WO2022199382A1

WO2022199382A1 - Cable assembly, signal transmission assembly, and communication system

Info

Publication number: WO2022199382A1
Application number: PCT/CN2022/079920
Authority: WO
Inventors: 李文亮; 陈永炜; 颜忠; 汪泽文
Original assignee: 华为技术有限公司
Priority date: 2021-03-22
Filing date: 2022-03-09
Publication date: 2022-09-29
Also published as: CN115133339A

Abstract

Disclosed are a cable assembly (101), a signal transmission assembly (100), and a communication system (1000). The signal transmission assembly (100) comprises a first chip (10), a first circuit board (20), and a cable module (101). The first circuit board (20) is provided with a first through hole (23). The cable module (101) comprises a first fixing base (31) and cables (32). The first fixing base (31) is fixed to the first circuit board (20), and is at least partially located in the first through hole (23). First ends (321) of the cables (32) are fixed to the first fixing base (31). The first ends (321) of the cables (32) can be directly and electrically connected to first signal pins (12) of the first chip (10). Thus, the first ends (321) of the cables (32) are connected to the first chip (10) at substantially zero distance. The signal loss between the first chip (10) and the first ends (321) of the cables (32) is low. In addition, upon comparison with conventional signal transmission assemblies, an electrical connector is removed. The layout space of the first circuit board (20) can be greatly improved.

Description

Cable assemblies, signal transmission assemblies and communication systems

This application claims the priority of the Chinese patent application with the application number 202110303154.8 and the application name "Cable Assembly, Signal Transmission Assembly and Communication System" filed with the China Patent Office on March 22, 2021, the entire contents of which are incorporated by reference in in this application.

technical field

The present application relates to the field of communication technologies, and in particular, to a cable assembly, a signal transmission assembly, and a communication system.

Background technique

In recent years, with the increase of the signal bandwidth of the communication system, lower requirements are placed on the loss of the communication channel. Traditional communication systems include chips, printed circuit boards (PCBs), electrical connectors, and cables. The chip and the electrical connector are fixed on the PCB. The cable is electrically connected to the chip through the electrical connector and the PCB. However, the electrical connector occupies a large space of the PCB, making the space utilization ratio of the PCB low.

SUMMARY OF THE INVENTION

The present application provides a cable assembly, a signal transmission assembly and a communication system with high PCB space utilization.

In a first aspect, the present application provides a signal transmission assembly. The signal transmission assembly includes a first chip, a first circuit board and a cable module. The first chip includes a first signal pin and a second signal pin arranged on the same side. The first circuit board is provided with a first through hole. The second signal pin is electrically connected to the first circuit board. The cable module includes a first fixing seat and a cable. The first fixing seat is fixed on the first circuit board and is at least partially located in the first through hole. The first end of the cable is fixed on the first fixing seat and is electrically connected to the first signal pin.

It can be understood that, compared with the traditional signal transmission assembly, the first signal pin of the signal transmission assembly of this embodiment can be directly electrically connected to the first end of the cable. The first chip and the cable can be connected with approximately zero distance, that is, a section of PCB connection and electrical connector connection can be omitted between the first signal pin of the first chip and the cable. In this way, the signal loss caused by the PCB trace (or the PCB via hole) and the signal loss caused by the electrical connector can be reduced between the first signal pin and the first end of the cable. It should be understood that by reducing the signal loss of PCB traces (or PCB vias) and the signal loss of electrical connectors, the loss of signal transmission components can be reduced to a large extent, which is extremely important for signal transmission components to meet the low loss requirements of.

In addition, compared with the traditional signal transmission component, in this embodiment, since the first signal pin of the first chip can be directly electrically connected to the first end of the cable, the first signal pin is connected to the first end of the cable. The connection position between the first signal pin and the PCB, the connection position between the PCB and the electrical connector, and the connection position between the electrical connector and the cable can be omitted between one end. In this way, there are fewer connection positions between the first signal pin and the first end of the cable, and the number of discontinuous points of the signal channel is less, thereby helping to improve the fluctuation and resonance of the insertion loss of the signal channel.

In addition, compared with the traditional signal transmission assembly, the signal transmission assembly of this embodiment can omit the via package between the first signal pin and the PCB, the via package between the electrical connector and the PCB, and the electrical connector and the cable. package. The structure of the signal transmission assembly of this embodiment is relatively simple.

In addition, when the connection position between the first signal pin and the first end of the cable is reduced, and the number of discontinuous points of the signal channel is small, it is not easy for the signal outside the signal transmission component to pass through the first signal pin and the first end of the cable. The connection positions between the first ends of the cables are coupled into the signal transmission component, that is, the coupling positions of signal crosstalk are reduced, thereby reducing signal crosstalk to a greater extent.

In addition, since the cable of the traditional signal transmission assembly is electrically connected to the PCB through the electrical connector, the electrical connector disposed around the chip will seriously interfere with the cooling air duct of the chip and occupy the layout space of the PCB. Electrical connectors are omitted. At this time, the heat dissipation air duct of the first chip is no longer disturbed by the electrical connector. In addition, the layout space of the PCB can also be greatly improved, that is, the space utilization rate of the PCB can be improved.

In a possible implementation manner, the number of cables is one, and one cable is used to transmit high-speed signals; or, the number of cables is multiple, and at least one cable is used to transmit high-speed signals.

It can be understood that when the signal transmission component is used to transmit high-speed signals, the communication system places a lower loss requirement on the signal transmission component. If the structural setting of the signal transmission component is unreasonable, the loss may be greatly increased, so that the signal transmission component cannot meet the low loss requirement of the communication system. In this embodiment, a brand-new signal transmission component structure is provided to reduce the signal loss between the first chip and the cable to a greater extent, thereby meeting the low-loss requirement of the communication system. Even more, the maximum transmission bandwidth of the signal transmission component of this embodiment can reach 112 Gbps.

In addition, since the first signal pin of the first chip can be directly electrically connected to the first end of the cable, the high-speed signal does not need to be transmitted to the cable through the PCB and the electrical connector. In this way, on the one hand, in this embodiment, there is no need to worry about the influence of the loss and deterioration of the high-speed signal on the first circuit board of the low-level material, that is, the material of the first circuit board can be made of a low-level material, thereby reducing the first circuit board to a greater extent. The cost of a circuit board is invested; on the other hand, the first chip can use a lower active driving cost to realize signal transmission, thereby reducing system power consumption.

In a possible implementation manner, the first circuit board is used to transmit low-speed signals, power or high-speed signals.

It can be understood that the transmission loss of the low-speed signal on the first circuit board is relatively small, so the direct transmission of the low-speed signal through the first circuit board can meet the low-loss requirement of the communication system. In addition, the method of directly transmitting low-speed signals and power through the first circuit board is relatively simple, the first circuit board does not need to dig holes, and the cost investment is low.

In addition, although the loss of transmitting high-speed signals through the first circuit board is relatively large, for some high-speed signals with lower channel loss requirements, transmission through the first circuit board can also meet the communication requirements. This transmission method is relatively simple, the first circuit board does not need to dig holes, and the cost input is low. Of course, for some high-speed signals with high channel loss requirements, they can also be transmitted through the first circuit board. Although this transmission method cannot meet the communication requirements, other improved methods can be used to reduce the loss of the signal, so that this transmission method can meet the communication requirements.

In a possible implementation manner, the cable includes an inner conductor, a dielectric layer and an outer conductor. The dielectric layer wraps the inner conductor. The outer conductor wraps the dielectric layer. The inner conductor is electrically connected to the first signal pin. The first chip also includes a first ground pin. The first ground pin is used to provide a ground reference for the first signal pin. The first ground pin is electrically connected to the outer conductor. It can be understood that the cable of this structure can roughly form a coaxial line. The cable with this structure has better signal shielding effect. When the inner conductor of the cable is used to transmit signals, the inner conductor is not easily interfered by other signals.

In a possible implementation manner, the cable module further includes a first pad. A part of the first pad is fixed to the end face of the first end portion of the inner conductor. The other part of the first pad is fixed to the end surface of the first end portion of the dielectric layer. The first pad is electrically connected to the inner conductor of the cable, and is insulated from the outer conductor of the cable. The first pad is electrically connected to the first signal pin. It can be understood that by setting the first pad on the end face of the first end of the inner conductor and the end face of the first end of the dielectric layer, the connection area between the first signal pin and the inner conductor can be greatly improved, Thus, the difficulty of connecting the first signal pin and the inner conductor is reduced.

In a possible implementation manner, the cable module further includes a first elastic piece. The first elastic piece is fixed on the first pad. The first elastic piece is electrically connected to the first signal pin.

It can be understood that, for the solution in which the first signal pin is directly fixed to the first pad, since the first signal pin and the first pad are located between the first chip and the first fixing seat, on the one hand, the first signal It is difficult to fix the pins and the first pads. On the other hand, when the first holder is fixed to the first circuit board, it is difficult for the first pads to be at the same level as the pins of the first circuit board. If the distance between the pin of the first circuit board and the second signal pin is a standard distance, the distance between the first signal pin and the first pad is not easy to be at the standard distance, that is, the first signal lead The distance between the pin and the first pad is prone to errors. In this way, the first signal pin is not easily fixed to the first pad. In this embodiment, by fixing a first elastic sheet on each of the first pads, on the one hand, although the first elastic sheet and the first signal pin are located between the first chip and the first fixing seat, due to the An elastic piece has elasticity, and the first elastic piece can be in contact with the first signal pin to achieve stable electrical connection. In this way, the electrical connection between the first elastic piece and the first signal pin is relatively simple. On the other hand, when the first fixing base is fixed on the first circuit board, it is difficult for the first pad to be at the same level as the third signal pin of the first circuit board. At this time, due to the elasticity of the first elastic piece, the first elastic piece can absorb the error of the distance between the first elastic piece and the first signal pin, thereby ensuring that the first signal pin can be electrically connected to the first elastic piece stably.

In addition, by arranging the first elastic sheet on the first pad, the assembling manner of the signal transmission component can also be changed, thereby reducing the difficulty of assembling the signal transmission component. Specifically, when the first fixing seat is inserted into the first through hole of the first circuit board, the first fixing seat and the first circuit board are first fixed without adhesive. After the plurality of first elastic pieces are in contact with the plurality of first signal pins in a one-to-one correspondence, the first fixing seat and the first circuit board are fixed by adhesive. In this way, compared with the method of fixing the first fixing seat and the first circuit board first, and then fixing the first signal pin to the first elastic piece, the present embodiment does not need to pre-consider the connection between the first elastic piece and the first circuit board. Whether the feet are at the same level, that is to say, there is no need to consider too much the flatness of the first fixing base and the first circuit board. In this way, the connection between the first chip, the first circuit board and the cable module is relatively simple. Therefore, by arranging the first elastic sheet on the first pad, the flexibility of the connection between the first chip, the first circuit board and the cable module can be increased.

In a possible implementation manner, the cable module further includes a first ground layer. A part of the first ground layer is located on the surface of the first fixing base. Another portion of the first ground layer is located on the end face of the first end portion of the outer conductor. The first ground layer is electrically connected to the outer conductor of the cable, and is insulated from the inner conductor of the cable. The first ground layer is electrically connected to the first ground pin.

It can be understood that by arranging the first ground layer on the surface of the first fixing seat and the end face of the first end of the outer conductor, the contact area between the first ground pin and the first end of the outer conductor can be increased, thereby reducing the Difficulty in connecting the first ground pin with the first end of the outer conductor.

In a possible implementation manner, the cable module further includes a second pad. The second pad is fixed on the surface of the first ground layer away from the first fixing seat. The second pad is electrically connected to the first ground layer. The second pad is electrically connected to the first ground pin. It can be understood that, by arranging the second pad on the first ground layer, the first ground pin is facilitated to be fixedly connected to the first ground layer.

In a possible implementation manner, the signal transmission assembly further includes a socket connector. The socket connector is arranged between the first chip and the first circuit board. The socket connector includes a first signal dome and a second signal dome. One side of the first signal elastic sheet is electrically connected to the first signal pin. The other side is electrically connected to the first end of the cable. One side of the second signal elastic sheet is electrically connected to the second signal pin, and the other side is electrically connected to the first circuit board.

It can be understood that, for the solution in which the first signal pin is directly fixed to the first end of the cable, on the one hand, it is difficult to fix the first signal pin and the first end of the cable, and on the other hand, When the first fixing base is fixed on the first circuit board, it is difficult for the first end of the cable to be at the same level as the pins of the first circuit board, so that if the pins of the first circuit board and the second signal pins are When the distance between them is a standard distance, the distance between the first signal pin and the first end of the cable is not easy to be at the standard distance, that is, the distance between the first signal pin and the first end of the cable distances are prone to errors. In this way, the first signal pin is not easily fixed with the first end of the cable. In this embodiment, by disposing a socket connector between the first chip and the first circuit board, on the one hand, since the first signal elastic piece has elasticity, the first signal elastic piece can be contacted with the first signal pin. To achieve stable electrical connection, stable electrical connection can also be achieved through contact with the first end of the cable. In this way, the electrical connection between the first signal elastic piece and the first signal pin is relatively simple. The electrical connection between the first signal elastic piece and the first end of the cable is relatively simple. On the other hand, when the first fixing base is fixed on the first circuit board, it is still difficult for the first signal spring to be at the same level as the pins of the first circuit board. Because the first signal dome is elastic, the first signal dome can absorb the error of the distance between the first signal dome and the first signal pin, thereby ensuring that the first signal dome can be fixed on the first signal pin, and can The first signal elastic piece can absorb the error of the distance between the first signal elastic piece and the first end of the cable, thereby ensuring that the first signal elastic piece can be fixed on the first end of the cable.

In addition, by arranging the socket connector between the first chip and the circuit board, the assembly method of the signal transmission assembly can also be changed, thereby reducing the difficulty of assembly of the signal transmission assembly. Specifically, when the first fixing seat is inserted into the first through hole of the first circuit board, the first fixing seat and the first circuit board are first fixed without adhesive. After the plurality of first signal elastic pieces are in contact with the plurality of first signal pins in a one-to-one correspondence, the first fixing seat and the first circuit board are fixed by adhesive. In this way, compared to the method of first fixing the first fixing seat and the first circuit board, and then fixing the first signal pin to the first signal spring, the present embodiment does not need to consider the first signal spring and the first circuit board in advance. Whether the pins are at the same level, that is, there is no need to consider too much about the flatness of the first fixing seat and the first circuit board. In this way, the connection between the first chip, the first circuit board and the cable module is relatively simple. Therefore, by arranging the socket connector between the first chip and the circuit board, the flexibility of the connection between the first chip and the first circuit board and the cable module can be increased.

In a possible implementation manner, one side of the first signal elastic sheet is electrically connected to the first signal pin, and the other side is electrically connected to the first pad. One side of the second signal spring is electrically connected to the second signal pin, and the other side is electrically connected to the third signal pin of the first circuit board.

It can be understood that, for the solution in which the first signal pin is directly fixed to the first pad, since the first signal pin and the first pad are located between the first chip and the first fixing seat, on the one hand, the first signal It is difficult to fix the pins and the first pads. On the other hand, when the first fixing base is fixed to the first circuit board, it is difficult for the first pads to be in the same position as the third signal pins of the first circuit board. level, so if the distance between the third signal pin and the second signal pin of the first circuit board is a standard distance, the distance between the first signal pin and the first pad is not easy to be at the standard distance, That is, the distance between the first signal pin and the first pad is prone to errors. In this way, the first signal pin is not easily fixed to the first pad. In this embodiment, by disposing the socket connector between the first chip and the first circuit board, on the one hand, although the first signal spring, the first signal pin and the first pad are still located between the first chip and the first circuit board between the first fixing bases, but due to the elasticity of the first signal spring, the first signal spring can be in contact with the first signal pin to achieve stable electrical connection, and can also be in contact with the first pad to achieve stable electrical connection. In this way, the electrical connection between the first signal elastic piece and the first signal pin is relatively simple. The electrical connection between the first signal spring and the first pad is relatively simple. On the other hand, when the first fixing base is fixed on the first circuit board, it is still difficult for the first signal spring to be at the same level as the pins of the first circuit board. Because the first signal dome is elastic, the first signal dome can absorb the error of the distance between the first signal dome and the first signal pin, thereby ensuring that the first signal dome can be fixed on the first signal pin, and can The first signal elastic sheet can absorb the error of the distance between the first signal elastic sheet and the first pad, thereby ensuring that the first signal elastic sheet can be fixed on the first pad.

In a possible implementation manner, the first fixing seat is in interference fit with the hole wall of the first through hole. In this way, the connection firmness of the first fixing seat and the first circuit board is better, and the assembling method is relatively simple.

In a possible implementation manner, the first chip further includes a second ground pin. The second ground pin is used to provide a ground reference for the second signal pin. The second ground pin is electrically connected to the first circuit board and grounded through the first circuit board. It can be understood that the second ground pin can shield signals on other signal pins (eg, the first signal pin), thereby improving the anti-signal crosstalk capability of the second signal pin.

In a possible implementation manner, the cable module further includes a second fixing seat. Along the extending direction of the cable, the middle portion of the cable is fixed on the second fixing seat. It can be understood that the middle portion of the cable is fixed by the second fixing base, so that the multiple cables are more tidy.

In a possible implementation manner, the signal transmission component further includes a second circuit board and a second chip. The second chip includes a first signal terminal and a second signal terminal arranged on the same side. The second circuit board is provided with a third through hole. The second signal terminal is electrically connected to the second circuit board. The cable module further includes a third fixing seat. The third fixing base is fixed on the second circuit board and is at least partially located in the third through hole. The second end of the cable is fixed on the third fixing base and is electrically connected to the first signal end. It is understood that high-speed signals, low-speed signals, and power can be passed between the first circuit board and the second circuit board, ie, inter-board jumpers.

In a possible implementation manner, the second circuit board and the first circuit board are integrally formed, that is, the first circuit board and the second circuit board are integrated. In this way, high-speed signals, low-speed signals and power can be transmitted between the first chip and the second chip on the same circuit board, that is, the jumper on the board.

In a second aspect, the present application provides a communication system. The communication system includes a connector and a signal transmission assembly as described above. The connector electrically connects the second end of the cable. The connector is also electrically connected to the first circuit board to be electrically connected to the second signal pin through the first circuit board.

It can be understood that when the signal transmission component is applied to a communication system, the signal loss of the communication system is low, and the utilization rate of PCB space is high.

In a possible implementation manner, the connector is a backplane connector. The backplane connector includes a backplane connector female seat and a backplane connector male seat. The backplane connector female seat is fixed on the first circuit board. The backplane connector female base is electrically connected to the second end of the cable so as to be electrically connected to the first signal pin through the cable. The backplane connector female base is also electrically connected to the first circuit board so as to be electrically connected to the second signal pins through the first circuit board. The communication system also includes a backplane. The backplane connector male seat is fixed on the backplane and is electrically connected to the backplane. The backplane connector female seat is electrically connected to the backplane connector male seat.

In one possible implementation, the connector is an I/O connector. The communication system also includes a system circuit board and functional modules. The I/O connector is electrically connected to the system circuit board. The functional module is fixed on the system circuit board. The functional module is electrically connected to the system circuit board to be electrically connected to the I/O connector through the system circuit board.

In a third aspect, the present application provides a cable assembly. The cable assembly includes a first circuit board and a cable module. The first circuit board is provided with a first through hole. The first circuit board is used for electrical connection with the second signal pins of the first chip. The cable module includes a first fixing seat and a cable. The first fixing seat is fixed on the first circuit board and is at least partially located in the first through hole. The first end of the cable is fixed on the first fixing seat. The first end of the cable is used for electrical connection with the first signal pin of the first chip.

It can be understood that, compared with the traditional signal transmission component, the first signal pin of the first chip of this embodiment can be directly electrically connected to the first end of the cable. The first chip and the cable can be connected with approximately zero distance, that is, a section of PCB connection and electrical connector connection can be omitted between the first signal pin of the first chip and the cable. In this way, the signal loss caused by the PCB trace (or the PCB via hole) and the signal loss caused by the electrical connector can be reduced between the first signal pin and the first end of the cable. It should be understood that by reducing the signal loss of PCB traces (or PCB vias) and the signal loss of electrical connectors, the loss of signal transmission components can be reduced to a large extent, which is extremely important for signal transmission components to meet the low loss requirements of.

In a possible implementation manner, the cable includes an inner conductor, a dielectric layer and an outer conductor. The dielectric layer wraps the inner conductor, and the outer conductor wraps the dielectric layer. The inner conductor is used for electrical connection with the first signal pin of the first chip. The outer conductor is used for electrical connection with the first ground pin of the first chip. The first ground pin is used to provide a ground reference for the first signal pin. It can be understood that the cable of this structure can roughly form a coaxial line. The cable with this structure has better signal shielding effect. When the inner conductor of the cable is used to transmit signals, the inner conductor is not easily interfered by other signals.

In a possible implementation manner, the cable module further includes a first pad. A part of the first pad is fixed to the end face of the first end portion of the inner conductor. The other part of the first pad is fixed to the end surface of the first end portion of the dielectric layer. The first pad is electrically connected to the inner conductor of the cable, and is insulated from the outer conductor of the cable. The first pad is used for electrical connection with the first signal pin of the first chip. It can be understood that by setting the first pad on the end face of the first end of the inner conductor and the end face of the first end of the dielectric layer, the connection area between the first signal pin and the inner conductor can be greatly improved, Thus, the difficulty of connecting the first signal pin and the inner conductor is reduced.

In a possible implementation manner, the cable module further includes a first elastic piece. The first elastic piece is fixed on the first pad. The first elastic sheet is used for electrical connection with the first signal pin of the first chip.

In a possible implementation manner, the cable module further includes a first ground layer. A part of the first ground layer is located on the surface of the first fixing base. Another portion of the first ground layer is located on the end face of the first end portion of the outer conductor. The first ground layer is electrically connected to the outer conductor of the cable. The first ground layer is also insulated from the inner conductor of the cable. The first ground layer is used for electrical connection with the first ground pin of the first chip. It can be understood that by arranging the first ground layer on the surface of the first fixing seat and the end face of the first end of the outer conductor, the contact area between the first ground pin and the first end of the outer conductor can be increased, thereby reducing the Difficulty in connecting the first ground pin with the first end of the outer conductor.

In a possible implementation manner, the cable module further includes a second pad. The second pad is fixed on the surface of the first ground layer away from the first fixing seat. The second pad is electrically connected to the first ground layer. The second pad is provided with insulation from the inner conductor of the cable. The second pad is used for electrical connection with the first ground pin of the first chip. It can be understood that, by arranging the second pad on the first ground layer, the first ground pin is facilitated to be fixedly connected to the first ground layer.

In a possible implementation manner, the cable assembly further includes a socket connector. The socket connector is arranged on the same side of the first circuit board and the first fixing seat. The socket connector includes a first signal dome and a second signal dome. One side of the first signal elastic sheet is used for electrical connection with the first signal pin, and the other side is electrically connected with the first end of the cable. One side of the second signal elastic sheet is used for electrical connection with the second signal pin, and the other side is electrically connected with the first circuit board.

In a possible implementation manner, one side of the first signal elastic sheet is used to be electrically connected to the first signal pin, and the other side is electrically connected to the first pad. One side of the second signal elastic sheet is electrically connected to the second signal pin, and the other side is electrically connected to the third signal pin of the first circuit board.

It can be understood that, for the solution in which the first signal pin is directly fixed to the first pad, since the first signal pin and the first pad are located between the first chip and the first fixing seat, on the one hand, the first signal It is difficult to fix the pins and the first pads. On the other hand, when the first fixing base is fixed to the first circuit board, it is difficult for the first pads to be in the same position as the third signal pins of the first circuit board. level, so if the distance between the third signal pin and the second signal pin of the first circuit board is a standard distance, the distance between the first signal pin and the first pad is not easy to be at the standard distance, That is, the distance between the first signal pin and the first pad is prone to errors. In this way, the first signal pin is not easily fixed to the first pad. In this embodiment, by disposing the socket connector between the first chip and the first circuit board, on the one hand, although the first signal spring, the first signal pin and the first pad are still located between the first chip and the first circuit board between the first fixing bases, but due to the elasticity of the first signal spring, the first signal spring can be in contact with the first signal pin to achieve stable electrical connection, and can also be in contact with the first pad to achieve stable electrical connection. In this way, the electrical connection between the first signal elastic piece and the first signal pin is relatively simple. The electrical connection between the first signal spring and the first pad is relatively simple. On the other hand, when the first fixing base is fixed on the first circuit board, it is still difficult for the first signal spring to be at the same level as the third signal pin of the first circuit board. Because the first signal dome is elastic, the first signal dome can absorb the error of the distance between the first signal dome and the first signal pin, thereby ensuring that the first signal dome can be fixed on the first signal pin, and can The first signal elastic sheet can absorb the error of the distance between the first signal elastic sheet and the first pad, thereby ensuring that the first signal elastic sheet can be fixed on the first pad.

In addition, by arranging the socket connector between the first chip and the circuit board, the assembly method of the signal transmission assembly can also be changed, thereby reducing the difficulty of assembly of the signal transmission assembly. Specifically, when the first fixing seat is inserted into the first through hole of the first circuit board, the first fixing seat and the first circuit board are first fixed without adhesive. After the plurality of first signal elastic pieces are in contact with the plurality of first signal pins in a one-to-one correspondence, the first fixing seat and the first circuit board are fixed by adhesive. In this way, compared to the method of first fixing the first fixing seat and the first circuit board, and then fixing the first signal pin to the first signal spring, the present embodiment does not need to consider the first signal spring and the first circuit board in advance. Whether the third signal pins are at the same level, that is, there is no need to consider too much about the flatness of the first fixing seat and the first circuit board. In this way, the connection between the first chip, the first circuit board and the cable module is relatively simple. Therefore, by arranging the socket connector between the first chip and the circuit board, the flexibility of the connection between the first chip and the first circuit board and the cable module can be increased.

In a possible implementation manner, the cable assembly further includes a second circuit board. The second circuit board is provided with a third through hole. The second circuit board is used for electrical connection with the second signal terminal of the second chip. The cable module further includes a third fixing seat. The third fixing base is fixed on the second circuit board and is at least partially located in the third through hole. The second end of the cable is fixed on the third fixing seat. The second end of the cable is used for electrical connection with the first signal end of the second chip.

In a possible implementation manner, the second circuit board and the first circuit board are integrally formed.

In a fourth aspect, the present application provides a signal transmission assembly. The signal transmission assembly includes a first chip and a cable module. The first chip includes first signal pins. The cable module includes a first fixing seat and a cable. The first end of the cable is fixed on the first fixing seat and is electrically connected to the first signal pin.

In a possible implementation manner, the signal transmission assembly further includes a socket connector. The socket connector is arranged between the first chip and the cable module. The socket connector includes a first signal spring. One side of the first signal elastic sheet is electrically connected to the first signal pin. The other side is electrically connected to the first end of the cable.

In a possible implementation manner, one side of the first signal elastic sheet is electrically connected to the first signal pin, and the other side is electrically connected to the first pad.

In a possible implementation manner, the signal transmission component further includes a second chip. The second chip includes a first signal terminal. The cable module further includes a third fixing seat. The second end of the cable is fixed on the third fixing base and is electrically connected to the first signal end.

In a possible implementation manner, the second circuit board and the first circuit board are integrally formed, that is, the first circuit board and the second circuit board are integrated.

Description of drawings

In order to illustrate the technical solutions of the embodiments of the present application, the accompanying drawings that need to be used in the embodiments of the present application will be described below.

FIG. 1a is a schematic structural diagram of an implementation manner of an electronic device provided in this embodiment;

FIG. 1b is a schematic structural diagram of another implementation manner of the electronic device provided in this embodiment;

Fig. 1c is a partial structural schematic diagram of the electronic device shown in Fig. 1a;

1d is a schematic structural diagram of an embodiment of a signal transmission assembly provided by the present application;

Fig. 2 is the exploded schematic diagram of the signal transmission assembly shown in Fig. 1d;

3 is a schematic structural diagram of the first chip shown in FIG. 2 at another angle;

FIG. 4 is a schematic structural diagram of the first circuit board shown in FIG. 2 at another angle;

Fig. 5 is a partial cross-sectional schematic diagram of the signal transmission assembly shown in Fig. 1d at the line A-A;

6 is an exploded schematic view of the cable module shown in FIG. 2;

FIG. 7 is a schematic structural diagram of the first fixing seat of the cable module shown in FIG. 6 at another angle;

FIG. 8 is a schematic structural diagram of a cable of the cable module shown in FIG. 6;

Fig. 9a is an enlarged schematic view of the cable shown in Fig. 8 at line B1;

Fig. 9b is a schematic cross-sectional view of the cable shown in Fig. 8 at the line B2-B2;

FIG. 10 is a schematic structural diagram of the cable module shown in FIG. 2 from another angle;

FIG. 11 is an enlarged schematic view of the cable module shown in FIG. 10 at C;

FIG. 12 is an enlarged schematic view of the cable module shown in FIG. 2 at D;

13 is a schematic cross-sectional view of the cable module shown in FIG. 12 at E-E;

FIG. 14 is a schematic cross-sectional view of the signal transmission assembly shown in FIG. 1d at line A-A;

Fig. 15a is a schematic cross-sectional view of another embodiment of the signal transmission assembly shown in Fig. 1d at line A-A;

Fig. 15b is an enlarged schematic view of the signal transmission assembly shown in Fig. 15a at F;

16 is a schematic structural diagram of a receptacle connector provided by an embodiment of the present application;

17 is a schematic cross-sectional view of still another embodiment of the signal transmission assembly shown in FIG. 1d at the line A-A;

FIG. 18 is a schematic structural diagram of another embodiment of the cable module shown in FIG. 2;

FIG. 19 is a schematic structural diagram of an implementation manner of a communication system provided by an embodiment of the present application;

FIG. 20 is a schematic structural diagram of another implementation manner of a communication system provided by an embodiment of the present application;

21 is a schematic structural diagram of another embodiment of the signal transmission assembly provided by the present application;

Figure 22 is an exploded schematic view of the signal transmission assembly shown in Figure 21;

FIG. 23 is a schematic structural diagram of the second chip shown in FIG. 22;

FIG. 24 is a schematic structural diagram of still another implementation manner of a signal transmission component provided by an embodiment of the present application;

FIG. 25 is an exploded schematic view of the signal transmission assembly shown in FIG. 24 .

Detailed ways

For the convenience of understanding the communication system provided by the embodiments of the present application, the relevant terms involved in the present application are explained:

Gbps: The unit of transmission rate, which means that the number of bits per second per unit time is 10 ⁹ bits.

Crosstalk: Crosstalk refers to the coupling effect of unwanted signals passing from one network to another.

Loss: Loss refers to the energy loss that occurs when a signal propagates along a transmission line. It can be generated in five ways: dielectric loss, wire loss, external radiation, impedance mismatch reflection, and external coupling to adjacent networks. Loss is usually characterized and measured by S-parameters.

Impedance: mainly refers to the characteristic impedance of the transmission line, which is defined as the ratio of the voltage to the current at any point on the transmission line.

PCB package: refers to the pads and vias that are matched with the corresponding pins of the printed circuit board, including Ball Grid Array Package (BGA) chips, electrical connectors and other devices. It provides an area of The via and pad layout scheme is the part of the printed circuit board that matches the device.

Ground: The transmission line is generally composed of two wires with a certain length, one of which is used as a signal path to transmit signals, and the other is used as a return path to transmit the return current of the signal, and this return path is usually called "ground".

The embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application.

In the description of the embodiments of the present application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, "connection" may be detachable connection, or It is a non-removable connection; it can be a direct connection or an indirect connection through an intermediate medium. Wherein, "fixed" means connected to each other and the relative positional relationship after the connection remains unchanged. Orientation terms mentioned in the embodiments of this application, such as "upper", "bottom", "inside", "outside", etc., only refer to the directions of the drawings. Therefore, the orientation terms used are for better, To clearly describe and understand the embodiments of the present application, rather than indicating or implying that the indicated devices or elements must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be construed as a limitation on the embodiments of the present application. "Plurality" means at least two.

Please refer to FIG. 1a and FIG. 1b. FIG. 1a is a schematic structural diagram of an implementation manner of an electronic device 2000 provided in this embodiment. FIG. 1b is a schematic structural diagram of another implementation manner of the electronic device 2000 provided in this embodiment. The electronic device 2000 may be a switch, router, server, wavelength division, optical line terminal (optical line terminal, OLT), or optical network terminal (optical network terminal, ONT) and other devices. In addition, the electronic device 2000 may be a box-type device (eg, a box-type switch, a box-type router, etc.), or a box-type device (eg, a box-type switch, a box-type router, etc.). In this embodiment, FIG. 1a schematically shows a structure in which the electronic device 2000 is a modular switch. Fig. 1b schematically shows a structure in which the electronic device 2000 is a box switch.

Please refer to FIG. 1c, which is a partial structural schematic diagram of the electronic device 2000 shown in FIG. 1a. The electronic device 2000 includes a housing 2100 and a functional single board 2200 . The functional single board 2200 is disposed on the housing 2100 . The casing 2100 is used to carry the functional single board 2200 . The functional single board 2200 can be used to transmit signals. The functional board 2200 includes a first chip, a first circuit board, a cable module and a connector which will be mentioned below. The specifics will be described below with reference to the related drawings. I won't go into details here. It should be noted that, in the following, the present application will provide a communication system. The communication system may be a system composed of multiple electronic devices 2000 (for example, a system composed of multiple electronic devices of the same type, or a system composed of multiple electronic devices of different types), or a system composed of one electronic device 2000 The system may also be a system composed of some devices in the electronic device 2000 (for example, the functional single board 2200, or a part of the functional single board 2200). The functional board 2200 may include a main control board, a switch board, a line card, and the like according to different functional implementations. The number of main control boards, switch boards or line cards is not specifically limited.

Please refer to FIG. 1d, which is a schematic structural diagram of an embodiment of the signal transmission assembly 100 provided by the present application. The signal transmission assembly 100 is used to transmit high-speed signals and low-speed signals. The high-speed signal may be a signal with a transmission rate greater than or equal to 1 Gbps, and the rise and fall time of the signal is less than or equal to 350ps. For example, the high-speed signal can be Ethernet Serdes or PCIE 5.0 or the like. The low-speed signal can be a signal of less than 1Gbps, and the rise and fall time of the signal is greater than 350ps. For example, the low-speed signal may be an I2C signal, an SPI signal, or a Cat5 network cable signal, or the like. The loss of the signal transmission component 100 is small, and the anti-signal crosstalk capability is better. The specifics will be introduced in detail below, and will not be repeated here. In this embodiment, the signal transmission assembly 100 has various setting manners. The signal transmission assembly 100 of each embodiment will be described in detail below with reference to the related drawings.

The first embodiment: please refer to FIG. 2 in combination with FIG. 1 d . FIG. 2 is an exploded schematic diagram of the signal transmission assembly 100 shown in FIG. 1 d . The signal transmission assembly 100 includes a first chip 10 , a first circuit board 20 and a cable module 30 . The first circuit board 20 cooperates with the cable module 30 to form the cable assembly 101 . The first chip 10 is used for transmitting high-speed signals and low-speed signals. The type of the first chip 10 is not specifically limited in this application. The first circuit board 20 may be a rigid circuit board, a flexible circuit board, or a flexible-rigid circuit board. The first circuit board 20 may be a FR-4 dielectric board, a Rogers (Rogers) dielectric board, or a mixed media board of Rogers and FR-4, and so on. Here FR-4 is the code name for a grade of fire-resistant materials. Rogers dielectric board is a high frequency board. Regarding the type of the first circuit board 20, the present application does not specifically limit it.

Please refer to FIG. 3 , which is a schematic structural diagram of the first chip 10 shown in FIG. 2 from another angle. The first chip 10 includes a first chip body 11 , a plurality of first signal pins 12 , a plurality of first ground pins 13 , a plurality of second signal pins 14 and a plurality of second ground pins 15 .

It should be noted that, FIG. 3 illustrates the first signal pin 12 , the first ground pin 13 , the second signal pin 14 and the second ground pin 15 respectively through different fillers. In this embodiment, the structures of the plurality of first signal pins 12 are all the same, and the first signal pins 12 may all use the same reference numerals. In addition, for the sake of brevity of the drawings, FIG. 3 only illustrates one first signal pin 12 . In other embodiments, the structures of the plurality of first signal pins 12 may also be different. The first signal pins 12 may use different numbers. The labeling of the first ground pin 13 , the second signal pin 14 and the second ground pin 15 may refer to the labeling of the first signal pin 12 . In addition, when there are a plurality of the same components in the following, the labeling method can also refer to the labeling method of the first signal pin 12. The specific details will not be repeated below.

In other embodiments, the number of the first signal pins 12 may also be one. The number of the first ground pins 13 may also be one. The second signal pin 14 may also be one. The second ground pin 1 can also be one. Specifically, this embodiment is not limited.

Wherein, the first signal pins 12 may be solder balls, pads, elastic pins or spring pins, and the like. The specific application is not limited, and can be selected flexibly according to product requirements. The first signal pin 12 in this embodiment is described by taking a solder ball as an example. In addition, the setting methods of the first ground pins 13 , the second signal pins 14 and the second ground pins 15 may refer to the setting methods of the first signal pins 12 .

Please refer to FIG. 3 again, the first chip body 11 includes an upper end surface 111 (refer to FIG. 2 ) and a lower end surface 112 facing oppositely. The lower end surface 112 of the first chip body 11 has a first region 1121 , a second region 1122 and a third region 1123 connected in sequence. It should be noted that, in FIG. 3 , the first area 1121 , the second area 1122 and the third area 1123 are schematically distinguished by dotted lines. It should be understood that, in this embodiment, the number, position, shape and size of the first area 1121 , the second area 1122 and the third area 1123 are not limited by FIG. 3 .

The plurality of first signal pins 12 and the plurality of first ground pins 13 are located in the first region 1121 . The first ground pin 13 is located around the first signal pin 12 . The plurality of first signal pins 12 and the plurality of first ground pins 13 may be arranged in an array. It should be understood that the arrangement of the first signal pins 12 and the first ground pins 13 in the first region 1121 is not limited to the arrangement shown in FIG. 3 .

In addition, the plurality of second signal pins 14 and the plurality of second ground pins 15 are located in the third region 1123 . The second signal pins 14 and the first signal pins 12 are located on the same side of the first chip body 11 . The second ground pins 15 are located around the second signal pins 14 . The plurality of second signal pins 14 and the plurality of second ground pins 15 may be arranged in rows and columns. It should be understood that the arrangement of the second signal pins 14 and the second ground pins 15 in the third region 1123 is not limited to the arrangement shown in FIG. 3 .

In addition, the second area 1122 is a blank area, that is, the second area 1122 is not provided with structures such as pins. In this way, the first signal pin 12 and the first ground pin 13 can be separated from the second signal pin 14 and the second ground pin 15 through the second region 1122 . In other embodiments, the first chip body 11 may also not include the second region 1122 . At this time, the first area 1121 is directly connected to the third area 1123 .

In this embodiment, the first signal pin 12 is used to transmit high-speed signals. For example, the first signal pin 12 is used to transmit a high-speed signal greater than or equal to 25Gbps. The first ground pin 13 is the ground reference of the first signal pin 12 , that is, the return path of the high-speed signal. The first ground pin 13 can shield signals on other signal pins (eg, the second signal pin 14 ), thereby improving the ability of the first signal pin 12 to resist signal crosstalk. In other embodiments, the signal transmitted by the first signal pin 12 is not specifically limited.

It should be understood that the number of the first signal pins 12 in this embodiment is multiple. Each of the first signal pins 12 is used for transmitting high-speed signals. In other embodiments, when the number of the first signal pins 12 is one. A first signal pin 12 can transmit high-speed signals. When the number of the first signal pins 12 is plural, at least one of the first signal pins 12 is used for transmitting high-speed signals. For example, when the number of the first signal pins 12 is two, one of the first signal pins 12 is used to transmit high-speed signals, and the other first signal pins 12 are used to transmit low-speed signals or power.

In this embodiment, the second signal pin 14 is used to transmit low-speed signals or power. The second ground pin 15 is the ground reference of the second signal pin 14 . The second ground pin 15 can shield signals on other signal pins (eg, the first signal pin 12 ), thereby improving the ability of the second signal pin 14 to resist signal crosstalk. In other embodiments, the signal transmitted by the second signal pin 14 is not specifically limited.

In other embodiments, by fixing a heat sink (not shown) on the upper end surface 111 of the first chip body 11 , when the first chip body 11 generates heat, the heat sink can reduce the temperature of the first chip body 11 , thereby reducing the temperature of the first chip body 11 . The reliability of the first chip 10 is improved.

Please refer to FIG. 4 in conjunction with FIG. 2 . FIG. 4 is a schematic structural diagram of the first circuit board 20 shown in FIG. 2 from another angle. The first circuit board 20 includes an upper end surface 21 and a lower end surface 22 facing oppositely (please refer to FIG. 2 ). The first circuit board 20 is provided with a first through hole 23 . The first through hole 23 penetrates from the upper end surface 21 of the first circuit board 20 to the lower end surface 22 of the first circuit board 20 , that is, the first through hole 23 penetrates through the upper end surface 21 of the first circuit board 20 and the first circuit board 20 the lower end face 22. The positions, sizes and shapes of the first through holes 23 are not limited to the positions, sizes and shapes shown in FIGS. 2 and 4 .

In addition, the first circuit board 20 has a plurality of third signal pins 24 and a plurality of third ground pins 25 . The third signal pins 24 may be pads, solder balls, elastic pins, spring pins, or the like. The specific application is not limited, and can be selected flexibly according to product requirements. The third signal pin 24 in this embodiment is described by taking a pad as an example. In addition, the setting method of the third ground pin 25 can refer to the setting method of the third signal pin 24 .

In addition, the plurality of third signal pins 24 and the plurality of third ground pins 25 are both located on the upper end surface 21 of the first circuit board 20 . A plurality of third signal pins 24 and a plurality of third ground pins 25 are disposed around the first through hole 23 . The plurality of third signal pins 24 and the plurality of third ground pins 25 may be arranged in rows and columns. The third ground pin 25 is located around the third signal pin 24 . Exemplarily, the arrangement of the third signal pins 24 on the first circuit board 20 is the same as the arrangement of the second signal pins 14 (refer to FIG. 3 ) on the first chip body 11 (refer to FIG. 3 ) . The arrangement of the third ground pins 25 on the first circuit board 20 is the same as the arrangement of the second ground pins 15 (refer to FIG. 3 ) on the first chip body 11 .

Please refer to FIG. 5 in combination with FIG. 3 and FIG. 4 . FIG. 5 is a partial cross-sectional schematic diagram of the signal transmission assembly 100 shown in FIG. 1d at the line A-A. The first chip 10 is fixed on the first circuit board 20 and is electrically connected to the first circuit board 20 . The lower end surface 112 of the first chip body 11 is disposed opposite to the upper end surface 21 of the first circuit board 20 , that is, the upper end surface 21 of the first circuit board 20 faces the first chip 10 . The upper end surface 111 of the first chip body 11 is disposed away from the upper end surface 21 of the first circuit board 20 . The lower end surface 22 of the first circuit board 20 is disposed opposite to the lower end surface 112 of the first chip body 11 . In addition, the first region 1121 of the first chip body 11 is disposed opposite to the first through hole 23 of the first circuit board 20 .

In addition, the plurality of second signal pins 14 of the first chip 10 and the plurality of third signal pins 24 of the first circuit board 20 are fixed and electrically connected in one-to-one correspondence. Exemplarily, the second signal pin 14 may be connected to the third signal pin 24 by a process such as laser welding or induction welding. At this time, the low-speed signal or power of the first chip 10 can be transmitted to the first circuit board 20 through the second signal pin 14 and the third signal pin 24 .

In addition, the plurality of second ground pins 15 of the first chip 10 and the plurality of third ground pins 25 of the first circuit board 20 are fixed and electrically connected in one-to-one correspondence. Exemplarily, the second ground pin 15 may be connected to the third ground pin 25 by a process such as laser welding or induction welding. In this way, the second ground pin 15 can be grounded through the third ground pin 25 .

Please refer to FIG. 6 , which is an exploded schematic view of the cable module 30 shown in FIG. 2 . The cable module 30 includes a first fixing base 31 and a plurality of cables 32 . It should be understood that the number, size and shape of the cables 32 are not limited to the number, size and shape shown in FIG. 6 . Illustratively, the number of cables 32 is the same as the number of the first signal pins 12 .

Please refer to FIG. 7 in combination with FIG. 6 . FIG. 7 is a schematic structural diagram of the first fixing seat 31 of the cable module 30 shown in FIG. 6 from another angle. End face 311 and lower end face 312. The first fixing seat 31 is provided with a plurality of second through holes 313 . Each second through hole 313 penetrates from the upper end surface 311 of the first fixing seat 31 to the lower end surface 312 of the first fixing seat 31 , that is, each second through hole 313 penetrates through the upper end surface 311 of the first fixing seat 31 and the lower end surface 312 of the first fixing seat 31 . It should be understood that the position, size and shape of the second through hole 313 are not limited to the position, size and shape shown in FIG. 6 and FIG. 7 .

Exemplarily, the number of the second through holes 313 is the same as the number of the cables 32 . The arrangement of the second through holes 313 is the same as that of the first signal pins 12 (refer to FIG. 3 ).

Please refer to FIG. 7 again, and as shown in FIG. 6 , the material of the first fixing base 31 is liquid crystal polymer (LCP). In this way, the first fixing seat 31 has better strength, corrosion resistance and electrical insulation. In other embodiments, the material of the first fixing seat 31 may be other plastic materials or insulating materials.

Exemplarily, the first fixing seat 31 may be formed by an injection molding process. At this time, the steps for forming the first fixing seat 31 are less, and the processing cost is lower.

Exemplarily, the first fixing base 31 can also be formed by processing a computerised numerical control machine (computerised numerical control machine, CNC). In this way, the size of the first fixing seat 31 and the size of the second through hole 313 are relatively accurate.

Please refer to FIG. 8 , which is a schematic structural diagram of the cable 32 of the cable module 30 shown in FIG. 6 . Since the structure of each cable 32 in this embodiment is the same, the following description will take one of the cables 32 as an example. The cable 32 includes a first end portion 321 , a middle portion 322 and a second end portion 323 which are connected in sequence. It should be noted that the distinction between the first end portion 321 of the cable 32 , the middle portion 322 of the cable 32 , and the second end portion 323 of the cable 32 is not strictly defined.

9a and 9b, FIG. 9a is an enlarged schematic view of the cable shown in FIG. 8 at line B1, and FIG. 9b is a schematic cross-sectional view of the cable 32 shown in FIG. 8 at line B2-B2. The cable 32 includes an inner conductor 324 , a dielectric layer 325 and an outer conductor 326 . The dielectric layer 325 is disposed around the outer peripheral surface 3241 of the inner conductor 324 and wraps the outer peripheral surface 3241 of the inner conductor 324 . The outer conductor 326 is disposed around the outer peripheral surface 3251 of the dielectric layer 325 and wraps the outer peripheral surface 3251 of the dielectric layer 325 . The dielectric layer 325 is located between the inner conductor 324 and the outer conductor 326 . Dielectric layer 325 separates inner conductor 324 and outer conductor 326 . At this time, the cable 32 forms a substantially coaxial line. It should be noted that, since the inner conductor 324 and the dielectric layer 325 are located inside the cable 32, FIG. 9a illustrates the inner conductor 324 and the dielectric layer 325 through different dotted lines.

Please refer to FIG. 9a again and in conjunction with FIG. 8 , the first end 321 of the cable 32 includes the first end 3242 of the inner conductor 324 , the first end 3252 of the dielectric layer 325 and the first end of the outer conductor 326 Section 3261. The end face 3211 of the first end portion 321 of the cable 32 includes the end face 3243 of the first end portion 3242 of the inner conductor 324 , the end face 3253 of the first end portion 3252 of the dielectric layer 325 and the end face of the first end portion 3261 of the outer conductor 326 3262. Similarly, the middle portion 322 of the cable 32 and the second end portion 323 of the cable 32 also include respective parts of the inner conductor 324 , the dielectric layer 325 and the outer conductor 326 . The details are not repeated here.

In this embodiment, the inner conductor 324 is composed of one wire. In its embodiment, the inner conductor 324 may also consist of multiple wires. Multiple wires can be intertwined to form a whole.

In this embodiment, the material of the inner conductor 324 may be a conductive material made of metal. For example, the material of the inner conductor 324 is copper, tin, aluminum, gold, silver, or copper-nickel alloy.

In this embodiment, the material of the dielectric layer 325 is an insulating material. The dielectric layer 325 can electrically insulate the inner conductor 324 from the outer conductor 326 . For example, the material of the dielectric layer 325 may be fluorinated ethylene propylene copolymer (fluorinated ethylene propylene, FEP) or polyolefin (Polyolefin).

In this embodiment, the material of the outer conductor 326 can be a conductive material made of metal. For example, the material of the outer conductor 326 is copper, nickel, gold, silver, copper-nickel alloy, or the like. The outer conductor 326 may be formed on the outer peripheral surface 3251 of the dielectric layer 325 by an electroplating process. At this time, the connection firmness between the outer conductor 326 and the dielectric layer 325 is strong.

In other embodiments, the cable 32 further includes a protective layer (not shown). The protective layer is disposed around the outer conductor 326 and wraps the outer conductor 326 . At this time, the protective layer may be used to protect the outer conductor 326 . The material of the protective layer can be polyethylene terephthalate (polyethylene terephthalate, PET) or mylar (Mylar: a tough polyester polymer).

Please refer to FIGS. 10 and 11 . FIG. 10 is a schematic structural diagram of the cable module 30 shown in FIG. 2 from another angle. FIG. 11 is an enlarged schematic view of the cable module 30 at C shown in FIG. 10 . The first end portion 321 of each cable 32 is fixed to the first fixing seat 31. Specifically, the first ends 321 of the plurality of cables 32 are fixed in the plurality of second through holes 313 of the first fixing seat 31 in a one-to-one correspondence, that is, the first end 321 of a cable 32 and a The wall of the second through hole 313 is fixed. It should be understood that the first end portion 321 of the cable 32 may be entirely located in the second through hole 313 , or may be partially located in the second through hole 313 . In this embodiment, the first end portion 321 of the cable 32 is partially located in the second through hole 313 .

There are various ways for connecting the first end 321 of the cable 32 to the first fixing seat 31 :

In one embodiment, after the first fixing seat 31 is processed and formed, the first end 321 of each cable 32 is inserted into a second through hole 313 . Then, glue is filled between the first end 321 of the cable 32 and the hole wall of the second through hole 313 . After the adhesive is cured, the first end 321 of the cable 32 is fixed in the second through hole 313 .

In one embodiment, a plurality of cables 32 are bundled into a whole. The first ends 321 of the plurality of cables 32 are then injection-molded by using a mold. After the plastic material is cured, the first fixing seat 31 is formed. At this time, the first ends 321 of the plurality of cables 32 are also fixed on the first fixing seat 31 .

In this embodiment, since the arrangement of the second through holes 313 is the same as the arrangement of the first signal pins 12 (refer to FIG. 3 ), when the first ends 321 of the plurality of cables 32 are in one-to-one correspondence When grounded in the plurality of second through holes 313 of the first fixing base 31 , the arrangement of the first end portions 321 of the plurality of cables 32 is the same as the arrangement of the first signal pins 12 .

In this embodiment, by fixing the first end 321 of each cable 32 to the first fixing seat 31 , a plurality of cables 32 can be combined and fixed as a whole. 2 and 10 both illustrate that the second end 323 of each cable 32 is an open end, that is, the second end 323 of the cable 32 is not provided with the first fixing seat 31 . In other embodiments, the cable module 30 may also include a third fixing seat. The third fixing seat fixes the second end 323 of the cable 32 . The solution will be described in detail below with reference to the relevant drawings. I won't go into details here.

Please refer to FIG. 11 again and in conjunction with FIG. 9 a , when the first end 321 of the cable 32 is fixed to the first fixing seat 31 , the end face 3243 of the first end 3242 of the inner conductor 324 and the first end 324 of the dielectric layer 325 Both the end surface 3253 of the one end portion 3252 and the end surface 3262 of the first end portion 3261 of the outer conductor 326 are exposed relative to the upper end surface 311 of the first fixing seat 31 .

Exemplarily, the end surface 3243 of the first end portion 3242 of the inner conductor 324 , the end surface 3253 of the first end portion 3252 of the dielectric layer 325 , and the end surface 3262 of the first end portion 3261 of the outer conductor 326 are connected to the upper surface of the first fixing seat 31 . The end face 311 is flush. In this way, the inner conductor 324 , the dielectric layer 325 and the outer conductor 326 will not greatly affect the flatness of the upper end surface 311 of the first fixing seat 31 .

It should be understood that when the first ends 321 of the plurality of cables 32 are fixed on the first fixing seat 31, the first fixing seat 31 and the plurality of cables 32 may be cut so that the inner conductor 324, the dielectric layer 325 and the outer conductor 326 are exposed relative to the upper end surface 311 of the first fixing seat 31 . At this time, the first fixing seat 31 , the inner conductor 324 , the dielectric layer 325 and the outer conductor 326 are polished again, so that the end face 3243 of the first end portion 3242 of the inner conductor 324 and the end face 3243 of the first end portion 3252 of the dielectric layer 325 are The end surface 3253 and the end surface 3262 of the first end portion 3261 of the outer conductor 326 are flush with the upper end surface 311 of the first fixing seat 31 .

Please refer to FIG. 12 and FIG. 13 . FIG. 12 is an enlarged schematic view of the cable module 30 at D shown in FIG. 2 . FIG. 13 is a schematic cross-sectional view of the cable module 30 shown in FIG. 12 at the position E-E. The cable module 30 also includes a first ground layer 314 . A part of the first ground layer 314 is located on the upper end surface 311 of the first fixing base 31 . Another part of the first ground layer 314 is located on the end surface 3262 of the first end portion 3261 of the outer conductor 326 . The material of the first ground layer 314 may be a conductive material such as copper, tin, aluminum, gold, silver, or copper-nickel alloy.

The first ground layer 314 is fixed to the outer conductor 326 of each cable 32 . At this time, the outer conductors 326 of the two adjacent cables 32 are fixed by the first ground layer 314 . In addition, the first ground layer 314 is also electrically connected to the outer conductor 326 of each cable 32 , that is, the first ground layer 314 and the outer conductor 326 of each cable 32 can be electrically connected to each other. In this way, when the first ground layer 314 is grounded, the outer conductors 326 of each cable 32 are also grounded.

Exemplarily, the first ground layer 314 is fixed and electrically connected to the outer conductor 326 of each cable 32 by means of electroplating, sputtering, deposition or evaporation.

In addition, the first ground layer 314 is also insulated from the inner conductor 324 of each cable 32 . Illustratively, by disconnecting the first ground layer 314 from the inner conductor 324 of each cable 32 , that is, the first ground layer 314 is not in contact with the inner conductor 324 of each cable 32 . In this way, the first ground layer 314 is insulated from the inner conductor 324 of each cable 32 .

In other embodiments, the cable module 30 may also not include the first ground layer 314 .

Please refer to FIGS. 12 and 13 again, the cable module 30 includes a plurality of first pads 315 . The first pad 315 and the first ground layer 314 are located on the same side of the first fixing base 31 . The shape of the first pad 315 is not limited to the disk shape shown in FIG. 12 . The material of the first pad 315 may be a conductive material such as copper, tin, aluminum, gold, silver, or copper-nickel alloy.

In addition, the plurality of first pads 315 are fixed in one-to-one correspondence with the inner conductors 324 of the plurality of cables 32 . The plurality of first pads 315 are electrically connected to the inner conductors 324 of the plurality of cables 32 in a one-to-one correspondence, that is, one first pad 315 and the inner conductor 324 of one cable 32 can be electrically connected to each other. Taking one of the first pads 315 as an example for description, a part of the first pad 315 is fixed to the end surface 3243 of the first end portion 3242 of the inner conductor 324 . Another part of the first pad 315 is fixed to the end surface 3253 of the first end portion 3252 of the dielectric layer 325 .

In addition, each of the first pads 315 is also insulated from the first ground layer 314 . Exemplarily, by disconnecting the first ground layer 314 from each of the first pads 315, that is, the first ground layer 314 is not in contact with each of the first pads 315, so that the first ground layer 314 is connected to each of the first pads 315. The first pads 315 are provided in isolation.

Exemplarily, the first pads 315 are fixed on the inner conductors 324 of each cable 32 through processes such as electroplating, sputtering, deposition, or evaporation, and the first pads 315 are electrically connected.

In this embodiment, since the arrangement of the plurality of cables 32 is the same as the arrangement of the first signal pins 12 (refer to FIG. 3 ), when the plurality of first pads 315 and the plurality of cables 32 are arranged in the same manner When the inner conductors 324 are fixed in one-to-one correspondence, the arrangement of the first pads 315 is also the same as the arrangement of the first signal pins 12 .

In other embodiments, the cable module 30 may also not include the first pad 315 .

Please refer to FIGS. 12 and 13 again, the cable module 30 includes a plurality of second pads 316 . The shape of the second pad 316 is not limited to the disk shape illustrated in FIG. 12 . The material of the second pad 316 may be a conductive material such as copper, tin, aluminum, gold, silver, or copper-nickel alloy.

In addition, the plurality of second pads 316 are fixed on the surface of the first ground layer 314 away from the first fixing base 31 . At this time, the plurality of second pads 316 and the first ground layer 314 form an integral body. In addition, each of the second pads 316 is electrically connected to the first ground layer 314 . When the first ground layer 314 is grounded, each of the second pads 316 may also be grounded.

Exemplarily, each second pad 316 is fixed to the first ground layer 314 through a process such as electroplating, sputtering, deposition or evaporation.

In addition, a plurality of second pads 316 are provided insulated from each of the first pads 315 . Exemplarily, by disposing each second pad 316 from each first pad 315, that is, each second pad 316 is not in contact with each first pad 315, so that each The two bonding pads 316 are insulated from each of the first bonding pads 315 .

Exemplarily, the arrangement of the second pads 316 is the same as the arrangement of the first ground pins 13 (refer to FIG. 3 ).

In other embodiments, the cable module 30 may not include the second pad 316 .

Please refer to FIG. 14. FIG. 14 is a schematic cross-sectional view of the signal transmission assembly 100 shown in FIG. 1d at the line A-A. At least part of the first fixing seat 31 of the cable module 30 is located in the first through hole 23 of the first circuit board 20 , and the first fixing seat 31 fixes the first circuit board 20 . The first fixing seat 31 may be partially located in the first through hole 23 , or may be completely located in the first through hole 23 . FIG. 14 shows that part of the first fixing seat 31 is located in the first through hole 23 . In addition, the end face 3211 of the first end portion 321 of the cable 32 faces the first chip 10 , that is, the end face 3211 of the first end portion 321 of the cable 32 and the upper end face 21 of the first circuit board 20 both face the first fixing seat 31 on the same side.

It should be understood that there are various ways for the first fixing base 31 to be fixed to the first circuit board 20 .

In one embodiment, the first fixing seat 31 and the hole wall of the first through hole 23 are fixed by interference fit.

In one embodiment, the first fixing base 31 is fixed to the first circuit board 20 by a structural member or a locking member.

Exemplarily, by arranging adhesive (eg glue or double-sided tape) between the first fixing seat 31 and the hole wall of the first through hole 23 , the first fixing seat 31 is bonded to the first circuit board 20 .

Exemplarily, the first fixing seat 31 is locked to the first circuit board 20 by fasteners (eg, screws, screws or pins, etc.). It should be understood that the shape of the first fixing seat 31 can be flexibly adjusted according to requirements, so as to facilitate the fastener to lock the first fixing seat 31 to the first circuit board 20 .

In this embodiment, when the first fixing seat 31 of the cable module 30 fixes the first circuit board 20 , the cable module 30 and the first circuit board 20 form a whole, that is, the cable assembly 101 . The cable assembly 101 can be used as a stand-alone product.

Referring to FIG. 14 again, a plurality of first pads 315 are fixed to a plurality of first signal pins 12 in a one-to-one correspondence, that is, one first pad 315 can be fixed to one first signal pin 12 . In addition, the plurality of first pads 315 are electrically connected to the plurality of first signal pins 12 in one-to-one correspondence, that is, one first pad 315 may be electrically connected to one first signal pin 12 . Exemplarily, the first signal pin 12 may be fixed to the first pad 315 by a process such as laser welding or induction welding. At this time, the high-speed signal of the first chip 10 can be transmitted to the inner conductor 324 of the cable 32 through the first signal pin 12 and the first pad 315 .

In this embodiment, the number of cables 32 is plural. The inner conductor 324 of each cable 32 is used to transmit high-speed signals. In other embodiments, when the number of cables 32 is one. The inner conductor 324 of a cable 32 can transmit high-speed signals. When the number of cables 32 is plural, the inner conductor 324 of at least one cable 32 is used to transmit high-speed signals. For example, when the number of cables 32 is two, the inner conductor 324 of one cable 32 is used to transmit high-speed signals, and the inner conductor 324 of the other cable 32 is used to transmit low-speed signals or power.

In other embodiments, when the cable module 30 is not provided with the first pads 315 , the plurality of first signal pins 12 of the first chip 10 and the inner conductors 324 of the plurality of cables 32 are fixed in a one-to-one correspondence. In addition, the plurality of first signal pins 12 of the first chip 10 are electrically connected to the inner conductors 324 of the plurality of cables 32 in a one-to-one correspondence.

Referring to FIG. 14 again, the plurality of second pads 316 are fixed to the plurality of first ground pins 13 in one-to-one correspondence, that is, one second pad 316 is fixed to one first ground pin 13 . In addition, the plurality of second pads 316 are electrically connected to the plurality of first ground pins 13 in a one-to-one correspondence, that is, one second pad 316 is electrically connected to one first ground pin 13 . In this way, the first ground pin 13 can be electrically connected to the outer conductor 326 of the cable 32 through the second pad 316 and the first ground layer 314 .

Exemplarily, the first ground pin 13 may be fixed to the second pad 316 by a process such as laser welding or induction welding.

In other embodiments, when the cable module 30 is not provided with the second pads 316 , the plurality of first ground pins 13 are all fixed to the first ground layer 314 . In addition, the plurality of first ground pins 13 are all electrically connected to the first ground layer 314 .

In other embodiments, when the cable module 30 is not provided with the first ground layer 314 , the first ground pin 13 can be directly electrically connected to the outer conductor 326 of the cable 32 .

The structure of a signal transmission assembly 100 is described in detail above with reference to the related drawings. Among them, the signal transmission component 100 can transmit high-speed signals. The maximum transmission bandwidth of high-speed signals can reach 112Gbps. It should be understood that when the signal transmission assembly 100 can transmit high-speed signals, the communication system places a lower loss requirement on the signal transmission assembly 100 . For example, the CEI-112G-LR-PAM4 standard requires a signal transmission component of 28dB@fb/2 (fb is the Nyquist frequency point of the signal. In other words, although the maximum transmission bandwidth of the signal transmission component can reach 112Gbps, the signal The loss of the transmission component is greater than 28dB@fb/2, and the signal transmission component still cannot be applied to the communication system. In this embodiment, by setting a new structure of the signal transmission component 100, the first chip 10 can be The signal pins 12 (pins used for transmitting high-speed signals) are directly and electrically connected to the cables 32, so that the maximum transmission bandwidth of the signal transmission component 100 can reach 112 Gbps, and the signal loss can also be reduced to a large extent to meet the requirements of the communication system. low loss requirements. The details are as follows:

First, a cable module 30 structure is provided. The cable module 30 includes a first fixing base 31 and a plurality of cables 32 . The first fixing seat 31 is provided with a plurality of second through holes 313 . Each second through hole 313 penetrates from the upper end surface 311 of the first fixing seat 31 to the lower end surface 312 of the first fixing seat 31 , that is, each second through hole 313 penetrates through the upper end surface 311 of the first fixing seat 31 and the lower end surface 312 of the first fixing seat 31 . The first ends 321 of the plurality of cables 32 are fixed in the plurality of second through holes 313 of the first fixing seat 31 in a one-to-one correspondence.

Next, a first circuit board 20 structure is provided. The first circuit board 20 is provided with a first through hole 23 . The first through hole 23 penetrates from the upper end surface 21 of the first circuit board 20 to the lower end surface 22 of the first circuit board 20 , that is, the first through hole 23 penetrates through the upper end surface 21 of the first circuit board 20 and the first circuit board 20 the lower end face 22.

Finally, a signal transmission assembly 100 structure is provided. The first fixing seat 31 of the cable module 30 is fixed in the first through hole 23 of the first circuit board 20 . The plurality of first signal pins 12 of the first chip 10 are electrically connected to the inner conductors 324 of the plurality of cables 32 in a one-to-one correspondence.

It should be understood that, compared with the conventional signal transmission assembly, the first signal pin 12 of the signal transmission assembly 100 of the present embodiment can be directly electrically connected to the inner conductor 324 of the cable 32 . The first chip 10 and the cable 32 can be connected substantially at zero distance, that is, a section of PCB connection and electrical connector connection can be omitted between the first signal pin 12 of the first chip 10 and the cable 32 . In this way, between the first signal pin 12 and the inner conductor 324 of the cable 32, the signal loss caused by the PCB trace (or the PCB via hole) and the signal loss caused by the electrical connector can be reduced. It should be understood that by reducing the signal loss of the PCB traces (or PCB vias) and the signal loss of the electrical connector, the loss of the signal transmission assembly 100 can be reduced to a great extent, and it is necessary for the signal transmission assembly 100 to meet the low loss requirement. extremely important.

Secondly, the signal transmission assembly 100 of this embodiment can also solve some technical problems. details as follows:

Compared with the traditional signal transmission component, in this embodiment, since the first signal pin 12 of the first chip 10 can be directly electrically connected to the inner conductor 324 of the cable 32 , the first signal pin 12 is connected to the cable 32 . The connection position between the first signal pin 12 and the PCB, the connection position between the PCB and the electrical connector, and the connection position between the electrical connector and the cable 32 can be omitted between the inner conductors 324 . In this way, there are fewer connection positions between the first signal pin 12 and the inner conductor 324 of the cable 32, and the number of discontinuous points of the signal channel is less, which is beneficial to improve the fluctuation of the insertion loss and the resonance of the signal channel.

In addition, compared with the conventional signal transmission assembly, the signal transmission assembly 100 of this embodiment can omit the via package between the first signal pin 12 and the PCB, the via package between the electrical connector and the PCB, and the electrical connector and the wire cable packaging. The structure of the signal transmission assembly 100 of this embodiment is relatively simple.

In addition, when the connection position between the first signal pin 12 and the inner conductor 324 of the cable 32 is reduced, and the number of discontinuous points of the signal channel is small, the signal outside the signal transmission assembly 100 is not easy to pass through the first signal lead. The connection position between the pin 12 and the inner conductor 324 of the cable 32 is coupled into the signal transmission assembly 100 , that is, the coupling position of the signal crosstalk is reduced, thereby reducing the signal crosstalk to a greater extent.

In addition, since the first signal pin 12 of the first chip 10 can be directly electrically connected to the inner conductor 324 of the cable 32 , the high-speed signal does not need to be transmitted to the cable 32 via the PCB and the electrical connector. In this way, on the one hand, in this embodiment, there is no need to worry about the influence of the loss and deterioration of the high-speed signal on the first circuit board 20 of the low-level material, that is, the material of the first circuit board 20 can be made of a low-level material, so as to maximize the efficiency of the first circuit board 20 . The cost of the first circuit board 20 is reduced; on the other hand, the first chip 10 can implement signal transmission with a lower active driving cost, thereby reducing system power consumption.

In addition, since the cable of the traditional signal transmission assembly is electrically connected to the PCB through the electrical connector, the electrical connector disposed around the chip will seriously interfere with the cooling air duct of the chip and occupy the layout space of the PCB. 100 eliminates the need for electrical connectors. At this time, the heat dissipation air duct of the first chip 10 is no longer disturbed by the electrical connector. In addition, the layout space of the PCB can also be greatly improved, that is, the space utilization rate of the PCB can be improved.

In this embodiment, the signal transmission assembly 100 also has some advantages. details as follows:

First, the cable module 30 further includes a plurality of first pads 315 . The plurality of first pads 315 are fixed in one-to-one correspondence with the inner conductors 324 of the plurality of cables 32 . In this way, a one-to-one correspondence between the inner conductors 324 of the multiple cables 32 and the multiple first signal pins 12 can be achieved by fixing the multiple first pads 315 and the multiple first signal pins 12 in one-to-one correspondence. fixed. It should be understood that the first pad 315 can increase the end surface area of the inner conductor 324 of the cable 32 . The connection process between the first pad 315 and the first signal pin 12 is simpler, which is beneficial to reduce the assembly difficulty of the cable module 30 .

In addition, by disposing the first ground layer 314 on the upper end surface 311 of the first fixing base 31 , the first ground layer 314 is fixed to the outer conductor 326 of each cable 32 . The first ground plane 314 may connect the outer conductors 326 of each cable 32 as a whole. In this way, the plurality of first ground pins 13 and the outer conductors 326 of the plurality of cables 32 are connected by the first ground layer 314 being fixed to the plurality of first ground pins 13 of the first chip 10 . It should be understood that the first ground layer 314 may increase the end face area of the outer conductor 326 of the cable 32 . The connection process between the first ground layer 314 and the first ground pins 13 is simpler, which is beneficial to reduce the assembly difficulty of the cable module 30 .

In addition, the cable module 30 includes a plurality of second pads 316 . The plurality of second pads 316 are fixed on the surface of the first ground layer 314 away from the first fixing base 31 . The second pad 316 facilitates the fixed connection between the first ground pin 13 and the first ground layer 314 .

A signal transmission assembly 100 is described in detail above with reference to the relevant drawings, and a method for manufacturing the signal transmission assembly 100 is described in detail below. The preparation method of the signal transmission assembly 100 includes:

Please refer to FIG. 11 again and in conjunction with FIG. 9 a , fix the first end 321 of the cable 32 to the first fixing seat 31 , wherein the end surface 3211 of the first end 321 of the cable 32 is exposed relative to the first fixing seat 31 ;

Illustratively, the first ends 321 of the plurality of cables 32 are injection molded through a mold. After the plastic material is cured, the first fixing seat 31 is formed. At this time, the first ends 321 of the plurality of cables 32 are also fixed on the first fixing seat 31 . Then, the first fixing seat 31 and the plurality of cables 32 are cut so that the end surface of the first end portion 321 of each cable 32 is exposed relative to the first fixing seat 31 .

Exemplarily, the first fixing seat 31 is formed by machining through a CNC process. The first end 321 of each cable 32 is inserted into a second through hole 313 and exposed relative to the first fixing seat 31 . Then, glue is filled between the first end 321 of the cable 32 and the hole wall of the second through hole 313 . After the adhesive is cured, the first end 321 of the cable 32 is fixed in the second through hole 313 .

Please refer to FIG. 14 again, the first fixing seat 31 is fixed in the first through hole 23 of the first circuit board 20 , wherein the first through hole 23 penetrates through the upper end surface 21 of the first circuit board 20 and the first circuit board 20 the lower end face 22.

Exemplarily, the first fixing seat 31 and the hole wall of the first through hole 23 are fixed by interference fit.

Exemplarily, the first fixing base 31 is fixed to the first circuit board 20 by a structural member or a locking member. For example, by disposing adhesive (eg glue or double-sided tape) between the first fixing seat 31 and the hole wall of the first through hole 23 , the first fixing seat 31 is bonded to the first circuit board 20 . For another example, the first fixing base 31 is locked to the first circuit board 20 by means of fasteners (eg, screws, screws or pins, etc.). It should be understood that the shape of the first fixing seat 31 can be flexibly adjusted according to requirements, so as to facilitate the fastener to lock the first fixing seat 31 to the first circuit board 20 .

In one embodiment, before the step of "fixing the first end 321 of the cable 32 to the first fixing seat 31", the preparation method of the signal transmission assembly 100 further includes:

Referring to FIG. 9 a again, a dielectric layer 325 is formed on the outer peripheral surface 3241 of the inner conductor 324 . The material of the inner conductor 324 may be a conductive material made of metal. For example, the material of the inner conductor 324 is copper, tin, aluminum, gold, silver, or copper-nickel alloy. The material of the dielectric layer 325 is an insulating material. For example, the material of the dielectric layer 325 may be FEP or Polyolefin.

Referring to FIG. 9a again, the outer conductor 326 is formed on the outer peripheral surface 3251 of the dielectric layer 325 . The dielectric layer 325 can electrically insulate the inner conductor 324 from the outer conductor 326 . Exemplarily, the outer conductor 326 may be formed on the outer peripheral surface 3251 of the dielectric layer 325 by an electroplating process. At this time, the connection firmness between the outer conductor 326 and the dielectric layer 325 is strong.

9a and 11, when the first end 321 of the cable 32 is fixed to the first fixing seat 31, the end face 3243 of the first end 3242 of the inner conductor 324 and the first end 3252 of the dielectric layer 325 Both the end surface 3253 of the outer conductor 326 and the end surface 3262 of the first end portion 3261 of the outer conductor 326 may be exposed relative to the first fixing seat 31 .

In one embodiment, after the step of "fixing the first end 321 of the cable 32 to the first fixing seat 31", the method for preparing the signal transmission assembly 100 further includes:

Referring to FIGS. 12 and 13 , a first pad 315 is formed on the end face 3243 of the first end portion 3242 of the inner conductor 324 and the end face 3253 of the first end portion 3252 of the dielectric layer 325 ; wherein the first pad 315 is electrically Connected to the inner conductor 324 of the cable 32 , the first pad 315 is further insulated from the first ground layer 314 . Exemplarily, by electroplating, sputtering, deposition or evaporation, etc., a first solder joint is formed on the end face 3243 of the first end portion 3242 of the inner conductor 324 and the end face 3253 of the first end portion 3252 of the dielectric layer 325 . Disc 315.

Please refer to FIGS. 12 and 13 , a first ground layer 314 is formed on the upper end surface 311 of the first fixing base 31 , wherein the first ground layer 314 is fixed and electrically connected to the outer conductor 326 of the cable 32 , and the first ground layer 314 is also provided insulated from the inner conductor 324 of the cable 32 . Exemplarily, the first ground layer 314 is formed on the upper end surface 311 of the first fixing seat 31 through electroplating, sputtering, deposition or evaporation and other processes, and is fixed to the outer conductor 326 of the cable 32 .

It can be understood that the first ground layer 314 may be in conduction with the outer conductor 326 of the cable 32 . In this way, when the first ground layer 314 is grounded, the outer conductors 326 of the cables 32 are also grounded.

In one embodiment, after the step of "forming the first ground layer 314 on the upper end surface 311 of the first fixing base 31", the method for preparing the signal transmission assembly 100 further includes:

Referring to FIG. 12 and FIG. 13 , second pads 316 are formed on the surface of the first ground layer 314 away from the first fixing base 31 . Exemplarily, the second pad 316 is formed on the surface of the first ground layer 314 away from the first fixing seat 31 by a process such as electroplating, sputtering, deposition or evaporation.

In one embodiment, after "fixing the first fixing seat 31 in the first through hole 23 of the first circuit board 20", the method for preparing the signal transmission assembly 100 further includes:

Please refer to FIG. 5 , the second signal pin 14 and the second ground pin 15 of the first chip 10 are fixed to the first circuit board 20 and are electrically connected to the first circuit board 20 ; exemplarily, the second signal pin 14 can be connected to the third signal pin 24 by a process such as laser welding or induction welding. The second ground pin 15 may be connected to the third ground pin 25 by a process such as laser welding or induction welding.

In other embodiments, the step "the second signal pin 14 and the second ground pin 15 of the first chip 10 are fixed to the first circuit board 20 and electrically connected to the first circuit board 20" can also be The first fixing seat 31 is fixed in the first through hole 23 of the first circuit board 20 ” before.

Referring to FIG. 14 , the first signal pin 12 of the first chip 10 is fixed to the inner conductor 322 of the cable 32 and is electrically connected to the inner conductor 322 of the cable 32 . Exemplarily, the plurality of first signal pins 12 and the plurality of first pads 315 are welded in a one-to-one correspondence with laser welding or induction welding. At this time, the high-speed signal of the first chip 10 can be transmitted to the inner conductor 324 of the cable 32 through the first signal pin 12 and the first pad 315 .

A signal transmission assembly 100 and a manufacturing method thereof are specifically described above with reference to the related drawings, and it is introduced that the signal transmission assembly 100 can solve some technical problems of the conventional signal transmission assembly 100 . Hereinafter, several arrangement manners of the signal transmission assembly 100 will be introduced again with reference to the related drawings. The following signal transmission assembly 100 can not only solve the above technical problems, but also solve some additional technical problems.

In the second embodiment, the same technical content as the first embodiment will not be repeated: please refer to Fig. 15a and Fig. 15b, Fig. 15a is another embodiment of the signal transmission assembly 100 shown in Fig. 1d at the A-A line Fig. 15b is an enlarged schematic view of the signal transmission assembly 100 shown in Fig. 15a at F. The cable module 30 includes a plurality of first elastic pieces 317 . The shape of the first elastic piece 317 is not limited to the hook shape shown in FIGS. 15 a and 15 b . The material of the first elastic piece 317 may be a conductive material such as copper, tin, aluminum, gold, silver, or copper-nickel alloy.

Wherein, each of the first pads 315 defines a first groove 3151 . The opening of the first groove 3151 faces away from the side of the cable 32 . The shape of the first groove 3151 is not limited to the rectangular shape shown in FIG. 15b.

In addition, the plurality of first elastic pieces 317 are fixed to the plurality of first pads 315 in a one-to-one correspondence, and parts of the first elastic pieces 317 are disposed in the first grooves 3151 .

In this embodiment, the first elastic piece 317 and the first pad 315 have various connection methods.

Exemplarily, the first elastic piece 317 may be in interference fit with the groove wall of the first groove 3151 .

Exemplarily, the first elastic piece 317 may be fixed to the groove wall of the first groove 3151 through a welding process.

It should be understood that by opening the first groove 3151 in the first pad 315 and fixing part of the first elastic sheet 317 in the first groove 3151, the connection between the first elastic sheet 317 and the first bonding pad 315 can be increased. Therefore, the connection area between the first elastic sheet 317 and the first pad 315 is increased, and the connection stability between the first elastic sheet 317 and the first pad 315 is improved.

In other embodiments, the first pad 315 may not have the first groove 3151 . At this time, the plurality of first elastic pieces 317 can be directly fixed to the plurality of first pads 315 in a one-to-one correspondence.

Referring to FIGS. 15 a and 15 b again, the plurality of first elastic pieces 317 are in contact with the plurality of first signal pins 12 in one-to-one correspondence. At this time, the plurality of first elastic pieces 317 and the plurality of first signal pins 12 can also be electrically connected. In this way, the high-speed signal of the first chip 10 can be transmitted to the inner conductor 324 of the cable 32 through the first signal pin 12 , the first elastic piece 317 and the first pad 315 . It should be noted that the first signal pin 12 in this embodiment is in the form of a pad, which can increase the contact area between the first signal pin 12 and the first elastic sheet 317 , which is beneficial to improve the The electrical connection stability between the elastic pieces 317. In other embodiments, the first signal pin 12 may also adopt other structural forms.

It should be understood that, for the solution in which the first signal pin 12 is directly fixed to the first pad 315, since the first signal pin 12 and the first pad 315 are located between the first chip body 11 and the first fixing seat 31, a On the one hand, it is difficult to fix the first signal pin 12 and the first pad 315. On the other hand, when the first fixing seat 31 is fixed to the first circuit board 20, it is difficult for the first pad 315 to connect with the first circuit The third signal pin 24 of the board 20 is at the same level, so that if the distance between the third signal pin 24 and the second signal pin 14 is a standard distance, the first signal pin 12 and the first pad 315 The distance between them is not easy to be at a standard distance, that is, the distance between the first signal pin 12 and the first pad 315 is prone to errors. In this way, the first signal pins 12 are not easily fixed to the first pads 315 . In this embodiment, by fixing a first elastic piece 317 on each first pad 315, on the one hand, although the first elastic piece 317 and the first signal pin 12 are located on the first chip body 11 and the first fixing seat 31, but due to the elasticity of the first elastic piece 317, the first elastic piece 317 can be in contact with the first signal pin 12 to achieve stable electrical connection. In this way, the electrical connection between the first elastic piece 317 and the first signal pin 12 is relatively simple. On the other hand, when the first fixing base 31 is fixed on the first circuit board 20 , it is difficult for the first pad 315 to be at the same level as the third signal pin 24 of the first circuit board 20 . At this time, due to the elasticity of the first elastic piece 317, the first elastic piece 317 can absorb the error of the distance between the first elastic piece 317 and the first signal pin 12, thereby ensuring that the first signal pin 12 can be stably electrically connected to the first signal pin 12. A shrapnel 317.

In addition, by arranging the first elastic piece 317 on the first pad 315 , the assembly method of the signal transmission assembly 100 can also be changed, thereby reducing the assembly difficulty of the signal transmission assembly 100 . Specifically, when the first fixing seat 31 is inserted into the first through hole 23 of the first circuit board 20 , the first fixing seat 31 and the first circuit board 20 are first fixed without adhesive. After the plurality of first elastic pieces 317 are in contact with the plurality of first signal pins 12 in a one-to-one correspondence, the first fixing seat 31 and the first circuit board 20 are fixed by adhesive. In this way, compared to the method of fixing the first fixing seat 31 to the first circuit board 20 first, and then fixing the first signal pin 12 to the first elastic piece 317 , the present embodiment does not need to consider the first elastic piece 317 and the first elastic piece 317 in advance. Whether the three signal pins 24 are at the same level, that is, the flatness of the first fixing base 31 and the first circuit board 20 need not be considered too much. In this way, the connection between the first chip 10 and the first circuit board 20 and the cable module 30 is relatively simple. Therefore, by arranging the first elastic piece 317 on the first pad 315 , the flexibility of the connection between the first chip 10 and the first circuit board 20 and the cable module 30 can be increased.

Referring to FIG. 15 a again, the cable module 30 further includes a plurality of second elastic pieces 318 . The plurality of second elastic pieces 318 are fixed to the plurality of second pads 316 in a one-to-one correspondence. The second elastic piece 318 may be located on the side of the second pad 316 away from the first ground layer 314 . The arrangement of the second elastic piece 318 may refer to the arrangement of the first elastic piece 317 . For the connection method of the second elastic sheet 318 and the second pad 316 , please refer to the connection method of the first elastic sheet 317 and the first pad 315 . For the connection method of the second elastic piece 318 and the first ground pin 13 of the first chip 10 , please refer to the connection method of the first elastic piece 317 and the first signal pin 12 . The details are not repeated here.

In the third embodiment, the same technical content as the first embodiment will not be repeated: please refer to FIG. 16 and FIG. 17 . FIG. 16 is a schematic structural diagram of the receptacle connector 40 provided by the embodiment of the present application. FIG. 17 is a schematic cross-sectional view of still another embodiment of the signal transmission assembly 100 shown in FIG. 1d at the line A-A. The socket connector 40 includes a base 41 , a plurality of first signal springs 42 , a plurality of first ground springs 43 , a plurality of second signal springs 44 and a plurality of second ground springs 45 . It should be noted that, FIG. 16 illustrates the first signal spring 42 , the first ground spring 43 , the second signal spring 44 and the second ground spring 45 respectively through different fillers. It should be noted that, FIGS. 16 and 17 only schematically show some components included in the socket connector 40 , and the actual shapes, actual sizes and actual structures of these components are not limited by FIGS. 16 and 17 .

Please refer to FIGS. 16 and 17 again, the base 41 includes an upper end surface 411 and a lower end surface 412 facing oppositely. The base 41 includes a first part 4121 , a second part 4122 and a third part 4123 which are connected in sequence. It should be noted that, both FIG. 16 and FIG. 17 schematically divide the base 41 into a first part 4121 , a second part 4122 and a third part 4123 by dotted lines. It should be understood that FIG. 16 only schematically shows an embodiment of the first part 4121 , the second part 4122 and the third part 4123 . The shape and size are not limited by FIGS. 16 and 17 .

The plurality of first signal springs 42 and the plurality of first ground springs 43 are located in the first portion 4121 . The first ground spring 43 is located at the periphery of the first signal spring 42 . In this embodiment, the arrangement of the first signal elastic pieces 42 is the same as the arrangement of the first signal pins 12 . The arrangement of the first ground spring pieces 43 is the same as the arrangement of the first ground pins 13 . In other embodiments, the arrangement of the first signal elastic pieces 42 may also be different from the arrangement of the first signal pins 12 . The arrangement of the first ground spring pieces 43 may also be different from the arrangement of the first ground pins 13 .

In addition, a plurality of second signal springs 44 and a plurality of second ground springs 45 are located in the third portion 4123 . The second ground spring 45 is located at the periphery of the second signal spring 44 . In this embodiment, the arrangement of the second signal elastic pieces 44 is the same as the arrangement of the second signal pins 14 . The arrangement of the second ground spring pieces 45 is the same as the arrangement of the second ground pins 15 . In other embodiments, the arrangement of the second signal elastic pieces 44 may also be different from the arrangement of the second signal pins 14 . The arrangement of the second ground spring pieces 45 may also be different from the arrangement of the second ground pins 15 .

In addition, the second portion 4122 is a blank area, that is, the second portion 4122 is not provided with an elastic sheet structure. In this way, the plurality of first signal springs 42 and the plurality of first ground springs 43 can be disposed separately from the second portion 4122 , the plurality of second signal springs 44 and the plurality of second ground springs 45 . In other embodiments, the base 41 may also not include the second portion 4122 . At this time, the first part 4121 is directly connected to the third part 4123 .

Please refer to FIG. 17 again, the socket connector 40 is disposed between the first chip 10 and the first circuit board 20 . The socket connector 40 is disposed between the first chip 10 and the cable module 30 . At this time, the socket connector 40 is located on the same side of the first circuit board 20 and the first fixing base 31 . In addition, the base 41 includes an upper end surface 411 and a lower end surface 412 facing opposite to each other. The upper end surface 411 of the base 41 faces the first chip 10 . The lower end surface 412 of the base 41 faces the first circuit board 20 . The first signal elastic piece 42 , the first grounding elastic piece 43 , the second signal elastic piece 44 and the second grounding elastic piece 45 all penetrate through the upper end surface 411 of the base 41 and the lower end surface 412 of the base 41 , and are opposite to the upper end surface of the base 41 . 411 and the lower end surface 412 of the base 41 protrude.

Wherein, one side of the plurality of first signal elastic pieces 42 is in contact with the plurality of first signal pins 12 in a one-to-one correspondence. The other sides of the plurality of first signal springs 42 are in contact with the plurality of first pads 315 in a one-to-one correspondence. At this time, the high-speed signal of the first chip 10 can be transmitted to the inner conductor 324 of the cable 32 through the first signal pin 12 , the first signal spring 42 and the first pad 315 .

In addition, one side of the plurality of first ground spring pieces 43 is in contact with the plurality of first ground pins 13 in a one-to-one correspondence. The other sides of the plurality of first ground spring sheets 43 are in contact with the plurality of second pads 316 in a one-to-one correspondence. In this way, the first ground pin 13 can be electrically connected to the first ground layer 314 through the first ground spring 43 and the second pad 316 , and electrically connected to the outer conductor 326 of the cable 32 through the first ground layer 314 .

In addition, one side of the plurality of second signal elastic pieces 44 is in contact with the plurality of second signal pins 14 in a one-to-one correspondence. The other sides of the plurality of second signal elastic pieces 44 are in contact with the plurality of third signal pins 24 in a one-to-one correspondence. At this time, non-high-speed signals such as low-speed signals or power signals of the first chip 10 can be transmitted to the first circuit board 20 through the second signal pin 14 , the second signal spring 44 and the third signal pin 24 .

In addition, one side of the plurality of second ground spring pieces 45 is in contact with the plurality of second ground pins 15 in a one-to-one correspondence. The other sides of the plurality of second ground spring pieces 45 are in contact with the plurality of third ground pins 25 in a one-to-one correspondence. In this way, the second ground pin 15 can be electrically connected to the ground of the first circuit board 20 through the second ground spring 45 and the third ground pin 25 .

It should be understood that, for the solution in which the first signal pin 12 is directly fixed to the first pad 315, since the first signal pin 12 and the first pad 315 are located between the first chip body 11 and the first fixing seat 31, a On the one hand, it is difficult to fix the first signal pin 12 and the first pad 315. On the other hand, when the first fixing seat 31 is fixed to the first circuit board 20, it is difficult for the first pad 315 to connect with the first circuit The third signal pin 24 of the board 20 is at the same level, so that if the distance between the third signal pin 24 and the second signal pin 14 is a standard distance, the first signal pin 12 and the first pad 315 The distance between them is not easy to be at a standard distance, that is, the distance between the first signal pin 12 and the first pad 315 is prone to errors. In this way, the first signal pins 12 are not easily fixed to the first pads 315 . In this embodiment, by disposing the socket connector 40 between the first chip 10 and the first circuit board 20 , on the one hand, although the first signal spring 42 , the first signal pin 12 and the first pad 315 It is still located between the first chip body 11 and the first fixing seat 31, but because the first signal spring 42 has elasticity, the first signal spring 42 can be in contact with the first signal pin 12 to achieve stable electrical connection, and can also be connected with the first signal pin 12. The first pad 315 realizes stable electrical connection through contact. In this way, the electrical connection between the first signal elastic piece 42 and the first signal pin 12 is relatively simple. The electrical connection between the first signal spring 42 and the first pad 315 is relatively simple. On the other hand, when the first fixing base 31 is fixed on the first circuit board 20 , it is still difficult for the first signal spring 42 to be at the same level as the third signal pin 24 of the first circuit board 20 . Since the first signal spring 42 is elastic, the first signal spring 42 can absorb the error of the distance between the first signal spring 42 and the first signal pin 12, thereby ensuring that the first signal spring 42 can be fixed to the first signal spring 42. The pin 12 can allow the first signal spring 42 to absorb the error of the distance between the first signal spring 42 and the first pad 315 , thereby ensuring that the first signal spring 42 can be fixed on the first pad 315 .

In addition, by arranging the socket connector 40 between the first chip 10 and the first circuit board 20 , the assembly method of the signal transmission assembly 100 can also be changed, thereby reducing the assembly difficulty of the signal transmission assembly 100 . Specifically, when the first fixing seat 31 is inserted into the first through hole 23 of the first circuit board 20 , the first fixing seat 31 and the first circuit board 20 are first fixed without adhesive. After the plurality of first signal springs 42 are in contact with the plurality of first signal pins 12 in a one-to-one correspondence, the first fixing base 31 and the first circuit board 20 are fixed by adhesive. In this way, compared to the method of fixing the first fixing seat 31 to the first circuit board 20 first, and then fixing the first signal pin 12 to the first signal spring 42 , the first signal spring 42 does not need to be considered in this embodiment. Whether the third signal pin 24 is at the same level, that is, the flatness of the first fixing seat 31 and the first circuit board 20 need not be considered too much. In this way, the connection between the first chip 10 and the first circuit board 20 and the cable module 30 is relatively simple. Therefore, by disposing the socket connector 40 between the first chip 10 and the first circuit board 20 , the flexibility of the connection between the first chip 10 and the first circuit board 20 and the cable module 30 can be increased.

In the fourth embodiment, the same technical content as the first embodiment will not be repeated: please refer to FIG. 18 , which is a schematic structural diagram of another embodiment of the cable module 30 shown in FIG. 2 . The cable module 30 further includes a second fixing seat 34 . The structure of the second fixing base 34 can refer to the structure of the first fixing base 31 . I won't go into details here.

The middle portion 322 of each cable 32 passes through the second fixing seat 34 . In the extending direction of the cables 32 , the second fixing seat 34 is used to fix the middle portion 322 of the cables 32 , so that the plurality of cables 32 are more tidy. The formation method of the second fixing seat 34 may refer to the formation method of the first fixing seat 31 . For the assembling method of the second fixing base 34 and the plurality of cables 32 , please refer to the assembling method of the first fixing base 31 and the plurality of cables 32 . I won't go into details here.

In other embodiments, the cable module 30 may further include a third fixing seat, a fourth fixing seat, . . . , or an Mth fixing seat, where M is greater than or equal to 3. The third fixing seat, the fourth fixing seat, . . . , or the Mth fixing seat can all be used to fix the middle portion 322 of each cable 32 , so as to ensure that the plurality of cables 32 are more tidy.

Several kinds of signal transmission assemblies 100 are described in detail above in conjunction with the relevant drawings. Several embodiments of the communication system 1000 will be described in detail below with reference to the related drawings.

Please refer to FIG. 19. FIG. 19 is a schematic structural diagram of an implementation manner of a communication system 1000 provided by an embodiment of the present application. The communication system 1000 includes a signal transmission assembly 100 , a backplane 200 and a backplane connector 300 . It should be noted that FIG. 19 only schematically shows some components included in the communication system 1000 , and the actual shapes, actual sizes, actual positions and actual structures of these components are not limited by FIG. 19 . In addition, FIG. 19 illustrates that the number of signal transmission assemblies 100 is two, the number of backplanes 200 is one, and the number of backplane connectors 300 is two. In other embodiments, the number of transmission assemblies 100 , the number of backplanes 200 and the number of backplane connectors 300 are not specifically limited.

The backplane 200 may be a rigid backplane, a flexible backplane, or a flexible-rigid backplane. The backplane 200 may use an FR-4 dielectric board, a Rogers (Rogers) dielectric board, or a mixed media board of Rogers and FR-4, and so on. The application does not specifically limit the type of the backplane 200 .

Additionally, the backplane connector 300 includes a backplane connector receptacle 310 and a backplane connector receptacle 320 . The backplane connector socket 310 is fixed to the first circuit board 20 of the signal transmission assembly 100 and is electrically connected to the first circuit board 20 . At this time, the backplane connector socket 310 is electrically connected to the second signal pin 14 of the first chip 10 through the first circuit board 20 . The low-speed signal or power of the first chip 10 may be transmitted to the backplane connector receptacle 310 via the first circuit board 20 .

Referring to FIG. 19 again, as shown in FIG. 8 and FIG. 9 a , the backplane connector female seat 310 is also electrically connected to the second ends 323 of the plurality of cables 32 of the cable module 30 . Specifically, the inner conductor 324 of each cable 32 is electrically connected to the signal end (not shown) of the backplane connector socket 310 , and the outer conductor 326 of each cable 32 is electrically connected to the backplane connector socket 310 ground terminal (not shown). At this time, the backplane connector socket 310 is electrically connected to the first signal pin 12 of the first chip 10 through the cable 32 . The high-speed signal of the first chip 10 may be transmitted to the backplane connector female seat 310 via the inner conductors 324 of the respective cables 32 . The first ground pin 13 of the first chip 10 may be electrically connected to the ground terminal of the backplane connector female seat 310 through the outer conductor 326 of the cable 32 .

In addition, the backplane connector male seat 320 is fixed to the backplane 200 and is electrically connected to the backplane 200 . The backplane connector female seat 310 can be plugged into the backplane connector male seat 320 . In this way, on the one hand, the low-speed signal or power of the first chip 10 can be transmitted to the backplane 200 via the first circuit board 20 , the backplane connector female seat 310 and the backplane connector male seat 320 . In addition, the high-speed signal of the first chip 10 can also be transmitted to the backplane 200 through the plurality of cables 32 of the cable module 30 , the backplane connector female seat 310 and the backplane connector male seat 320 .

In other embodiments, the positions of the backplane connector female seat 310 and the backplane connector male seat 320 can be reversed. At this time, the backplane connector male seat 320 is fixed to the first circuit board 20 of the signal transmission assembly 100 and is electrically connected to the first circuit board 20 . The backplane connector male seat 320 is also electrically connected to the second ends 323 of the plurality of cables 32 of the cable module 30 . The backplane connector socket 310 is fixed to the backplane 200 and is electrically connected to the backplane 200 .

Please refer to FIG. 20. FIG. 20 is a schematic structural diagram of another implementation manner of a communication system 1000 provided by an embodiment of the present application. The communication system 1000 includes a signal transmission assembly 100 , an input/output (I/O) connector 400 , a system circuit board 500 and a functional module 600 . It should be noted that, FIG. 20 only schematically shows some components included in the communication system 1000 , and the actual shapes, actual sizes, actual positions and actual structures of these components are not limited by FIG. 20 .

The system circuit board 500 may be a rigid circuit board, a flexible circuit board, or a flexible-rigid circuit board. The system circuit board 500 may use an FR-4 dielectric board, a Rogers (Rogers) dielectric board, or a mixed media board of Rogers and FR-4, and the like. The application does not specifically limit the type of the system circuit board 500 .

In addition, the functional module 600 may be a photoelectric conversion chip.

Please refer to FIG. 20 again, the I/O connector 400 is fixed on the first circuit board 20 of the signal transmission component 100 and is electrically connected to the first circuit board 20 . At this time, the I/O connector 400 is electrically connected to the second signal pin 14 of the first chip 10 through the first circuit board 20 . The low-speed signal or power of the first chip 10 may be transmitted to the I/O connector 400 via the first circuit board 20 .

Referring to FIG. 20 again, as shown in FIG. 8 and FIG. 9 a , the I/O connector 400 is also electrically connected to the second ends 323 of the plurality of cables 32 of the cable module 30 . Specifically, the inner conductor 324 of each cable 32 is electrically connected to the signal end (not shown) of the I/O connector 400 , and the outer conductor 326 of each cable 32 is electrically connected to the ground of the I/O connector 400 . end (not shown). At this time, the I/O connector 400 is electrically connected to the first signal pin 12 of the first chip 10 through the cable 32 . The high-speed signal of the first chip 10 can also be transmitted to the I/O connector 400 through the multiple cables 32 of the cable module 30 .

In addition, the functional module 600 is fixed to the system circuit board 500 and is electrically connected to the system circuit board 500 . The system circuit board 500 may be electrically connected to the I/O connector 400 . At this time, the functional module 600 is electrically connected to the I/O connector 400 through the system circuit board 500 . The low-speed signal or power of the first chip 10 may be transmitted to the functional module 600 via the first circuit board 20 , the I/O connector 400 and the system circuit board 500 . In addition, the high-speed signal of the first chip 10 may also be transmitted to the functional module 600 via the multiple cables 32 of the cable module 30 , the I/O connector 400 and the system circuit board 500 .

In other embodiments, the communication system 1000 may not include the system circuit board 500 and the functional module 600 .

In other embodiments, the communication system 1000 may also include a second circuit board (not shown). The second circuit board is provided separately from the first circuit board 20 . The I/O connector 400 is fixed on the second circuit board and is electrically connected to the second circuit board.

Several embodiments of the communication system 1000 have been described in detail above with reference to the related drawings. Several embodiments of the signal transmission assembly 100 will be described in detail below with reference to the related drawings.

In the fifth embodiment, the same technical content as the first embodiment will not be repeated: please refer to FIG. 21 and FIG. 22 . FIG. 21 is a schematic structural diagram of another embodiment of the signal transmission assembly 100 provided by the present application. FIG. 22 is an exploded schematic view of the signal transmission assembly 100 shown in FIG. 21 . The cable module 30 further includes a third fixing seat 33 . The third fixing seat 33 is used for fixing the second end 323 of each cable 32 . Wherein, the setting method of the third fixing seat 33 (eg, the structure of the third fixing seat 33 , the forming method of the third fixing seat 33 ) can refer to the setting method of the first fixing seat 31 . The connection method between the third fixing seat 33 and the second end 323 of each cable 32 can also refer to the connection method between the first fixing seat 31 and the first end 321 of each cable 32 . The details are not repeated here.

The signal transmission assembly 100 further includes a second circuit board 50 and a second chip 60 . The second circuit board 50 may be a rigid circuit board, a flexible circuit board, or a flexible-rigid circuit board. The second circuit board 50 may be an FR-4 dielectric board, a Rogers (Rogers) dielectric board, or a mixed media board of Rogers and FR-4, and so on.

In addition, the second circuit board 50 includes an upper end surface 51 and a lower end surface 52 facing opposite to each other. The second circuit board 50 is provided with third through holes 53 . The third through hole 53 penetrates from the upper end surface 51 of the second circuit board 50 to the lower end surface 52 of the second circuit board 50 , that is, the third through hole 53 penetrates through the upper end surface 51 of the second circuit board 50 and the second circuit board 50 the lower end face 52. The positions, sizes and shapes of the third through holes 53 are not limited to the positions, sizes and shapes shown in FIGS. 21 and 22 .

In this embodiment, the structure of the second circuit board 50 is the same as that of the first circuit board 20 . In other embodiments, the structure of the second circuit board 50 may also be different from the structure of the first circuit board 20 .

Wherein, at least part of the third fixing seat 33 of the cable module 30 is disposed in the third through hole 53 and fixes the second circuit board 50 . For the connection method of the third fixing base 33 and the second circuit board 50 , please refer to the connection method of the first fixing base 31 and the first circuit board 20 . The details are not repeated here. In this way, the end surface of the second end portion 323 of the cable 32 and the upper end surface 51 of the second circuit board 50 both face the same side of the third fixing seat 33 .

In this embodiment, the second chip 60 may be the same as or different from the first chip 10 . The type of the second chip 60 is not specifically limited in this application.

Please refer to FIG. 23 , which is a schematic structural diagram of the second chip 60 shown in FIG. 22 . The second chip 60 includes a second chip body 61 , a plurality of first signal terminals 62 , a plurality of first ground terminals 63 , a plurality of second signal terminals 64 and a plurality of second ground terminals 65 . A plurality of first signal terminals 62 , a plurality of first ground terminals 63 , a plurality of second signal terminals 64 and a plurality of second ground terminals 65 are all disposed on the second chip body 61 . The arrangement of the plurality of first signal terminals 62 , the plurality of first ground terminals 63 , the plurality of second signal terminals 64 and the plurality of second ground terminals 65 in the second chip body 61 is not limited to that shown in FIG. 23 . Arrangement. Regarding the arrangement of the plurality of first signal terminals 62 , the plurality of first ground terminals 63 , the plurality of second signal terminals 64 and the plurality of second ground terminals 65 in the second chip body 61 , this application does not Make specific restrictions.

In addition, the first signal terminal 62 is used to transmit high-speed signals, and transmit the high-speed signals to the second chip body 61 . The first ground terminal 63 is the ground reference of the first signal terminal 62 . The first ground terminal 63 can shield signals on other signal terminals (eg, the second signal terminal 64 ), thereby improving the ability of the first signal terminal 62 to resist signal crosstalk.

In addition, the second signal terminal 64 is used to transmit a low-speed signal or power, and transmit the low-speed signal or power to the second chip body 61 . The second ground terminal 65 is the ground reference of the second signal terminal 64 . The second ground terminal 65 can shield signals on other signal terminals (eg, the first signal terminal 62 ), thereby improving the anti-signal crosstalk capability of the second signal terminal 64 .

Please refer to FIG. 23 again, combined with FIG. 21 and FIG. 22 , the plurality of second signal terminals 64 and the plurality of second ground terminals 65 are fixed to the second circuit board 50 and are electrically connected to the second circuit board 50 . The second circuit board 50 is electrically connected to the first circuit board 20 . The connection between the second signal terminal 64 and the second circuit board 50 may refer to the connection between the second signal pin 14 (refer to FIG. 5 ) of the first chip 10 and the first circuit board 20 . For the connection method between the second ground terminal 65 and the second circuit board 50 , please refer to the connection method between the second ground pin 15 (refer to FIG. 5 ) of the first chip 10 and the first circuit board 20 . The details are not repeated here. In this way, the low-speed signal or power of the first chip 10 can be transmitted to the second chip 60 via the first circuit board 20 and the second circuit board 50 .

