ATE203443T1 - Rotierende anordnung einer reflowlötanlage - Google Patents

Rotierende anordnung einer reflowlötanlage

Info

Publication number
ATE203443T1
ATE203443T1 AT96927943T AT96927943T ATE203443T1 AT E203443 T1 ATE203443 T1 AT E203443T1 AT 96927943 T AT96927943 T AT 96927943T AT 96927943 T AT96927943 T AT 96927943T AT E203443 T1 ATE203443 T1 AT E203443T1
Authority
AT
Austria
Prior art keywords
chambers
pct
objects
present
processing
Prior art date
Application number
AT96927943T
Other languages
English (en)
Inventor
Jeroen Lambertus Schmits
Dopper Rolf Arthur Den
Original Assignee
Soltec Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soltec Bv filed Critical Soltec Bv
Application granted granted Critical
Publication of ATE203443T1 publication Critical patent/ATE203443T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AT96927943T 1995-08-29 1996-08-28 Rotierende anordnung einer reflowlötanlage ATE203443T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NL1001089 1995-08-29
NL1002175 1996-01-25
PCT/NL1996/000341 WO1997007924A1 (en) 1995-08-29 1996-08-28 Reflow soldering apparatus with a rotative configuration

Publications (1)

Publication Number Publication Date
ATE203443T1 true ATE203443T1 (de) 2001-08-15

Family

ID=26642160

Family Applications (1)

Application Number Title Priority Date Filing Date
AT96927943T ATE203443T1 (de) 1995-08-29 1996-08-28 Rotierende anordnung einer reflowlötanlage

Country Status (5)

Country Link
US (1) US6096999A (de)
EP (1) EP0885084B1 (de)
AT (1) ATE203443T1 (de)
DE (1) DE69614152T2 (de)
WO (1) WO1997007924A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5965048A (en) * 1998-11-20 1999-10-12 General Electric Company Heated chamber including an open wall with a gas curtain
US6354481B1 (en) * 1999-02-18 2002-03-12 Speedline Technologies, Inc. Compact reflow and cleaning apparatus
US9226407B2 (en) * 2002-07-01 2015-12-29 Semigear Inc Reflow treating unit and substrate treating apparatus
DE102016222114A1 (de) * 2016-11-10 2018-05-17 Asm Assembly Systems Gmbh & Co. Kg Heizsystem und Verfahren zum Durchführen eines Lötvorgangs in einer SMT-Bestückungslinie
DE102019116290A1 (de) * 2019-06-14 2020-12-17 Werkzeugbau Siegfried Hofmann Gmbh Vorrichtung zum Löten
DE102020119877A1 (de) * 2020-07-28 2022-02-03 Siegfried Hofmann Gmbh Vorrichtung zur Verlagerung wenigstens einer Baugruppe zwischen einem Bereitstellungsbereich und einem Arbeitsbereich

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1385662A (en) * 1919-10-13 1921-07-26 Nat System Of Bakeries Co Baking-oven
US3272933A (en) * 1964-07-10 1966-09-13 Sperry Rand Corp Rotary indexing programmer switch using circuit boards
GB1461494A (en) * 1974-04-04 1977-01-13 Asahi Glass Co Ltd Apparatus and method for sealing components in tubes
US5101546A (en) * 1990-11-30 1992-04-07 Hitachi Seiko Ltd. Apparatus for removing printed board
TW220028B (en) * 1992-08-24 1994-02-01 Ciba Geigy Ag Method and apparatus for coating board-shaped articles, especially printed circuit boards
US5345061A (en) * 1992-09-15 1994-09-06 Vitronics Corporation Convection/infrared solder reflow apparatus utilizing controlled gas flow
JP3250082B2 (ja) * 1992-09-30 2002-01-28 エイテックテクトロン株式会社 自動半田付け装置

Also Published As

Publication number Publication date
WO1997007924A1 (en) 1997-03-06
US6096999A (en) 2000-08-01
EP0885084B1 (de) 2001-07-25
EP0885084A1 (de) 1998-12-23
DE69614152D1 (de) 2001-08-30
DE69614152T2 (de) 2001-11-15

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Legal Events

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