WO2021064895A1

WO2021064895A1 - Processing system, control device, control method, and computer program

Info

Publication number: WO2021064895A1
Application number: PCT/JP2019/038922
Authority: WO
Inventors: 和樹上野; ふみ香志岐
Original assignee: 株式会社ニコン
Priority date: 2019-10-02
Filing date: 2019-10-02
Publication date: 2021-04-08

Abstract

This processing system is for performing a processing by using powder and is provided with: a powder supply device for supplying powder; an imaging device for imaging powder passing through a powder supply path; and a control device for controlling the powder supply device on the basis of a powder image imaged by the imaging device.

Description

Machining system, control device, control method and computer program

The present invention relates to, for example, a processing system that performs processing using powder, and a technical field of a control device, a control method, and a computer program that controls the processing system.

Patent Document 1 describes a processing system that performs a processing process for forming a modeled object by melting the powder with an energy beam and then solidifying the melted powder. In such a processing system, it is a technical problem to appropriately supply powder.

U.S. Pat. No. 5,038,014

According to the first aspect, it is a processing system that performs processing using powder, and images the powder supply device that supplies the powder and the powder that passes through the powder supply path. A processing system including an image pickup device and a control device for controlling the powder supply device based on an image of the powder imaged by the image pickup device is provided.

According to the second aspect, it is a processing system that performs a processing process using an energy beam and a powder, the irradiation device that irradiates the energy beam, the powder supply device that supplies the powder, and the said. A processing system including an image pickup device that images the powder passing through a powder supply path and a control device that controls the irradiation device based on the image captured by the image pickup device is provided.

According to the third aspect, in a processing system that processes an object using powder, the powder supply device that supplies the powder and the powder that passes through the powder supply path are supplied. The position based on the image pickup device for imaging, the position change device for changing the positional relationship between the powder supply position supplied to the object and the object, and the powder image captured by the image pickup device. A machining system including a control device for controlling a change device is provided.

According to the fourth aspect, it is a processing system that performs processing using powder, and images the powder supply device that supplies the powder and the powder that passes through the powder supply path. A processing system including an image pickup device and a receiving device that receives the control signal from a control device that generates a control signal for controlling the powder supply device based on an image of the powder imaged by the image pickup device. Is provided.

According to the fifth aspect, it is a processing system that performs a processing process using an energy beam and a powder, the irradiation device that irradiates the energy beam, the powder supply device that supplies the powder, and the said. From the image pickup device that images the powder passing through the powder supply path and the control device that generates a control signal for controlling the irradiation device based on the image of the powder imaged by the image pickup device, the said A processing system including a receiving device for receiving a control signal is provided.

According to the sixth aspect, in a processing system that processes an object using powder, the powder supply device that supplies the powder and the powder that passes through the powder supply path are combined. The position change based on the image pickup device for imaging, the position change device for changing the positional relationship between the powder supply position supplied to the object and the object, and the powder image captured by the image pickup device. A processing system including a receiving device for receiving the control signal is provided from a control device for generating a control signal for controlling the device.

According to a seventh aspect, it is a control device that controls a processing system that performs processing using powder, and the processing system includes a powder supply device that supplies the powder, and the processing of the powder. A control device for controlling the powder supply device is provided based on an image of the powder obtained by imaging the powder passing through the supply path.

According to an eighth aspect, the control device controls a processing system that performs processing using an energy beam and powder, and the processing system includes an irradiation device that irradiates the energy beam and the powder. A control device for controlling the irradiation device based on an image of the powder obtained by imaging the powder passing through the powder supply path is provided. To.

According to a ninth aspect, it is a control device that controls a processing system that processes an object using powder, and the processing system is a powder supply device that supplies the powder and the object. The powder obtained by imaging the powder passing through the supply path of the powder, provided with a position changing device for changing the positional relationship between the supplied position of the powder to be supplied and the object. A control device for controlling the position changing device based on an image is provided.

According to a tenth aspect, it is a control method for controlling a processing system that performs processing using powder, wherein the processing system includes a powder supply device that supplies the powder, and the powder A control method including acquiring an image of the powder obtained by imaging the powder passing through the supply path and controlling the powder supply device based on the image of the powder. Is provided.

According to the eleventh aspect, it is a control method for controlling a processing system that performs processing processing using an energy beam and powder, wherein the processing system includes an irradiation device that irradiates the energy beam and the powder. The powder supply device is provided, and an image of the powder obtained by imaging the powder passing through the powder supply path is obtained, and based on the image of the powder. A control method including controlling the irradiation device is provided.

According to the twelfth aspect, it is a control method for controlling a processing system that processes an object using powder, and the processing system is a powder supply device that supplies the powder and the object. The powder obtained by imaging the powder passing through the powder supply path with a position changing device for changing the positional relationship between the supplied powder supply position and the object. A control device is provided that includes acquiring an image and controlling the position changing device based on the image of the powder.

According to the thirteenth aspect, it is a computer program executed by a computer that controls a processing system that performs processing using powder, and the processing system includes a powder supply device that supplies the powder. The computer program acquires an image of the powder obtained by imaging the powder passing through the supply path of the powder on the computer, and based on the image of the powder, A computer program for controlling and executing the powder feeding device is provided.

According to a fourteenth aspect, the processing system is a computer program executed by a computer that controls a processing system that performs processing using an energy beam and powder, and the processing system is an irradiation device that irradiates the energy beam. And a powder supply device for supplying the powder, the computer program obtains an image of the powder obtained by imaging the powder passing through the supply path of the powder on the computer. A computer program is provided that executes the acquisition of the above and the control of the irradiation device based on the image of the powder.

According to a fifteenth aspect, a computer program executed by a computer that controls a processing system that processes an object using powder, wherein the processing system is a powder supply device that supplies the powder. And a position changing device for changing the positional relationship between the powder supply position supplied to the object and the object, the computer program causes the computer to pass through the powder supply path. A computer program is provided that acquires an image of the powder obtained by imaging the powder and controls the position changing device based on the image of the powder.

The actions and other gains of the present invention will be clarified from the embodiments described below.

FIG. 1 is a cross-sectional view showing the structure of the processing system of the present embodiment. FIG. 2 is a system configuration diagram showing a system configuration of the processing system of the present embodiment. FIG. 3 is a cross-sectional view showing the structure of the material supply device of the present embodiment. FIG. 4 is a side view showing the structure of the holding member included in the material supply device. FIG. 5A is a perspective view showing the structure of the first example of the transport member included in the material supply device, and FIG. 5B is a front view showing the structure of the first example of the transport member. .. FIG. 6 (a) is a perspective view showing the structure of a second example of the transport member included in the material supply device, and each of FIGS. 6 (b) to 6 (c) is a second example of the transport member. It is sectional drawing which shows the structure of. Each of FIGS. 7 (a) to 7 (e) is a cross-sectional view showing a state in which light is irradiated and a modeling material is supplied in a certain region on the work. Each of FIGS. 8 (a) to 8 (c) is a cross-sectional view showing a process of forming a three-dimensional structure. FIG. 9 is a cross-sectional view showing a material supply device that supplies modeling materials. FIG. 10 is a flowchart showing a flow of a supply amount control operation for controlling the actual supply amount of the modeling material. FIG. 11 is a plan view showing an example of the original image captured by the imaging device. FIG. 12 is a plan view showing an example of a binarized image generated by performing a binarization process on the original image. FIG. 13 is a graph showing correlation information showing the correlation between the area occupied by the modeling material in the binarized image and the actual supply amount of the modeling material. FIG. 14 is a graph showing the time change of the actual supply amount of the modeling material M. FIG. 15 is a graph showing the time change of the actual supply amount of the modeling material M. FIG. 16 is a cross-sectional view showing an imaging device that images an imaging target path. FIG. 17 is a cross-sectional view showing an example of an image pickup apparatus that images a modeling material passing through a supply path between a material nozzle and a work. FIG. 18 is a cross-sectional view showing an example of an image pickup apparatus that images a modeling material passing through a supply path between a material nozzle and a work. FIG. 19 is a cross-sectional view showing an example of an image pickup apparatus that images a modeling material passing through a supply path between a material nozzle and a work. FIG. 20A is a cross-sectional view showing a machining system in which the actual supply direction and the target supply direction do not match, and FIG. 20B is a machining in which the actual supply direction and the target supply direction coincide with each other. It is sectional drawing which shows the system. FIG. 21 is a graph showing an example of the correlation between the particle size of the modeling material and the intensity of the processing light. FIG. 22 is a graph showing the correlation between the control amount (specifically, the rotation speed) of the transport member by the feedback control and the actual supply amount of the modeling material. FIG. 23 shows an actual supply amount of the modeling material M that periodically fluctuates in synchronization with the rotation cycle of the transfer member under a situation where feedback control is not performed, and a control amount of the transfer member by feedback control (specifically, Is a graph showing the rotation speed) and the actual supply amount of the modeling material M under the condition that the feedback control is performed. FIG. 24 (a) is a cross-sectional view showing how the modeling material falls from a gap located below the central axis of the shaft member, and FIG. 24 (b) is a sectional view showing how the molding material falls below the central axis of the shaft member. FIG. 24 (c) is a front view showing how the modeling material falls from the gap, and FIG. 24 (c) is a cross-sectional view showing how the modeling material falls from the gap located above the central axis of the shaft member. 24 (d) is a front view showing how the modeling material falls from the gap located above the central axis of the shaft member, and FIG. 24 (e) shows the modeling material falling from the gap per unit time. It is a graph which shows the quantity. FIG. 25 is a perspective view showing the configuration of a processing head including a plurality of material nozzles.

Hereinafter, the processing system, the control device, the control method, and the embodiment of the computer program will be described with reference to the drawings. Hereinafter, embodiments of a machining system, a control device, a control method, and a computer program will be described using the machining system SYS machining system SYS that performs additional machining on the work W, which is an example of an object. In particular, in the following, a machining system, a control device, a control method, and an embodiment of a computer program will be described using a machining system SYS that performs machining processing including additional machining based on a laser overlay welding method (LMD: Laser Metal Deposition). To do. In the additional processing based on the laser overlay welding method, the modeling material M supplied to the work W is melted by the processing light EL (energy beam having the form of light) to be integrated with the work W or separated from the work W. This is an additional process for forming a possible three-dimensional structure ST.

Further, in the following description, the positional relationship of various components constituting the machining system SYS will be described using the XYZ Cartesian coordinate system defined from the X-axis, the Y-axis, and the Z-axis which are orthogonal to each other. In the following description, for convenience of explanation, each of the X-axis direction and the Y-axis direction is a horizontal direction (that is, a predetermined direction in the horizontal plane), and the Z-axis direction is a vertical direction (that is, a direction orthogonal to the horizontal plane). Yes, it is assumed that it is substantially in the vertical direction). Further, the rotation directions (in other words, the inclination direction) around the X-axis, the Y-axis, and the Z-axis are referred to as the θX direction, the θY direction, and the θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. Further, the XY plane may be horizontal.

(1) Structure of Processing System SYS First, the structure of the processing system SYS of the present embodiment will be described.

(1-1) Overall Structure of Machining System SYS First, the overall structure of the machining system SYS of the present embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is a cross-sectional view showing an example of the structure of the processing system SYS of the present embodiment. FIG. 2 is a system configuration diagram showing an example of the system configuration of the processing system SYS of the present embodiment.

The processing system SYS can form a three-dimensional structure ST (that is, a three-dimensional object having a size in any of the three-dimensional directions and a three-dimensional object). The processing system SYS can form the three-dimensional structure ST on the work W that is the basis for forming the three-dimensional structure ST. The processing system SYS can form the three-dimensional structure ST on the work W that is the target of additional processing (that is, the target of processing). This work W may be referred to as a base material or a pedestal. The processing system SYS can form a three-dimensional structure ST by performing additional processing on the work W. When the work W is the stage 31, which will be described later, the machining system SYS can form the three-dimensional structure ST on the stage 31. When the work W is an existing structure held by the stage 31 (or supported or mounted on the stage 31), the processing system SYS puts the three-dimensional structure ST on the existing structure. It can be formed. In this case, the processing system SYS may form a three-dimensional structure ST integrated with the existing structure. The operation of forming the three-dimensional structure ST integrated with the existing structure can be regarded as equivalent to the operation of adding a new structure to the existing structure. The existing structure may be, for example, a repair-required product having a defective portion. The processing system SYS may form a three-dimensional structure ST on the repair-required product so as to fill the defective portion of the repair-required product. Alternatively, the processing system SYS may form a three-dimensional structure ST separable from the existing structure. Note that FIG. 1 shows an example in which the work W is an existing structure held by the stage 31. Further, in the following, the description will proceed with reference to an example in which the work W is an existing structure held by the stage 31.

As described above, the processing system SYS can form the three-dimensional structure ST by the laser overlay welding method. That is, it can be said that the processing system SYS is a 3D printer that forms an object by using the laminated modeling technology. The laminated modeling technique is also referred to as rapid prototyping, rapid manufacturing, or adaptive manufacturing.

In order to form the three-dimensional structure ST, the processing system SYS has a material supply device 1, a processing device 2, a stage device 3, a light source 4, and a gas supply device 5, as shown in FIGS. 1 and 2. A housing 6, a control device 7, an image pickup device 8, and a lighting device 9 are provided. At least a part of each of the processing device 2 and the stage device 3 is housed in the chamber space 63IN inside the housing 6. The housing 6 may be referred to as a housing. The housing is not limited to the box shape and may have other shapes.

The material supply device 1 supplies the modeling material M to the processing device 2. The processing apparatus 2 supplies the modeling material M to the work W as described later. Therefore, the material supply device 1 may be regarded as supplying the modeling material M to the work W via the processing device 2. The material supply device 1 corresponds to the required amount so that the modeling material M required for the processing device 2 to form the three-dimensional structure ST is supplied to the processing device 2. The modeling material M is supplied at the supply rate. That is, the material supply device 1 supplies the modeling material M so that the supply amount of the modeling material M per unit time becomes a desired supply amount according to the required amount. Since the structure of the material supply device 1 will be described in detail later with reference to FIG. 3 and the like, detailed description thereof will be omitted here.

The modeling material M is a material that can be melted by irradiation with a processing light EL having a predetermined intensity or higher. As such a modeling material M, for example, at least one of a metal material and a resin material can be used. However, as the modeling material M, other materials different from the metal material and the resin material may be used. The modeling material M is a powdery material. That is, the modeling material M is a powder. The powder may contain a granular material in addition to the powdery material. The modeling material M may contain, for example, a powder having a particle size within the range of 90 micrometers ± 40 micrometers. The average particle size of the powders constituting the modeling material M may be, for example, 75 micrometers or other sizes.

The processing device 2 forms the three-dimensional structure ST using the modeling material M supplied from the material supply device 1. In order to form the three-dimensional structure ST using the modeling material M, the processing apparatus 2 includes a processing head 21 and a head drive system 22. Further, the processing head 21 includes an irradiation optical system 211 and a material nozzle (that is, a supply system or a supply device for supplying the modeling material M) 212. The processing head 21 and the head drive system 22 are housed in the chamber space 63IN. However, at least a part of the processing head 21 and / or the head drive system 22 may be arranged in the external space 64OUT, which is the space outside the housing 6. The external space 64OUT may be a space accessible to the operator of the processing system SYS.

The irradiation optical system 211 is an optical system (for example, a condensing optical system) for emitting the processed light EL from the injection unit 213. Specifically, the irradiation optical system 211 is optically connected to the light source 4 that emits the processed light EL via an optical transmission member (not shown) such as an optical fiber or a light pipe. The irradiation optical system 211 emits the processed light EL propagating from the light source 4 via the optical transmission member. The irradiation optical system 211 emits the processing light EL so that the processing light EL advances in the chamber space 63IN. The irradiation optical system 211 irradiates the processed light EL downward (that is, the −Z side) from the irradiation optical system 211. A stage 31 is arranged below the irradiation optical system 211. When the work W is placed on the stage 31, the irradiation optical system 211 irradiates the work W with the processing light EL. Specifically, the irradiation optical system 211 can irradiate the irradiation area EA set on the work W as the area where the processing light EL is irradiated (typically, the light is focused). .. Further, the state of the irradiation optical system 211 can be switched between a state in which the irradiation area EA is irradiated with the processing light EL and a state in which the irradiation area EA is not irradiated with the processing light EL under the control of the control device 7. .. The direction of the processed light EL emitted from the irradiation optical system 211 is not limited to directly below (that is, coincident with the −Z axis direction), and is, for example, a direction tilted by a predetermined angle with respect to the Z axis. May be good.

The material nozzle 212 is a material supply member (powder supply member) that supplies the modeling material M toward the work W. Specifically, the material nozzle 212 is formed with a supply port 214 for supplying the modeling material M. The supply port 214 is formed, for example, in a portion of the material nozzle 212 facing the work W side (that is, a portion facing the work W and facing the −Z side). The material nozzle 212 supplies the modeling material M from the supply port 214 (for example, spraying, ejecting, or spraying). The material nozzle 212 is physically connected to the material supply device 1 via a pipe (not shown) or the like. The material nozzle 212 supplies the modeling material M supplied from the material supply device 1 via a pipe. The material nozzle 212 may pump the modeling material M supplied from the material supply device 1 via a pipe. That is, the material supply device 1 mixes the modeling material M from the material supply device 1 and a gas for transportation (for example, an inert gas such as nitrogen or argon) and pumps it to the material nozzle 212 via a pipe. May be good. In this case, for example, the purge gas supplied from the gas supply device 5 may be used as the transport gas. Although the material nozzle 212 is drawn in a tubular shape in FIG. 1, the shape of the material nozzle 212 is not limited to this shape. The material nozzle 212 supplies the modeling material M toward the chamber space 63IN. The material nozzle 212 supplies the modeling material M downward (that is, the −Z side) from the material nozzle 212. A stage 31 is arranged below the material nozzle 212. When the work W is mounted on the stage 31, the material nozzle 212 supplies the modeling material M toward the work W. The traveling direction of the modeling material M supplied from the material nozzle 212 is a direction inclined by a predetermined angle (an acute angle as an example) with respect to the Z-axis direction, but even if it is on the −Z side (that is, directly below). Good.

In the present embodiment, the material nozzle 212 is aligned with the irradiation optical system 211 so that the irradiation optical system 211 supplies the modeling material M toward the irradiation region EA on which the processing light EL is irradiated. Conversely, in the present embodiment, the irradiation optical system 211 emits the processing light EL toward the supply region MA set on the work W as the region where the material nozzle 212 supplies the modeling material M. Aligned with respect to material nozzle 212. That is, the material nozzle 212 and the irradiation optical system 211 are aligned so that the supply region MA and the irradiation region EA coincide with each other (or at least partially overlap). The material nozzle 212 may be aligned so as to supply the modeling material M to the molten pool MP formed by the processing light EL emitted from the irradiation optical system 211.

The head drive system 22 moves the processing head 21. The head drive system 22 moves the processing head 21 within the chamber space 63IN, for example. The head drive system 22 moves the machining head 21 along at least one of the X-axis, the Y-axis, and the Z-axis. Further, the head drive system 22 may move the machining head 21 along at least one rotation direction in the θX direction, the θY direction, and the θZ direction in addition to at least one of the X-axis, the Y-axis, and the Z-axis. .. In other words, the head drive system 22 may rotate the machining head 21 around at least one of the X-axis, Y-axis, and Z-axis. The head drive system 22 may change the posture of the machining head 21 around at least one of the X-axis, the Y-axis, and the Z-axis. The head drive system 22 includes an actuator such as a motor, for example.

When the processing head 21 moves along at least one of the X-axis and the θY direction, each of the irradiation region EA and the supply region MA moves along the X-axis on the work W. When the processing head 21 moves along at least one of the Y axis and the θX direction, each of the irradiation region EA and the supply region MA moves along the Y axis on the work W. That is, the head drive system 22 can change the positional relationship between the irradiation region EA and the supply region MA and the work W by moving the processing head 21.

The head drive system 22 may move the irradiation optical system 211 and the material nozzle 212 separately. Specifically, for example, the head drive system 22 may be capable of adjusting at least one of the position of the injection unit 213, the direction of the injection unit 213, the position of the supply port 214, and the direction of the supply port 214. In this case, the irradiation region EA in which the irradiation optical system 211 irradiates the processing light EL and the supply region MA in which the material nozzle 212 supplies the modeling material M can be controlled separately.

The stage device 3 includes a stage 31. The stage 31 is housed in the chamber space 63IN. The stage 31 can support the work W. The state in which the work W supports the work W may mean a state in which the work W is directly or indirectly supported by the stage 31. The stage 31 may be able to hold the work W. That is, the stage 31 may support the work W by holding the work W. In this case, the stage 31 may be provided with a mechanical chuck, a vacuum suction chuck, or the like in order to hold the work W. Alternatively, the stage 31 does not have to be able to hold the work W. In this case, the work W may be placed on the stage 31. That is, the stage 31 may support the work W placed on the stage 31. At this time, the work W may be mounted on the stage 31 without being clamped. Therefore, the state in which the "stage 31 supports the work W" in the present embodiment may include a state in which the stage 31 holds the work W and a state in which the work W is placed on the stage 31. Since the stage 31 is housed in the chamber space 63IN, the work W supported by the stage 31 is also housed in the chamber space 63IN. Further, the stage 31 can release the held work W when the work W is held. The irradiation optical system 211 described above irradiates the processing light EL at least a part of the period during which the stage 31 supports the work W. Further, the material nozzle 212 described above supplies the modeling material M during at least a part of the period in which the stage 31 supports the work W. A part of the modeling material M supplied by the material nozzle 212 may be scattered or spilled from the surface of the work W to the outside of the work W (for example, around the stage 31). Therefore, the processing system SYS may be provided with a recovery device for recovering the scattered or spilled modeling material M around the stage 31.

The stage 31 may be movable by a stage drive system (not shown). In this case, the stage drive system may move the stage 31 within the chamber space 63IN, for example. The stage drive system may move the stage 31 along at least one of the X-axis, the Y-axis, and the Z-axis. When the stage 31 moves along at least one of the X-axis and the Y-axis, each of the irradiation region EA and the supply region MA moves on the work W along at least one of the X-axis and the Y-axis. Further, the stage drive system may move the stage 31 along at least one rotation direction in the θX direction, the θY direction, and the θZ direction in addition to at least one of the X-axis, the Y-axis, and the Z-axis. The stage drive system includes, for example, an actuator such as a motor. When the stage device 3 includes a stage drive system, the processing device 2 does not have to include the head drive system 22.

The light source 4 emits, for example, at least one of infrared light and ultraviolet light as processed light EL. However, as the processed light EL, light having another wavelength (for example, light having a wavelength in the visible region) may be used. The processing light EL is a laser light. In this case, the light source 4 may include a laser light source such as a semiconductor laser. Examples of the laser light source include at least one such as a laser diode (LD: Laser Diode), a fiber laser, a CO ₂ laser, a YAG laser, and an excimer laser. However, the processing light EL does not have to be a laser beam, and the light source 4 may include an arbitrary light source (for example, at least one such as an LED (Light Emitting Diode) and a discharge lamp).

The gas supply device 5 is a supply source of purge gas for purging the chamber space 63IN. The purge gas contains an inert gas. As an example of the inert gas, nitrogen gas or argon gas can be mentioned. The gas supply device 5 supplies purge gas to the chamber space 63IN. As a result, the chamber space 63IN becomes a space purged by the purge gas. The gas supply device 5 also supplies purge gas to the material supply device 1. The purge gas supplied to the material supply device 1 is mainly used for pumping the modeling material M from the material supply device 1 to the material nozzle 212, as will be described later. Therefore, the gas supply device 5 supplies the pressurized purge gas to the material supply device 1. The gas supply device 5 may be a cylinder in which a purge gas such as nitrogen gas or argon gas is stored. When the purge gas is nitrogen gas, the gas supply device 5 may be a nitrogen gas generator that generates nitrogen gas from the atmosphere as a raw material.

The gas supply device 5 may separately control the gas supply mode to the chamber space 63IN and the gas supply mode to the material supply device 1. For example, the gas supply device 5 has the chamber space 63IN and the material supply device so that the supply amount of the purge gas to the chamber space 63IN per unit time and the supply amount of the purge gas to the material supply device 1 per unit time are different. The gas supply mode to each of 1 may be controlled. For example, the gas supply device 5 supplies the purge gas to either the chamber space 63IN or the material supply device 1 in a state where the supply of the purge gas to the chamber space 63IN or the material supply device 1 is stopped. , The mode of gas supply to each of the chamber space 63IN and the material supply device 1 may be controlled. Further, the characteristics of the purge gas supplied to the chamber space 63IN (for example, temperature and the like) may be different from the characteristics of the purge gas supplied to the material supply device 1. The composition of the purge gas supplied to the chamber space 63IN may be different from the composition of the purge gas supplied to the material supply device 1. The processing system SYS may separately include a gas supply device that supplies purge gas to the chamber space 63IN and a gas supply device that supplies purge gas to the material supply device 1.

The housing 6 is a storage device that accommodates at least a part of each of the processing device 2 and the stage device 3 in the chamber space 63IN, which is the internal space of the housing 6. The housing 6 includes a partition member 61 that defines the chamber space 63IN. The partition member 61 is a member that separates the chamber space 63IN from the external space 64OUT of the housing 6. The partition member 61 faces the chamber space 63IN via its inner wall 611, and faces the outer space 64OUT via its outer wall 612. In this case, the space surrounded by the partition member 61 (more specifically, the space surrounded by the inner wall 611 of the partition member 61) becomes the chamber space 63IN. The partition member 61 may be provided with a door that can be opened and closed. This door may be opened when the work W is placed on the stage 31 (or brought in so as to be supported or held). This door may be opened when the work W and / or the three-dimensional structure ST is taken out from the stage 31. On the other hand, this door may be closed while the additional processing for forming the three-dimensional structure ST is being performed.

The control device 7 controls the operation of the processing system SYS. For example, the control device 7 may control the emission mode of the processed light EL by the irradiation optical system 211. The injection mode may include, for example, at least one of the intensity of the processing light EL and the injection timing of the processing light EL. When the processing light EL is pulsed light, the injection mode may include, for example, a ratio (so-called duty ratio) between the length of the emission time of the pulsed light and the emission period of the pulsed light. Further, the injection mode may include, for example, at least one of the length of the emission time of the pulsed light itself and the emission period itself. Further, the control device 7 may control the movement mode of the processing head 21 by the head drive system 22. The movement mode may include, for example, at least one of a movement amount, a movement speed, a movement direction, and a movement timing. Further, the control device 7 may control the supply mode of the modeling material M by the material supply device 1. The supply mode of the modeling material M by the material nozzle 212 is mainly determined by the supply mode of the modeling material M by the material supply device 1. Therefore, controlling the supply mode of the modeling material M by the material supply device 1 can be regarded as equivalent to controlling the supply mode of the modeling material M by the material nozzle 212. The supply mode may include, for example, at least one of a supply amount (particularly, a supply amount per unit time) and a supply timing.

The control device 7 may include, for example, an arithmetic unit and a storage device. The arithmetic unit may include, for example, at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The control device 7 functions as a device that controls the operation of the processing system SYS by executing a computer program by the arithmetic unit. This computer program is a computer program for causing the control device 7 (for example, an arithmetic unit) to perform (that is, execute) the above-mentioned operation to be performed by the control device 7. That is, this computer program is a computer program for causing the control device 7 to function so that the processing system SYS performs the operation described later. The computer program executed by the arithmetic unit may be recorded in a storage device (that is, a recording medium) included in the control device 7, or any storage built in the control device 7 or externally attached to the control device 7. It may be recorded on a medium (for example, a hard disk or a semiconductor memory). Alternatively, the arithmetic unit may download the computer program to be executed from an external device of the control device 7 via the network interface.

The control device 7 does not have to be provided inside the processing system SYS, and may be provided as a server or the like outside the processing system SYS, for example. In this case, the control device 7 and the processing system SYS may be connected by a wired and / or wireless network (or a data bus and / or a communication line). As the wired network, for example, a network using a serial bus type interface represented by at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485 and USB may be used. As the wired network, a network using a parallel bus interface may be used. As a wired network, a network using an Ethernet (registered trademark) compliant interface represented by at least one of 10BASE-T, 100BASE-TX and 1000BASE-T may be used. As the wireless network, a network using radio waves may be used. An example of a network using radio waves is a network conforming to IEEE802.1x (for example, at least one of wireless LAN and Bluetooth®). As the wireless network, a network using infrared rays may be used. As the wireless network, a network using optical communication may be used. In this case, the control device 7 and the processing system SYS may be configured so that various types of information can be transmitted and received via the network. Further, the control device 7 may be able to transmit information such as commands and control parameters to the processing system SYS via the network. The processing system SYS may include a receiving device that receives information such as commands and control parameters from the control device 7 via the network. Alternatively, while the first control device that performs a part of the processing performed by the control device 7 is provided inside the processing system SYS, the second control device that performs the other part of the processing performed by the control device 7 is provided. The control device may be provided outside the processing system SYS.

The recording medium for recording the computer program executed by the arithmetic unit includes CD-ROM, CD-R, CD-RW, flexible disc, MO, DVD-ROM, DVD-RAM, DVD-R, DVD + R, and DVD-. At least one of optical disks such as RW, DVD + RW and Blu-ray (registered trademark), magnetic media such as magnetic tape, magneto-optical disks, semiconductor memories such as USB memory, and any other medium capable of storing a program is used. You may. The recording medium may include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device in which the computer program is implemented in a state in which it can be executed in at least one form such as software and firmware). Further, each process or function included in the computer program may be realized by a logical processing block realized in the control device 7 by the control device 7 (that is, a computer) executing the computer program. It may be realized by hardware such as a predetermined gate array (FPGA, ASIC) included in the control device 7, or a logical processing block and a partial hardware module that realizes a part of the hardware are mixed. It may be realized in the form of.

The image pickup device 8 is a camera capable of taking an image of an object to be imaged. The image captured by the image pickup device 8 is output to the control device 7. The control device 7 may control the operation of the processing system SYS based on the image captured by the image pickup device 8.

In the present embodiment, the image pickup apparatus 8 images at least a part of the supply path of the modeling material M. That is, in the present embodiment, the image pickup device 8 is arranged so that the image pickup range IMA of the image pickup device 8 (see FIG. 3 and the like described later) includes at least a part of the supply path of the modeling material M. In the following description, for convenience of explanation, at least a part of the supply path of the modeling material M to be imaged by the imaging device 8 (that is, included in the imaging range IMA) is referred to as an “imaging target path”.

During the period during which the modeling material M passes through the imaging target path, the imaging device 8 images the modeling material M passing through the imaging target path. In this case, the modeling material M passing through the image pickup target path is reflected in the image captured by the image pickup apparatus 8. Therefore, it can be said that the image captured by the image pickup apparatus 8 includes information regarding the modeling material M passing through the image pickup target path. In particular, the modeling material M supplied through the imaging target path is reflected in the image captured by the imaging device 8. Therefore, it can be said that the image captured by the image pickup apparatus 8 includes information regarding the supply state of the modeling material M.

The imaging device 8 may image the modeling material M passing through the imaging target path at a desired timing. The image pickup apparatus 8 may repeatedly image the modeling material M passing through the image pickup target path. For example, the imaging device 8 may repeatedly image the modeling material M passing through the imaging target path at a regular cycle. That is, the imaging device 8 may repeatedly image the modeling material M passing through the imaging target path at a desired imaging rate. The imaging rate is arbitrary. For example, the imaging device 8 passes through the imaging target path at an imaging rate (that is, an imaging rate of several fps (frame per sec) to several tens of fps) that images the imaging target path several to several tens of times per second. The modeling material M may be repeatedly imaged. For example, the imaging device 8 images at an imaging rate (that is, an imaging rate of several hundred fps to several hundred fps) that images the modeling material M passing through the imaging target path several hundred to several hundred times per second. The modeling material M passing through the target path may be repeatedly imaged. Examples of imaging devices capable of imaging an imaged object at an imaging rate of several hundred fps to several hundred fps are US Pat. No. 7,046,821, US Patent Application Publication No. 2012/0147016, and US Pat. No. It is described in each of Nos. 6, 970 and 196. Alternatively, the imaging device 8 may repeatedly image the modeling material M passing through the imaging target path at an irregular cycle or a random cycle.

The lighting device 9 illuminates at least a part of the imaging range IMA of the imaging device 8 with the illumination light IL (see FIG. 3 described later) which is visible light. Since the imaging device 8 images the modeling material M passing through the imaging target path, the lighting device 9 illuminates the modeling material M passing through the imaging target path with the illumination light IL. However, when the image pickup element of the image pickup apparatus 8 can detect light in a wavelength range different from the visible light wavelength range, the illumination light IL is light in a wavelength range different from the visible light wavelength range (particularly, Light in a wavelength range that can be detected by the image pickup element) may be included. The lighting device 9 illuminates the modeling material M passing through the imaging target path with the illumination light IL during the period in which the imaging device 8 images the modeling material M passing through the imaging target path. Therefore, the image pickup apparatus 8 images the modeling material M illuminated by the illumination light IL. As a result, even when the image pickup target path is in a relatively dark environment, the image pickup apparatus 8 can appropriately image the modeling material M passing through the image pickup target path. When the imaging target path exists in a relatively bright environment, the processing system SYS does not have to include the lighting device 9.

(1-2) Structure of Material Supply Device 1 Subsequently, the structure of the material supply device 1 will be described with reference to FIG. FIG. 3 is a cross-sectional view showing the structure of the material supply device 1.

As shown in FIG. 3, the material supply device 1 is connected to a hopper 11, a holding member 12, a transport member 13, a drive device 14, a material delivery member 15, and a housing (in other words, a container) 16. It is provided with a tube 17. The holding member 12, the transport member 13, and the material delivery member 15 are a space surrounded by a partition member 161 of a box-shaped (or other shape) housing 16 (that is, an internal space 16IN of the housing 16). ). The hopper 11 and the driving device 14 are arranged in the external space 16OUT separated from the internal space 16IN via the partition member 161. However, at least one of the hopper 11 and the drive device 14 may be arranged in the internal space 16IN.

The hopper 11 is a device for storing the modeling material M. The hopper 11 has a funnel-shaped shape (that is, an inverted conical shape). The space surrounded by the funnel-shaped partition wall member 111 corresponds to the storage space 112 for storing the modeling material M. However, the hopper 11 may have other shapes. For example, the shape of the hopper 11 may be an inverted pyramid shape (for example, an inverted quadrangular pyramid shape).

A supply port 113 is formed at the lower end of the hopper 11 (that is, below the storage space 112). The supply port 113 is an opening (that is, a through hole) that penetrates the partition wall member 111 along the Z-axis direction at the bottom of the hopper 11. Alternatively, when the partition wall member 111 is not formed at the lower end of the hopper 11, the open end of the lower portion of the hopper 11 in which the partition wall member 111 is not formed may be used as the supply port 113. The shape of the cross section of the supply port 113 (specifically, the cross section along the XY plane) is circular, but other shapes (for example, at least one of an oval shape, an elliptical shape, a rectangular shape, and a polygonal shape). There may be. The supply port 113 is an opening for supplying the modeling material M from the hopper 11 to the lower side of the hopper 11 (that is, to the −Z side). That is, the modeling material M stored in the storage space 112 by the hopper 11 is supplied to the outside of the hopper 11 via the supply port 113 (in other words, discharged or dropped).

The hopper 11 is arranged on the partition member 161 of the housing 16. Specifically, the hopper 11 is arranged on the ceiling member 1611 located above the internal space 16IN of the partition wall member 161. A supply port 162 is formed in the ceiling member 1611. The supply port 162 is an opening (that is, a through hole) that penetrates the ceiling member 1611 from the external space 16OUT toward the internal space 16IN. The supply port 162 of the housing 16 is connected to the supply port 113 of the hopper 11. Therefore, the supply port 162 is substantially an opening (that is, a through hole) that penetrates the ceiling member 1611 from the supply port 113 toward the internal space 16IN. Therefore, the modeling material M stored in the storage space 112 by the hopper 11 is supplied to the internal space 16IN of the housing 16 via the supply port 113 and the supply port 162 (in other words, is discharged or discharged). Will be dropped).

A material replenishment port 114 is formed at the upper end of the hopper 11. The material replenishment port 114 is an opening that penetrates the partition wall member 111 along the Z-axis direction at the upper end of the hopper 11. Alternatively, when the partition wall member 111 is not formed on the upper end of the hopper 11, the open end on the upper portion of the hopper 11 on which the partition wall member 111 is not formed may be used as the material replenishment port 114. The material replenishment port 114 is an opening for replenishing the hopper 11 (particularly, the storage space 112) with the modeling material M. The material replenishment port 114 is normally sealed by a lid 115 (specifically, during the period when the hopper 11 is not replenished with the modeling material M). In this case, the lid 115 may function together with the partition member 111 as a partition member that defines the storage space 112. The lid 115 may function together with the partition wall member 111 as a partition wall member that maintains the airtightness of the storage space 112. The lid 115 is opened during the period of replenishing the hopper 11 with the modeling material M. The material replenishment port 114 may be used for purposes other than replenishment of the modeling material M (for example, for the purpose of maintenance of the hopper 11).

An opening 116 is formed in the partition member 111 of the hopper 11 (for example, a portion located relatively upward and below the material replenishment port 114). The opening 116 is a through hole that penetrates the partition wall member 111 from the storage space 112 toward the space outside the hopper 11 (specifically, the exterior space 16OUT of the housing 16). Therefore, the storage space 112 is connected to the external space 16OUT through the opening 116. However, as will be described in detail later, a connecting pipe 17 is attached to the opening 116. Therefore, when the connecting pipe 17 is attached to the opening 116, the storage space 112 is separated from the external space 16OUT. In addition to or in place of the through hole formed in the partition wall member 111, the through hole formed in the lid 115 may be used as the opening 116.

The holding member 12 holds the modeling material M supplied from the supply port 113 of the hopper 11 to the internal space 16IN via the supply port 162. In order to hold the modeling material M supplied from the hopper 11, the holding member 12 is arranged below each of the supply port 113 and the supply port 162. The holding member 12 is arranged so that a part of the holding member 12 is located directly below each of the supply port 113 and the supply port 162. The holding member 12 is arranged so that a part of the holding member 12 is located in the drop path of the modeling material M from the supply port 113 and the supply port 162. The holding member 12 is arranged so that a part of the holding member 12 faces each of the supply ports 162 along the Z-axis direction.

The holding member 12 is supported by the partition member 161 (particularly, the ceiling member 1611) of the housing 6. However, the holding member 12 may be supported by any other member. For example, the holding member 12 may be supported by the side wall member 1612 located on the side of the internal space 16IN of the partition wall member 161. For example, the holding member 12 may be supported by a bottom member 1613 located below the internal space 16IN of the partition member 161. For example, the holding member 12 may be supported by a supporting member (not shown).

FIG. 4 is a side view showing the structure of the holding member 12. As shown in FIGS. 3 and 4, the holding member 12 is a tubular member (that is, a hollow member). Specifically, the holding member 12 is a member in which a tubular space 121 extending along a direction intersecting the Z-axis direction is formed inside. That is, the holding member 12 is a member whose longitudinal direction is the direction intersecting the Z-axis direction. Although FIGS. 3 and 4 show an example in which the space 121 extends along the Y-axis direction, the space 121 may be a space extending along the X-axis direction or the Z-axis. It may be a space extending along a direction inclined with respect to the space. The space 121 is a space surrounded by the inner wall surface 122 of the holding member 12. The shape of the cross section of the inner wall surface 122 including the Z axis is circular. In this case, the shape of the cross section of the tubular space 121 including the Z axis is circular. That is, the holding member 12 is a cylindrical member. The "cylindrical member" referred to here means a member having a circular cross-sectional shape of the inner wall surface 122. Therefore, the shape of the cross section of the outer wall surface of the holding member 12 is not limited to a circle, and may be any shape (for example, at least one of an oval shape, an ellipse shape, a rectangle, and a polygonal shape). However, the shape of the cross section of the inner wall surface 122 including the Z axis may be another shape different from the circular shape (for example, at least one of an oval shape, an elliptical shape, a rectangular shape, and a polygonal shape). Since the holding member 12 is arranged in the internal space 16IN, the space 121 constitutes at least a part of the internal space 16IN.

A supply port 123 is formed in the holding member 12. The supply port 123 is an opening (that is, a through hole) that penetrates the holding member 12 along the Z-axis direction. The supply port 123 is a through hole that penetrates the holding member 12 in one direction from the space 121. The supply port 123 is a through hole that penetrates the holding member 12 in a direction (for example, in the Z-axis direction (upward)) that intersects the direction in which the space 121 extends (for example, the Y-axis direction). The supply port 123 is connected to the supply port 162 located above the holding member 12. That is, the holding member 12 is arranged so that the supply port 123 is connected to the supply port 162. In this case, since the holding member 12 is arranged below the supply port 162, the supply port 123 is a through hole that penetrates the holding member 12 upward from the space 121. Since the supply port 123 is connected to the supply port 162, the storage space 112 and the space 121 are connected to each other via the

supply ports

113, 162, and 123. Therefore, the modeling material M supplied from the storage space 112 to the internal space 16IN via the supply port 113 and the supply port 162 is supplied to the space 121 via the supply port 123. That is, the modeling material M is supplied from the storage space 112 to the space 121 via the supply port 113, the supply port 162, and the supply port 123. The modeling material M is supplied from the hopper 11 to the holding member 12 so as to fall from the storage space 112 toward the space 121 through the supply port 113, the supply port 162, and the supply port 123.

The modeling material M supplied to the space 121 is deposited on the inner wall surface 122. Specifically, the modeling material M supplied to the space 121 falls and accumulates on the surface portions of the inner wall surface 122 located below the supply port 113, the supply port 162, and the supply port 123. The inner wall surface 122 holds the modeling material M deposited on at least a part of the inner wall surface 122. Therefore, the inner wall surface 122 includes a holding surface 1221 for holding the modeling material M supplied from the hopper 11. At least a part of the inner wall surface 122 functions as a holding surface 1221. For example, since the holding surface 1221 holds the modeling material M that falls downward due to the action of gravity, at least a part of the inner wall surface 122 facing upward (that is, the + Z side). However, it functions as a holding surface 1221. For example, since the holding surface 1221 holds the modeling material M that falls from the

supply ports

113, 162, and 123, the surface of the inner wall surface 122 that is located at a position downward from the

supply ports

113, 162, and 123. At least a portion of the portion functions as a holding surface 1221. Further, since the holding surface 1221 which is at least a part of the inner wall surface 122 holds the modeling material M, the space 121 defined by the inner wall surface 122 serves as a space for holding the modeling material M supplied from the hopper 11. Function. Therefore, in the following description, the space 121 is referred to as a "holding space 121".

At least a part of the transport member 13 is arranged in the holding space 121. Therefore, as shown in FIGS. 3 and 4, at least a part of the transport member 13 is surrounded by the inner wall surface 122 that defines the holding space 121. A gap SP is formed between the transport member 13 and the inner wall surface 122. Therefore, the modeling material M supplied to the holding space 121 is held between the inner wall surface 122 and the transport member 13. That is, the modeling material M supplied to the holding space 121 is held between the holding member 12 and the conveying member 13. Therefore, at least a part of the inner wall surface 122 that faces the transport member 13 may also function as the holding surface 1221 described above.

The transport member 13 is a member for supplying (that is, transporting) the modeling material M held by the holding member 12 from the holding member 12 to the outside of the holding member 12. The transport member 13 is a member for supplying the modeling material M held by the holding space 121 from the holding space 121 to the outside of the holding space 121. The transport member 13 is a member for supplying the modeling material M held by the inner wall surface 122 (particularly, the holding surface 1221) from the inner wall surface 122 to the outside of the inner wall surface 122.

The transport member 13 supplies the modeling material M along the direction in which the holding space 121 extends. As a result, the transport member 13 transfers the modeling material M held by the holding space 121 from the holding space 121 through the opening (that is, the open end) 124 of the holding member 12 that defines the end portion of the holding space 121. It is supplied to the outside of the holding space 121. That is, the opening 124 is used as a supply port for transporting the modeling material M from the holding member 12 to the outside of the holding member 12. Therefore, in the following, the opening 124 will be referred to as a “supply port 124”. The device including the hopper 11, the holding member 12, and the conveying member 13 may be referred to as a material supply source 1A that supplies the modeling material M to the outside of the holding space 121 via the supply port 124.

Since the transport member 13 supplies the modeling material M that falls from the

supply ports

113, 162, and 123 into the holding space 121, at least a part of the transport member 13 is located below the

supply ports

113, 162, and 123. Since the transport member 13 supplies the modeling material M that falls on the inner wall surface 122 (particularly, the holding surface 1221), at least a part of the transport member 13 is at least a part of the inner wall surface 122 (particularly, the holding surface 1221). Located above. That is, at least a part of the transport member 13 is located between the

supply ports

113, 162 and 123 and the inner wall surface 122 (particularly, the holding surface 1221). As a result, the modeling material M is supplied from the hopper 11 to the transport member 13 along the direction of gravity.

The transport member 13 may have any structure as long as the modeling material M can be supplied. Hereinafter, an example of the structure of the transport member 13 will be described together with FIG. 3 with reference to FIGS. 5 (a) to 5 (b) and FIGS. 6 (a) to 6 (c). FIG. 5 (a) is a perspective view showing the structure of a first example of the transport member 13 included in the material supply device 1, and FIG. 5 (b) is a first view of the transport member 13 included in the material supply device 1. It is a front view which shows the structure of an example. FIG. 6 (a) is a perspective view showing the structure of a second example of the transport member 13 included in the material supply device 1, and each of FIGS. 6 (b) to 6 (c) includes the material supply device 1. It is sectional drawing which shows the structure of the 2nd example of the transport member 13 provided.

As shown in FIGS. 3 and 5 (a) to 6 (c), the transport member 13 is a member extending in a desired direction. Specifically, the transport member 13 is a member that extends along the direction in which the holding space 121 extends. That is, the transport member 13 is a member that extends along the longitudinal direction of the holding member 12. Since the holding space 121 extends in the direction intersecting the Z axis, the transport member 13 is a member extending along the direction intersecting the Z axis. FIG. 3 shows an example in which the transport member 13 is a member extending along the Y-axis direction, but the transport member 13 may be a member extending along the X-axis direction or with respect to the Z-axis. It may be a member extending along an inclined direction. The transport member 13 is arranged in the holding space 121 so that the transport member 13 extends along the direction in which the holding space 121 extends.

When the transport member 13 is a member extending along the direction intersecting the Z axis, the transport member 13 may include a shaft member 131 extending along the direction intersecting the Z axis. The shaft member 131 is a member having a circular cross-sectional shape including the Z-axis. However, the shaft member 131 may be a member having a cross-sectional shape including the Z-axis having another shape (for example, at least one of an oval shape, an elliptical shape, a rectangular shape, and a polygonal shape). The transport member 13 is arranged in the holding space 121 so that the shaft member 131 extends along the direction in which the holding space 121 extends.

The transport member 13 is a member having a spiral groove 132 formed on its side surface. Specifically, the transport member 13 is a member having a groove 132 formed on its side surface, which extends (that is, advances) along the direction in which the transport member 13 extends while rotating around an axis along the direction in which the transport member 13 extends. Is. The transport member 13 is a member in which a groove 132 extending (that is, advancing) along the direction in which the transport member 13 extends while orbiting the side surface of the transport member 13 is formed on the side surface thereof. The pitch of the spiral groove 132 (that is, the period, for example, the extension (that is, the distance traveled) of the groove 132 during one rotation of the groove 132) is constant but may vary. An example of the transport member 13 in which the groove 132 is formed on the side surface is shown in FIGS. 5 (a) to 5 (b) and 6 (a) to 6 (c).

5 (a) to 5 (b) show a first example of the transport member 13 in which the groove 132 is formed on the side surface. As shown in FIGS. 5 (a) to 5 (b), on the side surface of the shaft member 131, a protrusion 133 protruding from the side surface of the shaft member 131 so as to define (that is, form) a spiral groove 132 is formed. It may be formed. In this case, the groove 132 is formed between two adjacent protrusions 133. That is, the space sandwiched by the two adjacent protrusions 133 becomes the groove 132. Therefore, the groove 132 is formed parallel to the protrusion 133. The "state in which the groove 132 and the protrusion 133 are parallel" is not only a state in which the direction in which the groove 132 extends and the direction in which the protrusion 133 extends are literally completely parallel, but also the direction in which the groove 132 extends and the protrusion. There is also a state in which the direction in which the 133 extends is not exactly parallel, but can be regarded as substantially parallel (that is, the direction in which the groove 132 extends and the direction in which the protrusion 133 extends are substantially parallel). Including. In this case, the protrusion 133 may function as a partition wall defining the groove 132. The dimensions of the shaft member 131 and the protrusion 133 shown in FIGS. 5 (a) to 5 (b) are merely examples, and are different from the dimensions shown in FIGS. 5 (a) to 5 (b). It may be. For example, the radial dimension of the protrusion 133 with respect to the diameter of the shaft member 131 may be smaller or larger than the examples shown in FIGS. 5 (a) to 5 (b).

Since the protrusion 133 forms the spiral groove 132, the protrusion 133 is also a spiral member. Specifically, the protrusion 133 is formed so as to draw a spiral on the side surface of the shaft member 131. The protrusion 133 is formed so as to draw a spiral while orbiting the side surface of the shaft member 131. The position where the protrusion 133 is formed on the side surface of the shaft member 131 draws a spiral on the side surface of the shaft member 131. The protrusion 133 extends along the direction in which the shaft member 131 extends while rotating around the axis along the direction in which the shaft member 131 extends on the side surface of the shaft member 131.

6 (a) to 6 (c) show a second example of the transport member 13 in which the groove 132 is formed on the side surface. As shown in FIGS. 6A to 6C, a recess (that is, a recess) defining the spiral groove 132 may be formed on the side surface of the shaft member 131. That is, the transport member 13 in which the groove 132 is formed on the side surface may be formed by processing the side surface of the shaft member 131 to form a recess so as to form the groove 132. .. By applying the engraving process for forming the groove 132 to the side surface of the shaft member 131, the transport member 13 having the groove 132 formed on the side surface may be formed. In this case, the portion of the shaft member 131 in which the groove 132 is not formed (for example, the portion not carved or the convex portion protruding from the groove 132) substantially defines the groove 132. It may function as a protrusion 133. Therefore, in the following description, for convenience of explanation, the second example of the transport member 13 is also a member in which the protrusion 133 is formed on the side surface of the shaft member 131, similarly to the first example of the transport member 13. I will proceed with the explanation.

The shape of the cross section of the groove 132 formed on the side surface of the shaft member 131 along the XZ plane may be any shape. FIG. 6B shows an example in which the shape of the cross section of the groove 132 formed on the side surface of the shaft member 131 along the XZ plane is a rectangular shape (for example, a trapezoidal shape). FIG. 6C shows an example in which the shape of the cross section of the groove 132 formed on the side surface of the shaft member 131 along the XZ plane is the shape of an arc. The dimensions of the shaft member 131 and the groove 132 shown in FIGS. 6 (a) to 6 (c) are merely examples, and are different from those shown in FIGS. 6 (a) to 6 (c). It may be a dimension. For example, the radial dimension of the groove 132 with respect to the diameter of the shaft member 131 may be smaller or larger than the examples shown in FIGS. 6 (a) to 6 (c).

In both the first example and the second example of the transport member 13, the transport member 13 can also function as a screw. Therefore, not only the transport member 13 having the structures shown in FIGS. 5 (a) to 5 (b) and FIGS. 6 (a) to 6 (c), but also a member capable of functioning as a screw is used as the transport member 13. May be done. The first example of the transport member 13 can also function as an Archimedes' screw. Therefore, not only the transport member 13 having the structures shown in FIGS. 5 (a) to 5 (b) and FIGS. 6 (a) to 6 (c), but also a member capable of functioning as an Archimedes' screw is a transport member. It may be used as 13. A second example of the transport member 13 can also function as a screw. Therefore, not only the transport member 13 having the structures shown in FIGS. 5 (a) to 5 (b) and FIGS. 6 (a) to 6 (c), but also a member capable of functioning as a screw is used as the transport member 13. May be done.

The transport member 13 supplies the modeling material M via the groove 132. The transport member 13 supplies the modeling material M so that the modeling material M moves through the groove 132 in the holding space 121. The transport member 13 supplies the modeling material M so that the modeling material M moves along the groove 132 in the holding space 121. The transport member 13 is supplied from the holding space 121 to the outside of the holding member 12 through the supply port 124 of the holding member 12 by using the groove 132. Therefore, the transport member 13 is arranged so as to penetrate the supply port 124.

In order to supply the modeling material M through the groove 132, the groove 132 is formed so as to extend from the holding space 121 toward the supply port 124. More specifically, the groove 132 is formed so as to extend toward the supply port 124 from at least a portion of the holding space 121 located directly below the supply port 123. The groove 132 is formed so as to extend from at least the portion of the transport member 13 located directly below the supply port 123 toward the portion of the transport member 13 located at the supply port 124.

Further, in order to supply the modeling material M through the groove 132, the driving device 14 drives the transport member 13 in which the groove 132 is formed. Therefore, the drive device 14 includes an actuator (power source) such as a motor to drive the transport member 13. Specifically, the drive device 14 uses the transport member 13 so that the shaft member 131 rotates about a shaft (typically, the central shaft of the shaft member 131) along the direction in which the shaft member 131 extends. Rotationally driven. As a result, the modeling material M held in the holding space 121 extends in the direction in which the shaft member 131 extends (that is, the holding space 121 extends) along the spiral groove 132 formed on the side surface of the rotating transport member 13. It moves along the direction (longitudinal direction of the holding member 12). That is, the modeling material M moves along the direction intersecting the Z axis. The modeling material M moves laterally. In this case, the drive device 14 shafts in the rotational direction in which the modeling material M can be moved toward the supply port 124 through the groove 132 (in the example shown in FIG. 3, it is moved toward the −Y side). The transport member 13 is rotationally driven so that the member 131 rotates. As a result, the modeling material M held in the holding space 121 falls to the outside of the holding space 121 through the supply port 124. The modeling material M held by the inner wall surface 122 falls to the outside of the inner wall surface 122 through the supply port 124. That is, the transport member 13 supplies the modeling material M to the outside of the holding member 12 by passing the modeling material M through the supply port 124.

In order to drive the transport member 13, the transport member 13 is connected to the drive device 14. Specifically, the transport member 13 (particularly, the shaft member 131) is formed in the opening (that is, the open end) 125 and the housing 16 of the holding member 12 that defines the end opposite to the supply port 124. Through the opening 163, it extends from the internal space 16IN (particularly, the holding space 121) to the external space 16OUT. The opening 163 is a through hole that penetrates the side wall member 1612 of the housing 16 from the internal space 16IN to the external space 16OUT. The transport member 13 (particularly, the shaft member 131) is connected to the drive device 14 arranged in the external space 16OUT via the openings 126 and 163.

The opening 163 formed in the partition wall member 161 may be formed with a seal member 164 for filling the gap between the transport member 13 (particularly, the shaft member 131) and the partition wall member 161. When the seal member 164 is formed, it is possible to prevent the modeling material M of the internal space 16IN (particularly, the holding space 121) from being unintentionally discharged to the external space 16OUT through the opening 163. Further, when the seal member 164 is formed, it is possible to prevent the purge gas in the internal space 16IN (particularly, the holding space 121) from being unintentionally discharged to the external space 16OUT through the opening 163.

As described above, a gap SP is formed between the transport member 13 and the inner wall surface 122 that defines the holding space 121. As a result, the transport member 13 rotates smoothly as compared with the case where the gap SP is not formed between the transport member 13 and the inner wall surface 122. That is, the transport member 13 rotates smoothly as compared with the case where the transport member 13 comes into contact with the inner wall surface 122.

On the other hand, if a relatively large gap SP is formed between the transport member 13 and the inner wall surface 122, a relatively large amount of modeling material M invades the gap SP. As a result, although the modeling material M should be supplied through the groove 132 of the rotating transport member 13, the modeling material M is supplied through the gap SP without passing through the groove 132 of the transport member 13. There is a possibility that it will be done. Such supply of the modeling material M through the groove 132 may cause fluctuations in the supply rate of the modeling material M supplied from the material supply device 1 to the processing device 2. Therefore, the size of the gap SP (that is, the distance between the transport member 13 and the inner wall surface 122) d realizes a state in which the supply of the modeling material M through the gap SP is suppressed (typically prevented). It may be set to be less than or equal to the desired desired interval.

Note that the "gap SP size d" in the present embodiment may mean the distance between the portion of the transport member 13 closest to the inner wall surface 122 and the inner wall surface 122. That is, the “gap SP size d” may mean the minimum value of the distance between the transport member 13 and the inner wall surface 122. As can be seen from FIGS. 3, 5 (a) to 5 (b) and FIGS. 6 (a) to 6 (c) described above, the portion of the transport member 13 closest to the inner wall surface 122 is It becomes a protrusion 133 (particularly, a portion of the protrusion 133 located on the outermost peripheral side). Therefore, the “gap SP size d” in the present embodiment may mean the distance between the protrusion 133 (particularly, the portion of the protrusion 133 located on the outermost peripheral side) and the inner wall surface 122. ..

The size d of the gap SP may be set according to the characteristics of the modeling material M. For example, since the modeling material M is a powder, the smaller the size (for example, the particle size) of the modeling material M, the more the modeling material M penetrates into the gap SP. Therefore, the size d of the gap SP may be set according to the size (for example, particle size) of the modeling material M. For example, the size d of the gap SP may be set according to the maximum particle size of the modeling material M (that is, the maximum size assumed as the particle size of the modeling material M). For example, the size d of the gap SP may be set to be twice or less the maximum particle size of the modeling material M. When the size d of the gap SP is set to be twice or less the maximum particle size of the modeling material M, the size d of the gap SP is set to be larger than twice the maximum particle size of the modeling material M. Compared with the case where it is set, the supply of the modeling material M through the gap SP is suppressed. Alternatively, for example, the size d of the gap SP may be set to be 1 time or less of the maximum particle size of the modeling material M. When the size d of the gap SP is set to be 1 times or less of the maximum particle size of the modeling material M, the size d of the gap SP is set to be larger than 1 time the maximum particle size of the modeling material M. Compared with the case where it is set, the supply of the modeling material M through the gap SP is suppressed.

Again in FIG. 3, the material sending member 15 receives the modeling material M supplied by the conveying member 13 from the holding member 12. The transport member 13 supplies the modeling material M so that the modeling material M falls from the holding member 12. Therefore, the material sending member 15 receives the modeling material M falling from the holding member 12. In this case, the material delivery member 15 is arranged at a position where the modeling material M supplied from the holding member 12 can be received. For example, the material delivery member 15 may be arranged at least one of the lower side and the diagonally lower side of the holding member 12. For example, the material delivery member 15 may be arranged on the drop path of the modeling material M from the holding member 12. Typically, the material delivery member 15 is located below the supply port 124. In order to receive the modeling material M, the material delivery member 15 may have a funnel-shaped shape (for example, an inverted conical shape). The material delivery member 15 receives the modeling material M supplied from the holding member 12 so as to be collected by the funnel-shaped partition wall member. However, the material delivery member 15 may have other shapes (for example, an inverted pyramid shape, for example, an inverted quadrangular pyramid shape).

The material sending member 15 further sends the modeling material M received from the holding member 12 to the outside of the material supply device 1 (that is, to the processing device 2). A delivery port 151 is formed at the lower end of the material delivery member 15 in order to send the modeling material M to the processing apparatus 2. The delivery port 151 is an opening (that is, a through hole) that penetrates the partition wall at the bottom of the material delivery member 15 along the Z-axis direction. Alternatively, when the partition wall member is not formed at the lower end of the material delivery member 15, the open end of the lower portion of the material delivery member 15 on which the partition wall member is not formed may be used as the delivery port 151. The shape of the cross section of the delivery port 151 (specifically, the cross section along the XY plane) is circular, but other shapes may be used. Other shapes include at least one of oval, elliptical, rectangular and polygonal.

A delivery port 165 is formed in the housing 16. The delivery port 165 is an opening (that is, a through hole) that penetrates the partition wall member 161 (in the example shown in FIG. 5, the bottom member 1613) from the internal space 16IN toward the external space 16 OUT. The delivery port 165 is connected to the delivery port 151 of the material delivery member 15. The above-mentioned pipe (not shown) connected to the processing device 2 is connected to the delivery port 165. Therefore, the modeling material M sent out by the material sending member 15 is sent out to the processing apparatus 2 through the

delivery ports

151 and 164 and a pipe (not shown).

The housing 16 is further formed with an inflow port 166. The inflow port 166 is an opening that penetrates the partition wall member 161 (in the example shown in FIG. 5, the side wall member 1612, but may be the ceiling member 1611 or the bottom member 1613) from the internal space 16IN toward the external space 16OUT. (That is, a through hole). The inflow port 166 is connected to the gas supply device 5 described above. Therefore, the pressurized purge gas is supplied from the gas supply device 5 described above to the internal space 16IN of the housing 16 via the inflow port 166. That is, the internal space 16IN is a space purged with the purge gas. At this time, when the purge gas contains an inert gas, the possibility of a dust explosion caused by the modeling material M is eliminated or reduced.

The housing 16 is further formed with an opening 167. The opening 167 is a through hole that penetrates the partition wall member 161 (in the example shown in FIG. 3, the ceiling member 1611, but may be the side wall member 1612 or the bottom member 1613) from the internal space 16IN toward the external space 16OUT. Is. A connecting pipe 17 connected to the opening 116 of the hopper 11 described above is connected to the opening 167. Specifically, one end of the connecting pipe 17 is connected to the opening 116, and the other end of the connecting pipe 17 is connected to the opening 167. As a result, the storage space 112 of the hopper 11 and the internal space 16IN of the housing 16 are connected to each other via the connecting pipe 17, the opening 116, and the opening 167. That is, in the processing system SYS, not only the route via the

supply ports

113, 162 and 123 but also the route via the connecting pipe 17 and the opening 116 and the opening 167 are provided as the route connecting the storage space 112 and the internal space 16IN. It is formed. In other words, the connecting pipe 17 connects the storage space 112 and the internal space 16IN at a position different from the

supply ports

113, 162 and 123.

Therefore, the modeling material M is stored in the storage space 112 (as a result, the path via the

supply ports

113, 162, and 123 as the path connecting the storage space 112 and the internal space 16IN is blocked by the modeling material M. Even in this case, the storage space 112 is a space purged by the purge gas, similarly to the internal space 16IN. Further, the modeling material M is stored in the storage space 112 (as a result, the path via the

supply ports

113, 162 and 123 as the path connecting the storage space 112 and the internal space 16IN is blocked by the modeling material M. ), The purge gas in the storage space 112 flows into (that is, moves) into the internal space 16IN and / or the purge gas in the internal space 16IN flows into the storage space 112 through the connecting pipe 17. As a result, the difference between the pressure in the storage space 112 and the pressure in the internal space 16IN is reduced. Therefore, there is almost no imbalance between the pressure of the storage space 112 and the pressure of the internal space 16IN. Therefore, the inconvenience that the modeling material M is suddenly supplied from the hopper 11 to the holding member 12 due to the imbalance generated between the pressure of the storage space 112 and the pressure of the internal space 16IN may occur. Almost gone. Further, it is almost impossible that the modeling material M is not smoothly supplied from the hopper 11 due to the imbalance generated between the pressure of the storage space 112 and the pressure of the internal space 16IN. Further, due to the imbalance that occurs between the pressure of the storage space 112 and the pressure of the internal space 16IN, the modeling material M supplied from the hopper 11 to the internal space 16IN (particularly, the holding space 121) is supplied to the supply port. There is almost no backflow to the storage space 112 of the hopper 11 via 113, 162 and 123.

In addition to or instead of the processing system SYS including the connecting pipe 17, the hopper 11 may be arranged in the internal space 16IN. In this case, even if the connecting pipe 17 is not connected to the opening 116, the storage space 112 and the internal space 16IN are connected to each other through the opening 116. Therefore, there is almost no imbalance between the pressure of the storage space 112 and the pressure of the internal space 16IN. When the processing system SYS does not include the connecting pipe 17, the housing 16 may not have an opening 167.

The housing 16 is further formed with an opening 168. The opening 168 is a through hole that penetrates the partition wall member 161 (in the example shown in FIG. 3, the side wall member 1612, but may be the ceiling member 1611 or the bottom member 1613) from the internal space 16IN toward the external space 16OUT. Is. An observation window 1681 is fitted in the opening 168. When a gap is formed between the observation window 1681 and the partition member 161 with the observation window 1681 fitted in the opening 168, a seal member is formed in the gap between the observation window 1681 and the partition member 161. May be good. The observation window 1681 is a member through which visible light can pass (that is, is transparent to visible light). However, when the image pickup element of the image pickup apparatus 8 can detect light in a wavelength range different from the visible light wavelength range, the observation window 1681 is used for light in a wavelength range different from the visible light wavelength range (particularly). It may be a member through which light in a wavelength range that can be detected by the image pickup element) can pass. The observation window 1681 is used for the imaging device 8 to image the modeling material M passing through the internal space 16IN of the housing 16. Therefore, in the example shown in FIG. 3, the image pickup target path to be imaged by the image pickup apparatus 8 is set in the internal space 16IN of the housing 16. As a result, the imaging device 8 arranged in the external space 16OUT images the modeling material M passing through the imaging target path in the internal space 16IN through the observation window 1681. In this way, when the imaging device 8 is arranged in the external space 16OUT, the imaging device 8 is physically isolated from the internal space 16IN in which the modeling material M is present. As a result, the imaging device 8 can image the modeling material M passing through the imaging target path without being affected by the modeling material M. That is, there is no possibility or low possibility that the modeling material M has an influence on the image pickup apparatus 8. However, the image pickup apparatus 8 may be arranged in the internal space 16IN.

The imaging device 8 images the modeling material M passing between the material supply source 1A and the material nozzle 212 through the observation window 1681. That is, the image pickup apparatus 8 images the modeling material M passing through the supply path (imaging target path) between the material supply source 1A and the material nozzle 212. Since the material supply source 1A supplies the modeling material M from the supply port 124, the image pickup apparatus 8 images the modeling material M passing through the supply path path (imaging target path) between the supply port 124 and the material nozzle 212. To do. In the example shown in FIG. 3, the image pickup apparatus 8 images the modeling material M passing through the drop path (that is, the supply path) DP of the modeling material M that falls from the holding member 12 to the material delivery member 15. The image pickup apparatus 8 images the modeling material M passing through the supply path between the supply port 124 and the material delivery member 15. However, the image pickup apparatus 8 may image the modeling material M which is a supply path between the material supply source 1A and the material nozzle 212 and passes through a supply path different from the drop path DP of the modeling material M.

The housing 16 is further formed with an opening 169. The opening 169 is a through hole that penetrates the partition wall member 161 (in the example shown in FIG. 3, the side wall member 1612, but may be the ceiling member 1611 or the bottom member 1613) from the internal space 16IN toward the external space 16OUT. Is. An observation window 1691 is fitted in the opening 169. When a gap is formed between the observation window 1691 and the partition member 161 with the observation window 1691 fitted in the opening 169, a seal member is formed in the gap between the observation window 1691 and the partition member 161. May be good. The observation window 1691 is a member through which visible light can pass (that is, is transparent to visible light). However, when the lighting device 9 emits light in a wavelength range different from the visible light wavelength range as the illumination light IL, the observation window 1691 emits light in a wavelength range different from the visible light wavelength range (particularly, illumination). It may be a member through which optical IL) can pass. The observation window 1691 is used for the lighting device 9 to illuminate the modeling material M passing through the internal space 16IN of the housing 16 with the illumination light IL. Specifically, the illumination device 9 arranged in the external space 16OUT irradiates the illumination light IL toward the modeling material M passing through the supply path in the internal space 16IN through the observation window 1691. As a result, the modeling material M passing through the supply path in the internal space 16IN is illuminated by the illumination light IL emitted from the lighting device 9 arranged in the external space 16OUT through the observation window 1691. In this way, when the lighting device 9 is arranged in the external space 16OUT, the lighting device 9 is physically isolated from the internal space 16IN in which the modeling material M exists. As a result, the illumination device 9 can irradiate the illumination light IL toward the modeling material M passing through the imaging target path without being affected by the modeling material M. That is, there is no possibility or low possibility that the modeling material M has an influence on the lighting device 9. However, the lighting device 9 may be arranged in the internal space 16IN.

The

openings

168 and 169 may be formed at positions separated from the imaging target path (that is, at least a part of the falling path DP) in different directions. In this case, the image pickup device 8 and the illumination device 9 may be arranged at positions separated from the image pickup target path in different directions. As a result, the lighting device 9 may illuminate the modeling material M with the illumination light IL from a direction different from the direction in which the imaging device 8 images the modeling material M. At least one of the image pickup device 8 and the illumination device 9 may be provided with an optical path deflection mirror. The optical path deflection mirror may be arranged between the objective optical system of the image pickup apparatus 8 and the image pickup target path or between the illumination optical system of the illumination device 9 and the image pickup target path.

For example, as shown as an example in FIG. 3, the opening 168 may be formed on the −Y side of the imaging target path, and the opening 169 may be formed on the + Y side of the imaging target path. That is, the opening 168 may be formed on the opposite side of the opening 169 when viewed from the imaging target path. In this case, the lighting device 9 illuminates the modeling material M with the illumination light IL from the side opposite to the direction in which the imaging device 8 images the modeling material M. The lighting device 9 may illuminate the illumination light IL toward the image pickup device 8. In other words, the lighting device 9 transmits and illuminates the modeling material M. As a result, the image pickup apparatus 8 acquires an image corresponding to a negative image in which the brightness and darkness of the modeling material M, which is the subject, is reversed from the actual one. When the image pickup apparatus 8 acquires an image corresponding to such a negative image, it is compared with the case where the image pickup apparatus 8 acquires an image corresponding to a positive image in which the brightness and darkness of the modeling material M as the subject is substantially the same as the actual one. , Image analysis (specifically, binarization process and zero-order moment calculation process, which will be described in detail later with reference to FIG. 10) becomes easy. The illumination light IL emitted by the illumination device 9 may be continuous light or pulsed light.

However, the

openings

168 and 169 may be formed at positions separated from the imaging target path in the same direction. The lighting device 9 may illuminate the modeling material M with the illumination light IL from the same direction in which the imaging device 8 images the modeling material M. In other words, the lighting device 9 may reflect-illuminate the modeling material M. As a result, the image pickup apparatus 8 acquires an image corresponding to a positive image in which the brightness and darkness of the modeling material M as the subject is substantially the same as the actual one. Even in this case, the image can be analyzed.

(2) Operation of Machining System SYS Next, the operation of the machining system SYS will be described.

(2-1) Machining Operation for Machining Work W First, a machining operation by the machining system SYS (that is, an operation for forming a three-dimensional structure ST) will be described. As described above, the processing system SYS forms the three-dimensional structure ST by the laser overlay welding method. Therefore, the processing system SYS may form the three-dimensional structure ST by performing an existing processing operation (in this case, a modeling operation) based on the laser overlay welding method. Hereinafter, an example of a machining operation for forming the three-dimensional structure ST by using the laser overlay welding method will be briefly described.

The processing system SYS forms the three-dimensional structure ST on the work W based on the three-dimensional model data (for example, CAD (Computer Aided Design) data) of the three-dimensional structure ST to be formed. As 3D model data, at least the measurement data of a three-dimensional object measured by a measuring device (not shown) provided in the processing system SYS and the measurement data of the 3D shape measuring machine provided separately from the processing system SYS. One may be used.

In order to form the three-dimensional structure ST, the processing system SYS forms, for example, a plurality of layered partial structures (hereinafter referred to as "structural layers") SLs arranged along the Z-axis direction in order. For example, the processing system SYS sequentially forms a plurality of structural layers SL obtained by cutting the three-dimensional structure ST into round slices along the Z-axis direction. As a result, the three-dimensional structure ST, which is a laminated structure in which a plurality of structural layers SL are laminated, is formed. Hereinafter, the flow of the operation of forming the three-dimensional structure ST by sequentially forming the plurality of structural layers SL one by one will be described.

First, the operation of forming each structural layer SL will be described with reference to FIGS. 7 (a) to 7 (e). Under the control of the control device 7, the processing system SYS sets an irradiation region EA in a desired region on the modeling surface MS corresponding to the surface of the work W or the surface of the formed structural layer SL, and the irradiation region EA is set with respect to the irradiation region EA. The processing light EL is irradiated from the irradiation optical system 211. The region occupied by the processed light EL emitted from the irradiation optical system 211 on the modeling surface MS may be referred to as an irradiation region EA. In the present embodiment, the focus position (that is, the condensing position) of the processed light EL coincides with the modeling surface MS. As a result, as shown in FIG. 7A, a molten pool (that is, a pool of metal melted by the processing light EL) MP is formed in a desired region on the modeling surface MS by the processing light EL emitted from the irradiation optical system 211. It is formed. Further, the processing system SYS sets a supply region MA in a desired region on the modeling surface MS under the control of the control device 7, and supplies the modeling material M to the supply region MA from the material nozzle 212. Here, since the irradiation region EA and the supply region MA coincide with each other as described above, the supply region MA is set to the region where the molten pool MP is formed. Therefore, as shown in FIG. 7B, the processing system SYS supplies the modeling material M to the molten pool MP from the material nozzle 212. As a result, the modeling material M supplied to the molten pool MP is melted. When the processing light EL is not irradiated to the molten pool MP as the processing head 21 moves, the modeling material M melted in the molten pool MP is cooled and solidified (that is, solidified). As a result, as shown in FIG. 7C, the solidified modeling material M is deposited on the modeling surface MS. That is, a modeled object is formed by the deposit of the solidified modeling material M.

A series of modeling processes including formation of the molten pool MP by irradiation with such processing light EL, supply of the modeling material M to the molten pool MP, melting of the supplied modeling material M, and solidification of the molten modeling material M can be performed. As shown in FIG. 7D, the processing head 21 is repeatedly moved relative to the modeling surface MS along the XY plane. That is, when the processing head 21 moves relative to the modeling surface MS, the irradiation region EA also moves relative to the modeling surface MS. Therefore, a series of modeling processes is repeated while the irradiation region EA is moved relative to the modeling surface MS along the XY plane (that is, in the two-dimensional plane). At this time, the processed light EL is selectively irradiated to the irradiation region EA set in the region where the modeled object is to be formed on the modeled surface MS, but it is not desired to form the modeled object on the modeled surface MS. The irradiation area EA set in the area is not selectively irradiated (it can be said that the irradiation area EA is not set in the area where the modeled object is not desired to be formed). That is, the processing system SYS moves the irradiation region EA along the predetermined movement locus on the modeling surface MS, and converts the processing light EL into the modeling surface MS at a timing according to the distribution mode of the region where the modeled object is to be formed. Irradiate. The mode of distribution of the region where the modeled object is to be formed may be referred to as a distribution pattern or a pattern of the structural layer SL. As a result, the molten pool MP also moves on the modeling surface MS along the movement locus according to the movement locus of the irradiation region EA. Specifically, the molten pool MP is sequentially formed on the modeling surface MS in the portion of the region along the movement locus of the irradiation region EA that is irradiated with the processing light EL. Further, since the irradiation region EA and the supply region MA coincide with each other as described above, the supply region MA also moves on the modeling surface MS along the movement locus according to the movement locus of the irradiation region EA. Become. As a result, as shown in FIG. 7 (e), a structural layer SL corresponding to an aggregate of the modeled objects made of the solidified modeling material M is formed on the modeling surface MS. That is, the structural layer SL corresponding to the aggregate of the shaped objects formed on the modeling surface MS in the pattern corresponding to the moving locus of the molten pool MP (that is, the shape corresponding to the moving locus of the molten pool MP in a plan view). The structural layer SL) to have is formed. When the irradiation region EA is set in the region where the modeled object is not to be formed, the processing system SYS irradiates the irradiation region EA with the processing light EL and stops the supply of the modeling material M. Good. Further, when the irradiation region EA is set in the region where the modeled object is not to be formed, the processing system SYS supplies the modeling material M to the irradiation region EA, and the processing light EL having an intensity that does not allow the molten pool MP to be formed. May be irradiated to the irradiation area EA. In the above description, the irradiation area EA moves with respect to the modeling surface MS, but the modeling surface MS may move with respect to the irradiation area EA.

The processing system SYS repeatedly performs the operation for forming such a structural layer SL under the control of the control device 7 based on the three-dimensional model data. Specifically, first, the three-dimensional model data is sliced at a stacking pitch to create slice data. The processing system SYS performs an operation for forming the first structural layer SL # 1 on the modeling surface MS corresponding to the surface of the work W, that is, three-dimensional model data corresponding to the structural layer SL # 1, that is, the structural layer. This is performed based on the slice data corresponding to SL # 1. As a result, the structural layer SL # 1 is formed on the modeling surface MS as shown in FIG. 8A. After that, the processing system SYS sets the surface (that is, the upper surface) of the structural layer SL # 1 on the new modeling surface MS, and then forms the second structural layer SL # 2 on the new modeling surface MS. To do. In order to form the structural layer SL # 2, the control device 7 first controls the head drive system 22 so that the machining head 21 moves along the Z axis. Specifically, the control device 7 controls the head drive system 22 so that the irradiation region EA and the supply region MA are set on the surface of the structural layer SL # 1 (that is, the new modeling surface MS). The processing head 21 is moved toward the + Z side. As a result, the focus position of the processing light EL coincides with the new modeling surface MS. After that, the processing system SYS operates on the structural layer SL # 1 based on the slice data corresponding to the structural layer SL # 2 in the same operation as the operation of forming the structural layer SL # 1 under the control of the control device 7. The structural layer SL # 2 is formed on the surface. As a result, the structural layer SL # 2 is formed as shown in FIG. 8 (b). After that, the same operation is repeated until all the structural layers SL constituting the three-dimensional structure ST to be formed on the work W are formed. As a result, as shown in FIG. 8C, the three-dimensional structure ST is formed by the laminated structure in which a plurality of structural layers SL are laminated.

(2-2) Supply operation of the modeling material M by the material supply device 1 Subsequently, with reference to FIG. 9, the supply of the modeling material M performed by the material supply device 1 during the period during which the above-mentioned processing operation is performed. The operation will be described. FIG. 9 is a cross-sectional view showing a material supply device 1 that supplies the modeling material M.

As shown in FIG. 9, the modeling material M stored in the storage space 112 of the hopper 11 falls into the holding space 121 of the holding member 12 via the

supply ports

113, 162 and 123. The modeling material M stored in the storage space 112 of the hopper 11 falls on the holding surface 1221 of the holding member 12 via the

supply ports

113, 162 and 123. That is, the modeling material M is supplied from the hopper 11 to the holding member 12 (particularly to the holding space 121 and further to the transport member 13 arranged in the holding space 121) in the direction of gravity. In order to realize such supply of the modeling material M, the supply port 123 is formed on a surface portion of the inner wall surface 122 that does not intersect with the transport member 13 (particularly, the shaft member 131). As a result, the holding space 121 holds the modeling material M in an amount corresponding to the size of the holding space 121. An amount of modeling material M corresponding to the size of the holding space 121 is deposited on the holding surface 1221.

The modeling material M deposited on the holding surface 1221 is in contact with the

supply ports

123, 162 and 113. In this case, under the condition that the transport member 13 is stationary (that is, not rotating), the deposited modeling material M closes the

supply ports

123, 162 and 113, and more modeling material M is attached to the holding member 12. It suppresses the supply. In this state, the transport member 13 is rotationally driven by the drive device 14. When the transport member 13 starts to rotate, as described above, the modeling material M held in the holding space 121 starts to move through the groove 132 formed in the transport member 13. The modeling material M is pushed by the protrusion 133 defining the groove 132 and gradually moves toward the supply port 124. That is, the transport member 13 supplies the modeling material M toward the supply port 124. That is, the transport member 13 is along a direction (for example, the Y-axis direction) that intersects the direction in which the modeling material M is supplied from the hopper 11 to the transport member 13 (for example, the direction of gravity and the Z-axis direction). The modeling material M is supplied.

As a result, the modeling material M supplied by the transport member 13 falls (that is, spills) from the supply port 124 of the holding member 12 to the outside of the holding member 12 (that is, the material delivery member 15). Specifically, the modeling material M falls from the end of the groove 132 or the gap G corresponding to the groove 132 exposed in the internal space 16IN to the material delivery member 15. That is, the modeling material M falls from the gap G formed by the groove 132 to the material delivery member 15 at the position where the supply port 124 is formed. The gap G is a gap formed by a groove 132 between the holding member 12 and the transport member 13 at the position where the supply port 124 is formed. The device including the hopper 11, the holding member 12, and the conveying member 13 may be referred to as a supply source because the modeling material M is supplied to the material sending member 15.

Since the pitch of the spiral groove 132 (that is, the period, for example, the distance that the groove 132 extends (that is, advances) during one rotation of the groove 132) is constant, the transport member 13 is continuously and. When it continues to rotate in the same manner, the modeling material M held in the holding space 121 is supplied at a constant supply rate. As a result, a certain amount of the modeling material M per unit time spills from the supply port 124 of the holding member 12 to the outside of the holding member 12 (that is, the material delivery member 15). As a result, the holding member 12 supplies (that is, conveys) a constant amount of the modeling material M to the material sending member 15 per unit time. Therefore, by supplying the modeling material M through the groove 132, the transport member 13 substantially functions as a member that cuts out a constant amount of the modeling material M per unit time to the outside of the holding member 12.

On the other hand, when the rotation of the transport member 13 by the drive device 14 is stopped, the modeling material M held in the holding space 121 stops moving, and the modeling material M does not spill from the holding member 12. That is, the supply of the modeling material M from the holding member 12 to the material sending member 15 is stopped. As a result, the supply of the modeling material M from the material supply device 1 to the processing device 2 is also stopped. Therefore, the drive device 14 does not have to supply the modeling material M to the processing device 2 under the control of the control device 7 (for example, the timing at which the material nozzle 212 does not have to supply the modeling material M). , The rotation of the transport member 13 is stopped.

The amount of the modeling material M supplied from the holding member 12 to the outside of the holding member 12 per unit time (that is, the supply amount of the modeling material M per unit time) can be controlled by the state of rotation of the transport member 13. is there. Therefore, in the control device 7, the amount of the modeling material M supplied from the holding member 12 to the material sending member 15 per unit time corresponds to the supply rate of the modeling material M required for forming the three-dimensional structure ST. The state of rotation of the transport member 13 may be set so as to reach the target supply amount. In the present embodiment, the amount of the modeling material M means the mass of the modeling material M.

The drive device 14 is under the control of the control device 7 while the processing device 2 is forming the three-dimensional structure ST (more specifically, while the material nozzle 212 continues to supply the modeling material M). May rotate the transport member 13 so that the transport member 13 continues to rotate in the set rotation state. As a result, a certain amount of modeling material M required per unit time for the processing apparatus 2 to form the three-dimensional structure ST is supplied from the holding member 12 to the material sending member 15.

The state of rotation may include, for example, the rotation speed (that is, the number of rotations per unit time). For example, as the rotation speed increases (that is, the number of rotations per unit time increases), the moving speed of the modeling material M moving through the groove 132 also increases. Therefore, the faster the rotation speed, the larger the amount of the modeling material M supplied from the holding member 12 to the outside of the holding member 12 per unit time. As the amount of the modeling material M supplied from the holding member 12 to the outside of the holding member 12 increases per unit time, the amount of the modeling material M supplied from the material supply device 1 to the processing device 2 per unit time ( That is, the supply amount) increases. Therefore, the faster the rotation speed, the larger the supply amount of the modeling material M supplied from the material supply device 1 to the processing device 2 per unit time. The control device 7 takes into consideration the relationship between the rotation speed of the transport member 13 and the supply amount of the modeling material M, and the modeling material supplied from the holding member 12 to the material delivery member 15 per unit time. The rotation speed of the transport member 13 may be set so that the amount of M becomes the target supply amount according to the supply rate of the modeling material M required for forming the three-dimensional structure ST. That is, the control device 7 is a transport member based on the supply rate of the modeling material M required for forming the three-dimensional structure ST (that is, the amount of the modeling material M to be supplied by the material supply device 1 per unit time). The rotation speed of 13 may be set. Further, the drive device 14 may rotationally drive the transfer member 13 so that the transfer member 13 rotates at a rotation speed set by the control device 7.

Even if the state of rotation of the transport member 13 is the same, the amount of the modeling material M in the first state supplied from the holding member 12 per unit time and the second amount supplied from the holding member 12 per unit time. (However, the second state is different from the first state), the amount of the modeling material M may not be the same. That is, the amount of the modeling material M in the first state supplied from the holding member 12 per unit time by the transport member 13 rotating in a certain state, and the amount per unit time from the holding member 12 by the transport member 13 rotating in the same state. The amount of modeling material M in a different second state supplied to may not be the same. Specifically, for example, the amount of the first type of modeling material M supplied from the holding member 12 by the conveying member 13 rotating in a certain state per unit time, and the holding member by the conveying member 13 rotating in the same state. There is a possibility that the amount of the modeling material M of the second type (however, the second type is different from the first type) supplied from 12 per unit time is not the same. For example, the amount of the molding material M having the first particle size supplied from the holding member 12 per unit time by the conveying member 13 rotating in a certain state and the unit time from the holding member 12 by the conveying member 13 rotating in the same state. There is a possibility that the amount of the molding material M of the second particle size (however, the second particle size is different from the first particle size) supplied per unit is not the same. For example, the amount of the molding material M having the first particle size supplied from the holding member 12 per unit time by the transport member 13 rotating in a certain state and the amount of the molding material M having the same particle size per unit time from the holding member 12 There is a possibility that the amount of the modeling material M of the second particle size (however, the second particle size is different from the first particle size) supplied to the product will not be the same. For example, the amount of the modeling material M of the first shape (particularly the outer shape) supplied from the holding member 12 by the conveying member 13 rotating in a certain state and the holding member 13 by the conveying member 13 rotating in the same state. There is a possibility that the amount of the modeling material M of the second shape (however, the second shape is different from the first shape) supplied from 12 per unit time is not the same. For example, the amount of the modeling material M whose surface friction coefficient is the first value, which is supplied from the holding member 12 by the conveying member 13 rotating in a certain state, is held by the conveying member 13 rotating in the same state. The surface friction coefficient supplied from the member 12 per unit time may not be the same as the amount of the modeling material M having the second value (however, the second value is different from the first value). For example, the amount of the modeling material M having the first specific gravity supplied from the holding member 12 per unit time by the conveying member 13 rotating in a certain state, and the amount of the modeling material M having the first specific gravity supplied from the holding member 12 per unit time by the conveying member 13 rotating in the same state. There is a possibility that the amount of the modeling material M of the second specific gravity (however, the second specific gravity is different from the first specific gravity) supplied to the above is not the same. For example, the amount of the first density modeling material M supplied from the holding member 12 per unit time by the transport member 13 rotating in a certain state, and the amount of the modeling material M of the first density supplied from the holding member 12 per unit time by the transport member 13 rotating in the same state. There is a possibility that the amount of the modeling material M of the second density (however, the second density is different from the first density) supplied to the first density is not the same. Therefore, the control device 7 adds or substitutes for or in place of the relationship between the state of rotation of the transport member 13 and the supply amount of the modeling material M, and the relationship between the state of the modeling material M and the supply amount of the modeling material M. The amount of the modeling material M supplied from the holding member 12 to the material sending member 15 per unit time is a target according to the supply rate of the modeling material M required for forming the three-dimensional structure ST. The state of rotation of the transport member 13 may be set so as to be the supply amount. That is, the control device 7 may set the rotational state of the transport member 13 based on the state of the modeling material M and the supply rate of the modeling material M required for forming the three-dimensional structure ST. Here, the state of the modeling material M includes the type of the modeling material M, the size of the modeling material M (for example, the particle size), the particle size of the modeling material M, the shape of the modeling material M, the friction coefficient of the surface of the modeling material M, and so on. It may contain at least one of the specific gravity of the modeling material M and the density of the modeling material M.

In the present embodiment, in particular, in order to set the rotational state of the transport member 13 so that the amount of the modeling material M supplied from the holding member 12 to the material delivery member 15 per unit time becomes the target supply amount, the control device. 7 performs the supply amount control operation shown below. Specifically, the control device 7 calculates (that is, obtains) the amount of the modeling material M that passes through the imaging target path per unit time based on the image captured by the imaging device 8. Hereinafter, for the sake of simplification of the description, the amount of the modeling material M passing through the imaging target path per unit time will be referred to as "the actual supply amount of the modeling material M". Specifically, during the period in which the material supply device 1 supplies the modeling material M to the processing device 2, as shown in FIG. 9, the image pickup device 8 is located between the material supply source 1A and the material creation member 15. The modeling material M passing through the drop path DP of the above is imaged. Therefore, the image captured by the image pickup apparatus 8 includes information regarding the modeling material M passing through the image pickup target path (fall path DP). Therefore, the control device 7 calculates the actual supply amount of the modeling material M by analyzing the image captured by the image pickup device 8. After that, the control device 7 sets the rotational state of the transport member 13 based on the calculation result of the actual supply amount of the modeling material M. Specifically, the control device 7 sets the state of rotation of the transport member 13 so that the actual supply amount of the modeling material M matches the target supply amount. Here, in the present embodiment, since at least a part of the supply path (that is, the drop path DP) of the modeling material M supplied from the holding member 12 to the material delivery member 15 is the imaging target path, the modeling material The actual supply amount of M may be regarded as substantially equivalent to the amount of the modeling material M supplied from the holding member 12 to the material delivery member 15 per unit time. Therefore, the operation of setting the rotational state of the transport member 13 so that the actual supply amount of the modeling material M matches the target supply amount is substantially from the holding member 12 to the material delivery member 15 per unit time. This is equivalent to the operation of setting the rotational state of the transport member 13 so that the amount of the supplied modeling material M becomes the target supply amount.

The actual supply amount of the modeling material M is calculated by analyzing the image captured by the imaging device 8, and the rotational state of the transport member 13 is determined based on the calculation result of the actual supply amount of the modeling material M. Since the supply amount control operation to be set will be described in detail later with reference to FIG. 10 and the like, detailed description here will be omitted.

When the modeling material M is supplied from the holding member 12 to the material sending member 15, the amount of the modeling material M held by the holding member 12 is reduced. On the other hand, since the holding member 12 is located below the supply port 113 of the hopper 11, when the amount of the modeling material M held by the holding member 12 decreases, the weight of the modeling material M itself causes the supply port 113 to move. A new modeling material M is supplied from the hopper 11 to the holding member 12 via the hopper 11. That is, the holding member 12 is newly supplied with the modeling material M in an amount corresponding to the amount of the modeling material M supplied from the holding member 12 to the material delivery member 15. For example, the holding member 12 is newly supplied with the modeling material M in an amount substantially the same as the amount of the modeling material M supplied from the holding member 12 to the material delivery member 15. Therefore, the modeling material M does not disappear from the holding member 12 due to the supply of the modeling material M from the holding member 12. Typically, the holding member 12 will hold approximately the same amount of modeling material M.

The modeling material M supplied from the holding member 12 falls from the holding member 12 to the material sending member 15. As a result, the material sending member 15 receives the modeling material M supplied from the holding member 12. The modeling material M received by the material sending member 15 is sent out to the outside of the material supply device 1 (that is, to the processing device 2). Here, as described above, the purge gas pressurized from the gas supply device 5 is supplied to the internal space 16IN of the housing 16 in which the material delivery member 15 is arranged via the inflow port 166. The material delivery member 15 sends the modeling material M to the processing apparatus 2 by pressure feeding with the pressurized purge gas. That is, the modeling material M received by the material delivery member 15 is sent out so as to be pushed out into the pipe through the

delivery ports

151 and 165 by the pressure of the purge gas supplied to the internal space 16IN. The modeling material M sent out through the pipe is supplied from the material nozzle 212.

Since the material sending member 15 sends out the modeling material M by pumping, the amount of the modeling material M sent out by the material sending member 15 per unit time is supplied from the holding member 12 to the material sending member 15 per unit time. It depends on the amount of the modeling material M (that is, the actual supply amount of the modeling material M). Therefore, the material delivery member 15 can deliver a fixed amount of the modeling material M to the processing device 2 per unit time. As a result, the material supply device 1 can supply a fixed amount of the modeling material M to the processing device 2 per unit time. That is, in the material supply device 1, the amount of the modeling material M supplied from the material supply device 1 to the processing device 2 per unit time depends on the supply rate of the modeling material M required for forming the three-dimensional structure ST. The modeling material M can be supplied to the processing apparatus 2 so as to have a constant supply amount. Therefore, the above-mentioned supply amount control operation can be regarded as substantially equivalent to the operation of controlling the amount of the modeling material M supplied from the material supply device 1 to the processing device 2 per unit time. Good.

Further, since the material nozzle 212 supplies the modeling material M supplied from the material supply device 1 to the processing device 2 to the work W, the amount of the modeling material M supplied by the material nozzle 212 per unit time is a unit time. It depends on the amount of the modeling material M supplied to the modeling material M supplied from the material supply device 1 to the processing device 2. Therefore, the material nozzle 212 can supply a fixed amount of the modeling material M to the work W per unit time. That is, the material nozzle 212 supplies a constant amount of the modeling material M supplied from the material nozzle 212 to the work W per unit time according to the supply rate of the modeling material M required for forming the three-dimensional structure ST. The modeling material M can be supplied to the work W so as to be in quantity. Therefore, the above-mentioned supply amount control operation may be regarded as substantially equivalent to the operation of controlling the amount of the modeling material M supplied from the material nozzle 212 to the work W per unit time.

In the above description, while the processing apparatus 2 forms the three-dimensional structure ST, the amount of the modeling material M transported from the holding member 12 to the material sending member 15 is constant per unit time. ing. That is, while the processing device 2 forms the three-dimensional structure ST, the amount of the modeling material M supplied from the material supply device 1 to the processing device 2 is constant per unit time. However, the material supply device 1 is supplied from the material supply device 1 to the processing device 2 per unit time while the processing device 2 forms the three-dimensional structure ST under the control of the control device 7. The amount of the modeling material M may be changed. Specifically, as described above, the amount of the modeling material M transported from the holding member 12 to the material delivery member 15 per unit time depends on the state of rotation of the transport member. Therefore, the control device 7 may control the drive device 14 so as to change the rotational state of the transport member 13 during at least a part of the period during which the processing device 2 forms the three-dimensional structure ST. As a result, the amount of the modeling material M transported from the holding member 12 to the material delivery member 15 is changed per unit time as the rotational state of the transport member 13 is changed. That is, as the state of rotation of the transport member 13 changes, the amount of the modeling material M transported from the material supply device 1 to the processing device 2 is changed per unit time.

(2-3) Supply amount control operation for controlling the actual supply amount of the modeling material M Next, a supply amount control operation for controlling the actual supply amount of the modeling material M will be described with reference to FIG. FIG. 10 is a flowchart showing a flow of a supply amount control operation for controlling the actual supply amount of the modeling material M.

The supply amount control operation shown in FIG. 10 is performed at least a part of the period during which the machining system SYS is machining the work W. The supply amount control operation shown in FIG. 10 is performed at least a part of the period during which the material supply device 1 supplies the modeling material M to the processing device 2. In particular, the supply amount control operation shown in FIG. 10 is repeatedly performed during at least a part of the period during which the machining system SYS is machining the work W. The supply amount control operation shown in FIG. 10 is repeatedly performed during at least a part of the period during which the material supply device 1 supplies the modeling material M to the processing device 2. On the other hand, the supply amount control operation shown in FIG. 10 may not be performed during at least a part of the period during which the machining system SYS is not machining the work W. The supply amount control operation shown in FIG. 10 may not be performed during at least a part of the period during which the material supply device 1 does not supply the modeling material M to the processing device 2.

As shown in FIG. 10, first, the image pickup apparatus 8 images the image pickup target path (step S11). That is, the image pickup apparatus 8 takes an image of the modeling material M passing through the image pickup target path (step S11).

Every time the image pickup device 8 images the modeling material M, the control device 7 acquires an image (hereinafter referred to as “original image”) captured by the image pickup device 8 (step S12). An example of the original image captured by the image pickup apparatus 8 is shown in FIG. As shown in FIG. 11, the modeling material M passing through the imaging target path is reflected in the original image. Note that FIG. 11 shows an example of an original image in which the light and darkness of the modeling material M, which is the subject, corresponds to a negative image in which the brightness is reversed from the actual one.

After that, the control device 7 calculates the actual supply amount of the modeling material M based on the original image acquired in step S12 (steps S13 to S15). The control device 7 may use an existing method as a method for calculating the amount of powder based on the image. Therefore, a detailed description of the process of calculating the actual supply amount of the modeling material M based on the original image will be omitted, but the following is an example of the process of calculating the actual supply amount of the modeling material M based on the original image. Will be briefly explained. However, the control device 7 may calculate the actual supply amount of the modeling material M based on the original image by performing a process different from the process shown below.

In order to calculate the actual supply amount of the modeling material M, the control device 7 generates a binarized image by performing a binarization process on the original image acquired in step S12 (step S13). At this time, the control device 7 may perform binarization processing on the entire original image. Alternatively, the control device 7 may perform the binarization process on a part of the original image, but may not perform the binarization process on the remaining part of the original image. For example, the control device 7 may perform binarization processing on a part of the image portion in which the modeling material M is reflected in the original image. For example, the control device 7 may perform binarization processing on a part of the image portion of the original image in which the imaging target path is reflected. When the binarization process is performed on a part of the original image in this way, the processing load of the control device 7 is reduced as compared with the case where the binarization process is performed on the entire original image.

An example of the binarized image is shown in FIG. FIG. 12 shows a binarized image generated by performing a binarization process on a part of the original image shown in FIG. As shown in FIG. 12, as a result of the binarization process, it can be seen that a binarized image in which the modeling material M and its background can be more clearly distinguished is generated as compared with the original image.

After that, the control device 7 calculates the area occupied by the modeling material M in the binarized image based on the binarized image (step S14). In order to calculate the area occupied by the modeling material M in the binarized image, the control device 7 reflects, for example, at least a part of the modeling material M among the plurality of pixels constituting the binarized image. The 0th-order moment corresponding to the sum of the pixels may be calculated. That is, the control device 7 sets the pixel value of the pixel in which at least a part of the modeling material M is reflected to 1, and sets the pixel value of the pixel in which at least a part of the modeling material M is not reflected to 0. , The 0th-order moment corresponding to the sum of the pixel values of the plurality of pixels constituting the binarized image may be calculated. The 0th-order moment calculated in this way corresponds to the area occupied by the modeling material M in the binarized image.

After that, the control device 7 calculates the actual supply amount of the modeling material M based on the area of the modeling material M calculated in step S14 (that is, the area occupied by the modeling material M in the binarized image) (step S15). ). Specifically, as the actual supply amount of the modeling material M increases, the modeling material M reflected in the original image increases. The larger the modeling material M reflected in the original image, the larger the area occupied by the modeling material M in the binarized image. Therefore, the area occupied by the modeling material M in the binarized image is information having a correlation with the actual supply amount of the modeling material M. Therefore, the control device 7 can calculate the actual supply amount of the modeling material M based on the area occupied by the modeling material M in the binarized image.

The control device 7 uses the correlation information showing the correlation between the area occupied by the modeling material M in the binarized image and the actual supply amount of the modeling material M from the area occupied by the modeling material M in the binarized image. , The actual supply amount of the modeling material M may be calculated. An example of correlation information is shown in FIG. As shown in FIG. 13, the correlation information may include a graph showing the correlation between the area occupied by the modeling material M in the binarized image and the actual supply amount of the modeling material M. As shown in FIG. 13, the correlation information typically shows a correlation that the larger the area occupied by the modeling material M in the binarized image, the larger the actual supply amount of the modeling material M. In the example shown in FIG. 13, the correlation information shows that the area occupied by the modeling material M in the binarized image and the actual supply amount of the modeling material M have a linear correlation. However, the correlation information may indicate that the area occupied by the modeling material M in the binarized image and the actual supply amount of the modeling material M have a non-linear correlation.

Not limited to the graph, arbitrary information showing the correlation between the area occupied by the modeling material M in the binarized image and the actual supply amount of the modeling material M may be used as the correlation information. An example of such arbitrary information is at least one of a table, a function, a computational model and a database.

Such correlation information may be generated in advance before the supply amount control operation is performed. The correlation information generated in advance may be stored in a storage device included in the control device 7. In order to generate the correlation information in advance, the material supply device 1 may perform the above-mentioned supply operation before the processing device 2 processes the work W. At this time, the imaging device 8 images the modeling material M passing through the imaging target path, and the amount of the modeling material M passing through the imaging target path (that is, the actual supply amount) is actually measured using the mass measuring device. You may. For example, if the mass measuring device is arranged in the falling path of the modeling material M that falls from the holding member 12 to the material sending member 15, the mass measuring device can measure the amount of the modeling material M passing through the imaging target path (that is, the actual amount). Supply amount) can be measured. After that, the control device 7 calculates the area occupied by the modeling material M in the binarized image from the original image captured by the image pickup device 8, and obtains the correlation information based on the calculated area and the measurement result of the mass measuring device. It may be generated.

When the state of the modeling material M is different, the correlation between the area occupied by the area of the modeling material M in the binarized image and the actual supply amount of the modeling material M may change. For example, the correlation between the area occupied by the first type of modeling material M in the binarized image and the actual supply amount of the first type of modeling material M is different from that of the first type in the second type. The correlation between the area occupied by the modeling material M in the binarized image and the actual supply amount of the second type of modeling material M may differ. For example, the correlation between the area occupied by the modeling material M having the first particle size in the binarized image and the actual supply amount of the modeling material M having the first particle size is different from that of the first particle size. There is a possibility that the correlation between the area occupied by the modeling material M having the particle size of 2 in the binarized image and the actual supply amount of the modeling material M having the second particle size may be different. For example, the correlation between the area occupied by the modeling material M of the first particle size in the binarized image and the actual supply amount of the modeling material M of the first particle size is different from that of the first particle size. The correlation between the area occupied by the modeling material M in the binarized image and the actual supply amount of the modeling material M having the second particle size may differ. For example, the correlation between the area occupied by the modeling material M of the first shape in the binarized image and the actual supply amount of the modeling material M of the first shape is different from that of the first shape. The correlation between the area occupied by the modeling material M in the binarized image and the actual supply amount of the modeling material M of the second shape may be different. For example, the correlation between the area occupied by the modeling material M having the first specific gravity in the binarized image and the actual supply amount of the modeling material M having the first specific gravity is different from that of the first specific gravity. The correlation between the area occupied by the modeling material M in the binarized image and the actual supply amount of the modeling material M having the second specific gravity may be different. For example, the correlation between the area occupied by the first density modeling material M in the binarized image and the actual supply amount of the first density modeling material M is different from the first density in the second density. The correlation between the area occupied by the modeling material M in the binarized image and the actual supply amount of the modeling material M having the second density may be different. Therefore, the control device 7 may calculate the actual supply amount of each of the plurality of modeling materials M having different states by using the plurality of correlation information. Specifically, the control device 7 selects one correlation information according to the state of the modeling material M from a plurality of correlation information, and uses the selected one correlation information to determine the actual supply amount of the modeling material M. It may be calculated. Alternatively, the control device 7 may calculate the actual supply amount of each of the plurality of modeling materials M in different states by using a single correlation information. Specifically, the control device 7 converts the correlation information based on the state of the modeling material M (in other words, changes, corrects, or corrects), and uses the converted correlation information to produce the fruit of the modeling material M. The supply amount may be calculated.

After that, the control device 7 calculates the deviation of the actual supply amount of the modeling material M calculated in step S15 from the target supply amount (step S16). That is, the control device 7 calculates the difference between the actual supply amount of the modeling material M calculated in step S15 and the target supply amount (step S16).

After that, the control device 7 controls the transport member 13 based on the deviation calculated in step S16 (step S17). Specifically, the control device 7 calculates the state of rotation (typically, the rotation speed) of the transport member 13 that can make the deviation calculated in step S16 zero. That is, the control device 7 calculates the state of rotation of the transport member 13 capable of matching the actual supply amount of the modeling material M calculated in step S15 with the target supply amount. For example, when the actual supply amount is larger than the target supply amount, it is desirable to reduce the actual supply amount. In this case, the control device 7 may calculate a speed slower than the current rotation speed by the amount corresponding to the deviation. On the other hand, for example, when the actual supply amount is smaller than the target supply amount, it is desirable to increase the actual supply amount. In this case, the control device 7 may calculate a speed that is faster than the current rotation speed by the amount corresponding to the deviation. After that, the control device 7 controls the drive device 14 so that the transport member 13 rotates in the calculated state (typically, the speed).

As a result, the state of rotation of the transport member 13 is controlled so that the actual supply amount and the target supply amount match. That is, the control device 7 can feedback-control the rotation state of the transport member 13 that affects the actual supply amount of the modeling material M based on the actual supply amount of the modeling material M. Therefore, a state in which the actual supply rate of the modeling material M supplied from the material supply device 1 to the processing device 2 matches the target supply rate of the modeling material M required for forming the three-dimensional structure ST is appropriately maintained. To.

(3) Technical Effects of Machining System SYS As described above, the machining system SYS of the present embodiment can appropriately perform additional machining on the work W.

Further, the material supply device 1 included in the processing system SYS is a holding member 12 arranged below the hopper 11 to hold a certain amount of the modeling material M supplied from the hopper 11 and then enter the holding space 121 of the holding member 12. A certain amount of modeling material M is transported from the holding member 12 to the material delivery member 15 per unit time by the rotation of the arranged transport member 13. Therefore, the material supply device 1 can stably supply the processing device 2 with a fixed amount of the modeling material M required per unit time for the processing device 2 to form the three-dimensional structure ST. .. That is, the material supply device 1 can supply the modeling material M to the processing device 2 while maintaining a desired supply rate. As a result, the processing system SYS can form a relatively high-precision three-dimensional structure ST.

Further, the control device 7 can control the rotational state of the transport member 13 so that the actual supply amount of the modeling material M and the target supply amount match. Therefore, even if the actual supply amount of the modeling material M does not match the target supply amount due to some factor, the control device 7 again matches the actual supply amount of the modeling material M with the target supply amount. As described above, the state of rotation of the transport member 13 can be controlled. That is, a state in which the actual supply amount of the modeling material M and the target supply amount match is appropriately maintained. Hereinafter, an example of a situation in which a state in which the actual supply amount and the target supply amount of the modeling material M are appropriately maintained will be described with reference to FIGS. 14 and 15.

FIG. 14 shows a state in which the actual supply amount of the modeling material M gradually decreases (or increases in some cases) when the state of rotation of the transport member 13 is continuously maintained under the condition that the supply amount operation is not performed. Is indicated by a dotted line. For example, since the transport member 13 is rotating, the shaft member 131 may be worn. When the shaft member 131 is worn in this way, the fruit of the modeling material M is different from the case where the shaft member 131 is not worn, even though the rotational state of the transport member 13 has not changed at all. The supply may change. For example, as shown by the dotted line in FIG. 14, as the shaft member 131 gradually wears, the actual supply amount of the modeling material M may also gradually decrease (or increase). Alternatively, the temperature of the transport member 13 may fluctuate according to the rotation of the transport member 13. If the temperature of the transport member 13 fluctuates, the transport member 13 may be thermally deformed. As a result, the actual supply amount of the modeling material M may change due to the thermal deformation of the transport member 13. However, even if the actual supply amount of the modeling material M does not match the target supply amount due to such wear of the shaft member 131 and / or thermal deformation of the transport member 13, the control device 7 still uses the modeling material M. The state of rotation of the transport member 13 is controlled so that the actual supply amount and the target supply amount of the above match again. As a result, as shown by the solid line in FIG. 14, the state in which the actual supply amount of the modeling material M and the target supply amount coincide with each other is appropriately maintained.

FIG. 15 shows that the actual supply amount of the modeling material M decreases (or increases in some cases) at a certain timing when the state of rotation of the transport member 13 is continuously maintained under the condition that the supply amount operation is not performed. The situation is shown by a dotted line. For example, the state of the material supply device 1 changes from the state in which the modeling material M in the first state is supplied to the state in which the modeling material M in the second state different from the first state is supplied. there's a possibility that. This is because the processing system SYS does not always perform the processing operation using the modeling material M in the same state. In this case, as shown by the dotted line in FIG. 15, the actual supply amount of the modeling material M is changed at the timing when the state of the modeling material M is changed even though the rotational state of the transport member 13 has not changed at all. It may change. However, even if the actual supply amount of the modeling material M does not match the target supply amount due to such a change in the state of the modeling material M, the control device 7 still supplies the actual supply amount and the target supply amount of the modeling material M. The state of rotation of the transport member 13 is controlled so that the amount matches again. As a result, as shown by the solid line in FIG. 15, the state in which the actual supply amount of the modeling material M and the target supply amount coincide with each other is appropriately maintained.

When the state in which the actual supply amount and the target supply amount of the modeling material M are appropriately maintained in this way, the material supply device 1 takes the processing device 2 to form the three-dimensional structure ST per unit time. A certain amount of the modeling material M required for the above can be stably supplied to the processing apparatus 2. That is, the material supply device 1 can supply the modeling material M to the processing device 2 while maintaining a desired supply rate. Further, the material nozzle 212 can stably supply the work W with a fixed amount of the modeling material M required per unit time for the processing apparatus 2 to form the three-dimensional structure ST. That is, the material nozzle 212 can supply the modeling material M to the work W while maintaining a desired supply rate. As a result, the processing system SYS can form a relatively high-precision three-dimensional structure ST.

Instead of calculating the actual supply amount of the modeling material M based on the original image obtained by imaging the modeling material M passing through the imaging target path, the modeling material is used by a mass measuring device such as a load cell. In order to maintain a state in which the actual supply amount of the modeling material M and the target supply amount match with each other in the processing system of the comparative example, which is different from the processing system SYS of the present embodiment in that the actual supply amount of M is actually measured. Can be considered as an alternative to. However, the measured value of the mass measuring device such as the load cell may fluctuate due to the vibration of the material supply device 1 (or the vibration of some members thereof) and the wind pressure of the purge gas or the like. Therefore, the processing system of the comparative example may not be able to maintain a state in which the actual supply amount of the modeling material M and the target supply amount match. However, in the present embodiment, since the actual supply amount of the modeling material M is calculated based on the original image, the vibration of the material supply device 1 (or the vibration of a part of the members), the wind pressure such as purge gas, and the material. The temperature of the supply device 1, electrical noise, and the like do not affect the calculated value of the actual supply amount. Therefore, the processing system SYS of the present embodiment can appropriately maintain a state in which the actual supply amount and the target supply amount of the modeling material M are in agreement, which is practical, which is not found in the processing system of the comparative example. You can enjoy the effect.

Further, in the material supply device 1, the drive device 14 is arranged in the external space 16OUT separated from the internal space 16IN of the housing 16 by the partition member 161. Therefore, as compared with the case where the drive device 14 is arranged in the internal space 16IN, the heat generated by the actuator (power source) such as the motor included in the drive device 14 is arranged in the internal space 16IN. Specifically, it becomes difficult to transmit to the holding member 12, the transport member 13, and the material delivery member 15). As a result, the members arranged in the internal space 16IN are less likely to be thermally deformed. Here, the thermal deformation of the members arranged in the internal space 16IN may cause fluctuations in the amount of the modeling material M transported from the holding member 12 to the material delivery member 15 per unit time. That is, the thermal deformation of the member arranged in the internal space 16IN may cause a fluctuation in the supply rate of the modeling material M supplied from the material supply device 1 to the processing device 2. Then, in the present embodiment, since the member arranged in the internal space 16IN is less likely to be thermally deformed, the supply rate of the modeling material M supplied from the material supply device 1 to the processing device 2 becomes the heat of the drive device 14. Due to this, unintentional fluctuations are appropriately suppressed. That is, the material supply device 1 can suppress the influence of the heat of the drive device 14 on the supply rate of the modeling material M. Therefore, the material supply device 1 can supply the modeling material M while maintaining a desired supply rate. As a result, the processing system SYS can form a relatively high-precision three-dimensional structure ST.

However, even if the amount of the modeling material M transported from the holding member 12 to the material sending member 15 fluctuates per unit time due to thermal deformation of the member arranged in the internal space 16IN, the fluctuation does not occur. , It is offset by the supply amount control operation described above. Therefore, even if the member arranged in the internal space 16IN is thermally deformed, the supply rate of the modeling material M supplied from the material supply device 1 to the processing device 2 hardly fluctuates. Alternatively, the amount of fluctuation in the supply rate of the modeling material M supplied from the material supply device 1 to the processing device 2 is hardly so large as to affect the processing accuracy by the processing device 2. Therefore, the drive device 14 may be arranged in the internal space 16IN of the housing 16.

(4) Modification Example Next, a modification of the machining system SYS will be described. It should be noted that at least two of the plurality of modifications described below may be combined with each other.

(4-1) First Modified Example In the above description, the control device 7 controls the transport member 13 based on the actual supply amount of the modeling material M calculated based on the original image. On the other hand, in the first modification, the control device 7 repeatedly images the imaging target path from step S13 to step S15, based on the fact that the imaging device 8 repeatedly images the imaging target path at a constant imaging rate. Based on the plurality of original images obtained by the above, the actual supply amount of the modeling material M is calculated a plurality of times, and then the calculated value calculated by performing the calculation using the plurality of actual supply amounts is calculated. May be good. After that, the control device 7 may control the transport member 13 based on the calculated values of the plurality of actual supply amounts in steps S16 to S17. Specifically, the control device 7 calculates deviations from the target supply amount of the calculated values of the plurality of actual supply amounts in step S16, and controls the transport member 13 based on the calculated deviations in step S17. You may. That is, the control device 7 may control the transport member 13 based on the plurality of original images.

The average value is an example of the calculated value. In this case, the control device 7 may calculate the average value of the plurality of actual supply amounts, calculate the deviation of the calculated average value from the target supply amount, and control the transport member 13 based on the calculated deviation. .. Since the image pickup device 8 repeatedly images the image pickup target path at a constant image pickup rate, it can be said that the plurality of original images acquired by the control device 7 are time-series data. Therefore, the average value here may mean a moving average value.

Here, the fluctuation amount of the deviation of the average value of the actual supply amount with respect to the target supply amount is usually smaller than the fluctuation amount of the deviation of the actual supply amount itself with respect to the target supply amount. This is because the average value corresponds to a smoothed value of a plurality of actual supplies calculated as time series data based on a plurality of original images. Therefore, when such an average value of the actual supply amount is used, the variation in deviation becomes smaller than when the actual supply amount itself is used. As a result, the material supply device 1 can stably supply the processing device 2 with a fixed amount of the modeling material M required per unit time for the processing device 2 to form the three-dimensional structure ST. .. Alternatively, the material nozzle 212 can stably supply the work W with a fixed amount of the modeling material M required per unit time for the processing apparatus 2 to form the three-dimensional structure ST. As a result, the processing system SYS can form a highly accurate three-dimensional structure ST.

Furthermore, when the average value of the actual supply amount is used, it is caused by an error of the actual supply amount itself calculated based on the original image (that is, an error of the calculated value of the actual supply amount with respect to the true value of the actual supply amount). The impact is reduced. Specifically, as shown in FIG. 16, which is a cross-sectional view showing an image pickup device 8 that images the modeling material M passing through the imaging target path, the imaging device 8 looks at the modeling material M passing through the imaging target path. The modeling material M passing through the imaging target path is imaged from one direction. Further, as shown in FIG. 16, the modeling material M is supplied while being distributed so as to have a constant spread along a direction intersecting the supply direction (for example, the left-right direction of the paper surface in FIG. 16). Therefore, not all of the modeling material M passing through the image pickup target path is imaged by the image pickup apparatus 8. Specifically, at least one modeling material M in which another modeling material M exists between the modeling material M passing through the imaging target path and the imaging device 8 (specifically, it is shown by a dotted line in FIG. 16). The modeling material M) may not be imaged by the image pickup apparatus 8. Therefore, not all of the modeling material M passing through the imaging target path is reflected in the original image. As a result, the actual supply amount calculated based on the original image may be different from the actual supply amount of all the modeling materials M passing through the imaging target path. That is, the actual supply amount calculated based on the original image may have an error with respect to the true value of the actual supply amount. On the other hand, since the modeling material M continues to pass through the imaging target path during the period in which the imaging device 8 is imaging the imaging target path, the modeling material M that is not imaged by the imaging device 8 at a certain timing is different. There is a possibility that the image pickup device 8 will take an image at the timing. Then, the average value of the actual supply amount is more likely to approach the true value of the actual supply amount than the actual supply amount itself calculated based on the original image. Therefore, in the first modification, the control device 7 uses the average value of the actual supply amount, which is more likely to be closer to the true value of the actual supply amount than the actual supply amount itself calculated based on the original image. The transport member 13 can be controlled. As a result, the actual supply amount of the modeling material M supplied by the material supply device 1 corresponds to the constant amount of the modeling material M required per unit time for the processing device 2 to form the three-dimensional structure ST. It is more likely to get closer to the target supply. Similarly, the actual supply amount of the modeling material M supplied by the material nozzle 212 is a target according to a certain amount of modeling material M required per unit time for the processing apparatus 2 to form the three-dimensional structure ST. It is more likely to get closer to the supply. As a result, the processing system SYS can form a highly accurate three-dimensional structure ST.

Another example of the calculated value is at least one of the median value and the mode value. Even in this case, as in the case where the mean value is used, the fluctuation amount of the deviation of the median and the mode of the actual supply with respect to at least one target supply is usually the target of the actual supply itself. It is smaller than the fluctuation amount of the deviation with respect to the supply amount. Furthermore, when at least one of the actual supply amount and the mode value is used, the error of the actual supply amount itself calculated based on the original image (that is, the calculated value of the actual supply amount with respect to the true value of the actual supply amount). The effect caused by the error) is reduced. As a result, even when at least one of the median value and the mode value is used, the machining system SYS can form a highly accurate three-dimensional structure ST as in the case where the mean value is used. ..

(4-2) Second Modified Example In the above description, the image pickup apparatus 8 images the modeling material M passing through the supply path between the material supply source 1A and the material nozzle 212. That is, the image pickup apparatus 8 images the modeling material M passing through the supply path in the internal space 16IN of the housing 6. The imaging range IMA of the imaging device 8 includes a supply path of the modeling material M in the internal space 16IN. However, the imaging device 8 may image the modeling material M passing through the supply path between the material nozzle 212 and the work W. The image pickup apparatus 8 may take an image of the modeling material M passing through the supply path of the external space 16OUT of the housing 6. The imaging range IMA of the imaging device 8 may include a supply path of the modeling material M in the external space 16OUT. Hereinafter, an example of the image pickup apparatus 8 that images the modeling material M passing through the supply path between the material nozzle 212 and the work W will be described with reference to FIGS. 17 to 19. Each of FIGS. 17 to 19 is a cross-sectional view showing an example of an image pickup apparatus 8 that images a modeling material M passing through a supply path between the material nozzle 212 and the work W.

As shown in FIG. 17, the imaging device 8 may image the modeling material M passing through the supply path between the material nozzle 212 and the work W. The image pickup apparatus 8 may take an image of the modeling material M passing through the supply path between the supply port 214 of the material nozzle 212 and the work W. The image pickup apparatus 8 may take an image of the modeling material M heading from the material nozzle 212 to the work W. The imaging range IMA may include a supply path of the modeling material M between the material nozzle 212 and the work W. The imaging range IMA may include a supply path of the modeling material M between the supply port 214 of the material nozzle 212 and the work W.

In this case, considering that the material nozzle 212 and the work W are housed in the housing 6 as described above, the image pickup apparatus 8 images the modeling material M passing through the chamber space 63IN of the housing 6. May be good. The imaging device 8 may image the modeling material M passing through the supply path in the chamber space 63IN of the housing 6. The imaging range IMA may include a supply path of the modeling material M in the chamber space 63IN of the housing 6.

When the imaging device 8 images the modeling material M passing through the supply path in the chamber space 63IN, the housing 6 may have an opening 613. The opening 613 is a through hole that penetrates the partition wall member 61 from the chamber space 63IN toward the external space 64OUT. An observation window 6131 is fitted in the opening 613. When a gap is formed between the observation window 6131 and the partition member 61 with the observation window 6131 fitted in the opening 613, a seal member is formed in the gap between the observation window 6131 and the partition member 61. May be good. The observation window 6131 is a member through which visible light can pass (that is, is transparent to visible light). However, when the image pickup element of the image pickup apparatus 8 can detect light in a wavelength range different from the visible light wavelength range, the observation window 6131 uses light in a wavelength range different from the visible light wavelength range (particularly). It may be a member through which light in a wavelength range that can be detected by the image pickup element) can pass. The observation window 6131 is used for the imaging device 8 to image the modeling material M passing through the chamber space 63IN of the housing 6. Therefore, the image pickup apparatus 8 arranged in the external space 64OUT images the modeling material M passing through the supply path of the chamber space 63IN of the housing 6 through the observation window 6131. That is, the imaging device 8 can image the modeling material M passing through the imaging target path without being affected by the modeling material M. However, the image pickup apparatus 8 may be arranged in the chamber space 63IN.

Further, the housing 6 may be formed with an opening 614. The opening 614 is a through hole that penetrates the partition wall member 61 from the chamber space 63IN toward the external space 64OUT. An observation window 6141 may be fitted in the opening 614. When a gap is formed between the observation window 6141 and the partition member 61 with the observation window 6141 fitted in the opening 614, a seal member is formed in the gap between the observation window 6141 and the partition member 61. May be good. The observation window 6141 is a member through which visible light can pass (that is, is transparent to visible light). However, when the lighting device 9 emits light in a wavelength range different from the visible light wavelength range as the illumination light IL, the observation window 6141 emits light in a wavelength range different from the visible light wavelength range (particularly, illumination). It may be a member through which optical IL) can pass. The observation window 6141 is used for the lighting device 9 to illuminate the modeling material M passing through the chamber space 63IN of the housing 6 with the illumination light IL. As a result, the modeling material M passing through the supply path in the chamber space 63IN of the housing 6 is illuminated by the illumination light IL emitted from the lighting device 9 arranged in the external space 64OUT through the observation window 6141. That is, the illumination device 9 can irradiate the illumination light IL toward the modeling material M passing through the imaging target path without being affected by the modeling material M. That is, there is no possibility or low possibility that the modeling material M has an influence on the lighting device 9. However, the lighting device 9 may be arranged in the chamber space 63IN.

The positional relationship of the

openings

613 and 614 with respect to the supply path of the modeling material M may be the same as the positional relationship of the

openings

168 and 169 with respect to the supply path of the modeling material M described above. That is, the

openings

613 and 614 may be formed at positions separated from the supply path of the modeling material M in different directions. In this case, the lighting device 9 illuminates the modeling material M with the illumination light IL from a direction different from the direction in which the imaging device 8 images the modeling material M. Alternatively, the

openings

613 and 614 may be formed at positions separated from the supply path of the modeling material M in the same direction. In this case, the lighting device 9 illuminates the modeling material M with the illumination light IL from the same direction as the direction in which the imaging device 8 images the modeling material M.

When the modeling material M passing through the supply path between the material nozzle 212 and the work W is imaged by the image pickup apparatus 8, the modeling material M passing through the supply path between the material supply source 1A and the material nozzle 212 is imaged. Compared with the case where the image is taken by the apparatus 8, the actual supply amount of the modeling material M calculated based on the original image approaches the actual supply amount of the modeling material M supplied to the work W. This is because, in the example shown in FIG. 17, the modeling material M that was not actually supplied from the material nozzle 212 toward the work W even though it fell from the holding member 12 toward the material delivery member 15 is the imaging device 8. Will not be imaged by. Therefore, the actual supply amount of the modeling material M calculated based on the original image is actually supplied from the material nozzle 212 toward the work W even though it has fallen from the holding member 12 toward the material delivery member 15. Does not include the amount of modeling material M that was not present. Therefore, the actual supply amount of the modeling material M supplied by the material nozzle 212 is the target supply according to the constant amount of the modeling material M required per unit time for the processing apparatus 2 to form the three-dimensional structure ST. Get closer to the quantity. As a result, the processing system SYS can form a highly accurate three-dimensional structure ST.

As an example of the modeling material M that was not actually supplied from the material nozzle 212 toward the work W even though it fell from the holding member 12 toward the material delivery member 15, the holding member 12 sent the material to the material delivery member 15. The modeling material M that has spilled to the outside of the material delivery member 15 even though it has fallen toward it can be mentioned. As another example of the modeling material M that was not actually supplied from the material nozzle 212 toward the work W even though it fell from the holding member 12 toward the material delivery member 15, the holding member 12 sent the material to the material delivery member 15. Examples thereof include the modeling material M that has accumulated or is clogged inside the pipe connecting the material supply device 1 and the material nozzle 212 even though the material has fallen toward the material nozzle 212.

Further, as shown in FIG. 18, the image pickup apparatus 8 may take an image of the molten pool MP in addition to the modeling material M passing through the supply path between the material nozzle 212 and the work W. The imaging range IMA may include a supply path of the modeling material M between the material nozzle 212 and the work W, and a molten pool MP. When the molten pool MP is imaged by the imaging device 8 in this way, the actual supply amount of the modeling material M calculated based on the original image is melted as compared with the case where the molten pool MP is not imaged by the imaging device 8. It approaches the actual supply amount of the modeling material M supplied to the pond MP. This is because, in the example shown in FIG. 18, the control device 7 is supplied from the material nozzle 212 to the chamber space 63IN and then is actually supplied to the molten pool MP (that is, molten) based on the original image. The modeling material M) that melts in the pond MP and becomes a part of the three-dimensional structure ST, and the modeling that was supplied from the material nozzle 212 to the chamber space 63IN but was not actually supplied to the molten pool MP. It can be distinguished from the material M (that is, the modeling material M which does not become a part of the three-dimensional structure ST because it does not melt in the molten pool MP). Therefore, the control device 7 can calculate the actual supply amount of the modeling material M actually supplied to the molten pool MP based on the original image. Therefore, the actual supply amount of the modeling material M supplied to the molten pool MP is a target according to the constant amount of the modeling material M required per unit time for the processing apparatus 2 to form the three-dimensional structure ST. Closer to the supply. As a result, the processing system SYS can form a highly accurate three-dimensional structure ST.

When the actual supply amount of the modeling material M supplied from the material nozzle 212 to the molten pool MP matches the target supply amount, the actual supply amount of the modeling material M supplied from the material nozzle 212 to the molten pool MP is The machining system SYS can form a more accurate 3D structure ST as compared to the case where it does not match the target supply amount. Then, the operation of controlling the rotational state of the transport member 13 so that the actual supply amount of the modeling material M passing through the imaging target path described above matches the target supply amount is substantially the operation of controlling the rotation state from the material nozzle 212 to the molten pool. It may be regarded as equivalent to the operation of controlling the rotational state of the transport member 13 so that the actual supply amount of the modeling material M supplied to the MP matches the target supply amount.

The actual supply amount of the modeling material M supplied from the material nozzle 212 to the molten pool MP depends on the relative speed between the supply position (that is, the supply region MA) of the modeling material M supplied to the work W and the work W. And fluctuate. This is because, under the condition that the amount of the modeling material M supplied by the material nozzle 212 from the supply port 214 to the chamber space 63IN per unit time is constant, the speed at which the supply region MA moves with respect to the work W can be increased. The more, the shorter the time for the supply region MA to be located in a certain portion of the work W. That is, the faster the supply region MA moves with respect to the work W, the shorter the time for the modeling material M to be supplied to the molten pool MP formed in a certain portion of the work W. Therefore, the faster the supply region MA moves with respect to the work W, the smaller the amount of the modeling material M supplied to a certain portion of the work W per unit time. That is, the faster the supply region MA moves with respect to the work W, the smaller the amount of the modeling material M supplied per unit time to the molten pool MP formed in a certain portion of the work W. Therefore, in addition to or instead of controlling the rotational state (typically, rotational speed) of the transport member 13, the control device 7 is relative to the material nozzle 212 and the work W. By controlling the speed, the actual supply amount of the modeling material M supplied from the material nozzle 212 to the molten pool MP may be matched with the target supply amount. The control device 7 typically controls the relative speed between the work W and the supply region MA by controlling the speed at which the material nozzle 212 moves with respect to the work W using the head drive system 22. You may.

Since the molten pool MP is formed in a part of the work W, the image pickup apparatus 8 includes the molding material M passing through the supply path between the material nozzle 212 and the work W, and the molten pool of the work W. The portion where the MP is formed may be imaged. The imaging range IMA may include a supply path of the modeling material M between the material nozzle 212 and the work W, and a portion of the work W where the molten pool MP is formed. Further, since the modeling material M is supplied to the molten pool MP, in the image pickup apparatus 8, the modeling material M passing through the supply path between the material nozzle 212 and the work W and the modeling material M in the work W are The supplied portion (that is, the portion of the work W in which the supply region MA is set) may be imaged. The image pickup apparatus 8 may take an image of the modeling material M passing through the supply path between the material nozzle 212 and the work W and the portion of the work W reached by the modeling material M. The imaging range IMA includes a modeling material M passing through a supply path between the material nozzle 212 and the work W, and a portion of the work W to which the modeling material M is supplied (a portion reached by the modeling material M). You may be. In this case as well, the same effect as that that can be enjoyed when the molten pool MP is imaged by the imaging device 8 can be enjoyed.

Further, as shown in FIG. 19, the image pickup apparatus 8 may take an image of the modeling material M passing through the supply path between the material nozzle 212 and the work W, and at least a part of the material nozzle 212. The imaging range IMA may include a supply path of the modeling material M between the material nozzle 212 and the work W, and at least a portion of the material nozzle 212. The image pickup apparatus 8 may image the modeling material M passing through the supply path between the material nozzle 212 and the work W, and the supply port 214 of the material nozzle 212. The imaging range IMA may include a supply path of the modeling material M between the material nozzle 212 and the work W, and a supply port 214 of the material nozzle 212.

In the above-described examples of FIGS. 17 to 19, at least one of at least a part of the image pickup apparatus 8 and at least a part of the illumination apparatus 9 has a fixed relative positional relationship with the material nozzle 212. It may be provided. In other words, at least one of at least a part of the image pickup apparatus 8 and at least a part of the illumination apparatus 9 may be provided on the movable processing head 21.

(4-3) Third Modified Example In the above description, the control device 7 calculates the actual supply amount of the modeling material M passing through the image pickup target path based on the original image captured by the image pickup device 8. However, the control device 7 adds or replaces the actual supply amount of the modeling material M passing through the imaging target path based on the original image captured by the imaging device 8, and optionally the modeling material M passing through the imaging target path. The supply status of is calculated (that is, it may be calculated).

In this case, the control device 7 may control the rotational state of the transport member 13 in the same manner as the supply amount control operation described above, based on the calculated arbitrary supply state of the modeling material M. Alternatively, the control device 7 may control the operation of the processing system SYS based on the calculated arbitrary supply state of the modeling material M. For example, the control device 7 controls at least one of the processing device 2 (particularly, the irradiation optical system 211) and the light source 4 based on the calculated arbitrary supply state of the modeling material M, so that the processing light by the irradiation optical system 211 The injection mode of the EL may be controlled. For example, the control device 7 may control the movement mode of the processing head 21 by controlling the head drive system 22 based on the calculated arbitrary supply state of the modeling material M. For example, the control device 7 controls at least one of the processing device 2 (particularly, the material nozzle 212) and the material supply device 1 based on the calculated arbitrary supply state of the modeling material M, thereby supplying the modeling material M. May be controlled. Even when the actual supply amount of the modeling material M is calculated as described above, the control device 7 may control the operation of the processing system SYS based on the calculated actual supply amount of the modeling material M. ..

As an example of an arbitrary supply state, the supply direction of the modeling material M from the material nozzle 212 can be mentioned. In this case, as shown in FIG. 19 described above, the image pickup apparatus 8 provides a supply path of the modeling material M supplied from the material nozzle 212 to the work W and at least a part of the material nozzle 212 (particularly, the supply port 214). You may take an image. As a result, the control device 7 can calculate the supply direction (hereinafter, referred to as “actual supply direction”) of the modeling material M from the material nozzle 212 based on the original image captured by the image pickup device 8. Alternatively, based on the fact that the imaging device 8 repeatedly images the imaging target path at a constant imaging rate, the control device 7 determines the position of the modeling material M reflected in the plurality of original images corresponding to the time series data. By comparing, the moving direction of the modeling material M from the material nozzle 212 (hereinafter, referred to as “actual moving direction”) may be calculated. The moving direction of the modeling material M may be regarded as equivalent to the supply direction of the modeling material M.

When the actual supply direction of the modeling material M from the material nozzle 212 is calculated, the control device 7 controls the material nozzle 212 so that the actual supply direction of the modeling material M from the material nozzle 212 matches the target supply direction. The actual supply direction of the modeling material M from the above may be controlled. When the actual moving direction of the modeling material M from the material nozzle 212 is calculated, the control device 7 controls the material nozzle 212 so that the actual moving direction of the modeling material M from the material nozzle 212 coincides with the target moving direction. The actual moving direction of the modeling material M from the above may be controlled. Here, the target supply direction (target movement direction) is the supply direction (movement direction) of the modeling material M that can realize a state in which the modeling material M supplied from the material nozzle 212 reaches the irradiation position of the processing light EL. You may. The target supply direction (target movement direction) is the supply direction of the modeling material M that can realize a state in which the supply region MA of the modeling material M coincides with (or at least partially overlaps) the irradiation region EA of the processing light EL. The direction of movement) may be used.

The control device 7 may control the head drive system 22 in order to control the actual supply direction (actual movement direction, the same applies hereinafter) of the modeling material M. In this case, the control device 7 controls the actual supply direction of the modeling material M by controlling the position of the material nozzle 212 using the head drive system 22. For example, FIG. 20A is a cross-sectional view showing a processing system SYS in which the actual supply direction and the target supply direction do not match. In this case, the control device 7 uses the head drive system 22 so that the actual supply direction of the modeling material M coincides with the target supply direction, and the control device 7 uses the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, and the θY direction. And the position of the material nozzle 212 in at least one of the θZ directions may be controlled. Here, the position of the material nozzle 212 in at least one of the θX direction, the θY direction, and the θZ direction may be referred to as the posture of the material nozzle 212. That is, the control device 7 may control the posture of the material nozzle 212 by using the head drive system 22 so that the actual supply direction of the modeling material M coincides with the target supply direction. As a result, as shown in FIG. 20B, the actual supply direction of the modeling material M coincides with the target supply direction.

As shown in FIGS. 20A and 20B, when the position of the material nozzle 212 is controlled so that the actual supply direction that does not match the target supply direction matches the target supply direction, The relationship between the actual supply direction (actual movement direction) of the modeling material M and the posture of the work W changes. Therefore, the control device 7 sets the actual supply direction that does not match the target supply direction as the target supply direction by changing the relationship between the actual supply direction (actual movement direction) of the modeling material M and the posture of the work W. The head drive system 22 may be controlled so as to match.

Note that, in order to set the target supply direction, the imaging device 8 may image the molten pool MP as in the example shown in FIG. In this case, the control device 7 calculates the position of the molten pool MP from the imaging result of the molten pool MP imaged by the imaging device 8, and from the position of the supply port 214 of the material nozzle 212 to the calculated position of the molten pool MP. The direction may be set to the target supply direction. At this time, the material nozzle 212 may be imaged by the image pickup apparatus 8.

The control device 7 may control the gas supply device 5 in addition to or in place of the head drive system 22 in order to control the actual supply direction (actual movement direction, the same applies hereinafter) of the modeling material M. Specifically, the control device 7 may control the pressure and / or flow rate (typically, the flow rate per unit time) of the purge gas supplied by the gas supply device 5 to the material supply device 1. Since the material supply device 1 pumps the modeling material M to the material nozzle 212 using the purge gas and the modeling material M is supplied from the supply port 214 of the material nozzle 212 to the chamber space 63IN by the purge gas, the pressure of the purge gas and / Alternatively, when the flow rate changes, the momentum of the modeling material M supplied from the material nozzle 212 to the chamber space 63IN changes. As a result, the supply direction (movement direction) of the modeling material M from the material nozzle 212 changes.

As an example of an arbitrary supply state, the particle size of the modeling material M supplied from the material nozzle 212 can be mentioned. In this case, the control device 7 calculates and calculates the size (typically, a diameter such as a diameter or a radius) of the modeling material M reflected in the original image based on the original image captured by the image pickup device 8. The particle size of the modeling material M may be calculated based on the determined size. Since the particle size of the modeling material M is a parameter based on the size of the modeling material M (typically, a diameter such as a diameter or a radius), the size of the modeling material M is also an example of an arbitrary supply state. It can be said that there is. Therefore, the control device 7 may calculate the size of the modeling material M in addition to or instead of calculating the particle size of the modeling material M.

When the particle size (or size) of the modeling material M is calculated, the control device 7 may control the intensity of the processing light EL applied to the work W based on the calculated particle size. Specifically, the intensity of the processing light EL required to melt the modeling material M having a relatively coarse particle size (that is, a relatively large size) is usually relatively fine (that is, a relatively large size). It is higher than the strength of the processing light EL required to melt the modeling material M (which is relatively small in size). Therefore, as shown in FIG. 21, which is a graph showing an example of the correlation between the particle size of the modeling material M and the intensity of the processing light EL, the control device 7 increases the intensity of the processing light EL as the particle size of the modeling material M becomes coarser. The intensity of the processing light EL may be controlled so as to increase the value. In the control device 7, the intensity of the processing light EL when the modeling material M having the first particle size is supplied is the processing light EL when the modeling material M having a second particle size finer than the first particle size is supplied. The intensity of the processing light EL may be controlled so as to be higher than the intensity of. As a result, the processing system SYS can appropriately melt the modeling material M using the processing light EL. Therefore, the processing system SYS can form a relatively high-precision three-dimensional structure ST.

The control device 7 may control the light source 4 in order to control the intensity of the processing light EL. The control device 7 may control an intensity distribution control element (not shown) included in the irradiation optical system 211 in order to control the intensity of the processed light EL.

Even when the processing system SYS is controlled based on an arbitrary supply state of the modeling material M described in the third modification, the control device 7 still has a plurality of original images as described in the first modification. The supply state of the modeling material M is calculated a plurality of times based on the above, the calculated value calculated by performing the calculation using the plurality of supply states is calculated, and the processing system SYS is calculated based on the calculated values of the plurality of supply states. You may control it.

(4-4) Fourth Modified Example In the above description, the control device 7 feeds back the state of rotation of the transport member 13 that affects the actual supply amount of the modeling material M based on the actual supply amount of the modeling material M. I'm in control. In this case, the control device 7 may feedforward control the rotational state of the transport member 13 in addition to feedback-controlling the rotational state of the transport member 13. The feedforward control will be described below.

In order to perform feedforward control, the control device 7 learns the relationship between the control amount (specifically, the rotation speed) of the transport member 13 by feedback control and the actual supply amount of the modeling material M. Specifically, when the control device 7 sets the rotation speed of the transport member 13 to a target speed determined based on feedback control, what value does the actual supply amount of the modeling material M take (that is, which? How it changes). As a result, as shown in FIG. 22, the control device 7 can calculate the correlation between the control amount (specifically, the rotation speed) of the transport member 13 by feedback control and the actual supply amount of the modeling material M. it can.

The control device 7 feedforwards the rotational state of the transport member 13 based on the correlation between the control amount of the transport member 13 calculated based on the result of the feedback control and the actual supply amount of the modeling material M. Control. Specifically, the control device 7 calculates the target control amount (that is, the target speed) of the transport member 13 corresponding to the target supply amount of the modeling material M based on the calculated correlation. That is, the control device 7 calculates the target control amount (that is, the target speed) of the transport member 13 required to match the actual supply amount of the modeling material M with the target supply amount based on the calculated correlation. At this time, the control device 7 does not have to calculate the actual supply amount of the modeling material M based on the original image captured by the image pickup device 8. After that, the control device 7 controls the state of rotation of the transport member 13 so that the transport member 13 rotates with the calculated target control amount.

However, when the period during which the feedback control is performed is relatively short, the accuracy of the correlation between the control amount of the transport member 13 calculated based on the result of the feedback control and the actual supply amount of the modeling material M is high. May be relatively low. Therefore, the control device 7 may not be able to appropriately control the rotational state of the transport member 13 by feedforward control. Specifically, the control device 7 may not be able to match the actual supply amount of the modeling material M with the target supply amount only by controlling the rotational state of the transport member 13 by feedforward control. Therefore, the control device 7 may perform the feedback control and the feedforward control in parallel (typically, alternately) until a certain period of time elapses from the start of the feedback control. The control device 7 may perform feedforward control without performing feedback control after a certain period of time has elapsed from the start of feedback control. For a certain period of time, after the feedback control is started, the state of rotation of the transport member 13 can be appropriately controlled by the feedforward control alone (that is, the actual supply amount of the modeling material M is matched with the target supply amount. It may be set to a period required until it becomes possible or a period longer than the period.

Further, when the control device 7 learns the correlation between the control amount of the transport member 13 and the actual supply amount of the modeling material M, the control device 7 may learn the correlation in synchronization with the rotation cycle of the transport member 13. For example, the first-stage graph of FIG. 23 is a graph showing the actual supply amount of the modeling material M that periodically fluctuates in synchronization with the rotation cycle of the transport member 13 under the condition that the feedback control is not performed. .. In this case, as shown in the second graph of FIG. 23, the control device 7 rotates the transport member 13 so that the rotation speed of the transport member 13 periodically fluctuates in synchronization with the rotation cycle of the transport member 13. Feedback control of the state of. As a result, as shown in the graph in the third row of FIG. 23, the periodic fluctuation of the modeling material M synchronized with the rotation cycle of the transport member 13 is canceled out, and the actual supply amount of the modeling material M matches the target supply amount. To do. In this case, the control device 7 may learn the correlation between the control amount of the transport member by feedback control and the actual supply amount of the modeling material M in synchronization with the rotation cycle of the transport member 13. Typically, the control device 7 learns the correlation between the control amount of the transport member by feedback control and the actual supply amount of the modeling material M during the period of one rotation of the transport member 13 (that is, for one cycle). You may. In this case, the control device 7 rotates the transport member 13 at the rotation speed indicated by the learned correlation (that is, the rotation of the transport member 13 at the rotation speed indicated by the learned correlation) while the transport member 13 rotates once. The state of rotation of the transport member 13 may be feed-forward controlled so that the speed changes). That is, even if the control device 7 feedforward controls the rotation state of the transport member 13 so that the transport member 13 repeats the operation of rotating the transport member 13 at the rotation speed for one cycle indicated by the learned correlation. Good. As a result, even when the actual supply amount of the modeling material M fluctuates during a relatively short period of time, the control device 7 causes the transport member 13 so that the actual supply amount of the modeling material M matches the target supply amount. The state of rotation can be appropriately controlled.

An example of a situation in which the actual supply amount of the modeling material M fluctuates during a relatively short period will be described with reference to FIGS. 24 (a) to 24 (e). As described above, the modeling material M falls from the gap G formed between the holding member 12 and the conveying member 13 into the material sending member 15 (see FIG. 9). Here, since the shaft member 131 of the transport member 13 rotates to transport the modeling material M, the position of the gap G between the holding member 12 and the transport member 13 where the modeling material M spills is the position of the shaft member 131. It changes according to the rotation of. Specifically, the position of the gap G changes so that the gap G moves along a locus that rotates around the central axis of the shaft member 131. Therefore, the gap G may be located above the central axis of the shaft member 131, or the gap G may be located below the central axis of the shaft member 131. Note that FIG. 24A is a cross-sectional view showing how the modeling material M falls from the gap G located below the central axis of the shaft member 131. FIG. 24B is a front view showing how the modeling material M falls from the gap G located below the central axis of the shaft member 131. FIG. 24C is a cross-sectional view showing how the modeling material M falls from the gap G located above the central axis of the shaft member 131. FIG. 24D is a front view showing how the modeling material M falls from the gap G located above the central axis of the shaft member 131.

As described above, the gap G is a gap formed by the groove 132 at the supply port 124. Therefore, the state in which the gap G is located below the central axis of the shaft member 131 can be regarded as equivalent to the state in which the groove 132 is located below the central axis of the shaft member 131 at the supply port 124. Similarly, the state in which the gap G is located above the central axis of the shaft member 131 can be regarded as equivalent to the state in which the groove 132 is located above the central axis of the shaft member 131 at the supply port 124.

Here, the modeling material M falls from the holding member 12 to the material sending member 15 due to the action of gravity. Therefore, when the gap G is located below the central axis of the shaft member 131, it originally remains in the groove 132 due to the fact that the modeling material M has fallen from the gap G, and gradually from the gap G. The modeling material M to be dropped may collapse due to its own weight. As a result, when the gap G is located below the central axis of the shaft member 131, the gap G is larger than the gap G per unit time as compared with the case where the gap G is located above the central axis of the shaft member 131. There is a possibility that the amount of the molding material M that falls will increase.

Since the position of the gap G changes according to the rotation of the shaft member 131, the timing at which the gap G is located below the central axis of the shaft member 131 is the timing synchronized with the rotation of the shaft member 131. As a result, the timing at which the amount of the modeling material M that falls from the gap G per unit time becomes relatively large due to the gap G being located below the central axis of the shaft member 131 is also the timing of the shaft member 131. The timing is synchronized with the rotation of. FIG. 24E is a graph showing the amount of the modeling material M that falls from the gap G per unit time under the condition that the rotation speed of the conveying member 13 is constant (that is, the actual supply amount of the modeling material M). .. As shown in FIG. 24 (e), the actual supply amount of the modeling material M fluctuates periodically in synchronization with the rotation of the shaft member 131. That is, the amount of drop of the modeling material M fluctuates during a relatively short period synchronized with the rotation of the shaft member 131.

In the fourth modification, even when the actual supply amount of the modeling material M fluctuates during such a relatively short period, the control device 7 ensures that the actual supply amount of the modeling material M matches the target supply amount. In addition, the state of rotation of the transport member 13 can be appropriately controlled.

Although detailed description is omitted to avoid duplication of description, the position (posture) of the material nozzle 212 that affects the actual supply direction (actual movement direction) of the modeling material M based on the actual supply direction of the modeling material M. ) Is also fed back controlled, the control device 7 may feedforward control the position (posture) of the material nozzle 212. Even when the machining system SYS is feedback-controlled based on an arbitrary supply state of the modeling material M, the control device 7 may feedforward control the machining system SYS. That is, even when the processing system SYS is feedback-controlled based on an arbitrary supply state of the modeling material M, the control device 7 is provided with each device (that is, the material supply device 1, the processing device 2, and the light source 4) included in the processing system SYS. And at least one of the gas supply devices 5) may be feedforward controlled.

(4-5) Fifth Deformation Example In the above description, the processing head 21 includes one material nozzle 212. However, the processing head 21 may include a plurality of material nozzles 212. In this case, a plurality of supply paths of the modeling material M are formed between the plurality of material nozzles 212 and the work W, and the plurality of supply paths may be imaged by one imaging device 8.

FIG. 25 shows the configuration of the processing head 21 provided with a plurality of

material nozzles

212a and 212b. In FIG. 25, the processing head 21 is provided with an irradiation optical system 211, and a plurality of

material nozzles

212a and 212b and an imaging device 8 are arranged around the injection portion 213 of the irradiation optical system 211. .. The image pickup apparatus 8 images the modeling material M supplied (injected) from each of the plurality of

material nozzles

212a and 212b. Here, the imaging range IMA of the imaging device 8 includes a plurality of supply paths of the modeling material M between the plurality of material nozzles 212 and the work W. In the example of FIG. 25, the processing head 21 includes two

material nozzles

212a and 212b, but the number of material nozzles 212 is not limited to two, and the processing head 21 is made of three or more materials. The nozzle 212 may be provided.

In the example of FIG. 25, since the modeling material M is illuminated by the light from the molten pool MP, the processing system SYS does not have to be provided with the lighting device 9. For example, the lighting device 9 may not be provided on the processing head 21. However, also in the example shown in FIG. 25, the processing system SYS may include the lighting device 9. For example, the processing head 21 may be provided with the lighting device 9. In the example shown in FIG. 25, the optical axis AX211 of the irradiation optical system 211 and the optical axis AX8 of the imaging device 8 intersect on the work W, but the optical axis AX211 of the irradiation optical system 211 and the imaging device 8 The optical axis AX8 does not have to intersect on the work W. Further, in the example shown in FIG. 25, the imaging device 8 also images the molten pool MP, but the imaging device 8 does not have to image the molten pool MP. In the example shown in FIG. 25, the image pickup device 8 is provided so as to overlook the work W, but the optical axis AX8 of the image pickup device 8 may be provided so as to be substantially parallel to the surface of the work W. ..

Note that the plurality of supply paths of the modeling material M between the plurality of

material nozzles

212a and 212b and the work W may be imaged by the plurality of imaging devices 8, respectively.

(4-6) Other Modification Examples In the above description, the material supply device 1 supplies the modeling material M to the material nozzle 212 by using the rotating transport member 13. However, the material supply device 1 may have any structure as long as the modeling material M can be supplied to the material nozzle 212. For example, as described in the International Publication No. 2019/06571 pamphlet, the material supply device 1 may supply the modeling material M from the holding member 12 to the material delivery member 15 by vibrating the holding member 12. Good. In this case, the control device 7 may control the vibration state (for example, at least one of the amplitude and frequency of the vibration) of the holding member 12 so that the supply state of the modeling material M matches the desired state.

In the above description, the processing apparatus 2 melts the modeling material M by irradiating the modeling material M with the processing light EL. However, the processing apparatus 2 may melt the modeling material M by irradiating the modeling material M with an arbitrary energy beam. In this case, the processing device 2 may include a beam irradiation device capable of irradiating an arbitrary energy beam in addition to or in place of the irradiation optical system 211. Any energy beam includes, but is not limited to, a charged particle beam such as an electron beam, an ion beam, or an electromagnetic wave.

In the above description, the processing system SYS can form the three-dimensional structure ST by the laser overlay welding method. However, the processing system SYS can form the three-dimensional structure ST from the modeling material M by another method capable of forming the three-dimensional structure ST by irradiating the modeling material M with the processing light EL (or an arbitrary energy beam). It may be formed. Other methods include, for example, a powder bed melting bonding method (Power Bed Fusion) such as a powder sintering laminated molding method (SLS: Selective Laser Sintering), a binder jetting method (Binder Jetting), or a laser metal fusion method (LMF:). Laser Metal Fusion). Alternatively, the processing system SYS may use an arbitrary method for additional processing, which is different from the method capable of forming the three-dimensional structure ST by irradiating the modeling material M with the processing light EL (or an arbitrary energy beam). The three-dimensional structure ST may be formed.

An example of a processing system using the powder bed melt bonding method is described in US Patent Application Publication No. 2018/0370127. In this case, the image pickup device 8 is supplied below the powder discharge port (reference code: 12a) or the measuring device (reference code: 12b) of the storage container shown in FIG. 3 of US Patent Application Publication No. 2018/03701127. The modeling material passing through the path may be imaged. Further, the control device 7 may control the actual supply amount of the modeling material based on the original image captured by the image pickup device 8.

In the above description, the processing system SYS forms the three-dimensional structure ST by supplying the modeling material M from the material nozzle 212 toward the irradiation region EA where the irradiation optical system 211 irradiates the processing light EL. .. However, the processing system SYS may form the three-dimensional structure ST by supplying the modeling material M from the material nozzle 212 without irradiating the processing light EL from the irradiation optical system 211. For example, the processing system SYS melts the modeling material M on the modeling surface MS by spraying the modeling material M onto the modeling surface MS from the material nozzle 212, and solidifies the melted modeling material M. The three-dimensional structure ST may be formed. For example, the processing system SYS melts the modeling material M on the modeling surface MS and solidifies the molten modeling material M by blowing a gas containing the modeling material M onto the modeling surface MS from the material nozzle 212 at an ultra-high speed. By making it, the three-dimensional structure ST may be formed. For example, the processing system SYS melts the modeling material M on the modeling surface MS by spraying the heated modeling material M onto the modeling surface MS from the material nozzle 212, and solidifies the melted modeling material M. The three-dimensional structure ST may be formed. When the three-dimensional structure ST is formed without irradiating the processing light EL from the irradiation optical system 211 in this way, the processing system SYS (particularly, the processing head 21) does not have to include the irradiation optical system 211. Good.

In addition to or instead of the additional processing, the processing system SYS may perform a removal processing capable of removing at least a part of the object by irradiating an object such as a work W with a processing light EL (or an arbitrary energy beam). Good. Alternatively, the processing system SYS irradiates an object such as a work W with processing light EL (or an arbitrary energy beam) in addition to or in place of at least one of addition processing and removal processing to mark at least a part of the object. Marking processing capable of forming (for example, letters, numbers or figures) may be performed. Even in this case, the above-mentioned effects can be enjoyed.

In the above description, the processing system SYS capable of forming the three-dimensional structure ST from the modeling material M is provided with the material supply device 1. However, a processing system capable of performing a processing process using an arbitrary powder may include a material supply device 1 that supplies the arbitrary powder instead of the modeling material M. An example of such a processing system is a chemical manufacturing system that manufactures a pharmaceutical product from a granular or powdery raw material. In this case, the material supply device 1 supplies granular or powdery raw materials. Alternatively, an example of such a processing system is a food manufacturing system that manufactures food from granular or powdery raw materials. In this case, the material supply device 1 supplies granular or powdery raw materials. Alternatively, as an example of such a processing system, there is a recycling manufacturing system for manufacturing a PET bottle or a glass container (or various other products) from recycled pellets obtained by finely crushing a PET bottle or a glass container. In this case, the material supply device 1 supplies the regenerated pellets. Alternatively, as an example of such a processing system, there is an electronic product manufacturing system that manufactures an electronic product from minute parts. In this case, the material supply device 1 supplies minute parts.

At least a part of the constituent elements of each of the above-described embodiments can be appropriately combined with at least another part of the constituent requirements of each of the above-described embodiments. Some of the constituent requirements of each of the above embodiments may not be used. In addition, to the extent permitted by law, the disclosures of all published gazettes and US patents cited in each of the above embodiments shall be incorporated as part of the text.

The present invention is not limited to the above-described embodiment, and can be appropriately modified within the scope of claims and within the scope not contrary to the gist or idea of the invention that can be read from the entire specification. Control devices, control methods and computer programs are also included in the technical scope of the present invention.

SYSTEM processing system 1 Material supply device 2 Processing device 21 Processing head 211 Irradiation optical system 212 Material nozzle 22 Head drive system 31 Stage 7 Control device 8 Imaging device 9 Lighting device W work M Modeling material SL Structural layer MS Modeling surface EA Irradiation area MA Supply area MP melting pond EL processing light

Claims

It is a processing system that performs processing using powder.
A powder supply device that supplies the powder and
An imaging device that images the powder passing through the powder supply path, and
A processing system including a control device that controls the powder supply device based on an image of the powder captured by the image pickup device.
The processing system according to claim 1, wherein the control device obtains a supply state of the powder passing through the supply path based on an image of the powder.
The processing system according to claim 2, wherein the control device determines the supply amount of the powder passing through the supply path per unit time as the supply state.
3. The control device controls the powder supply device based on the obtained supply amount so that the supply amount of the powder passing through the supply path per unit time becomes a target amount. The processing system described in.
The powder supply device includes a powder supply member that supplies the powder toward the object from a powder supply port facing the object to be processed.
The imaging device images the powder from the powder supply port toward the object.
The processing system according to any one of claims 2 to 4, wherein the control device determines the supply direction of the powder from the supply port as the supply state.
The processing system according to claim 5, wherein the control device controls the powder supply device so that the supply direction of the powder from the supply port becomes a target direction based on the obtained supply direction. ..
The processing system according to any one of claims 2 to 6, wherein the control device determines the particle size of the powder passing through the supply path as the supply state.
An irradiation device for irradiating the powder with an energy beam is further provided.
The processing system according to claim 7, wherein the control device controls the intensity of the energy beam emitted from the irradiation device based on the obtained particle size.
An irradiation device for irradiating the powder with an energy beam is further provided.
The processing system according to any one of claims 1 to 8, wherein the control device controls the irradiation device based on an image of the powder.
A processing system that performs processing using an energy beam and powder.
An irradiation device that irradiates the energy beam and
A powder supply device that supplies the powder and
An imaging device that images the powder passing through the powder supply path, and
A processing system including a control device that controls the irradiation device based on an image captured by the image pickup device.
The processing system according to claim 10, wherein the control device obtains a supply state of the powder passing through the supply path based on an image of the powder.
The processing system according to claim 11, wherein the control device determines the particle size of the powder passing through the supply path as the supply state.
The processing system according to claim 12, wherein the control device controls the intensity of the energy beam emitted from the irradiation device based on the obtained particle size.
The processing system according to any one of claims 1 to 13, wherein the control device controls the supply amount of the powder passing through the supply path per unit time based on the image.
The imaging device images the supply path through which the powder passes a plurality of times.
The control device obtains a plurality of the supply states based on a plurality of images captured by the image pickup device, and controls the powder supply device based on the plurality of supply states. The processing system described in item 1.
The processing system according to claim 15, wherein the control device controls the powder supply device based on the average of the plurality of supply states.
The imaging device images the supply path through which the powder passes a plurality of times.
The control device obtains a plurality of the supply states based on a plurality of images captured by the image pickup device, and controls the irradiation device based on the plurality of supply states, any one of claims 8 to 13. The processing system described in.
The processing system according to claim 17, wherein the control device controls the irradiation device based on the average of the plurality of supply states.
A processing system that processes objects using powder.
A powder supply device that supplies the powder and
An imaging device that images the powder passing through the powder supply path, and
A position changing device that changes the positional relationship between the powder supply position supplied to the object and the object, and
A processing system including a control device that controls the position changing device based on an image of the powder imaged by the imaging device.
The processing system according to claim 19, wherein the control device obtains a supply state of the powder passing through the supply path based on an image of the powder.
The processing system according to claim 20, wherein the control device determines the supply amount of the powder passing through the supply path per unit time as the supply state.
The processing system according to claim 20 or 21, wherein the control device changes the relative speed between the supply position and the object based on the obtained supply state.
The powder supply device includes a powder supply member that supplies the powder toward the object from a powder supply port facing the object to be processed.
The imaging device images the powder from the powder supply port toward the object.
The processing system according to any one of claims 20 to 22, wherein the control device determines the moving direction of the powder from the supply port as the supply state.
23. The control device controls the position changing device so as to change the relationship between the moving direction of the powder from the supply port and the posture of the object based on the obtained moving direction. The processing system described in.
The powder supply device supplies the powder from a supply port and supplies the powder.
The processing system according to any one of claims 1 to 24, wherein the supply path includes a path of the powder from the supply port to an object to be processed.
When the supply port is used as the first supply port,
The powder supply device includes a powder supply member that supplies the powder toward the object from a second supply port facing the object to be processed, and the first powder supply member. 1. The processing system according to claim 25, which includes a powder supply source for supplying the powder from a supply port.
The powder supply device supplies the powder to a powder supply member that supplies the powder toward the object from a powder supply port facing the object to be processed. Including sources
The processing system according to any one of claims 1 to 26, wherein the image pickup apparatus images the powder passing between the powder supply source and the powder supply member.
The powder supplied from the powder source passes through the housing and passes through the housing.
The processing system according to claim 27, wherein the imaging device images the powder through an observation window formed in the housing.
The powder supply device includes a powder supply member that supplies the powder toward the object from a powder supply port facing the object to be processed.
The processing system according to any one of claims 1 to 28, wherein the image pickup apparatus images the powder from the powder supply member toward the object.
The processing system according to claim 29, wherein the imaging device images the powder supplied from the powder supply port and the supply position of the powder reaching the object.
The processing system processes the object by irradiating the powder with an energy beam to form a molten pool on the object.
The processing system according to claim 29 or 30, wherein the image pickup apparatus images the powder supplied from the powder supply port and the molten pool.
The processing system according to any one of claims 29 to 31, wherein the image pickup apparatus images the powder supplied from the powder supply port and at least a part of the powder supply member.
The processing system according to any one of claims 29 to 32, wherein the imaging device images the powder supplied from the powder supply port and the powder supply port.
The processing system according to any one of claims 1 to 33, further comprising an illumination device that illuminates the powder passing through the supply path with illumination light.
The processing system according to claim 34, wherein the illumination device irradiates the illumination light toward the image pickup apparatus.
The control means include (i) a first supply control for controlling the powder supply device based on the image of the powder, and (ii) a control amount of the powder supply device by the first supply control. The relationship with the supply state is calculated, the target supply control amount for maintaining the supply state in the desired supply state is calculated based on the calculated relationship, and the powder is calculated based on the calculated target supply control amount. The processing system according to any one of claims 1 to 35, which performs a second supply control for controlling a body supply device.
The control means performs the first supply control and the second supply control in parallel at least a part of the period during which the supply state cannot be maintained in the desired supply state by the second supply control alone. The processing system according to claim 36.
The control means performs the second supply control without performing the first supply control for at least a part of the period during which the supply state can be maintained in the desired supply state by the second supply control alone. The processing system according to claim 36 or 37.
The control means include (i) a first irradiation control for controlling the irradiation device based on the image of the powder, and (ii) a controlled amount of the irradiation device and the energy beam by the first irradiation control. The relationship with the irradiation state is calculated, the target irradiation control amount for maintaining the irradiation state in the desired irradiation state is calculated based on the calculated relationship, and the irradiation device is based on the calculated target irradiation control amount. The processing system according to any one of claims 8 to 13 and 17 to 18, which performs a second irradiation control for controlling the above.
The control means performs the first irradiation control and the second irradiation control in parallel for at least a part of the period during which the irradiation state cannot be maintained in the desired irradiation state by the second irradiation control alone. The processing system according to claim 39.
A claim that the control means performs the second irradiation control without performing the first irradiation control for at least a part of a period during which the irradiation state can be maintained in the desired irradiation state by the second control alone. Item 39 or 40.
It is a processing system that performs processing using powder.
A powder supply device that supplies the powder and
An imaging device that images the powder passing through the powder supply path, and
A processing system including a receiving device that receives a control signal from a control device that generates a control signal for controlling the powder supply device based on an image of the powder imaged by the imaging device.
A processing system that performs processing using an energy beam and powder.
An irradiation device that irradiates the energy beam and
A powder supply device that supplies the powder and
An imaging device that images the powder passing through the powder supply path, and
A processing system including a receiving device that receives a control signal from a control device that generates a control signal for controlling the irradiation device based on an image of the powder imaged by the imaging device.
A processing system that processes objects using powder.
A powder supply device that supplies the powder and
An imaging device that images the powder passing through the powder supply path, and
A position changing device that changes the positional relationship between the powder supply position supplied to the object and the object, and
A processing system including a receiving device that receives a control signal from a control device that generates a control signal for controlling the position changing device based on an image of the powder imaged by the imaging device.
A control device that controls a processing system that performs processing using powder.
The processing system includes a powder supply device that supplies the powder.
A control device that controls the powder supply device based on an image of the powder obtained by imaging the powder passing through the powder supply path.
A control device that controls a processing system that performs processing using an energy beam and powder.
The processing system includes an irradiation device that irradiates the energy beam and a powder supply device that supplies the powder.
A control device that controls the irradiation device based on an image of the powder obtained by imaging the powder passing through the powder supply path.
A control device that controls a processing system that processes objects using powder.
The processing system includes a powder supply device that supplies the powder, and a position change device that changes the positional relationship between the powder supply position supplied to the object and the object.
A control device that controls the position changing device based on an image of the powder obtained by imaging the powder passing through the powder supply path.
It is a control method that controls a processing system that performs processing using powder.
The processing system includes a powder supply device that supplies the powder.
To acquire an image of the powder obtained by imaging the powder passing through the powder supply path, and
A control method including controlling the powder supply device based on the image of the powder.
It is a control method that controls a processing system that performs processing using an energy beam and powder.
The processing system includes an irradiation device that irradiates the energy beam and a powder supply device that supplies the powder.
To acquire an image of the powder obtained by imaging the powder passing through the powder supply path, and
A control method including controlling the irradiation device based on an image of the powder.
It is a control method that controls a processing system that processes an object using powder.
The processing system includes a powder supply device that supplies the powder, and a position change device that changes the positional relationship between the powder supply position supplied to the object and the object.
To acquire an image of the powder obtained by imaging the powder passing through the powder supply path, and
A control device including controlling the position changing device based on an image of the powder.
A computer program executed by a computer that controls a processing system that performs processing using powder.
The processing system includes a powder supply device that supplies the powder.
The computer program is attached to the computer.
To acquire an image of the powder obtained by imaging the powder passing through the powder supply path, and
A computer program that controls and executes the powder supply device based on the image of the powder.
A computer program executed by a computer that controls a processing system that performs processing using an energy beam and powder.
The processing system includes an irradiation device that irradiates the energy beam and a powder supply device that supplies the powder.
The computer program is attached to the computer.
To acquire an image of the powder obtained by imaging the powder passing through the powder supply path, and
A computer program that controls and executes the irradiation device based on the image of the powder.
A computer program executed by a computer that controls a processing system that processes an object using powder.
The processing system includes a powder supply device that supplies the powder, and a position change device that changes the positional relationship between the powder supply position supplied to the object and the object.
The computer program is attached to the computer.
To acquire an image of the powder obtained by imaging the powder passing through the powder supply path, and
A computer program that controls and executes the position changing device based on an image of the powder.