WO2019129034A1 - Light-emitting diode filament and light-emitting diode bulb - Google Patents

Light-emitting diode filament and light-emitting diode bulb Download PDF

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Publication number
WO2019129034A1
WO2019129034A1 PCT/CN2018/123817 CN2018123817W WO2019129034A1 WO 2019129034 A1 WO2019129034 A1 WO 2019129034A1 CN 2018123817 W CN2018123817 W CN 2018123817W WO 2019129034 A1 WO2019129034 A1 WO 2019129034A1
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WIPO (PCT)
Prior art keywords
led
filament
conductor
light
segments
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PCT/CN2018/123817
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French (fr)
Chinese (zh)
Inventor
江涛
徐卫洪
斎藤幸广
鳗池勇人
熊爱明
徐俊锋
陈易庆
Original Assignee
嘉兴山蒲照明电器有限公司
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Application filed by 嘉兴山蒲照明电器有限公司 filed Critical 嘉兴山蒲照明电器有限公司
Priority to CN201890001486.2U priority Critical patent/CN213629939U/en
Priority to JP2020600090U priority patent/JP3230017U/en
Publication of WO2019129034A1 publication Critical patent/WO2019129034A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/08—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material comprising photoluminescent substances
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
    • F21V9/32—Elements containing photoluminescent material distinct from or spaced from the light source characterised by the arrangement of the photoluminescent material
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    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
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    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/12—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2109/00—Light sources with light-generating elements disposed on transparent or translucent supports or substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/4809—Loop shape
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    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L2224/4903—Connectors having different sizes, e.g. different diameters
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
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Definitions

  • the invention relates to the field of illumination, and in particular to a light-emitting diode (LED) filament and a light-emitting diode bulb thereof.
  • LED light-emitting diode
  • Incandescent bulbs have been widely used for home or business lighting for decades. However, incandescent bulbs are generally inefficient in energy use, and about 90% of energy input is converted to heat. And because incandescent bulbs have a very limited life (about 1,000 hours), they need to be replaced frequently. These traditional light bulbs are gradually being replaced by other more efficient electric lights, such as fluorescent lamps, high-intensity discharge lamps, and light-emitting diodes (LEDs). Of these lights, LED luminaires are the most eye-catching lighting technology. LED lamps have the advantages of long service life, small size, and environmental protection, so their applications are growing.
  • LED bulbs with LED filaments have been available on the market.
  • LED bulbs using LED filaments as illumination sources still have the following problems to be improved:
  • an LED hard filament is used with a substrate (for example, a glass substrate), and a plurality of LED chips on its substrate.
  • a substrate for example, a glass substrate
  • LED chips on its substrate.
  • the lighting effect of LED bulbs relies on a combination of multiple hard filaments to produce better lighting effects.
  • the lighting effect of a single hard filament cannot meet the general needs in the market.
  • Conventional bulbs have tungsten filaments, which are capable of producing uniform light output due to the naturally bendable nature of the tungsten filaments.
  • LED hard filaments are difficult to achieve such uniform light effects. There are many reasons why LED filaments are difficult to achieve this effect.
  • the substrate blocks the light emitted by the LED, and the light generated by the LED is a point source, which causes the light to concentrate. .
  • a uniform distribution of light produces a uniform illumination effect, and on the other hand, a concentrated distribution of light results in uneven and concentrated illumination.
  • the filament structure has a thermal expansion coefficient such as FPC, which is different from the silica gel coated with the filament, and the long-term use causes displacement or even degumming of the LED chip; or FPC is disadvantageous to the flexible change of the process conditions.
  • the filament structure has a challenge to the stability of the metal wire between the chips when bent. When the arrangement of the chips in the filament is dense, if the adjacent LED chips are connected by metal wire bonding, it is easy. When the filament is bent, the stress is too concentrated on a specific part of the filament, causing damage or even breakage of the metal wire connecting the LED chip.
  • the LED filament is generally disposed in the LED bulb, and in order to present the aesthetic appearance, and to make the illumination effect of the LED filament more uniform and wide, the LED filament is bent to exhibit various curves.
  • LED chips are arranged in the LED filaments, and the LED chips are relatively hard objects, so that the LED filaments are more difficult to be bent into a desired shape.
  • the LED filament is also prone to cracks due to stress concentration at the time of bending.
  • a LED bulb In order to increase the aesthetic appearance and make the illumination effect more uniform, a LED bulb has a plurality of LED filaments and a plurality of LED filaments are set to different placement angles. However, since a plurality of LED filaments need to be installed in a single LED bulb, and these LED filaments need to be individually fixed, the process will be more complicated and the production cost will be increased.
  • the LED filament has a driving requirement for lighting, it is substantially different from the conventional tungsten filament lamp.
  • the LED filament has a driving requirement for lighting, it is substantially different from the conventional tungsten filament lamp.
  • how to design a power circuit so that it can give a stable current so that the ripple of the LED filament is low enough to make the user feel the flicker is not a design consideration.
  • how to design a power supply circuit that is simple enough and can accommodate the space of the lamp head under the premise of achieving the required light efficiency and driving requirements is also a focus of attention.
  • Patent No. CN202252991U discloses that the phosphor is coated on the upper and lower sides of the chip or on the periphery thereof.
  • the chip is fixed on the flexible PCB and sealed by an insulating adhesive.
  • the insulating glue is epoxy resin; the electrodes of the chip are connected by gold wire.
  • the circuit on the PCB board; the flexible PCB board is transparent or translucent, and the flexible PCB board is made by printing circuit on the polyimide or polyester film substrate, and the flexible PCB board is used instead of the aluminum substrate bracket lamp heat dissipation component, and the improvement is improved. Cooling.
  • CN105161608A discloses an LED filament illuminating strip and a preparation method thereof, which adopt corresponding arrangement between the surface of the illuminating surface of the chip which do not overlap each other, thereby improving light uniformity and improving heat dissipation.
  • Patent Publication No. CN103939758A discloses that a transparent and thermally conductive heat dissipation layer is formed between the bonding surface of the carrier and the bonding surface of the LED chip for heat exchange with the LED chip.
  • the aforementioned patents respectively use a PCB board, adjust the chip arrangement or form a heat dissipation layer, which can improve the heat dissipation of the filament to a certain extent, but the heat is easy to accumulate due to low heat dissipation efficiency.
  • Patent Publication No. CN204289439U discloses a full-circumferential LED filament comprising a substrate mixed with phosphor, an electrode disposed on the substrate, at least one LED chip mounted on the substrate, and covering The encapsulant on the LED chip.
  • the substrate formed by the phosphor-containing silicone resin eliminates the cost of glass or sapphire as a substrate, and the filament made using the substrate avoids the influence of glass or sapphire on the light output of the chip, and realizes 360-degree light output, light uniformity and light efficiency. Greatly improve.
  • the substrate is formed of a silicone resin, there is also a disadvantage that heat resistance is not good.
  • present disclosure may actually include one or more inventive aspects that are currently claimed or not claimed, and that in order to avoid confusion due to unnecessary distinction between these possible inventive solutions during the writing of the specification, this document may The various inventive arrangements may be collectively referred to herein as "(present) inventions.”
  • invention A number of embodiments relating to "the invention” are outlined herein.
  • the word “invention” is used merely to describe certain embodiments disclosed in this specification (whether or not in the claims), and not a full description of all possible embodiments. Certain embodiments of the various features or aspects described below as “invention” may be combined in various ways to form an LED bulb or a portion thereof.
  • an LED filament comprising an LED chip, an electrode, and a first light conversion layer, further comprising a PI film and a copper foil, the upper surface of the PI film being attached a copper foil and the LED chip, the copper foil being located between two adjacent LED chips; the electrode corresponding to the LED chip configuration, the LED chip and the copper foil, the LED chip and the electrode Electrically connected by a wire; the LED chip has a p-junction and an n-junction, and the wire comprises a first wire connected to the p-junction of the LED chip and a second wire connected to the n-junction of the LED chip, the first light conversion
  • the layer covers the first wire and the second wire of the single LED chip connected to the LED chip, and the number of the first light conversion layers is the same as the number of the LED chips.
  • the upper surface of the copper foil has a silver plating layer, and the silver plating layer is provided with a solder mask layer, and the thickness of the solder resist layer is 30-50 um.
  • the first light conversion layer covers both ends of the copper foil, and an area, an average thickness of both ends of the copper foil covered by the first light conversion layer are equal or unequal, the first The light conversion layer covers 30 to 40% of the area of the upper surface of the copper foil.
  • the first light conversion layer covers the copper foil, and an area, an average thickness of both ends of the copper foil covered by the first light conversion layer and the middle of the copper foil are first The area covered by the light conversion layer and the average thickness are not equal, and the thickness of the copper foil covered by the first light conversion layer is 30 to 50 ⁇ m.
  • the electrode is a copper foil located at both ends of the filament end and extending beyond the PI film.
  • the lower surface of the PI film covers the second light conversion layer, and the second light conversion layer has an inclined side surface or an inclined side surface with an arc, and an upper surface of the PI film corresponds to the lower surface thereof.
  • the surface of the first light conversion layer has an arc shape, and the height of the arc gradually decreases from the middle to the both sides, and an angle between the two sides of the curved shape and the PI film is an acute angle or an obtuse angle.
  • an LED filament including an LED segment, a conductor segment, at least two electrodes, and a light conversion layer, the conductor segment being located between adjacent LED segments, the electrode corresponding to the LED segment configuration, and The LED segments are electrically connected, and the adjacent two LED segments are electrically connected to each other through the conductor segments; the LED segments include at least two LED chips, and the LED chips are electrically connected to each other through the wires; the light conversion layer covers the LED segments, the conductor segments and the electrodes And respectively expose a part of the two electrodes.
  • the conductor segment comprises a conductor connecting the LED segments, the length of the conductor being less than the length of the conductor
  • the light conversion layer may have at least one top layer and one base layer.
  • an LED filament including an LED segment, a conductor segment, at least two electrodes, and a light conversion layer, the conductor segment being located between adjacent LED segments, the electrode corresponding to the LED segment configuration, and The LED segments are electrically connected, and the conductor segments are located between adjacent LED segments, and the conductor segments and the LED segments are electrically connected by wires.
  • the LED segment comprises at least two LED chips, and the LED chips are electrically connected to each other through wires.
  • the conductor segments may include a wavy concave structure, a wavy convex structure or a spiral structure.
  • the LED filament may include an auxiliary strip that penetrates the conductor segment.
  • the conductors in the conductor segments have a wavy structure.
  • the LED segments and the conductor segments respectively have different particles, or the light conversion layers of the LED segments and the conductor segments are made of different materials.
  • an LED filament comprising a base layer and a chip and a top layer disposed on the base layer; both sides of the top layer are naturally collapsed to form an arc-shaped surface, in the height direction of the LED filament,
  • the thickness of the base layer is less than or equal to the thickness of the top layer.
  • the phosphor concentration of the top layer may be greater than the phosphor concentration of the base layer.
  • an LED filament comprising a plurality of LED chip units, a conductor, and at least two electrodes; the conductor is located between two adjacent LED chip units, the LED chip units are at different heights, and the electrodes correspond to The LED chip unit is configured, and the LED chip unit is electrically connected by a wire.
  • the adjacent two LED chip units are electrically connected to each other through a conductor, and the angle between the conductor and the length of the filament extending direction is 30° to 120°.
  • the invention provides a composition suitable for making a filament substrate or a light converting layer comprising at least a host material, a modifier and an additive.
  • the main material is a silicone modified polyimide
  • the modifier is a thermal curing agent
  • the additive is a microparticle added to the main material, and may include a phosphor, a heat dissipating particle, and a coupling agent.
  • the present invention provides a composition suitable for making a filament substrate or a light conversion layer, the main material of which is a silicone modified polyimide, which is a kind a siloxane-containing polyimide, wherein the silicone-modified polyimide comprises a repeating unit represented by the formula (I):
  • Ar1 is a tetravalent organic group having a benzene ring or an alicyclic hydrocarbon structure
  • Ar2 is a divalent organic group
  • R is independently selected from a methyl group or a phenyl group
  • n It is 1 to 5.
  • the Ar1 is a tetravalent organic group having a monocyclic alicyclic hydrocarbon structure or an alicyclic hydrocarbon structure containing a bridged ring.
  • the Ar2 is a divalent organic group having a monocyclic alicyclic hydrocarbon structure.
  • an LED bulb in accordance with another embodiment of the present invention, includes a lamp housing, a lamp cap, two conductive brackets, a stem, and an LED filament.
  • the lamp cap is connected to the lamp housing, the two conductive brackets are disposed in the lamp housing, the core post extends from the lamp cap into the lamp housing, and the LED filament comprises a plurality of LED chips and Two electrodes.
  • the LED chips are arranged in an array along the extending direction of the LED filaments, the two electrodes are respectively disposed at two ends of the LED filament and connected to the LED chip, and the two electrodes are respectively connected to the two LEDs Conductive brackets.
  • the LED filament is bent to satisfy a symmetrical characteristic, wherein the top view of the LED bulb is presented in a two-dimensional coordinate system defined with four quadrants, and the four quadrants have a cross over the core
  • the X-axis of the column, across the Y-axis of the stem and the origin, the brightness of the LED filament in the first quadrant in the top view is symmetric with respect to the Y-axis a brightness in a portion of the top view that is present in the second quadrant and/or a brightness that is symmetric with respect to the origin relative to a portion of the LED filament that is in the third quadrant in the top view; and when the LED bulb A side view of the lamp is presented in a two-dimensional coordinate system defined with four quadrants having a Y' axis aligned with the stem, an X' axis traversing the Y' axis, and an origin, the LED filament being The brightness of the portion of the side view that is located in the first quadrant is symmetrical with respect to the
  • an LED bulb in accordance with another embodiment of the present invention, includes a lamp housing, a lamp cap, two conductive brackets, a stem, and an LED filament.
  • the lamp cap is connected to the lamp housing, the two conductive brackets are disposed in the lamp housing, the core post extends from the lamp cap into the lamp housing, and the LED filament comprises a plurality of LED chips and Two electrodes.
  • the LED chips are arranged in an array along the extending direction of the LED filaments, the two electrodes are respectively disposed at two ends of the LED filament and connected to the LED chip, and the two electrodes are respectively connected to the two LEDs Conductive brackets.
  • the LED filament is bent to satisfy a symmetrical characteristic, wherein the top view of the LED bulb is presented in a two-dimensional coordinate system defined with four quadrants, and the four quadrants have a cross over the core
  • the structure of the portion of the first quadrant is symmetrical with respect to
  • an LED bulb comprising a lamp housing, a lamp cap, two conductive brackets, a stem and an LED filament.
  • the lamp cap is connected to the lamp housing, the two conductive brackets are disposed in the lamp housing, the core post extends from the lamp cap into the lamp housing, and the LED filament comprises a plurality of LED chips and Two electrodes.
  • the LED chips are arranged in an array along the extending direction of the LED filaments, the two electrodes are respectively disposed at two ends of the LED filament and connected to the LED chip, and the two electrodes are respectively connected to the two LEDs Conductive brackets.
  • the LED filament is bent to satisfy a symmetrical characteristic, wherein the top view of the LED bulb is presented in a two-dimensional coordinate system defined with four quadrants, and the four quadrants have a cross over the core
  • a schematic diagram of an emission spectrum of an LED bulb which may be any of the LED bulbs disclosed in the previous embodiments, is disclosed.
  • the spectrum is mainly distributed between wavelengths of 400 nm and 800 nm, and three peaks P1, P2, and P3 appear in three places in the range; the peak P1 is between about 430 nm and 480 nm, and the peak P2 is about 580 nm to 620 nm. Meanwhile, the peak value P3 is approximately between 680 nm and 750 nm; in intensity, the intensity of the peak P1 is less than the intensity of the peak P2, and the intensity of the peak P2 is less than the intensity of the peak P3.
  • an LED power module is disclosed.
  • the power module is disposed in a LED bulb lamp head.
  • the power module includes a rectifier circuit, a filter circuit, and a driving circuit.
  • the rectifier circuit is coupled to the first pin and the second pin to receive an external driving signal.
  • the first pin and the second pin are respectively connected to the first region and the second region of the lamp cap, wherein the first region and the second region are electrically independent.
  • the rectifier circuit is configured to rectify an external driving signal to output a rectified signal.
  • the filter circuit is coupled to the rectifier circuit for filtering the rectified signal and generating a filtered signal accordingly.
  • the driving circuit is coupled to the filter circuit and the LED light emitting portion for performing power conversion on the filtered signal, and accordingly generating a driving power source, wherein the LED light emitting portion is lit in response to the driving power source.
  • the present invention adopts the above technical solutions, and at least can achieve one of the following beneficial effects or any combination thereof: (1) A copper foil and an LED chip are pasted on the LED filament substrate, and each LED chip and the LED chip are The connected first wire and the second wire are separately wrapped by the first light conversion layer, which increases the heat radiation area, improves the heat dissipation effect and the light extraction efficiency; (2) can realize the bending of the filament and reduce the probability of the wire falling off, Increase the reliability of the product; (3) Divide the LED filament structure into LED segments and conductor segments, so the LED filaments tend to concentrate stress on the conductor segments when bent, so that the gold wires connecting the adjacent chips in the LED segments are bent.
  • the conductor segment is made of copper foil structure, which reduces the length of the metal wire and further reduces the probability of metal wire breakage in the conductor segment; (4) Design the LED through the ideal formula
  • the filament structure can improve the overall luminous efficiency;
  • the conductor or the wire connecting the LED chip unit and the conductor has an angle with the extending direction of the LED filament, which can effectively reduce the conductor cross section when the filament is bent
  • the internal force on the upper side reduces the probability of bending and breaking of the LED filament, and improves the overall quality of the LED filament;
  • (6) (material) is made of silicone modified polyimide as the main body, and the organic obtained by adding the thermosetting agent
  • the silicon-modified polyimide resin composition has excellent heat resistance, mechanical strength and light transmittance; and the silicone-modified polyimide resin composition is used as a filament substrate, and the filament has good resilience.
  • the filament is presented in a variety of shapes to achieve 360° full-circumference illumination; (7) the LED bulb includes a single LED filament, and the LED filament has symmetrical characteristics, which contribute to uniform, broad light distribution The LED bulb can produce full-circumferential effect; (8) The special spectral design is different from the traditional LED spectral distribution pattern, closer to the spectral distribution of traditional incandescent light, and close to the spectral distribution of natural light, improving the human body. The comfort of the light; and (9) the power supply circuit can give a stable current so that the ripple of the LED filament when lighting is low enough, so that the user does not feel the flicker.
  • FIG. 1A and 1B are schematic views of an LED bulb according to an embodiment of the invention.
  • FIG. 2 is a perspective, partial, cross-sectional view showing an embodiment of a light-emitting portion of the present invention
  • 3A to 3F are schematic perspective partial cross-sectional views showing an embodiment of an LED filament according to the present invention.
  • 4A to 4F are schematic structural views showing a plurality of embodiments of the segmented LED filament of the present invention.
  • 4G is a schematic view showing a bent state of the LED filament of FIG. 4F;
  • 4H to 4K are schematic structural views showing a plurality of embodiments of the segmented LED filament of the present invention.
  • Figure 5 is a perspective, partial, cross-sectional view showing an embodiment of an LED filament according to the present invention.
  • 6A is a schematic structural view showing another embodiment of the segmented LED filament of the present invention.
  • 6B to 6J are schematic structural views showing a plurality of embodiments of the segmented LED filament of the present invention.
  • 6K and 6L are perspective views showing another embodiment of the segmented LED filament of the present invention.
  • Figure 6M is a partial top view of Figure 6L;
  • FIG. 7 is a schematic structural view of an embodiment of a layered structure of an LED filament according to the present invention.
  • Figure 8 is a cross-sectional view showing a different embodiment of the filament layered structure of the present invention.
  • Figure 9 is a schematic cross-sectional view showing a different embodiment of the filament layered structure of the present invention.
  • Figure 10 is a cross-sectional view showing a different embodiment of the filament package structure of the present invention.
  • Figure 11 is a cross-sectional view showing a different embodiment of the filament package structure of the present invention.
  • Figure 12 is a cross-sectional view showing an embodiment of the LED filament of the present invention in two parts;
  • Figure 13 is a cross-sectional view showing an embodiment of the LED filament of the present invention in two parts;
  • Figure 14A is a schematic cross-sectional view showing a different embodiment of the filament layered structure of the present invention.
  • Figure 14B is a plan view showing an embodiment of the filament conductor of the present invention.
  • Figure 14C is a plan view showing an embodiment of the filament conductor of the present invention.
  • Figure 14D is a side elevational view of an embodiment of the filament conductor of the present invention.
  • FIG. 14E to 14I are respectively bottom views of an embodiment of the filament conductor of the present invention.
  • FIG. 14J to 14M show an embodiment of a filament layer structure for increasing the joint strength, wherein FIG. 14J is a perspective view of the conductor, and FIG. 14K is a perspective view of the top layer, the conductor and the base layer, and FIG. 14L and FIG. 14M. Shown in cross section in two different cases of the E1-E2 line in Figure 14K;
  • Figure 14N is a schematic cross-sectional view showing an embodiment of the conductor of the present invention.
  • Figure 14O shows a bending manner of the filament of Figure 14A of the present invention
  • Figure 15 is a cross-sectional view showing a different embodiment of the filament package structure of the present invention.
  • Figure 16 is a cross-sectional view showing a different embodiment of the filament package structure of the present invention.
  • 17A to 17D are schematic cross-sectional views showing different embodiments of the filament of the present invention.
  • FIGS. 17E and 17F are schematic views showing the arrangement of adding chips in FIGS. 17A and 17B;
  • Figure 18 is a schematic view showing the interface of light emitted by the LED chip of the present invention.
  • Figure 19A is a cross-sectional view showing the LED filament unit in the axial direction of the LED filament
  • Figure 19B is a cross-sectional view showing the LED filament unit in the radial direction of the LED filament
  • 20A and 20B are cross-sectional views showing LED filament units 400a1 of different top layers 420a shape
  • Figure 20C is a cross-sectional view showing a different embodiment of the filament of the present invention.
  • 21A to 21I are schematic plan views of different embodiments of the present invention.
  • 22A is a schematic structural view showing an embodiment of a layered structure of an LED filament according to the present invention.
  • FIG. 22B is a schematic structural view of an LED chip bonding wire of an embodiment
  • Figure 23 is a graph showing the analysis of polyimide TMA before and after the addition of a thermosetting agent
  • Figure 24 is a graph showing the particle size distribution of heat dissipating particles of different specifications.
  • 25A is an SEM image showing a composite film of a silicone-modified polyimide resin composition of the present invention.
  • 25B and 25C are schematic cross-sectional views showing an embodiment of a composite film of a silicone-modified polyimide resin composition of the present invention.
  • Figure 26A is a schematic view showing an LED bulb using the LED filament of the present invention.
  • Figure 26B is an enlarged cross-sectional view showing the dotted circle of Figure 26A;
  • Figure 26C is a projection of the LED filament of the LED bulb of Figure 26A in a top view
  • Figure 27A is a schematic view showing another LED bulb using the LED filament of the present invention.
  • Figure 27B is a front elevational view of the LED bulb of Figure 27A;
  • Figure 27C is a top plan view of the LED bulb of Figure 27A;
  • Figure 27D shows the LED filament of Figure 27B in a two-dimensional coordinate system defined with four quadrants
  • Figure 27E is the LED filament of Figure 27C presented in a two-dimensional coordinate system defined with four quadrants;
  • Figure 28A is a schematic illustration of an LED bulb in accordance with one embodiment of the present invention.
  • Figure 28B is a side elevational view of the LED bulb of Figure 28A;
  • Figure 28C is a top plan view of the LED bulb of Figure 28A;
  • Figure 29A is a schematic illustration of an LED bulb in accordance with one embodiment of the present invention.
  • Figure 29B is a side elevational view of the LED bulb of Figure 29A;
  • Figure 29C is a top plan view of the LED bulb of Figure 29A;
  • Figure 30A is a schematic illustration of an LED bulb in accordance with one embodiment of the present invention.
  • Figure 30B is a side elevational view of the LED bulb of Figure 30A;
  • Figure 30C is a top plan view of the LED bulb of Figure 30A;
  • Figure 31A is a schematic illustration of an LED bulb in accordance with one embodiment of the present invention.
  • Figure 31B is a side elevational view of the LED bulb of Figure 31A;
  • Figure 31C is a top plan view of the LED bulb of Figure 31A;
  • Figure 32A is a schematic illustration of an LED bulb in accordance with one embodiment of the present invention.
  • Figure 32B is a side elevational view of the LED bulb of Figure 32A;
  • Figure 32C is a top plan view of the LED bulb of Figure 32A;
  • Figure 33A is a schematic illustration of an LED bulb in accordance with one embodiment of the present invention.
  • Figure 33B is a side elevational view of the LED bulb of Figure 33A;
  • Figure 33C is a top plan view of the LED bulb of Figure 33A;
  • Figure 34A is a schematic illustration of an LED bulb in accordance with one embodiment of the present invention.
  • Figure 34B is a side elevational view of the LED bulb of Figure 34A;
  • Figure 34C is a top plan view of the LED bulb of Figure 34A;
  • 35A to 35C are respectively a schematic view, a side view and a top view of an LED bulb according to an embodiment of the present invention.
  • 36A to 36C are respectively a schematic, side and top views of an LED bulb according to an embodiment of the present invention.
  • 37A to 37C are respectively a schematic, side and top views of an LED bulb according to an embodiment of the present invention.
  • 38A to 38C are respectively a schematic view, a side view and a top view of an LED bulb according to an embodiment of the present invention.
  • 39A to 39C are respectively a schematic view, a side view and a top view of an LED bulb according to an embodiment of the present invention.
  • 40A to 40C are respectively a schematic view, a side view and a top view of an LED bulb according to an embodiment of the present invention.
  • 41A to 41C are respectively a schematic view, a side view and a top view of an LED bulb according to an embodiment of the present invention.
  • 42A to 42C are respectively a schematic view, a side view and a top view of an LED bulb according to an embodiment of the present invention.
  • 43A to 43C are respectively a schematic view, a side view and a top view of an LED bulb according to an embodiment of the present invention.
  • 44A to 44C are respectively a schematic, side and top views of an LED bulb according to an embodiment of the present invention.
  • 45A to 45C are respectively a schematic view, a side view and a top view of an LED bulb according to an embodiment of the present invention.
  • 46A to 46C are respectively a schematic, side and top views of an LED bulb according to an embodiment of the present invention.
  • 47A and 47B are respectively a schematic view and a top view of an LED bulb according to an embodiment of the present invention.
  • 48A to 48C are respectively a schematic view, a side view and a top view of an LED bulb according to an embodiment of the present invention.
  • 49A to 49C are respectively a schematic, side and top views of an LED bulb according to an embodiment of the present invention.
  • 50A to 50C are respectively a schematic view, a side view and a top view of an LED bulb according to an embodiment of the present invention.
  • 51A to 51C are respectively a schematic, side and top views of an LED bulb according to an embodiment of the present invention.
  • 52A to 52D are respectively a schematic view, a side view, another side view and a top view of an LED bulb according to an embodiment of the present invention.
  • 53A to 53D are respectively a schematic view, a side view, another side view and a top view of an LED bulb according to an embodiment of the present invention.
  • 54A to 54D are respectively a schematic view, a side view, another side view and a top view of an LED bulb according to an embodiment of the present invention.
  • 55A to 55D are respectively a schematic view, a side view, another side view and a top view of an LED bulb according to an embodiment of the present invention.
  • 56A to 56D are respectively a schematic view, a side view, another side view and a top view of an LED bulb according to an embodiment of the present invention.
  • 57A to 57D are respectively a schematic view, a side view, another side view and a top view of an LED bulb according to an embodiment of the present invention.
  • 58A to 58D are respectively a schematic view, a side view, another side view and a top view of an LED bulb according to an embodiment of the present invention.
  • 59A to 59D are respectively a schematic view, a side view, another side view and a top view of an LED bulb according to an embodiment of the present invention.
  • 60A to 60D are respectively a schematic view, a side view, another side view and a top view of an LED bulb according to an embodiment of the present invention.
  • Figure 61 is a schematic view showing the light emission spectrum of an LED bulb according to an embodiment of the present invention.
  • Figure 62 is a schematic view showing the light emission spectrum of an LED bulb according to another embodiment of the present invention.
  • 63A to 63C are schematic diagrams showing a circuit of an LED filament according to an embodiment of the present invention.
  • 64A to 64C are schematic diagrams showing a circuit of an LED filament according to another embodiment of the present invention.
  • 65A to 65D are schematic diagrams showing a circuit of an LED filament according to another embodiment of the present invention.
  • 66A to 66E are schematic diagrams showing a circuit of an LED filament according to another embodiment of the present invention.
  • 67 is a circuit block diagram of a power module of an LED bulb according to an embodiment of the invention.
  • 68A is a circuit diagram of a rectifier circuit according to a first preferred embodiment of the present invention.
  • 68B is a circuit diagram showing a rectifier circuit according to a second preferred embodiment of the present invention.
  • 69A is a circuit diagram of a filter circuit according to a first preferred embodiment of the present invention.
  • 69B is a circuit diagram showing a filter circuit according to a second preferred embodiment of the present invention.
  • Figure 70 is a block diagram showing the circuit of a driving circuit in accordance with a preferred embodiment of the present invention.
  • 71A to 71D are schematic diagrams showing signal waveforms of driving circuits according to different embodiments of the present invention.
  • 72A is a circuit diagram showing a driving circuit of a first preferred embodiment of the present invention.
  • Figure 72B is a circuit diagram showing the driving circuit of the second preferred embodiment of the present invention.
  • the present disclosure provides a new LED filament and its applied LED bulb, which will be described in the following embodiments with reference to the accompanying drawings.
  • the following description of the various embodiments of the invention herein are intended to be illustrative only These example embodiments are merely examples, and many embodiments and variations that do not require the details provided herein are possible. It should also be emphasized that the present disclosure provides details of alternative examples, but such alternative displays are not exclusive. Moreover, the consistency of any detail between the various examples should be understood as requiring such detail, after which it is not practical to display every possible variation for each feature described herein.
  • first, second, third, etc. may be used to describe various components, components, regions, layers or steps, these components, components, regions, layers and/or steps should not be These terms are limited. The terms are used to distinguish one component, component, region, layer, or step, or another component, component, region, layer or step, for example, as a naming convention. Therefore, a first component, component, region, layer or step discussed in the following section in the specification may be named in another section of the specification or in the claims without departing from the teachings of the invention. Second component, component, region, layer or step. Further, in some cases, even if the terms "first”, “second”, etc. are not used in the specification, the term may be referred to as "first" or "second” in the claims. Differentiate the different components of the record.
  • orientation, layout, position, shape, size, number, or other measure do not necessarily mean exactly the same orientation, layout, position, shape.
  • the size, number, or other measure but is intended to encompass nearly the same orientation, layout, position, shape, size, number, or other measure within an acceptable range of variations, for example, as a result of a manufacturing process.
  • basic may be used herein to reflect this meaning.
  • Terms such as “about” or “about” may mean a size, orientation, or arrangement that varies only in a relatively small manner and/or in a form that does not significantly alter the operation, function, or structure of certain components.
  • a range from “about 0.1 to about 1" may encompass, for example, a range of 0%-5% deviation in the vicinity of 0.1 and a deviation of 0% to 5% in the vicinity of 1, especially if such deviation remains the same as the listed range. influences.
  • FIG. 1A and FIG. 1B are schematic diagrams showing the structure of a first embodiment and a second embodiment of the present invention.
  • the LED bulbs 1a, 1b comprise a lamp housing 12, a lamp cap 16 connecting the lamp housing 12, at least two conductive brackets 51a, 51b disposed in the lamp housing 12, disposed in the lamp cap and electrically connected
  • the mounting portions 51a, 51b and the driving circuit 518 of the base 16 and the single light emitting portion 100 disposed in the lamp housing 12, the implementation of the light emitting portion 100 may be an LED filament including an LED chip.
  • the conductive brackets 51a and 51b are used to electrically connect the two electrodes 506 of the light emitting unit 100, and can also support the weight of the light emitting unit 100.
  • the driving circuit 518 is electrically connected to the conductive brackets 51a, 51b and the lamp cap 16. When the lamp cap 16 is connected to the lamp holder of the conventional bulb lamp, the lamp socket provides power to the lamp cap 16, and the driving circuit 518 is powered from the lamp cap 16. The light emitting unit 100 is driven to emit light.
  • the LED bulbs 1a, 1b can generate full illumination.
  • the drive circuit 518 is disposed within the LED bulb. However, in some embodiments, the drive circuit 518 is disposed outside of the LED bulb.
  • the conductive brackets 51a, 51b of the LED bulb 1a are exemplified by two, but not limited thereto, and may be increased in number depending on the conductive or supporting requirements of the light-emitting portion 100.
  • the LED bulb 1a, 1b further includes a stem 19 and a heat dissipating component 17, the stem 19 is disposed in the bulb 12, and the heat dissipating component 17 is located between the cap 16 and the lamp housing 12 and The stem 19 is connected.
  • the base 16 is indirectly connected to the lamp housing 12 through the heat dissipation assembly 17.
  • the base 16 can be directly coupled to the lamp housing 12 and has no heat sink assembly 17.
  • the light emitting unit 100 connects the stem 19 via the conductive holders 51a and 51b.
  • the stem 19 can be used to exchange the air in the LED bulb 1b and replace it with a mixture of nitrogen and helium.
  • the stem 19 can also provide a heat conducting function to transfer heat from the light emitting portion 100 of the connecting stem 19 to the outside of the lamp housing 12.
  • the heat dissipating component 17 may be a hollow cylindrical body that surrounds the opening of the lamp housing 12, which connects the stem 19 and the base 16 and conducts the heat transmitted therefrom to the outside of the LED bulb 1b.
  • the inside of the heat dissipating component 17 may be provided with a driving circuit 518, and the outside of the heat dissipating component 17 that contacts the outside air has conducted heat.
  • the material of the heat dissipating component 17 can be selected from metal, ceramic or high thermal conductive plastic with good thermal conductivity.
  • the material of the heat dissipating component 17 (along with the opening/thread of the LED bulb) can also be a ceramic material with good thermal conductivity, and the heat dissipating component 17 can also be integrally formed with the ceramic stem 19, so that the LED ball can be eliminated.
  • the lamp cap of the lamp needs to be glued with the heat dissipating component 17 to increase the thermal resistance of the heat dissipating path of the light emitting part 100, thereby having a better heat dissipating effect.
  • FIG. 2 is a perspective, partial, cross-sectional view showing an embodiment of a light-emitting portion of the present invention.
  • the present invention will be described below with an LED filament as a light-emitting portion.
  • the embodiment in which the light-emitting portion of the LED bulb of the present invention may be implemented is not limited thereto, and any illuminant can be bent through the manner.
  • the LED bulb of the invention can emit full-circumference light, which should be regarded as an equivalent replacement component of the light-emitting portion referred to in the present invention.
  • the LED filament 100 includes a plurality of LED chip units 102, 104, at least two conductive electrodes 110, 112, and a light converting coating 120 (in a particular embodiment, the light converting coating may be referred to as a silicone layer), a light converting coating
  • the phosphor in 120 absorbs certain radiation (such as light) and emits light.
  • the LED filament emits light after its conductive electrodes 110, 112 are powered (voltage source or current source). Taking the embodiment as an example, the light emitted by the light may be substantially 360 degrees of light close to the point source; when the LED filament of the embodiment of the invention is applied to the bulb, omni-directional light may be emitted.
  • the cross-sectional shape of the LED filament 100 of the present invention is rectangular, but the cross-sectional shape of the LED filament 100 is not limited thereto, and may be triangular, circular, elliptical, polygonal or diamond-shaped. It can even be square, but the corners can be chamfered or rounded.
  • the LED chip units 102, 104, or LED segments 102, 104 may be a single LED chip, or two LED chips. Of course, it may also include a plurality of LED chips, that is, equal to or larger than three LED chips.
  • FIG. 3A to 3F are perspective partial cross-sectional views showing an embodiment of an LED filament according to the present invention.
  • LED chip units 102, 104, electrodes 110, 112, and wires are included.
  • the light conversion coating of the present embodiment is divided into a first light conversion layer 121 and a base layer 122.
  • the upper surface of the base layer 122 is coated with a plurality of copper foils 116 and LED chip units 102 and 104, and a copper foil.
  • each of the LED chip units 102, 104 has a p-junction and an n-junction, and the wires include the first wires 141 and the connection copper foil 116 connecting the electrodes 110, 112 and the LED chip unit.
  • the first light conversion layer 121 covers the first wire 141 and the second wire 142 of the single LED chip unit connected to the LED chip unit, the number of the first light conversion layer 121 and the LED chip unit The number is the same.
  • the single LED chip unit 102, 104 may be two LED chips, and of course, may also include multiple LED chips, that is, equal to or larger than three LED chips.
  • the shape of the LED chip can be, but is not limited to, a strip type, and the strip type chip can have fewer electrodes, reducing the chance of shielding the light emitted by the LED chip.
  • the electrodes 110 and 112 are disposed at both ends of the LED chip units 102 and 104 connected in series, and a part of each of the electrodes 110 and 112 is exposed outside the first light conversion layer 121, and six of the LED chips in the LED chip units 102 and 104 Each surface of the face is covered with the first light conversion layer 121, that is, the six faces of the LED chip units 102, 104 are covered by the first light conversion layer 121, and the cover or package may be, but not limited to, direct contact.
  • each of the six faces of the LED chips of the LED chip units 102, 104 directly contacts the first light conversion layer 121.
  • the first light conversion layer 121 may cover only at least one of the six surfaces of the LED chips of each of the LED chip units 102, 104, that is, the first light conversion layer 121 directly contacts the surface, which is in direct contact.
  • the surface can be the top surface.
  • the first light conversion layer 121 may directly contact at least one surface of the two electrodes 110, 112 or the copper foil 116.
  • the wire is a gold wire or an aluminum wire
  • the combination of the copper foil 116 and the gold wire is a lamp ribbon to stabilize and maintain a flexible conductive structure.
  • the copper foil 116 may be replaced by other materials having good electrical conductivity, the width or/and length of the opening of the copper foil 116 being larger than the LED chip units 102, 104 to define the position of the LED chip units 102, 104, and the LED chip units 102, 104 At least two of the six faces are in contact with and covered by the first light conversion layer 121.
  • a plurality of the LED chip units 102 and 104 are connected to the copper foil 116 by wires to form a series circuit, a parallel circuit, a circuit that is connected in series and then connected in series or in parallel, and then connected in parallel, and then connected in parallel.
  • the LED chip units 102 and 104 at the forefront and the last end of the circuit are respectively connected to the two electrodes 110 and 112 fixed on the base layer 122, and the electrodes 110 and 112 can be connected to the power source to provide the LED chip units 102 and 104. Light up the required power.
  • the first light conversion layer 121 covers both ends of the copper foil 116.
  • the area and the average thickness of the two ends of the copper foil 116 covered by the first light conversion layer 121 are equal or unequal, and the upper surface of the copper foil 116 is covered by the first light conversion layer. 121 covers an area of 30 to 40%.
  • the adjacent two first light conversion layers may cover the entire copper foil 116 between the two adjacent first light conversion layers, and the two ends of the copper foil 116 are The area covered by the light conversion layer 121 and the average thickness are not equal to the area covered by the first light conversion layer 121 and the average thickness of the copper foil 116, and the thickness of the copper foil 116 covered by the first light conversion layer 121 is 30. ⁇ 50um.
  • the surface of the first light conversion layer 121 has an arc shape, and the height of the arc gradually decreases from the middle to the both sides, and the angle between the curved sides and the base layer 122 is an acute angle or an obtuse angle.
  • the first light conversion layer 121 includes a phosphor paste or a phosphor film, and at least a portion of each of the six faces of the LED chip units 102, 104 directly contacts the first light conversion layer 121 and/or the LED chip units 102, 104.
  • One or both sides are bonded to the first light conversion layer 121 through the solid glue, and the six faces are also covered by the first light conversion layer 121 and/or the LED chip units 102 and 104 directly contact the first light.
  • the solid crystal glue may also be incorporated with a phosphor to increase the overall light conversion efficiency.
  • the solid crystal glue is usually also a silica gel. The difference from the silica gel used for mixing phosphors is that the solid crystal glue is often mixed with silver powder or Heat the powder to improve heat transfer.
  • the difference from the above embodiment is that the lower surface of the base layer 122 covers the second light-converting layer 123 having a uniform thickness, and the upper surface and the lower surface of the base layer 122 are opposed to each other.
  • the second light conversion layer 123 covering the lower surface of the base layer 122 has an inclined side surface or an inclined side surface with an arc shape.
  • the lower surface of the base layer 122 covers the second light conversion layer 123, which can generate more yellow fluorescence and reduce blue light. Therefore, the difference in color temperature between the front and back sides of the LED chip units 102 and 104 can be reduced, so that the LED chip units 102 and 104 emit light on both sides. The color temperature is closer.
  • the first light conversion layer 121 covers two adjacent LED chip units 102 and 104, and the copper foil 116 between the two LED chip units 102 and 104 and The first wire 141 and the second wire 142 are connected to the two LED chip units 102 and 104.
  • the upper surface of the copper foil 116 has a silver plated layer 118, and the copper foil 116 located at the ends of the filament head and extending beyond the base layer 122 serves as the electrodes 110, 112.
  • the silver plating layer 118 not only can bring good conductivity but also has the effect of increasing light reflection; the surface of the silver plating layer can be selectively provided with a solder resist layer (not shown), and the thickness of the solder resist layer is 30 ⁇ . 50um, the solder mask layer is obtained by the OSP (Organic Solderability Preservatives) process, and the solder resist layer has anti-oxidation, thermal shock resistance and moisture resistance.
  • the LED filament 200 has: LED chip units 102, 104; electrodes 110, 112; wires 140, and a light conversion coating 120.
  • the copper foil 116 is located between the adjacent two LED chip units 102, 104; the electrodes 110, 112 are arranged corresponding to the LED chip units 102, 104, the LED chip units 102, 104 and the copper foil 116, the LED chip units 102, 104 and the electrode 110
  • the light-transfer coating 120 is applied to at least two sides of the LED chip units 102, 104 and the filament electrodes 110, 112.
  • the light conversion coating 120 exposes a portion of the filament electrodes 110, 112.
  • the light conversion coating 120 includes a phosphor layer 124 and a silica layer 125.
  • the phosphor layer 124 directly contacts the surface of the LED chip units 102, 104.
  • a layer of phosphor layer 124 is sprayed on the surface of the LED chip unit 102, 104, the copper foil 116, the electrodes 110, 112 and the wire 140 by electrostatic spraying, and then a vacuum coating method can be applied to the phosphor layer 124.
  • the silica gel layer 125 and the silica gel layer 125 do not contain phosphor; the phosphor layer 124 and the silica gel layer 125 have the same or different thickness, the phosphor layer 124 has a thickness of 30 to 70 um, and the silica gel layer 125 has a thickness of 30 to 50 um.
  • the surface of the LED chip unit 102, 104, the copper foil 116, the electrodes 110, 112, and the wire 140 may be covered with a transparent resin layer, and the transparent resin layer does not contain phosphor, and then used.
  • the phosphor layer covers the transparent resin layer, and the thickness of the transparent resin layer and the phosphor layer are equal or unequal, and the thickness of the transparent resin layer is 30 to 50 um.
  • FIG. 4A to 4K are schematic views of various embodiments of the segmented LED filament
  • FIGS. 4A to 4E and FIGS. 4H to 4K are cross-sectional views of the LED filament along the axial direction thereof.
  • 4G is a schematic view showing a bent state of the LED filament of FIG. 4F.
  • the LED filament in the axial direction of the LED filament, can be divided into different segments, for example, the LED filament can be divided into LED segments (ie, the LED chip unit referred to in the foregoing embodiment) 102, 104.
  • the conductor segment 130 but is not limited thereto.
  • the number of LED segments 102, 104 and conductor segments 130 in a single LED filament may each be one or more, and the LED segments 102, 104 and conductor segments 130 are disposed along the axial direction of the LED filament. Wherein, the LED segments 102, 104 and the conductor segments 130 may have different structural features to achieve different effects, as detailed below.
  • the LED filament 100 includes LED segments 102, 104, a conductor segment 130, at least two electrodes 110, 112, and a light conversion layer 120.
  • the conductor segments 130 are located between adjacent LED segments 102, 104. 112 corresponds to the LED segments 102, 104, and is electrically connected to the LED segments 102, 104.
  • the adjacent two LED segments 102, 104 are electrically connected to each other through the conductor segments 130.
  • the conductor segments 130 include connecting LEDs.
  • each of the LED segments 102 and 104 includes at least two LED chips 142.
  • the LED chips 142 are electrically connected to each other, and the electrical connection is connected through the wires 140. The present invention does not This is limited.
  • the light conversion layer 120 covers the LED segments 102, 104, the conductor segments 130 and the electrodes 110, 112, and exposes a portion of the two electrodes 110, 112, respectively.
  • each of the six faces of the LED chip 142 in the LED segments 102, 104 is covered with the light conversion layer 120, that is, the six faces are covered by the light conversion layer 120 and may be referred to as a light conversion layer.
  • 120 covers the LED chip 142.
  • the cover or package may be, but not limited to, direct contact.
  • each of the six faces of the LED chip 142 directly contacts the light conversion layer 120.
  • the light conversion layer 120 may cover only two of the six surfaces of each of the LED chips 142, that is, the light conversion layer 120 directly contacts the two surfaces, and the two surfaces of the direct contact may be, but are not limited to, The top or bottom surface in Figure 4. Likewise, the light conversion layer 120 can directly contact both surfaces of the two electrodes 110, 112. In various embodiments, the light conversion layer 120 may employ a package that does not have a light conversion effect, for example, the light conversion layer 120 of the conductor segment 130 may be changed to a transparent package excellent in flexibility.
  • the LED filaments 100 are disposed within the LED bulbs, and only a single LED filament is provided in each of the LED bulbs to provide sufficient illumination. Moreover, in order to present the aesthetic appearance, and to make the illumination effect of a single LED filament more uniform and broad, and even achieve the effect of full-circumference, the LED filament in the LED bulb can be flexed and flexed. The diversified curve allows the LED filament to be illuminated in all directions by a variety of curves, or to adjust the overall luminous pattern of the LED bulb.
  • the conductor segment 130 of the LED filament does not have any LED chip, but only has the conductor 130a.
  • the conductor 130a eg, a metal wire or metal coating
  • the conductor 130a is more easily bent relative to the LED chip, that is, the conductor segments 130 without any LED chips are corresponding to the LED segments 102, 104 having the LED chips. It is easier to be bent.
  • the LED segments 102, 104 of the LED filament 100 and the conductor segments 130 have different structural features.
  • the conductor segment 130 further includes a wavy recess structure 132a disposed on the surface edge of the conductor segment 130 and disposed around the axial direction of the LED filament 100.
  • the recessed structure 132a is recessed by the surface of the conductor segment 130.
  • the plurality of recessed structures 132a are spaced apart in the axial direction and are parallel to each other to present a continuous wave shape.
  • the conductor segment 130 can serve as a main bend. Due to the wavy recessed structure 132a of the conductor segment 130, the conductor segment 130 is easily extended and compressed, which is more advantageous for being bent. For example, the conductor segments 130 may extend outside of the bend and the inside will compress, while the wavy recess 132a may improve such extension and compression. After the extension, the recessed structure 132a becomes looser and flatter, that is, the height difference becomes smaller and the pitch of adjacent peaks or troughs becomes larger; and the recessed structure 132a after compression becomes denser and more concave, that is, The height difference is large and the pitch of adjacent peaks or troughs becomes small. Since the undulating recessed structure 132a provides a margin of extension and compression, the conductor segments 130 are more susceptible to bending.
  • the LED segments 102, 104 of the LED filament 100 and the conductor segments 130 have different structural features.
  • the conductor segment 130 further includes a wavy convex structure 132b disposed on the surface edge of the conductor segment 130 and surrounded by the axial direction of the LED filament. It is disposed on the conductor segment 130.
  • the raised structure 132b is a structure that is protruded from the surface of the conductor segment 130. The plurality of raised structures 132b are spaced apart in the axial direction and are parallel to each other to exhibit a continuous wave shape.
  • the conductor segment 130 can serve as a main bend. Due to the undulating convex structure 132b of the conductor segment 130, the conductor segment 130 is easily extended and compressed, which is more advantageous for being bent. For example, the conductor segments 130 may extend on the outside of the bend and the inside will compress, while the undulating projections 132b may compensate for such extension and compression. After the extension, the raised structure 132b becomes looser and flatter, that is, the height difference becomes smaller and the pitch of adjacent peaks or troughs becomes larger; and the convex structure 132b after compression becomes more compact and more convex. That is, the height difference is large and the pitch of adjacent peaks or troughs becomes smaller. Since the undulating raised structure 132b can provide a margin of extension and compression, the conductor segments 130 are more susceptible to bending.
  • both the LED segments 102, 104 and the conductor segments 130 of the LED filament 100 have a uniform appearance structure, and the LED filament further includes an auxiliary strip 132c.
  • the auxiliary strip 132c is disposed in the LED filament 100 and is covered by the light conversion layer 120.
  • the auxiliary strip 132c extends along the axial direction of the LED filament and extends through all of the LED segments 102, 104 and conductor segments 130 of the LED filament.
  • the LED segments 102, 104 will have a smaller degree of bending because of the internal LED chips 142, while the conductor segments 130 will have a greater degree of bending.
  • the curve between the LED segments 102, 104 and the conductor segment 130 will show a large change, and since the stress will be concentrated in a place where the curve changes greatly, this will increase the LED filament in the case.
  • the light conversion layer 120 between the LED segments 102, 104 and the conductor segments 130 creates a chance of cracking or even breakage.
  • the auxiliary strip 132c can absorb stress and avoid stress concentration on the light conversion layer 120, thus reducing the chance of cracking or even breakage of the light conversion layer 120 between the LED segments 102, 104 and the conductor segments 130.
  • the degree of bendability of the LED filament is increased by the arrangement of the auxiliary strip 132c.
  • the auxiliary strips 132c are one piece; in other embodiments, the auxiliary strips 132c may be plural and disposed at different positions of the LED filaments in the radial direction.
  • the LED segments 102, 104 of the LED filament 100 and the conductor segments 130 are identical in appearance structure, and the LED filament further includes a plurality of auxiliary strips 132d.
  • a plurality of auxiliary strips 132d are disposed in the LED filament 100 and are covered by the light conversion layer 120.
  • the plurality of auxiliary strips 132d are arranged along the axial direction of the LED filaments to present a segmented arrangement.
  • Each of the auxiliary strips 132d is disposed in a region of each of the conductor segments 130, and each of the auxiliary strips 132d extends through the corresponding conductor segment 130 in the axial direction of the LED filament and extends along the axial direction of the LED filament to the corresponding conductor segment.
  • the auxiliary strip 132d does not penetrate the region of the LED segments 102, 104.
  • the conductor segment 130 When the LED filament 100 is bent, the conductor segment 130 will exhibit a large change, and the plurality of auxiliary strips 132d can absorb the stress generated by the LED segments 102, 104 and the conductor segment 130 due to bending, thereby avoiding stress concentration on the LED segment 102, 104 and the light converting layer 120 of the conductor segment 130, this reduces the chance of cracking or even breakage of the light converting layer 120 between the LED segments 102, 104 and the conductor segments 130.
  • the auxiliary strip 132d By the arrangement of the auxiliary strip 132d, the degree of bending of the LED filament is increased, thereby improving the quality of the product.
  • the plurality of auxiliary strips 132d extend in the axial direction of the LED filament and are aligned with each other in a specific radial direction; in other embodiments, the plurality of auxiliary strips 132d may also be along the axis of the LED filament. They extend in the direction but are not aligned with each other in a specific radial direction, but are dispersed at different positions in the radial direction.
  • both the LED segments 102, 104 and the conductor segments 130 of the LED filament 100 have different structural features.
  • the conductor segment 130 further includes a spiral structure 132e disposed on the surface edge of the conductor segment 130 and disposed around the conductor segment 130 centering on the axial direction of the LED filament.
  • the helical structure 132e is a helical structure that protrudes from the surface of the conductor segment 130. The helical structure 132e is along the axial direction of the LED filament, and is terminated by one end of the conductor segment 130 (eg, adjacent one end of the LED segment 102).
  • the helical structure 132e will assume an oblique arrangement relative to the axial direction of the LED filament.
  • the helical structure 132e may also be a helical structure that is recessed by the surface of the conductor segment 130.
  • both the LED segments 102, 104 and the conductor segments 130 of the LED filament 100 may have the same helical structure 132e structural features.
  • the LED filament 100 of FIG. 4G is in a state in which the filament of FIG. 4F is bent.
  • the conductor segment 130 can serve as a main bend, and the spiral structure 132e of the conductor segment 130 can easily extend and compress the conductor segment 130, which is more favorable for being bent. fold.
  • the conductor segments 130 will extend outwardly of the bend and the inside will compress, while the helical structure 132e will compensate for such extension and compression.
  • the spiral structure 132e becomes looser and flatter, that is, the height difference becomes smaller and the pitch of adjacent peaks or troughs becomes larger; and the spiral structure 132e after compression becomes more compact and more convex, That is, the height difference becomes large and the pitch of adjacent peaks or troughs becomes small. Since the helical structure 132e can provide a margin of extension and compression, the conductor segments 130 are more susceptible to bending.
  • the LED filament 100 is substantially identical to the LED filament of FIG. 4A, but in the LED filament 100 of FIG. 4H, the conductor 130b of the conductor segment 130 has a wavy configuration.
  • the conductor segment 130 serves as a main bend, and the conductor 130b located inside the conductor segment 130 is also bent as the conductor segment 130 is bent, due to the wavy structure of the conductor 130b.
  • the greater ductility of the conductor 130b can be extended or compressed as the conductor segment 130 is bent, so that the conductor 130b is susceptible to stress pulling due to bending and is not easily broken. Accordingly, the connection relationship between the conductor 130b and the connected LED chip 142 will be more stable, and the durability of the conductor 130b is also improved.
  • the light conversion layer 120 of the LED segments 102, 104 of the LED filament and the light conversion layer 120 of the conductor segment 130 respectively include particles distributed therein.
  • the particles of the LED segments 102, 104 and the conductor segments 130 may have different structures, different materials, different effects, or different distribution densities, because the LED segments 102, 104 and the conductor segments 130 respectively have different functions. Therefore, the LED segments 102, 104 and the light conversion layer 120 of the conductor segment 130 can be respectively provided with different types of particles to achieve different effects.
  • the light conversion layer 120 of the LED segments 102, 104 can include phosphor 124a, while the conductor segment 130 light conversion layer 120 includes light directing particles 124b.
  • the phosphor 124a can absorb the light emitted by the LED chip 142 and convert the wavelength of the light to reduce or increase the color temperature, and the phosphor 124a also has the effect of diffusing light, so the phosphor is disposed on the light conversion layer 120 of the LED segments 102, 104.
  • 124a helps to change the color temperature of the light and also makes the light spread more evenly.
  • the conductor segment 130 does not have an LED chip, and the conductor segment 130 is a main bent portion of the LED filament. Therefore, the light-converting layer 124b is disposed in the light conversion layer 120 of the conductor segment 130, and the light-guiding particle 124b has light diffusion and light. The effect of conduction helps to direct light in adjacent LED segments 102, 104 into conductor segment 130 and further spread evenly throughout conductor segment 130.
  • the light guiding particles 124b are, for example, particles of different sizes made of polymethyl methacrylate (PMMA) or a resin, but are not limited thereto.
  • the particles included in the conductor segments 130 may also have excellent plastic deformation properties, such as particles made of plastic, which may improve the bendability of the conductor segments 130 and strengthen the LED filament 100 in a bend. Supportability at the time of folding.
  • the light conversion layer 120 of the LED segments 102, 104 of the LED filament 100 includes light diffusing particles, such as phosphor 124a, while the light converting layer 120 of the conductor segment 130 does not include particles.
  • the LED segments 102, 104 and the light conversion layer 120 of the conductor segment 130 are made of, for example, silica gel, and no particles are present in the light conversion layer 120 of the conductor segment 130, which can improve the bendability of the conductor segment 130. Folding.
  • the material of the light conversion layer 120 of the conductor segments 130 and the material of the light conversion layer 120 of the LED segments 102, 104 may be different.
  • the light conversion layer 120 of the LED segments 102, 104 is made of silicone
  • the light conversion layer 120 of the conductor segment 130 is made of a light guiding material
  • the light conversion layer 120 of the conductor segment 130 may be made of PMMA, resin or The combination is made, but is not limited thereto. Since the material of the light conversion layer 120 of the conductor segment 130 is different from the material of the light conversion layer 120 of the LED segments 102, 104, the conductor segments 130 and the LED segments 102, 104 can have different properties, such as the conductor segments 130 and the LED segments 102. , 104 may have different elastic coefficients, so that the LED segments 102, 104 are better supported to protect the LED chip 142, and the bendability of the conductor segment 130 is better, so that the LED filament 100 can be bent. Present a diverse curve.
  • the LED segments 102, 104 of the LED filament 100 and the conductor segments 130 have different structural features.
  • the LED segments 102, 104 and the conductor segments 130 have different widths, thicknesses or diameters in the radial direction of the LED filament 100, in other words, the minimum between the opposite surfaces of the LED segments 102, 104. The distance is greater than the maximum distance between opposite surfaces of the conductor segments 130.
  • the conductor segments 130 are relatively thin relative to the LED segments 102, 104. When the LED filaments 100 are bent, the conductor segments 130 are the primary bend portions, while the thinner conductor segments 130 help to be Bend into a variety of curves.
  • each conductor segment 130 will form a smooth transition surface curve between adjacent LED segments 102, 104.
  • the conductor segments 130 will start from one end adjacent to the LED segments 102, 104 toward the conductor segment 130. In the middle, it gradually becomes thinner, that is, the connection between the conductor segment 130 and the LED segments 102, 104 will have a smooth curve, so that when the LED filament is bent, the stress can be dispersed, so that the stress is not concentrated. Between the conductor segments 130 and the LED segments 102, 104, thereby reducing the chance of cracking or even cracking of the light converting layer 120.
  • the conductor segments 130 may also be relatively thick relative to the LED segments 102, 104, and the light conversion layer 120 of the LED segments 102, 104 and the light conversion layer 120 of the conductor segments 130 may be made of different materials.
  • the light conversion layer 120 of the LED segments 102, 104 may be set to be relatively rigid and supportive, and the light conversion layer 120 of the conductor segment 130 may be changed to a flexible transparent seal such as PMMA, resin or the like.
  • a closure made of a single material or a composite material.
  • the LED filament 100 shown in FIG. 4B can be used in combination with the LED filament 100 shown in FIG. 4D, that is, the conductor segment 130 of such an LED filament 100 has a wavy recessed structure 132a, and the inside of the LED filament There is also an auxiliary strip 132c so that the LED filament not only contributes to being bent and flexed, but also has excellent supportability.
  • the LED filaments shown in FIG. 4I can be used in combination with the LED filaments shown in FIG. 4G, that is, the particles distributed in the LED segments 102, 104 of such LED filaments are different from the particles distributed in the conductor segments 130.
  • the size, the different materials and/or the different densities, and the conductor segment 130 also has a spiral structure 132e, so that the LED filament not only helps to be flexed and flexed, but also makes the light distribution more uniform, thereby enhancing the full circumference light. The effect of lighting.
  • the LED filament 200 includes a plurality of LED segments 202, 204, a conductor segment 230, at least two electrodes 210, 212, and a light conversion layer 220.
  • the conductor segments 230 connect the adjacent two LED segments 202, 204, and the electrodes 210, 212 are disposed corresponding to the LED chips 202, 204, and are electrically connected to the LED segments 202, 204.
  • the LED segments 202, 204 include at least two LED chips 242 that are electrically connected to each other.
  • the light conversion layer 220 covers the LED segments 202, 204, the conductor segments 230 and the electrodes 210, 212, and exposes a portion of the two electrodes 210, 212, respectively.
  • the LED filament 200 further includes a plurality of circuit films 240 (also referred to as light transmissive circuit films).
  • the LED chips 202 and 204 and the electrodes 210 and 212 are electrically connected to each other through the circuit film 240, and the light conversion layer 220 covers the circuit film 240.
  • the length of the circuit film 240 is less than the length of the conductor 230a, or the shortest distance between two LED chips respectively located in adjacent LED segments 202, 204 is greater than the distance between adjacent LED chips in the LED segments 202/204.
  • FIG. 6A is a schematic structural view of another embodiment of the segmented LED filament of the present invention.
  • One of the differences between the segmented LED filament 400 shown in Figures 6A through 6G and the segmented LED filament 100 shown in Figures 4A through 4K is that the segmented LED filament 400 shown in Figures 6A through 6G
  • the light conversion layer 420 can be further divided into a two-layer structure.
  • the structure shown in FIGS. 4C to 4K can also be employed in FIG. 6A or FIG. 6B. As shown in FIG.
  • the LED filament 400 has a light conversion layer 420, LED segments 402, 404, electrodes 410, 412, and a conductor segment 430 for electrically connecting between adjacent LED segments 402, 404.
  • the LED segments 402, 404 include at least two LED chips 442 that are electrically connected to each other by wires 440.
  • the conductor segment 430 includes a conductor 430a that connects the LED segments 402, 404, wherein the shortest distance between the two LED chips 442 located in adjacent two LED segments 402, 404 is greater than the LED segment 402/404 internal phase. The distance between adjacent two LED chips, the length of the wire 440 is less than the length of the conductor 430a.
  • the light conversion layer 420 is coated on at least two sides of the LED chip 442/electrodes 410, 412. Light conversion layer 420 exposes a portion of electrodes 410, 412.
  • the light conversion layer 420 can have at least one top layer 420a and one base layer 420b as the upper layer and the lower layer of the filament respectively. In this embodiment, the top layer 420a and the base layer 420b are respectively located on both sides of the LED chip 442/electrodes 410 and 412.
  • the top layer 420a described herein with respect to Figures 6A-6M is in the LED segment 402, 404 or conductor segment 430, its thickness, diameter or width in the radial direction of the LED filament, or the LED segment 402,
  • the thickness, diameter or width of the top layer of the 404 or conductor segment 430 in the radial direction of the LED filament refers to the upper surface of the top layer 420a to the top layer 420a and the base layer 420b in the LED segment 402, 404 or the conductor segment 430, respectively, in the radial direction of the LED filament.
  • the interface, or to the LED chip 442 or the distance between the conductor 430a and the base layer 420b, the upper surface of the top layer 420a is a surface away from the base layer.
  • the top layer 420a and the base layer 420b may each have different particles or different particle densities according to different needs.
  • the base layer 420b may add more light scattering particles to increase the light dispersion of the base layer 420b, thereby maximizing the brightness of the base layer 420b, or even The brightness that can be produced near the top layer 420a.
  • the base layer 420b may also have a higher density phosphor to increase the hardness of the base layer 420b.
  • the base layer 420b may be prepared first, and then the LED chip 442, the wire 440 and the conductor 430a may be disposed on the base layer 420b. Since the base layer 420b has a hardness that can satisfy the subsequent arrangement of the LED chips and the wires, the LED chips 442, the wires 440, and the conductors 430a can be more stable in arrangement without sag or skew. Finally, the top layer 420a is overlaid on the base layer 420b, the LED chip 442, the wires 440, and the conductor 430a.
  • the conductor segments 430 are also located between the adjacent two LED segments 402, 404, and the plurality of LED chips 442 in the LED segments 402, 404 are electrically connected to each other through the wires 440. connection.
  • the conductor 430a in the conductor segment 430 of Fig. 6B is not in the form of a wire but in a sheet or film form.
  • the conductor 430a can be a copper foil, gold foil, or other material that can conduct electrical conduction.
  • the conductor 430a is attached to the surface of the base layer 420b adjacent to the top layer 420a, that is, between the base layer 420b and the top layer 420a.
  • the conductor segments 430 and the LED segments 402, 404 are electrically connected by wires 450, that is, the two LED chips 442 located in the adjacent two LED segments 402, 404 and having the shortest distance from the conductor segments 430 are through the wires 450 and the conductor segments 430.
  • the conductor 430a is electrically connected.
  • the length of the conductor segment 430 is greater than the distance between adjacent two LED chips in the LED segments 402, 404, and the length of the wire 440 is less than the length of the conductor 430a.
  • the thickness of the electrode and the conductor in the radial direction of the filament is 0.5H to 1.4H, preferably 0.5H to 0.7H. This ensures that the wire bonding process is carried out while ensuring the quality of the wire bonding process (ie having good strength) and improving the stability of the product.
  • the LED segments 402, 404 and the conductor segments 430 of the LED filament have different structural features.
  • the LED segments 402, 404 and the conductor segments 430 have different widths, thicknesses, or diameters in the radial direction of the LED filaments.
  • the conductor segments 430 are relatively thin with respect to the LED segments 402, 404. When the LED filaments are bent, the conductor segments 430 serve as the primary bend portions, while the thinner conductor segments 430 help to be bent. Fold into a variety of curves.
  • the base layer 420b whether in the LED segments 402, 404 or in the conductor segment 430, has a uniform width, thickness or diameter in the radial direction of the LED filament; and the top layer 420a is in the LED segment 402. , 404 and in conductor segment 430, which have different widths, thicknesses or diameters in the radial direction of the LED filament.
  • the top layer 420a of the LED segments 402, 404 has a maximum diameter D2 in the radial direction of the LED filament, while the top layer 420a of the conductor segment 430 has the largest diameter D1 in the radial direction of the LED filament. , D2 will be greater than D1.
  • the diameter of the top layer 420a is gradually reduced from the LED segments 402, 404 to the conductor segments 430, and is gradually increased from the conductor segments 430 to the LED segments 402, 404, so that the top layer 420a will form a smooth concave-convex curve along the axial direction of the LED filaments.
  • the top layer 420a of the LED segments 402, 404 has the largest diameter (or maximum thickness) in the radial direction of the LED filament, and the diameter of the top layer 420a is from the LED segments 402, 404 to the conductor. Segment 430 is gradually reduced and a portion of conductor 430a, such as the intermediate portion, is not covered by top layer 420a.
  • the base layer 420b whether in the LED segments 402, 404 or in the conductor segment 430, has a uniform width, thickness or diameter in the radial direction of the LED filament.
  • the number of LED chips 442 in each of the LED segments 402, 404 may be different. For example, some LED segments 402, 404 have only one LED chip 442, and some LED segments 402, 404. There are two or more LED chips 442.
  • the LED segments 402, 402 may be different in type, except that the number of LED chips 442 may be different.
  • the top layer 420a is uniform in width, thickness or diameter in the radial direction of the LED filament, whether in the LED segments 402, 404 or in the conductor segment 430, and the base layer
  • the 420b may then be recessed or hollowed out at the at least one conductor 430a such that a portion (e.g., the intermediate portion) of the at least one conductor 430a is not covered by the base layer 420b, while the other at least one conductor 430a is completely covered by the base layer 420b.
  • the top layer 420a is uniform in width, thickness or diameter in the radial direction of the LED filament, whether in the LED segments 402, 404 or in the conductor segment 430, and the base layer 420b is then recessed or hollowed out at all conductors 430a such that a portion (e.g., the intermediate portion) of each conductor 430a is not covered by the base layer 420b.
  • the top layer 420a of the LED segments 402, 404 has the largest diameter in the radial direction of the LED filament, and the diameter of the top layer 420a is gradually reduced from the LED segments 402, 404 to the conductor segment 430. And a portion of the conductor 430a, such as the intermediate portion, is not covered by the top layer 420a.
  • the base layer 420b is recessed or hollowed out at the conductor 430a such that a portion (e.g., the intermediate portion) of the conductor 430a is not covered by the base layer 420b. In other words, at least opposite sides of the conductor 430a are not covered by the top layer 420a and the base layer 420b, respectively.
  • the embodiment shown in Figures 6E to 6G above illustrates that when the base layer 420b has a depression or hollowing out in part or all of the conductor segments 430, the recessed or hollowed out form may also be a slit or a slit, that is, The conductor segments 430 are well bent and the conductors 430a are not exposed.
  • the conductor 430a is, for example, a conductive metal piece or a metal strip.
  • the conductor 430a has a thickness Tc, and since the LED chip 442 is thinner with respect to the conductor 430a, the thickness Tc of the conductor 430a is significantly larger than the thickness of the LED chip 442.
  • the thickness Tc of the conductor 430a is closer to the thickness of the top layer 420a at the conductor segment 430 (the thickness of the top layer 420a at the conductor segment 430 can be referred to the diameter of the aforementioned top layer 420a in the radial direction.
  • the top layer 420a is identical in conductor segment 430 to the thickness of the LED segments 402, 404 (the thickness of the top layer 420a in the LED segments 402, 404 can be referenced to the diameter D2 of the aforementioned top layer 420a in the radial direction). of.
  • the thickness Tc of the conductor 430a is also significantly larger than the thickness of the LED chip 442, and the thickness Tc of the conductor 430a is closer to the top layer 420a at the conductor segment 430 with respect to the thickness of the LED chip 442. Thickness (diameter D1). Also, in the present embodiment, the thickness of the top layer 420a is inconsistent with the thickness of the conductor segments 430 and the LED segments 402, 404. As shown in FIG.
  • the top layer 420a of the LED segments 402, 404 has a minimum diameter D2 in the radial direction of the LED filament, while the top layer 420a of the conductor segment 430 has the largest diameter D1 in the radial direction of the LED filament. , D1 will be greater than D2.
  • the diameter of the top layer 420a is gradually increased from the LED segments 402, 404 to the conductor segments 430, and then gradually decreases from the conductor segments 430 to the LED segments 402, 404, so that the top layer 420a will form a smooth concave-convex curve along the axial direction of the LED filaments. .
  • the thickness Tc of the conductor 430a is also significantly larger than the thickness of the LED chip 442, however, the top layer 420a of the LED segments 402, 404 has the largest diameter in the radial direction of the LED filament, and The diameter of the top layer 420a is gradually reduced from the LED segments 402, 404 to the conductor segments 430, and a portion of the conductor 430a (e.g., the intermediate portion) is not covered by the top layer 420a.
  • the thickness of the conductor 430a is also significantly larger than the thickness of the LED chip 442, and the thickness of the conductor 430a is closer to the thickness of the top layer 420a at the conductor segment 430 with respect to the thickness of the LED chip 442.
  • the top layer 420a has a width W1
  • the LED chip 442 has a width W2
  • the width W2 of the LED chip 442 is close to the width W1 of the top layer 420a.
  • the top layer 420a is slightly larger than the LED chip 442 in the width direction and slightly larger than the conductor 430a in the thickness direction.
  • the width W1 of the top layer 420a: the width W2 of the LED chip 442 is 2 to 5:1.
  • the base layer 420b has the same width W1 as the top layer 420a, but is not limited thereto.
  • the conductor segment 430 further includes a wavy recess structure 432a disposed on one side surface of the conductor segment 430.
  • the recessed structure 432a is recessed by the upper side surface of the top layer 420a of the conductor segment 430.
  • the plurality of recessed structures 432a are spaced apart in the axial direction and are parallel to each other to present a continuous wave shape. In some embodiments, the plurality of recessed features 432a are continuously closely aligned in the axial direction. In some embodiments, the undulating recessed structure 432a may also be disposed around the entire outer peripheral surface of the conductor segment 430 centering on the axial direction of the LED filament. In some embodiments, the wavy concave structure 432a may also be changed to a wavy convex structure (as shown in FIG. 4C). In some embodiments, the wavy concave structure and the wavy convex structure may be staggered together to form a wavy concave-convex structure.
  • the LED chip 442 has a length in the axial direction of the LED filament and has a width in the X direction, and the ratio of the length to the width of the LED chip 442 is 2:1 to 6: 1.
  • the LED chip unit can have an aspect ratio of 6:1, which enables the filament to have a large luminous flux.
  • the LED chip 442, the electrodes 410, 412 and the conductor 430a have a thickness in the Y direction, the thickness of the electrodes 410, 412 is smaller than the thickness of the LED chip 442, and the thickness Tc of the conductor 430a is also smaller than the thickness of the chip 442, that is, the conductor 430a and The electrodes 410, 412 appear to be thinner than the chip 442.
  • the top layer 420a and the base layer 420b have a thickness in the Y direction, and the thickness of the base layer 420b is smaller than the maximum thickness of the top layer 420a.
  • the conductor 430a exhibits a parallelogram rather than a rectangle in a top view along the Y direction, that is, the angle of the four sides of the conductor 430a presented in the top view is not a 90 degree angle.
  • the two ends of the LED chip 442 are respectively connected to the wire 440 or the wire 450 to be connected to the other chip 442 or the conductor 430a through the wire 440 or the wire 450, and the two ends of the LED chip 442 are used to connect the wire 440 or The connection points of the wires 450 are not aligned with each other in the axial direction of the LED filaments.
  • connection point of one end of the chip 442 is offset toward the negative X direction
  • connection point of the other end of the chip 442 is offset toward the positive X direction, that is, the two connection points of the two ends of the chip 442 are at the X.
  • FIG. 6K a wavy concave or convex structure 432a as shown in FIG. 6K, which is a wave shape showing a depression and a bulge in the Y direction, but is kept linear in the axial direction of the LED filament (in a top view,
  • the wavy concave or convex structure 432a is a straight line arranged along the axial direction of the LED filament, or the connection of the lowest point of the concave structure 432a in the Y direction or the highest point of the convex structure 432a in the Y direction.
  • the line is a straight line.
  • 6L is not only undulated in the Y direction but also curved in the axial direction of the LED filament (in the top view, the wavy recessed or raised structure) 432a is a curve arranged along the axial direction of the LED filament, or a line connecting the lowest point of the recessed structure 432a in the Y direction or the highest point of the convex structure 432a in the Y direction is a curve.
  • Fig. 6M which is a partial top view of the conductor segment 430 of Fig. 6L, which presents a wavy depression or raised structure 432a
  • Fig. 6L shows the curved configuration of the conductor segment 430 in the axial direction of the LED filament.
  • the width of each recessed structure 432a itself in the axial direction of the LED filament is irregular, that is, the width of any two places of each recessed structure 432a in the axial direction of the LED filament is Unequal, for example, two places of a certain recessed structure 432a in FIG. 6M have a width D1 and a width D2, respectively, and the width D1 and the width D2 are not equal.
  • the width of each of the recessed structures 432a in the axial direction of the LED filament is also irregular.
  • the width of each other the two recessed structures 432a in FIG. 6M have a width D1 and a width D3 at two positions aligned in the axial direction, respectively, and the width D1 and the width D3 are not equal.
  • the shape of the recessed or raised structure 432a is a straight strip or a combination of a straight strip and a wave, and a recessed or raised structure 432a of the top layer 420a at the conductor segment 430 in a top view of the conductor segment
  • the shape can be a straight line or a combination of a straight line and a wavy line.
  • Figure 7 illustrates another embodiment of a layered structure of LED filaments.
  • the LED segments 402, 404, the gold wires 440, and the top layer 420a are disposed on both sides of the base layer 420b, that is, the base layer 420b is located in the middle of the two top layers 420a.
  • the electrodes 410, 412 are respectively disposed at both ends of the base layer 420b.
  • the LED segments 402, 404 in the upper and lower top layers 420a of the figure can be connected to the same electrode 410/412 by gold wires 440. In this way, the light can be made more uniform, and the shape of the gold wire 440 can have a bent shape (for example, a slightly M-shape in FIG. 4H) to reduce the impact force, and can also be a more common arc or straight shape.
  • Fig. 8 shows another embodiment of the filament layered structure of the present invention.
  • the light conversion layer of the filament 400 includes a top layer 420a and a base layer 420b.
  • Each side of the LED segments 402, 404 is in direct contact with the top layer 420a; and the base layer 420b is not in contact with the LED segments 402, 404.
  • the base layer 420b may be preformed, and the LED segments 402, 404 and the top layer 420a are formed second.
  • the base layer 420b of the filament 400 is formed as a wavy surface having a high and low undulation, and the LED segments 402, 404 are disposed thereon with high and low undulations and are inclined.
  • the filament has a wider exit angle. That is to say, if the contact surface of the bottom surface of the base layer and the surface of the work surface is a horizontal plane, the arrangement of the LED segments does not need to be parallel to the horizontal plane, but is arranged at a certain angle with the horizontal plane, and each LED segment is arranged.
  • the configured height/angle/direction can also be different. In other words, if a plurality of LED segments are connected in series at the center point of the LED segment, the formed line may not be a straight line. In this way, the filament 400 can be provided with an effect of increasing the light exit angle and uniform light emission even in a state where the filament 400 is not bent.
  • the filament 400 has: LED segments 402, 404; electrodes 410, 412; gold wires 440; a light conversion layer 420, and a conductor segment 430 electrically connecting the two LED segments 402, 404.
  • the LED segments 402, 404 include at least two LED chips 142 that are electrically connected to each other by wires 440.
  • the light conversion layer 420 includes a base layer 420a and a top layer 420b, and a copper foil 460 having a plurality of radial openings is attached to the base layer 420a.
  • the upper surface of the copper foil 460 may further have a silver plating layer 461, and copper foils at both ends of the filament head and tail serve as electrodes 410, 412 and extend beyond the light conversion layer 420.
  • the LED segments 402, 404 can be fixed to the base layer 420a by means of a solid crystal glue or the like. Thereafter, a phosphor paste or phosphor film is applied to cover the LED segments 402, 404, the gold wires 440, the conductor segments 430, and a portion of the electrodes 410, 412 to form the light conversion layer 420.
  • the width or/and the length of the opening of the copper foil 460 is larger than the LED chip 442, the position of the LED chip is defined, and at least two of the six faces of the LED chip (the five faces in this embodiment) are contacted and Top layer of phosphor glue coated.
  • the combination of the copper foil 460 and the gold wire 440 is a lamp ribbon to stabilize and maintain a flexible conductive structure; the silver plating layer 461 has an effect of increasing light reflection in addition to good electrical conductivity.
  • the filament 400 is similar to the filament disclosed in FIG. 10, and the difference is that: (1) the LED chip 442 used for the filament 400 is a flip chip having the same solder fillet height, and will directly The solder fillet is attached to the silver plating layer 461; (2) the length of the filament opening described above (ie, the length in the axial direction of the filament) must be larger than the LED chip 442 in order to accommodate the LED chip 442, and the LED of the filament of the present embodiment
  • the chip 442 corresponds to the opening 432 and is located above the copper foil 460/silver plating layer 461, so the length of the LED chip 442 is larger than the opening 432. This embodiment omits the step of golding the wire as compared with the previous embodiment.
  • an LED filament as shown in FIG. 11 can be used.
  • the flip chip is used for flip-chip configuration, that is, the original height of different solder fillets is processed to the same height (usually the lower N-pole extension is treated to the same height as the P-pole).
  • the LED filament 400 is further cut into two parts to schematically show its internal structure.
  • the small part is that the rectangular ABCD is defined by rotating 360 degrees around the line CD (ie, the central axis of the LED filament).
  • most of the rectangular ABCD is defined by rotating 360 degrees around the line CD.
  • the area of the enclosure 420 is defined by an imaginary set of parallel planes that intersect the enclosure 420 perpendicular to the longitudinal axis of the enclosure 420.
  • the enclosure 420 includes two alternating first and second light conversion layers 420a, 420b.
  • the LED filament includes an LED segment 402, 404, a sealing body 420, a conductor segment 430 and an electrode 410.
  • the conductor segment 430 is located between the adjacent two LED segments 402, 404.
  • the electrode 410 is electrically connected to the LED segment 402/404.
  • the conversion layer 420a covers the LED segments 402, 404 and the second light conversion layer 420b covers the conductor segments 430. Defined by a hypothetical set of parallel planes, LED segments 402/404 include a plurality of LED chips 442.
  • an imaginary set of parallel planes intersects the enclosure 420 at the edge of the LED segments 402/404; LED chips 442 are disposed in the LED segments 402/404; adjacent LED segments 402, 404 pass through the conductors Segment 430 is electrically connected, conductor segment 430 includes conductor 430a, conductor 430a is disposed in conductor segment 430, and both ends of conductor 430a are disposed in LED segment 402/404.
  • a hypothetical set of parallel planes intersects the enclosure 430 at the edges of the LED segments 402/404, and LED chips 442 (including edges) in the LED segments 402/404 are disposed in the LED segments 402/404.
  • Both ends of the conductor 430a for connecting the two shortest distance LED chips in the adjacent two LED segments 402, 404 are disposed in the conductor segment 430.
  • an imaginary set of parallel planes intersects the enclosure 108 at the space between adjacent LED segments 402, 404.
  • LED chips 442 are disposed in LED segments 402/404.
  • a portion of the conductor 430a for electrically connecting the adjacent two LED segments 402, 404 is disposed in the first light conversion layer 420a, and the other portion is disposed in the second light conversion layer 420b.
  • the conversion wavelength/particle size/thickness/transmittance/hardness/particle ratio of the first light conversion layer 420a and the second light conversion layer 420b may also be different, and may be adjusted as needed.
  • the first light conversion layer 420a is harder than the second light conversion layer 420b, and the first light conversion layer 420a is filled with more phosphor than the second light conversion layer 420b. Because the first light converting layer 420a is harder, it is configured to better protect the linear array of LED segments 402/404 when the LED filament is bent to maintain a desired posture in the bulb, ensuring that the bulb does not malfunction.
  • the second light converting layer 420b is made softer so that the entire LED filament is bent in the bulb to produce a full perimeter, especially one filament producing a full perimeter.
  • the first light conversion layer 420a has a better thermal conductivity than the second light conversion layer 420b, for example, more heat dissipation particles are added to the first light conversion layer 420a than the second light conversion layer 420b.
  • the first light conversion layer 420a having a higher thermal conductivity can conduct heat from the LED segments out of the filament to better protect the linear array of LED segments from degradation or burning. Because of the spacing of the conductor segments 430 from the LED segments 402/404, the conductor segments 430 act less than the LED segments 402/404 in terms of the heat that conducts the LED segments 402/404.
  • the second light conversion layer 420b is doped with less heat-dissipating particles than the first light-converting layer 420a, the cost of manufacturing the LED filament can be saved.
  • the size ratio of the first light conversion layer 420a and the envelope 420 in which the LED segments 402/404 are placed is determined by reference factors such as light conversion capability, bendability, and thermal conductivity. Otherwise, the larger the first light conversion layer 420a is than the entire package 420, the LED filament has greater light conversion capability and thermal conductivity, but will not be easily bent.
  • the outer surface of the envelope 420 shows a combination of the first light conversion layer 420a and other regions.
  • R5 is the ratio of the total area of the outer surface of the first light conversion layer 420a to the total area of the outer surface of the envelope 420.
  • R5 is from 0.2 to 0.8.
  • R5 is from 0.4 to 0.6.
  • the structure of the filament 400 shown in Fig. 13 is similar to that of Fig. 12 except that an imaginary set of parallel planes intersects the enclosure 420 just at the edges of the LED segments 402/404.
  • LED chips 442 are disposed in LED segments 402/404.
  • the LED segments 402, 404 are electrically connected to the LED segments 442 of the conductor segments 430 or the LED segments 402/404, for example, electrically connected by a first wire 440 and a second wire 450, and the second wire 450 is disposed at the conductor segment 430. in.
  • a hypothetical set of parallel planes intersects the enclosure 430 at the edges of the LED segments 402/404, and a portion (including edges) of certain LED chips 442 in the LED segments 402/404 are disposed in the LED segments 402. /404, both ends of the wires for connecting the two shortest LED chips in the adjacent two LED segments 402, 404 are disposed in the second light conversion layer 420b, that is, the second wire is disposed in the second light Conversion layer 420b.
  • an imaginary set of parallel planes intersects the enclosure 420 at a space between adjacent LED segments 402, 404. LED chips 442 are disposed in LED segments 402/404.
  • a portion of the second wire 450 for electrically connecting the adjacent LED chip 442 and the conductor 430a is disposed in the first light conversion layer 420a; and the second wire 450 for electrically connecting the adjacent LED chip 442 and the conductor 430a A portion is disposed in the second light conversion layer 420b.
  • the filament 400 has a light conversion layer 420, LED segments 402, 404, electrodes 410, 412, a conductor segment 430, and a conductor segment 430 located adjacent to the two LED segments 402, 404.
  • the LED segments 402, 404 include at least two LED chips 442 electrically connected to each other by wires 440.
  • the conductor segment 430 includes a conductor 430a, and the conductor segment 430 and the LED segments 402, 404 are electrically connected by a wire 450, that is, two LEDs respectively located in the adjacent two LED segments 402, 404 and having the shortest distance from the conductor segment 430.
  • the chip is electrically connected to the conductor 430a in the conductor segment 430 via a wire 450.
  • the length of conductor segment 430 is greater than the distance between adjacent two LED chips in LED segments 402/404, and the length of wire 440 is less than the length of conductor 430a.
  • the light conversion layer 420 is coated on at least two sides of the LED chip 442/electrodes 410, 412.
  • Light conversion layer 420 exposes a portion of electrodes 410, 412.
  • the light conversion layer 420 can have at least a top layer 420a and a base layer 420b.
  • the LED segments 402, 404, the electrodes 410, 412, and the conductor segments 430 are all attached to the base layer 420b.
  • Conductor 430a can be a copper foil or other electrically conductive material and conductor 430a has a radial opening.
  • the upper surface of the conductor 430a may further have a silver plating layer, and secondly, the LED chip 442 may be fixed to the base layer 420b by means of a solid crystal glue or the like. Thereafter, a phosphor paste or phosphor film is applied to cover the LED chip 442, the wires 440, 450, and a portion of the electrodes 410, 412 to form the light conversion layer 420.
  • the width or/and the length of the opening are respectively greater than the width or/and length of the LED chip 442, defining the position of the LED chip 442 and making at least two of the six faces of the LED chip 442 (in this embodiment, five faces) Both are contacted and coated with a top layer 420a phosphor paste.
  • the wires 440, 450 may be gold wires.
  • the combination of the copper foil and the gold wire is a lamp ribbon to stabilize and maintain a flexible conductive structure; the silver plating layer has a good electrical conductivity. Increase the effect of light reflection.
  • the shape of the conductor 430a may also be a structural design made in consideration of a gold wire connection or a filament bending.
  • a top view of conductor 430a is shown in Figure 14B.
  • the conductor 430a has a connection region 5068 and a transition region 5067 at the end of the conductor 430a and is used to electrically connect other components.
  • the conductor 430a has two connection regions 5068, and the transition region 5067 is located at the connection region 5068. Between, used to connect two joint areas 5068.
  • the width of the joint region 5068 can be greater than the transition region 5067. Since the joint is formed on the joint region 5068, a relatively large width is required.
  • the width of the joint region 5068 of the conductor 430a can be 1/4W. Between W, the connecting area 5068 can be multiple and the width does not need to be uniform; the transition area 5067 is located between the connecting areas 5068. Since the connecting area is not required to be formed on the transition area 5067, the width can be set to be thinner than the connecting area 5068, for example When the filament width is W, the width of the transition region 5067 may be between 1/10W and 1/5W, at which time the conductor 430a is more easily deformed as the filament is bent due to the thinner width of the transition region 5067 of the conductor 430a. The risk of the wire 450 near the conductor 430a being easily broken due to stress is reduced.
  • the LED chip 442 is electrically connected to the conductor 430a through the wire 450, and the conductor 430a has a "work" shape in a plan view.
  • the conductor 430a has a shape surrounded by the three sides of the LED chip 442, wherein three sides surrounding the LED chip 442 are composed of two transition regions 5067 and a joint region 5068, and at the same time form the above-mentioned radial opening structure, the two transition regions 5067 are in the LED
  • the sum of the widths in the radial direction of the filament is smaller than the width of the joint region 5068 in the radial direction of the LED filament, as shown in Fig.
  • the widths Wt1, Wt2 of the two transition regions 5067 in the radial direction of the LED filament The sum is smaller than the width Wc of the connecting portion 5068 in the radial direction of the LED filament, which can increase the mechanical strength of the conductor and the region where the LED chip 442 is located and can avoid damage of the wire 450 connecting the LED chip and the conductor.
  • the transition region The length can extend in the radial direction of the LED filament to the LED segment adjacent to the conductor segment, thereby buffering the impact of the external force on the LED chip and improving product stability.
  • the width Wc of the bonding region 5068 is equal to the width of the base layer 420b (or LED filament), and the side of the LED chip 442 that is not surrounded by the conductor 430a is electrically connected to other LED chips through the wire 440.
  • the wire 450 between the LED chip 442 and the conductor 430a is shorter than the distance between any two LED chips in the LED segment, for example, the distance between the wire between the LED chip 442 and the conductor 430a and the distance between two adjacent LED chips in the LED segment. Short, as a result, the risk of LED filaments being broken due to elastic setback stress is also low.
  • the conductor 430a in the filament has a shape as shown in FIG. 14C having a joint region 5068 and a fourth transition region 5067.
  • the conductor 430a is composed of a left half end and a right half end symmetrically in the longitudinal direction
  • FIG. 14E and FIG. 14G. 14H, 14I is a bottom view of the left half or the right half of the conductor 430a
  • the connecting zone is composed of a first connecting zone at the left half end and a second connecting zone at the right half end
  • the two transition zones are composed of the first connecting zone or the second connecting zone.
  • the two transition regions form a U shape together with the first joint region or the second joint region.
  • the conductor 430a may not be symmetric with respect to the longitudinal direction, and the transition region connecting the joint regions may be any combination of the transition regions shown in Figures 14E, 14F, and 14G, 14H, 14I.
  • the conductor 430a has a plurality of through holes 506p.
  • the base layer (for example, the phosphor film) 420b penetrates into the through hole 506p and optionally protrudes from the through hole 506.
  • FIG. 14D shows a case where the phosphor film does not protrude through the through hole.
  • FIG. 14D is roughened so that the surface thereof has better heat dissipation capability
  • FIG. 14E is FIG. 14D.
  • the top layer may protrude from the other end of the through hole toward the other end as shown in FIG. 14L or the phosphor film protrudes from the other end of the through hole toward the other end as shown in FIG. 14M, so that the top layer 420a penetrates into the base layer 420b or the base layer. 420b penetrates into the top layer 420a to increase the contact area between the top layer 420a and the base layer 420b; as shown in FIG. 14L, FIG. 14L is a cross-sectional view taken along the line E1-E2 of FIG.
  • the phosphor paste used to form the top layer 420a penetrates the through hole of the conductor 430a. After 466, it can be further extended to the base layer 420a.
  • the phosphor film used to form the base layer 420b penetrates into the through hole 506p of the conductor 430a and then further extends to the top layer 420a.
  • the contact area between the conductor 430a and the top layer 420a or the base layer 420b is increased. The increase in contact area increases the bond strength between the conductor 430a and the top layer 420a or the base layer 420b, thereby increasing the bending resistance of the conductor segments.
  • Fig. 14F and 14G, 14H, 14I are also an embodiment of a conductor 430a having a through hole
  • Fig. 14F is a partial bottom view of the LED filament of an embodiment.
  • the conductor 430a has only two transition regions; as shown in Fig. 14F, in a particular view of the LED filament, such as a bottom view, either the transition region 5067 or the junction region 5068 has a rectangular shape. Any one of the transition zones 5067 is connected to one of the opposite sides of the joint zone 5068. The two transition zones are located on the same side or different sides of the opposite sides of the joint zone 5068. In the bottom view, the transition zone 5067 is associated with the junction zone 5068.
  • the shortest distance from the center point o of the LED chip 442 to the connection region 5068 is set to r1, and the shortest distance from the center point o to the transition region 5067 is r2, and r1 is greater than or equal to r2.
  • FIG. 14F shows the case where r1 is greater than r2.
  • the base layer 420b for example, a phosphor film
  • the embedded conductor 430a is formed on the basis of the conductor 430a, as shown in FIG.
  • the LED chip 442 overlaps the transition region 5067 in the axial direction of the LED filament. In other embodiments, the LED chip 442 does not overlap the transition region 5067 in the axial direction of the LED filament in a bottom view.
  • one transition zone 5067 can be connected to the center of the joint zone 5068, and the other transition zone can be connected to both ends or the center of the joint zone 5068. In other embodiments, the other transition zone 5067 can also be connected. Any position between the ends of the region 5068 and the center of the junction region 5068. When another transition zone 5067 can be coupled to the center of the attachment zone 5068, the transition zone 5067 and the attachment zone 5068 together form a cross in a bottom view.
  • the conductor 430a has only two transition regions, the transition region 5067 of the conductor 430a is a trapezoidal shape extending from the joint region 5068, and the transition region 5067 is The entire joint region 5068 begins to extend rather than extending from either side or both sides of the opposite sides of the joint region 5068, and the width of the transition region 5067 is gradually reduced from the fixed end of the transition region 5067 toward the free end of the opposite side.
  • the fixed end of the transition zone 5067 is one end of the transition zone 5067 and the connection zone 5068.
  • the free end of the transition zone 5067 is one end away from the connection zone 5068, and the fixed end of the transition zone 5067 is aligned with the entire connection zone 5068 or the base layer 420b.
  • the width of the fixed end of the transition zone 5067 will be equal to the width of the junction zone 5068 or the base layer 420b, which in the bottom view is trapezoidal.
  • the transition zone 5067 having a width that gradually decreases from a fixed end to a free end may also be triangular or semi-circular.
  • the average width of the transition zone 5067 is less than the average width of the tie zone 5068. As shown in Fig.
  • the chip 442 is covered by the base layer 420b as viewed in this direction.
  • the LED chip 442 overlaps the transition region 5067 in a bottom view.
  • transition region 5067 of FIG. 14H is the width of the base layer 420 on which the filaments are aligned on both sides, but the center of the width direction extends toward the sides from the joint region 5068 and is tapered to form a beveled edge, such as
  • Each transition zone 5067 of the two transition zones 5067 at the left or right half will form a triangle, such as an equilateral triangle.
  • Each of the two transition zones 5067 includes a beveled edge, the two beveled edges of the two transition zones 5067 will face each other, and the two beveled edges of the two transition zones 5067 will be close to each other at the fixed end of the transition zone 5067. .
  • the two oblique sides of the two transition regions 5067 can be, but are not limited to, connected to each other.
  • the two oblique sides will gradually move away from each other from the fixed end to the free end, and the two oblique sides will respectively contact the opposite sides of the base layer 420b at the free end.
  • the distance between the two oblique sides of the transition zone 5067 in the axial direction of the LED filament gradually increases from the fixed end to the free end, and the transition zone 5067 cuts the joint zone 5068 and the base layer 420b, and its width at the fixed end is equal to the transition zone 5067.
  • the distance between the two oblique sides at the free end is also equal to the width of the joint region 5068 and the base layer 420b.
  • the fixed end and the free end are both fixed ends and free ends of the transition zone.
  • Figure 14I is similar to Figure 14H in that the hypotenuse of the transition zone 5067 is not a straight line but a stepped shape. In other embodiments, the beveled edges of the transition zone 5067 can be curved, arched, or wavy.
  • the conductor 130a in FIG. 4, the conductor 230a in FIG. 5, and the conductor 430a in FIGS. 7-9 may be the structure of the conductor 430a shown in FIG. 14, and other structures are unchanged.
  • the conductor 430a in FIG. 7 is the structure of the conductor 430a shown in FIG. 14, the rivet structure shown in FIG. 14L can be formed, and the top layer 420 penetrates into the through hole 506p of the conductor 430a and further extends to the gap between the conductor 430a and the base layer 420b.
  • the contact area between the conductor and the top layer is increased, and the increase of the contact area increases the bonding strength between the conductor and the top layer, thereby improving the bending resistance of the conductor segment.
  • the pitch D1 to D2 is a predetermined bend.
  • the conductor 430 is provided with a plurality of holes.
  • the holes 468 are from the outer side of the bend (upper in the figure), and the closer to the bent inner side (lower in the figure), the larger the hole, and the hole 468 is triangular in this embodiment.
  • the LED filament When bending the LED filament, the filament is bent upward by the F direction, and at this time, the LED filament is easily bent due to the plurality of holes 468 between the spacings D1 to D2, and the hole 468 at the bending portion can buffer the thermal stress, and Plan according to the appropriate hole shape and bending angle.
  • FIG. 14A is a bending form of the filament shown in FIG. 14A of the present invention.
  • a plurality of filaments are generally connected by electrodes to realize bending of the filament, and the bending is performed at the electrode, and the strength is low and the fracture is easy to occur.
  • the electrode occupies some space, the light-emitting area of the filament becomes small.
  • the conductor segment 430 is a bent portion of the filament, and the rivet structure and the conductor reinforcement are formed by the conductor 430a shown in Figs. 14C to 14M, so that the wire 450 connecting the LED chip 442 and the conductor 430a is less likely to be broken.
  • the conductors may be arranged in a structure as shown in Fig. 14B or provided with an accommodation space (e.g., the hole structure shown in Fig. 14N) on the conductor 430a, thereby reducing the probability of the filament cracking when bent.
  • the LED filament of the invention has the advantages of good bending resistance and high luminous efficiency.
  • the filament is similar to the filament disclosed in FIGS. 14A to 14O, except that a copper foil 460 is disposed between the two LED chips 442, and a silver plating layer 461 is disposed on the copper foil, and the LED chip passes through The wire 440 is electrically connected to the copper foil 460.
  • the filament is similar to the filament disclosed in FIGS. 14A to 14O, and the difference is that: (1) the LED chip used for the filament is a flip chip having the same solder fillet height, and the solder fillet is directly connected. On the silver plating layer 461; (2) the length of the filament opening described above (ie, the length in the axial direction of the filament) must be larger than the LED chip in order to accommodate the LED chip, and the LED chip 442 of the filament of the present embodiment corresponds to the opening 432. It is located above the copper foil 460/silver plating layer 461, so the length of the LED chip 442 is larger than the opening.
  • the LED filament structure is divided into an LED segment and a conductor segment
  • the LED filament is easy to concentrate stress on the conductor segment when bent, so that the gold wire connecting the adjacent chips in the LED segment is bent. Reduce the chance of breakage, thereby improving the overall quality of the LED filament.
  • the conductor segment is made of a copper foil structure, which reduces the length of the metal wire and further reduces the probability of fracture of the broken metal wire.
  • the conductor in the LED filament conductor segment may be "M" shaped or waved. Shape to provide a better extension of the LED filament.
  • 17A to 17C show an embodiment of the treatment of the surface angle of the filament, which are both cross sections of the filament.
  • the top layer 420a in Fig. 17A, Fig. 17B, and Fig. 17C is formed by a dispenser, and the phosphor viscosity adjustment is performed so that both sides of the top layer after the dispensing are naturally collapsed to form an arcuate surface.
  • the cross section of the base layer 420b of Fig. 17A is a quadrilateral section formed by vertical cutting.
  • the cross-section of the base layer 420b of Fig. 17B is a trapezoidal cut surface having a beveled Sc formed by cutting a beveled or angled tool.
  • the base layer 420b of Fig. 17C is similar to the base layer 420b of Fig. 17A, but the two corners located below the figure are surface-treated to form a circular arc angle Se.
  • the filament can achieve different light-emitting surface angles and light-emitting effects when the LED chips in the filament are illuminated.
  • the base layer 420b of Fig. 17D is similar to the base layer 420b of Fig. 17B, but the oblique side Sc of the base layer 420b in Fig. 17D extends along the top layer 420a, and the cross section of the top layer 420a is divided into the arc portion of the top and the oblique side of the side.
  • the top layer 420a of FIG. 17D and the base layer 420b will have a common bevel Sc, and the two beveled Scs are located on opposite sides of the LED filament.
  • the hypotenuse Sc of the top layer 420a aligns with the hypotenuse Sc of the base layer 420b.
  • the section of the top layer 420a in Fig. 17D will have an outer contour composed of an arched edge and two opposite oblique sides Sc.
  • the LED chip completes the solid crystal bonding on the surface of the large-area base layer 420a, uniformly applies the top layer 420a to the upper surface of the large-area base layer 420a, and then performs the cutting process of the filament strip, thereby forming
  • the top layer 420a and the base layer 420b shown in Fig. 17D will have a common bevel Sc.
  • FIG. 17E is a schematic view showing the arrangement of the LED chip 442 in FIG. 17A.
  • the thickness and diameter of the base layer 420b may be smaller than the thickness and diameter of the top layer 420a.
  • the thickness T2 of the base layer 420b is smaller than the thickness T1 of the top layer 420a, and the thickness of the base layer 420b or the top layer 420a may be uneven due to the process, and T1 and T2 represent the maximum thickness of the top layer 420a and the base layer 420b, respectively. Values; in addition, the LED chip 442 is placed on the surface of the base layer 420b and wrapped in the top layer 420a.
  • a filament electrode (not shown) may be disposed primarily in the base layer 420b. In the case where the base layer 420b is thinner than the top layer 420a, the heat generated by the filament electrode can be more easily dissipated from the base layer 420b.
  • the LED chip 442 is disposed facing (the main light-emitting direction) the top layer 420a, so that most of the light from the LED chip 442 will penetrate the top layer 420a, which causes the base layer 420b to have a higher relative brightness than the top layer 420a. Low brightness.
  • the top layer 420a has a relatively large amount of light reflecting/diffusing particles (e.g., phosphor) that can reflect or diffuse light toward the base layer 420b, and the light can easily penetrate the thinner base layer 420b, thereby allowing the top layer 420a and the base layer 420b to The brightness is even.
  • the phosphor concentration of the top layer 420a can be configured to be greater than the phosphor concentration of the base layer 420b, so that the color temperature of the LED filament is more uniform.
  • W1 is the width of the base layer 420b or the top layer 420a
  • W2 is the width of the LED chip 442.
  • W1 represents the width of the upper surface of the base layer 420b or the width of the lower surface of the top layer 420a
  • W1: W2 1: 0.8 to 0.9
  • the upper surface of the base layer 420b contacts the LED chip 402, and the base layer 420a is under
  • the surface is away from the LED chip 442 and opposite to the upper surface of the base layer 420b; the upper surface of the top layer 420b is away from the LED chip 442, and the lower surface of the top layer 420b is opposite to the upper surface of the top layer 420b and contacts the base layer 420a.
  • W1 indicates the width of the upper surface of the base layer 420b (or the minimum value of the width of the base layer 420b);
  • Fig. 17F is a schematic view showing the arrangement of the LED chip 402 in Fig. 17B, and W1 is the width of the lower surface of the top layer 420b ( Or the maximum value of the width of the top layer 420a); when an embodiment such as the top layer 420a of FIG. 17D and the base layer 420b have a common oblique side Sc, W1 is the width of the lower surface of the top layer 420a (or the maximum of the width of the base layer 420b).
  • W1 and W2 can be designed to be unequal, and W1>W2; Ensure that the filament has a certain flexibility and can have a small radius of curvature when bending (make sure the filament can maintain a certain degree of flexibility), so the ratio of the thickness and width of the cross section perpendicular to the length of the filament is ideal. Consistent. With this design, the filament can be easily realized with a full-circumferential effect and has a better bending property.
  • the light emitted by the LED chip 442 passes through the A to F interface, wherein the interface A is the interface between the GaN and the top layer 420a in the LED chip 442.
  • the B interface is the interface between the top layer 420a and the inert gas
  • the C interface is the interface between the substrate and the solid crystal glue 450 in the LED chip 442
  • the interface D is the interface between the solid crystal glue 450 and the base layer 420b
  • the interface E is the interface between the base layer 420b and the inert gas.
  • the F interface is the interface between the base layer 420b and the top layer 420a.
  • the refractive indices of the two substances at any interface are n1 and n2, respectively, then
  • the refractive indices of the two substances at any of the four interfaces B, E, D, and F are respectively n1 and n2, and then
  • the refractive indices of the two substances at any of the two interfaces D and F are respectively n1 and n2, then
  • the incident angle is ⁇ 1
  • the refraction angle is ⁇ 2
  • the refractive index of the base layer 420b is n1
  • the refractive index of the top layer 420a is n2
  • the LED filament unit 400a1 including a single LED chip 442 is taken as a boundary line between the midpoints of two adjacent LED chips 442, and FIG. 19A shows the LED filament unit 400a1 in the axial direction of the LED filament.
  • FIG. 19B is a cross-sectional view of the LED filament unit 400a1 in the radial direction of the LED filament.
  • the illumination angle of the LED chip 442 in the axial direction of the LED filament is ⁇
  • the illumination angle of the LED chip 442 in the radial direction of the LED filament is ⁇ , which defines the surface of the LED chip 442 away from the base layer 420b.
  • the distance from the upper surface of the LED chip 442 to the outer surface of the top layer in the radial direction of the LED filament is H
  • the length of the LED filament unit 400a1 in the longitudinal direction of the LED filament is C
  • one LED in the LED filament The light exiting area of the chip 442 in the axial direction of the LED filament is a central angle ⁇
  • the top layer 420a has a sector-shaped area corresponding to the thickness H of the upper surface of the LED chip 442, and is set between the ends of the arc length in the sector area, and the LED filament shaft
  • the straight line distance parallel to the direction is L1; the light exiting area of one LED chip 442 in the radial direction of the LED filament is the central angle ⁇ , and the top layer 420a has a sector area corresponding to the thickness H of the upper surface of the LED chip 442.
  • the linear distance between the ends of the arc length in the sector area and the radial direction of the LED filament is set to L2.
  • the LED filament has ideal light-emitting area, better bending property and heat dissipation performance, avoiding obvious dark areas of the LED filament and reducing material waste.
  • the L1 value can be designed to be 0.5C ⁇ L1 ⁇ 10C, preferably C ⁇ L1 ⁇ 2C.
  • the adjacent LED chip 442 cannot obtain an intersection in the axial direction, and the LED filament may have a dark area in the axial direction; and when the L2 value is smaller than the W1 value, it represents The LED chip 442 is too large in radial/width of the LED filament, and it is also possible to cause the top layer 420a to create dark areas on both sides in the radial/width direction. The appearance of dark areas not only affects the overall light output efficiency of the LED filament, but also indirectly causes waste of material use.
  • the specific values of ⁇ , ⁇ depend on the type or specification of the LED chip 442.
  • H L1/2tan0.5 ⁇ , 0.5C ⁇ L1 ⁇ 10C, then 0.5C/2tan0.5 ⁇ H ⁇ 10C/2tan0.5 ⁇ ;
  • H L2/2tan0.5 ⁇ , L2 ⁇ W1, then H ⁇ W1/2tan0.5 ⁇ ;
  • Hmax 10C/2tan0.5 ⁇
  • Hmin a
  • setting a is the maximum value of both 0.5C/2tan0.5 ⁇ and W1/2tan0.5 ⁇
  • setting A is the maximum value of both 0.5C/2tan0.5 ⁇ and W1/2tan0.5 ⁇
  • setting A is the maximum value of both 0.5C/2tan0.5 ⁇ and W1/2tan0.5 ⁇
  • setting A is the maximum value of both 0.5C/2tan0.5 ⁇ and W1/2tan0.5 ⁇
  • a ⁇ H ⁇ 10C/2tan0.5 ⁇ preferably A ⁇ H ⁇ 2C/2tan0.5 ⁇ .
  • the setting b is the maximum of 0.14C and 0.28W1, and B is 0.28C and 0.28W1.
  • the maximum value is b ⁇ H ⁇ 2.9 C; preferably B ⁇ H ⁇ 0.58 C.
  • H L1/2tan0.5 ⁇ , 0.5C ⁇ L1 ⁇ 10C;
  • W2/0.9 ⁇ W1 ⁇ d Preferably, W2/0.9 ⁇ W1 ⁇ D.
  • the range of the width W of the filament can be known, so that the filament has the radial direction and the axial direction of the filament. More excellent light exit area.
  • LED chips have an illumination angle of 120° in the axial direction of the LED filament and in the radial direction of the LED filament.
  • the e is the minimum of 10C and 3.46H, and E is the smallest of 2C and 3.46H.
  • 1.1 W2 ⁇ W1 ⁇ e preferably 1.1 W2 ⁇ W1 ⁇ E.
  • H L1/2tan0.5 ⁇ , 0.5C ⁇ L1 ⁇ 10C, then 0.2Htan0.5 ⁇ C ⁇ 4Htan0.5 ⁇ ;
  • H L2/2tan0.5 ⁇ , L2 ⁇ W1, then L1 ⁇ W1tan0.5 ⁇ /tan0.5 ⁇ ;
  • f be the maximum value of both 0.2Htan0.5 ⁇ and 0.1W1tan0.5 ⁇ /tan0.5 ⁇
  • F is the maximum value of both Htan0.5 ⁇ and 0.1W1tan0.5 ⁇ /tan0.5 ⁇ , so f ⁇ C ⁇ 4Htan0.5 ⁇ , preferably F ⁇ C ⁇ 2Htan0.5 ⁇ ;
  • the range of the width C of the filament is known, so that the LED filament has a superior light-emitting area in both the radial direction and the axial direction of the filament.
  • LED chips have an illumination angle of 120° in the axial direction of the LED filament and in the radial direction of the LED filament.
  • the setting g is the maximum value of 0.34H and 0.1W1
  • G is the maximum value of 1.73H and 0.1W1.
  • the thickness of the LED chip 442 is small relative to the thickness of the top layer 420a, it is negligible in most cases, that is, H also represents the actual thickness of the top layer 420a.
  • the height of any of the two top layers 420a as shown in Figure 7 is also applicable to the range of H in the above.
  • the difference from FIG. 7 is that the LED chip 442 and the electrodes 410 and 412 are placed on one surface of the base layer 420b, and the LED chip 442 and the electrodes 410 and 412 are not disposed on the other surface opposite to the surface.
  • the height of the top layer 420a in this embodiment applies to the range of H above.
  • the light conversion layer is similar to the structure of the light conversion layer 420 as shown in FIG. 6A and FIG. 7 , for example, only differs from the position of the electrodes shown in FIG. 6A and FIG. 7 , and the height of the top layer 420 a is suitable for The range of H above.
  • FIG. 20A and 20B are cross-sectional views of the LED filament unit 400a1 of a different top layer 420a shape, and the surface of the LED chip 442 which is away from the base layer 420b and which is in contact with the surface of the base layer 420b is denoted as Ca.
  • the shape of the top layer 420a is a semicircle of different diameters, and the center o of the top layer 420a does not overlap with the light exit surface Ca of the LED chip 442, and the light is incident on the outer circumference of the top surface 420a.
  • the distances above are r1 and r2, respectively.
  • a top layer 420a has a semicircular shape, and the other top layer 420a has an elliptical shape, wherein the major axis of the ellipse has the same length as the semicircular diameter, and the top layer 420a
  • the center point o of the center o and the ellipse does not overlap with the light exit surface A of the LED chip.
  • the center O of the top layer 420a indicated by the solid line does not overlap with the light-emitting surface A of the LED chip, and the center O' of the top layer 420a indicated by the broken line overlaps with the light-emitting surface of the LED chip, and the semi-circle with the center of O is The radius of the semicircle of O' is equal.
  • tan ⁇ m1/r
  • tan ⁇ m2/r
  • m1 is larger than m2
  • ⁇ is larger than ⁇ , so when the light emitting surface overlaps with the center of the circle (ie, the LED chip emits Ca)
  • the distance from the center point to the outer surface of the top layer is substantially the same), and the light extraction efficiency is better.
  • the LED chip can be replaced by a back plated chip, and the plated metal is silver or gold alloy.
  • the specular reflection can be improved, and the amount of light emitted from the light emitting surface A of the LED chip can be increased.
  • 21A is a top plan view of an embodiment of the LED filament 300 in an unbent state in accordance with the present invention.
  • the LED filament 300 includes a plurality of LED chip units 302, 304, a conductor 330a, and at least two electrodes 310, 312.
  • the LED chip units 302 and 304 may be a single LED chip, or may include a plurality of LED chips, that is, equal to or larger than two LED chips.
  • the conductor 330a is located between the adjacent two LED chip units 302, 304, the LED chip units 302, 304 are at different positions in the Y direction, the electrodes 310, 312 are corresponding to the LED chip units 302, 304, and are electrically connected through the wires 340.
  • the LED chip units 302 and 304 are connected, and the adjacent LED chip units 302 and 304 are electrically connected to each other through the conductor 330a.
  • the angle between the conductor 330a and the filament in the longitudinal direction (X direction) is 30° to 120°, preferably 60°. 120°.
  • the direction of the conductor 330a is parallel to the X direction, and the internal stress acting on the cross-sectional area of the conductor when the filament is bent at the conductor is large, and the conductor 330a is disposed at a certain angle with the X direction, which can effectively reduce The internal stress acting on the cross-sectional area of the conductor when the filament is bent.
  • the wire 340 is at an angle, parallel, vertical or any combination with the X direction.
  • the LED filament 300 includes two wires 340, one wire 340 is parallel to the X direction, and the other wire 340 is in the X direction. It is 30° to 120°.
  • the LED filament 300 emits light after its electrodes 310, 312 are powered (voltage source or current source).
  • 21B to 21D show the case where the conductor of FIG. 21A is 90° with respect to the X direction, that is, the conductor 330a is perpendicular to the X direction, which can reduce the internal stress on the conductor cross-sectional area when the filament is bent, and the embodiment shown in FIG. 21B
  • the middle wire 340 is parallel and vertically combined with the X direction, and the LED filament 300 includes two wires 340, one wire 340 being parallel to the X direction and the other wire 340 being perpendicular to the X direction.
  • the difference from the embodiment shown in FIG. 21B is that the wire 340 is perpendicular to the X direction, and the bending property between the electrodes 310, 312 and the LED chip units 302, 304 is improved due to the conductor 330a.
  • the wire 340 is disposed at the same time as the X direction, so that the filament can have good bendability at any position.
  • 21E is a top view of the embodiment of the LED filament 300 in an unbent state according to the present invention, which is different from the embodiment shown in FIG. 21C in that the LED chip unit 304 is in the adjacent two LED chip units 302 in the X direction.
  • the projection in the Y direction does not have an overlap with the LED chip unit 302, so that when the filament is bent at the conductor 330a, the chip is not damaged, thereby improving the stability of the product quality.
  • the LED filament 300 includes a plurality of LED chip units 302, 304, a conductor 330a, and at least two electrodes 310, 312.
  • the conductor 330a is located between two adjacent LED chip units 302, 304, and the LED chip unit 302,
  • the 304 is in substantially the same position in the Y direction, so that the overall width of the LED filament 300 is small, thereby shortening the heat dissipation path of the LED chip and improving the heat dissipation effect.
  • the electrodes 310 and 312 are disposed corresponding to the LED chip units 302 and 304, and are electrically connected to the LED chip units 302 and 304 through the wires 340.
  • the LED chip units 302/304 are electrically connected to the conductors 330a through the wires 350.
  • the conductors 330a are substantially Z.
  • the font shape can increase the mechanical strength of the region where the conductor and the LED chip are located, and can avoid the damage of the wire connecting the LED chip and the conductor when the LED filament 300 is bent.
  • the wire 340 is disposed in a parallel state with the X direction.
  • the LED filament 300 includes a plurality of LED chip units 302, 304, a conductor 330a, and at least two electrodes 310, 312.
  • the LED chip units 302, 304 are in the same position in the Y direction, and the conductors 330a and X are oriented.
  • the conductor 330a includes a first conductor 3301a and a second conductor 3302a respectively located on opposite sides of the LED chip unit 302/304.
  • the first conductor 3301a is located between two adjacent LED chip units, and is electrically connected to the LED chip through the wire 350.
  • Unit 302/304 is a plurality of LED chip units 302, 304, a conductor 330a, and at least two electrodes 310, 312.
  • the LED chip units 302, 304 are in the same position in the Y direction, and the conductors 330a and X are oriented.
  • the conductor 330a includes a first conductor 3301a and a second conductor 3302a respectively located on opposite sides of the LED
  • the wire 350 is perpendicular to the X direction, and reduces the internal stress on the cross-sectional area of the wire when the LED filament 300 is bent, thereby improving the bending resistance of the wire.
  • the second conductor 3302a is electrically connected to the LED chip 142, and the second conductor 3302a extends in the X direction to the wire 340.
  • the LED filament 300 receives an external force, it can act as a stress buffer to protect the LED chip and improve product stability. Secondly, the forces on both sides of the LED chip are balanced.
  • the electrodes 310, 312 are configured corresponding to the LED chip units 302, 304, and are electrically connected to the LED chip units 302, 304 through wires 340.
  • the difference from the embodiment shown in FIG. 21G is that the first conductor 3301a and the second conductor 3302a extend in the X direction to the wire 340, and the first conductor 3301a and the second conductor 3302a both pass the wire 350.
  • the LED chip unit 302 and the LED chip unit 304 are connected.
  • the first conductor 3301a connects the LED chip unit 302 and the LED chip unit 304 via the wire 350, and the second conductor 3302a may not be electrically connected to the LED chip unit 302/304.
  • the LED filament 300 is bent on both sides of the LED chip, the LED filament 300 can be bent to increase the intensity of the LED filament 300 and disperse a portion of the heat generated by the LED chip during illumination.
  • 21I is a top view of an embodiment of the LED filament 300 in an unbent state.
  • the LED chip units 302 and 304 are single LED chips, and the width direction of the LED chip units 302 and 304 is parallel to the X direction.
  • the LED chip units 302 and 304 are at substantially the same position in the Y direction, so that the overall width of the LED filament 300 is small, thereby shortening the heat dissipation path of the LED chip and improving the heat dissipation effect.
  • the adjacent two LED chip units 302 and 304 are connected by a conductor 330a, and the angle between the conductor 330a and the X direction is 30° to 120°, which reduces the internal stress on the cross-sectional area of the wire when the LED filament 300 is bent, and improves the resistance of the wire. Bendability.
  • the long sides of the LED chip unit may have an angle with the X direction, which may further reduce the overall width of the LED filament 300.
  • FIG. 22A is a schematic view showing an embodiment of a layered structure of the LED filament 400 of the present invention.
  • the LED filament 400 has a light conversion layer 420, LED chip units 402, 404, electrodes 410, 412, and electrical connections for adjacent two LED chip units 402, 404. Between the conductor segments 430.
  • the LED chip units 402, 404 include at least two LED chips 442 electrically connected to each other by wires 440.
  • the conductor segment 430 includes a conductor 430a that is electrically connected to the LED segments 402, 404 by wires 450, wherein the shortest between the two LED chips 442 located in adjacent LED chip units 402, 404, respectively.
  • the distance is greater than the distance between adjacent LED chips in the LED chip unit 402/404, the length of the wire 440 being less than the length of the conductor 430a.
  • the light conversion layer 420 is coated on at least two sides of the LED chip 442/electrodes 410, 412. Light conversion layer 420 exposes a portion of electrodes 410, 412.
  • the light conversion layer 420 can have at least one top layer 420a and one base layer 420b as the upper layer and the lower layer of the filament respectively. In this embodiment, the top layer 420a and the base layer 420b are respectively located on both sides of the LED chip 442/electrodes 410 and 412.
  • the quality of the bonding wire is mainly determined by five points A, B, C, D, and E, and A is a chip pad.
  • the junction of 4401 and Golden Ball 4403, B is the junction of gold ball 4403 and gold wire 440, C is between two sections of gold wire 440, D is the connection of gold wire 440 and two solder joint welding bar 4402, E is two Between the solder joint bar 4402 and the surface of the chip 442, since the B point is the first bending point of the gold wire 440 arc, the wire diameter of the gold wire 440 at the D point is thin, and thus the gold wire 440 is at the B point. And the point D is frangible, so for example, when implementing the structure of FIG. 22A, the top layer 420a of the LED filament 300 is only required to cover points B and D, and a part of the gold line 440 is exposed outside the light conversion layer.
  • the distance from the upper surface of the LED chip 442 to the surface of the top layer 420a is 100 to 200 ⁇ m.
  • the present invention provides a filament substrate or a light conversion layer formed of a composition comprising a silicone-modified polyimide, which composition can also be adjusted in a specific or partial composition in addition to the above characteristics.
  • the adjustment method of each characteristic is as follows.
  • the silicone-modified polyimide proposed by the present invention comprises a repeating unit represented by the following formula (I):
  • Ar 1 is a tetravalent organic group.
  • the organic group has a benzene ring or an alicyclic hydrocarbon structure, and the alicyclic hydrocarbon structure may be a monocyclic alicyclic hydrocarbon structure or an alicyclic hydrocarbon structure containing a bridged ring as a bridge containing
  • the cyclic alicyclic hydrocarbon structure may be a bicyclic alicyclic hydrocarbon structure or a tricyclic alicyclic hydrocarbon structure.
  • the organic group may also be a benzene ring structure or an alicyclic hydrocarbon structure containing an active hydrogen functional group, and the active hydrogen functional group may be any one or more of a hydroxyl group, an amino group, a carboxyl group, an amide group or a thiol group.
  • Ar 2 is a divalent organic group, and the organic group may have, for example, a monocyclic alicyclic hydrocarbon structure or a divalent organic group containing an active hydrogen functional group, and the active hydrogen functional group is a hydroxyl group, an amino group, a carboxyl group, Any one or more of an amide group or a thiol group.
  • R is independently selected from methyl or phenyl.
  • n is from 1 to 5, preferably n is 1 or 2 or 3 or 5.
  • the number average molecular weight of the formula (I) is from 5,000 to 100,000, preferably from 10,000 to 60,000, and more preferably from 20,000 to 40,000.
  • the number average molecular weight is a polystyrene-converted value based on a calibration curve prepared by a gel permeation chromatography (GPC) apparatus using standard polystyrene.
  • GPC gel permeation chromatography
  • Ar 1 is a component derived from a dianhydride
  • the dianhydride may include an aromatic acid anhydride and an aliphatic acid anhydride
  • the aromatic acid anhydride includes an aromatic acid anhydride containing only a benzene ring, a fluorinated aromatic acid anhydride, an amide group-containing aromatic acid anhydride, An ester group-containing aromatic acid anhydride, an ether group-containing aromatic acid anhydride, a sulfur group-containing aromatic acid anhydride, a sulfone group-containing aromatic acid anhydride, a carbonyl group-containing aromatic acid anhydride, and the like.
  • aromatic acid anhydride containing only a benzene ring examples include pyromellitic anhydride (PMDA), 2,3,3',4'-biphenyltetracarboxylic dianhydride (aBPDA), and 3,3',4,4'.
  • PMDA pyromellitic anhydride
  • aBPDA 2,3,3',4'-biphenyltetracarboxylic dianhydride
  • 3,3',4,4' 3,3',4,4'.
  • sBPDA 4-(2,5-dioxotetrahydrofuran-3-yl)-1,2,3,4-tetrahydronaphthalene-1,2-dicarboxylic anhydride
  • TDA Fluorinated aromatic acid anhydride such as 4FDA 4,4'-(hexafluoroisopropene) dicarboxylic anhydride
  • amide group-containing aromatic acid anhydride including N,N'-(5,5'-(perfluoropropane Benzyl-2,2-diyl)bis(2-hydroxy-5,1-phenylene))bis(1,3-dioxo-1,3-dihydroisobenzofuran)-5-carboxamide (6FAP-ATA), N,N'-(9H- ⁇ -9-ylidene-2,1-phenylene)bis[1,3-dihydro-1,3-dioxo-5- Isobenzofurancar
  • TDA Fluorinated aromatic acid anhydride such as 4
  • the alicyclic acid anhydride includes 1,2,4,5-cyclohexanetetracarboxylic dianhydride, 1,2,3,4-butanetetracarboxylic dianhydride (BDA), tetrahydro-1H-5, which is abbreviated as HPMDA, 9-methanepyrano[3,4-d]oxin-1,3,6,8(4H)-tetraone (TCA), hexahydro-4,8-ethylene-1H,3H-benzo [1,2-C:4,5-C']difuran-1,3,5,7-tetraone (BODA), cyclobutane tetracarboxylic dianhydride (CBDA), 1,2,3,4- Cyclopentanetetracarboxylic dianhydride (CpDA) or the like, or an alicyclic acid anhydride having an olefin structure, such as bicyclo [2.2.2] oct-7-ene-2,3,5,6-tetracar
  • an acid anhydride having an ethynyl group such as 4,4'-(acetylene-1,2-diyl)diphthalic anhydride (EBPA) is used, the mechanical strength of the light conversion layer can be further ensured by post-hardening.
  • EBPA 4,4'-(acetylene-1,2-diyl)diphthalic anhydride
  • sODPA 4,4'-oxydiphthalic anhydride
  • BTDA 3,3',4,4'-benzophenonetetracarboxylic dianhydride
  • CBDA 4,4'-(hexafluoroisopropene) diacetic anhydride
  • 6FDA 4,4'-(hexafluoroisopropene) diacetic anhydride
  • Ar 2 is a component derived from a diamine which can be classified into an aromatic diamine and an aliphatic diamine, and the aromatic diamine includes an aromatic diamine having only a benzene ring structure, a fluorinated aromatic diamine, and the like.
  • the aromatic diamine having only a benzene ring structure includes m-phenylenediamine, p-phenylenediamine, 2,4-diaminotoluene, 2,6-diamino-3,5-diethyltoluene, 4,4'- Diamino-3,3'-dimethylbiphenyl, 9,9-bis(4-aminophenyl)indole (FDA), 9,9-bis(4-amino-3-methylphenyl)anthracene, 2, 2-bis(4-aminophenyl)propane, 2,2-bis(3-methyl-4-aminophenyl)propane, 4,4'-diamino-2,2'-dimethylbiphenyl ( APB); fluorinated aromatic diamines include 2,2'-bis(trifluoromethyl)diaminobiphenyl (TFMB), 2,2-bis(4-aminophenyl)hexafluoropropan
  • the carboxyl group-containing aromatic diamine includes 6,6'-bisamino-3,3'-methylenedibenzoic acid (MBAA), 3,5-diaminobenzoic acid (DBA), etc.;
  • Group diamines include 3,3'-diaminodiphenyl sulfone (DDS), 4,4'-diaminodiphenyl sulfone, bis[4-(4-aminophenoxy)phenyl] sulfone (BAPS) (or Known as 4,4'-bis(4-aminophenoxy)diphenyl sulfone) 3,3'-diamino-4,4'-dihydroxydiphenyl sulfone (ABPS);
  • the sulfur-containing aromatic diamine includes 4,4'-diaminodiphenyl sulfide.
  • the aliphatic diamine is a diamine having no aromatic structure (such as a benzene ring), the alicyclic diamine includes a monocyclic alicyclic diamine, a linear aliphatic diamine, and the linear aliphatic diamine includes silicon.
  • the diamine may also be a diamine containing a mercapto group having a bulky free volume and a rigid fused ring structure, which enables the polyimide to have good heat resistance, thermal oxidation stability, mechanical properties, optical transparency, and Good solubility in organic solvents, thiol-containing diamines, such as 9,9-bis(3,5-difluoro-4-aminophenyl)anthracene, which can be derived from 9-fluorenone and 2,6- Dichloroaniline is obtained by reaction.
  • thiol-containing diamines such as 9,9-bis(3,5-difluoro-4-aminophenyl)anthracene, which can be derived from 9-fluorenone and 2,6- Dichloroaniline is obtained by reaction.
  • the fluorinated diamine may also be selected from 1,4-bis(3'-amino-5'-trifluoromethylphenoxy)biphenyl, which is a meta-substituted fluorine-containing diamine having a rigid biphenyl structure.
  • the meta-substitution structure can block the charge flow along the molecular chain direction, reduce the intermolecular conjugation, and thus reduce the absorption of light by visible light.
  • the choice of asymmetric structure of diamine or acid anhydride will improve the silicone modified polycondensation to some extent.
  • the transparency of the imide resin composition may be used singly or in combination of two or more.
  • diamine having an active hydrogen examples include a hydroxyl group-containing diamine such as 3,3'-diamino-4,4'-dihydroxybiphenyl, 4,4'-diamino-3,3'-dihydroxy-1.
  • ABPS 3,3'-diamino-4,4'-dihydroxydiphenyl sulfone
  • HAB 1,3-biphenyl (or 3,3'-dihydroxybenzidine)
  • BAP 2,2-bis(3-amino-4-hydroxyphenyl)propane
  • 6FAP 2,2-double (3-Amino-4-hydroxyphenyl)hexafluoropropane
  • 1,3-bis(3-hydroxy-4-aminophenoxy)benzene, 1,4-bis(3-hydroxy-4-amino) Phenyl)benzene, 3,3'-diamino-4,4'-dihydroxydiphenyl sulfone (ABPS) can be exemplified as a diamine having a carboxyl group such as 3,5-diaminobenzoic acid, bis(4- Amino-3-carboxyphenyl)methane (or 6,6'-bisamino-3,3'-methylenedibenzoic acid
  • a diamine having an amino group such as 4,4'-diaminobenzoanilide (DABA), 2-(4-aminophenyl)-5-aminobenzimidazole, diethylenetriamine, 3,3' -diaminodipropylamine, triethylenetetramine, N,N'-bis(3-aminopropyl)ethylenediamine (or N,N-bis(3-aminopropyl)ethylethylamine), etc. .
  • a thiol group-containing diamine such as 3,4-diaminobenzenethiol.
  • the above diamines may be used singly or in combination of two or more.
  • the silicone-modified polyimide can be synthesized by a known synthesis method.
  • the dianhydride and the diamine can be produced by imidating by dissolving them in an organic solvent in the presence of a catalyst, and examples of the catalyst include acetic anhydride/triethylamine type, valerolactone/pyridine type, etc., preferably,
  • the water produced by the azeotropic process in the imidization reaction uses a dehydrating agent such as toluene to promote the removal of water.
  • a polyamic acid It is also possible to carry out an equilibrium reaction of the acid anhydride with the diamine to obtain a polyamic acid, which is then heated and dehydrated to obtain a polyimide.
  • a small portion of the amic acid may be present in the main chain of the polyimide, for example.
  • the ratio of amic acid to imide in the polyimide molecule is from 1 to 3:100, and the amic acid and the epoxy resin have an interaction force, so that the substrate has superior performance.
  • a solid substance such as a heat curing agent, inorganic heat dissipating particles, and a phosphor
  • the alicyclic acid anhydride and the diamine can be directly heated and dehydrated to obtain a solutionized polyimide, thereby dissolving the polyimide as a rubber material, having good light transmittance and being liquid in itself. Therefore, other solid substances (for example, inorganic heat dissipating particles and phosphors) can be more fully dispersed in the rubber material.
  • the polyimide and the siloxane-type diamine obtained by heating and dehydrating the diamine and the anhydride are dissolved in a solvent to prepare a silicone-modified polyimide. amine.
  • the reaction is carried out with an siloxane-type diamine in the amic-acid state before the polyimide is obtained.
  • an acid anhydride and a diamine may be used to dehydrate the ring-closing and polycondensed imide compound, for example, an acid anhydride having a molecular weight ratio of 1:1 and a diamine.
  • an acid anhydride having a molecular weight ratio of 1:1 and a diamine in one embodiment 200 mmol (mmol) of 4,4'-(hexafluoroisopropene) diacetic anhydride (6FDA), 20 mmol (mmol) of 2,2-bis(3-amino-4-) was used.
  • a polyimide compound having an amino group as a terminal group can be obtained by the above method, but a polyimide compound having a carboxyl group as a terminal group can also be used in another manner. Further, in the reaction of the above acid anhydride and diamine, when the main chain of the acid anhydride contains a carbon-carbon triple bond, the binding force of the carbon-carbon triple bond can enhance the molecular structure thereof; or a diamine containing a vinylsiloxane structure can be used.
  • the molar ratio of dianhydride to diamine is 1:1.
  • the diamine containing an active hydrogen functional group accounts for 5 to 25% by mole of the entire diamine.
  • the reaction temperature for synthesizing the polyimide is preferably from 80 to 250 ° C, more preferably from 100 to 200 ° C, and the reaction time can be adjusted according to the size of the batch, for example, a reaction time of obtaining 10 to 30 g of the polyimide is 6 to 10 hours.
  • the silicone-modified polyimide can be classified into two types: a fluorinated aromatic silicone-modified polyimide and an aliphatic silicone-modified polyimide.
  • the fluorinated aromatic silicone-modified polyimide is composed of a siloxane-type diamine, an aromatic diamine containing fluorine (F) groups (or a F-aromatic aromatic diamine), and a fluorine-containing (F) group.
  • the aromatic dianhydride (or F-aromatic anhydride) is synthesized;
  • the aliphatic silicone-modified polyimide is composed of a dianhydride, a siloxane-type diamine and at least one aromatic-free structure (such as benzene).
  • a diamine or an aliphatic diamine synthesized, or a diamine (one of which is a siloxane diamine) and at least one dianhydride containing no aromatic structure (such as a benzene ring) Or aliphatic acid anhydride synthesis, aliphatic silicone modified polyimide including semi-aliphatic silicone modified polyimide and fully aliphatic silicone modified polyimide, all aliphatic silicone modified
  • the polyimide is synthesized from at least one aliphatic dianhydride, a silicon oxydiamine, and at least one aliphatic diamine; at least one aliphatic second of the raw material for synthesizing the semi-aliphatic silicone-modified polyimide An acid anhydride or an aliphatic diamine.
  • the raw material required for the synthesis of the silicone-modified polyimide and the silicon-oxygen content of the silicone-modified polyimide have a certain degree of transmittance, discoloration performance, mechanical properties, warpage and refractive index of the substrate. influences.
  • the silicone-modified polyimide of the present invention has a siloxane content of 20 to 75 wt%, preferably 30 to 70 wt%, a glass transition temperature of 150 ° C or less, and a glass transition temperature (Tg) test condition: TMA-60 manufactured by Shimadzu Shimadzu Corporation measured the glass transition temperature after adding a thermosetting agent to the silicone-modified polyimide.
  • Test conditions load: 5 g; heating rate: 10 ° C/min; measurement atmosphere: nitrogen Atmosphere; nitrogen flow rate: 20 ml/min; measured temperature range: -40 to 300 °C.
  • a film made of a silicone-modified polyimide resin composition may become very hard and brittle due to filling of the phosphor and the thermally conductive filler, and may be warped after drying and solidification.
  • the film has low workability; in addition, the heat discoloration property is lowered; and when the siloxane content is more than 75%, the film made of the silicone-modified polyimide resin composition becomes cloudy and the light transmittance is lowered. The tensile strength of the film is lowered.
  • the content of the siloxane in the present invention is the weight ratio of the silicone-oxygen diamine (the structural formula is represented by the formula (A)) to the silicone-modified polyimide, and the weight of the silicone-modified polyimide is synthetic organic.
  • R is selected from a methyl group or a phenyl group; R is preferably a methyl group, and n is from 1 to 5, preferably 1, 2, 3, 5.
  • the organic solvent required for synthesizing the silicone-modified polyimide can dissolve the silicone-modified polyimide and ensure affinity (wettability) with the phosphor or filler to be added, but avoid A large amount of solvent remains in the product, and the number of moles of the solvent is generally equal to the number of moles of water produced by the diamine and the acid anhydride. For example, 1 mol of water produced by 1 mol of the diamine and 1 mol of the acid anhydride is 1 mol, and the solvent is used in an amount of 1 mol. Further, the organic solvent selected has a boiling point of 80 ° C or more and less than 300 ° C at a standard atmospheric pressure, more preferably 120 ° C or more and less than 250 ° C.
  • the organic solvent is an ether organic solvent, an ester organic solvent, a dimethyl ether, a ketone organic solvent, an alcohol organic solvent, an aromatic hydrocarbon solvent or the like.
  • the ether organic solvent includes ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol dibutyl ether (or Ethylene glycol dibutyl ether), diglyme, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether (or diethylene glycol methyl ether), dipropylene glycol dimethyl ether or two Glycol dibutyl ether (diethylene glycol dibutyl ether), diethylene glycol butyl methyl ether; ester organic solvents include acetates, acetates including ethylene glycol monoethyl ether acetate, diethylene glycol monobutyl Ether acetate, propylene glycol monomethyl ether acetate, propyl acetate, propylene glycol diacetate,
  • the present invention provides a silicone-modified polyimide resin composition
  • a silicone-modified polyimide resin composition comprising the above-described silicone-modified polyimide and a heat curing agent, wherein the heat curing agent is an epoxy resin, an isocyanate or a bisoxazoline compound.
  • the amount of the thermosetting agent is from 5 to 12% by weight based on the weight of the silicone-modified polyimide.
  • the heat-dissipating particles and the phosphor may further be included in the silicone-modified polyimide group resin composition.
  • the factors affecting the light transmittance of the silicone-modified polyimide resin composition are at least the main material type, the type of the modifier (thermosetting agent), the type and content of the heat-dissipating particles, and the siloxane content.
  • the light transmittance refers to the transmittance of light in the vicinity of the main emission wavelength band of the LED chip.
  • the main emission wavelength range of the blue LED chip is near 450 nm, and the composition or the absorption of the polyimide to the wavelength of 450 nm is absorbed.
  • the rate is low enough or not absorbed to ensure that most or all of the light can pass through the composition or the polyimide.
  • the silicone-modified polyimide composition has a refractive index of from 1.4 to 1.7, preferably from 1.4 to 1.55.
  • the silicone-modified polyimide resin composition is used for a filament substrate, and the silicone-modified polyimide resin composition is required to have good light transmittance at the peak wavelength of InGaN of the blue-excited white LED.
  • the raw material of the synthetic silicone-modified polyimide, the heat curing agent, and the heat-dissipating particles can be changed, because the phosphor in the silicone-modified polyimide resin composition will pass through
  • the rate test has a certain influence, so the silicone-modified polyimide resin composition for measuring the transmittance does not contain a phosphor, and the transmittance of the silicone-modified polyimide resin composition It is 86 to 93%, preferably 88 to 91% or preferably 89 to 92% or preferably 90 to 93%.
  • the acid anhydride reacts with the diamine to form a polyimide, wherein the acid anhydride and the diamine may be respectively selected from different compositions, that is, the polyimide formed by the reaction of different acid anhydrides with different diamines may have different light transmission. rate.
  • the aliphatic silicone-modified polyimide resin composition comprises an aliphatic silicone-modified polyimide and a heat curing agent
  • the F-modified aromatic silicone-modified polyimide resin composition comprises a F-aromatic organic Silicon modified polyimide and heat curing agent. Since the aliphatic silicone-modified polyimide has an alicyclic structure, the aliphatic silicone-modified polyimide resin composition has a high light transmittance.
  • fluorinated aromatic, semi-aliphatic, and fully aliphatic polyimides have good light transmission for blue LED chips.
  • the fluorinated aromatic silicone-modified polyimide is composed of a siloxane-type diamine, an aromatic diamine containing fluorine (F) groups (or a F-aromatic aromatic diamine), and a fluorine-containing (F) group.
  • the aromatic dianhydride also referred to as F-aromatic anhydride
  • Ar 1 and Ar 2 have a fluorine (F) group.
  • Semi-aliphatic and fully aliphatic silicone-modified polyimides are dianhydrides, siloxane-type diamines, and at least one diamine (or benzene ring)-free diamine (or aliphatic diamine) Synthesis, or synthesis of a diamine (one of which is a siloxane-type diamine) and at least one dianhydride (or referred to as an aliphatic anhydride) containing no aromatic structure (such as a benzene ring), ie, Ar 1 and At least one of Ar 2 is an alicyclic hydrocarbon structure.
  • the blue LED chip may emit a small amount of light near the short wavelength of 400 nm due to the difference in the processing conditions of the chip and the environment.
  • Fluorinated aromatic, semi-aliphatic, and fully aliphatic polyimides have different absorption rates for light having a short wavelength of 400 nm, and the absorption rate of fluorinated aromatic polyimide to light having a short wavelength of around 400 nm is about
  • the absorption rate of semi-aliphatic and fully aliphatic polyimides for light having a short wavelength of 400 nm is lower than that of fluorinated aromatic polyimides for light having a short wavelength of 400 nm. 12%. Therefore, in an embodiment, if the LED chip used in the LED filament has a uniform quality and emits a short wavelength of blue light, the fluorinated aromatic silicone modified polyimide can be used to fabricate the filament substrate or Light conversion layer. In another embodiment, if the quality of the LED chips used in the LED filaments is different and more short-wavelength blue light is emitted, semi-aliphatic or fully aliphatic silicone-modified polyimide can be used. Filament substrate or light conversion layer.
  • the addition of different heat curing agents has a different effect on the light transmittance of the silicone modified polyimide.
  • Table 1-1 shows the effect of the addition of different heat curing agents on the light transmittance of the fully aliphatic silicone-modified polyimide. Under the condition that the main light-emitting wavelength of the blue LED chip is 450 nm, different heat curing agents are added. There is no significant difference in the light transmittance of the fully aliphatic silicone-modified polyimide, but a different thermal curing agent is added to the fully aliphatic silicone-modified polyimide at a short wavelength of 380 nm. The light transmittance will have an effect.
  • the silicone-modified polyimide itself has a transmittance for short-wavelength (380 nm) light that is worse than that of long-wavelength (450 nm) light, but the degree of difference varies with the addition of different heat curing. Different from the agent. For example, when a fully aliphatic silicone-modified polyimide is added with a thermosetting agent KF105, the degree of light transmittance is reduced to a small extent, but when a fully aliphatic silicone-modified polyimide is added with a thermosetting agent 2021p, The degree of light transmittance reduction will be large.
  • a thermal curing agent BPA or a thermal curing agent 2021p may be added.
  • the thermal curing agent KF105 may be optionally added. Table 1-1 and Table 1-2 were all tested for light transmission using Shimadzu UV-Vis spectrophotometer UV-1800. It is based on the light transmittance of white LEDs at wavelengths of 380 nm, 410 nm and 450 nm, respectively.
  • the heat-dissipating particles in the silicone-modified polyimide resin composition of the present invention are preferably transparent powders, or particles having high light transmittance, or particles having high light reflectance, because the LED flexible filaments are mainly used for light-emitting. Therefore, the filament substrate needs to have good light transmittance.
  • a combination of particles having a high transmittance and particles having a low transmittance can be used, and a ratio of particles having a high transmittance is larger than a transmittance having a low transmittance. particle.
  • the weight ratio of the particles having a high transmittance to the particles having a low transmittance is 3 to 5:1.
  • siloxane contents also have an effect on light transmission.
  • the siloxane content is only 37% by weight, the light transmittance is only 85%, but as the siloxane content is increased to more than 45%, the light transmittance is more than 94%.
  • the factors affecting the heat resistance of the silicone-modified polyimide resin composition are at least the main material type, the silicon oxygen content, and the type and content of the modifier (thermosetting agent).
  • the silicone-modified polyimide resin composition synthesized by fluorinating aromatic, semi-aliphatic and fully aliphatic silicone-modified polyimide has excellent heat resistance properties, and is suitable for fabricating a filament substrate. Or a light conversion layer. If carefully distinguished, it was found that the fluorinated aromatic silicone modified polyimide has better heat resistance than the aliphatic silicone modified polyimide in the accelerated heat aging test (300 ° C ⁇ 1 hr). . Therefore, in one embodiment, if the LED filament adopts a high power, high brightness LED chip, the fluorinated aromatic silicone modified polyimide can be used to fabricate the filament substrate or the light conversion layer.
  • the high siloxane content in the silicone-modified polyimide affects the heat-resistant discoloration property of the silicone-modified polyimide resin composition.
  • the heat-resistant discoloration property means that the sample was placed at 200 ° C for 24 hours, and the transmittance of the sample after standing at a wavelength of 460 nm was measured. It can be seen from Table 2 that when the siloxane content is only 37% by weight, the transmittance after 200 ° C ⁇ 24 hours is only 83%, and the transmittance after 200 ° C ⁇ 24 hours increases with the increase of the siloxane content. It is gradually increasing. When the content of siloxane is 73wt%, the transmittance after 200°C ⁇ 24 hours is still as high as 95%. Therefore, increasing the content of siloxane can effectively improve the resistance of silicone modified polyimide. Thermal discoloration.
  • thermosetting agent increases the heat resistance and the glass transition temperature.
  • A1 and A2 respectively represent the curves before and after the addition of the thermosetting agent; the D1 and D2 curves are the values obtained by calculating the values of the A1 and A2 curves by differential, respectively, representing the degree of change of the A1 and A2 curves, from Fig. 23
  • TMA thermomechanical analysis
  • the thermosetting agent When the silicone-modified polyimide is cross-linked with a thermosetting agent, the thermosetting agent has an organic group capable of reacting with an active hydrogen functional group in the polyimide, and the amount and type of the thermosetting agent are The color change performance, mechanical properties and refractive index of the substrate have a certain influence, and thus some heat curing agents having better heat resistance and transmittance may be selected.
  • the heat curing agent include epoxy resin, isocyanate, and bismalel. An imine or a bisoxazoline compound.
  • the epoxy resin may be a bisphenol A type epoxy resin, such as BPA, or a silicon oxide type epoxy resin such as KF105, X22-163, X22-163A, or an alicyclic epoxy resin such as 3 4-epoxycyclohexylmethyl 3,4-epoxycyclohexylformate (2021P), EHPE3150, EHPE3150CE.
  • BPA bisphenol A type epoxy resin
  • a silicon oxide type epoxy resin such as KF105, X22-163, X22-163A
  • an alicyclic epoxy resin such as 3 4-epoxycyclohexylmethyl 3,4-epoxycyclohexylformate (2021P), EHPE3150, EHPE3150CE.
  • the amount of the thermal curing agent may also be determined based on the molar amount of the thermal curing agent reacted with the active hydrogen functional groups in the silicone modified polyimide.
  • the molar amount of the active hydrogen functional group reacted with the thermal curing agent is equal to the molar amount of the thermal curing agent.
  • the molar amount of the active hydrogen functional group reacted with the thermal curing agent is 1 mol, and the molar amount of the thermal curing agent is 1mol.
  • the factors affecting the thermal conductivity of the silicone-modified polyimide resin composition are at least the type and content of the phosphor, the type and content of the heat-dissipating particles, and the addition and type of the coupling agent. Among them, the particle size and particle size distribution of the heat dissipating particles also affect the thermal conductivity.
  • the silicone-modified polyimide resin composition may further contain a phosphor for obtaining a desired luminescent property, and the phosphor may convert a wavelength of light emitted from the luminescent semiconductor, for example, a yellow phosphor converts blue light into yellow. Light, red phosphors convert blue light into red light.
  • a phosphor for obtaining a desired luminescent property may convert a wavelength of light emitted from the luminescent semiconductor, for example, a yellow phosphor converts blue light into yellow. Light, red phosphors convert blue light into red light.
  • Yellow phosphor for example, (Ba, Sr, Ca) 2 SiO 4 :Eu, (Sr,Ba) 2 SiO 4 :Eu (barium strontium silicate (BOS)) and other transparent phosphors, Y 3 Al 5 O 12 :Ce (YAG (yttrium aluminum garnet): Ce), Tb 3 Al 3 O 12 : Ce (YAG (yttrium aluminum garnet): Ce) and other silicate-type phosphors having a silicate structure, Ca - NOx oxide such as ?-SiAlON.
  • the red phosphor includes a nitride phosphor such as CaAlSiN 3 :Eu, CaSiN 2 :Eu.
  • Green phosphors such as rare earth-halide phosphors, silicate phosphors, and the like.
  • the content ratio of the phosphor in the silicone-modified polyimide resin composition can be arbitrarily set in accordance with desired light-emitting characteristics.
  • the thermal conductivity of the phosphor is much larger than that of the silicone-modified polyimide resin, the silicone-modified polyimide increases as the proportion of the phosphor in the silicone-modified polyimide resin composition increases. The thermal conductivity of the resin composition as a whole is also increased.
  • the content of the phosphor can be appropriately increased to increase the thermal conductivity of the silicone-modified polyimide resin composition, which is beneficial to the filament substrate or the light conversion.
  • the heat dissipation properties of the layer When the silicone-modified polyimide resin composition is used as a filament substrate, the content, shape, and particle diameter of the phosphor in the silicone-modified polyimide resin composition also affect the mechanical properties of the substrate (for example, elasticity). Modulus, elongation, tensile strength) and warpage have a certain effect.
  • the phosphor contained in the silicone modified polyimide resin composition is granular, and the shape of the phosphor may be spherical or plate.
  • the shape of the phosphor is spherical, and the maximum average length of the phosphor (average particle diameter in the case of a spherical shape) is 0.1 ⁇ m or more, preferably 1 ⁇ m or more, more preferably 1 to 100 ⁇ m, still more preferably 1 to 50 ⁇ m.
  • the phosphor is used in an amount of not less than 0.05 times, preferably not less than 0.1 times, and not more than 8 times, preferably not more than 7 times, such as the weight of the silicone-modified polyimide, of the weight of the silicone-modified polyimide.
  • the content of the phosphor is not less than 5 parts by weight, preferably not less than 10 parts by weight, and not more than 800 parts by weight, preferably not more than 700 parts by weight, based on 100 parts by weight of the phosphor, in the silicone-modified polyimide resin combination
  • the mechanical properties of the silicone-modified polyimide resin composition may not reach the strength required as the base layer of the filament, resulting in an increase in the defective rate of the product.
  • the addition ratio of the red phosphor to the green phosphor is 1:5-8, preferably red phosphor and green phosphor.
  • the addition ratio is 1:6-7.
  • the addition ratio of the red phosphor to the yellow phosphor is 1:5-8, preferably red phosphor and yellow phosphor.
  • the addition ratio of the powder is 1:6 to 7. In other embodiments, three or more phosphors may be added simultaneously.
  • the purpose of adding heat dissipating particles is mainly to increase the thermal conductivity of the silicone modified polyimide resin composition, maintain the color temperature of the LED chip, and prolong the service life of the LED chip.
  • the heat dissipating particles include silica, alumina, magnesia, magnesium carbonate, aluminum nitride, boron nitride or diamond. From the viewpoint of dispersibility, silica, alumina or a combination of both is preferably used.
  • the particle shape of the heat dissipating particles may be a spherical shape, a block shape, or the like, and the spherical shape includes a shape similar to a spherical shape.
  • spherical and non-spherical heat dissipating particles may be used to ensure dispersibility of the heat dissipating particles and heat conduction of the substrate.
  • the ratio of the weight ratio of the spherical and non-spherical heat dissipating particles is 1:0.15 to 0.35.
  • Table 3-1 shows the relationship between the heat-dissipating particle content and the thermal conductivity of the silicone-modified polyimide resin composition, and the thermal conductivity of the silicone-modified polyimide resin composition as the amount of the heat-dissipating particles increases The rate is also increased, but when the content of the heat-dissipating particles in the silicone-modified polyimide resin composition exceeds 1200 parts by weight, the mechanical properties of the silicone-modified polyimide resin composition may not be as a filament. The strength required for the base layer increases the defect rate of the product.
  • heat-dissipating particles for example, SiO 2 , Al 2 O 3
  • the lightness can also improve the heat dissipation of the silicone-modified polyimide resin composition.
  • Table 3-1 and Table 3-2 show that the obtained silicone-modified polyimide resin composition was cut into a film having a film thickness of 300 ⁇ m and a diameter of 30 mm as a test piece, and a thermal conductivity measuring device DRL manufactured by Xiangke was produced.
  • Table 3-2 and Figure 24 show the influence of the particle size and distribution of the heat-dissipating particles on the thermal conductivity of the silicone-modified polyimide resin composition.
  • Table 3-2 and Figure 24 show the results of adding the same ratio of seven different heat-dissipating particles to the silicone-modified polyimide resin composition and their thermal conductivity.
  • the particle size of the heat dissipating particles suitable for addition to the silicone-modified polyimide resin composition can be roughly classified into a small particle diameter (less than 1 ⁇ m), a medium particle diameter (1 to 30 ⁇ m), and a large particle diameter (greater than 30 ⁇ m).
  • Comparative specifications 4 and 6 show that, under the conditions of adding small particle size and medium particle size, although the average particle diameter of the heat dissipating particles is different, the thermal conductivity of the silicone modified polyimide resin composition is No significant impact.
  • Comparative specifications 4 and 7 show that in addition to the addition of small and medium particle sizes, size 7 of the addition of large particle size heat dissipating particles exhibits the most excellent thermal conductivity. Comparing specifications 5 and 7, although specifications 5 and 7 have added heat-dissipating particles of three sizes, large and medium, and the average particle size is similar, the thermal conductivity of size 7 is significantly better than that of specification 5, causing this difference. The reason is related to the ratio of the particle size distribution. Please see the particle size distribution of the specification 7 in Figure 24.
  • the curve of the specification 7 is smooth, and the slope is mostly small.
  • the display specification 7 not only contains each particle size, but also has a moderate proportion of each particle size. And exhibiting a normal distribution state, for example, a small particle size of about 10%, a medium particle size of about 60%, and a large particle size of about 30%.
  • the curve of the specification 5 has two regions with large slopes, respectively having a particle diameter of 1-2 ⁇ m and a particle diameter of 30-70 ⁇ m, indicating that the particle size of the specification 5 is mostly distributed in the particle diameter of 1-2 ⁇ m and the particle diameter of 30- 70 ⁇ m, and only contains a small amount of heat-dissipating particles with a particle size of 3-20 ⁇ m, showing a state of two-head distribution.
  • the particle size distribution of the heat-dissipating particles affects the thermal conductivity to a greater extent than the average particle diameter of the heat-dissipating particles.
  • the small particle size is about 5-20%
  • the medium particle size is about 5-20%.
  • the silicone-modified polyimide resin has an optimum thermal conductivity when the content is about 50-70% and the large particle size is about 20-40%. Because under the conditions of three sizes of large, medium and small, in the same volume, the heat-dissipating particles will have dense accumulation and contact to form an efficient heat dissipation path.
  • alumina having a particle size distribution of 0.1 to 100 ⁇ m and an average particle diameter of 12 ⁇ m or alumina having a particle size distribution of 0.1 to 20 ⁇ m and an average particle diameter of 4.1 ⁇ m is used, and the particle size distribution is alumina particles.
  • the average particle diameter may be selected from 1/5 to 2/5, preferably 1/5 to 1/3 of the thickness of the substrate.
  • the amount of the heat dissipating particles is 1 to 12 times the weight (amount) of the silicone modified polyimide, for example, 100 parts by weight of the silicone modified polyimide, and the content of the heat dissipating particles is 100 to 1200 parts by weight, preferably 400. ⁇ 900 parts by weight, two kinds of heat dissipating particles are simultaneously added, for example, silica and alumina are simultaneously added, and the weight ratio of alumina to silica is 0.4 to 25:1, preferably 1 to 10:1.
  • a coupling agent for example, a silane coupling agent
  • a coupling agent may be added to enhance solid substances (such as phosphors, heat-dissipating particles) and rubber materials (for example, silicone-modified poly-polymers).
  • the amount of coupling agent is related to the amount of heat-dissipating particles added and its specific surface area.
  • the process of synthesizing the silicone-modified polyimide resin composition may be selectively performed.
  • An additive such as an antifoaming agent, a leveling agent or a binder may be added as long as it does not affect the optical rotation resistance, mechanical strength, heat resistance and discoloration of the product.
  • Defoamers are used to eliminate bubbles generated during printing, coating, and curing, such as the use of surfactants such as acrylics or silicones as defoamers.
  • the leveling agent is used to eliminate irregularities on the surface of the coating film which are produced during printing and coating.
  • a surfactant component which can suppress bubbles, and can be made smooth by using a leveling agent such as acrylic or silicone, preferably a nonionic surfactant containing no ionic impurities.
  • a leveling agent such as acrylic or silicone
  • the binder include an imidazole compound, a thiazole compound, a triazole compound, an organoaluminum compound, an organotitanium compound, and a silane coupling agent.
  • these additives are used in an amount of not more than 10% by weight based on the weight of the silicone-modified polyimide. When the compounding amount of the additive exceeds 10% by weight, the physical properties of the resulting coating film tend to decrease, and the problem of deterioration of the optical rotation resistance caused by the volatile component is also generated.
  • the factors affecting the mechanical strength of the silicone-modified polyimide resin composition are at least the main material type, the siloxane content, the modifier (thermosetting agent) type, the phosphor, and the heat-dissipating particle content.
  • Table 4 lists fluorinated aromatic, semi-aliphatic and fully aliphatic three silicone modified polyimides with a siloxane content of about 45. The main characteristic of % (wt%). Fluorinated aromatics have the best heat-resistant discoloration, and all aliphatics have the best light transmission. Fluorinated aromatics also have high tensile strength and modulus of elasticity. Test conditions for mechanical strength shown in Tables 4 to 6: The thickness of the silicone-modified polyimide resin composition was 50 ⁇ m and the width was 10 mm, and the tensile properties of the film were tested using the ISO 527-3:1995 standard. The stretching speed is 10 mm/min.
  • the LED chip and the electrode are first fixed on the filament substrate formed by the silicone modified polyimide resin composition by a solid crystal glue, and then the wire bonding process is performed, and the adjacent LED chip is used by the wire.
  • the LED chip is electrically connected to the electrode.
  • the elastic modulus of the filament substrate should have a certain level to resist the lower pressure of the solid crystal and wire bonding process. Therefore, the elastic modulus of the filament substrate should be greater than 2.0 Gpa, preferably 2 to 6 GPa, most preferably 4 to 6 GPa.
  • Table 5 shows the effect of different siloxane contents and the presence or absence of particles (phosphor and alumina) addition on the elastic modulus of the silicone-modified polyimide resin composition.
  • the elastic modulus of the silicone modified polyimide resin composition is less than 2.0Gpa under the condition that no phosphor and alumina particles are added, and the elastic modulus decreases with the increase of the siloxane content. That is, the silicone-modified polyimide resin composition has a tendency to be softened. However, under the condition of adding phosphor and alumina particles, the elastic modulus of the silicone-modified polyimide resin composition can be greatly improved and both are greater than 2.0 GPa.
  • an increase in the siloxane content can soften the silicone-modified polyimide resin composition, facilitating the addition of more fillers, such as adding more phosphors or heat-dissipating particles.
  • the particle size distribution and the mixing ratio may be appropriately selected with respect to the particle diameter of the heat dissipating particles, so that the average particle diameter is in the range of 0.1 ⁇ m to 100 ⁇ m, or 1 ⁇ m to 50 ⁇ m.
  • the filament substrate should have an elongation at break of greater than 0.5%, preferably from 1 to 5%, most preferably from 1.5 to 5%.
  • the silicone-modified polyimide resin composition has excellent elongation at break and increases the content of siloxane and elongation at break without adding phosphor and alumina particles. As it increases, the modulus of elasticity decreases, thereby reducing the occurrence of warpage. On the contrary, under the condition that the phosphor and the alumina particles are added, the silicone-modified polyimide resin composition exhibits a decrease in elongation at break, an increase in elastic modulus, and an increase in warpage.
  • thermosetting agent can improve the mechanical properties of the silicone-modified polyimide resin, such as increasing the tensile strength and elastic modulus, in addition to improving the heat resistance and glass transition temperature of the silicone-modified polyimide resin. Amount and elongation at break. Adding different heat curing agents will also have different lifting effects. Table 6 shows the effects of the tensile strength and the elongation at break of the silicone-modified polyimide resin composition after the addition of different heat curing agents.
  • the fully aliphatic silicone-modified polyimide has a better tensile strength after the addition of the heat curing agent EHPE 3150, and the addition of the heat curing agent KF105 has a better elongation.
  • Table 10 Specific information of PAME, KF8010, X22-161A, X22-161B, NH15D, X22-163, X22-163A, KF-105, the inflection rate may also be referred to as refractive index.
  • the silicone-modified polyimide resin composition of the present invention can be used as a substrate together in a film form or attached to a carrier.
  • the film formation process includes three steps, and (a) a coating step of developing the above-mentioned silicone-modified polyimide resin composition on a release body to form a film; (b) drying and heating process: film and The release body was heat-dried together to remove the solvent in the film; (c) Peeling: After the completion of the drying, the film was peeled off from the release body to obtain a film-formed silicone-modified polyimide resin composition.
  • the above-mentioned exfoliated body may be a centrifugal film or other material that does not chemically react with the silicone-modified polyimide resin composition, and for example, a PET centrifugal film may be used.
  • the silicone-modified polyimide resin composition is attached to a carrier to obtain a constituent film, and the constituent film can be used as a substrate.
  • the formation process of the constituent film includes two steps: (a) coating step: modifying the above-mentioned silicone
  • the polyimide resin composition is developed on a carrier and coated to form a composition film; (b) a drying and heating process: the composition film is dried by heating to remove the solvent in the film.
  • a roll-to-roll coating device such as a roll coater, a die coater, or a knife coater, or a printing method, an inkjet method, a dispensing method, a spray method, or the like can be used.
  • Simple coating method As a coating method in the coating step, a roll-to-roll coating device such as a roll coater, a die coater, or a knife coater, or a printing method, an inkjet method, a dispensing method, a spray method, or the like can be used. Simple coating method.
  • a vacuum drying method, a heating drying method, or the like can be selected.
  • the heating method may be performed by heating a heat source such as an electric heater or a heat medium to generate heat energy, causing indirect convection, or using a heat radiation method heated by infrared rays emitted from a heat source.
  • the above silicone-modified polyimide resin composition can be obtained by drying and curing after coating to obtain a highly thermally conductive film (composite film) to obtain characteristics having any one or a combination of the following: excellent light transmittance and chemical resistance. Properties, heat resistance, thermal conductivity, mechanical properties of the film and resistance to light.
  • the temperature and time used in the drying and curing process can be appropriately selected according to the solvent and the applied film thickness in the silicone-modified polyimide resin composition, and can be dried before and after curing according to the silicone-modified polyimide resin composition.
  • the change in weight and the peak change of the thermosetting agent functional group on the infrared spectrum to determine whether the dry curing is complete for example, when the epoxy resin is used as a heat curing agent, the difference in weight before and after drying of the silicone modified polyimide resin composition
  • the value is equal to the weight of the added solvent and the increase or decrease in the peak of the epoxy group before and after the dry curing to determine whether the dry curing is complete.
  • the amidation reaction is carried out under a nitrogen atmosphere or the vacuum defoaming method or both methods are employed in synthesizing the silicone-modified polyimide resin composition, so that the silicone-modified polyamido can be made.
  • the volume percentage of cells in the composite film of the amine resin composition is 5 to 20%, preferably 5 to 10%.
  • a silicone-modified polyimide resin composition composite film is used as a substrate of an LED flexible filament (such as the various LED filament embodiments described above), and the substrate 420b has an upper surface 420b1 and an opposite lower surface.
  • 420b2 Fig. 25A shows the surface morphology of the obtained substrate by spraying gold on the surface of the substrate and under the electron microscope of Tescan.
  • FIG. 25B is a schematic cross-sectional view of the substrate 420b, the broken line in FIG.
  • the upper surface 420b1 of the substrate includes a first region 4a and a second region 4b, and a second
  • the region 4b includes the cell 4d
  • the surface roughness of the first region 4a is smaller than the surface roughness of the second region 4b
  • the light emitted by the LED chip is scattered by the cells of the second region, and the light is more uniform
  • the lower surface 420b2 of the substrate Including the third region 4c, the surface roughness of the third region 4c is greater than the surface roughness of the first region 4a.
  • the contact area of the solid crystal glue and the substrate is large when the crystal is fixed, and the bonding strength between the solid crystal glue and the substrate can be increased, and thus, the LED chip is placed on the LED chip.
  • the solid crystal bonding and the solid bonding glue can be simultaneously ensured The bonding strength of the substrate.
  • the surface of the base layer 420b may be treated with a silicone resin or a titanate coupling agent, preferably a silicone resin containing methanol or a titanate coupling agent containing methanol, or a silicone resin containing isopropyl alcohol.
  • a silicone resin or a titanate coupling agent preferably a silicone resin containing methanol or a titanate coupling agent containing methanol, or a silicone resin containing isopropyl alcohol.
  • the cross-sectional view of the treated base layer is as shown in Fig. 25C, the upper surface 420b1 of the base layer has a relatively uniform surface roughness, and the lower surface 420b2 of the base layer includes the third region 4c and the fourth region 4e, and the surface of the third region 4c is rough. The degree is greater than the surface roughness of the fourth region 4e.
  • the surface roughness of the upper surface 420b1 of the base layer may be equal to the surface roughness of the fourth region 4e.
  • the degree of vacuum at the time of vacuum defoaming is -0.5 to -0.09 MPa, preferably -0.2 to -0.09 MPa.
  • the revolution speed is 1200 to 2000 rpm
  • the rotation speed is 1200 to 2000 rpm
  • the vacuum defoaming time is 3 to 8 minutes. It can keep a certain bubble in the film to increase the uniformity of light and maintain better mechanical properties.
  • the total weight of the raw materials required for preparing the silicone-modified polyimide resin composition can be appropriately adjusted. Generally, the higher the total weight, the lower the degree of vacuum, the stirring time and the stirring speed can be appropriately increased.
  • the highly thermally conductive resin film can be formed by a simple coating method such as a printing method, an inkjet method, or a dispensing method.
  • the LED chip is a six-sided illuminator, and at least two sides of the LED chip are wrapped by the top layer when the LED filament is produced, and the existing LED filament
  • the color temperature of the top layer and the base layer may be uneven, or the base layer may be grainy, so that the composite film as the filament substrate needs to have excellent transparency.
  • a sulfone group, a non-coplanar structure, a meta-substituted diamine, or the like may be introduced on the main chain of the silicone-modified polyimide to enhance the silicone-modified polyimide resin composition. Transparency.
  • the composite film as the substrate needs to have a certain flexibility, so that an ether group can be introduced in the main chain of the silicone-modified polyimide (such as 4). , 4'-bis(4-amino-2-trifluoromethylphenoxy)diphenyl ether), carbonyl, methylene and other flexible structures.
  • a diamine or dianhydride containing a pyridine ring may also be selected, and the rigid structure of the pyridine ring may improve the mechanical properties of the composite film, and may be used in combination with a strong polar group (for example, -F) to form a composite film.
  • An acid anhydride having excellent fluorophore properties such as 2,6-bis(3',4'-dicarboxyphenyl)-4-(3",5"-bistrifluoromethylphenyl)pyridine anhydride.
  • the top layer 420a of the LED filament 400 is a layered structure of at least one layer.
  • the layered structure may be selected from the group consisting of a highly moldable phosphor paste, a low formable phosphor film, a transparent layer or any layered combination of the three.
  • the phosphor paste/phosphor film comprises the following components: a gel, a phosphor, and inorganic oxide nanoparticles.
  • the glue can be, but is not limited to, silica gel.
  • the silicone-modified polyimide may be included in the glue by 10% Wt or less to increase the hardness, insulation, thermal stability and mechanical strength of the filament as a whole, and the silicone modified polyacyl group.
  • the imine may have a solid content of 5 to 40% Wt and a rotational viscosity of 5 to 20 Pa.s.
  • the inorganic oxidized nanoparticles 426 can be, but are not limited to, aluminum oxide and aluminum nitride particles.
  • the particle size of the particles can be 100-600 nm or 0.1-100 micrometers, and the effect is to promote heat dissipation of the filament and incorporate inorganic heat-dissipating particles. It can have particle sizes in a variety of sizes. It is also possible to appropriately adjust the difference between the two in terms of hardness (for example, adjustment by encapsulating composition or phosphor ratio), conversion wavelength, particle size, thickness, and transmittance of the composition.
  • the transmittance of the phosphor film and the phosphor paste on the top layer can be adjusted as needed.
  • the transmittance of the phosphor paste or the phosphor film on the top layer is greater than 20%, 50%, or 70%.
  • the Shore hardness of the phosphor can be D40-70; the thickness of the phosphor can be 0.2-1.5 mm; and the Shore hardness of the phosphor film can be D20-70.
  • the phosphor film may have a thickness of 0.1 to 0.5 mm; a refractive index of 1.4 or higher; and a light transmittance of 40% to 95%.
  • the transparent layer may be composed of a high light transmissive resin such as silica gel, the above-described silicone modified polyimide, or a combination thereof.
  • the transparent layer can function as an index matching layer with the effect of adjusting the light output efficiency of the filament.
  • the LED filament 400 base layer 420b is a layered structure of at least one layer, and the layered structure may be selected from the group consisting of a highly moldable phosphor paste, a low moldable phosphor film, a transparent layer or It is any layered combination of the three; the phosphor paste/phosphor film comprises the following components: a silicone-modified polyimide, a phosphor, and an inorganic oxide nanoparticle.
  • the silicone modified polyimide may be replaced with the silicone modified polyimide resin composition described above.
  • the inorganic oxidized nanoparticles can be, but are not limited to, aluminum oxide and aluminum nitride particles.
  • the particle size of the particles can be 100-600 nm or 0.1-100 micrometers, and the function is to promote heat dissipation of the filament, and the inorganic heat-dissipating particles can be incorporated. It has particle sizes in a variety of sizes.
  • the light transmittance of the phosphor film and the phosphor paste in the base layer 420b may be adjusted as needed. For example, the transmittance of the phosphor paste or the phosphor film in the base layer 420b is greater than 20%, 50%, or 70%.
  • the transparent layer may be composed of a high light transmissive resin such as silica gel, the above-described silicone modified polyimide, or a combination thereof. In one embodiment, the transparent layer can function as an index matching layer with the effect of adjusting the light output efficiency of the filament.
  • the base layer 420b may be the above-described silicone-modified polyimide resin composition composite film.
  • the LED filament structure in the foregoing embodiments can be mainly applied to an LED bulb lamp product, and the LED bulb lamp can pass the flexible bending property of a single LED filament to achieve a full-circumference luminous effect.
  • the following is a further description of a specific embodiment in which the aforementioned LED filament is applied to an LED bulb.
  • FIG. 26A is a schematic structural view of a first embodiment of an LED bulb lamp 20c.
  • the LED bulb 20c includes a lamp housing 12, a lamp cap 16 connecting the lamp housing 12, at least two conductive brackets 51a, 51b disposed in the lamp housing 12, a driving circuit 518, and a support portion (including the cantilever 15, The stem 19) and a single light emitting portion (ie, LED filament) 100.
  • the driving circuit 518 is electrically connected to the conductive brackets 51a, 51b and the base 16.
  • the stem 19 further has a upright 19a extending vertically to the center of the lamp envelope 12, the upright 19a being located on the central axis of the base 16, or the stand 19a being located on the central axis of the LED bulb 20c.
  • a plurality of cantilevers 15 are located between the uprights 19a and the LED filaments 100. These cantilevers 15 are used to support the LED filaments 100 and maintain the LED filaments 100 in a predetermined curve and shape.
  • Each of the cantilevers 15 includes opposing first and second ends, a first end of each of the cantilevered walls 15 being coupled to the uprights 19a and a second end of each of the cantilevers 15 being coupled to the LED filaments 100.
  • the lamp housing 12 is preferably a material that is preferably light transmissive or thermally conductive, such as, but not limited to, glass or plastic.
  • the lamp housing 12 may be doped with a golden yellow material or the surface of the lamp housing may be coated with a yellow film to absorb a portion of the blue light emitted by the LED chip to reduce the light emitted by the LED bulb 20c. Color temperature.
  • the lamp housing 12 includes a layer of luminescent material (not shown), which may be formed on the inner surface, the outer surface of the lamp housing 12, or even integrated in accordance with design requirements or process feasibility.
  • the lamp housing 12 is in the body material.
  • the luminescent material layer comprises a low resorbed (abbreviated herein as LR) semiconductor nanocrystal, referred to herein as an LR quantum dot.
  • LR quantum dots are specially designed quantum dots, and the quantum dots include a core, a protective shell and a light absorbing shell, and the light absorbing shell is disposed between the core and the protective shell.
  • the core emits light, and the light absorbing shell absorbs the excitation light.
  • the wavelength of the emitted light is longer than the wavelength of the excitation light, and the protective shell provides light stability. Low reabsorption is achieved by using a ratio of absorbance to achieve this goal.
  • the nanocrystal emitter absorbs the required number of high energy photons from the excitation source and does not absorb any photons at all in the lower energy window.
  • the "brightness ratio” is defined as the ratio of the absorbance at the peak of the excitation source to the absorbance at 550 nm. This selection is effective if the emission peak of the nanocrystal is at a higher wavelength than 550 nm. The reason for choosing 550 nm is that 550 nm is the wavelength most sensitive to the human eye under ambient conditions. In the present disclosure, the ratio of the light absorption ratio is referred to as "Iexcitation/I550".
  • useful LR quantum dots have an absorbance ratio greater than about 8, suitably equal to or greater than about 10, or equal to or even greater than about 15.
  • the ratio of the absorbance is "the ratio of the absorbance at the emission peak", which is calculated by dividing the absorbance at the peak of the excitation source by the absorbance at the emission peak of the nanocrystal, In the present disclosure, this parameter is referred to as "Iexcitation/Iemission”.
  • the "absorption ratio at the emission peak" is "I450/Iemission”.
  • the ratio of absorbance at the emission peak is greater than 8, suitably greater than 10, or even greater than 15.
  • the core is a semiconductor nanocrystalline material, typically a combination of a metallic material and a non-metallic material, and the core can be prepared by combining a cationic precursor and an anionic precursor.
  • the metal material may be selected from the group consisting of Zn, Cd, Hg, Ga, In, Ti, Pb or rare earth.
  • the non-metallic material may be selected from O, S, Se, P, As or Te.
  • the cationic precursor ion may include all transition metals and rare earth elements, and the anionic precursor ions may be selected from the group consisting of O, S, Se, Te, N, P, As, F, CL, and Br.
  • the cationic precursor may include an element or a compound, for example, an element, a covalent compound, or an ionic compound including an oxide, a hydroxide, a coordination compound, or a metal salt, the resulting nanocrystalline core or shell material Medium is the source of positively charged elements.
  • the cationic precursor solution may include a metal oxide, a metal halide, a metal nitride, a metal ammonia complex, a metal amine, a metal amide, a metal imide, a metal carboxylate, a metal acetylacetonate, a metal dithiolate.
  • the cationic precursor solution may include metal oxides, metal carbonates, metal bicarbonates, metal sulfates, metal sulfites, metal phosphates, metal phosphites, metal halides, metal carboxylates, Metal hydroxide, metal alkoxide, metal thiolate, metal amide, metal imide, metal alkyl, metal aryl, metal complex, metal solvate, metal salt or a combination thereof.
  • the cationic precursor is a metal oxide or metal salt precursor and may be selected from the group consisting of zinc stearate, zinc myristate, zinc acetate, and manganese stearate.
  • the anionic precursor can also include an element, a covalent compound, or an ionic compound that acts as one or more electronegative elements within the nanocrystals produced. These definitions are expected to produce ternary, quaternary, and even more complex species using the methods disclosed herein, in which case more than one cationic precursor and/or more than one anion may be used. body. When two or more cationic elements are used during a given monolayer growth, if the other portions of the nanocrystals contain only a single cation, the resulting nanocrystals have a cationic alloy in the designated monolayer. The same method can be used to prepare nanocrystals having an anionic alloy.
  • the above method is applicable to core/shell nanocrystals prepared using a series of cationic precursor compounds of core and shell materials, for example, precursors of Group II metals (eg, Zn, Cd or Hg), precursors of Group III metals (eg, , Al, Ga or In), a precursor of a Group IV metal (for example, Ge, Sn or Pb), or a transition metal (for example, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Tc) , Re, Fe, Ru, Os, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, etc.).
  • precursors of Group II metals eg, Zn, Cd or Hg
  • precursors of Group III metals eg, Al, Ga or In
  • a precursor of a Group IV metal for example, Ge, Sn or Pb
  • a transition metal for example, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W
  • the composition of the light absorbing shell may be the same as or different from the composition of the core.
  • the lattice structure of the light absorbing shell material is the same as the type of material selected for the core.
  • the absorbing region material may be CdS.
  • the light absorbing shell material is selected to provide good absorption characteristics and may depend on the light source.
  • CdS can be a good material for the absorption region when excitation from a typical blue LED (within the wavelength range between 440 and 470 nm) is used for solid state illumination.
  • ZnSe or ZnSe x S 1-x (where x is greater than or equal to 0 and less than or equal to 1) is a preferred choice for the absorption region.
  • CdSe and InP are generally effective as materials for the absorption region.
  • the protected area (wide bandgap semiconductor or insulator) at the outermost outer shell of the quantum dot provides the desired chemical and optical stability to the quantum dots.
  • the protective casing also referred to as the protective region
  • the protective casing neither effectively absorbs light nor emits directional photons within the preferred excitation window described above. This is because it has a wide band gap.
  • ZnS and GaN can be used as a protective shell material.
  • Metal oxides can also be used.
  • an organic polymer can be used as a protective shell.
  • the thickness of the protective shell is typically in the range between 1 and 20 monolayers. Moreover, the thickness can also be increased as needed, but this also increases production costs.
  • the light absorbing shell includes a plurality of single layers that form a compositional gradient.
  • the light absorbing shell may comprise three constituents varying between a ratio of 1:0:1 in the single layer closest to the core and a ratio 0:1:1 in the single layer closest to the protective shell.
  • a single layer closest to the core may have a component CdS (ratio 1:0:1)
  • a single layer closest to the protective shell may have a component corresponding to ZnS ( Ratio 0:1:1)
  • the intermediate monolayer between the core and the protective shell may have a composition corresponding to Cd x Zn 1-x S having a ratio (X): (1-X): 1, And wherein X is greater than or equal to 0 and less than or equal to 1.
  • X is larger for a single layer closer to the core than a single layer closer to the protective shell.
  • the transition shell comprises three components, at a ratio of 0.9 from a single layer closest to the core to the single layer closest to the protective shell: 0.1:1, 0.8:0.2:1, 0.6:0.4:1. 0.4:0.6:1 and 0.2:0.8:1 change.
  • Other combinations of Cd, Zn, S, and Se alloys can also be used as transition shells instead of Cd x Zn 1-x S as long as they have suitable lattice matching parameters.
  • a suitable transition includes an outer shell having Cd, Zn, and S compositions and the following layers listed from the layer closest to the light absorbing shell to the layer closest to the protective shell: Cd 0.9 Zn 0.1 S, Cd 0.8 Zn 0.2 S, Cd 0.6 Zn 0.4 S, Cd 0.4 Zn 0.6 S, Cd 0.2 Zn 0.8 S.
  • the electrode 506 of the LED filament 100 is electrically connected to the conductive brackets 51a, 51b to receive power from the drive circuit 518.
  • the connection relationship between the electrode 506 and the conductive brackets 51a, 51b may be a mechanical compression connection or a solder connection, and the mechanical connection may be a specific formation formed by first passing the conductive brackets 51a, 51b through the electrode 506. The perforations (not shown) are then folded back to the free ends of the conductive supports 51a, 51b such that the conductive branches 51a, 51b sandwich the electrodes 506 and form an electrical connection.
  • the soldered connection may be the connection of the conductive supports 51a, 51b to the electrode 506 by means of silver-based alloy welding, silver soldering, soldering or the like.
  • the LED filament 100 shown in Fig. 26A is bent to form a circular-like contour in the upper view of Fig. 26A.
  • the LED filament 100 can be bent to form a wave shape in a side view since it has an LED filament structure including those described in any of the embodiments of Figs. 2 to 22.
  • the shape of the LED filament 100 is novel and makes illumination more uniform.
  • a single LED filament 100 has fewer contacts. In practice, the single filament 100 has only two joints for attachment, thus reducing the likelihood of flaws due to welding or mechanical crimping.
  • the stem 19 has a pole 19a that extends toward the center of the lamp envelope 12.
  • the uprights 19a support the cantilevers 15, the first ends of the respective cantilevers 15 are connected to the uprights 19a, and the second ends of the respective cantilevers 15 are connected to the LED filaments 100.
  • FIG. 26B is an enlarged cross-sectional view showing the dotted circle of FIG. 26A.
  • the second end of each cantilever 15 has a pliers portion 15a that clamps the body of the LED filament 10.
  • the pliers portion 15a can be used to clamp the wave-like crests or troughs of the LED filament 100, but not limited thereto, and the jaw portion 15a can also be used to sandwich the portion between the wavy crests and troughs of the LED filament 100.
  • the shape of the jaw portion 15a can be closely fitted to the outer shape of the cross section of the LED filament 100, and the inner shape (inner hole) of the jaw portion 15a can be slightly smaller than the outer shape of the cross section of the LED filament 100.
  • the LED filament 100 can be passed through the inner hole of the jaw portion 15a to form a close fit.
  • Another fixing method is to form the pliers via a bending process. Further, the LED filament 100 is first placed at the second end of the cantilever 15, and then the second end is bent into the pliers 15a by the jig. The LED filament 100 is clamped.
  • the material of the cantilever 15 may be, but not limited to, carbon spring steel to provide proper rigidity and elasticity, thereby absorbing external vibrations and reducing the impact on the LED filaments, so that the LED filaments are not easily deformed. Since the upright 19a extends to the center of the lamp housing 12 and the cantilever 15 is connected to the vicinity of the top end of the upright 19a, the vertical height of the LED filament 100 is close to the center of the lamp housing 12, and thus the LED bulb 20c The illuminating characteristics are close to the illuminating characteristics of the conventional bulb, so that the illuminating is more uniform, and the illuminating brightness can also reach the brightness level of the conventional bulb. In the present embodiment, at least half of the LED filament 100 will surround the central axis of the LED bulb 20c. This central axis is coaxial with the axis of the upright 19a.
  • the first end of the cantilever 15 of the LED filament 100 is connected to the upright 19a of the stem 19, and the second end of the cantilever 15 is connected to the outer insulating surface of the LED filament 100 via the jaw 15a, so the cantilever 15 is not Used to transmit electricity.
  • the stem 19 is made of glass so that the stem 19 does not break or burst due to thermal expansion and contraction of the cantilever 15.
  • the LED bulb may have no uprights, and the cantilever 15 may be attached to the stem or may be directly attached to the bulb to reduce the negative effects of the poles on illumination.
  • the cantilever 15 Since the cantilever 15 is non-conductive, it avoids the heat generated by the passing current when the cantilever 15 is electrically conductive, which causes the wire in the cantilever 15 to expand and contract, thereby causing the glass stem 19 to break and burst.
  • the second end of the cantilever 15 can be inserted directly into the LED filament 100 and become an auxiliary (auxiliary strip) in the LED filament 100 that can enhance the mechanical strength of the LED filament 100.
  • the inner shape (hole shape) of the jaw portion 15a matches the outer shape of the cross section of the LED filament 100, and thus, the cross section of the LED filament 100 can be oriented toward a specific orientation.
  • the top layer 420a of the LED filament 100 will be oriented toward the ten o'clock direction of Figure 2B, and the illumination surface of the entire LED filament 100 can be oriented toward substantially the same orientation to ensure that the illumination surface of the LED filament 100 is visually Consistent.
  • the LED filament 100 includes a main light emitting surface Lm and a sub light emitting surface Ls.
  • the LED chips of the LED filament 100 are wire-bonded and aligned in a line shape, one side of the top layer 420a away from the base layer 420b is the main light-emitting surface Lm, and the side of the base layer 420b away from the top layer 420a is the secondary light-emitting surface Ls.
  • the main light emitting surface Lm and the sub light emitting surface Ls are opposed to each other.
  • the main light-emitting surface Lm is the side through which the maximum amount of light passes
  • the secondary light-emitting surface Ls is the side through which the second large amount of light passes.
  • a conductive foil 530 is further disposed between the top layer 420a and the base layer 420b for electrically connecting between the LED chips.
  • the LED filament 100 is crimped and twisted such that the main light-emitting surface Lm always faces outward. That is, any portion of the main light-emitting surface Lm faces the lamp housing 12 or the lamp cap 16, and is oriented away from the stem 19 at any angle.
  • the secondary light-emitting surface Ls always faces the stem 19 or the tip end of the stem 19 (the secondary light-emitting surface Ls always faces inward).
  • the LED filament 100 shown in Fig. 26A is bent to form a circular shape in a top view and is formed in a wave shape in a side view.
  • This wavy structure is not only novel in appearance, but also ensures uniform illumination of the LED filament 100.
  • the single LED filament 100 is connected to the conductive holders 51a, 51b by fewer contacts (e.g., crimp points, weld points or solder joints) than a plurality of LED filaments.
  • a single LED filament 100 requires only two contacts, which are formed on two electrodes, respectively. This can effectively reduce the risk of welding errors, and the present embodiment can simplify the connection procedure as compared to the mechanical connection in which the pressing method is employed.
  • Figure 26C shows the projection of the LED filament 100 of the LED bulb 20c of Figure 26A in a top view.
  • the LED filaments can be bent to form a wave and, as viewed from a top view, resemble a circle that surrounds the center of the bulb or stem.
  • the LED filaments viewed from a top view may form a circular or U-like shape.
  • the LED filament 100 will be surrounded by a circular wave-like shape and have a symmetry-like structure in a top view, and the light-emitting surface of the LED filament 100 is also symmetrical.
  • the main light emitting surface Lm may face outward. Due to the symmetrical nature, the LED filament 100 can produce a full-circumferential effect.
  • the symmetrical characteristic relates to the symmetrical structure of the LED filament 100 and the configuration of the light emitting surface of the LED filament 100 in a top view. Thereby, the LED bulb lamp 20c as a whole can produce a full-circumference effect of approximately 360-degree illumination.
  • the two contacts can be close to each other such that the conductive brackets 51a, 51b will be substantially lower than the LED filament 100.
  • the conductive brackets 51a, 51b may appear inconspicuous and integrated with the LED filament 100 to exhibit a graceful curve.
  • FIG. 27A is a schematic diagram of an LED bulb of one embodiment of the present invention
  • FIG. 27B is a front view (or side view) of the LED bulb of FIG. 27A
  • the LED bulb 20d of FIG. 27A and FIG. 27B is similar to the LED bulb 20c of FIG. 26A.
  • the LED bulb 20d includes a lamp housing 12, a lamp holder 16 connecting the lamp housing 12, and At least two conductive brackets 51a, 51b, a cantilever 15, a stem 19, and a single LED filament 100 in the lamp housing 12.
  • the stem 19 includes an opposite stem bottom and a stem top, the stem bottom connecting the cap 16, the stem tip extending along the extension of the stem 19 to the inside of the bulb 12, for example, the stem top can be located The center of the interior of the lamp housing 12.
  • the stem 19 includes a stem 19a, where the stem 19a is considered to be a part of the stem 19 as a whole, so that the top end of the stem 19 is the top end of the stem 19a.
  • Conductive brackets 51a, 51b are connected to the stem 19.
  • the LED filament 100 includes a filament body and two electrodes 506. The two electrodes 506 are located at opposite ends of the filament body, and the filament body is the other portion of the LED filament 100 that does not include the electrode 506. The two filament electrodes 506 are respectively connected to two conductive brackets 51a, 51b, and the filament body surrounds the stem 19. One end of the cantilever 15 is connected to the stem 19 and the other end is connected to the filament body.
  • FIG. 27C is a top view of the LED bulb 20d of FIG. 27A.
  • the body of the LED filament 100 includes a main light emitting surface Lm and a sub light emitting surface Ls. Any segment of the main light-emitting surface Lm will face the lamp envelope 12 or the lamp cap 16 at any angle, that is, toward or outside the LED bulb 20d, and any segment of the secondary light-emitting surface Ls faces the core at any angle.
  • the top of the post 19 or stem 19, that is, towards the inside of the LED bulb 20d or toward the center of the lamp envelope 12. In other words, when the user observes the LED bulb 20d from the outside, the main light-emitting surface Lm of the LED filament 100 is seen at any angle. Based on this setting, the lighting will work better.
  • the LED filaments 100 in different LED bulbs may form different shapes or curves, and any of these LED filaments 100 will be set To have symmetrical characteristics. This symmetrical property helps to produce a uniform and widely distributed light, enabling the LED bulb to produce a full-circumferential effect.
  • the symmetrical characteristics of the LED filament 100 are as follows.
  • the definition of the symmetrical nature of the LED filament 100 can be based on four quadrants defined in a top view of the LED bulb.
  • Four quadrants can be defined in a top view of an LED bulb (eg, LED bulb 20c of FIG. 26A), the origin of which can be defined as the stem of the LED bulb or in the top view
  • the center for example, the top center of the stand of the stem 19 of Fig. 1A or the top center of the stand 19a of Fig. 26A).
  • the LED filaments of the LED bulb e.g., LED filament 100 of Figures IB and 26A
  • the LED filaments presented in the four quadrants in the top view will have symmetry.
  • the LED filament when the LED filament is in operation, the LED filament exhibits brightness in the first quadrant in a top view that is symmetric to the brightness of the LED filament in the second, third or fourth quadrant in a top view.
  • the structure of the portion of the LED filament that is in the first quadrant in a top view is symmetric to the structure of the portion of the LED filament that is in the second quadrant, the third quadrant, or the fourth quadrant in a top view.
  • the direction in which the LED filament is positioned in the first quadrant in the top view is symmetrical to the direction in which the LED filament is positioned in the second quadrant, the third quadrant or the fourth quadrant in the top view.
  • the configuration of the LED chip on the portion of the first quadrant in the top view in the top view varies symmetrically to the LED filament
  • the configuration of the LED chip in the second quadrant, the third quadrant or the fourth quadrant portion in the top view varies symmetrically to the LED filament
  • the power arrangement of the LED chips having different powers on the portion of the first quadrant in the top view in the top view (eg, LED chips of various powers on the portion of the first quadrant of the LED filaments)
  • the position distribution) is symmetric with respect to the power arrangement of the LED chips of different powers of the LED filaments in the second quadrant, the third quadrant or the fourth quadrant in the top view.
  • the LED filaments when the LED filament can be divided into a plurality of segments and the segments are defined by refractive indices that are different from one another, the LED filaments are in multiple segments on the portion of the first quadrant in a top view.
  • the refractive index is symmetrical to the refractive indices of the plurality of segments of the LED filament in the second quadrant, the third quadrant or the fourth quadrant in the top view.
  • the LED filament when the LED filament can be divided into a plurality of segments and the segments are defined by surface roughness that is different from each other, the LED filament has a plurality of points on the portion of the first quadrant in the top view.
  • the surface roughness of the segment will be symmetrical to the surface roughness of the plurality of segments of the LED filament in the second quadrant, the third quadrant or the fourth quadrant in the top view.
  • the LED filaments presented in the four quadrants of the top view may be point symmetric (eg, symmetrical according to the origin of the four quadrants) or line symmetrical (eg, symmetric according to one of the two axes of the four quadrants).
  • the symmetrical structure of the LED filaments in the four quadrants of the top view may have an error of at most 20%-50%, for example, when the structure of the LED filament in the first quadrant is symmetrical to the structure of the LED filament in the second quadrant portion
  • the LED filament has a designated point on the portion of the first quadrant, and the LED filament has a symmetry point symmetrically at the specified point on the portion of the second quadrant.
  • the designated point has a first position, the symmetry point There is a second position, the first position and the second position may be completely symmetrical or have an error of 20%-50%.
  • the length of the portion of the LED filament in one of the quadrants is substantially equal to the length of the portion of the LED filament in the other quadrant.
  • the length of the LED filament in different quadrants may also have an error of 20%-50%. Wherein the length may be a length of the LED filament extending along its axial direction.
  • the definition of the symmetrical characteristics of the LED filament 100 can be based on four quadrants defined in the side view, front view or rear view of the LED bulb.
  • the side view of the LED bulb includes a front view or a rear view.
  • Four quadrants can be defined in a side view of an LED bulb (e.g., LED bulb 20c of Figure 26A), in which case a stem or a stand in the LED bulb (e.g., the LED of Figure 26A)
  • the direction in which the vertical direction 19a) of the bulb lamp 20c extends (from the base 16 toward the top end of the lamp housing 12 away from the base 16) can be defined as the Y-axis, and the X-axis can traverse the middle of the stand, at this time in four quadrants
  • the origin is defined as the middle of the vertical, that is, the intersection of the X and Y axes.
  • the X-axis can traverse any point of the pole, for example, the X-axis can traverse the top end of the pole, the bottom end of the pole, or a point on a particular height of the pole (eg, 2/3 height) .
  • the LED filaments are symmetrical in brightness (eg, line symmetry to the Y axis) in the first quadrant and the second quadrant (upper quadrant) in the side view; the LED filament is in the third quadrant in the side view
  • the portion with the fourth quadrant (lower quadrant) is symmetric in brightness (for example, line symmetry to the Y axis).
  • the brightness of the LED filament in the upper quadrant in the side view is not symmetrical to the brightness of the LED filament in the lower quadrant in the side view.
  • the portion of the LED filament in the first quadrant and the second quadrant (ie, the upper two quadrants) will be structurally symmetric (eg, line symmetric with the Y axis as a line of symmetry).
  • the portion of the LED filament in the third quadrant and the fourth quadrant (ie, the lower two quadrants) will also be structurally symmetric (eg, line symmetry with the Y axis as the line of symmetry).
  • the LED filament is in the light-emitting direction of the portion of the first quadrant in the side view, and is symmetrical to the light-emitting direction of the LED filament in the second quadrant in the side view; the LED filament is in the third quadrant in the side view.
  • the light exiting direction of the portion is symmetrical with respect to the light exiting direction of the LED filament in the portion of the fourth quadrant in the side view.
  • the configuration of the LED chip of the LED filament in the first quadrant portion in a side view is symmetric to the configuration of the LED chip of the LED filament in the second quadrant portion in a side view; LED The arrangement of the LED chips on the portion of the filament in the third quadrant in the side view will be symmetric to the configuration of the LED chips on the portion of the LED filament that is in the fourth quadrant in the side view.
  • the power arrangement of the LED filaments having different powers on the portion of the first quadrant in the side view of the LED filament is symmetric to the LED filament in the second quadrant portion of the side view.
  • Power arrangement of LED chips of different powers; the power arrangement of LED chips with different powers of the LED filaments in the third quadrant in the side view is symmetrical to the portion of the LED filaments in the fourth quadrant in the side view Power arrangement of LED chips with different powers.
  • the LED filaments when the LED filament can be divided into a plurality of segments and the segments are defined by a refractive index that is different from each other, the LED filaments are in multiple segments on the portion of the first quadrant in a side view.
  • Refractive index which is symmetrical to the refractive index of the plurality of segments of the LED filament on the portion of the second quadrant in the side view; the plurality of segments of the LED filament in the side portion of the third quadrant in a side view
  • the index of refraction will be symmetric with respect to the refractive index of the plurality of segments of the LED filament that are located in the fourth quadrant in the side view.
  • the LED filament when the LED filament can be divided into a plurality of segments and the segments are defined by surface roughness that is different from each other, the LED filament has a plurality of points on the portion of the first quadrant in a side view.
  • the surface roughness of the segment is symmetrical to the surface roughness of the plurality of segments of the LED filament in the second quadrant portion in the side view; the LED filament is positioned in the third quadrant portion in the side view
  • the surface roughness of the segments is symmetrical to the surface roughness of the plurality of segments of the LED filaments in the portion of the fourth quadrant in the side view.
  • the portion of the LED filament that appears in the upper two quadrants and the portion of the LED filament that appears in the lower two quadrants are asymmetrical in brightness.
  • the LED filaments are present in the first quadrant and the fourth quadrant portion in structure, in length, in the light exiting direction, on the configuration of the LED chip, on the power arrangement of the LED chips having different powers.
  • Asymmetric in refractive index or in surface roughness and the LED filaments are present in the second quadrant and the third quadrant in terms of structure, length, in the light exiting direction, on the configuration of the LED chip, It is asymmetrical in the power arrangement of LED chips with different powers, in refractive index or in surface roughness.
  • the light emitted from the upper quadrant (the portion away from the lamp cap 16) in the side view should be more than the light emitted from the lower quadrant (the portion close to the cap 16). Therefore, the asymmetrical nature of the LED filament of such an LED bulb between the upper quadrant and the lower quadrant can help to meet the requirements of full illumination by focusing the light in the upper quadrant.
  • the symmetrical structure of the LED filament in the first quadrant and the second quadrant of the side view may have an error (tolerance) of 20%-50%, for example, the LED filament has a designated point on the portion of the first quadrant, and the LED filament a portion of the second quadrant having a symmetry point symmetrical at the specified point, the designated point having a first position, the symmetry point having a second position, the first position and the second position may be completely symmetrical or have 20%-50% error.
  • the meaning of the error here can be referred to the foregoing description.
  • the length of the portion of the LED filament in the first quadrant will be substantially equal to the length of the portion of the LED filament in the second quadrant.
  • the length of the portion of the LED filament in the third quadrant will be substantially equal to the length of the portion of the LED filament in the fourth quadrant.
  • the length of the portion of the LED filament in the first quadrant or the second quadrant may be different than the length of the portion of the LED filament in the third quadrant or the fourth quadrant.
  • the length of the LED filament in the third quadrant or fourth quadrant portion may be less than the length of the portion of the LED filament in the first quadrant or the second quadrant.
  • the length of the portion of the LED filament in the first or second quadrant or the length of the portion of the LED filament in the third or fourth quadrant may also have an error of 20%-50%.
  • Figure 27D shows the LED filament 100 of Figure 27B in a two-dimensional coordinate system defined with four quadrants.
  • the LED filament 100 of Fig. 27D is the same as the LED filament 100 of Fig. 27B, and Fig. 27D is a front view (or side view) of the LED bulb 20d of Fig. 27A.
  • the Y-axis will align with the stem 19a of the stem (i.e., the Y-axis will be positioned in the extension direction of the stem 19a), and the X-axis will traverse the stem 19a (i.e., the X-axis will It is perpendicular to the extension direction of the upright 19a).
  • the LED filament 100 is divided into a first portion 100p1, a second portion 100p2, a third portion 100p3 and a fourth portion 100p4 by X and Y axes in a side view.
  • the first portion 100p1 of the LED filament 100 is the portion that appears in the first quadrant in a side view
  • the second portion 100p2 of the LED filament 100 is the portion that appears in the second quadrant in a side view
  • the third portion 100p3 of the LED filament 100 is The portion of the third quadrant is presented in a side view
  • the fourth portion 100p4 of the LED filament 100 is the portion that appears in the fourth quadrant in a side view.
  • the LED filament 100 is line symmetrical.
  • the LED filament 100 will be symmetrical with respect to the Y-axis in a side view, that is, the geometry of the first portion 100p1 and the fourth portion 100p4 will be symmetrical to the geometry of the second portion 100p2 and the third portion 100p3.
  • the first portion 100p1 will be symmetric with respect to the second portion 100p2
  • the first portion 100p1 and the second portion 100p2 will be structurally symmetric with respect to the Y-axis.
  • the third portion 100p3 will be symmetric with respect to the fourth portion 100p4, and further, in a side view, the third portion 100p3 and the fourth portion 100p4 will be structurally symmetric with respect to the Y-axis.
  • the first portion 100p1 and the second portion 100p2 in the upper quadrant (ie, the first quadrant and the second quadrant) in the side view are located in the lower quadrant (ie, the third quadrant and the side view).
  • the third portion 100p3 of the fourth quadrant is asymmetrical to the fourth portion 100p4.
  • the first portion 100p1 and the fourth portion 100p4 are asymmetrical in the side view
  • the second portion 100p2 and the third portion 100p3 are asymmetrical in the side view.
  • the light emitted from the upper quadrant and passing through the upper lamp envelope 12 is more than the light emitted from the lower quadrant and passing through
  • the light from the lower lamp housing 12 meets the lighting objectives and requirements of the full-circumference luminaire.
  • the structure of the two symmetrical portions of the LED filament 100 in the side view may be completely symmetrical or structurally Symmetry of the error.
  • the error (tolerance error) between the structures of the two symmetrical portions of the LED filament 100 in the side view may be 20% to 50% or less.
  • the error can be defined as the difference in coordinates (i.e., the x-coordinate and the y-coordinate), for example, if the LED filament 100 has a designated point on the first portion 100p1 of the first quadrant and the LED filament 100 is in the second portion 100p2 of the second quadrant a symmetric point symmetrical with respect to the specified point relative to the Y axis, the absolute value of the y coordinate or the x coordinate of the specified point may be equal to the absolute value of the y coordinate or the x coordinate of the symmetric point, or may be relative to The absolute value of the y-coordinate or x-coordinate of the symmetry point has a 20% difference.
  • the LED filament 100 is defined as a first position at a specified point (x1, y1) of the first portion 100p1 of the first quadrant, and a symmetrical point of the LED filament 100 at the second portion 100p2 of the second quadrant.
  • (x2, y2) is defined as the second position
  • the second position of the symmetry point (x2, y2) is symmetrical with respect to the Y axis to the first position of the specified point (x1, y1).
  • the first position and the second position may be completely symmetrical or have a symmetry of 20%-50% error.
  • the first portion 100p1 and the second portion 100p2 are completely symmetrical in structure, that is, the x2 of the symmetry point (x2, y2) is equal to the negative x1 of the specified point (x1, y1), and the symmetry point ( The y2 of x2, y2) will be equal to the y1 of the specified point (x1, y1).
  • the LED filament 100 is defined as a third position at a specified point (x3, y3) of the third portion 100p3 of the third quadrant, and a symmetry of the LED filament 100 in the fourth portion 100p4 of the fourth quadrant
  • the point (x4, y4) is defined as the fourth position, and the fourth position of the symmetry point (x4, y4) is symmetrical with respect to the Y axis to the third position of the specified point (x3, y3).
  • the third position and the fourth position may be completely symmetrical or have a symmetry of 20%-50% error.
  • the third portion 100p3 and the fourth portion 100p4 are structurally symmetrical (for example, there is less than 20% error in coordinates), that is, x4 of the symmetry point (x4, y4).
  • the absolute value is not equal to the absolute value of x3 of the specified point (x3, y3), and the absolute value of y4 of the symmetric point (x4, y4) is not equal to the absolute value of y3 of the specified point (x3, y3).
  • the vertical height of the specified point (x3, y3) is slightly lower than the vertical height of the symmetrical point (x4, y4), and the specified point (x3, y3) is closer to Y than the symmetrical point (x4, y4).
  • the absolute value of y4 is slightly smaller than the absolute value of y3, and the absolute value of x4 is slightly larger than the absolute value of x3.
  • the length of the first portion 100p1 of the first quadrant of the LED filament 100 in a side view is substantially equal to the length of the second portion 100p2 of the second quadrant of the LED filament 100 in a side view.
  • the length is defined along a direction in which the LED filament 100 extends in a plan view such as a side view, a front view or a top view.
  • the first portion 100p1 is elongated in the first quadrant of the side view of FIG. 27D to form an inverted "V" shape having ends that respectively contact the X-axis and the Y-axis, and the length of the first portion 100p1 is along the X-axis. Defined by the inverted "V" shape between the Y axis.
  • the length of the third portion 100p3 of the third quadrant of the LED filament 100 in a side view is substantially equal to the length of the fourth portion 100p4 of the fourth quadrant of the LED filament 100 in a side view. Since the third portion 100p3 and the fourth portion 100p4 are structurally symmetrical with respect to each other with respect to the Y axis, the length of the third portion 100p3 is slightly different from the length of the fourth portion 100p4. This error can be 20%-50% or lower.
  • the light-emitting direction of the designated point of the first portion 100p1 and the light-emitting direction of the symmetrical point of the second portion 100p2 are symmetrical in the direction with respect to the Y-axis.
  • the light exiting direction may be defined as the direction in which the LED chip faces.
  • the direction in which the LED chip faces is defined as the direction in which the main light-emitting surface Lm faces, and thus the light-emitting direction can also be defined as the normal direction of the main light-emitting surface Lm.
  • the light-emitting direction ED of the designated point (x1, y1) of the first portion 100p1 is upward in FIG.
  • the light-emitting direction ED of the symmetrical point (x2, y2) of the second portion 100p2 is upward in FIG. 27D.
  • the light-emitting direction ED of the designated point (x1, y1) and the light-emitting direction ED of the symmetrical point (x2, y2) are symmetrical with respect to the Y-axis.
  • the light-emitting direction ED of the designated point (x3, y3) of the third portion 100p3 is toward the lower left direction in FIG. 27D
  • the light-emitting direction ED of the symmetrical point (x4, y4) of the fourth portion 100p4 is oriented in FIG. 27D.
  • the light outgoing direction ED of the designated point (x3, y3) and the light emitting direction ED of the symmetric point (x4, y4) are symmetrical with respect to the Y axis.
  • Figure 27E shows the LED filament 100 of Figure 27C in a two-dimensional coordinate system defined with four quadrants.
  • the LED filament 100 of Fig. 27E is the same as the LED filament 100 of Fig. 27C
  • Fig. 27E is a top view of the LED bulb 20d of Fig. 27A.
  • the center of the four quadrants is defined as the center of the uprights 19a of the LED bulb 20d in the top view (e.g., the top center of the uprights 19a of Fig. 27A).
  • the Y axis is vertical in Fig. 27E and the X axis is horizontal in Fig. 27E.
  • the LED filament 100 is divided into a first portion 100p1, a second portion 100p2, a third portion 100p3 and a fourth portion 100p4 by X-axis and Y-axis in a top view.
  • the first portion 100p1 of the LED filament 100 is the portion that is presented in the first quadrant in a top view
  • the second portion 100p2 of the LED filament 100 is the portion that appears in the second quadrant in a top view
  • the third portion 100p3 of the LED filament 100 is The portion in the third quadrant is presented in a top view
  • the fourth portion 100p4 of the LED filament 100 is the portion that appears in the fourth quadrant in a top view.
  • the LED filaments 100 in the top view may be point symmetric (eg, symmetric according to the origin of the four quadrants) or line symmetric (eg, symmetric according to one of the two axes of the four quadrants).
  • the LED filament 100 is line symmetrical in a top view, and in particular, the LED filament 100 is symmetrical with respect to the Y axis in a top view, that is, the first portion 100p1 and the fourth portion.
  • the geometry of 100p42 will be symmetrical to the geometry of the second portion 100p2 and the third portion 100p3.
  • the first portion 100p1 will be symmetric with respect to the second portion 100p2, and further, in the top view, the first portion 100p1 and the second portion 100p2 will be structurally symmetric with respect to the Y-axis.
  • the third portion 100p3 will be symmetric with respect to the fourth portion 100p4, and further, in the top view, the third portion 100p3 and the fourth portion 100p4 will be structurally symmetric with respect to the Y-axis.
  • the structure of the two symmetrical portions of the LED filament 100 in the top view may be completely symmetrical or structurally Symmetry of the error.
  • the error (tolerance) between the structures of the two symmetrical portions of the LED filament 100 in the top view may be 20% to 50% or less.
  • the LED filament 100 is defined as a first position at a designated point (x1, y1) of the first portion 100p1 of the first quadrant, and a symmetrical point of the LED filament 100 at the second portion 100p2 of the second quadrant.
  • (x2, y2) is defined as the second position
  • the second position of the symmetry point (x2, y2) is symmetrical with respect to the Y axis to the first position of the specified point (x1, y1).
  • the first position and the second position may be completely symmetrical or have a symmetry of 20%-50% error.
  • the first portion 100p1 and the second portion 100p2 are completely symmetrical in structure, that is, the x2 of the symmetry point (x2, y2) is equal to the negative x1 of the specified point (x1, y1), and the symmetry point ( The y2 of x2, y2) will be equal to the y1 of the specified point (x1, y1).
  • the LED filament 100 is defined as a third position at a designated point (x3, y3) of the third portion 100p3 of the third quadrant, and a symmetry of the LED filament 100 in the fourth portion 100p4 of the fourth quadrant
  • the point (x4, y4) is defined as the fourth position, and the fourth position of the symmetry point (x4, y4) is symmetrical with respect to the Y axis to the third position of the specified point (x3, y3).
  • the third position and the fourth position may be completely symmetrical or have a symmetry of 20%-50% error.
  • the third portion 100p3 and the fourth portion 100p4 are structurally symmetrical (for example, there is less than 20% error in coordinates), that is, the x4 of the symmetry point (x4, y4) is not A negative value equal to x3 of the specified point (x3, y3), and y4 of the symmetric point (x4, y4) is not equal to y3 of the specified point (x3, y3).
  • the vertical height of the specified point (x3, y3) is slightly lower than the vertical height of the symmetry point (x4, y4), and the specified point (x3, y3) is closer to Y than the symmetry point (x4, y4).
  • the absolute value of y4 is slightly smaller than the absolute value of y3, and the absolute value of x4 is slightly larger than the absolute value of x3.
  • the length of the first portion 100p1 of the first quadrant of the LED filament 100 in a top view is substantially equal to the length of the second portion 100p2 of the second quadrant of the LED filament 100 in a top view.
  • the length is defined along a direction in which the LED filament 100 is extended in a plan view such as a top view, a front view or a side view.
  • the second portion 100p2 is elongated in the second quadrant of the top view of FIG. 27E to form an inverted "L" shape having ends that respectively contact the X-axis and the Y-axis, and the length of the second portion 100p2 is reversed.
  • the "L" shape is defined.
  • the length of the third portion 100p3 of the third quadrant of the LED filament 100 in the top view is substantially equal to the length of the fourth portion 100p4 of the fourth quadrant of the LED filament 100 in the top view. Since the third portion 100p3 and the fourth portion 100p4 are structurally symmetrical with respect to each other with respect to the Y axis, the length of the third portion 100p3 is slightly different from the length of the fourth portion 100p4. This error can be 20%-50% or lower.
  • the light-emitting direction of the designated point of the first portion 100p1 and the light-emitting direction of the symmetrical point of the second portion 100p2 are symmetrical in the direction with respect to the Y-axis.
  • the light exiting direction may be defined as the direction in which the LED chip faces.
  • the direction in which the LED chip faces is defined as the direction in which the main light-emitting surface Lm faces, and thus the light-emitting direction can also be defined as the normal direction of the main light-emitting surface Lm.
  • the light-emitting direction ED of the designated point (x1, y1) of the first portion 100p1 is rightward in FIG.
  • the light-emitting direction ED of the symmetrical point (x2, y2) of the second portion 100p2 is leftward in FIG. 27E.
  • the light-emitting direction ED of the designated point (x1, y1) and the light-emitting direction ED of the symmetrical point (x2, y2) are symmetrical with respect to the Y-axis. Further, the light-emitting direction ED of the designated point (x3, y3) of the third portion 100p3 is toward the lower left direction in FIG. 27E, and the light-emitting direction ED of the symmetrical point (x4, y4) of the fourth portion 100p4 is oriented in FIG. 27E. Right lower direction.
  • the light outgoing direction ED of the designated point (x3, y3) and the light emitting direction ED of the symmetric point (x4, y4) are symmetrical with respect to the Y axis.
  • the light-emitting direction ED of any given point on the first portion 100p1 and the light-emitting direction ED of any corresponding symmetric point on the second portion 100p2 that is symmetric with respect to the specified point will be in the direction relative to the Y-axis. symmetry.
  • the light-emitting direction ED of any specified point on the third portion 100p3 and the light-emitting direction ED of any corresponding symmetric point on the fourth portion 100p4 that is symmetric with respect to the specified point are in the direction relative to the Y-axis. symmetry.
  • Symmetrical characteristics of power placement, symmetric refractive index, and/or symmetrical surface roughness contribute to uniform distribution of light, and symmetric design of symmetric power placement, symmetric refractive index, and/or symmetrical surface roughness of LED chip 442,
  • a comprehensive consideration of the segmentation characteristics of the LED filament described above enables the LED bulb having the LED filament 100 to generate full illumination.
  • Figure 28A is a schematic illustration of an LED bulb 20e in accordance with one embodiment of the present invention
  • Figure 28B is a side view of the LED bulb 20e of Figure 28A.
  • the LED bulb 20e shown in Figs. 28A and 28B is similar to the LED bulb 20d shown in Fig. 27A.
  • the main difference between the LED bulb lamp 20e and the LED bulb lamp 20d is the LED filament 100.
  • the LED filament 100 of the LED bulb lamp 20e is connected to the top end of the upright 19a and extends to form two circles perpendicular to each other. shape.
  • the LED filament 100 is positioned above the upright 19a, and the upright 19a (ie, the stem) is located between the base 16 and the LED filament 100.
  • the LED filament 100 is presented in a two-dimensional coordinate system defined with four quadrants.
  • the Y axis is aligned with the upright 19a and the X axis is traversed by the upright 19a.
  • the LED filament 100 in the side view can be divided into a first portion 100p1 and a second portion 100p2 by the Y axis, and the LED filament 100 is completely located in the upper quadrant of Fig. 17B.
  • the first portion 100p1 of the LED filament 100 is the portion that appears in the first quadrant in a side view
  • the second portion 100p2 of the LED filament 100 is the portion that appears in the second quadrant in a side view.
  • the LED filament 100 is line symmetrical, and the LED filament 100 is symmetrical with respect to the Y axis in a side view, while the first portion 100p1 and the second portion 100p2 are structurally symmetrical with respect to the Y axis in a side view.
  • the first portion 100p1 forms a semicircle in a side view
  • the second portion 100p2 forms a semicircle in a side view
  • the first portion 100p1 and the second portion 100p2 together form a circular shape in a side view.
  • the light-emitting direction ED of the first portion 100p1 and the light-emitting direction ED of the second portion 100p2 are symmetrical in the direction with respect to the Y-axis in a side view.
  • Figure 28C is a top plan view of the LED bulb 20e of Figure 28A.
  • the LED filament 100 of Figure 28C is presented in a two-dimensional coordinate system defined with four quadrants.
  • the origin of the four quadrants is defined as the center of the upright 19a of the LED bulb 20e in the top view (as in the center of the top end of the upright 19a of Fig. 28A), in the present embodiment, the Y-axis of Fig. 28C is inclined.
  • the X axis of Fig. 28C is also inclined. As shown in FIG.
  • the LED filament 100 in the top view can be divided into a first portion 100p1, a second portion 100p2, a third portion 100p3, and a fourth portion 100p4 by the X-axis and the Y-axis.
  • the first portion 100p1 of the LED filament 100 is the portion that is presented in the first quadrant in a top view
  • the second portion 100p2 of the LED filament 100 is the portion that appears in the second quadrant in a top view
  • the third portion 100p3 of the LED filament 100 is The portion in the third quadrant is presented in a top view
  • the fourth portion 100p4 of the LED filament 100 is the portion that appears in the fourth quadrant in a top view.
  • the LED filament 100 in the top view is point symmetrical, specifically, the LED filament 100 is symmetrical with respect to the origin of the four quadrants in a top view.
  • the structure of the LED filament 100 in the top view will be the same as the structure in which the LED filament 100 is rotated 180 degrees around the origin in the top view.
  • the LED filament 100 is defined as a first position at a specified point (x1, y1) of the first portion 100p1 of the first quadrant, and a symmetrical point of the LED filament 100 at the third portion 100p2 of the third quadrant.
  • (x2, y2) is defined as the second position, and the second position of the symmetry point (x2, y2) is symmetrical with respect to the origin to the first position of the specified point (x1, y1).
  • the designated point (x1, y1) of the first portion 100p1 of the LED filament 100 in the top view overlaps the third of the LED filament 100 in the top view.
  • the LED filament 100 is defined as a third position at a specified point (x3, y3) of the second portion 100p2 of the second quadrant, and a symmetry of the LED filament 100 in the fourth portion 100p4 of the fourth quadrant
  • the point (x4, y4) is defined as the fourth position, and the fourth position of the symmetry point (x4, y4) is symmetrical with respect to the origin to the third position of the specified point (x3, y3).
  • the designated point (x3, y3) of the second portion 100p2 of the LED filament 100 in the top view overlaps the LED filament 100 in the top view.
  • the LED filament 100 is also line symmetrical in a top view. Specifically, the LED filament 100 is symmetrical with respect to the X-axis or the Y-axis in a top view. That is, the first portion 100p1 and the second portion 100p2 are symmetrical with respect to the Y axis, and the third portion 100p3 and the fourth portion 100p4 are symmetrical with respect to the Y axis. Further, the first portion 100p1 and the fourth portion 100p4 are symmetrical with respect to the X axis, and the second portion 100p2 and the third portion 100p3 are symmetrical with respect to the X axis. The first portion 100p1, the second portion 100p2, the third portion 100p3, and the fourth portion 100p4 together form an "X" shape in a top view.
  • the light-emitting direction ED of the designated point (x1, y1) of the first portion 100p1 and the light-emitting direction ED of the symmetrical point (x2, y2) of the third portion 100p3 are symmetrical in the top view with respect to the origin
  • the light exiting direction ED of the specified point (x3, y3) of 100p2 and the light exiting direction ED of the symmetrical point (x4, y4) of the fourth portion 100p4 are symmetrical in the top view with respect to the origin.
  • the light-emitting direction ED of the first portion 100p1 and the light-emitting direction ED of the second portion 100p2 are symmetrical in the top view with respect to the Y-axis, and the light-emitting direction ED of the third portion 100p3 and the light-emitting direction ED of the fourth portion 100p4. It is symmetrical in direction with respect to the Y axis in the top view.
  • the light-emitting direction ED of the first portion 100p1 and the light-emitting direction ED of the fourth portion 100p4 are symmetrical in the top view with respect to the X-axis
  • the light-emitting direction ED of the second portion 100p2 and the light-emitting direction ED of the third portion 100p3 are The top view is symmetrical in direction with respect to the X axis.
  • Figure 29A is a schematic view of an LED bulb 20f in accordance with one embodiment of the present invention
  • Figure 29B is a side view of the LED bulb 20f of Figure 29A.
  • the LED bulb 20f shown in Figs. 29A and 29B is similar to the LED bulb 20d shown in Fig. 27A.
  • the main difference between the LED bulb 20f and the LED bulb 20d is the LED filament 100.
  • the LED filament 100 of the LED bulb 20f is connected to the upright 19a and extends to form two circular circles perpendicular to each other ( Or four semi-circular perpendicular to each other).
  • the LED filament 100 passes through the upright 19a.
  • the LED filament 100 is presented in a two-dimensional coordinate system defined with four quadrants.
  • the Y axis is aligned with the upright 19a and the X axis is traversed by the upright 19a.
  • the LED filament 100 in a side view can be divided into a first portion 100p1 and a second portion 100p2 by a Y-axis.
  • the first portion 100p1 of the LED filament 100 is the portion that appears in the first quadrant in a side view
  • the second portion 100p2 of the LED filament 100 is the portion that appears in the second quadrant in a side view.
  • the LED filament 100 is line symmetrical, and the LED filament 100 is symmetrical with respect to the Y axis in a side view, while the first portion 100p1 and the second portion 100p2 are structurally symmetrical with respect to the Y axis in a side view. Further, the light-emitting direction ED of the first portion 100p1 and the light-emitting direction ED of the second portion 100p2 are symmetrical in the direction with respect to the Y-axis in a side view.
  • FIG. 29C is a top view of the LED bulb 20f of FIG. 29A.
  • the LED filament 100 of Figure 29C is presented in a two-dimensional coordinate system defined with four quadrants.
  • the origin of the four quadrants is defined as the center of the upright 19a of the LED bulb 20f in the top view (as in the center of the top end of the upright 19a of Fig. 29A), and in the present embodiment, the Y-axis of Fig. 29C is inclined. And the X-axis of Fig. 29C is also inclined. As shown in FIG.
  • the LED filament 100 in the top view can be divided into a first portion 100p1, a second portion 100p2, a third portion 100p3, and a fourth portion 100p4 by the X-axis and the Y-axis.
  • the first portion 100p1 of the LED filament 100 is the portion that is presented in the first quadrant in a top view
  • the second portion 100p2 of the LED filament 100 is the portion that appears in the second quadrant in a top view
  • the third portion 100p3 of the LED filament 100 is The portion in the third quadrant is presented in a top view
  • the fourth portion 100p4 of the LED filament 100 is the portion that appears in the fourth quadrant in a top view.
  • the LED filament 100 in the top view is point symmetrical, specifically, the LED filament 100 is symmetrical with respect to the origin of the four quadrants in a top view.
  • the structure of the LED filament 100 in the top view will be the same as the structure in which the LED filament 100 is rotated 180 degrees around the origin in the top view.
  • the LED filament 100 is set to a first position at a specified point (x1, y1) of the first portion 100p1 of the first quadrant, and a symmetrical point of the LED filament 100 at the third portion 100p2 of the third quadrant.
  • (x2, y2) is defined as the second position
  • the second position of the symmetry point (x2, y2) is symmetrical with respect to the origin to the first position of the specified point (x1, y1).
  • the designated point (x1, y1) of the first portion 100p1 of the LED filament 100 in the top view overlaps the third of the LED filament 100 in the top view.
  • the LED filament 100 is defined as a third position at a specified point (x3, y3) of the second portion 100p2 of the second quadrant, and a symmetry of the LED filament 100 in the fourth portion 100p4 of the fourth quadrant
  • the point (x4, y4) is defined as the fourth position, and the fourth position of the symmetry point (x4, y4) is symmetrical with respect to the origin to the third position of the specified point (x3, y3).
  • the designated point (x3, y3) of the second portion 100p2 of the LED filament 100 in the top view overlaps the LED filament 100 in the top view.
  • the LED filament 100 is also line symmetrical in a top view. Specifically, the LED filament 100 is symmetrical with respect to the X-axis or the Y-axis in a top view. That is, the first portion 100p1 and the second portion 100p2 are symmetrical with respect to the Y axis, and the third portion 100p3 and the fourth portion 100p4 are symmetrical with respect to the Y axis. Further, the first portion 100p1 and the fourth portion 100p4 are symmetrical with respect to the X axis, and the second portion 100p2 and the third portion 100p3 are symmetrical with respect to the X axis. The first portion 100p1 and the fourth portion 100p4 together form an "L" shape in a top view, and the second portion 100p2 and the third portion 100p3 together form an inverted "L" shape in a top view.
  • the light-emitting direction ED of the designated point (x1, y1) of the first portion 100p1 and the light-emitting direction ED of the symmetrical point (x2, y2) of the third portion 100p3 are symmetrical in the top view with respect to the origin
  • the light exiting direction ED of the specified point (x3, y3) of 100p2 and the light exiting direction ED of the symmetrical point (x4, y4) of the fourth portion 100p4 are symmetrical in the top view with respect to the origin.
  • the light-emitting direction ED of the first portion 100p1 and the light-emitting direction ED of the second portion 100p2 are symmetrical in the top view with respect to the Y-axis, and the light-emitting direction ED of the third portion 100p3 and the light-emitting direction ED of the fourth portion 100p4. It is symmetrical in direction with respect to the Y axis in the top view.
  • the light-emitting direction ED of the first portion 100p1 and the light-emitting direction ED of the fourth portion 100p4 are symmetrical in the top view with respect to the X-axis
  • the light-emitting direction ED of the second portion 100p2 and the light-emitting direction ED of the third portion 100p3 are The top view is symmetrical in direction with respect to the X axis.
  • Figure 30A is a schematic view of an LED bulb 20g in accordance with one embodiment of the present invention
  • Figure 30B is a side view of the LED bulb 20g of Figure 30A
  • the LED bulb 20g shown in Figs. 30A and 30B is similar to the LED bulb 20d shown in Fig. 27A.
  • the main difference between the LED bulb lamp 20g and the LED bulb lamp 20d is the LED filament 100.
  • the LED filament 100 of the LED bulb lamp 20g is connected to the top of the upright 19a and extends to form two on one plane. Round shape.
  • the two circles formed by the LED filaments 100 are arranged side by side, and their shapes are similar to represent infinite symbols.
  • the LED filament 100 passes through the top of the upright 19a.
  • the LED filament 100 is presented in a two-dimensional coordinate system defined with four quadrants.
  • the Y axis is aligned with the upright 19a and the X axis is traversed by the upright 19a.
  • the LED filament 100 in the side view can be divided into a first portion 100p1 and a second portion 100p2 by the Y-axis.
  • the first portion 100p1 of the LED filament 100 is the portion that appears in the first quadrant in a side view
  • the second portion 100p2 of the LED filament 100 is the portion that appears in the second quadrant in a side view.
  • the LED filament 100 is line symmetrical, and the LED filament 100 is symmetrical with respect to the Y axis in a side view, while the first portion 100p1 and the second portion 100p2 are structurally symmetrical with respect to the Y axis in a side view. Further, the light-emitting direction ED of the first portion 100p1 and the light-emitting direction ED of the second portion 100p2 are symmetrical in the direction with respect to the Y-axis in a side view.
  • the LED filament 100 is also point-symmetrical.
  • FIG. 30C is a top view of the LED bulb 20g of FIG. 30A.
  • the LED filament 100 of Figure 30C is presented in a two-dimensional coordinate system defined with four quadrants.
  • the origin of the four quadrants is defined as the center of the upright 19a of the LED bulb 20g in the top view (as in the center of the top end of the upright 19a of Fig. 30A).
  • the Y-axis of Fig. 30C is vertical.
  • the X axis of Fig. 30C is horizontal. As shown in FIG.
  • the LED filament 100 in the top view can be divided into a first portion 100p1, a second portion 100p2, a third portion 100p3, and a fourth portion 100p4 by the X-axis and the Y-axis.
  • the first portion 100p1 of the LED filament 100 is the portion that is presented in the first quadrant in a top view
  • the second portion 100p2 of the LED filament 100 is the portion that appears in the second quadrant in a top view
  • the third portion 100p3 of the LED filament 100 is The portion in the third quadrant is presented in a top view
  • the fourth portion 100p4 of the LED filament 100 is the portion that appears in the fourth quadrant in a top view.
  • the LED filament 100 in the top view is point symmetrical, specifically, the LED filament 100 is symmetrical with respect to the origin of the four quadrants in a top view.
  • the structure of the LED filament 100 in the top view will be the same as the structure in which the LED filament 100 is rotated 180 degrees around the origin in the top view.
  • the first portion 100p1 and the third portion 100p3 of the LED filament 100 are symmetrical with respect to the origin, and the second portion 100p2 and the fourth portion 100p4 of the LED filament 100 are symmetrical with respect to the origin.
  • the LED filament 100 is defined as a first position at a specified point (x1, y1) of the first portion 100p1 of the first quadrant, and a symmetrical of the LED filament 100 in the third portion 100p3 of the third quadrant is
  • the symmetry point (x3, y3) of the specified point (x1, y1) is defined as the second position, and the second position of the symmetry point (x3, y3) is symmetrical with respect to the origin to the first position of the specified point (x1, y1).
  • the LED filament 100 when the LED filament 100 is rotated 180 degrees around the origin in the top view, the designated point (x1, y1) of the first portion 100p1 of the LED filament 100 in the top view overlaps the third of the LED filament 100 in the top view. Partial 100p3 symmetry point (x3, y3). Further, the LED filament 100 is defined as a third position at a specified point (x2, y2) of the second portion 100p2 of the second quadrant, and the LED filament 100 is symmetrical at a specified point (x2, in a fourth portion 100p4 of the fourth quadrant).
  • the symmetry point (x4, y4) of y2) is defined as the fourth position, and the fourth position of the symmetry point (x4, y4) is symmetrical with respect to the origin to the third position of the specified point (x2, y2).
  • the designated point (x2, y2) of the second portion 100p2 of the LED filament 100 in the top view overlaps the LED filament 100 in the top view.
  • the light-emitting direction ED of the designated point (x1, y1) of the first portion 100p1 and the light-emitting direction ED of the symmetrical point (x3, y3) of the third portion 100p3 are symmetrical in the top view with respect to the origin
  • the light exiting direction ED of the specified point (x2, y2) of 100p2 and the light exiting direction ED of the symmetrical point (x4, y4) of the fourth portion 100p4 are symmetrical in the top view with respect to the origin.
  • FIG. 31A is a schematic view of an LED bulb 20h according to an embodiment of the present invention
  • FIG. 31B is a side view of the LED bulb 20h of FIG. 31A
  • the LED bulb 20h shown in Figs. 31A and 31B is similar to the LED bulb 20d shown in Fig. 27A.
  • the main difference between the LED bulb lamp 20h and the LED bulb lamp 20d is the LED filament 100.
  • the LED filament 100 of the LED bulb lamp 20h is connected to the top of the upright 19a and extends to form two circles.
  • the two circles formed by the LED filaments 100 are arranged side by side, and their shapes are similar to represent infinite symbols.
  • the two circles formed by the LED filaments 100 assume a "V" shape in a side view.
  • the LED filament 100 passes through the top of the upright 19a.
  • the LED filament 100 is presented in a two-dimensional coordinate system defined with four quadrants.
  • the Y axis is aligned with the upright 19a and the X axis is traversed by the upright 19a.
  • the LED filament 100 in a side view can be divided into a first portion 100p1 and a second portion 100p2 by a Y-axis.
  • the first portion 100p1 of the LED filament 100 is the portion that appears in the first quadrant in a side view
  • the second portion 100p2 of the LED filament 100 is the portion that appears in the second quadrant in a side view.
  • the LED filament 100 is line symmetrical, and the LED filament 100 is symmetrical with respect to the Y axis in a side view, while the first portion 100p1 and the second portion 100p2 are structurally symmetrical with respect to the Y axis in a side view. Further, the light-emitting direction ED of the first portion 100p1 and the light-emitting direction ED of the second portion 100p2 are symmetrical in the direction with respect to the Y-axis in a side view.
  • FIG. 31C is a top view of the LED bulb 20h of FIG. 31A.
  • the LED filament 100 of Figure 31C is presented in a two-dimensional coordinate system defined with four quadrants.
  • the origin of the four quadrants is defined as the center of the upright 19a of the LED bulb 20h in the top view (as in the center of the top end of the upright 19a of Fig. 31A), in the present embodiment, the Y-axis of Fig. 31C is vertical.
  • the X axis of Fig. 31C is horizontal. As shown in FIG.
  • the LED filament 100 in the top view can be divided into a first portion 100p1, a second portion 100p2, a third portion 100p3, and a fourth portion 100p4 by the X-axis and the Y-axis.
  • the first portion 100p1 of the LED filament 100 is the portion that is presented in the first quadrant in a top view
  • the second portion 100p2 of the LED filament 100 is the portion that appears in the second quadrant in a top view
  • the third portion 100p3 of the LED filament 100 is The portion in the third quadrant is presented in a top view
  • the fourth portion 100p4 of the LED filament 100 is the portion that appears in the fourth quadrant in a top view.
  • the LED filament 100 in the top view is point symmetrical, specifically, the LED filament 100 is symmetrical with respect to the origin of the four quadrants in a top view.
  • the structure of the LED filament 100 in the top view will be the same as the structure in which the LED filament 100 is rotated 180 degrees around the origin in the top view.
  • the first portion 100p1 and the third portion 100p3 of the LED filament 100 are symmetrical with respect to the origin, and the second portion 100p2 and the fourth portion 100p4 of the LED filament 100 are symmetrical with respect to the origin.
  • the light-emitting direction ED of the first portion 100p1 and the light-emitting direction ED of the third portion 100p3 are symmetrical in the top view with respect to the origin, and the light-emitting direction ED of the second portion 100p2 and the light-emitting direction ED of the fourth portion 100p4 are at the top.
  • the view is symmetrical in direction with respect to the origin.
  • Figure 32A is a schematic diagram of an LED bulb 20i in accordance with one embodiment of the present invention
  • Figure 32B is a side view of the LED bulb 20i of Figure 32A.
  • the LED bulb 20i shown in Figs. 32A and 32B is similar to the LED bulb 20d shown in Fig. 27A.
  • the main difference between the LED bulb 20i and the LED bulb 20d is the LED filament 100.
  • the LED filament 100 of the LED bulb 20i is connected to the top of the upright 19a and extends to form two circles.
  • the two circles formed by the LED filaments 100 are arranged side by side, and their shapes are similar to represent infinite symbols.
  • the two circles formed by the LED filaments 100 exhibit an inverted "V" shape in a side view.
  • the LED filament 100 does not pass through the top of the upright 19a, and the LED filament 100 is supported by the cantilever.
  • the LED filament 100 is presented in a two-dimensional coordinate system defined with four quadrants.
  • the Y axis is aligned with the upright 19a and the X axis is traversed by the upright 19a.
  • the LED filament 100 in the side view can be divided into a first portion 100p1 and a second portion 100p2 by the Y-axis.
  • the first portion 100p1 of the LED filament 100 is the portion that appears in the first quadrant in a side view
  • the second portion 100p2 of the LED filament 100 is the portion that appears in the second quadrant in a side view.
  • the LED filament 100 is line symmetrical, and the LED filament 100 is symmetrical with respect to the Y axis in a side view, while the first portion 100p1 and the second portion 100p2 are structurally symmetrical with respect to the Y axis in a side view. Further, the light-emitting direction ED of the first portion 100p1 and the light-emitting direction ED of the second portion 100p2 are symmetrical in the direction with respect to the Y-axis in a side view.
  • Figure 32C is a top plan view of the LED bulb 20i of Figure 32A.
  • the LED filament 100 of Figure 32C is presented in a two-dimensional coordinate system defined with four quadrants.
  • the origin of the four quadrants is defined as the center of the upright 19a of the LED bulb 20i in the top view (as in the center of the top end of the upright 19a of Fig. 32A).
  • the Y-axis of Fig. 32C is vertical.
  • the X axis of Fig. 32C is horizontal. As shown in FIG.
  • the LED filament 100 in the top view can be divided into a first portion 100p1, a second portion 100p2, a third portion 100p3, and a fourth portion 100p4 by the X-axis and the Y-axis.
  • the first portion 100p1 of the LED filament 100 is the portion that is presented in the first quadrant in a top view
  • the second portion 100p2 of the LED filament 100 is the portion that appears in the second quadrant in a top view
  • the third portion 100p3 of the LED filament 100 is The portion in the third quadrant is presented in a top view
  • the fourth portion 100p4 of the LED filament 100 is the portion that appears in the fourth quadrant in a top view.
  • the LED filament 100 in the top view is point symmetrical, and specifically, the LED filament 100 is symmetrical with respect to the origin of the four quadrants in the top view.
  • the structure of the LED filament 100 in the top view will be the same as the structure in which the LED filament 100 is rotated 180 degrees around the origin in the top view.
  • the first portion 100p1 and the third portion 100p3 of the LED filament 100 are symmetrical with respect to the origin, and the second portion 100p2 and the fourth portion 100p4 of the LED filament 100 are symmetrical with respect to the origin.
  • the light-emitting direction ED of the first portion 100p1 and the light-emitting direction ED of the third portion 100p3 are symmetrical in the top view with respect to the origin, and the light-emitting direction ED of the second portion 100p2 and the light-emitting direction ED of the fourth portion 100p4 are at the top.
  • the view is symmetrical in direction with respect to the origin.
  • Figure 33A is a schematic diagram of an LED bulb 20j in accordance with one embodiment of the present invention
  • Figure 33B is a side view of the LED bulb 20j of Figure 33A.
  • the LED bulb 20j shown in Figs. 33A and 33B is similar to the LED bulb 20d shown in Fig. 27A.
  • the main difference between the LED bulb 20j and the LED bulb 20d is the LED filament 100.
  • the LED filament 100 of the LED bulb 20j is connected to the top of the pole 19a and extends to form two spirals.
  • the two spirals formed by the LED filaments 100 are arranged side by side, and when viewed from a specific angle, as shown in Fig. 33A, the shape is similar to the "S" shape.
  • one of the two spirals extends upward, and the other of the two spirals extends downward.
  • the LED filament 100 passes through the top of the upright 19a.
  • the LED filament 100 is presented in a two-dimensional coordinate system defined with four quadrants.
  • the Y axis is aligned with the upright 19a and the X axis is traversed by the upright 19a.
  • the LED filament 100 in the side view can be divided into a first portion 100p1, a second portion 100p2, a third portion 100p3, and a fourth portion 100p4 by the X-axis and the Y-axis.
  • the first portion 100p1 of the LED filament 100 is the portion that appears in the first quadrant in a side view
  • the second portion 100p2 of the LED filament 100 is the portion that appears in the second quadrant in a side view
  • the third portion 100p3 of the LED filament 100 is The portion of the third quadrant is presented in a side view
  • the fourth portion 100p4 of the LED filament 100 is the portion that appears in the fourth quadrant in a side view.
  • the LED filament 100 is point symmetrical in a side view, and the LED filament 100 is symmetrical with respect to the origin in a side view.
  • the first portion 100p1 and the third portion 100p3 are structurally symmetrical with respect to the origin in a side view
  • the second portion 100p2 and the fourth portion 100p4 are structurally symmetrical with respect to the origin in a side view.
  • the structure of the LED filament 100 in a side view is the same as the structure in which the LED filament 100 is rotated 180 degrees around the origin in a side view.
  • the LED filament 100 is defined as a first position at a specified point (x1, y1) of the second portion 100p2 of the second quadrant, and a symmetry of the LED filament 100 in the fourth portion 100p4 of the fourth quadrant
  • the symmetry point (x2, y2) at the specified point (x1, y1) is defined as the second position, and the second position of the symmetry point (x2, y2) is symmetrical with respect to the origin to the first position of the specified point (x1, y1).
  • the designated point (x1, y1) of the second portion 100p2 of the LED filament 100 in the side view overlaps the LED filament 100 in the side view.
  • the light-emitting direction ED of the designated point (x1, y1) of the second portion 100p2 and the light-emitting direction ED of the symmetrical point (x2, y2) of the fourth portion 100p4 are symmetrical in the direction with respect to the origin in the side view.
  • FIG. 33C is a top view of the LED bulb 20j of FIG. 33A.
  • the LED filament 100 of Figure 33C is presented in a two-dimensional coordinate system defined with four quadrants.
  • the origin of the four quadrants is defined as the center of the upright 19a of the LED bulb 20j in the top view (as in the center of the top end of the upright 19a of Fig. 33A).
  • the Y-axis of Fig. 33C is vertical.
  • the X axis of Fig. 33C is horizontal. As shown in FIG.
  • the LED filament 100 in the top view can be divided into a first portion 100p1, a second portion 100p2, a third portion 100p3, and a fourth portion 100p4 by the X-axis and the Y-axis.
  • the first portion 100p1 of the LED filament 100 is the portion that is presented in the first quadrant in a top view
  • the second portion 100p2 of the LED filament 100 is the portion that appears in the second quadrant in a top view
  • the third portion 100p3 of the LED filament 100 is The portion in the third quadrant is presented in a top view
  • the fourth portion 100p4 of the LED filament 100 is the portion that appears in the fourth quadrant in a top view.
  • the LED filament 100 in the top view is point symmetrical, specifically, the LED filament 100 is symmetrical with respect to the origin of the four quadrants in a top view.
  • the structure of the LED filament 100 in the top view will be the same as the structure in which the LED filament 100 is rotated 180 degrees around the origin in the top view.
  • the first portion 100p1 and the third portion 100p3 of the LED filament 100 are symmetrical with respect to the origin, and the second portion 100p2 and the fourth portion 100p4 of the LED filament 100 are symmetrical with respect to the origin.
  • the light-emitting direction ED of the first portion 100p1 and the light-emitting direction ED of the third portion 100p3 are symmetrical in the top view with respect to the origin, and the light-emitting direction ED of the second portion 100p2 and the light-emitting direction ED of the fourth portion 100p4 are at the top.
  • the view is symmetrical in direction with respect to the origin.
  • FIG. 34A is a schematic view of an LED bulb 20k according to an embodiment of the present invention
  • FIG. 34B is a side view of the LED bulb 20k of FIG. 34A
  • the LED bulb 20k shown in Figs. 34A and 34B is similar to the LED bulb 20d shown in Fig. 27A.
  • the main difference between the LED bulb lamp 20k and the LED bulb lamp 20d is the LED filament 100.
  • the LED filament 100 of the LED bulb lamp 20k is connected to the top of the upright 19a and extends to form four vertical halves. Round.
  • the LED filament 100 passes through the bottom of the upright 19a and over the top of the upright 19a.
  • the LED filament 100 is presented in a two-dimensional coordinate system defined with four quadrants.
  • the Y axis is aligned with the upright 19a and the X axis is traversed by the upright 19a.
  • the LED filament 100 in the side view can be divided into a first portion 100p1, a second portion 100p2, a third portion 100p3, and a fourth portion 100p4 by the X-axis and the Y-axis.
  • the first portion 100p1 of the LED filament 100 is the portion that appears in the first quadrant in a side view
  • the second portion 100p2 of the LED filament 100 is the portion that appears in the second quadrant in a side view
  • the third portion 100p3 of the LED filament 100 is The portion of the third quadrant is presented in a side view
  • the fourth portion 100p4 of the LED filament 100 is the portion that appears in the fourth quadrant in a side view.
  • the LED filament 100 is point symmetrical in a side view, and the LED filament 100 is symmetrical with respect to the origin in a side view.
  • the first portion 100p1 and the third portion 100p3 are structurally symmetrical with respect to the origin in a side view
  • the second portion 100p2 and the fourth portion 100p4 are structurally symmetrical with respect to the origin in a side view.
  • the structure of the LED filament 100 in a side view is the same as the structure in which the LED filament 100 is rotated 180 degrees around the origin in a side view.
  • the light-emitting direction ED of the first portion 100p1 and the light-emitting direction ED of the third portion 100p3 are symmetrical in the side view with respect to the origin in the side view, and the light-emitting direction ED of the second portion 100p2 and the light-emitting direction ED of the fourth portion 100p4 are on the side.
  • the view is symmetrical in direction with respect to the origin.
  • Figure 34C is a top plan view of the LED bulb 20k of Figure 34A.
  • the LED filament 100 of Figure 34C is presented in a two-dimensional coordinate system defined with four quadrants.
  • the origin of the four quadrants is defined as the center of the upright 19a of the LED bulb 20k in the top view (as in the center of the top end of the upright 19a of Fig. 34A).
  • the Y-axis of Fig. 34C is inclined.
  • the X axis of Fig. 34C is also inclined. As shown in FIG.
  • the LED filament 100 in the top view can be divided into a first portion 100p1, a second portion 100p2, a third portion 100p3, and a fourth portion 100p4 by the X-axis and the Y-axis.
  • the first portion 100p1 of the LED filament 100 is the portion that is presented in the first quadrant in a top view
  • the second portion 100p2 of the LED filament 100 is the portion that appears in the second quadrant in a top view
  • the third portion 100p3 of the LED filament 100 is The portion in the third quadrant is presented in a top view
  • the fourth portion 100p4 of the LED filament 100 is the portion that appears in the fourth quadrant in a top view.
  • the LED filament 100 in the top view is line symmetrical, and specifically, the LED filament 100 is symmetrical with respect to the Y axis in a top view.
  • the first portion 100p1 and the second portion 100p2 of the LED filament 100 are symmetrical with respect to the Y-axis, and the third portion 100p3 and the fourth portion 100p4 of the LED filament 100 are symmetrical with respect to the Y-axis.
  • Each of the first portion 100p1, the second portion 100p2, the third portion 100p3, and the fourth portion 100p4 is formed in a blade shape in a top view, and the first portion 100p1, the second portion 100p2, the third portion 100p3, and the fourth portion 100p4 are at the top
  • the shape of the four-leaf clover is formed together in the view.
  • the light-emitting direction ED of the first portion 100p1 and the light-emitting direction ED of the second portion 100p2 are symmetrical in the top view with respect to the Y-axis
  • the light-emitting direction ED of the third portion 100p3 and the light-emitting direction ED of the fourth portion 100p4 are The top view is symmetrical in direction with respect to the Y axis.
  • FIG. 35A-35C Figures 35A-35C are schematic, side and top views, respectively, of an LED bulb 30a in accordance with one embodiment of the present invention.
  • the LED bulb 30a includes an LED filament 100 and is similar to the LED bulb of the previous embodiment.
  • the difference between the LED bulb 30a and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30a has a modified structure.
  • the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness. As shown in FIG.
  • the LED filament 100 is presented in a first quadrant and a second quadrant in a side view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip with respect to the Y-axis. It is line-symmetric in the power arrangement of LED chips with different powers, in refractive index or in surface roughness.
  • the LED filament 100 is presented in four quadrant portions in a top view, which may be in relation to the origin and relative to the Y-axis and the X-axis in terms of structure, length, and direction of light, in the LED chip.
  • the configuration is point-symmetric and line-symmetric in the power arrangement of the LED chips with different powers, in the refractive index or in the surface roughness.
  • FIG. 36A-36C Figures 36A-36C are schematic, side and top views, respectively, of an LED bulb 30b in accordance with one embodiment of the present invention.
  • the LED bulb 30b includes an LED filament 100 and is similar to the LED bulb of the previous embodiment.
  • the difference between the LED bulb 30b and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30b has a modified structure.
  • the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness. As shown in FIG.
  • the LED filament 100 is presented in a first quadrant and a second quadrant in a side view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip with respect to the Y axis. It is line-symmetric in the power arrangement of LED chips with different powers, in refractive index or in surface roughness.
  • the LED filament 100 is presented in four quadrant portions in a top view, which may be relative to the origin and relative to the Y-axis and the X-axis in terms of structure, length, and direction of light, in the LED chip.
  • the configuration is point-symmetric and line-symmetric in the power arrangement of the LED chips with different powers, in the refractive index or in the surface roughness.
  • FIG. 37A to 37C are schematic, side and top views, respectively, of an LED bulb 30c according to an embodiment of the present invention.
  • the LED bulb 30c includes an LED filament 100 and is similar to the LED bulb of the previous embodiment. The difference between the LED bulb 30c and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30c has a modified structure. When the LED filament 100 is in operation, the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness. As shown in FIG.
  • the LED filament 100 presents portions of the first quadrant and the second quadrant in a side view and portions of the third quadrant and the fourth quadrant presented in a side view, which may be structurally relative to the Y-axis. It is line symmetrical in length, in the light exit direction, on the configuration of the LED chip, on the power arrangement of the LED chips having different powers, on the refractive index or on the surface roughness. As shown in FIG. 37C, the LED filament 100 is presented in four quadrant portions in a top view, which may be in relation to the origin and relative to the Y-axis and the X-axis in terms of structure, length, and direction of light, in the LED chip. The configuration is point-symmetric and line-symmetric in the power arrangement of the LED chips with different powers, in the refractive index or in the surface roughness.
  • FIG. 38A-38C Figures 15 through 38C are schematic, side and top views, respectively, of an LED bulb 30d in accordance with one embodiment of the present invention.
  • the LED bulb 30d includes an LED filament 100 and is similar to the LED bulb of the previous embodiment.
  • the difference between the LED bulb 30d and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30d has a modified structure.
  • the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness. As shown in FIG.
  • the LED filament 100 presents portions of the first quadrant and the second quadrant in a side view and portions of the third quadrant and the fourth quadrant presented in a side view, which may be structurally relative to the Y-axis. It is line symmetrical in length, in the light exit direction, on the configuration of the LED chip, on the power arrangement of the LED chips having different powers, on the refractive index or on the surface roughness.
  • the LED filament 100 is presented in four quadrant portions in a top view, which may be relative to the origin and relative to the Y-axis and the X-axis, structurally, in length, in the light-emitting direction, in the LED chip.
  • the configuration is point-symmetric and line-symmetric in the power arrangement of the LED chips with different powers, in the refractive index or in the surface roughness.
  • Figures 39A-39C are schematic, side and top views, respectively, of an LED bulb 30e in accordance with one embodiment of the present invention.
  • the LED bulb 30e includes an LED filament 100 and is similar to the LED bulb of the previous embodiment.
  • the difference between the LED bulb 30e and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30e has a modified structure.
  • the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness. As shown in FIG.
  • the LED filament 100 is presented in a first quadrant and a second quadrant in a side view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip with respect to the Y-axis. It is line-symmetric in the power arrangement of LED chips with different powers, in refractive index or in surface roughness.
  • the LED filament 100 is presented in four quadrant portions in a top view, which may be in relation to the origin and relative to the Y-axis and the X-axis in terms of structure, length, and direction of light, in the LED chip.
  • the configuration is point-symmetric and line-symmetric in the power arrangement of the LED chips with different powers, in the refractive index or in the surface roughness.
  • FIG. 40A to 40C are schematic, side and top views, respectively, of an LED bulb 30f according to an embodiment of the present invention.
  • the LED bulb 30f includes an LED filament 100 and is similar to the LED bulb of the previous embodiment. The difference between the LED bulb 30f and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30f has a modified structure. When the LED filament 100 is in operation, the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness. As shown in FIG.
  • the LED filament 100 is presented in a first quadrant and a second quadrant in a side view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip with respect to the Y-axis. It is line-symmetric in the power arrangement of LED chips with different powers, in refractive index or in surface roughness.
  • the LED filament 100 is presented in four quadrant portions in a top view, which may be in relation to the origin and relative to the Y-axis and the X-axis in terms of structure, length, and direction of light, in the LED chip.
  • the configuration is point-symmetric and line-symmetric in the power arrangement of the LED chips with different powers, in the refractive index or in the surface roughness.
  • the LED bulb 30g includes an LED filament 100 and is similar to the LED bulb of the previous embodiment.
  • the difference between the LED bulb 30g and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30g has a modified structure.
  • the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness. As shown in FIG.
  • the LED filament 100 is presented in a first quadrant and a second quadrant in a side view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip with respect to the Y-axis. It is line-symmetric in the power arrangement of LED chips with different powers, in refractive index or in surface roughness.
  • the LED filament 100 is presented in four quadrant portions in a top view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip, with different powers relative to the origin.
  • the power level of the LED chip is point-symmetric in terms of refractive index or surface roughness.
  • the LED bulb 30h includes an LED filament 100 and is similar to the LED bulb of the previous embodiment.
  • the difference between the LED bulb 30h and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30h has a modified structure.
  • the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness.
  • the LED filament 100 is presented in four quadrant portions in a side view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip, with different powers relative to the origin.
  • the power level of the LED chip is point-symmetric in terms of refractive index or surface roughness.
  • the LED filament 100 is presented in four quadrant portions in a top view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip, with different powers relative to the origin.
  • the power level of the LED chip is point-symmetric in terms of refractive index or surface roughness.
  • FIG. 43A-43C Figures 43A-43C are schematic, side and top views, respectively, of an LED bulb 30i, in accordance with one embodiment of the present invention.
  • the LED bulb 30i includes an LED filament 100 and is similar to the LED bulb of the previous embodiment.
  • the difference between the LED bulb 30i and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30i has a modified structure.
  • the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness. As shown in FIG.
  • the LED filament 100 is presented in four quadrant portions in a side view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip, with different powers relative to the origin.
  • the power level of the LED chip is point-symmetric in terms of refractive index or surface roughness.
  • FIG. 43C the LED filament 100 is presented in four quadrant portions in a top view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip, with different powers relative to the origin.
  • the power level of the LED chip is point-symmetric in terms of refractive index or surface roughness.
  • Figures 44A-44C are schematic, side and top views, respectively, of an LED bulb 30j in accordance with one embodiment of the present invention.
  • the LED bulb 30j includes an LED filament 100 and is similar to the LED bulb of the previous embodiment.
  • the difference between the LED bulb 30j and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30j has a modified structure.
  • the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness. As shown in FIG.
  • the LED filament 100 is presented in a first quadrant and a second quadrant in a side view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip with respect to the Y-axis. It is line-symmetric in the power arrangement of LED chips with different powers, in refractive index or in surface roughness.
  • the LED filament 100 is presented in four quadrant portions in a top view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip, with different powers relative to the origin.
  • the power level of the LED chip is point-symmetric in terms of refractive index or surface roughness.
  • FIGS. 45A to 45C are respectively a schematic, side and top views of an LED bulb 30k according to an embodiment of the present invention.
  • the LED bulb 30k includes an LED filament 100 and is similar to the LED bulb of the previous embodiment.
  • the difference between the LED bulb 30k and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30k has a modified structure.
  • the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness. As shown in FIG.
  • the LED filament 100 is presented in a first quadrant and a second quadrant in a side view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip with respect to the Y-axis. It is line-symmetric in the power arrangement of LED chips with different powers, in refractive index or in surface roughness.
  • the LED filament 100 is presented in four quadrant portions in a top view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip, with different powers relative to the origin.
  • the power level of the LED chip is point-symmetric in terms of refractive index or surface roughness.
  • FIGS. 46A to 46C are respectively a schematic, side and top views of an LED bulb 30l according to an embodiment of the present invention.
  • the LED bulb 30l includes an LED filament 100 and is similar to the LED bulb of the previous embodiment.
  • the difference between the LED bulb lamp 30l and the aforementioned LED bulb lamp is that the LED filament 100 of the LED bulb lamp 30l has a modified structure.
  • the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness. As shown in FIG.
  • the LED filament 100 is presented in a first quadrant and a second quadrant in a side view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip with respect to the Y-axis. It is substantially line-symmetric in the power arrangement of LED chips with different powers, in refractive index or in surface roughness.
  • the LED filament 100 is presented in four quadrant portions in a top view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip, with different powers relative to the origin.
  • the power level of the LED chip is point-symmetric in terms of refractive index or surface roughness.
  • FIG. 47A and FIG. 47B are respectively a schematic view and a top view of an LED bulb 30m according to an embodiment of the present invention.
  • the LED bulb 30m includes an LED filament 100 and is similar to the LED bulb of the previous embodiment.
  • the difference between the LED bulb 30m and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30m has a modified structure.
  • the LED filament 100 presents portions of different quadrants in a top view that may be line symmetrical in brightness. As shown in FIG.
  • the LED filament 100 is presented in a first quadrant and a second quadrant in a top view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip with respect to the Y axis. It is substantially line-symmetric in the power arrangement of LED chips with different powers, in refractive index or in surface roughness.
  • FIGS. 48A to 48C are respectively a schematic, side and top views of an LED bulb 30n according to an embodiment of the present invention.
  • the LED bulb 30n includes an LED filament 100 and is similar to the LED bulb of the previous embodiment.
  • the difference between the LED bulb 30n and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30n has a modified structure.
  • the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness. As shown in FIG.
  • the LED filament 100 is presented in a first quadrant and a second quadrant in a side view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip with respect to the Y-axis. It is substantially line-symmetric in the power arrangement of LED chips with different powers, in refractive index or in surface roughness.
  • the LED filament 100 is presented in four quadrant portions in a top view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip, with different powers relative to the origin.
  • the power level of the LED chip is point-symmetric in terms of refractive index or surface roughness.
  • FIG. 49A through 49C there are shown schematic, side and top views, respectively, of an LED bulb 30o in accordance with one embodiment of the present invention.
  • the LED bulb 30o includes an LED filament 100 and is similar to the LED bulb of the previous embodiment.
  • the difference between the LED bulb 30o and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30o has a modified structure.
  • the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness. As shown in FIG.
  • the LED filament 100 is presented in a first quadrant and a second quadrant in a side view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip with respect to the Y-axis. It is line-symmetric in the power arrangement of LED chips with different powers, in refractive index or in surface roughness.
  • the LED filament 100 is presented in four quadrant portions in a top view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip, with different powers relative to the origin.
  • the power level of the LED chip is point-symmetric in terms of refractive index or surface roughness.
  • FIG. 50A to FIG. 50C are respectively a schematic, side and top views of an LED bulb 30p according to an embodiment of the present invention.
  • the LED bulb 30p includes an LED filament 100 and is similar to the LED bulb of the previous embodiment.
  • the difference between the LED bulb 30p and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30p has a modified structure.
  • the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness. As shown in FIG.
  • the LED filament 100 is presented in a first quadrant and a second quadrant in a side view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip with respect to the Y axis. It is line-symmetric in the power arrangement of LED chips with different powers, in refractive index or in surface roughness.
  • the LED filament 100 is presented in four quadrant portions in a top view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip, with different powers relative to the origin.
  • the power level of the LED chip is point-symmetric in terms of refractive index or surface roughness.
  • FIGS. 51A to 51C are respectively a schematic, side and top views of an LED bulb 30q according to an embodiment of the present invention.
  • the LED bulb 30q includes an LED filament 100 and is similar to the LED bulb of the previous embodiment.
  • the difference between the LED bulb 30q and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30q has a modified structure.
  • the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness. As shown in FIG.
  • the LED filament 100 is presented in a first quadrant and a second quadrant in a side view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip with respect to the Y-axis. It is line-symmetric in the power arrangement of LED chips with different powers, in refractive index or in surface roughness.
  • the LED filament 100 is presented in four quadrant portions in a top view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip, with different powers relative to the origin.
  • the power level of the LED chip is point-symmetric in terms of refractive index or surface roughness.
  • FIG. 52A to 52D are respectively a schematic view, a side view (such as a front view), and another side view (such as a right side view) of an LED bulb 30r according to an embodiment of the present invention. Or left side view) with top view.
  • FIG. 52B is a front view
  • FIG. 52C is a right side view.
  • the plane projected by the right view is a plane perpendicular to the front view and the top view, respectively.
  • the LED bulb 30r includes an LED filament 100 and is similar to the LED bulb of the previous embodiment. The difference between the LED bulb 30r and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30r has a modified structure. When the LED filament 100 is in operation, the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness.
  • the LED filament 100 is presented in a first quadrant and a second quadrant in a side view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip with respect to the Y-axis. It is line-symmetric in the power arrangement of LED chips with different powers, in refractive index or in surface roughness.
  • the LED filament 100 is presented in a first quadrant and a second quadrant in another side view, which may be structurally, in length, in the light exiting direction relative to the Y axis, in the LED chip.
  • the configuration is line symmetrical on the power arrangement of the LED chips with different powers, on the refractive index or on the surface roughness.
  • the LED filament 100 is presented in four quadrant portions in a top view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip, with different powers relative to the origin.
  • the power level of the LED chip is point-symmetric in terms of refractive index or surface roughness.
  • the definition of the full perimeter light depends on the region in which the LED bulb is used and will vary over time. Depending on the organization and country, LED bulbs that claim to provide full-circumference light may need to meet different standards.
  • the light emitted should be at least 5% of the total luminous flux (lm), and 90% of the luminance measurements can be varied, but the difference from the average of the total luminance measurements on all planes is not Will exceed 25%.
  • Luminance (cd) is measured in increments (maximum) at a vertical angle of 5 degrees on each vertical plane, between 0 and 135 degrees.
  • the Japanese JEL801 specification requires that the LED lamp be within the range of 120 degrees of the optical axis, and its luminous flux should not be less than 70% of the total luminous flux of the bulb. Based on the arrangement of the LED filaments having symmetrical characteristics according to the previous embodiments, the LED bulbs with the LED filaments can conform to different standards of full-circumferential luminaires.
  • FIG. 53A is a schematic diagram of an LED bulb 40a according to an embodiment of the present invention
  • FIGS. 53B to 53D are respectively the LED bulb 40a of FIG. 53A.
  • Side view another side view with top view.
  • the LED bulb 40a includes a lamp housing 12, a lamp cap 16 that connects the lamp housing 12, a stem 19, and a single LED filament 100.
  • the LED strip lamp 40a and the single strip LED filament 100 disposed in the LED bulb 40a can refer to the LED bulbs, LED filaments and related descriptions of the previous embodiments, wherein the same or similar components and components The connection relationship between them is not described in detail.
  • the stem 19 is coupled to the cap 16 and located within the bulb housing 12.
  • the stem 19 has a post 19a extending perpendicularly to the center of the bulb 12, the stem 19a being located on the central axis of the cap 16, or standing 19a is located on the central axis of the LED bulb 40a.
  • the LED filament 100 is disposed around the upright 19a and located in the lamp housing 12, and the LED filament 100 can be connected to the upright 19a through a cantilever (refer to the previous embodiment and the drawings for detailed description of the cantilever) to maintain a preset curve and shape.
  • the LED filament 100 includes two electrodes 110, 112 at both ends, a plurality of LED segments 102, 104, and a plurality of conductor segments 130. As shown in FIGS.
  • each of the LED segments 102, 104 can include a plurality of LED chips connected to each other, and each conductor segment 130 can include a conductor. Each conductor segment 130 is located between adjacent two LED segments 102, 104.
  • each conductor segment 130 connects the LED chips in the adjacent two LED segments 102, 104 and are adjacent to the two electrical stages 110, 112.
  • the LED chips in the two LED segments are respectively connected to the two electrical stages 110, 112.
  • the stem 19 is permeable to the electrically conductive support (the detailed description of the electrically conductive support can be coupled to the two electrical stages 110, 112 with reference to the previous embodiment and the drawings).
  • the LED filament 100 has three conductor segments, wherein the first conductor segment 130 has two, the second conductor segment 130' has one, and the LED segments 102, 104 have Four, and between each two adjacent LED segments 102, 104 are bent through the first conductor segment 130 and the second conductor segment 130'.
  • the first conductor segment 130 and the second conductor segment 130' have a higher bendability than the LED segments 102, 104, the first conductor segment 130 between the adjacent two LED segments 102, 104
  • the second conductor segment 130' can be bent to a greater extent such that the angle between adjacent two LED segments 102, 104 can be relatively small, such as an angle of up to 45 degrees or less.
  • each of the LED segments 102, 104 is slightly curved or not bent compared to the first conductor segment 130 and the second conductor segment 130', so that a single LED filament 100 in the LED bulb 40a can be borrowed.
  • the first conductor segment 130 and the second conductor segment 130' are greatly bent and produce a significant bending change, and the LED filament 100 can be defined as a first conductor segment 130 and a second at each bend.
  • the conductor segments 130' are followed by a segment, and the respective LED segments 102, 104 form respective segments.
  • each of the first conductor segments 130 and the second conductor segments 130' and the adjacent two LED segments 102, 104 together form a U-shaped or V-shaped bend.
  • the folded structure, the U-shaped or V-shaped bent structure formed by each of the first conductor segments 130, the second conductor segments 130' and the adjacent two LED segments 102, 104 is bent into two segments.
  • the two LED segments 102, 104 are respectively the two segments.
  • the LED filament 100 is bent into four segments by the first conductor segment 130 and the second conductor segment 130', and the four LED segments 102, 104 are respectively the four segments. segment.
  • the number of LED segments 102, 104 is one more than the number of conductor segments.
  • the electrodes 110, 112 are located between the highest point and the lowest point of the LED filament 100 in the Z direction.
  • the highest point is at the highest conductor segment 130 in the Z direction and the lowest point is at the lowest conductor segment 130' in the Z direction.
  • the lower second conductor segment 130' represents its proximity to the lamp cap 16 relative to the electrodes 110, 112, while the higher first conductor segment 130 represents its distance from the lamp cap 16 relative to the electrodes 110, 112.
  • the electrodes 110, 112 can be connected in a straight line LA, with two higher first conductor segments 130 above the straight line LA and lower ones below the straight line LA. There is one second conductor segment 130'.
  • the number of first conductor segments 130 positioned above the line LA to which the electrodes 110, 112 are connected may be one more than the number of the second conductor segments 130' positioned below the line LA. It can also be said that, as a whole, the number of first conductor segments 130 that are remote from the base 16 relative to the electrodes 110, 112 is one more than the number of second conductor segments 130' that are adjacent the bases 16 with respect to the electrodes 110, 112.
  • the line LA connected by the electrodes 110, 112 has at least one intersection with the projection of the LED segments 102, 104.
  • the straight lines LA connected by the electrodes 110, 112 respectively intersect the projections of the two LED segments 104, so that the projection of the straight line LA and the adjacent two LED segments 104 coexist. Intersection.
  • the projections of the opposite LED segments 102, 104 are overlapped with each other.
  • the projections of the opposing two LED segments 102, 104 on a particular plane may be parallel to each other.
  • the projections of the electrodes 110, 112 on the XY plane can be connected in a straight line LB, and the first conductor segment 130
  • the projections of the second conductor segments 130' on the XY plane do not intersect or overlap the straight line LB, and the projections of the first conductor segments 130 and the second conductor segments 130' on the XY plane are located on one side of the straight line LB.
  • the projections of the first conductor segment 130 and the second conductor segment 130' on the XY plane are all located above the straight line LB.
  • the projection length of the LED filament 100 on three projection surfaces perpendicular to each other has a designed ratio to make the illumination more uniform.
  • the projection of the LED filament 100 on the first projection surface (such as the XY plane) has a length L1
  • the projection of the LED filament 100 on the second projection surface has a length L2
  • the LED filament 100 is in the The projection on the three projection planes (such as the XZ plane) has a length L3.
  • the first projection surface, the second projection surface and the third projection surface are perpendicular to each other, and the normal of the first projection surface is parallel to the axis of the LED bulb 40a from the center of the lamp housing 12 to the center of the lamp cap 16.
  • the projection of the LED filament 100 on the XY plane can be as shown in FIG. 53D, and the projection thereof will be similar to an inverted U shape, and the total length of the projection of the LED filament 100 on the XY plane is the length L1; the LED filament 100
  • the projection on the YZ plane can be as shown in FIG.
  • the projection thereof will be similar to the inverted W shape, and the total length of the projection of the LED filament 100 on the YZ plane is the length L2; the projection of the LED filament 100 on the XZ plane can be Referring to Fig. 53C, the projection thereof will be similar to an inverted V shape, and the total length of the projection of the LED filament 100 on the XZ plane is the length L3.
  • the length L1: the length L2: the length L3 is approximately equal to 1:1:0.9.
  • length L1: length L2: length L3 is approximately equal to 1:0.5 to 1:0.6 to 0.9.
  • the ratio of the length L1, the length L2, and the length L3 is closer to 1:1:1, the uniform illumination effect of the single LED filament 100 in the LED bulb 40a is uniform and the full-circumference effect is presented. The better.
  • the projected length of the LED filament 100 in the XZ plane or in the YZ plane is, for example but not limited to, the minimum of the height difference in the Z direction that approximates the first conductor segment 130 and the second conductor segment 130'.
  • the value of the number of LED segments 102, 104 or the minimum value of the height difference between the highest point and the lowest point of the LED filament in the Z direction is multiplied by the number of LED segments 102, 104.
  • the total length of the LED filament 100 is about 7 to 9 times the total length of the first conductor segment 130 or the second conductor segment 130'.
  • the LED filament 100 can be bent by the first conductor segment 130 and the second conductor segment 130' to form various curves, which not only can increase the overall aesthetic appearance of the LED bulb 40a, but also enable The LED bulb 40a emits light more evenly for better illumination.
  • FIG. 54A is a schematic diagram of an LED bulb 40b according to an embodiment of the present invention
  • FIGS. 54B to 54D are respectively the LED bulb 40b of FIG. 54A.
  • Side view another side view with top view.
  • the LED bulb 40b includes a lamp housing 12, a base 16 that connects the lamp housing 12, a stem 19, a stand 19a, and a single LED filament 100.
  • the LED filament 100 includes two electrodes 110, 112 at both ends, a plurality of LED segments 102, 104 and a plurality of first conductor segments 130, and a second conductor segment 130'.
  • the LED bulb 40b and the single LED filament 100 disposed in the LED bulb 40b can refer to the LED bulb, LED filament and related descriptions of the foregoing various embodiments, wherein the same or similar components and components The connection relationship between them is not described in detail.
  • the LED filament 100 has three first conductor segments 130, two second conductor segments 130', and six LED segments 102, 104, and two.
  • the adjacent LED segments 102, 104 are bent through the first conductor segment 130 and the second conductor segment 130'.
  • the single LED filament 100 in the LED bulb 40b can be greatly bent by the first conductor segment 130 and the second conductor segment 130', and produces a more significant bending change, and the LED filament 100 can be defined as After each of the bent first conductor segment 130 and the second conductor segment 130' is followed by a segment, each LED segment 102, 104 is formed into a respective segment.
  • the LED filament 100 is bent into six segments by three first conductor segments 130 and two second conductor segments 130', and the six LED segments 102, 104 are respectively Six segments are described.
  • the height of the three higher first conductor segments 130 in the Z direction is greater than the other two lower second conductor segments 130' in the Z direction.
  • the height of the four LED segments 102, 104 is between the higher first conductor segment 130 and the lower second conductor segment 130' in the Z direction, and the other two LED segments 102, 104 are in the Z direction.
  • the upper portion extends downward from the corresponding first conductor segment 130, and the height of the electrodes 110, 112 in the Z direction is less than the height of the first conductor segment 130 in the Z direction.
  • Fig. 54C in the present embodiment, if the LED filament 100 is projected on the XZ plane (refer to Fig.
  • the projections of the opposite LED segments 102, 104 are overlapped with each other.
  • FIG. 54D in the present embodiment, if the LED filament 100 is projected on the XY plane (refer to FIG. 54D), the projections of all the second conductor segments 130' on the XY plane are located at the electrodes 110, 112. One side of the straight line, and the projection of the first conductor segment 130 on the XY plane is dispersed on both sides of the line formed by the electrodes 110, 112.
  • FIG. 55A is a schematic diagram of an LED bulb 40c according to an embodiment of the present invention
  • FIGS. 55B to 55D are respectively the LED bulb 40c of FIG. 55A.
  • Side view another side view with top view.
  • the LED bulb 40c includes a lamp housing 12, a lamp cap 16 that connects the lamp housing 12, a stem 19, a stand 19a, and a single LED filament 100.
  • the LED filament 100 includes two electrodes 110, 112 at both ends, a plurality of LED segments 102, 104 and a plurality of first conductor segments 130, and a second conductor segment 130'.
  • the LED bulb 40c and the single LED filament 100 disposed in the LED bulb 40c can refer to the LED bulb, LED filament and related descriptions of the foregoing various embodiments, wherein the same or similar components and components The connection relationship between them is not described in detail.
  • the LED filament 100 has three first conductor segments 130, two second conductor segments 130', and eight LED segments 102, 104, and two.
  • the adjacent LED segments 102, 104 are bent through the first conductor segment 130 and the second conductor segment 130'.
  • the single LED filament 100 in the LED bulb 40c can be bent substantially by the first conductor segment 130 and the second conductor segment 130', and produces a more significant bending change, and the LED filament 100 can be defined as After each of the bent first conductor segment 130 and the second conductor segment 130' is followed by a segment, each LED segment 102, 104 is formed into a respective segment.
  • the LED filament 100 is bent into eight segments by three first conductor segments 130 and four second conductor segments 130', and the eight LED segments 102, 104 are respectively Eight segments are described.
  • the height of the three higher first conductor segments 130 in the Z direction is greater than the other four lower second conductor segments 130' in the Z direction.
  • the height of the six LED segments 102, 104 is between the higher first conductor segment 130 and the lower second conductor segment 130' in the Z direction, and the other two LED segments 102, 104 are in the Z direction.
  • the upper portion extends upward from the corresponding second conductor segment 130', and the height of the electrodes 110, 112 in the Z direction is about the same as the height of the higher first conductor segment 130 in the Z direction.
  • the LED filament 100 is projected on the YZ plane (refer to Fig. 55B) or the XZ plane (refer to Fig. 55C)
  • the projection of the opposite LED segments 102, 104 is Overlapping each other.
  • FIG. 55D in the present embodiment, if the LED filament 100 is projected on the XY plane (refer to FIG. 55D), the projections of the first conductor segment 130 and the second conductor segment 130' on the XY plane are all located at the electrode 110, One of the straight lines of 112 connected.
  • FIG. 56A is a schematic diagram of an LED bulb 40d according to an embodiment of the present invention
  • FIGS. 56B to 56D are respectively the LED bulb 40d of FIG. 56A.
  • Side view another side view with top view.
  • the LED bulb 40d includes a lamp housing 12, a lamp cap 16 that connects the lamp housing 12, a stem 19, a stand 19a, and a single LED filament 100.
  • the LED filament 100 includes two electrodes 110, 112 at both ends, a plurality of LED segments 102, 104 and a plurality of first conductor segments 130, and a second conductor segment 130'.
  • the LED bulb 40d and the single LED filament 100 disposed in the LED bulb 40d can refer to the LED bulb, LED filament and related descriptions of the foregoing various embodiments, wherein the same or similar components and components The connection relationship between them is not described in detail.
  • the LED filament 100 has two first conductor segments 130, one second conductor segment 130', and four LED segments 102, 104, and two each.
  • the adjacent LED segments 102, 104 are bent through the first conductor segment 130 and the second conductor segment 130'.
  • the single LED filament 100 in the LED bulb 40d can be greatly bent by the first conductor segment 130 and the second conductor segment 130', and produces a more significant bending change, and the LED filament 100 can be defined as After each of the bent first conductor segment 130 and the second conductor segment 130' is followed by a segment, each LED segment 102, 104 is formed into a respective segment.
  • the LED filament 100 is bent into four segments by two first conductor segments 130 and one second conductor segment 130', wherein the four LED segments 102, 104 are respectively Four segments.
  • the height of the two higher first conductor segments 130 in the Z direction is greater than the height of the other lower second conductor segment 130' in the Z direction.
  • Height, and the two LED segments 102, 104 are located between the higher first conductor segment 130 and the lower second conductor segment 130' in the Z direction, and the other two LED segments 102, 104 are in the Z direction.
  • Extending downward from the corresponding first conductor segment 130, and the height of the electrodes 110, 112 in the Z direction is lower than the height of the second conductor segment 130' in the Z direction.
  • Fig. 56C in the present embodiment, if the LED filament 100 is projected on the XZ plane (refer to Fig.
  • the projections of the opposite LED segments 102, 104 overlap each other.
  • the projections of the first conductor segment 130 and the second conductor segment 130' on the XY plane are all located at the electrode 110, One of the straight lines of 112 connected.
  • the first conductor segment 130 and the second conductor segment 130' of the LED filament 100 of the LED bulb 40d of FIGS. 56A-56D are in the Z direction.
  • the height difference between the first conductor segment 130 and the second conductor segment 130' is relatively gentle, so that the LED filament 100 as a whole has a gentle undulation curve.
  • FIG. 57A is a schematic diagram of an LED bulb 40e according to an embodiment of the present invention
  • FIGS. 57B to 57D are respectively the LED bulb 40e of FIG. 57A.
  • Side view another side view with top view.
  • the LED bulb 40e includes a lamp housing 12, a lamp cap 16 that connects the lamp housing 12, a stem 19, a stand 19a, and a single LED filament 100.
  • the LED filament 100 includes two electrodes 110, 112 at both ends, a plurality of LED segments 102, 104 and a plurality of first conductor segments 130, and second conductor segments.
  • the LED bulb 40e and the single LED filament 100 disposed in the LED bulb 40e can refer to the LED bulb, LED filament and related descriptions of the foregoing various embodiments, wherein the same or similar components and components The connection relationship between them is not described in detail.
  • the LED filament 100 has three first conductor segments 130, two second conductor segments 130', and six LED segments 102, 104, and two.
  • the adjacent LED segments 102, 104 are bent through the first conductor segment 130 and the second conductor segment 130'.
  • the single LED filament 100 in the LED bulb 40e can be bent substantially by the first conductor segment 130 and the second conductor segment 130', and produces a more significant bending change, and the LED filament 100 can be defined as After each of the bent first conductor segment 130 and the second conductor segment 130' is followed by a segment, each LED segment 102, 104 is formed into a respective segment.
  • the LED filament 100 is bent into six segments by three first conductor segments 130 and two second conductor segments 130', and the six LED segments 102, 104 are respectively Six segments are described.
  • the height of the three higher first conductor segments 130 in the Z direction is greater than the other two lower second conductor segments 130' in the Z direction.
  • the height of the four LED segments 102, 104 is between the higher first conductor segment 130 and the lower second conductor segment 130' in the Z direction, and the other two LED segments 102, 104 are in the Z direction.
  • the upper portion extends downward from the corresponding first conductor segment 130, and the height of the electrodes 110, 112 in the Z direction is lower than the height of the first conductor segment 130 in the Z direction.
  • Fig. 57C in the present embodiment, if the LED filament 100 is projected on the XZ plane (refer to Fig.
  • the projections of the opposite LED segments 102, 104 overlap each other.
  • the projection of the second conductor segment 130' on the XY plane is located on the line formed by the electrodes 110, 112. One of the sides.
  • the first conductor segment 130 and the second conductor segment 130' of the LED filament 100 of the LED bulb 40e of FIGS. 57A to 57D are in the Z direction.
  • the height difference between the first conductor segment 130 and the second conductor segment 130' is relatively gentle, so that the LED filament 100 as a whole has a gentle undulation curve.
  • FIG. 58A is a schematic diagram of an LED bulb 40f according to an embodiment of the present invention
  • FIGS. 58B to 58D are respectively LED bulb 40f of FIG. 58A.
  • Side view another side view with top view.
  • the LED bulb 40f includes a lamp housing 12, a lamp cap 16 that connects the lamp housing 12, a stem 19, a stand 19a, and a single LED filament 100.
  • the LED filament 100 includes two electrodes 110, 112 at both ends, a plurality of LED segments 102, 104 and a plurality of first conductor segments 130, and a second conductor segment 130'.
  • the LED bulb 40f and the single LED filament 100 disposed in the LED bulb 40f can refer to the LED bulb, LED filament and related descriptions of the foregoing various embodiments, wherein the same or similar components and components The connection relationship between them is not described in detail.
  • the LED filament 100 has three first conductor segments 130, the second conductor segment 130' has four, and the LED segments 102, 104 have eight, and each two.
  • the adjacent LED segments 102, 104 are bent through the first conductor segment 130 and the second conductor segment 130'.
  • the single LED filament 100 in the LED bulb 40f can be greatly bent by the first conductor segment 130 and the second conductor segment 130', and produces a more significant bending change, and the LED filament 100 can be defined as After each of the bent first conductor segment 130 and the second conductor segment 130' is followed by a segment, each LED segment 102, 104 is formed into a respective segment.
  • the LED filament 100 is bent into eight segments by three first conductor segments 130 and four second conductor segments 130', and the eight LED segments 102, 104 are respectively Eight segments are described.
  • the height of the three higher first conductor segments 130 in the Z direction is greater than the other four lower second conductor segments 130' in the Z direction.
  • the height of the six LED segments 102, 104 is between the higher first conductor segment 130 and the lower second conductor segment 130' in the Z direction, and the other two LED segments 102, 104 are in the Z direction.
  • the upper portion extends upward from the corresponding second conductor segment 130', and the height of the electrodes 110, 112 in the Z direction is approximately equal to the height of the higher second conductor segment 130 in the Z direction.
  • the LED filament 100 is projected on the YZ plane (refer to Fig. 58B) or the XZ plane (refer to Fig. 58C), the projection of the opposite LED segments 102, 104 is Overlapping each other.
  • FIG. 58D in the present embodiment, if the LED filament 100 is projected on the XY plane (refer to FIG. 58D), the projections of the first conductor segment 130 and the second conductor segment 130' on the XY plane are all located at the electrode 110, One of the straight lines of 112 connected.
  • the first conductor segment 130 and the second conductor segment 130' of the LED filament 100 of the LED bulb 40f of FIGS. 58A to 58D are in the Z direction.
  • the height difference between the first conductor segment 130 and the second conductor segment 130' is relatively gentle, so that the LED filament 100 as a whole has a gentle undulation curve.
  • FIG. 59A is a schematic diagram of an LED bulb 40g according to an embodiment of the present invention
  • FIGS. 59B to 59D are respectively the LED bulb 40g of FIG. 59A.
  • Side view another side view with top view.
  • the LED bulb 40g includes a lamp housing 12, a lamp cap 16 that connects the lamp housing 12, a stem 19, a stand 19a, and a single LED filament 100.
  • the LED filament 100 includes two electrodes 110, 112 at both ends, a plurality of LED segments 102, 104 and a plurality of first conductor segments 130, and a second conductor segment 130'.
  • the LED bulb 40g and the single LED filament 100 disposed in the LED bulb 40g can refer to the LED bulb, LED filament and related descriptions of the foregoing various embodiments, wherein the same or similar components and components The connection relationship between them is not described in detail.
  • the LED filament 100 has two first conductor segments 130, one second conductor segment 130', and four LED segments 102, 104, and two.
  • the adjacent LED segments 102, 104 are bent through the first conductor segment 130 and the second conductor segment 130'.
  • the single LED filament 100 in the LED bulb 40g can be bent substantially by the first conductor segment 130 and the second conductor segment 130', and produces a more significant bending change, and the LED filament 100 can be defined as After each of the bent first conductor segment 130 and the second conductor segment 130' is followed by a segment, each LED segment 102, 104 is formed into a respective segment.
  • the LED filament 100 is bent into four segments by two first conductor segments 130 and one second conductor segment 130', wherein the four LED segments 102, 104 are respectively Four segments.
  • the height of the two higher first conductor segments 130 in the Z direction is greater than the height of the other lower second conductor segment 130' in the Z direction.
  • Height, and the two LED segments 104 are located between the upper first conductor segment 130 and the lower second conductor segment 130' in the Z direction, and the other two LED segments 102, 104 are corresponding in the Z direction.
  • the first conductor segment 130 extends downwardly and the height of the electrodes 110, 112 in the Z direction is lower than the height of the second conductor segment 130' in the Z direction.
  • the LED filament 100 extends around an axial direction like a spiral.
  • the portion of the spiral-like intermediate coil of the LED filament 100 i.e., the portion around which the two LED segments 102, 104 are formed
  • the spiral of the LED filament 100 is spiral.
  • the portion of the outer ring i.e., the portion of the other two LED segments 102, 104 that extends outwardly
  • the contour of the LED filament in the YZ plane may form a love-like shape
  • the two first conductor segments 130 are The distance in the Y direction is smaller than the distance between the two electrodes 110, 112.
  • the distance of the first conductor segment 130 in the Y direction may be greater than or equal to the distance between the two electrodes 110, 112.
  • the LED filament 100 has an S-shape in the outline of the XZ plane. If the LED filament 100 continues to extend in a spiral shape along its axial direction, the outline of the LED filament 100 in the XZ plane may have a plurality of overlapping S-shapes. As shown in Fig. 59D, in the present embodiment, the outline of the LED filament 100 in the XY plane also has an S shape.
  • the profile of the LED filament 100 in the XY plane may have a plurality of overlapping S-shapes.
  • the first conductor segment 130 and the second conductor segment 130' are located between the electrodes 110, 112.
  • FIG. 60A is a schematic diagram of an LED bulb 40h according to an embodiment of the present invention
  • FIG. 60B to FIG. 60D are respectively the LED bulb 40h of FIG. 60A.
  • Side view another side view with top view.
  • the LED bulb 40h includes a lamp housing 12, a lamp cap 16 that connects the lamp housing 12, a stem 19, a stand 19a, and a single LED filament 100.
  • the LED filament 100 includes two electrodes 110, 112, two LED segments 102 and a single conductor segment 130 at both ends.
  • the LED bulb 40h and the single LED filament 100 disposed in the LED bulb 40h can refer to the LED bulb, LED filament and related descriptions of the foregoing various embodiments, wherein the same or similar components and components The connection relationship between them is not described in detail.
  • the LED filament 100 has one conductor segment 130, and the LED segments 102, 104 have two, and each two adjacent LED segments 102, 104 are transparent.
  • the conductor segments 130 are connected, and the LED filament 100 exhibits a circular arc bending at the highest point of the bending, that is, the LED segments 102 and 104 respectively exhibit a circular arc at the highest point of the LED filament 100, and the conductor segments are at the low point of the LED filament. It also exhibits a curved arc.
  • the LED filament 100 can be defined as a segment following each bent conductor segment 130, and each LED segment 102, 104 forms a corresponding segment.
  • the LED filament 100 uses a flexible base layer, and the flexible base layer preferably employs a silicone-modified polyimide resin composition, the LED segments 102, 104 themselves also have a certain degree of bending ability.
  • the two LED segments 102 are respectively bent to form an inverted U shape, and the conductor segments 130 are located between the two LED segments 102, and the degree of bending of the conductor segments 130 is the same as or greater than that of the LED segments 102. The degree of bending.
  • the two LED segments 102 are respectively bent at the high point of the filament to form an inverted U shape and have a bending radius R1 value
  • the conductor segment 130 is bent at a low point of the filament LED filament 100 and has a bending radius R2 value. Where R1 is greater than the R2 value.
  • the LED filament 100 can be bent in a limited space to achieve a small radius of gyration.
  • the LED segments 102 and the bend points of the LED segments 104 are at the same height in the Z direction.
  • the stand 19a of the present embodiment has a lower height than the stand 19a of the previous embodiment, and the height of the stand 19a corresponds to the height of the conductor segment 130.
  • the lowest portion of the conductor segment 130 can be attached to the top of the riser 19a such that the overall shape of the LED filament 100 is not easily deformed.
  • the conductor segments 130 may be connected to each other through perforations in the top of the riser 19a, or the conductor segments 130 may be glued to the top of the stand 19a to be connected to each other, but are not limited thereto.
  • the conductor segments 130 and the uprights 19a may be connected by a guide wire, such as a guide wire connecting conductor segment 130 at the top of the uprights 19a.
  • the height of the conductor segment 130 is higher than the two electrodes 110, 112, and the two LED segments 102 are respectively extended upward from the two electrodes 110, 112 to the highest point.
  • the bend further extends down to the conductor segments 130 connecting the two LED segments 102.
  • the outline of the LED filament 100 in the XZ plane is similar to a V shape, that is, the two LED segments 102 are obliquely extended upward and outward, respectively, and are bent at the highest point, and then respectively
  • the conductor segment 130 extends obliquely downward inwardly. As shown in Fig.
  • the LED filament 100 has an S shape in the outline of the XY plane.
  • the conductor segments 130 are located between the electrodes 110, 112.
  • the bending point of the LED segment 102, the bending point of the LED segment 104, and the electrodes 110, 112 are located substantially on the circumference centered on the conductor segment 130.
  • FIG. 61 is a schematic diagram showing the light emission spectrum of an LED bulb according to an embodiment of the present invention.
  • the LED bulb can be any of the LED bulbs disclosed in the previous embodiments, and any one of the LEDs disclosed in the previous embodiments is disposed in the LED bulb. filament.
  • the spectrum emitted by the LED bulb is measured by a spectrometer to obtain a spectrum diagram as shown in FIG.
  • the spectrum of the LED bulb is mainly distributed between wavelengths of 400 nm and 800 nm, and three peaks P1, P2, and P3 appear in three places in this range.
  • the peak P1 is between about 430 nm and 480 nm, the peak P2 is between about 580 nm and 620 nm, and the peak P3 is between about 680 nm and 750 nm.
  • the intensity of the peak P1 is less than the intensity of the peak P2
  • the intensity of the peak P2 is less than the intensity of the peak P3.
  • a spectral distribution is close to the spectral distribution of a conventional incandescent filament lamp and also close to the spectral distribution of natural light.
  • a schematic diagram of the light emission spectrum of a single LED filament is shown in FIG. 62.
  • the spectrum of the LED bulb is mainly distributed between wavelengths of 400 nm and 800 nm, and in this range.
  • the peak P1 is between about 430 nm and 480 nm
  • the peak P2 is between about 480 nm and 530 nm
  • the peak P3 is between about 630 nm and 680 nm.
  • Such a spectral distribution is close to the spectral distribution of a conventional incandescent filament lamp and also close to the spectral distribution of natural light.
  • one LED filament and "one LED filament” as used in the present invention means that the aforementioned conductor segments and LED segments are connected in common, and have the same and continuous light conversion layer (including the same and continuously formed top layer or The bottom layer), and only two conductive electrodes electrically connected to the bulb conductive support are disposed at both ends, which is a single LED filament structure as claimed in the present invention.
  • the LED filament 100 can have a plurality of LED segments, the LED chips in the same LED segment are connected in series, and the different LED segments are connected in parallel, wherein the anode of each LED segment can serve as the anode of the LED filament.
  • the cathode of each LED segment can be connected as two or more conductive supports (as shown in FIGS. 26A51a, 51b) as the negative pole of the LED filament, and electrically connected to the power module (such as 518) through the conductive bracket.
  • FIG. 63A is a schematic diagram of an LED filament circuit according to an embodiment of the present invention.
  • the LED filament 100 has two LED segments 402 and 404, wherein each segment of the LED segments 402/404 can include one or more.
  • the LED chips, the LED chips in the same LED segment 402/404 are connected in series, and the LED segments 402 and the LED segments 404 have independent current paths (ie, split-flow connection) after being electrically connected to each other.
  • the LED segment 402 of the present embodiment and the anode of the LED segment 404 are connected together and serve as the positive pole P1 of the LED filament 100, the cathode of the LED segment 402 as the first negative pole N1 of the LED filament 100, and the LED segment 402 The cathode serves as the second negative electrode N2 of the LED filament 100.
  • the positive electrode P1 of the LED filament 100, the first negative electrode N1 and the second negative electrode N2 are electrically connected to the power module through a conductive bracket, for example, the conductive brackets 51a, 51b and the power module 518 as shown in FIG. 26A.
  • the electrical connection relationship between the positive electrode P1, the first negative electrode N1, and the second negative electrode N2 of the LED filament 100 and the power module can be as shown in FIG. 63B or FIG. 63C, wherein FIG. 63B and FIG. 63C are Schematic diagram of the electrical connection relationship of the LED filaments of different embodiments of the present invention.
  • the positive pole P1 of the LED filament 100 is electrically connected to the first output end (or positive output end) of the power module 518, and the first negative pole N1 and the second of the LED filament 100 are The negative poles N2 are electrically connected/short-circuited together and electrically connected to the second output end (or negative output end) of the power module 518.
  • the LED segments 402 and 404 can be considered to be connected in parallel with the output of the power module 518, so the LED segments 402 and 404 are both subjected to the first output and the first The driving voltage V1 between the two outputs is driven.
  • the drive current provided by power module 518 is evenly shunted to each of LED segments 402 and 404, thus causing LED segments 402 and 404 to be rendered.
  • the anode P1 of the LED filament 100 is electrically connected to the first output end (or the positive output end) of the power module 518, and the first cathode N1 of the LED filament 100 is electrically connected to The second output terminal (or the first negative output terminal) of the power module 518 is electrically coupled to the third output terminal (or the second negative output terminal) of the power module 518.
  • a driving voltage V1 output is formed between the first output end and the second output end of the power module 518, and another driving voltage V2 output is formed between the first output end and the third output end of the power module 518.
  • the LED segment 402 is electrically connected between the first output end and the second output end, and the LED segment 404 is electrically connected to the first output end and Between the third outputs, LED segments 402 and 404 can therefore be considered to be driven by drive voltages V1 and V2, respectively.
  • the drive current provided by the power module 518 to the LED segments 402/404 can be independently controlled by the magnitude of the drive voltages V1 and V2 of the modulated output, thereby allowing the LED segments 402 and 404 to have corresponding brightness and/or respectively. Or color temperature.
  • the function of segment dimming can be realized on a single LED filament.
  • the second output and the third output of the power module 518 can be connected together by a resistor, and one of the second output and the third output is electrically connected/short-circuited to the ground. With this configuration, negative outputs having different levels can be constructed, thereby generating drive voltages V1 and V2 having different levels.
  • the second output terminal and the third output terminal may also be controlled by circuits, respectively, and the present invention is not limited to the above embodiments.
  • FIG. 64A is a schematic diagram of a LED filament circuit according to an embodiment of the present invention.
  • the LED filament 100 is similar to the foregoing FIG. 63A, and has two LED segments 402 and 404.
  • the arrangement of the LED segments 402 and 404 is not Repeat it again.
  • the main difference between this embodiment and the foregoing embodiment of Fig. 63A is that the LED segments 402 and 404 of the present embodiment are connected/short-circuited together as the negative electrode N1 of the LED filament 100, and the anodes of the LED segments 402 and 404 are respectively The first positive electrode P1 and the second positive electrode P2 of the LED filament 100.
  • the first positive electrode P1, the second positive electrode P2, and the negative electrode N1 of the LED filament 100 are electrically connected to the power module through a conductive bracket, for example, the conductive brackets 51a, 51b and the power module 518 as shown in FIG. 26A.
  • the electrical connection relationship between the first positive electrode P1, the second positive electrode P2, and the negative electrode N1 of the LED filament 100 and the power module can be as shown in FIG. 64B or FIG. 64C, wherein FIG. 64B and FIG. 64C are different embodiments of the present invention.
  • the LED segments 402 and 404 can be considered to be connected in parallel with the output of the power module 518, so the LED segments 402 and 404 are both subjected to the first output and the first The driving voltage V1 between the two outputs is driven.
  • the drive current provided by power module 518 is evenly shunted to each of LED segments 402 and 404, thus causing LED segments 402 and 404 to be rendered.
  • This configuration can be equivalent to the configuration of the aforementioned embodiment of Fig. 63B.
  • the first positive pole P1 of the LED filament 100 is electrically connected to the first output end (or the first positive output end) of the power module 518, and the second positive pole P2 of the LED filament 100 is connected.
  • the second output end (or the second positive output end) of the power module 518 is electrically connected to the third output end (or the negative output end) of the power module 518.
  • a driving voltage V1 output is formed between the first output terminal and the third output terminal of the power module 518
  • another driving voltage V2 output is formed between the second output terminal and the third output terminal of the power module 518.
  • the LED segment 402 is electrically connected between the first output terminal and the third output terminal, and the LED segment 404 is electrically connected to the second output terminal and Between the third outputs, LED segments 402 and 404 can therefore be considered to be driven by drive voltages V1 and V2, respectively.
  • the drive current provided by the power module 518 to the LED segments 402/404 can be independently controlled by the magnitude of the drive voltages V1 and V2 of the modulated output, thereby allowing the LED segments 402 and 404 to have corresponding brightness and/or respectively. Or color temperature.
  • the function of the segment dimming can be realized on a single LED filament by the design and control of the power module 518.
  • the LED filament 100 has three segments of LED segments 402, 404, 406, as shown in FIG. 65A. More specifically, the LED filament 100 of the present embodiment is configured by adding an LED segment 406 to the foregoing FIG. 63A (which can also be said to be based on FIG. 64A plus the LED segment 404 of FIG. 65A, wherein The LED segment 406 of FIG. 65A corresponds to the LED segment 404) of FIG. 64A.
  • the configuration of the LED segments 402 and 404 can be described with reference to the above embodiments, and details are not described herein again.
  • the LED segments 406 are configured similarly/identical to the LED segments 402 and 404, which may include one or more LED chips that are connected in series, and the LED segments 402, 404, and 406 are electrically connected to each other. After the connection, there will be independent current paths between each other (ie, the split mode connection). More specifically, the cathode of the LED segment 406 is electrically/short-circuited with the cathode of the LED segment 402 (ie, the cathodes of the LED segments 402 and 406 collectively serve as the first negative electrode N1), and the anode of the LED segment 406 acts as the LED filament.
  • the second positive electrode P2 of 100 In other words, in the LED filament 100 of the present embodiment, in addition to the first positive electrode P1, the first negative electrode N1, and the second negative electrode N2, a second positive electrode P2 electrically connected to the anode of the LED segment 406 is further included.
  • the electrical connection relationship between the LED filament 100 and the power module 518 may have a type as shown in FIGS. 65B to 44D, thereby implementing current sharing driving control or centring. Segment independent control, wherein FIGS. 65B to 65D are schematic diagrams showing electrical connection relationships of LED filaments according to different embodiments of the present invention. Referring to FIG. 65B to 44D, thereby implementing current sharing driving control or centring. Segment independent control, wherein FIGS. 65B to 65D are schematic diagrams showing electrical connection relationships of LED filaments according to different embodiments of the present invention. Referring to FIG.
  • the first positive electrode P1 and the second positive electrode P2 of the LED filament 100 are electrically connected/short-circuited together, and are electrically connected to the first output end of the power module 518 (or The first negative electrode N1 and the second negative electrode N2 of the LED filament 100 are electrically connected/short-circuited together, and are electrically connected to the second output terminal (or negative output terminal) of the power module 518.
  • the LED segments 402, 404, and 406 can be considered to be parallel to the output of the power module 518, so the LED segments 402, 404, and 406 are both first.
  • the driving voltage V1 between the output terminal and the second output terminal is driven.
  • the driving current provided by the power module 518 is evenly shunted to the LED segments 402, 404, and 406, thus causing the LED segments. 402, 404, and 406 exhibit substantially uniform brightness and/or color temperature.
  • This configuration can be equivalent to the configuration of the aforementioned embodiment of Figs. 63B, 43B.
  • the first positive electrode P1 and the second positive electrode P2 of the LED filament 100 are electrically connected/short-circuited together, and are electrically connected to the first output end of the power module 518 (or The first negative pole N1 of the LED filament 100 is electrically connected to the second output end of the power module 518 (or the first negative output terminal), and the second negative pole N2 of the LED filament 100 is electrically connected to the power source.
  • the overall line connection relationship can be equivalent to the configuration of FIG. 63C, and the related control manners, functions, and effects can be referred to the description of FIG. 63C.
  • the configuration of this embodiment can make one filament have two effects of dimming.
  • the first positive pole P1 of the LED filament 100 is electrically connected to the first output end (or the first positive output end) of the power module 518
  • the second positive pole P2 is electrically connected to
  • the second output end (or the second positive output end) of the power module 518 is electrically connected to the third output end (or the first negative output end) of the power module 518
  • the second negative pole N2 is electrically connected.
  • the fourth output (or second negative output) of the power module 518 is connected to the power module 518.
  • a driving voltage V1 output is formed between the first output end and the third output end of the power module 518
  • another driving voltage V2 is formed between the first output end and the fourth output end of the power module 518.
  • the drive current supplied by the power module 518 to the LED segments 402 to 406 can be independently controlled by the magnitude of the drive voltages V1, V2, and V3 of the modulated output, thereby enabling the LED segments 402, 404, and 406 to have corresponding Brightness and / or color temperature.
  • the configuration of this embodiment can make a filament have a three-stage dimming effect.
  • Figure 66A is a schematic diagram of an LED filament circuit in accordance with one embodiment of the present invention.
  • the LED filament 100 has four segments of LED segments 402, 404, 406, 408, as shown in Figure 66A. More specifically, the LED filament 100 of the present embodiment is configured by adding an LED segment 408 to the foregoing FIG. 65A, wherein the configuration of the LED segments 402, 404, and 406 can be described with reference to the above embodiments. The details are not repeated.
  • the LED segments 408 are configured similarly/identical to the LED segments 402, 404, and 406, which may include one or more LED chips that are connected in series, and the LED segments 402, 404, 406 and 408 will have independent current paths between each other after being electrically connected to each other (ie, a split-flow connection). More specifically, the cathode of the LED segment 408 is electrically/synchronized with the cathode of the LED segment 404 (ie, the cathodes of the LED segments 402 and 406 collectively serve as the second negative electrode N2), and the anode of the LED segment 408 acts as the LED filament.
  • the third positive electrode P3 of 100 is electrically/synchronized with the cathode of the LED segment 404 (ie, the cathodes of the LED segments 402 and 406 collectively serve as the second negative electrode N2), and the anode of the LED segment 408 acts as the LED filament.
  • the third positive electrode P3 of 100 is electrically/synchronized with the cathode of the
  • a third electrode electrically connected to the anode of the LED segment 408 is further included.
  • the electrical connection relationship between the LED filament 100 and the power module 518 may have the type shown in FIGS. 66B to 66E, thereby realizing the current sharing driving control or dividing. Segment independent control, wherein FIG. 66B to FIG. 66E are schematic diagrams showing electrical connection relationships of LED filaments according to different embodiments of the present invention.
  • the first positive electrode P1, the second positive electrode P2, and the third positive electrode P3 of the LED filament 100 are electrically connected/short-circuited together, and are electrically connected to the power module 518.
  • An output terminal (or a positive output terminal); the first negative electrode N1 and the second negative electrode N2 of the LED filament 100 are electrically connected/short-circuited together, and are electrically connected to the second output end of the power module 518 (or Negative output)).
  • the LED segments 402, 404, 406 and 408 can be regarded as being parallel to the output of the power module 518, so the LED segments 402, 404, 406 and 408 are both It is driven by the driving voltage V1 between the first output terminal and the second output terminal.
  • the driving current provided by the power module 518 is evenly shunted to the LED segments 402, 404, 406, and 408,
  • the LED segments 402, 404, 406, and 408 will be rendered substantially uniform in brightness and/or color temperature.
  • This configuration can be equivalent to the configuration of the aforementioned embodiment of Figs. 63B, 43B, 44B.
  • the first positive electrode P1, the second positive electrode P2, and the third positive electrode P3 of the LED filament 100 are electrically connected/short-circuited together, and are electrically connected to the power module 518.
  • An output terminal (or positive output terminal), the first negative electrode N1 of the LED filament 100 is electrically connected to the second output end of the power module 518 (or the first negative output terminal), and the second negative pole N2 of the LED filament 100
  • the third output (or second negative output) of the power module 518 is electrically connected.
  • Figure 63C is a description. The configuration of this embodiment can make one filament have two effects of dimming.
  • the first positive electrode P1 and the second positive electrode of the LED filament 100 are electrically connected/short-circuited together, and are electrically connected to the first output end of the power module 518 (or
  • the first positive output terminal 3 is electrically connected to the second output end of the power module 518 (or the second positive output end)
  • the first negative electrode N1 is electrically connected to the third output end of the power module 518 (
  • the second negative terminal N2 is electrically connected to the fourth output terminal (or the second negative output terminal) of the power module 518.
  • the configuration of this embodiment can make one filament have two effects of dimming.
  • the configuration of this embodiment can make a filament have a three-stage dimming effect.
  • the first positive pole P1 of the LED filament 100 is electrically connected to the first output end (or the first positive output end) of the power module 518
  • the second positive pole P2 is electrically connected to
  • the second output terminal (or the second positive output terminal) of the power module 518 is electrically connected to the third output terminal (or the third positive output terminal) of the power module 518, and the first anode N1 is electrically connected.
  • the fourth output terminal (or the first negative output terminal) of the power module 518 is electrically connected to the fifth output terminal (or the second negative output terminal) of the power module 518.
  • a driving voltage V1 is formed between the first output terminal and the fourth output terminal of the power module 518
  • another driving voltage V2 is formed between the first output terminal and the fifth output terminal of the power module 518.
  • the output, the second output end and the fourth output end of the power module 518 form another driving voltage V3 output
  • another driving voltage V4 output is formed between the third output end and the fifth output end of the power module 518.
  • the LED segment 402 is electrically connected between the first output end and the fourth output end, and the LED segment 404 is electrically connected to the first output end and the first Between the five output terminals, the LED segment 406 is electrically connected between the second output end and the fourth output end, and the LED segment 408 is electrically connected between the third output end and the fifth output end, so the LED segment 402, 404, 406, and 408 can be considered to be driven by drive voltages V1, V2, V3, and V4, respectively.
  • the drive current provided by the power module 518 to the LED segments 402-408 can be independently controlled by modulating the output drive voltages V1, V2, V3, and V4, thereby enabling the LED segments 402, 404, 406, and 408.
  • the configuration of this embodiment can make a filament have a four-stage dimming effect.
  • the driving circuit 518 is for converting the received AC power source, and accordingly generating a power/driving power source to illuminate the light emitting portion 100.
  • the "power module 5200” represents the drive circuit 518.
  • FIG. 67 is a circuit block diagram of a power module of an LED bulb according to an embodiment of the invention.
  • the power module 5200 includes a rectifier circuit 5210, a filter circuit 5220, and a drive circuit 5230.
  • the rectifier circuit 5210 is coupled to the first pin 5201 and the second pin 5202 to receive the external driving signal Pin, and rectifies the external driving signal, and then is rectified by the first rectifying output terminal 5211 and the second rectifying output terminal 5212. After the signal Srec.
  • the external drive signal here can be an AC drive signal or an AC power signal (such as a grid signal) or even a DC signal without affecting the operation of the LED bulb.
  • the rectifier circuit 5210 in the power module 5200 can be omitted.
  • the first pin 5201 and the second pin 5202 are directly coupled to the input ends of the filter circuit 5220 (ie, 5211, 5212).
  • the filter circuit 5220 is coupled to the rectifier circuit 5210 for filtering the rectified signal Srec; that is, the input end of the filter circuit 5220 is coupled to the first rectified output terminal 5211 and the second rectified output terminal 5212 to receive the rectified signal. Srec, and filtering the rectified signal Srec, and then outputting the filtered signal Sflr by the first filter output terminal 5221 and the second filter output terminal 5222.
  • the first rectified output terminal 5211 can be regarded as the first filter input end of the filter circuit 5220
  • the second rectified output terminal 5212 can be regarded as the second filter input end of the filter circuit 5220.
  • the filter circuit 5220 can filter the ripple in the rectified signal Srec such that the waveform of the generated filtered signal Sflr is smoother than the waveform of the rectified signal Srec.
  • the filter circuit 5220 can be configured to filter a particular frequency to filter out the response/energy of the external drive signal at a particular frequency.
  • the driving circuit 5230 is coupled to the filtering circuit 5220 to receive the filtered signal Sflr and perform power conversion on the filtered signal Sflr to generate a driving power source Sdrv; that is, the input end of the driving circuit 5230 is coupled to the first filtering output end.
  • the second filter output terminal 5222 is coupled to the second filter output terminal 5222 to receive the filtered signal Sflr, and then generates a driving power source Sdrv for driving the LED light emitting portion 100 (FIG. 26A) to emit light.
  • the first filter output end 5221 can be regarded as the first drive input end of the drive circuit 5230, and the second filter output end 5222 can be regarded as the second drive input end of the drive circuit 5230.
  • the driving power source Sdrv generated by the driving circuit 5230 is supplied to the LED light emitting portion 100 through the first driving output terminal 5231 and the second driving output terminal 5232, so that the LED filament in the LED light emitting portion 100 can respond to the received driving power source Sdrv. And light up.
  • the following embodiments describe possible implementations of the rectifier circuit 5210, the filter circuit 5220, and the drive circuit 5230 in the power module 5200, but the disclosure is not limited thereto.
  • FIG. 68A is a circuit diagram of a rectifier circuit according to a first preferred embodiment of the present invention.
  • the rectifier circuit 5310 is a bridge rectifier circuit including rectifier diodes 5311-5314 for full-wave rectification of the received signal.
  • the anode of the rectifier diode 5311 is coupled to the second rectified output terminal 5212, and the cathode is coupled to the second pin 5202.
  • the anode of the rectifier diode 5312 is coupled to the second rectified output terminal 5212, and the cathode is coupled to the first pin 5201.
  • the anode of the rectifier diode 5313 is coupled to the second pin 5202, and the cathode is coupled to the first rectified output terminal 5211.
  • the anode of the rectifier diode 5314 is coupled to the first pin 5201, and the cathode is coupled to the first rectified output terminal 5211.
  • the rectifier diodes 5311-5314 can be represented by a first rectifier diode 5311, a second rectifier diode 5312, a third rectifier diode 5313, and a fourth rectifier diode 5314, respectively.
  • the operation of the rectifier circuit 5310 is described as follows.
  • the level on the first pin 5201 will be greater than the level on the second pin 5202.
  • the rectifier diodes 5311 and 5314 will operate in a forward-biased state to be turned on, and the rectifier diodes 5312 and 5313 will operate in a reverse bias state to be turned off, thereby forming a loop between the first pin 5201 and the second pin 5202.
  • the input current caused by the AC signal will flow through the first pin 5201, the rectifier diode 5314 and the first rectified output terminal 5211, and then flow into the subsequent load, and sequentially through the second rectified output.
  • the terminal 5212, the rectifier diode 5311 and the second pin 5202 flow out.
  • the level on the second pin 5202 will be greater than the level on the first pin 5201.
  • the rectifier diodes 5312 and 5313 operate in a forward-biased state and are turned on, and the rectifier diodes 5311 and 5314 operate in a reverse bias state to be turned off, thereby forming a loop between the first pin 5201 and the second pin 5202.
  • the input current caused by the AC signal will flow through the second pin 5202, the rectifier diode 5313 and the first rectified output terminal 5211, and then flow into the subsequent load, and sequentially through the second rectified output.
  • the terminal 5212, the rectifier diode 5312 and the first pin 5201 flow out. Therefore, regardless of whether the AC signal is in the positive half wave or the negative half wave, the positive pole of the rectified signal Srec of the rectifying circuit 5310 is located at the first rectifying output terminal 5211, and the negative pole is located at the second rectifying output terminal 5212.
  • the rectified signal output from the rectifier circuit 5210 is a full-wave rectified signal.
  • the operation of the rectifier circuit 5310 is described as follows.
  • the rectifier diodes 5311 and 5314 will operate in a forward biased state and conduct, and the rectifier diodes 5312 and 5313 will The operation is turned off in the reverse bias state, and a loop is formed between the first pin 5201 and the second pin 5202.
  • the circuit configuration and operation of the rectifier circuit 5310 are the same as the state in which the rectifier circuit 5310 is in the positive half cycle of the AC signal.
  • the rectifier diodes 5312 and 5313 When the first pin 5201 is coupled to the negative terminal of the DC power supply and the second pin 5202 is coupled to the positive terminal of the DC power supply, the rectifier diodes 5312 and 5313 will operate in a forward biased state and conduct, and the rectifier diodes 5311 and 5314 will The operation is turned off in the reverse bias state, and a loop is formed between the first pin 5201 and the second pin 5202. At this time, the circuit configuration and operation of the rectifier circuit 5310 are the same as the state in which the rectifier circuit 5310 is in the negative half cycle of the AC signal.
  • the rectifier circuit 5310 of the present embodiment can correctly output the rectified signal Srec regardless of whether the received signal is an AC signal or a DC signal.
  • a capacitance Cx may also be provided between the input terminals of the rectifier circuit 5310.
  • the capacitance value of the capacitor Cx can be, for example, 47 nF, which can be used to improve the electromagnetic interference effect in the power module 5200.
  • FIG. 68B is a circuit diagram of a rectifier circuit according to a second preferred embodiment of the present invention.
  • the rectifier circuit 5410 includes rectifier diodes 5411 and 5412 for half-wave rectifying the received signal.
  • the anode of the rectifier diode 5411 is coupled to the second pin 5202, and the cathode is coupled to the first rectified output terminal 5211.
  • the anode of the rectifier diode 5412 is coupled to the first rectified output terminal 5211, and the cathode is coupled to the first pin 5201.
  • the second rectified output 5212 can be omitted or grounded depending on the actual application.
  • the rectifier diodes 5411-5412 can be represented by a first rectifier diode 5411 and a second rectifier diode 5412, respectively.
  • the operation of the rectifying circuit 5410 will be described by dividing the operating situation into the case where the received signal is an alternating current signal and a direct current signal.
  • the operation of the rectifier circuit 5410 is described as follows.
  • the AC signal is in the positive half cycle, the signal level at which the AC signal is input at the first pin 5201 is higher than the signal level input at the second pin 5202.
  • the rectifier diodes 5411 and 5412 are both in the reverse biased state, and the rectifier circuit 5410 stops outputting the rectified signal Srec (or the rectified signal Srec outputted by the rectifier circuit 5410 is zero at this time).
  • the AC signal is in the negative half cycle, the signal level of the AC signal input at the first pin 5201 is lower than the signal level input at the second pin 5202.
  • the rectifier diodes 5411 and 5412 are both in a forward-biased conduction state, and the AC signal flows into the rear-stage load via the rectifier diode 5411 and the first rectification output terminal 5211, and is output by the second rectification output terminal 5212 or the LED bulb lamp. Another circuit or ground is flowing out.
  • the rectified signal output from the rectifier circuit 5410 is a half-wave rectified signal.
  • the operation of the rectifier circuit 5410 is described as follows.
  • the rectifier diodes 5411 and 5412 are both in the reverse biased state, and the rectifier circuit 5410 stops outputting the rectified signal.
  • the rectifier diodes 5411 and 5412 are both in a forward biased state, thereby forming a loop.
  • the circuit configuration and operation of the rectifier circuit 5410 are the same as the state in which the rectifier circuit 5410 is in the negative half cycle of the AC signal. Therefore, in the present embodiment, if the DC power source is connected to the second pin 5202 at the positive terminal and the negative terminal is connected to the first pin 5201, the rectifier circuit 5410 can still operate normally.
  • FIG. 69A is a circuit diagram of a filter circuit according to a first preferred embodiment of the present invention.
  • the filter circuit 5320 includes an inductor 5321, resistors 5322 and 5323, and capacitors 5324 and 5325.
  • the first end of the inductor 5321 is coupled to the first rectified output end 5211, and the second end of the inductor 5321 is coupled to the first filter output end 5221; that is, the inductor 5321 is connected in series to the first rectified output end 5211 and the first filtered output end. Between 5221.
  • the first end of the resistor 5322 is coupled to the first rectified output end 5211 and the first end of the inductor 5321, and the second end of the resistor 5322 is coupled to the first filter output end 5221 and the second end of the inductor 5321; that is, the resistor 5322 and The inductors 5321 are connected in parallel with each other.
  • the first end of the resistor 5323 is coupled to the second end of the inductor 5321 and the first filter output end 5221.
  • the first end of the capacitor 5324 is coupled to the second end of the inductor 5321 and the first filter output end 5221.
  • the second end of the capacitor 5324 is coupled to the second rectified output end 5212 and the second filtered output end 5222, wherein the second rectified output end
  • the 5212 and the second filter output 5222 can be regarded as the same end and can be regarded as the ground GND.
  • the first end of the capacitor 5325 is coupled to the second end of the resistor 5323, and the second end of the capacitor 5325 is coupled to the second rectified output end 5212 and the second filtered output end 5222.
  • the low-pass filtering of the rectified signal Srec may be performed to filter the high-frequency component of the rectified signal Srec to form a filtered signal Sflr, and then the first filter output end The 5221 and the second filter output 5222 are output.
  • FIG. 69B is a circuit diagram of a filter circuit according to a second preferred embodiment of the present invention.
  • the filter circuit 5420 is a ⁇ -type filter circuit, and includes an inductor 5421, capacitors 5422-5424, and resistors 5425 and 5426.
  • the first end of the inductor 5421 is coupled to the first rectified output end 5211, and the second end of the inductor 5421 is coupled to the first filter output end 5221; that is, the inductor 5421 is serially connected to the first rectified output end 5211 and the first filtered output end.
  • the first end of the capacitor 5422 is coupled to the first rectified output end 5211 and the first end of the inductor 5421.
  • the second end of the capacitor 5422 is coupled to the second rectified output end 5212 and the second filtered output end 5222; that is, the capacitor 5422
  • the first end is coupled to the first filter output end 5221 through the inductor 5421.
  • the first end of the capacitor 5423 is coupled to the first filter output terminal 5221 and the second end of the inductor 5421.
  • the second end of the capacitor 5423 is coupled to the second rectified output terminal 5212 and the second filter output terminal 5222; that is, the capacitor 5423
  • the first end is coupled to the first rectified output end 5211 through the inductor 5421.
  • the first end of the capacitor 5424 is coupled to the first filter output end 5221 and the second end of the inductor 5421.
  • the first ends of the resistors 5425 and 5426 are coupled to the second end of the capacitor 5424, and the second ends of the resistors 5425 and 5426 are coupled to the second rectified output terminal 5212 and the second filter output terminal 5222.
  • the configuration of the inductor 5421 and the capacitor 5423 in the filter circuit 5420 is similar to the inductor 5321 and the capacitor 5324 in the filter circuit 5320.
  • the filter circuit 5420 has a capacitor 5422 more than the filter circuit 5320 shown in FIG. 69A.
  • the capacitor 5422 has the same low-pass filtering effect as the inductor 5421 and the capacitor 5423. Therefore, the filter circuit 5420 of the present embodiment has better high-frequency filtering capability than the filter circuit 5320 shown in FIG. 69A, and the waveform of the output filtered signal Sflr is smoother.
  • the inductance of the inductors 5321 and 5421 in the above embodiment is preferably selected from the range of 10 nH to 10 mH.
  • the capacitance values of the capacitors 5324, 5325, 5422, 423, and 5424 are preferably selected from the range of 100 pF to 1 uF.
  • FIG. 70 is a circuit block diagram of a driving circuit according to a preferred embodiment of the present invention.
  • the drive circuit 5330 includes a switching control circuit 5331 and a conversion circuit 5332, and performs power conversion in a mode of a current source to drive the LED light-emitting portion to emit light.
  • the conversion circuit 5332 includes a switching circuit (also referred to as a power switch) PSW and a tank circuit ESE.
  • the conversion circuit 5332 is coupled to the first filter output terminal 5221 and the second filter output terminal 5222, receives the filtered signal Sflr, and converts the filtered signal Sflr into a driving power source Sdrv and is output by the first driver according to the control of the switching control circuit 5331.
  • the terminal 5231 and the second driving output terminal 5232 are output to drive the LED light emitting portion 100.
  • the driving power output from the conversion circuit 5332 is a steady current, and the LED light emitting portion is stably illuminated.
  • the driving circuit 5330 may further include a bias circuit 5333, which may generate an operating voltage Vcc based on a bus voltage of the power module, and the operating voltage Vcc is supplied to the switching control circuit 5331 for switching control Circuit 5331 can be activated and operated in response to the operating voltage.
  • FIGS. 71A to 71D are schematic diagrams of signal waveforms of the driving circuit 5330 according to various embodiments of the present invention.
  • 71A and 71B illustrate signal waveforms and control scenarios in which the drive circuit 5330 operates in a Continuous-Conduction Mode (CCM)
  • FIGS. 71C and 71D illustrate the operation of the drive circuit 5330 in discontinuous conduction.
  • Signal waveform and control context of the mode Discontinuous-Conduction Mode, DCM).
  • t on the horizontal axis represents time
  • the vertical axis represents voltage or current value (depending on the type of signal).
  • the switching control circuit 5331 of the present embodiment adjusts the duty ratio (Duty Cycle) of the output lighting control signal Slc in real time according to the operating state of the current LED lighting unit, so that the switching circuit PSW reacts to the lighting control signal Slc. Turn on or off.
  • the switching control circuit 5331 can detect the input voltage (which can be the level on the first pin 5201 / the second pin 5202, the level on the first rectified output terminal 5211 or the first filter output terminal 5221.
  • output voltage which can be the level on the first drive output 5231
  • input current which can be the bus current, that is, the current flowing through the rectified output 5211/5212, the filtered output 5221/5222
  • At least one or more of the output current (which may be the current flowing through the drive output 5231/5232 or the current flowing through the switch circuit PSW) determines the operating state of the current LED lighting portion.
  • the storage circuit ESE repeatedly charges/discharges according to the state in which the switching circuit PSW is turned on/off, so that the driving current ILED received by the LED light-emitting portion can be stably maintained at a preset current value Ipred.
  • the lighting control signal Slc will have a fixed signal period Tlc and signal amplitude, and the length of the pulse enable period (such as Ton1, Ton2, Ton3, or pulse width) in each signal period Tlc will be adjusted according to control requirements. .
  • the duty ratio of the lighting control signal Slc is the ratio of the pulse enable period to the signal period Tlc. For example, if the pulse enable period Ton1 is 40% of the signal period Tlc, it means that the duty ratio of the lighting control signal at the first signal period Tlc is 0.4.
  • FIG. 71A illustrates a signal waveform change of the driving circuit 5330 under a plurality of signal periods Tlc in a case where the driving current ILED is smaller than the preset current value Ipred.
  • the switching circuit PSW is turned on in the pulse enable period Ton1 in response to the high-level lighting control signal Slc.
  • the conversion circuit 5332 generates a driving current ILED according to the input power source received from the first filter output terminal 5221 and the second filter output terminal 5222, and supplies the driving current ILED to the LED light emitting portion 100, and also via the turned-on switching circuit PSW.
  • the storage circuit ESE is charged such that the current IL flowing through the storage circuit ESE gradually rises.
  • the tank circuit ESE stores energy in response to the input power received from the first filter output terminal 5221 and the second filter output terminal 5222.
  • the switching circuit PSW turns off the lighting control signal Slc that is low level.
  • the input power on the first filter output terminal 5221 and the second filter output terminal 5222 is not supplied to the LED light emitting portion, but is discharged by the storage circuit ESE to generate the driving current ILED.
  • the energy storage circuit ESE gradually reduces the current IL due to the release of electrical energy. Therefore, even when the lighting control signal Slc is at a low level (ie, during the disable period), the driving circuit 5330 continues to supply power to the LED lighting portion based on the energy release of the storage circuit ESE.
  • the driving circuit 5330 continuously supplies a stable driving current ILED to the LED light emitting portion, and the driving current ILED has a current value of about I1 in the first signal period Tlc.
  • the switching control circuit 5331 determines that the current value I1 of the driving current ILED is smaller than the preset current value Ipred according to a current detecting signal indicating the operating state of the LED light emitting portion, and thus enters the second signal.
  • the pulse enable period of the lighting control signal Slc is adjusted to Ton2, wherein the pulse enable period Ton2 is the pulse enable period Ton1 plus the unit period t1.
  • the operation of the switching circuit PSW and the tank circuit ESE is similar to the previous signal period Tlc.
  • the main difference between the two is that since the pulse enable period Ton2 is longer than the pulse enable period Ton1, the tank circuit ESE has a longer charging time, and the discharge time is also relatively short, so that the drive circuit 5330 is in the second.
  • the average value of the drive current ILED provided in the signal period Tlc is increased to a current value I2 closer to the preset current value Ipred.
  • the switching control circuit 5331 further adjusts the pulse enable period of the lighting control signal Slc during the third signal period Tlc. It is Ton3, in which the pulse enable period Ton3 is the pulse enable period Ton2 plus the unit period t1, which is equal to the pulse enable period Ton1 plus the period t2 (corresponding to two unit periods t1).
  • Ton3 the pulse enable period Ton3 is the pulse enable period Ton2 plus the unit period t1, which is equal to the pulse enable period Ton1 plus the period t2 (corresponding to two unit periods t1).
  • the operation of the switching circuit PSW and the tank circuit ESE is similar to the first two signal periods Tlc. Since the pulse enable period Ton3 is further extended, the current value of the drive current ILED is raised to I3, and substantially reaches the preset current value Ipred. Thereafter, since the current value I3 of the driving current ILED has reached the preset current value Ipred, the switching control circuit 5331 maintains the same duty ratio so that the driving current ILED can be continuously maintained at the preset current value Ipred
  • FIG. 71B illustrates a signal waveform change of the driving circuit 5330 under a plurality of signal periods Tlc in a case where the driving current ILED is greater than the preset current value Ipred.
  • the switching circuit PSW is turned on in the pulse enable period Ton1 in response to the high-level lighting control signal Slc.
  • the conversion circuit 5332 generates a driving current ILED according to the input power source received from the first filter output terminal 5221 and the second filter output terminal 5222, and supplies the driving current ILED to the LED light emitting portion 100, and also via the turned-on switching circuit PSW.
  • the storage circuit ESE is charged such that the current IL flowing through the storage circuit ESE gradually rises.
  • the tank circuit ESE stores energy in response to the input power received from the first filter output terminal 5221 and the second filter output terminal 5222.
  • the switching circuit PSW turns off the lighting control signal Slc which is reflected at the low voltage level.
  • the input power on the first filter output terminal 5221 and the second filter output terminal 5222 is not supplied to the LED light emitting portion 100, but is discharged by the storage circuit ESE to generate the driving current ILED.
  • the energy storage circuit ESE gradually reduces the current IL due to the release of electrical energy. Therefore, even when the lighting control signal Slc is at the low voltage level (ie, during the disable period), the driving circuit 5330 continues to supply power to the LED lighting portion 100 based on the release of the energy storage circuit ESE. In other words, regardless of whether the switching circuit PSW is turned on or not, the driving circuit 5330 continuously supplies a stable driving current ILED to the LED lighting portion 100, and the driving current ILED has a current value of about I4 in the first signal period Tlc.
  • the switching control circuit 5331 determines that the current value I4 of the driving current ILED is greater than the preset current value Ipred according to the current detecting signal Sdet, so that the control signal will be illuminated when entering the second signal period Tlc.
  • the pulse enable period of Slc is adjusted to Ton2, wherein the pulse enable period Ton2 is the pulse enable period Ton1 minus the unit period t1.
  • the operation of the switching circuit PSW and the tank circuit ESE is similar to the previous signal period Tlc.
  • the main difference between the two is that since the pulse enable period Ton2 is shorter than the pulse enable period Ton1, the storage circuit ESE has a shorter charging time and the discharge time is relatively longer, so that the drive circuit 5330 is in the second.
  • the average value of the drive current ILED provided in the signal period Tlc is lowered to a current value I5 closer to the preset current value Ipred.
  • the switching control circuit 5331 further adjusts the pulse enable period of the lighting control signal Slc during the third signal period Tpwm. It is Ton3, in which the pulse enable period Ton3 is the pulse enable period Ton2 minus the unit period t1, which is equal to the pulse enable period Ton1 minus the period t2 (corresponding to two unit periods t1).
  • Ton3 the pulse enable period Ton3 is the pulse enable period Ton2 minus the unit period t1, which is equal to the pulse enable period Ton1 minus the period t2 (corresponding to two unit periods t1).
  • the operation of the switching circuit PSW and the tank circuit ESE is similar to the first two signal periods Tlc. Since the pulse enable period Ton3 is further shortened, the current value of the drive current ILED is lowered to I6, and substantially reaches the preset current value Ipred. Thereafter, since the current value I6 of the driving current ILED has reached the preset current value Ipred, the switching control circuit 5331 maintains the same duty ratio so that the driving current ILED can be continuously maintained at the
  • the driving circuit 5330 adjusts the pulse width of the lighting control signal Slc step by step so that the driving current ILED is gradually adjusted to be close to the preset current when the driving current ILED is lower or higher than the preset current value Ipred.
  • the value Ipred in turn, achieves a constant current output.
  • the driving circuit 5330 is exemplified by operating in the continuous conduction mode, that is, the storage circuit ESE is not discharged until the current IL is zero during the off period of the switching circuit PSW.
  • the driving circuit 5330 in the continuous conduction mode to supply power to the LED filament module, the power supply to the LED filament module can be stabilized and ripple is less likely to occur.
  • FIG. 70 and FIG. 71C first, wherein the signal waveform of FIG. 71C and the driving circuit 5330 operate substantially the same as FIG. 71A.
  • the main difference between FIG. 71C and FIG. 71A is that the driving circuit 5330 of the present embodiment operates in the discontinuous conduction mode, so the tank circuit ESE is discharged to the current IL equal to zero during the pulse disable period of the lighting control signal Slc. And then re-charging at the beginning of the next signal period Tlc.
  • FIG. 71A For the operation descriptions other than the above, reference may be made to the above-mentioned embodiment of FIG. 71A, and details are not described herein again.
  • FIG. 70 and FIG. 71D the signal waveform of FIG. 71D and the driving circuit 5330 operate substantially the same as FIG. 71B.
  • the main difference between FIG. 71D and FIG. 71B is that the driving circuit 5330 of the present embodiment operates in the discontinuous conduction mode, so the tank circuit ESE is discharged to the current IL equal to zero during the pulse disable period of the lighting control signal Slc. And then re-charging at the beginning of the next signal period Tlc.
  • the tank circuit ESE is discharged to the current IL equal to zero during the pulse disable period of the lighting control signal Slc.
  • Tlc the next signal period
  • the driving circuit 5330 By operating the driving circuit 5330 in the discontinuous conduction mode to supply power to the LED filament module, the power loss generated by the driving circuit 5330 during power conversion can be reduced, thereby having high conversion efficiency.
  • a specific circuit example of a plurality of driving circuits 5330 is further described below for explanation.
  • FIG. 72A is a circuit diagram of a driving circuit according to a first preferred embodiment of the present invention.
  • the driving circuit 5430 is a step-down DC-to-DC conversion circuit, and includes a controller 5431, an output circuit 5432, a bias circuit 5433, and a sampling circuit 5434.
  • the driving circuit 5430 is coupled to the first filtering output terminal 5221 and the second filtering output terminal 5222 to convert the received filtered signal Sflr into a driving power source Sdrv for drivingly coupled to the first driving output terminal 5231 and the second driving output terminal.
  • LED filament module between 5232.
  • the controller 5431 can be, for example, an integrated chip including a drain pin Pdrn, a source pin Pcs, a power pin Pvcc, a voltage sampling pin Pln, an overvoltage protection pin Povp, and a ground pin Pgnd.
  • the drain pin Pdrn is coupled to the output circuit 5432.
  • the source pin Pcs is coupled to the second filter output terminal 5222 and the ground terminal GND through a resistor Rs.
  • the power pin Pvcc and the overvoltage protection pin Povp are coupled to the bias circuit 5433.
  • the voltage sampling pin Pln is coupled to the sampling circuit 5434.
  • the ground pin Pgnd is coupled to the second filter output terminal 5222 and the ground terminal GND.
  • the switching circuit/power switch (PSW) in the conversion circuit can be integrated, for example, in the controller 5431, and the first end and the second end of the switching circuit are respectively connected to the drain pin Pdrn and the source. Pole pin Pcs.
  • the controller 5431 can determine whether the drain pin Pdrn and the source pin Pcs and the corresponding current path are turned on or off by controlling the switching of the internal switching circuit.
  • the switching circuit can also be a discrete device disposed outside of the controller 5431.
  • each pin of the controller 5431 will be adjusted accordingly, for example, the drain pin Pdrn will be adjusted to be connected to the control terminal of the switching circuit, and used to provide the lighting control signal. Pin.
  • the output circuit 5432 includes a diode D1, an inductor L1, a capacitor Co, and a resistor Ro, wherein the inductor L1 and the capacitor C1 are used as an energy storage circuit (ESE) in the conversion circuit.
  • the diode D1 acts as a freewheeling diode, and its anode is coupled to the drain pin Pdrn of the controller 5431 to be coupled to the first terminal/drain of the switching circuit inside the controller 5431 through the drain pin Pdrn; the cathode of the diode D1
  • the second drive output 5232 is coupled.
  • the first end of the inductor L1 is coupled to the anode of the diode D1 and the drain pin Pdrn of the controller 5431.
  • the second end of the inductor L1 is coupled to the first filter output terminal 5221 and the second drive output terminal 5232.
  • the resistor Ro and the capacitor Co are connected in parallel with each other and coupled between the first driving output terminal 5231 and the second driving output terminal 5232.
  • the first filter output terminal 5221 and the second drive output terminal 5232 can be regarded as the same end.
  • the controller 5431 controls the conduction and the off between the drain pin Pdrn and the source pin Pcs.
  • the drain pin Pdrn and the source pin Pcs are turned on, current flows in from the first filter output terminal 5221, and flows through the inductor L1 and the drain pin Pdrn to the controller 5431, and passes through the source pin.
  • the Pcs and the second filter output terminal 5222 flow to the ground GND.
  • the current flowing through the inductor L1 increases with time, the inductor L1 is in the energy storage state; the voltage of the capacitor Co decreases with time, and the capacitor Co is in the release state to maintain the LED filament module emitting light.
  • the inductor L1 When the drain pin Pdrn and the source pin Pcs are turned off, the inductor L1 is in a release state, and the current of the inductor L1 decreases with time. At this time, the current of the inductor L1 is returned to the inductor L1 via the diode D1, the first driving output terminal 5231, the LED filament module, and the second driving output terminal 5232 to form a freewheeling flow. At this time, the capacitance Co is in the energy storage state, and the level of the capacitance Co increases with time.
  • the capacitance Co is an omitting component.
  • the capacitor Co When the capacitor Co is omitted, when the drain pin Pdrn and the source pin Pcs are turned on, the current of the inductor L1 does not flow through the first driving output terminal 5231 and the second driving output terminal 5232, so that the LED filament module does not emit light.
  • the drain pin Pdrn and the source pin Pcs are turned off, the current of the inductor L1 flows through the LED filament module through the freewheeling diode D1 to cause the LED filament to emit light.
  • the average brightness of the LED filament can be stabilized at a set value to achieve the same stable illumination.
  • this embodiment adopts a non-isolated power conversion architecture, it can be used as a controller 5431 to feedback control of the switch circuit/power switch by detecting the magnitude of the current flowing through the switch circuit/power switch. basis.
  • the driving circuit 5430 keeps the current flowing through the LED light-emitting portion unchanged, so for some LED light-emitting portions (for example, LED light-emitting portions such as white, red, blue, green, etc.), the color temperature follows The situation in which the magnitude of the current changes can be improved, that is, the LED light-emitting portion can maintain the color temperature at different brightnesses.
  • LED light-emitting portions for example, LED light-emitting portions such as white, red, blue, green, etc.
  • the inductor L1 which acts as a storage circuit, releases the stored energy when the switch circuit is turned off, on the one hand, the LED light-emitting portion continues to emit light, and on the other hand, the current and voltage on the LED light-emitting portion does not suddenly drop to a minimum value, and when When the switch circuit is turned on again, the current and voltage do not need to go back to the maximum value from the lowest value, thereby avoiding intermittent light emission of the LED light-emitting portion, improving the overall brightness of the LED light-emitting portion, lowering the minimum on-period and increasing the driving frequency.
  • the bias circuit 5433 includes a capacitor C1 and resistors R1-R4.
  • the first end of the capacitor C1 is coupled to the power pin Pvcc, and the second end of the capacitor C1 is coupled to the second filter output 5222 and the ground GND.
  • the first end of the resistor R1 is coupled to the second driving output end 5232.
  • the first end of the resistor R2 is coupled to the second end of the resistor R1, and the second end of the resistor R2 is coupled to the first end of the capacitor C1 and the power pin Pvcc.
  • the first end of the resistor R3 is coupled to the second end of the resistor R1 and the first end of the resistor R2, and the second end of the resistor R3 is coupled to the overvoltage protection pin Povp of the controller 5431.
  • the first end of the resistor R4 is coupled to the second end of the resistor R3, and the second end of the resistor R4 is coupled to the second filter output terminal 5222 and the ground GND.
  • the resistors R1 and R2 draw the voltage on the second drive output terminal 5232 to generate the operating voltage Vcc, and the operating voltage Vcc is regulated by the capacitor C1 and supplied to the power pin Pvcc of the controller 5431 for use by the controller 5431.
  • the resistors R3 and R4 sample the voltage on the second driving output terminal 5232 by voltage division, so that the controller 5431 can determine whether to perform the overvoltage protection function according to the voltage information on the overvoltage protection pin Povp.
  • the sampling circuit 5434 includes a capacitor C2 and resistors R5-R7.
  • the first end of the capacitor C2 is coupled to the voltage sampling pin Pln, and the second end of the capacitor C2 is coupled to the second filter output terminal 5222 and the ground terminal GND.
  • the first end of the resistor R5 is coupled to the first filter output terminal 5221 and the second drive output terminal 5232.
  • the first end of the resistor R6 is coupled to the second end of the resistor R5, and the second end of the resistor R6 is coupled to the second filter output terminal 5222 and the ground GND.
  • the first end of the resistor R7 is coupled to the second end of the resistor R5 and the first end of the resistor R6, and the second end of the resistor R7 is coupled to the first end of the voltage sampling pin Pln and the capacitor C2.
  • the resistors R5 and R6 sample the bus voltage (ie, the voltage on the first filter output terminal 5221) by means of voltage division, and the sampled voltage is supplied to the voltage sampling pin Pln of the controller 5431 via the resistor R7.
  • Capacitor C2 is used to regulate the voltage on the voltage sampling pin Pln.
  • FIG. 72B is a circuit diagram of a driving circuit according to a second preferred embodiment of the present invention.
  • the driving circuit 5530 is exemplified by a step-up DC-to-DC conversion circuit, and includes a controller 5531, an output circuit 5532, a bias circuit 5533, and a sampling circuit 5534.
  • the driving circuit 5530 is coupled to the first filtering output terminal 5221 and the second filtering output terminal 5222 to convert the received filtered signal Sflr into a driving power source Sdrv, and is further coupled to the first driving output end 5231 and the second driving output end. LED light emitting part between 5232.
  • the driving circuit 5530 is further coupled to the first rectified output terminal 5211, thereby drawing the bus voltage to generate the operating voltage Vcc.
  • the controller 5531 can be, for example, an integrated chip including a drain pin Pdrn, a source pin Pcs, a power pin Pvcc, an overvoltage protection pin Povp, and a ground pin Pgnd.
  • the drain pin Pdrn is coupled to the output circuit 5532.
  • the source pin Pcs is coupled to the second filter output terminal 5222, the second drive output terminal 5232, and the ground terminal GND through a capacitor Cs.
  • the power pin Pvcc is coupled to the bias circuit 5533.
  • the overvoltage protection pin Povp is coupled to the sampling circuit 5534.
  • the ground pin Pgnd is coupled to the bias circuit 5533 and the sampling circuit 5534.
  • the switching circuit/power switch (PSW) in the conversion circuit can be integrated, for example, in the controller 5531, and the first end and the second end of the switching circuit are respectively connected to the drain pin Pdrn and the source. Pole pin Pcs.
  • the controller 5531 can determine whether the drain pin Pdrn and the source pin Pcs and the corresponding current path are turned on or off by controlling the switching of the internal switching circuit.
  • the switching circuit can also be a discrete device disposed outside of the controller 5531.
  • each pin of the controller 5531 will be adjusted correspondingly, for example, the drain pin Pdrn will be adjusted to be connected to the control terminal of the switching circuit, and used to provide the lighting control signal. Pin.
  • the output circuit 5532 includes a diode D1, an inductor L1, a capacitor Co, and a resistor Ro, wherein the inductor L1 and the capacitor C1 are used as an energy storage circuit (ESE) in the conversion circuit.
  • the diode D1 acts as a freewheeling diode, and its anode is coupled to the drain pin Pdrn of the controller 5531 to be coupled to the first terminal/drain of the switching circuit inside the controller 5531 through the drain pin Pdrn; the cathode of the diode D1
  • the first driving output end 5231 is coupled.
  • the first end of the inductor L1 is coupled to the first filter output terminal 5221, and the second end of the inductor L1 is coupled to the drain pin Pdrn of the controller 5431 and the anode of the diode D1.
  • the resistor Ro and the capacitor Co are connected in parallel with each other and coupled between the first driving output terminal 5231 and the second driving output terminal 5232.
  • the first filter output terminal 5221 is coupled to the first drive output terminal 5231 through the diode D1 and the inductor L1.
  • the controller 5531 controls the conduction and the cutoff between the drain pin Pdrn and the source pin Pcs.
  • the drain pin Pdrn and the source pin Pcs When the drain pin Pdrn and the source pin Pcs are turned on, current flows in from the first filter output terminal 5221, and flows through the inductor L1 and the drain pin Pdrn to the controller 5531, and passes through the source pin.
  • the Pcs, the capacitor Cs, and the second filter output terminal 5222 flow to the ground GND.
  • the current flowing through the inductor L1 increases with time, and the inductor L1 is in an energy storage state.
  • the capacitor Co is in an energy release state to continuously drive the LED light emitting portion to emit light.
  • the inductor L1 When the drain pin Pdrn and the source pin Pcs are turned off, the inductor L1 is in a release state, and the current of the inductor L1 decreases with time. The current of the inductor L1 flows through the diode D1 to the capacitor Co and the LED light-emitting portion. At this time, the capacitor Co is in an energy storage state.
  • the capacitance Co is an omitting component.
  • the capacitor Co When the capacitor Co is omitted, when the drain pin Pdrn and the source pin Pcs are turned on, the current of the inductor L1 does not flow through the first drive output terminal 5231 and the second drive output terminal 5232, so that the LED light-emitting portion does not emit light.
  • the current of the inductor L1 flows through the LED light-emitting portion via the freewheeling diode D1 to cause the LED light-emitting portion to emit light.
  • the average brightness of the LED light-emitting portion can be stabilized at a set value to achieve the same stable light-emitting effect.
  • the bias circuit 5533 includes a diode D2, a capacitor C1, and a resistor R1.
  • the anode of the diode D2 is coupled to the first rectified output terminal 5211, and the cathode of the diode D2 is coupled to the first driving output end 5231.
  • the first end of the capacitor C1 is coupled to the power pin Pvcc, and the second end of the capacitor C1 is coupled to the ground pin Pgnd.
  • the first end of the resistor R1 is coupled to the cathode of the diodes D1 and D2 and the first driving output terminal 5231.
  • the second end of the resistor R1 is coupled to the first end of the capacitor C1 and the power pin Pvcc.
  • the resistor R1 draws the voltage on the first driving output terminal 5231 to generate the operating voltage Vcc, and the operating voltage Vcc is regulated by the capacitor C1 and supplied to the power pin Pvcc of the controller 5431 for use by the controller 5431.
  • Sampling circuit 5534 includes resistors R2-R5.
  • the first end of the resistor R2 is coupled to the first driving output terminal 5231, and the second end of the resistor R2 is coupled to the overvoltage protection pin Povp.
  • the resistors R3 and R4 are connected in parallel with each other. The first ends of the resistors R3 and R4 are coupled to the ground pin Pgnd, and the second ends of the resistors R3 and R4 are coupled to the second filter output terminal 5222, the second driving output terminal 5232, and the ground terminal GND.
  • the first end of the resistor R5 is coupled to the ground pin Pgnd, and the second end of the resistor R5 is coupled to the second end of the resistor R2 and the overvoltage protection pin Povp.
  • the resistor R2-R5 samples the output voltage by means of voltage division (ie, the voltage on the first driving output terminal 5231), and the sampled voltage is supplied to the overvoltage protection pin Povp of the controller 5531, so that the controller 5531
  • the overvoltage protection function can be judged based on the voltage information on the overvoltage protection pin Povp.
  • the driving circuits 5430 and 530 are exemplified by a single-stage DC-DC conversion circuit, the present invention is not limited thereto.
  • the driving circuit 5330 can also be a two-stage driving circuit composed of an active power factor correction circuit and a DC-to-DC conversion circuit.

Abstract

A light-emitting diode filament comprises LED segments, conductor segments, at least two electrodes, and a light conversion layer. The invention is characterized in that the conductor segment is located between two adjacent LED segments. The electrodes are configured to correspond to the LED segments and are electrically connected to the LED segments. Two adjacent LED segments are electrically connected to each other via the conductor segment. The LED segment comprises at least two LED chips, and the LED chips are electrically connected to each other. The light conversion layer covers the LED segments, the conductor segments, and the electrodes, and exposes a part of each of the two electrodes. The light-emitting diode filament structure of the present invention is divided into the LED segments and the conductor segments. Therefore, stress is easily concentrated on the conductor segment when the light-emitting diode filament is bent, such that the probability of a conducting wire connecting adjacent LED chips in the LED segment breaking when bent is reduced, thereby improving overall quality of the light-emitting diode filament and a light-emitting diode bulb applying the same.

Description

发光二极管灯丝及发光二极管球泡灯LED filament and LED bulb 技术领域Technical field
本发明涉及照明领域，具体涉及一种发光二极管(LED)灯丝及其应用的发光二极管球泡灯。The invention relates to the field of illumination, and in particular to a light-emitting diode (LED) filament and a light-emitting diode bulb thereof.
背景技术Background technique
几十年来，白炽灯泡被广泛用于家庭或商业场合的照明，然而，白炽灯泡在能源运用方面通常较没有效率，大约有90％的能源输入会转为以热的形式散逸。且因为白炽灯泡极有限的寿命(约1,000小时)，因此需要经常更换。这些传统灯泡逐渐被其他更有效率的电灯取代，如荧光灯、高强度气体放电灯、发光二极体(LED)等。在这些电灯中，LED灯具是最引人注目的照明技术。LED灯具有使用寿命长、体积小、环保等优点，因此其应用不断增长。Incandescent bulbs have been widely used for home or business lighting for decades. However, incandescent bulbs are generally inefficient in energy use, and about 90% of energy input is converted to heat. And because incandescent bulbs have a very limited life (about 1,000 hours), they need to be replaced frequently. These traditional light bulbs are gradually being replaced by other more efficient electric lights, such as fluorescent lamps, high-intensity discharge lamps, and light-emitting diodes (LEDs). Of these lights, LED luminaires are the most eye-catching lighting technology. LED lamps have the advantages of long service life, small size, and environmental protection, so their applications are growing.
近年来，市面上已有具有LED灯丝的LED球泡灯。目前市面上利用LED灯丝作为发光源的LED球泡灯仍有以下问题待改善：In recent years, LED bulbs with LED filaments have been available on the market. At present, LED bulbs using LED filaments as illumination sources still have the following problems to be improved:
首先，采用LED硬灯丝具有基板(例如：玻璃基板)，以及在其基板上的许多LED芯片。不过LED球泡灯的照明效果需倚赖多根硬灯丝组合，才能产生较佳的照明效果，单一硬灯丝的照明效果则无法满足市场上普遍的需求。传统球泡灯具有钨丝，由于钨丝的自然可弯折的性质而能够产生均匀的出光，然而LED硬灯丝难以达到这种均匀的光的效果。让LED灯丝难以达到这种效果的原因有很多种，除了前述的不可弯折之外，其一是基板会挡住LED所发出的光线，再者LED产生的光为点光源，这会导致光线集中。而与之相反的，均匀的光线分布会产生均匀的光照效果，另一方面，集中的光线分布则会导致不均匀且集中的光照效果。First, an LED hard filament is used with a substrate (for example, a glass substrate), and a plurality of LED chips on its substrate. However, the lighting effect of LED bulbs relies on a combination of multiple hard filaments to produce better lighting effects. The lighting effect of a single hard filament cannot meet the general needs in the market. Conventional bulbs have tungsten filaments, which are capable of producing uniform light output due to the naturally bendable nature of the tungsten filaments. However, LED hard filaments are difficult to achieve such uniform light effects. There are many reasons why LED filaments are difficult to achieve this effect. In addition to the aforementioned non-bending, one of them is that the substrate blocks the light emitted by the LED, and the light generated by the LED is a point source, which causes the light to concentrate. . Conversely, a uniform distribution of light produces a uniform illumination effect, and on the other hand, a concentrated distribution of light results in uneven and concentrated illumination.
另外，还有一种LED软灯丝，其与上述的灯丝结构类似，而玻璃基板的部分改用具有可挠性基板(以下简称FPC)，使得灯丝可具有一定的弯折度。然而，利用FPC所制成的软灯丝具有例如FPC热膨胀系数与包覆灯丝的硅胶不同，长久使用导致LED芯片的移位甚至脱胶；或者是FPC不利于制程条件的灵活改变等缺点。除此之外，灯丝结构在弯折时对芯片间金属打线的稳定性存在挑战，当灯丝中芯片的排布缜密时，如果通过金属打线的方式将相邻的LED芯片进行连接，容易由于灯丝弯曲时造成应力过于集中在灯丝特定部位，使连接LED芯片的金属打线造成破坏甚至断裂，In addition, there is an LED flexible filament which is similar to the above-described filament structure, and a portion of the glass substrate is replaced with a flexible substrate (hereinafter referred to as FPC) so that the filament can have a certain degree of bending. However, the soft filament made by FPC has a thermal expansion coefficient such as FPC, which is different from the silica gel coated with the filament, and the long-term use causes displacement or even degumming of the LED chip; or FPC is disadvantageous to the flexible change of the process conditions. In addition, the filament structure has a challenge to the stability of the metal wire between the chips when bent. When the arrangement of the chips in the filament is dense, if the adjacent LED chips are connected by metal wire bonding, it is easy. When the filament is bent, the stress is too concentrated on a specific part of the filament, causing damage or even breakage of the metal wire connecting the LED chip.
另外，LED灯丝一般是设置于LED球泡灯之中，而为了呈现外观上的美感，也为了让LED灯丝的光照效果更为均匀且广阔，LED灯丝会被弯折而呈现多种曲线。不过LED灯丝中排列着LED芯片，而LED芯片是相对较坚硬的物体，因此会使得LED灯丝较难被弯折成理想的形状。并且，LED灯丝也容易因为弯折时的应力集中而产生裂痕。In addition, the LED filament is generally disposed in the LED bulb, and in order to present the aesthetic appearance, and to make the illumination effect of the LED filament more uniform and wide, the LED filament is bent to exhibit various curves. However, LED chips are arranged in the LED filaments, and the LED chips are relatively hard objects, so that the LED filaments are more difficult to be bent into a desired shape. Moreover, the LED filament is also prone to cracks due to stress concentration at the time of bending.
现有一种LED球泡灯，为了增加外观上的美感并使光照效果更均匀，其设置有多条LED灯丝，并将多条LED灯丝设置为不同的摆放角度。不过，由于单一LED球泡灯中需要装设多条LED灯丝，且须这些LED灯丝都需要被个别固定，如此将使制程更加繁琐，提高生产成本。In order to increase the aesthetic appearance and make the illumination effect more uniform, a LED bulb has a plurality of LED filaments and a plurality of LED filaments are set to different placement angles. However, since a plurality of LED filaments need to be installed in a single LED bulb, and these LED filaments need to be individually fixed, the process will be more complicated and the production cost will be increased.
另外，由于LED灯丝对于点亮的驱动要求与传统的钨丝灯有着本质上的差异。对于LED球泡灯而言，如何设计一个电源电路，使其能够给出稳定的电流使LED灯丝在点亮时的纹波足够低，进而令使用者不至于感受到闪烁，是其中一个设计考虑。其次，由于空间上的限制，如何在实现所需光效及驱动要求的前提下设计出足够简单并且足以容纳至灯头空间的电源电路，也是一个值得关注的重点。In addition, since the LED filament has a driving requirement for lighting, it is substantially different from the conventional tungsten filament lamp. For LED bulbs, how to design a power circuit so that it can give a stable current so that the ripple of the LED filament is low enough to make the user feel the flicker is not a design consideration. . Secondly, due to space constraints, how to design a power supply circuit that is simple enough and can accommodate the space of the lamp head under the premise of achieving the required light efficiency and driving requirements is also a focus of attention.
专利号为CN202252991U公开了芯片的上下面或者其四周分别涂布荧光粉，芯片固定在柔性PCB板上并通过绝缘胶粘接封装，绝缘胶是环氧树脂胶；芯片的电极通过金线连接柔性PCB板上的电路；柔性PCB板呈透明或半透明状，柔性PCB板是在聚酰亚胺或聚酯薄膜基板上印刷电路制作而成，采用柔性PCB板代替铝基板支架灯散热部件，改善散热。专利公开号为CN105161608A公开了一种LED灯丝发光条及其制备方法，其采用互不重叠的芯片发光面之间面面对应排布，提高出光均匀性及改善散热。专利公开号为CN103939758A公开了载体的承载面与LED芯片之间的结合面之间形成有透明且导热的散热层，用以与所述LED芯片进行热交换。前述专利分别采用PCB板、调整芯片排布或形成散热层，虽在一定程度上能改善灯丝散热，但因散热效率低，热量易积聚。最后，专利公开号为CN204289439U公开了一种全周发光的LED灯丝，包括混有荧光粉的基板，设置于所述基板上的电极，安装在所述基板上的至少一个LED芯片，以及覆盖于所述LED芯片上的封装胶。通过含有荧光粉的硅树脂形成的基板，免除了玻璃或蓝宝石作为基板的成本，使用所述基板制作的灯丝避免了玻璃或蓝宝石对芯片出光的影响，实现了360度出光，出光均匀性和光效大大提高。但基板因采用硅树脂形成，亦存在耐热性不佳的缺点。Patent No. CN202252991U discloses that the phosphor is coated on the upper and lower sides of the chip or on the periphery thereof. The chip is fixed on the flexible PCB and sealed by an insulating adhesive. The insulating glue is epoxy resin; the electrodes of the chip are connected by gold wire. The circuit on the PCB board; the flexible PCB board is transparent or translucent, and the flexible PCB board is made by printing circuit on the polyimide or polyester film substrate, and the flexible PCB board is used instead of the aluminum substrate bracket lamp heat dissipation component, and the improvement is improved. Cooling. Patent Publication No. CN105161608A discloses an LED filament illuminating strip and a preparation method thereof, which adopt corresponding arrangement between the surface of the illuminating surface of the chip which do not overlap each other, thereby improving light uniformity and improving heat dissipation. Patent Publication No. CN103939758A discloses that a transparent and thermally conductive heat dissipation layer is formed between the bonding surface of the carrier and the bonding surface of the LED chip for heat exchange with the LED chip. The aforementioned patents respectively use a PCB board, adjust the chip arrangement or form a heat dissipation layer, which can improve the heat dissipation of the filament to a certain extent, but the heat is easy to accumulate due to low heat dissipation efficiency. Finally, Patent Publication No. CN204289439U discloses a full-circumferential LED filament comprising a substrate mixed with phosphor, an electrode disposed on the substrate, at least one LED chip mounted on the substrate, and covering The encapsulant on the LED chip. The substrate formed by the phosphor-containing silicone resin eliminates the cost of glass or sapphire as a substrate, and the filament made using the substrate avoids the influence of glass or sapphire on the light output of the chip, and realizes 360-degree light output, light uniformity and light efficiency. Greatly improve. However, since the substrate is formed of a silicone resin, there is also a disadvantage that heat resistance is not good.
发明内容Summary of the invention
特别注意，本公开可实际包括当前要求保护或尚未要求保护的一个或多个发明方案，并且在撰写说明书的过程中为了避免由于这些可能发明方案之间的不必要区分而造成的混淆，本文可能的多个发明方案可在此被共同称为“(本)发明”。It is specifically noted that the present disclosure may actually include one or more inventive aspects that are currently claimed or not claimed, and that in order to avoid confusion due to unnecessary distinction between these possible inventive solutions during the writing of the specification, this document may The various inventive arrangements may be collectively referred to herein as "(present) inventions."
在此概要描述关于“本发明”的许多实施例。然而所述词汇“本发明”仅仅用来描述在此说明书中揭露的某些实施例(不管是否已在权利要求项中)，而不是所有可能的实施例的完整描述。以下被描述为“本发明”的各个特征或方面的某些实施例可以不同方式合并以形成一LED球泡灯或其中一部分。A number of embodiments relating to "the invention" are outlined herein. The word "invention" is used merely to describe certain embodiments disclosed in this specification (whether or not in the claims), and not a full description of all possible embodiments. Certain embodiments of the various features or aspects described below as "invention" may be combined in various ways to form an LED bulb or a portion thereof.
根据本发明的一个实施例，公开一种LED灯丝，包括LED芯片、电极、第一光转换层，其特征在于，还包括PI膜与铜箔，所述PI膜的上表面上贴覆所述铜箔以及所述LED芯 片，所述铜箔位于相邻两LED芯片之间；所述电极对应于所述LED芯片配置，所述LED芯片与所述铜箔、所述LED芯片与所述电极通过导线进行电性连接；LED芯片具有p接面和n接面，导线包括与LED芯片的p接面相连接的第一导线和与LED芯片的n接面相连接的第二导线，第一光转换层覆盖单个LED芯片与此LED芯片相连接的第一导线和第二导线，第一光转换层的数量与LED芯片的数量相同。According to an embodiment of the present invention, an LED filament comprising an LED chip, an electrode, and a first light conversion layer, further comprising a PI film and a copper foil, the upper surface of the PI film being attached a copper foil and the LED chip, the copper foil being located between two adjacent LED chips; the electrode corresponding to the LED chip configuration, the LED chip and the copper foil, the LED chip and the electrode Electrically connected by a wire; the LED chip has a p-junction and an n-junction, and the wire comprises a first wire connected to the p-junction of the LED chip and a second wire connected to the n-junction of the LED chip, the first light conversion The layer covers the first wire and the second wire of the single LED chip connected to the LED chip, and the number of the first light conversion layers is the same as the number of the LED chips.
可选的，所述铜箔上表面具有镀银层，镀银层上设有保焊膜层，保焊膜层的厚度为30～50um。Optionally, the upper surface of the copper foil has a silver plating layer, and the silver plating layer is provided with a solder mask layer, and the thickness of the solder resist layer is 30-50 um.
可选的，所述第一光转换层覆盖所述铜箔的两端，所述铜箔的两端被所述第一光转换层覆盖的面积、平均厚度相等或不相等，所述第一光转换层覆盖所述铜箔的上表面面积的30～40％。Optionally, the first light conversion layer covers both ends of the copper foil, and an area, an average thickness of both ends of the copper foil covered by the first light conversion layer are equal or unequal, the first The light conversion layer covers 30 to 40% of the area of the upper surface of the copper foil.
可选的，所述第一光转换层覆盖所述铜箔，所述铜箔的两端被所述第一光转换层覆盖的面积、平均厚度与所述铜箔的中间被所述第一光转换层覆盖的面积、平均厚度不相等，所述铜箔的中间被所述第一光转换层覆盖的厚度为30～50um。Optionally, the first light conversion layer covers the copper foil, and an area, an average thickness of both ends of the copper foil covered by the first light conversion layer and the middle of the copper foil are first The area covered by the light conversion layer and the average thickness are not equal, and the thickness of the copper foil covered by the first light conversion layer is 30 to 50 μm.
可选的，所述电极为位于灯丝头尾两端并延伸超过所述PI膜的铜箔。Optionally, the electrode is a copper foil located at both ends of the filament end and extending beyond the PI film.
可选的，所述PI膜的下表面覆盖第二光转换层，第二光转换层具有倾斜侧面或带有弧形的倾斜侧面，PI膜的上表面与其下表面相对应。Optionally, the lower surface of the PI film covers the second light conversion layer, and the second light conversion layer has an inclined side surface or an inclined side surface with an arc, and an upper surface of the PI film corresponds to the lower surface thereof.
可选的，第一光转换层的表面呈弧形，弧形的高度由中间往两侧逐渐降低，弧形两侧与PI膜的夹角为锐角或钝角。Optionally, the surface of the first light conversion layer has an arc shape, and the height of the arc gradually decreases from the middle to the both sides, and an angle between the two sides of the curved shape and the PI film is an acute angle or an obtuse angle.
根据本发明的另一个实施例，公开一种LED灯丝，包括LED段、导体段、至少两个电极以及光转换层，导体段位于相邻两LED段之间，电极对应于LED段配置，且电性连接LED段，相邻两LED段通过导体段相互电性连接；LED段包括至少两个LED芯片，LED芯片间通过导线相互电性连接；光转换层覆盖于LED段、导体段与电极，并分别使两个电极的一部分外露。According to another embodiment of the present invention, an LED filament is disclosed, including an LED segment, a conductor segment, at least two electrodes, and a light conversion layer, the conductor segment being located between adjacent LED segments, the electrode corresponding to the LED segment configuration, and The LED segments are electrically connected, and the adjacent two LED segments are electrically connected to each other through the conductor segments; the LED segments include at least two LED chips, and the LED chips are electrically connected to each other through the wires; the light conversion layer covers the LED segments, the conductor segments and the electrodes And respectively expose a part of the two electrodes.
可选的，导体段包括连接LED段的导体，导线的长度小于导体的长度Optionally, the conductor segment comprises a conductor connecting the LED segments, the length of the conductor being less than the length of the conductor
可选的，光转换层可至少具有一顶层及一基层。Optionally, the light conversion layer may have at least one top layer and one base layer.
根据本发明的另一个实施例，公开一种LED灯丝，包括LED段、导体段、至少两个电极以及光转换层，导体段位于相邻两LED段之间，电极对应于LED段配置，且电性连接LED段，导体段位于相邻两LED段之间，导体段与LED段通过导线进行电性连接。According to another embodiment of the present invention, an LED filament is disclosed, including an LED segment, a conductor segment, at least two electrodes, and a light conversion layer, the conductor segment being located between adjacent LED segments, the electrode corresponding to the LED segment configuration, and The LED segments are electrically connected, and the conductor segments are located between adjacent LED segments, and the conductor segments and the LED segments are electrically connected by wires.
可选的，LED段包括至少两个LED芯片，LED芯片间通过导线相互电性连接。Optionally, the LED segment comprises at least two LED chips, and the LED chips are electrically connected to each other through wires.
可选的，导体段可包括波浪状的凹陷结构、波浪状的凸起结构或螺旋结构。Alternatively, the conductor segments may include a wavy concave structure, a wavy convex structure or a spiral structure.
可选的，LED灯丝可包括辅助条，辅助条贯穿导体段。Optionally, the LED filament may include an auxiliary strip that penetrates the conductor segment.
可选的，导体段中的导体具有波浪状的结构。Alternatively, the conductors in the conductor segments have a wavy structure.
可选的，LED段与导体段分别具有不同的颗粒，或LED段与导体段的光转换层是由不同的材质制成。Optionally, the LED segments and the conductor segments respectively have different particles, or the light conversion layers of the LED segments and the conductor segments are made of different materials.
根据本发明的另一个实施例，公开一种LED灯丝，包括基层以及设置于所述基 层上的芯片和顶层；顶层两侧自然塌陷形成具有圆弧状的表面，在LED灯丝的高度方向上，基层的厚度小于或等于顶层的厚度。According to another embodiment of the present invention, an LED filament is disclosed, comprising a base layer and a chip and a top layer disposed on the base layer; both sides of the top layer are naturally collapsed to form an arc-shaped surface, in the height direction of the LED filament, The thickness of the base layer is less than or equal to the thickness of the top layer.
可选的，顶层的荧光粉浓度可大于基层的荧光粉浓度。Alternatively, the phosphor concentration of the top layer may be greater than the phosphor concentration of the base layer.
可选的，在LED灯丝的宽度方向上，基层或顶层的宽度W1与芯片的宽度W2之间的比例关系为W1：W2＝1:0.8～0.9。Optionally, in the width direction of the LED filament, the proportional relationship between the width W1 of the base layer or the top layer and the width W2 of the chip is W1: W2=1: 0.8-0.9.
根据本发明的另一个实施例，公开一种LED灯丝，包括多个LED芯片单元、导体、至少两个电极；导体位于相邻两LED芯片单元之间，LED芯片单元处于不同的高度，电极对应于LED芯片单元配置，且通过导线电性连接LED芯片单元，相邻两LED芯片单元通过导体相互电性连接，导体与灯丝的长度延伸方向的夹角为30°～120°。According to another embodiment of the present invention, an LED filament is disclosed, comprising a plurality of LED chip units, a conductor, and at least two electrodes; the conductor is located between two adjacent LED chip units, the LED chip units are at different heights, and the electrodes correspond to The LED chip unit is configured, and the LED chip unit is electrically connected by a wire. The adjacent two LED chip units are electrically connected to each other through a conductor, and the angle between the conductor and the length of the filament extending direction is 30° to 120°.
根据本发明的另一个实施例，本发明提出一种适于制作灯丝基材或光转换层的组合物，此组合物至少包含主材料、改性剂以及添加剂。主材料为一种有机硅改性聚酰亚胺，改性剂为一种热固化剂，添加料则是添加于主材料中的微粒子，可包含荧光粉、散热粒子以及偶联剂。According to another embodiment of the invention, the invention provides a composition suitable for making a filament substrate or a light converting layer comprising at least a host material, a modifier and an additive. The main material is a silicone modified polyimide, the modifier is a thermal curing agent, and the additive is a microparticle added to the main material, and may include a phosphor, a heat dissipating particle, and a coupling agent.
根据本发明的另一个实施例，本发明提出一种适于制作灯丝基材或光转换层的组合物，此组合物中的主材料为一种有机硅改性聚酰亚胺，是一种含有硅氧烷的聚酰亚胺，其中，有机硅改性聚酰亚胺，包括通式(Ⅰ)所表示的重复单元：According to another embodiment of the present invention, the present invention provides a composition suitable for making a filament substrate or a light conversion layer, the main material of which is a silicone modified polyimide, which is a kind a siloxane-containing polyimide, wherein the silicone-modified polyimide comprises a repeating unit represented by the formula (I):
可选的，通式(Ⅰ)中，Ar1为具有苯环或脂环式烃结构的4价有机基团，Ar2为2价有机基团，R分别独立地选自甲基或苯基，n为1～5。Alternatively, in the formula (I), Ar1 is a tetravalent organic group having a benzene ring or an alicyclic hydrocarbon structure, Ar2 is a divalent organic group, and R is independently selected from a methyl group or a phenyl group, n It is 1 to 5.
可选的，其中所述Ar1是具有单环系脂环式烃结构或含有桥环的脂环式烃结构的4价有机基团。Alternatively, the Ar1 is a tetravalent organic group having a monocyclic alicyclic hydrocarbon structure or an alicyclic hydrocarbon structure containing a bridged ring.
可选的，根据本发明的另一实施方式，其中所述Ar2为具有单环系的脂环式烃结构的2价有机基团。Alternatively, according to another embodiment of the present invention, the Ar2 is a divalent organic group having a monocyclic alicyclic hydrocarbon structure.
根据本发明的另一个实施例，公开一种LED球泡灯，所述LED球泡灯包括灯壳、灯头、两个导电支架、芯柱与LED灯丝。所述灯头连接所述灯壳，所述两个导电支架设置于所述灯壳中，所述芯柱自所述灯头延伸至所述灯壳内，而所述LED灯丝包括多个LED芯片与两个电极。所述LED芯片沿着所述LED灯丝的延伸方向排成阵列，所述两个电极分别设置于所述LED灯丝的两端且连接所述LED芯片，且所述两个电极分别连接所述两个导电支架。所述LED灯丝弯曲以满足对称特性，所述对称特性为：当所述LED球泡灯的顶视图呈 现于定义有四个象限的二维坐标系中，且此四个象限具有横越所述芯柱的X轴、横越所述芯柱的Y轴与原点，所述LED灯丝在所述顶视图中位于第一象限的部分所呈现的亮度，会相对于Y轴对称于所述LED灯丝在所述顶视图中位于第二象限的部分所呈现的亮度及/或相对于原点对称于所述LED灯丝在所述顶视图中位于第三象限的部分所呈现的亮度；以及当所述LED球泡灯的侧视图呈现于定义有四个象限的二维坐标系中，且此四个象限具有对齐所述芯柱的Y’轴、横越Y’轴的X’轴与原点，所述LED灯丝在所述侧视图中位于第一象限的部分所呈现的亮度，会相对于Y’轴对称于所述LED灯丝在所述侧视图中位于第二象限的部分所呈现的亮度。In accordance with another embodiment of the present invention, an LED bulb is disclosed that includes a lamp housing, a lamp cap, two conductive brackets, a stem, and an LED filament. The lamp cap is connected to the lamp housing, the two conductive brackets are disposed in the lamp housing, the core post extends from the lamp cap into the lamp housing, and the LED filament comprises a plurality of LED chips and Two electrodes. The LED chips are arranged in an array along the extending direction of the LED filaments, the two electrodes are respectively disposed at two ends of the LED filament and connected to the LED chip, and the two electrodes are respectively connected to the two LEDs Conductive brackets. The LED filament is bent to satisfy a symmetrical characteristic, wherein the top view of the LED bulb is presented in a two-dimensional coordinate system defined with four quadrants, and the four quadrants have a cross over the core The X-axis of the column, across the Y-axis of the stem and the origin, the brightness of the LED filament in the first quadrant in the top view is symmetric with respect to the Y-axis a brightness in a portion of the top view that is present in the second quadrant and/or a brightness that is symmetric with respect to the origin relative to a portion of the LED filament that is in the third quadrant in the top view; and when the LED bulb A side view of the lamp is presented in a two-dimensional coordinate system defined with four quadrants having a Y' axis aligned with the stem, an X' axis traversing the Y' axis, and an origin, the LED filament being The brightness of the portion of the side view that is located in the first quadrant is symmetrical with respect to the Y' axis to the brightness exhibited by the portion of the LED filament that is in the second quadrant in the side view.
根据本发明的另一个实施例，公开一种LED球泡灯，所述LED球泡灯包括灯壳、灯头、两个导电支架、芯柱与LED灯丝。所述灯头连接所述灯壳，所述两个导电支架设置于所述灯壳中，所述芯柱自所述灯头延伸至所述灯壳内，而所述LED灯丝包括多个LED芯片与两个电极。所述LED芯片沿着所述LED灯丝的延伸方向排成阵列，所述两个电极分别设置于所述LED灯丝的两端且连接所述LED芯片，且所述两个电极分别连接所述两个导电支架。所述LED灯丝弯曲以满足对称特性，所述对称特性为：当所述LED球泡灯的顶视图呈现于定义有四个象限的二维坐标系中，且此四个象限具有横越所述芯柱的X轴、横越所述芯柱的Y轴与原点，所述LED灯丝在所述顶视图中位于第一象限的部分的结构，会相对于Y轴对称于所述LED灯丝在所述顶视图中位于第二象限的部分的结构及/或相对于原点对称于所述LED灯丝在所述顶视图中位于第三象限的部分的结构；以及当所述LED球泡灯的侧视图呈现于定义有四个象限的二维坐标系中，且此四个象限具有对齐所述芯柱的Y’轴、横越Y’轴的X’轴与原点，所述LED灯丝在所述侧视图中位于第一象限的部分的结构，会相对于Y’轴对称于所述LED灯丝在所述侧视图中位于第二象限的部分的结构。In accordance with another embodiment of the present invention, an LED bulb is disclosed that includes a lamp housing, a lamp cap, two conductive brackets, a stem, and an LED filament. The lamp cap is connected to the lamp housing, the two conductive brackets are disposed in the lamp housing, the core post extends from the lamp cap into the lamp housing, and the LED filament comprises a plurality of LED chips and Two electrodes. The LED chips are arranged in an array along the extending direction of the LED filaments, the two electrodes are respectively disposed at two ends of the LED filament and connected to the LED chip, and the two electrodes are respectively connected to the two LEDs Conductive brackets. The LED filament is bent to satisfy a symmetrical characteristic, wherein the top view of the LED bulb is presented in a two-dimensional coordinate system defined with four quadrants, and the four quadrants have a cross over the core The X-axis of the column, across the Y-axis of the stem and the origin, the structure of the portion of the LED filament in the first quadrant in the top view, symmetrical to the Y-axis at the top of the LED filament a structure of a portion of the view in the second quadrant and/or a structure symmetrical with respect to the origin to a portion of the LED filament located in the third quadrant in the top view; and when the side view of the LED bulb is presented Defined in a two-dimensional coordinate system having four quadrants having a Y' axis aligned with the stem, an X' axis traversing the Y' axis, and an origin, the LED filament being located in the side view The structure of the portion of the first quadrant is symmetrical with respect to the Y' axis to the structure of the portion of the LED filament that is located in the second quadrant in the side view.
根据本发明的一个实施例，公开一种LED球泡灯，所述LED球泡灯包括灯壳、灯头、两个导电支架、芯柱与LED灯丝。所述灯头连接所述灯壳，所述两个导电支架设置于所述灯壳中，所述芯柱自所述灯头延伸至所述灯壳内，而所述LED灯丝包括多个LED芯片与两个电极。所述LED芯片沿着所述LED灯丝的延伸方向排成阵列，所述两个电极分别设置于所述LED灯丝的两端且连接所述LED芯片，且所述两个电极分别连接所述两个导电支架。所述LED灯丝弯曲以满足对称特性，所述对称特性为：当所述LED球泡灯的顶视图呈现于定义有四个象限的二维坐标系中，且此四个象限具有横越所述芯柱的X轴、横越所述芯柱的Y轴与原点，所述LED灯丝在所述顶视图中位于第一象限的部分的长度，会等于所述LED灯丝在所述顶视图中位于第二象限的部分的长度及/或等于所述LED灯丝在所述顶视图中位于第三象限的部分的长度；以及当所述LED球泡灯的侧视图呈现于定义有四个象限的二维坐标系中，且此四个象限具有对齐所述芯柱的Y’轴、横越Y’轴的X’轴与原点，所述LED灯丝在所述侧视图中位于第一象限的部分的长度，会等于所述LED灯丝在所述侧视图中位于第二象限的部分的长度。According to an embodiment of the invention, an LED bulb is disclosed, the LED bulb comprising a lamp housing, a lamp cap, two conductive brackets, a stem and an LED filament. The lamp cap is connected to the lamp housing, the two conductive brackets are disposed in the lamp housing, the core post extends from the lamp cap into the lamp housing, and the LED filament comprises a plurality of LED chips and Two electrodes. The LED chips are arranged in an array along the extending direction of the LED filaments, the two electrodes are respectively disposed at two ends of the LED filament and connected to the LED chip, and the two electrodes are respectively connected to the two LEDs Conductive brackets. The LED filament is bent to satisfy a symmetrical characteristic, wherein the top view of the LED bulb is presented in a two-dimensional coordinate system defined with four quadrants, and the four quadrants have a cross over the core The X-axis of the column, across the Y-axis of the stem and the origin, the length of the LED filament in the top view in the top view, which is equal to the LED filament being in the top view The length of the portion of the quadrant and/or the length of the portion of the LED filament that is in the third quadrant in the top view; and when the side view of the LED bulb is presented in two-dimensional coordinates defining four quadrants In the system, and the four quadrants have a Y' axis aligned with the stem, an X' axis that traverses the Y' axis, and an origin, the length of the LED filament in the first quadrant in the side view, Equal to the length of the portion of the LED filament that is in the second quadrant in the side view.
根据本发明的另一个实施例，公开一种LED球泡灯的出光光谱示意图，所述LED 球泡灯可以是先前的各实施例所揭示的任一LED球泡灯，所述LED球泡灯的光谱主要分布于波长400nm至800nm之间，且在此范围中的三处出现有三个峰值P1、P2、P3；峰值P1约在波长430nm至480nm之间，峰值P2约在波长580nm至620nm之间，而峰值P3约在波长680nm至750nm之间；在强度上，峰值P1的强度小于峰值P2的强度，而峰值P2的强度小于峰值P3的强度。According to another embodiment of the present invention, a schematic diagram of an emission spectrum of an LED bulb, which may be any of the LED bulbs disclosed in the previous embodiments, is disclosed. The spectrum is mainly distributed between wavelengths of 400 nm and 800 nm, and three peaks P1, P2, and P3 appear in three places in the range; the peak P1 is between about 430 nm and 480 nm, and the peak P2 is about 580 nm to 620 nm. Meanwhile, the peak value P3 is approximately between 680 nm and 750 nm; in intensity, the intensity of the peak P1 is less than the intensity of the peak P2, and the intensity of the peak P2 is less than the intensity of the peak P3.
根据本发明的另一个实施例，公开一种LED电源模块，所述电源模块设于LED球泡灯灯头内，所述电源模块包括整流电路、滤波电路以及驱动电路。所述整流电路耦接第一接脚与第二接脚，以接收外部驱动信号。所述第一接脚与所述第二接脚分别连接至所述灯头的第一区域及第二区域，其中所述第一区域及所述第二区域电性独立。所述整流电路用以对外部驱动信号进行整流，藉以输出整流后信号。滤波电路耦接所述整流电路，用以对所述整流后信号进行滤波，并据以产生滤波后信号。驱动电路耦接所述滤波电路和所述LED发光部，用以对所述滤波后信号进行电源转换，并据以产生驱动电源，其中所述LED发光部响应于所述驱动电源而点亮。According to another embodiment of the present invention, an LED power module is disclosed. The power module is disposed in a LED bulb lamp head. The power module includes a rectifier circuit, a filter circuit, and a driving circuit. The rectifier circuit is coupled to the first pin and the second pin to receive an external driving signal. The first pin and the second pin are respectively connected to the first region and the second region of the lamp cap, wherein the first region and the second region are electrically independent. The rectifier circuit is configured to rectify an external driving signal to output a rectified signal. The filter circuit is coupled to the rectifier circuit for filtering the rectified signal and generating a filtered signal accordingly. The driving circuit is coupled to the filter circuit and the LED light emitting portion for performing power conversion on the filtered signal, and accordingly generating a driving power source, wherein the LED light emitting portion is lit in response to the driving power source.
本发明由于采用了以上技术方案，至少可达成了以下所述有益效果之一或其任意组合：(1)在LED灯丝基板上粘贴有铜箔和LED芯片，每个LED芯片及与LED芯片相连接的第一导线和第二导线单独用第一光转换层包裹，增加了热辐射面积，提升了散热效果和出光效率；(2)可实现灯丝弯折点亮，降低了导线的脱落概率，增加了产品的可靠度；(3)将LED灯丝结构区分为LED段和导体段，因此LED灯丝在弯折时容易将应力集中于导体段，使LED段中连接相邻芯片的金线在弯折时减少断裂的机率，藉此提升LED灯丝整体质量；此外，导体段采用铜箔结构，减少金属打线长度，进一步降低导体段金属打线断裂的机率；(4)透过理想公式设计LED灯丝结构，可提升整体发光效率；(5)导体或连接LED芯片单元与导体的导线与LED灯丝的长度延伸方向存在夹角，可有效减少灯丝弯折时在导体截面积上的内用力，同时减少了LED灯丝弯折断裂的机率，提升了LED灯丝的整体质量；(6)(材料)以有机硅改性聚酰亚胺作为主体，添加热固化剂后所得的有机硅改性聚酰亚胺树脂组合物具有优异的耐热性能、机械强度和透光性；而采用有机硅改性聚酰亚胺树脂组合物作为灯丝基材，灯丝具有良好的可饶性，使灯丝呈现出多样的形状，实现360°全周光照明；(7)LED球泡灯包括有单一LED灯丝，且LED灯丝具有对称特性，此种对称特性有助于产生均匀、宽广的光线分布，使得LED球泡灯能够产生全周光的效果；(8)特殊的光谱设计，有别于传统LED光谱分布图形，更接近传统白炽光的光谱分布，也接近自然光的光谱分布，提升人体对光照的舒适性；以及(9)电源电路能够给出稳定的电流使LED灯丝在点亮时的纹波足够低，进而令使用者不至于感受到闪烁。The present invention adopts the above technical solutions, and at least can achieve one of the following beneficial effects or any combination thereof: (1) A copper foil and an LED chip are pasted on the LED filament substrate, and each LED chip and the LED chip are The connected first wire and the second wire are separately wrapped by the first light conversion layer, which increases the heat radiation area, improves the heat dissipation effect and the light extraction efficiency; (2) can realize the bending of the filament and reduce the probability of the wire falling off, Increase the reliability of the product; (3) Divide the LED filament structure into LED segments and conductor segments, so the LED filaments tend to concentrate stress on the conductor segments when bent, so that the gold wires connecting the adjacent chips in the LED segments are bent. Reduce the probability of breakage when folding, thereby improving the overall quality of the LED filament; in addition, the conductor segment is made of copper foil structure, which reduces the length of the metal wire and further reduces the probability of metal wire breakage in the conductor segment; (4) Design the LED through the ideal formula The filament structure can improve the overall luminous efficiency; (5) the conductor or the wire connecting the LED chip unit and the conductor has an angle with the extending direction of the LED filament, which can effectively reduce the conductor cross section when the filament is bent The internal force on the upper side reduces the probability of bending and breaking of the LED filament, and improves the overall quality of the LED filament; (6) (material) is made of silicone modified polyimide as the main body, and the organic obtained by adding the thermosetting agent The silicon-modified polyimide resin composition has excellent heat resistance, mechanical strength and light transmittance; and the silicone-modified polyimide resin composition is used as a filament substrate, and the filament has good resilience. The filament is presented in a variety of shapes to achieve 360° full-circumference illumination; (7) the LED bulb includes a single LED filament, and the LED filament has symmetrical characteristics, which contribute to uniform, broad light distribution The LED bulb can produce full-circumferential effect; (8) The special spectral design is different from the traditional LED spectral distribution pattern, closer to the spectral distribution of traditional incandescent light, and close to the spectral distribution of natural light, improving the human body. The comfort of the light; and (9) the power supply circuit can give a stable current so that the ripple of the LED filament when lighting is low enough, so that the user does not feel the flicker.
附图说明DRAWINGS
图1A与图1B所示为根据本发明一实施例的LED球泡灯示意图；1A and 1B are schematic views of an LED bulb according to an embodiment of the invention;
图2所示为本发明发光部一实施例的立体局部剖面示意图；2 is a perspective, partial, cross-sectional view showing an embodiment of a light-emitting portion of the present invention;
图3A至3F所示为本发明LED灯丝实施例的立体局部剖面示意图；3A to 3F are schematic perspective partial cross-sectional views showing an embodiment of an LED filament according to the present invention;
图4A至4F所示为本发明的分段式LED灯丝的多个实施例的结构示意图；4A to 4F are schematic structural views showing a plurality of embodiments of the segmented LED filament of the present invention;
图4G所示为图4F的LED灯丝的弯折状态的示意图；4G is a schematic view showing a bent state of the LED filament of FIG. 4F;
图4H至图4K所示为本发明的分段式的LED灯丝的多个实施例的结构示意图；4H to 4K are schematic structural views showing a plurality of embodiments of the segmented LED filament of the present invention;
图5所示为本发明LED灯丝一实施例的立体局部剖面示意图；Figure 5 is a perspective, partial, cross-sectional view showing an embodiment of an LED filament according to the present invention;
图6A所示为本发明的分段式的LED灯丝的另一实施例的结构示意图；6A is a schematic structural view showing another embodiment of the segmented LED filament of the present invention;
图6B至图6J所示为本发明的分段式的LED灯丝的多个实施例的结构示意图；6B to 6J are schematic structural views showing a plurality of embodiments of the segmented LED filament of the present invention;
图6K与图6L所示为本发明的分段式的LED灯丝的另一实施例的立体示意图；6K and 6L are perspective views showing another embodiment of the segmented LED filament of the present invention;
图6M所示为图6L的局部顶视图；Figure 6M is a partial top view of Figure 6L;
图7所示为本发明LED灯丝层状结构一实施例的结构示意图；7 is a schematic structural view of an embodiment of a layered structure of an LED filament according to the present invention;
图8所示为本发明灯丝层状结构不同实施例的截面示意图；Figure 8 is a cross-sectional view showing a different embodiment of the filament layered structure of the present invention;
图9所示为本发明灯丝层状结构不同实施例的截面示意图；Figure 9 is a schematic cross-sectional view showing a different embodiment of the filament layered structure of the present invention;
图10所示为本发明灯丝封装构造不同实施例的截面图；Figure 10 is a cross-sectional view showing a different embodiment of the filament package structure of the present invention;
图11所示为本发明灯丝封装构造不同实施例的截面图；Figure 11 is a cross-sectional view showing a different embodiment of the filament package structure of the present invention;
图12所示为本发明LED灯丝截成两部分示意的一实施例的截面图；Figure 12 is a cross-sectional view showing an embodiment of the LED filament of the present invention in two parts;
图13所示为本发明LED灯丝截成两部分示意的一实施例的截面图；Figure 13 is a cross-sectional view showing an embodiment of the LED filament of the present invention in two parts;
图14A所示为本发明灯丝层状结构不同实施例的截面示意图；Figure 14A is a schematic cross-sectional view showing a different embodiment of the filament layered structure of the present invention;
图14B所示为出本发明灯丝导体一实施例的俯视图；Figure 14B is a plan view showing an embodiment of the filament conductor of the present invention;
图14C所示为出本发明灯丝导体一实施例的俯视图；Figure 14C is a plan view showing an embodiment of the filament conductor of the present invention;
图14D所示为出本发明灯丝导体一实施例的侧视图；Figure 14D is a side elevational view of an embodiment of the filament conductor of the present invention;
图14E至图14I分别所示为出本发明灯丝导体一实施例的底视图；14E to 14I are respectively bottom views of an embodiment of the filament conductor of the present invention;
图14J至图14M所示为增加接合强度的灯丝层状结构的一实施例，其中图14J所示为导体的立体图，图14K所示为顶层、导体及基层的立体图，图14L、图14M所示为图14K中E1-E2线的两种不同情况下的截面图；14J to 14M show an embodiment of a filament layer structure for increasing the joint strength, wherein FIG. 14J is a perspective view of the conductor, and FIG. 14K is a perspective view of the top layer, the conductor and the base layer, and FIG. 14L and FIG. 14M. Shown in cross section in two different cases of the E1-E2 line in Figure 14K;
图14N所示为本发明导体的一实施例的截面示意图；Figure 14N is a schematic cross-sectional view showing an embodiment of the conductor of the present invention;
图14O所示为本发明图14A所示灯丝的一种弯折方式；Figure 14O shows a bending manner of the filament of Figure 14A of the present invention;
图15所示为本发明灯丝封装构造不同实施例的截面图；Figure 15 is a cross-sectional view showing a different embodiment of the filament package structure of the present invention;
图16所示为本发明灯丝封装构造不同实施例的截面图；Figure 16 is a cross-sectional view showing a different embodiment of the filament package structure of the present invention;
图17A至图17D所示为本发明灯丝中不同实施例的横切面示意图；17A to 17D are schematic cross-sectional views showing different embodiments of the filament of the present invention;
图17E和图17F所示为图17A、17B中增加芯片摆放的示意图；17E and 17F are schematic views showing the arrangement of adding chips in FIGS. 17A and 17B;
图18所示为本发明LED芯片发出的光经过的界面示意图；Figure 18 is a schematic view showing the interface of light emitted by the LED chip of the present invention;
图19A所示为LED灯丝单元在LED灯丝轴向方向上的横截面示意图；Figure 19A is a cross-sectional view showing the LED filament unit in the axial direction of the LED filament;
图19B所示为LED灯丝单元在LED灯丝径向方向上的横截面示意图；Figure 19B is a cross-sectional view showing the LED filament unit in the radial direction of the LED filament;
图20A和图20B所示为不同顶层420a形状的LED灯丝单元400a1的截面图；20A and 20B are cross-sectional views showing LED filament units 400a1 of different top layers 420a shape;
图20C所示为本发明灯丝中不同实施例的横切面示意图；Figure 20C is a cross-sectional view showing a different embodiment of the filament of the present invention;
图21A至图21I所示为本发明的不同实施例的俯视示意图；21A to 21I are schematic plan views of different embodiments of the present invention;
图22A所示为本发明LED灯丝层状结构一实施例的结构示意图；22A is a schematic structural view showing an embodiment of a layered structure of an LED filament according to the present invention;
图22B所示为一实施例的LED芯片焊线的结构示意图；FIG. 22B is a schematic structural view of an LED chip bonding wire of an embodiment; FIG.
图23所示为加入热固化剂前后的聚酰亚胺TMA分析图；Figure 23 is a graph showing the analysis of polyimide TMA before and after the addition of a thermosetting agent;
图24所示为不同规格散热粒子的粒度分布图；Figure 24 is a graph showing the particle size distribution of heat dissipating particles of different specifications;
图25A所示为本发明有机硅改性聚酰亚胺树脂组合物复合膜的SEM图；25A is an SEM image showing a composite film of a silicone-modified polyimide resin composition of the present invention;
图25B和图25C所示为本发明有机硅改性聚酰亚胺树脂组合物复合膜实施例的截面示意图；25B and 25C are schematic cross-sectional views showing an embodiment of a composite film of a silicone-modified polyimide resin composition of the present invention;
图26A所示为使用本发明LED灯丝的LED球泡灯的示意图；Figure 26A is a schematic view showing an LED bulb using the LED filament of the present invention;
图26B所示为图26A的虚线圆圈处的放大截面图；Figure 26B is an enlarged cross-sectional view showing the dotted circle of Figure 26A;
图26C所示为图26A的LED球泡灯的LED灯丝在顶视图的投影；；Figure 26C is a projection of the LED filament of the LED bulb of Figure 26A in a top view;
图27A所示为使用本发明LED灯丝的另一LED球泡灯的示意图；Figure 27A is a schematic view showing another LED bulb using the LED filament of the present invention;
图27B所示为图27A的LED球泡灯的前视图；Figure 27B is a front elevational view of the LED bulb of Figure 27A;
图27C所示为图27A的LED球泡灯的顶视图；Figure 27C is a top plan view of the LED bulb of Figure 27A;
图27D为图27B的LED灯丝呈现在定义有四个象限的二维坐标系中；Figure 27D shows the LED filament of Figure 27B in a two-dimensional coordinate system defined with four quadrants;
图27E为图27C的LED灯丝呈现在定义有四个象限的二维坐标系中；Figure 27E is the LED filament of Figure 27C presented in a two-dimensional coordinate system defined with four quadrants;
图28A所示为根据本发明的一个实施例的LED球泡灯的示意图；Figure 28A is a schematic illustration of an LED bulb in accordance with one embodiment of the present invention;
图28B所示为图28A的LED球泡灯的侧视图；Figure 28B is a side elevational view of the LED bulb of Figure 28A;
图28C所示为图28A的LED球泡灯的顶视图；Figure 28C is a top plan view of the LED bulb of Figure 28A;
图29A所示为根据本发明的一个实施例的LED球泡灯的示意图；Figure 29A is a schematic illustration of an LED bulb in accordance with one embodiment of the present invention;
图29B所示为图29A的LED球泡灯的侧视图；Figure 29B is a side elevational view of the LED bulb of Figure 29A;
图29C所示为图29A的LED球泡灯的顶视图；Figure 29C is a top plan view of the LED bulb of Figure 29A;
图30A所示为根据本发明的一个实施例的LED球泡灯的示意图；Figure 30A is a schematic illustration of an LED bulb in accordance with one embodiment of the present invention;
图30B所示为图30A的LED球泡灯的侧视图；Figure 30B is a side elevational view of the LED bulb of Figure 30A;
图30C所示为图30A的LED球泡灯的顶视图；Figure 30C is a top plan view of the LED bulb of Figure 30A;
图31A所示为根据本发明的一个实施例的LED球泡灯的示意图；Figure 31A is a schematic illustration of an LED bulb in accordance with one embodiment of the present invention;
图31B所示为图31A的LED球泡灯的侧视图；Figure 31B is a side elevational view of the LED bulb of Figure 31A;
图31C所示为图31A的LED球泡灯的顶视图；Figure 31C is a top plan view of the LED bulb of Figure 31A;
图32A所示为根据本发明的一个实施例的LED球泡灯的示意图；Figure 32A is a schematic illustration of an LED bulb in accordance with one embodiment of the present invention;
图32B所示为图32A的LED球泡灯的侧视图；Figure 32B is a side elevational view of the LED bulb of Figure 32A;
图32C所示为图32A的LED球泡灯的顶视图；Figure 32C is a top plan view of the LED bulb of Figure 32A;
图33A所示为根据本发明的一个实施例的LED球泡灯的示意图；Figure 33A is a schematic illustration of an LED bulb in accordance with one embodiment of the present invention;
图33B所示为图33A的LED球泡灯的侧视图；Figure 33B is a side elevational view of the LED bulb of Figure 33A;
图33C所示为图33A的LED球泡灯的顶视图；Figure 33C is a top plan view of the LED bulb of Figure 33A;
图34A所示为根据本发明的一个实施例的LED球泡灯的示意图；Figure 34A is a schematic illustration of an LED bulb in accordance with one embodiment of the present invention;
图34B所示为图34A的LED球泡灯的侧视图；Figure 34B is a side elevational view of the LED bulb of Figure 34A;
图34C所示为图34A的LED球泡灯的顶视图；Figure 34C is a top plan view of the LED bulb of Figure 34A;
图35A至图35C所示分别为根据本发明的一个实施例的LED球泡灯的示意图、侧视图与顶视图；35A to 35C are respectively a schematic view, a side view and a top view of an LED bulb according to an embodiment of the present invention;
图36A至图36C所示分别为根据本发明的一个实施例的LED球泡灯的示意图、侧视图与顶视图；36A to 36C are respectively a schematic, side and top views of an LED bulb according to an embodiment of the present invention;
图37A至图37C所示分别为根据本发明的一个实施例的LED球泡灯的示意图、侧视图与顶视图；37A to 37C are respectively a schematic, side and top views of an LED bulb according to an embodiment of the present invention;
图38A至图38C所示分别为根据本发明的一个实施例的LED球泡灯的示意图、侧视图与顶视图；38A to 38C are respectively a schematic view, a side view and a top view of an LED bulb according to an embodiment of the present invention;
图39A至图39C所示分别为根据本发明的一个实施例的LED球泡灯的示意图、侧视图与顶视图；39A to 39C are respectively a schematic view, a side view and a top view of an LED bulb according to an embodiment of the present invention;
图40A至图40C所示分别为根据本发明的一个实施例的LED球泡灯的示意图、侧视图与顶视图；40A to 40C are respectively a schematic view, a side view and a top view of an LED bulb according to an embodiment of the present invention;
图41A至图41C所示分别为根据本发明的一个实施例的LED球泡灯的示意图、侧视图与顶视图；41A to 41C are respectively a schematic view, a side view and a top view of an LED bulb according to an embodiment of the present invention;
图42A至图42C所示分别为根据本发明的一个实施例的LED球泡灯的示意图、侧视图与顶视图；42A to 42C are respectively a schematic view, a side view and a top view of an LED bulb according to an embodiment of the present invention;
图43A至图43C所示分别为根据本发明的一个实施例的LED球泡灯的示意图、侧视图与顶视图；43A to 43C are respectively a schematic view, a side view and a top view of an LED bulb according to an embodiment of the present invention;
图44A至图44C所示分别为根据本发明的一个实施例的LED球泡灯的示意图、侧视图与顶视图；44A to 44C are respectively a schematic, side and top views of an LED bulb according to an embodiment of the present invention;
图45A至图45C所示分别为根据本发明的一个实施例的LED球泡灯的示意图、侧视图与顶视图；45A to 45C are respectively a schematic view, a side view and a top view of an LED bulb according to an embodiment of the present invention;
图46A至图46C所示分别为根据本发明的一个实施例的LED球泡灯的示意图、侧视图与顶视图；46A to 46C are respectively a schematic, side and top views of an LED bulb according to an embodiment of the present invention;
图47A与图47B所示分别为根据本发明的一个实施例的LED球泡灯的示意图与顶视图；47A and 47B are respectively a schematic view and a top view of an LED bulb according to an embodiment of the present invention;
图48A至图48C所示分别为根据本发明的一个实施例的LED球泡灯的示意图、侧视图与顶视图；48A to 48C are respectively a schematic view, a side view and a top view of an LED bulb according to an embodiment of the present invention;
图49A至图49C所示分别为根据本发明的一个实施例的LED球泡灯的示意图、侧视图与顶视图；49A to 49C are respectively a schematic, side and top views of an LED bulb according to an embodiment of the present invention;
图50A至图50C所示分别为根据本发明的一个实施例的LED球泡灯的示意图、侧视图与顶视图；50A to 50C are respectively a schematic view, a side view and a top view of an LED bulb according to an embodiment of the present invention;
图51A至图51C所示分别为根据本发明的一个实施例的LED球泡灯的示意图、侧视图与顶视图；以及51A to 51C are respectively a schematic, side and top views of an LED bulb according to an embodiment of the present invention;
图52A至图52D所示分别为根据本发明的一个实施例的LED球泡灯的示意图、侧视图、另一侧视图与顶视图；52A to 52D are respectively a schematic view, a side view, another side view and a top view of an LED bulb according to an embodiment of the present invention;
图53A至图53D所示分别为根据本发明的一个实施例的LED球泡灯的示意图、侧视图、另一侧视图与顶视图；53A to 53D are respectively a schematic view, a side view, another side view and a top view of an LED bulb according to an embodiment of the present invention;
图54A至图54D所示分别为根据本发明的一个实施例的LED球泡灯的示意图、侧视图、另一侧视图与顶视图；54A to 54D are respectively a schematic view, a side view, another side view and a top view of an LED bulb according to an embodiment of the present invention;
图55A至图55D所示分别为根据本发明的一个实施例的LED球泡灯的示意图、侧视图、另一侧视图与顶视图；55A to 55D are respectively a schematic view, a side view, another side view and a top view of an LED bulb according to an embodiment of the present invention;
图56A至图56D所示分别为根据本发明的一个实施例的LED球泡灯的示意图、侧视图、另一侧视图与顶视图；56A to 56D are respectively a schematic view, a side view, another side view and a top view of an LED bulb according to an embodiment of the present invention;
图57A至图57D所示分别为根据本发明的一个实施例的LED球泡灯的示意图、侧视图、另一侧视图与顶视图；57A to 57D are respectively a schematic view, a side view, another side view and a top view of an LED bulb according to an embodiment of the present invention;
图58A至图58D所示分别为根据本发明的一个实施例的LED球泡灯的示意图、侧视图、另一侧视图与顶视图；58A to 58D are respectively a schematic view, a side view, another side view and a top view of an LED bulb according to an embodiment of the present invention;
图59A至图59D所示分别为根据本发明的一个实施例的LED球泡灯的示意图、侧视图、另一侧视图与顶视图；59A to 59D are respectively a schematic view, a side view, another side view and a top view of an LED bulb according to an embodiment of the present invention;
图60A至图60D所示分别为根据本发明的一个实施例的LED球泡灯的示意图、侧视图、另一侧视图与顶视图；60A to 60D are respectively a schematic view, a side view, another side view and a top view of an LED bulb according to an embodiment of the present invention;
图61所示为本发明的一个实施例的LED球泡灯的出光光谱示意图；Figure 61 is a schematic view showing the light emission spectrum of an LED bulb according to an embodiment of the present invention;
图62所示为本发明的另一个实施例的LED球泡灯的出光光谱示意图；Figure 62 is a schematic view showing the light emission spectrum of an LED bulb according to another embodiment of the present invention;
图63A至图63C所示为本发明一实施例的LED灯丝电路示意图；63A to 63C are schematic diagrams showing a circuit of an LED filament according to an embodiment of the present invention;
图64A至图64C所示为本发明另一实施例的LED灯丝电路示意图；64A to 64C are schematic diagrams showing a circuit of an LED filament according to another embodiment of the present invention;
图65A至图65D所示为本发明另一实施例的LED灯丝电路示意图；65A to 65D are schematic diagrams showing a circuit of an LED filament according to another embodiment of the present invention;
图66A至图66E所示为本发明另一实施例的LED灯丝电路示意图；66A to 66E are schematic diagrams showing a circuit of an LED filament according to another embodiment of the present invention;
图67所示为根据发明一实施例的LED球泡灯的电源模块的电路方块示意图；67 is a circuit block diagram of a power module of an LED bulb according to an embodiment of the invention;
图68A所示为根据本发明第一较佳实施例的整流电路的电路示意图；68A is a circuit diagram of a rectifier circuit according to a first preferred embodiment of the present invention;
图68B所示为根据本发明第二较佳实施例的整流电路的电路示意图；68B is a circuit diagram showing a rectifier circuit according to a second preferred embodiment of the present invention;
图69A所示为根据本发明第一较佳实施例的滤波电路的电路示意图；69A is a circuit diagram of a filter circuit according to a first preferred embodiment of the present invention;
图69B所示为根据本发明第二较佳实施例的滤波电路的电路示意图；69B is a circuit diagram showing a filter circuit according to a second preferred embodiment of the present invention;
图70所示为根据本发明较佳实施例的驱动电路的电路方块示意图；Figure 70 is a block diagram showing the circuit of a driving circuit in accordance with a preferred embodiment of the present invention;
图71A至图71D所示分别为根据本发明不同实施例的驱动电路的信号波形示意图；71A to 71D are schematic diagrams showing signal waveforms of driving circuits according to different embodiments of the present invention;
图72A所示为本发明第一较佳实施例的驱动电路的电路示意图；及72A is a circuit diagram showing a driving circuit of a first preferred embodiment of the present invention; and
图72B所示为本发明第二较佳实施例的驱动电路的电路示意图。Figure 72B is a circuit diagram showing the driving circuit of the second preferred embodiment of the present invention.
具体实施方式Detailed ways
本公开提供了一种新的LED灯丝及其应用的LED球泡灯，将参照附图在下面的实施例中描述本公开。本文中所呈现的本发明的各种实施例的下列描述仅用于图示和示例的目的，而不是旨在排他性的或限于所公开的确切形式。这些示例实施例仅仅是示例，并且不需要本文提供的细节的许多实施方式和变化是可能的。还应强调的是，本公开提供了替代示例的细节，但是这些替代的陈列不是排他性的。而且，各种示例之间的任何细节的一致应被理解为需要这样的细节，毕竟对于本文中描述的每个特征陈列每一种可能的变化是不实际的。The present disclosure provides a new LED filament and its applied LED bulb, which will be described in the following embodiments with reference to the accompanying drawings. The following description of the various embodiments of the invention herein are intended to be illustrative only These example embodiments are merely examples, and many embodiments and variations that do not require the details provided herein are possible. It should also be emphasized that the present disclosure provides details of alternative examples, but such alternative displays are not exclusive. Moreover, the consistency of any detail between the various examples should be understood as requiring such detail, after which it is not practical to display every possible variation for each feature described herein.
在附图中，构件的尺寸和相对尺寸可以为了清楚而放大。整个附图中，相同的附图标记指代相同的组件。In the figures, the dimensions and relative dimensions of the components may be exaggerated for clarity. Throughout the drawings, the same reference numerals refer to the same components.
本文所使用的技术术语仅仅是为了描述具体实施例，而不是旨在限制本发明。在本文所使用的术语中，单数形式“一(a)”或“一个(an)”旨在也包括复数形式，除非上下文清楚地另外指出。在本文所使用的术语中，术语“和/或”包括一个或多个相关联的所列术语中的任一术语和所有组合，并且可简写为“/”。The technical terms used herein are for the purpose of describing particular embodiments only and are not intended to limit the invention. In the terms used herein, the singular forms "a" or "an" are intended to include the plural, unless the context clearly indicates otherwise. In the terms used herein, the term "and/or" includes any and all combinations of one or more of the associated listed terms, and may be abbreviated as "/".
应理解的是，尽管本文可能使用了术语第一、第二、第三等来描述各种组件、构件、区域、层或步骤，但是这些组件、构件、区域、层和/或步骤不应受这些术语限制。除非上下文另外指出，否则这些术语仅用于将一个组件、构件、区、层或步骤与另一组件、构件、区域、层或步骤进行区分，例如作为命名约定。因此，在不偏离本发明的教导的情况下，下面在说明书中的一个章节中讨论的第一组件、构件、区、层或步骤可在说明书的另一章节中或权利要求中被命名为第二组件、构件、区域、层或步骤。此外，在某些情况下，即使在说明书中不使用“第一”、“第二”等描述术语，但是该术语可能在权利要求书中仍被称为“第一”或“第二”以对记载的不同组件进行彼此区分。It should be understood that, although the terms first, second, third, etc. may be used to describe various components, components, regions, layers or steps, these components, components, regions, layers and/or steps should not be These terms are limited. The terms are used to distinguish one component, component, region, layer, or step, or another component, component, region, layer or step, for example, as a naming convention. Therefore, a first component, component, region, layer or step discussed in the following section in the specification may be named in another section of the specification or in the claims without departing from the teachings of the invention. Second component, component, region, layer or step. Further, in some cases, even if the terms "first", "second", etc. are not used in the specification, the term may be referred to as "first" or "second" in the claims. Differentiate the different components of the record.
还应理解的是，当在说明书中使用术语“包括”或“包含”时，这些术语列举所记载的特征、区域、整数、步骤、操作、组件和/或构件的存在，但是不排除一个或多个其它特征、区域、整数、步骤、操作、组件和/或构件的存在或添加。It is also to be understood that the terms "comprises" or "comprising" or "an" The presence or addition of a plurality of other features, regions, integers, steps, operations, components, and/or components.
应理解，当组件被称为“连接”或“耦接”到另一组件或另一组件“上”时，该组件可以直接连接或耦接到另一组件或另一组件上，或者可以存在中间组件。相反，当组件被称为“直接连接”或“直接耦接”到另一组件时，不存在中间组件。用于描述组件之间的关系的其它词语应以类似的方式(例如，“之间”与“直接之间”，“相邻”与“直接相邻”等)进行解释。然而，本文使用的术语“接触”指直接接触(即，触碰)，除非上下文另外指出。It will be understood that when a component is referred to as "connected" or "coupled" to another component or another component, the component can be directly connected or coupled to another component or another component or can be present Intermediate component. In contrast, when a component is referred to as "directly connected" or "directly coupled" to another component, there is no intermediate component. Other words used to describe the relationship between the components should be interpreted in a similar manner (e.g., "between" and "directly", "adjacent" and "directly adjacent", etc.). However, the term "contact" as used herein refers to direct contact (ie, touch) unless the context indicates otherwise.
本文所描述的实施例将通过理想的示意图参照平面图和/或剖视图来描述。因此，示例性视图可取决于制造技术和/或公差进行修改。因此，所公开的实施例不限于在视图中所示的那些，而是包含在制造工艺的基础上形成的配置的变型。因此，在图中示例的区域可具有示意性质，并在图中所示的区域的形状可示例性列举组件的区域的形状，但本发明的各方 面并不限于此。The embodiments described herein will be described with reference to a plan view and/or a cross-sectional view through an ideal schematic. Accordingly, the exemplary views may be modified depending on manufacturing techniques and/or tolerances. Thus, the disclosed embodiments are not limited to those shown in the drawings, but rather include variations of the configuration formed on the basis of the manufacturing process. Therefore, the regions exemplified in the drawings may have schematic properties, and the shapes of the regions shown in the drawings may exemplify the shapes of the regions of the components, but the aspects of the invention are not limited thereto.
本文可使用空间相对术语，如“在...之下”、“下方”、“下”、“上方”、“上”等以便于描述附图中所示的一个组件或特征与另一组件或特征的关系。但应理解的是，除附图中描绘的取向之外，空间相对术语旨在涵盖器件在使用或操作中的不同取向。例如，如果附图中的器件被翻转，那么被描述为在其它组件或特征“下方”或“之下”的组件或特征将被取向成在其它组件或特征“上方”。因此，术语“下方”可以涵盖上方和下方的取向。所述装置可以其它方式取向(旋转90度或者在其它取向)，并且本文使用的空间相对描述都应被相应地解释。Spatially relative terms such as "under", "lower", "lower", "above", "upper", etc., may be used to describe one component or feature and another component shown in the drawings. Or the relationship of features. It should be understood, however, that the spatially relative terms are intended to encompass different orientations of the device in use or operation. For example, a component or feature that is described as "under" or "beneath" or "an" or "an" Thus, the term "below" can encompass the orientation above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatial relative descriptions used herein should be interpreted accordingly.
本文参照取向、布局、位置、形状、尺寸、数量或其它量度时使用的术语如“相同”、“相等”、“平面”或“共面”不一定意味着恰好相同取向、布局、位置、形状、尺寸、数量或其它量度，而是旨在涵盖例如由于制造工艺可能导致的可接受变化范围内的几乎相同取向、布局、位置、形状、尺寸、数量或其它量度。在本文中可使用术语“基本”来反映该含义。Terms such as "identical," "equal," "planar," or "coplanar" as used herein with respect to orientation, layout, position, shape, size, number, or other measure do not necessarily mean exactly the same orientation, layout, position, shape. The size, number, or other measure, but is intended to encompass nearly the same orientation, layout, position, shape, size, number, or other measure within an acceptable range of variations, for example, as a result of a manufacturing process. The term "basic" may be used herein to reflect this meaning.
术语如“约”或“大约”可反映仅以相对小的方式和/或以不显着改变某些组件的操作、功能或结构的形式变化的尺寸、取向或布局。例如，从“约0.1至约1”的范围可涵盖例如在0.1附近偏差0％-5％以及在1附近偏差0％至5％的范围，特别是如果这种偏差维持与所列范围相同的影响。Terms such as "about" or "about" may mean a size, orientation, or arrangement that varies only in a relatively small manner and/or in a form that does not significantly alter the operation, function, or structure of certain components. For example, a range from "about 0.1 to about 1" may encompass, for example, a range of 0%-5% deviation in the vicinity of 0.1 and a deviation of 0% to 5% in the vicinity of 1, especially if such deviation remains the same as the listed range. influences.
除非另有定义，本文使用的所有术语(包括技术和科学术语)具有本公开所述领域普通技术人员通常理解的相同的含义。还应理解，术语，例如那些在常用字典中定义的，应当被解释为具有与它们在相关领域和/或本申请的上下文中的含义一致的含义，并且不应以理想化的或过于形式化的意义进行解释，除非本文明确如此定义。Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning meaning It should also be understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having meaning consistent with their meaning in the relevant art and/or context of the application, and should not be idealized or too formalized. The meaning of the explanation is explained unless it is explicitly defined as such.
请参阅图1A及1B，图1A及1B为本发明的第一实施例及第二实施例的结构示意图。图中可以看出，LED球泡灯1a、1b包括灯壳12、连接灯壳12的灯头16、设于灯壳12内的至少二导电支架51a、51b、设于灯头内且电性连接导电支架51a、51b与灯头16的驱动电路518、以及设置于灯壳12内的单一条发光部100，发光部100的实施态样可为LED灯丝，其中包括LED芯片。1A and 1B, FIG. 1A and FIG. 1B are schematic diagrams showing the structure of a first embodiment and a second embodiment of the present invention. As can be seen, the LED bulbs 1a, 1b comprise a lamp housing 12, a lamp cap 16 connecting the lamp housing 12, at least two conductive brackets 51a, 51b disposed in the lamp housing 12, disposed in the lamp cap and electrically connected The mounting portions 51a, 51b and the driving circuit 518 of the base 16 and the single light emitting portion 100 disposed in the lamp housing 12, the implementation of the light emitting portion 100 may be an LED filament including an LED chip.
导电支架51a、51b用以电性连接发光部100的两个电极506，亦可用于支撑发光部100的重量。驱动电路518为电性连接该导电支架51a、51b与灯头16，当灯头16连接于传统的球泡灯的灯座时，灯座为提供灯头16电源，驱动电路518为从灯头16取得电源后用以驱动该发光部100发光。由于LED球泡灯1a、1b的发光部100在结构、形状、轮廓或曲线等方面的对称特性，或发光部100在出光方向(本发明即LED灯丝的发光面所朝向的方向)上的对称特性(详如后述)，LED球泡灯1a、1b可产生全周光。在本实施例中，驱动电路518设置在LED球泡灯之内。然而，在一些实施例中，驱动电路518设置在LED球泡灯之外。The conductive brackets 51a and 51b are used to electrically connect the two electrodes 506 of the light emitting unit 100, and can also support the weight of the light emitting unit 100. The driving circuit 518 is electrically connected to the conductive brackets 51a, 51b and the lamp cap 16. When the lamp cap 16 is connected to the lamp holder of the conventional bulb lamp, the lamp socket provides power to the lamp cap 16, and the driving circuit 518 is powered from the lamp cap 16. The light emitting unit 100 is driven to emit light. The symmetry of the light-emitting portion 100 of the LED bulb 1a, 1b in terms of structure, shape, contour, curve, or the like, or the symmetry of the light-emitting portion 100 in the light-emitting direction (the direction in which the light-emitting surface of the LED filament is oriented) The characteristics (described later in detail), the LED bulbs 1a, 1b can generate full illumination. In the present embodiment, the drive circuit 518 is disposed within the LED bulb. However, in some embodiments, the drive circuit 518 is disposed outside of the LED bulb.
在图1A的实施例中，LED球泡灯1a的导电支架51a、51b是以两个为例，但并不以此为限，可视发光部100的导电或支撑性需求而增加数量。In the embodiment of FIG. 1A, the conductive brackets 51a, 51b of the LED bulb 1a are exemplified by two, but not limited thereto, and may be increased in number depending on the conductive or supporting requirements of the light-emitting portion 100.
在图1A与1B的实施例中，LED球泡灯1a、1b还包括芯柱19与散热组件17，芯柱19设于灯壳12内，散热组件17位于灯头16与灯壳12之间且连接芯柱19。在本实施例中，灯头16是透过散热组件17间接连接灯壳12。在其他实施例中，灯头16可直接连接灯壳12且不具有散热组件17。发光部100经由导电支架51a、51b连接芯柱19。芯柱19可用来抽换LED球泡灯1b中的空气，换成氮气与氦气的混合气体。芯柱19还可提供导热的功能，将连接芯柱19的发光部100的热传导致灯壳12之外。散热组件17可以是环绕灯壳12开口的中空柱状体，其连接芯柱19与灯头16并将其所传来的热传导到LED球泡灯1b之外。散热组件17的内部可装设有驱动电路518，散热组件17的外部接触外界的气体已传导热。散热组件17的材质上可选用具有良好导热效果的金属、陶瓷或高导热塑料。散热组件17(连同LED球泡灯的开口/螺口)的材质也可为具有良好导热效果的陶瓷材料，散热组件17亦可与陶瓷芯柱19为一体成形的组件，如此可以免去LED球泡灯的灯头需与散热组件17胶合而增加发光部100散热路径的热阻，从而具有更好的散热效果。In the embodiment of FIGS. 1A and 1B, the LED bulb 1a, 1b further includes a stem 19 and a heat dissipating component 17, the stem 19 is disposed in the bulb 12, and the heat dissipating component 17 is located between the cap 16 and the lamp housing 12 and The stem 19 is connected. In the present embodiment, the base 16 is indirectly connected to the lamp housing 12 through the heat dissipation assembly 17. In other embodiments, the base 16 can be directly coupled to the lamp housing 12 and has no heat sink assembly 17. The light emitting unit 100 connects the stem 19 via the conductive holders 51a and 51b. The stem 19 can be used to exchange the air in the LED bulb 1b and replace it with a mixture of nitrogen and helium. The stem 19 can also provide a heat conducting function to transfer heat from the light emitting portion 100 of the connecting stem 19 to the outside of the lamp housing 12. The heat dissipating component 17 may be a hollow cylindrical body that surrounds the opening of the lamp housing 12, which connects the stem 19 and the base 16 and conducts the heat transmitted therefrom to the outside of the LED bulb 1b. The inside of the heat dissipating component 17 may be provided with a driving circuit 518, and the outside of the heat dissipating component 17 that contacts the outside air has conducted heat. The material of the heat dissipating component 17 can be selected from metal, ceramic or high thermal conductive plastic with good thermal conductivity. The material of the heat dissipating component 17 (along with the opening/thread of the LED bulb) can also be a ceramic material with good thermal conductivity, and the heat dissipating component 17 can also be integrally formed with the ceramic stem 19, so that the LED ball can be eliminated. The lamp cap of the lamp needs to be glued with the heat dissipating component 17 to increase the thermal resistance of the heat dissipating path of the light emitting part 100, thereby having a better heat dissipating effect.
图2为本发明发光部一实施例的立体局部剖面示意图。本发明接下来即以LED灯丝作为发光部具体实施方式进行说明，然而本发明LED球泡灯中发光部可能实施的形态不以此为限，举凡任何发光体得以透过弯折的方式使本发明所述的LED球泡灯得以发出全周光，应可视为本发明所指发光部的等同置换组件。LED灯丝100包括多个LED芯片单元102、104、至少两个导电电极110、112、以及光转换涂层120(在特定实施例中，光转换涂层可称作硅胶层)，光转换涂层120中的荧光粉能吸收某些辐射(如光)而发出光线。LED灯丝在其导电电极110、112被接通电源(电压源或电流源)后，即可发出光线。以本实施例为例，其发出的光线可以实质上为接近点光源的360度的光线；将本发明实施例LED灯丝应用于球泡灯，则可以发出全周光(omni-directionallight)。2 is a perspective, partial, cross-sectional view showing an embodiment of a light-emitting portion of the present invention. The present invention will be described below with an LED filament as a light-emitting portion. However, the embodiment in which the light-emitting portion of the LED bulb of the present invention may be implemented is not limited thereto, and any illuminant can be bent through the manner. The LED bulb of the invention can emit full-circumference light, which should be regarded as an equivalent replacement component of the light-emitting portion referred to in the present invention. The LED filament 100 includes a plurality of LED chip units 102, 104, at least two conductive electrodes 110, 112, and a light converting coating 120 (in a particular embodiment, the light converting coating may be referred to as a silicone layer), a light converting coating The phosphor in 120 absorbs certain radiation (such as light) and emits light. The LED filament emits light after its conductive electrodes 110, 112 are powered (voltage source or current source). Taking the embodiment as an example, the light emitted by the light may be substantially 360 degrees of light close to the point source; when the LED filament of the embodiment of the invention is applied to the bulb, omni-directional light may be emitted.
从图2中可以看出，本发明的LED灯丝100的截面形状为长方形，但LED灯丝100的截面形状并不以此为限，亦可以是三角形、圆形、椭圆形、多边形或者是菱形，甚至亦可以是采用方形，但边角可采用倒角或圆角。As can be seen from FIG. 2, the cross-sectional shape of the LED filament 100 of the present invention is rectangular, but the cross-sectional shape of the LED filament 100 is not limited thereto, and may be triangular, circular, elliptical, polygonal or diamond-shaped. It can even be square, but the corners can be chamfered or rounded.
LED芯片单元102、104，或称为LED段102、104，可以是单颗LED芯片，也可以是两颗LED芯片，当然也可以是包含多颗LED芯片，即等于或大于三颗LED芯片。The LED chip units 102, 104, or LED segments 102, 104, may be a single LED chip, or two LED chips. Of course, it may also include a plurality of LED chips, that is, equal to or larger than three LED chips.
图3A至3F为本发明LED灯丝实施例的立体局部剖面示意图。如图3A所示，包括LED芯片单元102、104，电极110、112，导线。与前一实施例相异，本实施例的光转换涂层分为第一光转换层121和基层122，基层122的上表面贴覆多个铜箔116以及LED芯片单元102、104，铜箔116位于相邻两LED芯片单元102、104之间；电极110、112对应于LED芯片单元102、104配置，LED芯片单元102、104与铜箔116、LED芯片单元102、104与电极110、112通过导线进行电性连接；LED芯片单元102、104中的每个LED芯片具有p接面和n接面，导线包括连接电极110、112与LED芯片单元的第一导线141和连接铜箔116与LED芯片单元的第二导线142，第一光转换层121覆盖单个LED芯片单元与此LED芯片单元相连接的第一导线141和第二导线142，第一光转换层121的数量与LED芯片单元的数 量相同。采用此设计，增加了热辐射面积，提升了散热效果和出光效率；可实现灯丝弯折点亮，降低了导线脱落或断线的概率，增加了产品的可靠度。3A to 3F are perspective partial cross-sectional views showing an embodiment of an LED filament according to the present invention. As shown in FIG. 3A, LED chip units 102, 104, electrodes 110, 112, and wires are included. Different from the previous embodiment, the light conversion coating of the present embodiment is divided into a first light conversion layer 121 and a base layer 122. The upper surface of the base layer 122 is coated with a plurality of copper foils 116 and LED chip units 102 and 104, and a copper foil. 116 is located between two adjacent LED chip units 102, 104; electrodes 110, 112 are arranged corresponding to LED chip units 102, 104, LED chip units 102, 104 and copper foil 116, LED chip units 102, 104 and electrodes 110, 112 Electrically connected by wires; each of the LED chip units 102, 104 has a p-junction and an n-junction, and the wires include the first wires 141 and the connection copper foil 116 connecting the electrodes 110, 112 and the LED chip unit. a second wire 142 of the LED chip unit, the first light conversion layer 121 covers the first wire 141 and the second wire 142 of the single LED chip unit connected to the LED chip unit, the number of the first light conversion layer 121 and the LED chip unit The number is the same. By adopting this design, the heat radiation area is increased, the heat dissipation effect and the light extraction efficiency are improved; the filament bending and lighting can be realized, the probability of wire falling off or disconnection is reduced, and the reliability of the product is increased.
依据本实施例，单一LED芯片单元102、104可以是两颗LED芯片，当然也可以是包含多颗LED芯片，即等于或大于三颗LED芯片。LED芯片的形状可以但不限于长条型，长条型的芯片可具有较少的电极，减少遮蔽LED芯片所发出光线的机会。电极110、112配置于串联后的LED芯片单元102、104的两端，每一电极110、112的一部分外露于第一光转换层121之外，LED芯片单元102、104中的LED芯片的六个面的每一个表面都覆盖着第一光转换层121，即所述LED芯片单元102、104的六个面被第一光转换层121覆盖，此覆盖或包裹可以是但不限于直接接触，较佳的，在本实施例中，LED芯片单元102、104的LED芯片的六个面的每一个表面都直接接触第一光转换层121。然而，实施时，第一光转换层121可以仅覆盖每一个LED芯片单元102、104的LED芯片六个表面中的至少一个表面，意即第一光转换层121直接接触该表面，此直接接触的表面可以是顶面。同样的，第一光转换层121可直接接触两个电极110、112或铜箔116的至少一个表面。According to this embodiment, the single LED chip unit 102, 104 may be two LED chips, and of course, may also include multiple LED chips, that is, equal to or larger than three LED chips. The shape of the LED chip can be, but is not limited to, a strip type, and the strip type chip can have fewer electrodes, reducing the chance of shielding the light emitted by the LED chip. The electrodes 110 and 112 are disposed at both ends of the LED chip units 102 and 104 connected in series, and a part of each of the electrodes 110 and 112 is exposed outside the first light conversion layer 121, and six of the LED chips in the LED chip units 102 and 104 Each surface of the face is covered with the first light conversion layer 121, that is, the six faces of the LED chip units 102, 104 are covered by the first light conversion layer 121, and the cover or package may be, but not limited to, direct contact. Preferably, in the present embodiment, each of the six faces of the LED chips of the LED chip units 102, 104 directly contacts the first light conversion layer 121. However, when implemented, the first light conversion layer 121 may cover only at least one of the six surfaces of the LED chips of each of the LED chip units 102, 104, that is, the first light conversion layer 121 directly contacts the surface, which is in direct contact. The surface can be the top surface. Also, the first light conversion layer 121 may directly contact at least one surface of the two electrodes 110, 112 or the copper foil 116.
导线为金线或铝线，铜箔116搭配金线的组合为灯丝带来稳固而又维持可挠性的导电结构。铜箔116可采用其他具有良好导电性的材料代替，铜箔116开口的宽度或/及长度大于LED芯片单元102、104以限定LED芯片单元102、104的位置，并使LED芯片单元102、104的六个面当中的至少两个面以上均接触并被第一光转换层121包覆。多个所述LED芯片单元102、104通过导线与铜箔116进行连接形成串联电路、并联电路、先串联后再将各串联并联起来的电路或先并联后再将各并联串联起来的电路，然后将该电路的最前端与最后端的LED芯片单元102、104分别与固着于基层122上的两个电极110、112连接，电极110、112即可以连接至电源，为提供LED芯片单元102、104点亮所需的电源。The wire is a gold wire or an aluminum wire, and the combination of the copper foil 116 and the gold wire is a lamp ribbon to stabilize and maintain a flexible conductive structure. The copper foil 116 may be replaced by other materials having good electrical conductivity, the width or/and length of the opening of the copper foil 116 being larger than the LED chip units 102, 104 to define the position of the LED chip units 102, 104, and the LED chip units 102, 104 At least two of the six faces are in contact with and covered by the first light conversion layer 121. a plurality of the LED chip units 102 and 104 are connected to the copper foil 116 by wires to form a series circuit, a parallel circuit, a circuit that is connected in series and then connected in series or in parallel, and then connected in parallel, and then connected in parallel. The LED chip units 102 and 104 at the forefront and the last end of the circuit are respectively connected to the two electrodes 110 and 112 fixed on the base layer 122, and the electrodes 110 and 112 can be connected to the power source to provide the LED chip units 102 and 104. Light up the required power.
第一光转换层121覆盖铜箔116的两端，铜箔116的两端被第一光转换层121覆盖的面积、平均厚度相等或不相等，铜箔116的上表面被第一光转换层121覆盖的面积为30～40％。于一实施例中，如图3B所示，相邻的两第一光转换层可以覆盖位于此相邻的两第一光转换层之间的整个铜箔116，铜箔116的两端被第一光转换层121覆盖的面积、平均厚度与铜箔116的中间被第一光转换层121覆盖的面积、平均厚度不相等，铜箔116的中间被第一光转换层121覆盖的厚度为30～50um。第一光转换层121的表面呈弧形，弧形的高度由中间往两侧逐渐降低，弧形两侧与基层122的夹角为锐角或钝角。The first light conversion layer 121 covers both ends of the copper foil 116. The area and the average thickness of the two ends of the copper foil 116 covered by the first light conversion layer 121 are equal or unequal, and the upper surface of the copper foil 116 is covered by the first light conversion layer. 121 covers an area of 30 to 40%. In an embodiment, as shown in FIG. 3B, the adjacent two first light conversion layers may cover the entire copper foil 116 between the two adjacent first light conversion layers, and the two ends of the copper foil 116 are The area covered by the light conversion layer 121 and the average thickness are not equal to the area covered by the first light conversion layer 121 and the average thickness of the copper foil 116, and the thickness of the copper foil 116 covered by the first light conversion layer 121 is 30. ~50um. The surface of the first light conversion layer 121 has an arc shape, and the height of the arc gradually decreases from the middle to the both sides, and the angle between the curved sides and the base layer 122 is an acute angle or an obtuse angle.
第一光转换层121包括荧光粉胶或荧光粉膜，LED芯片单元102、104的六个面的每一个表面都至少有一部分直接接触第一光转换层121和/或LED芯片单元102、104其中一或两面透过固晶胶与第一光转换层121粘接，也属于前述的六个面均被第一光转换层121包覆及/或LED芯片单元102、104直接接触第一光转换层121的等同概念。前述的固晶胶在其他实施例中也可掺入荧光粉，以增加整体的光转换效率，固晶胶通常也为硅胶，与混合荧光粉用的硅胶不同点在于固晶胶常混合银粉或散热粉末以提高导热效果。The first light conversion layer 121 includes a phosphor paste or a phosphor film, and at least a portion of each of the six faces of the LED chip units 102, 104 directly contacts the first light conversion layer 121 and/or the LED chip units 102, 104. One or both sides are bonded to the first light conversion layer 121 through the solid glue, and the six faces are also covered by the first light conversion layer 121 and/or the LED chip units 102 and 104 directly contact the first light. The equivalent concept of the conversion layer 121. In the other embodiments, the solid crystal glue may also be incorporated with a phosphor to increase the overall light conversion efficiency. The solid crystal glue is usually also a silica gel. The difference from the silica gel used for mixing phosphors is that the solid crystal glue is often mixed with silver powder or Heat the powder to improve heat transfer.
如图3C所示，与上述实施例不同之处在于，基层122的下表面覆盖厚度均匀的 第二光转换层123，基层122的上表面和下表面相对。如图3D所示，覆盖基层122的下表面的第二光转换层123具有倾斜侧面或带有弧形的倾斜侧面。基层122的下表面覆盖第二光转换层123，可以产生更多的黄色荧光而减少蓝光，因此能减少LED芯片单元102、104正面及背面出光的色温差异，使得LED芯片单元102、104两面出光的色温更接近。As shown in Fig. 3C, the difference from the above embodiment is that the lower surface of the base layer 122 covers the second light-converting layer 123 having a uniform thickness, and the upper surface and the lower surface of the base layer 122 are opposed to each other. As shown in FIG. 3D, the second light conversion layer 123 covering the lower surface of the base layer 122 has an inclined side surface or an inclined side surface with an arc shape. The lower surface of the base layer 122 covers the second light conversion layer 123, which can generate more yellow fluorescence and reduce blue light. Therefore, the difference in color temperature between the front and back sides of the LED chip units 102 and 104 can be reduced, so that the LED chip units 102 and 104 emit light on both sides. The color temperature is closer.
于一实施例中，如图3E所示，第一光转换层121包覆相邻的两个LED芯片单元102、104，位于这两个LED芯片单元102、104之间的铜箔116及与这两个LED芯片单元102、104相连接的第一导线141、第二导线142。于一实施例中，铜箔116上表面具有镀银层118，位于灯丝头尾两端并延伸超过基层122的铜箔116可作为电极110、112。镀银层118不仅能带来良好的导电性外亦具有增加光反射的效果；镀银层表面上可选择性设有保焊膜层(图未示)，保焊膜层的厚度为30～50um，保焊膜层为采用OSP(Organic Solderability Preservatives)工艺获得，保焊膜层具有防氧化，耐热冲击，耐湿性。In an embodiment, as shown in FIG. 3E, the first light conversion layer 121 covers two adjacent LED chip units 102 and 104, and the copper foil 116 between the two LED chip units 102 and 104 and The first wire 141 and the second wire 142 are connected to the two LED chip units 102 and 104. In one embodiment, the upper surface of the copper foil 116 has a silver plated layer 118, and the copper foil 116 located at the ends of the filament head and extending beyond the base layer 122 serves as the electrodes 110, 112. The silver plating layer 118 not only can bring good conductivity but also has the effect of increasing light reflection; the surface of the silver plating layer can be selectively provided with a solder resist layer (not shown), and the thickness of the solder resist layer is 30 ～. 50um, the solder mask layer is obtained by the OSP (Organic Solderability Preservatives) process, and the solder resist layer has anti-oxidation, thermal shock resistance and moisture resistance.
本案的又一实施例，如图3F所示，LED灯丝200具有：LED芯片单元102，104；电极110，112；导线140，以及光转换涂层120。铜箔116位于相邻两LED芯片单元102、104之间；电极110、112对应于LED芯片单元102、104配置，LED芯片单元102、104与铜箔116、LED芯片单元102、104与电极110、112通过导线140进行电性连接，光转换涂层120涂布于LED芯片单元102、104与灯丝电极110、112的至少两侧上。光转换涂层120暴露出灯丝电极110，112的一部分，光转换涂层120包括荧光粉层124和硅胶层125，荧光粉层124直接接触LED芯片单元102、104的表面，在喷涂时，可以采用静电喷涂方式在LED芯片单元102、104、铜箔116、电极110、112及导线140的表面喷涂一层荧光粉层124，后可以采用真空涂覆方式再在荧光粉层124上涂覆一层硅胶层125，硅胶层125中不含荧光粉；荧光粉层124与硅胶层125的厚度相等或不相等，荧光粉层124的厚度为30～70um，硅胶层125的厚度为30～50um。于另一实施例中，也可以先在LED芯片单元102、104、铜箔116、电极110、112及导线140的表面覆盖一层透明树脂层，透明树脂层中不含荧光粉，然后再用荧光粉层覆盖透明树脂层，透明树脂层与荧光粉层的厚度相等或不相等，透明树脂层的厚度为30～50um。In another embodiment of the present invention, as shown in FIG. 3F, the LED filament 200 has: LED chip units 102, 104; electrodes 110, 112; wires 140, and a light conversion coating 120. The copper foil 116 is located between the adjacent two LED chip units 102, 104; the electrodes 110, 112 are arranged corresponding to the LED chip units 102, 104, the LED chip units 102, 104 and the copper foil 116, the LED chip units 102, 104 and the electrode 110 The light-transfer coating 120 is applied to at least two sides of the LED chip units 102, 104 and the filament electrodes 110, 112. The light conversion coating 120 exposes a portion of the filament electrodes 110, 112. The light conversion coating 120 includes a phosphor layer 124 and a silica layer 125. The phosphor layer 124 directly contacts the surface of the LED chip units 102, 104. A layer of phosphor layer 124 is sprayed on the surface of the LED chip unit 102, 104, the copper foil 116, the electrodes 110, 112 and the wire 140 by electrostatic spraying, and then a vacuum coating method can be applied to the phosphor layer 124. The silica gel layer 125 and the silica gel layer 125 do not contain phosphor; the phosphor layer 124 and the silica gel layer 125 have the same or different thickness, the phosphor layer 124 has a thickness of 30 to 70 um, and the silica gel layer 125 has a thickness of 30 to 50 um. In another embodiment, the surface of the LED chip unit 102, 104, the copper foil 116, the electrodes 110, 112, and the wire 140 may be covered with a transparent resin layer, and the transparent resin layer does not contain phosphor, and then used. The phosphor layer covers the transparent resin layer, and the thickness of the transparent resin layer and the phosphor layer are equal or unequal, and the thickness of the transparent resin layer is 30 to 50 um.
请参照图4A至图4K，图4A至图4K是分段式的LED灯丝的多种实施例的示意图，图4A至图4E与图4H至图4K为LED灯丝沿着其轴向方向的剖视图，图4G是图4F的LED灯丝的弯折状态的示意图。如图4A至图4K所示，在LED灯丝的轴向方向上，LED灯丝可区分为不同的分段，例如LED灯丝可区分为LED段(即前述实施例所称LED芯片单元)102、104与导体段130，但不限于此。单一LED灯丝中的LED段102、104与导体段130的数量可分别为一个或多个，且LED段102、104与导体段130是沿着LED灯丝的轴向方向设置。其中，LED段102、104与导体段130可具有不同的结构特征，以达到不同的效果，详述如后。4A to 4K, FIG. 4A to FIG. 4K are schematic views of various embodiments of the segmented LED filament, and FIGS. 4A to 4E and FIGS. 4H to 4K are cross-sectional views of the LED filament along the axial direction thereof. 4G is a schematic view showing a bent state of the LED filament of FIG. 4F. As shown in FIG. 4A to FIG. 4K, in the axial direction of the LED filament, the LED filament can be divided into different segments, for example, the LED filament can be divided into LED segments (ie, the LED chip unit referred to in the foregoing embodiment) 102, 104. And the conductor segment 130, but is not limited thereto. The number of LED segments 102, 104 and conductor segments 130 in a single LED filament may each be one or more, and the LED segments 102, 104 and conductor segments 130 are disposed along the axial direction of the LED filament. Wherein, the LED segments 102, 104 and the conductor segments 130 may have different structural features to achieve different effects, as detailed below.
如图4A所示，LED灯丝100包括LED段102、104，导体段130、至少两个电极110、112以及光转换层120，导体段130位于相邻两LED段102、104之间，电极110、112 对应于LED段102、104配置，且电性连接LED段102、104，相邻两LED段102、104通过导体段130相互电性连接，在本实施例中，导体段130包括连接LED段102、104的导体130a，导线140的长度小于导体130a的长度，或者分别位于相邻两LED段102、104内的两个LED芯片间的最短距离大于单一LED段102/104内相邻两LED芯片之间的距离。此外，在本发明其他较佳实施例中，每一LED段102、104包括至少两个LED芯片142，LED芯片142间相互电性连接，电性连接是通过导线140进行连接；本发明不以此为限。As shown in FIG. 4A, the LED filament 100 includes LED segments 102, 104, a conductor segment 130, at least two electrodes 110, 112, and a light conversion layer 120. The conductor segments 130 are located between adjacent LED segments 102, 104. 112 corresponds to the LED segments 102, 104, and is electrically connected to the LED segments 102, 104. The adjacent two LED segments 102, 104 are electrically connected to each other through the conductor segments 130. In this embodiment, the conductor segments 130 include connecting LEDs. The length of the conductor 130a of the segments 102, 104, the length of the wire 140 is less than the length of the conductor 130a, or the shortest distance between the two LED chips respectively located in the adjacent two LED segments 102, 104 is greater than the adjacent two in the single LED segment 102 / 104 The distance between the LED chips. In addition, in other preferred embodiments of the present invention, each of the LED segments 102 and 104 includes at least two LED chips 142. The LED chips 142 are electrically connected to each other, and the electrical connection is connected through the wires 140. The present invention does not This is limited.
光转换层120覆盖于LED段102、104、导体段130与电极110、112，并分别使两个电极110、112的一部分外露。本实施例中，LED段102、104中的LED芯片142的六个面中每一个表面都覆盖着光转换层120，即所述六个面被光转换层120覆盖而可称为光转换层120包裹了LED芯片142，此覆盖或包裹可以是但不限于直接接触，较佳的，在本实施例中，LED芯片142的六个面的每一个表面都直接接触光转换层120。然而，实施时，光转换层120可以仅覆盖每一个LED芯片142六个表面中的两个表面，意即光转换层120直接接触该两个表面，此直接接触的二表面可以是但不限于图4中的顶面或底面。同样的，光转换层120可直接接触两个电极110、112的两个表面。在不同实施例中，光转换层120可采用不具有光转换作用的封体，例如导体段130的光转换层120可改为可挠性优良的透明封体。The light conversion layer 120 covers the LED segments 102, 104, the conductor segments 130 and the electrodes 110, 112, and exposes a portion of the two electrodes 110, 112, respectively. In this embodiment, each of the six faces of the LED chip 142 in the LED segments 102, 104 is covered with the light conversion layer 120, that is, the six faces are covered by the light conversion layer 120 and may be referred to as a light conversion layer. 120 covers the LED chip 142. The cover or package may be, but not limited to, direct contact. Preferably, in the embodiment, each of the six faces of the LED chip 142 directly contacts the light conversion layer 120. However, when implemented, the light conversion layer 120 may cover only two of the six surfaces of each of the LED chips 142, that is, the light conversion layer 120 directly contacts the two surfaces, and the two surfaces of the direct contact may be, but are not limited to, The top or bottom surface in Figure 4. Likewise, the light conversion layer 120 can directly contact both surfaces of the two electrodes 110, 112. In various embodiments, the light conversion layer 120 may employ a package that does not have a light conversion effect, for example, the light conversion layer 120 of the conductor segment 130 may be changed to a transparent package excellent in flexibility.
在一些实施例中，LED灯丝100是设置于LED球泡灯之中，且每个LED球泡灯中仅设置有单一条LED灯丝就能提供足够的照明效果。并且，为了呈现外观上的美感，也为了让单一LED灯丝的光照效果能更为均匀且广阔，甚至达到全周光的效果，因此LED球泡灯中的LED灯丝可以通过弯折挠曲而呈现多样化的曲线，藉由多样化的曲线使LED灯丝的发光方向朝向四面八方，或是藉此调整LED球泡灯整体的发光光型。为了让LED灯丝更容易被弯折形成这样的曲线结构，并且LED灯丝还能承受弯折挠曲的应力，LED灯丝的导体段130中不具有任何LED芯片，而只具有导体130a。导体130a(例如金属线或金属涂层)相对于LED芯片是更容易被弯折的，也就是说，不具有任何LED芯片的导体段130相对于具有LED芯片的LED段102、104会相应的更容易被弯折。In some embodiments, the LED filaments 100 are disposed within the LED bulbs, and only a single LED filament is provided in each of the LED bulbs to provide sufficient illumination. Moreover, in order to present the aesthetic appearance, and to make the illumination effect of a single LED filament more uniform and broad, and even achieve the effect of full-circumference, the LED filament in the LED bulb can be flexed and flexed. The diversified curve allows the LED filament to be illuminated in all directions by a variety of curves, or to adjust the overall luminous pattern of the LED bulb. In order to make the LED filament more easily bent to form such a curved structure, and the LED filament can also withstand the bending and flexing stress, the conductor segment 130 of the LED filament does not have any LED chip, but only has the conductor 130a. The conductor 130a (eg, a metal wire or metal coating) is more easily bent relative to the LED chip, that is, the conductor segments 130 without any LED chips are corresponding to the LED segments 102, 104 having the LED chips. It is easier to be bent.
如图4B所示，在本实施例中，LED灯丝100的LED段102、104与导体段130两者具有不同的结构特征。在本实施例中，导体段130更包括波浪状的凹陷结构132a，此波浪状的凹陷结构132a是设置于导体段130的表面边缘上，且是以LED灯丝100的轴向方向为中心环绕设置于导体段130。在本实施例中，凹陷结构132a是由导体段130的表面凹陷进去。多个凹陷结构132a沿着轴向方向间隔排列，且彼此平行，而呈现连续的波浪状。As shown in FIG. 4B, in the present embodiment, the LED segments 102, 104 of the LED filament 100 and the conductor segments 130 have different structural features. In this embodiment, the conductor segment 130 further includes a wavy recess structure 132a disposed on the surface edge of the conductor segment 130 and disposed around the axial direction of the LED filament 100. In the conductor segment 130. In the present embodiment, the recessed structure 132a is recessed by the surface of the conductor segment 130. The plurality of recessed structures 132a are spaced apart in the axial direction and are parallel to each other to present a continuous wave shape.
当LED灯丝在被弯折时，导体段130可作为主要的弯折处，由于导体段130的波浪状的凹陷结构132a，所以导体段130易于延伸、压缩，更有利于被弯折。举例来说，导体段130在弯折处的外侧会延伸而内侧会压缩，而波浪状的凹陷结构132a则可改善这样的延伸与压缩。延伸之后的凹陷结构132a会变得较为疏松而平整，也就是高低落差变小且相邻波峰或波谷的间距变大；而压缩之后的凹陷结构132a则会变得较为紧密而更加凹陷，也就是高低落差变大且相邻波峰或波谷的间距变小。由于波浪状的凹陷结构132a可提供延伸与压缩的 裕度，使得导体段130更易于弯折。When the LED filament is bent, the conductor segment 130 can serve as a main bend. Due to the wavy recessed structure 132a of the conductor segment 130, the conductor segment 130 is easily extended and compressed, which is more advantageous for being bent. For example, the conductor segments 130 may extend outside of the bend and the inside will compress, while the wavy recess 132a may improve such extension and compression. After the extension, the recessed structure 132a becomes looser and flatter, that is, the height difference becomes smaller and the pitch of adjacent peaks or troughs becomes larger; and the recessed structure 132a after compression becomes denser and more concave, that is, The height difference is large and the pitch of adjacent peaks or troughs becomes small. Since the undulating recessed structure 132a provides a margin of extension and compression, the conductor segments 130 are more susceptible to bending.
如图4C所示，在本实施例中，LED灯丝100的LED段102、104与导体段130两者具有不同的结构特征。在本实施例中，导体段130更包括波浪状的凸起结构132b，此波浪状的凸起结构132b是设置于导体段130的表面边缘上，且是以LED灯丝的轴向方向为中心环绕设置于导体段130。在本实施例中，凸起结构132b是由导体段130的表面凸出来的结构。多个凸起结构132b沿着轴向方向间隔排列，且彼此平行，而呈现连续的波浪状。As shown in FIG. 4C, in the present embodiment, the LED segments 102, 104 of the LED filament 100 and the conductor segments 130 have different structural features. In this embodiment, the conductor segment 130 further includes a wavy convex structure 132b disposed on the surface edge of the conductor segment 130 and surrounded by the axial direction of the LED filament. It is disposed on the conductor segment 130. In the present embodiment, the raised structure 132b is a structure that is protruded from the surface of the conductor segment 130. The plurality of raised structures 132b are spaced apart in the axial direction and are parallel to each other to exhibit a continuous wave shape.
当LED灯丝100在被弯折时，导体段130可作为主要的弯折处，由于导体段130的波浪状的凸起结构132b，所以导体段130易于延伸、压缩，更有利于被弯折。举例来说，导体段130在弯折处的外侧会延伸而内侧会压缩，而波浪状的凸起结构132b则可补偿这样的延伸与压缩。延伸之后的凸起结构132b会变得较为疏松而平整，也就是高低落差变小且相邻波峰或波谷的间距变大；而压缩之后的凸起结构132b则会变得较为紧密而更加凸出，也就是高低落差变大且相邻波峰或波谷的间距变小。由于波浪状的凸起结构132b可提供延伸与压缩的裕度，使得导体段130更易于弯折。When the LED filament 100 is bent, the conductor segment 130 can serve as a main bend. Due to the undulating convex structure 132b of the conductor segment 130, the conductor segment 130 is easily extended and compressed, which is more advantageous for being bent. For example, the conductor segments 130 may extend on the outside of the bend and the inside will compress, while the undulating projections 132b may compensate for such extension and compression. After the extension, the raised structure 132b becomes looser and flatter, that is, the height difference becomes smaller and the pitch of adjacent peaks or troughs becomes larger; and the convex structure 132b after compression becomes more compact and more convex. That is, the height difference is large and the pitch of adjacent peaks or troughs becomes smaller. Since the undulating raised structure 132b can provide a margin of extension and compression, the conductor segments 130 are more susceptible to bending.
如图4D所示，在本实施例中，LED灯丝100的LED段102、104与导体段130两者在外观结构上具有一致性，且LED灯丝更包括辅助条132c。辅助条132c设置于LED灯丝100之中，且被光转换层120包裹覆盖起来。辅助条132c是沿着LED灯丝的轴向方向延伸，且贯穿LED灯丝的所有LED段102、104与导体段130。As shown in FIG. 4D, in the present embodiment, both the LED segments 102, 104 and the conductor segments 130 of the LED filament 100 have a uniform appearance structure, and the LED filament further includes an auxiliary strip 132c. The auxiliary strip 132c is disposed in the LED filament 100 and is covered by the light conversion layer 120. The auxiliary strip 132c extends along the axial direction of the LED filament and extends through all of the LED segments 102, 104 and conductor segments 130 of the LED filament.
由于LED灯丝被弯折时，LED段102、104会因为内部具有LED芯片142而具有较小的弯折程度，而导体段130则会具有较大的弯折程度。在弯折程度差异较大的情况下，LED段102、104与导体段130之间的曲线会呈现较大的变化，而由于应力会集中于曲线变化较大的地方，这会提高LED灯丝在LED段102、104与导体段130之间的光转换层120产生裂痕或甚至断裂的机会。辅助条132c可以吸收应力，避免应力集中于光转换层120，如此可减少LED段102、104与导体段130之间的光转换层120产生裂痕或甚至断裂的机会。藉由辅助条132c的设置，使得LED灯丝的可弯折程度提高。在本实施例中，辅助条132c为一条；在其他实施例中，辅助条132c可以为多条且设置于LED灯丝在径向方向上的不同位置。Since the LED filaments are bent, the LED segments 102, 104 will have a smaller degree of bending because of the internal LED chips 142, while the conductor segments 130 will have a greater degree of bending. In the case of a large difference in the degree of bending, the curve between the LED segments 102, 104 and the conductor segment 130 will show a large change, and since the stress will be concentrated in a place where the curve changes greatly, this will increase the LED filament in the case. The light conversion layer 120 between the LED segments 102, 104 and the conductor segments 130 creates a chance of cracking or even breakage. The auxiliary strip 132c can absorb stress and avoid stress concentration on the light conversion layer 120, thus reducing the chance of cracking or even breakage of the light conversion layer 120 between the LED segments 102, 104 and the conductor segments 130. The degree of bendability of the LED filament is increased by the arrangement of the auxiliary strip 132c. In the present embodiment, the auxiliary strips 132c are one piece; in other embodiments, the auxiliary strips 132c may be plural and disposed at different positions of the LED filaments in the radial direction.
如图4E所示，在本实施例中，LED灯丝100的LED段102、104与导体段130两者在外观结构上具有一致性，且LED灯丝更包括多个辅助条132d。多个辅助条132d设置于LED灯丝100之中，且被光转换层120包裹覆盖起来。多个辅助条132d是沿着LED灯丝的轴向方向排列，而呈现分段的设置。各辅助条132d分别设置于各导体段130的区域中，且各辅助条132d会沿LED灯丝的轴向方向贯穿对应的导体段130，并沿LED灯丝的轴向方向延伸到与对应的导体段130相邻的LED段102、104中，在本实施例中，辅助条132d不会贯穿LED段102、104的区域中。As shown in FIG. 4E, in the present embodiment, the LED segments 102, 104 of the LED filament 100 and the conductor segments 130 are identical in appearance structure, and the LED filament further includes a plurality of auxiliary strips 132d. A plurality of auxiliary strips 132d are disposed in the LED filament 100 and are covered by the light conversion layer 120. The plurality of auxiliary strips 132d are arranged along the axial direction of the LED filaments to present a segmented arrangement. Each of the auxiliary strips 132d is disposed in a region of each of the conductor segments 130, and each of the auxiliary strips 132d extends through the corresponding conductor segment 130 in the axial direction of the LED filament and extends along the axial direction of the LED filament to the corresponding conductor segment. Of the 130 adjacent LED segments 102, 104, in the present embodiment, the auxiliary strip 132d does not penetrate the region of the LED segments 102, 104.
在LED灯丝100弯折时，导体段130会呈现较大的变化，多个辅助条132d可以吸收LED段102、104与导体段130因为弯折而产生的应力，避免应力集中于LED段102、104与导体段130的光转换层120，如此可减少LED段102、104与导体段130之间的光转换 层120产生裂痕或甚至断裂的机会。藉由辅助条132d的设置，使得LED灯丝的可弯折程度提高，从而提高了产品的质量。在本实施例中，多个辅助条132d是沿LED灯丝的轴向方向延伸且在特定的径向方向上彼此对齐；在其他实施例中，多个辅助条132d也可以是沿LED灯丝的轴向方向延伸，但并未在特定的径向方向上彼此对齐，而是分散在在径向方向上的不同位置。When the LED filament 100 is bent, the conductor segment 130 will exhibit a large change, and the plurality of auxiliary strips 132d can absorb the stress generated by the LED segments 102, 104 and the conductor segment 130 due to bending, thereby avoiding stress concentration on the LED segment 102, 104 and the light converting layer 120 of the conductor segment 130, this reduces the chance of cracking or even breakage of the light converting layer 120 between the LED segments 102, 104 and the conductor segments 130. By the arrangement of the auxiliary strip 132d, the degree of bending of the LED filament is increased, thereby improving the quality of the product. In the present embodiment, the plurality of auxiliary strips 132d extend in the axial direction of the LED filament and are aligned with each other in a specific radial direction; in other embodiments, the plurality of auxiliary strips 132d may also be along the axis of the LED filament. They extend in the direction but are not aligned with each other in a specific radial direction, but are dispersed at different positions in the radial direction.
如图4F所示，在本实施例中，LED灯丝100的LED段102、104与导体段130两者具有不同的结构特征。在本实施例中，导体段130还包括螺旋结构132e，螺旋结构132e设置于导体段130的表面边缘上，且以LED灯丝的轴向方向为中心环绕设置于导体段130。在本实施例中，螺旋结构132e是由导体段130的表面凸出来的螺旋状结构，螺旋结构132e是沿着LED灯丝的轴向方向，由导体段130的一端(例如邻接LED段102的一端)开始延续不断地环绕导体段130的边缘，直到导体段130的另一端(例如邻接LED段104的一端)。如图4F所示，螺旋结构132e的虚线部分是位在附图中导体段130的后方，因此以虚线呈现。整体来看，螺旋结构132e会相对于LED灯丝的轴向方向呈现倾斜的布置。在其他实施例中，螺旋结构132e也可以是由导体段130的表面凹进去的螺旋状结构。在本发明其他实施例中，考虑LED灯丝100整体制作工艺的批量生产性，LED灯丝100的LED段102、104与导体段130两者可具有相同的螺旋结构132e结构特征。As shown in FIG. 4F, in the present embodiment, both the LED segments 102, 104 and the conductor segments 130 of the LED filament 100 have different structural features. In the present embodiment, the conductor segment 130 further includes a spiral structure 132e disposed on the surface edge of the conductor segment 130 and disposed around the conductor segment 130 centering on the axial direction of the LED filament. In the present embodiment, the helical structure 132e is a helical structure that protrudes from the surface of the conductor segment 130. The helical structure 132e is along the axial direction of the LED filament, and is terminated by one end of the conductor segment 130 (eg, adjacent one end of the LED segment 102). The continuation of the edge of the conductor segment 130 continues until the other end of the conductor segment 130 (e.g., adjacent one end of the LED segment 104). As shown in Fig. 4F, the dashed portion of the spiral structure 132e is located behind the conductor segment 130 in the drawing and is therefore presented in dashed lines. Overall, the helical structure 132e will assume an oblique arrangement relative to the axial direction of the LED filament. In other embodiments, the helical structure 132e may also be a helical structure that is recessed by the surface of the conductor segment 130. In other embodiments of the present invention, considering the mass production of the overall fabrication process of the LED filament 100, both the LED segments 102, 104 and the conductor segments 130 of the LED filament 100 may have the same helical structure 132e structural features.
如图4G所示，图4G的LED灯丝100是图4F的灯丝被弯折后的状态。如图4G所示，当LED灯丝100在被弯折时，导体段130可作为主要的弯折处，且导体段130的螺旋结构132e可使导体段130易于延伸、压缩，更有利于被弯折。举例来说，如图4G所示，导体段130在弯折处的外侧会延伸而内侧会压缩，而螺旋结构132e则可补偿这样的延伸与压缩。延伸之后的螺旋结构132e会变得较为疏松而平整，也就是高低落差变小且相邻波峰或波谷的间距变大；而压缩之后的螺旋结构132e则会变得较为紧密而更加凸出，也就是高低落差变大且相邻波峰或波谷的间距变小。由于螺旋结构132e可提供延伸与压缩的裕度，使得导体段130更易于弯折。As shown in FIG. 4G, the LED filament 100 of FIG. 4G is in a state in which the filament of FIG. 4F is bent. As shown in FIG. 4G, when the LED filament 100 is bent, the conductor segment 130 can serve as a main bend, and the spiral structure 132e of the conductor segment 130 can easily extend and compress the conductor segment 130, which is more favorable for being bent. fold. For example, as shown in Figure 4G, the conductor segments 130 will extend outwardly of the bend and the inside will compress, while the helical structure 132e will compensate for such extension and compression. After the extension, the spiral structure 132e becomes looser and flatter, that is, the height difference becomes smaller and the pitch of adjacent peaks or troughs becomes larger; and the spiral structure 132e after compression becomes more compact and more convex, That is, the height difference becomes large and the pitch of adjacent peaks or troughs becomes small. Since the helical structure 132e can provide a margin of extension and compression, the conductor segments 130 are more susceptible to bending.
如图4H所示，在本实施例中，LED灯丝100大致上相同于图4A的LED灯丝，不过在图4H的LED灯丝100中，导体段130的导体130b具有波浪状的结构。当LED灯丝在被弯折时，导体段130作为主要的弯折处，位于导体段130内部的导体130b也会随着导体段130的弯折而弯折，由于导体130b的波浪状结构，使得导体130b有较大的延展性可随着导体段130的弯折而延伸或压缩，从而使导体130b因弯折而易受应力拉扯，且也不容易断裂。相应地，导体130b与所连接的LED芯片142的连接关系将更加稳定，导体130b的耐用度也因此提高。As shown in FIG. 4H, in the present embodiment, the LED filament 100 is substantially identical to the LED filament of FIG. 4A, but in the LED filament 100 of FIG. 4H, the conductor 130b of the conductor segment 130 has a wavy configuration. When the LED filament is bent, the conductor segment 130 serves as a main bend, and the conductor 130b located inside the conductor segment 130 is also bent as the conductor segment 130 is bent, due to the wavy structure of the conductor 130b. The greater ductility of the conductor 130b can be extended or compressed as the conductor segment 130 is bent, so that the conductor 130b is susceptible to stress pulling due to bending and is not easily broken. Accordingly, the connection relationship between the conductor 130b and the connected LED chip 142 will be more stable, and the durability of the conductor 130b is also improved.
如图4I所示，在本实施例中，LED灯丝的LED段102、104的光转换层120与导体段130的光转换层120分别包括有分布其中的颗粒。并且，LED段102、104与导体段130所具有的颗粒彼此可以是结构不同、材质不同、效果不同或分布密度不同的，这是由于LED段102、104与导体段130分别肩负不同的功能，因此LED段102、104与导体段130 的光转换层120可分别设置有不同类型的颗粒来达到不同的效果。例如，LED段102、104的光转换层120可包括荧光粉124a，而导体段130光转换层120则包括导光粒子124b。荧光粉124a可吸收LED芯片142发出的光线，并转换光线的波长以降低或提高色温，同时荧光粉124a也兼具光扩散的效果，因此在LED段102、104的光转换层120设置荧光粉124a有助于改变光线色温，也能使光线分散更加均匀。而导体段130不具有LED芯片，且导体段130是作为LED灯丝的主要弯折部分，因此在导体段130的光转换层120中设置有导光粒子124b，导光粒子124b具有光扩散与光传导的效果，有助于将相邻的LED段102、104中的光线传导至导体段130中，并进一步在导体段130中均匀扩散开来。As shown in FIG. 4I, in the present embodiment, the light conversion layer 120 of the LED segments 102, 104 of the LED filament and the light conversion layer 120 of the conductor segment 130 respectively include particles distributed therein. Moreover, the particles of the LED segments 102, 104 and the conductor segments 130 may have different structures, different materials, different effects, or different distribution densities, because the LED segments 102, 104 and the conductor segments 130 respectively have different functions. Therefore, the LED segments 102, 104 and the light conversion layer 120 of the conductor segment 130 can be respectively provided with different types of particles to achieve different effects. For example, the light conversion layer 120 of the LED segments 102, 104 can include phosphor 124a, while the conductor segment 130 light conversion layer 120 includes light directing particles 124b. The phosphor 124a can absorb the light emitted by the LED chip 142 and convert the wavelength of the light to reduce or increase the color temperature, and the phosphor 124a also has the effect of diffusing light, so the phosphor is disposed on the light conversion layer 120 of the LED segments 102, 104. 124a helps to change the color temperature of the light and also makes the light spread more evenly. The conductor segment 130 does not have an LED chip, and the conductor segment 130 is a main bent portion of the LED filament. Therefore, the light-converting layer 124b is disposed in the light conversion layer 120 of the conductor segment 130, and the light-guiding particle 124b has light diffusion and light. The effect of conduction helps to direct light in adjacent LED segments 102, 104 into conductor segment 130 and further spread evenly throughout conductor segment 130.
导光粒子124b例如是聚甲基丙烯酸甲酯(PMMA)或树脂所制成的大小不一的颗粒，但不限于此。在一些实施例中，导体段130所包括的粒子还可具有优良的塑性变形性能，例如塑胶制成的粒子，如此一来可提高导体段130的可弯折性能，并强化LED灯丝100在弯折时的支撑性。The light guiding particles 124b are, for example, particles of different sizes made of polymethyl methacrylate (PMMA) or a resin, but are not limited thereto. In some embodiments, the particles included in the conductor segments 130 may also have excellent plastic deformation properties, such as particles made of plastic, which may improve the bendability of the conductor segments 130 and strengthen the LED filament 100 in a bend. Supportability at the time of folding.
如图4J所示，在本实施例中，LED灯丝100的LED段102、104的光转换层120包括光扩散颗粒，例如荧光粉124a，而导体段130的光转换层120则不包括颗粒。在本实施例中，LED段102、104与导体段130的光转换层120例如是硅胶所制成，而导体段130的光转换层120中没有任何颗粒存在，可提高导体段130的可弯折性。As shown in FIG. 4J, in the present embodiment, the light conversion layer 120 of the LED segments 102, 104 of the LED filament 100 includes light diffusing particles, such as phosphor 124a, while the light converting layer 120 of the conductor segment 130 does not include particles. In the present embodiment, the LED segments 102, 104 and the light conversion layer 120 of the conductor segment 130 are made of, for example, silica gel, and no particles are present in the light conversion layer 120 of the conductor segment 130, which can improve the bendability of the conductor segment 130. Folding.
在一些实施例中，导体段130的光转换层120的材质与LED段102、104的光转换层120的材质可以是不同的。例如，LED段102、104的光转换层120是由硅胶制成，而导体段130的光转换层120则是由导光材料制成，例如导体段130的光转换层120可由PMMA、树脂或其组合制成，但不限于此。由于导体段130的光转换层120的材质与LED段102、104的光转换层120的材质不同，使得导体段130与LED段102、104可以具有不同的性能，例如导体段130与LED段102、104可具有不同的弹性系数，使得LED段102、104的支撑性较好，以保护LED芯片142，并使得导体段130的可弯折性较佳，以使LED灯丝100可被弯折而呈现多样化的曲线。In some embodiments, the material of the light conversion layer 120 of the conductor segments 130 and the material of the light conversion layer 120 of the LED segments 102, 104 may be different. For example, the light conversion layer 120 of the LED segments 102, 104 is made of silicone, and the light conversion layer 120 of the conductor segment 130 is made of a light guiding material, for example, the light conversion layer 120 of the conductor segment 130 may be made of PMMA, resin or The combination is made, but is not limited thereto. Since the material of the light conversion layer 120 of the conductor segment 130 is different from the material of the light conversion layer 120 of the LED segments 102, 104, the conductor segments 130 and the LED segments 102, 104 can have different properties, such as the conductor segments 130 and the LED segments 102. , 104 may have different elastic coefficients, so that the LED segments 102, 104 are better supported to protect the LED chip 142, and the bendability of the conductor segment 130 is better, so that the LED filament 100 can be bent. Present a diverse curve.
如图4K所示，在本实施例中，LED灯丝100的LED段102、104与导体段130两者具有不同的结构特征。在本实施例中，LED段102、104与导体段130在LED灯丝100的径向方向上具有不同的宽度、厚度或直径，换句话说，LED段102、104的相对两表面之间的最小距离大于导体段130的相对两表面之间的最大距离。如图4K所示，导体段130相对于LED段102、104较细，当LED灯丝100被弯折时，导体段130是作为主要的弯折部分，而较细的导体段130有助于被弯折成多种的曲线。As shown in FIG. 4K, in the present embodiment, the LED segments 102, 104 of the LED filament 100 and the conductor segments 130 have different structural features. In the present embodiment, the LED segments 102, 104 and the conductor segments 130 have different widths, thicknesses or diameters in the radial direction of the LED filament 100, in other words, the minimum between the opposite surfaces of the LED segments 102, 104. The distance is greater than the maximum distance between opposite surfaces of the conductor segments 130. As shown in Figure 4K, the conductor segments 130 are relatively thin relative to the LED segments 102, 104. When the LED filaments 100 are bent, the conductor segments 130 are the primary bend portions, while the thinner conductor segments 130 help to be Bend into a variety of curves.
在本实施例中，各导体段130在相邻的LED段102、104之间会形成平顺过渡的表面曲线，导体段130会由邻接LED段102、104的一端开始，朝着导体段130的中间，逐渐地变细，也就是说，导体段130与LED段102、104的连接处会呈现平顺的曲线，如此一来，当LED灯丝被弯折时，可分散应力，使应力不会集中导体段130与LED段102、104之间，藉此降低光转换层120产生裂痕或甚至破裂的机会。在其他实施例中，导体段130也可 相对于LED段102、104较粗，并且，LED段102、104的光转换层120与导体段130的光转换层120可以是由不同的材质制成，例如LED段102、104的光转换层120可以设置为较为坚硬而支撑性佳，而导体段130的光转换层120可改为可挠性好的透明封体，例如以PMMA、树脂或其他单一材质或复合材质制成的封体。In this embodiment, each conductor segment 130 will form a smooth transition surface curve between adjacent LED segments 102, 104. The conductor segments 130 will start from one end adjacent to the LED segments 102, 104 toward the conductor segment 130. In the middle, it gradually becomes thinner, that is, the connection between the conductor segment 130 and the LED segments 102, 104 will have a smooth curve, so that when the LED filament is bent, the stress can be dispersed, so that the stress is not concentrated. Between the conductor segments 130 and the LED segments 102, 104, thereby reducing the chance of cracking or even cracking of the light converting layer 120. In other embodiments, the conductor segments 130 may also be relatively thick relative to the LED segments 102, 104, and the light conversion layer 120 of the LED segments 102, 104 and the light conversion layer 120 of the conductor segments 130 may be made of different materials. For example, the light conversion layer 120 of the LED segments 102, 104 may be set to be relatively rigid and supportive, and the light conversion layer 120 of the conductor segment 130 may be changed to a flexible transparent seal such as PMMA, resin or the like. A closure made of a single material or a composite material.
如图4A至4K所示的各个实施例，可以单独实施，也可以组合运用。举例来说，图4B所示的LED灯丝100可以与图4D所示的LED灯丝100组合运用，也就是说，此种LED灯丝100的导体段130具有波浪状的凹陷结构132a，并且LED灯丝内部还具有辅助条132c，使得LED灯丝不但有助于被弯折挠曲，且还具有优良的支撑性。或者，图4I所示的LED灯丝可以与图4G所示的LED灯丝组合运用，也就是说，此种LED灯丝的LED段102、104中分布的颗粒与导体段130中分布的颗粒具有不同的大小、不同的材质及/或不同的密度，且导体段130还具有螺旋结构132e，使得LED灯丝不但有助于被弯折挠曲，且还可让光分布更加均匀，从而加强了全周光照明的效果。The various embodiments shown in Figures 4A through 4K can be implemented separately or in combination. For example, the LED filament 100 shown in FIG. 4B can be used in combination with the LED filament 100 shown in FIG. 4D, that is, the conductor segment 130 of such an LED filament 100 has a wavy recessed structure 132a, and the inside of the LED filament There is also an auxiliary strip 132c so that the LED filament not only contributes to being bent and flexed, but also has excellent supportability. Alternatively, the LED filaments shown in FIG. 4I can be used in combination with the LED filaments shown in FIG. 4G, that is, the particles distributed in the LED segments 102, 104 of such LED filaments are different from the particles distributed in the conductor segments 130. The size, the different materials and/or the different densities, and the conductor segment 130 also has a spiral structure 132e, so that the LED filament not only helps to be flexed and flexed, but also makes the light distribution more uniform, thereby enhancing the full circumference light. The effect of lighting.
依据上述LED灯丝100的结构，如图5所示，LED灯丝200包括多个LED段202、204，导体段230，至少两个电极210、212，光转换层220。导体段230连接相邻两LED段202、204，电极210、212对应于LED芯片202、204配置，且电性连接LED段202、204。LED段202、204包括至少两个LED芯片242，LED芯片间相互电性连接。光转换层220覆盖LED段202、204，导体段230与电极210、212，并分别使两个电极210、212的一部分外露。LED灯丝200还包括多片电路膜240(亦可称透光电路膜)，LED芯片202、204与电极210、212透过电路膜240相互电性连接，光转换层220覆盖于电路膜240。电路膜240的长度小于导体230a的长度，或者分别位于相邻两LED段202、204内的两个LED芯片间的最短距离大于LED段202/204内相邻两LED芯片之间的距离。According to the structure of the LED filament 100 described above, as shown in FIG. 5, the LED filament 200 includes a plurality of LED segments 202, 204, a conductor segment 230, at least two electrodes 210, 212, and a light conversion layer 220. The conductor segments 230 connect the adjacent two LED segments 202, 204, and the electrodes 210, 212 are disposed corresponding to the LED chips 202, 204, and are electrically connected to the LED segments 202, 204. The LED segments 202, 204 include at least two LED chips 242 that are electrically connected to each other. The light conversion layer 220 covers the LED segments 202, 204, the conductor segments 230 and the electrodes 210, 212, and exposes a portion of the two electrodes 210, 212, respectively. The LED filament 200 further includes a plurality of circuit films 240 (also referred to as light transmissive circuit films). The LED chips 202 and 204 and the electrodes 210 and 212 are electrically connected to each other through the circuit film 240, and the light conversion layer 220 covers the circuit film 240. The length of the circuit film 240 is less than the length of the conductor 230a, or the shortest distance between two LED chips respectively located in adjacent LED segments 202, 204 is greater than the distance between adjacent LED chips in the LED segments 202/204.
接下来请参照图6A至图6G，图6A是本发明的分段式的LED灯丝的另一实施例的结构示意图。图6A至图6G所示的分段式LED灯丝400与图4A至图4K所示的分段式LED灯丝100的其中一个差异在于，图6A至图6G所示的分段式LED灯丝400的光转换层420更可区分为两层结构，在一些实施例中，图6A或图6B也可采用图4C至4K所示结构。如图6A所示，LED灯丝400具有：光转换层420；LED段402,404；电极410,412；以及用于电连接相邻两LED段402、404间的导体段430。LED段402、404包括至少两个LED芯片442，LED芯片间通过导线440相互电性连接。在本实施例中，导体段430包括连接LED段402、404的导体430a，其中分别位于相邻两LED段402、404内的两个LED芯片442间的最短距离大于LED段402/404内相邻两LED芯片之间的距离，导线440的长度小于导体430a的长度。如此一来，得以确保当两LED段之间弯折时，所产生的应力不致使导体段产生断裂。光转换层420涂布于LED芯片442/电极410、412的至少两侧上。光转换层420暴露出电极410、412的一部分。光转换层420可至少具有一顶层420a及一基层420b，分别作为灯丝的上位层以及下位层，于此实施例中顶层420a及基层420b分别位于LED芯片442/电极410、412的两侧。需特别说明的是，本文中关于图6A～6M中所述的顶层420a在LED段402、404或导体段430，其在 LED灯丝径向方向上的厚度、直径或宽度，或LED段402、404或导体段430的顶层在LED灯丝径向方向上的厚度、直径或宽度分别指在LED灯丝径向方向上，LED段402、404或导体段430内顶层420a上表面至顶层420a与基层420b交界面，或是至LED芯片442或是导体430a与基层420b交界面的距离，顶层420a上表面为远离基层的一表面。6A to 6G, FIG. 6A is a schematic structural view of another embodiment of the segmented LED filament of the present invention. One of the differences between the segmented LED filament 400 shown in Figures 6A through 6G and the segmented LED filament 100 shown in Figures 4A through 4K is that the segmented LED filament 400 shown in Figures 6A through 6G The light conversion layer 420 can be further divided into a two-layer structure. In some embodiments, the structure shown in FIGS. 4C to 4K can also be employed in FIG. 6A or FIG. 6B. As shown in FIG. 6A, the LED filament 400 has a light conversion layer 420, LED segments 402, 404, electrodes 410, 412, and a conductor segment 430 for electrically connecting between adjacent LED segments 402, 404. The LED segments 402, 404 include at least two LED chips 442 that are electrically connected to each other by wires 440. In the present embodiment, the conductor segment 430 includes a conductor 430a that connects the LED segments 402, 404, wherein the shortest distance between the two LED chips 442 located in adjacent two LED segments 402, 404 is greater than the LED segment 402/404 internal phase. The distance between adjacent two LED chips, the length of the wire 440 is less than the length of the conductor 430a. In this way, it is ensured that when the two LED segments are bent, the generated stress does not cause the conductor segments to break. The light conversion layer 420 is coated on at least two sides of the LED chip 442/ electrodes 410, 412. Light conversion layer 420 exposes a portion of electrodes 410, 412. The light conversion layer 420 can have at least one top layer 420a and one base layer 420b as the upper layer and the lower layer of the filament respectively. In this embodiment, the top layer 420a and the base layer 420b are respectively located on both sides of the LED chip 442/ electrodes 410 and 412. It should be particularly noted that the top layer 420a described herein with respect to Figures 6A-6M is in the LED segment 402, 404 or conductor segment 430, its thickness, diameter or width in the radial direction of the LED filament, or the LED segment 402, The thickness, diameter or width of the top layer of the 404 or conductor segment 430 in the radial direction of the LED filament refers to the upper surface of the top layer 420a to the top layer 420a and the base layer 420b in the LED segment 402, 404 or the conductor segment 430, respectively, in the radial direction of the LED filament. The interface, or to the LED chip 442 or the distance between the conductor 430a and the base layer 420b, the upper surface of the top layer 420a is a surface away from the base layer.
在本实施例中，顶层420a与基层420b中可根据不同的需求，而各具有不同的颗粒或不同的颗粒密度。例如，在LED芯片442的主要发光面是朝向顶层420a的情况下，基层420b可添加更多的光散射颗粒，以提高基层420b的光线散布，使基层420b所能产生的亮度最大化，甚至趋近于顶层420a所能产生的亮度。此外，基层420b也可具有密度更高的荧光粉，以提高基层420b的硬度。在LED灯丝400的制作工艺流程中，可先制备基层420b，再于基层420b上设置LED芯片442、导线440与导体430a。由于基层420b具有可满足后续设置LED芯片和导线的硬度，LED芯片442、导线440与导体430a在设置上可以更加稳定，不会产生下陷或歪斜的情况。最后，再于基层420b、LED芯片442、导线440与导体430a上覆盖顶层420a。In this embodiment, the top layer 420a and the base layer 420b may each have different particles or different particle densities according to different needs. For example, in the case where the main light emitting surface of the LED chip 442 is toward the top layer 420a, the base layer 420b may add more light scattering particles to increase the light dispersion of the base layer 420b, thereby maximizing the brightness of the base layer 420b, or even The brightness that can be produced near the top layer 420a. Further, the base layer 420b may also have a higher density phosphor to increase the hardness of the base layer 420b. In the manufacturing process of the LED filament 400, the base layer 420b may be prepared first, and then the LED chip 442, the wire 440 and the conductor 430a may be disposed on the base layer 420b. Since the base layer 420b has a hardness that can satisfy the subsequent arrangement of the LED chips and the wires, the LED chips 442, the wires 440, and the conductors 430a can be more stable in arrangement without sag or skew. Finally, the top layer 420a is overlaid on the base layer 420b, the LED chip 442, the wires 440, and the conductor 430a.
如图6B所示，在本实施例中，导体段430同样是位于相邻两LED段402、404之间，且LED段402、404中的多个LED芯片442间是通过导线440相互电性连接。不过，图6B的导体段430中的导体430a并非是导线的形态，而是片状或膜状的形态。在一些实施例中，导体430a可为铜箔、金箔或其他可进行电传导的材料。在本实施例中，导体430a是贴覆于基层420b表面且邻接顶层420a，也就是介于基层420b和顶层420a之间。并且，导体段430与LED段402,404通过导线450进行电性连接，即分别位于相邻两LED段402、404内且与导体段430距离最短的两LED芯片442是通过导线450与导体段430中的导体430a进行电性连接。其中，导体段430的长度大于LED段402、404中的相邻两LED芯片之间的距离，且导线440的长度小于导体430a的长度。如此的设计，可确保导体段430具有良好的可弯折性。假设LED芯片在灯丝径向方向上的最大厚度为H，则电极、导体在灯丝径向方向上的厚度为0.5H～1.4H，优选0.5H～0.7H。如此即可以确保打线工艺得以实施，同时确保打线工艺品质(即具有良好强度)，提高产品的稳定性。As shown in FIG. 6B, in the embodiment, the conductor segments 430 are also located between the adjacent two LED segments 402, 404, and the plurality of LED chips 442 in the LED segments 402, 404 are electrically connected to each other through the wires 440. connection. However, the conductor 430a in the conductor segment 430 of Fig. 6B is not in the form of a wire but in a sheet or film form. In some embodiments, the conductor 430a can be a copper foil, gold foil, or other material that can conduct electrical conduction. In the present embodiment, the conductor 430a is attached to the surface of the base layer 420b adjacent to the top layer 420a, that is, between the base layer 420b and the top layer 420a. Moreover, the conductor segments 430 and the LED segments 402, 404 are electrically connected by wires 450, that is, the two LED chips 442 located in the adjacent two LED segments 402, 404 and having the shortest distance from the conductor segments 430 are through the wires 450 and the conductor segments 430. The conductor 430a is electrically connected. Wherein, the length of the conductor segment 430 is greater than the distance between adjacent two LED chips in the LED segments 402, 404, and the length of the wire 440 is less than the length of the conductor 430a. Such a design ensures that the conductor segments 430 have good bendability. Assuming that the maximum thickness of the LED chip in the radial direction of the filament is H, the thickness of the electrode and the conductor in the radial direction of the filament is 0.5H to 1.4H, preferably 0.5H to 0.7H. This ensures that the wire bonding process is carried out while ensuring the quality of the wire bonding process (ie having good strength) and improving the stability of the product.
如图6C所示，本实施例中，LED灯丝的LED段402、404与导体段430两者具有不同的结构特征。在本实施例中，LED段402、404与导体段430在LED灯丝的径向方向上具有不同的宽度、厚度或直径。如图6C所示，导体段430相对于LED段402、404较细，当LED灯丝被弯折时，导体段430是作为主要的弯折部分，而较细的导体段430有助于被弯折成多种的曲线。在本实施例中，基层420b无论是在LED段402、404或是在导体段430，其在LED灯丝的径向方向上的宽度、厚度或直径都是一致的；而顶层420a在LED段402、404与在导体段430，其在LED灯丝的径向方向上则具有不同的宽度、厚度或直径。如图6C所示，LED段402、404的顶层420a在LED灯丝的径向方向上具有最大的直径D2，而在导体段430的顶层420a则在LED灯丝的径向方向上具有最大的直径D1，D2会大于D1。顶层420a的直径是由LED段402、404至导体段430逐渐缩小，再由导体段430至LED段402、404逐渐增加， 因此顶层420a会沿着LED灯丝的轴向方向形成平顺凹凸的曲线。As shown in FIG. 6C, in the present embodiment, the LED segments 402, 404 and the conductor segments 430 of the LED filament have different structural features. In the present embodiment, the LED segments 402, 404 and the conductor segments 430 have different widths, thicknesses, or diameters in the radial direction of the LED filaments. As shown in Figure 6C, the conductor segments 430 are relatively thin with respect to the LED segments 402, 404. When the LED filaments are bent, the conductor segments 430 serve as the primary bend portions, while the thinner conductor segments 430 help to be bent. Fold into a variety of curves. In the present embodiment, the base layer 420b, whether in the LED segments 402, 404 or in the conductor segment 430, has a uniform width, thickness or diameter in the radial direction of the LED filament; and the top layer 420a is in the LED segment 402. , 404 and in conductor segment 430, which have different widths, thicknesses or diameters in the radial direction of the LED filament. As shown in Figure 6C, the top layer 420a of the LED segments 402, 404 has a maximum diameter D2 in the radial direction of the LED filament, while the top layer 420a of the conductor segment 430 has the largest diameter D1 in the radial direction of the LED filament. , D2 will be greater than D1. The diameter of the top layer 420a is gradually reduced from the LED segments 402, 404 to the conductor segments 430, and is gradually increased from the conductor segments 430 to the LED segments 402, 404, so that the top layer 420a will form a smooth concave-convex curve along the axial direction of the LED filaments.
如图6D所示，本实施例中，LED段402、404的顶层420a在LED灯丝的径向方向上具有最大的直径(或最大厚度)，顶层420a的直径是由LED段402、404至导体段430逐渐缩小，且导体430a的一部分(如中间部分)没有被顶层420a所覆盖。而基层420b无论是在LED段402、404或是在导体段430，其在LED灯丝的径向方向上的宽度、厚度或直径都是一致的。在本实施例中，各个LED段402、404中的LED芯片442的数量可以是不相同的，例如，有的LED段402、404中只有一个LED芯片442，而有的LED段402、404中有两个或更多个LED芯片442。各LED段402、402除了LED芯片442数量可设计为不同之外，LED芯片442的种类亦可不同。As shown in FIG. 6D, in this embodiment, the top layer 420a of the LED segments 402, 404 has the largest diameter (or maximum thickness) in the radial direction of the LED filament, and the diameter of the top layer 420a is from the LED segments 402, 404 to the conductor. Segment 430 is gradually reduced and a portion of conductor 430a, such as the intermediate portion, is not covered by top layer 420a. The base layer 420b, whether in the LED segments 402, 404 or in the conductor segment 430, has a uniform width, thickness or diameter in the radial direction of the LED filament. In this embodiment, the number of LED chips 442 in each of the LED segments 402, 404 may be different. For example, some LED segments 402, 404 have only one LED chip 442, and some LED segments 402, 404. There are two or more LED chips 442. The LED segments 402, 402 may be different in type, except that the number of LED chips 442 may be different.
如图6E所示，本实施例中，顶层420a无论是在LED段402、404或是在导体段430，其在LED灯丝的径向方向上的宽度、厚度或直径都是一致的，而基层420b则可在至少一个导体430a处凹陷或挖空，使至少一个导体430a的一部分(如中间部分)没有被基层420b覆盖，而另外至少一个导体430a则会被基层420b完全覆盖。As shown in FIG. 6E, in the present embodiment, the top layer 420a is uniform in width, thickness or diameter in the radial direction of the LED filament, whether in the LED segments 402, 404 or in the conductor segment 430, and the base layer The 420b may then be recessed or hollowed out at the at least one conductor 430a such that a portion (e.g., the intermediate portion) of the at least one conductor 430a is not covered by the base layer 420b, while the other at least one conductor 430a is completely covered by the base layer 420b.
如图6F所示，本实施例中，顶层420a无论是在LED段402、404或是在导体段430，其在LED灯丝的径向方向上的宽度、厚度或直径都是一致的，而基层420b则在所有导体430a处凹陷或挖空，使每个导体430a的一部分(如中间部分)没有被基层420b覆盖。As shown in FIG. 6F, in the present embodiment, the top layer 420a is uniform in width, thickness or diameter in the radial direction of the LED filament, whether in the LED segments 402, 404 or in the conductor segment 430, and the base layer 420b is then recessed or hollowed out at all conductors 430a such that a portion (e.g., the intermediate portion) of each conductor 430a is not covered by the base layer 420b.
如图6G所示，本实施例中，LED段402、404的顶层420a在LED灯丝的径向方向上具有最大的直径，顶层420a的直径是由LED段402、404至导体段430逐渐缩小，且导体430a的一部分(如中间部分)没有被顶层420a覆盖。而基层420b则在导体430a处凹陷或挖空，使导体430a的一部分(如中间部分)没有被基层420b覆盖。换句话说，导体430a的至少相对两侧会分别没有被顶层420a与基层420b覆盖。As shown in FIG. 6G, in the present embodiment, the top layer 420a of the LED segments 402, 404 has the largest diameter in the radial direction of the LED filament, and the diameter of the top layer 420a is gradually reduced from the LED segments 402, 404 to the conductor segment 430. And a portion of the conductor 430a, such as the intermediate portion, is not covered by the top layer 420a. The base layer 420b is recessed or hollowed out at the conductor 430a such that a portion (e.g., the intermediate portion) of the conductor 430a is not covered by the base layer 420b. In other words, at least opposite sides of the conductor 430a are not covered by the top layer 420a and the base layer 420b, respectively.
以上如图6E至6G的实施例说明，当基层420b在部分或所有导体段430具有凹陷或挖空的情形，所述的凹陷或挖空的形式亦可能为夹缝或细缝，也就是可提供导体段430良好的弯折性，而导体430a不会外露。The embodiment shown in Figures 6E to 6G above illustrates that when the base layer 420b has a depression or hollowing out in part or all of the conductor segments 430, the recessed or hollowed out form may also be a slit or a slit, that is, The conductor segments 430 are well bent and the conductors 430a are not exposed.
如图6H所示，在本实施例中，导体430a例如是可导电的金属片或金属条。导体430a具有厚度Tc，由于LED芯片442相对于导体430a更加纤薄，因此导体430a的厚度Tc会明显地大于LED芯片442的厚度。除此之外，相对于LED芯片442的厚度，导体430a的厚度Tc则更加接近顶层420a在导体段430的厚度(顶层420a在导体段430的厚度可参照前述顶层420a在径向方向上的直径D1)，Tc＝(0.7～0.9)D1，优选Tc＝(0.7～0.8)D1。并且，在本实施例中，顶层420a在导体段430与在LED段402、404的厚度(顶层420a在LED段402、404的厚度可参照前述顶层420a在径向方向上的直径D2)是一致的。As shown in FIG. 6H, in the present embodiment, the conductor 430a is, for example, a conductive metal piece or a metal strip. The conductor 430a has a thickness Tc, and since the LED chip 442 is thinner with respect to the conductor 430a, the thickness Tc of the conductor 430a is significantly larger than the thickness of the LED chip 442. In addition, with respect to the thickness of the LED chip 442, the thickness Tc of the conductor 430a is closer to the thickness of the top layer 420a at the conductor segment 430 (the thickness of the top layer 420a at the conductor segment 430 can be referred to the diameter of the aforementioned top layer 420a in the radial direction. D1), Tc = (0.7 to 0.9) D1, preferably Tc = (0.7 to 0.8) D1. Also, in the present embodiment, the top layer 420a is identical in conductor segment 430 to the thickness of the LED segments 402, 404 (the thickness of the top layer 420a in the LED segments 402, 404 can be referenced to the diameter D2 of the aforementioned top layer 420a in the radial direction). of.
如图6I所示，在本实施例中，导体430a的厚度Tc同样明显地大于LED芯片442的厚度，且相对于LED芯片442的厚度，导体430a的厚度Tc则更加接近顶层420a在导体段430的厚度(直径D1)。并且，在本实施例中，顶层420a在导体段430与LED段402、404的厚度是不一致的。如图6I所示，LED段402、404的顶层420a在LED灯丝的径向方向上具有 最小的直径D2，而在导体段430的顶层420a则在LED灯丝的径向方向上具有最大的直径D1，D1会大于D2。顶层420a的直径是由LED段402、404至导体段430逐渐增加，再由导体段430至LED段402、404逐渐减小，因此顶层420a会沿着LED灯丝的轴向方向形成平顺凹凸的曲线。As shown in FIG. 6I, in the present embodiment, the thickness Tc of the conductor 430a is also significantly larger than the thickness of the LED chip 442, and the thickness Tc of the conductor 430a is closer to the top layer 420a at the conductor segment 430 with respect to the thickness of the LED chip 442. Thickness (diameter D1). Also, in the present embodiment, the thickness of the top layer 420a is inconsistent with the thickness of the conductor segments 430 and the LED segments 402, 404. As shown in FIG. 6I, the top layer 420a of the LED segments 402, 404 has a minimum diameter D2 in the radial direction of the LED filament, while the top layer 420a of the conductor segment 430 has the largest diameter D1 in the radial direction of the LED filament. , D1 will be greater than D2. The diameter of the top layer 420a is gradually increased from the LED segments 402, 404 to the conductor segments 430, and then gradually decreases from the conductor segments 430 to the LED segments 402, 404, so that the top layer 420a will form a smooth concave-convex curve along the axial direction of the LED filaments. .
如图6J所示，本实施例中，导体430a的厚度Tc同样明显地大于LED芯片442的厚度，不过，LED段402、404的顶层420a在LED灯丝的径向方向上具有最大的直径，且顶层420a的直径是由LED段402、404至导体段430逐渐缩小，且导体430a的一部分(如中间部分)没有被顶层420a覆盖。As shown in FIG. 6J, in the present embodiment, the thickness Tc of the conductor 430a is also significantly larger than the thickness of the LED chip 442, however, the top layer 420a of the LED segments 402, 404 has the largest diameter in the radial direction of the LED filament, and The diameter of the top layer 420a is gradually reduced from the LED segments 402, 404 to the conductor segments 430, and a portion of the conductor 430a (e.g., the intermediate portion) is not covered by the top layer 420a.
如图6K所示，在本实施例中，导体430a的厚度同样明显地大于LED芯片442的厚度，且相对于LED芯片442的厚度，导体430a的厚度则更加接近顶层420a在导体段430的厚度。在LED灯丝的宽度方向上(宽度方向垂直于轴向方向与前述厚度方向)，顶层420a具有宽度W1，而LED芯片442具有宽度W2，LED芯片442的宽度W2接近顶层420a的宽度W1。也就是说，顶层420a在宽度方向上稍微大于LED芯片442，而在厚度方向上稍微大于导体430a。在其它实施例中，顶层420a的宽度W1：LED芯片442的宽度W2＝2～5:1。在本实施例中，基层420b与顶层420a具有相同的宽度W1，但不限于此。此外，如图6K所示，在本实施例中，导体段430更包括波浪状的凹陷结构432a，此波浪状的凹陷结构432a是设置于导体段430的一侧表面上。在本实施例中，凹陷结构432a是由导体段430的顶层420a的上侧表面凹陷进去。多个凹陷结构432a沿着轴向方向间隔排列，且彼此平行，而呈现连续的波浪状。在一些实施例中，多个凹陷结构432a沿着轴向方向连续紧密的排列。在一些实施例中，波浪状的凹陷结构432a也可以是以LED灯丝的轴向方向为中心环绕设置于导体段430的整个外周面。在一些实施例中，所述波浪状的凹陷结构432a亦可改为波浪状的凸起结构(如图4C所示)。在一些实施例中，所述波浪状的凹陷结构与波浪状的凸起结构可交错排列在一起而形成波浪状的凹凸结构。As shown in FIG. 6K, in the present embodiment, the thickness of the conductor 430a is also significantly larger than the thickness of the LED chip 442, and the thickness of the conductor 430a is closer to the thickness of the top layer 420a at the conductor segment 430 with respect to the thickness of the LED chip 442. . In the width direction of the LED filament (the width direction is perpendicular to the axial direction and the aforementioned thickness direction), the top layer 420a has a width W1, and the LED chip 442 has a width W2, and the width W2 of the LED chip 442 is close to the width W1 of the top layer 420a. That is, the top layer 420a is slightly larger than the LED chip 442 in the width direction and slightly larger than the conductor 430a in the thickness direction. In other embodiments, the width W1 of the top layer 420a: the width W2 of the LED chip 442 is 2 to 5:1. In the present embodiment, the base layer 420b has the same width W1 as the top layer 420a, but is not limited thereto. In addition, as shown in FIG. 6K, in the embodiment, the conductor segment 430 further includes a wavy recess structure 432a disposed on one side surface of the conductor segment 430. In the present embodiment, the recessed structure 432a is recessed by the upper side surface of the top layer 420a of the conductor segment 430. The plurality of recessed structures 432a are spaced apart in the axial direction and are parallel to each other to present a continuous wave shape. In some embodiments, the plurality of recessed features 432a are continuously closely aligned in the axial direction. In some embodiments, the undulating recessed structure 432a may also be disposed around the entire outer peripheral surface of the conductor segment 430 centering on the axial direction of the LED filament. In some embodiments, the wavy concave structure 432a may also be changed to a wavy convex structure (as shown in FIG. 4C). In some embodiments, the wavy concave structure and the wavy convex structure may be staggered together to form a wavy concave-convex structure.
如图6L所示，在本实施例中，LED芯片442在LED灯丝的轴向方向上具有长度，且在X方向上具有宽度，LED芯片442的长度比宽度的比为2:1～6:1。例如在一实施例中将两个LED芯片电连接作为一个芯片单元，此LED芯片单元的长宽比可为6:1，可使灯丝具有较大的光通量。并且，LED芯片442、电极410、412与导体430a在Y方向具有厚度，电极410、412的厚度会小于LED芯片442的厚度，导体430a的厚度Tc也小于芯片442的厚度，也就是导体430a与电极410、412看起来会比芯片442薄。此外，顶层420a与基层420b在Y方向具有厚度，基层420b的厚度小于顶层420a的最大厚度。在本实施例中，导体430a在沿着Y方向的顶视图上来看是呈现平行四边形而非矩形，亦即导体430a在顶视图呈现的四边的夹角非90度角。除此之外，LED芯片442的两端会分别连接导线440或导线450，以透过导线440或导线450连接到另一芯片442或导体430a，而LED芯片442两端用来连接导线440或导线450的连接点，在LED灯丝的轴向方向上是没有彼此对齐的。举例来说，芯片442的一端的连接点会朝向负X方向偏移，而芯片442的另一端的连接点则会朝向正X方向偏移，亦 即芯片442的两端的两个连接点在X方向上会间隔一段距离。As shown in FIG. 6L, in the present embodiment, the LED chip 442 has a length in the axial direction of the LED filament and has a width in the X direction, and the ratio of the length to the width of the LED chip 442 is 2:1 to 6: 1. For example, in one embodiment, two LED chips are electrically connected as one chip unit, and the LED chip unit can have an aspect ratio of 6:1, which enables the filament to have a large luminous flux. Further, the LED chip 442, the electrodes 410, 412 and the conductor 430a have a thickness in the Y direction, the thickness of the electrodes 410, 412 is smaller than the thickness of the LED chip 442, and the thickness Tc of the conductor 430a is also smaller than the thickness of the chip 442, that is, the conductor 430a and The electrodes 410, 412 appear to be thinner than the chip 442. Further, the top layer 420a and the base layer 420b have a thickness in the Y direction, and the thickness of the base layer 420b is smaller than the maximum thickness of the top layer 420a. In the present embodiment, the conductor 430a exhibits a parallelogram rather than a rectangle in a top view along the Y direction, that is, the angle of the four sides of the conductor 430a presented in the top view is not a 90 degree angle. In addition, the two ends of the LED chip 442 are respectively connected to the wire 440 or the wire 450 to be connected to the other chip 442 or the conductor 430a through the wire 440 or the wire 450, and the two ends of the LED chip 442 are used to connect the wire 440 or The connection points of the wires 450 are not aligned with each other in the axial direction of the LED filaments. For example, the connection point of one end of the chip 442 is offset toward the negative X direction, and the connection point of the other end of the chip 442 is offset toward the positive X direction, that is, the two connection points of the two ends of the chip 442 are at the X. There will be a distance in the direction.
如图6K所示的波浪状的凹陷或凸起结构432a，其是在Y方向上呈现凹陷与隆起的波浪状，但在LED灯丝的轴向方向上则保持直线状(以顶视图来看，波浪状的凹陷或凸起结构432a是沿着LED灯丝的轴向方向排列的直线)，或者为凹陷结构432a在Y方向上最低点的连线或凸起结构432a在Y方向上最高点的连线为直线。而如图6L所示的波浪状的凹陷结构432a，其不但是在Y方向呈现波浪状，同时还在LED灯丝的轴向方向上弯曲(以顶视图来看，波浪状的凹陷或凸起结构432a是沿着LED灯丝的轴向方向排列的曲线)，或者为凹陷结构432a在Y方向上最低点的连线或凸起结构432a在Y方向上最高点的连线为曲线。a wavy concave or convex structure 432a as shown in FIG. 6K, which is a wave shape showing a depression and a bulge in the Y direction, but is kept linear in the axial direction of the LED filament (in a top view, The wavy concave or convex structure 432a is a straight line arranged along the axial direction of the LED filament, or the connection of the lowest point of the concave structure 432a in the Y direction or the highest point of the convex structure 432a in the Y direction. The line is a straight line. The undulating recessed structure 432a as shown in FIG. 6L is not only undulated in the Y direction but also curved in the axial direction of the LED filament (in the top view, the wavy recessed or raised structure) 432a is a curve arranged along the axial direction of the LED filament, or a line connecting the lowest point of the recessed structure 432a in the Y direction or the highest point of the convex structure 432a in the Y direction is a curve.
如图6M所示，其为图6L的导体段430的局部顶视图，其呈现波浪状的凹陷或凸起结构432a，图6L呈现出导体段430在LED灯丝轴向方向上的弯曲形态。并且，在本实施例中，每一凹陷结构432a本身在LED灯丝的轴向方向上的宽度是不规则的，亦即每一凹陷结构432a的任意两处在LED灯丝轴向方向上的宽度是不相等的，例如，图6M中某一凹陷结构432a的两处分别具有宽度D1与宽度D2，且宽度D1与宽度D2不相等。此外，在本实施例中，各个凹陷结构432a在LED灯丝的轴向方向上的宽度也是不规则的，举例来说，各个凹陷结构432a在LED灯丝的轴向方向上对齐的地方，彼此的宽度却是不相等的，例如，图6M中相邻的两凹陷结构432a在轴向方向上对齐的两处分别具有宽度D1与宽度D3，且宽度D1与宽度D3不相等。在其它实施例中，凹陷或凸起结构432a的形状为直条状或直条状与波浪状的组合，在导体段的顶视图上，顶层420a在导体段430处的凹陷或凸起结构432a的形状可为直线或直线与波浪线的组合。As shown in Fig. 6M, which is a partial top view of the conductor segment 430 of Fig. 6L, which presents a wavy depression or raised structure 432a, Fig. 6L shows the curved configuration of the conductor segment 430 in the axial direction of the LED filament. Moreover, in the present embodiment, the width of each recessed structure 432a itself in the axial direction of the LED filament is irregular, that is, the width of any two places of each recessed structure 432a in the axial direction of the LED filament is Unequal, for example, two places of a certain recessed structure 432a in FIG. 6M have a width D1 and a width D2, respectively, and the width D1 and the width D2 are not equal. In addition, in the present embodiment, the width of each of the recessed structures 432a in the axial direction of the LED filament is also irregular. For example, where the recessed structures 432a are aligned in the axial direction of the LED filament, the width of each other However, the two recessed structures 432a in FIG. 6M have a width D1 and a width D3 at two positions aligned in the axial direction, respectively, and the width D1 and the width D3 are not equal. In other embodiments, the shape of the recessed or raised structure 432a is a straight strip or a combination of a straight strip and a wave, and a recessed or raised structure 432a of the top layer 420a at the conductor segment 430 in a top view of the conductor segment The shape can be a straight line or a combination of a straight line and a wavy line.
图7示出了LED灯丝层状结构的另一实施例。于此实施例中，LED段402,404、金线440、顶层420a配置于基层420b的两侧，也就是说，基层420b位于两个顶层420a的中间。电极410,412分别地配置于基层420b的两端。图中上下两个顶层420a中的LED段402,404可通过金线440连接至同一电极410/412。如此，可使出光更为均匀，金线440的形状可具有弯折形状(例如图4H中略呈M字型)以减缓冲击力，亦可为较常见的弧状或直线状。Figure 7 illustrates another embodiment of a layered structure of LED filaments. In this embodiment, the LED segments 402, 404, the gold wires 440, and the top layer 420a are disposed on both sides of the base layer 420b, that is, the base layer 420b is located in the middle of the two top layers 420a. The electrodes 410, 412 are respectively disposed at both ends of the base layer 420b. The LED segments 402, 404 in the upper and lower top layers 420a of the figure can be connected to the same electrode 410/412 by gold wires 440. In this way, the light can be made more uniform, and the shape of the gold wire 440 can have a bent shape (for example, a slightly M-shape in FIG. 4H) to reduce the impact force, and can also be a more common arc or straight shape.
图8示出了本案灯丝层状结构的另一实施例。如图8所示，灯丝400的光转换层包括顶层420a以及基层420b。LED段402,404的各个面均与顶层420a直接接触；而基层420b不与LED段402,404接触。于制造过程中，可预先形成基层420b，其次形成LED段402,404以及顶层420a。Fig. 8 shows another embodiment of the filament layered structure of the present invention. As shown in FIG. 8, the light conversion layer of the filament 400 includes a top layer 420a and a base layer 420b. Each side of the LED segments 402, 404 is in direct contact with the top layer 420a; and the base layer 420b is not in contact with the LED segments 402, 404. In the manufacturing process, the base layer 420b may be preformed, and the LED segments 402, 404 and the top layer 420a are formed second.
于另一实施例中，如图9所示，灯丝400的基层420b形成为具有高低起伏的波浪状表面，LED段402,404配置于其上而具有高低起伏并呈斜置状态。因而灯丝具有较广的出光角度。也就是说，若以基层的底面与工作台表面的接触面为水平面，LED段的配置并不需要与水平面平行，而是与水平面之间具有一定夹角的方式来配置，且每个LED段之间的配置高度/角度/方向亦可为不同。换句话说，若以LED段中心点串接多个LED段时，所形成的线条可不为直线。如此，可使灯丝400即使在没有弯折的状态下，就已经具备增加出光角度且出光均匀的效果。In another embodiment, as shown in FIG. 9, the base layer 420b of the filament 400 is formed as a wavy surface having a high and low undulation, and the LED segments 402, 404 are disposed thereon with high and low undulations and are inclined. Thus the filament has a wider exit angle. That is to say, if the contact surface of the bottom surface of the base layer and the surface of the work surface is a horizontal plane, the arrangement of the LED segments does not need to be parallel to the horizontal plane, but is arranged at a certain angle with the horizontal plane, and each LED segment is arranged. The configured height/angle/direction can also be different. In other words, if a plurality of LED segments are connected in series at the center point of the LED segment, the formed line may not be a straight line. In this way, the filament 400 can be provided with an effect of increasing the light exit angle and uniform light emission even in a state where the filament 400 is not bent.
图10示出的LED灯丝封装结构当中，灯丝400具有：LED段402,404；电极410,412；金线440；光转换层420，以及电性连接两LED段402、404的导体段430。LED段402、404包括至少两个LED芯片142，LED芯片间通过导线440相互电性连接。光转换层420包括基层420a与顶层420b，于基层420a上通过贴覆具有多个径向开口的铜箔460。铜箔460上表面可进一步具有镀银层461，位于灯丝头尾两端的铜箔作为电极410,412并延伸超过光转换层420。其次可通过固晶胶等方式将LED段402,404固定于基层420a上。其后，施加荧光粉胶或荧光粉膜，使其包覆LED段402,404、金线440，导体段430以及电极410,412的一部分，以形成光转换层420。铜箔460的开口的宽度或/及长度大于LED芯片442，限定LED芯片的位置，并使LED芯片的六个面当中的至少两个面以上(本实施例为五个面)均接触并被顶层荧光粉胶包覆。在此实施例中，铜箔460搭配金线440的组合为灯丝带来稳固而又维持可挠性的导电结构；镀银层461除了带来良好的导电性外亦具有增加光反射的效果。In the LED filament package structure shown in FIG. 10, the filament 400 has: LED segments 402, 404; electrodes 410, 412; gold wires 440; a light conversion layer 420, and a conductor segment 430 electrically connecting the two LED segments 402, 404. The LED segments 402, 404 include at least two LED chips 142 that are electrically connected to each other by wires 440. The light conversion layer 420 includes a base layer 420a and a top layer 420b, and a copper foil 460 having a plurality of radial openings is attached to the base layer 420a. The upper surface of the copper foil 460 may further have a silver plating layer 461, and copper foils at both ends of the filament head and tail serve as electrodes 410, 412 and extend beyond the light conversion layer 420. Secondly, the LED segments 402, 404 can be fixed to the base layer 420a by means of a solid crystal glue or the like. Thereafter, a phosphor paste or phosphor film is applied to cover the LED segments 402, 404, the gold wires 440, the conductor segments 430, and a portion of the electrodes 410, 412 to form the light conversion layer 420. The width or/and the length of the opening of the copper foil 460 is larger than the LED chip 442, the position of the LED chip is defined, and at least two of the six faces of the LED chip (the five faces in this embodiment) are contacted and Top layer of phosphor glue coated. In this embodiment, the combination of the copper foil 460 and the gold wire 440 is a lamp ribbon to stabilize and maintain a flexible conductive structure; the silver plating layer 461 has an effect of increasing light reflection in addition to good electrical conductivity.
图11示出的LED灯丝封装结构当中，灯丝400类似于图10所揭露的灯丝，其不同之处在于：(1)灯丝400使用的LED芯片442为焊脚高度相同的倒装芯片，直接将焊脚接在镀银层461上；(2)前面所述灯丝开口的长度(即灯丝轴向上的长度)为了要容纳LED芯片442而必须大于LED芯片442，而本实施例的灯丝的LED芯片442对应开口432并位于铜箔460/镀银层461的上方，因此LED芯片442的长度大于开口432。本实施例相较于前述实施例省略了打金线的步骤。In the LED filament package structure shown in FIG. 11, the filament 400 is similar to the filament disclosed in FIG. 10, and the difference is that: (1) the LED chip 442 used for the filament 400 is a flip chip having the same solder fillet height, and will directly The solder fillet is attached to the silver plating layer 461; (2) the length of the filament opening described above (ie, the length in the axial direction of the filament) must be larger than the LED chip 442 in order to accommodate the LED chip 442, and the LED of the filament of the present embodiment The chip 442 corresponds to the opening 432 and is located above the copper foil 460/silver plating layer 461, so the length of the LED chip 442 is larger than the opening 432. This embodiment omits the step of golding the wire as compared with the previous embodiment.
在LED灯丝封装结构当中，可以采用如图11所示的LED灯丝。不同之处在于，使用了将正装芯片进行倒装配置，即将原本高度不同的焊脚处理为相同高度后(通常为将较低的N极延伸处理为与P极同高度)进行倒装配置。In the LED filament package structure, an LED filament as shown in FIG. 11 can be used. The difference is that the flip chip is used for flip-chip configuration, that is, the original height of different solder fillets is processed to the same height (usually the lower N-pole extension is treated to the same height as the P-pole).
接下来请参见图12。在图12中，LED灯丝400被进一步截成大小两部分示意显示其内部结构。小部分是矩形ABCD通过围绕线CD(即LED灯丝中心轴)旋转360度来限定的。类似地，除了小部分占用的空间之外，大部分是矩形ABCD通过围绕线CD旋转360度而限定的。封体420的区域由垂直于封体420的纵向轴线与封体420相交的假想的一组平行平面限定。例如，封体420包括两个交替的第一光转换层420a与第二光转换层420b。LED灯丝包括LED段402，404、封体420、导体段430及电极410，导体段430位于相邻两LED段402，404之间，电极410与LED段402/404电性连接，第一光转换层420a包覆LED段402,404，第二光转换层420b包覆导体段430。由假设的一组平行平面限定，LED段402/404包括多个LED芯片442。在一个实施例中，假想的一组平行平面正好在LED段402/404的边缘处与封体420相交；LED芯片442设置在LED段402/404中；相邻两LED段402、404通过导体段430进行电性连接，导体段430包括导体430a，导体430a设置在导体段430中，导体430a的两端设置在LED段中402/404中。在另一个实施例中，假设的一组平行平面与封体430在LED段402/404的边缘处相交，LED段402/404中的LED芯片442(包括边缘)设置在LED段402/404中，用于连接相邻两LED段402、404内的两个距离最短的LED芯片的导体430a的两端均设置在导体段430中。在又一个实施例中，假想的一组平行平面在相邻的LED段402，404之间 的空间处与封体108相交。LED芯片442设置在LED段402/404中。用于电连接相邻两LED段402、404的导体430a一部分设置在第一光转换层420a中，另一部分设置在第二光转换层420b中。第一光转换层420a与第二光转换层420b的转换波长/粒子大小/厚度/透光度/硬度/粒子比例也可为不同，视需要进行调整。在一个实施例中，第一光转换层420a比第二光转换层420b硬，第一光转换层420a填充的荧光粉含量比第二光转换层420b多。因为第一光转换层420a更硬，所以其被配置成当LED灯丝被弯曲以保持在灯泡中期望的姿势时能更好地保护LED段402/404的线性阵列，保证灯泡不发生故障。第二光转换层420b被制造得更柔软，以使得整个LED灯丝在灯泡中弯曲产生全周光，尤其是一根灯丝产生全周光。在另一个实施例中，第一光转换层420a具有比第二光转换层420b更好的热传导率，例如在第一光转换层420a添加的散热颗粒比第二光转换层420b多。具有较高导热率的第一光转换层420a能将来自LED段的热量传导至灯丝外而更好地保护LED段的线性阵列免于退化或燃烧。导体段430因为与LED段402/404间隔设置，因而在传导LED段402/404的热量方面，导体段430的作用比LED段402/404小。因此，当第二光转换层420b掺杂的散热颗粒含量比第一光转换层420a少时，制造LED灯丝的成本能得到节约。其中放置有LED段402/404的第一光转换层420a与封体420的尺寸比例由参考因素(如光转换能力、可弯曲性、热导率)决定。其他情况相同，第一光转换层420a相比于整个封体420越大，LED灯丝具有更大的光转换能力和导热性，但是将不易弯曲。封体420的外表面示出了第一光转换层420a和其他区域的组合。R5是第一光转换层420a外表面的总面积与封体420外表面的总面积之比。优选地，R5是从0.2到0.8。最优选地，R5是从0.4到0.6。See Figure 12 next. In Fig. 12, the LED filament 400 is further cut into two parts to schematically show its internal structure. The small part is that the rectangular ABCD is defined by rotating 360 degrees around the line CD (ie, the central axis of the LED filament). Similarly, except for the space occupied by a small portion, most of the rectangular ABCD is defined by rotating 360 degrees around the line CD. The area of the enclosure 420 is defined by an imaginary set of parallel planes that intersect the enclosure 420 perpendicular to the longitudinal axis of the enclosure 420. For example, the enclosure 420 includes two alternating first and second light conversion layers 420a, 420b. The LED filament includes an LED segment 402, 404, a sealing body 420, a conductor segment 430 and an electrode 410. The conductor segment 430 is located between the adjacent two LED segments 402, 404. The electrode 410 is electrically connected to the LED segment 402/404. The conversion layer 420a covers the LED segments 402, 404 and the second light conversion layer 420b covers the conductor segments 430. Defined by a hypothetical set of parallel planes, LED segments 402/404 include a plurality of LED chips 442. In one embodiment, an imaginary set of parallel planes intersects the enclosure 420 at the edge of the LED segments 402/404; LED chips 442 are disposed in the LED segments 402/404; adjacent LED segments 402, 404 pass through the conductors Segment 430 is electrically connected, conductor segment 430 includes conductor 430a, conductor 430a is disposed in conductor segment 430, and both ends of conductor 430a are disposed in LED segment 402/404. In another embodiment, a hypothetical set of parallel planes intersects the enclosure 430 at the edges of the LED segments 402/404, and LED chips 442 (including edges) in the LED segments 402/404 are disposed in the LED segments 402/404. Both ends of the conductor 430a for connecting the two shortest distance LED chips in the adjacent two LED segments 402, 404 are disposed in the conductor segment 430. In yet another embodiment, an imaginary set of parallel planes intersects the enclosure 108 at the space between adjacent LED segments 402, 404. LED chips 442 are disposed in LED segments 402/404. A portion of the conductor 430a for electrically connecting the adjacent two LED segments 402, 404 is disposed in the first light conversion layer 420a, and the other portion is disposed in the second light conversion layer 420b. The conversion wavelength/particle size/thickness/transmittance/hardness/particle ratio of the first light conversion layer 420a and the second light conversion layer 420b may also be different, and may be adjusted as needed. In one embodiment, the first light conversion layer 420a is harder than the second light conversion layer 420b, and the first light conversion layer 420a is filled with more phosphor than the second light conversion layer 420b. Because the first light converting layer 420a is harder, it is configured to better protect the linear array of LED segments 402/404 when the LED filament is bent to maintain a desired posture in the bulb, ensuring that the bulb does not malfunction. The second light converting layer 420b is made softer so that the entire LED filament is bent in the bulb to produce a full perimeter, especially one filament producing a full perimeter. In another embodiment, the first light conversion layer 420a has a better thermal conductivity than the second light conversion layer 420b, for example, more heat dissipation particles are added to the first light conversion layer 420a than the second light conversion layer 420b. The first light conversion layer 420a having a higher thermal conductivity can conduct heat from the LED segments out of the filament to better protect the linear array of LED segments from degradation or burning. Because of the spacing of the conductor segments 430 from the LED segments 402/404, the conductor segments 430 act less than the LED segments 402/404 in terms of the heat that conducts the LED segments 402/404. Therefore, when the second light conversion layer 420b is doped with less heat-dissipating particles than the first light-converting layer 420a, the cost of manufacturing the LED filament can be saved. The size ratio of the first light conversion layer 420a and the envelope 420 in which the LED segments 402/404 are placed is determined by reference factors such as light conversion capability, bendability, and thermal conductivity. Otherwise, the larger the first light conversion layer 420a is than the entire package 420, the LED filament has greater light conversion capability and thermal conductivity, but will not be easily bent. The outer surface of the envelope 420 shows a combination of the first light conversion layer 420a and other regions. R5 is the ratio of the total area of the outer surface of the first light conversion layer 420a to the total area of the outer surface of the envelope 420. Preferably, R5 is from 0.2 to 0.8. Most preferably, R5 is from 0.4 to 0.6.
图13示出的灯丝400结构中，与图12类似，不同之处在于，假想的一组平行平面正好在LED段402/404的边缘处与封体420相交。LED芯片442设置在LED段402/404中。LED段402、404与导体段430或LED段402/404中LED芯片442之间电性连接，例如采用第一导线440、第二导线450进行电性连接，第二导线450设置在导体段430中。在另一个实施例中，假设的一组平行平面与封体430在LED段402/404的边缘处相交，LED段402/404中某些LED芯片442的一部分(包括边缘)设置在LED段402/404中，用于连接相邻两LED段402、404内的两个距离最短的LED芯片的导线的两端均设置在第二光转换层420b中，意即第二导线设置在第二光转换层420b。在又一个实施例中，假想的一组平行平面在相邻的LED段402，404之间的空间处与封体420相交。LED芯片442设置在LED段402/404中。用于电连接相邻的LED芯片442与导体430a的第二导线450的一部分设置在第一光转换层420a中；用于电连接相邻的LED芯片442与导体430a的第二导线450的另一部分设置在第二光转换层420b中。The structure of the filament 400 shown in Fig. 13 is similar to that of Fig. 12 except that an imaginary set of parallel planes intersects the enclosure 420 just at the edges of the LED segments 402/404. LED chips 442 are disposed in LED segments 402/404. The LED segments 402, 404 are electrically connected to the LED segments 442 of the conductor segments 430 or the LED segments 402/404, for example, electrically connected by a first wire 440 and a second wire 450, and the second wire 450 is disposed at the conductor segment 430. in. In another embodiment, a hypothetical set of parallel planes intersects the enclosure 430 at the edges of the LED segments 402/404, and a portion (including edges) of certain LED chips 442 in the LED segments 402/404 are disposed in the LED segments 402. /404, both ends of the wires for connecting the two shortest LED chips in the adjacent two LED segments 402, 404 are disposed in the second light conversion layer 420b, that is, the second wire is disposed in the second light Conversion layer 420b. In yet another embodiment, an imaginary set of parallel planes intersects the enclosure 420 at a space between adjacent LED segments 402, 404. LED chips 442 are disposed in LED segments 402/404. A portion of the second wire 450 for electrically connecting the adjacent LED chip 442 and the conductor 430a is disposed in the first light conversion layer 420a; and the second wire 450 for electrically connecting the adjacent LED chip 442 and the conductor 430a A portion is disposed in the second light conversion layer 420b.
接下来说明导体段中的导体与光转换层的连接方式。首先请参见图14A，图14A示出的LED灯丝封装结构当中，灯丝400具有：光转换层420；LED段402,404；电极410,412；导体段430；导体段430位于相邻两LED段402、404之间，LED段402、404包括至少两个LED芯片442，LED芯片442间通过导线440相互电性连接。于此实施例中，导体段430包括 导体430a，导体段430与LED段402,404通过导线450进行电性连接，即分别位于相邻两LED段402、404内且与导体段430距离最短的两LED芯片通过导线450与导体段430中的导体430a进行电性连接。导体段430的长度大于LED段402/404中相邻两LED芯片之间的距离，导线440的长度小于导体430a的长度。光转换层420涂布于LED芯片442/电极410,412的至少两侧上。光转换层420暴露出电极410,412的一部分。光转换层420可至少具有一顶层420a及一基层420b，于此实施例中，LED段402、404、电极410,412、导体段430均贴覆于基层420b上。Next, the manner in which the conductors in the conductor segments are connected to the light conversion layer will be described. Referring first to FIG. 14A, in the LED filament package structure shown in FIG. 14A, the filament 400 has a light conversion layer 420, LED segments 402, 404, electrodes 410, 412, a conductor segment 430, and a conductor segment 430 located adjacent to the two LED segments 402, 404. The LED segments 402, 404 include at least two LED chips 442 electrically connected to each other by wires 440. In this embodiment, the conductor segment 430 includes a conductor 430a, and the conductor segment 430 and the LED segments 402, 404 are electrically connected by a wire 450, that is, two LEDs respectively located in the adjacent two LED segments 402, 404 and having the shortest distance from the conductor segment 430. The chip is electrically connected to the conductor 430a in the conductor segment 430 via a wire 450. The length of conductor segment 430 is greater than the distance between adjacent two LED chips in LED segments 402/404, and the length of wire 440 is less than the length of conductor 430a. The light conversion layer 420 is coated on at least two sides of the LED chip 442/ electrodes 410, 412. Light conversion layer 420 exposes a portion of electrodes 410, 412. The light conversion layer 420 can have at least a top layer 420a and a base layer 420b. In this embodiment, the LED segments 402, 404, the electrodes 410, 412, and the conductor segments 430 are all attached to the base layer 420b.
导体430a可为铜箔或其他可进行电传导的材料，导体430a具有径向的开口。导体430a上表面可进一步具有镀银层，其次可通过固晶胶等方式将LED芯片442固定于基层420b上。其后，施加荧光粉胶或荧光粉膜，使其包覆LED芯片442、导线440、450，以及电极410,412的一部分，以形成光转换层420。开口的宽度或/及长度分别大于LED芯片442的宽度或/及长度，限定LED芯片442的位置，并使LED芯片442的六个面当中的至少两个面以上(本实施例为五个面)均接触并被顶层420a荧光粉胶包覆。导线440、450可为金线，在此实施例中，铜箔搭配金线的组合为灯丝带来稳固而又维持可挠性的导电结构；镀银层除了带来良好的导电性外亦具有增加光反射的效果。 Conductor 430a can be a copper foil or other electrically conductive material and conductor 430a has a radial opening. The upper surface of the conductor 430a may further have a silver plating layer, and secondly, the LED chip 442 may be fixed to the base layer 420b by means of a solid crystal glue or the like. Thereafter, a phosphor paste or phosphor film is applied to cover the LED chip 442, the wires 440, 450, and a portion of the electrodes 410, 412 to form the light conversion layer 420. The width or/and the length of the opening are respectively greater than the width or/and length of the LED chip 442, defining the position of the LED chip 442 and making at least two of the six faces of the LED chip 442 (in this embodiment, five faces) Both are contacted and coated with a top layer 420a phosphor paste. The wires 440, 450 may be gold wires. In this embodiment, the combination of the copper foil and the gold wire is a lamp ribbon to stabilize and maintain a flexible conductive structure; the silver plating layer has a good electrical conductivity. Increase the effect of light reflection.
在一实施例中，导体430a的形状也可以是考虑金线连接或是灯丝弯折而做出的结构设计。例如于一实施例中，如图14B所示的导体430a的俯视图。导体430a具有连结区5068以及过渡区5067，连结区5068位于导体430a的端部并用于电连接其他组件，于此实施例中导体430a具有二个连结区5068，过渡区5067则位于连结区5068之间，用于衔接两个连结区5068。连结区5068的宽度可大于过渡区5067，由于连结区5068上需形成接点，因此需要相对较大的宽度，例如当灯丝宽度为W时，导体430a的连结区5068的宽度可为1/4W至W之间，连结区5068可为多个且其宽度不需一致；过渡区5067位于连结区5068之间，由于过渡区5067上不需形成接点，因此宽度可设定较连结区5068细，例如当灯丝宽度为W时，过渡区5067的宽度可为1/10W至1/5W之间，此时由于导体430a的过渡区5067具有较细的宽度，使得导体430a更容易随着灯丝弯折形变，减少靠近导体430a的导线450因应力影响而容易断线的风险。In an embodiment, the shape of the conductor 430a may also be a structural design made in consideration of a gold wire connection or a filament bending. For example, in one embodiment, a top view of conductor 430a is shown in Figure 14B. The conductor 430a has a connection region 5068 and a transition region 5067 at the end of the conductor 430a and is used to electrically connect other components. In this embodiment, the conductor 430a has two connection regions 5068, and the transition region 5067 is located at the connection region 5068. Between, used to connect two joint areas 5068. The width of the joint region 5068 can be greater than the transition region 5067. Since the joint is formed on the joint region 5068, a relatively large width is required. For example, when the filament width is W, the width of the joint region 5068 of the conductor 430a can be 1/4W. Between W, the connecting area 5068 can be multiple and the width does not need to be uniform; the transition area 5067 is located between the connecting areas 5068. Since the connecting area is not required to be formed on the transition area 5067, the width can be set to be thinner than the connecting area 5068, for example When the filament width is W, the width of the transition region 5067 may be between 1/10W and 1/5W, at which time the conductor 430a is more easily deformed as the filament is bent due to the thinner width of the transition region 5067 of the conductor 430a. The risk of the wire 450 near the conductor 430a being easily broken due to stress is reduced.
于一实施例中，如俯视图14C所示，构成灯丝的多个LED芯片当中，LED芯片442通过导线450与导体430a电连接，导体430a于俯视角度呈“工”字形。导体430a具有由三面环绕所述LED芯片442的形状，其中环绕LED芯片442的三面由两个过渡区5067以及一连结区5068组成，同时形成上述的径向开口结构，两个过渡区5067在LED灯丝的径向方向上的宽度的总和小于连结区5068在LED灯丝的径向方向上的宽度，如图14C所示，两个过渡区5067在LED灯丝的径向方向上的宽度Wt1、Wt2的总和小于连结区5068在LED灯丝的径向方向上的宽度Wc，可增加导体与LED芯片442所在区域的机械强度且可避免连接LED芯片与导体的导线450破损，在一实施例中，过渡区的长度可在LED灯丝的径向方向延伸至与导体段相邻的LED段，从而缓冲外力对LED芯片的冲击，提高产品稳定性。在本实施例中，连结区 5068的宽度Wc等于基层420b(或LED灯丝)的宽度，在所述LED芯片442中未被导体430a环绕的一面则通过导线440电连接其他LED芯片，此时所述LED芯片442与导体430a之间的导线450比LED段中任意两LED芯片间的距离短，例如所述LED芯片442与导体430a之间的导线比LED段中相邻两LED芯片间的距离短，如此一来LED灯丝因受弹性挫屈应力而断线的风险也较低。In one embodiment, as shown in the top view of FIG. 14C, among the plurality of LED chips constituting the filament, the LED chip 442 is electrically connected to the conductor 430a through the wire 450, and the conductor 430a has a "work" shape in a plan view. The conductor 430a has a shape surrounded by the three sides of the LED chip 442, wherein three sides surrounding the LED chip 442 are composed of two transition regions 5067 and a joint region 5068, and at the same time form the above-mentioned radial opening structure, the two transition regions 5067 are in the LED The sum of the widths in the radial direction of the filament is smaller than the width of the joint region 5068 in the radial direction of the LED filament, as shown in Fig. 14C, the widths Wt1, Wt2 of the two transition regions 5067 in the radial direction of the LED filament The sum is smaller than the width Wc of the connecting portion 5068 in the radial direction of the LED filament, which can increase the mechanical strength of the conductor and the region where the LED chip 442 is located and can avoid damage of the wire 450 connecting the LED chip and the conductor. In an embodiment, the transition region The length can extend in the radial direction of the LED filament to the LED segment adjacent to the conductor segment, thereby buffering the impact of the external force on the LED chip and improving product stability. In the present embodiment, the width Wc of the bonding region 5068 is equal to the width of the base layer 420b (or LED filament), and the side of the LED chip 442 that is not surrounded by the conductor 430a is electrically connected to other LED chips through the wire 440. The wire 450 between the LED chip 442 and the conductor 430a is shorter than the distance between any two LED chips in the LED segment, for example, the distance between the wire between the LED chip 442 and the conductor 430a and the distance between two adjacent LED chips in the LED segment. Short, as a result, the risk of LED filaments being broken due to elastic setback stress is also low.
于一实施例中，灯丝中的导体430a的形状为图14C所示的具有一连结区5068及四过渡区5067，导体430a由沿纵向对称的左半端和右半端组成，图14E以及图14G,14H,14I为导体430a的左半端或右半端的底视图，连结区由左半端的第一连结区和右半端的第二连结区组成，两过渡区与第一连结区或第二连结区组成以围绕LED芯片的形状，两过渡区与第一连结区或第二连结区共同形成U形。在其它实施例中，导体430a可不关于纵向对称，连接连结区的过渡区可为图14E，图14F以及图14G,14H,14I所示的过渡区的任意组合。如图14J所示，导体430a上具有多个贯孔506p，如图14D与图14E所示，基层(例如荧光粉膜)420b渗透至贯孔506p中并可视情况选择是否突出于贯孔506的另一端，图14D所示为荧光粉膜未突出贯孔的情况，此实施例中图14D中朝上的表面进行粗糙化处理，使得其表面具有更好的散热能力，图14E为图14D的底视图。于其它实施例中，也可如图14L所示顶层突出于贯孔朝图下的另一端或如图14M所示荧光粉膜突出于贯孔朝图上的另一端，使得顶层420a渗入基层420b之中或基层420b渗入顶层420a而增加顶层420a与基层420b间的接触面积；如图14L所示，图14L为图14K的E1-E2线截面图，用来形成顶层420a的荧光粉胶渗入导体430a的贯孔466后可再进一步延展至基层420a。于另一实施例中，如图14M所示，用来形成基层420b的荧光粉膜渗入导体430a的贯孔506p后再进一步延伸至顶层420a。图14L、图14M中由于导体430a在LED灯丝的轴向方向上被顶层420a或基层420b上、下包夹而呈现类似铆接的关系,导体430a与顶层420a或基层420b之间的接触面积增加，接触面积的增加提高了导体430a与顶层420a或基层420b之间的结合强度，从而提高了导体段的耐弯折性。In one embodiment, the conductor 430a in the filament has a shape as shown in FIG. 14C having a joint region 5068 and a fourth transition region 5067. The conductor 430a is composed of a left half end and a right half end symmetrically in the longitudinal direction, FIG. 14E and FIG. 14G. 14H, 14I is a bottom view of the left half or the right half of the conductor 430a, the connecting zone is composed of a first connecting zone at the left half end and a second connecting zone at the right half end, and the two transition zones are composed of the first connecting zone or the second connecting zone. In a shape surrounding the LED chip, the two transition regions form a U shape together with the first joint region or the second joint region. In other embodiments, the conductor 430a may not be symmetric with respect to the longitudinal direction, and the transition region connecting the joint regions may be any combination of the transition regions shown in Figures 14E, 14F, and 14G, 14H, 14I. As shown in FIG. 14J, the conductor 430a has a plurality of through holes 506p. As shown in FIG. 14D and FIG. 14E, the base layer (for example, the phosphor film) 420b penetrates into the through hole 506p and optionally protrudes from the through hole 506. At the other end, FIG. 14D shows a case where the phosphor film does not protrude through the through hole. In this embodiment, the upward facing surface of FIG. 14D is roughened so that the surface thereof has better heat dissipation capability, and FIG. 14E is FIG. 14D. Bottom view. In other embodiments, the top layer may protrude from the other end of the through hole toward the other end as shown in FIG. 14L or the phosphor film protrudes from the other end of the through hole toward the other end as shown in FIG. 14M, so that the top layer 420a penetrates into the base layer 420b or the base layer. 420b penetrates into the top layer 420a to increase the contact area between the top layer 420a and the base layer 420b; as shown in FIG. 14L, FIG. 14L is a cross-sectional view taken along the line E1-E2 of FIG. 14K, and the phosphor paste used to form the top layer 420a penetrates the through hole of the conductor 430a. After 466, it can be further extended to the base layer 420a. In another embodiment, as shown in FIG. 14M, the phosphor film used to form the base layer 420b penetrates into the through hole 506p of the conductor 430a and then further extends to the top layer 420a. 14L, FIG. 14M, since the conductor 430a is similarly riveted by the top layer 420a or the base layer 420b in the axial direction of the LED filament, the contact area between the conductor 430a and the top layer 420a or the base layer 420b is increased. The increase in contact area increases the bond strength between the conductor 430a and the top layer 420a or the base layer 420b, thereby increasing the bending resistance of the conductor segments.
图14F以及图14G,14H,14I亦为具有贯孔的导体430a的实施例，图14F为一实施例的LED灯丝的局部底视图。导体430a仅具有二个过渡区；如图14F所示，以LED灯丝的特定视图来看，例如底视图，无论是过渡区5067或连结区5068都呈矩形的形状。任意一个过渡区5067连接至连结区5068的相对两侧的其中一侧，两过渡区位于连结区5068的相对两侧的同一侧或不同侧，在底视图上，过渡区5067与连结区5068共同形成Z形或T形或倒U形，以LED芯片442的中心点o至连结区5068的最短距离设为r1，中心点o至过渡区5067的最短距离为r2，r1大于或等于r2，能降低LED灯丝受弹性挫屈应力而断线的风险，图14F所示为r1大于r2的情形。在以此导体430a为基础制作内嵌导体430a的基层420b(例如荧光粉膜)的情况下，如图14F所示，因芯片442被基层420b挡住，因而是以虚线来描述，以在底视图来看，LED芯片442在LED灯丝的轴向方向上与过渡区5067重叠。在其他实施例中，以底视图来看，LED芯片442在LED灯丝的轴向方向上不会与过渡区5067重叠。在其他实施例中，其中一过渡区5067可连接至连结区5068的中心，另一过渡区可连接至连结区5068的 两端或中心，其它实施例中，另一过渡区5067还可连接连结区5068的两端与连结区5068的中心之间的任意位置。当另一过渡区5067可连接至连结区5068的中心时，在底视图上，此过渡区5067与连结区5068共同形成十字形。14F and 14G, 14H, 14I are also an embodiment of a conductor 430a having a through hole, and Fig. 14F is a partial bottom view of the LED filament of an embodiment. The conductor 430a has only two transition regions; as shown in Fig. 14F, in a particular view of the LED filament, such as a bottom view, either the transition region 5067 or the junction region 5068 has a rectangular shape. Any one of the transition zones 5067 is connected to one of the opposite sides of the joint zone 5068. The two transition zones are located on the same side or different sides of the opposite sides of the joint zone 5068. In the bottom view, the transition zone 5067 is associated with the junction zone 5068. Forming a Z shape or a T shape or an inverted U shape, the shortest distance from the center point o of the LED chip 442 to the connection region 5068 is set to r1, and the shortest distance from the center point o to the transition region 5067 is r2, and r1 is greater than or equal to r2. The risk of the LED filament being broken by the elastic buckling stress is reduced, and FIG. 14F shows the case where r1 is greater than r2. In the case where the base layer 420b (for example, a phosphor film) of the embedded conductor 430a is formed on the basis of the conductor 430a, as shown in FIG. 14F, since the chip 442 is blocked by the base layer 420b, it is described by a broken line to be in a bottom view. In view, the LED chip 442 overlaps the transition region 5067 in the axial direction of the LED filament. In other embodiments, the LED chip 442 does not overlap the transition region 5067 in the axial direction of the LED filament in a bottom view. In other embodiments, one transition zone 5067 can be connected to the center of the joint zone 5068, and the other transition zone can be connected to both ends or the center of the joint zone 5068. In other embodiments, the other transition zone 5067 can also be connected. Any position between the ends of the region 5068 and the center of the junction region 5068. When another transition zone 5067 can be coupled to the center of the attachment zone 5068, the transition zone 5067 and the attachment zone 5068 together form a cross in a bottom view.
图14G与图14E实施例的不同之处在于14G的实施例中，导体430a仅具有二个过渡区，导体430a的过渡区5067为自连结区5068延伸渐窄的梯形形状，过渡区5067是由整个连结区5068开始延伸，而不是由连结区5068的相对两侧的任一侧或两侧开始延伸，且过渡区5067的宽度会由过渡区5067的固定端朝向相对侧的自由端逐渐减少，过渡区5067的固定端为过渡区5067与连结区5068连接的一端，过渡区5067的自由端为远离连结区5068的一端，过渡区5067的固定端会对齐整个连结区5068或基层420b，换句话说，过渡区5067的固定端的宽度会等于连结区5068或基层420b的宽度，在底视图上，过渡区5067呈梯形。在其他实施例中，宽度由固定端至自由端逐渐减少的过渡区5067，也可以呈三角形或半圆形。过渡区5067的平均宽度小于所述连结区5068的平均宽度。如图14G所示，在以此导体430a为基础制作内嵌导体430a的基层420b(例如荧光粉膜)的情况下，如图14F所示，因芯片442以此方向观察即被基层420b所覆盖，因而是以虚线来描述，以在底视图来看，LED芯片442在底视图上与过渡区5067重叠。14G is different from the embodiment of FIG. 14E in the embodiment of 14G, the conductor 430a has only two transition regions, the transition region 5067 of the conductor 430a is a trapezoidal shape extending from the joint region 5068, and the transition region 5067 is The entire joint region 5068 begins to extend rather than extending from either side or both sides of the opposite sides of the joint region 5068, and the width of the transition region 5067 is gradually reduced from the fixed end of the transition region 5067 toward the free end of the opposite side. The fixed end of the transition zone 5067 is one end of the transition zone 5067 and the connection zone 5068. The free end of the transition zone 5067 is one end away from the connection zone 5068, and the fixed end of the transition zone 5067 is aligned with the entire connection zone 5068 or the base layer 420b. In other words, the width of the fixed end of the transition zone 5067 will be equal to the width of the junction zone 5068 or the base layer 420b, which in the bottom view is trapezoidal. In other embodiments, the transition zone 5067 having a width that gradually decreases from a fixed end to a free end may also be triangular or semi-circular. The average width of the transition zone 5067 is less than the average width of the tie zone 5068. As shown in Fig. 14G, in the case where the base layer 420b (e.g., phosphor film) of the embedded conductor 430a is formed based on the conductor 430a, as shown in Fig. 14F, the chip 442 is covered by the base layer 420b as viewed in this direction. Thus, it is described in dashed lines, and in the bottom view, the LED chip 442 overlaps the transition region 5067 in a bottom view.
图14H与图14F实施例的不同之处在于图14H的过渡区5067为两侧对齐灯丝的基层420的宽度，但宽度方向的中央处往两旁自连结区5068延伸渐窄并形成斜边，如左半端或右半端的两个过渡区5067的每一个过渡区5067都会形成三角形，例如正三角形。此两过渡区5067的每一个都包括斜边，这两个过渡区5067的两个斜边会面对彼此，且此两过渡区5067的两个斜边会在过渡区5067的固定端彼此靠近。在本实施例中，此两过渡区5067的两个斜边可以但不限于是彼此连接。这两个斜边会由固定端至自由端逐渐远离彼此，且此两斜边在自由端会分别接触基层420b的相对两侧。过渡区5067的两斜边在LED灯丝的轴向方向上的距离由固定端至自由端逐渐增加，过渡区5067会切齐连结区5068与基层420b，且其在固定端的宽度会等于过渡区5067的两斜边在自由端之间的距离，且也会等于连结区5068与基层420b的宽度。上述固定端、自由端均为过渡区的固定端、自由端。14H is different from the embodiment of FIG. 14F in that the transition region 5067 of FIG. 14H is the width of the base layer 420 on which the filaments are aligned on both sides, but the center of the width direction extends toward the sides from the joint region 5068 and is tapered to form a beveled edge, such as Each transition zone 5067 of the two transition zones 5067 at the left or right half will form a triangle, such as an equilateral triangle. Each of the two transition zones 5067 includes a beveled edge, the two beveled edges of the two transition zones 5067 will face each other, and the two beveled edges of the two transition zones 5067 will be close to each other at the fixed end of the transition zone 5067. . In this embodiment, the two oblique sides of the two transition regions 5067 can be, but are not limited to, connected to each other. The two oblique sides will gradually move away from each other from the fixed end to the free end, and the two oblique sides will respectively contact the opposite sides of the base layer 420b at the free end. The distance between the two oblique sides of the transition zone 5067 in the axial direction of the LED filament gradually increases from the fixed end to the free end, and the transition zone 5067 cuts the joint zone 5068 and the base layer 420b, and its width at the fixed end is equal to the transition zone 5067. The distance between the two oblique sides at the free end is also equal to the width of the joint region 5068 and the base layer 420b. The fixed end and the free end are both fixed ends and free ends of the transition zone.
图14I实施例类似于图14H，过渡区5067的斜边不是直线而是阶梯状。在其它实施例中，过渡区5067的斜边可以是曲线形、拱形或波浪形。The embodiment of Figure 14I is similar to Figure 14H in that the hypotenuse of the transition zone 5067 is not a straight line but a stepped shape. In other embodiments, the beveled edges of the transition zone 5067 can be curved, arched, or wavy.
于其它实施例中，图4中的导体130a、图5中的导体230a、图7～图9中的导体430a可为图14中所示的导体430a的结构，其它结构不变。当图7中的导体430a为图14中所示的导体430a的结构时，可形成图14L所示的铆钉结构，顶层420渗入导体430a的贯孔506p后进一步延伸至导体430a与基层420b的间隙中，导体与顶层之间的接触面积增加，接触面积的增加提高了导体与顶层之间的结合强度，从而提高了导体段的耐弯折性。In other embodiments, the conductor 130a in FIG. 4, the conductor 230a in FIG. 5, and the conductor 430a in FIGS. 7-9 may be the structure of the conductor 430a shown in FIG. 14, and other structures are unchanged. When the conductor 430a in FIG. 7 is the structure of the conductor 430a shown in FIG. 14, the rivet structure shown in FIG. 14L can be formed, and the top layer 420 penetrates into the through hole 506p of the conductor 430a and further extends to the gap between the conductor 430a and the base layer 420b. In the middle, the contact area between the conductor and the top layer is increased, and the increase of the contact area increases the bonding strength between the conductor and the top layer, thereby improving the bending resistance of the conductor segment.
由于当LED灯丝放置于LED球泡灯中呈弯折起伏不定的样式，当LED灯丝以较小的角度弯折时，弯折处可能因受热膨胀而受热应力影响而变得脆弱。因此，LED灯丝中还可于弯折处附近适当地设置孔洞或缺口，以减缓此影响。于一实施例中，如图14N(图中省略 LED芯片及灯丝电极)所示，间距D1至D2间为预定的弯折处。导体430上设有多个孔洞，优选地，孔洞468自弯折处外侧(图中上方)起，越靠近弯着内侧处(图中下方)孔洞越大，如此实施例中孔洞468为三角形。进行弯折LED灯丝时，由F方向朝上施力弯折灯丝，此时由于间距D1至D2间的多个孔洞468使得LED灯丝容易弯折，弯折处的孔洞468能够缓冲热应力，且依照适当的孔洞形状与弯折角度规划。Since the LED filament is bent and undulated in the LED bulb, when the LED filament is bent at a small angle, the bend may be weakened by thermal stress due to thermal expansion. Therefore, holes or notches can be appropriately placed in the LED filament near the bend to mitigate this effect. In one embodiment, as shown in FIG. 14N (the LED chip and the filament electrode are omitted), the pitch D1 to D2 is a predetermined bend. The conductor 430 is provided with a plurality of holes. Preferably, the holes 468 are from the outer side of the bend (upper in the figure), and the closer to the bent inner side (lower in the figure), the larger the hole, and the hole 468 is triangular in this embodiment. When bending the LED filament, the filament is bent upward by the F direction, and at this time, the LED filament is easily bent due to the plurality of holes 468 between the spacings D1 to D2, and the hole 468 at the bending portion can buffer the thermal stress, and Plan according to the appropriate hole shape and bending angle.
图14O为本发明图14A所示灯丝的一种弯折形式，现有技术中一般通过电极将多根灯丝连接起来实现灯丝弯折，因在电极处实现弯折，强度较低易出现断裂，此外因电极占用了一些空间使得灯丝的发光面积变小。本发明中导体段430为灯丝的弯折处，通过图14C～14M所示的导体430a形成铆钉结构以及导体加强，使得连接LED芯片442与导体430a的导线450较不易断裂。在不同实施例中，可将导体设置成如图14B所示的结构或在导体430a上设有容置空间(例如图14N所示的孔洞结构)，从而降低灯丝在弯折时开裂的概率。本发明LED灯丝具有耐弯折性佳以及发光效率高的优点。14A is a bending form of the filament shown in FIG. 14A of the present invention. In the prior art, a plurality of filaments are generally connected by electrodes to realize bending of the filament, and the bending is performed at the electrode, and the strength is low and the fracture is easy to occur. In addition, since the electrode occupies some space, the light-emitting area of the filament becomes small. In the present invention, the conductor segment 430 is a bent portion of the filament, and the rivet structure and the conductor reinforcement are formed by the conductor 430a shown in Figs. 14C to 14M, so that the wire 450 connecting the LED chip 442 and the conductor 430a is less likely to be broken. In various embodiments, the conductors may be arranged in a structure as shown in Fig. 14B or provided with an accommodation space (e.g., the hole structure shown in Fig. 14N) on the conductor 430a, thereby reducing the probability of the filament cracking when bent. The LED filament of the invention has the advantages of good bending resistance and high luminous efficiency.
图15示出的封装结构中，灯丝类似于图14A～14O揭示的灯丝，不同之处在于：两LED芯片442之间设有铜箔460，铜箔上设有镀银层461，LED芯片通过导线440电性连接铜箔460。In the package structure shown in FIG. 15, the filament is similar to the filament disclosed in FIGS. 14A to 14O, except that a copper foil 460 is disposed between the two LED chips 442, and a silver plating layer 461 is disposed on the copper foil, and the LED chip passes through The wire 440 is electrically connected to the copper foil 460.
图16示出的封装结构中，灯丝类似于图14A～14O所揭露的灯丝，其不同之处在于：(1)灯丝使用的LED芯片为焊脚高度相同的倒装芯片，直接将焊脚接在镀银层461上；(2)前面所述灯丝开口的长度(即灯丝轴向上的长度)为了要容纳LED芯片而必须大于LED芯片，而本实施例的灯丝的LED芯片442对应开口432并位于铜箔460/镀银层461的上方，因此LED芯片442的长度大于开口。In the package structure shown in FIG. 16, the filament is similar to the filament disclosed in FIGS. 14A to 14O, and the difference is that: (1) the LED chip used for the filament is a flip chip having the same solder fillet height, and the solder fillet is directly connected. On the silver plating layer 461; (2) the length of the filament opening described above (ie, the length in the axial direction of the filament) must be larger than the LED chip in order to accommodate the LED chip, and the LED chip 442 of the filament of the present embodiment corresponds to the opening 432. It is located above the copper foil 460/silver plating layer 461, so the length of the LED chip 442 is larger than the opening.
依据本发明前述各实施例，由于LED灯丝结构区分为LED段和导体段，因此LED灯丝在弯折时容易将应力集中于导体段，使LED段中连接相邻芯片的金线在弯折时减少断裂的机率，藉此提升LED灯丝整体质量。除此之外，导体段采用铜箔结构，减少金属打线长度，进一步降低弯折断金属打线断裂的机率。同时为了提升LED灯丝导体段的可弯折性，进一步避免导体在LED灯丝弯折时产生破坏，在本发明其他实施例中，LED灯丝导体段中的导体可呈“M”字型或为波浪状，以提供LED灯丝较佳的延伸效果。According to the foregoing embodiments of the present invention, since the LED filament structure is divided into an LED segment and a conductor segment, the LED filament is easy to concentrate stress on the conductor segment when bent, so that the gold wire connecting the adjacent chips in the LED segment is bent. Reduce the chance of breakage, thereby improving the overall quality of the LED filament. In addition, the conductor segment is made of a copper foil structure, which reduces the length of the metal wire and further reduces the probability of fracture of the broken metal wire. At the same time, in order to improve the bendability of the LED filament conductor segment, the conductor is further prevented from being damaged when the LED filament is bent. In other embodiments of the invention, the conductor in the LED filament conductor segment may be "M" shaped or waved. Shape to provide a better extension of the LED filament.
接下来说明灯丝结构层状结构的相关设计。图17A至图17C示出了关于灯丝表面角度处理的实施例，其均为灯丝的横截面。图17A，图17B，图17C中的顶层420a由点胶机形成，可通过荧光粉胶黏度调整使得点胶后顶层两侧自然塌陷形成具有圆弧状的表面。图17A的基层420b的横截面为经过垂直切割后所形成的四边形切面。图17B的基层420b的横截面为经过斜角切割或是具角度设计的刀具切割后所形成的具有斜边Sc的梯形切面。图17C的基层420b类似于图17A的基层420b，但位于图下方的两个边角经过表面处理而形成了圆弧角Se。灯丝通过上述图17A至17C的各种做法，可使灯丝内的LED芯片在发光时，灯丝整体得以达到不同的出光表面角度与出光效果。图17D的基层420b类似于图17B的基层420b，但图17D中基层420b的斜边Sc沿伸到顶层420a上，而顶层420a的横截面则分为顶部的圆 弧部分及侧方的斜边Sc。换句话说，图17D的顶层420a与基层420b会具有共同的斜边Sc，两个斜边Sc位于LED灯丝的相对两侧。顶层420a的斜边Sc会对齐基层420b的斜边Sc。在此状况下，顶层420a在图17D中的截面会具有拱形边缘与两个相对斜边Sc所组成的外轮廓。在灯丝制作的工艺流程中，LED芯片于大面积基层420a表面上完成固晶打线，统一对大面积基层420a上表面涂布顶层420a后，再进行灯丝条的切割工艺，如此即可形成如图17D所示顶层420a与基层420b会具有共同的斜边Sc。Next, the related design of the layer structure of the filament structure will be described. 17A to 17C show an embodiment of the treatment of the surface angle of the filament, which are both cross sections of the filament. The top layer 420a in Fig. 17A, Fig. 17B, and Fig. 17C is formed by a dispenser, and the phosphor viscosity adjustment is performed so that both sides of the top layer after the dispensing are naturally collapsed to form an arcuate surface. The cross section of the base layer 420b of Fig. 17A is a quadrilateral section formed by vertical cutting. The cross-section of the base layer 420b of Fig. 17B is a trapezoidal cut surface having a beveled Sc formed by cutting a beveled or angled tool. The base layer 420b of Fig. 17C is similar to the base layer 420b of Fig. 17A, but the two corners located below the figure are surface-treated to form a circular arc angle Se. Through the various methods of the above-mentioned FIGS. 17A to 17C, the filament can achieve different light-emitting surface angles and light-emitting effects when the LED chips in the filament are illuminated. The base layer 420b of Fig. 17D is similar to the base layer 420b of Fig. 17B, but the oblique side Sc of the base layer 420b in Fig. 17D extends along the top layer 420a, and the cross section of the top layer 420a is divided into the arc portion of the top and the oblique side of the side. Sc. In other words, the top layer 420a of FIG. 17D and the base layer 420b will have a common bevel Sc, and the two beveled Scs are located on opposite sides of the LED filament. The hypotenuse Sc of the top layer 420a aligns with the hypotenuse Sc of the base layer 420b. In this case, the section of the top layer 420a in Fig. 17D will have an outer contour composed of an arched edge and two opposite oblique sides Sc. In the process of filament manufacturing, the LED chip completes the solid crystal bonding on the surface of the large-area base layer 420a, uniformly applies the top layer 420a to the upper surface of the large-area base layer 420a, and then performs the cutting process of the filament strip, thereby forming The top layer 420a and the base layer 420b shown in Fig. 17D will have a common bevel Sc.
图17E为在图17A中增加LED芯片442摆放的示意图，基层420b的厚度、直径可小于顶层420a的厚度、直径。如图17E所示，基层420b的厚度T2小于顶层420a的厚度T1，基层420b或顶层420a的厚度由于制程的原因会出现厚度不均匀的情形，T1、T2分别代表顶层420a、基层420b厚度的最大值；除此之外，LED芯片442放置于基层420b表面，被包裹于顶层420a中。在一些方案中，灯丝电极(图未示)可以主要设置于基层420b中。在基层420b比顶层420a厚度薄的情况下，灯丝电极所产生的热可以较容易由基层420b散出去。在一些方案中，LED芯片442面向(主要出光方向朝向)顶层420a设置，因此来自于LED芯片442大多数光线会穿透顶层420a，相对于顶层420a的亮度来说，这会导致基层420b具有较低的亮度。顶层420a具有较大量的光反射/扩散粒子(例如荧光粉)，其可将光线朝向基层420b反射或扩散，且光线可以容易地穿透较薄的基层420b，因而可使得顶层420a与基层420b的亮度均匀。另一实施例中，当顶层420a和基层420b具有相同厚度，此时顶层420a的荧光粉浓度可配置为大于基层420b的荧光粉浓度，使LED灯丝的色温更趋均匀。FIG. 17E is a schematic view showing the arrangement of the LED chip 442 in FIG. 17A. The thickness and diameter of the base layer 420b may be smaller than the thickness and diameter of the top layer 420a. As shown in FIG. 17E, the thickness T2 of the base layer 420b is smaller than the thickness T1 of the top layer 420a, and the thickness of the base layer 420b or the top layer 420a may be uneven due to the process, and T1 and T2 represent the maximum thickness of the top layer 420a and the base layer 420b, respectively. Values; in addition, the LED chip 442 is placed on the surface of the base layer 420b and wrapped in the top layer 420a. In some aspects, a filament electrode (not shown) may be disposed primarily in the base layer 420b. In the case where the base layer 420b is thinner than the top layer 420a, the heat generated by the filament electrode can be more easily dissipated from the base layer 420b. In some aspects, the LED chip 442 is disposed facing (the main light-emitting direction) the top layer 420a, so that most of the light from the LED chip 442 will penetrate the top layer 420a, which causes the base layer 420b to have a higher relative brightness than the top layer 420a. Low brightness. The top layer 420a has a relatively large amount of light reflecting/diffusing particles (e.g., phosphor) that can reflect or diffuse light toward the base layer 420b, and the light can easily penetrate the thinner base layer 420b, thereby allowing the top layer 420a and the base layer 420b to The brightness is even. In another embodiment, when the top layer 420a and the base layer 420b have the same thickness, the phosphor concentration of the top layer 420a can be configured to be greater than the phosphor concentration of the base layer 420b, so that the color temperature of the LED filament is more uniform.
如图17E和17F所示，W1为基层420b或顶层420a的宽度，W2为LED芯片442的宽度。当基层420b或顶层420a的宽度不均一时，W1代表基层420b上表面的宽度或顶层420a下表面的宽度，W1：W2＝1:0.8～0.9，基层420b上表面接触LED芯片402，基层420a下表面远离LED芯片442且相对于基层420b上表面；顶层420b上表面远离LED芯片442，顶层420b下表面与顶层420b上表面相对且接触基层420a。图17E中W1表示基层420b上表面的宽度(或基层420b宽度的最小值)；图17F为在图17B中增加LED芯片402摆放的示意图，图中所示W1为顶层420b下表面的宽度(或顶层420a宽度的最大值)；一实施例如图17D的顶层420a与基层420b会具有共同的斜边Sc时，W1为顶层420a下表面的宽度(或基层420b宽度的最大值)。由于一方面LED芯片442为六面发光体，为了确保灯丝侧向发光(即LED芯片442侧面仍被顶层402a包覆)，W1与W2可设计为不相等，且W1>W2；另一方面为了确保灯丝具有一定挠曲性和在进行弯曲时能有较小的曲率半径(确保灯丝能保有一定的可弯曲性)，因此灯丝与拉伸长度方向相互垂直的截面厚度和宽度的比例理想为趋于一致。采用此设计，能使灯丝较容易实现全周光效果和具有较佳的弯折性。As shown in FIGS. 17E and 17F, W1 is the width of the base layer 420b or the top layer 420a, and W2 is the width of the LED chip 442. When the width of the base layer 420b or the top layer 420a is not uniform, W1 represents the width of the upper surface of the base layer 420b or the width of the lower surface of the top layer 420a, W1: W2 = 1: 0.8 to 0.9, the upper surface of the base layer 420b contacts the LED chip 402, and the base layer 420a is under The surface is away from the LED chip 442 and opposite to the upper surface of the base layer 420b; the upper surface of the top layer 420b is away from the LED chip 442, and the lower surface of the top layer 420b is opposite to the upper surface of the top layer 420b and contacts the base layer 420a. In Fig. 17E, W1 indicates the width of the upper surface of the base layer 420b (or the minimum value of the width of the base layer 420b); Fig. 17F is a schematic view showing the arrangement of the LED chip 402 in Fig. 17B, and W1 is the width of the lower surface of the top layer 420b ( Or the maximum value of the width of the top layer 420a); when an embodiment such as the top layer 420a of FIG. 17D and the base layer 420b have a common oblique side Sc, W1 is the width of the lower surface of the top layer 420a (or the maximum of the width of the base layer 420b). Since the LED chip 442 is a six-sided illuminant on the one hand, in order to ensure lateral illuminating of the filament (ie, the side of the LED chip 442 is still covered by the top layer 402a), W1 and W2 can be designed to be unequal, and W1>W2; Ensure that the filament has a certain flexibility and can have a small radius of curvature when bending (make sure the filament can maintain a certain degree of flexibility), so the ratio of the thickness and width of the cross section perpendicular to the length of the filament is ideal. Consistent. With this design, the filament can be easily realized with a full-circumferential effect and has a better bending property.
LED灯丝在封装有惰性气体的LED球泡灯中发光时，如图18所示，LED芯片442发出的光会经过A～F界面，其中A界面为LED芯片442中GaN与顶层420a的界面，B界面为顶层420a与惰性气体的界面，C界面为LED芯片442中基板与固晶胶450的界面，D界面为固晶胶450与基层420b的界面，E界面为基层420b与惰性气体的界面，F界面为基 层420b与顶层420a的界面。光穿越A～F界面时，任一界面的两种物质的折射率分别为n1、n2，则|n1-n2|＜1.0，优选|n1-n2|＜0.5，更优选|n1-n2|＜0.2。一实施例中，B、E、D、F四个界面中任一界面的两种物质的折射率分别为n1、n2，则|n1-n2|＜1.0，优选|n1-n2|＜0.5，更优选|n1-n2|＜0.2。一实施例中，D、F两个界面中任一界面的两种物质的折射率分别为n1、n2，则|n1-n2|＜1.0，优选|n1-n2|＜0.5，更优选|n1-n2|＜0.2。每个界面的两种物质的折射率的差值的绝对值越小，出光效率越高。例如LED芯片442发出的光从基层420b穿越到顶层420a时，入射角为θ1，折射角为θ2，假设基层420b的折射率为n1，顶层420a的折射率为n2，根据sinθ1/sinθ2＝n2/n1，当n1与n2的差值的绝对值越小，入射角与折射角越接近，则LED灯丝的出光效率越高。When the LED filament is illuminated in the LED bulb encapsulating the inert gas, as shown in FIG. 18, the light emitted by the LED chip 442 passes through the A to F interface, wherein the interface A is the interface between the GaN and the top layer 420a in the LED chip 442. The B interface is the interface between the top layer 420a and the inert gas, the C interface is the interface between the substrate and the solid crystal glue 450 in the LED chip 442, the interface D is the interface between the solid crystal glue 450 and the base layer 420b, and the interface E is the interface between the base layer 420b and the inert gas. The F interface is the interface between the base layer 420b and the top layer 420a. When light passes through the A to F interface, the refractive indices of the two substances at any interface are n1 and n2, respectively, then |n1-n2|<1.0, preferably |n1-n2|<0.5, more preferably |n1-n2| 0.2. In one embodiment, the refractive indices of the two substances at any of the four interfaces B, E, D, and F are respectively n1 and n2, and then |n1-n2|<1.0, preferably |n1-n2|<0.5, More preferably, |n1-n2|<0.2. In one embodiment, the refractive indices of the two substances at any of the two interfaces D and F are respectively n1 and n2, then |n1-n2|<1.0, preferably |n1-n2|<0.5, more preferably |n1 -n2|<0.2. The smaller the absolute value of the difference in refractive index between the two substances at each interface, the higher the light extraction efficiency. For example, when the light emitted from the LED chip 442 passes through the base layer 420b to the top layer 420a, the incident angle is θ1, the refraction angle is θ2, and the refractive index of the base layer 420b is n1, and the refractive index of the top layer 420a is n2, according to sin θ1/sin θ2=n2/ N1, when the absolute value of the difference between n1 and n2 is smaller, the closer the incident angle to the refraction angle, the higher the light-emitting efficiency of the LED filament.
如图19A所示，LED灯丝400中以相邻两LED芯片442的中点作为分界线截取包含单个LED芯片442的LED灯丝单元400a1，图19A为LED灯丝单元400a1在LED灯丝轴向方向上的横截面图，图19B为LED灯丝单元400a1在LED灯丝径向方向上的横截面图。如图19A和19B所示，LED芯片442在LED灯丝轴向方向上的发光角度为α，LED芯片442在LED灯丝径向方向上的发光角度为β，将远离基层420b的LED芯片442表面定义为LED芯片442上表面，在LED灯丝径向方向上LED芯片442上表面至顶层外表面的距离为H，LED灯丝单元400a1在LED灯丝的长度方向上的长度为C，LED灯丝中某一LED芯片442在LED灯丝轴向方向上的出光区域为圆心角α、顶层420a距离LED芯片442上表面具有厚度H所对应的扇形区域，设定扇形区域中弧长两端点之间，与LED灯丝轴向方向相互平行的直线距离为L1；LED灯丝中某一LED芯片442在LED灯丝径向方向上的出光区域为圆心角β、顶层420a距离LED芯片442上表面具有厚度H所对应的扇形区域，设定扇形区域中弧长两端点之间，与LED灯丝径向方向相互平行的直线距离的为L2。同时考虑LED灯丝具有理想的出光区域、较佳的弯折性及散热性能，避免LED灯丝出现明显暗区，减少材料浪费，可将L1值设计为0.5C≤L1≤10C，优选C≤L1≤2C。而L2≥W1若L1值小于C值，相邻的LED芯片442在轴向方向上的出光区域无法取得交集，LED灯丝在轴向上即可能出现暗区；而当L2值小于W1值，代表LED芯片442在LED灯丝径向/宽度过大，同样可能使顶层420a在径向/宽度方向的两侧产生暗区。暗区的出现不仅会影响LED灯丝整体出光效率，同时间接造成材料使用上的浪费。α，β具体数值根据LED芯片442的种类或规格而定。As shown in FIG. 19A, in the LED filament 400, the LED filament unit 400a1 including a single LED chip 442 is taken as a boundary line between the midpoints of two adjacent LED chips 442, and FIG. 19A shows the LED filament unit 400a1 in the axial direction of the LED filament. Cross-sectional view, FIG. 19B is a cross-sectional view of the LED filament unit 400a1 in the radial direction of the LED filament. As shown in FIGS. 19A and 19B, the illumination angle of the LED chip 442 in the axial direction of the LED filament is α, and the illumination angle of the LED chip 442 in the radial direction of the LED filament is β, which defines the surface of the LED chip 442 away from the base layer 420b. For the upper surface of the LED chip 442, the distance from the upper surface of the LED chip 442 to the outer surface of the top layer in the radial direction of the LED filament is H, and the length of the LED filament unit 400a1 in the longitudinal direction of the LED filament is C, and one LED in the LED filament The light exiting area of the chip 442 in the axial direction of the LED filament is a central angle α, and the top layer 420a has a sector-shaped area corresponding to the thickness H of the upper surface of the LED chip 442, and is set between the ends of the arc length in the sector area, and the LED filament shaft The straight line distance parallel to the direction is L1; the light exiting area of one LED chip 442 in the radial direction of the LED filament is the central angle β, and the top layer 420a has a sector area corresponding to the thickness H of the upper surface of the LED chip 442. The linear distance between the ends of the arc length in the sector area and the radial direction of the LED filament is set to L2. At the same time, the LED filament has ideal light-emitting area, better bending property and heat dissipation performance, avoiding obvious dark areas of the LED filament and reducing material waste. The L1 value can be designed to be 0.5C≤L1≤10C, preferably C≤L1≤ 2C. When L2≥W1, if the L1 value is smaller than the C value, the adjacent LED chip 442 cannot obtain an intersection in the axial direction, and the LED filament may have a dark area in the axial direction; and when the L2 value is smaller than the W1 value, it represents The LED chip 442 is too large in radial/width of the LED filament, and it is also possible to cause the top layer 420a to create dark areas on both sides in the radial/width direction. The appearance of dark areas not only affects the overall light output efficiency of the LED filament, but also indirectly causes waste of material use. The specific values of α, β depend on the type or specification of the LED chip 442.
一实施例中，在LED灯丝轴向方向上：In one embodiment, in the axial direction of the LED filament:
H＝L1/2tan0.5α，0.5C≤L1≤10C，则0.5C/2tan0.5α≤H≤10C/2tan0.5α；H=L1/2tan0.5α, 0.5C≤L1≤10C, then 0.5C/2tan0.5α≤H≤10C/2tan0.5α;
在LED径向方向上：In the radial direction of the LED:
H＝L2/2tan0.5β，L2≥W1，则H≥W1/2tan0.5β；H=L2/2tan0.5β, L2≥W1, then H≥W1/2tan0.5β;
因此，Hmax＝10C/2tan0.5α，Hmin＝a；设定a为0.5C/2tan0.5α、W1/2tan0.5β两者中的最大值，设定A为C/2tan0.5α、W1/2tan0.5β两者中的最大值。Therefore, Hmax=10C/2tan0.5α, Hmin=a; setting a is the maximum value of both 0.5C/2tan0.5α and W1/2tan0.5β, and setting A to C/2tan0.5α, W1/2tan0 The maximum of both .5β.
因而，a≤H≤10C/2tan0.5α，优选A≤H≤2C/2tan0.5α。当得知LED芯片442的种类、相邻LED芯片之间的间距及灯丝的宽度时，可确定LED芯片442发光面至顶层外表 面的距离H范围，如此可保证灯丝在灯丝的径向方向、轴向方向上均具有较优异的出光区域。Therefore, a ≤ H ≤ 10C/2tan0.5α, preferably A ≤ H ≤ 2C/2tan0.5α. When the type of the LED chip 442, the spacing between adjacent LED chips, and the width of the filament are known, the distance H from the light emitting surface of the LED chip 442 to the outer surface of the top layer can be determined, so that the filament is ensured in the radial direction of the filament, It has an excellent light exiting area in the axial direction.
大多数LED芯片在LED灯丝轴向、LED灯丝径向方向上的发光角度均为120°，设定b为0.14C、0.28W1两者中的最大值，B为0.28C、0.28W1两者中的最大值，则b≤H≤2.9C；优选B≤H≤0.58C。Most LED chips have an illumination angle of 120° in the axial direction of the LED filament and in the radial direction of the LED filament. The setting b is the maximum of 0.14C and 0.28W1, and B is 0.28C and 0.28W1. The maximum value is b ≤ H ≤ 2.9 C; preferably B ≤ H ≤ 0.58 C.
一实施例中，在LED灯丝轴向方向上：In one embodiment, in the axial direction of the LED filament:
H＝L1/2tan0.5α，0.5C≤L1≤10C；H=L1/2tan0.5α, 0.5C≤L1≤10C;
在LED灯丝径向方向上：In the radial direction of the LED filament:
H＝L2/2tan0.5β，L2≥W1；则W1≤2Htan0.5β；H=L2/2tan0.5β, L2≥W1; then W1≤2Htan0.5β;
则0.5Ctan0.5β/tan0.5α≤L2≤10Ctan0.5β/tan0.5α，L2≥W1；Then 0.5Ctan0.5β/tan0.5α≤L2≤10Ctan0.5β/tan0.5α, L2≥W1;
所以W1≤10Ctan0.5β/tan0.5α。因而W1max＝min(10Ctan0.5β/tan0.5α，2Htan0.5β)Therefore, W1 ≤ 10 Ctan 0.5 β / tan 0.5 α. Thus W1max=min(10Ctan0.5β/tan0.5α, 2Htan0.5β)
又已设定LED芯片宽度W2和基层宽度W1的关系式为W1：W2＝1:0.8～0.9，因而可得知W1min＝W2/0.9Further, the relationship between the LED chip width W2 and the base layer width W1 is set to W1: W2 = 1:0.8 to 0.9, so that W1min=W2/0.9 can be known.
设定d为10Ctan0.5β/tan0.5α、2Htan0.5β两者中的最小值，D为2Ctan0.5β/tan0.5α、2Htan0.5β两者中的最小值，则W2/0.9≤W1≤d，优选W2/0.9≤W1≤D。Let d be the minimum of 10Ctan0.5β/tan0.5α and 2Htan0.5β, and D is the minimum of 2Ctan0.5β/tan0.5α and 2Htan0.5β, then W2/0.9≤W1≤d Preferably, W2/0.9 ≤ W1 ≤ D.
已知LED芯片442的种类、LED灯丝中相邻两LED芯片之间的距离及H值，即可知灯丝的宽度W的范围，如此可保证灯丝在灯丝的径向方向、轴向方向上均具有较优异的出光区域。Knowing the kind of the LED chip 442, the distance between the adjacent two LED chips in the LED filament, and the H value, the range of the width W of the filament can be known, so that the filament has the radial direction and the axial direction of the filament. More excellent light exit area.
大多数LED芯片在LED灯丝轴向、LED灯丝径向方向上的发光角度均为120°，设定e为10C、3.46H两者中的最小值，E为2C、3.46H两者中的最小值，则1.1W2≤W1≤e，优选1.1W2≤W1≤E。Most LED chips have an illumination angle of 120° in the axial direction of the LED filament and in the radial direction of the LED filament. The e is the minimum of 10C and 3.46H, and E is the smallest of 2C and 3.46H. For the value, 1.1 W2 ≤ W1 ≤ e, preferably 1.1 W2 ≤ W1 ≤ E.
一实施例中，在LED灯丝轴向方向上：In one embodiment, in the axial direction of the LED filament:
H＝L1/2tan0.5α，0.5C≤L1≤10C，则0.2Htan0.5α≤C≤4Htan0.5α；H=L1/2tan0.5α, 0.5C≤L1≤10C, then 0.2Htan0.5α≤C≤4Htan0.5α;
在LED灯丝径向方向上：In the radial direction of the LED filament:
H＝L2/2tan0.5β，L2≥W1，则L1≥W1tan0.5α/tan0.5β；H=L2/2tan0.5β, L2≥W1, then L1≥W1tan0.5α/tan0.5β;
因而W1tan0.5α/tan0.5β≤10C，所以C≥0.1W1tan0.5α/tan0.5β；Thus W1tan0.5α/tan0.5β≤10C, so C≥0.1W1tan0.5α/tan0.5β;
则Cmax＝4Htan0.5α；Then Cmax=4Htan0.5α;
设定f为0.2Htan0.5α、0.1W1tan0.5α/tan0.5β两者中的最大值，F为Htan0.5α、0.1W1tan0.5α/tan0.5β两者中的最大值，所以f≤C≤4Htan0.5α，优选F≤C≤2Htan0.5α；Let f be the maximum value of both 0.2Htan0.5α and 0.1W1tan0.5α/tan0.5β, and F is the maximum value of both Htan0.5α and 0.1W1tan0.5α/tan0.5β, so f≤C≤ 4Htan0.5α, preferably F≤C≤2Htan0.5α;
当确定了LED灯丝的宽度、高度H以及LED芯片442种类时，可知灯丝的宽度C的范围，如此可保证LED灯丝在灯丝的径向方向、轴向方向上均具有较优异的出光区域。When the width, height H, and type of the LED chip 442 of the LED filament are determined, the range of the width C of the filament is known, so that the LED filament has a superior light-emitting area in both the radial direction and the axial direction of the filament.
大多数LED芯片在LED灯丝轴向、LED灯丝径向方向上的发光角度均为120°，设定g为0.34H、0.1W1中的最大值，G为1.73H、0.1W1中的最大值，则g≤C≤6.92H，优选G≤C≤3.46H。Most LED chips have an illumination angle of 120° in the axial direction of the LED filament and in the radial direction of the LED filament. The setting g is the maximum value of 0.34H and 0.1W1, and G is the maximum value of 1.73H and 0.1W1. Then g ≤ C ≤ 6.92H, preferably G ≤ C ≤ 3.46H.
上述实施例中，因LED芯片442的厚度相对于顶层420a的厚度会较小，因而在多数情况下可忽略不计，亦即H也可代表顶层420a的实际厚度。一实施例中，如图7所示 的两个顶层420a中任意一个的高度也适用于上述中H的范围。另一实施例中，与图7不同之处在于，基层420b的一表面上放置有LED芯片442及电极410、412，与此表面相对的另一表面上没有放置LED芯片442及电极410、412，的此实施例中顶层420a的高度适用上述H的范围。其它实施例中，光转换层为类似如图6A、图7所示的光转换层420的结构，例如区别仅在于与图6A、图7所示的电极的位置不同，顶层420a的高度适用于上述H的范围。In the above embodiment, since the thickness of the LED chip 442 is small relative to the thickness of the top layer 420a, it is negligible in most cases, that is, H also represents the actual thickness of the top layer 420a. In one embodiment, the height of any of the two top layers 420a as shown in Figure 7 is also applicable to the range of H in the above. In another embodiment, the difference from FIG. 7 is that the LED chip 442 and the electrodes 410 and 412 are placed on one surface of the base layer 420b, and the LED chip 442 and the electrodes 410 and 412 are not disposed on the other surface opposite to the surface. The height of the top layer 420a in this embodiment applies to the range of H above. In other embodiments, the light conversion layer is similar to the structure of the light conversion layer 420 as shown in FIG. 6A and FIG. 7 , for example, only differs from the position of the electrodes shown in FIG. 6A and FIG. 7 , and the height of the top layer 420 a is suitable for The range of H above.
图20A和图20B所示为不同顶层420a形状的LED灯丝单元400a1的截面图，将远离基层420b且与基层420b相接触表面相对的LED芯片442表面记为Ca。在一实施例中，如图20A所示，顶层420a的形状为不同直径大小的半圆形，顶层420a的圆心o与LED芯片442的出光面Ca不重叠，光射到顶层420a外表面两圆周上的距离分别为r1、r2，当光以同一方向从B界面(顶层与惰性气体的界面)上穿越时，顶层420a半径r1、r2的入射角分别为α、β，由tanα＝m/r1，tanβ＝m/r2可得知，半径越大，入射角越小，灯丝的出光效率越高；也就是说，当顶层420a截面为半圆形的形状时，应尽可能取其最大半径/直径值，可获得较佳出光效率。另一实施例中，如图20B所示一顶层420a的形状为半圆形，另一顶层420a的形状为椭圆形，其中椭圆形的长轴的长度与半圆形的直径相同，且顶层420a的圆心o和椭圆的中心点o与LED芯片的出光面A不重叠。从图20B中可以看出，当光以同一方向从B界面上穿越时，光射到圆周和椭圆圆弧上的距离分别为r1、r2，入射角分别为α、β，由tanα＝m/r1，tanβ＝m/r2可得知，r1、r2越大，入射角越小，灯丝的出光效率越高；也就是说，相较于椭圆形，将顶层420a截面设计为半圆形的形状时(即LED芯片发光Ca中心点至顶层外表面的距离实质上相同)，可获得较佳出光效率。如图20C所示，实线表示的顶层420a的圆心O与LED芯片的出光面A不重叠，虚线表示的顶层420a的圆心O’与LED芯片的出光面重叠，以O为圆心的半圆与以O’的半圆的半径相等，从图中可以看出，tanα＝m1/r，tanβ＝m2/r，m1大于m2，因而α大于β，因而当出光面与圆心重叠时(即LED芯片发光Ca中心点至顶层外表面的距离实质上相同)，出光效率较好。20A and 20B are cross-sectional views of the LED filament unit 400a1 of a different top layer 420a shape, and the surface of the LED chip 442 which is away from the base layer 420b and which is in contact with the surface of the base layer 420b is denoted as Ca. In one embodiment, as shown in FIG. 20A, the shape of the top layer 420a is a semicircle of different diameters, and the center o of the top layer 420a does not overlap with the light exit surface Ca of the LED chip 442, and the light is incident on the outer circumference of the top surface 420a. The distances above are r1 and r2, respectively. When the light passes through the B interface (the interface between the top layer and the inert gas) in the same direction, the incident angles of the radii r1 and r2 of the top layer 420a are α and β, respectively, and tan α=m/r1 , tanβ=m/r2, the larger the radius, the smaller the incident angle, the higher the light extraction efficiency of the filament; that is, when the top layer 420a has a semicircular shape, the maximum radius should be taken as much as possible/ The diameter value gives a better light extraction efficiency. In another embodiment, as shown in FIG. 20B, a top layer 420a has a semicircular shape, and the other top layer 420a has an elliptical shape, wherein the major axis of the ellipse has the same length as the semicircular diameter, and the top layer 420a The center point o of the center o and the ellipse does not overlap with the light exit surface A of the LED chip. As can be seen from Fig. 20B, when the light passes through the B interface in the same direction, the distances of the light on the circumference and the elliptical arc are r1 and r2, respectively, and the incident angles are α and β, respectively, and tan α = m / R1,tanβ=m/r2 can be seen that the larger the r1 and r2, the smaller the incident angle, and the higher the light extraction efficiency of the filament; that is, the top layer 420a is designed to have a semicircular shape compared to the elliptical shape. At the time (ie, the distance from the center point of the LED chip to the outer surface of the top layer is substantially the same), a better light extraction efficiency can be obtained. As shown in FIG. 20C, the center O of the top layer 420a indicated by the solid line does not overlap with the light-emitting surface A of the LED chip, and the center O' of the top layer 420a indicated by the broken line overlaps with the light-emitting surface of the LED chip, and the semi-circle with the center of O is The radius of the semicircle of O' is equal. As can be seen from the figure, tanα=m1/r, tanβ=m2/r, m1 is larger than m2, and thus α is larger than β, so when the light emitting surface overlaps with the center of the circle (ie, the LED chip emits Ca) The distance from the center point to the outer surface of the top layer is substantially the same), and the light extraction efficiency is better.
上述LED芯片可换成背镀芯片，镀的金属为银或金合金，采用背镀芯片时，可提高镜面反射，增加LED芯片发光面A的出光量。The LED chip can be replaced by a back plated chip, and the plated metal is silver or gold alloy. When the back plated chip is used, the specular reflection can be improved, and the amount of light emitted from the light emitting surface A of the LED chip can be increased.
接下来说明有关LED灯丝的芯片打线相关设计。图21A为本发明LED灯丝300未弯折状态下一实施例的俯视图，LED灯丝300包括多个LED芯片单元302、304、导体330a、至少两个电极310、312。LED芯片单元302、304，可以是单颗LED芯片，也可以是包含多颗LED芯片，即等于或大于两颗LED芯片。Next, the chip-related design of the LED filament will be described. 21A is a top plan view of an embodiment of the LED filament 300 in an unbent state in accordance with the present invention. The LED filament 300 includes a plurality of LED chip units 302, 304, a conductor 330a, and at least two electrodes 310, 312. The LED chip units 302 and 304 may be a single LED chip, or may include a plurality of LED chips, that is, equal to or larger than two LED chips.
导体330a位于相邻两LED芯片单元302、304之间，LED芯片单元302、304在Y方向上处于不同的位置，电极310、312对应于LED芯片单元302、304配置，且通过导线340电性连接LED芯片单元302、304，相邻两LED芯片单元302、304通过导体330a相互电性连接，导体330a与灯丝的长度方向(X方向)的夹角为30°～120°，优选60°～120°。现有技术中导体330a的方向与X方向平行，灯丝在导体处弯折时作用在导体截面积上的内应力较大，而将导体330a配置为与X方向呈一定的夹角，能有效降低灯丝弯曲时作用在导体截 面积上的内应力。导线340与X方向呈一定夹角、平行、垂直或任意组合，在本实施例中，LED灯丝300包括两条导线340，一条导线340与X方向平行，另一条导线340与X方向的夹角为30°～120°。LED灯丝300在其电极310、312被接通电源(电压源或电流源)后，即可发出光线。The conductor 330a is located between the adjacent two LED chip units 302, 304, the LED chip units 302, 304 are at different positions in the Y direction, the electrodes 310, 312 are corresponding to the LED chip units 302, 304, and are electrically connected through the wires 340. The LED chip units 302 and 304 are connected, and the adjacent LED chip units 302 and 304 are electrically connected to each other through the conductor 330a. The angle between the conductor 330a and the filament in the longitudinal direction (X direction) is 30° to 120°, preferably 60°. 120°. In the prior art, the direction of the conductor 330a is parallel to the X direction, and the internal stress acting on the cross-sectional area of the conductor when the filament is bent at the conductor is large, and the conductor 330a is disposed at a certain angle with the X direction, which can effectively reduce The internal stress acting on the cross-sectional area of the conductor when the filament is bent. The wire 340 is at an angle, parallel, vertical or any combination with the X direction. In the embodiment, the LED filament 300 includes two wires 340, one wire 340 is parallel to the X direction, and the other wire 340 is in the X direction. It is 30° to 120°. The LED filament 300 emits light after its electrodes 310, 312 are powered (voltage source or current source).
图21B至图21D所示为图21A中导体与X方向呈90°的情形，即导体330a与X方向垂直，能降低灯丝弯折时导体截面积上的内应力，图21B所示的实施例中导线340与X方向平行、垂直组合，LED灯丝300包括两条导线340，一条导线340与X方向平行，另一条导线340则与X方向垂直。21B to 21D show the case where the conductor of FIG. 21A is 90° with respect to the X direction, that is, the conductor 330a is perpendicular to the X direction, which can reduce the internal stress on the conductor cross-sectional area when the filament is bent, and the embodiment shown in FIG. 21B The middle wire 340 is parallel and vertically combined with the X direction, and the LED filament 300 includes two wires 340, one wire 340 being parallel to the X direction and the other wire 340 being perpendicular to the X direction.
如图21C所示，与图21B所示的实施例的不同之处在于，导线340与X方向垂直，电极310、312与LED芯片单元302、304之间的弯折性能提高，而由于导体330a和导线340同时配置为与X方向垂直，因此灯丝得以在任意位置都能具有良好的可弯折性。As shown in FIG. 21C, the difference from the embodiment shown in FIG. 21B is that the wire 340 is perpendicular to the X direction, and the bending property between the electrodes 310, 312 and the LED chip units 302, 304 is improved due to the conductor 330a. The wire 340 is disposed at the same time as the X direction, so that the filament can have good bendability at any position.
图21E为本发明LED灯丝300未弯折状态下一实施例的俯视图,与图21C所示的实施例不同之处在于，在X方向上，LED芯片单元304处于相邻两LED芯片单元302之间，并且在Y方向的投影与LED芯片单元302不具有重叠的区域，如此当灯丝在导体330a处弯折时，不会损伤芯片，从而提高产品质量的稳定性。21E is a top view of the embodiment of the LED filament 300 in an unbent state according to the present invention, which is different from the embodiment shown in FIG. 21C in that the LED chip unit 304 is in the adjacent two LED chip units 302 in the X direction. The projection in the Y direction does not have an overlap with the LED chip unit 302, so that when the filament is bent at the conductor 330a, the chip is not damaged, thereby improving the stability of the product quality.
如图21F所示，LED灯丝300包括多个LED芯片单元302、304、导体330a、至少两个电极310、312，导体330a位于相邻两LED芯片单元302、304之间，LED芯片单元302、304在Y方向上处于基本相同的位置，如此可使得LED灯丝300的整体宽度较小，进而缩短LED芯片的散热路径，提高散热效果。电极310、312对应于LED芯片单元302、304配置，且通过导线340电性连接LED芯片单元302、304，LED芯片单元302/304通过导线350与导体330a电性连接，导体330a大体上呈Z字型，可增加导体与LED芯片所在区域的机械强度且可避免连接LED芯片与导体的导线在LED灯丝300弯折时发生破损的情形，此时导线340配置为与X方向呈平行状态。As shown in FIG. 21F, the LED filament 300 includes a plurality of LED chip units 302, 304, a conductor 330a, and at least two electrodes 310, 312. The conductor 330a is located between two adjacent LED chip units 302, 304, and the LED chip unit 302, The 304 is in substantially the same position in the Y direction, so that the overall width of the LED filament 300 is small, thereby shortening the heat dissipation path of the LED chip and improving the heat dissipation effect. The electrodes 310 and 312 are disposed corresponding to the LED chip units 302 and 304, and are electrically connected to the LED chip units 302 and 304 through the wires 340. The LED chip units 302/304 are electrically connected to the conductors 330a through the wires 350. The conductors 330a are substantially Z. The font shape can increase the mechanical strength of the region where the conductor and the LED chip are located, and can avoid the damage of the wire connecting the LED chip and the conductor when the LED filament 300 is bent. At this time, the wire 340 is disposed in a parallel state with the X direction.
如图21G所示，LED灯丝300包括多个LED芯片单元302、304、导体330a、至少两个电极310、312，LED芯片单元302、304在Y方向上处于同样的位置，导体330a与X方向平行，导体330a包括第一导体3301a与第二导体3302a，分别位于LED芯片单元302/304的两侧，第一导体3301a位于相邻两LED芯片单元之间，且通过导线350电性连接LED芯片单元302/304。导线350与X方向垂直，降低LED灯丝300弯折时导线截面积上的内应力，提高导线的耐弯折性。第二导体3302a与LED芯片142无电性连接，第二导体3302a沿X方向延伸至导线340，当LED灯丝300受到外力时，可起到应力缓冲的作用，保护LED芯片，提高产品稳定性，其次使LED芯片两侧的受力均衡。电极310、312对应于LED芯片单元302、304配置，且通过导线340电性连接LED芯片单元302、304。As shown in FIG. 21G, the LED filament 300 includes a plurality of LED chip units 302, 304, a conductor 330a, and at least two electrodes 310, 312. The LED chip units 302, 304 are in the same position in the Y direction, and the conductors 330a and X are oriented. In parallel, the conductor 330a includes a first conductor 3301a and a second conductor 3302a respectively located on opposite sides of the LED chip unit 302/304. The first conductor 3301a is located between two adjacent LED chip units, and is electrically connected to the LED chip through the wire 350. Unit 302/304. The wire 350 is perpendicular to the X direction, and reduces the internal stress on the cross-sectional area of the wire when the LED filament 300 is bent, thereby improving the bending resistance of the wire. The second conductor 3302a is electrically connected to the LED chip 142, and the second conductor 3302a extends in the X direction to the wire 340. When the LED filament 300 receives an external force, it can act as a stress buffer to protect the LED chip and improve product stability. Secondly, the forces on both sides of the LED chip are balanced. The electrodes 310, 312 are configured corresponding to the LED chip units 302, 304, and are electrically connected to the LED chip units 302, 304 through wires 340.
如图21H所示，与图21G所示的实施例的不同之处在于，第一导体3301a与第二导体3302a沿X方向延伸至导线340，第一导体3301a与第二导体3302a均通过导线350连接LED芯片单元302和LED芯片单元304。在其它实施例中，例如第一导体3301a通过导线 350连接LED芯片单元302和LED芯片单元304，第二导体3302a可不与LED芯片单元302/304电性连接。通过在LED芯片两侧设置导体，使得LED灯丝300弯折时，既能起到增加LED灯丝300强度的作用又能分散一部分LED芯片在发光时所产生的热量。As shown in FIG. 21H, the difference from the embodiment shown in FIG. 21G is that the first conductor 3301a and the second conductor 3302a extend in the X direction to the wire 340, and the first conductor 3301a and the second conductor 3302a both pass the wire 350. The LED chip unit 302 and the LED chip unit 304 are connected. In other embodiments, for example, the first conductor 3301a connects the LED chip unit 302 and the LED chip unit 304 via the wire 350, and the second conductor 3302a may not be electrically connected to the LED chip unit 302/304. When the LED filament 300 is bent on both sides of the LED chip, the LED filament 300 can be bent to increase the intensity of the LED filament 300 and disperse a portion of the heat generated by the LED chip during illumination.
图21I为本发明LED灯丝300未弯折状态下一实施例的俯视图，本实施例中，LED芯片单元302、304为单个LED芯片，LED芯片单元302、304的宽度方向与X方向平行，优选LED芯片单元302、304在Y方向上处于基本相同的位置，如此可使得LED灯丝300的整体宽度较小，进而缩短LED芯片的散热路径，提高散热效果。相邻两LED芯片单元302、304之间通过导体330a连接，导体330a与X方向的夹角为30°～120°，降低LED灯丝300弯折时导线截面积上的内应力，提高导线的耐弯折性。在其它实施例中，LED芯片单元的长边可与X方向具有一定夹角，如此可使LED灯丝300的整体宽度进一步缩小。21I is a top view of an embodiment of the LED filament 300 in an unbent state. In this embodiment, the LED chip units 302 and 304 are single LED chips, and the width direction of the LED chip units 302 and 304 is parallel to the X direction. The LED chip units 302 and 304 are at substantially the same position in the Y direction, so that the overall width of the LED filament 300 is small, thereby shortening the heat dissipation path of the LED chip and improving the heat dissipation effect. The adjacent two LED chip units 302 and 304 are connected by a conductor 330a, and the angle between the conductor 330a and the X direction is 30° to 120°, which reduces the internal stress on the cross-sectional area of the wire when the LED filament 300 is bent, and improves the resistance of the wire. Bendability. In other embodiments, the long sides of the LED chip unit may have an angle with the X direction, which may further reduce the overall width of the LED filament 300.
图22A所示本发明LED灯丝400层状结构的一实施例示意图，LED灯丝400具有：光转换层420；LED芯片单元402,404；电极410,412；以及用于电连接相邻两LED芯片单元402、404间的导体段430。LED芯片单元402、404包括至少两个LED芯片442，LED芯片间通过导线440相互电性连接。在本实施例中，导体段430包括导体430a，导体段430与LED段402,404通过导线450进行电性连接，其中分别位于相邻两LED芯片单元402、404内的两个LED芯片442间的最短距离大于LED芯片单元402/404内相邻两LED芯片之间的距离，导线440的长度小于导体430a的长度。光转换层420涂布于LED芯片442/电极410、412的至少两侧上。光转换层420暴露出电极410、412的一部分。光转换层420可至少具有一顶层420a及一基层420b，分别作为灯丝的上位层以及下位层，于此实施例中顶层420a及基层420b分别位于LED芯片442/电极410、412的两侧。正装芯片沿X方向进行焊线工艺时，例如导线和导体为金线，如图22B所示，焊线的质量主要由A、B、C、D、E五个点决定，A为芯片焊垫4401与金球4403的连接处，B为金球4403与金线440的连接处，C为金线440两段之间，D为金线440与二焊点焊巴4402连接处，E为二焊点焊巴4402与芯片442表面之间，因为B点为金线440走线弧时的第一次折弯点，D点处金线440的线径较薄，因而金线440在B点和D点处易断，因此例如在实施如图22A的结构时，LED灯丝300封装时顶层420a只需覆盖B点和D点，金线440的一部分露出光转换层外。如果将LED芯片442六面中与基层420b距离最远的那一个面定义为LED芯片442的上表面，则LED芯片442的上表面至顶层420a表面的距离为100～200μm。FIG. 22A is a schematic view showing an embodiment of a layered structure of the LED filament 400 of the present invention. The LED filament 400 has a light conversion layer 420, LED chip units 402, 404, electrodes 410, 412, and electrical connections for adjacent two LED chip units 402, 404. Between the conductor segments 430. The LED chip units 402, 404 include at least two LED chips 442 electrically connected to each other by wires 440. In the present embodiment, the conductor segment 430 includes a conductor 430a that is electrically connected to the LED segments 402, 404 by wires 450, wherein the shortest between the two LED chips 442 located in adjacent LED chip units 402, 404, respectively. The distance is greater than the distance between adjacent LED chips in the LED chip unit 402/404, the length of the wire 440 being less than the length of the conductor 430a. The light conversion layer 420 is coated on at least two sides of the LED chip 442/ electrodes 410, 412. Light conversion layer 420 exposes a portion of electrodes 410, 412. The light conversion layer 420 can have at least one top layer 420a and one base layer 420b as the upper layer and the lower layer of the filament respectively. In this embodiment, the top layer 420a and the base layer 420b are respectively located on both sides of the LED chip 442/ electrodes 410 and 412. When the positive-loading chip performs the bonding process along the X direction, for example, the wire and the conductor are gold wires, as shown in FIG. 22B, the quality of the bonding wire is mainly determined by five points A, B, C, D, and E, and A is a chip pad. The junction of 4401 and Golden Ball 4403, B is the junction of gold ball 4403 and gold wire 440, C is between two sections of gold wire 440, D is the connection of gold wire 440 and two solder joint welding bar 4402, E is two Between the solder joint bar 4402 and the surface of the chip 442, since the B point is the first bending point of the gold wire 440 arc, the wire diameter of the gold wire 440 at the D point is thin, and thus the gold wire 440 is at the B point. And the point D is frangible, so for example, when implementing the structure of FIG. 22A, the top layer 420a of the LED filament 300 is only required to cover points B and D, and a part of the gold line 440 is exposed outside the light conversion layer. If the one of the six faces of the LED chip 442 which is the farthest from the base layer 420b is defined as the upper surface of the LED chip 442, the distance from the upper surface of the LED chip 442 to the surface of the top layer 420a is 100 to 200 μm.
接下来说明本发明LED灯丝关于基层的材料内容。适用于制作软性LED灯丝基材或光转换层的材料必须具备优良的光透过率、较佳的耐热性、优良的热传导率、适当的折射率、优良的机械性质以及不易翘曲等特性。上述的这些特性都可藉由调整有机硅改性聚酰亚胺组合物中所包含的主材料、改性剂以及添加剂的种类及含量比例来满足。本发明提供一种包含有机硅改性聚酰亚胺的组合物所形成灯丝基材或光转换层，该组合物除了可满足上述特性之外，也可藉由调整特定或部分组合物中的主材料、改性剂以及添加剂的种类及含量来整灯丝基材或光转换层的特性，以满足特殊的需求环境。每一种特性的调整方式如以下说明。Next, the material content of the LED filament of the present invention with respect to the base layer will be described. Materials suitable for making flexible LED filament substrates or light conversion layers must have excellent light transmittance, better heat resistance, excellent thermal conductivity, proper refractive index, excellent mechanical properties, and difficulty in warping. characteristic. All of the above characteristics can be satisfied by adjusting the type and content ratio of the main material, the modifier, and the additive contained in the silicone-modified polyimide composition. The present invention provides a filament substrate or a light conversion layer formed of a composition comprising a silicone-modified polyimide, which composition can also be adjusted in a specific or partial composition in addition to the above characteristics. The type and content of the main material, modifier and additive to the characteristics of the entire filament substrate or light conversion layer to meet the special needs of the environment. The adjustment method of each characteristic is as follows.
有机硅改性聚酰亚胺调配方式Silicone modified polyimide blending method
本发明所提出的有机硅改性聚酰亚胺，包括下述通式(Ⅰ)所表示的重复单元：The silicone-modified polyimide proposed by the present invention comprises a repeating unit represented by the following formula (I):
Figure PCTCN2018123817-appb-000002
Figure PCTCN2018123817-appb-000002
通式(Ⅰ)中，Ar 1为4价有机基团。所述有机基团具有苯环或脂环式烃结构，所述脂环式烃结构可以为单环系的脂环式烃结构，也可以具有含有桥环的脂环式烃结构，作为含有桥环的脂环式烃结构，可以为两环系的脂环式烃结构，也可以为三环系的脂环式烃结构。有机基团也可以是含有活泼氢官能团的苯环结构或脂环式烃结构，活泼氢官能团为羟基、氨基、羧基、酰胺基或硫醇基中的任意一种或一种以上。 In the formula (I), Ar 1 is a tetravalent organic group. The organic group has a benzene ring or an alicyclic hydrocarbon structure, and the alicyclic hydrocarbon structure may be a monocyclic alicyclic hydrocarbon structure or an alicyclic hydrocarbon structure containing a bridged ring as a bridge containing The cyclic alicyclic hydrocarbon structure may be a bicyclic alicyclic hydrocarbon structure or a tricyclic alicyclic hydrocarbon structure. The organic group may also be a benzene ring structure or an alicyclic hydrocarbon structure containing an active hydrogen functional group, and the active hydrogen functional group may be any one or more of a hydroxyl group, an amino group, a carboxyl group, an amide group or a thiol group.
Ar 2为2价有机基团，所述有机基团可以具有例如单环系的脂环式烃结构，或是含有活泼氢官能团的2价有机基团，活泼氢官能团为羟基、氨基、羧基、酰胺基或硫醇基中的任意一种或一种以上。 Ar 2 is a divalent organic group, and the organic group may have, for example, a monocyclic alicyclic hydrocarbon structure or a divalent organic group containing an active hydrogen functional group, and the active hydrogen functional group is a hydroxyl group, an amino group, a carboxyl group, Any one or more of an amide group or a thiol group.
R分别独立地选自甲基或苯基。R is independently selected from methyl or phenyl.
n为1～5，优选n为1或2或3或5。n is from 1 to 5, preferably n is 1 or 2 or 3 or 5.
通式(Ⅰ)的数均分子量为5000～100000，优选为10000～60000，更优选为20000～40000。数均分子量是基于通过凝胶渗透色谱(GPC)装置使用标准聚苯乙烯制备的校准曲线的聚苯乙烯换算值。数均分子量为5000以下时，固化后难以获得良好的机械性能，特别是伸长率有降低的倾向。另一方面，当它超过100000时，粘度变得太高，使树脂难以形成。The number average molecular weight of the formula (I) is from 5,000 to 100,000, preferably from 10,000 to 60,000, and more preferably from 20,000 to 40,000. The number average molecular weight is a polystyrene-converted value based on a calibration curve prepared by a gel permeation chromatography (GPC) apparatus using standard polystyrene. When the number average molecular weight is 5,000 or less, it is difficult to obtain good mechanical properties after curing, and in particular, the elongation tends to be lowered. On the other hand, when it exceeds 100,000, the viscosity becomes too high, making it difficult to form a resin.
Ar 1是来自二酸酐的成分，所述二酸酐可包含芳香族酸酐和脂肪族酸酐，芳香族酸酐包括只含苯环的芳香族酸酐、氟化芳香族酸酐、含酰胺基的芳香族酸酐、含酯基的芳香族酸酐、含醚基的芳香族酸酐、含硫基的芳香族酸酐、含砜基的芳香族酸酐及含羰基的芳香族酸酐等。 Ar 1 is a component derived from a dianhydride, and the dianhydride may include an aromatic acid anhydride and an aliphatic acid anhydride, and the aromatic acid anhydride includes an aromatic acid anhydride containing only a benzene ring, a fluorinated aromatic acid anhydride, an amide group-containing aromatic acid anhydride, An ester group-containing aromatic acid anhydride, an ether group-containing aromatic acid anhydride, a sulfur group-containing aromatic acid anhydride, a sulfone group-containing aromatic acid anhydride, a carbonyl group-containing aromatic acid anhydride, and the like.
只含苯环的芳香族酸酐例如可以举出均苯四甲酸酐(PMDA)、2,3,3',4'-联苯四甲酸二酐(aBPDA)、3,3'，4,4'-联苯四羧酸二酐(sBPDA)、4-(2,5-二氧代四氢呋喃-3-基)-1,2,3,4-四氢萘-1,2-二甲酸酐(TDA)等；氟化芳香族酸酐例如简称6FDA的4,4'-(六氟异丙烯)二酞酸酐；含酰胺基的芳香族酸酐包括N，N'-(5,5'-(全氟丙基-2,2-二基)双(2-羟基-5,1-亚苯基))双(1,3-二氧代-1,3-二氢异苯并呋喃)-5-甲酰胺)(6FAP-ATA)、N,N'-(9H-芴-9-亚基二-4,1-亚苯基)二[1,3-二氢-1,3-二氧代-5-异苯并呋喃甲酰胺](FDA-ATA)等；含酯基的芳香族酸酐包 括对苯基二(偏苯三酸酯)二酸酐(TAHQ)等；含醚基的芳香族酸酐包括4,4'-(4,4'-异丙基二苯氧基)双(邻苯二甲酸酐)(BPADA)、4,4'-氧双邻苯二甲酸酐(sODPA)、2,3,3',4'-二苯醚四甲酸二酐(aODPA)、4,4'-(4,4'-异丙基二苯氧基)双(邻苯二甲酸酐)(BPADA)等；含硫基的芳香族酸酐包括4,4'-双(邻苯二甲酸酐)硫化物(TPDA)等；含砜基的芳香族酸酐包括3,3',4,4'-二苯基砜四羧酸二酸酐(DSDA)等；含羰基的芳香族酸酐包括3,3',4,4'-二苯酮四酸二酐(BTDA)等。Examples of the aromatic acid anhydride containing only a benzene ring include pyromellitic anhydride (PMDA), 2,3,3',4'-biphenyltetracarboxylic dianhydride (aBPDA), and 3,3',4,4'. -biphenyltetracarboxylic dianhydride (sBPDA), 4-(2,5-dioxotetrahydrofuran-3-yl)-1,2,3,4-tetrahydronaphthalene-1,2-dicarboxylic anhydride (TDA Fluorinated aromatic acid anhydride such as 4FDA 4,4'-(hexafluoroisopropene) dicarboxylic anhydride; amide group-containing aromatic acid anhydride including N,N'-(5,5'-(perfluoropropane Benzyl-2,2-diyl)bis(2-hydroxy-5,1-phenylene))bis(1,3-dioxo-1,3-dihydroisobenzofuran)-5-carboxamide (6FAP-ATA), N,N'-(9H-芴-9-ylidene-2,1-phenylene)bis[1,3-dihydro-1,3-dioxo-5- Isobenzofurancarboxamide] (FDA-ATA) or the like; an aromatic acid anhydride containing an ester group includes p-phenylbis(trimellitic acid ester) dianhydride (TAHQ) or the like; and an ether anhydride-containing aromatic acid anhydride includes 4, 4'-(4,4'-isopropyldiphenoxy) bis(phthalic anhydride) (BPADA), 4,4'-oxydiphthalic anhydride (sODPA), 2,3,3 ',4'-diphenyl ether tetracarboxylic dianhydride (aODPA), 4,4'-(4,4'-isopropyldiphenoxy) bis(phthalic anhydride) (BPADA), etc.; sulfur Aromatic anhydrides include 4,4'-bis(phthalic anhydride) sulfur (TPDA) or the like; a sulfone group-containing aromatic acid anhydride including 3,3',4,4'-diphenylsulfone tetracarboxylic acid dianhydride (DSDA) or the like; a carbonyl group-containing aromatic acid anhydride including 3,3', 4,4'-benzophenonetetracarboxylic dianhydride (BTDA) and the like.
脂环族酸酐包括简称HPMDA的1,2,4,5-环己烷四甲酸二酐、1,2,3,4-丁烷四羧酸二酐(BDA)、四氢-1H-5,9-甲烷吡喃并[3,4-d]恶英-1,3,6,8(4H)-四酮(TCA)、六氢-4,8-亚乙基-1H，3H-苯并[1,2-C：4,5-C']二呋喃-1,3,5,7-四酮(BODA)、环丁烷四甲酸二酐(CBDA)、1,2,3,4-环戊四羧酸二酐(CpDA)等，或是具有烯烃结构的脂环族酸酐，如双环[2.2.2]辛-7-烯-2,3,5,6-四羧酸二酐(COeDA)。若使用具有乙炔基的酸酐如4,4'-(乙炔-1,2-二基)二酞酸酐(EBPA)，可进一步地通过后硬化来确保光转换层的机械强度。The alicyclic acid anhydride includes 1,2,4,5-cyclohexanetetracarboxylic dianhydride, 1,2,3,4-butanetetracarboxylic dianhydride (BDA), tetrahydro-1H-5, which is abbreviated as HPMDA, 9-methanepyrano[3,4-d]oxin-1,3,6,8(4H)-tetraone (TCA), hexahydro-4,8-ethylene-1H,3H-benzo [1,2-C:4,5-C']difuran-1,3,5,7-tetraone (BODA), cyclobutane tetracarboxylic dianhydride (CBDA), 1,2,3,4- Cyclopentanetetracarboxylic dianhydride (CpDA) or the like, or an alicyclic acid anhydride having an olefin structure, such as bicyclo [2.2.2] oct-7-ene-2,3,5,6-tetracarboxylic dianhydride ( COeDA). If an acid anhydride having an ethynyl group such as 4,4'-(acetylene-1,2-diyl)diphthalic anhydride (EBPA) is used, the mechanical strength of the light conversion layer can be further ensured by post-hardening.
从溶解性的角度考虑，优选4,4'-氧双邻苯二甲酸酐(sODPA)、3,3',4,4'-二苯酮四酸二酐(BTDA)、环丁烷四甲酸二酐(CBDA)、4,4'-(六氟异丙烯)二酞酸酐(6FDA)。上述二酸酐可以单独使用或两种以上组合使用。From the viewpoint of solubility, 4,4'-oxydiphthalic anhydride (sODPA), 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA), cyclobutanetetracarboxylic acid is preferred. Dihydride (CBDA), 4,4'-(hexafluoroisopropene) diacetic anhydride (6FDA). The above dianhydrides may be used singly or in combination of two or more.
Ar 2是来自二胺的成分，所述二胺可分为芳香族二胺和脂肪族二胺，芳香族二胺包括只含苯环结构的芳香族二胺、氟化芳香族二胺、含酯基的芳香族二胺、含醚基的芳香族二胺、含酰胺基的芳香族二胺、含羰基的芳香族二胺、含羟基的芳香族二胺、含羧基的芳香族二胺、含砜基的芳香族二胺、含硫基的芳香族二胺等。 Ar 2 is a component derived from a diamine which can be classified into an aromatic diamine and an aliphatic diamine, and the aromatic diamine includes an aromatic diamine having only a benzene ring structure, a fluorinated aromatic diamine, and the like. An ester group aromatic diamine, an ether group-containing aromatic diamine, an amide group-containing aromatic diamine, a carbonyl group-containing aromatic diamine, a hydroxyl group-containing aromatic diamine, a carboxyl group-containing aromatic diamine, A sulfone group-containing aromatic diamine, a sulfur-containing aromatic diamine, and the like.
只含苯环结构的芳香族二胺包括间苯二胺、对苯二胺、2,4-二氨基甲苯、2,6-二氨基-3,5-二乙基甲苯、4,4'-二氨基-3,3'-二甲基联苯、9,9-双(4-氨基苯基)芴(FDA)、9,9-二(4-氨基-3-甲苯基)芴、2,2-双(4-氨基苯基)丙烷、2,2-双(3-甲基-4-氨基苯基)丙烷、4,4'-二氨基-2,2'-二甲基联苯(APB)；氟化芳香族二胺包括2,2'-二(三氟甲基)二氨基联苯(TFMB)、2,2-双(4-氨基苯基)六氟丙烷(6FDAM)、2,2-双[4-(4-氨基苯氧基)苯基]六氟丙烷(HFBAPP)、2,2-双(3-氨基-4-甲苯基)六氟丙烷等)(BIS-AF-AF)等；含酯基的芳香族二胺包括[4-(4-氨基苯甲酰基)氧基苯基]-4-氨基苯甲酸酯(ABHQ)、对苯二甲酸二对氨基苯酯(BPTP)、对氨基苯甲酸对氨基苯酯(APAB)等；含醚基的芳香族二胺包括2,2-双[4-(4-氨基苯氧基)苯基]丙烷)(BAPP)、2,2'-双[4-(4-氨基苯氧基苯基)]丙烷(ET-BDM)、2,7-双(4-氨基苯氧基)-萘(ET-2,7-Na)、1,3-双(3-氨基苯氧基)苯(TPE-M)、4,4'-[1,4-苯基双(氧)]双[3-(三氟甲基)苯胺](p-6FAPB)、3,4'-二氨基二苯醚、4,4'-二氨基二苯醚(ODA)、1,3-双(4-氨基苯氧基)苯(TPE-R)、1,4-双(4-氨基苯氧基)苯(TPE-Q)、4,4'-双(4-氨基苯氧基)联苯(BAPB)等；含酰胺基的芳香族二胺包括N，N'-双(4-氨基苯基)苯-1,4-二甲酰胺(BPTPA)、3,4'-二氨基苯酰替苯胺(m-APABA)、4,4'-二氨基苯酰替苯胺(DABA)等；含羰基的芳香族二胺包括4,4'-二氨基二苯甲酮(4,4'-DABP)、双(4-氨基-3-羧基苯基)甲烷(或称为6,6'-双氨基-3,3'-甲叉基二苯甲酸)等；含羟基的芳香族二胺包括3,3'-二羟基联苯胺(HAB)、2,2-双(3-氨基-4-羟基苯基)六氟丙烷(6FAP)等；含羧基的芳香族二胺包括6,6'-双氨基-3,3'-甲叉基二苯甲酸(MBAA)、3,5-二氨基苯甲酸(DBA) 等；含砜基的芳香族二胺包括3,3'-二氨基二苯砜(DDS)、4,4'-二氨基二苯砜、双[4-(4-氨基苯氧基)苯基]砜(BAPS)(或称为4,4'-双(4-氨基苯氧基)二苯砜)、3,3'-二氨基-4,4'-二羟基二苯砜(ABPS)；含硫基的芳香族二胺包括4,4'-二氨基二苯硫醚。The aromatic diamine having only a benzene ring structure includes m-phenylenediamine, p-phenylenediamine, 2,4-diaminotoluene, 2,6-diamino-3,5-diethyltoluene, 4,4'- Diamino-3,3'-dimethylbiphenyl, 9,9-bis(4-aminophenyl)indole (FDA), 9,9-bis(4-amino-3-methylphenyl)anthracene, 2, 2-bis(4-aminophenyl)propane, 2,2-bis(3-methyl-4-aminophenyl)propane, 4,4'-diamino-2,2'-dimethylbiphenyl ( APB); fluorinated aromatic diamines include 2,2'-bis(trifluoromethyl)diaminobiphenyl (TFMB), 2,2-bis(4-aminophenyl)hexafluoropropane (6FDAM), 2 ,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane (HFBAPP), 2,2-bis(3-amino-4-methylphenyl)hexafluoropropane, etc.) (BIS-AF- AF), etc.; ester-containing aromatic diamines include [4-(4-aminobenzoyl)oxyphenyl]-4-aminobenzoate (ABHQ), di-p-aminophenyl terephthalate (BPTP), p-aminophenyl p-aminobenzoate (APAB), etc.; ether-containing aromatic diamines including 2,2-bis[4-(4-aminophenoxy)phenyl]propane) (BAPP) , 2,2'-bis[4-(4-aminophenoxyphenyl)]propane (ET-BDM), 2,7-bis(4-aminophenoxy)-naphthalene (ET-2,7- Na), 1,3-bis(3-aminophenoxy)benzene (TPE-M) 4,4'-[1,4-phenylbis(oxy)]bis[3-(trifluoromethyl)aniline](p-6FAPB), 3,4'-diaminodiphenyl ether, 4,4' -diaminodiphenyl ether (ODA), 1,3-bis(4-aminophenoxy)benzene (TPE-R), 1,4-bis(4-aminophenoxy)benzene (TPE-Q), 4,4'-bis(4-aminophenoxy)biphenyl (BAPB) or the like; the amide group-containing aromatic diamine includes N,N'-bis(4-aminophenyl)benzene-1,4-di Formamide (BPTPA), 3,4'-diaminobenzophenidine (m-APABA), 4,4'-diaminobenzophenidine (DABA), etc.; carbonyl-containing aromatic diamines including 4,4 '-Diaminobenzophenone (4,4'-DABP), bis(4-amino-3-carboxyphenyl)methane (or 6,6'-bisamino-3,3'-methylidene) Dibenzoic acid), etc.; hydroxyl-containing aromatic diamines include 3,3'-dihydroxybenzidine (HAB), 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (6FAP), etc. The carboxyl group-containing aromatic diamine includes 6,6'-bisamino-3,3'-methylenedibenzoic acid (MBAA), 3,5-diaminobenzoic acid (DBA), etc.; Group diamines include 3,3'-diaminodiphenyl sulfone (DDS), 4,4'-diaminodiphenyl sulfone, bis[4-(4-aminophenoxy)phenyl] sulfone (BAPS) (or Known as 4,4'-bis(4-aminophenoxy)diphenyl sulfone) 3,3'-diamino-4,4'-dihydroxydiphenyl sulfone (ABPS); the sulfur-containing aromatic diamine includes 4,4'-diaminodiphenyl sulfide.
脂肪族二胺为不含芳香族结构(如苯环)的二胺，脂环族二胺包括单环脂环式二胺、直链型脂肪族二胺，直链型脂肪族二胺包括硅氧型二胺、直链烷基二胺、含醚基的直链脂肪族二胺，单环脂环式二胺包括4,4'-二氨基二环己基甲烷(PACM)、3,3-二甲基-4,4-二氨基二环己基甲烷(DMDC)；硅氧型二胺(或称为氨基改性有机硅)包括α，ω-(3-氨基丙基)聚硅氧烷(KF8010)，X22-161A、X22-161B、NH15D、1,3-双(3-氨基丙基)-1,1,3,3-四甲基二硅氧烷(PAME)等；直链烷基二胺的碳原子个数为6～12，优选无取代基的直链烷基二胺；含醚基的直链脂肪族二胺包括乙二醇二(3-氨丙基)醚等。The aliphatic diamine is a diamine having no aromatic structure (such as a benzene ring), the alicyclic diamine includes a monocyclic alicyclic diamine, a linear aliphatic diamine, and the linear aliphatic diamine includes silicon. Oxydiamine, linear alkyl diamine, linear aliphatic diamine containing ether group, monocyclic alicyclic diamine including 4,4'-diaminodicyclohexylmethane (PACM), 3,3- Dimethyl-4,4-diaminodicyclohexylmethane (DMDC); siloxane diamine (or amino-modified silicone) including α,ω-(3-aminopropyl)polysiloxane ( KF8010), X22-161A, X22-161B, NH15D, 1,3-bis(3-aminopropyl)-1,1,3,3-tetramethyldisiloxane (PAME), etc.; linear alkyl group The diamine has a carbon atom number of 6 to 12, preferably a substituent-free linear alkyl diamine; and an ether group-containing linear aliphatic diamine includes ethylene glycol bis(3-aminopropyl) ether.
二胺还可选用含有芴基的二胺，芴基具有庞大的自由体积和刚性稠环结构，能使聚酰亚胺具有良好的耐热、热氧化稳定性、机械性能、光学透明性及在有机溶剂中具有良好的溶解性，含有芴基的二胺，比如9,9-双(3,5-二氟-4-胺基苯基)芴，其可由9-芴酮和2,6-二氯苯胺反应得到。氟化二胺还可选用1,4-双(3’-氨基-5’-三氟甲基苯氧基)联苯，此二胺为具有刚性联苯结构的间位取代含氟二胺，间位取代结构可以阻碍沿着分子链方向的电荷流动，减少分子间共轭作用，从而减少可见光对光的吸收，选用不对称结构的二胺或酸酐在一定程度上会提高有机硅改性聚酰亚胺树脂组合物的透明性。上述二胺可以单独使用或者两种以上组合使用。The diamine may also be a diamine containing a mercapto group having a bulky free volume and a rigid fused ring structure, which enables the polyimide to have good heat resistance, thermal oxidation stability, mechanical properties, optical transparency, and Good solubility in organic solvents, thiol-containing diamines, such as 9,9-bis(3,5-difluoro-4-aminophenyl)anthracene, which can be derived from 9-fluorenone and 2,6- Dichloroaniline is obtained by reaction. The fluorinated diamine may also be selected from 1,4-bis(3'-amino-5'-trifluoromethylphenoxy)biphenyl, which is a meta-substituted fluorine-containing diamine having a rigid biphenyl structure. The meta-substitution structure can block the charge flow along the molecular chain direction, reduce the intermolecular conjugation, and thus reduce the absorption of light by visible light. The choice of asymmetric structure of diamine or acid anhydride will improve the silicone modified polycondensation to some extent. The transparency of the imide resin composition. The above diamines may be used singly or in combination of two or more.
具有活性氢的二胺的实例包括含羟基的二胺如3,3'-二氨基-4,4'-二羟基联苯、4,4'-二氨基-3,3'-二羟基-1,1'-联苯(或称为3,3'-二羟基联苯胺)(HAB)、2,2-双(3-氨基-4-羟基苯基)丙烷(BAP)、2,2-双(3-氨基-4-羟基苯基)六氟丙烷(6FAP)、1,3-双(3-羟基-4-氨基苯氧基)苯、1,4-双(3-羟基-4-氨基苯基)苯、3,3'-二氨基-4,4'-二羟基二苯基砜(ABPS)可以列举，作为具有羧基的二胺如3,5-二氨基苯甲酸、双(4-氨基-3-羧基苯基)甲烷(或称为6,6'-双氨基-3,3'-甲叉基二苯甲酸)、3,5-双(4-氨基苯氧基)苯甲酸，1,3-双(4-氨基-2-羧基苯氧基)苯。具有氨基的二胺，例如4,4'-二氨基苯酰替苯胺(DABA)、2-(4-氨基苯基)-5-氨基苯并咪唑、二亚乙基三胺，3,3'-二氨基二丙胺、三亚乙基四胺、N，N'-双(3-氨基丙基)乙二胺(或称为N,N-二(3-氨丙基)乙基乙胺)等。含硫醇基的二胺，例如3,4-二氨基苯硫醇。上述二胺可以单独使用或者两种以上组合使用。Examples of the diamine having an active hydrogen include a hydroxyl group-containing diamine such as 3,3'-diamino-4,4'-dihydroxybiphenyl, 4,4'-diamino-3,3'-dihydroxy-1. , 1'-biphenyl (or 3,3'-dihydroxybenzidine) (HAB), 2,2-bis(3-amino-4-hydroxyphenyl)propane (BAP), 2,2-double (3-Amino-4-hydroxyphenyl)hexafluoropropane (6FAP), 1,3-bis(3-hydroxy-4-aminophenoxy)benzene, 1,4-bis(3-hydroxy-4-amino) Phenyl)benzene, 3,3'-diamino-4,4'-dihydroxydiphenyl sulfone (ABPS) can be exemplified as a diamine having a carboxyl group such as 3,5-diaminobenzoic acid, bis(4- Amino-3-carboxyphenyl)methane (or 6,6'-bisamino-3,3'-methylenedibenzoic acid), 3,5-bis(4-aminophenoxy)benzoic acid, 1,3-bis(4-amino-2-carboxyphenoxy)benzene. A diamine having an amino group, such as 4,4'-diaminobenzoanilide (DABA), 2-(4-aminophenyl)-5-aminobenzimidazole, diethylenetriamine, 3,3' -diaminodipropylamine, triethylenetetramine, N,N'-bis(3-aminopropyl)ethylenediamine (or N,N-bis(3-aminopropyl)ethylethylamine), etc. . A thiol group-containing diamine such as 3,4-diaminobenzenethiol. The above diamines may be used singly or in combination of two or more.
有机硅改性聚酰亚胺可以通过公知的合成方法合成。二酸酐和二胺可以在催化剂存在下通过将它们溶解在有机溶剂中进行酰亚胺化来制备，催化剂的实例包括乙酸酐/三乙胺型，戊内酯/吡啶型等，优选的是，酰亚胺化反应中共沸过程产生的水，使用脱水剂(如甲苯)促进水的脱除。The silicone-modified polyimide can be synthesized by a known synthesis method. The dianhydride and the diamine can be produced by imidating by dissolving them in an organic solvent in the presence of a catalyst, and examples of the catalyst include acetic anhydride/triethylamine type, valerolactone/pyridine type, etc., preferably, The water produced by the azeotropic process in the imidization reaction uses a dehydrating agent such as toluene to promote the removal of water.
也可以将酸酐与二胺进行平衡反应得到聚酰胺酸，然后再经过加热脱水得到聚酰亚胺，在其它实施例中，在聚酰亚胺的主链上可具有一小部分酰胺酸，例如聚酰亚胺分子中酰胺酸与酰亚胺的比值为1～3:100，酰胺酸与环氧树脂之间具有相互作用力，从而使基材具有 较优的性能。在其它实施例中，也可在聚酰胺酸的状态下加入固态物质(如热固化剂、无机散热粒子与荧光粉)得到基材。此外，也可利用脂环族酸酐与二胺直接加热脱水的方式来得到溶液化聚酰亚胺，以此溶液化聚酰亚胺作为胶材材料，透光性佳，且本身即为液态，因此可使其它固态物质(例如无机散热粒子与荧光粉)能够更充分地分散在胶材中。It is also possible to carry out an equilibrium reaction of the acid anhydride with the diamine to obtain a polyamic acid, which is then heated and dehydrated to obtain a polyimide. In other embodiments, a small portion of the amic acid may be present in the main chain of the polyimide, for example. The ratio of amic acid to imide in the polyimide molecule is from 1 to 3:100, and the amic acid and the epoxy resin have an interaction force, so that the substrate has superior performance. In other embodiments, a solid substance (such as a heat curing agent, inorganic heat dissipating particles, and a phosphor) may be added in the state of a polyamic acid to obtain a substrate. In addition, the alicyclic acid anhydride and the diamine can be directly heated and dehydrated to obtain a solutionized polyimide, thereby dissolving the polyimide as a rubber material, having good light transmittance and being liquid in itself. Therefore, other solid substances (for example, inorganic heat dissipating particles and phosphors) can be more fully dispersed in the rubber material.
于一实施例，制备有机硅改性聚酰亚胺时，可将二胺与酸酐加热脱水后得到的聚酰亚胺与硅氧型二胺溶于溶剂中制成有机硅改性聚酰亚胺。于另一实施例中则是在得到聚酰亚胺前的酰胺酸(amic-acid)状态下即与硅氧型二胺进行反应。In one embodiment, when preparing the silicone-modified polyimide, the polyimide and the siloxane-type diamine obtained by heating and dehydrating the diamine and the anhydride are dissolved in a solvent to prepare a silicone-modified polyimide. amine. In another embodiment, the reaction is carried out with an siloxane-type diamine in the amic-acid state before the polyimide is obtained.
此外也可使用酸酐及二胺，使其脱水闭环并且缩聚的酰亚胺化合物，例如分子量比为1:1的酸酐与二胺。于一实施例中使用200毫摩尔(mmol)的4,4'-(六氟异丙烯)二酞酸酐(6FDA)、20毫摩尔(mmol)的2,2-双(3-氨基-4-羟基苯基)六氟丙烷(6FAP)、50毫摩尔(mmol)的2,2'-二(三氟甲基)二氨基联苯(TFMB)、130毫摩尔(mmol)的氨基丙基封端的聚(二甲基硅氧烷)，以得到PI合成溶液。Further, an acid anhydride and a diamine may be used to dehydrate the ring-closing and polycondensed imide compound, for example, an acid anhydride having a molecular weight ratio of 1:1 and a diamine. In one embodiment 200 mmol (mmol) of 4,4'-(hexafluoroisopropene) diacetic anhydride (6FDA), 20 mmol (mmol) of 2,2-bis(3-amino-4-) was used. Hydroxyphenyl)hexafluoropropane (6FAP), 50 mmol (mmol) of 2,2'-bis(trifluoromethyl)diaminobiphenyl (TFMB), 130 mmol (mmol) of aminopropyl terminated Poly(dimethylsiloxane) to obtain a PI synthesis solution.
通过上述方法可得到端基为氨基的聚酰亚胺化合物，但亦可使用以其他方式来制成以羧基为端基的聚酰亚胺化合物。此外，上述酸酐及二胺的反应中，酸酐主链上含有碳碳三键时，碳碳三键的结合力可加强其分子结构；或是采用含有乙烯基硅氧烷结构的二胺。A polyimide compound having an amino group as a terminal group can be obtained by the above method, but a polyimide compound having a carboxyl group as a terminal group can also be used in another manner. Further, in the reaction of the above acid anhydride and diamine, when the main chain of the acid anhydride contains a carbon-carbon triple bond, the binding force of the carbon-carbon triple bond can enhance the molecular structure thereof; or a diamine containing a vinylsiloxane structure can be used.
二酸酐与二胺的摩尔比为1:1。其中含有活泼氢官能团的二胺占整个二胺的摩尔分数为5～25％。合成聚酰亚胺的反应温度优选为80～250℃，更优选为100～200℃，反应时间可以根据批量的大小调节，比如得到10～30g聚酰亚胺的反应时间为6～10小时。The molar ratio of dianhydride to diamine is 1:1. The diamine containing an active hydrogen functional group accounts for 5 to 25% by mole of the entire diamine. The reaction temperature for synthesizing the polyimide is preferably from 80 to 250 ° C, more preferably from 100 to 200 ° C, and the reaction time can be adjusted according to the size of the batch, for example, a reaction time of obtaining 10 to 30 g of the polyimide is 6 to 10 hours.
有机硅改性聚酰亚胺可区分为氟化芳香族有机硅改性聚酰亚胺和脂肪族有机硅改性聚酰亚胺两个种类。氟化芳香族有机硅改性聚酰亚胺是由硅氧型二胺、含有氟(F)基团的芳香族二胺(或称为F化芳香族二胺)与含有氟(F)基团的芳香族二酸酐(或称为F化芳香族酸酐)合成；脂肪族有机硅改性聚酰亚胺是由二酸酐、硅氧型二胺和至少一种不含芳香族结构(如苯环)的二胺(或称为脂肪族二胺)合成，或二胺(其中一种二胺为硅氧型二胺)和至少一种不含芳香族结构(如苯环)的二酸酐(或称为脂肪族酸酐)合成，脂肪族有机硅改性聚酰亚胺包括半脂肪族有机硅改性聚酰亚胺和全脂肪族有机硅改性聚酰亚胺，全脂肪族有机硅改性聚酰亚胺由至少一种脂肪族二酸酐、硅氧型二胺和至少一种脂肪族二胺合成；合成半脂肪族有机硅改性聚酰亚胺的原料中至少有一种脂肪族二酸酐或脂肪族二胺。合成有机硅改性聚酰亚胺所需的原料与有机硅改性聚酰亚胺的硅氧含量会对基材的透过率、变色性能、机械性能、翘曲程度及折射率均具有一定影响。The silicone-modified polyimide can be classified into two types: a fluorinated aromatic silicone-modified polyimide and an aliphatic silicone-modified polyimide. The fluorinated aromatic silicone-modified polyimide is composed of a siloxane-type diamine, an aromatic diamine containing fluorine (F) groups (or a F-aromatic aromatic diamine), and a fluorine-containing (F) group. The aromatic dianhydride (or F-aromatic anhydride) is synthesized; the aliphatic silicone-modified polyimide is composed of a dianhydride, a siloxane-type diamine and at least one aromatic-free structure (such as benzene). a diamine (or an aliphatic diamine) synthesized, or a diamine (one of which is a siloxane diamine) and at least one dianhydride containing no aromatic structure (such as a benzene ring) Or aliphatic acid anhydride synthesis, aliphatic silicone modified polyimide including semi-aliphatic silicone modified polyimide and fully aliphatic silicone modified polyimide, all aliphatic silicone modified The polyimide is synthesized from at least one aliphatic dianhydride, a silicon oxydiamine, and at least one aliphatic diamine; at least one aliphatic second of the raw material for synthesizing the semi-aliphatic silicone-modified polyimide An acid anhydride or an aliphatic diamine. The raw material required for the synthesis of the silicone-modified polyimide and the silicon-oxygen content of the silicone-modified polyimide have a certain degree of transmittance, discoloration performance, mechanical properties, warpage and refractive index of the substrate. influences.
本发明的有机硅改性聚酰亚胺的硅氧烷含量为20～75wt％，优选30～70wt％，玻璃化转变温度为150℃以下，玻璃化转变温度(Tg)的测试条件为使用株式会社岛津制作所制TMA-60测定在有机硅改性聚酰亚胺中加入热固化剂后的玻璃转变温度，测试条件：负荷：5克；升温速度：10℃/min；测量气氛：氮气氛；氮气流速：20毫升/分钟；测量温度范围：-40至300℃。当硅氧烷含量小于20％，由有机硅改性聚酰亚胺树脂组合物制成的膜可能会因荧光粉和导热性填料的填充变得非常硬且脆，同时在干燥固化后产生翘曲，加工性较低；另外， 耐热变色性降低；而当硅氧烷含量大于75％，由有机硅改性聚酰亚胺树脂组合物制成的膜变得浑浊，透光性降低，膜的拉伸强度降低。本发明中硅氧烷的含量为硅氧型二胺(结构式如式(A)所示)与有机硅改性聚酰亚胺的重量比，有机硅改性聚酰亚胺的重量为合成有机硅改性聚酰亚胺所用的二胺与二酸酐重量之和减去合成过程中产生的水的重量。The silicone-modified polyimide of the present invention has a siloxane content of 20 to 75 wt%, preferably 30 to 70 wt%, a glass transition temperature of 150 ° C or less, and a glass transition temperature (Tg) test condition: TMA-60 manufactured by Shimadzu Shimadzu Corporation measured the glass transition temperature after adding a thermosetting agent to the silicone-modified polyimide. Test conditions: load: 5 g; heating rate: 10 ° C/min; measurement atmosphere: nitrogen Atmosphere; nitrogen flow rate: 20 ml/min; measured temperature range: -40 to 300 °C. When the siloxane content is less than 20%, a film made of a silicone-modified polyimide resin composition may become very hard and brittle due to filling of the phosphor and the thermally conductive filler, and may be warped after drying and solidification. The film has low workability; in addition, the heat discoloration property is lowered; and when the siloxane content is more than 75%, the film made of the silicone-modified polyimide resin composition becomes cloudy and the light transmittance is lowered. The tensile strength of the film is lowered. The content of the siloxane in the present invention is the weight ratio of the silicone-oxygen diamine (the structural formula is represented by the formula (A)) to the silicone-modified polyimide, and the weight of the silicone-modified polyimide is synthetic organic. The sum of the weight of the diamine and the dianhydride used in the silicon-modified polyimide minus the weight of water produced during the synthesis.
Figure PCTCN2018123817-appb-000003
Figure PCTCN2018123817-appb-000003
式(A)中R选自甲基或苯基；R优选为甲基，n为1～5，优选1,2,3,5。In the formula (A), R is selected from a methyl group or a phenyl group; R is preferably a methyl group, and n is from 1 to 5, preferably 1, 2, 3, 5.
合成有机硅改性聚酰亚胺时所需要的有机溶剂只要能够溶解有机硅改性聚酰亚胺且确保与要添加的荧光粉或填料具有亲和性(润湿性)即可，但避免产物中残留较多的溶剂，一般溶剂的摩尔数与二胺和酸酐生成的水的摩尔数相等，例如1mol二胺与1mol酸酐生成的水为1mol,则溶剂的用量为1mol。此外，所选用的有机溶剂在标准大气压下的沸点为80℃以上且小于300℃，更优选为120℃以上且小于250℃。因为涂布后需要在低温下干燥和固化，如果温度低于120℃，则在涂布工艺实施的过程中，可能因为干燥的速度太快而无法很好地涂布。如果选用的有机溶剂沸点温度高于250℃时，低温下的干燥可能会延迟。具体而言，有机溶剂为醚类有机溶剂、酯类有机溶剂、二甲醚类、酮类有机溶剂、醇类有机溶剂、芳香烃类溶剂或其它。醚类有机溶剂包括乙二醇单甲醚、乙二醇单乙醚、丙二醇单甲醚、丙二醇单乙醚、乙二醇二甲醚、乙二醇二乙醚、乙二醇二丁基醚(或称为乙二醇二丁醚)、二甘醇二甲醚、二甘醇二乙醚、二乙二醇甲基乙基醚(或称为二乙二醇甲乙醚)、二丙二醇二甲醚或二甘醇二丁基醚(二甘醇二丁醚)、二乙二醇丁基甲醚；酯类有机溶剂包括乙酸酯类，乙酸酯类包括乙二醇单乙醚乙酸酯、二乙二醇单丁醚乙酸酯、丙二醇单甲醚乙酸酯、乙酸丙酯、丙二醇二乙酸酯、乙酸丁酯、乙酸异丁酯、3-甲氧基丁基乙酸酯、3-甲基-3-甲氧基丁基乙酸酯、乙酸苄酯或丁基卡必醇乙酸酯，酯类溶剂还可为乳酸甲酯、乳酸乙酯、丁酯、苯甲酸甲酯或苯甲酸乙酯；二甲醚类溶剂包括三甘醇二甲醚或四甘醇二甲醚；酮类溶剂包括乙酰丙酮、甲基丙基酮、甲基丁基酮、甲基异丁基酮、环戊酮、乙酰丙酮、甲基丙基酮、甲基丁基酮、甲基异丁基酮、环戊酮或2-庚酮；醇类溶剂包括丁醇、异丁醇、戊醇、4-甲基-2-戊醇、3-甲基-2-丁醇、3-甲基-3-甲氧基丁醇或双丙酮醇；芳香烃类溶剂包括甲苯或二甲苯；其它溶剂包括γ-丁内酯、N-甲基吡咯烷酮、N，N-二甲基甲酰胺、N，N-二甲基乙酰胺或二甲基亚砜。The organic solvent required for synthesizing the silicone-modified polyimide can dissolve the silicone-modified polyimide and ensure affinity (wettability) with the phosphor or filler to be added, but avoid A large amount of solvent remains in the product, and the number of moles of the solvent is generally equal to the number of moles of water produced by the diamine and the acid anhydride. For example, 1 mol of water produced by 1 mol of the diamine and 1 mol of the acid anhydride is 1 mol, and the solvent is used in an amount of 1 mol. Further, the organic solvent selected has a boiling point of 80 ° C or more and less than 300 ° C at a standard atmospheric pressure, more preferably 120 ° C or more and less than 250 ° C. Since it is required to dry and solidify at a low temperature after coating, if the temperature is lower than 120 ° C, it may not be well coated because the drying speed is too fast during the coating process. If the boiling temperature of the organic solvent selected is higher than 250 ° C, drying at low temperatures may be delayed. Specifically, the organic solvent is an ether organic solvent, an ester organic solvent, a dimethyl ether, a ketone organic solvent, an alcohol organic solvent, an aromatic hydrocarbon solvent or the like. The ether organic solvent includes ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol dibutyl ether (or Ethylene glycol dibutyl ether), diglyme, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether (or diethylene glycol methyl ether), dipropylene glycol dimethyl ether or two Glycol dibutyl ether (diethylene glycol dibutyl ether), diethylene glycol butyl methyl ether; ester organic solvents include acetates, acetates including ethylene glycol monoethyl ether acetate, diethylene glycol monobutyl Ether acetate, propylene glycol monomethyl ether acetate, propyl acetate, propylene glycol diacetate, butyl acetate, isobutyl acetate, 3-methoxybutyl acetate, 3-methyl-3- Methoxybutyl acetate, benzyl acetate or butyl carbitol acetate, the ester solvent may also be methyl lactate, ethyl lactate, butyl ester, methyl benzoate or ethyl benzoate; The methyl ether solvent includes triethylene glycol dimethyl ether or tetraglyme dimethyl ether; the ketone solvent includes acetylacetone, methyl propyl ketone, methyl butyl ketone, methyl isobutyl ketone, cyclopentanone, and B. Acetylacetone, methylpropyl ketone, methyl butyl ketone, methyl isobutyl ketone, cyclopentanone or 2-heptanone; alcohol solvents include butanol, isobutanol, pentanol, 4-methyl- 2-pentanol, 3-methyl-2-butanol, 3-methyl-3-methoxybutanol or diacetone alcohol; aromatic hydrocarbon solvents including toluene or xylene; other solvents including γ-butyrolactone , N-methylpyrrolidone, N,N-dimethylformamide, N,N-dimethylacetamide or dimethyl sulfoxide.
本发明提供一种有机硅改性聚酰亚胺树脂组合物，包括上述有机硅改性聚酰亚胺和热固化剂，热固化剂为环氧树脂、异氰酸酯或双恶唑啉化合物。在一实施例中，以有机硅改性聚酰亚胺的重量为基准，热固化剂的用量为有机硅改性聚酰亚胺的重量的5～12％。有机 硅改性聚酰亚胺组树脂合物中还可以进一步包括散热粒子和荧光粉。The present invention provides a silicone-modified polyimide resin composition comprising the above-described silicone-modified polyimide and a heat curing agent, wherein the heat curing agent is an epoxy resin, an isocyanate or a bisoxazoline compound. In one embodiment, the amount of the thermosetting agent is from 5 to 12% by weight based on the weight of the silicone-modified polyimide. The heat-dissipating particles and the phosphor may further be included in the silicone-modified polyimide group resin composition.
光透过率Light transmittance
影响有机硅改性聚酰亚胺树脂组合物透光率的因素至少为主材料种类、改性剂(热固化剂)种类、散热粒子种类及含量以及硅氧烷含量。光透过率是指在LED芯片主发光波长段附近的光的通过率，例如蓝光LED芯片的主发光波长段为450nm附近，则组合物或是聚酰亚胺对光波长为450nm附近的吸收率要够低甚至不吸收，才可确保大部分甚至全部的光可以通过该组合物或是该聚酰亚胺。此外LED芯片发出的光穿越两种物质的界面时，两种物质的折射率越接近，出光效率越高，为接近与灯丝基材(或基层)接触的物质(例如固晶胶)的折射率，因而有机硅改性聚酰亚胺组合物的折射率为1.4～1.7，优选1.4～1.55。将有机硅改性聚酰亚胺树脂组合物用于灯丝基材，需有机硅改性聚酰亚胺树脂组合物在蓝色激发白色LED的InGaN的峰值波长处具有良好的透光率。为得到良好的透过率，可以通过改变合成有机硅改性聚酰亚胺的原料、热固化剂及散热粒子，因有机硅改性聚酰亚胺树脂组合物中的荧光粉会对透过率的测试会有一定影响，因此用于测透过率时的有机硅改性聚酰亚胺树脂组合物中不含有荧光粉，此有机硅改性聚酰亚胺树脂组合物的透过率为86～93％，优选88～91％或者优选89～92％或者优选90～93％。The factors affecting the light transmittance of the silicone-modified polyimide resin composition are at least the main material type, the type of the modifier (thermosetting agent), the type and content of the heat-dissipating particles, and the siloxane content. The light transmittance refers to the transmittance of light in the vicinity of the main emission wavelength band of the LED chip. For example, the main emission wavelength range of the blue LED chip is near 450 nm, and the composition or the absorption of the polyimide to the wavelength of 450 nm is absorbed. The rate is low enough or not absorbed to ensure that most or all of the light can pass through the composition or the polyimide. In addition, when the light emitted by the LED chip crosses the interface between the two substances, the closer the refractive index of the two substances is, the higher the light extraction efficiency is, and the refractive index of the substance (for example, solid crystal glue) close to the contact with the filament substrate (or the base layer). Thus, the silicone-modified polyimide composition has a refractive index of from 1.4 to 1.7, preferably from 1.4 to 1.55. The silicone-modified polyimide resin composition is used for a filament substrate, and the silicone-modified polyimide resin composition is required to have good light transmittance at the peak wavelength of InGaN of the blue-excited white LED. In order to obtain a good transmittance, the raw material of the synthetic silicone-modified polyimide, the heat curing agent, and the heat-dissipating particles can be changed, because the phosphor in the silicone-modified polyimide resin composition will pass through The rate test has a certain influence, so the silicone-modified polyimide resin composition for measuring the transmittance does not contain a phosphor, and the transmittance of the silicone-modified polyimide resin composition It is 86 to 93%, preferably 88 to 91% or preferably 89 to 92% or preferably 90 to 93%.
酸酐与二胺进行反应生成聚酰亚胺，当中的酸酐与二胺可以分别选自不同的组成，即不同的酸酐与不同的二胺反应所生成的聚酰亚胺会有不同的光透过率。脂肪族有机硅改性聚酰亚胺树脂组合物包括脂肪族有机硅改性聚酰亚胺和热固化剂，F化芳香族有机硅改性聚酰亚胺树脂组合物包括F化芳香族有机硅改性聚酰亚胺和热固化剂。因脂肪族有机硅改性聚酰亚胺具有脂环结构，所以脂肪族有机硅改性聚酰亚胺树脂组合物的透光率较高。此外，氟化芳香族、半脂肪族以及全脂肪族的聚酰亚胺针对蓝光LED芯片皆具有良好的光透过率。氟化芳香族有机硅改性聚酰亚胺是由硅氧型二胺、含有氟(F)基团的芳香族二胺(或称为F化芳香族二胺)与含有氟(F)基团的芳香族二酸酐(或称为F化芳香族酸酐)合成，即Ar 1与Ar 2两者都要有氟(F)基团。半脂肪族以及全脂肪族有机硅改性聚酰亚胺是由二酸酐、硅氧型二胺和至少一种不含芳香族结构(如苯环)的二胺(或称为脂肪族二胺)合成，或二胺(其中一种二胺为硅氧型二胺)和至少一种不含芳香族结构(如苯环)的二酸酐(或称为脂肪族酸酐)合成，即Ar 1与Ar 2两者至少其中之一为脂环式烃结构。 The acid anhydride reacts with the diamine to form a polyimide, wherein the acid anhydride and the diamine may be respectively selected from different compositions, that is, the polyimide formed by the reaction of different acid anhydrides with different diamines may have different light transmission. rate. The aliphatic silicone-modified polyimide resin composition comprises an aliphatic silicone-modified polyimide and a heat curing agent, and the F-modified aromatic silicone-modified polyimide resin composition comprises a F-aromatic organic Silicon modified polyimide and heat curing agent. Since the aliphatic silicone-modified polyimide has an alicyclic structure, the aliphatic silicone-modified polyimide resin composition has a high light transmittance. In addition, fluorinated aromatic, semi-aliphatic, and fully aliphatic polyimides have good light transmission for blue LED chips. The fluorinated aromatic silicone-modified polyimide is composed of a siloxane-type diamine, an aromatic diamine containing fluorine (F) groups (or a F-aromatic aromatic diamine), and a fluorine-containing (F) group. The aromatic dianhydride (also referred to as F-aromatic anhydride) is synthesized, that is, both Ar 1 and Ar 2 have a fluorine (F) group. Semi-aliphatic and fully aliphatic silicone-modified polyimides are dianhydrides, siloxane-type diamines, and at least one diamine (or benzene ring)-free diamine (or aliphatic diamine) Synthesis, or synthesis of a diamine (one of which is a siloxane-type diamine) and at least one dianhydride (or referred to as an aliphatic anhydride) containing no aromatic structure (such as a benzene ring), ie, Ar 1 and At least one of Ar 2 is an alicyclic hydrocarbon structure.
虽然蓝光LED芯片的主发光波长为450nm，但由于芯片的制程条件差异与环境的影响，蓝光LED芯片仍可能会发出少量短波长400nm附近的光。氟化芳香族、半脂肪族以及全脂肪族的聚酰亚胺针对短波长400nm的光的吸收率是有差异的，氟化芳香族聚酰亚胺对短波长400nm附近的光的吸收率约为20％，即波长400nm的光通过氟化芳香族聚酰亚胺的光透过率约为80％。而半脂肪族以及全脂肪族的聚酰亚胺针对短波长400nm的光的吸收率是比氟化芳香族聚酰亚胺对短波长400nm附近的光的吸收率还要低，大约只吸收有12％。因此，于一实施例中，若LED灯丝所采用的LED芯片品质较均一，也较少发出短波长的蓝光时，可采用氟化芳香族有机硅改性聚酰亚胺来制作灯丝基材或光转换层。于另一实施例中， 若LED灯丝所采用的LED芯片质量有所差异，且发出较多短波长的蓝光时，可采用半脂肪族或全脂肪族的有机硅改性聚酰亚胺来制作灯丝基材或光转换层。Although the main LED wavelength of the blue LED chip is 450 nm, the blue LED chip may emit a small amount of light near the short wavelength of 400 nm due to the difference in the processing conditions of the chip and the environment. Fluorinated aromatic, semi-aliphatic, and fully aliphatic polyimides have different absorption rates for light having a short wavelength of 400 nm, and the absorption rate of fluorinated aromatic polyimide to light having a short wavelength of around 400 nm is about The light transmittance of the fluorinated aromatic polyimide, which is 20%, that is, light having a wavelength of 400 nm, is about 80%. The absorption rate of semi-aliphatic and fully aliphatic polyimides for light having a short wavelength of 400 nm is lower than that of fluorinated aromatic polyimides for light having a short wavelength of 400 nm. 12%. Therefore, in an embodiment, if the LED chip used in the LED filament has a uniform quality and emits a short wavelength of blue light, the fluorinated aromatic silicone modified polyimide can be used to fabricate the filament substrate or Light conversion layer. In another embodiment, if the quality of the LED chips used in the LED filaments is different and more short-wavelength blue light is emitted, semi-aliphatic or fully aliphatic silicone-modified polyimide can be used. Filament substrate or light conversion layer.
添加不同的热固化剂对有机硅改性聚酰亚胺的光透过率会有不同的影响。表1-1显示不同热固化剂的添加对全脂肪族有机硅改性聚酰亚胺的光透过率的影响，在蓝光LED芯片的主发光波长450nm的条件下，添加不同的热固化剂对全脂肪族有机硅改性聚酰亚胺的光透过率并没显着差异，但在短波长380nm的条件下，添加不同的热固化剂对全脂肪族有机硅改性聚酰亚胺的光透过率会有影响。有机硅改性聚酰亚胺本身对短波长(380nm)的光的透过率就是会比长波长(450nm)的光的透过率还差，但是差异的程度会随着添加不同的热固化剂而不同。例如当全脂肪族有机硅改性聚酰亚胺添加热固化剂KF105时，光透过率减少的程度较小，但是当全脂肪族有机硅改性聚酰亚胺添加热固化剂2021p时，光透过率减少的程度会较大。因此，于一实施例中，若LED灯丝所采用的LED芯片品质较均一，也较少发出短波长的蓝光时，可添加热固化剂BPA或是热固化剂2021p。相反的，于一实施例中，若LED灯丝所采用的LED芯片质量有所差异，且发出较多短波长的蓝光时，可以选择添加热固化剂KF105。表1-1及表1-2均是采用岛津紫外可见分光亮度计UV-1800进行对其进行透光性测试。它根据白色LED的发光，在波长分别为380nm、410nm及450nm的光透过率。The addition of different heat curing agents has a different effect on the light transmittance of the silicone modified polyimide. Table 1-1 shows the effect of the addition of different heat curing agents on the light transmittance of the fully aliphatic silicone-modified polyimide. Under the condition that the main light-emitting wavelength of the blue LED chip is 450 nm, different heat curing agents are added. There is no significant difference in the light transmittance of the fully aliphatic silicone-modified polyimide, but a different thermal curing agent is added to the fully aliphatic silicone-modified polyimide at a short wavelength of 380 nm. The light transmittance will have an effect. The silicone-modified polyimide itself has a transmittance for short-wavelength (380 nm) light that is worse than that of long-wavelength (450 nm) light, but the degree of difference varies with the addition of different heat curing. Different from the agent. For example, when a fully aliphatic silicone-modified polyimide is added with a thermosetting agent KF105, the degree of light transmittance is reduced to a small extent, but when a fully aliphatic silicone-modified polyimide is added with a thermosetting agent 2021p, The degree of light transmittance reduction will be large. Therefore, in one embodiment, if the LED chip used in the LED filament has a uniform quality and emits a short-wavelength blue light, a thermal curing agent BPA or a thermal curing agent 2021p may be added. Conversely, in one embodiment, if the quality of the LED chips used in the LED filaments is different and more short-wavelength blue light is emitted, the thermal curing agent KF105 may be optionally added. Table 1-1 and Table 1-2 were all tested for light transmission using Shimadzu UV-Vis spectrophotometer UV-1800. It is based on the light transmittance of white LEDs at wavelengths of 380 nm, 410 nm and 450 nm, respectively.
表1-1Table 1-1
Figure PCTCN2018123817-appb-000004
Figure PCTCN2018123817-appb-000004
即使是添加相同的热固化剂，当添加量不同时，对光透过率也会有不同的影响。表1-2显示，当全脂肪族有机硅改性聚酰亚胺的热固化剂BPA添加量由4％增加到8％时，光透过率是提升的。但是当添加量再增加到12％时，光透过率的表现就几乎不变。显示光透过率会随着热固化剂添加量的增加而变好，但是当提升到一个程度后，添加再多的热固化剂对光透过率的影响就相当有限。Even if the same heat curing agent is added, when the amount of addition is different, the light transmittance will be differently affected. Table 1-2 shows that when the amount of BPA added by the thermal curing agent of the wholly aliphatic silicone-modified polyimide is increased from 4% to 8%, the light transmittance is improved. However, when the addition amount is further increased to 12%, the performance of light transmittance is almost unchanged. The light transmittance is shown to increase as the amount of heat curing agent increases, but when it is raised to a certain extent, the effect of adding more heat curing agent on the light transmittance is rather limited.
表1-2Table 1-2
Figure PCTCN2018123817-appb-000005
Figure PCTCN2018123817-appb-000005
Figure PCTCN2018123817-appb-000006
Figure PCTCN2018123817-appb-000006
表2Table 2
Figure PCTCN2018123817-appb-000007
Figure PCTCN2018123817-appb-000007
不同的散热粒子会有不同的透光度，若采用透光度低或是光反射率低的散热粒子，则有机硅改性聚酰亚胺树脂组合物的光透过率就会降低。本发明的有机硅改性聚酰亚胺树脂组合物中的散热粒子优选采用透明粉末，或是透光度高的粒子，或是光反射率高的粒子，因为LED软灯丝主要用以发光，因此灯丝基材需要具有良好的透光性。另外，在混合两种以上类型的散热粒子的情况下，可采用透光度高的粒子和透光度低的粒子组合使用，并且使透光度高的粒子所占比例大于透光度低的粒子。例如在一实施例中，透光度高的粒子与透光度低的粒子的重量比为3～5:1。Different heat dissipating particles have different transmittances, and if heat dissipating particles having low transmittance or low light reflectance are used, the light transmittance of the silicone-modified polyimide resin composition is lowered. The heat-dissipating particles in the silicone-modified polyimide resin composition of the present invention are preferably transparent powders, or particles having high light transmittance, or particles having high light reflectance, because the LED flexible filaments are mainly used for light-emitting. Therefore, the filament substrate needs to have good light transmittance. In addition, in the case of mixing two or more types of heat dissipating particles, a combination of particles having a high transmittance and particles having a low transmittance can be used, and a ratio of particles having a high transmittance is larger than a transmittance having a low transmittance. particle. For example, in one embodiment, the weight ratio of the particles having a high transmittance to the particles having a low transmittance is 3 to 5:1.
不同的硅氧烷含量也对光透过率也会有影响。表2可以看出，在硅氧烷含量只有37wt％时，光透过率只有85％，但随着硅氧烷含量提高到超过45％，光透过率都有超过94％的水平表现。Different siloxane contents also have an effect on light transmission. As can be seen from Table 2, when the siloxane content is only 37% by weight, the light transmittance is only 85%, but as the siloxane content is increased to more than 45%, the light transmittance is more than 94%.
耐热性Heat resistance
影响有机硅改性聚酰亚胺树脂组合物耐热性的因素至少为主材料种类、硅氧含量及改性剂(热固化剂)的种类及含量。The factors affecting the heat resistance of the silicone-modified polyimide resin composition are at least the main material type, the silicon oxygen content, and the type and content of the modifier (thermosetting agent).
以氟化芳香族、半脂肪族以及全脂肪族的有机硅改性聚酰亚胺合成得到的有机硅改性聚酰亚胺树脂组合物都有优异的耐热性质，均适合制作灯丝基材或光转换层。若再仔细区别，在加速耐热老化实验(300℃×1hr)时发现，氟化芳香族有机硅改性聚酰亚胺比脂肪族有机硅改性聚酰亚胺拥有较好的耐热性质。因此，于一实施例中，若LED灯丝采用高功率、高亮度的LED芯片，可采用氟化芳香族有机硅改性聚酰亚胺来制作灯丝基材或光转换层。The silicone-modified polyimide resin composition synthesized by fluorinating aromatic, semi-aliphatic and fully aliphatic silicone-modified polyimide has excellent heat resistance properties, and is suitable for fabricating a filament substrate. Or a light conversion layer. If carefully distinguished, it was found that the fluorinated aromatic silicone modified polyimide has better heat resistance than the aliphatic silicone modified polyimide in the accelerated heat aging test (300 ° C × 1 hr). . Therefore, in one embodiment, if the LED filament adopts a high power, high brightness LED chip, the fluorinated aromatic silicone modified polyimide can be used to fabricate the filament substrate or the light conversion layer.
有机硅改性聚酰亚胺中的硅氧烷含量高低会影响有机硅改性聚酰亚胺树脂组合物的耐热变色性质。耐热变色性质指的是将样品置于200℃×24小时的条件下，测定放置后的样品在波长460nm处的透过率。由表2可以看出，当硅氧烷含量只有37wt％时200℃×24小时后的透过率只剩83％，随着硅氧烷含量的增加，200℃×24小时后的透过率是逐渐增加的，当硅氧烷含量有73wt％时200℃×24小时后的透过率仍高达95％，因此提高硅氧烷的含量是 可以有效提高有机硅改性聚酰亚胺的耐热变色性。The high siloxane content in the silicone-modified polyimide affects the heat-resistant discoloration property of the silicone-modified polyimide resin composition. The heat-resistant discoloration property means that the sample was placed at 200 ° C for 24 hours, and the transmittance of the sample after standing at a wavelength of 460 nm was measured. It can be seen from Table 2 that when the siloxane content is only 37% by weight, the transmittance after 200 ° C × 24 hours is only 83%, and the transmittance after 200 ° C × 24 hours increases with the increase of the siloxane content. It is gradually increasing. When the content of siloxane is 73wt%, the transmittance after 200°C×24 hours is still as high as 95%. Therefore, increasing the content of siloxane can effectively improve the resistance of silicone modified polyimide. Thermal discoloration.
加入热固化剂可提高耐热性和玻璃化转换温度。如图23所示，A1、A2分别代表加入热固化剂前后的曲线；D1,D2曲线则是分别以微分计算A1、A2曲线数值后的值，代表A1、A2曲线的变化程度，从图23所示的TMA(thermomechanical analysis)的分析结果来看，当加入热固化剂后，产生受热变形的曲线减缓的趋势。因此，可得知加入热固化剂，可具有提高其耐热性的效果。The addition of a thermal curing agent increases the heat resistance and the glass transition temperature. As shown in Fig. 23, A1 and A2 respectively represent the curves before and after the addition of the thermosetting agent; the D1 and D2 curves are the values obtained by calculating the values of the A1 and A2 curves by differential, respectively, representing the degree of change of the A1 and A2 curves, from Fig. 23 As a result of the analysis of the TMA (thermomechanical analysis) shown, when a thermosetting agent is added, a tendency to slow down the curve of heat deformation occurs. Therefore, it is known that the addition of the thermosetting agent has an effect of improving the heat resistance.
有机硅改性聚酰亚胺与热固化剂进行交联反应时，热固化剂中具有能与聚酰亚胺中的活泼氢官能团反应的有机基团即可，热固化剂的用量及种类对基材的变色性能、机械性能及折射率具有一定的影响，因而可选择一些耐热性、透过率较佳的热固化剂，热固化剂的实例包括环氧树脂、异氰酸酯、双马来酰亚胺或双恶唑啉化合物。环氧树脂可为双酚A型环氧树脂，例如BPA，还可为硅氧型的环氧树脂，如KF105、X22-163、X22-163A，还可为脂环族环氧树脂，如3,4-环氧环己基甲基3,4-环氧环己基甲酸酯(2021P)、EHPE3150、EHPE3150CE。通过环氧树脂的架桥反应，使得有机硅改性聚酰亚胺与环氧树脂之间形成三维的架桥结构，提高了胶材本身的结构强度。一实施例中，热固化剂的用量还可根据热固化剂与有机硅改性聚酰亚胺中的活泼氢官能团反应的摩尔量决定。于一实施例中，与热固化剂反应的活泼氢官能团的摩尔量等于热固化剂的摩尔量，例如与热固化剂反应的活泼氢官能团的摩尔量为1mol，则热固化剂的摩尔量为1mol。When the silicone-modified polyimide is cross-linked with a thermosetting agent, the thermosetting agent has an organic group capable of reacting with an active hydrogen functional group in the polyimide, and the amount and type of the thermosetting agent are The color change performance, mechanical properties and refractive index of the substrate have a certain influence, and thus some heat curing agents having better heat resistance and transmittance may be selected. Examples of the heat curing agent include epoxy resin, isocyanate, and bismalel. An imine or a bisoxazoline compound. The epoxy resin may be a bisphenol A type epoxy resin, such as BPA, or a silicon oxide type epoxy resin such as KF105, X22-163, X22-163A, or an alicyclic epoxy resin such as 3 4-epoxycyclohexylmethyl 3,4-epoxycyclohexylformate (2021P), EHPE3150, EHPE3150CE. Through the bridging reaction of epoxy resin, a three-dimensional bridging structure is formed between the silicone modified polyimide and the epoxy resin, thereby improving the structural strength of the rubber material itself. In one embodiment, the amount of the thermal curing agent may also be determined based on the molar amount of the thermal curing agent reacted with the active hydrogen functional groups in the silicone modified polyimide. In one embodiment, the molar amount of the active hydrogen functional group reacted with the thermal curing agent is equal to the molar amount of the thermal curing agent. For example, the molar amount of the active hydrogen functional group reacted with the thermal curing agent is 1 mol, and the molar amount of the thermal curing agent is 1mol.
热传导率Thermal conductivity
影响有机硅改性聚酰亚胺树脂组合物热传导率的因素至少有荧光粉种类与含量、散热粒子种类与含量以及偶联剂的添加与种类。其中，散热粒子的粒径大小及粒径分布也会影响热传导率。The factors affecting the thermal conductivity of the silicone-modified polyimide resin composition are at least the type and content of the phosphor, the type and content of the heat-dissipating particles, and the addition and type of the coupling agent. Among them, the particle size and particle size distribution of the heat dissipating particles also affect the thermal conductivity.
有机硅改性聚酰亚胺树脂组合物中还可以含有用于获得所需发光特性的荧光粉，荧光粉可以将发光半导体发出的光的波长进行变换，例如黄色荧光粉能将蓝光转换成黄光，红色荧光粉能够将蓝光转换成红光。黄色荧光粉，例如(Ba,Sr,Ca) 2SiO 4:Eu、(Sr,Ba) 2SiO 4:Eu(原硅酸钡(BOS))等透明荧光粉，Y 3Al 5O 12:Ce(YAG(钇·铝·石榴石):Ce)、Tb 3Al 3O 12:Ce(YAG(铽·铝·石榴石):Ce)等具有硅酸盐结构的硅酸盐型荧光粉，Ca-α-SiAlON等氮氧化物荧光粉。红色荧光粉包括氮化物荧光粉，例如CaAlSiN 3:Eu、CaSiN 2:Eu。绿色荧光粉，例如稀土-卤酸盐荧光粉、硅酸盐荧光粉等。荧光粉在有机硅改性聚酰亚胺树脂组合物中的含有比例可以根据所期望的发光特性任意设定。此外，因荧光粉热传导率远大于有机硅改性聚酰亚胺树脂，所以随着荧光粉在有机硅改性聚酰亚胺树脂组合物中含有比例的提升，有机硅改性聚酰亚胺树脂组合物整体的热传导率也会跟着提升。因此，在一实施例中，在满足发光特性的前提下，可适度的提高荧光粉的含量以增加有机硅改性聚酰亚胺树脂组合物的热传导率，有利于灯丝基材或是光转换层的散热性质。另有机硅改性聚酰亚胺树脂组合物作为灯丝基材时，有机硅改性聚酰亚胺树脂组合物中荧光粉的含量、形状、粒径也会对基材的机械性能(例如弹性模量、伸长率、拉伸强度)及翘曲程度有一定的影响。为使基材具有较优 的机械性能、热传导率及翘曲程度小，有机硅改性聚酰亚胺树脂组合物中所含有的荧光粉是颗粒状的，荧光粉的形状可为球状、板状或针状，优选荧光粉的形状为球状；荧光粉的最大平均长度(球状时的平均粒径)为0.1μm以上，优选为1μm以上，进一步优选为1～100μm，更优选为1～50μm；荧光粉的用量为不小于有机硅改性聚酰亚胺重量的0.05倍，优选不小于0.1倍，且不大于8倍，优选不大于7倍，例如有机硅改性聚酰亚胺的重量为100重量份，荧光粉的含量为不小于5重量份，优选不小于10重量份，且不大于800重量份，优选不大于700重量份，荧光粉在有机硅改性聚酰亚胺树脂组合物中的含量超过800重量份时，有机硅改性聚酰亚胺树脂组合物的机械性能可能达不到作为灯丝基层所需的强度，造成产品的不良率增加。于一实施例中，同时添加两种荧光粉，比如同时添加红色荧光粉、绿荧光粉时，红荧光粉与绿荧光粉的添加比为1:5～8，优选红荧光粉与绿荧光粉的添加比为1:6～7。于另一实施例中，同时添加两种荧光粉，比如同时添加红色荧光粉、黄色荧光粉时，红色荧光粉与黄色荧光粉的添加比为1:5～8，优选红色荧光粉与黄色荧光粉的添加比为1:6～7。在其它实施例中，可同时添加三种或三种以上的荧光粉。 The silicone-modified polyimide resin composition may further contain a phosphor for obtaining a desired luminescent property, and the phosphor may convert a wavelength of light emitted from the luminescent semiconductor, for example, a yellow phosphor converts blue light into yellow. Light, red phosphors convert blue light into red light. Yellow phosphor, for example, (Ba, Sr, Ca) 2 SiO 4 :Eu, (Sr,Ba) 2 SiO 4 :Eu (barium strontium silicate (BOS)) and other transparent phosphors, Y 3 Al 5 O 12 :Ce (YAG (yttrium aluminum garnet): Ce), Tb 3 Al 3 O 12 : Ce (YAG (yttrium aluminum garnet): Ce) and other silicate-type phosphors having a silicate structure, Ca - NOx oxide such as ?-SiAlON. The red phosphor includes a nitride phosphor such as CaAlSiN 3 :Eu, CaSiN 2 :Eu. Green phosphors, such as rare earth-halide phosphors, silicate phosphors, and the like. The content ratio of the phosphor in the silicone-modified polyimide resin composition can be arbitrarily set in accordance with desired light-emitting characteristics. In addition, since the thermal conductivity of the phosphor is much larger than that of the silicone-modified polyimide resin, the silicone-modified polyimide increases as the proportion of the phosphor in the silicone-modified polyimide resin composition increases. The thermal conductivity of the resin composition as a whole is also increased. Therefore, in an embodiment, under the premise that the luminescent property is satisfied, the content of the phosphor can be appropriately increased to increase the thermal conductivity of the silicone-modified polyimide resin composition, which is beneficial to the filament substrate or the light conversion. The heat dissipation properties of the layer. When the silicone-modified polyimide resin composition is used as a filament substrate, the content, shape, and particle diameter of the phosphor in the silicone-modified polyimide resin composition also affect the mechanical properties of the substrate (for example, elasticity). Modulus, elongation, tensile strength) and warpage have a certain effect. In order to make the substrate have superior mechanical properties, thermal conductivity and warpage, the phosphor contained in the silicone modified polyimide resin composition is granular, and the shape of the phosphor may be spherical or plate. Preferably, the shape of the phosphor is spherical, and the maximum average length of the phosphor (average particle diameter in the case of a spherical shape) is 0.1 μm or more, preferably 1 μm or more, more preferably 1 to 100 μm, still more preferably 1 to 50 μm. The phosphor is used in an amount of not less than 0.05 times, preferably not less than 0.1 times, and not more than 8 times, preferably not more than 7 times, such as the weight of the silicone-modified polyimide, of the weight of the silicone-modified polyimide. The content of the phosphor is not less than 5 parts by weight, preferably not less than 10 parts by weight, and not more than 800 parts by weight, preferably not more than 700 parts by weight, based on 100 parts by weight of the phosphor, in the silicone-modified polyimide resin combination When the content in the content exceeds 800 parts by weight, the mechanical properties of the silicone-modified polyimide resin composition may not reach the strength required as the base layer of the filament, resulting in an increase in the defective rate of the product. In one embodiment, when two kinds of phosphors are simultaneously added, such as adding red phosphor and green phosphor at the same time, the addition ratio of the red phosphor to the green phosphor is 1:5-8, preferably red phosphor and green phosphor. The addition ratio is 1:6-7. In another embodiment, when two kinds of phosphors are simultaneously added, such as adding red phosphor and yellow phosphor at the same time, the addition ratio of the red phosphor to the yellow phosphor is 1:5-8, preferably red phosphor and yellow phosphor. The addition ratio of the powder is 1:6 to 7. In other embodiments, three or more phosphors may be added simultaneously.
添加散热粒子的目的主要是增加有机硅改性聚酰亚胺树脂组合物的热导率，维持LED芯片发光色温以及延长LED芯片的使用寿命。散热粒子的实例包括二氧化硅、氧化铝、氧化镁、碳酸镁、氮化铝、氮化硼或金刚石等。从分散性考虑，优选二氧化硅、氧化铝或其两者组合使用。关于散热粒子的颗粒形状，可以为球状、块状等，此球状包括与球状相似的形状，一实施例中，可以采用球状与非球状散热粒子，以保证散热粒子的分散性和基材的热传导率，球状与非球状散热粒子的添加重量比为1:0.15～0.35。The purpose of adding heat dissipating particles is mainly to increase the thermal conductivity of the silicone modified polyimide resin composition, maintain the color temperature of the LED chip, and prolong the service life of the LED chip. Examples of the heat dissipating particles include silica, alumina, magnesia, magnesium carbonate, aluminum nitride, boron nitride or diamond. From the viewpoint of dispersibility, silica, alumina or a combination of both is preferably used. The particle shape of the heat dissipating particles may be a spherical shape, a block shape, or the like, and the spherical shape includes a shape similar to a spherical shape. In one embodiment, spherical and non-spherical heat dissipating particles may be used to ensure dispersibility of the heat dissipating particles and heat conduction of the substrate. The ratio of the weight ratio of the spherical and non-spherical heat dissipating particles is 1:0.15 to 0.35.
表3-1显示出散热粒子含量与有机硅改性聚酰亚胺树脂组合物热导率的变化关系，随着散热粒子含量的增加，有机硅改性聚酰亚胺树脂组合物的热导率也随之提高，但散热粒子在有机硅改性聚酰亚胺树脂组合物中的含量超过1200重量份时，有机硅改性聚酰亚胺树脂组合物的机械性能可能达不到作为灯丝基层所需的强度，造成产品的不良率增加。于一实施例中，可以添加高含量且透光度高或是反射度高的散热粒子(例如SiO 2、Al 2O 3)，除了可以维持有机硅改性聚酰亚胺树脂组合物的透光性，也可以提升有机硅改性聚酰亚胺树脂组合物的散热性。表3-1及表3-2为将所得有机硅改性聚酰亚胺树脂组合物切成膜厚为300um，直径为30mm的圆作为试验片，通过湘科制作的热导率测量装置DRL-Ⅲ测量导热率，测试条件：热极温度：90℃；冷极温度：20℃；负载：350N。 Table 3-1 shows the relationship between the heat-dissipating particle content and the thermal conductivity of the silicone-modified polyimide resin composition, and the thermal conductivity of the silicone-modified polyimide resin composition as the amount of the heat-dissipating particles increases The rate is also increased, but when the content of the heat-dissipating particles in the silicone-modified polyimide resin composition exceeds 1200 parts by weight, the mechanical properties of the silicone-modified polyimide resin composition may not be as a filament. The strength required for the base layer increases the defect rate of the product. In one embodiment, heat-dissipating particles (for example, SiO 2 , Al 2 O 3 ) having a high content and high transmittance or high reflectance may be added, in addition to maintaining the transparency of the silicone-modified polyimide resin composition. The lightness can also improve the heat dissipation of the silicone-modified polyimide resin composition. Table 3-1 and Table 3-2 show that the obtained silicone-modified polyimide resin composition was cut into a film having a film thickness of 300 μm and a diameter of 30 mm as a test piece, and a thermal conductivity measuring device DRL manufactured by Xiangke was produced. -III Measurement of thermal conductivity, test conditions: hot electrode temperature: 90 ° C; cold electrode temperature: 20 ° C; load: 350 N.
表3-1Table 3-1
重量比[wt％]Weight ratio [wt%] 0.0％0.0% 37.9％37.9% 59.8％59.8% 69.8％69.8% 77.6％77.6% 83.9％83.9% 89.0％89.0%
体积比[vol％]Volume ratio [vol%] 0.0％0.0% 15.0％15.0% 30.0％30.0% 40.0％40.0% 50.0％50.0% 60.0％60.0% 70.0％70.0%
热传导率[W/m*K]Thermal conductivity [W/m*K] 0.170.17 0.200.20 0.380.38 0.540.54 0.610.61 0.740.74 0.810.81
表3-2Table 3-2
规格 specification ①1 ②2 ③3 ④4 ⑤5 ⑥6 ⑦7
平均粒径[μm]Average particle size [μm] 2.72.7 6.66.6 9.09.0 9.69.6 1313 4.14.1 1212
粒径分布[μm]Particle size distribution [μm] 1～71~7 1～201 to 20 1～301 to 30 0.2～300.2 to 30 0.2～1100.2 to 110 0.1～200.1～20 0.1～1000.1～100
热传导率[W/m*K]Thermal conductivity [W/m*K] 1.651.65 1.481.48 1.521.52 1.861.86 1.681.68 1.871.87 2.102.10
关于散热粒子的粒径大小及分布对有机硅改性聚酰亚胺树脂组合物的热导率的影响请同时参考表3-2与图24。表3-2与图24显示有机硅改性聚酰亚胺树脂组合物分别添加相同比例的7种不同规格的散热粒子及对其热导率的影响结果。适合添加于有机硅改性聚酰亚胺树脂组合物的散热粒子的粒径大小大致可分为小粒径(小于1μm)、中等粒径(1-30μm)以及大粒径(大于30μm)。Please refer to Table 3-2 and Figure 24 for the influence of the particle size and distribution of the heat-dissipating particles on the thermal conductivity of the silicone-modified polyimide resin composition. Table 3-2 and Figure 24 show the results of adding the same ratio of seven different heat-dissipating particles to the silicone-modified polyimide resin composition and their thermal conductivity. The particle size of the heat dissipating particles suitable for addition to the silicone-modified polyimide resin composition can be roughly classified into a small particle diameter (less than 1 μm), a medium particle diameter (1 to 30 μm), and a large particle diameter (greater than 30 μm).
比较规格①、②和③，规格①、②和③都只有添加中等粒径的散热粒子，只是平均粒径并不相同。其结果显示，在只添加中等粒径的散热粒子的条件下，散热粒子的平均粒径对有机硅改性聚酰亚胺树脂组合物热导率并无明显的影响。比较规格③和④显示，在平均粒径相似的条件下，添加小粒径与中等粒径的规格④所呈现的热导率明显优于只添加中等粒径的规格③。比较规格④和⑥显示，在都添加小粒径与中等粒径的条件下，虽然散热粒子的平均粒径有所差异，但对有机硅改性聚酰亚胺树脂组合物的热导率并无明显的影响。比较规格④和⑦显示，除了添加小粒径与中等粒径之外，多添加大粒径散热粒子的规格⑦呈现最优异的热传导率。比较规格⑤和⑦，规格⑤和⑦虽然都添加了大、中、小三种粒径的散热粒子，且平均粒径也相似，但规格⑦的热传导率却明显比规格⑤优异，造成这种差异的原因与粒径分布的比例有关。请看图24规格⑦的粒径分布，规格⑦的曲线平滑，斜率大部分都差易不大，显示规格⑦不仅包含每一种粒径大小，且每一种粒径含量皆有适度的比例，且呈现常态的分布状态，例如，小粒径含量大约10％，中粒径含量大约60％，大粒径含量大约30％。反观规格⑤，规格⑤的曲线有两个大斜率的区域，分别在粒径1-2μm与粒径30-70μm，表示规格⑤的粒径大部分分布在粒径1-2μm与粒径30-70μm，且只包含少量粒径大小3-20μm的散热粒子，呈现两头分布的状态。Comparing specifications 1, 2 and 3, specifications 1, 2 and 3 only add medium-sized heat-dissipating particles, but the average particle size is not the same. As a result, it was revealed that the average particle diameter of the heat-dissipating particles did not significantly affect the thermal conductivity of the silicone-modified polyimide resin composition under the condition that only the medium-sized heat-dissipating particles were added. Comparing the specifications 3 and 4 shows that under the conditions of similar average particle size, the thermal conductivity exhibited by the addition of the small particle size and the medium particle size 4 is significantly better than the specification of only the medium particle size. Comparative specifications 4 and 6 show that, under the conditions of adding small particle size and medium particle size, although the average particle diameter of the heat dissipating particles is different, the thermal conductivity of the silicone modified polyimide resin composition is No significant impact. Comparative specifications 4 and 7 show that in addition to the addition of small and medium particle sizes, size 7 of the addition of large particle size heat dissipating particles exhibits the most excellent thermal conductivity. Comparing specifications 5 and 7, although specifications 5 and 7 have added heat-dissipating particles of three sizes, large and medium, and the average particle size is similar, the thermal conductivity of size 7 is significantly better than that of specification 5, causing this difference. The reason is related to the ratio of the particle size distribution. Please see the particle size distribution of the specification 7 in Figure 24. The curve of the specification 7 is smooth, and the slope is mostly small. The display specification 7 not only contains each particle size, but also has a moderate proportion of each particle size. And exhibiting a normal distribution state, for example, a small particle size of about 10%, a medium particle size of about 60%, and a large particle size of about 30%. In contrast to the specification 5, the curve of the specification 5 has two regions with large slopes, respectively having a particle diameter of 1-2 μm and a particle diameter of 30-70 μm, indicating that the particle size of the specification 5 is mostly distributed in the particle diameter of 1-2 μm and the particle diameter of 30- 70μm, and only contains a small amount of heat-dissipating particles with a particle size of 3-20μm, showing a state of two-head distribution.
因此散热粒子的粒径分布影响热传导率的程度是大于散热粒子的平均粒径，当添加了大、中、小三种粒径的散热粒子，且小粒径含量大约5-20％、中粒径含量大约50-70％、大粒径含量大约20-40％时，有机硅改性聚酰亚胺树脂会有最佳的热传导率。因为当有大、中、小三种粒径的条件下，在相同的体积里，散热粒子会有较密集的堆积与接触而形成有效率的散热路径。Therefore, the particle size distribution of the heat-dissipating particles affects the thermal conductivity to a greater extent than the average particle diameter of the heat-dissipating particles. When three large, medium, and small particle size heat-dissipating particles are added, the small particle size is about 5-20%, and the medium particle size is about 5-20%. The silicone-modified polyimide resin has an optimum thermal conductivity when the content is about 50-70% and the large particle size is about 20-40%. Because under the conditions of three sizes of large, medium and small, in the same volume, the heat-dissipating particles will have dense accumulation and contact to form an efficient heat dissipation path.
于一实施例中例如采用粒径分布为0.1～100μm，平均粒径为12μm的氧化铝或是粒度分布为0.1～20μm，平均粒径为4.1μm的氧化铝，此粒度分布为氧化铝的粒径范围。于另一实施例中，从基材的平滑性考虑，可以选取平均粒径为基材厚度的1/5～2/5，优选1/5～1/3。散热粒子的用量为有机硅改性聚酰亚胺重量(用量)的1～12倍，例如有机硅改性聚酰亚胺为100重量份，散热粒子的含量为100～1200重量份，优选400～900重量份，同时添加两种散热 粒子，例如同时添加二氧化硅、氧化铝，氧化铝与二氧化硅的重量比为0.4～25:1，优选1～10:1。In one embodiment, for example, alumina having a particle size distribution of 0.1 to 100 μm and an average particle diameter of 12 μm or alumina having a particle size distribution of 0.1 to 20 μm and an average particle diameter of 4.1 μm is used, and the particle size distribution is alumina particles. Range of diameters. In another embodiment, from the viewpoint of smoothness of the substrate, the average particle diameter may be selected from 1/5 to 2/5, preferably 1/5 to 1/3 of the thickness of the substrate. The amount of the heat dissipating particles is 1 to 12 times the weight (amount) of the silicone modified polyimide, for example, 100 parts by weight of the silicone modified polyimide, and the content of the heat dissipating particles is 100 to 1200 parts by weight, preferably 400. ～900 parts by weight, two kinds of heat dissipating particles are simultaneously added, for example, silica and alumina are simultaneously added, and the weight ratio of alumina to silica is 0.4 to 25:1, preferably 1 to 10:1.
在合成有机硅改性聚酰亚胺树脂组合物时，可以通过添加偶联剂(例如硅烷偶联剂)以提升固态物质(如荧光粉、散热粒子)与胶材(例如有机硅改性聚酰亚胺)之间的密着性且提高整体固态物质的分散均匀度，进而提高光转换层的散热性以及机械强度，偶联剂还可采用钛酸酯偶联剂，优选环氧类钛酸酯偶联剂。偶联剂的用量与散热粒子的添加量及其比表面积有关，偶联剂的用量＝(散热粒子用量*散热粒子的比表面积)/偶联剂最小包覆面积，例如采用环氧类钛酸酯偶联剂，偶联剂的用量＝(散热粒子用量*散热粒子的比表面积)/331.5。In the synthesis of the silicone-modified polyimide resin composition, a coupling agent (for example, a silane coupling agent) may be added to enhance solid substances (such as phosphors, heat-dissipating particles) and rubber materials (for example, silicone-modified poly-polymers). The adhesion between the imide) and the uniformity of dispersion of the entire solid matter, thereby improving the heat dissipation and mechanical strength of the light conversion layer, and the coupling agent may also be a titanate coupling agent, preferably an epoxy-based titanic acid. Ester coupling agent. The amount of coupling agent is related to the amount of heat-dissipating particles added and its specific surface area. The amount of coupling agent = (the amount of heat-dissipating particles * the specific surface area of the heat-dissipating particles) / the minimum coating area of the coupling agent, for example, epoxy-based titanic acid Ester coupling agent, the amount of coupling agent = (the amount of heat-dissipating particles * specific surface area of the heat-dissipating particles) / 331.5.
在本发明其他具体实施例中，为了进一步改善有机硅改性聚酰亚胺树脂组合物在合成工艺中的性质，可以选择性地在有机硅改性聚酰亚胺树脂组合物合成工艺的过程中添加消泡剂、流平剂或粘合剂等添加剂，只要其不影响产品的耐旋光性、机械强度、耐热性及变色性即可。消泡剂用于消除在印刷、涂布和固化时产生的气泡，比如使用丙烯酸类或有机硅类等表面活性剂作为消泡剂。流平剂用于消除在印刷和涂布过程中产生的涂膜表面上的凹凸。具体而言，优选含有0.01～2wt％的表面活性剂成分，可以抑制气泡，可以通过使用如丙烯酸类或有机硅类的流平剂使涂膜平滑，优选不含离子杂质的非离子表面活性剂。粘合剂的实例包括咪唑类化合物、噻唑类化合物、三唑类化合物、有机铝化合物、有机钛化合物和硅烷偶联剂。优选的，这些添加剂的用量为不大于有机硅改性聚酰亚胺重量的10％。当添加剂的混合量超过10wt％时，所得涂膜的物理性质倾向于降低，并且还会产生由挥发性成分引起的耐旋光性劣化的问题。In other specific embodiments of the present invention, in order to further improve the properties of the silicone-modified polyimide resin composition in the synthesis process, the process of synthesizing the silicone-modified polyimide resin composition may be selectively performed. An additive such as an antifoaming agent, a leveling agent or a binder may be added as long as it does not affect the optical rotation resistance, mechanical strength, heat resistance and discoloration of the product. Defoamers are used to eliminate bubbles generated during printing, coating, and curing, such as the use of surfactants such as acrylics or silicones as defoamers. The leveling agent is used to eliminate irregularities on the surface of the coating film which are produced during printing and coating. Specifically, it is preferable to contain 0.01 to 2% by weight of a surfactant component, which can suppress bubbles, and can be made smooth by using a leveling agent such as acrylic or silicone, preferably a nonionic surfactant containing no ionic impurities. . Examples of the binder include an imidazole compound, a thiazole compound, a triazole compound, an organoaluminum compound, an organotitanium compound, and a silane coupling agent. Preferably, these additives are used in an amount of not more than 10% by weight based on the weight of the silicone-modified polyimide. When the compounding amount of the additive exceeds 10% by weight, the physical properties of the resulting coating film tend to decrease, and the problem of deterioration of the optical rotation resistance caused by the volatile component is also generated.
机械强度Mechanical strength
影响有机硅改性聚酰亚胺树脂组合物机械强度的因素至少有主材料种类、硅氧烷含量、改性剂(热固化剂)种类、荧光粉以及散热粒子含量。The factors affecting the mechanical strength of the silicone-modified polyimide resin composition are at least the main material type, the siloxane content, the modifier (thermosetting agent) type, the phosphor, and the heat-dissipating particle content.
不同的有机硅改性聚酰亚胺树脂拥有不同的特性，表4分别列出氟化芳香族、半脂肪族以及全脂肪族三种有机硅改性聚酰亚胺在硅氧烷含量大约45％时(wt％)的主要特性。氟化芳香族拥有最好的耐热变色性，全脂肪族拥有最佳的光透过率。氟化芳香族同时拥有较高的拉伸强度与弹性模量。表4～表6所示的机械强度的测试条件：有机硅改性聚酰亚胺树脂组合物的厚度为50μm、宽度为10mm，采用ISO527-3:1995标准进行膜的拉伸性能测试，拉伸速度为10mm/min。Different silicone modified polyimide resins have different characteristics. Table 4 lists fluorinated aromatic, semi-aliphatic and fully aliphatic three silicone modified polyimides with a siloxane content of about 45. The main characteristic of % (wt%). Fluorinated aromatics have the best heat-resistant discoloration, and all aliphatics have the best light transmission. Fluorinated aromatics also have high tensile strength and modulus of elasticity. Test conditions for mechanical strength shown in Tables 4 to 6: The thickness of the silicone-modified polyimide resin composition was 50 μm and the width was 10 mm, and the tensile properties of the film were tested using the ISO 527-3:1995 standard. The stretching speed is 10 mm/min.
表4Table 4
Figure PCTCN2018123817-appb-000008
Figure PCTCN2018123817-appb-000008
灯丝制作时会先通过固晶胶将LED芯片、电极固定在有机硅改性聚酰亚胺树脂 组合物所形成的灯丝基材上，后再进行打线程序，用导线对相邻LED芯片、LED芯片与电极之间进行电性连接。为保证固晶与打线品质，提高产品质量，灯丝基材的弹性模量应具一定的水平，以抵抗固晶与打线制程的下压力度，因此，灯丝基材的弹性模量应大于2.0Gpa，优选2～6Gpa，最优选4～6Gpa。表5显示不同硅氧烷含量以及有无粒子(荧光粉与氧化铝)添加对有机硅改性聚酰亚胺树脂组合物弹性模量的影响。在没有添加荧光粉与氧化铝粒子的条件下，有机硅改性聚酰亚胺树脂组合物的弹性模量皆小于2.0Gpa，且随着硅氧烷含量的增加，弹性模量呈现下降的趋势，即有机硅改性聚酰亚胺树脂组合物有被软化的趋势。然而在有添加荧光粉与氧化铝粒子的条件下，有机硅改性聚酰亚胺树脂组合物的弹性模量皆可大幅提升且都大于2.0Gpa。因此，硅氧烷含量的增加可以软化有机硅改性聚酰亚胺树脂组合物，有利于添加更多的填充物，如添加更多的荧光粉或散热粒子。为使基材具有较优的弹性模量及热传导率，关于散热粒子的粒径，可以适当选择粒度分布和混合比例，使得平均粒径在0.1μm至100μm的范围内，或是1μm至50μm的范围内。When the filament is produced, the LED chip and the electrode are first fixed on the filament substrate formed by the silicone modified polyimide resin composition by a solid crystal glue, and then the wire bonding process is performed, and the adjacent LED chip is used by the wire. The LED chip is electrically connected to the electrode. In order to ensure the quality of solid crystal and wire and improve the quality of the product, the elastic modulus of the filament substrate should have a certain level to resist the lower pressure of the solid crystal and wire bonding process. Therefore, the elastic modulus of the filament substrate should be greater than 2.0 Gpa, preferably 2 to 6 GPa, most preferably 4 to 6 GPa. Table 5 shows the effect of different siloxane contents and the presence or absence of particles (phosphor and alumina) addition on the elastic modulus of the silicone-modified polyimide resin composition. The elastic modulus of the silicone modified polyimide resin composition is less than 2.0Gpa under the condition that no phosphor and alumina particles are added, and the elastic modulus decreases with the increase of the siloxane content. That is, the silicone-modified polyimide resin composition has a tendency to be softened. However, under the condition of adding phosphor and alumina particles, the elastic modulus of the silicone-modified polyimide resin composition can be greatly improved and both are greater than 2.0 GPa. Therefore, an increase in the siloxane content can soften the silicone-modified polyimide resin composition, facilitating the addition of more fillers, such as adding more phosphors or heat-dissipating particles. In order to obtain a superior elastic modulus and thermal conductivity of the substrate, the particle size distribution and the mixing ratio may be appropriately selected with respect to the particle diameter of the heat dissipating particles, so that the average particle diameter is in the range of 0.1 μm to 100 μm, or 1 μm to 50 μm. Within the scope.
为使LED灯丝具有较佳的弯折性能，灯丝基材的断裂伸长率应大于0.5％，优选1～5％，最优选1.5～5％。请参见表5，在没有添加荧光粉与氧化铝粒子的条件下，有机硅改性聚酰亚胺树脂组合物具有优良的断裂伸长率，且增加硅氧烷的含量，断裂伸长率也随着增加，弹性模量随着降低，从而减少翘曲现象的发生。相反的，在有添加荧光粉与氧化铝粒子的条件下，有机硅改性聚酰亚胺树脂组合物反而呈现断裂伸长率下降，弹性模量增加，增加翘曲现象。In order for the LED filament to have better bending properties, the filament substrate should have an elongation at break of greater than 0.5%, preferably from 1 to 5%, most preferably from 1.5 to 5%. Referring to Table 5, the silicone-modified polyimide resin composition has excellent elongation at break and increases the content of siloxane and elongation at break without adding phosphor and alumina particles. As it increases, the modulus of elasticity decreases, thereby reducing the occurrence of warpage. On the contrary, under the condition that the phosphor and the alumina particles are added, the silicone-modified polyimide resin composition exhibits a decrease in elongation at break, an increase in elastic modulus, and an increase in warpage.
表5table 5
Figure PCTCN2018123817-appb-000009
Figure PCTCN2018123817-appb-000009
添加热固化剂除了提高有机硅改性聚酰亚胺树脂的耐热性和玻璃化转换温度外， 也可以提升有机硅改性聚酰亚胺树脂的机械性质，例如提高拉伸强度、弹性模量与断裂伸长率。而添加不同热固化剂，也会有不同的提升效果。表6显示添加了不同的热固化剂之后，有机硅改性聚酰亚胺树脂组合物的拉伸强度与断裂伸长率皆有不同的表现的效果。全脂肪族有机硅改性聚酰亚胺在添加热固化剂EHPE3150之后有较佳的拉伸强度，而添加热固化剂KF105有较佳的伸长率。Adding a thermosetting agent can improve the mechanical properties of the silicone-modified polyimide resin, such as increasing the tensile strength and elastic modulus, in addition to improving the heat resistance and glass transition temperature of the silicone-modified polyimide resin. Amount and elongation at break. Adding different heat curing agents will also have different lifting effects. Table 6 shows the effects of the tensile strength and the elongation at break of the silicone-modified polyimide resin composition after the addition of different heat curing agents. The fully aliphatic silicone-modified polyimide has a better tensile strength after the addition of the heat curing agent EHPE 3150, and the addition of the heat curing agent KF105 has a better elongation.
表6Table 6
Figure PCTCN2018123817-appb-000010
Figure PCTCN2018123817-appb-000010
表7：BPA的具体信息Table 7: Specific information of BPA
Figure PCTCN2018123817-appb-000011
Figure PCTCN2018123817-appb-000011
表8：2021P的具体信息Table 8: 2021P specific information
Figure PCTCN2018123817-appb-000012
Figure PCTCN2018123817-appb-000012
表9：EHPE3150、EHPE3150CE的具体信息Table 9: Specific information of EHPE3150 and EHPE3150CE
Figure PCTCN2018123817-appb-000013
Figure PCTCN2018123817-appb-000013
表10：PAME、KF8010，X22-161A，X22-161B，NH15D，X22-163，X22-163A，KF-105的具体信息，屈折率又可称为折射率。Table 10: Specific information of PAME, KF8010, X22-161A, X22-161B, NH15D, X22-163, X22-163A, KF-105, the inflection rate may also be referred to as refractive index.
Figure PCTCN2018123817-appb-000014
Figure PCTCN2018123817-appb-000014
本发明的有机硅改性聚酰亚胺树脂组合物可以以膜形态或者附在载体上一起作为基材使用。膜的形成过程包括三道工序，(a)涂布工序：将上述有机硅改性聚酰亚胺树脂组合物在剥离体上展开、涂布形成膜；(b)干燥加热工序：将膜与剥离体一起进行加热干燥以除去膜中的溶剂；(c)剥离：干燥完成之后将膜从剥离体上进行剥离得到膜形态的有机硅改性聚酰亚胺树脂组合物。上述剥离体可采用离心膜或其它与有机硅改性聚酰亚胺树脂组合物不发生化学反应的材料，例如可以采用PET离心膜。The silicone-modified polyimide resin composition of the present invention can be used as a substrate together in a film form or attached to a carrier. The film formation process includes three steps, and (a) a coating step of developing the above-mentioned silicone-modified polyimide resin composition on a release body to form a film; (b) drying and heating process: film and The release body was heat-dried together to remove the solvent in the film; (c) Peeling: After the completion of the drying, the film was peeled off from the release body to obtain a film-formed silicone-modified polyimide resin composition. The above-mentioned exfoliated body may be a centrifugal film or other material that does not chemically react with the silicone-modified polyimide resin composition, and for example, a PET centrifugal film may be used.
有机硅改性聚酰亚胺树脂组合物附在载体上得到组成膜，组成膜可作为基材使用，组成膜的形成过程包括两道工序：(a)涂布工序：将上述有机硅改性聚酰亚胺树脂组合物在载体上展开、涂布形成组成膜；(b)干燥加热工序：将组成膜进行加热干燥以除去膜中的溶剂。The silicone-modified polyimide resin composition is attached to a carrier to obtain a constituent film, and the constituent film can be used as a substrate. The formation process of the constituent film includes two steps: (a) coating step: modifying the above-mentioned silicone The polyimide resin composition is developed on a carrier and coated to form a composition film; (b) a drying and heating process: the composition film is dried by heating to remove the solvent in the film.
作为涂布工序中的涂布方式，可以使用辊涂机、模涂布机、刮刀涂层机等卷对卷方式的涂布装置，或者印刷法、喷墨法、点胶法、喷涂法等简便的涂布方式。As a coating method in the coating step, a roll-to-roll coating device such as a roll coater, a die coater, or a knife coater, or a printing method, an inkjet method, a dispensing method, a spray method, or the like can be used. Simple coating method.
上述加热干燥工序对应的干燥方法，可以选择真空干燥法，加热干燥法等。加热方法可采用电加热器等热源或热媒加热产生热能，并使其产生间接对流，或者使用从热源发出的红外线来加热的热辐射方式。In the drying method corresponding to the heating and drying step, a vacuum drying method, a heating drying method, or the like can be selected. The heating method may be performed by heating a heat source such as an electric heater or a heat medium to generate heat energy, causing indirect convection, or using a heat radiation method heated by infrared rays emitted from a heat source.
上述有机硅改性聚酰亚胺树脂组合物可通过涂布后干燥固化而获得高导热性膜(复合膜)，以获得具有以下任一或其组合的特性：优异的透光性、耐化学性、耐热性、导热性、膜机械性能和耐旋光性。干燥固化工艺所采用的温度和时间可以根据有机硅改性聚酰亚胺树脂组合物中的溶剂和涂布的膜厚适当选择，可根据有机硅改性聚酰亚胺树脂组合物干燥固化前后的重量变化以及红外谱图上热固化剂官能团的峰值变化来确定是否干燥固化完全，例如以环氧树脂作为热固化剂时，有机硅改性聚酰亚胺树脂组合物干燥固化前后的重量差值等于所添加溶剂的重量和干燥固化前后环氧基团峰值的变大或变小来确定是否干燥固化完全。The above silicone-modified polyimide resin composition can be obtained by drying and curing after coating to obtain a highly thermally conductive film (composite film) to obtain characteristics having any one or a combination of the following: excellent light transmittance and chemical resistance. Properties, heat resistance, thermal conductivity, mechanical properties of the film and resistance to light. The temperature and time used in the drying and curing process can be appropriately selected according to the solvent and the applied film thickness in the silicone-modified polyimide resin composition, and can be dried before and after curing according to the silicone-modified polyimide resin composition. The change in weight and the peak change of the thermosetting agent functional group on the infrared spectrum to determine whether the dry curing is complete, for example, when the epoxy resin is used as a heat curing agent, the difference in weight before and after drying of the silicone modified polyimide resin composition The value is equal to the weight of the added solvent and the increase or decrease in the peak of the epoxy group before and after the dry curing to determine whether the dry curing is complete.
于一实施例中，在氮气气氛下进行酰胺化反应或在合成有机硅改性聚酰亚胺树脂组合物时采用真空脱泡方法或两种方法均采用，可使得有机硅改性聚酰亚胺树脂组合物复合膜中泡孔的体积百分比为5～20％，优选5～10％。如图25B所示，采用有机硅改性聚酰亚胺树 脂组合物复合膜作为LED软灯丝的基材(如前述各种LED灯丝实施例)，基材420b具有上表面420b1及相对的下表面420b2，图25A所示为在基材表面喷金，在Tescan公司的vega3电镜下观察所得到的基材的表面形态。由图25B和图25A所示的基材表面SEM图可知，基材中存在泡孔4d，泡孔4d占基材420b的体积含量百分比为5～20％，优选5～10％，泡孔4d的横截面为无规则形状，如图25B所示为基材420b的横截面示意图，图25B中的虚线为基准线，基材的上表面420b1包括第一区域4a和第二区域4b，第二区域4b包括泡孔4d，第一区域4a的表面粗糙度小于第二区域4b的表面粗糙度，LED芯片发出的光经第二区域的泡孔进行散射，出光更加均匀；基材的下表面420b2包括第三区域4c，第三区域4c的表面粗糙度大于第一区域4a的表面粗糙度，当LED芯片放置第一区域4a时，因第一区域4a较平整，因而有利于后续的固定打线，当LED芯片放置在第二区域4b、第三区域4c时，固晶时固晶胶与基材的接触面积大，能增加固晶胶与基材的结合强度，因而，将LED芯片放置在上表面420b1上，能同时保证固晶打线及固晶胶与基材的结合强度。采用有机硅改性聚酰亚胺树脂组合物作为LED软灯丝基材时，LED芯片发出的光经基材中的气泡进行散射，出光更加均匀，同时能进一步改善眩光现象。于一实施例中，可采用含有硅树脂或钛酸酯耦合剂处理基层420b的表面，优选采用含有甲醇的硅树脂或含有甲醇的钛酸酯耦合剂，也可采用含有异丙醇的硅树脂，处理过的基层的截面图如图25C所示，基层的上表面420b1具有较均一的表面粗糙度，基层的下表面420b2包括第三区域4c和第四区域4e，第三区域4c的表面粗糙度大于第四区域4e的表面粗糙度。基层的上表面420b1的表面粗糙度可等于第四区域4e的表面粗糙度。将基层420b的表面进行处理，可使反应高、强度高的物质进入部分孔洞4d中，从而提高基层的强度。In one embodiment, the amidation reaction is carried out under a nitrogen atmosphere or the vacuum defoaming method or both methods are employed in synthesizing the silicone-modified polyimide resin composition, so that the silicone-modified polyamido can be made. The volume percentage of cells in the composite film of the amine resin composition is 5 to 20%, preferably 5 to 10%. As shown in FIG. 25B, a silicone-modified polyimide resin composition composite film is used as a substrate of an LED flexible filament (such as the various LED filament embodiments described above), and the substrate 420b has an upper surface 420b1 and an opposite lower surface. 420b2, Fig. 25A shows the surface morphology of the obtained substrate by spraying gold on the surface of the substrate and under the electron microscope of Tescan. It can be seen from the SEM image of the surface of the substrate shown in FIG. 25B and FIG. 25A that the cell 4d is present in the substrate, and the cell 4d accounts for 5 to 20% by volume of the substrate 420b, preferably 5 to 10%, and the cell 4d. The cross section is a random shape, as shown in FIG. 25B is a schematic cross-sectional view of the substrate 420b, the broken line in FIG. 25B is a reference line, and the upper surface 420b1 of the substrate includes a first region 4a and a second region 4b, and a second The region 4b includes the cell 4d, the surface roughness of the first region 4a is smaller than the surface roughness of the second region 4b, and the light emitted by the LED chip is scattered by the cells of the second region, and the light is more uniform; the lower surface 420b2 of the substrate Including the third region 4c, the surface roughness of the third region 4c is greater than the surface roughness of the first region 4a. When the LED chip is placed in the first region 4a, since the first region 4a is relatively flat, it is advantageous for the subsequent fixed wire bonding. When the LED chip is placed in the second region 4b and the third region 4c, the contact area of the solid crystal glue and the substrate is large when the crystal is fixed, and the bonding strength between the solid crystal glue and the substrate can be increased, and thus, the LED chip is placed on the LED chip. On the upper surface 420b1, the solid crystal bonding and the solid bonding glue can be simultaneously ensured The bonding strength of the substrate. When the silicone modified polyimide resin composition is used as the LED flexible filament substrate, the light emitted by the LED chip is scattered by the bubbles in the substrate, and the light is more uniform, and the glare phenomenon can be further improved. In one embodiment, the surface of the base layer 420b may be treated with a silicone resin or a titanate coupling agent, preferably a silicone resin containing methanol or a titanate coupling agent containing methanol, or a silicone resin containing isopropyl alcohol. The cross-sectional view of the treated base layer is as shown in Fig. 25C, the upper surface 420b1 of the base layer has a relatively uniform surface roughness, and the lower surface 420b2 of the base layer includes the third region 4c and the fourth region 4e, and the surface of the third region 4c is rough. The degree is greater than the surface roughness of the fourth region 4e. The surface roughness of the upper surface 420b1 of the base layer may be equal to the surface roughness of the fourth region 4e. By treating the surface of the base layer 420b, a substance having high reaction and high strength can be introduced into the partial pores 4d, thereby increasing the strength of the base layer.
采用真空脱泡方法制备有机硅改性聚酰亚胺树脂组合物时，真空脱泡时的真空度为-0.5～-0.09MPa，优选-0.2～-0.09MPa。制备有机硅改性聚酰亚胺树脂组合物所用原料重量总和小于等于250g时，公转速度为1200～2000rpm，自转速度为1200～2000rpm，真空脱泡时间为3～8min。既能保持膜中保留一定的气泡以增加出光均匀性，又能保持较佳的力学性能。根据制备有机硅改性聚酰亚胺树脂组合物所需原料的总重量可做适当调整，一般总重量越高，真空度可降低、搅拌时间和搅拌速度可适当增加。When the silicone-modified polyimide resin composition is prepared by a vacuum defoaming method, the degree of vacuum at the time of vacuum defoaming is -0.5 to -0.09 MPa, preferably -0.2 to -0.09 MPa. When the total weight of the raw materials used for preparing the silicone-modified polyimide resin composition is 250 g or less, the revolution speed is 1200 to 2000 rpm, the rotation speed is 1200 to 2000 rpm, and the vacuum defoaming time is 3 to 8 minutes. It can keep a certain bubble in the film to increase the uniformity of light and maintain better mechanical properties. The total weight of the raw materials required for preparing the silicone-modified polyimide resin composition can be appropriately adjusted. Generally, the higher the total weight, the lower the degree of vacuum, the stirring time and the stirring speed can be appropriately increased.
根据本发明，可以获得作为LED软灯丝基材所需的透光率，耐化学性，耐热变色性，导热性，膜机械性能和耐旋光性优异的树脂。此外，可以通过诸如印刷法涂布法、喷墨法或点胶法等的简便涂布方法来形成高导热性树脂膜。According to the present invention, a resin which is excellent in light transmittance, chemical resistance, heat discoloration resistance, thermal conductivity, film mechanical properties and optical rotation resistance which are required as a substrate for an LED flexible filament can be obtained. Further, the highly thermally conductive resin film can be formed by a simple coating method such as a printing method, an inkjet method, or a dispensing method.
有机硅改性聚酰亚胺树脂组合物复合膜作为灯丝基材(或基层)时，LED芯片为六面发光体，LED灯丝制作时，LED芯片的至少二面被顶层包裹，现有LED灯丝在点亮时，会出现顶层与基层色温不均匀的现象，或基层会出现颗粒感，因而作为灯丝基材的复合膜需要具备优异的透明性。在其它实施例中，可在有机硅改性聚酰亚胺的主链上引入砜基、非共平面结构、间位取代二胺等手段以提高有机硅改性聚酰亚胺树脂组合物的透明性。此外为使采用该灯丝的球泡灯实现全周光发光效果，作为基材的复合膜需具备一定的柔性，因此可在 有机硅改性聚酰亚胺的主链中引入醚基(如4,4'-双(4-氨基-2-三氟甲基苯氧基)二苯醚)、羰基、亚甲基等柔性结构。在其它实施例中，也可选用含有吡啶环的二胺或二酐，吡啶环的刚性结构可提高复合膜的机械性能，同时与强极性基团(例如-F)连用，可使复合膜具有优异的透光性能，具有吡啶结构的酸酐如2,6-双(3’,4’-二羧基苯基)-4-(3”,5”-双三氟甲基苯基)吡啶二酐。When the silicone-modified polyimide resin composition composite film is used as a filament substrate (or a base layer), the LED chip is a six-sided illuminator, and at least two sides of the LED chip are wrapped by the top layer when the LED filament is produced, and the existing LED filament When the light is turned on, the color temperature of the top layer and the base layer may be uneven, or the base layer may be grainy, so that the composite film as the filament substrate needs to have excellent transparency. In other embodiments, a sulfone group, a non-coplanar structure, a meta-substituted diamine, or the like may be introduced on the main chain of the silicone-modified polyimide to enhance the silicone-modified polyimide resin composition. Transparency. In addition, in order to realize the full-period light-emitting effect of the bulb using the filament, the composite film as the substrate needs to have a certain flexibility, so that an ether group can be introduced in the main chain of the silicone-modified polyimide (such as 4). , 4'-bis(4-amino-2-trifluoromethylphenoxy)diphenyl ether), carbonyl, methylene and other flexible structures. In other embodiments, a diamine or dianhydride containing a pyridine ring may also be selected, and the rigid structure of the pyridine ring may improve the mechanical properties of the composite film, and may be used in combination with a strong polar group (for example, -F) to form a composite film. An acid anhydride having excellent fluorophore properties such as 2,6-bis(3',4'-dicarboxyphenyl)-4-(3",5"-bistrifluoromethylphenyl)pyridine anhydride.
以下说明请同时参见图6A，LED灯丝400顶层420a为至少一层的层状结构。所述层状结构可选自：可塑形性高的荧光粉胶、可塑形性低的荧光粉膜、透明层或是此三者的任意层状组合。所述荧光粉胶/荧光粉膜包含以下成分：胶、荧光粉、无机氧化物纳米粒子。胶可为但不限定为硅胶。于一实施例中，胶中可包含10％Wt或更低的上述有机硅改性聚酰亚胺，以增加灯丝整体的硬度、绝缘性、热稳定性以及机械强度，有机硅改性聚酰亚胺的固含量可为5-40％Wt，旋转黏度可为5-20Pa.S。无机氧化纳米粒子426可为但不限定为氧化铝、氮化铝粒子，颗粒的粒径可为100-600纳米或是0.1至100微米，其作用为促进灯丝的散热，掺入的无机散热粒子可具有多种尺寸的粒径。亦可适当地进行调整，使两者在硬度(例如通过封装胶组成或是荧光粉比例来调整)、转换波长、组成物粒子颗粒大小、厚度、透光度等特征上视情形差异化。荧光粉膜与荧光粉胶在顶层的透过率可视需要调整，例如荧光粉胶或荧光粉膜在顶层的透过率为大于20％、50％、或70％。荧光粉胶的邵氏硬度可为D40-70；荧光粉胶的厚度可为0.2-1.5公厘；而荧光粉膜的邵氏硬度可为D20-70。荧光粉膜的厚度可为0.1-0.5公厘；折射率为1.4或更高；透光率为40％-95％。透明层(胶层、绝缘层)可由高透光树脂例如硅胶、上述所述有机硅改性聚酰亚胺或其组合而构成。于一实施例中，透明层可为作为折射率匹配层，具有调整灯丝出光效率的作用。For the following description, please refer to FIG. 6A at the same time, the top layer 420a of the LED filament 400 is a layered structure of at least one layer. The layered structure may be selected from the group consisting of a highly moldable phosphor paste, a low formable phosphor film, a transparent layer or any layered combination of the three. The phosphor paste/phosphor film comprises the following components: a gel, a phosphor, and inorganic oxide nanoparticles. The glue can be, but is not limited to, silica gel. In one embodiment, the silicone-modified polyimide may be included in the glue by 10% Wt or less to increase the hardness, insulation, thermal stability and mechanical strength of the filament as a whole, and the silicone modified polyacyl group. The imine may have a solid content of 5 to 40% Wt and a rotational viscosity of 5 to 20 Pa.s. The inorganic oxidized nanoparticles 426 can be, but are not limited to, aluminum oxide and aluminum nitride particles. The particle size of the particles can be 100-600 nm or 0.1-100 micrometers, and the effect is to promote heat dissipation of the filament and incorporate inorganic heat-dissipating particles. It can have particle sizes in a variety of sizes. It is also possible to appropriately adjust the difference between the two in terms of hardness (for example, adjustment by encapsulating composition or phosphor ratio), conversion wavelength, particle size, thickness, and transmittance of the composition. The transmittance of the phosphor film and the phosphor paste on the top layer can be adjusted as needed. For example, the transmittance of the phosphor paste or the phosphor film on the top layer is greater than 20%, 50%, or 70%. The Shore hardness of the phosphor can be D40-70; the thickness of the phosphor can be 0.2-1.5 mm; and the Shore hardness of the phosphor film can be D20-70. The phosphor film may have a thickness of 0.1 to 0.5 mm; a refractive index of 1.4 or higher; and a light transmittance of 40% to 95%. The transparent layer (glue layer, insulating layer) may be composed of a high light transmissive resin such as silica gel, the above-described silicone modified polyimide, or a combination thereof. In one embodiment, the transparent layer can function as an index matching layer with the effect of adjusting the light output efficiency of the filament.
请继续参见图6A，LED灯丝400基层420b为至少一层的层状结构，所述层状结构可选自：可塑形性高的荧光粉胶、可塑形性低的荧光粉膜、透明层或是此三者的任意层状组合；所述荧光粉胶/荧光粉膜包含以下成分：有机硅改性聚酰亚胺、荧光粉、无机氧化物纳米粒子。于一实施例中，有机硅改性聚酰亚胺可用上述所述的有机硅改性聚酰亚胺树脂组合物替代。无机氧化纳米粒子可为但不限定为氧化铝、氮化铝粒子，颗粒的粒径可为100-600纳米或是0.1至100微米，其作用为促进灯丝的散热，掺入的无机散热粒子可具有多种尺寸的粒径。荧光粉膜与荧光粉胶在基层420b的光透过率可视需要调整，例如荧光粉胶或荧光粉膜在基层420b的透过率为大于20％、50％、或70％。透明层(胶层、绝缘层)可由高透光树脂例如硅胶、上述所述的有机硅改性聚酰亚胺或其组合而构成。于一实施例中，透明层可为作为折射率匹配层，具有调整灯丝出光效率的作用。于一实施例中，基层420b可为上述所述的有机硅改性聚酰亚胺树脂组合物复合膜。Continuing to refer to FIG. 6A, the LED filament 400 base layer 420b is a layered structure of at least one layer, and the layered structure may be selected from the group consisting of a highly moldable phosphor paste, a low moldable phosphor film, a transparent layer or It is any layered combination of the three; the phosphor paste/phosphor film comprises the following components: a silicone-modified polyimide, a phosphor, and an inorganic oxide nanoparticle. In one embodiment, the silicone modified polyimide may be replaced with the silicone modified polyimide resin composition described above. The inorganic oxidized nanoparticles can be, but are not limited to, aluminum oxide and aluminum nitride particles. The particle size of the particles can be 100-600 nm or 0.1-100 micrometers, and the function is to promote heat dissipation of the filament, and the inorganic heat-dissipating particles can be incorporated. It has particle sizes in a variety of sizes. The light transmittance of the phosphor film and the phosphor paste in the base layer 420b may be adjusted as needed. For example, the transmittance of the phosphor paste or the phosphor film in the base layer 420b is greater than 20%, 50%, or 70%. The transparent layer (glue layer, insulating layer) may be composed of a high light transmissive resin such as silica gel, the above-described silicone modified polyimide, or a combination thereof. In one embodiment, the transparent layer can function as an index matching layer with the effect of adjusting the light output efficiency of the filament. In one embodiment, the base layer 420b may be the above-described silicone-modified polyimide resin composition composite film.
以上关于将有机硅改性聚酰亚胺应用于灯丝结构的说明，仅以图6A为说明代表，然而并不以此为限。同样说明内容适用于本发明所有类似的LED灯丝结构。The above description of the application of the silicone-modified polyimide to the filament structure is merely represented by the description of FIG. 6A, but is not limited thereto. The same description applies to all similar LED filament structures of the present invention.
前述各实施例中的LED灯丝结构，主要可应用于LED球泡灯产品，使所述LED球泡灯透过单条LED灯丝的可挠曲弯折特性，达成全周光的发光效果。以下即进一步说明将 前述LED灯丝应用于LED球泡灯的具体实施方式。The LED filament structure in the foregoing embodiments can be mainly applied to an LED bulb lamp product, and the LED bulb lamp can pass the flexible bending property of a single LED filament to achieve a full-circumference luminous effect. The following is a further description of a specific embodiment in which the aforementioned LED filament is applied to an LED bulb.
请参考图26A，图26A为LED球泡灯20c的第一实施例的结构示意图。依据第一实施例，LED球泡灯20c包括灯壳12、连接灯壳12的灯头16、设于灯壳12内的至少二导电支架51a、51b、驱动电路518、支撑部(包括悬臂15、芯柱19)、及单一发光部(即LED灯丝)100。驱动电路518是电性连接至导电支架51a、51b与灯头16。芯柱19另具有一垂直延伸至灯壳12中心的立杆19a，立杆19a位于灯头16的中心轴线上，或者立竿19a位于LED球泡灯20c的中心轴线上。多个悬臂15位于立竿19a与LED灯丝100之间，这些悬臂15用来支撑LED灯丝100且可以使LED灯丝100维持预设的曲线与形状。每一个悬臂15包括相对的第一端与第二端，每一个悬壁15的第一端连接至立杆19a，而每一悬臂15的第二端连接至该LED灯丝100。Referring to FIG. 26A, FIG. 26A is a schematic structural view of a first embodiment of an LED bulb lamp 20c. According to the first embodiment, the LED bulb 20c includes a lamp housing 12, a lamp cap 16 connecting the lamp housing 12, at least two conductive brackets 51a, 51b disposed in the lamp housing 12, a driving circuit 518, and a support portion (including the cantilever 15, The stem 19) and a single light emitting portion (ie, LED filament) 100. The driving circuit 518 is electrically connected to the conductive brackets 51a, 51b and the base 16. The stem 19 further has a upright 19a extending vertically to the center of the lamp envelope 12, the upright 19a being located on the central axis of the base 16, or the stand 19a being located on the central axis of the LED bulb 20c. A plurality of cantilevers 15 are located between the uprights 19a and the LED filaments 100. These cantilevers 15 are used to support the LED filaments 100 and maintain the LED filaments 100 in a predetermined curve and shape. Each of the cantilevers 15 includes opposing first and second ends, a first end of each of the cantilevered walls 15 being coupled to the uprights 19a and a second end of each of the cantilevers 15 being coupled to the LED filaments 100.
灯壳12是可采用透光性较佳或导热性较佳的材料，例如但不限于玻璃或塑料。实施时，亦可在灯壳12内掺杂带有金黄色材料或灯壳表面镀上一层黄色薄膜，以适量吸收部分LED芯片所发出的蓝光，以降低LED球泡灯20c所发出光线的色温。在本发明其他实施例中，灯壳12包括发光材料层(图未示)，所述发光材料层可依设计需求或工艺可行性形成在灯壳12内表面、外表面上，或甚至融合于灯壳12本体材料中。所述发光材料层包括低再吸收的(在文中缩写为LR)半导体纳米晶体，在本文中称为LR量子点。LR量子点为特别设计的量子点，所述量子点包括核、保护壳与吸光壳，吸光壳设置于核和保护壳之间。核可发射光，而吸光壳可吸收激发光，发射光波长比激发光波长更长，保护壳则可提供光稳定性。低再吸收是采用吸亮度比值以实现该目标。理想地，纳米晶体发射器从激发光源中吸收所需数量的高能量光子并且在更低的能量窗内根本未吸收任何光子。在一个选择中，将“吸亮度比值”定义为激发光源的峰值处的吸亮度与550nm处的吸亮度的比值。如果纳米晶体的发射峰位于比550nm更高的波长处，那么该选择有效。选择550nm的原因在于，550nm为在周围环境条件下人眼最敏感的波长。在本公开中，将该吸亮度比值称为“Iexcitation/I550”。例如，如果蓝色LED的激发峰值在450mm处(对于高功率和高效率蓝色LED的共同峰值位置)，那么相关吸亮度比值为“I450/I550”。在某些实施方式中，有用的LR量子点具有的吸亮度比值大于大约8，适当地等于或大于大约10，或者等于或甚至大于大约15。可选地，人们可将吸亮度比值定义“在发射峰处的吸亮度比值”，其通过将激发光源的峰值处的吸亮度与纳米晶体的发射峰处的吸亮度相除来计算得到的，在本公开中，将该参数记为“Iexcitation/Iemission”。例如如果激发光源的峰值为450nm，那么“在发射峰处的吸亮度比值”为“I450/Iemission”。可取的，在发射峰处的吸亮度比值大于8，适当地大于10，或者甚至大于15。The lamp housing 12 is preferably a material that is preferably light transmissive or thermally conductive, such as, but not limited to, glass or plastic. In practice, the lamp housing 12 may be doped with a golden yellow material or the surface of the lamp housing may be coated with a yellow film to absorb a portion of the blue light emitted by the LED chip to reduce the light emitted by the LED bulb 20c. Color temperature. In other embodiments of the present invention, the lamp housing 12 includes a layer of luminescent material (not shown), which may be formed on the inner surface, the outer surface of the lamp housing 12, or even integrated in accordance with design requirements or process feasibility. The lamp housing 12 is in the body material. The luminescent material layer comprises a low resorbed (abbreviated herein as LR) semiconductor nanocrystal, referred to herein as an LR quantum dot. The LR quantum dots are specially designed quantum dots, and the quantum dots include a core, a protective shell and a light absorbing shell, and the light absorbing shell is disposed between the core and the protective shell. The core emits light, and the light absorbing shell absorbs the excitation light. The wavelength of the emitted light is longer than the wavelength of the excitation light, and the protective shell provides light stability. Low reabsorption is achieved by using a ratio of absorbance to achieve this goal. Ideally, the nanocrystal emitter absorbs the required number of high energy photons from the excitation source and does not absorb any photons at all in the lower energy window. In one option, the "brightness ratio" is defined as the ratio of the absorbance at the peak of the excitation source to the absorbance at 550 nm. This selection is effective if the emission peak of the nanocrystal is at a higher wavelength than 550 nm. The reason for choosing 550 nm is that 550 nm is the wavelength most sensitive to the human eye under ambient conditions. In the present disclosure, the ratio of the light absorption ratio is referred to as "Iexcitation/I550". For example, if the excitation peak of the blue LED is at 450 mm (for a common peak position of the high power and high efficiency blue LED), then the associated brightness ratio is "I450/I550". In certain embodiments, useful LR quantum dots have an absorbance ratio greater than about 8, suitably equal to or greater than about 10, or equal to or even greater than about 15. Alternatively, one can define the ratio of the absorbance as "the ratio of the absorbance at the emission peak", which is calculated by dividing the absorbance at the peak of the excitation source by the absorbance at the emission peak of the nanocrystal, In the present disclosure, this parameter is referred to as "Iexcitation/Iemission". For example, if the peak value of the excitation light source is 450 nm, then the "absorption ratio at the emission peak" is "I450/Iemission". Preferably, the ratio of absorbance at the emission peak is greater than 8, suitably greater than 10, or even greater than 15.
核为半导体纳米晶体材料，通常为金属材料和非金属材料的组合，且可通过使阳离子前体和阴离子前体相结合来制备核。所述金属材料可选自Zn、Cd、Hg、Ga、In、Ti、Pb或稀土。所述非金属材料可选自O、S、Se、P、As或Te。阳离子前体离子可包括所有过渡金属和稀土元素，并且阴离子前体离子可选自O、S、Se、Te、N、P、As、F、CL以及Br。并且，阳离子前体可包括元素或化合物，例如，元素、共价化合物或离子化合物，其包括氧 化物、氢氧化物、配位化合物或金属盐，这些化合物在所产生的纳米晶体核或壳材料中是作为正电性元素的源。The core is a semiconductor nanocrystalline material, typically a combination of a metallic material and a non-metallic material, and the core can be prepared by combining a cationic precursor and an anionic precursor. The metal material may be selected from the group consisting of Zn, Cd, Hg, Ga, In, Ti, Pb or rare earth. The non-metallic material may be selected from O, S, Se, P, As or Te. The cationic precursor ion may include all transition metals and rare earth elements, and the anionic precursor ions may be selected from the group consisting of O, S, Se, Te, N, P, As, F, CL, and Br. Also, the cationic precursor may include an element or a compound, for example, an element, a covalent compound, or an ionic compound including an oxide, a hydroxide, a coordination compound, or a metal salt, the resulting nanocrystalline core or shell material Medium is the source of positively charged elements.
阳离子前体溶液可包括金属氧化物、金属卤化物、金属氮化物、金属氨络合物、金属胺、金属酰胺、金属酰亚胺、金属羧酸盐、金属乙酰丙酮化物、金属二硫醇盐、金属羰基、金属氰化物、金属异腈、金属丁腈、金属过氧化物、金属氢氧化物、金属氢化物、金属乙醚络合物、金属二醚络合物、金属三醚络合物、金属碳酸盐、金属硝酸盐、金属亚硝酸盐、金属硫酸盐、金属醇盐、金属三甲基硅氧化物、金属硫醇盐、金属二硫醇、金属二硫化物、金属氨基甲酸酯、金属二羟基氨基甲酸酯、金属吡啶络合物、金属二吡啶络合物、金属邻二氮菲络合物、金属三联吡啶络合物、金属二胺络合物、金属三胺络合物、金属二亚胺、金属吡啶二亚胺、金属吡唑硼酸盐、金属二(吡唑)硼酸盐、金属三(吡唑)硼酸盐、金属亚硝酰基、金属硫代氨基甲酸酯、金属二氮丁二烯、金属二硫代氨基甲酸酯、金属二烃基乙酰胺、金属二烃基甲酰胺、金属甲脒、金属磷化氢络合物、金属砷化氢络合物、金属二膦络合物、金属联胂络合物、金属草酸、金属咪唑、金属吡唑特、金属希夫碱络合物、金属卟啉、金属酞菁、金属亚酞菁、金属吡啶甲酸、金属哌啶络合物、金属吡唑基、金属水杨醛、金属乙二胺、金属三氟甲磺酸化合物或其任意组合。优选地，阳离子前驱溶液可包括金属氧化物、金属碳酸盐、金属重碳酸盐、金属硫酸盐、金属亚硫酸盐、金属磷酸盐、金属亚磷酸盐、金属卤化物、金属羧酸盐、金属氢氧化物、金属醇盐、金属硫醇盐、金属酰胺、金属酰亚胺、金属烷基、金属芳基、金属配位化合物、金属溶剂化物、金属盐或其组合。最优选地，阳离子前体为金属氧化物或金属盐前体，并且可选自硬脂酸锌、肉豆蔻酸锌、醋酸锌以及硬酯酸锰。The cationic precursor solution may include a metal oxide, a metal halide, a metal nitride, a metal ammonia complex, a metal amine, a metal amide, a metal imide, a metal carboxylate, a metal acetylacetonate, a metal dithiolate. , metal carbonyl, metal cyanide, metal isonitrile, metal butyronitrile, metal peroxide, metal hydroxide, metal hydride, metal ether complex, metal diether complex, metal triether complex, Metal carbonate, metal nitrate, metal nitrite, metal sulfate, metal alkoxide, metal trimethyl silicon oxide, metal thiolate, metal dithiol, metal disulfide, metal urethane , metal dihydroxy carbamate, metal pyridine complex, metal dipyridine complex, metal phenanthroline complex, metal terpyridine complex, metal diamine complex, metal triamine complex , metal diimine, metal pyridine diimine, metal pyrazole borate, metal di(pyrazole) borate, metal tris (pyrazole) borate, metal nitrosyl, metal thiomethine Acid ester, metal diazide , metal dithiocarbamate, metal dihydrocarbyl acetamide, metal dihydrocarbyl carboxamide, metal formamidine, metal phosphine complex, metal arsine complex, metal diphosphine complex, metal Bismuth complex, metal oxalic acid, metal imidazole, metal pyrazole, metal Schiff base complex, metal porphyrin, metal phthalocyanine, metal phthalocyanine, metal picolinic acid, metal piperidine complex, metal Pyrazolyl, metal salicylaldehyde, metal ethylenediamine, metal trifluoromethanesulfonic acid compound or any combination thereof. Preferably, the cationic precursor solution may include metal oxides, metal carbonates, metal bicarbonates, metal sulfates, metal sulfites, metal phosphates, metal phosphites, metal halides, metal carboxylates, Metal hydroxide, metal alkoxide, metal thiolate, metal amide, metal imide, metal alkyl, metal aryl, metal complex, metal solvate, metal salt or a combination thereof. Most preferably, the cationic precursor is a metal oxide or metal salt precursor and may be selected from the group consisting of zinc stearate, zinc myristate, zinc acetate, and manganese stearate.
阴离子前体也可包括元素、共价化合物或离子化合物，其用作在所产生的纳米晶体内的一个或多个负电性元素。这些定义期望可以使用在本文中所公开的方法，制备三元化合物、四元化合物以及甚至更复杂的种类，在这种情况下，可使用多于一个阳离子前体和/或多于一个阴离子前体。在给定的单层生长期间使用两个或多个阳离子元素时，如果纳米晶体的其他部分仅仅包含单个阳离子，那么所产生的纳米晶体在指定的单层具有阳离子合金。相同的方法可用于制备具有阴离子合金的纳米晶体。The anionic precursor can also include an element, a covalent compound, or an ionic compound that acts as one or more electronegative elements within the nanocrystals produced. These definitions are expected to produce ternary, quaternary, and even more complex species using the methods disclosed herein, in which case more than one cationic precursor and/or more than one anion may be used. body. When two or more cationic elements are used during a given monolayer growth, if the other portions of the nanocrystals contain only a single cation, the resulting nanocrystals have a cationic alloy in the designated monolayer. The same method can be used to prepare nanocrystals having an anionic alloy.
以上方法适用于使用核和外壳材料的一系列阳离子前体化合物制备的核/壳纳米晶体，例如，II族金属的前体(例如，Zn、Cd或Hg)、III族金属的前体(例如，Al、Ga或In)、IV族金属的前体(例如，Ge、Sn或Pb)、或过渡金属(例如Ti、Zr、Hf、V、Nb、Ta、Cr、Mo、W、Mn、Tc、Re、Fe、Ru、Os、Co、Rh、Ir、Ni、Pd、Pt、Cu、Ag、Au等)。The above method is applicable to core/shell nanocrystals prepared using a series of cationic precursor compounds of core and shell materials, for example, precursors of Group II metals (eg, Zn, Cd or Hg), precursors of Group III metals (eg, , Al, Ga or In), a precursor of a Group IV metal (for example, Ge, Sn or Pb), or a transition metal (for example, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Tc) , Re, Fe, Ru, Os, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, etc.).
吸光壳的成分可与核的成分相同或不同。通常，吸光壳材料的晶格结构与为核选择的材料的类型相同。例如，如果CdSe用作发射区域材料，那么吸收区域材料可为CdS。选择吸光壳材料，以提供良好的吸收特征，并且可取决于光源。例如，在源自典型的蓝色LED(在440和470nm之间的波长范围内)的激发用于固态照明时，CdS可作为吸收区域的良好材料。例如，如果激发源自紫色LED，以通过下变频来制造红色LED，那么ZnSe或ZnSe xS 1-x(其中，x大于等于0且小于等于1)为吸收区域较好的选择。又例如，如果人们希望通过使 用红色光源从量子点获得近红外发射，以用于生物医学应用(700-1000nm)中，那么作为吸收区域材料，CdSe和InP通常有效。 The composition of the light absorbing shell may be the same as or different from the composition of the core. Typically, the lattice structure of the light absorbing shell material is the same as the type of material selected for the core. For example, if CdSe is used as the emissive region material, the absorbing region material may be CdS. The light absorbing shell material is selected to provide good absorption characteristics and may depend on the light source. For example, CdS can be a good material for the absorption region when excitation from a typical blue LED (within the wavelength range between 440 and 470 nm) is used for solid state illumination. For example, if the excitation originates from a purple LED to produce a red LED by down-conversion, then ZnSe or ZnSe x S 1-x (where x is greater than or equal to 0 and less than or equal to 1) is a preferred choice for the absorption region. As another example, if one wishes to obtain near-infrared emission from a quantum dot using a red light source for use in biomedical applications (700-1000 nm), then CdSe and InP are generally effective as materials for the absorption region.
在量子点最外面的外壳处的保护区域(宽带隙半导体或绝缘体)为量子点提供所需要的化学和光稳定性。通常，保护壳(也称为保护区域)在上述优选的激发窗口内既不有效地吸光，也不发射定向光子。这是因为其具有宽带隙。例如，ZnS和GaN可作为保护壳材料。也可使用金属氧化物。在某些实施方式中，有机聚合物可用作保护壳。保护壳的厚度通常在1个和20个单层之间的范围内。而且，厚度还能够根据需要增加，但是这也会增加生产成本。The protected area (wide bandgap semiconductor or insulator) at the outermost outer shell of the quantum dot provides the desired chemical and optical stability to the quantum dots. Typically, the protective casing (also referred to as the protective region) neither effectively absorbs light nor emits directional photons within the preferred excitation window described above. This is because it has a wide band gap. For example, ZnS and GaN can be used as a protective shell material. Metal oxides can also be used. In certain embodiments, an organic polymer can be used as a protective shell. The thickness of the protective shell is typically in the range between 1 and 20 monolayers. Moreover, the thickness can also be increased as needed, but this also increases production costs.
吸光壳包括形成成分梯度的多个单层。例如，吸光壳可包括三个组成成分，在最靠近核的单层中的比率1:0:1和最靠近保护壳的单层中的比率0:1:1之间变化。例如，三个有用的成分为Cd、Zn以及S，并且，最靠近核的单层可具有成分CdS(比率1:0:1)，最靠近保护壳的单层可具有与ZnS对应的成分(比率0:1:1)，并且在核和保护壳之间的中间单层可具有与Cd xZn 1-xS对应的成分，该成分具有比率(X):(1-X):1，并且其中，X大于等于0且小于等于1。在此例中，与更靠近保护壳的单层相比，对于更靠近核的单层，X更大。在另一个实施方式中，过渡壳包括三个成分，在从最靠近核的单层到最靠近保护壳的单层的比率0.9:0.1:1、0.8:0.2:1、0.6:0.4:1、0.4:0.6:1以及0.2:0.8:1变化。只要具有合适的晶格匹配参数，Cd、Zn、S以及Se合金的其他组合就也可用作过渡壳，代替Cd xZn 1-xS。在一个实施例中，合适的过渡外包括具有Cd、Zn以及S成分的外壳以及从最靠近吸光壳的层到最靠近保护壳的层中列出的以下层：Cd 0.9Zn 0.1S、Cd 0.8Zn 0.2S、Cd 0.6Zn 0.4S、Cd 0.4Zn 0.6S、Cd 0.2Zn 0.8S。 The light absorbing shell includes a plurality of single layers that form a compositional gradient. For example, the light absorbing shell may comprise three constituents varying between a ratio of 1:0:1 in the single layer closest to the core and a ratio 0:1:1 in the single layer closest to the protective shell. For example, three useful components are Cd, Zn, and S, and a single layer closest to the core may have a component CdS (ratio 1:0:1), and a single layer closest to the protective shell may have a component corresponding to ZnS ( Ratio 0:1:1), and the intermediate monolayer between the core and the protective shell may have a composition corresponding to Cd x Zn 1-x S having a ratio (X): (1-X): 1, And wherein X is greater than or equal to 0 and less than or equal to 1. In this case, X is larger for a single layer closer to the core than a single layer closer to the protective shell. In another embodiment, the transition shell comprises three components, at a ratio of 0.9 from a single layer closest to the core to the single layer closest to the protective shell: 0.1:1, 0.8:0.2:1, 0.6:0.4:1. 0.4:0.6:1 and 0.2:0.8:1 change. Other combinations of Cd, Zn, S, and Se alloys can also be used as transition shells instead of Cd x Zn 1-x S as long as they have suitable lattice matching parameters. In one embodiment, a suitable transition includes an outer shell having Cd, Zn, and S compositions and the following layers listed from the layer closest to the light absorbing shell to the layer closest to the protective shell: Cd 0.9 Zn 0.1 S, Cd 0.8 Zn 0.2 S, Cd 0.6 Zn 0.4 S, Cd 0.4 Zn 0.6 S, Cd 0.2 Zn 0.8 S.
LED灯丝100的电极506电性连接至导电支架51a、51b，以接收来自于驱动电路518的电力。电极506与导电支架51a、51b之间的连接关系可以是机械式的压紧连接，亦可以是焊接连接，所述机械式连接可以是先把导电支架51a、51b穿过电极506上形成的特定穿孔(图未示)，再反折导电支架51a、51b的自由端，使得导电支51a、51b夹住电极506并形成电性连接。所述焊接式连接可以是利用银基合金焊、银焊、钖焊等方式把导电支架51a、51b与电极506连接。The electrode 506 of the LED filament 100 is electrically connected to the conductive brackets 51a, 51b to receive power from the drive circuit 518. The connection relationship between the electrode 506 and the conductive brackets 51a, 51b may be a mechanical compression connection or a solder connection, and the mechanical connection may be a specific formation formed by first passing the conductive brackets 51a, 51b through the electrode 506. The perforations (not shown) are then folded back to the free ends of the conductive supports 51a, 51b such that the conductive branches 51a, 51b sandwich the electrodes 506 and form an electrical connection. The soldered connection may be the connection of the conductive supports 51a, 51b to the electrode 506 by means of silver-based alloy welding, silver soldering, soldering or the like.
图26A所示的LED灯丝100弯折形成图26A的上视图中的类似圆形的轮廓。在图26A的实施例中，LED灯丝100由于具有包括如图2至图22中任一实施例中所述的LED灯丝结构，因此可弯折形成侧视图中的波浪状。LED灯丝100的形状是新颖的，且使照明更加均匀。对比于具有多个LED灯丝的LED球泡灯，单一LED灯丝100具有较少的接点。在实施上，单一灯丝100仅具有两个连接用的接点，因此减少了因焊接或机械压接而产生瑕疵的可能性。The LED filament 100 shown in Fig. 26A is bent to form a circular-like contour in the upper view of Fig. 26A. In the embodiment of Fig. 26A, the LED filament 100 can be bent to form a wave shape in a side view since it has an LED filament structure including those described in any of the embodiments of Figs. 2 to 22. The shape of the LED filament 100 is novel and makes illumination more uniform. In contrast to LED bulbs having multiple LED filaments, a single LED filament 100 has fewer contacts. In practice, the single filament 100 has only two joints for attachment, thus reducing the likelihood of flaws due to welding or mechanical crimping.
芯柱19具有立杆19a，立杆19a朝向灯壳12的中心延伸。立杆19a支撑悬臂15，各个悬臂15的第一端连接立杆19a，且各个悬臂15的第二端连接LED灯丝100。The stem 19 has a pole 19a that extends toward the center of the lamp envelope 12. The uprights 19a support the cantilevers 15, the first ends of the respective cantilevers 15 are connected to the uprights 19a, and the second ends of the respective cantilevers 15 are connected to the LED filaments 100.
请参照图26B，图26B所示为图26A的虚线圆圈处的放大截面图。每一悬臂15的第二端具有一钳部15a，钳部15a夹住LED灯丝10的本体。钳部15a可以用以夹住LED灯丝100的波浪状的波峰或波谷，但并不以此为限，钳部15a也可以用来夹住LED灯丝100的波 浪状的波峰与波谷之间的部分。钳部15a的形状可以紧密配合于LED灯丝100截面的外形，而钳部15a的内部形状(内孔)的尺寸可以略小于LED灯丝100截面的外形的尺寸。因此，在制造时，可以把LED灯丝100穿过钳部15a的内孔，以形成紧密配合。另一种固定方式是经由弯折程序来形成该钳部，进一步来说，是先将LED灯丝100置于悬臂15的第二端，接着利用治具将第二端弯折成钳部15a以夹住LED灯丝100。Referring to FIG. 26B, FIG. 26B is an enlarged cross-sectional view showing the dotted circle of FIG. 26A. The second end of each cantilever 15 has a pliers portion 15a that clamps the body of the LED filament 10. The pliers portion 15a can be used to clamp the wave-like crests or troughs of the LED filament 100, but not limited thereto, and the jaw portion 15a can also be used to sandwich the portion between the wavy crests and troughs of the LED filament 100. . The shape of the jaw portion 15a can be closely fitted to the outer shape of the cross section of the LED filament 100, and the inner shape (inner hole) of the jaw portion 15a can be slightly smaller than the outer shape of the cross section of the LED filament 100. Therefore, at the time of manufacture, the LED filament 100 can be passed through the inner hole of the jaw portion 15a to form a close fit. Another fixing method is to form the pliers via a bending process. Further, the LED filament 100 is first placed at the second end of the cantilever 15, and then the second end is bent into the pliers 15a by the jig. The LED filament 100 is clamped.
悬臂15的材质可以是但不限于碳素弹簧钢，以提供适当的刚性与弹性，从而吸收外部振动而减少对LED灯丝的冲击，以使LED灯丝不易变形。由于立杆19a为延伸至灯壳12的中心，且悬臂15连接至立杆19a的顶端附近，因此，LED灯丝100的铅垂高度为接近于灯壳12的中心，因此LED球泡灯20c的发光特性接近于传统球泡灯的发光特性，使得发光更加均匀，同时发光亮度也能达到传统球泡灯的亮度水平。在本实施例中，LED灯丝100的至少一半会环绕LED球泡灯20c的中心轴。此中心轴与立杆19a的轴是同轴。The material of the cantilever 15 may be, but not limited to, carbon spring steel to provide proper rigidity and elasticity, thereby absorbing external vibrations and reducing the impact on the LED filaments, so that the LED filaments are not easily deformed. Since the upright 19a extends to the center of the lamp housing 12 and the cantilever 15 is connected to the vicinity of the top end of the upright 19a, the vertical height of the LED filament 100 is close to the center of the lamp housing 12, and thus the LED bulb 20c The illuminating characteristics are close to the illuminating characteristics of the conventional bulb, so that the illuminating is more uniform, and the illuminating brightness can also reach the brightness level of the conventional bulb. In the present embodiment, at least half of the LED filament 100 will surround the central axis of the LED bulb 20c. This central axis is coaxial with the axis of the upright 19a.
在本实施例中，LED灯丝100的悬臂15第一端与芯柱19的立杆19a连接，悬臂15的第二端通过钳部15a连接至LED灯丝100的外绝缘面，因此悬臂15并不是用来传输电力。在一实施例中，芯柱19是以玻璃制成，因此芯柱19不会因为悬壁15的热胀冷缩而破损或爆裂。在不同实施例中，LED球泡灯可不具有立杆，悬臂15可连接至芯柱或可直接连接灯壳，以减少因为立杆对于发光造成的负面影响。In the present embodiment, the first end of the cantilever 15 of the LED filament 100 is connected to the upright 19a of the stem 19, and the second end of the cantilever 15 is connected to the outer insulating surface of the LED filament 100 via the jaw 15a, so the cantilever 15 is not Used to transmit electricity. In an embodiment, the stem 19 is made of glass so that the stem 19 does not break or burst due to thermal expansion and contraction of the cantilever 15. In various embodiments, the LED bulb may have no uprights, and the cantilever 15 may be attached to the stem or may be directly attached to the bulb to reduce the negative effects of the poles on illumination.
由于悬臂15是不导电的，避免了以往在悬臂15导电时，会因通过的电流产生热，而导致悬臂15内的金属丝热胀冷缩，从而造成玻璃芯柱19破损爆裂的风险。Since the cantilever 15 is non-conductive, it avoids the heat generated by the passing current when the cantilever 15 is electrically conductive, which causes the wire in the cantilever 15 to expand and contract, thereby causing the glass stem 19 to break and burst.
在不同实施例中，悬臂15的第二端可以直接插入LED灯丝100中，且成为LED灯丝100中的辅助件(辅助条)，其可以强化LED灯丝100的机械强度。In various embodiments, the second end of the cantilever 15 can be inserted directly into the LED filament 100 and become an auxiliary (auxiliary strip) in the LED filament 100 that can enhance the mechanical strength of the LED filament 100.
钳部15a的内部形状(孔洞形状)匹配LED灯丝100截面的外部形状，因此，LED灯丝100的截面可以被定向而朝向特定的方位。LED灯丝100的顶层420a会被定向而朝向图2B的十点钟方向，整条LED灯丝100的发光面都可被定向朝向大致上同样的方位，以确保LED灯丝100的发光面在视觉上是一致的。对应于LED芯片，LED灯丝100包括主发光面Lm与次发光面Ls。当LED灯丝100的LED芯片是打线连接，且以线状对齐，顶层420a远离基层420b的一面为主发光面Lm，而基层420b远离顶层420a的一面为次发光面Ls。主发光面Lm与次发光面Ls彼此相对。当LED灯丝100发光时，主发光面Lm是有最大量的光线穿过的一面，而次发光面Ls是有第二大量的光线穿过的一面。在本实施例中，在顶层420a与基层420b之间还具有导电箔530，其用来电性连接于LED芯片之间。在本实施例中，LED灯丝100卷曲扭绕而使主发光面Lm总是朝向外侧。也就是说，主发光面Lm的任何部分都是朝向灯壳12或灯头16，且在任何角度下其所朝方向都是远离芯柱19的。而次发光面Ls则总是朝向芯柱19或朝向芯柱19的顶端(次发光面Ls总是朝向内侧)。The inner shape (hole shape) of the jaw portion 15a matches the outer shape of the cross section of the LED filament 100, and thus, the cross section of the LED filament 100 can be oriented toward a specific orientation. The top layer 420a of the LED filament 100 will be oriented toward the ten o'clock direction of Figure 2B, and the illumination surface of the entire LED filament 100 can be oriented toward substantially the same orientation to ensure that the illumination surface of the LED filament 100 is visually Consistent. Corresponding to the LED chip, the LED filament 100 includes a main light emitting surface Lm and a sub light emitting surface Ls. When the LED chips of the LED filament 100 are wire-bonded and aligned in a line shape, one side of the top layer 420a away from the base layer 420b is the main light-emitting surface Lm, and the side of the base layer 420b away from the top layer 420a is the secondary light-emitting surface Ls. The main light emitting surface Lm and the sub light emitting surface Ls are opposed to each other. When the LED filament 100 emits light, the main light-emitting surface Lm is the side through which the maximum amount of light passes, and the secondary light-emitting surface Ls is the side through which the second large amount of light passes. In this embodiment, a conductive foil 530 is further disposed between the top layer 420a and the base layer 420b for electrically connecting between the LED chips. In the present embodiment, the LED filament 100 is crimped and twisted such that the main light-emitting surface Lm always faces outward. That is, any portion of the main light-emitting surface Lm faces the lamp housing 12 or the lamp cap 16, and is oriented away from the stem 19 at any angle. The secondary light-emitting surface Ls always faces the stem 19 or the tip end of the stem 19 (the secondary light-emitting surface Ls always faces inward).
图26A所示的LED灯丝100被折弯而在顶视图中形成圆形，且在侧视图中形成波浪状。此波浪状结构不只是外观新颖，还可确保LED灯丝100的光照均匀。同时，相较于多条LED灯丝，单一LED灯丝100只要较少的接点(如压接点、熔接点或焊接点)来连接导电 支架51a、51b。实际上，单一LED灯丝100只需要两个接点，其分别形成在两个电极上。如此可有效降低焊接失误的风险，且相较于采取紧压方式的机械连接，本实施例可简化连接程序。The LED filament 100 shown in Fig. 26A is bent to form a circular shape in a top view and is formed in a wave shape in a side view. This wavy structure is not only novel in appearance, but also ensures uniform illumination of the LED filament 100. At the same time, the single LED filament 100 is connected to the conductive holders 51a, 51b by fewer contacts (e.g., crimp points, weld points or solder joints) than a plurality of LED filaments. In fact, a single LED filament 100 requires only two contacts, which are formed on two electrodes, respectively. This can effectively reduce the risk of welding errors, and the present embodiment can simplify the connection procedure as compared to the mechanical connection in which the pressing method is employed.
请参照图26C，图26C所示为图26A的LED球泡灯20c的LED灯丝100在顶视图的投影。如图26C所示，在一实施例中，LED灯丝可以被折弯而形成波浪状，且由顶视图观察，会类似圆形，此圆形会环绕球泡灯或芯柱的中心。在不同实施例中，由顶视图观察的LED灯丝可以形成类圆形或类“U”形。Referring to Figure 26C, Figure 26C shows the projection of the LED filament 100 of the LED bulb 20c of Figure 26A in a top view. As shown in Fig. 26C, in one embodiment, the LED filaments can be bent to form a wave and, as viewed from a top view, resemble a circle that surrounds the center of the bulb or stem. In various embodiments, the LED filaments viewed from a top view may form a circular or U-like shape.
如图26C所示，LED灯丝100会以类似圆形的波浪状环绕且在顶视图中具有类对称结构，而LED灯丝100的发光面也是对称的。例如在顶视图中，主发光面Lm可面向外侧。由于对称特性，LED灯丝100可产生全周光的效果。对称特性是关于在顶视图中，LED灯丝100的类对称结构以及LED灯丝100的发光面的配置。藉此，LED球泡灯20c整体可产生近似于360度发光的全周光效果。此外，两接点可以彼此靠近，使导电支架51a、51b会大致上低于LED灯丝100。在视觉上，导电支架51a、51b会显得不明显，且与LED灯丝100整合，以展现优美曲线。As shown in Fig. 26C, the LED filament 100 will be surrounded by a circular wave-like shape and have a symmetry-like structure in a top view, and the light-emitting surface of the LED filament 100 is also symmetrical. For example, in the top view, the main light emitting surface Lm may face outward. Due to the symmetrical nature, the LED filament 100 can produce a full-circumferential effect. The symmetrical characteristic relates to the symmetrical structure of the LED filament 100 and the configuration of the light emitting surface of the LED filament 100 in a top view. Thereby, the LED bulb lamp 20c as a whole can produce a full-circumference effect of approximately 360-degree illumination. In addition, the two contacts can be close to each other such that the conductive brackets 51a, 51b will be substantially lower than the LED filament 100. Visually, the conductive brackets 51a, 51b may appear inconspicuous and integrated with the LED filament 100 to exhibit a graceful curve.
请参照图27A与图27B，图27A为本发明的一个实施例的LED球泡灯的示意图，图27B为图27A的LED球泡灯的前视图(或侧视图)。图27A与图27B的LED球泡灯20d类似于图26A的LED球泡灯20c，如图27A与图27B所示，LED球泡灯20d包括灯壳12、连接灯壳12的灯头16、设于灯壳12内的至少二导电支架51a、51b、悬臂15、芯柱19、及单根LED灯丝100。芯柱19包括相对的芯柱底部与芯柱顶部，所述芯柱底部连接所述灯头16，芯柱顶部会沿着芯柱19的延长方向延伸至灯壳12内部，例如芯柱顶部可位于灯壳12内部的中心。在本实施例中，芯柱19包括了立杆19a，此处立杆19a被视为芯柱19整体的一部分，因此芯柱19的顶端即为立杆19a的顶端。导电支架51a、51b连接所述芯柱19。LED灯丝100包括灯丝本体与二电极506，所述二电极506位于所述灯丝本体的相对两端，灯丝本体即为LED灯丝100不包括电极506的其他部分。二灯丝电极506分别连接二导电支架51a、51b，所述灯丝本体环绕所述芯柱19。悬臂15的一端连接芯柱19而另一端连接灯丝本体。27A and FIG. 27B, FIG. 27A is a schematic diagram of an LED bulb of one embodiment of the present invention, and FIG. 27B is a front view (or side view) of the LED bulb of FIG. 27A. The LED bulb 20d of FIG. 27A and FIG. 27B is similar to the LED bulb 20c of FIG. 26A. As shown in FIG. 27A and FIG. 27B, the LED bulb 20d includes a lamp housing 12, a lamp holder 16 connecting the lamp housing 12, and At least two conductive brackets 51a, 51b, a cantilever 15, a stem 19, and a single LED filament 100 in the lamp housing 12. The stem 19 includes an opposite stem bottom and a stem top, the stem bottom connecting the cap 16, the stem tip extending along the extension of the stem 19 to the inside of the bulb 12, for example, the stem top can be located The center of the interior of the lamp housing 12. In the present embodiment, the stem 19 includes a stem 19a, where the stem 19a is considered to be a part of the stem 19 as a whole, so that the top end of the stem 19 is the top end of the stem 19a. Conductive brackets 51a, 51b are connected to the stem 19. The LED filament 100 includes a filament body and two electrodes 506. The two electrodes 506 are located at opposite ends of the filament body, and the filament body is the other portion of the LED filament 100 that does not include the electrode 506. The two filament electrodes 506 are respectively connected to two conductive brackets 51a, 51b, and the filament body surrounds the stem 19. One end of the cantilever 15 is connected to the stem 19 and the other end is connected to the filament body.
请参照图27C，图27C所示为图27A的LED球泡灯20d的顶视图。如图27C所示，LED灯丝100本体包括主发光面Lm与次发光面Ls。主发光面Lm的任一段在任一角度会朝向灯壳12或灯头16，也就是朝向LED球泡灯20d之外或朝向灯壳12之外，而次发光面Ls的任一段在任一角度朝向芯柱19或芯柱19顶部，也就是朝向LED球泡灯20d之内或朝向灯壳12的中心。换句话说，当使用者由外部观察LED球泡灯20d时，在任何角度下都会看到LED灯丝100的主发光面Lm。基于此种设置，照明的效果会更好。Referring to FIG. 27C, FIG. 27C is a top view of the LED bulb 20d of FIG. 27A. As shown in FIG. 27C, the body of the LED filament 100 includes a main light emitting surface Lm and a sub light emitting surface Ls. Any segment of the main light-emitting surface Lm will face the lamp envelope 12 or the lamp cap 16 at any angle, that is, toward or outside the LED bulb 20d, and any segment of the secondary light-emitting surface Ls faces the core at any angle. The top of the post 19 or stem 19, that is, towards the inside of the LED bulb 20d or toward the center of the lamp envelope 12. In other words, when the user observes the LED bulb 20d from the outside, the main light-emitting surface Lm of the LED filament 100 is seen at any angle. Based on this setting, the lighting will work better.
根据不同的实施例，在不同的LED球泡灯(如LED球泡灯0a，20b，20c或20d)中的LED灯丝100可以形成不同的形状或曲线，且这些LED灯丝100的任一个都会设置为具有对称特性。此对称特性有助于产生均匀且分布广泛的光线，使得LED球泡灯能够产生全周光效果。LED灯丝100的对称特性如下所述。According to various embodiments, the LED filaments 100 in different LED bulbs (such as LED bulbs 0a, 20b, 20c or 20d) may form different shapes or curves, and any of these LED filaments 100 will be set To have symmetrical characteristics. This symmetrical property helps to produce a uniform and widely distributed light, enabling the LED bulb to produce a full-circumferential effect. The symmetrical characteristics of the LED filament 100 are as follows.
LED灯丝100的对称特性的定义，可以是基于以LED球泡灯的顶视图所定义的四个象限。在LED球泡灯(例如图26A的LED球泡灯20c)的顶视图中可以定义出四个象限，这四个象限的原点可定义为LED球泡灯的芯柱或立竿在顶视图中的中心(例如图1A的芯柱19的立竿的顶部中心或图26A的立竿19a的顶部中心)。LED球泡灯的LED灯丝(例如图1B与图26A的LED灯丝100)可在顶视图中呈现环形的结构、形状或轮廓。呈现在顶视图中的四个象限中的LED灯丝会具有对称性。The definition of the symmetrical nature of the LED filament 100 can be based on four quadrants defined in a top view of the LED bulb. Four quadrants can be defined in a top view of an LED bulb (eg, LED bulb 20c of FIG. 26A), the origin of which can be defined as the stem of the LED bulb or in the top view The center (for example, the top center of the stand of the stem 19 of Fig. 1A or the top center of the stand 19a of Fig. 26A). The LED filaments of the LED bulb (e.g., LED filament 100 of Figures IB and 26A) may exhibit a toroidal configuration, shape or profile in a top view. The LED filaments presented in the four quadrants in the top view will have symmetry.
例如，当LED灯丝运作时，LED灯丝在顶视图中呈现在第一象限的亮度，会对称于LED灯丝在顶视图中呈现在第二象限、第三象限或第四象限的亮度。在一些实施例中，LED灯丝在顶视图中位在第一象限的部分的结构，会对称于LED灯丝在顶视图中位在第二象限、第三象限或第四象限的部分的结构。此外，LED灯丝在顶视图中位在第一象限的部分的出光方向，会对称于LED灯丝在顶视图中位在第二象限、第三象限或第四象限的部分的出光方向。For example, when the LED filament is in operation, the LED filament exhibits brightness in the first quadrant in a top view that is symmetric to the brightness of the LED filament in the second, third or fourth quadrant in a top view. In some embodiments, the structure of the portion of the LED filament that is in the first quadrant in a top view is symmetric to the structure of the portion of the LED filament that is in the second quadrant, the third quadrant, or the fourth quadrant in a top view. In addition, the direction in which the LED filament is positioned in the first quadrant in the top view is symmetrical to the direction in which the LED filament is positioned in the second quadrant, the third quadrant or the fourth quadrant in the top view.
在其他实施例中，LED灯丝在顶视图中位在第一象限的部分上的LED芯片的配置(如LED灯丝位在第一象限的部分上的LED芯片的密度变化)，会对称于LED灯丝在顶视图中位在第二象限、第三象限或第四象限的部分上的LED芯片的配置。In other embodiments, the configuration of the LED chip on the portion of the first quadrant in the top view in the top view (eg, the density of the LED chip on the portion of the first quadrant of the LED filament) varies symmetrically to the LED filament The configuration of the LED chip in the second quadrant, the third quadrant or the fourth quadrant portion in the top view.
在其他实施例中，LED灯丝在顶视图中位在第一象限的部分上的具有不同功率的LED芯片的功率布置(如LED灯丝位在第一象限的部分上的各种功率的LED芯片的位置分布)，会对称于LED灯丝在顶视图中位在第二象限、第三象限或第四象限的部分上的具有不同功率的LED芯片的功率布置。In other embodiments, the power arrangement of the LED chips having different powers on the portion of the first quadrant in the top view in the top view (eg, LED chips of various powers on the portion of the first quadrant of the LED filaments) The position distribution) is symmetric with respect to the power arrangement of the LED chips of different powers of the LED filaments in the second quadrant, the third quadrant or the fourth quadrant in the top view.
在其他实施例中，当LED灯丝可区分为多个分段且这些分段是以彼此区别的折射率来定义，则LED灯丝在顶视图中位在第一象限的部分上的多个分段的折射率，会对称于LED灯丝在顶视图中位在第二象限、第三象限或第四象限的部分上的多个分段的折射率。In other embodiments, when the LED filament can be divided into a plurality of segments and the segments are defined by refractive indices that are different from one another, the LED filaments are in multiple segments on the portion of the first quadrant in a top view. The refractive index is symmetrical to the refractive indices of the plurality of segments of the LED filament in the second quadrant, the third quadrant or the fourth quadrant in the top view.
在其他实施例中，当LED灯丝可区分为多个分段且这些分段是以彼此区别的表面粗糙度来定义，则LED灯丝在顶视图中位在第一象限的部分上的多个分段的表面粗糙度，会对称于LED灯丝在顶视图中位在第二象限、第三象限或第四象限的部分上的多个分段的表面粗糙度。In other embodiments, when the LED filament can be divided into a plurality of segments and the segments are defined by surface roughness that is different from each other, the LED filament has a plurality of points on the portion of the first quadrant in the top view. The surface roughness of the segment will be symmetrical to the surface roughness of the plurality of segments of the LED filament in the second quadrant, the third quadrant or the fourth quadrant in the top view.
呈现在顶视图的四个象限中的LED灯丝可以是点对称(例如根据四象限的原点对称)或是线对称(例如根据四象限的两个轴之一对称)。The LED filaments presented in the four quadrants of the top view may be point symmetric (eg, symmetrical according to the origin of the four quadrants) or line symmetrical (eg, symmetric according to one of the two axes of the four quadrants).
在顶视图的四个象限中的LED灯丝的对称结构可以具有至多20％-50％的误差，例如，当LED灯丝在第一象限的部分的结构对称于LED灯丝在第二象限的部分的结构的时候，LED灯丝在第一象限的部分上有一个指定点，而LED灯丝在第二象限的部分上有一个对称于此指定点的对称点，此指定点有一个第一位置，此对称点有一个第二位置，第一位置与第二位置可以是完全对称或是有20％-50％的误差。The symmetrical structure of the LED filaments in the four quadrants of the top view may have an error of at most 20%-50%, for example, when the structure of the LED filament in the first quadrant is symmetrical to the structure of the LED filament in the second quadrant portion The LED filament has a designated point on the portion of the first quadrant, and the LED filament has a symmetry point symmetrically at the specified point on the portion of the second quadrant. The designated point has a first position, the symmetry point There is a second position, the first position and the second position may be completely symmetrical or have an error of 20%-50%.
此外，在顶视图中，当LED灯丝在两个象限对称，也可以定义为LED灯丝在其中一个象限的部分的长度会大致上等于LED灯丝在另外一个象限的部分的长度。LED灯丝在不同象限的部分的长度也可以有20％-50％的误差。其中，所述长度可以是LED灯丝沿着其轴向 方向延伸的长度。Furthermore, in the top view, when the LED filaments are symmetric in two quadrants, it can also be defined that the length of the portion of the LED filament in one of the quadrants is substantially equal to the length of the portion of the LED filament in the other quadrant. The length of the LED filament in different quadrants may also have an error of 20%-50%. Wherein the length may be a length of the LED filament extending along its axial direction.
LED灯丝100的对称特性的定义，可以是基于LED球泡灯在侧视图、前视图或后视图中定义的四个象限。在本实施例中，LED球泡灯的侧视图包括前视图或后视图。在LED球泡灯(例如图26A的LED球泡灯20c)的侧视图中可以定义出四个象限，在此种情况下，LED球泡灯中的芯柱或立竿(例如图26A的LED球泡灯20c的立竿19a)的延长方向(自灯头16朝向灯壳12远离灯头16的顶端)可定义为Y轴，而X轴则可以横越过立竿的中间，此时四个象限的原点则定义为此立竿的中间，也就是X轴与Y轴的交叉点。在不同的实施例中，X轴可以横越立杆的任何一点，例如，X轴可以横越立杆的顶端、立杆的底端或立杆的特定高度上的一点(如2/3高度处)。The definition of the symmetrical characteristics of the LED filament 100 can be based on four quadrants defined in the side view, front view or rear view of the LED bulb. In the present embodiment, the side view of the LED bulb includes a front view or a rear view. Four quadrants can be defined in a side view of an LED bulb (e.g., LED bulb 20c of Figure 26A), in which case a stem or a stand in the LED bulb (e.g., the LED of Figure 26A) The direction in which the vertical direction 19a) of the bulb lamp 20c extends (from the base 16 toward the top end of the lamp housing 12 away from the base 16) can be defined as the Y-axis, and the X-axis can traverse the middle of the stand, at this time in four quadrants The origin is defined as the middle of the vertical, that is, the intersection of the X and Y axes. In various embodiments, the X-axis can traverse any point of the pole, for example, the X-axis can traverse the top end of the pole, the bottom end of the pole, or a point on a particular height of the pole (eg, 2/3 height) .
此外，LED灯丝在侧视图中位在第一象限与第二象限(上方象限)的部分，会在亮度上对称(例如对Y轴呈线对称)；LED灯丝在侧视图中位在第三象限与第四象限(下方象限)的部分，会在亮度上对称(例如对Y轴呈线对称)。然而，LED灯丝在侧视图中位在上方象限的部分所呈现的亮度，不会对称于LED灯丝在侧视图中位在下方象限的部分所呈现的亮度。In addition, the LED filaments are symmetrical in brightness (eg, line symmetry to the Y axis) in the first quadrant and the second quadrant (upper quadrant) in the side view; the LED filament is in the third quadrant in the side view The portion with the fourth quadrant (lower quadrant) is symmetric in brightness (for example, line symmetry to the Y axis). However, the brightness of the LED filament in the upper quadrant in the side view is not symmetrical to the brightness of the LED filament in the lower quadrant in the side view.
在一些实施例中，LED灯丝位在第一象限与第二象限(即上方两个象限)的部分会在结构上对称(例如以Y轴为对称线的线对称)。LED灯丝位在第三象限与第四象限(即下方两个象限)的部分会也会在结构上对称(例如以Y轴为对称线的线对称)。此外，LED灯丝在侧视图中位在第一象限的部分的出光方向，会对称于LED灯丝在侧视图中位在第二象限的部分的出光方向；LED灯丝在侧视图中位在第三象限的部分的出光方向，会对称于LED灯丝在侧视图中位在第四象限的部分的出光方向。In some embodiments, the portion of the LED filament in the first quadrant and the second quadrant (ie, the upper two quadrants) will be structurally symmetric (eg, line symmetric with the Y axis as a line of symmetry). The portion of the LED filament in the third quadrant and the fourth quadrant (ie, the lower two quadrants) will also be structurally symmetric (eg, line symmetry with the Y axis as the line of symmetry). In addition, the LED filament is in the light-emitting direction of the portion of the first quadrant in the side view, and is symmetrical to the light-emitting direction of the LED filament in the second quadrant in the side view; the LED filament is in the third quadrant in the side view. The light exiting direction of the portion is symmetrical with respect to the light exiting direction of the LED filament in the portion of the fourth quadrant in the side view.
在其他实施例中，LED灯丝在侧视图中位在第一象限的部分上的LED芯片的配置，会对称于LED灯丝在侧视图中位在第二象限的部分上的LED芯片的配置；LED灯丝在侧视图中位在第三象限的部分上的LED芯片的配置，会对称于LED灯丝在侧视图中位在第四象限的部分上的LED芯片的配置。In other embodiments, the configuration of the LED chip of the LED filament in the first quadrant portion in a side view is symmetric to the configuration of the LED chip of the LED filament in the second quadrant portion in a side view; LED The arrangement of the LED chips on the portion of the filament in the third quadrant in the side view will be symmetric to the configuration of the LED chips on the portion of the LED filament that is in the fourth quadrant in the side view.
在其他实施例中，LED灯丝在侧视图中位在第一象限的部分上的具有不同功率的LED芯片的功率布置，会对称于LED灯丝在侧视图中位在第二象限的部分上的具有不同功率的LED芯片的功率布置；LED灯丝在侧视图中位在第三象限的部分上的具有不同功率的LED芯片的功率布置，会对称于LED灯丝在侧视图中位在第四象限的部分上的具有不同功率的LED芯片的功率布置。In other embodiments, the power arrangement of the LED filaments having different powers on the portion of the first quadrant in the side view of the LED filament is symmetric to the LED filament in the second quadrant portion of the side view. Power arrangement of LED chips of different powers; the power arrangement of LED chips with different powers of the LED filaments in the third quadrant in the side view is symmetrical to the portion of the LED filaments in the fourth quadrant in the side view Power arrangement of LED chips with different powers.
在其他实施例中，当LED灯丝可区分为多个分段且这些分段是以彼此区别的折射率来定义，则LED灯丝在侧视图中位在第一象限的部分上的多个分段的折射率，会对称于LED灯丝在侧视图中位在第二象限的部分上的多个分段的折射率；LED灯丝在侧视图中位在第三象限的部分上的多个分段的折射率，会对称于LED灯丝在侧视图中位在第四象限的部分上的多个分段的折射率。In other embodiments, when the LED filament can be divided into a plurality of segments and the segments are defined by a refractive index that is different from each other, the LED filaments are in multiple segments on the portion of the first quadrant in a side view. Refractive index, which is symmetrical to the refractive index of the plurality of segments of the LED filament on the portion of the second quadrant in the side view; the plurality of segments of the LED filament in the side portion of the third quadrant in a side view The index of refraction will be symmetric with respect to the refractive index of the plurality of segments of the LED filament that are located in the fourth quadrant in the side view.
在其他实施例中，当LED灯丝可区分为多个分段且这些分段是以彼此区别的表面 粗糙度来定义，则LED灯丝在侧视图中位在第一象限的部分上的多个分段的表面粗糙度，会对称于LED灯丝在侧视图中位在第二象限的部分上的多个分段的表面粗糙度；LED灯丝在侧视图中位在第三象限的部分上的多个分段的表面粗糙度，会对称于LED灯丝在侧视图中位在第四象限的部分上的多个分段的表面粗糙度。In other embodiments, when the LED filament can be divided into a plurality of segments and the segments are defined by surface roughness that is different from each other, the LED filament has a plurality of points on the portion of the first quadrant in a side view. The surface roughness of the segment is symmetrical to the surface roughness of the plurality of segments of the LED filament in the second quadrant portion in the side view; the LED filament is positioned in the third quadrant portion in the side view The surface roughness of the segments is symmetrical to the surface roughness of the plurality of segments of the LED filaments in the portion of the fourth quadrant in the side view.
此外，在侧视图中，LED灯丝呈现在上方两个象限的部分与LED灯丝呈现在下方两个象限的部分则在亮度上是不对称的。在一些实施例中，LED灯丝呈现在第一象限与第四象限的部分在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上是不对称的，而LED灯丝呈现在第二象限与第三象限的部分在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上是不对称的。为了满足全周光灯具的照明目的与要求，在侧视图中自上方象限(远离灯头16的部分)发出的光线应该要多于自下方象限(靠近灯头16的部分)发出的光线。因此，这种LED球泡灯的LED灯丝在上方象限与下方象限之间的不对称特性，可藉由将光线集中在上方象限，而有有助于满足全周光的要求。In addition, in the side view, the portion of the LED filament that appears in the upper two quadrants and the portion of the LED filament that appears in the lower two quadrants are asymmetrical in brightness. In some embodiments, the LED filaments are present in the first quadrant and the fourth quadrant portion in structure, in length, in the light exiting direction, on the configuration of the LED chip, on the power arrangement of the LED chips having different powers. Asymmetric in refractive index or in surface roughness, and the LED filaments are present in the second quadrant and the third quadrant in terms of structure, length, in the light exiting direction, on the configuration of the LED chip, It is asymmetrical in the power arrangement of LED chips with different powers, in refractive index or in surface roughness. In order to meet the lighting objectives and requirements of a full-circumferential luminaire, the light emitted from the upper quadrant (the portion away from the lamp cap 16) in the side view should be more than the light emitted from the lower quadrant (the portion close to the cap 16). Therefore, the asymmetrical nature of the LED filament of such an LED bulb between the upper quadrant and the lower quadrant can help to meet the requirements of full illumination by focusing the light in the upper quadrant.
LED灯丝在侧视图的第一象限与第二象限中的对称结构可以具有20％-50％的误差(容许误差)，例如，LED灯丝在第一象限的部分上有一个指定点，而LED灯丝在第二象限的部分上有一个对称于此指定点的对称点，此指定点有一个第一位置，此对称点有一个第二位置，第一位置与第二位置可以是完全对称或是有20％-50％的误差。此处误差的意义可参照前文的记载。The symmetrical structure of the LED filament in the first quadrant and the second quadrant of the side view may have an error (tolerance) of 20%-50%, for example, the LED filament has a designated point on the portion of the first quadrant, and the LED filament a portion of the second quadrant having a symmetry point symmetrical at the specified point, the designated point having a first position, the symmetry point having a second position, the first position and the second position may be completely symmetrical or have 20%-50% error. The meaning of the error here can be referred to the foregoing description.
此外，在侧视图中，LED灯丝在第一象限的部分的长度会大致上等于LED灯丝在第二象限的部分的长度。在侧视图中，LED灯丝在第三象限的部分的长度会大致上等于LED灯丝在第四象限的部分的长度。然而，在侧视图中，LED灯丝在第一象限或第二象限的部分的长度会不同于LED灯丝在第三象限或第四象限的部分的长度。在一些实施例中，在侧视图中，LED灯丝在第三象限或第四象限的部分的长度会小于LED灯丝在第一象限或第二象限的部分的长度。在侧视图中，LED灯丝在第一象限或第二象限的部分的长度或者LED灯丝在第三象限或第四象限的部分的长度也会具有20％-50％的误差。Moreover, in a side view, the length of the portion of the LED filament in the first quadrant will be substantially equal to the length of the portion of the LED filament in the second quadrant. In a side view, the length of the portion of the LED filament in the third quadrant will be substantially equal to the length of the portion of the LED filament in the fourth quadrant. However, in a side view, the length of the portion of the LED filament in the first quadrant or the second quadrant may be different than the length of the portion of the LED filament in the third quadrant or the fourth quadrant. In some embodiments, in a side view, the length of the LED filament in the third quadrant or fourth quadrant portion may be less than the length of the portion of the LED filament in the first quadrant or the second quadrant. In a side view, the length of the portion of the LED filament in the first or second quadrant or the length of the portion of the LED filament in the third or fourth quadrant may also have an error of 20%-50%.
请参照图27D，图27D为图27B的LED灯丝100呈现在定义有四个象限的二维坐标系中。图27D的LED灯丝100同于图27B的LED灯丝100，图27D是图27A的LED球泡灯20d的前视图(或侧视图)。如图27B与图27D所示，Y轴会对齐芯柱的立杆19a(即，Y轴会位在立杆19a的延长方向上)，而X轴会横越立杆19a(即，X轴会垂直于立杆19a的延长方向)。如图27D所示，LED灯丝100在侧视图中会被X轴与Y轴分为第一部分100p1、第二部分100p2、第三部分100p3与第四部分100p4。LED灯丝100的第一部分100p1是在侧视图中呈现在第一象限的部分，LED灯丝100的第二部分100p2是在侧视图中呈现在第二象限的部分，LED灯丝100的第三部分100p3是在侧视图中呈现在第三象限的部分，而LED灯丝100的第四部分100p4是在侧视图中呈现在第四象限的部分。Referring to Figure 27D, Figure 27D shows the LED filament 100 of Figure 27B in a two-dimensional coordinate system defined with four quadrants. The LED filament 100 of Fig. 27D is the same as the LED filament 100 of Fig. 27B, and Fig. 27D is a front view (or side view) of the LED bulb 20d of Fig. 27A. As shown in Fig. 27B and Fig. 27D, the Y-axis will align with the stem 19a of the stem (i.e., the Y-axis will be positioned in the extension direction of the stem 19a), and the X-axis will traverse the stem 19a (i.e., the X-axis will It is perpendicular to the extension direction of the upright 19a). As shown in Fig. 27D, the LED filament 100 is divided into a first portion 100p1, a second portion 100p2, a third portion 100p3 and a fourth portion 100p4 by X and Y axes in a side view. The first portion 100p1 of the LED filament 100 is the portion that appears in the first quadrant in a side view, the second portion 100p2 of the LED filament 100 is the portion that appears in the second quadrant in a side view, and the third portion 100p3 of the LED filament 100 is The portion of the third quadrant is presented in a side view, while the fourth portion 100p4 of the LED filament 100 is the portion that appears in the fourth quadrant in a side view.
如图27D所示，LED灯丝100为线对称。LED灯丝100在侧视图中会相对于Y轴对称，也就是说，第一部分100p1与第四部分100p4的几何形状会对称于第二部分100p2、第三部分100p3的几何形状。具体而言，在侧视图中，第一部分100p1会对称于第二部分100p2，更进一步来说，在侧视图中，第一部分100p1与第二部分100p2会在结构上相对于Y轴对称。此外，在侧视图中，第三部分100p3会对称于第四部分100p4，更进一步来说，在侧视图中，第三部分100p3与第四部分100p4会在结构上相对于Y轴对称。As shown in Fig. 27D, the LED filament 100 is line symmetrical. The LED filament 100 will be symmetrical with respect to the Y-axis in a side view, that is, the geometry of the first portion 100p1 and the fourth portion 100p4 will be symmetrical to the geometry of the second portion 100p2 and the third portion 100p3. Specifically, in a side view, the first portion 100p1 will be symmetric with respect to the second portion 100p2, and further, in a side view, the first portion 100p1 and the second portion 100p2 will be structurally symmetric with respect to the Y-axis. Further, in a side view, the third portion 100p3 will be symmetric with respect to the fourth portion 100p4, and further, in a side view, the third portion 100p3 and the fourth portion 100p4 will be structurally symmetric with respect to the Y-axis.
在本实施例中，如图27D所示，侧视图中位于上方象限(即第一象限与第二象限)的第一部分100p1与第二部分100p2与侧视图中位于下方象限(即第三象限与第四象限)的第三部分100p3与第四部分100p4是不对称的。具体而言，侧视图中第一部分100p1与第四部分100p4是不对称的，而侧视图中第二部分100p2与第三部分100p3是不对称的。根据图27D中LED灯丝100在上方象限与下方象限的结构的不对称特性，自上方象限射出且穿过上方灯壳12(远离灯头16的部分)的光线会多于自下方象限射出且穿过下方灯壳12(靠近灯头16的部分)的光线，以满足全周光灯具的照明目的与要求。In the present embodiment, as shown in FIG. 27D, the first portion 100p1 and the second portion 100p2 in the upper quadrant (ie, the first quadrant and the second quadrant) in the side view are located in the lower quadrant (ie, the third quadrant and the side view). The third portion 100p3 of the fourth quadrant is asymmetrical to the fourth portion 100p4. Specifically, the first portion 100p1 and the fourth portion 100p4 are asymmetrical in the side view, while the second portion 100p2 and the third portion 100p3 are asymmetrical in the side view. According to the asymmetry characteristic of the structure of the LED filament 100 in the upper quadrant and the lower quadrant in Fig. 27D, the light emitted from the upper quadrant and passing through the upper lamp envelope 12 (the portion away from the lamp cap 16) is more than the light emitted from the lower quadrant and passing through The light from the lower lamp housing 12 (near the portion of the lamp cap 16) meets the lighting objectives and requirements of the full-circumference luminaire.
基于LED灯丝100的对称特性，侧视图中LED灯丝100的两对称部分的结构(第一部分100p1与第二部分100p2或第三部分100p3与第四部分100p4)可以是完全对称或是在结构上有误差的对称。LED灯丝100在侧视图中的两个对称部分的结构之间的误差(容许误差)可以是20％-50％或更低。Based on the symmetrical nature of the LED filament 100, the structure of the two symmetrical portions of the LED filament 100 in the side view (the first portion 100p1 and the second portion 100p2 or the third portion 100p3 and the fourth portion 100p4) may be completely symmetrical or structurally Symmetry of the error. The error (tolerance error) between the structures of the two symmetrical portions of the LED filament 100 in the side view may be 20% to 50% or less.
误差可以定义为坐标(即x坐标与y坐标)上的差异，例如，若LED灯丝100在第一象限的第一部分100p1上有一指定点，而LED灯丝100在第二象限的第二部分100p2上有一相对于Y轴对称于所述指定点的对称点，则所述指定点的y坐标或x坐标的绝对值可以等于所述对称点的y坐标或x坐标的绝对值，或可以相对于所述对称点的y坐标或x坐标的绝对值具有20％的差异。The error can be defined as the difference in coordinates (i.e., the x-coordinate and the y-coordinate), for example, if the LED filament 100 has a designated point on the first portion 100p1 of the first quadrant and the LED filament 100 is in the second portion 100p2 of the second quadrant a symmetric point symmetrical with respect to the specified point relative to the Y axis, the absolute value of the y coordinate or the x coordinate of the specified point may be equal to the absolute value of the y coordinate or the x coordinate of the symmetric point, or may be relative to The absolute value of the y-coordinate or x-coordinate of the symmetry point has a 20% difference.
例如，如图27D所示，LED灯丝100在第一象限的第一部分100p1的一个指定点(x1,y1)定义为第一位置，LED灯丝100在第二象限的第二部分100p2的一个对称点(x2,y2)定义为第二位置，对称点(x2,y2)的第二位置相对于Y轴对称于指定点(x1,y1)的第一位置。第一位置与第二位置可以是完全对称或是有20％-50％误差的对称。在本实施例中，第一部分100p1与第二部分100p2在结构上完全对称，也就是说，对称点(x2,y2)的x2会等于指定点(x1,y1)的负x1，而对称点(x2,y2)的y2会等于指定点(x1,y1)的y1。For example, as shown in FIG. 27D, the LED filament 100 is defined as a first position at a specified point (x1, y1) of the first portion 100p1 of the first quadrant, and a symmetrical point of the LED filament 100 at the second portion 100p2 of the second quadrant. (x2, y2) is defined as the second position, and the second position of the symmetry point (x2, y2) is symmetrical with respect to the Y axis to the first position of the specified point (x1, y1). The first position and the second position may be completely symmetrical or have a symmetry of 20%-50% error. In this embodiment, the first portion 100p1 and the second portion 100p2 are completely symmetrical in structure, that is, the x2 of the symmetry point (x2, y2) is equal to the negative x1 of the specified point (x1, y1), and the symmetry point ( The y2 of x2, y2) will be equal to the y1 of the specified point (x1, y1).
例如，如图27D所示，LED灯丝100在第三象限的第三部分100p3的一个指定点(x3,y3)定义为第三位置，LED灯丝100在第四象限的第四部分100p4的一个对称点(x4,y4)定义为第四位置，对称点(x4,y4)的第四位置相对于Y轴对称于指定点(x3,y3)的第三位置。第三位置与第四位置可以是完全对称或是有20％-50％误差的对称。在本实施例中，第三部分100p3与第四部分100p4在结构上有误差的对称(例如在坐标上会有小于20％的误差)，也就是说，对称点(x4,y4)的x4的绝对值不等于指定点(x3,y3)的x3的绝对值，而对称点(x4,y4)的y4的绝对值不等于指定点(x3,y3)的y3的绝对值。如图27D所示，指定点 (x3,y3)的垂直高度稍低于对称点(x4,y4)的垂直高度，而指定点(x3,y3)比起对称点(x4,y4)更靠近Y轴。相应地，y4的绝对值稍小于y3的绝对值，而x4的绝对值稍大于x3的绝对值。For example, as shown in FIG. 27D, the LED filament 100 is defined as a third position at a specified point (x3, y3) of the third portion 100p3 of the third quadrant, and a symmetry of the LED filament 100 in the fourth portion 100p4 of the fourth quadrant The point (x4, y4) is defined as the fourth position, and the fourth position of the symmetry point (x4, y4) is symmetrical with respect to the Y axis to the third position of the specified point (x3, y3). The third position and the fourth position may be completely symmetrical or have a symmetry of 20%-50% error. In the present embodiment, the third portion 100p3 and the fourth portion 100p4 are structurally symmetrical (for example, there is less than 20% error in coordinates), that is, x4 of the symmetry point (x4, y4). The absolute value is not equal to the absolute value of x3 of the specified point (x3, y3), and the absolute value of y4 of the symmetric point (x4, y4) is not equal to the absolute value of y3 of the specified point (x3, y3). As shown in Fig. 27D, the vertical height of the specified point (x3, y3) is slightly lower than the vertical height of the symmetrical point (x4, y4), and the specified point (x3, y3) is closer to Y than the symmetrical point (x4, y4). axis. Accordingly, the absolute value of y4 is slightly smaller than the absolute value of y3, and the absolute value of x4 is slightly larger than the absolute value of x3.
如图27D所示，LED灯丝100在侧视图中的第一象限的第一部分100p1的长度大致上等于LED灯丝100在侧视图中的第二象限的第二部分100p2的长度。在本实施例中，所述长度是在一平面图上(如侧视图、前视图或顶视图)沿着LED灯丝100的延长方向而定义的。例如，第一部分100p1在图27D的侧视图的第一象限延长而形成倒“V”形，其具有分别接触X轴与Y轴的两端，而第一部分100p1的长度则是沿着在X轴与Y轴之间的倒“V”形来定义。As shown in Fig. 27D, the length of the first portion 100p1 of the first quadrant of the LED filament 100 in a side view is substantially equal to the length of the second portion 100p2 of the second quadrant of the LED filament 100 in a side view. In the present embodiment, the length is defined along a direction in which the LED filament 100 extends in a plan view such as a side view, a front view or a top view. For example, the first portion 100p1 is elongated in the first quadrant of the side view of FIG. 27D to form an inverted "V" shape having ends that respectively contact the X-axis and the Y-axis, and the length of the first portion 100p1 is along the X-axis. Defined by the inverted "V" shape between the Y axis.
此外，LED灯丝100在侧视图中的第三象限的第三部分100p3的长度大致上等于LED灯丝100在侧视图中的第四象限的第四部分100p4的长度。由于第三部分100p3与第四部分100p4相对于Y轴彼此在结构上有误差的对称，因此第三部分100p3的长度与第四部分100p4的长度有些许误差。此误差可以是20％-50％或更低。Furthermore, the length of the third portion 100p3 of the third quadrant of the LED filament 100 in a side view is substantially equal to the length of the fourth portion 100p4 of the fourth quadrant of the LED filament 100 in a side view. Since the third portion 100p3 and the fourth portion 100p4 are structurally symmetrical with respect to each other with respect to the Y axis, the length of the third portion 100p3 is slightly different from the length of the fourth portion 100p4. This error can be 20%-50% or lower.
如图27D所示，在侧视图中，第一部分100p1的指定点的出光方向与第二部分100p2的对称点的出光方向，会相对于Y轴在方向上对称。在本实施例中，出光方向可以定义为LED芯片所面对的方向。并且LED芯片面对的方向定义为主发光面Lm面对的方向，因此出光方向也可以定义为主发光面Lm的法线方向。例如，第一部分100p1的指定点(x1,y1)的出光方向ED在图27D中为向上，而第二部分100p2的对称点(x2,y2)的出光方向ED在图27D中为向上。指定点(x1,y1)的出光方向ED与对称点(x2,y2)的出光方向ED相对于Y轴对称。此外，第三部分100p3的指定点(x3,y3)的出光方向ED在图27D中是朝向左下方向，而第四部分100p4的对称点(x4,y4)的出光方向ED在图27D中是朝向右下方向。指定点(x3,y3)的出光方向ED与对称点(x4,y4)的出光方向ED相对于Y轴对称。As shown in Fig. 27D, in the side view, the light-emitting direction of the designated point of the first portion 100p1 and the light-emitting direction of the symmetrical point of the second portion 100p2 are symmetrical in the direction with respect to the Y-axis. In this embodiment, the light exiting direction may be defined as the direction in which the LED chip faces. And the direction in which the LED chip faces is defined as the direction in which the main light-emitting surface Lm faces, and thus the light-emitting direction can also be defined as the normal direction of the main light-emitting surface Lm. For example, the light-emitting direction ED of the designated point (x1, y1) of the first portion 100p1 is upward in FIG. 27D, and the light-emitting direction ED of the symmetrical point (x2, y2) of the second portion 100p2 is upward in FIG. 27D. The light-emitting direction ED of the designated point (x1, y1) and the light-emitting direction ED of the symmetrical point (x2, y2) are symmetrical with respect to the Y-axis. Further, the light-emitting direction ED of the designated point (x3, y3) of the third portion 100p3 is toward the lower left direction in FIG. 27D, and the light-emitting direction ED of the symmetrical point (x4, y4) of the fourth portion 100p4 is oriented in FIG. 27D. Right lower direction. The light outgoing direction ED of the designated point (x3, y3) and the light emitting direction ED of the symmetric point (x4, y4) are symmetrical with respect to the Y axis.
请参照图27E，图27E为图27C的LED灯丝100呈现在定义有四个象限的二维坐标系中。图27E的LED灯丝100同于图27C的LED灯丝100，图27E是图27A的LED球泡灯20d的顶视图。如图27C与图27E所示，四个象限的原心被定义为LED球泡灯20d在顶视图中的立杆19a的中心(例如，图27A的立杆19a的顶部中心)。在本实施例中，Y轴在图27E中为垂直，而X轴在图27E中为水平。如图27E所示，LED灯丝100在顶视图中会被X轴与Y轴分为第一部分100p1、第二部分100p2、第三部分100p3与第四部分100p4。LED灯丝100的第一部分100p1是在顶视图中呈现在第一象限的部分，LED灯丝100的第二部分100p2是在顶视图中呈现在第二象限的部分，LED灯丝100的第三部分100p3是在顶视图中呈现在第三象限的部分，而LED灯丝100的第四部分100p4是在顶视图中呈现在第四象限的部分。Referring to Figure 27E, Figure 27E shows the LED filament 100 of Figure 27C in a two-dimensional coordinate system defined with four quadrants. The LED filament 100 of Fig. 27E is the same as the LED filament 100 of Fig. 27C, and Fig. 27E is a top view of the LED bulb 20d of Fig. 27A. As shown in Fig. 27C and Fig. 27E, the center of the four quadrants is defined as the center of the uprights 19a of the LED bulb 20d in the top view (e.g., the top center of the uprights 19a of Fig. 27A). In the present embodiment, the Y axis is vertical in Fig. 27E and the X axis is horizontal in Fig. 27E. As shown in Fig. 27E, the LED filament 100 is divided into a first portion 100p1, a second portion 100p2, a third portion 100p3 and a fourth portion 100p4 by X-axis and Y-axis in a top view. The first portion 100p1 of the LED filament 100 is the portion that is presented in the first quadrant in a top view, the second portion 100p2 of the LED filament 100 is the portion that appears in the second quadrant in a top view, and the third portion 100p3 of the LED filament 100 is The portion in the third quadrant is presented in a top view, while the fourth portion 100p4 of the LED filament 100 is the portion that appears in the fourth quadrant in a top view.
在一些实施例中，在顶视图的LED灯丝100可以是点对称(例如根据四象限的原点对称)或是线对称(例如根据四象限的两个轴之一对称)。在本实施例中，如图27E所示，LED灯丝100在顶视图为线对称，且特别是LED灯丝100在顶视图中会相对于Y轴对称，也就是说，第一部分100p1与第四部分100p42的几何形状会对称于第二部分100p2与第三部分100p3的几何形状。具体而言，在顶视图中，第一部分100p1会对称于第二部分100p2，更进 一步来说，在顶视图中，第一部分100p1与第二部分100p2会在结构上相对于Y轴对称。此外，在顶视图中，第三部分100p3会对称于第四部分100p4，更进一步来说，在顶视图中，第三部分100p3与第四部分100p4会在结构上相对于Y轴对称。In some embodiments, the LED filaments 100 in the top view may be point symmetric (eg, symmetric according to the origin of the four quadrants) or line symmetric (eg, symmetric according to one of the two axes of the four quadrants). In the present embodiment, as shown in FIG. 27E, the LED filament 100 is line symmetrical in a top view, and in particular, the LED filament 100 is symmetrical with respect to the Y axis in a top view, that is, the first portion 100p1 and the fourth portion. The geometry of 100p42 will be symmetrical to the geometry of the second portion 100p2 and the third portion 100p3. Specifically, in the top view, the first portion 100p1 will be symmetric with respect to the second portion 100p2, and further, in the top view, the first portion 100p1 and the second portion 100p2 will be structurally symmetric with respect to the Y-axis. Further, in the top view, the third portion 100p3 will be symmetric with respect to the fourth portion 100p4, and further, in the top view, the third portion 100p3 and the fourth portion 100p4 will be structurally symmetric with respect to the Y-axis.
基于LED灯丝100的对称特性，顶视图中LED灯丝100的两对称部分的结构(第一部分100p1与第二部分100p2或第三部分100p3与第四部分100p4)可以是完全对称或是在结构上有误差的对称。LED灯丝100在顶视图中的两个对称部分的结构之间的误差(容许误差)可以是20％-50％或更低。Based on the symmetrical nature of the LED filament 100, the structure of the two symmetrical portions of the LED filament 100 in the top view (the first portion 100p1 and the second portion 100p2 or the third portion 100p3 and the fourth portion 100p4) may be completely symmetrical or structurally Symmetry of the error. The error (tolerance) between the structures of the two symmetrical portions of the LED filament 100 in the top view may be 20% to 50% or less.
例如，如图27E所示，LED灯丝100在第一象限的第一部分100p1的一个指定点(x1,y1)定义为第一位置，LED灯丝100在第二象限的第二部分100p2的一个对称点(x2,y2)定义为第二位置，对称点(x2,y2)的第二位置相对于Y轴对称于指定点(x1,y1)的第一位置。第一位置与第二位置可以是完全对称或是有20％-50％误差的对称。在本实施例中，第一部分100p1与第二部分100p2在结构上完全对称，也就是说，对称点(x2,y2)的x2会等于指定点(x1,y1)的负x1，而对称点(x2,y2)的y2会等于指定点(x1,y1)的y1。For example, as shown in FIG. 27E, the LED filament 100 is defined as a first position at a designated point (x1, y1) of the first portion 100p1 of the first quadrant, and a symmetrical point of the LED filament 100 at the second portion 100p2 of the second quadrant. (x2, y2) is defined as the second position, and the second position of the symmetry point (x2, y2) is symmetrical with respect to the Y axis to the first position of the specified point (x1, y1). The first position and the second position may be completely symmetrical or have a symmetry of 20%-50% error. In this embodiment, the first portion 100p1 and the second portion 100p2 are completely symmetrical in structure, that is, the x2 of the symmetry point (x2, y2) is equal to the negative x1 of the specified point (x1, y1), and the symmetry point ( The y2 of x2, y2) will be equal to the y1 of the specified point (x1, y1).
例如，如图27E所示，LED灯丝100在第三象限的第三部分100p3的一个指定点(x3,y3)定义为第三位置，LED灯丝100在第四象限的第四部分100p4的一个对称点(x4,y4)定义为第四位置，对称点(x4,y4)的第四位置相对于Y轴对称于指定点(x3,y3)的第三位置。第三位置与第四位置可以是完全对称或是有20％-50％误差的对称。在本实施例中，第三部分100p3与第四部分100p4在结构上有误差的对称(例如在坐标上会有小于20％的误差)，也就是说，对称点(x4,y4)的x4不等于指定点(x3,y3)的x3的负值，而对称点(x4,y4)的y4不等于指定点(x3,y3)的y3。如图27E所示，指定点(x3,y3)的垂直高度稍低于对称点(x4,y4)的垂直高度，而指定点(x3,y3)比起对称点(x4,y4)更靠近Y轴。相应地，y4的绝对值稍小于y3的绝对值，而x4的绝对值稍大于x3的绝对值。For example, as shown in FIG. 27E, the LED filament 100 is defined as a third position at a designated point (x3, y3) of the third portion 100p3 of the third quadrant, and a symmetry of the LED filament 100 in the fourth portion 100p4 of the fourth quadrant The point (x4, y4) is defined as the fourth position, and the fourth position of the symmetry point (x4, y4) is symmetrical with respect to the Y axis to the third position of the specified point (x3, y3). The third position and the fourth position may be completely symmetrical or have a symmetry of 20%-50% error. In this embodiment, the third portion 100p3 and the fourth portion 100p4 are structurally symmetrical (for example, there is less than 20% error in coordinates), that is, the x4 of the symmetry point (x4, y4) is not A negative value equal to x3 of the specified point (x3, y3), and y4 of the symmetric point (x4, y4) is not equal to y3 of the specified point (x3, y3). As shown in Fig. 27E, the vertical height of the specified point (x3, y3) is slightly lower than the vertical height of the symmetry point (x4, y4), and the specified point (x3, y3) is closer to Y than the symmetry point (x4, y4). axis. Accordingly, the absolute value of y4 is slightly smaller than the absolute value of y3, and the absolute value of x4 is slightly larger than the absolute value of x3.
如图27E所示，LED灯丝100在顶视图中的第一象限的第一部分100p1的长度大致上等于LED灯丝100在顶视图中的第二象限的第二部分100p2的长度。在本实施例中，所述长度是在一平面图上(如顶视图、前视图或侧视图)沿着LED灯丝100的延长方向而定义的。例如，第二部分100p2在图27E的顶视图的第二象限延长而形成倒“L”形，其具有分别接触X轴与Y轴的两端，而第二部分100p2的长度则是沿着倒“L”形来定义。As shown in Figure 27E, the length of the first portion 100p1 of the first quadrant of the LED filament 100 in a top view is substantially equal to the length of the second portion 100p2 of the second quadrant of the LED filament 100 in a top view. In the present embodiment, the length is defined along a direction in which the LED filament 100 is extended in a plan view such as a top view, a front view or a side view. For example, the second portion 100p2 is elongated in the second quadrant of the top view of FIG. 27E to form an inverted "L" shape having ends that respectively contact the X-axis and the Y-axis, and the length of the second portion 100p2 is reversed. The "L" shape is defined.
此外，LED灯丝100在顶视图中的第三象限的第三部分100p3的长度大致上等于LED灯丝100在顶视图中的第四象限的第四部分100p4的长度。由于第三部分100p3与第四部分100p4相对于Y轴彼此在结构上有误差的对称，因此第三部分100p3的长度与第四部分100p4的长度有些许误差。此误差可以是20％-50％或更低。Furthermore, the length of the third portion 100p3 of the third quadrant of the LED filament 100 in the top view is substantially equal to the length of the fourth portion 100p4 of the fourth quadrant of the LED filament 100 in the top view. Since the third portion 100p3 and the fourth portion 100p4 are structurally symmetrical with respect to each other with respect to the Y axis, the length of the third portion 100p3 is slightly different from the length of the fourth portion 100p4. This error can be 20%-50% or lower.
如图27E所示，在顶视图中，第一部分100p1的指定点的出光方向与第二部分100p2的对称点的出光方向，会相对于Y轴在方向上对称。在本实施例中，出光方向可以定义为LED芯片所面对的方向。并且LED芯片面对的方向定义为主发光面Lm面对的方向，因此出光方向也可以定义为主发光面Lm的法线方向。例如，第一部分100p1的指定点(x1,y1) 的出光方向ED在图27E中为向右，而第二部分100p2的对称点(x2,y2)的出光方向ED在图27E中为向左。指定点(x1,y1)的出光方向ED与对称点(x2,y2)的出光方向ED相对于Y轴对称。此外，第三部分100p3的指定点(x3,y3)的出光方向ED在图27E中是朝向左下方向，而第四部分100p4的对称点(x4,y4)的出光方向ED在图27E中是朝向右下方向。指定点(x3,y3)的出光方向ED与对称点(x4,y4)的出光方向ED相对于Y轴对称。此外，在顶视图中，第一部分100p1上的任一指定点的出光方向ED与第二部分100p2上的对称于指定点的任一对应对称点的出光方向ED，会相对于Y轴在方向上对称。且在顶视图中，第三部分100p3上的任一指定点的出光方向ED与第四部分100p4上的对称于指定点的任一对应对称点的出光方向ED，会相对于Y轴在方向上对称。As shown in Fig. 27E, in the top view, the light-emitting direction of the designated point of the first portion 100p1 and the light-emitting direction of the symmetrical point of the second portion 100p2 are symmetrical in the direction with respect to the Y-axis. In this embodiment, the light exiting direction may be defined as the direction in which the LED chip faces. And the direction in which the LED chip faces is defined as the direction in which the main light-emitting surface Lm faces, and thus the light-emitting direction can also be defined as the normal direction of the main light-emitting surface Lm. For example, the light-emitting direction ED of the designated point (x1, y1) of the first portion 100p1 is rightward in FIG. 27E, and the light-emitting direction ED of the symmetrical point (x2, y2) of the second portion 100p2 is leftward in FIG. 27E. The light-emitting direction ED of the designated point (x1, y1) and the light-emitting direction ED of the symmetrical point (x2, y2) are symmetrical with respect to the Y-axis. Further, the light-emitting direction ED of the designated point (x3, y3) of the third portion 100p3 is toward the lower left direction in FIG. 27E, and the light-emitting direction ED of the symmetrical point (x4, y4) of the fourth portion 100p4 is oriented in FIG. 27E. Right lower direction. The light outgoing direction ED of the designated point (x3, y3) and the light emitting direction ED of the symmetric point (x4, y4) are symmetrical with respect to the Y axis. In addition, in the top view, the light-emitting direction ED of any given point on the first portion 100p1 and the light-emitting direction ED of any corresponding symmetric point on the second portion 100p2 that is symmetric with respect to the specified point will be in the direction relative to the Y-axis. symmetry. And in the top view, the light-emitting direction ED of any specified point on the third portion 100p3 and the light-emitting direction ED of any corresponding symmetric point on the fourth portion 100p4 that is symmetric with respect to the specified point are in the direction relative to the Y-axis. symmetry.
如前所述的实施例，在侧视图(包括前视图或后视图)及/或顶视图中，LED灯丝100的关于对称结构、对称出光方向、LED芯片442的对称配置、LED芯片442的对称功率布置、对称折射率及/或对称表面粗糙度的对称特性，有助于产生均匀分布的光线，且LED芯片442的对称功率布置、对称折射率及/或对称表面粗糙度的对称设计，可搭配上述LED灯丝的分段特性进行综合考虑，使得具有LED灯丝100的LED球泡灯能够产生全周光。The symmetrical structure of the LED filament 100, the symmetrical light exit direction, the symmetric configuration of the LED chip 442, and the symmetry of the LED chip 442 in a side view (including front or rear view) and/or top view, as previously described. Symmetrical characteristics of power placement, symmetric refractive index, and/or symmetrical surface roughness contribute to uniform distribution of light, and symmetric design of symmetric power placement, symmetric refractive index, and/or symmetrical surface roughness of LED chip 442, A comprehensive consideration of the segmentation characteristics of the LED filament described above enables the LED bulb having the LED filament 100 to generate full illumination.
请参照图28A与图28B，图28A所示为根据本发明的一个实施例的LED球泡灯20e的示意图，图28B所示为图28A的LED球泡灯20e的侧视图。图28A与图28B所示的LED球泡灯20e类似于图27A所示的LED球泡灯20d。LED球泡灯20e与LED球泡灯20d的主要差异在于LED灯丝100，如图28A所示，LED球泡灯20e的LED灯丝100连接立杆19a的顶端，且延伸形成两个彼此垂直的圆形。在本实施例中，LED灯丝100位在立杆19a上方，且立杆19a(也就是芯柱)位于灯头16与LED灯丝100之间。Referring to Figures 28A and 28B, Figure 28A is a schematic illustration of an LED bulb 20e in accordance with one embodiment of the present invention, and Figure 28B is a side view of the LED bulb 20e of Figure 28A. The LED bulb 20e shown in Figs. 28A and 28B is similar to the LED bulb 20d shown in Fig. 27A. The main difference between the LED bulb lamp 20e and the LED bulb lamp 20d is the LED filament 100. As shown in Fig. 28A, the LED filament 100 of the LED bulb lamp 20e is connected to the top end of the upright 19a and extends to form two circles perpendicular to each other. shape. In the present embodiment, the LED filament 100 is positioned above the upright 19a, and the upright 19a (ie, the stem) is located between the base 16 and the LED filament 100.
如图28B所示，LED灯丝100呈现于定义有四个象限的二维坐标系中。在本实施例中，Y轴对齐立杆19a而X轴横越立杆19a。如图28B所示，侧视图中的LED灯丝100可被Y轴区分为第一部分100p1与第二部分100p2，且LED灯丝100完全位于图17B的上方象限中。LED灯丝100的第一部分100p1是在侧视图中呈现在第一象限的部分，LED灯丝100的第二部分100p2是在侧视图中呈现在第二象限的部分。LED灯丝100是线对称，且LED灯丝100是在侧视图中相对于Y轴对称，而第一部分100p1与第二部分100p2是在侧视图中相对于Y轴在结构上对称。第一部分100p1在侧视图中形成半圆形，且第二部分100p2在侧视图中形成半圆形，第一部分100p1与第二部分100p2在侧视图中共同形成一个圆形。此外，第一部分100p1的出光方向ED与第二部分100p2的出光方向ED是在侧视图中相对于Y轴在方向上对称。As shown in Figure 28B, the LED filament 100 is presented in a two-dimensional coordinate system defined with four quadrants. In the present embodiment, the Y axis is aligned with the upright 19a and the X axis is traversed by the upright 19a. As shown in Fig. 28B, the LED filament 100 in the side view can be divided into a first portion 100p1 and a second portion 100p2 by the Y axis, and the LED filament 100 is completely located in the upper quadrant of Fig. 17B. The first portion 100p1 of the LED filament 100 is the portion that appears in the first quadrant in a side view, and the second portion 100p2 of the LED filament 100 is the portion that appears in the second quadrant in a side view. The LED filament 100 is line symmetrical, and the LED filament 100 is symmetrical with respect to the Y axis in a side view, while the first portion 100p1 and the second portion 100p2 are structurally symmetrical with respect to the Y axis in a side view. The first portion 100p1 forms a semicircle in a side view, and the second portion 100p2 forms a semicircle in a side view, and the first portion 100p1 and the second portion 100p2 together form a circular shape in a side view. Further, the light-emitting direction ED of the first portion 100p1 and the light-emitting direction ED of the second portion 100p2 are symmetrical in the direction with respect to the Y-axis in a side view.
请参照图28C，图28C所示为图28A的LED球泡灯20e的顶视图。图28C的LED灯丝100呈现于定义有四个象限的二维坐标系中。四个象限的原点定义为顶视图中的LED球泡灯20e的立杆19a的中心(如图28A的立杆19a的顶端的中心)，在本实施例中，图28C的Y轴是倾斜的，且图28C的X轴也是倾斜的。如图28C所示，顶视图中的LED灯丝100可被X轴与Y轴区分为第一部分100p1、第二部分100p2、第三部分100p3与第四部分100p4。LED 灯丝100的第一部分100p1是在顶视图中呈现在第一象限的部分，LED灯丝100的第二部分100p2是在顶视图中呈现在第二象限的部分，LED灯丝100的第三部分100p3是在顶视图中呈现在第三象限的部分，而LED灯丝100的第四部分100p4是在顶视图中呈现在第四象限的部分。在本实施例中，顶视图中的LED灯丝100是点对称，具体来说，LED灯丝100是在顶视图中相对于四个象限的原点对称。换句话说，LED灯丝100在顶视图中的结构会同于LED灯丝100在顶视图中绕原点旋转180度后的结构。Referring to Figure 28C, Figure 28C is a top plan view of the LED bulb 20e of Figure 28A. The LED filament 100 of Figure 28C is presented in a two-dimensional coordinate system defined with four quadrants. The origin of the four quadrants is defined as the center of the upright 19a of the LED bulb 20e in the top view (as in the center of the top end of the upright 19a of Fig. 28A), in the present embodiment, the Y-axis of Fig. 28C is inclined. And the X axis of Fig. 28C is also inclined. As shown in FIG. 28C, the LED filament 100 in the top view can be divided into a first portion 100p1, a second portion 100p2, a third portion 100p3, and a fourth portion 100p4 by the X-axis and the Y-axis. The first portion 100p1 of the LED filament 100 is the portion that is presented in the first quadrant in a top view, the second portion 100p2 of the LED filament 100 is the portion that appears in the second quadrant in a top view, and the third portion 100p3 of the LED filament 100 is The portion in the third quadrant is presented in a top view, while the fourth portion 100p4 of the LED filament 100 is the portion that appears in the fourth quadrant in a top view. In the present embodiment, the LED filament 100 in the top view is point symmetrical, specifically, the LED filament 100 is symmetrical with respect to the origin of the four quadrants in a top view. In other words, the structure of the LED filament 100 in the top view will be the same as the structure in which the LED filament 100 is rotated 180 degrees around the origin in the top view.
例如，如图28C所示，LED灯丝100在第一象限的第一部分100p1的一个指定点(x1,y1)定义为第一位置，LED灯丝100在第三象限的第三部分100p2的一个对称点(x2,y2)定义为第二位置，对称点(x2,y2)的第二位置相对于原点对称于指定点(x1,y1)的第一位置。换句话说，当LED灯丝100在顶视图中绕原点旋转180度后，LED灯丝100在顶视图中的第一部分100p1的指定点(x1,y1)会重叠LED灯丝100在顶视图中的第三部分100p3的对称点(x2,y2)。For example, as shown in FIG. 28C, the LED filament 100 is defined as a first position at a specified point (x1, y1) of the first portion 100p1 of the first quadrant, and a symmetrical point of the LED filament 100 at the third portion 100p2 of the third quadrant. (x2, y2) is defined as the second position, and the second position of the symmetry point (x2, y2) is symmetrical with respect to the origin to the first position of the specified point (x1, y1). In other words, when the LED filament 100 is rotated 180 degrees around the origin in the top view, the designated point (x1, y1) of the first portion 100p1 of the LED filament 100 in the top view overlaps the third of the LED filament 100 in the top view. The symmetry point (x2, y2) of the part 100p3.
例如，如图28C所示，LED灯丝100在第二象限的第二部分100p2的一个指定点(x3,y3)定义为第三位置，LED灯丝100在第四象限的第四部分100p4的一个对称点(x4,y4)定义为第四位置，对称点(x4,y4)的第四位置相对于原点对称于指定点(x3,y3)的第三位置。换句话说，当LED灯丝100在顶视图中绕原点旋转180度后，LED灯丝100在顶视图中的第二部分100p2的指定点(x3,y3)会重叠LED灯丝100在顶视图中的第四部分100p4的对称点(x4,y4)。For example, as shown in FIG. 28C, the LED filament 100 is defined as a third position at a specified point (x3, y3) of the second portion 100p2 of the second quadrant, and a symmetry of the LED filament 100 in the fourth portion 100p4 of the fourth quadrant The point (x4, y4) is defined as the fourth position, and the fourth position of the symmetry point (x4, y4) is symmetrical with respect to the origin to the third position of the specified point (x3, y3). In other words, when the LED filament 100 is rotated 180 degrees around the origin in the top view, the designated point (x3, y3) of the second portion 100p2 of the LED filament 100 in the top view overlaps the LED filament 100 in the top view. Four parts of the 100p4 symmetry point (x4, y4).
在本实施例中，LED灯丝100在顶视图中也是线对称的。具体而言，LED灯丝100在顶视图中是相对于X轴或Y轴对称。也就是说，第一部分100p1与第二部分100p2是相对于Y轴对称，且第三部分100p3与第四部分100p4是相对于Y轴对称。此外，第一部分100p1与第四部分100p4是相对于X轴对称，且第二部分100p2与第三部分100p3是相对于X轴对称。第一部分100p1、第二部分100p2、第三部分100p3与第四部分100p4在顶视图中共同形成一个“X”形。In the present embodiment, the LED filament 100 is also line symmetrical in a top view. Specifically, the LED filament 100 is symmetrical with respect to the X-axis or the Y-axis in a top view. That is, the first portion 100p1 and the second portion 100p2 are symmetrical with respect to the Y axis, and the third portion 100p3 and the fourth portion 100p4 are symmetrical with respect to the Y axis. Further, the first portion 100p1 and the fourth portion 100p4 are symmetrical with respect to the X axis, and the second portion 100p2 and the third portion 100p3 are symmetrical with respect to the X axis. The first portion 100p1, the second portion 100p2, the third portion 100p3, and the fourth portion 100p4 together form an "X" shape in a top view.
此外，第一部分100p1的指定点(x1,y1)的出光方向ED与第三部分100p3的对称点(x2,y2)的出光方向ED在顶视图中相对于原点在方向上对称，且第二部分100p2的指定点(x3,y3)的出光方向ED与第四部分100p4的对称点(x4,y4)的出光方向ED在顶视图中相对于原点在方向上对称。进一步地，第一部分100p1的出光方向ED与第二部分100p2的出光方向ED在顶视图中相对于Y轴在方向上对称，且第三部分100p3的出光方向ED与第四部分100p4的出光方向ED在顶视图中相对于Y轴在方向上对称。而且，第一部分100p1的出光方向ED与第四部分100p4的出光方向ED在顶视图中相对于X轴在方向上对称，且第二部分100p2的出光方向ED与第三部分100p3的出光方向ED在顶视图中相对于X轴在方向上对称。Further, the light-emitting direction ED of the designated point (x1, y1) of the first portion 100p1 and the light-emitting direction ED of the symmetrical point (x2, y2) of the third portion 100p3 are symmetrical in the top view with respect to the origin, and the second portion The light exiting direction ED of the specified point (x3, y3) of 100p2 and the light exiting direction ED of the symmetrical point (x4, y4) of the fourth portion 100p4 are symmetrical in the top view with respect to the origin. Further, the light-emitting direction ED of the first portion 100p1 and the light-emitting direction ED of the second portion 100p2 are symmetrical in the top view with respect to the Y-axis, and the light-emitting direction ED of the third portion 100p3 and the light-emitting direction ED of the fourth portion 100p4. It is symmetrical in direction with respect to the Y axis in the top view. Moreover, the light-emitting direction ED of the first portion 100p1 and the light-emitting direction ED of the fourth portion 100p4 are symmetrical in the top view with respect to the X-axis, and the light-emitting direction ED of the second portion 100p2 and the light-emitting direction ED of the third portion 100p3 are The top view is symmetrical in direction with respect to the X axis.
请参照图29A与图29B，图29A所示为根据本发明的一个实施例的LED球泡灯20f的示意图，图29B所示为图29A的LED球泡灯20f的侧视图。图29A与图29B所示的LED球 泡灯20f类似于图27A所示的LED球泡灯20d。LED球泡灯20f与LED球泡灯20d的主要差异在于LED灯丝100，如图29A所示，LED球泡灯20f的LED灯丝100连接立杆19a，且延伸形成两个彼此垂直的圆形(或四个彼此垂直地半圆形)。LED灯丝100穿过立杆19a。Referring to Figures 29A and 29B, Figure 29A is a schematic view of an LED bulb 20f in accordance with one embodiment of the present invention, and Figure 29B is a side view of the LED bulb 20f of Figure 29A. The LED bulb 20f shown in Figs. 29A and 29B is similar to the LED bulb 20d shown in Fig. 27A. The main difference between the LED bulb 20f and the LED bulb 20d is the LED filament 100. As shown in Fig. 29A, the LED filament 100 of the LED bulb 20f is connected to the upright 19a and extends to form two circular circles perpendicular to each other ( Or four semi-circular perpendicular to each other). The LED filament 100 passes through the upright 19a.
如图29B所示，LED灯丝100呈现于定义有四个象限的二维坐标系中。在本实施例中，Y轴对齐立杆19a而X轴横越立杆19a。如图29B所示，侧视图中的LED灯丝100可被Y轴区分为第一部分100p1与第二部分100p2。LED灯丝100的第一部分100p1是在侧视图中呈现在第一象限的部分，LED灯丝100的第二部分100p2是在侧视图中呈现在第二象限的部分。As shown in Figure 29B, the LED filament 100 is presented in a two-dimensional coordinate system defined with four quadrants. In the present embodiment, the Y axis is aligned with the upright 19a and the X axis is traversed by the upright 19a. As shown in FIG. 29B, the LED filament 100 in a side view can be divided into a first portion 100p1 and a second portion 100p2 by a Y-axis. The first portion 100p1 of the LED filament 100 is the portion that appears in the first quadrant in a side view, and the second portion 100p2 of the LED filament 100 is the portion that appears in the second quadrant in a side view.
LED灯丝100是线对称，且LED灯丝100是在侧视图中相对于Y轴对称，而第一部分100p1与第二部分100p2是在侧视图中相对于Y轴在结构上对称。此外，第一部分100p1的出光方向ED与第二部分100p2的出光方向ED是在侧视图中相对于Y轴在方向上对称。The LED filament 100 is line symmetrical, and the LED filament 100 is symmetrical with respect to the Y axis in a side view, while the first portion 100p1 and the second portion 100p2 are structurally symmetrical with respect to the Y axis in a side view. Further, the light-emitting direction ED of the first portion 100p1 and the light-emitting direction ED of the second portion 100p2 are symmetrical in the direction with respect to the Y-axis in a side view.
请参照图29C，图29C所示为图29A的LED球泡灯20f的顶视图。图29C的LED灯丝100呈现于定义有四个象限的二维坐标系中。四个象限的原点定义为顶视图中的LED球泡灯20f的立杆19a的中心(如图29A的立杆19a的顶端的中心)，在本实施例中，图29C的Y轴是倾斜的，且图29C的X轴也是倾斜的。如图29C所示，顶视图中的LED灯丝100可被X轴与Y轴区分为第一部分100p1、第二部分100p2、第三部分100p3与第四部分100p4。LED灯丝100的第一部分100p1是在顶视图中呈现在第一象限的部分，LED灯丝100的第二部分100p2是在顶视图中呈现在第二象限的部分，LED灯丝100的第三部分100p3是在顶视图中呈现在第三象限的部分，而LED灯丝100的第四部分100p4是在顶视图中呈现在第四象限的部分。在本实施例中，顶视图中的LED灯丝100是点对称，具体来说，LED灯丝100是在顶视图中相对于四个象限的原点对称。换句话说，LED灯丝100在顶视图中的结构会同于LED灯丝100在顶视图中绕原点旋转180度后的结构。Referring to FIG. 29C, FIG. 29C is a top view of the LED bulb 20f of FIG. 29A. The LED filament 100 of Figure 29C is presented in a two-dimensional coordinate system defined with four quadrants. The origin of the four quadrants is defined as the center of the upright 19a of the LED bulb 20f in the top view (as in the center of the top end of the upright 19a of Fig. 29A), and in the present embodiment, the Y-axis of Fig. 29C is inclined. And the X-axis of Fig. 29C is also inclined. As shown in FIG. 29C, the LED filament 100 in the top view can be divided into a first portion 100p1, a second portion 100p2, a third portion 100p3, and a fourth portion 100p4 by the X-axis and the Y-axis. The first portion 100p1 of the LED filament 100 is the portion that is presented in the first quadrant in a top view, the second portion 100p2 of the LED filament 100 is the portion that appears in the second quadrant in a top view, and the third portion 100p3 of the LED filament 100 is The portion in the third quadrant is presented in a top view, while the fourth portion 100p4 of the LED filament 100 is the portion that appears in the fourth quadrant in a top view. In the present embodiment, the LED filament 100 in the top view is point symmetrical, specifically, the LED filament 100 is symmetrical with respect to the origin of the four quadrants in a top view. In other words, the structure of the LED filament 100 in the top view will be the same as the structure in which the LED filament 100 is rotated 180 degrees around the origin in the top view.
例如，如图29C所示，LED灯丝100在第一象限的第一部分100p1的一个指定点(x1,y1)定为第一位置，LED灯丝100在第三象限的第三部分100p2的一个对称点(x2,y2)定义为第二位置，对称点(x2,y2)的第二位置相对于原点对称于指定点(x1,y1)的第一位置。换句话说，当LED灯丝100在顶视图中绕原点旋转180度后，LED灯丝100在顶视图中的第一部分100p1的指定点(x1,y1)会重叠LED灯丝100在顶视图中的第三部分100p3的对称点(x2,y2)。For example, as shown in FIG. 29C, the LED filament 100 is set to a first position at a specified point (x1, y1) of the first portion 100p1 of the first quadrant, and a symmetrical point of the LED filament 100 at the third portion 100p2 of the third quadrant. (x2, y2) is defined as the second position, and the second position of the symmetry point (x2, y2) is symmetrical with respect to the origin to the first position of the specified point (x1, y1). In other words, when the LED filament 100 is rotated 180 degrees around the origin in the top view, the designated point (x1, y1) of the first portion 100p1 of the LED filament 100 in the top view overlaps the third of the LED filament 100 in the top view. The symmetry point (x2, y2) of the part 100p3.
例如，如图29C所示，LED灯丝100在第二象限的第二部分100p2的一个指定点(x3,y3)定义为第三位置，LED灯丝100在第四象限的第四部分100p4的一个对称点(x4,y4)定义为第四位置，对称点(x4,y4)的第四位置相对于原点对称于指定点(x3,y3)的第三位置。换句话说，当LED灯丝100在顶视图中绕原点旋转180度后，LED灯丝100在顶视图中的第二部分100p2的指定点(x3,y3)会重叠LED灯丝100在顶视图中的第四部分100p4的对称点(x4,y4)。For example, as shown in FIG. 29C, the LED filament 100 is defined as a third position at a specified point (x3, y3) of the second portion 100p2 of the second quadrant, and a symmetry of the LED filament 100 in the fourth portion 100p4 of the fourth quadrant The point (x4, y4) is defined as the fourth position, and the fourth position of the symmetry point (x4, y4) is symmetrical with respect to the origin to the third position of the specified point (x3, y3). In other words, when the LED filament 100 is rotated 180 degrees around the origin in the top view, the designated point (x3, y3) of the second portion 100p2 of the LED filament 100 in the top view overlaps the LED filament 100 in the top view. Four parts of the 100p4 symmetry point (x4, y4).
在本实施例中，LED灯丝100在顶视图中也是线对称的。具体而言，LED灯丝100 在顶视图中是相对于X轴或Y轴对称。也就是说，第一部分100p1与第二部分100p2是相对于Y轴对称，且第三部分100p3与第四部分100p4是相对于Y轴对称。此外，第一部分100p1与第四部分100p4是相对于X轴对称，且第二部分100p2与第三部分100p3是相对于X轴对称。第一部分100p1与第四部分100p4在顶视图中共同形成一个“L”形，且第二部分100p2与第三部分100p3在顶视图中共同形成一个倒“L”形。In the present embodiment, the LED filament 100 is also line symmetrical in a top view. Specifically, the LED filament 100 is symmetrical with respect to the X-axis or the Y-axis in a top view. That is, the first portion 100p1 and the second portion 100p2 are symmetrical with respect to the Y axis, and the third portion 100p3 and the fourth portion 100p4 are symmetrical with respect to the Y axis. Further, the first portion 100p1 and the fourth portion 100p4 are symmetrical with respect to the X axis, and the second portion 100p2 and the third portion 100p3 are symmetrical with respect to the X axis. The first portion 100p1 and the fourth portion 100p4 together form an "L" shape in a top view, and the second portion 100p2 and the third portion 100p3 together form an inverted "L" shape in a top view.
此外，第一部分100p1的指定点(x1,y1)的出光方向ED与第三部分100p3的对称点(x2,y2)的出光方向ED在顶视图中相对于原点在方向上对称，且第二部分100p2的指定点(x3,y3)的出光方向ED与第四部分100p4的对称点(x4,y4)的出光方向ED在顶视图中相对于原点在方向上对称。进一步地，第一部分100p1的出光方向ED与第二部分100p2的出光方向ED在顶视图中相对于Y轴在方向上对称，且第三部分100p3的出光方向ED与第四部分100p4的出光方向ED在顶视图中相对于Y轴在方向上对称。而且，第一部分100p1的出光方向ED与第四部分100p4的出光方向ED在顶视图中相对于X轴在方向上对称，且第二部分100p2的出光方向ED与第三部分100p3的出光方向ED在顶视图中相对于X轴在方向上对称。Further, the light-emitting direction ED of the designated point (x1, y1) of the first portion 100p1 and the light-emitting direction ED of the symmetrical point (x2, y2) of the third portion 100p3 are symmetrical in the top view with respect to the origin, and the second portion The light exiting direction ED of the specified point (x3, y3) of 100p2 and the light exiting direction ED of the symmetrical point (x4, y4) of the fourth portion 100p4 are symmetrical in the top view with respect to the origin. Further, the light-emitting direction ED of the first portion 100p1 and the light-emitting direction ED of the second portion 100p2 are symmetrical in the top view with respect to the Y-axis, and the light-emitting direction ED of the third portion 100p3 and the light-emitting direction ED of the fourth portion 100p4. It is symmetrical in direction with respect to the Y axis in the top view. Moreover, the light-emitting direction ED of the first portion 100p1 and the light-emitting direction ED of the fourth portion 100p4 are symmetrical in the top view with respect to the X-axis, and the light-emitting direction ED of the second portion 100p2 and the light-emitting direction ED of the third portion 100p3 are The top view is symmetrical in direction with respect to the X axis.
请参照图30A与图30B，图30A所示为根据本发明的一个实施例的LED球泡灯20g的示意图，图30B所示为图30A的LED球泡灯20g的侧视图。图30A与图30B所示的LED球泡灯20g类似于图27A所示的LED球泡灯20d。LED球泡灯20g与LED球泡灯20d的主要差异在于LED灯丝100，如图30A所示，LED球泡灯20g的LED灯丝100连接立杆19a的顶部，且延伸形成两个在一个平面上的圆形。这两个由LED灯丝100形成的圆形为并排设置，且其形状类似代表无限的符号。LED灯丝100穿过立杆19a的顶部。Referring to Figures 30A and 30B, Figure 30A is a schematic view of an LED bulb 20g in accordance with one embodiment of the present invention, and Figure 30B is a side view of the LED bulb 20g of Figure 30A. The LED bulb 20g shown in Figs. 30A and 30B is similar to the LED bulb 20d shown in Fig. 27A. The main difference between the LED bulb lamp 20g and the LED bulb lamp 20d is the LED filament 100. As shown in Fig. 30A, the LED filament 100 of the LED bulb lamp 20g is connected to the top of the upright 19a and extends to form two on one plane. Round shape. The two circles formed by the LED filaments 100 are arranged side by side, and their shapes are similar to represent infinite symbols. The LED filament 100 passes through the top of the upright 19a.
如图30B所示，LED灯丝100呈现于定义有四个象限的二维坐标系中。在本实施例中，Y轴对齐立杆19a而X轴横越立杆19a。如图30B所示，侧视图中的LED灯丝100可被Y轴区分为第一部分100p1与第二部分100p2。LED灯丝100的第一部分100p1是在侧视图中呈现在第一象限的部分，LED灯丝100的第二部分100p2是在侧视图中呈现在第二象限的部分。LED灯丝100是线对称，且LED灯丝100是在侧视图中相对于Y轴对称，而第一部分100p1与第二部分100p2是在侧视图中相对于Y轴在结构上对称。此外，第一部分100p1的出光方向ED与第二部分100p2的出光方向ED是在侧视图中相对于Y轴在方向上对称。As shown in Figure 30B, the LED filament 100 is presented in a two-dimensional coordinate system defined with four quadrants. In the present embodiment, the Y axis is aligned with the upright 19a and the X axis is traversed by the upright 19a. As shown in FIG. 30B, the LED filament 100 in the side view can be divided into a first portion 100p1 and a second portion 100p2 by the Y-axis. The first portion 100p1 of the LED filament 100 is the portion that appears in the first quadrant in a side view, and the second portion 100p2 of the LED filament 100 is the portion that appears in the second quadrant in a side view. The LED filament 100 is line symmetrical, and the LED filament 100 is symmetrical with respect to the Y axis in a side view, while the first portion 100p1 and the second portion 100p2 are structurally symmetrical with respect to the Y axis in a side view. Further, the light-emitting direction ED of the first portion 100p1 and the light-emitting direction ED of the second portion 100p2 are symmetrical in the direction with respect to the Y-axis in a side view.
此外，如图30B所示，若X轴横越立杆19a且与侧视图中的LED灯丝100重叠，LED灯丝100也会是点对称的。Further, as shown in FIG. 30B, if the X-axis traverses the upright 19a and overlaps the LED filament 100 in the side view, the LED filament 100 is also point-symmetrical.
请参照图30C，图30C所示为图30A的LED球泡灯20g的顶视图。图30C的LED灯丝100呈现于定义有四个象限的二维坐标系中。四个象限的原点定义为顶视图中的LED球泡灯20g的立杆19a的中心(如图30A的立杆19a的顶端的中心)，在本实施例中，图30C的Y轴是垂直的，且图30C的X轴是水平的。如图30C所示，顶视图中的LED灯丝100可被X轴与Y轴区分为第一部分100p1、第二部分100p2、第三部分100p3与第四部分100p4。LED灯丝100的第一部分100p1是在顶视图中呈现在第一象限的部分，LED灯丝100的第二部分 100p2是在顶视图中呈现在第二象限的部分，LED灯丝100的第三部分100p3是在顶视图中呈现在第三象限的部分，而LED灯丝100的第四部分100p4是在顶视图中呈现在第四象限的部分。Referring to FIG. 30C, FIG. 30C is a top view of the LED bulb 20g of FIG. 30A. The LED filament 100 of Figure 30C is presented in a two-dimensional coordinate system defined with four quadrants. The origin of the four quadrants is defined as the center of the upright 19a of the LED bulb 20g in the top view (as in the center of the top end of the upright 19a of Fig. 30A). In the present embodiment, the Y-axis of Fig. 30C is vertical. And the X axis of Fig. 30C is horizontal. As shown in FIG. 30C, the LED filament 100 in the top view can be divided into a first portion 100p1, a second portion 100p2, a third portion 100p3, and a fourth portion 100p4 by the X-axis and the Y-axis. The first portion 100p1 of the LED filament 100 is the portion that is presented in the first quadrant in a top view, the second portion 100p2 of the LED filament 100 is the portion that appears in the second quadrant in a top view, and the third portion 100p3 of the LED filament 100 is The portion in the third quadrant is presented in a top view, while the fourth portion 100p4 of the LED filament 100 is the portion that appears in the fourth quadrant in a top view.
如图30C所示，在本实施例中，顶视图中的LED灯丝100是点对称，具体来说，LED灯丝100是在顶视图中相对于四个象限的原点对称。换句话说，LED灯丝100在顶视图中的结构会同于LED灯丝100在顶视图中绕原点旋转180度后的结构。并且，LED灯丝100的第一部分100p1与第三部分100p3是相对于原点对称，而LED灯丝100的第二部分100p2与第四部分100p4是相对于原点对称。As shown in Fig. 30C, in the present embodiment, the LED filament 100 in the top view is point symmetrical, specifically, the LED filament 100 is symmetrical with respect to the origin of the four quadrants in a top view. In other words, the structure of the LED filament 100 in the top view will be the same as the structure in which the LED filament 100 is rotated 180 degrees around the origin in the top view. Also, the first portion 100p1 and the third portion 100p3 of the LED filament 100 are symmetrical with respect to the origin, and the second portion 100p2 and the fourth portion 100p4 of the LED filament 100 are symmetrical with respect to the origin.
例如，如图30C所示，LED灯丝100在第一象限的第一部分100p1的一个指定点(x1,y1)定义为第一位置，LED灯丝100在第三象限的第三部分100p3的一个对称于指定点(x1,y1)的对称点(x3,y3)定义为第二位置，对称点(x3,y3)的第二位置相对于原点对称于指定点(x1,y1)的第一位置。换句话说，当LED灯丝100在顶视图中绕原点旋转180度后，LED灯丝100在顶视图中的第一部分100p1的指定点(x1,y1)会重叠LED灯丝100在顶视图中的第三部分100p3的对称点(x3,y3)。此外，LED灯丝100在第二象限的第二部分100p2的一个指定点(x2,y2)定义为第三位置，LED灯丝100在第四象限的第四部分100p4的一个对称于指定点(x2,y2)的对称点(x4,y4)定义为第四位置，对称点(x4,y4)的第四位置相对于原点对称于指定点(x2,y2)的第三位置。换句话说，当LED灯丝100在顶视图中绕原点旋转180度后，LED灯丝100在顶视图中的第二部分100p2的指定点(x2,y2)会重叠LED灯丝100在顶视图中的第四部分100p4的对称点(x4,y4)。For example, as shown in FIG. 30C, the LED filament 100 is defined as a first position at a specified point (x1, y1) of the first portion 100p1 of the first quadrant, and a symmetrical of the LED filament 100 in the third portion 100p3 of the third quadrant is The symmetry point (x3, y3) of the specified point (x1, y1) is defined as the second position, and the second position of the symmetry point (x3, y3) is symmetrical with respect to the origin to the first position of the specified point (x1, y1). In other words, when the LED filament 100 is rotated 180 degrees around the origin in the top view, the designated point (x1, y1) of the first portion 100p1 of the LED filament 100 in the top view overlaps the third of the LED filament 100 in the top view. Partial 100p3 symmetry point (x3, y3). Further, the LED filament 100 is defined as a third position at a specified point (x2, y2) of the second portion 100p2 of the second quadrant, and the LED filament 100 is symmetrical at a specified point (x2, in a fourth portion 100p4 of the fourth quadrant). The symmetry point (x4, y4) of y2) is defined as the fourth position, and the fourth position of the symmetry point (x4, y4) is symmetrical with respect to the origin to the third position of the specified point (x2, y2). In other words, when the LED filament 100 is rotated 180 degrees around the origin in the top view, the designated point (x2, y2) of the second portion 100p2 of the LED filament 100 in the top view overlaps the LED filament 100 in the top view. Four parts of the 100p4 symmetry point (x4, y4).
此外，第一部分100p1的指定点(x1,y1)的出光方向ED与第三部分100p3的对称点(x3,y3)的出光方向ED在顶视图中相对于原点在方向上对称，且第二部分100p2的指定点(x2,y2)的出光方向ED与第四部分100p4的对称点(x4,y4)的出光方向ED在顶视图中相对于原点在方向上对称。Further, the light-emitting direction ED of the designated point (x1, y1) of the first portion 100p1 and the light-emitting direction ED of the symmetrical point (x3, y3) of the third portion 100p3 are symmetrical in the top view with respect to the origin, and the second portion The light exiting direction ED of the specified point (x2, y2) of 100p2 and the light exiting direction ED of the symmetrical point (x4, y4) of the fourth portion 100p4 are symmetrical in the top view with respect to the origin.
请参照图31A与图31B，图31A所示为根据本发明的一个实施例的LED球泡灯20h的示意图，图31B所示为图31A的LED球泡灯20h的侧视图。图31A与图31B所示的LED球泡灯20h类似于图27A所示的LED球泡灯20d。LED球泡灯20h与LED球泡灯20d的主要差异在于LED灯丝100，如图31A所示，LED球泡灯20h的LED灯丝100连接立杆19a的顶部，且延伸形成两个圆形。这两个由LED灯丝100形成的圆形为并排设置，且其形状类似代表无限的符号。如图31B所示，这两个由LED灯丝100形成的圆形在侧视图中呈现“V”形。LED灯丝100穿过立杆19a的顶部。31A and 31B, FIG. 31A is a schematic view of an LED bulb 20h according to an embodiment of the present invention, and FIG. 31B is a side view of the LED bulb 20h of FIG. 31A. The LED bulb 20h shown in Figs. 31A and 31B is similar to the LED bulb 20d shown in Fig. 27A. The main difference between the LED bulb lamp 20h and the LED bulb lamp 20d is the LED filament 100. As shown in Fig. 31A, the LED filament 100 of the LED bulb lamp 20h is connected to the top of the upright 19a and extends to form two circles. The two circles formed by the LED filaments 100 are arranged side by side, and their shapes are similar to represent infinite symbols. As shown in Fig. 31B, the two circles formed by the LED filaments 100 assume a "V" shape in a side view. The LED filament 100 passes through the top of the upright 19a.
如图31B所示，LED灯丝100呈现于定义有四个象限的二维坐标系中。在本实施例中，Y轴对齐立杆19a而X轴横越立杆19a。如图31B所示，侧视图中的LED灯丝100可被Y轴区分为第一部分100p1与第二部分100p2。LED灯丝100的第一部分100p1是在侧视图中呈现在第一象限的部分，LED灯丝100的第二部分100p2是在侧视图中呈现在第二象限的部分。LED灯丝100是线对称，且LED灯丝100是在侧视图中相对于Y轴对称，而第一部分100p1 与第二部分100p2是在侧视图中相对于Y轴在结构上对称。此外，第一部分100p1的出光方向ED与第二部分100p2的出光方向ED是在侧视图中相对于Y轴在方向上对称。As shown in Fig. 31B, the LED filament 100 is presented in a two-dimensional coordinate system defined with four quadrants. In the present embodiment, the Y axis is aligned with the upright 19a and the X axis is traversed by the upright 19a. As shown in FIG. 31B, the LED filament 100 in a side view can be divided into a first portion 100p1 and a second portion 100p2 by a Y-axis. The first portion 100p1 of the LED filament 100 is the portion that appears in the first quadrant in a side view, and the second portion 100p2 of the LED filament 100 is the portion that appears in the second quadrant in a side view. The LED filament 100 is line symmetrical, and the LED filament 100 is symmetrical with respect to the Y axis in a side view, while the first portion 100p1 and the second portion 100p2 are structurally symmetrical with respect to the Y axis in a side view. Further, the light-emitting direction ED of the first portion 100p1 and the light-emitting direction ED of the second portion 100p2 are symmetrical in the direction with respect to the Y-axis in a side view.
请参照图31C，图31C所示为图31A的LED球泡灯20h的顶视图。图31C的LED灯丝100呈现于定义有四个象限的二维坐标系中。四个象限的原点定义为顶视图中的LED球泡灯20h的立杆19a的中心(如图31A的立杆19a的顶端的中心)，在本实施例中，图31C的Y轴是垂直的，且图31C的X轴是水平的。如图31C所示，顶视图中的LED灯丝100可被X轴与Y轴区分为第一部分100p1、第二部分100p2、第三部分100p3与第四部分100p4。LED灯丝100的第一部分100p1是在顶视图中呈现在第一象限的部分，LED灯丝100的第二部分100p2是在顶视图中呈现在第二象限的部分，LED灯丝100的第三部分100p3是在顶视图中呈现在第三象限的部分，而LED灯丝100的第四部分100p4是在顶视图中呈现在第四象限的部分。Referring to FIG. 31C, FIG. 31C is a top view of the LED bulb 20h of FIG. 31A. The LED filament 100 of Figure 31C is presented in a two-dimensional coordinate system defined with four quadrants. The origin of the four quadrants is defined as the center of the upright 19a of the LED bulb 20h in the top view (as in the center of the top end of the upright 19a of Fig. 31A), in the present embodiment, the Y-axis of Fig. 31C is vertical. And the X axis of Fig. 31C is horizontal. As shown in FIG. 31C, the LED filament 100 in the top view can be divided into a first portion 100p1, a second portion 100p2, a third portion 100p3, and a fourth portion 100p4 by the X-axis and the Y-axis. The first portion 100p1 of the LED filament 100 is the portion that is presented in the first quadrant in a top view, the second portion 100p2 of the LED filament 100 is the portion that appears in the second quadrant in a top view, and the third portion 100p3 of the LED filament 100 is The portion in the third quadrant is presented in a top view, while the fourth portion 100p4 of the LED filament 100 is the portion that appears in the fourth quadrant in a top view.
如图31C所示，在本实施例中，顶视图中的LED灯丝100是点对称，具体来说，LED灯丝100是在顶视图中相对于四个象限的原点对称。换句话说，LED灯丝100在顶视图中的结构会同于LED灯丝100在顶视图中绕原点旋转180度后的结构。LED灯丝100的第一部分100p1与第三部分100p3是相对于原点对称，而LED灯丝100的第二部分100p2与第四部分100p4是相对于原点对称。此外，第一部分100p1的出光方向ED与第三部分100p3的出光方向ED在顶视图中相对于原点在方向上对称，且第二部分100p2的出光方向ED与第四部分100p4的出光方向ED在顶视图中相对于原点在方向上对称。As shown in Fig. 31C, in the present embodiment, the LED filament 100 in the top view is point symmetrical, specifically, the LED filament 100 is symmetrical with respect to the origin of the four quadrants in a top view. In other words, the structure of the LED filament 100 in the top view will be the same as the structure in which the LED filament 100 is rotated 180 degrees around the origin in the top view. The first portion 100p1 and the third portion 100p3 of the LED filament 100 are symmetrical with respect to the origin, and the second portion 100p2 and the fourth portion 100p4 of the LED filament 100 are symmetrical with respect to the origin. Further, the light-emitting direction ED of the first portion 100p1 and the light-emitting direction ED of the third portion 100p3 are symmetrical in the top view with respect to the origin, and the light-emitting direction ED of the second portion 100p2 and the light-emitting direction ED of the fourth portion 100p4 are at the top. The view is symmetrical in direction with respect to the origin.
请参照图32A与图32B，图32A所示为根据本发明的一个实施例的LED球泡灯20i的示意图，图32B所示为图32A的LED球泡灯20i的侧视图。图32A与图32B所示的LED球泡灯20i类似于图27A所示的LED球泡灯20d。LED球泡灯20i与LED球泡灯20d的主要差异在于LED灯丝100，如图32A所示，LED球泡灯20i的LED灯丝100连接立杆19a的顶部，且延伸形成两个圆形。这两个由LED灯丝100形成的圆形为并排设置，且其形状类似代表无限的符号。如图32B所示，这两个由LED灯丝100形成的圆形在侧视图中呈现倒“V”形。在本实施例中，LED灯丝100没有穿过立杆19a的顶部，且LED灯丝100是被悬臂支撑。Referring to Figures 32A and 32B, Figure 32A is a schematic diagram of an LED bulb 20i in accordance with one embodiment of the present invention, and Figure 32B is a side view of the LED bulb 20i of Figure 32A. The LED bulb 20i shown in Figs. 32A and 32B is similar to the LED bulb 20d shown in Fig. 27A. The main difference between the LED bulb 20i and the LED bulb 20d is the LED filament 100. As shown in Fig. 32A, the LED filament 100 of the LED bulb 20i is connected to the top of the upright 19a and extends to form two circles. The two circles formed by the LED filaments 100 are arranged side by side, and their shapes are similar to represent infinite symbols. As shown in Fig. 32B, the two circles formed by the LED filaments 100 exhibit an inverted "V" shape in a side view. In the present embodiment, the LED filament 100 does not pass through the top of the upright 19a, and the LED filament 100 is supported by the cantilever.
如图32B所示，LED灯丝100呈现于定义有四个象限的二维坐标系中。在本实施例中，Y轴对齐立杆19a而X轴横越立杆19a。如图32B所示，侧视图中的LED灯丝100可被Y轴区分为第一部分100p1与第二部分100p2。LED灯丝100的第一部分100p1是在侧视图中呈现在第一象限的部分，LED灯丝100的第二部分100p2是在侧视图中呈现在第二象限的部分。LED灯丝100是线对称，且LED灯丝100是在侧视图中相对于Y轴对称，而第一部分100p1与第二部分100p2是在侧视图中相对于Y轴在结构上对称。此外，第一部分100p1的出光方向ED与第二部分100p2的出光方向ED是在侧视图中相对于Y轴在方向上对称。As shown in Figure 32B, the LED filament 100 is presented in a two-dimensional coordinate system defined with four quadrants. In the present embodiment, the Y axis is aligned with the upright 19a and the X axis is traversed by the upright 19a. As shown in FIG. 32B, the LED filament 100 in the side view can be divided into a first portion 100p1 and a second portion 100p2 by the Y-axis. The first portion 100p1 of the LED filament 100 is the portion that appears in the first quadrant in a side view, and the second portion 100p2 of the LED filament 100 is the portion that appears in the second quadrant in a side view. The LED filament 100 is line symmetrical, and the LED filament 100 is symmetrical with respect to the Y axis in a side view, while the first portion 100p1 and the second portion 100p2 are structurally symmetrical with respect to the Y axis in a side view. Further, the light-emitting direction ED of the first portion 100p1 and the light-emitting direction ED of the second portion 100p2 are symmetrical in the direction with respect to the Y-axis in a side view.
请参照图32C，图32C所示为图32A的LED球泡灯20i的顶视图。图32C的LED灯丝100呈现于定义有四个象限的二维坐标系中。四个象限的原点定义为顶视图中的LED球泡灯20i的立杆19a的中心(如图32A的立杆19a的顶端的中心)，在本实施例中，图32C的 Y轴是垂直的，且图32C的X轴是水平的。如图32C所示，顶视图中的LED灯丝100可被X轴与Y轴区分为第一部分100p1、第二部分100p2、第三部分100p3与第四部分100p4。LED灯丝100的第一部分100p1是在顶视图中呈现在第一象限的部分，LED灯丝100的第二部分100p2是在顶视图中呈现在第二象限的部分，LED灯丝100的第三部分100p3是在顶视图中呈现在第三象限的部分，而LED灯丝100的第四部分100p4是在顶视图中呈现在第四象限的部分。Referring to Figure 32C, Figure 32C is a top plan view of the LED bulb 20i of Figure 32A. The LED filament 100 of Figure 32C is presented in a two-dimensional coordinate system defined with four quadrants. The origin of the four quadrants is defined as the center of the upright 19a of the LED bulb 20i in the top view (as in the center of the top end of the upright 19a of Fig. 32A). In the present embodiment, the Y-axis of Fig. 32C is vertical. And the X axis of Fig. 32C is horizontal. As shown in FIG. 32C, the LED filament 100 in the top view can be divided into a first portion 100p1, a second portion 100p2, a third portion 100p3, and a fourth portion 100p4 by the X-axis and the Y-axis. The first portion 100p1 of the LED filament 100 is the portion that is presented in the first quadrant in a top view, the second portion 100p2 of the LED filament 100 is the portion that appears in the second quadrant in a top view, and the third portion 100p3 of the LED filament 100 is The portion in the third quadrant is presented in a top view, while the fourth portion 100p4 of the LED filament 100 is the portion that appears in the fourth quadrant in a top view.
如图32C所示，在本实施例中，顶视图中的LED灯丝100是点对称，具体来说，LED灯丝100是在顶视图中相对于四个象限的原点对称。换句话说，LED灯丝100在顶视图中的结构会同于LED灯丝100在顶视图中绕原点旋转180度后的结构。LED灯丝100的第一部分100p1与第三部分100p3是相对于原点对称，而LED灯丝100的第二部分100p2与第四部分100p4是相对于原点对称。此外，第一部分100p1的出光方向ED与第三部分100p3的出光方向ED在顶视图中相对于原点在方向上对称，且第二部分100p2的出光方向ED与第四部分100p4的出光方向ED在顶视图中相对于原点在方向上对称。As shown in Fig. 32C, in the present embodiment, the LED filament 100 in the top view is point symmetrical, and specifically, the LED filament 100 is symmetrical with respect to the origin of the four quadrants in the top view. In other words, the structure of the LED filament 100 in the top view will be the same as the structure in which the LED filament 100 is rotated 180 degrees around the origin in the top view. The first portion 100p1 and the third portion 100p3 of the LED filament 100 are symmetrical with respect to the origin, and the second portion 100p2 and the fourth portion 100p4 of the LED filament 100 are symmetrical with respect to the origin. Further, the light-emitting direction ED of the first portion 100p1 and the light-emitting direction ED of the third portion 100p3 are symmetrical in the top view with respect to the origin, and the light-emitting direction ED of the second portion 100p2 and the light-emitting direction ED of the fourth portion 100p4 are at the top. The view is symmetrical in direction with respect to the origin.
请参照图33A与图33B，图33A所示为根据本发明的一个实施例的LED球泡灯20j的示意图，图33B所示为图33A的LED球泡灯20j的侧视图。图33A与图33B所示的LED球泡灯20j类似于图27A所示的LED球泡灯20d。LED球泡灯20j与LED球泡灯20d的主要差异在于LED灯丝100，如图33A所示，LED球泡灯20j的LED灯丝100连接立杆19a的顶部，且延伸形成两个螺旋线。这两个由LED灯丝100形成的螺旋线为并排设置，且当由特定角度观察时，如图33A所示，其形状类似“S”形。如图33B所示，这两个螺旋线的其中一个是向上延伸，而这两个螺旋线的其中另一个是向下延伸。LED灯丝100穿过立杆19a的顶部。Referring to Figures 33A and 33B, Figure 33A is a schematic diagram of an LED bulb 20j in accordance with one embodiment of the present invention, and Figure 33B is a side view of the LED bulb 20j of Figure 33A. The LED bulb 20j shown in Figs. 33A and 33B is similar to the LED bulb 20d shown in Fig. 27A. The main difference between the LED bulb 20j and the LED bulb 20d is the LED filament 100. As shown in Fig. 33A, the LED filament 100 of the LED bulb 20j is connected to the top of the pole 19a and extends to form two spirals. The two spirals formed by the LED filaments 100 are arranged side by side, and when viewed from a specific angle, as shown in Fig. 33A, the shape is similar to the "S" shape. As shown in Fig. 33B, one of the two spirals extends upward, and the other of the two spirals extends downward. The LED filament 100 passes through the top of the upright 19a.
如图33B所示，LED灯丝100呈现于定义有四个象限的二维坐标系中。在本实施例中，Y轴对齐立杆19a而X轴横越立杆19a。如图33B所示，侧视图中的LED灯丝100可被X轴与Y轴区分为第一部分100p1、第二部分100p2、第三部分100p3与第四部分100p4。LED灯丝100的第一部分100p1是在侧视图中呈现在第一象限的部分，LED灯丝100的第二部分100p2是在侧视图中呈现在第二象限的部分，LED灯丝100的第三部分100p3是在侧视图中呈现在第三象限的部分，而LED灯丝100的第四部分100p4是在侧视图中呈现在第四象限的部分。在本实施例中，LED灯丝100在侧视图中是点对称的，且LED灯丝100是在侧视图中相对于原点对称。第一部分100p1与第三部分100p3是在侧视图中相对于原点在结构上对称，而第二部分100p2与第四部分100p4是在侧视图中相对于原点在结构上对称。换句话说，如图33B所示，LED灯丝100在侧视图中的结构会同于LED灯丝100在侧视图中绕原点旋转180度后的结构。As shown in Figure 33B, the LED filament 100 is presented in a two-dimensional coordinate system defined with four quadrants. In the present embodiment, the Y axis is aligned with the upright 19a and the X axis is traversed by the upright 19a. As shown in FIG. 33B, the LED filament 100 in the side view can be divided into a first portion 100p1, a second portion 100p2, a third portion 100p3, and a fourth portion 100p4 by the X-axis and the Y-axis. The first portion 100p1 of the LED filament 100 is the portion that appears in the first quadrant in a side view, the second portion 100p2 of the LED filament 100 is the portion that appears in the second quadrant in a side view, and the third portion 100p3 of the LED filament 100 is The portion of the third quadrant is presented in a side view, while the fourth portion 100p4 of the LED filament 100 is the portion that appears in the fourth quadrant in a side view. In the present embodiment, the LED filament 100 is point symmetrical in a side view, and the LED filament 100 is symmetrical with respect to the origin in a side view. The first portion 100p1 and the third portion 100p3 are structurally symmetrical with respect to the origin in a side view, and the second portion 100p2 and the fourth portion 100p4 are structurally symmetrical with respect to the origin in a side view. In other words, as shown in Fig. 33B, the structure of the LED filament 100 in a side view is the same as the structure in which the LED filament 100 is rotated 180 degrees around the origin in a side view.
例如，如图33B所示，LED灯丝100在第二象限的第二部分100p2的一个指定点(x1,y1)定义为第一位置，LED灯丝100在第四象限的第四部分100p4的一个对称于指定点(x1,y1)的对称点(x2,y2)定义为第二位置，对称点(x2,y2)的第二位置相对于原点对称于指定点(x1,y1)的第一位置。换句话说，当LED灯丝100在侧视图中绕原点旋转180度后， LED灯丝100在侧视图中的第二部分100p2的指定点(x1,y1)会重叠LED灯丝100在侧视图中的第四部分100p4的对称点(x2,y2)。此外，第二部分100p2的指定点(x1,y1)的出光方向ED与第四部分100p4的对称点(x2,y2)的出光方向ED是在侧视图中相对于原点在方向上对称。For example, as shown in FIG. 33B, the LED filament 100 is defined as a first position at a specified point (x1, y1) of the second portion 100p2 of the second quadrant, and a symmetry of the LED filament 100 in the fourth portion 100p4 of the fourth quadrant The symmetry point (x2, y2) at the specified point (x1, y1) is defined as the second position, and the second position of the symmetry point (x2, y2) is symmetrical with respect to the origin to the first position of the specified point (x1, y1). In other words, when the LED filament 100 is rotated 180 degrees around the origin in a side view, the designated point (x1, y1) of the second portion 100p2 of the LED filament 100 in the side view overlaps the LED filament 100 in the side view. Four parts of the 100p4 symmetry point (x2, y2). Further, the light-emitting direction ED of the designated point (x1, y1) of the second portion 100p2 and the light-emitting direction ED of the symmetrical point (x2, y2) of the fourth portion 100p4 are symmetrical in the direction with respect to the origin in the side view.
请参照图33C，图33C所示为图33A的LED球泡灯20j的顶视图。图33C的LED灯丝100呈现于定义有四个象限的二维坐标系中。四个象限的原点定义为顶视图中的LED球泡灯20j的立杆19a的中心(如图33A的立杆19a的顶端的中心)，在本实施例中，图33C的Y轴是垂直的，且图33C的X轴是水平的。如图33C所示，顶视图中的LED灯丝100可被X轴与Y轴区分为第一部分100p1、第二部分100p2、第三部分100p3与第四部分100p4。LED灯丝100的第一部分100p1是在顶视图中呈现在第一象限的部分，LED灯丝100的第二部分100p2是在顶视图中呈现在第二象限的部分，LED灯丝100的第三部分100p3是在顶视图中呈现在第三象限的部分，而LED灯丝100的第四部分100p4是在顶视图中呈现在第四象限的部分。Referring to FIG. 33C, FIG. 33C is a top view of the LED bulb 20j of FIG. 33A. The LED filament 100 of Figure 33C is presented in a two-dimensional coordinate system defined with four quadrants. The origin of the four quadrants is defined as the center of the upright 19a of the LED bulb 20j in the top view (as in the center of the top end of the upright 19a of Fig. 33A). In the present embodiment, the Y-axis of Fig. 33C is vertical. And the X axis of Fig. 33C is horizontal. As shown in FIG. 33C, the LED filament 100 in the top view can be divided into a first portion 100p1, a second portion 100p2, a third portion 100p3, and a fourth portion 100p4 by the X-axis and the Y-axis. The first portion 100p1 of the LED filament 100 is the portion that is presented in the first quadrant in a top view, the second portion 100p2 of the LED filament 100 is the portion that appears in the second quadrant in a top view, and the third portion 100p3 of the LED filament 100 is The portion in the third quadrant is presented in a top view, while the fourth portion 100p4 of the LED filament 100 is the portion that appears in the fourth quadrant in a top view.
如图33C所示，在本实施例中，顶视图中的LED灯丝100是点对称，具体来说，LED灯丝100是在顶视图中相对于四个象限的原点对称。换句话说，LED灯丝100在顶视图中的结构会同于LED灯丝100在顶视图中绕原点旋转180度后的结构。LED灯丝100的第一部分100p1与第三部分100p3是相对于原点对称，而LED灯丝100的第二部分100p2与第四部分100p4是相对于原点对称。此外，第一部分100p1的出光方向ED与第三部分100p3的出光方向ED在顶视图中相对于原点在方向上对称，且第二部分100p2的出光方向ED与第四部分100p4的出光方向ED在顶视图中相对于原点在方向上对称。As shown in Fig. 33C, in the present embodiment, the LED filament 100 in the top view is point symmetrical, specifically, the LED filament 100 is symmetrical with respect to the origin of the four quadrants in a top view. In other words, the structure of the LED filament 100 in the top view will be the same as the structure in which the LED filament 100 is rotated 180 degrees around the origin in the top view. The first portion 100p1 and the third portion 100p3 of the LED filament 100 are symmetrical with respect to the origin, and the second portion 100p2 and the fourth portion 100p4 of the LED filament 100 are symmetrical with respect to the origin. Further, the light-emitting direction ED of the first portion 100p1 and the light-emitting direction ED of the third portion 100p3 are symmetrical in the top view with respect to the origin, and the light-emitting direction ED of the second portion 100p2 and the light-emitting direction ED of the fourth portion 100p4 are at the top. The view is symmetrical in direction with respect to the origin.
请参照图34A与图34B，图34A所示为根据本发明的一个实施例的LED球泡灯20k的示意图，图34B所示为图34A的LED球泡灯20k的侧视图。图34A与图34B所示的LED球泡灯20k类似于图27A所示的LED球泡灯20d。LED球泡灯20k与LED球泡灯20d的主要差异在于LED灯丝100，如图34A所示，LED球泡灯20k的LED灯丝100连接立杆19a的顶部，且延伸形成四个彼此垂直的半圆形。LED灯丝100穿过立杆19a的底部，且越过立杆19a的顶部上方。34A and 34B, FIG. 34A is a schematic view of an LED bulb 20k according to an embodiment of the present invention, and FIG. 34B is a side view of the LED bulb 20k of FIG. 34A. The LED bulb 20k shown in Figs. 34A and 34B is similar to the LED bulb 20d shown in Fig. 27A. The main difference between the LED bulb lamp 20k and the LED bulb lamp 20d is the LED filament 100. As shown in Fig. 34A, the LED filament 100 of the LED bulb lamp 20k is connected to the top of the upright 19a and extends to form four vertical halves. Round. The LED filament 100 passes through the bottom of the upright 19a and over the top of the upright 19a.
如图34B所示，LED灯丝100呈现于定义有四个象限的二维坐标系中。在本实施例中，Y轴对齐立杆19a而X轴横越立杆19a。如图34B所示，侧视图中的LED灯丝100可被X轴与Y轴区分为第一部分100p1、第二部分100p2、第三部分100p3与第四部分100p4。LED灯丝100的第一部分100p1是在侧视图中呈现在第一象限的部分，LED灯丝100的第二部分100p2是在侧视图中呈现在第二象限的部分，LED灯丝100的第三部分100p3是在侧视图中呈现在第三象限的部分，而LED灯丝100的第四部分100p4是在侧视图中呈现在第四象限的部分。在本实施例中，LED灯丝100在侧视图中是点对称的，且LED灯丝100是在侧视图中相对于原点对称。第一部分100p1与第三部分100p3是在侧视图中相对于原点在结构上对称，而第二部分100p2与第四部分100p4是在侧视图中相对于原点在结构上对称。换句话说，如 图11B所示，LED灯丝100在侧视图中的结构会同于LED灯丝100在侧视图中绕原点旋转180度后的结构。此外，第一部分100p1的出光方向ED与第三部分100p3的出光方向ED在侧视图中相对于原点在方向上对称，且第二部分100p2的出光方向ED与第四部分100p4的出光方向ED在侧视图中相对于原点在方向上对称。As shown in Figure 34B, the LED filament 100 is presented in a two-dimensional coordinate system defined with four quadrants. In the present embodiment, the Y axis is aligned with the upright 19a and the X axis is traversed by the upright 19a. As shown in FIG. 34B, the LED filament 100 in the side view can be divided into a first portion 100p1, a second portion 100p2, a third portion 100p3, and a fourth portion 100p4 by the X-axis and the Y-axis. The first portion 100p1 of the LED filament 100 is the portion that appears in the first quadrant in a side view, the second portion 100p2 of the LED filament 100 is the portion that appears in the second quadrant in a side view, and the third portion 100p3 of the LED filament 100 is The portion of the third quadrant is presented in a side view, while the fourth portion 100p4 of the LED filament 100 is the portion that appears in the fourth quadrant in a side view. In the present embodiment, the LED filament 100 is point symmetrical in a side view, and the LED filament 100 is symmetrical with respect to the origin in a side view. The first portion 100p1 and the third portion 100p3 are structurally symmetrical with respect to the origin in a side view, and the second portion 100p2 and the fourth portion 100p4 are structurally symmetrical with respect to the origin in a side view. In other words, as shown in Fig. 11B, the structure of the LED filament 100 in a side view is the same as the structure in which the LED filament 100 is rotated 180 degrees around the origin in a side view. Further, the light-emitting direction ED of the first portion 100p1 and the light-emitting direction ED of the third portion 100p3 are symmetrical in the side view with respect to the origin in the side view, and the light-emitting direction ED of the second portion 100p2 and the light-emitting direction ED of the fourth portion 100p4 are on the side. The view is symmetrical in direction with respect to the origin.
请参照图34C，图34C所示为图34A的LED球泡灯20k的顶视图。图34C的LED灯丝100呈现于定义有四个象限的二维坐标系中。四个象限的原点定义为顶视图中的LED球泡灯20k的立杆19a的中心(如图34A的立杆19a的顶端的中心)，在本实施例中，图34C的Y轴是倾斜的，且图34C的X轴也是倾斜的。如图34C所示，顶视图中的LED灯丝100可被X轴与Y轴区分为第一部分100p1、第二部分100p2、第三部分100p3与第四部分100p4。LED灯丝100的第一部分100p1是在顶视图中呈现在第一象限的部分，LED灯丝100的第二部分100p2是在顶视图中呈现在第二象限的部分，LED灯丝100的第三部分100p3是在顶视图中呈现在第三象限的部分，而LED灯丝100的第四部分100p4是在顶视图中呈现在第四象限的部分。Referring to Figure 34C, Figure 34C is a top plan view of the LED bulb 20k of Figure 34A. The LED filament 100 of Figure 34C is presented in a two-dimensional coordinate system defined with four quadrants. The origin of the four quadrants is defined as the center of the upright 19a of the LED bulb 20k in the top view (as in the center of the top end of the upright 19a of Fig. 34A). In the present embodiment, the Y-axis of Fig. 34C is inclined. And the X axis of Fig. 34C is also inclined. As shown in FIG. 34C, the LED filament 100 in the top view can be divided into a first portion 100p1, a second portion 100p2, a third portion 100p3, and a fourth portion 100p4 by the X-axis and the Y-axis. The first portion 100p1 of the LED filament 100 is the portion that is presented in the first quadrant in a top view, the second portion 100p2 of the LED filament 100 is the portion that appears in the second quadrant in a top view, and the third portion 100p3 of the LED filament 100 is The portion in the third quadrant is presented in a top view, while the fourth portion 100p4 of the LED filament 100 is the portion that appears in the fourth quadrant in a top view.
如图34C所示，在本实施例中，顶视图中的LED灯丝100是线对称的，具体来说，LED灯丝100是在顶视图中相对于Y轴对称。LED灯丝100的第一部分100p1与第二部分100p2是相对于Y轴对称，且LED灯丝100的第三部分100p3与第四部分100p4是相对于Y轴对称。第一部分100p1、第二部分100p2、第三部分100p3与第四部分100p4的每一个在顶视图中形成叶片状，且第一部分100p1、第二部分100p2、第三部分100p3与第四部分100p4在顶视图中共同形成四叶草的形状。此外，第一部分100p1的出光方向ED与第二部分100p2的出光方向ED在顶视图中相对于Y轴在方向上对称，且第三部分100p3的出光方向ED与第四部分100p4的出光方向ED在顶视图中相对于Y轴在方向上对称。As shown in Fig. 34C, in the present embodiment, the LED filament 100 in the top view is line symmetrical, and specifically, the LED filament 100 is symmetrical with respect to the Y axis in a top view. The first portion 100p1 and the second portion 100p2 of the LED filament 100 are symmetrical with respect to the Y-axis, and the third portion 100p3 and the fourth portion 100p4 of the LED filament 100 are symmetrical with respect to the Y-axis. Each of the first portion 100p1, the second portion 100p2, the third portion 100p3, and the fourth portion 100p4 is formed in a blade shape in a top view, and the first portion 100p1, the second portion 100p2, the third portion 100p3, and the fourth portion 100p4 are at the top The shape of the four-leaf clover is formed together in the view. Further, the light-emitting direction ED of the first portion 100p1 and the light-emitting direction ED of the second portion 100p2 are symmetrical in the top view with respect to the Y-axis, and the light-emitting direction ED of the third portion 100p3 and the light-emitting direction ED of the fourth portion 100p4 are The top view is symmetrical in direction with respect to the Y axis.
请参照图35A至图35C，图35A至图35C所示分别为根据本发明的一个实施例的LED球泡灯30a的示意图、侧视图与顶视图。LED球泡灯30a包括LED灯丝100且类似于前述实施例的LED球泡灯。LED球泡灯30a与前述LED球泡灯的差异在于，LED球泡灯30a的LED灯丝100有着更改过的结构。当LED灯丝100运作时，LED灯丝100呈现在侧视图或顶视图中的不同象限的部分，可以是在亮度上为线对称或点对称的。如图35B所示，LED灯丝100呈现在侧视图中的第一象限与第二象限的部分，可以是相对于Y轴在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为线对称的。如图35C所示，LED灯丝100呈现在顶视图中的四个象限的部分，可以是相对于原点与相对于Y轴与X轴在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为点对称与线对称的。Referring to Figures 35A-35C, Figures 35A-35C are schematic, side and top views, respectively, of an LED bulb 30a in accordance with one embodiment of the present invention. The LED bulb 30a includes an LED filament 100 and is similar to the LED bulb of the previous embodiment. The difference between the LED bulb 30a and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30a has a modified structure. When the LED filament 100 is in operation, the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness. As shown in FIG. 35B, the LED filament 100 is presented in a first quadrant and a second quadrant in a side view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip with respect to the Y-axis. It is line-symmetric in the power arrangement of LED chips with different powers, in refractive index or in surface roughness. As shown in FIG. 35C, the LED filament 100 is presented in four quadrant portions in a top view, which may be in relation to the origin and relative to the Y-axis and the X-axis in terms of structure, length, and direction of light, in the LED chip. The configuration is point-symmetric and line-symmetric in the power arrangement of the LED chips with different powers, in the refractive index or in the surface roughness.
请参照图36A至图36C，图36A至图36C所示分别为根据本发明的一个实施例的LED球泡灯30b的示意图、侧视图与顶视图。LED球泡灯30b包括LED灯丝100且类似于前述实施例的LED球泡灯。LED球泡灯30b与前述LED球泡灯的差异在于，LED球泡灯30b的LED 灯丝100有着更改过的结构。当LED灯丝100运作时，LED灯丝100呈现在侧视图或顶视图中的不同象限的部分，可以是在亮度上为线对称或点对称的。如图36B所示，LED灯丝100呈现在侧视图中的第一象限与第二象限的部分，可以是相对于Y轴在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为线对称的。如图36C所示，LED灯丝100呈现在顶视图中的四个象限的部分，可以是相对于原点与相对于Y轴与X轴在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为点对称与线对称的。Referring to Figures 36A-36C, Figures 36A-36C are schematic, side and top views, respectively, of an LED bulb 30b in accordance with one embodiment of the present invention. The LED bulb 30b includes an LED filament 100 and is similar to the LED bulb of the previous embodiment. The difference between the LED bulb 30b and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30b has a modified structure. When the LED filament 100 is in operation, the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness. As shown in FIG. 36B, the LED filament 100 is presented in a first quadrant and a second quadrant in a side view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip with respect to the Y axis. It is line-symmetric in the power arrangement of LED chips with different powers, in refractive index or in surface roughness. As shown in FIG. 36C, the LED filament 100 is presented in four quadrant portions in a top view, which may be relative to the origin and relative to the Y-axis and the X-axis in terms of structure, length, and direction of light, in the LED chip. The configuration is point-symmetric and line-symmetric in the power arrangement of the LED chips with different powers, in the refractive index or in the surface roughness.
请参照图37A至图37C，图37A至图37C所示分别为根据本发明的一个实施例的LED球泡灯30c的示意图、侧视图与顶视图。LED球泡灯30c包括LED灯丝100且类似于前述实施例的LED球泡灯。LED球泡灯30c与前述LED球泡灯的差异在于，LED球泡灯30c的LED灯丝100有着更改过的结构。当LED灯丝100运作时，LED灯丝100呈现在侧视图或顶视图中的不同象限的部分，可以是在亮度上为线对称或点对称的。如图37B所示，LED灯丝100呈现在侧视图中的第一象限与第二象限的部分以及呈现在侧视图中的第三象限与第四象限的部分，可以是相对于Y轴在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为线对称的。如图37C所示，LED灯丝100呈现在顶视图中的四个象限的部分，可以是相对于原点与相对于Y轴与X轴在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为点对称与线对称的。37A to 37C, which are schematic, side and top views, respectively, of an LED bulb 30c according to an embodiment of the present invention. The LED bulb 30c includes an LED filament 100 and is similar to the LED bulb of the previous embodiment. The difference between the LED bulb 30c and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30c has a modified structure. When the LED filament 100 is in operation, the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness. As shown in FIG. 37B, the LED filament 100 presents portions of the first quadrant and the second quadrant in a side view and portions of the third quadrant and the fourth quadrant presented in a side view, which may be structurally relative to the Y-axis. It is line symmetrical in length, in the light exit direction, on the configuration of the LED chip, on the power arrangement of the LED chips having different powers, on the refractive index or on the surface roughness. As shown in FIG. 37C, the LED filament 100 is presented in four quadrant portions in a top view, which may be in relation to the origin and relative to the Y-axis and the X-axis in terms of structure, length, and direction of light, in the LED chip. The configuration is point-symmetric and line-symmetric in the power arrangement of the LED chips with different powers, in the refractive index or in the surface roughness.
请参照图38A至图38C，图15至图38C所示分别为根据本发明的一个实施例的LED球泡灯30d的示意图、侧视图与顶视图。LED球泡灯30d包括LED灯丝100且类似于前述实施例的LED球泡灯。LED球泡灯30d与前述LED球泡灯的差异在于，LED球泡灯30d的LED灯丝100有着更改过的结构。当LED灯丝100运作时，LED灯丝100呈现在侧视图或顶视图中的不同象限的部分，可以是在亮度上为线对称或点对称的。如图38B所示，LED灯丝100呈现在侧视图中的第一象限与第二象限的部分以及呈现在侧视图中的第三象限与第四象限的部分，可以是相对于Y轴在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为线对称的。如图38C所示，LED灯丝100呈现在顶视图中的四个象限的部分，可以是相对于原点与相对于Y轴与X轴在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为点对称与线对称的。Referring to Figures 38A-38C, Figures 15 through 38C are schematic, side and top views, respectively, of an LED bulb 30d in accordance with one embodiment of the present invention. The LED bulb 30d includes an LED filament 100 and is similar to the LED bulb of the previous embodiment. The difference between the LED bulb 30d and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30d has a modified structure. When the LED filament 100 is in operation, the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness. As shown in FIG. 38B, the LED filament 100 presents portions of the first quadrant and the second quadrant in a side view and portions of the third quadrant and the fourth quadrant presented in a side view, which may be structurally relative to the Y-axis. It is line symmetrical in length, in the light exit direction, on the configuration of the LED chip, on the power arrangement of the LED chips having different powers, on the refractive index or on the surface roughness. As shown in FIG. 38C, the LED filament 100 is presented in four quadrant portions in a top view, which may be relative to the origin and relative to the Y-axis and the X-axis, structurally, in length, in the light-emitting direction, in the LED chip. The configuration is point-symmetric and line-symmetric in the power arrangement of the LED chips with different powers, in the refractive index or in the surface roughness.
请参照图39A至图39C，图39A至图39C所示分别为根据本发明的一个实施例的LED球泡灯30e的示意图、侧视图与顶视图。LED球泡灯30e包括LED灯丝100且类似于前述实施例的LED球泡灯。LED球泡灯30e与前述LED球泡灯的差异在于，LED球泡灯30e的LED灯丝100有着更改过的结构。当LED灯丝100运作时，LED灯丝100呈现在侧视图或顶视图中的不同象限的部分，可以是在亮度上为线对称或点对称的。如图28B所示，LED灯丝100 呈现在侧视图中的第一象限与第二象限的部分，可以是相对于Y轴在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为线对称的。如图28C所示，LED灯丝100呈现在顶视图中的四个象限的部分，可以是相对于原点与相对于Y轴与X轴在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为点对称与线对称的。Referring to Figures 39A-39C, Figures 39A-39C are schematic, side and top views, respectively, of an LED bulb 30e in accordance with one embodiment of the present invention. The LED bulb 30e includes an LED filament 100 and is similar to the LED bulb of the previous embodiment. The difference between the LED bulb 30e and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30e has a modified structure. When the LED filament 100 is in operation, the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness. As shown in FIG. 28B, the LED filament 100 is presented in a first quadrant and a second quadrant in a side view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip with respect to the Y-axis. It is line-symmetric in the power arrangement of LED chips with different powers, in refractive index or in surface roughness. As shown in FIG. 28C, the LED filament 100 is presented in four quadrant portions in a top view, which may be in relation to the origin and relative to the Y-axis and the X-axis in terms of structure, length, and direction of light, in the LED chip. The configuration is point-symmetric and line-symmetric in the power arrangement of the LED chips with different powers, in the refractive index or in the surface roughness.
请参照图40A至图40C，图40A至图40C所示分别为根据本发明的一个实施例的LED球泡灯30f的示意图、侧视图与顶视图。LED球泡灯30f包括LED灯丝100且类似于前述实施例的LED球泡灯。LED球泡灯30f与前述LED球泡灯的差异在于，LED球泡灯30f的LED灯丝100有着更改过的结构。当LED灯丝100运作时，LED灯丝100呈现在侧视图或顶视图中的不同象限的部分，可以是在亮度上为线对称或点对称的。如图40B所示，LED灯丝100呈现在侧视图中的第一象限与第二象限的部分，可以是相对于Y轴在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为线对称的。如图40C所示，LED灯丝100呈现在顶视图中的四个象限的部分，可以是相对于原点与相对于Y轴与X轴在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为点对称与线对称的。40A to 40C, which are schematic, side and top views, respectively, of an LED bulb 30f according to an embodiment of the present invention. The LED bulb 30f includes an LED filament 100 and is similar to the LED bulb of the previous embodiment. The difference between the LED bulb 30f and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30f has a modified structure. When the LED filament 100 is in operation, the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness. As shown in FIG. 40B, the LED filament 100 is presented in a first quadrant and a second quadrant in a side view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip with respect to the Y-axis. It is line-symmetric in the power arrangement of LED chips with different powers, in refractive index or in surface roughness. As shown in FIG. 40C, the LED filament 100 is presented in four quadrant portions in a top view, which may be in relation to the origin and relative to the Y-axis and the X-axis in terms of structure, length, and direction of light, in the LED chip. The configuration is point-symmetric and line-symmetric in the power arrangement of the LED chips with different powers, in the refractive index or in the surface roughness.
请参照图41A至图41C，图41A至图41C所示分别为根据本发明的一个实施例的LED球泡灯30g的示意图、侧视图与顶视图。LED球泡灯30g包括LED灯丝100且类似于前述实施例的LED球泡灯。LED球泡灯30g与前述LED球泡灯的差异在于，LED球泡灯30g的LED灯丝100有着更改过的结构。当LED灯丝100运作时，LED灯丝100呈现在侧视图或顶视图中的不同象限的部分，可以是在亮度上为线对称或点对称的。如图41B所示，LED灯丝100呈现在侧视图中的第一象限与第二象限的部分，可以是相对于Y轴在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为线对称的。如图41C所示，LED灯丝100呈现在顶视图中的四个象限的部分，可以是相对于原点在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为点对称的。41A to 41C, which are schematic, side and top views, respectively, of an LED bulb 30g according to an embodiment of the present invention. The LED bulb 30g includes an LED filament 100 and is similar to the LED bulb of the previous embodiment. The difference between the LED bulb 30g and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30g has a modified structure. When the LED filament 100 is in operation, the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness. As shown in FIG. 41B, the LED filament 100 is presented in a first quadrant and a second quadrant in a side view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip with respect to the Y-axis. It is line-symmetric in the power arrangement of LED chips with different powers, in refractive index or in surface roughness. As shown in FIG. 41C, the LED filament 100 is presented in four quadrant portions in a top view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip, with different powers relative to the origin. The power level of the LED chip is point-symmetric in terms of refractive index or surface roughness.
请参照图42A至图42C，图42A至图42C所示分别为根据本发明的一个实施例的LED球泡灯30h的示意图、侧视图与顶视图。LED球泡灯30h包括LED灯丝100且类似于前述实施例的LED球泡灯。LED球泡灯30h与前述LED球泡灯的差异在于，LED球泡灯30h的LED灯丝100有着更改过的结构。当LED灯丝100运作时，LED灯丝100呈现在侧视图或顶视图中的不同象限的部分，可以是在亮度上为线对称或点对称的。如图42B所示，LED灯丝100呈现在侧视图中的四个象限的部分，可以是相对于原点在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为点对称的。如图42C所示，LED灯丝100呈现在顶视图中的四个象限的部分，可以是 相对于原点在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为点对称的。42A to 42C, which are schematic, side and top views, respectively, of an LED bulb 30h according to an embodiment of the present invention. The LED bulb 30h includes an LED filament 100 and is similar to the LED bulb of the previous embodiment. The difference between the LED bulb 30h and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30h has a modified structure. When the LED filament 100 is in operation, the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness. As shown in FIG. 42B, the LED filament 100 is presented in four quadrant portions in a side view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip, with different powers relative to the origin. The power level of the LED chip is point-symmetric in terms of refractive index or surface roughness. As shown in FIG. 42C, the LED filament 100 is presented in four quadrant portions in a top view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip, with different powers relative to the origin. The power level of the LED chip is point-symmetric in terms of refractive index or surface roughness.
请参照图43A至图43C，图43A至图43C所示分别为根据本发明的一个实施例的LED球泡灯30i的示意图、侧视图与顶视图。LED球泡灯30i包括LED灯丝100且类似于前述实施例的LED球泡灯。LED球泡灯30i与前述LED球泡灯的差异在于，LED球泡灯30i的LED灯丝100有着更改过的结构。当LED灯丝100运作时，LED灯丝100呈现在侧视图或顶视图中的不同象限的部分，可以是在亮度上为线对称或点对称的。如图43B所示，LED灯丝100呈现在侧视图中的四个象限的部分，可以是相对于原点在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为点对称的。如图43C所示，LED灯丝100呈现在顶视图中的四个象限的部分，可以是相对于原点在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为点对称的。Referring to Figures 43A-43C, Figures 43A-43C are schematic, side and top views, respectively, of an LED bulb 30i, in accordance with one embodiment of the present invention. The LED bulb 30i includes an LED filament 100 and is similar to the LED bulb of the previous embodiment. The difference between the LED bulb 30i and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30i has a modified structure. When the LED filament 100 is in operation, the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness. As shown in FIG. 43B, the LED filament 100 is presented in four quadrant portions in a side view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip, with different powers relative to the origin. The power level of the LED chip is point-symmetric in terms of refractive index or surface roughness. As shown in FIG. 43C, the LED filament 100 is presented in four quadrant portions in a top view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip, with different powers relative to the origin. The power level of the LED chip is point-symmetric in terms of refractive index or surface roughness.
请参照图44A至图44C，图44A至图44C所示分别为根据本发明的一个实施例的LED球泡灯30j的示意图、侧视图与顶视图。LED球泡灯30j包括LED灯丝100且类似于前述实施例的LED球泡灯。LED球泡灯30j与前述LED球泡灯的差异在于，LED球泡灯30j的LED灯丝100有着更改过的结构。当LED灯丝100运作时，LED灯丝100呈现在侧视图或顶视图中的不同象限的部分，可以是在亮度上为线对称或点对称的。如图44B所示，LED灯丝100呈现在侧视图中的第一象限与第二象限的部分，可以是相对于Y轴在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为线对称的。如图44C所示，LED灯丝100呈现在顶视图中的四个象限的部分，可以是相对于原点在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为点对称的。Referring to Figures 44A-44C, Figures 44A-44C are schematic, side and top views, respectively, of an LED bulb 30j in accordance with one embodiment of the present invention. The LED bulb 30j includes an LED filament 100 and is similar to the LED bulb of the previous embodiment. The difference between the LED bulb 30j and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30j has a modified structure. When the LED filament 100 is in operation, the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness. As shown in FIG. 44B, the LED filament 100 is presented in a first quadrant and a second quadrant in a side view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip with respect to the Y-axis. It is line-symmetric in the power arrangement of LED chips with different powers, in refractive index or in surface roughness. As shown in FIG. 44C, the LED filament 100 is presented in four quadrant portions in a top view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip, with different powers relative to the origin. The power level of the LED chip is point-symmetric in terms of refractive index or surface roughness.
请参照图45A至图45C，图45A至图45C所示分别为根据本发明的一个实施例的LED球泡灯30k的示意图、侧视图与顶视图。LED球泡灯30k包括LED灯丝100且类似于前述实施例的LED球泡灯。LED球泡灯30k与前述LED球泡灯的差异在于，LED球泡灯30k的LED灯丝100有着更改过的结构。当LED灯丝100运作时，LED灯丝100呈现在侧视图或顶视图中的不同象限的部分，可以是在亮度上为线对称或点对称的。如图45B所示，LED灯丝100呈现在侧视图中的第一象限与第二象限的部分，可以是相对于Y轴在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为线对称的。如图45C所示，LED灯丝100呈现在顶视图中的四个象限的部分，可以是相对于原点在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为点对称的。Referring to FIGS. 45A to 45C, FIGS. 45A to 45C are respectively a schematic, side and top views of an LED bulb 30k according to an embodiment of the present invention. The LED bulb 30k includes an LED filament 100 and is similar to the LED bulb of the previous embodiment. The difference between the LED bulb 30k and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30k has a modified structure. When the LED filament 100 is in operation, the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness. As shown in FIG. 45B, the LED filament 100 is presented in a first quadrant and a second quadrant in a side view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip with respect to the Y-axis. It is line-symmetric in the power arrangement of LED chips with different powers, in refractive index or in surface roughness. As shown in FIG. 45C, the LED filament 100 is presented in four quadrant portions in a top view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip, with different powers relative to the origin. The power level of the LED chip is point-symmetric in terms of refractive index or surface roughness.
请参照图46A至图46C，图46A至图46C所示分别为根据本发明的一个实施例的LED球泡灯30l的示意图、侧视图与顶视图。LED球泡灯30l包括LED灯丝100且类似于前述实施例的LED球泡灯。LED球泡灯30l与前述LED球泡灯的差异在于，LED球泡灯30l的LED 灯丝100有着更改过的结构。当LED灯丝100运作时，LED灯丝100呈现在侧视图或顶视图中的不同象限的部分，可以是在亮度上为线对称或点对称的。如图46B所示，LED灯丝100呈现在侧视图中的第一象限与第二象限的部分，可以是相对于Y轴在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为大致上线对称的。如图46C所示，LED灯丝100呈现在顶视图中的四个象限的部分，可以是相对于原点在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为点对称的。Referring to FIGS. 46A to 46C, FIG. 46A to FIG. 46C are respectively a schematic, side and top views of an LED bulb 30l according to an embodiment of the present invention. The LED bulb 30l includes an LED filament 100 and is similar to the LED bulb of the previous embodiment. The difference between the LED bulb lamp 30l and the aforementioned LED bulb lamp is that the LED filament 100 of the LED bulb lamp 30l has a modified structure. When the LED filament 100 is in operation, the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness. As shown in FIG. 46B, the LED filament 100 is presented in a first quadrant and a second quadrant in a side view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip with respect to the Y-axis. It is substantially line-symmetric in the power arrangement of LED chips with different powers, in refractive index or in surface roughness. As shown in FIG. 46C, the LED filament 100 is presented in four quadrant portions in a top view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip, with different powers relative to the origin. The power level of the LED chip is point-symmetric in terms of refractive index or surface roughness.
请参照图47A与图47B，图47A与图47B所示分别为根据本发明的一个实施例的LED球泡灯30m的示意图与顶视图。LED球泡灯30m包括LED灯丝100且类似于前述实施例的LED球泡灯。LED球泡灯30m与前述LED球泡灯的差异在于，LED球泡灯30m的LED灯丝100有着更改过的结构。当LED灯丝100运作时，LED灯丝100呈现在顶视图中的不同象限的部分，可以是在亮度上为线对称的。如图47B所示，LED灯丝100呈现在顶视图中的第一象限与第二象限的部分，可以是相对于Y轴在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为大致上线对称的。Referring to FIG. 47A and FIG. 47B, FIG. 47A and FIG. 47B are respectively a schematic view and a top view of an LED bulb 30m according to an embodiment of the present invention. The LED bulb 30m includes an LED filament 100 and is similar to the LED bulb of the previous embodiment. The difference between the LED bulb 30m and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30m has a modified structure. When the LED filament 100 is in operation, the LED filament 100 presents portions of different quadrants in a top view that may be line symmetrical in brightness. As shown in FIG. 47B, the LED filament 100 is presented in a first quadrant and a second quadrant in a top view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip with respect to the Y axis. It is substantially line-symmetric in the power arrangement of LED chips with different powers, in refractive index or in surface roughness.
请参照图48A至图48C，图48A至图48C所示分别为根据本发明的一个实施例的LED球泡灯30n的示意图、侧视图与顶视图。LED球泡灯30n包括LED灯丝100且类似于前述实施例的LED球泡灯。LED球泡灯30n与前述LED球泡灯的差异在于，LED球泡灯30n的LED灯丝100有着更改过的结构。当LED灯丝100运作时，LED灯丝100呈现在侧视图或顶视图中的不同象限的部分，可以是在亮度上为线对称或点对称的。如图48B所示，LED灯丝100呈现在侧视图中的第一象限与第二象限的部分，可以是相对于Y轴在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为大致上线对称的。如图48C所示，LED灯丝100呈现在顶视图中的四个象限的部分，可以是相对于原点在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为点对称的。Referring to FIGS. 48A to 48C, FIGS. 48A to 48C are respectively a schematic, side and top views of an LED bulb 30n according to an embodiment of the present invention. The LED bulb 30n includes an LED filament 100 and is similar to the LED bulb of the previous embodiment. The difference between the LED bulb 30n and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30n has a modified structure. When the LED filament 100 is in operation, the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness. As shown in FIG. 48B, the LED filament 100 is presented in a first quadrant and a second quadrant in a side view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip with respect to the Y-axis. It is substantially line-symmetric in the power arrangement of LED chips with different powers, in refractive index or in surface roughness. As shown in FIG. 48C, the LED filament 100 is presented in four quadrant portions in a top view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip, with different powers relative to the origin. The power level of the LED chip is point-symmetric in terms of refractive index or surface roughness.
请参照图49A至图49C，图49A至图49C所示分别为根据本发明的一个实施例的LED球泡灯30o的示意图、侧视图与顶视图。LED球泡灯30o包括LED灯丝100且类似于前述实施例的LED球泡灯。LED球泡灯30o与前述LED球泡灯的差异在于，LED球泡灯30o的LED灯丝100有着更改过的结构。当LED灯丝100运作时，LED灯丝100呈现在侧视图或顶视图中的不同象限的部分，可以是在亮度上为线对称或点对称的。如图49B所示，LED灯丝100呈现在侧视图中的第一象限与第二象限的部分，可以是相对于Y轴在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为线对称的。如图49C所示，LED灯丝100呈现在顶视图中的四个象限的部分，可以是相对于原点在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为点对称的。Referring to Figures 49A through 49C, there are shown schematic, side and top views, respectively, of an LED bulb 30o in accordance with one embodiment of the present invention. The LED bulb 30o includes an LED filament 100 and is similar to the LED bulb of the previous embodiment. The difference between the LED bulb 30o and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30o has a modified structure. When the LED filament 100 is in operation, the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness. As shown in FIG. 49B, the LED filament 100 is presented in a first quadrant and a second quadrant in a side view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip with respect to the Y-axis. It is line-symmetric in the power arrangement of LED chips with different powers, in refractive index or in surface roughness. As shown in FIG. 49C, the LED filament 100 is presented in four quadrant portions in a top view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip, with different powers relative to the origin. The power level of the LED chip is point-symmetric in terms of refractive index or surface roughness.
请参照图50A至图50C，图50A至图50C所示分别为根据本发明的一个实施例的LED球泡灯30p的示意图、侧视图与顶视图。LED球泡灯30p包括LED灯丝100且类似于前述实施例的LED球泡灯。LED球泡灯30p与前述LED球泡灯的差异在于，LED球泡灯30p的LED灯丝100有着更改过的结构。当LED灯丝100运作时，LED灯丝100呈现在侧视图或顶视图中的不同象限的部分，可以是在亮度上为线对称或点对称的。如图50B所示，LED灯丝100呈现在侧视图中的第一象限与第二象限的部分，可以是相对于Y轴在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为线对称的。如图50C所示，LED灯丝100呈现在顶视图中的四个象限的部分，可以是相对于原点在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为点对称的。Referring to FIG. 50A to FIG. 50C, FIG. 50A to FIG. 50C are respectively a schematic, side and top views of an LED bulb 30p according to an embodiment of the present invention. The LED bulb 30p includes an LED filament 100 and is similar to the LED bulb of the previous embodiment. The difference between the LED bulb 30p and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30p has a modified structure. When the LED filament 100 is in operation, the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness. As shown in FIG. 50B, the LED filament 100 is presented in a first quadrant and a second quadrant in a side view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip with respect to the Y axis. It is line-symmetric in the power arrangement of LED chips with different powers, in refractive index or in surface roughness. As shown in FIG. 50C, the LED filament 100 is presented in four quadrant portions in a top view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip, with different powers relative to the origin. The power level of the LED chip is point-symmetric in terms of refractive index or surface roughness.
请参照图51A至图51C，图51A至图51C所示分别为根据本发明的一个实施例的LED球泡灯30q的示意图、侧视图与顶视图。LED球泡灯30q包括LED灯丝100且类似于前述实施例的LED球泡灯。LED球泡灯30q与前述LED球泡灯的差异在于，LED球泡灯30q的LED灯丝100有着更改过的结构。当LED灯丝100运作时，LED灯丝100呈现在侧视图或顶视图中的不同象限的部分，可以是在亮度上为线对称或点对称的。如图51B所示，LED灯丝100呈现在侧视图中的第一象限与第二象限的部分，可以是相对于Y轴在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为线对称的。如图51C所示，LED灯丝100呈现在顶视图中的四个象限的部分，可以是相对于原点在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为点对称的。Referring to FIGS. 51A to 51C, FIG. 51A to FIG. 51C are respectively a schematic, side and top views of an LED bulb 30q according to an embodiment of the present invention. The LED bulb 30q includes an LED filament 100 and is similar to the LED bulb of the previous embodiment. The difference between the LED bulb 30q and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30q has a modified structure. When the LED filament 100 is in operation, the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness. As shown in FIG. 51B, the LED filament 100 is presented in a first quadrant and a second quadrant in a side view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip with respect to the Y-axis. It is line-symmetric in the power arrangement of LED chips with different powers, in refractive index or in surface roughness. As shown in FIG. 51C, the LED filament 100 is presented in four quadrant portions in a top view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip, with different powers relative to the origin. The power level of the LED chip is point-symmetric in terms of refractive index or surface roughness.
请参照图52A至图52D，图52A至图52D所示分别为根据本发明的一个实施例的LED球泡灯30r的示意图、侧视图(如前视图)、另一个侧视图(如右侧视图或左侧视图)与顶视图。在本实施例中，图52B为前视图，而图52C为右侧视图。右侧视图所投影的平面是垂直于前视图与顶视图所分别投影的平面。LED球泡灯30r包括LED灯丝100且类似于前述实施例的LED球泡灯。LED球泡灯30r与前述LED球泡灯的差异在于，LED球泡灯30r的LED灯丝100有着更改过的结构。当LED灯丝100运作时，LED灯丝100呈现在侧视图或顶视图中的不同象限的部分，可以是在亮度上为线对称或点对称的。52A to 52D, which are respectively a schematic view, a side view (such as a front view), and another side view (such as a right side view) of an LED bulb 30r according to an embodiment of the present invention. Or left side view) with top view. In the present embodiment, FIG. 52B is a front view, and FIG. 52C is a right side view. The plane projected by the right view is a plane perpendicular to the front view and the top view, respectively. The LED bulb 30r includes an LED filament 100 and is similar to the LED bulb of the previous embodiment. The difference between the LED bulb 30r and the aforementioned LED bulb is that the LED filament 100 of the LED bulb 30r has a modified structure. When the LED filament 100 is in operation, the LED filament 100 presents portions of different quadrants in a side view or top view, which may be line symmetrical or point symmetrical in brightness.
如图52B所示，LED灯丝100呈现在侧视图中的第一象限与第二象限的部分，可以是相对于Y轴在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为线对称的。如图52C所示，LED灯丝100呈现在另一个侧视图中的第一象限与第二象限的部分，可以是相对于Y轴在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为线对称的。如图52D所示，LED灯丝100呈现在顶视图中的四个象限的部分，可以是相对于原点在结构上、在长度上、在出光方向上、在LED芯片的配置上、在具有不同功率的LED芯片的功率布置上、在折射率上或在表面粗糙度上为点对称的。As shown in FIG. 52B, the LED filament 100 is presented in a first quadrant and a second quadrant in a side view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip with respect to the Y-axis. It is line-symmetric in the power arrangement of LED chips with different powers, in refractive index or in surface roughness. As shown in FIG. 52C, the LED filament 100 is presented in a first quadrant and a second quadrant in another side view, which may be structurally, in length, in the light exiting direction relative to the Y axis, in the LED chip. The configuration is line symmetrical on the power arrangement of the LED chips with different powers, on the refractive index or on the surface roughness. As shown in FIG. 52D, the LED filament 100 is presented in four quadrant portions in a top view, which may be structurally, in length, in the light exiting direction, on the configuration of the LED chip, with different powers relative to the origin. The power level of the LED chip is point-symmetric in terms of refractive index or surface roughness.
所述全周光的定义，视LED球泡灯所使用的地区而定，且会随着时间而变动。根据不同的机构与国家，宣称可提供全周光的LED球泡灯可能需要满足不同标准。美国能源之星计划的灯具(球泡灯)资格准则第一版(EligibilityCriteriaVersion1.0)第24页，定义了在全周光灯具基座向上的设置下，其要求了在135度至180度之间所发出的光至少应是总光通量(totalflux)(lm)的5％，而90％的亮度测量值为可变化的，但其与在全部平面上的总亮度测量值的平均值的差异不会超过25％。亮度(luminousintensity(cd))是在每一个垂直平面上，以垂直角度5度的增幅(最大值)，在0度至135度之间加以测量。而日本的JEL801规范对LED灯要求在光轴的120度范围的区间内，其光通量不应小于球泡灯的总光通量的70％。基于前述实施例的具有对称特性的LED灯丝的设置，带有所述LED灯丝的LED球泡灯可符合全周光灯具的不同标准。The definition of the full perimeter light depends on the region in which the LED bulb is used and will vary over time. Depending on the organization and country, LED bulbs that claim to provide full-circumference light may need to meet different standards. The first edition of the ENERGY STAR Program's luminaire (Ball Light) eligibility guidelines (EligibilityCriteriaVersion 1.0), page 24, defines the 135 to 180 degree requirement for the full-light fixture base up. The light emitted should be at least 5% of the total luminous flux (lm), and 90% of the luminance measurements can be varied, but the difference from the average of the total luminance measurements on all planes is not Will exceed 25%. Luminance (cd) is measured in increments (maximum) at a vertical angle of 5 degrees on each vertical plane, between 0 and 135 degrees. The Japanese JEL801 specification requires that the LED lamp be within the range of 120 degrees of the optical axis, and its luminous flux should not be less than 70% of the total luminous flux of the bulb. Based on the arrangement of the LED filaments having symmetrical characteristics according to the previous embodiments, the LED bulbs with the LED filaments can conform to different standards of full-circumferential luminaires.
请参考图53A与图53B至图53D，图53A所示为根据本发明的一个实施例的LED球泡灯40a的示意图，图53B至图53D所示分别为图53A的LED球泡灯40a的侧视图、另一侧视图与顶视图。在本实施例中，LED球泡灯40a包括灯壳12、连接灯壳12的灯头16、芯柱19及单一条LED灯丝100。并且，LED球泡灯40a以及LED球泡灯40a中所设置的单一条LED灯丝100可参考先前的多个实施例的LED球泡灯、LED灯丝与其相关描述，其中相同或相似的组件与组件之间的连接关系不再详细叙述。Referring to FIG. 53A and FIG. 53B to FIG. 53D, FIG. 53A is a schematic diagram of an LED bulb 40a according to an embodiment of the present invention, and FIGS. 53B to 53D are respectively the LED bulb 40a of FIG. 53A. Side view, another side view with top view. In the present embodiment, the LED bulb 40a includes a lamp housing 12, a lamp cap 16 that connects the lamp housing 12, a stem 19, and a single LED filament 100. Moreover, the LED strip lamp 40a and the single strip LED filament 100 disposed in the LED bulb 40a can refer to the LED bulbs, LED filaments and related descriptions of the previous embodiments, wherein the same or similar components and components The connection relationship between them is not described in detail.
在本实施例中，芯柱19连接灯头16且位于灯壳12内，芯柱19具有一垂直延伸至灯壳12中心的立杆19a，立杆19a位于灯头16的中心轴线上，或者立竿19a位于LED球泡灯40a的中心轴线上。LED灯丝100环绕着立杆19a设置且位于灯壳12内，且LED灯丝100可透过悬臂(悬臂的详细说明可参照先前的实施例与附图)连接立杆19a以维持预设的曲线与形状。LED灯丝100包括位于两端的两电极110、112、多个LED段102、104与多个导体段130。如图53A至图53D所示，在附图中为了区隔导体段130与LED段102、104，LED灯丝100在导体段130的部分是以多个点分布于其中，其仅是为了让阅读者更容易理解，而非用于任何限制，并且，之后的实施例与相关附图也是类似地藉由导体段130呈现点分布来与LED段102、104区隔。如先前的多个实施例所述，每一个LED段102、104可包括有多个彼此连接的LED芯片，而每一个导体段130则可包括有导体。各导体段130位于相邻的两LED段102、104之间，各导体段130中的导体连接相邻的两LED段102、104中的LED芯片，而相邻于两电级110、112的两LED段中的LED芯片则分别连接两电级110、112。芯柱19可透过导电支架(导电支架的详细说明可参照先前的实施例与附图)连接两电级110、112。In the present embodiment, the stem 19 is coupled to the cap 16 and located within the bulb housing 12. The stem 19 has a post 19a extending perpendicularly to the center of the bulb 12, the stem 19a being located on the central axis of the cap 16, or standing 19a is located on the central axis of the LED bulb 40a. The LED filament 100 is disposed around the upright 19a and located in the lamp housing 12, and the LED filament 100 can be connected to the upright 19a through a cantilever (refer to the previous embodiment and the drawings for detailed description of the cantilever) to maintain a preset curve and shape. The LED filament 100 includes two electrodes 110, 112 at both ends, a plurality of LED segments 102, 104, and a plurality of conductor segments 130. As shown in FIGS. 53A to 53D, in the drawing, in order to distinguish the conductor segments 130 from the LED segments 102, 104, the LED filament 100 is distributed in a portion of the conductor segment 130 in a plurality of points, which is only for reading. It is easier to understand, and not to use any limitation, and the subsequent embodiments are similarly related to the related figures by the point distribution of the conductor segments 130 to distinguish from the LED segments 102, 104. As described in various previous embodiments, each of the LED segments 102, 104 can include a plurality of LED chips connected to each other, and each conductor segment 130 can include a conductor. Each conductor segment 130 is located between adjacent two LED segments 102, 104. The conductors in each conductor segment 130 connect the LED chips in the adjacent two LED segments 102, 104 and are adjacent to the two electrical stages 110, 112. The LED chips in the two LED segments are respectively connected to the two electrical stages 110, 112. The stem 19 is permeable to the electrically conductive support (the detailed description of the electrically conductive support can be coupled to the two electrical stages 110, 112 with reference to the previous embodiment and the drawings).
如图53A至图53D所示，在本实施例中，LED灯丝100的导体段有三个，其中第一导体段130有两个，第二导体段130'有一个，而LED段102、104有四个，且每两相邻的LED段102、104之间是透过第一导体段130、第二导体段130'弯折。并且，由于第一导体段130、第二导体段130'具有相较于LED段102、104更高的可弯折性，因此相邻的两LED段102、104之间的第一导体段130、第二导体段130'可较大程度的被加以弯折，使相邻的两LED段102、104之间的夹角可以相对较小，例如夹角可达45度或更小。在本实施例中，每一LED 段102、104相较于第一导体段130、第二导体段130'只有些微弯曲或没有弯曲，因而LED球泡灯40a中的单一条LED灯丝100可藉由第一导体段130、第二导体段130'而大幅度的弯折，并产生较显着的弯曲变化，且LED灯丝100可定义为在每一个弯折的第一导体段130、第二导体段130'之后是接续一个分段，则各个LED段102、104是形成各个对应的分段。As shown in FIG. 53A to FIG. 53D, in the embodiment, the LED filament 100 has three conductor segments, wherein the first conductor segment 130 has two, the second conductor segment 130' has one, and the LED segments 102, 104 have Four, and between each two adjacent LED segments 102, 104 are bent through the first conductor segment 130 and the second conductor segment 130'. Moreover, since the first conductor segment 130 and the second conductor segment 130' have a higher bendability than the LED segments 102, 104, the first conductor segment 130 between the adjacent two LED segments 102, 104 The second conductor segment 130' can be bent to a greater extent such that the angle between adjacent two LED segments 102, 104 can be relatively small, such as an angle of up to 45 degrees or less. In this embodiment, each of the LED segments 102, 104 is slightly curved or not bent compared to the first conductor segment 130 and the second conductor segment 130', so that a single LED filament 100 in the LED bulb 40a can be borrowed. The first conductor segment 130 and the second conductor segment 130' are greatly bent and produce a significant bending change, and the LED filament 100 can be defined as a first conductor segment 130 and a second at each bend. The conductor segments 130' are followed by a segment, and the respective LED segments 102, 104 form respective segments.
如图53B与图53C所示，在本实施例中，每一第一导体段130、第二导体段130'与相邻的两LED段102、104会共同形成U形或是V形的弯折结构，每一个第一导体段130、第二导体段130'与相邻的两LED段102、104所形成的U形或V形的弯折结构是被弯折分为两个分段，所述两个LED段102、104即分别为所述两个分段。在本实施例中，LED灯丝100藉由第一导体段130、第二导体段130'而被弯折为四个分段，所述四个LED段102、104即分别为所述四个分段。并且，在本实施例中，LED段102、104的数量比导体段的数量多1。As shown in FIG. 53B and FIG. 53C, in this embodiment, each of the first conductor segments 130 and the second conductor segments 130' and the adjacent two LED segments 102, 104 together form a U-shaped or V-shaped bend. The folded structure, the U-shaped or V-shaped bent structure formed by each of the first conductor segments 130, the second conductor segments 130' and the adjacent two LED segments 102, 104 is bent into two segments. The two LED segments 102, 104 are respectively the two segments. In this embodiment, the LED filament 100 is bent into four segments by the first conductor segment 130 and the second conductor segment 130', and the four LED segments 102, 104 are respectively the four segments. segment. Also, in the present embodiment, the number of LED segments 102, 104 is one more than the number of conductor segments.
如图53B所示，在本实施例中，电极110、112在Z方向上位于LED灯丝100的最高点与最低点之间。所述最高点位于在Z方向上的最高处的第一导体段130，而所述最低点位于在Z方向上的最低处的第二导体段130'。较低的第二导体段130'代表其相对于电极110、112靠近灯头16，而较高的第一导体段130代表其相对于电极110、112远离灯头16。以YZ平面来看(参照图53B)，电极110、112之间可连成一条直线LA，在直线LA上方的较高的第一导体段130有两个，而在直线LA下方的较低的第二导体段130'有一个。换句话说，在Z方向上，位在电极110、112所连成的直线LA上方的第一导体段130的数量会比位在直线LA下方的第二导体段130'的数量多1。也可以说，以整体来看，相对于电极110、112远离灯头16的第一导体段130的数量比相对于电极110、112靠近灯头16的第二导体段130'的数量多1。此外，若LED灯丝100投影在YZ平面上(参照图53B)，电极110、112所连成的直线LA与LED段102、104的投影至少存在一个交点。在本实施例中，在YZ平面上，电极110、112所连成的直线LA分别与两个LED段104的投影相交，因此直线LA与相邻的两个LED段104的投影共存在两个交点。As shown in FIG. 53B, in the present embodiment, the electrodes 110, 112 are located between the highest point and the lowest point of the LED filament 100 in the Z direction. The highest point is at the highest conductor segment 130 in the Z direction and the lowest point is at the lowest conductor segment 130' in the Z direction. The lower second conductor segment 130' represents its proximity to the lamp cap 16 relative to the electrodes 110, 112, while the higher first conductor segment 130 represents its distance from the lamp cap 16 relative to the electrodes 110, 112. Viewed in the YZ plane (see Fig. 53B), the electrodes 110, 112 can be connected in a straight line LA, with two higher first conductor segments 130 above the straight line LA and lower ones below the straight line LA. There is one second conductor segment 130'. In other words, in the Z direction, the number of first conductor segments 130 positioned above the line LA to which the electrodes 110, 112 are connected may be one more than the number of the second conductor segments 130' positioned below the line LA. It can also be said that, as a whole, the number of first conductor segments 130 that are remote from the base 16 relative to the electrodes 110, 112 is one more than the number of second conductor segments 130' that are adjacent the bases 16 with respect to the electrodes 110, 112. Further, if the LED filament 100 is projected on the YZ plane (see FIG. 53B), the line LA connected by the electrodes 110, 112 has at least one intersection with the projection of the LED segments 102, 104. In the present embodiment, on the YZ plane, the straight lines LA connected by the electrodes 110, 112 respectively intersect the projections of the two LED segments 104, so that the projection of the straight line LA and the adjacent two LED segments 104 coexist. Intersection.
如图53C所示，在本实施例中，若LED灯丝100投影在XZ平面上(参照图53C)，相对的两个LED段102、104的投影是彼此重叠的。在一些实施例中，相对的两个LED段102、104在特定平面上的投影可以是彼此平行的。As shown in Fig. 53C, in the present embodiment, if the LED filament 100 is projected on the XZ plane (refer to Fig. 53C), the projections of the opposite LED segments 102, 104 are overlapped with each other. In some embodiments, the projections of the opposing two LED segments 102, 104 on a particular plane may be parallel to each other.
如图53D所示，在本实施例中，若LED灯丝100投影在XY平面上(参照图53D)，电极110、112在XY平面上的投影可连成一条直线LB，而第一导体段130、第二导体段130'在XY平面上的投影都不会相交或重叠于直线LB，并且第一导体段130、第二导体段130'在XY平面上的投影都位于直线LB的其中一侧。举例来说，以图53D来看，第一导体段130、第二导体段130'在XY平面上的投影都位于直线LB的上方。As shown in FIG. 53D, in the present embodiment, if the LED filament 100 is projected on the XY plane (refer to FIG. 53D), the projections of the electrodes 110, 112 on the XY plane can be connected in a straight line LB, and the first conductor segment 130 The projections of the second conductor segments 130' on the XY plane do not intersect or overlap the straight line LB, and the projections of the first conductor segments 130 and the second conductor segments 130' on the XY plane are located on one side of the straight line LB. . For example, as seen in FIG. 53D, the projections of the first conductor segment 130 and the second conductor segment 130' on the XY plane are all located above the straight line LB.
如图53B至图53D所示，在本实施例中，LED灯丝100在三个彼此垂直的投影面上的投影长度会有设计好的比例，以使光照更加均匀。举例来说，LED灯丝100在第一投影面(如XY平面)上的投影具有长度L1，LED灯丝100在第二投影面(如YZ平面)上的投影具有长度L2，且LED灯丝100在第三投影面(如XZ平面)上的投影具有长度L3。其中第一 投影面、第二投影面与第三投影面互相垂直，且第一投影面的法线平行于LED球泡灯40a的由灯壳12的中心至灯头16的中心的轴线。进一步来说，LED灯丝100在XY平面上的投影可参照图53D所示，其投影会呈现类似倒U形，而在XY平面上的LED灯丝100的投影的总长度为长度L1；LED灯丝100在YZ平面上的投影可参照图53B所示，其投影会呈现类似倒W形，而在YZ平面上的LED灯丝100的投影的总长度为长度L2；LED灯丝100在XZ平面上的投影可参照图53C所示，其投影会呈现类似倒V形，在XZ平面上的LED灯丝100的投影的总长度为长度L3。在本实施例中，长度L1：长度L2：长度L3约等于1：1：0.9。在一些实施例中，长度L1：长度L2：长度L3约等于1：0.5至1：0.6至0.9。举例来说，若长度L1、长度L2与长度L3的比例愈接近1：1：1，则LED球泡灯40a中的单一条LED灯丝100的光照效果愈均匀，且所呈现的全周光效果愈好。As shown in Fig. 53B to Fig. 53D, in the present embodiment, the projection length of the LED filament 100 on three projection surfaces perpendicular to each other has a designed ratio to make the illumination more uniform. For example, the projection of the LED filament 100 on the first projection surface (such as the XY plane) has a length L1, the projection of the LED filament 100 on the second projection surface (such as the YZ plane) has a length L2, and the LED filament 100 is in the The projection on the three projection planes (such as the XZ plane) has a length L3. The first projection surface, the second projection surface and the third projection surface are perpendicular to each other, and the normal of the first projection surface is parallel to the axis of the LED bulb 40a from the center of the lamp housing 12 to the center of the lamp cap 16. Further, the projection of the LED filament 100 on the XY plane can be as shown in FIG. 53D, and the projection thereof will be similar to an inverted U shape, and the total length of the projection of the LED filament 100 on the XY plane is the length L1; the LED filament 100 The projection on the YZ plane can be as shown in FIG. 53B, the projection thereof will be similar to the inverted W shape, and the total length of the projection of the LED filament 100 on the YZ plane is the length L2; the projection of the LED filament 100 on the XZ plane can be Referring to Fig. 53C, the projection thereof will be similar to an inverted V shape, and the total length of the projection of the LED filament 100 on the XZ plane is the length L3. In the present embodiment, the length L1: the length L2: the length L3 is approximately equal to 1:1:0.9. In some embodiments, length L1: length L2: length L3 is approximately equal to 1:0.5 to 1:0.6 to 0.9. For example, if the ratio of the length L1, the length L2, and the length L3 is closer to 1:1:1, the uniform illumination effect of the single LED filament 100 in the LED bulb 40a is uniform and the full-circumference effect is presented. The better.
在一些实施例中，LED灯丝100在XZ平面或在YZ平面的投影长度例如但不限于是趋近于第一导体段130、第二导体段130'在Z方向上的高度差的最小值乘以LED段102、104的数量值或者是趋近于LED灯丝在Z方向上的最高点与最低点的高度差的最小值乘以LED段102、104的数量值。在本实施例中，LED灯丝100的总长度约为第一导体段130或第二导体段130'的总长度的7至9倍。In some embodiments, the projected length of the LED filament 100 in the XZ plane or in the YZ plane is, for example but not limited to, the minimum of the height difference in the Z direction that approximates the first conductor segment 130 and the second conductor segment 130'. The value of the number of LED segments 102, 104 or the minimum value of the height difference between the highest point and the lowest point of the LED filament in the Z direction is multiplied by the number of LED segments 102, 104. In the present embodiment, the total length of the LED filament 100 is about 7 to 9 times the total length of the first conductor segment 130 or the second conductor segment 130'.
在本实施例中，LED灯丝100可藉由第一导体段130、第二导体段130'而弯折形成各种曲线，不但能增添LED球泡灯40a整体在外观上的美感，还能使LED球泡灯40a的出光更加均匀，达到更好光照效果。In this embodiment, the LED filament 100 can be bent by the first conductor segment 130 and the second conductor segment 130' to form various curves, which not only can increase the overall aesthetic appearance of the LED bulb 40a, but also enable The LED bulb 40a emits light more evenly for better illumination.
请参考图54A与图54B至图54D，图54A所示为根据本发明的一个实施例的LED球泡灯40b的示意图，图54B至图54D所示分别为图54A的LED球泡灯40b的侧视图、另一侧视图与顶视图。在本实施例中，LED球泡灯40b包括灯壳12、连接灯壳12的灯头16、芯柱19、立竿19a及单一条LED灯丝100。LED灯丝100包括位于两端的两电极110、112、多个LED段102、104与多个第一导体段130、第二导体段130'。并且，LED球泡灯40b以及LED球泡灯40b中所设置的单根LED灯丝100可参考前述多个实施例的LED球泡灯、LED灯丝与其相关描述，其中相同或相似的组件与组件之间的连接关系不再详细叙述。Please refer to FIG. 54A and FIG. 54B to FIG. 54D. FIG. 54A is a schematic diagram of an LED bulb 40b according to an embodiment of the present invention, and FIGS. 54B to 54D are respectively the LED bulb 40b of FIG. 54A. Side view, another side view with top view. In the present embodiment, the LED bulb 40b includes a lamp housing 12, a base 16 that connects the lamp housing 12, a stem 19, a stand 19a, and a single LED filament 100. The LED filament 100 includes two electrodes 110, 112 at both ends, a plurality of LED segments 102, 104 and a plurality of first conductor segments 130, and a second conductor segment 130'. Moreover, the LED bulb 40b and the single LED filament 100 disposed in the LED bulb 40b can refer to the LED bulb, LED filament and related descriptions of the foregoing various embodiments, wherein the same or similar components and components The connection relationship between them is not described in detail.
如图54A至图54D所示，在本实施例中，LED灯丝100的第一导体段130有三个，第二导体段130'有两个，而LED段102、104有六个，且每两相邻的LED段102、104之间是透过第一导体段130、第二导体段130'弯折。LED球泡灯40b中的单一条LED灯丝100可藉由第一导体段130、第二导体段130'而大幅度的弯折，并产生较显着的弯曲变化，且LED灯丝100可定义为在每一个弯折的第一导体段130、第二导体段130'之后是接续一个分段，则各个LED段102、104是形成各个对应的分段。在本实施例中，LED灯丝100藉由三个第一导体段130、两个第二导体段130'而被弯折为六个分段，所述六个LED段102、104即分别为所述六个分段。As shown in FIGS. 54A to 54D, in the present embodiment, the LED filament 100 has three first conductor segments 130, two second conductor segments 130', and six LED segments 102, 104, and two. The adjacent LED segments 102, 104 are bent through the first conductor segment 130 and the second conductor segment 130'. The single LED filament 100 in the LED bulb 40b can be greatly bent by the first conductor segment 130 and the second conductor segment 130', and produces a more significant bending change, and the LED filament 100 can be defined as After each of the bent first conductor segment 130 and the second conductor segment 130' is followed by a segment, each LED segment 102, 104 is formed into a respective segment. In this embodiment, the LED filament 100 is bent into six segments by three first conductor segments 130 and two second conductor segments 130', and the six LED segments 102, 104 are respectively Six segments are described.
如图54A与图54B所示，在本实施例中，其中三个较高的第一导体段130在Z方向上的高度会大于另外两个较低的第二导体段130'在Z方向上的高度，而四个LED段102、 104在Z方向上则位于较高的第一导体段130与较低的第二导体段130'之间，另外两个LED段102、104则在Z方向上由对应的第一导体段130向下延伸，且电极110、112在Z方向上的高度是小于第一导体段130在Z方向上的高度。如图54C所示，在本实施例中，若LED灯丝100投影在XZ平面上(参照图54C)，相对的两个LED段102、104的投影是彼此重叠的。如图54D所示，在本实施例中，若LED灯丝100投影在XY平面上(参照图54D)，所有第二导体段130'在XY平面上的投影都位于电极110、112所连成的直线的其中一侧，而第一导体段130在XY平面上的投影分散于电极110、112所连成的直线的两侧。As shown in FIG. 54A and FIG. 54B, in the present embodiment, the height of the three higher first conductor segments 130 in the Z direction is greater than the other two lower second conductor segments 130' in the Z direction. The height of the four LED segments 102, 104 is between the higher first conductor segment 130 and the lower second conductor segment 130' in the Z direction, and the other two LED segments 102, 104 are in the Z direction. The upper portion extends downward from the corresponding first conductor segment 130, and the height of the electrodes 110, 112 in the Z direction is less than the height of the first conductor segment 130 in the Z direction. As shown in Fig. 54C, in the present embodiment, if the LED filament 100 is projected on the XZ plane (refer to Fig. 54C), the projections of the opposite LED segments 102, 104 are overlapped with each other. As shown in FIG. 54D, in the present embodiment, if the LED filament 100 is projected on the XY plane (refer to FIG. 54D), the projections of all the second conductor segments 130' on the XY plane are located at the electrodes 110, 112. One side of the straight line, and the projection of the first conductor segment 130 on the XY plane is dispersed on both sides of the line formed by the electrodes 110, 112.
请参考图55A与图55B至图55D，图55A所示为根据本发明的一个实施例的LED球泡灯40c的示意图，图55B至图55D所示分别为图55A的LED球泡灯40c的侧视图、另一侧视图与顶视图。在本实施例中，LED球泡灯40c包括灯壳12、连接灯壳12的灯头16、芯柱19、立竿19a及单一条LED灯丝100。LED灯丝100包括位于两端的两电极110、112、多个LED段102、104与多个第一导体段130、第二导体段130'。并且，LED球泡灯40c以及LED球泡灯40c中所设置的单根LED灯丝100可参考前述多个实施例的LED球泡灯、LED灯丝与其相关描述，其中相同或相似的组件与组件之间的连接关系不再详细叙述。Referring to FIG. 55A and FIG. 55B to FIG. 55D, FIG. 55A is a schematic diagram of an LED bulb 40c according to an embodiment of the present invention, and FIGS. 55B to 55D are respectively the LED bulb 40c of FIG. 55A. Side view, another side view with top view. In the present embodiment, the LED bulb 40c includes a lamp housing 12, a lamp cap 16 that connects the lamp housing 12, a stem 19, a stand 19a, and a single LED filament 100. The LED filament 100 includes two electrodes 110, 112 at both ends, a plurality of LED segments 102, 104 and a plurality of first conductor segments 130, and a second conductor segment 130'. Moreover, the LED bulb 40c and the single LED filament 100 disposed in the LED bulb 40c can refer to the LED bulb, LED filament and related descriptions of the foregoing various embodiments, wherein the same or similar components and components The connection relationship between them is not described in detail.
如图55A至图55D所示，在本实施例中，LED灯丝100的第一导体段130有三个，第二导体段130'有四个，而LED段102、104有八个，且每两相邻的LED段102、104之间是透过第一导体段130、第二导体段130'弯折。LED球泡灯40c中的单一条LED灯丝100可藉由第一导体段130、第二导体段130'而大幅度的弯折，并产生较显着的弯曲变化，且LED灯丝100可定义为在每一个弯折的第一导体段130、第二导体段130'之后是接续一个分段，则各个LED段102、104是形成各个对应的分段。在本实施例中，LED灯丝100藉由三个第一导体段130、四个第二导体段130'而被弯折为八个分段，所述八个LED段102、104即分别为所述八个分段。As shown in FIGS. 55A to 55D, in the present embodiment, the LED filament 100 has three first conductor segments 130, two second conductor segments 130', and eight LED segments 102, 104, and two. The adjacent LED segments 102, 104 are bent through the first conductor segment 130 and the second conductor segment 130'. The single LED filament 100 in the LED bulb 40c can be bent substantially by the first conductor segment 130 and the second conductor segment 130', and produces a more significant bending change, and the LED filament 100 can be defined as After each of the bent first conductor segment 130 and the second conductor segment 130' is followed by a segment, each LED segment 102, 104 is formed into a respective segment. In this embodiment, the LED filament 100 is bent into eight segments by three first conductor segments 130 and four second conductor segments 130', and the eight LED segments 102, 104 are respectively Eight segments are described.
如图55A至图55C所示，在本实施例中，其中三个较高的第一导体段130在Z方向上的高度会大于另外四个较低的第二导体段130'在Z方向上的高度，而六个LED段102、104在Z方向上则位于较高的第一导体段130与较低的第二导体段130'之间，另外两个LED段102、104则在Z方向上由对应的第二导体段130'向上延伸，且电极110、112在Z方向上的高度约与较高的第一导体段130在Z方向上的高度相同。如图55B与图55C所示，在本实施例中，若LED灯丝100投影在YZ平面(参照图55B)或XZ平面上(参照图55C)，相对的两个LED段102、104的投影是彼此重叠的。如图55D所示，在本实施例中，若LED灯丝100投影在XY平面上(参照图55D)，第一导体段130、第二导体段130'在XY平面上的投影都位于电极110、112所连成的直线的其中一侧。As shown in FIGS. 55A to 55C, in the present embodiment, the height of the three higher first conductor segments 130 in the Z direction is greater than the other four lower second conductor segments 130' in the Z direction. The height of the six LED segments 102, 104 is between the higher first conductor segment 130 and the lower second conductor segment 130' in the Z direction, and the other two LED segments 102, 104 are in the Z direction. The upper portion extends upward from the corresponding second conductor segment 130', and the height of the electrodes 110, 112 in the Z direction is about the same as the height of the higher first conductor segment 130 in the Z direction. As shown in Fig. 55B and Fig. 55C, in the present embodiment, if the LED filament 100 is projected on the YZ plane (refer to Fig. 55B) or the XZ plane (refer to Fig. 55C), the projection of the opposite LED segments 102, 104 is Overlapping each other. As shown in FIG. 55D, in the present embodiment, if the LED filament 100 is projected on the XY plane (refer to FIG. 55D), the projections of the first conductor segment 130 and the second conductor segment 130' on the XY plane are all located at the electrode 110, One of the straight lines of 112 connected.
请参考图56A与图56B至图56D，图56A所示为根据本发明的一个实施例的LED球泡灯40d的示意图，图56B至图56D所示分别为图56A的LED球泡灯40d的侧视图、另一侧视图与顶视图。在本实施例中，LED球泡灯40d包括灯壳12、连接灯壳12的灯头16、芯柱19、立竿19a及单一条LED灯丝100。LED灯丝100包括位于两端的两电极110、112、多 个LED段102、104与多个第一导体段130、第二导体段130'。并且，LED球泡灯40d以及LED球泡灯40d中所设置的单根LED灯丝100可参考前述多个实施例的LED球泡灯、LED灯丝与其相关描述，其中相同或相似的组件与组件之间的连接关系不再详细叙述。Please refer to FIG. 56A and FIG. 56B to FIG. 56D. FIG. 56A is a schematic diagram of an LED bulb 40d according to an embodiment of the present invention, and FIGS. 56B to 56D are respectively the LED bulb 40d of FIG. 56A. Side view, another side view with top view. In the present embodiment, the LED bulb 40d includes a lamp housing 12, a lamp cap 16 that connects the lamp housing 12, a stem 19, a stand 19a, and a single LED filament 100. The LED filament 100 includes two electrodes 110, 112 at both ends, a plurality of LED segments 102, 104 and a plurality of first conductor segments 130, and a second conductor segment 130'. Moreover, the LED bulb 40d and the single LED filament 100 disposed in the LED bulb 40d can refer to the LED bulb, LED filament and related descriptions of the foregoing various embodiments, wherein the same or similar components and components The connection relationship between them is not described in detail.
如图56A至图56D所示，在本实施例中，LED灯丝100的第一导体段130有两个，第二导体段130'有一个，而LED段102、104有四个，且每两相邻的LED段102、104之间是透过第一导体段130、第二导体段130'弯折。LED球泡灯40d中的单一条LED灯丝100可藉由第一导体段130、第二导体段130'而大幅度的弯折，并产生较显着的弯曲变化，且LED灯丝100可定义为在每一个弯折的第一导体段130、第二导体段130'之后是接续一个分段，则各个LED段102、104是形成各个对应的分段。在本实施例中，LED灯丝100藉由两个第一导体段130、一个第二导体段130'而被弯折为四个分段，所述四个LED段102、104即分别为所述四个分段。As shown in FIG. 56A to FIG. 56D, in the present embodiment, the LED filament 100 has two first conductor segments 130, one second conductor segment 130', and four LED segments 102, 104, and two each. The adjacent LED segments 102, 104 are bent through the first conductor segment 130 and the second conductor segment 130'. The single LED filament 100 in the LED bulb 40d can be greatly bent by the first conductor segment 130 and the second conductor segment 130', and produces a more significant bending change, and the LED filament 100 can be defined as After each of the bent first conductor segment 130 and the second conductor segment 130' is followed by a segment, each LED segment 102, 104 is formed into a respective segment. In this embodiment, the LED filament 100 is bent into four segments by two first conductor segments 130 and one second conductor segment 130', wherein the four LED segments 102, 104 are respectively Four segments.
如图56A至图56C所示，在本实施例中，其中两个较高的第一导体段130在Z方向上的高度会大于另外一个较低的第二导体段130'在Z方向上的高度，而两个LED段102、104在Z方向上则位于较高的第一导体段130与较低的第二导体段130'之间，另外两个LED段102、104则在Z方向上由对应的第一导体段130向下延伸，且电极110、112在Z方向上的高度低于第二导体段130'在Z方向上的高度。如图56C所示，在本实施例中，若LED灯丝100投影在XZ平面上(参照图56C)，相对的两个LED段102、104的投影是彼此重叠的。如图56D所示，在本实施例中，若LED灯丝100投影在XY平面上(参照图56D)，第一导体段130、第二导体段130'在XY平面上的投影都位于电极110、112所连成的直线的其中一侧。As shown in FIGS. 56A to 56C, in the present embodiment, the height of the two higher first conductor segments 130 in the Z direction is greater than the height of the other lower second conductor segment 130' in the Z direction. Height, and the two LED segments 102, 104 are located between the higher first conductor segment 130 and the lower second conductor segment 130' in the Z direction, and the other two LED segments 102, 104 are in the Z direction. Extending downward from the corresponding first conductor segment 130, and the height of the electrodes 110, 112 in the Z direction is lower than the height of the second conductor segment 130' in the Z direction. As shown in Fig. 56C, in the present embodiment, if the LED filament 100 is projected on the XZ plane (refer to Fig. 56C), the projections of the opposite LED segments 102, 104 overlap each other. As shown in FIG. 56D, in the present embodiment, if the LED filament 100 is projected on the XY plane (refer to FIG. 56D), the projections of the first conductor segment 130 and the second conductor segment 130' on the XY plane are all located at the electrode 110, One of the straight lines of 112 connected.
相较于图53A至图53D的LED球泡灯40a的LED灯丝100，图56A至图56D的LED球泡灯40d的LED灯丝100的第一导体段130与第二导体段130'在Z方向上的高度差较小，因而第一导体段130、第二导体段130'的弯折幅度较为和缓，使LED灯丝100整体而言呈现较平缓的起伏曲线。Compared to the LED filament 100 of the LED bulb 40a of FIGS. 53A-53D, the first conductor segment 130 and the second conductor segment 130' of the LED filament 100 of the LED bulb 40d of FIGS. 56A-56D are in the Z direction. The height difference between the first conductor segment 130 and the second conductor segment 130' is relatively gentle, so that the LED filament 100 as a whole has a gentle undulation curve.
请参考图57A与图57B至图57D，图57A所示为根据本发明的一个实施例的LED球泡灯40e的示意图，图57B至图57D所示分别为图57A的LED球泡灯40e的侧视图、另一侧视图与顶视图。在本实施例中，LED球泡灯40e包括灯壳12、连接灯壳12的灯头16、芯柱19、立竿19a及单一条LED灯丝100。LED灯丝100包括位于两端的两电极110、112、多个LED段102、104与多个第一导体段130、第二导体段。并且，LED球泡灯40e以及LED球泡灯40e中所设置的单根LED灯丝100可参考前述多个实施例的LED球泡灯、LED灯丝与其相关描述，其中相同或相似的组件与组件之间的连接关系不再详细叙述。Please refer to FIG. 57A and FIG. 57B to FIG. 57D. FIG. 57A is a schematic diagram of an LED bulb 40e according to an embodiment of the present invention, and FIGS. 57B to 57D are respectively the LED bulb 40e of FIG. 57A. Side view, another side view with top view. In the present embodiment, the LED bulb 40e includes a lamp housing 12, a lamp cap 16 that connects the lamp housing 12, a stem 19, a stand 19a, and a single LED filament 100. The LED filament 100 includes two electrodes 110, 112 at both ends, a plurality of LED segments 102, 104 and a plurality of first conductor segments 130, and second conductor segments. Moreover, the LED bulb 40e and the single LED filament 100 disposed in the LED bulb 40e can refer to the LED bulb, LED filament and related descriptions of the foregoing various embodiments, wherein the same or similar components and components The connection relationship between them is not described in detail.
如图57A至图57D所示，在本实施例中，LED灯丝100的第一导体段130有三个，第二导体段130'有两个，而LED段102、104有六个，且每两相邻的LED段102、104之间是透过第一导体段130、第二导体段130'弯折。LED球泡灯40e中的单一条LED灯丝100可藉由第一导体段130、第二导体段130'而大幅度的弯折，并产生较显着的弯曲变化，且LED灯丝100可定义为在每一个弯折的第一导体段130、第二导体段130'之后是接续一个分段，则 各个LED段102、104是形成各个对应的分段。在本实施例中，LED灯丝100藉由三个第一导体段130、两个第二导体段130'而被弯折为六个分段，所述六个LED段102、104即分别为所述六个分段。As shown in FIG. 57A to FIG. 57D, in the present embodiment, the LED filament 100 has three first conductor segments 130, two second conductor segments 130', and six LED segments 102, 104, and two. The adjacent LED segments 102, 104 are bent through the first conductor segment 130 and the second conductor segment 130'. The single LED filament 100 in the LED bulb 40e can be bent substantially by the first conductor segment 130 and the second conductor segment 130', and produces a more significant bending change, and the LED filament 100 can be defined as After each of the bent first conductor segment 130 and the second conductor segment 130' is followed by a segment, each LED segment 102, 104 is formed into a respective segment. In this embodiment, the LED filament 100 is bent into six segments by three first conductor segments 130 and two second conductor segments 130', and the six LED segments 102, 104 are respectively Six segments are described.
如图57A至图57C所示，在本实施例中，其中三个较高的第一导体段130在Z方向上的高度会大于另外两个较低的第二导体段130'在Z方向上的高度，而四个LED段102、104在Z方向上则位于较高的第一导体段130与较低的第二导体段130'之间，另外两个LED段102、104则在Z方向上由对应的第一导体段130向下延伸，且电极110、112在Z方向上的高度低于第一导体段130在Z方向上的高度。如图57C所示，在本实施例中，若LED灯丝100投影在XZ平面上(参照图57C)，相对的两个LED段102、104的投影是彼此重叠的。如图57D所示，在本实施例中，若LED灯丝100投影在XY平面上(参照图57D)，第二导体段130'在XY平面上的投影都位于电极110、112所连成的直线的其中一侧。As shown in FIGS. 57A to 57C, in the present embodiment, the height of the three higher first conductor segments 130 in the Z direction is greater than the other two lower second conductor segments 130' in the Z direction. The height of the four LED segments 102, 104 is between the higher first conductor segment 130 and the lower second conductor segment 130' in the Z direction, and the other two LED segments 102, 104 are in the Z direction. The upper portion extends downward from the corresponding first conductor segment 130, and the height of the electrodes 110, 112 in the Z direction is lower than the height of the first conductor segment 130 in the Z direction. As shown in Fig. 57C, in the present embodiment, if the LED filament 100 is projected on the XZ plane (refer to Fig. 57C), the projections of the opposite LED segments 102, 104 overlap each other. As shown in FIG. 57D, in the present embodiment, if the LED filament 100 is projected on the XY plane (refer to FIG. 57D), the projection of the second conductor segment 130' on the XY plane is located on the line formed by the electrodes 110, 112. One of the sides.
相较于图54A至图54D的LED球泡灯40b的LED灯丝100，图57A至图57D的LED球泡灯40e的LED灯丝100的第一导体段130与第二导体段130'在Z方向上的高度差较小，因而第一导体段130、第二导体段130'的弯折幅度较为和缓，使LED灯丝100整体而言呈现较平缓的起伏曲线。Compared to the LED filament 100 of the LED bulb 40b of FIGS. 54A to 54D, the first conductor segment 130 and the second conductor segment 130' of the LED filament 100 of the LED bulb 40e of FIGS. 57A to 57D are in the Z direction. The height difference between the first conductor segment 130 and the second conductor segment 130' is relatively gentle, so that the LED filament 100 as a whole has a gentle undulation curve.
请参考图58A与图58B至图58D，图58A所示为根据本发明的一个实施例的LED球泡灯40f的示意图，图58B至图58D所示分别为图58A的LED球泡灯40f的侧视图、另一侧视图与顶视图。在本实施例中，LED球泡灯40f包括灯壳12、连接灯壳12的灯头16、芯柱19、立竿19a及单一条LED灯丝100。LED灯丝100包括位于两端的两电极110、112、多个LED段102、104与多个第一导体段130、第二导体段130'。并且，LED球泡灯40f以及LED球泡灯40f中所设置的单根LED灯丝100可参考前述多个实施例的LED球泡灯、LED灯丝与其相关描述，其中相同或相似的组件与组件之间的连接关系不再详细叙述。Referring to FIG. 58A and FIG. 58B to FIG. 58D, FIG. 58A is a schematic diagram of an LED bulb 40f according to an embodiment of the present invention, and FIGS. 58B to 58D are respectively LED bulb 40f of FIG. 58A. Side view, another side view with top view. In the present embodiment, the LED bulb 40f includes a lamp housing 12, a lamp cap 16 that connects the lamp housing 12, a stem 19, a stand 19a, and a single LED filament 100. The LED filament 100 includes two electrodes 110, 112 at both ends, a plurality of LED segments 102, 104 and a plurality of first conductor segments 130, and a second conductor segment 130'. Moreover, the LED bulb 40f and the single LED filament 100 disposed in the LED bulb 40f can refer to the LED bulb, LED filament and related descriptions of the foregoing various embodiments, wherein the same or similar components and components The connection relationship between them is not described in detail.
如图58A至图58D所示，在本实施例中，LED灯丝100的第一导体段130有三个，第二导体段130'有四个，而LED段102、104有八个，且每两相邻的LED段102、104之间是透过第一导体段130、第二导体段130'弯折。LED球泡灯40f中的单一条LED灯丝100可藉由第一导体段130、第二导体段130'而大幅度的弯折，并产生较显着的弯曲变化，且LED灯丝100可定义为在每一个弯折的第一导体段130、第二导体段130'之后是接续一个分段，则各个LED段102、104是形成各个对应的分段。在本实施例中，LED灯丝100藉由三个第一导体段130、四个第二导体段130'而被弯折为八个分段，所述八个LED段102、104即分别为所述八个分段。As shown in FIG. 58A to FIG. 58D, in the present embodiment, the LED filament 100 has three first conductor segments 130, the second conductor segment 130' has four, and the LED segments 102, 104 have eight, and each two. The adjacent LED segments 102, 104 are bent through the first conductor segment 130 and the second conductor segment 130'. The single LED filament 100 in the LED bulb 40f can be greatly bent by the first conductor segment 130 and the second conductor segment 130', and produces a more significant bending change, and the LED filament 100 can be defined as After each of the bent first conductor segment 130 and the second conductor segment 130' is followed by a segment, each LED segment 102, 104 is formed into a respective segment. In this embodiment, the LED filament 100 is bent into eight segments by three first conductor segments 130 and four second conductor segments 130', and the eight LED segments 102, 104 are respectively Eight segments are described.
如图58A至图58C所示，在本实施例中，其中三个较高的第一导体段130在Z方向上的高度会大于另外四个较低的第二导体段130'在Z方向上的高度，而六个LED段102、104在Z方向上则位于较高的第一导体段130与较低的第二导体段130'之间，另外两个LED段102、104则在Z方向上由对应的第二导体段130'向上延伸，且电极110、112在Z方向上的高度约等于较高的第二导体段130在Z方向上的高度。如图58B与图58C所示，在本实施 例中，若LED灯丝100投影在YZ平面(参照图58B)或XZ平面上(参照图58C)，相对的两个LED段102、104的投影是彼此重叠的。如图58D所示，在本实施例中，若LED灯丝100投影在XY平面上(参照图58D)，第一导体段130、第二导体段130'在XY平面上的投影都位于电极110、112所连成的直线的其中一侧。As shown in FIGS. 58A to 58C, in the present embodiment, the height of the three higher first conductor segments 130 in the Z direction is greater than the other four lower second conductor segments 130' in the Z direction. The height of the six LED segments 102, 104 is between the higher first conductor segment 130 and the lower second conductor segment 130' in the Z direction, and the other two LED segments 102, 104 are in the Z direction. The upper portion extends upward from the corresponding second conductor segment 130', and the height of the electrodes 110, 112 in the Z direction is approximately equal to the height of the higher second conductor segment 130 in the Z direction. As shown in Fig. 58B and Fig. 58C, in the present embodiment, if the LED filament 100 is projected on the YZ plane (refer to Fig. 58B) or the XZ plane (refer to Fig. 58C), the projection of the opposite LED segments 102, 104 is Overlapping each other. As shown in FIG. 58D, in the present embodiment, if the LED filament 100 is projected on the XY plane (refer to FIG. 58D), the projections of the first conductor segment 130 and the second conductor segment 130' on the XY plane are all located at the electrode 110, One of the straight lines of 112 connected.
相较于图55A至图55D的LED球泡灯40c的LED灯丝100，图58A至图58D的LED球泡灯40f的LED灯丝100的第一导体段130与第二导体段130'在Z方向上的高度差较小，因而第一导体段130、第二导体段130'的弯折幅度较为和缓，使LED灯丝100整体而言呈现较平缓的起伏曲线。Compared with the LED filament 100 of the LED bulb 40c of FIGS. 55A to 55D, the first conductor segment 130 and the second conductor segment 130' of the LED filament 100 of the LED bulb 40f of FIGS. 58A to 58D are in the Z direction. The height difference between the first conductor segment 130 and the second conductor segment 130' is relatively gentle, so that the LED filament 100 as a whole has a gentle undulation curve.
请参考图59A与图59B至图59D，图59A所示为根据本发明的一个实施例的LED球泡灯40g的示意图，图59B至图59D所示分别为图59A的LED球泡灯40g的侧视图、另一侧视图与顶视图。在本实施例中，LED球泡灯40g包括灯壳12、连接灯壳12的灯头16、芯柱19、立竿19a及单一条LED灯丝100。LED灯丝100包括位于两端的两电极110、112、多个LED段102、104与多个第一导体段130、第二导体段130'。并且，LED球泡灯40g以及LED球泡灯40g中所设置的单根LED灯丝100可参考前述多个实施例的LED球泡灯、LED灯丝与其相关描述，其中相同或相似的组件与组件之间的连接关系不再详细叙述。Referring to FIG. 59A and FIG. 59B to FIG. 59D, FIG. 59A is a schematic diagram of an LED bulb 40g according to an embodiment of the present invention, and FIGS. 59B to 59D are respectively the LED bulb 40g of FIG. 59A. Side view, another side view with top view. In the present embodiment, the LED bulb 40g includes a lamp housing 12, a lamp cap 16 that connects the lamp housing 12, a stem 19, a stand 19a, and a single LED filament 100. The LED filament 100 includes two electrodes 110, 112 at both ends, a plurality of LED segments 102, 104 and a plurality of first conductor segments 130, and a second conductor segment 130'. Moreover, the LED bulb 40g and the single LED filament 100 disposed in the LED bulb 40g can refer to the LED bulb, LED filament and related descriptions of the foregoing various embodiments, wherein the same or similar components and components The connection relationship between them is not described in detail.
如图59A至图59D所示，在本实施例中，LED灯丝100的第一导体段130有两个，第二导体段130'有一个，而LED段102、104有四个，且每两相邻的LED段102、104之间是透过第一导体段130、第二导体段130'弯折。LED球泡灯40g中的单一条LED灯丝100可藉由第一导体段130、第二导体段130'而大幅度的弯折，并产生较显着的弯曲变化，且LED灯丝100可定义为在每一个弯折的第一导体段130、第二导体段130'之后是接续一个分段，则各个LED段102、104是形成各个对应的分段。在本实施例中，LED灯丝100藉由两个第一导体段130、一个第二导体段130'而被弯折为四个分段，所述四个LED段102、104即分别为所述四个分段。As shown in FIG. 59A to FIG. 59D, in the present embodiment, the LED filament 100 has two first conductor segments 130, one second conductor segment 130', and four LED segments 102, 104, and two. The adjacent LED segments 102, 104 are bent through the first conductor segment 130 and the second conductor segment 130'. The single LED filament 100 in the LED bulb 40g can be bent substantially by the first conductor segment 130 and the second conductor segment 130', and produces a more significant bending change, and the LED filament 100 can be defined as After each of the bent first conductor segment 130 and the second conductor segment 130' is followed by a segment, each LED segment 102, 104 is formed into a respective segment. In this embodiment, the LED filament 100 is bent into four segments by two first conductor segments 130 and one second conductor segment 130', wherein the four LED segments 102, 104 are respectively Four segments.
如图59A至图59C所示，在本实施例中，其中两个较高的第一导体段130在Z方向上的高度会大于另外一个较低的第二导体段130'在Z方向上的高度，而两个LED段104在Z方向上则位于较高的第一导体段130与较低的第二导体段130'之间，另外两个LED段102、104则在Z方向上由对应的第一导体段130向下延伸，且电极110、112在Z方向上的高度低于第二导体段130'在Z方向上的高度。As shown in FIGS. 59A to 59C, in the present embodiment, the height of the two higher first conductor segments 130 in the Z direction is greater than the height of the other lower second conductor segment 130' in the Z direction. Height, and the two LED segments 104 are located between the upper first conductor segment 130 and the lower second conductor segment 130' in the Z direction, and the other two LED segments 102, 104 are corresponding in the Z direction. The first conductor segment 130 extends downwardly and the height of the electrodes 110, 112 in the Z direction is lower than the height of the second conductor segment 130' in the Z direction.
如图59A所示，在本实施例中，LED灯丝100沿着一轴向环绕延伸而类似于螺旋形。如图59B所示，在本实施例中，LED灯丝100的类螺旋形的中间螺圈的部分(即两个LED段102、104环绕组成的部分)相对较小，而LED灯丝100的类螺旋形的外圈的部分(即另外两个LED段102、104往外环绕延伸的部分)则相对较大，且LED灯丝在YZ平面上的轮廓可形成类似爱心的形状，两第一导体段130在Y方向上的距离小于两电极110、112之间的距离。在其它实施例中，也可为第一导体段130在Y方向上的距离大于或等于两电极110、112之间的距离。如图59C所示，在本实施例中，LED灯丝100在XZ平面的轮廓具有S形。若LED灯 丝100沿着其轴向持续以螺旋状环绕延伸，则LED灯丝100在XZ平面的轮廓可具有多个交叠的S形。如图59D所示，在本实施例中，LED灯丝100在XY平面的轮廓亦具有S形。若LED灯丝100沿着其轴向持续以螺旋状环绕延伸，则LED灯丝100在XY平面的轮廓可具有多个交叠的S形。如图59C与图59D所示，在本实施例中，第一导体段130、第二导体段130'位于电极110、112之间。As shown in Fig. 59A, in the present embodiment, the LED filament 100 extends around an axial direction like a spiral. As shown in Fig. 59B, in the present embodiment, the portion of the spiral-like intermediate coil of the LED filament 100 (i.e., the portion around which the two LED segments 102, 104 are formed) is relatively small, and the spiral of the LED filament 100 is spiral. The portion of the outer ring (i.e., the portion of the other two LED segments 102, 104 that extends outwardly) is relatively large, and the contour of the LED filament in the YZ plane may form a love-like shape, and the two first conductor segments 130 are The distance in the Y direction is smaller than the distance between the two electrodes 110, 112. In other embodiments, the distance of the first conductor segment 130 in the Y direction may be greater than or equal to the distance between the two electrodes 110, 112. As shown in Fig. 59C, in the present embodiment, the LED filament 100 has an S-shape in the outline of the XZ plane. If the LED filament 100 continues to extend in a spiral shape along its axial direction, the outline of the LED filament 100 in the XZ plane may have a plurality of overlapping S-shapes. As shown in Fig. 59D, in the present embodiment, the outline of the LED filament 100 in the XY plane also has an S shape. If the LED filament 100 continues to extend in a spiral shape along its axial direction, the profile of the LED filament 100 in the XY plane may have a plurality of overlapping S-shapes. As shown in FIG. 59C and FIG. 59D, in the present embodiment, the first conductor segment 130 and the second conductor segment 130' are located between the electrodes 110, 112.
请参考图60A与图60B至图60D，图60A所示为根据本发明的一个实施例的LED球泡灯40h的示意图，图60B至图60D所示分别为图60A的LED球泡灯40h的侧视图、另一侧视图与顶视图。在本实施例中，LED球泡灯40h包括灯壳12、连接灯壳12的灯头16、芯柱19、立竿19a及单一条LED灯丝100。LED灯丝100包括位于两端的两电极110、112、两个LED段102与单一个导体段130。并且，LED球泡灯40h以及LED球泡灯40h中所设置的单根LED灯丝100可参考前述多个实施例的LED球泡灯、LED灯丝与其相关描述，其中相同或相似的组件与组件之间的连接关系不再详细叙述。Please refer to FIG. 60A and FIG. 60B to FIG. 60D. FIG. 60A is a schematic diagram of an LED bulb 40h according to an embodiment of the present invention, and FIG. 60B to FIG. 60D are respectively the LED bulb 40h of FIG. 60A. Side view, another side view with top view. In the present embodiment, the LED bulb 40h includes a lamp housing 12, a lamp cap 16 that connects the lamp housing 12, a stem 19, a stand 19a, and a single LED filament 100. The LED filament 100 includes two electrodes 110, 112, two LED segments 102 and a single conductor segment 130 at both ends. Moreover, the LED bulb 40h and the single LED filament 100 disposed in the LED bulb 40h can refer to the LED bulb, LED filament and related descriptions of the foregoing various embodiments, wherein the same or similar components and components The connection relationship between them is not described in detail.
如图60A至图60D所示，在本实施例中，LED灯丝100的导体段130为一个，而LED段102、104有两个，且每两相邻的LED段102、104之间是透过导体段130连接，LED灯丝100在最高点的弯折态样呈现圆弧弯曲，即LED段102、104分别在LED灯丝100的最高点呈现圆弧弯曲，且导体段在LED灯丝的低点也呈现圆弧弯曲。LED灯丝100可定义为在每一个弯折的导体段130之后是接续一个分段，则各个LED段102、104形成对应的分段。As shown in FIG. 60A to FIG. 60D, in the present embodiment, the LED filament 100 has one conductor segment 130, and the LED segments 102, 104 have two, and each two adjacent LED segments 102, 104 are transparent. The conductor segments 130 are connected, and the LED filament 100 exhibits a circular arc bending at the highest point of the bending, that is, the LED segments 102 and 104 respectively exhibit a circular arc at the highest point of the LED filament 100, and the conductor segments are at the low point of the LED filament. It also exhibits a curved arc. The LED filament 100 can be defined as a segment following each bent conductor segment 130, and each LED segment 102, 104 forms a corresponding segment.
并且，由于LED灯丝100采用柔性基层，柔性基层优选采用有机硅改性聚酰亚胺树脂组合物，因此LED段102、104本身也具有一定程度的弯折能力。在本实施例中，两个LED段102分别弯折形成倒U形，而导体段130位于此两LED段102之间，且导体段130的弯折程度是相同于或更大于LED段102的弯折程度。也就是说，两个LED段102在灯丝高点处分别弯折形成倒U形并具有一弯曲半径R1值，导体段130在灯丝LED灯丝100低点处弯折并具有一弯曲半径R2值，其中R1大于R2值。透过导体段130的配置，使:LED灯丝100得以在有限空间内实现小回转半径的弯折。在一实施例中，LED段102与LED段104的弯折点在Z方向上处于同一高度。此外，在Z方向上，本实施例的立竿19a相对先前实施例的立竿19a具有较低的高度，此立竿19a的高度是对应于导体段130的高度。举例来说，导体段130的最低处可连接至立竿19a的顶部，以使LED灯丝100的整体造型不易变形。在不同实施例中，导体段130可穿过立竿19a的顶部的穿孔而彼此连接，或导体段130可胶黏于立竿19a的顶部而彼此连接，但不限于此。在一实施例中，导体段130与立杆19a可采用导丝连接，例如在立杆19a的顶部引出一导丝连接导体段130。Moreover, since the LED filament 100 uses a flexible base layer, and the flexible base layer preferably employs a silicone-modified polyimide resin composition, the LED segments 102, 104 themselves also have a certain degree of bending ability. In the present embodiment, the two LED segments 102 are respectively bent to form an inverted U shape, and the conductor segments 130 are located between the two LED segments 102, and the degree of bending of the conductor segments 130 is the same as or greater than that of the LED segments 102. The degree of bending. That is, the two LED segments 102 are respectively bent at the high point of the filament to form an inverted U shape and have a bending radius R1 value, and the conductor segment 130 is bent at a low point of the filament LED filament 100 and has a bending radius R2 value. Where R1 is greater than the R2 value. Through the arrangement of the conductor segments 130, the LED filament 100 can be bent in a limited space to achieve a small radius of gyration. In one embodiment, the LED segments 102 and the bend points of the LED segments 104 are at the same height in the Z direction. Further, in the Z direction, the stand 19a of the present embodiment has a lower height than the stand 19a of the previous embodiment, and the height of the stand 19a corresponds to the height of the conductor segment 130. For example, the lowest portion of the conductor segment 130 can be attached to the top of the riser 19a such that the overall shape of the LED filament 100 is not easily deformed. In various embodiments, the conductor segments 130 may be connected to each other through perforations in the top of the riser 19a, or the conductor segments 130 may be glued to the top of the stand 19a to be connected to each other, but are not limited thereto. In one embodiment, the conductor segments 130 and the uprights 19a may be connected by a guide wire, such as a guide wire connecting conductor segment 130 at the top of the uprights 19a.
如图60B所示，在本实施例中，在Z方向上，导体段130的高度高于两电极110、112，且两LED段102是分别由两电极110、112向上延伸至最高点后，再弯折向下延伸至连接两LED段102的导体段130。如图60C所示，在本实施例中，LED灯丝100在XZ平面的轮廓类似V形，也就是两LED段102是分别朝上朝外斜向延伸，并于最高点弯折后，再分别朝下朝内斜向延伸至导体段130。如图60D所示，在本实施例中，LED灯丝100在XY平面的轮 廓具有S形。如图60B与图60D所示，在本实施例中，导体段130位于电极110、112之间。如图60D所示，在本实施例中，在XY平面上，LED段102的弯折点、LED段104的弯折点及电极110、112大致位于以导体段130为圆心的圆周上。As shown in FIG. 60B, in the present embodiment, in the Z direction, the height of the conductor segment 130 is higher than the two electrodes 110, 112, and the two LED segments 102 are respectively extended upward from the two electrodes 110, 112 to the highest point. The bend further extends down to the conductor segments 130 connecting the two LED segments 102. As shown in FIG. 60C, in the present embodiment, the outline of the LED filament 100 in the XZ plane is similar to a V shape, that is, the two LED segments 102 are obliquely extended upward and outward, respectively, and are bent at the highest point, and then respectively The conductor segment 130 extends obliquely downward inwardly. As shown in Fig. 60D, in the present embodiment, the LED filament 100 has an S shape in the outline of the XY plane. As shown in FIGS. 60B and 60D, in the present embodiment, the conductor segments 130 are located between the electrodes 110, 112. As shown in Fig. 60D, in the present embodiment, in the XY plane, the bending point of the LED segment 102, the bending point of the LED segment 104, and the electrodes 110, 112 are located substantially on the circumference centered on the conductor segment 130.
请参照图61，图61为本发明的一个实施例的LED球泡灯的出光光谱示意图。在本实施例中，LED球泡灯可以是先前的各实施例所揭示的任一LED球泡灯，且此LED球泡灯之中设置有先前的各个实施例所揭示的任一单一条LED灯丝。经由光谱测量仪测量LED球泡灯所发出的光，可得到如图61所示的光谱示意图。由此光谱示意图可看出，LED球泡灯的光谱主要分布于波长400nm至800nm之间，且在此范围中的三处出现有三个峰值P1、P2、P3。峰值P1约在波长430nm至480nm之间，峰值P2约在波长580nm至620nm之间，而峰值P3约在波长680nm至750nm之间。在强度上，峰值P1的强度小于峰值P2的强度，而峰值P2的强度小于峰值P3的强度。如图61所示，这样的光谱分布接近传统白炽光灯丝灯的光谱分布，也接近自然光的光谱分布。某一实施例中，单一条LED灯丝的出光光谱示意图如图62所示，由此光谱示意图可看出，LED球泡灯的光谱主要分布于波长400nm至800nm之间，且在此范围中的三处出现有三个峰值P1、P2、P3。峰值P1约在波长430nm至480nm之间，峰值P2约在波长480nm至530nm之间，而峰值P3约在波长630nm至680nm之间。这样的光谱分布接近传统白炽光灯丝灯的光谱分布，也接近自然光的光谱分布。Please refer to FIG. 61. FIG. 61 is a schematic diagram showing the light emission spectrum of an LED bulb according to an embodiment of the present invention. In this embodiment, the LED bulb can be any of the LED bulbs disclosed in the previous embodiments, and any one of the LEDs disclosed in the previous embodiments is disposed in the LED bulb. filament. The spectrum emitted by the LED bulb is measured by a spectrometer to obtain a spectrum diagram as shown in FIG. As can be seen from the spectrum diagram, the spectrum of the LED bulb is mainly distributed between wavelengths of 400 nm and 800 nm, and three peaks P1, P2, and P3 appear in three places in this range. The peak P1 is between about 430 nm and 480 nm, the peak P2 is between about 580 nm and 620 nm, and the peak P3 is between about 680 nm and 750 nm. In terms of intensity, the intensity of the peak P1 is less than the intensity of the peak P2, and the intensity of the peak P2 is less than the intensity of the peak P3. As shown in Fig. 61, such a spectral distribution is close to the spectral distribution of a conventional incandescent filament lamp and also close to the spectral distribution of natural light. In one embodiment, a schematic diagram of the light emission spectrum of a single LED filament is shown in FIG. 62. From the spectrum diagram, it can be seen that the spectrum of the LED bulb is mainly distributed between wavelengths of 400 nm and 800 nm, and in this range. There are three peaks P1, P2, and P3 appearing at three places. The peak P1 is between about 430 nm and 480 nm, the peak P2 is between about 480 nm and 530 nm, and the peak P3 is between about 630 nm and 680 nm. Such a spectral distribution is close to the spectral distribution of a conventional incandescent filament lamp and also close to the spectral distribution of natural light.
本发明所指的“一根LED灯丝”、“一条LED灯丝”，指的是由前述导体段和LED段共同连接而成，具有相同且连续的光转换层(包括相同且连续形成的顶层或底层)，并且仅在两端设置有与灯泡导电支架电性连接的两个导电电极，符合以上结构叙述即为本发明所称的单一LED灯丝结构。The term "one LED filament" and "one LED filament" as used in the present invention means that the aforementioned conductor segments and LED segments are connected in common, and have the same and continuous light conversion layer (including the same and continuously formed top layer or The bottom layer), and only two conductive electrodes electrically connected to the bulb conductive support are disposed at both ends, which is a single LED filament structure as claimed in the present invention.
在一些实施例中，LED灯丝100可具有多段LED段，同一LED段中的LED芯片采用串联连接，不同的LED段之间采用并联连接，其中每一LED段的阳极可以作为LED灯丝的正极、并且每一LED段的阴极可以作为LED灯丝的负极分别连接二或二个以上导电支架(如图26A51a、51b)，并且通过导电支架电性连接电源模块(如518)。如图63A所示，图63A为本发明一实施例的LED灯丝电路示意图，此实施例中LED灯丝100具有两段LED段402、404，其中每段LED段402/404可包含一或多个LED芯片，同一LED段402/404中的LED芯片用串联连接，并且LED段402、LED段404在相互电性连接后彼此间会具有独立的电流路径(即，采分流方式连接)。更具体的说，本实施例的LED段402和LED段404的阳极连接在一起并且作为LED灯丝100的正极P1，LED段402的阴极作为LED灯丝100的第一负极N1，并且LED段402的阴极作为LED灯丝100的第二负极N2。LED灯丝100的正极P1、第一负极N1和第二负极N2分别通过导电支架电性连接至电源模块，例如如图26A所示的导电支架51a、51b和电源模块518。In some embodiments, the LED filament 100 can have a plurality of LED segments, the LED chips in the same LED segment are connected in series, and the different LED segments are connected in parallel, wherein the anode of each LED segment can serve as the anode of the LED filament. And the cathode of each LED segment can be connected as two or more conductive supports (as shown in FIGS. 26A51a, 51b) as the negative pole of the LED filament, and electrically connected to the power module (such as 518) through the conductive bracket. As shown in FIG. 63A, FIG. 63A is a schematic diagram of an LED filament circuit according to an embodiment of the present invention. In this embodiment, the LED filament 100 has two LED segments 402 and 404, wherein each segment of the LED segments 402/404 can include one or more. The LED chips, the LED chips in the same LED segment 402/404 are connected in series, and the LED segments 402 and the LED segments 404 have independent current paths (ie, split-flow connection) after being electrically connected to each other. More specifically, the LED segment 402 of the present embodiment and the anode of the LED segment 404 are connected together and serve as the positive pole P1 of the LED filament 100, the cathode of the LED segment 402 as the first negative pole N1 of the LED filament 100, and the LED segment 402 The cathode serves as the second negative electrode N2 of the LED filament 100. The positive electrode P1 of the LED filament 100, the first negative electrode N1 and the second negative electrode N2 are electrically connected to the power module through a conductive bracket, for example, the conductive brackets 51a, 51b and the power module 518 as shown in FIG. 26A.
更具体的说，所述LED灯丝100的正极P1、第一负极N1和第二负极N2与电源模块之间的电性连接关系可如图63B或图63C所示，其中图63B和图63C为本发明不同实施例的LED灯丝的电性连接关系的示意图。请先参照图63B，在本实施例中，LED灯丝100 的正极P1电性连接至电源模块518的第一输出端(或称正输出端)，并且LED灯丝100的第一负极N1和第二负极N2被电性连接/短路在一起，并且共同电性连接至电源模块518的第二输出端(或称负输出端)。搭配图63A来看，在图63B的电性连接关系下，LED段402和404可视为是并联于电源模块518的输出端上，因此LED段402和404皆是受到第一输出端和第二输出端之间的驱动电压V1所驱动。在LED段402和404所包含的芯片数和配置相同或近似的前提下，电源模块518所提供的驱动电流会均匀的分流至各LED段402和404上，因此会使LED段402和404呈现大致上一致的亮度和/或色温。More specifically, the electrical connection relationship between the positive electrode P1, the first negative electrode N1, and the second negative electrode N2 of the LED filament 100 and the power module can be as shown in FIG. 63B or FIG. 63C, wherein FIG. 63B and FIG. 63C are Schematic diagram of the electrical connection relationship of the LED filaments of different embodiments of the present invention. Referring to FIG. 63B, in this embodiment, the positive pole P1 of the LED filament 100 is electrically connected to the first output end (or positive output end) of the power module 518, and the first negative pole N1 and the second of the LED filament 100 are The negative poles N2 are electrically connected/short-circuited together and electrically connected to the second output end (or negative output end) of the power module 518. As seen in conjunction with FIG. 63A, in the electrical connection relationship of FIG. 63B, the LED segments 402 and 404 can be considered to be connected in parallel with the output of the power module 518, so the LED segments 402 and 404 are both subjected to the first output and the first The driving voltage V1 between the two outputs is driven. Under the premise that the number and configuration of chips included in LED segments 402 and 404 are the same or similar, the drive current provided by power module 518 is evenly shunted to each of LED segments 402 and 404, thus causing LED segments 402 and 404 to be rendered. A substantially uniform brightness and/or color temperature.
请接着参照图63C，在本实施例中，LED灯丝100的正极P1电性连接至电源模块518的第一输出端(或称正输出端)，LED灯丝100的第一负极N1电性连接至电源模块518的第二输出端(或称第一负输出端)，并且LED灯丝100的第二负极N1电性连接至电源模块518的第三输出端(或称第二负输出端)，其中，电源模块518的第一输出端和第二输出端之间会构成一个驱动电压V1输出，并且电源模块518的第一输出端和第三输出端之间会构成另一个驱动电压V2输出。搭配图63A来看，在图63C的电性连接关系下，LED段402是电性连接在第一输出端和第二输出端之间，并且LED段404是电性连接在第一输出端和第三输出端之间，因此LED段402和404可视为是分别受到驱动电压V1和V2所驱动。在此配置底下，电源模块518提供至LED段402/404的驱动电流可通过调变输出的驱动电压V1和V2大小来实现独立控制，进而使LED段402和404可分别具有对应的亮度和/或色温。换言之，在图63C的配置底下，通过电源模块518的设计及控制，即可在单一条LED灯丝上实现分段调光的功能。Referring to FIG. 63C, in the embodiment, the anode P1 of the LED filament 100 is electrically connected to the first output end (or the positive output end) of the power module 518, and the first cathode N1 of the LED filament 100 is electrically connected to The second output terminal (or the first negative output terminal) of the power module 518 is electrically coupled to the third output terminal (or the second negative output terminal) of the power module 518. A driving voltage V1 output is formed between the first output end and the second output end of the power module 518, and another driving voltage V2 output is formed between the first output end and the third output end of the power module 518. As seen in conjunction with FIG. 63A, in the electrical connection relationship of FIG. 63C, the LED segment 402 is electrically connected between the first output end and the second output end, and the LED segment 404 is electrically connected to the first output end and Between the third outputs, LED segments 402 and 404 can therefore be considered to be driven by drive voltages V1 and V2, respectively. Under this configuration, the drive current provided by the power module 518 to the LED segments 402/404 can be independently controlled by the magnitude of the drive voltages V1 and V2 of the modulated output, thereby allowing the LED segments 402 and 404 to have corresponding brightness and/or respectively. Or color temperature. In other words, under the configuration of FIG. 63C, by the design and control of the power module 518, the function of segment dimming can be realized on a single LED filament.
在一些实施例中，电源模块518的第二输出端和第三输出端可以通过电阻连接在一起，并且第二输出端和第三输出端其中之一电性连接/短路至接地端。通过此种配置即可构成具有不同电平的负输出端，进而产生具有不同电平的驱动电压V1和V2。在一些实施例中，第二输出端和第三输出端也可以是分别通过电路控制其电平，本发明不仅限于上述实施方式。In some embodiments, the second output and the third output of the power module 518 can be connected together by a resistor, and one of the second output and the third output is electrically connected/short-circuited to the ground. With this configuration, negative outputs having different levels can be constructed, thereby generating drive voltages V1 and V2 having different levels. In some embodiments, the second output terminal and the third output terminal may also be controlled by circuits, respectively, and the present invention is not limited to the above embodiments.
图64A为本发明一实施例的LED灯丝电路示意图，此实施例中LED灯丝100与前述图63A类似，同样具有两段LED段402、404，有关于各LED段402和404的配置于此不再重复赘述。本实施例与前述图63A实施例的主要差异在于，本实施例的LED段402和404是将阴极连接/短路在一起作为LED灯丝100的负极N1，并且LED段402和404的阳极会分别作为LED灯丝100的第一正极P1和第二正极P2。LED灯丝100的第一正极P1、第二正极P2和负极N1分别通过导电支架电性连接至电源模块，例如如图26A所示的导电支架51a、51b和电源模块518。FIG. 64A is a schematic diagram of a LED filament circuit according to an embodiment of the present invention. In this embodiment, the LED filament 100 is similar to the foregoing FIG. 63A, and has two LED segments 402 and 404. The arrangement of the LED segments 402 and 404 is not Repeat it again. The main difference between this embodiment and the foregoing embodiment of Fig. 63A is that the LED segments 402 and 404 of the present embodiment are connected/short-circuited together as the negative electrode N1 of the LED filament 100, and the anodes of the LED segments 402 and 404 are respectively The first positive electrode P1 and the second positive electrode P2 of the LED filament 100. The first positive electrode P1, the second positive electrode P2, and the negative electrode N1 of the LED filament 100 are electrically connected to the power module through a conductive bracket, for example, the conductive brackets 51a, 51b and the power module 518 as shown in FIG. 26A.
所述LED灯丝100的第一正极P1、第二正极P2和负极N1与电源模块之间的电性连接关系可如图64B或图64C所示，其中图64B和图64C为本发明不同实施例的LED灯丝的电性连接关系的示意图。请先参照图64B，在本实施例中，LED灯丝100的第一正极P1和第二正极P2被电性连接/短路在一起，并且共同电性连接至电源模块518的第一输出端(或称正输出端)，并且LED灯丝100的负极N1电性连接至电源模块518的第二输出端(或称 负输出端)。搭配图64A来看，在图64B的电性连接关系下，LED段402和404可视为是并联于电源模块518的输出端上，因此LED段402和404皆是受到第一输出端和第二输出端之间的驱动电压V1所驱动。在LED段402和404所包含的芯片数和配置相同或近似的前提下，电源模块518所提供的驱动电流会均匀的分流至各LED段402和404上，因此会使LED段402和404呈现大致上一致的亮度和/或色温。此配置可以等效为前述图63B实施例的配置。The electrical connection relationship between the first positive electrode P1, the second positive electrode P2, and the negative electrode N1 of the LED filament 100 and the power module can be as shown in FIG. 64B or FIG. 64C, wherein FIG. 64B and FIG. 64C are different embodiments of the present invention. Schematic diagram of the electrical connection relationship of the LED filaments. Referring to FIG. 64B, in this embodiment, the first positive electrode P1 and the second positive electrode P2 of the LED filament 100 are electrically connected/short-circuited together, and are electrically connected to the first output end of the power module 518 (or The positive output terminal is referred to, and the negative electrode N1 of the LED filament 100 is electrically connected to the second output terminal (or negative output terminal) of the power module 518. As seen in conjunction with FIG. 64A, in the electrical connection relationship of FIG. 64B, the LED segments 402 and 404 can be considered to be connected in parallel with the output of the power module 518, so the LED segments 402 and 404 are both subjected to the first output and the first The driving voltage V1 between the two outputs is driven. Under the premise that the number and configuration of chips included in LED segments 402 and 404 are the same or similar, the drive current provided by power module 518 is evenly shunted to each of LED segments 402 and 404, thus causing LED segments 402 and 404 to be rendered. A substantially uniform brightness and/or color temperature. This configuration can be equivalent to the configuration of the aforementioned embodiment of Fig. 63B.
请接着参照图64C，在本实施例中，LED灯丝100的第一正极P1电性连接至电源模块518的第一输出端(或称第一正输出端)，LED灯丝100的第二正极P2电性连接至电源模块518的第二输出端(或称第二正输出端)，并且LED灯丝100的负极N1电性连接至电源模块518的第三输出端(或称负输出端)，其中，电源模块518的第一输出端和第三输出端之间会构成一个驱动电压V1输出，并且电源模块518的第二输出端和第三输出端之间会构成另一个驱动电压V2输出。搭配图64A来看，在图64C的电性连接关系下，LED段402是电性连接在第一输出端和第三输出端之间，并且LED段404是电性连接在第二输出端和第三输出端之间，因此LED段402和404可视为是分别受到驱动电压V1和V2所驱动。在此配置底下，电源模块518提供至LED段402/404的驱动电流可通过调变输出的驱动电压V1和V2大小来实现独立控制，进而使LED段402和404可分别具有对应的亮度和/或色温。换言之，在图64C的配置底下，通过电源模块518的设计及控制，即可在单一条LED灯丝上实现分段调光的功能。Referring to FIG. 64C, in the embodiment, the first positive pole P1 of the LED filament 100 is electrically connected to the first output end (or the first positive output end) of the power module 518, and the second positive pole P2 of the LED filament 100 is connected. The second output end (or the second positive output end) of the power module 518 is electrically connected to the third output end (or the negative output end) of the power module 518. A driving voltage V1 output is formed between the first output terminal and the third output terminal of the power module 518, and another driving voltage V2 output is formed between the second output terminal and the third output terminal of the power module 518. As seen in conjunction with FIG. 64A, in the electrical connection relationship of FIG. 64C, the LED segment 402 is electrically connected between the first output terminal and the third output terminal, and the LED segment 404 is electrically connected to the second output terminal and Between the third outputs, LED segments 402 and 404 can therefore be considered to be driven by drive voltages V1 and V2, respectively. Under this configuration, the drive current provided by the power module 518 to the LED segments 402/404 can be independently controlled by the magnitude of the drive voltages V1 and V2 of the modulated output, thereby allowing the LED segments 402 and 404 to have corresponding brightness and/or respectively. Or color temperature. In other words, under the configuration of FIG. 64C, the function of the segment dimming can be realized on a single LED filament by the design and control of the power module 518.
图65A为本发明一实施例的LED灯丝电路示意图，此实施例中LED灯丝100具有三段LED段402、404、406，如图65A所示。更具体的说，本实施例的LED灯丝100的配置是在前述图63A的基础上再加上LED段406(也可以说是在图64A的基础上再加上图65A的LED段404，其中图65A的LED段406对应至图64A的LED段404)，其中有关于LED段402和404的配置可参照上述实施例说明，于此不再重复赘述。在本实施例中，LED段406的配置与LED段402和404近似/相同，其可包含一或多个LED芯片，所述LED芯片用串联连接，并且LED段402、404和406在相互电性连接后彼此间会具有独立的电流路径(即，采分流方式连接)。更具体的说，LED段406的阴极与LED段402的阴极电性连接/短路在一起(即，LED段402和406的阴极共同作为第一负极N1)，并且LED段406的阳极作为LED灯丝100的第二正极P2。换言之，在本实施例的LED灯丝100中，除了包含第一正极P1、第一负极N1和第二负极N2之外，更包含与LED段406的阳极电性连接的第二正极P2。65A is a schematic diagram of an LED filament circuit according to an embodiment of the invention. In this embodiment, the LED filament 100 has three segments of LED segments 402, 404, 406, as shown in FIG. 65A. More specifically, the LED filament 100 of the present embodiment is configured by adding an LED segment 406 to the foregoing FIG. 63A (which can also be said to be based on FIG. 64A plus the LED segment 404 of FIG. 65A, wherein The LED segment 406 of FIG. 65A corresponds to the LED segment 404) of FIG. 64A. The configuration of the LED segments 402 and 404 can be described with reference to the above embodiments, and details are not described herein again. In this embodiment, the LED segments 406 are configured similarly/identical to the LED segments 402 and 404, which may include one or more LED chips that are connected in series, and the LED segments 402, 404, and 406 are electrically connected to each other. After the connection, there will be independent current paths between each other (ie, the split mode connection). More specifically, the cathode of the LED segment 406 is electrically/short-circuited with the cathode of the LED segment 402 (ie, the cathodes of the LED segments 402 and 406 collectively serve as the first negative electrode N1), and the anode of the LED segment 406 acts as the LED filament. The second positive electrode P2 of 100. In other words, in the LED filament 100 of the present embodiment, in addition to the first positive electrode P1, the first negative electrode N1, and the second negative electrode N2, a second positive electrode P2 electrically connected to the anode of the LED segment 406 is further included.
在本实施例中LED灯丝100的配置底下，所述LED灯丝100与电源模块518之间的电性连接关系可具有如图65B至44D所示的型态，藉以实现均流驱动控制或是分段独立控制，其中图65B至图65D为本发明不同实施例的LED灯丝的电性连接关系的示意图。请先参照图65B，在本实施例中，LED灯丝100的第一正极P1和第二正极P2被电性连接/短路在一起，并且共同电性连接至电源模块518的第一输出端(或称正输出端)；LED灯丝100的第一负极N1和第二负极N2被电性连接/短路在一起，并且共同电性连接至电源模块518 的第二输出端(或称负输出端)。搭配图65A来看，在图65B的电性连接关系下，LED段402、404和406可视为是并联于电源模块518的输出端上，因此LED段402、404和406皆是受到第一输出端和第二输出端之间的驱动电压V1所驱动。在LED段402、404和406所包含的芯片数和配置相同或近似的前提下，电源模块518所提供的驱动电流会均匀的分流至各LED段402、404和406上，因此会使LED段402、404和406呈现大致上一致的亮度和/或色温。此配置可以等效为前述图63B、43B实施例的配置。In the configuration of the LED filament 100 in this embodiment, the electrical connection relationship between the LED filament 100 and the power module 518 may have a type as shown in FIGS. 65B to 44D, thereby implementing current sharing driving control or centring. Segment independent control, wherein FIGS. 65B to 65D are schematic diagrams showing electrical connection relationships of LED filaments according to different embodiments of the present invention. Referring to FIG. 65B, in this embodiment, the first positive electrode P1 and the second positive electrode P2 of the LED filament 100 are electrically connected/short-circuited together, and are electrically connected to the first output end of the power module 518 (or The first negative electrode N1 and the second negative electrode N2 of the LED filament 100 are electrically connected/short-circuited together, and are electrically connected to the second output terminal (or negative output terminal) of the power module 518. As seen in conjunction with FIG. 65A, in the electrical connection relationship of FIG. 65B, the LED segments 402, 404, and 406 can be considered to be parallel to the output of the power module 518, so the LED segments 402, 404, and 406 are both first. The driving voltage V1 between the output terminal and the second output terminal is driven. Under the premise that the number and configuration of chips included in the LED segments 402, 404, and 406 are the same or similar, the driving current provided by the power module 518 is evenly shunted to the LED segments 402, 404, and 406, thus causing the LED segments. 402, 404, and 406 exhibit substantially uniform brightness and/or color temperature. This configuration can be equivalent to the configuration of the aforementioned embodiment of Figs. 63B, 43B.
请接着参照图65C，在本实施例中，LED灯丝100的第一正极P1和第二正极P2被电性连接/短路在一起，并且共同电性连接至电源模块518的第一输出端(或称正输出端)，LED灯丝100的第一负极N1电性连接至电源模块518的第二输出端(或称第一负输出端)，并且LED灯丝100的第二负极N2电性连接至电源模块518的第三输出端(或称第二负输出端)。在此配置下，由于第一正极P1和第二正极P2可以视为是同一端，因此整体线路连接关系可等效为图63C的配置，相关控制方式、功能和效果可参照图63C的描述。本实施例的配置可以使一条灯丝具有两段调光的效果。Referring to FIG. 65C, in the embodiment, the first positive electrode P1 and the second positive electrode P2 of the LED filament 100 are electrically connected/short-circuited together, and are electrically connected to the first output end of the power module 518 (or The first negative pole N1 of the LED filament 100 is electrically connected to the second output end of the power module 518 (or the first negative output terminal), and the second negative pole N2 of the LED filament 100 is electrically connected to the power source. A third output (or second negative output) of module 518. In this configuration, since the first positive electrode P1 and the second positive electrode P2 can be regarded as the same end, the overall line connection relationship can be equivalent to the configuration of FIG. 63C, and the related control manners, functions, and effects can be referred to the description of FIG. 63C. The configuration of this embodiment can make one filament have two effects of dimming.
请接着参照图65D，在本实施例中，LED灯丝100的第一正极P1电性连接至电源模块518的第一输出端(或称第一正输出端)，第二正极P2电性连接至电源模块518的第二输出端(或称第二正输出端)，第一负极N1电性连接至电源模块518的第三输出端(或称第一负输出端)，并且第二负极N2电性连接至电源模块518的第四输出端(或称第二负输出端)。在此配置底下，电源模块518的第一输出端和第三输出端之间会构成一个驱动电压V1输出，电源模块518的第一输出端和第四输出端之间会构成另一个驱动电压V2输出，并且电源模块518的第二输出端和第三输出端之间会构成另一个驱动电压V3输出。搭配图65A来看，在图65D的电性连接关系下，LED段402是电性连接在第一输出端和第三输出端之间，LED段404是电性连接在第一输出端和第四输出端之间，并且LED段406是电性连接在第二输出端和第三输出端之间，因此LED段402、404和406可视为是分别受到驱动电压V1、V2和V3所驱动。在此配置底下，电源模块518提供至LED段402至406的驱动电流可通过调变输出的驱动电压V1、V2和V3大小来实现独立控制，进而使LED段402、404和406可分别具有对应的亮度和/或色温。本实施例的配置可以使一条灯丝具有三段调光的效果。Referring to FIG. 65D, in the embodiment, the first positive pole P1 of the LED filament 100 is electrically connected to the first output end (or the first positive output end) of the power module 518, and the second positive pole P2 is electrically connected to The second output end (or the second positive output end) of the power module 518 is electrically connected to the third output end (or the first negative output end) of the power module 518, and the second negative pole N2 is electrically connected. The fourth output (or second negative output) of the power module 518 is connected to the power module 518. Under this configuration, a driving voltage V1 output is formed between the first output end and the third output end of the power module 518, and another driving voltage V2 is formed between the first output end and the fourth output end of the power module 518. Output, and another drive voltage V3 output is formed between the second output terminal and the third output terminal of the power module 518. As seen in conjunction with FIG. 65A, in the electrical connection relationship of FIG. 65D, the LED segment 402 is electrically connected between the first output end and the third output end, and the LED segment 404 is electrically connected to the first output end and the first Between the four outputs, and the LED segments 406 are electrically connected between the second output and the third output, so the LED segments 402, 404 and 406 can be considered to be driven by the drive voltages V1, V2 and V3, respectively. . Under this configuration, the drive current supplied by the power module 518 to the LED segments 402 to 406 can be independently controlled by the magnitude of the drive voltages V1, V2, and V3 of the modulated output, thereby enabling the LED segments 402, 404, and 406 to have corresponding Brightness and / or color temperature. The configuration of this embodiment can make a filament have a three-stage dimming effect.
图66A为本发明一实施例的LED灯丝电路示意图，此实施例中LED灯丝100具有四段LED段402、404、406、408，如图66A所示。更具体的说，本实施例的LED灯丝100的配置是在前述图65A的基础上再加上LED段408，其中有关于LED段402、404和406的配置可参照上述实施例说明，于此不再重复赘述。在本实施例中，LED段408的配置与LED段402、404和406近似/相同，其可包含一或多个LED芯片，所述LED芯片用串联连接，并且LED段402、404、406和408在相互电性连接后彼此间会具有独立的电流路径(即，采分流方式连接)。更具体的说，LED段408的阴极与LED段404的阴极电性连接/短路在一起(即，LED段402和406的阴极共同作为第二负极N2)，并且LED段408的阳极作为LED灯丝100的第三正极P3。换言之，在本实施例的LED灯丝100中，除了包含第一正极P1、 第二正极P2、第一负极N1和第二负极N2之外，更包含与LED段408的阳极电性连接的第三正极P3。Figure 66A is a schematic diagram of an LED filament circuit in accordance with one embodiment of the present invention. In this embodiment, the LED filament 100 has four segments of LED segments 402, 404, 406, 408, as shown in Figure 66A. More specifically, the LED filament 100 of the present embodiment is configured by adding an LED segment 408 to the foregoing FIG. 65A, wherein the configuration of the LED segments 402, 404, and 406 can be described with reference to the above embodiments. The details are not repeated. In the present embodiment, the LED segments 408 are configured similarly/identical to the LED segments 402, 404, and 406, which may include one or more LED chips that are connected in series, and the LED segments 402, 404, 406 and 408 will have independent current paths between each other after being electrically connected to each other (ie, a split-flow connection). More specifically, the cathode of the LED segment 408 is electrically/synchronized with the cathode of the LED segment 404 (ie, the cathodes of the LED segments 402 and 406 collectively serve as the second negative electrode N2), and the anode of the LED segment 408 acts as the LED filament. The third positive electrode P3 of 100. In other words, in the LED filament 100 of the present embodiment, in addition to the first positive electrode P1, the second positive electrode P2, the first negative electrode N1, and the second negative electrode N2, a third electrode electrically connected to the anode of the LED segment 408 is further included. Positive electrode P3.
在本实施例中LED灯丝100的配置底下，所述LED灯丝100与电源模块518之间的电性连接关系可具有如图66B至66E所示的型态，藉以实现均流驱动控制或是分段独立控制，其中图66B至图66E为本发明不同实施例的LED灯丝的电性连接关系的示意图。请先参照图66B，在本实施例中，LED灯丝100的第一正极P1、第二正极P2和第三正极P3被电性连接/短路在一起，并且共同电性连接至电源模块518的第一输出端(或称正输出端)；LED灯丝100的第一负极N1和第二负极N2被电性连接/短路在一起，并且共同电性连接至电源模块518的第二输出端(或称负输出端)。搭配图66A来看，在图66B的电性连接关系下，LED段402、404、406和408可视为是并联于电源模块518的输出端上，因此LED段402、404、406和408皆是受到第一输出端和第二输出端之间的驱动电压V1所驱动。在LED段402、404、406和408所包含的芯片数和配置相同或近似的前提下，电源模块518所提供的驱动电流会均匀的分流至各LED段402、404、406和408上，因此会使LED段402、404、406和408呈现大致上一致的亮度和/或色温。此配置可以等效为前述图63B、43B、44B实施例的配置。In the configuration of the LED filament 100 in this embodiment, the electrical connection relationship between the LED filament 100 and the power module 518 may have the type shown in FIGS. 66B to 66E, thereby realizing the current sharing driving control or dividing. Segment independent control, wherein FIG. 66B to FIG. 66E are schematic diagrams showing electrical connection relationships of LED filaments according to different embodiments of the present invention. Referring to FIG. 66B, in the embodiment, the first positive electrode P1, the second positive electrode P2, and the third positive electrode P3 of the LED filament 100 are electrically connected/short-circuited together, and are electrically connected to the power module 518. An output terminal (or a positive output terminal); the first negative electrode N1 and the second negative electrode N2 of the LED filament 100 are electrically connected/short-circuited together, and are electrically connected to the second output end of the power module 518 (or Negative output)). 86A, in the electrical connection relationship of FIG. 66B, the LED segments 402, 404, 406 and 408 can be regarded as being parallel to the output of the power module 518, so the LED segments 402, 404, 406 and 408 are both It is driven by the driving voltage V1 between the first output terminal and the second output terminal. Under the premise that the number and configuration of chips included in the LED segments 402, 404, 406, and 408 are the same or similar, the driving current provided by the power module 518 is evenly shunted to the LED segments 402, 404, 406, and 408, The LED segments 402, 404, 406, and 408 will be rendered substantially uniform in brightness and/or color temperature. This configuration can be equivalent to the configuration of the aforementioned embodiment of Figs. 63B, 43B, 44B.
请接着参照图66C，在本实施例中，LED灯丝100的第一正极P1、第二正极P2和第三正极P3被电性连接/短路在一起，并且共同电性连接至电源模块518的第一输出端(或称正输出端)，LED灯丝100的第一负极N1电性连接至电源模块518的第二输出端(或称第一负输出端)，并且LED灯丝100的第二负极N2电性连接至电源模块518的第三输出端(或称第二负输出端)。在此配置下，由于第一正极P1、第二正极P2和第三正极P3可以视为是同一端，因此整体线路连接关系可等效为图63C的配置，相关控制方式、功能和效果可参照图63C的描述。本实施例的配置可以使一条灯丝具有两段调光的效果。Referring to FIG. 66C, in the embodiment, the first positive electrode P1, the second positive electrode P2, and the third positive electrode P3 of the LED filament 100 are electrically connected/short-circuited together, and are electrically connected to the power module 518. An output terminal (or positive output terminal), the first negative electrode N1 of the LED filament 100 is electrically connected to the second output end of the power module 518 (or the first negative output terminal), and the second negative pole N2 of the LED filament 100 The third output (or second negative output) of the power module 518 is electrically connected. In this configuration, since the first positive electrode P1, the second positive electrode P2, and the third positive electrode P3 can be regarded as the same end, the overall line connection relationship can be equivalent to the configuration of FIG. 63C, and related control methods, functions, and effects can be referred to. Figure 63C is a description. The configuration of this embodiment can make one filament have two effects of dimming.
请接着参照图66D，在本实施例中，LED灯丝100的第一正极P1和第二正极被电性连接/短路在一起，并共同电性连接至电源模块518的第一输出端(或称第一正输出端)，第三正极P3电性连接至电源模块518的第二输出端(或称第二正输出端)，第一负极N1电性连接至电源模块518的第三输出端(或称第一负输出端)，并且第二负极N2电性连接至电源模块518的第四输出端(或称第二负输出端)。在此配置下，由于第一正极P1和第二正极P2可以视为是同一端，因此整体线路连接关系可等效为图65D的配置，相关控制方式、功能和效果可参照图65D的描述。本实施例的配置可以使一条灯丝具有两段调光的效果。本实施例的配置可以使一条灯丝具有三段调光的效果。Referring to FIG. 66D, in the embodiment, the first positive electrode P1 and the second positive electrode of the LED filament 100 are electrically connected/short-circuited together, and are electrically connected to the first output end of the power module 518 (or The first positive output terminal 3 is electrically connected to the second output end of the power module 518 (or the second positive output end), and the first negative electrode N1 is electrically connected to the third output end of the power module 518 ( The second negative terminal N2 is electrically connected to the fourth output terminal (or the second negative output terminal) of the power module 518. In this configuration, since the first positive electrode P1 and the second positive electrode P2 can be regarded as the same end, the overall line connection relationship can be equivalent to the configuration of FIG. 65D, and the related control manners, functions, and effects can be referred to the description of FIG. 65D. The configuration of this embodiment can make one filament have two effects of dimming. The configuration of this embodiment can make a filament have a three-stage dimming effect.
请接着参照图66D，在本实施例中，LED灯丝100的第一正极P1电性连接至电源模块518的第一输出端(或称第一正输出端)，第二正极P2电性连接至电源模块518的第二输出端(或称第二正输出端)，第三正极P3电性连接至电源模块518的第三输出端(或称第三正输出端)，第一负极N1电性连接至电源模块518的第四输出端(或称第一负输出端)，并且第二负极N2电性连接至电源模块518的第五输出端(或称第二负输出端)。在此配置底 下，电源模块518的第一输出端和第四输出端之间会构成一个驱动电压V1输出，电源模块518的第一输出端和第五输出端之间会构成另一个驱动电压V2输出，电源模块518的第二输出端和第四输出端之间会构成另一个驱动电压V3输出，并且电源模块518的第三输出端和第五输出端之间会构成另一个驱动电压V4输出。搭配图66A来看，在图66E的电性连接关系下，LED段402是电性连接在第一输出端和第四输出端之间，LED段404是电性连接在第一输出端和第五输出端之间，LED段406是电性连接在第二输出端和第四输出端之间，并且LED段408是电性连接在第三输出端和第五输出端之间，因此LED段402、404、406和408可视为是分别受到驱动电压V1、V2、V3和V4所驱动。在此配置底下，电源模块518提供至LED段402至408的驱动电流可通过调变输出的驱动电压V1、V2、V3和V4大小来实现独立控制，进而使LED段402、404、406和408可分别具有对应的亮度和/或色温。本实施例的配置可以使一条灯丝具有四段调光的效果。Referring to FIG. 66D, in this embodiment, the first positive pole P1 of the LED filament 100 is electrically connected to the first output end (or the first positive output end) of the power module 518, and the second positive pole P2 is electrically connected to The second output terminal (or the second positive output terminal) of the power module 518 is electrically connected to the third output terminal (or the third positive output terminal) of the power module 518, and the first anode N1 is electrically connected. The fourth output terminal (or the first negative output terminal) of the power module 518 is electrically connected to the fifth output terminal (or the second negative output terminal) of the power module 518. Under this configuration, a driving voltage V1 is formed between the first output terminal and the fourth output terminal of the power module 518, and another driving voltage V2 is formed between the first output terminal and the fifth output terminal of the power module 518. The output, the second output end and the fourth output end of the power module 518 form another driving voltage V3 output, and another driving voltage V4 output is formed between the third output end and the fifth output end of the power module 518. . As shown in FIG. 66A, in the electrical connection relationship of FIG. 66E, the LED segment 402 is electrically connected between the first output end and the fourth output end, and the LED segment 404 is electrically connected to the first output end and the first Between the five output terminals, the LED segment 406 is electrically connected between the second output end and the fourth output end, and the LED segment 408 is electrically connected between the third output end and the fifth output end, so the LED segment 402, 404, 406, and 408 can be considered to be driven by drive voltages V1, V2, V3, and V4, respectively. Under this configuration, the drive current provided by the power module 518 to the LED segments 402-408 can be independently controlled by modulating the output drive voltages V1, V2, V3, and V4, thereby enabling the LED segments 402, 404, 406, and 408. There may be corresponding brightness and/or color temperature, respectively. The configuration of this embodiment can make a filament have a four-stage dimming effect.
上述实施例的说明，已经具体揭露通过组合两段、三段和四段LED段来实现一条灯丝的多段可调光配置。本领域的普通技术人员参照上述说明可轻易推知通过组合四段以上LED段来实现一条灯丝的多段调光的配置。The description of the above embodiments has specifically disclosed a multi-segment dimming configuration for a filament by combining two, three and four segments of LED segments. A person skilled in the art can easily infer the configuration of multi-stage dimming of one filament by combining four or more LED segments with reference to the above description.
以下说明本发明LED球泡灯中，关于驱动电路的相关设计。如图26A所示，驱动电路518是用以转换接收到的AC电源，并据以产生电力/驱动电源以点亮发光部100。以下说明即以“电源模块5200”代表驱动电路518。请参考图67，图67为根据发明一实施例的LED球泡灯的电源模块的电路方块示意图。电源模块5200包含整流电路5210、滤波电路5220及驱动电路5230。整流电路5210耦接第一接脚5201与第二接脚5202，以接收外部驱动信号Pin，并对外部驱动信号进行整流Pin，然后由第一整流输出端5211、第二整流输出端5212输出整流后信号Srec。在此的外部驱动信号可以是交流驱动信号或交流电源信号(例如电网信号)，甚至也可以为直流信号而不影响LED球泡灯的操作。当LED球泡灯是设计为基于直流信号点亮时，电源模块5200中的整流电路5210可被省略。在省略整流电路5210的配置下，第一接脚5201与第二接脚5202会直接耦接至滤波电路5220的输入端(即5211、5212)。The related design of the drive circuit in the LED bulb of the present invention will be described below. As shown in FIG. 26A, the driving circuit 518 is for converting the received AC power source, and accordingly generating a power/driving power source to illuminate the light emitting portion 100. In the following description, the "power module 5200" represents the drive circuit 518. Please refer to FIG. 67. FIG. 67 is a circuit block diagram of a power module of an LED bulb according to an embodiment of the invention. The power module 5200 includes a rectifier circuit 5210, a filter circuit 5220, and a drive circuit 5230. The rectifier circuit 5210 is coupled to the first pin 5201 and the second pin 5202 to receive the external driving signal Pin, and rectifies the external driving signal, and then is rectified by the first rectifying output terminal 5211 and the second rectifying output terminal 5212. After the signal Srec. The external drive signal here can be an AC drive signal or an AC power signal (such as a grid signal) or even a DC signal without affecting the operation of the LED bulb. When the LED bulb is designed to illuminate based on a DC signal, the rectifier circuit 5210 in the power module 5200 can be omitted. In the configuration in which the rectifier circuit 5210 is omitted, the first pin 5201 and the second pin 5202 are directly coupled to the input ends of the filter circuit 5220 (ie, 5211, 5212).
滤波电路5220与所述整流电路5210耦接，用以对整流后信号Srec进行滤波；即滤波电路5220的输入端耦接第一整流输出端5211与第二整流输出端5212，以接收整流后信号Srec，并对整流后信号Srec进行滤波，然后由第一滤波输出端5221、第二滤波输出端5222输出滤波后信号Sflr。其中，第一整流输出端5211可视为滤波电路5220的第一滤波输入端，并且第二整流输出端5212可视为滤波电路5220的第二滤波输入端。在本实施例中，滤波电路5220可滤除整流后信号Srec中的纹波，使得所产生的滤波后信号Sflr的波形较整流后信号Srec的波形更平滑。此外，滤波电路5220可透过选择电路配置以实现对特定频率进行滤波，以滤除外部驱动信号在特定频率的响应/能量。The filter circuit 5220 is coupled to the rectifier circuit 5210 for filtering the rectified signal Srec; that is, the input end of the filter circuit 5220 is coupled to the first rectified output terminal 5211 and the second rectified output terminal 5212 to receive the rectified signal. Srec, and filtering the rectified signal Srec, and then outputting the filtered signal Sflr by the first filter output terminal 5221 and the second filter output terminal 5222. The first rectified output terminal 5211 can be regarded as the first filter input end of the filter circuit 5220, and the second rectified output terminal 5212 can be regarded as the second filter input end of the filter circuit 5220. In this embodiment, the filter circuit 5220 can filter the ripple in the rectified signal Srec such that the waveform of the generated filtered signal Sflr is smoother than the waveform of the rectified signal Srec. In addition, the filter circuit 5220 can be configured to filter a particular frequency to filter out the response/energy of the external drive signal at a particular frequency.
驱动电路5230与滤波电路5220耦接，以接收滤波后信号Sflr并且对滤波后信号Sflr进行电源转换(power conversion)，进而产生驱动电源Sdrv；即驱动电路5230的输入端耦接第一滤波输出端5221与第二滤波输出端5222，以接收滤波后信号Sflr，然后产 生用以驱动LED发光部100(图26A)发光的驱动电源Sdrv。其中，第一滤波输出端5221可视为驱动电路5230的第一驱动输入端，并且第二滤波输出端5222可视为驱动电路5230的第二驱动输入端。驱动电路5230所产生的驱动电源Sdrv会透过第一驱动输出端5231与第二驱动输出端5232提供给LED发光部100，使得LED发光部100中的LED灯丝可响应于接收到的驱动电源Sdrv而点亮。底下实施例分别描述电源模块5200中的整流电路5210、滤波电路5220及驱动电路5230可能的实施态样，但本揭露不仅限于此。The driving circuit 5230 is coupled to the filtering circuit 5220 to receive the filtered signal Sflr and perform power conversion on the filtered signal Sflr to generate a driving power source Sdrv; that is, the input end of the driving circuit 5230 is coupled to the first filtering output end. The second filter output terminal 5222 is coupled to the second filter output terminal 5222 to receive the filtered signal Sflr, and then generates a driving power source Sdrv for driving the LED light emitting portion 100 (FIG. 26A) to emit light. The first filter output end 5221 can be regarded as the first drive input end of the drive circuit 5230, and the second filter output end 5222 can be regarded as the second drive input end of the drive circuit 5230. The driving power source Sdrv generated by the driving circuit 5230 is supplied to the LED light emitting portion 100 through the first driving output terminal 5231 and the second driving output terminal 5232, so that the LED filament in the LED light emitting portion 100 can respond to the received driving power source Sdrv. And light up. The following embodiments describe possible implementations of the rectifier circuit 5210, the filter circuit 5220, and the drive circuit 5230 in the power module 5200, but the disclosure is not limited thereto.
请参见图68A，图68A为根据本发明第一较佳实施例的整流电路的电路示意图。整流电路5310为桥式整流电路，包含整流二极管5311-5314，用以对所接收的信号进行全波整流。整流二极管5311的阳极耦接第二整流输出端5212，阴极耦接第二接脚5202。整流二极管5312的阳极耦接第二整流输出端5212，阴极耦接第一接脚5201。整流二极管5313的阳极耦接第二接脚5202，阴极耦接第一整流输出端5211。整流二极管5314的阳极耦接第一接脚5201，阴极耦接第一整流输出端5211。在本实施例中，所述整流二极管5311-5314可分别以第一整流二极管5311、第二整流二极管5312、第三整流二极管5313及第四整流二极管5314表示。Referring to FIG. 68A, FIG. 68A is a circuit diagram of a rectifier circuit according to a first preferred embodiment of the present invention. The rectifier circuit 5310 is a bridge rectifier circuit including rectifier diodes 5311-5314 for full-wave rectification of the received signal. The anode of the rectifier diode 5311 is coupled to the second rectified output terminal 5212, and the cathode is coupled to the second pin 5202. The anode of the rectifier diode 5312 is coupled to the second rectified output terminal 5212, and the cathode is coupled to the first pin 5201. The anode of the rectifier diode 5313 is coupled to the second pin 5202, and the cathode is coupled to the first rectified output terminal 5211. The anode of the rectifier diode 5314 is coupled to the first pin 5201, and the cathode is coupled to the first rectified output terminal 5211. In this embodiment, the rectifier diodes 5311-5314 can be represented by a first rectifier diode 5311, a second rectifier diode 5312, a third rectifier diode 5313, and a fourth rectifier diode 5314, respectively.
当第一接脚5201、第二接脚5202接收的信号为交流信号时，整流电路5310的操作描述如下。当交流信号处于正半周时，第一接脚5201上的电平会大于第二接脚5202上的电平。此时整流二极管5311与5314会工作在正偏状态而导通，并且整流二极管5312与5313会工作在逆偏状态而截止，进而在第一接脚5201与第二接脚5202之间形成回路。在正半周的电路组态下，交流信号所造成的输入电流会依序经第一接脚5201、整流二极管5314和第一整流输出端5211后流入后级负载，并依序经第二整流输出端5212、整流二极管5311和第二接脚5202后流出。当交流信号处于负半周时，第二接脚5202上的电平会大于第一接脚5201上的电平。此时整流二极管5312与5313会工作在正偏状态而导通，并且整流二极管5311与5314会工作在逆偏状态而截止，进而在第一接脚5201与第二接脚5202之间形成回路。在负半周的电路组态下，交流信号所造成的输入电流会依序经第二接脚5202、整流二极管5313和第一整流输出端5211后流入后级负载，并依序经第二整流输出端5212、整流二极管5312和第一接脚5201后流出。因此，不论交流信号处于正半波或负半波，整流电路5310的整流后信号Srec的正极均位于第一整流输出端5211，负极均位于第二整流输出端5212。依据上述操作说明，整流电路5210输出的整流后信号为全波整流信号。When the signals received by the first pin 5201 and the second pin 5202 are AC signals, the operation of the rectifier circuit 5310 is described as follows. When the AC signal is in the positive half cycle, the level on the first pin 5201 will be greater than the level on the second pin 5202. At this time, the rectifier diodes 5311 and 5314 will operate in a forward-biased state to be turned on, and the rectifier diodes 5312 and 5313 will operate in a reverse bias state to be turned off, thereby forming a loop between the first pin 5201 and the second pin 5202. In the circuit configuration of the positive half cycle, the input current caused by the AC signal will flow through the first pin 5201, the rectifier diode 5314 and the first rectified output terminal 5211, and then flow into the subsequent load, and sequentially through the second rectified output. The terminal 5212, the rectifier diode 5311 and the second pin 5202 flow out. When the AC signal is in the negative half cycle, the level on the second pin 5202 will be greater than the level on the first pin 5201. At this time, the rectifier diodes 5312 and 5313 operate in a forward-biased state and are turned on, and the rectifier diodes 5311 and 5314 operate in a reverse bias state to be turned off, thereby forming a loop between the first pin 5201 and the second pin 5202. In the negative half cycle circuit configuration, the input current caused by the AC signal will flow through the second pin 5202, the rectifier diode 5313 and the first rectified output terminal 5211, and then flow into the subsequent load, and sequentially through the second rectified output. The terminal 5212, the rectifier diode 5312 and the first pin 5201 flow out. Therefore, regardless of whether the AC signal is in the positive half wave or the negative half wave, the positive pole of the rectified signal Srec of the rectifying circuit 5310 is located at the first rectifying output terminal 5211, and the negative pole is located at the second rectifying output terminal 5212. According to the above operation description, the rectified signal output from the rectifier circuit 5210 is a full-wave rectified signal.
当第一接脚5201、第二接脚5202耦接直流电源而接收直流信号时，整流电路5310的操作描述如下。当第一接脚5201耦接直流电源的正端而第二接脚5202耦接直流电源的负端时，整流二极管5311与5314会工作在正偏状态而导通，并且整流二极管5312与5313会工作在逆偏状态而截止，进而在第一接脚5201与第二接脚5202之间形成回路。此时整流电路5310的电路组态及操作与整流电路5310处于交流信号的正半周的状态相同。当第一接脚5201耦接直流电源的负端而第二接脚5202耦接直流电源的正端时，整流二极管5312与5313会工作在正偏状态而导通，并且整流二极管5311与5314会工作在逆偏状态而截止，进而在 第一接脚5201与第二接脚5202之间形成回路。此时整流电路5310的电路组态及操作与整流电路5310处于交流信号的负半周的状态相同。When the first pin 5201 and the second pin 5202 are coupled to the DC power source to receive the DC signal, the operation of the rectifier circuit 5310 is described as follows. When the first pin 5201 is coupled to the positive terminal of the DC power supply and the second pin 5202 is coupled to the negative terminal of the DC power supply, the rectifier diodes 5311 and 5314 will operate in a forward biased state and conduct, and the rectifier diodes 5312 and 5313 will The operation is turned off in the reverse bias state, and a loop is formed between the first pin 5201 and the second pin 5202. At this time, the circuit configuration and operation of the rectifier circuit 5310 are the same as the state in which the rectifier circuit 5310 is in the positive half cycle of the AC signal. When the first pin 5201 is coupled to the negative terminal of the DC power supply and the second pin 5202 is coupled to the positive terminal of the DC power supply, the rectifier diodes 5312 and 5313 will operate in a forward biased state and conduct, and the rectifier diodes 5311 and 5314 will The operation is turned off in the reverse bias state, and a loop is formed between the first pin 5201 and the second pin 5202. At this time, the circuit configuration and operation of the rectifier circuit 5310 are the same as the state in which the rectifier circuit 5310 is in the negative half cycle of the AC signal.
由上述说明可知，本实施例的整流电路5310不论所接收的信号为交流信号或直流信号，均可正确输出整流后信号Srec。As apparent from the above description, the rectifier circuit 5310 of the present embodiment can correctly output the rectified signal Srec regardless of whether the received signal is an AC signal or a DC signal.
除此之外，在一些实施例中，整流电路5310的输入端之间还可设有电容Cx。所述电容Cx的电容值可例如是47nF，其可用以改善电源模块5200中的电磁干扰效应。In addition, in some embodiments, a capacitance Cx may also be provided between the input terminals of the rectifier circuit 5310. The capacitance value of the capacitor Cx can be, for example, 47 nF, which can be used to improve the electromagnetic interference effect in the power module 5200.
请参见图68B，图68B为根据本发明第二较佳实施例的整流电路的电路示意图。整流电路5410包含整流二极管5411及5412，用以对所接收的信号进行半波整流。整流二极管5411的阳极耦接第二接脚5202，阴极耦接第一整流输出端5211。整流二极管5412的阳极耦接第一整流输出端5211，阴极耦接第一接脚5201。第二整流输出端5212视实际应用而可以省略或者接地。在本实施例中，所述整流二极管5411-5412可分别以第一整流二极管5411和第二整流二极管5412表示。Referring to FIG. 68B, FIG. 68B is a circuit diagram of a rectifier circuit according to a second preferred embodiment of the present invention. The rectifier circuit 5410 includes rectifier diodes 5411 and 5412 for half-wave rectifying the received signal. The anode of the rectifier diode 5411 is coupled to the second pin 5202, and the cathode is coupled to the first rectified output terminal 5211. The anode of the rectifier diode 5412 is coupled to the first rectified output terminal 5211, and the cathode is coupled to the first pin 5201. The second rectified output 5212 can be omitted or grounded depending on the actual application. In this embodiment, the rectifier diodes 5411-5412 can be represented by a first rectifier diode 5411 and a second rectifier diode 5412, respectively.
接着同样将操作情境区分为接收到的信号为交流信号和直流信号的情况来说明整流电路5410的操作。Next, the operation of the rectifying circuit 5410 will be described by dividing the operating situation into the case where the received signal is an alternating current signal and a direct current signal.
当第一接脚5201、第二接脚5202接收的信号为交流信号时，整流电路5410的操作描述如下。当交流信号处于正半周时，交流信号在第一接脚5201输入的信号电平高于在第二接脚5202输入的信号电平。此时，整流二极管5411及5412均处于逆偏的截止状态，整流电路5410停止输出整流后信号Srec(或可称整流电路5410所输出的整流后信号Srec此时为零)。当交流信号处于负半周时，交流信号在第一接脚5201输入的信号电平低于在第二接脚5202输入的信号电平。此时，整流二极管5411及5412均处于正偏的导通状态，交流信号经由整流二极管5411、第一整流输出端5211而流入后级负载，并由第二整流输出端5212或LED球泡灯的另一电路或接地端流出。依据上述操作说明，整流电路5410输出的整流后信号为半波整流信号。When the signals received by the first pin 5201 and the second pin 5202 are AC signals, the operation of the rectifier circuit 5410 is described as follows. When the AC signal is in the positive half cycle, the signal level at which the AC signal is input at the first pin 5201 is higher than the signal level input at the second pin 5202. At this time, the rectifier diodes 5411 and 5412 are both in the reverse biased state, and the rectifier circuit 5410 stops outputting the rectified signal Srec (or the rectified signal Srec outputted by the rectifier circuit 5410 is zero at this time). When the AC signal is in the negative half cycle, the signal level of the AC signal input at the first pin 5201 is lower than the signal level input at the second pin 5202. At this time, the rectifier diodes 5411 and 5412 are both in a forward-biased conduction state, and the AC signal flows into the rear-stage load via the rectifier diode 5411 and the first rectification output terminal 5211, and is output by the second rectification output terminal 5212 or the LED bulb lamp. Another circuit or ground is flowing out. According to the above operation description, the rectified signal output from the rectifier circuit 5410 is a half-wave rectified signal.
当第一接脚5201、第二接脚5202耦接直流电源而接收直流信号时，整流电路5410的操作描述如下。当第一接脚5201耦接直流电源的正端而第二接脚5202耦接直流电源的负端时，整流二极管5411及5412均处于逆偏的截止状态，整流电路5410停止输出整流后信号Srec。当第一接脚5201耦接直流电源的负端而第二接脚5202耦接直流电源的正端时，整流二极管5411及5412均处于正偏的导通状态，进而形成回路。此时整流电路5410的电路组态及操作与整流电路5410处于交流信号的负半周的状态相同。由此可知，在本实施例中，若直流电源以正端接在第二接脚5202并且负端接在第一接脚5201的情形下，整流电路5410仍可正常工作。When the first pin 5201 and the second pin 5202 are coupled to the DC power source to receive the DC signal, the operation of the rectifier circuit 5410 is described as follows. When the first pin 5201 is coupled to the positive terminal of the DC power supply and the second pin 5202 is coupled to the negative terminal of the DC power supply, the rectifier diodes 5411 and 5412 are both in the reverse biased state, and the rectifier circuit 5410 stops outputting the rectified signal. . When the first pin 5201 is coupled to the negative terminal of the DC power supply and the second pin 5202 is coupled to the positive terminal of the DC power supply, the rectifier diodes 5411 and 5412 are both in a forward biased state, thereby forming a loop. At this time, the circuit configuration and operation of the rectifier circuit 5410 are the same as the state in which the rectifier circuit 5410 is in the negative half cycle of the AC signal. Therefore, in the present embodiment, if the DC power source is connected to the second pin 5202 at the positive terminal and the negative terminal is connected to the first pin 5201, the rectifier circuit 5410 can still operate normally.
请参见图69A，图69A为根据本发明第一较佳实施例的滤波电路的电路示意图。滤波电路5320包含电感5321、电阻5322和5323以及电容5324和5325。电感5321的第一端耦接第一整流输出端5211，电感5321的第二端耦接第一滤波输出端5221；亦即，电感5321串接在第一整流输出端5211与第一滤波输出端5221之间。电阻5322的第一端耦接第一整流 输出端5211和电感5321的第一端，电阻5322的第二端耦接第一滤波输出端5221和电感5321的第二端；亦即，电阻5322与电感5321相互并联。电阻5323的第一端耦接电感5321的第二端及第一滤波输出端5221。电容5324的第一端耦接电感5321的第二端及第一滤波输出端5221，电容5324的第二端耦接第二整流输出端5212与第二滤波输出端5222，其中第二整流输出端5212与第二滤波输出端5222可视为同一端，并且可视为接地端GND。电容5325的第一端耦接电阻5323第二端，电容5325的第二端耦接第二整流输出端5212与第二滤波输出端5222。在本实施例的滤波电路5320的配置中，其可对整流后信号Srec进行低通滤波，以滤除整流后信号Srec中的高频成分而形成滤波后信号Sflr，然后由第一滤波输出端5221及第二滤波输出端5222输出。Referring to FIG. 69A, FIG. 69A is a circuit diagram of a filter circuit according to a first preferred embodiment of the present invention. The filter circuit 5320 includes an inductor 5321, resistors 5322 and 5323, and capacitors 5324 and 5325. The first end of the inductor 5321 is coupled to the first rectified output end 5211, and the second end of the inductor 5321 is coupled to the first filter output end 5221; that is, the inductor 5321 is connected in series to the first rectified output end 5211 and the first filtered output end. Between 5221. The first end of the resistor 5322 is coupled to the first rectified output end 5211 and the first end of the inductor 5321, and the second end of the resistor 5322 is coupled to the first filter output end 5221 and the second end of the inductor 5321; that is, the resistor 5322 and The inductors 5321 are connected in parallel with each other. The first end of the resistor 5323 is coupled to the second end of the inductor 5321 and the first filter output end 5221. The first end of the capacitor 5324 is coupled to the second end of the inductor 5321 and the first filter output end 5221. The second end of the capacitor 5324 is coupled to the second rectified output end 5212 and the second filtered output end 5222, wherein the second rectified output end The 5212 and the second filter output 5222 can be regarded as the same end and can be regarded as the ground GND. The first end of the capacitor 5325 is coupled to the second end of the resistor 5323, and the second end of the capacitor 5325 is coupled to the second rectified output end 5212 and the second filtered output end 5222. In the configuration of the filter circuit 5320 of the embodiment, the low-pass filtering of the rectified signal Srec may be performed to filter the high-frequency component of the rectified signal Srec to form a filtered signal Sflr, and then the first filter output end The 5221 and the second filter output 5222 are output.
请参见图69B，图69B为根据本发明第二较佳实施例的滤波电路的电路示意图。滤波电路5420为π型滤波电路，包含电感5421、电容5422-5424及电阻5425和5426。电感5421的第一端耦接第一整流输出端5211，电感5421的第二端耦接第一滤波输出端5221；亦即，电感5421串接在第一整流输出端5211与第一滤波输出端5221之间。电容5422的第一端耦接第一整流输出端5211及电感5421的第一端，电容5422的第二端耦接第二整流输出端5212及第二滤波输出端5222；亦即，电容5422的第一端通过电感5421耦接第一滤波输出端5221。电容5423的第一端耦接第一滤波输出端5221及电感5421的第二端，电容5423的第二端耦接第二整流输出端5212及第二滤波输出端5222；亦即，电容5423的第一端通过电感5421耦接第一整流输出端5211。电容5424的第一端耦接第一滤波输出端5221及电感5421的第二端。电阻5425及5426的第一端耦接电容5424的第二端，电阻5425及5426的第二端耦接第二整流输出端5212及第二滤波输出端5222。Referring to FIG. 69B, FIG. 69B is a circuit diagram of a filter circuit according to a second preferred embodiment of the present invention. The filter circuit 5420 is a π-type filter circuit, and includes an inductor 5421, capacitors 5422-5424, and resistors 5425 and 5426. The first end of the inductor 5421 is coupled to the first rectified output end 5211, and the second end of the inductor 5421 is coupled to the first filter output end 5221; that is, the inductor 5421 is serially connected to the first rectified output end 5211 and the first filtered output end. Between 5221. The first end of the capacitor 5422 is coupled to the first rectified output end 5211 and the first end of the inductor 5421. The second end of the capacitor 5422 is coupled to the second rectified output end 5212 and the second filtered output end 5222; that is, the capacitor 5422 The first end is coupled to the first filter output end 5221 through the inductor 5421. The first end of the capacitor 5423 is coupled to the first filter output terminal 5221 and the second end of the inductor 5421. The second end of the capacitor 5423 is coupled to the second rectified output terminal 5212 and the second filter output terminal 5222; that is, the capacitor 5423 The first end is coupled to the first rectified output end 5211 through the inductor 5421. The first end of the capacitor 5424 is coupled to the first filter output end 5221 and the second end of the inductor 5421. The first ends of the resistors 5425 and 5426 are coupled to the second end of the capacitor 5424, and the second ends of the resistors 5425 and 5426 are coupled to the second rectified output terminal 5212 and the second filter output terminal 5222.
等效上来看，滤波电路5420中的电感5421及电容5423的配置类似于滤波电路5320中的电感5321及电容5324。滤波电路5420较图69A所示的滤波电路5320多了电容5422，其中电容5422也同电感5421及电容5423般，具有低通滤波作用。故，本实施例的滤波电路5420相较于图69A所示的滤波电路5320，具有更佳的高频滤除能力，所输出的滤波后信号Sflr的波形更为平滑。Equivalently, the configuration of the inductor 5421 and the capacitor 5423 in the filter circuit 5420 is similar to the inductor 5321 and the capacitor 5324 in the filter circuit 5320. The filter circuit 5420 has a capacitor 5422 more than the filter circuit 5320 shown in FIG. 69A. The capacitor 5422 has the same low-pass filtering effect as the inductor 5421 and the capacitor 5423. Therefore, the filter circuit 5420 of the present embodiment has better high-frequency filtering capability than the filter circuit 5320 shown in FIG. 69A, and the waveform of the output filtered signal Sflr is smoother.
上述实施例中的电感5321、5421的感值较佳为选自10nH～10mH的范围。电容5324、5325、5422、423、5424的容值较佳为选自100pF～1uF的范围。The inductance of the inductors 5321 and 5421 in the above embodiment is preferably selected from the range of 10 nH to 10 mH. The capacitance values of the capacitors 5324, 5325, 5422, 423, and 5424 are preferably selected from the range of 100 pF to 1 uF.
请参见图70，图70为根据本发明较佳实施例的驱动电路的电路方块示意图。驱动电路5330包含切换控制电路5331及转换电路5332，以电流源的模式进行电力转换，以驱动LED发光部发光。转换电路5332包含开关电路(也可称为功率开关)PSW以及储能电路ESE。转换电路5332耦接第一滤波输出端5221及第二滤波输出端5222，接收滤波后信号Sflr，并根据切换控制电路5331的控制，将滤波后信号Sflr转换成驱动电源Sdrv而由第一驱动输出端5231及第二驱动输出端5232输出，以驱动LED发光部100。在切换控制电路5331的控制下，转换电路5332所输出的驱动电源为稳定电流，而使LED发光部稳定发光。除此之外，驱动电路5330还可包含有偏压电路5333，所述偏压电路5333可基于电源模块的母线电压产生 工作电压Vcc，并且工作电压Vcc提供给切换控制电路5331使用，使切换控制电路5331可因应工作电压而启动并进行运作。Referring to FIG. 70, FIG. 70 is a circuit block diagram of a driving circuit according to a preferred embodiment of the present invention. The drive circuit 5330 includes a switching control circuit 5331 and a conversion circuit 5332, and performs power conversion in a mode of a current source to drive the LED light-emitting portion to emit light. The conversion circuit 5332 includes a switching circuit (also referred to as a power switch) PSW and a tank circuit ESE. The conversion circuit 5332 is coupled to the first filter output terminal 5221 and the second filter output terminal 5222, receives the filtered signal Sflr, and converts the filtered signal Sflr into a driving power source Sdrv and is output by the first driver according to the control of the switching control circuit 5331. The terminal 5231 and the second driving output terminal 5232 are output to drive the LED light emitting portion 100. Under the control of the switching control circuit 5331, the driving power output from the conversion circuit 5332 is a steady current, and the LED light emitting portion is stably illuminated. In addition, the driving circuit 5330 may further include a bias circuit 5333, which may generate an operating voltage Vcc based on a bus voltage of the power module, and the operating voltage Vcc is supplied to the switching control circuit 5331 for switching control Circuit 5331 can be activated and operated in response to the operating voltage.
底下搭配图71A至图71D的信号波形来进一步说明驱动电路5330的运作。其中，图71A至图71D为根据本发明不同实施例的驱动电路5330的信号波形示意图。图71A与图71B是绘示驱动电路5330操作在连续导通模式(Continuous-Conduction Mode，CCM)的信号波形与控制情境，并且图71C与图71D是绘示驱动电路5330操作在不连续导通模式(Discontinuous-Conduction Mode，DCM)的信号波形与控制情境。在信号波形图中，横轴的t代表时间，纵轴则是代表电压或电流值(视信号类型而定)。The operation of the driving circuit 5330 is further explained below with the signal waveforms of FIGS. 71A to 71D. 71A to 71D are schematic diagrams of signal waveforms of the driving circuit 5330 according to various embodiments of the present invention. 71A and 71B illustrate signal waveforms and control scenarios in which the drive circuit 5330 operates in a Continuous-Conduction Mode (CCM), and FIGS. 71C and 71D illustrate the operation of the drive circuit 5330 in discontinuous conduction. Signal waveform and control context of the mode (Discontinuous-Conduction Mode, DCM). In the signal waveform diagram, t on the horizontal axis represents time, and the vertical axis represents voltage or current value (depending on the type of signal).
本实施例的切换控制电路5331会根据当前LED发光部的工作状态来实时地调整所输出的点亮控制信号Slc的占空比(Duty Cycle)，使得开关电路PSW反应于点亮控制信号Slc而导通或截止。其中，切换控制电路5331可通过侦测输入电压(可为第一接脚5201/第二接脚5202上的电平、第一整流输出端5211上的电平或第一滤波输出端5221上的电平)、输出电压(可为第一驱动输出端5231上的电平)、输入电流(可为母线电流，亦即流经整流输出端5211/5212、滤波输出端5221/5222的电流)及输出电流(可为流经驱动输出端5231/5232的电流或流经开关电路PSW的电流)至少其中一者或多者来判断当前LED发光部的工作状态。储能电路ESE会根据开关电路PSW导通/截止的状态而反复充/放能，进而令LED发光部接收到的驱动电流ILED可以被稳定地维持在一预设电流值Ipred上。点亮控制信号Slc会具有固定的信号周期Tlc与信号振幅，而每个信号周期Tlc内的脉冲使能期间(如Ton1、Ton2、Ton3，或称脉冲宽度)的长度则会根据控制需求而调整。其中，点亮控制信号Slc的占空比即是脉冲使能期间与信号周期Tlc的比例。举例来说，若脉冲使能期间Ton1为信号周期Tlc的40％，即表示点亮控制信号在第一个信号周期Tlc下的占空比为0.4。The switching control circuit 5331 of the present embodiment adjusts the duty ratio (Duty Cycle) of the output lighting control signal Slc in real time according to the operating state of the current LED lighting unit, so that the switching circuit PSW reacts to the lighting control signal Slc. Turn on or off. The switching control circuit 5331 can detect the input voltage (which can be the level on the first pin 5201 / the second pin 5202, the level on the first rectified output terminal 5211 or the first filter output terminal 5221. Level), output voltage (which can be the level on the first drive output 5231), input current (which can be the bus current, that is, the current flowing through the rectified output 5211/5212, the filtered output 5221/5222) and At least one or more of the output current (which may be the current flowing through the drive output 5231/5232 or the current flowing through the switch circuit PSW) determines the operating state of the current LED lighting portion. The storage circuit ESE repeatedly charges/discharges according to the state in which the switching circuit PSW is turned on/off, so that the driving current ILED received by the LED light-emitting portion can be stably maintained at a preset current value Ipred. The lighting control signal Slc will have a fixed signal period Tlc and signal amplitude, and the length of the pulse enable period (such as Ton1, Ton2, Ton3, or pulse width) in each signal period Tlc will be adjusted according to control requirements. . The duty ratio of the lighting control signal Slc is the ratio of the pulse enable period to the signal period Tlc. For example, if the pulse enable period Ton1 is 40% of the signal period Tlc, it means that the duty ratio of the lighting control signal at the first signal period Tlc is 0.4.
请先同时参照图70与图71A，图71A绘示在驱动电流ILED小于预设电流值Ipred的情况下，驱动电路5330在多个信号周期Tlc下的信号波形变化。具体而言，在第一个信号周期Tlc中，开关电路PSW会反应于高电平的点亮控制信号Slc而在脉冲使能期间Ton1内导通。此时，转换电路5332除了会根据从第一滤波输出端5221及第二滤波输出端5222接收到的输入电源产生驱动电流ILED提供给LED发光部100之外，还会经由导通的开关电路PSW对储能电路ESE充电，使得流经储能电路ESE的电流IL逐渐上升。换言之，在脉冲使能期间Ton1内，储能电路ESE会反应于从第一滤波输出端5221及第二滤波输出端5222接收到的输入电源而储能。Referring to FIG. 70 and FIG. 71A simultaneously, FIG. 71A illustrates a signal waveform change of the driving circuit 5330 under a plurality of signal periods Tlc in a case where the driving current ILED is smaller than the preset current value Ipred. Specifically, in the first signal period Tlc, the switching circuit PSW is turned on in the pulse enable period Ton1 in response to the high-level lighting control signal Slc. At this time, the conversion circuit 5332 generates a driving current ILED according to the input power source received from the first filter output terminal 5221 and the second filter output terminal 5222, and supplies the driving current ILED to the LED light emitting portion 100, and also via the turned-on switching circuit PSW. The storage circuit ESE is charged such that the current IL flowing through the storage circuit ESE gradually rises. In other words, during the pulse enable period Ton1, the tank circuit ESE stores energy in response to the input power received from the first filter output terminal 5221 and the second filter output terminal 5222.
接着，在脉冲使能期间Ton1结束后，开关电路PSW会反应于低电平的点亮控制信号Slc截止。在开关电路PSW截止的期间内，第一滤波输出端5221及第二滤波输出端5222上的输入电源不会被提供至LED发光部，而是由储能电路ESE进行放电以产生驱动电流ILED提供给LED发光部，其中储能电路ESE会因为释放电能而使电流IL逐渐降低。因此，即使当点亮控制信号Slc位于低电平(即，禁能期间)时，驱动电路5330还是会基于储能电路ESE的释能而持续供电给LED发光部。换言之，无论开关电路PSW导通与否，驱动电路5330都会 持续地提供稳定的驱动电流ILED给LED发光部，并且所述驱动电流ILED在第一个信号周期Tlc内电流值的约为I1。Next, after the pulse enable period Ton1 ends, the switching circuit PSW turns off the lighting control signal Slc that is low level. During the period when the switching circuit PSW is turned off, the input power on the first filter output terminal 5221 and the second filter output terminal 5222 is not supplied to the LED light emitting portion, but is discharged by the storage circuit ESE to generate the driving current ILED. For the LED lighting portion, the energy storage circuit ESE gradually reduces the current IL due to the release of electrical energy. Therefore, even when the lighting control signal Slc is at a low level (ie, during the disable period), the driving circuit 5330 continues to supply power to the LED lighting portion based on the energy release of the storage circuit ESE. In other words, regardless of whether the switching circuit PSW is turned on or not, the driving circuit 5330 continuously supplies a stable driving current ILED to the LED light emitting portion, and the driving current ILED has a current value of about I1 in the first signal period Tlc.
在第一个信号周期Tlc内，切换控制电路5331会根据指示LED发光部的工作状态的一电流侦测信号判定驱动电流ILED的电流值I1小于预设电流值Ipred，因此在进入第二个信号周期Tlc时将点亮控制信号Slc的脉冲使能期间调整为Ton2，其中脉冲使能期间Ton2为脉冲使能期间Ton1加上单位期间t1。In the first signal period Tlc, the switching control circuit 5331 determines that the current value I1 of the driving current ILED is smaller than the preset current value Ipred according to a current detecting signal indicating the operating state of the LED light emitting portion, and thus enters the second signal. At the period Tlc, the pulse enable period of the lighting control signal Slc is adjusted to Ton2, wherein the pulse enable period Ton2 is the pulse enable period Ton1 plus the unit period t1.
在第二个信号周期Tlc内，开关电路PSW与储能电路ESE的运作与前一信号周期Tlc类似。两者间的主要差异在于，由于脉冲使能期间Ton2较脉冲使能期间Ton1长，所以储能电路ESE会有更长的充电时间，并且放电时间亦相对较短，使得驱动电路5330在第二个信号周期Tlc内所提供的驱动电流ILED的平均值会提高至更接近预设电流值Ipred的电流值I2。In the second signal period Tlc, the operation of the switching circuit PSW and the tank circuit ESE is similar to the previous signal period Tlc. The main difference between the two is that since the pulse enable period Ton2 is longer than the pulse enable period Ton1, the tank circuit ESE has a longer charging time, and the discharge time is also relatively short, so that the drive circuit 5330 is in the second. The average value of the drive current ILED provided in the signal period Tlc is increased to a current value I2 closer to the preset current value Ipred.
类似地，由于此时驱动电流ILED的电流值I2仍小于预设电流值Ipred，因此在第三个信号周期Tlc内，切换控制电路5331会进一步的将点亮控制信号Slc的脉冲使能期间调整为Ton3，其中脉冲使能期间Ton3为脉冲使能期间Ton2加上单位期间t1，等于脉冲使能期间Ton1加上期间t2(相当于两个单位期间t1)。在第三个信号周期Tlc内，开关电路PSW与储能电路ESE的运作与前两信号周期Tlc类似。由于脉冲使能期间Ton3更进一步延长，因此使得驱动电流ILED的电流值上升至I3，并且大致上达到预设电流值Ipred。其后，由于驱动电流ILED的电流值I3已达到预设电流值Ipred，因此切换控制电路5331会维持相同的占空比，使得驱动电流ILED可被持续维持在预设电流值Ipred。Similarly, since the current value I2 of the driving current ILED is still less than the preset current value Ipred, the switching control circuit 5331 further adjusts the pulse enable period of the lighting control signal Slc during the third signal period Tlc. It is Ton3, in which the pulse enable period Ton3 is the pulse enable period Ton2 plus the unit period t1, which is equal to the pulse enable period Ton1 plus the period t2 (corresponding to two unit periods t1). In the third signal period Tlc, the operation of the switching circuit PSW and the tank circuit ESE is similar to the first two signal periods Tlc. Since the pulse enable period Ton3 is further extended, the current value of the drive current ILED is raised to I3, and substantially reaches the preset current value Ipred. Thereafter, since the current value I3 of the driving current ILED has reached the preset current value Ipred, the switching control circuit 5331 maintains the same duty ratio so that the driving current ILED can be continuously maintained at the preset current value Ipred.
请再同时参照图70与图71B，图71B绘示在驱动电流ILED大于预设电流值Ipred的情况下，驱动电路5330在多个信号周期Tlc下的信号波形变化。具体而言，在第一个信号周期Tlc中，开关电路PSW会反应于高电平的点亮控制信号Slc而在脉冲使能期间Ton1内导通。此时，转换电路5332除了会根据从第一滤波输出端5221及第二滤波输出端5222接收到的输入电源产生驱动电流ILED提供给LED发光部100之外，还会经由导通的开关电路PSW对储能电路ESE充电，使得流经储能电路ESE的电流IL逐渐上升。换言之，在脉冲使能期间Ton1内，储能电路ESE会反应于从第一滤波输出端5221及第二滤波输出端5222接收到的输入电源而储能。Referring to FIG. 70 and FIG. 71B at the same time, FIG. 71B illustrates a signal waveform change of the driving circuit 5330 under a plurality of signal periods Tlc in a case where the driving current ILED is greater than the preset current value Ipred. Specifically, in the first signal period Tlc, the switching circuit PSW is turned on in the pulse enable period Ton1 in response to the high-level lighting control signal Slc. At this time, the conversion circuit 5332 generates a driving current ILED according to the input power source received from the first filter output terminal 5221 and the second filter output terminal 5222, and supplies the driving current ILED to the LED light emitting portion 100, and also via the turned-on switching circuit PSW. The storage circuit ESE is charged such that the current IL flowing through the storage circuit ESE gradually rises. In other words, during the pulse enable period Ton1, the tank circuit ESE stores energy in response to the input power received from the first filter output terminal 5221 and the second filter output terminal 5222.
接着，在脉冲使能期间Ton1结束后，开关电路PSW会反应于低电压准位的点亮控制信号Slc截止。在开关电路PSW截止的期间内，第一滤波输出端5221及第二滤波输出端5222上的输入电源不会被提供至LED发光部100，而是由储能电路ESE进行放电以产生驱动电流ILED提供给LED发光部100，其中储能电路ESE会因为释放电能而使电流IL逐渐降低。因此，即使当点亮控制信号Slc位于低电压准位(即，禁能期间)时，驱动电路5330还是会基于储能电路ESE的释能而持续供电给LED发光部100。换言之，无论开关电路PSW导通与否，驱动电路5330都会持续地提供稳定的驱动电流ILED给LED发光部100，并且所述驱动电流ILED在第一个信号周期Tlc内电流值的约为I4。Next, after the pulse enable period Ton1 ends, the switching circuit PSW turns off the lighting control signal Slc which is reflected at the low voltage level. During the period when the switching circuit PSW is turned off, the input power on the first filter output terminal 5221 and the second filter output terminal 5222 is not supplied to the LED light emitting portion 100, but is discharged by the storage circuit ESE to generate the driving current ILED. Provided to the LED lighting portion 100, wherein the energy storage circuit ESE gradually reduces the current IL due to the release of electrical energy. Therefore, even when the lighting control signal Slc is at the low voltage level (ie, during the disable period), the driving circuit 5330 continues to supply power to the LED lighting portion 100 based on the release of the energy storage circuit ESE. In other words, regardless of whether the switching circuit PSW is turned on or not, the driving circuit 5330 continuously supplies a stable driving current ILED to the LED lighting portion 100, and the driving current ILED has a current value of about I4 in the first signal period Tlc.
在第一个信号周期Tlc内，切换控制电路5331会根据电流侦测信号Sdet判定驱动电流ILED的电流值I4大于预设电流值Ipred，因此在进入第二个信号周期Tlc时将点亮控制信号Slc的脉冲使能期间调整为Ton2，其中脉冲使能期间Ton2为脉冲使能期间Ton1减去单位期间t1。During the first signal period Tlc, the switching control circuit 5331 determines that the current value I4 of the driving current ILED is greater than the preset current value Ipred according to the current detecting signal Sdet, so that the control signal will be illuminated when entering the second signal period Tlc. The pulse enable period of Slc is adjusted to Ton2, wherein the pulse enable period Ton2 is the pulse enable period Ton1 minus the unit period t1.
在第二个信号周期Tlc内，开关电路PSW与储能电路ESE的运作与前一信号周期Tlc类似。两者间的主要差异在于，由于脉冲使能期间Ton2较脉冲使能期间Ton1短，所以储能电路ESE会有较短的充电时间，并且放电时间亦相对较长，使得驱动电路5330在第二个信号周期Tlc内所提供的驱动电流ILED的平均值会降低至更接近预设电流值Ipred的电流值I5。In the second signal period Tlc, the operation of the switching circuit PSW and the tank circuit ESE is similar to the previous signal period Tlc. The main difference between the two is that since the pulse enable period Ton2 is shorter than the pulse enable period Ton1, the storage circuit ESE has a shorter charging time and the discharge time is relatively longer, so that the drive circuit 5330 is in the second. The average value of the drive current ILED provided in the signal period Tlc is lowered to a current value I5 closer to the preset current value Ipred.
类似地，由于此时驱动电流ILED的电流值I5仍大于预设电流值Ipred，因此在第三个信号周期Tpwm内，切换控制电路5331会进一步的将点亮控制信号Slc的脉冲使能期间调整为Ton3，其中脉冲使能期间Ton3为脉冲使能期间Ton2减去单位期间t1，等于脉冲使能期间Ton1减去期间t2(相当于两个单位期间t1)。在第三个信号周期Tlc内，开关电路PSW与储能电路ESE的运作与前两信号周期Tlc类似。由于脉冲使能期间Ton3更进一步缩短，因此使得驱动电流ILED的电流值降至I6，并且大致上达到预设电流值Ipred。其后，由于驱动电流ILED的电流值I6已达到预设电流值Ipred，因此切换控制电路5331会维持相同的占空比，使得驱动电流ILED可被持续维持在预设电流值Ipred。Similarly, since the current value I5 of the driving current ILED is still greater than the preset current value Ipred, the switching control circuit 5331 further adjusts the pulse enable period of the lighting control signal Slc during the third signal period Tpwm. It is Ton3, in which the pulse enable period Ton3 is the pulse enable period Ton2 minus the unit period t1, which is equal to the pulse enable period Ton1 minus the period t2 (corresponding to two unit periods t1). In the third signal period Tlc, the operation of the switching circuit PSW and the tank circuit ESE is similar to the first two signal periods Tlc. Since the pulse enable period Ton3 is further shortened, the current value of the drive current ILED is lowered to I6, and substantially reaches the preset current value Ipred. Thereafter, since the current value I6 of the driving current ILED has reached the preset current value Ipred, the switching control circuit 5331 maintains the same duty ratio so that the driving current ILED can be continuously maintained at the preset current value Ipred.
由上述可知，驱动电路5330会步阶式的调整点亮控制信号Slc的脉冲宽度，以使驱动电流ILED在低于或高于预设电流值Ipred时被逐步地调整至趋近于预设电流值Ipred，进而实现定电流输出。As can be seen from the above, the driving circuit 5330 adjusts the pulse width of the lighting control signal Slc step by step so that the driving current ILED is gradually adjusted to be close to the preset current when the driving current ILED is lower or higher than the preset current value Ipred. The value Ipred, in turn, achieves a constant current output.
此外，在本实施例中，驱动电路5330是以操作在连续导通模式为例，亦即储能电路ESE在开关电路PSW截止期间内不会放电至电流IL为零。藉由操作在连续导通模式的驱动电路5330为LED灯丝模块供电，可以使提供给LED灯丝模块的电源较为稳定，不易产生纹波。Further, in the present embodiment, the driving circuit 5330 is exemplified by operating in the continuous conduction mode, that is, the storage circuit ESE is not discharged until the current IL is zero during the off period of the switching circuit PSW. By operating the driving circuit 5330 in the continuous conduction mode to supply power to the LED filament module, the power supply to the LED filament module can be stabilized and ripple is less likely to occur.
接下来说明驱动电路5330操作在不连续导通模式下的控制情境。请先参见图70与图71C，其中，图71C的信号波形与驱动电路5330运作大致上与图71A相同。图71C与图71A的主要差异在于本实施例的驱动电路5330因操作在不连续导通模式下，因此储能电路ESE会在点亮控制信号Slc的脉冲禁能期间内放电至电流IL等于零，并且再于下个信号周期Tlc的开始再重新进行充电。除此之外的运作叙述皆可参照上述图71A实施例，于此不再赘述。Next, the control scenario in which the drive circuit 5330 operates in the discontinuous conduction mode will be described. Please refer to FIG. 70 and FIG. 71C first, wherein the signal waveform of FIG. 71C and the driving circuit 5330 operate substantially the same as FIG. 71A. The main difference between FIG. 71C and FIG. 71A is that the driving circuit 5330 of the present embodiment operates in the discontinuous conduction mode, so the tank circuit ESE is discharged to the current IL equal to zero during the pulse disable period of the lighting control signal Slc. And then re-charging at the beginning of the next signal period Tlc. For the operation descriptions other than the above, reference may be made to the above-mentioned embodiment of FIG. 71A, and details are not described herein again.
请接着参照图70与图71D，其中，图71D的信号波形与驱动电路5330运作大致上与图71B相同。图71D与图71B的主要差异在于本实施例的驱动电路5330因操作在不连续导通模式下，因此储能电路ESE会在点亮控制信号Slc的脉冲禁能期间内放电至电流IL等于零，并且再于下个信号周期Tlc的开始再重新进行充电。除此之外的运作叙述皆可参照上述图71B实施例，于此不再赘述。Referring to FIG. 70 and FIG. 71D, the signal waveform of FIG. 71D and the driving circuit 5330 operate substantially the same as FIG. 71B. The main difference between FIG. 71D and FIG. 71B is that the driving circuit 5330 of the present embodiment operates in the discontinuous conduction mode, so the tank circuit ESE is discharged to the current IL equal to zero during the pulse disable period of the lighting control signal Slc. And then re-charging at the beginning of the next signal period Tlc. For the operation descriptions other than the above, reference may be made to the above-mentioned embodiment of FIG. 71B, and details are not described herein again.
藉由操作在不连续导通模式的驱动电路5330为LED灯丝模块供电，可以降低驱 动电路5330在进行电源转换时所产生的电源损耗，从而具有较高的转换效率。底下进一步列举数个驱动电路5330的具体电路范例来进行说明。By operating the driving circuit 5330 in the discontinuous conduction mode to supply power to the LED filament module, the power loss generated by the driving circuit 5330 during power conversion can be reduced, thereby having high conversion efficiency. A specific circuit example of a plurality of driving circuits 5330 is further described below for explanation.
请参见图72A，图72A为本发明第一较佳实施例的驱动电路的电路示意图。在本实施例中，驱动电路5430为降压直流转直流转换电路，包含控制器5431、输出电路5432、偏压电路5433及采样电路5434。驱动电路5430耦接第一滤波输出端5221及第二滤波输出端5222，以将接收的滤波后信号Sflr转换成驱动电源Sdrv，以驱动耦接在第一驱动输出端5231及第二驱动输出端5232之间的LED灯丝模块。Referring to FIG. 72A, FIG. 72A is a circuit diagram of a driving circuit according to a first preferred embodiment of the present invention. In this embodiment, the driving circuit 5430 is a step-down DC-to-DC conversion circuit, and includes a controller 5431, an output circuit 5432, a bias circuit 5433, and a sampling circuit 5434. The driving circuit 5430 is coupled to the first filtering output terminal 5221 and the second filtering output terminal 5222 to convert the received filtered signal Sflr into a driving power source Sdrv for drivingly coupled to the first driving output terminal 5231 and the second driving output terminal. LED filament module between 5232.
控制器5431可例如是一个集成芯片，其包含漏极管脚Pdrn、源极管脚Pcs、电源管脚Pvcc、电压采样管脚Pln、过压保护管脚Povp及接地管脚Pgnd。漏极管脚Pdrn耦接输出电路5432。源极管脚Pcs通过电阻Rs耦接第二滤波输出端5222和接地端GND。电源管脚Pvcc和过压保护管脚Povp耦接偏压电路5433。电压采样管脚Pln耦接采样电路5434。接地管脚Pgnd耦接第二滤波输出端5222和接地端GND。The controller 5431 can be, for example, an integrated chip including a drain pin Pdrn, a source pin Pcs, a power pin Pvcc, a voltage sampling pin Pln, an overvoltage protection pin Povp, and a ground pin Pgnd. The drain pin Pdrn is coupled to the output circuit 5432. The source pin Pcs is coupled to the second filter output terminal 5222 and the ground terminal GND through a resistor Rs. The power pin Pvcc and the overvoltage protection pin Povp are coupled to the bias circuit 5433. The voltage sampling pin Pln is coupled to the sampling circuit 5434. The ground pin Pgnd is coupled to the second filter output terminal 5222 and the ground terminal GND.
在本实施例中，所述转换电路中的开关电路/功率开关(PSW)可例如是集成在控制器5431中，并且开关电路的第一端与第二端分别连接漏极管脚Pdrn和源极管脚Pcs。换言之，控制器5431通过控制内部的开关电路的切换，可以决定漏极管脚Pdrn与源极管脚Pcs及相应的电流路径的导通或关断。在其他实施例中，所述开关电路也可以是配置在控制器5431之外的分立器件。在使用分立器件作为开关电路的应用下，控制器5431各管脚的定义会对应的调整，例如漏极管脚Pdrn会调整为连接至开关电路的控制端，并且用以提供点亮控制信号的管脚。In this embodiment, the switching circuit/power switch (PSW) in the conversion circuit can be integrated, for example, in the controller 5431, and the first end and the second end of the switching circuit are respectively connected to the drain pin Pdrn and the source. Pole pin Pcs. In other words, the controller 5431 can determine whether the drain pin Pdrn and the source pin Pcs and the corresponding current path are turned on or off by controlling the switching of the internal switching circuit. In other embodiments, the switching circuit can also be a discrete device disposed outside of the controller 5431. In the application of the discrete device as the switching circuit, the definition of each pin of the controller 5431 will be adjusted accordingly, for example, the drain pin Pdrn will be adjusted to be connected to the control terminal of the switching circuit, and used to provide the lighting control signal. Pin.
输出电路5432包括二极管D1、电感L1、电容Co及电阻Ro，其中电感L1和电容C1是作为所述转换电路中的储能电路(ESE)。二极管D1作为续流二极管，其阳极耦接控制器5431的漏极管脚Pdrn，以通过漏极管脚Pdrn与控制器5431内部的开关电路的第一端/漏极耦接；二极管D1的阴极耦接第二驱动输出端5232。电感L1的第一端耦接二极管D1的阳极和控制器5431的漏极管脚Pdrn，电感L1的第二端耦接第一滤波输出端5221和第二驱动输出端5232。电阻Ro和电容Co互相并联，并且耦接于第一驱动输出端5231和第二驱动输出端5232之间。在本实施例中，第一滤波输出端5221和第二驱动输出端5232可视为同一端。The output circuit 5432 includes a diode D1, an inductor L1, a capacitor Co, and a resistor Ro, wherein the inductor L1 and the capacitor C1 are used as an energy storage circuit (ESE) in the conversion circuit. The diode D1 acts as a freewheeling diode, and its anode is coupled to the drain pin Pdrn of the controller 5431 to be coupled to the first terminal/drain of the switching circuit inside the controller 5431 through the drain pin Pdrn; the cathode of the diode D1 The second drive output 5232 is coupled. The first end of the inductor L1 is coupled to the anode of the diode D1 and the drain pin Pdrn of the controller 5431. The second end of the inductor L1 is coupled to the first filter output terminal 5221 and the second drive output terminal 5232. The resistor Ro and the capacitor Co are connected in parallel with each other and coupled between the first driving output terminal 5231 and the second driving output terminal 5232. In this embodiment, the first filter output terminal 5221 and the second drive output terminal 5232 can be regarded as the same end.
其中，控制器5431会控制漏极管脚Pdrn和源极管脚Pcs之间的导通及截止。当漏极管脚Pdrn和源极管脚Pcs之间导通时，电流由第一滤波输出端5221流入，并流经电感L1、漏极管脚Pdrn流入控制器5431，并且经源极管脚Pcs和第二滤波输出端5222流向接地端GND。此时，流经电感L1的电流随时间增加，电感L1处于储能状态；电容Co的电压随时间减少，电容Co处于释能状态，以维持LED灯丝模块发光。当漏极管脚Pdrn和源极管脚Pcs之间截止时，电感L1处于释能状态，电感L1的电流随时间减少。此时，电感L1的电流经二极管D1、第一驱动输出端5231、LED灯丝模块及第二驱动输出端5232再回到电感L1而形成续流。此时，电容Co处于储能状态，电容Co的电平随时间增加。The controller 5431 controls the conduction and the off between the drain pin Pdrn and the source pin Pcs. When the drain pin Pdrn and the source pin Pcs are turned on, current flows in from the first filter output terminal 5221, and flows through the inductor L1 and the drain pin Pdrn to the controller 5431, and passes through the source pin. The Pcs and the second filter output terminal 5222 flow to the ground GND. At this time, the current flowing through the inductor L1 increases with time, the inductor L1 is in the energy storage state; the voltage of the capacitor Co decreases with time, and the capacitor Co is in the release state to maintain the LED filament module emitting light. When the drain pin Pdrn and the source pin Pcs are turned off, the inductor L1 is in a release state, and the current of the inductor L1 decreases with time. At this time, the current of the inductor L1 is returned to the inductor L1 via the diode D1, the first driving output terminal 5231, the LED filament module, and the second driving output terminal 5232 to form a freewheeling flow. At this time, the capacitance Co is in the energy storage state, and the level of the capacitance Co increases with time.
值得注意的是，电容Co为可省略组件。当电容Co省略时，漏极管脚Pdrn和源 极管脚Pcs导通时，电感L1的电流并未流经第一驱动输出端5231及第二驱动输出端5232而使LED灯丝模块不发光。漏极管脚Pdrn和源极管脚Pcs截止时，电感L1的电流经续流二极管D1而流经LED灯丝模块而使LED灯丝发光。藉由控制LED灯丝的发光时间及流经的电流大小，可以达到LED灯丝的平均亮度稳定于设定值上，而达到相同的稳定发光的作用。另外附带一提的是，由于本实施例是采用非隔离式的电源转换架构，因此可透过侦测流经开关电路/功率开关的电流大小来作为控制器5431反馈控制开关电路/功率开关的基础。It is worth noting that the capacitance Co is an omitting component. When the capacitor Co is omitted, when the drain pin Pdrn and the source pin Pcs are turned on, the current of the inductor L1 does not flow through the first driving output terminal 5231 and the second driving output terminal 5232, so that the LED filament module does not emit light. When the drain pin Pdrn and the source pin Pcs are turned off, the current of the inductor L1 flows through the LED filament module through the freewheeling diode D1 to cause the LED filament to emit light. By controlling the illumination time of the LED filament and the current flowing through it, the average brightness of the LED filament can be stabilized at a set value to achieve the same stable illumination. In addition, since this embodiment adopts a non-isolated power conversion architecture, it can be used as a controller 5431 to feedback control of the switch circuit/power switch by detecting the magnitude of the current flowing through the switch circuit/power switch. basis.
再从另一角度来看,驱动电路5430使得流经LED发光部电流维持不变,因此对于部分LED发光部而言(例如:白色、红色、蓝色、绿色等LED发光部),色温随着电流大小而改变的情形即可改善,亦即,LED发光部能在不同的亮度下维持色温不变。而扮演储能电路的电感L1在开关电路截止时释放所储存的能量,一方面使得LED发光部持续发光,另一方面也使得LED发光部上的电流电压不会骤降至最低值,而当开关电路再次导通时,电流电压就不需从最低值往返到最大值,藉此,避免LED发光部断续发光而提高LED发光部的整体亮度并降低最低导通周期以及提高驱动频率。From another point of view, the driving circuit 5430 keeps the current flowing through the LED light-emitting portion unchanged, so for some LED light-emitting portions (for example, LED light-emitting portions such as white, red, blue, green, etc.), the color temperature follows The situation in which the magnitude of the current changes can be improved, that is, the LED light-emitting portion can maintain the color temperature at different brightnesses. The inductor L1, which acts as a storage circuit, releases the stored energy when the switch circuit is turned off, on the one hand, the LED light-emitting portion continues to emit light, and on the other hand, the current and voltage on the LED light-emitting portion does not suddenly drop to a minimum value, and when When the switch circuit is turned on again, the current and voltage do not need to go back to the maximum value from the lowest value, thereby avoiding intermittent light emission of the LED light-emitting portion, improving the overall brightness of the LED light-emitting portion, lowering the minimum on-period and increasing the driving frequency.
偏压电路5433包括电容C1和电阻R1-R4。电容C1的第一端耦接电源管脚Pvcc，电容C1的第二端耦接第二滤波输出端5222和接地端GND。电阻R1的第一端耦接第二驱动输出端5232。电阻R2的第一端耦接电阻R1的第二端，电阻R2的第二端耦接电容C1的第一端和电源管脚Pvcc。电阻R3的第一端耦接电阻R1的第二端和电阻R2的第一端，电阻R3的第二端耦接控制器5431的过压保护管脚Povp。电阻R4的第一端耦接电阻R3的第二端，电阻R4的第二端耦接第二滤波输出端5222和接地端GND。The bias circuit 5433 includes a capacitor C1 and resistors R1-R4. The first end of the capacitor C1 is coupled to the power pin Pvcc, and the second end of the capacitor C1 is coupled to the second filter output 5222 and the ground GND. The first end of the resistor R1 is coupled to the second driving output end 5232. The first end of the resistor R2 is coupled to the second end of the resistor R1, and the second end of the resistor R2 is coupled to the first end of the capacitor C1 and the power pin Pvcc. The first end of the resistor R3 is coupled to the second end of the resistor R1 and the first end of the resistor R2, and the second end of the resistor R3 is coupled to the overvoltage protection pin Povp of the controller 5431. The first end of the resistor R4 is coupled to the second end of the resistor R3, and the second end of the resistor R4 is coupled to the second filter output terminal 5222 and the ground GND.
其中，电阻R1和R2撷取第二驱动输出端5232上的电压以产生工作电压Vcc，工作电压Vcc经电容C1稳压并提供至控制器5431的电源管脚Pvcc，以供控制器5431使用。电阻R3和R4通过分压的方式采样第二驱动输出端5232上的电压，使得控制器5431可根据过压保护管脚Povp上的电压信息来判断是否执行过压保护功能。Wherein, the resistors R1 and R2 draw the voltage on the second drive output terminal 5232 to generate the operating voltage Vcc, and the operating voltage Vcc is regulated by the capacitor C1 and supplied to the power pin Pvcc of the controller 5431 for use by the controller 5431. The resistors R3 and R4 sample the voltage on the second driving output terminal 5232 by voltage division, so that the controller 5431 can determine whether to perform the overvoltage protection function according to the voltage information on the overvoltage protection pin Povp.
采样电路5434包括电容C2和电阻R5-R7。电容C2的第一端耦接电压采样管脚Pln，电容C2的第二端耦接第二滤波输出端5222和接地端GND。电阻R5的第一端耦接第一滤波输出端5221和第二驱动输出端5232。电阻R6的第一端耦接电阻R5的第二端，电阻R6的第二端耦接第二滤波输出端5222和接地端GND。电阻R7的第一端耦接电阻R5的第二端和电阻R6的第一端，电阻R7的第二端耦接电压采样管脚Pln和电容C2的第一端。The sampling circuit 5434 includes a capacitor C2 and resistors R5-R7. The first end of the capacitor C2 is coupled to the voltage sampling pin Pln, and the second end of the capacitor C2 is coupled to the second filter output terminal 5222 and the ground terminal GND. The first end of the resistor R5 is coupled to the first filter output terminal 5221 and the second drive output terminal 5232. The first end of the resistor R6 is coupled to the second end of the resistor R5, and the second end of the resistor R6 is coupled to the second filter output terminal 5222 and the ground GND. The first end of the resistor R7 is coupled to the second end of the resistor R5 and the first end of the resistor R6, and the second end of the resistor R7 is coupled to the first end of the voltage sampling pin Pln and the capacitor C2.
其中，电阻R5和R6通过分压的方式采样母线电压(即，第一滤波输出端5221上电压)，采样到的电压会通过电阻R7提供至控制器5431的电压采样管脚Pln。电容C2则是作为对电压采样管脚Pln上电压进行稳压的用途。Wherein, the resistors R5 and R6 sample the bus voltage (ie, the voltage on the first filter output terminal 5221) by means of voltage division, and the sampled voltage is supplied to the voltage sampling pin Pln of the controller 5431 via the resistor R7. Capacitor C2 is used to regulate the voltage on the voltage sampling pin Pln.
请参见图72B，图72B为本发明第二较佳实施例的驱动电路的电路示意图。在本实施例中，驱动电路5530以升压直流转直流转换电路为例，其包含控制器5531、输出电路5532、偏压电路5533及采样电路5534。驱动电路5530耦接第一滤波输出端5221及第二滤波输出端5222，以将接收的滤波后信号Sflr转换成驱动电源Sdrv，进而驱动耦接在第一驱 动输出端5231及第二驱动输出端5232之间的LED发光部。此外，驱动电路5530还耦接第一整流输出端5211，藉以撷取母线电压来产生工作电压Vcc。Referring to FIG. 72B, FIG. 72B is a circuit diagram of a driving circuit according to a second preferred embodiment of the present invention. In the embodiment, the driving circuit 5530 is exemplified by a step-up DC-to-DC conversion circuit, and includes a controller 5531, an output circuit 5532, a bias circuit 5533, and a sampling circuit 5534. The driving circuit 5530 is coupled to the first filtering output terminal 5221 and the second filtering output terminal 5222 to convert the received filtered signal Sflr into a driving power source Sdrv, and is further coupled to the first driving output end 5231 and the second driving output end. LED light emitting part between 5232. In addition, the driving circuit 5530 is further coupled to the first rectified output terminal 5211, thereby drawing the bus voltage to generate the operating voltage Vcc.
控制器5531可例如是一个集成芯片，其包含漏极管脚Pdrn、源极管脚Pcs、电源管脚Pvcc、过压保护管脚Povp及接地管脚Pgnd。漏极管脚Pdrn耦接输出电路5532。源极管脚Pcs通过电容Cs耦接第二滤波输出端5222、第二驱动输出端5232及接地端GND。电源管脚Pvcc耦接偏压电路5533。过压保护管脚Povp耦接采样电路5534。接地管脚Pgnd耦接偏压电路5533和采样电路5534。The controller 5531 can be, for example, an integrated chip including a drain pin Pdrn, a source pin Pcs, a power pin Pvcc, an overvoltage protection pin Povp, and a ground pin Pgnd. The drain pin Pdrn is coupled to the output circuit 5532. The source pin Pcs is coupled to the second filter output terminal 5222, the second drive output terminal 5232, and the ground terminal GND through a capacitor Cs. The power pin Pvcc is coupled to the bias circuit 5533. The overvoltage protection pin Povp is coupled to the sampling circuit 5534. The ground pin Pgnd is coupled to the bias circuit 5533 and the sampling circuit 5534.
在本实施例中，所述转换电路中的开关电路/功率开关(PSW)可例如是集成在控制器5531中，并且开关电路的第一端与第二端分别连接漏极管脚Pdrn和源极管脚Pcs。换言之，控制器5531通过控制内部的开关电路的切换，可以决定漏极管脚Pdrn与源极管脚Pcs及相应的电流路径的导通或关断。在其他实施例中，所述开关电路也可以是配置在控制器5531之外的分立器件。在使用分立器件作为开关电路的应用下，控制器5531各管脚的定义会对应的调整，例如漏极管脚Pdrn会调整为连接至开关电路的控制端，并且用以提供点亮控制信号的管脚。In this embodiment, the switching circuit/power switch (PSW) in the conversion circuit can be integrated, for example, in the controller 5531, and the first end and the second end of the switching circuit are respectively connected to the drain pin Pdrn and the source. Pole pin Pcs. In other words, the controller 5531 can determine whether the drain pin Pdrn and the source pin Pcs and the corresponding current path are turned on or off by controlling the switching of the internal switching circuit. In other embodiments, the switching circuit can also be a discrete device disposed outside of the controller 5531. In the application of the discrete device as the switching circuit, the definition of each pin of the controller 5531 will be adjusted correspondingly, for example, the drain pin Pdrn will be adjusted to be connected to the control terminal of the switching circuit, and used to provide the lighting control signal. Pin.
输出电路5532包括二极管D1、电感L1、电容Co及电阻Ro，其中电感L1和电容C1是作为所述转换电路中的储能电路(ESE)。二极管D1作为续流二极管，其阳极耦接控制器5531的漏极管脚Pdrn，以通过漏极管脚Pdrn与控制器5531内部的开关电路的第一端/漏极耦接；二极管D1的阴极耦接第一驱动输出端5231。电感L1的第一端耦接第一滤波输出端5221，电感L1的第二端耦接控制器5431的漏极管脚Pdrn和二极管D1的阳极。电阻Ro和电容Co互相并联，并且耦接于第一驱动输出端5231和第二驱动输出端5232之间。在本实施例中，第一滤波输出端5221通过二极管D1和电感L1耦接至第一驱动输出端5231。The output circuit 5532 includes a diode D1, an inductor L1, a capacitor Co, and a resistor Ro, wherein the inductor L1 and the capacitor C1 are used as an energy storage circuit (ESE) in the conversion circuit. The diode D1 acts as a freewheeling diode, and its anode is coupled to the drain pin Pdrn of the controller 5531 to be coupled to the first terminal/drain of the switching circuit inside the controller 5531 through the drain pin Pdrn; the cathode of the diode D1 The first driving output end 5231 is coupled. The first end of the inductor L1 is coupled to the first filter output terminal 5221, and the second end of the inductor L1 is coupled to the drain pin Pdrn of the controller 5431 and the anode of the diode D1. The resistor Ro and the capacitor Co are connected in parallel with each other and coupled between the first driving output terminal 5231 and the second driving output terminal 5232. In this embodiment, the first filter output terminal 5221 is coupled to the first drive output terminal 5231 through the diode D1 and the inductor L1.
其中，控制器5531会控制漏极管脚Pdrn和源极管脚Pcs之间的导通及截止。当漏极管脚Pdrn和源极管脚Pcs之间导通时，电流由第一滤波输出端5221流入，并流经电感L1、漏极管脚Pdrn流入控制器5531，并且经源极管脚Pcs、电容Cs和第二滤波输出端5222流向接地端GND。此时，流经电感L1的电流随时间增加，电感L1处于储能状态。同时，电容Co处于释能状态，以持续驱动LED发光部发光。当漏极管脚Pdrn和源极管脚Pcs之间截止时，电感L1处于释能状态，电感L1的电流随时间减少。电感L1的电流经二极管D1续流流向电容Co以及LED发光部。此时，电容Co处于储能状态。The controller 5531 controls the conduction and the cutoff between the drain pin Pdrn and the source pin Pcs. When the drain pin Pdrn and the source pin Pcs are turned on, current flows in from the first filter output terminal 5221, and flows through the inductor L1 and the drain pin Pdrn to the controller 5531, and passes through the source pin. The Pcs, the capacitor Cs, and the second filter output terminal 5222 flow to the ground GND. At this time, the current flowing through the inductor L1 increases with time, and the inductor L1 is in an energy storage state. At the same time, the capacitor Co is in an energy release state to continuously drive the LED light emitting portion to emit light. When the drain pin Pdrn and the source pin Pcs are turned off, the inductor L1 is in a release state, and the current of the inductor L1 decreases with time. The current of the inductor L1 flows through the diode D1 to the capacitor Co and the LED light-emitting portion. At this time, the capacitor Co is in an energy storage state.
值得注意的是，电容Co为可省略组件。当电容Co省略时，漏极管脚Pdrn和源极管脚Pcs导通时，电感L1的电流并未流经第一驱动输出端5231及第二驱动输出端5232而使LED发光部不发光。漏极管脚Pdrn和源极管脚Pcs截止时，电感L1的电流经续流二极管D1而流经LED发光部而使LED发光部发光。藉由控制LED发光部的发光时间及流经的电流大小，可以达到LED发光部的平均亮度稳定于设定值上，而达到相同的稳定发光的作用。It is worth noting that the capacitance Co is an omitting component. When the capacitor Co is omitted, when the drain pin Pdrn and the source pin Pcs are turned on, the current of the inductor L1 does not flow through the first drive output terminal 5231 and the second drive output terminal 5232, so that the LED light-emitting portion does not emit light. When the drain pin Pdrn and the source pin Pcs are turned off, the current of the inductor L1 flows through the LED light-emitting portion via the freewheeling diode D1 to cause the LED light-emitting portion to emit light. By controlling the light-emitting time of the LED light-emitting portion and the magnitude of the current flowing through it, the average brightness of the LED light-emitting portion can be stabilized at a set value to achieve the same stable light-emitting effect.
偏压电路5533包括二极管D2、电容C1及电阻R1。二极管D2的阳极耦接第一整流输出端5211，二极管D2的阴极耦接第一驱动输出端5231。电容C1的第一端耦接电源管脚 Pvcc，电容C1的第二端耦接接地管脚Pgnd。电阻R1的第一端耦接二极管D1和D2的阴极及第一驱动输出端5231，电阻R1的第二端耦接电容C1的第一端和电源管脚Pvcc。其中，电阻R1撷取第一驱动输出端5231上的电压以产生工作电压Vcc，工作电压Vcc经电容C1稳压并提供至控制器5431的电源管脚Pvcc，以供控制器5431使用。The bias circuit 5533 includes a diode D2, a capacitor C1, and a resistor R1. The anode of the diode D2 is coupled to the first rectified output terminal 5211, and the cathode of the diode D2 is coupled to the first driving output end 5231. The first end of the capacitor C1 is coupled to the power pin Pvcc, and the second end of the capacitor C1 is coupled to the ground pin Pgnd. The first end of the resistor R1 is coupled to the cathode of the diodes D1 and D2 and the first driving output terminal 5231. The second end of the resistor R1 is coupled to the first end of the capacitor C1 and the power pin Pvcc. The resistor R1 draws the voltage on the first driving output terminal 5231 to generate the operating voltage Vcc, and the operating voltage Vcc is regulated by the capacitor C1 and supplied to the power pin Pvcc of the controller 5431 for use by the controller 5431.
采样电路5534包括电阻R2-R5。电阻R2的第一端耦接第一驱动输出端5231，电阻R2的第二端耦接过压保护管脚Povp。电阻R3和R4相互并联，电阻R3和R4的第一端耦接接地管脚Pgnd，电阻R3和R4的第二端耦接第二滤波输出端5222、第二驱动输出端5232及接地端GND。电阻R5的第一端耦接接地管脚Pgnd，电阻R5的第二端耦接电阻R2的第二端和过压保护管脚Povp。 Sampling circuit 5534 includes resistors R2-R5. The first end of the resistor R2 is coupled to the first driving output terminal 5231, and the second end of the resistor R2 is coupled to the overvoltage protection pin Povp. The resistors R3 and R4 are connected in parallel with each other. The first ends of the resistors R3 and R4 are coupled to the ground pin Pgnd, and the second ends of the resistors R3 and R4 are coupled to the second filter output terminal 5222, the second driving output terminal 5232, and the ground terminal GND. The first end of the resistor R5 is coupled to the ground pin Pgnd, and the second end of the resistor R5 is coupled to the second end of the resistor R2 and the overvoltage protection pin Povp.
其中，电阻R2-R5通过分压的方式采样输出电压(即，第一驱动输出端5231上电压)，采样到的电压会被提供至控制器5531的过压保护管脚Povp，使得控制器5531可根据过压保护管脚Povp上的电压信息来判断是否执行过压保护功能。Wherein, the resistor R2-R5 samples the output voltage by means of voltage division (ie, the voltage on the first driving output terminal 5231), and the sampled voltage is supplied to the overvoltage protection pin Povp of the controller 5531, so that the controller 5531 The overvoltage protection function can be judged based on the voltage information on the overvoltage protection pin Povp.
附带一提，所述驱动电路5430、530虽然以单级式直流转直流转换电路作为范例，但本发明不以此为限。举例来说，所述驱动电路5330亦可为由主动式功率因数校正电路搭配直流转直流转换电路所组成的双级式驱动电路。Incidentally, although the driving circuits 5430 and 530 are exemplified by a single-stage DC-DC conversion circuit, the present invention is not limited thereto. For example, the driving circuit 5330 can also be a two-stage driving circuit composed of an active power factor correction circuit and a DC-to-DC conversion circuit.
以上所述本发明的各种实施例特征，可以在不相互排斥的情况下任意组合变换，并不局限于具体的一种实施例中。例如图A所示的实施例中所述，这些特征虽然未在图C所示的实施例中说明亦可包括有图A实施例所述特征，但很显然，本领域普通技术人员可以根据图A的说明不经创造性的将此等特征应用于图C；又例如，本发明虽然以LED球泡灯为例对各种创作方案进行了说明，但明显的这些设计均可以不经创造性的应用于其他形状或者类型的灯中，例如LED蜡烛灯等，在此不再一一列举。The various embodiments of the present invention described above may be combined in any combination without being mutually exclusive, and are not limited to a specific embodiment. For example, as described in the embodiment shown in FIG. A, although these features are not described in the embodiment shown in FIG. C, the features described in the embodiment of FIG. A may be included, but it is obvious that those skilled in the art can The description of A applies these features to FIG. C without inventiveness; for example, although the present invention describes various creative schemes by taking LED bulbs as an example, it is obvious that these designs can be applied without creativity. In other shapes or types of lamps, such as LED candle lamps, etc., they are not enumerated here.
本发明LED灯丝及其应用的LED球泡灯各实施例的实现已如前所述，需要提醒的是，对于同一根LED灯丝而言或采用所述LED灯丝的LED球泡灯而言，以上所述各个实施例中涉及的诸如“光转换层”、“光转换层包裹电极及/或LED芯片的方式”、“导线”、“硅胶及/或聚酰亚胺及/或树脂”、“荧光粉构成比”、“灯丝层状结构”、“荧光粉胶/膜的转换波长/粒子大小/厚度/透光度/硬度/形状“、“透明层”、“荧光粉构成导热路径”、“电路膜”、“氧化纳米粒子(无机散热粒子)”、“固晶胶”、“LED灯丝本体波浪状”、“芯柱”、“灯壳内的气体”、“灯丝组件”、“导电支架的长度”、“LED灯丝的导电支架的长度”、“悬臂及/或芯柱的表面可以涂布有石墨烯薄膜”、“灯壳内的气压”、“灯丝的杨氏系数”、“灯丝基层的邵氏硬度”、“辅助条”、“灯壳表面涂布黏接膜、扩散膜、调色膜”、“灯壳/芯柱/立杆中掺有光转换物质”、“灯壳具散热区”、“灯丝具孔洞或缺口”、“灯丝中具有散热路径”、“灯丝形状的曲线公式”、“灯壳的透气孔”、“灯丝顶层与基层之间的波浪状嵌合面”、“嵌合面为锯齿状”、“基层的贯孔”、“光转换层包括第一荧光胶层、第二荧光胶层与透明层”、“辅助条为波浪形状”、“辅助条为螺旋形状”、“多个辅助条横向与纵向排布”、“纵向辅助条的至少一端弯折成L字型”、“LED灯丝具有弯折处”、“灯壳内无立杆”、“灯壳喷镀薄膜”、“灯壳原材料内掺杂色料”、“灯壳与芯柱 采用对接封口”、“灯壳和芯柱壁厚不同”、“灯壳壁厚比芯柱要厚”以及“弯折处附近适当地设置孔洞或缺口”、“LED芯片的宽度小于基层或顶层的宽度”、“顶层的形状、厚度、中心圆点是否与LED芯片的发光面重叠对出光效率的影响”等特征在不相互冲突的情况下可以包括一个、两个、多个或者所有技术特征。有关的对应内容系可选自于包含有对应实施例中的技术特征之一或其组合。The embodiments of the LED filament of the present invention and the LED bulb of the same have been implemented as described above. It should be noted that for the same LED filament or the LED bulb using the LED filament, the above In the various embodiments, such as "light conversion layer", "method of light conversion layer wrapping electrode and/or LED chip", "wire", "silica gel and/or polyimide and/or resin", " Phosphor composition ratio, "filament layer structure", "converter gel / film conversion wavelength / particle size / thickness / transmittance / hardness / shape", "transparent layer", "phosphor to form a heat conduction path", "Circuit film", "oxidized nanoparticles (inorganic heat dissipating particles)", "solid crystal glue", "LED filament body wave shape", "core column", "gas in lamp housing", "filament assembly", "conducting "length of the bracket", "length of the conductive support of the LED filament", "the surface of the cantilever and / or the stem can be coated with a graphene film", "the gas pressure inside the lamp envelope", "the Young's modulus of the filament", " Shore hardness of the filament base layer, "auxiliary strip", "light shell Surface coating adhesive film, diffusion film, color film", "light-converting material in lamp housing/core column/pillar", "light-emitting area of lamp housing", "filament or notch of filament", "filament Medium heat dissipation path, "curve formula of filament shape", "ventilation hole of lamp housing", "wavy fitting surface between filament top layer and base layer", "fitting surface is jagged", "base layer" Hole", "light conversion layer includes first fluorescent rubber layer, second fluorescent rubber layer and transparent layer", "auxiliary strip is wave shape", "auxiliary strip is spiral shape", "multiple auxiliary strips are horizontally and vertically arranged" "At least one end of the longitudinal auxiliary strip is bent into an L-shaped shape", "the LED filament has a bent portion", "there is no pole in the lamp housing", "the lamp shell spray coating film", and "the lamp shell material is doped therein" “Colorant”, “Bundle and core column use butt seal”, “Light shell and core column wall thickness are different”, “Light bulb wall thickness is thicker than core column” and “Position hole or gap is set appropriately near bend” , "the width of the LED chip is smaller than the width of the base layer or the top layer", "the shape and thickness of the top layer" Center dots affect the efficiency of the light emitting surface of the LED chip overlap "and other characteristics without conflicting with each other may comprise one, two, a plurality or all features. Related content may be selected from one or a combination of the technical features included in the corresponding embodiments.
本发明在上文中已以较佳实施例揭露，然熟悉本项技术者应理解的是，该实施例仅用于描绘本发明，而不应解读为限制本发明的范围。应注意的是，举凡与该实施例等效的变化与置换，均应设为涵盖于本发明的范畴内。因此，本发明的保护范围当以所附的权利要求书所界定的范围为准。The present invention has been disclosed in its preferred embodiments, and it should be understood by those skilled in the art that the present invention is not intended to limit the scope of the invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be within the scope of the present invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

Claims (10)

  1. 一种发光二极管灯丝，其特征在于，包括：A light-emitting diode filament characterized by comprising:
    导体段，所述导体段包括导体；a conductor segment, the conductor segment comprising a conductor;
    LED段，邻接所述导体段，所述LED段至少包括两个相互电性连接的LED芯片；An LED segment adjacent to the conductor segment, the LED segment comprising at least two LED chips electrically connected to each other;
    电极，所述电极与所述LED段电性连接；以及An electrode electrically connected to the LED segment;
    光转换层，至少覆盖所述LED段和部分所述电极，使所述电极的一部分外露。The light conversion layer covers at least the LED segment and a portion of the electrode to expose a portion of the electrode.
  2. 如权利要求1所述的发光二极管灯丝，其特征在于，所述LED段数量为2，所述导体段位于两LED段之间。The LED filament of claim 1 wherein said number of LED segments is two and said conductor segments are between the two LED segments.
  3. 如权利要求1所述的发光二极管灯丝，其特征在于，所述光转换层至少覆盖任一所述LED芯片六个表面中的两个表面。A light-emitting diode filament according to claim 1, wherein said light conversion layer covers at least two of the six surfaces of any of said LED chips.
  4. 如权利要求3所述的发光二极管灯丝，其特征在于，所述光转换层覆盖任一所述LED芯片六个表面。A light-emitting diode filament according to claim 3, wherein said light conversion layer covers six surfaces of any of said LED chips.
  5. 如权利要求1所述的发光二极管灯丝，其特征在于，所述导体段更包括波浪状的凸起结构，所述凸起结构设置于所述导体段的表面边缘上，且以所述发光二极管灯丝的轴向方向为中心环绕设置于所述导体段。The LED filament of claim 1 wherein said conductor segment further comprises a wavy raised structure, said raised structure being disposed on a surface edge of said conductor segment and said light emitting diode The axial direction of the filament is centrally disposed around the conductor segment.
  6. 如权利要求1所述的发光二极管灯丝，其特征在于，还包括辅助条，所述辅助条设于所述光转换层中并沿所述发光二极管灯丝的轴向方向延伸，且贯穿所述导体段。A light-emitting diode filament according to claim 1, further comprising an auxiliary strip provided in said light conversion layer and extending in an axial direction of said light-emitting diode filament and extending through said conductor segment.
  7. 如权利要求6所述的发光二极管灯丝，其特征在于，所述辅助条同时贯穿所述LED段与所述导体段。The LED filament of claim 6 wherein said auxiliary strip extends through said LED segment and said conductor segment simultaneously.
  8. 如权利要求1所述的发光二极管灯丝，其特征在于，所述光转换层中包括颗粒，所述颗粒的结构、材质、效果或分布密度等任一性质，于所述LED段和所述导体段不同。A light-emitting diode filament according to claim 1, wherein said light conversion layer comprises particles, any of properties of said structure, material, effect or distribution density of said particles, said LED segment and said conductor The segments are different.
  9. 如权利要求8所述的发光二极管灯丝，其特征在于，所述LED段的光转换层包括荧光粉，所述导体段的光转换层包括导光粒子。A light-emitting diode filament according to claim 8, wherein the light conversion layer of the LED segment comprises a phosphor, and the light conversion layer of the conductor segment comprises light guiding particles.
  10. 如权利要求9所述的发光二极管灯丝，其特征在于，所述导光粒子为聚甲基丙烯酸甲酯(PMMA)或树脂所制成的大小不一的颗粒。The light-emitting diode filament according to claim 9, wherein the light guiding particles are particles of different sizes made of polymethyl methacrylate (PMMA) or a resin.
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