WO2018227951A1

WO2018227951A1 - Panel manufacturing method, panel and display device

Info

Publication number: WO2018227951A1
Application number: PCT/CN2018/071288
Authority: WO
Inventors: 陈军; 张明; 许占齐; 陈璀; 李洋
Original assignee: 京东方科技集团股份有限公司; 合肥鑫晟光电科技有限公司
Priority date: 2017-06-16
Filing date: 2018-01-04
Publication date: 2018-12-20
Also published as: CN109143637A; EP3640774A4; EP3640774A1; US20210200405A1; EP3640774B1; CN109143637B; US11237666B2

Abstract

A panel manufacturing method, comprising: forming a first conductive layer on a substrate (100) by means of a patterning process, the first conductive layer comprising a plurality of first conductive traces (210) disposed in a non-working area of the substrate (100) and a plurality of electrode patterns disposed in a working area of the substrate (100). A plurality of metal traces (300) are formed on the plurality of first conductive traces (210), and each of the metal traces (300) comprises a connection end (315) near the edge of the working area of the substrate (100). Also provided are a panel and a display device.

Description

Panel manufacturing method, panel and display device

The present application claims priority to Chinese Patent Application No. 201710457046.X filed on Jun. 16, s.

Technical field

Embodiments of the present disclosure relate to a method of manufacturing a panel, a panel, and a display device.

Background technique

In the field of touch and display, metal materials are commonly used to make electrode traces. The advantage of using metal materials to make electrode traces is that the metal has high conductivity, which can reduce channel impedance and make touch sensing more sensitive. The metal material is generally copper/aluminum. As impedance requirements become lower and lower, pure copper/pure aluminum with higher conductivity is required as the material for the electrode traces to improve electron mobility and improve product performance.

Summary of the invention

At least one embodiment of the present disclosure provides a method of manufacturing a panel, comprising: forming a first conductive layer on a substrate by a patterning process, the first conductive layer including a plurality of non-working regions disposed in the substrate substrate a first conductive trace and a plurality of electrode patterns disposed in the working area of the base substrate; forming a plurality of metal traces on the plurality of first conductive traces, each of the metal traces including a connection end of an edge of the substrate substrate working area.

For example, in a method of manufacturing a panel according to an embodiment of the present disclosure, the panel includes a touch panel, the working area of the base substrate is a touch area of the base substrate, and the non-working area of the base substrate is a substrate. The substrate is not touched.

For example, in a method of manufacturing a panel provided by an embodiment of the present disclosure, the plurality of electrode patterns includes a plurality of bridge electrodes.

For example, a method of manufacturing a panel provided by an embodiment of the present disclosure further includes forming an insulating layer on the base substrate. The insulating layer covers the connection ends of the plurality of bridge electrodes and the plurality of metal traces, and a plurality of via holes are formed in the insulating layer to expose the connection ends of the plurality of metal traces.

For example, a method of manufacturing a panel provided by an embodiment of the present disclosure further includes forming a second conductive layer on the substrate by a patterning process. The second conductive layer includes a plurality of first touch electrodes and a plurality of second touch electrodes disposed in the touch area of the base substrate, and a plurality of strips disposed on the non-touch area of the base substrate The second conductive trace. The plurality of first touch electrodes and the plurality of second touch electrodes are correspondingly connected to the plurality of metal traces through the via holes, and each of the first touch electrodes includes a plurality of first sub-ports An electrode is connected between the adjacent first sub-electrodes through the bridge electrode. The plurality of second touch electrodes are insulated from the plurality of bridge electrodes by the insulating layer. The plurality of second conductive traces are formed on the plurality of metal traces and cover other portions of each of the plurality of metal traces except the connection end.

For example, in a method of manufacturing a panel according to an embodiment of the present disclosure, the insulating layer further covers other portions of each of the plurality of metal traces except the connection end, and the method further includes: A second conductive layer is formed on the substrate by a patterning process. The second conductive layer includes a plurality of first touch electrodes and a plurality of second touch electrodes disposed in the touch area of the base substrate. The plurality of first touch electrodes and the plurality of second touch electrodes are correspondingly connected to the plurality of metal traces through the via holes, and each of the first touch electrodes includes a plurality of first sub-ports The electrodes are connected between the adjacent first sub-electrodes by the bridge electrodes, and the plurality of second touch electrodes are insulated from the plurality of bridge electrodes by the insulating layer.

For example, in a method of manufacturing a panel according to an embodiment of the present disclosure, the plurality of electrode patterns includes a plurality of first touch electrodes, and the plurality of metal traces includes a plurality of first metal traces and a plurality of strips Two metal traces are connected, and the plurality of first touch electrodes are connected to the plurality of first metal traces.

For example, a method of manufacturing a panel provided by an embodiment of the present disclosure further includes forming an insulating layer on the base substrate. The insulating layer covers a portion of the plurality of first touch electrodes and the connection ends of the plurality of metal traces, and a plurality of via holes are formed in the insulating layer to expose the plurality of second metal traces Connection end.

For example, a method of manufacturing a panel provided by an embodiment of the present disclosure further includes forming a second conductive layer on the substrate by a patterning process. The second conductive layer includes a plurality of second touch electrodes disposed in the touch area of the base substrate, and a plurality of second conductive traces disposed on the non-touch area of the base substrate. The plurality of second touch electrodes are connected to the plurality of second metal traces through the via holes, and the plurality of second touch electrodes pass through the insulating layer and the plurality of first touch electrodes The electrode is insulated. The plurality of second conductive traces are formed on the plurality of metal traces and cover other portions of each of the plurality of metal traces except the connection end.

For example, in a method of manufacturing a panel according to an embodiment of the present disclosure, the insulating layer further covers other portions of each of the plurality of metal traces except the connection end, and the method further includes: A second conductive layer is formed on the substrate by a patterning process. The second conductive layer includes a plurality of second touch electrodes disposed in the touch area of the base substrate, and the plurality of second touch electrodes pass through the via holes and the plurality of second metals The plurality of second touch electrodes are insulated from the plurality of first touch electrodes by the insulating layer.

For example, in the manufacturing method of the panel provided by the embodiment of the present disclosure, the material of the metal trace includes copper, copper alloy, aluminum, aluminum alloy, gold, gold alloy, silver, silver alloy.

For example, in the manufacturing method of the panel provided by the embodiment of the present disclosure, the material of the first conductive layer includes indium tin oxide, tin oxide or indium zinc oxide.

For example, in the manufacturing method of the panel provided by the embodiment of the present disclosure, the material of the second conductive layer includes indium tin oxide, tin oxide or indium zinc oxide.

At least one embodiment of the present disclosure further provides a panel, including: a substrate, including a working area and a non-working area; a first conductive layer disposed on the base substrate, the first conductive layer including a set a plurality of first conductive traces in a non-working region of the base substrate and a plurality of electrode patterns disposed in the working area of the base substrate; and a plurality of metals disposed on the plurality of first conductive traces A trace, each of the plurality of metal traces including a connection end adjacent to an edge of the substrate substrate working area.

For example, in a panel according to an embodiment of the present disclosure, the panel includes a touch panel, the working area of the base substrate is a touch area of the base substrate, and the non-working area of the base substrate is a non-touch of the base substrate. Control area.

For example, in a panel provided by an embodiment of the present disclosure, the plurality of electrode patterns includes a plurality of bridge electrodes.

For example, a panel provided by an embodiment of the present disclosure further includes: an insulating layer covering a connection end of the plurality of bridge electrodes and the plurality of metal traces, and having a plurality of metal traces exposed a plurality of vias at the connection end; and a second conductive layer disposed on the base substrate. The second conductive layer includes: a plurality of second conductive traces disposed on the plurality of metal traces and covering other portions of the plurality of metal traces except the connection end, and disposed at the a plurality of first touch electrodes and a plurality of second touch electrodes in the touch area of the base substrate. The plurality of first touch electrodes and the plurality of second touch electrodes are correspondingly connected to the plurality of metal traces through the via holes, and each of the first touch electrodes includes a plurality of first sub-ports The electrodes are connected between the adjacent first sub-electrodes by the bridge electrodes, and the plurality of second touch electrodes are insulated from the plurality of bridge electrodes by the insulating layer.

For example, a panel provided by an embodiment of the present disclosure further includes: an insulating layer covering the plurality of bridge electrodes and other portions of each of the plurality of metal traces except the connection end, and having a plurality of vias exposing the connection ends of the plurality of metal traces; and a second conductive layer disposed on the base substrate, the second conductive layer being disposed in the touch area of the base substrate a plurality of first touch electrodes and a plurality of second touch electrodes. The plurality of first touch electrodes and the plurality of second touch electrodes are correspondingly connected to the plurality of metal traces through the via holes, and each of the first touch electrodes includes a plurality of first sub-ports The electrodes are connected between the adjacent first sub-electrodes by the bridge electrodes, and the plurality of second touch electrodes are insulated from the plurality of bridge electrodes by the insulating layer.

For example, in a panel provided by an embodiment of the present disclosure, the plurality of electrode patterns includes a plurality of first touch electrodes, and the plurality of metal traces include a plurality of first metal traces and a plurality of second metal traces And a plurality of first touch electrodes are connected to the plurality of first metal traces.

For example, a panel provided by an embodiment of the present disclosure further includes: an insulating layer covering a portion of the plurality of first touch electrodes and the plurality of metal trace connection ends, and having the plurality of strips exposed a plurality of vias at the connection end of the second metal trace; and a second conductive layer disposed on the base substrate. The second conductive layer includes: a plurality of second conductive traces disposed on the plurality of metal traces and covering other portions of the plurality of metal traces except the connection end, and disposed at the A plurality of second touch electrodes in the touch area of the base substrate. The plurality of second touch electrodes are connected to the plurality of second metal traces through the via holes, and the plurality of second touch electrodes pass through the insulating layer and the plurality of first touch electrodes The electrode is insulated.

For example, a panel provided by an embodiment of the present disclosure further includes: an insulating layer covering a portion of the plurality of first touch electrodes and each of the plurality of metal traces except the connecting end a further portion having a plurality of vias exposing the connection ends of the plurality of second metal traces; and a second conductive layer disposed on the base substrate, the second conductive layer including the liner a plurality of second touch electrodes in the touch area of the bottom substrate. The plurality of second touch electrodes are connected to the plurality of second metal traces through the via holes, and the plurality of second touch electrodes pass through the insulating layer and the plurality of first touch electrodes The electrode is insulated.

At least one embodiment of the present disclosure also provides a display device including the panel of any of the embodiments of the present disclosure.

DRAWINGS

In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly described below. It is obvious that the drawings in the following description relate only to some embodiments of the present disclosure, and are not to limit the disclosure. .

1 is a schematic view showing etching of a multilayer structure of a metal trace;

2A is a schematic view showing a step S20 in a method of manufacturing a panel according to an embodiment of the present disclosure; and FIG. 2B is a cross-sectional view taken along line AA' of FIG. 2A;

3A is a schematic view showing a step S30 in a method of manufacturing a panel according to an embodiment of the present disclosure; and FIG. 3B is a cross-sectional view taken along line BB' of FIG. 3A;

4A is a schematic view showing a step S40 in a method of manufacturing a panel according to an embodiment of the present invention; FIG. 4B is a cross-sectional view taken along line CC' of FIG. 4A; and FIG. 4C is a line along line DD' of FIG. 4A. Cutaway view

5A is a schematic view of a step S50 in a method of manufacturing a panel according to an embodiment of the present disclosure; FIG. 5B is a cross-sectional view taken along line EE' of FIG. 5A; and FIG. 5C is a line along line FF' of FIG. 5A. Cutaway view

Figure 6 is a cross-sectional view taken along line II' of Figure 5A;

7A is a schematic view of a step S40' in a method of manufacturing another panel according to an embodiment of the present disclosure; FIG. 7B is a cross-sectional view taken along line GG' of FIG. 7A; and FIG. 7C is taken along line H-H' of FIG. 7A. a cross-sectional view of the line;

8A is a schematic view of a step S50' in a method of manufacturing another panel according to an embodiment of the present disclosure; FIG. 8B is a cross-sectional view taken along line II' of FIG. 8A; and FIG. 8C is a J-J' along FIG. 8A. a cross-sectional view of the line;

9A is a schematic view of a step S200 in a method of manufacturing a panel according to another embodiment of the present disclosure; and FIG. 9B is a cross-sectional view taken along line K-K' of FIG. 9A;

10A is a schematic view showing a step S300 in a method of manufacturing a panel according to another embodiment of the present disclosure; and FIG. 10B is a cross-sectional view taken along line L-L' of FIG. 10A;

11A is a schematic view of a step S400 in a method of manufacturing a panel according to another embodiment of the present disclosure; FIG. 11B is a cross-sectional view taken along line MM' of FIG. 11A; and FIG. 11C is a line along line N-N' of FIG. Sectional view

12A is a schematic view of a step S500 in a method of manufacturing a panel according to another embodiment of the present disclosure; FIG. 12B is a cross-sectional view taken along line O-0' of FIG. 12A; and FIG. 12C is a line along line P-P' of FIG. 12A. Sectional view

Figure 13 is a cross-sectional view taken along line II-II' of Figure 12A;

14A is a schematic view of a step S400' in a method of manufacturing another panel according to another embodiment of the present disclosure; FIG. 14B is a cross-sectional view taken along line Q-Q' of FIG. 14A; and FIG. 14C is an R-R along FIG. 14A. 'section view of the line;

15A is a schematic view of a step S500' in a method of manufacturing another panel according to another embodiment of the present disclosure; FIG. 15B is a cross-sectional view taken along line S-S' of FIG. 15A; and FIG. 15C is a T-T along FIG. 15A. 'Sectional view of the line.

detailed description

The technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. It is apparent that the described embodiments are part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the described embodiments of the present disclosure without departing from the scope of the invention are within the scope of the disclosure.

Unless otherwise defined, technical terms or scientific terms used in the present disclosure are intended to be understood in the ordinary meaning of the ordinary skill of the art. The words "first," "second," and similar terms used in the present disclosure do not denote any order, quantity, or importance, but are used to distinguish different components. Similarly, the words "a", "an", "the" The word "comprising" or "comprises" or the like means that the element or item preceding the word is intended to be in the The words "connected" or "connected" and the like are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Upper", "lower", "left", "right", etc. are only used to indicate the relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may also change accordingly.

In a process for preparing electrodes or wires in, for example, a display panel or a touch panel using pure copper/pure aluminum, as shown in FIG. 1, in order to improve the adhesion of the pure copper/pure aluminum metal layer 300, in pure copper A buffer layer 120 is prepared under the pure aluminum metal layer 300, and the buffer layer material may be a MoNb (molybdenum tantalum), Ti (titanium) or CuNi (copper nickel) alloy. At the same time, in order to prevent oxidation of the pure copper/pure aluminum metal layer exposed to the air, a protective layer 130 is prepared on the pure copper/pure aluminum metal layer 300, and the protective layer material may be MoNb (molybdenum tantalum) or Ti (titanium). Or CuNi (copper nickel) alloy. This multi-layer structure can solve the problem of insufficient adhesion and oxidation of pure copper/pure aluminum, but it will make etching difficult, and uneven etching may occur.

At least one embodiment of the present disclosure provides a method of manufacturing a panel, comprising: forming a first conductive layer on a substrate by a patterning process, the first conductive layer including a plurality of first layers disposed in a non-working area of the substrate a conductive trace and a plurality of electrode patterns disposed in a working area of the base substrate; forming a plurality of metal traces on the plurality of first conductive traces, each of the metal traces including an edge adjacent to a working area of the substrate substrate Connection end. At least one embodiment of the present disclosure also provides a panel and a display device corresponding to the above panel manufacturing method.

The manufacturing method provided by the embodiments of the present disclosure can improve the etching effect of the metal traces and improve the etching efficiency of the metal traces, without increasing the number of processes and masks, thereby saving process cost and mask cost.

Embodiments of the present disclosure and examples thereof will be described in detail below with reference to the accompanying drawings.

One embodiment of the present disclosure provides a method of manufacturing a panel including a work area and a non-work area. It should be noted that the embodiment of the present disclosure does not limit the type of the panel. For example, the panel may be a touch panel. In this case, the working area is a touch area, and the non-working area is a non-touch area (for example, a peripheral area). For example, the panel may be a display panel, in which case the working area is a display area and the non-working area is a non-display area (eg, a peripheral area). The embodiment of the present disclosure is described by taking a panel as a touch panel as an example. The following embodiments are the same as the above, and are not described again.

For example, the panel is a touch panel, the working area is a touch area, and the non-work area is a non-touch area. An electrode pattern of the touch electrode is formed in the touch area, and a lead wire or the like for the touch electrode may be formed in the non-touch area (for example, a peripheral area). As shown in Figures 2A-3B, the method includes the following operations.

Step S20: forming a first conductive layer on the base substrate 100 by a patterning process.

The first conductive layer includes a plurality of first conductive traces 210 disposed in the non-touch area 102 of the base substrate 100 and a plurality of electrode patterns disposed in the touch area 101 of the base substrate 100 ( For example, bridge electrode 220).

Step S30: forming a plurality of metal traces 300 on the plurality of first conductive traces 210.

Each of the metal traces 300 includes a connection end 315 near the edge of the touch area 101 of the base substrate 100.

In step S20, for example, as shown in FIGS. 2A and 2B (FIG. 2B is a cross-sectional view taken along line AA' of FIG. 2A), a first conductive layer is formed on the base substrate 100 by a patterning process, for example, The first conductive layer film is formed by a sputtering process, and then a pattern as shown in FIG. 2A is formed by a process of exposure, development, etching, or the like.

For example, as shown in FIG. 2A, the first conductive layer includes a plurality of first conductive traces 210 in the non-touch area 102 of the base substrate 100, and a plurality of the touch regions 101 in the base substrate 100. The electrode pattern, for example, the plurality of electrode patterns is a plurality of bridge electrodes 220, and each of the bridge electrodes 220 is used to electrically connect the touch electrodes disposed adjacent to each other. It should be noted that in the embodiment, the electrode patterns in the touch region 101 of the base substrate 100 are all described by taking the bridge electrode 220 as an example.

It should be noted that only seven first conductive traces 210 and six bridge electrodes 220 are schematically illustrated in FIG. 2A. Embodiments of the present disclosure include, but are not limited to, first wire traces and bridge electrodes The number can be set as needed, and the following embodiments are the same.

In the embodiment of the present disclosure, the material of the first conductive layer may be a transparent conductive material. For example, the material of the first conductive layer may be ITO (Indium Tin Oxide), SnO 2 (tin oxide), etc., for example, the first The material of the conductive layer may be IZO (Indium Zinc Oxide). Embodiments of the present disclosure include, but are not limited to, the following embodiments are identical thereto.

In step S30, for example, as shown in FIGS. 3A and 3B (FIG. 3B is a cross-sectional view taken along line BB' of FIG. 3A), a plurality of metal traces 300 are formed on the plurality of first conductive traces 210. For example, the metal traces 300 are formed on the first conductive traces 210 by a photolithography process. Each of the metal traces 300 includes a connection end 315 near the edge of the touch area 101 of the base substrate 100. The connection end 315 is configured to facilitate the connection between the first touch electrode and the second touch electrode formed in the touch area in the subsequent step. It should be noted that the connection ends of the metal traces shown in the figures are only schematic, and their shapes and sizes do not represent true proportions. For example, the width of the connection end 315 can be greater than the width of the remainder of the metal trace 300; for example, the connection end 315 can be as wide as the remainder of the metal trace 300.

In the embodiment of the present disclosure, the material of the metal trace includes one or a combination of copper, copper alloy, aluminum, aluminum alloy, gold, gold alloy, silver, silver alloy, and the like, and the following embodiments are the same.

In the embodiment of the present disclosure, the first conductive trace 210 may serve as a buffer layer of the metal trace 300 formed thereon, which may improve the problem of insufficient adhesion of the metal trace 300 to the substrate.

In this embodiment, when the metal trace is formed by the above etching, only one layer of the metal trace needs to be etched, and the etching effect is better than when etching the multilayer metal structure. At the same time, the etching time is short, for example, the etching time is 30 seconds, which greatly improves the etching efficiency compared to etching a multilayer metal structure (for example, 150 seconds for etching the MoNb/Cu/MoNb structure).

In addition, in step S20, when the bridge electrode 220 in the touch area 101 is formed, the first conductive trace 210 is formed in the non-touch area 102 at the same time, that is, the bridge electrode 220 and the first conductive trace 210 can pass once. The patterning process is formed at the same time, which saves process cost and mask cost.

As shown in FIG. 4A-4C, the manufacturing method of the panel provided by this embodiment further includes the following operations.

Step S40: forming an insulating layer 400 on the base substrate 100.

The insulating layer 400 covers the plurality of bridge electrodes 220 and the connection ends 315 of the plurality of metal traces 300, and a plurality of via holes 410 are formed in the insulating layer 400 to expose the connection ends 315 of the plurality of metal traces 300.

In step S40, for example, as shown in FIGS. 4A, 4B, and 4C (FIG. 4B is a cross-sectional view taken along line CC' of FIG. 4A, and FIG. 4C is a cross-sectional view taken along line DD' of FIG. 4A), The insulating layer 400 is formed on the base substrate on which the first conductive layer and the metal trace are formed by one patterning process.

For example, as shown in FIGS. 4A and 4B, in the touch region 101, the insulating layer 400 covers a portion of the bridge electrode 220. The portion of the bridge electrode 220 that is not covered by the insulating layer 400 is used to connect the first touch electrode formed in the subsequent step, and the insulating layer in the touch region 101 is used to make the first touch electrode formed in the subsequent step and The second touch electrodes are insulated from each other. In the non-touch area 102, the insulating layer 400 covers the connection end 315, and a via hole 410 is formed in each of the insulating layer portions covering the connection end 315 to expose the connection end 315, thereby making the first contact formed in the subsequent step The control electrode and the second touch electrode may be connected to the connection end 315 through the via 410, that is, to the metal trace 300.

As shown in FIG. 5A-5C, the manufacturing method of the panel provided by this embodiment further includes the following operations.

Step S50: forming a second conductive layer on the base substrate 100 by a patterning process.

In step S50, for example, as shown in FIGS. 5A, 5B, and 5C (FIG. 5B is a cross-sectional view taken along line EE' of FIG. 5A, and FIG. 5C is a cross-sectional view taken along line FF' of FIG. 5A), A second conductive layer is formed on the base substrate on which the insulating layer 400 is formed by one patterning process.

For example, as shown in FIG. 5A, the second conductive layer includes a plurality of first touch electrodes 510 and a plurality of second touch electrodes 520 disposed in the touch area 101 of the base substrate 100, and is disposed on the lining. A plurality of second conductive traces 530 in the non-touch area 102 of the base substrate 100.

It should be noted that, for clarity, only a portion of the first touch electrode 510 and a portion of the second touch electrode 520 are exemplarily shown in FIG. 5A. In order to achieve a corresponding touch effect, the first touch electrode 510 and The second touch electrode 520 should be filled with the touch area 101. The following embodiments are identical to this.

As shown in FIG. 5A and FIG. 5B , the plurality of first touch electrodes 510 and the plurality of second touch electrodes 520 are correspondingly connected through the via holes 410 and the plurality of metal traces 300 . For example, the plurality of first touch electrodes 510 and the plurality of second touch electrodes 520 are connected through the via 410 and the connection end 315 , that is, connected to the metal trace 300 . It should be noted that FIG. 5B only shows that the first touch electrode 510 is connected to the connection end 315 of the metal trace 300 through the via 410. It is easy to understand that the second touch electrode 520 is connected to the metal trace. Consistent in 5B.

For example, as shown in FIG. 5A and FIG. 6 (FIG. 6 is a cross-sectional view taken along line II' of FIG. 5A), each of the first touch electrodes 510 includes a plurality of first sub-electrodes 511, adjacent first sub-children. The electrodes 511 are connected to each other through the bridge electrode 220 formed in the step S20, and the plurality of second touch electrodes 520 are insulated from the plurality of bridge electrodes 220 by the insulating layer 400 formed in the touch region 101 in step S40.

It should be noted that only four first sub-electrodes 511 are exemplarily shown in FIG. 5A. Embodiments of the present disclosure include but are not limited thereto, and the number of first sub-electrodes may be set as needed, and the following embodiments Same as this.

For example, as shown in FIG. 5A and FIG. 5C, a plurality of second conductive traces 530 are formed on the plurality of metal traces 300, and a plurality of second conductive traces 530 cover each of the metal traces 300 except the connection end 315. The other part.

In an embodiment of the present disclosure, the material of the second conductive layer may be a transparent conductive material. For example, the material of the second conductive layer may be ITO (indium tin oxide), SnO 2 (tin oxide), or the like, for example, second. The material of the conductive layer may be IZO (Indium Zinc Oxide). Embodiments of the present disclosure include, but are not limited to, the following embodiments are identical thereto.

In this embodiment, the second conductive traces 530 can serve as a protective layer of the metal traces 300 to prevent the metal traces 300 from being exposed to the air, thereby avoiding metal oxidation problems.

In addition, in the embodiment, when the first touch electrode 510 and the second touch electrode 520 in the touch area 101 are formed, the second conductive trace 530 is formed in the non-touch area 102 at the same time, that is, the first The touch electrode 510, the second touch electrode 520, and the second conductive trace 530 can be simultaneously formed by one patterning process, thereby saving process cost and mask cost.

For example, in another embodiment of the present disclosure, as shown in FIGS. 7A-8C, the difference between this embodiment and the embodiment shown in FIG. 2A-6 is that there is a difference in forming the insulating layer and the second conductive layer. The steps of forming the first conductive layer and the metal traces in the example are the same as those in the embodiment shown in FIG. 2A-6, and are not described herein again. The steps of forming the insulating layer and the second conductive layer will be mainly described below.

The method may include the following operations in addition to steps S20 and S30.

Step S40': An insulating layer 400 is formed on the base substrate 100.

Step S50': A second conductive layer is formed on the base substrate 100 by a patterning process.

In step S40', for example, as shown in Figs. 7A, 7B, and 7C (Fig. 7B is a cross-sectional view taken along line GG' of Fig. 7A, and Fig. 7C is a cross-sectional view taken along line H-H' in Fig. 7A), The one patterning process forms the insulating layer 400 on the base substrate on which the first conductive layer and the metal trace are formed.

For example, as shown in FIG. 7A, in the touch region 101, the insulating layer 400 covers a portion of the bridge electrode 220. The portion of the bridge electrode 220 that is not covered by the insulating layer 400 is used to connect the first touch electrode formed in the subsequent step, and the insulating layer in the touch region 101 is used to make the first touch electrode formed in the subsequent step and The second touch electrodes are insulated from each other.

For example, as shown in FIGS. 7A, 7B, and 7C, in the non-touch region 102, the insulating layer 400 covers the metal traces 300 because the metal traces 300 are to be electrically connected to other structures in the bonding region 105 ( For example, it is electrically connected to the touch detection chip), so the insulating layer 400 does not cover the metal traces in the bonding area 105, and the second conductive trace formed in the subsequent step will cover the metal in the bonding area 105. line. A via hole 410 is formed in the insulating layer covering each of the metal traces to expose the connection end 315, so that the first touch electrode and the second touch electrode formed in the subsequent step are connected to the connection end 315 through the via hole 410. That is, it is connected to the metal trace 300.

In the present embodiment, in the non-touch area 102, the insulating layer 400 covering the metal traces 300 can serve as a protective layer of the metal traces 300, preventing the metal traces 300 from being exposed to the air, thereby avoiding metal oxidation problems.

In addition, in the embodiment, when the insulating layer pattern in the touch region 101 is formed, the insulating layer 400 covering the metal trace 300 is simultaneously formed in the non-touch region 102 to protect the metal trace, thereby saving process cost. And mask costs.

In step S50', for example, as shown in Figs. 8A, 8B, and 8C (Fig. 8B is a cross-sectional view taken along line II' of Fig. 8A, and Fig. 8C is a cross-sectional view taken along line J-J' of Fig. 8A) Forming a second conductive layer on the base substrate on which the insulating layer is formed by one patterning process.

For example, as shown in FIG. 8A , the second conductive layer includes a plurality of first touch electrodes 510 and a plurality of second touch electrodes 520 disposed in the touch area 101 of the base substrate 100 . In the non-touch area 102, the second conductive layer also covers the metal traces in the bonding area 105.

As shown in FIG. 8A and FIG. 8B , the plurality of first touch electrodes 510 and the plurality of second touch electrodes 520 are correspondingly connected through the via holes 410 and the plurality of metal traces 300 . For example, the plurality of first touch electrodes 510 and the plurality of second touch electrodes 520 are connected through the via 410 and the connection end 315 , that is, connected to the metal trace 300 . It should be noted that FIG. 8B only shows that the first touch electrode 510 is connected to the connection end 315 of the metal trace 300 through the via 410. It is easy to understand that the second touch electrode 520 is connected to the metal trace. Consistent in 8B.

For example, as shown in FIG. 8A, each of the first touch electrodes 510 includes a plurality of first sub-electrodes 511, and the adjacent first sub-electrodes are connected by the bridge electrodes 220, and the plurality of second touch electrodes 520 pass through. The insulating layer formed in the touch region 101 is insulated from the plurality of bridge electrodes 220. A cross-sectional view of the bridge between the first touch electrode and the second touch electrode can be referred to FIG. 6.

It should be noted that, in this embodiment, the second conductive layer also covers the metal traces in the bonding region 105 to prevent the metal traces in the bonding region 105 from being exposed to the air, thereby avoiding metal oxidation problems.

For the first conductive layer and the metal trace, reference may be made to the corresponding description in the above embodiments, and details are not described herein again.

In an embodiment of the present disclosure, the manufacturing method may further include the following operations before step S20.

Step S10: forming a black matrix layer 110 on the non-touch area 102 corresponding to the base substrate 100.

The non-touch area 102 corresponds to the non-display area of the display panel, so the black matrix 110 is formed in this area to block.

It should be noted that, in the embodiment of the present disclosure, the manner in which the first touch electrode and the second touch electrode are disposed as described above, the present disclosure includes but is not limited thereto. For example, the second touch electrode may include a plurality of second sub-electrodes, and the adjacent second sub-electrodes are connected by a bridge electrode, and the plurality of first touch electrodes are insulated from the plurality of bridge electrodes by an insulating layer.

An embodiment of the present disclosure further provides a method of manufacturing a panel, which is different from the above embodiment in that a plurality of electrode patterns in the first conductive layer are a plurality of first touch electrodes. It should be noted that the present embodiment includes but is not limited to, for example, the plurality of electrode patterns of the first conductive layer may also be the second touch electrodes.

As shown in Figures 9A-10B, the method includes the following operations.

Step S200: forming a first conductive layer on the base substrate 100 by a patterning process.

The first conductive layer includes a plurality of first conductive traces 210 disposed in the non-touch area 102 of the base substrate 100 and a plurality of electrode patterns disposed in the touch area 101 of the base substrate 100 ( For example, the first touch electrode 510).

Step S300: forming a plurality of metal traces on the plurality of first conductive traces 210.

Each of the metal traces includes a connection end 315 adjacent to an edge of the touch area 101 of the base substrate 100. The plurality of metal traces include a plurality of first metal traces 310 and a plurality of second metal traces 320, and a plurality of The first metal traces 310 are respectively connected to the plurality of first touch electrodes 510.

In step S200, for example, as shown in FIGS. 9A and 9B (FIG. 9B is a cross-sectional view taken along line K-K' in FIG. 9A), a first conductive layer is formed on the base substrate 100 by a patterning process, for example, The first conductive layer film is formed using a sputtering process, and then a pattern as shown in FIG. 9A is formed by a process of exposure, development, etching, or the like.

For example, as shown in FIG. 9A, the first conductive layer includes a plurality of first conductive traces 210 in the non-touch area 102 of the base substrate 100, and a plurality of the touch regions 101 in the base substrate 100. The electrode pattern, for example, the plurality of electrode patterns may be a plurality of first touch electrodes 510. It should be noted that in the embodiment, the electrode patterns in the touch region 101 of the base substrate 100 are all described by taking the first touch electrodes 510 as an example.

In step S300, for example, as shown in FIGS. 10A and 10B (FIG. 10B is a cross-sectional view taken along line LL' of FIG. 10A), a plurality of metal traces are formed on the plurality of first conductive traces 210. For example, metal traces are formed on the first conductive traces 210 by a photolithography process. Each of the metal traces includes a connection end 315 adjacent to an edge of the touch area 101 of the base substrate 100. The connection end 315 is configured to facilitate the connection between the first touch electrode 510 and the second touch electrode formed in the subsequent step. The plurality of metal traces include a plurality of first metal traces 310 and a plurality of second metal traces 320 , and the plurality of first metal traces 310 are respectively connected to the plurality of first touch electrodes 510 .

In the embodiment of the present disclosure, the first conductive trace 210 may serve as a buffer layer of the metal trace formed thereon, which may improve the problem of insufficient adhesion of the metal trace.

In addition, in the step S200, when the first touch electrode 510 in the touch area 101 is formed, the first conductive trace 210 is formed in the non-touch area 102, that is, the first touch electrode 510 and the first conductive layer. The trace 210 can be formed simultaneously by one patterning process, thereby saving process cost and mask cost.

As shown in FIG. 11A-11C, the manufacturing method of the panel provided by this embodiment further includes the following operations.

Step S400: forming an insulating layer 400 on the base substrate 100.

The insulating layer 400 covers a portion of the plurality of first touch electrodes 510 and the connection ends 315 of the plurality of metal traces, and a plurality of via holes 410 are formed in the insulating layer 400 to expose the connection ends of the plurality of second metal traces 320 315.

In step S400, for example, as shown in FIGS. 11A, 11B, and 11C (FIG. 11B is a cross-sectional view taken along line MM' of FIG. 11A, and FIG. 11C is a cross-sectional view taken along line N-N' of FIG. 11A), The insulating layer 400 is formed on the base substrate on which the first conductive layer and the metal trace are formed by one patterning process.

For example, as shown in FIG. 11A and FIG. 11B , in the touch area 101 , the insulating layer 400 covers the bridge of the first touch electrode 510 for the first touch electrode and the second touch formed in the subsequent step. The electrodes are insulated from each other. In the non-touch area 102, the insulating layer 400 covers the connection end 315 of the metal trace, and a via 410 is formed in the portion of the insulating layer covering the second metal trace 320 to expose the connection end 315 of the second metal trace 320. Therefore, the second touch electrode formed in the subsequent step is connected to the connection end 315 through the via hole 410, that is, to the second metal trace 320. It should be noted that the bridge of the first touch electrode 510 refers to a region of the first touch electrode that overlaps and is insulated from the second touch electrodes formed in the subsequent step.

As shown in FIG. 12A-12C, the manufacturing method of the panel provided by this embodiment further includes the following operations.

Step S500: forming a second conductive layer on the base substrate 100 by a patterning process.

In step S500, for example, as shown in FIGS. 12A, 12B, and 12C (FIG. 12B is a cross-sectional view taken along line O-O' in FIG. 12A, and FIG. 12C is a cross-sectional view taken along line P-P' in FIG. 12A), A second conductive layer is formed on the base substrate on which the insulating layer is formed by one patterning process.

For example, as shown in FIG. 12A, the second conductive layer includes a plurality of second touch electrodes 520 disposed in the touch area 101 of the base substrate 100, and a non-touch area 102 disposed on the base substrate 100. A plurality of second conductive traces 530 in the middle.

As shown in FIG. 12A and FIG. 12B , the plurality of second touch electrodes 520 are correspondingly connected through the via holes 410 and the plurality of second metal traces 320 .

For example, as shown in FIG. 12A and FIG. 13 (FIG. 13 is a cross-sectional view taken along line II-II' in FIG. 12A), the plurality of second touch electrodes 520 pass through the insulating layer 400 formed in the touch region 101 in step S400. Insulation is performed with the plurality of first touch electrodes 510.

For example, as shown in FIG. 12A and FIG. 12C, a plurality of second conductive traces 530 are formed on the plurality of metal traces, and the plurality of second conductive traces 530 cover the other metal traces except the connection terminal 315. section.

In this embodiment, the second conductive traces 530 can serve as a protective layer for the metal traces, preventing the metal traces from being exposed to the air, thereby avoiding metal oxidation problems.

In addition, in the embodiment, when the second touch electrode 520 in the touch area 101 is formed, the second conductive trace 530, that is, the second touch electrode 520 and the second, are simultaneously formed in the non-touch area 102. The conductive traces 530 can be formed simultaneously by one patterning process, thereby saving process cost and mask cost.

For example, in another embodiment of the present disclosure, as shown in FIGS. 14A-15C, the difference between this embodiment and the embodiment shown in FIGS. 9A-13 is that there is a difference in forming the insulating layer and the second conductive layer. The steps of forming the first conductive layer and the metal traces in the example are the same as those of the embodiment shown in FIG. 9A-13 above, and are not described herein again. The steps of forming the insulating layer and the second conductive layer will be mainly described below.

The method may include the following operations in addition to steps S200 and S300.

Step S400': An insulating layer 400 is formed on the base substrate 100.

Step S500': A second conductive layer is formed on the base substrate 100 by a patterning process.

In step S400', for example, as shown in FIGS. 14A, 14B, and 14C (FIG. 14B is a cross-sectional view taken along line Q-Q' in FIG. 14A, and FIG. 14C is a cross-sectional view taken along line R-R' in FIG. 14A) The insulating layer 400 is formed on the base substrate on which the first conductive layer and the metal trace are formed by one patterning process.

For example, as shown in FIG. 14A, FIG. 14B and FIG. 14C, in the touch region 101, the insulating layer 400 covers the bridge of the first touch electrode 510. The first touch electrodes and the second touch electrodes formed in the subsequent steps are insulated from each other. In the non-touch area 102, the insulating layer 400 covers the metal traces, because the metal traces 300 are electrically connected to other structures in the bonding area 105 (for example, electrically connected to the touch detection chip), so the insulation Layer 400 does not cover the metal traces in bonding region 105, and the second conductive traces formed in subsequent steps will cover the metal traces in bonding region 105. A via hole 410 is formed in the portion of the insulating layer covering the second metal trace 320 to expose the connection end of the second metal trace 320, so that the second touch electrode formed in the subsequent step is connected to the connection end through the via 410. That is, it is connected to the second metal trace 320.

In the embodiment, in the non-touch area 102, the cover metal trace insulating layer 400 can serve as a protective layer for the metal traces, preventing the metal traces from being exposed to the air, thereby avoiding metal oxidation problems.

In addition, in the embodiment, when the insulating layer pattern in the touch region 101 is formed, the insulating layer 400 covering the metal traces is simultaneously formed in the non-touch region 102 to protect the metal traces, thereby saving process cost and Mask cost.

In step S500', for example, as shown in Figs. 15A, 15B, and 15C (Fig. 15B is a cross-sectional view taken along line S-S' in Fig. 15A, and Fig. 15C is a cross-sectional view taken along line T-T' in Fig. 15A) Forming a second conductive layer on the base substrate on which the insulating layer is formed by one patterning process.

For example, as shown in FIG. 15A, the second conductive layer includes a plurality of second touch electrodes 520 disposed in the touch region 101 of the base substrate 100. In the non-touch area 102, the second conductive layer also covers the metal traces in the bonding area 105.

As shown in FIG. 15A and FIG. 15B , the plurality of second touch electrodes 520 are correspondingly connected through the via holes 410 and the plurality of second metal traces 320 .

For example, as shown in FIG. 15A , the plurality of second touch electrodes 520 are insulated from the plurality of first touch electrodes 510 by an insulating layer formed in the touch region 101 . For a cross-sectional view of the bridge between the first touch electrode and the second touch electrode in this embodiment, reference may be made to FIG.

It should be noted that, in this embodiment, the second conductive layer also covers the metal traces in the bonding region 105 to prevent the metal traces in the bonding region from being exposed to the air, thereby avoiding metal oxidation problems.

In an embodiment of the present disclosure, the manufacturing method may further include the following operations before step S200.

Step S100: forming a black matrix layer 110 on the non-touch area 102 corresponding to the base substrate 100.

One embodiment of the present disclosure also provides a panel formed using the manufacturing method of the embodiment illustrated in Figures 2A-6.

As shown in FIG. 2A and FIG. 3A, the panel includes a base substrate 100, a first conductive layer disposed on the base substrate 100, and a plurality of metal traces 300 disposed on the plurality of first conductive traces 210.

The base substrate 100 includes a touch area 101 and a non-touch area 102. The first conductive layer includes a plurality of first conductive traces 210 disposed in the non-touch area 102 of the base substrate 100 and disposed on the base substrate 100. A plurality of electrode patterns in the touch area 101; each of the metal traces 300 includes a connection end 315 adjacent to an edge of the touch area 101 of the base substrate 100.

For example, as shown in FIG. 2A , the plurality of electrode patterns in the touch region 101 may be a plurality of bridge electrodes 220 .

For example, as shown in FIG. 4A and FIG. 5A, the panel provided by this embodiment further includes an insulating layer 400 and a second conductive layer disposed on the base substrate 100.

For example, as shown in FIG. 4A, the insulating layer 400 covers the plurality of bridge electrodes 220 and the connection ends 315 of the plurality of metal traces 300, and has a plurality of via holes 410 exposing the connection ends 315 of the plurality of metal traces 300.

For example, as shown in FIG. 5A and FIG. 5B, the second conductive layer includes a plurality of second conductive traces 530 disposed on the plurality of metal traces 300, and is disposed in the touch region 101 of the base substrate 100. a plurality of first touch electrodes 510 and a plurality of second touch electrodes 520. A plurality of second conductive traces 530 cover other portions of each metal trace 300 other than the connection ends 315. The plurality of first touch electrodes 510 and the plurality of second touch electrodes 520 are correspondingly connected through the via holes 410 and the plurality of metal traces 300.

As shown in FIG. 5A and FIG. 6 (FIG. 6 is a cross-sectional view taken along line II' of FIG. 5A), each of the first touch electrodes 510 includes a plurality of first sub-electrodes 511 adjacent to the first sub-portion. The electrodes are connected by the bridge electrodes 220, and the plurality of second touch electrodes 520 are insulated from the plurality of bridge electrodes 220 by an insulating layer disposed in the touch region 101.

For example, another embodiment of the present disclosure further provides a panel. As shown in FIG. 7A-8C, the difference between the embodiment and the above embodiment is that there is a difference between the insulating layer and the second conductive layer of the panel. The first conductive layer and the metal trace are the same as those in the above embodiment, and are not described herein again.

The panel includes an insulating layer 400 and a second conductive layer disposed on the base substrate 100 in addition to the first conductive layer and the metal trace.

For example, as shown in FIGS. 7A and 7B, the edge layer 400 covers the plurality of bridge electrodes 220 and the plurality of metal traces 300, and has a plurality of via holes 410 exposing the connection ends 315 of the plurality of metal traces 300.

For example, as shown in FIG. 8A and FIG. 8B, the second conductive layer includes a plurality of first touch electrodes 510 and a plurality of second touch electrodes 520 disposed in the touch area 101 of the base substrate 100. The plurality of first touch electrodes 510 and the plurality of second touch electrodes 520 are correspondingly connected through the via holes 410 and the plurality of metal traces 300.

As shown in FIG. 8A, each of the first touch electrodes 510 includes a plurality of first sub-electrodes 511, and the adjacent first sub-electrodes are connected by a bridge electrode 220, and the plurality of second touch electrodes 520 pass through. The insulating layer disposed in the touch region 101 is insulated from the plurality of bridge electrodes 220. A cross-sectional view of the bridge between the first touch electrode and the second touch electrode can be referred to FIG. 6.

It should be noted that, in this embodiment, the manner in which the first touch electrode and the second touch electrode are disposed as described above, the present disclosure includes but is not limited thereto. For example, the second touch electrode may include a plurality of second sub-electrodes, and the adjacent second sub-electrodes are connected by a bridge electrode, and the plurality of first touch electrodes pass through the insulating layer covering the bridge electrodes and the plurality of bridge electrodes Insulation, that is, insulated from the second touch electrode.

The panel provided in this embodiment may further include a touch detection chip. The first touch electrode and the second touch electrode are connected to the touch detection chip through metal traces, thereby implementing a touch function.

Another embodiment of the present disclosure also provides a panel formed using the manufacturing method of the embodiment illustrated in Figures 9A-13. The difference between this embodiment and the above embodiment is that the plurality of electrode patterns in the first conductive layer are the first touch electrodes. It should be noted that the present embodiment includes but is not limited to, for example, the plurality of electrode patterns of the first conductive layer may also be the second touch electrodes.

As shown in FIG. 9A and FIG. 10A, the panel includes a base substrate 100, a first conductive layer disposed on the base substrate 100, and a plurality of metal traces disposed on the plurality of first conductive traces 210.

The base substrate 100 includes a touch area 101 and a non-touch area 102. The first conductive layer includes a plurality of first conductive traces 210 disposed in the non-touch area 102 of the base substrate 100 and disposed on the base substrate 100. a plurality of first touch electrodes in the touch area 101; each of the metal traces includes a connection end 315 adjacent to an edge of the touch area 101 of the base substrate 100, and the plurality of metal traces include a plurality of first lines The metal traces 310 and the plurality of second metal traces 320 are connected to the plurality of first touch electrodes 510.

For example, as shown in FIG. 11A and FIG. 12A, the panel provided in this embodiment may further include an insulating layer 400 and a second conductive layer disposed on the base substrate 100.

For example, as shown in FIG. 11A, the insulating layer 400 covers the bridge of the first touch electrode 510 and the connection ends 315 of the plurality of metal traces, and the insulating layer 400 has a plurality of connection ends exposing the plurality of second metal traces 320. Via 410.

For example, as shown in FIG. 12A and FIG. 12B, the second conductive layer includes a plurality of second conductive traces 530 disposed on the plurality of metal traces 300, and is disposed in the touch region 101 of the base substrate 100. A plurality of second touch electrodes 520. A plurality of second conductive traces 530 cover other portions of each metal trace 300 other than the connection ends 315. The plurality of second touch electrodes 520 are correspondingly connected through the via 410 and the plurality of second metal traces 320.

As shown in FIG. 12A and FIG. 13 (FIG. 13 is a cross-sectional view taken along line II-II' in FIG. 12A), the plurality of second touch electrodes 520 pass through the insulating layer and the plurality of first touches disposed in the touch region 101. The control electrode 510 is insulated.

For example, another embodiment of the present disclosure further provides a panel, as shown in FIGS. 14A-15C, the difference between the embodiment and the above embodiment is that there is a difference in the arrangement of the insulating layer and the second conductive layer, in this embodiment. The first conductive layer and the metal trace are the same as those in the above embodiment, and are not described herein again.

For example, as shown in FIG. 14A and FIG. 14B, the insulating layer 400 covers the bridge of the first touch electrode 510 and the plurality of metal traces, and has a plurality of vias 410 exposing the connection ends of the plurality of second metal traces 320. .

For example, as shown in FIG. 15A and FIG. 15B, the second conductive layer includes a plurality of second touch electrodes 520 disposed in the touch area 101 of the base substrate 100, and the plurality of second touch electrodes 520 pass through. The hole 410 and the plurality of second metal traces 320 are correspondingly connected.

As shown in FIG. 15A , the plurality of second touch electrodes 520 are insulated from the plurality of first touch electrodes 510 by an insulating layer formed in the touch region 101 . For a cross-sectional view of the bridge between the first touch electrode and the second touch electrode in this embodiment, reference may be made to FIG.

It should be noted that the panel provided by the embodiment of the present disclosure is formed correspondingly by the manufacturing method provided in the embodiment of the present disclosure, and the structure and technical effects of the panel may refer to the corresponding description in the embodiment of the manufacturing method of the present disclosure, where No longer.

An embodiment of the present disclosure also provides a display device comprising the panel of any of the above embodiments.

It should be noted that the embodiment of the present disclosure does not limit the type of the panel, for example, the panel may be a touch panel; and, for example, the panel may be a display panel. In this embodiment, a panel is used as a touch panel as an example for description.

For example, the panel is a touch panel, and the display device provided in this embodiment may further include a display screen. It should be noted that the embodiment does not limit the combination manner of the touch panel and the display screen.

For example, the base substrate may be a protective cover plate for covering the display screen to protect the display screen, and the side of the protective cover plate on which the touch panel is formed faces the display screen. That is, the combination of the touch panel and the display screen is an OGS (One Glass Solution) method.

For example, the base substrate may also be a color filter substrate, and the color filter substrate is used for pairing with the array substrate, and the touch panel is disposed on a side of the color filter substrate facing away from the array substrate, and the touch panel is facing away from the color film. A polarizer is also disposed on one side of the substrate. That is, the combination of the touch panel and the display screen is an On-Cell (external) mode.

For example, the base substrate may also be a color filter substrate, and the color filter substrate is used to face the array substrate, and the touch panel is disposed on a side of the color filter substrate facing the array substrate. That is, the touch panel and the display screen are combined in an In-Cell (in-line) manner.

It should be noted that the display device in this embodiment may be: a liquid crystal panel, a liquid crystal television, a display, an OLED panel, an OLED television, an electronic paper, a mobile phone, a tablet computer, a notebook computer, a digital photo frame, a navigation device, etc. A product or part that displays functionality.

For the technical effects of the display device provided in this embodiment, reference may be made to the corresponding description in any of the foregoing embodiments, and details are not described herein again.

In summary, the manufacturing method, the panel, and the display device of the panel provided by the embodiments of the present disclosure have at least one of the following beneficial effects.

(1) At least one embodiment of the present disclosure only needs to etch a metal trace when etching a metal trace, and the etching effect is better than etching a multilayer metal structure (for example, etching a MoNb/Cu/MoNb structure). Good time. At the same time, the etching time is greatly improved compared to the etching time of the etched multilayer metal structure, and the etching efficiency is greatly improved.

(2) In at least one embodiment, when the electrode pattern in the touch area is formed (for example, a bridge electrode or a touch electrode), the first conductive trace is formed in the non-touch area, thereby saving process cost and Mask cost.

(3) In at least one embodiment, when the touch electrodes in the touch area are formed, the second conductive traces are simultaneously formed in the non-touch areas, thereby saving process cost and mask cost.

(4) In at least one embodiment, when the insulating layer pattern in the touch region is formed, a protective layer covering the metal trace is formed in the non-touch region at the same time, thereby saving process cost and mask cost.

(5) In at least one embodiment, the first conductive trace may serve as a buffer layer of the metal trace formed thereon, which may improve the problem of insufficient adhesion of the metal trace.

(6) In at least one embodiment, the second conductive trace can serve as a protective layer for the metal trace, preventing the metal trace from being exposed to the air, thereby avoiding metal oxidation problems.

(7) In at least one embodiment, in the non-touch area, the insulating layer may cover the metal trace as a protective layer of the metal trace to prevent the metal trace from being exposed to the air, thereby avoiding metal oxidation problems.

The above is only the specific embodiment of the present disclosure, but the scope of the present disclosure is not limited thereto, and the scope of the present disclosure should be determined by the scope of the claims.

Claims

A method of manufacturing a panel, comprising:

Forming a first conductive layer on a base substrate by a patterning process, wherein the first conductive layer includes a plurality of first conductive traces disposed in the non-working region of the base substrate and disposed on the base substrate a plurality of electrode patterns in the work area;

Forming a plurality of metal traces on the plurality of first conductive traces, wherein each of the metal traces includes a connection end adjacent to an edge of the substrate substrate working region.
The manufacturing method of claim 1 , wherein the panel comprises a touch panel, the substrate substrate working area is a base substrate touch area, and the base substrate non-working area is a base substrate non-touch region.
The manufacturing method according to claim 2, wherein the plurality of electrode patterns comprise a plurality of bridge electrodes.
The manufacturing method according to claim 3, further comprising:

Forming an insulating layer on the base substrate; wherein

The insulating layer covers the connection ends of the plurality of bridge electrodes and the plurality of metal traces, and a plurality of via holes are formed in the insulating layer to expose the connection ends of the plurality of metal traces.
The manufacturing method according to claim 4, further comprising:

Forming a second conductive layer on the substrate by a patterning process; wherein

The second conductive layer includes a plurality of first touch electrodes and a plurality of second touch electrodes disposed in the touch area of the base substrate, and a plurality of strips disposed on the non-touch area of the base substrate Second conductive trace,

The plurality of first touch electrodes and the plurality of second touch electrodes are correspondingly connected to the plurality of metal traces through the via holes, and each of the first touch electrodes includes a plurality of first sub-ports An electrode is connected between the adjacent first sub-electrodes through the bridge electrode, and the plurality of second touch electrodes are insulated from the plurality of bridge electrodes by the insulating layer,

The plurality of second conductive traces are formed on the plurality of metal traces and cover other portions of each of the plurality of metal traces except the connection end.
The manufacturing method according to claim 4, wherein the insulating layer further covers other portions of each of the plurality of metal traces except the connection end, and the method further comprises:

Forming a second conductive layer on the substrate by a patterning process; wherein

The second conductive layer includes a plurality of first touch electrodes and a plurality of second touch electrodes disposed in the touch area of the base substrate.

The plurality of first touch electrodes and the plurality of second touch electrodes are correspondingly connected to the plurality of metal traces through the via holes, and each of the first touch electrodes includes a plurality of first sub-ports The electrodes are connected between the adjacent first sub-electrodes by the bridge electrodes, and the plurality of second touch electrodes are insulated from the plurality of bridge electrodes by the insulating layer.
The manufacturing method according to claim 2, wherein the plurality of electrode patterns comprise a plurality of first touch electrodes, and the plurality of metal traces comprise a plurality of first metal traces and a plurality of second metal traces And the plurality of first touch electrodes are connected to the plurality of first metal traces.
The manufacturing method according to claim 7, further comprising:

Forming an insulating layer on the base substrate; wherein

The insulating layer covers a portion of the plurality of first touch electrodes and the connection ends of the plurality of metal traces, and a plurality of via holes are formed in the insulating layer to expose the plurality of second metal traces Connection end.
The manufacturing method according to claim 8, further comprising:

Forming a second conductive layer on the substrate by a patterning process; wherein

The second conductive layer includes a plurality of second touch electrodes disposed in the touch area of the base substrate, and a plurality of second conductive traces disposed on the non-touch area of the base substrate.

The plurality of second touch electrodes are connected to the plurality of second metal traces through the via holes, and the plurality of second touch electrodes pass through the insulating layer and the plurality of first touch electrodes Electrode insulation,

The plurality of second conductive traces are formed on the plurality of metal traces and cover other portions of each of the plurality of metal traces except the connection end.
The manufacturing method according to claim 8, wherein the insulating layer further covers other portions of each of the plurality of metal traces except the connection end, and the method further comprises:

Forming a second conductive layer on the substrate by a patterning process; wherein

The second conductive layer includes a plurality of second touch electrodes disposed in the touch area of the base substrate.

The plurality of second touch electrodes are connected to the plurality of second metal traces through the via holes, and the plurality of second touch electrodes pass through the insulating layer and the plurality of first touch electrodes The electrode is insulated.
The manufacturing method according to any one of claims 1 to 10, wherein the material of the metal trace comprises copper, copper alloy, aluminum, aluminum alloy, gold, gold alloy, silver, silver alloy.
The manufacturing method according to any one of claims 1 to 11, wherein the material of the first conductive layer comprises indium tin oxide, tin oxide or indium zinc oxide.
The manufacturing method according to any one of claims 5, 6, 9, or 10, wherein the material of the second conductive layer comprises indium tin oxide, tin oxide or indium zinc oxide.
A panel that includes:

a substrate substrate including a working area and a non-working area,

a first conductive layer disposed on the base substrate, wherein the first conductive layer includes a plurality of first conductive traces disposed in the non-working region of the base substrate and disposed on the base substrate Multiple electrode patterns in the work area, and

a plurality of metal traces disposed on the plurality of first conductive traces, wherein

Each of the plurality of metal traces includes a connection end adjacent to an edge of the substrate substrate working area.
The panel of claim 14 , wherein the panel comprises a touch panel, the substrate substrate working area is a substrate substrate touch area, and the base substrate non-working area is a base substrate non-touch area .
The panel of claim 15 wherein the plurality of electrode patterns comprises a plurality of bridge electrodes.
The panel of claim 16 further comprising:

An insulating layer covering the connection ends of the plurality of bridge electrodes and the plurality of metal traces, and having a plurality of vias exposing connection ends of the plurality of metal traces;

a second conductive layer disposed on the base substrate, the second conductive layer comprising: disposed on a plurality of metal traces and covering each of the plurality of metal traces except the connection end a plurality of second conductive traces, and a plurality of first touch electrodes and a plurality of second touch electrodes disposed in the touch area of the base substrate; wherein

The plurality of first touch electrodes and the plurality of second touch electrodes are correspondingly connected to the plurality of metal traces through the via holes, and each of the first touch electrodes includes a plurality of first sub-ports The electrodes are connected between the adjacent first sub-electrodes by the bridge electrodes, and the plurality of second touch electrodes are insulated from the plurality of bridge electrodes by the insulating layer.
The panel of claim 16 further comprising:

An insulating layer covering the plurality of bridge electrodes and other portions of each of the plurality of metal traces except the connection end, and having a plurality of connection ends exposing the plurality of metal traces Via hole

a second conductive layer disposed on the base substrate, the second conductive layer includes a plurality of first touch electrodes and a plurality of second touch electrodes disposed in the touch area of the base substrate; ,

The plurality of first touch electrodes and the plurality of second touch electrodes are correspondingly connected to the plurality of metal traces through the via holes, and each of the first touch electrodes includes a plurality of first sub-ports The electrodes are connected between the adjacent first sub-electrodes by the bridge electrodes, and the plurality of second touch electrodes are insulated from the plurality of bridge electrodes by the insulating layer.
The panel of claim 15 , wherein the plurality of electrode patterns comprise a plurality of first touch electrodes, the plurality of metal traces comprising a plurality of first metal traces and a plurality of second metal traces, And the plurality of first touch electrodes are connected to the plurality of first metal traces.
The panel of claim 19, further comprising:

An insulating layer covering a portion of the plurality of first touch electrodes and the plurality of metal trace connection ends, and having a plurality of vias exposing connection ends of the plurality of second metal traces;

a second conductive layer disposed on the base substrate, the second conductive layer comprising: disposed on a plurality of metal traces and covering each of the plurality of metal traces except the connection end a plurality of second conductive traces and a plurality of second touch electrodes disposed in the touch area of the base substrate; wherein

The plurality of second touch electrodes are connected to the plurality of second metal traces through the via holes, and the plurality of second touch electrodes pass through the insulating layer and the plurality of first touch electrodes The electrode is insulated.
The panel of claim 19, further comprising:

An insulating layer covering a portion of the plurality of first touch electrodes and other portions of each of the plurality of metal traces except the connection end, and having the plurality of second metals exposed a plurality of vias at the connection end of the trace;

a second conductive layer disposed on the base substrate, the second conductive layer includes a plurality of second touch electrodes disposed in the touch area of the base substrate;

The plurality of second touch electrodes are connected to the plurality of second metal traces through the via holes, and the plurality of second touch electrodes pass through the insulating layer and the plurality of first touch electrodes The electrode is insulated.
A display device comprising the panel of any of claims 14-21.