WO2018016918A1

WO2018016918A1 - Tube-shaped led lighting device

Info

Publication number: WO2018016918A1
Application number: PCT/KR2017/007897
Authority: WO
Inventors: 한규원
Original assignee: 서울바이오시스 주식회사
Priority date: 2016-07-22
Filing date: 2017-07-21
Publication date: 2018-01-25

Abstract

The present invention relates to a tube-shaped LED lighting device. A tube-shaped LED lighting device according to an embodiment comprises: a substrate; a light emitting element mounted on the substrate; a heat sink having one surface on which the substrate is stably placed and having both opposite side surfaces on which inwardly concave groove portions are formed; a cover housing the heat sink, the substrate, and the light emitting element and including protrusion portions which protrude from an inner wall of the cover and are inserted into the groove portions; and bases coupled respectively to both opposite ends of the cover, wherein the opposite side surfaces of the heat sink have a morphology corresponding to that of the inner wall of the cover.

Description

[Correction by rule 26.08.2017] Tube type LED lighting device

The present invention relates to a tubular LED lighting device.

In general, an LED (Light Emitting Diode) is a semiconductor device that emits light by flowing a current through the compound. LED does not use mercury, so it is eco-friendly, and it is a solid device, which has a long life and low power consumption.

Various lighting apparatuses using such LEDs as light sources have been developed, and LED lighting apparatuses equipped with bulb-type power connection parts that can be mounted in a socket for a light bulb (Receptacle) have gained popularity.

The LED has a problem that heat is generated when it is turned on. If the LED is not good heat dissipation will shorten the life and light intensity. The upper limit of the temperature at which the LED is turned on smoothly is around 60 ° C., and thus the performance of the LED lighting device is directly related to heat dissipation.

Ultraviolet rays generally refer to light having a wavelength range of 100 to 400 nanometers, and have a higher energy than visible light. Ultraviolet rays from the sun are classified into ultraviolet A (ultraviolet-A), ultraviolet B (ultraviolet-C), and ultraviolet C (ultraviolet-C), and ultraviolet C is mostly absorbed by the ozone layer, and ultraviolet A and ultraviolet B are applied to the surface of the earth. It is known to reach.

Ultraviolet light can be utilized in various fields. The ultraviolet lamp includes a lamp tube and a light emitting device that emits ultraviolet light within the lamp tube. The lamp tube requires high transmittance to ultraviolet rays and properties that do not deform when the ultraviolet rays are transmitted for a long time.

The problem to be solved by the present invention is to provide a tube type LED lighting device with improved heat dissipation.

In addition, another problem to be solved by the present invention is to provide a tube-type LED lighting device that prevents defects due to opening and short circuit by omitting wire bonding.

The present application is to provide an ultraviolet lamp and a method of manufacturing the same having improved performance and reliability.

According to an embodiment of the present invention, a substrate, a light emitting device mounted on the substrate, a substrate is mounted on one surface, and a heat sink, a heat sink, a substrate, and a light emitting device formed with recesses inwardly formed on both sides thereof, and protrude from the inner wall. And a base coupled to both ends of the cover, the cover including a protrusion inserted into the groove, and both sides of the heat sink are provided with a tubular LED lighting device corresponding to the shape of the inner wall of the cover.

According to another embodiment of the present invention, a heat sink, a heat sink, a substrate, and a light emitting device having a substrate, a light emitting device mounted on the substrate, a substrate seated on one surface, and recessed grooves formed on both sides thereof inwardly There is provided a tubular LED lighting device which includes a cover which includes a cover and a base including a protrusion which protrudes from an inner wall and is inserted into a groove, and one end of the substrate penetrates the base and is positioned inside the base.

An ultraviolet lamp according to an embodiment of the present invention, the lamp tube including an upper cover and a lower cover integrally formed with the upper cover; A printed circuit board fixed in the lamp tube; And at least one ultraviolet light emitting device disposed on the printed circuit board and opposed to the upper cover, and driven under the control of the printed circuit board, wherein the at least one ultraviolet light emitting device has ultraviolet light having a wavelength of 360 nm or more. Emits light toward the upper cover, and the upper cover includes polymethylmethacrylate.

In example embodiments, the ultraviolet lamp may further include a flame retardant layer disposed between the printed circuit board and the upper cover.

In an embodiment, the ultraviolet lamp may further include a heat sink fixed in the lamp tube and configured to dissipate heat generated by the printed circuit board. In this case, a groove may be formed on the heat sink, the printed circuit board and the flame retardant layer may be located in the groove, and the flame retardant layer may cover the printed circuit board.

In an embodiment, the ultraviolet lamp may further include a heat sink fixed in the lamp tube and configured to dissipate heat generated by the printed circuit board. In this case, a groove is formed on an upper portion of the heat sink, the printed circuit board is positioned in the groove, and the flame retardant layer may cover the upper portion of the heat sink and the printed circuit board.

In an embodiment, the ultraviolet lamp includes a heat sink configured to support the printed circuit board and to dissipate heat generated by the printed circuit board; And a power supply disposed between the heat sink and the lower cover and configured to convert AC power from the outside into DC power and provide the converted DC power to the printed circuit board. In this case, the lower cover may include the polymethyl methacrylate, but may be formed to be opaque.

In an embodiment, the ultraviolet lamp may further include a base fixed to an end of the lamp tube. In this case, the at least one ultraviolet light emitting device may be positioned on the printed circuit board to emit the ultraviolet light within a predetermined directivity range, but the base is located outside the predetermined directivity range.

In an embodiment, the ultraviolet lamp may further include a base fixed to an end of the lamp tube. In this case, the base may include an ultraviolet stabilizer.

According to another embodiment of the present invention, an ultraviolet lamp includes: a lamp tube including an upper cover and a lower cover integrally formed with the upper cover; A printed circuit board fixed in the lamp tube; At least one ultraviolet light emitting device disposed on the printed circuit board and facing the upper cover, the ultraviolet light emitting device emitting light toward the upper cover in accordance with control of the printed circuit board; And a flame retardant layer disposed between the printed circuit board and the upper cover. The top cover may comprise polymethylmethacrylate.

In an embodiment, the at least one ultraviolet light emitting device may emit ultraviolet light having a wavelength of 360 nm or more.

In an embodiment, the lower cover may include the polymethylmethacrylate, but may be formed to be opaque.

Another aspect of the present invention relates to a method of manufacturing an ultraviolet lamp. According to one or more exemplary embodiments, a method of manufacturing an ultraviolet lamp includes: melting a first raw material and a second raw material to produce a first melt and a second melt; Passing the first melt and the second melt through one mold to integrally form an upper cover and a lower cover; Cooling the upper cover and the lower cover; And disposing at least one ultraviolet light emitting device driven under control of a printed circuit board and the printed circuit board in the upper cover and the lower cover. The at least one ultraviolet light emitting device faces the top cover, the at least one ultraviolet light emitting device emits ultraviolet light having a wavelength of 360 nm toward the top cover, and the top cover comprises polymethylmethacrylate. .

According to another embodiment of the present invention, an ultraviolet lamp includes: a lamp tube including an upper cover and a lower cover integrally formed with the upper cover; A printed circuit board fixed in the lamp tube; At least one ultraviolet light emitting device disposed on the printed circuit board and facing the upper cover, the ultraviolet light emitting device emitting light toward the upper cover in accordance with control of the printed circuit board; And a flame retardant layer disposed between the printed circuit board and the upper cover or surrounding at least a portion of an outer surface of the lamp tube.

In an embodiment, the top cover may include polymethyl methacrylate or quartz.

In an embodiment, the lower cover may be formed to include the polymethyl methacrylate or quartz but is opaque.

In an embodiment, the flame retardant layer may be attached to at least a portion of an inner surface of the lamp tube.

The tubular LED lighting device according to the embodiment of the present invention has a shorter separation distance between the heat sink and the cover, thereby improving heat dissipation.

In addition, the tubular LED lighting apparatus according to an embodiment of the present invention is formed so that one end of the substrate on which the electrode is formed is located inside the base, it can be electrically connected to the external power supply without wire bonding. Therefore, the tubular LED lighting device can simplify the process by eliminating wire bonding, and can prevent defects due to opening and short circuit due to wire bonding.

According to the present application, an ultraviolet lamp having improved performance and reliability and a method of manufacturing the same are provided.

1 is a component diagram of a tubular LED lighting apparatus according to a first embodiment of the present invention.

2 is a cross-sectional view of the tubular LED lighting apparatus according to the first embodiment of the present invention.

3 is a side cross-sectional view of the tubular LED lighting apparatus according to the first embodiment of the present invention.

4 is a component diagram of a tubular LED lighting apparatus according to a second embodiment of the present invention.

5 is a cross-sectional view of the tubular LED lighting apparatus according to the second embodiment of the present invention.

6 is a side cross-sectional view of a tubular LED lighting apparatus according to a second embodiment of the present invention.

7 is an exemplary view showing a tubular LED lighting apparatus according to a third embodiment of the present invention.

8 is an exemplary view showing a tubular LED lighting apparatus according to a fourth embodiment of the present invention.

9 is an exemplary view showing a tubular LED lighting apparatus according to a fifth embodiment of the present invention.

10 is a side cross-sectional view of a tubular LED lighting apparatus according to a sixth embodiment of the present invention.

11 is a cross-sectional view of the tubular LED lighting apparatus according to the sixth embodiment of the present invention.

12 is an exemplary view showing a tubular LED lighting apparatus according to the seventh embodiment.

13 is an exemplary view showing a tubular LED lighting apparatus according to an eighth embodiment.

14 is an exemplary view showing a tubular LED lighting apparatus according to the ninth embodiment.

15 is an exemplary view showing a tubular LED lighting apparatus according to a tenth embodiment.

16 is an exemplary view showing a tubular LED lighting apparatus according to the eleventh embodiment.

17 is a view showing an ultraviolet lamp according to an embodiment of the present invention.

FIG. 18 is a side view illustrating the ultraviolet lamp of FIG. 17.

19 is a cross-sectional view of the ultraviolet lamp taken along line II ′ of FIG. 17.

20A is a graph showing a change in transmittance of a top cover including polymethylmethacrylate according to a change in wavelength of light.

20B is a graph showing the change in transmittance of the top cover with time when the top cover including polymethyl methacrylate transmits ultraviolet rays having a wavelength of 360 nm.

FIG. 21 is a graph showing the change in transmittance of the upper cover with a diffusing agent according to the change in wavelength of light.

22 is a cross-sectional view of an ultraviolet lamp according to another embodiment of the present invention.

23 is a cross-sectional view of an ultraviolet lamp according to another embodiment of the present invention.

24 is an exploded perspective view showing a printed circuit board, ultraviolet light emitting devices, heat sinks, and a flame retardant layer.

25 is a cross-sectional view of an ultraviolet lamp according to another embodiment of the present invention.

FIG. 26 is a cross-sectional view of the ultraviolet lamp taken along line II-II ′ of FIG. 17.

27 is a view showing a modified embodiment of the ultraviolet lamp of FIG.

28 is a cross-sectional view of the ultraviolet lamp of FIG. 27.

29 is a cross-sectional view of an ultraviolet lamp according to another embodiment of the present invention.

30 is a cross-sectional view of an ultraviolet lamp according to another embodiment of the present invention.

FIG. 31 is a flowchart illustrating a method of manufacturing the lamp tube of FIG. 17.

The description in the background of the technical field of the present invention is only for the purpose of understanding the background art of the technical idea of the present invention, and thus it can be understood as the content corresponding to the prior art known to those skilled in the art. none.

In the following description, for purposes of explanation, numerous specific details are set forth in order to assist in understanding the various embodiments. It may be evident, however, that various embodiments may be practiced without these specific details or in one or more equivalent ways. In other instances, well-known structures and devices are shown in block diagram form in order to avoid unnecessarily obscuring the various embodiments.

In the drawings, the size or relative size of layers, films, panels, regions, etc. may be exaggerated for clarity. Like reference numerals denote like elements.

Throughout the specification, when an element or layer is described as being "connected" to another element or layer, it is not only directly connected, but also indirectly connected between other elements or layers in between. However, if a part is described as "directly connected" to another part, it means that there is no other element between that part and the other part. "At least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" is X one, Y one, Z one, or two of X, Y, and Z or Any combination of the above will be understood (e.g., XYZ, XYY, YZ, ZZ). Here, "and / or" includes all combinations of one or more of the configurations.

Herein, terms such as first, second, etc. may be used to describe various elements, elements, regions, layers, and / or sections, but such elements, elements, regions, layers, and / or the like. Or sections are not limited to these terms. These terms are used to distinguish one element, element, region, layer, and / or section from another element, element, region, layer, and / or section. Thus, the first element, element, region, layer, and / or section in one embodiment may be referred to as the second element, element, region, layer, and / or section in another embodiment.

Spatially relative terms such as "below", "above", and the like may be used for illustrative purposes, thereby describing the relationship of one device or feature to another device (s) or feature (s) as shown in the figures. do. This is only used to indicate the relationship of one component to another component in the drawings, but does not mean an absolute position. For example, when the device shown in the figure is inverted, elements depicted as being "below" of other elements or features are located in the direction of "above" other elements or features. Thus, in one embodiment, the term "below" may include both up and down directions. In addition, the device may be in other directions (eg, rotated 90 degrees or in other directions), and such spatially relative terms used herein are interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. Throughout the specification, when a portion "contains" a certain component, it means that it can further include other components, except to exclude other components unless specifically stated otherwise. Unless otherwise specified, terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

Tube-shaped LED lighting apparatus according to an embodiment of the present invention includes a heat sink, a heat sink, a substrate and a light emitting device having a substrate, a light emitting device mounted on the substrate, the substrate is seated on one surface, the groove is formed on both sides inwardly concave And a cover including a protrusion protruding from the inner wall and inserted into the groove, and a base coupled to both ends of the cover. At this time, the shape of both sides of the heat sink corresponds to the shape of the inner wall of the cover. For example, the inner wall of the cover is shaped to include a curved surface. In addition, both sides of the heat sink also have a curved surface. Thus, the separation distance between the cover and the heat sink can be minimized. Accordingly, the heat sink facilitates the transfer of heat conducted from the light emitting element to the cover, which in turn improves the heat dissipation performance of the tubular LED lighting device.

The heat sink further includes a substrate fixing portion surrounding both sides of the substrate. One surface of the substrate fixing portion increases in height from the inner side on which the substrate is seated to the outer side. That is, one surface of the substrate fixing part is formed to have a predetermined angle. Such a structure can prevent the light emitted from the light emitting device from hitting the substrate fixing part, thereby improving the light efficiency of the tubular LED lighting device.

It further includes a heat dissipation fin formed on the other surface opposite to one surface of the heat sink. When the air contact area of the heat sink is increased by the heat dissipation fins, heat dissipation performance may be further improved.

The cover is formed of a light transmissive material. Alternatively, the cover may be partially formed of a light transmissive material, and the other part may be formed of a non-transparent material. At least a part of the cover is formed of a pure polymethylmethacrylate (PMMA) material. That is, the portion of the cover through which the light of the light emitting element is transmitted may be formed of pure PMMA. In this way, the portion of the cover through which light is transmitted is formed of pure PMMA, thereby improving light transmittance.

In addition, the cover may be formed in a color including at least one of transparent, translucent and colored.

One end of the substrate penetrates the base and is positioned inside the base. In addition, a power pad is formed at one end of the base substrate. This power supply pad is connected to an external power supply device. By the substrate and the power pad having such a structure, the base heat dissipation fin and the wire for the electrical connection between the external power supply and the substrate can be omitted. Therefore, the step of inserting the base heat dissipation fin into the base and the wire bonding step can be omitted. In addition, it is possible to prevent the occurrence of open and short due to the failure of the base heat radiation fins and wires.

The power pad may be formed on one surface of one end of the substrate. In addition, the power pad may be formed on one surface and the other surface of one end of the substrate, respectively. In addition, the power pads may be formed on both sides of the substrate, respectively.

In addition, the tubular LED lighting device may further include a connector, one end protruding out of the base, the other end is in contact with the power pad formed on one end of the substrate.

Tube-shaped LED lighting apparatus according to another embodiment of the present invention is a heat sink, a heat sink, a substrate having a substrate, a light emitting device mounted on the substrate, the substrate is seated on one surface, the groove is formed on both sides inwardly concave And a base having a light emitting device therein, the cover including a protrusion protruding from the inner wall and inserted into the groove, and a base coupled to both ends of the cover, wherein one end of the substrate penetrates the base and is positioned inside the base.

1 to 3 are exemplary views of the tubular LED lighting apparatus according to the first embodiment of the present invention. 1 is a component diagram of a tubular LED lighting apparatus according to a first embodiment of the present invention. 2 is a cross-sectional view of the tubular LED lighting apparatus according to the first embodiment of the present invention. 3 is a side cross-sectional view of the tubular LED lighting apparatus according to the first embodiment of the present invention.

1 to 3, the tubular LED lighting device 100 includes a substrate 110, a light emitting device 120, a heat sink 130, a cover 140, and a base 150.

The substrate 110 is a printed circuit board on which a conductive pattern (not shown) is formed. The conductive patterns of the substrate 110 are electrically connected to the light emitting device 120. The substrate 110 according to the embodiment of the present invention has a long length according to the shape of the long cover 140.

