WO2020134038A1 - Control method for storage device, storage device, and electronic device - Google Patents

Control method for storage device, storage device, and electronic device Download PDF

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Publication number
WO2020134038A1
WO2020134038A1 PCT/CN2019/096435 CN2019096435W WO2020134038A1 WO 2020134038 A1 WO2020134038 A1 WO 2020134038A1 CN 2019096435 W CN2019096435 W CN 2019096435W WO 2020134038 A1 WO2020134038 A1 WO 2020134038A1
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WIPO (PCT)
Prior art keywords
storage unit
target
pin
controller
control method
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PCT/CN2019/096435
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French (fr)
Chinese (zh)
Inventor
林前锋
郭丹
邓恩华
李志雄
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深圳市江波龙电子股份有限公司
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Publication of WO2020134038A1 publication Critical patent/WO2020134038A1/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/06Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
    • G06F3/0601Interfaces specially adapted for storage systems
    • G06F3/0628Interfaces specially adapted for storage systems making use of a particular technique
    • G06F3/0655Vertical data movement, i.e. input-output transfer; data movement between one or more hosts and one or more storage devices
    • G06F3/0659Command handling arrangements, e.g. command buffers, queues, command scheduling
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F12/00Accessing, addressing or allocating within memory systems or architectures
    • G06F12/02Addressing or allocation; Relocation
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/06Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/06Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
    • G06F3/0601Interfaces specially adapted for storage systems
    • G06F3/0668Interfaces specially adapted for storage systems adopting a particular infrastructure
    • G06F3/0671In-line storage system
    • G06F3/0673Single storage device
    • G06F3/0679Non-volatile semiconductor memory device, e.g. flash memory, one time programmable memory [OTP]

Definitions

  • the disclosed embodiments of the present invention relate to the field of storage technology, and more specifically, to a storage device control method, storage device, and electronic device.
  • solid-state storage devices have become an important choice for different electronic devices with high speed and small size, such as computers and smart phones.
  • a certain memory device is usually controlled through different chip select pins.
  • chip select pin 1 is connected to one memory device A
  • chip select pin 2 is connected to another memory device A, that is, different chip select pins control the same type of memory device.
  • the storage devices are all of the same type, and each storage device has the same capacity, which is prone to waste capacity, and each storage device has the same type, and packaging space is prone to waste during packaging happening.
  • the present invention provides a control method of a storage device, a storage device, and an electronic device to solve the above technical problems.
  • a control method of a storage device includes a controller and at least two types of storage units.
  • the controller is electrically connected to each of the storage units.
  • the control method includes determining a target storage unit to which the operation instruction acts in response to the operation instruction. And calling the control command corresponding to the target model according to the determined target model of the target storage unit; and executing the operation instruction on the target storage unit according to the control command corresponding to the target model.
  • a storage device includes: at least one controller; and at least two storage units communicatively connected to the at least one controller; wherein the storage unit stores instructions executable by the at least one controller, and the instructions are The at least one controller executes to enable the at least one controller to execute the control method described in the first aspect.
  • an electronic device includes the storage device in the second aspect.
  • the storage device includes at least two types of storage units, and by determining the target storage unit to which the operation instruction acts, and then according to the target storage unit's target model, the corresponding control instruction is invoked, so that according to the control instruction, The operation instructions are executed on the target storage unit to control different types of storage units to operate, and to combine different types of storage units.
  • FIG. 1 is a schematic diagram of a storage device according to an embodiment of the present invention.
  • FIG. 2 is a flowchart of a storage device control method according to an embodiment of the present invention.
  • FIG. 3 is a flowchart of a storage device control method according to another embodiment of the present invention.
  • FIG. 4 is a schematic view of the state of the storage device in FIG.
  • FIG. 5 is a flowchart of a storage device control method according to another embodiment of the present invention.
  • FIG. 6 is a schematic diagram of the state of the storage device in FIG. 1.
  • FIG. 7 is a schematic diagram of the state of the storage device in FIG.
  • FIG. 8 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
  • the storage device 100 includes but is not limited to SD (Secure Digital Memory Card) card, TF (Trans-flash Card) card, MMC (Multi-Media Card) card, EMMC (Embedded Multi Media Card) card, EMCP (Embedded Multi-Chip Package) card, CF (Compact Flash) card, U disk (USB Flash) Drive, SSD (Solid State Drive, Solid State Drive).
  • SD Secure Digital Memory Card
  • TF Trans-flash Card
  • MMC Multi-Media Card
  • EMMC Embedded Multi Media Card
  • EMCP Embedded Multi-Chip Package
  • CF Compact Flash
  • U disk USB Flash
  • SSD Solid State Drive, Solid State Drive
  • the storage device 100 includes a controller 110 and at least two types of storage units, wherein the controller 110 is electrically connected to each storage unit.
  • each memory cell is an independent memory die.
  • the storage unit may be a NAND Flash chip.
  • the model can be one or any combination of storage unit type, manufacturer, manufacturing process, capacity and communication protocol.
  • the storage unit type includes but is not limited to SLC, MLC, TLC, QLC, and in the case of stacking classification, the storage unit type includes but not Limited to 2D Nand and 3D Nand.
  • the manufacturer refers to the manufacturer of the storage unit
  • the manufacturing process refers to the manufacturing process for manufacturing the storage unit
  • the capacity refers to the storage capacity of the storage unit
  • the communication protocol refers to the communication protocol adopted by the storage unit, and the adopted communication protocols include but not Limited to one of SD protocol, eMMC protocol, UFS protocol, SATA, PCIe, NVMe, etc.
  • the controller 110 includes at least one chip select pin, for example, a chip select pin 111a and/or a chip select pin 112a, and each chip select pin is electrically connected to at least one memory unit.
  • the storage device 100 includes a storage unit 1211 and a storage unit group 122.
  • the storage unit group 122 includes storage units 1221-122n, wherein the chip select pin 111a is electrically connected to the storage unit 1211, and the chip select pin 112a is connected to the storage The unit group 122 is electrically connected.
  • the storage units 1211 and the storage units 1221-122n in the storage unit group 122 have different models.
  • the storage capacity of the storage units 1221-122n is 512M
  • the storage capacity of the storage unit 1211 is 1G
  • the controller 110 includes at least two chip select pins, for example, a chip select pin 111a and a chip select pin 112a, etc., each chip select pin is electrically connected to at least one memory unit, and then the controller 110 is electrically connected to each storage unit.
  • the storage unit 1211 is connected to the chip selection pin 111a
  • the storage unit group 122 is connected to the chip selection pin 112a.
  • the number of storage units electrically connected to each chip selection pin is different, that is, the chip selection pin 111a is electrically connected to one memory cell 1211, and the chip select pin 112a is electrically connected to a plurality of memory cells 1221-122n.
  • the number of memory cells electrically connected to each chip select pin may be the same, for example, the number of memory cells electrically connected to each chip select pin may be equal to 1, that is, each chip select pin is One storage unit is electrically connected.
  • the controller 110 also includes a command pin 111b, an address pin 111c, and several data pins 111d.
  • the storage unit group such as the storage unit group 122, is also connected to the command pin 111b, the address pin 111c, and several data pins 111d, that is, each storage unit in the storage unit group 122 is also connected to the command Pin 111b, address pin 111c and several data pins 111d are connected.
  • the number of data pins 111d is 8.
  • FIG. 1 Although only two types of storage units are shown in FIG. 1, in other embodiments, storage units of other types are also included. Meanwhile, in the controller 110 in FIG. 1, for clarity and conciseness, several data pins 111d are represented by one dot.
  • FIG. 2 it is a flowchart of a storage device control method according to an embodiment of the present invention.
  • the execution subject of the control method 200 is the controller 110 in FIG. 1.
  • the control method 200 includes:
  • Step 210 In response to the operation instruction, determine the target storage unit to which the operation instruction acts, and call the control command corresponding to the target model according to the determined target model of the target storage unit.
  • the target storage unit refers to a storage unit that the controller 110 is about to perform related operations on, for example, a storage unit to which the controller 110 reads, writes, erases, garbage collects, idles fast acceleration, etc.
  • the target storage unit refers to the object that the operation instruction is about to act on.
  • the operation instructions include operation instructions issued by the host and operation instructions generated by the controller executing its own internal firmware.
  • the control method 200 further includes: receiving the operation instruction issued by the host.
  • the controller 110 stores control commands of different types of storage units. After determining the target type of the target storage unit, the corresponding control commands are called.
  • Step 220 Perform an operation instruction on the target storage unit according to the control command corresponding to the target model.
  • the controller 110 After calling the control command corresponding to the target model, the controller 110 executes an operation instruction on the target storage unit according to the control command.
  • the storage device includes at least two types of storage units.
  • the corresponding control instruction is called, so that according to the control instruction, the The target storage unit executes operation instructions, controls different types of storage units to operate, and realizes combining different types of storage units.
  • the target storage unit when the target storage unit is the storage unit 1211, only one storage unit 1211 is connected to the chip select 111a.
  • FIG. 3 it is a flowchart of a control method of a storage device according to another embodiment of the present invention. The control method is based on the control method 200 of the foregoing embodiment, and the same parts are not repeated here. Among them, as shown in FIG. 3, the target storage unit for determining the operation instruction includes:
  • Step 310 Send a chip selection instruction to the storage unit electrically connected to each chip selection pin to select the target storage unit.
  • the target storage unit refers to a storage unit to which the controller 110 will perform related operations, for example, a storage unit to which the controller 110 reads, writes, erases, garbage collects, idles fast acceleration, and the like.
  • the target storage unit refers to the object that the operation instruction is about to act on.
  • the chip selection instruction includes voltage information of each chip selection pin, and each storage unit determines whether it is a target storage unit according to the voltage information.
  • step 310 includes: lowering the voltage of the target chip select pin connected to the target storage unit; and raising the voltage of other chip select pins except the target chip select pin, to Select the target storage unit.
  • the target storage unit is the storage unit 1211
  • the controller 110 pulls down the target chip select pin 111a, and pulls up other chip select pins, for example, the chip select pin 112a.
  • the storage unit 1211 is selected (gray in the figure indicates that it is selected).
  • the chip select instruction includes a signal with a low level. In other words, the controller 110 pulls down the voltage of the chip select pin.
  • the target storage unit in a case where the target storage unit is only one storage unit electrically connected to a certain chip selection pin, by sending only a chip selection instruction to select the target storage unit, the target storage unit can be determined.
  • At least one memory cell connected to each chip select pin constitutes a memory cell group, that is, a memory cell 1211 electrically connected to the chip select pin 111a constitutes a memory cell Group, memory cells 1221-122n electrically connected to the chip select pins 112a constitute a memory cell group 122.
  • the following uses the target storage unit group as the storage unit group 122 as an example for illustration. The following description also applies to the case where the target storage unit group is the storage unit group composed of the storage units 1211.
  • the target storage unit is a storage unit in the storage unit group 122, as shown in FIG.
  • the target storage unit for determining the operation instruction includes:
  • Step 510 Send a chip selection instruction to each storage unit group to select all storage units in the target storage unit group.
  • the target storage unit refers to a storage unit on which the controller 110 is about to perform related operations, for example, a storage unit to which the controller 110 reads, writes, erases, garbage collects, and idles fast acceleration.
  • the target storage unit refers to the object that the operation instruction is about to act on.
  • the target storage unit group refers to a combination of all storage units electrically connected to the chip select pins electrically connected to the target storage unit, that is, the storage unit group where the "target storage unit" is located is the target storage unit group.
  • the storage units in the storage unit group have the same model number. Therefore, the other storage units in the target storage unit group are the same as the target model of the target storage unit, that is, the other storage units in the target storage unit group are also The target model.
  • the chip selection instruction includes voltage information of each chip selection pin, and the storage unit/storage unit group judges whether it is the target storage unit/target storage unit group according to the voltage information.
  • the target storage unit group is the storage unit group 122
  • the controller 110 sends the chip selection instruction to the storage unit group 122.
  • the storage unit group 122 receives the chip selection instruction, and judges that it is the target storage unit group. As shown in FIG. 6, the storage units 1221-122n in the storage unit group 122 are selected (gray in the figure indicates that they are selected).
  • step 510 includes: lowering the voltage of the target chip select pin electrically connected to the target memory cell group; and raising the voltage of other chip select pins except the target chip select pin to select All storage units in the target storage unit group.
  • the target memory cell group is the memory cell group 122
  • the chip select pin 112a electrically connected to the memory cell group 122 is the target chip select pin
  • the controller 110 pulls down the target chip select pin 112a and pulls Other chip select pins are higher, for example, the chip select pin 111a.
  • the storage units 1221-122n in the storage unit group 122 are selected (gray in the figure indicates being selected). Conversely, if the target chip select pin 112a is pulled up, the target memory cell group 122 is cancelled.
  • the chip select instruction includes a signal with a low level.
  • the controller 110 pulls down the voltage of the target chip select pin.
  • Step 520 Send a notification command to the target storage unit group to notify all storage units in the target storage unit group that a target storage unit selection will be made.
  • the target storage unit group is the storage unit group 122.
  • the storage units 1221-122n in the storage unit group 122 are selected, and then, the controller 110 sends a notification to the target storage unit group 122 In response, the controller 110 notifies the storage units 1221-122n in the target storage unit group 122 that a target storage unit selection will be made.
  • step 520 includes: raising the voltage of the command pin and lowering the voltage of the address pin; sending a notification command to the target storage unit group through the data pin.
  • the controller 110 pulls up the voltage of the command pin 111b and pulls down the voltage of the address pin 111c, and then sends a notification command to the target storage unit group 122 through the data pin 111d.
  • the target storage unit group The storage units 1221-122n in 122 receive the notification command and learn that the target storage unit will be selected.
  • the controller 110 pulls up the voltage of the command pin 111b, that is, sends a signal of high level to the command pin 111b, in other words, the controller 110 pulls up the command pin 111b. In one example, the controller 110 pulls down the voltage of the address pin 111c, that is, sends a signal of low level to the address pin 111c. In other words, the controller 110 pulls down the address pin 111c.
  • the notification command occupies 1 bit.
  • the notification command is 00000000, it means to notify the target storage unit group to select the target storage unit, or when the command bit is 00000001, it means to notify the target storage unit group to select the target storage unit.
  • Step 530 Send an address command to the target storage unit group to select the target storage unit.
  • the address command includes the address of the target storage unit, so that the storage unit in the target storage unit group determines whether it is the target storage unit according to the address.
  • the controller 110 after sending a notification command to the target storage unit group 122, the controller 110 notifies the storage units 1221-122n in the target storage unit group 122 that the selection of the target storage unit will be performed. Subsequently, the controller 110 sends an address command to the target storage unit group 122. At this time, the storage units 1221-122n in the target storage unit group 122 respectively receive the address command and determine whether they are selected according to the address information in the address command, that is, the storage unit 1221 in the target storage unit group 122 -122n judges whether it is the target storage unit according to the address command. As shown in FIG. 7, assuming that the storage unit 1221 is a target storage unit, the storage unit 1221 determines that it is a target storage unit according to the address command.
  • step 530 includes: lowering the voltage of the command pin and raising the voltage of the address pin; sending an address command to the target storage unit group through the data pin to select the target according to the address information contained in the address command Storage unit.
  • the controller 110 pulls down the voltage of the command pin 111b and the voltage of the address pin 111c, and then sends an address command to the target storage unit group 122 through the data pin 111d.
