WO2023177347A1 - A system and method for placement of at least one conductor pin - Google Patents

A system and method for placement of at least one conductor pin Download PDF

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Publication number
WO2023177347A1
WO2023177347A1 PCT/SG2022/050137 SG2022050137W WO2023177347A1 WO 2023177347 A1 WO2023177347 A1 WO 2023177347A1 SG 2022050137 W SG2022050137 W SG 2022050137W WO 2023177347 A1 WO2023177347 A1 WO 2023177347A1
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WO
WIPO (PCT)
Prior art keywords
template
pins
pin
target surface
conductor
Prior art date
Application number
PCT/SG2022/050137
Other languages
French (fr)
Inventor
Honggang Wang
Feng Yu
Tao Yu
Yongxin Wang
Original Assignee
Capcon Holdings (Beijing) Limited
Capcon Singapore Pte. Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Capcon Holdings (Beijing) Limited, Capcon Singapore Pte. Ltd. filed Critical Capcon Holdings (Beijing) Limited
Priority to PCT/SG2022/050137 priority Critical patent/WO2023177347A1/en
Priority to TW112109528A priority patent/TW202401599A/en
Publication of WO2023177347A1 publication Critical patent/WO2023177347A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

Definitions

  • the present invention relates to the field of semiconductor manufacturing.
  • each respective layer should be electrically coupled to one another, and a faulty/missing connection is likely to lead to issues with the fabricated product. It is typical that the electrical coupling is enabled using conductor pins.
  • the issues that can lead to issues with the fabricated product include, for example, missing conductor pins, incorrectly positioned conductor pins, poorly orientated conductor pins, and so forth.
  • a method for the placement of at least one conductor pin comprising: loading a first template with a plurality of conductor pins; aligning the first template with a target surface; and unloading the plurality of conductor pins to the target surface.
  • a second template is used to unload the at least one missing conductor pin, the first template being different from the second template, the second template being configured to be positioned and moved relative to at least two fiducials of the target surface.
  • a system for the placement of at least one conductor pin comprising: load a first template with a plurality of conductor pins; align the first template with a target surface; and unload the plurality of conductor pins to the target surface.
  • a second template is used to unload the at least one missing conductor pin, the first template being different from the second template, the second template being configured to be positioned and moved relative to at least two fiducials of the target surface.
  • FIG 1 shows a substrate including a plurality of glass panel units
  • FIG 2 shows a top view of relative movement of a template with one of the glass panel units of FIG 1 ;
  • FIG 3 shows a cross-sectional view of FIG 2 during a usage instance
  • FIG 4 shows a possible way of dislodging a pin from a template
  • FIGs 5A and 5B show flux dipping for different types of pins
  • FIG 6A shows an instance of mass unloading from a template
  • FIG 6B shows an instance of individual unloading from a template
  • FIG 7A shows locations of openings where pins are missing, while FIGs 7B and 7C show how the openings are filled;
  • FIG 8 shows a process flow for a method for placing at least one missing pin
  • FIG 9 shows two possible types of templates
  • FIG 10 shows a pre-aligning apparatus
  • FIG 11 shows loading of the pre-aligning apparatus of FIG 10
  • FIG 12 shows usage of the pre-aligning apparatus of FIG 10
  • FIG 13 shows a first method of loading pins of different shapes to a template
  • FIG 14 shows a second method of loading pins of different shapes to a template
  • FIG 15 shows a third method of loading pins of different shapes to a template
  • FIG 16 shows a fourth method of loading pins of different shapes to a template
  • FIG 17 shows a fifth method of loading pins of different shapes to a template
  • FIG 18 shows a process flow for a method of placement of at least one conductor pin.
  • the present invention provides a system and method for placement of at least one pin during manufacturing in the semiconductor industry, which ensures a low incidence of missing pins or improperly positioned pins during the manufacturing process.
  • the system and method can be used during both a manufacturing process, and can also be used in a quality assessment process. It should be appreciated that implementation of the system and method is advantageous in relation to yield and throughput.
  • the substrate 100 includes a plurality of glass panel units 105.
  • contact pins will be described in relation to placement on each of the glass panel units 105, however, it should be appreciated that the pins can also be placed on other surfaces, most likely on surfaces used in the semiconductor industry.
  • FIG 2 shows a top view of one of the glass panel units 105, where pin location openings 110 are already provided in this FIG. It should be noted that a subsequent portion of the description will provide a description on some methods to locate the pin openings 110 on each glass panel unit 105.
  • FIG 2 also shows a template 115, the template 115 being an apparatus which is configured to be loaded with a plurality of pins 130 at pre-defined positions which match the pin location openings 110 on each glass panel unit 105.
  • Each glass panel unit 105 includes at least two glass fiducials 125, and similarly, each template 115 also includes at least two template fiducials 120. Each of the glass fiducials 125 and template fiducials 120 can be printed indicia or a physical feature(s).
  • the purpose of the glass fiducials 125 and the template fiducials 120 is to ensure that the template 115 is able to be aligned with the glass panel unit 105, such that the plurality of pins 130 is able to be positioned in a desired manner at the glass panel unit 105.
  • the template 115 is movable in relation to the glass panel unit 105, but the converse is also possible.
  • FIG 2 provides an illustration of how the plurality of pins 130 are placed on the glass panel unit 105.
  • FIG 9A shows a mass pin template which is fully loaded with pins during use. Ideally, all pin location openings 110 of the glass panel unit 105 are filled with pins once the fully loaded mass pin template 115 is unloaded.
  • FIG 9B shows an individual pin template which will be used to fill openings 110 with missing pins, as detailed with reference in FIG 7.
  • FIG 3 shows a cross-sectional view of FIG 2 during a usage instance.
  • FIG 3 shows the glass panel unit 105, the template 115 and an additional template carrier 135.
  • the template carrier 135 is configured to transport the template 115, and to load/unload the plurality of pins 130 to/from the template 115.
  • the template carrier 135 relies on compressed air (pneumatic controls) when loading/unloading the plurality of pins 130.
  • a distance between the template 115 and the glass panel unit 105 is between 50 to 100 urn when the plurality of pins 130 is unloaded from the template 115.
  • FIG 3 illustrates how one pin 130 (out of three) is unable to be appropriately positioned in a desired opening 110 when the pin 130 is unloaded from the template 115.
  • the pin 130 is “stuck” in the template 115, and this leads to a situation illustrated in FIG 4, where the template carrier 135 initiates jerky movement in a horizontal plane (or X/Y axes) to ensure that the pin 130 is able to be unloaded to a desired opening 110.
  • the openings 110 are not well defined as shown in FIGs 3 and 4 due to manufacturing issues for the glass panel unit 105. Such manufacturing issues may also cause “stuck” pins 130 during unloading of the template 115 as shown in FIG 3.
  • FIG 5 shows flux dipping for different types of pins.
  • FIG 5A shows dipping for “I” type pins while
  • FIG 5B shows dipping for “pie” type pins.
  • a fluxer unit 140 with a receptacle 145 of liquid flux is shown, and all other parts are identically labelled as per earlier FIGs.
  • FIG 5 shows mass dipping of the pins 130 when loaded in the template 115 to ensure higher productivity.
  • FIG 6A shows an instance of mass unloading of pins 130 from the template 115 to a glass panel 105, where the template carrier 135 uses a mass flow meter 150 to control suction forces at pin receptacles 155 of the template 115 to ensure mass release of the pins 130 into pin location openings 110 of the glass panel 105.
  • FIG 6B shows an instance of individual unloading of pins from the template 115 to a glass panel 105 where the template carrier 135 uses respective mass flow meters 150(a), 150(b), 150(c) to control suction forces at respective pin receptacles 155 of the template 115 to ensure individual/singular release of the pins 130 into pin openings 110 of the glass panel 105.
  • FIG 7A shows a template 115 for individual pins as previously described in FIG 6B.
  • the template 115 is shown to have nine pin receptacles 155.
  • the corresponding positions 111 (a), 111 (b), 111 (c) are when fiducials 120 of the template 115 are aligned with fiducials of the glass panel 105. All subsequent movements of the template 115 are in relation to the aligned fiducials.
  • FIG 7B shows the template 115 being moved to place two missing pins at positions 111 (a), 111 (c) followed by movement to place the missing pin at position 111 (b). It should be appreciated that this two movement process is faster than moving the template 115 to place the pin at 111 (a), 111 (b), 111 (c) individually.
  • machine vision is used to ensure that there are no other empty pin location openings 110 to ensure high yield.
  • a process flow providing further details for FIG 7 is provided in FIG 8.
  • a method 800 for placing missing pins on a glass panel is shown in FIG 8.
  • machine vision is used to determine a position of empty pin location openings 110 on a glass panel 105.
  • the template 115 is then loaded with pins 130 used to fill the empty pin location openings 110.
  • fiducials of the template 115 and the glass panel 105 are aligned, and a controller then determines an efficient way to fill the empty pin location openings 110 at step 820.
  • machine vision is used to ensure that there are no other empty pin location openings 110 to ensure high yield.
  • the method 800 is advantageous in relation to time savings (minimising time to fill missing openings) to ensure high yield.
  • the pre-alignment apparatus 300 is configured to assist in loading the templates 115. Basically, the prealignment apparatus 300 is loaded with pins 130 before the pins 130 are loaded to the template 115. It should be noted that the pre-alignment apparatus 300 also includes at least two pre-alignment fiducials 305. Each of the pre-alignment fiducials 305 can be printed indicia or a physical feature(s).
  • the purpose of the pre-alignment fiducials 305 and the template fiducials 120 is to ensure that the template 115 is able to be aligned with the pre-alignment apparatus 300 as shown in FIG 12 such that the plurality of pins 130 is able to be positioned in a desired manner at the template 115.
  • FIG 11 the pre-alignment apparatus 300 is loaded from a pin chamber 400.
  • FIG 11 (A) illustrates loading of “I” type pins
  • FIG 11 (B) illustrates loading of “T” type pins
  • FIG 11 (C) illustrates “pie” type pins.
  • a holder of the pre-alignment apparatus 300 is configured to provide a suction force for the pins to be loaded to the pre-alignment apparatus 300.
  • FIG 13 there is shown a first method of loading pins of different shapes to a template (both mass or individual).
  • FIG 13(A) shows pins of an “I” type
  • FIG 13(B) shows pins of a “T” type
  • FIG 13(C) shows pins of a “pie” type.
  • FIG 13(A) shows how the template 115 for “I” type pins have a substantially conicalshaped pin receptacle 155 for the “I” type pins. It has been observed that the substantially conical-shaped pin receptacle 155 (bottom view of the receptacle is shown) is advantageous in loading the “I” shaped type pins in an efficient manner such that the “I” type pins are securely held in the conical-shaped pin receptacle 155 in a desired orientation and can also be unloaded in the desired orientation.
  • FIG 13(B) shows how the template 115 for “T” type pins have a substantially pyramidal-shaped pin receptacle 155 for the “T” type pins.
  • the substantially pyramidal-shaped pin receptacle 155 (bottom view of the receptacle is shown) is advantageous in loading the “T” shaped type pins in an efficient manner such that the “T” type pins are securely held in the pyramidal-shaped pin receptacle 155 in a desired orientation and can also be unloaded in the desired orientation.
  • FIG 13(C) shows how the template 115 for “pie” type pins have a substantially pillshaped pin receptacle 155 for the “pie” type pins. It has been observed that the substantially pill-shaped pin receptacle 155 (bottom view of the receptacle is shown) is advantageous in loading the “pie” shaped type pins in an efficient manner such that the “pie” type pins are securely held in the pill-shaped pin receptacle 155 in a desired orientation and can also be unloaded in the desired orientation.
  • the pill-shaped pin receptacle 155 is shown to include four suction channels to ensure correct loading orientation for the “pie” type pins (horizontal orientation rather than vertical).
  • FIG 13 shows pins 130 being loaded into the receptacles 155 with the use of periodic compressed air from a base 200 such that the pins are suspended in air in a pin chamber and able to be loaded into the receptacles 155 using suction forces. Subsequently, a flow meter for the receptacles 155 is able to detect if any of the receptacles 155 is not loaded. It is advantageous that the template 115 need not be flipped before the pins 130 are unloaded from the template 115. Referring to FIG 14, there is shown a second method of loading pins of different shapes to a template.
  • FIG 14(A) shows pins of an “I” type
  • FIG 14(B) shows pins of a “T” type.
  • the second method can also be used for “pie” type pins.
  • FIG 14 shows pins 130 being loaded into the receptacles 155 with the use of periodic compressed air from a base 200 such that the pins are suspended in air in a pin chamber and able to be loaded into the receptacles 155 using suction forces and an alignment guide 180 positioned adjacent to the template 115.
  • the alignment guide 180 can include conical, pyramidal or cylindrical channels 185 for guiding an aligning the pins 130 in a desired orientation.
  • the second method allows for use of a thinner template 115.
  • a flow meter for the receptacles 155 is able to detect if any of the receptacles 155 is not loaded. It is advantageous that the template 115 need not be flipped before the pins 130 are unloaded from the template 115.
  • FIG 15 there is shown a third method of loading pins of different shapes to a template.
  • the third method also utilises the alignment apparatus 300 as per FIG 11.
  • FIG 15(A) shows pins of an “I” type
  • FIG 15(B) shows pins of a “pie” type
  • FIG 15(C) shows pins of a “T” type.
  • FIG 15 shows pins 130 being loaded in the alignment apparatus 300.
  • the pins 130 are loaded in the alignment apparatus 300 before the alignment apparatus 300 is moved to an adjacent position to the template 115 where the pins 130 are then loaded to the template 115.
  • the third method also allows for use of a thinner template 115.
  • a flow meter for the receptacles 155 is able to detect if any of the receptacles 155 is not loaded. It is advantageous that the template 115 need not be flipped before the pins 130 are unloaded from the template 115.
  • FIG 16 there is shown a fourth method of loading pins of different shapes to a template.
  • FIG 16(A) shows pins of an “I” type
  • FIG 16(B) shows pins of a “T” type
  • FIG 15(C) shows pins of a “pie” type.
  • FIG 16 shows pins 130 being loaded into the receptacles 155 with the use of gravity and shaking of a pin chamber.
  • the pins 130 from a pin chamber adjacent to the template 115 are loaded in the receptacles 155 of the template 115 by shaking of the pin chamber together with the template 115.
  • a flow meter for the receptacles 155 is able to detect if any of the receptacles 155 is not loaded.
  • the template 115 will need to be flipped by 180° before the pins 130 are unloaded from the template 115.
  • FIG 17 there is shown a fifth method of loading pins of different shapes to a template.
  • FIG 17(A) shows pins of an “I” type
  • FIG 14(B) shows pins of a “T” type.
  • the fifth method also utilises an alignment guide 180.
  • the alignment guide 180 can include conical, pyramidal or cylindrical channels 185 for guiding an aligning the pins 130 in a desired orientation.
  • FIG 17 shows pins 130 being loaded into the receptacles 155 with the use of gravity and shaking of a pin chamber/alignment guide.
  • the pins 130 from a pin chamber and alignment guide 180 adjacent to the template 115 are loaded in the receptacles 155 of the template 115 by shaking of the pin chamber together with the template. Subsequently, a flow meter for the receptacles 155 is able to detect if any of the receptacles 155 is not loaded.
  • the template 115 will need to be flipped by 180° before the pins 130 are unloaded from the template 115.
  • a process flow for a method 1800 for the placement of at least one conductor pin is shown.
  • the method 1800 is a broad view showing how the respective steps as described in the preceding paragraphs are applied.
  • a first template is loaded, the first template typically being a mass template as shown in FIG 9(A). It should be appreciated that the first template can be loaded using either a pre-alignment apparatus, or an alignment guide as detailed in the preceding paragraphs.
  • the first template is first aligned with the target surface using fiducials of a target surface, and once aligned, pins in the first template are unloaded to the target surface.
  • the target surface can be the glass panel unit 105 of FIG 2.
  • a second template is then loaded.
  • the second template can be an individual pin template as shown in FIG 9(B). It should be appreciated that the first template can be loaded using either a pre-alignment apparatus, or an alignment guide as detailed in the preceding paragraphs.
  • a controller determines a most efficient way to place the missing pins using the second template, the most efficient way being detailed in FIG 7. Finally, the pin(s) is unloaded from the second template in a manner which places the missing pins to the target surface.

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Abstract

The present invention provides a system and method for placement of at least one pin during manufacturing in the semiconductor industry, which ensures a low incidence of missing pins or improperly positioned pins during the manufacturing process. The system and method can be used during both a manufacturing process, and can also be used in a quality assessment process. It should be appreciated that implementation of the system and method is advantageous in relation to yield and throughput.

Description

A SYSTEM AND METHOD FOR PLACEMENT OF AT LEAST ONE CONDUCTOR PIN
Field of the Invention
The present invention relates to the field of semiconductor manufacturing.
Background
In the field of semiconductor manufacturing, the miniaturization of components that are fabricated is important as more layers are packed into a pre-defined area. It should be appreciated that each respective layer should be electrically coupled to one another, and a faulty/missing connection is likely to lead to issues with the fabricated product. It is typical that the electrical coupling is enabled using conductor pins.
Thus, the issues that can lead to issues with the fabricated product include, for example, missing conductor pins, incorrectly positioned conductor pins, poorly orientated conductor pins, and so forth.
Currently, there are no desirable solutions in relation to desirably positioning and orientating conductor pins for both individual conductor pins or a mass of conductor pins. Summary
In a first aspect, there is provided a method for the placement of at least one conductor pin, the method comprising: loading a first template with a plurality of conductor pins; aligning the first template with a target surface; and unloading the plurality of conductor pins to the target surface.
It is preferable that when the target surface is missing at least one conductor pin after unloading of the conductor pins from the first template, a second template is used to unload the at least one missing conductor pin, the first template being different from the second template, the second template being configured to be positioned and moved relative to at least two fiducials of the target surface.
In a second aspect, there is provided a system for the placement of at least one conductor pin, the system being configured to carry out the steps comprising: load a first template with a plurality of conductor pins; align the first template with a target surface; and unload the plurality of conductor pins to the target surface.
Preferably, when the target surface is missing at least one conductor pin after unloading of the conductor pins from the first template, a second template is used to unload the at least one missing conductor pin, the first template being different from the second template, the second template being configured to be positioned and moved relative to at least two fiducials of the target surface.
It will be appreciated that the broad forms of the invention and their respective features can be used in conjunction, interchangeably and/or independently, and reference to separate broad forms is not intended to be limiting.
Brief Description of the Drawings
A non-limiting example of the present invention will now be described with reference to the accompanying drawings, in which:
FIG 1 shows a substrate including a plurality of glass panel units;
FIG 2 shows a top view of relative movement of a template with one of the glass panel units of FIG 1 ;
FIG 3 shows a cross-sectional view of FIG 2 during a usage instance;
FIG 4 shows a possible way of dislodging a pin from a template;
FIGs 5A and 5B show flux dipping for different types of pins;
FIG 6A shows an instance of mass unloading from a template, while FIG 6B shows an instance of individual unloading from a template;
FIG 7A shows locations of openings where pins are missing, while FIGs 7B and 7C show how the openings are filled;
FIG 8 shows a process flow for a method for placing at least one missing pin; FIG 9 shows two possible types of templates;
FIG 10 shows a pre-aligning apparatus;
FIG 11 shows loading of the pre-aligning apparatus of FIG 10;
FIG 12 shows usage of the pre-aligning apparatus of FIG 10;
FIG 13 shows a first method of loading pins of different shapes to a template;
FIG 14 shows a second method of loading pins of different shapes to a template;
FIG 15 shows a third method of loading pins of different shapes to a template;
FIG 16 shows a fourth method of loading pins of different shapes to a template;
FIG 17 shows a fifth method of loading pins of different shapes to a template; and FIG 18 shows a process flow for a method of placement of at least one conductor pin.
Detailed Description
The present invention provides a system and method for placement of at least one pin during manufacturing in the semiconductor industry, which ensures a low incidence of missing pins or improperly positioned pins during the manufacturing process. The system and method can be used during both a manufacturing process, and can also be used in a quality assessment process. It should be appreciated that implementation of the system and method is advantageous in relation to yield and throughput.
For the purpose of illustration, it is assumed that embodiments of the system and method as described possible non-limiting embodiments, and other embodiments are possible. It should be noted that all advantages should be consistent for all embodiments.
Referring to FIG 1 , there is shown a substrate 100, and the substrate 100 includes a plurality of glass panel units 105. In the following description, contact pins will be described in relation to placement on each of the glass panel units 105, however, it should be appreciated that the pins can also be placed on other surfaces, most likely on surfaces used in the semiconductor industry.
Referring to FIG 2, there is shown a top view of one of the glass panel units 105, where pin location openings 110 are already provided in this FIG. It should be noted that a subsequent portion of the description will provide a description on some methods to locate the pin openings 110 on each glass panel unit 105. FIG 2 also shows a template 115, the template 115 being an apparatus which is configured to be loaded with a plurality of pins 130 at pre-defined positions which match the pin location openings 110 on each glass panel unit 105. Each glass panel unit 105 includes at least two glass fiducials 125, and similarly, each template 115 also includes at least two template fiducials 120. Each of the glass fiducials 125 and template fiducials 120 can be printed indicia or a physical feature(s). The purpose of the glass fiducials 125 and the template fiducials 120 is to ensure that the template 115 is able to be aligned with the glass panel unit 105, such that the plurality of pins 130 is able to be positioned in a desired manner at the glass panel unit 105. Typically, the template 115 is movable in relation to the glass panel unit 105, but the converse is also possible. Thus, FIG 2 provides an illustration of how the plurality of pins 130 are placed on the glass panel unit 105.
Referring to FIG 9, for the sake of clarification there is shown two possible types of templates 115. FIG 9A shows a mass pin template which is fully loaded with pins during use. Ideally, all pin location openings 110 of the glass panel unit 105 are filled with pins once the fully loaded mass pin template 115 is unloaded. FIG 9B shows an individual pin template which will be used to fill openings 110 with missing pins, as detailed with reference in FIG 7.
Further clarification of FIG 2 is provided in FIG 3. FIG 3 shows a cross-sectional view of FIG 2 during a usage instance. FIG 3 shows the glass panel unit 105, the template 115 and an additional template carrier 135. The template carrier 135 is configured to transport the template 115, and to load/unload the plurality of pins 130 to/from the template 115. The template carrier 135 relies on compressed air (pneumatic controls) when loading/unloading the plurality of pins 130. For the sake of illustration, a distance between the template 115 and the glass panel unit 105 is between 50 to 100 urn when the plurality of pins 130 is unloaded from the template 115. While the distance between the template 115 and the glass panel unit 105 is miniscule, FIG 3 illustrates how one pin 130 (out of three) is unable to be appropriately positioned in a desired opening 110 when the pin 130 is unloaded from the template 115. The pin 130 is “stuck” in the template 115, and this leads to a situation illustrated in FIG 4, where the template carrier 135 initiates jerky movement in a horizontal plane (or X/Y axes) to ensure that the pin 130 is able to be unloaded to a desired opening 110. In some instances, the openings 110 are not well defined as shown in FIGs 3 and 4 due to manufacturing issues for the glass panel unit 105. Such manufacturing issues may also cause “stuck” pins 130 during unloading of the template 115 as shown in FIG 3.
FIG 5 shows flux dipping for different types of pins. FIG 5A shows dipping for “I” type pins while FIG 5B shows dipping for “pie” type pins. A fluxer unit 140 with a receptacle 145 of liquid flux is shown, and all other parts are identically labelled as per earlier FIGs. FIG 5 shows mass dipping of the pins 130 when loaded in the template 115 to ensure higher productivity.
FIG 6A shows an instance of mass unloading of pins 130 from the template 115 to a glass panel 105, where the template carrier 135 uses a mass flow meter 150 to control suction forces at pin receptacles 155 of the template 115 to ensure mass release of the pins 130 into pin location openings 110 of the glass panel 105. FIG 6B shows an instance of individual unloading of pins from the template 115 to a glass panel 105 where the template carrier 135 uses respective mass flow meters 150(a), 150(b), 150(c) to control suction forces at respective pin receptacles 155 of the template 115 to ensure individual/singular release of the pins 130 into pin openings 110 of the glass panel 105. It should be noted that mass unloading of pins 130 as shown in FIG 6A is beneficial for throughput, while the individual unloading of pins as shown in FIG 6B is beneficial for yield. A subsequent section of the description will disclose a method for loading at least one missing pin in a glass panel 105, which would necessitate the instance shown in FIG 6B.
Referring to FIG 7, there is shown a sequence of how missing pins on a glass panel 105 are detected and subsequently placed using the instance shown in FIG 6B. FIG 7A shows a template 115 for individual pins as previously described in FIG 6B. For the sake of illustration, the template 115 is shown to have nine pin receptacles 155. There are three pin location openings which do not have pins, and their corresponding positions 111 (a), 111 (b), 111 (c) are shown on the template 115. It should be noted that the corresponding positions 111 (a), 111 (b), 111 (c) are when fiducials 120 of the template 115 are aligned with fiducials of the glass panel 105. All subsequent movements of the template 115 are in relation to the aligned fiducials.
Once the corresponding positions 111 (a), 111 (b), 111 (c) are determined, machine vision is employed to determine movement of the template 115 in an efficient manner to place the missing pins. For example, FIG 7B shows the template 115 being moved to place two missing pins at positions 111 (a), 111 (c) followed by movement to place the missing pin at position 111 (b). It should be appreciated that this two movement process is faster than moving the template 115 to place the pin at 111 (a), 111 (b), 111 (c) individually. After the pin location openings 110 are filled, machine vision is used to ensure that there are no other empty pin location openings 110 to ensure high yield. A process flow providing further details for FIG 7 is provided in FIG 8. For the sake of illustration, reference is made to the components as indicated in the prior paragraphs. A method 800 for placing missing pins on a glass panel is shown in FIG 8. At step 805, machine vision is used to determine a position of empty pin location openings 110 on a glass panel 105. At step 810, the template 115 is then loaded with pins 130 used to fill the empty pin location openings 110. At step 815, fiducials of the template 115 and the glass panel 105 are aligned, and a controller then determines an efficient way to fill the empty pin location openings 110 at step 820. As mentioned previously, it is desirable for the template 115 to be moved as minimally as possible when filling the empty pin location openings 1 10 to ensure efficiency of the method 800. After the pin location openings 110 are filled, machine vision is used to ensure that there are no other empty pin location openings 110 to ensure high yield.
Referring to FIG 7 and FIG 8, it is appreciated that the method 800 is advantageous in relation to time savings (minimising time to fill missing openings) to ensure high yield.
Referring to FIG 10, there is shown a pre-alignment apparatus 300. The pre-alignment apparatus 300 is configured to assist in loading the templates 115. Basically, the prealignment apparatus 300 is loaded with pins 130 before the pins 130 are loaded to the template 115. It should be noted that the pre-alignment apparatus 300 also includes at least two pre-alignment fiducials 305. Each of the pre-alignment fiducials 305 can be printed indicia or a physical feature(s). The purpose of the pre-alignment fiducials 305 and the template fiducials 120 is to ensure that the template 115 is able to be aligned with the pre-alignment apparatus 300 as shown in FIG 12 such that the plurality of pins 130 is able to be positioned in a desired manner at the template 115.
Referring to FIG 11 , the pre-alignment apparatus 300 is loaded from a pin chamber 400. FIG 11 (A) illustrates loading of “I” type pins, FIG 11 (B) illustrates loading of “T” type pins while FIG 11 (C) illustrates “pie” type pins. In FIGS 11 (A) to 11 (C), a holder of the pre-alignment apparatus 300 is configured to provide a suction force for the pins to be loaded to the pre-alignment apparatus 300.
Referring to FIG 13, there is shown a first method of loading pins of different shapes to a template (both mass or individual). FIG 13(A) shows pins of an “I” type, FIG 13(B) shows pins of a “T” type while FIG 13(C) shows pins of a “pie” type. Using FIG 13 for convenient reference, it should be noted that there are differences in the templates 115 used for the different pin types.
FIG 13(A) shows how the template 115 for “I” type pins have a substantially conicalshaped pin receptacle 155 for the “I” type pins. It has been observed that the substantially conical-shaped pin receptacle 155 (bottom view of the receptacle is shown) is advantageous in loading the “I” shaped type pins in an efficient manner such that the “I” type pins are securely held in the conical-shaped pin receptacle 155 in a desired orientation and can also be unloaded in the desired orientation. FIG 13(B) shows how the template 115 for “T” type pins have a substantially pyramidal-shaped pin receptacle 155 for the “T” type pins. It has been observed that the substantially pyramidal-shaped pin receptacle 155 (bottom view of the receptacle is shown) is advantageous in loading the “T” shaped type pins in an efficient manner such that the “T” type pins are securely held in the pyramidal-shaped pin receptacle 155 in a desired orientation and can also be unloaded in the desired orientation.
FIG 13(C) shows how the template 115 for “pie” type pins have a substantially pillshaped pin receptacle 155 for the “pie” type pins. It has been observed that the substantially pill-shaped pin receptacle 155 (bottom view of the receptacle is shown) is advantageous in loading the “pie” shaped type pins in an efficient manner such that the “pie” type pins are securely held in the pill-shaped pin receptacle 155 in a desired orientation and can also be unloaded in the desired orientation. The pill-shaped pin receptacle 155 is shown to include four suction channels to ensure correct loading orientation for the “pie” type pins (horizontal orientation rather than vertical).
Basically, FIG 13 shows pins 130 being loaded into the receptacles 155 with the use of periodic compressed air from a base 200 such that the pins are suspended in air in a pin chamber and able to be loaded into the receptacles 155 using suction forces. Subsequently, a flow meter for the receptacles 155 is able to detect if any of the receptacles 155 is not loaded. It is advantageous that the template 115 need not be flipped before the pins 130 are unloaded from the template 115. Referring to FIG 14, there is shown a second method of loading pins of different shapes to a template. FIG 14(A) shows pins of an “I” type, FIG 14(B) shows pins of a “T” type. It should be noted that the second method can also be used for “pie” type pins. Basically, FIG 14 shows pins 130 being loaded into the receptacles 155 with the use of periodic compressed air from a base 200 such that the pins are suspended in air in a pin chamber and able to be loaded into the receptacles 155 using suction forces and an alignment guide 180 positioned adjacent to the template 115. The alignment guide 180 can include conical, pyramidal or cylindrical channels 185 for guiding an aligning the pins 130 in a desired orientation. The second method allows for use of a thinner template 115. Subsequently, a flow meter for the receptacles 155 is able to detect if any of the receptacles 155 is not loaded. It is advantageous that the template 115 need not be flipped before the pins 130 are unloaded from the template 115.
Referring to FIG 15, there is shown a third method of loading pins of different shapes to a template. The third method also utilises the alignment apparatus 300 as per FIG 11. FIG 15(A) shows pins of an “I” type, FIG 15(B) shows pins of a “pie” type, while FIG 15(C) shows pins of a “T” type. FIG 15 shows pins 130 being loaded in the alignment apparatus 300. In this method, the pins 130 are loaded in the alignment apparatus 300 before the alignment apparatus 300 is moved to an adjacent position to the template 115 where the pins 130 are then loaded to the template 115. The third method also allows for use of a thinner template 115. Subsequently, a flow meter for the receptacles 155 is able to detect if any of the receptacles 155 is not loaded. It is advantageous that the template 115 need not be flipped before the pins 130 are unloaded from the template 115.
Referring to FIG 16, there is shown a fourth method of loading pins of different shapes to a template. FIG 16(A) shows pins of an “I” type, FIG 16(B) shows pins of a “T” type, while FIG 15(C) shows pins of a “pie” type. FIG 16 shows pins 130 being loaded into the receptacles 155 with the use of gravity and shaking of a pin chamber. In this method, the pins 130 from a pin chamber adjacent to the template 115 (in an upside down orientation) are loaded in the receptacles 155 of the template 115 by shaking of the pin chamber together with the template 115. Subsequently, a flow meter for the receptacles 155 is able to detect if any of the receptacles 155 is not loaded. The template 115 will need to be flipped by 180° before the pins 130 are unloaded from the template 115.
Referring to FIG 17, there is shown a fifth method of loading pins of different shapes to a template. FIG 17(A) shows pins of an “I” type, FIG 14(B) shows pins of a “T” type. It should be noted that the second method can also be used for “pie” type pins. The fifth method also utilises an alignment guide 180. The alignment guide 180 can include conical, pyramidal or cylindrical channels 185 for guiding an aligning the pins 130 in a desired orientation. FIG 17 shows pins 130 being loaded into the receptacles 155 with the use of gravity and shaking of a pin chamber/alignment guide. In this method, the pins 130 from a pin chamber and alignment guide 180 adjacent to the template 115 (in an upside down orientation) are loaded in the receptacles 155 of the template 115 by shaking of the pin chamber together with the template. Subsequently, a flow meter for the receptacles 155 is able to detect if any of the receptacles 155 is not loaded. The template 115 will need to be flipped by 180° before the pins 130 are unloaded from the template 115.
The preceding paragraphs describe an invention in the form of a system and method comprising multiple aspects for placement of at least one conductor pin in a manner which either improves throughput or yield. In some cases, both throughput and yield are improved. The system and method arises from multiple improvements for the various aspects, and leads to substantial improvements that are consequential to the solving of multiple problems that have arisen.
Referring to FIG 18, there is shown a process flow for a method 1800 for the placement of at least one conductor pin. The method 1800 is a broad view showing how the respective steps as described in the preceding paragraphs are applied. At step 1805, a first template is loaded, the first template typically being a mass template as shown in FIG 9(A). It should be appreciated that the first template can be loaded using either a pre-alignment apparatus, or an alignment guide as detailed in the preceding paragraphs.
At step 1810, the first template is first aligned with the target surface using fiducials of a target surface, and once aligned, pins in the first template are unloaded to the target surface. The target surface can be the glass panel unit 105 of FIG 2. At step 1815, if there is detection of missing pins on the target surface, a second template is then loaded. The second template can be an individual pin template as shown in FIG 9(B). It should be appreciated that the first template can be loaded using either a pre-alignment apparatus, or an alignment guide as detailed in the preceding paragraphs.
At step 1820, a controller then determines a most efficient way to place the missing pins using the second template, the most efficient way being detailed in FIG 7. Finally, the pin(s) is unloaded from the second template in a manner which places the missing pins to the target surface.
It should be appreciated that the benefits provided by the respective steps of the method 1800 are also provided by the method 1800, and can also lead to synergistic efficiencies for the method 1800.
Throughout this specification and claims which follow, unless the context requires otherwise, the word “comprise”, and variations such as “comprises” or “comprising”, will be understood to imply the inclusion of a stated integer or group of integers or steps but not the exclusion of any other integer or group of integers.
Persons skilled in the art will appreciate that numerous variations and modifications will become apparent. All such variations and modifications which become apparent to persons skilled in the art, should be considered to fall within the spirit and scope that the invention broadly appearing before described.

Claims

THE CLAIMS DEFINING THE INVENTION ARE AS FOLLOWS:
1. A method for the placement of at least one conductor pin, the method comprising: loading a first template with a plurality of conductor pins; aligning the first template with a target surface; and unloading the plurality of conductor pins to the target surface; wherein, when the target surface is missing at least one conductor pin after unloading of the conductor pins from the first template, a second template is used to unload the at least one missing conductor pin, the first template being different from the second template, the second template being configured to be positioned and moved relative to at least two fiducials of the target surface.
2. The method of claim 1 , wherein the second template is moved to multiple positions relative to the target surface, each location being for unloading at least one conductor pin.
3. The method of either claim 1 or 2, wherein the first template is configured to contain more conductor pins than the second template.
4. The method of any of claims 1 to 3, wherein the target surface includes a plurality of pin location openings.
5. The method of any of claims 1 to 4, wherein the at least two fiducials are either printed indicia or physical features.
6. The method of any of claims 1 to 5, wherein the first template is moved jerkily in a horizontal plane when encountering issues during unloading.
7. The method of any of claims 1 to 6, wherein machine vision is used to determine the conductor pins missing on the target surface.
8. The method of any of claims 1 to 7, wherein the second template is moved to as few positions as possible during unloading.
9. The method of any of claims 1 to 8, wherein a pre-alignment apparatus is used to load the first template.
10. The method of any of claims 1 to 8, wherein an alignment guide is used to load the first template.
11 . The method of any of claims 1 to 10, wherein the at least one conductor pin is selected from a form selected from a group comprising: l-type, T-type and pie-type.
12. A system for the placement of at least one conductor pin, the system being configured to carry out the steps comprising: load a first template with a plurality of conductor pins; align the first template with a target surface; and unload the plurality of conductor pins to the target surface; wherein, when the target surface is missing at least one conductor pin after unloading of the conductor pins from the first template, a second template is used to unload the at least one missing conductor pin, the first template being different from the second template, the second template being configured to be positioned and moved relative to at least two fiducials of the target surface.
13. The system of claim 12, wherein the second template is moved to multiple positions relative to the target surface, each location being for unloading at least one conductor pin.
14. The system of either claim 12 or 13, wherein the first template is configured to contain more conductor pins than the second template.
15. The system of any of claims 12 to 14, wherein the target surface includes a plurality of pin location openings.
16. The system of any of claims 12 to 15, wherein the at least two fiducials are either printed indicia or physical features.
17. The system of any of claims 12 to 16, wherein the first template is moved jerkily in a horizontal plane when encountering issues during unloading.
18. The system of any of claims 12 to 17, wherein machine vision is used to determine the conductor pins missing on the target surface.
19. The system of any of claims 12 to 18, wherein the second template is moved to as few positions as possible during unloading.
20. The system of any of claims 12 to 19, wherein a pre-alignment apparatus is used to load the first template.
21. The system of any of claims 12 to 19, wherein an alignment guide is used to load the first template.
22. The system of any of claims 12 to 21 , wherein the at least one conductor pin is selected from a form selected from a group comprising: l-type, T-type and pie-type.
PCT/SG2022/050137 2022-03-15 2022-03-15 A system and method for placement of at least one conductor pin WO2023177347A1 (en)

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PCT/SG2022/050137 WO2023177347A1 (en) 2022-03-15 2022-03-15 A system and method for placement of at least one conductor pin
TW112109528A TW202401599A (en) 2022-03-15 2023-03-15 A system and method for placement of at least one conductor pin

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050214661A1 (en) * 2004-03-23 2005-09-29 Stasiak James W Structure formed with template having nanoscale features
KR20080102963A (en) * 2007-05-21 2008-11-26 가부시키가이샤 히타치플랜트테크놀로지 Solder ball printer
JP2015154055A (en) * 2014-02-19 2015-08-24 イビデン株式会社 Printed wiring board
KR20190013551A (en) * 2017-07-28 2019-02-11 아스리트 에프에이 가부시키가이샤 Columnar member mounting device and columnar member mounting method
US20200402831A1 (en) * 2019-06-24 2020-12-24 Palo Alto Research Center Incorporated Transfer substrate utilizing selectable surface adhesion transfer elements

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050214661A1 (en) * 2004-03-23 2005-09-29 Stasiak James W Structure formed with template having nanoscale features
KR20080102963A (en) * 2007-05-21 2008-11-26 가부시키가이샤 히타치플랜트테크놀로지 Solder ball printer
JP2015154055A (en) * 2014-02-19 2015-08-24 イビデン株式会社 Printed wiring board
KR20190013551A (en) * 2017-07-28 2019-02-11 아스리트 에프에이 가부시키가이샤 Columnar member mounting device and columnar member mounting method
US20200402831A1 (en) * 2019-06-24 2020-12-24 Palo Alto Research Center Incorporated Transfer substrate utilizing selectable surface adhesion transfer elements

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