The light emitting device 120 is mounted on one surface of the substrate 110. The light emitting device 120 may include an LED chip (not shown) and may include a phosphor (not shown). The light emitting device 120 may generate light of various colors including white light by using a combination of an LED chip and a phosphor. 1 to 3 illustrate the plurality of light emitting devices 120 mounted on the substrate 110. However, the number of light emitting devices 120 mounted on the substrate 110 may be changed by a person skilled in the art.

The heat sink 130 is for heat dissipation of the light emitting device 120 and the substrate 110. The heat sink 130 includes a substrate fixing part 131, a groove part 133, and a heat dissipation fin 135.

The substrate fixing part 131 is formed on one surface of the heat sink 130 on which the substrate 110 is seated, and is formed in a form that surrounds both sides of the substrate 110 on which the substrate 110 is seated. In addition, the substrate fixing part 131 is formed long along the longitudinal direction of the heat sink 130.

One surface 132 of the substrate fixing part 131 increases in height from the inner side of the heat sink 130 on which the substrate 110 is mounted to the outer side. That is, one surface 132 of the substrate fixing part 131 is formed to have a predetermined angle. Here, one surface 132 of the substrate fixing part 131 becomes an upper surface with reference to FIG. 1. In addition, the predetermined angle is an angle that can prevent the light emitted from the light emitting device 120 from being blocked by the substrate fixing part 131. The tubular LED lighting device 100 is capable of high-efficiency light emission by the substrate fixing part 131 formed as described above.

The groove 133 is formed on both side surfaces of the heat sink 130. The groove 133 is formed in the form of a recess formed inwardly of the heat sink 130. In this case, the groove 133 has a shape corresponding to the protrusion 141 of the cover 140. In addition, the groove 133 is formed at a position corresponding to the protrusion 141 of the cover 140. The protrusion 141 of the cover 140 is inserted into the groove 133 formed as described above, and thus the heat sink 130 and the cover 140 are coupled to each other.

The heat dissipation fin 135 is formed under the heat sink 130. A plurality of heat dissipation fins 135 may be formed. The heat dissipation fin 135 formed as described above expands the area where the heat sink 130 and air contact to improve the heat dissipation performance of the heat sink 130. The structure of the heat dissipation fin 135 may be variously changed according to a selection by those skilled in the art.

Side surfaces of the heat sink 130 are formed to correspond to the inner wall of the cover 140. 1 to 3, since the cover 140 is cylindrical, the inner wall of the cover 140 is curved. Accordingly, the side surface of the heat sink 130 also has a curved shape. Such a structure can minimize the separation distance between the cover 140 and the heat sink 130. As the spacing between the cover 140 and the heat sink 130 is minimized, the heat sink 130 may easily emit heat of the light emitting device 120 and the substrate 110 to the outside through the cover 140. Therefore, the heat radiation performance of the tubular LED lighting device 100 is improved. In addition, one end of the heat dissipation fin 135 is also formed along the inner wall of the cover 140, as shown in the figure, it can emit heat to the outside through the cover 140.

The cover 140 is formed to surround the heat sink 130, the substrate 110, and the light emitting device 120. That is, the cover 140 has a heat sink 130, a substrate 110, and a light emitting device 120 therein. The cover 140 is formed with a protrusion 141. The protrusion 141 is formed to protrude from the inner wall of the cover 140 into the inner space. The protrusion 141 is inserted into the grooves 133 formed on both side surfaces of the heat sink 130.

The cover 140 is formed of a resin or glass material having transparency. For example, at least a portion of the cover 140 is formed of pure polymethylmethacrylate (PMMA) material. Here, pure PMMA is free of impurities or other materials added to the PMMA. That is, the cover 140 may be formed entirely of pure PMMA material. Alternatively, the cover 140 may be formed of a pure PMMA material. In this case, the portion of the cover 140, which is a pure PMMA material, includes a region through which light of the light emitting device passes. PMMA has a higher light transmittance with a lower concentration of impurities or other materials. Therefore, when the portion of the cover 140 that transmits light of the light emitting device is formed of pure PMMA, light transmittance can be improved.

In an embodiment of the present invention, the cover 140 is transparent. However, the color of the cover 140 is not limited to being transparent. Cover 140 may be translucent or colored.

Base 150 is coupled to both ends of the cover 140, respectively. For example, a cover insertion groove 151 corresponding to an end of the cover 140 is formed in the base 150. One end and the other end of the cover 140 are respectively inserted into the cover insertion groove 151 of the base 150, whereby the cover 140 and the base 150 are coupled. In addition, the cover 140 and the base 150 are fixed to each other by using the screw 160. One end of the screw 160 is located inside the base 150, and the other end is located inside the cover 140. Alternatively, the cover 140 and the base 150 may be fixed by using an adhesive. However, when fixing the cover 140 and the base 150 in a coupled state, the present invention is not limited to using a screw or an adhesive. The method for fixing the cover 140 and the base 150 may be applied to any method known in the art.

In addition, the sealing member 170 is inserted into an empty space between the screw 160 and the outside of the tubular LED lighting device 100. The sealing member 170 prevents moisture from penetrating from the outside to the inside of the tubular LED lighting device 100. For example, the sealing member 170 is formed of an elastic material and may be a rubber packing. The sealing member 170 may be omitted at the choice of those skilled in the art.

4 to 6 is an exemplary view showing a tubular LED lighting apparatus according to a second embodiment of the present invention. 4 is a component diagram of a tubular LED lighting apparatus according to a second embodiment of the present invention. 5 is a cross-sectional view of the tubular LED lighting apparatus according to the second embodiment of the present invention. 6 is a side cross-sectional view of the tubular LED lighting apparatus according to the second embodiment of the present invention.

Description of the same configuration as the tubular LED lighting apparatus according to the first embodiment of the configuration of the tubular LED lighting apparatus 200 according to the second embodiment will be omitted. For the description of the omitted configuration, refer to the description of the tubular LED lighting apparatus according to the first embodiment.

4 to 6, the tubular LED lighting device 200 includes a substrate 210, a light emitting device 120, a heat sink 130, a cover 140, and a base 250.

The substrate 210, the light emitting device 120, and the heat sink 130 are disposed in the cover 140. In this case, the substrate 210 is fixed to the substrate fixing part 131 formed on one surface of the heat sink 130. In addition, the light emitting device 120 is mounted on one surface of the substrate 210. In addition, the base 250 is coupled to both ends of the cover 140. For example, a cover insertion groove 251 is formed in the base 250. One end portion and the other end portion of the cover 140 are respectively inserted into the cover insertion groove 251 of the base 250, thereby engaging the base 250.

According to an embodiment of the present invention, one end 211 of the substrate 210 penetrates inside the base 250. A hole (not shown) penetrating the inside is formed in the base 250 that is coupled to one end of the cover 140. One end 211 of the substrate 210 penetrates the base 250 through the hole and is positioned inside the base 250.

A power pad 280 is formed at one end 211 of the substrate 210 positioned inside the base 250. For example, the power pad 280 includes a first power pad 281 and a second power pad 282. Here, one of the first power pad 281 and the second power pad 282 is connected to the positive power of the external power supply, the other is connected to the negative power. 4 to 6, both the first power pad 281 and the second power pad 282 are formed on one surface of the substrate 210 side by side.

The power pad 280 formed as described above is electrically connected to the light emitting device 120 through a conductive pattern (not shown) formed on the substrate 210. In addition, the power pad 280 is connected to an external power supply device (not shown). That is, the power pad 280 located inside the base 250 electrically connects an external power supply device (not shown) and the light emitting device 120. The other end of the cover 140 and the coupling of the base 250 is the same as FIG.

Conventionally, in order to electrically connect an external power supply device and a substrate on which a light emitting device is mounted, a base heat radiation fin insertion and wire bonding process is required. However, by performing this process in a narrow inner space of the base, defects such as electrical open and short have occurred.

However, according to the embodiment of the present invention, the conventional base heat radiation fin insertion and wire bonding process can be omitted, the process is simplified. In addition, it is possible to prevent the occurrence of defects such as the above-described electrical opening and short circuit.

7 to 9 are exemplary views showing the tubular LED lighting apparatus according to the third to fifth embodiments of the present invention.

Among the configurations of the tubular

LED lighting apparatuses

300, 400, and 500 according to the third to fifth embodiments, a difference from the tubular LED lighting apparatus according to the second embodiment will be mainly described. For the description of the omitted configuration, refer to the description of the second embodiment.

7-9, a portion of the

substrate

210, 510 located inside the base 250 is shown. Portions of the illustrated

substrates

210 and 510 correspond to one ends 211 of the substrate 210 described in the second embodiment of FIGS. 4 to 6.

Referring to FIG. 7, in the tubular LED lighting apparatus 300 according to the third embodiment, a power pad 280 is formed on one surface and the other surface of the substrate 110, respectively. For example, the first power pad is formed on one surface of the substrate 110, and the second power pad is formed on the other surface of the substrate 110.

