WO2021085107A1 - Capacitor - Google Patents

Capacitor Download PDF

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Publication number
WO2021085107A1
WO2021085107A1 PCT/JP2020/038545 JP2020038545W WO2021085107A1 WO 2021085107 A1 WO2021085107 A1 WO 2021085107A1 JP 2020038545 W JP2020038545 W JP 2020038545W WO 2021085107 A1 WO2021085107 A1 WO 2021085107A1
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WO
WIPO (PCT)
Prior art keywords
hole
overlapping portion
bus bar
capacitor
overlapping
Prior art date
Application number
PCT/JP2020/038545
Other languages
French (fr)
Japanese (ja)
Inventor
宏将 松井
英里子 金谷
Original Assignee
パナソニックＩｐマネジメント株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニックＩｐマネジメント株式会社 filed Critical パナソニックＩｐマネジメント株式会社
Priority to CN202080066658.6A priority Critical patent/CN114467158A/en
Priority to JP2021554298A priority patent/JPWO2021085107A1/ja
Publication of WO2021085107A1 publication Critical patent/WO2021085107A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/252—Terminals the terminals being coated on the capacitive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/32—Wound capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors 
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors

Definitions

  • the present invention relates to a capacitor.
  • a capacitor element to which the front bus bar and the rear bus bar are connected is housed in a case, and the case is filled with a filling resin.
  • the front bus bar and the rear bus bar each overlap each other with an insulating module in between.
  • Patent Document 1 describes that the ELS (equivalent series inductance) can be reduced by including the third plate portion.
  • Each third plate portion rises from the second plate portion covered with the filling resin in the case, and has a covering portion covered with the filling resin and an exposed portion exposed from the filling resin.
  • a plurality of connection terminal portions to which terminals of external devices are connected are provided at the upper end portion of each third plate portion.
  • the above film capacitors can be used in various environments depending on their application. For example, when a film capacitor is used in an environment with large temperature changes, the difference in the coefficient of linear expansion (coefficient of thermal expansion) between each third plate of the front and rear bus bars made of metal and the filling resin. As a result, stress is generated at the boundary between the exposed portion of the covering portion of each third plate and the third plate portion that is in close contact with each other and the filling resin, and cracks and peeling are likely to occur between them. Become. As a result, when the moisture-proof property of the filling resin is lowered, moisture comes into contact with the capacitor element covered with the filling resin, which may cause problems such as a decrease in capacity and deterioration of insulation in the capacitor element.
  • each of the first bus bar and the second bus bar has a first overlapping portion and a second overlapping portion that overlap each other with the insulating plate sandwiched between them, and the overlapping portions are exposed from the filling resin. It is an object of the present invention to provide a capacitor capable of suppressing a decrease in moisture resistance due to the filling resin because cracks and peeling are unlikely to occur between these overlapping portions and the filling resin when the structure is configured.
  • the capacitor according to the main aspect of the present invention is filled in the capacitor element, the first bus bar and the second bus bar connected to the electrodes at both ends of the capacitor element, a case in which the capacitor element is housed, and the case. It is provided with a filling resin.
  • the first bus bar and the second bus bar have a first overlapping portion and a second overlapping portion that are overlapped with each other with an insulating plate interposed therebetween, respectively, and the first overlapping portion and the second overlapping portion.
  • the insulating plate includes a coating portion covered with the filling resin and an exposed portion exposed from the filling resin.
  • the capacitor is formed so as to straddle the boundary between the covering portion and the exposed portion, and has a through hole penetrating the first overlapping portion, the second overlapping portion, and the insulating plate in the overlapping direction in which they overlap. Be prepared.
  • each of the first bus bar and the second bus bar has a first overlapping portion and a second overlapping portion that overlap with each other across the insulating plate, and the overlapping portion is exposed from the filling resin.
  • FIG. 1 is a perspective view of a film capacitor according to an embodiment.
  • FIG. 2A is a perspective view of the capacitor element unit viewed from the front according to the embodiment
  • FIG. 2B is a perspective view of the capacitor element unit viewed from the rear according to the embodiment.
  • FIG. 3A is a perspective view of the first busbar according to the embodiment
  • FIG. 3B is a perspective view of the second busbar according to the embodiment.
  • FIG. 4A is a perspective view of the insulating plate viewed from the front according to the embodiment
  • FIG. 4B is a perspective view of the insulating plate viewed from the rear according to the embodiment.
  • 5 (a) and 5 (b) are perspective views and plan views of the case according to the embodiment, respectively.
  • FIG. 6 is a side sectional view of the film capacitor cut at the position of the second through hole from the left according to the embodiment.
  • the film capacitor 1 which is an embodiment of the capacitor of the present invention, will be described with reference to the drawings.
  • each figure is appropriately marked with front-back, left-right, and up-down directions.
  • the direction shown is only a relative direction of the film capacitor 1 and does not indicate an absolute direction.
  • the film capacitor 1 corresponds to the "capacitor” described in the claims.
  • the first electrode 410 and the second electrode 420 correspond to the “electrode” described in the claims.
  • the protruding piece 515 corresponds to the "engaged portion” described in the claims.
  • the claw piece 718 corresponds to the "engagement portion” described in the claims.
  • FIG. 1 is a perspective view of the film capacitor 1.
  • the film capacitor 1 includes a capacitor element unit 100, a case 200, and a filling resin 300.
  • the capacitor element unit 100 is housed in the case 200, and the filling resin 300 is filled in the case 200.
  • the filling resin 300 is a thermosetting resin, for example, an epoxy resin. Most of the capacitor element unit 100 buried in the filling resin 300 is protected from moisture and impact by the case 200 and the filling resin 300.
  • FIG. 2A is a perspective view of the capacitor element unit 100 viewed from the front
  • FIG. 2B is a perspective view of the capacitor element unit 100 viewed from the rear
  • FIG. 3A is a perspective view of the first bus bar 500
  • FIG. 3B is a perspective view of the second bus bar 600
  • FIG. 4A is a perspective view of the insulating plate 700 viewed from the front
  • FIG. 4B is a perspective view of the insulating plate 700 viewed from the rear.
  • the capacitor element unit 100 includes six capacitor elements 400, a first bus bar 500, a second bus bar 600, and an insulating plate 700.
  • the capacitor element 400 is formed by stacking two metallized films on which aluminum is vapor-deposited on a dielectric film, winding or laminating the laminated metallized films, and pressing them in a flat shape.
  • the first electrode 410 is formed on one end face by spraying a metal such as zinc
  • the second electrode 420 is formed on the other end face by spraying a metal such as zinc.
  • the six capacitor elements 400 are arranged in the left-right direction with both end faces facing the front-rear direction.
  • the first bus bar 500 is formed by appropriately cutting out and bending a conductive material, for example, a copper plate, and the first main body portion 510, the first overlapping portion 520, and the three first connection terminal portions 530 are integrated. Has a structure.
  • the first main body portion 510 is elongated in the left-right direction, and has an upper surface portion 510a that covers most of the peripheral surfaces of the six capacitor elements 400 and a front surface that covers a part of the first electrode 410 of the six capacitor elements 400. It is composed of a part 510b. A pair of pin-shaped first electrode terminals 511 are formed at positions corresponding to the first electrodes 410 at the lower end of the front surface portion 510b. On the upper surface portion 510a, six oval flow holes 512 and five circular flow holes 513 are formed so as to be arranged alternately in the left-right direction. Further, in the upper surface portion 510a, six square flow holes 514 are formed in front of the six flow holes 512. The front side of each distribution hole 514 extends to the front surface portion 510b.
  • the first overlapping portion 520 rises upward (in the direction away from the capacitor element 400) from the rear end of the upper surface portion 510a of the first main body portion 510.
  • the first overlapping portion 520 is elongated in the left-right direction (longer in the left-right direction than in the vertical direction), the left side portion 520a extends upward from the central portion 520b, and the central portion 520b extends upward from the right side portion 520c.
  • Notches 521, 522, and 523 are formed in the first overlapping portion 520 at the left and right ends of the left side portion 520a and at the right end of the central portion 520b, respectively.
  • first overlapping portion 520 In the first overlapping portion 520, five square first holes 524 are formed at the lower end portion so as to line up in the left-right direction, which is a long direction.
  • the first hole 524 at the right end has a smaller vertical dimension than the other first holes 524.
  • the lower side of each first hole 524 extends to the upper surface portion 510a of the first main body portion 510.
  • a square protruding piece 515 projecting rearward is formed at the lower edge portion of the first hole 524, which is the first and fourth holes from the left.
  • the three first connection terminal portions 530 have a square shape and are provided at the upper ends of the left side portion 520a of the first overlapping portion 520 so as to be arranged at predetermined intervals in the left-right direction.
  • a circular mounting hole 531 is formed in each first connection terminal portion 530.
  • the second bus bar 600 is formed by appropriately cutting out and bending a conductive material, for example, a copper plate, and has a configuration in which a second main body portion 610, a second overlapping portion 620, and a second connection terminal portion 630 are integrated. Has.
  • the second main body portion 610 is elongated in the left-right direction, and after covering a part of the upper surface portion 610a covering a part of the peripheral surface of the six capacitor elements 400 and a part of the second electrode 420 of the six capacitor elements 400. It is composed of a surface portion 610b. A pair of pin-shaped second electrode terminals 611 are formed at positions corresponding to the second electrodes 420 at the lower end of the rear surface portion 610b. Further, in the rear surface portion 610b, square engaging holes 612 are formed at the left and right end portions.
  • the second overlapping portion 620 rises upward (in the direction away from the capacitor element 400) from the front end of the upper surface portion 610a of the second main body portion 610.
  • the second overlapping portion 620 is elongated in the left-right direction (longer in the left-right direction than in the vertical direction), the left side portion 620a extends upward from the central portion 620b, and the central portion 620b extends upward from the right side portion 620c.
  • Notches 621, 622, and 623 are formed in the second overlapping portion 620 at the left and right ends of the left side portion 620a and at the right end of the central portion 620b, respectively.
  • each second hole 624 extends to the rear surface portion 610b of the second main body portion 610.
  • the three second connection terminal portions 630 have a square shape and are provided at the upper ends of the left side portion 620a of the second overlapping portion 620 so as to be arranged at predetermined intervals in the left-right direction.
  • a circular mounting hole 631 is formed in each second connection terminal portion 630.
  • the insulating plate 700 is formed of a resin such as polyphenylene sulfide (PPS) and has an insulating property.
  • the insulating plate 700 is composed of a first insulating portion 710 and a second insulating portion 720.
  • the first insulating portion 710 is elongated in the left-right direction (longer in the left-right direction than in the vertical direction), and is a left side portion 520a of the first overlapping portion 520 of the first bus bar 500 and the second overlapping portion 620 of the second bus bar 600. , 620a, central 520b, 620b and left side 710a, central 710b and right side 710c corresponding to right side 520c, 620c, respectively.
  • hook-shaped engaging pieces 711, 712, and 713 are formed at the left and right ends of the left side portion 710a and the right end portion of the central portion 710b, respectively.
  • the rib 711a is connected below the engaging piece 711, and the rib 713a is connected above the engaging piece 713.
  • hook-shaped engaging pieces 714, 715, and 716 are formed at the left and right ends of the left side portion 710a and the right end portion of the central portion 710b, respectively.
  • the rib 714a is connected under the engaging piece 714
  • the rib 715a is connected under the engaging piece 715
  • the rib 716a is connected on the engaging piece 716.
  • first insulating portion 710 In the first insulating portion 710, five square third holes 717 are formed at the lower end portion so as to line up in the left-right direction, which is a long direction.
  • the third hole 717 at the right end has a smaller vertical dimension than the other third holes 717.
  • Each third hole 717 is formed at a position corresponding to each first hole 524 and each second hole 624.
  • a claw piece 718 extending downward is formed on the upper edge of the first and fourth third holes 717 from the left.
  • a nail 718a is provided at the tip of the nail piece 718.
  • the second insulating portion 720 is formed at the lower end of the first insulating portion 710, extends in the front-rear direction, greatly overhangs to the front side, and slightly overhangs to the rear side.
  • the second insulating portion 720 is formed with claw pieces 721 extending downward at the left and right ends on the rear side.
  • a nail 721a is provided at the tip of the nail piece 721.
  • the first bus bar 500 When assembling the capacitor element unit 100, first, the first bus bar 500 is mounted on the front side of the insulating plate 700. At the time of mounting, the first overlapping portion 520 of the first bus bar 500 passes the engaging pieces 711, 712, 713 corresponding to the three notches 521, 522, 523 through the three notches 521, 522, 523, and the first of the insulating plate 700. It is pressed against the front surface of the insulating portion 710 and then pushed down. The protruding piece 515 of the first main body portion 510 of the first bus bar 500 moves to the bottom of the claw piece 718 while elastically deforming the claw piece 718 of the first insulating portion 710, and engages with the claw piece 718 in the vertical direction. To do.
  • the left and right engaging pieces 711 and 712 of the left side portion 710a of the first insulating portion 710 engage with the left and right end portions of the left side portion 520a of the first overlapping portion 520, and the central portion 710b of the first insulating portion 710
  • the engaging piece 713 of the above engages with the right end portion of the central portion 520b of the first overlapping portion 520.
  • the first bus bar 500 is positioned and fixed to the insulating plate 700 so as not to move in the front-rear, left-right, and up-down directions.
  • the second bus bar 600 is mounted on the rear side of the insulating plate 700.
  • the second overlapping portion 620 of the second bus bar 600 passes the engaging pieces 714, 715, 716 corresponding to the three notches 621, 622, 623 through the three notches 621, 622, 623, and the first of the insulating plate 700. It is pressed against the rear surface of the insulating portion 710 and then pushed down.
  • the rear surface portion 610b of the second main body portion 610 of the second bus bar 600 moves downward while elastically deforming the claw piece 721 of the second insulating portion 720 forward, and the engaging hole 612 and the claw piece 721 of the rear surface portion 610b Engage in the vertical direction.
  • the left and right engaging pieces 714 and 715 of the left side portion 710a of the first insulating portion 710 engage with the left and right end portions of the left side portion 620a of the second overlapping portion 620, and the central portion 710b of the first insulating portion 710
  • the engaging piece 716 of the second overlapping portion 620 engages with the right end portion of the central portion 620b of the second overlapping portion 620.
  • the first hole 524 of the first overlapping portion 520, the second hole 624 of the second overlapping portion 620, and the third hole 717 of the first insulating portion 710 overlap in the front-rear direction, so that the first overlapping portion 520 and the first A through hole 110 is formed through the double overlapping portion 620 and the first insulating portion 710 in the front-rear direction in which they overlap.
  • the three first connection terminal portions 530 of the first bus bar 500 and the second connection terminal portions 630 of the second bus bar 600 are arranged alternately in the left-right direction.
  • the first bus bar 500 and the second bus bar 600 are connected to the six capacitor elements 400. That is, each of the first electrode terminals 511 of the first main body portion 510 of the first bus bar 500 is joined to the first electrode 410 of each capacitor element 400 by a joining method such as soldering. As a result, the first bus bar 500 is electrically connected to each first electrode 410 of the six capacitor elements 400. Similarly, each second electrode terminal 611 of the second main body portion 610 of the second bus bar 600 is joined to the second electrode 420 of each capacitor element 400 by a joining method such as soldering. As a result, the second bus bar 600 is electrically connected to each second electrode 420 of the six capacitor elements 400. In this way, as shown in FIGS. 2A and 2B, the capacitor element unit 100 is completed.
  • the first overlapping portion 520 of the first bus bar 500 and the second overlapping portion 620 of the second bus bar 600 overlap each other in the front-rear direction with the first insulating portion 710 of the insulating plate 700 interposed therebetween.
  • the ESL (equivalent series inductance) of the first bus bar 500 and the second bus bar 600 can be reduced.
  • the first insulating portion 710 ensures the insulating property between the first overlapping portion 520 and the second overlapping portion 620.
  • the third hole 717 is made smaller than the first hole 524 and the second hole 624 so as to fit within the opening region of the first hole 524 and the second hole 624, so that the first overlapping portion 520 and the second hole 724
  • the creepage distance between the double overlapping portion 620 can be lengthened, and sufficient insulation can be ensured.
  • the second insulating portion 720 secures the insulating property between the first overlapping portion 520 and the second electrode 420 of the six capacitor elements 400.
  • 5 (a) and 5 (b) are a perspective view and a plan view of the case 200, respectively.
  • the case 200 is made of resin and is formed of, for example, polyphenylene sulfide (PPS) which is a thermoplastic resin.
  • PPS polyphenylene sulfide
  • the case 200 is formed in the shape of a substantially rectangular parallelepiped box that is long in the left-right direction, and the upper surface is open. At the four corners of the case 200, accommodating recesses 210 are formed in the upper part on the inner side.
  • mounting tabs 220 are provided on the outer surfaces of the bottom surface portion, the left side surface portion, and the right side surface portion of the case 200.
  • An insertion hole 221 is formed in each mounting tab 220.
  • a metal collar 222 is fitted into the insertion hole 221 in order to increase the strength of the hole.
  • the left and right mounting tabs 220 are formed with positioning pins 223 protruding forward on the front surface.
  • the mounting tab 220 is fixed to the installation portion by a screw or the like after positioning by the positioning pin 223.
  • the capacitor element unit 100 is housed in the case 200 through the opening 201.
  • the left and right ends of the front surface portion 510b of the first main body portion 510 of the first bus bar 500 are accommodated in the front left and right accommodating recesses 210, and the left and right ends of the rear surface portion 610b of the second main body portion 610 of the second bus bar 600.
  • the portion is accommodated in the left and right accommodating recesses 210 on the rear side.
  • the capacitor element unit 100 is positioned with respect to the case 200.
  • the filling resin 300 is injected in a liquid phase state into the case 200 in which the capacitor element unit 100 is housed. At this time, the filling resin 300 in the liquid phase state passes through the flow holes 512, 513, and 514 provided in the first bus bar 500. Further, the filling resin 300 in the liquid phase state passes through the through hole 110. As a result, the filling resin 300 is smoothly filled in the case 200. The filling resin 300 is filled up to a position near the opening 201 of the case 200. After that, when the inside of the case 200 is heated, the filling resin 300 is cured. In this way, as shown in FIG. 1, the film capacitor 1 is completed.
  • the three first connection terminal portions 530 of the first bus bar 500 are connected to the external terminals of the corresponding external device by screwing using the mounting holes 531.
  • the second connection terminal portion 630 of the second bus bar 600 is connected to the external terminal of the corresponding external device by screwing using the mounting hole 631.
  • FIG. 6 is a side sectional view of the film capacitor 1 cut at the position of the second through hole 110 from the left.
  • FIG. 6 for convenience, only the portion of the casting surface (surface exposed to the outside) of the filling resin 300 is shown by a broken line.
  • the first overlapping portion 520 of the first bus bar 500, the second overlapping portion 620 of the second bus bar 600, and the first insulating portion 710 of the insulating plate 700 are made of the filling resin 300.
  • the through hole 110 is formed so as to straddle the boundary BL between the covering portion and the exposed portion, including the covering portion to be covered and the exposed portion exposed from the filling resin 300.
  • the boundary BL portion there are a plurality of portions (5) in which the first overlapping portion 520 and the filling resin 300 are in close contact with each other and the second overlapping portion 620 and the filling resin 300 are in close contact with each other. Since the through hole 110 is reduced by the presence of the through hole 110, the stress that tends to separate the first overlapping portion 520 and the filling resin 300 and the second overlapping portion 620 and the filling resin 300 as a whole is reduced. Becomes smaller.
  • the filling resin 300 in contact with the first overlapping portion 520 and the filling resin 300 in contact with the second overlapping portion 620 are connected through the through holes 110, the filling resin 300 is interrupted by the first insulating portion 710 of the insulating plate 700.
  • the resistance to the above stress becomes stronger, and the first overlapping portion 520 and the filling resin 300 and the second overlapping portion 620 and the filling resin 300 are less likely to be separated.
  • cracks and peeling are less likely to occur between the first overlapping portion 520 and the filling resin 300 and between the second overlapping portion 620 and the filling resin 300, so that moisture can be absorbed inside the filling resin 300 from between them. It becomes difficult to invade.
  • the first bus bar 500 and the second bus bar 600 have a first overlapping portion 520 and a second overlapping portion 620 on which the insulating plate 700 is interposed, respectively, and the first overlapping portion 520
  • the second overlapping portion 620 and the insulating plate 700 include a coating portion covered with the filling resin 300 and an exposed portion exposed from the filling resin 300.
  • the film capacitor 1 is formed so as to straddle the boundary BL between the covering portion and the exposed portion, and the first overlapping portion 520, the second overlapping portion 620, and the insulating plate 700 are placed in the overlapping direction (front-back direction) in which they overlap.
  • a through hole 110 for penetrating is provided.
  • the film capacitor 1 has a first overlapping portion 520 and a second overlapping portion 620 on which the first bus bar 500 and the second bus bar 600 are overlapped with each other sandwiching the insulating plate 700.
  • these overlapping portions 520 and 620 are exposed from the filling resin 300, even if the overlapping portions 520 and 620 are used in an environment with a large temperature change, the overlapping portions 520 and 620 and the filling resin 300 Since cracks and peeling are less likely to occur between them, moisture is less likely to enter the inside of the filling resin 300 from between them, and the deterioration of the moisture-proof property due to the filling resin 300 is suppressed.
  • first overlapping portion 520, the second overlapping portion 620, and the insulating plate 700 are formed with the first hole 524, the second hole 624, and the third hole 717, respectively, and these holes 524, 624, and 717 overlap each other.
  • the through hole 110 is formed by the above.
  • the third hole 717 is smaller than the first hole 524 and the second hole 624 and fits within the opening region of the first hole 524 and the second hole 624.
  • the creepage distance between the first overlapping portion 520 and the second overlapping portion 620 can be increased, so that it is easy to secure the insulating property between them.
  • a plurality of (six) capacitor elements 400 are arranged and housed in a predetermined direction (horizontal direction).
  • the first overlapping portion 520, the second overlapping portion 620, and the insulating plate 700 are formed so as to be elongated in a predetermined direction, and a plurality (five) through holes 110 are provided so as to be arranged in a predetermined direction.
  • the direction is long.
  • the insulating plate 700 is provided with a claw piece 718 extending from the edge of the third hole 717 in a direction (downward) perpendicular to the direction in which the first overlapping portion 520, the second overlapping portion 620, and the insulating plate 700 overlap.
  • the first bus bar 500 is provided with a protruding piece 515 that engages with the claw piece 718.
  • the third hole 717 formed in the insulating plate 700 to form the through hole 110 can be used to position the first bus bar 500 with respect to the insulating plate 700.
  • the first overlapping portion 520 of the first bus bar 500, the second overlapping portion 620 of the second bus bar 600, and the first insulating portion 710 of the insulating plate 700 are arranged in the arrangement direction (horizontal direction) of the capacitor elements 400. ) Is formed to be long, and a plurality of through holes 110 are provided so as to be arranged in the long direction.
  • the first overlapping portion 520, the second overlapping portion 620, and the first insulating portion 710 do not have to be long in the alignment direction of the capacitor elements 400, and in this case, only one through hole 110 is provided. May be done.
  • the insulating plate 700 of the second bus bar 600 is engaged with the claw piece 721 provided in the second insulating portion 720 of the insulating plate 700 and the engaging hole 612 provided in the second bus bar 600.
  • the vertical positioning with respect to the above was performed.
  • the claw piece 718 for the first bus bar 500 is not provided in the third hole 717, while the claw piece for the second bus bar 600 is provided, while the second Protruding pieces are provided on the upper surface portion 610a of the second main body portion 610 of the bus bar 600, and the claw pieces and the protruding pieces are engaged with each other so that the second bus bar 600 is positioned in the vertical direction with respect to the insulating plate 700. May be good.
  • the capacitor element unit 100 includes six capacitor elements 400.
  • the number of capacitor elements 400 can be changed as appropriate, including the case where the number of capacitor elements 400 is one.
  • the capacitor element 400 is formed of a metallized film in which aluminum is vapor-deposited on a dielectric film, but in addition to this, a metal in which other metals such as zinc and magnesium are vapor-deposited. It may be formed by a chemical film. Alternatively, the capacitor element 400 may be formed of a metallized film in which a plurality of metals are vapor-deposited among these metals, or may be formed of a metallized film in which an alloy of these metals is vapor-deposited. .. Further, in the above embodiment, the capacitor element 400 is formed by stacking two metallized films in which aluminum is vapor-deposited on a dielectric film, and winding or laminating the laminated metallized films. However, in addition to this, these capacitor elements 400 may be formed by laminating a metallized film in which aluminum is vapor-deposited on both sides of a dielectric film and an insulating film, and winding or laminating them.
  • the film capacitor 1 is mentioned as an example of the capacitor of the present invention.
  • the present invention can also be applied to capacitors other than the film capacitor 1.
  • the present invention is useful for capacitors used in various electronic devices, electrical devices, industrial devices, electrical components of vehicles, and the like.
  • Capacitor 100 Capacitor element unit 110 Through hole 200 Case 300 Filling resin 400 Capacitor element 410 First electrode (electrode) 420 Second electrode (electrode) 500 1st bus bar 515 Projecting piece (engaged part) 520 1st overlapping part 524 1st hole 600 2nd bus bar 620 2nd overlapping part 624 2nd hole 700 Insulation plate 717 3rd hole 718 Claw piece (engagement part) BL boundary

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

A film capacitor 1 is provided with a capacitor element, a first bus bar, a second bus bar, a case, and a fill resin. The first bus bar and the second bus bar each have a first overlapping portion and a second overlapping portion that overlap each other with an insulating plate interposed therebetween. The first overlapping portion, the second overlapping portion, and the insulating plate each have a covered part covered with the fill resin and an exposed part exposed out from the fill resin. The film capacitor 1 further has a through-hole which is formed so as to straddle a boundary between the covered part and the exposed part and which penetrates the first overlapping portion, the second overlapping portion, and the insulating plate in the overlapping direction thereof.

Description

コンデンサCapacitor
　本発明は、コンデンサに関する。 The present invention relates to a capacitor.
　前バスバーおよび後バスバーが接続されたコンデンサ素子がケース内に収容され、当該ケース内に充填樹脂が充填されたフィルムコンデンサであって、前バスバーおよび後バスバーのそれぞれが、絶縁モジュールを挟んで互いに重なり合う第３プレート部を含むことにより、ＥＬＳ（等価直列インダクタンス）の低減が図られるようにしたものが特許文献１に記載されている。各第３プレート部は、ケース内の充填樹脂に覆われた第２プレート部から立ち上がり、充填樹脂に覆われた被覆部と充填樹脂から露出する露出部とを有する。各第３プレート部の上端部には、外部機器の端子が接続される複数の接続端子部が設けられる。 A capacitor element to which the front bus bar and the rear bus bar are connected is housed in a case, and the case is filled with a filling resin. The front bus bar and the rear bus bar each overlap each other with an insulating module in between. Patent Document 1 describes that the ELS (equivalent series inductance) can be reduced by including the third plate portion. Each third plate portion rises from the second plate portion covered with the filling resin in the case, and has a covering portion covered with the filling resin and an exposed portion exposed from the filling resin. A plurality of connection terminal portions to which terminals of external devices are connected are provided at the upper end portion of each third plate portion.
特開２０１７－１１２１６８号公報Japanese Unexamined Patent Publication No. 2017-12168
　上記のフィルムコンデンサは、その用途により、様々な環境下で使用され得る。たとえば、フィルムコンデンサが、温度変化の大きな環境下で使用された場合、金属製である前バスバーおよび後バスバーの各第３プレート部と充填樹脂との間の線膨張係数（熱膨張係数）の違いにより、各第３プレートの被覆部の露出部との境界部分において、互に密着している第３プレート部と充填樹脂とを引き離そうとする応力が生じ、これらの間に亀裂や剥離が生じやすくなる。これにより、充填樹脂の防湿性が低下すると、充填樹脂で覆われたコンデンサ素子に水分が接触することで、コンデンサ素子に容量低下や絶縁劣化などの不具合が生じる虞がある。 The above film capacitors can be used in various environments depending on their application. For example, when a film capacitor is used in an environment with large temperature changes, the difference in the coefficient of linear expansion (coefficient of thermal expansion) between each third plate of the front and rear bus bars made of metal and the filling resin. As a result, stress is generated at the boundary between the exposed portion of the covering portion of each third plate and the third plate portion that is in close contact with each other and the filling resin, and cracks and peeling are likely to occur between them. Become. As a result, when the moisture-proof property of the filling resin is lowered, moisture comes into contact with the capacitor element covered with the filling resin, which may cause problems such as a decrease in capacity and deterioration of insulation in the capacitor element.
　かかる課題に鑑み、本発明は、第１バスバーおよび第２バスバーのそれぞれが、絶縁板を挟んで重なり合う第１重なり部および第２重なり部を有し、これら重なり部において充填樹脂から露出するような構成とされた場合に、これら重なり部と充填樹脂との間に亀裂や剥離が生じにくく、充填樹脂による防湿性の低下を抑制できるコンデンサを提供する目的とする。 In view of such a problem, in the present invention, each of the first bus bar and the second bus bar has a first overlapping portion and a second overlapping portion that overlap each other with the insulating plate sandwiched between them, and the overlapping portions are exposed from the filling resin. It is an object of the present invention to provide a capacitor capable of suppressing a decrease in moisture resistance due to the filling resin because cracks and peeling are unlikely to occur between these overlapping portions and the filling resin when the structure is configured.
　本発明の主たる態様に係るコンデンサは、コンデンサ素子と、前記コンデンサ素子の両端の電極に接続される第１バスバーおよび第２バスバーと、前記コンデンサ素子が収容されるケースと、前記ケース内に充填される充填樹脂と、を備える。ここで、前記第１バスバーおよび前記第２バスバーは、それぞれ、絶縁板を挟んで互いに重ね合される第１重なり部および第２重なり部を有し、前記第１重なり部、前記第２重なり部および前記絶縁板は、前記充填樹脂に覆われる被覆部と前記充填樹脂から露出する露出部とを含む。さらに、コンデンサは、前記被覆部と前記露出部との境界に跨るように形成され、前記第１重なり部、前記第２重なり部および前記絶縁板を、これらが重なる重なり方向に貫通する貫通孔を備える。 The capacitor according to the main aspect of the present invention is filled in the capacitor element, the first bus bar and the second bus bar connected to the electrodes at both ends of the capacitor element, a case in which the capacitor element is housed, and the case. It is provided with a filling resin. Here, the first bus bar and the second bus bar have a first overlapping portion and a second overlapping portion that are overlapped with each other with an insulating plate interposed therebetween, respectively, and the first overlapping portion and the second overlapping portion. And the insulating plate includes a coating portion covered with the filling resin and an exposed portion exposed from the filling resin. Further, the capacitor is formed so as to straddle the boundary between the covering portion and the exposed portion, and has a through hole penetrating the first overlapping portion, the second overlapping portion, and the insulating plate in the overlapping direction in which they overlap. Be prepared.
　本発明によれば、第１バスバーおよび第２バスバーのそれぞれが、絶縁板を挟んで重なり合う第１重なり部および第２重なり部を有し、これら重なり部において充填樹脂から露出するような構成とされた場合に、これら重なり部と充填樹脂との間に亀裂や剥離が生じにくく、充填樹脂による防湿性の低下を抑制できるコンデンサを提供できる。 According to the present invention, each of the first bus bar and the second bus bar has a first overlapping portion and a second overlapping portion that overlap with each other across the insulating plate, and the overlapping portion is exposed from the filling resin. In this case, it is possible to provide a capacitor in which cracks and peeling are less likely to occur between these overlapping portions and the filling resin, and deterioration of moisture resistance due to the filling resin can be suppressed.
　本発明の効果ないし意義は、以下に示す実施の形態の説明により更に明らかとなろう。ただし、以下に示す実施の形態は、あくまでも、本発明を実施化する際の一つの例示であって、本発明は、以下の実施の形態に記載されたものに何ら制限されるものではない。 The effect or significance of the present invention will be further clarified by the description of the embodiments shown below. However, the embodiments shown below are merely examples when the present invention is put into practice, and the present invention is not limited to those described in the following embodiments.
図１は、実施の形態に係る、フィルムコンデンサの斜視図である。FIG. 1 is a perspective view of a film capacitor according to an embodiment. 図２（ａ）は、実施の形態に係る、前方から見たコンデンサ素子ユニットの斜視図であり、図２（ｂ）は、実施の形態に係る、後方から見たコンデンサ素子ユニットの斜視図である。FIG. 2A is a perspective view of the capacitor element unit viewed from the front according to the embodiment, and FIG. 2B is a perspective view of the capacitor element unit viewed from the rear according to the embodiment. is there. 図３（ａ）は、実施の形態に係る、第１バスバーの斜視図であり、図３（ｂ）は、実施の形態に係る、第２バスバーの斜視図である。FIG. 3A is a perspective view of the first busbar according to the embodiment, and FIG. 3B is a perspective view of the second busbar according to the embodiment. 図４（ａ）は、実施の形態に係る、前方から見た絶縁板の斜視図であり、図４（ｂ）は、実施の形態に係る、後方から見た絶縁板の斜視図である。FIG. 4A is a perspective view of the insulating plate viewed from the front according to the embodiment, and FIG. 4B is a perspective view of the insulating plate viewed from the rear according to the embodiment. 図５（ａ）および（ｂ）は、それぞれ、実施の形態に係る、ケースの斜視図および平面図である。5 (a) and 5 (b) are perspective views and plan views of the case according to the embodiment, respectively. 図６は、実施の形態に係る、左から２つ目の貫通孔の位置で切断された、フィルムコンデンサの側面断面図である。FIG. 6 is a side sectional view of the film capacitor cut at the position of the second through hole from the left according to the embodiment.
　以下、本発明のコンデンサの一実施形態であるフィルムコンデンサ１について図を参照して説明する。便宜上、各図には、適宜、前後、左右および上下の方向が付記されている。なお、図示の方向は、あくまでフィルムコンデンサ１の相対的な方向を示すものであり、絶対的な方向を示すものではない。 Hereinafter, the film capacitor 1, which is an embodiment of the capacitor of the present invention, will be described with reference to the drawings. For convenience, each figure is appropriately marked with front-back, left-right, and up-down directions. The direction shown is only a relative direction of the film capacitor 1 and does not indicate an absolute direction.
　本実施の形態において、フィルムコンデンサ１が、特許請求の範囲に記載の「コンデンサ」に対応する。また、第１電極４１０および第２電極４２０が、特許請求の範囲に記載の「電極」に対応する。さらに、突出片５１５が、特許請求の範囲に記載の「被係合部」に対応する。さらに、爪片７１８が、特許請求の範囲に記載の「係合部」に対応する。 In the present embodiment, the film capacitor 1 corresponds to the "capacitor" described in the claims. Further, the first electrode 410 and the second electrode 420 correspond to the "electrode" described in the claims. Further, the protruding piece 515 corresponds to the "engaged portion" described in the claims. Further, the claw piece 718 corresponds to the "engagement portion" described in the claims.
　ただし、上記記載は、あくまで、特許請求の範囲の構成と実施形態の構成とを対応付けることを目的とするものであって、上記対応付けによって特許請求の範囲に記載の発明が実施形態の構成に何ら限定されるものではない。 However, the above description is intended only for the purpose of associating the configuration of the claims with the configuration of the embodiment, and the invention described in the scope of claims by the above association becomes the configuration of the embodiment. It is not limited in any way.
　図１は、フィルムコンデンサ１の斜視図である。 FIG. 1 is a perspective view of the film capacitor 1.
　フィルムコンデンサ１は、コンデンサ素子ユニット１００と、ケース２００と、充填樹脂３００とを備える。コンデンサ素子ユニット１００がケース２００内に収容され、ケース２００内に充填樹脂３００が充填される。充填樹脂３００は、熱硬化性樹脂、たとえば、エポキシ樹脂である。コンデンサ素子ユニット１００の充填樹脂３００に埋没した大部分が、ケース２００および充填樹脂３００によって湿気や衝撃から保護される。 The film capacitor 1 includes a capacitor element unit 100, a case 200, and a filling resin 300. The capacitor element unit 100 is housed in the case 200, and the filling resin 300 is filled in the case 200. The filling resin 300 is a thermosetting resin, for example, an epoxy resin. Most of the capacitor element unit 100 buried in the filling resin 300 is protected from moisture and impact by the case 200 and the filling resin 300.
　図２（ａ）は、前方から見たコンデンサ素子ユニット１００の斜視図であり、図２（ｂ）は、後方から見たコンデンサ素子ユニット１００の斜視図である。図３（ａ）は、第１バスバー５００の斜視図であり、図３（ｂ）は、第２バスバー６００の斜視図である。図４（ａ）は、前方から見た絶縁板７００の斜視図であり、図４（ｂ）は、後方から見た絶縁板７００の斜視図である。 FIG. 2A is a perspective view of the capacitor element unit 100 viewed from the front, and FIG. 2B is a perspective view of the capacitor element unit 100 viewed from the rear. FIG. 3A is a perspective view of the first bus bar 500, and FIG. 3B is a perspective view of the second bus bar 600. FIG. 4A is a perspective view of the insulating plate 700 viewed from the front, and FIG. 4B is a perspective view of the insulating plate 700 viewed from the rear.
　コンデンサ素子ユニット１００は、６個のコンデンサ素子４００と、第１バスバー５００と、第２バスバー６００と、絶縁板７００と、含む。 The capacitor element unit 100 includes six capacitor elements 400, a first bus bar 500, a second bus bar 600, and an insulating plate 700.
　コンデンサ素子４００は、誘電体フィルム上にアルミニウムを蒸着させた２枚の金属化フィルムを重ね、重ねた金属化フィルムを巻回または積層し、扁平状に押圧することにより形成される。コンデンサ素子４００には、一方の端面に、亜鉛等の金属の吹付けにより第１電極４１０が形成され、他方の端面に、同じく亜鉛等の金属の吹付けにより第２電極４２０が形成される。６個のコンデンサ素子４００は、両端面が前後方向を向く状態で左右方向に配列される。 The capacitor element 400 is formed by stacking two metallized films on which aluminum is vapor-deposited on a dielectric film, winding or laminating the laminated metallized films, and pressing them in a flat shape. In the capacitor element 400, the first electrode 410 is formed on one end face by spraying a metal such as zinc, and the second electrode 420 is formed on the other end face by spraying a metal such as zinc. The six capacitor elements 400 are arranged in the left-right direction with both end faces facing the front-rear direction.
　第１バスバー５００は、導電性材料、たとえば、銅板を適宜切り抜き、折り曲げることによって形成され、第１本体部５１０と、第１重なり部５２０と、３つの第１接続端子部５３０とが一体となった構成を有する。 The first bus bar 500 is formed by appropriately cutting out and bending a conductive material, for example, a copper plate, and the first main body portion 510, the first overlapping portion 520, and the three first connection terminal portions 530 are integrated. Has a structure.
　第１本体部５１０は、左右方向に長尺であり、６個のコンデンサ素子４００の周面の大部分を覆う上面部５１０ａと６個のコンデンサ素子４００の第１電極４１０の一部を覆う前面部５１０ｂにより構成される。前面部５１０ｂの下端における各第１電極４１０に対応する位置に、ピン状を有する一対の第１電極端子５１１が形成される。上面部５１０ａには、６つの長円形の流通孔５１２と、５つの円形の流通孔５１３とが、左右方向に交互に並ぶように形成される。また、上面部５１０ａには、６つの流通孔５１２の前方に６つの方形状の流通孔５１４が形成される。各流通孔５１４は、前側が前面部５１０ｂにまで亘る。 The first main body portion 510 is elongated in the left-right direction, and has an upper surface portion 510a that covers most of the peripheral surfaces of the six capacitor elements 400 and a front surface that covers a part of the first electrode 410 of the six capacitor elements 400. It is composed of a part 510b. A pair of pin-shaped first electrode terminals 511 are formed at positions corresponding to the first electrodes 410 at the lower end of the front surface portion 510b. On the upper surface portion 510a, six oval flow holes 512 and five circular flow holes 513 are formed so as to be arranged alternately in the left-right direction. Further, in the upper surface portion 510a, six square flow holes 514 are formed in front of the six flow holes 512. The front side of each distribution hole 514 extends to the front surface portion 510b.
　第１重なり部５２０は、第１本体部５１０の上面部５１０ａの後端から上方（コンデンサ素子４００から離れる方向）に立ち上がる。第１重なり部５２０は、左右方向に長尺（上下方向よりも左右方向に長い）であり、左側部５２０ａが中央部５２０ｂより上方に延び、中央部５２０ｂが右側部５２０ｃよりも上方に延びる。第１重なり部５２０には、左側部５２０ａの左右の端部と中央部５２０ｂの右端部に、それぞれ切欠部５２１、５２２、５２３が形成される。 The first overlapping portion 520 rises upward (in the direction away from the capacitor element 400) from the rear end of the upper surface portion 510a of the first main body portion 510. The first overlapping portion 520 is elongated in the left-right direction (longer in the left-right direction than in the vertical direction), the left side portion 520a extends upward from the central portion 520b, and the central portion 520b extends upward from the right side portion 520c. Notches 521, 522, and 523 are formed in the first overlapping portion 520 at the left and right ends of the left side portion 520a and at the right end of the central portion 520b, respectively.
　第１重なり部５２０には、下端部に、長尺な方向である左右方向に並ぶように、５つの方形状の第１孔５２４が形成される。右端の第１孔５２４は、他の第１孔５２４よりも上下の寸法が小さくされる。各第１孔５２４は、下側が第１本体部５１０の上面部５１０ａにまで亘る。上面部５１０ａには、左から１つ目と４つ目の第１孔５２４の下側の縁部に、後方へ突出する方形状の突出片５１５が形成される。 In the first overlapping portion 520, five square first holes 524 are formed at the lower end portion so as to line up in the left-right direction, which is a long direction. The first hole 524 at the right end has a smaller vertical dimension than the other first holes 524. The lower side of each first hole 524 extends to the upper surface portion 510a of the first main body portion 510. On the upper surface portion 510a, a square protruding piece 515 projecting rearward is formed at the lower edge portion of the first hole 524, which is the first and fourth holes from the left.
　３つの第１接続端子部５３０は、方形状を有し、第１重なり部５２０の左側部５２０ａの上端に、左右方向に所定の間隔を置いて並ぶように設けられる。各第１接続端子部５３０には、円形の取付孔５３１が形成される。 The three first connection terminal portions 530 have a square shape and are provided at the upper ends of the left side portion 520a of the first overlapping portion 520 so as to be arranged at predetermined intervals in the left-right direction. A circular mounting hole 531 is formed in each first connection terminal portion 530.
　第２バスバー６００は、導電性材料、たとえば、銅板を適宜切り抜き、折り曲げることによって形成され、第２本体部６１０と、第２重なり部６２０と、第２接続端子部６３０とが一体となった構成を有する。 The second bus bar 600 is formed by appropriately cutting out and bending a conductive material, for example, a copper plate, and has a configuration in which a second main body portion 610, a second overlapping portion 620, and a second connection terminal portion 630 are integrated. Has.
　第２本体部６１０は、左右方向に長尺であり、６個のコンデンサ素子４００の周面の一部を覆う上面部６１０ａと６個のコンデンサ素子４００の第２電極４２０の一部を覆う後面部６１０ｂにより構成される。後面部６１０ｂの下端における各第２電極４２０に対応する位置に、ピン状を有する一対の第２電極端子６１１が形成される。また、後面部６１０ｂには、左右の端部に方形状の係合孔６１２が形成される。 The second main body portion 610 is elongated in the left-right direction, and after covering a part of the upper surface portion 610a covering a part of the peripheral surface of the six capacitor elements 400 and a part of the second electrode 420 of the six capacitor elements 400. It is composed of a surface portion 610b. A pair of pin-shaped second electrode terminals 611 are formed at positions corresponding to the second electrodes 420 at the lower end of the rear surface portion 610b. Further, in the rear surface portion 610b, square engaging holes 612 are formed at the left and right end portions.
　第２重なり部６２０は、第２本体部６１０の上面部６１０ａの前端から上方（コンデンサ素子４００から離れる方向）に立ち上がる。第２重なり部６２０は、左右方向に長尺（上下方向よりも左右方向に長い）であり、左側部６２０ａが中央部６２０ｂより上方に延び、中央部６２０ｂが右側部６２０ｃよりも上方に延びる。第２重なり部６２０には、左側部６２０ａの左右の端部と中央部６２０ｂの右端部に、それぞれ切欠部６２１、６２２、６２３が形成される。 The second overlapping portion 620 rises upward (in the direction away from the capacitor element 400) from the front end of the upper surface portion 610a of the second main body portion 610. The second overlapping portion 620 is elongated in the left-right direction (longer in the left-right direction than in the vertical direction), the left side portion 620a extends upward from the central portion 620b, and the central portion 620b extends upward from the right side portion 620c. Notches 621, 622, and 623 are formed in the second overlapping portion 620 at the left and right ends of the left side portion 620a and at the right end of the central portion 620b, respectively.
　第２重なり部６２０には、下端部に、長尺な方向である左右方向に並ぶように、５つの方形状の第２孔６２４が形成される。右端の第２孔６２４は、他の第２孔６２４よりも上下の寸法が小さくされる。各第２孔６２４は、下側が第２本体部６１０の後面部６１０ｂにまで亘る。 In the second overlapping portion 620, five square-shaped second holes 624 are formed at the lower end portion so as to line up in the left-right direction, which is a long direction. The rightmost second hole 624 has a smaller vertical dimension than the other second hole 624. The lower side of each second hole 624 extends to the rear surface portion 610b of the second main body portion 610.
　３つの第２接続端子部６３０は、方形状を有し、第２重なり部６２０の左側部６２０ａの上端に、左右方向に所定の間隔を置いて並ぶように設けられる。各第２接続端子部６３０には、円形の取付孔６３１が形成される。 The three second connection terminal portions 630 have a square shape and are provided at the upper ends of the left side portion 620a of the second overlapping portion 620 so as to be arranged at predetermined intervals in the left-right direction. A circular mounting hole 631 is formed in each second connection terminal portion 630.
　絶縁板７００は、ポリフェニレンサルファイド（ＰＰＳ）等の樹脂により形成され、絶縁性を有する。絶縁板７００は、第１絶縁部７１０と第２絶縁部７２０とにより構成される。 The insulating plate 700 is formed of a resin such as polyphenylene sulfide (PPS) and has an insulating property. The insulating plate 700 is composed of a first insulating portion 710 and a second insulating portion 720.
　第１絶縁部７１０は、左右方向に長尺（上下方向よりも左右方向に長い）であり、第１バスバー５００の第１重なり部５２０および第２バスバー６００の第２重なり部６２０の左側部５２０ａ、６２０ａ、中央部５２０ｂ、６２０ｂおよび右側部５２０ｃ、６２０ｃにそれぞれ対応する左側部７１０ａ、中央部７１０ｂおよび右側部７１０ｃを含む。 The first insulating portion 710 is elongated in the left-right direction (longer in the left-right direction than in the vertical direction), and is a left side portion 520a of the first overlapping portion 520 of the first bus bar 500 and the second overlapping portion 620 of the second bus bar 600. , 620a, central 520b, 620b and left side 710a, central 710b and right side 710c corresponding to right side 520c, 620c, respectively.
　第１絶縁部７１０の前面側には、左側部７１０ａの左右の端部と中央部７１０ｂの右端部に、それぞれ鈎状の係合片７１１、７１２、７１３が形成される。係合片７１１の下にリブ７１１ａが繋がり、係合片７１３の上にリブ７１３ａが繋がる。 On the front side of the first insulating portion 710, hook-shaped engaging pieces 711, 712, and 713 are formed at the left and right ends of the left side portion 710a and the right end portion of the central portion 710b, respectively. The rib 711a is connected below the engaging piece 711, and the rib 713a is connected above the engaging piece 713.
　第１絶縁部７１０の後面側には、左側部７１０ａの左右の端部と中央部７１０ｂの右端部に、それぞれ鈎状の係合片７１４、７１５、７１６が形成される。係合片７１４の下にリブ７１４ａが繋がり、係合片７１５の下にリブ７１５ａが繋がり、係合片７１６の上にリブ７１６ａが繋がる。 On the rear surface side of the first insulating portion 710, hook-shaped engaging pieces 714, 715, and 716 are formed at the left and right ends of the left side portion 710a and the right end portion of the central portion 710b, respectively. The rib 714a is connected under the engaging piece 714, the rib 715a is connected under the engaging piece 715, and the rib 716a is connected on the engaging piece 716.
　第１絶縁部７１０には、下端部に、長尺な方向である左右方向に並ぶように、５つの方形状の第３孔７１７が形成される。右端の第３孔７１７は、他の第３孔７１７よりも上下の寸法が小さくされる。各第３孔７１７は、各第１孔５２４および各第２孔６２４に対応する位置に形成される。 In the first insulating portion 710, five square third holes 717 are formed at the lower end portion so as to line up in the left-right direction, which is a long direction. The third hole 717 at the right end has a smaller vertical dimension than the other third holes 717. Each third hole 717 is formed at a position corresponding to each first hole 524 and each second hole 624.
　第１絶縁部７１０には、左から１つ目と４つ目の第３孔７１７の上側の縁部に、下方に延びる爪片７１８が形成される。爪片７１８の先端部には、爪７１８ａが設けられる。 In the first insulating portion 710, a claw piece 718 extending downward is formed on the upper edge of the first and fourth third holes 717 from the left. A nail 718a is provided at the tip of the nail piece 718.
　第２絶縁部７２０は、第１絶縁部７１０の下端に形成され、前後方向に延び、前側に大きく張り出し、後側に僅かに張り出す。第２絶縁部７２０には、後側の左右の端部に、下方に延びる爪片７２１が形成される。爪片７２１の先端部には、爪７２１ａが設けられる。 The second insulating portion 720 is formed at the lower end of the first insulating portion 710, extends in the front-rear direction, greatly overhangs to the front side, and slightly overhangs to the rear side. The second insulating portion 720 is formed with claw pieces 721 extending downward at the left and right ends on the rear side. A nail 721a is provided at the tip of the nail piece 721.
　コンデンサ素子ユニット１００を組み立てる際には、まず、第１バスバー５００が絶縁板７００の前側に装着される。装着の際、第１バスバー５００の第１重なり部５２０が、３つの切欠部５２１、５２２、５２３にそれらに対応する係合片７１１、７１２、７１３を通すようにして、絶縁板７００の第１絶縁部７１０の前面に押し当てられ、その後に押し下げられる。第１バスバー５００の第１本体部５１０の突出片５１５が、第１絶縁部７１０の爪片７１８を後方に弾性変形させながら爪片７１８の下まで移動し、上下方向に爪片７１８と係合する。また、第１絶縁部７１０の左側部７１０ａの左右の係合片７１１、７１２が、第１重なり部５２０の左側部５２０ａの左右の端部と係合し、第１絶縁部７１０の中央部７１０ｂの係合片７１３が、第１重なり部５２０の中央部５２０ｂの右端部と係合する。これにより、第１バスバー５００が絶縁板７００に対して、前後左右および上下方向に動かないよう位置決め固定される。 When assembling the capacitor element unit 100, first, the first bus bar 500 is mounted on the front side of the insulating plate 700. At the time of mounting, the first overlapping portion 520 of the first bus bar 500 passes the engaging pieces 711, 712, 713 corresponding to the three notches 521, 522, 523 through the three notches 521, 522, 523, and the first of the insulating plate 700. It is pressed against the front surface of the insulating portion 710 and then pushed down. The protruding piece 515 of the first main body portion 510 of the first bus bar 500 moves to the bottom of the claw piece 718 while elastically deforming the claw piece 718 of the first insulating portion 710, and engages with the claw piece 718 in the vertical direction. To do. Further, the left and right engaging pieces 711 and 712 of the left side portion 710a of the first insulating portion 710 engage with the left and right end portions of the left side portion 520a of the first overlapping portion 520, and the central portion 710b of the first insulating portion 710 The engaging piece 713 of the above engages with the right end portion of the central portion 520b of the first overlapping portion 520. As a result, the first bus bar 500 is positioned and fixed to the insulating plate 700 so as not to move in the front-rear, left-right, and up-down directions.
　同様にして、第２バスバー６００が絶縁板７００の後側に装着される。装着の際、第２バスバー６００の第２重なり部６２０が、３つの切欠部６２１、６２２、６２３にそれらに対応する係合片７１４、７１５、７１６を通すようにして、絶縁板７００の第１絶縁部７１０の後面に押し当てられ、その後に押し下げられる。第２バスバー６００の第２本体部６１０の後面部６１０ｂが、第２絶縁部７２０の爪片７２１を前方に弾性変形させながら下方へ移動し、後面部６１０ｂの係合孔６１２と爪片７２１とが上下方向に係合する。また、第１絶縁部７１０の左側部７１０ａの左右の係合片７１４、７１５が、第２重なり部６２０の左側部６２０ａの左右の端部と係合し、第１絶縁部７１０の中央部７１０ｂの係合片７１６が、第２重なり部６２０の中央部６２０ｂの右端部と係合する。これにより、第２バスバー６００が絶縁板７００に対して、前後左右および上下方向に動かないよう位置決め固定される。 Similarly, the second bus bar 600 is mounted on the rear side of the insulating plate 700. At the time of mounting, the second overlapping portion 620 of the second bus bar 600 passes the engaging pieces 714, 715, 716 corresponding to the three notches 621, 622, 623 through the three notches 621, 622, 623, and the first of the insulating plate 700. It is pressed against the rear surface of the insulating portion 710 and then pushed down. The rear surface portion 610b of the second main body portion 610 of the second bus bar 600 moves downward while elastically deforming the claw piece 721 of the second insulating portion 720 forward, and the engaging hole 612 and the claw piece 721 of the rear surface portion 610b Engage in the vertical direction. Further, the left and right engaging pieces 714 and 715 of the left side portion 710a of the first insulating portion 710 engage with the left and right end portions of the left side portion 620a of the second overlapping portion 620, and the central portion 710b of the first insulating portion 710 The engaging piece 716 of the second overlapping portion 620 engages with the right end portion of the central portion 620b of the second overlapping portion 620. As a result, the second bus bar 600 is positioned and fixed to the insulating plate 700 so as not to move in the front-rear, left-right, and up-down directions.
　第１重なり部５２０の第１孔５２４と、第２重なり部６２０の第２孔６２４と、第１絶縁部７１０の第３孔７１７とが前後方向に重なることにより、第１重なり部５２０、第２重なり部６２０および第１絶縁部７１０を、これらが重なる前後方向に貫通する貫通孔１１０が形成される。また、第１バスバー５００の３つの第１接続端子部５３０と第２バスバー６００の第２接続端子部６３０とが、左右方向に交互に並ぶ。 The first hole 524 of the first overlapping portion 520, the second hole 624 of the second overlapping portion 620, and the third hole 717 of the first insulating portion 710 overlap in the front-rear direction, so that the first overlapping portion 520 and the first A through hole 110 is formed through the double overlapping portion 620 and the first insulating portion 710 in the front-rear direction in which they overlap. Further, the three first connection terminal portions 530 of the first bus bar 500 and the second connection terminal portions 630 of the second bus bar 600 are arranged alternately in the left-right direction.
　次に、６つのコンデンサ素子４００に、第１バスバー５００および第２バスバー６００が接続される。即ち、第１バスバー５００の第１本体部５１０の各第１電極端子５１１が各コンデンサ素子４００の第１電極４１０に半田付け等の接合方法で接合される。これにより、第１バスバー５００が６つのコンデンサ素子４００の各第１電極４１０に電気的に接続される。同様に、第２バスバー６００の第２本体部６１０の各第２電極端子６１１が各コンデンサ素子４００の第２電極４２０に半田付け等の接合方法で接合される。これにより、第２バスバー６００が６つのコンデンサ素子４００の各第２電極４２０に電気的に接続される。こうして、図２（ａ）および（ｂ）に示すように、コンデンサ素子ユニット１００が完成する。 Next, the first bus bar 500 and the second bus bar 600 are connected to the six capacitor elements 400. That is, each of the first electrode terminals 511 of the first main body portion 510 of the first bus bar 500 is joined to the first electrode 410 of each capacitor element 400 by a joining method such as soldering. As a result, the first bus bar 500 is electrically connected to each first electrode 410 of the six capacitor elements 400. Similarly, each second electrode terminal 611 of the second main body portion 610 of the second bus bar 600 is joined to the second electrode 420 of each capacitor element 400 by a joining method such as soldering. As a result, the second bus bar 600 is electrically connected to each second electrode 420 of the six capacitor elements 400. In this way, as shown in FIGS. 2A and 2B, the capacitor element unit 100 is completed.
　第１バスバー５００の第１重なり部５２０と第２バスバー６００の第２重なり部６２０とが絶縁板７００の第１絶縁部７１０を挟んで前後に重なり合う。これにより、第１バスバー５００と第２バスバー６００とが有するＥＳＬ（等価直列インダクタンス）を低減させることができる。また、第１絶縁部７１０により、第１重なり部５２０と第２重なり部６２０との間の絶縁性が確保される。特に、第３孔７１７は、第１孔５２４および第２孔６２４より小さくされ、第１孔５２４および第２孔６２４の開口領域内に収まるようにされているので、第１重なり部５２０と第２重なり部６２０との間の沿面距離を長くでき、十分に絶縁性を確保できる。さらに、第２絶縁部７２０により、第１重なり部５２０と６つのコンデンサ素子４００の第２電極４２０との間の絶縁性が確保される。 The first overlapping portion 520 of the first bus bar 500 and the second overlapping portion 620 of the second bus bar 600 overlap each other in the front-rear direction with the first insulating portion 710 of the insulating plate 700 interposed therebetween. As a result, the ESL (equivalent series inductance) of the first bus bar 500 and the second bus bar 600 can be reduced. Further, the first insulating portion 710 ensures the insulating property between the first overlapping portion 520 and the second overlapping portion 620. In particular, the third hole 717 is made smaller than the first hole 524 and the second hole 624 so as to fit within the opening region of the first hole 524 and the second hole 624, so that the first overlapping portion 520 and the second hole 724 The creepage distance between the double overlapping portion 620 can be lengthened, and sufficient insulation can be ensured. Further, the second insulating portion 720 secures the insulating property between the first overlapping portion 520 and the second electrode 420 of the six capacitor elements 400.
　図５（ａ）および（ｂ）は、それぞれ、ケース２００の斜視図および平面図である。 5 (a) and 5 (b) are a perspective view and a plan view of the case 200, respectively.
　ケース２００は、樹脂製であり、たとえば、熱可塑性樹脂であるポリフェニレンサルファイド（ＰＰＳ）により形成される。ケース２００は、左右方向に長いほぼ直方体の箱状に形成され、上面が開口する。ケース２００の４つの角部には、内側の上部に収容凹部２１０が形成される。また、ケース２００の底面部、左側面部および右側面部には、外面に、取付タブ２２０が設けられる。各取付タブ２２０には、挿通孔２２１が形成される。挿通孔２２１には、孔の強度を上げるために金属製のカラー２２２が嵌め込まれる。また、左右の取付タブ２２０には、前面に、前方へ突出する位置決めピン２２３が形成される。フィルムコンデンサ１が外部装置の設置部に設置される際、位置決めピン２２３による位置決めがなされた後に、取付タブ２２０がネジ等によって設置部に固定される。 The case 200 is made of resin and is formed of, for example, polyphenylene sulfide (PPS) which is a thermoplastic resin. The case 200 is formed in the shape of a substantially rectangular parallelepiped box that is long in the left-right direction, and the upper surface is open. At the four corners of the case 200, accommodating recesses 210 are formed in the upper part on the inner side. Further, mounting tabs 220 are provided on the outer surfaces of the bottom surface portion, the left side surface portion, and the right side surface portion of the case 200. An insertion hole 221 is formed in each mounting tab 220. A metal collar 222 is fitted into the insertion hole 221 in order to increase the strength of the hole. Further, the left and right mounting tabs 220 are formed with positioning pins 223 protruding forward on the front surface. When the film capacitor 1 is installed in the installation portion of the external device, the mounting tab 220 is fixed to the installation portion by a screw or the like after positioning by the positioning pin 223.
　コンデンサ素子ユニット１００は、開口部２０１を通じてケース２００内に収容される。第１バスバー５００の第１本体部５１０の前面部５１０ｂの左右の端部が、前側の左右の収容凹部２１０に収容され、第２バスバー６００の第２本体部６１０の後面部６１０ｂの左右の端部が、後側の左右の収容凹部２１０に収容される。これにより、コンデンサ素子ユニット１００がケース２００に対して位置決めされる。 The capacitor element unit 100 is housed in the case 200 through the opening 201. The left and right ends of the front surface portion 510b of the first main body portion 510 of the first bus bar 500 are accommodated in the front left and right accommodating recesses 210, and the left and right ends of the rear surface portion 610b of the second main body portion 610 of the second bus bar 600. The portion is accommodated in the left and right accommodating recesses 210 on the rear side. As a result, the capacitor element unit 100 is positioned with respect to the case 200.
　コンデンサ素子ユニット１００が収容されたケース２００内に充填樹脂３００が液相状態で注入される。この際、液相状態の充填樹脂３００が第１バスバー５００に設けられた流通孔５１２、５１３、５１４を通過する。また、液相状態の充填樹脂３００が貫通孔１１０を通過する。これにより、ケース２００内に円滑に充填樹脂３００が充填される。充填樹脂３００は、ケース２００の開口部２０１の近傍位置まで満たされる。その後、ケース２００内が加熱されると充填樹脂３００が硬化する。こうして、図１に示すように、フィルムコンデンサ１が完成する。 The filling resin 300 is injected in a liquid phase state into the case 200 in which the capacitor element unit 100 is housed. At this time, the filling resin 300 in the liquid phase state passes through the flow holes 512, 513, and 514 provided in the first bus bar 500. Further, the filling resin 300 in the liquid phase state passes through the through hole 110. As a result, the filling resin 300 is smoothly filled in the case 200. The filling resin 300 is filled up to a position near the opening 201 of the case 200. After that, when the inside of the case 200 is heated, the filling resin 300 is cured. In this way, as shown in FIG. 1, the film capacitor 1 is completed.
　フィルムコンデンサ１が外部装置に搭載されると、第１バスバー５００の３つの第１接続端子部５３０が、取付孔５３１を用いたネジ止めにより、それらに対応する外部装置の外部端子に接続され、第２バスバー６００の第２接続端子部６３０が、取付孔６３１を用いたネジ止めにより、それらに対応する外部装置の外部端子に接続される。 When the film capacitor 1 is mounted on the external device, the three first connection terminal portions 530 of the first bus bar 500 are connected to the external terminals of the corresponding external device by screwing using the mounting holes 531. The second connection terminal portion 630 of the second bus bar 600 is connected to the external terminal of the corresponding external device by screwing using the mounting hole 631.
　図６は、左から２つ目の貫通孔１１０の位置で切断された、フィルムコンデンサ１の側面断面図である。なお、図６では、便宜上、充填樹脂３００は、その注型面（外部に露出する表面）の部分のみが、破線で示されている。 FIG. 6 is a side sectional view of the film capacitor 1 cut at the position of the second through hole 110 from the left. In FIG. 6, for convenience, only the portion of the casting surface (surface exposed to the outside) of the filling resin 300 is shown by a broken line.
　図６に示すように、コンデンサ素子ユニット１００において、第１バスバー５００の第１重なり部５２０、第２バスバー６００の第２重なり部６２０および絶縁板７００の第１絶縁部７１０は、充填樹脂３００に覆われる被覆部と充填樹脂３００から露出する露出部とを含み、貫通孔１１０は、被覆部と露出部との境界ＢＬに跨るように形成されている。 As shown in FIG. 6, in the capacitor element unit 100, the first overlapping portion 520 of the first bus bar 500, the second overlapping portion 620 of the second bus bar 600, and the first insulating portion 710 of the insulating plate 700 are made of the filling resin 300. The through hole 110 is formed so as to straddle the boundary BL between the covering portion and the exposed portion, including the covering portion to be covered and the exposed portion exposed from the filling resin 300.
　フィルムコンデンサ１が、温度変化の大きな環境下で使用された場合、第１重なり部５２０と充填樹脂３００との間および第２重なり部６２０と充填樹脂３００との間の線膨張係数（熱膨張係数）の違いにより、境界ＢＬの部分において、互に密着している第１重なり部５２０と充填樹脂３００および第２重なり部６２０と充填樹脂３００とを引き離そうとする応力が生じやすい。 When the film capacitor 1 is used in an environment with a large temperature change, the coefficient of linear expansion (coefficient of thermal expansion) between the first overlapping portion 520 and the filling resin 300 and between the second overlapping portion 620 and the filling resin 300. ), In the boundary BL portion, stress is likely to occur to separate the first overlapping portion 520 and the filling resin 300 and the second overlapping portion 620 and the filling resin 300 which are in close contact with each other.
　本実施の形態では、境界ＢＬの部分において、第１重なり部５２０と充填樹脂３００とが密着している部分および第２重なり部６２０と充填樹脂３００とが密着している部分が、複数（５つ）の貫通孔１１０が存在する分だけ少なくなっているため、全体として、第１重なり部５２０と充填樹脂３００との間および第２重なり部６２０と充填樹脂３００との間を引き離そうとする応力が小さくなる。また、第１重なり部５２０と接する充填樹脂３００と第２重なり部６２０と接する充填樹脂３００とが各貫通孔１１０を通じて繋がっているので、充填樹脂３００が絶縁板７００の第１絶縁部７１０によって途切れるような構成とされる場合に比べて、上記の応力に対する抵抗力が強くなり、第１重なり部５２０と充填樹脂３００および第２重なり部６２０と充填樹脂３００とが引き離されにくくなる。これにより、第１重なり部５２０と充填樹脂３００との間および第２重なり部６２０と充填樹脂３００との間に亀裂や剥離が生じにくくなるので、それらの間から充填樹脂３００の内部に水分が侵入しにくくなる。 In the present embodiment, in the boundary BL portion, there are a plurality of portions (5) in which the first overlapping portion 520 and the filling resin 300 are in close contact with each other and the second overlapping portion 620 and the filling resin 300 are in close contact with each other. Since the through hole 110 is reduced by the presence of the through hole 110, the stress that tends to separate the first overlapping portion 520 and the filling resin 300 and the second overlapping portion 620 and the filling resin 300 as a whole is reduced. Becomes smaller. Further, since the filling resin 300 in contact with the first overlapping portion 520 and the filling resin 300 in contact with the second overlapping portion 620 are connected through the through holes 110, the filling resin 300 is interrupted by the first insulating portion 710 of the insulating plate 700. Compared with the case of such a configuration, the resistance to the above stress becomes stronger, and the first overlapping portion 520 and the filling resin 300 and the second overlapping portion 620 and the filling resin 300 are less likely to be separated. As a result, cracks and peeling are less likely to occur between the first overlapping portion 520 and the filling resin 300 and between the second overlapping portion 620 and the filling resin 300, so that moisture can be absorbed inside the filling resin 300 from between them. It becomes difficult to invade.
　＜実施の形態の効果＞
　以上、本実施の形態によれば、以下の効果が奏される。 <Effect of embodiment>
As described above, according to the present embodiment, the following effects are achieved.
　フィルムコンデンサ１は、第１バスバー５００および第２バスバー６００が、それぞれ、絶縁板７００を挟んで互いに重ね合される第１重なり部５２０および第２重なり部６２０を有し、第１重なり部５２０、第２重なり部６２０および絶縁板７００が、充填樹脂３００に覆われる被覆部と充填樹脂３００から露出する露出部とを含む。さらに、フィルムコンデンサ１は、被覆部と露出部との境界ＢＬに跨るように形成され、第１重なり部５２０、第２重なり部６２０および絶縁板７００を、これらが重なる重なり方向（前後方向）に貫通する貫通孔１１０を備える。 In the film capacitor 1, the first bus bar 500 and the second bus bar 600 have a first overlapping portion 520 and a second overlapping portion 620 on which the insulating plate 700 is interposed, respectively, and the first overlapping portion 520, The second overlapping portion 620 and the insulating plate 700 include a coating portion covered with the filling resin 300 and an exposed portion exposed from the filling resin 300. Further, the film capacitor 1 is formed so as to straddle the boundary BL between the covering portion and the exposed portion, and the first overlapping portion 520, the second overlapping portion 620, and the insulating plate 700 are placed in the overlapping direction (front-back direction) in which they overlap. A through hole 110 for penetrating is provided.
　この構成によれば、フィルムコンデンサ１が、ＥＬＳの低減を図るために、第１バスバー５００と第２バスバー６００のそれぞれが、絶縁板７００を挟んで重なり合う第１重なり部５２０および第２重なり部６２０を有し、これら重なり部５２０、６２０において充填樹脂３００から露出するような構成とされた場合に、温度変化の大きな環境下で使用されても、これら重なり部５２０、６２０と充填樹脂３００との間に亀裂や剥離が生じにくくなるので、それらの間から充填樹脂３００の内部に水分が侵入しにくくなり、充填樹脂３００による防湿性の低下が抑制される。 According to this configuration, in order to reduce ELS, the film capacitor 1 has a first overlapping portion 520 and a second overlapping portion 620 on which the first bus bar 500 and the second bus bar 600 are overlapped with each other sandwiching the insulating plate 700. In the case where these overlapping portions 520 and 620 are exposed from the filling resin 300, even if the overlapping portions 520 and 620 are used in an environment with a large temperature change, the overlapping portions 520 and 620 and the filling resin 300 Since cracks and peeling are less likely to occur between them, moisture is less likely to enter the inside of the filling resin 300 from between them, and the deterioration of the moisture-proof property due to the filling resin 300 is suppressed.
　また、第１重なり部５２０、第２重なり部６２０および絶縁板７００には、それぞれ、第１孔５２４、第２孔６２４および第３孔７１７形成され、これらの孔５２４、６２４、７１７が重なることにより貫通孔１１０が形成される。第３孔７１７は、第１孔５２４および第２孔６２４より小さく、第１孔５２４および第２孔６２４の開口領域内に収まる。 Further, the first overlapping portion 520, the second overlapping portion 620, and the insulating plate 700 are formed with the first hole 524, the second hole 624, and the third hole 717, respectively, and these holes 524, 624, and 717 overlap each other. The through hole 110 is formed by the above. The third hole 717 is smaller than the first hole 524 and the second hole 624 and fits within the opening region of the first hole 524 and the second hole 624.
　この構成によれば、貫通孔１１０の部分において、第１重なり部５２０と第２重なり部６２０との間の沿面距離を長くできるので、これらの間の絶縁性を確保しやすい。 According to this configuration, in the portion of the through hole 110, the creepage distance between the first overlapping portion 520 and the second overlapping portion 620 can be increased, so that it is easy to secure the insulating property between them.
　さらに、ケース２００には、複数（６つ）のコンデンサ素子４００が所定方向（左右方向）に並べられて収容される。そして、第１重なり部５２０、第２重なり部６２０および絶縁板７００は、所定方向に長尺となるように形成され、貫通孔１１０は、所定方向に並ぶように複数（５つ）設けられる。 Further, in the case 200, a plurality of (six) capacitor elements 400 are arranged and housed in a predetermined direction (horizontal direction). The first overlapping portion 520, the second overlapping portion 620, and the insulating plate 700 are formed so as to be elongated in a predetermined direction, and a plurality (five) through holes 110 are provided so as to be arranged in a predetermined direction.
　この構成によれば、ＥＬＳが低減しやすいように、第１重なり部５２０と第２重なり部６２０が複数のコンデンサ素子４００が並ぶ方向に長尺となるように形成されても、長尺な方向に複数の貫通孔１１０が並べられることにより、第１重なり部５２０および第２重なり部６２０と充填樹脂３００との間に亀裂や剥離が生じやすくならないようにでき、充填樹脂３００による防湿性の低下を抑制できる。 According to this configuration, even if the first overlapping portion 520 and the second overlapping portion 620 are formed to be long in the direction in which the plurality of capacitor elements 400 are lined up so that the ELS can be easily reduced, the direction is long. By arranging a plurality of through holes 110 in the same space, it is possible to prevent cracks and peeling from easily occurring between the first overlapping portion 520 and the second overlapping portion 620 and the filling resin 300, and the moisture resistance of the filling resin 300 is reduced. Can be suppressed.
　さらに、絶縁板７００には、第３孔７１７の縁部から第１重なり部５２０、第２重なり部６２０および絶縁板７００が重なる方向と垂直な方向（下方向）に延びる爪片７１８が設けられ、第１バスバー５００には、爪片７１８と係合する突出片５１５が設けられる。 Further, the insulating plate 700 is provided with a claw piece 718 extending from the edge of the third hole 717 in a direction (downward) perpendicular to the direction in which the first overlapping portion 520, the second overlapping portion 620, and the insulating plate 700 overlap. , The first bus bar 500 is provided with a protruding piece 515 that engages with the claw piece 718.
　この構成によれば、貫通孔１１０を構成するために絶縁板７００に形成された第３孔７１７を利用して、第１バスバー５００の絶縁板７００に対する位置決めを行うことができる。 According to this configuration, the third hole 717 formed in the insulating plate 700 to form the through hole 110 can be used to position the first bus bar 500 with respect to the insulating plate 700.
　以上、本発明の実施の形態について説明したが、本発明は、上記実施の形態に限定されるものではなく、また、本発明の適用例も、上記実施の形態の他に、種々の変更が可能である。 Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and application examples of the present invention also have various changes in addition to the above-described embodiments. It is possible.
　たとえば、上記実施の形態では、第１バスバー５００の第１重なり部５２０、第２バスバー６００の第２重なり部６２０および絶縁板７００の第１絶縁部７１０が、コンデンサ素子４００の並び方向（左右方向）に長尺となるように形成され、その長尺な方向に並ぶように、貫通孔１１０が複数設けられた。しかしながら、第１重なり部５２０、第２重なり部６２０および第１絶縁部７１０は、コンデンサ素子４００の並び方向に長尺でなくともよく、この場合に、貫通孔１１０が一つだけ設けられるようにされてもよい。 For example, in the above embodiment, the first overlapping portion 520 of the first bus bar 500, the second overlapping portion 620 of the second bus bar 600, and the first insulating portion 710 of the insulating plate 700 are arranged in the arrangement direction (horizontal direction) of the capacitor elements 400. ) Is formed to be long, and a plurality of through holes 110 are provided so as to be arranged in the long direction. However, the first overlapping portion 520, the second overlapping portion 620, and the first insulating portion 710 do not have to be long in the alignment direction of the capacitor elements 400, and in this case, only one through hole 110 is provided. May be done.
　さらに、上記実施の形態では、絶縁板７００の第２絶縁部７２０に設けられた爪片７２１と第２バスバー６００に設けられた係合孔６１２と係合により、第２バスバー６００の絶縁板７００に対する上下方向の位置決めが行われた。しかしながら、絶縁板７００の第１絶縁部７１０における、第１バスバー５００のための爪片７１８が設けられていない第３孔７１７に、第２バスバー６００のための爪片が設けられる一方、第２バスバー６００の第２本体部６１０の上面部６１０ａに突出片が設けられ、これら爪片と突出片との係合により、第２バスバー６００の絶縁板７００に対する上下方向の位置決めが行われるようにしてもよい。 Further, in the above embodiment, the insulating plate 700 of the second bus bar 600 is engaged with the claw piece 721 provided in the second insulating portion 720 of the insulating plate 700 and the engaging hole 612 provided in the second bus bar 600. The vertical positioning with respect to the above was performed. However, in the first insulating portion 710 of the insulating plate 700, the claw piece 718 for the first bus bar 500 is not provided in the third hole 717, while the claw piece for the second bus bar 600 is provided, while the second Protruding pieces are provided on the upper surface portion 610a of the second main body portion 610 of the bus bar 600, and the claw pieces and the protruding pieces are engaged with each other so that the second bus bar 600 is positioned in the vertical direction with respect to the insulating plate 700. May be good.
　さらに、上記実施の形態では、コンデンサ素子ユニット１００に６個のコンデンサ素子４００が含まれる。しかしながら、コンデンサ素子４００の個数は、１個である場合も含めて、適宜、変更することができる。 Further, in the above embodiment, the capacitor element unit 100 includes six capacitor elements 400. However, the number of capacitor elements 400 can be changed as appropriate, including the case where the number of capacitor elements 400 is one.
　さらに、上記実施の形態では、コンデンサ素子４００は、誘電体フィルム上にアルミニウムを蒸着させた金属化フィルムにより形成されたが、これ以外にも、亜鉛、マグネシウム等の他の金属を蒸着させた金属化フィルムにより形成されてもよい。あるいは、コンデンサ素子４００は、これらの金属のうち、複数の金属を蒸着させた金属化フィルムにより形成されてもよいし、これらの金属どうしの合金を蒸着させた金属化フィルムにより形成されてもよい。また、上記実施の形態では、コンデンサ素子４００は、誘電体フィルム上にアルミニウムを蒸着させた２枚の金属化フィルムを重ね、重ねた金属化フィルムを巻回または積層することで形成されたものであるが、これ以外にも、誘電体フィルムの両面にアルミニウムを蒸着させた金属化フィルムと絶縁フィルムとを重ね、これを巻回または積層することにより、これらコンデンサ素子４００が形成されてもよい。 Further, in the above embodiment, the capacitor element 400 is formed of a metallized film in which aluminum is vapor-deposited on a dielectric film, but in addition to this, a metal in which other metals such as zinc and magnesium are vapor-deposited. It may be formed by a chemical film. Alternatively, the capacitor element 400 may be formed of a metallized film in which a plurality of metals are vapor-deposited among these metals, or may be formed of a metallized film in which an alloy of these metals is vapor-deposited. .. Further, in the above embodiment, the capacitor element 400 is formed by stacking two metallized films in which aluminum is vapor-deposited on a dielectric film, and winding or laminating the laminated metallized films. However, in addition to this, these capacitor elements 400 may be formed by laminating a metallized film in which aluminum is vapor-deposited on both sides of a dielectric film and an insulating film, and winding or laminating them.
　さらに、上記実施の形態では、本発明のコンデンサの一例として、フィルムコンデンサ１が挙げられた。しかしながら、本発明は、フィルムコンデンサ１以外のコンデンサに適用することもできる。 Further, in the above embodiment, the film capacitor 1 is mentioned as an example of the capacitor of the present invention. However, the present invention can also be applied to capacitors other than the film capacitor 1.
　この他、本発明の実施の形態は、特許請求の範囲に示された技術的思想の範囲内において、適宜、種々の変更が可能である。 In addition, various modifications of the embodiment of the present invention can be made as appropriate within the scope of the technical idea shown in the claims.
　なお、上記実施の形態の説明において「上方」「下方」等の方向を示す用語は、構成部材の相対的な位置関係にのみ依存する相対的な方向を示すものであり、鉛直方向、水平方向等の絶対的な方向を示すものではない。 In the description of the above-described embodiment, terms such as "upper" and "lower" indicate relative directions that depend only on the relative positional relationship of the constituent members, and are vertical and horizontal directions. It does not indicate the absolute direction such as.
　本発明は、各種電子機器、電気機器、産業機器、車両の電装等に使用されるコンデンサに有用である。 The present invention is useful for capacitors used in various electronic devices, electrical devices, industrial devices, electrical components of vehicles, and the like.
　１　フィルムコンデンサ（コンデンサ）
　１００　コンデンサ素子ユニット
　１１０　貫通孔
　２００　ケース
　３００　充填樹脂
　４００　コンデンサ素子
　４１０　第１電極（電極）
　４２０　第２電極（電極）
　５００　第１バスバー
　５１５　突出片（被係合部）
　５２０　第１重なり部
　５２４　第１孔
　６００　第２バスバー
　６２０　第２重なり部
　６２４　第２孔
　７００　絶縁板
　７１７　第３孔
　７１８　爪片（係合部）
　ＢＬ　境界 1 Film capacitor (capacitor)
100 Capacitor element unit 110 Through hole 200 Case 300 Filling resin 400 Capacitor element 410 First electrode (electrode)
420 Second electrode (electrode)
500 1st bus bar 515 Projecting piece (engaged part)
520 1st overlapping part 524 1st hole 600 2nd bus bar 620 2nd overlapping part 624 2nd hole 700 Insulation plate 717 3rd hole 718 Claw piece (engagement part)
BL boundary

Claims (5)

  1. 　コンデンサ素子と、
    　前記コンデンサ素子の両端の電極に接続される第１バスバーおよび第２バスバーと、
    　前記コンデンサ素子が収容されるケースと、
    　前記ケース内に充填される充填樹脂と、を備え、
    　前記第１バスバーおよび前記第２バスバーは、それぞれ、絶縁板を挟んで互いに重ね合される第１重なり部および第２重なり部を有し、
    　前記第１重なり部、前記第２重なり部および前記絶縁板は、前記充填樹脂に覆われる被覆部と前記充填樹脂から露出する露出部とを含み、
    　前記被覆部と前記露出部との境界に跨るように形成され、前記第１重なり部、前記第２重なり部および前記絶縁板を、これらが重なる重なり方向に貫通する貫通孔を、さらに備える、
    ことを特徴とするコンデンサ。     Capacitor element and
    The first bus bar and the second bus bar connected to the electrodes at both ends of the capacitor element,
    A case in which the capacitor element is housed and
    With a filling resin filled in the case,
    The first bus bar and the second bus bar each have a first overlapping portion and a second overlapping portion that are overlapped with each other with an insulating plate interposed therebetween.
    The first overlapping portion, the second overlapping portion, and the insulating plate include a coating portion covered with the filling resin and an exposed portion exposed from the filling resin.
    It is formed so as to straddle the boundary between the covering portion and the exposed portion, and further includes a through hole that penetrates the first overlapping portion, the second overlapping portion, and the insulating plate in the overlapping direction in which they overlap.
    A capacitor that is characterized by that.
  2. 　請求項１に記載のコンデンサにおいて、
    　前記第１重なり部、前記第２重なり部および前記絶縁板には、それぞれ、第１孔、第２孔および第３孔が形成され、
    　前記第１孔、前記第２孔および前記第３孔が重なることにより、前記貫通孔が形成される、
    ことを特徴とするコンデンサ。     In the capacitor according to claim 1,
    A first hole, a second hole, and a third hole are formed in the first overlapping portion, the second overlapping portion, and the insulating plate, respectively.
    The through hole is formed by overlapping the first hole, the second hole, and the third hole.
    A capacitor that is characterized by that.
  3. 　請求項２に記載のコンデンサにおいて、
    　前記第３孔は、前記第１孔および前記第２孔より小さく、前記第１孔および前記第２孔の開口領域内に収まる、
    ことを特徴とするコンデンサ。     In the capacitor according to claim 2,
    The third hole is smaller than the first hole and the second hole and fits within the opening region of the first hole and the second hole.
    A capacitor that is characterized by that.
  4. 　請求項１ないし３の何れか一項に記載のコンデンサにおいて、
    　前記ケースには、複数の前記コンデンサ素子が所定方向に並べられて収容され、
    　前記第１重なり部、前記第２重なり部および前記絶縁板は、前記所定方向に長尺であり、
    　前記貫通孔は、前記所定方向に並ぶように複数設けられる、
    ことを特徴とするコンデンサ。     In the capacitor according to any one of claims 1 to 3.
    A plurality of the capacitor elements are arranged and housed in a predetermined direction in the case.
    The first overlapping portion, the second overlapping portion, and the insulating plate are elongated in the predetermined direction.
    A plurality of the through holes are provided so as to be arranged in the predetermined direction.
    A capacitor that is characterized by that.
  5. 　請求項１ないし４の何れか一項に記載のコンデンサにおいて、
    　前記絶縁板には、前記第３孔の縁部から前記重なり方向と垂直な方向に延びる係合部が設けられ、
    　前記第１バスバーには、前記係合部と係合する被係合部が設けられる、
    ことを特徴とするコンデンサ。     In the capacitor according to any one of claims 1 to 4.
    The insulating plate is provided with an engaging portion extending from the edge of the third hole in a direction perpendicular to the overlapping direction.
    The first bus bar is provided with an engaged portion that engages with the engaging portion.
    A capacitor that is characterized by that.
PCT/JP2020/038545 2019-10-29 2020-10-12 Capacitor WO2021085107A1 (en)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005085880A (en) * 2003-09-05 2005-03-31 Shizuki Electric Co Inc Electrical component
JP2010251400A (en) * 2009-04-13 2010-11-04 Panasonic Corp Case-molded type capacitor
WO2016027462A1 (en) * 2014-08-21 2016-02-25 パナソニックＩｐマネジメント株式会社 Film capacitor
WO2017081853A1 (en) * 2015-11-10 2017-05-18 パナソニックＩｐマネジメント株式会社 Film capacitor
WO2018101260A1 (en) * 2016-11-29 2018-06-07 京セラ株式会社 Film capacitor, inverter and electric vehicle
WO2018198527A1 (en) * 2017-04-26 2018-11-01 パナソニックＩｐマネジメント株式会社 Capacitor
WO2019107128A1 (en) * 2017-11-29 2019-06-06 パナソニックＩｐマネジメント株式会社 Capacitor

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005085880A (en) * 2003-09-05 2005-03-31 Shizuki Electric Co Inc Electrical component
JP2010251400A (en) * 2009-04-13 2010-11-04 Panasonic Corp Case-molded type capacitor
WO2016027462A1 (en) * 2014-08-21 2016-02-25 パナソニックＩｐマネジメント株式会社 Film capacitor
WO2017081853A1 (en) * 2015-11-10 2017-05-18 パナソニックＩｐマネジメント株式会社 Film capacitor
WO2018101260A1 (en) * 2016-11-29 2018-06-07 京セラ株式会社 Film capacitor, inverter and electric vehicle
WO2018198527A1 (en) * 2017-04-26 2018-11-01 パナソニックＩｐマネジメント株式会社 Capacitor
WO2019107128A1 (en) * 2017-11-29 2019-06-06 パナソニックＩｐマネジメント株式会社 Capacitor

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