WO2023074933A1 - Wafer vacuum pickup device - Google Patents

Wafer vacuum pickup device Download PDF

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Publication number
WO2023074933A1
WO2023074933A1 PCT/KR2021/015210 KR2021015210W WO2023074933A1 WO 2023074933 A1 WO2023074933 A1 WO 2023074933A1 KR 2021015210 W KR2021015210 W KR 2021015210W WO 2023074933 A1 WO2023074933 A1 WO 2023074933A1
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Prior art keywords
vacuum
wafer
container
control valve
pickup device
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PCT/KR2021/015210
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French (fr)
Korean (ko)
Inventor
박종익
Original Assignee
주식회사 세정로봇
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Priority to KR1020247005238A priority Critical patent/KR20240038988A/en
Priority to PCT/KR2021/015210 priority patent/WO2023074933A1/en
Publication of WO2023074933A1 publication Critical patent/WO2023074933A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0033—Gripping heads and other end effectors with gripping surfaces having special shapes
    • B25J15/0038—Cylindrical gripping surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Definitions

  • the present invention relates to a wafer vacuum pick-up device, and more particularly, to a wafer vacuum pick-up device for preventing suction marks caused by vacuum suction on a wafer when picking up a wafer immersed in a water tank.
  • a wafer is manufactured through a number of detailed processes such as a cutting process, a polishing process, and a cleaning process.
  • a pick-up device for picking up and transferring wafers is disposed between each process, and in general, a pick-up device using vacuum adsorption is more used than a pick-up device based on a physical gripping operation.
  • Korean Patent Registration No. 10-0912432 Wafer Transfer Device and Transfer Method
  • the method of picking up by vacuum suction through a vacuum is the most used.
  • suction pads have a problem in that vacuum adsorption marks are formed after vacuum adsorption.
  • the surface of the wafer is the surface on which processing is performed, there is a problem in that manufacturing quality varies due to fine marks.
  • An object of the present invention has been made to solve the above problems, and to provide a wafer vacuum pick-up device for preventing vacuum suction marks from being formed on the wafer when picking up the wafer contained in the water tank.
  • the wafer vacuum pick-up device has a hand body coupled to a transfer robot and a pick-up part having an arc shape on the lower surface disposed below the hand body, and a step is formed on one side of the lower surface of the pick-up part. It is characterized in that it includes a holding part to which one edge of the wafer to be picked up is in close contact with, and a vacuum suction part formed on the lower surface of the pickup part to vacuum the side surface of the wafer to be picked up.
  • the holding part is characterized in that it further comprises a suction passage having a predetermined depth extending from the lower surface of the holding part to the vacuum suction part along the other side of the holding part.
  • a control valve for selectively sending the fluid sucked through the vacuum suction unit to one of a plurality of containers and a vacuum pump connected to each container to form a vacuum pressure in the container connected by the control valve Further comprising characterized by
  • a control valve for selectively sending the fluid sucked through the vacuum suction unit to one of a plurality of containers, a vacuum pump connected to each container to form a vacuum pressure in the container connected by the control valve, and the control valve Characterized in that it further comprises a discharge pump connected to each container to discharge the fluid accommodated in the other container not selected by the.
  • the wafer vacuum pick-up device As described above, according to the wafer vacuum pick-up device according to the present invention, by vacuum adsorption along the lateral edge of the wafer, there is an effect of minimizing the formation of vacuum adsorption marks on the wafer.
  • FIG. 1 is a view showing a wafer vacuum pickup device and a wafer contained in a water bath according to the present invention.
  • FIG. 2 is a view showing an operation of picking up a wafer through a wafer vacuum pick-up device according to the present invention.
  • FIG 3 is a view showing a wafer picked up through a wafer vacuum pick-up device according to the present invention.
  • FIG. 4 is a view showing a wafer vacuum pick-up device according to the present invention.
  • FIG. 5 is a view showing a longitudinal section of a wafer vacuum pick-up device according to the present invention.
  • FIG. 6 is a conceptual diagram schematically illustrating a wafer vacuum pick-up device according to the present invention.
  • FIG. 1 is a view showing a wafer vacuum pick-up device according to the present invention and a wafer contained in a water tank
  • FIG. 2 is a view showing an operation of picking up a wafer through the wafer vacuum pick-up device according to the present invention
  • FIG. It is a view showing a wafer picked up through the wafer vacuum pick-up device according to the present invention
  • FIG. 4 is a view showing the wafer vacuum pick-up device according to the present invention
  • FIG. 5 shows a longitudinal section of the wafer vacuum pick-up device according to the present invention.
  • FIG. 6 is a conceptual diagram schematically illustrating a wafer vacuum pick-up device according to the present invention.
  • the wafer vacuum pickup device picks up the wafer 100 submerged in the water tank 101 containing water (W) such as DI water or cleaning liquid through vacuum suction, the wafer ( 100) to prevent the formation of marks due to vacuum adsorption on both sides of the hand body 1 coupled to the transfer robot and a pick-up unit disposed below the hand body 1 and having an arc shape on the lower surface ( 2) and a mounting portion 3 in which a step is formed on one side of the lower surface of the pick-up part 2 so that one edge of the wafer 100 to be picked up is brought into close contact.
  • W water
  • the wafer ( 100) to prevent the formation of marks due to vacuum adsorption on both sides of the hand body 1 coupled to the transfer robot and a pick-up unit disposed below the hand body 1 and having an arc shape on the lower surface ( 2) and a mounting portion 3 in which a step is formed on one side of the lower surface of the pick-up part 2 so that one edge of the wafer 100 to be picked up is brought into close contact.
  • the pickup unit 2 has a vacuum suction unit 4 for vacuum adsorbing the side surface of the wafer 100 to be picked up on the lower surface of the pickup unit 2, so that the side surface of the wafer 100 It is in close contact with the vacuum suction of the vacuum suction part (4).
  • the holding part 3 is configured to further include a suction passage 4 having a predetermined depth extending from the bottom surface of the holding part 3 to the vacuum suction part 11 along the other surface of the holding part 3. It can be.
  • vacuum pressure is formed along the suction passage 4 from the vacuum suction part 4 to one side of the wafer 100 that is in close contact with the lower surface of the pick-up part 2 by the vacuum suction of the vacuum suction part 4.
  • the wafer 100 is effectively prevented from being shaken during transport while being closely adhered to the holding portion 3 .
  • control valve 12 and the control valve for selectively sending the water (W) and air sucked through the vacuum suction part 11 to one of a plurality of containers In order to form a vacuum pressure in the containers 13a and 13b connected by 12), vacuum pumps 14a and 14b connected to each container may be further included.
  • the water in the water tank is vacuumed together with air, and the vacuumed water is stored in a container to separate and discharge it.
  • control valve 12 selectively connects any one of the plurality of containers to store water in each container.
  • it may be configured to further include a discharge pump connected to each container to discharge the fluid stored in the containers 13a and 14b after being sucked through the vacuum suction part 11 or to circulate the fluid back to the water tank.
  • a discharge pump connected to each container to discharge the fluid stored in the containers 13a and 14b after being sucked through the vacuum suction part 11 or to circulate the fluid back to the water tank.
  • the fluid contained in the other container not selected by the control valve 12 is discharged by the discharge pump or circulated back to the water tank, and is repeated.

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to a wafer vacuum pickup device and, more specifically, to a wafer vacuum pickup device for preventing the occurrence of adsorption marks caused by vacuum adsorption when wafers contained in a water tank are picked up.

Description

웨이퍼 진공 픽업장치Wafer vacuum pickup device
본 발명은 웨이퍼 진공 픽업장치에 관한 것으로, 보다 상세하게는 수조에 담겨진 웨이퍼를 픽업할 때, 웨이퍼에 진공 흡착에 의한 흡착자국이 생기는 것을 방지하기 위한 웨이퍼 진공 픽업장치에 관한 것이다.The present invention relates to a wafer vacuum pick-up device, and more particularly, to a wafer vacuum pick-up device for preventing suction marks caused by vacuum suction on a wafer when picking up a wafer immersed in a water tank.
일반적으로 웨이퍼는 절단공정, 연마공정, 세정공정 등 다수의 세부 공정을 거쳐서 제조된다.In general, a wafer is manufactured through a number of detailed processes such as a cutting process, a polishing process, and a cleaning process.
각 공정 사이에는 웨이퍼를 픽업하여 이송시키기 위한 픽업장치가 배치되며, 일반적으로 물리적인 파지동작에 의한 픽업장치보다는 진공 흡착을 이용한 픽업장치가 더 많이 이용되고 있다.A pick-up device for picking up and transferring wafers is disposed between each process, and in general, a pick-up device using vacuum adsorption is more used than a pick-up device based on a physical gripping operation.
웨이퍼를 보다 빠르고, 안정적으로 픽업하기 위해서 한국등록특허 제10-0912432호 "웨이퍼 이송장치 및 그 이송방법"과 같이 다양한 기술이 개발되고 있으며, 구조적으로 간단하고 웨이퍼의 손상을 방지하기 위해서 흡착 패드를 통해 진공 흡입하여 픽업하는 방법이 가장 많이 이용되고 있다.In order to pick up the wafer more quickly and stably, various technologies have been developed, such as Korean Patent Registration No. 10-0912432 "Wafer Transfer Device and Transfer Method", which is structurally simple and uses a suction pad to prevent damage to the wafer. The method of picking up by vacuum suction through a vacuum is the most used.
하지만, 종래의 흡착 패드는 진공 흡착 후 진공 흡착 자국이 형성되는 문제점이 있었다.However, conventional suction pads have a problem in that vacuum adsorption marks are formed after vacuum adsorption.
특히, 웨이퍼의 면은 가공이 이루어지는 면이므로 미세한 자국에 의해서 제조 품질이 달라지는 문제점이 있었다.In particular, since the surface of the wafer is the surface on which processing is performed, there is a problem in that manufacturing quality varies due to fine marks.
이에 따라, 면의 손상을 최소화하면서 웨이퍼를 픽업하기 위한 기술개발의 필요성이 제기되고 있다.Accordingly, there is a need to develop a technology for picking up a wafer while minimizing surface damage.
본 발명의 목적은 상술한 바와 같은 문제점을 해결하기 위해 안출된 것으로서, 수조에 담긴 웨이퍼를 픽업할 때, 웨이퍼에 진공 흡착자국이 형성되는 것을 방지하기 위한 웨이퍼 진공 픽업장치를 제공하는 것이다.An object of the present invention has been made to solve the above problems, and to provide a wafer vacuum pick-up device for preventing vacuum suction marks from being formed on the wafer when picking up the wafer contained in the water tank.
상기 목적을 달성하기 위해 본 발명에 따른 웨이퍼 진공 픽업장치는 이송 로봇에 결합되는 핸드 몸체와 핸드 몸체의 하부에 배치되어 하면이 호 형태를 가지는 픽업부와 상기 픽업부의 하면에 일측으로 단차가 형성되어 픽업할 웨이퍼의 일측 가장자리가 밀착되는 거치부와 상기 픽업부의 하면에 형성되어 픽업할 웨이퍼의 측면을 진공 흡착시키는 진공흡입부를 포함하는 것을 특징으로 한다.In order to achieve the above object, the wafer vacuum pick-up device according to the present invention has a hand body coupled to a transfer robot and a pick-up part having an arc shape on the lower surface disposed below the hand body, and a step is formed on one side of the lower surface of the pick-up part. It is characterized in that it includes a holding part to which one edge of the wafer to be picked up is in close contact with, and a vacuum suction part formed on the lower surface of the pickup part to vacuum the side surface of the wafer to be picked up.
또한, 상기 거치부는 거치부의 하면에서부터 거치부의 타면을따라 진공흡입부로 연장되는 소정의 깊이를 가지는 흡입 유로를 더 포함하는 것을 특징으로 한다.In addition, the holding part is characterized in that it further comprises a suction passage having a predetermined depth extending from the lower surface of the holding part to the vacuum suction part along the other side of the holding part.
또한, 상기 진공흡입부를 통해 흡입되는 유체를 복수 개의 용기 중 어느 하나로 선택적으로 보내기 위한 제어밸브와 상기 제어밸브에 의해 연결된 용기에 진공압을 형성시켜주기 위해 각 용기에 연결되는 진공펌프를 더 포함하는 것을 특징으로 한다.In addition, a control valve for selectively sending the fluid sucked through the vacuum suction unit to one of a plurality of containers and a vacuum pump connected to each container to form a vacuum pressure in the container connected by the control valve Further comprising characterized by
또한, 상기 진공흡입부를 통해 흡입되는 유체를 복수 개의 용기 중 어느 하나로 선택적으로 보내기 위한 제어밸브와 상기 제어밸브에 의해 연결된 용기에 진공압을 형성시켜주기 위해 각 용기에 연결되는 진공펌프와 상기 제어밸브에 의해 선택되지 않은 다른 용기에 수용된 유체를 배출시켜주기 위해 각 용기에 연결되는 배출펌프를 더 포함하는 것을 특징으로 한다.In addition, a control valve for selectively sending the fluid sucked through the vacuum suction unit to one of a plurality of containers, a vacuum pump connected to each container to form a vacuum pressure in the container connected by the control valve, and the control valve Characterized in that it further comprises a discharge pump connected to each container to discharge the fluid accommodated in the other container not selected by the.
상술한 바와 같이, 본 발명에 따른 웨이퍼 진공 픽업장치에 의하면, 웨이퍼의 측면 가장자리를 따라 진공흡착함으로써, 웨이퍼에 진공 흡착자국이 형성되는 것을 최소화할 수 있는 효과가 있다.As described above, according to the wafer vacuum pick-up device according to the present invention, by vacuum adsorption along the lateral edge of the wafer, there is an effect of minimizing the formation of vacuum adsorption marks on the wafer.
도 1은 본 발명에 따른 웨이퍼 진공 픽업장치와 수조에 담긴 웨이퍼를 도시한 도면.1 is a view showing a wafer vacuum pickup device and a wafer contained in a water bath according to the present invention.
도 2는 본 발명에 따른 웨이퍼 진공 픽업장치를 통해 웨이퍼를 픽업하는 동작을 도시한 도면.2 is a view showing an operation of picking up a wafer through a wafer vacuum pick-up device according to the present invention.
도 3은 본 발명에 따른 웨이퍼 진공 픽업장치를 통해 픽업된 웨이퍼를 도시한 도면.3 is a view showing a wafer picked up through a wafer vacuum pick-up device according to the present invention.
도 4는 본 발명에 따른 웨이퍼 진공 픽업장치를 도시한 도면.4 is a view showing a wafer vacuum pick-up device according to the present invention.
도 5는 본 발명에 따른 웨이퍼 진공 픽업장치의 종단면을 도시한 도면.5 is a view showing a longitudinal section of a wafer vacuum pick-up device according to the present invention.
도 6은 본 발명에 따른 웨이퍼 진공 픽업장치를 간략하게 도시한 개념도.6 is a conceptual diagram schematically illustrating a wafer vacuum pick-up device according to the present invention.
1 : 핸드 몸체1 : hand body
2 : 픽업부2: pickup unit
3 : 거치부3: Mounting part
4 : 흡입 유로4: intake flow path
11 : 진공흡입부11: vacuum suction part
12 : 제어밸브12: control valve
13a, 13b : 용기13a, 13b: container
14a, 14b : 진공펌프14a, 14b: vacuum pump
100 : 웨이퍼 100: wafer
본 명세서에 개시되어 있는 본 발명의 개념에 따른 실시 예들에 대해서 특정한 구조적 또는 기능적 설명은 단지 본 발명의 개념에 따른 실시 예들을 설명하기 위한 목적으로 예시된 것으로서, 본 발명의 개념에 따른 실시 예들은 다양한 형태들로 실시될 수 있으며 본 명세서에 설명된 실시 예들에 한정되지 않는다.Specific structural or functional descriptions of the embodiments according to the concept of the present invention disclosed in this specification are only illustrated for the purpose of explaining the embodiments according to the concept of the present invention, and the embodiments according to the concept of the present invention It can be embodied in various forms and is not limited to the embodiments described herein.
본 발명의 개념에 따른 실시 예들은 다양한 변경들을 가할 수 있고 여러 가지 형태들을 가질 수 있으므로 실시 예들을 도면에 예시하고 본 명세서에서 상세하게 설명하고자 한다. 그러나, 이는 본 발명의 개념에 따른 실시 예들을 특정한 개시 형태들에 대해 한정하려는 것이 아니며, 본 발명의 사상 및 기술 범위에 포함되는 모든 변경, 균등물, 또는 대체물을 포함한다.Embodiments according to the concept of the present invention can apply various changes and have various forms, so the embodiments are illustrated in the drawings and described in detail in this specification. However, this is not intended to limit the embodiments according to the concept of the present invention to specific disclosed forms, and includes all changes, equivalents, or substitutes included in the spirit and technical scope of the present invention.
이하, 본 발명의 바람직한 실시예를 첨부된 도면을 참조하여 설명하면 다음과 같다.Hereinafter, a preferred embodiment of the present invention will be described with reference to the accompanying drawings.
도 1은 본 발명에 따른 웨이퍼 진공 픽업장치와 수조에 담긴 웨이퍼를 도시한 도면이며, 도 2는 본 발명에 따른 웨이퍼 진공 픽업장치를 통해 웨이퍼를 픽업하는 동작을 도시한 도면이고, 도 3은 본 발명에 따른 웨이퍼 진공 픽업장치를 통해 픽업된 웨이퍼를 도시한 도면이며, 도 4는 본 발명에 따른 웨이퍼 진공 픽업장치를 도시한 도면이고, 도 5는 본 발명에 따른 웨이퍼 진공 픽업장치의 종단면을 도시한 도면이며, 도 6은 본 발명에 따른 웨이퍼 진공 픽업장치를 간략하게 도시한 개념도이다.1 is a view showing a wafer vacuum pick-up device according to the present invention and a wafer contained in a water tank, FIG. 2 is a view showing an operation of picking up a wafer through the wafer vacuum pick-up device according to the present invention, and FIG. It is a view showing a wafer picked up through the wafer vacuum pick-up device according to the present invention, FIG. 4 is a view showing the wafer vacuum pick-up device according to the present invention, and FIG. 5 shows a longitudinal section of the wafer vacuum pick-up device according to the present invention. It is a drawing, and FIG. 6 is a conceptual diagram schematically illustrating a wafer vacuum pick-up device according to the present invention.
도 1에 도시된 바와 같이, 본 발명에 따른 웨이퍼 진공 픽업장치는 DI워터 또는 세정액 등의 물(W)이 담긴 수조(101)에 잠겨진 웨이퍼(100)를 진공 흡입을 통해 픽업할 때, 웨이퍼(100)의 양면에 진공 흡착에 의한 자국이 형성되는 것을 방지하기 위한 것으로써, 이송 로봇에 결합되는 핸드 몸체(1)와 핸드 몸체(1)의 하부에 배치되어 하면이 호 형태를 가지는 픽업부(2)와 상기 픽업부(2)의 하면에 일측으로 단차가 형성되어 픽업할 웨이퍼(100)의 일측 가장자리가 밀착되는 거치부(3)를 포함하여 구성된다.As shown in FIG. 1, the wafer vacuum pickup device according to the present invention picks up the wafer 100 submerged in the water tank 101 containing water (W) such as DI water or cleaning liquid through vacuum suction, the wafer ( 100) to prevent the formation of marks due to vacuum adsorption on both sides of the hand body 1 coupled to the transfer robot and a pick-up unit disposed below the hand body 1 and having an arc shape on the lower surface ( 2) and a mounting portion 3 in which a step is formed on one side of the lower surface of the pick-up part 2 so that one edge of the wafer 100 to be picked up is brought into close contact.
상기 거치부(3)는 도 2 또는 도 3에 도시된 바와 같이, 극히 일부만 웨이퍼(100)의 가장자리를 따라 접하여 픽업된 웨이퍼(100)가 흔들리는 것을 방지하게 되며, 웨이퍼(100)는 픽업부(2)의 하면을 따라 형성되는 진공 흡입 압력에 의해 웨이퍼(100)의 측면이 픽업부(2)의 하면에 밀착되어 픽업된다.As shown in FIG. 2 or 3, only a small portion of the holding unit 3 comes into contact with the edge of the wafer 100 to prevent the picked up wafer 100 from shaking, and the wafer 100 is 2) The side surface of the wafer 100 adheres to the lower surface of the pick-up unit 2 and is picked up by vacuum suction pressure formed along the lower surface of the wafer 100 .
즉, 도 4 또는 도 5에 도시된 바와 같이, 상기 픽업부(2)는 하면에 픽업할 웨이퍼(100)의 측면을 진공 흡착시키는 진공흡입부(4)가 형성되어 웨이퍼(100)의 측면이 진공흡입부(4)의 진공 흡입에 의해 밀착되는 것이다.That is, as shown in FIG. 4 or 5, the pickup unit 2 has a vacuum suction unit 4 for vacuum adsorbing the side surface of the wafer 100 to be picked up on the lower surface of the pickup unit 2, so that the side surface of the wafer 100 It is in close contact with the vacuum suction of the vacuum suction part (4).
또한, 상기 거치부(3)는 거치부(3)의 하면에서부터 거치부(3)의 타면을따라 진공흡입부(11)로 연장되는 소정의 깊이를 가지는 흡입 유로(4)를 더 포함하도록 구성될 수 있다.In addition, the holding part 3 is configured to further include a suction passage 4 having a predetermined depth extending from the bottom surface of the holding part 3 to the vacuum suction part 11 along the other surface of the holding part 3. It can be.
이를 통해, 상기 진공흡입부(4)의 진공 흡입에 의해 픽업부(2)의 하면에 밀착된 웨이퍼(100)의 일면이 진공흡입부(4)에서부터 흡입 유로(4)를 따라 형성되는 진공압에 의해 거치부(3)에 밀착되면서 웨이퍼(100)가 이송중에 흔들리는 것을 효과적으로 방지하게 된다.Through this, vacuum pressure is formed along the suction passage 4 from the vacuum suction part 4 to one side of the wafer 100 that is in close contact with the lower surface of the pick-up part 2 by the vacuum suction of the vacuum suction part 4. As a result, the wafer 100 is effectively prevented from being shaken during transport while being closely adhered to the holding portion 3 .
또한, 도 6에 도시된 바와 같이, 상기 진공흡입부(11)를 통해 흡입되는 물(W)과 공기를 유체를 복수 개의 용기 중 어느 하나로 선택적으로 보내기 위한 제어밸브(12)와 상기 제어밸브(12)에 의해 연결된 용기(13a, 13b)에 진공압을 형성시켜주기 위해 각 용기에 연결되는 진공펌프(14a, 14b)를 더 포함하도록 구성될 수 있다.In addition, as shown in FIG. 6, the control valve 12 and the control valve for selectively sending the water (W) and air sucked through the vacuum suction part 11 to one of a plurality of containers ( In order to form a vacuum pressure in the containers 13a and 13b connected by 12), vacuum pumps 14a and 14b connected to each container may be further included.
보다 상세하게는, 수조에 담긴 웨이퍼의 측면을 진공 흡착하여 이송하는 과정에서 수조에 담긴 물이 공기와 함께 진공 흡입되며, 이를 분리 배출하기 위해서는 진공 흡입된 물을 용기에 저장하게 된다.More specifically, in the process of vacuum adsorbing and transferring the side of the wafer in the water tank, the water in the water tank is vacuumed together with air, and the vacuumed water is stored in a container to separate and discharge it.
또한, 각 용기는 수용할 수 있는 공간이 한정적이므로, 제어밸브(12)가 복수 개의 용기중 어느 하나를 선택적으로 연결하여 각 용기에 물을 저장하게 되는 것이다.In addition, since the space that each container can accommodate is limited, the control valve 12 selectively connects any one of the plurality of containers to store water in each container.
또한, 상기 진공흡입부(11)를 통해 흡입되어 용기(13a, 14b)에 저장된 유체를 배출하거나, 다시 수조로 순환시키기 위해 각 용기에 연결되는 배출펌프를 더 포함하도록 구성될 수도 있다.In addition, it may be configured to further include a discharge pump connected to each container to discharge the fluid stored in the containers 13a and 14b after being sucked through the vacuum suction part 11 or to circulate the fluid back to the water tank.
즉, 상기 제어밸브(12)에 의해 선택되지 않은 다른 용기에 수용된 유체는 배출펌프에 의해 배출되거나, 다시 수조로 순환되는 형태로 반복된다.That is, the fluid contained in the other container not selected by the control valve 12 is discharged by the discharge pump or circulated back to the water tank, and is repeated.
이상과 같이 본 발명은 첨부된 도면을 참조하여 바람직한 실시예를 중심으로 기술되었지만 당업자라면 이러한 기재로부터 본 발명의 범주를 벗어남이 없이 많은 다양한 자명한 변형이 가능하다는 것은 명백하다. 따라서 본 발명의 범주는 이러한 많은 변형의 예들을 포함하도록 기술된 청구범위에 의해서 해석되어져야 한다.As described above, the present invention has been described with reference to the preferred embodiments with reference to the accompanying drawings, but it is clear that many and various obvious modifications are possible to those skilled in the art from this description without departing from the scope of the present invention. Accordingly, the scope of the present invention should be construed by the claims described to include examples of these many variations.

