WO2022028265A1

WO2022028265A1 - Power supply apparatus capable of impedance matching

Info

Publication number: WO2022028265A1
Application number: PCT/CN2021/108456
Authority: WO
Inventors: 吴晓宁; 陆小珊
Original assignee: 吴晓宁; 陆小珊
Priority date: 2020-08-01
Filing date: 2021-07-26
Publication date: 2022-02-10

Abstract

A power supply apparatus (100) capable of impedance matching, comprising a power supply module (110) and at least one impedance matching circuit (120). The power supply module (110) is used for supplying power to an external device. The impedance matching circuit (120) is arranged before or after the power supply module (110), and comprises a plurality of impedance elements (121), at least one input end (126), and at least one output end (127). The plurality of impedance elements (121) constitute a mesh structure (123) comprising at least one grid (122), and the grid (122) has edges (124) and vertices (125). Each input end (126) is connected to one vertex (125) in the at least one grid (122). Each output end (127) is connected to another vertex (125) in the at least one grid (122). The power supply apparatus (100) can perform impedance matching on the power supply module (110) and the external device by means of the impedance matching circuit (120) therein, thereby ensuring that a signal generated by the external device is transmitted without distortion while the power is supplied to the external device.

Description

Impedance matched power supply unit

CROSS-REFERENCE TO RELATED APPLICATIONS

This application requires the application on August 1, 2020, the application number is 2020107638767, and the name is "Impedance-matched power supply device"; the application was filed on August 1, 2020, the application number is 2020215719314, and the name is "Impedance-matched power supply device" Device" of the Chinese Patent Application, which is hereby incorporated by reference in its entirety.

technical field

The present disclosure generally relates to the field of power supply technology. More particularly, the present disclosure relates to an impedance-matched power supply device.

Background technique

Generally speaking, the signal transmitted in the power supply equipment and external equipment is a complex energy-synthesized intermodulation signal, which may contain fundamental and harmonic signals of multiple frequency components, and the fundamental signal of each frequency component is harmonic The amplitudes of the wave signals may also be different. The so-called "intermodulation" refers to the mutual influence and mutual modulation between the above-mentioned signals with different frequencies and/or different amplitude values. However, various components in the existing circuit have their own frequency and amplitude characteristics. For signals of different frequencies and amplitudes, the responses and indicators of various components will also be different, and the impedance characteristics of a single component will vary with changes in signal frequency and amplitude.

In the process of transmitting the signal in the existing power supply equipment and external equipment, the signal is usually only processed as a signal of a single frequency. However, since the signals in the power supply device and the external device are composed of multiple intermodulation signals of different frequencies and amplitudes, the impedance shown in the power supply device and the external device is relative to the signal of each frequency component. The values are not the same. In this way, the impedance value of the power supply device does not match the impedance value of the external device, and a local standing wave may be generated between the power supply device and the external device. The standing wave is superimposed with the signals of various frequency and amplitude components, and finally the signals of multiple frequency and amplitude components in the signal, especially the signals of harmonic components, are filtered, weakened or enhanced at a certain moment, so that the original signal Intermodulation distortion occurs during transmission. To sum up, when the existing power supply device supplies power to external devices, due to the diversity of signal frequencies and amplitudes in the power supply device and the external device, it is impossible to perform impedance matching on various signals of different external devices at the same time, resulting in Intermodulation distortion of signal transmission in external equipment.

SUMMARY OF THE INVENTION

In order to solve one or more problems in the above-mentioned background art, the present disclosure provides an impedance matching power supply device. The power supply device includes a power supply module and an impedance matching circuit. For different external devices, by setting the number and impedance value of the impedance elements of each part and layer in the impedance matching circuit, when the DC voltage intermodulation signal or the signal of the external device flows through the impedance matching circuit , so that the signals of different frequencies and/or amplitudes can automatically select their respective optimal paths for transmission, so as to achieve signal intermodulation matching. Further, by intermodulating with the DC power supply signal to achieve the purpose of balanced transmission, impedance matching is performed between the power supply device and the external device, and distortion-free signal transmission is finally realized.

Specifically, the present disclosure discloses an impedance matching power supply device. The power supply device includes a power supply module configured to output a DC voltage to an external device for powering the same; and at least one impedance matching circuit, wherein each of the impedance matching circuits includes: a plurality of impedance elements, the plurality of impedances The element formation comprises a mesh structure comprising at least one mesh having edges and vertices and wherein at least one edge consists of at least one impedance element; at least one input terminal, wherein each input terminal is connected to the at least one mesh in the at least one mesh. and at least one output, wherein each output is connected to another vertex in the at least one mesh. The impedance matching circuit is connected to the power supply module, so that when the power supply device is connected to the external device, impedance matching is performed between the power supply module and the external device.

In one embodiment, impedance values of at least two of the plurality of impedance elements are different so that signals from the external device and signals of different frequencies and/or amplitudes in the DC voltage intermodulation pass through the grid different paths in the structure.

In another embodiment, the impedance element is at least one of the following: capacitance; inductance; capacitance and inductance; resistance and capacitance; resistance and inductance; and resistance, capacitance and inductance.

In another embodiment, the input terminal and the output terminal of the impedance element are respectively connected with vertices at opposite corners of the impedance matching circuit, so that the impedance elements between the input terminal and the output terminal form the most combinations .

In yet another embodiment, the power module includes a transformer and a rectifier circuit, or includes a battery pack.

In another embodiment, the impedance matching circuit is arranged after the power supply module, the input end of the impedance matching circuit is connected to the rectifier circuit or the battery pack, and the output end of the impedance matching circuit is connected to the external device connection.

In another embodiment, the power module is a single-channel power module, at least one input end of the impedance matching circuit is connected to the rectifier circuit or a battery pack, and at least one output end of the impedance matching circuit is connected to the External device connection.

In yet another embodiment, when the power module includes a transformer and a rectifier circuit, the power module is a dual-circuit power module, one input end of the impedance matching circuit is connected to the rectifier circuit, and the other input end is connected to the rectifier circuit. The transformer is connected, one output end of the impedance matching circuit is connected to the external device, and the other output end is grounded.

In another embodiment, when the power supply module includes a transformer and a rectifier circuit, the impedance matching circuit is arranged before the power supply module, the input end of the impedance matching circuit is connected to three-phase alternating current, and the impedance matching circuit The output end of the circuit is connected with the power module.

In yet another embodiment, the impedance matching circuit is at least one, and the power module outputs multiple DC voltages so as to supply power to multiple external devices.

The impedance matching power supply device of the present disclosure can not only supply power to external devices, but also realize impedance matching between the power supply device and external devices. In addition, the configuration of the power supply device of the present disclosure is flexible, and the impedance element and other corresponding connection devices can be easily selected according to different external devices that need to supply power, and the impedance matching circuit can also be arranged at different positions of the power supply module, so as to achieve the matching effect on the power supply. The purpose of impedance matching and timing adjustment of signals in different parts.

Description of drawings

The above and other objects, features and advantages of exemplary embodiments of the present disclosure will become readily understood by reading the following detailed description with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present disclosure are shown by way of example and not limitation, and like or corresponding reference numerals refer to like or corresponding parts, wherein:

FIG. 1 is a schematic structural diagram illustrating an impedance matching power supply device according to an embodiment of the present disclosure;

2 is a two-dimensional structural diagram illustrating an impedance matching circuit according to an embodiment of the present disclosure;

3 is a three-dimensional structural diagram illustrating an impedance matching circuit according to an embodiment of the present disclosure;

4 is an exemplary signal flow diagram illustrating an impedance matching circuit according to an embodiment of the present disclosure;

FIG. 5 is another exemplary signal flow diagram illustrating an impedance matching circuit according to an embodiment of the present disclosure;

6 is a schematic structural diagram illustrating a power supply device with an impedance matching circuit located behind a power supply module according to an embodiment of the present disclosure;

FIG. 7 is a schematic structural diagram illustrating a power supply device including a single-channel power supply module according to an embodiment of the present disclosure;

8 is a schematic diagram illustrating another structure of a power supply device including a single-channel power supply module according to an embodiment of the present disclosure;

9 is a schematic structural diagram illustrating a power supply device including a dual-circuit power supply module according to an embodiment of the present disclosure;

10 is a schematic structural diagram illustrating a power supply device with an impedance matching circuit located before a power supply module according to an embodiment of the present disclosure; and

11 is a schematic structural diagram illustrating a power supply device including a plurality of impedance matching circuits according to an embodiment of the present disclosure.

detailed description

The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present disclosure. Obviously, the described embodiments are some, but not all, embodiments of the present disclosure. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present disclosure.

FIG. 1 is a schematic structural diagram illustrating an impedance matching power supply apparatus 100 according to an embodiment of the present disclosure. It can be understood that although a limited number of impedance elements and grids are depicted in FIG. 1 , the number of impedance elements and grids may be greater or more depending on the external device to which the power supply apparatus of the present disclosure is connected. few. Meanwhile, in order to better understand the structure and function of the present disclosure, an external device is also drawn in FIG. 1 , and the external device is used to receive the DC voltage output by the power supply device of the present disclosure. In addition, impedance matching and timing adjustment can be performed on the internal signal of the external device through the power supply device, so as to realize the distortion-free transmission of the signal.

As shown in FIG. 1 , the power supply apparatus of the present disclosure may include a power supply module 110 and an impedance matching circuit 120 . Wherein, the power module is configured to output a direct current voltage to the external device so as to supply power thereto. The impedance matching circuit is connected to the power supply module and configured to perform impedance matching on the power supply module and the external device when the power supply device is connected to the external device.

Further, each of the impedance matching circuits may include a plurality of impedance elements 121 forming a mesh structure 123 including a mesh 122 having edges 124 and vertices 125 and at least one of the edges It consists of at least one impedance element. The impedance matching circuit further includes at least one input terminal 126, wherein each input terminal is connected to a vertex of the plurality of grids and is used for receiving the DC voltage output by the power module, and/or for receiving signal from the external device. The impedance matching circuit further includes at least one output terminal 127, wherein each output terminal is connected to another vertex in the plurality of meshes, and is used for outputting various signals processed by the impedance matching circuit.

In one embodiment, the grid may be one or more of triangular, quadrilateral, pentagonal, hexagonal, or other shapes. As shown in FIG. 1 , for example, the grid may be a quadrilateral grid composed of 4 sides, and the grid may have 9, which are connected to each other by common sides to form a network structure. The vertex of one corner of the mesh structure can be used as the input terminal of the impedance matching circuit, and the vertex of the other corner of the mesh structure can be used as the output terminal of the impedance matching circuit.

In one embodiment, there may be an impedance element connected by wires on each side of each of the grids. The impedance elements may be arranged in a matrix, for example, a 4×4 matrix, each row of the matrix includes 3 impedance elements, and each column includes 4 impedance elements. At least two of the impedance elements have different impedance values, and the impedance elements may be at least one of the following: capacitance; inductance; capacitance and inductance; resistance and capacitance; resistance and inductance; resistance, capacitance and inductance. The input, output, wires, and impedance elements may constitute multiple paths for signals flowing through the impedance matching circuit.

Further, by configuring the number of the impedance elements and the impedance value, at least two of the multiple signal paths of the impedance matching circuit have different impedance values, and can also be adjusted according to the specific application circuit. The numbers and impedance values of the capacitors, inductors and resistors are configured differently so that each of the plurality of signal paths has a different impedance value. In this way, when signals of different frequencies and/or amplitudes flow through the impedance matching circuit, they can follow different paths with different impedance values from the input end to the output end, thereby realizing the matching between the signals of different frequencies and/or amplitudes and the application circuit. The impedance matching between them ensures that the signal is transmitted without distortion.

In one embodiment, some of the impedance elements of the plurality of impedance elements may be connected to form a filter circuit, so as to perform a noise filtering operation on signals of different frequencies and/or amplitudes flowing therethrough. The filter circuit may include, for example, a low-pass filter circuit composed of a resistor and a capacitor, which is configured to filter out high-frequency noise; or may also include a band-pass filter circuit composed of an inductor and a capacitor, configured to filter out band out-of-band noise from the pass filter circuit.

FIG. 2 is a two-dimensional structural diagram illustrating an impedance matching circuit 200 according to an embodiment of the present disclosure. The impedance matching circuit 200 in FIG. 2 can be understood as an exemplary implementation of the impedance matching circuit 120 in FIG. 1 . Therefore, the details of the impedance matching circuit 120 described in connection with FIG. 1 also apply to the description of the impedance matching circuit 200 in FIG. 2 .

As shown in FIG. 2 , the impedance matching circuit may include a two-dimensional planar mesh structure composed of m rows and n columns, and the impedance elements in the mesh structure may be arranged in a matrix, for example, as shown in FIG. 2 . An m-by-n matrix of , where m and n are positive integers greater than or equal to 2. Specifically, the first row of the m rows may include sequentially arranged impedance elements ZX11, ZX12...ZX1(n-1) and ZX1n, and the second row may include sequentially arranged impedance elements ZX21, ZX22...ZX2(n- 1) and ZX2n, . . ., and so on, the m-th row may include impedance elements ZXm1, ZXm2, . . . ZXm(n-1) and ZXmn arranged in sequence. The first column of the n columns may include sequentially arranged impedance elements ZY11, ZY21...ZY(m-1)1 and ZYm1, and the second column may include sequentially arranged impedance elements ZY12, ZY22...ZY(m-1) 2 and ZYm2, . . . and so on, the nth column may include impedance elements ZY1n, ZY2n, . . . ZY(m-1)n and ZYmn arranged in sequence.

In one embodiment, the four impedance elements may be connected by wires to form a quadrilateral grid, and the grid includes edges and vertices. Further, the two-dimensional plane mesh structure may be formed by interconnecting the quadrilateral meshes, wherein adjacent meshes have a common edge. Specifically, as shown in Figure 2, the impedance elements ZX11, ZX21, ZY11 and ZY12 are sequentially connected to form a quadrilateral grid through wires; similarly, the impedance elements ZX12, ZX22, ZY12 and ZY13 are also sequentially connected to form a quadrilateral grid through wires grid. The two meshes described above have a common edge including the impedance element ZY12, and the two meshes are connected into a mesh structure by this common edge.

In one embodiment, each of the meshes has four vertices. The input end of the impedance matching circuit can be drawn from any vertex of the grid, and is configured to receive a signal input to the impedance matching circuit. It can also be other signals output by external devices. The output terminal of the impedance matching circuit can be drawn from another vertex of the grid, and is configured to output the signal processed by the impedance matching circuit. Further, there may be multiple input terminals, and there may be one or more output terminals, so as to meet the requirements of receiving and outputting multiple channels of the signals. Specifically, for example, the input terminal may be multiple of A, B, C, D, E, F, G and H in FIG. 2 , and the output terminal may be one or more of the A to H and the input and output terminals are different.

In one embodiment, the input terminal and the output terminal of the impedance matching circuit may be respectively connected to different vertices of the grid. In particular, the vertices may be located at the opposite corners of the mesh structure, so that the impedance elements between the input end and the output end form the most combinations, so as to achieve the purpose of more accurate impedance matching. For example, the input end is connected to the A end, and the output end is connected to the F end; or the input end is connected to the B end, and the output end is connected to the E end. With this arrangement, the signal can have a longer path or more impedance elements in the mesh structure, so as to achieve more accurate impedance matching for the signal.

In one embodiment, the input, output, wires, and multiple impedance elements may constitute multiple paths for the signal flowing through the impedance matching circuit. Each of the plurality of impedance elements may include: at least one type of impedance element of capacitance and inductance, and at least one of the at least one type of impedance element may include one or more impedance elements of this type; Or each of the plurality of impedance elements may further include at least two types of impedance elements of capacitance, inductance and resistance, and each of the at least two types of impedance elements includes at least one or Multiple impedance elements of this type.

Further, by configuring the number of the impedance elements and the impedance value, at least two of the multiple paths of the signal of the impedance matching circuit have different impedance values, and can also be adjusted according to the specific application circuit. The numbers and impedance values of the capacitors, inductors and resistors are configured differently so that each of the plurality of signal paths has a different impedance value. In one embodiment, the signal may comprise a composite signal consisting of a plurality of harmonic signals of different frequencies and/or amplitudes, wherein each of the harmonic signals flows through one of the plurality of paths via the input All the way to the output end, so as to perform impedance matching on each of the harmonic signals, thereby ensuring that the signals are transmitted without distortion.

In one embodiment, some of the impedance elements of the plurality of impedance elements may be connected to form a filter circuit, so as to perform an operation of filtering noises on signals of different frequencies and/or amplitudes flowing therethrough. The filter circuit may include, for example, a low-pass filter circuit composed of a resistor and a capacitor, which is configured to filter out high-frequency noise; or may also include a band-pass filter circuit composed of an inductor and a capacitor, configured to filter out band out-of-band noise from the pass filter circuit.

FIG. 3 is a three-dimensional structural diagram illustrating an impedance matching circuit 300 according to an embodiment of the present disclosure. The circuit 300 in FIG. 3 can be understood as an exemplary implementation of the impedance matching circuit 120 in FIG. 1 , and can also be understood as an extended implementation of the impedance matching circuit 200 in FIG. 2 . Therefore, the details of the impedance matching circuits 120 and 200 described in conjunction with FIGS. 1 and 2 also apply to the description of the impedance matching circuit 300 in FIG. 3 .

As an extended implementation manner of the impedance matching circuit 200 in FIG. 2 , the structure of the impedance matching circuit 300 may be a three-dimensional mesh structure formed by sequentially connecting the multiple layers of the mesh structures shown in FIG. 2 . Wherein, the two adjacent layers of the mesh structures are connected by a plurality of impedance elements. In one embodiment, each layer of the mesh structure may be disposed on one board, so that a plurality of the boards are connected to form the three-dimensional mesh structure.

As shown in FIG. 3 , the structure of the impedance matching circuit 300 may be a three-dimensional structure composed of three dimensions X, Y and Z, wherein the X dimension includes m rows, the Y dimension includes n columns, and the Z dimension includes n columns. Above includes t vertical. Each row in the X dimension consists of impedance elements ZXmnt, each column in the Y dimension consists of impedance elements ZYmnt, and each column in the Z dimension consists of impedance elements ZZmnt, where m, n, and t, respectively is a positive integer greater than or equal to 1, in particular, when m=n=t, the three-dimensional structure is a cube.

Specifically, in the X dimension, the first column in the first row may include impedance elements ZX111, ZX121... ZX1(n-1)1 and ZX1n1 arranged in sequence, and the first column in the second row may include impedance elements arranged in sequence ZX211, ZX221...ZX2(n-1)1 and ZX2n1,..., and so on, the m-th row and the first column may include sequentially arranged impedance elements ZXm11, ZXm21... ZXm(n-1)1 and ZXmn1. It can be understood that although the

rows

2, 3...t of row 1,

rows

2, 3...t of row 2 and

rows

2, 3...t of

rows

3, 4...m are not shown in the figure, However, according to the above arrangement rules, the numbers and layout structures of these undrawn impedance elements can be obtained.

In the Y dimension, the first column and the first column may include impedance elements ZY111, ZY211... ... ZY(n-1)21 and ZYn21, . . . and so on, the nth column and the first column may include sequentially arranged impedance elements ZY1n1, ZY2n1...ZY(m-1)n1 and ZYmn1. It can be understood that although the

columns

2, 3...t in the first column, the

columns

2, 3...t in the second column, and the

columns

2, 3...t in the third, 4...m columns are not shown in the figure, However, according to the above arrangement rules, the numbers and layout structures of these undrawn impedance elements can be obtained.

In the Z dimension, the first vertical m-th row may include sequentially arranged impedance elements ZZm11, ZZm21...ZZm(n-1)1 and ZZmn1, and the second vertical m-th row may include sequentially arranged impedance elements ZZm12, ZZm22 ...ZZ m(n-1)2 and ZZmn2, ..., and so on, the t vertical mth row may include sequentially arranged impedance elements ZZm1t, ZZm2t...ZZm(n-1)t and ZZmnt. It can be understood that although the

first row

1, 2...(m-1), the

second row

1, 2...(m-1) and the 3rd, 4...

t row

1, 2...(m -1) Lines are not drawn in the figure, but according to the above arrangement rules, the numbers and layout structures of these undrawn impedance elements can be obtained.

In one embodiment, the input terminal and the output terminal of the impedance matching circuit may be respectively connected to different vertices of the three-dimensional structure. Wherein any two of the different vertices can be far away from each other. In particular, the input end and the output end can be respectively connected to the diagonal vertices of the three-dimensional structure, for example, the input end is connected to the vertex A, and the output end is connected to the vertex F; or the input end is connected to the vertex C, and the output end is connected to the vertex G . Through this arrangement, the impedance elements between the input end and the output end can form the most combinations, so that the signal flows through a longer path or more impedance elements in the three-dimensional structure, so that the more accurate impedance matching of the above-mentioned signals.

In one embodiment, the input terminal, the output terminal, the wires and the plurality of impedance elements may constitute a plurality of three-dimensional paths for the signal flowing through the impedance matching circuit. Each of the plurality of impedance elements may include: at least one type of reactive element of capacitance, inductance, and at least one or more reactive elements of the type are included in the at least one type of impedance element; or Each of the plurality of impedance elements may further include at least two types of impedance elements of capacitance, inductance and resistance, and each of the at least two types of impedance elements includes at least one or more impedance element of this type.

Further, by configuring the number of the impedance elements and the impedance value, at least two of the multiple three-dimensional paths of the signal of the impedance matching circuit have different impedance values, and also according to different specific application circuits, The numbers and impedance values of the capacitors, inductors and resistors are configured differently so that each of the plurality of signal paths has a different impedance value. In one embodiment, the signal may comprise a composite signal consisting of a plurality of harmonic signals of different frequencies and/or amplitudes, wherein each of the harmonic signals flows through one of the plurality of paths via the input All the way to the output end, so as to perform impedance matching on each of the harmonic signals, thereby ensuring that the signals are transmitted without distortion.

FIG. 4 is an exemplary signal flow diagram illustrating an impedance matching circuit according to an embodiment of the present disclosure. It can be understood that the signal flow diagram shown in FIG. 4 is drawn on the basis of the impedance matching circuit shown in FIG. 2 . Therefore, the circuit structure part of the signal flow diagram shown in FIG. 4 is the same as the circuit structure in FIG. 2 . same. For the description of the impedance matching circuit in FIG. 4 , please refer to the related description in FIG. 2 , which will not be repeated here.

As shown in Figure 4, signals of three different frequencies enter the impedance matching circuit of the mesh structure from the input terminal D, then flow through different signal paths formed by impedance elements, and finally output from the output terminal H. In order to distinguish signals of different frequencies, the signals of three different frequencies transmitted in the mesh structure are represented by thick solid lines, thin solid lines and dashed lines, respectively. It can be concluded from Figure 4 that although the signals of three different frequencies represented by the thick solid line, the thin solid line and the dashed line are all input from the input end and all output from the output end, they flow through the mesh structure. different signaling pathways. Since the number of impedance elements and the impedance value of each signal path with different frequencies can be different, the total impedance value of each signal path is also different, so that the impedance matching of the signals of three different frequencies can be realized, and the signal is guaranteed. Distortion-free transmission.

In one embodiment, the signal input to the input terminal may be, for example, one or more composite signals, and the composite signal may be composed of a fundamental signal of a certain frequency and a plurality of harmonic signals of different frequencies. After the composite signal is input to the impedance matching circuit, the fundamental wave and harmonic signals of different frequencies can automatically select paths for transmission according to the different impedance values of the impedance element, so that the fundamental wave and harmonic signals of different frequencies can be respectively for impedance matching purposes. In addition, when fundamental and harmonic signals of different frequencies flow through different types and numbers of impedance elements, the resulting timing will be different. By setting a reasonable number and type of impedance elements, the timing of the fundamental wave and harmonic signals of different frequencies at the output end is consistent with the timing at the input end, so that the synthesized signal can be completely restored at the output end.

In another embodiment, the signal input to the input terminal may also be, for example, multiple harmonic signals of different frequencies, wherein the multiple harmonic signals of different frequencies come from different composite signals respectively; or the signal input to the input terminal It can also be a combination of one or more composite signals and a plurality of harmonic signals of different frequencies, wherein the harmonic signals are respectively derived from another one or more composite signals. Its working principle is the same as the case where the signal input to the input terminal is one or more composite signals, and will not be repeated here.

As a specific implementation manner, the following takes the signal flow direction of a partial circuit in FIG. 4 as an example to illustrate the principle of impedance matching of the signal by the impedance matching circuit. As shown in FIG. 4 , take the thick solid line path formed by ZX11 , ZX21 , ZX31 , ZX32 , ZY11 , ZY12 , ZY21 and ZY22 as an example. Further, for the convenience of description, ignoring the influence of this path on the signal timing, ZX11, ZX21, ZX31 and ZX32 can be set as resistors with a resistance value of 0. In addition, ZY11, ZY12 and ZY21 are set as capacitive element C, and ZY22 is set as resistive element R. Suppose the value of ZY11 is 470uF, the value of ZY12 is 10uF, the value of ZY21 is 220uF, and the value of ZY22 is 1kΩ. Then, the signal flows from the input terminal A to the junction of ZX32 and ZY23. The impedance value of this path is the combined impedance value of 470uF and 10uF in parallel, and then connected in series with the impedance values of 220u and 1k in parallel.

Obviously, on the one hand, by setting different capacitance values and resistance values, the paths of signals of different frequencies can be changed, and then the impedance matching of signals of different frequencies can be performed. On the other hand, it is also possible to adjust the timing changes of signals of different frequencies by setting capacitor values of different sizes and using the capacitors to have timing response differences to signals of different frequencies, so that signals of different frequencies maintain timing consistency. Finally, after the signal flows through the above-mentioned path, it can be ensured that it is transmitted without distortion.

FIG. 5 is another exemplary signal flow diagram illustrating an impedance matching circuit according to an embodiment of the present disclosure. It should be noted that the signal flow diagram of FIG. 5 is an exemplary implementation based on the signal flow diagram of FIG. 4 , wherein the frequencies of the three different signals in FIG. 5 are the same as those of the three different signals in FIG. 4 , and one-to-one correspondence. Different from the signal flow diagram in FIG. 4 , the signals of different frequencies shown in FIG. 5 are different in amplitude from the signals of corresponding frequencies in FIG. 4 . Therefore, even if the signal of the same frequency flows through the same impedance matching circuit, the paths through which it flows are different.

As shown in FIG. 5 , in one embodiment, signals of three different frequencies enter the mesh structure from the input terminal D, then flow through different signal paths formed by impedance elements, and finally output from the output terminal H. In order to distinguish signals of different frequencies, the signals of three different frequencies transmitted in the mesh structure are represented by thick solid lines, thin solid lines and dashed lines, respectively. Comparing with Fig. 4, it can be concluded that the paths of the three different frequency signals in Fig. 5 are not exactly the same as those in Fig. 4, the reason is that the three different frequency signals in Fig. 5 correspond to those in Fig. 4 respectively. The three signals of different frequencies differ in amplitude. Since the number and impedance value of impedance elements on each signal path can be different, the total impedance value of each signal path is also different, thus realizing impedance matching for signals with the same frequency but different amplitudes, ensuring that the signal has no noise. Distorted transmission.

FIG. 6 is a schematic structural diagram illustrating a power supply device 600 with an impedance matching circuit located behind a power supply module according to an embodiment of the present disclosure. In order to better understand the structure and function of the present disclosure, FIG. 6 also depicts an external device for receiving the DC voltage output by the power supply device 600 of the present disclosure for operation. In addition, impedance matching and timing adjustment can be performed on the internal signal of the external device through the power supply device, so as to realize the distortion-free transmission of the signal.

As shown in FIG. 6 , the impedance matching circuit in the power supply device 600 of the present disclosure may be arranged after the power supply module 610 . Specifically, the impedance matching circuit may include two, which are an impedance matching circuit 620 and an impedance matching circuit 621 respectively. The input terminals A and B of the impedance matching circuit 620 are respectively connected to the power module, so as to receive the DC voltage output by the power module. The output terminals E and F of the impedance matching circuit 620 are respectively connected to external devices so as to supply power to the external devices. The input terminal E and the output terminal F of the impedance matching circuit 621 are respectively connected to the external device, so as to perform impedance matching and timing adjustment on the signal output by the external device.

Optionally, according to the different structures of the

impedance matching circuits

620 and 621, the input terminals and the output terminals of the

impedance matching circuits

620 and 621 may also be connected to the vertexes D and H or any other vertexes. In particular, according to different requirements of the external circuit, on the premise that the input terminal and the output terminal are connected to different vertices, the input terminal of the impedance matching circuit can be used as the output terminal, and the output terminal can be used as the input terminal. end.

As a specific embodiment, the power supply device of the present disclosure may have two standard interfaces, one of which is connected to the impedance matching circuit 620 , and the other interface is connected to the impedance matching circuit 621 . When the power supply device works, on the one hand, one of the interfaces is connected with the power supply terminal of the external device to supply power. On the other hand, the other interface is connected to the signal terminal of the external device, so as to perform impedance matching and timing adjustment on the signal output by the external device. The operation principle of the power supply device 600 of the present disclosure is briefly described below.

On the one hand, the power module outputs a DC voltage to the external device through the impedance matching circuit 620 to power it. When the DC voltage passes through the impedance matching circuit, it will first be filtered, stabilized or limited by the impedance matching circuit, thereby providing a stable working voltage or current to the external device. In addition, the DC voltage is processed by the impedance matching circuit 620, so that the impedance matching circuit 620 and the power module form a loop that can be matched in impedance for signals of different frequencies and/or amplitudes. Impedance matching with the external device.

On the other hand, an intermodulation signal including fundamental and harmonic signals with multiple frequency and/or amplitude components generated by an external device flows into the impedance matching circuit 621 through the input terminal E of the impedance matching circuit 621 . In the impedance matching circuit 621, fundamental and harmonic signals of different frequency and/or amplitude components automatically select paths for transmission according to different impedance values, and output from the F terminal, and finally flow to an external device for further processing. In this way, the intermodulation signal of the external device is processed by the impedance matching circuit 621, so that an impedance matching loop is formed between the impedance matching circuit and the external device for intermodulation signals of different frequencies and/or amplitudes , and then perform impedance matching and timing adjustment on the intermodulation signal. Finally, the intermodulation signal of the external device can be transmitted without distortion.

FIG. 7 is a schematic diagram illustrating a structure of a power supply device 700 including a single-circuit power supply module according to an embodiment of the present disclosure. It can be understood that the power supply device 700 shown in FIG. 7 is an embodiment in which the impedance matching circuit is arranged after the power supply module. And the single-channel power supply module in FIG. 7 can also be applied in FIG. 6 , and can replace the corresponding power supply module in FIG. 6 .

As shown in FIG. 7 , in one embodiment, the power supply module may be a single-channel power supply module, which may provide one channel of power supply to an external device. Specifically, the power module 710 may include a transformer 711 and a rectifier circuit 712 . Wherein the transformer may include a primary coil, a secondary coil and an iron core, and is configured to convert the three-phase alternating current high voltage power input to the power supply device into low voltage alternating current power. The rectifier circuit is configured to convert the low-voltage alternating current output from the transformer into direct current. Input terminals A and B of the impedance matching circuit 720 are respectively connected to the positive and negative output terminals of the rectifier circuit, so as to receive the direct current output from the rectifier circuit. The output terminals E and F of the impedance matching circuit are respectively connected to the external device, so as to output the DC signal processed by the external device to the external device. The operation principle of the power supply device 700 of the present disclosure is briefly described below.

First, the external power grid inputs three-phase high-voltage alternating current to the transformer in the power supply device. The three-phase high-voltage alternating current passes through the primary coil of the transformer and induces corresponding magnetic flux in the iron core, and then winds the three-phase high-voltage alternating current on the iron core. The secondary coil then induces the magnetic flux into low-voltage alternating current. Among them, the ratio of the transformer input and output voltage can be adjusted by adjusting the winding ratio of the primary coil and the secondary coil. Next, after the low-voltage alternating current output from the secondary coil of the transformer is transformed by a rectifier bridge inside the rectifier circuit, the low-voltage alternating current is converted into direct current and output to the input terminals A and B of the impedance matching circuit.

Then, on the one hand, the impedance matching circuit filters, stabilizes or limits the direct current, so as to output a stable voltage or current to the external device. On the other hand, the impedance matching circuit, the external circuit and the power supply module form a loop whose impedance can be matched for direct current signals of different frequencies and/or amplitudes, so that the power supply module and the external The device is impedance matched. At the same time, various intermodulation signals generated by external devices can also be input into the impedance matching circuit through the E terminal or the F terminal. After impedance matching and timing adjustment are performed on the impedance matching circuit, the various intermodulation signals can be adjusted The signal is transmitted without distortion.

FIG. 8 is a schematic diagram illustrating another structure of a power supply device 800 including a single-circuit power supply module according to an embodiment of the present disclosure. It can be understood that the power supply device 800 shown in FIG. 8 is another embodiment in which the impedance matching circuit is arranged after the power supply module. And the single-channel power supply module in FIG. 8 can be applied in FIG. 6 , and can replace the corresponding power supply module in FIG. 6 .

As shown in FIG. 8 , in one embodiment, the power supply module may be a single-channel power supply module, which may provide one channel of power supply to an external device. Specifically, the power module 810 may include a battery pack, and is used to provide a single-circuit power supply to the external device. The input terminals A and B of the impedance matching circuit 820 are respectively connected to the positive and negative poles of the battery pack, so as to receive the DC power output by the battery pack. The output terminals E and F of the impedance matching circuit are respectively connected to the external device, so as to output the DC power processed by the external device to the external device. The operation principle of the power supply device 800 of the present disclosure is briefly described below.

First, the battery pack outputs direct current to the impedance matching circuit through the input terminals A and B of the impedance matching circuit. Then, on the one hand, the impedance matching circuit filters, stabilizes or limits the direct current, so as to output a stable voltage or current to an external device. On the other hand, the impedance matching circuit, the external circuit and the power supply module form a loop whose impedance can be matched for direct current signals of different frequencies and/or amplitudes, so that the battery pack and the external The device is impedance matched. At the same time, when the power supply device is connected to an external device, various intermodulation signals generated by the external device can also be input into the impedance matching circuit through the E terminal or the F terminal, and after impedance matching and timing adjustment are performed on the impedance matching circuit. , so as to realize the distortion-free transmission of the various intermodulation signals.

FIG. 9 is a schematic structural diagram illustrating a power supply apparatus 900 including a dual-circuit power supply module according to an embodiment of the present disclosure. It can be understood that the power supply device 900 shown in FIG. 9 is an embodiment in which the impedance matching circuit is arranged after the power supply module, and is an expanded form of the power supply device 700 shown in FIG. 7 . Wherein, the dual-circuit power supply module shown in FIG. 9 can also be applied in FIGS. 6 and 7, and can replace the corresponding power supply module therein.

As shown in FIG. 9 , in one embodiment, the power supply module may be a dual-circuit power supply module, which may provide two-circuit power supplies to external devices for powering them. Specifically, the power module 910 may include a transformer 911 and a rectifier circuit 912 . Wherein the transformer may include a primary coil, a secondary coil and an iron core, and is configured to convert the three-phase alternating current high voltage power input to the power supply device into low voltage alternating current power. The rectifier circuit is configured to convert the low-voltage alternating current output from the transformer into a direct current signal.

Further, the input terminal D of the impedance matching circuit 920 is respectively connected to the positive output terminal of the rectifier circuit and the external device. The other input terminal C of the impedance matching circuit is connected to the center tap of the secondary coil of the transformer, and the input terminal C is connected to the output terminal G and is grounded. The other output terminal H of the impedance matching circuit is connected to the negative output terminal of the rectifier circuit and the external device. Therefore, a loop with impedance matching for signals of different frequencies and/or amplitudes is formed between the impedance matching circuit and the power module, so as to provide two voltages +VCC and -VCC to the external device. At the same time, when the power supply device is connected to an external device, the impedance matching circuit and the external device form a loop whose impedance can be matched for signals of the external device with different frequencies and/or amplitudes. The operation principle of the power supply device 900 of the present disclosure is briefly described below.

First, the external power grid inputs three-phase high-voltage alternating current to the transformer in the power supply device. The three-phase high-voltage alternating current passes through the primary coil of the transformer and induces corresponding magnetic flux in the iron core, and then winds the three-phase high-voltage alternating current on the iron core. The secondary coil then induces the magnetic flux into low-voltage alternating current. Among them, the ratio of the transformer input and output voltage can be adjusted by adjusting the winding ratio of the primary coil and the secondary coil. Next, after the low-voltage alternating current output from the secondary coil of the transformer is transformed by a rectifier bridge inside the rectifier circuit, the low-voltage alternating current AC is converted into direct current and output to the input terminal D of the impedance matching circuit.

Then, on the one hand, the impedance matching circuit filters, stabilizes or limits the direct current, so as to output two stable voltages +VCC and -VCC to the external device. On the other hand, when the power supply device is connected to an external device, the impedance matching circuit, the external circuit and the power supply module form a loop whose impedance can be matched for direct current signals of different frequencies and/or amplitudes, Further, impedance matching is performed on the power module and the external device. At the same time, various intermodulation signals generated by external devices can also be input into the impedance matching circuit through the D terminal. After impedance matching and timing adjustment are performed on the impedance matching circuit, the various intermodulation signals can be distorted without distortion. ground transmission.

FIG. 10 is a schematic structural diagram illustrating a power supply apparatus 1000 with an impedance matching circuit located before a power supply module according to an embodiment of the present disclosure. In order to better understand the structure and function of the present disclosure, FIG. 10 also depicts an externally input three-phase AC high-voltage line and an external device. Wherein, the three-phase AC high-voltage line outputs three-phase AC high-voltage power to the power supply device 1000 . The external device is used to receive the DC power output by the power supply apparatus 1000 of the present disclosure. When the power supply device is connected to an external device, the power supply device can also perform impedance matching and timing adjustment on the signal inside the external device, thereby realizing distortion-free transmission of the signal.

As shown in FIG. 10 , in one embodiment, the power supply module 1010 in the power supply apparatus 1000 of the present disclosure may include a transformer 1011 and a rectification filter circuit 1012 . Wherein, the transformer may include a primary coil, a secondary coil and an iron core, which is configured to convert the three-phase AC high-voltage power input to the power supply device into low-voltage AC power through electromagnetic induction. The rectifying and filtering circuit is configured to convert the low-voltage alternating current output from the transformer into direct current suitable for the operation of the external device.

In one embodiment, the impedance matching circuit 1020 in the power supply apparatus of the present disclosure may be arranged before the power supply module. Specifically, the input terminals A and B of the impedance matching circuit are respectively connected to the L terminal and the N terminal of the three-phase AC high-voltage line, so as to receive the three-phase AC high-voltage power output by the three-phase AC high-voltage line. The output terminals E and F of the impedance matching circuit are respectively connected with the primary coil of the transformer, so as to output the three-phase AC high voltage power processed by the impedance matching circuit to the transformer. The input end of the rectifier and filter circuit is connected to the secondary coil of the transformer, so as to convert the low-voltage alternating current AC output by the transformer into direct current. The output end of the rectifying and filtering circuit is connected to the external device, so as to provide the external device with the DC power required for its operation. The operation principle of the power supply apparatus 1000 of the present disclosure is briefly described below.

First, the external power grid outputs three-phase high-voltage alternating current to the input terminals A and B of the impedance matching circuit. When the three-phase high-voltage alternating current passes through the impedance matching circuit, it will first be filtered, stabilized or limited by the impedance matching circuit, thereby Output a stable voltage or current to the transformer. in addition. The three-phase high-voltage AC power is processed by an impedance matching circuit, so that a loop with impedance matching for signals of different frequencies and/or amplitudes is formed between the impedance matching circuit, the transformer and the three-phase AC high-voltage line, and further Impedance matching is performed between the power supply module and the power grid end where the three-phase AC high-voltage line is located.

FIG. 11 is a schematic structural diagram illustrating a power supply apparatus 1100 including a plurality of impedance matching circuits according to an embodiment of the present disclosure. It can be understood that the power supply device 1100 shown in FIG. 11 may include multiple power supply devices 700 shown in FIG. 7 , or may also include multiple power supply devices 800 shown in FIG. 8 .

Further, the power module in the power supply device can provide multiple DC voltages, and supply power to multiple external devices through one or more impedance matching circuits 1120 . The power module may include a transformer 1111 composed of a primary coil and a plurality of secondary coils and a plurality of rectifier circuits 1112 . And multiple low-voltage alternating currents AC are output through the plurality of secondary coils. The multi-channel low-voltage alternating current AC is converted into multi-channel direct current voltage by the plurality of rectifier circuits, and then output to the plurality of impedance matching circuits. The plurality of impedance matching circuits perform impedance matching and timing adjustment on the multi-channel DC voltage intermodulation signals, so as to supply power to the plurality of external devices. Optionally, the power supply module may further include a voltage conversion module, which is configured to perform voltage conversion on the DC voltage output by the rectifier circuit, so as to output multiple channels of DC voltages with different voltage values to the plurality of external devices. .

It should be understood that the terms "first", "second", "third" and "fourth" in the claims, description and drawings of the present disclosure are used to distinguish different objects, rather than to describe a specific order . The terms "comprising" and "comprising" as used in the specification and claims of the present disclosure indicate the presence of the described feature, integer, step, operation, element and/or component, but do not exclude one or more other features, integers , step, operation, element, component and/or the presence or addition of a collection thereof.

It should also be understood that the terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to limit the present disclosure. As used in this disclosure and the claims, the singular forms "a," "an," and "the" are intended to include the plural unless the context clearly dictates otherwise. It should further be understood that, as used in this disclosure and the claims, the term "and/or" refers to and including any and all possible combinations of one or more of the associated listed items.

As used in this specification and in the claims, the term "if" may be contextually interpreted as "when" or "once" or "in response to determining" or "in response to detecting". Similarly, the phrases "if it is determined" or "if the [described condition or event] is detected" may be interpreted, depending on the context, to mean "once it is determined" or "in response to the determination" or "once the [described condition or event] is detected. ]" or "in response to detection of the [described condition or event]".

Although the embodiments of the present disclosure are as described above, the contents described are only examples adopted to facilitate understanding of the present disclosure, and are not intended to limit the scope and application scenarios of the present disclosure. Any person skilled in the technical field described in this disclosure, without departing from the spirit and scope disclosed in this disclosure, can make any modifications and changes in the form and details of implementation, but the scope of patent protection of this disclosure , still subject to the scope defined by the appended claims.

The foregoing can be better understood in accordance with the following terms:

Clause 1. An impedance matched power supply device comprising:

a power module configured to output a DC voltage to an external device for powering it; and

at least one impedance matching circuit, wherein each said impedance matching circuit includes:

a plurality of impedance elements, the plurality of impedance elements forming a mesh structure including at least one mesh, the mesh having edges and vertices and wherein at least one edge is made up of at least one impedance element;

at least one input, wherein each input is connected to a vertex in the at least one mesh; and at least one output, wherein each output is connected to another vertex of the at least one mesh,

The impedance matching circuit is connected to the power supply module, so that when the power supply device is connected to the external device, impedance matching is performed between the power supply module and the external device.

Clause 2. The power supply apparatus of clause 1, wherein impedance values of at least two of the plurality of impedance elements are different so that the signals from the external device and the DC voltage intermodulation differ in frequency and/or or amplitude of the signal through different paths in the mesh.

Clause 3. The power supply device of Clause 1, wherein the impedance element is at least one of: capacitance; inductance; capacitance and inductance; resistance and capacitance; resistance and inductance; and resistance, capacitance, and inductance.

Clause 4. The power supply device of Clause 1, wherein the input and output terminals of the impedance element are connected to vertices at opposite corners of the impedance matching circuit such that the voltage between the input and output terminals is Impedance elements form the most combinations.

Clause 5. The power supply device of clause 1, wherein the power supply module includes a transformer and a rectifier circuit, or includes a battery pack.

Item 6. The power supply device according to Item 5, wherein the impedance matching circuit is arranged after the power supply module, an input end of the impedance matching circuit is connected to the rectifier circuit or a battery pack, and the impedance matching circuit is The output terminal is connected to the external device.

Item 7. The power supply device according to Item 6, wherein the power supply module is a single-channel power supply module, at least one input end of the impedance matching circuit is connected to the rectifier circuit or the battery pack, and the impedance matching circuit has At least one output is connected to the external device.

Item 8. The power supply device according to Item 6, wherein, when the power supply module includes a transformer and a rectifier circuit, the power supply module is a dual-circuit power supply module, and one input end of the impedance matching circuit is connected to the rectifier circuit connection, the other input end is connected to the transformer, one output end of the impedance matching circuit is connected to the external device, and the other output end is grounded.

Item 9. The power supply device of Item 5, wherein, when the power supply module includes a transformer and a rectifier circuit, the impedance matching circuit is arranged before the power supply module, and the input terminal of the impedance matching circuit is connected to the three-phase circuit. AC connection, and the output end of the impedance matching circuit is connected with the power module.

Item 10. The power supply device according to any one of Items 1 to 9, wherein the impedance matching circuit is at least one, and the power supply module outputs multiple DC voltages to supply power to a plurality of external devices.

Claims

An impedance matching power supply device, comprising:

a power module configured to output a DC voltage to an external device for powering it; and

at least one impedance matching circuit, wherein each said impedance matching circuit includes:

a plurality of impedance elements, the plurality of impedance elements forming a mesh structure including at least one mesh, the mesh having edges and vertices and wherein at least one edge is made up of at least one impedance element;

at least one input, wherein each input is connected to a vertex in the at least one mesh; and

at least one output, wherein each output is connected to another vertex in the at least one mesh,

The impedance matching circuit is connected to the power supply module, so that when the power supply device is connected to the external device, impedance matching is performed between the power supply module and the external device.
The power supply device according to claim 1, wherein impedance values of at least two of the plurality of impedance elements are different to cause different frequencies and/or amplitudes in the signal from the external device and the DC voltage intermodulation The signals travel through different paths in the mesh structure.
The power supply device of claim 1, wherein the impedance element is at least one of the following: capacitance; inductance; capacitance and inductance; resistance and capacitance; resistance and inductance; and resistance, capacitance and inductance.
The power supply device according to claim 1, wherein the input terminal and the output terminal of the impedance element are connected to vertices at opposite corners of the impedance matching circuit such that the impedance element between the input terminal and the output terminal is connected form the most combinations.
The power supply device of claim 1, wherein the power supply module includes a transformer and a rectifier circuit, or includes a battery pack.
The power supply device according to claim 5, wherein the impedance matching circuit is arranged after the power supply module, the input end of the impedance matching circuit is connected to the rectifier circuit or the battery pack, and the output of the impedance matching circuit is connected to the rectifier circuit or the battery pack. The terminal is connected to the external device.
The power supply device according to claim 6, wherein the power supply module is a single-channel power supply module, at least one input end of the impedance matching circuit is connected to the rectifier circuit or the battery pack, and at least one of the impedance matching circuit The output terminal is connected to the external device.
The power supply device according to claim 6, wherein, when the power supply module includes a transformer and a rectifier circuit, the power supply module is a dual-circuit power supply module, and one input end of the impedance matching circuit is connected to the rectifier circuit, The other input terminal is connected to the transformer, one output terminal of the impedance matching circuit is connected to the external device, and the other output terminal is grounded.
The power supply device according to claim 5, wherein, when the power supply module includes a transformer and a rectifier circuit, the impedance matching circuit is arranged before the power supply module, and an input end of the impedance matching circuit is connected to three-phase alternating current , the output end of the impedance matching circuit is connected to the power supply module.
The power supply device according to any one of claims 1 to 9, wherein the impedance matching circuit is at least one, and the power supply module outputs multiple DC voltages to supply power to a plurality of external devices.