AT296866B - Verfahren zum bereichsweisen Metallisieren der Oberflächen eines Isolierstoffkörpers - Google Patents

Verfahren zum bereichsweisen Metallisieren der Oberflächen eines Isolierstoffkörpers

Info

Publication number
AT296866B
AT296866B AT825369A AT825369A AT296866B AT 296866 B AT296866 B AT 296866B AT 825369 A AT825369 A AT 825369A AT 825369 A AT825369 A AT 825369A AT 296866 B AT296866 B AT 296866B
Authority
AT
Austria
Prior art keywords
metallizing
wise
area
insulating body
insulating
Prior art date
Application number
AT825369A
Other languages
English (en)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of AT296866B publication Critical patent/AT296866B/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/4572—Partial coating or impregnation of the surface of the substrate
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0568—Resist used for applying paste, ink or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0577—Double layer of resist having the same pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Inorganic Insulating Materials (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Chemically Coating (AREA)
AT825369A 1968-08-30 1969-08-28 Verfahren zum bereichsweisen Metallisieren der Oberflächen eines Isolierstoffkörpers AT296866B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1307368A CH519029A (de) 1968-08-30 1968-08-30 Verfahren zum bereichsweisen Metallisieren der Oberflächen sowie zum Metallisieren von Durchbrüchen eines Isolierstoffkörpers

Publications (1)

Publication Number Publication Date
AT296866B true AT296866B (de) 1972-02-25

Family

ID=4389062

Family Applications (1)

Application Number Title Priority Date Filing Date
AT825369A AT296866B (de) 1968-08-30 1969-08-28 Verfahren zum bereichsweisen Metallisieren der Oberflächen eines Isolierstoffkörpers

Country Status (8)

Country Link
JP (1) JPS5327284B1 (de)
AT (1) AT296866B (de)
BR (1) BR6911964D0 (de)
CH (1) CH519029A (de)
DE (1) DE1931248C3 (de)
GB (1) GB1283392A (de)
NL (1) NL145433B (de)
SE (1) SE359014B (de)

Also Published As

Publication number Publication date
DE1931248C3 (de) 1974-01-31
SE359014B (de) 1973-08-13
DE1931248B2 (de) 1973-07-05
CH519029A (de) 1972-02-15
DE1931248A1 (de) 1970-03-05
JPS5327284B1 (de) 1978-08-08
NL6912613A (de) 1970-03-03
NL145433B (nl) 1975-03-17
GB1283392A (en) 1972-07-26
BR6911964D0 (pt) 1973-06-12

Similar Documents

Publication Publication Date Title
FI49915C (fi) Menetelmä ja laite kappaleen pinnan päällystämiseksi hitsikerrostamall a.
AT301978B (de) Verfahren und Bad zum Beschichten metallischer Gegenstände
AT320581B (de) Verfahren zum Überziehen von Oberflächen
AT283826B (de) Verfahren zur Verminderung der Intensität von Stoßwellen
CH502870A (de) Verfahren zum Erzeugen gekrümmter Oberflächen
AT293950B (de) Verfahren zum Kommissionieren
AT283078B (de) Verfahren zum Nachbehandeln von Phosphatschichten auf Metalloberflächen
CH505527A (de) Verfahren zum Herstellen eines elektro-akustischen Wandlers
CH501435A (de) Verfahren und Vorrichtung zum Versprühen leichtflüssiger Medien
CH516650A (de) Verfahren zum Reinigen metallischer Werkstücke
AT305214B (de) Verfahren zur Verbesserung der Eingenschaften kleiner Kapseln
AT281541B (de) Verfahren zum Beizen von metallischen Innenflächen geschlossener Gefäße
CH501314A (de) Verfahren zum Prüfen der Vollständigkeit von Ätzungen
CH522041A (de) Verfahren zur Behandlung metallischer Oberflächen
CH503124A (de) Verfahren zur Nitrierung der Oberfläche von Stahlkörpern
CH527278A (de) Verfahren zur Nitridierhärtung der inneren Oberfläche von Röhren
AT296866B (de) Verfahren zum bereichsweisen Metallisieren der Oberflächen eines Isolierstoffkörpers
CH471425A (de) Verfahren zur Detektion der Bewegung eines Objektes
SU461514A3 (ru) Способ получени металлических покрытий на стали
CH471242A (de) Verfahren zur selektiven Maskierung zu bearbeitender Flächen
CH537465A (de) Verfahren zur Phosphatierung von Metalloberflächen
CH498492A (de) Verfahren zum Herstellen eines elektronischen Bauelements
AT312130B (de) Verfahren zum Reinigen von lackierten Oberflächen
AT301852B (de) Verfahren zum kontinuierlichen belegen der oberflaechen von platten od. dgl
DE1962182B2 (de) Verfahren zum entsanden von gusstuecken

Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee