WO2022033294A1

WO2022033294A1 - Anti-shake photographing module and preparation method therefor

Info

Publication number: WO2022033294A1
Application number: PCT/CN2021/108433
Authority: WO
Inventors: 陈飞帆; 袁栋立; 魏罕钢; 何艳宁; 蒋泽娇; 张焕杰; 刘旭辉
Original assignee: 宁波舜宇光电信息有限公司
Priority date: 2020-08-11
Filing date: 2021-07-26
Publication date: 2022-02-17
Also published as: CN114079712B; CN114079712A

Abstract

Provided in the present application are an anti-shake photographing module and a preparation method therefor. The anti-shake photographing module comprises a lens assembly and a photosensitive assembly, wherein the lens assembly comprises a lens and a motor for driving the lens, and a plurality of support columns with preset heights are arranged on a lower surface of the motor. In addition, the anti-shake photographing module provided in the present application further comprises: a driving assembly connected to the plurality of support columns to form a compensation motion space, wherein the driving assembly comprises a fixed part and a movable part, the movable part is connected to the fixed part by means of an SMA member, such that when the SMA member is in a connection state, the movable part drives the photosensitive assembly to carry out a compensation motion in the compensation motion space relative to the fixed part and in an optical axis direction of a lens or in a direction perpendicular to the optical axis direction of the lens.

Description

Anti-shake camera module and preparation method thereof

cross reference

This application claims the priority of the invention patent application No. 202010801335.9 filed with the China Patent Office on August 11, 2020, and the invention is titled "Anti-shake camera module and its preparation method". The entire content of the above patent application is incorporated by reference. into this article.

technical field

The present application relates to the technical field of optical imaging, and more particularly, to an anti-shake camera module and a preparation method thereof.

Background technique

In order to improve the imaging quality of the camera module, the camera module is generally equipped with an anti-shake structure, and with the rise of short videos, the anti-shake structure has become a standard configuration of camera modules used in portable electronic products such as mobile phones. At present, the camera module of the mobile phone usually adopts an optical anti-shake method or an electronic anti-shake method.

The optical anti-shake method generally requires hardware support. For example, the voice coil motor can drive the optical lens for adjustment, and the anti-shake effect can be achieved by compensating for the jitter generated by the optical lens of the camera module. The principle is to detect the tiny movement through the gyroscope in the optical lens, and then send the signal to the microprocessor. The microprocessor immediately calculates the displacement that needs to be compensated, and then drives the optical lens to move through the voice coil motor.

Electronic image stabilization methods generally do not require additional hardware, but require DSP to process imaging data. The DSP analyzes the image on the CCD and then uses the edge image to compensate. It can be seen that the electronic anti-shake method only performs post-processing on the collected imaging data, and uses edge images to compensate for the jittered area to correct the impact of jitter on imaging, thereby improving the stability of lens imaging.

According to the above analysis, the optical anti-shake method can substantially improve the jitter of the camera module, but it depends on the driving of the motor. Therefore, there are many problems accompanying the increase in the quality of the optical lens, for example, the driving force provided by the original motor is insufficient, and the cost of improving the motor itself is relatively high. And the motor itself also has many problems, such as motor dust, glue cracking, motor stability and other issues. The above problems also lead to a decrease in the yield of the camera module assembly. The electronic anti-shake method compensates for the jitter deviation of the image by using the pixels in the edge portion, which does not substantially improve the image quality. On the contrary, the overall image quality of the image is still damaged to a certain extent. Therefore, in general, the electronic anti-shake method is used together with the optical anti-shake method, and the separate electronic anti-shake method is only applied to lower-end camera modules.

To sum up, there is an urgent need for an anti-shake camera module that can solve the above problems, and a method for applying an anti-shake structure to the camera module is also required to improve the assembly yield of the camera module.

SUMMARY OF THE INVENTION

The present application provides a camera module and a manufacturing method thereof that can at least solve or partially solve at least one of the above shortcomings in the prior art.

In one aspect of the present application, a camera module is provided, including a lens assembly and a photosensitive assembly, the lens assembly includes a lens and a motor for driving the lens, wherein a lower surface of the motor is provided with a camera having a predetermined height A plurality of support columns, and the camera module further includes: a drive assembly, connecting the plurality of support columns to form a compensation motion space, wherein the drive assembly includes a fixed part and a movable part, wherein the movable part The SMA member is connected to the fixed portion, so that when the SMA member is in conduction, the movable portion drives the photosensitive component in the compensation motion space, and is positioned on the lens relative to the fixed portion. The compensation movement is performed in the direction of the optical axis or in the direction perpendicular to the optical axis of the lens.

According to an embodiment of the present application, the photosensitive assembly is disposed below the lens assembly, and the photosensitive assembly includes a photosensitive chip and a circuit board, wherein the photosensitive chip is disposed on the circuit board, and is processed through a wire bonding process. The circuit boards are electrically connected.

According to an embodiment of the present application, the camera module further includes a filter, and the metal wire used in the wire-bonding process is molded in the support of the filter.

According to an embodiment of the present application, the photosensitive chip is packaged in a space formed by the filter, the circuit board, and the support.

According to an embodiment of the present application, the movable part has an opposite first surface and a second surface, the first surface is connected to the circuit board, and the second surface covers the fixed part.

