WO2022083040A1 - Optical module - Google Patents

Optical module Download PDF

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Publication number
WO2022083040A1
WO2022083040A1 PCT/CN2021/077502 CN2021077502W WO2022083040A1 WO 2022083040 A1 WO2022083040 A1 WO 2022083040A1 CN 2021077502 W CN2021077502 W CN 2021077502W WO 2022083040 A1 WO2022083040 A1 WO 2022083040A1
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WO
WIPO (PCT)
Prior art keywords
optical fiber
array
circuit board
lens assembly
light
Prior art date
Application number
PCT/CN2021/077502
Other languages
French (fr)
Chinese (zh)
Inventor
刘旭霞
王旭东
付深圳
杨思更
林晓彤
李雪健
何鹏
刘璐
董玉婷
Original Assignee
青岛海信宽带多媒体技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202011120975.XA external-priority patent/CN114384645A/en
Priority claimed from CN202011120978.3A external-priority patent/CN114384646A/en
Priority claimed from CN202011120982.XA external-priority patent/CN114384647A/en
Application filed by 青岛海信宽带多媒体技术有限公司 filed Critical 青岛海信宽带多媒体技术有限公司
Publication of WO2022083040A1 publication Critical patent/WO2022083040A1/en

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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements

Definitions

  • the present disclosure relates to the technical field of optical communication, and in particular, to an optical module.
  • One of the core links of optical fiber communication is the mutual conversion of optical and electrical signals.
  • Optical fiber communication uses information-carrying optical signals to transmit in information transmission equipment such as optical fibers/optical waveguides.
  • the passive transmission characteristics of light in optical fibers/optical waveguides can realize low-cost, low-loss information transmission; while computers and other information processing equipment Electrical signals are used.
  • the optical module is an important component of the modern optical communication network. It provides a Gbit high-speed data physical channel for the communication network, and the optical transmitting device and the optical receiving device are the core components of the optical module. With the rapid construction and upgrade of the current data center network, data centers have put forward demands on optical modules such as multi-wavelength channels, high speed, small size, and low cost.
  • an embodiment of the present application discloses an optical module device, comprising: a circuit board; a light emitting chip array, disposed on the circuit board, for emitting signal light of different wavelengths; a first collimating lens array, The first lens assembly is arranged on the light-emitting direction of the light emitting chip, and is used for condensing the signal light; the first lens assembly is covered above the collimating lens array, and forms a first accommodating cavity with the circuit board; wherein: the The top of the lens assembly is provided with a first reflection surface and a second converging reflection surface; the first reflection surface is an inclined surface; a third reflection surface is arranged on the inner upper wall of the first accommodating cavity, and the third reflection surface is a coating film the first reflective surface; the coating layer includes a plurality of filter film layers; the signal light enters the first lens component through different filter film layers, and passes through the first reflective surface and the reflection and beam combination of the third reflecting surface; the second converging reflecting surface is arranged on one side of the first
  • an embodiment of the present application further provides an optical module, including: a circuit board; a second lens assembly, covered above the circuit board, and forming a second accommodating cavity with the circuit board; wherein: the The top of the lens assembly is provided with a fourth reflection surface and a fifth converging reflection surface; the fourth reflection surface is an inclined surface; a sixth reflection surface is arranged on the inner upper wall of the second accommodation cavity, and the sixth reflection surface is connected to the The fourth reflecting surface is arranged in parallel; the sixth reflecting surface includes a plurality of filter film layers; the fifth converging reflecting surface is used for converging and reflecting the signal light and transmitting it to the sixth reflecting surface; The six reflective surfaces cooperate with the fourth reflective surface for beam splitting and reflection; a light-receiving chip array is arranged on the circuit board for receiving signal light of different wavelengths; a second collimating lens array is arranged on the light The light incident direction of the receiving chip is used for condensing the signal light; the second lens assembly is provided with a second optical fiber array
  • an embodiment of the present application discloses an optical module device, comprising: a circuit board; a light emitting chip array, disposed on the circuit board, for emitting signal light of different wavelengths; a first collimating lens array, The first lens assembly is arranged on the light-emitting direction of the light emitting chip, and is used for condensing the signal light; the first lens assembly is covered above the collimating lens array, and forms a first accommodating cavity with the circuit board; wherein: the The top of the lens assembly is provided with a first reflection surface and a second converging reflection surface; the first reflection surface is an inclined surface; a third reflection surface is arranged on the inner upper wall of the first accommodating cavity, and the third reflection surface is a coating film the first reflective surface; the coating layer includes a plurality of filter film layers; the signal light enters the first lens component through different filter film layers, and passes through the first reflective surface and the reflection and beam combination of the third reflecting surface; the second converging reflecting surface is arranged on one side of the first
  • an embodiment of the present application further provides an optical module, including: a circuit board; a second lens assembly, covered above the circuit board, and forming a second accommodating cavity with the circuit board; wherein: the The top of the lens assembly is provided with a fourth reflection surface and a fifth converging reflection surface; the fourth reflection surface is an inclined surface; a sixth reflection surface is arranged on the inner upper wall of the second accommodation cavity, and the sixth reflection surface is connected to the The fourth reflecting surface is arranged in parallel; the sixth reflecting surface includes a plurality of filter film layers; the fifth converging reflecting surface is used for converging and reflecting the signal light and transmitting it to the sixth reflecting surface; The six reflective surfaces cooperate with the fourth reflective surface for beam splitting and reflection; a light-receiving chip array is arranged on the circuit board for receiving signal light of different wavelengths; a second collimating lens array is arranged on the light The light incident direction of the receiving chip is used for condensing the signal light; the second lens assembly is provided with a second optical fiber fixing
  • an embodiment of the present application discloses an optical module device, comprising: a circuit board; a light emitting chip array, disposed on the circuit board, for emitting signal light of different wavelengths; a first collimating lens array, The first lens assembly is arranged on the light-emitting direction of the light emitting chip, and is used for condensing the signal light; the first lens assembly is covered above the collimating lens array, and forms a first accommodating cavity with the circuit board; wherein: the The top of the lens assembly is provided with a first reflection surface and a second converging reflection surface; the first reflection surface is an inclined surface; a third reflection surface is arranged on the inner upper wall of the first accommodating cavity, and the third reflection surface is a coating film the first reflective surface; the coating layer includes a plurality of filter film layers; the signal light enters the first lens component through different filter film layers, and passes through the first reflective surface and the Reflection and beam combining of the third reflecting surface; the second converging reflecting surface is arranged on one side
  • the present application further provides an optical module, including: a circuit board; a second lens assembly, which is covered and disposed above the circuit board and forms a second accommodating cavity with the circuit board; wherein: the lens assembly A fourth reflecting surface and a fifth converging reflecting surface are arranged at the top of the second accommodating cavity; the fourth reflecting surface is an inclined surface; Four reflecting surfaces are arranged in parallel; the sixth reflecting surface includes a plurality of filter film layers; the fifth converging reflecting surface is used for converging and reflecting the signal light and transmitting it to the sixth reflecting surface;
  • the light-receiving chip array is arranged on the circuit board to receive signal light of different wavelengths; the second collimating lens array is arranged on the light-receiving chip
  • the second lens assembly is provided with a second optical fiber fixing hole for fixing the second optical fiber array.
  • Fig. 1 is a schematic diagram of the connection relationship of optical communication terminals
  • Fig. 2 is a schematic diagram of the structure of an optical network unit
  • FIG. 3 is a schematic structural diagram of an optical module according to an embodiment of the present application.
  • FIG. 4 is a schematic diagram of an exploded structure of an optical module provided by an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of an optical module provided by an embodiment of the present application after removing the upper casing, the lower casing and the unlocking component;
  • FIG. 6 is a schematic diagram of a partially exploded structure of an optical module according to an embodiment of the present application.
  • FIG. 7 is a partial optical path diagram of an optical module light emission process provided by an embodiment of the present application.
  • FIG. 8 is a first structural schematic diagram of a first lens assembly and a first collimating lens array according to an embodiment of the present application
  • FIG. 9 is a cross-sectional view 1 of a first lens assembly and a first collimating lens array according to an embodiment of the present application;
  • FIG. 10 is a structural diagram 1 of a first collimating lens array provided by an embodiment of the present application.
  • FIG. 11 is a second structural schematic diagram of a first lens assembly and a first collimating lens array according to an embodiment of the application;
  • FIG. 12 provides a second cross-sectional view of a first lens assembly and a first collimating lens array
  • FIG. 13 is a second structural diagram of a first collimating lens array according to an embodiment of the application.
  • FIG. 14 is a perspective view 1 of a first lens assembly provided by an embodiment of the present application.
  • FIG. 15 is a second perspective view of a first lens assembly according to an embodiment of the application.
  • 16 is a cross-sectional view 1 of a first lens assembly provided by an embodiment of the application.
  • FIG. 17 is a schematic exploded schematic diagram 1 of a first lens assembly structure provided by an embodiment of the present application.
  • FIG. 18 is a second cross-sectional view of a first lens assembly provided by an embodiment of the application.
  • FIG. 19 is a schematic diagram of the main body structure of a first lens assembly provided by an embodiment of the present application.
  • FIG. 20 is a schematic structural diagram 1 of a first optical fiber array according to an embodiment of the present application.
  • FIG. 21 is a schematic structural diagram of a first optical fiber fixing hole according to an embodiment of the application.
  • FIG. 22 is a second schematic structural diagram of a first optical fiber array provided by an embodiment of the present application.
  • FIG. 23 is a perspective view one of the structure of a first lens assembly and an optical fiber support provided in an embodiment of the application;
  • 24 is a second perspective view of the structure of a first lens assembly and an optical fiber support provided in an embodiment of the application;
  • FIG. 25 is a three-dimensional view of the structure of a first lens assembly and an optical fiber support provided in an embodiment of the application;
  • 26 is an exploded structural diagram of a second lens assembly and a second collimating lens array provided by an embodiment of the application;
  • FIG. 27 is a structural diagram of yet another second lens assembly and a second collimating lens array provided by an embodiment of the present application.
  • FIG. 28 is a partial light path diagram of an optical module for light emission and reception according to an embodiment of the present application.
  • One of the core links of optical fiber communication is the mutual conversion of optical and electrical signals.
  • Optical fiber communication uses information-carrying optical signals to transmit in information transmission equipment such as optical fibers/optical waveguides.
  • the passive transmission characteristics of light in optical fibers/optical waveguides can realize low-cost, low-loss information transmission; while computers and other information processing equipment Electrical signals are used.
  • the optical module realizes the mutual conversion function of the above-mentioned optical and electrical signals in the technical field of optical fiber communication, and the mutual conversion of the optical signal and the electrical signal is the core function of the optical module.
  • the optical module realizes the electrical connection with the external host computer through the gold finger on its internal circuit board.
  • the main electrical connections include power supply, I2C signal, data signal and grounding, etc.
  • the electrical connection method realized by the gold finger has become the optical module.
  • the mainstream connection method of the industry based on this, the definition of pins on the gold finger has formed a variety of industry protocols/norms.
  • FIG. 1 is a schematic diagram of a connection relationship of an optical communication terminal.
  • the connection of the optical communication terminal mainly includes the interconnection between the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;
  • One end of the optical fiber 101 is connected to the remote server, and one end of the network cable 103 is connected to the local information processing device.
  • the connection between the local information processing device and the remote server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by The optical network terminal 100 with the optical module 200 is completed.
  • the optical port of the optical module 200 is externally connected to the optical fiber 101, and a two-way optical signal connection is established with the optical fiber 101;
  • the electrical port of the optical module 200 is externally connected to the optical network terminal 100, and a two-way electrical signal connection is established with the optical network terminal 100;
  • the optical module realizes mutual conversion between optical signals and electrical signals, so as to establish an information connection between the optical fiber and the optical network terminal; in an embodiment of the present application, after the optical signal from the optical fiber is converted into an electrical signal by the optical module Input to the optical network terminal 100, the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input into the optical fiber.
  • the optical network terminal has an optical module interface 102, which is used to access the optical module 200 and establish a two-way electrical signal connection with the optical module 200; Signal connection; a connection is established between the optical module 200 and the network cable 103 through the optical network terminal 100.
  • the optical network terminal transmits the signal from the optical module to the network cable, and transmits the signal from the network cable to the optical network terminal.
  • the optical network terminal acts as the host computer of the optical module to monitor the work of the optical module.
  • the remote server has established a two-way signal transmission channel with the local information processing equipment through optical fibers, optical modules, optical network terminals and network cables.
  • Common information processing equipment includes routers, switches, electronic computers, etc.; the optical network terminal is the host computer of the optical module, providing data signals to the optical module and receiving data signals from the optical module.
  • FIG. 2 is a schematic structural diagram of an optical network terminal.
  • the optical network terminal 100 has a circuit board 105, and a cage 106 is arranged on the surface of the circuit board 105; an electrical connector is arranged inside the cage 106 for connecting to the electrical port of an optical module such as a gold finger;
  • the cage 106 is provided with a radiator 107 , and the radiator 107 has raised portions such as fins that increase the heat dissipation area.
  • the optical module 200 is inserted into the optical network terminal, the electrical port of the optical module is inserted into the electrical connector inside the cage 106 , and the optical port of the optical module is connected to the optical fiber 101 .
  • the cage 106 is located on the circuit board, and the electrical connectors on the circuit board are wrapped in the cage, so that the interior of the cage is provided with electrical connectors; the optical module is inserted into the cage, the optical module is fixed by the cage, and the heat generated by the optical module is conducted to the cage. 106 and then diffuse through a heat sink 107 on the cage.
  • FIG. 3 is a schematic structural diagram of an optical module provided by an embodiment of the present application
  • FIG. 4 is a schematic structural diagram of an exploded optical module provided by an embodiment of the present application.
  • the optical module 200 provided in this embodiment of the present application includes an upper casing 201 , a lower casing 202 , an unlocking component 203 , a circuit board 300 , and an optical transceiver device.
  • the upper casing 201 is covered with the lower casing 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity generally presents a square body.
  • Two side plates are located on both sides of the main board and are vertically arranged with the main board;
  • the upper shell includes a cover plate, and the cover plate is closed on the two side plates of the upper shell to form a wrapping cavity;
  • the upper shell can also include a The two side walls on both sides of the cover plate and the two side walls vertically arranged with the cover plate are combined with the two side plates to realize that the upper casing is covered on the lower casing.
  • the two openings may be openings (204, 205) at both ends in the same direction, or may be two openings in different directions; one of the openings is an electrical port 204, and the gold fingers of the circuit board protrude from the electrical port 204.
  • the other opening is an optical port 205, which is used for external optical fiber access to connect the optical transceiver devices inside the optical module; the circuit board 300, optical transceiver devices and other optoelectronic devices are located in the package cavity.
  • the combination of the upper casing and the lower casing is adopted, which facilitates the installation of the circuit board 300, the optical transceiver and other components into the casing, and the upper casing and the lower casing form the outermost encapsulation protection casing of the optical module;
  • the upper casing and the lower casing are generally made of metal materials, which are conducive to electromagnetic shielding and heat dissipation; generally, the casing of the optical module is not made into an integral part, so that when assembling circuit boards and other devices, positioning parts, heat dissipation and electromagnetic shielding parts It cannot be installed and is not conducive to production automation.
  • the unlocking part 203 is located on the outer wall of the enclosing cavity/lower casing 202, and is used to realize the fixed connection between the optical module and the upper computer, or to release the fixed connection between the optical module and the upper computer.
  • the unlocking part 203 has an engaging part matched with the cage of the upper computer; pulling the end of the unlocking part can make the unlocking part move relatively on the surface of the outer wall; the optical module is inserted into the cage of the upper computer, and the optical module is moved by the engaging part of the unlocking part. It is fixed in the cage of the upper computer; by pulling the unlocking part, the engaging part of the unlocking part moves with it, thereby changing the connection relationship between the engaging part and the upper computer, so as to release the engaging relationship between the optical module and the upper computer, so that the The optical module is pulled out from the cage of the host computer.
  • the circuit board 300 is provided with a light-emitting chip, a driving chip for the light-emitting chip, a light-receiving chip, a transimpedance amplifying chip, a limiting amplifying chip, a microprocessor chip, etc., wherein the light-emitting chip and the light-receiving chip are directly mounted on the light-emitting chip.
  • COB chip on board
  • the circuit board connects the electrical components in the optical module according to the circuit design through the circuit wiring, so as to realize the electrical functions such as power supply, electrical signal transmission and grounding.
  • the circuit board is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the bearing function. For example, the rigid circuit board can carry the chip smoothly; when the optical transceiver is located on the circuit board, the rigid circuit board can also provide Stable bearing; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage.
  • metal pins/gold fingers are formed on one end surface of the rigid circuit board for connecting with Electrical connector connections; these are inconvenient to implement with flexible circuit boards.
  • the optical transceiver device includes two parts, an optical emitting part and an optical receiving part, which are respectively used to realize the transmission of optical signals and the reception of optical signals.
  • the light-emitting part and the light-receiving part may be combined together, or may be independent of each other.
  • This application mainly takes the light emitting component as an example for introduction.
  • FIG. 5 is a schematic structural diagram of the optical module provided by the embodiment of the present application after removing the upper casing, the lower casing and the unlocking part. Schematic. As shown in FIG. 6 , a schematic diagram of a partially exploded structure of an optical module provided by an embodiment of the present application is shown.
  • the light emitting chip array 310 is disposed on the circuit board 300 for emitting signal light of different wavelengths.
  • the light emitting chip array 310 is defined as a row along the length direction of the circuit board 300 ; and as a column along the length direction of the circuit board 300 .
  • a plurality of light-emitting chips of different wavelengths are arranged in the same row, and this application takes 4 as an example; the same column can be light-emitting chips of different wavelengths, or light-emitting chips of the same wavelength can be set .
  • the number of columns of the light emitting chip array 310 may be 1 column, 2 columns, 3 columns or 4 columns, which may be set according to actual needs of the optical module.
  • the light emitting chip array 310 is set in a 4-row 4-array mode.
  • FIG. 6 a schematic diagram of a partially exploded structure of an optical module provided in an embodiment of the present application.
  • the first lens assembly 400 and the circuit board 300 form a first receiving cavity that wraps the optical chip assembly, and the direction from the circuit board 300 to the first lens assembly 400 is
  • the light emitting chip array 310 and the first collimating lens array 320 are arranged in sequence.
  • the first collimating lens assembly 320 is covered above the light emitting chip array 310 , and the number of lenses in the first collimating lens array 320 depends on the number of chips in the light emitting chip array 310 . Generally, the number of lenses of the first collimating lens assembly 320 is equal to the number of chips in the light emitting chip array 310 . In order to realize the installation of the first collimating lens assembly 320 , the first collimating lens array 320 is provided with a collimating lens bracket, and the collimating lens bracket is connected and fixed to the circuit board 300 .
  • FIG. 7 is a partial light path diagram of the light emission process of the optical module provided by the embodiment of the present application.
  • the signal light emitted by the light emission chip array 310 is scattered light, and after passing through the first collimating lens array 320, a parallel light beam is formed, The first lens assembly 400 is illuminated.
  • the first collimating lens array 320 has 4 rows and 4 columns, and the setting of the rows and columns is consistent with the directions of the rows and columns of the light emitting chip array.
  • the first lens assembly 400 is disposed on the circuit board 300, and is disposed above the light emitting chip array in a cover-up manner.
  • the first lens assembly 400 and the circuit board 300 form a first accommodating cavity for wrapping the light emitting chip array.
  • the signal light emitted by the light emitting chip array is reflected and concentrated by the first lens assembly and then enters the optical fiber array.
  • the first lens assembly not only plays the role of sealing the optical chip, but also establishes the optical connection between the optical chip and the optical fiber.
  • the first lens assembly is used to transmit the light beam and change the transmission direction of the light beam during the transmission process. In use: the light emitted by the light emitting chip in the light emitting chip array is transmitted and reflected by the first lens assembly and then enters the optical fiber. optical connection between.
  • High-speed data transmission requires close proximity between the optical chip and its driver/matching chip, so as to shorten the connection between the chips and reduce the signal loss caused by the connection, and the first lens assembly 400 is covered above the optical chip.
  • the first lens assembly generally covers the optical chip and its driving/matching chip at the same time. Therefore, the light emitting chip and the driving chip of the light emitting chip are arranged close to each other, and the first lens assembly covers the light emitting chip and the driving chip of the light emitting chip; the light receiving chip and the transimpedance amplifying chip are arranged close to each other, and the first lens assembly covers the Light receiving chip and transimpedance amplifying chip.
  • each optical chip is generally small, and the size of the driver/matching chip of the optical chip is generally large, especially the driver/matching chip that achieves a rate of more than 100G, while the size of the first lens assembly is limited, the optical chip and its driver There are certain restrictions on the setting position of the /matching chip, and there is not much spatial freedom.
