ATE326489T1 - EPOXY RESIN MADE FROM P-HYDROXYSTYRENE WITH HIGH FUNCTIONALITY, LOW MELTING VICOSITY WITH HIGH GLASS TRANSITION TEMPERATURE - Google Patents

EPOXY RESIN MADE FROM P-HYDROXYSTYRENE WITH HIGH FUNCTIONALITY, LOW MELTING VICOSITY WITH HIGH GLASS TRANSITION TEMPERATURE

Info

Publication number
ATE326489T1
ATE326489T1 AT00905956T AT00905956T ATE326489T1 AT E326489 T1 ATE326489 T1 AT E326489T1 AT 00905956 T AT00905956 T AT 00905956T AT 00905956 T AT00905956 T AT 00905956T AT E326489 T1 ATE326489 T1 AT E326489T1
Authority
AT
Austria
Prior art keywords
glass transition
hydroxystyrene
vicosity
epoxy resin
transition temperature
Prior art date
Application number
AT00905956T
Other languages
German (de)
Inventor
Donald J Keehan
Original Assignee
Donald J Keehan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Donald J Keehan filed Critical Donald J Keehan
Application granted granted Critical
Publication of ATE326489T1 publication Critical patent/ATE326489T1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/08—Epoxidation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/28—Chemically modified polycondensates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
  • Epoxy Compounds (AREA)

Abstract

Disclosed are epoxides prepared by reacting a p-hydroxystyrene polymer and epichlorohydrin in the presence of one or more alkali agents. Also disclosed are epoxy agents prepared from reacting a p-hydroxystyrene polymer and one or more di-hydric phenol agents with epichlorohydrin in the presence of alkali. These new epoxide resins have a low melt viscosity and when cured exhibit glass transition temperatures above 300° C.
AT00905956T 1999-04-27 2000-02-02 EPOXY RESIN MADE FROM P-HYDROXYSTYRENE WITH HIGH FUNCTIONALITY, LOW MELTING VICOSITY WITH HIGH GLASS TRANSITION TEMPERATURE ATE326489T1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/300,300 US6180723B1 (en) 1999-04-27 1999-04-27 Epoxy resin prepared by reacting poly-p-hydroxystyrene with epichlorohydrin

Publications (1)

Publication Number Publication Date
ATE326489T1 true ATE326489T1 (en) 2006-06-15

Family

ID=23158528

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00905956T ATE326489T1 (en) 1999-04-27 2000-02-02 EPOXY RESIN MADE FROM P-HYDROXYSTYRENE WITH HIGH FUNCTIONALITY, LOW MELTING VICOSITY WITH HIGH GLASS TRANSITION TEMPERATURE

Country Status (6)

Country Link
US (2) US6180723B1 (en)
EP (1) EP1196463B1 (en)
AT (1) ATE326489T1 (en)
AU (1) AU2754200A (en)
DE (1) DE60028036T2 (en)
WO (1) WO2000064955A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6713535B2 (en) * 2002-02-28 2004-03-30 Turbine Controls, Inc. Low-friction chromate-free coating of epoxy resins and sulfonyldianiline
US7647931B2 (en) 2002-12-30 2010-01-19 Quiescence Medical, Inc. Stent for maintaining patency of a body region
US20040204515A1 (en) * 2003-01-17 2004-10-14 Edita Rojasova Chemical resistant epoxy composition
TWI392713B (en) * 2003-03-26 2013-04-11 Atotech Deutschland Gmbh Powder coating and process for the preparation of thin layers in the manufacture of printed circuit boards
US7426775B2 (en) * 2003-12-17 2008-09-23 The Procter + Gamble Company Polymeric structures comprising a hydrophile/lipophile system
US7714065B2 (en) 2003-12-17 2010-05-11 The Procter & Gamble Company Polymeric structures comprising a hydrophile/lipophile system
WO2008006090A2 (en) * 2006-07-06 2008-01-10 Quiescence Medical, Inc. Apparatus and methods for treating sleep apnea
WO2014066693A1 (en) 2012-10-25 2014-05-01 Kohler Co. Engineered composite material and products produced therefrom
US20140251168A1 (en) 2013-03-06 2014-09-11 E I Du Pont De Nemours And Company Printing form and a process for preparing a printing form using two-step cure
EP2874280A1 (en) * 2013-11-14 2015-05-20 Siemens Aktiengesellschaft Groove closure mass, groove closure and method for producing a groove closure
CN108864341B (en) * 2017-05-12 2020-10-13 湖北固润科技股份有限公司 Poly (p-hydroxystyrene) epoxy resin, and synthesis and application thereof
EP4204510A1 (en) * 2020-10-05 2023-07-05 Advanced Polymer Coatings, Inc. Chemically resistant epoxy composition

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5229800B2 (en) 1972-11-01 1977-08-04
JPS5219875B2 (en) 1974-02-07 1977-05-31
US4020225A (en) 1975-02-07 1977-04-26 Maruzen Oil Co. Ltd. Metal clad laminate composed of flame resistant thermosetting resin composition
JPS57141419A (en) 1981-02-27 1982-09-01 Mitsubishi Petrochem Co Ltd Production of polyepoxide
US4499255B1 (en) * 1982-09-13 2000-01-11 Dow Chemical Co Preparation of epoxy resins
US5212244A (en) 1987-11-04 1993-05-18 Hitachi, Ltd. Thermosetting resin composition, and prepreg and laminated sheet which use the same
JPH03173007A (en) 1989-12-01 1991-07-26 Kao Corp Conductive paste and conductive film
US5120793A (en) 1990-04-18 1992-06-09 Hoechst Celanese Corp. Process for preparing ether derivatives of polymers of p-hydroxystyrene
DE69127801T2 (en) * 1990-12-19 1998-02-05 Canon Kk Manufacturing process for liquid-spouting recording head
US5714544A (en) * 1993-08-05 1998-02-03 Mitsubishi Gas Chemical Company, Inc. Process for the production of phenolic resin and epoxy resin composition

Also Published As

Publication number Publication date
EP1196463A4 (en) 2002-07-17
AU2754200A (en) 2000-11-10
WO2000064955A1 (en) 2000-11-02
EP1196463A1 (en) 2002-04-17
DE60028036T2 (en) 2006-12-07
DE60028036D1 (en) 2006-06-22
EP1196463B1 (en) 2006-05-17
US6391979B1 (en) 2002-05-21
US6180723B1 (en) 2001-01-30

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