ATE492895T1 - SURFACE MOUNT WOUND CAPACITOR WITH A VARIETY OF BALL GRID TYPE CONNECTORS - Google Patents

SURFACE MOUNT WOUND CAPACITOR WITH A VARIETY OF BALL GRID TYPE CONNECTORS

Info

Publication number
ATE492895T1
ATE492895T1 AT02768753T AT02768753T ATE492895T1 AT E492895 T1 ATE492895 T1 AT E492895T1 AT 02768753 T AT02768753 T AT 02768753T AT 02768753 T AT02768753 T AT 02768753T AT E492895 T1 ATE492895 T1 AT E492895T1
Authority
AT
Austria
Prior art keywords
ball grid
variety
surface mount
grid type
type connectors
Prior art date
Application number
AT02768753T
Other languages
German (de)
Inventor
Tao Liu
Peir Chu
Michael Greenwood
Steve Schiveley
Aaron Steyskal
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Application granted granted Critical
Publication of ATE492895T1 publication Critical patent/ATE492895T1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

A method of fabricating a capacitor provides for coupling a ball grid array (BGA) lead configuration to a foil and disposing the foil within a case. The BGA lead configuration extends from the case.
AT02768753T 2001-09-28 2002-08-29 SURFACE MOUNT WOUND CAPACITOR WITH A VARIETY OF BALL GRID TYPE CONNECTORS ATE492895T1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/964,806 US6529365B1 (en) 2001-09-28 2001-09-28 Multiple terminal SMT BGA-style wound capacitor
PCT/US2002/027660 WO2003030193A1 (en) 2001-09-28 2002-08-29 Multiple terminal smt-bga-style wound capacitor

Publications (1)

Publication Number Publication Date
ATE492895T1 true ATE492895T1 (en) 2011-01-15

Family

ID=25509029

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02768753T ATE492895T1 (en) 2001-09-28 2002-08-29 SURFACE MOUNT WOUND CAPACITOR WITH A VARIETY OF BALL GRID TYPE CONNECTORS

Country Status (7)

Country Link
US (2) US6529365B1 (en)
EP (1) EP1430493B1 (en)
CN (1) CN100431071C (en)
AT (1) ATE492895T1 (en)
DE (1) DE60238695D1 (en)
MY (1) MY133404A (en)
WO (1) WO2003030193A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6529365B1 (en) * 2001-09-28 2003-03-04 Intel Corporation Multiple terminal SMT BGA-style wound capacitor
US7042702B2 (en) * 2003-12-15 2006-05-09 Intel Corporation Wound capacitor
WO2006014753A1 (en) * 2004-07-23 2006-02-09 Sundew Technologies, Llp Capacitors with high energy storage density and low esr
WO2007013223A1 (en) 2005-07-29 2007-02-01 Sii Micro Parts Ltd. Electrochemical cell
JP2009152514A (en) * 2007-12-20 2009-07-09 Jcc Engineering Co Ltd Electronic component and method of manufacturing the same
CN102576609B (en) * 2009-09-30 2014-04-09 三洋电机株式会社 Electrolytic capacitor
DE102017210419A1 (en) * 2017-06-21 2018-12-27 Bayerische Motoren Werke Aktiengesellschaft Link capacitor

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2406141B2 (en) * 1974-02-08 1976-10-21 Siemens AG, 1000 Berlin und 8000 München ELECTROLYTE CAPACITOR AND ITS USE
US4314313A (en) 1979-09-10 1982-02-02 Sangamo Weston, Inc. Single and dual low inductance capacitor and header therefor
US4916576A (en) * 1989-02-27 1990-04-10 Fmtt, Inc. Matrix capacitor
US5359487A (en) 1993-01-27 1994-10-25 General Electric Company Capacitor assembly of the wound-foil type
JPH08279670A (en) * 1995-04-07 1996-10-22 Hitachi Ltd Surface mount structure of electronic component
US5746608A (en) * 1995-11-30 1998-05-05 Taylor; Attalee S. Surface mount socket for an electronic package, and contact for use therewith
US5676305A (en) * 1996-04-18 1997-10-14 Motorola, Inc. Method to achieve regulated force contact in pin transfer deposition of liquidus substances
US6120550A (en) * 1996-10-28 2000-09-19 Altera Corporation Design file templates for implementation of logic designs
US5949638A (en) * 1997-05-02 1999-09-07 Cm Components, Inc. Multiple anode capacitor
JPH11317490A (en) * 1997-10-16 1999-11-16 Hitachi Ltd Semiconductor element mounting substrate
JP3063709B2 (en) * 1997-11-05 2000-07-12 日本電気株式会社 Electronic component mounting structure, mounting substrate and electronic component mounting method
US6110233A (en) 1998-05-11 2000-08-29 Cardiac Pacemakers, Inc. Wound multi-anode electrolytic capacitor with offset anodes
US6194979B1 (en) * 1999-03-18 2001-02-27 Cts Corporation Ball grid array R-C network with high density
US6262877B1 (en) * 1999-11-23 2001-07-17 Intel Corporation Low inductance high capacitance capacitor and method of making same
US6529365B1 (en) * 2001-09-28 2003-03-04 Intel Corporation Multiple terminal SMT BGA-style wound capacitor

Also Published As

Publication number Publication date
US6529365B1 (en) 2003-03-04
US20030103317A1 (en) 2003-06-05
CN1561527A (en) 2005-01-05
EP1430493B1 (en) 2010-12-22
US6862784B2 (en) 2005-03-08
WO2003030193A1 (en) 2003-04-10
DE60238695D1 (en) 2011-02-03
CN100431071C (en) 2008-11-05
MY133404A (en) 2007-11-30
EP1430493A1 (en) 2004-06-23

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties