WO2023067627A1

WO2023067627A1 - An improved metal card

Info

Publication number: WO2023067627A1
Application number: PCT/IN2022/050939
Authority: WO
Inventors: Pragnyat LALWANI; Arul NR
Original assignee: Seshaasai Business Forms Pvt. Ltd
Priority date: 2021-10-21
Filing date: 2022-10-20
Publication date: 2023-04-27

Abstract

The present invention discloses an improved metal card (100) and a method for manufacturing the improved metal card (100). The improved metal card (100) is a dual interface card (100) comprising at least one of a chip (102) and a magnetic strip. The chip (102) is embedded into the metal card (100) to enable contactless transactions. The metal card (100) comprises a chip slot (128) and carrier substrate (130) to receive the chip (100). The metal card also comprises a central cavity (124) and a pair of apertures (122). The pair of apertures (122) are dosed to form a connection between the chip (104) and an antenna present within the metal card (100). The soldering using solder paste dosing firmly provides a strong and foolproof connection and enhances transmission of radio frequency waves.

Description

An improved metal card

The field of invention generally relates to the fabrication of metal cards. More specifically, the invention relates to an improved metal card comprising a solder paste connection between a chip and antenna.

The Smart cards or contactless cards or transaction cards are intended for carrying out various operations such as, for example, banking operations, telephone communications, various identification operations, or operations of the tele-ticketing type.

Transaction cards are made from thermoplastic materials. These transaction cards are susceptible to being damaged or destroyed if exposed to damaging environments. For example, transaction cards may be damaged if left exposed to the elements for an extended period of time. Moisture and/or sunlight may break down the chemical bonds within the polymers of typical transaction cards resulting in warped, cracked and unusable transaction cards. In addition, thermoplastic transaction cards may be easily bent or may be broken or cut, thereby damaging the transaction card and rendering it unusable.

Typical transaction cards may comprise both a contact area structure, arranged on the card module, for example, for electrically connecting the card to a card reader, and an antenna for wireless interface. The antenna of the card module can be designed in such a way that it can perform information and energy interchange.

The antenna may exchange information with outside through an electromagnetic coupling between the card's electronics and a receiving or reading device. This coupling can be carried out in read mode or in read/ write mode, and the data transmission is carried out by radio frequency or by microwave.

Existing cards use different RFID contactless coupling techniques between the chip and antenna for the transmission of radio waves. Some of the RFID contactless coupling techniques comprise inductive coupling, capacitive coupling etc. However, such contactless couplings effect the transmission of the radio waves which in turn hinders the card performance. Further, existing cards can only be used through contact/proximity from the bottom of the card, and not from the top of the card.

Thus, in light of the above discussion, it is implied that there is need for a system and method for a transaction card that provides better connection between the chip and the antenna without any hindrance to the performance of the card, which is reliable and does not suffer from the problems discussed above.

Object of Invention

The principle object of this invention is to provide an improved metal card and a method of manufacture of the improved metal card.

A further object of the invention is to provide an improved metal card which provides a direct soldering between a chip and an antenna, for improving transmission of radio waves.

Another object of the invention is to provide a metal card comprising apertures to connect the chip and the antenna.

Another object of the invention is to provide a metal card where the lead contact wires are passed through the apertures to establish a connection between the chip and the antenna.

Another object of the invention is to provide a metal card which is dosed with solder paste in the apertures to create the connection between the chip and the antenna.

Another object of the invention is to provide a metal card with a cavity to firmly position the chip into the metal card.

Another object of the invention is to use a milling unit to provide apertures made in the metal card, to connect the chip and the antenna.

Another object of the invention is to use a camera-guided dosing unit to dose the solder paste into the apertures.

Another object of the invention is to use a hot press unit to create the connection between the chip and the antenna.

Another object of the invention is to use a lamination unit to create the improved metal card.

Another object of the invention is to give a high read distance between the card and the payment PoS terminal due to the efficient connection and antennae design.

Another object of the invention is to enable readability range on both the sides of the metal card faces.

This invention is illustrated in the accompanying drawings, throughout which, like reference letters indicate corresponding parts in the various figures.

The embodiments herein will be better understood from the following description with reference to the drawings, in which:

Fig. 1A

depicts/illustrates a side view of a metal card comprising various layers, a central cavity and a pair of apertures, in accordance with an embodiment;

Fig. 1B

depicts/illustrates a side view of the chip carrier substrate accommodating the chip in the metal card, in accordance with an embodiment;

Fig. 1C

Fig. 2

[Fig. 2] illustrates an expanded view of various layers comprised in the metal card, in accordance with an embodiment of the invention;

Fig. 3A

depicts a front view of the metal card, in accordance with an embodiment of the invention;

Fig. 3B

depicts a back view of the metal card, in accordance with an embodiment of the invention;

Fig. 4

elaborately illustrates a method for manufacturing the metal card, in accordance with an embodiment of the invention;

Fig. 5

illustrates a method 500 for manufacturing the improved metal card.

The embodiments herein and the various features and advantageous details thereof are explained more fully with reference to the non-limiting embodiments that are illustrated in the accompanying drawings and/or detailed in the following description. Descriptions of well-known components and processing techniques are omitted so as to not unnecessarily obscure the embodiments herein. The examples used herein are intended merely to facilitate an understanding of ways in which the embodiments herein may be practiced and to further enable those of skill in the art to practice the embodiments herein. Accordingly, the examples should not be construed as limiting the scope of the embodiments herein.

The present invention discloses an improved metal card and a method for manufacturing the same. The improved metal card is a dual interface metal card comprising at least one of a chip and a magnetic strip. The chip is embedded into the metal card to enable contactless transactions or actions. The metal card comprises a chip slot and chip carrier substrate to receive/accommodate the chip. Several layers of the metal card also comprise a central cavity and a pair of apertures on either side of the central cavity. The pair of apertures are dosed with solder paste to form a connection between the chip and an antenna within the metal card.

The chip may comprise a Radio Frequency IDentification (RFID) or a Near-Field Communication (NFC) chip which function as per their respective technologies. The metal card may be used as one or more of a transaction card, credit card, debit card, access card, rewards card, and identity card, among others.

The metal card is manufactured by depositing or creating thin layers of various materials on an overlay layer, thus resulting in a metal card that is sturdy, as well as easy to use and carry.

The term "chip" used herein may be understood to comprise a chip module, or a chip unit. Generally, as used herein, "chip" is intended to refer to at least one of RFID, transponder or NFC chip.

The term "antenna" used herein may be taken to comprise a coil antenna comprising a wire with a predetermined number of turns and two ends, a dipole antenna having two wire segments with two inner ends, or any other antenna configuration suitable for connecting to a chip or chip module in a transaction card.

depicts/illustrates a side view of a metal card 100 comprising various layers 108-120, a central cavity 124, a chip slot 128, a chip carrier substrate 130, and a pair of apertures 122/1, 122/2, in accordance with an embodiment. The layers of the metal card 100 comprise various different materials, such as at least one of PVC, PET, SS grade metal, plastic, adhesive, and ferrite, among others.

In an embodiment, the chip slot 128 is present as a cut-out in the metal layer 108. Further, the plastic chip carrier substrate 130 is placed in the chip slot 130 to accommodate/hold the chip 102. The chip carrier substrate 130 comprises the central cavity 124 which is a circular cut-out, as well as the pair of apertures 122/1, 122/2 which are positioned on either side of the central cavity 124.

In an embodiment, both of the central cavity 124 and the pair of apertures 122/1, 122/2 are present on multiple layers of the metal card 100. Further, the central cavity 124 may be larger in size than the pair of apertures 122/1, 122/2 which are used to connect contact pads on a bottom of the chip 102 to an antenna in the metal card 100.

In particular, the depth of the apertures 122/1, 122/2 may be more than the depth of the central cavity 124, in order to allow solder paste to connect the chip 102 to the antenna present at a rear of inlay layer 118.

In an embodiment, the chip carrier substrate 130 comprises one or more types of plastic or PVC. The PVC material may be fused or melted over a cavity surface of the chip slot 128. The PVC material is fused over the chip slot 128 by using a pre-determined requisite temperature and pressure to form the surface into the PVC chip carrier substrate 130. The advantage of the PVC chip carrier substrate 130 is that the fusing of the PVC material enables filling of the central cavity 124 and the pair of apertures 122 on either side of the chip carrier substrate 130. Additionally, plastic/PVC material of the chip carrier substrate 130 also provides insulation to the chip 102 from the metal layer 108.

