WO2019197892A1 - Elastic electronic device applicable on a fabric - Google Patents

Elastic electronic device applicable on a fabric Download PDF

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Publication number
WO2019197892A1
WO2019197892A1 PCT/IB2019/000262 IB2019000262W WO2019197892A1 WO 2019197892 A1 WO2019197892 A1 WO 2019197892A1 IB 2019000262 W IB2019000262 W IB 2019000262W WO 2019197892 A1 WO2019197892 A1 WO 2019197892A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
ink
track
stretchable
fabric
Prior art date
Application number
PCT/IB2019/000262
Other languages
French (fr)
Inventor
Corrado FONTANESI
Original Assignee
Eptatech S.R.L.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eptatech S.R.L. filed Critical Eptatech S.R.L.
Publication of WO2019197892A1 publication Critical patent/WO2019197892A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/568—Temporary substrate used as encapsulation process aid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68345—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during the manufacture of self supporting substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68363—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/038—Textiles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Definitions

  • the present invention relates to the “Intelligent Textiles” sector, such term identifying the implementation of electric or electronic devices integrated in clothes, hence wearable.
  • Another advantage of such devices is in that they do not lose the functional performances of the common electronic and electric components, thus allowing a correct practical application of a device, without the latter being a constraint element limiting the freedom of movement of the user.
  • the Printed Electronics Technology i.e. the use of additive industrial printing processes for implementing electric or electronic circuits, has now got consolidated application cases, for instance in the photovoltaic field or in the implementation of so-called membrane keyboards.
  • Such technology has been adopted because of its cost-effectiveness, simplicity, and diffusion of the printing processes which make it possible to achieve high throughputs.
  • Some special inks are among the products that are most suitable for implementing electronic devices integrated in clothes.
  • the surface of a fabric features irregularities, porosities, and instabilities. Such characteristics of a fabric make it impossible to print tracks on a fabric directly, to form an electric circuit by using a conductive and/or functional ink, being it not possible to implement said tracks with an appropriate resolution and homogeneous thicknesses.
  • the stretchable electric circuits are implemented on stretchable membranes featuring a regular surface, which are subsequently hot laminated on the final fabric.
  • a laminated stretchable membrane becomes an integral part of a cloth in contact with a user’s skin, thus limiting the comfort of the cloth, hence its extended wearability over time.
  • Elastic membranes are also dimensionally instable whenever they are mechanically stressed by printing operations and are subjected to deformations whenever they are exposed to heat during the ink polymerization step.
  • dimensional instability is a criticality, in particular for the so- called“registration” operation, i.e. the positioning of a semi-finished product in a printing machine for the execution of subsequent operations.
  • a typical “registration” operation includes positionings in a printing machine as necessary for depositing successive layers of ink, every layer of ink, amongst others, having to be subjected to heat in order for it to be dried, for instance in a furnace, before the next layer is deposited.
  • a membrane does not solve the problem of protecting the electronics from the external environment while using clothes or, in particular, while washing or electrically insulating them.
  • a protective layer implemented by way of a deposition of inks or a further lamination, shall be applied on the outer side of the electronics.
  • the device according to the present invention relates to a device formed of inks printed on a flat support and an electronic device implemented by way of printing processes both in its electric and functional components and in its structural and protective components.
  • the present invention relates to a device formed of inks printed on a flat printing support which basically uses various types of inks to implement an electronic device comprising at least one track which forms an electrically conductive circuit and one stretchable ink which operates as a protection and a housing; by using said stretchable ink, it is possible to overcome the drawbacks related to the use of membranes.
  • an electronic device is provided similar to that illustrated above including the addition of at least one electric or electronic component, not implementable by using the various types of ink mentioned above, let’s think, for instance, to microchips, mounted on at least one track of an electrically conductive ink and electrically connected thereto by way of conductive adhesives.
  • the mentioned electronic device includes the presence of at least one track of a functional ink to perform, for example, a sensor function.
  • a functional ink to perform, for example, a sensor function.
  • Such track can be combined with at least one track of an electrically conductive circuit and possibly with electric and electronic components as mentioned above.
  • the device according to the present invention comprises a dimensionally and thermally stable flat support which operates as a support for depositing printing inks and mounting components for implementing the mentioned electronic device in accordance with the present invention. Such support is subsequently removed after applying the electronic device on the fabric or cloth which it shall be applied on.
  • At least one stretchable track of an alternatively closed or open electric circuit, implemented by way of an electrically conductive ink, is implemented, and preferably printed, on the support.
  • Such device comprises at least one layer of a stretchable ink suitable for encapsulating and protecting the track that forms the electric circuit either totally or partially. In this way, the drawbacks of using membranes are overcome by using said stretchable ink.
  • Such device possibly comprises an upper layer of an adhesive material for applying and integrating the mentioned electronic device to a fabric.
  • the electronic device should the electronic device have to be of a hybrid type, as mentioned in the previous paragraph, at least one electric or electronic component is provided such as, for instance, a microchip, mounted on the stretchable track of the electric circuit and electrically connected thereto by way of conductive adhesives.
  • the electronic device also comprises at least one track made from an electrically functional ink.
  • the electronic device comprises at least one layer of a rigid ink for alternatively or jointly encapsulating the electric or electronic component, and the track implemented by way of an electrically functional ink, either totally or partially, for supporting and containing them.
  • the stretchable encapsulating and protective ink besides protecting the conductive electric circuit from external agents, is present all throughout the surface of the electric device so as to partially or totally level the differences in thickness generated upon mounting the electric or electronic component, while leaving portions of the electric circuit or of the functional tracks uncovered in order for them to perform a sensing function or because so required for electrically connecting to further external devices.
  • the support on which the electronic device is printed is removed upon finishing the application of the electronic device on the fabric, in that it does not perform any final structural function for the electronic device.
  • the selection of such support only aims at performing the production processes of the electronic device in an optimum manner, not at obtaining final characteristics in said device.
  • a flat support that is dimensionally stabile (it is flexible at the most, but not stretchable) and thermally stable (it does not modify its own dimensions upon undergoing the heating that it is subjected to during the printing and/or drying processes) makes it possible: (i) to print successive layers of ink, each with its specific characteristics, thereon; (ii) to perform mounting operations of non- printed components, if any, in that an accurate“registration” positioning of the semi-finished electronic device is possible in the machines for executing each individual step of the production process followed to produce the subject device, be it an electric or electronic component printing or mounting operation.
  • the final structure of an electronic device comprises:
  • An electronic device can be integrated in the final fabric by depositing a pressure activated, or even hot pressure activated, layer of adhesive in contact with the fabric itself. In this way, the electronic component implemented is transferred onto the fabric starting from the sacrificial support. The latter is removed when the operation is over, as already illustrated above.
  • Eliminating stretchable membranes permanently interposed between a fabric and an electronic component makes a cloth more pleasant to the touch and more comfortable, the latter being an aspect which is essential in many of the expected uses of this type of textiles such as, for example, an even long-term monitoring of the physiological parameters of patients, including elderly persons or children, and/or during sports activities or rehabilitation activities.
  • the printing process which is additive and selective by its nature in that it deposits a material according to a precise drawing, makes it possible to implement a component in its final form without having recourse to ablation activities as necessary to remove unnecessary, or even undesired, portions from semi-finished products.
  • the above described shell encapsulating the true electronics is implemented by way of printing or deposition processes which, by their own nature, are much more flexible than the extrusion processes used for producing membranes, on which printing operations are typically made and are often used for laminating the electronic components for protective purposes.
  • This increased flexibility makes it possible, for example, to easily obtain encapsulating thicknesses that are optimized for each specific application requirement and are different from the limited number of standard thicknesses reasonably available for membranes obtained via industrial extrusion processes.
  • Figure 1 shows an orthogonal cross-sectional view of the device according to the present invention.
  • Figure 1 shows a dimensionally and thermally stable and removable flat support (2), on which an electronic device (1), suitable for being applied onto a fabric (10), not shown in the figure, is implemented, by way of a composition of inks which are printed on said flat support (2).
  • the electronic device (1) comprises a stretchable track which forms an alternatively closed or open electric circuit (3), implemented by using an electrically conductive ink and at least one layer of stretchable ink (7) suitable for encapsulating and protecting the track that forms the electric circuit (3) either totally or partially; the latter ink solves the problems related to the use of stretchable membranes.
  • Figure 1 also shows an upper layer of an adhesive material (9) suitable for applying and integrating the electronic device (1) to a fabric (10), not shown in the figure.
  • Figure 1 shows the electronic device (1) in the form of a hybrid electronic device, as dealt with in the previous paragraph, which comprises at least one electric or electronic component (5) mounted on the track that forms the electric circuit (3) electrically connected thereto by way of conductive adhesives (6).
  • the embodiment of the device according to the present invention also comprises at least one track of an electrically functional ink (4) and one layer of a rigid ink (8) suitable for alternatively or jointly encapsulating the electric or electronic component (5) and the track of the electrically functional ink (4) either totally or partially for supporting and containing them.
  • the electronic device (1) comprises at least one further layer of stretchable ink (7) for encapsulating and protecting the remaining components of the electronic device ( 1 ) .

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Yarns And Mechanical Finishing Of Yarns Or Ropes (AREA)
  • Control Of Vending Devices And Auxiliary Devices For Vending Devices (AREA)
  • Undergarments, Swaddling Clothes, Handkerchiefs Or Underwear Materials (AREA)

Abstract

Device suitable for being applied onto a fabric made by using different types of ink, a flat support and electric and/or electronic components. The device comprises a dimensionally and thermally stable flat support 2 suitable for being removed and operating as a printing support on which an electronic device 1 is implemented by way of printing processes, a stretchable track which forms an alternatively closed or open electric circuit 3 made from an electrically conductive ink, at least one layer of a stretchable ink 7 encapsulating and protecting the track that forms the electric circuit 3 either totally or partially, and an upper layer of an adhesive material 9 suitable for applying and integrating the electronic device 1 to a fabric 10 by removing the flat support 2.

Description

ELASTIC ELECTRONIC DEVICE APPLICABLE ON A FABRIC
Owner: Eptatech S.r.l.
Inventor: Corrado Fontanesi TECHNICAL FIELD
The present invention relates to the “Intelligent Textiles” sector, such term identifying the implementation of electric or electronic devices integrated in clothes, hence wearable.
An outstanding characteristic of such devices is in that they follow and support the movements and the mechanical stresses clothes are subjected to during their normal use.
Think, for instance, to the elongations, foldings, bendings, and torsions that clothes are subjected to whenever they are worn, put away, or washed.
Another advantage of such devices is in that they do not lose the functional performances of the common electronic and electric components, thus allowing a correct practical application of a device, without the latter being a constraint element limiting the freedom of movement of the user.
PRESENT STATUS OF THE ART
The Printed Electronics Technology, i.e. the use of additive industrial printing processes for implementing electric or electronic circuits, has now got consolidated application cases, for instance in the photovoltaic field or in the implementation of so-called membrane keyboards. Such technology has been adopted because of its cost-effectiveness, simplicity, and diffusion of the printing processes which make it possible to achieve high throughputs. These characteristics made it possible to develop different types of the printed electronics.
In the last years a so-called “Stretchable Electronics” is emerging, i.e. an Electronics capable of conforming to stretchable structures and following their deformations without the electronic device being damaged or losing its performances.
Among these structures, fabrics are of a particular interest. Integrating electronic devices in clothes allows various applications. For example, let’s remember the possibility of performing a continuous and non-invasive monitoring of the physiological parameters of a user, thus making it possible to apply this monitoring to the medical field, in particular to telemedicine and to sports medicine.
Some special inks are among the products that are most suitable for implementing electronic devices integrated in clothes.
The known“stretchable” conductive inks and dielectric and protective inks, which provide electrical performances under a mechanical stress suitable for printing stretchable electric circuits, play a special importance.
Also relevant are those known inks which exhibit functionally relevant behaviors whenever they are stimulated by electric currents. Just as an example, let’s mention those inks which, whenever an electric current flows through them, emit light waves (electroluminescent inks, OLED inks) or change the frequency of the reflected light wave (electrochemical inks) or undergo dimensional changes (electrosensitive inks).
It is also worth mentioning here those known inks which transform the energy supplied thereto into measurable electric currents and can be used for printing sensors. This category includes, for example, photosensitive, piezoelectric, and bio-sensor inks, which transform chemical energy into electric signals (the latter two types of ink will be briefly referred to below as“functional ink”).
Conversely, functional inks usable for printing semiconductors having sufficient performances as to support the computing requirements of most applications are not available yet. Likewise, not always are so-called passive components (capacitors, resistors, inductors) implementable in practice via printing processes. Such deficiency led to the implementation of so-called“hybrid” electronics, i.e. electronics only partially implemented via printing processes using electrically conductive inks and/or functional inks, supplemented by mounting processes of non-printable components, such as microchips, some capacitors, some resistors, and some inductors.
Notwithstanding the mentioned conductive and functional inks are available for various printing technologies, using a conductive and/or functional ink for printing on fabrics presents substantial criticalities.
The surface of a fabric features irregularities, porosities, and instabilities. Such characteristics of a fabric make it impossible to print tracks on a fabric directly, to form an electric circuit by using a conductive and/or functional ink, being it not possible to implement said tracks with an appropriate resolution and homogeneous thicknesses.
In order to overcome this problem, the stretchable electric circuits are implemented on stretchable membranes featuring a regular surface, which are subsequently hot laminated on the final fabric.
However, the prior art stretchable membranes have a number of limitations. A laminated stretchable membrane becomes an integral part of a cloth in contact with a user’s skin, thus limiting the comfort of the cloth, hence its extended wearability over time.
Elastic membranes are also dimensionally instable whenever they are mechanically stressed by printing operations and are subjected to deformations whenever they are exposed to heat during the ink polymerization step.
In membranes, dimensional instability is a criticality, in particular for the so- called“registration” operation, i.e. the positioning of a semi-finished product in a printing machine for the execution of subsequent operations. A typical “registration” operation includes positionings in a printing machine as necessary for depositing successive layers of ink, every layer of ink, amongst others, having to be subjected to heat in order for it to be dried, for instance in a furnace, before the next layer is deposited.
For membranes, dimensional instability is also a problem in the“registration”, an operation that is necessary for mounting non printable electronic components. As a matter of fact, such operations are performed by automatic machines, called “pick and place” machines, which require compliance with sub-millimetric tolerances. Another disadvantage of stretchable membranes is in that their mechanical stretchability characteristic is uniform all throughout their extension, whereas it should be preferable big stretchability areas contiguous to rigid or less deformable areas coincident with the anchoring and electrical connection points to the non-printed electronic or electric components which are subsequently mounted in order to impart strength and reliability to the final product.
It is also worth emphasizing that the use of a membrane does not solve the problem of protecting the electronics from the external environment while using clothes or, in particular, while washing or electrically insulating them. As a matter of fact, the application of a protective layer, implemented by way of a deposition of inks or a further lamination, shall be applied on the outer side of the electronics.
DESCRIPTION OF THE INVENTION
The known problems of stretchable devices, in particular those implemented by using a membrane, as described in the previous paragraph, are solved by the device according to the present invention.
The device according to the present invention relates to a device formed of inks printed on a flat support and an electronic device implemented by way of printing processes both in its electric and functional components and in its structural and protective components.
In other words, in an elementary embodiment thereof, the present invention relates to a device formed of inks printed on a flat printing support which basically uses various types of inks to implement an electronic device comprising at least one track which forms an electrically conductive circuit and one stretchable ink which operates as a protection and a housing; by using said stretchable ink, it is possible to overcome the drawbacks related to the use of membranes.
In one embodiment, also according to the present invention, an electronic device is provided similar to that illustrated above including the addition of at least one electric or electronic component, not implementable by using the various types of ink mentioned above, let’s think, for instance, to microchips, mounted on at least one track of an electrically conductive ink and electrically connected thereto by way of conductive adhesives.
In a further embodiment, the mentioned electronic device includes the presence of at least one track of a functional ink to perform, for example, a sensor function. Such track can be combined with at least one track of an electrically conductive circuit and possibly with electric and electronic components as mentioned above. The device according to the present invention comprises a dimensionally and thermally stable flat support which operates as a support for depositing printing inks and mounting components for implementing the mentioned electronic device in accordance with the present invention. Such support is subsequently removed after applying the electronic device on the fabric or cloth which it shall be applied on. At least one stretchable track of an alternatively closed or open electric circuit, implemented by way of an electrically conductive ink, is implemented, and preferably printed, on the support. Such device comprises at least one layer of a stretchable ink suitable for encapsulating and protecting the track that forms the electric circuit either totally or partially. In this way, the drawbacks of using membranes are overcome by using said stretchable ink. Such device possibly comprises an upper layer of an adhesive material for applying and integrating the mentioned electronic device to a fabric.
In one embodiment, should the electronic device have to be of a hybrid type, as mentioned in the previous paragraph, at least one electric or electronic component is provided such as, for instance, a microchip, mounted on the stretchable track of the electric circuit and electrically connected thereto by way of conductive adhesives. In another embodiment the electronic device also comprises at least one track made from an electrically functional ink.
Such embodiments make it possible to get a wide range of applications for the device according to the present invention.
In one embodiment, the electronic device comprises at least one layer of a rigid ink for alternatively or jointly encapsulating the electric or electronic component, and the track implemented by way of an electrically functional ink, either totally or partially, for supporting and containing them.
The stretchable encapsulating and protective ink, besides protecting the conductive electric circuit from external agents, is present all throughout the surface of the electric device so as to partially or totally level the differences in thickness generated upon mounting the electric or electronic component, while leaving portions of the electric circuit or of the functional tracks uncovered in order for them to perform a sensing function or because so required for electrically connecting to further external devices.
In order to better illustrate the innovative scope of the electronic device according to the present invention, note that the support on which the electronic device is printed is removed upon finishing the application of the electronic device on the fabric, in that it does not perform any final structural function for the electronic device. The selection of such support only aims at performing the production processes of the electronic device in an optimum manner, not at obtaining final characteristics in said device.
Using a flat support that is dimensionally stabile (it is flexible at the most, but not stretchable) and thermally stable (it does not modify its own dimensions upon undergoing the heating that it is subjected to during the printing and/or drying processes) makes it possible: (i) to print successive layers of ink, each with its specific characteristics, thereon; (ii) to perform mounting operations of non- printed components, if any, in that an accurate“registration” positioning of the semi-finished electronic device is possible in the machines for executing each individual step of the production process followed to produce the subject device, be it an electric or electronic component printing or mounting operation.
So, the final structure of an electronic device comprises:
External layers of encapsulating inks which make up a shell inside which the layers implementing the properly said electronic circuitry are contained. Note that the use of protective inks of different characteristics makes it possible to implement portions of the encapsulating shell featuring differentiated degrees of stretchability. For example, rigid portions of the shell might be implemented in correspondence with positions wherein non-printed electric parts are to be mounted and connected, while retaining a greater stretchability in the remaining portions.
An electronic device can be integrated in the final fabric by depositing a pressure activated, or even hot pressure activated, layer of adhesive in contact with the fabric itself. In this way, the electronic component implemented is transferred onto the fabric starting from the sacrificial support. The latter is removed when the operation is over, as already illustrated above.
ADVANTAGES OF THE INVENTION
Eliminating stretchable membranes permanently interposed between a fabric and an electronic component makes a cloth more pleasant to the touch and more comfortable, the latter being an aspect which is essential in many of the expected uses of this type of textiles such as, for example, an even long-term monitoring of the physiological parameters of patients, including elderly persons or children, and/or during sports activities or rehabilitation activities.
The production process for manufacturing an electronic component is more reliable and flexible and increases its application cases. As a matter of fact, eliminating a permanent substrate formed of a stretchable membrane and adopting a dimensionally stable printing support, selected for process requirements only, results in a more accurate semi-finished product registration from one step of the process to the other, thus allowing to manufacture electronic components featuring a greater complexity in terms of number of layers of inks printed and non-printed parts mounted.
A completely additive production process is used. The printing process, which is additive and selective by its nature in that it deposits a material according to a precise drawing, makes it possible to implement a component in its final form without having recourse to ablation activities as necessary to remove unnecessary, or even undesired, portions from semi-finished products.
It is also worth pointing out that the above described shell encapsulating the true electronics is implemented by way of printing or deposition processes which, by their own nature, are much more flexible than the extrusion processes used for producing membranes, on which printing operations are typically made and are often used for laminating the electronic components for protective purposes. This increased flexibility makes it possible, for example, to easily obtain encapsulating thicknesses that are optimized for each specific application requirement and are different from the limited number of standard thicknesses reasonably available for membranes obtained via industrial extrusion processes. Also, as an example again, thanks to the flexibility of the printing processes, it is possible to implement encapsulating shells having stretchability, flexibility, or on the contrary, rigidness, characteristics, differentiated on their surfaces (thanks to the use of different inks with different characteristics).
DESCRIPTION OF THE DRAWINGS
Figure 1 shows an orthogonal cross-sectional view of the device according to the present invention. Figure 1 shows a dimensionally and thermally stable and removable flat support (2), on which an electronic device (1), suitable for being applied onto a fabric (10), not shown in the figure, is implemented, by way of a composition of inks which are printed on said flat support (2). The electronic device (1) comprises a stretchable track which forms an alternatively closed or open electric circuit (3), implemented by using an electrically conductive ink and at least one layer of stretchable ink (7) suitable for encapsulating and protecting the track that forms the electric circuit (3) either totally or partially; the latter ink solves the problems related to the use of stretchable membranes. Figure 1 also shows an upper layer of an adhesive material (9) suitable for applying and integrating the electronic device (1) to a fabric (10), not shown in the figure.
Figure 1 shows the electronic device (1) in the form of a hybrid electronic device, as dealt with in the previous paragraph, which comprises at least one electric or electronic component (5) mounted on the track that forms the electric circuit (3) electrically connected thereto by way of conductive adhesives (6). The embodiment of the device according to the present invention also comprises at least one track of an electrically functional ink (4) and one layer of a rigid ink (8) suitable for alternatively or jointly encapsulating the electric or electronic component (5) and the track of the electrically functional ink (4) either totally or partially for supporting and containing them.
Finally, the electronic device (1) comprises at least one further layer of stretchable ink (7) for encapsulating and protecting the remaining components of the electronic device ( 1 ) .

Claims

1. A device formed of printed inks comprising a dimensionally and thermally stable flat support (2) suitable for being removed and operating as a printing support on which an electronic device (1) is implemented by way of printing processes and suitable for being applied onto a fabric (10) characterized in that it comprises a stretchable track which forms an alternatively closed or open electric circuit (3) made from an electrically conductive ink, at least one layer of a stretchable ink (7) suitable for overcoming the drawbacks related to the use of stretchable membranes by encapsulating and protecting the track that forms the electric circuit (3) either totally or partially.
2. The device according to claim 1 characterized in that it comprises an upper layer of an adhesive material (9) suitable for applying and integrating the electronic device (1 ) to a fabric (10) by removing the flat support (2).
3. The device according to claim 1 characterized in that the electronic device (1) comprises at least one electric or electronic component (5) mounted on the track that forms the electric circuit (3) electrically connected thereto by way of conductive adhesives (6).
4. The device according to claim 1 or 3 characterized in that the electronic device (1) comprises at least one track of an electrically functional ink
(4)· 5 The device according to claim 3 or 4 characterized in that the electronic device (1) comprises at least one layer of a rigid ink (8) suitable for alternatively or jointly encapsulating the electric or electronic component (5) and the track of electrically functional ink (4) either totally or partially for supporting and containing them.
PCT/IB2019/000262 2018-04-10 2019-04-09 Elastic electronic device applicable on a fabric WO2019197892A1 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021105676A1 (en) * 2019-11-28 2021-06-03 Prevayl Limited Sensor semiconductor package, article comprising the same and manufacturing method thereof
GB2589567A (en) * 2019-11-28 2021-06-09 Prevayl Ltd Semiconductor package, article and method
US11813080B2 (en) 2019-11-28 2023-11-14 Prevayl Innovations Limited Sensor device, method and wearable article

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040145089A1 (en) * 2001-06-19 2004-07-29 Kenneth Burrows Uv-curable inks for ptf laminates (including flexible circuitry)
US20080083721A1 (en) * 2006-10-04 2008-04-10 T-Ink, Inc. Heated textiles and methods of making the same
US20140318699A1 (en) * 2012-09-11 2014-10-30 Gianluigi LONGINOTTI-BUITONI Methods of making garments having stretchable and conductive ink
US20170079144A1 (en) * 2014-05-16 2017-03-16 The Regents Of The University Of California Fabrication of flexible electronic devices

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040145089A1 (en) * 2001-06-19 2004-07-29 Kenneth Burrows Uv-curable inks for ptf laminates (including flexible circuitry)
US20080083721A1 (en) * 2006-10-04 2008-04-10 T-Ink, Inc. Heated textiles and methods of making the same
US20140318699A1 (en) * 2012-09-11 2014-10-30 Gianluigi LONGINOTTI-BUITONI Methods of making garments having stretchable and conductive ink
US20170079144A1 (en) * 2014-05-16 2017-03-16 The Regents Of The University Of California Fabrication of flexible electronic devices

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021105676A1 (en) * 2019-11-28 2021-06-03 Prevayl Limited Sensor semiconductor package, article comprising the same and manufacturing method thereof
GB2589567A (en) * 2019-11-28 2021-06-09 Prevayl Ltd Semiconductor package, article and method
US11813080B2 (en) 2019-11-28 2023-11-14 Prevayl Innovations Limited Sensor device, method and wearable article

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