ATE114148T1 - Verwendung von permeablen materialien zur verbesserung des heisspressprozesses. - Google Patents

Verwendung von permeablen materialien zur verbesserung des heisspressprozesses.

Info

Publication number
ATE114148T1
ATE114148T1 AT91121261T AT91121261T ATE114148T1 AT E114148 T1 ATE114148 T1 AT E114148T1 AT 91121261 T AT91121261 T AT 91121261T AT 91121261 T AT91121261 T AT 91121261T AT E114148 T1 ATE114148 T1 AT E114148T1
Authority
AT
Austria
Prior art keywords
hot pressing
sintering
intergranular
improve
pressing process
Prior art date
Application number
AT91121261T
Other languages
English (en)
Inventor
Jack Harrison Enloe
John Wing-Keung Lau
Original Assignee
Grace W R & Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Grace W R & Co filed Critical Grace W R & Co
Application granted granted Critical
Publication of ATE114148T1 publication Critical patent/ATE114148T1/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/64Burning or sintering processes
    • C04B35/645Pressure sintering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28BSHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B3/00Producing shaped articles from the material by using presses; Presses specially adapted therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12Both compacting and sintering
    • B22F3/14Both compacting and sintering simultaneously
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28BSHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B3/00Producing shaped articles from the material by using presses; Presses specially adapted therefor
    • B28B3/02Producing shaped articles from the material by using presses; Presses specially adapted therefor wherein a ram exerts pressure on the material in a moulding space; Ram heads of special form
    • B28B3/025Hot pressing, e.g. of ceramic materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28BSHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B7/00Moulds; Cores; Mandrels
    • B28B7/40Moulds; Cores; Mandrels characterised by means for modifying the properties of the moulding material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4803Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/4807Ceramic parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Press-Shaping Or Shaping Using Conveyers (AREA)
  • Treatment Of Fiber Materials (AREA)
  • Laminated Bodies (AREA)
  • Porous Artificial Stone Or Porous Ceramic Products (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Ceramic Products (AREA)
AT91121261T 1990-12-21 1991-12-11 Verwendung von permeablen materialien zur verbesserung des heisspressprozesses. ATE114148T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/631,577 US5211786A (en) 1990-12-21 1990-12-21 Use of permeable materials to improve hot pressing process

Publications (1)

Publication Number Publication Date
ATE114148T1 true ATE114148T1 (de) 1994-12-15

Family

ID=24531815

Family Applications (1)

Application Number Title Priority Date Filing Date
AT91121261T ATE114148T1 (de) 1990-12-21 1991-12-11 Verwendung von permeablen materialien zur verbesserung des heisspressprozesses.

Country Status (8)

Country Link
US (1) US5211786A (de)
EP (1) EP0492284B1 (de)
JP (1) JPH05337912A (de)
KR (1) KR920011664A (de)
AT (1) ATE114148T1 (de)
DE (1) DE69105189T2 (de)
ES (1) ES2066325T3 (de)
HK (1) HK42395A (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5470412A (en) * 1992-07-30 1995-11-28 Sumitomo Metal Ceramics Inc. Process for producing a circuit substrate
US20050003195A1 (en) * 1999-12-02 2005-01-06 Joseph Brian E. Carbon foam composite tooling and methods for using the same
US20050008862A1 (en) * 1999-12-02 2005-01-13 Joseph Brian E. Carbon foam composite tooling and methods for using the same
US6749652B1 (en) 1999-12-02 2004-06-15 Touchstone Research Laboratory, Ltd. Cellular coal products and processes
JP2003212666A (ja) * 2002-01-28 2003-07-30 Sanyo Electric Co Ltd セラミック積層体の製造装置および製造方法
WO2005089021A1 (en) * 2004-03-04 2005-09-22 Touchstone Research Laboratory, Ltd. Tool bodies having heated tool faces
US8021750B2 (en) * 2004-10-21 2011-09-20 Graftech International Holdings Inc. Insulated panel for mine safe rooms
US7232606B2 (en) * 2004-10-21 2007-06-19 Ucar Carbon Company Inc. Sealant for high strength carbon foam
US7413793B2 (en) 2004-10-21 2008-08-19 Graftech International Holdings Inc. Induction furnace with unique carbon foam insulation
US7527855B2 (en) * 2004-10-21 2009-05-05 Graftech International Holdings Inc. High strength monolithic carbon foam
US7264878B2 (en) 2004-10-21 2007-09-04 Ucar Carbon Company Inc. Laminated carbon foam sandwich for naval decking
US7776430B2 (en) * 2004-10-21 2010-08-17 Graftech International Holdings Inc. Carbon foam tooling with durable skin
US7785712B2 (en) * 2004-10-21 2010-08-31 Graftech International Holdings Inc. Carbon foam structural insulated panel
US8080127B2 (en) * 2007-04-15 2011-12-20 Graftech International Holdings Inc. Carbon foam evaporator
US7892636B2 (en) * 2007-05-01 2011-02-22 Graftech International Holdings Inc. Carbon foam with supplemental material
US20080286191A1 (en) * 2007-05-14 2008-11-20 Stansberry Peter G Process For The Production Of Highly Graphitizable Carbon Foam
CN101855072A (zh) * 2007-09-11 2010-10-06 格拉弗技术国际控股有限公司 被涂覆的碳泡沫制品
US9283693B2 (en) * 2010-07-30 2016-03-15 Lg Innotek Co., Ltd. Hot press sintering apparatus and press element
US8438963B2 (en) * 2010-09-07 2013-05-14 Michael Cohen High density ceramic bodies and composite armor comprising the same
WO2015183655A1 (en) * 2014-05-30 2015-12-03 Saint-Gobain Ceramics & Plastics, Inc. Hot press and methods of using
JP2016172415A (ja) * 2015-03-18 2016-09-29 株式会社ブリヂストン ホットプレス装置、及び焼結体の製造方法
FR3086567B1 (fr) * 2018-10-02 2022-07-22 Norimat Procede de realisation de contreforme et procede de fabrication de piece de forme complexe utilisant une telle contre-forme

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1209409B (de) * 1959-12-24 1966-01-20 Deutsche Edelstahlwerke Ag Heisspressform
GB1415522A (en) * 1972-04-06 1975-11-26 Lucas Industries Ltd Method of manufacturing hot pressed cermaic material based on silicon nitride
US4340436A (en) * 1980-07-14 1982-07-20 International Business Machines Corporation Process for flattening glass-ceramic substrates
WO1985000590A1 (en) * 1983-07-19 1985-02-14 Ford Motor Company Making hot pressed silicon nitride by use of low density reaction bonded body
US4539175A (en) * 1983-09-26 1985-09-03 Metal Alloys Inc. Method of object consolidation employing graphite particulate
US4753694A (en) * 1986-05-02 1988-06-28 International Business Machines Corporation Process for forming multilayered ceramic substrate having solid metal conductors
US4879156A (en) * 1986-05-02 1989-11-07 International Business Machines Corporation Multilayered ceramic substrate having solid non-porous metal conductors
US5130067A (en) * 1986-05-02 1992-07-14 International Business Machines Corporation Method and means for co-sintering ceramic/metal mlc substrates
US4920640A (en) * 1988-01-27 1990-05-01 W. R. Grace & Co.-Conn. Hot pressing dense ceramic sheets for electronic substrates and for multilayer electronic substrates

Also Published As

Publication number Publication date
DE69105189D1 (de) 1994-12-22
JPH05337912A (ja) 1993-12-21
EP0492284A1 (de) 1992-07-01
US5211786A (en) 1993-05-18
KR920011664A (ko) 1992-07-24
ES2066325T3 (es) 1995-03-01
DE69105189T2 (de) 1995-03-23
EP0492284B1 (de) 1994-11-17
HK42395A (en) 1995-03-31

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Legal Events

Date Code Title Description
EEFA Change of the company name
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties