WO2020016636A1 - Thermal sensor for monitoring pcb soldering temperature and respective pcb, manufacturing and monitoring method thereof - Google Patents
Thermal sensor for monitoring pcb soldering temperature and respective pcb, manufacturing and monitoring method thereof Download PDFInfo
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
Abstract
Thermal sensor, manufacturing and method for monitoring soldering temperature of a component in a printed circuit board, PCB, for placing between a PCB solder pad and a corresponding component lead to be soldered to said PCB pad, the sensor comprising: a first metallic layer; a second metallic layer; wherein the first metallic layer and the second metallic layer are of dissimilar metallic materials; the first metallic layer and the second metallic layer are overlaid in the region between the component lead and the PCB pad to form a contact thermocouple in said region. The thermal sensor may comprise: an upper solder protection layer for protecting the sensor from the soldering of the component to the PCB; a topmost solderability layer for the soldering of the component lead to the top of the sensor; a bottom electrical insulation layer from the PCB; and/or an electrical insulation layer immediately over the sensor metallic layers.
Description
D E S C R I P T I O N
THERMAL SENSOR FOR MONITORING PCB SOLDERING TEMPERATURE AND RESPECTIVE PCB, MANUFACTURING AND MONITORING METHOD THEREOF
Technical field
[0001] The present disclosure relates to a method of monitoring thermal profiles in mass soldering processes used in soldering electronic components to printed circuit boards (PCB) and more particularly to a thermocouple sensor formed by thin film deposition and/or printing processes used for monitoring the temperature profiles in electronic components footprints.
Background
[0002] Mass soldering processes used for PCB assembly require thermal treatments which must assure high quality solder joints. Each product will require a specific thermal profile which is mainly determined by its thermal mass and by the solder paste. A proper thermal profile must ensure that all components even with different thermal masses meet the adequate thermal profiles, which requires that the minimum temperature is achieved in all components, in order to ensure the formation of proper solder joints, without exceeding the maximum temperature, which would cause damage in the component and compromise the solder joint quality. The increasing complexity of PCB design, combining large thermal mass components (such as large ball grid array (BGA), quad flat package (QFP), quad flat, no leads (QFN), electrolytic capacitor) with small thermal mass components (such as chip resistors and capacitors like 0201) represents the main challenge in the definition of proper thermal profiles. The current method used for defining thermal profiles for PCB assembly uses thermocouples attached to high thermal mass components (BGA, QFN, QFP, electrolytic capacitor) and low thermal mass components (chip resistors and capacitors and PCB), being the thermocouple attachment method high temperature solder, conductive adhesives or tapes. Those thermocouples are typically type K thermocouples with 36 American Wire Gauge (AWG) size, being the size of the temperature measuring point about 500 pm. The thermocouples are manually attached to the components after PCB assembly. This method is described and defined in detail in the IPC-7530A standard, which represents the standard followed by electronic industries for temperature profiling for mass soldering processes [Association Connecting Electronic Industries, IPC— 7530- A, "Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave), 20171].
[0003] The size of solder joints to be monitored is in a range of hundreds of micrometers and it reaches in some cases 300 miti; thus, being smaller than the size of the wire thermocouple sensing point. In some components, such as BGA, the thermal profiles in ball grids, sitting below the component, must be monitored. However, the wire thermocouples bring some limitations since it is physically impossible to place the thermocouple below the component without changing the PCB. In order to monitor these solder joints, it is necessary to drill a hole in the inner and outer rows of the BGA pads from the bottom of the board and aftermost push the thermocouple to the top surface. Considering the small size of the solder joints to be monitored and the fact that the process is manually performed, the accurate positioning of the thermocouple sensing point is difficult to perform, and with the constant miniaturization of components the correct positioning of the thermocouple will get more and more challenging.
[0004] Thin film thermocouples have been used in several applications where wire thermocouples are not appropriate. The use of thin film thermocouples deposited in PCB for monitoring the thermal profiles in mass soldering processes, more particularly in reflow soldering, deposited on PCB boards allow to overcome some of the limitations related with the use of wire thermocouples, namely (i) small sensing points can be deposited, with sizes below 300 pm, thus compatible with the size of solder joints to be monitored, being the sensing point positioning accurate and (ii) the solder joints sitting below the component can be monitored without the need of drilling the PCB, which changes the PCB thermal mass.
[0005] A number of references have disclosed thin film thermocouples for different applications such as paper copier [see, US5411600], rapid thermal processing of silicon wafers [US6037645], combustion engine [US5215597], medical devices [US4935345], among others [US 667058282, US 8033722B2, US5251981, US5281025, CN205157074, CN104748876, CN203643055U], being the choice of sensor design, materials for thermocouples as well as the choice of additional layers like adhesion layers, diffusion barrier layers and protective layers among others, dependent on the application.
[0006] The sensor design and materials must be preferably optimized taking into account the working conditions (e.g. mechanical resistance, corrosion resistance in a given temperature range). Thus, the thin film thermocouple design must preferably be enhanced for printing and/or deposition in PCB and optimized in order to not interfere with mass soldering processes.
General Description
[0007] The present disclosure relates to a method for monitoring thermal profiles in mass soldering processes used in soldering electronic components to printed circuit boards (PCB); more particularly to a thermocouple sensor formed by thin film deposition and/or printing processes, for monitoring the temperature profiles in solder joints.
[0008] An object of the present disclosure goal is to place a thermal sensor in a PCB, more particularly in electronic component footprint above which the component is placed and soldered. Thus; the sensor should preferably, be printed on the test PCB before the components placement and soldering in order to allow the precise positioning of the sensor on the component solder pad, where solder joints are formed. The printed sensor cannot interfere with the solder paste printing process and it should preferably guarantee that a proper interconnection is formed between the component and the PCB. After production of test PCB with printed and / or deposited thermal sensors the components are placed on the test PCB and soldered on it. The test PCB with printed and /or deposited thermal sensors, containing electrical components represents the calibration PCB used for defining and/or monitoring the thermal profiles used in mass soldering processes. The thermal profiles are acquired by connecting the PCB to thermal profilers used in monitoring of mass soldering processes.
[0009] An aspect of the present disclosure relates to a thermal sensor for monitoring soldering temperature of a component in a printed circuit board, PCB, for placing between a PCB solder pad and a corresponding component lead to be soldered to said PCB pad, the sensor comprising:
a first metallic layer, and
a second metallic layer;
wherein the first metallic layer and the second metallic layer are of dissimilar metallic materials, wherein the first metallic layer and the second metallic layer are overlaid in the region between the component lead and the PCB pad to form a contact thermocouple in said region.
[0010] In an embodiment, the thermal sensor of the present disclosure may comprise an upper solder protection layer for protecting the sensor from the soldering of the component to the PCB.
[0011] In an embodiment, the thermal sensor of the present disclosure may comprise a topmost solderability layer for the soldering of the component lead to the top of the sensor. The solderability layer has the ability to form intermetallic bonds with the solder paste.
[0012] In an embodiment, the thermal sensor of the present disclosure may comprise a bottom electrical insulation layer for insulating the sensor from the PCB.
[0013] The electrical insulating layer is a layer that does not interfere on thermoelectric response of the sensor.
[0014] In an embodiment, the thermal sensor of the present disclosure may comprise an electrical insulation layer over the sensor metallic layers. The electrically insulating layer over the sensor metallic layer has the ability of protecting the solder from interfering in the sensor signal.
[0015] In an embodiment, the thermal sensor of the present disclosure may comprise uncovered extensions layers of the first metallic layer and the second metallic layer for providing sensor terminals for the sensor, preferably uncovered extensions layer is copper.
[0016] In an embodiment, the providing of the first or second or both metallic layers may be by printing or depositing.
[0017] In an embodiment, the uncovered extensions layers comprise a finish layer, preferably the finish layer is selected from a list of: organic solderability preservative (OSP); immersion tin (i-Sn); electroless nickel immersion gold (ENiG), hot air solder level (HASL).
[0018] In an embodiment, the electrical insulating layer thickness is between 20 pm to 30 pm.
[0019] In an embodiment, the first or the second metallic layer are independently selected from a list consisting of chromium; aluminium; nickel; silver; and alloys thereof.
[0020] In an embodiment, the alloys are a nickel/aluminium alloy (alumel); nickel/chromium alloy (chromel); silver alloy/nickel alloy.
[0021] In an embodiment, the thickness of the thermal sensor is between 40 pm and 100 pm.
[0022] In an embodiment, the thermal sensor of the present disclosure may comprise connection wires comprising the same material of the correspondent metallic layer.
[0023] In an embodiment, the thermal profiler comprises a voltage acquisition system arranged to acquire the thermal profiler acquisition of the mass soldering processes.
[0024] Another aspect of the present disclosure relates to a printed circuit board, PCB, comprising the thermal sensor of the present disclosure.
[0025] Another aspect of the present disclosure relates to a method of manufacturing a printed circuit board, PCB, comprising a thermal sensor for monitoring soldering temperature of a component in the PCB, placed between a PCB solder pad and a corresponding component lead to be soldered to said PCB pad, the method comprising: providing a first metallic layer; providing a second metallic layer such that the first metallic layer and the second metallic layer overlay in the region between the component lead and the PCB pad to form a contact thermocouple in said region; wherein the first metallic layer and the second metallic layer are of dissimilar metallic materials.
[0026] Another aspect of the present disclosure relates to a method for monitoring temperature of a printed circuit board, PCB, when soldering a component to the PCB, said PCB comprising a thermal sensor placed between a PCB solder pad and a corresponding component lead to be soldered to said PCB pad; the sensor comprising a first metallic layer and a second metallic layer, wherein the first metallic layer and the second metallic layer are of dissimilar metallic materials, and the first metallic layer and the second metallic layer are overlaid in the region between the component lead and the PCB pad to form a contact thermocouple in said region; the method comprising measuring a temperature-dependent voltage of the thermocouple while soldering the component to the PCB.
Brief Description of the Drawings
[0027] The following figures provide preferred embodiments for illustrating the description and should not be seen as limiting the scope of invention.
[0028] Figure 1 - shows the top-view design of a deposited or printed thermocouple with the identification of different sensor components, wherein 1 represents an extension line for metal/alloy A, 2 represents an extension line for metal/alloy B, 3 represents a junction point/measuring point; 4 represents a contact pad for metal/alloy A extension wire; 5 represents a contact pad for metal/alloy B extension wire; 6 represents metal/alloy A extension wire; 7 represents metal/alloy B extension wire; 8 represents a thermal profiler equipment.
[0029] Figure 2 - shows the cross-sectional side view of the thermocouple; showing the layers present at different components of the thermal sensor; wherein 9 represents the substrate, which is a PCB; 10 represents an electrical insulation layer A; 11 represents a first metal/alloy A; 12 represents a second metal/alloy B; 13 represents an electrical insulation layer B; 14 represents a solder protection layer; 15 represents a solderability layer.
[0030] Figure 3 - schematic sequence of the steps in thermal profile test PCB construction, wherein A represents the PCB layout design, B represents PVD mask and/or screen design; C represents sensor deposition and/or printing, D represents components placement and soldering; E represents attachment of connection wires.
[0031] Figure 4 - Product PCB (A.O.) general view (top-left) and detailed view (bottom-left) and thermal profile test PCB (A.l.) general view (top-right) and detailed view (bottom-right).
[0032] Figure 5 - Schematic representation of sequence of sensor layers deposition and/or printing.
[0033] Figure 6 - Schematic representation of designation of sensor components dimensions on different sensor layers.
Detailed Description
[0034] The present disclosure relates to a method of monitoring thermal profiles in mass soldering processes, used for assembling electronic components in PCB, and more particularly to a thermocouple sensor formed by deposition and/or printing of sensors in PCB. The thermocouple sensors aim to monitor the temperature profiles at solder joints. The printed and/or deposited sensors allow an accurate positioning of the thermal sensing point at the components solder joints; thus, improving the process repeatability and accuracy in relation to the use of wire thermocouples.
[0035] In an embodiment, the thin film thermocouple is formed by depositing or printing metal or alloy A 1 and metal or alloy B 2, which overlap at 3 forming the temperature sensing point, according to the design in Figure 1. Contact pads should be printed and/or deposited for metal or alloy A 4 and metal or alloy B 5, which allow the connection of extension wires for metal or alloy A 6 and metal or alloy B 7 for signal acquisition at thermal profiler 8. The signal acquisition is performed by dedicated thermal profilers used in the monitoring of mass soldering processes. The thermal sensor components are identified in Figure 1.
[0036] In an embodiment, the thin film thermocouple includes the substrate, which is a PCB, 9; an electrical insulation layer A 10; first metal or alloy thin film A 11 deposited over electrical insulation layer A 10; second metal or alloy thin film B 12 deposited over electrical insulation layer A 10 and overlapping a portion of the first metal/alloy layer at 3; an electrical insulation B layer 13 an solder protection layer 14 between thermocouple metal or alloy 11 or 12 and a solderability layer 15. The layers contained in the different sensor components are depicted in Figure 2.
[0037] In an embodiment, the electrical insulation layer A 10 should ensure a proper electrical insulation between the substrate 9 - metal and alloy A 11 and substrate finish layer 9 - metal and alloy B 12; thus the electrical insulation layer A 10 is the first layer of the sensor and it is placed in all printed or deposited sensor components from 1 to 5. The metal or alloy A 11 is printed or deposited over the components 1, 3 and 4, while metal or alloy B is deposited or printed over components 2, 3 and 5. Both metal or alloy A 11 and metal or alloy B 12 overlap at 3, which represents the measurement point that is placed in the component solder pad at the place where the solder joint is formed. The electrical insulation B 13 layer aims to protect the sensor metal and alloys 11 and 12 from any degradation promoted by the solder paste; the solder protection 14 layers aims to avoid the spreading of solder paste out of the component solder pad, which would interfere negatively on the component soldering process. The electrical insulation B 13 layer and solder protection 14 layer are consecutively placed above the metal or alloy A 11 and metal or alloy B 12 in the components 1, 2 and 3 of the sensor; while the components 4 and 5 do not contain electrical insulation B 13 or solder protection layer 14 since they are composed by an electrically insulating material that could avoid the electrical contact between the metal or alloy 11 and 12 and components 4 and 5 should allow the connection of the extension wires 6 and 7, respectively. The metal or alloy A 11 and metal or alloy B 12 should be properly electrically insulated from the solderability layer placed at measurement point 3 in order to avoid any interference on signal acquisition; thus, an electrical insulation layer B 13 is required between the previous layers and the solderability layer 15. The solderability layer 15 aims to allow a proper interconnection between the component and the PCB solder pad in order to guarantee that the component is correctly attached to the PCB and thus a proper thermal conduction occurs.
[0038] In an embodiment, the substrate is a PCB. In a preferred embodiment, the substrate comprises a PCB composed by FR4 (FR4 is a glass-reinforced epoxy laminate material) with a laminated thin copper layer in one sided or double sided or multiple layers of copper and FR4 laminated together; the surface finish on copper layers comprises ENiG; OSP; i-Sn or H ASL. The PCB surface contains solder mask; FR4 and copper layers coated with ENiG; OSP; i-Sn or H ASL on top and bottom surfaces.
[0039] In an embodiment, the electrical insulation layer A 10 should guarantee an electrical insulation between the PCB 9 - metal or alloy A 11 and PCB 9 - metal or alloy B 12. In a preferred embodiment the electrical insulation layer A 10 is composed of a screen printable thermally cured paste with electrical insulating properties.
[0040] In an embodiment, the sensing device is comprised by metal or alloy A 11 and metal or alloy B 12, which overlapping forms the thermal sensing point. In a preferred embodiment the metal or alloy A 11 is composed by chromel or alumel and the metal or alloy B 12 is composed by chromel or alumel, thus forming a printed or deposited type K thermocouple. Other combination of materials are also suitable, namely, silver and nickel, which also form a thermocouple (with a Seebeck constant of 20 pV/°C); the advantage of the later being related with the use of single metals instead of alloys, which are easier to produce, since no proper alloying requirements are needed either on the deposition process or the inks particles production itself.
[0041] In an embodiment, the solder protection layer 14 function is to prevent the spreading of solder paste; thus, it should act in a similar way to solder mask used in PCB production, which should guarantee that the solder paste is retained in the component solder pad where it forms the interconnection bonds between the components and the PCB 9. The solder protection layer 14 can be deposited and/or printed with any material that repels solder paste, acting in a similar way to solder mask, provided that the material is electrically insulating and does not interfere with the thermoelectric response of the thermocouple metals or alloys. This layer should also protect the sensing point from the degradation promoted by solder paste. In a preferred embodiment, the solder protection layer is composed of aluminium oxide.
[0042] In an embodiment, the electrical insulation layer B 13 should fulfil the same requirements of electrical insulation layer A 10. The solderability layer 15 should ensure that the interaction with solder paste is similar to the one found in a PCB, where the requirements for proper interconnection between PCB and component require the presence of a metal that is able to form intermetallic compounds with the solder paste and also the presence of a layer that prevents the oxidation of the previous layer. In a preferred embodiment the solderability layer should resemble the characteristics of the product PCB under test, where solderability layers comprise i-Sn; Ni/Au where Ni guarantees the formation of intermetallic compounds and Au protects Ni from oxidation; copper/OSP, where Cu forms intermetallic compounds and OSP protects copper from oxidation and HASL.
[0043] In a preferred embodiment the sensor layers 10 to 15 are deposited either by physical vapor deposition methods (PVD), screen printing or inkjet printing, either using one of the previously mentioned technologies individually or by combining the different technologies mentioned.
[0044] In an embodiment, the production of thermal profile test PCB follows different steps represented in a schematic diagram in Figure 3. The first step (A) is the PCB layout design. The PCB under evaluation represents a product PCB which is meant to be tested in terms of thermal profile during soldering
processes. The main goal is to optimize the thermal profile of soldering process for the specific product under evaluation. The thermal sensors are designed to be deposited and/or printed on PCB top surface and/or PCB bottom surface.
[0045] In an embodiment, the product PCB top surface and bottom surface contain different surface finish, namely solder mask, FR4 and metallization, the latter being composed of copper layers coated with i-Sn; ENiG; OSP or HASL; and typically, between the different surface finish steps with heights ranging from 5 pm up to 80 pm are found. In order to print and or/deposit a continuous sensor the PCB surface should be flat, since the sensor thickness considering all deposited and /or printed layers in a preferred embodiment ranges from 40 pm up to 100 pm, which means that for the deposition and/or printing of continuous and functional sensors no steps between different PCB surface finish are allowed. Thus, the product PCB should be changed in order to allow the deposition of the sensor components 1 to 5 in a flat surface. Since the surface finish of components solder pads, which represents the sensor measuring point 3, is copper layer coated with i-Sn; ENiG; OSP or HASL, the surface finish in components 1, 2, 4 and 5 should be also copper layer coated with i-Sn; ENiG; OSP or HASL. The test PCB layout should be similar to the product PCB under evaluation in order to not change the thermal properties under evaluation; the only change being related with the creation of copper layer coated with i-Sn; ENiG; OSP and HASL for the deposition and/or printing of the sensor components 1; 2; 4 and 5. No changes in component solder pad, where sensor measuring point 3 is placed, are allowed. The changes in product PCB (A.O.) layout for design of thermal profile test PCB are shown in Figure 4, where a PCB containing an electric component 17 (flat- chip) is represented for the product PCB (A.O.) and for the thermal profile test PCB (A.I.), where the additional copper layers for sensor components 1; 2; 4 and 5 are represented. The electronic component 17 is placed on component solder pad (16) where solder joints are formed. The solder pads 16 contain copper layers with i-Sn, ENiG, OSP or HASL surface finish, being the later surrounded by solder mask 18 and FR4 19. The test PCB (A.l) is similar to product PCB (A.O), nevertheless the copper extension surface is created in order to allow the deposition of sensor components 1; 2; 4 and 5 in a similar surface to the one found in the component solder pad 16.
[0046] In an embodiment, the second step represents the design of screens for screen printing process; PVD masks for PVD process and digital designs for inkjet printing process (B). The screens; masks and digital designs contain the design of the layers to be printed. A total number of 5 masks; screens or digital designs are required. The first mask; screen or digital design for electrical insulation A 10 should guarantee the coverage of sensor components 1 to 5. The second mask; screen or digital design for metal or alloy A 11 should allow the coverage of the sensor components 1; 3 and 4. The third mask; screen or digital design
for metal or alloy B 12 should allow the coverage of the components 2; 3 and 5. The fourth mask; screen or digital design for electrical insulation B 13 and solder protection 14 should guarantee the coverage of sensor components 1; 2 and 3. The fifth mask for solderability layer 15 should allow the coverage of the sensor component 3. In a preferred embodiment the PVD mask is constructed in NickelNanovate® with 200 pm of thickness.
[0047] In an embodiment, the third step is the sensors deposition and/or printing (C). The sensor layers from 10 to 15 can be deposited by physical vapor deposition (PVD) or printed by screen printing or inkjet printing; either using each technology individually or by a combination of different technologies. The sensor layers should be deposited and/or printed in a sequential steps, as described in Figure 5, being the first printed or deposited layer (C.l.) the electrical insulation layer A (10); the second deposited layer can be either metal or alloy A 11 or metal or alloy B 12 (C.2.); the third deposited or printed layer can be either metal or alloy A 11 or metal or alloy B 12 (C.3.); the fourth deposited or printed layer is the electrical insulation B layer 13 and the fifth deposited or printed layer is solder protection layer 14 (C.4); and the sixth deposited or printed layer is solderability layer 15 (C.5.). In a preferred embodiment the sensor patterning in PVD technology is performed by using shadow masks; which are aligned with the PCB under optical microscope observation being the alignment object a fiducial present in PCB and patterned on the shadow mask; being the line width of the fiducial 300 pm.
[0048] In an embodiment, the fourth step D the electronic components are placed and soldered in the test PCB.
[0049] In an embodiment, the fifth step E the metal or alloy A extension wire 6 is attached to the contact pad for metal or alloy A extension wire 4 and metal or alloy B extension wire 7 is attached to the contact pad for metal or alloy B extension wire 5. In a preferred embodiment the extension wires are AWG36 wires. The extension metal or alloy wire A 6 should be constructed on the same material that the deposited or printed metal or alloy A 11 and extension metal or alloy B 7 should be constructed on same material than deposited or printed metal or alloy B 12. The attachment method should ensure that the connection material does not change the thermoelectric response of the thermal sensor and also that no electrical insulation occurs between the contact pads and extension wires.
[0050] In an embodiment, the first step on construction of thermal profile test PCB is the design of the PCB layout (A), according to Figure 3. In this stage changes on the product PCB (A.O.), which is subject of thermal profile analysis, are required in order to allow the deposition of thermal sensor over a flat PCB
surface, following Figure 4 and Figure 5. The PCB surface laying below the deposited and/or printed sensor components 1 to 5 is a copper surface coated with i-Sn; ENiG; OSP or HASL
[0051] In an embodiment, the solder pad 16 design on test PCB (A.l) should be similar to the solder pad design on product PCB (A.0). The design of copper layers for sensor components 1; 2; 4 and 5 printing and/or deposition are required; according to the Figure 5 (A.l.). The product PCB (A.0.) contains a solder pad 16 where the electronic component is placed, the latter being the target point of thermal monitoring where the sensor measuring point 3 is placed. The component solder pad 16 is placed on PCB top surface or bottom surface and it contains copper layer coated with i-Sn; ENiG; OSP or HASL; the solder pad can be surrounded either by solder mask or by FR4, depending if the solder pad is solder mask defined (SMD), for which the copper layer is surrounded by solder mask, or non-solder mask defined (NSMD), for which the copper layer is surrounded by FR4. In the thermal profile test PCB (A.l.) the copper layer should be non solder mask defined (NSMD), being the width between solder mask 18 and copper layer in a preferred embodiment between 100 pm to 200 pm, the later containing FR4 19.
[0052] In an embodiment, the designation of dimensions of sensor layers in different sensor components are given in Figure 6.
[0053] In an embodiment, the length of copper layer for printing or deposition of sensor component 1, (Y1.0) and length of copper layer for printing or deposition of sensor component 2, (Y2.0), should be as short as possible in order to avoid thermal dissipation. In a preferred embodiment the lengths (Y1.0) and (Y2.0) should be between 2 mm to 50 mm. The copper layers for sensor components 1 and 2 deposition and/or printing should be straight in order to avoid defects (short circuits) in deposited or printed sensors arising from the presence of complex line geometries. In a preferred embodiment the widths (X4.0) and (X5.0) and heights (Y4.0) and (Y5.0) of copper layer for printing or deposition of the sensor components 4 and 5 is 5 mm x 5 mm.
[0054] In an embodiment, the widths (XI.0) and (X2.0) of copper layer for deposition or printing of sensor components 1 and 2 should be larger than the width of metal or alloy layer A (XI.11) and the width of metal or alloy layer B (X2.12). In a preferred embodiment the (XI.0) width is 200 pm higher than (XI.11) and the (X2.0) width is 200 pm higher than (X2.12) width.
[0055] In an embodiment, the width of component solder pad 16 (X16) and height of component solder pad 16 (Y16) is similar to the component solder pad in the product PCB (A.0), as well as its geometry.
[0056] In an embodiment, the first printed or deposited layer is the electrical insulation layer A 10, which should cover sensor components 1 to 5 according to the design in Figure 5 (C.l). The geometry of electrical insulation layer A is similar to the copper layer geometry contained in the PCB in sensor components 1; 2; 4 and 5, being its widths and length larger than the width and lengths of copper layer sitting below the electrical insulation A 10 in order to compensate for displacement on layer 10 printing or deposition, since it should be guaranteed that the copper layer sitting below electrical insulation layer A 10 is fully covered with an electrical insulation material. In a preferred embodiment, the increase in dimension should be 200 pm from (XI.0) to (XI.10); 200 pm from (X2.0) to (X2.10); 200 pm from (X4.0) to (X4.10); 200 pm from (X5.0) to (X5.10); 200 pm from (Y4.0) to (Y4.10) and 200 pm from (Y5.0) to (Y5.10). The heights (Y1.10) and (Y2.10) are similar to the heights (Y1.0) and (Y2.0), respectively.
[0057] In an embodiment, the geometry of electrical insulation layer A 10 in sensor component 3 is similar to the geometry of sensor component 3; the latter being determined by sensor layers metal and alloy A 11 and metal and alloy B 12; provided that the electrical insulation layer A is wider in order to compensate the displacement. In a preferred embodiment the width (X3.10) and length (Y3.10) are 200 pm wider and longer in relation to widths (X3.ll) and (X3.12) and lengths (Y3.ll) and (Y3.12), respectively.
[0058] In an embodiment, the thickness of electrical insulation layer should ensure a proper electrical insulation. In a preferred embodiment the thickness of electrical insulating layer A 10 ranges from 20 pm to 30 pm.
[0059] In an embodiment, the printed or deposited sensor layers geometry and dimensions on sensor component 3 are determined by the solder pad 16 dimension and geometry on product PCB (A.0). The geometry of printed or deposited sensor layer can be similar to solder pad dimensions and geometry or smaller than the solder pad dimensions comprising any type of geometry, not limited to the solder pad geometry. The dimensions and geometry of sensor component 3 are determined by the dimensions and geometry of metal or alloy A 11 and metal and alloy B 12 overlapping at PCB solder pad 16.
[0060] In an embodiment, the width of sensor component 1 is determined by the width of metal or alloy A 11 in component 1, (XI.11). In a preferred embodiment the width (XI.11) is 100 pm to 300 pm. The width of sensor component 2 is determined by the width of metal or alloy B 12 in component 2, (X2.12). In a preferred embodiment the width (X2.12) ranges between 100 pm to 300 pm. The length of metal or alloy A 11 in sensor component 1, (Yl.ll) is similar to the copper layer length in sensor component 1, (Y1.0). The length of metal or alloy B 12 in sensor component 2, (Y2.12) is similar to the copper layer length in sensor component 2, (Y2.0).
[0061] In an embodiment, the width (X4.ll) and length (Y4.ll) of metal or alloy layer A 11 on sensor component 4 should be smaller than the width (X4.0) and length (Y4.0) of copper layer on sensor component 4. In a preferred embodiment the reduction in dimension should be 200 pm from (X4.0) to (X4.ll) and 200 pm from (Y4.0) to (Y4.ll).
[0062] In an embodiment, the width (X5.12) and length (Y5.12) of metal or alloy layer B 12 on sensor component 5 should be smaller than the width (X5.0) and length (Y5.0) of copper layer on sensor component 5. In a preferred embodiment the reduction in dimension should be 200 pm from (X5.0) to (X5.12) and 200 pm from (Y5.0) to (Y5.12).
[0063] In an embodiment, the fourth printed or deposited layer is electrical insulation layer B 13, which should cover sensor components 1; 2 and 3 according to the design in Figure 5 (C.4.). The electrical insulation layer B 13 geometry and dimension are similar to the geometry and dimension of electrical insulation layer A 10; nevertheless, in the sensor components 4 and 5 no electrical insulation B 13 is printed or deposited.
[0064] In an embodiment, the fifth printed or deposited layer is solder protection 14 and the sixth printed or deposited layer is solderability layer 15, both showing similar geometry and dimensions, following the Figure 5 (C.5.). The sensor layers 14 and 15 should cover the electrical insulation layer B 13 in sensor component 3, showing similar geometry and dimensions.
[0065] The term "comprising" whenever used in this document is intended to indicate the presence of stated features, integers, steps, components, but not to preclude the presence or addition of one or more other features, integers, steps, components or groups thereof.
[0066] The disclosure should not be seen in any way restricted to the embodiments described and a person with ordinary skill in the art will foresee many possibilities to modifications thereof. The above described embodiments are combinable. The following claims further set out embodiments of the disclosure.
Claims
1. A thermal sensor for monitoring soldering temperature of a component in a printed circuit board, PCB (9), for placing between a PCB solder pad and a corresponding component lead to be soldered to said PCB (9) pad, the sensor comprising:
a first metallic layer (11), and
a second metallic layer (12);
wherein the first metallic layer (11) and the second metallic layer (12) are of dissimilar metallic materials,
wherein the first metallic layer (11) and the second metallic layer (12) are overlaid in a region (3) between the component lead and the PCB (9) pad to form a contact thermocouple in said region (3).
2. The thermal sensor according to the previous claim comprising an upper solder protection layer (14) for protecting the sensor from soldering of the component to the PCB (9).
3. The thermal sensor according to any of the previous claims comprising a topmost solderability layer (15) for the soldering of the component lead to the top of the sensor.
4. The thermal sensor according to any of the previous claims comprising a bottom electrical insulation layer (10) for insulating the sensor from the PCB (9).
5. The thermal sensor according to any of the previous claims comprising an electrical insulation layer (10) immediately over the sensor metallic layers.
6. The thermal sensor according to any of the previous claims comprising uncovered extensions layers of the first metallic layer (11) and the second metallic layer (12) for providing sensor terminals for the sensor.
7. The thermal sensor according to any of the previous claims wherein the providing of the first metallic layer (11) or second metallic layer (12) or both metallic layers is by printing or depositing.
8. The thermal sensor according to any of the previous claims wherein first and the second metallic layer (12) are independently selected from a list consisting of chromium, aluminium, nickel, silver, and alloys thereof.
9. The thermal sensor according to the previous claim wherein the alloys are a nickel-aluminium alloy; nickel-chromium alloy, silver alloy or nickel alloy.
10. The thermal sensor according to any of the previous claims wherein the electrical insulating layer (10) thickness is between 20 pm to 30 pm and /or the thickness of the thermal sensor is between 40 pm and 100 pm.
11. A printed circuit board, PCB (9), comprising a thermal sensor according to any of the previous claims.
12. A method of manufacturing a printed circuit board, PCB (9), comprising a thermal sensor for monitoring soldering temperature of a component in the PCB (9), placed between a PCB (9) solder pad and a corresponding component lead to be soldered to said PCB (9) pad, the method comprising: providing a first metallic layer (11);
providing a second metallic layer (12) such that the first metallic layer (11) and the second metallic layer (12) overlay in the region between the component lead and the PCB (9) pad to form a contact thermocouple in said region (3);
wherein the first metallic layer (11) and the second metallic layer (12) are of dissimilar metallic materials.
13. A method for monitoring temperature of a printed circuit board, PCB (9), when soldering a component to the PCB (9), said PCB (9) comprising a thermal sensor placed between a PCB solder pad and a corresponding component lead to be soldered to said PCB (9) pad;
the sensor comprising a first metallic layer (11) and a second metallic layer (12), wherein the first metallic layer (11) and the second metallic layer (12) are of dissimilar metallic materials, and the first metallic layer (11) and the second metallic layer (12) are overlaid in the region between the component lead and the PCB pad to form a contact thermocouple in said region (3);
the method comprising measuring a temperature-dependent voltage of the thermocouple while soldering the component to the PCB (9).
14. The method according to the previous claim comprising the step of acquiring the temperature of the thermocouple using a thermal profiler device.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PT11086418 | 2018-07-19 | ||
| PT110864 | 2018-07-19 |
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| WO2020016636A1 true WO2020016636A1 (en) | 2020-01-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/IB2018/055432 WO2020016636A1 (en) | 2018-07-19 | 2018-07-20 | Thermal sensor for monitoring pcb soldering temperature and respective pcb, manufacturing and monitoring method thereof |
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| WO (1) | WO2020016636A1 (en) |
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| CN112013979A (en) * | 2020-08-18 | 2020-12-01 | 东莞市优琥电子科技有限公司 | Temperature testing device and testing jig for wire end welding dotting |
| WO2023126686A1 (en) | 2021-12-30 | 2023-07-06 | Bosch Car Multimedia Portugal, S.A. | PRINTABLE INK FORMULATION BASED ON NiCr AND NiAl ALLOYS AND METHOD FOR PRODUCING THE PRINTABLE INK FORMULATION |
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