WO2018035539A1 - High-volume millimeter scale manufacturing - Google Patents

Abstract

A method for manufacturing a millimeter scale electromechanical device includes coupling a stainless steel ply to a polymer carrier ply, coating the stainless steel ply in a photo resist material, masking tine photoresist material,exposing the photoresist material to cure a portion of the photoresist material, developing the photoresist material to remove uncured photoresist.material from the stainless steel ply, chemically etching the stainless steel ply to remove a patterned portion of the stainless steel ply, dissolving the polymer carrier ply to release unwanted chips of the stainless steel ply, and adhering the patterned stainless steel ply to a flexible material ply to form a sub-laminate.

Description

IN THB Ι ΓΓΙΟ STATES ftlCEiVI G OFFICE

¾ig¾-¥olume Millimeter Scale _^ a ufac uring

Cross-Refetence to Related Applications

00001 Xhe present appiieatipnis a U.S. onproyisipnal Application under 35

VSX ,- 111(a) of . international application , haying a.n. international filing ate of August 21, 2Qi7_f&tti& published as O _., which i turn daims t¾e benefit of United States provisional patent application . number 62/377,51 , lied on August 19, 2016 and of United States provisional patent application number 62/3 7,661 filed on August 21, 2016 and of United States pro visional, patent application number 62/381,492, filed on August 30, 2016 the disclosures of all of the f regoing are incorporated in the present application by reference in their entirety. The present applicatio is a continuation-in--part of international application number PCr US2Q17/Q29 75 filed on April 27, 2017, and published as WO which in torn claims the benefit of U.S. provisional patent application number 62/328,524, filed on May 6, 201 the disclosures of which are incorporated herein by reference their entirety. The present application is a am inuation-in-part of US. patent application number 15/242,508, filed August 20, 2016, which claims the benefit of U.S. provisional patent application number 62/328,524, filed on April 27, 2016, and of international application PCT/U52C)! 6/028 85 filed on April 18, 201 which claims the benefit of U.S. provisional application number 62/148,732, filed on April 1.6, 2015 and of U.S. provisional application number 62/180,974., filed on June 17, 2015 and of 62/289,147, filed on January 29, 2016, and of international applic do

PCT/US2015/015509, filed o February 11, 2015 which claims the benefit of VS. provisional patent application number 62/051,358, filed September 17, 2014 and of U , provisional patent application number^' 61/938,613, filed on February 11.,.2014 the disclosures of which are incorporated herein by reference in their entirety . The present application is a continuation-in-part of U.S. patent application number 15/703,436 filed on March 1 , 2016 which claims benefit of U.S. nonprovisional application number 1 /834,336 tiled on August 24, 2015 which in turn claims benefit of U.S. provisional patent application number 61/993,037, filed on January 29, 2014 and U.S. provisional application number 61/933,027, filed on January 29, 2014 and of U.S. provisional application number 62/051,355, filed on September 17, 2104 the disclosures of which are incorporated herein by reference in their entirety. The present application is a continuation-in-par of U.S. patent application number 15/703,436 filed on March 17, 2016 which claims benefit of U.S. nonprovisional application number 14/834,336 filed on August 24, 2015 which in turn claims benefit of international application number PCT/IJS2014/018096, filed on February 24, 2014 which in turn claims benefit of U.S. provisional application number 61/768,397, Februar 22, 2013 and of U.S. provisional application number 61/768,494, filed on February 24, 2013 and of U.S. provisional application number 61/771,847, filed on March 2, 2013 and of U.S. provisional application number 61/772,239, filed on March 4, 201 Sand of U.S. provisional application number 61/772,257, filed on March 4, 2013 and of U.S. provisional application number 61/775,852, filed on March 1 , 2013 and of U.S. provisional application number 61/775,867, filed on March 11, 2013 and of U.S. provisional application number 61/788,698, filed on March 15, 2013 and of U.S. provisional application number 61/821,495, filed on Ma 9, 2013 the disclosures of which are incorporated herein by reference in their entirety. The present application is a continuation-in-part of U.S. patent application number 1.5/703,436 filed on March 17, 2016 which claims benefit of international application number

PCT/US2014/0561 5, filed on September 7, 2014 which in tur claims benefit of U.S. provisional application number 61/878,979, filed o September 17, 2013 and of U.S. provisional application number 61/930,359, filed on January 22, 2014 and of U.S. provisional application number 61/930,370, filed on January 22, 2014 and of U.S. provisional application number 61/955,614, filed on March 19, 2014 the disclosures of

7 which are incorporated herein by reference in their entirety. The present application is a continuation-in-part of United States patent applicatio number 14/834,336 filed on August 24, 2015 which claims the benefit of U.S. provisional patent application number 62/051,355 filed on September 17, 2014, and of intern ional application

PCT/US2014/018096 filed on February 24, 2014 which claims benefit of U.S.

provisional application 61/768,397, filed on February 22, 2103 and of U.S. provisional application number 61/768,494 filed on February 24, 2103 and of U.S. provisional application number 61/771,847, filed on March 2, 2013 and of U.S. provisional application number 61/772,239, filed on March 4, 2013 and of U.S. provisional application number 61/772,257 filed on March 4, 2013 and of U.S. provisional application number 61/775,852, filed on March 11, 2013 and of U.S. provisional application number 61/775,867, filed on March 1.1, 2013 and of U.S. provisional application number 61/788,698, filed cm March 5, 2013 and of U.S. provisional application numbe61/933,037, fi led on January 29, 2014 the disclosures of which are incorporated herein by reference i their entirety.

Field of the Invention

[0001 J The present invention relates to features of a manufactured assembly and more particularl to methods and assembly features of a manufactured laminated assembly.

Summary

[0002] The ability to manufacture goods efficiently and with superior functionality has long been a key determinant of economic success for individuals, enterprises and societies. Contrary to popular perception, most innovation takes place through an evolutionary process in which pre-existing elements are recombined in surprisingly useful ways, rather than as a radical departure from the status quo. This is true of innovations in apparatus and methods and also in manufacturing techniques. [0003] The history of manufactured goods spans a long series of transitions across materials (from wood, stone and leather to gold, copper, bronze, iron and steel and on to various synthetic materials Including, among others, man-made polymers. Likewise, the techniques of manufacturing have evolved from the preparation of individual items through the development of interchangeable parts, moving assembly lines and various photolithographic techniques for the preparation of circuit hoards, integrated circuits and micro-electromechanical (MEMS) systems.

[0004] MEMS systems predominate among mechanical devices at the micron scale and typically involve the bulk addition and removal of materials in serial fashion from a single substantially planar substrate. Traditional, machining and fabrication practices are readil applicable to devices from centimeter scale up to meters (e.g. large machine tools and dynamos).

[0005] While these developments have led to a remarkable abundance and variety of products, one that would astound the most prescient individual of a century ago, there remain apparatus and systems that are persistently difficult, time-consuming and consequently expensive to manufacture, in particular,, manufacturing at the millimeter scale, remains challenging for a variety of reasons.

[0006] The inventors of the present invention has conceived and implemen and a fundamental advancement in manufacturing technology at this millimeter scale. As described, for example, in PCX patent application number PCT/US 2014/018096 (W 0201.4130967) (the disclosure which is herewith incorporated by reference in. its entirety) the present inventors have crea ed a useful and fundamentally novel manufacturing technique (as exemplified in numerous devices) that readily allows mass production of millimeter scale mechanical, electromechanical, pneumatic and hydraulic devices,, among others, at high volume and low cost and demonstrating robustness and effectiveness unmatched by other technoiogies in the prior art,

[0007] This new technology and method includes the assembly of more or less flexible and more or less rigid layered materials in a generally two-dimensional format and, thereafter, activating these assemblies to achieve operative systems with multiple degrees of freedom and, in many cases, a generally three-dimensional aspect. This groundbreaking technology is termed uMECS™.

[0008] Now, having achieved still further advancements, and thereby achieving surprising and unexpected results, beneficial to the technology broadly, and to the numerous and various disciplines that it improves and enables, the inventors herewith present systems, methods and apparatus related to high- olume manufacturing at die millimeter scale.

[0009] The methods presented here enable high volume, low cost fabrication of tiMECS™ components. These processes represent significant improvements to throughput and cost over state of the art prototype methods, enabling pMECS™ components for high volume consumer markets.

[0010] Throughout this work a reference component, the Thumper™ Haptic Communicator (THC), is used to quantify process im rovements for a component targeting high volume consumer markets. A preferred embodiment of THC fabrication at high volumes follows the detailed description of inventions.

A summary of key innovations that enable high volume uMECS component manufacturing include:

* Use of a printable / patternab!e rapid curing adhesive for multilayer lamination and component assembly. Rapid cure mechanisms include pressure sensitive adhesives (PSA), light curing (LJV / visible), delayed light cure, and thermal snapcure adhesives with setting / cure times <5 minutes. A reduction in lamination cycle time from 5 hours to < 1 minute is possible,

* Use of a high throughput, batch adhesive patterning process based on die cutting, screen/stencil printing, jetting, pad printing, or photo-patterning. To fabricate THC using state of the art UV laser machining requires 30 minutes per part. Ba ch processes can. pattern an. entire panel in seconds per adhesive layer.

* Use of mask-less adhesive printing processes to assemble linkage and spacer sub-laminates. In many cases, linkages and spacers do not require independent adhesive patterning; the adhesive pattern matches that of an adjoining ply. In this scenario, the material ply can be used as a mask to define the adhesive pattern in continuous or batch processes. Example processes include ultrasonic spray (deposit adhesive in seconds per ply) and selective wet/dry etching (remove adhesive in minutes per batch).

* Use of printed flex circuits as linkage laminate and spacers. Examples include using double-sided stainless steel flex circuits or fine line copper circui ts as linkage laminates. Fabrication steps are analogous to those employed in the manufacture of flexible Printed Circuit Board (PCB) (e.g. photolithography and wet etch features). This method enables high throughput linkage and spacer fabrication with existing PCB manufacturing lines. An additional benefit is bridge-less rigid plies; stainless steel ca be patterned with material islands, retained to webbing by flex material, improving throughput and capital equipment cost. (Mylar TM polyester).

* Use of a rapidly machinable carrier for substrate transport. This method enables direct patterning of islands of material in μΜ ECS plies, unsupported by bridges (but supported by carrier). The aim of this method is to simplify release processing; by patterning rigid structural plies (e.g. stainless steel) without bridges, releas thin, easily madiined plastic: films,: Example carriers include a thin film, rapidl machinable substrate (e.g, Polyimide, Polyester) or soluble film that ean.be dissolved after lamination (e.g. olyvinyi Alcohol). In; the case oi linkage laminates the ilex ply can double as a ear&r fiim_f: further simplifying: processing,.

[0011] Having examined and understood a range of previously availabl .^■ devices, the inven ors of the¹ present i dention has developed a n w an important

understanding of : the pro ienis associated with the prior art and, opt of this novel understanding, has developed new and useful solutions and improved devkes including solutions and devices yielding surprising and beneficial results,

[0012] Certai exemplary structures,, prepared according to principles of th invention, will include laminated structures created, f om: substantially flat source layers of material. Three-dimensional assemblies are formed through subtrartive machining and additive lamination of these flat layers. Siieh a methodology create two and a hal dimensional structu es built from the la ers. In addition, certai three-dimensional structures will be added to the assembl for their beneficial, effect.

[0013] For example, Th micro-Mnitilayer Itched Composite Systems (^iMECS™) process Is used to manufacture low profile electromechanical systems. Generally, pMECS components consis of linkage mechanisms fabricated by layering sheets of patterned, rigid and flexibl materials. The simplest embodiment of a uMECS component, a flexible hing ('flexure'), consists of two rigid links connected by a compliant bending beam. The flexure approximates th -motion of a pi joint by elastically deforming under applied loads. Flexures exist at many scales, however the uMECS process enables very small (0.1 millimeter to 10 centimeter) hinges. [001 ] The unit flexure hinge can be fabricated using the generic process described below (See Figure 1). Previously, methods have been described for preparing uMECS™ systems at prototype manufacturing volumes,

[0015] The invention encompassin these new and useful solutions and improved devices is described below in its various aspects with reference to several exemplary embodiments including a preferred embodiment.

[0016] These and other advantages and features of the invention will be more readily understood in relation to the following detailed description of the invention, which is provided in conjunction with the accompanying drawings. It should be noted that, while the various figures of the following drawings show respective aspects of the invention, no one figure is intended to show the entire invention. Rather, the figures together illustrate the invention in its various aspects and principles. As such, it should not be presumed that any particular figure is

exclusively related to a discrete aspect or species of the invention. To the contrary, one of skill in the art will appreciate that the figures taken together reflect various embodiments exemplifying the invention.

[0017] Correspondingly, referenced throughout the specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearance of the phrases "in one embodiment" or "in an embodiment" in various places throughout the specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. [0018] in the interests of clarity,. the^:it nQ in:g.'d-e&ii.ttp.na are prov ded;

[0019] Flexure: A hinge comprised f a. compliant material that elastkat!y deforms, approximating the motion of a pin, joint

[0CJ20 ] S« ferrate: in the context qt : a μ ECS^'i¾i component, suhstra te refers: to material that provides hiBctio andis retained within, a ^ ECS-^W component

[0021 ] Chip:; In contrast to substrate,, chips are present during fabrica ion hut are sacrificial and released from the finaJ ^MECS^xy component

[0022] Bridge: in th context of p ECS^T¾S bridges retain substrate material to surrounding webbing during processing. Bridges are released to free the μΜΕΟβ™ component degrees of freedom.

[0023] Release: The act of freeing substrate and chip from surroundin webbing, usually by breaking bridges. Partial, or interoiediate release refers to bridge removal prior to freeing the final part from webbing (singulation).

[0024] Plies:. Individual material layers in a μΜΕ€8¹ laminate composite.

[0025] Lamination: Substantially permanent bonding of pMECS^w plies. Usually lamination occurs tinder heat and/or pressure to cure an adhesive,

[0026] Sub-laminate: A laminate that is not a final p ECS^:i¾ produc but will be subsequently bonded to additional plies to form the final laminate. [0027] Linkage: Laminat A laminate or sub amiriate that contains flexure binges anc rigid links,

[0028] Spacer: Generically, spacers are ny piles wi¾in a I¾ ECS laminat that do not contain Ifexuxes and are not adhesive. Spacers can. serve many functions but

laminates (t:,e. as. part of the rigid links within, a. traditional Mnematk inkage^, or kinematic mounts for sutvco ponen.ts,

[0029] Adhesive Plies: Adhesive plies^■within a pMECS^¾i laminate generieall describe adhesive connecting linkages and spacers. Adhesive is typieally uniquelly patterned for selective adhesion between sub-laminates, and is therefore considered, a ply; this is not typical within standard composites manufacturing,

[0030] The following description is provided to enable an person skilled in the art to make and use the disclosed inventions and sets forth the best ^'modes, presently contemplated by the inventors of carrying out their inventions. In the followin description, for purposes of explanation, numerous specific details are set fo th i order to pro vid a thorough understanding of ^'fe. i:e^jri myen ion.,lt.Wiii be.

apparent however, to one skilled in the art that the present invention may be practiced without: these specific details, in other instances, well-know structures and devices are shown in block diagram form in order to avoid unnecessaril obscuring the substance diselosed. These and other advantages and features of the invention will be more readily understood i relation to the following detailed description of the invention, which is provided i conjunctio with the

accompanying drawings. [0031] It should be noted that, while the various figures show respective aspects of the invention, no one figure is intended to show the entire invention. Rather, the figures together illustrate the invention in its various aspects and principles. As such, it should not be presumed that any particular figure is exclusively related to a discrete aspect or species of the invention. To the contrary, one of skill in. the art would appreciate that the figures taken together reflect various embodiments exemplifying the invention,

[0032] Correspondingly, referenced throughout the specification to '^"'one

embodiment" or "an . embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearance of the phrases "in one embodiment" or "in a embodiment" in various places throughout the specificatio are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

Brief Description of the Drawings

[0033] Fig. 1 shows, in flowchart form, certain aspects of a prototype scale process according to principles of the invention;

[0034] Fig. 2A shows, in schematic perspective view elements of a device prepared according to principles of the inventio i an un-laminated state;

[0035] Fig. 2B shows, in schematic perspective view, a device similar to that of Fig. 2 A in a completed state;

[0036] Fig. 3A shows a printed circuit manufacturing line illustrative of equipment that will optionally be employed in practicing certain aspects of the present invention; [0037] Fig. 3B shows a horizontal conveyorized printed circuit manufacturing station illustrative of certain equipment that will optionally he employed in practicing certain aspects of the present invention;

[0038] Fig. 4A shows, in schematic plan view, a portio of a layer or ply prepared to be included in a device prepared accordin to principles of the invention;

[0039] Fig. 4B shows_., in schematic side view, certain aspects of a manufacturing process and manufacturing equipment according to principles of the invention;

[0040] Fig. 5 shows, in flo diagram form, a portion of an exemplary photo patterning method according to principles of the invention;

[0041] Fig. 6 shows, in schematic cross-section certain states of a ply during a process according to the inve tion;

[0042] Fig. 7 illustrates, in flow diagram form, a method for delayed adhesive curing according to principles of the invention;

[0043] Fig. 8 illustrates, in flow diagram form, a method for a two pass thermal snap adhesive cure according to principles of the invention;

[0044] Fig. 9 illustrates, in flow diagram form, method for employing hybrid cure adhesives according to principles of the invention;

[0045] Fig. 10 illustrates, in flow diagram form, certain aspects of a method according to principles of the invention;

[0046] Fig. 11. illustrates, i flow diagram form, further aspects of a method according to principles of the invention;

[0047] Fig. 12 illustrates, in flow diagram form, still additional aspects of a method according to princi les of the invention;

[0048] Fig. 13 illustrates, in flow diagram form, yet other aspects of a method according to principles of the invention;

[0049] Fig. 14 illustrates, in flow diagram form, certain additional aspects of a method according to principles of the in vention;

[0050] Fig. 15 illustrates, in flow diagram form, still more aspects of a method according to principles of the invention;

[0051] Fig. 16 illustrates, in flow diagram form, other novel aspects of a method according to principles of the invention; [0052] Fig. 17 Illustrates, m schema tic perspective view, certain., aspects of an electro-mechanical de ice prepared: by a m th d accordin to principles 0f the invention;

[0053] Fig, IS illustrates, In schematic cress- section, certain additional aspects of an electro-mechanical device prepared ¾y a-met od, according to principles of the invention;

[ OS4] Fig. 19 Illustrate!, in flow diagram forh^ certain further aspects, of manufacturing method according ½ piandpj.es· of the -indention;;

[0055] Fig's .2OA~20D illo stra te, in flow diagram .form, a : manuf actnrift process fo manufacturing pMECS^ electromechanical device prepared according to principles of the invention;

[0056] Fig' si 21 A-21 B : illustrate, in schematic, cross-section, respective operational states of an electro-mechanical device prepared by a method according to principles of the inven tlo ;

[0057] Fig's 22A~22B Illustrate, in- sche atic cross-section and schematic

[0058] Fig.23A Illustrates, in schematic cross-section, respect e operational states of a substantially conventional mechanical device;

[0059] Fig's 23B-23C illustrate,.. In schematic cross-section, respect ve embodiments of electro-mechanical devices prepared by a method according to principles of th invention;

[0060] Fig's 2 and 24B Illustrate, in schematic cross-section, respective operational, states of substantially conventional devices and contrasting electro-mechanical devices prepared by a method according to principles of the invention

[0061] Fig. 25 illustrates, in schematic cross-section, certain aspects of an electromechanical device prepared by & method according ro principles of the invention;

[0062] Fig, 26A and 26B illustrate, shows in schematic cross-section, certain respective aspects and operational states f an eiectro-meehanicai device prepared b a method according to principles of the invention

[0063] Fig. 27 illustrates, in schematic cross-section^ certain aspects of a further electro-niechanical device prepared by a method according to principles of the Invention; Detailed Description

[0064] The following description is provided to enable an perso skilled in the art to make and use the disclosed inventions and sets forth the best modes presently contemplated by the inventors of carrying out their inventions. In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the present invention, it will be apparent, however, to one skilled in the art th the present Invention may be practiced without these specific details, in other instances, well-known structures and devices are shown in block diagram form in order to avoid unnecessarily obscuring the substance disclosed.

[0065] Fig. 1 shows a block diagram corresponding to certain steps of a

generalized manufacturing process 100 for manufacturing a ^tMECS™ device.

Beginning at step 102, the process involves forming a pattern in one or more generally planar sheets of a more or less rigid, material. In a typical application, at least one of the sheets will be substantiall rigid, h certain applications, the generally rigid material may have an anisotropic characteristic such that it is more or less rigid along one axis than along another.

[0066] In various applications, the sheet will include a material such as, for example, fiberglass reinforced polyester, carbon reinforced polyester, or any other filled or reinforced polymer material. Alternately or in combination the generally rigid material may include a metallic material such any appropriate metal or metaliic alloy. The forming of a pattern in such a sheet of material will include, in certain exemplary applications, the remo al of material by photolithographic etching, the removal of material by laser machining, patterning of the material by the application of a die and/or the removal of material by the application of a cutting tool. In addition, additive processes ma be used in forming the patterned sheet. [0067] At step 104, a pattern is formed in one or more sheets of a generally planar flexible component material. In various applications, the generally flexible material may be substantially flexible. In certain applications, the flexible material may have an anisotropic characteristic such that it is more or less flexible along one axis than along another. Patterning of the generally flexible material will proceed in any manner appropriate to the material including, among others, any of the processes identified above with respect to the rigid material.

[0068] At step 106, a patter is formed in one or more sheets of an adhesive component material. In various cases, the adhesive material may be substantially flexible. In other cases, the adhesive material will be substantially rigid. I certain cases, the adhesive material may have an anisotropic characteristic such that if Is more or less flexible or rigid along one axis than along another. Patterning of the adhesive material will proceed in any manner appropriate to the adhesive material including, among others, any of the processes identified above with respect to the rigid and flexible materials.

[0069] As indicated at step 110, fixturing apparatus is provided for alignment of the various sheets of rigid, flexible and adhesive material prepared in steps 104 - 108. In certai embodiments, the fixturing apparatus will include alignment pins such as are known in the art. In other embodiments the fixturing apparatus will include active alignment actuators and/or optical alignment devices.

[0070] As indicated in step 112, an assembly is thereafter prepared by applying the previously prepared and patterned (and in some cases unpattemed sheets of material) to the fixturing apparatus. It will he appreciated that the patterns and materials will, in certain embodiments, differ from sheet to sheet according to the requirements of a particular application. Moreover., in certain cases, one or more sheets of adhesive material may be omitted in favor of applying adhesive individual sheets and/or surface regions. The adhesive material will be applied, in any manner that is, or becomes, known in the art. By way of example only, the adhesive material may be applied in liquid, powder, aerosol or gaseous form as individual sheets are added to the assembly ,

[0071.] As will be understood fa one of ordinary skill in the art in light of the totalit of the current presentation, the characteristics of the various layers and patterns will be chosen and applied according to the requirements of a particular assembly being prepared. Thus, for example, where a joint feature is required, a prepared void in substantially rigid sheets above and below a flexible layer will leave a portion of an intervening flexible layer exposed and ultimately able to flexibly support the adjacent more rigid materials.

[0072] As indicated in step 114, curing conditions are then applied to the assembled materials and/or fixturing apparatus. In certain embodiments, the curing conditions wil l include the application of heat and/or pressure to the assembly of layers. In other embodiments, the curing conditions will include the application of physical or chemical additives such as, for example, cataly tic chemicals, reduce tempera ures, gaseous chemical components, or any other condition appropriate to secure a desirable unification of the various layers into an integrated assembly.

[0073] As per step 116, the integrated assembly is, in certain embodiments, then removed from the fixturing apparatus. In some embodiments the integrated assembly is transferred thereafter to additional fixturing equipment, in other embodiments, and as will be understood by one of skill in the art, the integrated assembly remains on the fixturing apparatus for further processing. [0074] In step 118, a method according to certain embodiments of the invention will include the removal of certain portions of one or more of the rigid and/or flexible layers. These portions will have served to support particular regions of the correspondin layer during the preceding processing steps. Their removal will allow one or more of those portions to translate, rotate, or otherwise reorient with respect to some additional portion of the assembly. This step may include the removal of individual assemblies from a iarger sheet/assembly on which multiple assemblies of similar or different configurations have been prepared.

[0075] In certain embodiments, the removal of particular support regions will be effected by laser machining. In various other embodiments, the removal of support regions will be effected by mechanical machining, wet chemical etching, chemical vapor etching, scribing, cutting, die cutting, punching, and/or tearing, among others. One of skill in the art will appreciate that any combination of these methods (or other methods that are known or become known in the art) will be beneficially applied and will fall within the scope of the invention,

[0076] Once the removal of identified portions of the one or more rigid and/or flexible layers is complete, the assembly is activated, as per step 120 to transition from its existing status to a post-activation configuration. This activation will, hi certain embodiments, include reorientation of certain portions of one or more regions of one or more of the sheets of material. Thus, for example, in certain embodiments, a portio of the assembly will fold up out of its initial plane to form a three-dimensional assembly in the manner of a pop-up book.

[0077] The activation 120 will incorporate various motions in corresponding embodiments of the invention including various translations and rotations along and a bout one or more axes. In respective embodiments, the activation will be

by; the -action ©f ^'an.indjyrdual. ^'' orke ,: by a robotic device;, by a device integrated within th assembly itself such as^ fo : example, a spring a motor, a piezoelectric actuator, a bimetal/bimorph device, a magnetic actuator, electromagnetic aefuat©r,_: thermal expansive or cor¾tractiv« device, a ebemical reaction a eludin ^ gas. generating process, a crystallkation process, a dehydration process^ polymerization process,, or any other processor device appropriate to the. requirements ^: of. a particular application.

[0078] In certain embodiments, and as indicated: at step. 122, a further process step will secure the apparatus in its activated configuration. Among other methods that will be evident to one of skill in the art in light of th presen t disclosure, this step of securing the apparatus in its activated configuration will include, In- certai

embodiments^ point soldering, wave soldering, tip soldering, wire bonding, electrical welding, laser welding,, ultrasonic welding, thermal bonding, chemical adhesive banding, the activation of a ratchet and pawl device, the activation of a helical imidifeetional gripping d evice, the application of a snap, a hook and loop fastener, a rivet, or any other fastener or fastening method that is known or becomes know to those of skill In the art.

[0079] Qf course it will be understood by the reader that in certain embodiments, the process or mechanism that reorients the apparatu s in to its acti vated

configuration will serve to maintain that configuration without any additional step 122 process or action. Moreover, while th securing indicated at step 122 is generally anticipated to be permanent, in certai applications it will be beneficially temporary and/or repeatahle.

IS [0080] At step 124 additional scaffolding elements will be removed or severed to release the activated and secured uMECS™ device from any remaining scaffolding.

One of skill in the art will appreciate that this step will be unnecessar where the device was completely released from any associated scaffolding prior to activation. Moreover,, in other embodiments and applications the activated device will remain coupled to surrounding scaffolding for additional processing steps. To the extent that step 124 is applied any of the approaches and methodologies identified above at, for example,, step 118 will be advantageously applied according to the instant circumstances.

[0081] Thereafter, again depending on the requirements of a particular apparatus or embodiment, various testing, packaging, systems integration and other

manufacturing or application steps will be applied as indicated in step 126 after which the operatio concludes with step 128,

[0082] Fig. 2 A shows certain elements 200 of an assembly consistent with, for example, process 100. The elements include a first patterned substantially rigid layer 202, a second patterned substantially rigid layer 204, a patterned substantially flexible layer 206, and first 208 and second 21.0 patterned adhesive layers.

[0083] As shown, the pattern of each exemplar layer includes apertures, e.g., 21.2, 214 for receiving corresponding fixturmg pins or dowels, e.g., 216, 218. These fixturmg dowels serve to maintain a desirable alignment of the various patterns while die assembly is compressed and curing of the adhesive layers 208, 21.0 is accomplished.

[0084] The result, as shown 230 in Fig, 2B is an exemplary hinged assembly 232 that has been released f om a surrounding scaffolding material 234 by the severing of various support regions, e.g., 236. As is readily apparent the released assembly includes a hinge feature 238 coupled between first 240 and second 242 substantially rigid members. As further shown in the magnified portion region 244, each substantially rigid member includes an upper rigid portion 246 and a lower rigid portion 248 coupled to respective sides of the flexible portion 250 by respective layers of cured , or otherwise activated, adhesive material 252, 254. It will be further appreciated that, while no securing step is apparent in relation to the hinged assembly 232, other assemblies wilt benefit from such further processing.

[0085] According to principles of the present invention, tiMECS componen ts can be fabricated in-line, one component at a time, or in batches. When using parallel processes (e.g. etching), manufacturers should fit as many components as possible onto a single panel to minimize unit cost and improve throughput. For example, 600 x 600 or 1200 x 1200 are used in low volume production, however panel size should be chosen based on equipment capabilities, throughput, and required tolerances.

[0086] Fig. 3A shows, for example, an automated vertical wet processing system 300 for the processing of printed circuit boards. The system includes a plurality of individual chemical processing and rinse tanks, e.g., 302, 304, 306. Robotic equipment, e.g. 308,, 310 can be applied to move substrate materials and

subassemblies between the various processing and rinse tanks to effect desired etching steps, such as those further described below. Typically, the work in process materials will be temporarily coupled to machine racks that are effective to readily interface with the robotic equipment 308, 310 and suspend the work in process material within the tanks.

[0087] Fig. 3B shows an alternative style of processing equipment 350 in which work in process materials are conveyed through a processing chamber 352 while supported from below by

a series, of saeh: stations, Again the work In process will, in particular embodiments of the invention, includ■ individual plies of Ε ^8 '^? material and or multi-layer sa assemhiies,

[0 B8] Fig. 4A. illustrates, in schematic plan view, a portion of a ^MECS™

component ply 400 prepared according to principles of the my fitioti. Iri. certain embodiments, the ply 4Q0 wili mclnde a material such as, fo example, a stainless steel material, a spring steel material, a metallic alloy material, or any other material desi able in a. particular application of the inventio .

[0089] After etching i any high-volume proces of the current invention, the ply will include land areas, e.g. 402, 404, 406 and scaffolding regions 408. Apertures, e.g. 410 412 are defined by respective edges of the land areas, e.g. 416, 418, 20.

[0090] In certain embodiments of the inve tion, bridge material, e.g. 422, 424 will be temporarily left in place between respectiv Sand areas and/or land areas and scaffolding regions. It will he appreciated by one of -skill in the art; that these bridge materials will fee removed du i g later processing. As will be further described below, in other embodiments of the invention, the desired ply material 400 will be pre-lamlnated wi h a sacrificial layer of, for example, a polymer m terial.

Consequently no bridge material will he left in place. Instead, the sacrificial layer will be, e.g., dissolved, evaporated or burned away during late processing,

[0091] it will ^'be understood that the application of automated vertical and horizontal chemical processing, according, to principles of the invention, will allow the production of high-qualit layers and subassemblies a substantially higher throughputs and,, ultimately, lower per part cost as compared with laser etching. The resulting economic efficiencies will allow the application of MECS™

manufacturing techniques to produce wide variety of consumer and industrial components and devices.

[0092] Adhesive patterning and cure time are the primary targets for increased pMECS production throughput. As a high throughput alternative to laser-cutting B- staged film, ad hesive ca be patterned during deposition on plies or sub-laminates. Various high volume adhesive deposition methods are described below:

Scree / Stencil Printing As demonstrated in electronics assembly, adhesives of many cure types (e.g. light, thermal, PSA) can be screen / stencil printed. Generally, screen printable adhesives are high viscosity and thixotropic liquids or pastes. Screen / stencil printing is successfully implemented in precision, high volume applications such as flip chip packaging, die attach, solar cells, and MEMS packaging with demonstrated trace and space down to lOlLm/lOlLm.

[0093] A fine stainless steel mesh >325 with thin emulsion can achieve fine line, thin bond line (<1 mil) results. For high throughput pMECS, automated screen printers used in electronics assembl can coat each panel in seconds in an automated assembly line. Example adhesives for thin bond line, fine line screen printing include DUALBO D OB787 (DELO), H70 line of epoxies (Epoxy Teehnol-ogy), and

Ablebond 8387 (Henkel). For liquid and paste adhesives, bond line can he difficult to control in a laminate.

[0094] According to principles of the invention, high- volume production can be achieved in part by the application of adhesive patterning technologies including adhesive jet printing, diecut adhesive film, adhesive transfer printing, adhesive spraying, and the applica tion of adhesive B-staglng along with any of of these technologies. [0095] Adhesive patterns can be printed using high speed jet dispensing, for example ink jet. Example hardware is the Nordson ASYMTE Dispensejet DJ-9500 or DELO-DOT PN2, capable of dispensing adhesive down to lSOlLm dots at 300 Hz. Complex adhesive geometries with thin bond line can be achieved by depositing dot patterns with predictable flow when compressed. Bond line can be maintained using the Bond Line Control processes below,

[0096] A common technique for substrate die attach, B-staged epoxy or acrylic adhesives are die-cut from adhesive carrier and placed at precise locations onto a substrate. Die cutting is a possible application for pMECS components with adhesive patterns containing simple, repea table shapes. Die cutting can be combined with higher precisio methods (e.g. laser machining) to achieve high throughput and small features. An example adhesive film is ESP7670-WL (AI Technology inc.), which is thermally cured in, for example, under 10 minutes.

[0097] Transfer printing employs an etched or engraved plate to pick up and transfer a pattern of adhesive to substrate. Processes to transter adhesive patterns to u ECS™ plies include rotogravure, f iexographic printing, stamping, pad printing, or any other process to physically transfer a patter of liquid adhesive to a ply.

[0098] Spraying is a further process for rapid deposition of thin adhesive coats on patterned plies, in general, spraying is used to coat an entire ply with adhesive in under 5 seconds. A variety of liquid adhesives can be sprayed (e.g. epoxies or acrylics), including B-stageable materials.

[0099] Fig. 4B illustrates, in schematic elevation, the application of an exemplary spray deposition process 450 according to principles of the invention. As shown, a previously etched component pl 452 is supported for processing on, for example, a conveyor or table 454. in certain embodiments, and as illustrated, the conveyor or table 454 will include a screen or textik material having members arranged longitudinally, e.g. 456 and transversely 458 to a longitudinal axis 460 of a

processing station, in this arrangement, apertures 462 are present between the textile members. A spray nozzle 464 is disposed, for example, above the component ply 452.

[0100] As illustrated, un cured adhesive material 466 is sprayed towards and onto the component ply 452. The adhesive material 466 will self pattern on the component ply 452, forming a layer of adhesive 468 on the land areas of the component ply and passing through 470 apertures 472 of the component ply 452. The resulting layer of adhesive 468 may thereafter be immediately placed i contact with further component plies, be allowed to dry by evaporatio of a solvent and/or be B-cured for later processing.

[0101] Excess adhesive material 466, 470 having passed through apertures 472 of the component ply, 472 is collected 474 for disposal and/or recircula ion.

[0102] In certain embodiments of the invention, the conveyor or table 454 will advance 476 to move the component ply material 452 past the spray nozzle 464 to ensure distribution, of the adhesive ma erial in an even, layer 468 on. the componen ply 452. In other embodiments of the invention, the spray nozzle 464 will be mobile, and moved 478 to achieve this end. In certain other embodiments of the Invention, both the spray nozzle 464 and the conveyor or table 454 will move.

[0103] It will be appreciated by one of skill in the art that multiple spray nozzles will, in certai embodiments, be employed in parallel and, that in certain embodiments^•imHlti-!CQiSi orient^ad esives^{^} ill be sprayed throu h a single nozzle and/or through discrete respective nozzles. In addition^ sn certain embodiments, Inkjet spray ' nozzles will be employed such that rasteriii of the spray n zzle and/or: t e supporting conveyor or table will allow specific patterning of me adhesive layer 468,

[0104] Selective adhesion can be achieved using a physical shadow mask registered to a machined ply. Masks are not required for linkage or spacer laminate plies when adhesive pattern, is identical to adfo ed ply. In this case_>: the ply acts as a. mask by collecting op / oil: its surface ¾#h mihiihai deposition on. sidewall or across holes. Exemplary resul ts m obtained fe deposi tin 3-25 prn B-stageahle epoxy using a ultrasonic sprayer :( .g.^ Ultrasonic Systems &c,) ofi. steel, and. po!yirmde substrates,

[0105] Fig, 5 shows, In- flow diagram for , a portion of an exemplary method 500 of photo-patterning of adhesi e on a substrate ply or sub-laminate. According to the illustrated method, a hybrid adhesive (i,e. two cure mechanisms) is photo- lithographically patterned then cured using a second mechanism, An example is a hybrid UV / thermal cure adhesive.

[0106] Ihe Fhoto-Patteniing process is analogous to photolithogra hy steps in MEMS or PGB fabrication, Example commercial adhesiyes in MEMS include BCB

as stainless steel and apton, Accordingly, in certain embodiments,, a custom formulated adhesive will be applied in practice of the invention. In certain

embodiments, photo-patterned adhesive process according to principles o the invention, enables small line / space (2 mil / 2 mil) using existin PCS and flex circuit processin equipment. OI O7 ί¾· 6 shows, scherriatie cr ss-seehoh, certain states 60Q of a ply or sub- l.aniiB.atei602 during, fpr eKampI , the. method 500 £ Fig. 5. eferr n now te both Fig, 5 and Fig. 6, firs ply or suh-lamift&te 602 is provided 30 . for processing,

[0108] The fksl ply or sub-laminate :602 is shown in Fig.6 as having land areas,, e.g., 604 and pertures, c ^ 606, As will fee apparent from Fig. 6, and from the discussion above with respect to Fig. # B, adhesive; coating of the land areas b liquid, or solid (particulate spray, sheet,: gel methods will be employed according to th requirements of: a particular Y i«m.e m.annfecturing application. Thus, Irs. the illustrated embodiment, the method 500 includes depositing (e.g. spray, dip, blade, unroll,, etc.) 504 the liquid liquid, or sheet adhesi ve onto a firstply.

[0109] Where a liquid adhesive is employed, after application it is soft baked 506 to remove solvent, drying and immobilizing it fo processing. Dependin SOS on the requirements of a particular application, a mask will be applied 510 to pattern the adhesive. Thereafter, the uncured adhesive not covered by the mask is exposed to ultraviolet light 512 t activate the first stage cure mechanism, affixing but not fully curing on a pl (B-stage). A photo-tool, or mask is used to selectively B-stage certain regions of adhesive that remairs in the laminate, it will be appreciated by one of skill, in the art tha negative cure adhesives and negative mass will also be beneficially applied in certain circumstances, in which ease exposed adhesive will remain uncured while masked adhesive will cure_^

[0110] ^'Thereafter;, uncured adhesive is removed by solvent or developer strip 51 , without damaging B-staged adhesive, Next, a second ply is registered 516 and, thereafter, cured with heat 518 (i.e, by convective;, conductive and/or radiative heating). Finally,, the fully cared assembl is emoved 520 for inspection, packaging and/dr further processing,

[0:111 ] With, reference now to Fig. 6 it will be noted thai apertures 60S in the ply 602 may be temporarily filled prior to thti: application, of ad esive, by fixturin and or a removable filler suc as wax arid/or polymer rnaterial, where : appropriate to the requirements of a particular embodiment. T s temporary filler may later be removed, physically, and/or by chemical dissolu ion, therffial n elHrig, ImrMng, etc.

[0112] Thereafter, a: laye of adhesive 610 is applied to the first ply or sub-laminate 602, Where liquid adhesive is employed;, after application it is soft baked 612 to remove solvent, drying and immobilizing the adhesive layer 61.4 tor processing.

[0113] Depending on the req irements of a particular application,, a. mask will be applied 616 to pattern the adhesive. In certai embodiments, the mask will include a single layer of material regions tl a t are, respectively, opaque 618 and transparent 622 the curing wavelengths. In other embodiments (and as illustrated), a layer of opaque material 622 will be supported by a layer of iransparent material 624,

[0114] Once masked, the uneure adhesive not covered by the mask e.g., 626 is exposed to curing radiation such as, for example, ultraviolet light 628. This exposure is continued with a duration and or intensify sufficient to activate the first stage cure mechanism, affixing but not fully curing {B~stage} the adhesive 610.

[0115] Thereafter, the mask is removed 630 and uneured adhesive 632 is removed from the ply or sub-iammate 602 b solvent or developer strip 314, without damaging B-staged adhesive. The result is a patterned B-staged adhesive 634 disposed at respective surface areas 636 of the ply or sub-laminate 602, [0116] Either immediately, or after inspection and/or storage, a further ply 637 and/or component and/or sub-laminate is registered 516 and, thereafter, cured, e.g., with heat 638 (Le, by coiivec ive, conductive and/or radiative heating), by die application of a chemical catalyst, or other means. Finally, the fully cured, assembly is removed 640 inspection, packaging and/or further processing.

[0117] Liquid or paste adhesives deposited by Inkjet or screen print have difficult to control bond lines. Several techniques are available that maintain a thin, controlled bond line to meet the requirements of the present invention. These include, among others, the incorporation, of solid particles, such, as those found in electrically or thermally conductive adhesives; the use of a rigid sheet of material of the required bond line thickness between plies; and a two-step adhesive printing process, wherein a first layer of adhesive is deposited and cured to create a separation between plies during the second adhesive cure step,

[0118] A further novel and beneficial improvement includes the application of rapid curing adhesives in high-volume manufacturing of μΜΕ€5™ components and systems. Whereas state of the art pMECS™ prototyping requires 30 minutes tack bond and 5 hour cure per lamination, the cycle times are not compatible with high-volume productio methods according to the present invention. One exemplary high-volume product would require four lamination cycles during production, or 22 hours in a press; a major bottleneck to high volume production.

[011.9] Advantageously, a method according to the invention includes the simultaneous lamination of multiple panels and, thereafter, rapid cooling in a second press, freeing the heated press to conduct further processing during the cooling stage of already-hea ed work in process materials. [0120] In a further embodiment of the i ention_^ plies and/or subdaniinates and/ or components are combined using a Fyralux^'1- adhesive; data sheets suggest 5 minutes a 250: ° C is sufficient It should, e noted that this solution re uires prohihiMvely high temperature for certain materials, and cornes a the cost of increased laminate stresses.

[01 ] High throughput adhesives, particularly used in electronics assembly, are alternatives to the slow BrS ged Pyralux material A wide range of adhesives are compatible with ECS, and a iini versal solutio doesn't exist fdr all applications and materials. Careful consideration of substrate material compatibility, required throughpnt, deposition method, cured adhesive properties (e-g- Young's modulus^ peel strength, bond line, feature size), and cost are required for .¾MECS adhesive selection. Example embodiments are presented here i the context of buildin the THG, a stainless steel and polyimide construction.

[Q122] Light curing adhesiv.es Light (or radiation) cure adhesives are activated by JV or visible light and ha ve full cure times on the order of seconds, some lower than Is, Light curing adhesi ves are typically single component with a. long shelf life, making handling and storage easy. Many light, cure adhesi ves are ..manufactured, for high volu me electronics assembly by ^'major adhesive companies such as Henke! an d 3M, .Although heat will speed up cure reactions, light activated adhesives can cure at room temperature, eliminating thermal mismatch and enabling a wide range of materials in μΜΕ€5^ΤΜ components. Light curing adhesives generally have a faster processing time than thermal, however selection should also consider material ply compatibility, cost, desired throughput printing method, and cured mechanical properties. [0123] A solution for opaque μΜΕΟΒ laminates is a pre-activated light curing adhesive. Pre-activated adhesives have a delayed airing mechanism; the adhesive has a working time of several seconds af er light exposure, during which the two materials can he registered and joined. One example adhesive is a delayed cure cationic such as KATIOBOND 4595 (DELO).