Claims (4)

  1. 이송 로봇에 결합되는 핸드 몸체와;a hand body coupled to the transfer robot;
    핸드 몸체의 하부에 배치되어 하면이 호 형태를 가지는 픽업부와;a pick-up unit disposed on the lower part of the hand body and having an arc shape when the bottom thereof;
    상기 픽업부의 하면에 일측으로 단차가 형성되어 픽업할 웨이퍼의 일측 가장자리가 밀착되는 거치부와;a mounting portion having a step formed on one side of a lower surface of the pickup portion so that an edge of one side of a wafer to be picked up is brought into close contact;
    상기 픽업부의 하면에 형성되어 픽업할 웨이퍼의 측면을 진공 흡착시키는 진공흡입부를 포함하는 것을 특징으로 하는And a vacuum suction unit formed on the lower surface of the pickup unit to vacuum the side surface of the wafer to be picked up.
    웨이퍼 진공 픽업장치.Wafer vacuum pickup device.
  2. 제 1항에 있어서,According to claim 1,
    상기 거치부는The holding part
    거치부의 하면에서부터 거치부의 타면을따라 진공흡입부로 연장되는 소정의 깊이를 가지는 흡입 유로를 더 포함하는 것을 특징으로 하는Characterized in that it further comprises a suction passage having a predetermined depth extending from the lower surface of the mounting unit to the vacuum suction unit along the other surface of the mounting unit
    웨이퍼 진공 픽업장치.Wafer vacuum pickup device.
  3. 제 1항에 있어서,According to claim 1,
    상기 진공흡입부를 통해 흡입되는 유체를 복수 개의 용기 중 어느 하나로 선택적으로 보내기 위한 제어밸브와;a control valve for selectively sending the fluid sucked through the vacuum suction unit to one of a plurality of containers;
    상기 제어밸브에 의해 연결된 용기에 진공압을 형성시켜주기 위해 각 용기에 연결되는 진공펌프를 더 포함하는 것을 특징으로 하는Characterized in that it further comprises a vacuum pump connected to each container to form a vacuum pressure in the container connected by the control valve
    웨이퍼 진공 픽업장치.Wafer vacuum pickup device.
  4. 제 1항에 있어서,According to claim 1,
    상기 진공흡입부를 통해 흡입되는 유체를 복수 개의 용기 중 어느 하나로 선택적으로 보내기 위한 제어밸브와;a control valve for selectively sending the fluid sucked through the vacuum suction unit to one of a plurality of containers;
    상기 제어밸브에 의해 연결된 용기에 진공압을 형성시켜주기 위해 각 용기에 연결되는 진공펌프와;a vacuum pump connected to each container to form a vacuum pressure in the container connected by the control valve;
    상기 제어밸브에 의해 선택되지 않은 다른 용기에 수용된 유체를 배출시켜주기 위해 각 용기에 연결되는 배출펌프를 더 포함하는 것을 특징으로 하는Characterized in that it further comprises a discharge pump connected to each container to discharge the fluid accommodated in the other container not selected by the control valve
    웨이퍼 진공 픽업장치.Wafer vacuum pickup device.
PCT/KR2021/015210 2021-10-27 2021-10-27 Wafer vacuum pickup device WO2023074933A1 (en)

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JPH0693449B2 (en) * 1989-12-25 1994-11-16 佳英 柴野 Drying device for hot water pull-up system
JPH07164365A (en) * 1993-12-10 1995-06-27 Fuji Electric Co Ltd Vacuum chuck for conveyer robot
JPH0836752A (en) * 1994-07-25 1996-02-06 Hitachi Electron Eng Co Ltd Vacuum chucking mechanism for magnetic disk
US6227008B1 (en) * 1990-05-22 2001-05-08 Glasstech, Inc. Apparatus for vacuum impulse forming of heated glass sheets
KR101258404B1 (en) * 2012-01-19 2013-04-26 로체 시스템즈(주) Apparatus for conveyance of glass disk

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0693449B2 (en) * 1989-12-25 1994-11-16 佳英 柴野 Drying device for hot water pull-up system
US6227008B1 (en) * 1990-05-22 2001-05-08 Glasstech, Inc. Apparatus for vacuum impulse forming of heated glass sheets
JPH07164365A (en) * 1993-12-10 1995-06-27 Fuji Electric Co Ltd Vacuum chuck for conveyer robot
JPH0836752A (en) * 1994-07-25 1996-02-06 Hitachi Electron Eng Co Ltd Vacuum chucking mechanism for magnetic disk
KR101258404B1 (en) * 2012-01-19 2013-04-26 로체 시스템즈(주) Apparatus for conveyance of glass disk

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