WO2022268131A1 - Optical transceiving assembly - Google Patents

Optical transceiving assembly Download PDF

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Publication number
WO2022268131A1
WO2022268131A1 PCT/CN2022/100516 CN2022100516W WO2022268131A1 WO 2022268131 A1 WO2022268131 A1 WO 2022268131A1 CN 2022100516 W CN2022100516 W CN 2022100516W WO 2022268131 A1 WO2022268131 A1 WO 2022268131A1
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WO
WIPO (PCT)
Prior art keywords
optical
optical signal
signal
bidirectional
uplink
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PCT/CN2022/100516
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French (fr)
Chinese (zh)
Inventor
汪绍武
李志伟
廖永平
曾金林
王谦
锁靖
Original Assignee
华为技术有限公司
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Publication of WO2022268131A1 publication Critical patent/WO2022268131A1/en

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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4287Optical modules with tapping or launching means through the surface of the waveguide
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12007Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
    • G02B6/12009Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/14Mode converters
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/26Optical coupling means
    • G02B6/28Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4256Details of housings
    • G02B6/426Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B10/00Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/40Transceivers

Definitions

  • the present application relates to the technical field of optical communication, and in particular to an optical transceiver component.
  • optical network termination belongs to the equipment on the user side, which can provide users with service interfaces and has the function of electro-optical conversion, realizing the communication between users and the access network. signal exchange.
  • BOSA bi-directional optical sub-assembly
  • the ONT generally uses a bi-directional optical sub-assembly (BOSA) structure to transmit and receive optical signals.
  • BOSA is a structure commonly used in optical communication systems, and its function is to realize integrated optical signal transmission and reception.
  • the BOSA structure contains many components and the packaging process is complicated, for example, it is difficult to accurately locate and fix the components when they are coupled, so there are defects of difficulty in integration and high cost.
  • An embodiment of the present application provides an optical transceiver component, which is used to design an optical transceiver component with low integration difficulty and low cost in an ONT.
  • an optical transceiver component including: an optical transmitter, a bidirectional wave splitter, and an optical receiver; the bidirectional wave splitter is coupled to the optical transmitter through a first optical waveguide port, The port is coupled with the optical receiver and is coupled with the optical fiber through the third optical waveguide port; wherein, the bidirectional wave splitter is prepared based on an optical waveguide chip; the optical transmitter is used to generate an uplink optical signal, and transmit the The uplink optical signal is injected into the bidirectional demultiplexer; the bidirectional demultiplexer is used to transmit the uplink optical signal into the optical fiber; and receive the downlink optical signal from the optical fiber, and transmit the The downlink optical signal is transmitted to the optical receiver; the optical receiver is configured to receive the downlink optical signal.
  • the bidirectional wave splitter prepared by using the optical waveguide chip can realize the optical signal transceiver function that can be realized by the BOSA structure adopted in the prior art.
  • the optical transceiver assembly based on the bidirectional wave splitter prepared by the optical waveguide chip provided by the present application has the advantages of less difficulty in integration and lower cost. Therefore, the present application provides an optical transceiver assembly that can be implemented in a simple manner, thereby reducing the cost of the optical transceiver assembly.
  • the optical transmitter is end-face-coupled with the first optical waveguide port of the bidirectional wave splitter by using a flip-chip bonding process.
  • the coupling between the optical transmitter and the bidirectional wave splitter can be realized by adopting a simple packaging method, and the transmission power of the optical signal can be guaranteed through the flip-chip bonding process.
  • the second optical waveguide port is designed as an inclined total reflection surface using a grinding and polishing process, and the optical receiver is configured to receive a downlink optical signal transmitted through the inclined total reflection surface.
  • the optical receiver can be patched on the output side of the second optical waveguide port of the bidirectional wave splitter after being reflected by the inclined total reflection surface, so that the optical receiver can effectively receive the downlink optical signal.
  • a signal amplifier is also included; the input end of the signal amplifier is connected to the output end of the optical receiver, and is used for signal amplification of the downlink optical signal received by the optical receiver .
  • the signal amplifier is used to amplify the received downlink optical signal, which can increase the signal gain of the downlink optical signal, thereby ensuring the accuracy of processing according to the downlink optical signal.
  • it also includes a first speckle converter; the input end of the first speckle converter is connected to the optical transmitter, and the output end is connected to the first optical waveguide port of the bidirectional wave splitter , for converting the spot size of the uplink optical signal output by the optical transmitter into the spot size of the uplink optical signal received by the bidirectional wave splitter through the first optical waveguide port.
  • the use of the mode spot converter can reduce the loss of the uplink optical signal during transmission, thereby ensuring the transmission power of the uplink optical signal.
  • the first speckle converter may be, but not limited to, a tapered speckle converter, an inverted tapered speckle converter, or a grating-type speckle converter.
  • a mode speckle converter with a suitable shape can be selected according to the actual needs of the optical transceiver components, so that the coupling rate between the two optical elements can be improved and the power during optical signal transmission can be guaranteed.
  • it also includes a second speckle converter; the input end of the second speckle converter is connected to the third optical waveguide port of the bidirectional wave splitter, and the output end is connected to the optical fiber, using Converting the spot size of the uplink optical signal output by the bidirectional wave splitter through the third optical waveguide port into the spot size of the uplink optical signal received by the optical fiber.
  • the loss of the downlink optical signal in the transmission process can be reduced by using the mode spot converter, so that the transmission power of the downlink optical signal can be guaranteed.
  • the second speckle converter may also be, but not limited to, a tapered speckle converter, an inverted tapered speckle converter, or a grating type speckle converter.
  • the mode speckle converter with a suitable shape can be selected according to the actual requirements of the optical transceiver components. Therefore, the coupling rate between the two optical elements can be improved, and the power during the transmission of the optical signal can be guaranteed.
  • the optical waveguide chip may be a planar optical waveguide chip.
  • the implementation of the bidirectional wave splitter by using the planar optical waveguide chip can simplify the implementation process of the optical transceiver component, thereby reducing the cost of the optical transceiver component.
  • the bidirectional wave splitter includes an optical waveguide and a silicon dioxide cladding; the optical waveguide can adopt a directional coupler (direction coupler, DC) structure, a Mach-Zehnder interferometer (mach zehnder interferometer) , MZI) structure or arrayed waveguide grating (arrayed waveguide grating, AWG) structure design.
  • DC direct coupler
  • MZI Mach-Zehnder interferometer
  • AWG arrayed waveguide grating
  • the optical waveguide with a certain structural design is used to realize the optical splitter, and then through the coupling between different optical waveguide ports and optical transmitters, optical receivers and optical fibers, it can realize the transmission and reception of optical signals. , simplify the realization of the optical transceiver component, and reduce the cost of forming the optical transceiver component.
  • the embodiment of the present application further provides an optical device, which may include the optical transceiver component, processor, and optical control chip as introduced in the first aspect or any possible design of the first aspect.
  • the processor can be used to encode and encapsulate the data into a data message conforming to the optical transmission protocol, and send it to the optical control chip.
  • the optical control chip can receive the data message sent by the processor and convert it into an optical driving signal (analog signal) to drive the optical transmitter included in the optical transceiver component to generate an uplink optical signal.
  • optical device in the above second aspect includes the optical transceiver components of the various designs in the above first aspect, it also has the technical effects that can be brought by the various designs in the above first aspect, and will not be repeated here.
  • FIG. 1 is a schematic diagram of a scene of an optical communication system
  • FIG. 2 is one of the structural schematic diagrams of an optical transceiver component provided in an embodiment of the present application
  • FIG. 3a is a schematic structural diagram of an optical transceiver component adopting a DC structure provided by an embodiment of the present application
  • Fig. 3b is a schematic diagram of signal transmission of an optical transceiver component adopting a DC structure provided by an embodiment of the present application;
  • FIG. 3c is a schematic structural diagram of an optical transceiver assembly using an MZI structure provided in an embodiment of the present application
  • FIG. 3d is a schematic structural diagram of an optical transceiver assembly using an AWG structure provided by an embodiment of the present application.
  • FIG. 4 is the second structural schematic diagram of an optical transceiver component provided by an embodiment of the present application.
  • Fig. 5 is the third structural schematic diagram of an optical transceiver component provided by the embodiment of the present application.
  • FIG. 6 is the fourth structural schematic diagram of an optical transceiver component provided by an embodiment of the present application.
  • Fig. 7a is one of the optical signal transmission diagrams at the second optical waveguide port provided by the embodiment of the present application.
  • Fig. 7b is a second diagram of optical signal transmission at the port of the second optical waveguide provided by the embodiment of the present application.
  • the optical transceiver component provided in the embodiment of the present application may be applied in an optical communication system, and the optical communication system may be, for example, a PON system.
  • the PON system is a technology based on point-to-multipoint (point 2 multiple point, P2MP) topology.
  • Passive means that the optical network does not contain any electronic devices and electronic power sources, all of which are composed of passive devices and do not require expensive active electronic devices.
  • the PON system can be an Ethernet passive optical network (ethernet PON, EPON) system, a gigabit-capable PON (GPON) system, a passive optical network based on wavelength division multiplexing (wavelength division multiplexing) PON, WDM PON) system, passive optical network (asynchronous transfer mode PON, APON) system based on asynchronous transfer mode, etc.
  • Ethernet PON Ethernet PON
  • GPON gigabit-capable PON
  • WDM PON wavelength division multiplexing
  • APON passive optical network
  • an optical communication system may include at least multiple ONTs and optical splitters. Multiple ONTs may communicate with upper-layer access devices through optical splitters. Upper-layer access devices may be, for example, optical lines Terminal (optical line termination, OLT).
  • FIG. 1 is a schematic diagram of a partial scene of an optical communication system.
  • the multiple ONTs included in the optical communication system may be ONT1, ONT2, . . . , ONTn, respectively.
  • Each ONT can be connected to multiple users.
  • ONT1 can be connected to user 1 and user 2; or an ONT can also be connected to one user.
  • ONT1 can be connected to user 3, and ONTn can be connected to ONTm.
  • the ONT as the terminal equipment on the user side in the optical communication system, can provide the user with a service interface and has the function of electro-optic conversion to realize the signal conversion process between the user and the access network.
  • the ONT included in the optical communication system in the prior art usually uses a BOSA structure to implement signal sending and receiving.
  • BOSA can realize the transmission and reception of integrated optical signals.
  • BOSA needs to package laser diode (LD), trans-impedance amplifier (TIA), WDM, ceramic sleeve, ceramic ferrule components, etc. into a coaxial module.
  • LD laser diode
  • TIA trans-impedance amplifier
  • WDM ceramic sleeve
  • ceramic ferrule components etc. into a coaxial module.
  • the embodiment of the present application provides an optical transceiver component, which is used to obtain the optical transceiver component in a simple way to meet the optical signal transceiver function that can be realized by using the BOSA structure in the prior art. Therefore, the optical transceiver assembly provided by the embodiment of the present application can be used to replace the complex packaged BOSA structure existing in the prior art, thereby reducing the integration cost of the optical transceiver assembly.
  • FIG. 2 it is a schematic schematic diagram of an optical transceiver component 200 provided in an embodiment of the present application.
  • the optical transceiver component 200 may be used for optical equipment in an optical communication system to implement optical signal transmission and reception, and the optical equipment may be, for example, an ONT.
  • the optical transceiver assembly 200 may at least include:
  • the light transmitter 201 may be, for example, a laser, specifically a passive patch type laser. Wherein, the laser can generally be realized by using a laser diode (LD).
  • the optical transmitter 201 is configured to emit light according to the optical driving signal, that is, generate an uplink optical signal, and inject the uplink optical signal into the bidirectional demultiplexer 202 .
  • the data carried by the uplink optical signal may be represented as data sent to other devices when the optical device where the optical transceiver component is located serves as the sending end.
  • the data to be sent by the optical device where the optical transceiver component is located can be sent to an upper-layer access device based on an optical fiber in the form of an uplink optical signal, and then transmitted to the core network.
  • the bidirectional wave splitter 202 is used to perform bidirectional wavelength division multiplexing processing on the upstream optical signal and the downstream optical signal according to the wavelength, which can also be called wavelength division multiplexing (wavelength division multiplexing, WDM)+bidirectional (bidirectional, BiDi) )structure.
  • WDM wavelength division multiplexing
  • the wavelength of an uplink optical signal may generally be 1270 nm and/or 1310 nm
  • the wavelength of a downlink optical signal may generally be 1490 nm and/or 1577 nm.
  • the bidirectional demultiplexer 202 may be used to receive an uplink optical signal and transmit the uplink optical signal into an optical fiber.
  • the bidirectional demultiplexer 202 can also be used to receive the downlink optical signal from the optical fiber, and transmit the downlink optical signal to the optical receiver 203 .
  • the data carried by the downlink optical signal may be represented as data sent by other devices when the optical device where the optical transceiver component is located serves as the receiving end.
  • the downlink optical signal after the demultiplexing process by the bidirectional demultiplexer 202 can be received by the optical receiver 203 , and then undergoes photoelectric conversion to obtain the carried data.
  • the bidirectional wave splitter 202 can be fabricated based on an optical waveguide chip, and transmit optical signals through the optical waveguide. Moreover, the bidirectional wave splitter 202 can be coupled to the optical transmitter 201 through the first optical waveguide port, coupled to the optical receiver 203 through the second optical waveguide port, and coupled to the optical fiber through the third optical waveguide port.
  • the bidirectional wave splitter prepared by using the optical waveguide chip can realize the optical signal transceiver function that can be realized by the BOSA structure adopted in the prior art.
  • the optical transceiver assembly based on the bidirectional wave splitter prepared by the optical waveguide chip provided by the present application has the advantages of less difficulty in integration and lower cost.
  • the optical waveguide chip can be a planar lightwave circuit (PLC) chip, and can also be understood as a chip integrated based on PLC technology; or optionally, a silicon-based chip, etc.
  • PLC is a technology used to realize optical waveguide transmission.
  • chips integrated with PLC technology can be realized based on a variety of materials.
  • silicon dioxide is the most widely used material in the market, that is, chips integrated with PLC technology can be based on silicon dioxide materials with low refractive index characteristics as cladding.
  • the optical waveguide with a higher refractive index than the silica cladding is wrapped in the inner layer. In this way, the overflow of the optical signal transmitted through the optical waveguide can be avoided by the silica cladding, thereby avoiding the loss of the energy of the optical signal.
  • the bidirectional wave splitter 202 may include an optical waveguide and a silicon dioxide cladding.
  • the silicon dioxide cladding layer has a characteristic of low refractive index, so that the transmission of optical signals can be ensured, and the power loss of optical signals can be reduced.
  • the optical waveguide can be designed using a directional coupler (direction coupler, DC) structure, a Mach-Zehnder interferometer (mach zehnder interferometer, MZI) structure, or an arrayed waveguide grating (arrayed waveguide grating, AWG) structure.
  • DC direction coupler
  • MZI Mach-Zehnder interferometer
  • AWG arrayed waveguide grating
  • FIG. 3 a it is a schematic structural diagram of an optical transceiver component 200 adopting a DC structure provided by an embodiment of the present application.
  • a DC structure may contain two input ports and two output ports.
  • one of the two input ports of the DC structure is used as the port for injecting uplink optical signals into the optical transceiver assembly 200 by the optical transmitter 201, that is, the first optical waveguide port shown in FIG. 3a, assuming port A; the other input port is used as the port for the optical transceiver assembly 200 to receive downlink optical signals from the optical fiber, that is, the third optical waveguide port shown in FIG. 3 a , which is assumed to be port D.
  • one of the two output ports of the DC structure is used as the port for the optical receiver 203 to receive the downlink optical signal from the optical transceiver assembly 200, that is, the second optical waveguide port shown in FIG. 3a, assumed to be C port; the other output port can be used as a backup port, which can wait for new functions to be discovered, assuming it is port B.
  • FIG. 3 b is a schematic diagram of signal transmission of the optical transceiver assembly using the DC structure provided by the embodiment of the present application.
  • the uplink optical signal injected by the optical transmitter 201 from the A port to the bidirectional demultiplexer 202, after passing through the optical waveguide of the DC structure, can pass through the D The port is transmitted to the optical fiber.
  • the wavelength of the downlink optical signal is 1577nm
  • the downlink optical signal transmitted from the optical fiber at the D port passes through the optical waveguide of the DC structure, it can be transmitted to the optical receiver 203 through the C port for further processing. take over.
  • the optical waveguide of the DC structure can realize the transmission of the 1270nm optical signal from the upper waveguide to the lower waveguide, and can realize the transmission of the 1577nm optical signal from the lower waveguide to the upper waveguide and then to the lower waveguide Therefore, the length of the DC structure can be designed as an optical waveguide within a specified length range, and the optical waveguide within the specified length range can realize the optical signal transmission path as shown in Figure 3b. In this way, the uplink optical signal and the downlink optical signal can be separately processed according to the characteristics of different wavelengths through the DC structure, and then the optical signal transceiving function of the optical transceiver component 200 can be realized.
  • FIG. 3 c it is a schematic structural diagram of an optical transceiver assembly 200 using an MZI structure provided by an embodiment of the present application.
  • the principle of the MZI structure is mainly to construct optical waveguides of different lengths to realize mutual interference of optical signals after transmission through different optical paths, and finally, optical signals of different wavelengths can be output from two different ports respectively.
  • the MZI structure shown in Figure 3c contains two lengths of optical waveguides.
  • the downlink optical signal and the uplink optical signal can be respectively transmitted through two optical waveguides of different lengths in the MZI structure, so that they can be output from different ports, so as to ensure the demultiplexing of the downlink optical signal and the uplink optical signal by the optical transceiver component processing, so as to ensure that the optical transceiver component 200 realizes the optical signal transceiver function.
  • FIG. 3 d it is a schematic structural diagram of an optical transceiver assembly 200 adopting an AWG structure provided by an embodiment of the present application.
  • the AWG structure can be divided into a waveguide array and multiple ports on both sides of the waveguide array. After the optical signal passes through the waveguide array, a certain phase difference can be generated, so that optical signals of different wavelengths can be transmitted from different designated ports. .
  • the AWG structure can be used to input the uplink optical signal from the left port of the waveguide array (that is, the first optical waveguide port introduced in the previous embodiment), and from the waveguide
  • the specified port on the right side of the array outputs an uplink optical signal (that is, the third optical waveguide port introduced in the foregoing embodiments);
  • the third optical waveguide port introduced in the above) and the downlink optical signal is output from the designated port on the left side of the waveguide array (that is, the second optical waveguide port introduced in the foregoing embodiments).
  • the designated port for outputting the uplink optical signal on the right side of the waveguide array can be the same as the port for inputting the downlink optical signal, which can be understood as the third optical waveguide port; while the left side of the waveguide array is the port for inputting the uplink optical signal Different from the port for outputting downlink optical signals, it can be understood as the first optical waveguide port and the second optical waveguide port.
  • the downlink optical signal can be received from a transmission port different from the uplink optical signal, so that the uplink optical signal and the downlink optical signal can be processed separately according to different wavelength characteristics.
  • the light receiver 203 may be, for example, a detector.
  • the detector can generally be realized by an avalanche photodiode (APD).
  • the optical receiver 203 may be used to detect and receive the downlink optical signal.
  • An optical fiber port configured to connect the optical transceiver assembly 200 to an optical fiber, such as the third optical waveguide port shown in FIG. 2 .
  • the optical transceiver assembly 200 may implement optical signal transmission with an optical device such as the optical splitter 100 shown in FIG. 1 through a connected optical fiber.
  • the optical transceiver component 200 provided in the present application may further include a signal amplifier 204 .
  • FIG. 4 it is a schematic structural diagram of another optical transceiver component 200 provided in the embodiment of the present application.
  • the input terminal of the signal amplifier 204 can be connected with the output terminal of the optical receiver 203 .
  • the signal amplifier 204 can generally be realized by a transimpedance amplifier (TIA), and can be used to amplify the downlink optical signal received by the optical receiver 203, so as to ensure the signal gain of the received downlink optical signal.
  • TIA transimpedance amplifier
  • the optical equipment including the optical transceiver assembly 200 may further include a processor and an optical control chip.
  • the processor for example, can be a CPU (Central Processing Unit), and the general implementation form can be a PON media access control (media access control, MAC) chip, which is used to encode the application data and encapsulate it into data conforming to the optical transmission protocol. The message is sent to the light control chip.
  • the optical control chip that is, the driving chip, can receive the data packet sent by the processor and convert it into an optical driving signal (analog signal) to drive the optical transmitter 201 to generate an uplink optical signal.
  • the first optical waveguide port and/or the third optical waveguide port introduced in the foregoing embodiments may also be coupled by using a spot-mode converter.
  • the matching of transmitted optical signals between ports with different spot sizes can be realized through the mode-spot converter, so that more accurate coupling between ports of two optical devices can be realized to reduce loss during optical signal transmission.
  • FIG. 5 is a schematic structural diagram of another optical transceiver component 200 provided in an embodiment of the present application.
  • coupling can be realized by a first spot size converter (spot size converter, SSC) 1, the input end of SSC1 can be connected to the optical transmitter 201, and the output end can be connected to the bidirectional wave splitter 202.
  • SSC1 spot size converter
  • SSC1 may be used to convert the spot size of the uplink optical signal output by the optical transmitter 201 into the spot size of the uplink optical signal received by the bidirectional wave splitter 202 through the first optical waveguide port.
  • the speckle converter may be in the shape of a cone or an inverted cone.
  • the SSC1 may be tapered. If the spot size of the uplink optical signal output by the optical transmitter 201 is smaller than the spot size of the uplink optical signal received by the bidirectional wave splitter 202 through the first optical waveguide port, the SSC1 may be an inverted cone.
  • a flip-chip bonding process can also be used for end-face coupling, so as to ensure the transmission power of the optical signal through a simple packaging method.
  • a second speckle-mode converter SSC2 can also be set to achieve coupling, the input end of SSC2 can be connected to the bidirectional wave splitter 202, and the output end of SSC2 can be connected to an optical fiber.
  • the SSC2 may be used to convert the spot size of the uplink optical signal output by the bidirectional wave splitter 202 through the third optical waveguide port into the spot size of the uplink optical signal that the optical fiber can receive.
  • the SSC2 may also be used to convert the spot size of the downlink optical signal transmitted by the optical fiber into the spot size of the downlink optical signal that the bidirectional demultiplexer 202 can receive. Similar to SSC1, SSC2 can also be tapered or inverted tapered, and the specific shape can be designed according to actual needs.
  • the first speckle converter and/or the second speckle converter may also have other shapes, which may be designed according to the actual application scenario of the optical transceiver component.
  • SSC2 may also adopt a structure such as a grating SSC, so as to realize more efficient coupling between the optical fiber and the optical waveguide contained in the bidirectional wave splitter 202 .
  • the input spot size is 4 ⁇ m ⁇ 4 ⁇ m
  • After entering the grating-type SSC it can be gradually converted to 4 ⁇ m ⁇ 10 ⁇ m, and then further converted to 10 ⁇ m ⁇ 10 ⁇ m.
  • the spot size of 4 ⁇ m ⁇ 4 ⁇ m at the input can be converted to the spot size of 10 ⁇ m ⁇ 10 ⁇ m at the output, and the power of the optical signal can be guaranteed.
  • FIG. 6 it is a schematic structural diagram of an optical transceiver component provided by an embodiment of the present application.
  • a grating-type SSC can be designed to convert the spot size of the uplink optical signal output from the bidirectional demultiplexer 202 into the spot size of the uplink optical signal that can be received in the optical fiber.
  • an inclined total reflection surface can also be designed by grinding and polishing technology, so as to realize effective detection and reception of downlink optical signals by the optical receiver 203 .
  • FIG. 7a it is a diagram of optical signal transmission at a second optical waveguide port provided by an embodiment of the present application.
  • the optical receiver 203 can be patched above the bidirectional wave splitter 202, and after the downlink optical signal is reflected by the inclined total reflection surface at the second optical waveguide port, the downlink optical signal can be The light receiver 203 performs active reception.
  • FIG. 7 b is another optical signal transmission diagram at the port of the second optical waveguide provided by the embodiment of the present application.
  • the optical receiver 203 can also be placed between the printed circuit board (PCB) board and the bidirectional wave splitter 202, wherein the PCB board and the bidirectional wave splitter 202 can be supported by a gasket to have a certain space, in this space Used to place the light receiver 203 in.
  • the downlink optical signal can be effectively received by the optical receiver 203 after being reflected by the inclined total reflection surface at the port of the second optical waveguide.
  • the embodiment of the present application also provides an optical device, which may include the optical transceiver component, processor, and optical control chip as introduced in the foregoing embodiments.
  • the processor can be used to encode the application data, encapsulate it into a data message conforming to the optical transmission protocol, and send it to the optical control chip.
  • the optical control chip can receive the data message sent by the processor and convert it into an optical driving signal (analog signal) to drive the optical transmitter contained in the optical transceiver component to generate an uplink optical signal. Since the optical device proposed here includes the optical transceiver component described in the above embodiments, the optical device also has the technical effects of the above optical transceiver component.
  • the word "exemplary” is used to mean serving as an example, instance, or illustration. Any embodiment or design described herein as “example” is not to be construed as preferred or advantageous over other embodiments or designs. Or it can be understood that the use of the word example is intended to present a concept in a specific manner, and does not constitute a limitation to the application.
  • the power of an optical signal may also be referred to as optical power.

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Abstract

An optical transceiving assembly (200), comprising an optical transmitter (201), a bidirectional demultiplexer (202) and an optical receiver (203), wherein the bidirectional demultiplexer (202) is coupled to the optical transmitter (201) by means of a first optical waveguide port, is coupled to the optical receiver (203) by means of a second optical waveguide port, and is coupled to an optical fiber by means of a third optical waveguide port; the bidirectional demultiplexer (202) is prepared on the basis of an optical waveguide chip; the optical transmitter (201) is used for generating an uplink optical signal and injecting the uplink optical signal into the bidirectional demultiplexer (202); the bidirectional demultiplexer (202) is used for transmitting the uplink optical signal to the optical fiber, receiving a downlink optical signal from the optical fiber, and transmitting the downlink optical signal to the optical receiver (203); and the optical receiver (203) is used for receiving the downlink optical signal. The optical transceiving assembly (200) has a simple structure, and is easily encapsulated.

Description

一种光收发组件An optical transceiver component
相关申请的交叉引用Cross References to Related Applications
本申请要求在2021年06月23日提交中华人民共和国知识产权局、申请号为202110696439.2、申请名称为“一种光收发组件”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。This application claims the priority of the Chinese patent application filed with the Intellectual Property Office of the People's Republic of China on June 23, 2021, with the application number 202110696439.2 and the application name "An Optical Transceiver Component", the entire contents of which are incorporated in this application by reference middle.
技术领域technical field
本申请涉及光通信技术领域,尤其涉及一种光收发组件。The present application relates to the technical field of optical communication, and in particular to an optical transceiver component.
背景技术Background technique
在无源光网络(passive optical network,PON)中,光网络终端(optical network termination,ONT)属于用户侧的设备,可以为用户提供业务接口,具有电光转换功能,实现用户与接入网之间的信号交换。In passive optical network (passive optical network, PON), optical network termination (ONT) belongs to the equipment on the user side, which can provide users with service interfaces and has the function of electro-optical conversion, realizing the communication between users and the access network. signal exchange.
目前,ONT一般使用双向光学子系统(bi-directional optical sub-assembly,BOSA)的结构实现光信号的收发。其中,BOSA是光通信系统中常用的一种结构,其作用是实现集成化的光信号发射与接收。然而,由于BOSA结构中包含的组件较多,且封装过程复杂,例如各组件耦合时的精确定位和固定较难,故存在集成化难度较大、成本较高的缺陷。Currently, the ONT generally uses a bi-directional optical sub-assembly (BOSA) structure to transmit and receive optical signals. Among them, BOSA is a structure commonly used in optical communication systems, and its function is to realize integrated optical signal transmission and reception. However, since the BOSA structure contains many components and the packaging process is complicated, for example, it is difficult to accurately locate and fix the components when they are coupled, so there are defects of difficulty in integration and high cost.
因此,在ONT中设计一种集成化难度小、成本较低的光收发组件是具有研究意义的。Therefore, it is meaningful to design an optical transceiver component with low integration difficulty and low cost in ONT.
发明内容Contents of the invention
本申请实施例提供一种光收发组件,用以在ONT中设计一种集成化难度小、成本较低的光收发组件。An embodiment of the present application provides an optical transceiver component, which is used to design an optical transceiver component with low integration difficulty and low cost in an ONT.
第一方面,提供一种光收发组件,包括:光发射器、双向分波器和光接收器;所述双向分波器通过第一光波导端口与所述光发射器耦合、通过第二光波导端口与所述光接收器耦合以及通过第三光波导端口与光纤耦合;其中,所述双向分波器基于光波导芯片制备;所述光发射器,用于产生上行光信号,并将所述上行光信号注入到所述双向分波器中;所述双向分波器,用于将所述上行光信号传输到所述光纤中;以及接收来自所述光纤的下行光信号,并将所述下行光信号传输给所述光接收器;所述光接收器,用于对所述下行光信号进行接收。In a first aspect, an optical transceiver component is provided, including: an optical transmitter, a bidirectional wave splitter, and an optical receiver; the bidirectional wave splitter is coupled to the optical transmitter through a first optical waveguide port, The port is coupled with the optical receiver and is coupled with the optical fiber through the third optical waveguide port; wherein, the bidirectional wave splitter is prepared based on an optical waveguide chip; the optical transmitter is used to generate an uplink optical signal, and transmit the The uplink optical signal is injected into the bidirectional demultiplexer; the bidirectional demultiplexer is used to transmit the uplink optical signal into the optical fiber; and receive the downlink optical signal from the optical fiber, and transmit the The downlink optical signal is transmitted to the optical receiver; the optical receiver is configured to receive the downlink optical signal.
通过本申请提供的光收发组件,采用光波导芯片制备的双向分波器可以实现现有技术中采用的BOSA结构可以实现的光信号收发功能。并且,本申请提供的基于光波导芯片制备的双向分波器的光收发组件,相比于BOSA结构,具有集成化难度小,成本低的优势。因此,本申请提供了一种通过简单的方式可以实现的光收发组件,从而可以降低光收发组件的成本。Through the optical transceiver component provided in the present application, the bidirectional wave splitter prepared by using the optical waveguide chip can realize the optical signal transceiver function that can be realized by the BOSA structure adopted in the prior art. Moreover, compared with the BOSA structure, the optical transceiver assembly based on the bidirectional wave splitter prepared by the optical waveguide chip provided by the present application has the advantages of less difficulty in integration and lower cost. Therefore, the present application provides an optical transceiver assembly that can be implemented in a simple manner, thereby reducing the cost of the optical transceiver assembly.
在一种可能的设计中,所述光发射器采用倒装键合工艺与所述双向分波器的第一光波导端口进行端面耦合。通过该设计,采用简单的封装方式可以实现光发射器与双向分波器之间的耦合,并且通过倒装键合工艺可以保障光信号的传输功率。In a possible design, the optical transmitter is end-face-coupled with the first optical waveguide port of the bidirectional wave splitter by using a flip-chip bonding process. Through this design, the coupling between the optical transmitter and the bidirectional wave splitter can be realized by adopting a simple packaging method, and the transmission power of the optical signal can be guaranteed through the flip-chip bonding process.
在一种可能的设计中,所述第二光波导端口设计为采用磨抛工艺的倾斜全反射面,所述光接收器用于接收通过所述倾斜全发射面发射之后的下行光信号。通过该设计,可以实现将光接收器贴片在双向分波器的第二光波导端口经倾斜全反射面反射之后的输出侧,从而可以实现光接收器对下行光信号的有效接收。In a possible design, the second optical waveguide port is designed as an inclined total reflection surface using a grinding and polishing process, and the optical receiver is configured to receive a downlink optical signal transmitted through the inclined total reflection surface. Through this design, the optical receiver can be patched on the output side of the second optical waveguide port of the bidirectional wave splitter after being reflected by the inclined total reflection surface, so that the optical receiver can effectively receive the downlink optical signal.
在一种可能的设计中,还包括信号放大器;所述信号放大器的输入端与所述光接收器的输出端连接,用于对所述光接收器接收到的所述下行光信号进行信号放大。通过该设计,采用信号放大器对接收的下行光信号进行信号放大,可以提升下行光信号的信号增益,从而保障根据下行光信号进行处理时的准确性。In a possible design, a signal amplifier is also included; the input end of the signal amplifier is connected to the output end of the optical receiver, and is used for signal amplification of the downlink optical signal received by the optical receiver . Through this design, the signal amplifier is used to amplify the received downlink optical signal, which can increase the signal gain of the downlink optical signal, thereby ensuring the accuracy of processing according to the downlink optical signal.
在一种可能的设计中,还包括第一模斑转换器;所述第一模斑转换器的输入端连接所述光发射器,输出端连接所述双向分波器的第一光波导端口,用于将所述光发射器输出的所述上行光信号的光斑尺寸,转换为所述双向分波器通过所述第一光波导端口接收的所述上行光信号的光斑尺寸。In a possible design, it also includes a first speckle converter; the input end of the first speckle converter is connected to the optical transmitter, and the output end is connected to the first optical waveguide port of the bidirectional wave splitter , for converting the spot size of the uplink optical signal output by the optical transmitter into the spot size of the uplink optical signal received by the bidirectional wave splitter through the first optical waveguide port.
通过该设计,采用模斑转换器可以降低上行光信号在传输过程中的损耗,从而保障上行光信号传输的功率。Through this design, the use of the mode spot converter can reduce the loss of the uplink optical signal during transmission, thereby ensuring the transmission power of the uplink optical signal.
在一种可能的设计中,所述第一模斑转换器可以但不限于为锥形模斑转换器、倒锥形模斑转换器或光栅型模斑转换器。通过该设计,可以根据光收发组件的实际需求选择合适形状的模斑转换器,从而可以提升两个光学元件之间的耦合率,保障光信号传输过程中的功率。In a possible design, the first speckle converter may be, but not limited to, a tapered speckle converter, an inverted tapered speckle converter, or a grating-type speckle converter. Through this design, a mode speckle converter with a suitable shape can be selected according to the actual needs of the optical transceiver components, so that the coupling rate between the two optical elements can be improved and the power during optical signal transmission can be guaranteed.
在一种可能的设计中,还包括第二模斑转换器;所述第二模斑转换器的输入端连接所述双向分波器的第三光波导端口,输出端连接所述光纤,用于将所述双向分波器通过所述第三光波导端口输出的所述上行光信号的光斑尺寸,转换为所述光纤接收的所述上行光信号的光斑尺寸。In a possible design, it also includes a second speckle converter; the input end of the second speckle converter is connected to the third optical waveguide port of the bidirectional wave splitter, and the output end is connected to the optical fiber, using Converting the spot size of the uplink optical signal output by the bidirectional wave splitter through the third optical waveguide port into the spot size of the uplink optical signal received by the optical fiber.
通过该设计,采用模斑转换器可以降低下行光信号在传输过程中的损耗,从而可以保障下行光信号传输的功率。Through this design, the loss of the downlink optical signal in the transmission process can be reduced by using the mode spot converter, so that the transmission power of the downlink optical signal can be guaranteed.
在一种可能的设计中,所述第二模斑转换器也可以但不限于为锥形模斑转换器、倒锥形模斑转换器或光栅型模斑转换器。通过该设计,可以根据光收发组件的实际需求选择合适形状的模斑转换器。从而可以提升两个光学元件之间的耦合率,保障光信号传输过程中的功率。In a possible design, the second speckle converter may also be, but not limited to, a tapered speckle converter, an inverted tapered speckle converter, or a grating type speckle converter. Through this design, the mode speckle converter with a suitable shape can be selected according to the actual requirements of the optical transceiver components. Therefore, the coupling rate between the two optical elements can be improved, and the power during the transmission of the optical signal can be guaranteed.
在一种可能的设计中,所述光波导芯片可以为平面光波导芯片。采用平面光波导芯片实现双向分波器,可以简化光收发组件的实现过程,从而可以降低光收发组件的成本。In a possible design, the optical waveguide chip may be a planar optical waveguide chip. The implementation of the bidirectional wave splitter by using the planar optical waveguide chip can simplify the implementation process of the optical transceiver component, thereby reducing the cost of the optical transceiver component.
在一种可能的设计中,所述双向分波器包括光波导和二氧化硅包层;所述光波导可采用定向耦合器(direction coupler,DC)结构、马赫曾德尔干涉仪(mach zehnder interferometer,MZI)结构或阵列波导光栅(arrayed waveguide grating,AWG)结构进行设计。In a possible design, the bidirectional wave splitter includes an optical waveguide and a silicon dioxide cladding; the optical waveguide can adopt a directional coupler (direction coupler, DC) structure, a Mach-Zehnder interferometer (mach zehnder interferometer) , MZI) structure or arrayed waveguide grating (arrayed waveguide grating, AWG) structure design.
通过该设计,采用一定结构设计的光波导实现光向分波器,进而通过不同的光波导端口与光发射器、光接收器以及光纤之间的耦合,可以在实现光信号的收发的基础上,简化光收发组件的实现,降低组成光收发组件的成本。Through this design, the optical waveguide with a certain structural design is used to realize the optical splitter, and then through the coupling between different optical waveguide ports and optical transmitters, optical receivers and optical fibers, it can realize the transmission and reception of optical signals. , simplify the realization of the optical transceiver component, and reduce the cost of forming the optical transceiver component.
第二方面,本申请实施例还提供一种光设备,可以包括如第一方面或第一方面中任一可能的设计所介绍到的光收发组件、处理器和光控制芯片。其中,处理器可以用于将数据编码,封装成符合光传输协议的数据报文,发送给所述光控制芯片。所述光控制芯片,可以接收处理器发送的数据报文,并转化为光驱动信号(模拟信号),以驱动光收发组件中 包含的光发射器产生上行光信号。In the second aspect, the embodiment of the present application further provides an optical device, which may include the optical transceiver component, processor, and optical control chip as introduced in the first aspect or any possible design of the first aspect. Wherein, the processor can be used to encode and encapsulate the data into a data message conforming to the optical transmission protocol, and send it to the optical control chip. The optical control chip can receive the data message sent by the processor and convert it into an optical driving signal (analog signal) to drive the optical transmitter included in the optical transceiver component to generate an uplink optical signal.
由于上述第二方面中的光设备包括上述第一方面中各个设计的光收发组件,因此也具有上述第一方面中各个设计可以带来的技术效果,这里不再重复赘述。Since the optical device in the above second aspect includes the optical transceiver components of the various designs in the above first aspect, it also has the technical effects that can be brought by the various designs in the above first aspect, and will not be repeated here.
附图说明Description of drawings
图1为光通信系统的场景示意图;FIG. 1 is a schematic diagram of a scene of an optical communication system;
图2为本申请实施例提供的一种光收发组件的结构示意图之一;FIG. 2 is one of the structural schematic diagrams of an optical transceiver component provided in an embodiment of the present application;
图3a为本申请实施例提供的采用DC结构的光收发组件的结构示意图;FIG. 3a is a schematic structural diagram of an optical transceiver component adopting a DC structure provided by an embodiment of the present application;
图3b为本申请实施例提供的采用DC结构的光收发组件的信号传输示意图;Fig. 3b is a schematic diagram of signal transmission of an optical transceiver component adopting a DC structure provided by an embodiment of the present application;
图3c为本申请实施例提供的采用MZI结构的光收发组件的结构示意图;FIG. 3c is a schematic structural diagram of an optical transceiver assembly using an MZI structure provided in an embodiment of the present application;
图3d为本申请实施例提供的采用AWG结构的光收发组件的结构示意图;FIG. 3d is a schematic structural diagram of an optical transceiver assembly using an AWG structure provided by an embodiment of the present application;
图4为本申请实施例提供的一种光收发组件的结构示意图之二;FIG. 4 is the second structural schematic diagram of an optical transceiver component provided by an embodiment of the present application;
图5为本申请实施例提供的一种光收发组件的结构示意图之三;Fig. 5 is the third structural schematic diagram of an optical transceiver component provided by the embodiment of the present application;
图6为本申请实施例提供的一种光收发组件的结构示意图之四;FIG. 6 is the fourth structural schematic diagram of an optical transceiver component provided by an embodiment of the present application;
图7a为本申请实施例提供的一种第二光波导端口处的光信号传输图之一;Fig. 7a is one of the optical signal transmission diagrams at the second optical waveguide port provided by the embodiment of the present application;
图7b为本申请实施例提供的一种第二光波导端口处的光信号传输图之二。Fig. 7b is a second diagram of optical signal transmission at the port of the second optical waveguide provided by the embodiment of the present application.
具体实施方式detailed description
本申请实施例提供的光收发组件可以应用于光通信系统中,光通信系统例如可以是PON系统。PON系统是一种基于点到多点(point 2 multiple point,P2MP)拓扑的技术。“无源”指的是在光网络中不包含有任何电子器件及电子电源,全部由无源器件组成,不需要贵重的有源电子设备。例如,PON系统可以是以太网无源光网络(ethernet PON,EPON)系统、吉比特无源光网络(gigabit-capable PON,GPON)系统、基于波分复用的无源光网络(wavelength division multiplexing PON,WDM PON)系统、基于异步传输模式的无源光网络(asynchronous transfer mode PON,APON)系统等。The optical transceiver component provided in the embodiment of the present application may be applied in an optical communication system, and the optical communication system may be, for example, a PON system. The PON system is a technology based on point-to-multipoint (point 2 multiple point, P2MP) topology. "Passive" means that the optical network does not contain any electronic devices and electronic power sources, all of which are composed of passive devices and do not require expensive active electronic devices. For example, the PON system can be an Ethernet passive optical network (ethernet PON, EPON) system, a gigabit-capable PON (GPON) system, a passive optical network based on wavelength division multiplexing (wavelength division multiplexing) PON, WDM PON) system, passive optical network (asynchronous transfer mode PON, APON) system based on asynchronous transfer mode, etc.
作为一种应用场景示例,光通信系统中至少可以包括多个ONT和分光器,多个ONT可以通过分光器实现与更上层的接入设备进行通信,更上层的接入设备例如可以是光线路终端(optical line termination,OLT)。例如,图1为一种光通信系统的部分场景示意图。图1中,光通信系统包含的多个ONT可以分别为ONT1、ONT2、……、ONTn。每个ONT可以与多个用户连接,例如ONT1可以连接用户1和用户2;或者ONT也可以与一个用户连接,例如,ONT1可以连接用户3,ONTn可以连接ONTm。这样,ONT作为光通信系统中用户侧的终端设备,可以为用户提供业务接口,具有电光转换功能,以实现用户与接入网之间的信号转换过程。As an example of an application scenario, an optical communication system may include at least multiple ONTs and optical splitters. Multiple ONTs may communicate with upper-layer access devices through optical splitters. Upper-layer access devices may be, for example, optical lines Terminal (optical line termination, OLT). For example, FIG. 1 is a schematic diagram of a partial scene of an optical communication system. In FIG. 1 , the multiple ONTs included in the optical communication system may be ONT1, ONT2, . . . , ONTn, respectively. Each ONT can be connected to multiple users. For example, ONT1 can be connected to user 1 and user 2; or an ONT can also be connected to one user. For example, ONT1 can be connected to user 3, and ONTn can be connected to ONTm. In this way, the ONT, as the terminal equipment on the user side in the optical communication system, can provide the user with a service interface and has the function of electro-optic conversion to realize the signal conversion process between the user and the access network.
目前,现有技术中光通信系统包含的ONT通常使用BOSA结构实现信号的收发。BOSA可以实现集成化的光信号的发射与接收。然而,由于BOSA需要将激光器(laser diode,LD)、跨阻放大器(trans-impedance amplifier,TIA)、WDM、陶瓷套筒、陶瓷插芯组件等封装成同轴模组。在封装过程中实现各组件耦合时的精确定位和固定较难,存在集成化难度较大、成本较高的缺陷。At present, the ONT included in the optical communication system in the prior art usually uses a BOSA structure to implement signal sending and receiving. BOSA can realize the transmission and reception of integrated optical signals. However, BOSA needs to package laser diode (LD), trans-impedance amplifier (TIA), WDM, ceramic sleeve, ceramic ferrule components, etc. into a coaxial module. In the packaging process, it is difficult to achieve accurate positioning and fixing of the coupling of various components, and there are defects that the integration is difficult and the cost is high.
有鉴于此,本申请实施例提供了一种光收发组件,用以通过采用一种简单的方式得到 光收发组件,以满足现有技术中采用BOSA结构可以实现的光信号收发功能。因此,本申请实施例提供的光收发组件可以用于替代现有技术中存在的封装复杂的BOSA结构,从而可以降低光收发组件的集成化成本。In view of this, the embodiment of the present application provides an optical transceiver component, which is used to obtain the optical transceiver component in a simple way to meet the optical signal transceiver function that can be realized by using the BOSA structure in the prior art. Therefore, the optical transceiver assembly provided by the embodiment of the present application can be used to replace the complex packaged BOSA structure existing in the prior art, thereby reducing the integration cost of the optical transceiver assembly.
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行详尽描述。The technical solutions in the embodiments of the present application will be described in detail below with reference to the drawings in the embodiments of the present application.
需要说明的是,本申请实施例中的术语“系统”和“网络”可被互换使用。本申请涉及的多个,是指两个或两个以上。另外,需要理解的是,在本申请的描述中,“第一”、“第二”等词汇,仅用于区分描述的目的,而不能理解为指示或暗示相对重要性,也不能理解为指示或暗示顺序。“和/或”,描述关联对象的关联关系,表示可以存在三种关系,例如,A和/或B,可以表示:单独存在A,同时存在A和B,单独存在B这三种情况。另外,字符“/”,如无特殊说明,一般表示前后关联对象是一种“或”的关系。It should be noted that the terms "system" and "network" in the embodiments of the present application may be used interchangeably. A plurality referred to in this application refers to two or more than two. In addition, it should be understood that in the description of this application, words such as "first" and "second" are only used for the purpose of distinguishing descriptions, and cannot be understood as indicating or implying relative importance, nor can they be understood as indicating or imply order. "And/or" describes the association relationship of associated objects, indicating that there may be three types of relationships, for example, A and/or B may indicate: A exists alone, A and B exist simultaneously, and B exists independently. In addition, the character "/", unless otherwise specified, generally indicates that the associated objects before and after are in an "or" relationship.
参阅图2,为本申请实施例提供的一种光收发组件200的原理示意图。光收发组件200可以用于光通信系统中光设备实现光信号的收发,光设备例如可以是ONT。光收发组件200至少可以包括:Referring to FIG. 2 , it is a schematic schematic diagram of an optical transceiver component 200 provided in an embodiment of the present application. The optical transceiver component 200 may be used for optical equipment in an optical communication system to implement optical signal transmission and reception, and the optical equipment may be, for example, an ONT. The optical transceiver assembly 200 may at least include:
1)光发射器201,例如可以为激光器,具体可以为无源贴片型的激光器。其中,激光器一般可以采用激光二极管(laser diode,LD)实现。光发射器201,用于根据光驱动信号发光,即产生上行光信号,并将所述上行光信号注入到双向分波器202中。1) The light transmitter 201 may be, for example, a laser, specifically a passive patch type laser. Wherein, the laser can generally be realized by using a laser diode (LD). The optical transmitter 201 is configured to emit light according to the optical driving signal, that is, generate an uplink optical signal, and inject the uplink optical signal into the bidirectional demultiplexer 202 .
示例性的,上行光信号承载的数据可以表示为该光收发组件所在的光设备作为发送端时,向其他设备发送的数据。通过光发射器201可以将该光收发组件所在的光设备的待发送数据通过上行光信号的形式基于光纤发送给更上层的接入设备,进而传输到核心网络中。Exemplarily, the data carried by the uplink optical signal may be represented as data sent to other devices when the optical device where the optical transceiver component is located serves as the sending end. Through the optical transmitter 201, the data to be sent by the optical device where the optical transceiver component is located can be sent to an upper-layer access device based on an optical fiber in the form of an uplink optical signal, and then transmitted to the core network.
2)双向分波器202,用于对上行光信号和下行光信号根据波长进行双向的波分复用处理,也可以称为波分复用(wavelength division dultiplexing,WDM)+双向(bidirectional,BiDi)结构。在光通信系统中,上行光信号的波长通常可以采用1270nm和/或1310nm,下行光信号的波长通常可以采用1490nm和/或1577nm。实施时,双向分波器202可以用于接收上行光信号,并将所述上行光信号传输到光纤中。以及所述双向分波器202还可以用于接收来自光纤的下行光信号,并将下行光信号传输给光接收器203。2) The bidirectional wave splitter 202 is used to perform bidirectional wavelength division multiplexing processing on the upstream optical signal and the downstream optical signal according to the wavelength, which can also be called wavelength division multiplexing (wavelength division multiplexing, WDM)+bidirectional (bidirectional, BiDi) )structure. In an optical communication system, the wavelength of an uplink optical signal may generally be 1270 nm and/or 1310 nm, and the wavelength of a downlink optical signal may generally be 1490 nm and/or 1577 nm. During implementation, the bidirectional demultiplexer 202 may be used to receive an uplink optical signal and transmit the uplink optical signal into an optical fiber. And the bidirectional demultiplexer 202 can also be used to receive the downlink optical signal from the optical fiber, and transmit the downlink optical signal to the optical receiver 203 .
其中,下行光信号承载的数据可以表示为该光收发组件所在的光设备作为接收端时,其他设备发送的数据。经过双向分波器202分波处理之后的下行光信号,可以被光接收器203接收,进而进行光电转换之后,获取到承载的数据。Wherein, the data carried by the downlink optical signal may be represented as data sent by other devices when the optical device where the optical transceiver component is located serves as the receiving end. The downlink optical signal after the demultiplexing process by the bidirectional demultiplexer 202 can be received by the optical receiver 203 , and then undergoes photoelectric conversion to obtain the carried data.
示例性的,双向分波器202可以基于光波导芯片制备,通过光波导实现对光信号的传输。并且,双向分波器202可以通过第一光波导端口与光发射器201耦合,通过第二光波导端口与光接收器203耦合以及通过第三光波导端口与光纤耦合。这样,通过本申请提供的光收发组件,采用光波导芯片制备的双向分波器可以实现现有技术中采用的BOSA结构可以实现的光信号收发功能。并且,本申请提供的基于光波导芯片制备的双向分波器的光收发组件,相比于BOSA结构,具有集成化难度小,成本低的优势。Exemplarily, the bidirectional wave splitter 202 can be fabricated based on an optical waveguide chip, and transmit optical signals through the optical waveguide. Moreover, the bidirectional wave splitter 202 can be coupled to the optical transmitter 201 through the first optical waveguide port, coupled to the optical receiver 203 through the second optical waveguide port, and coupled to the optical fiber through the third optical waveguide port. In this way, through the optical transceiver component provided in the present application, the bidirectional wave splitter prepared by using the optical waveguide chip can realize the optical signal transceiver function that can be realized by the BOSA structure adopted in the prior art. Moreover, compared with the BOSA structure, the optical transceiver assembly based on the bidirectional wave splitter prepared by the optical waveguide chip provided by the present application has the advantages of less difficulty in integration and lower cost.
可选的,光波导芯片可以为平面光波导(planar lightwave circuit,PLC)芯片,也可以理解为基于PLC技术集成的芯片;或者可选的还可以为硅基芯片等。需要说明的是,PLC是一种用于实现光波导传输的技术。其中,采用PLC技术集成的芯片可以基于多种材料实现,目前市场应用最广泛采用的为二氧化硅材料,即采用PLC技术集成的芯片可以基于具有低折射率特性的二氧化硅材料作为包层,将比二氧化硅包层折射率高的光波导包在内层。这样,通过二氧化硅包层可以避免通过光波导传输的光信号的溢出,从而可以避免导致光 信号能量的损耗。Optionally, the optical waveguide chip can be a planar lightwave circuit (PLC) chip, and can also be understood as a chip integrated based on PLC technology; or optionally, a silicon-based chip, etc. It should be noted that PLC is a technology used to realize optical waveguide transmission. Among them, chips integrated with PLC technology can be realized based on a variety of materials. At present, silicon dioxide is the most widely used material in the market, that is, chips integrated with PLC technology can be based on silicon dioxide materials with low refractive index characteristics as cladding. , the optical waveguide with a higher refractive index than the silica cladding is wrapped in the inner layer. In this way, the overflow of the optical signal transmitted through the optical waveguide can be avoided by the silica cladding, thereby avoiding the loss of the energy of the optical signal.
可以理解,双向分波器202可以包括光波导和二氧化硅包层。其中,二氧化硅包层具有低折射率的特性,从而可以保障光信号的传输,减少光信号的功率损耗。光波导可以采用定向耦合器(direction coupler,DC)结构、马赫曾德尔干涉仪(mach zehnder interferometer,MZI)结构或阵列波导光栅(arrayed waveguide grating,AWG)结构等进行设计。以下结合图3a至图3d对双向分波器202采用不同结构下的光波导的工作原理进行介绍。It can be understood that the bidirectional wave splitter 202 may include an optical waveguide and a silicon dioxide cladding. Among them, the silicon dioxide cladding layer has a characteristic of low refractive index, so that the transmission of optical signals can be ensured, and the power loss of optical signals can be reduced. The optical waveguide can be designed using a directional coupler (direction coupler, DC) structure, a Mach-Zehnder interferometer (mach zehnder interferometer, MZI) structure, or an arrayed waveguide grating (arrayed waveguide grating, AWG) structure. The working principles of the optical waveguides with different structures adopted by the bidirectional wave splitter 202 will be introduced below with reference to FIGS. 3 a to 3 d.
参阅图3a,为本申请实施例提供的采用DC结构的光收发组件200的结构示意图。通常DC结构可以包含两个输入端口和两个输出端口。本申请实施时,通过DC结构的两个输入端口中的一个输入端口作为光发射器201向光收发组件200注入上行光信号的端口,也即图3a中示出的第一光波导端口,假设为A口;另一个输入端口作为光收发组件200从光纤中接收下行光信号的端口,也即图3a中示出的第三光波导端口,假设为D口。以及,采用DC结构的两个输出端口中的一个输出端口作为光接收器203从光收发组件200中接收下行光信号的端口,也即图3a中示出的第二光波导端口,假设为C口;另一个输出端口可以作为备用端口,可以等待挖掘新的功能等,假设为B口。Referring to FIG. 3 a , it is a schematic structural diagram of an optical transceiver component 200 adopting a DC structure provided by an embodiment of the present application. Typically a DC structure may contain two input ports and two output ports. When this application is implemented, one of the two input ports of the DC structure is used as the port for injecting uplink optical signals into the optical transceiver assembly 200 by the optical transmitter 201, that is, the first optical waveguide port shown in FIG. 3a, assuming port A; the other input port is used as the port for the optical transceiver assembly 200 to receive downlink optical signals from the optical fiber, that is, the third optical waveguide port shown in FIG. 3 a , which is assumed to be port D. And, one of the two output ports of the DC structure is used as the port for the optical receiver 203 to receive the downlink optical signal from the optical transceiver assembly 200, that is, the second optical waveguide port shown in FIG. 3a, assumed to be C port; the other output port can be used as a backup port, which can wait for new functions to be discovered, assuming it is port B.
基于图3a示出的采用DC结构的光收发组件200,参阅图3b,为本申请实施例提供的采用DC结构的光收发组件的信号传输示意图。根据图3b中的(a)的示例,假设上行光信号的波长为1270nm,光发射器201从A口向双向分波器202注入的上行光信号,通过DC结构的光波导之后,可以通过D口传输至光纤中。根据图3b中的(b)的示例,假设下行光信号的波长为1577nm,D口处从光纤传输来的下行光信号通过DC结构的光波导之后,可以通过C口传输至光接收器203进行接收。Based on the optical transceiver assembly 200 using the DC structure shown in FIG. 3 a , refer to FIG. 3 b , which is a schematic diagram of signal transmission of the optical transceiver assembly using the DC structure provided by the embodiment of the present application. According to the example of (a) in Figure 3b, assuming that the wavelength of the uplink optical signal is 1270nm, the uplink optical signal injected by the optical transmitter 201 from the A port to the bidirectional demultiplexer 202, after passing through the optical waveguide of the DC structure, can pass through the D The port is transmitted to the optical fiber. According to the example of (b) in Figure 3b, assuming that the wavelength of the downlink optical signal is 1577nm, after the downlink optical signal transmitted from the optical fiber at the D port passes through the optical waveguide of the DC structure, it can be transmitted to the optical receiver 203 through the C port for further processing. take over.
需要说明的是,本申请实施时,DC结构的光波导可以实现对1270nm的光信号从上波导传输至下波导中,以及可以实现将1577nm的光信号从下波导传输至上波导再传输至下波导中,因此DC结构的长度可以设计为指定长度范围的光波导,在指定长度范围内的光波导可以实现如图3b示出的光信号传输路径。这样,可以通过DC结构实现对上行光信号和下行光信号根据波长不同的特性分别进行处理,进而可以实现光收发组件200的光信号收发功能。It should be noted that when this application is implemented, the optical waveguide of the DC structure can realize the transmission of the 1270nm optical signal from the upper waveguide to the lower waveguide, and can realize the transmission of the 1577nm optical signal from the lower waveguide to the upper waveguide and then to the lower waveguide Therefore, the length of the DC structure can be designed as an optical waveguide within a specified length range, and the optical waveguide within the specified length range can realize the optical signal transmission path as shown in Figure 3b. In this way, the uplink optical signal and the downlink optical signal can be separately processed according to the characteristics of different wavelengths through the DC structure, and then the optical signal transceiving function of the optical transceiver component 200 can be realized.
参阅图3c,为本申请实施例提供的采用MZI结构的光收发组件200的结构示意图。MZI结构的原理主要是通过构建不同长度的光波导,实现光信号经过不同的光程的传输之后进行相互干涉,最后可以实现不同波长的光信号分别从两个不同的端口输出。例如,图3c中示出的MZI结构中包含两个长度的光波导。其中,下行光信号和上行光信号可以分别通过MZI结构中的两个不同长度的光波导分别传输,从而可以从不同的端口输出,以保障光收发组件对下行光信号和上行光信号的分波处理,进而可以保障光收发组件200实现光信号收发功能。Referring to FIG. 3 c , it is a schematic structural diagram of an optical transceiver assembly 200 using an MZI structure provided by an embodiment of the present application. The principle of the MZI structure is mainly to construct optical waveguides of different lengths to realize mutual interference of optical signals after transmission through different optical paths, and finally, optical signals of different wavelengths can be output from two different ports respectively. For example, the MZI structure shown in Figure 3c contains two lengths of optical waveguides. Among them, the downlink optical signal and the uplink optical signal can be respectively transmitted through two optical waveguides of different lengths in the MZI structure, so that they can be output from different ports, so as to ensure the demultiplexing of the downlink optical signal and the uplink optical signal by the optical transceiver component processing, so as to ensure that the optical transceiver component 200 realizes the optical signal transceiver function.
参阅图3d,为本申请实施例提供的采用AWG结构的光收发组件200的结构示意图。其中,AWG结构可以划分为包含波导阵列和处于波导阵列两侧的多个端口,光信号通过波导阵列之后,可以产生一定的相位差,从而可以实现不同波长的光信号从不同的指定端口传输出去。基于此,如图3d所示,本申请实施时采用AWG结构可以实现从波导阵列的左侧一个端口输入上行光信号(也即前述实施例中介绍到的第一光波导端口),并从波导阵列的右侧的指定端口输出上行光信号(也即前述实施例中介绍到的第三光波导端口);以及还可以实现从波导阵列的右侧一个端口输入下行光信号(也即前述实施例中介绍到的 第三光波导端口),并从波导阵列的左侧的指定端口输出下行光信号(也即前述实施例中介绍到的第二光波导端口)。Referring to FIG. 3 d , it is a schematic structural diagram of an optical transceiver assembly 200 adopting an AWG structure provided by an embodiment of the present application. Among them, the AWG structure can be divided into a waveguide array and multiple ports on both sides of the waveguide array. After the optical signal passes through the waveguide array, a certain phase difference can be generated, so that optical signals of different wavelengths can be transmitted from different designated ports. . Based on this, as shown in Figure 3d, when the present application is implemented, the AWG structure can be used to input the uplink optical signal from the left port of the waveguide array (that is, the first optical waveguide port introduced in the previous embodiment), and from the waveguide The specified port on the right side of the array outputs an uplink optical signal (that is, the third optical waveguide port introduced in the foregoing embodiments); The third optical waveguide port introduced in the above), and the downlink optical signal is output from the designated port on the left side of the waveguide array (that is, the second optical waveguide port introduced in the foregoing embodiments).
需要说明的是,波导阵列的右侧输出上行光信号的指定端口可以与输入下行光信号的端口相同,可以理解为均为第三光波导端口;而波导阵列的左侧输入上行光信号的端口与输出下行光信号的端口不相同,可以理解为第一光波导端口和第二光波导端口。这样,可以实现将下行光信号从不同于上行光信号的传输端口接收,以实现对上行光信号和下行光信号根据波长不同的特性进行分别处理。It should be noted that the designated port for outputting the uplink optical signal on the right side of the waveguide array can be the same as the port for inputting the downlink optical signal, which can be understood as the third optical waveguide port; while the left side of the waveguide array is the port for inputting the uplink optical signal Different from the port for outputting downlink optical signals, it can be understood as the first optical waveguide port and the second optical waveguide port. In this way, the downlink optical signal can be received from a transmission port different from the uplink optical signal, so that the uplink optical signal and the downlink optical signal can be processed separately according to different wavelength characteristics.
3)光接收器203,例如可以为探测器。探测器一般可以采用雪崩光电二极管(avalanche photon diode,APD)实现。光接收器203可以用于对下行光信号探测后进行接收。3) The light receiver 203 may be, for example, a detector. The detector can generally be realized by an avalanche photodiode (APD). The optical receiver 203 may be used to detect and receive the downlink optical signal.
