WO2021228089A1 - Case and electronic device - Google Patents

Abstract

A case (2) and an electronic device, relating to the technical field of electronic devices. When a certain part of a fan (4) of the electronic device is damaged or the fan (4) opposite a certain part of the case (2) is pulled out due to maintenance being carried out on the certain part of the case (2), the case (2) corresponding to the certain part of the fan (4) can be cooled. The case (2) comprises a housing (21) and a circuit assembly (24); a first opening (211) and a second opening (212) are respectively provided in two ends of the housing (21) in a first direction; a first cavity (213) communicating the first opening (211) and the second opening (212) is defined by the housing (21); the housing (21) comprises a first side wall (214) and a second side wall (215) that are parallel to each other and are oppositely arranged; the first side wall (214) and the second side wall (215) are both parallel to the first direction; a first through hole (22) is provided in the first side wall (214); a second through hole (23) is provided in the second side wall (215); and the circuit assembly (24) is arranged in the first cavity (213). The case (2) is used for realizing some or all of the functions of the electronic device.

Description

Case and electronic equipment

This application claims the priority of a Chinese patent application filed with the Chinese Patent Office on May 11, 2020, the application number is 202010396476.7, and the application name is "a case and electronic equipment", the entire content of which is incorporated into this application by reference.

Technical field

This application relates to the technical field of electronic equipment, and in particular to a case and electronic equipment.

Background technique

In a data center, there are electronic devices such as storage, servers, and network switches. These electronic devices include a chassis and multiple chassis stacked in the chassis, and these chassis are used to implement part of the functions of storage, servers, and network switches. These enclosures will generate a lot of heat during operation. If this heat is not discharged in time, it will cause severe overheating and paralysis of some enclosures and even the entire electronic equipment.

In order to dissipate the heat generated by multiple cabinets, a fan array is usually arranged on the housing of the machine frame. The fan array includes a plurality of fans arranged in an array. When the fan array is working, it can drive the outside air into the The multiple chassis in the chassis are discharged out of the chassis after heat exchange.

However, when one or more fans in the fan array are damaged, or one or more fans in the fan array are unplugged to maintain an electronic device (such as a hard disk) on one or more chassis corresponding to the fan At this time, the one or more cabinets are in a windless environment, so they are easily burned out during operation.

Summary of the invention

The present application provides a chassis and electronic equipment, which can cool the chassis corresponding to the part of the fan when a certain part of the fan of the electronic equipment is damaged or the fan opposite to the part of the chassis is unplugged due to maintenance of a certain part of the chassis, so as to avoid The chassis corresponding to this part of the fan was burned out.

In order to achieve the foregoing objectives, the following technical solutions are adopted in the embodiments of the present application:

In the first aspect, some embodiments of the present application provide a case, which includes a case and a circuit component; both ends of the case along the first direction are respectively provided with a first opening and a second opening, and the case surrounds the second opening. An opening and a first cavity of the second opening, the housing includes a first side wall and a second side wall, the first side wall and the second side wall are both parallel to the first direction, and the first side wall Parallel to and opposite to the second side wall, at least one first through hole is provided on the first side wall, and at least one second through hole is provided on the second side wall; the circuit component is arranged in the first cavity, and the circuit The component does not block between the first opening and the second opening, between the at least one first through hole and the first opening, between the at least one first through hole and the second opening, and the at least one second through hole and A communication path passing through the first cavity between the first openings and between the at least one second through hole and the second opening.

Wherein, the number of at least part of the first through hole in the at least one first through hole is equal to the number of at least part of the second through hole in the at least one second through hole, and the at least part of the first through hole is the same as the at least part of the second through hole. The second through holes have a one-to-one correspondence, and the projection area of each first through hole in the at least part of the first through hole on the plane where the second side wall is located is the same as the second through hole corresponding to the first through hole in the first through hole. At least part of the occupied area on the plane where the two side walls are located overlaps.

In the case provided by the embodiment of the present application, the case of the case encloses an independent air duct. When multiple cases are stacked and installed in an electronic device, the stacking direction of the multiple cases is aligned with the first of the case of each case. One side wall is vertical, and when the outer surfaces of the first side walls of a plurality of cabinets have the same orientation, among two adjacent cabinets, the first side wall of one cabinet is attached to the second side wall of the other cabinet. At least part of the first through hole in the at least one first through hole on the side wall is aligned with at least part of the second through hole in the at least one second through hole on the second side wall. Therefore, when a part of the fans in the fan array in the electronic device is damaged, or a part of the fans is unplugged to maintain at least one chassis corresponding to the part of the fans, at least part of the first through holes or At least part of the second through holes supply air to the at least one cabinet, so that the at least one cabinet can be cooled, thereby preventing the at least one cabinet from being burnt out.

Optionally, at least one first through hole is provided on an end of the first side wall close to the first opening, and at least one second through hole is provided on an end of the second side wall close to the first opening. In this way, when the case is applied to an electronic device, the first opening of the case can be directed toward the air inlet of the frame, so that at least part of the first through holes or at least part of the second through holes can enter or flee sideways. The temperature of the outgoing airflow is lower and the pressure is higher, which can effectively cool the case.

Optionally, a first door body is provided at the at least one first through hole, and the first door body is used to open or close the at least one first through hole, and no door body is provided at the at least one second through hole; or, At least one first through hole is not provided with a door body, at least one second through hole is provided with a second door body, and the second door body is used to open or close the at least one second through hole; or, at least one first through hole The through hole is provided with a first door body, the first door body is used to open or close the at least one first through hole, and the at least one second through hole is provided with a second door body, the second door body is used to open Or close the at least one second through hole. In this way, the first door body or the second door body can be used to control the air flow from laterally entering or exiting from the at least one first through hole or the at least one second through hole.

Optionally, the chassis further includes a shielding structure; the shielding structure is disposed at the first opening, and the shielding structure can move between the first position and the second position. When the shielding structure is in the first position, the shielding structure is not shielded The first opening, when the shielding structure is in the second position, the shielding structure partially shields the first opening. In this way, when the case is applied to an electronic device, when the fan corresponding to the case is running normally, the shielding structure of the case can be driven to move to the first position to prevent the shielding structure from blocking the entry into the first cavity from the first opening The airflow to ensure the effectiveness of cooling. When the fan corresponding to the chassis fails or is unplugged, the shielding structure of the chassis can be driven to move to the second position, so as to avoid at least part of the first through hole or at least one of the at least one first through hole of the chassis. At least part of the second through-holes in the second through-holes in the lateral direction of the air flow is exhausted from the first opening of the chassis, resulting in failure to effectively cool the at least one first through-hole in the chassis and the second opening of the chassis Between the part of the circuit assembly inside the housing.

Optionally, the shielding structure includes a plurality of baffles arranged at intervals along a direction perpendicular to the first direction and parallel to the first side wall, and the plurality of baffles are all perpendicular to the first side wall. Each of the two baffles can be rotatably connected to the housing or the circuit assembly, the rotation axis of each baffle is perpendicular to the first side wall, and each baffle can be parallel to the first side wall around its own rotation axis. Rotate between a position in one direction and a position perpendicular to the first direction; when each of the plurality of blocking pieces is parallel to the first direction, the blocking structure is located at the first position; when the plurality of blocking pieces When each of the baffles in is perpendicular to the first direction, the shielding structure is located at the second position. This structure is simple, easy to implement, and occupies a small space.

Optionally, the circuit assembly includes a hard disk unit and a central processing unit, the hard disk unit is electrically connected to the central processing unit; the hard disk unit is arranged in an end of the housing close to the first opening, and the central processing unit is arranged in the housing close to the second opening Inside one end.

Optionally, the hard disk unit as a whole is slidably connected in the housing along a direction parallel to the first direction. In this way, when the hard disk in the hard disk unit needs to be maintained, the hard disk unit can be drawn out from the first opening to facilitate maintenance of the hard disk in the hard disk unit.

Optionally, the hard disk unit includes a plurality of hard disks stacked and spaced in a direction parallel to the first side wall and perpendicular to the first direction; at least one first through hole and at least one second through hole are connected to two adjacent hard disks. The gap between them is opposite. In this way, there is no interference between the at least one first through hole and the plurality of hard disks, and between the at least one second through hole and the plurality of hard disks, which facilitates lateral movement through the at least one first through hole or the at least one second through hole. Airflow entering or exiting sideways.

In a second aspect, some embodiments of the present application provide a chassis, which includes a substrate and a circuit component; the two edges of the substrate in the first direction are a first edge and a second edge respectively, and at least one through hole is provided on the substrate; The circuit component is arranged on the substrate, and the circuit component does not block the at least one through hole.

When multiple cabinets are stacked and installed in an electronic device, there are gaps between the substrates of two adjacent cabinets, and between the substrate of the uppermost cabinet and the top wall of the frame, and these gaps form independent air ducts. The circuit components are located in these air ducts, and these air ducts can let in or out the wind laterally through at least one through hole. Therefore, when a part of the fans in the fan array in the electronic device is damaged, or a part of the fans is unplugged to maintain at least one chassis corresponding to the part of the fans, it can pass through at least one through hole of the at least one chassis or be adjacent to the at least one chassis The at least one through hole of the chassis provides lateral air supply to the at least one chassis, so as to effectively cool the at least one chassis.

Optionally, at least one through hole is provided close to the first edge. In this way, when the chassis is applied to an electronic device, the first edge of the substrate of the chassis can be directed toward the air inlet of the chassis, so that the temperature of the airflow that enters or exits from the at least one through hole sideways is lower. , The pressure is high, which can effectively cool the case.

Optionally, at least one through hole is provided with a damper, and the damper is used to open or close the at least one through hole. In this way, the lateral flow of the airflow can be controlled through the door.

Optionally, the chassis further includes a shielding structure; the shielding structure is arranged on the first edge of the substrate, and the shielding structure can move between the first position and the second position. When the shielding structure is in the first position, the shielding structure is not covered by the circuit. The side of the component close to the first edge shields the circuit component. When the shielding structure is in the second position, the shielding structure partially shields the circuit component by the side of the circuit component close to the first border. In this way, when the chassis is applied to an electronic device, when the fan corresponding to the chassis is operating normally, the shielding structure can be driven to move to the first position, so as to prevent the shielding structure from blocking the entry between the substrates of two adjacent chassis The air flow in the air duct ensures the cooling efficiency of the circuit components. When the fan corresponding to the chassis fails or is unplugged, the shielding structure can be driven to move to the second position to prevent the airflow from at least one through hole into the adjacent air duct from being approached by the adjacent air duct. One end of the first edge is discharged, so that the circuit components on the part of the substrate between the at least one through hole of the case and the second edge of the case cannot be effectively cooled.

Optionally, the shielding structure includes a plurality of baffles arranged at intervals along a direction perpendicular to the first direction and parallel to the substrate, and the plurality of baffles are all perpendicular to the substrate, and of the plurality of baffles Each baffle can be rotatably connected to the substrate or circuit assembly, the rotation axis of each baffle is perpendicular to the substrate, and each baffle can rotate around its axis of rotation in a position parallel to the first direction and perpendicular to the Rotate between positions in the first direction; when each of the plurality of baffles is parallel to the first direction, the shielding structure is located at the first position; when each of the plurality of baffles is vertical When in the first direction, the shielding structure is located at the second position. This structure is simple, easy to implement, and occupies a small space.

Optionally, the circuit assembly includes a hard disk unit and a central processing unit, the hard disk unit is electrically connected to the central processing unit; the hard disk unit is arranged on a part of the substrate close to the first edge, and the central processing unit is arranged on the substrate close to the second edge Part of it.

Optionally, the hard disk unit includes a plurality of hard disks stacked and spaced in a direction perpendicular to the first direction and parallel to the substrate; at least one through hole is opposite to the gap between two adjacent hard disk units. In this way, there is no interference between the at least one through hole and the plurality of hard disks, and it is convenient for the at least one through hole to enter or exit the air flow laterally.

In a third aspect, some embodiments of the present application provide an electronic device, which includes a machine frame, a plurality of cabinets, and a plurality of fans; the two ends of the machine frame along the second direction are respectively provided with a third opening and a fourth opening, The machine frame encloses a second cavity, one end of the second cavity facing the third opening communicates with the third opening, and one end of the second cavity facing the fourth opening communicates with the fourth opening; each of the multiple cabinets The cabinets are all the cabinets described in any one of the above-mentioned first aspects. A plurality of cabinets are stacked and installed in the second cavity, and the stacking direction of the multiple cabinets is perpendicular to the second direction. The first side walls of each of the multiple cabinets are vertical, the outer surfaces of the first side walls of the multiple cabinets face the same orientation, the first openings of the multiple cabinets all face the third opening of the frame, and the second The openings all face the fourth opening; a plurality of fan arrays are arranged in the third opening, and the air outlet surfaces of the plurality of fans are opposite to the first openings of the plurality of cabinets, or the plurality of fan arrays are arranged in the fourth opening, and The air inlet surface of each fan is opposite to the second openings of the multiple cabinets.

Since the chassis used in the electronic device of the embodiment of the present application is the same as the chassis described in any one of the technical solutions in the first aspect, the two can solve the same technical problem and achieve the same expected effect.

Optionally, the second cavity is disposed close to the third opening, and an end of the second cavity facing the third opening is directly connected with the third opening. The end of the second cavity facing away from the third opening is provided with a back plate. The back plate is a hollow circuit board. The back plate is provided with a plurality of first plug-in connectors and a plurality of second plug-in connectors. The side of the board away from the second cavity forms a third cavity; a plurality of chassis are respectively plugged into the plurality of plug-in connectors; the electronic device further includes a plurality of input/output cards, and the plurality of input/output cards are respectively It is plugged into a plurality of second plug-in connectors. In this way, electrical connections between multiple chassis and multiple input/output cards are realized through the backplane.

In a fourth aspect, some embodiments of the present application provide an electronic device that includes a machine frame, a plurality of cabinets, and a plurality of fans; the two ends of the machine frame along the second direction are respectively provided with a third opening and a fourth opening, The machine frame encloses a second cavity, one end of the second cavity facing the third opening communicates with the third opening, and one end of the second cavity facing the fourth opening communicates with the fourth opening; each of the plurality of cabinets Each of the cabinets is the cabinet described in any one of the technical solutions in the second aspect, multiple cabinets are stacked and installed in the second cavity, and the stacking direction of the multiple cabinets is perpendicular to the second direction, and the stacking direction of the multiple cabinets is perpendicular to the second direction. The base plate of each of the multiple cabinets is vertical, the first edge of the base plate of the multiple cabinets is set close to the third opening of the machine frame, and the second edge of the base plate of the multiple cabinets is set close to the fourth opening; a plurality of fan arrays It is arranged in the third opening, and the air outlet surfaces of the plurality of fans are facing the first edge of the base plate of the plurality of chassis, or the plurality of fan arrays are arranged in the fourth opening, and the air inlet faces of the plurality of fans are facing the plurality of chassis The second edge of the substrate.

Since the chassis used in the electronic device of the embodiment of the present application is the same as the chassis described in any of the technical solutions in the second aspect, the two can solve the same technical problems and achieve the same expected effects.

Description of the drawings

FIG. 1 is a schematic diagram of the structure of an electronic device provided by some embodiments of the application;

Fig. 2 is a schematic diagram of a structure of the electronic device shown in Fig. 1 after removing the fan array;

FIG. 3 is a schematic structural diagram of a first type of chassis provided by some embodiments of this application;

FIG. 4 is a schematic structural diagram of a second type of chassis provided by some embodiments of the application;

5 is a schematic diagram of another structure of the electronic device shown in FIG. 1 after removing the fan array;

FIG. 6 is a schematic structural diagram of an electronic device provided by some embodiments of the application;

FIG. 7 is a cross-sectional view of the electronic device shown in FIG. 6;

FIG. 8 is a schematic structural diagram of a chassis provided by some embodiments of the application;

Fig. 9 is a schematic structural diagram of the chassis shown in Fig. 8 after the first side wall is removed;

10 is a schematic diagram of the structure when multiple cabinets shown in FIG. 8 are stacked and installed in the second cavity of the electronic device shown in FIG. 7;

11 is a schematic diagram of the structure of the electronic device shown in FIG. 10 when a part of the fan is unplugged;

FIG. 12 is a schematic structural diagram of a chassis provided by still other embodiments of the application after the first side wall is removed and the shielding structure is in the first position;

Figure 13 is a schematic structural diagram of the chassis shown in Figure 12 when the shielding structure is in the second position;

14 is a schematic structural diagram of a chassis provided by still other embodiments of the application after the first side wall is removed and the shielding structure is in the first position;

15 is a schematic structural diagram of the chassis shown in FIG. 14 when the shielding structure is in the second position;

16 is a schematic structural diagram of a chassis provided by still other embodiments of the application after the first side wall is removed and the shielding structure is in the first position;

Figure 17 is a schematic structural diagram of the chassis shown in Figure 16 when the shielding structure is in the second position;

FIG. 18 is a schematic structural diagram of a chassis provided by still other embodiments of the application;

FIG. 19 is a cross-sectional view of an electronic device provided by still other embodiments of the application;

20 is a schematic diagram of the structure of the electronic device shown in FIG. 19 when a part of the fan is unplugged;

FIG. 21 is a schematic structural diagram of a chassis provided by other embodiments of the application when the shielding structure is in the first position; FIG.

Figure 22 is a schematic structural diagram of the chassis shown in Figure 21 when the shielding structure is in the second position;

FIG. 23 is a schematic structural diagram of a chassis provided by still other embodiments of the application when the shielding structure is in the first position; FIG.

24 is a schematic structural diagram of the chassis shown in FIG. 23 when the shielding structure is in the second position;

FIG. 25 is a schematic structural diagram of a chassis provided by other embodiments of the application when the shielding structure is in the first position; FIG.

Fig. 26 is a schematic structural diagram of the chassis shown in Fig. 25 when the shielding structure is in the second position.

Detailed ways

In the embodiments of the present application, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of these features.

In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection or a fixed connection. Removable connection, or integral connection; can be directly connected, or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above-mentioned terms in the embodiments of the present application can be understood under specific circumstances.

In the data center, there are not only electronic equipment such as storage devices, servers, and network switches, but also cold air channels and hot air channels. FIG. 1 is a schematic structural diagram of an electronic device 01 provided by some embodiments of the application, and FIG. 2 is a schematic structural diagram of the electronic device 01 shown in FIG. 1 after removing the fan array 013. As shown in Figures 1 and 2, the electronic device 01 includes a chassis 011, a chassis 012, and a fan array 013. The front and rear ends of the chassis 011 are open. When the electronic device 01 is installed in the data center, the front opening of the chassis 011 faces the cold air duct (not shown in the figure), and the rear opening of the chassis 011 faces the hot air duct ( Not shown in the figure). The chassis 012 is stacked and installed in the chassis 011. As shown in FIG. When the fan array 013 is working, it can drive the cold air flow in the cold air channel from the front opening of the frame 011 into the frame 011, and exchange heat with the multiple enclosures 012 in the frame 011. The end opening is discharged to the hot air channel.

Among them, the chassis mainly has the following two structures:

FIG. 3 is a schematic structural diagram of the first type of chassis provided by some embodiments of the application, and the chassis is a schematic structural diagram of the chassis in the electronic device 01 shown in FIG. 2. As shown in FIG. 3, the chassis 012 includes a housing 0121 and a circuit component 0122 installed in the housing 0121, and opposite ends of the housing 0121 are open. When multiple chassis 012 shown in FIG. 3 are stacked and installed in the chassis 011, as shown in FIG. The rear end is open. In this way, the housing 0121 of each chassis 012 encloses an independent air duct. When the fan array 013 (as shown in Figure 1) is running, the cold air flow in the cold air duct enters multiple independent air ducts from the front opening of the chassis 011. After heat exchange with circuit components 0122 in multiple independent air ducts, it is discharged from the rear end opening of the machine frame 011 to the hot air duct. When one or more fans in the fan array 013 are damaged, or one or more fans in the fan array are unplugged to maintain an electronic device (such as a hard disk) in one or more chassis 012 corresponding to the fan ), there is no wind in the independent air duct of the chassis 012 corresponding to the one or more fans. During the operation of the circuit component 0122 in the independent air duct, the circuit component 0122 in the independent air duct cannot be quickly dissipated due to the inability to quickly dissipate heat in the independent air duct. Burn out.

FIG. 4 is a schematic structural diagram of a second type of chassis provided by some embodiments of the application. As shown in FIG. 4, the chassis 012 includes a supporting board 0123 and a circuit component 0122 installed on the supporting board 0123. When multiple chassis 012 shown in FIG. 4 are stacked and installed in the chassis 011, as shown in FIG. The rear end is open, and there is a gap between two adjacent cases 012. In this way, every two adjacent chassis 012 and the side walls of the machine frame 011 form an independent air duct. When the fan array 013 (as shown in Figure 1) is running, the cold air flow in the cold air duct is opened from the front end of the machine frame 011. After entering into the multiple independent air ducts and performing heat exchange with the circuit components 0122 in the multiple independent air ducts, it is discharged from the rear end opening of the machine frame 011 to the hot air duct. When one or more fans in the fan array 013 are damaged, or one or more fans in the fan array 013 are unplugged to maintain an electronic device (such as When the hard disk), there is no wind in the independent air duct of the chassis 012 corresponding to the one or more fans. The circuit component 0122 in the independent air duct cannot quickly dissipate heat in the independent air duct during operation. Burned out.

In order to avoid the above-mentioned problems, the present application provides an electronic device, which is applied to a data center, and the electronic device includes, but is not limited to, a server, a memory, and a switch.

FIG. 6 is a schematic structural diagram of an electronic device provided by some embodiments of the application. As shown in FIG. 6, the electronic device includes a machine frame 1. The machine frame 1 includes, but is not limited to, a metal machine frame and a plastic machine frame. The two ends of the machine frame 1 along the second direction (the Y direction shown in FIGS. 6 and 7) are respectively provided with a third opening 11 and a fourth opening 12 . In the electronic device of the embodiment of the present application, the third opening 11 faces the cold air channel, and the fourth opening 12 faces the hot air channel.

Fig. 7 is a cross-sectional view of the electronic device shown in Fig. 6. As shown in Fig. 7, the machine frame 1 encloses a second cavity 13, the end of the second cavity 13 facing the third opening 11 communicates with the third opening 11, and the end of the second cavity 13 facing the fourth opening 12 is connected to The fourth opening 12 communicates.

The end of the second cavity 13 facing the third opening 11 may directly communicate with the third opening 11, or may be indirectly communicated with the third opening 11 through other cavities or hollow structures, which is not specifically limited here.

The end of the second cavity 13 facing the fourth opening 12 may directly communicate with the fourth opening 12, or may be indirectly communicated with the fourth opening 12 through other cavities or hollow structures, which is not specifically limited here.

The second cavity 13 can be arranged close to the third opening 11, can also be arranged close to the fourth opening 12, or can be arranged in the middle of the machine frame 1 in the second direction, which is not specifically limited here, as long as the second cavity 13 The end facing the third opening 11 communicates with the third opening 11, and the end facing the fourth opening 12 of the second cavity 13 communicates with the fourth opening 12.

In some embodiments, as shown in FIG. 7, the second cavity 13 is disposed close to the third opening 11, and the end of the second cavity 13 facing the third opening 11 is directly connected to the third opening 11. An end of the second cavity 13 facing away from the third opening 11 is provided with a back plate 14, and the back plate 14 is a hollow plate. A third cavity 15 is formed on the side of the back plate 14 away from the second cavity 13. In this way, the end of the second cavity 13 close to the fourth opening 12 is indirectly communicated with the fourth opening 12 through the hollow area on the back plate 14 and the third cavity 15.

As shown in FIG. 7, the electronic device further includes a plurality of cabinets 2, the multiple cabinets 2 are stacked and installed in the second cavity 13, and the stacking direction of the multiple cabinets 2 is perpendicular to the second direction. The multiple cases 2 can be inserted into or pulled out of the second cavity 13 through the third opening 11, and can also be installed in the second cavity 13 in other ways, which is not specifically limited here.

The number of chassis 2 included in the electronic device can be two, three, four, five, etc., which is not specifically limited here. FIG. 7 only shows an example in which the electronic device includes two chassis 2 and does not limit the application.

In some embodiments, as shown in FIG. 7, the backplane 14 is a hollow circuit board, and a plurality of first plug-in connectors 141 are provided on the backplane 14. When multiple cabinets 2 are inserted into the second cavity 13 through the third opening 11, the multiple cabinets 2 can be plugged into the multiple first plug-in connectors 141 respectively to realize multiple cabinets 2 and backplanes. The interconnection between 14.

As shown in FIG. 7, the electronic device further includes a plurality of input/output cards 3, the plurality of input/output cards 3 are stacked and installed in the third cavity 15, and the stacking direction of the plurality of input/output cards 3 is the same as the second direction. vertical. The multiple input/output cards 3 can be inserted into or pulled out of the third cavity 15 through the fourth opening 12, and can also be installed in the third cavity 15 in other ways, which is not specifically limited here.

In some embodiments, as shown in FIG. 7, a plurality of second plug-in connectors 142 are provided on the backplane. When a plurality of input/output cards 3 are inserted into the third cavity 15 through the fourth opening 12, the plurality of input/output cards 3 can be inserted into the plurality of second plug-in connectors 142 respectively to The interconnection between the multiple input/output cards 3 and the backplane 14 is realized, and the interconnection between the multiple chassis 2 through the backplane 14 is realized.

The terminals of the multiple input/output cards 3 face the fourth opening 12. In this way, the connecting wires of the multiple input/output cards 3 can be led out through the fourth opening 12, which is convenient for lead management.

As shown in FIGS. 6 and 7, the electronic device further includes a plurality of fans 4, the plurality of fans 4 are arranged in an array in the third opening 11 of the machine frame 1, and the air outlet surfaces of the plurality of fans 4 and the plurality of cabinets 2 relatively.

In this way, when multiple fans 4 are running, the cold air flow from the outside can flow into the second cavity 13 through the third opening 11 to exchange heat with the multiple chassis 2 in the second cavity 13. The air flow passes through the hollow area on the back plate 14 and the third cavity 15 is discharged from the fourth opening 12.

It should be noted that multiple fans 4 may also be arranged in the fourth opening 12 of the machine frame 1 in an array form. At this time, the air inlet surfaces of the multiple fans 4 are opposite to the multiple chassis 2. Fig. 6 and Fig. 7 only show an example of the arrangement positions of the multiple fans 4, and do not limit the application.

The application also provides a chassis, which is used to implement part or all of the functions in the electronic device.

FIG. 8 is a schematic structural diagram of a chassis provided by some embodiments of the application. The chassis is an example of a chassis in the electronic device shown in FIG. 7. As shown in FIG. 8, the case 2 includes a housing 21. The housing 21 includes, but is not limited to, a metal housing and a plastic housing. The two ends of the housing 21 along the first direction (that is, the X direction shown in FIG. 8) are respectively provided with a first opening 211 and a second opening 212. The housing 21 encloses a first cavity 213 connecting the first opening 211 and the second opening 212. The housing 21 includes a first side wall 214 and a second side wall 215, the first side wall 214 and the second side wall 215 are both parallel to the first direction, and the first side wall 214 and the second side wall 215 are parallel and opposite to each other. At least one first through hole 22 is provided on the first side wall 214. Fig. 9 is a schematic structural diagram of the chassis shown in Fig. 8 after the first side wall is removed. As shown in FIG. 9, at least one second through hole 23 is provided on the second side wall 215.

Wherein, the number of at least part of the first through holes 22 in the at least one first through hole 22 is equal to the number of at least part of the second through holes 23 in the at least one second through hole 23, and the at least part of the first through holes 22 corresponds to the at least part of the second through holes 23, and the projection area of each first through hole 22 in the at least part of the first through holes 22 on the plane where the second side wall 215 is located is the same as the first through hole. The second through hole 23 corresponding to the hole 22 overlaps at least a part of the occupied area on the plane where the second side wall 215 is located. Specifically, this embodiment includes the following four implementation modes:

In the first implementation manner, the number of all first through holes 22 in the at least one first through hole 22 is equal to the number of all second through holes 23 in the at least one second through hole 23, and the at least one first through hole 23 All the first through holes 22 in the through holes 22 correspond to all the second through holes 23 in the at least one second through hole 23, and each first through hole 22 in the at least one first through hole 22 is The projection area on the plane where the second side wall 215 is located overlaps with all or part of the area occupied by the second through hole 23 corresponding to the first through hole 22 on the plane where the second side wall 215 is located.

In the second implementation manner, the number of all the first through holes 22 in the at least one first through hole 22 is equal to the number of part of the second through holes 23 in the at least one second through hole 23, and the at least one first through hole 23 All the first through holes 22 in the through holes 22 correspond to a part of the second through holes 23 in the at least one second through hole 23, and each of the first through holes 22 in the at least one first through hole 22 is The projection area on the plane where the second side wall 215 is located overlaps with all or part of the area occupied by the second through hole 23 corresponding to the first through hole 22 on the plane where the second side wall 215 is located.

In a third implementation manner, the number of part of the first through holes 22 in the at least one first through hole 22 is equal to the number of all the second through holes 23 in the at least one second through hole 23, and the part of the first through holes 23 The holes 22 correspond to all the second through holes 23 in the at least one second through hole 23, and each of the first through holes 22 in the part of the first through holes 22 is on the plane where the second side wall 215 is located. The projection area overlaps with all or part of the occupied area of the second through hole 23 corresponding to the first through hole 22 on the plane where the second side wall 215 is located.

In a fourth implementation manner, the number of part of the first through holes 22 in the at least one first through hole 22 is equal to the number of part of the second through holes 23 in the at least one second through hole 23, and the part of the first through holes 23 The holes 22 correspond to the part of the second through holes 23 one-to-one, and the projection area of each of the first through holes 22 in the part of the first through holes 22 on the plane where the second side wall 215 is located is the same as the first through hole. The second through hole 23 corresponding to 22 overlaps all or part of the occupied area on the plane where the second side wall 215 is located.

In this way, when multiple cabinets 2 shown in FIG. 8 are stacked and installed in the second cavity 13 of the electronic device shown in FIG. 7, as shown in FIG. The first side walls 214 of the plurality of cabinets 2 are vertical, the outer surfaces of the first side walls 214 of the plurality of cabinets 2 have the same orientation, and the first openings 211 of the plurality of cabinets 2 all face the third opening 11 of the cabinet 1, and the plurality of cabinets 2 The second openings 212 of each face the fourth opening 12 of the machine frame 1. Wherein, the outer surface of the first side wall 214 refers to the surface of the first side wall 214 away from the first cavity 213.

In this way, the housing 21 of each cabinet 2 encloses an independent air duct, and in two adjacent cabinets 2, the first side wall 214 of one cabinet 2 is attached to the second side wall 215 of the other cabinet 2. At least part of the first through hole 22 in the at least one first through hole 22 on the first side wall 214 is paired with at least part of the second through hole 23 in the at least one second through hole 23 on the second side wall 215 Therefore, when multiple fans 4 are running at the same time, the cold air flow from the outside can flow into the second cavity 13 from the third opening 11, and pass through the multiple winds enclosed by the casings 21 of the multiple cabinets 2 In this process, as shown in Figure 10, the air volume and speed in the multiple air channels are approximately equal, and the airflows in two adjacent air channels do not move with each other. . When a part of the fans 4 in the plurality of fans 4 is damaged, or a part of the fans 4 is unplugged to maintain at least one chassis 2 shielded by the part of the fans 4, as shown in FIG. At least a part of the first through holes 22 or at least a part of the second through holes 23 of the chassis 2 supply air to the at least one chassis 2 so that the at least one chassis 2 can be cooled.

The number of at least one first through hole 22 may be one or multiple, which is not specifically limited here. In some embodiments, as shown in FIG. 8, the number of at least one first through hole 22 is multiple, specifically six.

Similarly, the number of at least one second through hole 23 may be one or multiple, which is not specifically limited here. In some embodiments, as shown in FIG. 9, the number of at least one second through hole 23 is multiple, and the number of multiple second through holes 23 is equal to the number of multiple first through holes 22 in FIG. 8.

The at least one first through hole 22 may be provided on an end of the first side wall 214 close to the first opening 211, or may be provided on an end of the first side wall 214 close to the second opening 212, or may be provided on the end of the first side wall 214 close to the second opening 212. The middle position of a side wall 214 along the first direction is not specifically limited here. In some embodiments, as shown in FIG. 8, at least one first through hole 22 is provided on an end of the first side wall 214 close to the first opening 211. When a plurality of cabinets 2 are stacked and installed in an electronic device, as shown in FIG. 10, the first opening of the cabinet 2 faces the third opening 11 of the machine frame, and the third opening 11 is the inlet of the outside cold air. The air flow entering or exiting sideways from at least part of the first through holes 22 has a lower temperature and a higher pressure, which can effectively cool the adjacent case 2.

Correspondingly, at least one second through hole 23 may be provided on an end of the second side wall 215 close to the first opening 211, or may be provided on an end of the second side wall 215 close to the second opening 212, or may be provided The middle position of the second side wall 215 along the first direction is not specifically limited here. In some embodiments, as shown in FIG. 8, at least one second through hole 23 is provided on an end of the second side wall 215 close to the first opening 211. When a plurality of cabinets 2 are stacked and installed in an electronic device, as shown in FIG. 10, the first opening 211 of the cabinet 2 faces the third opening 11 of the machine frame, and the third opening 11 is the inlet for the inflow of outside cold air, Therefore, the air flow entering or exiting sideways through at least part of the second through holes 23 has a lower temperature and a higher pressure, which can effectively cool the adjacent case 2.

In some embodiments, at least one first through hole 22 is provided with a first door body (not shown in the figure), and the first door body is used to open or close the at least one first through hole 22, and at least one first door body is used to open or close the at least one first through hole 22. No door is provided at the second through hole 23. In this way, the lateral flow of the airflow in the first cavity 213 can be controlled through the first door body.

The opening or closing of the first door body can be manually driven, or can be automatically driven by a driving device (such as a motor), which is not specifically limited here. There may be one first door, and the first door opens or closes the at least one first through hole 22 at the same time. The number of the first door may also be the same as the number of the at least one first through hole 22. A door opens or closes the at least one first through hole 22 respectively.

In still other embodiments, at least one of the first through holes 22 is not provided with a door, and at least one of the second through holes 23 is provided with a second door (not shown in the figure), and the second door is used to open Or the at least one second through hole 23 is closed. In this way, the lateral flow of the airflow in the first cavity 213 can be controlled by the second door.

The opening or closing of the second door body can be manually driven, or can be automatically driven by a driving device (such as a motor), which is not specifically limited here. There may be one second door. The second door opens or closes the at least one second through hole 23 at the same time. The two doors respectively open or close the at least one second through hole 23.

In still other embodiments, at least one first through hole 22 is provided with a first door, and the first door is used to open or close the at least one first through hole 22, and at least one second through hole 23 is provided. There is a second door body, and the second door body is used to open or close the at least one second through hole 23. In this way, the lateral flow of the airflow in the first cavity 213 can be jointly controlled by the second door body and the second door body.

As shown in FIG. 9, the case 2 further includes a circuit assembly 24. The circuit component 24 is disposed in the first cavity 213. The circuit component 24 is a circuit component that realizes the function of the chassis and is a structure that generates heat in the chassis 2. The cold airflow entering the first cavity 213 from the first opening 211 mainly exchanges heat with the circuit component 24 for cooling The circuit assembly 24.

In order to allow the cold air flow to be discharged through the second opening 212 after heat exchange with the circuit assembly 24, the circuit assembly 24 does not block the communication path between the first opening 211 and the second opening 212 through the first cavity 213. At the same time, in order to enable the chassis 2 to perform lateral air supply through at least part of the first through hole 22 in the at least one first through hole 22 or at least part of the second through hole 23 in the at least one second through hole 23 to cool the entire circuit Component 24, the circuit component 24 does not block the communication path between the at least one first through hole 22 and the first opening 211 through the first cavity 213, and the circuit component 24 does not block the at least one first through hole 22 and the second The communication path between the openings 212 through the first cavity 213, the circuit assembly 24 does not block the communication path between the at least one second through hole 23 and the first opening 211 through the first cavity 213, and the circuit assembly 24 also does not The communication path between the at least one second through hole 23 and the second opening 212 through the first cavity 213 is blocked. In this way, side air supplement can be performed through at least part of the first through holes 22 or at least part of the second through holes 23, and the supplemented air can flow in the direction of the first opening 211 and the second opening 212 to cool the entire circuit assembly .

The circuit component 24 can have a variety of structural forms according to the functions it implements and its performance. In some embodiments, as shown in FIG. 9, the circuit assembly 24 includes a hard disk unit 241 and a central processing unit (CPU) 242. The hard disk unit 241 is used to store data and information, the hard disk unit 241 is electrically connected to the central processing unit 242, and the central processing unit 242 is used to process the data and information stored or read out by the hard disk unit 241. The hard disk unit 241 is disposed in an end of the casing 21 close to the first opening 211, and the central processing unit 242 is disposed in an end of the casing 21 close to the second opening 212. The hard disk unit 241 includes a plurality of hard disks 241a that are stacked and spaced apart in a direction perpendicular to the first direction.

Compared with the central processing unit 242, the hard disk 241a in the hard disk unit 241 is much more likely to be damaged. Therefore, maintaining the chassis 2 usually involves maintaining the hard disk 241a in the chassis 2, that is, pulling out the damaged hard disk 241a in the chassis 2. Since the hard disk unit 241 is disposed at one end of the housing 21 close to the first opening 211, when the chassis 2 provided in this embodiment is applied to the electronic device shown in FIG. 7 and installed in the data center, the first opening 211 faces the data center The cold air channel is the maintenance channel for the operator, so it is convenient for the operator to maintain the hard disk 241a in the chassis 2 through the first opening 211.

In order to further reduce the difficulty of maintaining the hard disk 241a in the hard disk unit 241, the hard disk unit 241 as a whole can be slidably connected in the housing 21 in a direction parallel to the first direction. When the hard disk 241a in the hard disk unit 241 needs to be maintained The hard disk unit 241 can be drawn out through the first opening 211 to facilitate maintenance of the hard disk 241 a in the hard disk unit 241.

Since the central processing unit 242 is disposed in the end of the housing 21 close to the second opening 212, when a plurality of cabinets 2 provided in this embodiment are stacked and installed in the second cavity 13 of the electronic device shown in FIG. 7, As shown in FIG. 10, the central processing unit 242 is arranged close to the back plate 14, so that the central processing unit 242 is electrically connected to the input/output card 3 in the third cavity 15 through the back plate 14.

In some embodiments, as shown in FIGS. 8 and 9, the stacking direction of the plurality of hard disks 241a in the hard disk unit 241 is parallel to the first side wall 214, and at least one first through hole 22 and at least one second through hole 23 is opposite to the gap between two adjacent hard disks 241a.

In this way, on the one hand, since the hard disk unit 241 is disposed in one end of the housing 21 close to the first opening 211, at least one first through hole 22 and at least one second through hole 23 are arranged to be adjacent to two adjacent hard disks 241a. The gap therebetween is opposite, that is, at least one first through hole 22 and at least one second through hole 23 are provided on one end of the housing 21 close to the first opening 211. When multiple chassis 2 are stacked and installed in the electronic device shown in FIG. 7, as shown in FIG. 10, the first opening 211 of the chassis 2 faces the third opening 11 of the chassis, and the third opening 11 is the outside cold air. Therefore, the air flow entering or exiting sideways from the at least one first through hole 22 and at least one second through hole 23 has a lower temperature and a higher pressure, which can effectively cool the circuit components of the chassis 2 24 or the circuit assembly 24 of the adjacent case 2.

On the other hand, because the stacking direction of the plurality of hard disks 241a in the hard disk unit 241 is parallel to the first side wall 214, and at least one first through hole 22 and at least one second through hole 23 are between two adjacent hard disks 241a. Therefore, there is no interference between the at least one first through hole 22 and the plurality of hard disks 241a, and between the at least one second through hole 23 and the plurality of hard disks 241a, so that the at least one first through hole 22 or The at least one second through hole 23 enters or exits air flow laterally.

After the air flow enters the adjacent chassis 2 laterally from at least part of the first through hole 22 in the at least one first through hole 22 or at least part of the second through hole 23 in the at least one second through hole 23, as As shown in FIG. 11, a part of the airflow flows along the first cavity 213 of the adjacent case 2 to the first opening 211 of the adjacent case 2, and the other part of the airflow flows along the first cavity 213 of the adjacent case 2 It flows to the second opening 212 of the adjacent case 2.

In order to prevent at least part of the first through holes 22 in the at least one first through hole 22 of the chassis 2 or at least part of the second through holes 23 in the at least one second through hole 23 of the chassis 2 from entering the chassis 2 laterally All are exhausted from the first opening 211 of the chassis 2. In some embodiments, as shown in FIG. 12, FIG. 14 or FIG. 16, the chassis 2 further includes a shielding structure 25. The shielding structure 25 is disposed at the first opening 211. The shielding structure 25 can move between the first position A and the second position B. When the shielding structure 25 is at the first position A, the shielding structure 25 does not shield the first opening 211; when the shielding structure 25 is at the second position B , The shielding structure 25 partially shields the first opening 211.

In this way, when the fan 4 (as shown in FIG. 10) corresponding to the chassis 2 is operating normally, the shielding structure 25 can be driven to move to the first position A to prevent the shielding structure 25 from blocking the entry into the first cavity from the first opening 211 213 air flow to ensure the effectiveness of cooling. When the fan 4 corresponding to the chassis 2 fails or is unplugged, the shielding structure 25 can be driven to move to the second position B to avoid at least part of the first through hole 22 of the chassis 2 The air flow in the hole 22 or at least a part of the second through hole 23 in the at least one second through hole 23 is all discharged from the first opening 211 of the chassis 2 so that at least one of the at least one through hole 23 in the chassis 2 cannot be effectively cooled. The circuit components in the part of the housing 21 between the first through hole 23 and the second opening 212 of the case 2.

There can be many structural forms and movement modes of the shielding structure 25.

For example, FIG. 12 is a schematic structural diagram of a chassis provided by still other embodiments of the application after the first side wall is removed. As shown in FIG. 12, the shielding structure 25 includes a baffle, the baffle is parallel to the plane where the first opening 211 is located, and the baffle is at a first position A and a second position B along a direction parallel to the plane where the first opening 211 is located. When the shielding structure 25 is in the first position A, as shown in FIG. 12, the baffle is located outside the first opening 211, and the baffle does not cover the first opening 211 at this time. When the shielding structure 25 is in the second position B, as shown in FIG. 13, the baffle is located in the first opening 211, and the area of the baffle is smaller than the area of the first opening 211, at this time the baffle partially covers the first opening 211. This structure is simple and easy to implement.

For another example, FIG. 14 is a schematic structural diagram of a chassis provided by still other embodiments of the application after the first side wall is removed. As shown in FIG. 14, the shielding structure 25 includes a folding and retractable structure. When the shielding structure 25 is in the first position A, as shown in FIG. 14, the folding and retractable structure is in a folded state. At this time, the thickness of the folding and retractable structure is very large. It can be considered that the first opening 211 is not blocked. When the shielding structure 25 is in the second position B, as shown in FIG. 15, the foldable and retractable structure is in an extended state, and there is a gap between the foldable and retractable structure and the first side wall 214. At this time, the foldable and retractable structure partially shields First opening 211. This structure is simple, easy to implement, and occupies a small space.

For another example, FIG. 16 is a schematic structural diagram of a chassis provided by still other embodiments of the application after the first side wall is removed. As shown in FIG. 16, the shielding structure 25 includes a plurality of blocking pieces 251, and the plurality of blocking pieces 251 are perpendicular to the first direction (the X direction as shown in FIG. 16) and are connected to the first side wall 214 (as shown in FIG. 8). ) Are arranged at intervals in a parallel direction, and the plurality of baffles 251 are all perpendicular to the first side wall 214. Each baffle of the plurality of baffles 251 can be rotatably connected to the housing 21 or the circuit assembly. The rotation axis of the pieces 251 is perpendicular to the first side wall 214, and each stop piece 251 can rotate about its own rotation axis between a position parallel to the first direction and a position perpendicular to the first direction. When the shielding structure 25 is located at the first position A, as shown in FIG. 16, each of the plurality of shielding pieces 251 is parallel to the first direction, and the thickness of the plurality of shielding pieces 251 is very small, which can be considered as not shielding the first position. An opening 211. When the shielding structure 25 is located at the second position B, as shown in FIG. 17, each of the plurality of shielding pieces 251 is perpendicular to the first direction, each of the shielding pieces 251 has a gap on both sides, and the plurality of shielding pieces 251 The sheet 251 partially blocks the first opening 211. This structure is simple, easy to implement, and occupies a small space.

Specifically, as shown in FIG. 16, a plurality of blocking pieces 251 may be respectively disposed in a plurality of gaps formed between the plurality of hard disks 241 a in the hard disk unit near one end of the first opening 211.

When a plurality of fans 4 are arranged in an array in the third opening 11 of the machine frame 1, as shown in FIG. 10, a plurality of cabinets 2 can be stacked and installed in the second cavity 13 of the electronic device, and then a plurality of fans can be installed. 4. It is also possible to assemble at least one case 2 and fan 4 together and then install them in the frame 1 together, which is not specifically limited here.

FIG. 18 is a schematic structural diagram of a chassis provided by still other embodiments of the application. As shown in FIG. 18, the chassis 2 includes a base plate 26. The substrate 26 includes, but is not limited to, a metal substrate and a plastic substrate. The two edges of the substrate 26 in the first direction (that is, the X direction shown in FIG. 18) are a first edge 261 and a second edge 262, respectively. At least one through hole 263 is provided on the substrate 26.

As shown in FIG. 18, the chassis 2 further includes a circuit assembly 24. The circuit component 24 is disposed on the substrate 26. The circuit component 24 is a circuit component that realizes the function of the chassis and is a structure that generates heat in the chassis 2. The cooling of the chassis 2 is mainly the cooling of the circuit component 24.

When multiple chassis 2 shown in FIG. 18 are stacked and installed in the second cavity 13 of the electronic device shown in FIG. 7, as shown in FIG. 19, the stacking direction of the multiple chassis 2 and the second direction (that is, the figure The Y direction shown in 19) is vertical, the stacking direction of the multiple cabinets 2 is perpendicular to the base plate 26 of each cabinet 2 of the multiple cabinets 2, and the first edge 261 of the base plate 26 of the multiple cabinets 2 is close to the first edge of the cabinet 1. Three openings 11 are provided, and the second edges 262 of the plurality of cabinets 2 are provided close to the fourth opening 12 of the machine frame 1.

In this way, there are gaps between the base plates 26 of two adjacent chassis 2 and between the base plate 26 of the uppermost chassis 2 and the top wall of the machine frame 1. These gaps form independent air ducts, and the circuit components 24 are located in these winds. In the duct, the air ducts can let the wind out or enter the wind sideways through the at least one through hole 263.

Therefore, when multiple fans 4 are running at the same time, the cold air flow from the outside can be driven to flow into the second cavity 13 from the third opening 11, and pass through the air duct between every two adjacent cases 2 and located on the uppermost layer. The air duct between the chassis 1 and the top wall of the machine frame 1 exchanges heat with the circuit components 24 in the air duct. The air flow after the heat exchange is discharged to the external environment through the fourth opening 12. In this process, as shown in Figure 19, the air volume and speed in the multiple air ducts are approximately equal, and the airflows in two adjacent air ducts do not move with each other. When a part of the fans 4 of the plurality of fans 4 is damaged, or a part of the fans 4 is unplugged to maintain at least one chassis 2 shielded by the part of the fans 4, as shown in FIG. 20, at least one of the at least one chassis 2 can be connected The hole 263 or the at least one through hole 263 of the case 2 adjacent to the at least one case 2 performs lateral air supply to the at least one case 2 to effectively cool the at least one case 2.

It should be noted that, in order to enable the chassis 2 to perform lateral air supply through the at least one through hole 263, the circuit assembly 24 does not cover the at least one through hole 263, that is, the projection of the circuit assembly 24 on the plane where the substrate 26 is located. The area does not cover the occupied area of at least one through hole 263 on the plane where the substrate 26 is located. In this way, when a plurality of cabinets 2 are stacked and installed in the electronic device shown in FIG. 7, at least one through hole 263 communicates with the air ducts on both sides of the substrate 26, so that the at least one through hole 263 can be used for lateral direction. Make up the wind.

The number of the at least one through hole 263 may be one or multiple, which is not specifically limited here. In some embodiments, as shown in FIG. 18, the number of at least one through hole 263 is multiple, specifically six.

The at least one through hole 263 can be provided close to the first edge 261, can also be provided close to the second edge 262, or can be provided in the middle of the substrate 26 along the first direction, which is not specifically limited here. In some embodiments, as shown in FIG. 18, at least one through hole 263 is disposed close to the first edge 261. Because when multiple chassis 2 are stacked and installed in the electronic device shown in FIG. 7, as shown in FIG. As the air flows into the inlet, the air flow entering or exiting sideways through the at least one through hole 263 has a lower temperature and a higher pressure, which can effectively cool the case 2 or the case adjacent to the case 2.

In some embodiments, at least one through hole 263 is provided with a door body (not shown in the figure), and the door body is used to open or close the at least one through hole 263. In this way, the lateral flow of the airflow can be controlled through the door.

Wherein, the opening or closing of the door body can be manually driven, or can be automatically driven by a driving device (such as a motor), which is not specifically limited here. There may be one door body, which opens or closes the at least one through hole 263 at the same time, and the number of the door body may also be the same as the number of the at least one through hole 263, and at least one door body opens or closes the at least one through hole respectively 263.

The circuit component 24 can have a variety of structural forms according to the functions it implements and its performance. In some embodiments, as shown in FIG. 18, the circuit component 24 includes a hard disk unit 241 and a central processing unit (CPU) 242. The hard disk unit 241 is used to store data and information, the hard disk unit 241 is electrically connected to the central processing unit 242, and the central processing unit 242 is used to process the data and information stored or read out by the hard disk unit 241. The hard disk unit 241 is disposed on a part of the substrate 26 close to the first edge 261, and the central processing unit 242 is disposed on a part of the substrate 26 close to the second edge 262. The hard disk unit 241 includes a plurality of hard disks 241 a which are stacked and spaced apart in a direction perpendicular to the first direction and parallel to the substrate 26.

Compared with the central processing unit 242, the hard disk 241a in the hard disk unit 241 is much more likely to be damaged. Therefore, maintaining the chassis 2 usually involves maintaining the hard disk 241a in the chassis 2, that is, pulling out the damaged hard disk 241a in the chassis 2. Since the hard disk unit 241 is disposed on the portion of the substrate 26 close to the first edge 261, when the chassis 2 provided in this embodiment is applied to an electronic device and installed in a data center, the first edge 261 is close to the cold air duct, and the cold air duct That is, it is a maintenance channel for the operator, so it is convenient for the operator to maintain the hard disk 241a in the chassis 2 from the side close to the first edge 261.

In order to further reduce the difficulty of maintenance operation of the hard disk 241a in the hard disk unit 241, the hard disk unit 241 as a whole can be slidably connected to the base plate 26 in a direction parallel to the first direction. When the hard disk 241a in the hard disk unit 241 needs to be maintained, The hard disk unit 241 can be drawn out from the side close to the first edge 261 to facilitate maintenance of the hard disk 241a in the hard disk unit 241.

Since the central processing unit 242 is arranged on the part of the substrate 26 close to the second edge 262, a plurality of cases 2 provided in this embodiment are stacked and installed in the second cavity 13 of the electronic device frame 1 shown in FIG. When inside, as shown in FIG. 19, the central processing unit 242 is arranged close to the back plate 14, so that the central processing unit 242 is electrically connected to the input/output card 3 in the third cavity 15 through the back plate 14.

In some embodiments, as shown in FIG. 18, at least one through hole 263 is opposite to the gap between two adjacent hard disks 241a.

In this way, on the one hand, since the hard disk unit 241 is disposed on the portion of the substrate 26 close to the first edge 261, the at least one through hole 263 is disposed opposite to the gap between two adjacent hard disks 241a, that is, at least A through hole 263 is provided on a portion of the substrate 26 close to the first edge 261. When multiple chassis 2 are stacked and installed in an electronic device, as shown in FIG. 19, the first edge 261 of the chassis 2 is close to the third opening 11 of the machine frame 1, and the third opening 11 is the inlet for the inflow of outside cold air. Therefore, the airflow entering or exiting sideways from the at least one through hole 263 has a lower temperature and a higher pressure, which can effectively cool the circuit components 24 of the chassis 2 or the circuit components 24 of the adjacent chassis 2.

On the other hand, since the at least one through hole 263 is opposite to the gap between the two adjacent hard disks 241a, there is no interference between the at least one through hole 263 and the plurality of hard disks 241a, which facilitates lateral movement from the at least one through hole 263. Airflow entering or exiting sideways.

After the air flow enters the adjacent air duct laterally from at least one through hole 263, as shown in FIG. The adjacent air duct flows in a direction close to the second edge 262.

In order to avoid that the air flow from the at least one through hole 263 into the adjacent air duct laterally is exhausted from the end of the adjacent air duct close to the first edge 261, in some embodiments, as shown in FIG. 21, the chassis 2 also Include a shielding structure 25. The shielding structure 25 is disposed on the first edge 261. The shielding structure 25 can move between the first position A and the second position B. When the shielding structure 25 is in the first position A, the shielding structure does not shield the circuit assembly 24 by the side of the circuit assembly 24 close to the first edge 261; When the shielding structure is located at the second position B, the shielding structure 25 partially shields the circuit assembly 24 by the side of the circuit assembly 24 close to the first edge 261.

In this way, when the fan 4 (as shown in FIG. 19) corresponding to the chassis 2 is operating normally, the shielding structure 25 can be driven to move to the first position A, so as to prevent the shielding structure 25 from blocking the substrates 26 of two adjacent chassis 2 The air flow in the air ducts between the two, thereby ensuring the cooling efficiency of the circuit assembly 24. When the fan 4 corresponding to the chassis 2 fails or is unplugged, the shielding structure 25 can be driven to move to the second position B, so as to avoid that the airflow from the at least one through hole 263 into the adjacent air duct sideways is completely caused by the phase. The adjacent air duct is exhausted from an end close to the first edge 261, so that the circuit components on the part of the substrate 26 located between the at least one through hole 263 of the chassis 2 and the second edge 262 of the chassis 2 cannot be effectively cooled.

There can be many structural forms and movement modes of the shielding structure 25.

For example, FIG. 21 is a schematic structural diagram of a chassis provided by other embodiments of the application. As shown in FIG. 21, the shielding structure 25 includes a baffle, which is perpendicular to the first direction (that is, the X direction in FIG. 21). Translation between positions B. When the shielding structure 25 is in the first position A, as shown in FIG. 12, the baffle is not located on the side of the circuit assembly 24 close to the first edge 261. One side 261 shields the circuit assembly 24. When the shielding structure 25 is in the second position B, as shown in FIG. 22, the baffle is located on the side of the circuit assembly 24 close to the first edge 261, and the height of the baffle is less than the maximum height of the circuit assembly protruding from the surface of the substrate 26. The baffle partially shields the circuit assembly 24 from a side of the circuit assembly 24 close to the first edge 261. This structure is simple and easy to implement.

For another example, FIG. 23 is a schematic structural diagram of a chassis provided by still other embodiments of the application. As shown in FIG. 23, the shielding structure 25 includes a folding and retractable structure. When the shielding structure 25 is in the first position A, as shown in FIG. 23, the folding and retractable structure is in a folded state. At this time, the thickness of the folding and retractable structure is very large. It can be considered that the folding and retractable structure does not cover the circuit assembly 24 by the side of the circuit assembly 24 close to the first edge 261. When the shielding structure 25 is in the second position B, as shown in FIG. 24, the folding and retractable structure is in an extended state. At this time, the height of the foldable and retractable structure protruding from the substrate 26 is less than the maximum height of the circuit component protruding from the surface of the substrate 26. At this time, in the foldable and retractable structure, the circuit assembly 24 is partially shielded by the side of the circuit assembly 24 close to the first edge 261. This structure is simple, easy to implement, and occupies a small space.

For another example, FIG. 25 is a schematic structural diagram of a chassis provided by still other embodiments of the application. As shown in FIG. 25, the shielding structure 25 includes a plurality of blocking pieces 251, and the plurality of blocking pieces 251 are arranged at intervals in a direction perpendicular to the first direction (the X direction as shown in FIG. 25) and parallel to the substrate 26, and the plurality of The baffles 251 are all perpendicular to the substrate 26. Each baffle of the plurality of baffles 251 can be rotatably connected to the substrate 26 or the circuit assembly. The rotation axis of each baffle 251 is perpendicular to the substrate 26. Each piece 251 can rotate about its own rotation axis between a position parallel to the first direction and a position perpendicular to the first direction. When the shielding structure 25 is located at the first position A, as shown in FIG. 25, each of the plurality of shielding pieces 251 is parallel to the first direction, and the thickness of the plurality of shielding pieces 251 is very small. The sheet 251 does not block the circuit assembly 24 by the side of the circuit assembly 24 close to the first edge 261. When the shielding structure 25 is located at the second position B, as shown in FIG. 26, each of the plurality of shielding pieces 251 is perpendicular to the first direction, each of the shielding pieces 251 has a gap on both sides, and the multiple shielding pieces 251 The sheet 251 partially shields the circuit assembly 24 from a side of the circuit assembly 24 close to the first edge 261. This structure is simple, easy to implement, and occupies a small space.