According to an embodiment of the present application, the circuit board has a flexible connecting tape to electrically connect the photosensitive component and the main board of the camera module.

According to an embodiment of the present application, the flexible connecting tape is bent using a hot pressing process, and has a hollow portion where lines are not arranged.

According to the embodiment of the present application, the bend of the flexible connecting tape is in contact with the main board.

According to an embodiment of the present application, a contact surface or a plurality of contact points are provided at the bend.

According to an embodiment of the present application, the driving assembly is disposed below or above the photosensitive assembly.

According to an embodiment of the present application, the second surface is provided with a contact array to electrically connect the lead wires of the main board and the closed circuit.

According to the embodiment of the present application, the side surface of the fixing part is provided with the lead wire of the closed circuit to electrically connect the lead wire of the main board.

According to an embodiment of the present application, the fixed part includes: a first surface, the first surface has a plurality of connection points, the movable part is connected to the connection points through an SMA member; a second surface is connected to the connection points; The first surface is opposite and is flat, and the second surface is connected with the main board of the camera module; and a closed circuit is arranged inside the fixing portion to conduct the driving assembly.

According to the embodiment of the present application, the surface area of the second surface of the movable part is smaller than the surface area of the first surface of the fixed part.

According to the embodiment of the present application, the fixed portion and the movable portion have a planar outline.

According to the embodiment of the present application, the movable part has a hollow structure to reduce the weight of the movable part.

According to an embodiment of the present application, the driving assembly has a through hole, so that the light passing through the lens assembly passes through the through hole to reach the photosensitive chip.

According to an embodiment of the present application, the SMA member is made of SMA metal.

Another aspect of the present application also provides a method for preparing the above-mentioned camera module, comprising: preparing a lens assembly and a photosensitive assembly including a lens and a motor, wherein a plurality of support columns with predetermined heights are arranged on the motor the lower surface of the lens assembly; prepare a photosensitive assembly, and arrange the photosensitive assembly under the lens assembly; connect the drive assembly to the plurality of support columns to form a compensation motion space, wherein the drive assembly includes a fixed part and a movable part ; And connect the movable part with the fixed part through the SMA member, so that the movable part drives the photosensitive assembly in the compensation movement space under the state of conduction of the SMA member, relative to the The fixing part performs a compensation motion in the direction of the optical axis of the lens or in a direction perpendicular to the optical axis of the lens.

According to an embodiment of the present application, the photosensitive component includes a photosensitive chip and a circuit board, and the method further includes: arranging the photosensitive chip on the circuit board, and electrically connecting the circuit board and the circuit board through a wire bonding process photosensitive chip.

According to an embodiment of the present application, the camera module further includes a filter, and the method further includes: molding the metal wire used in the wire-bonding process in the support of the filter.

According to an embodiment of the present application, the method further includes: encapsulating the photosensitive chip in a space formed by the optical filter, the circuit board and the support of the optical filter.

According to an embodiment of the present application, the method further includes: disposing a flexible connecting tape on the circuit board to electrically connect the photosensitive assembly and the main board of the camera module.

According to an embodiment of the present application, arranging a flexible connecting tape on the circuit board to electrically connect the photosensitive component and the main board of the camera module further includes: arranging a part of the flexible connecting tape where no lines are arranged. forming a hollow part; and bending the flexible connecting tape using a hot pressing process.

According to an embodiment of the present application, arranging a flexible connecting tape on the circuit board to electrically connect the photosensitive assembly and the main board of the camera module further comprises: connecting the bend of the flexible connecting tape to the main board of the camera module. motherboard contact.

According to an embodiment of the present application, contacting the bend of the flexible connecting tape with the main board further includes: setting a contact surface or a plurality of contact points at the bend to contact the main board. According to an embodiment of the present application, the method further includes: disposing the driving assembly below or above the photosensitive assembly.

According to an embodiment of the present application, the movable part has a first surface and a second surface opposite to each other, and the method further includes: connecting the first surface with the circuit board, and covering the second surface on the on the fixed part.

According to an embodiment of the present application, the fixed portion has a first surface and a second surface opposite to each other, and the method further includes: arranging a plurality of connection points on the first surface, and connecting the movable portion with the SMA member through the SMA member. the connection point is connected; the second surface is set as a plane and connected with the main board of the camera module; and a closed circuit is arranged inside the fixed part to conduct the drive assembly.

According to an embodiment of the present application, arranging a closed circuit inside the fixing portion to conduct the driving assembly further includes: arranging a lead wire of the closed circuit on the side surface of the fixing portion to electrically connect the lead wire of the main board.

According to an embodiment of the present application, arranging a closed circuit inside the fixing portion to conduct the driving assembly further includes: arranging a contact array on the second surface to electrically connect the lead wire of the main board and the closed circuit .

According to an embodiment of the present application, the method further includes: setting the surface area of the second surface of the movable part to be smaller than the surface area of the first surface of the fixed part.

According to an embodiment of the present application, the method further includes: setting the outer contours of the fixed portion and the movable portion in a plane shape.

According to an embodiment of the present application, the method further includes: setting the movable part into a hollow structure to reduce the weight of the movable part.

According to an embodiment of the present application, the method further includes: disposing a through hole in the driving assembly, so that the light passing through the lens assembly passes through the through hole to reach the photosensitive chip.

According to an embodiment of the present application, the method further includes: forming the SMA member from SMA metal.

According to at least one solution of the camera module provided above in this application, at least one of the following beneficial effects can be achieved:

1. the application provides a kind of anti-shake camera module, by moving the photosensitive chip inside the camera module, to correct the shaking problem that the camera module produces in the shooting process, improve the imaging quality of the camera module.

2. The present application provides an idea for solving the anti-shake of the camera module, which converts the original driving optical lens movement compensation camera module anti-shake into the driving photosensitive chip to compensate the camera module anti-shake, which can simplify the design structure of the camera module. while effectively improving the quality of its imaging.

3. The application provides a method for protecting the photosensitive chip, which is to adhere the photosensitive chip on its circuit board, and use the color filter and the color filter holder in the lens to encapsulate it in a circuit board and a color filter. Inside the structure, the photosensitive chip can be effectively protected.

4. The present application provides a driving structure capable of driving the photosensitive chip to move. The driving structure includes a movable part and a fixed part, whereby the driving structure drives the photosensitive chip to move, which can correct the jitter generated by the camera module during the shooting process.

5. The present application provides a miniaturized drive assembly for a camera module. The drive assembly can be installed under, for example, a photosensitive chip, and the support column on the lower surface of the motor is used to reserve a space for the compensation movement of the photosensitive chip, which can effectively to lower the height of the camera module.

6. This application provides an anti-shake solution for a camera module with a large image area. The increase in the size of the photosensitive chip of the camera module with a large image area will inevitably lead to a corresponding increase in other structures of the camera module. No matter how the weight of the lens of the module changes, by applying a driving component to the photosensitive chip structure, the impact of the jitter generated during the shooting process of the camera module on the imaging can be effectively reduced.

Description of drawings

Other features, objects and advantages of the present application will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings:

1 is a top view of a drive assembly of an anti-shake camera module according to an embodiment of the present application;

2 is a side view of a drive assembly of an anti-shake camera module according to an embodiment of the present application;

3 is a schematic diagram of the overall structure of an anti-shake camera module according to an embodiment of the present application;

4 is a schematic diagram of a partial structure of an anti-shake camera module according to an embodiment of the present application;

5 is a perspective view of an anti-shake camera module according to an embodiment of the present application;

6 is a side view of a partial structure of an anti-shake camera module according to an embodiment of the present application;

7 is a top view of a partial structure of an anti-shake camera module according to an embodiment of the present application; and

FIG. 8 is a flow chart of the preparation of an anti-shake camera module according to an embodiment of the present application.

detailed description

For a better understanding of the present application, various aspects of the present application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed descriptions are merely illustrative of exemplary embodiments of the present application and are not intended to limit the scope of the present application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and/or" includes any and all combinations of one or more of the associated listed items.

It should be noted that in this specification, the expressions first, second, third etc. are only used to distinguish one feature from another feature and do not imply any limitation on the feature. Accordingly, the first surface discussed below may also be referred to as the second surface without departing from the teachings of the present application. vice versa.

In the drawings, the thickness, size and shape of components have been slightly adjusted for ease of illustration. The drawings are examples only and are not drawn strictly to scale. As used herein, the terms "approximately," "approximately," and similar terms are used as terms of approximation, not of degree, and are intended to describe measurements that would be recognized by those of ordinary skill in the art or inherent bias in the calculated value.

It should also be understood that expressions such as "includes," "includes," "has," "includes," and/or "includes" in this specification are open-ended rather than closed expressions, indicating the presence of all Recited features, elements and/or components do not exclude the presence of one or more other features, elements, components and/or combinations thereof. Furthermore, when an expression such as "at least one of" appears after a list of listed features, it modifies the entire list of features and not only individual elements of the list. Furthermore, when describing embodiments of the present application, the use of "may" means "one or more embodiments of the present application." Also, the term "exemplary" is intended to refer to an example or illustration.

Unless otherwise defined, all terms (including engineering and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It should also be understood that, unless expressly stated otherwise in this application, words defined in commonly used dictionaries should be construed as having meanings consistent with their meanings in the context of the related art, rather than being idealized or excessive. Formal interpretation of meaning.

It should be noted that the embodiments in the present application and the features of the embodiments may be combined with each other in the case of no conflict. In addition, unless clearly defined or contradicted by the context, the specific steps included in the camera module described in the present application are not necessarily limited to the described order, but can be performed in any order or in parallel. The present application will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.

1 and 2 are respectively a top view and a side view of a driving assembly 1000 of an anti-shake camera module according to an embodiment of the present application. The present application provides a camera module with an anti-shake structure. The drive assembly 1000 shown in FIG. 1 and FIG. 2 is an important part of the anti-shake structure, including a fixed part 1100 and a movable part 1200 .

The overall outline of the fixing part 1100 is generally flat, with a first surface 1110 and a second surface (not shown) opposite to each other, and a closed circuit structure (hereinafter referred to as an internal circuit, not shown) may be provided inside the fixing part 1100 . Shows). The second surface of the fixing part 1100 is usually in contact with the main board of the camera module used in portable electronic products such as mobile phones. So that the second surface of the fixing portion 1100 can be closely attached to the main board of the camera module.

Further, a contact array for connecting with the main board of the camera module can also be provided on the second surface of the fixing portion 1100 , that is, the second surface of the fixing portion 1100 is provided with a package of electrode contacts such as ceramic LGA in an array state. , the contact array is connected to the lead wire of the main board, and the lead wire of the main board can be configured, for example, into a socket that can be inserted into the contact array, so as to realize the current supply to the driving assembly 1000 during operation.

As an option, the internal circuit of the fixed part 1100 can also be directly led out from the side of the fixed part 1100, and connected with the lead on the main board through the side lead (a part of the led out internal circuit), so as to realize the control of the driving component during the working process. 1000 current supply.

Drawing out the internal circuit from the side of the fixing part 1100 can ensure that the second side of the fixing part 1100 can be closely connected with the main board of the camera module, and on the other hand, it can also ensure the stability of the connection between the internal circuit and the main board lead. During the wiring operation, the operation of the leads from the side can be performed on the front, so the stability of the connection between the side leads and the motherboard leads can be ensured, and the power supply to the driving assembly 1000 is stable when the camera module is working normally.

In addition, the first surface 1110 of the fixed part 1100 also has a plurality of connection points 1111 for connecting the movable part 1200 .

The movable part 1200 may be made of SMA (Shape Memory Alloy, shape memory alloy) metal, or may be made of other materials. This application does not limit this, and those skilled in the art should understand that, without departing from the technical solution claimed in this application, the material and processing method of the movable part can be changed to obtain the method described in this specification. Individual results and advantages.

The overall outline of the movable part 1200 is generally planar, with a first surface 1210 and a second surface (not shown) opposite to each other. The second surface of the movable part 1200 may cover the first surface 1110 of the fixed part 1100, and the surface area of the second surface is smaller than the surface area of the first surface 1110 of the fixed part 1100, and the movable part 1200 and the fixed part 1100 can pass through The connection point 1111 of the first surface 1110 of the fixing part 1100 is fixed, and the SMA member (not shown) connects the two together.

The SMA (Shape Memory Alloy) member can be made of SMA metal, such as titanium-nickel alloy (TiNi), titanium-palladium alloy (TiPd), titanium-nickel-copper alloy (TiNiCu), titanium-nickel-palladium alloy (TiNiPd) or a combination thereof memory alloy. The SMA member may have different shapes such as linear, strip, etc., which is not limited in this application. Those skilled in the art should understand that the shape and Materials are fabricated to achieve the various results and advantages described in this specification. The SMA member has a shape memory function, that is, it is heated after plastic deformation, and can return to the shape before deformation when the temperature reaches a critical value. When the SMA member is energized, since the temperature of the SMA member itself rises, the length of the SMA member will change when the temperature reaches a critical value, so a certain driving force can be generated, and this driving force will drive the movable part 1200 to move relative to the fixed part 1100 .

As an option, a hollow structure can also be provided inside the movable part 1200 , and the rest of the movable part 1200 outside the hollow structure can be made of, for example, SMA material, so as to reduce the weight of the movable part 1200 . When the weight of the movable part 1200 is light, the driving force provided by the SMA member is relatively large, and the driving assembly 1000 can control the movement of the movable part 1200 relative to the fixed part 1100 more precisely.

FIG. 3 is a schematic diagram of the overall structure of an anti-shake camera module according to an embodiment of the present application. FIG. 4 is a partial structural schematic diagram of an anti-shake camera module according to an embodiment of the present application. FIG. 5 is a perspective view of an anti-shake camera module according to an embodiment of the present application.

As shown in FIG. 3 , the anti-shake camera module provided by the present application further includes a lens assembly 2000, which includes a voice coil motor (not shown) and a lens 2100. The voice coil motor is mainly used to drive the lens 2100 for adjustment, so as to achieve The focusing function of the camera module during the shooting process, in the embodiment of the present application, a plurality of BTB (Board To Board) connectors can be set on the voice coil motor to fix the voice coil motor and other parts of the camera module . The lens 2100 is mainly used to collect the reflected light of the target during the shooting process, and may include a plurality of optical lenses, a filter 2110 (as shown in FIG. 4 ) and a glass sheet. The optical lens can be made of glass material or plastic material; the optical filter 2110 can be made of, for example, blue glass material, which is not limited in this application.

The lens 2100 and the voice coil motor can be connected by, for example, threads, that is, the lens 2100 has an external thread, and the voice coil motor has an internal thread adapted to it, and the two can be fixed by an internal and external thread structure. As an option, the lens 2100 and the voice coil motor can also be fixed by means of bonding, that is, the outer diameter of the lens 2100 matches the inner diameter of the voice coil motor, and the lens 2100 is installed inside the voice coil motor by, for example, glue Bonding with other adhesive materials to achieve the fixation of the lens 2100 and the motor. This application does not limit this, and those skilled in the art should understand that, without departing from the technical solutions claimed in this application, the fixing methods of the lens and the motor can be changed to obtain the various results and advantages described in this specification. .

As shown in FIGS. 3 and 4 , the anti-shake camera module provided by the present application further includes a photosensitive assembly 3000 , and the photosensitive assembly 3000 includes a photosensitive chip 3100 and a circuit board 3200 . The photosensitive component 3000 mainly converts the optical signal transmitted by the lens 2100 into an electrical signal, so as to form a photo of the target object. In the embodiment of the present application, the photosensitive chip 3100 may be bonded on the circuit board 3200 and electrically connected to the circuit board 3200 through, for example, a wire bonding process, so as to realize electrical connection therebetween. For the wire bonding process, metal wires such as gold wires can be used to connect the circuit board 3200 and the photosensitive chip 3100 .

In one embodiment of the present application, the metal wires used in the wire bonding process, such as gold wires and some capacitor elements, can be directly molded into the frame of the optical filter 2110 by the molding process. This connection method can not only Protecting the metal wires used in the wire bonding process can also effectively reduce the height of the molding base of the anti-shake camera module (the bracket of the filter 2110). At the same time, encapsulating the photosensitive chip 3100 in the inner space composed of the circuit board 3200, the molding base and the filter 2110 can effectively protect the photosensitive chip 3100 from damage caused by dust on the surface of the photosensitive chip 3100 or some other factors.

In the process of assembling the camera module, the voice coil motor and the lens 2100 can be combined together to form the lens assembly 2000, and then the photosensitive assembly 3000 can be assembled under the lens assembly 2000 to obtain the camera module.

In one embodiment of the present application, the circuit board 3200 of the photosensitive assembly 3000 is connected and fixed to the first surface 1210 of the movable part 1200 of the driving assembly 1000, and the two can be fixed by, for example, bonding or welding. The working current of the driving component 1000 is provided by the corresponding components on the mainboard of the camera module through the fixing portion 1100 thereof, and the working current of the photosensitive component 3000 is provided by the flexible connecting tape 3300 connected thereto. One end of the flexible wire connecting tape 3300 is connected to the main board of the camera module, and the other end is fixed on the circuit board 3200 of the photosensitive assembly 3000 to provide the current required by the photosensitive assembly 3000 when the camera module works.

After the SMA member of the driving assembly 1000 is energized, the driving force generated by the SMA member will drive the movable part 1200 to move relative to the fixed part 1100 . At the same time, the circuit board 3200 fixedly connected to the movable part 1200 and the photosensitive chip 3100 bonded on the circuit board 3200 are driven by the movable part 1200 and move relative to the fixed part 1100 . Therefore, when the anti-shake camera module shakes during the shooting process, the driving component 1000 can drive the photosensitive chip 3100 to adjust the corresponding position through the movable part 1200 according to the received instruction, so as to correct the displacement caused by the camera module shake. After the shake correction of the drive assembly 1000 is completed, the voice coil motor will also drive the lens 2100 to focus, and then the anti-shake camera module completes the shooting. Therefore, using the anti-shake camera module having the driving assembly 1000 for shooting can effectively improve the imaging quality.

Further, the driving assembly 1000 can also adjust the movable part 1200 to drive the circuit board 3200 and the photosensitive chip 3100 fixed on the circuit board 3200 relative to the fixed position after calculation according to the shaking direction and displacement of the camera module during the shooting process. and adjust the movable part 1200 to drive the circuit board 3200 and the photosensitive chip 3100 fixed on the circuit board 3200 to compensate relative to the fixed part 1100 in the direction perpendicular to the optical axis of the lens 2100 sports.

In addition, FIG. 6 and FIG. 7 are respectively a side view and a top view of a partial structure of an anti-shake camera module according to an embodiment of the present application. The lens assembly 2000 is installed directly above the photosensitive assembly 3000, as shown in FIG. 6 and FIG. 7, and the photosensitive assembly 3000 is covered inside the frame 2200 of the lens assembly 2000. In order to realize the compensation motion of the photosensitive chip 3100, the lens assembly 2000 The bottom of the frame 2200 needs to reserve a space for compensation movement, so the lens assembly 2000 can be fixed with the driving assembly 1000 by, for example, four supporting columns 2210 at the bottom of the frame 2200 to form a space for compensation movement.

In an embodiment of the present application, a certain predetermined height can be designed for the support column 2210 , so that the movable part 1200 drives the circuit board 3200 and the photosensitive chip 3100 in the compensation motion space, relative to the light of the fixed part 1100 along the lens 2100 . The need for compensation movement in the direction of the axis or perpendicular to the optical axis of the lens 2100 . While the predetermined height of the support column 2210 satisfies the above compensation motion requirements, the height of the support column 2210 can be designed to be as low as possible to improve the stability of the camera module. Meanwhile, during the installation process of the camera module, the support column 2210 can be conveniently used as a reference to locate the installation positions of other components.

As an option, a lead wire for connecting to the main board of the camera module can also be provided in the support column 2210, so as to realize the current supply to the voice coil motor during operation.

Referring again to FIG. 1 and FIG. 2 , further, the driving assembly 1000 may have a through hole penetrating the fixed part 1100 and the movable part 1200 , and the through hole may have an aperture adapted to the lens assembly 2000 . The through hole mainly enables the light collected by the lens assembly 2000 to reach the photosensitive chip 3100 directly.

In one embodiment of the present application, the main structure of the photosensitive assembly 3000 may be located above the driving assembly 1000 ; in another embodiment of the present application, the main structure of the photosensitive assembly 3000 may be located below the driving assembly 1000 .

In the structure of the anti-shake camera module in which the main structure of the photosensitive assembly 3000 is located below the driving assembly 1000 , that is, the driving assembly 1000 is installed in the middle of the photosensitive assembly 3000 and the lens assembly 2000 , and the movable part 1200 of the driving assembly 1000 is connected to the photosensitive assembly. 3000 is fixedly connected, and the fixing part 1100 is fixedly connected with the lens assembly 2000 .

