ATE434266T1 - POWER SEMICONDUCTOR MODULE - Google Patents

POWER SEMICONDUCTOR MODULE

Info

Publication number
ATE434266T1
ATE434266T1 AT08000987T AT08000987T ATE434266T1 AT E434266 T1 ATE434266 T1 AT E434266T1 AT 08000987 T AT08000987 T AT 08000987T AT 08000987 T AT08000987 T AT 08000987T AT E434266 T1 ATE434266 T1 AT E434266T1
Authority
AT
Austria
Prior art keywords
power semiconductor
semiconductor module
packing frame
circular packing
housing
Prior art date
Application number
AT08000987T
Other languages
German (de)
Inventor
Rainer Popp
Marco Lederer
Original Assignee
Semikron Elektronik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Elektronik Gmbh filed Critical Semikron Elektronik Gmbh
Application granted granted Critical
Publication of ATE434266T1 publication Critical patent/ATE434266T1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)
  • Bipolar Transistors (AREA)
  • Inverter Devices (AREA)

Abstract

The power semiconductor module has a housing (12), where load connection elements (16) are arranged, which has contact devices (17). The housing forms an upper side material with a circular packing frame (22), and a cover (14) that is formed with an outer edge (24) that overlaps the circular packing frame.
AT08000987T 2007-02-14 2008-01-19 POWER SEMICONDUCTOR MODULE ATE434266T1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102007007224A DE102007007224B4 (en) 2007-02-14 2007-02-14 Power semiconductor module with a housing

Publications (1)

Publication Number Publication Date
ATE434266T1 true ATE434266T1 (en) 2009-07-15

Family

ID=39356628

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08000987T ATE434266T1 (en) 2007-02-14 2008-01-19 POWER SEMICONDUCTOR MODULE

Country Status (7)

Country Link
US (1) US7944701B2 (en)
EP (1) EP1959494B1 (en)
JP (1) JP5171284B2 (en)
AT (1) ATE434266T1 (en)
DE (2) DE102007007224B4 (en)
DK (1) DK1959494T3 (en)
ES (1) ES2326143T3 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008057831B4 (en) * 2008-11-19 2010-09-16 Semikron Elektronik Gmbh & Co. Kg Arrangement with power semiconductor module and driver device
DE102013113764B3 (en) * 2013-12-10 2014-09-25 Semikron Elektronik Gmbh & Co. Kg Power semiconductor device
US9856719B1 (en) 2016-12-21 2018-01-02 Kevin R. Williams System for supplying power from the main powerhouse to a drill floor powerhouse
US10247688B2 (en) 2017-01-05 2019-04-02 Kevin R. Williams Moisture detecting system and method for use in an IGBT or a MOSFET

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3143339C2 (en) 1981-10-31 1987-05-14 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Semiconductor arrangement
DE3604882A1 (en) * 1986-02-15 1987-08-20 Bbc Brown Boveri & Cie PERFORMANCE SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING THE MODULE
DE4237632A1 (en) * 1992-11-07 1994-05-11 Export Contor Ausenhandelsgese Circuit arrangement
DE9313483U1 (en) 1993-09-07 1994-01-05 SZE Microelectronics GmbH, 24220 Flintbek Recording device
DE4445125A1 (en) * 1994-12-17 1996-06-20 Wabco Gmbh Housing for an electrical component
DE19600619A1 (en) * 1996-01-10 1997-07-17 Bosch Gmbh Robert Control unit consisting of at least two housing parts
JP4151209B2 (en) * 2000-08-29 2008-09-17 三菱電機株式会社 Power semiconductor device
DE10141114C1 (en) * 2001-06-08 2002-11-21 Semikron Elektronik Gmbh Circuit device has AC terminal element of circuit substrate cooled via terminal pin of base body thermally connected to heat sink
DE10127947C1 (en) * 2001-08-22 2002-10-17 Semikron Elektronik Gmbh Circuit device for power semiconductor module has intermediate circuit board with DC and AC terminals coupled to conductor paths of substrate incorporated in base body
WO2003078211A1 (en) * 2002-03-16 2003-09-25 Conti Temic Microelectronic Gmbh Electronic subassembly for a motor vehicle
JP3910497B2 (en) * 2002-07-03 2007-04-25 株式会社オートネットワーク技術研究所 Power circuit waterproofing method and power module having power circuit
JP2007533518A (en) * 2003-08-01 2007-11-22 シーメンス　アクチエンゲゼルシヤフト Electronic device unit and method for manufacturing the electronic device unit
JP2009119957A (en) * 2007-11-13 2009-06-04 Mitsubishi Electric Corp Electronic control device and its manufacturing method

Also Published As

Publication number Publication date
DE102007007224B4 (en) 2009-06-10
DE502008000036D1 (en) 2009-07-30
DK1959494T3 (en) 2009-10-05
JP5171284B2 (en) 2013-03-27
DE102007007224A1 (en) 2008-08-28
JP2008199007A (en) 2008-08-28
EP1959494A1 (en) 2008-08-20
EP1959494B1 (en) 2009-06-17
US20080212302A1 (en) 2008-09-04
US7944701B2 (en) 2011-05-17
ES2326143T3 (en) 2009-10-01

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