WO2020051902A1

WO2020051902A1 - Flexible display device

Info

Publication number: WO2020051902A1
Application number: PCT/CN2018/105812
Authority: WO
Inventors: 刘景�; 陈松亚
Original assignee: 深圳市柔宇科技有限公司
Priority date: 2018-09-14
Filing date: 2018-09-14
Publication date: 2020-03-19
Also published as: CN112639927A

Abstract

A flexible display device (100), which comprises a bearing assembly (20), a circuit board assembly (30) and a back cover assembly (40). The bearing assembly (20) comprises a first bearing member (22) and a second bearing member (26) which is spaced apart from the first bearing member (22). The back cover assembly (40) comprises a first sub-back cover (42) and a second sub-back cover (46), the first sub-back cover (42) covers the circuit board assembly (30) and is connected to the first bearing member (22), the second sub-back cover (46) is connected to the second bearing member (26), and materials of the first sub-back cover (42) and the second sub-back cover (46) both comprise graphene plastic. The circuit board assembly (30) is arranged between the first bearing member (22) and the first sub-back cover (42) and may dissipate heat by means of the bearing assembly (20) and the back cover assembly (40) collectively, thus increasing the heat dissipation area of the circuit board assembly (30), which facilitates uniform heat dissipation.

Description

Flexible display device

Technical field

The present application relates to the field of electronic equipment, and in particular, to a flexible display device.

Background technique

The motherboard of an electronic device in the related art generally dissipates heat through the rear cover of the electronic device. However, the proportion of the rear cover corresponding to the motherboard covers a small proportion of the total area of the rear cover. The temperature of the corresponding back cover is high, which affects the user experience.

Summary of the Invention

In view of this, the present application provides a flexible display device with better heat dissipation performance.

The flexible display device according to the embodiment of the present application includes a bearing component, a circuit board component, and a back cover component. The carrier assembly includes a first carrier and a second carrier spaced from the first carrier. The rear cover assembly includes a first sub-rear cover and a second sub-rear cover. The first sub-rear cover covers the circuit board assembly and is connected to the first carrier. The second sub-rear cover is connected to the second carrier. The first sub-rear cover. And the material of the second sub-back cover includes graphene plastic. The circuit board assembly is disposed between the first carrier and the first sub-back cover.

The bearing component and the rear cover component of the flexible display device according to the embodiment of the present application are correspondingly connected. The circuit board component is located between the first bearing and the first sub-back cover, and the heat can be dissipated through the bearing component and the rear cover component to improve The heat dissipation area of the circuit board components is conducive to uniform heat dissipation. The first sub-back and the second sub-back are made of graphene plastic with better heat dissipation effect, which improves the heat dissipation ability of the rear cover assembly, so that the rear cover assembly can better dissipate heat through heat radiation and natural convection. In the outside air of the flexible display device, the circuit board assembly can achieve the purpose of uniform heat dissipation through the integral back cover assembly, and avoid the local temperature of the back cover assembly from being too high.

Additional aspects and advantages of the present application will be given in part in the following description, part of which will become apparent from the following description, or be learned through practice of the present application.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

1 is a schematic diagram of a flexible display device according to an embodiment of the present application;

2 is an exploded perspective view of a flexible display device according to an embodiment of the present application;

3 is a schematic perspective view of a flexible display device according to an embodiment of the present application when it is flattened;

4 is a schematic cross-sectional view of the flexible display device of FIG. 3;

5 is a schematic perspective view of a flexible display device according to an embodiment of the present application when it is folded;

6 is a schematic cross-sectional view of the flexible display device of FIG. 5;

7 is a schematic perspective view of a bearing assembly according to an embodiment of the present application;

8 is a schematic perspective view of a circuit board assembly according to an embodiment of the present application;

FIG. 9 is a schematic perspective view of a back cover assembly according to an embodiment of the present application.

Description of main component symbols: flexible heat sink 10, first heat conducting member 12, second heat conducting member 14, carrier assembly 20, first carrier 22, third accommodation space 222, connecting member 24, second carrier 26, first Four accommodation spaces 262, circuit board assembly 30, first chip 31, first shield cover 32, first heat conductor 33, main board 34, second chip 35, second shield cover 36, second heat conductor 37, rear cover Component 40, first sub-back cover 42, first accommodation space 422, first inner surface 424, cover 44, second sub-back cover 46, second accommodation space 462, second inner surface 464, battery 50, The flexible support assembly 60, the first support member 62, the second support member 64, the flexible display screen 70, and the flexible display device 100.

detailed description

The embodiments of the present application are described in detail below. Examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application, and should not be construed as limiting the present application.

In the description of this application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Rear "," left "," right "," vertical "," horizontal "," top "," bottom "," inside "," outside "," clockwise "," counterclockwise ", etc. or The positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, structure and operation in a specific orientation, Therefore, it cannot be understood as a limitation on this application. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality" is two or more, unless specifically defined otherwise.

In the description of this application, it should be noted that the terms "installation", "connected", and "connected" should be understood in a broad sense unless explicitly stated and limited otherwise. For example, they may be fixed connections or removable. Connected or integrated; it can be mechanical, electrical, or can communicate with each other; it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction of two elements relationship. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific situations.

In this application, unless explicitly stated and limited otherwise, the "first" or "under" of the second feature may include the first and second features in direct contact, and may also include the first and second features. Not directly, but through another characteristic contact between them. Moreover, the first feature is "above", "above", and "above" the second feature, including that the first feature is directly above and obliquely above the second feature, or merely indicates that the first feature is higher in level than the second feature. The first feature is “below”, “below”, and “below” of the second feature, including the fact that the first feature is directly below and obliquely below the second feature, or merely indicates that the first feature is less horizontal than the second feature.

The following disclosure provides many different implementations or examples for implementing different structures of the present application. To simplify the disclosure of this application, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the application. In addition, the present application may repeat reference numbers and / or reference letters in different examples, and such repetition is for the purpose of simplicity and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, examples of various specific processes and materials are provided in this application, but those of ordinary skill in the art may be aware of the application of other processes and / or the use of other materials.

Referring to FIG. 1, the present application provides a flexible display device 100. The flexible display device 100 of the present application includes, but is not limited to, smart terminals and display devices such as flexible smart phones, foldable smart computers, and wearable smart products. It should be noted that the shape of the flexible display device 100 may be set according to specific conditions, for example, it may be rectangular parallelepiped.

Referring to FIG. 2, a flexible display device 100 according to an embodiment of the present application includes a carrying component 20, a circuit board component 30 and a back cover component 40. The carrier assembly 20 includes a first carrier 22 and a second carrier 26 spaced from the first carrier 22. The circuit board assembly 30 is disposed between the first carrier 22 and the first sub-back cover 42. The rear cover assembly 40 includes a first sub-back cover 42 and a second sub-back cover 46, the first sub-back cover 42 is connected to the first carrier 22, the second sub-back cover 46 is connected to the second carrier 22, and the first sub-back The materials of the back cover 42 and the second sub-back cover 46 include graphene plastic.

The carrier assembly 20 and the rear cover assembly 40 of the flexible display device 100 according to the embodiment of the present application are correspondingly connected. The circuit board assembly 30 is located between the first carrier 22 and the first sub-back cover 42. The components 40 dissipate heat together, thereby increasing the heat dissipation area of the circuit board component 30 and facilitating uniform heat dissipation.

Through the solvent exchange method, graphene can be evenly mixed with plastic to form graphene plastic materials. The elastic modulus and fracture toughness of graphene plastic materials are greatly improved compared to graphene and plastic, and at the same time have other kinds of Characteristics such as higher thermal conductivity, better thermal stability, vulcanization resistance, moisture and chemical stability, etc.

The first sub-back 42 and the second sub-back 44 are made of graphene plastic with good heat dissipation, which can improve the performance of the first sub-back 42 and the second sub-back 46 and improve the performance of the rear cover assembly 40. The heat dissipation capability enables the rear cover assembly 40 to better dissipate heat to the outside air of the flexible display device 100 through heat radiation and natural convection heat dissipation, thereby achieving circuit board assembly 30 to achieve uniform heat dissipation through the overall rear cover assembly 40. The purpose is to prevent the local temperature of the back cover assembly 40 from being too high, extend the service life, and further beautify the appearance of the flexible display device 100 and enhance the user experience.

In one embodiment, the first sub-back cover 42 may also be made of 3D glass material or plastic material, and the second sub-back cover 46 may be made of 3D glass material or plastic material.

Specifically, taking the 3D glass material as an example, the 3D glass material has good thermal conductivity, and has the advantages of lightness, transparency, cleanness, anti-fingerprint, anti-glare, rigidity, scratch resistance, good weather resistance, etc. The 3D appearance of this shape makes the molded product more beautiful and differentiated, so that the first sub-back 42 and the second sub-back 46 have good strength and aesthetics.

It can be understood that the first sub-back 42 and the second sub-back 46 are not limited to the above-mentioned 3D glass material, plastic material, and graphene plastic material, and may be specifically selected in the specific implementation. Preferably, in the embodiment of the present application, the first sub-back cover 42 and the second sub-back cover 46 are both made of graphene plastic with good heat dissipation performance.

In one embodiment, both the first carrier 22 and the second carrier 26 can be made of a metal material. In this way, the first carrier 22 and the second carrier 26 have higher strength to support the flexible display device 100 and have better heat conducting effect to facilitate heat dissipation.

Please refer to FIG. 2. In some embodiments, the flexible display device 100 includes a battery 50. The battery 50 is disposed between the second carrier 26 and the second sub-back cover 46. In this way, the battery 50 can dissipate heat through the second carrier 26 and the second sub-back cover 46.

Please refer to FIG. 2, FIG. 4 and FIG. 9. The first supporting member 22 and the first sub-back cover 42 are connected together to form a first receiving space 422, and the second supporting member 26 and the second sub-back cover 46 are connected and shared together. A second accommodation space 462 is formed.

The combination of the first accommodating space 422 and the second accommodating space 462 can carry the remaining components of the flexible display device 100. The circuit board assembly 30 and the battery 50 are accommodated in the first accommodating space 422 and the second accommodating space 462, respectively. The carrier assembly 20 is carried on the side wall of the periphery of the back cover assembly 40, so that a more stable connection can be formed, the space utilization of the back cover assembly 40 is improved, and the integration of the flexible display device 100 is improved.

In some embodiments, the first carrier 22 and the second carrier 26 are close to each other when the flexible display device 100 is bent, and are away from each other when the flexible display device 100 is deployed.

Specifically, when the flexible display device 100 is bent, the rear cover assembly 40 is located outside the flexible display device 100 relative to the carrying component 20, so even if the flexible display device 100 is bent and the circuit board assembly 30 and the battery 50 are close to each other, the first bearing The combination of the second cover member 26 and the second cover member 26 on the outside can also dissipate the heat generated by the circuit board assembly 30 and the heat generated by the battery 50;

When the electronic device 100 is deployed, the first carrier 22 and the second carrier 26 are far away from each other. The heat generated by the circuit board assembly 30 and the battery 50 can be dissipated from the side of the back cover assembly 30 and can be carried from the side. The component 20 is scattered on one side, which is beneficial to heat dissipation and prevents the flexible display device 100 from overheating.

In some embodiments, when the flexible display device 100 is bent, the first sub-back 42 and the second sub-back 46 are close to each other, and the distance between the first sub-back 42 and the second sub-back 46 is greater than The distance between the first carrier 22 and the second carrier 26.

It can be understood that when the flexible display device 100 is bent, the back cover assembly 40 is located outside the flexible display device 100 relative to the carrying component 20. In this way, when the flexible display device 100 is bent, this is more beneficial to heat dissipation.

In some embodiments, the flexible display device 100 includes a flexible heat sink 10, which is thermally connected to the circuit board assembly 30, the first sub-rear cover 42 and the second sub-rear cover 46. The sub-back cover 42 extends to the second sub-back cover 46 across the connecting member 24 and fits on the second sub-back cover 46.

Specifically, the flexible heat radiating member 10 is located between the battery 50 and the second sub-back cover 46, and the battery 50 is connected to the second sub-back cover 46 through the flexible heat radiating member 10. The flexible heat dissipating member 10 is connected to the first sub-rear cover 42 and the second sub-rear cover 46. The flexible heat dissipating member 10 can conduct the heat generated by the circuit board assembly 30 to the flexible heat dissipating member 10 first, and then to the first heat dissipating member 10 through the flexible heat dissipating member 10. The sub-back cover 42 and the second sub-back cover 44 increase the heat dissipation area, which is beneficial to uniform heat dissipation.

In some embodiments, the flexible display device 100 can be switched between an unfolded state and a folded state, and the bending angle of the flexible display device 100 is 0 ° -180 °.

As shown in FIGS. 3 and 4, when the bending angle of the flexible display device 100 is 0 °, the flexible display device 100 is in a flat state. As shown in FIG. 5 and FIG. 6, when the bending angle of the flexible display device 100 is approximately 180 °, the first supporting member 22 and the second supporting member 26 substantially overlap, and the distance between the circuit board assembly 30 and the battery 50 at this time. Smaller, the heat dissipation between the circuit board assembly 30 and the battery 50 may affect each other, which causes the heat dissipation difficulty of the flexible display device 100 to increase.

Therefore, the flexible heat sink 10 is disposed to quickly dissipate heat from the back cover assembly 40 facing away from the first carrier 22 and the second carrier 26 to ensure that the temperature and usage of the flexible display device 100 are normal.

In some embodiments, the flexible heat sink 10 includes a first heat conducting member 12 and a second heat conducting member 14 which are arranged in a stack. The second heat conducting member 14 is disposed on the rear cover assembly 40. The first heat conducting member 12 is disposed on a side of the second heat conducting member 14 away from the rear cover assembly 40. Specifically, the first heat conducting member 12 is attached to the connecting member 24 and the circuit board assembly 30, and the second heat conducting member 14 is attached to the first sub-rear cover 42 and the second sub-rear cover 46.

Specifically, the strength of the first heat conducting member 12 is greater than the strength of the second heat conducting member 14. The second heat-conducting member 14 is stacked with the first heat-conducting member 12, which can better protect the second heat-conducting member 14 from being damaged by the flexible heat-dissipating member. When the flexible display device 100 is bent, the flexible heat sink 10 and the back cover assembly 40 are located outside the flexible display device 100 to facilitate heat dissipation. The first heat conducting member 12 is attached to the connecting member 24 and the circuit board assembly 30, and the second heat conducting member 14 is attached to the first sub-back 42 and the second sub-back 46, which can improve the flexible heat-dissipating member 10 and each component The contact area between them is not only beneficial for the circuit board assembly 30 to conduct and dissipate heat through the flexible heat sink 10, but also for improving the tightness and connection stability of the internal structure of the flexible display device 100.

In some embodiments, the orthographic projection area of the first heat conducting member 12 on the second heat conducting member 14 covers the second heat conducting member 14.

Specifically, the size of the first heat conducting member 12 may be consistent with the size of the second heat conducting member 14, or the size of the first heat conducting member 12 is slightly larger than the size of the second heat conducting member 14, so that the first heat conducting member 12 can be sufficiently separated. The second heat conducting member 14 and the battery 50, the connecting member 24 and the circuit board assembly 30 are used to reduce the abrasion of the second heat conducting member 14.

In some embodiments, the first heat conducting member 12 is made of metal, and the second heat conducting member 14 is made of graphene material or graphite material.

In this way, the first heat conducting member 12 and the second heat conducting member 14 have a better heat conducting effect. In one example, the first heat conducting member 12 may be made of a metal steel sheet. In this way, the first heat conducting member 12 can increase the strength of the flexible heat sink 10 and further increase the strength of the flexible display device 100.

Specifically, a graphene material such as a graphene film and a graphite material such as a graphite sheet. Graphene materials and graphite materials have the advantages of stable structure, high strength, high toughness and flexibility, excellent electrical and thermal conductivity, and good thermal shock resistance, that is, graphite can withstand when used at normal temperature. The temperature changes drastically without causing damage. When the temperature changes suddenly, the volume of graphite does not change much, no cracks will occur, and a better second thermally conductive member 14 can be formed.

It can be understood that the first heat-conducting member 12 is not limited to being made of a metal material, and the second heat-conducting member 14 is not limited to being made of the above-mentioned graphene material and graphite material, and an appropriate material may be selected in a specific implementation However, preferably, in the embodiment of the present application, the thermal conductivity of the second thermally conductive member 14 is greater than the thermal conductivity of the first thermally conductive member 12.

In some embodiments, the bearing assembly 20 includes a connecting member 24. The connecting member 24 connects the first bearing member 22 and the second bearing member 26. The connecting member 24 is thermally connected to the flexible heat sink 10.

The first sub-back cover 42 covers the first carrier 22 and the second sub-back 46 covers the second carrier 26. The connecting member 24 divides the flexible display device 100 into a first part and a second part. The first part includes the first part. The carrier 22 and the first sub-back cover 42, the second part includes the second carrier 26 and the second sub-back 46, and the connecting part 24 connects the first part and the second part, and the first part and the second part can pass through the connecting part 24 Bend and flatten.

In one embodiment, the connecting member 24 may be a hinge, and the first bearing member 22 and the second bearing member 26 may be connected to the connecting member 24 by welding or screwing. In this embodiment, the connecting member 24 is made of a metal material, so that the connecting member 24 has higher strength and better thermal conductivity. In other embodiments, the connecting member 24 may also be a structure having a certain bending ability, such as a component made of plastic, polymer material, and metal material.

Specifically, the connecting member 24 is fixedly connected to the flexible heat sink 10, and the battery 50 is located on the other side of the connecting member 24 facing away from the circuit board assembly 30. The heating power of the circuit board assembly 30 is large and generates a large amount of heat. The battery 50 generates less heat than the circuit board assembly 30. The heat generated by the circuit board assembly 30 can be conducted to the connecting member 24 and the battery through the flexible heat sink 10 The second sub-back cover 46 corresponding to 50 is used to evenly dissipate heat and avoid the temperature of the first sub-back cover 42 corresponding to the circuit board assembly 30 being high.

