WO2022249841A1 - Mounting structure - Google Patents

Mounting structure Download PDF

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Publication number
WO2022249841A1
WO2022249841A1 PCT/JP2022/018975 JP2022018975W WO2022249841A1 WO 2022249841 A1 WO2022249841 A1 WO 2022249841A1 JP 2022018975 W JP2022018975 W JP 2022018975W WO 2022249841 A1 WO2022249841 A1 WO 2022249841A1
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WO
WIPO (PCT)
Prior art keywords
heat
wiring board
radiator
area
insulating member
Prior art date
Application number
PCT/JP2022/018975
Other languages
French (fr)
Japanese (ja)
Inventor
貴大 大堀
和憲 木寺
孝典 明田
Original Assignee
パナソニックＩｐマネジメント株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニックＩｐマネジメント株式会社 filed Critical パナソニックＩｐマネジメント株式会社
Publication of WO2022249841A1 publication Critical patent/WO2022249841A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present disclosure relates to a mounting structure, and more particularly to a mounting structure including a wiring board on which heat-generating components are mounted.
  • Circuit boards equipped with wiring boards on which parts such as semiconductor elements are mounted are used in various electrical devices.
  • a power conditioner for converting DC power generated by a solar cell module into AC power is mounted with a plurality of parts such as semiconductor elements such as FETs and resistor elements. is used.
  • Parts such as semiconductor elements or resistance elements are heat-generating parts that generate heat. Therefore, a circuit board including a wiring board on which heat-generating components are mounted generates heat. In particular, in a circuit board including a wiring board on which power semiconductor elements, which are heat-generating components, are mounted, the temperature rises due to the high heat generated from the power semiconductor elements.
  • the heat generated from the heat-generating components is dissipated by thermally connecting the circuit board to a metal radiator.
  • a wiring board on which a heat-generating component is mounted is attached to a radiator with a screw or the like, so that heat generated by the heat-generating component is conducted to the radiator located on the back side of the wiring board.
  • a heat-conducting member is inserted between the wiring board and the radiator in order to efficiently conduct the heat generated by the heat-generating components mounted on the wiring board to the radiator.
  • a thermal interface material TIM: Thermal Interface Material
  • TIM Thermal Interface Material
  • the present disclosure has been made to solve such problems, and efficiently dissipates heat generated by heat-generating components mounted on the wiring board while suppressing the occurrence of dielectric breakdown in the wiring board.
  • the purpose is to provide a mounting structure that can
  • One aspect of the mounting structure according to the present disclosure is a wiring substrate having a first surface and a second surface facing the first surface, and one or more mounted on the first surface of the wiring substrate.
  • a heat sink provided on the second surface side of the wiring board; an insulating member provided between the wiring board and the heat sink; and the wiring board.
  • a first heat conducting member provided between the insulating member and a fixing member for fixing the wiring board to the radiator, The area and the area of the first heat conducting member on the insulating member side are smaller than the area of the insulating member on the radiator side.
  • FIG. 1 is a cross-sectional view showing the configuration of a mounting structure according to Embodiment 1.
  • FIG. FIG. 2 is a cross-sectional view showing a configuration of a mounting structure according to a modification of Embodiment 1.
  • FIG. 3 is a cross-sectional view showing the configuration of the mounting structure according to the second embodiment.
  • FIG. 4 is a cross-sectional view showing the configuration of a mounting structure according to a modification of the second embodiment.
  • 5 is a cross-sectional view showing the configuration of the mounting structure of Comparative Example 1.
  • FIG. FIG. 6 is a cross-sectional view showing the configuration of the mounting structure of Comparative Example 2. As shown in FIG.
  • each figure is a schematic diagram and is not necessarily strictly illustrated. Moreover, in each figure, the same code
  • FIG. 1 is a cross-sectional view showing the configuration of a mounting structure 1 according to Embodiment 1.
  • FIG. 1 is a cross-sectional view showing the configuration of a mounting structure 1 according to Embodiment 1.
  • the mounting structure 1 includes a wiring board 10, a heat-generating component 20 mounted on the wiring board 10, a radiator 30 to which the wiring board 10 is attached, and a combination of the wiring board 10 and the radiator 30.
  • An insulating member 40 provided therebetween, a heat conducting member 50 provided between the wiring board 10 and the insulating member 40 , and a fixing member 60 for fixing the wiring board 10 to the radiator 30 are provided.
  • the wiring board 10 is a wiring board on which conductive wiring such as metal wiring is formed.
  • the wiring board 10 is, for example, a printed wiring board (printed board) on which metal wiring is formed in a predetermined pattern.
  • the metal wiring formed on the wiring substrate 10 is, for example, copper wiring made of copper foil.
  • the metal wiring may be formed in a predetermined pattern by printing or the like, or may be formed in a predetermined pattern by etching a portion of a metal thin film (for example, copper foil) formed on the entire surface of the base material constituting the wiring board 10 . pattern.
  • a resist made of an insulating resin material may be formed so as to cover the wirings in order to protect the wirings and ensure the dielectric strength.
  • the wiring board 10 is a plate-like board and has a first surface 10a and a second surface 10b facing the first surface 10a.
  • the first surface 10a is the upper surface of the wiring board 10 and is the surface opposite to the radiator 30 side.
  • the second surface 10b is the lower surface of the wiring board 10 and is the surface on the radiator 30 side.
  • the wiring board 10 is a flat board having a constant thickness.
  • the planar view shape of the wiring board 10 is substantially a rectangle as a whole, for example, it is not restricted to this.
  • the wiring board 10 may be a single-sided wiring board in which wiring is formed only on the first surface 10a on which the heat-generating component 20 is mounted, out of the first surface 10a and the second surface 10b. It may be a double-sided wiring board in which wiring is formed on each of the surface 10a and the second surface 10b. Moreover, the wiring board 10 is not limited to this, and may be a multilayer wiring board having one or a plurality of wiring layers in which wiring is formed in the inner layer of the wiring board 10 . In this embodiment, a double-sided wiring board is used as the wiring board 10 . The wiring formed on the first surface 10a and the wiring formed on the second surface 10b of the wiring board 10 may be electrically connected by via holes formed in the wiring board 10, for example.
  • the base material constituting the wiring board 10 includes a resin substrate made of an insulating resin material, a ceramic substrate made of a sintered body of a ceramic material such as alumina, and a metal substrate made of a metal material such as aluminum or copper. A metal base substrate or the like obtained by coating is used. From the viewpoint of ensuring a higher dielectric strength voltage as the wiring board 10, the base material constituting the wiring board 10 is preferably a resin board or a ceramic board whose entire base material is insulative. On the other hand, from the viewpoint of improving the heat dissipation of the wiring board 10, it is preferable that the base material constituting the wiring board 10 is a metal base board.
  • the resin substrate examples include glass epoxy substrates (CEM-3, FR-4, etc.) made of glass fiber and epoxy resin, craft paper, etc., and phenol resin.
  • a paper phenol substrate (FR-1, FR-2), a paper epoxy substrate (FR-3) made of paper and epoxy resin, or a polyimide substrate made of polyimide or the like can be used.
  • the wiring board 10 a rigid board is used instead of a film-like film board. Specifically, as the wiring board 10, an FR-4 glass epoxy board was used.
  • the wiring board 10 is a mounting board for mounting components including the heat generating component 20 . That is, the wiring substrate 10 may be mounted with non-heat generating components that do not generate heat, in addition to the heat generating components 20 that generate heat. A plurality of components mounted on the wiring board 10 constitute a predetermined drive circuit on the circuit board.
  • the heat-generating component 20 that constitutes the drive circuit on the circuit board is a component that generates heat when the drive circuit operates.
  • the heat-generating component 20 is, for example, a semiconductor element made of a semiconductor material. Examples of semiconductor elements include transistor elements such as FETs (Field Effect Transistors).
  • the heat-generating component 20 may be a discrete semiconductor element or a packaged semiconductor element such as a control IC. For example, a plurality of semiconductor elements such as FETs are integrated in the control IC.
  • the semiconductor element that is the heat-generating component 20 is a power semiconductor element, the heat-generating component 20 tends to generate a large amount of heat.
  • the heat-generating component 20 is not limited to a semiconductor element, and may be a component such as a transistor element such as a FET (Field Effect Transistor), a resistor element, or a coil element.
  • the heat generating component 20 is a surface mount (SMD: Surface Mount Device) type component. Therefore, the heat-generating component 20 is mounted on the wiring board 10 by bonding the electrodes of the heat-generating component 20 to pads or lands connected to wiring formed on the wiring board 10 with a conductive adhesive (for example, solder). .
  • SMD Surface Mount Device
  • One or more heat generating components 20 are mounted on the first surface 10 a of the wiring board 10 .
  • a plurality of heat-generating components 20 are mounted on the first surface 10a of the wiring board 10.
  • FIG. 1 illustrates a configuration in which two heat-generating components 20 are mounted on the wiring board 10 .
  • the plurality of heat-generating components 20 are electrically connected to each other through wiring formed on the wiring board 10 . Moreover, the plurality of heat-generating components 20 are also electrically connected to non-heat-generating components mounted on the wiring board 10 via wiring.
  • a non-heat generating component is, for example, an electrolytic capacitor or the like.
  • the heat-generating component 20 is arranged on the first surface 10a of the wiring board 10.
  • the heat-generating component 20 may be arranged on the second surface 10b of the wiring board 10.
  • non-heat generating components may be arranged on the first surface 10a of the wiring board 10 or may be arranged on the second surface 10b.
  • the wiring board 10 and a plurality of components mounted on the wiring board 10 constitute a circuit board.
  • Circuit boards are used, for example, in power conditioners in photovoltaic power generation systems.
  • the power conditioner converts the DC power generated by the solar cell module into AC power that can be used at home, for example.
  • a circuit board including a wiring board 10 on which a plurality of heat-generating components 20 are mounted is attached to a radiator 30 in order to efficiently radiate heat generated by the heat-generating components 20 .
  • the wiring board 10 is placed at a predetermined position on the radiator 30 and fixed to the radiator 30 by the fixing member 60 .
  • wiring board 10 is arranged on the upper surface of radiator 30 (that is, the surface facing wiring board 10).
  • the wiring board 10 is provided with a heat transport member 11 that transports the heat generated by the heat-generating component 20 to the second surface 10b side of the wiring board 10 .
  • the heat transport member 11 provided on the wiring board 10 is, for example, a thermal via, but may be a copper inlay or the like.
  • the radiator 30 is provided on the side of the second surface 10b of the wiring board 10 . That is, the radiator 30 is arranged to face the second surface 10b of the wiring board 10 . Specifically, the radiator 30 is arranged below the wiring board 10 . In other words, the wiring board 10 is arranged above the radiator 30 . In addition, the upper surface of the radiator 30 is a flat surface.
  • the radiator 30 is a heat radiating member (heat sink) for radiating heat generated by the heat generating component 20 . Moreover, the radiator 30 functions not only as a heat sink but also as a supporting member that supports the wiring board 10 . Therefore, radiator 30 is preferably a rigid body made of a metal material or a resin material with high thermal conductivity. In particular, radiator 30 is preferably made of a metal material with high thermal conductivity, such as aluminum or copper.
  • the radiator 30 may be, for example, a metal die-cast (for example, aluminum die-cast) formed into a predetermined shape, or may be formed into a predetermined shape by pressing an iron-based metal plate. It may be a sheet metal frame (eg steel plate frame) or a metal block (eg copper block). In order to improve the heat radiation performance of the radiator 30, the radiator 30 may be provided with heat radiation fins.
  • a metal die-cast for example, aluminum die-cast
  • It may be a sheet metal frame (eg steel plate frame) or a metal block (eg copper block).
  • the radiator 30 may be provided with heat radiation fins.
  • An insulating member 40 and a heat conducting member 50 are arranged between the wiring board 10 and the radiator 30 .
  • the insulating member 40 and the heat conducting member 50 are sandwiched between the wiring substrate 10 and the radiator 30 .
  • the insulating member 40 is plate-shaped and has a first surface 40a and a second surface 40b facing the first surface 40a.
  • the first surface 40 a is the upper surface of the insulating member 40 and the second surface 40 b is the lower surface of the insulating member 40 .
  • the heat conducting member 50 also has a plate-like shape, and has a first surface 50a and a second surface 50b facing the first surface 50a.
  • the first surface 50a is the upper surface of the heat conducting member 50
  • the second surface 50b is the lower surface of the heat conducting member 50. As shown in FIG.
  • the insulating member 40 and the heat conducting member 50 are arranged on the second surface 10b side of the wiring substrate 10 . Specifically, the insulating member 40 and the heat conducting member 50 are arranged below the wiring board 10 . That is, the insulating member 40 and the heat conducting member 50 are arranged above the radiator 30 .
  • the insulating member 40 and the heat conducting member 50 are arranged on the radiator 30 in this order from bottom to top. That is, the insulating member 40 is arranged above the radiator 30 , and the heat conducting member 50 is arranged above the insulating member 40 . Therefore, the insulating member 40 is inserted between the radiator 30 and the heat conducting member 50 , and the heat conducting member 50 is inserted between the insulating member 40 and the wiring substrate 10 . Specifically, the heat conducting member 50 is sandwiched between the wiring board 10 and the insulating member 40 .
  • the insulating member 40 is placed on the upper surface of the radiator 30 and the heat conducting member 50 is placed on the first surface 40a of the insulating member 40.
  • the second surface 40b of the insulating member 40 is in surface contact with the upper surface of the radiator 30, and the first surface 40a of the insulating member 40 is in surface contact with the second surface 50b of the heat conducting member 50.
  • the second surface 50b of the heat conducting member 50 is in surface contact with the first surface 40a of the insulating member 40, and the first surface 50a of the heat conducting member 50 is in contact with the second surface of the wiring board 10. It is in surface contact with 10b.
  • the insulating member 40 is in contact with both the radiator 30 and the heat conducting member 50
  • the heat conducting member 50 is in contact with both the insulating member 40 and the wiring board 10 .
  • the heat conducting member 50 that contacts the wiring board 10 also contacts the heat transporting member 11 provided on the wiring board 10 .
  • the insulating member 40 is made of an insulating material such as an insulating resin material or ceramic.
  • the insulating member 40 is, for example, an insulating plate with a constant thickness.
  • the insulating member 40 may be a rigid substrate having high rigidity, or may be a flexible substrate having flexibility.
  • the insulating member 40 is preferably made of an insulating material with high thermal conductivity. Specifically, the thermal conductivity of the insulating member 40 is preferably higher than the thermal conductivity of the substrate material of the wiring board 10 .
  • the material of the insulating member 40 is ceramic. That is, the insulating member 40 is a ceramic substrate made of ceramic with high thermal conductivity. Aluminum nitride (AlN), alumina (Al 2 O 3 ), polycrystalline silicon carbide (SiC), or the like can be used as the ceramic constituting the insulating member 40 .
  • the insulating member 40 may be a resin sheet made of an insulating resin material instead of the ceramic substrate.
  • a polyimide tape made of polyimide can be used as the insulating member 40 .
  • the insulating member 40 may or may not have adhesiveness.
  • the thermally conductive member 50 on the insulating member 40 is a thermal interface material (TIM) with excellent thermal conductivity, and is made of an insulating material with high thermal conductivity.
  • the heat conducting member 50 is made of an insulating resin material.
  • the heat conducting member 50 is heat dissipation grease.
  • silicone oil or the like can be used as the heat dissipation grease.
  • the heat dissipating grease is a fluid, even if the gap between the wiring board 10 and the insulating member 40 is minute and has irregularities, the heat dissipating grease easily enters into the gap. Adhesion with 40 can be effectively improved.
  • thermally conductive member 50 may be a flat plate-shaped thermally conductive sheet (heat radiation sheet) with a constant thickness. Moreover, the heat conducting member 50 may or may not have adhesiveness.
  • the thermally conductive member 50 is a thermally conductive sheet
  • the thermally conductive member 50 is preferably made of a flexible rubber-based material.
  • the thermally conductive member 50 which is a thermally conductive sheet, may be made of clay and have elasticity.
  • thermally conductive member 50 Even when a thermally conductive sheet is used as the thermally conductive member 50, heat dissipation grease should be applied between the thermally conductive member 50 and the wiring board 10 and/or between the thermally conductive member 50 and the insulating member 40. good too.
  • a plurality of heat conducting members 50 are provided so as to face each of the plurality of heat generating components 20 .
  • a plurality of heat conducting members 50 are arranged two-dimensionally on the insulating member 40 .
  • a plurality of heat conducting members 50 facing each of the plurality of heat generating components 20 are arranged separately from each other. Therefore, a gap (air layer) exists between two adjacent heat conducting members 50 , and an air layer exists between the wiring substrate 10 and the insulating member 40 .
  • the plurality of heat conducting members 50 are arranged directly under the plurality of heat generating components 20 and correspond to each other one by one.
  • the heat conducting member 50 is arranged in a part of the region between the wiring substrate 10 and the insulating member 40. As shown in FIG. Therefore, when the mounting structure 1 is viewed from above, the area of the heat conducting member 50 is smaller than the area of the insulating member 40 .
  • the area S50a of the heat conducting member 50 on the wiring board 10 side (hereinafter also referred to as "first area S50a”) and the area S50b of the heat conducting member 50 on the insulating member 40 side (hereinafter referred to as " The second area S50b”) is smaller than the area S40b of the insulating member 40 on the radiator 30 side (hereinafter also referred to as the "third area S40b”) (S50a ⁇ S40b, S50b ⁇ S40b).
  • the first area S50a is the area of the portion where the first surface 50a of the heat conducting member 50 contacts the second surface 10b of the wiring board 10.
  • the second area S50b is the area of the portion where the second surface 50b of the heat conducting member 50 contacts the first surface 40a of the insulating member 40.
  • the third area S40b is the area of the portion where the second surface 40b of the insulating member 40 contacts the upper surface of the radiator 30.
  • a plurality of heat conducting members 50 are arranged between the wiring substrate 10 and the insulating member 40.
  • Each of the plurality of heat conducting members 50 has a relational expression of S50a ⁇ S40b and ⁇ The relational expression of S40b is satisfied.
  • each of the plurality of heat conducting members 50 not only satisfies the relational expressions of S50a ⁇ S40b and S50b ⁇ S40b, but the total area of the plurality of heat conducting members 50 satisfies the relation of S50a ⁇ S40b. It satisfies the relational expression and the relational expression of S50b ⁇ S40b. That is, the first area S50a is the sum of the areas of the plurality of heat conducting members 50 on the wiring substrate 10 side, and the second area S50b is the sum of the areas of the plurality of heat conducting members 50 on the insulating member 40 side. Even in this case, the relational expressions of S50a ⁇ S40b and S50b ⁇ S40b are satisfied.
  • the relational expression S50a ⁇ S40b and the relational expression S50b ⁇ S40b do not necessarily have to be satisfied when the total area of the plurality of heat conducting members 50 is satisfied. It is sufficient that the area of each of the conductive members 50 satisfies the relational expression of S50a ⁇ S40b and the relational expression of S50b ⁇ S40b.
  • the first area S50a and the second area S50b are preferably larger than the area where the heat-generating component 20 contacts the wiring board 10 by the thickness of the wiring board 10 or more.
  • the wiring board 10 is fixed to the radiator 30 with a fixing member 60 .
  • a fastening member such as a screw can be used as the fixing member 60 .
  • fixing member 60 is a screw having a screw head and a screw shaft, and wiring board 10 is screwed to radiator 30 by the screw.
  • the wiring board 10 is attached to the radiator 30 by inserting the screw shaft of the screw through the through hole provided in the wiring board 10 and screwing the screw shaft into the screw hole provided in the radiator 30 . can be done.
  • the screw head of the screw abuts against the first surface 10a of the wiring board 10 and is locked.
  • wiring board 10 is fixed to radiator 30 with a plurality of screws.
  • the heat conducting member 50 and the insulating member 40 are inserted between the wiring board 10 and the radiator 30 , the wiring board 10 can be fixed to the radiator 30 by the fixing member 60 . , the heat conducting member 50 and the insulating member 40 are also fixed to the radiator 30 .
  • the wiring board 10, the heat conducting member 50, the insulating member 40, and the radiator 30 are fastened together by the tightening force of the screws, which are the fixing members 60, and fixed to each other. Therefore, the heat conducting member 50 and the insulating member 40 inserted between the wiring board 10 and the heat sink 30 are pressed by the wiring board 10 and the heat sink 30 to be pressed and fixed to the heat sink 30 . ing.
  • the adhesion between the heat conducting member 50 and the wiring board 10 and the insulating member 40 can be improved. Therefore, the heat generated by the heat-generating component 20 can be efficiently conducted to the radiator 30 via the heat-conducting member 50 and the insulating member 40 .
  • a spacer into which a screw can be inserted may be provided in a portion of the radiator 30 corresponding to the fixing member 60 .
  • the spacer may be made of metal or resin.
  • the screw hole portion provided in the radiator 30 may be formed so as to swell to such an extent that the wiring substrate 10 and the radiator 30 are not bent.
  • each of the insulating member 40 and the thermally conductive member 50 is provided with an insertion hole through which the screw shaft of the screw is inserted.
  • the threaded shaft of the screw may be inserted into the heat sink 30 and screwed into the threaded hole of the radiator 30 .
  • FIG. 5 is a cross-sectional view of a mounting structure 1X of Comparative Example 1
  • FIG. 6 is a cross-sectional view of a mounting structure 1Y of Comparative Example 2.
  • the wiring substrate 10 and the radiator 30 are arranged in order to efficiently conduct the heat generated by the heat-generating component 20 mounted on the wiring substrate 10 to the radiator 30. are uniformly arranged over the entire area between the wiring board 10 and the radiator 30 .
  • the wiring board 10 when the wiring board 10 is attached to the heat sink 30 with screws as the fixing members 60, the wiring board 10 may be bent by being pressed by the tightening of the screws. . As a result, a gap (air layer) may occur between the wiring board 10 and the radiator 30 . For example, as shown in FIG. 5, a gap may occur between the wiring board 10 and the heat conducting member 50X. Moreover, although not shown, a gap may occur between the heat conducting member 50X and the radiator 30 . When the wiring board 10 bends in this way, the adhesion between the wiring board 10 and the radiator 30 is lowered. In particular, if the wiring board 10 is a resin board such as CEM-3 or FR-4, the resin board has lower rigidity than a ceramic board or a metal base board. .
  • the wiring board 10 and the heat sink 30 are arranged as in the mounting structure 1Y shown in FIG. It is conceivable to partially dispose the heat conducting member 50Y between. For example, it is conceivable to divide the heat conducting member 50Y into a plurality of pieces and dispose the plurality of heat conducting members 50Y separately from each other.
  • insulating member 40 is provided between wiring board 10 and radiator 30 , and heat is generated between wiring board 10 and insulating member 40 .
  • a conducting member 50 is provided.
  • the area S50a of the heat conducting member 50 on the wiring board 10 side and the area S50b of the heat conducting member 50 on the insulating member 40 side are smaller than the area S40b of the insulating member 40 on the radiator 30 side.
  • the insulating member 40 is inserted between the wiring substrate 10 and the radiator 30, and then the heat conducting member is inserted in the region between the wiring substrate 10 and the insulating member 40. 50 is partially arranged.
  • the heat conducting member 50 and the insulating member 40 are sandwiched between the wiring board 10 and the radiator 30, and the wiring board 10 is pressed down by the fixing member 60 such as a screw to be fixed to the radiator 30. Even if there is, the heat conducting member 50 is partially arranged between the wiring board 10 and the insulating member 40, so even if the wiring board 10 is bent, the wiring board 10 directly below the heat generating component 20 and the radiator 30 It is possible to suppress the formation of a gap between them. In other words, it is possible to improve the adhesion between the wiring substrate 10 and the radiator 30 immediately below the heat-generating component 20 . As a result, the heat generated by the heat-generating component 20 can be efficiently conducted to the radiator 30 and radiated.
  • the insulating member 40 having a larger area than the heat conducting member 50 is inserted between the wiring board 10 and the radiator 30 .
  • the heat conducting member 50 is partially arranged between the wiring board 10 and the insulating member 40, the occurrence of dielectric breakdown in the wiring board 10 can be suppressed.
  • the heat generated by the heat-generating component 20 mounted on the wiring board 10 is efficiently radiated while suppressing the occurrence of dielectric breakdown in the wiring board 10. be able to.
  • a plurality of heat conducting members 50 are provided so as to face each of the plurality of heat generating components 20 and are separated from each other. Specifically, the heat conducting member 50 is arranged directly below each heat generating component 20 via the wiring board 10 .
  • the thermal conductivity of the insulating member 40 is higher than the thermal conductivity of the substrate material of the wiring board 10 .
  • the heat generated by the heat-generating component 20 can be efficiently conducted to the insulating member 40 side. Therefore, the heat generated by the heat-generating component 20 can be efficiently dissipated.
  • the mounting structure 1 includes the heat transport member 11 that transports the heat generated by the heat-generating component 20 to the second surface 10b side of the wiring board 10 .
  • the heat transport member 11 is provided on the wiring board 10 .
  • the heat-conducting member 50 is preferably in contact with the heat-transporting member 11 .
  • the heat generated by the heat-generating component 20 can be efficiently conducted to the heat-conducting member 50 through the wiring board 10 .
  • the area where the heat conducting member 50 abuts against the heat transporting member 11 is at least larger than the area of the portion of the wiring board 10 where the heat transporting member 11 is provided by at least the thickness of the wiring board 10 . good.
  • the mounting structure 1A according to this modification has the same configuration as the mounting structure 1 according to the first embodiment except that two adjacent heat conducting members 50 are in contact with each other.
  • the area of each of the plurality of heat conducting members 50 is larger than in the mounting structure 1 shown in FIG.
  • the area of each heat conducting member 50 and the total area of the plurality of heat conducting members 50 satisfy the relational expressions of S50a ⁇ S40b and S50b ⁇ S40b.
  • the mounting structure 1A according to this modified example also has the same effects as the mounting structure 1 according to the first embodiment.
  • FIG. 3 is a cross-sectional view of the mounting structure 2 according to the second embodiment.
  • the mounting structure 2 is the mounting structure 1 according to the first embodiment, in addition to the thermally conductive member 50 (first thermally conductive member). It is configured to include a thermally conductive member 70 (second thermally conductive member).
  • the heat conducting member 70 is arranged between the insulating member 40 and the radiator 30 .
  • the heat conducting member 70 is arranged below the insulating member 40 .
  • the heat conducting member 50 is arranged as in the first embodiment. Therefore, the insulating member 40 is sandwiched between the heat conducting member 50 and the heat conducting member 70 .
  • the heat conducting member 70 is placed on the top surface of the radiator 30 .
  • the lower surface of the heat conducting member 70 is in surface contact with the upper surface of the radiator 30 . Therefore, the insulating member 40 is not in contact with the radiator 30 unlike the first embodiment.
  • the upper surface of the heat conducting member 70 is in surface contact with the second surface 40 b (lower surface) of the insulating member 40 .
  • the thermally conductive member 70 is a thermal interface material (TIM) with excellent thermal conductivity, similar to the thermally conductive member 50, and is made of an insulating material with high thermal conductivity.
  • the heat conducting member 70 is made of an insulating resin material.
  • the heat conducting member 70 is heat dissipation grease.
  • the heat conducting member 70 may be made of the same material as the heat conducting member 50, or may be made of a material different from that of the heat conducting member 50. Moreover, the thickness of the heat-conducting member 70 may be the same as the thickness of the heat-conducting member 50 or may be different from the thickness of the heat-conducting member 50 .
  • the area of the heat conducting member 70 is greater than or equal to the area of the insulating member 40 . That is, both the area of the heat conducting member 70 on the radiator 30 side and the area of the heat conducting member 70 on the insulating member 40 side are equal to or larger than the area S40b of the insulating member 40 on the radiator 30 side. Specifically, the area of the heat conducting member 70 on the radiator 30 side and the area of the heat conducting member 70 on the insulating member 40 side are larger than the area S40b of the insulating member 40 on the radiator 30 side.
  • the area of the heat conducting member 70 on the radiator 30 side is the area of the lower surface of the heat conducting member 70
  • the area of the heat conducting member 70 on the insulating member 40 side is the area of the upper surface of the heat conducting member 70. area.
  • the area where the lower heat conduction member 70 exists is larger than the area where the upper heat conduction member 50 exists.
  • the area of the heat conducting member 70 on the lower side is larger than the area of the heat conducting member 50 on the upper side.
  • the area of the upper surface of the heat-conducting member 70 and the area of the lower surface of the heat-conducting member 70 are larger than the area S50a of the heat-conducting member 50 on the side of the wiring board 10, and the insulating member 40 of the heat-conducting member 50 It is larger than the side area S50b.
  • the mounting structure 2 according to the present embodiment has the same configuration as the mounting structure 1 according to the first embodiment, except that it includes a heat conducting member 70 as a second heat conducting member. .
  • the insulating member 40 is provided between the wiring board 10 and the radiator 30, and the heat conducting member 50 is provided between the wiring board 10 and the insulating member 40. is provided.
  • the area S50a of the heat conducting member 50 on the wiring board 10 side and the area S50b of the heat conducting member 50 on the insulating member 40 side are smaller than the area S40b of the insulating member 40 on the radiator 30 side.
  • a second heat conducting member A heat conducting member 70 is provided.
  • the adhesion between the insulating member 40 and the radiator 30 can be further enhanced compared to the mounting structure 1 according to the first embodiment.
  • the heat generated by the heat-generating component 20 mounted on the wiring board 10 can be dissipated more efficiently.
  • the area where the heat conducting member 70 exists is larger than the area where the heat conducting member 50 exists.
  • This configuration improves heat transfer from the wiring board 10 to the radiator 30, so that the heat generated by the heat-generating components 20 mounted on the wiring board 10 can be dissipated more efficiently.
  • a plurality of heat conducting members 70 may be arranged between the insulating member 40 and the radiator 30 like the mounting structure 2A according to the modification shown in FIG.
  • each of the plurality of heat conducting members 70 may be provided so as to face each of the plurality of heat generating components 20 .
  • the plurality of heat conducting members 70 are arranged separately from each other. Therefore, a gap (air layer) exists between two adjacent heat conducting members 70 .
  • the area of the thermally conductive member 70 which is the second thermally conductive member, is equal to or greater than the area of the insulating member 40, but the present invention is not limited to this. That is, as shown in FIG. 4 , the area of the heat conducting member 70 may be smaller than the area of the insulating member 40 .
  • the area S70a of the heat conducting member 70 on the insulating member 40 side (hereinafter also referred to as “fourth area S70a”) and the area of the heat conducting member 70 on the radiator 30 side S70b (hereinafter also referred to as “fifth area S70b”) is smaller than area S40b (third area) of insulating member 40 on radiator 30 side (S70a ⁇ S40b, S70b ⁇ S40b).
  • the fourth area S70a is the area of the portion where the first surface 70a, which is the upper surface of the heat conducting member 70, contacts the second surface 40b of the insulating member 40.
  • the fifth area S70b is the area of the portion where the second surface 70b, which is the lower surface of the heat conducting member 70, contacts the radiator 30.
  • a plurality of heat conducting members 70 are arranged between the insulating member 40 and the radiator 30, and each of the plurality of heat conducting members 70 satisfies the relational expressions S70a ⁇ S40b and S70b ⁇ It satisfies the relational expression of S40b.
  • each of the plurality of heat conducting members 70 not only satisfies the relational expressions of S70a ⁇ S40b and S70b ⁇ S40b, but the total area of the plurality of heat conducting members 70 satisfies the relation of S70a ⁇ S40b. It satisfies the relational expression and the relational expression of S70b ⁇ S40b. That is, the fourth area S70a is the sum of the areas of the plurality of heat conducting members 70 on the insulating member 40 side, and the fifth area S70b is the sum of the areas of the plurality of heat conducting members 70 on the radiator 30 side. Even in this case, the relational expressions of S70a ⁇ S40b and S70b ⁇ S40b are satisfied.
  • the relational expression S70a ⁇ S40b and the relational expression S70b ⁇ S40b do not necessarily have to be satisfied when the areas of the plurality of heat conducting members 70 are totaled. It is sufficient that the area of each of the conductive members 70 satisfies the relational expression of S70a ⁇ S40b and the relational expression of S70b ⁇ S40b.
  • the fourth area S70a and the fifth area S70b of the heat conducting member 70 are larger than the area where the heating component 20 contacts the wiring board 10 by the thickness of the wiring board 10 and/or It is preferable that the thickness is greater than the thickness of the insulating member 40 .
  • the mounting structure 2A according to this modified example also has the same effect as the mounting structure 2 according to the second embodiment.
  • the self-heating heat-generating component 20 was a circuit element such as a semiconductor element, but it is not limited to this.
  • the heat-generating component 20 that generates heat by itself may be a surface-mounted LED element (LED light source).
  • LED light source a surface-mounted LED element
  • an SMD type LED light source in which an LED chip is packaged can be used as the LED element.
  • An SMD type LED light source includes a container (package) made of resin or ceramic, an LED chip (bare chip) arranged in the container, and a sealing member that seals the LED chip.
  • a phosphor-containing resin containing a phosphor may be used as the sealing member.
  • the heat-generating component 20 may include both the LED element and the circuit element, or may include only the LED element.
  • the wiring board 10 on which the LED element is mounted becomes an LED board.
  • the insulating member 40 and the heat conducting member 50 may be made of different materials, or may be made of the same material.
  • both the insulating member 40 and the heat conducting member 50 may be made of TIM.
  • the insulating member 40 and the heat conducting member 70 (second heat conducting member) may be made of different materials or may be made of the same material.
  • both the insulating member 40 and the heat conducting member 70 may be made of TIM.
  • the insulating member 40, the heat conducting member 50 and the heat conducting member 70 may all be made of TIM.
  • the fixing member 60 is a screw, and the wiring board 10 and the heat sink 30 are fixed by screwing, but the present invention is not limited to this.
  • the fixing member 60 may be a holder that presses the wiring board 10 toward the radiator 30 . By pressing the wiring board 10 with the holder in this manner, the heat conducting member 50 and the insulating member 40 can be sandwiched between the wiring board 10 and the radiator 30 and fixed to the radiator 30 .
  • the holder is fixed to the heat radiator 30 or the like with fasteners such as screws.

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Abstract

This mounting structure (1) comprises: a wiring board (10) having a first surface (10a) and a second surface (10b) which is opposite to the first surface (10a); one or more surface-mounted-type heat-generating components (20) mounted on the first surface (10a) of the wiring board (10); a heat dissipator (30) provided on the second surface (10b) side of the wiring board (10); an insulating member (40) provided between the wiring board (10) and the heat dissipator (30); a heat transfer member (50) provided between the wiring board (10) and the insulating member (40); and a fixing member (60) for fixing the wiring board (10) to the heat dissipator (30), wherein the insulating member (40)-side area (S50b) of the heat transfer member (5) and the wiring board (10)-side area (S50a) of the heat transfer member (50) are smaller than the heat dissipator (30)-side area (S40b) of the insulating member (40).

Description

実装構造体implementation structure
　本開示は、実装構造体に関し、特に、発熱部品が実装された配線基板を備える実装構造体に関する。 The present disclosure relates to a mounting structure, and more particularly to a mounting structure including a wiring board on which heat-generating components are mounted.
　半導体素子等の部品が実装された配線基板を備える回路基板は、種々の電気機器に用いられている。例えば、太陽光発電システムにおいては、太陽電池モジュールで発電された直流電力を交流電力に変換するためのパワーコンディショナに、ＦＥＴ等の半導体素子や抵抗素子等の複数の部品が実装された配線基板を備える回路基板が用いられている。 Circuit boards equipped with wiring boards on which parts such as semiconductor elements are mounted are used in various electrical devices. For example, in a photovoltaic power generation system, a power conditioner for converting DC power generated by a solar cell module into AC power is mounted with a plurality of parts such as semiconductor elements such as FETs and resistor elements. is used.
　半導体素子または抵抗素子等の部品は、熱を発する発熱部品である。したがって、発熱部品が実装された配線基板を備える回路基板は、熱を発生する。特に、発熱部品となる電力用半導体素子が実装された配線基板を備える回路基板では、電力用半導体素子から発生する高い熱によって高温になる。 Parts such as semiconductor elements or resistance elements are heat-generating parts that generate heat. Therefore, a circuit board including a wiring board on which heat-generating components are mounted generates heat. In particular, in a circuit board including a wiring board on which power semiconductor elements, which are heat-generating components, are mounted, the temperature rises due to the high heat generated from the power semiconductor elements.
　そこで、従来、回路基板を金属製の放熱器に熱的に接続することで、発熱部品から発生する熱を放熱している。例えば、発熱部品が実装された配線基板をネジ等によって放熱器に取り付けることで、発熱部品で発生する熱を配線基板の裏面側に位置する放熱器へと伝導させている。 Therefore, conventionally, the heat generated from the heat-generating components is dissipated by thermally connecting the circuit board to a metal radiator. For example, a wiring board on which a heat-generating component is mounted is attached to a radiator with a screw or the like, so that heat generated by the heat-generating component is conducted to the radiator located on the back side of the wiring board.
　また、この種の回路基板を備える電気機器では、配線基板に実装された発熱部品で発生する熱を効率良く放熱器に伝導させるために、配線基板と放熱器との間に熱伝導部材を挿入することがある（例えば特許文献１）。熱伝導部材としては、例えば、放熱シートまたは放熱グリス等の熱伝導性に優れた熱界面材料（ＴＩＭ；Ｔｈｅｒｍａｌ　Ｉｎｔｅｒｆａｃｅ　Ｍａｔｅｒｉａｌ）が用いられる。 In addition, in an electrical device equipped with this type of circuit board, a heat-conducting member is inserted between the wiring board and the radiator in order to efficiently conduct the heat generated by the heat-generating components mounted on the wiring board to the radiator. (For example, Patent Document 1). As the heat-conducting member, for example, a thermal interface material (TIM: Thermal Interface Material) having excellent heat conductivity such as a heat-dissipating sheet or heat-dissipating grease is used.
特開２０２０－１９１３１６号公報JP 2020-191316 A
　しかしながら、配線基板と放熱器との間に熱伝導部材が挿入された構造を有する実装構造体においては、配線基板に絶縁破壊が発生することを抑制しつつ、発熱部品で発生する熱を効率良く放熱することが難しい。 However, in a mounting structure having a structure in which a heat-conducting member is inserted between a wiring board and a radiator, the occurrence of dielectric breakdown in the wiring board is suppressed, and heat generated by heat-generating components is efficiently dissipated. Difficult to dissipate heat.
　本開示は、このような課題を解決するためになされたものであり、配線基板に絶縁破壊が発生することを抑制しつつ、配線基板に実装された発熱部品で発生する熱を効率良く放熱することができる実装構造体を提供することを目的とする。 The present disclosure has been made to solve such problems, and efficiently dissipates heat generated by heat-generating components mounted on the wiring board while suppressing the occurrence of dielectric breakdown in the wiring board. The purpose is to provide a mounting structure that can
　本開示に係る実装構造体の一態様は、第一の面および前記第一の面に背向する第二の面を有する配線基板と、前記配線基板の前記第一の面に１つ以上実装された表面実装型の発熱部品と、前記配線基板の前記第二の面側に設けられた放熱器と、前記配線基板と前記放熱器との間に設けられた絶縁部材と、前記配線基板と前記絶縁部材との間に設けられた第一の熱伝導部材と、前記配線基板を前記放熱器に固定するための固定部材と、を備え、前記第一の熱伝導部材の前記配線基板側の面積、および、前記第一の熱伝導部材の前記絶縁部材側の面積は、前記絶縁部材の前記放熱器側の面積よりも小さい。 One aspect of the mounting structure according to the present disclosure is a wiring substrate having a first surface and a second surface facing the first surface, and one or more mounted on the first surface of the wiring substrate. a heat sink provided on the second surface side of the wiring board; an insulating member provided between the wiring board and the heat sink; and the wiring board. a first heat conducting member provided between the insulating member and a fixing member for fixing the wiring board to the radiator, The area and the area of the first heat conducting member on the insulating member side are smaller than the area of the insulating member on the radiator side.
　配線基板に絶縁破壊が発生することを抑制しつつ、配線基板に実装された発熱部品で発生する熱を効率良く放熱することができる。 It is possible to efficiently dissipate the heat generated by the heat-generating components mounted on the wiring board while suppressing the occurrence of dielectric breakdown in the wiring board.
図１は、実施の形態１に係る実装構造体の構成を示す断面図である。FIG. 1 is a cross-sectional view showing the configuration of a mounting structure according to Embodiment 1. FIG. 図２は、実施の形態１の変形例に係る実装構造体の構成を示す断面図である。FIG. 2 is a cross-sectional view showing a configuration of a mounting structure according to a modification of Embodiment 1. FIG. 図３は、実施の形態２に係る実装構造体の構成を示す断面図である。FIG. 3 is a cross-sectional view showing the configuration of the mounting structure according to the second embodiment. 図４は、実施の形態２の変形例に係る実装構造体の構成を示す断面図である。FIG. 4 is a cross-sectional view showing the configuration of a mounting structure according to a modification of the second embodiment. 図５は、比較例１の実装構造体の構成を示す断面図である。5 is a cross-sectional view showing the configuration of the mounting structure of Comparative Example 1. FIG. 図６は、比較例２の実装構造体の構成を示す断面図である。FIG. 6 is a cross-sectional view showing the configuration of the mounting structure of Comparative Example 2. As shown in FIG.
　以下、本開示の実施の形態について説明する。なお、以下に説明する実施の形態は、いずれも本開示の好ましい一具体例を示すものである。したがって、以下の実施の形態で示される、数値、形状、材料、構成要素、および、構成要素の配置位置や接続形態などは、一例であって本開示を限定する主旨ではない。よって、以下の実施の形態における構成要素のうち、本開示の最上位概念を示す独立請求項に記載されていない構成要素については、任意の構成要素として説明される。 An embodiment of the present disclosure will be described below. It should be noted that each of the embodiments described below is a preferred specific example of the present disclosure. Therefore, the numerical values, shapes, materials, components, and arrangement positions and connection forms of the components shown in the following embodiments are examples and are not intended to limit the present disclosure. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in independent claims representing the highest concept of the present disclosure will be described as optional constituent elements.
　なお、各図は、模式図であり、必ずしも厳密に図示されたものではない。また、各図において、実質的に同一の構成に対しては同一の符号を付しており、重複する説明は省略または簡略化する。また、本明細書において、「上」および「下」という用語は、必ずしも、絶対的な空間認識における上方向（鉛直上方）および下方向（鉛直下方）を指すものではない。 It should be noted that each figure is a schematic diagram and is not necessarily strictly illustrated. Moreover, in each figure, the same code|symbol is attached|subjected to the substantially same structure, and the overlapping description is abbreviate|omitted or simplified. Also, in this specification, the terms "upper" and "lower" do not necessarily indicate upward (vertically upward) and downward (vertically downward) directions in absolute spatial recognition.
　（実施の形態１）
　まず、実施の形態１に係る実装構造体１の構成について、図１を用いて説明する。図１は、実施の形態１に係る実装構造体１の構成を示す断面図である。 (Embodiment 1)
First, the configuration of the mounting structure 1 according to Embodiment 1 will be described with reference to FIG. FIG. 1 is a cross-sectional view showing the configuration of a mounting structure 1 according to Embodiment 1. FIG.
　図１に示すように、実装構造体１は、配線基板１０と、配線基板１０に実装された発熱部品２０と、配線基板１０が取り付けられる放熱器３０と、配線基板１０と放熱器３０との間に設けられた絶縁部材４０と、配線基板１０と絶縁部材４０との間に設けられた熱伝導部材５０と、配線基板１０を放熱器３０に固定するための固定部材６０とを備える。 As shown in FIG. 1, the mounting structure 1 includes a wiring board 10, a heat-generating component 20 mounted on the wiring board 10, a radiator 30 to which the wiring board 10 is attached, and a combination of the wiring board 10 and the radiator 30. An insulating member 40 provided therebetween, a heat conducting member 50 provided between the wiring board 10 and the insulating member 40 , and a fixing member 60 for fixing the wiring board 10 to the radiator 30 are provided.
　配線基板１０は、金属配線等の導電性を有する配線が形成された配線基板である。配線基板１０は、例えば金属配線が所定のパターンで形成されたプリント配線基板（プリント基板）である。配線基板１０に形成される金属配線は、例えば、銅箔からなる銅配線である。なお、金属配線は、印刷等によって所定のパターンに形成されてもよいし、配線基板１０を構成する基材の全面に形成された金属薄膜（例えば銅箔）の一部をエッチングすることで所定のパターンに形成されてもよい。なお、配線基板１０の表面には、配線を保護するとともに絶縁耐圧を確保するために、配線を覆うように絶縁性樹脂材料からなるレジストが形成されていてもよい。 The wiring board 10 is a wiring board on which conductive wiring such as metal wiring is formed. The wiring board 10 is, for example, a printed wiring board (printed board) on which metal wiring is formed in a predetermined pattern. The metal wiring formed on the wiring substrate 10 is, for example, copper wiring made of copper foil. The metal wiring may be formed in a predetermined pattern by printing or the like, or may be formed in a predetermined pattern by etching a portion of a metal thin film (for example, copper foil) formed on the entire surface of the base material constituting the wiring board 10 . pattern. On the surface of the wiring substrate 10, a resist made of an insulating resin material may be formed so as to cover the wirings in order to protect the wirings and ensure the dielectric strength.
　配線基板１０は、板状の基板であり、第一の面１０ａと、第一の面１０ａに背向する第二の面１０ｂとを有する。本実施の形態において、第一の面１０ａは、配線基板１０の上面であり、放熱器３０側とは反対側の面である。一方、第二の面１０ｂは、配線基板１０の下面であり、放熱器３０側の面である。また、配線基板１０は、厚みが一定の平板状の基板である。なお、配線基板１０の平面視形状は、例えば、全体として略矩形であるが、これに限るものでない。 The wiring board 10 is a plate-like board and has a first surface 10a and a second surface 10b facing the first surface 10a. In the present embodiment, the first surface 10a is the upper surface of the wiring board 10 and is the surface opposite to the radiator 30 side. On the other hand, the second surface 10b is the lower surface of the wiring board 10 and is the surface on the radiator 30 side. Further, the wiring board 10 is a flat board having a constant thickness. In addition, although the planar view shape of the wiring board 10 is substantially a rectangle as a whole, for example, it is not restricted to this.
　配線基板１０は、第一の面１０ａおよび第二の面１０ｂのうち発熱部品２０が実装される第一の面１０ａのみに配線が形成された片面配線基板であってもよいし、第一の面１０ａおよび第二の面１０ｂの各々に配線が形成された両面配線基板であってもよい。また、配線基板１０は、これに限らず、配線基板１０の内層に配線が形成された配線層を１つ又は複数備える多層配線基板であってもよい。本実施の形態では、配線基板１０として、両面配線基板を用いている。なお、配線基板１０の第一の面１０ａに形成された配線と第二の面１０ｂに形成された配線とは、例えば配線基板１０に形成されたビアホールによって電気的に接続されていてもよい。 The wiring board 10 may be a single-sided wiring board in which wiring is formed only on the first surface 10a on which the heat-generating component 20 is mounted, out of the first surface 10a and the second surface 10b. It may be a double-sided wiring board in which wiring is formed on each of the surface 10a and the second surface 10b. Moreover, the wiring board 10 is not limited to this, and may be a multilayer wiring board having one or a plurality of wiring layers in which wiring is formed in the inner layer of the wiring board 10 . In this embodiment, a double-sided wiring board is used as the wiring board 10 . The wiring formed on the first surface 10a and the wiring formed on the second surface 10b of the wiring board 10 may be electrically connected by via holes formed in the wiring board 10, for example.
　配線基板１０を構成する基材としては、絶縁性樹脂材料からなる樹脂基板、アルミナ等のセラミック材料の焼結体からなるセラミック基板、アルミニウムまたは銅等の金属材料からなる金属基材の表面に絶縁被膜を施すことで得られるメタルベース基板等が用いられる。なお、配線基板１０としてより高い絶縁耐圧を確保するとの観点では、配線基板１０を構成する基材としては、基材全体が絶縁性を有する樹脂基板またはセラミック基板であるとよい。一方、配線基板１０の放熱性を良くするとの観点では、配線基板１０を構成する基材としてはメタルベース基板であるとよい。 The base material constituting the wiring board 10 includes a resin substrate made of an insulating resin material, a ceramic substrate made of a sintered body of a ceramic material such as alumina, and a metal substrate made of a metal material such as aluminum or copper. A metal base substrate or the like obtained by coating is used. From the viewpoint of ensuring a higher dielectric strength voltage as the wiring board 10, the base material constituting the wiring board 10 is preferably a resin board or a ceramic board whose entire base material is insulative. On the other hand, from the viewpoint of improving the heat dissipation of the wiring board 10, it is preferable that the base material constituting the wiring board 10 is a metal base board.
　配線基板１０が樹脂基板によって構成されている場合、樹脂基板としては、例えば、ガラス繊維とエポキシ樹脂とからなるガラスエポキシ基板（ＣＥＭ－３、ＦＲ－４等）、クラフト紙等とフェノール樹脂とによって構成された紙フェノール基板（ＦＲ－１、ＦＲ－２）、紙とエポキシ樹脂とによって構成された紙エポキシ基板（ＦＲ－３）、または、ポリイミド等からなるポリイミド基板等を用いることができる。 When the wiring board 10 is made of a resin substrate, examples of the resin substrate include glass epoxy substrates (CEM-3, FR-4, etc.) made of glass fiber and epoxy resin, craft paper, etc., and phenol resin. A paper phenol substrate (FR-1, FR-2), a paper epoxy substrate (FR-3) made of paper and epoxy resin, or a polyimide substrate made of polyimide or the like can be used.
　また、本実施の形態では、配線基板１０として、フィルム状のフィルム基板ではなく、リジッド基板を用いた。具体的には、配線基板１０として、ＦＲ－４のガラスエポキシ基板を用いた。 Further, in the present embodiment, as the wiring board 10, a rigid board is used instead of a film-like film board. Specifically, as the wiring board 10, an FR-4 glass epoxy board was used.
　また、配線基板１０は、発熱部品２０を含む部品を実装するための実装基板である。つまり、配線基板１０には、部品として、熱を発生する発熱部品２０以外に、熱を発生しない非発熱部品が実装されていてもよい。配線基板１０に実装された複数の部品は、回路基板における所定の駆動回路を構成している。 Also, the wiring board 10 is a mounting board for mounting components including the heat generating component 20 . That is, the wiring substrate 10 may be mounted with non-heat generating components that do not generate heat, in addition to the heat generating components 20 that generate heat. A plurality of components mounted on the wiring board 10 constitute a predetermined drive circuit on the circuit board.
　回路基板における駆動回路を構成する発熱部品２０は、この駆動回路が動作することで自身が熱を発する部品である。発熱部品２０は、例えば、半導体材料によって構成された半導体素子である。半導体素子としては、ＦＥＴ（Ｆｉｅｌｄ　Ｅｆｆｅｃｔ　Ｔｒａｎｓｉｓｔｏｒ）等のトランジスタ素子等である。この場合、発熱部品２０は、ディスクリート半導体素子であってもよいし、制御ＩＣ等のパッケージ化されたパッケージ半導体素子であってもよい。例えば、制御ＩＣには、複数のＦＥＴ等の半導体素子が集積されている。特に、発熱部品２０である半導体素子が電力用半導体素子である場合、発熱部品２０は高い熱を発生しやすい。なお、発熱部品２０は、半導体素子に限るものではなく、ＦＥＴ（Ｆｉｅｌｄ　Ｅｆｆｅｃｔ　Ｔｒａｎｓｉｓｔｏｒ）等のトランジスタ素子、抵抗素子またはコイル素子等の部品であってもよい。 The heat-generating component 20 that constitutes the drive circuit on the circuit board is a component that generates heat when the drive circuit operates. The heat-generating component 20 is, for example, a semiconductor element made of a semiconductor material. Examples of semiconductor elements include transistor elements such as FETs (Field Effect Transistors). In this case, the heat-generating component 20 may be a discrete semiconductor element or a packaged semiconductor element such as a control IC. For example, a plurality of semiconductor elements such as FETs are integrated in the control IC. In particular, when the semiconductor element that is the heat-generating component 20 is a power semiconductor element, the heat-generating component 20 tends to generate a large amount of heat. Note that the heat-generating component 20 is not limited to a semiconductor element, and may be a component such as a transistor element such as a FET (Field Effect Transistor), a resistor element, or a coil element.
　発熱部品２０は、表面実装（ＳＭＤ：Ｓｕｒｆａｃｅ　Ｍｏｕｎｔ　Ｄｅｖｉｃｅ）型の部品である。したがって、発熱部品２０は、配線基板１０に形成された配線に接続されたパッドまたはランドに、発熱部品２０の電極を導電性接着材（例えば半田）で接合することで配線基板１０に実装される。 The heat generating component 20 is a surface mount (SMD: Surface Mount Device) type component. Therefore, the heat-generating component 20 is mounted on the wiring board 10 by bonding the electrodes of the heat-generating component 20 to pads or lands connected to wiring formed on the wiring board 10 with a conductive adhesive (for example, solder). .
　発熱部品２０は、配線基板１０の第一の面１０ａに１つ以上実装されている。本実施の形態では、複数の発熱部品２０が配線基板１０の第一の面１０ａに実装されている。図１では、２つの発熱部品２０が配線基板１０に実装された構成が例示されている。 One or more heat generating components 20 are mounted on the first surface 10 a of the wiring board 10 . In this embodiment, a plurality of heat-generating components 20 are mounted on the first surface 10a of the wiring board 10. As shown in FIG. FIG. 1 illustrates a configuration in which two heat-generating components 20 are mounted on the wiring board 10 .
　複数の発熱部品２０は、配線基板１０に形成された配線を介して互いに電気的に接続されている。また、複数の発熱部品２０は、配線を介して配線基板１０に実装された非発熱部品にも電気的に接続されている。非発熱部品は、例えば、電解コンデンサ等である。 The plurality of heat-generating components 20 are electrically connected to each other through wiring formed on the wiring board 10 . Moreover, the plurality of heat-generating components 20 are also electrically connected to non-heat-generating components mounted on the wiring board 10 via wiring. A non-heat generating component is, for example, an electrolytic capacitor or the like.
　なお、本実施の形態において、発熱部品２０は、配線基板１０の第一の面１０ａに配置したが、放熱器３０への放熱を行わない場合、もしくは配線基板１０を介さず放熱器３０へ放熱を行う場合、配線基板１０の第二の面１０ｂに配置しても良い。また、非発熱部品に関しても、配線基板１０の第一の面１０ａに配置しても良いし、第二の面１０ｂに配置しても良い。 In the present embodiment, the heat-generating component 20 is arranged on the first surface 10a of the wiring board 10. However, in the case where heat is not radiated to the heat sink 30, or heat is not radiated to the heat sink 30 without passing through the wiring board 10, may be arranged on the second surface 10b of the wiring board 10. Also, non-heat generating components may be arranged on the first surface 10a of the wiring board 10 or may be arranged on the second surface 10b.
　配線基板１０と配線基板１０に実装された複数の部品とは、回路基板を構成している。回路基板は、例えば、太陽光発電システムにおけるパワーコンディショナに用いられる。パワーコンディショナは、太陽電池モジュールで発電された直流電力を例えば家庭で使用できる交流電力へ変換する。 The wiring board 10 and a plurality of components mounted on the wiring board 10 constitute a circuit board. Circuit boards are used, for example, in power conditioners in photovoltaic power generation systems. The power conditioner converts the DC power generated by the solar cell module into AC power that can be used at home, for example.
　複数の発熱部品２０が実装された配線基板１０を備える回路基板は、発熱部品２０で発生する熱を効率良く放熱するために、放熱器３０に取り付けられる。この場合、配線基板１０は、放熱器３０の所定の箇所に載置され、固定部材６０によって放熱器３０に固定される。本実施の形態において、配線基板１０は、放熱器３０の上面（つまり配線基板１０に対向する面）に配置される。 A circuit board including a wiring board 10 on which a plurality of heat-generating components 20 are mounted is attached to a radiator 30 in order to efficiently radiate heat generated by the heat-generating components 20 . In this case, the wiring board 10 is placed at a predetermined position on the radiator 30 and fixed to the radiator 30 by the fixing member 60 . In the present embodiment, wiring board 10 is arranged on the upper surface of radiator 30 (that is, the surface facing wiring board 10).
　また、配線基板１０には、発熱部品２０で発生する熱を配線基板１０の第二の面１０ｂ側に輸送する熱輸送部材１１が設けられている。配線基板１０に設けられた熱輸送部材１１は、例えばサーマルビアであるが、銅インレイ等であってもよい。 Further, the wiring board 10 is provided with a heat transport member 11 that transports the heat generated by the heat-generating component 20 to the second surface 10b side of the wiring board 10 . The heat transport member 11 provided on the wiring board 10 is, for example, a thermal via, but may be a copper inlay or the like.
　放熱器３０は、配線基板１０の第二の面１０ｂ側に設けられている。つまり、放熱器３０は、配線基板１０の第二の面１０ｂに対向して配置されている。具体的には、放熱器３０は、配線基板１０の下方に配置される。言い換えると、配線基板１０は、放熱器３０の上方に配置される。なお、放熱器３０の上面は、平坦面である。 The radiator 30 is provided on the side of the second surface 10b of the wiring board 10 . That is, the radiator 30 is arranged to face the second surface 10b of the wiring board 10 . Specifically, the radiator 30 is arranged below the wiring board 10 . In other words, the wiring board 10 is arranged above the radiator 30 . In addition, the upper surface of the radiator 30 is a flat surface.
　放熱器３０は、発熱部品２０で発生する熱を放熱するための放熱部材（ヒートシンク）である。また、放熱器３０は、ヒートシンクとして機能するだけではなく、配線基板１０を支持する支持部材としても機能する。したがって、放熱器３０は、金属材料または熱伝導率の高い樹脂材料によって構成された剛体であるとよい。特に、放熱器３０は、アルミニウムまたは銅等の熱伝導率の高い金属材料によって構成されているとよい。 The radiator 30 is a heat radiating member (heat sink) for radiating heat generated by the heat generating component 20 . Moreover, the radiator 30 functions not only as a heat sink but also as a supporting member that supports the wiring board 10 . Therefore, radiator 30 is preferably a rigid body made of a metal material or a resin material with high thermal conductivity. In particular, radiator 30 is preferably made of a metal material with high thermal conductivity, such as aluminum or copper.
　放熱器３０は、例えば、所定の形状に形成された金属製のダイキャスト（例えばアルミダイキャスト）であってもよいし、鉄系の金属板をプレス加工することにより所定の形状に形成された板金フレーム（例えば鋼板フレーム）であってもよいし、金属ブロック（例えば銅ブロック）であってもよい。なお、放熱器３０の放熱性を向上させるために、放熱器３０には放熱フィンが形成されていてもよい。 The radiator 30 may be, for example, a metal die-cast (for example, aluminum die-cast) formed into a predetermined shape, or may be formed into a predetermined shape by pressing an iron-based metal plate. It may be a sheet metal frame (eg steel plate frame) or a metal block (eg copper block). In order to improve the heat radiation performance of the radiator 30, the radiator 30 may be provided with heat radiation fins.
　配線基板１０と放熱器３０との間には、絶縁部材４０と熱伝導部材５０とが配置されている。絶縁部材４０と熱伝導部材５０とは、配線基板１０と放熱器３０とに挟持されている。 An insulating member 40 and a heat conducting member 50 are arranged between the wiring board 10 and the radiator 30 . The insulating member 40 and the heat conducting member 50 are sandwiched between the wiring substrate 10 and the radiator 30 .
　絶縁部材４０は、板状であり、第一の面４０ａと、第一の面４０ａに背向する第二の面４０ｂとを有する。本実施の形態において、第一の面４０ａは、絶縁部材４０の上面であり、第二の面４０ｂは、絶縁部材４０の下面である。また、熱伝導部材５０も形状は板状であり、第一の面５０ａと、第一の面５０ａに背向する第二の面５０ｂとを有する。本実施の形態において、第一の面５０ａは、熱伝導部材５０の上面であり、第二の面５０ｂは、熱伝導部材５０の下面である。 The insulating member 40 is plate-shaped and has a first surface 40a and a second surface 40b facing the first surface 40a. In this embodiment, the first surface 40 a is the upper surface of the insulating member 40 and the second surface 40 b is the lower surface of the insulating member 40 . The heat conducting member 50 also has a plate-like shape, and has a first surface 50a and a second surface 50b facing the first surface 50a. In the present embodiment, the first surface 50a is the upper surface of the heat conducting member 50, and the second surface 50b is the lower surface of the heat conducting member 50. As shown in FIG.
　絶縁部材４０および熱伝導部材５０は、配線基板１０の第二の面１０ｂ側に配置されている。具体的には、絶縁部材４０および熱伝導部材５０は、配線基板１０の下方に配置されている。つまり、絶縁部材４０および熱伝導部材５０は、放熱器３０の上方に配置されている。 The insulating member 40 and the heat conducting member 50 are arranged on the second surface 10b side of the wiring substrate 10 . Specifically, the insulating member 40 and the heat conducting member 50 are arranged below the wiring board 10 . That is, the insulating member 40 and the heat conducting member 50 are arranged above the radiator 30 .
　絶縁部材４０および熱伝導部材５０は、放熱器３０の上に、下から上に向かって、この順で配置されている。つまり、絶縁部材４０は、放熱器３０の上方に配置されており、熱伝導部材５０は、絶縁部材４０の上方に配置されている。したがって、放熱器３０と熱伝導部材５０との間に絶縁部材４０が挿入されており、絶縁部材４０と配線基板１０との間に熱伝導部材５０が挿入されている。具体的には、熱伝導部材５０は、配線基板１０と絶縁部材４０とに挟持されている。 The insulating member 40 and the heat conducting member 50 are arranged on the radiator 30 in this order from bottom to top. That is, the insulating member 40 is arranged above the radiator 30 , and the heat conducting member 50 is arranged above the insulating member 40 . Therefore, the insulating member 40 is inserted between the radiator 30 and the heat conducting member 50 , and the heat conducting member 50 is inserted between the insulating member 40 and the wiring substrate 10 . Specifically, the heat conducting member 50 is sandwiched between the wiring board 10 and the insulating member 40 .
　本実施の形態において、絶縁部材４０は、放熱器３０の上面に載置されており、熱伝導部材５０は、絶縁部材４０の第一の面４０ａに載置されている。したがって、絶縁部材４０の第二の面４０ｂは、放熱器３０の上面に面接触しており、絶縁部材４０の第一の面４０ａは、熱伝導部材５０の第二の面５０ｂに面接触している。また、熱伝導部材５０の第二の面５０ｂは、絶縁部材４０の第一の面４０ａに面接触しており、熱伝導部材５０の第一の面５０ａは、配線基板１０の第二の面１０ｂに面接触している。つまり、絶縁部材４０は、放熱器３０と熱伝導部材５０との両方に接しており、また、熱伝導部材５０は、絶縁部材４０と配線基板１０との両方に接触している。なお、配線基板１０に当接する熱伝導部材５０は、配線基板１０に設けられた熱輸送部材１１にも当接している。 In the present embodiment, the insulating member 40 is placed on the upper surface of the radiator 30 and the heat conducting member 50 is placed on the first surface 40a of the insulating member 40. As shown in FIG. Therefore, the second surface 40b of the insulating member 40 is in surface contact with the upper surface of the radiator 30, and the first surface 40a of the insulating member 40 is in surface contact with the second surface 50b of the heat conducting member 50. ing. The second surface 50b of the heat conducting member 50 is in surface contact with the first surface 40a of the insulating member 40, and the first surface 50a of the heat conducting member 50 is in contact with the second surface of the wiring board 10. It is in surface contact with 10b. That is, the insulating member 40 is in contact with both the radiator 30 and the heat conducting member 50 , and the heat conducting member 50 is in contact with both the insulating member 40 and the wiring board 10 . The heat conducting member 50 that contacts the wiring board 10 also contacts the heat transporting member 11 provided on the wiring board 10 .
　絶縁部材４０は、絶縁性樹脂材料またはセラミック等の絶縁材料によって構成されている。絶縁部材４０は、例えば、厚みが一定の絶縁板である。また、絶縁部材４０は、剛性の高いリジッド基板であってもよいし、フレキシブル性を有するフレキシブル基板であってもよい。 The insulating member 40 is made of an insulating material such as an insulating resin material or ceramic. The insulating member 40 is, for example, an insulating plate with a constant thickness. Also, the insulating member 40 may be a rigid substrate having high rigidity, or may be a flexible substrate having flexibility.
　絶縁部材４０は、熱伝導率が高い絶縁材料によって構成されているとよい。具体的には、絶縁部材４０の熱伝導率は、配線基板１０の基板材料の熱伝導率よりも高くなっているとよい。本実施の形態では、配線基板１０の基板材料を樹脂材料にしているので、絶縁部材４０の材料をセラミックにしている。つまり、絶縁部材４０は、熱伝導率が高いセラミックからなるセラミック基板である。絶縁部材４０を構成するセラミックとしては、窒化アルミニウム（ＡｌＮ）、アルミナ（Ａｌ２Ｏ３）または多結晶の炭化ケイ素（ＳｉＣ）等を用いることができる。 The insulating member 40 is preferably made of an insulating material with high thermal conductivity. Specifically, the thermal conductivity of the insulating member 40 is preferably higher than the thermal conductivity of the substrate material of the wiring board 10 . In the present embodiment, since the substrate material of the wiring board 10 is a resin material, the material of the insulating member 40 is ceramic. That is, the insulating member 40 is a ceramic substrate made of ceramic with high thermal conductivity. Aluminum nitride (AlN), alumina (Al 2 O 3 ), polycrystalline silicon carbide (SiC), or the like can be used as the ceramic constituting the insulating member 40 .
　なお、絶縁部材４０は、セラミック基板ではなく、絶縁性樹脂材料からなる樹脂シートであってもよい。この場合、絶縁部材４０としては、ポリイミドからなるポリイミドテープを用いることができる。絶縁部材４０は、粘着性を有していてもよいし、粘着性を有していなくてもよい。 Note that the insulating member 40 may be a resin sheet made of an insulating resin material instead of the ceramic substrate. In this case, a polyimide tape made of polyimide can be used as the insulating member 40 . The insulating member 40 may or may not have adhesiveness.
　絶縁部材４０の上の熱伝導部材５０は、熱伝導性に優れた熱界面材料（ＴＩＭ）であり、熱伝導率が高い絶縁材料によって構成されている。本実施の形態において、熱伝導部材５０は、絶縁性樹脂材料によって構成されている。一例として、熱伝導部材５０は、放熱グリスである。放熱グリスとしては、例えばシリコーンオイル等を用いることができる。これにより、配線基板１０と絶縁部材４０との界面の隙間を無くして配線基板１０と絶縁部材４０との密着性を向上させることができる。特に、放熱グリスは流体であるので、配線基板１０と絶縁部材４０との間の隙間が微小で凹凸を有する場合であってもその隙間に放熱グリスが容易に入り込むので、配線基板１０と絶縁部材４０との密着性を効果的に向上させることができる。 The thermally conductive member 50 on the insulating member 40 is a thermal interface material (TIM) with excellent thermal conductivity, and is made of an insulating material with high thermal conductivity. In this embodiment, the heat conducting member 50 is made of an insulating resin material. As an example, the heat conducting member 50 is heat dissipation grease. For example, silicone oil or the like can be used as the heat dissipation grease. As a result, the gap at the interface between the wiring board 10 and the insulating member 40 can be eliminated, and the adhesion between the wiring board 10 and the insulating member 40 can be improved. In particular, since the heat dissipating grease is a fluid, even if the gap between the wiring board 10 and the insulating member 40 is minute and has irregularities, the heat dissipating grease easily enters into the gap. Adhesion with 40 can be effectively improved.
　なお、熱伝導部材５０は、厚さが一定の平板状の熱伝導シート（放熱シート）であってもよい。また、熱伝導部材５０は、粘着性を有していてもよいし、粘着性を有していなくてもよい。 Note that the thermally conductive member 50 may be a flat plate-shaped thermally conductive sheet (heat radiation sheet) with a constant thickness. Moreover, the heat conducting member 50 may or may not have adhesiveness.
　熱伝導部材５０が熱伝導シートである場合、熱伝導部材５０は柔軟性を有するゴム系材料によって構成されているとよい。また、熱伝導シートである熱伝導部材５０は、粘土質で弾力性を有するものであってもよい。このような構成にすることで、熱伝導部材５０と配線基板１０および絶縁部材４０との密着性が向上するので、熱伝導部材５０と配線基板１０および絶縁部材４０との界面の隙間を無くすことができる。これにより、配線基板１０と絶縁部材４０との間の熱抵抗を低くすることができるので、発熱部品２０で発生する熱を絶縁部材４０に効率良く伝導させることができる。なお、熱伝導部材５０として熱伝導シートを用いる場合であっても、熱伝導部材５０と配線基板１０との間および／または熱伝導部材５０と絶縁部材４０との間に放熱グリスを塗布してもよい。 When the thermally conductive member 50 is a thermally conductive sheet, the thermally conductive member 50 is preferably made of a flexible rubber-based material. Moreover, the thermally conductive member 50, which is a thermally conductive sheet, may be made of clay and have elasticity. By adopting such a configuration, the adhesion between the heat conducting member 50 and the wiring board 10 and the insulating member 40 is improved, so the interfacial gap between the heat conducting member 50 and the wiring board 10 and the insulating member 40 should be eliminated. can be done. As a result, the heat resistance between the wiring board 10 and the insulating member 40 can be reduced, so that the heat generated by the heat-generating component 20 can be efficiently conducted to the insulating member 40 . Even when a thermally conductive sheet is used as the thermally conductive member 50, heat dissipation grease should be applied between the thermally conductive member 50 and the wiring board 10 and/or between the thermally conductive member 50 and the insulating member 40. good too.
　また、本実施の形態において、熱伝導部材５０は、複数の発熱部品２０の各々に対向するように複数設けられている。複数の熱伝導部材５０は、絶縁部材４０の上に、二次元状に並べられている。複数の発熱部品２０の各々に対向する複数の熱伝導部材５０は、互いに分離して配置されている。したがって、隣り合う２つの熱伝導部材５０の間には隙間（空気層）が存在しており、配線基板１０と絶縁部材４０との間には空気層が存在している。なお、複数の熱伝導部材５０は複数の発熱部品２０の直下に配置されており、一対一に対応している。 Also, in the present embodiment, a plurality of heat conducting members 50 are provided so as to face each of the plurality of heat generating components 20 . A plurality of heat conducting members 50 are arranged two-dimensionally on the insulating member 40 . A plurality of heat conducting members 50 facing each of the plurality of heat generating components 20 are arranged separately from each other. Therefore, a gap (air layer) exists between two adjacent heat conducting members 50 , and an air layer exists between the wiring substrate 10 and the insulating member 40 . In addition, the plurality of heat conducting members 50 are arranged directly under the plurality of heat generating components 20 and correspond to each other one by one.
　このように、熱伝導部材５０は、配線基板１０と絶縁部材４０との間の領域の一部に配置されている。したがって、実装構造体１を鳥観したときに、熱伝導部材５０の面積は、絶縁部材４０の面積よりも小さくなっている。具体的には、熱伝導部材５０の配線基板１０側の面積Ｓ５０ａ（以下、「第一の面積Ｓ５０ａ」とも記載する）、および、熱伝導部材５０の絶縁部材４０側の面積Ｓ５０ｂ（以下、「第二の面積Ｓ５０ｂ」とも記載する）は、絶縁部材４０の放熱器３０側の面積Ｓ４０ｂ（以下、「第三の面積Ｓ４０ｂ」とも記載する）よりも小さくなっている（Ｓ５０ａ＜Ｓ４０ｂ、Ｓ５０ｂ＜Ｓ４０ｂ）。 Thus, the heat conducting member 50 is arranged in a part of the region between the wiring substrate 10 and the insulating member 40. As shown in FIG. Therefore, when the mounting structure 1 is viewed from above, the area of the heat conducting member 50 is smaller than the area of the insulating member 40 . Specifically, the area S50a of the heat conducting member 50 on the wiring board 10 side (hereinafter also referred to as "first area S50a") and the area S50b of the heat conducting member 50 on the insulating member 40 side (hereinafter referred to as " The second area S50b") is smaller than the area S40b of the insulating member 40 on the radiator 30 side (hereinafter also referred to as the "third area S40b") (S50a<S40b, S50b< S40b).
　本実施の形態において、第一の面積Ｓ５０ａは、熱伝導部材５０の第一の面５０ａが配線基板１０の第二の面１０ｂに当接する部分の面積である。また、第二の面積Ｓ５０ｂは、熱伝導部材５０の第二の面５０ｂが絶縁部材４０の第一の面４０ａに当接する部分の面積である。また、第三の面積Ｓ４０ｂは、絶縁部材４０の第二の面４０ｂが放熱器３０の上面に当接する部分の面積である。なお、本実施の形態において、第一の面積Ｓ５０ａと第二の面積Ｓ５０ｂとは同じであるが（Ｓ５０ａ＝Ｓ５０ｂ）、これに限らない。 In the present embodiment, the first area S50a is the area of the portion where the first surface 50a of the heat conducting member 50 contacts the second surface 10b of the wiring board 10. As shown in FIG. The second area S50b is the area of the portion where the second surface 50b of the heat conducting member 50 contacts the first surface 40a of the insulating member 40. As shown in FIG. The third area S40b is the area of the portion where the second surface 40b of the insulating member 40 contacts the upper surface of the radiator 30. As shown in FIG. In addition, in the present embodiment, the first area S50a and the second area S50b are the same (S50a=S50b), but the present invention is not limited to this.
　また、本実施の形態では、配線基板１０と絶縁部材４０との間には熱伝導部材５０が複数配置されているが、複数の熱伝導部材５０の各々が、Ｓ５０ａ＜Ｓ４０ｂの関係式とＳ５０ｂ＜Ｓ４０ｂの関係式とを満たしている。 In addition, in the present embodiment, a plurality of heat conducting members 50 are arranged between the wiring substrate 10 and the insulating member 40. Each of the plurality of heat conducting members 50 has a relational expression of S50a<S40b and <The relational expression of S40b is satisfied.
　さらに、複数の熱伝導部材５０の各々が、Ｓ５０ａ＜Ｓ４０ｂの関係式とＳ５０ｂ＜Ｓ４０ｂの関係式とを満たしているだけではなく、複数の熱伝導部材５０の面積の合計が、Ｓ５０ａ＜Ｓ４０ｂの関係式とＳ５０ｂ＜Ｓ４０ｂの関係式とを満たしている。つまり、第一の面積Ｓ５０ａを、複数の熱伝導部材５０の配線基板１０側の面積の合計とし、第二の面積Ｓ５０ｂを、複数の熱伝導部材５０の絶縁部材４０側の面積の合計とした場合であっても、Ｓ５０ａ＜Ｓ４０ｂの関係式とＳ５０ｂ＜Ｓ４０ｂの関係式とを満たしている。 Furthermore, each of the plurality of heat conducting members 50 not only satisfies the relational expressions of S50a<S40b and S50b<S40b, but the total area of the plurality of heat conducting members 50 satisfies the relation of S50a<S40b. It satisfies the relational expression and the relational expression of S50b<S40b. That is, the first area S50a is the sum of the areas of the plurality of heat conducting members 50 on the wiring substrate 10 side, and the second area S50b is the sum of the areas of the plurality of heat conducting members 50 on the insulating member 40 side. Even in this case, the relational expressions of S50a<S40b and S50b<S40b are satisfied.
　なお、実装構造体１においては、Ｓ５０ａ＜Ｓ４０ｂの関係式とＳ５０ｂ＜Ｓ４０ｂの関係式とは、複数の熱伝導部材５０の面積を合計した場合に必ずしも満たしている必要はなく、少なくとも複数の熱伝導部材５０の各々の面積が、Ｓ５０ａ＜Ｓ４０ｂの関係式とＳ５０ｂ＜Ｓ４０ｂの関係式とを満たしていればよい。 In the mounting structure 1, the relational expression S50a<S40b and the relational expression S50b<S40b do not necessarily have to be satisfied when the total area of the plurality of heat conducting members 50 is satisfied. It is sufficient that the area of each of the conductive members 50 satisfies the relational expression of S50a<S40b and the relational expression of S50b<S40b.
　また、本実施の形態において、第一の面積Ｓ５０ａおよび第二の面積Ｓ５０ｂは、発熱部品２０が配線基板１０に当接する面積よりも、配線基板１０の厚さ分以上大きくなっているとよい。 Also, in the present embodiment, the first area S50a and the second area S50b are preferably larger than the area where the heat-generating component 20 contacts the wiring board 10 by the thickness of the wiring board 10 or more.
　配線基板１０は、固定部材６０によって放熱器３０に固定されている。固定部材６０としては、ネジ等の締結部材を用いることができる。本実施の形態において、固定部材６０は、ネジ頭とネジ軸とを有するネジであり、配線基板１０は、ネジによって放熱器３０にねじ止めされている。この場合、配線基板１０に設けられた貫通孔にネジのネジ軸を挿通して、放熱器３０に設けられたネジ穴にネジ軸を捻じ込むことで、配線基板１０を放熱器３０に取り付けることができる。この場合、ネジのネジ頭は、配線基板１０の第一の面１０ａに当接して係止している。なお、本実施の形態では、複数のネジによって配線基板１０を放熱器３０に固定している。 The wiring board 10 is fixed to the radiator 30 with a fixing member 60 . A fastening member such as a screw can be used as the fixing member 60 . In the present embodiment, fixing member 60 is a screw having a screw head and a screw shaft, and wiring board 10 is screwed to radiator 30 by the screw. In this case, the wiring board 10 is attached to the radiator 30 by inserting the screw shaft of the screw through the through hole provided in the wiring board 10 and screwing the screw shaft into the screw hole provided in the radiator 30 . can be done. In this case, the screw head of the screw abuts against the first surface 10a of the wiring board 10 and is locked. In this embodiment, wiring board 10 is fixed to radiator 30 with a plurality of screws.
　また、本実施の形態では、配線基板１０と放熱器３０との間に熱伝導部材５０と絶縁部材４０とが挿入されているので、固定部材６０によって配線基板１０を放熱器３０に固定することで、熱伝導部材５０および絶縁部材４０も放熱器３０に固定される。 Moreover, in the present embodiment, since the heat conducting member 50 and the insulating member 40 are inserted between the wiring board 10 and the radiator 30 , the wiring board 10 can be fixed to the radiator 30 by the fixing member 60 . , the heat conducting member 50 and the insulating member 40 are also fixed to the radiator 30 .
　具体的には、配線基板１０と熱伝導部材５０と絶縁部材４０と放熱器３０とは、固定部材６０であるネジの締め付け力によって共締めされて互いに固定されている。したがって、配線基板１０と放熱器３０との間に挿入された熱伝導部材５０と絶縁部材４０とは、配線基板１０と放熱器３０とに押さえ込まれることで放熱器３０に押さえ付けられて固定されている。このように、固定部材６０による締め付け力によって配線基板１０を放熱器３０に押さえ付けて固定することで、熱伝導部材５０と配線基板１０および絶縁部材４０との密着性を向上させることができる。したがって、発熱部品２０で発生する熱を熱伝導部材５０および絶縁部材４０を介して放熱器３０に効率良く伝導させることができる。 Specifically, the wiring board 10, the heat conducting member 50, the insulating member 40, and the radiator 30 are fastened together by the tightening force of the screws, which are the fixing members 60, and fixed to each other. Therefore, the heat conducting member 50 and the insulating member 40 inserted between the wiring board 10 and the heat sink 30 are pressed by the wiring board 10 and the heat sink 30 to be pressed and fixed to the heat sink 30 . ing. By fixing the wiring board 10 to the radiator 30 by pressing it with the tightening force of the fixing member 60 in this way, the adhesion between the heat conducting member 50 and the wiring board 10 and the insulating member 40 can be improved. Therefore, the heat generated by the heat-generating component 20 can be efficiently conducted to the radiator 30 via the heat-conducting member 50 and the insulating member 40 .
　ここで、放熱器３０の固定部材６０に対応する部分にネジを挿通することができるスペーサーが設けられていても良い。このようにすると、固定部材６０であるネジの締め付け力によって配線基板１０や放熱器３０がたわんでしまう可能性を低くすることができる。スペーサーは、金属製であってもよいし、樹脂製であってもよい。また、放熱器３０に設けられるネジ穴部分は、配線基板１０や放熱器３０のたわみを無くす程度に盛り上がって形成されていても良い。 Here, a spacer into which a screw can be inserted may be provided in a portion of the radiator 30 corresponding to the fixing member 60 . By doing so, it is possible to reduce the possibility that the wiring board 10 and the radiator 30 will be bent due to the tightening force of the screw that is the fixing member 60 . The spacer may be made of metal or resin. Moreover, the screw hole portion provided in the radiator 30 may be formed so as to swell to such an extent that the wiring substrate 10 and the radiator 30 are not bent.
　なお、絶縁部材４０および熱伝導部材５０には、固定部材６０であるネジが挿通されていないが、絶縁部材４０および熱伝導部材５０に、ネジが挿通されてもよい。この場合、絶縁部材４０および熱伝導部材５０の各々にネジのネジ軸が挿通される挿通孔を設けておき、配線基板１０の挿通孔と絶縁部材４０と熱伝導部材５０の各々の挿通孔とにネジのネジ軸を挿通してネジ軸を放熱器３０のネジ穴に捻じ込んでもよい。 Although the fixing member 60 is not inserted through the insulating member 40 and the thermally conductive member 50 , a screw may be inserted through the insulating member 40 and the thermally conductive member 50 . In this case, each of the insulating member 40 and the thermally conductive member 50 is provided with an insertion hole through which the screw shaft of the screw is inserted. The threaded shaft of the screw may be inserted into the heat sink 30 and screwed into the threaded hole of the radiator 30 .
　次に、本実施の形態に係る実装構造体１の効果について、比較例１、２の実装構造体と比較しながら、本実施の形態に係る実装構造体１を得るに至った経緯も含めて説明する。 Next, the effect of the mounting structure 1 according to the present embodiment will be compared with the mounting structures of Comparative Examples 1 and 2, including the background to obtaining the mounting structure 1 according to the present embodiment. explain.
　図５は、比較例１の実装構造体１Ｘの断面図であり、図６は、比較例２の実装構造体１Ｙの断面図である。 5 is a cross-sectional view of a mounting structure 1X of Comparative Example 1, and FIG. 6 is a cross-sectional view of a mounting structure 1Y of Comparative Example 2. FIG.
　図５に示すように、比較例１の実装構造体１Ｘでは、配線基板１０に実装された発熱部品２０で発生する熱を放熱器３０に効率良く伝導させるために、配線基板１０と放熱器３０との間に挿入された熱伝導部材５０Ｘは、配線基板１０と放熱器３０との間の全ての領域にわたって均一に配置されている。 As shown in FIG. 5, in the mounting structure 1X of Comparative Example 1, the wiring substrate 10 and the radiator 30 are arranged in order to efficiently conduct the heat generated by the heat-generating component 20 mounted on the wiring substrate 10 to the radiator 30. are uniformly arranged over the entire area between the wiring board 10 and the radiator 30 .
　しかしながら、比較例の実装構造体１Ｘでは、固定部材６０としてネジを用いて配線基板１０をネジで放熱器３０に取り付けると、ネジの締め付けによって押さえ付けられて配線基板１０がたわんでしまうことがある。この結果、配線基板１０と放熱器３０との間に隙間（空気層）が生じることがある。例えば、図５に示すように、配線基板１０と熱伝導部材５０Ｘとの間に隙間が生じることがある。また、図示されていないが、熱伝導部材５０Ｘと放熱器３０との間に隙間が生じることもある。このように、配線基板１０がたわむと、配線基板１０と放熱器３０との密着性が低下する。特に、配線基板１０がＣＥＭ－３やＦＲ－４等の樹脂基板であると、樹脂基板は、セラミック基板やメタルベース基板と比べて剛性が低いので、ネジの締め付けによって配線基板１０がたわみやすくなる。 However, in the mounting structure 1X of the comparative example, when the wiring board 10 is attached to the heat sink 30 with screws as the fixing members 60, the wiring board 10 may be bent by being pressed by the tightening of the screws. . As a result, a gap (air layer) may occur between the wiring board 10 and the radiator 30 . For example, as shown in FIG. 5, a gap may occur between the wiring board 10 and the heat conducting member 50X. Moreover, although not shown, a gap may occur between the heat conducting member 50X and the radiator 30 . When the wiring board 10 bends in this way, the adhesion between the wiring board 10 and the radiator 30 is lowered. In particular, if the wiring board 10 is a resin board such as CEM-3 or FR-4, the resin board has lower rigidity than a ceramic board or a metal base board. .
　そして、配線基板１０と放熱器３０との間に隙間（空気層）が生じて配線基板１０と放熱器３０との密着性が低下すると、配線基板１０と放熱器３０との間の熱抵抗が高くなり、発熱部品２０で発生する熱を効率良く放熱器３０に伝導させることができなくなるおそれがある。つまり、回路基板としての放熱性が低下する。 When a gap (air layer) is generated between the wiring board 10 and the radiator 30 and the adhesion between the wiring board 10 and the radiator 30 is lowered, the thermal resistance between the wiring board 10 and the radiator 30 increases. As a result, the heat generated by the heat-generating component 20 may not be efficiently conducted to the radiator 30 . That is, the heat dissipation performance of the circuit board is lowered.
　そこで、配線基板１０と放熱器３０との間の全領域に熱伝導部材５０Ｘを均一に配置するのではなく、図６に示される実装構造体１Ｙのように、配線基板１０と放熱器３０との間に熱伝導部材５０Ｙを部分的に配置することが考えられる。例えば、熱伝導部材５０Ｙを複数に分割して、複数の熱伝導部材５０Ｙを互いに分離させて配置することが考えられる。 Therefore, instead of arranging the thermally conductive member 50X uniformly over the entire area between the wiring board 10 and the heat sink 30, the wiring board 10 and the heat sink 30 are arranged as in the mounting structure 1Y shown in FIG. It is conceivable to partially dispose the heat conducting member 50Y between. For example, it is conceivable to divide the heat conducting member 50Y into a plurality of pieces and dispose the plurality of heat conducting members 50Y separately from each other.
　しかしながら、図６に示すように、配線基板１０と放熱器３０との間に複数の熱伝導部材５０Ｙを並べて配置すると、金属製の放熱器３０と配線基板１０との間に隙間が生じることになり、配線基板１０に絶縁破壊が生じるおそれがある。特に、配線基板１０として両面配線基板を用いる場合には、配線基板１０の放熱器３０側の面にも配線が形成されているので、配線基板１０と放熱器３０とが近接し、絶縁破壊が生じやすくなる。 However, when a plurality of heat conducting members 50Y are arranged side by side between the wiring board 10 and the radiator 30 as shown in FIG. As a result, dielectric breakdown may occur in the wiring board 10 . In particular, when a double-sided wiring board is used as the wiring board 10, since wiring is also formed on the surface of the wiring board 10 facing the radiator 30, the wiring board 10 and the radiator 30 are brought close to each other, and dielectric breakdown occurs. more likely to occur.
　これに対して、本実施の形態に係る実装構造体１では、配線基板１０と放熱器３０との間に絶縁部材４０が設けられているとともに、配線基板１０と絶縁部材４０との間に熱伝導部材５０が設けられている。そして、熱伝導部材５０の配線基板１０側の面積Ｓ５０ａ、および、熱伝導部材５０の絶縁部材４０側の面積Ｓ５０ｂは、絶縁部材４０の放熱器３０側の面積Ｓ４０ｂよりも小さくなっている。 On the other hand, in mounting structure 1 according to the present embodiment, insulating member 40 is provided between wiring board 10 and radiator 30 , and heat is generated between wiring board 10 and insulating member 40 . A conducting member 50 is provided. The area S50a of the heat conducting member 50 on the wiring board 10 side and the area S50b of the heat conducting member 50 on the insulating member 40 side are smaller than the area S40b of the insulating member 40 on the radiator 30 side.
　つまり、本実施の形態に係る実装構造体１では、配線基板１０と放熱器３０との間に絶縁部材４０を挿入した上で、配線基板１０と絶縁部材４０との間の領域に熱伝導部材５０を部分的に配置している。 In other words, in the mounting structure 1 according to the present embodiment, the insulating member 40 is inserted between the wiring substrate 10 and the radiator 30, and then the heat conducting member is inserted in the region between the wiring substrate 10 and the insulating member 40. 50 is partially arranged.
　この構成により、配線基板１０と放熱器３０との間に熱伝導部材５０と絶縁部材４０とを挟んで、ネジ等の固定部材６０によって配線基板１０を押さえ付けて放熱器３０に固定した場合であっても、配線基板１０と絶縁部材４０との間に熱伝導部材５０を部分的に配置しているので配線基板１０がたわんだとしても発熱部品２０直下の配線基板１０と放熱器３０との間に隙間が生じることを抑制することができる。つまり、発熱部品２０直下の配線基板１０と放熱器３０との密着性を向上させることができる。これにより、発熱部品２０で発生する熱を効率良く放熱器３０へと伝導して放熱することができる。 With this configuration, the heat conducting member 50 and the insulating member 40 are sandwiched between the wiring board 10 and the radiator 30, and the wiring board 10 is pressed down by the fixing member 60 such as a screw to be fixed to the radiator 30. Even if there is, the heat conducting member 50 is partially arranged between the wiring board 10 and the insulating member 40, so even if the wiring board 10 is bent, the wiring board 10 directly below the heat generating component 20 and the radiator 30 It is possible to suppress the formation of a gap between them. In other words, it is possible to improve the adhesion between the wiring substrate 10 and the radiator 30 immediately below the heat-generating component 20 . As a result, the heat generated by the heat-generating component 20 can be efficiently conducted to the radiator 30 and radiated.
　しかも、本実施の形態に係る実装構造体１においては、配線基板１０と放熱器３０との間に、熱伝導部材５０よりも面積が大きい絶縁部材４０が挿入されている。これにより、配線基板１０と絶縁部材４０との間に熱伝導部材５０を部分的に配置したとしても、配線基板１０に絶縁破壊が生じることを抑制することができる。 Moreover, in the mounting structure 1 according to the present embodiment, the insulating member 40 having a larger area than the heat conducting member 50 is inserted between the wiring board 10 and the radiator 30 . Thus, even if the heat conducting member 50 is partially arranged between the wiring board 10 and the insulating member 40, the occurrence of dielectric breakdown in the wiring board 10 can be suppressed.
　以上、本実施の形態に係る実装構造体１によれば、配線基板１０に絶縁破壊が発生することを抑制しつつ、配線基板１０に実装された発熱部品２０で発生する熱を効率良く放熱することができる。 As described above, according to the mounting structure 1 according to the present embodiment, the heat generated by the heat-generating component 20 mounted on the wiring board 10 is efficiently radiated while suppressing the occurrence of dielectric breakdown in the wiring board 10. be able to.
　また、本実施の形態に係る実装構造体１において、熱伝導部材５０は、複数の発熱部品２０の各々に対向するように且つ互いに分離して複数設けられている。具体的には、配線基板１０を介して各発熱部品２０の直下に熱伝導部材５０が配置されている。 Also, in the mounting structure 1 according to the present embodiment, a plurality of heat conducting members 50 are provided so as to face each of the plurality of heat generating components 20 and are separated from each other. Specifically, the heat conducting member 50 is arranged directly below each heat generating component 20 via the wiring board 10 .
　この構成により、複数の熱伝導部材５０が分離して配置されている場合であっても、複数の発熱部品２０の各々で発生する熱を効率良く熱伝導部材５０に伝導させることができる。したがって、複数の発熱部品２０の各々で発生する熱を効率良く放熱させることができる。 With this configuration, even when the plurality of heat-conducting members 50 are arranged separately, the heat generated by each of the plurality of heat-generating components 20 can be efficiently conducted to the heat-conducting members 50 . Therefore, the heat generated by each of the plurality of heat-generating components 20 can be efficiently radiated.
　また、本実施の形態に係る実装構造体１において、絶縁部材４０の熱伝導率は、配線基板１０の基板材料の熱伝導率よりも高くなっている。 Also, in the mounting structure 1 according to the present embodiment, the thermal conductivity of the insulating member 40 is higher than the thermal conductivity of the substrate material of the wiring board 10 .
　この構成により、発熱部品２０で発生する熱を絶縁部材４０側へと効率良く伝導させることができる。したがって、発熱部品２０で発生する熱を効率良く放熱させることができる。 With this configuration, the heat generated by the heat-generating component 20 can be efficiently conducted to the insulating member 40 side. Therefore, the heat generated by the heat-generating component 20 can be efficiently dissipated.
　また、本実施の形態に係る実装構造体１において、発熱部品２０で発生する熱を配線基板１０の第二の面１０ｂ側に輸送する熱輸送部材１１を備えている。具体的には、熱輸送部材１１は、配線基板１０に設けられている。この場合、熱伝導部材５０は、熱輸送部材１１に当接しているとよい。 Moreover, the mounting structure 1 according to the present embodiment includes the heat transport member 11 that transports the heat generated by the heat-generating component 20 to the second surface 10b side of the wiring board 10 . Specifically, the heat transport member 11 is provided on the wiring board 10 . In this case, the heat-conducting member 50 is preferably in contact with the heat-transporting member 11 .
　この構成により、発熱部品２０で発生する熱を配線基板１０を介して熱伝導部材５０に効率良く伝導させることができる。 With this configuration, the heat generated by the heat-generating component 20 can be efficiently conducted to the heat-conducting member 50 through the wiring board 10 .
　なお、熱伝導部材５０が熱輸送部材１１に当接する面積は、少なくとも、配線基板１０における熱輸送部材１１が設けられた部分の面積よりも、配線基板１０の厚さ分以上大きくなっているとよい。 It should be noted that the area where the heat conducting member 50 abuts against the heat transporting member 11 is at least larger than the area of the portion of the wiring board 10 where the heat transporting member 11 is provided by at least the thickness of the wiring board 10 . good.
　（実施の形態１の変形例）
　上記実施の形態１に係る実装構造体１では、隣り合う２つの熱伝導部材５０の間には隙間が存在していたが、これに限らない。 (Modification of Embodiment 1)
In the mounting structure 1 according to Embodiment 1, there is a gap between the two adjacent heat conducting members 50, but the gap is not limited to this.
　具体的には、図２に示される変形例に係る実装構造体１Ａのように、隣り合う２つの熱伝導部材５０の間に隙間が存在せずに、隣り合う２つの熱伝導部材５０同士が接触していてもよい。 Specifically, like the mounting structure 1A according to the modification shown in FIG. may be in contact.
　なお、本変形例に係る実装構造体１Ａは、隣り合う２つの熱伝導部材５０同士が接触していること以外については、上記実施の形態１に係る実装構造体１と同じ構成である。この場合、図２に示すように、本変形例に係る実装構造体１Ａでは、図１に示される実装構造体１と比べて、複数の熱伝導部材５０の各々の面積が大きくなっているが、本変形例においても、各熱伝導部材５０の面積および複数の熱伝導部材５０の合計の面積は、Ｓ５０ａ＜Ｓ４０ｂの関係式とＳ５０ｂ＜Ｓ４０ｂの関係式とを満たしている。 Note that the mounting structure 1A according to this modification has the same configuration as the mounting structure 1 according to the first embodiment except that two adjacent heat conducting members 50 are in contact with each other. In this case, as shown in FIG. 2, in the mounting structure 1A according to this modified example, the area of each of the plurality of heat conducting members 50 is larger than in the mounting structure 1 shown in FIG. Also in this modification, the area of each heat conducting member 50 and the total area of the plurality of heat conducting members 50 satisfy the relational expressions of S50a<S40b and S50b<S40b.
　したがって、本変形例に係る実装構造体１Ａにおいても、上記実施の形態１に係る実装構造体１と同様の効果を奏する。 Therefore, the mounting structure 1A according to this modified example also has the same effects as the mounting structure 1 according to the first embodiment.
　（実施の形態２）
　次に、実施の形態２に係る実装構造体２について、図３を用いて説明する。図３は、実施の形態２に係る実装構造体２の断面図である。 (Embodiment 2)
Next, a mounting structure 2 according to Embodiment 2 will be described with reference to FIG. FIG. 3 is a cross-sectional view of the mounting structure 2 according to the second embodiment.
　図３に示すように、本実施の形態に係る実装構造体２は、上記実施の形態１に係る実装構造体１において、熱伝導部材５０（第一の熱伝導部材）とは別に、さらに、熱伝導部材７０（第二の熱伝導部材）を備える構成になっている。 As shown in FIG. 3, the mounting structure 2 according to the present embodiment is the mounting structure 1 according to the first embodiment, in addition to the thermally conductive member 50 (first thermally conductive member). It is configured to include a thermally conductive member 70 (second thermally conductive member).
　図３に示すように、熱伝導部材７０は、絶縁部材４０と放熱器３０との間に配置されている。熱伝導部材７０は、絶縁部材４０の下方に配置されている。一方、絶縁部材４０の上方には、上記実施の形態１と同様に、熱伝導部材５０が配置されている。したがって、絶縁部材４０は、熱伝導部材５０と熱伝導部材７０とに挟まれている。 As shown in FIG. 3 , the heat conducting member 70 is arranged between the insulating member 40 and the radiator 30 . The heat conducting member 70 is arranged below the insulating member 40 . On the other hand, above the insulating member 40, the heat conducting member 50 is arranged as in the first embodiment. Therefore, the insulating member 40 is sandwiched between the heat conducting member 50 and the heat conducting member 70 .
　本実施の形態において、熱伝導部材７０は、放熱器３０の上面に載置されている。具体的には、熱伝導部材７０の下面は、放熱器３０の上面に面接触している。したがって、絶縁部材４０については、上記実施の形態１とは異なり、放熱器３０に接触していない。また、熱伝導部材７０の上面は、絶縁部材４０の第二の面４０ｂ（下面）に面接触している。 In this embodiment, the heat conducting member 70 is placed on the top surface of the radiator 30 . Specifically, the lower surface of the heat conducting member 70 is in surface contact with the upper surface of the radiator 30 . Therefore, the insulating member 40 is not in contact with the radiator 30 unlike the first embodiment. Also, the upper surface of the heat conducting member 70 is in surface contact with the second surface 40 b (lower surface) of the insulating member 40 .
　熱伝導部材７０は、熱伝導部材５０と同様に、熱伝導性に優れた熱界面材料（ＴＩＭ）であり、熱伝導率が高い絶縁材料によって構成されている。例えば、熱伝導部材７０は、絶縁性樹脂材料によって構成されている。一例として、熱伝導部材７０は、放熱グリスである。 The thermally conductive member 70 is a thermal interface material (TIM) with excellent thermal conductivity, similar to the thermally conductive member 50, and is made of an insulating material with high thermal conductivity. For example, the heat conducting member 70 is made of an insulating resin material. As an example, the heat conducting member 70 is heat dissipation grease.
　熱伝導部材７０は、熱伝導部材５０と同じ材料によって構成されたものを用いてもよいし、熱伝導部材５０とは異なる材料によって構成されたものを用いてもよい。また、熱伝導部材７０の厚さは、熱伝導部材５０の厚さと同じであってもよいし、熱伝導部材５０の厚さと異なっていてもよい。 The heat conducting member 70 may be made of the same material as the heat conducting member 50, or may be made of a material different from that of the heat conducting member 50. Moreover, the thickness of the heat-conducting member 70 may be the same as the thickness of the heat-conducting member 50 or may be different from the thickness of the heat-conducting member 50 .
　実装構造体２を鳥観したときに、熱伝導部材７０の面積は、絶縁部材４０の面積以上になっている。つまり、熱伝導部材７０の放熱器３０側の面積および熱伝導部材７０の絶縁部材４０側の面積は、いずれも絶縁部材４０の放熱器３０側の面積Ｓ４０ｂ以上になっている。具体的には、熱伝導部材７０の放熱器３０側の面積および熱伝導部材７０の絶縁部材４０側の面積は、絶縁部材４０の放熱器３０側の面積Ｓ４０ｂよりも大きくなっている。本実施の形態において、熱伝導部材７０の放熱器３０側の面積は、熱伝導部材７０の下面の面積であり、熱伝導部材７０の絶縁部材４０側の面積は、熱伝導部材７０の上面の面積である。 When the mounting structure 2 is viewed from above, the area of the heat conducting member 70 is greater than or equal to the area of the insulating member 40 . That is, both the area of the heat conducting member 70 on the radiator 30 side and the area of the heat conducting member 70 on the insulating member 40 side are equal to or larger than the area S40b of the insulating member 40 on the radiator 30 side. Specifically, the area of the heat conducting member 70 on the radiator 30 side and the area of the heat conducting member 70 on the insulating member 40 side are larger than the area S40b of the insulating member 40 on the radiator 30 side. In the present embodiment, the area of the heat conducting member 70 on the radiator 30 side is the area of the lower surface of the heat conducting member 70, and the area of the heat conducting member 70 on the insulating member 40 side is the area of the upper surface of the heat conducting member 70. area.
　また、実装構造体２を鳥観したときに、下側の熱伝導部材７０が存在する領域は、上側の熱伝導部材５０が存在する領域よりも大きい。つまり、実装構造体２を鳥観したときに、下側の熱伝導部材７０の面積は、上側の熱伝導部材５０の面積よりも大きくなっている。具体的には、熱伝導部材７０の上面の面積および熱伝導部材７０の下面の面積は、熱伝導部材５０の配線基板１０側の面積Ｓ５０ａよりも大きく、また、熱伝導部材５０の絶縁部材４０側の面積Ｓ５０ｂよりも大きくなっている。 Further, when the mounting structure 2 is viewed from above, the area where the lower heat conduction member 70 exists is larger than the area where the upper heat conduction member 50 exists. In other words, when the mounting structure 2 is viewed from above, the area of the heat conducting member 70 on the lower side is larger than the area of the heat conducting member 50 on the upper side. Specifically, the area of the upper surface of the heat-conducting member 70 and the area of the lower surface of the heat-conducting member 70 are larger than the area S50a of the heat-conducting member 50 on the side of the wiring board 10, and the insulating member 40 of the heat-conducting member 50 It is larger than the side area S50b.
　なお、本実施の形態に係る実装構造体２は、第二の熱伝導部材として熱伝導部材７０を備えていること以外については、上記実施の形態１に係る実装構造体１と同じ構成である。 Note that the mounting structure 2 according to the present embodiment has the same configuration as the mounting structure 1 according to the first embodiment, except that it includes a heat conducting member 70 as a second heat conducting member. .
　したがって、本実施の形態に係る実装構造体２でも、配線基板１０と放熱器３０との間に絶縁部材４０が設けられているとともに、配線基板１０と絶縁部材４０との間に熱伝導部材５０が設けられている。そして、熱伝導部材５０の配線基板１０側の面積Ｓ５０ａ、および、熱伝導部材５０の絶縁部材４０側の面積Ｓ５０ｂは、絶縁部材４０の放熱器３０側の面積Ｓ４０ｂよりも小さくなっている。 Therefore, in the mounting structure 2 according to the present embodiment as well, the insulating member 40 is provided between the wiring board 10 and the radiator 30, and the heat conducting member 50 is provided between the wiring board 10 and the insulating member 40. is provided. The area S50a of the heat conducting member 50 on the wiring board 10 side and the area S50b of the heat conducting member 50 on the insulating member 40 side are smaller than the area S40b of the insulating member 40 on the radiator 30 side.
　これにより、配線基板１０に絶縁破壊が発生することを抑制しつつ、配線基板１０に実装された発熱部品２０で発生する熱を効率良く放熱することができる。 As a result, it is possible to efficiently dissipate the heat generated by the heat-generating components 20 mounted on the wiring board 10 while suppressing the occurrence of dielectric breakdown in the wiring board 10 .
　さらに、本実施の形態に係る実装構造体２は、第一の熱伝導部材である熱伝導部材５０に加えて、絶縁部材４０と放熱器３０との間に、さらに第二の熱伝導部材として熱伝導部材７０を備えている。 Furthermore, in the mounting structure 2 according to the present embodiment, in addition to the heat conducting member 50 which is the first heat conducting member, between the insulating member 40 and the radiator 30, a second heat conducting member A heat conducting member 70 is provided.
　この構成により、上記実施の形態１に係る実装構造体１と比べて、絶縁部材４０と放熱器３０との密着性をさらに高めることができる。これにより、配線基板１０に実装された発熱部品２０で発生する熱をさらに効率良く放熱することができる。 With this configuration, the adhesion between the insulating member 40 and the radiator 30 can be further enhanced compared to the mounting structure 1 according to the first embodiment. As a result, the heat generated by the heat-generating component 20 mounted on the wiring board 10 can be dissipated more efficiently.
　また、本実施の形態に係る実装構造体２において、実装構造体２を鳥観したときに、熱伝導部材７０が存在する領域は、熱伝導部材５０が存在する領域よりも大きくなっている。 In addition, in the mounting structure 2 according to the present embodiment, when the mounting structure 2 is viewed from above, the area where the heat conducting member 70 exists is larger than the area where the heat conducting member 50 exists.
　この構成により、配線基板１０から放熱器３０までの熱の伝わりが良くなるので、配線基板１０に実装された発熱部品２０で発生する熱をさらに効率良く放熱することができる。 This configuration improves heat transfer from the wiring board 10 to the radiator 30, so that the heat generated by the heat-generating components 20 mounted on the wiring board 10 can be dissipated more efficiently.
　（実施の形態２の変形例）
　上記実施の形態２に係る実装構造体２では、絶縁部材４０と放熱器３０との間に１つの熱伝導部材７０しか挿入されていなかったが、これに限らない。 (Modification of Embodiment 2)
In the mounting structure 2 according to the second embodiment, only one thermally conductive member 70 is inserted between the insulating member 40 and the radiator 30, but the present invention is not limited to this.
　具体的には、図４に示される変形例に係る実装構造体２Ａのように、絶縁部材４０と放熱器３０との間に複数の熱伝導部材７０が配置されていてもよい。この場合、図４に示すように、複数の熱伝導部材７０の各々は、複数の発熱部品２０の各々に対向するように設けられているとよい。また、複数の熱伝導部材７０は、互いに分離して配置されている。したがって、隣り合う２つの熱伝導部材７０の間には隙間（空気層）が存在している。 Specifically, a plurality of heat conducting members 70 may be arranged between the insulating member 40 and the radiator 30 like the mounting structure 2A according to the modification shown in FIG. In this case, as shown in FIG. 4 , each of the plurality of heat conducting members 70 may be provided so as to face each of the plurality of heat generating components 20 . Also, the plurality of heat conducting members 70 are arranged separately from each other. Therefore, a gap (air layer) exists between two adjacent heat conducting members 70 .
　また、上記実施の形態２に係る実装構造体２では、第二の熱伝導部材である熱伝導部材７０の面積を、絶縁部材４０の面積以上としたが、これに限らない。つまり、図４に示すように、熱伝導部材７０の面積は、絶縁部材４０の面積よりも小さくてもよい。 In addition, in the mounting structure 2 according to the second embodiment, the area of the thermally conductive member 70, which is the second thermally conductive member, is equal to or greater than the area of the insulating member 40, but the present invention is not limited to this. That is, as shown in FIG. 4 , the area of the heat conducting member 70 may be smaller than the area of the insulating member 40 .
　具体的には、本変形例では、熱伝導部材７０の絶縁部材４０側の面積Ｓ７０ａ（以下、「第四の面積Ｓ７０ａ」とも記載する）、および、熱伝導部材７０の放熱器３０側の面積Ｓ７０ｂ（以下、「第五の面積Ｓ７０ｂ」とも記載する）は、絶縁部材４０の放熱器３０側の面積Ｓ４０ｂ（第三の面積）よりも小さくなっている（Ｓ７０ａ＜Ｓ４０ｂ、Ｓ７０ｂ＜Ｓ４０ｂ）。 Specifically, in this modification, the area S70a of the heat conducting member 70 on the insulating member 40 side (hereinafter also referred to as "fourth area S70a") and the area of the heat conducting member 70 on the radiator 30 side S70b (hereinafter also referred to as “fifth area S70b”) is smaller than area S40b (third area) of insulating member 40 on radiator 30 side (S70a<S40b, S70b<S40b).