Specifically, as shown in FIG. 25, a plurality of baffles 251 may be respectively disposed in a plurality of gaps formed between the plurality of hard disks 241 a in the hard disk unit near one end of the first edge 261.

When multiple fans 4 are arranged in an array in the third opening 11 of the machine frame 1, as shown in FIG. 19, the multiple cabinets 2 can be stacked and installed in the second cavity 13 of the electronic device, and then multiple fans can be installed. 4. It is also possible to assemble at least one case 2 and fan 4 together and then install them in the frame 1 together, which is not specifically limited here.

In the description of this specification, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

Claims (17)

1. A case, characterized in that it comprises:

   A casing having a first opening and a second opening at both ends along the first direction, the casing enclosing a first cavity communicating with the first opening and the second opening, the casing including A first side wall and a second side wall, the first side wall and the second side wall are both parallel to the first direction, and the first side wall and the second side wall are parallel and opposite, At least one first through hole is provided on the first side wall, and at least one second through hole is provided on the second side wall;

   The circuit component is disposed in the first cavity, and the circuit component does not block between the first opening and the second opening, and between the at least one first through hole and the first opening Between the at least one first through hole and the second opening, between the at least one second through hole and the first opening, and between the at least one second through hole and the second opening A communication path passing through the first cavity therebetween.
2. The chassis according to claim 1, wherein the number of at least part of the first through holes in the at least one first through hole and the number of at least part of the second through holes in the at least one second through hole Equal, the at least part of the first through holes corresponds to the at least part of the second through holes, and each of the at least part of the first through holes is on the plane where the second side wall is located The projection areas of both overlap at least part of the occupied area of the second through hole corresponding to the first through hole on the plane where the second side wall is located.
3. The cabinet according to claim 1 or 2, wherein the at least one first through hole is provided on an end of the first side wall close to the first opening, and the at least one second through hole It is arranged on an end of the second side wall close to the first opening.
4. The cabinet according to any one of claims 1 to 3, wherein a first door body is provided at the at least one first through hole, and the first door body is used to open or close the at least one A first through hole, where a door is not provided at the at least one second through hole;

   Alternatively, the at least one first through hole is not provided with a door body, and the at least one second through hole is provided with a second door body, and the second door body is used to open or close the at least one second through hole. hole;

   Alternatively, a first door body is provided at the at least one first through hole, the first door body is used to open or close the at least one first through hole, and the at least one second through hole is provided with a first door. Two door bodies, the second door body is used to open or close the at least one second through hole.
5. The chassis according to any one of claims 1 to 4, further comprising:

   The shielding structure is arranged at the first opening. The shielding structure can move between a first position and a second position. When the shielding structure is in the first position, the shielding structure does not shield the The first opening, when the shielding structure is in the second position, the shielding structure partially shields the first opening.
6. The cabinet according to claim 5, wherein the shielding structure comprises a plurality of baffles, and the plurality of baffles are arranged at intervals along a direction perpendicular to the first direction and parallel to the first side wall , And the plurality of baffles are perpendicular to the first side wall, each of the plurality of baffles can be rotatably connected to the housing or the circuit assembly, and each The rotation axes of the baffles are all perpendicular to the first side wall, and each baffle can rotate about its own rotation axis between a position parallel to the first direction and a position perpendicular to the first direction ；

   When each of the plurality of blocking pieces is parallel to the first direction, the blocking structure is located at the first position;

   When each of the plurality of blocking pieces is perpendicular to the first direction, the blocking structure is located at the second position.
7. The case according to any one of claims 1 to 6, wherein the circuit assembly comprises a hard disk unit and a central processing unit, and the hard disk unit is electrically connected to the central processing unit;

   The hard disk unit is disposed in an end of the casing close to the first opening, and the central processing unit is disposed in an end of the casing close to the second opening.
8. 8. The chassis according to claim 7, wherein the hard disk unit comprises a plurality of hard disks stacked and spaced apart along a direction parallel to the first side wall and perpendicular to the first direction;

   The at least one first through hole and the at least one second through hole are opposite to the gap between two adjacent hard disks.
9. A case, characterized in that it comprises:

   A substrate, two edges along the first direction are respectively a first edge and a second edge, and at least one through hole is provided on the substrate;

   The circuit component is arranged on the substrate, and the circuit component does not block the at least one through hole.
10. The chassis according to claim 9, wherein the at least one through hole is disposed close to the first edge.
11. The cabinet according to claim 9 or 10, wherein a damper is provided at the at least one through hole, and the damper is used to open or close the at least one through hole.
12. The chassis according to any one of claims 9 to 11, further comprising:

    The shielding structure is arranged on the first edge of the substrate. The shielding structure can move between a first position and a second position. When the shielding structure is in the first position, the shielding structure is not controlled by the The circuit component is shielded by a side of the circuit component close to the first edge, and when the shielding structure is located in the second position, the shielding structure consists of a side portion of the circuit component close to the first edge Block the circuit assembly.
13. The cabinet according to claim 12, wherein the shielding structure comprises a plurality of baffles, the plurality of baffles are arranged at intervals along a direction perpendicular to the first direction and parallel to the substrate, and The plurality of baffles are all perpendicular to the substrate, each of the plurality of baffles can be rotatably connected to the substrate or the circuit assembly, and the rotation axis of each of the baffles is aligned with The substrate is vertical, and each of the baffles can rotate about its own rotation axis between a position parallel to the first direction and a position perpendicular to the first direction;

    When each of the plurality of blocking pieces is parallel to the first direction, the blocking structure is located at the first position;

    When each of the plurality of blocking pieces is perpendicular to the first direction, the blocking structure is located at the second position.
14. The case according to any one of claims 9-13, wherein the circuit assembly comprises a hard disk unit and a central processing unit, and the hard disk unit is electrically connected to the central processing unit;

    The hard disk unit is arranged on a part of the substrate close to the first edge, and the central processing unit is arranged on a part of the substrate close to the second edge.
15. The chassis according to claim 14, wherein the hard disk unit comprises a plurality of hard disks stacked and spaced apart along a direction perpendicular to the first direction and parallel to the substrate;

    The at least one through hole is opposite to the gap between two adjacent hard disk units.
16. An electronic device, characterized in that it comprises:

    The machine frame is provided with a third opening and a fourth opening at both ends along the second direction, the machine frame encloses a second cavity, and the second cavity faces the third opening and the first end The three openings are in communication, and the end of the second cavity facing the fourth opening is in communication with the fourth opening;

    A plurality of cabinets, each of the cabinets is the cabinet according to any one of claims 1 to 8, the plurality of cabinets are stacked and installed in the second cavity, and the stacking direction of the plurality of cabinets Perpendicular to the second direction, the stacking direction of the multiple cabinets is perpendicular to the first side wall of each of the multiple cabinets, and the outer surfaces of the first side walls of the multiple cabinets have the same orientation, The first openings of the plurality of cabinets all face the third opening of the machine frame, and the second openings of the plurality of cabinets all face the fourth opening;

    A plurality of fans, the plurality of fan arrays are arranged in the third opening, and the air outlet surfaces of the plurality of fans are opposite to the first openings of the plurality of cabinets, or the plurality of fan arrays are arranged in Inside the fourth opening, the air inlet surfaces of the plurality of fans are opposite to the second openings of the plurality of cabinets.
17. An electronic device, characterized in that it comprises:

    The machine frame is provided with a third opening and a fourth opening at both ends along the second direction, the machine frame encloses a second cavity, and the second cavity faces the third opening and the first end The three openings are in communication, and the end of the second cavity facing the fourth opening is in communication with the fourth opening;

    A plurality of cabinets, each of the cabinets is the cabinet of any one of claims 9-15, the plurality of cabinets are stacked and installed in the second cavity, and the stacking direction of the plurality of cabinets Perpendicular to the second direction, the stacking direction of the plurality of cabinets is perpendicular to the base plate of each of the plurality of cabinets, and the first edge of the base plate of the plurality of cabinets is close to the third opening of the machine frame Provided that the second edges of the substrates of the plurality of cabinets are arranged close to the fourth opening;

    A plurality of fans, the plurality of fan arrays are arranged in the third opening, and the air outlet surfaces of the plurality of fans are facing the first edge of the substrate of the plurality of cabinets, or the plurality of fan arrays are arranged Inside the fourth opening, and the air inlet surfaces of the plurality of fans face the second edge of the base plate of the plurality of cabinets.

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