ATE531004T1 - METHOD FOR ATTACHING RFID LABELS - Google Patents

METHOD FOR ATTACHING RFID LABELS

Info

Publication number
ATE531004T1
ATE531004T1 AT10161430T AT10161430T ATE531004T1 AT E531004 T1 ATE531004 T1 AT E531004T1 AT 10161430 T AT10161430 T AT 10161430T AT 10161430 T AT10161430 T AT 10161430T AT E531004 T1 ATE531004 T1 AT E531004T1
Authority
AT
Austria
Prior art keywords
layer
coil
bottom conductive
shipping article
conductive point
Prior art date
Application number
AT10161430T
Other languages
German (de)
Inventor
Thomas Clare
Andre Cote
Original Assignee
Checkpoint Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Checkpoint Systems Inc filed Critical Checkpoint Systems Inc
Application granted granted Critical
Publication of ATE531004T1 publication Critical patent/ATE531004T1/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07786—Antenna details the antenna being of the HF type, such as a dipole
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item

Abstract

A method for installing an RFID tag on a shipping article includes applying a coil of conductive material to the surface of the shipping article (18), the coil having a first layer (32) in the shape of a coil and a second layer (32a) being a short length of foil, the second layer (32a) adhered to the first layer (32), and providing an RFID chip (12) having a body (20), a first bottom conductive point and a second bottom conductive point. The RFID chip is attached to the shipping article by inserting the chip onto the coil on the shipping article such that the first bottom conductive point is electrically attached to the first layer and the second bottom conductive point is electrically attached to the second layer.
AT10161430T 2005-07-19 2006-07-18 METHOD FOR ATTACHING RFID LABELS ATE531004T1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US70043105P 2005-07-19 2005-07-19
US11/457,890 US7436305B2 (en) 2005-07-19 2006-07-17 RFID tags for pallets and cartons and system for attaching same

Publications (1)

Publication Number Publication Date
ATE531004T1 true ATE531004T1 (en) 2011-11-15

Family

ID=37546759

Family Applications (2)

Application Number Title Priority Date Filing Date
AT10161430T ATE531004T1 (en) 2005-07-19 2006-07-18 METHOD FOR ATTACHING RFID LABELS
AT06787743T ATE471548T1 (en) 2005-07-19 2006-07-18 RFID LABELS FOR PALLETS AND CARTONS AND METHOD FOR ATTACHING THEM

Family Applications After (1)

Application Number Title Priority Date Filing Date
AT06787743T ATE471548T1 (en) 2005-07-19 2006-07-18 RFID LABELS FOR PALLETS AND CARTONS AND METHOD FOR ATTACHING THEM

Country Status (11)

Country Link
US (2) US7436305B2 (en)
EP (2) EP2207133B1 (en)
JP (1) JP4881949B2 (en)
CN (3) CN101853419B (en)
AT (2) ATE531004T1 (en)
AU (1) AU2006270022B2 (en)
CA (2) CA2705018C (en)
DE (1) DE602006014970D1 (en)
ES (2) ES2349960T3 (en)
MX (1) MX2008000923A (en)
WO (1) WO2007011954A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2874442B1 (en) * 2004-08-20 2007-06-29 Kaysersberg Packaging Soc Par METHOD FOR APPLYING RADIOFREQUENCY IDENTIFICATION TRANSPONDERS ON PACKAGING SHEETS, TRANSPONDER SUPPORT
US7605708B2 (en) * 2005-12-22 2009-10-20 Checkpoint Systems, Inc. Smart corrugated cardboard
US8061624B2 (en) * 2009-12-28 2011-11-22 Avery Dennison Corporation RFID strap and cutting device
US8991709B2 (en) 2010-08-30 2015-03-31 Tagstar Systems Gmbh Tamper-proof RFID label
DE102012109040B4 (en) * 2012-09-25 2014-12-11 BIBA - Bremer Institut für Produktion und Logistik GmbH Climbing apparatus and method for performing activities on stacked objects
US10089572B2 (en) 2015-02-03 2018-10-02 Halliburton Energy Services, Inc. Radio frequency identification tag
US10284160B2 (en) * 2016-08-31 2019-05-07 Skyworks Solutions, Inc. Amplifier with improved return loss and mismatch over gain modes
CN108000939B (en) * 2017-11-24 2019-08-16 中煤科工集团淮北爆破技术研究院有限公司 A kind of automatic safe detonator box labelling machine

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US4605844A (en) * 1985-02-11 1986-08-12 At&T Technologies, Inc. Computerized transaction card with inductive data transfer
JP2508444B2 (en) * 1987-06-25 1996-06-19 ソニー株式会社 Color cathode ray tube
JPH01129396A (en) * 1987-11-14 1989-05-22 Tokai Kinzoku Kk Resonance tag and production
US5071445A (en) * 1990-05-18 1991-12-10 Basf Aktiengesellschaft Novel reaction products of aminoalkylene polycarboxylic acids with secondary amines and middle distillate compositions containing the aforesaid
US5083942A (en) * 1991-02-13 1992-01-28 E. I. Du Pont De Nemours And Company Fish hook hold-downs
CN2138348Y (en) * 1992-05-12 1993-07-14 李连彬 Disconnection preventing plug
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US6107920A (en) * 1998-06-09 2000-08-22 Motorola, Inc. Radio frequency identification tag having an article integrated antenna
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Also Published As

Publication number Publication date
WO2007011954A3 (en) 2007-05-31
ATE471548T1 (en) 2010-07-15
CA2616000A1 (en) 2007-01-25
CN101273370B (en) 2010-12-29
CA2705018A1 (en) 2007-01-25
CN101853419B (en) 2013-05-15
CN101853418B (en) 2013-05-15
MX2008000923A (en) 2008-03-26
WO2007011954A2 (en) 2007-01-25
DE602006014970D1 (en) 2010-07-29
JP4881949B2 (en) 2012-02-22
ES2376530T3 (en) 2012-03-14
US7436305B2 (en) 2008-10-14
JP2009503651A (en) 2009-01-29
EP1904961A2 (en) 2008-04-02
AU2006270022B2 (en) 2010-03-25
CN101853419A (en) 2010-10-06
CA2616000C (en) 2012-07-10
CA2705018C (en) 2012-09-11
EP2207133A1 (en) 2010-07-14
ES2349960T3 (en) 2011-01-13
CN101273370A (en) 2008-09-24
EP1904961B1 (en) 2010-06-16
US7961102B2 (en) 2011-06-14
US20090015412A1 (en) 2009-01-15
CN101853418A (en) 2010-10-06
AU2006270022A1 (en) 2007-01-25
EP2207133B1 (en) 2011-10-26
US20070018824A1 (en) 2007-01-25

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