ATA472170A - Verfahren zum befestigen der verbindungsdrahte von elektrischen mikrobauteilen - Google Patents

Verfahren zum befestigen der verbindungsdrahte von elektrischen mikrobauteilen

Info

Publication number
ATA472170A
ATA472170A AT472170A AT472170A ATA472170A AT A472170 A ATA472170 A AT A472170A AT 472170 A AT472170 A AT 472170A AT 472170 A AT472170 A AT 472170A AT A472170 A ATA472170 A AT A472170A
Authority
AT
Austria
Prior art keywords
fixing
connecting wires
electrical micro
micro components
components
Prior art date
Application number
AT472170A
Other languages
English (en)
Other versions
AT328508B (de
Inventor
Gyula Paroczi
Gabor Horvath
Viktor Mann
Original Assignee
Egyesuelt Izzolampa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Egyesuelt Izzolampa filed Critical Egyesuelt Izzolampa
Priority to AT472170A priority Critical patent/AT328508B/de
Publication of ATA472170A publication Critical patent/ATA472170A/de
Application granted granted Critical
Publication of AT328508B publication Critical patent/AT328508B/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
AT472170A 1970-05-26 1970-05-26 Verfahren zum befestigen der verbindungsdrahte von elektrischen mikrobauteilen AT328508B (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT472170A AT328508B (de) 1970-05-26 1970-05-26 Verfahren zum befestigen der verbindungsdrahte von elektrischen mikrobauteilen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT472170A AT328508B (de) 1970-05-26 1970-05-26 Verfahren zum befestigen der verbindungsdrahte von elektrischen mikrobauteilen

Publications (2)

Publication Number Publication Date
ATA472170A true ATA472170A (de) 1975-06-15
AT328508B AT328508B (de) 1976-03-25

Family

ID=3567543

Family Applications (1)

Application Number Title Priority Date Filing Date
AT472170A AT328508B (de) 1970-05-26 1970-05-26 Verfahren zum befestigen der verbindungsdrahte von elektrischen mikrobauteilen

Country Status (1)

Country Link
AT (1) AT328508B (de)

Also Published As

Publication number Publication date
AT328508B (de) 1976-03-25

Similar Documents

Publication Publication Date Title
SU563126A3 (ru) Способ получени электрической энергии
SE384605B (sv) Elektriskt anslutningsdon
SE386802B (sv) Elektriskt kopplingsdon
SE386803B (sv) Elektriskt kopplingsdon
AT317330B (de) Elektrischer Verbinder
SE387780B (sv) Elektriskt forbindningsdon
BR7100854D0 (pt) Conectores eletricos
SU439966A3 (ru) Способ получения -арил-2-аминоалкоксистиролов
AT310842B (de) Elektrischer Verbinder
CH550530A (de) Verfahren zum herstellen einer elektrischen baueinheit.
SE396876B (sv) Elektrisk kontaktapparat
IT940109B (it) Elemento connettore elettrico
AT314638B (de) Verbindungselement zum Verspleißen isolierter elektrischer Leitungen
CH532853A (de) Verfahren zum Verbinden von aluminiummantelten Kabeln
AT329126B (de) Montage-vorrichtung zum verbinden von isolierten elektrischen leitungsadern
BG17538A3 (bg) Метод за получаване на нови сулфамилантранилови киселини
CH470771A (de) Kommutator für Kleinstmotoren und Verfahren zum Herstellen desselben
SU461519A3 (ru) Способ изготовлени электрических катушек
SE383589B (sv) Elektriskt anslutningsdon
AT312129B (de) Elektroisolierung
IT971125B (it) Metodo per montare collegamenti elettrici
ATA472170A (de) Verfahren zum befestigen der verbindungsdrahte von elektrischen mikrobauteilen
SU439963A3 (ru) Способ получения фениламиноалканов
TR16680A (tr) Usul
SU437302A3 (ru) Способ получения арилфенилметилхлорсиланов

Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee