WO2022186427A1 - Release film - Google Patents

Release film Download PDF

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Publication number
WO2022186427A1
WO2022186427A1 PCT/KR2021/008195 KR2021008195W WO2022186427A1 WO 2022186427 A1 WO2022186427 A1 WO 2022186427A1 KR 2021008195 W KR2021008195 W KR 2021008195W WO 2022186427 A1 WO2022186427 A1 WO 2022186427A1
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Prior art keywords
release layer
release film
release
formula
fluorinated
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PCT/KR2021/008195
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French (fr)
Korean (ko)
Inventor
우혜미
김태근
김현철
최영경
Original Assignee
도레이첨단소재 주식회사
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Priority to CN202180002518.7A priority Critical patent/CN115397939A/en
Publication of WO2022186427A1 publication Critical patent/WO2022186427A1/en

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/40Adhesives in the form of films or foils characterised by release liners
    • C09J7/401Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/0427Coating with only one layer of a composition containing a polymer binder
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/40Adhesives in the form of films or foils characterised by release liners
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Definitions

  • It relates to a release film.
  • Silicone-based release films used for general adhesives such as acrylic and epoxy are soft and thick due to low curing density, Young's modulus, reduced modulus, and hardness of the release layer. The more the peeling force is lowered. However, in the silicone-based release film, the lower the peeling force, the lower the residual adhesion rate and the adhesion to the substrate, as well as the low elastic modulus and hardness of the surface of the release layer, so blocking may occur during winding.
  • the silicone-based release film uses a silicone-based adhesive
  • the silicone-based release film is completely laminated to the silicone-based adhesive and is not peeled off.
  • the silicone-based pressure-sensitive adhesive A film coated with a release agent including a fluorine-based resin is commonly used.
  • the release agent containing the fluorine-based resin has a low surface energy, so it is difficult to mix with a general organic solvent and may cause a coating defect, so a fluorine-based solvent should be used. Since the release agent containing the fluorine-based resin is several tens of times more expensive than the general silicone-based release agent, there is a problem in terms of productivity and economic efficiency.
  • a release film that can be used with both an acrylic pressure-sensitive adhesive and a silicone-based pressure-sensitive adhesive and has a high surface hardness and reduced modulus of the release layer, but a low peel force and a low rate of change in peel force.
  • One aspect is to provide a release film that can be used with both an acrylic pressure-sensitive adhesive and a silicone-based pressure-sensitive adhesive, and has a high surface hardness and a reduced modulus of a release layer, but has a low peel force and a low rate of change in peel force.
  • the release layer is a cured layer of a composition for forming a release layer comprising a blend of a fluorinated organopolysiloxane and a fluorinated organopolysiloxane,
  • the release layer decreases the fluorine atom/silicon atom content ratio from the surface to the center
  • the release layer has a reduced modulus measured by the nanoindentation method of 2 to 6 GPa,
  • the release layer has a surface hardness measured by the nanoindentation method of 0.3 to 0.6 GPa, the release film is provided.
  • the content (atomic%) ratio of fluorine atoms/silicon atoms by XPS analysis with respect to the surface of the release layer may be 1.5 to 4.5.
  • the surface energy of the release layer may be 10 dyne/cm to 16 dyne/cm.
  • the release film may have a peeling force of 0.5 gf/25mm to 10 gf/25mm at a peeling angle of 180° and a peeling rate of 0.3mpm for the acrylic pressure-sensitive adhesive and the silicone-based pressure-sensitive adhesive.
  • the release film may have a peel force change rate of 50% or less according to the following formula 2 for the acrylic pressure-sensitive adhesive and the silicone-based pressure-sensitive adhesive:
  • the residual adhesion rate of the release film may be 85% or more.
  • the release layer may have a thickness of 0.03 ⁇ m to 2.0 ⁇ m.
  • the fluorinated polysiloxane may include an organo polysiloxane represented by the following Chemical Formula 1:
  • R 1 is a substituted or unsubstituted C1-C10 monovalent hydrocarbon group, or a substituted or unsubstituted C2-C10 alkenyl group;
  • R 2 is a substituted or unsubstituted C1-C10 monovalent hydrocarbon group, a substituted or unsubstituted C2-C10 alkenyl group, or hydrogen;
  • R 3 and R 4 are each independently a fluorinated alkyl group represented by Formula 2, a fluorinated ether group represented by Formula 3, A substituted or unsubstituted C1 ⁇ C10 monovalent hydrocarbon group, a substituted or unsubstituted C2 ⁇ C10 alkenyl group, or hydrogen,
  • R 3 and R 4 is a fluorinated alkyl group represented by Formula 2, a fluorinated ether group represented by Formula 3, or a combination thereof;
  • n is an integer from 1 to 8
  • m is an integer from 1 to 5;
  • p is an integer from 1 to 5
  • q is 0 or 1
  • r is 0, 1 or 2
  • v is an integer from 1 to 5;
  • A is an oxygen atom or a single bond
  • x, y, and z are each an integer of 1 or more;
  • * is a binding site with a neighboring atom
  • R 1 and R 2 may be a substituted or unsubstituted C2 ⁇ C10 alkenyl group.
  • the content of the fluorinated organopolysiloxane may be 10 parts by weight to 300 parts by weight based on 100 parts by weight of the non-fluorinated organopolysiloxane.
  • the release layer may further include organic/inorganic particles.
  • the release layer may further include at least one of hydrogen polysiloxane and a catalyst.
  • a release film includes a release layer, which is a cured layer of a composition for forming a release layer including a blend of fluorinated organopolysiloxane and non-fluorinated organopolysiloxane.
  • the release film has a low peel force and a low change rate of peel force for both the acrylic pressure-sensitive adhesive and the silicone-based pressure-sensitive adhesive, and has a high surface hardness and reduced modulus to prevent blocking during film winding.
  • FIG. 1 is a schematic cross-sectional view of a release film according to an embodiment.
  • the term “and/or” is meant to include any and all combinations of one or more of the related listed items.
  • the term “or” means “and/or”.
  • the expression “at least one” or “one or more” in front of components in the present specification does not imply that it may supplement the entire list of components and may supplement individual components of the description.
  • ⁇ -based resin means " ⁇ resin”, “ ⁇ polymer”, “ ⁇ copolymer”, or/and “ ⁇ resin, polymer, Or a derivative of a copolymer” is a broad concept including all.
  • polymer or copolymer crosslinked with these resins means “polymer or copolymer crosslinked with the above-mentioned resins”.
  • each component is a concept including both the singular and the plural.
  • a release film includes a substrate; and a release layer located on at least one surface of the substrate, wherein the release layer is a cured layer of a composition for forming a release layer comprising a blend of a fluorinated organopolysiloxane and a fluorinated organopolysiloxane, and the release layer
  • the fluorine atom/silicon atom content ratio decreases from the surface of the silver to the center direction, and the release layer has a reduced modulus measured by a nanoindentation method of 2 to 6 GPa, and the release layer has a nanoindentation method.
  • the surface hardness measured by the tation method may be 0.3 to 0.6 GPa.
  • the release film according to an embodiment has low peel force and peel force change rate for both the acrylic pressure-sensitive adhesive and the silicone-based pressure-sensitive adhesive, and has high surface hardness and reduced modulus to prevent blocking during film winding.
  • the base material constituting the release film, the release layer, the release film, and the optical film and electronic device including the same will be described in detail as follows.
  • a known substrate film or sheet may be used as a substrate for a release film.
  • a polyester-based resin film may be used as the substrate.
  • a known base film commonly used in the field of release film may be used.
  • the polyester-based base film may be a polyester-based base film disclosed in Korean Patent Registration No. 10-1268584, Korean Patent Publication No. 2012-45213, and No. 2012-99546.
  • the polyester-based base film is described without limitation, but it should be understood as including the technical features of the known polyester-based base film. .
  • the polyester-based base film may include polyethylene terephthalate, polybutylene terephthalate, or polyethylene naphthalate.
  • the polyester-based resin forming the base film may be a polyester obtained by polycondensation of an aromatic dicarboxylic acid and an aliphatic glycol.
  • aromatic dicarboxylic acid examples include isophthalic acid, phthalic acid, terephthalic acid, 2,6-naphthalenedicarboxylic acid, adipic acid, sebacic acid, and oxycarboxylic acid (eg, ⁇ -oxybenzoic acid, etc.).
  • aliphatic glycol examples include ethylene glycol, diethylene glycol, propylene glycol, butanediol, 1,4-cyclohexanedimethanol, neopentyl glycol, and the like.
  • These polyester-based resins may use two or more of a dicarboxylic acid component and a glycol component in combination, and a copolymer containing a third component is also possible.
  • the polyester-based base film may use a uniaxial or biaxially oriented film having high transparency and excellent productivity and processability.
  • the polyester-based base film polyethylene terephthalate (PET) or polyethylene-2,6-naphthalene dicarboxylate (PEN) may be used.
  • the polyester-based base film may contain particles in order to provide excellent running characteristics between rolls, and as long as the added particles can exhibit excellent sliding properties, they can be used without limitation.
  • Such particles may include particles such as silica, silicon oxide, calcium carbonate, calcium sulfate, calcium phosphate, magnesium carbonate, magnesium phosphate, barium carbonate, kaolin, aluminum oxide, titanium oxide, and the like, and the shape of the particles used Although not limited to, for example, any of spherical, bulky, rod-shaped, plate-shaped particles may be used.
  • the hardness, specific gravity, and color of the particles are not limited, but two or more types may be used in parallel as needed, and the average particle diameter of the particles used may be 0.1 to 5 ⁇ m, for example, 0.1 to 2 ⁇ m in the range of can be used. At this time, if the average particle diameter of the particles is less than 0.1 ⁇ m, aggregation between particles may occur, resulting in poor dispersion. can occur.
  • the content of the particles may be 0.01 to 5 wt%, for example, 0.01 to 3 wt%, based on the total weight of the polyester-based base film. If the content of the particles is less than 0.01% by weight, the sliding properties of the polyester film may deteriorate and the running characteristics between the rolls may deteriorate, and if the content of the particles exceeds 5% by weight, the surface smoothness of the film may deteriorate.
  • the thickness of the polyester-based base film is not limited, but may be 20 to 125 ⁇ m.
  • polyester-based base film is too thin at 20 um or less, there is a risk of deformation by heat treatment during processing, and if it is too thick over 125 um, heat may not be sufficiently transmitted and there may be a problem in curing.
  • the release layer of the release film may be a cured layer of a composition for forming a release layer including a blend of fluorinated organopolysiloxane and fluorinated organopolysiloxane.
  • the fluorine atom/silicon atom content ratio may decrease from the surface to the center.
  • the release layer has a higher content of fluorine atoms compared to silicon atoms on its surface, so the peelability is excellent when laminated with a silicone pressure-sensitive adhesive.
  • the content (atomic%) ratio of fluorine atoms/silicon atoms by X-ray photoelectron spectroscopy (XPS) analysis on the surface of the release layer may be 1.5 to 4.5. If the content (atomic%) ratio of fluorine atoms/silicon atoms by XPS analysis with respect to the surface of the release layer is less than 1.5, it may not be peeled off during lamination with the silicone-based pressure-sensitive adhesive.
  • XPS X-ray photoelectron spectroscopy
  • the content (atomic%) ratio of fluorine atoms/silicon atoms by XPS analysis with respect to the surface of the release layer exceeds 4.5, a large amount of heat is required to cure the fluorinated organopolysiloxane, so it may cause thermal deformation of the substrate and hardness Since it is high, the peeling force to the acrylic pressure-sensitive adhesive may increase.
  • the depth of the release layer contains less than 80 atomic% of fluorine atoms based on 100 atomic% of silicon atoms. .
  • "deep part” means the inside of the release layer etched by plasma on the surface of the release layer, and more specifically, when analyzed with an XPS analyzer, the atomic% of C (carbon) from the surface of the release layer is 60 atomic% Refers to a point inside the release layer.
  • the fluorine atoms of the release layer are positioned on the surface of the coating layer, the better the peeling force, so if the fluorine atoms in the release layer are 80 atomic% or more, the fluorine atom weight on the surface of the release layer decreases and the silicon atom content increases, so that peeling off when laminated with a silicone pressure-sensitive adhesive may not be
  • the fluorinated polysiloxane may include an organo polysiloxane represented by the following Chemical Formula 1:
  • R 1 may be a substituted or unsubstituted C1 ⁇ C10 monovalent hydrocarbon group, or a substituted or unsubstituted C2 ⁇ C10 alkenyl group;
  • R 2 may be a substituted or unsubstituted C1-C10 monovalent hydrocarbon group, a substituted or unsubstituted C2-C10 alkenyl group, or hydrogen;
  • R 3 and R 4 are each independently a fluorinated alkyl group represented by Formula 2, a fluorinated ether group represented by Formula 3, A substituted or unsubstituted C1 ⁇ C10 monovalent hydrocarbon group, a substituted or unsubstituted C2 ⁇ C10 alkenyl group, or hydrogen,
  • R 3 and R 4 is a fluorinated alkyl group represented by Formula 2, a fluorinated ether group represented by Formula 3, or a combination thereof;
  • n may be an integer from 1 to 8
  • m may be an integer from 1 to 5;
  • p may be an integer from 1 to 5
  • q may be 0 or 1
  • r may be 0, 1 or 2
  • v may be an integer from 1 to 5;
  • A may be an oxygen atom or a single bond
  • x, y, z may each be an integer of 1 or more;
  • * may be a binding site with a neighboring atom
  • R 1 and R 2 may be a substituted or unsubstituted C2 ⁇ C10 alkenyl group.
  • the fluorine-free organo polysiloxane may be represented by the following Chemical Formula 4:
  • R a may be a substituted or unsubstituted C1-C10 monovalent hydrocarbon group, or a substituted or unsubstituted C2-C10 alkenyl group;
  • R b may be a substituted or unsubstituted C1-C10 monovalent hydrocarbon group, a substituted or unsubstituted C2-C10 alkenyl group, or hydrogen;
  • Each of x' and y' may be an integer of 1 or more.
  • the fluorinated polysiloxane may be a blend of the organo polysiloxane represented by the formula (1) and the organo polysiloxane represented by the following formula (5), or the organo polysiloxane represented by the formula (1) and the organo polysiloxane represented by the formula (5) It may be a copolymer in which the organo polysiloxane is linked:
  • R′ 1 may be a substituted or unsubstituted C1-C10 monovalent hydrocarbon group, or a substituted or unsubstituted C2-C10 alkenyl group;
  • R′ 2 may be a fluorine-containing ether group represented by Formula 6;
  • n' may be an integer from 1 to 8
  • m' may be an integer from 3 to 17;
  • * may be a binding site with a neighboring atom.
  • a weight ratio of the organopolysiloxane represented by Formula 1 to the organopolysiloxane represented by Formula 5 may be 10:1 to 1:10.
  • the content of the fluorinated organopolysiloxane may be 10 parts by weight to 300 parts by weight based on 100 parts by weight of the non-fluorinated organopolysiloxane. If the content of the fluorinated organopolysiloxane is less than 10 parts by weight based on 100 parts by weight of the non-fluorinated organopolysiloxane, the fluorine group on the surface of the release layer is not sufficiently cured to increase the surface energy, and the hardness is lowered due to blocking and penetration of the adhesive Significant changes over time may occur. For this reason, when the release layer and the silicone pressure-sensitive adhesive are laminated, it may not be peeled off.
  • the content of the fluorinated organopolysiloxane exceeds 300 parts by weight based on 100 parts by weight of the non-fluorinated organopolysiloxane, a lot of energy is required during curing of the fluorine-containing organopolysiloxane, and there is a fear that the substrate may be deformed.
  • the surface energy of the release layer may be 10 dyne/cm to 16 dyne/cm. If the surface energy of the release layer is less than 10 dyne/cm, the pressure-sensitive adhesive may not be applied due to the low surface energy. If the surface energy of the release layer is more than 16 dyne/cm, the fluorinated organopolysiloxane on the surface of the release layer may not be sufficiently cured, and the release layer and the silicone pressure-sensitive adhesive may not be peeled off.
  • the release layer may have a reduced modulus measured by a nanoindentation method of 2 to 6 GPa.
  • the conversion modulus of elasticity of the release layer is less than 2 GPa, the release layer becomes soft and a blocking phenomenon may occur during winding. If the converted elastic modulus of the release layer is more than 6 GPa, the peeling force is increased by the hard release layer.
  • the release layer may have a surface hardness measured by a nanoindentation method of 0.3 to 0.6 GPa.
  • the surface hardness of the release layer measured by the nanoindentation method is less than 0.3 GPa, the surface hardening degree is lowered, and thus, a large change over time may occur due to penetration of the pressure-sensitive adhesive.
  • the surface hardness of the release layer measured by the nanoindentation method is greater than 0.6 GPa, the peeling force may increase due to the high surface hardness.
  • the release layer may further include organic/inorganic particles.
  • the organic and inorganic particles are natural minerals; oxides, hydroxides, sulfides, nitrides, or halides of elements of Groups 1 to 4, 11 to 12, 14 and 16 to 18; carbonate, sulfate, acetate, phosphate, phosphite, carboxylate, silicate, titanate, borate, or hydrates thereof; and inorganic particles selected from these complex compounds.
  • the organic/inorganic particles may be organic particles selected from fluorine-based resins, melamine-based resins, styrene-based resins, acrylic resins, silicone-based resins, styrene-divinylbenzene-based copolymer resins, and polymers or copolymers crosslinked with these resins.
  • the shape of the organic/inorganic particles used is not particularly limited, and may be spherical, bulky, rod-shaped, or flat-shaped.
  • the hardness, specific gravity, color, etc. of the organic/inorganic particles are not limited, and if necessary, these organic/inorganic particles may be used alone, or two or more kinds may be used.
  • the average particle diameter (D50) of the organic/inorganic particles may be 1 ⁇ m to 5 ⁇ m.
  • the average particle diameter (D50) of the organic-inorganic particles may be 3 ⁇ m to 5 ⁇ m or 1 ⁇ m to 2 ⁇ m.
  • the term "average particle diameter (D50)" refers to 50% from the smallest particle when the total number of particles is 100% in the distribution curve accumulated in the order of the smallest particle to the largest particle. It means the value of the particle size.
  • the D50 value can be measured by a method well known to those skilled in the art, for example, it can be measured with a particle size analyzer, or can be measured from a TEM photograph or an SEM photograph. As another method, it is measured using a measuring device using a dynamic light-scattering method, data analysis is performed, the number of particles is counted for each particle size range, and the D50 value is calculated therefrom. can be obtained easily.
  • the average particle diameter (D50) of the organic-inorganic particles is less than 1 ⁇ m, the blocking phenomenon cannot be prevented because sufficient surface roughness cannot be obtained. If the average particle diameter (D50) of the organic-inorganic particles exceeds 5 ⁇ m, it may act as a defect of the film.
  • the release layer may further include at least one of hydrogen polysiloxane and a catalyst.
  • the hydrogen polysiloxane may include at least one of an addition reaction type siloxane resin, a condensation reaction type siloxane resin, and an ultraviolet curing type siloxane resin.
  • the hydrogen polysiloxane may be in one of linear, branched, or cyclic form, and may be in the form of a mixture thereof.
  • the hydrogen polysiloxane is not limited in viscosity or molecular weight, but compatibility with the aforementioned organo polysiloxane should be good, and the hydrogen polysiloxane may not contain a fluorine group.
  • the hydrogen polysiloxane may include the same fluorine-containing alkyl group and/or fluorine-containing ether group as the aforementioned organo polysiloxane.
  • the content of the hydrogen polysiloxane may be 1.0 to 10.0 wt% based on the total weight of the composition for forming a release layer.
  • the catalyst may use one or more metals or amphoteric elements selected from Groups 4 to 14 elements, for example, one or more selected from Rh, Pt, Sn, Ti, Pd, Ir, W, and Co.
  • the catalyst may comprise a platinum chelate catalyst.
  • the release layer may further include additives for imparting various functions such as a reaction modifier and an antistatic agent.
  • the release layer may have a thickness of 0.03 to 2.0 ⁇ m. If the thickness of the release layer is less than 0.03 um, the release layer coverage may not be good and may not be peeled off during lamination with an acrylic pressure-sensitive adhesive or/and a silicone-based pressure-sensitive adhesive. If the thickness of the release layer exceeds 2.0 um, it may cause thermal deformation of the substrate because it requires a large amount of heat during curing, and the cost may increase because peelability is not improved.
  • the composition for forming a release layer for forming the release layer is prepared by containing a solvent with a solid content of 0.5 to 10% by weight.
  • the solvent may be used without limitation as long as it can be applied on the substrate by dispersing the solid content, for example, aromatic hydrocarbon-based solvents such as toluene and xylene; aliphatic hydrocarbon solvents such as hexane, heptane, octane, isooctane, decane, cyclohexane, methyl cyclohexane and isoparaffin; Hydrocarbon solvents, such as industrial gasoline (rubber gasoline etc.), petroleum benzene, and solvent naphtha; Acetone, methyl ethyl ketone, 2-pentanone, 3-pentanone, 2-hexanone, 2-heptanone, 4-heptanone, methyl isobutyl ketone, diisobutyl ketone, acetonylacetone, cycl
  • ester solvents such as ethyl acetate, propyl acetate, isopropyl acetate, butyl acetate, and isobutyl acetate
  • ether solvents such as diethyl ether, dipropyl ether, diisopropyl ether, dibutyl ether, 1,2-dimethoxyethane, and 1,4-dioxane
  • solvents having ester and ether moieties such as 2-methoxyethyl acetate, 2-ethoxyethyl acetate, propylene glycol monomethyl ether acetate, and 2-butoxyethyl acetate
  • siloxane solvents such as hexamethyldisiloxane, octamethyltrisiloxane, octamethylcyclotetrasiloxane, decanemethylcyclopentasiloxane, tris(trimethylsiloxy)methylsilane, and tetra
  • the solid content of the composition for forming a release layer is less than 0.5 wt %, a sufficient coating thickness may not be formed, so that the release property may not be expressed. If the solid content of the composition for forming the release layer exceeds 10% by weight, the viscosity of the composition for forming the release layer is high, so leveling unevenness may occur, and thus the thickness uniformity of the release layer may be deteriorated, and the coating thickness may be thickened and not cured it may not be
  • an offline coating method available in the art such as bar coating, gravure coating, die coating, etc. may be used.
  • the energy source for curing the composition for forming the release layer is not particularly limited, but heat treatment, ultraviolet irradiation, or electron beam irradiation may be used, and these may be used alone or in combination, but heat treatment alone or combination treatment of heat and ultraviolet light may be used.
  • FIG. 1 is a schematic cross-sectional view of a release film 100 according to an embodiment.
  • a release film 120 has a structure in which a substrate 100 and a release layer 110 are sequentially positioned.
  • the release film 120 has a low peel force and a low peel force change rate for both the acrylic adhesive and the silicone adhesive, and has high surface hardness and reduced modulus to prevent blocking during film winding. have.
  • the release film 120 may have a peeling force of 0.5 gf/25mm to 10 gf/25mm at a peeling angle of 180° and a peeling rate of 0.3mpm for the acrylic adhesive and the silicone-based adhesive.
  • the release film 120 has less than 0.5 gf/25mm at a peeling angle of 180 ° and a peeling rate of 0.3 mpm, the release film 120 has a peeling force for the acrylic pressure-sensitive adhesive and the silicone-based pressure-sensitive adhesive.
  • the laminated interface may be lifted. If the release film 120 has more than 10 gf/25mm at a peeling angle of 180° and a peeling rate of 0.3 mpm, the peeling force for the acrylic pressure-sensitive adhesive and the silicone-based pressure-sensitive adhesive is not properly peeled from the acrylic pressure-sensitive adhesive or/and the silicone-based pressure-sensitive adhesive. Problems can arise.
  • the release film 120 may have a peel force change rate of 50% or less according to Equation 2 below for the acrylic pressure-sensitive adhesive and the silicone-based pressure-sensitive adhesive:
  • the release film 120 may implement a stable peeling force for the acrylic adhesive and the silicone adhesive without changing over time.
  • the residual adhesion rate of the release film 120 may be 85% or more.
  • the release agent may be transferred to the adhesion layer due to insufficient curing of the release layer 110, and the adhesion of the pressure-sensitive adhesive may be deteriorated.
  • substitution is derived by exchanging one or more hydrogens with another atom or functional group in an unsubstituted mother group.
  • a functional group when a functional group is considered to be “substituted,” it means that the functional group is an alkyl group having 1 to 40 carbon atoms, an alkenyl group having 2 to 40 carbon atoms, an alkynyl group having 2 to 40 carbon atoms, or a cyclo group having 3 to 40 carbon atoms. It means substituted with one or more substituents selected from an alkyl group, a cycloalkenyl group having 3 to 40 carbon atoms, and an aryl group having 7 to 40 carbon atoms.
  • a functional group is described as being “optionally substituted”, it is meant that the functional group may be substituted with the aforementioned substituents.
  • the C1-C10 monovalent hydrocarbon group includes, for example, a linear alkyl group such as a methyl group, an ethyl group, a hexyl group, an octyl group, and a decyl group; branched alkyl groups such as isopropyl group, tert-butyl group, neopentyl group and hexyl group; Cyclic alkyl groups, such as a cyclopentyl group and a cyclohexyl group, Aryl groups, such as a vinyl group, a henyl group, and a tolyl group, Arylalkyl groups, such as a benzyl group and a phenethyl group; means etc. Among them, it may be an alkyl group in consideration of the ease of procurement of raw materials, and may be a methyl group or an ethyl group in consideration of the usefulness of the product.
  • the C2-C10 alkenyl group refers to a branched or unbranched hydrocarbon having at least one carbon-carbon double bond.
  • alkenyl groups include vinyl, allyl, butenyl, isopropenyl, or isobutenyl.
  • a 50 ⁇ m thick polyester film (Toray Advanced Materials, XD500P) was prepared.
  • an organopolysiloxane represented by the following Chemical Formula 1 including a fluorinated alkyl group represented by the following Chemical Formula 2 (Dow Chemical, Q2-7785), a fluorine-free containing a vinyl group and a methyl group 100 parts by weight of organopolysiloxane (Shin-Etsu, KS847H), 3 parts by weight of hydrogen polysiloxane (Q2-7560, Dow Chemical), and 0.1 parts by weight of a platinum chelate catalyst (manufactured by Dow Chemical, SYL-OFF 4000) are diluted in heptane solvent
  • a composition for forming a release layer having a total solid content of 5% by weight was prepared.
  • a release film was prepared by coating the composition for forming a release layer on one surface of the polyester film and heat-treating it for 60 seconds in a hot air dryer at 150° C. to form a release layer with a thickness of 0.3 ⁇ m.
  • R 1 is a vinyl group
  • R 2 , R 3 are each a methyl group
  • R 4 is a fluoroalkyl group represented by Formula 2
  • n 4
  • m 2
  • * is a bonding site with a neighboring atom.
  • fluorinated organopolysiloxane 50 parts by weight of the organopolysiloxane represented by Formula 1 (Dow Chemical, Q2-7785) including a fluorinealkyl group represented by Formula 2 and a fluorine ether group represented by Formula 6 below
  • a release film was prepared in the same manner as in Example 1, except that 50 parts by weight of the organopolysiloxane represented by 5 (Shin-Etsu Silicone, X-70-201S) was used:
  • R′ 1 is a vinyl group
  • R′ 2 is a fluorine ether group represented by Formula 6;
  • n' is 2
  • m' is 4
  • x' is 1.
  • release film was prepared by coating the composition for forming a release layer on one side of the polyester film and heat-treating it for 60 seconds in a hot air dryer at 150° C. to form a release layer with a thickness of 1 ⁇ m.
  • a release film was prepared in the same manner.
  • a release film was prepared in the same manner as in Example 1, except that a composition for forming a release layer was prepared by adding 1 wt% of silica particles having a particle diameter of 2 ⁇ m based on the total solid content.
  • release film was prepared by coating the composition for forming a release layer on one side of the polyester film and heat-treating it in a hot air dryer at 150° C. for 60 seconds to form a release layer having a thickness of 2.5 ⁇ m, and A release film was prepared in the same manner.
  • release film was prepared by coating the composition for forming a release layer on one side of the polyester film and heat-treating it for 60 seconds in a hot air dryer at 150° C. to form a release layer having a thickness of 0.01 ⁇ m.
  • a release film was prepared in the same manner.
  • a release film was prepared in the same manner as in Example 1, except that fluorinated organopolysiloxane was not used.
  • a release film was prepared in the same manner as in Example 1, except that the fluorinated organopolysiloxane represented by Chemical Formula 4 (Shin-Etsu, KS847H) was not used.
  • the atomic composition of silicon (Si), fluorine (F), carbon (C), and oxygen (O) was analyzed with an XPS analyzer for the surface of the release layer of each release film and expressed in atomic%.
  • XPS analyzer K-ALPHA from ThermoFisher was used, and the spot size was set to 400 ⁇ m.
  • the content (atomic%) ratio of fluorine atoms/silicon atoms was calculated using the analyzed fluorine atoms and silicon atoms.
  • Each release film was cut into a size of 500 mm x 1500 mm to prepare a sample.
  • the samples were stored at 25° C., 65% RH for 24 hours (initial peel force sample) and 7 days (7 days later peel force sample).
  • the silicone-based adhesive tape (SYMBIO, MY2G) and the acrylic adhesive tape (TESA, TESA7475) were respectively pressed at 50 °C and 20 g/cm 2 under a load of 20 g/cm 2 for 24 hours on the release layer of the samples, and then the cheminstrument AR-1000 device was applied.
  • the peel force of 250 mm x 1500 mm size was measured using 180 °, 0.3 mpm speed. At this time, the peel force was measured 5 times and then the average value was calculated to obtain the initial peel force and the peel force after 7 days, and the rate of change of the peel force was obtained by substituting the formula 2 below:
  • Each release film was cut into a size of 500 mm x 1500 mm to prepare a sample.
  • the samples were stored at 25° C., 65% RH for 24 hours.
  • the adhesive tape adhered to the release layer was collected without contamination.
  • the adhesive tape was adhered to the surface of the polyethylene terephthalate film having a flat and clean surface.
  • the adhesive tape adhered to the surface of the polyethylene terephthalate film was reciprocally compressed once with a 2 kg tape roller (ASTMD-1000-55T).
  • the reduced modulus and surface hardness were measured for the release layer of each release film using a nanoindenter analyzer (Hysitron, TI950 Triboindenter).
  • the release films prepared in Examples 1 to 6 have stable peeling force due to low peeling force with respect to the silicone-based adhesive, and the peeling force and peeling force change rate for the acrylic adhesive.
  • the release film prepared by Comparative Example 1 (when the fluorinated organopolysiloxane content is low) and Comparative Example 5 (when only the non-fluorinated organopolysiloxane is used alone) The release film was completely laminated to the silicone pressure-sensitive adhesive, so that it was not peeled off It can be seen that the conversion modulus of elasticity and the surface hardness of the release layer are low, so that the peel force change rate is as large as 50% or more.
  • the release films prepared by Comparative Example 2 (when the content of fluorinated organopolysiloxane is high) and Comparative Example 3 (when the thickness of the release layer is thick) did not cure well, so the residual adhesion rate was reduced and the peel force change rate was also high that can be checked
  • the release film prepared by Comparative Example 6 when only fluorinated organopolysiloxane was used alone) showed light peeling properties with a peeling force of 10 gf/25mm or less with respect to the silicone adhesive, but the peeling force with respect to the acrylic adhesive was 10 gf/ Measured over 25mm.
  • the release film prepared by Comparative Example 4 (when the thickness of the release layer was thin) had poor coverage of the release layer, so that the peeling force was high when laminating with the silicone pressure-sensitive adhesive and the acrylic pressure-sensitive adhesive. From this, it can be seen that since the release layer of the release film of the present invention has an appropriate converted modulus and surface hardness, the release film exhibits light peeling properties for both the acrylic pressure-sensitive adhesive and the silicone-based pressure-sensitive adhesive. In addition, it can be seen that the release film of the present invention has a high surface hardness compared to the silicone-based release film, so that the peel force change rate for the acrylic pressure-sensitive adhesive is low, and blocking is improved when the release film is wound.

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Abstract

A release film, an optical film comprising same, and an electronic device are disclosed. The release film comprises a substrate and a release layer positioned on at least one surface of the substrate, wherein the release layer is a cured layer of a release-layer-forming composition comprising a blend of a fluorine-containing organopolysiloxane and a fluorine-free organopolysiloxane, the content ratio of fluorine atom/silicon atom decreases from the surface of the release layer to the center thereof, the reduced modulus of the release layer, measured by means of nanoindentation is 2-6 GPa, and the surface hardness of the release layer, measured by means of nanoindentation, can be 0.3-0.6 GPa.

Description

이형필름release film
이형필름에 관한 것이다.It relates to a release film.
최근 디스플레이, 테이프, 및 라벨 등의 업계에서 공정성 개선 및 생산성 향상을 위해 박리력이 낮은 초경박리 이형필름에 대한 사용이 증가하고 있다.Recently, in industries such as displays, tapes, and labels, the use of carbide release films with low peeling force is increasing in order to improve processability and improve productivity.
일반적인 아크릴, 에폭시 등의 점착제에 사용되는 실리콘계 이형필름은 이형층의 경화 밀도, 탄성계수(Young's modulus), 환산탄성계수(reduced modulus), 및 경도(hardness)가 낮아 소프트(soft)하며 두께가 두꺼울수록 박리력이 낮아진다. 그런데, 상기 실리콘계 이형필름은 박리력이 낮아질수록 잔류접착률 및 기재와의 밀착력이 감소할 뿐만 아니라 이형층 표면의 탄성계수 및 경도가 낮기 때문에 권취시 블로킹이 발생할 수 있다.Silicone-based release films used for general adhesives such as acrylic and epoxy are soft and thick due to low curing density, Young's modulus, reduced modulus, and hardness of the release layer. The more the peeling force is lowered. However, in the silicone-based release film, the lower the peeling force, the lower the residual adhesion rate and the adhesion to the substrate, as well as the low elastic modulus and hardness of the surface of the release layer, so blocking may occur during winding.
또한 상기 실리콘계 이형필름은 실리콘계 점착제를 사용하는 경우, 상기 실리콘계 이형필름은 상기 실리콘계 점착제에 완전히 합지되어 박리되지 않는다. 이로 인해, 상기 실리콘계 점착제에는 불소계 수지를 포함한 이형제가 도포된 필름이 흔히 사용되고 있다. In addition, when the silicone-based release film uses a silicone-based adhesive, the silicone-based release film is completely laminated to the silicone-based adhesive and is not peeled off. For this reason, the silicone-based pressure-sensitive adhesive A film coated with a release agent including a fluorine-based resin is commonly used.
그러나 불소계 수지를 포함하는 이형제는 표면에너지가 낮아 일반 유기용매와의 혼합이 잘 되지 않고 코팅 불량을 야기할 수 있어 불소계 용매를 사용해야 한다. 상기 불소계 수지를 포함하는 이형제는 일반 실리콘계 이형제 대비 수십 배 이상의 고가이기 때문에 생산성 및 경제성 측면에서 문제가 있다. However, the release agent containing the fluorine-based resin has a low surface energy, so it is difficult to mix with a general organic solvent and may cause a coating defect, so a fluorine-based solvent should be used. Since the release agent containing the fluorine-based resin is several tens of times more expensive than the general silicone-based release agent, there is a problem in terms of productivity and economic efficiency.
따라서 아크릴계 점착제 및 실리콘계 점착제 모두 사용이 가능하면서 이형층의 표면경도 및 환산탄성계수(reduced modulus)가 높지만 박리력 및 박리력 변화율이 낮은 이형필름에 대한 요구가 있다. Therefore, there is a need for a release film that can be used with both an acrylic pressure-sensitive adhesive and a silicone-based pressure-sensitive adhesive and has a high surface hardness and reduced modulus of the release layer, but a low peel force and a low rate of change in peel force.
일 측면은 아크릴계 점착제 및 실리콘계 점착제 모두 사용이 가능하면서 이형층의 표면경도 및 환산탄성계수(reduced modulus)가 높지만 박리력 및 박리력 변화율이 낮은 이형필름을 제공하는 것이다.One aspect is to provide a release film that can be used with both an acrylic pressure-sensitive adhesive and a silicone-based pressure-sensitive adhesive, and has a high surface hardness and a reduced modulus of a release layer, but has a low peel force and a low rate of change in peel force.
일 측면에 따라,According to one aspect,
기재; 및 상기 기재의 적어도 일 면에 위치하는 이형층;을 포함하고,write; and a release layer located on at least one surface of the substrate;
상기 이형층은 함불소 오르가노 폴리실록산 및 비함불소 오르가노 폴리실록산의 블렌드를 포함하는 이형층 형성용 조성물의 경화층이며,The release layer is a cured layer of a composition for forming a release layer comprising a blend of a fluorinated organopolysiloxane and a fluorinated organopolysiloxane,
상기 이형층은 표면에서 중심방향으로 불소원자/실리콘 원자 함량비가 감소하며,The release layer decreases the fluorine atom/silicon atom content ratio from the surface to the center,
상기 이형층은 나노인덴테이션법에 의해 측정한 환산탄성계수(reduced modulus)가 2 내지 6 GPa이며,The release layer has a reduced modulus measured by the nanoindentation method of 2 to 6 GPa,
상기 이형층은 나노인덴테이션법에 의해 측정한 표면 경도(surface hardness)가 0.3 내지 0.6 GPa인, 이형필름이 제공된다.The release layer has a surface hardness measured by the nanoindentation method of 0.3 to 0.6 GPa, the release film is provided.
상기 이형층 표면에 대해 XPS 분석에 의한 불소원자/실리콘 원자의 함량(atomic%)비는 1.5 내지 4.5일 수 있다.The content (atomic%) ratio of fluorine atoms/silicon atoms by XPS analysis with respect to the surface of the release layer may be 1.5 to 4.5.
상기 이형층의 표면에너지는 10 dyne/cm 내지 16 dyne/cm일 수 있다.The surface energy of the release layer may be 10 dyne/cm to 16 dyne/cm.
상기 이형필름은 아크릴계 점착제 및 실리콘계 점착제에 대한 박리력이 180 ° 박리각도, 0.3mpm 박리속도에서 0.5 gf/25mm 내지 10 gf/25mm일 수 있다. The release film may have a peeling force of 0.5 gf/25mm to 10 gf/25mm at a peeling angle of 180° and a peeling rate of 0.3mpm for the acrylic pressure-sensitive adhesive and the silicone-based pressure-sensitive adhesive.
상기 이형필름은 아크릴계 점착제 및 실리콘계 점착제에 대한 하기 식 2에 의한 박리력 변화율이 50% 이하일 수 있다:The release film may have a peel force change rate of 50% or less according to the following formula 2 for the acrylic pressure-sensitive adhesive and the silicone-based pressure-sensitive adhesive:
[식 2][Equation 2]
Figure PCTKR2021008195-appb-I000001
Figure PCTKR2021008195-appb-I000001
상기 이형필름의 잔류접착률은 85% 이상일 수 있다.The residual adhesion rate of the release film may be 85% or more.
상기 이형층의 두께는 0.03 ㎛ 내지 2.0 ㎛일 수 있다.The release layer may have a thickness of 0.03 μm to 2.0 μm.
상기 함불소 폴리실록산은 하기 화학식 1로 표시되는 오르가노 폴리실록산을 포함할 수 있다:The fluorinated polysiloxane may include an organo polysiloxane represented by the following Chemical Formula 1:
[화학식 1][Formula 1]
Figure PCTKR2021008195-appb-I000002
Figure PCTKR2021008195-appb-I000002
[화학식 2][Formula 2]
Figure PCTKR2021008195-appb-I000003
Figure PCTKR2021008195-appb-I000003
[화학식 3][Formula 3]
Figure PCTKR2021008195-appb-I000004
Figure PCTKR2021008195-appb-I000004
상기 화학식 1에서,In Formula 1,
R1은 치환 또는 비치환된 C1~C10의 1가 탄화수소기, 또는 치환 또는 비치환된 C2~C10의 알케닐기이고;R 1 is a substituted or unsubstituted C1-C10 monovalent hydrocarbon group, or a substituted or unsubstituted C2-C10 alkenyl group;
R2는 치환 또는 비치환된 C1~C10의 1가 탄화수소기, 치환 또는 비치환된 C2~C10의 알케닐기, 또는 수소이고;R 2 is a substituted or unsubstituted C1-C10 monovalent hydrocarbon group, a substituted or unsubstituted C2-C10 alkenyl group, or hydrogen;
R3 및 R4는 서로 독립적으로 상기 화학식 2로 표시되는 함불소알킬기, 상기 화학식 3으로 표시되는 함불소에테르기, 치환 또는 비치환된 C1~C10의 1가 탄화수소기, 치환 또는 비치환된 C2~C10의 알케닐기, 또는 수소이되,R 3 and R 4 are each independently a fluorinated alkyl group represented by Formula 2, a fluorinated ether group represented by Formula 3, A substituted or unsubstituted C1~ C10 monovalent hydrocarbon group, a substituted or unsubstituted C2~ C10 alkenyl group, or hydrogen,
상기 R3 및 R4 중 적어도 하나는 상기 화학식 2로 표시되는 함불소알킬기, 상기 화학식 3으로 표시되는 함불소에테르기, 또는 이들 조합이고;at least one of R 3 and R 4 is a fluorinated alkyl group represented by Formula 2, a fluorinated ether group represented by Formula 3, or a combination thereof;
n은 1~8의 정수이고, m은 1~5의 정수이고;n is an integer from 1 to 8, m is an integer from 1 to 5;
p는 1~5의 정수이고, q는 0 또는 1이고, r은 0, 1 또는 2이고, v는 1~5의 정수이고;p is an integer from 1 to 5, q is 0 or 1, r is 0, 1 or 2, and v is an integer from 1 to 5;
A는 산소원자 또는 단결합이고;A is an oxygen atom or a single bond;
x, y, z는 각각 1 이상의 정수이고;x, y, and z are each an integer of 1 or more;
*은 이웃한 원자와의 결합 사이트이고;* is a binding site with a neighboring atom;
단, R1, R2 중 적어도 하나는 치환 또는 비치환된 C2~C10의 알케닐기일 수있다.However, at least one of R 1 and R 2 may be a substituted or unsubstituted C2~C10 alkenyl group.
상기 함불소 오르가노 폴리실록산의 함량은 비함불소 오르가노 폴리실록산 100 중량부를 기준으로 하여 10 중량부 내지 300 중량부일 수 있다.The content of the fluorinated organopolysiloxane may be 10 parts by weight to 300 parts by weight based on 100 parts by weight of the non-fluorinated organopolysiloxane.
상기 이형층은 유무기입자를 더 포함할 수 있다.The release layer may further include organic/inorganic particles.
상기 이형층은 하이드로겐 폴리실록산(hydrogen polysiloxane) 및 촉매 중 1종 이상을 더 포함할 수 있다. The release layer may further include at least one of hydrogen polysiloxane and a catalyst.
일 측면에 따른 이형필름은 함불소 오르가노 폴리실록산 및 비함불소 오르가노 폴리실록산의 블렌드를 포함하는 이형층 형성용 조성물의 경화층인 이형층을 포함한다. 상기 이형필름은 아크릴계 점착제 및 실리콘계 점착제 모두에 대한 박리력 및 박리력 변화율이 낮으며, 표면경도 및 환산탄성계수(reduced modulus)가 높아 필름 권취시 블로킹 현상을 방지할 수 있다. A release film according to one aspect includes a release layer, which is a cured layer of a composition for forming a release layer including a blend of fluorinated organopolysiloxane and non-fluorinated organopolysiloxane. The release film has a low peel force and a low change rate of peel force for both the acrylic pressure-sensitive adhesive and the silicone-based pressure-sensitive adhesive, and has a high surface hardness and reduced modulus to prevent blocking during film winding.
도 1은 일 구현예에 따른 이형필름의 단면 모식도이다.1 is a schematic cross-sectional view of a release film according to an embodiment.
이하, 본 발명의 실시예와 도면을 참조하여 이형필름에 관해 상세히 설명한다. 이들 실시예는 오로지 본 발명을 보다 구체적으로 설명하기 위해 예시적으로 제시한 것일 뿐, 본 발명의 범위가 이들 실시예에 의해 제한되지 않는다는 것은 당업계에서 통상의 지식을 가지는 자에 있어서 자명할 것이다.Hereinafter, the release film will be described in detail with reference to examples and drawings of the present invention. It will be apparent to those of ordinary skill in the art that these examples are only presented as examples to explain the present invention in more detail, and that the scope of the present invention is not limited by these examples. .
달리 정의하지 않는 한, 본 명세서에서 사용되는 모든 기술적 및 과학적 용어는 본 발명이 속하는 기술분야의 숙련자에 의해 통상적으로 이해되는 바와 동일한 의미를 갖는다. 상충되는 경우, 정의를 포함하는 본 명세서가 우선할 것이다.Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In case of conflict, the present specification, including definitions, will control.
본 명세서에서 설명되는 것과 유사하거나 동등한 방법 및 재료가 본 발명의 실시 또는 시험에 사용될 수 있지만, 적합한 방법 및 재료가 본 명세서에 기재된다. Although methods and materials similar or equivalent to those described herein can be used in the practice or testing of the present invention, suitable methods and materials are described herein.
본 명세서에서 "포함"이라는 용어는 특별히 반대되는 기재가 없는 한 다른 구성요소를 제외하는 것이 아니라 다른 구성요소를 더 포함할 수 있는 것을 의미한다.In the present specification, the term "included" means that other components may be further included, rather than excluding other components, unless otherwise stated.
본 명세서에서 "이들 조합"이라는 용어는 기재된 구성요소들 하나 이상과의 혼합 또는 조합을 의미한다. As used herein, the term “combination of these” means a mixture or combination with one or more of the described components.
본 명세서에서 "및/또는"이라는 용어는 관련 기재된 하나 이상의 항목들의 임의의 조합 및 모든 조합을 포함하는 것을 의미한다. 본 명세서에서 "또는"이라는 용어는 "및/또는"을 의미한다. 본 명세서에서 구성요소들의 앞에 "적어도 1종", 또는 "하나 이상"이라는 표현은 전체 구성요소들의 목록을 보완할 수 있고 상기 기재의 개별 구성요소들을 보완할 수 있는 것을 의미하지 않는다.As used herein, the term “and/or” is meant to include any and all combinations of one or more of the related listed items. As used herein, the term “or” means “and/or”. The expression “at least one” or “one or more” in front of components in the present specification does not imply that it may supplement the entire list of components and may supplement individual components of the description.
본 명세서에서 일 구성요소가 다른 구성요소의 "상에" 또는 "위에" 배치되어 있다고 언급되는 경우, 일 구성요소는 다른 구성요소 위에 직접 배치될 수 있거나 상기 구성요소들 사이에 개재된 구성요소들이 존재할 수 있을 수 있다. 반면에, 일 구성요소가 다른 구성요소 "상에 직접" 또는 "위에 직접" 배치되어 있다고 언급되는 경우, 개재된 구성요소들이 존재하지 않을 수 있다.In the present specification, when it is stated that an element is disposed "on" or "above" another element, one element may be disposed directly on the other element, or the elements interposed between the elements are may exist. On the other hand, when an element is referred to as being disposed "directly on" or "directly on" another element, intervening elements may not be present.
본 명세서에서 "~계 수지", "~ 계 중합체", 또는/및 "~ 계 공중합체"는 "~ 수지", "~ 중합체", "~ 공중합체", 또는/및 "~ 수지, 중합체, 또는 공중합체의 유도체"를 모두 포함하는 광의의 개념이다. As used herein, "~-based resin", "~-based polymer", or/and "~-based copolymer" means "~ resin", "~ polymer", "~ copolymer", or/and "~ resin, polymer, Or a derivative of a copolymer" is a broad concept including all.
본 명세서에서 "이들 수지로 가교된 중합체 또는 공중합체"라는 용어는 "전술한 수지로 가교된 중합체 또는 공중합체"를 의미한다. As used herein, the term "polymer or copolymer crosslinked with these resins" means "polymer or copolymer crosslinked with the above-mentioned resins".
본 명세서에서 각각의 구성요소들은 단수 및 복수를 모두 포함하는 개념이다.In the present specification, each component is a concept including both the singular and the plural.
본 명세서에서 달리 기술되지 않는다면, 모든 백분율, 부, 비 등은 중량 기준이다. 또한 양, 농도, 또는 다른 값 또는 파라미터가 범위, 바람직한 범위 또는 바람직한 상한치와 바람직한 하한치의 목록 중 어느 하나로 주어질 경우, 이것은 범위가 별도로 개시되는 지에 관계없이 임의의 상한 범위 한계치 또는 바람직한 값과 임의의 하한 범위 한계치 또는 바람직한 값의 임의의 쌍으로부터 형성된 모든 범위를 구체적으로 개시하는 것으로 이해되어야 한다.Unless otherwise stated herein, all percentages, parts, ratios, etc. are by weight. Also, when an amount, concentration, or other value or parameter is given as any one of a range, a preferred range, or a list of upper and preferred upper limits and lower preferred limits, this means any upper range limit or preferred value and any lower limit, whether or not the range is separately disclosed. It is to be understood that all ranges formed from any pair of range limits or preferred values are specifically disclosed.
본 명세서에서 수치값의 범위가 언급될 경우, 달리 기술되지 않는다면, 그 범위는 그 종점 및 그 범위 내의 모든 정수와 분수를 포함하는 것으로 의도된다. 본 발명의 범주는 범위를 정의할 때 언급되는 특정값으로 한정되지 않는 것으로 의도된다. When a range of numerical values is recited herein, unless otherwise stated, the range is intended to include the endpoints and all integers and fractions within the range. It is intended that the scope of the invention not be limited to the particular values recited when defining the ranges.
일 구현예에 따른 이형필름은 기재; 및 상기 기재의 적어도 일 면에 위치하는 이형층;을 포함하고, 상기 이형층은 함불소 오르가노 폴리실록산 및 비함불소 오르가노 폴리실록산의 블렌드를 포함하는 이형층 형성용 조성물의 경화층이며, 상기 이형층은 표면에서 중심방향으로 불소원자/실리콘 원자 함량비가 감소하며, 상기 이형층은 나노인덴테이션법에 의해 측정한 환산탄성계수(reduced modulus)가 2 내지 6 GPa이며, 상기 이형층은 나노인덴테이션법에 의해 측정한 표면 경도(surface hardness)가 0.3 내지 0.6 GPa일 수 있다.A release film according to an embodiment includes a substrate; and a release layer located on at least one surface of the substrate, wherein the release layer is a cured layer of a composition for forming a release layer comprising a blend of a fluorinated organopolysiloxane and a fluorinated organopolysiloxane, and the release layer The fluorine atom/silicon atom content ratio decreases from the surface of the silver to the center direction, and the release layer has a reduced modulus measured by a nanoindentation method of 2 to 6 GPa, and the release layer has a nanoindentation method. The surface hardness measured by the tation method may be 0.3 to 0.6 GPa.
일 구현예에 따른 이형필름은 아크릴계 점착제 및 실리콘계 점착제 모두에 대한 박리력 및 박리력 변화율이 낮으며, 표면경도 및 환산탄성계수(reduced modulus)가 높아 필름 권취시 블로킹 현상을 방지할 수 있다. The release film according to an embodiment has low peel force and peel force change rate for both the acrylic pressure-sensitive adhesive and the silicone-based pressure-sensitive adhesive, and has high surface hardness and reduced modulus to prevent blocking during film winding.
이형필름을 구성하는 기재, 이형층, 상기 이형필름, 및 이를 포함하는 광학필름 및 전자소자에 대하여 구체적으로 설명하면 다음과 같다.The base material constituting the release film, the release layer, the release film, and the optical film and electronic device including the same will be described in detail as follows.
<기재><Reference>
본 발명에 사용되는 기재는 이형필름의 기재로서 알려진 공지의 기재필름 또는 시트를 이용할 수 있다. 예를 들어, 기재로는 폴리에스테르계 수지 필름을 사용할 수 있다. 폴리에스테르계 수지로는 이형필름 분야에서 통용되는 공지의 기재필름을 사용할 수 있다. 예를 들어, 상기 폴리에스테르계 기재필름은 대한민국 등록특허 제10-1268584호, 대한민국 공개특허 제2012-45213호, 및 제2012-99546호 등에 개시된 폴리에스테르계 기재필름을 사용할 수 있다. 다만, 본 발명의 일 구현예에서는 본 발명의 특징만으로 설명하기 위하여, 폴리에스테르계 기재필름에 대해 한정없이 기술하고 있으나, 공지의 폴리에스테르계 기재필름에 관한 기술적 특징을 포함하는 것으로 이해되어야 할 것이다.As the substrate used in the present invention, a known substrate film or sheet may be used as a substrate for a release film. For example, a polyester-based resin film may be used as the substrate. As the polyester-based resin, a known base film commonly used in the field of release film may be used. For example, the polyester-based base film may be a polyester-based base film disclosed in Korean Patent Registration No. 10-1268584, Korean Patent Publication No. 2012-45213, and No. 2012-99546. However, in one embodiment of the present invention, in order to describe only the features of the present invention, the polyester-based base film is described without limitation, but it should be understood as including the technical features of the known polyester-based base film. .
상기 폴리에스테르계 기재필름은 폴리에틸렌테레프탈레이트, 폴리부틸렌테레프탈레이트, 또는 폴리에틸렌나프탈레이트 등을 포함할 수 있다.The polyester-based base film may include polyethylene terephthalate, polybutylene terephthalate, or polyethylene naphthalate.
상기 기재필름을 형성하는 폴리에스테르계 수지로는 방향족 디카르복실산과 지방족 글리콜을 중축합시켜 얻은 폴리에스테르일 수 있다.The polyester-based resin forming the base film may be a polyester obtained by polycondensation of an aromatic dicarboxylic acid and an aliphatic glycol.
상기 방향족 디카르복실산의 예로는 이소프탈산, 프탈산, 테레프탈산, 2,6-나프탈렌디카르복실산, 아디프산, 세바스산, 옥시카르복실산 (예컨대, ρ-옥시벤조산 등)등을 사용할 수 있고, 상기 지방족 글리콜의 예로는 에틸렌글리콜, 디에틸렌글리콜, 프로필렌글리콜, 부탄디올, 1,4-시클로헥산디메탄올, 네오펜틸글리콜 등을 사용할 수 있다. 이러한 폴리에스테르계 수지는 디카르복실산 성분 및 글리콜 성분 중 2종 이상을 병용할 수도 있으며, 제 3 성분을 함유한 공중합체도 가능하다. Examples of the aromatic dicarboxylic acid include isophthalic acid, phthalic acid, terephthalic acid, 2,6-naphthalenedicarboxylic acid, adipic acid, sebacic acid, and oxycarboxylic acid (eg, ρ-oxybenzoic acid, etc.). and examples of the aliphatic glycol include ethylene glycol, diethylene glycol, propylene glycol, butanediol, 1,4-cyclohexanedimethanol, neopentyl glycol, and the like. These polyester-based resins may use two or more of a dicarboxylic acid component and a glycol component in combination, and a copolymer containing a third component is also possible.
또한 폴리에스테르계 기재필름은 높은 투명성을 갖는 동시에 생산성 및 가공성이 우수한 일축 또는 이축 배향필름을 사용할 수 있다. 상기 폴리에스테르계 기재필름은 폴리에틸렌테레프탈레이트(PET), 또는 폴리에틸렌-2,6-나트탈렌디카르복실레이트(PEN) 등을 사용할 수 있다.In addition, the polyester-based base film may use a uniaxial or biaxially oriented film having high transparency and excellent productivity and processability. As the polyester-based base film, polyethylene terephthalate (PET) or polyethylene-2,6-naphthalene dicarboxylate (PEN) may be used.
또한 폴리에스테르계 기재필름은 우수한 롤(Roll)간 주행 특성을 부여하기 위해 입자들을 함유할 수 있는데, 첨가되는 입자로 우수한 미끄러짐 특성을 나타낼 수 있다면 제한없이 사용할 수 있다. In addition, the polyester-based base film may contain particles in order to provide excellent running characteristics between rolls, and as long as the added particles can exhibit excellent sliding properties, they can be used without limitation.
이러한 입자의 예로는, 실리카, 산화 실리콘, 탄산칼슘, 황산칼슘, 인산칼슘, 탄산마그네슘, 인산마그네슘, 탄산바륨, 카올린, 산화알류미늄, 산화티탄 등의 입자를 포함할 수 있으며, 사용되는 입자의 형상에 한정이 있는 것은 아니나, 예를 들어, 구상, 괴상, 봉상, 판상 입자 중 어떤 것이라도 사용될 수 있다.Examples of such particles may include particles such as silica, silicon oxide, calcium carbonate, calcium sulfate, calcium phosphate, magnesium carbonate, magnesium phosphate, barium carbonate, kaolin, aluminum oxide, titanium oxide, and the like, and the shape of the particles used Although not limited to, for example, any of spherical, bulky, rod-shaped, plate-shaped particles may be used.
또한 입자의 경도, 비중, 및 색상에 대해 제한하지 않으나, 필요에 따라 2 종류 이상을 병행 사용할 수 있으며, 사용하는 입자의 평균입경은 0.1 내지 5 ㎛일 수 있고, 예를 들어 0.1 내지 2 ㎛ 범위의 것을 사용할 수 있다. 이때, 입자의 평균입경이 0.1 ㎛ 미만이면, 입자 간의 응집현상이 발생하여 분산불량이 발생될 수 있고, 입자의 평균입경이 5 ㎛를 초과하면, 필름의 표면 거칠기 특성이 나빠져 후가공시 코팅 불량이 발생될 수 있다.In addition, the hardness, specific gravity, and color of the particles are not limited, but two or more types may be used in parallel as needed, and the average particle diameter of the particles used may be 0.1 to 5 μm, for example, 0.1 to 2 μm in the range of can be used. At this time, if the average particle diameter of the particles is less than 0.1 μm, aggregation between particles may occur, resulting in poor dispersion. can occur.
또한 폴리에스테르계 기재필름에 입자가 포함될 경우, 입자의 함량은 폴리에스테르계 기재필름 전체 중량을 기준으로 하여 0.01 내지 5 중량%일 수 있고, 예를 들어 0.01 내지 3 중량%일 수 있다. 입자의 함량이 0.01 중량% 미만이면, 폴리에스테르 필름의 미끄러짐 특성이 나빠져 롤 간의 주행 특성이 나빠질 수 있으며, 입자의 함량이 5 중량%를 초과하면, 필름의 표면 평활성이 나빠질 수 있다.In addition, when particles are included in the polyester-based base film, the content of the particles may be 0.01 to 5 wt%, for example, 0.01 to 3 wt%, based on the total weight of the polyester-based base film. If the content of the particles is less than 0.01% by weight, the sliding properties of the polyester film may deteriorate and the running characteristics between the rolls may deteriorate, and if the content of the particles exceeds 5% by weight, the surface smoothness of the film may deteriorate.
폴리에스테르계 기재필름은 두께가 제한되지 않으나, 20 ~ 125 ㎛일 수 있다.The thickness of the polyester-based base film is not limited, but may be 20 to 125 μm.
상기 폴리에스테르계 기재필름이 20 um 이하로 너무 얇은 경우 가공 시 열처리에 의해 변형될 우려가 있으며, 125 um 이상 너무 두꺼운 경우에는 열이 충분히 전달되지 않아 경화에 문제가 있을 수 있다.If the polyester-based base film is too thin at 20 um or less, there is a risk of deformation by heat treatment during processing, and if it is too thick over 125 um, heat may not be sufficiently transmitted and there may be a problem in curing.
<이형층><Release layer>
일 구현예에 따른 이형필름의 이형층은 함불소 오르가노 폴리실록산 및 비함불소 오르가노 폴리실록산의 블렌드를 포함하는 이형층 형성용 조성물의 경화층일 수 있다.The release layer of the release film according to an exemplary embodiment may be a cured layer of a composition for forming a release layer including a blend of fluorinated organopolysiloxane and fluorinated organopolysiloxane.
상기 이형층은 표면에서 중심방향으로 불소원자/실리콘 원자 함량비가 감소할 수 있다. 이형층은 그 표면에 실리콘 원자 대비 불소 원자의 함량이 높을수록 실리콘계 점착제와의 합지시 박리성이 우수하기에, 상기 이형층은 아크릴계 점착제뿐만 아니라 실리콘계 점착제에 대해서도 박리력 및 박리력 변화율이 낮은 특성을 가질 수 있다.In the release layer, the fluorine atom/silicon atom content ratio may decrease from the surface to the center. The release layer has a higher content of fluorine atoms compared to silicon atoms on its surface, so the peelability is excellent when laminated with a silicone pressure-sensitive adhesive. can have
상기 이형층 표면에 대해 XPS(X-ray photoelectron spectroscopy) 분석에 의한 불소원자/실리콘 원자의 함량(atomic%)비는 1.5 내지 4.5일 수 있다. 상기 이형층 표면에 대해 XPS 분석에 의한 불소원자/실리콘 원자의 함량(atomic%)비가 1.5 미만이라면, 실리콘계 점착제와 합지시 박리되지 않을 수 있다. 상기 이형층 표면에 대해 XPS 분석에 의한 불소원자/실리콘 원자의 함량(atomic%)비가 4.5 초과라면, 상기 함불소 오르가노 폴리실록산의 경화에 많은 열량이 필요하므로 기재의 열변형을 유발할 수 있으며 경도도 높아지기 때문에 아크릴계 점착제에 대한 박리력이 증가할 수 있다.The content (atomic%) ratio of fluorine atoms/silicon atoms by X-ray photoelectron spectroscopy (XPS) analysis on the surface of the release layer may be 1.5 to 4.5. If the content (atomic%) ratio of fluorine atoms/silicon atoms by XPS analysis with respect to the surface of the release layer is less than 1.5, it may not be peeled off during lamination with the silicone-based pressure-sensitive adhesive. If the content (atomic%) ratio of fluorine atoms/silicon atoms by XPS analysis with respect to the surface of the release layer exceeds 4.5, a large amount of heat is required to cure the fluorinated organopolysiloxane, so it may cause thermal deformation of the substrate and hardness Since it is high, the peeling force to the acrylic pressure-sensitive adhesive may increase.
또한 이형층 표면을 플라즈마 처리로 식각하고 상기 이형층 내부를 XPS 분석기기로 분석하였을 때, 상기 이형층의 심부에서는 실리콘 원자 100 atomic%를 기준으로 하여 불소 원자를 80 atomic% 미만으로 포함할 수 있다. 본 명세서에서 "심부"는 이형층 표면을 플라즈마로 식각한 이형층 내부를 의미하고, 보다 구체적으로는 XPS 분석기기로 분석하였을 때, 이형층 표면으로부터 C(탄소)의 atomic%가 60 atomic%인 이형층 내부의 지점을 지칭한다. 이형층의 불소원자가 코팅층 표면에 위치할수록 박리력이 우수하기 때문에 이형층 내부에 불소원자가 80 atomic% 이상이라면, 이형층 표면의 불소원자 비중이 줄어들고 실리콘 원자 함량이 증가하여 실리콘계 점착제와의 합지시 박리가 되지 않을 수 있다.In addition, when the surface of the release layer is etched by plasma treatment and the inside of the release layer is analyzed with an XPS analyzer, the depth of the release layer contains less than 80 atomic% of fluorine atoms based on 100 atomic% of silicon atoms. . In the present specification, "deep part" means the inside of the release layer etched by plasma on the surface of the release layer, and more specifically, when analyzed with an XPS analyzer, the atomic% of C (carbon) from the surface of the release layer is 60 atomic% Refers to a point inside the release layer. As the fluorine atoms of the release layer are positioned on the surface of the coating layer, the better the peeling force, so if the fluorine atoms in the release layer are 80 atomic% or more, the fluorine atom weight on the surface of the release layer decreases and the silicon atom content increases, so that peeling off when laminated with a silicone pressure-sensitive adhesive may not be
상기 함불소 폴리실록산은 하기 화학식 1로 표시되는 오르가노 폴리실록산을 포함할 수 있다:The fluorinated polysiloxane may include an organo polysiloxane represented by the following Chemical Formula 1:
[화학식 1][Formula 1]
Figure PCTKR2021008195-appb-I000005
Figure PCTKR2021008195-appb-I000005
[화학식 2][Formula 2]
Figure PCTKR2021008195-appb-I000006
Figure PCTKR2021008195-appb-I000006
[화학식 3][Formula 3]
Figure PCTKR2021008195-appb-I000007
Figure PCTKR2021008195-appb-I000007
상기 화학식 1에서,In Formula 1,
R1은 치환 또는 비치환된 C1~C10의 1가 탄화수소기, 또는 치환 또는 비치환된 C2~C10의 알케닐기일 수 있고;R 1 may be a substituted or unsubstituted C1~C10 monovalent hydrocarbon group, or a substituted or unsubstituted C2~C10 alkenyl group;
R2는 치환 또는 비치환된 C1~C10의 1가 탄화수소기, 치환 또는 비치환된 C2~C10의 알케닐기, 또는 수소일 수 있고;R 2 may be a substituted or unsubstituted C1-C10 monovalent hydrocarbon group, a substituted or unsubstituted C2-C10 alkenyl group, or hydrogen;
R3 및 R4는 서로 독립적으로 상기 화학식 2로 표시되는 함불소알킬기, 상기 화학식 3으로 표시되는 함불소에테르기, 치환 또는 비치환된 C1~C10의 1가 탄화수소기, 치환 또는 비치환된 C2~C10의 알케닐기, 또는 수소이되,R 3 and R 4 are each independently a fluorinated alkyl group represented by Formula 2, a fluorinated ether group represented by Formula 3, A substituted or unsubstituted C1~ C10 monovalent hydrocarbon group, a substituted or unsubstituted C2~ C10 alkenyl group, or hydrogen,
상기 R3 및 R4 중 적어도 하나는 상기 화학식 2로 표시되는 함불소알킬기, 상기 화학식 3으로 표시되는 함불소에테르기, 또는 이들 조합이고;at least one of R 3 and R 4 is a fluorinated alkyl group represented by Formula 2, a fluorinated ether group represented by Formula 3, or a combination thereof;
n은 1~8의 정수일 수 있고, m은 1~5의 정수일 수 있고;n may be an integer from 1 to 8, m may be an integer from 1 to 5;
p는 1~5의 정수일 수 있고, q는 0 또는 1일 수 있고, r은 0, 1 또는 2일 수 있고, v는 1~5의 정수일 수 있고;p may be an integer from 1 to 5, q may be 0 or 1, r may be 0, 1 or 2, v may be an integer from 1 to 5;
A는 산소원자 또는 단결합일 수 있고;A may be an oxygen atom or a single bond;
x, y, z는 각각 1 이상의 정수일 수 있고;x, y, z may each be an integer of 1 or more;
*은 이웃한 원자와의 결합 사이트일 수 있고;* may be a binding site with a neighboring atom;
단, R1, R2 중 적어도 하나는 치환 또는 비치환된 C2~C10의 알케닐기일 수 있다.However, at least one of R 1 and R 2 may be a substituted or unsubstituted C2~C10 alkenyl group.
상기 비함불소 오르가노 폴리실록산은 하기 화학식 4로 표시될 수 있다:The fluorine-free organo polysiloxane may be represented by the following Chemical Formula 4:
[화학식 4][Formula 4]
Figure PCTKR2021008195-appb-I000008
Figure PCTKR2021008195-appb-I000008
상기 화학식 4에서,In Formula 4,
Ra는 치환 또는 비치환된 C1~C10의 1가 탄화수소기, 또는 치환 또는 비치환된 C2~C10의 알케닐기일 수 있고;R a may be a substituted or unsubstituted C1-C10 monovalent hydrocarbon group, or a substituted or unsubstituted C2-C10 alkenyl group;
Rb는 치환 또는 비치환된 C1~C10의 1가 탄화수소기, 치환 또는 비치환된 C2~C10의 알케닐기, 또는 수소일 수 있고;R b may be a substituted or unsubstituted C1-C10 monovalent hydrocarbon group, a substituted or unsubstituted C2-C10 alkenyl group, or hydrogen;
x', y'는 각각 1 이상의 정수일 수 있다. Each of x' and y' may be an integer of 1 or more.
경우에 따라, 상기 함불소 폴리실록산은 상기 화학식 1로 표시되는 오르가노 폴리실록산과 하기 화학식 5로 표시되는 오르가노 폴리실록산의 블렌드일 수 있거나 또는 상기 화학식 1로 표시되는 오르가노 폴리실록산과 상기 화학식 5로 표시되는 오르가노 폴리실록산이 연결된 공중합체일 수 있다:In some cases, the fluorinated polysiloxane may be a blend of the organo polysiloxane represented by the formula (1) and the organo polysiloxane represented by the following formula (5), or the organo polysiloxane represented by the formula (1) and the organo polysiloxane represented by the formula (5) It may be a copolymer in which the organo polysiloxane is linked:
[화학식 5] [Formula 5]
Figure PCTKR2021008195-appb-I000009
Figure PCTKR2021008195-appb-I000009
[화학식 6][Formula 6]
Figure PCTKR2021008195-appb-I000010
Figure PCTKR2021008195-appb-I000010
상기 화학식 5에서,In Formula 5,
R'1은 치환 또는 비치환된 C1~C10의 1가 탄화수소기, 또는 치환 또는 비치환된 C2~C10의 알케닐기일 수 있고;R′ 1 may be a substituted or unsubstituted C1-C10 monovalent hydrocarbon group, or a substituted or unsubstituted C2-C10 alkenyl group;
R'2는 상기 화학식 6으로 표시되는 함불소에테르기일 수 있고;R′ 2 may be a fluorine-containing ether group represented by Formula 6;
n'는 1~8의 정수일 수 있고, m'는 3~17의 정수일 수 있고;n' may be an integer from 1 to 8, m' may be an integer from 3 to 17;
*은 이웃한 원자와의 결합 사이트일 수 있다.* may be a binding site with a neighboring atom.
예를 들어, 상기 화학식 1로 표시되는 오르가노 폴리실록산과 상기 화학식 5로 표시되는 오르가노 폴리실록산의 중량비는 10:1 ~ 1:10일 수 있다.For example, a weight ratio of the organopolysiloxane represented by Formula 1 to the organopolysiloxane represented by Formula 5 may be 10:1 to 1:10.
상기 함불소 오르가노 폴리실록산의 함량은 비함불소 오르가노 폴리실록산 100 중량부를 기준으로 하여 10 중량부 내지 300 중량부일 수 있다. 상기 함불소 오르가노 폴리실록산의 함량이 비함불소 오르가노 폴리실록산 100 중량부를 기준으로 하여 10 중량부 미만이라면, 이형층 표면에서 불소기가 충분히 경화되지 않아 표면에너지가 올라가고, 경도가 낮아져 블로킹 및 점착제의 침투로 인한 경시변화가 크게 발생할 수 있다. 이로 인해, 상기 이형층과 실리콘 점착제와의 합지시 박리되지 않을 수 있다. 상기 함불소 오르가노 폴리실록산의 함량이 비함불소 오르가노 폴리실록산 100 중량부를 기준으로 하여 300 중량부를 초과한다면, 불소기가 포함된 오르가노 폴리실록산의 경화시 많은 에너지가 필요하게 되어 기재가 변형될 우려가 있다.The content of the fluorinated organopolysiloxane may be 10 parts by weight to 300 parts by weight based on 100 parts by weight of the non-fluorinated organopolysiloxane. If the content of the fluorinated organopolysiloxane is less than 10 parts by weight based on 100 parts by weight of the non-fluorinated organopolysiloxane, the fluorine group on the surface of the release layer is not sufficiently cured to increase the surface energy, and the hardness is lowered due to blocking and penetration of the adhesive Significant changes over time may occur. For this reason, when the release layer and the silicone pressure-sensitive adhesive are laminated, it may not be peeled off. If the content of the fluorinated organopolysiloxane exceeds 300 parts by weight based on 100 parts by weight of the non-fluorinated organopolysiloxane, a lot of energy is required during curing of the fluorine-containing organopolysiloxane, and there is a fear that the substrate may be deformed.
상기 이형층의 표면에너지는 10 dyne/cm 내지 16 dyne/cm일 수 있다. 상기 이형층의 표면에너지가 10 dyne/cm 미만이라면, 낮은 표면에너지로 인해 점착제가 도포되지 않을 수 있다. 상기 이형층의 표면에너지가 16 dyne/cm 초과라면, 이형층 표면의 함불소 오르가노 폴리실록산이 충분히 경화되지 않아, 상기 이형층과 실리콘계 점착제가 박리되지 않을 수 있다.The surface energy of the release layer may be 10 dyne/cm to 16 dyne/cm. If the surface energy of the release layer is less than 10 dyne/cm, the pressure-sensitive adhesive may not be applied due to the low surface energy. If the surface energy of the release layer is more than 16 dyne/cm, the fluorinated organopolysiloxane on the surface of the release layer may not be sufficiently cured, and the release layer and the silicone pressure-sensitive adhesive may not be peeled off.
상기 이형층은 나노인덴테이션법에 의해 측정한 환산탄성계수(reduced modulus)가 2 내지 6 GPa일 수 있다.The release layer may have a reduced modulus measured by a nanoindentation method of 2 to 6 GPa.
상기 이형층의 환산탄성계수가 2 GPa 미만이라면, 이형층이 소프트해져 권취시 블로킹 현상이 발생할 수 있다. 상기 이형층의 환산탄성계수가 6 GPa 초과라면, 딱딱한 이형층에 의해 박리력이 높아지게 된다.If the conversion modulus of elasticity of the release layer is less than 2 GPa, the release layer becomes soft and a blocking phenomenon may occur during winding. If the converted elastic modulus of the release layer is more than 6 GPa, the peeling force is increased by the hard release layer.
상기 이형층은 나노인덴테이션법에 의해 측정한 표면 경도(surface hardness)가 0.3 내지 0.6 GPa일 수 있다.The release layer may have a surface hardness measured by a nanoindentation method of 0.3 to 0.6 GPa.
상기 이형층은 나노인덴테이션법에 의해 측정한 표면 경도(surface hardness)가 0.3 GPa 미만이라면, 표면 경화도가 낮아져 점착제 침투로 인해 경시변화가 크게 발생할 수 있다. 상기 이형층은 나노인덴테이션법에 의해 측정한 표면 경도(surface hardness)가 0.6 GPa 초과라면, 높은 표면 경도로 인해 박리력이 상승할 수 있다.If the surface hardness of the release layer measured by the nanoindentation method is less than 0.3 GPa, the surface hardening degree is lowered, and thus, a large change over time may occur due to penetration of the pressure-sensitive adhesive. When the surface hardness of the release layer measured by the nanoindentation method is greater than 0.6 GPa, the peeling force may increase due to the high surface hardness.
상기 이형층은 유무기입자를 더 포함할 수 있다.The release layer may further include organic/inorganic particles.
상기 유무기입자는 천연광물; 1족~4족, 11~12족, 14족, 16~18족 원소의 산화물, 수산화물, 황화물, 질소화물, 또는 할로겐화물; 탄산염, 황산염, 아세트산염, 인산염, 아인산염, 카르복시산염, 규산염, 티탄산염, 붕산염, 또는 이들 수화물; 및 이들 복합 화합물로부터 선택된 무기입자일 수 있다.The organic and inorganic particles are natural minerals; oxides, hydroxides, sulfides, nitrides, or halides of elements of Groups 1 to 4, 11 to 12, 14 and 16 to 18; carbonate, sulfate, acetate, phosphate, phosphite, carboxylate, silicate, titanate, borate, or hydrates thereof; and inorganic particles selected from these complex compounds.
상기 유무기입자는 불소계 수지, 멜라민계 수지, 스티렌계 수지, 아크릴계 수지, 실리콘계 수지, 스티렌-디비닐벤젠계 공중합체 수지, 이들 수지로 가교된 중합체 또는 공중합체로부터 선택된 유기입자일 수 있다.The organic/inorganic particles may be organic particles selected from fluorine-based resins, melamine-based resins, styrene-based resins, acrylic resins, silicone-based resins, styrene-divinylbenzene-based copolymer resins, and polymers or copolymers crosslinked with these resins.
사용하는 유무기입자의 형상은 특별히 제한되지 아니하며, 구상, 괴상, 봉형, 또는 편평형 등일 수 있다. 또한 상기 유무기입자의 경도, 비중, 색 등에 대해서도 제한되지 아니하며, 필요에 따라, 이들 유무기입자는 단독, 혹은 2종 이상을 사용할 수도 있다.The shape of the organic/inorganic particles used is not particularly limited, and may be spherical, bulky, rod-shaped, or flat-shaped. In addition, the hardness, specific gravity, color, etc. of the organic/inorganic particles are not limited, and if necessary, these organic/inorganic particles may be used alone, or two or more kinds may be used.
상기 유무기입자의 평균입경(D50)은 1 ㎛ 내지 5 ㎛일 수 있다. 예를 들어, 상기 유무기 입자의 평균입경(D50)은 3 ㎛ 내지 5 ㎛일 수 있거나 1 ㎛ 내지 2 ㎛일 수 있다. 본 명세서에서, "평균입경(D50)"이라 함은 입자 크기가 가장 작은 입자부터 가장 큰 입자 순서로 누적시킨 분포 곡선에서, 전체 입자 개수를 100%으로 했을 때 가장 작은 입자로부터 50%에 해당되는 입경의 값을 의미한다. D50 값은 당업자에게 널리 공지된 방법으로 측정될 수 있으며, 예를 들어, 입도 분석기(Particle size analyzer)로 측정하거나, 또는 TEM 사진 또는 SEM 사진으로부터 측정할 수 있다. 다른 방법으로는, 동적광산란법(dynamic Light-scattering)을 이용한 측정장치를 이용하여 측정하고, 데이터 분석을 실시하여 각각의 입자 사이즈 범위에 대하여 입자 수를 카운팅한 후, 이로부터 계산을 통하여 D50값을 쉽게 얻을 수 있다.The average particle diameter (D50) of the organic/inorganic particles may be 1 μm to 5 μm. For example, the average particle diameter (D50) of the organic-inorganic particles may be 3 μm to 5 μm or 1 μm to 2 μm. In the present specification, the term "average particle diameter (D50)" refers to 50% from the smallest particle when the total number of particles is 100% in the distribution curve accumulated in the order of the smallest particle to the largest particle. It means the value of the particle size. The D50 value can be measured by a method well known to those skilled in the art, for example, it can be measured with a particle size analyzer, or can be measured from a TEM photograph or an SEM photograph. As another method, it is measured using a measuring device using a dynamic light-scattering method, data analysis is performed, the number of particles is counted for each particle size range, and the D50 value is calculated therefrom. can be obtained easily.
상기 유무기 입자의 평균입경(D50)이 1 ㎛ 미만이라면, 충분한 표면조도를 얻을 수 없기 때문에 블로킹 현상을 예방할 수 없다. 상기 유무기 입자의 평균입경(D50)이 5 ㎛ 초과라면 필름의 결점으로 작용할 수 있다.If the average particle diameter (D50) of the organic-inorganic particles is less than 1 μm, the blocking phenomenon cannot be prevented because sufficient surface roughness cannot be obtained. If the average particle diameter (D50) of the organic-inorganic particles exceeds 5 μm, it may act as a defect of the film.
상기 이형층은 하이드로겐 폴리실록산(hydrogen polysiloxane) 및 촉매 중 1종 이상을 더 포함할 수 있다. The release layer may further include at least one of hydrogen polysiloxane and a catalyst.
상기 하이드로겐 폴리실록산은 부가반응형 실록산 수지, 축합반응형 실록산 수지, 및 자외선경화형 실록산 수지 중에서 1종 이상을 포함할 수 있다. 상기 하이드로겐 폴리실록산은 직쇄상, 분지상, 또는 환상 중 하나의 형태일 수 있으며, 이들 혼합물의 형태일 수도 있다. 상기 하이드로겐 폴리실록산은 점도나 분자량이 한정되지 않으나, 전술한 오르가노 폴리실록산과의 상용성이 양호하여야 하며, 상기 하이드로겐 폴리실록산은 불소기가 포함되지 않을 수 있다. 그러나 상기 하이드로겐 폴리실록산은 전술한 오르가노 폴리실록산과 동일한 함불소알킬기 또는/및 함불소에테르기를 포함할 수도 있다.The hydrogen polysiloxane may include at least one of an addition reaction type siloxane resin, a condensation reaction type siloxane resin, and an ultraviolet curing type siloxane resin. The hydrogen polysiloxane may be in one of linear, branched, or cyclic form, and may be in the form of a mixture thereof. The hydrogen polysiloxane is not limited in viscosity or molecular weight, but compatibility with the aforementioned organo polysiloxane should be good, and the hydrogen polysiloxane may not contain a fluorine group. However, the hydrogen polysiloxane may include the same fluorine-containing alkyl group and/or fluorine-containing ether group as the aforementioned organo polysiloxane.
상기 하이드로겐 폴리실록산의 함량은 이형층 형성용 조성물 전체 중량 대비 1.0 ~ 10.0 중량%일 수 있다.The content of the hydrogen polysiloxane may be 1.0 to 10.0 wt% based on the total weight of the composition for forming a release layer.
상기 촉매는 4족~14족 원소에서 선택되는 1종 이상의 금속 또는 양쪽성 원소를 사용할 수 있고, 예를 들어 Rh, Pt, Sn, Ti,Pd, Ir, W, Co 중에서 선택된 1종 이상을 사용할 수 있다. 예를 들어, 촉매는 백금 킬레이트 촉매를 포함할 수 있다.The catalyst may use one or more metals or amphoteric elements selected from Groups 4 to 14 elements, for example, one or more selected from Rh, Pt, Sn, Ti, Pd, Ir, W, and Co. can For example, the catalyst may comprise a platinum chelate catalyst.
경우에 따라, 상기 이형층은 반응 조정제, 대전 방지제 등의 각종 기능을 부여하기 위한 첨가제가 더 포함될 수도 있다.In some cases, the release layer may further include additives for imparting various functions such as a reaction modifier and an antistatic agent.
상기 이형층의 두께는 0.03 내지 2.0 ㎛일 수 있다. 상기 이형층의 두께가 0.03 um 미만이라면, 이형층 커버리지가 좋지 않아 아크릴계 점착제 또는/및 실리콘계 점착제와의 합지시 박리되지 않을 수 있다. 상기 이형층의 두께가 2.0 um를 초과한다면, 경화시 많은 열량을 필요로 하기에 기재의 열변형을 유발할 수 있으며 박리성이 향상되지 않아 비용이 증가할 수 있다. The release layer may have a thickness of 0.03 to 2.0 μm. If the thickness of the release layer is less than 0.03 um, the release layer coverage may not be good and may not be peeled off during lamination with an acrylic pressure-sensitive adhesive or/and a silicone-based pressure-sensitive adhesive. If the thickness of the release layer exceeds 2.0 um, it may cause thermal deformation of the substrate because it requires a large amount of heat during curing, and the cost may increase because peelability is not improved.
상기 이형층을 형성하기 위한 이형층 형성용 조성물은 0.5 내지 10 중량% 고형분 함량으로 용매를 함유하여 제조된다. 상기 용매는 상기 고형분을 분산시켜 기재 상에 도포할 수 있는 것이면 제한없이 사용할 수 있으나, 예를 들어 톨루엔, 크실렌 등의 방향족 탄화수소계 용매; 헥산, 헵탄, 옥탄, 이소옥탄, 데칸, 사이클로헥산, 메틸 사이클로헥산, 이소파라핀 등의 지방족 탄화수소계 용매; 공업용 가솔린(고무휘발유 등), 석유 벤젠, 솔벤트 나프타 등의 탄화수소계 용매; 아세톤, 메틸 에틸 케톤, 2-펜타논, 3-펜타논, 2-헥산온, 2-헵타논, 4-헵타논, 메틸 이소부틸 케톤, 디이소부틸케톤, 아세토닐아세톤, 사이클로헥사논 등의 케톤계 용매; 초산에틸, 초산 프로필, 초산 이소프로필, 초산 부틸, 초산 이소부틸 등의 에스테르계 용매; 디에틸에테르, 디프로필 에테르, 디이소프로필 에테르, 디부틸에테르, 1,2-디메톡시 에탄, 1,4-디옥산 등의 에테르계 용매; 2-메톡시에틸 아세테이트, 2-에톡시에틸 아세테이트, 프로필렌글리콜 모노메틸에테르 아세테이트, 2-부톡시에틸아세테이트 등의 에스테르와 에테르 부분을 가지는 용매; 헥사메틸디실록산, 옥타메틸트리실록산, 옥타메틸 사이클로테트라실록산, 데칸메틸 사이클로펜타실록산, 트리스(트리메틸실록시) 메틸실란, 테트라키스(트리메틸실록시) 실란 등의 실록산계 용매; 트리플루오로톨루엔, 헥사플루오로 크실렌, 메틸 노나플루오로부틸 에테르, 에틸 노나플루오로부틸 에테르 등의 불소계 용매; 또는 이들의 혼합용매 등을 사용할 수 있다. 예를 들어, 상기 이형층 형성용 조성물에 사용되는 용매로 헵탄을 사용할 수 있다.The composition for forming a release layer for forming the release layer is prepared by containing a solvent with a solid content of 0.5 to 10% by weight. The solvent may be used without limitation as long as it can be applied on the substrate by dispersing the solid content, for example, aromatic hydrocarbon-based solvents such as toluene and xylene; aliphatic hydrocarbon solvents such as hexane, heptane, octane, isooctane, decane, cyclohexane, methyl cyclohexane and isoparaffin; Hydrocarbon solvents, such as industrial gasoline (rubber gasoline etc.), petroleum benzene, and solvent naphtha; Acetone, methyl ethyl ketone, 2-pentanone, 3-pentanone, 2-hexanone, 2-heptanone, 4-heptanone, methyl isobutyl ketone, diisobutyl ketone, acetonylacetone, cyclohexanone, etc. ketone solvents; ester solvents such as ethyl acetate, propyl acetate, isopropyl acetate, butyl acetate, and isobutyl acetate; ether solvents such as diethyl ether, dipropyl ether, diisopropyl ether, dibutyl ether, 1,2-dimethoxyethane, and 1,4-dioxane; solvents having ester and ether moieties such as 2-methoxyethyl acetate, 2-ethoxyethyl acetate, propylene glycol monomethyl ether acetate, and 2-butoxyethyl acetate; siloxane solvents such as hexamethyldisiloxane, octamethyltrisiloxane, octamethylcyclotetrasiloxane, decanemethylcyclopentasiloxane, tris(trimethylsiloxy)methylsilane, and tetrakis(trimethylsiloxy)silane; fluorine-based solvents such as trifluorotoluene, hexafluoroxylene, methyl nonafluorobutyl ether, and ethyl nonafluorobutyl ether; Or a mixed solvent thereof and the like may be used. For example, heptane may be used as a solvent used in the composition for forming the release layer.
상기 이형층 형성용 조성물의 고형분 함량이 0.5 중량% 미만이라면, 충분한 도포 두께가 형성되지 못하여 이형성이 발현되지 않을 수 있다. 상기 이형층 형성용 조성물의 고형분 함량이 10 중량%를 초과한다면, 상기 이형층 형성용 조성물의 점도가 높아 레벨링 불균일이 발생될 수 있어 이형층의 두께 균일도가 나빠질 수 있으며 도포 두께가 두꺼워져서 경화되지 않을 수 있다. If the solid content of the composition for forming a release layer is less than 0.5 wt %, a sufficient coating thickness may not be formed, so that the release property may not be expressed. If the solid content of the composition for forming the release layer exceeds 10% by weight, the viscosity of the composition for forming the release layer is high, so leveling unevenness may occur, and thus the thickness uniformity of the release layer may be deteriorated, and the coating thickness may be thickened and not cured it may not be
상기 이형층 형성용 조성물을 상기 기재의 일 면에 도포하는 방법으로는 바 코팅, 그라비아 코팅, 다이 코팅 등 당해 기술분야에서 사용 가능한 오프라인 도포법을 이용할 수 있다. 상기 이형층 형성용 조성물을 경화 처리하는 에너지원은 특별히 제한되지 않지만, 열처리, 자외선 조사, 또는 전자선 조사를 이용할 수 있고, 이들 단독, 혹은 조합해서 이용되지만, 열처리 단독, 열과 자외선의 병용 처리를 이용할 수 있다.As a method of applying the composition for forming the release layer to one surface of the substrate, an offline coating method available in the art such as bar coating, gravure coating, die coating, etc. may be used. The energy source for curing the composition for forming the release layer is not particularly limited, but heat treatment, ultraviolet irradiation, or electron beam irradiation may be used, and these may be used alone or in combination, but heat treatment alone or combination treatment of heat and ultraviolet light may be used. can
<이형필름><Release film>
도 1은 일 구현예에 따른 이형필름(100)의 단면 모식도이다.1 is a schematic cross-sectional view of a release film 100 according to an embodiment.
도 1을 참조하면, 일 구현예에 따른 이형필름(120)은 기재(100) 및 이형층(110)이 순차로 위치한 구조이다.Referring to FIG. 1 , a release film 120 according to an exemplary embodiment has a structure in which a substrate 100 and a release layer 110 are sequentially positioned.
일 구현예에 따른 이형필름(120)은 아크릴계 점착제 및 실리콘계 점착제 모두에 대한 박리력 및 박리력 변화율이 낮으며, 표면경도 및 환산탄성계수(reduced modulus)가 높아 필름 권취시 블로킹 현상을 방지할 수 있다. The release film 120 according to an embodiment has a low peel force and a low peel force change rate for both the acrylic adhesive and the silicone adhesive, and has high surface hardness and reduced modulus to prevent blocking during film winding. have.
상기 이형필름(120)은 아크릴계 점착제 및 실리콘계 점착제에 대한 박리력이 180 ° 박리각도, 0.3mpm 박리속도에서 0.5 gf/25mm 내지 10 gf/25mm일 수 있다.The release film 120 may have a peeling force of 0.5 gf/25mm to 10 gf/25mm at a peeling angle of 180° and a peeling rate of 0.3mpm for the acrylic adhesive and the silicone-based adhesive.
상기 이형필름(120)은 아크릴계 점착제 및 실리콘계 점착제에 대한 박리력이 180 ° 박리각도, 0.3 mpm 박리속도에서 0.5 gf/25mm 미만이라면, 이형층(110)과 실리콘계 점착제와의 부착성이 나빠져 터널링 현상 등 합지 계면이 들뜰 수 있다. 상기 이형필름(120)은 아크릴계 점착제 및 실리콘계 점착제에 대한 박리력이 180 ° 박리각도, 0.3 mpm 박리속도에서 10 gf/25mm 초과라면, 아크릴계 점착제 또는/및 실리콘계 점착제와의 박리가 제대로 되지 않아 공정상 문제가 발생할 수 있다. If the release film 120 has less than 0.5 gf/25mm at a peeling angle of 180 ° and a peeling rate of 0.3 mpm, the release film 120 has a peeling force for the acrylic pressure-sensitive adhesive and the silicone-based pressure-sensitive adhesive. The laminated interface may be lifted. If the release film 120 has more than 10 gf/25mm at a peeling angle of 180° and a peeling rate of 0.3 mpm, the peeling force for the acrylic pressure-sensitive adhesive and the silicone-based pressure-sensitive adhesive is not properly peeled from the acrylic pressure-sensitive adhesive or/and the silicone-based pressure-sensitive adhesive. Problems can arise.
상기 이형필름(120)은 아크릴계 점착제 및 실리콘계 점착제에 대한 하기 식 2에 의한 박리력 변화율이 50% 이하일 수 있다:The release film 120 may have a peel force change rate of 50% or less according to Equation 2 below for the acrylic pressure-sensitive adhesive and the silicone-based pressure-sensitive adhesive:
[식 2][Equation 2]
Figure PCTKR2021008195-appb-I000011
Figure PCTKR2021008195-appb-I000011
상기 이형필름(120)은 경시변화 없이 아크릴계 점착제 및 실리콘계 점착제에 대한 안정적인 박리력을 구현할 수 있다.The release film 120 may implement a stable peeling force for the acrylic adhesive and the silicone adhesive without changing over time.
상기 이형필름(120)의 잔류접착률은 85% 이상일 수 있다.The residual adhesion rate of the release film 120 may be 85% or more.
상기 이형필름(120)의 잔류접착률이 85% 미만이라면, 이형층(110)의 경화가 부족하여 점착되는 점착층으로 이형제가 전이되고, 점착제의 점착성이 나빠질 수 있다.If the residual adhesion rate of the release film 120 is less than 85%, the release agent may be transferred to the adhesion layer due to insufficient curing of the release layer 110, and the adhesion of the pressure-sensitive adhesive may be deteriorated.
본 명세서에서, "치환"은 치환되지 않는 모그룹(mother group)에서 하나 이상의 수소가 다른 원자나 작용기를 교환됨에 의하여 유도된다. 다르게 기재하지 않으면, 어떠한 작용기가 "치환된"것으로 여겨질 때, 그것은 상기 작용기가 탄소수 1 내지 40의 알킬기, 탄소수 2 내지 40의 알케닐기, 탄소수 2 내지 40의 알키닐기, 탄소수 3 내지 40의 시클로알킬기, 탄소수 3 내지 40의 시클로알케닐기, 탄소수 7 내지 40의 아릴기에서 선택된 하나 이상의 치환기로 치환됨을 의미한다. 작용기가 "선택적으로 치환된다"고 기재되는 경우에, 상기 작용기가 상술한 치환기로 치환될 수 있다는 것을 의미한다.As used herein, "substitution" is derived by exchanging one or more hydrogens with another atom or functional group in an unsubstituted mother group. Unless otherwise stated, when a functional group is considered to be “substituted,” it means that the functional group is an alkyl group having 1 to 40 carbon atoms, an alkenyl group having 2 to 40 carbon atoms, an alkynyl group having 2 to 40 carbon atoms, or a cyclo group having 3 to 40 carbon atoms. It means substituted with one or more substituents selected from an alkyl group, a cycloalkenyl group having 3 to 40 carbon atoms, and an aryl group having 7 to 40 carbon atoms. When a functional group is described as being “optionally substituted”, it is meant that the functional group may be substituted with the aforementioned substituents.
본 명세서에서, C1~C10의 1가 탄화수소기로는 예를 들어, 메틸기, 에틸기, 헥실기, 옥틸기, 데실기 등의 직쇄상 알킬기; 이소프로필기, tert-부틸기, 네오펜틸기, 헥실기 등의 분지상 알킬기; 시클로펜틸기, 시클로헥실기 등의 환상 알킬기, 비닐기, 헤닐기, 톨릴기 등의 아릴기, 벤질기, 페네틸기 등의 아릴알킬기; 등을 의미한다. 이 중에서, 원료의 조달 용이성을 고려하여 알킬기일 수 있고, 생성물의 유용성을 고려하여 메틸기 또는 에틸기일 수 있다.In the present specification, the C1-C10 monovalent hydrocarbon group includes, for example, a linear alkyl group such as a methyl group, an ethyl group, a hexyl group, an octyl group, and a decyl group; branched alkyl groups such as isopropyl group, tert-butyl group, neopentyl group and hexyl group; Cyclic alkyl groups, such as a cyclopentyl group and a cyclohexyl group, Aryl groups, such as a vinyl group, a henyl group, and a tolyl group, Arylalkyl groups, such as a benzyl group and a phenethyl group; means etc. Among them, it may be an alkyl group in consideration of the ease of procurement of raw materials, and may be a methyl group or an ethyl group in consideration of the usefulness of the product.
본 명세서에서, C2~C10의 알케닐기는 적어도 하나의 탄소-탄소 이중결합을 갖는 분지형 또는 비분지형 탄화수소를 의미한다. 알케닐기의 비제한적인 예로는 비닐, 알릴, 부테닐, 이소프로페닐, 또는 이소부테닐 등을 들 수 있다.In the present specification, the C2-C10 alkenyl group refers to a branched or unbranched hydrocarbon having at least one carbon-carbon double bond. Non-limiting examples of alkenyl groups include vinyl, allyl, butenyl, isopropenyl, or isobutenyl.
이하, 실시예와 비교예를 통하여 본 발명의 구성 및 그에 따른 효과를 보다 상세히 설명하고자 한다. 그러나, 본 실시예는 본 발명을 보다 구체적으로 설명하기 위한 것이며, 본 발명의 범위가 이들 실시예에 한정되지 않는다는 것은 자명한 사실일 것이다.Hereinafter, the configuration of the present invention and its effects will be described in more detail through Examples and Comparative Examples. However, it will be apparent that these examples are for illustrating the present invention in more detail, and the scope of the present invention is not limited to these examples.
[실시예] [Example]
실시예 1: 이형필름Example 1: Release film
50 ㎛ 두께의 폴리에스테르필름(도레이 첨단소재, XD500P)을 준비하였다.A 50 μm thick polyester film (Toray Advanced Materials, XD500P) was prepared.
이와 별개로, 함불소 오르가노 폴리실록산으로서 하기 화학식 2로 표시되는 불소알킬기를 포함한 하기 화학식 1로 표시되는 오르가노 폴리실록산 (다우케미칼 제조, Q2-7785) 100 중량부, 비닐기와 메틸기를 포함하는 비함불소 오르가노 폴리실록산 (신에츠 제조, KS847H) 100 중량부, 하이드로겐 폴리실록산 (다우케미칼 제조, Q2-7560) 3 중량부, 및 백금 킬레이트 촉매 (다우케미칼 제조, SYL-OFF 4000) 0.1 중량부를 헵탄 용매에 희석하여 전체 고형분 함량이 5 중량%인 이형층 형성용 조성물을 준비하였다.Separately, as the fluorinated organopolysiloxane, 100 parts by weight of an organopolysiloxane represented by the following Chemical Formula 1 including a fluorinated alkyl group represented by the following Chemical Formula 2 (Dow Chemical, Q2-7785), a fluorine-free containing a vinyl group and a methyl group 100 parts by weight of organopolysiloxane (Shin-Etsu, KS847H), 3 parts by weight of hydrogen polysiloxane (Q2-7560, Dow Chemical), and 0.1 parts by weight of a platinum chelate catalyst (manufactured by Dow Chemical, SYL-OFF 4000) are diluted in heptane solvent Thus, a composition for forming a release layer having a total solid content of 5% by weight was prepared.
상기 폴리에스테르필름의 일 면에 상기 이형층 형성용 조성물을 도포하고 150 ℃의 열풍 건조기에서 60 초간 열처리하여 0.3 ㎛ 두께의 이형층을 형성하여 이형필름을 제조하였다.A release film was prepared by coating the composition for forming a release layer on one surface of the polyester film and heat-treating it for 60 seconds in a hot air dryer at 150° C. to form a release layer with a thickness of 0.3 μm.
[화학식 1][Formula 1]
Figure PCTKR2021008195-appb-I000012
Figure PCTKR2021008195-appb-I000012
[화학식 2][Formula 2]
Figure PCTKR2021008195-appb-I000013
Figure PCTKR2021008195-appb-I000013
상기 화학식 1에서,In Formula 1,
R1은 비닐기이고, R2, R3는 각각 메틸기이고, R4는 상기 화학식 2로 표시되는 불소알킬기이며,R 1 is a vinyl group, R 2 , R 3 are each a methyl group, R 4 is a fluoroalkyl group represented by Formula 2,
n은 4이고, m은 2이고, *은 이웃한 원자와의 결합 사이트이다.n is 4, m is 2, and * is a bonding site with a neighboring atom.
실시예 2: 이형필름Example 2: Release film
함불소 오르가노 폴리실록산으로서 상기 화학식 2로 표시되는 불소알킬기를 포함한 상기 화학식 1로 표시되는 오르가노 폴리실록산 (다우케미칼 제조, Q2-7785) 50 중량부를 사용한 것을 제외하고는, 실시예 1과 동일한 방법으로 이형필름을 제조하였다.In the same manner as in Example 1, except that 50 parts by weight of the organopolysiloxane represented by Formula 1 (Dow Chemical, Q2-7785) including the fluorinated alkyl group represented by Formula 2 was used as the fluorinated organopolysiloxane. A release film was prepared.
실시예 3: 이형필름Example 3: Release film
함불소 오르가노 폴리실록산으로서 상기 화학식 2로 표시되는 불소알킬기를 포함한 상기 화학식 1로 표시되는 오르가노 폴리실록산 (다우케미칼 제조, Q2-7785) 50 중량부 및 하기 화학식 6으로 표시되는 불소에테르기를 포함한 하기 화학식 5로 표시되는 오르가노 폴리실록산(신에츠 실리콘, X-70-201S)을 50 중량부를 사용한 것을 제외하고는, 실시예 1과 동일한 방법으로 이형필름을 제조하였다:As the fluorinated organopolysiloxane, 50 parts by weight of the organopolysiloxane represented by Formula 1 (Dow Chemical, Q2-7785) including a fluorinealkyl group represented by Formula 2 and a fluorine ether group represented by Formula 6 below A release film was prepared in the same manner as in Example 1, except that 50 parts by weight of the organopolysiloxane represented by 5 (Shin-Etsu Silicone, X-70-201S) was used:
[화학식 5][Formula 5]
Figure PCTKR2021008195-appb-I000014
Figure PCTKR2021008195-appb-I000014
[화학식 6][Formula 6]
Figure PCTKR2021008195-appb-I000015
Figure PCTKR2021008195-appb-I000015
상기 화학식 5에서,In Formula 5,
R'1은 비닐기이고, R'2는 상기 화학식 6으로 표시되는 불소에테르기이며;R′ 1 is a vinyl group, R′ 2 is a fluorine ether group represented by Formula 6;
n'는 2이고, m'는 4이고, x'는 1이다.n' is 2, m' is 4, and x' is 1.
실시예 4: 이형필름Example 4: Release film
상기 화학식 4로 표시되는 비함불소 오르가노 폴리실록산 (신에츠 제조, KS847H) 100 중량부 대신 상기 화학식 4로 표시되는 비함불소 오르가노 폴리실록산 (신에츠 제조, KS847H) 50 중량부 및 헥세닐기를 포함하는 비함불소 오르가노 폴리실록산 (다우케미칼 제조, LTC750A) 50 중량부를 사용한 것을 제외하고는, 실시예 1과 동일한 방법으로 이형필름을 제조하였다.Instead of 100 parts by weight of the fluorinated organopolysiloxane represented by Chemical Formula 4 (Shin-Etsu, KS847H), 50 parts by weight of the fluorinated organopolysiloxane represented by Chemical Formula 4 (Shin-Etsu, KS847H) and a fluorine-free organ containing a hexenyl group A release film was prepared in the same manner as in Example 1, except that 50 parts by weight of gano polysiloxane (manufactured by Dow Chemical, LTC750A) was used.
실시예 5: 이형필름Example 5: Release film
상기 폴리에스테르필름의 일 면에 상기 이형층 형성용 조성물을 도포하고 150 ℃의 열풍 건조기에서 60 초간 열처리하여 1 ㎛ 두께의 이형층을 형성하여 이형필름을 제조한 것을 제외하고는, 실시예 1과 동일한 방법으로 이형필름을 제조하였다.Except that the release film was prepared by coating the composition for forming a release layer on one side of the polyester film and heat-treating it for 60 seconds in a hot air dryer at 150° C. to form a release layer with a thickness of 1 μm. A release film was prepared in the same manner.
실시예 6: 이형필름Example 6: Release film
입경이 2 ㎛인 실리카 입자를 전체 고형분을 기준으로 하여 1 중량% 추가 배합하여 이형층 형성용 조성물을 준비한 것을 제외하고는, 실시예 1과 동일한 방법으로 이형필름을 제조하였다.A release film was prepared in the same manner as in Example 1, except that a composition for forming a release layer was prepared by adding 1 wt% of silica particles having a particle diameter of 2 μm based on the total solid content.
비교예 1: 이형필름Comparative Example 1: Release film
함불소 오르가노 폴리실록산으로서 상기 화학식 2로 표시되는 불소알킬기를 포함한 상기 화학식 1로 표시되는 오르가노 폴리실록산 (다우케미칼 제조, Q2-7785) 5 중량부를 사용한 것을 제외하고는, 실시예 1과 동일한 방법으로 이형필름을 제조하였다.In the same manner as in Example 1, except that 5 parts by weight of the organopolysiloxane (Dow Chemical, Q2-7785) represented by Formula 1 including the fluorinated alkyl group represented by Formula 2 was used as the fluorinated organopolysiloxane. A release film was prepared.
비교예 2: 이형필름Comparative Example 2: Release film
함불소 오르가노 폴리실록산으로서 상기 화학식 2로 표시되는 불소알킬기를 포함한 상기 화학식 1로 표시되는 오르가노 폴리실록산 (다우케미칼 제조, Q2-7785) 500 중량부를 사용한 것을 제외하고는, 실시예 1과 동일한 방법으로 이형필름을 제조하였다.In the same manner as in Example 1, except that 500 parts by weight of the organopolysiloxane represented by Formula 1 (Q2-7785, manufactured by Dow Chemical) including a fluorinated alkyl group represented by Formula 2 was used as the fluorinated organopolysiloxane. A release film was prepared.
비교예 3: 이형필름Comparative Example 3: Release film
상기 폴리에스테르필름의 일 면에 상기 이형층 형성용 조성물을 도포하고 150 ℃의 열풍 건조기에서 60 초간 열처리하여 2.5 ㎛ 두께의 이형층을 형성하여 이형필름을 제조한 것을 제외하고는, 실시예 1과 동일한 방법으로 이형필름을 제조하였다.Except that the release film was prepared by coating the composition for forming a release layer on one side of the polyester film and heat-treating it in a hot air dryer at 150° C. for 60 seconds to form a release layer having a thickness of 2.5 μm, and A release film was prepared in the same manner.
비교예 4: 이형필름Comparative Example 4: Release film
상기 폴리에스테르필름의 일 면에 상기 이형층 형성용 조성물을 도포하고 150 ℃의 열풍 건조기에서 60 초간 열처리하여 0.01 ㎛ 두께의 이형층을 형성하여 이형필름을 제조한 것을 제외하고는, 실시예 1과 동일한 방법으로 이형필름을 제조하였다.Except that the release film was prepared by coating the composition for forming a release layer on one side of the polyester film and heat-treating it for 60 seconds in a hot air dryer at 150° C. to form a release layer having a thickness of 0.01 μm. A release film was prepared in the same manner.
비교예 5: 이형필름Comparative Example 5: Release film
함불소 오르가노 폴리실록산을 사용하지 않은 것을 제외하고는, 실시예 1과 동일한 방법으로 이형필름을 제조하였다.A release film was prepared in the same manner as in Example 1, except that fluorinated organopolysiloxane was not used.
비교예 6: 이형필름Comparative Example 6: Release film
상기 화학식 4로 표시되는 비함불소 오르가노 폴리실록산 (신에츠 제조, KS847H)을 사용하지 않은 것을 제외하고는, 실시예 1과 동일한 방법으로 이형필름을 제조하였다. A release film was prepared in the same manner as in Example 1, except that the fluorinated organopolysiloxane represented by Chemical Formula 4 (Shin-Etsu, KS847H) was not used.
평가예 1: 물성 평가Evaluation Example 1: Physical property evaluation
실시예 1~6 및 비교예 1~6에 의해 제조된 이형필름의 물성을 다음과 같은 방법으로 평가하여, 그 결과를 표 1에 나타내었다.The physical properties of the release films prepared in Examples 1 to 6 and Comparative Examples 1 to 6 were evaluated in the following manner, and the results are shown in Table 1.
(1) 이형층 표면에 대한 XPS 분석(1) XPS analysis on the surface of the release layer
각각의 이형필름의 이형층 표면에 대하여 XPS 분석기기로 실리콘(Si), 불소(F), 탄소(C), 및 산소(O) 원자조성을 분석하여 atomic%로 표시하였다. XPS 분석기기는 ThermoFisher사 K-ALPHA를 사용하였고, 분석영역(spot size)으로는 400 ㎛로 하였다. 또한 분석한 불소원자 및 실리콘 원자를 이용하여 불소원자/실리콘 원자의 함량(atomic%)비를 계산하였다. The atomic composition of silicon (Si), fluorine (F), carbon (C), and oxygen (O) was analyzed with an XPS analyzer for the surface of the release layer of each release film and expressed in atomic%. As the XPS analyzer, K-ALPHA from ThermoFisher was used, and the spot size was set to 400 μm. In addition, the content (atomic%) ratio of fluorine atoms/silicon atoms was calculated using the analyzed fluorine atoms and silicon atoms.
(2) 이형필름의 박리력(gf/25mm) 및 박리력 변화율(%) (2) Peel force of the release film (gf/25mm) and rate of change in peel force (%)
각각의 이형필름을 500 mm x 1500 mm 크기로 잘라 샘플을 제조하였다. 상기 샘플들을 25 ℃, 65% RH 에서 24 시간 보존(초기 박리력 샘플) 및 7 일간 보존하였다(7일 후 박리력 샘플). 이후, 상기 샘플들의 이형층에 실리콘계 점착테이프(SYMBIO, MY2G) 및 아크릴계 점착테이프(TESA, TESA7475)를 각각 50 ℃, 20 g/cm2의 하중으로 24 시간 압착한 후, cheminstrument AR-1000 기기를 이용하여 180°, 0.3 mpm 속도로 250㎜ x 1500 mm 크기의 박리력을 측정하였다. 이 때, 박리력은 5회 측정한 후 평균값을 산출하여 초기 박리력 및 7일 후 박리력을 얻었고, 박리력 변화율은 하기 식 2에 대입하여 구하였다:Each release film was cut into a size of 500 mm x 1500 mm to prepare a sample. The samples were stored at 25° C., 65% RH for 24 hours (initial peel force sample) and 7 days (7 days later peel force sample). After that, the silicone-based adhesive tape (SYMBIO, MY2G) and the acrylic adhesive tape (TESA, TESA7475) were respectively pressed at 50 °C and 20 g/cm 2 under a load of 20 g/cm 2 for 24 hours on the release layer of the samples, and then the cheminstrument AR-1000 device was applied. The peel force of 250 mm x 1500 mm size was measured using 180 °, 0.3 mpm speed. At this time, the peel force was measured 5 times and then the average value was calculated to obtain the initial peel force and the peel force after 7 days, and the rate of change of the peel force was obtained by substituting the formula 2 below:
[식 2][Equation 2]
Figure PCTKR2021008195-appb-I000016
Figure PCTKR2021008195-appb-I000016
(3) 이형필름의 잔류접착률(%) (3) Residual adhesion rate of release film (%)
각각의 이형필름을 500 mm x 1500 mm 크기로 잘라 샘플을 제조하였다. 상기 샘플들을 25 ℃, 65% RH 에서 24시간 보존하였다. 상기 샘플들의 이형층에 점착테이프(Nitto, 31B)를 상온, 20 g/cm2의 하중으로 24 시간 압착한 후, 이형층에 접착하였던 점착테이프를 오염없이 수거하였다. 상기 점착테이프를 표면이 평탄하고 깨끗한 폴리에틸렌테레프탈레이트 필름 면에 접착시켰다. 상기 폴리에틸렌테레프탈레이트 필름 면에 접착된 점착테이프를 2 kg 테이프롤러(ASTMD-1000-55T)로 1회 왕복 압착시켰다. 그리고나서, 상기 폴리에틸렌테레프탈레이트 필름 면에 압착된 점착테이프 샘플에 대하여 cheminstrument AR-1000 기기를 이용하여 180°, 0.3 mpm 속도로 250㎜ x 1500 mm 크기의 박리력을 측정하고, 하기 식 3에 대입하여 잔류접착률을 얻었다. Each release film was cut into a size of 500 mm x 1500 mm to prepare a sample. The samples were stored at 25° C., 65% RH for 24 hours. After pressing the adhesive tape (Nitto, 31B) on the release layer of the samples at room temperature and under a load of 20 g/cm 2 for 24 hours, the adhesive tape adhered to the release layer was collected without contamination. The adhesive tape was adhered to the surface of the polyethylene terephthalate film having a flat and clean surface. The adhesive tape adhered to the surface of the polyethylene terephthalate film was reciprocally compressed once with a 2 kg tape roller (ASTMD-1000-55T). Then, with respect to the adhesive tape sample pressed onto the polyethylene terephthalate film surface, the peel force of the size of 250 mm x 1500 mm was measured at 180 ° and 0.3 mpm speed using a cheminstrument AR-1000 device, and substituted into Equation 3 below. Thus, a residual adhesion rate was obtained.
[식 3][Equation 3]
Figure PCTKR2021008195-appb-I000017
Figure PCTKR2021008195-appb-I000017
(4) 이형층의 환산탄성계수(GPa) 및 표면경도(GPa) (4) Converted modulus of elasticity (GPa) and surface hardness (GPa) of the release layer
각각의 이형필름의 이형층에 대하여 나노인덴터 분석기기(Hysitron, TI950 Triboindenter)를 이용하여 환산탄성계수(reduced modulus) 및 표면경도를 측정하였다.The reduced modulus and surface hardness were measured for the release layer of each release film using a nanoindenter analyzer (Hysitron, TI950 Triboindenter).
아크릴계 점착제에 대한 초기 박리력
(gf/
25mm)
Initial Peeling Force for Acrylic Adhesives
(gf/
25mm)
아크릴계 점착제에 대한 7일 후의 박리력
(gf/25mm)
Peel force after 7 days for acrylic adhesive
(gf/25mm)
아크릴계 점착제에 대한 박리력 변화율(%)Peel force change rate for acrylic adhesive (%) 실리콘계 점착제에 대한 박리력
(gf/
25mm)
Peeling force for silicone adhesive
(gf/
25mm)
잔류접착률
(%)
Residual Adhesion
(%)
불소
함량
(atomic%)
fluoride
content
(atomic%)
실리콘함량
(atomic%)
Silicon content
(atomic%)
불소/
실리콘 함량비
Fluorine/
Silicon content ratio
환산탄성계수
(GPa)
conversion modulus of elasticity
(GPa)
표면경도
(GPa)
surface hardness
(GPa)
실시예1Example 1 4.54.5 5.65.6 24.424.4 5.65.6 8686 3535 1313 2.72.7 3.73.7 0.380.38
실시예2Example 2 4.64.6 6.26.2 34.734.7 7.17.1 8686 3434 1414 2.42.4 3.33.3 0.320.32
실시예3Example 3 4.54.5 5.45.4 2020 4.64.6 8585 3939 99 4.34.3 4.14.1 0.370.37
실시예4Example 4 4.54.5 6.16.1 35.535.5 6.86.8 9292 3434 1212 2.82.8 3.43.4 0.340.34
실시예5Example 5 4.24.2 5.45.4 28.628.6 6.16.1 8585 3434 1414 2.72.7 3.43.4 0.320.32
실시예6Example 6 4.54.5 5.55.5 22.222.2 7.27.2 8787 3333 1515 2.22.2 3.53.5 0.370.37
비교예1Comparative Example 1 7.87.8 12.412.4 58.958.9 xx 9090 2424 1919 1.21.2 2.22.2 0.260.26
비교예2Comparative Example 2 6.16.1 13.713.7 124.5124.5 8.98.9 8080 3434 1717 2.02.0 3.83.8 0.340.34
비교예3Comparative Example 3 5.55.5 13.513.5 145.4145.4 9.39.3 7979 3232 1414 2.32.3 3.43.4 0.300.30
비교예4Comparative Example 4 3838 73.873.8 94.294.2 29.829.8 9191 3333 1212 2.72.7 -- --
비교예5Comparative Example 5 4.74.7 12.512.5 165.9165.9 xx 7878 -- 4343 -- 1.91.9 0.120.12
비교예6Comparative Example 6 1212 13.213.2 1010 7.87.8 8686 3030 1515 2.02.0 4.64.6 0.420.42
표 1을 참조하면, 실시예 1~6에 의해 제조된 이형필름은 실리콘계 점착제에 대한 박리력, 및 아크릴계 점착제에 대한 박리력과 박리력 변화율이 낮아 안정적인 박리력을 가짐을 확인할 수 있다.Referring to Table 1, it can be seen that the release films prepared in Examples 1 to 6 have stable peeling force due to low peeling force with respect to the silicone-based adhesive, and the peeling force and peeling force change rate for the acrylic adhesive.
비교예 1(함불소 오르가노 폴리실록산 함량이 적은 경우) 및 비교예 5(비함불소 오르가노 폴리실록산만을 단독 사용한 경우)에 의해 제조된 이형필름은 실리콘계 점착제에 상기 이형필름이 완전히 합지되어 박리가 되지 않았으며, 이형층의 환산탄성계수 및 표면 경도가 낮아 박리력 변화율이 50% 이상으로 큰 것을 확인할 수 있다. 비교예 2(함불소 오르가노 폴리실록산 함량이 많은 경우) 및 비교예 3(이형층 두께가 두꺼운 경우)에 의해 제조된 이형필름은 경화가 잘 되지 않았기 때문에 잔류접착률이 감소되었고 박리력 변화율도 높은 것을 확인할 수 있다. 비교예 6(함불소 오르가노 폴리실록산만을 단독 사용한 경우)에 의해 제조된 이형필름은 실리콘계 점착제에 대한 박리력은 10 gf/25mm 이하로 경박리 특성을 나타내었지만 아크릴계 점착제에 대한 박리력은 10 gf/25mm 이상으로 측정되었다. 비교예 4(이형층 두께가 얇은 경우)에 의해 제조된 이형필름은 이형층의 커버리지가 좋지 않아 실리콘계 점착제 및 아크릴계 점착제와의 합지시 박리력이 높게 측정되었다. 이로부터, 본 발명의 이형필름의 이형층은 적절한 환산탄성계수와 표면 경도를 가지기에 상기 이형필름은 아크릴계 점착제 및 실리콘계 점착에 대해 모두 경박리 특성을 나타냄을 알 수 있다. 또한 본 발명의 이형필름은 실리콘계 이형필름과 비교하여 높은 표면 경도를 가짐으로써 아크릴계 점착제에 대한 박리력 변화율이 낮으며, 상기 이형필름 권취시 블로킹이 개선됨을 알 수 있다The release film prepared by Comparative Example 1 (when the fluorinated organopolysiloxane content is low) and Comparative Example 5 (when only the non-fluorinated organopolysiloxane is used alone) The release film was completely laminated to the silicone pressure-sensitive adhesive, so that it was not peeled off It can be seen that the conversion modulus of elasticity and the surface hardness of the release layer are low, so that the peel force change rate is as large as 50% or more. The release films prepared by Comparative Example 2 (when the content of fluorinated organopolysiloxane is high) and Comparative Example 3 (when the thickness of the release layer is thick) did not cure well, so the residual adhesion rate was reduced and the peel force change rate was also high that can be checked The release film prepared by Comparative Example 6 (when only fluorinated organopolysiloxane was used alone) showed light peeling properties with a peeling force of 10 gf/25mm or less with respect to the silicone adhesive, but the peeling force with respect to the acrylic adhesive was 10 gf/ Measured over 25mm. The release film prepared by Comparative Example 4 (when the thickness of the release layer was thin) had poor coverage of the release layer, so that the peeling force was high when laminating with the silicone pressure-sensitive adhesive and the acrylic pressure-sensitive adhesive. From this, it can be seen that since the release layer of the release film of the present invention has an appropriate converted modulus and surface hardness, the release film exhibits light peeling properties for both the acrylic pressure-sensitive adhesive and the silicone-based pressure-sensitive adhesive. In addition, it can be seen that the release film of the present invention has a high surface hardness compared to the silicone-based release film, so that the peel force change rate for the acrylic pressure-sensitive adhesive is low, and blocking is improved when the release film is wound.

Claims (11)

  1. 기재; 및 상기 기재의 적어도 일 면에 위치하는 이형층;을 포함하고,write; and a release layer located on at least one surface of the substrate;
    상기 이형층은 함불소 오르가노 폴리실록산 및 비함불소 오르가노 폴리실록산의 블렌드를 포함하는 이형층 형성용 조성물의 경화층이며,The release layer is a cured layer of a composition for forming a release layer comprising a blend of a fluorinated organopolysiloxane and a fluorinated organopolysiloxane,
    상기 이형층은 표면에서 중심방향으로 불소원자/실리콘 원자 함량비가 감소하며,The release layer decreases the fluorine atom/silicon atom content ratio from the surface to the center,
    상기 이형층은 나노인덴테이션법에 의해 측정한 환산탄성계수(reduced modulus)가 2 내지 6 GPa이며,The release layer has a reduced modulus measured by the nanoindentation method of 2 to 6 GPa,
    상기 이형층은 나노인덴테이션법에 의해 측정한 표면 경도(surface hardness)가 0.3 내지 0.6 GPa인, 이형필름.The release layer has a surface hardness measured by the nanoindentation method of 0.3 to 0.6 GPa, the release film.
  2. 제1항에 있어서,The method of claim 1,
    상기 이형층 표면에 대해 XPS 분석에 의한 불소원자/실리콘 원자의 함량(atomic%)비가 1.5 내지 4.5인, 이형필름.The content (atomic%) ratio of fluorine atoms / silicon atoms by XPS analysis on the surface of the release layer is 1.5 to 4.5, the release film.
  3. 제1항에 있어서,According to claim 1,
    상기 이형층의 표면에너지가 10 dyne/cm 내지 16 dyne/cm인, 이형필름.The surface energy of the release layer is 10 dyne / cm to 16 dyne / cm, the release film.
  4. 제1항에 있어서,According to claim 1,
    상기 이형필름은 아크릴계 점착제 및 실리콘계 점착제에 대한 박리력이 180 ° 박리각도, 0.3 mpm 박리속도에서 0.5 gf/25mm 내지 10 gf/25mm인, 이형필름.The release film is a release film of 0.5 gf/25mm to 10 gf/25mm at a peeling angle of 180 ° and a peeling rate of 0.3 mpm, the peeling force for the acrylic pressure-sensitive adhesive and the silicone-based pressure-sensitive adhesive.
  5. 제1항에 있어서,The method of claim 1,
    상기 이형필름은 아크릴계 점착제 및 실리콘계 점착제에 대한 하기 식 2에 의한 박리력 변화율이 50% 이하인, 이형필름:The release film is a release film having a peel force change rate of 50% or less according to the following formula 2 for an acrylic pressure-sensitive adhesive and a silicone-based pressure-sensitive adhesive:
    [식 2][Equation 2]
    Figure PCTKR2021008195-appb-I000018
    Figure PCTKR2021008195-appb-I000018
  6. 제1항에 있어서,The method of claim 1,
    상기 이형필름의 잔류접착률이 85% 이상인, 이형필름.A release film having a residual adhesion rate of 85% or more of the release film.
  7. 제1항에 있어서,According to claim 1,
    상기 이형층의 두께가 0.03 ㎛ 내지 2.0 ㎛인, 이형필름.The release layer has a thickness of 0.03 μm to 2.0 μm, a release film.
  8. 제1항에 있어서,The method of claim 1,
    상기 함불소 폴리실록산이 하기 화학식 1로 표시되는 오르가노 폴리실록산을 포함하는, 이형필름:A release film, wherein the fluorinated polysiloxane comprises an organo polysiloxane represented by the following formula (1):
    [화학식 1][Formula 1]
    Figure PCTKR2021008195-appb-I000019
    Figure PCTKR2021008195-appb-I000019
    [화학식 2][Formula 2]
    Figure PCTKR2021008195-appb-I000020
    Figure PCTKR2021008195-appb-I000020
    [화학식 3][Formula 3]
    Figure PCTKR2021008195-appb-I000021
    Figure PCTKR2021008195-appb-I000021
    상기 화학식 1에서,In Formula 1,
    R1은 치환 또는 비치환된 C1~C10의 1가 탄화수소기, 또는 치환 또는 비치환된 C2~C10의 알케닐기이고;R 1 is a substituted or unsubstituted C1-C10 monovalent hydrocarbon group, or a substituted or unsubstituted C2-C10 alkenyl group;
    R2는 치환 또는 비치환된 C1~C10의 1가 탄화수소기, 치환 또는 비치환된 C2~C10의 알케닐기, 또는 수소이고;R 2 is a substituted or unsubstituted C1-C10 monovalent hydrocarbon group, a substituted or unsubstituted C2-C10 alkenyl group, or hydrogen;
    R3 및 R4는 서로 독립적으로 상기 화학식 2로 표시되는 함불소알킬기, 상기 화학식 3으로 표시되는 함불소에테르기, 치환 또는 비치환된 C1~C10의 1가 탄화수소기, 치환 또는 비치환된 C2~C10의 알케닐기, 또는 수소이되,R 3 and R 4 are each independently a fluorinated alkyl group represented by Formula 2, a fluorinated ether group represented by Formula 3, A substituted or unsubstituted C1~ C10 monovalent hydrocarbon group, a substituted or unsubstituted C2~ C10 alkenyl group, or hydrogen,
    상기 R3 및 R4 중 적어도 하나는 상기 화학식 2로 표시되는 함불소알킬기, 상기 화학식 3으로 표시되는 함불소에테르기, 또는 이들 조합이고;at least one of R 3 and R 4 is a fluorinated alkyl group represented by Formula 2, a fluorinated ether group represented by Formula 3, or a combination thereof;
    n은 1~8의 정수이고, m은 1~5의 정수이고;n is an integer from 1 to 8, m is an integer from 1 to 5;
    p는 1~5의 정수이고, q는 0 또는 1이고, r은 0, 1 또는 2이고, v는 1~5의 정수이고;p is an integer from 1 to 5, q is 0 or 1, r is 0, 1 or 2, v is an integer from 1 to 5;
    A는 산소원자 또는 단결합이고;A is an oxygen atom or a single bond;
    x, y, z는 각각 1 이상의 정수이고;x, y, and z are each an integer of 1 or more;
    *은 이웃한 원자와의 결합 사이트이고;* is a binding site with a neighboring atom;
    단, R1, R2 중 적어도 하나는 치환 또는 비치환된 C2~C10의 알케닐기이다.However, at least one of R 1 and R 2 is a substituted or unsubstituted C2~C10 alkenyl group.
  9. 제1항에 있어서,According to claim 1,
    상기 함불소 오르가노 폴리실록산의 함량이 비함불소 오르가노 폴리실록산 100 중량부를 기준으로 하여 10 중량부 내지 300 중량부인, 이형필름.The content of the fluorinated organopolysiloxane is 10 parts by weight to 300 parts by weight based on 100 parts by weight of the non-fluorinated organopolysiloxane, the release film.
  10. 제1항에 있어서,According to claim 1,
    상기 이형층은 유무기입자를 더 포함하는, 이형필름.The release layer further comprises organic and inorganic particles, a release film.
  11. 제1항에 있어서,According to claim 1,
    상기 이형층은 하이드로겐 폴리실록산(hydrogen polysiloxane) 및 촉매 중 1종 이상을 더 포함하는, 이형필름.The release layer further comprises at least one of a hydrogen polysiloxane and a catalyst.
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KR20200090792A (en) * 2017-12-11 2020-07-29 미쯔비시 케미컬 주식회사 Laminated film, release film and laminate
WO2020121687A1 (en) * 2018-12-11 2020-06-18 三菱ケミカル株式会社 Release film
KR102054615B1 (en) * 2019-04-11 2019-12-10 도레이첨단소재 주식회사 Release film comprising fluorine group

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