  • FIG. 8 provides a first structural schematic diagram of a first lens assembly and a first collimating lens array.
  • FIG. 9 provides a first cross-sectional view of a first lens assembly and a first collimating lens array
  • FIG. 10 is a first structural view of a first collimating lens array.
  • the first collimating lens array 320 is a support-type structure.
  • the first lens assembly 400 is covered above the circuit board 300 .
  • the first lens assembly 400 and the circuit board 300 are assembled to form a closed cavity.
  • the first collimating lens array 320 and the light emitting chip array 310 are disposed in the cavity.
  • the support-type structure may be as shown in the figure, including pillars arranged symmetrically and a flat plate arranged between the pillars, and a collimating lens is arranged on the flat plate.
  • the flat plate can be disposed on the top of the pillar, and the other end of the pillar is fixedly connected to the circuit board 300 , so that a certain gap is formed between the first collimating lens array 320 and the circuit board 300 , leaving space for the arrangement of the light emitting chip array 310 .
  • the support structure can be a split structure or an integrated structure.
  • the first collimating lens array 320 is integrally formed to ensure the distance between the first collimating lens array 320 and the circuit board 300, and at the same time to ensure The position between the flat plate and the pillar is kept accurate to avoid errors during installation by personnel, which is beneficial to improve the stability of the optical path of the entire optical module.
  • FIG. 11 provides a second structural schematic diagram of a first lens assembly and a first collimating lens array.
  • FIG. 12 provides a second cross-sectional view of a first lens assembly and a first collimating lens array;
  • FIG. 13 is a second structural view of a first collimating lens array.
  • the first collimating lens array 320 is a flat plate structure, and the bottom end of the first lens assembly 400 has a first bearing surface 423 and a second bearing surface 422 .
  • the first bearing surface 423 is used for bearing one end of the first collimating lens array 320
  • the second bearing surface 422 is used for bearing the other end of the first collimating lens array 320 .
  • the positions of the lenses in the first collimating lens array 320 correspond to the positions of the optical chips, and are not necessarily arranged at the center of the first collimating lens array.
  • the flat-panel structure of the first collimating lens array 320 can be set as a horizontal I-shape, and both ends are placed horizontally on the corresponding bearing surface.
  • the straight lenses are arranged on the surface of the main body plate in the form of an array.
  • the first bearing surface 423 and the second bearing surface 422 of the first lens assembly 400 and the first lens assembly The side of the first lens assembly 400 is connected, so that the package cavity formed after the first lens assembly 400 is assembled with the circuit board 300 is not completely sealed, an opening is provided on the side of the first lens assembly 400, and the first collimating lens array 320 The position is inserted from the outside of the first lens assembly 400 to the inside.
  • FIG. 14 is a perspective view 1 of a first lens assembly provided by an embodiment of the application
  • FIG. 15 is a perspective view 2 of a first lens assembly provided by an embodiment of the application
  • FIG. 16 is a first lens provided by an embodiment of the application Component sectional view 1
  • FIG. 17 is an exploded schematic view 1 of the first lens component provided by the embodiment of the application.
  • the first lens assembly 400 includes: a first reflection surface 411 , a second converging reflection surface 412 , a third reflection surface 413 , and a first optical fiber fixing hole 414 .
  • the first reflecting surface 411 and the second converging reflecting surface 412 are disposed on the top surface of the first lens assembly 400 .
  • the first reflection surface 411 is an inclined surface, and the inclination angle of the upper surface of the first lens assembly 400 is consistent with that of the first reflection surface 411 .
  • a third reflective surface 413 is provided on the inner upper wall of the first accommodating cavity.
  • the third reflective surface 413 is a coating layer and is arranged parallel to the first reflective surface 411 .
  • the signal light enters the third reflective surface 143 through different positions of the coating layer, and is then reflected toward the third reflective surface 413 through the first reflective surface 411 to realize the beam combining of signal lights of different wavelengths.
  • the coating layer is provided with a plurality of filter film layers, and signal lights of different wavelengths are injected into the first lens assembly 400 through different filter film layers.
  • the arrangement of the filter film layers corresponds to the arrangement of the light emitting chips, so as to realize the beam combining of light of different wavelengths. For example, if 4 light emitting chips with different wavelengths are arranged in the same row in the light emitting chip array, the coating layer needs to be arranged with corresponding 4 different filter film layers.
  • the filter film layer in the same column is the same sub-film layer, or a whole column covering the entire column direction. film layer. If the same column of the light emitting chip array is the light emitting chips of different wavelengths, the same column of the filter film layer has different sub-film layers.
  • the second converging reflection surface 412 is an inclined surface, and is provided with an arc-shaped convex portion, and the arc-shaped convex portion protrudes toward the outside of the first lens assembly 400 , and the second converging and reflecting surface 412 is disposed on the first lens assembly 400 .
  • a reflective surface 411 is away from one side of one end of the circuit board 300 , and the second converging reflective surface 412 is provided with an arc-shaped protrusion.
  • the second converging reflection surface 412 is disposed between the first reflecting surface 411 and the first optical fiber fixing hole 414 for transmission of the combined signal light between the second converging reflection surface 412 and the first optical fiber array 500 .
  • the surface of the second converging and reflecting surface in the present application is arc-shaped, so that the second converging and reflecting surface 420 can have a converging function, and no additional converging lens is required.
  • the light emitting chip array 310 is a plurality of lasers.
  • the embodiment of the present application takes a row of four light emitting chips as an example, and the signal light of four wavelengths emitted by the laser is condensed into parallel light through the first collimating lens assembly 320 .
  • the four parallel light beams are respectively incident on different filter film layers of the third reflecting surface 413, and cooperate with the first reflecting surface 411.
  • the four parallel light beams are incident on the second converging reflecting surface 412, and the second converging reflecting surface 412
  • the light beam is reflected and converged and transmitted to the first optical fiber array 500, and the position of the optical fiber hole matches the position of the light beam converging spot to ensure that the spot can reach the first optical fiber array to complete the coupling and transmission of light.
  • the wavelength of the first light emitted by the first laser 311 is , the wavelength of the second light emitted by the second laser 312 is , the wavelength of the third light emitted by the third laser 313 is for.
  • the third reflective surface 413 is provided with a first filter film layer 4131, a second filter film layer 4132, a third filter film layer 4133, and a fourth filter film layer 4134, which respectively allow only the light beams of the corresponding wavelengths to pass through, while the light beams of other wavelengths are filtered. reflection.
  • the first outgoing light rays are converged by the first collimating lens array 320 to form a parallel beam, and reach the first filter film layer 4131 , which can allow light with a wavelength of 100 ⁇ to pass through.
  • the first outgoing light is slightly refracted in the first filter film layer 4131 and then transmitted to the first reflection surface 411 , reflected by the first reflection surface 411 and transmitted to the second filter film layer 4132 , and the second filter film layer 4132 occurs. secondary reflection.
  • the second outgoing light emitted by the second laser 312 has a wavelength of light passes through. After entering the first lens assembly 400, the second outgoing light and the first outgoing light are combined for the first time to form a combined light. Then, according to the light path diagram, it is sequentially combined with the third outgoing light and the fourth outgoing light to form a final combined light.
  • the end face of the first fiber array 500 is set at the converging focus position of the second converging reflection surface 412 , and the center line of the first fiber array 500 coincides with the center light of the second converging reflection surface 412 .
  • the signal light finally generated by the signal light is transmitted to the second converging reflection surface 420 , it is reflected by the second converging and reflecting surface 420 and then condensed into the first optical fiber array.
  • the light in order to realize multiple reflections of light between the first reflection surface and the third reflection surface, the light can be transmitted in sequence, and the first reflection surface 411 is a total reflection surface.
  • the inclination angle of the third reflection surface is consistent with the inclination angle of the top plate of the first lens assembly 400 , and the angle is related to the spacing between optical chips of different wavelengths, and is generally between 4° and 17°.
  • a certain angle is set between the first reflecting surface 411 and the plane of the circuit board 300, and the light beam passes through multiple reflections, The transmission of light beams between the first collimating lens array 320 and the second converging reflection surface 412 is realized.
  • FIG. 18 provides a second schematic exploded view of the structure of a first lens assembly
  • FIG. 19 provides a schematic diagram of the main structure of a first lens assembly.
  • the first lens assembly 400 includes a support body 420 and a main body 410 .
  • the main body 410 is provided with a first reflecting surface 411 , a second converging reflecting surface 412 , a third reflecting surface 413 , a first optical fiber fixing hole 414 , and a first cavity 440 .
  • the first reflecting surface 411 and the second converging reflecting surface 412 are disposed on the upper surface of the main body 410 .
  • the first reflection surface 411 is an inclined surface, and the inclination angle of the upper surface of the main body 410 is the same.
  • the support body 420 is covered on the circuit board 300 and is inserted and fixed with the main body 410 .
  • the support body 420 may be a rectangular cylinder with a hollow interior formed by four brackets connected end to end and enclosed.
  • the support body 420 is provided with a plurality of fixing holes 421 .
  • the bottom surface of the main body 410 is provided with a plurality of positioning columns 415 , and the fixing holes 421 match the positions and sizes of the positioning columns 415 to realize the insertion of the fixing holes 421 and the positioning columns 415 .
  • two fixing holes 421 may be provided on the support body 420 , which are respectively located at diagonally opposite corners of the support body 420 .
  • the connection surface of the main body 410 and the support body 420 is a plane disposed parallel to the circuit board 300 . Then, the main body 410 forms the first cavity 440 .
  • the vertical height of the first cavity 440 cannot be too large.
  • the first cavity 440 of the main body 410 has a small space and cannot accommodate the light emitting chip array 310 and the first collimating lens array 320.
  • the second cavity 430 inside the support body 420 is used for accommodating the light emitting chip array 310 and the first collimating lens array 320. Collimating lens array 320 .
  • the second cavity 430 communicates with the first cavity 440 to ensure the transmission of signal light.
  • FIG. 19 is a schematic diagram of a main body structure of a first lens assembly according to an embodiment of the present application.
  • the third reflection surface 413 is disposed on the bottom surface of the main body 410.
  • the third reflection surface 413 is a coating layer. Different wavelengths of signal light are filtered.
  • the third reflective surface 413 is a plurality of filters distributed in parallel, and the filters are connected with the bottom surface of the main body through optical glue.
  • the third reflective surface 413 is disposed parallel to the first reflective surface 411 , and the projection of the third reflective surface 413 in the direction of the circuit board 300 covers the optical chip assembly, so that the third reflective surface 413 can receive all the signal light emitted or received by the optical chip.
  • the projection of the first reflective surface 411 in the direction of the circuit board 300 covers the third reflective surface 413 , so that the first reflective surface can process all signal light rays to prevent signal loss.
  • the main body 410 and the support body 420 of the first lens assembly 400 are respectively integrally formed, so that the position and size between the first optical fiber fixing hole 414 and the second converging reflection surface 412 are very stable, improving the The connection accuracy between components is improved, thereby improving the coupling accuracy when coupling multiple channels in COB technology.
  • the first lens assembly 400 may also be an integral structure, and the integral molding structure has high precision to avoid errors in the assembly process, so that the first optical fiber fixing hole 414 and the second converging reflection surface 412 The position and size between them are very stable, which improves the connection accuracy between components, thereby improving the coupling accuracy when coupling multiple channels in COB technology.
  • the end face of the first optical fiber array 500 is set at the converging focal position of the second converging and reflecting surface 412 , and the center line of the first optical fiber array 500 coincides with the center light of the second converging and reflecting surface 412 to ensure beam coupling accuracy.
  • the position of the first optical fiber positioning hole is consistent with the position of the light beam converging spot to ensure that the light spot can reach the first optical fiber array to complete the coupling and transmission of light.
  • FIG. 20 is a schematic structural diagram 1 of a first optical fiber array provided by an embodiment of the application
  • FIG. 21 is a schematic structural diagram of a first optical fiber fixing hole provided by an embodiment of the application. 20 and 21, in order to ensure the positional relationship between the first optical fiber array 500 and the second converging reflection surface 412, so that the position of the first optical fiber array 500 is stable, the first optical fiber fixing hole 414 includes: a first installation The groove 4141, the second installation groove 4142, the first installation groove 4141 and the second installation groove 4142 communicate with each other.
  • the first optical fiber array 500 includes: an inner core 510 , a cladding layer 520 and a sheath 530 ; the cladding layer 520 is arranged between the inner core 510 and the sheath 530 , and the first installation groove 4141 matches the cladding layer 520 of the first optical fiber array 500 Setting; the second installation groove 4142 is matched with the sheath 530 .
  • the first optical fiber fixing hole 414 is fixedly connected to the first optical fiber array 500 through optical glue.
  • the first installation groove 441 and the second installation groove 442 are coaxially arranged.
  • the second schematic structural diagram of the first optical fiber array is another angular structural schematic diagram of the first optical fiber array 500 .
  • the outer layer of the first optical fiber array 500 is provided with a concentrating rubber sleeve 540 for gathering the plurality of optical fibers.
  • the first optical fiber fixing hole 414 further includes: a third installation groove 443 , and the third installation groove 443 is matched with the hub rubber sleeve 540 .
  • the first installation groove 4141, the second installation groove 4142, and the third installation groove 4143 are coaxially arranged, so that the first optical fiber array
  • the part in the first optical fiber fixing hole is arranged in a straight line to avoid bending and affecting the service life, and the first lens assembly 400 is integrally formed as a whole, the position of the light fixing hole is very stable, and the first optical fiber array and the second convergent reflection The distance between the faces 412 is fixed.
  • transition grooves are respectively provided between the first installation groove 4141, the second installation groove 4142, and the third installation groove 4143, and the outer edge of the transition groove is formed by an installation groove. It is inclined to the adjacent installation slot, so that the transition between the first installation slot 4141, the second installation slot 4142, and the third installation slot 4143 is smooth, so as to avoid the contact dead angle between the single first optical fiber array and the installation slot during the insertion process, which will affect the insertion
  • the connection effect is ensured; it is ensured that the end face of the first optical fiber array is set at the converging focus of the second converging reflection surface 412, so as to improve the light coupling accuracy.
  • the glue added in the gap part is optical glue, which is ensured between the first optical fiber array 500 and the first optical fiber fixing hole 414 While the connection is fixed, the transmission of signal light is ensured.
  • the embodiment of the present application also provides another connection manner of the first optical fiber array and the first lens assembly.
  • 23 is a first perspective view of the structure of a first lens assembly and an optical fiber support provided by an embodiment of the application
  • FIG. 24 is a perspective view of the structure of a first lens assembly and an optical fiber support provided by an embodiment of the application
  • FIG. 25 is an implementation of the application
  • Example 3 provides a perspective view of the structure of a first lens assembly and an optical fiber support.
  • the optical module further includes: a first optical fiber support 600 .
  • the first optical fiber holder 600 includes: a holder positioning hole 601 and a first optical fiber slot 602 .
  • the bracket positioning holes 601 are arranged on the side surface of the first optical fiber bracket 600 and are respectively arranged at both ends of the side surface.
  • the first lens assembly 400 is provided with a bracket positioning column 417 , which matches the position and size of the bracket positioning hole 601 .
  • the bracket positioning column 415 is inserted into the bracket positioning hole 601 to realize the connection between the first optical fiber bracket 600 and the first lens assembly 400 .
  • the bottom surface of the first optical fiber holder 600 is provided with a guide groove 603
  • the first lens assembly 400 is provided with a guide rail 416 to match the guide groove 603 .
  • the operator can first match the guide rail 416 with the guide groove 603, and then push the first optical fiber holder 600 to the first lens assembly 400 to install, which can avoid assembly deviation, and at the same time, the guide rail 416 and the guide groove 603 cooperate with each other. , making the assembly easier.
  • the upper surface of the first fiber support 600 is provided with a first fiber slot 602 for carrying the first fiber array 500 .
  • the side of the first optical fiber support 600 is provided with an optical fiber hole 604 for fixing the end face of a single optical fiber and ensuring the The end face is arranged at the converging focal point of the second converging reflection surface to improve the coupling precision.
  • the optical module provided by the present application can realize multi-wavelength channels, independent optical paths emitted by lasers of different wavelengths, and realize the function of combining multiple optical paths.
  • the first lens assembly is provided with a first optical fiber fixing hole for positioning the first optical fiber array.
  • the first lens assembly is an integral molding structure. Because it is mass-produced by an integral molding die, the position and size of the hole relative to the second converging reflection surface are very stable, and this design is both precise and easy to assemble.
  • the alignment of the optical path and the first optical fiber array can be completed in a very simple process, the optical coupling is completed, and the optical coupling accuracy is improved.
  • the structure of the second lens assembly 400A is similar to or the same as that of the first lens assembly 400 .
  • the lens assembly in light emission is defined as the first lens assembly
  • the lens assembly in light reception is defined as the second lens assembly.
  • An exploded structural diagram of a collimating lens array FIG. 27 is a structural diagram of yet another second lens assembly and a second collimating lens array according to an embodiment of the present application. As shown in FIG. 26 or 27 , the second lens assembly 400A and the circuit board 300 form a second accommodating cavity, and the second accommodating cavity is used for arranging optical devices.
  • a light-receiving chip array 310A and a second collimating lens array 320A are sequentially arranged in the second accommodating cavity from the circuit board 300 to the top.
  • the top surface of the second lens assembly 400A is provided with a fourth reflection surface 411A and a fifth converging reflection surface 412A.
  • a sixth reflection surface 413A is provided on the inner upper wall of the second accommodating cavity, and the sixth reflection surface 413A is arranged in parallel with the fourth reflection surface 411A.
  • the sixth reflection surface 413A includes a plurality of filter film layers.
  • the light-receiving chip array 310A includes a plurality of light-receiving chips for receiving multiple beams of signal light with different wavelengths, wherein the light-receiving chips are arranged in an array, and the light-receiving chips are arranged in the length direction and the width direction of the circuit board. , wherein one row of light-receiving chips in the length direction is set as one group, so that multiple groups of light-receiving chips can be set.
  • the second collimating lens array 320A includes several collimating lenses for the signal light output by the second lens assembly 320A.
  • the structure of the second collimating lens array 320A is similar to or the same as that of the first collimating lens array 320 .
  • the second collimating lens array 320A is covered above the light-receiving chip array 310A, and the number of lenses in the second collimating lens array 400A depends on the number of light-receiving chips in the light-receiving chip array 310A. Generally, the number of lenses of the second collimating lens array 400A is equal to the number of light receiving chips in the light receiving chip array 310A.
  • the structure of the sixth reflection surface 413A is the same as or similar to that of the third reflection surface 413 , and the sixth reflection surface 413A includes a plurality of filter film layers distributed in parallel.
  • the sixth reflective surface 413A uses different film layers arranged at different positions to transmit and reflect the signal light of different wavelengths to split a signal light including different wavelengths into multiple light beams.
  • the sixth reflection surface 413A selects the number of reflections of the signal light of each wavelength in coordination according to the wavelength type and the number of the divided beams.
  • a beam of signal light with different wavelengths outside the optical module is transmitted to the second lens assembly 400A, and the beam of signal light is reflected by the fifth converging and reflecting surface 412A and then condensed to the sixth reflecting surface 413A .
  • the light beam of one wavelength is incident on the corresponding collimating lens through the sixth reflecting surface 413A, and the light beam of the remaining wavelength is reflected to the fourth reflecting surface 411A.
  • the light beam of another wavelength After being reflected by the fourth reflecting surface 411A to the sixth reflecting surface 413A, the light beam of another wavelength passes through the sixth reflecting surface 413A, and the light beam of the remaining wavelength is reflected to the fourth reflecting surface 411A, thus completing a beam of signal light with different wavelengths
  • the signal light is divided into multiple beams of different wavelengths, which are collimated by the second collimating lens array 320A and then transmitted to the light receiving chips in the light receiving chip assembly in turn, so as to realize the function of the optical module receiving signal light of multiple wavelengths in a single fiber.
  • FIG. 28 is a partial light path diagram of an optical module for light emission and reception according to an embodiment of the present application.
  • the light-receiving chip array 310A is a plurality of light-receiving chips.
  • the embodiment of the present application takes four light receiving chips in a row as an example.
  • a bundle of signal light with different wavelengths outside the optical module is transmitted to the second lens assembly 400A, and the bundle of signal light is reflected by the fifth converging reflection surface 412A and then condensed to the sixth reflection surface 413A.
  • the beam of signal light includes four wavelengths of signal light, ⁇ 1, ⁇ 2, ⁇ 3 and ⁇ 4. Since the light is reversible, it is reflected and filtered through the sixth reflecting surface 413A and the fourth reflecting surface 411A, so as to complete a beam splitting including signal light of different wavelengths.
  • the second collimating lens array 320A has the same structure as the first collimating lens array 320; the second optical fiber array has the same structure as the first optical fiber array 500, and can refer to each other.
  • the structures of the first lens assembly 400 and the second lens assembly 400A in the light emission process and the light reception process are completely consistent, and the photodetectors and lasers can be arranged in an array in sequence, which can save space.
  • the light emitting device and the light receiving device are arranged in the same lens assembly, which improves the space utilization rate, reduces the number of optical module components, and simplifies the assembly process.
  • the lens assembly is also covered above the light-emitting chip array or the light-receiving chip array, which facilitates changing the propagation direction of the signal light emitted by the light-emitting chip or the signal light from outside the optical module by using fewer components.
  • the light-emitting chip array and the light-receiving chip array may be covered by the first lens assembly and the second lens assembly, respectively; and may also be covered by the same lens assembly.
  • the number of columns of the first lens array may be one, or two, or the like.
  • the same collimating lens array and the same fiber array can also be used at the same time. It is only necessary to set the optical chips in the light-emitting chip array and the light-receiving chip array in one-to-one correspondence with the corresponding filter film layers in the lens assembly as required.
  • the first lens assembly and the circuit board form a first accommodating cavity, and the first accommodating cavity is sequentially provided with a light emitting chip array and a first collimating lens array from bottom to top, and the surface of the first lens assembly is A first reflecting surface and a second converging reflecting surface are provided, a third reflecting surface is set on the inner upper wall of the first accommodating cavity, and the third reflecting surface is a coating layer and is arranged in parallel with the first reflecting surface; the coating layer includes Multiple filter film layers.
  • the light emitting chip array includes a plurality of light emitting chips, and the light emitting chip array can emit multiple beams of signal light with different wavelengths.
  • the signal light is in a scattered state, and is collimated and focused by the first collimating lens array to form parallel light.
  • multiple beams of parallel light with different wavelengths are transmitted to the film layer of the third reflective surface.
  • the light beam of one wavelength is transmitted to the first reflecting surface through a filter film layer of the third reflecting surface, and is totally reflected by the first reflecting surface to another filter film layer of the third reflecting surface.
  • the light beam of another wavelength is After passing through another filter film layer of the third reflecting surface, it is combined with the reflected beam and then transmitted to the first reflecting surface, and is totally reflected by the first reflecting surface to the third reflecting surface, repeating the previous beam combining to complete multiple different beams
  • the signal light of the wavelength is combined to finally generate a bundle of signal light, which is reflected by the second converging reflection surface and then converged into the optical fiber ribbon to realize the simultaneous transmission of signal light of multiple wavelengths in a single fiber.
  • the optical module provided by the present application, only the first reflection surface and the third reflection surface provided by the first lens assembly are used to complete the beam combining of multiple signal lights of different wavelengths, which improves the coupling accuracy when coupling multiple channels in the optical module. .
  • the second lens assembly and the circuit board form a second accommodating cavity
  • the light receiving chip assembly and the second collimating lens array are arranged in sequence from bottom to top in the cavity
  • the top surface of the second lens assembly is provided with a fourth reflecting surface and a fifth converging reflecting surface
  • a sixth reflecting surface is provided on the inner upper wall of the second accommodating cavity, and the sixth reflecting surface is arranged in parallel with the fourth reflecting surface
  • the sixth reflecting surface includes a plurality of filter layer.
  • a beam of signal light with different wavelengths outside the optical module is transmitted to the second lens assembly, the signal light is reflected by the fifth converging reflecting surface and then converged to the sixth reflecting surface, wherein the beam of one wavelength passes through the sixth reflecting surface, The light beam of the remaining wavelength is reflected to the fourth reflecting surface, and is reflected to the sixth reflecting surface through the fourth reflecting surface. The light beam of another wavelength passes through the sixth reflecting surface, and the light beam of the remaining wavelength is reflected to the fourth reflecting surface.
  • the beam of signal light with different wavelengths is demultiplexed into multiple beams of signal light with different wavelengths, which are sequentially transmitted to the light-receiving chips in the light-receiving chip array after passing through the second collimating lens array, so that the optical module can receive multiple wavelengths in a single fiber.
  • the function of signal light In the optical module provided by the present application, only the fourth reflection surface and the sixth reflection surface provided by the second lens assembly are used to complete a beam of signal light with different wavelengths, which improves the coupling when coupling multiple channels in the optical module. precision.
  • the present application also provides an implementation manner in which the light-emitting chip array and the light-receiving chip array are arranged in the same lens assembly.

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Abstract

An optical module: a first lens assembly (400) and a circuit board (300) form a first accommodating cavity; the first accommodating cavity is provided in succession from bottom to top with a light-emitting chip array (310) and a first collimating lens array (320), and the surface of the first lens assembly (400) is provided with a first reflective surface (411) and a second converging reflective surface (412); a third reflective surface (413) is provided on the inner upper wall of the first accommodating cavity; the third reflective surface (413) is a coating layer, and is arranged in parallel with the first reflective surface (411); and the coating layer comprises a plurality of filtering film layers distributed in parallel. The first reflective surface (411) and the third reflective surface (413) provided by the first lens assembly (400) complete the combining of multiple beams of signal light of different wavelengths, thereby improving the coupling accuracy when coupling multiple channels in the optical module.

Description

一种光模块an optical module
本公开要求在2020年10月19日提交中国专利局、申请号为202011120982.X、专利名称为“一种光模块”的优先权,要求在2020年10月19日提交中国专利局、申请号为202011120978.3、专利名称为“一种光模块”的优先权,要求在2020年10月19日提交中国专利局、申请号为202011120975.X、专利名称为“一种光模块”的优先权,其全部内容通过引用结合在本公开中。This disclosure requires the priority to be submitted to the China Patent Office on October 19, 2020, with the application number 202011120982.X and the patent name "An Optical Module", and is required to be submitted to the China Patent Office on October 19, 2020, with the application number It is the priority of 202011120978.3, the patent name is "an optical module", and the priority is required to be submitted to the Chinese Patent Office on October 19, 2020, the application number is 202011120975.X, and the patent name is "an optical module". The entire contents of this disclosure are incorporated by reference.
技术领域technical field
本公开涉及光通信技术领域,尤其涉及一种光模块。The present disclosure relates to the technical field of optical communication, and in particular, to an optical module.
背景技术Background technique
光纤通信的核心环节之一是光、电信号的相互转换。光纤通信使用携带信息的光信号在光纤/光波导等信息传输设备中传输,利用光在光纤/光波导中的无源传输特性可以实现低成本、低损耗的信息传输;而计算机等信息处理设备使用的是电信号,为了在光纤/光波导等信息传输设备与计算机等信息处理设备之间建立信息连接,就需要实现电信号与光信号的相互转换。One of the core links of optical fiber communication is the mutual conversion of optical and electrical signals. Optical fiber communication uses information-carrying optical signals to transmit in information transmission equipment such as optical fibers/optical waveguides. The passive transmission characteristics of light in optical fibers/optical waveguides can realize low-cost, low-loss information transmission; while computers and other information processing equipment Electrical signals are used. In order to establish an information connection between information transmission equipment such as optical fibers/optical waveguides and information processing equipment such as computers, it is necessary to realize the mutual conversion of electrical signals and optical signals.
目前,光模块是现代光通信网络的重要组成部件,它为通信网络提供了Gbit高速数据物理通道,而光发射器件和光接收器件是光模块中最为核心的部件。随着当前数据中心网络的快速建设与升级,数据中心对光模块提出了多波长通道、高速率、小尺寸、低成本等诉求。At present, the optical module is an important component of the modern optical communication network. It provides a Gbit high-speed data physical channel for the communication network, and the optical transmitting device and the optical receiving device are the core components of the optical module. With the rapid construction and upgrade of the current data center network, data centers have put forward demands on optical modules such as multi-wavelength channels, high speed, small size, and low cost.
发明内容SUMMARY OF THE INVENTION
第一方面,本申请实施例公开了一种光模块装置,包括:电路板;光发射芯片阵列,设置于所述电路板上,用于发射不同波长的信号光;第一准直透镜阵列,设置于所述光发射芯片的出光方向上,用于汇聚所述信号光;第一透镜组件,罩设于所述准直透镜阵列上方,与所述电路板形成第一容纳腔;其中:所述透镜组件的顶端设置第一反射面和第二汇聚反射面;所述第一反射面为倾斜面;所述第一容纳腔内侧上壁设置第三反射面,所述第三反射面为镀膜层,与所述第一反射面平行设置;所述镀膜层包含多个滤波膜层;所述信号光经不同的滤波膜层进入所述第一透镜组件,经所述第一反射面与所述第三反射面的反射、合束;所述第二汇聚反射面设置于所述第一反射面的一侧,用于将合束后的信号光汇聚反射至第一光纤阵列;所述第一透镜组件设置第一光纤阵列固定孔,用于固定所述第一光纤阵列。In a first aspect, an embodiment of the present application discloses an optical module device, comprising: a circuit board; a light emitting chip array, disposed on the circuit board, for emitting signal light of different wavelengths; a first collimating lens array, The first lens assembly is arranged on the light-emitting direction of the light emitting chip, and is used for condensing the signal light; the first lens assembly is covered above the collimating lens array, and forms a first accommodating cavity with the circuit board; wherein: the The top of the lens assembly is provided with a first reflection surface and a second converging reflection surface; the first reflection surface is an inclined surface; a third reflection surface is arranged on the inner upper wall of the first accommodating cavity, and the third reflection surface is a coating film the first reflective surface; the coating layer includes a plurality of filter film layers; the signal light enters the first lens component through different filter film layers, and passes through the first reflective surface and the reflection and beam combination of the third reflecting surface; the second converging reflecting surface is arranged on one side of the first reflecting surface, and is used for converging and reflecting the combined signal light to the first optical fiber array; A lens assembly is provided with a first optical fiber array fixing hole for fixing the first optical fiber array.
第二方面,本申请实施例还提供了一种光模块,包括:电路板;第二透镜组件,罩设于所述电路板上方,与所述电路板形成第二容纳腔;其中:所述透镜组件的顶端设置第四反射面和第五汇聚反射面;所述第四反射面为倾斜面;所述第二容纳腔内侧上壁设置第六反射面,所述第六反射面,与所述第四反射面平行设置;所述第六反射面包含多个滤波 膜层;所述第五汇聚反射面用于将信号光汇聚反射,传送至所述第六反射面;再经所述第六反射面与所述第四反射面配合分束、反射;光接收芯片阵列,设置于所述电路板上,用于接收不同波长的信号光;第二准直透镜阵列,设置于所述光接收芯片的入光方向上,用于汇聚所述信号光;所述第二透镜组件设置第二光纤阵列固定孔,用于固定第二光纤阵列。In a second aspect, an embodiment of the present application further provides an optical module, including: a circuit board; a second lens assembly, covered above the circuit board, and forming a second accommodating cavity with the circuit board; wherein: the The top of the lens assembly is provided with a fourth reflection surface and a fifth converging reflection surface; the fourth reflection surface is an inclined surface; a sixth reflection surface is arranged on the inner upper wall of the second accommodation cavity, and the sixth reflection surface is connected to the The fourth reflecting surface is arranged in parallel; the sixth reflecting surface includes a plurality of filter film layers; the fifth converging reflecting surface is used for converging and reflecting the signal light and transmitting it to the sixth reflecting surface; The six reflective surfaces cooperate with the fourth reflective surface for beam splitting and reflection; a light-receiving chip array is arranged on the circuit board for receiving signal light of different wavelengths; a second collimating lens array is arranged on the light The light incident direction of the receiving chip is used for condensing the signal light; the second lens assembly is provided with a second optical fiber array fixing hole for fixing the second optical fiber array.
第三方面,本申请实施例公开了一种光模块装置,包括:电路板;光发射芯片阵列,设置于所述电路板上,用于发射不同波长的信号光;第一准直透镜阵列,设置于所述光发射芯片的出光方向上,用于汇聚所述信号光;第一透镜组件,罩设于所述准直透镜阵列上方,与所述电路板形成第一容纳腔;其中:所述透镜组件的顶端设置第一反射面和第二汇聚反射面;所述第一反射面为倾斜面;所述第一容纳腔内侧上壁设置第三反射面,所述第三反射面为镀膜层,与所述第一反射面平行设置;所述镀膜层包含多个滤波膜层;所述信号光经不同的滤波膜层进入所述第一透镜组件,经所述第一反射面与所述第三反射面的反射、合束;所述第二汇聚反射面设置于所述第一反射面的一侧,用于将合束后的信号光汇聚反射至第一光纤阵列;所述第一透镜组件设置第一光纤固定孔,用于固定所述第一光纤阵列。In a third aspect, an embodiment of the present application discloses an optical module device, comprising: a circuit board; a light emitting chip array, disposed on the circuit board, for emitting signal light of different wavelengths; a first collimating lens array, The first lens assembly is arranged on the light-emitting direction of the light emitting chip, and is used for condensing the signal light; the first lens assembly is covered above the collimating lens array, and forms a first accommodating cavity with the circuit board; wherein: the The top of the lens assembly is provided with a first reflection surface and a second converging reflection surface; the first reflection surface is an inclined surface; a third reflection surface is arranged on the inner upper wall of the first accommodating cavity, and the third reflection surface is a coating film the first reflective surface; the coating layer includes a plurality of filter film layers; the signal light enters the first lens component through different filter film layers, and passes through the first reflective surface and the reflection and beam combination of the third reflecting surface; the second converging reflecting surface is arranged on one side of the first reflecting surface, and is used for converging and reflecting the combined signal light to the first optical fiber array; A lens assembly is provided with a first optical fiber fixing hole for fixing the first optical fiber array.
第四方面,本申请实施例还提供了一种光模块,包括:电路板;第二透镜组件,罩设于所述电路板上方,与所述电路板形成第二容纳腔;其中:所述透镜组件的顶端设置第四反射面和第五汇聚反射面;所述第四反射面为倾斜面;所述第二容纳腔内侧上壁设置第六反射面,所述第六反射面,与所述第四反射面平行设置;所述第六反射面包含多个滤波膜层;所述第五汇聚反射面用于将信号光汇聚反射,传送至所述第六反射面;再经所述第六反射面与所述第四反射面配合分束、反射;光接收芯片阵列,设置于所述电路板上,用于接收不同波长的信号光;第二准直透镜阵列,设置于所述光接收芯片的入光方向上,用于汇聚所述信号光;所述第二透镜组件设置第二光纤固定孔,用于固定第二光纤阵列。In a fourth aspect, an embodiment of the present application further provides an optical module, including: a circuit board; a second lens assembly, covered above the circuit board, and forming a second accommodating cavity with the circuit board; wherein: the The top of the lens assembly is provided with a fourth reflection surface and a fifth converging reflection surface; the fourth reflection surface is an inclined surface; a sixth reflection surface is arranged on the inner upper wall of the second accommodation cavity, and the sixth reflection surface is connected to the The fourth reflecting surface is arranged in parallel; the sixth reflecting surface includes a plurality of filter film layers; the fifth converging reflecting surface is used for converging and reflecting the signal light and transmitting it to the sixth reflecting surface; The six reflective surfaces cooperate with the fourth reflective surface for beam splitting and reflection; a light-receiving chip array is arranged on the circuit board for receiving signal light of different wavelengths; a second collimating lens array is arranged on the light The light incident direction of the receiving chip is used for condensing the signal light; the second lens assembly is provided with a second optical fiber fixing hole for fixing the second optical fiber array.
第五方面,本申请实施例公开了一种光模块装置,包括:电路板;光发射芯片阵列,设置于所述电路板上,用于发射不同波长的信号光;第一准直透镜阵列,设置于所述光发射芯片的出光方向上,用于汇聚所述信号光;第一透镜组件,罩设于所述准直透镜阵列上方,与所述电路板形成第一容纳腔;其中:所述透镜组件的顶端设置第一反射面和第二汇聚反射面;所述第一反射面为倾斜面;所述第一容纳腔内侧上壁设置第三反射面,所述第三反射面为镀膜层,与所述第一反射面平行设置;所述镀膜层包含多个滤波膜层;所述信号光经不同的滤波膜层进入所述第一透镜组件,经所述第一反射面与所述第三反射面的反射、合束;所述第二汇聚反射面设置于所述第一反射面的一侧,用于将合束后的信号光汇聚反射至第一光纤阵列;第一光纤支架,与所述第一透镜组件插接,用于固定所述第一光纤阵列。In a fifth aspect, an embodiment of the present application discloses an optical module device, comprising: a circuit board; a light emitting chip array, disposed on the circuit board, for emitting signal light of different wavelengths; a first collimating lens array, The first lens assembly is arranged on the light-emitting direction of the light emitting chip, and is used for condensing the signal light; the first lens assembly is covered above the collimating lens array, and forms a first accommodating cavity with the circuit board; wherein: the The top of the lens assembly is provided with a first reflection surface and a second converging reflection surface; the first reflection surface is an inclined surface; a third reflection surface is arranged on the inner upper wall of the first accommodating cavity, and the third reflection surface is a coating film the first reflective surface; the coating layer includes a plurality of filter film layers; the signal light enters the first lens component through different filter film layers, and passes through the first reflective surface and the Reflection and beam combining of the third reflecting surface; the second converging reflecting surface is arranged on one side of the first reflecting surface, and is used for converging and reflecting the combined signal light to the first optical fiber array; the first optical fiber A bracket is inserted into the first lens assembly for fixing the first optical fiber array.
第六方面,本申请还提供了一种光模块,包括:电路板;第二透镜组件,罩设于所述电路板上方,与所述电路板形成第二容纳腔;其中:所述透镜组件的顶端设置第四反射面和第五汇聚反射面;所述第四反射面为倾斜面;所述第二容纳腔内侧上壁设置第六反射面,所述第六反射面,与所述第四反射面平行设置;所述第六反射面包含多个滤波膜层;所述第五汇聚反射面用于将信号光汇聚反射,传送至所述第六反射面;再经所述第六反射 面与所述第四反射面配合分束、反射;光接收芯片阵列,设置于所述电路板上,用于接收不同波长的信号光;第二准直透镜阵列,设置于所述光接收芯片的入光方向上,用于汇聚所述信号光;所述第二透镜组件设置第二光纤固定孔,用于固定第二光纤阵列。In a sixth aspect, the present application further provides an optical module, including: a circuit board; a second lens assembly, which is covered and disposed above the circuit board and forms a second accommodating cavity with the circuit board; wherein: the lens assembly A fourth reflecting surface and a fifth converging reflecting surface are arranged at the top of the second accommodating cavity; the fourth reflecting surface is an inclined surface; Four reflecting surfaces are arranged in parallel; the sixth reflecting surface includes a plurality of filter film layers; the fifth converging reflecting surface is used for converging and reflecting the signal light and transmitting it to the sixth reflecting surface; The light-receiving chip array is arranged on the circuit board to receive signal light of different wavelengths; the second collimating lens array is arranged on the light-receiving chip The second lens assembly is provided with a second optical fiber fixing hole for fixing the second optical fiber array.
附图说明Description of drawings
为了更清楚地说明本申请的技术方案,下面将对实施例中所需要使用的附图作简单地介绍,显而易见地,对于本领域普通技术人员而言,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to illustrate the technical solutions of the present application more clearly, the accompanying drawings required in the embodiments will be briefly introduced below. Obviously, for those of ordinary skill in the art, without creative work, the Additional drawings can be obtained from these drawings.
图1为光通信终端连接关系示意图;Fig. 1 is a schematic diagram of the connection relationship of optical communication terminals;
图2为光网络单元结构示意图;Fig. 2 is a schematic diagram of the structure of an optical network unit;
图3为本申请实施例提供的一种光模块结构示意图;FIG. 3 is a schematic structural diagram of an optical module according to an embodiment of the present application;
图4为本申请实施例提供的一种光模块分解结构示意图;FIG. 4 is a schematic diagram of an exploded structure of an optical module provided by an embodiment of the present application;
图5为本申请实施例提供的一种光模块去除上壳体、下壳体及解锁部件后的结构示意图;5 is a schematic structural diagram of an optical module provided by an embodiment of the present application after removing the upper casing, the lower casing and the unlocking component;
图6为本申请实施例提供的一种光模块局部分解结构示意图;6 is a schematic diagram of a partially exploded structure of an optical module according to an embodiment of the present application;
图7为本申请实施例提供的光模块光发射过程局部光路图;FIG. 7 is a partial optical path diagram of an optical module light emission process provided by an embodiment of the present application;
图8为本申请实施例提供的一种第一透镜组件与第一准直透镜阵列结构示意图一;FIG. 8 is a first structural schematic diagram of a first lens assembly and a first collimating lens array according to an embodiment of the present application;
图9为本申请实施例提供的一种第一透镜组件与第一准直透镜阵列截面图一;9 is a cross-sectional view 1 of a first lens assembly and a first collimating lens array according to an embodiment of the present application;
图10为本申请实施例提供的一种第一准直透镜阵列的结构图一;10 is a structural diagram 1 of a first collimating lens array provided by an embodiment of the present application;
图11为本申请实施例提供的一种第一透镜组件与第一准直透镜阵列结构示意图二;FIG. 11 is a second structural schematic diagram of a first lens assembly and a first collimating lens array according to an embodiment of the application;
图12提供了一种第一透镜组件与第一准直透镜阵列截面图二;FIG. 12 provides a second cross-sectional view of a first lens assembly and a first collimating lens array;
图13为本申请实施例提供的一种第一准直透镜阵列的结构图二;FIG. 13 is a second structural diagram of a first collimating lens array according to an embodiment of the application;
图14为本申请实施例提供的一种第一透镜组件的立体图一;FIG. 14 is a perspective view 1 of a first lens assembly provided by an embodiment of the present application;
图15为本申请实施例提供的一种第一透镜组件的立体图二;FIG. 15 is a second perspective view of a first lens assembly according to an embodiment of the application;
图16为本申请实施例提供的一种第一透镜组件截面图一;16 is a cross-sectional view 1 of a first lens assembly provided by an embodiment of the application;
图17为本申请实施例提供的一种第一透镜组件结构分解示意图一;FIG. 17 is a schematic exploded schematic diagram 1 of a first lens assembly structure provided by an embodiment of the present application;
图18为本申请实施例提供的一种第一透镜组件截面图二;18 is a second cross-sectional view of a first lens assembly provided by an embodiment of the application;
图19为本申请实施例提供的一种第一透镜组件的主体结构示意图;FIG. 19 is a schematic diagram of the main body structure of a first lens assembly provided by an embodiment of the present application;
图20为本申请实施例提供的一种第一光纤阵列结构示意图一;FIG. 20 is a schematic structural diagram 1 of a first optical fiber array according to an embodiment of the present application;
图21为本申请实施例提供的一种第一光纤固定孔结构示意图;FIG. 21 is a schematic structural diagram of a first optical fiber fixing hole according to an embodiment of the application;
图22本申请实施例提供的一种第一光纤阵列结构示意图二;FIG. 22 is a second schematic structural diagram of a first optical fiber array provided by an embodiment of the present application;
图23为本申请实施例提供的一种第一透镜组件与光纤支架结构立体图一;23 is a perspective view one of the structure of a first lens assembly and an optical fiber support provided in an embodiment of the application;
图24为本申请实施例提供的一种第一透镜组件与光纤支架结构立体图二;24 is a second perspective view of the structure of a first lens assembly and an optical fiber support provided in an embodiment of the application;
图25为本申请实施例提供的一种第一透镜组件与光纤支架结构立体图三;FIG. 25 is a three-dimensional view of the structure of a first lens assembly and an optical fiber support provided in an embodiment of the application;
图26为本申请实施例提供的一种第二透镜组件与第二准直透镜阵列的分解结构图;26 is an exploded structural diagram of a second lens assembly and a second collimating lens array provided by an embodiment of the application;
图27为本申请实施例提供的又一种第二透镜组件与第二准直透镜阵列结构图;27 is a structural diagram of yet another second lens assembly and a second collimating lens array provided by an embodiment of the present application;
图28为本申请实施例提供的光模块光发接收过程局部光路图。FIG. 28 is a partial light path diagram of an optical module for light emission and reception according to an embodiment of the present application.
具体实施方式Detailed ways
为了使本技术领域的人员更好地理解本申请中的技术方案,下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部实施例。基于本申请中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都应当属于本申请保护的范围。In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described The embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the scope of protection of the present application.
光纤通信的核心环节之一是光、电信号的相互转换。光纤通信使用携带信息的光信号在光纤/光波导等信息传输设备中传输,利用光在光纤/光波导中的无源传输特性可以实现低成本、低损耗的信息传输;而计算机等信息处理设备使用的是电信号,为了在光纤/光波导等信息传输设备与计算机等信息处理设备之间建立信息连接,就需要实现电信号与光信号的相互转换。One of the core links of optical fiber communication is the mutual conversion of optical and electrical signals. Optical fiber communication uses information-carrying optical signals to transmit in information transmission equipment such as optical fibers/optical waveguides. The passive transmission characteristics of light in optical fibers/optical waveguides can realize low-cost, low-loss information transmission; while computers and other information processing equipment Electrical signals are used. In order to establish an information connection between information transmission equipment such as optical fibers/optical waveguides and information processing equipment such as computers, it is necessary to realize the mutual conversion of electrical signals and optical signals.
光模块在光纤通信技术领域中实现上述光、电信号的相互转换功能,光信号与电信号的相互转换是光模块的核心功能。光模块通过其内部电路板上的金手指实现与外部上位机之间的电连接,主要的电连接包括供电、I2C信号、数据信号以及接地等;采用金手指实现的电连接方式已经成为光模块行业的主流连接方式,以此为基础,金手指上引脚的定义形成了多种行业协议/规范。The optical module realizes the mutual conversion function of the above-mentioned optical and electrical signals in the technical field of optical fiber communication, and the mutual conversion of the optical signal and the electrical signal is the core function of the optical module. The optical module realizes the electrical connection with the external host computer through the gold finger on its internal circuit board. The main electrical connections include power supply, I2C signal, data signal and grounding, etc. The electrical connection method realized by the gold finger has become the optical module. The mainstream connection method of the industry, based on this, the definition of pins on the gold finger has formed a variety of industry protocols/norms.
图1为光通信终端连接关系示意图。如图1所示,光通信终端的连接主要包括光网络终端100、光模块200、光纤101及网线103之间的相互连接;FIG. 1 is a schematic diagram of a connection relationship of an optical communication terminal. As shown in FIG. 1 , the connection of the optical communication terminal mainly includes the interconnection between the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;
光纤101的一端连接远端服务器,网线103的一端连接本地信息处理设备,本地信息处理设备与远端服务器的连接由光纤101与网线103的连接完成;而光纤101与网线103之间的连接由具有光模块200的光网络终端100完成。One end of the optical fiber 101 is connected to the remote server, and one end of the network cable 103 is connected to the local information processing device. The connection between the local information processing device and the remote server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by The optical network terminal 100 with the optical module 200 is completed.
光模块200的光口对外接入光纤101,与光纤101建立双向的光信号连接;光模块200的电口对外接入光网络终端100中,与光网络终端100建立双向的电信号连接;在光模块内部实现光信号与电信号的相互转换,从而实现在光纤与光网络终端之间建立信息连接;在本申请的某一实施例中,来自光纤的光信号由光模块转换为电信号后输入至光网络终端100中,来自光网络终端100的电信号由光模块转换为光信号输入至光纤中。The optical port of the optical module 200 is externally connected to the optical fiber 101, and a two-way optical signal connection is established with the optical fiber 101; the electrical port of the optical module 200 is externally connected to the optical network terminal 100, and a two-way electrical signal connection is established with the optical network terminal 100; The optical module realizes mutual conversion between optical signals and electrical signals, so as to establish an information connection between the optical fiber and the optical network terminal; in an embodiment of the present application, after the optical signal from the optical fiber is converted into an electrical signal by the optical module Input to the optical network terminal 100, the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input into the optical fiber.
光网络终端具有光模块接口102,用于接入光模块200,与光模块200建立双向的电信号连接;光网络终端具有网线接口104,用于接入网线103,与网线103建立双向的电信号连接;光模块200与网线103之间通过光网络终端100建立连接,在本申请的某一实施例中,光网络终端将来自光模块的信号传递给网线,将来自网线的信号传递给光模块,光网络终端作为光模块的上位机监控光模块的工作。The optical network terminal has an optical module interface 102, which is used to access the optical module 200 and establish a two-way electrical signal connection with the optical module 200; Signal connection; a connection is established between the optical module 200 and the network cable 103 through the optical network terminal 100. In an embodiment of the present application, the optical network terminal transmits the signal from the optical module to the network cable, and transmits the signal from the network cable to the optical network terminal. The optical network terminal acts as the host computer of the optical module to monitor the work of the optical module.
至此,远端服务器通过光纤、光模块、光网络终端及网线,与本地信息处理设备之间建立双向的信号传递通道。So far, the remote server has established a two-way signal transmission channel with the local information processing equipment through optical fibers, optical modules, optical network terminals and network cables.
常见的信息处理设备包括路由器、交换机、电子计算机等;光网络终端是光模块的上位机,向光模块提供数据信号,并接收来自光模块的数据信号,常见的光模块上位机还有光线路终端等。Common information processing equipment includes routers, switches, electronic computers, etc.; the optical network terminal is the host computer of the optical module, providing data signals to the optical module and receiving data signals from the optical module. Common optical module host computers and optical lines terminal etc.
图2为光网络终端结构示意图。如图2所示,在光网络终端100中具有电路板105, 在电路板105的表面设置笼子106;在笼子106内部设置有电连接器,用于接入金手指等光模块电口;在笼子106上设置有散热器107,散热器107具有增大散热面积的翅片等凸起部。FIG. 2 is a schematic structural diagram of an optical network terminal. As shown in FIG. 2, the optical network terminal 100 has a circuit board 105, and a cage 106 is arranged on the surface of the circuit board 105; an electrical connector is arranged inside the cage 106 for connecting to the electrical port of an optical module such as a gold finger; The cage 106 is provided with a radiator 107 , and the radiator 107 has raised portions such as fins that increase the heat dissipation area.
光模块200插入光网络终端中,光模块的电口插入笼子106内部的电连接器,光模块的光口与光纤101连接。The optical module 200 is inserted into the optical network terminal, the electrical port of the optical module is inserted into the electrical connector inside the cage 106 , and the optical port of the optical module is connected to the optical fiber 101 .
笼子106位于电路板上,将电路板上的电连接器包裹在笼子中,从而使笼子内部设置有电连接器;光模块插入笼子中,由笼子固定光模块,光模块产生的热量传导给笼子106,然后通过笼子上的散热器107进行扩散。The cage 106 is located on the circuit board, and the electrical connectors on the circuit board are wrapped in the cage, so that the interior of the cage is provided with electrical connectors; the optical module is inserted into the cage, the optical module is fixed by the cage, and the heat generated by the optical module is conducted to the cage. 106 and then diffuse through a heat sink 107 on the cage.
图3为本申请实施例提供的一种光模块结构示意图,图4为本申请实施例提供光模块分解结构示意图。如图3、图4所示,本申请实施例提供的光模块200包括上壳体201、下壳体202、解锁部件203、电路板300及光收发器件。FIG. 3 is a schematic structural diagram of an optical module provided by an embodiment of the present application, and FIG. 4 is a schematic structural diagram of an exploded optical module provided by an embodiment of the present application. As shown in FIG. 3 and FIG. 4 , the optical module 200 provided in this embodiment of the present application includes an upper casing 201 , a lower casing 202 , an unlocking component 203 , a circuit board 300 , and an optical transceiver device.
上壳体201盖合在下壳体202上,以形成具有两个开口的包裹腔体;包裹腔体的外轮廓一般呈现方形体,在本申请的某一实施例中,下壳体包括主板以及位于主板两侧、与主板垂直设置的两个侧板;上壳体包括盖板,盖板盖合在上壳体的两个侧板上,以形成包裹腔体;上壳体还可以包括位于盖板两侧、与盖板垂直设置的两个侧壁,由两个侧壁与两个侧板结合,以实现上壳体盖合在下壳体上。The upper casing 201 is covered with the lower casing 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity generally presents a square body. Two side plates are located on both sides of the main board and are vertically arranged with the main board; the upper shell includes a cover plate, and the cover plate is closed on the two side plates of the upper shell to form a wrapping cavity; the upper shell can also include a The two side walls on both sides of the cover plate and the two side walls vertically arranged with the cover plate are combined with the two side plates to realize that the upper casing is covered on the lower casing.
两个开口具体可以是在同一方向的两端开口(204、205),也可以是在不同方向上的两处开口;其中一个开口为电口204,电路板的金手指从电口204伸出,插入光网络终端等上位机中;另一个开口为光口205,用于外部光纤接入以连接光模块内部的光收发器件;电路板300、光收发器件等光电器件位于包裹腔体中。Specifically, the two openings may be openings (204, 205) at both ends in the same direction, or may be two openings in different directions; one of the openings is an electrical port 204, and the gold fingers of the circuit board protrude from the electrical port 204. , inserted into a host computer such as an optical network terminal; the other opening is an optical port 205, which is used for external optical fiber access to connect the optical transceiver devices inside the optical module; the circuit board 300, optical transceiver devices and other optoelectronic devices are located in the package cavity.
采用上壳体、下壳体结合的装配方式,便于将电路板300、光收发器件等器件安装到壳体中,由上壳体、下壳体形成光模块最外层的封装保护壳体;上壳体及下壳体一般采用金属材料,利于实现电磁屏蔽以及散热;一般不会将光模块的壳体做成一体部件,这样在装配电路板等器件时,定位部件、散热以及电磁屏蔽部件无法安装,也不利于生产自动化。The combination of the upper casing and the lower casing is adopted, which facilitates the installation of the circuit board 300, the optical transceiver and other components into the casing, and the upper casing and the lower casing form the outermost encapsulation protection casing of the optical module; The upper casing and the lower casing are generally made of metal materials, which are conducive to electromagnetic shielding and heat dissipation; generally, the casing of the optical module is not made into an integral part, so that when assembling circuit boards and other devices, positioning parts, heat dissipation and electromagnetic shielding parts It cannot be installed and is not conducive to production automation.
解锁部件203位于包裹腔体/下壳体202的外壁,用于实现光模块与上位机之间的固定连接,或解除光模块与上位机之间的固定连接。The unlocking part 203 is located on the outer wall of the enclosing cavity/lower casing 202, and is used to realize the fixed connection between the optical module and the upper computer, or to release the fixed connection between the optical module and the upper computer.
解锁部件203具有与上位机笼子匹配的卡合部件;拉动解锁部件的末端可以在使解锁部件在外壁的表面相对移动;光模块插入上位机的笼子里,由解锁部件的卡合部件将光模块固定在上位机的笼子里;通过拉动解锁部件,解锁部件的卡合部件随之移动,进而改变卡合部件与上位机的连接关系,以解除光模块与上位机的卡合关系,从而可以将光模块从上位机的笼子里抽出。The unlocking part 203 has an engaging part matched with the cage of the upper computer; pulling the end of the unlocking part can make the unlocking part move relatively on the surface of the outer wall; the optical module is inserted into the cage of the upper computer, and the optical module is moved by the engaging part of the unlocking part. It is fixed in the cage of the upper computer; by pulling the unlocking part, the engaging part of the unlocking part moves with it, thereby changing the connection relationship between the engaging part and the upper computer, so as to release the engaging relationship between the optical module and the upper computer, so that the The optical module is pulled out from the cage of the host computer.
电路板300上设置有光发射芯片、光发射芯片的驱动芯片、光接收芯片、跨阻放大芯片、限幅放大芯片及微处理器芯片等,其中光发射芯片与光接收芯片直接贴装在光模块的电路板上,此种形态业内称为COB(chip on board)封装。The circuit board 300 is provided with a light-emitting chip, a driving chip for the light-emitting chip, a light-receiving chip, a transimpedance amplifying chip, a limiting amplifying chip, a microprocessor chip, etc., wherein the light-emitting chip and the light-receiving chip are directly mounted on the light-emitting chip. On the circuit board of the module, this form is called COB (chip on board) package in the industry.
电路板通过电路走线将光模块中的用电器件按照电路设计连接在一起,以实现供电、电信号传输及接地等电功能。The circuit board connects the electrical components in the optical module according to the circuit design through the circuit wiring, so as to realize the electrical functions such as power supply, electrical signal transmission and grounding.
电路板一般为硬性电路板,硬性电路板由于其相对坚硬的材质,还可以实现承载作用, 如硬性电路板可以平稳的承载芯片;当光收发器件位于电路板上时,硬性电路板也可以提供平稳的承载;硬性电路板还可以插入上位机笼子中的电连接器中,在本申请的某一实施例中,在硬性电路板的一侧末端表面形成金属引脚/金手指,用于与电连接器连接;这些都是柔性电路板不便于实现的。The circuit board is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the bearing function. For example, the rigid circuit board can carry the chip smoothly; when the optical transceiver is located on the circuit board, the rigid circuit board can also provide Stable bearing; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage. In an embodiment of the present application, metal pins/gold fingers are formed on one end surface of the rigid circuit board for connecting with Electrical connector connections; these are inconvenient to implement with flexible circuit boards.
光收发器件包括光发射部件及光接收部件两部分,分别用于实现光信号的发射与光信号的接收。光发射部件及光接收部件可以结合在一起,也可以相互独立。本申请主要以光发射部件为例进行介绍。The optical transceiver device includes two parts, an optical emitting part and an optical receiving part, which are respectively used to realize the transmission of optical signals and the reception of optical signals. The light-emitting part and the light-receiving part may be combined together, or may be independent of each other. This application mainly takes the light emitting component as an example for introduction.
图5为本申请实施例提供的光模块去除上壳体、下壳体及解锁部件后的结构示意图。结构示意图。如图6所示,为本申请实施例提供的一种光模块局部分解结构示意图。FIG. 5 is a schematic structural diagram of the optical module provided by the embodiment of the present application after removing the upper casing, the lower casing and the unlocking part. Schematic. As shown in FIG. 6 , a schematic diagram of a partially exploded structure of an optical module provided by an embodiment of the present application is shown.
如图5所示,光发射芯片阵列310设置于电路板300上,用于发射不同波长的信号光。在本申请的某一实施例中,在本实施例中光发射芯片阵列310沿电路板300长度方向定义为行;沿电路板300长度方向定义为列。为实现不同波长的光线的合束,同一行设置多个不同波长的光发射芯片,本申请以4个为例;同一列可以是不波长的光发射芯片,也可以设置相同波长的光发射芯片。光发射芯片阵列310的列数可是1列、2列、3列或4列,具体可根据光模块实际需要进行设置。本实施例中,光发射芯片阵列310设置为4行4阵列模式。As shown in FIG. 5 , the light emitting chip array 310 is disposed on the circuit board 300 for emitting signal light of different wavelengths. In an embodiment of the present application, in this embodiment, the light emitting chip array 310 is defined as a row along the length direction of the circuit board 300 ; and as a column along the length direction of the circuit board 300 . In order to realize the combination of light of different wavelengths, a plurality of light-emitting chips of different wavelengths are arranged in the same row, and this application takes 4 as an example; the same column can be light-emitting chips of different wavelengths, or light-emitting chips of the same wavelength can be set . The number of columns of the light emitting chip array 310 may be 1 column, 2 columns, 3 columns or 4 columns, which may be set according to actual needs of the optical module. In this embodiment, the light emitting chip array 310 is set in a 4-row 4-array mode.
在本申请的某一实施例中,如图6所示,为本申请实施例提供的一种光模块局部分解结构示意图。在一些实施例中,本申请实施例提供的一种光模块中,第一透镜组件400与电路板300形成包裹光芯片组件的第一容纳腔内,从电路板300向第一透镜组件400方向依次设置光发射芯片阵列310和第一准直透镜阵列320。In an embodiment of the present application, as shown in FIG. 6 , a schematic diagram of a partially exploded structure of an optical module provided in an embodiment of the present application. In some embodiments, in the optical module provided by the embodiments of the present application, the first lens assembly 400 and the circuit board 300 form a first receiving cavity that wraps the optical chip assembly, and the direction from the circuit board 300 to the first lens assembly 400 is The light emitting chip array 310 and the first collimating lens array 320 are arranged in sequence.
第一准直透镜组件320罩设在光发射芯片阵列310的上方,第一准直透镜阵列320的透镜数量取决于光发射芯片阵列310中的芯片数量。通常第一准直透镜组件320的透镜数量等于光发射芯片阵列310中的芯片数量。为实现第一准直透镜组件320的安装,第一准直透镜阵列320设置准直透镜支架,准直透镜支架与电路板300连接固定。The first collimating lens assembly 320 is covered above the light emitting chip array 310 , and the number of lenses in the first collimating lens array 320 depends on the number of chips in the light emitting chip array 310 . Generally, the number of lenses of the first collimating lens assembly 320 is equal to the number of chips in the light emitting chip array 310 . In order to realize the installation of the first collimating lens assembly 320 , the first collimating lens array 320 is provided with a collimating lens bracket, and the collimating lens bracket is connected and fixed to the circuit board 300 .
图7为本申请实施例提供的光模块光发射过程局部光路图,结合图7所示,光发射芯片阵列310发出的信号光为分散光,经第一准直透镜阵列320后形成平行光束,照射到第一透镜组件400。本实施例中第一准直透镜阵列320为4行4列,行与列的设定与光发射芯片阵列的行与列的方向一致。FIG. 7 is a partial light path diagram of the light emission process of the optical module provided by the embodiment of the present application. With reference to FIG. 7 , the signal light emitted by the light emission chip array 310 is scattered light, and after passing through the first collimating lens array 320, a parallel light beam is formed, The first lens assembly 400 is illuminated. In this embodiment, the first collimating lens array 320 has 4 rows and 4 columns, and the setting of the rows and columns is consistent with the directions of the rows and columns of the light emitting chip array.
第一透镜组件400设置在电路板300上,采用罩设式的方式设置在光发射芯片阵列的上方,第一透镜组件400与电路板300形成包裹光发射芯片阵列的第一容纳腔。光发射芯片阵列发出的信号光经第一透镜组件反射汇聚后进入光纤阵列中,第一透镜组件不仅起到密封光芯片的作用,同时也建立了光芯片与光纤之间的光连接。第一透镜组件用于传输光束并在传输过程中改变光束传输方向。在使用中:光发射芯片阵列中光发射芯片发出的光经第一透镜组件传输并反射后进入光纤中第一透镜组件不仅起到密封光芯片的作用,同时也建立了光发射芯片与光纤之间的光连接。The first lens assembly 400 is disposed on the circuit board 300, and is disposed above the light emitting chip array in a cover-up manner. The first lens assembly 400 and the circuit board 300 form a first accommodating cavity for wrapping the light emitting chip array. The signal light emitted by the light emitting chip array is reflected and concentrated by the first lens assembly and then enters the optical fiber array. The first lens assembly not only plays the role of sealing the optical chip, but also establishes the optical connection between the optical chip and the optical fiber. The first lens assembly is used to transmit the light beam and change the transmission direction of the light beam during the transmission process. In use: the light emitted by the light emitting chip in the light emitting chip array is transmitted and reflected by the first lens assembly and then enters the optical fiber. optical connection between.
高速率数据传输要求光芯片及其驱动/匹配芯片之间近距离设置,以缩短芯片之间的连线、减小连线造成的信号损失,而第一透镜组件400罩设在光芯片的上方,所以第一透镜 组件一般将光芯片及其驱动/匹配芯片同时罩设住。所以光发射芯片与光发射芯片的驱动芯片近距离设置,第一透镜组件罩设光发射芯片与光发射芯片的驱动芯片;光接收芯片与跨阻放大芯片近距离设置,第一透镜组件罩设光接收芯片与跨阻放大芯片。High-speed data transmission requires close proximity between the optical chip and its driver/matching chip, so as to shorten the connection between the chips and reduce the signal loss caused by the connection, and the first lens assembly 400 is covered above the optical chip. , so the first lens assembly generally covers the optical chip and its driving/matching chip at the same time. Therefore, the light emitting chip and the driving chip of the light emitting chip are arranged close to each other, and the first lens assembly covers the light emitting chip and the driving chip of the light emitting chip; the light receiving chip and the transimpedance amplifying chip are arranged close to each other, and the first lens assembly covers the Light receiving chip and transimpedance amplifying chip.
每个光芯片的尺寸一般很小,而光芯片的驱动/匹配芯片的尺寸一般很大,特别是实现100G以上速率的驱动/匹配芯片,而第一透镜组件的尺寸有限,光芯片及其驱动/匹配芯片的设置位置存在一定的限制,没有太多的空间自由度。The size of each optical chip is generally small, and the size of the driver/matching chip of the optical chip is generally large, especially the driver/matching chip that achieves a rate of more than 100G, while the size of the first lens assembly is limited, the optical chip and its driver There are certain restrictions on the setting position of the /matching chip, and there is not much spatial freedom.
在本申请的某一实施例中,图8提供了一种第一透镜组件与第一准直透镜阵列结构示意图一。图9提供了一种第一透镜组件与第一准直透镜阵列截面图一,图10为一种第一准直透镜阵列的结构图一。结合图8、图9和图10所示,第一准直透镜阵列320为支座式结构。第一透镜组件400罩设于电路板300上方,第一透镜组件400与电路板300组装后形成密闭的腔体,第一准直透镜阵列320与光发射芯片阵列310设置于腔体内。In an embodiment of the present application, FIG. 8 provides a first structural schematic diagram of a first lens assembly and a first collimating lens array. FIG. 9 provides a first cross-sectional view of a first lens assembly and a first collimating lens array, and FIG. 10 is a first structural view of a first collimating lens array. As shown in FIG. 8 , FIG. 9 and FIG. 10 , the first collimating lens array 320 is a support-type structure. The first lens assembly 400 is covered above the circuit board 300 . The first lens assembly 400 and the circuit board 300 are assembled to form a closed cavity. The first collimating lens array 320 and the light emitting chip array 310 are disposed in the cavity.
在本申请的某一实施例中,支座式结构可如图所示,包括对称设置的支柱和设置于支柱之间的平板,平板上设置准直透镜。平板可设置于支柱的顶端,支柱的另一端与电路板300固定连接,使得第一准直透镜阵列320与电路板300之间形成一定的空隙,为光发射芯片阵列310的设置留有空间。In a certain embodiment of the present application, the support-type structure may be as shown in the figure, including pillars arranged symmetrically and a flat plate arranged between the pillars, and a collimating lens is arranged on the flat plate. The flat plate can be disposed on the top of the pillar, and the other end of the pillar is fixedly connected to the circuit board 300 , so that a certain gap is formed between the first collimating lens array 320 and the circuit board 300 , leaving space for the arrangement of the light emitting chip array 310 .
支座式结构可以是分体式结构,也可以是一体式结构。为了装配过程方便简单,避免出现准直透镜与光芯片光路不对应,第一准直透镜阵列320为一体成型结构,保证第一准直透镜阵列320与电路板300之间距离大小,同时可保证平板与支柱之间的位置保持准确,避免人员安装过程中的误差,有利于提高整个光模块光路的稳定性。The support structure can be a split structure or an integrated structure. In order to facilitate the assembly process and avoid the mismatch between the collimating lens and the optical path of the optical chip, the first collimating lens array 320 is integrally formed to ensure the distance between the first collimating lens array 320 and the circuit board 300, and at the same time to ensure The position between the flat plate and the pillar is kept accurate to avoid errors during installation by personnel, which is beneficial to improve the stability of the optical path of the entire optical module.
图11提供了一种第一透镜组件与第一准直透镜阵列结构示意图二。图12提供了一种第一透镜组件与第一准直透镜阵列截面图二;图13为一种第一准直透镜阵列的结构图二。FIG. 11 provides a second structural schematic diagram of a first lens assembly and a first collimating lens array. FIG. 12 provides a second cross-sectional view of a first lens assembly and a first collimating lens array; FIG. 13 is a second structural view of a first collimating lens array.
结合图11、图12和图13所示,第一准直透镜阵列320为平板式结构,第一透镜组件400的底端具有第一承载面423和第二承载面422。第一承载面423用于承载第一准直透镜阵列320的一端,第二承载面422用于承载第一准直透镜阵列320的另一端。第一准直透镜阵列320中透镜的位置与光芯片位置对应,并不一定设置于第一准直透镜阵列的中心位置。11 , 12 and 13 , the first collimating lens array 320 is a flat plate structure, and the bottom end of the first lens assembly 400 has a first bearing surface 423 and a second bearing surface 422 . The first bearing surface 423 is used for bearing one end of the first collimating lens array 320 , and the second bearing surface 422 is used for bearing the other end of the first collimating lens array 320 . The positions of the lenses in the first collimating lens array 320 correspond to the positions of the optical chips, and are not necessarily arranged at the center of the first collimating lens array.
第一准直透镜阵列320的平板式结构可以设为横置的工字形,两端横置于相应的承载面上,工字形平板中间的主体板表面设有多个准直透镜,多个准直透镜以阵列的形式设于主体板的表面。The flat-panel structure of the first collimating lens array 320 can be set as a horizontal I-shape, and both ends are placed horizontally on the corresponding bearing surface. The straight lenses are arranged on the surface of the main body plate in the form of an array.
在本申请的某一实施例中,为了方便第一准直透镜阵列320与第一透镜组件400的组装,第一透镜组件400的第一承载面423和第二承载面422与第一透镜组件400的侧面连通,使得第一透镜组件400与电路板300组装后形成的包裹腔体并不是完全密封的,在第一透镜组件400的侧面设置一个开口,第一准直透镜阵列320可在开口位置从第一透镜组件400的外部向内部插入连接。In an embodiment of the present application, in order to facilitate the assembly of the first collimating lens array 320 and the first lens assembly 400, the first bearing surface 423 and the second bearing surface 422 of the first lens assembly 400 and the first lens assembly The side of the first lens assembly 400 is connected, so that the package cavity formed after the first lens assembly 400 is assembled with the circuit board 300 is not completely sealed, an opening is provided on the side of the first lens assembly 400, and the first collimating lens array 320 The position is inserted from the outside of the first lens assembly 400 to the inside.
图14为本申请实施例提供的一种第一透镜组件的立体图一;图15为本申请实施例提供的一种第一透镜组件的立体图二;图16为本申请实施例提供的第一透镜组件截面图一;图17为本申请实施例提供的第一透镜组件分解示意图一。14 is a perspective view 1 of a first lens assembly provided by an embodiment of the application; FIG. 15 is a perspective view 2 of a first lens assembly provided by an embodiment of the application; FIG. 16 is a first lens provided by an embodiment of the application Component sectional view 1; FIG. 17 is an exploded schematic view 1 of the first lens component provided by the embodiment of the application.
结合图14和图15所示,第一透镜组件400包括:第一反射面411、第二汇聚反射面412、第三反射面413、第一光纤固定孔414。其中,第一反射面411和第二汇聚反射面412设置于第一透镜组件400的顶端上表面。第一反射面411为倾斜面,且与第一透镜组件400的上表面倾斜角度保持一致。14 and 15 , the first lens assembly 400 includes: a first reflection surface 411 , a second converging reflection surface 412 , a third reflection surface 413 , and a first optical fiber fixing hole 414 . The first reflecting surface 411 and the second converging reflecting surface 412 are disposed on the top surface of the first lens assembly 400 . The first reflection surface 411 is an inclined surface, and the inclination angle of the upper surface of the first lens assembly 400 is consistent with that of the first reflection surface 411 .
第一容纳腔内侧上壁设置第三反射面413,第三反射面413为镀膜层,与第一反射面411平行设置。信号光经镀膜层不同位置进入第三反射面143,再经过第一反射面411反射向第三反射面413,实现不同波长的信号光的合束。镀膜层设置多个滤波膜层,不同波长的信号光由不同的滤波膜层射入第一透镜组件400。A third reflective surface 413 is provided on the inner upper wall of the first accommodating cavity. The third reflective surface 413 is a coating layer and is arranged parallel to the first reflective surface 411 . The signal light enters the third reflective surface 143 through different positions of the coating layer, and is then reflected toward the third reflective surface 413 through the first reflective surface 411 to realize the beam combining of signal lights of different wavelengths. The coating layer is provided with a plurality of filter film layers, and signal lights of different wavelengths are injected into the first lens assembly 400 through different filter film layers.
滤波膜层的排列方式与光发射芯片的排列方式对应,实现不同波长的光线的合束。例如光发射芯片阵列中的同一行设置4个不同波长的光发射芯片,则镀膜层需设置相对应的4个不同的滤波膜层。在本申请的某一实施例中,如果光发射芯片阵列中同一列是相同波长的光发射芯片,则滤波膜层同一列为相同的子膜层,也可以是覆盖整个列方向上的一整个膜层。如果光发射芯片阵列中同一列是不同波长的光发射芯片,则滤波膜层同一列为不相同的子膜层。通常情况下,为简化生产过程,光发射芯片阵列中同一列设置相同波长的光发射芯片。如图16所示,第二汇聚反射面412为倾斜面,设置有弧形凸起部,且弧形凸起部向第一透镜组件400的外侧凸起,第二汇聚反射面412设置于第一反射面411远离电路板300的一端的一侧,且第二汇聚反射面412设置弧形凸起。第二汇聚反射面412设置于第一反射面411与第一光纤固定孔414之间,用于合束后的信号光在第二汇聚反射面412和第一光纤阵列500之间的传输。本申请中的第二汇聚反射面表面为弧形,这样可以使第二汇聚反射面420具备汇聚功能,不需要再设置额外的汇聚透镜。The arrangement of the filter film layers corresponds to the arrangement of the light emitting chips, so as to realize the beam combining of light of different wavelengths. For example, if 4 light emitting chips with different wavelengths are arranged in the same row in the light emitting chip array, the coating layer needs to be arranged with corresponding 4 different filter film layers. In an embodiment of the present application, if the same column of the light-emitting chip array is the light-emitting chip with the same wavelength, the filter film layer in the same column is the same sub-film layer, or a whole column covering the entire column direction. film layer. If the same column of the light emitting chip array is the light emitting chips of different wavelengths, the same column of the filter film layer has different sub-film layers. Usually, in order to simplify the production process, light emitting chips of the same wavelength are arranged in the same column in the light emitting chip array. As shown in FIG. 16 , the second converging reflection surface 412 is an inclined surface, and is provided with an arc-shaped convex portion, and the arc-shaped convex portion protrudes toward the outside of the first lens assembly 400 , and the second converging and reflecting surface 412 is disposed on the first lens assembly 400 . A reflective surface 411 is away from one side of one end of the circuit board 300 , and the second converging reflective surface 412 is provided with an arc-shaped protrusion. The second converging reflection surface 412 is disposed between the first reflecting surface 411 and the first optical fiber fixing hole 414 for transmission of the combined signal light between the second converging reflection surface 412 and the first optical fiber array 500 . The surface of the second converging and reflecting surface in the present application is arc-shaped, so that the second converging and reflecting surface 420 can have a converging function, and no additional converging lens is required.
结合图7所示,在光发射器件中,光发射芯片阵列310为多个激光器。本申请实施例以一行光发射芯片4个为例,激光器发出的四个波长的信号光,经第一准直透镜组件320汇聚为平行光。四束平行光分别在第三反射面413不同的滤波膜层入射,配合第一反射面411,多次反射后,四束平行光束一同入射到第二汇聚反射面412,第二汇聚反射面412将光束反射、汇聚后向第一光纤阵列500传输,光纤孔位置与光束汇聚光斑位置吻合,保证光斑可以到达第一光纤阵列,完成光的耦合和传输。With reference to FIG. 7 , in the light emitting device, the light emitting chip array 310 is a plurality of lasers. The embodiment of the present application takes a row of four light emitting chips as an example, and the signal light of four wavelengths emitted by the laser is condensed into parallel light through the first collimating lens assembly 320 . The four parallel light beams are respectively incident on different filter film layers of the third reflecting surface 413, and cooperate with the first reflecting surface 411. After multiple reflections, the four parallel light beams are incident on the second converging reflecting surface 412, and the second converging reflecting surface 412 The light beam is reflected and converged and transmitted to the first optical fiber array 500, and the position of the optical fiber hole matches the position of the light beam converging spot to ensure that the spot can reach the first optical fiber array to complete the coupling and transmission of light.
第一激光器311发射的第一出射光线波长为,第二激光器312发射的第二出射光线波长为,第三激光器313发射的第三出射光线波长为,第四激光器314发射的第四出射光线波长为。第三反射面413设置第一滤波膜层4131、第二滤波膜层4132、第三滤波膜层4133、第四滤波膜层4134,分别仅允许对应波长的光束通过,而对其他波长的光束进行反射。The wavelength of the first light emitted by the first laser 311 is , the wavelength of the second light emitted by the second laser 312 is , the wavelength of the third light emitted by the third laser 313 is for. The third reflective surface 413 is provided with a first filter film layer 4131, a second filter film layer 4132, a third filter film layer 4133, and a fourth filter film layer 4134, which respectively allow only the light beams of the corresponding wavelengths to pass through, while the light beams of other wavelengths are filtered. reflection.
第一出射光线经第一准直透镜阵列320汇聚后形成平行光束,到达第一滤波膜层4131,第一滤波膜层4131能够允许波长为的光通过。第一出射光线在第一滤波膜层4131发生轻微折射后向第一反射面411传输,经第一反射面411反射后传输向第二滤波膜层4132,并在第二滤波膜层4132发生第二次反射。The first outgoing light rays are converged by the first collimating lens array 320 to form a parallel beam, and reach the first filter film layer 4131 , which can allow light with a wavelength of 100 Å to pass through. The first outgoing light is slightly refracted in the first filter film layer 4131 and then transmitted to the first reflection surface 411 , reflected by the first reflection surface 411 and transmitted to the second filter film layer 4132 , and the second filter film layer 4132 occurs. secondary reflection.
第二激光器312发射的第二出射光线波长为,第二出射光线经第一准直透镜组件320准直后形成平行光束,到达第二滤波膜层4132,第二滤波膜层4132能够允许波长为的光通过。进入第一透镜组件400后第二出射光线与第一出射光线进行第一次合束,形成一次 合束光线。而后,依据光路图所示,依次与第三出射光线、第四出射光线合束,形成最终合束光线。The second outgoing light emitted by the second laser 312 has a wavelength of light passes through. After entering the first lens assembly 400, the second outgoing light and the first outgoing light are combined for the first time to form a combined light. Then, according to the light path diagram, it is sequentially combined with the third outgoing light and the fourth outgoing light to form a final combined light.
最终合束光线经第二汇聚反射面412反射、汇聚后,向第一光纤阵列500传输。为提高光线耦合精度,第一光纤阵列500的端面设置于第二汇聚反射面412的汇聚焦点位置,且第一光纤阵列500的中心线与第二汇聚反射面412的中心光线重合。信号光线最终生成的一束信号光传输至第二汇聚反射面420后,经过第二汇聚反射面420反射后汇聚至第一光纤阵列中。After the final combined light beam is reflected and converged by the second converging reflection surface 412 , it is transmitted to the first optical fiber array 500 . In order to improve the light coupling precision, the end face of the first fiber array 500 is set at the converging focus position of the second converging reflection surface 412 , and the center line of the first fiber array 500 coincides with the center light of the second converging reflection surface 412 . After the signal light finally generated by the signal light is transmitted to the second converging reflection surface 420 , it is reflected by the second converging and reflecting surface 420 and then condensed into the first optical fiber array.
在本申请的某一实施例中,为实现光线在第一反射面与第三反射面之间的多次反射可将光线依次传输,第一反射面411为全反射面。In an embodiment of the present application, in order to realize multiple reflections of light between the first reflection surface and the third reflection surface, the light can be transmitted in sequence, and the first reflection surface 411 is a total reflection surface.
第三反射面的倾斜角度与第一透镜组件400的顶板的倾斜角度一致,角度大小与不同波长光芯片的间距有关系,一般在4-17°之间。The inclination angle of the third reflection surface is consistent with the inclination angle of the top plate of the first lens assembly 400 , and the angle is related to the spacing between optical chips of different wavelengths, and is generally between 4° and 17°.
在一些实施例中,为实现光束在第一准直透镜阵列320和第二汇聚反射面412之间的传输,第一反射面411与电路板300平面设置一定夹角,光束通过多次反射,实现光束在第一准直透镜阵列320和第二汇聚反射面412之间的传输。In some embodiments, in order to realize the transmission of the light beam between the first collimating lens array 320 and the second converging reflecting surface 412, a certain angle is set between the first reflecting surface 411 and the plane of the circuit board 300, and the light beam passes through multiple reflections, The transmission of light beams between the first collimating lens array 320 and the second converging reflection surface 412 is realized.
在本申请的某一实施例中,图18提供了一种第一透镜组件结构分解示意图二;图19提供了一种第一透镜组件的主体结构示意图。如图18和图19所示所示,第一透镜组件400包括:支撑体420和主体410。主体410设置第一反射面411、第二汇聚反射面412、第三反射面413、第一光纤固定孔414、第一空腔440。其中,第一反射面411和第二汇聚反射面412设置于主体410的上表面。第一反射面411为倾斜面,且与主体410的上表面倾斜角度保持一致。In an embodiment of the present application, FIG. 18 provides a second schematic exploded view of the structure of a first lens assembly; FIG. 19 provides a schematic diagram of the main structure of a first lens assembly. As shown in FIGS. 18 and 19 , the first lens assembly 400 includes a support body 420 and a main body 410 . The main body 410 is provided with a first reflecting surface 411 , a second converging reflecting surface 412 , a third reflecting surface 413 , a first optical fiber fixing hole 414 , and a first cavity 440 . The first reflecting surface 411 and the second converging reflecting surface 412 are disposed on the upper surface of the main body 410 . The first reflection surface 411 is an inclined surface, and the inclination angle of the upper surface of the main body 410 is the same.
支撑体420罩设于电路板300上,与主体410插接固定。支撑体420可以是一个由四个支架首尾相连,围合而成的内部中空的长方形柱体。支撑体420设置多个固定孔421。主体410的底面设置多个定位柱415,固定孔421与定位柱415位置、尺寸相匹配,实现固定孔421与定位柱415插接。The support body 420 is covered on the circuit board 300 and is inserted and fixed with the main body 410 . The support body 420 may be a rectangular cylinder with a hollow interior formed by four brackets connected end to end and enclosed. The support body 420 is provided with a plurality of fixing holes 421 . The bottom surface of the main body 410 is provided with a plurality of positioning columns 415 , and the fixing holes 421 match the positions and sizes of the positioning columns 415 to realize the insertion of the fixing holes 421 and the positioning columns 415 .
在本申请的某一实施例中,支撑体420上可设置两个固定孔421,分别位于支撑体420的斜对角。为方便主体410与支撑体420之间的装配连接以及装配后的稳定性,主体410与支撑体420的连接面为与电路板300平行设置的平面。则,主体410形成第一空腔440。在本申请的某一实施例中,为保证第三反射面413镀膜过程中,镀膜层的完整性,第一空腔440的垂直高度不能过大。因此主体410的第一空腔440空间较小,无法容纳光发射芯片阵列310和第一准直透镜阵列320,支撑体420内部的第二空腔430用于容纳光发射芯片阵列310和第一准直透镜阵列320。第二空腔430与第一空腔440连通,保证信号光线的传输。In an embodiment of the present application, two fixing holes 421 may be provided on the support body 420 , which are respectively located at diagonally opposite corners of the support body 420 . In order to facilitate the assembly connection between the main body 410 and the support body 420 and the stability after assembly, the connection surface of the main body 410 and the support body 420 is a plane disposed parallel to the circuit board 300 . Then, the main body 410 forms the first cavity 440 . In an embodiment of the present application, in order to ensure the integrity of the coating layer during the coating process of the third reflective surface 413, the vertical height of the first cavity 440 cannot be too large. Therefore, the first cavity 440 of the main body 410 has a small space and cannot accommodate the light emitting chip array 310 and the first collimating lens array 320. The second cavity 430 inside the support body 420 is used for accommodating the light emitting chip array 310 and the first collimating lens array 320. Collimating lens array 320 . The second cavity 430 communicates with the first cavity 440 to ensure the transmission of signal light.
图19为本申请实施例提供的一种第一透镜组件的主体结构示意图。第三反射面413设置于主体410的底面,为实现光模块对信号光线的合束或分束作用,第三反射面413为镀膜层,所述镀膜层包含多个并列分布的膜层,对不同波长的信号光线进行过滤。或第三反射面413为多个并列分布的滤波片,滤波片与主体底面通过光学胶连接。第三反射面413与第一反射面411平行设置,且第三反射面413在电路板300方向的投影覆盖光芯片组件, 使得第三反射面413能够接收全部光芯片发射或接收的信号光线。第一反射面411在电路板300方向的投影覆盖第三反射面413,使得第一反射面可对全部信号光线进行处理,防止信号缺失。FIG. 19 is a schematic diagram of a main body structure of a first lens assembly according to an embodiment of the present application. The third reflection surface 413 is disposed on the bottom surface of the main body 410. In order to realize the beam combining or beam splitting effect of the optical module on the signal light, the third reflection surface 413 is a coating layer. Different wavelengths of signal light are filtered. Or the third reflective surface 413 is a plurality of filters distributed in parallel, and the filters are connected with the bottom surface of the main body through optical glue. The third reflective surface 413 is disposed parallel to the first reflective surface 411 , and the projection of the third reflective surface 413 in the direction of the circuit board 300 covers the optical chip assembly, so that the third reflective surface 413 can receive all the signal light emitted or received by the optical chip. The projection of the first reflective surface 411 in the direction of the circuit board 300 covers the third reflective surface 413 , so that the first reflective surface can process all signal light rays to prevent signal loss.
在本申请的某一实施例中,第一透镜组件400的主体410和支撑体420分别一体成型,使得第一光纤固定孔414与第二汇聚反射面412之间的位置、尺寸非常稳定,提高了部件之间的连接精度,从而提高COB技术中耦合多通道时的耦合精度。In an embodiment of the present application, the main body 410 and the support body 420 of the first lens assembly 400 are respectively integrally formed, so that the position and size between the first optical fiber fixing hole 414 and the second converging reflection surface 412 are very stable, improving the The connection accuracy between components is improved, thereby improving the coupling accuracy when coupling multiple channels in COB technology.
在本申请的某一实施例中,第一透镜组件400也可以是一体式结构,一体式成型结构精度高,避免组装过程中的误差,使得第一光纤固定孔414与第二汇聚反射面412之间的位置、尺寸非常稳定,提高了部件之间的连接精度,从而提高COB技术中耦合多通道时的耦合精度。In an embodiment of the present application, the first lens assembly 400 may also be an integral structure, and the integral molding structure has high precision to avoid errors in the assembly process, so that the first optical fiber fixing hole 414 and the second converging reflection surface 412 The position and size between them are very stable, which improves the connection accuracy between components, thereby improving the coupling accuracy when coupling multiple channels in COB technology.
第一光纤阵列500的端面设置于第二汇聚反射面412的汇聚焦点位置,且第一光纤阵列500的中心线与第二汇聚反射面412中心光线重合,保证光束耦合精度。第一光纤定位孔位置与光束汇聚光斑位置吻合,保证光斑可以到达第一光纤阵列,完成光的耦合和传输。The end face of the first optical fiber array 500 is set at the converging focal position of the second converging and reflecting surface 412 , and the center line of the first optical fiber array 500 coincides with the center light of the second converging and reflecting surface 412 to ensure beam coupling accuracy. The position of the first optical fiber positioning hole is consistent with the position of the light beam converging spot to ensure that the light spot can reach the first optical fiber array to complete the coupling and transmission of light.
图20为本申请实施例提供的一种第一光纤阵列结构示意图一;图21为本申请实施例提供的一种第一光纤固定孔结构示意图。结合图20和图21所示,为保证第一光纤阵列500与第二汇聚反射面412之间的位置关系,使得第一光纤阵列500的位置稳定,第一光纤固定孔414包括:第一安装槽4141、第二安装槽4142,第一安装槽4141与第二安装槽4142内部连通。FIG. 20 is a schematic structural diagram 1 of a first optical fiber array provided by an embodiment of the application; FIG. 21 is a schematic structural diagram of a first optical fiber fixing hole provided by an embodiment of the application. 20 and 21, in order to ensure the positional relationship between the first optical fiber array 500 and the second converging reflection surface 412, so that the position of the first optical fiber array 500 is stable, the first optical fiber fixing hole 414 includes: a first installation The groove 4141, the second installation groove 4142, the first installation groove 4141 and the second installation groove 4142 communicate with each other.
第一光纤阵列500包括:内芯510、包层520和护套530;包层520设置于内芯510和护套530之间,第一安装槽4141与第一光纤阵列500的包层520匹配设置;第二安装槽4142与护套530匹配设置。第一光纤固定孔414与第一光纤阵列500通过光学胶固定连接。为避免第一光纤阵列500出现弯折,影响第一光纤阵列的使用寿命,第一安装槽441与第二安装槽442同轴设置。The first optical fiber array 500 includes: an inner core 510 , a cladding layer 520 and a sheath 530 ; the cladding layer 520 is arranged between the inner core 510 and the sheath 530 , and the first installation groove 4141 matches the cladding layer 520 of the first optical fiber array 500 Setting; the second installation groove 4142 is matched with the sheath 530 . The first optical fiber fixing hole 414 is fixedly connected to the first optical fiber array 500 through optical glue. In order to prevent the first optical fiber array 500 from being bent and affecting the service life of the first optical fiber array, the first installation groove 441 and the second installation groove 442 are coaxially arranged.
在本申请的某一实施例中,在一些实施例中,如图22,第一光纤阵列结构示意图二为第一光纤阵列500另一角度结构示意图。为将多条光纤束缚成一个整体,第一光纤阵列500外层设置集线胶套540,用于多条光纤聚集。第一光纤固定孔414还包括:第三安装槽443,第三安装槽443与集线胶套540相匹配。为避免第一光纤阵列500在安装过程中出现弯折,影响第一光纤阵列的使用寿命,第一安装槽4141、第二安装槽4142、第三安装槽4143同轴设置,使得第一光纤阵列在第一光纤固定孔中的部分呈直线设置,避免出现弯折影响使用寿命,且第一透镜组件400整体为一体成型结构,光线固定孔的位置非常稳定,第一光纤阵列与第二汇聚反射面412之间的距离固定。In an embodiment of the present application, in some embodiments, as shown in FIG. 22 , the second schematic structural diagram of the first optical fiber array is another angular structural schematic diagram of the first optical fiber array 500 . In order to bind the plurality of optical fibers into a whole, the outer layer of the first optical fiber array 500 is provided with a concentrating rubber sleeve 540 for gathering the plurality of optical fibers. The first optical fiber fixing hole 414 further includes: a third installation groove 443 , and the third installation groove 443 is matched with the hub rubber sleeve 540 . In order to prevent the first optical fiber array 500 from being bent during the installation process and affecting the service life of the first optical fiber array, the first installation groove 4141, the second installation groove 4142, and the third installation groove 4143 are coaxially arranged, so that the first optical fiber array The part in the first optical fiber fixing hole is arranged in a straight line to avoid bending and affecting the service life, and the first lens assembly 400 is integrally formed as a whole, the position of the light fixing hole is very stable, and the first optical fiber array and the second convergent reflection The distance between the faces 412 is fixed.
为了方便第一光纤阵列500与第一光纤固定孔414连接固定,第一安装槽4141、第二安装槽4142、第三安装槽4143之间分别设置过渡槽,过渡槽的外边缘由一安装槽向相邻安装槽倾斜设置,使得第一安装槽4141、第二安装槽4142、第三安装槽4143之间平滑过渡,避免插接过程中单条第一光纤阵列与安装槽存在接触死角,影响插接效果;确保第一光纤阵列的端面设置于第二汇聚反射面412的汇聚焦点,提高光线耦合精度。In order to facilitate the connection and fixation of the first optical fiber array 500 and the first optical fiber fixing hole 414, transition grooves are respectively provided between the first installation groove 4141, the second installation groove 4142, and the third installation groove 4143, and the outer edge of the transition groove is formed by an installation groove. It is inclined to the adjacent installation slot, so that the transition between the first installation slot 4141, the second installation slot 4142, and the third installation slot 4143 is smooth, so as to avoid the contact dead angle between the single first optical fiber array and the installation slot during the insertion process, which will affect the insertion The connection effect is ensured; it is ensured that the end face of the first optical fiber array is set at the converging focus of the second converging reflection surface 412, so as to improve the light coupling accuracy.
同时,第一光纤阵列500与第一光纤固定孔414插接匹配后,在过渡槽存在一定的缝 隙,因此在缝隙部分添加胶体用于第一光纤阵列500与第一光纤固定孔414的固定。At the same time, after the first optical fiber array 500 is plugged and matched with the first optical fiber fixing hole 414, there is a certain gap in the transition groove, so colloid is added to the gap for fixing the first optical fiber array 500 and the first optical fiber fixing hole 414.
在本申请的某一实施例中,为避免影响信号光束在第一透镜组件400的传输,在缝隙部分添加的胶体为光学胶,在保证第一光纤阵列500与第一光纤固定孔414之间连接固定的同时,保证信号光的传输。In an embodiment of the present application, in order to avoid affecting the transmission of the signal beam in the first lens assembly 400 , the glue added in the gap part is optical glue, which is ensured between the first optical fiber array 500 and the first optical fiber fixing hole 414 While the connection is fixed, the transmission of signal light is ensured.
本申请实施例还提供了另一种第一光纤阵列与第一透镜组件的连接方式。图23为本申请实施例提供的一种第一透镜组件与光纤支架结构立体图一,图24为本申请实施例提供的一种第一透镜组件与光纤支架结构立体图二,图25为本申请实施例提供的一种第一透镜组件与光纤支架结构立体图三。结合图23、图24和图25所示,光模块还包括:第一光纤支架600。第一光纤支架600包括:支架定位孔601、第一光纤插槽602。支架定位孔601设置于第一光纤支架600的侧面,且分别设置在侧面两端。第一透镜组件400设置支架定位柱417,与支架定位孔601位置、尺寸匹配。组装时,支架定位柱415与支架定位孔601插接,实现第一光纤支架600与第一透镜组件400的连接。The embodiment of the present application also provides another connection manner of the first optical fiber array and the first lens assembly. 23 is a first perspective view of the structure of a first lens assembly and an optical fiber support provided by an embodiment of the application, FIG. 24 is a perspective view of the structure of a first lens assembly and an optical fiber support provided by an embodiment of the application, and FIG. 25 is an implementation of the application Example 3 provides a perspective view of the structure of a first lens assembly and an optical fiber support. With reference to FIG. 23 , FIG. 24 and FIG. 25 , the optical module further includes: a first optical fiber support 600 . The first optical fiber holder 600 includes: a holder positioning hole 601 and a first optical fiber slot 602 . The bracket positioning holes 601 are arranged on the side surface of the first optical fiber bracket 600 and are respectively arranged at both ends of the side surface. The first lens assembly 400 is provided with a bracket positioning column 417 , which matches the position and size of the bracket positioning hole 601 . During assembly, the bracket positioning column 415 is inserted into the bracket positioning hole 601 to realize the connection between the first optical fiber bracket 600 and the first lens assembly 400 .
在本申请的某一实施例中,为方便实现组装,第一光纤支架600的底面设置导向槽603,第一透镜组件400设置导向轨416与导向槽603匹配。组装时,作业人员可先将导向轨416与导向槽603匹配后,再将第一光纤支架600向第一透镜组件400推进安装,可避免出现组装偏差,同时导向轨416与导向槽603的配合,使得组装更加简便。In an embodiment of the present application, in order to facilitate assembly, the bottom surface of the first optical fiber holder 600 is provided with a guide groove 603 , and the first lens assembly 400 is provided with a guide rail 416 to match the guide groove 603 . When assembling, the operator can first match the guide rail 416 with the guide groove 603, and then push the first optical fiber holder 600 to the first lens assembly 400 to install, which can avoid assembly deviation, and at the same time, the guide rail 416 and the guide groove 603 cooperate with each other. , making the assembly easier.
第一光纤支架600的上表面设置第一光纤插槽602,用于承载第一光纤阵列500。在本申请的某一实施例中,为实现第一光纤阵列500与第一光纤支架600的连接,第一光纤支架600的侧面设置光纤孔604,用于固定单条光纤的端面,确保单条光纤的端面设置于第二汇聚反射面的汇聚焦点,提高耦合精度。The upper surface of the first fiber support 600 is provided with a first fiber slot 602 for carrying the first fiber array 500 . In an embodiment of the present application, in order to realize the connection between the first optical fiber array 500 and the first optical fiber support 600, the side of the first optical fiber support 600 is provided with an optical fiber hole 604 for fixing the end face of a single optical fiber and ensuring the The end face is arranged at the converging focal point of the second converging reflection surface to improve the coupling precision.
本申请提供的光模块可实现多波长通道,不同波长的激光器发出的独立的光路,实现多光路合束的功能。第一透镜组件设置有第一光纤固定孔,用于定位第一光纤阵列。其中,第一透镜组件为一体成型结构。因为是一体成型模具加工量产的,所以孔相对第二汇聚反射面的位置和尺寸非常稳定,这样的设计即精确工艺组装又简单。可以工艺非常简单的就完成光路与第一光纤阵列的对准,完成光的耦合,提高光线耦合精度。The optical module provided by the present application can realize multi-wavelength channels, independent optical paths emitted by lasers of different wavelengths, and realize the function of combining multiple optical paths. The first lens assembly is provided with a first optical fiber fixing hole for positioning the first optical fiber array. Wherein, the first lens assembly is an integral molding structure. Because it is mass-produced by an integral molding die, the position and size of the hole relative to the second converging reflection surface are very stable, and this design is both precise and easy to assemble. The alignment of the optical path and the first optical fiber array can be completed in a very simple process, the optical coupling is completed, and the optical coupling accuracy is improved.
下面对光接收部件进行说明。Next, the light receiving member will be described.
在本申请实施例中,第二透镜组件400A的结构与第一透镜组件400的结构相似或相同。为了方便描述,将光发射中的透镜组件定义为第一透镜组件,将光接收中的透镜组件定义为第二透镜组件,图26为本申请实施例提供的一种第二透镜组件与第二准直透镜阵列的分解结构图;图27为本申请实施例提供的又一种第二透镜组件与第二准直透镜阵列结构图。如图26或27所示,第二透镜组件400A和电路板300形成第二容纳腔,第二容纳腔用于设置光学器件。在本申请的某一实施例中,从电路板300处至上第二容纳腔内依次设有光接收芯片阵列310A、第二准直透镜阵列320A。且,第二透镜组件400A的顶部表面设有第四反射面411A和第五汇聚反射面412A。第二容纳腔内侧上壁设置第六反射面413A,第六反射面413A与所述第四反射面411A平行设置。第六反射面413A包含多个滤波膜层。In the embodiment of the present application, the structure of the second lens assembly 400A is similar to or the same as that of the first lens assembly 400 . For the convenience of description, the lens assembly in light emission is defined as the first lens assembly, and the lens assembly in light reception is defined as the second lens assembly. An exploded structural diagram of a collimating lens array; FIG. 27 is a structural diagram of yet another second lens assembly and a second collimating lens array according to an embodiment of the present application. As shown in FIG. 26 or 27 , the second lens assembly 400A and the circuit board 300 form a second accommodating cavity, and the second accommodating cavity is used for arranging optical devices. In an embodiment of the present application, a light-receiving chip array 310A and a second collimating lens array 320A are sequentially arranged in the second accommodating cavity from the circuit board 300 to the top. And, the top surface of the second lens assembly 400A is provided with a fourth reflection surface 411A and a fifth converging reflection surface 412A. A sixth reflection surface 413A is provided on the inner upper wall of the second accommodating cavity, and the sixth reflection surface 413A is arranged in parallel with the fourth reflection surface 411A. The sixth reflection surface 413A includes a plurality of filter film layers.
光接收芯片阵列310A中包括多个光接收芯片,用于接收出多束不同波长的信号光, 其中光接收芯片以阵列的形式进行排列,电路板长度方向和宽度方向上均设有光接收芯片,其中长度方向上一行光接收芯片设为一组,这样可以实现设置多组光接收芯片。The light-receiving chip array 310A includes a plurality of light-receiving chips for receiving multiple beams of signal light with different wavelengths, wherein the light-receiving chips are arranged in an array, and the light-receiving chips are arranged in the length direction and the width direction of the circuit board. , wherein one row of light-receiving chips in the length direction is set as one group, so that multiple groups of light-receiving chips can be set.
第二准直透镜阵列320A包括若干个准直透镜,用于第二透镜组件320A输出的信号光。第二准直透镜阵列320A的结构与第一准直透镜阵列320的结构相似或相同。第二准直透镜阵列320A罩设在光接收芯片阵列310A的上方,第二准直透镜阵列400A的透镜数量取决于于光接收芯片阵列310A中的光接收芯片的数量。通常第二准直透镜阵列400A的透镜数量等于光接收芯片阵列310A中的光接收芯片的数量。The second collimating lens array 320A includes several collimating lenses for the signal light output by the second lens assembly 320A. The structure of the second collimating lens array 320A is similar to or the same as that of the first collimating lens array 320 . The second collimating lens array 320A is covered above the light-receiving chip array 310A, and the number of lenses in the second collimating lens array 400A depends on the number of light-receiving chips in the light-receiving chip array 310A. Generally, the number of lenses of the second collimating lens array 400A is equal to the number of light receiving chips in the light receiving chip array 310A.
第六反射面413A与第三反射面413结构相同或相似,第六反射面413A包含多个并列分布的滤波膜层。在本申请实施例中,第六反射面413A利用不同位置设置不同的膜层对不同波长信号光进行透过和反射将一束包括不同波长的信号光分束成多束光。第六反射面413A根据被分束光的波长种类以及分束数量协调选择每一波长信号光的反射次数。The structure of the sixth reflection surface 413A is the same as or similar to that of the third reflection surface 413 , and the sixth reflection surface 413A includes a plurality of filter film layers distributed in parallel. In the embodiment of the present application, the sixth reflective surface 413A uses different film layers arranged at different positions to transmit and reflect the signal light of different wavelengths to split a signal light including different wavelengths into multiple light beams. The sixth reflection surface 413A selects the number of reflections of the signal light of each wavelength in coordination according to the wavelength type and the number of the divided beams.
在本申请的某一实施例中,光模块外部的一束具有不同波长的信号光传输至第二透镜组件400A,该束信号光经过第五汇聚反射面412A反射后汇聚至第六反射面413A。其中一波长的光束透过第六反射面413A入射到其对应的准直透镜,剩余波长的光束反射至第四反射面411A。经过第四反射面411A反射至第六反射面413A,另一波长的光束透过第六反射面413A,剩余波长的光束反射至第四反射面411A,如此完成将一束具有不同波长的信号光分波成多束不同波长的信号光,经过第二准直透镜阵列320A准直后依次传输至光接收芯片组件中的光接收芯片,实现光模块接收单光纤中多个波长的信号光的功能。In an embodiment of the present application, a beam of signal light with different wavelengths outside the optical module is transmitted to the second lens assembly 400A, and the beam of signal light is reflected by the fifth converging and reflecting surface 412A and then condensed to the sixth reflecting surface 413A . The light beam of one wavelength is incident on the corresponding collimating lens through the sixth reflecting surface 413A, and the light beam of the remaining wavelength is reflected to the fourth reflecting surface 411A. After being reflected by the fourth reflecting surface 411A to the sixth reflecting surface 413A, the light beam of another wavelength passes through the sixth reflecting surface 413A, and the light beam of the remaining wavelength is reflected to the fourth reflecting surface 411A, thus completing a beam of signal light with different wavelengths The signal light is divided into multiple beams of different wavelengths, which are collimated by the second collimating lens array 320A and then transmitted to the light receiving chips in the light receiving chip assembly in turn, so as to realize the function of the optical module receiving signal light of multiple wavelengths in a single fiber. .
图28为本申请实施例提供的光模块光发接收过程局部光路图。在光接收器件中,光接收芯片阵列310A为多个光接收芯片。本申请实施例以一行光接收芯片4个为例。FIG. 28 is a partial light path diagram of an optical module for light emission and reception according to an embodiment of the present application. In the light-receiving device, the light-receiving chip array 310A is a plurality of light-receiving chips. The embodiment of the present application takes four light receiving chips in a row as an example.
光模块外部的一束具有不同波长的信号光传输至第二透镜组件400A,该束信号光经过第五汇聚反射面412A反射后汇聚至第六反射面413A。该束信号光为包括λ1、λ2、λ3以及λ4四种波长的信号光。因光是可逆的其经过第六反射面413A和第四反射面411A配合反射、滤波,实现完成一束包括不同波长信号光的分束。A bundle of signal light with different wavelengths outside the optical module is transmitted to the second lens assembly 400A, and the bundle of signal light is reflected by the fifth converging reflection surface 412A and then condensed to the sixth reflection surface 413A. The beam of signal light includes four wavelengths of signal light, λ1, λ2, λ3 and λ4. Since the light is reversible, it is reflected and filtered through the sixth reflecting surface 413A and the fourth reflecting surface 411A, so as to complete a beam splitting including signal light of different wavelengths.
在本申请实施例中关于第二透镜组件400A未尽之处可参见第一透镜组件400。第二准直透镜阵列320A与第一准直透镜阵列320结构相同;第二光纤阵列与第一光纤阵列500结构相同,均可相互参见。For the details of the second lens assembly 400A in the embodiments of the present application, reference may be made to the first lens assembly 400 . The second collimating lens array 320A has the same structure as the first collimating lens array 320; the second optical fiber array has the same structure as the first optical fiber array 500, and can refer to each other.
本申请提供的光模块中,光发射过程与光接收过程中第一透镜组件400与第二透镜组件400A的结构完全一致,依次可将光探测器、激光器按照阵列进行排列,可节约空间。光发射器件与光接收器件设置于同一透镜组件中,提高空间利用率,减少光模块部件数量,简化装配过程。In the optical module provided by the present application, the structures of the first lens assembly 400 and the second lens assembly 400A in the light emission process and the light reception process are completely consistent, and the photodetectors and lasers can be arranged in an array in sequence, which can save space. The light emitting device and the light receiving device are arranged in the same lens assembly, which improves the space utilization rate, reduces the number of optical module components, and simplifies the assembly process.
透镜组件同时罩设在光发射芯片阵列或光接收芯片阵列上方,便于利用较少器件实现改变光发射芯片发射的信号光或来自光模块外部的信号光的传播方向。在本申请实施例中,可以将光发射芯片阵列和光接收芯片阵列分别通过第一透镜组件、第二透镜组件罩设;还可以用同一透镜组件罩设。进而在本申请实施例中,第一透镜阵列的列数可以为1个,还可以为2个等。The lens assembly is also covered above the light-emitting chip array or the light-receiving chip array, which facilitates changing the propagation direction of the signal light emitted by the light-emitting chip or the signal light from outside the optical module by using fewer components. In the embodiments of the present application, the light-emitting chip array and the light-receiving chip array may be covered by the first lens assembly and the second lens assembly, respectively; and may also be covered by the same lens assembly. Furthermore, in the embodiment of the present application, the number of columns of the first lens array may be one, or two, or the like.
光发射芯片阵列和光接收芯片阵列同一透镜组件罩设时,也可同时使用同一准直透镜 阵列和同一光纤阵列。仅需要根据需要将光发射芯片阵列和光接收芯片阵列中的光芯片与透镜组件中对应的滤波膜层一一对应设置。When the light-emitting chip array and the light-receiving chip array are covered by the same lens assembly, the same collimating lens array and the same fiber array can also be used at the same time. It is only necessary to set the optical chips in the light-emitting chip array and the light-receiving chip array in one-to-one correspondence with the corresponding filter film layers in the lens assembly as required.
本申请提供的光模块中,第一透镜组件和电路板形成第一容纳腔,第一容纳腔从下至上依次设有光发射芯片阵列、第一准直透镜阵列,且第一透镜组件的表面设置第一反射面和第二汇聚反射面,第一容纳腔内侧上壁设置第三反射面,所述第三反射面为镀膜层,与所述第一反射面平行设置;所述镀膜层包含多个滤波膜层。其中光发射芯片阵列包括多个光发射芯片,光发射芯片阵列可以发射多束不同波长的信号光,此时该信号光为散射状态,经过第一准直透镜阵列的准直聚焦后形成平行光,多束不同波长的平行光传输至第三反射面的膜层。一波长的光束透过第三反射面的一滤波膜层传输至第一反射面,经第一反射面的全反射至第三反射面的另一滤波膜层,此时,另一波长的光束通过第三反射面的另一滤波膜层,与反射的光束合束后传输至第一反射面,经第一反射面的全反射至第三反射面,重复前面的合束,完成多束不同波长的信号光的合束,最终生成一束信号光,该束信号光经过第二汇聚反射面反射后汇聚至光纤带中,实现单光纤中多个波长的信号光同时传输。本申请提供的光模块中,仅是通过第一透镜组件设置的第一反射面与第三反射面,完成多束不同波长信号光的合束,提高了光模块中耦合多通道时的耦合精度。In the optical module provided by the present application, the first lens assembly and the circuit board form a first accommodating cavity, and the first accommodating cavity is sequentially provided with a light emitting chip array and a first collimating lens array from bottom to top, and the surface of the first lens assembly is A first reflecting surface and a second converging reflecting surface are provided, a third reflecting surface is set on the inner upper wall of the first accommodating cavity, and the third reflecting surface is a coating layer and is arranged in parallel with the first reflecting surface; the coating layer includes Multiple filter film layers. The light emitting chip array includes a plurality of light emitting chips, and the light emitting chip array can emit multiple beams of signal light with different wavelengths. At this time, the signal light is in a scattered state, and is collimated and focused by the first collimating lens array to form parallel light. , and multiple beams of parallel light with different wavelengths are transmitted to the film layer of the third reflective surface. The light beam of one wavelength is transmitted to the first reflecting surface through a filter film layer of the third reflecting surface, and is totally reflected by the first reflecting surface to another filter film layer of the third reflecting surface. At this time, the light beam of another wavelength is After passing through another filter film layer of the third reflecting surface, it is combined with the reflected beam and then transmitted to the first reflecting surface, and is totally reflected by the first reflecting surface to the third reflecting surface, repeating the previous beam combining to complete multiple different beams The signal light of the wavelength is combined to finally generate a bundle of signal light, which is reflected by the second converging reflection surface and then converged into the optical fiber ribbon to realize the simultaneous transmission of signal light of multiple wavelengths in a single fiber. In the optical module provided by the present application, only the first reflection surface and the third reflection surface provided by the first lens assembly are used to complete the beam combining of multiple signal lights of different wavelengths, which improves the coupling accuracy when coupling multiple channels in the optical module. .
本申请提供的光模块中,第二透镜组件与电路板形成第二容纳腔,腔内从下至上依次设置光接收芯片组件、第二准直透镜阵列,且,第二透镜组件的顶部表面设置第四反射面和第五汇聚反射面;第二容纳腔内侧上壁设置第六反射面,所述第六反射面,与所述第四反射面平行设置;所述第六反射面包含多个滤波膜层。光模块外部的一束具有不同波长的信号光传输至第二透镜组件,该束信号光经过第五汇聚反射面反射后汇聚至第六反射面,其中一波长的光束透过第六反射面,剩余波长的光束反射至第四反射面,经过第四反射面反射至第六反射面,另一波长的光束透过第六反射面,剩余波长的光束反射至第四反射面,如此完成将一束具有不同波长的信号光分波成多束不同波长的信号光,经过第二准直透镜阵列后依次传输至光接收芯片阵列中的光接收芯片,实现光模块接收单光纤中多个波长的信号光的功能。本申请提供的光模块中,仅是通过第二透镜组件设置的第四反射面和第六反射面,完成一束包括不同波长信号光的分束,提高了光模块中耦合多通道时的耦合精度。In the optical module provided by the present application, the second lens assembly and the circuit board form a second accommodating cavity, the light receiving chip assembly and the second collimating lens array are arranged in sequence from bottom to top in the cavity, and the top surface of the second lens assembly is provided with a fourth reflecting surface and a fifth converging reflecting surface; a sixth reflecting surface is provided on the inner upper wall of the second accommodating cavity, and the sixth reflecting surface is arranged in parallel with the fourth reflecting surface; the sixth reflecting surface includes a plurality of filter layer. A beam of signal light with different wavelengths outside the optical module is transmitted to the second lens assembly, the signal light is reflected by the fifth converging reflecting surface and then converged to the sixth reflecting surface, wherein the beam of one wavelength passes through the sixth reflecting surface, The light beam of the remaining wavelength is reflected to the fourth reflecting surface, and is reflected to the sixth reflecting surface through the fourth reflecting surface. The light beam of another wavelength passes through the sixth reflecting surface, and the light beam of the remaining wavelength is reflected to the fourth reflecting surface. The beam of signal light with different wavelengths is demultiplexed into multiple beams of signal light with different wavelengths, which are sequentially transmitted to the light-receiving chips in the light-receiving chip array after passing through the second collimating lens array, so that the optical module can receive multiple wavelengths in a single fiber. The function of signal light. In the optical module provided by the present application, only the fourth reflection surface and the sixth reflection surface provided by the second lens assembly are used to complete a beam of signal light with different wavelengths, which improves the coupling when coupling multiple channels in the optical module. precision.
同时,本申请还提供了一种将光发射芯片阵列和光接收芯片阵列设置于同一透镜组件中的实现方式。Meanwhile, the present application also provides an implementation manner in which the light-emitting chip array and the light-receiving chip array are arranged in the same lens assembly.
由于以上实施方式均是在其他方式之上引用结合进行说明,不同实施例之间均具有相同的部分,本说明书中各个实施例之间相同、相似的部分互相参见即可。在此不再详细阐述。Since the above embodiments are all cited and combined with other modes for description, different embodiments all have the same parts, and the same and similar parts among the various embodiments in this specification can be referred to each other. It will not be elaborated here.
本说明书通篇提及的“多个实施例”、“一些实施例”、“一个实施例”或“实施例”等,意味着结合该实施例描述的具体特征、部件或特性包括在至少一个实施例中。因此,本说明书通篇出现的短语“在多个实施例中”、“在一些实施例中”、“在至少另一个实施例中”或“在实施例中”等并不一定都指相同的实施例。此外,在一个或多个实施例中,具体特征、部件或特性可以任何合适的方式进行组合。因此,在无限制的情形下,结合一个实施例示出或描述的具体特征、部件或特性可全部或部分地与一个或多个其他实施例的特征、 部件或特性进行组合。这种修改和变型旨在包括在本申请的范围之内。Reference throughout this specification to "embodiments," "some embodiments," "one embodiment," or "an embodiment," etc., means that a particular feature, component, or characteristic described in connection with the embodiment is included in at least one in the examples. Thus, appearances of the phrases "in various embodiments", "in some embodiments", "in at least another embodiment" or "in an embodiment", etc. throughout this specification are not necessarily all referring to the same Example. Furthermore, the particular features, components or characteristics may be combined in any suitable manner in one or more embodiments. Thus, without limitation, particular features, components or characteristics illustrated or described in connection with one embodiment may be combined in whole or in part with features, components or characteristics of one or more other embodiments. Such modifications and variations are intended to be included within the scope of this application.
需要说明的是,在本说明书中,诸如“第一”和“第二”等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来,而不一定要求或暗示这些实体或操作之间存在任何这种实际的关系或顺序。而且,术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含,从而使得包括一系列要素的电路结构、物品或者设备不仅包括那些要素,而且还包括没有明确列出的其他要素,或者是还包括为这种电路结构、物品或者设备所固有的要素。在没有更多限制的情况下,有语句“包括一个……”限定的要素,并不排除在包括所述要素的电路结构、物品或者设备中还存在另外的相同要素。It should be noted that, in this specification, relational terms such as "first" and "second" etc. are only used to distinguish one entity or operation from another entity or operation, and are not necessarily required or implied Any such actual relationship or ordering exists between these entities or operations. Moreover, the terms "comprising", "comprising" or any other variation thereof are intended to encompass a non-exclusive inclusion such that a circuit structure, article or device comprising a list of elements includes not only those elements, but also not expressly listed Other elements, or elements inherent to such a circuit structure, article, or device are also included. Without further limitation, an element qualified by the phrase "comprising a..." does not preclude the presence of additional identical elements in the circuit structure, article or device that includes the element.
本领域技术人员在考虑说明书及实践这里发明的公开后,将容易想到本申请的其他实施方案。本申请旨在涵盖本申请的任何变型、用途或者适应性变化,这些变型、用途或者适应性变化遵循本申请的一般性原理并包括本申请未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的,本申请的真正范围和精神由权利要求的内容指出。Other embodiments of the present application will readily suggest themselves to those skilled in the art upon consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses or adaptations of this application that follow the general principles of this application and include common knowledge or conventional techniques in the technical field not disclosed in this application . The specification and examples are to be regarded as exemplary only, with the true scope and spirit of the application being indicated by the content of the claims.
以上所述的本申请实施方式并不构成对本申请保护范围的限定。The above-described embodiments of the present application do not limit the protection scope of the present application.

Claims (30)

  1. 一种光模块,其特征在于,包括:电路板;An optical module, characterized by comprising: a circuit board;
    光发射芯片阵列,设置于所述电路板上,用于发射不同波长的信号光;an array of light emitting chips, arranged on the circuit board, for emitting signal light of different wavelengths;
    第一准直透镜阵列,设置于所述光发射芯片的出光方向上,用于汇聚所述信号光;a first collimating lens array, arranged in the light-emitting direction of the light-emitting chip, for condensing the signal light;
    第一透镜组件,罩设于所述准直透镜阵列上方,与所述电路板形成第一容纳腔;a first lens assembly, covered above the collimating lens array, and forming a first accommodating cavity with the circuit board;
    其中:所述第一透镜组件的顶端设置第一反射面和第二汇聚反射面;所述第一反射面为倾斜面;Wherein: the top of the first lens assembly is provided with a first reflecting surface and a second converging reflecting surface; the first reflecting surface is an inclined surface;
    所述第一容纳腔内侧上壁设置第三反射面,所述第三反射面为镀膜层,与所述第一反射面平行设置;所述镀膜层包含多个滤波膜层;A third reflective surface is arranged on the inner upper wall of the first accommodating cavity, and the third reflective surface is a coating layer and is arranged in parallel with the first reflective surface; the coating layer includes a plurality of filter film layers;
    所述信号光经不同的滤波膜层进入所述第一透镜组件,经所述第一反射面与所述第三反射面的反射、合束;The signal light enters the first lens assembly through different filter film layers, and is reflected and combined by the first reflecting surface and the third reflecting surface;
    所述第二汇聚反射面设置于所述第一反射面的一侧,用于将合束后的信号光汇聚反射至第一光纤阵列;The second converging reflection surface is arranged on one side of the first reflection surface, and is used for converging and reflecting the combined signal light to the first optical fiber array;
    所述第一透镜组件设置第一光纤阵列固定孔,用于固定所述第一光纤阵列。The first lens assembly is provided with a first optical fiber array fixing hole for fixing the first optical fiber array.
  2. 根据权利要求1所述的光模块,其特征在于,所述第一透镜组件为分体式结构,第一透镜组件包括:支撑体和主体;所述支撑体罩设于所述电路板上,与所述主体插接固定;所述第三反射面设置于所述主体的底面。The optical module according to claim 1, wherein the first lens assembly is a split structure, and the first lens assembly comprises: a support body and a main body; the support body is covered on the circuit board, and is connected to the circuit board. The main body is inserted and fixed; the third reflection surface is arranged on the bottom surface of the main body.
  3. 根据权利要求1所述的光模块,其特征在于,所述第二汇聚反射面,设置于所述第一反射面与所述第一光纤固定孔之间,所述光纤阵列的端面设置于所述第二汇聚反射面的汇聚焦点;所述第一反射面在所述电路板的投影覆盖所述第三反射面;且所述第三反射面在所述电路板的投影覆盖所述光发射芯片阵列。The optical module according to claim 1, wherein the second converging reflection surface is disposed between the first reflecting surface and the first optical fiber fixing hole, and the end face of the optical fiber array is disposed in the first optical fiber fixing hole. the converging focus of the second converging reflective surface; the projection of the first reflective surface on the circuit board covers the third reflective surface; and the projection of the third reflective surface on the circuit board covers the light emission chip array.
  4. 根据权利要求1所述的光模块,其特征在于,所述滤波膜层与所述光发射芯片阵列相对应,用于实现对应波长的信号光线选择透射。The optical module according to claim 1, wherein the filter film layer corresponds to the light emitting chip array, and is used to achieve selective transmission of signal light of a corresponding wavelength.
  5. 根据权利要求1所述的光模块,其特征在于,所述第一光纤固定孔,包括:依次连通的第一装槽、第二安装槽、第三安装槽;The optical module according to claim 1, wherein the first optical fiber fixing hole comprises: a first installation slot, a second installation slot, and a third installation slot that are connected in sequence;
    所述第一安装槽与所述第一光纤阵列的包层插接;the first installation groove is plugged with the cladding of the first optical fiber array;
    所述第二安装槽与所述第一光纤阵列的保护套插接;the second installation groove is inserted into the protective sleeve of the first optical fiber array;
    第三安装槽与所述第一光纤阵列的集线胶套插接。The third installation groove is plugged with the hub rubber sleeve of the first optical fiber array.
  6. 一种光模块,其特征在于,包括:电路板;An optical module, characterized by comprising: a circuit board;
    第二透镜组件,罩设于所述电路板上方,与所述电路板形成第二容纳腔;a second lens assembly, covered above the circuit board, and forming a second accommodating cavity with the circuit board;
    其中:所述透镜组件的顶端设置第四反射面和第五汇聚反射面;所述第四反射面为倾斜面;所述第二容纳腔内侧上壁设置第六反射面,所述第六反射面,与所述第四反射面平行设置;所述第六反射面包含多个滤波膜层;Wherein: the top of the lens assembly is provided with a fourth reflecting surface and a fifth converging reflecting surface; the fourth reflecting surface is an inclined surface; a sixth reflecting surface is set on the inner upper wall of the second accommodating cavity, and the sixth reflecting surface is surface, which is arranged in parallel with the fourth reflection surface; the sixth reflection surface includes a plurality of filter film layers;
    所述第五汇聚反射面用于将信号光汇聚反射,传送至所述第六反射面;再经所述第六反射面与所述第四反射面配合分束、反射;The fifth converging reflection surface is used for converging and reflecting the signal light and transmitting it to the sixth reflecting surface; and then the sixth reflecting surface cooperates with the fourth reflecting surface for beam splitting and reflection;
    光接收芯片阵列,设置于所述电路板上,用于接收不同波长的信号光;a light-receiving chip array, arranged on the circuit board, for receiving signal light of different wavelengths;
    第二准直透镜阵列,设置于所述光接收芯片的入光方向上,用于汇聚所述信号光;The second collimating lens array is arranged in the light incident direction of the light receiving chip, and is used for condensing the signal light;
    所述第二透镜组件设置第二光纤阵列固定孔,用于固定第二光纤阵列。The second lens assembly is provided with a second fiber array fixing hole for fixing the second fiber array.