Optionally, a through hole is provided in the driving assembly 1000 , and the light passing through the lens assembly 2000 passes through the through hole of the driving assembly 1000 after passing through the lens 2100 to reach the position of the photosensitive chip 3100 . Disposing the through hole in the drive assembly 1000 not only facilitates light entering the camera module, but also effectively reduces the weight of the drive assembly 1000 , which facilitates the drive assembly 1000 to more precisely control the movement of the movable part 1200 relative to the fixed part 1100 . In the above-mentioned structure of the anti-shake camera module, the through hole may not be provided in the driving assembly 1000 , so that the connection between the movable part 1200 and the photosensitive assembly 3000 can be firmer.

In the structure of the anti-shake camera module in which the main structure of the photosensitive assembly 3000 is located above the driving assembly 1000 , that is, the photosensitive assembly 3000 is installed in the middle of the lens assembly 2000 and the driving assembly 1000 , and the movable part 1200 of the driving assembly 1000 is connected to the photosensitive assembly. 3000 is fixedly connected, and the fixing part 1100 is fixedly connected with the lens assembly 2000 .

Optionally, through holes may be provided in the drive assembly 1000 . Providing the through hole in the drive assembly 1000 can effectively reduce the weight of the drive assembly 1000 , which is beneficial for the drive assembly 1000 to achieve more precise control of the movement of the movable part 1200 relative to the fixed part 1100 . In the above-mentioned structure of the anti-shake camera module, the through hole may not be provided in the driving assembly 1000 , so that the connection between the movable part 1200 and the photosensitive assembly 3000 can be firmer.

Referring to FIG. 5 again, one end of the flexible connecting tape 3300 of the photosensitive assembly 3000 is connected to the photosensitive assembly 3000, and the other end is fixed on the main board (not shown) of the camera module for photosensitive when the anti-shake camera module is working. Component 3000 is powered. However, when the driving assembly 1000 drives the photosensitive assembly 3000 to perform the compensation motion, the flexible connecting belt 3300 will generate a certain resistance to the compensation motion of the photosensitive assembly 3000.

In order to effectively solve this problem, the present application also provides a connection method of the flexible connecting tape that can effectively reduce the resistance force. As shown in FIG. 5 , the flexible connecting tape 3300 can be bent, and the bending place Connect with the mainboard of the camera module. Further, a hollow setting can also be performed at the middle position of the flexible connecting strip 3300 , that is, hollowing out the part of the flexible connecting strip 3300 where lines are not laid out. By bending the flexible connecting belt 3300, the movable range of the photosensitive assembly 3000 can be reserved. When the photosensitive assembly 3000 frequently performs compensating motions, due to the sufficient movable scope reserved, the compensating motion will not affect the flexible connecting belt. The 3300 connection is firm and stable, and there will be no problems such as tearing of the soft connecting belt 3300 due to frequent compensating movements.

Bending the flexible connecting tape 3300 can be performed by, for example, a hot pressing process. Before assembling the anti-shake camera module, the flexible connecting tape 3300 is bent using, for example, a hot pressing process, and operations such as dispensing or welding are performed at the bent place, and then the flexible connecting tape 3300 and the camera module are connected. The motherboards are held together by contact points at the bends. Bending the flexible connecting belt 3300 can effectively solve the problem of the torque of the flexible connecting belt 3300 to the photosensitive assembly 3000 and the influence of frequent compensating motion on the power-on stability. Further, the contact between the bend of the flexible connection tape 3300 and the main board of the camera module is not limited to the contact point. Set the contact surface to be in contact with the mainboard of the camera module.

FIG. 8 is a flow chart of the preparation of an anti-shake camera module according to an embodiment of the present application. As shown in FIG. 8 , in an embodiment of the present application, a preparation method of an anti-shake camera module is also provided. The method mainly includes:

S1, disposing a plurality of support columns with a predetermined height on the lower surface of the voice coil motor.

In step S1, the lens assembly included in the anti-shake camera module is mainly used to collect the reflected light of the target during the shooting process. The lens assembly includes a lens and a voice coil motor, and the voice coil motor is used to drive the lens to adjust, so as to realize the focusing function of the camera module during the shooting process. In the embodiment of the present application, a plurality of BTB ( Board To Board) connector for fixing the voice coil motor and other parts of the camera module.

S2, the photosensitive assembly is arranged below the lens assembly.

In step S2, the photosensitive component included in the anti-shake camera module mainly converts the optical signal sent by the lens component into an electrical signal, so as to form a photo of the shooting target. The photosensitive component includes a photosensitive chip and a circuit board, the photosensitive chip can be bonded to the circuit board, and the circuit board and the photosensitive chip are electrically connected through a wire bonding process, wherein the wire bonding process can use metal wires such as gold wires.

Further, the metal wire used in the wire bonding process can also be molded into the holder of the optical filter. In addition, the photosensitive chip can also be encapsulated in a space composed of a filter, a circuit board and a support for the filter.

The above steps can effectively reduce the height of the molding base (the support of the filter) of the anti-shake camera module. At the same time, it can also effectively protect the photosensitive chip surface from dust or other damage caused by some factors.

The flexible connecting tape can also be arranged on the circuit board of the photosensitive component to electrically connect the photosensitive component and the main board of the camera module. Further, the part of the flexible connecting tape where the lines are not arranged can also be set as a hollow part.

Considering that the flexible connecting belt will have a certain resistance to the movement of the photosensitive component, the flexible connecting belt of the circuit board can be bent by the hot pressing process, and the bending part of the flexible connecting belt can be connected with the anti-shake camera module. The main board is in contact to ensure the reliability of power supply to the photosensitive components under working conditions. Multiple contact points can be set at the bend of the flexible connecting tape to contact the motherboard of the anti-shake camera module. As an option, a contact surface can also be set at the bend of the flexible connecting tape to contact the mainboard of the anti-shake camera module, so that the photosensitive assembly can obtain stable power supply.

S3, connecting the drive assembly to a plurality of support columns to form a compensation motion space.

In step S3, the anti-shake camera module further includes a driving component. The driving component can be arranged below or above the photosensitive component. The drive assembly includes a fixed part and a movable part, and the outer contours of the fixed part and the movable part can be set in a plane shape.

The movable part can be made of SMA metal, for example, and has an opposite first surface and a second surface, the first surface of the movable part is connected with the circuit board of the photosensitive component, and the second surface of the movable part is covered on the fixed part , wherein the surface area of the second surface of the movable part is smaller than the surface area of the first surface of the fixed part.

The fixed part has an opposite first surface and a second surface, a plurality of connection points are arranged on the first surface of the fixed part, and the movable part is connected with the connection points of the first surface through the SMA member; the second surface of the fixed part is connected Set to a flat surface and connect with the main board of the anti-shake camera module.

The SMA member can be made of SMA metal. The SMA member has a shape memory function, that is, after being heated after plastic deformation, it can return to the shape before deformation when the temperature reaches a critical value. When the SMA member is energized, since the temperature of the SMA member itself rises, the length of the SMA member will change when the temperature reaches a critical value, so a certain driving force can be generated, and this driving force will drive the movable part 1200 to move relative to the fixed part 1100 .

A closed circuit can be arranged inside the fixed part, and the closed circuit can provide working current to the driving component by being connected with the main board of the anti-shake camera module. The lead wire of the closed circuit can be arranged on the side of the fixing part to electrically connect the lead wire of the main board of the anti-shake camera module. As an option, a contact array can also be provided on the second surface of the fixing part to electrically connect the lead wires of the main board of the anti-shake camera module and the closed circuit of the fixing part.

Further, in order to reduce the weight of the movable portion, the movable portion can also be provided with a hollow structure. Alternatively, a through hole is provided in the driving assembly including the movable part and the fixed part, so that the light passing through the lens assembly can directly reach the photosensitive chip.

S4, connect the movable part to the fixed part through the SMA member, so that the movable part drives the photosensitive assembly in the compensation motion space in the state of conduction of the SMA member, relative to the fixed part in the direction of the optical axis of the lens or perpendicular to Compensate movement in the direction of the optical axis of the lens.

The preparation method of the anti-shake camera module provided by the present application can install the driving component under the photosensitive chip, for example, and use the support column on the lower surface of the motor to reserve the compensation movement space of the photosensitive chip, which can effectively reduce the height of the camera module. At the same time, no matter how the weight of the lens of the camera module changes, by applying a driving component to the photosensitive chip structure, the impact of the camera module's jitter during the shooting process on the imaging can be effectively reduced.

The above description is merely an embodiment of the present application and an illustration of the applied technical principles. Those skilled in the art should understand that the protection scope involved in the present application is not limited to the technical solutions formed by the specific combination of the above-mentioned technical features, but also covers the technical solutions made of the above-mentioned technical features or their technical features without departing from the technical concept. Other technical solutions formed by any combination of equivalent features. For example, a technical solution is formed by replacing the above-mentioned features with the technical features disclosed in this application (but not limited to) with similar functions.

Claims

A camera module includes a lens assembly and a photosensitive assembly, the lens assembly includes a lens and a motor for driving the lens, characterized in that:

A plurality of support columns with predetermined heights are arranged on the lower surface of the motor, and the camera module further includes:

a drive assembly, connecting the plurality of support columns to form a compensation motion space, wherein the drive assembly includes a fixed part and a movable part,

Wherein, the movable part is connected with the fixed part through an SMA member, so that when the SMA member is connected, the movable part drives the photosensitive component in the compensation movement space, relative to the The fixing part performs a compensation motion in the direction of the optical axis of the lens or in a direction perpendicular to the optical axis of the lens.
The camera module according to claim 1, wherein the photosensitive assembly is disposed below the lens assembly, and the photosensitive assembly comprises:

Photosensitive chips and circuit boards,

Wherein, the photosensitive chip is arranged on the circuit board, and is electrically connected to the circuit board through a wire bonding process.
The camera module according to claim 2, wherein the camera module further comprises a filter, and the metal wire used in the wire-bonding process is molded in the support of the filter.
The camera module according to claim 3, wherein the photosensitive chip is packaged in a space formed by the filter, the circuit board and the support of the filter.
The camera module according to claim 1, wherein the circuit board has a flexible connecting tape to electrically connect the photosensitive assembly and the main board of the camera module.
The camera module according to claim 5, wherein the flexible connecting tape is bent by a hot pressing process, and has a hollow portion without wiring.
The camera module according to claim 6, wherein the bend of the flexible connecting tape is in contact with the main board.
The camera module according to claim 7, wherein a contact surface or a plurality of contact points are provided at the bend.
The camera module according to claim 1, wherein the driving component is disposed below or above the photosensitive component.
The camera module according to claim 1, wherein the movable part has a first surface and a second surface opposite to each other, the first surface is connected to the circuit board, and the second surface covers the on the fixed part.
The camera module according to claim 10, wherein the fixing part comprises:

a first surface, the first surface has a plurality of connection points, and the movable part is connected with the connection points through an SMA member;

The second surface is opposite to the first surface and is flat, and the second surface is connected to the main board of the camera module; and

A closed circuit is arranged inside the fixing portion to conduct the driving component.
The camera module according to claim 11, wherein the second surface is provided with a contact array to electrically connect the lead wires of the main board and the closed circuit.
The camera module according to claim 11, wherein the side surface of the fixing portion is provided with the lead wire of the closed circuit to electrically connect the lead wire of the main board.
The camera module according to claim 11, wherein the surface area of the second surface of the movable part is smaller than the surface area of the first surface of the fixed part.
The camera module according to claim 1, wherein the fixed part and the movable part have a planar outline.
The camera module according to claim 1 or 15, wherein the movable part has a hollow structure to reduce the weight of the movable part.
The camera module according to claim 1, wherein the driving assembly has a through hole, so that the light passing through the lens assembly passes through the through hole to reach the photosensitive chip.
The camera module according to claim 1, wherein the SMA member is made of SMA metal.
A method for preparing a camera module as claimed in any one of claims 1-18, comprising preparing a lens assembly and a photosensitive assembly comprising a lens and a motor, wherein the method comprises:

disposing a plurality of support columns having a predetermined height on the lower surface of the motor;

disposing the photosensitive assembly below the lens assembly;

connecting a drive assembly to the plurality of support columns to form a compensation motion space, wherein the drive assembly includes a fixed part and a movable part; and

The movable part is connected to the fixed part through the SMA member, so that the movable part drives the photosensitive component in the compensation movement space, relative to the The fixing part performs compensation motion in the direction of the optical axis of the lens or in the direction perpendicular to the optical axis of the lens.
The method according to claim 19, wherein the photosensitive component comprises a photosensitive chip and a circuit board, wherein the method further comprises:

The photosensitive chip is arranged on the circuit board, and the circuit board and the photosensitive chip are electrically connected through a wire bonding process.
The method according to claim 20, wherein the camera module further comprises a filter, wherein the method further comprises:

The wire used for the wire bonding process is molded into the filter holder.
The method of claim 21, wherein the method further comprises:

The photosensitive chip is packaged in the space formed by the optical filter, the circuit board and the support of the optical filter.
The method of claim 19, wherein the method further comprises:

A flexible connecting tape is arranged on the circuit board to electrically connect the photosensitive component and the main board of the camera module.
The method according to claim 23, wherein arranging a flexible connecting tape on the circuit board to electrically connect the photosensitive assembly and the main board of the camera module further comprises:

Setting the part of the flexible connecting tape where the lines are not arranged as a hollow part; and

The flexible connecting tape is bent using a hot pressing process.
The method according to claim 24, wherein arranging a flexible connection tape on the circuit board to electrically connect the photosensitive assembly and the main board of the camera module further comprises:

Contact the bend of the flexible connecting tape with the main board.
The method according to claim 25, wherein contacting the bend of the flexible connecting tape with the main board further comprises:

A contact surface or a plurality of contact points are arranged at the bend to be in contact with the main board.
The method of claim 19, wherein the method further comprises:

The driving component is arranged below or above the photosensitive component.
The method of claim 19, wherein the movable portion has opposing first and second surfaces, further comprising:

The first surface is connected to the circuit board, and the second surface is covered on the fixing part.
The method of claim 28, wherein the fixing portion has opposite first and second surfaces, further comprising:

A plurality of connection points are arranged on the first surface, and the movable part is connected to the connection points through an SMA member;

The second surface is arranged to be flat and connected with the mainboard of the camera module; and

A closed circuit is arranged inside the fixing portion to conduct the driving assembly.
The method according to claim 29, wherein arranging a closed circuit inside the fixing portion to conduct the driving assembly further comprises:

The lead wires of the closed circuit are arranged on the side surface of the fixing part to electrically connect the lead wires of the main board.
The method according to claim 29, wherein arranging a closed circuit inside the fixing portion to conduct the driving assembly further comprises:

A contact array is arranged on the second surface to electrically connect the lead wires of the main board and the closed circuit.
The method of claim 29, wherein the method further comprises:

The surface area of the second surface of the movable portion is set to be smaller than the surface area of the first surface of the fixed portion.
The method of claim 19, wherein the method further comprises:

The outer contours of the fixed portion and the movable portion are provided in a plane shape.
The method according to claim 19 or 33, wherein the method further comprises:

The movable portion is provided in a hollow structure to reduce the weight of the movable portion.
The method of claim 19, wherein the method further comprises:

A through hole is provided in the driving assembly, so that the light passing through the lens assembly passes through the through hole and reaches the photosensitive chip.
The method of claim 19, wherein the method further comprises:

The SMA member is made of SMA metal.