The first heat conducting member 12 is fixedly disposed with the battery 50, the connecting member 24, and the circuit board assembly 30, and the second heat conducting member 14 is fixedly disposed with the back cover assembly 40.

The fixed arrangement of the first heat conducting member 12 and the battery 50, the connecting member 24, and the circuit board assembly 30 can be understood as that the battery 50, the connecting member 24, and the circuit board assembly 30 are connected to each other through the first heat conducting member 12, on the one hand, the circuit board assembly can be connected The heat of 30 is averaged to the battery 50 and the connecting member 24, and then conducts the heat to the second heat conducting member 14 to dissipate the heat through the back cover assembly 40. On the other hand, the first heat conducting member 12 can carry the battery 50 and the connecting member 24 And the circuit board assembly 30 to improve the stability of the flexible display device 100.

In some embodiments, the rear cover assembly 40 includes a cover 44 connecting the first sub-back 42 and the second sub-back 46, and the cover 44 covers a portion of the flexible heat sink 10 corresponding to the connection member 24.

Specifically, the flexible display device 100 can be switched between bending and flattening, and the bending and flattening of the flexible display device 100 are realized by the deformation of the connecting member 24. When the flexible display device 100 is bent, the bare connecting member 24 may pinch the user's hand, and the bare connecting member 24 is also easily damaged by the external environment, such as water vapor, impurities, and the like. Especially when the connecting member 24 is a metal hinge, the influence is more significant.

Therefore, a cover member 44 is provided to connect the first sub-back cover 42 and the second sub-back cover 46 to cover the connection member 24, thereby protecting the connection member 24. The first sub-back cover 42 and the second sub-back cover 46 are connected to each other through the cover 44 and form a continuous plane, and the flexible heat sink 10 can be attached to the above plane. The cover 44 connects the first sub-back 42 and the second sub-back 46, and the heat conducted to the first sub-back 42 can be conducted to the second sub-back 46 and the second sub-back 46 through the cover 44. The heat can be conducted to the first sub-back cover 42 through the cover 44. Since the cover 44 covers a portion of the flexible heat radiating member 10 corresponding to the connecting member 24, the heat conducted to the flexible heat radiating member 10 can also be directly radiated through the cover 44.

In one embodiment, the cover 44 is made of a silicone material, a graphene silicone material, a polymer material, or a metal material.

Specifically, taking a polymer such as polyimide (PI) material as an example, it has excellent heat resistance, excellent mechanical properties, good chemical stability, humidity and heat resistance, good radiation resistance, and good In addition to the dielectric properties of polyimide, polyimide also has the characteristics of low temperature resistance, low expansion coefficient, flame retardancy and good biocompatibility, which can better prevent water and gas from entering the flexible display device 100. With better heat dissipation, the strength of the back cover assembly 40 can be improved, and the strength of the flexible display device 100 can be further improved.

It can be understood that the covering member 44 is not limited to the above-mentioned silicon material, graphene silicon material, polymer material, or metal material, and may be specifically selected in specific implementation embodiments. Preferably, the cover 44 may be a graphene silica gel material with excellent heat dissipation performance.

Please refer to FIG. 2, FIG. 4 and FIG. 9. In some embodiments, the first sub-back cover 42 includes a first inner surface 424 that fits the flexible heat sink 10. The second sub-back cover 46 includes a second inner surface 464 attached to the flexible heat sink 10.

It can be understood that the second heat-conducting plate 14 is closely connected to the first inner surface 424 and the second inner surface 464. The larger the contact area of the flexible heat sink 10 with the first inner surface 424 and the second inner surface 464 is, the larger the area where the flexible heat sink 10 can conduct heat through the first sub-back 42 and the second sub-back 46 is.

In this embodiment, the area where the flexible heat sink 10 is attached to the first inner surface 424 is larger than two thirds of the total area of the first inner surface 424. The area where the flexible heat sink 10 is attached to the second inner surface 464 is larger than two thirds of the total area of the second inner surface 464.

The ratio of the bonding area of the flexible heat sink 10 to the area of the first inner surface 424 and the second inner surface 464 is moderate, so that the flexible heat sink 10 can be better connected with the first sub-back 42 and the second sub-back 46 Fitting heat dissipation also saves material usage of the flexible heat sink 10.

In one embodiment, the flexible heat sink 10 can cover the first inner surface 424 and the second inner surface 464 over the entire surface to increase the contact area between the flexible heat sink 10 and the first sub-back cover 42 and the second sub-back cover 46. It is helpful for heat conduction, and further improves the heat radiation effect of the flexible heat sink 10.

Of course, the attaching ratio of the flexible heat sink 10 to the first inner surface 424 and the second inner surface 464 is not limited to the above-mentioned ratios, and may be specifically selected in specific implementations.

Please refer to FIGS. 4, 6 and 8. In some embodiments, the circuit board assembly 30 includes a first chip 31, a first shield cover 32, a first heat conductor 33 and a mainboard 34. The first chip 31 is disposed on the motherboard 34. The first shielding cover 32 covers the first chip 31, or in other words, the first chip 31 is housed in the first shielding cover 32. The side of the first shield cover 32 away from the main board 34 is attached to the flexible heat sink 10. The first heat-conducting body 33 is housed in the first shielding case 32 and connects the first shielding case 32 and the first chip 31.

Specifically, the first chip 31 and the first heat conductor 33 are stacked and housed in the first shielding cover 32. The arrangement of the first shield cover 32 can increase the heat dissipation area of the motherboard 34 and protect the first chip 31. The heat dissipation between the first chip 31 and the remaining components in the flexible display device 100 does not affect each other, which can improve the heat dissipation efficiency. The arrangement of the first heat conductor 33 can improve the efficiency of heat conduction between the first chip 31 and the first shield cover 32.

Further, the first chip 31 may be, for example, a central processing unit (CPU), an image processing unit (GPU), a digital signal processor (DSP), a modem (Modem), navigation positioning, multimedia, and other chips or processing modules. The main board 34 may be a printed circuit board (PCB) and is electrically connected to the battery 50 through a wire. The first chip 31 is electrically disposed on the main board 34.

In some embodiments, the circuit board assembly 30 further includes a second chip 35, a second shielding cover 36, and a second heat conductor 37. The second chip 35 and the first chip 31 are respectively disposed on opposite sides of the main board 34. The second shielding cover 36 houses the second chip 35, or the second chip 35 is housed in the second shielding cover 36. A side of the second shielding cover 36 away from the main board 34 is attached to the first supporting member 22. The second heat-conducting body 37 is housed in the second shielding cover 36 and connects the second shielding cover 36 and the second chip 35.

Specifically, the second chip 35 and the second heat conductor 37 are stacked and housed in the second shielding cover 36, and the heat generated by the second chip 35 can be conducted to the first carrier 22 and dissipated by the second shielding cover 36. The second shielding cover 32 can be used for protecting the second chip 35.

The provision of the second heat conductor 37 can improve the efficiency of heat conduction between the second chip 35 and the second shield cover 36. Further, the second chip 35 may be, for example, a central processing unit (CPU), an image processing unit (GPU), a digital signal processor (DSP), a modem (Modem), navigation positioning, multimedia and other chips or processing modules. The chip 35 is electrically disposed on the motherboard 34. Furthermore, the function of the second chip 35 is different from that of the first chip 36.

In some embodiments, the thermal conductor includes a first thermal conductor 33 and a second thermal conductor 37, and the materials used for the first thermal conductor 33 and the second thermal conductor 37 both include thermal silica gel.

Specifically, thermally conductive silica gel is a thermally conductive compound, which has relatively high thermal conductivity and thermal conductivity, resistance to cold and heat alternation, aging resistance, and electrical insulation, and has excellent moisture resistance, shock resistance, corona resistance, and leakage resistance. , Wider use temperature, resistance to chemical media, lower consistency and better use stability. As well as good construction performance, it has good adhesion to most metal and non-metal materials, and can have a good adhesion and protection effect on the first chip 31 and the second chip 35, and improve the safety of the circuit board assembly 30 Performance, to further ensure the safety and service life of the flexible display device 100.

Please refer to FIGS. 2, 4 and 6. In some embodiments, the flexible display device 100 includes a flexible support assembly 60 and a flexible display screen 70 disposed on the flexible support assembly 60. The flexible supporting component 60 is disposed on the carrying component 20. The flexible support assembly 60 includes a first support member 62 and a second support member 64 stacked on the first support member 62. The first supporting member 62 is fixed on the supporting component 20. The flexible display screen 70 is fixed on the second support 64.

Specifically, the flexible supporting component 60 is disposed on the carrying component 20. On the one hand, the flexible supporting component 60 can be used to carry the flexible display 70 to space the flexible display 70 and the carrying component 20 to prevent the flexible display 70 from being deformed by the carrying component 20. To prevent the flexible display 70 from being damaged.

Please refer to FIGS. 2 and 7 further, the first bearing member 22 and the second bearing member 26 are disposed at the upper edges of the connecting member 26, and the first bearing member 22, the connecting member 24 and the second bearing member 26 form a continuous plane. A third receiving space 222 and a fourth receiving space 262 are formed in the first bearing member 22 and the second bearing member 24, respectively. The third receiving space 222 and the fourth receiving space 262 receive the flexible support assembly 60 and the flexible display. Screen 70.

In this way, the flexible supporting component 60 and the flexible display screen 70 are relatively stably disposed on the carrying component 20 and can form a regular and beautiful flexible display device 100.

In some embodiments, the first support member 62 is made of a metal material, and the second support member 64 is made of a liquid metal material.

In this way, the first support member 62 and the second support member 64 have higher strength and better thermal conductivity, and can form a flexible support assembly 60 having higher strength and better thermal conductivity, and enhance the circuit board assembly 30 through the flexible support assembly. The ability to dissipate heat to the flexible display 70.

In summary, the carrier assembly 20 and the back cover assembly 40 respectively form two heat dissipation paths, that is, the carrier assembly 20 and the back cover assembly 40 can dissipate the heat of the circuit board assembly 30 and the battery 50 through two different directions.

When the flexible display device 100 is in the unfolded state, the first carrier 22, the second carrier 26, the first sub-back cover 42 and the second sub-back cover 46 all serve as main heat dissipation paths for heat dissipation. Since the heat of the circuit board assembly 30 is higher than that of the battery 50, the heat of the circuit board assembly 30 can be conducted to the first carrier 22 and the first carrier 22 through the second heat conductor 37 and the second heat shield 36 in sequence. The heat of 22 can be conducted to the second carrier 26 through the flexible support assembly 60 to achieve uniform temperature heat dissipation.

At the same time, the heat of the circuit board assembly 30 can also be conducted to the flexible heat sink 10 through the first heat conductor 33 and the first heat shield 32 in sequence, and the heat conducted to the flexible heat sink 10 can be dissipated through the first back cover 42. It can be conducted to the second back cover 46 for uniform temperature heat dissipation.

However, when the flexible display device 100 is in a folded state, the first carrier 22 and the second carrier 26 are close to each other or even come into contact with each other, so that there is less space for emitting heat to the outside and lower heat dissipation efficiency. Therefore, in the folded state, heat is mainly dissipated through another heat dissipation path, that is, through the rear cover assembly 40 still located on the outside. One part of the heat of the circuit board assembly 30 is conducted to the first sub-back 42 through the flexible heat sink 10, and the other part is conducted to the second sub-back 46 through the flexible heat-conducting member 10. The heat of the battery 50 and transmitted by the flexible heat-conducting member 10 The heat of the passed circuit board assembly 30 is dissipated through the second sub-back cover 46. The cover 44 connects the first sub-back 42 and the second sub-back 46, and the heat conducted to the first sub-back 42 can be conducted to the second sub-back 46 and the second sub-back 46 through the cover 44. The heat can be conducted to the first sub-back cover 42 through the cover 44. Since the covering member 44 covers a portion of the flexible heat conducting member 10 corresponding to the connecting member 24, the heat conducted to the flexible heat conducting member 10 can also be directly radiated through the covering member 44. The heat of the flexible display device 100 can achieve uniform temperature and large area heat dissipation through the overall heat dissipation of the back cover assembly 40, thereby ensuring overall heat dissipation efficiency.

It can be understood that the flexible heat-dissipating member 10 can also include only the second heat-conducting member 14, that is, the second heat-conducting member 14 can simultaneously perform the heat-conducting function and the supporting function.

Further, when the connecting member 24 is made of a metal material, it can also be used as a heat dissipation path to dissipate the heat of the battery 50 and the circuit board assembly 30. That is, the first bearing member 22, the second bearing member 26, the flexible heat sink 10, the first sub-back cover 42 and the second sub-back cover 46 can further transfer heat to the connecting member 24, and then radiate to the outside through the connecting member 24 to Further improve the cooling effect.

In the embodiment of the present application, the flexible display screen 70 of the flexible display device 100 belongs to a form of inversion, that is, after the flexible display device 100 is folded, the flexible display screen 70 is located inside the fold, and the back cover assembly 40 is located outside the fold. Of course, it can be understood that the flexible display device 100 of the present application is not limited to the form of inversion, and the inverted flexible display device 100 can also be applied.

In the description of the present specification, descriptions with reference to the terms “one embodiment”, “some embodiments”, “exemplary embodiments”, “examples”, “specific examples”, or “some examples” and the like mean that in combination with Specific features, structures, materials, or characteristics described in the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same implementation or example. Moreover, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more implementations or examples.

Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirit of the present application, The scope of the application is defined by the claims and their equivalents.

Claims

A flexible display device includes:

A bearing assembly, the bearing assembly comprising a first bearing and a second bearing spaced from the first bearing;

A rear cover assembly comprising a first sub-back cover and a second sub-back cover, the first sub-back cover is connected to the first carrier, and the second sub-back cover is connected to the second sub-back cover The carrier is connected, and the material of the first sub-back and the second sub-back includes graphene plastic; and

A circuit board assembly disposed between the first carrier and the first sub-back cover.
The flexible display device according to claim 1, wherein the flexible display device comprises a battery, and the battery is disposed between the second carrier and the second sub-back cover.
The flexible display device according to claim 2, wherein the first supporting member and the first sub-back cover are connected and jointly form a first accommodating space, and the circuit board assembly is received in the first In an accommodation space;

The second carrier and the second sub-back cover are connected and together form a second accommodating space, and the battery is accommodated in the second accommodating space.
The flexible display device according to claim 1, wherein when the flexible display device is bent, the first carrier and the second carrier are close to each other;

When the flexible display device is flattened, the first carrier and the second carrier are separated from each other.
The flexible display device according to claim 4, wherein when the flexible display device is bent, a distance between the first sub-back cover and the second sub-back cover is greater than the first carrier Distance from the second carrier.
The flexible display device according to claim 1, wherein the flexible display device comprises a flexible heat dissipating member, and the flexible heat dissipating member is thermally connected to the circuit board assembly, the first sub-back cover, and the first heat dissipation member. Second child back cover.
The flexible display device according to claim 6, wherein the flexible heat dissipating member comprises a first heat conducting member and a second heat conducting member arranged in a stack, and the second heat conducting member is disposed on the back cover assembly, and The first heat conducting member is disposed on a side of the second heat conducting member remote from the back cover assembly.
The flexible display device according to claim 6, wherein the first heat conducting member is attached to the circuit board assembly, and the second heat conducting member is attached to the first sub-back cover and the Cover the second child.
The flexible display device according to claim 6, wherein the thermal conductivity of the first thermally conductive member is lower than the thermal conductivity of the second thermally conductive member, and the hardness of the first thermally conductive member is greater than that of the second thermally conductive member. Piece hardness.
The flexible display device according to claim 6, wherein the first heat conducting member is made of a metal material, and the second heat conducting member is made of a graphene material or a graphite material.
The flexible display device according to claim 6, wherein the bearing assembly comprises a connecting member, the connecting member connects the first bearing member and the second bearing member, and the connecting member is thermally conductively connected to the bearing member. The flexible heat sink connection is described.
The flexible display device according to claim 11, wherein the back cover assembly further comprises a cover connecting the first sub back cover and the second sub back cover, and the cover covers the flexible A portion of the heat dissipation member corresponding to the connecting member.
The flexible display device according to claim 6, wherein the first sub-back cover includes a first inner surface that is attached to the flexible heat sink, and the flexible heat sink is attached to the first inner surface. The combined area is greater than two thirds of the total area of the first inner surface;

The second sub-back cover includes a second inner surface that is attached to the flexible heat sink, and an area that the flexible heat sink is attached to the second inner surface is greater than three-thirds of the total area of the second inner surface. of two.
The flexible display device according to claim 1, wherein the circuit board assembly comprises:

Motherboard

A first chip provided on the motherboard; and

A first shielding cover covering the first chip is thermally connected to the flexible heat sink on a side of the first shielding cover remote from the motherboard.
The flexible display device according to claim 14, wherein the circuit board assembly comprises a heat conductor, the heat conductor is housed in the first shield case and is thermally connected to the first shield case and the heat sink. First chip.
The flexible display device according to claim 14, wherein the circuit board assembly further comprises:

A second chip disposed on the main board, the second chip and the first chip being disposed on opposite sides of the main board; and

A second shielding cover covering the second chip, and a side of the second shielding cover remote from the main board is thermally connected to the first carrier.
The flexible display device according to claim 16, wherein the circuit board assembly further comprises a heat conductor, the heat conductor is housed in the second shield case and is thermally connected to the second shield case and the second shield case. Mentioned second chip.
The flexible display device according to claim 15 or 17, wherein the thermal conductor comprises a thermally conductive silica gel.
The flexible display device according to claim 1, wherein the flexible display device comprises a flexible support component and a flexible display screen disposed on the flexible support component, and the flexible display screen is provided through the flexible support component On the bearing component.
The flexible display device according to claim 19, wherein the flexible supporting assembly comprises a first supporting member and a second supporting member which are arranged in a stack, and the first supporting member is fixedly disposed on the bearing assembly, and The second supporting member is disposed on a side of the first supporting member remote from the supporting member, and the flexible display screen is disposed on the second supporting member.