AT9303B - Spelsewasser-Vorwärmer. - Google Patents

Spelsewasser-Vorwärmer.

Info

Publication number
AT9303B
AT9303B AT9303DA AT9303B AT 9303 B AT9303 B AT 9303B AT 9303D A AT9303D A AT 9303DA AT 9303 B AT9303 B AT 9303B
Authority
AT
Austria
Prior art keywords
water preheater
spinning water
spinning
preheater
desc
Prior art date
Application number
Other languages
English (en)
Inventor
Gottfried Hoepfner
Original Assignee
Gottfried Hoepfner
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gottfried Hoepfner filed Critical Gottfried Hoepfner
Application granted granted Critical
Publication of AT9303B publication Critical patent/AT9303B/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Yarns And Mechanical Finishing Of Yarns Or Ropes (AREA)
  • Paper (AREA)
  • Treating Waste Gases (AREA)

Description


   <Desc/Clms Page number 1> 
 
 EMI1.1 
 
 EMI1.2 
 

**WARNUNG** Ende DESC Feld kannt Anfang CLMS uberlappen**.

Claims (1)

  1. **WARNUNG** Ende CLMS Feld Kannt Anfang DESC uberlappen**.
AT9303D 1901-10-31 1901-10-31 Spelsewasser-Vorwärmer. AT9303B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT9303T 1901-10-31

Publications (1)

Publication Number Publication Date
AT9303B true AT9303B (de) 1902-10-10

Family

ID=3503111

Family Applications (1)

Application Number Title Priority Date Filing Date
AT9303D AT9303B (de) 1901-10-31 1901-10-31 Spelsewasser-Vorwärmer.

Country Status (1)

Country Link
AT (1) AT9303B (de)

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