ATA5612001A - SEMICONDUCTOR MODULE - Google Patents

SEMICONDUCTOR MODULE

Info

Publication number
ATA5612001A
ATA5612001A AT5612001A AT5612001A ATA5612001A AT A5612001 A ATA5612001 A AT A5612001A AT 5612001 A AT5612001 A AT 5612001A AT 5612001 A AT5612001 A AT 5612001A AT A5612001 A ATA5612001 A AT A5612001A
Authority
AT
Austria
Prior art keywords
semiconductor module
semiconductor
module
Prior art date
Application number
AT5612001A
Other languages
German (de)
Other versions
AT411126B (en
Inventor
Werner Ing Lachmann
Original Assignee
Siemens Ag Oesterreich
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag Oesterreich filed Critical Siemens Ag Oesterreich
Priority to AT5612001A priority Critical patent/AT411126B/en
Priority to DE10205408A priority patent/DE10205408A1/en
Priority to CH2702002A priority patent/CH695518A5/en
Publication of ATA5612001A publication Critical patent/ATA5612001A/en
Application granted granted Critical
Publication of AT411126B publication Critical patent/AT411126B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AT5612001A 2001-04-06 2001-04-06 SEMICONDUCTOR MODULE AT411126B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AT5612001A AT411126B (en) 2001-04-06 2001-04-06 SEMICONDUCTOR MODULE
DE10205408A DE10205408A1 (en) 2001-04-06 2002-02-09 Semiconductor module comprises a housing closed on one side by a metallic heat conducting base which is connected to a metallic coated, electrically insulating heat conducting ceramic layer via a solder layer
CH2702002A CH695518A5 (en) 2001-04-06 2002-02-18 Semiconductor module.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT5612001A AT411126B (en) 2001-04-06 2001-04-06 SEMICONDUCTOR MODULE

Publications (2)

Publication Number Publication Date
ATA5612001A true ATA5612001A (en) 2003-02-15
AT411126B AT411126B (en) 2003-09-25

Family

ID=3676613

Family Applications (1)

Application Number Title Priority Date Filing Date
AT5612001A AT411126B (en) 2001-04-06 2001-04-06 SEMICONDUCTOR MODULE

Country Status (3)

Country Link
AT (1) AT411126B (en)
CH (1) CH695518A5 (en)
DE (1) DE10205408A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004018477B4 (en) * 2004-04-16 2008-08-21 Infineon Technologies Ag Semiconductor module
CN100390974C (en) * 2004-08-20 2008-05-28 清华大学 Large-area heat sink structure for large power semiconductor device
GB2418539A (en) * 2004-09-23 2006-03-29 Vetco Gray Controls Ltd Electrical circuit package
DE102004056111A1 (en) 2004-11-19 2006-06-01 Siemens Ag Semiconductor switching module
DE102005039706A1 (en) * 2005-08-23 2007-03-01 Hella Kgaa Hueck & Co. Printed circuit board structure for an electronic device like a choke/controller on a gas discharge lamp has electronic components attached to a heat sink and earthing contacts
DE102005048100B4 (en) * 2005-09-30 2018-07-05 Robert Bosch Gmbh Electrical device, in particular electronic control device for motor vehicles
DE102007003875A1 (en) * 2007-01-25 2008-08-07 Siemens Ag power converters
GB2467805C (en) * 2009-05-12 2011-06-01 Iceotope Ltd Cooled electronic system
DE102011100524B4 (en) 2011-05-05 2016-06-09 Semikron Elektronik Gmbh & Co. Kg Power electronic arrangement
DE102023103638A1 (en) 2023-02-15 2024-08-22 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Heat sinks for electronic power modules, assembly with such a heat sink and their manufacture and use

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5602720A (en) * 1993-06-25 1997-02-11 Sumitomo Electric Industries, Ltd. Mounting structure for semiconductor device having low thermal resistance
JP3051011B2 (en) * 1993-11-18 2000-06-12 株式会社東芝 Power module
JPH07211832A (en) * 1994-01-03 1995-08-11 Motorola Inc Power radiating device and manufacture thereof
JP2000138333A (en) * 1998-11-04 2000-05-16 Shibafu Engineering Kk Module semiconductor device
FR2786658A1 (en) * 1998-11-27 2000-06-02 Alstom Technology Composite structure for electronic power components including cooling system, comprising channels for passage of coolant in lower conductor or semiconductor layer

Also Published As

Publication number Publication date
DE10205408A1 (en) 2002-10-17
CH695518A5 (en) 2006-06-15
AT411126B (en) 2003-09-25

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee