AR192233A1 - Dispositivo semiconductor y metodo para fabricarlo - Google Patents
Dispositivo semiconductor y metodo para fabricarloInfo
- Publication number
- AR192233A1 AR192233A1 AR239946A AR23994672A AR192233A1 AR 192233 A1 AR192233 A1 AR 192233A1 AR 239946 A AR239946 A AR 239946A AR 23994672 A AR23994672 A AR 23994672A AR 192233 A1 AR192233 A1 AR 192233A1
- Authority
- AR
- Argentina
- Prior art keywords
- manufacturing
- semiconductor device
- semiconductor
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/4824—Pads with extended contours, e.g. grid structure, branch structure, finger structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/66272—Silicon vertical transistors
- H01L29/66295—Silicon vertical transistors with main current going through the whole silicon substrate, e.g. power bipolar transistor
- H01L29/66303—Silicon vertical transistors with main current going through the whole silicon substrate, e.g. power bipolar transistor with multi-emitter, e.g. interdigitated, multi-cellular or distributed emitter
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13122971A | 1971-04-05 | 1971-04-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
AR192233A1 true AR192233A1 (es) | 1973-02-08 |
Family
ID=22448510
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AR239946A AR192233A1 (es) | 1971-04-05 | 1972-01-04 | Dispositivo semiconductor y metodo para fabricarlo |
Country Status (12)
Country | Link |
---|---|
AR (1) | AR192233A1 (es) |
AU (1) | AU461334B2 (es) |
BE (1) | BE777627A (es) |
BR (1) | BR7108653D0 (es) |
CA (1) | CA934480A (es) |
DE (1) | DE2165274A1 (es) |
ES (1) | ES397884A1 (es) |
FR (1) | FR2131930B1 (es) |
GB (1) | GB1322141A (es) |
IT (1) | IT946279B (es) |
NL (1) | NL7200117A (es) |
SE (1) | SE377632B (es) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113394267B (zh) * | 2021-06-09 | 2023-06-09 | 武汉新芯集成电路制造有限公司 | 半导体器件及其制造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3571913A (en) * | 1968-08-20 | 1971-03-23 | Hewlett Packard Co | Method of making ohmic contact to a shallow diffused transistor |
GB1262000A (en) * | 1968-11-22 | 1972-02-02 | Tokyo Shibaura Electric Co | A semiconductor device and a method for manufacturing the same |
-
1971
- 1971-12-08 FR FR7143997A patent/FR2131930B1/fr not_active Expired
- 1971-12-08 AU AU36602/71A patent/AU461334B2/en not_active Expired
- 1971-12-09 CA CA129820A patent/CA934480A/en not_active Expired
- 1971-12-11 ES ES397884A patent/ES397884A1/es not_active Expired
- 1971-12-29 BR BR8653/71A patent/BR7108653D0/pt unknown
- 1971-12-29 DE DE19712165274 patent/DE2165274A1/de active Pending
- 1971-12-31 BE BE777627A patent/BE777627A/xx unknown
-
1972
- 1972-01-03 GB GB4272A patent/GB1322141A/en not_active Expired
- 1972-01-03 IT IT19013/72A patent/IT946279B/it active
- 1972-01-04 AR AR239946A patent/AR192233A1/es active
- 1972-01-04 SE SE7200054A patent/SE377632B/xx unknown
- 1972-01-05 NL NL7200117A patent/NL7200117A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
FR2131930B1 (es) | 1977-06-03 |
IT946279B (it) | 1973-05-21 |
BE777627A (fr) | 1972-04-17 |
ES397884A1 (es) | 1975-05-16 |
CA934480A (en) | 1973-09-25 |
BR7108653D0 (pt) | 1973-05-15 |
FR2131930A1 (es) | 1972-11-17 |
GB1322141A (en) | 1973-07-04 |
SE377632B (es) | 1975-07-14 |
AU3660271A (en) | 1973-06-14 |
AU461334B2 (en) | 1975-05-22 |
NL7200117A (es) | 1972-10-09 |
DE2165274A1 (de) | 1972-10-12 |
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