　本変形例において、第四の面積Ｓ７０ａは、熱伝導部材７０の上面である第一の面７０ａが絶縁部材４０の第二の面４０ｂに当接する部分の面積である。また、第五の面積Ｓ７０ｂは、熱伝導部材７０の下面である第二の面７０ｂが放熱器３０に当接する部分の面積である。なお、本変形例において、第四の面積Ｓ７０ａと第五の面積Ｓ７０ｂとは同じであるが（Ｓ７０ａ＝Ｓ７０ｂ）、これに限らない。 In this modified example, the fourth area S70a is the area of the portion where the first surface 70a, which is the upper surface of the heat conducting member 70, contacts the second surface 40b of the insulating member 40. The fifth area S70b is the area of the portion where the second surface 70b, which is the lower surface of the heat conducting member 70, contacts the radiator 30. As shown in FIG. In addition, in this modified example, the fourth area S70a and the fifth area S70b are the same (S70a=S70b), but the present invention is not limited to this.
　また、本変形例では、絶縁部材４０と放熱器３０との間には熱伝導部材７０が複数配置されているが、複数の熱伝導部材７０の各々が、Ｓ７０ａ＜Ｓ４０ｂの関係式とＳ７０ｂ＜Ｓ４０ｂの関係式とを満たしている。 In addition, in this modification, a plurality of heat conducting members 70 are arranged between the insulating member 40 and the radiator 30, and each of the plurality of heat conducting members 70 satisfies the relational expressions S70a<S40b and S70b< It satisfies the relational expression of S40b.
　さらに、複数の熱伝導部材７０の各々が、Ｓ７０ａ＜Ｓ４０ｂの関係式とＳ７０ｂ＜Ｓ４０ｂの関係式とを満たしているだけではなく、複数の熱伝導部材７０の面積の合計が、Ｓ７０ａ＜Ｓ４０ｂの関係式とＳ７０ｂ＜Ｓ４０ｂの関係式とを満たしている。つまり、第四の面積Ｓ７０ａを、複数の熱伝導部材７０の絶縁部材４０側の面積の合計とし、第五の面積Ｓ７０ｂを、複数の熱伝導部材７０の放熱器３０側の面積の合計とした場合であっても、Ｓ７０ａ＜Ｓ４０ｂの関係式とＳ７０ｂ＜Ｓ４０ｂの関係式とを満たしている。 Furthermore, each of the plurality of heat conducting members 70 not only satisfies the relational expressions of S70a<S40b and S70b<S40b, but the total area of the plurality of heat conducting members 70 satisfies the relation of S70a<S40b. It satisfies the relational expression and the relational expression of S70b<S40b. That is, the fourth area S70a is the sum of the areas of the plurality of heat conducting members 70 on the insulating member 40 side, and the fifth area S70b is the sum of the areas of the plurality of heat conducting members 70 on the radiator 30 side. Even in this case, the relational expressions of S70a<S40b and S70b<S40b are satisfied.
　なお、実装構造体２Ａにおいては、Ｓ７０ａ＜Ｓ４０ｂの関係式とＳ７０ｂ＜Ｓ４０ｂの関係式とは、複数の熱伝導部材７０の面積を合計した場合に必ずしも満たしている必要はなく、少なくとも複数の熱伝導部材７０の各々の面積が、Ｓ７０ａ＜Ｓ４０ｂの関係式とＳ７０ｂ＜Ｓ４０ｂの関係式とを満たしていればよい。 In the mounting structure 2A, the relational expression S70a<S40b and the relational expression S70b<S40b do not necessarily have to be satisfied when the areas of the plurality of heat conducting members 70 are totaled. It is sufficient that the area of each of the conductive members 70 satisfies the relational expression of S70a<S40b and the relational expression of S70b<S40b.
　また、本変形例において、熱伝導部材７０についての第四の面積Ｓ７０ａおよび第五の面積Ｓ７０ｂは、発熱部品２０が配線基板１０に当接する面積よりも、配線基板１０の厚さ分および／または絶縁部材４０の厚さ分以上大きくなっているとよい。 In addition, in this modification, the fourth area S70a and the fifth area S70b of the heat conducting member 70 are larger than the area where the heating component 20 contacts the wiring board 10 by the thickness of the wiring board 10 and/or It is preferable that the thickness is greater than the thickness of the insulating member 40 .
　なお、本変形例に係る実装構造体２Ａにおいても、配線基板１０と絶縁部材４０との間に配置された熱伝導部材５０については、Ｓ５０ａ＜Ｓ４０ｂの関係式とＳ５０ｂ＜Ｓ４０ｂの関係式とを満たしている。したがって、本変形例に係る実装構造体２Ａにおいても、上記実施の形態２に係る実装構造体２と同様の効果を奏する。 Also in the mounting structure 2A according to this modified example, regarding the heat conducting member 50 arranged between the wiring board 10 and the insulating member 40, the relational expressions S50a<S40b and S50b<S40b are applied. meet. Therefore, the mounting structure 2A according to this modified example also has the same effect as the mounting structure 2 according to the second embodiment.
　（変形例）
　以上、本開示に係る実装構造体について、実施の形態１、２に基づいて説明したが、本開示は、上記実施の形態１、２に限定されるものではない。 (Modification)
As described above, the mounting structure according to the present disclosure has been described based on the first and second embodiments, but the present disclosure is not limited to the first and second embodiments.
　例えば、上記実施の形態１、２において、自己発熱する発熱部品２０は、半導体素子等の回路素子であったが、これに限らない。具体的には、自己発熱する発熱部品２０は、表面実装型のＬＥＤ素子（ＬＥＤ光源）であってもよい。この場合、ＬＥＤ素子としては、ＬＥＤチップがパッケージ化されたＳＭＤ型のＬＥＤ光源を用いることができる。ＳＭＤ型のＬＥＤ光源は、樹脂製またはセラミック製等の容器（パッケージ）と、容器内に配置されたＬＥＤチップ（ベアチップ）と、ＬＥＤチップを封止する封止部材とを備える。封止部材としては、蛍光体が含有された蛍光体含有樹脂を用いてもよい。 For example, in Embodiments 1 and 2, the self-heating heat-generating component 20 was a circuit element such as a semiconductor element, but it is not limited to this. Specifically, the heat-generating component 20 that generates heat by itself may be a surface-mounted LED element (LED light source). In this case, an SMD type LED light source in which an LED chip is packaged can be used as the LED element. An SMD type LED light source includes a container (package) made of resin or ceramic, an LED chip (bare chip) arranged in the container, and a sealing member that seals the LED chip. A phosphor-containing resin containing a phosphor may be used as the sealing member.
　また、発熱部品２０として、ＬＥＤ素子を用いる場合、発熱部品２０は、ＬＥＤ素子と回路素子との両方を含んでいてもよいし、ＬＥＤ素子のみであってもよい。発熱部品２０がＬＥＤ素子のみである場合、ＬＥＤ素子が実装された配線基板１０は、ＬＥＤ基板となる。 Also, when an LED element is used as the heat-generating component 20, the heat-generating component 20 may include both the LED element and the circuit element, or may include only the LED element. When the heat-generating component 20 is only an LED element, the wiring board 10 on which the LED element is mounted becomes an LED board.
　また、上記実施の形態１、２において、絶縁部材４０と熱伝導部材５０とは、異なる材料によって構成されていてもよいし、同じ材料によって構成されていてもよい。例えば、絶縁部材４０および熱伝導部材５０は、いずれもＴＩＭによって構成されていてもよい。同様に、上記実施の形態２において、絶縁部材４０と熱伝導部材７０（第二の熱伝導部材）とは、異なる材料によって構成されていてもよいし、同じ材料によって構成されていてもよい。例えば、絶縁部材４０および熱伝導部材７０がいずれもＴＩＭによって構成されていてもよい。さらに、上記実施の形態２においては、絶縁部材４０、熱伝導部材５０および熱伝導部材７０がいずれもＴＩＭによって構成されていてもよい。 In addition, in Embodiments 1 and 2 above, the insulating member 40 and the heat conducting member 50 may be made of different materials, or may be made of the same material. For example, both the insulating member 40 and the heat conducting member 50 may be made of TIM. Similarly, in the second embodiment, the insulating member 40 and the heat conducting member 70 (second heat conducting member) may be made of different materials or may be made of the same material. For example, both the insulating member 40 and the heat conducting member 70 may be made of TIM. Furthermore, in the above second embodiment, the insulating member 40, the heat conducting member 50 and the heat conducting member 70 may all be made of TIM.
　また、上記実施の形態１、２において、固定部材６０は、ネジであって、配線基板１０と放熱器３０とはねじ止めによって固定されていたが、これに限らない。例えば、固定部材６０は、配線基板１０を放熱器３０に向けて押さえ付けるホルダであってもよい。このように、ホルダによって配線基板１０を押さえ付けることで、熱伝導部材５０および絶縁部材４０を配線基板１０と放熱器３０とで挟みこんで放熱器３０に固定することができる。この場合、ホルダは、ネジ等の固定具によって放熱器３０等に固定される。 In addition, in Embodiments 1 and 2 above, the fixing member 60 is a screw, and the wiring board 10 and the heat sink 30 are fixed by screwing, but the present invention is not limited to this. For example, the fixing member 60 may be a holder that presses the wiring board 10 toward the radiator 30 . By pressing the wiring board 10 with the holder in this manner, the heat conducting member 50 and the insulating member 40 can be sandwiched between the wiring board 10 and the radiator 30 and fixed to the radiator 30 . In this case, the holder is fixed to the heat radiator 30 or the like with fasteners such as screws.
　その他、上記実施の形態に対して当業者が思いつく各種変形を施して得られる形態や、本開示の趣旨を逸脱しない範囲で実施の形態における構成要素および機能を任意に組み合わせることで実現される形態も本開示に含まれる。 In addition, a form obtained by applying various modifications that a person skilled in the art can think of to the above embodiment, and a form realized by arbitrarily combining the constituent elements and functions in the embodiment within the scope of the present disclosure. are also included in this disclosure.
　１、１Ａ、２、２Ａ　実装構造体
　１０　配線基板
　１０ａ、４０ａ、５０ａ、７０ａ　第一の面
　１０ｂ、４０ｂ、５０ｂ、７０ｂ　第二の面
　１１　熱輸送部材
　２０　発熱部品
　３０　放熱器
　４０　絶縁部材
　５０　熱伝導部材（第一の熱伝導部材）
　６０　固定部材
　７０　熱伝導部材（第二の熱伝導部材） 1, 1A, 2, 2A mounting structure 10 wiring board 10a, 40a, 50a, 70a first surface 10b, 40b, 50b, 70b second surface 11 heat transport member 20 heat generating component 30 radiator 40 insulating member 50 heat Conductive member (first heat conductive member)
60 fixing member 70 thermally conductive member (second thermally conductive member)

Claims (8)

  1. 　第一の面および前記第一の面に背向する第二の面を有する配線基板と、
    　前記配線基板の前記第一の面に１つ以上実装された表面実装型の発熱部品と、
    　前記配線基板の前記第二の面側に設けられた放熱器と、
    　前記配線基板と前記放熱器との間に設けられた絶縁部材と、
    　前記配線基板と前記絶縁部材との間に設けられた第一の熱伝導部材と、
    　前記配線基板を前記放熱器に固定するための固定部材と、を備え、
    　前記第一の熱伝導部材の前記配線基板側の面積、および、前記第一の熱伝導部材の前記絶縁部材側の面積は、前記絶縁部材の前記放熱器側の面積よりも小さい、
    　実装構造体。     a wiring board having a first surface and a second surface opposite to the first surface;
    one or more surface-mounted heat-generating components mounted on the first surface of the wiring board;
    a radiator provided on the second surface side of the wiring board;
    an insulating member provided between the wiring board and the radiator;
    a first thermally conductive member provided between the wiring board and the insulating member;
    a fixing member for fixing the wiring board to the radiator,
    The area of the first thermally conductive member on the wiring board side and the area of the first thermally conductive member on the insulating member side are smaller than the area of the insulating member on the radiator side,
    An implementation struct.
  2. 　前記発熱部品は、複数実装されており、
    　前記第一の熱伝導部材は、複数の前記発熱部品の各々に対向するように且つ互いに分離して複数設けられている、
    　請求項１に記載の実装構造体。     A plurality of the heat-generating components are mounted,
    A plurality of the first heat-conducting members are provided so as to face each of the plurality of heat-generating components and are separated from each other.
    The mounting structure according to claim 1.
  3. 　前記絶縁部材の熱伝導率は、前記配線基板の基板材料の熱伝導率よりも高い、
    　請求項１または２に記載の実装構造体。     The thermal conductivity of the insulating member is higher than the thermal conductivity of the substrate material of the wiring board,
    The mounting structure according to claim 1 or 2.
  4. 　前記発熱部品で発生する熱を前記配線基板の前記第二の面側に輸送する熱輸送部材を備える、
    　請求項１～３のいずれか１項に記載の実装構造体。     a heat transport member that transports heat generated by the heat generating component to the second surface side of the wiring board;
    The mounting structure according to any one of claims 1 to 3.
  5. 　前記第一の熱伝導部材は、前記熱輸送部材に当接している、
    　請求項４に記載の実装構造体。     the first heat conducting member is in contact with the heat transporting member;
    The mounting structure according to claim 4.
  6. 　前記絶縁部材と前記放熱器との間に、さらに第二の熱伝導部材を備える、
    　請求項１～５のいずれか１項に記載の実装構造体。      further comprising a second thermally conductive member between the insulating member and the radiator;
    The mounting structure according to any one of claims 1 to 5.
  7. 　前記第二の熱伝導部材の前記絶縁部材側の面積、および、前記第二の熱伝導部材の前記放熱器側の面積は、前記絶縁部材の前記放熱器側の面積よりも小さい、
    　請求項６に記載の実装構造体。     The area of the second thermally conductive member on the insulating member side and the area of the second thermally conductive member on the radiator side are smaller than the area of the insulating member on the radiator side,
    The mounting structure according to claim 6.
  8. 　前記実装構造体を鳥観したときに、前記第二の熱伝導部材が存在する領域は、前記第一の熱伝導部材が存在する領域よりも大きい、
    　請求項６または７に記載の実装構造体。     When the mounting structure is viewed from above, the area where the second heat conduction member exists is larger than the area where the first heat conduction member exists,
    The mounting structure according to claim 6 or 7.
PCT/JP2022/018975 2021-05-26 2022-04-26 Mounting structure WO2022249841A1 (en)

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JPH0955459A (en) * 1995-06-06 1997-02-25 Seiko Epson Corp Semiconductor device
JP2004311566A (en) * 2003-04-03 2004-11-04 Nissan Motor Co Ltd Semiconductor device and its manufacturing method
JP2010232318A (en) * 2009-03-26 2010-10-14 Toyota Industries Corp Semiconductor device and heat conductive sheet
JP2010245174A (en) * 2009-04-02 2010-10-28 Denso Corp Electronic control unit and method of manufacturing the same
JP2016054221A (en) * 2014-09-03 2016-04-14 トヨタ自動車株式会社 Semiconductor device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0955459A (en) * 1995-06-06 1997-02-25 Seiko Epson Corp Semiconductor device
JP2004311566A (en) * 2003-04-03 2004-11-04 Nissan Motor Co Ltd Semiconductor device and its manufacturing method
JP2010232318A (en) * 2009-03-26 2010-10-14 Toyota Industries Corp Semiconductor device and heat conductive sheet
JP2010245174A (en) * 2009-04-02 2010-10-28 Denso Corp Electronic control unit and method of manufacturing the same
JP2016054221A (en) * 2014-09-03 2016-04-14 トヨタ自動車株式会社 Semiconductor device

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