[0124] Fig. 7 illustrates, in flow diagram form, a method or process 700 for delayed UV / visible light airing adhesive beneficially applied in certain embodiments the present invention. According to method 700, effective results will be achieved by screen printing 702 KATIOBOND 4595 (DELO) onto a JAMECS™ linkage laminate, 'the printed pattern places adhesive only in areas required for selective adhesion to another laminate. Thereafter,, expose 704 the epoxy to 460nm wavelength light (55mW/cni2 intensity for 5s) to pre-activate the curing mechanism. Thereaf ter, optically register 706 a second lamina e to the first using visio recognition of fiducia!s o both laminates. Preferably, registratio will happen within the 18s open time of the KATIOBOND 4595, or the corresponding open time of an alternative adhesive. Thereafter, apply 708 very light pressure (<5 PS1) to affix the two laminates while the adhesive cures.

[0125] The bonded laminates are strong enough for further processing 710 (e.g. subsequent release and lamination cycles), however the adhesive will reach full strength 712 within 24 hours at room, temperature.

[0126] Thermal snap cure adhesives are formulated for high volume electronics assembly and can come as a one or two part printable liquid or paste, or a B-staged film. Additionally, adhesives can be printed directly onto a laminate and B-staged for later processing. To bond plies with thermal cure adhesive, heat can be applied by convection oven (e.g. batch or tunnel oven), direct contact (e.g. press, heated stamps,, or therrnades}, induction (for electrically conductive p ies}, and. infrared radiators. Settin time for sna cure adhesives can be lower than 1 minute,, allowing, fast panel lamination and release cycles. For some dhesives, a thermal post-cuie will be required to reach full strength, which can be processed in large batches.

[0127] A hesive selectio criteria includes pattern de-position method (e.g. screen, jet), compatibility ply materials, throughput requirements, and cured

mechanical properties (e¾. Young's Modulus, shear strength, and bo d line).

Example adhesives include H70 -4, B7DE, and M! epoxies (Epoxy Technology), DE-LO ONOPOX MK055 (DELO), and ABLE-BOND 8387B (Henkel).

[0128] Fig. 8 illustrates, in low diagram form, a method or process 800 for a two- pass thermal snap cure MECS™ process. According to method 800, effective results will be achieved by screen printing 802 1 mil DILOMGNOPOX M )55 (or equivalent) adhesive paste on top of a μΜΕ€8™ linkage laminate. Thereafter, register 804 a second linkage laminate using dowel pins through interference fit holes in the laminates; bring the two laminates in contact 806. Tliereafter, directly apply heat 808 (200 ^a C) using a heated stamp to the top substrate for :6s to snap cure the adhesive. ^'The resulting laminat can undergo further processing (e.g.

intermediate release and subsequent lamination) or final release.

[0.1.29] Fig, 9 illustrates, i flow diagram, form a method or process 900 for the application of hybrid cure adhesives in a pMECS™ process. Designed for

applications with bond regions ^shadowed from light, hybrid cure adhesives can he activated with U¾ / visible light to bond transparent substrates or an exposed adhesive fillet. Final cure strength is achieved by a therm a! cure. In pMECS, the edges of a bonded laminate can be light-cured, to establish bond strength for additional, processing (e.g. release and subsequent lamination). Once all process steps are complete, an entire laminate can be thermally cured for full bond strength.

[0130] According to method 900, effective results will be achieved by screen printing 902 1 mil hybrid UV/therrna! cure adhesive (e.g. DELO DU ALBOND OB787 or equivalent) onto a pMECS linkage sub-laminate. Thereafter, register 904 a second linkage sub-laminate using dowel pins through interference fit holes in the laminates. Thereafter, bring the two laminates in contact 906, Subsequently, expose 908 to 55mW/cm2355nin UV light for 9 seconds, curing the adhesive exposed around edges. Thereafter, continue processing 9^'H) the new laminate (e.g. release, subsequent lamination, or component pick and place). Oven cure 912 the shadowed adhesive at 1.50C for .1.0 minutes. A large batch of panels can be simultaneously cured.

[0131] Alternative cure mechanisms, according to principles of the invention, with iMECS™ applications include humidity cure and anaerobic cure, and combinations of any of the foregoing. In addition, hybrid cure adhesives have application in subcomponent assembly, especially electromagnetic or other actuation components. B-staged adhesive A modified version of the thermal snap or radiatio cure adhesives. Adhesive is printed directly onto linkage or spacer sub-laminates during their fabrication. The adhesive is B-staged, forming a dry, immobile, film that can. be handled or processed later. B-staging ca occur by one of several mechanisms, including solvent evaporation or first stage (for a hybrid adhesive) cure. B-staging printed adhesives provides several advantages for storage, handling, and

processing. First, adhesive deposition and. printing can occur at a separate facility, or at a separate time from the multilayer lamination and cure step. Additionally, B~ staged material can have highly controllable bond line and be of higher molecular weight (more advanced cure), reducing flow. [01.32] Fig. 10 illustrates* in flow diagram form., a metho or process 1000 for an exemplary -stage adhesive process for Ε€Β^{Ϊ Μ} According to rrieth d ΙΟΟΐϊ, effective results -will-foe achieved by fabricating 1002 _:a linkage or spacer sub- iaffimate, ¾ereaf ef : screen printing 1004 adhesive or to the constructed laminate. Thereafter;, B-siagin the d esive 1 06 b evaporating solvent, forming a 25 μ dry film that wt!lnot cure or damage when subjected to shipping, andlings or storage conditions; and thereafte shipping 1008 the sub-laminate and adhesive fo assembly at a separate facility,

[0133] Pressure Sensitive Adhesives (PSAs) are commonly used in hi

throughput .lamination ^'-applications. Liquid precursors can foe printed o liner or directly o substrate, then dried or UV cured in-lin to form a tacky surface; die cuttin or digital { laser) converting transfer tape is also feasible. Second substrate can then be registered and cured with brief application of pressure. Thin bond line (0.001") and -^'.fin -features (<0.006") are possible with PSAs. Downsides to PSAs include lower adhesive strength, high temperature resistance, and mobility after placement However, their fast, low cost processing makes them a candidate for some uMBCS applications.

[0134] The present Invention includes systems and methods for reducin manufacturing- time Including reducing the time required, lor release ot completed components from suriOunding scaffolding structure, Prototype production of the pMBCS™ THC release uses a 20W 355nm UV laser to drill individual bridges that retain sub-strate to webbing. Laser drilling is applicable to vol-ume production, and widely^' used in rigid and flexible FGB manufacture for via drilling,- routing, and depanelirtg. The appropriate laser technology will depend on materials and feature size, ho wever UV, IK, and C02 lasers are broad ly applicable. Alternatives to laser release include die cutting and routing_., also commonly used in PCB manufacturing.

[0135] Release process time is dominated by thick, poor maehinability materials like stainless steel.. In production, specialized tools are required for high throughput release of rigid materials. The Stencil-Laser G6080 (LPKF), for example can machine up to 800 stainless steel bridges per minute using a $200k system. For a complex, high throughput component like THC (450 bridges per part), each laser is only capable of 1-2 PPM throughput. In addition, the specialized II laser thermally damages most other materials like polyimide and adhesive.

[0136] It's advantageous to minimize or eliminate rigid material bridges by substituting a more machinable material. Several solutions exist for linkage and spacer laminates that enable release to thousands of bridges per minute. For

example, in certain embodiments and applications, it is advantageous to machine individual plies on a sacrificial film carrier. Each uMECS ply, laminated to a sacrificial film, ca be selectively etched to pattern substrate and chi islands. The film carrier is removed or decomposed. The following represent materials

advantageously employed in various embodiments of the invention.

A) Soluble films. For example polyvinyl alcohol (water-so.lub.le), MEMS wafer processing films (isopropynol-soluble), and dry film photoresist (developer-soluble). These films can be batch dissolved after lamination.

B) Thermally decomposing films. For exampie thermoset plastics that degrade during or after lamination.

C) Melting films. For example hot melts or wax that melts during or after lamination. D) Biodegradable films. For example biodegradable PEL Degradation is sIow¾. however can be aeeefcrated with externa.! mechanisms such as at r ότ heat. QX37] Linkage laminates are an irttpor tanl el ment of m ^' pMEC£P^¾i

components, and include of rigid links and exiire :hinges. Exemplary composite tomi a e.∞i¾stmc½0«.½ciy.i!l.€S at least two rigid material lies sand wfching one flexible material ply, and hinges are nominally created usin the process desc bed above with respect td Fig, 1.

[0138] The materi l-mdependent composite layup of a¾ linkage laminate is: [Rigid / Adhesive / flexure / Adhesive / Rigid], however adhesiveless constructions are also possible. An alternative construction includes just one rigid layer bonded to one flexure layer, however designs Incorporating this construction are susceptible to peel stress delaminatlon during flexure bending.

[0139] In certain aspects, the present invention includes methods for high volume linkage laminate production. For example, one embodiment is a. straightforward adaptation of the c rrent prototype methods, however using high-throughput processes and equipment In this method, each material ply (two rigid, one flexible) is machined using an appropriate process for the material, thickness, features^ tolerances, speed, and cost. Candidates include but are not limited to,

photochemical machining (etching), laser cutting, water-jet cutting, die cutting, electrofbrming, and electrical discharge machining (EDM),

[0140] Like printed circuits .jiMECS™ planar features can be evaluated by 'trace and space', a linear dimension tha t represents the smallest physical features and smallest holes that can be .machined. THC, for example, requires trace space as small as 8 mil / 2 mil in linkage laminates. Chemical etching is a strong candidate for THC's thin gauge stainless steel and polyimide construction. Etching has an added benefit of minimal post-processing time because there are no chads, burrs, or machining stresses.

[0141] The Pre-Pattemed Plies method uses an adhesive patterned prior to lamination,, however is agnostic to selective adhesion process. One embodiment of the Pre-Patterned Plies method is illustrated in Fig, 11.

[0142] Fig. 11 shows, in flow diagram form, a method and process 1100 of preparing pre-patterned plies including wet etching 1102 two 0.002" AISi 304 full hard stainless steel (rigid) piles and one 0.001" apton polyimide (flexure) ply with desired geometries. Thereafter, both stainless steel plies are coated 1104 by spraying 0,0005" thick (dry) B-staged epoxy using an ultrasonic sprayer (Ultrasonic Systems Inc). Plies are registered and retained by dowel pins 1106. Subsequently, the

[Stainless / Epoxy / Kapton / Epoxy / Stainless] composite is laminated 1108 under heat and pressure. Many linkage laminates can be laid up and pressed in parallel to increase throughpu t.

[0143] Fig. 12 shows,, in flow diagram form, a further exemplary method and process 1200 that employs plies similar to those of method 1100. However, plies are laminated with an iin-paherned adhesive, which is machined after lamination by chemical etching, plasma etching, or thermal decomposi ion. The adhesive material can be applied in a uniform film, compatible with the material plies,, and selectively removed after lamination. Examples include but are not limited to: B-staged film (epoxy or acrylic), pressure sensitive adhesive (PSA), and thermoplastic (hot melt). In this method, the rigid pre-patterned plies can be used as a mask, or an additional mask can be applied (e.g. photoresist) to protect the rigid plies from the adhesive removal process.

[0144] Process 1200 include the steps of wet etching 1202 two 0.002" AISI 304 full hard stainless steel (rigid) plies and one 0.001" Kapton polyimide (flexure) ply with desired geometries. One of skill in the art will appreciate that the indicated ratios are intended to be multiplied according to the desired throughpu of the process. The un-patterned adhesive doesn't require precise registration; oversized clearance holes can be punched into the adhesive, allowing dow the construction el pin pass- through. Accordingly_., punch large clearance holes through adhesive sheet 1204. ^'['.hereafter, using 0.000500 thick DuPont Pyralux FR B-staged film adhesive (a modified acrylic), lay up and laminate 1206 the [Stainless / Acrylic Kapton / Acrylic / Stainless] composite under heat and pressure. Rigid and flex plies are registered and retained by dowel pins 1208. Many linkage laminates can be laid up and pressed in parallel to increase throughput. Thereafter, the laminated assembly is subjected to a 100% oxygen cold gas plasma 1210 (e.g. Plasma Etch BT~1) to etch exposed adhesive. Tlie rigid stainless steel acts as a mask, protecting underlying adhesive from etching. Etch power and duration should be precisely controlled to prevent damage to the Kapton once adhesive has been removed.

[0145] Fig.13 illustrates, in flo diagram form, a still further aspect of the invention in which two outer rigid plies are laminated to the central flex ply before machining. The assembly can be adhesive based or adhesiveless, meaning rigid plies can be directly bonded to the flex material. An example adhesiveless construction employs DuPont' s Pyralux AC copper-clad Kapton. Each ply of the laminate is selectivel machined using etching (chemical or dry) processes to form links and hinges. [0146] A benefit of the pre-laminatio.n method is the capability to pattern

unsupported islands of material in rigid plies. The islands are adhered and retained to webbing by the flex ply. The pre-laminated structure improves release throughput and cost by eliminating rigid ply bridges; flex material can. be machined faster and with lower energy.

[0147] With further reference to Fig. 13, for a stainless steel and Kapton po!yimide linkage laminate an exemplary process 1300 includes constructing 1302 the composite laminate: [Stainless / Epoxy Kapton Epoxy / Stainless] from 0.001500 AISl 304 full hard stainless steel, 0.000500" Kapton HN (DuPont), and 0.00100 Hanwhaflex HGB-E500EG (Hanwha L&C) epoxy. Thereafter, mask 1304 and

selectively photoche.mical.1y machine (wet etch) 1306 the two stainless steel plies. Retained features are masked using a patterned, dry film photoresist. Each layer requires a separate phototool and must be registered precisely during photoresist exposure; <0.0005" registration is achievable using state of the art PCB exposure equipment. Substrate and chips are adhered directly to Kapton and require no bridges to webbing. Photochemical etching industry standards can achieve 3 mil / 3 mi! trace and space, with the possibilit of smaller features depending on. required yield.

[014.8] Subsequently, selectively wet etch 1308 the two epoxy plies

simultaneously. The resulting patterned features match those of the stainless steel; no undercutting is required. Features are masked using a patterned, dry film

photoresist. Each layer requires a separate mask and masks must be registered precisely during exposure. [0149] Finally, selectively wet etch 13 0 the apton polyimide, retaining flexure hinges and bridges. The Kapton will connect the entire pMECS component in webbing for later processing steps (e.g. lamination and release),

[0150] The High Density Interconnect (HDI) flex circuit is another specific embodiment of the Pre~Lamination Method. HDI technology is driven by the demand for increased density in rigid and flexible PCBs, with trace / space requirements lower than 30jtm. In the HDI embodime , a single or double-sided flex circuit is used as the linkage laminate, with copper as the rigid layer. Flex material (base substrate or dielectric in PCB terminology) is chosen based on material, properties and process conditions; commonl polyimide,, polyester, and flourocarbon are used,

[0151] Fig. 14 shows, in flow diagram form, a further high-volume manufacturing method 1400 termed the Hybrid Machining Method. The Hybrid Machining Method enables fine, tight tolerance features with improved unit cost anci throughput over pre-machining methods. In general. Hybrid Machining is applicable to pMECS linkage laminates with infrequent precision features. An example application is flexures with smaller and tighter tolerance features than other planar features. In this case, precisio flexure pre-machining (e.g. b laser) can be combined with high throughput methods (e.g. etching) for remaining features.

[0152] in this context, method 1400 includes using, for example, a 355nm UV laser with 10 μ spot size to machine 1 .02 35 μ x 100 μ flexure hinge gaps into 0.00200 AiSI 304 full hard stainless steel plies. Include flduclals and. dowel pin holes for realignment. Thereafter, laminate 1404 the stainless steel plies to a 0.000500 Kapton HN flex ply, forming the [Stainless Epoxy / Kapton / Epox / Stainless] composite. Thereafter, apply 1406 0.00100 Hanwhatlex HGB-E500EG (Hanwha L&C) for the epoxy. Thereafter, register 1408 the two steel layers using dowel pins, it should be noted, however, that the apton and adhesive require no alignment and can be punched with dowel pin clearance holes. Thereafter, selectively wet etch 1 10 the remaining features in the two stainless steel plies. Retained features are masked usin a patterned, dry film photoresist. Each layer requires a separate phototoot and must be registered to the pre~machined flexure gaps precisely during exposure. Only substrate and chip material is retained in the stainless steel; islands of materia] are bonded to Kapton, Thereafter, selectively wet etch 1412 the two epoxy plies simu! taneou sl .

[0153] The patterned features match that of the stainless steel; no undercutting is required. Retained features are masked using a patterned,, dry film photoresist. Each layer requires a separate mask and masks must be registered precisely during exposure. Thereafter, selectively wet etch 1414 the Kapton polyimide, retaining flexure hinges and bridges. The Kapton will support the u ECS component in webbing for later processing steps (e.g. lamination and release).

[0154] Spacers are generally rigid materials used to separate linkage sub-laminates or serve as mechanical ground in pMECS laminates. Common examples include patterned 0.002" -0,025" polyimide or steel sheets. In general, spacers ca be fabricated by any machining method (e.g. laser, die cut, waterjet, chemical etch, EDM, e!ectroforaimg) appropriate for the material, thickness, feature size, and tolerances.

[0155] Often, spacers require features smaller than the constraints imposed by material thickness. In this case, spacers can be fabricated from many thin materials that are machined, stacked, and laminated to achieve the desired thickness. An example is a 0.023" stainles steel spacer with minimum slot size 0.006". This high aspect ratio hole is difficult to machine from stock. One solution is to chemically etch four 0.005" stainless sheets and adhere them with 0.001" adhesive. In this case the adhesive pattern identically matches that of the spacer material, and can be pa terned using processes such as process 1200 or process 1300 , for example, as described above.

[0156] Similar to linkage laminates, thick spacer bridges can be eliminated by using the Pre-Lamination Method described in relation to process 1300 above.

However, a thin, machinable film or foil must be added to spacers in lieu of the flex ply in linkages. A consequence of the Fre-Laminated Spacer in Carrier is a reduction in stiffness and yield strength at the thin carrier and adhesive interface. However, this method is suitable for components subjected to relatively low forces.

[0157] Fig. 15 shows, in flow diagram form, exemplary process 1500 to fabricate, for example, a. carrier-supported 0.006" stainless steel spacer. Process 1500 includes laminating 1502 two 0.002" AISi 304 FH stainless steel sheets to a 0.001" apton HN polyimide film using Hamvhaflex HGB-E500EG epoxy, forming the composite

[Stainless / Epoxy / Kapton Epoxy Stainless]. Thereafter, chemically etching 1504 the two stainless steel plies with the desired spacer pattern. Retai only substrate and chip material, without bridges. Thereaf ter, chemically etch 1506 the Hanwhaflex epoxy plies with an identical pattern to the stainless steel spacer. Thereafter, chemically etch 1508 the Kapton film, leaving bridges to retain the stainless spacer to webbing. This step can be omit if Kapton is fully machined during release steps.

[0158] It should be noted that the Preiarninaied Spacer on Carrier Method can additionall be used to join two consecutive spacers with different patterns in a pMECS laminate. The only required change to the above process is using different top and bottom mask for chemical etching. [0X59] Fig. 16 shows, in flow diagram form, still further eiieficiai. rioeess 1600 according to principles of the indention.. In this prpees 1600 three linkage laminate

relation, to process 1300* Each linkage laminate requires four photo-tools; two to define steel and adhesive,: and two (identical) to define Kaptqn. Linkage laminates are fabricated: as fellows.

[Q160J Laminate 1602 the t o 0^0035" stainless: plies and 0.0005" aptdn ply using 0.0005" Hanw!mfle HGB-ESQOEG adhesive, forming the symmetric composit

[Stainless / Hanwhaflex / Kapton / Hanwhaflex / Staintess|. Thereafter, laminate 1604 dry film photoresist to bot sides of the composite. Subsequent!^ precisely register 1606 bottom and top s e photo-tools and selectively pattern the resist. Thereafter, chemically etch 1608 both stainless steel plies, Jeaving islanda-of material for substrate and chips. This is followed by chemically etching 610 the Hanwhaflex plies- o match the adjoining stainless steel, followed by resist strip. Thereafter, laminate 16 2 a new dry Elm resist to both sides; and thereaf ter precisely register 1614 Kapfon pattern photo-tools to the etched stainless and pattern the resist.

1¾ereafter, selectively etch 161.■ through the Kapton layer from both sides. Strip the resist 1618. Kapton will serve as both flexure bridge and thin film carrier for th linkage laminates.

[0161 The pMEGS™ laminate consists of 3 linkage la inates, 7 s acers, and 9 unique printed adhesive layers,

[0162] THC has seve stainless steel spacers of the following thicknesses: SI) 0.002", S2) 0,005", S3) 0.011% S ) 0.005^ 55} 0,005", S6) 0.017" 97) 0.023".. All spacers are chemically etched on carrier using the Fre-Laminated Spacer on Carrier Method (Section 4.4.1). The minimum feature si¾e all plies k T^'50j tm (0.006''), however typical minimu efched bole size Is 110% materiai thickness; Excepting SI each spacer: is divisible by Q Q05" sub-la ihates and 0,001" adhesive between each siih- laminate (e.g. S3 is constructed, of two (LOOS" sub-laminates bonded by 0.001" adhesive). Therefore, a standardized.0,005" spacer construction is used; [Stainless / Epp y / Kapfcon Epoxy / Stainless], with 0,0015" 304; full hard stainless steel, 0.0005" Hanwhaflex HGB-E500EG epoxy, and ,0.0005" E>uPont olyimide Kapton; HN. The

assembly.

£0163] The THC is presented as an exemplary application of manufacturing process according to principles of the invention. THG is a nonlinear haptic motor for mobile and wearable electronics, its .manufacturer is herewith described to illustrate the application of mass production methods to piMEGS™ processing.

|01641 In Ib s context Fig. 17 shows, in perspective view, a portio of a THC 1700, prepared according to principle of the invention. Haptic actuator 1700 includes, inter alia, a motor portion 1706. Moto portion 1706 is coupled throiigh a first transmission portion 1708 to a first inertial mass 1710. Motor portion 1706 is also •coupled through a second transmission portion 1712 to a second inertial mass 1714.

[0165] In the illustrated embodiment, the motor portion 1706 includes a. linear motor apparatus having a movable armature coil 1716. The movable armature coil 1716 is arranged generally co centrically about a longitudinal axis 1718 of a stator element 1720. The apparatus is arranged such thai;, during operat on of the haptic actuator 1700, the movable armature coil 1716 moves substantially linearly in a direction substantially parallel to longitudinal axis 1718. [0166] A keeper element, 1722 includes an external surface region 1724 and an internal surface region 1726. A portion 1 28 of external surface region 1724 is disposed substantially normal to longitudinal axis 1718. Intemal surface region 1726 defines an intemal spatial region 1730 of the keeper element 1722, within which is disposed, at least, respective portions of stator element 1720 and armature coil 1716.

[0167] In certain embodiments of the invention., stator element 1720 includes a permanent magnet. In some embodiments of the invention, the keeper element 1722 includes a permanent magnet. In other embodiments of the invention, one or both of the stator element 1720 and the keeper element 1 22 exhibit negligible permanent magnetism.

[0168] In certain embodiments, one or more of the stator element 1720 and the keeper element 1 22 will include a respective plurality of laminated sheets of magnetic material. In certain embodiments, the laminated sheets of magnetic material will include iron as an elementary metal and/or as a d emical compound. One of skill i the art will appreciate that, in certain embodiments, the keeper element 1722 will include a further portion (not visible in Fig. 17) such th t the keeper element 1722 forms a substantially closed magnetic loop encircling the stator element 1720.

[0169] In other words, the THC includes a magnetic voice coil actuator driving a tungsten alloy mass through a MECS™ linkage transmission. The transmission augments the linear voice coil motion and moves the masses along a complex trajectory. Prototype fabrication of THC has been carried out using the laser-based process outlined above with respect to Fig. 1. [0170] An outline for a THC production process targeting >6PPM throughput is outlined here. This process highlights only μΜΕ05™ laminate and sub-component assembly; sub-coin portent manufacturing is omitted for clarity. One of skill in the art, however, readily understand and practice the invention once in possession of the present disclosure.

[0171 ] The Bill of Materials THC consists of the following com onents:

* Ix pMECS laminate including:

3x Linkage sub-laminates; [Stainless / Epoxy / apton / Epoxy / Stainless] constructed from 0.0015" 2x AISJ 304 FH stainless steel, 0.0005" Ix Kapton. H (DuPont), and 0.001" Hanwhaflex HGB-E500EG (Hanwha L&C) epoxy film adhe-sive.

* 7x Spacers; A1SI 304 FH stainless steel (multiple thicknesses 0.002" - 0.023")

* 9x Unique adhesive layers; screen printed KATIOBOND 4595 (DELO) UV pre-activated adhesive.

* 5x In ermediate, and Ix final release steps

* 2x Tungsten alloy masses

* 1.x Coil

* Ix Magnet Assembly (NdFeB magnet and yoke)

* 1 X Enclosure, which includes circuit trace for external routing and bond pads for coil, leads

[0172] In one embodiment of the invention, THC is manufactured in 600 x 600 panels to achieve required tolerances using photochemical machining processes. The total THC footprint is 20.8mm x 7.9mm, and each panel contains 50 components and fiducials for optical alignment. [0173] Fig:. 18 shows in sche atic efoss-seciiori, a portion of a lamin te: composite: structur 1800 highlighting certain linkages/ aces and printed adhesive within the THC. As will be evident nppn inspection of the figure, the illustrated laminate includes three linkage laminates, seven spaces and nine unique printed adhesive layers, These elements are. illustrated as follows, Inclii ding linkage layers [LI] 1802, [L2] 18G4, and | L3| 1806, Also included are spacer layer sf 51] 1808, |S2_:11810, |53] 1812, [S4] ISli, j¾3] 18 6, [S6] 18Ϊ 8 and [S7] 1820, These elements are substantially firmly coupled to one another with the illustrated adhesive layers 1S22, 1824, 1826_* 1828, 1830, 18a¾ 1834 and 1836.

|0174] The general process to fabricate S2-S7 spacers on carrier,: using three: photo- tools per unique sub-laminate is shown in Fig.19, in which th process is designated 1900 and mclttd.es the steps of:

1 ) Construct 1902 the [Stainless Epoxy / Kapton / Epoxy / Stainless] composite.

2) Selectively etch 190 through both sides of stainless steel (two masks), followed by epoxy etch 1906, to pattern substrate and chip features:

3) Seiectiveiy etch 1908 through Kapton from one side (one mask); the Kapton ply retains ail features to webbing by bridges.

Spacers S3, ¾ and 87 are constructed using two, three, and four sub- laminates, respectively, SI is a single-sided 0:002"^' [0.001" stainless / 0.0005" epoxy / 0.0005"^' Kapton] composite, requiring only two photo- too Is.

[0175] Fig. 20 A~D illustrates, in flow diagram form, a portion of a detailed assembly process; 2000 for an exemplary μΜΕ€5^'ΤΜ device prepared according to principles of the invention. With three linkage and thirteen spacer sub-larninates in band, the pMECS assembly process can begin. The lamination adhesive is light curing KAHOBO D 45952 (DELO). The selected, adhesive is a thixotropic paste and can be screen printed to 0.016'7 0.006" trace and space with.0.00.1." bond line.

KATIOBO D 45952 is pre-activated using 460nm light for 5 seconds at 55mW/cm2 intensity. Open time after pre-activation is 18 seconds. Final cure strength is reached 24 hours after exposure,, however laminates are siifficientiy bonded for further processing immediately followin the open time.

[0176] The following lamination process 2000 is used to manij-facture THC (see Figure 9). For shorthand., refer to Linkages 1.-3 as [LI j...[L3], spacers [SI ]..,|S7j, and printed adhesive patterns identified b their adioining sub-laminate (e.g. [L1-S5]).

1} Screen print adhesive 2002 pattern [S1-S2] onto spacer [SI] (12s / panel).

2} Pre-activate adhesive 2004 with 460nm light (5s / panel).

3) Optically register and Laminate 2006 spacer [S2] to [SI] (18s / panel).

4) intermediate laser (355nm IN) Release 2008 of Kapton in [SI / S2] (3s / part).

5) Screen print adhesive 2010 pattern [S2-S3] onto spacer [S2j (12s / panel).

6) Pre-activate adhesive 2012 (5s / panel).

7) Optically register and Laminate 2014 spacer [S3a j to [SI / S2j (18s / panel).

8) Screen print adhesive 2016 pattern [S3-S3] onto spacer [SI / S2 / S3a] (12s / panel).

9) Pre-activate adhesive 2018 (5s / panel).

10) Optically register and Laminate 2020 spacer [S3b] to [SI / S2 / S3a] (18s / panel).

11) Screen print adhesive 2022 pattern [S3-S4] onto spacer [SI / S2 / S3] (12s / panel),

12) Pre-activate adhesive 2024 (5s / panel). .13) Optically register and Laminate 2026 spacer [S4] to [SI / S2 / S3] (18s / panel). Set sub-laminate [SI / S2 / S3 / S4| aside,

14) Screen print adhesive 2028 pattern jLi -S5| onto linkage [LI] (12s / panel).

15) Pre-activate adhesive 2030 (5s / panel).

16) Optically register and Laminate 2032 spacer [S5] to [LI] (18s / panel).

17) Screen print adhesive 2034 pattern [S5-S6] onto laminate [LI / S5] (12s / panel).

18) Pre-activate adhesive 2036 (5s / panel).

19) Optically register and Laminate 2038 spacer [S6a] to [LI / 55] (18s / panel).

20) Screen print adhesive 2040 pattern [S6-S6] onto laminate [LI / 55 / S6a] (12s / panel).

21 ) Pre-activate adhesive 2042 (5s / panel),

22) Optically register and Lamina e 2044 spacer [S6b] to [L / S5 / S6a] (18s / panel).

23) Screen print adhesive 2046 p ttern [S6-S6] onto laminate [Li / S5 / S6ab] (12s / panel),

24) Pre-activate adhesive 204.8 (5s / panel).

25) Optically register and Laminate 2050 spacer [S6c] to [LI / S5 / S6ab] (18s / panel).

26) Scree print adhesive 2052 pattern [S6-L2] onto laminate [LI / 55 / S6] (12s / panel).

27) Pre-activate adhesive 2054 (5s / panel).

28) Optically register and Laminate 2056 linkage [L2] to [LI / S5 / 86] (18s / panel).

29) Flip laminate 2058 [LI / S5 / 56 / L2] ( s / panel), 30) Intermediate laser (355n.m UV) Release 2060 of aptors. in [L2 / S6 / S5 / LI 1 (3s / part)

31 ) Flip laminate 2062 f L2 / S6 / S5 / Li] (Is / panel ) .

32) Intermediate laser (355nm UV) Release 2064 of Kapton. i [LI / S5 / S6 / L2j (3s / part)

33) Remove Chips 2066 by vacuum from the work surface.

34) Screen print adhesive 2068 pattern [L2-S7] onto laminate [LI / S5 / S6 / L2j (12s / panel) face.

35) Pre-aetivate adhesive 2070 (5s / panel),

36) Optically register and Laminate 2072 linkage [S7a] to [LI / S5 / S6 / L2| (18s / panel).

37) Screen print adhesive 2074 pattern [S7-S7] onto laminate [LI / S5 / S6 / L2 / S7a] (12s / panel)

38) Pre-aetivate adhesive 2076 (5s / panel),

39) Optically register and Laminate 2078 linkage [S7b] to [L / S5 / S6 / L2 / S7a] (18s / panel).

40) Scree print adhesive 2080 p tern [S7-S7] onto laminate [LI / S5 / S6 / L2 / S7ab] (12s / panel)

41) Pre-aetivate adhesive 2082 (5s / panel).

42) Optically register and Laminate 2084 linkage [S7c] to [LI / S5 / S6 / L2 / S7ab] (18s / panel),

43) Scree print adhesive 2086 patter [S7-S7] onto laminate [LI / S5 / S6 / L2 / S7abc] (12s / panel)

44) Pre-aetivate adhesive 2088 (5s /^' panel).

45) Optically register and Laminate 2090 linkage [S7d] to [L I / S5 / S6 / L2 / S7abcj (18s / panel).

46) Screen print adhesive 2092 pattern [S7-L3] onto laminate [LI / S5 / S6 / L2 / S7] (12s / panel) 47) Pre-activate adhesive 2094 (5s / panel).

48) Optically register and Laminate 2096 linkage [L3| to [LI / S5 S6 / L2 / $7] (18s / panel). Set sub-laminate [LI / S5 / S / L2 / S7 / L3] aside.

49) Screen print adhesive 2098 pattern [S4-I..1] onto sub-laminate [SI / S2 /

53 / S4] (12s / panel).

50) Pre-activate adhesive 2100 (5s / panel).

51) Optically register and Laminate 2102 sub-laminate [LI / S5 / S6 / L2 / S7] to [SI / 32 / S3 / S4[ (18s / panel).

52) intermediate laser (355nm UV) Release 2104 ot^* Kapton in [SI / S2 / S3 /

54 / LI / S5 / S6 / L2 / S7 / L3J (lis / part).

53) Remove Chips 2106 by vacuum from work surface.

54) Dispense AT1OBOND 45952 for Coil 2.1.08 assembly (0.3s / part).

55) Pre-activate adhesive 2110 (5s / panel).

56) Pick and Place Coil 2112 into the laminate (0.3s part).

57) Dispense KATIOBOMD 45952 for Mass 2114 assembly (0.6s / part).

58) Pre-activate adhesive 2116 (5s / panel).

59) Pick and Place Mass (2x per part) into the laminate 2118 (0,6s / part),

60) Pick and Place 2120 Enclosure onto the laminate (0.3s / part).

61) Laser Weld 2122 Enclosure to SI base plate (0.3s / part).

62) Laser Weld 2124 Coil leads to Enclosure bond pads (0.3s / part). Flip laminate [Si / S2 / S3 / S / L / S5 / S6 / L2 / S7 / L3] (Is).

63) Dispense ATIOBOND 45952 for Magnetic Sub-Assembly 2126 bond (0.3s / part).

64) Pre-activate adhesive 2128 (5s / panel).

65) Pick and Place Magnetic Sub- Assembl 2130 into the laminate (0.3s / part).

66) Final laser (355nm UV) Release 2132 of Kapton in [L3 /

S7/L2/S6/S5/L1/S4/S3/S2/S1] (15s / part). The part will fall from webbing. [0177] l¾e d lECS invention will, in its various

in the: art and those yet to he discovered. Virtually any material i sheet, foil, or film- for catl he included, in a p E B^i¾i laminate . However, a presently preferred set of materials prevails in most current MEC ^M fabrication based on material

properties, cost, and manuiactura-hility. The following is a short-list of materials,

applications,

• Rigid structural (e.g. linkage and spacer),, 0,001-0.01" sheet / foil / film: Stainless steel, Cold rolled steel,. Aiamiiwm ;Copper,, I¾ly iide, Polyester

^■ Flexure, 0,0003-0.002" film: Poly imide (e.g. Kapton), Polyester (e.g. Mylar)

^• Adhesive, 0,0001-0,002" cured bond line; Epo ies, Acrylics

[01 8J As previously discussed, a process lite that exemplified above with respect to the THC module will be beneficially applied to a wide variety of other millimeter scale electromechanical devices and

of providing additional non-limiting examples, it will be understood that pMECS™ technology is applicable to the production various devices as discussed below.:

[0179] Fig's 21 A and 21B show respectively, in linkage schematic form, alow-- energy operational stat 21.00 and a high-energy operational state 2102 of a hapfie actuator device prepared at millimeter scale and em ploying motion controlling linkages prepared with methods according to the invention. Consistent with the THC described above, the device includes a mechanical ground 2104 {here in the form of a case). A varying electrical signal drives a voice coil 2106 in substantially linear oscillator motion 2108 in what is h re illustrated, as a vertical direction. [0180] The oscillatory motion is coupled through respective μΜΕ05^τΜ mechanical linkages 2110, 2112 into first 2114 and second 2116 oscillating masses. This imparts to the masses respective oscillatory motions 2118, 2120 which in the low-energy operational state 2100 remains substantially linear. When configured at or near a natural frequenc of the system, the masses 2114, 2116 tend to receive and

accumulate energy supplied by the voice coil 2106.

[0181] As energy accumulates, however, the system traverses a threshold resulting in a transition of the motion of the masses 2114, 2116 from the linear trajectories 2 8, 2120 more complex trajectories - illustrated 2102 as respective J-trajectorles 2122 2124. This change of trajectory results in a release of energy in a direction transverse to the original oscillations 2118, 2.120 of the masses and is experienced by a user of the device as a "tap." It will he appreciated that a variety of other complex trajectories and configura ions can be developed with devices that are prepared by processes that fall within the scope of the present invention.

[0182] Fig. 22A and 22B show, respectively in schematic perspective view and linkage schematic form, a low-energy operational state 2200 and a high -energy operational state 2202 of a further haptic actuator device prepared at millimeter scale according to principles of the invention. Like the device of 2 A and 21B, this device accumulates energy from an internal motor when operating in its low -energy state. In contrast to the device discussed above, this energy is stored in angular

momentum, rather than oscillating linear momentum. Nevertheless, when the device makes a transition from operational state 2200 to operational, state 2202, a portion of the stored energy is converted into a helical motion having upward, component 2204 and resulting in a " tap" signal perceptible to a user outside of the sy stem. It should be noted that certain embodiments of a haptic actuator prepared in this

configuration can produce an extremely precise haptic signal. [0183] Fig. 23A illustrates, in schematic cross-section, a substantially eoiwentional Linear Resonant Actuator (LR^) 2300.. The LEA . n ludes rnechaBicai ground 2302 in die form_: of a case, a Flezo electric driver 2304,.

by the P!ezo electric driver 2304. When operating near a natural frequency of the system, a substantial mechanical output can fee produced.

[01 ] However, as illustrated in Fig, 2% a similar signal can. be produced, by a device 2308 prepared accordin to principles of the in enti n, within a sr&alfe spatial volume when the Piezo electric, actuator 2310 djriyes:tb»e<ma.ss. 312 through a single stage pMECS^'m linkage 2314. Moreover, a similar effect can be produced while operatin the Piezo electric actuator at a lower frequency.

[0185] Fig, 23C shows a furthe pMECS™ device 2316 whic a two-stage linkage 2318 is employed.

[0186] Fig's 2.4 A and 24B compare conventional acoustic transducers 2400, 2492 t pMECS™ technology acoustic transducers 2406, 2408 respectively. The practitione of ordinary skill in the art will readily ascertain tha the voice coils 2408, 2410 of the conventional devices ar disposed and move coaxial to vertically oriented axes 2412, 2414.

[0187] In contrast, the driving coils 2416, 2418 of the iMECS™ devices move in transverse direction and are coupled to respective output membranes 2420, 2422 through respective pMECS™ mechanical linkages, 2424, 2426, 2428, 2430. The result is that the μΜΕ€3^ΤΜ devices exhibit improved performance including, without limitation, a superior output to volume ratio, as well as advantageous linear dimensions. In addition, a device ca he prepared according to principles of the invention that prod noes superior bass response as compared with a similarly size conventional device.

[0:188] Fig. 25 similarly shows an acoustic transducer 2500 which exhibits: superior: Ott u characteristics because it includes a pMEC ^ mechanical linkage 2502 that serves to amplify the effect of Piexo electric driver 2504, Tbe.resu¾ n certain embodiments^ is. mproved : efficiency and larger acoustical outpu signal.

[01.89] Fi ' s 26 A and 26B show respective, fi rst 2600 and seco operational ..states 2602 of an optical zo m apparatus 2604 produced atimi!Iirnetet scale and employing a mechanical linkage 2606 according to principles of the invention, hi light of the present disclosure, one of ordinary skill. Irs: the art will readily appreciate the nature of the devic and the manner in whic it operates. Moreover, the practical benefits of preparing a similar devi ce ^'employing^' the teachings of the present disclosure will likewis b readily apparent.

[0190] Fig, 27 illustrates, in schematic cross-section, a portion of a combination haptic and acoustical transdiicer 2700. it will be apparent te one of skill in the art that the ad vantage of the present kiwntiou. allow the creation of millimeter scale devices never before practical or anticipated.

[019.1] While a variety of systems and equipment, ncluding equipment presentl available on yet yet to be developed, will be advantageously employed in the practice of the invention disclosed herewith, it may nevertheless he helpful to one of skill in the art to consider the following summary of core capital, equipment;.

5x Laser release modules * Galvo driven 10W 355nm UV D.FSS Laser (e.g. LPKF MicroLine 2120 CI)

* Vision system

* Vacuum exhaust and chip removal

lOx Lamination modules

* Screen printer (e.g. SpeedPrint SP OOj ~

* 460nm LED light array (e.g. 4x DELO DE-LOLUX 20)

* Vision system

* Lamination press

4x Pick and place assembly modules

* SMI pick and place (e.g.

* Vision system (e.g.

* Adhesive deliver and dispense (e.g. - Laser welder

* 460nm LED light array (e.g. 4x DELO DE-LOLUX 20)

[0192] The above is only one possible instantiation of an inline THC assembly process. Maximum throughput at each node requires 15 lamination modules (screen print, light activation, registration, and lamination), 5 laser release modules, 4 pick and place assembly modules (pick and place, adhesive dispense, and UV activation). Clever process engineering can leverage under-utilized equipment for multiple tasks, using a cellular arrangement. Using the above process time estimates, the lowest throughput process is final laser release (15s / part, 4PP ). A. 4 PPM process can be accomplished using 1 lamination module (91 PPM), 3 laser release modules (4-8 PPM), and 1 pick and place module (10-15PPM),

[0193] While the exemplary embodiments described above have been chosen primarily from the field of optical communication, one of skill in the art will apprecia te that the principles of the invention are equall well applied, and that the benefits of the present invention, are equally well realized, in a wide variety of other communications systems including, for example, electronic command and control systems. Further, while the invention has been described in detail in connection with the presently preferred embodiments, it should be readily understood that the invention is not limited to such disclosed embodiments. Rather, the invention can be modified to incorporate any number of variations, alterations, substitutions, or equivalent arrangements not heretofore described, but which are commensurate with the spirit and scope of the invention. Accordingly, the invention is not to be seen as limited by the foregoing description, but is onl limited by the scope of the appended claims.

Claims

Claims A method for manufacturing a sub-laminate of a millimeter scale

electromechanical de vice comprising: coupling a stainless steel ply to a polymer carrier ply;

coating said stainless steel ply in a photo resist material;

masking said photoresist material;

exposing said photoresist material to cure a portion of said photoresist material;

developing said photoresist material to remove uncured photoresist material from said stainless steel ply;

chemically etching said stainless steel ply to remove a patterned portion of said stainless steel ply;

dissolving said polymer carrier ply to release unwanted chips of said stainless steel ply; and

adhering said patterned stainless steel ply to a flexible material ply to form a sub-laminate.