In an embodiment, the central cavity 124 and the pair of apertures 122/1 and 122/2 may extend through the chip carrier substrate 130, the second adhesive layer 110, the ferrite layer 112, the insulation layer 114, and the first adhesive layer 116.

In particular, the pair of apertures 122/1 and 122/2 do not extend through the metal layer 108, as the metal layer 108 does not comprise the pair of apertures 122 and only comprises a chip slot 128.

In an embodiment, the various layers comprise different materials which altogether form the metal card 100. Further, a card manufacturing/assembly machine (not shown in the figure) may be used to assemble and create the metal card 100.

The metal card 100 is a dual interface card, and comprises a chip 102 for enabling contactless transactions. The chip 102 is connected to an antenna (not shown in the figure) by dosing solder paste through the pair of apertures 122/1 and 122/2 to form a connection between the chip 102 and the antenna. The solder paste composition comprises flux and lead.

In an embodiment, the metal layer 108 may comprise a chip slot 128 for accommodating/embedding the chip 102 comprising a contact 104. In particular, the metal layer 108 does not comprise the pair of apertures 122. Further, the thickness of the metal layer 108 is thinner than the height of the chip 102. The chip slot 128 enables the lesser thickness of the metal layer 108, as the chip slot 128 within the metal layer 108 snugly accommodates the chip 102. Hence, the thickness of the metal layer 108 does not need to be more than the thickness of the chip 102.

In an embodiment, an overlay layer 120 is deposited as a first layer. The overlay layer 120 forms a base layer on which other layers of the metal card 100 are constructed. Further, once an overlay layer 120 has been deposited, an inlay layer 118 is deposited on the overlay layer 120. The inlay layer comprises an antenna which is used for enabling contactless transactions.

After the antenna has been deposited/ positioned/ created onto the inlay layer 1, an insulation layer 114 is deposited on the inlay layer 118 by using a first adhesive layer 116. Further, a ferrite layer 112 is attached to the back/lower surface of a metal layer 108 by using a second adhesive layer 110.

In an embodiment, the metal layer 108 which is attached to the ferrite layer 112 is deposited on an insulation layer 114.

depicts/illustrates a side view of the metal card 100 comprising the pair of apertures 122 dosed with a solder paste 126, in accordance with an embodiment. The pair of apertures are used to create a connection between the chip 102 and the antenna by using solder paste 126, as depicted in the figure.

In an embodiment, the overlay layer 120 may be created from any material comprising at least one of plastic or metal, and polymer. Further, biodegradable plastic may be used to create the overlay layer 120. In an embodiment, thickness of the overlay layer 120 may be of any dimension.

In an embodiment, the inlay layer 118 may comprise PVC (polyvinyl chloride). Alternatively, the inlay layer 118 may also be made of other materials such as polymer, among others.

In an embodiment, the antenna may be positioned on the inlay layer 118 by at least one technique comprising embedding, mounting, adhesive sticking, copper wire etching or printing. The antenna may be mounted on the inlay layer 118 such that the antenna wire is embedded into the inlay layer 118. Alternately, the antenna wire may be stuck onto the surface of the inlay layer 118 by using an adhesive. Further, the antenna wire may comprise a copper wire. In another embodiment, the antenna may be printed on the inlay layer 118 by using conductive inks.

Advantageously, a high read distance is achieved between the metal card 100 and any payment PoS terminals, due to the efficient connection and antennae design. Further, the metal card 100 enables readability ranges on both the sides of the metal card 100 faces. Thus, the metal card 100 can be read from wither face instead of only one face.

In an embodiment, the insulation layer 114 may comprise any plastic material capable of insulating high frequency signals. In a preferred embodiment, the insulation layer 114 may comprise, but is not limited to, Polyethylene terephthalate (PET) material.

In an embodiment, the metal card 100 may or may not comprise the insulation layer 114.