Referring to FIG. 8, in the tubular LED lighting apparatus 400 according to the fourth embodiment, a power pad 280 is formed on one end surface of the substrate 110. That is, the first power pad 281 and the second power pad 282 are formed to be parallel to one end surface of the substrate 110.

Referring to FIG. 9, the tubular LED lighting apparatus 500 according to the fifth embodiment is formed such that one end of the substrate 510 has a separation space. That is, the substrate 510 has a structure in which one end is divided into two. A power pad 280 is formed at a cracked portion of the substrate 510. More specifically, as shown in FIG. 9, the first power pad 281 and the second power pad 282 are formed to be respectively disposed at the divided portions of the substrate 510.

Various embodiments of the structure of the substrate and the power pad have been described with reference to FIGS. 4 through 9. However, the structure of the substrate and the power pad is not limited to the above embodiments. One end of the substrate may be changed to a structure advantageous for connection with an external power supply device. In addition, the position and structure in which the power pad is formed may also be changed to advantageously make an electrical connection with an external power supply.

10 and 11 are exemplary views showing a tubular LED lighting apparatus according to a sixth embodiment of the present invention. 10 is a side cross-sectional view of a tubular LED lighting apparatus according to a sixth embodiment of the present invention. 11 is a cross-sectional view of the tubular LED lighting apparatus according to the sixth embodiment of the present invention.

The difference between the tubular LED lighting apparatus 600 and the tubular LED lighting apparatus 600 according to the second embodiment will now be described. For a description of the omitted configuration, refer to the second embodiment.

According to an embodiment of the present invention, one end 211 and the other end of the substrate 210 are located inside the base 250. However, like other embodiments, only one end of the substrate 210 may be located inside the base 250. A power pad 280 is formed at one end 211 of the substrate 210.

In addition, according to an embodiment of the present invention, the tubular LED lighting device 600 includes a connector 690. Although not shown in the figure, a conductive pattern is formed on the connector 690. For example, all of one surface and the other surface of the connector 690 may be formed of a conductive material. At this time, one surface and the other surface of the connector 690 should be insulated from each other. Alternatively, conductive patterns may be formed in one side and the other side of the connector 690 and the inside of the connector 690. The conductive patterns formed on one side and the other side of the connector 690 are formed at one end and the other end of the connector 690, respectively.

One end of the connector 690 contacts the power pad 280 of the substrate 210. In this case, the conductive patterns electrically connected to the first power pad 281 and the second power pad 282 are formed to be insulated from each other. The other end of the connector 690 is exposed to the outside of the base 250. The other end of the connector 690 exposed to the outside of the base 250 is connected to an external power supply (not shown). As such, the board 210 and the external power supply device are electrically connected through the connector 690.

12 to 14 are exemplary views showing a tubular LED lighting apparatus according to the seventh to ninth embodiments.

The configuration of the tubular

LED lighting apparatuses

700, 800, and 900 according to the seventh to ninth embodiments will be described mainly based on differences from the tubular LED lighting apparatus according to the sixth embodiment. See also.

Referring to FIG. 12, in the tubular LED lighting apparatus 700 according to the seventh embodiment, a first power pad 281 and a second power pad 282 are formed on one surface of a substrate 210. The connector 790 also includes a first connector 791 and a second connector 792. The first connector 791 is in contact with the first power pad 281 to be electrically connected to each other. In addition, the second connector 792 is in contact with the second power pad 282 to be electrically connected to each other. For example, the first connector 791 and the second connector 792 may be formed of a conductive material. Alternatively, a conductive pattern for electrical connection between the substrate 210 and an external power supply device may be formed in the first connector 791 and the second connector 792.

Referring to FIG. 13, in the tubular LED lighting apparatus 800 according to the eighth embodiment, a power pad 280 is formed on one surface and the other surface of the substrate 210, respectively. For example, a first power pad is formed on one surface of the substrate 210, and a second power pad is formed on the other surface of the substrate 210. In this case, the first connector 791 is in contact with the first power pad to be electrically connected to each other. In addition, the second connector 792 is in contact with the second power pad to be electrically connected to each other. For example, the first connector 791 and the second connector 792 may be formed of a conductive material. Alternatively, a conductive pattern for electrical connection between the substrate 210 and an external power supply device may be formed in the first connector 791 and the second connector 792.