  • the target storage unit group The storage units 1221-122n in 122 receive the address command and determine whether they are selected according to the address information in the address command, that is, the storage units 1221-122n determine whether they are the target storage unit according to the address command. As shown in FIG. 7, assuming that the storage unit 1221 is a target storage unit, the storage unit 1221 determines that it is a target storage unit according to the address command.
  • the controller 110 pulls up the voltage of the address pin 111c, that is, sends a signal of high level to the address pin 111c, in other words, the controller 110 pulls up the address pin 111c. In one example, the controller 110 pulls down the voltage of the command pin 111b, that is, sends a signal of low level to the command pin 111b, in other words, the controller 110 pulls down the command pin 111b.
  • the address command occupies 1 bit.
  • the target storage unit group is the storage unit group 122
  • the storage unit group 122 includes two storage units, for example, the storage unit 1221 and the storage unit 1222
  • the address of the storage unit 1221 is 00000000
  • the address of the storage unit 1222 is 00000001.
  • the address in the received address command is 00000000
  • the address in the received address command is 00000001, it indicates that the storage unit 1222 is selected.
  • the storage unit group 122 includes three storage units, namely, storage unit 1221, storage unit 1222, and storage unit 1223.
  • the address of storage unit 1221 is 00000000; the address of storage unit 1222 is 00000001; the address of storage unit group 1223 Is 00000010. If the address in the received address command is 00000000, it means that the storage unit 1221 is selected; if the address in the received address command is 00000001, it means that the storage unit 1222 is selected; if the address in the received address command is 00000010 indicates that the storage unit 1223 is selected.
  • the target storage unit group is determined by sending a chip select instruction, Send a notification command to the target storage unit group to notify the storage unit in the target storage unit group that the target storage unit will be selected, and send the address command to the target storage unit group to select the target storage unit to achieve one chip select control for multiple identical Model storage unit.
  • the target storage unit group When there is only one target storage unit, that is, when there is only one storage unit whose model is the target signal, similarly, by sending a chip select instruction, the target storage unit group is determined, and a notification command is sent to the target storage unit group to notify the target storage
  • the storage unit in the unit group will select the target storage unit, and send the address command to the target storage unit group, select the target storage unit, and realize a chip select to control multiple storage units of the same model.
  • the invention also provides a storage device.
  • the storage device includes at least one controller and at least two storage units communicatively connected to the at least one controller, the storage unit stores instructions executable by the at least one controller, and the instructions are stored by the at least one controller Execution to enable at least one controller to execute the control method of the above embodiment.
  • the storage device is the storage device 100 in the foregoing embodiment, that is, the storage device 100 in FIG. 1.
  • at least one controller includes a controller 110. For details, see the foregoing embodiment. No longer.
  • the present invention also provides an electronic device.
  • the electronic device 800 may be a computer, a smart phone, a tablet computer, a camera, a video camera, a set-top box, a smart home, or an in-vehicle electronic product.
  • the electronic device 800 includes the storage device in the foregoing embodiment, that is, the storage device 100 in FIG. 1.
  • the storage device 100 in FIG. 1 For a detailed description, refer to the foregoing embodiment, and details are not described herein again.

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Abstract

A control method for a storage device, the storage device, and an electronic device. The storage device (100) comprises a controller (110) and at least two models of storage units (1211, 122), and the controller is electronically connected to all of the storage units. The control method (200) comprises: in response to an operation instruction, determining a target storage unit affected by the operation instruction, and calling, according to a target model of the determined target storage unit, a control command corresponding to the target model (210); and executing the operation instruction on the target storage unit according to the control command corresponding to the target model (220). According to the solution, the combination of different types of storage units is implemented.

Description

一种存储设备的控制方法及存储设备、电子设备Control method of storage equipment, storage equipment and electronic equipment 【技术领域】【Technical field】
本发明的所公开实施例涉及存储技术领域,且更具体而言,涉及一种存储设备的控制方法及存储设备、电子设备。The disclosed embodiments of the present invention relate to the field of storage technology, and more specifically, to a storage device control method, storage device, and electronic device.
【背景技术】【Background technique】
在存储技术领域中,固态存储设备以高速率、体积小等特点成为不同电子设备的重要选择,例如,计算机、智能手机等。目前固态存储设备中,通常通过不同的片选引脚控制某种存储器件。例如,片选引脚1与一个存储器件A连接,片选引脚2与另一存储器件A,即不同的片选引脚控制同一种类的存储器件。然而,对于一个固态存储设备而言,其中的存储器件均为同一类型,每个存储器件的容量相同,容易产生容量浪费,并且每个存储器件的类型相同,在封装时容易出现封装空间浪费的情况。In the field of storage technology, solid-state storage devices have become an important choice for different electronic devices with high speed and small size, such as computers and smart phones. In current solid-state storage devices, a certain memory device is usually controlled through different chip select pins. For example, chip select pin 1 is connected to one memory device A, and chip select pin 2 is connected to another memory device A, that is, different chip select pins control the same type of memory device. However, for a solid-state storage device, the storage devices are all of the same type, and each storage device has the same capacity, which is prone to waste capacity, and each storage device has the same type, and packaging space is prone to waste during packaging Happening.
【发明内容】[Invention content]
有鉴于此,本发明提出了一种存储设备的控制方法及存储设备、电子设备,以解决上述技术问题。In view of this, the present invention provides a control method of a storage device, a storage device, and an electronic device to solve the above technical problems.
根据本发明的第一方面,提供了一种存储设备的控制方法。存储设备包括控制器以及至少两种型号的存储单元,所述控制器与每个所述存储单元电连接,所述控制方法包括响应于操作指令,确定所述操作指令所作用的目标存储单元,并根据所确定的目标存储单元的目标型号,调用所述目标型号所对应的控制命令;以及根据所述目标型号所对应的控制命令,对所述目标存储单元执行操作指令。According to a first aspect of the present invention, a control method of a storage device is provided. The storage device includes a controller and at least two types of storage units. The controller is electrically connected to each of the storage units. The control method includes determining a target storage unit to which the operation instruction acts in response to the operation instruction. And calling the control command corresponding to the target model according to the determined target model of the target storage unit; and executing the operation instruction on the target storage unit according to the control command corresponding to the target model.
根据本发明的第二方面,提供了一种存储设备。存储设备包括:至少一个控制器;以及与所述至少一个控制器通信连接至少两个存储单元;其中,所述存储单元存储有可被所述至少一个控制器执行的指令,所述指令被所述至少一个控制器执行,以使所述至少一个控制器能够执行第一方面中所述的控制方法。According to a second aspect of the invention, a storage device is provided. The storage device includes: at least one controller; and at least two storage units communicatively connected to the at least one controller; wherein the storage unit stores instructions executable by the at least one controller, and the instructions are The at least one controller executes to enable the at least one controller to execute the control method described in the first aspect.
根据本发明的第三方面,提供了一种电子设备。该电子设备包括第二方面中的存储设备。According to a third aspect of the invention, an electronic device is provided. The electronic device includes the storage device in the second aspect.
本发明的有益效果有:存储设备包括至少两种型号的存储单元,通过确定操作指令所作用的目标存储单元,进而根据目标存储单元的目标型号,调用相应的控制指令,从而根据该控制指令,对目标存储单元执行操作指令,实现控制不同类型的存储单元进行操作,并实现组合不同类型的存储单元。The beneficial effects of the present invention include: the storage device includes at least two types of storage units, and by determining the target storage unit to which the operation instruction acts, and then according to the target storage unit's target model, the corresponding control instruction is invoked, so that according to the control instruction, The operation instructions are executed on the target storage unit to control different types of storage units to operate, and to combine different types of storage units.
【附图说明】[Description of the drawings]
图1是本发明实施例的存储设备的示意图。FIG. 1 is a schematic diagram of a storage device according to an embodiment of the present invention.