In addition, the plurality of first signal ends 62 are fixed in one-to-one correspondence with the second ends 323 of the plurality of cables 32 . Exemplarily, the plurality of first signal terminals 62 are electrically connected to the inner conductors 324 of the plurality of cables 32 (refer to FIG. 9 a ) in a one-to-one correspondence. For the connection method between the first signal end 62 and the second end portion 323 of the cable 32 , please refer to the connection method between the first signal pin 12 (refer to FIG. 14 ) of the first chip 10 and the first end portion 321 of the cable 32 . The details are not repeated here. In this way, the high-speed signal of the first chip 10 can also be transmitted to the second chip 60 via the multiple cables 32 of the cable module 30 .

In addition, the plurality of first ground terminals 63 are electrically connected to the outer conductor 326 of the cable 32 (please refer to FIG. 9a ). The connection between the first ground terminal 63 and the outer conductor 326 of the cable 32 may refer to the connection between the first ground pin 13 (see FIG. 14 ) of the first chip 10 and the outer conductor 326 of the cable 32 . The details are not repeated here.

In this embodiment, high-speed signals, low-speed signals and power can be transmitted between the first circuit board 10 and the second circuit board 50 , that is, inter-board jumpers.

In other embodiments, the second end 323 of the cable 32 can also be electrically connected to the second chip 60 through the electrical connector and the second circuit board 50 , or the second end 323 of the cable 32 can also be other Electrically connected to the second chip 60 in a conventional manner. In this way, the cable module 30 may not include the third fixing seat 33 . The second circuit board 50 may not be provided with the third through holes 53 .

In the sixth embodiment, the same technical content as the fifth embodiment will not be repeated: please refer to FIG. 24 and FIG. 25 . FIG. 24 is a schematic structural diagram of another embodiment of the signal transmission assembly 100 provided by the embodiment of the present application. 25 is an exploded schematic view of the signal transmission assembly 100 shown in FIG. 24 . The first circuit board 20 and the second circuit board 50 are integrally formed, that is, the first circuit board 20 and the second circuit board 50 are integrated. FIG. 24 and FIG. 25 both use a number to indicate the whole formed by the first circuit board 20 and the second circuit board 50 . In this way, high-speed signals, low-speed signals and power can be transmitted between the first chip 10 and the second chip 60 on the same circuit board, that is, the jumper on the board.

Two types of signal transmission assemblies 100 are described above in conjunction with the associated figures. The signal transmission assembly 100 can implement inter-board jumpers, or can implement intra-board jumpers, thereby enriching the application of the signal transmission assembly 100 .

The above are only specific embodiments of the present application, but the protection scope of the present application is not limited to this. should be covered within the scope of protection of this application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

A signal transmission assembly (100), characterized by comprising a first chip (10), a first circuit board (20) and a cable module (30);

The first chip (10) includes a first signal pin (12) and a second signal pin (14) arranged on the same side;

The first circuit board (20) is provided with a first through hole (23), and the second signal pin (14) is electrically connected to the first circuit board (20);

The cable module (30) includes a first fixing seat (31) and a cable (32), the first fixing seat (31) is fixed on the first circuit board (20), and is at least partially located on the first circuit board (20). In a through hole (23), the first end (321) of the cable (32) is fixed on the first fixing seat (31), and is electrically connected to the first signal pin (12).
The signal transmission assembly (100) according to claim 1, wherein the number of the cables (32) is one, and one of the cables (32) is used to transmit high-speed signals; or, the The number of cables (32) is multiple, and at least one of the cables (32) is used for transmitting high-speed signals.
The signal transmission assembly (100) according to claim 1 or 2, characterized in that, the first circuit board (20) is used to transmit low-speed signals, power or high-speed signals.
The signal transmission assembly (100) according to any one of claims 1 to 3, wherein the cable (32) comprises an inner conductor (324), a dielectric layer (325) and an outer conductor (326), The dielectric layer (325) wraps the inner conductor (324), and the outer conductor (326) wraps the dielectric layer (325);

The inner conductor (324) is electrically connected to the first signal pin (12), the first chip (10) further comprises a first ground pin (13), and the first ground pin (13) For providing a ground reference for the first signal pin (12), the first ground pin (13) is electrically connected to the outer conductor (326).
The signal transmission assembly (100) according to claim 4, wherein the cable module (30) further comprises a first pad (315), and a part of the first pad (315) is fixed on the The end face (3243) of the first end portion (3242) of the inner conductor (324), and the other part of the first pad (315) is fixed to the first end portion (3252) of the dielectric layer (325) the end face (3253);

The first pad (315) is electrically connected to the inner conductor (324) of the cable (32), and is insulated from the outer conductor (326) of the cable (32). (315) is electrically connected to the first signal pin (12).
The signal transmission assembly (100) according to claim 5, wherein the cable module (30) further comprises a first elastic piece (317), and the first elastic piece (317) is fixed on the first elastic piece (317) A pad (315), the first elastic piece (317) is electrically connected to the first signal pin (12).
The signal transmission assembly (100) according to any one of claims 4 to 6, wherein the cable module (30) further comprises a first ground layer (314), the first ground layer ( A part of 314) is located on the surface of the first fixing seat (31), and another part of the first ground layer (314) is located on the end face (3262) of the first end part (3261) of the outer conductor (326) ;

The first ground layer (314) is electrically connected to the outer conductor (326) of the cable (32), and is insulated from the inner conductor (324) of the cable (32). The first ground layer (314) is electrically connected to the first ground pin (13).
The signal transmission assembly (100) according to claim 7, wherein the cable module (30) further comprises a second pad (316), and the second pad (316) is fixed on the The first ground layer (314) is far away from the surface of the first fixing seat (31);

The second pad (316) is electrically connected to the first ground layer (314), and the second pad (316) is electrically connected to the first ground pin (13).
The signal transmission assembly (100) according to any one of claims 1 to 8, characterized in that, the signal transmission assembly (100) further comprises a socket connector (40), and the socket connector (40) ) is arranged between the first chip (10) and the first circuit board (20);

The socket connector (40) includes a first signal spring (42) and a second signal spring (44);

One side of the first signal elastic sheet (42) is electrically connected to the first signal pin (12), and the other side is electrically connected to the first end (321) of the cable (32). One side of the second signal spring (44) is electrically connected to the second signal pin (14), and the other side is electrically connected to the first circuit board (20).
The signal transmission assembly (100) according to any one of claims 1 to 9, wherein the first fixing seat (31) is in interference fit with the hole wall of the first through hole (23).
The signal transmission assembly (100) according to any one of claims 1 to 10, wherein the first chip (10) further comprises a second ground pin (15), the second ground pin (15) is used to provide a ground reference for the second signal pin (14), the second ground pin (15) is electrically connected to the first circuit board (20), and passes through the first circuit The board (20) is grounded.
The signal transmission assembly (100) according to any one of claims 1 to 11, wherein the cable module (30) further comprises a second fixing seat (34) along the cable (32) ), the middle part (322) of the cable (32) is fixed on the second fixing seat (34).
The signal transmission assembly (100) according to any one of claims 1 to 12, characterized in that, the signal transmission assembly (100) further comprises a second circuit board (50) and a second chip (60);

The second chip (60) includes a first signal terminal (62) and a second signal terminal (64) arranged on the same side;

The second circuit board (50) is provided with a third through hole (53), and the second signal terminal (64) is electrically connected to the second circuit board (50);

The cable module (30) further comprises a third fixing seat (33), the third fixing seat (33) is fixed on the second circuit board (50) and is at least partially located in the third through hole (53) ), the second end (323) of the cable (32) is fixed to the third fixing seat (33) and is electrically connected to the first signal end (62).
The signal transmission assembly (100) according to claim 13, characterized in that, the second circuit board (50) and the first circuit board (20) are integrally formed.
A communication system (1000), characterized by comprising a connector and the signal transmission assembly (100) according to any one of claims 1 to 12;

The connector is electrically connected to the second end (323) of the cable (32), and the connector is also electrically connected to the first circuit board (20) to pass through the first circuit board (20) is electrically connected to the second signal pin (14).
The communication system (1000) according to claim 15, wherein the connector is a backplane connector (300), and the backplane connector (300) comprises a backplane connector female seat (310) and A backplane connector male seat (320), the backplane connector female seat (310) is fixed on the first circuit board (20), and the backplane connector female seat (310) is electrically connected to the cable The second end (323) of (32) is electrically connected to the first signal pin (12) through the cable (32), and the backplane connector socket (310) is also electrically connected to the first signal pin (12). the first circuit board (20), so as to be electrically connected to the second signal pin (14) through the first circuit board (20);

The communication system (1000) further includes a backplane (200), the backplane connector male seat (320) is fixed on the backplane (200), and is electrically connected to the backplane (200), the The backplane connector female seat (310) is electrically connected to the backplane connector male seat (320).
The communication system (1000) of claim 15, wherein the connector is an I/O connector (400);

The communication system (1000) further includes a system circuit board (500) and a function module (600), and the I/O connector (400) is electrically connected to the system circuit board (500);

The function module (600) is fixed on the system circuit board (500), and the function module (600) is electrically connected to the system circuit board (500) so as to be electrically connected to the system circuit board (500) through the system circuit board (500). I/O connector (400).
A cable assembly (101), characterized by comprising a first circuit board (20) and a cable module (30);

The first circuit board (20) is provided with a first through hole (23), and the first circuit board (20) is used for electrical connection with the second signal pin (14) of the first chip (10);

The cable module (30) includes a first fixing seat (31) and a cable (32), the first fixing seat (31) is fixed on the first circuit board (20), and is at least partially located on the first circuit board (20). In a through hole (23), the first end (321) of the cable (32) is fixed to the first fixing seat (31), and the first end (321) of the cable (32) It is used for electrical connection with the first signal pin (12) of the first chip (10).
The cable assembly (101) according to claim 18, wherein the cable (32) comprises an inner conductor (324), a dielectric layer (325) and an outer conductor (326), the dielectric layer (325) ) wraps the inner conductor (324), and the outer conductor (326) wraps the dielectric layer (325);

The inner conductor (324) is used for electrical connection with the first signal pin (12) of the first chip (10), and the outer conductor (326) is used for connecting with the first signal pin (12) of the first chip (10). A ground pin (13) is electrically connected, and the first ground pin (13) is used to provide a ground reference for the first signal pin (12).
The cable assembly (101) according to claim 19, wherein the cable module (30) further comprises a first pad (315), and a part of the first pad (315) is fixed on the The end face (3243) of the first end portion (3242) of the inner conductor (324), and the other part of the first pad (315) is fixed to the first end portion (3252) of the dielectric layer (325) the end face (3253);

The first pad (315) is electrically connected to the inner conductor (324) of the cable (32), and is insulated from the outer conductor (326) of the cable (32). (315) is used for electrical connection with the first signal pin (12) of the first chip (10).
The cable assembly (101) according to claim 20, wherein the cable module (30) further comprises a first elastic piece (317); the first elastic piece (317) is fixed on the first elastic piece (317) A pad (315), the first elastic sheet (317) is used for electrical connection with the first signal pin (12) of the first chip (10).
The cable assembly (101) according to any one of claims 19 to 21, wherein the cable module (30) further comprises a first ground layer (314), the first ground layer ( A part of 314) is located on the surface of the first fixing seat (31), and another part of the first ground layer (314) is located on the end face (3262) of the first end part (3261) of the outer conductor (326) ;

The first ground layer (314) is electrically connected to the outer conductor (326) of the cable (32), and the first ground layer (314) is also connected to the inner conductor (324) of the cable (32). Insulation arrangement, the first ground layer (314) is used for electrical connection with the first ground pin (13) of the first chip (10).
The cable assembly (101) according to claim 22, wherein the cable module (30) further comprises a second pad (316), and the second pad (316) is fixed on the The first ground layer (314) is far away from the surface of the first fixing seat (31);

The second pad (316) is electrically connected to the first ground layer (314), the second pad (316) is insulated from the inner conductor (324) of the cable (32), and the The second pad (316) is used for electrical connection with the first ground pin (13) of the first chip (10).
The cable assembly (101) according to any one of claims 18 to 23, wherein the cable assembly (101) further comprises a socket connector (40), the socket connector (40) ) is arranged on the same side of the first circuit board (20) and the first fixing seat (31);

The socket connector (40) includes a first signal spring (42) and a second signal spring (44);

One side of the first signal elastic piece (42) is used for electrical connection with the first signal pin (12), and the other side is electrically connected to the first end (321) of the cable (32), One side of the second signal elastic sheet (44) is used for electrical connection with the second signal pin (14), and the other side is electrically connected with the first circuit board (20).
The cable assembly (101) according to any one of claims 18 to 24, wherein the first fixing seat (31) is in interference fit with the hole wall of the first through hole (23).
The cable assembly (101) according to any one of claims 18 to 25, wherein the cable module (30) further comprises a second fixing seat (34) along the cable (32) ), the middle part (322) of the cable (32) is fixed on the second fixing seat (34).
The cable assembly (101) according to any one of claims 18 to 26, wherein the cable assembly (101) further comprises a second circuit board (50), the second circuit board (50) ) is provided with a third through hole (53), the second circuit board (50) is used for electrical connection with the second signal terminal (64) of the second chip (60);

The cable module (30) further comprises a third fixing seat (33), the third fixing seat (33) is fixed on the second circuit board (50) and is at least partially located in the third through hole In (53), the second end (323) of the cable (32) is fixed to the third fixing seat (33), and the second end (323) of the cable (32) is used for connecting with The first signal terminal (62) of the second chip (60) is electrically connected.
The cable assembly (101) according to any one of claims 18 to 27, wherein the number of the cables (32) is one, and one of the cables (32) is used for transmitting high-speed signal; or, the number of the cables (32) is multiple, and at least one of the cables (32) is used for transmitting high-speed signals.
A signal transmission assembly (100), characterized by comprising a first chip (10) and a cable module (30);

The first chip (10) includes a first signal pin (12), and the cable module (30) includes a first fixing seat (31) and a cable (32). The first end portion (321) is fixed on the first fixing seat (31) and is electrically connected to the first signal pin (12).
The signal transmission assembly (100) according to claim 29, wherein the number of the cables (32) is one, and one of the cables (32) is used for transmitting high-speed signals; or, the The number of cables (32) is multiple, and at least one of the cables (32) is used for transmitting high-speed signals.
The signal transmission assembly (100) according to claim 29 or 30, wherein the cable (32) comprises an inner conductor (324), a dielectric layer (325) and an outer conductor (326), the dielectric layer (325) wrapping the inner conductor (324), and the outer conductor (326) wrapping the dielectric layer (325);

The inner conductor (324) is electrically connected to the first signal pin (12), the first chip (10) further comprises a first ground pin (13), and the first ground pin (13) For providing a ground reference for the first signal pin (12), the first ground pin (13) is electrically connected to the outer conductor (326).