In an embodiment, the thickness of the ferrite layer 112 may comprise at least one ferrite material such as a microscale, printed, iron alloy ferrite material. The ferrite layer 112 may comprise a thickness of approximately 100 microns. The ferrite layer 112 prevents any interference of the metal layer 108 with the antenna. Further, the ferrite layer 112 is placed below the metal layer 108 to act as a shield, which advantageously prevents the metal layer 108 from interfering with radio frequency radiation to and from the metal card 100.

In an embodiment, the first and second

adhesive layers

110 and 116 may comprise any general adhesive commonly known in the art, which is used in the process of manufacturing transaction cards. The thickness of the adhesive may comprise approximately 50 microns.

In an embodiment, the metal layer 108 may comprise at least one metal such as stainless steel, gold, silver, and platinum, among others. The metal comprises a required grade, which can be selected from different available grades for each metal, based on the purpose of the metal card 100 or user requirements. The thickness of the metal layer 108 may be approximately 300 to 400 microns. In other embodiments, the thickness of the metal layer 108 may vary from 200 to 500 microns, or as per user requirements.

In an embodiment, one or more surfaces of the metal card 100 may be coated with different materials to make the metal card 100 resistant to scratches, damages, fingerprints, as well as adding colors and design to an appearance of the metal card 100. Further, the surfaces of the metal card 100 may be engraved with unique designs, characters, among others.

In an embodiment, one or more graphic designs such as images, graphics, words, or other symbols may be rendered/ deposited/ stuck on one or more faces of the metal card 100. The graphic designs may be rendered by using one or more different known techniques such as etching, spray painting, differential laser burning, anodizing, powder coating, screen printing, specialized texture coating on steel or inkjet etc.

In an embodiment, the surface of the metal layer 108 may be etched through milling by using machines such as a mechanical CNC machine. The etching allows written description/matter/logos to be added to the surface of the metal layer 108, such that the written description//matter/logos may be clearly visible and/or etched. In an embodiment, certain portions of paint and layers of the metal card may be removed to add the written description//matter/logos onto the surface of the metal layer 108.

In an embodiment, one or more faces of the metal card 100 may be embedded with one or more ornamental elements. The ornamental elements may comprise one or more of semi-precious stones, and tone finishes of one or more of gold, silver, rose gold, and rhodium, among others.

In an embodiment, the metal card 100 may be designed with different dimensions as per the requirements of the transaction card environment. The dimensions may vary based on one or more required changes in shapes, sizes, and edges, among others etc. Further, the dimensions of the metal card 100 may be customized based on any particular user requirements.

The proposed method for manufacturing metal cards may be further extended and altered to manufacture other multipurpose cards whose structure may be similar to the transaction cards or the access control cards as disclosed in the present invention.

depicts/illustrates a side view of the chip carrier substrate 130 accommodating the chip 102 in the metal card 100, in accordance with an embodiment.

In an embodiment, the chip carrier substrate 130 may be placed within a V-shaped cavity or any other shaped cavity inside the chip slot 128. The edges 132/1 and 132/2 of the chip carrier substrate 130 are designed as depicted in the figure, to firmly and tightly accommodate and lock the chip 102. The edges 132/1 and 132/2 may be designed with one or more inclined and step edges. In an embodiment, the edges 132/1 and 132/2 comprise both an inclined edge of approximately 40-50 degrees, as well as a step-shaped edge. The inclined edge may comprise approximately one or more inclinations such as 45 degree inclination, 40-50 degrees inclination, or 30-60 degrees inclination.

[Fig. 2] illustrates an expanded view of various layers comprised in the metal card 100, in accordance with an embodiment of the invention.

In an embodiment, the chip slot 128 may be approximately 0.2-0.4 mm thick. In other embodiments of the invention, the thickness of the chip slot 128 for holding the chip 102 may vary between 0.1 mm and 0.3 mm, based on the size of the chip 102. The height and size of the chip slot 128 within the metal layer 108 enables a firm accommodation of the chip 102. Hence, the thickness of the metal layer 128 is manufactured to be less than the height of the chip 102.

In an embodiment, the card manufacturing/assembly machine may comprise a milling unit for creating the central cavity 124 and the pair of apertures 122/1 and 122/2.

In an embodiment, the chip carrier substrate 130 accommodates the lower surface of the chip 102 i.e., the base of the chip 102, such that the base of the chip 102 may face the inlay layer 118 comprising the antenna wires, with a gap between the base of the chip 102 and the inlay layer 118. The gap between the top of the chip 102 and the antenna/inlay layer 118 may be in a range of approximately 500 to 570 microns.

In an embodiment, the card manufacturing/assembly machine may comprise a dosing unit which is used to dose a predetermined amount of solder paste into the pair of apertures 122/1 and 122/2, for forming a connection between the chip 102 and the antenna as depicted in the figure. The pair of apertures 122 in the chip carrier substrate 130, the second adhesive layer 110, the ferrite layer 112, the insulation layer 114, and the first adhesive layer 116 are simultaneously dosed by the dosing unit.

In an embodiment, the pair of apertures are used to form a connection between the chip 102 and the antenna, either with or without lead contact wires or contact pads of the chip 102, as explained below.

In an embodiment, the chip 102 may also comprise a pair of contact pads and/or lead contact wires at the lower surface of the chip 102. In this case, the pair of apertures 122 are dosed and the lead contact wires are partially extended into the pair of apertures 122 to form the connection between the chip 102 and the antenna. The lead contact wires may comprise but are not limited to gold wires.

In an embodiment, the card manufacturing/assembly machine may comprise a camera-guided mechanism to accurately and efficiently guide the dosing unit towards the pair of apertures 122/1 and 122/2.

In an embodiment, the card manufacturing/assembly machine may comprise a hot press unit which is used to apply heat and pressure to the dosed apertures, in order to create a strong permanent connection between the chip 102 and the antenna. The hot press unit applies the required heat and pressure to the soldered connection to reinforce the homogeneity and strength of the connection between the chip 102 and the antenna. Advantageously, the direct connection using lead soldering between the chip 102 and the antenna provides a strong and foolproof connection.

The soldering provides a physical bonding between the antenna and chip 102. Therefore, the performance of the metal card 100 is not affected by external Radio Frequency (RF) interference, as compared to other wireless metal card connections. Thus, the direct soldering connection results in radio waves which provide better efficiency than wireless connection resultant radio waves for similar inputs.

In an embodiment, the direct connection between the antenna and the chip 102 can also be implemented by using other connectivity technologies. One such connection may comprise thermo-compression chip welding where the antenna wire is extended and connected to the chip 102. Other connections may comprise usage of contact pads i.e., copper or tin pads through which antenna wires are connected to the chip 102 using lead soldering through the dosing unit.

In an embodiment, the card manufacturing/assembly machine may also comprise a lamination unit, which simultaneously laminates/ compresses all layers 108 – 120, to create the metal card 100.

In an embodiment, every layer comprised in the metal card 100 may be deposited using different techniques such as compression techniques and embedding techniques during the manufacture of the metal card 100.

Further, after the metal card 100 has been manufactured, a magnetic strip is deposited on a back side of the metal card 100. In an embodiment, said magnetic strip may be approximately 60 microns thick. The magnetic strip thickness may also be between 50-70 microns, as per user requirements. In other embodiments, the thickness of the magnetic strip may vary.

In an embodiment, a HiCo magnetic strip may be used to store financial user information. A person skilled in the art will realize a HiCo strip is also known as high coercivity strip, that is generally known to be durable and more secure as compared to other commonly known magnetic strips.

depicts a front view of the metal card 100, in accordance with an embodiment of the invention. In an embodiment, the metal card 100 is used as a transaction card and comprises structure and surface dimensions similar to a general card.

In an embodiment, the metal card 100 comprises details of users on a front surface of the metal card 100. The details of the user may comprise at least one of personal and financial data. The personal data may comprise at least one of name of the user, customer id of the user, name of an organization or financial institution issuing the metal card 100, type of card, year of expiry of the metal card 100, among others. The financial data may comprise at least one of card number, account number, and other secure financial data, among others.

In an alternate embodiment, the metal card 100 may comprise details of users on a back surface of the metal card 100.

depicts a back view of the metal card 100, in accordance with an embodiment of the invention.

The back surface of the metal card 100 comprises at least one component such as a magnetic strip 302, a space for signature of the user, and financial information such as secure codes related to the metal card 100.

elaborately illustrates a method for manufacturing the metal card, in accordance with an embodiment of the invention.