图2是根据本发明一实施例的存储设备的控制方法的流程图。2 is a flowchart of a storage device control method according to an embodiment of the present invention.
图3是根据本发明另一实施例的存储设备的控制方法的流程图。3 is a flowchart of a storage device control method according to another embodiment of the present invention.
图4是图1中的存储设备的状态示意图。4 is a schematic view of the state of the storage device in FIG.
图5是根据本发明另一实施例的存储设备的控制方法的流程图。5 is a flowchart of a storage device control method according to another embodiment of the present invention.
图6是图1中的存储设备的状态示意图。6 is a schematic diagram of the state of the storage device in FIG. 1.
图7是图1中的存储设备的状态示意图。7 is a schematic diagram of the state of the storage device in FIG.
图8是本发明实施例的电子设备的结构示意图。8 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
【具体实施方式】【detailed description】
本说明书及权利要求书通篇中所用的某些用语指代特定部件。如所属领域的技术人员可以理解的是,电子设备制造商可利用不同名称来指代同一个部件。本文并非以名称来区分部件,而是以功能来区分部件。在以下说明书及权利要求书中,用语“包括”是开放式的限定词语,因此其应被解释为意指“包括但不限于…”。另外,用语“耦合”旨在意指间接电连接或直接电连接。因此,当一个装置耦合到另一装置时,则这种连接可以是直接电连接或通过其他装置及连接部而实现的间接电连接。Certain terms used throughout this specification and claims refer to specific components. As those skilled in the art can understand, electronic device manufacturers can use different names to refer to the same component. This article does not distinguish parts by name, but by function. In the following description and claims, the term "including" is an open-ended qualified word, so it should be interpreted to mean "including but not limited to...". In addition, the term "coupled" is intended to mean an indirect electrical connection or a direct electrical connection. Therefore, when one device is coupled to another device, this connection may be a direct electrical connection or an indirect electrical connection through other devices and connections.
为了方便理解本发明,先对本发明的存储设备进行详细说明。In order to facilitate understanding of the present invention, the storage device of the present invention will be described in detail first.
如图1所示,是本发明实施例的存储设备的示意图。该存储设备100包括但不限于SD(Secure Digital Memory Card)卡、TF(Trans-flash Card)卡、MMC(Multi-Media Card)卡、EMMC(Embedded Multi Media Card)卡,EMCP(Embedded Multi-Chip Package)卡、CF(Compact Flash)卡、U盘(USB Flash Drive)、SSD(固态硬盘,Solid State Drive)。As shown in FIG. 1, it is a schematic diagram of a storage device according to an embodiment of the present invention. The storage device 100 includes but is not limited to SD (Secure Digital Memory Card) card, TF (Trans-flash Card) card, MMC (Multi-Media Card) card, EMMC (Embedded Multi Media Card) card, EMCP (Embedded Multi-Chip Package) card, CF (Compact Flash) card, U disk (USB Flash) Drive, SSD (Solid State Drive, Solid State Drive).
存储设备100包括控制器110和至少两种型号的存储单元,其中控制器110与每个存储单元电连接。在一示例中,每个存储单元为一个独立的存储晶粒。 进一步地,存储单元可以为NAND Flash芯片。型号可以为存储单元类型、生产厂家、制程、容量和通信协议中的一种或任意组合。The storage device 100 includes a controller 110 and at least two types of storage units, wherein the controller 110 is electrically connected to each storage unit. In an example, each memory cell is an independent memory die. Further, the storage unit may be a NAND Flash chip. The model can be one or any combination of storage unit type, manufacturer, manufacturing process, capacity and communication protocol.
当存储单元为NAND Flash存储单元时,在按照存储数据原理分类的情况中,存储单元类型包括但不限于SLC、MLC、TLC、QLC,在按照堆叠情况分类的情况中,存储单元类型包括但不限于2D Nand和3D Nand。生产厂家是指存储单元的生产者,制程是指制作存储单元的制作制程,容量是指存储单元的存储容量,以及通信协议是指存储单元所采用的通信协议,所采用的通信协议包括但不限于SD协议、eMMC协议、UFS协议、SATA、PCIe、NVMe等中的一种。When the storage unit is a NAND Flash storage unit, in the case of classification according to the principle of storing data, the storage unit type includes but is not limited to SLC, MLC, TLC, QLC, and in the case of stacking classification, the storage unit type includes but not Limited to 2D Nand and 3D Nand. The manufacturer refers to the manufacturer of the storage unit, the manufacturing process refers to the manufacturing process for manufacturing the storage unit, the capacity refers to the storage capacity of the storage unit, and the communication protocol refers to the communication protocol adopted by the storage unit, and the adopted communication protocols include but not Limited to one of SD protocol, eMMC protocol, UFS protocol, SATA, PCIe, NVMe, etc.
在一实施例中,控制器110包括至少一个片选引脚,例如,片选引脚111a和/或片选引脚112a,每个片选引脚与至少一个存储单元电连接。如图1所示,存储设备100包括存储单元1211和存储单元组122,存储单元组122包括存储单元1221-122n,其中片选引脚111a与存储单元1211电连接,片选引脚112a与存储单元组122电连接。存储单元1211和存储单元组122中的存储单元1221-122n的型号不同。假设存储单元组122中每个存储单元的型号为512M的存储容量,存储单元1211为1G的存储容量,则存储单元1221-122n的存储容量均为512M,而存储单元1211的存储容量为1G,从而实现组合不同存储容量的存储单元。In an embodiment, the controller 110 includes at least one chip select pin, for example, a chip select pin 111a and/or a chip select pin 112a, and each chip select pin is electrically connected to at least one memory unit. As shown in FIG. 1, the storage device 100 includes a storage unit 1211 and a storage unit group 122. The storage unit group 122 includes storage units 1221-122n, wherein the chip select pin 111a is electrically connected to the storage unit 1211, and the chip select pin 112a is connected to the storage The unit group 122 is electrically connected. The storage units 1211 and the storage units 1221-122n in the storage unit group 122 have different models. Assuming that the model of each storage unit in the storage unit group 122 is a storage capacity of 512M, and the storage unit 1211 is a storage capacity of 1G, the storage capacity of the storage units 1221-122n is 512M, and the storage capacity of the storage unit 1211 is 1G, Thus, a storage unit combining different storage capacities can be realized.
在一示例中,控制器110包括至少两个片选引脚,例如,片选引脚111a和片选引脚112a等,每个片选引脚分别与至少一个存储单元电连接,进而控制器110与每个存储单元电连接。例如,存储单元1211与片选引脚111a连接,存储单元组122与片选引脚112a连接,可以看出,与每个片选引脚电连接的存储单元的数量不同,即片选引脚111a与一个存储单元1211电连接,而片选引脚112a与多个存储单元1221-122n电连接。在其他示例中,与每个片选引脚电连接的存储单元的数量可以相同,例如,与每个片选引脚电连接的存储单元的数量可以均1,即每个片选引脚与一个存储单元电连接。In an example, the controller 110 includes at least two chip select pins, for example, a chip select pin 111a and a chip select pin 112a, etc., each chip select pin is electrically connected to at least one memory unit, and then the controller 110 is electrically connected to each storage unit. For example, the storage unit 1211 is connected to the chip selection pin 111a, and the storage unit group 122 is connected to the chip selection pin 112a. It can be seen that the number of storage units electrically connected to each chip selection pin is different, that is, the chip selection pin 111a is electrically connected to one memory cell 1211, and the chip select pin 112a is electrically connected to a plurality of memory cells 1221-122n. In other examples, the number of memory cells electrically connected to each chip select pin may be the same, for example, the number of memory cells electrically connected to each chip select pin may be equal to 1, that is, each chip select pin is One storage unit is electrically connected.
控制器110还包括命令引脚111b、地址引脚111c和若干个数据引脚111d。存储单元组,例如存储单元组122,还分别与命令引脚111b、地址引脚111c和若干个数据引脚111d连接,也就是说,存储单元组122中的每个存储单元还分别与命令引脚111b、地址引脚111c和若干个数据引脚111d连接。在一示例中,数据引脚111d的数量为8个。The controller 110 also includes a command pin 111b, an address pin 111c, and several data pins 111d. The storage unit group, such as the storage unit group 122, is also connected to the command pin 111b, the address pin 111c, and several data pins 111d, that is, each storage unit in the storage unit group 122 is also connected to the command Pin 111b, address pin 111c and several data pins 111d are connected. In one example, the number of data pins 111d is 8.
需要注意的是,虽然图1中仅示出两种型号的存储单元,但是在其他实施例中,还包括其他型号的存储单元。同时,在图1中的控制器110中,为了清楚简洁,用一个圆点表示若干个数据引脚111d。It should be noted that although only two types of storage units are shown in FIG. 1, in other embodiments, storage units of other types are also included. Meanwhile, in the controller 110 in FIG. 1, for clarity and conciseness, several data pins 111d are represented by one dot.
如图2所示,是根据本发明一实施例的存储设备的控制方法的流程图,在本实施例中,该控制方法200的执行主体为图1中的控制器110。下面结合图1进行说明,该控制方法200包括:As shown in FIG. 2, it is a flowchart of a storage device control method according to an embodiment of the present invention. In this embodiment, the execution subject of the control method 200 is the controller 110 in FIG. 1. The following describes with reference to FIG. 1, the control method 200 includes:
步骤210:响应于操作指令,确定操作指令所作用的目标存储单元,并根据所确定的目标存储单元的目标型号,调用目标型号所对应的控制命令。Step 210: In response to the operation instruction, determine the target storage unit to which the operation instruction acts, and call the control command corresponding to the target model according to the determined target model of the target storage unit.
目标存储单元是指控制器110即将对其进行相关操作的存储单元,例如,对其读、写、擦除、垃圾回收、空闲快加速等的存储单元。也就是说,目标存储单元是指操作指令即将作用的对象。The target storage unit refers to a storage unit that the controller 110 is about to perform related operations on, for example, a storage unit to which the controller 110 reads, writes, erases, garbage collects, idles fast acceleration, etc. In other words, the target storage unit refers to the object that the operation instruction is about to act on.
在一实施例中,操作指令包括主机下发的操作指令及控制器执行自身内部固件所产生的操作指令。在一示例中,当操作指令为主机下发的操作指令时,在步骤210之前,该控制方法200还包括:接收主机下发的操作指令。In one embodiment, the operation instructions include operation instructions issued by the host and operation instructions generated by the controller executing its own internal firmware. In an example, when the operation instruction is an operation instruction issued by the host, before step 210, the control method 200 further includes: receiving the operation instruction issued by the host.
控制器110中存储有不同型号的存储单元的控制命令,在确定目标存储单元的目标型号后,调用相应的控制命令。The controller 110 stores control commands of different types of storage units. After determining the target type of the target storage unit, the corresponding control commands are called.
步骤220:根据目标型号所对应的控制命令,对目标存储单元执行操作指令。Step 220: Perform an operation instruction on the target storage unit according to the control command corresponding to the target model.
控制器110调用目标型号所对应的控制命令后,根据该控制命令对目标存储单元执行操作指令。After calling the control command corresponding to the target model, the controller 110 executes an operation instruction on the target storage unit according to the control command.
在本实施例中,存储设备包括至少两种型号的存储单元,通过确定操作指令所作用的目标存储单元,进而根据目标存储单元的目标型号,调用相应的控制指令,从而根据该控制指令,对目标存储单元执行操作指令,实现控制不同类型的存储单元进行操作,并实现组合不同类型的存储单元。In this embodiment, the storage device includes at least two types of storage units. By determining the target storage unit to which the operation instruction acts, and then according to the target storage unit's target model, the corresponding control instruction is called, so that according to the control instruction, the The target storage unit executes operation instructions, controls different types of storage units to operate, and realizes combining different types of storage units.
在一实施例中,如图1所示,当目标存储单元为存储单元1211时,此时片选111a只与一个存储单元1211连接。如图3所示,是根据本发明另一实施例的存储设备的控制方法的流程图,该控制方法基于上述实施例的控制方法200,相同的部分在此不再赘述。其中,如图3所示,确定操作指令所作用的目标存储单元包括:In an embodiment, as shown in FIG. 1, when the target storage unit is the storage unit 1211, only one storage unit 1211 is connected to the chip select 111a. As shown in FIG. 3, it is a flowchart of a control method of a storage device according to another embodiment of the present invention. The control method is based on the control method 200 of the foregoing embodiment, and the same parts are not repeated here. Among them, as shown in FIG. 3, the target storage unit for determining the operation instruction includes:
步骤310:向与每个片选引脚电连接的存储单元发送片选指令,以选中目标存储单元。Step 310: Send a chip selection instruction to the storage unit electrically connected to each chip selection pin to select the target storage unit.
如上所述,目标存储单元是指控制器110即将对其进行相关操作的存储单 元,例如,对其读、写、擦除、垃圾回收、空闲快加速等的存储单元。也就是说,目标存储单元是指操作指令即将作用的对象。As described above, the target storage unit refers to a storage unit to which the controller 110 will perform related operations, for example, a storage unit to which the controller 110 reads, writes, erases, garbage collects, idles fast acceleration, and the like. In other words, the target storage unit refers to the object that the operation instruction is about to act on.
片选指令包括每个片选引脚的电压信息,每个存储单元根据该电压信息判断自己是否为目标存储单元。The chip selection instruction includes voltage information of each chip selection pin, and each storage unit determines whether it is a target storage unit according to the voltage information.
具体地,在一实施例中,步骤310包括:拉低与目标存储单元所连接的目标片选引脚的电压;以及拉高除目标片选引脚外的其它片选引脚的电压,以选中目标存储单元。在本实施例中,目标存储单元为存储单元1211,控制器110拉低目标片选引脚111a,并拉高其他片选引脚,例如,片选引脚112a,此时,如图4所示,存储单元1211被选中(图中灰色表示被选中)。在一示例中,片选指令包括电平为低的信号,换句话说,控制器110拉低片选引脚的电压。Specifically, in an embodiment, step 310 includes: lowering the voltage of the target chip select pin connected to the target storage unit; and raising the voltage of other chip select pins except the target chip select pin, to Select the target storage unit. In this embodiment, the target storage unit is the storage unit 1211, and the controller 110 pulls down the target chip select pin 111a, and pulls up other chip select pins, for example, the chip select pin 112a. At this time, as shown in FIG. 4 As shown, the storage unit 1211 is selected (gray in the figure indicates that it is selected). In one example, the chip select instruction includes a signal with a low level. In other words, the controller 110 pulls down the voltage of the chip select pin.
在本实施例中,在目标存储单元为某个片选引脚所仅电连接的一个存储单元的情况中,通过仅发送片选指令,选中该目标存储单元,即可确定目标存储单元。In this embodiment, in a case where the target storage unit is only one storage unit electrically connected to a certain chip selection pin, by sending only a chip selection instruction to select the target storage unit, the target storage unit can be determined.
在另一实施例中,如图1所示,与每个片选引脚所连接的至少一个存储单元组成一个存储单元组,即与片选引脚111a电连接的存储单元1211组成一个存储单元组,与片选引脚112a电连接的存储单元1221-122n组成一个存储单元组122。下面以目标存储单元组为存储单元组122为例进行说明,需要说明,下文的说明同样适用于目标存储单元组为存储单元1211所组成的存储单元组的情况。当目标存储单元为存储单元组122中的一个存储单元的实施例中,如图5所示,是根据本发明又一实施例的存储设备的控制方法的流程图,该控制方法基于上述实施例的控制方法200,相同的部分在此不再赘述。其中,如图5所示,确定操作指令所作用的目标存储单元包括:In another embodiment, as shown in FIG. 1, at least one memory cell connected to each chip select pin constitutes a memory cell group, that is, a memory cell 1211 electrically connected to the chip select pin 111a constitutes a memory cell Group, memory cells 1221-122n electrically connected to the chip select pins 112a constitute a memory cell group 122. The following uses the target storage unit group as the storage unit group 122 as an example for illustration. The following description also applies to the case where the target storage unit group is the storage unit group composed of the storage units 1211. When the target storage unit is a storage unit in the storage unit group 122, as shown in FIG. 5, it is a flowchart of a storage device control method according to another embodiment of the present invention, the control method is based on the above embodiment Of the control method 200, the same part will not be repeated here. Wherein, as shown in FIG. 5, the target storage unit for determining the operation instruction includes:
步骤510:向每个存储单元组发送片选指令,以选中目标存储单元组中的所有存储单元。Step 510: Send a chip selection instruction to each storage unit group to select all storage units in the target storage unit group.
如上所述,目标存储单元是指控制器110即将对其进行相关操作的存储单元,例如,对其读、写、擦除、垃圾回收、空闲快加速等的存储单元。也就是说,目标存储单元是指操作指令即将作用的对象。目标存储单元组是指目标存储单元所电连接的片选引脚电连接的所有存储单元的组合,即“目标存储单元”所在的存储单元组为目标存储单元组。如上所述,存储单元组中的存储单元的型号相同,因此,目标存储单元组中的其他存储单元与目标存储单元的目标型号相同,也就是说,目标存储单元组中的其他存储单元也为目标型号。As described above, the target storage unit refers to a storage unit on which the controller 110 is about to perform related operations, for example, a storage unit to which the controller 110 reads, writes, erases, garbage collects, and idles fast acceleration. In other words, the target storage unit refers to the object that the operation instruction is about to act on. The target storage unit group refers to a combination of all storage units electrically connected to the chip select pins electrically connected to the target storage unit, that is, the storage unit group where the "target storage unit" is located is the target storage unit group. As described above, the storage units in the storage unit group have the same model number. Therefore, the other storage units in the target storage unit group are the same as the target model of the target storage unit, that is, the other storage units in the target storage unit group are also The target model.
片选指令包括每个片选引脚的电压信息,存储单元/存储单元组根据该电压信息判断自己是否为目标存储单元/目标存储单元组。The chip selection instruction includes voltage information of each chip selection pin, and the storage unit/storage unit group judges whether it is the target storage unit/target storage unit group according to the voltage information.
在本实施例中,目标存储单元组为存储单元组122,控制器110向存储单元组122发送片选指令,此时,存储单元组122接收片选指令,判断自身为目标存储单元组,进而如图6所示,存储单元组122中的存储单元1221-122n被选中(图中灰色表示被选中)。In this embodiment, the target storage unit group is the storage unit group 122, and the controller 110 sends the chip selection instruction to the storage unit group 122. At this time, the storage unit group 122 receives the chip selection instruction, and judges that it is the target storage unit group. As shown in FIG. 6, the storage units 1221-122n in the storage unit group 122 are selected (gray in the figure indicates that they are selected).
在一实施例中,步骤510包括:拉低与目标存储单元组所电连接的目标片选引脚的电压;以及拉高除目标片选引脚外的其它片选引脚的电压,以选中目标存储单元组中的所有存储单元。在本实施例中,目标存储单元组为存储单元组122,与存储单元组122电连接的片选引脚112a为目标片选引脚,控制器110拉低目标片选引脚112a,并拉高其他片选引脚,例如,片选引脚111a,此时,如图6所示,存储单元组122中的存储单元1221-122n被选中(图中灰色表示被选中)。相反地,拉高目标片选引脚112a,则取消目标存储单元组122。In an embodiment, step 510 includes: lowering the voltage of the target chip select pin electrically connected to the target memory cell group; and raising the voltage of other chip select pins except the target chip select pin to select All storage units in the target storage unit group. In this embodiment, the target memory cell group is the memory cell group 122, the chip select pin 112a electrically connected to the memory cell group 122 is the target chip select pin, and the controller 110 pulls down the target chip select pin 112a and pulls Other chip select pins are higher, for example, the chip select pin 111a. At this time, as shown in FIG. 6, the storage units 1221-122n in the storage unit group 122 are selected (gray in the figure indicates being selected). Conversely, if the target chip select pin 112a is pulled up, the target memory cell group 122 is cancelled.
在一示例中,片选指令包括电平为低的信号,换句话说,控制器110拉低目标片选引脚的电压。In one example, the chip select instruction includes a signal with a low level. In other words, the controller 110 pulls down the voltage of the target chip select pin.
步骤520:向目标存储单元组发送通知命令,以通知目标存储单元组中的所有存储单元将进行目标存储单元选择。Step 520: Send a notification command to the target storage unit group to notify all storage units in the target storage unit group that a target storage unit selection will be made.
在本实施例中,目标存储单元组为存储单元组122,在发送片选指令后,存储单元组122中的存储单元1221-122n被选中,随后,控制器110向目标存储单元组122发送通知命令,控制器110通知目标存储单元组122中的存储单元1221-122n将进行目标存储单元选择。In this embodiment, the target storage unit group is the storage unit group 122. After sending the chip select instruction, the storage units 1221-122n in the storage unit group 122 are selected, and then, the controller 110 sends a notification to the target storage unit group 122 In response, the controller 110 notifies the storage units 1221-122n in the target storage unit group 122 that a target storage unit selection will be made.
在一实施例中,步骤520包括:拉高命令引脚的电压,拉低地址引脚的电压;通过数据引脚向目标存储单元组发送通知命令。在本实施例中,控制器110拉高命令引脚111b的电压,拉低地址引脚111c的电压,进而通过数据引脚111d向目标存储单元组122发送通知命令,此时,目标存储单元组122中的存储单元1221-122n接收该通知命令,了解到将进行目标存储单元的选择。In an embodiment, step 520 includes: raising the voltage of the command pin and lowering the voltage of the address pin; sending a notification command to the target storage unit group through the data pin. In this embodiment, the controller 110 pulls up the voltage of the command pin 111b and pulls down the voltage of the address pin 111c, and then sends a notification command to the target storage unit group 122 through the data pin 111d. At this time, the target storage unit group The storage units 1221-122n in 122 receive the notification command and learn that the target storage unit will be selected.
在一示例中,控制器110拉高命令引脚111b的电压,即向命令引脚111b发送电平为高的信号,换句话说,控制器110拉高命令引脚111b。在一示例中,控制器110拉低地址引脚111c的电压,即向地址引脚111c发送电平为低的信号,换句话说,控制器110拉低地址引脚111c。In one example, the controller 110 pulls up the voltage of the command pin 111b, that is, sends a signal of high level to the command pin 111b, in other words, the controller 110 pulls up the command pin 111b. In one example, the controller 110 pulls down the voltage of the address pin 111c, that is, sends a signal of low level to the address pin 111c. In other words, the controller 110 pulls down the address pin 111c.
在一实施例中,通知命令占用1比特。通知命令为00000000时,意味着通 知目标存储单元组进行目标存储单元的选择,或者命令位为00000001时,意味着通知目标存储单元组进行目标存储单元的选择。In one embodiment, the notification command occupies 1 bit. When the notification command is 00000000, it means to notify the target storage unit group to select the target storage unit, or when the command bit is 00000001, it means to notify the target storage unit group to select the target storage unit.
步骤530:向目标存储单元组发送地址命令,以选中目标存储单元。Step 530: Send an address command to the target storage unit group to select the target storage unit.
地址命令中包括目标存储单元的地址,以使目标存储单元组中的存储单元根据该地址,判断是否为目标存储单元。The address command includes the address of the target storage unit, so that the storage unit in the target storage unit group determines whether it is the target storage unit according to the address.
在本实施例中,在向目标存储单元组122发送通知命令后,控制器110通知目标存储单元组122中的存储单元1221-122n将进行目标存储单元的选择。随后,控制器110向目标存储单元组122发送地址命令。此时,目标存储单元组122中的存储单元1221-122n分别接收该地址命令,并根据该地址命令中的地址信息判断自身是否被选中,也就是说,目标存储单元组122中的存储单元1221-122n根据该地址命令判断自身是否为目标存储单元。如图7所示,假设存储单元1221为目标存储单元,存储单元1221根据该地址命令确定自身为目标存储单元。In this embodiment, after sending a notification command to the target storage unit group 122, the controller 110 notifies the storage units 1221-122n in the target storage unit group 122 that the selection of the target storage unit will be performed. Subsequently, the controller 110 sends an address command to the target storage unit group 122. At this time, the storage units 1221-122n in the target storage unit group 122 respectively receive the address command and determine whether they are selected according to the address information in the address command, that is, the storage unit 1221 in the target storage unit group 122 -122n judges whether it is the target storage unit according to the address command. As shown in FIG. 7, assuming that the storage unit 1221 is a target storage unit, the storage unit 1221 determines that it is a target storage unit according to the address command.
在一实施例中,步骤530包括:拉低命令引脚的电压,拉高地址引脚的电压;通过数据引脚向目标存储单元组发送地址命令,以根据地址命令所包含的地址信息选中目标存储单元。在本实施例中,控制器110拉低命令引脚111b的电压,拉高地址引脚111c的电压,进而通过数据引脚111d向目标存储单元组122发送地址命令,此时,目标存储单元组122中的存储单元1221-122n接收该地址命令,并根据该地址命令中的地址信息判断自身是否被选中,也就是说,存储单元1221-122n根据该地址命令判断自身是否为目标存储单元。如图7所示,假设存储单元1221为目标存储单元,存储单元1221根据该地址命令确定自身为目标存储单元。In one embodiment, step 530 includes: lowering the voltage of the command pin and raising the voltage of the address pin; sending an address command to the target storage unit group through the data pin to select the target according to the address information contained in the address command Storage unit. In this embodiment, the controller 110 pulls down the voltage of the command pin 111b and the voltage of the address pin 111c, and then sends an address command to the target storage unit group 122 through the data pin 111d. At this time, the target storage unit group The storage units 1221-122n in 122 receive the address command and determine whether they are selected according to the address information in the address command, that is, the storage units 1221-122n determine whether they are the target storage unit according to the address command. As shown in FIG. 7, assuming that the storage unit 1221 is a target storage unit, the storage unit 1221 determines that it is a target storage unit according to the address command.
在一示例中,控制器110拉高地址引脚111c的电压,即向地址引脚111c发送电平为高的信号,换句话说,控制器110拉高地址引脚111c。在一示例中,控制器110拉低命令引脚111b的电压,即向命令引脚111b发送电平为低的信号,换句话说,控制器110拉低命令引脚111b。In one example, the controller 110 pulls up the voltage of the address pin 111c, that is, sends a signal of high level to the address pin 111c, in other words, the controller 110 pulls up the address pin 111c. In one example, the controller 110 pulls down the voltage of the command pin 111b, that is, sends a signal of low level to the command pin 111b, in other words, the controller 110 pulls down the command pin 111b.
在一实施例中,地址命令占用1比特。假设目标存储单元组为存储单元组122,而存储单元组122包括两个存储单元,例如,存储单元1221和存储单元1222,存储单元1221的地址为00000000;存储单元1222的地址为00000001。在一示例中,若接收到地址命令中的地址为00000000时,表示存储单元1221被选中;若接收到地址命令中的地址为00000001时,表示存储单元1222被选 中。In one embodiment, the address command occupies 1 bit. Assume that the target storage unit group is the storage unit group 122, and the storage unit group 122 includes two storage units, for example, the storage unit 1221 and the storage unit 1222, the address of the storage unit 1221 is 00000000; the address of the storage unit 1222 is 00000001. In one example, if the address in the received address command is 00000000, it indicates that the storage unit 1221 is selected; if the address in the received address command is 00000001, it indicates that the storage unit 1222 is selected.
假设存储单元组122中包括3个存储单元,即存储单元1221、存储单元1222和存储单元1223,此时,存储单元1221的地址为00000000;存储单元1222的地址为00000001;存储单元组1223的地址为00000010。若接收到的地址命令中的地址为00000000,则表示存储单元1221被选中;若接收到的地址命令中的地址为00000001时,表示存储单元1222被选中;若接收到的地址命令中的地址为00000010时,表示存储单元1223被选中。Suppose that the storage unit group 122 includes three storage units, namely, storage unit 1221, storage unit 1222, and storage unit 1223. At this time, the address of storage unit 1221 is 00000000; the address of storage unit 1222 is 00000001; the address of storage unit group 1223 Is 00000010. If the address in the received address command is 00000000, it means that the storage unit 1221 is selected; if the address in the received address command is 00000001, it means that the storage unit 1222 is selected; if the address in the received address command is 00000010 indicates that the storage unit 1223 is selected.
在本实施例中,当目标存储单元为多个存储单元中的一个时,也就是说,型号为目标型号的存储单元有多个的情况下,通过发送片选指令,确定目标存储单元组,向目标存储单元组发送通知命令,通知目标存储单元组中的存储单元将进行目标存储单元的选择,并通过向目标存储单元组发送地址命令,选中目标存储单元,实现一个片选控制多个相同型号的存储单元。当目标存储单元为一个时,即型号为目标信号的存储单元仅有一个的情况下,同样地,通过发送片选指令,确定目标存储单元组,向目标存储单元组发送通知命令,通知目标存储单元组中的存储单元将进行目标存储单元的选择,并通过向目标存储单元组发送地址命令,选中目标存储单元,实现一个片选控制多个相同型号的存储单元。In this embodiment, when the target storage unit is one of the multiple storage units, that is to say, when there are multiple storage units of the target model type, the target storage unit group is determined by sending a chip select instruction, Send a notification command to the target storage unit group to notify the storage unit in the target storage unit group that the target storage unit will be selected, and send the address command to the target storage unit group to select the target storage unit to achieve one chip select control for multiple identical Model storage unit. When there is only one target storage unit, that is, when there is only one storage unit whose model is the target signal, similarly, by sending a chip select instruction, the target storage unit group is determined, and a notification command is sent to the target storage unit group to notify the target storage The storage unit in the unit group will select the target storage unit, and send the address command to the target storage unit group, select the target storage unit, and realize a chip select to control multiple storage units of the same model.
本发明还提供一种存储设备。在一实施例中,该存储设备包括至少一个控制器和与至少一个控制器通信连接的至少两个存储单元,存储单元存储有可被至少一个控制器执行的指令,该指令被至少一个控制器执行,以使至少一个控制器能够执行上述实施例的控制方法。在一示例中,该存储设备为上述实施例中的存储设备100,即图1的存储设备100,在本示例中,至少一个控制器包括控制器110,具体说明详见上述实施例,在此不再赘述。The invention also provides a storage device. In an embodiment, the storage device includes at least one controller and at least two storage units communicatively connected to the at least one controller, the storage unit stores instructions executable by the at least one controller, and the instructions are stored by the at least one controller Execution to enable at least one controller to execute the control method of the above embodiment. In an example, the storage device is the storage device 100 in the foregoing embodiment, that is, the storage device 100 in FIG. 1. In this example, at least one controller includes a controller 110. For details, see the foregoing embodiment. No longer.
如图8所示,本发明还提供一种电子设备。该电子设备800可以为计算机、智能手机、平板电脑、照相机、摄像机、机顶盒、智能家居、车载电子产品等。该电子设备800包括上述实施例的存储设备,即图1中的存储设备100,具体说明详见上述实施例,在此不再赘述。As shown in FIG. 8, the present invention also provides an electronic device. The electronic device 800 may be a computer, a smart phone, a tablet computer, a camera, a video camera, a set-top box, a smart home, or an in-vehicle electronic product. The electronic device 800 includes the storage device in the foregoing embodiment, that is, the storage device 100 in FIG. 1. For a detailed description, refer to the foregoing embodiment, and details are not described herein again.
所属领域的技术人员易知,可在保持本发明的教示内容的同时对装置及方法作出诸多修改及变动。因此,以上公开内容应被视为仅受随附权利要求书的范围的限制。Those skilled in the art can easily understand that many modifications and changes can be made to the device and method while maintaining the teaching content of the present invention. Therefore, the above disclosure should be considered as limited only by the scope of the appended claims.

Claims (12)

  1. 一种存储设备的控制方法,其特征在于,所述存储设备包括控制器以及至少两种型号的存储单元,所述控制器与每个所述存储单元电连接,所述控制方法包括:A control method of a storage device, wherein the storage device includes a controller and at least two types of storage units, the controller is electrically connected to each storage unit, and the control method includes:
    响应于操作指令,确定所述操作指令所作用的目标存储单元,并根据所确定的目标存储单元的目标型号,调用所述目标型号所对应的控制命令;以及In response to the operation instruction, determine the target storage unit to which the operation instruction acts, and call the control command corresponding to the target model according to the determined target model of the target storage unit; and
    根据所述目标型号所对应的控制命令,对所述目标存储单元执行操作指令。The operation instruction is executed on the target storage unit according to the control command corresponding to the target model.
  2. 如权利要求1所述的控制方法,其特征在于,所述操作指令包括主机下发的操作指令及控制器执行自身内部固件所产生的操作指令。The control method according to claim 1, wherein the operation instructions include operation instructions issued by the host and operation instructions generated by the controller executing its own internal firmware.
  3. 如权利要求2所述的控制方法,其特征在于,当所述操作指令为主机下发的操作指令时,所述控制方法还包括:接收主机下发的操作指令。The control method according to claim 2, wherein when the operation instruction is an operation instruction issued by a host, the control method further comprises: receiving an operation instruction issued by the host.
  4. 如权利要求1所述的控制方法,其特征在于,所述型号为以下中的任意组合:存储单元类型不同、生产厂家不同、制程不同、容量不同、通信协议不同。The control method according to claim 1, wherein the model is any combination of the following: different storage unit types, different manufacturers, different manufacturing processes, different capacities, and different communication protocols.
  5. 如权利要求1所述的控制方法,其特征在于,所述控制器包括至少一个片选引脚,每个所述片选引脚与一个存储单元电连接;所述确定所述操作指令所作用的目标存储单元,具体包括:The control method according to claim 1, wherein the controller includes at least one chip select pin, and each of the chip select pins is electrically connected to a storage unit; the determining the role of the operation instruction The target storage unit, including:
    向与每个所述存储单元发送片选指令,以选中所述目标存储单元。A chip selection instruction is sent to each of the storage units to select the target storage unit.
  6. 如权利要求1所述的控制方法,其特征在于,所述控制器包括至少一个片选引脚,每个所述片选引脚与至少一个存储单元电连接;与每个所述片选引脚所连接的至少一个存储单元组成一个存储单元组;所述确定所述操作指令所作用的目标存储单元,具体包括:The control method according to claim 1, wherein the controller includes at least one chip select pin, each of the chip select pins is electrically connected to at least one memory unit; and each of the chip select pins At least one storage unit connected to the foot constitutes a storage unit group; the determining of the target storage unit to which the operation instruction acts specifically includes:
    向每个所述存储单元组发送片选指令,以选中目标存储单元组中的所有存储单元;Sending a chip selection instruction to each of the storage unit groups to select all storage units in the target storage unit group;
    向所述目标存储单元组发送通知命令,以通知所述目标存储单元组中的所有存储单元将进行目标存储单元选择;以及Send a notification command to the target storage unit group to notify all storage units in the target storage unit group that a target storage unit selection will be made; and
    向所述目标存储单元组发送地址命令,以选中所述目标存储单元。Send an address command to the target storage unit group to select the target storage unit.
  7. 如权利要求6所述的控制方法,其特征在于,所述控制器包括至少两个片选引脚,与每个所述片选引脚电连接的存储单元个数可以相同,也可以不同。The control method according to claim 6, wherein the controller includes at least two chip select pins, and the number of memory cells electrically connected to each of the chip select pins may be the same or different.
  8. 如权利要求7所述的控制方法,其特征在于,The control method according to claim 7, wherein:
    向每个所述存储单元组发送片选指令,以选中目标存储单元组中的所有存储单元,具体包括:Send a chip selection instruction to each of the storage unit groups to select all storage units in the target storage unit group, specifically including:
    拉低与所述目标存储单元组所电连接的目标片选引脚的电压;以及Pull down the voltage of the target chip select pin electrically connected to the target memory cell group; and
    拉高除所述目标片选引脚外的其它片选引脚的电压,以选中所述目标存储单元组中的所有存储单元。Raise the voltage of other chip select pins except the target chip select pin to select all the memory cells in the target memory cell group.
  9. 如权利要求6-8任一项所述的控制方法,其特征在于,所述控制器还包括命令引脚、地址引脚及若干个数据引脚;每个所述存储单元分别与所述命令引脚、所述地址引脚及所述若干个数据引脚电连接;The control method according to any one of claims 6-8, wherein the controller further includes a command pin, an address pin, and a number of data pins; each of the storage units and the command The pin, the address pin and the several data pins are electrically connected;
    所述向所述目标存储单元组发送通知命令,具体包括:The sending a notification command to the target storage unit group specifically includes:
    拉高所述命令引脚的电压;拉低所述地址引脚的电压;以及Pull up the voltage of the command pin; pull down the voltage of the address pin; and
    通过所述数据引脚向所述目标存储单元组发送所述通知命令。The notification command is sent to the target storage unit group through the data pin.
  10. 如权利要求9所述的控制方法,其特征在于,所述向所述目标存储单元组中发送地址命令,以选中所述目标存储单元,包括:The control method according to claim 9, wherein the sending an address command to the target storage unit group to select the target storage unit includes:
    拉低命令引脚的电压,拉高地址引脚的电压;以及Pull the voltage of the command pin low and the voltage of the address pin high; and
    通过所述数据引脚向所述目标存储单元组发送所述地址命令,以根据所述地址命令所包含的地址信息选中所述目标存储单元。The address command is sent to the target storage unit group through the data pin to select the target storage unit according to the address information included in the address command.
  11. 一种存储设备,其特征在于,所述存储设备包括:A storage device, characterized in that the storage device includes:
    至少一个控制器;以及At least one controller; and
    与所述至少一个控制器通信连接至少两个存储单元;其中,At least two storage units are communicatively connected with the at least one controller; wherein,
    所述存储单元存储有可被所述至少一个控制器执行的指令,所述指令被所述至少一个控制器执行,以使所述至少一个控制器能够执行权利要求1-10任一项所述的控制方法。The storage unit stores instructions executable by the at least one controller, the instructions being executed by the at least one controller to enable the at least one controller to execute any one of claims 1-10 Control method.
  12. 一种电子设备,其特征在于,包括如权利要求11所述的存储设备。An electronic device characterized by comprising the storage device according to claim 11.
PCT/CN2019/096435 2018-12-26 2019-07-17 Control method for storage device, storage device, and electronic device WO2020134038A1 (en)

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