4)光纤端口,用于实现光收发组件200与光纤的连接,例如图2示出的第三光波导端口。示例性,光收发组件200可以通过连接的光纤,实现与如图1所示的分光器100等光器件之间的光信号传输。4) An optical fiber port, configured to connect the optical transceiver assembly 200 to an optical fiber, such as the third optical waveguide port shown in FIG. 2 . Exemplarily, the optical transceiver assembly 200 may implement optical signal transmission with an optical device such as the optical splitter 100 shown in FIG. 1 through a connected optical fiber.
另一种可能的示例中,本申请提供的光收发组件200还可以包括信号放大器204。参阅图4,为本申请实施例提供的另一种光收发组件200的结构示意图。所述信号放大器204的输入端可以与所述光接收器203的输出端连接。信号放大器204,一般可以采用跨阻放大器(trans impedance amplifier,TIA)实现,可以用于对光接收器203接收到的下行光信号进行信号放大,以保证接收到的下行光信号的信号增益。In another possible example, the optical transceiver component 200 provided in the present application may further include a signal amplifier 204 . Referring to FIG. 4 , it is a schematic structural diagram of another optical transceiver component 200 provided in the embodiment of the present application. The input terminal of the signal amplifier 204 can be connected with the output terminal of the optical receiver 203 . The signal amplifier 204 can generally be realized by a transimpedance amplifier (TIA), and can be used to amplify the downlink optical signal received by the optical receiver 203, so as to ensure the signal gain of the received downlink optical signal.
此外,为了实现光收发组件200的工作,在包含光收发组件200的光设备中,还可以包含处理器和光控制芯片。其中,处理器,例如可以是CPU(中央处理器),一般的实现形式可以是PON媒体接入控制(media access control,MAC)芯片,用于将应用数据编码,封装成符合光传输协议的数据报文,发送给光控制芯片。光控制芯片,即驱动芯片,可以接收处理器发送的数据报文,并转化为光驱动信号(模拟信号),以驱动光发射器201产生上行光信号。In addition, in order to realize the work of the optical transceiver assembly 200, the optical equipment including the optical transceiver assembly 200 may further include a processor and an optical control chip. Wherein, the processor, for example, can be a CPU (Central Processing Unit), and the general implementation form can be a PON media access control (media access control, MAC) chip, which is used to encode the application data and encapsulate it into data conforming to the optical transmission protocol. The message is sent to the light control chip. The optical control chip, that is, the driving chip, can receive the data packet sent by the processor and convert it into an optical driving signal (analog signal) to drive the optical transmitter 201 to generate an uplink optical signal.
为了提高光收发组件200进行光信号收发时的传输效率,保障光信号的传输功率,本申请实施时,在双向分波器202与光发射器201和/或光纤连接的光波导端口上,也即前述实施例中介绍到的第一光波导端口和/或第三光波导端口,还可以采用模斑转换器实现耦合。这样,通过模斑转换器可以实现具有不同光斑尺寸的端口之间传输光信号的匹配,从而可以实现两个光学器件的端口之间更为准确的耦合,以减少光信号传输过程中的损耗。In order to improve the transmission efficiency of the optical transceiver assembly 200 when performing optical signal transmission and reception, and ensure the transmission power of the optical signal, when the application is implemented, on the optical waveguide port where the bidirectional wave splitter 202 is connected to the optical transmitter 201 and/or the optical fiber, also That is, the first optical waveguide port and/or the third optical waveguide port introduced in the foregoing embodiments may also be coupled by using a spot-mode converter. In this way, the matching of transmitted optical signals between ports with different spot sizes can be realized through the mode-spot converter, so that more accurate coupling between ports of two optical devices can be realized to reduce loss during optical signal transmission.
以双向分波器202采用DC结构作为示例,参阅图5,为本申请实施例提供的再一种光收发组件200的结构示意图。Taking the bidirectional splitter 202 adopting a DC structure as an example, refer to FIG. 5 , which is a schematic structural diagram of another optical transceiver component 200 provided in an embodiment of the present application.
在第一光波导端口处,可以通过第一模斑转换器(spot size converter,SSC)1实现耦合,SSC1的输入端可以连接所述光发射器201,输出端可以连接所述双向分波器202。SSC1可以用于将所述光发射器201输出的上行光信号的光斑尺寸,转换为所述双向分波器202通过所述第一光波导端口接收的上行光信号的光斑尺寸。示例性的,模斑转换器可以为锥形或倒锥形。可选的,若光发射器201输出的上行光信号的光斑尺寸大于所述双向分波器202通过所述第一光波导端口接收的上行光信号的光斑尺寸,则SSC1可以为锥形。若光发射器201输出的上行光信号的光斑尺寸小于所述双向分波器202通过所述第一光波导端口接收的上行光信号的光斑尺寸,则SSC1可以为倒锥形。At the first optical waveguide port, coupling can be realized by a first spot size converter (spot size converter, SSC) 1, the input end of SSC1 can be connected to the optical transmitter 201, and the output end can be connected to the bidirectional wave splitter 202. SSC1 may be used to convert the spot size of the uplink optical signal output by the optical transmitter 201 into the spot size of the uplink optical signal received by the bidirectional wave splitter 202 through the first optical waveguide port. Exemplarily, the speckle converter may be in the shape of a cone or an inverted cone. Optionally, if the spot size of the uplink optical signal output by the optical transmitter 201 is larger than the spot size of the uplink optical signal received by the bidirectional wave splitter 202 through the first optical waveguide port, the SSC1 may be tapered. If the spot size of the uplink optical signal output by the optical transmitter 201 is smaller than the spot size of the uplink optical signal received by the bidirectional wave splitter 202 through the first optical waveguide port, the SSC1 may be an inverted cone.
并且,在第一光波导端口处,还可以采用倒装键合工艺进行端面耦合,以通过简单的封装方式保障光信号的传输功率。Moreover, at the first optical waveguide port, a flip-chip bonding process can also be used for end-face coupling, so as to ensure the transmission power of the optical signal through a simple packaging method.
同理,在第三光波导端口处,可以同样设置第二模斑转换器SSC2实现耦合,SSC2的输入端可以连接所述双向分波器202,SSC2的输出端连接光纤。SSC2可以用于将所述双向分波器202通过所述第三光波导端口输出的上行光信号的光斑尺寸,转换为所述光纤可以接收的上行光信号的光斑尺寸。或者,SSC2还可以用于将光纤传输来的下行光信号的光斑尺寸,转换为所述双向分波器202可以接收的下行光信号的光斑尺寸。与SSC1类似,SSC2也可以为锥形或倒锥形,具体形状可以根据实际需求进行设计。Similarly, at the third optical waveguide port, a second speckle-mode converter SSC2 can also be set to achieve coupling, the input end of SSC2 can be connected to the bidirectional wave splitter 202, and the output end of SSC2 can be connected to an optical fiber. The SSC2 may be used to convert the spot size of the uplink optical signal output by the bidirectional wave splitter 202 through the third optical waveguide port into the spot size of the uplink optical signal that the optical fiber can receive. Alternatively, the SSC2 may also be used to convert the spot size of the downlink optical signal transmitted by the optical fiber into the spot size of the downlink optical signal that the bidirectional demultiplexer 202 can receive. Similar to SSC1, SSC2 can also be tapered or inverted tapered, and the specific shape can be designed according to actual needs.
需要说明的是,第一模斑转换器和/或第二模斑转换器还可以是其他形状,可以根据光收发组件的实际应用场景进行设计。以SSC2作为示例,SSC2还可采用光栅型SSC等结构,从而可以实现光纤和双向分波器202包含的光波导间的更高效耦合。其中,通过光栅型SSC的处理,假设输入的光斑尺寸为4微米μm×4μm尺寸大小,在进入光栅型SSC之后,可以逐步转换为4μm×10μm,然后再进一步转换为10μm×10μm。这样,通过光栅型SSC的光斑转换处理,可以将输入端为4μm×4μm的光斑尺寸,转换为输出端为10μm×10μm的光斑尺寸,进而可以保障光信号的功率。It should be noted that the first speckle converter and/or the second speckle converter may also have other shapes, which may be designed according to the actual application scenario of the optical transceiver component. Taking SSC2 as an example, SSC2 may also adopt a structure such as a grating SSC, so as to realize more efficient coupling between the optical fiber and the optical waveguide contained in the bidirectional wave splitter 202 . Among them, through the processing of the grating-type SSC, assuming that the input spot size is 4 μm×4 μm, after entering the grating-type SSC, it can be gradually converted to 4 μm×10 μm, and then further converted to 10 μm×10 μm. In this way, through the spot conversion processing of the grating-type SSC, the spot size of 4 μm × 4 μm at the input can be converted to the spot size of 10 μm × 10 μm at the output, and the power of the optical signal can be guaranteed.
参阅图6,为本申请实施例提供的一种光收发组件的结构示意图。该示例中,在第三光波导端口处,可以设计光栅型SSC实现对将来自双向分波器202输出的上行光信号的光斑尺寸转换为光纤中可以接收的上行光信号的光斑尺寸。Referring to FIG. 6 , it is a schematic structural diagram of an optical transceiver component provided by an embodiment of the present application. In this example, at the third optical waveguide port, a grating-type SSC can be designed to convert the spot size of the uplink optical signal output from the bidirectional demultiplexer 202 into the spot size of the uplink optical signal that can be received in the optical fiber.
并且,在光接收器203与双向分波器202耦合的第二光波导端口处,还可以采用磨抛工艺设计倾斜全反射面,从而实现光接收器203对下行光信号的有效检测和接收。参阅图7a,为本申请实施例提供的一种第二光波导端口处的光信号传输图。在第二光波导端口处,可以将光接收器203贴片在双向分波器202的上方,在下行光信号通过第二光波导端口处的倾斜全反射面进行反射之后,下行光信号可以被光接收器203进行有效地接收。Moreover, at the second optical waveguide port where the optical receiver 203 is coupled with the bidirectional wave splitter 202 , an inclined total reflection surface can also be designed by grinding and polishing technology, so as to realize effective detection and reception of downlink optical signals by the optical receiver 203 . Referring to FIG. 7a , it is a diagram of optical signal transmission at a second optical waveguide port provided by an embodiment of the present application. At the second optical waveguide port, the optical receiver 203 can be patched above the bidirectional wave splitter 202, and after the downlink optical signal is reflected by the inclined total reflection surface at the second optical waveguide port, the downlink optical signal can be The light receiver 203 performs active reception.
或者,参阅图7b,为本申请实施例提供的另一种第二光波导端口处的光信号传输图。光接收器203也可以放置于印制电路板(printed circuit board,PCB)板与双向分波器202之间,其中PCB板和双向分波器202可以通过垫片支撑有一定空间,在该空间中用来放置光接收器203。如图7b所示,下行光信号通过第二光波导端口处的倾斜全反射面反射之后,可以被光接收器203进行有效地接收。Alternatively, refer to FIG. 7 b , which is another optical signal transmission diagram at the port of the second optical waveguide provided by the embodiment of the present application. The optical receiver 203 can also be placed between the printed circuit board (PCB) board and the bidirectional wave splitter 202, wherein the PCB board and the bidirectional wave splitter 202 can be supported by a gasket to have a certain space, in this space Used to place the light receiver 203 in. As shown in FIG. 7 b , the downlink optical signal can be effectively received by the optical receiver 203 after being reflected by the inclined total reflection surface at the port of the second optical waveguide.
本申请实施例还提供一种光设备,可以包括如前述各实施例中所介绍到的光收发组件、处理器和光控制芯片。其中,处理器可以用于将应用数据编码,封装成符合光传输协议的数据报文,发送给所述光控制芯片。所述光控制芯片,可以接收处理器发送的数据报文,并转化为光驱动信号(模拟信号),以驱动光收发组件中包含的光发射器产生上行光信号。由于这里提出的光设备包括上述实施例描述的光收发组件,因此该光设备也具备上述光收发组件所具备的技术效果。The embodiment of the present application also provides an optical device, which may include the optical transceiver component, processor, and optical control chip as introduced in the foregoing embodiments. Wherein, the processor can be used to encode the application data, encapsulate it into a data message conforming to the optical transmission protocol, and send it to the optical control chip. The optical control chip can receive the data message sent by the processor and convert it into an optical driving signal (analog signal) to drive the optical transmitter contained in the optical transceiver component to generate an uplink optical signal. Since the optical device proposed here includes the optical transceiver component described in the above embodiments, the optical device also has the technical effects of the above optical transceiver component.
在本申请的各个实施例中,如果没有特殊说明以及逻辑冲突,不同的实施例之间的术语和/或描述具有一致性、且可以相互引用,不同的实施例中的技术特征根据其内在的逻辑关系可以组合形成新的实施例。In each embodiment of the present application, if there is no special explanation and logical conflict, the terms and/or descriptions between different embodiments are consistent and can be referred to each other, and the technical features in different embodiments are based on their inherent Logical relationships can be combined to form new embodiments.
在本申请中,“示例的”一词用于表示作例子、例证或说明。本申请中被描述为“示例”的任何实施例或设计方案不应被解释为比其它实施例或设计方案更优选或更具优势。或者可理解为,使用示例的一词旨在以具体方式呈现概念,并不对本申请构成限定。本申请中光信号的功率也可以称为光功率。In this application, the word "exemplary" is used to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "example" is not to be construed as preferred or advantageous over other embodiments or designs. Or it can be understood that the use of the word example is intended to present a concept in a specific manner, and does not constitute a limitation to the application. In this application, the power of an optical signal may also be referred to as optical power.
可以理解的是,在本申请中涉及的各种数字编号仅为描述方便进行的区分,并不用来 限制本申请的实施例的范围。上述各过程的序号的大小并不意味着执行顺序的先后,各过程的执行顺序应以其功能和内在逻辑确定。此外,术语“包括”和“具有”以及他们的任何变形,意图在于覆盖不排他的包含,例如,包含了一系列步骤或单元。方法、系统、产品或设备不必限于清楚地列出的那些步骤或单元,而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或单元。It can be understood that the various numbers involved in the application are only for the convenience of description and are not used to limit the scope of the embodiments of the application. The size of the serial numbers of the above-mentioned processes does not mean the order of execution, and the execution order of each process should be determined by its functions and internal logic. Furthermore, the terms "comprising" and "having", as well as any variations thereof, are intended to cover a non-exclusive inclusion, for example, of a sequence of steps or elements. A method, system, product or device is not necessarily limited to those steps or elements explicitly listed, but may include other steps or elements not explicitly listed or inherent to the process, method, product or device.
尽管结合具体特征及其实施例对本申请进行了描述,显而易见的,在不脱离本申请的精神和范围的情况下,可对其进行各种修改和组合。相应地,本说明书和附图仅仅是所附权利要求所界定的方案进行示例性说明,且视为已覆盖本申请范围内的任意和所有修改、变化、组合或等同物。Although the application has been described in conjunction with specific features and embodiments thereof, it will be apparent that various modifications and combinations can be made thereto without departing from the spirit and scope of the application. Accordingly, the specification and drawings are merely illustrative of the solutions defined by the appended claims, and are deemed to cover any and all modifications, changes, combinations or equivalents within the scope of the application.
显然,本领域的技术人员可以对本申请进行各种改动和变型而不脱离本发明的精神和范围。这样,倘若本申请实施例的这些修改和变型属于本申请权利要求及其等同技术的范围之内,则本申请也意图包含这些改动和变型在内。Obviously, those skilled in the art can make various changes and modifications to this application without departing from the spirit and scope of the present invention. In this way, if the modifications and variations of the embodiments of the present application fall within the scope of the claims of the present application and equivalent technologies, the present application also intends to include these modifications and variations.

Claims (10)

  1. 一种光收发组件,其特征在于,包括:光发射器、双向分波器和光接收器;An optical transceiver component, characterized in that it includes: an optical transmitter, a bidirectional wave splitter and an optical receiver;
    所述双向分波器通过第一光波导端口与所述光发射器耦合、通过第二光波导端口与所述光接收器耦合以及通过第三光波导端口与光纤耦合;其中,所述双向分波器基于光波导芯片制备;The bidirectional wave splitter is coupled with the optical transmitter through a first optical waveguide port, coupled with the optical receiver through a second optical waveguide port, and coupled with an optical fiber through a third optical waveguide port; wherein, the bidirectional splitter The wave device is prepared based on the optical waveguide chip;
    所述光发射器,用于产生上行光信号,并将所述上行光信号注入到所述双向分波器中;The optical transmitter is used to generate an uplink optical signal and inject the uplink optical signal into the bidirectional demultiplexer;
    所述双向分波器,用于将所述上行光信号传输到所述光纤中;以及接收来自所述光纤的下行光信号,并将所述下行光信号传输给所述光接收器;The bidirectional demultiplexer is used to transmit the uplink optical signal into the optical fiber; and receive the downlink optical signal from the optical fiber, and transmit the downlink optical signal to the optical receiver;
    所述光接收器,用于对所述下行光信号进行接收。The optical receiver is configured to receive the downlink optical signal.
  2. 根据权利要求1所述的光收发组件,其特征在于,所述光发射器采用倒装键合工艺与所述双向分波器的第一光波导端口进行端面耦合。The optical transceiver assembly according to claim 1, wherein the optical transmitter is end-face-coupled with the first optical waveguide port of the bidirectional wave splitter by using a flip-chip bonding process.
  3. 根据权利要求1所述的光收发组件,其特征在于,所述第二光波导端口设计为采用磨抛工艺的倾斜全反射面,所述光接收器用于接收通过所述倾斜全发射面发射之后的下行光信号。The optical transceiver assembly according to claim 1, wherein the second optical waveguide port is designed as an inclined total reflection surface using a grinding and polishing process, and the optical receiver is used to receive light emitted by the inclined total reflection surface. downlink optical signal.
  4. 根据权利要求1至3中任一项所述的光收发组件,其特征在于,还包括信号放大器;所述信号放大器的输入端与所述光接收器的输出端连接,用于对所述光接收器接收到的所述下行光信号进行信号放大。The optical transceiver assembly according to any one of claims 1 to 3, further comprising a signal amplifier; the input end of the signal amplifier is connected to the output end of the optical receiver for The downlink optical signal received by the receiver is amplified.
  5. 根据权利要求1至4中任一项所述的光收发组件,其特征在于,还包括第一模斑转换器;所述第一模斑转换器的输入端连接所述光发射器,输出端连接所述双向分波器的第一光波导端口,用于将所述光发射器输出的所述上行光信号的光斑尺寸,转换为所述双向分波器通过所述第一光波导端口接收的所述上行光信号的光斑尺寸。The optical transceiver assembly according to any one of claims 1 to 4, further comprising a first speckle converter; the input end of the first speckle converter is connected to the optical transmitter, and the output end connected to the first optical waveguide port of the bidirectional wave splitter, for converting the spot size of the uplink optical signal output by the optical transmitter into The spot size of the uplink optical signal.
  6. 根据权利要求5所述的光收发组件,其特征在于,所述第一模斑转换器为锥形模斑转换器、倒锥形模斑转换器或光栅型模斑转换器。The optical transceiver assembly according to claim 5, wherein the first speckle converter is a tapered speckle converter, an inverted tapered speckle converter or a grating type speckle converter.
  7. 根据权利要求1至4中任一项所述的光收发组件,其特征在于,还包括第二模斑转换器;所述第二模斑转换器的输入端连接所述双向分波器的第三光波导端口,输出端连接所述光纤,用于将所述双向分波器通过所述第三光波导端口输出的所述上行光信号的光斑尺寸,转换为所述光纤接收的所述上行光信号的光斑尺寸。The optical transceiver assembly according to any one of claims 1 to 4, further comprising a second speckle converter; the input end of the second speckle converter is connected to the first bidirectional wave splitter Three optical waveguide ports, the output end of which is connected to the optical fiber, and is used to convert the spot size of the uplink optical signal output by the bidirectional wave splitter through the third optical waveguide port into the uplink optical signal received by the optical fiber The spot size of the optical signal.
  8. 根据权利要求7所述的光收发组件,其特征在于,所述第二模斑转换器为锥形模斑转换器、倒锥形模斑转换器或光栅型模斑转换器。The optical transceiver assembly according to claim 7, wherein the second speckle converter is a tapered speckle converter, an inverted tapered speckle converter or a grating type speckle converter.
  9. 根据权利要求1至8中任一项所述的光收发组件,其特征在于,所述光波导芯片为平面光波导芯片。The optical transceiver assembly according to any one of claims 1 to 8, wherein the optical waveguide chip is a planar optical waveguide chip.
  10. 根据权利要求1至9中任一项所述的光收发组件,其特征在于,所述双向分波器包括光波导和二氧化硅包层;所述光波导采用定向耦合器DC结构、马赫曾德尔干涉仪MZI结构或阵列波导光栅AWG结构进行设计。The optical transceiver assembly according to any one of claims 1 to 9, wherein the bidirectional wave splitter comprises an optical waveguide and a silicon dioxide cladding; the optical waveguide adopts a directional coupler DC structure, Mach Zeng Del interferometer MZI structure or arrayed waveguide grating AWG structure for design.
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