WO2023226661A1

WO2023226661A1 - Apparatus for mounting electronic device to photovoltaic module, electronic module, and photovoltaic module

Info

Publication number: WO2023226661A1
Application number: PCT/CN2023/090303
Authority: WO
Inventors: 谭显伟; 何晖; 刘振阳; 吕俊
Original assignee: 隆基乐叶光伏科技有限公司
Priority date: 2022-05-26
Filing date: 2023-04-24
Publication date: 2023-11-30

Abstract

Disclosed in the present application are an apparatus for mounting an electronic device to a photovoltaic module, an electronic module and a photovoltaic module. The apparatus for mounting the electronic device to the photovoltaic module comprises: a mounting plate, used for mounting an electronic device onto a module back plate of the photovoltaic module; and a connecting mechanism, being at least arranged between the mounting plate and the electronic device so as to keep the electronic device in different mounting states, the mounting states at least comprising a first mounting state and a second mounting state. In the first mounting state, the electronic device is basically attached to the mounting plate, and in the second mounting state, a heat dissipation gap is formed between the electronic device and the mounting plate. By means of integrated pre-mounting during delivery, the costs of independent packaging and transportation are reduced. In addition, the requirement of heat dissipation of the electronic device can be satisfied.

Description

Devices, electronic modules and photovoltaic modules for mounting electronic equipment to photovoltaic modules

Cross-references to related applications

This application is required to be submitted to the China Patent Office on May 26, 2022. The Chinese patent application with the application number 202210590564. A Chinese patent application with the application number 202210911059.0 and the name "Device, electronic module and photovoltaic module for mounting electronic equipment to photovoltaic modules" was submitted to the China Patent Office on July 29, 2022. Patent Office, application number 202210908580.9, Chinese patent application titled "Device, electronic module and photovoltaic module for mounting electronic equipment to photovoltaic modules", and submitted to the China Patent Office on July 29, 2022, application number 202221998968.4, the priority of the Chinese patent application entitled "Device, electronic module and photovoltaic module for mounting electronic equipment to photovoltaic modules", the entire content of which is incorporated by reference in this application.

Technical field

The present disclosure relates to the field of photovoltaic technology, and in particular, to an apparatus for mounting electronic equipment to a photovoltaic module, an electronic module, and a photovoltaic module.

Background technique

In a photovoltaic power generation system, multiple electronic devices are involved, such as the installation of multiple electronic devices such as smart photovoltaic optimizers, inverters, and converters. Taking the photovoltaic optimizer as an example, it has the functions of optimization, voltage limiting, shutdown, and monitoring, which can increase power generation, improve safety, and reduce operation and maintenance costs.

In related technology, electronic equipment can be installed on the aluminum profile of the module backplane. The installation method requires special T-bolts to match it. You can also choose to install the electronic equipment on the module frame. Before installation, you need to first Install bolts and nuts. The length of the bolts must meet the installation requirements, and installation holes need to be reserved on the component frame. The combined bolts and nuts need to be purchased from a third party, and the length must meet the frame requirements; electronic equipment can also pass through a specially made frame This method requires you to install the frame mounting parts and electronic equipment first, and then complete the overall assembly of subsequent components.

All of the above methods require on-site mechanical installation, which is labor-intensive. method, it is also necessary to leave a distance between the roof and the module frame to ensure the heat dissipation of electronic equipment; the above-mentioned photovoltaic modules and electronic equipment are independent products and need to be packaged and shipped separately, taking up space and increasing corresponding freight and packaging costs; existing The installation solution is inconvenient and cannot achieve pre-installation functions. It requires on-site installation. During on-site installation, sufficient installation space and installation conditions must be available on-site to ensure the smooth installation of electronic equipment. When the on-site space is narrow, , electronic equipment cannot even be installed on photovoltaic modules, which reduces installation efficiency and increases the risk of irregular installation; in addition, electronic equipment itself generates heat during work, and the existing installation method is too close to the module backplane, which will increase The functional performance and risk factors of photovoltaic modules and electronic equipment themselves reduce the service life.

Therefore, there is an urgent need to improve the existing installation methods to adapt to different functional requirements in packaging and working conditions.

Contents of the invention

The purpose of this disclosure is to provide a device, an electronic module and a photovoltaic module for installing electronic equipment to a photovoltaic module, so as to solve the problem in the prior art that electronic equipment and photovoltaic modules need to be packaged and transported separately, resulting in high costs. , as well as the problem of poor heat dissipation under working conditions, and also solves the problem of low installation and disassembly efficiency caused by complex installation in the existing solution, which requires additional nailing or other structures.

According to a first aspect of the present disclosure, an apparatus for mounting electronic equipment to a photovoltaic module is provided, comprising:

A mounting plate for mounting electronic equipment to the module backplane of the photovoltaic module;

A connection mechanism, the connection mechanism is at least disposed between the mounting plate and the electronic device to maintain the electronic device in different installation states;

The installation state at least includes a first installation state and a second installation state. In the first installation state, the electronic device and the mounting plate are basically arranged in close contact; in the second installation state, the electronic device A heat dissipation gap is formed between the mounting plate and the mounting plate.

Through the above technical solution, in the device for installing electronic equipment to photovoltaic modules provided by the present disclosure, through integrated pre-assembly at the factory, the existing thickness space of the photovoltaic module is used to install the electronic equipment, which can reduce the number of electronic equipment. The cost of separate packaging and transportation; through the structural design of the connecting mechanism, the electronic equipment can be switched between the first installation state and the second installation state. In the first installation state, the electronic equipment and the installation board can be reduced as much as possible The distance between them can meet the requirements of low thickness and small space occupation when leaving the factory; In the second installation state, a heat dissipation gap is formed between the electronic device and the mounting board, which meets the heat dissipation requirements of the component backplane and the electronic device, while also ensuring the stability of the connection between the electronic device and the mounting board. In addition, the installation structure provided by the present disclosure is easy to operate, reducing the risk of irregularities. The installation method does not require excessive operations, no additional nailing or other structures are required, and the efficiency of installation and disassembly is improved.

Optionally, the connection mechanism includes a first retaining member and a plurality of second retaining members; wherein,

The first holder is disposed on one of the electronic device and the mounting plate, and the plurality of second holders is disposed on the other one of the electronic device and the mounting plate. The first retaining member is selected from the plurality of second retaining members to cooperate with different second retaining members to maintain the electronic device in different installation states.

Through the above technical solution, in the device for installing electronic equipment to photovoltaic modules provided by the present disclosure, through integrated pre-assembly at the factory, the existing thickness space of the photovoltaic module is used to install the electronic equipment, which can reduce the number of electronic equipment. The cost of separate packaging and transportation; through the structural design of the first holder and the second holder, the electronic device can be switched between the first installation state and the second installation state. In the first installation state, it can be as secure as possible Reducing the distance between the electronic equipment and the mounting board can meet the requirements of low thickness and small space occupation when leaving the factory; in the second installation state, a heat dissipation gap is formed between the electronic equipment and the mounting board to meet the heat dissipation requirements of the component backplane and the electronic equipment. requirements, while also ensuring the stability of the connection between the electronic device and the mounting plate. In addition, the installation structure provided by the present disclosure is easy to operate, reducing the risk of irregularities. The installation method does not require excessive operations, no additional nailing or other structures are required, and the efficiency of installation and disassembly is improved.

Optionally, in the second installation state relative to the first installation state, the holding position of the electronic device only changes in the thickness direction; or

In the second installation state, relative to the first installation state, the holding position of the electronic device changes in both the thickness direction and the up-down direction.

Optionally, the first retaining member is a first limiting member, and there are two second retaining members, which are respectively a first positioning member and a second positioning member that cooperate with the first limiting member,

In the first installation state, the first positioning member cooperates with the first limiting member, and in the thickness direction of the electronic device, the mounting plate and the electronic device are basically arranged in contact with each other. ;

In the second installation state, the second positioning member cooperates with the first limiting member, and in the thickness direction of the electronic device, there is a gap between the mounting plate and the electronic device. Set up and form the heat dissipation gap at intervals;

Preferably, the first positioning member and the second positioning member are located on the same straight line along the up and down direction, and in the thickness direction, the second positioning member is used to cooperate with the positioning end of the first limiting member. The positioning end of the first positioning member is higher than the positioning end of the first positioning member for cooperating with the first limiting member;

Preferably, the first limiting member is a limiting hole, the first positioning member and the second positioning member are positioning hooks, and the positioning end is a combination of the positioning hook and the limiting hole. Location.

Optionally, the first retaining member is a first positioning member, and the second retaining member is two and are respectively a first limiting member and a second limiting member that cooperate with the first positioning member,

In the second installation state, the first positioning member cooperates with the second limiting member, and in the thickness direction of the electronic device, the mounting plate is spaced apart from the electronic device and forms a The heat dissipation gap;

Preferably, the first limiting member and the second limiting member are spaced apart in the thickness direction of the electronic device.

Optionally, the first limiting member and the second limiting member are arranged staggered in both the thickness direction and the up-down direction.

Optionally, the first retaining member is configured as a buckle or a latch, and the second retaining member is configured as a snap hole that matches the buckle, or a slot that matches the latch.

Optionally, the device further includes a slide groove opened on the electronic device, and a slide support provided on the mounting plate; the slide support is in sliding cooperation with the slide groove, and is formed by the Guide when the first installation state is switched to the second installation state, and used to support the electronic device when in the second installation state;

Preferably, the slide support and the slide groove extend in the up and down direction and respectively have slopes extending in the up and down direction, and the end of the slide groove is formed with an opening for the slide support to slide in;

Preferably, the starting end of the slope corresponds to the position of the first limiting member or the first positioning member, so that in the first installation state, the electronic device is in contact with the mounting plate. combined; the highest end of the slope and the second limiting member or the second positioning member The positions are corresponding to each other, so that the slide support supports the lifted electronic device in the second installation state;

Preferably, the height at which the electronic device is lifted is the distance between the first limiting member and the second limiting member in the thickness direction, or the distance between the positioning end of the second positioning member and the first positioning member. The height difference of the positioning end of the positioning member, and the distance or the height difference is equal to the height of the inclined surface in the thickness direction;

Preferably, the slide support and the slide groove are a set, the slide support is provided at the middle position of the mounting plate, and the slide groove is provided at the middle position of the electronic device; or

The slide support and the chute are two groups, the two sets of slide supports are symmetrically arranged on both sides of the mounting plate, and the two sets of chute are symmetrically arranged on both sides of the electronic device.

Optionally, a limiting support is provided at the bottom of the mounting plate, and in the second installation state, the limiting support is used to abut against the bottom surface of the electronic device.

Optionally, the device further includes a third positioning member provided on the mounting plate and a third limiting member provided on the electronic device. In the second installation state, the third positioning member The component is cooperatively connected with the third limiting component.

Optionally, one of the first holding parts and the corresponding plurality of second holding parts constitute a set of holding assemblies, and at least one set of holding parts are symmetrically arranged on the left and right sides of the electronic device and the mounting plate respectively. components, and the number of the holding components on both sides is the same.

Optionally, one of the first retaining member and the second retaining member is a buckle and the other is a limiting hole, and the device further includes a mounting plate disposed between the electronic device and the mounting plate. An elastic support member, which is integrated on the buckle or provided on the mounting plate;

Preferably, the buckle has a fixed end connected to the mounting plate and a positioning end used to engage with the limiting hole, and the buckle is located between the fixed end and the positioning end. The part between is provided with an opening, one end of the elastic support member is connected to the opening, and the other end is a free end and extends obliquely in the direction toward the positioning end;

Preferably, the electronic device is provided with an escape portion at a position corresponding to the elastic support member, and in the first installation state, the free end of the elastic support member acts on the position of the escape portion. .

Optionally, one of the first retaining member and the second retaining member is a latch, and the other is a limiting hole, and the device further includes a driving mechanism connected to the latch, and the driving mechanism The driving mechanism is used to drive the latch to move toward or away from the limiting hole to cooperate or separate the first retaining member and the second retaining member;

Preferably, the mounting plate is provided with a receiving frame, the plug is installed in the receiving frame, and the receiving frame can be extended or retracted, and the driving mechanism includes an operating piece connected to the plug and one end. The elastic member is pressed against the inner wall of the receiving frame, and the other end is pressed against the latch. A slot is formed on the receiving frame, and the operating member is close to or away from the limiting hole along the slot. directional movement to unlock the first installation state and the second installation state;

Preferably, a plurality of the latch pins share the same operating member.

The connection mechanism includes:

A folding mechanism, the folding mechanism is connected between the electronic device and the mounting plate;

The electronic device can move relative to the mounting plate along a folding or unfolding direction of the folding mechanism to switch the electronic device between a first installation state and a plurality of second installation states.

Optionally, the mounting plate and the electronic device are arranged oppositely, the folding mechanism is folded or unfolded along the thickness direction of the electronic device, the folding mechanism has a plurality of unfolding positions, and the electronic device and the The heat dissipation gaps created between the mounting plates vary in size.

Through the above technical solution, in the device for installing electronic equipment to photovoltaic modules provided by the present disclosure, through integrated pre-assembly at the factory, the existing thickness space of the photovoltaic module is used to install the electronic equipment, which can reduce the number of electronic equipment. The cost of separate packaging and transportation; through the structural design of the folding mechanism, the electronic equipment can be switched between the first installation state and the second installation state. In the first installation state, the gap between the electronic equipment and the mounting board can be reduced as much as possible. The distance between them can meet the requirements of low thickness and small space occupation when leaving the factory; in the second installation state, a heat dissipation gap is formed between the electronic equipment and the mounting plate, which meets the heat dissipation requirements of the component backplane and electronic equipment, and at the same time ensures that the electronic equipment Stability of the connection between the device and the mounting plate. In addition, the electronic device only needs to be moved in a predetermined direction to quickly switch between the first installation state and the second installation state. The installation structure provided by the present disclosure is easy to operate, reduces the risk of irregularities, and the installation method does not require excessive operations. , without the need for additional nailing or adding other structures, improving the efficiency of installation and disassembly.

Optionally, the folding mechanism is configured as a folding bracket composed of a hinged rod, and the folding bracket is self-locking in both the stowed position and multiple unfolded positions.

Optionally, the folding bracket includes a first fixing rod fixed on the mounting plate, A second fixed rod and a moving rod fixed on the electronic device. The first fixed rod and the second fixed rod are arranged in the same direction. The two ends of the moving rod are respectively connected with the first fixed rod and the second fixed rod. The ends of the second fixing rod are hinged to form a Z-shaped folding bracket.

Optionally, the first fixed rod, the moving rod and the second fixed rod have the same size in the thickness direction, and the hinge points of the first fixed rod and the moving rod, the second fixed rod The hinge points of the rod and the movement bar are respectively located on opposite sides of the movement bar,

In the first installation state, the first fixed rod, the moving rod and the second fixed rod overlap, and the distance between the mounting plate and the electronic device is Dimensions in thickness direction;

In the second installation state, the moving rod forms an angle with the first fixed rod and the second fixed rod respectively, and the heat dissipation gap between the mounting plate and the electronic device depends on the clip. horn.

Optionally, the number of the folding mechanisms is at least two, and they are spaced between the electronic device and the mounting plate along the length direction and/or the width direction of the electronic device.

Optionally, the folding mechanism is configured as a flexible support member having openings at both ends and a flexible cavity in the middle. The openings at both ends are respectively connected to the mounting plate and the electronic device, and the flexible support member has openings at both ends and a flexible cavity in the middle. The cavity is formed by at least two folded sheets that are foldably connected in sequence, and the folded sheets are annular.

Optionally, along the unfolding direction of the flexible support member, the inner diameters of the plurality of folding pieces are successively reduced. In the first installation state, the plurality of folding pieces are nested with each other, and the mounting plate and The distance between the electronic devices is the width of the folded piece with the largest inner diameter;

In the second installation state, at least one of the folding pieces is unfolded, and the heat dissipation gap between the mounting plate and the electronic device depends on the number of unfolding folding pieces.

Optionally, the flexible support member is provided with a plurality of heat dissipation holes at intervals.

Optionally, the device further includes an elastic support member disposed between the electronic device and the mounting plate; in the first installation state, the elastic support member is compressed so that the mounting plate It basically fits the electronic device; in the second installation state, the elastic support member returns to its original shape to support the electronic device.

The connection mechanism includes a guide part and a retainer that is cooperatively connected with the guide part; wherein,

The guide portion is provided on one of the electronic device and the mounting board, so The holder is provided on the other one of the electronic device and the mounting plate;

The electronic device is movable relative to the mounting plate along an extension direction of the guide portion to switch the electronic device between a first installation state and a plurality of second installation states.

Optionally, the guide portion includes at least a first section, a second section and a lifting section located between the first section and the second section,

In the first installation state, the retaining member is located in the first section, and the mounting plate and the electronic device are basically arranged in contact with each other in the thickness direction of the electronic device;

The electronic device moves, the retaining member enters the second section through the lifting section, and switches from the first installation state to the second installation state;

In the second installation state, the retaining member is located in the second section, and the mounting plate is spaced apart from the electronic device in the thickness direction of the electronic device to form the heat dissipation gap.

Through the above technical solution, in the device for installing electronic equipment to photovoltaic modules provided by the present disclosure, through integrated pre-assembly at the factory, the existing thickness space of the photovoltaic module is used to install the electronic equipment, which can reduce the number of electronic equipment. The cost of separate packaging and transportation; through the structural design of the guide part and the holder, the electronic equipment can be switched between the first installation state and the second installation state. In the first installation state, the electronic equipment and the The distance between the mounting boards can meet the requirements of low thickness and small space occupation when leaving the factory; in the second installation state, a heat dissipation gap is formed between the electronic equipment and the mounting boards to meet the heat dissipation requirements of the component backplane and electronic equipment, while also It can ensure the stability of the connection between electronic equipment and mounting board. In addition, the electronic device only needs to be moved in a predetermined direction to switch between the first installation state and the second installation state. The installation structure provided by the present disclosure is easy to operate and reduces the risk of irregularities. The installation method does not require excessive operations. No additional nailing or other structures are required, which improves installation and disassembly efficiency.

Optionally, the first section and the second section are arranged in parallel and staggered in the up-down direction and the thickness direction of the electronic device, and one end of the lifting section is connected to the end of the first section , the other end of the lifting section is connected to the end of the second section.

Optionally, there are multiple second sections arranged in parallel, there are multiple lifting sections, one end of the lifting sections is connected to the same first section, and the other end is connected to a different second section, and the retaining member By selecting corresponding lifting sections to position and cooperate with different second sections, the sizes of the heat dissipation gaps formed between the electronic equipment and the mounting board are different.

Optionally, there are multiple second sections arranged in parallel and spaced apart in the up and down direction, there are multiple lifting sections, and the two adjacent sections between the first section and the second section are The second sections are all connected through the lifting section, the retaining member is selected to position and cooperate with the different second sections through the corresponding lifting section, and a heat dissipation gap is formed between the electronic device and the mounting plate. Sizes vary.

Optionally, multiple second sections are arranged in parallel, and multiple second sections are connected through connecting sections. One end of the lifting section is connected to the first section, and the other end of the lifting section is connected to The connecting section and the retaining member are selectively positioned and matched with different second sections through the lifting section and the connecting section, and the sizes of the heat dissipation gaps formed between the electronic equipment and the mounting plate are different.

Optionally, the retaining member includes an upright column and a latching protrusion. One end of the upright column is fixedly connected to the mounting plate, and the other end is provided with the latching protrusion, and the latching protrusion is arranged toward the middle of the installation plate.

Optionally, the latching protrusion includes a fitting portion that can slide back and forth in the guide portion and a limiting portion that prevents the latching protrusion from protruding from the guide portion, and the fitting portion is configured along a line away from the upright. A tapered structure with gradually increasing axis diameter.

Optionally, the guide portion is provided on two opposite side walls of the electronic device, the holders are provided on the mounting plate and are arranged oppositely, and the distance between the oppositely arranged holders is the same as the distance between the oppositely arranged sidewalls of the electronic device. Adapt to the installation width of the electronic equipment described above.

Optionally, the guide part is a slide groove, and the retaining member is a latching structure that slides with the slide groove.

Optionally, the device further includes an elastic support member disposed between the electronic device and the mounting plate, the elastic support member being integrated on the retaining member or disposed on the mounting plate.

The connection mechanism includes a chute and a slide block that slides with the chute, and at least one of the chute and the slide block is multiple;

The chute is provided on one of the electronic equipment and the mounting plate, and the slider is provided on the other of the electronic equipment and the installation plate; the slider is selected with different The chute cooperates to maintain the electronic device in a plurality of installed states.

Through the above technical solutions, the present disclosure provides a method for installing electronic equipment to photovoltaic In the installation of modules, through integrated pre-assembly at the factory, the existing thickness space of photovoltaic modules is used to install electronic equipment, which can reduce the cost of separate packaging and transportation of electronic equipment; through the structural design of the slider and chute, The electronic equipment can be switched between the first installation state and the second installation state. In the first installation state, the distance between the electronic equipment and the installation board can be reduced as much as possible, which can meet the factory requirements of low thickness and small space occupation. ; In the second installation state, a heat dissipation gap is formed between the electronic device and the mounting board, which meets the heat dissipation requirements of the component backplane and the electronic device, while also ensuring the stability of the connection between the electronic device and the mounting board. In addition, the electronic device only needs to be moved in a predetermined direction to switch between the first installation state and the second installation state. The installation structure provided by the present disclosure is easy to operate and reduces the risk of irregularities. The installation method does not require excessive operations. No additional nailing or other structures are required, which improves installation and disassembly efficiency.

Optionally, the electronic device moves along the extension direction of the chute relative to the mounting plate, and the slider slides into the chute to realize the connection between the electronic device and the mounting plate, The slide block slides out of the chute to switch between the plurality of installation states.

Optionally, both the slide groove and the slide block extend in the up and down direction, there is at least one slide block, there are a plurality of slide grooves and they are arranged in parallel along the thickness direction, and the second installation state is relative to the In the first installation state, the position of the electronic device only changes in the thickness direction.

Optionally, the chute includes a first chute and a second chute, and the slide block includes a first slide block,

In the first installation state, the first slider is located in the first chute, and in the thickness direction of the electronic device, the mounting plate and the electronic device are basically arranged in close contact;

The electronic device moves, the first slider slides out of the first chute, slides into the second chute, and switches from the first installation state to the second installation state;

In the second installation state, the first slider is located in the second slide groove, and the mounting plate is spaced apart from the electronic device in the thickness direction of the electronic device and forms the heat dissipation gap.

Optionally, the slider also includes a second slider,

In the first installation state, the first slider is located in the first chute, and the second slider is located in the second chute. In the thickness direction of the electronic device, the The mounting plate and the electronic device are basically arranged to fit together;

The electronic device moves, the first slider and the second slider slide out of the first chute and the second chute at the same time, and the first slider slides into the second A chute that switches from the first installation state to the second installation state;

In the second installation state, the first slider is located in the second slider, and the first slider and the second slider are free. In the thickness direction of the electronic device, the The mounting plate is spaced apart from the electronic device and forms the heat dissipation gap.

Optionally, the chute further includes at least one third chute, and the slider selects a corresponding number of chute to connect, and the size of the heat dissipation gap between the mounting plate and the electronic device is different.

Optionally, along the extension direction of the chute and the slide block, one end of the chute is provided with an opening for the slide block to slide in, and the other end is provided with an opening to prevent the slide block from sliding out of the chute. The plugging part that slides out.

Optionally, along the extending direction of the slide groove and the slide block, the sizes of the slide groove and the slide block gradually decrease or gradually increase.

Optionally, the slider has a first side connected to the electronic device and a second side opposite to the first side, and in the thickness direction, the size of the second side is larger than the The size of the first side, the size of the slot opening of the chute is smaller than the size of the bottom of the chute.

Optionally, the slide blocks are respectively provided on two opposite side walls of the electronic device, two oppositely arranged vertical boards are fixed on the mounting plate, and the chute is opened inside the vertical boards. on the side, and the distance between the two vertical boards is adapted to the installation width of the electronic equipment.

Optionally, the cross section of the slide block is configured as a trapezoid or a sector, and the shape of the slide groove is adapted to the slide block.

Optionally, the device further includes a back-mounting plate that can be inserted into and fixed in a slot provided on the back of the electronic device so that the electronic device is positioned and maintained in the installed state;

The back hanging plate is provided with an external hanging hole, and the electronic device is installed on the photovoltaic module frame through the external hanging hole.

According to a second aspect of the present disclosure, an electronic module is also provided, including an electronic device and the above-mentioned device for mounting the electronic device to a photovoltaic component.

According to a third aspect of the present disclosure, a photovoltaic module is also provided, including a module backplane, The photovoltaic module also includes the above-mentioned electronic module.

Other features and advantages of the present disclosure will be described in detail in the detailed description that follows.

Description of the drawings

In order to more clearly explain the embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description These are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without exerting creative efforts.

Figure 1 is a schematic diagram of a photovoltaic module according to an embodiment of the present disclosure.

Figure 2 is a schematic diagram of a photovoltaic module according to another embodiment of the present disclosure.

3 to 10 are schematic structural diagrams of an apparatus for mounting electronic equipment to a photovoltaic module according to a first exemplary embodiment of the present disclosure.

11 to 18 are schematic structural diagrams of an apparatus for mounting electronic equipment to a photovoltaic module according to a second exemplary embodiment of the present disclosure.

19 to 23 are schematic structural diagrams of an apparatus for mounting electronic equipment to a photovoltaic module according to a third exemplary embodiment of the present disclosure.

24 to 28 are schematic structural diagrams of slide supports and slide grooves in a device for mounting electronic equipment to photovoltaic modules according to an exemplary embodiment of the present disclosure.

29 to 34 are schematic structural diagrams related to driving buckle movement in a device for mounting electronic equipment to photovoltaic modules according to an exemplary embodiment of the present disclosure.

35 to 41 are schematic structural diagrams of elastic supports in a device for mounting electronic equipment to photovoltaic modules according to an exemplary embodiment of the present disclosure.

42 is a schematic structural diagram of a device for installing electronic equipment to photovoltaic modules in a first installation state according to an embodiment of the present disclosure.

43 is a schematic structural diagram of a device for installing electronic equipment to photovoltaic modules in a second installation state according to an embodiment of the present disclosure.

44 is a schematic structural diagram of a device for mounting electronic equipment to a photovoltaic module in a second mounting state from another perspective according to an embodiment of the present disclosure.

Figure 45 is a schematic diagram of a second folding bracket according to an embodiment of the present disclosure.

Figure 46 is a schematic diagram of a third folding bracket according to an embodiment of the present disclosure.

Figure 47 is a diagram for mounting electronic equipment to a photovoltaic array according to one embodiment of the present disclosure. Structural diagram of the first installation state of the device.

48 is a schematic structural diagram of a second installation state of a device for installing electronic equipment to a photovoltaic module according to an embodiment of the present disclosure.

FIG. 49 is a schematic structural diagram of another situation of a first installation state of a device for installing electronic equipment to a photovoltaic module according to an embodiment of the present disclosure.

50 is a schematic structural diagram of a first installation state of a device for installing electronic equipment to a photovoltaic module according to an embodiment of the present disclosure.

51 is a schematic structural diagram of a second installation state of a device for installing electronic equipment to a photovoltaic module according to an embodiment of the present disclosure.

52 is a schematic structural diagram of a second installation state of a device for installing electronic equipment to a photovoltaic module according to an embodiment of the present disclosure from another perspective.

Figure 53 is a schematic structural diagram of a first installation state of a device for installing electronic equipment to a photovoltaic module according to an embodiment of the present disclosure.

Figure 54 is a schematic structural diagram of a device for installing electronic equipment to a photovoltaic module in a second installation state according to an embodiment of the present disclosure.

55 is a schematic structural diagram of a second installation state of a device for installing electronic equipment to a photovoltaic module according to an embodiment of the present disclosure from another perspective.

Figure 56 is a schematic diagram of an electronic device according to an embodiment of the present disclosure.

Figure 57 is a side view of an electronic device according to an embodiment of the present disclosure.

Figure 58 is a side view of an electronic device according to an embodiment of the present disclosure.

Figure 59 is a side view of an electronic device according to an embodiment of the present disclosure.

Figure 60 is a schematic diagram of a mounting plate according to an embodiment of the present disclosure.

Figure 61 is a schematic diagram of a holder according to an embodiment of the present disclosure.

62 is a schematic structural diagram of a first installation state of a device for installing electronic equipment to a photovoltaic module according to an embodiment of the present disclosure.

63 is a schematic structural diagram of a switching state of a device for mounting electronic equipment to a photovoltaic module according to an embodiment of the present disclosure.

64 is a schematic structural diagram of a second installation state of a device for installing electronic equipment to a photovoltaic module according to the first embodiment of the present disclosure.

65 is a schematic structural diagram of a first installation state of a device for installing electronic equipment to a photovoltaic module according to an embodiment of the present disclosure.

Figure 66 is a diagram for mounting electronic equipment to a photovoltaic array according to one embodiment of the present disclosure. Structural diagram of the second installation state of the device.

Figure 67 is a schematic structural diagram of a first installation state of a device for installing electronic equipment to a photovoltaic module according to an embodiment of the present disclosure.

Figure 68 is a schematic structural diagram of a device for installing electronic equipment to a photovoltaic module in a second installation state according to an embodiment of the present disclosure.

Figure 69 is a schematic diagram of an electronic device according to an embodiment of the present disclosure.

70 is a schematic diagram of a mounting plate in an apparatus for mounting electronic equipment to a photovoltaic module according to an embodiment of the present disclosure.

71 is a schematic diagram of a mounting plate in an apparatus for mounting electronic equipment to a photovoltaic module according to an embodiment of the present disclosure.

72 is a schematic diagram of a mounting plate in an apparatus for mounting electronic equipment to a photovoltaic module according to an embodiment of the present disclosure.

73 to 75 are structural schematic diagrams related to a third installation state of a device for installing electronic equipment to photovoltaic modules according to an exemplary embodiment of the present disclosure.

Explanation of reference signs

1-Electronic equipment; 101-Rear housing; 102-Crimping cover; 103-Front cover; 1101, 1102, 1103, 1104, 1105-First limiter; 11-Guide part; 111-First section ; 112-second section; 113-lift section; 114-connection section; 1201, 1203, 1204, 1205-second limiter; 1301, 1302-third limiter; 14-slot; 15-fourth Limiting member; 16-avoidance part; 170-sliding block; 171-first sliding block; 172-second sliding block; 2-mounting plate; 210-accommodating frame; 211-operating part; 212-elastic part; 2101, 2102, 2103-first positioning piece; 2202, 2205-second positioning piece; 2104-buckle, 2105-latch; 23-limiting support; 2401, 2402-third positioning piece; 25-retainer; 251-column ; 252-Latching protrusion; 2521-limiting part; 2522-fitting part; 26-limiting support; 27-elastic support; 28-vertical plate; 29-chute; 291-first chute; 292-second Chute; 293-third chute; 294-blocking part; 31-chute; 32-slide support; 33-elastic support; 4-back hanging plate; 41-top end; 5-component back plate; 51-Photovoltaic module frame; 6-cable; 71-wire box; 72-line card; 8-folding mechanism; 81-first fixed rod; 82-second fixed rod; 83-movement rod; 84-folding piece; 85-Heat dissipation hole;

Specific embodiments

In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the following will summarize The technical solutions in the embodiments of the present application are clearly and completely described with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this application.

The terms "first" and "second" features in the description and claims of this application may include one or more of these features, either explicitly or implicitly. In the description of this application, unless otherwise stated, "plurality" means two or more. In addition, "and/or" in the description and claims indicates at least one of the connected objects, and the character "/" generally indicates that the related objects are in an "or" relationship.

In the description of this application, it needs to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " "Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inside", "Outside", "Clockwise", "Counterclockwise", "Axis", The orientation or positional relationship indicated by "radial direction", "circumferential direction", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply the device or element to which it refers. Must have a specific orientation, be constructed and operate in a specific orientation and therefore should not be construed as a limitation on this application.

In this disclosure, unless otherwise specified, the directional words used such as “upper” and “lower” are defined with respect to the direction shown in FIG. 22 . "Left" and "right" are defined with respect to the directions shown in Figure 19, and the terms "first", "second" and other words used are used to distinguish different components and do not have sequence or importance. Furthermore, in the following description, when referring to the drawings, the same reference numerals in different drawings represent the same or similar elements unless otherwise explained.

In the description of this application, it should be noted that, unless otherwise clearly stated and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection or a detachable connection. Connection, or integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be an internal connection between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood on a case-by-case basis.

In the photovoltaic power generation system, a variety of electronic equipment is installed on the module backplane of the photovoltaic module to obtain higher profits, improve reliability, and achieve monitoring, operation and maintenance of the module. The unit price of existing electronic equipment is high, and domestic companies have not yet achieved large-scale replacement; electronic equipment and photovoltaic modules are independent products, which are inconvenient to install and require on-site installation, which reduces installation efficiency and increases the risk of irregular installation; electronic equipment is usually When installing with the module frame of the photovoltaic module, more cables need to be reserved in advance, which increases the cost of accessories and materials. In addition, the electronic equipment itself will generate heat. Because it is too close to the module backplane, it will increase the thermal stress of the photovoltaic module and the electronic equipment itself. Functional performance and risk factor; and electronic equipment and photovoltaic modules need to be packaged and shipped separately, which will increase corresponding freight and packaging costs. That is, when installing electronic equipment, multiple issues such as installation space, heat dissipation of photovoltaic modules and electronic equipment, ease of disassembly and assembly, packaging and transportation need to be comprehensively considered. However, the existing installation methods cannot meet the design needs of different scenarios at the same time.

In order to solve the above problems, embodiments of the present application provide a device for installing electronic equipment to photovoltaic modules. The device includes a mounting plate 2 for detachably connecting to the electronic equipment 1 and installing the electronic equipment 1 to On the module backplane 5 of the photovoltaic module. A connection mechanism is provided at least between the mounting plate 2 and the electronic device 1 to maintain the electronic device 1 in different installation states; the installation state at least includes a first installation state and a second installation state, the In the first installation state, the electronic device 1 and the mounting plate 2 are basically arranged in close contact; in the second installation state, a heat dissipation gap is formed between the electronic device 1 and the mounting plate 2 .

Through the above technical solution, in the device for installing electronic equipment to photovoltaic modules provided by the present disclosure, through integrated pre-assembly at the factory, the existing thickness space of the photovoltaic module is used to install the electronic equipment 1, which can reduce the number of electronic devices. Cost of packaging and shipping Equipment 1 individually. Through the structural design of the connecting mechanism, the electronic device 1 can be switched between the first installation state and the second installation state. In the first installation state, the distance between the electronic device 1 and the mounting board 2 can be reduced as much as possible, which can meet the factory requirements of low thickness and small space occupation. In the second installation state, a heat dissipation gap is formed between the electronic device 1 and the mounting plate 2, which meets the heat dissipation requirements of the component backplane 4 and the electronic device 1, while also ensuring the stability of the connection between the electronic device 1 and the mounting plate 2. . in addition, The installation structure provided by the present disclosure is easy to operate, reducing the risk of irregularities. The installation method does not require excessive operations, does not require additional nailing or adding other structures, and improves the efficiency of installation and disassembly.

It should be noted that in the first installation state, the electronic device 1 and the mounting plate 2 are basically arranged in close contact with each other. Compared with the second installation state, in the first installation state, the electronic device 1 and the mounting plate can be close to each other. , the gap between the electronic device 1 and the mounting plate 2 is smaller. In a specific application, the basic fit between the electronic device 1 and the mounting plate 2 may be a basically complete fit between the electronic device 1 and the mounting plate 2 (as shown in Figure 3), or it may be that the electronic device 1 and the mounting plate 2 are up and down. Partially dislocated, so that the electronic device 1 is attached to part of the surface of the mounting board 2 (as shown in Figures 11 and 15). The embodiment of the present application does not specifically limit the bonding method between the electronic device 1 and the mounting board 2 .

In some optional embodiments of the present application, the connection mechanism may include a first retaining member and a plurality of second retaining members; wherein the first retaining member is disposed on one of the electronic device 1 and the mounting board 2 First, the plurality of second holders are disposed corresponding to the other one of the electronic device 1 and the mounting board 2, and the first holder selects a different second holder from the plurality of second holders. Cooperate to keep the electronic device 1 in different installation states.

In an exemplary embodiment of the present disclosure, a first holder of the device on the electronic device 1 corresponds to a plurality of second holders provided on the mounting plate 2; the first holder is formed from the corresponding plurality of The second holders are selected to cooperate with different second holders to maintain the electronic device 1 in different installation states; the installation state at least includes a first installation state and a second installation state. In the first installation state, the electronic device 1 It is basically installed in close contact with the mounting plate 2; in the second installation state, a heat dissipation gap is formed between the electronic device 1 and the mounting plate 2.

In another exemplary embodiment of the present disclosure, an apparatus for mounting an electronic device to a photovoltaic module is provided. The device includes a mounting plate 2 for detachable connection with the electronic device 1 and attaches the electronic device to the photovoltaic module. 1 is installed on the module backplane 5 of the photovoltaic module. A first holder is provided on the mounting plate 2, corresponding to the first holder, and a plurality of second holders are provided on the electronic device 1; the first holder is corresponding to the first holder. A plurality of second holders are selected to cooperate with different second holders to maintain the electronic device 1 in different installation states. The installation states at least include a first installation state and a second installation state. In the first installation state, The electronic device 1 and the mounting plate 2 are basically arranged in close contact; the second installation state In the state, a heat dissipation gap is formed between the electronic device 1 and the mounting board 2 .

The positional relationship of the electronic device 1 relative to the mounting plate 2 is not limited to the first installation state and the second installation state. By designing the number, position, size, etc. of the plurality of second holders, the size of the heat dissipation gap can also be adjusted as needed. , that is, multiple second installation states with different heat dissipation gaps. In an example of the present disclosure, as shown in FIG. 31 , by increasing the number of second holders on the electronic device 1, when the first holders on the mounting plate 2 cooperate with different second holders, the electronic device The heat dissipation gap between 1 and the mounting plate 2 has various specifications, and the heat dissipation gap can be increased or reduced as needed to better meet the heat dissipation requirements.

In the above embodiment, the mounting plate 2 can be pasted and fixed on the component backplane 5 through 3M tape or a glue structure. The electronic device 1 and the mounting plate 2 are matched through the first retaining member and a plurality of second retaining members, thereby The electronic equipment 1 is installed on the module backplane 5. In this way, the photovoltaic modules and the electronic equipment 1 can be pre-installed in an integrated manner before leaving the factory, and the original thickness space of the module backplane 5 and the photovoltaic module frame 51 can be used to install the electronic equipment. Equipment 1 prevents electronic equipment 1 from additional product packaging and occupying freight space, and meets the needs of packaging and transportation scenarios.

As shown in Figure 1, the mounting plate 2 can be pasted in the middle of the module backplane 5 and placed close to the wire box 71. Compared with the installation method in which the electronic device 1 is installed on the photovoltaic module frame 51, unnecessary cables 6 are reduced. usage of. Further, as shown in Figure 2, the positive and negative polarity directions of the cable box 71 can be appropriately changed, which not only reduces the use of the cable 6, but also reduces the use of two pairs of connectors and two line cards 72. The wires here Box 71 can use a three-piece junction box, and the connector can use MC4 connectors, which can greatly reduce related costs and make on-site installation basically the same as conventional component installation.

Further, as shown in FIGS. 3 to 41 , in the device provided by the present disclosure, through the structural design of the first holder and the second holder, the electronic device 1 can have multiple relative positions relative to the mounting plate 2 Relationship, it can not only make full use of existing space to install electronic equipment in packaging and transportation scenarios, avoiding additional packaging and transportation of electronic equipment, but also meet the heat dissipation requirements in photovoltaic modules and electronic equipment 1 working scenarios.

Here, it should be noted that the electronic device 1 here may be a photovoltaic optimizer, an inverter, a converter, etc., and the cooperation method between the first holder and the second holder may be a snap connection, a plug connection, etc. Any appropriate structure can realize the detachable connection mode. In the specific embodiment provided below, the snap-in connection method will be taken as an example, that is, the first retaining member is a snap-in hole and the second retaining member is a snap buckle. Of course, the plug-in connection method will be introduced in detail. The deformations of hole and plug, double hook, hook and slot, ball slot and ball head, etc., the first retaining member is a buckle, and the second retaining member is a snap hole, all belong to the protection scope of the present disclosure. Moreover, the positional relationship of the electronic device 1 relative to the mounting plate 2 is not limited to the first installation state and the second installation state. By designing the number, position, size, etc. of the plurality of second holders, the heat dissipation gap can also be adjusted as needed. size, that is, multiple second mounting states with different heat dissipation gaps. In addition, as shown in Figures 19 and 24, the electronic device 1 includes a rear housing 101, a crimping cover 102, and a front cover 103. After assembly, the three are combined through ultrasonic technology to meet the product design requirements.

Through the above technical solution, in the device for installing electronic equipment 1 to photovoltaic modules provided by the present disclosure, through integrated pre-assembly at the factory, the existing thickness space of the photovoltaic module is used to install the electronic equipment 1, which can reduce The cost of separately packaging and transporting the electronic device 1; through the structural design of the first holder and the plurality of second holders, the electronic device 1 can at least switch between the first installation state and the second installation state. In the second installation state, the distance between the electronic device 1 and the mounting plate 2 can be reduced as much as possible, which can meet the factory requirements of low thickness and small occupied space; in the second installation state, a heat dissipation is formed between the electronic device 1 and the mounting plate 2 The gap meets the heat dissipation requirements of the component backplane 5 and the electronic device 1, while also ensuring the stability of the connection between the electronic device 1 and the mounting plate 2. In addition, the installation structure provided by the present disclosure is easy to operate, reducing the risk of irregularities. The installation method does not require excessive operations, no additional nailing or other structures are required, and the efficiency of installation and disassembly is improved.

The structural design of the holding component will be introduced in detail below with reference to different embodiments. It should be noted that these embodiments are only preferred embodiments of the present disclosure and are not intended to limit the present disclosure. Any modifications, equivalent substitutions, improvements, etc. made above should be included in the scope of protection of the present disclosure, and the multiple embodiments below can be implemented individually or in any appropriate combination to maximize the product. Excellent performance to better meet the needs of different scenarios.

Realization of multiple relative position relationships between electronic equipment and mounting boards

In the present disclosure, in the second installation state relative to the first installation state, the holding position of the electronic device 1 (the holding position refers to the position where the first holding member and the second holding member cooperate) is only in the thickness direction (as shown in FIG. 22 indicates that the thickness direction refers to the position change in the direction perpendicular to the surface of the mounting plate 2); or the second installation state is relative to the first installation state, the holding position of the electronic device 1 changes in both the thickness direction and the up and down direction. The changes will be introduced below with reference to specific embodiments.

Example 1

As shown in Figures 3 to 6, the first holding member is a first positioning member 2101 provided on the mounting plate 2, and there are two second holding members, each of which is provided on the electronic device 1 and can be connected to the first positioning member 2101. The first limiting part 1101 and the second limiting part 1201 are matched with the parts 2101. In this solution, when the first positioning part 2101 cooperates with the first limiting part 1101 to position and maintain the electronic device 1, the first The installation state, that is, in the thickness direction of the electronic device 1, the mounting plate 2 and the electronic device 1 are arranged to fit together. This state is also the factory state, and the purpose is to reduce the installation thickness of the electronic device 1, and just use the original photovoltaic module frame 51. There is a certain thickness space without occupying additional product packaging and shipping space. At the same time, due to this integrated connection method, the electronic equipment 1 and photovoltaic modules can be pre-installed at the factory, and only simple adjustments are needed to switch the electronics on site. The installation status of device 1 is sufficient, which can also improve installation efficiency and save installation time. In this solution, the first positioning member 2101 and the second limiting member 1201 cooperate to position and maintain the electronic device 1 to achieve the second installation state, that is, in the thickness direction of the electronic device 1, the electronic device 1 and the mounting plate 2 They are set at intervals to form heat dissipation gaps. This state is for on-site use to ensure good heat dissipation of the electronic device 1 and not affect the power generation efficiency of the photovoltaic modules.

In this embodiment, the first limiting member 1101 and the second limiting member 1201 are spaced apart in the thickness direction of the electronic device 1 to ensure that the first positioning member 2101 switches to the first limiting member 1101 or the second limiting member. The components 1201 are matched and connected to maintain the positioning of the electronic device 1 when the electronic device 1 is attached to the mounting plate 2 or the electronic device 1 is lifted to maintain a sufficient gap. And in this embodiment, the positioning position of the electronic device 1 in the thickness direction is directly adjusted to achieve the first installation state and the second installation state. state switching.

In the present disclosure, the electronic device 1 has the same number of second holders symmetrically disposed on the left and right sides, and the same number of first holders are symmetrically disposed on the left and right sides of the mounting plate 2. The number of both can be increased or decreased as needed. In the embodiment where the first retaining member is the first positioning member 2101 and the two second retaining members are the first limiting member 1101 and the second limiting member 1201, specifically, as shown in Figures 3 to 6, The electronic device 1 has a first limiting member 1101 and a second limiting member 1201 symmetrically disposed on the left and right sides of the electronic device 1 , and a first positioning member 2101 is symmetrically disposed on the left and right sides of the mounting plate 2 . The first retaining member and the two second retaining members constitute a set of retaining components. In order to improve the reliability of the connection between the mounting plate 2 and the electronic device 1, multiple sets of retaining components can be provided. The multiple sets of retaining components can be respectively disposed on the electronic device 1 and the electronic device 1. On multiple sides of the mounting plate 2, as shown in Figures 3 to 6, a set of holding components are respectively provided on the three sides of the electronic device 1 and the mounting plate 2. That is, a set of holding components can be provided above or below the electronic device 1. The third limiter 1301 and the fourth limiter 15 are provided with a third positioner 2401 at corresponding positions on the installation plate 2. In the first installation state, the third positioner 2401 cooperates with the fourth limiter 15. In the second installation state, the third positioning member 2401 cooperates with the third limiting member 1301.

Of course, multiple sets of holding assemblies can also be provided on the same side. As shown in Figures 7 to 10, two sets of holding assemblies are respectively provided on the left and right sides of the electronic device 1 and the mounting plate 2, spaced apart in the up and down direction. Regarding the holding assemblies, The number of groups, the number of second retainers, and the placement positions of multiple groups of retaining components can be designed as needed, and they all fall within the protection scope of the present disclosure.

Example 2

As shown in Figures 11 to 14, the first holding member is a first positioning member 2103 provided on the mounting plate 2, and there are two second holding members, each of which is provided on the electronic device 1 and can be connected to the first positioning member 2103. The first limiting piece 1103 and the second limiting piece 1203 are matched with the piece 2103. In this solution, the first positioning piece 2103 cooperates with the first limiting piece 1103 to position and maintain the electronic device 1, thereby realizing the first installation. State; when the first positioning member 2103 is switched to cooperate with the second limiting member 1203 to position and maintain the electronic device 1, the second installation state is achieved. Here and in the embodiments that will be introduced below, the effects produced by the first installation state and the second installation state are the same as those in Embodiment 1, and will not be repeated. Repeat introduction.

Further, as shown in FIG. 13 , the first limiting member 1103 and the second limiting member 1203 are arranged staggered in both the thickness direction and the up-down direction to ensure that the first positioning member 2103 switches to the first limiting member 1103 or the first limiting member 1103 . The two limiting members 1203 cooperate to maintain a sufficient gap between the electronic device 1 and the mounting plate 2 or when the electronic device 1 is lifted. And in this embodiment, switching between the first installation state and the second installation state can be achieved by moving the electronic device 1 in the up and down direction relative to the mounting plate 2 and adjusting the positioning position of the electronic device 1 in the thickness direction.

In this embodiment, the same number of first holders are symmetrically arranged on the left and right sides of the mounting plate 2, and the same number of second holders are symmetrically arranged on the left and right sides of the electronic device 1. The number of both can be increased or increased as needed. reduce. In the embodiment where the first retaining member is the first positioning member 2103 and the two second retaining members are the first limiting member 1103 and the second limiting member 1203, in the embodiment shown in Figures 11 to 14, the electronic A first limiting member 1103 and a second limiting member 1203 are symmetrically provided on the left and right sides of the device 1, and a first positioning member 2103 is symmetrically provided on the left and right sides of the mounting plate 2.

In order to improve the reliability of the connection between the mounting plate 2 and the electronic device 1 without affecting the adjustment of the electronic device 1 in the up and down direction, the first retaining member and a plurality of second retaining members constitute a set of retaining components, which can be selected on the left and right. Multiple sets of holding assemblies are provided on the side, and the multiple sets of holding assemblies are spaced apart in the up and down direction. As shown in Figures 15 to 18, two sets of holding assemblies are provided on the left and right sides of the electronic device 1 and the mounting plate 2 and spaced apart in the up and down direction. The number of sets of holding components, the number of second holding parts, and the placement positions of multiple sets of holding components can be designed as needed, and they all fall within the protection scope of the present disclosure.

Example 3

As shown in Figures 19 to 23, the first holding member includes a first limiting member 1102 provided on the electronic device 1. There are two second holding members and they are respectively provided on the mounting plate 2 and can be connected to the first limiting member 1102. The limiting member 1102 is matched with the first positioning member 2102 and the second positioning member 2202. In this solution, when the first limiting member 1102 cooperates with the first positioning member 2102 to position and hold the electronic device 1, the first installation state is achieved; the first limiting member 1102 switches to cooperate with the second positioning member 2202 to position and maintain the electronic device 1. electronic When the positioning of device 1 is maintained, the second installation state is achieved.

Further, as shown in Figures 19 and 20, the first positioning member 2102 and the second positioning member 2202 are located on the same straight line along the up and down direction, and in the thickness direction, the second positioning member 2202 is used to connect with the first positioning member 2202. The positioning end of the positioning member 1102 is higher than the positioning end of the first positioning member 2102 for cooperating with the first limiting member 1102 to ensure that the first limiting member 1102 switches to the first positioning member 2102 or the second positioning member. 2202 cooperates to achieve positioning and holding of the electronic device 1 when the electronic device 1 is attached to the mounting plate 2 or the electronic device 1 is lifted to maintain a sufficient gap. And in this embodiment, switching between the first installation state and the second installation state can be achieved by moving the electronic device 1 in the up and down direction relative to the mounting plate 2 and adjusting the positioning position of the electronic device 1 in the thickness direction.

In this embodiment, the first limiting member 1102 may be a limiting hole, the first positioning member 2102 and the second positioning member 2202 may be positioning hooks, and the positioning end mentioned above refers to the cooperation between the positioning hook and the limiting hole. Location. Of course, for the embodiment of the plug 2105 and the jack, the positioning end refers to the insertion position of the plug 2105 and the jack.

In the present disclosure, the same number of second holders are symmetrically arranged on the left and right sides of the electronic device 1, and the same number of first holders are symmetrically arranged on the left and right sides of the mounting plate 2, so that the electronic device 1 and the mounting plate are connected from the left and right sides. The connection of 2 will not cause interference when the electronic device 1 is adjusted in the up and down direction.

In this embodiment, as shown in Figures 19 and 20, a limiting support 23 is provided at the bottom of the mounting plate 2. In the second installation state, the limiting support 23 is used to abut the bottom surface of the electronic device 1 to protect the electronic device. The device 1 is supported, and can prevent the electronic device 1 from falling, and reduce the pressure on the second positioning member 2202.

In this embodiment, as shown in Figures 19, 20 and 25, the device for mounting electronic equipment to the photovoltaic module may further include a third positioning member 2402 provided on the mounting plate 2 and a third positioning member 2402 provided on the electronic equipment. 1, in the second installation state, the third positioning member 2402 cooperates with the third limiting member 1302. To further support the electronic device 1 and enhance the connection strength between the two, a third positioning member 1302 and a third limiting member 2402 may be provided as needed. The third positioning member 2402 and the third limiting member 1302 may be hooks. Card hole fit form.

In the embodiment of the present disclosure, in the second installation state, as shown in Figure 22, the heat dissipation gap D between the mounting plate 2 and the electronic device 1 is at least 15 mm, thereby ensuring good heat dissipation of the electronic device 1 without affecting the The power generation efficiency of the component may not be affected by the component. The heat dissipation gap can be adjusted by changing the position of the first limiting member 1102 in the thickness direction of the electronic device 1 or adjusting the height of the positioning end of the second positioning member 2202 in the thickness direction. The size of D is not limited in this disclosure. The technical solutions regarding the limiting support 23 , the third positioning member 2402 and the third limiting member 1302 , and the heat dissipation gap D in this embodiment are also applicable to all embodiments provided by this disclosure.

Maintain the design of the slides in the assembly

Regarding the examples provided in Embodiment 2 and Embodiment 3, that is, in embodiments in which switching between the first installation state and the second installation state can be achieved by moving the electronic device 1 in the up and down direction relative to the mounting plate 2, as shown in Figures 24 to 24 As shown in Figure 28, the device provided by the present disclosure for installing electronic equipment to photovoltaic modules includes a slide slot 31 provided on the electronic equipment 1, and a slide support 32 provided on the mounting plate 2; the slide support 32 and The sliding fit of the chute 31 can always provide guidance support during the entire process of switching from the first installation state to the second installation state, and when the electronic device 1 and the mounting plate 2 are relatively positioned and maintained in the second installation state, use To provide stable support for the electronic device 1. The cooperation between the chute 31 and the slide support 32 can limit the movement trajectory of the electronic device 1, making installation more convenient, while reducing the stress on the first holder and the second holder, and improving the stability of the installation of the electronic device 1 and the mounting plate 2. sex.

Further, as shown in FIGS. 25 to 28 , the slide support 32 and the slide groove 31 extend in the up and down direction, and the slide support 32 and the slide groove 31 respectively have slopes extending in the up and down direction, so as to facilitate the electronic device 1 at the first position. When switching between the first installation state and the second installation state, the electronic device 1 can slide along the trajectory of the inclined plane to a predetermined position, and can be raised or lowered relative to the mounting plate 2 in the thickness direction.

In this disclosure, the height at which the electronic device 1 is lifted is related to the length and height of the slope, the distance between the first limiting member 1103 and the second limiting member 1203 in the thickness direction in Embodiment 2, the first positioning in Embodiment 3 The height of the positioning end of the second positioning member 2102, the height of the positioning end of the second positioning member 2202 and other factors are related to each other. In the preferred embodiment, the length of the slope can satisfy that the starting end of the slope is related to the implementation. The position of the first limiting member 1103 in Example 2 corresponds to the position of the first positioning member 2102 in Example 3. In this way, in the first installation state, the electronic device 1 can be attached to the mounting plate 2. It is possible to prevent the installation of a bevel from affecting the fit between the electronic device 1 and the mounting plate 2; after the electronic device 1 slides, it slides along the bevel and is gradually lifted, and the highest end of the bevel can be aligned with the position of the second limiting member 1203 in Embodiment 2. Correspondingly, corresponding to the position of the second positioning member 2202 in Embodiment 3, in this way, in the second installation state, the electronic device 1 can be lifted to a predetermined height when it reaches the highest end of the slope, and the sliding support 32 can provide a certain height. Supporting effect.

In this publicly provided embodiment, the height at which the electronic device 1 is lifted is the distance in the thickness direction between the first limiting member 1103 and the second limiting member 1203 in Embodiment 2, or is the second positioning height in Embodiment 3. The height difference between the positioning end of the member 2202 and the positioning end of the first positioning member 2102 is equal to the height of the slope in the thickness direction, so as to ensure that the electronic device 1 is in contact with the mounting plate 2 after being lifted to a predetermined height. Connect and stay in that position.

Further, as shown in FIG. 24 , in order to ensure that the slide support 32 can slide into the slide groove 31 smoothly, an opening is formed at the end of the slide groove 31 for the slide support 32 to slide into. The chute 31 can be provided at any appropriate position on the electronic device 1. This disclosure also includes embodiments in which the slide support is provided on the electronic device 1 and the chute 31 is provided on the mounting plate 2, which all fall within the scope of the present disclosure.

In addition, the number and installation positions of the slide rail supports 32 and the slide grooves 31 can be set as needed. As shown in Figures 24 and 25, the first holders can be symmetrically arranged on the left and right sides of the mounting plate 2, and the second holders can also be symmetrically arranged on the left and right sides of the electronic device 1 to strengthen the mounting plate 2 and the electronic device. 1 to ensure connection stability and avoid falling off. Slide supports 32 are provided on both sides of the mounting plate 2 and inside the first holder. Slide grooves 31 are provided on both sides of the back of the electronic device 1 to secure the electronic device. 1 provides guidance support for movement. Of course, as shown in Figures 26 and 27, the slide groove 31 can be provided at the middle position of the electronic device 1, and the slide support 32 can be provided at the corresponding position of the mounting plate 2, which all fall within the protection scope of the present disclosure. Moreover, in the embodiments provided by the present disclosure, as shown in FIGS. 25 and 27 , the mounting plate 2 can be hollowed out except for the position where the slide support 32 is provided, which can reduce the overall weight and facilitate heat dissipation. .

Maintain the design of snaps in components

Regarding the first retaining member and the second retaining member in the above embodiment, one may be a buckle and the other may be a limiting hole, in order to quickly switch between the first installation state and the second installation state, such as As shown in Figures 29 to 34, the device provided by the present disclosure also includes a driving mechanism that cooperates with the buckle. The driving mechanism is used to drive the buckle toward or away from the limiting hole, which can quickly realize the first holding member and the second holding member. The combination or separation of parts makes the operation simple and improves the installation efficiency.

Specifically, as shown in Figures 32 to 34, the mounting plate 2 is provided with a receiving frame 210. The buckle 2104 is installed in the containing frame 210, and the receiving frame 210 can be extended or retracted. The driving mechanism includes the buckle 2104 and the receiving frame 210. The matching operating member 211 has a slot formed on the receiving frame 210. The operating member 211 moves along the slot in a direction closer to or away from the limiting hole. By moving the operating member 211, the first installation state and the second installation state can be unlocked.

The driving mechanism also includes an elastic member 212 disposed in the containing frame 210, with one end pressing against the buckle 2104, and the other end pressing against the inner wall of the containing frame 210. When connecting the electronic device 1 to the mounting plate 2, as shown in Figure As shown in 33 and 34, through the operating member 211, the elastic force of the elastic member 212 is overcome, so that the positioning end of the buckle 2104 is retracted into the containing frame 210. At this time, the position of the electronic device 1 can be adjusted and installed in place; as shown in Figure 30 As shown, loosen the operating member 211, and under the action of the restoring force of the elastic member 212, the positioning end of the buckle 2104 pops out of the containing frame 210 and extends into the limit hole to achieve cooperation with the limit hole; when it is necessary to change the installation state , the electronic device 1 can be separated from the mounting plate 2 simply by turning the operating member 211 .

Of course, for embodiments where two or even more buckles 2104 are provided on the same side, the operating parts 211 used to drive multiple buckles 2104 can be connected as one body. In this way, the operating part 211 can drive two buckles 2104 at the same time. Movement, improves disassembly efficiency.

In addition, in order to facilitate user operation, the operating member 211 connecting the two buckles 2104 on the same side has a bent portion 2110 arranged in a direction away from the limiting member, making it convenient for the user to reach into a small space and move the operating member 211.

Elastic support design

In the above embodiment, one of the first retaining member and the second retaining member may be a latch 2105 and the other may be a limiting hole. As shown in FIGS. 35 to 41 , the latch 2105 itself may be provided with an elastic support member 33 , in the first installation state, the elastic support member 33 is compressed and deformed, which will not affect the fit between the electronic device 1 and the mounting plate 2. In the second installation state, the elastic support member 33 can effectively support the electronic device 1 effect.

As shown in Figure 35, the latch 2105 has a fixed end that matches the mounting plate 2 and a positioning end used to engage with the limiter. When the elastic support 33 and the latch 2105 are designed to be integrated, the latch 2105 The part between the fixed end and the positioning end is provided with an opening. One end of the elastic support member 33 is connected to the opening, and the other end is a free end and extends toward the positioning end. In the first installation state, the elastic support member 33 The deformation in the direction away from the mounting plate 2 will not affect the fit of the back of the electronic device 1 with the mounting plate 2. As shown in Figure 39, in the second installation state, the free end of the elastic support 33 presses against the electronic device. 1 to support it.

Further, in this embodiment, as shown in FIG. 37 , the electronic device 1 is provided with an escape portion 16 at a position corresponding to the elastic support member 33 . In the first installation state, the free end of the elastic support member 33 acts The escape portion 16 will not affect the connection of the electronic device 1 and can also improve the stability of the connection.

In other embodiments, the elastic support 33 and the latch 2105 can also be provided separately. As shown in Figure 41, the elastic support 33 can be directly fixed on the mounting plate 2, and the elastic support 33 can be fixed to the installation plate 2 in the middle. , a plate-like structure with both ends extending obliquely upward; or a structure with a bulge in the middle and both ends fixed to the mounting plate 2. It can be a single plate or composed of multiple plates. Its principle is similar to that of a leaf spring. In the first installation state, the elastic support member 33 is deformed, and the elastic support member 33 is in a compressed state as a whole, which will not affect the fit between the electronic device 1 and the mounting plate 2; in the second installation state, the elastic support member 33 is stuck The claw does not deform, and its contact with the electronic device 1 can effectively support the electronic device 1 .

In the second installation state, in order to improve the stability of the electronic device 1 and the mounting plate 2, the support structure between the electronic device 1 and the mounting plate 2 is not limited to the cooperation between the slide groove 31 and the slide support 32, but can provide support. Any other structure may be used, such as a boss provided on the mounting plate 2 or the electronic device 1, or The elastic support member 33 mentioned above.

In order to solve the above problem, according to another embodiment of the present disclosure, as shown in Figures 42 to 52, a device for installing electronic equipment to a photovoltaic module is provided. The connection mechanism of the module backplane 5 includes a folding mechanism. 8. Wherein, the electronic device 1 can move relative to the mounting plate 2 along the folding or unfolding direction of the folding mechanism 8 to switch the electronic device 1 between a first installation state and a plurality of second installation states. In the first installation state In the second installation state, the folding mechanism 8 is folded, and the electronic device 1 and the mounting plate 2 are basically in contact with each other; in the second installation state, the folding mechanism 8 is unfolded, and a heat dissipation gap is formed between the electronic device 1 and the mounting plate 2 .

Here, it should be noted that in the first installation state, the "basic fit" of the electronic device 1 and the mounting plate 2 includes an embodiment in which the electronic device 1 and the mounting plate 2 are almost completely fit, and also includes an embodiment in which the electronic device 1 and the mounting plate 2 are not completely fit. In the former embodiment, the electronic device 1 can be provided with a receiving slot for accommodating the folding mechanism 8. When the folding mechanism 8 is folded, the electronic device 1 and the mounting plate 2 can be completely integrated. Fitting can be achieved; in the latter embodiment, since the folding mechanism 8 occupies a certain space after being folded, there is a gap between the electronic device 1 and the mounting plate 2 , which can also be understood as basic fitting at this time.

In the embodiment of the present disclosure, the electronic device 1 and the mounting plate 2 are connected through the folding mechanism 8. The mounting plate 2 can be pasted and fixed on the component backplane 5 through 3M tape or a glue structure, thereby installing the electronic device 1 to the component. On the back panel 5, after the folding mechanism 8 is folded, the overall thickness of the electronic device 1, the folding mechanism 8 and the mounting plate 2 is smaller than the thickness of the photovoltaic module frame 51. In this way, the photovoltaic module and the electronic device 1 can be integrated when leaving the factory. Type pre-installation can make full use of the original thickness space of the module backplane 5 and the photovoltaic module frame 51 to install the electronic device 1, avoiding additional product packaging and occupying freight space for the electronic device 1, and meeting the needs of packaging and transportation scenarios.

Through the above technical solution, in the device for installing electronic equipment 1 to photovoltaic modules provided by the present disclosure, through integrated pre-assembly at the factory, the existing thickness space of the photovoltaic module is used to install the electronic equipment 1, which can reduce The cost of separately packaging and transporting the electronic device 1; through the structural design of the folding mechanism 8, the electronic device 1 can be switched between the first installation state and the second installation state. In the first installation state, the distance between the electronic device 1 and the mounting plate 2 can be reduced as much as possible, which can meet the factory requirements of low thickness and small occupied space; in the second installation state, the distance between the electronic device 1 and the mounting plate 2 A heat dissipation gap is formed between the boards 2 to meet the heat dissipation requirements of the component backplane 5 and the electronic device 1, while also ensuring the stability of the connection between the electronic device 1 and the mounting board 2. In addition, the electronic device 1 only needs to be moved in a predetermined direction to quickly switch between the first installation state and the second installation state. The installation structure provided by the present disclosure is easy to operate, reduces the risk of irregularities, and does not need to increase the installation method too much. Operation, no additional nailing or other structures are required, improving installation and disassembly efficiency.

Further, as shown in Figures 42 to 52, the mounting plate 2 and the electronic device 1 are arranged oppositely, and the folding mechanism 8 can be folded or unfolded along the thickness direction of the electronic device 1, and the thickness direction is as shown by the arrow in Figure 42 direction, the folding mechanism 8 has multiple unfolding positions, and the size of the heat dissipation gap formed between the electronic device 1 and the mounting board 2 is different. The heat dissipation gap between the electronic device 1 and the mounting plate 2 has various specifications, and the heat dissipation gap can be increased or reduced as needed to better meet the heat dissipation requirements. In addition, unfolding the folding mechanism 8 to different positions makes the size of the heat dissipation gap different, so that the device can be applied in different scenarios. For example, the thickness of the photovoltaic module frame 51 is limited, and the heat dissipation gap can be reduced. When the thickness of the photovoltaic module frame 51 Under conditions that meet the requirements and require high heat dissipation, the heat dissipation gap can be increased and a variety of options can be adapted.

According to an embodiment of the present disclosure, as shown in FIGS. 42 to 46 , the folding mechanism 8 can be configured as a folding bracket composed of a hinged rod, and the folding bracket can be self-locking in a stowed position and multiple unfolded positions. Adjustable pre-tightening devices can also be installed at the hinge points of multiple hinge rods. By adjusting the pre-tightening device, the distance between the electronic device 1 and the mounting plate 2 can be fixed to any extendable range of the folding bracket. , this disclosure does not limit this.

Further, as shown in FIGS. 42 to 44 , the folding bracket may include a first fixed rod 81 fixed on the mounting plate 2 , a second fixed rod 82 fixed on the electronic device 1 , and a movement rod 83 . The rod 81 and the second fixed rod 82 are arranged in the same direction, and the two ends of the moving rod 83 are respectively hinged with the ends of the first fixed rod 81 and the second fixed rod 82 to form a Z-shaped folding bracket for convenient storage. In addition, as shown in Figure 45, the folding bracket can also be provided with two cross-hinged movement rods 83 to make the shape into a scissor-shaped folding bracket, or, as shown in Figure 46, the first fixed rod 81 and the second fixed rod 82 are hinged with two moving rods 83 at both ends, and the two moving rods 83 on both sides are V-shaped and inward. The design of the folding bracket that is recessed to complete the folding effect and can achieve the folding effect all fall within the scope of protection of the present disclosure.

Further, as shown in Figures 42 to 44, the first fixed rod 81, the moving rod 83 and the second fixed rod 82 have the same size in the thickness direction. The hinge points of the first fixed rod 81 and the moving rod 83, the second The hinge points of the fixed rod 82 and the moving rod 83 are respectively located on the opposite sides of the moving rod 83. In the first installation state, the first fixed rod 81, the moving rod 83 and the second fixed rod 82 overlap, and the mounting plate 2 is connected to the electronic device. The distance between 1 is the size of one of the first fixed rod 81, the moving rod 83 and the second fixed rod 82 in the thickness direction, so as to reduce the distance between the mounting plate 2 and the electronic device 1 in the first installation state. . In addition, a groove can also be provided on the back of the electronic device 1, and the second fixed rod 82 is arranged in the groove. When the first fixed rod 81, the second fixed rod 82 and the moving rod 83 overlap, they can all be located in the groove. , to minimize the additional thickness space occupied by the folding mechanism 8. Grooves can be made on both sides of the electronic device 1 or at appropriate positions on the back of the electronic device 1 that do not interfere with the arrangement of internal electronic components, and can be reused according to the thickness space required by the electronic components arranged inside the electronic device 1. This thickness space is used to store the folding mechanism 8, that is, the existing space of the electronic device 1 is used to store the folding mechanism 8, so that there is no need to occupy additional thickness space, and the inherent thickness space of the component itself can be used to integrate the electronic device 1 and the mounting plate 2 Pre-installed. In the second installation state, the moving rod 83 forms an included angle with the first fixed rod 81 and the second fixed rod 82 respectively. The heat dissipation gap between the mounting plate 2 and the electronic device 1 depends on the included angle. The larger the included angle, the greater the heat dissipation. The larger the gap and the smaller the included angle, the smaller the heat dissipation gap. The included angle can be selected according to different needs and application scenarios.

In addition, as shown in Figure 47 and Figure 48, the folding brackets can be staggered up and down. When the folding brackets are folded, they can be basically stacked flat at the position of the mounting plate 2. In addition, as shown in Figure 49, in the In the first installation state, the electronic device 1 can be further moved upward, and the electronic device 1 can be moved above the mounting plate 2 so that the electronic device 1 can be basically placed in close contact with the component backplane 5, thereby minimizing the need for the electronic device 1 to be installed. The thickness space occupied when pre-assembled with the mounting plate 2.

According to an embodiment of the present disclosure, as shown in FIGS. 42 to 44 , the number of folding mechanisms 8 can be at least two, and they are spaced apart along the length direction or width direction (as shown in FIG. 50 ) of the electronic device 1 Between the electronic device 1 and the mounting board 2 , an enhanced folding mechanism 8 supporting stability may also be provided in both the length direction and the width direction. The number and installation positions of the folding mechanisms 8 can be designed as needed, and they all fall within the protection scope of the present disclosure.

According to an embodiment of the present disclosure, as shown in FIGS. 50 to 52 , the folding mechanism 8 may be configured as a flexible support member. The flexible support member has openings at both ends and a flexible cavity in the middle. The openings at both ends are respectively connected to the mounting plate 2 With the electronic device 1, the flexible cavity is formed by at least two foldable pieces 84 that are foldably connected in sequence. The switching of the first installation state and the second installation state is completed by unfolding or folding the folding pieces 84. The folding piece 84 may be in a ring shape to increase the supporting force of the flexible support member and prevent the electronic device 1 from falling. The flexible support member can be made of silicone or other polymeric organic soft materials, which is not limited in this disclosure.

Further, as shown in FIGS. 50 to 52 , along the unfolding direction of the flexible support, the inner diameters of the multiple folding pieces 84 can be reduced sequentially, so that when the folding pieces 84 are folded, the multiple folding pieces 84 do not overlap. In the first installation state, a plurality of folded pieces 84 are nested in each other. The distance between the installation plate 2 and the electronic device 1 is the width of the folded piece 84 with the largest inner diameter. The remaining folded pieces 84 are sequentially embedded in the previous folded piece 84 in an annular shape along the inner diameter. In the inner circle of piece 84. In the second installation state, at least one folding piece 84 is unfolded, and the heat dissipation gap between the mounting plate 2 and the electronic device 1 depends on the number of unfolded folding pieces 84 . In addition, for the embodiment of the flexible support member, a groove for accommodating the flexible support member can also be provided on the back of the electronic device 1. The shape of the groove can be adaptively designed according to the shape of the flexible support member in the folded state. The back side of 1 has grooves at appropriate positions that do not interfere with the arrangement of internal electronic components, and the thickness space can be reused to accommodate the folding mechanism 8 according to the thickness space required by the electronic components arranged inside the electronic device 1, that is, The existing space of the electronic device 1 is used to store the folding mechanism 8 , so that no additional thickness space is required, and the inherent thickness space of the component itself can be utilized to realize integrated pre-assembly of the electronic device 1 and the mounting plate 2 .

According to an embodiment of the present disclosure, as shown in FIG. 52 , a plurality of heat dissipation holes 85 may be spaced on the flexible support member. Without affecting the folding function of the flexible support, it can be A plurality of heat dissipation holes 85 are provided on the flexible support member to enhance air circulation and improve the heat dissipation effect.

According to an embodiment of the present disclosure, as shown in Figures 44 and 52, since the folding mechanism 8 can be installed at the edge frame of the mounting plate 2, the mounting plate 2 can be configured as a hollow frame structure, that is, a hollow frame structure can be used. The design can reduce the weight of the mounting plate 2 and comply with the lightweight design principle. At the same time, in the hollow area, there is no other barrier between the component backplane 5 and the electronic device 1, thereby enhancing the heat dissipation function.

In the embodiment of the present disclosure, the device may further include an elastic support member disposed between the electronic device 1 and the mounting plate 2. When the mounting plate 2 is a flat plate and not hollow, the elastic support member may be disposed on the mounting plate. 2 on. The elastic support member can be a plate-like structure with the middle fixed to the mounting plate 2 and both ends extending obliquely upward; or a structure with a raised middle and both ends fixed to the mounting plate 2. It can be a single plate or can be composed of multiple plates. The principle is similar to that of leaf springs. In the first installation state, the elastic support member deforms, and the elastic support member is in a compressed state as a whole, which will not affect the fit between the electronic device 1 and the mounting plate 2; in the second installation state, the claws of the elastic support member do not produce The electronic device 1 can be effectively supported by the elastic support member when the folding mechanism 8 is fully deployed.

In order to solve the above problems, according to an embodiment of the present disclosure, as shown in FIGS. 53 to 8 , a device for installing electronic equipment to a photovoltaic module is provided. The connection mechanism includes a guide part 11 and a guide part 11 . 11 is connected with a holder 25; one of the electronic device 1 and the mounting plate 2 is provided with a guide part 11, and the other is provided with a holder 25 that slides with the guide part 11. The electronic device 1 can be positioned relative to the mounting plate. 2 moves along the extension direction of the guide portion 11 to switch the electronic device 1 between a first installation state and a plurality of second installation states. In the first installation state, the electronic device 1 and the mounting plate 2 are basically arranged in close contact with each other. ; In the second installation state, a heat dissipation gap is formed between the electronic device 1 and the mounting board 2 .

It should be noted that the present disclosure includes an embodiment in which the guide part 11 is provided on the electronic device 1 and the holder 25 is provided on the mounting plate 2. It also includes an embodiment in which the guide part 11 is provided on the mounting plate 2 and the holder 25 is provided on the electronic device. The embodiment on 1 can realize the sliding fit between the electronic device 1 and the mounting plate 2 The connection methods all belong to the protection scope of the present disclosure, and will be introduced in detail below using the former as an example. In addition, regarding the position of the guide part 11 on the electronic device 1, it may be provided on the side of the electronic device 1 or on the back of the electronic device 1, which is not limited in this disclosure. The guide part 11 can be a chute as shown in the figure, or a slide rail, etc., and the retaining member 25 can be a latching protrusion, a slide block, a ball head, etc.

Through the above technical solution, in the device for installing electronic equipment 1 to photovoltaic modules provided by the present disclosure, through integrated pre-assembly at the factory, the existing thickness space of the photovoltaic module is used to install the electronic equipment 1, which can reduce The cost of separately packaging and transporting the electronic device 1; through the structural design of the guide part 11 and the holder 25, the electronic device 1 can be switched between the first installation state and the second installation state. In the first installation state, it can be Possibly reduce the distance between the electronic device 1 and the mounting plate 2, which can meet the factory requirements of low thickness and small space occupation; in the second installation state, a heat dissipation gap is formed between the electronic device 1 and the mounting plate 2 to meet the requirements of the component back. The heat dissipation requirements of the board 31 and the electronic device 1 can also ensure the stability of the connection between the electronic device 1 and the mounting board 2 . In addition, the electronic device 1 only needs to be moved in a predetermined direction to switch between the first installation state and the second installation state. The installation structure provided by the present disclosure is easy to operate, reduces the risk of irregularities, and the installation method does not require excessive operations. , without the need for additional nailing or adding other structures, improving the efficiency of installation and disassembly.

Further, as shown in Figures 53 to 56, the guide part 11 at least includes a first section 111, a second section 112 and a lifting section 113 located between the first section 111 and the second section 112. In the first installation state , the retaining member 25 is located in the first section 111. In the thickness direction of the electronic device 1, the thickness direction of the electronic device 1 is as shown in Figure 57. The mounting plate 2 and the electronic device 1 are basically arranged in close contact; the electronic device 1 moves, and the retaining member 25 enters the second section 112 through the lifting section 113, switching from the first installation state to the second installation state; in the second installation state, the retaining member 25 is located in the second section 112, and in the thickness direction of the electronic device 1, the mounting plate 2 is spaced apart from the electronic device 1 and forms a heat dissipation gap. Among them, in the embodiment in which the guide part 11 is provided on the side of the electronic device 1, the first section 111 and the second section 112 are provided with a certain length, and the holder 25 slides into the first section 111 or the second section 112 through the lifting section 113. When, you can continue to slide along the extension direction of the first section 111 or the second section 112 to keep it away from the The connection point of the lifting section 113 slides to the end of the first section 111 or the second section 112. The design of the inner width gradually decreasing at the ends of the first end 111 and the second end 112 can be used when sliding to the end. The retaining member 25 plays a certain limiting role when the mounting plate 2 and the electronic device 1 are in the current state. The width of the gap between the mounting plate 2 and the electronic device 1 depends on the design of the lifting section 113. The lifting section 113 is not limited to one section, but can be multiple sections. The distance between the first section 111 and the second section 112 in the thickness direction is connected to the first section. The section 111 and the raised section 113 of the second section 112 are designed so that the heat dissipation gap between the mounting plate 2 and the electronic device 1 can be adjusted. In the embodiment of the present disclosure, the heat dissipation gap between the mounting plate 2 and the electronic device 1 is at least 15 mm, thereby ensuring good heat dissipation of the electronic device 1 without affecting the power generation efficiency of the component or being affected by the component.

Further, as shown in FIGS. 53 to 56 , the first section 111 and the second section 112 can be arranged in parallel, and at the same time staggered in the up and down direction and the thickness direction of the electronic device 1 , one end of the lifting section 113 is connected to the first section 111, the other end of the lifting section 113 is connected to the end of the second section 112. As shown in FIG. 3 , when the electronic device 1 moves, the holder 25 can enter the second section 112 along the lifting section 113 and switch to the second installation state, thereby saving operation time.

In the present disclosure, the positional relationship of the electronic device 1 relative to the mounting plate 2 is not limited to the first installation state and the second installation state. By designing the guide portion 11, the size of the heat dissipation gap can also be adjusted as needed, that is, with different Multiple second installation states for thermal gaps.

For example, as shown in Figure 57, in an exemplary embodiment of the present disclosure, there are multiple second sections 112 arranged in parallel, there are multiple lifting sections 113, one end of the lifting section 113 is connected to the same first section 111, and the other is One end is connected to different second sections 112, and the retaining member 25 is selected to position and cooperate with the different second sections 112 through the corresponding lifting sections 113. The sizes of the heat dissipation gaps formed between the electronic device 1 and the mounting plate 2 are different.

As shown in Figure 58, in an exemplary embodiment of the present disclosure, there are multiple second sections 112 arranged in parallel and spaced apart in the up and down direction, there are multiple lifting sections 113, and the first section 111 and the second section 112 and between two adjacent second sections 112 are connected through lifting sections 113. The retaining member 25 selects and positions with different second sections 112 through the corresponding lifting sections 113. The connection between the electronic device 1 and the mounting plate 2 The heat dissipation gaps are formed in different sizes.

As shown in Figure 59, in an exemplary embodiment of the present disclosure, multiple second sections 112 are arranged in parallel, and the multiple second sections 112 are connected through the connecting sections 114. One end of the lifting section 113 is connected to the first section 111. connection, the other end of the lifting section 113 is connected to the connecting section 114, the retaining member 25 is selected to position and cooperate with different second sections 112 through the lifting section 113 and the connecting section 114, and the size of the heat dissipation gap formed between the electronic device 1 and the mounting plate 2 is different. .

In addition, in the embodiment of the present disclosure, the connections between the first section 111 , the second section 112 , the lifting section 113 and the connecting section 114 can all adopt curved natural transition connections to ensure that the retaining member 25 does not move when moving. Stuck at the connection.

In the above embodiment, when the retaining member 25 is located in a different second section 112, the heat dissipation gap between the electronic device 1 and the mounting board 2 has a variety of specifications, and the heat dissipation gap can be increased or reduced as needed to better meet the requirements. heat dissipation requirements. In addition, different second sections 112 make the size of the heat dissipation gap different, so that the device can be applied in different scenarios. For example, the thickness of the photovoltaic module frame 51 is limited, and the heat dissipation gap can be reduced. When the thickness of the photovoltaic module frame 51 can meet Under conditions where high heat dissipation is required, the heat dissipation gap can be increased and a variety of options can be adapted.

According to an embodiment of the present disclosure, as shown in FIGS. 54 and 60 , there may be two guide parts 11 and they may be respectively provided on two opposite side walls of the electronic device 1 , and there may be two holders 25 and they may be arranged oppositely, and The distance between the two holders 25 is adapted to the installation width of the electronic device 1. Two sets of guide parts 11 and holders 25 are provided to better support the electronic device 1 and lift the mounting plate 2 and the electronic device. 1. Stability of fit. Of course, multiple guides 11 can also be provided on the same side of the electronic device 1, and multiple holders 25 can be provided on the mounting plate 2. The left and right sides of the electronic device 1 and the mounting plate 2 are spaced apart in the up and down direction. The two sets of guide parts 11 and retainers 25, the number of guide parts 11 and retainers 25, and the placement positions of multiple sets of guide parts 11 and retainers 25 can be designed as needed, and they all fall within the protection scope of the present disclosure. The distance between the holders 25 may be greater than or equal to the width of the electronic device 1 . The electronic device 1 can be located between the holders 25 and can basically fit with the mounting plate 2 in the first installation state. In an embodiment where the distance between the holders 25 is greater than the width of the electronic device 1 , the length of the holders 25 may be increased to achieve connection with the electronic device 1 .

According to an embodiment of the present disclosure, the guide part 11 may be a chute provided on the electronic device 1 , and the retaining member 25 may be a protruding structure that slides with the chute. The guide part 11 has a fixed extension trajectory, and the holder 25 slides in the chute along the trajectory of the guide part 11. The cooperation between the chute and the latching structure allows the holder 25 to snap into the guide part 11, preventing the mounting plate 2 from contacting the electronic equipment. 1 can be separated when not necessary to improve the overall stability of the device, while also enabling detachable connection between the two.

Further, as shown in Figures 60 and 61, the holder 25 includes a column 251 and a latching protrusion 252. One end of the upright column 251 is fixedly connected to the mounting plate 2, and the other end is provided with a latching protrusion 252, and the latching protrusion 252 can face the installation plate. 2 is arranged in the middle, wherein the height of the column 251 in the thickness direction of the electronic device 1 is greater than the distance between the first section 111 and the second section 112 in the thickness direction, so as to ensure that the latching protrusion 252 can be smoothly latched in the first installation state. Continuing in the first paragraph 111, the overall stability of the device is improved. The position of the first section 111 and the height of the column 251 determine the degree of fit between the electronic device 1 and the mounting plate 2 in the first installation state. If the height of the column 251 in the thickness direction of the electronic device 1 is not high enough, the first In the installation state, when the latching protrusion 252 is in the lifting section 113, the latching protrusion 252 cannot be stuck. Under the action of a slight external force, the latching protrusion 252 can easily slide into the second section 112 along the extension track of the guide portion 11. If the upright column 251 If the height of the electronic device 1 in the thickness direction is too high, it is easy to cause the electronic device 1 and the mounting plate 2 to fail to fit together in the first installation state, exceeding the existing thickness space of the photovoltaic module and failing to meet packaging requirements.

Further, as shown in FIG. 11 , the clamping protrusion 252 includes a fitting part 2522 that can slide back and forth in the guide part 11 and a limiting part 2521 that prevents the clamping protrusion 252 from coming out of the guide part 11 . The diameter of the limiting part 2521 can be larger than The matching portion 2522 prevents the latch 252 from sliding out of the guide portion 11 during normal use. The fitting portion 2522 can be configured as a tapered structure with an axial diameter gradually increasing in the direction away from the upright column 251. The fitting position of the guide portion 11 and the fitting portion 2522 is the thinnest part of the tapered structure. The tapered structure can also play a certain role. position function, and when the latch 252 is pulled out, the fitting position transitions from the thinnest part to the thickest part and finally to the limiting part 2521. Compared with the fitting part 2522, which is a cylindrical structure with an equiaxial diameter, this structure It is convenient to pull out the latching protrusion 252 from the guide portion 11 when the installation plate 2 needs to be disassembled. In addition, it can also be configured as a structure in which the gap between the first section 111 and the second section 112 is small, and the gap between the lifting section 113 is large. In this case, the limiting part 2521 can be made of a material with certain elastic deformation. This allows the limiting portion 2521 to fit into the guide portion 11 and not come out of the first section 111 and the second section 112 .

In the embodiment of the present disclosure, as shown in Figures 53 and 60, the bottom of the mounting plate 2 can be provided with a limited support 26. In the second installation state, the limited support 26 is used to abut the bottom surface of the electronic device 1, To support the electronic device 1, prevent the electronic device 1 from falling, and reduce the pressure on the holding member 25.

In the embodiment of the present disclosure, the device may further include an elastic support 27 disposed between the electronic device 1 and the mounting plate 2 , and the elastic support 27 may be integrated on the holder 25 or disposed on the mounting plate 2 . In the embodiment where the elastic support member 27 is provided on the retaining member 25, the elastic support member 27 can be an elastic piece with one end connected to the upright column 251 and the other end forming an angle with the upright column 251. When it is necessary to remove the retaining member 25 from the guide portion When the electronic device 11 is taken out, the elastic support member 27 is compressed and deformed. When the retaining member 25 is installed in the guide portion 11 , the elastic support member 27 can effectively support the electronic device 1 .

Further, in the embodiment where the elastic support member 27 is provided on the mounting plate 2, as shown in Figure 60, the elastic support member 27 may be a plate-like structure fixed to the mounting plate 2 in the middle and extending diagonally upward at both ends; or in the middle The structure of the bulge, which is fixed to the mounting plate 2 at both ends, can be one plate or composed of multiple plates, and its principle is similar to that of a leaf spring. In the first installation state, the elastic support member 27 is deformed, and the elastic support member 27 is in a compressed state as a whole, which will not affect the fit between the electronic device 1 and the mounting plate 2; in the second installation state, the elastic support member 27 is stuck The claw does not deform, and its contact with the electronic device 1 can effectively support the electronic device 1 .

In order to solve the above problem, according to an embodiment of the present disclosure, as shown in FIGS. 62 to 72 , the connection mechanism may include a slide groove 29 and a slide block 170 that slides with the slide groove 29 . At least one of the slide blocks may be provided with a slide groove 29 on one of the plurality of electronic devices 1 and the mounting plate 2, and a slide block 170 slidingly mated with the slide groove 29 may be provided on the other. The slide groove 29 and At least one of the sliders 170 is multiple. The slider 170 selectively cooperates with different slide grooves 29 to maintain the electronic device 1 in multiple installation states. In addition, the installation state at least includes a first installation state and a second In the installation state, in the first installation state, the electronic device 1 and the mounting plate 2 are basically arranged in close contact; in the second installation state, a heat dissipation gap is formed between the electronic device 1 and the mounting plate 2 .

It should be noted that the present disclosure includes an embodiment in which the slider 170 is provided on the electronic device 1 and the chute 29 is provided on the mounting plate 2. It also includes an embodiment in which the slider 170 is disposed on the mounting plate 2 and the chute 29 is disposed on the electronic device. The embodiment in 1 and the connection method that can realize the sliding fit between the electronic device 1 and the mounting plate 2 all belong to the protection scope of the present disclosure, and will be introduced in detail below using the former as an example. Regarding the number of slide blocks 170 and slide grooves 29 , the present disclosure includes embodiments in which there is one slide block 170 and multiple slide grooves 29 and the number is not limited. It also includes multiple slide blocks 170 and an equal number of slide grooves 29 . Or even more embodiments, including one chute 29 and multiple slide blocks 170 and the number is not limited, also including multiple chute 29 and an equal number or even more slide blocks 170 . Example.

In the embodiment of the present disclosure, the mounting plate 2 can be pasted and fixed on the component backplane 31 through 3M tape or a glue structure. The electronic device 1 and the mounting plate 2 are matched through the slider 170 and the chute 29, thereby connecting the electronic device 1 is installed on the module backplane 31. In this way, the photovoltaic modules and the electronic equipment 1 can be pre-installed in an integrated manner at the factory, and the original thickness space of the module backplane 5 and the photovoltaic module frame 51 can be used to install the electronic equipment 1 , to avoid additional product packaging of electronic equipment 1 and occupying freight space, and to meet the needs of packaging and transportation scenarios.

Through the above technical solution, in the device for installing electronic equipment 1 to photovoltaic modules provided by the present disclosure, through integrated pre-assembly at the factory, the existing thickness space of the photovoltaic module is used to install the electronic equipment 1, which can reduce The cost of separately packaging and transporting the electronic device 1; through the structural design of the slider 170 and the chute 29, the electronic device 1 can be switched between the first installation state and the second installation state. In the first installation state, it can be Possibly reduce the distance between the electronic device 1 and the mounting plate 2, which can meet the factory requirements of low thickness and small space occupation; in the second installation state, a heat dissipation gap is formed between the electronic device 1 and the mounting plate 2 to meet the requirements of the component back. The heat dissipation requirements of the board 31 and the electronic device 1 can also ensure the stability of the connection between the electronic device 1 and the mounting board 2 . In addition, the electronic device 1 only needs to be moved in a predetermined direction to quickly switch between the first installation state and the second installation state. The installation structure provided by the present disclosure is easy to operate and reduces irregularities. Minimizing risks, the installation method does not require excessive operations, no additional nailing or other structures, and the efficiency of installation and disassembly is improved.

In the present disclosure, the electronic device 1 can move along the extension direction of the chute 29 relative to the mounting plate 2. The slider 170 slides into the chute 29 to realize the connection between the electronic device 1 and the mounting plate 2. The slider 170 slides out. The chute 29 can unlock the connection between the electronic device 1 and the mounting plate 2, quickly switch between multiple installation states, and the operation is simple and convenient.

Further, as shown in Figures 62 to 68, both the slide groove 29 and the slide block 170 can extend in the up and down direction. There is at least one slide block 170. There are multiple slide grooves 29 and they are arranged in parallel along the thickness direction. The second installation state Relative to the first installation state, the position of the electronic device 1 only changes in the thickness direction. When positioning and maintaining the electronic device 1 , the electronic device 1 is attached to the mounting plate 2 or the electronic device 1 is lifted to maintain a sufficient gap. And in this embodiment, the positioning position of the electronic device 1 in the thickness direction is directly adjusted to achieve switching between the first installation state and the second installation state.

In an exemplary embodiment of the present disclosure, taking one slider 170 and two slide grooves 29 as an example, as shown in FIGS. 62 to 64 and 69 to 70 , the slide groove 29 may include a first slide groove. 291 and the second slide groove 292, the slide block 170 may include a first slide block 171, in the first installation state, the first slide block 171 is located in the first slide groove 291, in the thickness direction of the electronic device 1, the mounting plate 2 is basically set up to fit the electronic device 1. When the electronic device 1 moves, the first slider 171 slides out of the first chute 291, slides into the second chute 292, and switches from the first installation state to the second installation state. In the second installation state, the first slider 171 is located in the second slide groove 292, and the mounting plate 2 is spaced apart from the electronic device 1 in the thickness direction of the electronic device 1 to form a heat dissipation gap. The first slider 171 is arranged closer to the back of the electronic device 1. In this way, in the first installation state, the electronic device 1 and the mounting plate 2 can be ensured to fit as closely as possible. The first slider 291 and the second slider 292 are aligned in the thickness direction. The distance above determines the size of the heat dissipation gap, and the position of the chute can be designed as needed.

In another exemplary embodiment of the present disclosure, taking two slide blocks 170 and two slide grooves 29 as an example, as shown in Figures 65, 66, 69 and 70, the slide block 170 may also include a third Two slide blocks 172. In the first installation state, the first slide block 171 is located in the first slide groove 291, and the second slide block 172 is located in the second slide groove 292. In the thickness direction of the electronic device 1, the mounting plate 2 with electronic devices 1 Basic fit settings. The electronic device 1 moves, the first slider 171 and the second slider 172 slide out of the first slider 291 and the second slider 292 at the same time, the first slider 171 slides into the second slider 292, and the first slider 171 slides into the second slider 292. The status switches to the second installation status. In the second installation state, the first slider 171 is located in the second slider 292, and the first slider 291 and the second slider 172 are free. The free here means that there is no matching slider 170 in the first slider 291. , the second slide block 172 does not match the slide groove 29 . In the thickness direction of the electronic device 1, the mounting plate 2 is spaced apart from the electronic device 1 and forms a heat dissipation gap. Compared with one slider 170, the arrangement of two sliders 170 can make the electronic device 1 and the mounting plate 2 more compatible in the first installation state, and improve the overall stability and reliability of the device.

In another exemplary embodiment of the present disclosure, as shown in FIGS. 67 to 72 , the chute 29 may also include at least one third chute 293 , and the slider 170 selects a corresponding number of chute 29 to connect, and the mounting plate The size of the thermal gap between 2 and electronic device 1 is different. Multiple chutes 29 can provide different heat dissipation gap sizes for the entire device, increasing operator choice. At this time, the number of slide blocks 170 may be one or more. Any arrangement in which the number of slide blocks 170 is less than or equal to the number of slide grooves 29 is within the protection scope of the present disclosure.

According to an embodiment of the present disclosure, as shown in Figures 67, 70 to 72, along the extending direction of the chute 29 and the slider 170, one end of the chute 29 is provided with an opening for the slider 170 to slide in, The other end may be provided with a blocking portion 294 that prevents the slider 170 from sliding out of the chute 29 to prevent the slider 170 from sliding out of the chute 29 . In addition, in this embodiment, a limited support (not shown in the figure) can also be provided at the lower part of the mounting plate 2, so that the electronic device 1 can be supported and limited in both the first installation state and the second installation state. The support is used to contact the bottom surface of the electronic device 1 to support the electronic device 1, prevent the electronic device 1 from falling, and reduce the pressure on the blocking portion 294.

According to an embodiment of the present disclosure, along the extending direction of the chute 29 and the sliding block 170 , the sizes of the chute 29 and the sliding block 170 may gradually decrease or gradually increase. The gradually extending arrangement of the slider 170 and the chute 29 has the same function as the blocking portion 294 , that is, it plays a limiting role to prevent the slider 170 from sliding out of the opening at the end of the chute 29 .

According to an embodiment of the present disclosure, as shown in FIGS. 62 to 72 , the slider 170 has a first side connected to the electronic device 1 and a second side opposite to the first side. In the thickness direction, the second side side The size of the chute 29 is larger than the size of the first side, and the size of the slot opening of the chute 29 is smaller than the size of the bottom of the chute 29 . Among them, the size of the opening of the chute 29 is the smallest and can gradually increase toward the bottom of the chute 29 . The size of the connection point between the slider 170 and the electronic device 1 is the smallest and can gradually increase toward the end away from the electronic device 1 . This arrangement is to restrict the slider 170 from sliding in the direction of the slide groove 29 and prevent the slider 170 from laterally disengaging from the slide groove 29 . In addition, the maximum width of the slider 170 is larger than the size of the notch of the slider 29 to ensure that the slider 170 can be stuck into the slider 29 and will not cause the slider 170 to come out laterally. The cross section of the chute 29 can be trapezoidal, semicircular, etc. In addition, the cross section of the chute 29 can also be a cross-sectional shape that matches the slide block. The shape of the slide block 170 can match the shape of the chute 29. This disclosure does not limit this.

According to an embodiment of the present disclosure, as shown in FIGS. 62 to 68 , the slider 170 can be provided on the electronic device 1 and the sliders 170 are respectively provided on the two opposite side walls of the electronic device 1 , and the slider 170 is provided on the mounting plate 2 Two oppositely arranged vertical boards 28 are fixed. The chute 29 is opened on the inner side of the vertical boards 28 . The distance between the two vertical boards 28 is adapted to the installation width of the electronic device 1 . Two sets of sliders 170 and vertical plates 28 are provided to better support the electronic device 1. Both sides slide in or out at the same time to improve the stability of the cooperation between the mounting plate 2 and the electronic device 1.

Back-mounted installation

In the present disclosure, as shown in Figures 73 to 74, a slot 14 may be opened on the back of the electronic device 1, and the device for installing the electronic device to the photovoltaic module also includes a back that can be inserted and fixed in the slot 14. The electronic device 1 can be selectively connected to the back hanging plate 4 or the mounting plate 2. The device provided by the present disclosure for installing electronic equipment to photovoltaic modules has a third installation state. In the third installation state , the back hanging board 4 is inserted into the slot 14 and connected to the electronic device 1. After the back hanging board 4 is inserted into the slot 14, it can be connected with a transition fit or an interference fit. The back hanging board 4 is also provided with a protrusion toward the electronic device 1. The abutment top 41 is raised, and the abutment top 41 can cooperate with the electronic device 1, so that the back hanging plate 4 and the electronic device 1 can be more closely connected, so that the back hanging plate 4 and the electronic device 1 are not easily disassembled. At the same time, the part of the back mounting plate 4 extending out of the slot 14 is provided with an external hanging hole to facilitate connection with the outside world. The slot 14 is recessed in the back of the electronic device 1 so that the back mounting plate 4 can be flush with the back of the electronic device 1 after being inserted. Therefore, it does not interfere with the installation position of the mounting plate 2, as shown in Figure 75, and does not occupy additional space. , and the thickness of the electronic device 1 is not increased. In addition, as shown in Figure 74, an extension groove extends between the side of the slot 14 and the back of the electronic device 1, and the side of the back hanging plate 4 is provided with a flange to cooperate with the extending groove, so that the back hanging plate 4 can be inserted into the When the electronic device 1 is installed, it can enter and exit along the fixed track to limit the position of the back mounting plate 4 to prevent improper cooperation between the back mounting plate 4 and the electronic device 1, causing the installation of the electronic device 1 to be skewed and affecting the use effect. During the installation process, it is provided The guiding function makes the installation process smoother and can be operated blindly. It is especially suitable for photovoltaic modules that do not meet the pre-installation conditions in advance, such as double-glass bifacial module products that do not block the back cells, and the module frame height is less than 35mm, so as to meet the requirements of Usage requirements in different scenarios.

When the device for installing electronic equipment to photovoltaic modules is in the third installation state, the electronic equipment 1 can be mounted on the photovoltaic module frame 51 in a back-mounted manner. At this time, the photovoltaic module frame 51 can be provided with bolts, and the electronic equipment 1 can Hang on the bolts through the hanging holes on the mounting plate 2. Through the above settings, when the thickness of the photovoltaic module frame 51 meets the conditions for integrated pre-assembly, the electronic device 1 can be connected to the mounting plate 2 fixed on the module backplane 5; For module products with installation conditions, for example, when the thickness of the photovoltaic module frame 51 is thin, the electronic device 1 will affect the packaging of the module product in the first installation state, or for double-glass bifacial module products that do not block the back battery, the electronic device can Choose to install it on the photovoltaic module frame 51 to increase the application scenarios of the device, and install it according to needs and usage scenarios.

According to a second aspect of the present disclosure, an electronic module is also provided, including an electronic device 1 and the device for installing the electronic device to a photovoltaic module introduced above. Taking the electronic device 1 as a photovoltaic optimizer as an example, the photovoltaic optimization The optimizer includes an optimizer body. The optimizer body can be installed on the module backplane 5 through the device for installing electronic equipment to the photovoltaic module introduced above. The optimizer body can be provided with a first holding member or a second holding member. . The electronic device 1 in this article can also be an inverter, a converter and other devices, and other wiring devices that need to be installed externally are also included in the scope of the electronic device 1 .

According to a third aspect of the present disclosure, a photovoltaic component is also provided, the photovoltaic component comprising a group The component backplane 5 and the electronic module provided by the present disclosure can be a photovoltaic optimizer in the electronic device 1. The electronic device 1 is fixed on the component backplane 5 through the mounting plate 2, or is installed on the photovoltaic component frame 51 through the back hanging plate 4. When the device for installing the electronic equipment to the photovoltaic module is in the first installation state or the second installation state mentioned above, integrated pre-installation of the electronic equipment and the photovoltaic module can be achieved.

The device embodiments described above are only illustrative. The units described as separate components may or may not be physically separated. The components shown as units may or may not be physical units, that is, they may be located in One location, or it can be distributed across multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment. Persons of ordinary skill in the art can understand and implement the method without any creative effort.

Reference herein to "one embodiment," "an embodiment," or "one or more embodiments" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. In addition, please note that the examples of the word "in one embodiment" here do not necessarily all refer to the same embodiment.

In the instructions provided here, a number of specific details are described. However, it is understood that embodiments of the present application may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this description.

In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The application may be implemented by means of hardware comprising several different elements and by means of a suitably programmed computer. In the element claim enumerating several means, several of these means may be embodied by the same item of hardware. The use of the words first, second, third, etc. does not indicate any order. These words can be interpreted as names.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present application, rather than to Limitations: Although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent substitutions for some of the technical features; However, these modifications or substitutions do not cause the essence of the corresponding technical solution to deviate from the spirit and scope of the technical solution of each embodiment of the present application.

Claims

A device for installing electronic equipment to photovoltaic modules, characterized by comprising:

A mounting plate for mounting electronic equipment to the module backplane of the photovoltaic module;

A connection mechanism, the connection mechanism is at least disposed between the mounting plate and the electronic device to maintain the electronic device in different installation states;

The installation state at least includes a first installation state and a second installation state. In the first installation state, the electronic device and the mounting plate are basically arranged in close contact; in the second installation state, the electronic device A heat dissipation gap is formed between the mounting plate and the mounting plate.
The device for mounting electronic equipment to photovoltaic modules according to claim 1, wherein the connection mechanism includes a first retaining member and a plurality of second retaining members; wherein,

The first holder is disposed on one of the electronic device and the mounting plate, and the plurality of second holders is disposed on the other one of the electronic device and the mounting plate. The first retaining member is selected from the plurality of second retaining members to cooperate with different second retaining members to maintain the electronic device in different installation states.
The device for mounting electronic equipment to photovoltaic modules according to claim 2, characterized in that:

In the second installation state, relative to the first installation state, the holding position of the electronic device only changes in the thickness direction; or

In the second installation state, relative to the first installation state, the holding position of the electronic device changes in both the thickness direction and the up-down direction.
The device for mounting electronic equipment to photovoltaic modules according to claim 2, characterized in that the first retaining member is a first limiting member, and there are two second retaining members, each of which is the same as the first retaining member. The first positioning member and the second positioning member cooperated with the first limiting member,

In the first installation state, the first positioning member cooperates with the first limiting member, and in the thickness direction of the electronic device, the mounting plate and the electronic device are basically arranged in contact with each other. ;

In the second installation state, the second positioning member cooperates with the first limiting member, and in the thickness direction of the electronic device, the mounting plate is spaced apart from the electronic device and forms a The heat dissipation gap;

Preferably, the first positioning member and the second positioning member are located on the same straight line along the up and down direction, and in the thickness direction, the second positioning member is used to cooperate with the positioning end of the first limiting member. The positioning end of the first positioning member is higher than the positioning end of the first positioning member for cooperating with the first limiting member;

Preferably, the first limiting member is a limiting hole, the first positioning member and the second positioning member are positioning hooks, and the positioning end is a combination of the positioning hook and the limiting hole. Location.
The device for mounting electronic equipment to photovoltaic modules according to claim 2, characterized in that the first retaining member is a first positioning member, and there are two second retaining members, each of which is connected to the first positioning member. The first limiting piece and the second limiting piece that match the first positioning piece,

In the first installation state, the first positioning member cooperates with the first limiting member, and in the thickness direction of the electronic device, the mounting plate and the electronic device are basically arranged in contact with each other. ;

In the second installation state, the first positioning member cooperates with the second limiting member, and in the thickness direction of the electronic device, the mounting plate is spaced apart from the electronic device and forms a The heat dissipation gap;

Preferably, the first limiting member and the second limiting member are spaced apart in the thickness direction of the electronic device.
The device for mounting electronic equipment to photovoltaic modules according to claim 5, characterized in that the first limiting member and the second limiting member are arranged staggered in both the thickness direction and the up-down direction.
The device for mounting electronic equipment to a photovoltaic module according to claim 2, wherein the first retaining member is configured as a buckle or a plug, and the second retaining member is configured to engage with the buckle. A matching snap hole or a slot matching the latch.
The device for installing electronic equipment to photovoltaic modules according to claim 2, characterized in that the device further includes a chute provided on the electronic equipment and a slide track provided on the mounting plate. Support; the slide support is in sliding cooperation with the chute, guides when switching from the first installation state to the second installation state, and is used to support the electronics in the second installation state. equipment;

Preferably, the slide support and the slide groove extend in the up and down direction and respectively have slopes extending in the up and down direction, and the end of the slide groove is formed with an opening for the slide support to slide in;

Preferably, the starting end of the slope corresponds to the position of the first limiting member or the first positioning member, so that in the first installation state, the electronic device is in contact with the mounting plate. The highest end of the slope corresponds to the position of the second limiting member or the second positioning member, so that in the second installation state, the slide support supports the lifted electronic equipment for support;

Preferably, the height at which the electronic device is lifted is the distance between the first limiting member and the second limiting member in the thickness direction, or the distance between the positioning end of the second positioning member and the first positioning member. The height difference of the positioning end of the positioning member, and the distance or the height difference is equal to the height of the inclined surface in the thickness direction;

Preferably, the slide support and the slide groove are a set, the slide support is provided at the middle position of the mounting plate, and the slide groove is provided at the middle position of the electronic device; or

The slide support and the chute are two groups, the two sets of slide supports are symmetrically arranged on both sides of the mounting plate, and the two sets of chute are symmetrically arranged on both sides of the electronic device.
The device for mounting electronic equipment to a photovoltaic module according to claim 2, wherein The feature is that a limiting support is provided at the bottom of the mounting plate, and in the second installation state, the limiting support is used to abut against the bottom surface of the electronic device.
The device for mounting electronic equipment to photovoltaic modules according to claim 2, characterized in that the device further includes a third positioning member provided on the mounting plate and a third positioning member provided on the electronic equipment. Three limiting parts. In the second installation state, the third positioning part is cooperatively connected with the third limiting part.
The device for mounting electronic equipment to photovoltaic modules according to claim 2, characterized in that one of the first holding parts and the corresponding plurality of second holding parts constitute a set of holding components, and the electronic equipment At least one set of holding components is symmetrically arranged on the left and right sides of the equipment and the mounting plate, and the number of holding components on both sides is the same.
The device for mounting electronic equipment to photovoltaic modules according to claim 2, characterized in that one of the first retaining member and the second retaining member is a buckle, and the other is a limiting hole. , the device further includes an elastic support member disposed between the electronic device and the mounting plate, the elastic support member being integrated on the buckle or disposed on the mounting plate;

Preferably, the buckle has a fixed end connected to the mounting plate and a positioning end used to engage with the limiting hole, and the buckle is located between the fixed end and the positioning end. The part between is provided with an opening, one end of the elastic support member is connected to the opening, and the other end is a free end and extends obliquely in the direction toward the positioning end;

Preferably, the electronic device is provided with an escape portion at a position corresponding to the elastic support member, and in the first installation state, the free end of the elastic support member acts on the position of the escape portion. .
The device for mounting electronic equipment to photovoltaic modules according to claim 2, characterized in that one of the first retaining member and the second retaining member is a plug, and the other is a pin. position hole, the device further includes a driving mechanism connected to the latch, the driving mechanism is used to drive the latch to move toward or away from the limiting hole to connect the first retaining member to the third The two retaining parts are matched or separated;

Preferably, the mounting plate is provided with a receiving frame, the plug is installed in the receiving frame, and the receiving frame can be extended or retracted, and the driving mechanism includes an operating piece connected to the plug and one end. The elastic member is pressed against the inner wall of the receiving frame, and the other end is pressed against the latch. A slot is formed on the receiving frame, and the operating member is close to or away from the limiting hole along the slot. directional movement to unlock the first installation state and the second installation state;

Preferably, a plurality of the latch pins share the same operating member.
The device for installing electronic equipment to photovoltaic modules according to claim 1, characterized in that the connection mechanism includes:

A folding mechanism, the folding mechanism is connected between the electronic device and the mounting plate;

The electronic device can move relative to the mounting plate along a folding or unfolding direction of the folding mechanism to switch the electronic device between a first installation state and a plurality of second installation states.
The device for mounting electronic equipment to photovoltaic modules according to claim 14, characterized in that the mounting plate and the electronic equipment are arranged oppositely, and the folding mechanism is folded along the thickness direction of the electronic equipment or When unfolded, the folding mechanism has multiple unfolding positions, and the sizes of the heat dissipation gaps formed between the electronic device and the mounting board are different.
The device for mounting electronic equipment to photovoltaic modules according to claim 14, characterized in that the folding mechanism is configured as a folding bracket composed of a hinged rod, and the folding bracket is in a stowed position and a plurality of unfolding positions. Able to self-lock.
A device for mounting electronic equipment to a photovoltaic module according to claim 16, It is characterized in that the folding bracket includes a first fixed rod fixed on the mounting plate, a second fixed rod fixed on the electronic device, and a movement rod, the first fixed rod and the second fixed rod. The fixed rods are arranged in the same direction, and the two ends of the moving rod are respectively hinged with the ends of the first fixed rod and the second fixed rod to form a Z-shaped folding bracket.
The device for mounting electronic equipment to photovoltaic modules according to claim 17, characterized in that the first fixed rod, the moving rod and the second fixed rod have the same size in the thickness direction, so The hinge points of the first fixed rod and the moving rod, and the hinge points of the second fixed rod and the moving rod are respectively located on opposite sides of the moving rod,

In the first installation state, the first fixed rod, the moving rod and the second fixed rod overlap, and the distance between the mounting plate and the electronic device is Dimensions in thickness direction;

In the second installation state, the moving rod forms an angle with the first fixed rod and the second fixed rod respectively, and the heat dissipation gap between the mounting plate and the electronic device depends on the clip. horn.
The device for installing electronic equipment to photovoltaic modules according to claim 163, characterized in that the number of the folding mechanisms is at least two, and they are spaced apart along the length direction and/or width direction of the electronic equipment. between the electronic device and the mounting plate.
The device for mounting electronic equipment to photovoltaic modules according to claim 14, characterized in that the folding mechanism is configured as a flexible support member, the flexible support member has openings at both ends and a flexible cavity in the middle, The openings at both ends are connected to the mounting plate and the electronic device respectively, and the flexible cavity is formed by at least two folding sheets that are foldably connected in sequence, and the folding sheets are annular.
A device for mounting electronic equipment to a photovoltaic module according to claim 20, It is characterized in that along the unfolding direction of the flexible support member, the inner diameters of the plurality of folding pieces are successively reduced, and in the first installation state, the plurality of folding pieces are nested with each other, and the mounting plate and The distance between the electronic devices is the width of the folded piece with the largest inner diameter;

In the second installation state, at least one of the folding pieces is unfolded, and the heat dissipation gap between the mounting plate and the electronic device depends on the number of unfolding folding pieces.
The device for mounting electronic equipment to photovoltaic modules according to claim 20, wherein the flexible support member is provided with a plurality of heat dissipation holes at intervals.
The device for mounting electronic equipment to photovoltaic modules according to claim 4, wherein the device further includes an elastic support member disposed between the electronic equipment and the mounting plate; in the first In an installation state, the elastic support member is compressed so that the mounting plate and the electronic device are basically in contact with each other; in the second installation state, the elastic support member returns to its original shape to support the electronic device. equipment.
The device for installing electronic equipment to photovoltaic modules according to claim 1, characterized in that the connection mechanism includes a guide part and a holder cooperatively connected with the guide part; wherein,

The guide portion is provided on one of the electronic device and the mounting plate, and the holder is provided on the other of the electronic device and the mounting plate;

The electronic device is movable relative to the mounting plate along an extension direction of the guide portion to switch the electronic device between a first installation state and a plurality of second installation states.
The device for mounting electronic equipment to photovoltaic modules according to claim 24, characterized in that the guide portion at least includes a first section, a second section and a second section located between the first section and the second section. The lifting section between

In the first installation state, the retaining member is located in the first section, and when the electronic device In the thickness direction of the device, the mounting plate and the electronic device are basically arranged to fit together;

The electronic device moves, the retaining member enters the second section through the lifting section, and switches from the first installation state to the second installation state;

In the second installation state, the retaining member is located in the second section, and the mounting plate is spaced apart from the electronic device in the thickness direction of the electronic device to form the heat dissipation gap.
The device for mounting electronic equipment to photovoltaic modules according to claim 25, characterized in that the first section and the second section are arranged in parallel and simultaneously in the up and down direction and the thickness direction of the electronic equipment. They are staggered upward, one end of the lifting section is connected to the end of the first section, and the other end of the lifting section is connected to the end of the second section.
The device for installing electronic equipment to photovoltaic modules according to claim 25, characterized in that there are multiple second sections arranged in parallel, there are multiple lifting sections, and one end of the lifting section is connected to The other end of the same first section is connected to a different second section. The retaining member is selected to position and cooperate with the different second section through the corresponding lifting section. A heat dissipation gap is formed between the electronic device and the mounting plate. The sizes are different.
The device for mounting electronic equipment to photovoltaic modules according to claim 25, wherein the second sections are multiple and are arranged in parallel and spaced apart in the up and down direction, and the lifting sections are multiple, The first section and the second section and between two adjacent second sections are all connected by the lifting section, and the holding member is selected to be connected to the different second section through the corresponding lifting section. The segments are positioned and matched, and the dimensions of the heat dissipation gap formed between the electronic device and the mounting board are different.
The device for mounting electronic equipment to photovoltaic modules according to claim 25, wherein a plurality of second sections are arranged in parallel, and a plurality of second sections are connected through connecting sections, and the lifting One end of the section is connected to the first section, and the other end of the lifting section is connected to the As for the connecting section, the retaining member can be positioned and matched with different second sections through the lifting section and the connecting section, and the size of the heat dissipation gap formed between the electronic device and the mounting plate is different.
The device for installing electronic equipment to photovoltaic modules according to claim 25, characterized in that the holder includes a column and a latching protrusion, one end of the column is fixedly connected to the mounting plate, and the other end is provided with a The clamping protrusion is arranged toward the middle of the mounting plate.
The device for mounting electronic equipment to a photovoltaic module according to claim 30, wherein the clamping protrusion includes a fitting portion that can slide back and forth in the guide portion and a fitting portion that prevents the clamping protrusion from sliding away from the guide portion. The fitting portion is configured as a conical structure with an axis diameter gradually increasing in a direction away from the upright column.
The device for mounting electronic equipment to photovoltaic modules according to claim 24, characterized in that the guide portion is provided on two opposite side walls of the electronic equipment, and the holding member is provided on the mounting They are arranged oppositely on the board, and the distance between the oppositely arranged holders is adapted to the installation width of the electronic device.
The device for mounting electronic equipment to photovoltaic modules according to claim 24, wherein the guide part is a slide groove, and the retaining member is a latching structure that slides with the slide groove.
The device for installing electronic equipment to photovoltaic modules according to claim 24, characterized in that a limiting support is provided at the bottom of the mounting plate, and in the second installation state, the limiting support is used to resist Connected to the bottom of the electronic device.
The device for mounting electronic equipment to a photovoltaic module according to claim 24, characterized in that the device further includes an elastic support disposed between the electronic equipment and the mounting plate, the elastic support The parts are integrated on the retaining part or arranged on the mounting plate.
The device for installing electronic equipment to photovoltaic modules according to claim 1, characterized in that the connection mechanism includes a slide groove and a slide block slidingly mated with the slide groove, and the slide groove and the slide block At least one of the blocks is multiple;

The chute is provided on one of the electronic equipment and the mounting plate, and the slider is provided on the other of the electronic equipment and the installation plate; the slider is selected with different The chute cooperates to maintain the electronic device in a plurality of installed states.
The device for installing electronic equipment to photovoltaic modules according to claim 36, characterized in that the electronic equipment moves relative to the mounting plate along the extending direction of the slide groove, and the slider slides into the The slider slides out of the chute to switch between the multiple installation states.
The device for installing electronic equipment to photovoltaic modules according to claim 36, characterized in that both the slide groove and the slide block extend in the up and down direction, there is at least one slide block, and the slide groove There are multiple electronic devices and they are arranged in parallel along the thickness direction. In the second installation state, relative to the first installation state, the position of the electronic device only changes in the thickness direction.
The device for mounting electronic equipment to photovoltaic modules according to claim 38, wherein the chute includes a first chute and a second chute, and the slide block includes a first slide block,

In the first installation state, the first slider is located in the first chute, and in the thickness direction of the electronic device, the mounting plate and the electronic device are basically arranged in close contact;

The electronic device moves, the first slider slides out of the first chute, slides into the second chute, and switches from the first installation state to the second installation state;

In the second installation state, the first slider is located in the second slide groove, and the mounting plate is spaced apart from the electronic device in the thickness direction of the electronic device and forms the heat dissipation gap.
The device for mounting electronic equipment to photovoltaic modules according to claim 39, wherein the slider further includes a second slider,

In the first installation state, the first slider is located in the first chute, and the second slider is located in the second chute. In the thickness direction of the electronic device, the The mounting plate and the electronic device are basically arranged to fit together;

The electronic device moves, the first slider and the second slider slide out of the first chute and the second chute at the same time, and the first slider slides into the second A chute that switches from the first installation state to the second installation state;

In the second installation state, the first slider is located in the second slider, and the first slider and the second slider are free. In the thickness direction of the electronic device, the The mounting plate is spaced apart from the electronic device and forms the heat dissipation gap.
The device for installing electronic equipment to photovoltaic modules according to claim 38 or 39, characterized in that the chute further includes at least one third chute, and the slider selects a corresponding number of chute to connect. , the size of the heat dissipation gap between the mounting plate and the electronic device is different.
The device for installing electronic equipment to photovoltaic modules according to claim 36, characterized in that, along the extending direction of the chute and the slider, one end of the chute is provided with a hole for the slider to The other end of the sliding opening is provided with a blocking portion to prevent the slide block from sliding out of the chute.
The device for mounting electronic equipment to photovoltaic modules according to claim 36, wherein the sizes of the chute and the slider gradually decrease along the extending direction of the chute and the slider. Small or gradually increasing.
The device for mounting electronic equipment to a photovoltaic module according to claim 36, wherein the slider has a first side connected to the electronic equipment and a second side opposite to the first side. side, in the thickness direction, the size of the second side is larger than the size of the first side, and the size of the slot opening of the chute is smaller than the size of the bottom of the chute.
The device for installing electronic equipment to photovoltaic modules according to claim 36, characterized in that the slide blocks are respectively provided on two opposite side walls of the electronic equipment, and two mounting plates are fixed on the mounting plate. There are two vertical boards arranged oppositely, the chute is opened on the inner side of the vertical board, and the distance between the two vertical boards is adapted to the installation width of the electronic equipment.
The device for mounting electronic equipment to photovoltaic modules according to claim 36, characterized in that the cross-section of the slider is configured in a trapezoidal or sectoral shape, and the shape of the chute is adapted to the slider.
The device for mounting electronic equipment to photovoltaic modules according to claim 1, characterized in that the device further includes a back-hanging plate, and the back-hanging plate can be inserted into and fixed on the opening on the back of the electronic equipment. In the slot, the electronic device is positioned and maintained in the installed state;

The back hanging plate is provided with an external hanging hole, and the electronic device is installed on the photovoltaic module frame through the external hanging hole.
An electronic module, characterized by comprising electronic equipment and according to claims 1-47 The device for mounting electronic equipment to a photovoltaic module according to any one of the above.
A photovoltaic module includes a module backplane, characterized in that the photovoltaic module further includes an electronic module according to claim 48.