The method begins with creating a central cavity to fit a dual interface chip, by using a milling unit, as depicted at step 402. Subsequently, the method 400 discloses creating a pair of apertures, by using the milling unit, as depicted at step 404. Thereafter, the method 400 discloses dosing solder paste into the pair of apertures by using a camera-guided dosing unit, as depicted at step 406. The method 400 further discloses creating a permanent connection between the chip and antenna by using a hot press unit to press the chip onto the dozed pair of apertures. Thereafter, the method 400 discloses laminating all layers simultaneously to create the improved metal card, by using a lamination unit.

illustrates a method 500 for manufacturing the improved metal card. The method 500 begins with depositing an overlay layer as a base of the metal card, as depicted at step 502. The overlay is deposited on a manufacturing plate present in the card manufacturing/assembly machine. Once an overlay layer has been deposited, an inlay layer comprising an antenna wire is deposited on the overlay layer, as depicted at step 504. The inlay layer is made of plastic/ PVC material.

Subsequently, an insulation layer is deposited on the inlay layer by using a first adhesive layer, as depicted at step 506. The insulation layer is made of a PET material. Thereafter, a ferrite layer is deposited on the insulation layer, as depicted at step 508. Further, a metal layer is deposited on the ferrite layer by using a second adhesive layer, as depicted at step 510. The ferrite layer shields and prevents the metal layer from interfering with radio frequency radiation to and from the antenna.

Thereafter, a chip slot is created on the metal layer, and a chip carrier substrate is placed inside the chip slot, as depicted at step 512. The chip carrier substrate is made of a PVC material to support the chip which is to be placed into the chip slot. Further, all layers are laminated to create a metal card, as depicted at step 514. Further, the carrier substrate, the second adhesive layer, the ferrite layer, the insulation layer, and the first adhesive layer are each milled/pierced with a central cavity and a pair of apertures on either side of the central cavity, as depicted at step 516.

Further, the pair of apertures are dosed with a solder paste and a chip is placed into the chip slot to connect the antenna wires with the chip, as depicted at step 518. The dozing is done in a controlled manner under camera supervision.

Subsequently, required heat and pressure are applied to form a soldered connection, as depicted at step 520, to further reinforce the homogeneity and strength of the connection.

Thus, such a direct connection using lead soldering between the chip and the antenna provides a strong and foolproof connection. Additionally, it enhancing the transmission of the radio frequency waves. The proposed manufacturing method of the metal card comprising both metal layers and plastic layers enhances both the strength and durability of the metal card.

Advantages of the current invention comprise providing a high durability metal card and its method of manufacture. The method of using multiple layers of various materials aids in improving the durability of the card, thus preventing the card from breaking due to accidental snapping.

Advantageously, the carrier substrate and the solder paste dosing fix firmly attach the chip into the chip slot. Additionally, the shape of the edges of the carrier substrate firmly locks the chip within the chip slot. The PVC material of the carrier substrate also acts as an insulation medium between the chip and the metal layer.

Another advantage of the present method of manufacture of metal cards is the reduced usage of plastic required in the manufacturing process, thereby reducing carbon footprints of users. The minimal usage of plastic in the manufacture of the metal cards also ensures less plastic and plastic-related contaminants being dumped into the environment.

The foregoing description of the specific embodiments will so fully reveal the general nature of the embodiments herein that others can, by applying current knowledge, readily modify and/or adapt for various applications such specific embodiments without departing from the generic concept, and, therefore, such adaptations and modifications should and are intended to be comprehended within the meaning and range of equivalents of the disclosed embodiments. It is to be understood that the phraseology or terminology employed herein is for the purpose of description and not of limitation. Therefore, while the embodiments herein have been described in terms of preferred embodiments, those skilled in the art will recognize that the embodiments herein can be practiced with modification within the scope of the embodiments as described here.

Claims

An improved metal card (100) comprising:
a front surface;
a back surface;
at least one metal layer (108);
one or more layers comprised in between the front surface and the back surface, wherein the one or more layers comprises at least one of:
an inlay layer (118) comprising an embedded antenna;
at least one non-metal layer; and
at least one adhesive layer (110); and
a chip (102) configured to be placed within a slot on the metal layer (108), wherein the chip (102) is connected to the antenna via connecting mechanisms.
The card as claimed in claim 1, wherein the one or more layers comprise an overlay layer (120), the inlay layer (118), an insulation layer (114), a ferrite layer (112), a first adhesive layer (116) and a second adhesive layer (110).
The card as claimed in claim 1, wherein a thickness of the metal layer (108) is less than a height of the chip (102) placed within the slot on the metal layer (108).
The card as claimed in claim 1, wherein the slot is configured to receive a carrier substrate.
The card as claimed in claim 4, wherein the one or more layers and the carrier substrate are pierced, milled or culled to form a smaller center slot and one or more apertures.
The card as claimed in claim 5, wherein the smaller center slot on the carrier substrate and one or more pierced layers are configured to receive a base of the chip (102).
The card as claimed in claim 6, wherein the carrier substrate passes lead contact wires of the chip (102) into the one or more apertures, and wherein the one or more apertures are dozed with a solder paste to connect antenna wires with the lead contact wires to form a connection.
The card as claimed in claim 7, wherein the connection is a solder connection created from application of heat and pressure, to provide better transmission of radio frequency waves.
The card as claimed in claim 7, wherein the solder paste comprises of flux and lead.
The card as claimed in claim 8, wherein the solder paste is dozed into the one or more apertures using a camera-guided dosing unit.
The card as claimed in claim 3, wherein at least one of the overlay layer (120) and the inlay layer (118) comprise at least one of plastic, metal, polycarbonate, polyvinyl chloride, and a polymer.
The card as claimed in claim 3, wherein the insulation layer (114) comprises at least one of polycarbonate, and polyethylene terephthalate.
The card as claimed in claim 1, comprises a lamination unit configured to laminate the one or more layers to create an improved card.
A method of manufacturing a metal card comprising:
providing a front surface and a back surface of the metal card (100);
creating at least one metal layer (108) in the metal card (100);
creating at least one or more layers comprised in between the front surface and the back surface, comprising:
creating an inlay layer (118) comprising an embedded antenna;
creating at least one non-metal layer; and
creating at least one adhesive layer; and
connecting a chip to an antenna via connecting mechanisms, wherein the chip (102) is configured to be placed within a slot on the metal layer (108).
The method as claimed in claim 14, wherein creating at least one or more layers comprises creating an overlay layer (120), the inlay layer (118), an insulation layer (114), a ferrite layer (112), a first adhesive layer (116) and a second adhesive layer (110).
The method as claimed in claim 14, comprising creating a thickness of the metal layer (108) to be less than a height of the chip (102) placed within the slot on the metal layer (108).
The method as claimed in claim 14, comprising receiving a carrier substrate on the slot.
The method as claimed in claim 14, comprising piercing, milling or culling the one or more layers and the carrier substrate to form a smaller center slot and one or more apertures.
The method as claimed in claim 18, comprising receiving a base of the chip (102) on the smaller center slot of the carrier substrate and one or more pierced layers.
The method as claimed in claim 18, comprising:
passing lead contact wires to be connected the chip (102), through the carrier substrate into at least one of the one or more apertures; and
dozing the one or more apertures with a solder paste to connect antenna wires with the chip (102) to form a connection.
The method as claimed in claim 20, comprising forming the connection which is a solder connection through application of heat and pressure, to provide better transmission of radio frequency waves.
The method as claimed in claim 21, comprising using a camera-guided dosing unit for dozing the solder paste into the one or more apertures.
A transaction card comprising:
a front surface and a back surface, wherein one or more layers are comprised in between the front surface and the back surface;
the one or more layers created to comprise at least one metal layer (108), at least one non-metal layer and at least one adhesive layer (110);
an inlay layer (118) comprising an embedded antenna;
a chip (102) configured to be placed within a slot on a metal layer (108), wherein the chip (102) is connected to the antenna via connecting mechanisms;
wherein the slot is created on the metal layer (108), and wherein the slot is configured to receive a carrier substrate; and
wherein the one or more layers and the carrier substrate are pierced to form a smaller center slot and one or more apertures, thereby facilitating one or more wires connected to the chip (102) to pass through at least one of the one or more apertures and the smaller center slot.
The transaction card as claimed in claim 23, wherein a thickness of the metal layer (108) is less than a height of the chip (102) placed within the slot on the metal layer (108).