CN111007377A - Temperature sampling circuit, temperature sampling system and UPS system of IGBT module - Google Patents
Temperature sampling circuit, temperature sampling system and UPS system of IGBT module Download PDFInfo
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- CN111007377A CN111007377A CN201911335930.1A CN201911335930A CN111007377A CN 111007377 A CN111007377 A CN 111007377A CN 201911335930 A CN201911335930 A CN 201911335930A CN 111007377 A CN111007377 A CN 111007377A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
- G01R31/2608—Circuits therefor for testing bipolar transistors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
- G01K7/24—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor in a specially-adapted circuit, e.g. bridge circuit
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K2219/00—Thermometers with dedicated analog to digital converters
Abstract
The embodiment of the invention provides a temperature sampling circuit, a temperature sampling system and a UPS system of an IGBT module. Temperature sampling circuit of IGBT module includes: the temperature sensing circuit is used for outputting an analog quantity signal related to the current temperature of the IGBT module; a triangular wave generating circuit for generating a triangular wave; and the optical coupler transmission circuit is respectively electrically connected with the output ends of the thermal sensitive circuit and the triangular wave generating circuit and used for generating a square wave according to analog quantity signals output by the triangular wave and the thermal sensitive circuit, carrying out isolation transmission on the square wave through the optical coupler and filtering an output signal of the optical coupler into a direct current signal, wherein the direct current signal is a temperature sampling signal of the IGBT module. According to the invention, the triangular wave is compared with the analog quantity signal of the thermosensitive circuit to generate the square wave, the square wave is isolated and transmitted through a common optical coupler, and then the output of the optical coupler is filtered into a direct current component through a low-pass filter, so that the electrical isolation transmission of the analog quantity and the temperature sampling of the IGBT module are realized.
Description
Technical Field
The invention relates to the field of uninterrupted power supplies, in particular to the field of UPS, inverters, energy storage and frequency converters, and the invention is used for monitoring the temperature of an IGBT module used by an inversion part in the UPS in real time.
Background
There is no thermistor inside the early IGBT (Insulated Gate Bipolar Transistor) module, and thus there is no effective detection circuit designed for the temperature of the IGBT module, and overheat protection is performed by detecting the temperature of the heat sink on which the IGBT module is mounted. In actual operation of a UPS (uninterruptible Power Supply), the temperature of a heat sink and the actual temperature of an IGBT module are greatly different, and if an overheat protection point of the heat sink is too low, a machine may be falsely reported, and if the overheat protection point is too high, effective and sustainable reliable protection cannot be performed. And, along with the operating time of machine increases, the thermal grease also can be ageing to volatilize between IGBT module and the radiator, makes the overheat protection point temperature of radiator be less than the actual temperature of IGBT module far away to unable effectual protection IGBT module, make the IGBT module because overheated impaired, long-term the use, greatly reduced UPS's reliability.
By combining the above factors, it is difficult to select an appropriate overheating protection point for the temperature on the radiator, and reliable protection cannot be achieved. In the process of implementing the invention, the inventor finds that at least the following problems exist in the prior art: the prior art can not realize the real-time monitoring of the temperature of the IGBT module.
Disclosure of Invention
The embodiment of the invention provides a temperature sampling circuit, a temperature sampling system and a UPS system of an IGBT module, which are used for sampling the temperature of the IGBT module.
In a first aspect, an embodiment of the present invention provides a temperature sampling circuit for an IGBT module, including: the temperature sensing circuit is used for outputting an analog quantity signal related to the current temperature of the IGBT module; a triangular wave generating circuit for generating a triangular wave; and the optical coupler transmission circuit is respectively electrically connected with the output ends of the thermosensitive circuit and the triangular wave generating circuit and used for generating a square wave according to the triangular wave and an analog quantity signal output by the thermosensitive circuit, carrying out isolation transmission on the square wave through an optical coupler and filtering an output signal of the optical coupler into a direct current signal, wherein the direct current signal is a temperature sampling signal of the IGBT module.
Optionally, the thermistor circuit comprises a resistor voltage dividing circuit formed by connecting a thermistor (R6) and a voltage dividing resistor (R7) in series, and one end of the voltage dividing resistor (R7) is grounded.
Optionally, the triangular wave generating circuit is configured to obtain an output waveform of the triangular wave according to V _ EH, V _ EL, a rising time of the triangular wave, and a falling time of the triangular wave; wherein V _ EH is a high-point voltage of the output terminal of the triangular wave generation circuit, and V _ EL is a low-point voltage of the output terminal of the triangular wave generation circuit.
Optionally, the triangle wave generating circuit comprises a hysteresis comparator and a proportional-integral amplifier electrically connected to each other.
Optionally, the optical coupling transmission circuit includes: a comparator (U3), an optocoupler (U4) and a low pass filter; one input end of the comparator (U3) is electrically connected with the output end of the triangular wave generation circuit, and the other input end of the comparator (U3) is electrically connected with the voltage output end of the divider resistor (R7); the input end of the optical coupler (U4) is electrically connected with the output end of the comparator (U3), and the output end of the optical coupler (U4) is electrically connected with the low-pass filter; the low-pass filter comprises a monovalent RC low-pass filter consisting of a filter resistor (R10) and a filter capacitor (C2).
Optionally, the filter capacitor (C2) is connected in parallel with a voltage dividing resistor (R11), and the low-pass filter is electrically connected with a pull-up resistor (R9).
Optionally, the temperature sampling circuit is further electrically connected to a resource allocation circuit, and the resource allocation circuit is configured to obtain an output signal (TEMP _ DSP) after chip selection is performed on the temperature sampling signals output by the plurality of temperature sampling circuits, and transmit the output signal (TEMP _ DSP) to an a/D sampling port of a digital signal processor DSP in the UPS power system.
In a second aspect, an embodiment of the present invention provides a temperature sampling system for multiple IGBT modules, including multiple temperature sampling circuits for any one of the IGBT modules described above, one or more resource allocation circuits, and a digital signal processor DSP; the DSP is provided with one or more A/D sampling ports; the input end of the resource allocation circuit is electrically connected with the temperature sampling circuits of the IGBT modules, the output end of the resource allocation circuit is electrically connected with one A/D sampling port, and the resource allocation circuit is used for performing chip selection on the temperature sampling signals output by the temperature sampling circuits to obtain an output signal (TEMP _ DSP) and transmitting the output signal (TEMP _ DSP) to the A/D sampling port of the DSP.
Optionally, the resource allocation circuit comprises an 8-to-1 chip select (U5).
In a third aspect, an embodiment of the present invention provides a UPS system, where the UPS system includes a plurality of parallel IGBT modules, and the temperature sampling system of the multiple IGBT modules.
The technical scheme has the following beneficial effects:
according to the embodiment of the invention, the triangular wave is compared with the analog quantity signal of the thermosensitive circuit to generate the square wave, the square wave is isolated and transmitted through the common optical coupler, the cost can be reduced, the electric isolation is realized, then the output of the optical coupler is filtered into the direct current component through the low-pass filter, the electric isolation and transmission of the analog quantity are realized, and the temperature sampling of the IGBT module is realized.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of an IGBT simulated temperature sampling circuit of an embodiment of the present invention;
FIG. 2 is a circuit schematic of a triangular wave generation circuit of an embodiment of the present invention;
FIG. 3 is a circuit schematic of a temperature sensing circuit and an opto-coupler transmission circuit of an embodiment of the present invention;
fig. 4 is a circuit schematic of a resource allocation circuit of an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
With the development of scientific technology, an IGBT module with a built-in thermistor has appeared, and thus how to detect temperature by using the thermistor becomes a problem to be researched. The inventor of the application finds that an analog quantity related to the thermistor can be obtained through a proper voltage division circuit, but the IGBT module belongs to a strong current part, and in order to ensure the reliable operation of the whole system, the analog quantity needs to be electrically isolated and then transmitted to a detection circuit of the system. The linear optocoupler can realize the isolation transmission of analog quantity, but the cost of the linear optocoupler is too high, and aiming at the problem, the embodiment of the invention realizes the isolation transmission of the analog quantity by using a common optocoupler and applying a proper circuit.
Fig. 1 is a schematic diagram of an IGBT simulated temperature sampling circuit according to an embodiment of the present invention. As shown in fig. 1, an embodiment of the present invention provides a temperature sampling circuit of an IGBT module, including: the temperature sensing circuit is used for outputting an analog quantity signal related to the current temperature of the IGBT module; a triangular wave generating circuit for generating a triangular wave; and the optical coupler transmission circuit is respectively electrically connected with the output ends of the thermosensitive circuit and the triangular wave generating circuit and is used for generating a square wave according to the triangular wave and an analog quantity signal output by the thermosensitive circuit, carrying out isolation transmission on the square wave through an optical coupler and filtering an output signal of the optical coupler into a direct current signal, wherein the direct current signal is a temperature sampling signal of the IGBT module.
The embodiment of the invention designs a triangular wave generating circuit, and generates a square wave by comparing the triangular wave with the analog quantity signal of the thermosensitive circuit, so that the square wave can be isolated and transmitted by a common optical coupler, and then the output of the optical coupler is filtered into a direct current component by a low-pass filter, thereby realizing the electrical isolation and transmission of the analog quantity.
FIG. 2 is a schematic diagram of a triangular wave generating circuit according to an embodiment of the present invention, wherein a reference voltage obtained by dividing a voltage of a power supply V1 through R1 and R2 is supplied to a reverse input (-) of U1 and a non-reverse input (+) of U2 in FIG. 2, and R3 and R4 of U1 form a hysteresis comparator, so that U1 outputs a square wave. The proportional-integral amplifier formed by the R5 and the C1 of the U2 changes the square wave output by the U1 into a triangular wave, which is the trace signal in fig. 2. As shown in fig. 2, when the voltage at point A, B, C, D, E is V _ A, V _ B, V _ C, V _ D, V _ E (V _ EH is the high-point voltage, V _ EL is the low-point voltage), and U1 and U2 are operational amplifiers, the voltage at point V _ a can be calculated as:
u1 belongs to the hysteresis comparator, U2 belongs to the proportional-integral regulator, the voltage of the point B is determined by the point C and the point E, and the voltage of the point B is calculated according to the superposition theorem:
assuming that the high level of the output of U1 is V1 and the low level is 0, then:
when V _ B > V _ A, the U1 output is V1; v _ B < V _ a, the U1 output is 0.
When V _ B < V _ a and V _ C is 0, the capacitor C1 is charged through R5, the voltage at point E rises until the voltage at point E rises to V _ EH to make V _ B > V _ a, the voltage at point C reverses, then the voltage at point C V _ C is V1, the voltage at point B is raised by the voltage at point C to be slightly higher than the voltage at point a, C1 discharges, the voltage at point E begins to fall, when the voltage at point E falls to V _ EL to make V _ B < V _ a, the voltage at point C reverses, then the voltage at point C is 0, the voltage at point B is lowered by the voltage at point C to be slightly lower than the voltage at point a, C1 charges, the voltage at point E begins to rise, and so on. Then there are:
according to the above formula, the peak V _ EH and the trough V _ EL of the triangular wave at the point E can be calculated.
Then, the charging current and the discharging current of C1 are calculated as follows:
charging current:
discharge current:
then, according to the charging current and the discharging current, the rising time and the falling time of the triangular wave can be calculated:
rise time:
the falling time is as follows:
namely, the output waveform of the E-point triangular wave trace is obtained from V _ EH, V _ EL, the rising time of the triangular wave, and the falling time of the triangular wave.
Fig. 3 is a circuit schematic of a thermal sensing circuit and an opto-coupler transmission circuit of an embodiment of the present invention. As shown in fig. 3, R6 is a thermistor inside the IGBT module, and U3 is a comparator. When the temperature of the IGBT module changes, the resistance value of R6 changes, the 2-pin voltage of U3 changes correspondingly, and after the comparison with the waveform of Trangle, U3 outputs a square wave, and the duty ratio of the square wave changes along with the change of R6. After the square wave signal of U3 is isolated and transmitted by an optocoupler U4, the square wave signal finally forms a low-pass filter by R10 and C2, and the square wave signal is filtered into a direct current signal, so that the isolated transmission of analog quantity is realized. R9 provides a pull-up power source, R11 is a voltage dividing resistor, and converts the voltage into a voltage signal TEMP1 that a DSP (digital signal processor) can accept.
In a UPS power system, the analog signal is finally sent to the a/D sampling port of the DSP, the number of the a/D sampling ports of the DSP is limited, the number of the IGBT modules used in the UPS is large, especially in a high-power machine, many IGBT modules are used in parallel, if the temperatures of all the IGBT modules are sampled, a large number of the a/D sampling ports are needed, and obviously, this is not practical in practical application.
Based on the above problem, in some embodiments, the solution in fig. 4 is proposed. FIG. 4 is a circuit schematic of a resource allocation circuit of an embodiment of the invention, as shown in FIG. 4: an 8-to-1 chip select chip is used, such as U5 of FIG. 3. Because the temperature sampling signal is a slow signal for the UPS system, a 2-to-1 chip selection chip with higher speed is not required to be selected, and the temperature of 16 IGBT modules can be sampled only by two A/D sampling ports.
The TEMP1 signal (TEMP1-TEPM8 are temperature sampling signals of each module) obtained in fig. 3 is sent to TEMP1 in fig. 4, and after 8-to-1 chip selection, a signal TEMP _ DSP is output, so that temperature sampling of the IGBT module is completed.
In the circuit diagrams of fig. 2 to 4, the ports denoted by V1 are all connected together, the ports denoted by V2 are all connected together, V1 and V2 are different, and AGND (Analog Ground) and GND are also different.
The embodiment of the invention also provides a temperature sampling system of the multiple IGBT modules, which comprises a plurality of temperature sampling circuits of any one of the IGBT modules, one or more resource allocation circuits and a Digital Signal Processor (DSP); the DSP is provided with one or more A/D sampling ports; and the input end of the resource distribution circuit is electrically connected with the temperature sampling circuits of the plurality of IGBT modules, the output end of the resource distribution circuit is electrically connected with one A/D sampling port, and the resource distribution circuit is used for performing chip selection on the temperature sampling signals output by the plurality of temperature sampling circuits to obtain an output signal (TEMP _ DSP) and transmitting the output signal (TEMP _ DSP) to the A/D sampling port of the DSP. In some embodiments, the resource allocation circuitry includes an 8-to-1 chip select (U5).
The embodiment of the invention also provides a UPS system, which comprises a plurality of IGBT modules connected in parallel and the temperature sampling system of the multiple IGBT modules.
The various illustrative logical blocks, or elements, described in connection with the embodiments disclosed herein may be implemented or performed with a general purpose processor, a digital signal processor, an Application Specific Integrated Circuit (ASIC), a field programmable gate array or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. A general-purpose processor may be a microprocessor, but in the alternative, the processor may be any conventional processor, controller, microcontroller, or state machine. A processor may also be implemented as a combination of computing devices, e.g., a digital signal processor and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a digital signal processor core, or any other similar configuration.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are merely exemplary embodiments of the present invention, and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (10)
1. A temperature sampling circuit of an IGBT module is characterized by comprising:
the temperature sensing circuit is used for outputting an analog quantity signal related to the current temperature of the IGBT module;
a triangular wave generating circuit for generating a triangular wave;
and the optical coupler transmission circuit is respectively electrically connected with the output ends of the thermosensitive circuit and the triangular wave generating circuit and used for generating a square wave according to the triangular wave and an analog quantity signal output by the thermosensitive circuit, carrying out isolation transmission on the square wave through an optical coupler and filtering an output signal of the optical coupler into a direct current signal, wherein the direct current signal is a temperature sampling signal of the IGBT module.
2. The temperature sampling circuit according to claim 1, wherein the thermistor circuit comprises a resistor voltage dividing circuit formed by connecting a thermistor (R6) and a voltage dividing resistor (R7) in series, and one end of the voltage dividing resistor (R7) is grounded.
3. The temperature sampling circuit according to claim 1, wherein the triangular wave generating circuit is configured to derive an output waveform of the triangular wave according to V _ EH, V _ EL, a rise time of the triangular wave, and a fall time of the triangular wave; wherein V _ EH is a high-point voltage of the output terminal of the triangular wave generation circuit, and V _ EL is a low-point voltage of the output terminal of the triangular wave generation circuit.
4. The temperature sampling circuit of claim 1, wherein the triangular wave generation circuit comprises a hysteresis comparator and a proportional-integral amplifier electrically connected to each other.
5. The temperature sampling circuit of claim 2, wherein the optocoupler transmission circuit comprises: a comparator (U3), an optocoupler (U4) and a low pass filter;
one input end of the comparator (U3) is electrically connected with the output end of the triangular wave generation circuit, and the other input end of the comparator (U3) is electrically connected with the voltage output end of the divider resistor (R7);
the input end of the optical coupler (U4) is electrically connected with the output end of the comparator (U3), and the output end of the optical coupler (U4) is electrically connected with the low-pass filter;
the low-pass filter comprises a monovalent RC low-pass filter consisting of a filter resistor (R10) and a filter capacitor (C2).
6. The temperature sampling circuit of claim 5, wherein the filter capacitor (C2) is connected in parallel with a voltage dividing resistor (R11), and the low pass filter is electrically connected with a pull-up resistor (R9).
7. The temperature sampling circuit according to any one of claims 1-6, wherein the temperature sampling circuit is further electrically connected to a resource allocation circuit, and the resource allocation circuit is configured to obtain an output signal (TEMP _ DSP) after chip selection of the temperature sampling signals output by the plurality of temperature sampling circuits, and transmit the output signal (TEMP _ DSP) to an A/D sampling port of a Digital Signal Processor (DSP) in the UPS system.
8. A temperature sampling system of a multi-IGBT module, comprising a plurality of temperature sampling circuits of the IGBT module according to claims 1-6, one or more resource allocation circuits, and a digital signal processor DSP; the DSP is provided with one or more A/D sampling ports;
the input end of the resource allocation circuit is electrically connected with the temperature sampling circuits of the IGBT modules, the output end of the resource allocation circuit is electrically connected with one A/D sampling port, and the resource allocation circuit is used for performing chip selection on the temperature sampling signals output by the temperature sampling circuits to obtain an output signal (TEMP _ DSP) and transmitting the output signal (TEMP _ DSP) to the A/D sampling port of the DSP.
9. The temperature sampling system of claim 8, wherein the resource allocation circuit comprises an 8-to-1 chip select (U5).
10. A UPS system comprising a plurality of parallel IGBT modules, and a temperature sampling system of the multi-IGBT modules of claim 8 or 9.
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Cited By (3)
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| CN113367556A (en) * | 2021-05-26 | 2021-09-10 | 广东格兰仕集团有限公司 | Temperature control household appliance with split type panel and temperature control method thereof |
| CN117723812A (en) * | 2024-02-07 | 2024-03-19 | 中国铁塔股份有限公司 | Voltage isolation sampling circuit |
| CN117723812B (en) * | 2024-02-07 | 2024-05-14 | 中国铁塔股份有限公司 | Voltage isolation sampling circuit |
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Application publication date: 20200414 |