AT259018B - Vorrichtung zum Wärmeausgleich und zur Kühlung eines Transistorenpaares - Google Patents
Vorrichtung zum Wärmeausgleich und zur Kühlung eines TransistorenpaaresInfo
- Publication number
- AT259018B AT259018B AT94866A AT94866A AT259018B AT 259018 B AT259018 B AT 259018B AT 94866 A AT94866 A AT 94866A AT 94866 A AT94866 A AT 94866A AT 259018 B AT259018 B AT 259018B
- Authority
- AT
- Austria
- Prior art keywords
- transistors
- cooling
- pair
- heat compensation
- compensation
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
- H03F1/30—Modifications of amplifiers to reduce influence of variations of temperature or supply voltage or other physical parameters
- H03F1/302—Modifications of amplifiers to reduce influence of variations of temperature or supply voltage or other physical parameters in bipolar transistor amplifiers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT291665 | 1965-02-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
AT259018B true AT259018B (de) | 1967-12-27 |
Family
ID=11103748
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT94866A AT259018B (de) | 1965-02-12 | 1966-02-02 | Vorrichtung zum Wärmeausgleich und zur Kühlung eines Transistorenpaares |
Country Status (3)
Country | Link |
---|---|
US (1) | US3411049A ( ) |
AT (1) | AT259018B ( ) |
NL (1) | NL6601298A ( ) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3558987A (en) * | 1968-11-08 | 1971-01-26 | Subscription Television Inc | Overheating protection circuit for a power transistor |
US3590327A (en) * | 1969-04-24 | 1971-06-29 | Transmation Inc | System for maintaining uniform temperature conditions throughout a body |
US3621337A (en) * | 1969-08-14 | 1971-11-16 | Westinghouse Electric Corp | Solid-state photocontrol housing assembly with external heat dissipating ribs |
US3626252A (en) * | 1970-01-21 | 1971-12-07 | Keithley Instruments | Temperature equalization for printed circuits |
US3801874A (en) * | 1972-10-30 | 1974-04-02 | Gen Electric | Isolation mounting for semiconductor device |
US3999105A (en) * | 1974-04-19 | 1976-12-21 | International Business Machines Corporation | Liquid encapsulated integrated circuit package |
US3986082A (en) * | 1975-02-14 | 1976-10-12 | The United States Of America As Represented By The Secretary Of The Air Force | Universal temperature controlled reference junction |
US5405808A (en) * | 1993-08-16 | 1995-04-11 | Lsi Logic Corporation | Fluid-filled and gas-filled semiconductor packages |
US9318409B1 (en) | 2014-09-25 | 2016-04-19 | Freescale Semiconductor, Inc. | Integrated circuit heater for reducing stress in the integrated circuit material and chip leads of the integrated circuit, and for optimizing performance of devices of the integrated circuit |
USD750314S1 (en) * | 2014-12-22 | 2016-02-23 | Cree, Inc. | Photocontrol receptacle for lighting fixture |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3299331A (en) * | 1955-05-10 | 1967-01-17 | Texas Instruments Inc | Transistor structure with heatconductive housing for cooling |
BE614781A (fr) * | 1962-03-07 | 1962-07-02 | Anciens Etablissements Supli | Amplificateur miniature à transistors |
-
1966
- 1966-02-01 NL NL6601298A patent/NL6601298A/xx unknown
- 1966-02-02 AT AT94866A patent/AT259018B/de active
- 1966-03-04 US US531659A patent/US3411049A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US3411049A (en) | 1968-11-12 |
NL6601298A ( ) | 1966-08-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CH438594A (de) | Verfahren und Vorrichtung zum Kühlen von Stranggussmaterial | |
CH432735A (de) | Verfahren und Vorrichtung zum Erhitzen von Glastafeln | |
DE1967104A1 (de) | Vorrichtung zum regeln der temperatur eines raumes | |
CH389172A (de) | Verfahren und Vorrichtung zum Stranggiessen | |
CH389173A (de) | Verfahren und Vorrichtung zum Stranggiessen | |
AT259186B (de) | Vorrichtung zum Beheizen und Kühlen von Räumen | |
CH424102A (de) | Verfahren zum Stranggiessen eines Bandes und Kühlvorrichtung zum Durchführen des Verfahrens | |
AT282930B (de) | Verfahren und Vorrichtung zum kontinuierlichen Herstellen von formfesten Rohren | |
CH461791A (de) | Verfahren und Vorrichtung zum induktiven Beheizen von Formwerkzeugen | |
AT259018B (de) | Vorrichtung zum Wärmeausgleich und zur Kühlung eines Transistorenpaares | |
AT267454B (de) | Vorrichtung zum Abkühlen und Querfördern von Blechen | |
AT249896B (de) | Verfahren und Vorrichtung zum Stranggießen | |
AT246202B (de) | Einrichtung zum gleichmäßigen und schnellen Abkühlen von Werkstücken | |
AT271167B (de) | Verfahren und Vorrichtung zum Gefriertrocknen | |
AT233186B (de) | Einrichtung zum Kühlen von Stranggußmaterial | |
CH474732A (de) | Vorrichtung zur Wärmebehandlung eines Gutes | |
AT283879B (de) | Verfahren und Vorrichtung zum Agglomerieren vonpulverförmigen Produkten | |
CH462601A (de) | Vorrichtung zum Kühlen und Aufbereiten von körnigem Material | |
CH453617A (de) | Verfahren zur Regelung der Temperatur in einem dampfbeheizten Wärmebehandlungsapparat und Vorrichtung zur Durchführung des Verfahrens | |
CH412214A (de) | Verfahren und Vorrichtung zum Kühlen von Stranggussmaterial | |
CH454929A (de) | Vorrichtung zum Kühlen und Aufrechterhalten einer niedrigen Temperatur von Formteilen mittels einer tiefsiedenden Kühlflüssigkeit | |
CH474035A (de) | Verfahren zum Kühlen heisser Wände und Einrichtung zur Durchführung des Verfahrens | |
CH445727A (de) | Verfahren und Vorrichtung zum Stranggiessen | |
AT264802B (de) | Verfahren und Vorrichtung zum Kühlen von grepreßten Formkörpern | |
CH404216A (de) | Vorrichtung zum Aufzeichnen und Vergleichen von Profilen |