  7. 根据权利要求6所述的光模块,其特征在于,所述第二透镜组件为分体式结构,第二透镜组件包括:支撑体和主体;所述支撑体罩设于所述电路板上,与所述主体插接固定;所述第六反射面设置于所述主体的底面。The optical module according to claim 6, wherein the second lens assembly is a split structure, and the second lens assembly comprises: a support body and a main body; the support body is covered on the circuit board, and is connected to the circuit board. The main body is inserted and fixed; the sixth reflection surface is arranged on the bottom surface of the main body.
  8. 根据权利要求6所述的光模块,其特征在于,所述第五汇聚反射面,设置于所述第四反射面与所述第二光纤固定孔之间,所述光纤阵列的端口设置于所述第五汇聚反射面的汇聚焦点;所述第四反射面在所述电路板的投影覆盖所述第六反射面;且所述第六反射面在所述电路板的投影覆盖所述光接收芯片阵列。The optical module according to claim 6, wherein the fifth converging reflection surface is arranged between the fourth reflection surface and the second optical fiber fixing hole, and the port of the optical fiber array is arranged in the the converging focus of the fifth converging reflecting surface; the projection of the fourth reflecting surface on the circuit board covers the sixth reflecting surface; and the projection of the sixth reflecting surface on the circuit board covers the light receiving chip array.
  9. 根据权利要求6所述的光模块,其特征在于,所述滤波膜层与所述光接收芯片阵列相对应,用于实现对应波长的信号光线选择透射。The optical module according to claim 6, wherein the filter film layer corresponds to the light-receiving chip array, and is used to realize selective transmission of the signal light of the corresponding wavelength.
  10. 根据权利要求6所述的光模块,其特征在于,所述第二光纤阵列固定孔,包括:依次连通的第四装槽、第五安装槽、第六安装槽;The optical module according to claim 6, wherein the second optical fiber array fixing hole comprises: a fourth installation slot, a fifth installation slot, and a sixth installation slot that are connected in sequence;
    所述第四装槽与所述第二光纤阵列的包层插接;The fourth slot is inserted into the cladding of the second optical fiber array;
    所述第五安装槽与所述第二光纤阵列的保护套插接;the fifth installation groove is inserted into the protective sleeve of the second optical fiber array;
    所述第六安装槽与所述第二光纤阵列的集线胶套插接。The sixth installation groove is plugged with the hub rubber sleeve of the second optical fiber array.
  11. 一种光模块,其特征在于,包括:电路板;An optical module, characterized by comprising: a circuit board;
    光发射芯片阵列,设置于所述电路板上,用于发射不同波长的信号光;an array of light emitting chips, arranged on the circuit board, for emitting signal light of different wavelengths;
    第一准直透镜阵列,设置于所述光发射芯片的出光方向上,用于汇聚所述信号光;a first collimating lens array, arranged in the light-emitting direction of the light-emitting chip, for condensing the signal light;
    所述第一直透镜组件为平板式结构,所述第一透镜组件的底端具有第一承载面和第二承载面,所述第一承载面用于承载所述第一准直透镜阵列的一端,所述第二承载面用于承载所述第一准直透镜阵列的另一端;第一透镜组件,罩设于所述准直透镜阵列上方,与所述电路板形成第一容纳腔;The first straight lens assembly is a flat plate structure, the bottom end of the first lens assembly has a first bearing surface and a second bearing surface, and the first bearing surface is used to carry the first collimating lens array. one end, the second bearing surface is used to carry the other end of the first collimating lens array; the first lens assembly is covered above the collimating lens array and forms a first accommodating cavity with the circuit board;
    其中:所述第一透镜组件的顶端设置第一反射面和第二汇聚反射面;所述第一反射面为倾斜面;Wherein: the top of the first lens assembly is provided with a first reflecting surface and a second converging reflecting surface; the first reflecting surface is an inclined surface;
    所述第一容纳腔内侧上壁设置第三反射面,所述第三反射面为镀膜层,与所述第一反射面平行设置;所述镀膜层包含多个滤波膜层;所述滤波层与所述光发射芯片阵列相对应,用于实现对应波长的信号光线选择透射;A third reflection surface is arranged on the inner upper wall of the first accommodating cavity, and the third reflection surface is a coating layer and is arranged in parallel with the first reflection surface; the coating layer includes a plurality of filter film layers; the filter layer Corresponding to the light emitting chip array, it is used to realize the selective transmission of the signal light of the corresponding wavelength;
    所述信号光经不同的滤波膜层进入所述第一透镜组件,经所述第一反射面与所述第三反射面的反射、合束;The signal light enters the first lens assembly through different filter film layers, and is reflected and combined by the first reflecting surface and the third reflecting surface;
    所述第二汇聚反射面设置于所述第一反射面的一侧,用于将合束后的信号光汇聚反射至第一光纤阵列;The second converging reflection surface is arranged on one side of the first reflection surface, and is used for converging and reflecting the combined signal light to the first optical fiber array;
    所述第一透镜组件设置第一光纤固定孔,用于固定所述第一光纤阵列。The first lens assembly is provided with a first fiber fixing hole for fixing the first fiber array.
  12. 根据权利要求11所述的光模块,其特征在于,所述第一透镜组件为分体式结构,第一透镜组件包括:支撑体和主体;所述支撑体罩设于所述电路板上,与所述主体插接固定;所述第三反射面设置于所述主体的底面。The optical module according to claim 11, wherein the first lens assembly is a split structure, and the first lens assembly comprises: a support body and a main body; the support body is covered on the circuit board, and is connected to the circuit board. The main body is inserted and fixed; the third reflection surface is arranged on the bottom surface of the main body.
  13. 根据权利要求11所述的光模块,其特征在于,所述第二汇聚反射面,设置于所述 第一反射面与所述第一光纤固定孔之间,所述光纤阵列的端面设置于所述第二汇聚反射面的汇聚焦点;所述第一反射面在所述电路板的投影覆盖所述第三反射面;且所述第三反射面在所述电路板的投影覆盖所述光发射芯片阵列。The optical module according to claim 11, wherein the second converging reflection surface is disposed between the first reflecting surface and the first optical fiber fixing hole, and the end face of the optical fiber array is disposed in the optical fiber array. the converging focus of the second converging reflective surface; the projection of the first reflective surface on the circuit board covers the third reflective surface; and the projection of the third reflective surface on the circuit board covers the light emission chip array.
  14. 根据权利要求11所述的光模块,其特征在于,所述滤波膜层与所述光发射芯片阵列相对应,用于实现对应波长的信号光线选择透射。The optical module according to claim 11, wherein the filter film layer corresponds to the light emitting chip array, and is used to achieve selective transmission of signal light of a corresponding wavelength.
  15. 根据权利要求11所述的光模块,其特征在于,所述第一光纤固定孔,包括:依次连通的第一装槽、第二安装槽、第三安装槽;The optical module according to claim 11, wherein the first optical fiber fixing hole comprises: a first installation groove, a second installation groove, and a third installation groove connected in sequence;
    所述第一安装槽与所述第一光纤阵列的包层插接;the first installation groove is plugged with the cladding of the first optical fiber array;
    所述第二安装槽与所述第一光纤阵列的保护套插接;the second installation groove is inserted into the protective sleeve of the first optical fiber array;
    所述第三安装槽与所述第一光纤阵列的集线胶套插接。The third installation groove is inserted into the hub rubber sleeve of the first optical fiber array.
  16. 一种光模块,其特征在于,包括:电路板;An optical module, characterized by comprising: a circuit board;
    第二透镜组件,罩设于所述电路板上方,与所述电路板形成第二容纳腔;a second lens assembly, covered above the circuit board, and forming a second accommodating cavity with the circuit board;
    其中:所述透镜组件的顶端设置第四反射面和第五汇聚反射面;所述第四反射面为倾斜面;所述第二容纳腔内侧上壁设置第六反射面,所述第六反射面,与所述第四反射面平行设置;所述第六反射面包含多个滤波膜层;Wherein: the top of the lens assembly is provided with a fourth reflecting surface and a fifth converging reflecting surface; the fourth reflecting surface is an inclined surface; a sixth reflecting surface is set on the inner upper wall of the second accommodating cavity, and the sixth reflecting surface is surface, which is arranged in parallel with the fourth reflection surface; the sixth reflection surface includes a plurality of filter film layers;
    所述第五汇聚反射面用于将信号光汇聚反射,传送至所述第六反射面;再经所述第六反射面与所述第四反射面配合分束、反射;The fifth converging reflection surface is used for converging and reflecting the signal light and transmitting it to the sixth reflecting surface; and then the sixth reflecting surface cooperates with the fourth reflecting surface for beam splitting and reflection;
    光接收芯片阵列,设置于所述电路板上,用于接收不同波长的信号光;a light-receiving chip array, arranged on the circuit board, for receiving signal light of different wavelengths;
    第二准直透镜阵列,设置于所述光接收芯片的入光方向上,用于汇聚所述信号光;所述第二准直透镜阵列为平板式结构,所述第二透镜组件的底端具有第三承载面和第四承载面,所述第三承载面用于承载所述第二准直透镜阵列的一端,所述第四承载面用于承载所述第二准直透镜阵列的另一端;The second collimating lens array is arranged in the light incident direction of the light receiving chip and is used for condensing the signal light; the second collimating lens array is a flat-plate structure, and the bottom end of the second lens assembly It has a third bearing surface and a fourth bearing surface, the third bearing surface is used to carry one end of the second collimating lens array, and the fourth bearing surface is used to carry the other end of the second collimating lens array. one end;
    所述第二透镜组件设置第二光纤固定孔,用于固定第二光纤阵列。The second lens assembly is provided with a second optical fiber fixing hole for fixing the second optical fiber array.
  17. 根据权利要求16所述的光模块,其特征在于,所述第二透镜组件为分体式结构,第二透镜组件包括:支撑体和主体;所述支撑体罩设于所述电路板上,与所述主体插接固定;所述第六反射面设置于所述主体的底面。The optical module according to claim 16, wherein the second lens assembly is a split structure, and the second lens assembly comprises: a support body and a main body; the support body is covered on the circuit board, and is connected to the circuit board. The main body is inserted and fixed; the sixth reflection surface is arranged on the bottom surface of the main body.
  18. 根据权利要求16所述的光模块,其特征在于,所述第五汇聚反射面,设置于所述第四反射面与所述第二光纤固定孔之间,所述光纤阵列的端口设置于所述第五汇聚反射面的汇聚焦点;所述第四反射面在所述电路板的投影覆盖所述第六反射面;且所述第六反射面在所述电路板的投影覆盖所述光接收芯片阵列。The optical module according to claim 16, wherein the fifth converging reflection surface is arranged between the fourth reflection surface and the second optical fiber fixing hole, and the port of the optical fiber array is arranged in the the converging focus of the fifth converging reflecting surface; the projection of the fourth reflecting surface on the circuit board covers the sixth reflecting surface; and the projection of the sixth reflecting surface on the circuit board covers the light receiving chip array.
  19. 根据权利要求16所述的光模块,其特征在于,所述滤波膜层与所述光接收芯片阵列相对应,用于实现对应波长的信号光线选择透射。The optical module according to claim 16, wherein the filter film layer corresponds to the light-receiving chip array, and is used to realize selective transmission of the signal light of the corresponding wavelength.
  20. 根据权利要求16所述的光模块,其特征在于,所述第二光纤固定孔,包括:依次连通的第四装槽、第五安装槽、第六安装槽;The optical module according to claim 16, wherein the second optical fiber fixing hole comprises: a fourth installation groove, a fifth installation groove, and a sixth installation groove connected in sequence;
    所述第四装槽与所述第二光纤阵列的包层插接;The fourth slot is inserted into the cladding of the second optical fiber array;
    所述第五安装槽与所述第二光纤阵列的保护套插接;the fifth installation groove is inserted into the protective sleeve of the second optical fiber array;
    所述第六安装槽与所述第二光纤阵列的集线胶套插接。The sixth installation groove is plugged with the hub rubber sleeve of the second optical fiber array.
  21. 一种光模块,其特征在于,包括:电路板;An optical module, characterized by comprising: a circuit board;
    光发射芯片阵列,设置于所述电路板上,用于发射不同波长的信号光;an array of light emitting chips, arranged on the circuit board, for emitting signal light of different wavelengths;
    第一准直透镜阵列,设置于所述光发射芯片的出光方向上,用于汇聚所述信号光;a first collimating lens array, arranged in the light-emitting direction of the light-emitting chip, for condensing the signal light;
    第一透镜组件,罩设于所述准直透镜阵列上方,与所述电路板形成第一容纳腔;a first lens assembly, covered above the collimating lens array, and forming a first accommodating cavity with the circuit board;
    其中:所述第一透镜组件的顶端设置第一反射面和第二汇聚反射面;所述第一反射面为倾斜面;Wherein: the top of the first lens assembly is provided with a first reflecting surface and a second converging reflecting surface; the first reflecting surface is an inclined surface;
    所述第一容纳腔内侧上壁设置第三反射面,所述第三反射面为镀膜层,与所述第一反射面平行设置;所述镀膜层包含多个滤波膜层;A third reflective surface is arranged on the inner upper wall of the first accommodating cavity, and the third reflective surface is a coating layer and is arranged in parallel with the first reflective surface; the coating layer includes a plurality of filter film layers;
    所述信号光经不同的滤波膜层进入所述第一透镜组件,经所述第一反射面与所述第三反射面的反射、合束;The signal light enters the first lens assembly through different filter film layers, and is reflected and combined by the first reflecting surface and the third reflecting surface;
    所述第二汇聚反射面设置于所述第一反射面的一侧,用于将合束后的信号光汇聚反射至第一光纤阵列;The second converging reflection surface is arranged on one side of the first reflection surface, and is used for converging and reflecting the combined signal light to the first optical fiber array;
    第一光纤支架,与所述第一透镜组件插接,用于固定所述第一光纤阵列。The first optical fiber support is inserted into the first lens assembly and used for fixing the first optical fiber array.
  22. 根据权利要求21所述的光模块,其特征在于,所述第一透镜组件为分体式结构,第一透镜组件包括:支撑体和主体;所述支撑体罩设于所述电路板上,与所述主体插接固定;所述第三反射面设置于所述主体的底面。The optical module according to claim 21, wherein the first lens assembly is a split structure, and the first lens assembly comprises: a support body and a main body; the support body is covered on the circuit board, and is connected to the circuit board. The main body is inserted and fixed; the third reflection surface is arranged on the bottom surface of the main body.
  23. 根据权利要求21所述的光模块,其特征在于,所述第二汇聚反射面,设置于所述第一反射面与所述第一光纤固定孔之间,所述光纤阵列的端面设置于所述第二汇聚反射面的汇聚焦点;所述第一反射面在所述电路板的投影覆盖所述第三反射面;且所述第三反射面在所述电路板的投影覆盖所述光发射芯片阵列。The optical module according to claim 21, wherein the second converging reflection surface is disposed between the first reflecting surface and the first optical fiber fixing hole, and the end surface of the optical fiber array is disposed in the optical fiber array. the converging focus of the second converging reflective surface; the projection of the first reflective surface on the circuit board covers the third reflective surface; and the projection of the third reflective surface on the circuit board covers the light emission chip array.
  24. 根据权利要求21所述的光模块,其特征在于,所述滤波膜层与所述光发射芯片阵列相对应,用于实现对应波长的信号光线选择透射。The optical module according to claim 21, wherein the filter film layer corresponds to the light emitting chip array, and is used to achieve selective transmission of signal light of a corresponding wavelength.
  25. 根据权利要求21所述的光模块,其特征在于,所述第一光纤支架包括:The optical module according to claim 21, wherein the first optical fiber support comprises:
    第一支架定位孔,设置于所述第一光纤支架的侧面;所述第一透镜组件设置第一支架定位柱,与所述第一支架定位孔匹配插接;The first bracket positioning hole is arranged on the side of the first optical fiber bracket; the first lens assembly is provided with a first bracket positioning column, which is matched and inserted with the first bracket positioning hole;
    第一导向槽,设置于所述第一光纤支架的底面;所述第一透镜组件设置第一导向轨;与所述第一导向槽匹配;a first guide groove, which is arranged on the bottom surface of the first optical fiber support; a first guide rail is arranged on the first lens assembly; matched with the first guide groove;
    光纤孔,设置于所述第一光纤支架的侧面,用于固定所述第一光纤阵列。The optical fiber hole is arranged on the side surface of the first optical fiber support, and is used for fixing the first optical fiber array.
  26. 一种光模块,其特征在于,包括:电路板;An optical module, characterized by comprising: a circuit board;
    第二透镜组件,罩设于所述电路板上方,与所述电路板形成第二容纳腔;a second lens assembly, covered above the circuit board, and forming a second accommodating cavity with the circuit board;
    其中:所述第二透镜组件的顶端设置第四反射面和第五汇聚反射面;所述第四反射面为倾斜面;所述第二容纳腔内侧上壁设置第六反射面,所述第六反射面,与所述第四反射面平行设置;所述第六反射面包含多个滤波膜层;Wherein: the top of the second lens assembly is provided with a fourth reflecting surface and a fifth converging reflecting surface; the fourth reflecting surface is an inclined surface; the inner upper wall of the second accommodating cavity is provided with a sixth reflecting surface; Six reflecting surfaces are arranged in parallel with the fourth reflecting surface; the sixth reflecting surface includes a plurality of filter film layers;
    所述第五汇聚反射面用于将信号光汇聚反射,传送至所述第六反射面;再经所述第六反射面与所述第四反射面配合分束、反射;The fifth converging reflection surface is used for converging and reflecting the signal light and transmitting it to the sixth reflecting surface; and then the sixth reflecting surface cooperates with the fourth reflecting surface for beam splitting and reflection;
    光接收芯片阵列,设置于所述电路板上,用于接收不同波长的信号光;a light-receiving chip array, arranged on the circuit board, for receiving signal light of different wavelengths;
    第二准直透镜阵列,设置于所述光接收芯片的入光方向上,用于汇聚所述信号光;The second collimating lens array is arranged in the light incident direction of the light receiving chip, and is used for condensing the signal light;
    第二光纤支架,与所述第二透镜组件插接,用于固定所述第二光纤阵列。A second optical fiber support is inserted into the second lens assembly for fixing the second optical fiber array.
  27. 根据权利要求26所述的光模块,其特征在于,所述第二透镜组件为分体式结构,第二透镜组件包括:支撑体和主体;所述支撑体罩设于所述电路板上,与所述主体插接固定;所述第六反射面设置于所述主体的底面。The optical module according to claim 26, wherein the second lens assembly is a split structure, and the second lens assembly comprises: a support body and a main body; the support body is covered on the circuit board, and is connected to the circuit board. The main body is inserted and fixed; the sixth reflection surface is arranged on the bottom surface of the main body.
  28. 根据权利要求26所述的光模块,其特征在于,所述第五汇聚反射面,设置于所述第四反射面与所述第二光纤固定孔之间,所述光纤阵列的端口设置于所述第五汇聚反射面的汇聚焦点;所述第四反射面在所述电路板的投影覆盖所述第六反射面;且所述第六反射面在所述电路板的投影覆盖所述光接收芯片阵列。The optical module according to claim 26, wherein the fifth converging reflection surface is arranged between the fourth reflection surface and the second optical fiber fixing hole, and the port of the optical fiber array is arranged in the the converging focus of the fifth converging reflecting surface; the projection of the fourth reflecting surface on the circuit board covers the sixth reflecting surface; and the projection of the sixth reflecting surface on the circuit board covers the light receiving chip array.
  29. 根据权利要求26所述的光模块,其特征在于,所述滤波膜层与所述光接收芯片阵列相对应,用于实现对应波长的信号光线选择透射。The optical module according to claim 26, wherein the filter film layer corresponds to the light-receiving chip array, and is used to realize the selective transmission of the signal light of the corresponding wavelength.
  30. 根据权利要求26所述的光模块,其特征在于,所述第二光纤支架包括:The optical module according to claim 26, wherein the second optical fiber support comprises:
    第二支架定位孔,设置于所述第二光纤支架的侧面;所述第二透镜组件设置第二支架定位柱,与所述第二支架定位孔匹配插接;The second bracket positioning hole is arranged on the side of the second optical fiber bracket; the second lens assembly is provided with a second bracket positioning column, which is matched and plugged with the second bracket positioning hole;
    第二导向槽,设置于所述第二光纤支架的底面;所述第一透镜组件设置第一导向轨;与所述第一导向槽匹配;The second guide groove is arranged on the bottom surface of the second optical fiber support; the first lens assembly is provided with a first guide rail; matched with the first guide groove;
    次光纤孔,设置于所述第二光纤支架的侧面,用于固定所述第二光纤阵列。The secondary optical fiber hole is arranged on the side surface of the second optical fiber support, and is used for fixing the second optical fiber array.
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