ATE492895T1 - SURFACE MOUNT WOUND CAPACITOR WITH A VARIETY OF BALL GRID TYPE CONNECTORS - Google Patents
SURFACE MOUNT WOUND CAPACITOR WITH A VARIETY OF BALL GRID TYPE CONNECTORSInfo
- Publication number
- ATE492895T1 ATE492895T1 AT02768753T AT02768753T ATE492895T1 AT E492895 T1 ATE492895 T1 AT E492895T1 AT 02768753 T AT02768753 T AT 02768753T AT 02768753 T AT02768753 T AT 02768753T AT E492895 T1 ATE492895 T1 AT E492895T1
- Authority
- AT
- Austria
- Prior art keywords
- ball grid
- variety
- surface mount
- grid type
- type connectors
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 title abstract 2
- 239000011888 foil Substances 0.000 abstract 2
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
A method of fabricating a capacitor provides for coupling a ball grid array (BGA) lead configuration to a foil and disposing the foil within a case. The BGA lead configuration extends from the case.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/964,806 US6529365B1 (en) | 2001-09-28 | 2001-09-28 | Multiple terminal SMT BGA-style wound capacitor |
PCT/US2002/027660 WO2003030193A1 (en) | 2001-09-28 | 2002-08-29 | Multiple terminal smt-bga-style wound capacitor |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE492895T1 true ATE492895T1 (en) | 2011-01-15 |
Family
ID=25509029
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT02768753T ATE492895T1 (en) | 2001-09-28 | 2002-08-29 | SURFACE MOUNT WOUND CAPACITOR WITH A VARIETY OF BALL GRID TYPE CONNECTORS |
Country Status (7)
Country | Link |
---|---|
US (2) | US6529365B1 (en) |
EP (1) | EP1430493B1 (en) |
CN (1) | CN100431071C (en) |
AT (1) | ATE492895T1 (en) |
DE (1) | DE60238695D1 (en) |
MY (1) | MY133404A (en) |
WO (1) | WO2003030193A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6529365B1 (en) * | 2001-09-28 | 2003-03-04 | Intel Corporation | Multiple terminal SMT BGA-style wound capacitor |
US7042702B2 (en) * | 2003-12-15 | 2006-05-09 | Intel Corporation | Wound capacitor |
WO2006014753A1 (en) * | 2004-07-23 | 2006-02-09 | Sundew Technologies, Llp | Capacitors with high energy storage density and low esr |
WO2007013223A1 (en) | 2005-07-29 | 2007-02-01 | Sii Micro Parts Ltd. | Electrochemical cell |
JP2009152514A (en) * | 2007-12-20 | 2009-07-09 | Jcc Engineering Co Ltd | Electronic component and method of manufacturing the same |
CN102576609B (en) * | 2009-09-30 | 2014-04-09 | 三洋电机株式会社 | Electrolytic capacitor |
DE102017210419A1 (en) * | 2017-06-21 | 2018-12-27 | Bayerische Motoren Werke Aktiengesellschaft | Link capacitor |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2406141B2 (en) * | 1974-02-08 | 1976-10-21 | Siemens AG, 1000 Berlin und 8000 München | ELECTROLYTE CAPACITOR AND ITS USE |
US4314313A (en) | 1979-09-10 | 1982-02-02 | Sangamo Weston, Inc. | Single and dual low inductance capacitor and header therefor |
US4916576A (en) * | 1989-02-27 | 1990-04-10 | Fmtt, Inc. | Matrix capacitor |
US5359487A (en) | 1993-01-27 | 1994-10-25 | General Electric Company | Capacitor assembly of the wound-foil type |
JPH08279670A (en) * | 1995-04-07 | 1996-10-22 | Hitachi Ltd | Surface mount structure of electronic component |
US5746608A (en) * | 1995-11-30 | 1998-05-05 | Taylor; Attalee S. | Surface mount socket for an electronic package, and contact for use therewith |
US5676305A (en) * | 1996-04-18 | 1997-10-14 | Motorola, Inc. | Method to achieve regulated force contact in pin transfer deposition of liquidus substances |
US6120550A (en) * | 1996-10-28 | 2000-09-19 | Altera Corporation | Design file templates for implementation of logic designs |
US5949638A (en) * | 1997-05-02 | 1999-09-07 | Cm Components, Inc. | Multiple anode capacitor |
JPH11317490A (en) * | 1997-10-16 | 1999-11-16 | Hitachi Ltd | Semiconductor element mounting substrate |
JP3063709B2 (en) * | 1997-11-05 | 2000-07-12 | 日本電気株式会社 | Electronic component mounting structure, mounting substrate and electronic component mounting method |
US6110233A (en) | 1998-05-11 | 2000-08-29 | Cardiac Pacemakers, Inc. | Wound multi-anode electrolytic capacitor with offset anodes |
US6194979B1 (en) * | 1999-03-18 | 2001-02-27 | Cts Corporation | Ball grid array R-C network with high density |
US6262877B1 (en) * | 1999-11-23 | 2001-07-17 | Intel Corporation | Low inductance high capacitance capacitor and method of making same |
US6529365B1 (en) * | 2001-09-28 | 2003-03-04 | Intel Corporation | Multiple terminal SMT BGA-style wound capacitor |
-
2001
- 2001-09-28 US US09/964,806 patent/US6529365B1/en not_active Expired - Fee Related
-
2002
- 2002-08-29 DE DE60238695T patent/DE60238695D1/en not_active Expired - Lifetime
- 2002-08-29 WO PCT/US2002/027660 patent/WO2003030193A1/en not_active Application Discontinuation
- 2002-08-29 EP EP02768753A patent/EP1430493B1/en not_active Expired - Lifetime
- 2002-08-29 AT AT02768753T patent/ATE492895T1/en not_active IP Right Cessation
- 2002-08-29 CN CNB02819120XA patent/CN100431071C/en not_active Expired - Fee Related
- 2002-09-03 MY MYPI20023292A patent/MY133404A/en unknown
-
2003
- 2003-01-16 US US10/345,147 patent/US6862784B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6529365B1 (en) | 2003-03-04 |
US20030103317A1 (en) | 2003-06-05 |
CN1561527A (en) | 2005-01-05 |
EP1430493B1 (en) | 2010-12-22 |
US6862784B2 (en) | 2005-03-08 |
WO2003030193A1 (en) | 2003-04-10 |
DE60238695D1 (en) | 2011-02-03 |
CN100431071C (en) | 2008-11-05 |
MY133404A (en) | 2007-11-30 |
EP1430493A1 (en) | 2004-06-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE60001776D1 (en) | ENCLOSURE METHOD OF A SEMICONDUCTOR ARRANGEMENT WITH ANISOTROPICALLY CONDUCTIVE ADHESIVE | |
DE50210653D1 (en) | METHOD FOR PRODUCING ELECTRONIC COMPONENTS | |
WO2002027088A3 (en) | Cellulosic substrates with reduced absorbent capacity having the capability to wick liquids | |
DE60227915D1 (en) | HIGH DENSITY CONNECTOR SOCKET | |
ATE334574T1 (en) | SYSTEM AND METHOD FOR CONNECTING A POWER CONVERTER CIRCUIT TO AN LGA SOCKET | |
DE60043148D1 (en) | Manufacturing method of a device with micromagnetic components for power applications | |
FI982837A (en) | Electronic device, electronic device housing and method of manufacturing electronic device envelope | |
TW200628027A (en) | Power core devices and methods of making thereof | |
IT8423682A0 (en) | EQUIPMENT FOR INSTALLING, ACTIVATING AND CONNECTING THE MODULES OF AN UNDERWATER OIL PRODUCTION STATION. | |
TW200610080A (en) | Electronic device and method of manufacturing the same | |
WO2020143315A1 (en) | Speech acquisition device | |
TW200518647A (en) | Printed wiring board and method of manufacturing same | |
TW200503024A (en) | Chip-type solid electrolytic capacitor and method of producing the same | |
ATE492895T1 (en) | SURFACE MOUNT WOUND CAPACITOR WITH A VARIETY OF BALL GRID TYPE CONNECTORS | |
DE60044969D1 (en) | MANUFACTURING METHOD OF INTEGRATED CIRCUIT | |
DE502004004419D1 (en) | Electrical connection and connection box | |
DE3576019D1 (en) | PLUG SOCKET WITH INSULATING SHEATHING AND DEVICE FOR THEIR PRODUCTION. | |
DE60113337D1 (en) | Electronic power module with high power electronic components and related manufacturing process | |
DE60035447D1 (en) | Manufacturing method of an electron-emitting device | |
DE60105375D1 (en) | Manufacturing process of an electronic packaging arrangement | |
DE60018359D1 (en) | Component with a cable gland and manufacturing method for the same | |
DE50210562D1 (en) | CONTACTING FLEXIBLE PCB | |
DE60212213D1 (en) | Connection structure of electrical wires of a lamp unit | |
DE60235301D1 (en) | MANUFACTURING PROCESS OF A PCB | |
SE0104335D0 (en) | An electronic assembly and a method of manufacturing the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |