WO2024027480A1

WO2024027480A1 - Adapter board, middle frame structure and electronic device

Info

Publication number: WO2024027480A1
Application number: PCT/CN2023/107239
Authority: WO
Inventors: 李小龙; 文冲; 夏其博
Original assignee: 华为技术有限公司
Priority date: 2022-07-30
Filing date: 2023-07-13
Publication date: 2024-02-08
Also published as: CN115442953A

Abstract

A middle frame structure, comprising a middle frame provided with a through hole, and a first circuit board, a second circuit board and an adapter board, which are arranged on the middle frame. The through hole is located between the first circuit board and the second circuit board. The adapter board covers the through hole. The adapter board comprises a heat dissipation fin, which conducts electricity, and the heat dissipation fin is connected between the first circuit board and the second circuit board so that the second circuit board is electrically connected to the first circuit board. Alternatively, the adapter board comprises a ceramic substrate and an electrically conducting circuit arranged on the ceramic substrate, and the electrically conducting circuit is electrically connected to the first circuit board and the second circuit board. Further provided in the present application are an electronic device and an adapter board. The adapter board is arranged on the middle frame and covers the through hole, so as to achieve signal transmission between the first circuit board and the second circuit board. In addition, the adapter board does not affect the strength performance of the middle frame.

Description

Adapter board, mid-frame structure and electronic device

Cross-references to related applications

This application claims priority to the Chinese patent filed with the China Patent Office on July 30, 2022, with the application number 202210912597.1 and the application name "Adapter board, middle frame structure and electronic device", the entire content of which is incorporated herein by reference. Applying.

Technical field

The present application relates to an adapter board, a middle frame structure and an electronic device including the middle frame structure.

Background technique

In the current mobile phone structure, signals are transmitted from the small board to the main board, such as transmitting network signals from the Universal Serial Bus (USB) Type-C interface or the USB small board to the main board. The flexible circuit board is mainly used to connect the small board and the main board. between motherboards. Due to the large number of transmitted signals and the need to meet link impedance constraints, the entire flexible circuit board is wider and thicker. As electronic products gradually become smaller and lighter, there is an urgent need to narrow the flexible circuit board or even eliminate the need for a flexible circuit board.

Contents of the invention

The first aspect of the embodiment of the present application provides a middle frame structure, including:

A middle frame, the middle frame is provided with a through hole;

A first circuit board, arranged on the middle frame;

A second circuit board is provided on the middle frame, and the through hole is located between the first circuit board and the second circuit board;

An adapter plate is provided on the middle frame and covers the through hole,

The adapter board includes a conductive heat sink, and the heat sink is connected between the first circuit board and the second circuit board to electrically connect the second circuit board and the first circuit board. ;or

The adapter board includes a ceramic substrate and conductive lines provided on the ceramic substrate, and the conductive lines are electrically connected to the first circuit board and the second circuit board.

The first circuit board may be a main board, and the second circuit board may be a small board. This application implements signal transmission from the small board to the adapter board and then from the adapter board to the main board by arranging the adapter board in the hollowed-out area (through hole) of the middle frame. The through-hole can be a large-area opening to avoid digging a small-area opening in the middle frame. The strength of the heat sink and ceramic substrate of the adapter plate is equivalent to that of the middle frame material and will not affect the strength of the middle frame. Strength performance will not have any adverse effects on the overall structure of the machine.

In the embodiment of the present application, an elastic conductive material is provided at an electrical connection point between the adapter plate and the first circuit board, and an elastic conductive material is provided at an electrical connection point between the adapter plate and the second circuit board. Material.

In the embodiment of the present application, the conductive material is a conductive spring piece, a conductive spring probe, or conductive foam.

The above-mentioned conductive materials have a certain degree of elasticity and can play a good contact and buffering role.

In the embodiment of the present application, screw holes are provided near the edge of the adapter plate, and screw holes are also provided corresponding to the middle frame. The screw holes of the adapter plate are paired with the screw holes of the middle frame. Set it correctly, and set screws to lock in the screw holes to firmly connect the adapter plate to the middle frame.

The connection between the adapter plate and the middle frame is fixed with screws, so that the adapter plate can form a stable connection with the middle frame.

In the embodiment of the present application, when the adapter plate includes a heat sink, the heat sink includes a lower cover and an upper cover connected to the lower cover. A capillary structure is formed, a heat dissipation medium is provided in the capillary structure, and the upper cover plate and the lower cover plate are both made of conductive metal materials.

The adapter board can not only dissipate heat from the heat sink itself, but also realize signal transmission between the second circuit board and the first circuit board. The through-holes covering the large-area openings are covered by the adapter plate to avoid digging small-area openings in the middle frame. The large-area heat sink greatly improves the transmission path of large currents. The heat sink not only serves as a strength carrier for the mid-frame, but also provides a heat dissipation path for large current transmission.

In the embodiment of the present application, the opposite ends of the lower cover are connected to at least one pair of overlapping portions, the overlapping portions are conductive, and each pair of overlapping portions are respectively connected to the first circuit board and the second circuit board. circuit board.

In the embodiment of the present application, the material of the upper cover plate, the lower cover plate and the overlapping portion is copper-steel alloy, copper, or aluminum alloy.

In the embodiment of the present application, except for the area electrically connected to the first circuit board and the second circuit board, other surface areas of the adapter board are covered with an insulating layer.

The insulating layer is provided to prevent unnecessary electrical connections between the conductive heat sink and other electronic components or circuits. The insulation layer is also provided on the hole wall of the screw hole of the adapter plate.

In the embodiment of the present application, the adapter board includes at least two heat sinks arranged in a stack, and an insulation layer is provided between each two adjacent heat sinks to electrically isolate the two adjacent heat sinks.

When two or more signals need to be transmitted between the first circuit board and the second circuit board, the number of heat sinks needs to be increased accordingly, and each heat sink correspondingly transmits one signal. The insulating layer provided between the two heat sinks can be a thermally conductive silicone material, which has bonding strength and an insulating function, so it will not affect heat dissipation.

In the embodiment of the present application, when the adapter board includes a ceramic substrate and a conductive line provided on the ceramic substrate, the adapter board also includes an insulation layer provided on the ceramic substrate and at least covering the conductive line. layer.

In order to avoid unnecessary electrical connections between the conductive lines and other electronic components or circuits, an insulating layer (not shown) is provided on the ceramic substrate to cover the conductive lines. Since the ceramic substrate itself is electrically insulating, the insulating layer can only cover the conductive lines without covering other surface areas of the ceramic substrate.

In the embodiment of the present application, the adapter board further includes a pair of overlapping portions connected to the ceramic substrate. The pair of overlapping portions are respectively connected to opposite ends of the ceramic substrate. The overlapping portions are electrical Made of flexible insulating material, the conductive lines extend from the ceramic substrate to the overlapping portion.

In the embodiment of the present application, at least two independent conductive lines are provided on the ceramic substrate, and at least two connection points are provided on each overlapping portion. The at least two connection points are connected to the at least two conductive lines. One-to-one connection.

At least two mutually independent conductive lines are arranged on the ceramic substrate to realize the transmission of at least two signal networks.

In the embodiment of the present application, the ceramic substrate includes an opposing first surface and a second surface, and each conductive circuit includes a first circuit layer provided on the first surface and a second circuit layer provided on the second surface. layer, the first circuit layer and the second circuit layer penetrate the ceramic substrate to achieve parallel connection.

By arranging conductive lines with a double-layer structure, the resistance of the conductive lines can be reduced.

In the embodiment of the present application, the ceramic substrate is made of aluminum oxide or aluminum nitride. The ceramic substrate itself has high strength, strong mechanical stress, and stable shape. It can not only serve as a carrier for the strength of the middle frame, but also has good thermal conductivity and can provide a heat dissipation path for large current transmission.

A second aspect of the embodiment of the present application provides an electronic device, including the middle frame described in the first aspect of the embodiment of the present application, and a front cover and a back case cooperatively connected with the middle frame.

The third aspect of the embodiment of the present application provides an adapter board, including:

substrate;

The substrate is a conductive heat sink; or

The substrate is made of insulating ceramics, and conductive circuits are provided on the surface of the substrate.

In the embodiment of the present application, when the substrate is a conductive heat sink, the heat sink includes a lower cover and an upper cover connected to the lower cover. A capillary structure is formed, a heat dissipation medium is provided in the capillary structure, and the upper cover plate and the lower cover plate are both made of conductive metal materials.

In the embodiment of the present application, the adapter plate further includes a pair of overlapping portions connected to the lower cover. The pair of overlapping portions are respectively connected to opposite ends of the substrate. The overlapping portions are conductive. of.

In the embodiment of the present application, an electrical connection point is provided on the overlapping portion. Except for the area of the electrical connection point, other surface areas of the adapter plate are covered with an insulating layer.

In the embodiment of the present application, the substrate includes at least two heat sinks arranged in a stack, and an insulating layer is provided between each two adjacent heat sinks to electrically isolate the two adjacent heat sinks.

In the embodiment of the present application, when the substrate is made of insulating ceramics, the adapter board further includes an insulating layer disposed on the substrate and covering at least the conductive circuit.

In the embodiment of the present application, the substrate further includes a pair of overlapping portions connected to the ceramic substrate. The pair of overlapping portions are respectively connected to opposite ends of the substrate. The overlapping portions are insulated. The conductive trace extends from the substrate to the overlapping portion.

In the embodiment of the present application, screw holes penetrating the base plate are provided on the periphery of the base plate.

Description of the drawings

Figure 1 is a schematic diagram of the middle frame structure of the first embodiment of the present application.

FIG. 2 is a schematic diagram of the middle frame in FIG. 1 .

FIG. 3 is a schematic diagram of the adapter board in FIG. 1 .

FIG. 4 is a schematic cross-sectional view taken along section line IV-IV in FIG. 3 .

Figure 5 is a schematic diagram of the middle frame structure of the second embodiment of the present application.

FIG. 6 is a schematic diagram of the adapter board in FIG. 5 .

FIG. 7 is a schematic diagram of an electronic device according to an embodiment of the present application.

Main component symbol description middle frame structure 100, 200
middle frame 10
First circuit board 20
Second circuit board 30
Adapter board 40
Through hole 11
Connecting ribs 14
Heat sink 50
Lower cover 51
Upper cover 53
Overlap 55, 46
Electrical connection points 551
Capillary structure 57
Accommodation slot 552
Pillar 59
Screw hole 511
Insulation 41
Ceramic substrate 44
Conductive lines 42
Electronic devices 300
Front cover 310
Back shell 330

Detailed ways

The embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. Data range values reported in this application shall include end values unless otherwise specified.

In an existing mobile phone structure, in order to realize signal transmission on the middle frame of the mobile phone, a wider or thicker FPC needs to be installed on the middle frame, but this will affect the overall structure of the mobile phone.

This application provides an adapter board, which can be installed in the hollowed-out area of the middle frame to realize signal transmission from the small board to the adapter board, and then from the adapter board to the main board. The strength of the material of the adapter plate is equivalent to that of the middle frame. It will not affect the strength performance of the middle frame, nor will it have any adverse effects on the structure of the entire machine.

Embodiment 1

Referring to FIG. 1 , the middle frame structure 100 of the first embodiment of the present application includes a middle frame 10 and a first circuit board 20 , a second circuit board 30 and an adapter board 40 provided on the middle frame 10 . The middle frame 10 is generally a thin sheet-like structure made of metal. In order to ensure the conductivity and heat dissipation of the middle frame 10 , for example, the material of the middle frame 10 can be aluminum alloy, and some areas of the middle frame 10 can also be made of metal or alloy with better conductivity, such as copper-steel alloy. , the area where the copper-steel alloy is set is the area on the middle frame 10 where other electronic components need to be set to achieve signal transmission. In this embodiment, the first circuit board 20 is the main board, and the second circuit board 30 is a small board, but it is not limited to this.

Referring to FIG. 2 , a through hole 11 penetrating through the middle frame 10 along the thickness direction of the middle frame 10 is formed approximately in the middle of the middle frame 10 . In this embodiment, the through hole 11 is a hole with a rectangular opening. The through hole 11 is located between the first circuit board 20 and the second circuit board 30 . The first circuit board 20 and the second circuit board 30 are located at opposite ends of the through hole 11 . The through hole 11 is equivalent to digging out the middle area of the middle frame 10 , and the middle frame 10 leaves only two narrow connecting ribs 14 on opposite sides of the through hole 11 . Since the opening area of the through hole 11 is large, it will inevitably affect the overall strength of the middle frame 10 . By arranging the adapter plate 40 to overlap the through hole 11 and completely cover the through hole 11 , and the strength of the adapter plate 40 is equivalent to that of the middle frame 10 , the strength of the middle frame 10 can be effectively ensured. Overall strength. To ensure that the adapter plate 40 completely covers the through hole 11 , the area size of the adapter plate 40 is slightly larger than the opening size of the through hole 11 .

The adapter board 40 is overlapped between the first circuit board 20 and the second circuit board 30 to electrically connect the second circuit board 30 and the first circuit board 20 for signal transmission. . In this embodiment, the adapter plate 40 includes a conductive heat sink 50 . Therefore, the adapter board 40 can not only dissipate heat of the heat sink 50 itself, but also realize signal transmission between the second circuit board 30 and the first circuit board 20 .

Please refer to FIGS. 3 and 4 together. The heat sink 50 includes a lower cover 51 and an upper cover 53 connected to the lower cover 51 . The upper cover plate 53 and the lower cover plate 51 can be connected by welding, but are not limited to this. In this embodiment, the projected area size of the upper cover plate 53 is smaller than the projected area size of the lower cover plate 51 , and the upper cover plate 53 partially covers the lower cover plate 51 . The material of the upper cover plate 53 and the lower cover plate 51 is conductive metal or conductive alloy material. For example, the upper cover plate 53 and the lower cover plate 51 are made of copper, copper-steel alloy or aluminum alloy. In order to ensure the conductive effect of the heat sink 50, in some embodiments, the upper cover plate 53 and the lower cover plate 51 are made of copper or copper-steel alloy.

In order to match the shape of the through hole 11 , as shown in FIG. 3 , the lower cover plate 51 is generally rectangular and completely covers the through hole 11 , and the upper cover plate 53 is also rectangular. In order to better realize the connection with the first circuit board 20 and the second circuit board 30 , the adapter board 40 further includes a pair of overlapping portions 55 connected with the lower cover 51 . The pair of overlapping portions 55 Connected to the opposite ends of the lower cover 51 . The overlapping portion 55 is also made of conductive metal or conductive alloy. In this embodiment, the overlapping portion 55 and the lower cover 51 are integrally formed, but are not limited to this.

As shown in FIG. 4 , each overlapping portion 55 is provided with an electrical connection point 551 to be connected to the first circuit board 20 or the second circuit board 30 , and the electrical connection point 551 is connected to the first circuit board 20 and the second circuit board 30 . The electrical connection between the two circuit boards 30 is provided with an elastic conductive material (not shown), such as a conductive spring piece, a conductive spring probe (Pogo Pin), or conductive foam. These conductive materials have a certain degree of elasticity and can function as Good contact and cushioning.

In addition, the surface of the electrical connection point 551 can be gold-plated to better improve the anti-corrosion performance, mechanical performance and electrical performance of the electrical connection point 551 .

As shown in Figure 4, the heat sink 50 is a conventional heat sink 50. A capillary structure 57 is formed between the upper cover plate 53 and the lower cover plate 51, and a heat dissipation medium is provided in the capillary structure 57 (not shown in the figure). ), such as water. In this embodiment, the lower cover 51 has a receiving groove 552, and the upper cover 53 is covered on the receiving groove 552 to form a space between the upper cover 53 and the lower cover 51. A sealed cavity (not shown), the capillary structure 57 is formed on the wall of the sealed cavity. A plurality of hollow pillars 59 are also connected between the capillary structure 57 of the upper cover plate 53 and the capillary structure 57 of the lower cover plate 51 to realize the return flow of the heat dissipation medium.

In this embodiment, the connection between the adapter plate 40 and the middle frame 10 is fixed with screws, so that the adapter plate 40 can form a stable connection with the middle frame 10, but it is not limited to this. As shown in FIG. 3 , a screw hole 511 penetrating the lower cover 51 is provided near the edge of the lower cover 51 , and the lower cover 51 does not cover the screw hole 511 . As shown in FIG. 2 , correspondingly, the middle frame 10 is also provided with screw holes 511 around the periphery of the through hole 11 . The screw holes 511 of the lower cover 51 are paired with the screw holes 511 of the middle frame 10 . For example, the connecting ribs 14 of the middle frame 10 are also provided with screw holes 511, and screws (not shown) are locked in the screw holes 511 to connect the adapter plate 40 to the middle frame 10. Fixed connection. In this embodiment, the screw holes 511 are a plurality of screw holes spaced around the through holes 11 .

As shown in FIG. 4 , in order to avoid unnecessary electrical connections between the conductive heat sink 50 and other electronic components or circuits, the adapter board 40 is not only connected with the first circuit board 20 and the second circuit board 30 The electrically overlapping area, that is, except for the electrical connection point 551, other surface areas of the adapter plate 40 are provided with an insulating layer 41. The insulating layer 41 is also provided on the wall of the screw hole 511 of the lower cover 51 .

The insulating layer 41 can be obtained by oxidizing the adapter plate 40. The walls of the holes including the screw holes 511 in the lower cover plate 51 are also oxidized to form the insulating layer 41, but the overlapping portion 55 is not connected to the first circuit board. No insulation layer 41 is provided at the connection between 20 and the second circuit board 30 . The insulating layer 41 can also be obtained by electrophoresis, electrostatic spraying, etc., so that the surfaces of the upper cover 53 and the lower cover 51 of the adapter plate 40 are The screw holes 511 in 51 form the insulating layer 41 .

When two or more signals need to be transmitted between the first circuit board 20 and the second circuit board 30 , the number of heat sinks 50 needs to be increased accordingly, and each heat sink 50 correspondingly transmits one signal. Specifically: the adapter plate 40 includes at least two heat sinks 50 stacked on the through hole 11 , and a thermally conductive insulation layer is provided between each two adjacent heat sinks 50 to electrically isolate adjacent ones. The two heat sinks are 50. The insulating layer provided between the two heat sinks 50 can be a thermally conductive silicone material, which has bonding strength and an insulating function, so it will not affect heat dissipation.

By covering the through-hole 11 with a large-area opening through the adapter plate 40, local digging of a small-area opening in the middle frame 10 is avoided. The large-area heat sink 50 greatly improves the transmission path of large current. The heat sink 50 can not only serve as a strength carrier for the middle frame 10 but also provide a heat dissipation path for large current transmission.

Embodiment 2

Please refer to Figures 5 and 6 together. The middle frame structure 200 of the second embodiment of the present application is basically the same as the middle frame structure 100 of the first embodiment. It also includes a middle frame 10 with a through hole 11 and a The first circuit board 20, the second circuit board 30 and the adapter plate 40 on the middle frame 10. The adapter plate 40 completely covers the through hole 11. The difference from the first embodiment is that the adapter plate 40 is no longer a heat dissipator. Piece 50 , the adapter board 40 of the second embodiment includes a ceramic substrate 44 and conductive traces 42 provided on the ceramic substrate 44 .

The ceramic substrate 44 itself has high strength, strong mechanical stress, and stable shape. It can not only serve as the strength carrier of the middle frame 10, but also has good thermal conductivity and can provide a heat dissipation path for large current transmission. The ceramic substrate 44 is made of aluminum oxide or aluminum nitride, but is not limited thereto.

In one embodiment, the conductive lines 42 on the ceramic substrate 44 may be made of copper foil bonded directly to the surface of the ceramic substrate 44 at high temperature. The conductive lines 42 can be etched into various patterns as needed, similar to the circuit layer of a printed circuit board. The shapes of the conductive lines 42 in Figures 5 and 6 are only for illustration.

In order to better realize the overlapping connection with the first circuit board 20 and the second circuit board 30 , the adapter board 40 further includes a pair of overlapping portions 46 connected with the ceramic substrate 44 . The pair of overlapping portions 46 Connected to opposite ends of the ceramic substrate 44 , the pair of overlapping portions 46 are provided at opposite ends of the through hole 11 . The pair of overlapping portions 46 can be integrally formed with the ceramic substrate 44, but is not limited thereto. The conductive traces 42 extend from the ceramic substrate 44 to the pair of overlapping portions 46 .

Electrical connection points 551 are provided on the overlapping portion 46, and the conductive lines 42 extend to connect to the electrical connection points 551 on the overlapping portion 46. The electrical connection points 551 on each overlapping portion 46 are electrically connected to the first circuit board 20 or The second circuit board 30. The connection between the electrical connection point 551 and the first circuit board 20 and the second circuit board 30 is provided with an elastic conductive material (not shown), such as a conductive elastic piece, a conductive spring probe (Pogo Pin), or a conductive spring probe. Foam, these conductive materials have a certain degree of elasticity and can provide good contact and buffering.

The number of the conductive lines 42 may be one or two or more independent lines. As shown in Figure 6, two independent conductive lines 42 are provided on the ceramic substrate 44 to realize the transmission of two different signals. Each overlapping portion 46 is provided with two electrical connection points 551. The two electrical connection points 551 are provided on the ceramic substrate 44. Each electrical connection point 551 is connected to the two conductive lines 42 in a one-to-one correspondence. It can be understood that in other embodiments, the number of pairs of overlapping portions 46 can also be increased. Each conductive line 42 corresponds to a pair of overlapping portions 46 and extends to the corresponding pair of overlapping portions 46. Different conductive lines 42 extends to different pairs of overlaps 46 .

As a carrier for signal transmission, the conductive lines 42 can be transmitted on only one layer, or can be transmitted on both layers. The ceramic substrate 44 includes an opposing first surface (not shown) and a second surface (not shown). In some embodiments, each conductive circuit 42 includes a first circuit layer (not shown) disposed on the first surface. (not shown) and a second circuit layer (not shown) disposed on the second surface. The first circuit layer and the second circuit layer penetrate the ceramic substrate 44 to achieve parallel connection. In this way, the resistance of the conductive line 42 can be reduced.

In this embodiment, the connection between the adapter plate 40 and the middle frame 10 is fixed with screws, so that the adapter plate 40 can form a stable connection with the middle frame 10, but it is not limited to this. The connection between the ceramic substrate 44 and the middle frame 10 is fixed with screws. The adapter plate 40 is provided with screw holes 511 near the edge. Correspondingly, the middle frame 10 is also provided with screw holes 511 around the periphery of the through hole 11. Therefore, The screw holes 511 of the adapter plate 40 are aligned with the screw holes 511 of the middle frame 10 , and screws (not shown) are provided to be locked in the screw holes 511 so that the adapter plate 40 Fixedly connected to the middle frame 10 .

It can be understood that in order to avoid unnecessary electrical connections between the conductive lines 42 and other electronic components or circuits, an insulating layer (not shown) is provided on the ceramic substrate 44 to cover the conductive lines 42 . Since the ceramic substrate 44 itself is electrically insulating, the insulating layer may only cover the conductive traces 42 without covering other surface areas of the ceramic substrate 44 . Of course, the area where the adapter board 40 electrically overlaps the first circuit board 20 and the second circuit board 30 , that is, the electrical connection point 551 , does not need to be provided with an insulating layer to avoid shielding the electrical connection point 551 . In this embodiment, the insulating layer may be insulating ink, but is not limited thereto.

In some embodiments, except for the electrical connection points 551 connected to the first circuit board 20 and the second circuit board 30 , the upper and lower parts of the ceramic substrate 44 are opposite to each other. The surfaces are covered with an insulating layer, and an insulating layer can also be provided on the hole wall of the screw hole 511. For example, dry film ink can be used to obtain the insulating layer.

In this embodiment, by arranging the ceramic base 42 and arranging a plurality of mutually independent conductive lines 42 on the ceramic substrate 44, the transmission of various signal networks can be realized, and the ceramic substrate 44 itself has high strength and strong mechanical stress. , the shape is stable, and it can not only serve as a strong carrier for the middle frame 10, but the ceramic substrate 44 also has good thermal conductivity and can provide a heat dissipation path for large current transmission.

Referring to Figure 7, the present application also provides an electronic device 300, including the above-mentioned middle frame structure 100 and a front cover 310 and a rear case 330 connected to the middle frame structure 100. The middle frame structure 100 is located on the front cover. 310 and the rear case 330. The front cover 310, the middle frame structure 100, and the back cover 330 cooperate to form a housing (not shown) of the electronic device 300. The first circuit board 20, the second circuit board 30, and the adapter board 40 are all located inside the housing. In this embodiment, the electronic device 300 is a mobile phone, but it is not limited to this.

It should be noted that the above are only specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Any person familiar with the technical field can easily think of changes or replacements within the technical scope disclosed in the present application. , are all covered by the protection scope of this application; without conflict, the implementation modes and features in the implementation modes of this application can be combined with each other. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims

A middle frame structure is characterized by including:

A middle frame, the middle frame is provided with a through hole;

A first circuit board, arranged on the middle frame;

A second circuit board is provided on the middle frame, and the through hole is located between the first circuit board and the second circuit board;

An adapter plate is provided on the middle frame and covers the through hole,

The adapter board includes a conductive heat sink, and the heat sink is connected between the first circuit board and the second circuit board to electrically connect the second circuit board and the first circuit board. ;or

The adapter board includes a ceramic substrate and conductive lines provided on the ceramic substrate, and the conductive lines are electrically connected to the first circuit board and the second circuit board.
The middle frame structure according to claim 1, characterized in that an elastic conductive material is provided at the electrical connection point between the adapter plate and the first circuit board, and the adapter plate and the second circuit board An elastic conductive material is provided at the electrical connection.
The middle frame structure according to claim 2, wherein the conductive material is a conductive elastic piece, a conductive spring probe, or conductive foam.
The middle frame structure according to any one of claims 1 to 3, characterized in that screw holes are provided near the edge of the adapter plate, and screw holes are also provided corresponding to the middle frame. The screw holes of the board are aligned with the screw holes of the middle frame, and screws are set and locked in the screw holes to firmly connect the adapter plate and the middle frame.
The middle frame structure according to any one of claims 1 to 4, characterized in that when the adapter plate includes a heat sink, the heat sink includes a lower cover and an upper cover connected to the lower cover. A capillary structure is formed between the upper cover plate and the lower cover plate, a heat dissipation medium is provided in the capillary structure, and the upper cover plate and the lower cover plate are both made of conductive metal materials.
The middle frame structure according to claim 5, characterized in that the opposite ends of the lower cover are connected to at least one pair of overlapping parts, the overlapping parts are conductive, and each pair of overlapping parts are respectively connected to the a first circuit board and said second circuit board.
The middle frame structure according to claim 6, wherein the upper cover plate, the lower cover plate and the overlapping portion are made of copper-steel alloy, copper, or aluminum alloy.
The middle frame structure according to any one of claims 5 to 7, characterized in that, except for the area electrically connected to the first circuit board and the second circuit board, other surfaces of the adapter board Areas are covered with insulation.
The middle frame structure according to any one of claims 5 to 7, characterized in that the adapter plate includes at least two heat sinks arranged in a stack, and an insulation layer is provided between each two adjacent heat sinks. To electrically isolate two adjacent heat sinks.
The middle frame structure according to any one of claims 1 to 4, characterized in that when the adapter plate includes a ceramic substrate and a conductive circuit provided on the ceramic substrate, the adapter plate further includes a An insulating layer on the ceramic substrate and at least covering the conductive lines.
The middle frame structure according to claim 10, wherein the adapter plate further includes a pair of overlapping portions connected to the ceramic substrate, and the pair of overlapping portions are respectively connected to opposite two sides of the ceramic substrate. end, the overlapping portion is made of electrically insulating material, and the conductive circuit extends from the ceramic substrate to the overlapping portion.
The middle frame structure according to claim 11, characterized in that at least two mutually independent conductive lines are provided on the ceramic substrate, and at least two connection points are provided on each overlapping portion, and the at least two connection points The points are connected to the at least two conductive lines in one-to-one correspondence.
The middle frame structure according to any one of claims 10 to 12, wherein the ceramic substrate includes an opposing first surface and a second surface, and each conductive line includes a third surface disposed on the first surface. A circuit layer and a second circuit layer provided on the second surface. The first circuit layer and the second circuit layer penetrate the ceramic substrate to achieve parallel connection.
The middle frame structure according to any one of claims 10 to 13, wherein the ceramic substrate is made of aluminum oxide or aluminum nitride.
An electronic device, characterized by comprising the middle frame according to any one of claims 1 to 14, and a front cover and a back case cooperatively connected with the middle frame.
An adapter board, characterized by including:

substrate;

The substrate is a conductive heat sink; or

The substrate is made of insulating ceramics, and conductive circuits are provided on the surface of the substrate.
The adapter board according to claim 16, characterized in that when the substrate is a conductive heat sink, the heat sink includes a lower cover and an upper cover connected to the lower cover, and the upper cover A capillary structure is formed between the plate and the lower cover, and a heat dissipation medium is provided in the capillary structure. Both the upper cover and the lower cover are made of conductive metal materials.
The adapter board according to claim 17, wherein the adapter board further includes a pair of overlapping portions connected to the lower cover, the pair of overlapping portions being connected to opposite sides of the base plate respectively. end, the overlapping portion is conductive.
The adapter board according to claim 18, wherein the overlapping portion is provided with an electrical connection point, and except for the area of the electrical connection point, other surface areas of the adapter board are covered with an insulating layer. .
The adapter board according to any one of claims 17 to 19, characterized in that the substrate includes at least two heat sinks arranged in a stack, and an insulating layer is provided between each two adjacent heat sinks to electrically Protective isolation between two adjacent heat sinks.
The adapter board according to claim 16, wherein when the substrate is made of insulating ceramics, the adapter board further includes an insulating layer disposed on the substrate and covering at least the conductive lines.
The adapter board according to claim 21, wherein the substrate further includes a pair of overlapping portions connected to the ceramic substrate, and the pair of overlapping portions are respectively connected to opposite ends of the substrate, so The overlapping portion is insulated, and the conductive lines extend from the substrate to the overlapping portion.
The adapter board according to claim 21, wherein screw holes penetrating the base plate are provided on the periphery of the base plate.