Referring to FIG. 14, in the tubular LED lighting apparatus 900 according to the ninth embodiment, power pads 280 are formed on both side surfaces of the substrate 210. For example, a first power pad is formed on one side of the substrate 210 and a second power pad is formed on the other side. In this case, the first connector 791 is in contact with the first power pad to be electrically connected to each other. In addition, the second connector 792 is in contact with the second power pad to be electrically connected to each other. For example, the first connector 791 and the second connector 792 may be formed of a conductive material. Alternatively, a conductive pattern for electrical connection between the substrate 210 and an external power supply device may be formed in the first connector 791 and the second connector 792.

As such, the power pads may have various structures at one end of the substrate located inside the base, and may be formed at various positions. Accordingly, the connector also has various structures, and can be disposed at various positions.

Covers (140 of FIGS. 1 to 14) of the lighting apparatus according to the first to ninth embodiments of the present invention have been described as being formed of a light transmitting material. However, the present invention is not limited to the entire cover (140 of FIG. 1S to FIG. 14) made of a light-transmissive material.

Referring to FIG. 15, the cover 1040 of the tubular LED lighting apparatus 1000 is a mixture of a light transmitting material and a non-light transmitting material.

The cover 1040 is divided into a first cover 1041 and a second cover 1042.

The first cover 1041 is a portion of the cover 1040 positioned above the protrusion 141 based on FIG. 15. That is, the first cover 1041 includes a portion through which the light emitted from the light emitting device 120 passes. The first cover 1041 is formed of a light transmitting material. For example, the first cover 1041 is formed of pure PMMA material.

The second cover 1042 is a portion located under the protrusion 141 and the protrusion 141 of the cover 1040 based on FIG. 15. That is, the second cover 1042 is a portion of the cover 1040 except for the first cover 1041. The second cover 1042 is formed of a non-transparent material.

In an embodiment of the present invention, the first cover 1041 and the second cover 1042 are divided based on the protrusion 141. However, the reference of the first cover 1041 and the second cover 1042 may not necessarily be the protrusion 141. That is, if the first cover 1041 can pass the light emitted by the light emitting device 120, the reference of the first cover 1041 and the second cover 1042 may be changed according to the choice of those skilled in the art.

The joining method of the first cover 1041 and the second cover 1042 may be applied to any method known in the art. In addition, the first cover 1041 and the second cover 1042 may be integrated, and a method of coating a non-transparent material on a portion corresponding to the second cover 1042 may be applied.

Covers of the lighting apparatus according to the first to ninth embodiments of the present invention (140 of FIGS. 1 to 14) has been described as an example of being formed in one color of transparent, translucent or colored. However, the present invention is not limited to the entire cover (140 of FIGS. 1 to 14) formed in one color.

Referring to FIG. 16, the cover 1140 may be a mixture of two or more colors of transparent, translucent, and colored.

The cover 1140 is divided into a first cover 1141 and a second cover 1142.

The first cover 1141 is a portion of the cover 1140 positioned above the protrusion 141 based on FIG. 16. The second cover 1142 is a portion of the cover 1140 except for the first cover 1141.

According to an embodiment of the present invention, the first cover 1141 is transparent, and the second cover 1142 is formed to be translucent or colored. However, the color of the first cover 1141 and the color of the second cover 1142 are not limited thereto. For example, the first cover 1141 may be translucent or colored, and the second cover 1142 may be transparent. Alternatively, the first cover 1141 may be translucent and the second cover 1142 may be colored. Alternatively, the first cover 1141 may be colored and the second cover 1142 may be translucent. The translucent or colored cover 1140 may coat translucent or colored on the transparent first cover 1141 and the second cover 1142. Alternatively, the translucent or colored cover 1140 may be formed by including a material for translucent or colored when forming the first cover 1141 and the second cover 1142.

In an embodiment of the present invention, the first cover 1141 and the second cover 1142 are divided based on the protrusion 141. However, the reference of the first cover 1141 and the second cover 1142 may not necessarily be the protrusion 141. The order of the first cover 1141 and the second cover 1142 may be changed according to the choice of those skilled in the art.

In an embodiment of the present disclosure, the first cover 1141 and the second cover 1142 are divided into different colors, and the first cover 1141 and the second cover 1142 are separated from each other. There is no need. That is, the first cover 1141 and the second cover 1142 may be integrated. In addition, by coating a translucent or colored part to those skilled in the art, the cover 1140 may be a mixed color. In addition, the two colors are not necessarily mixed with the cover 1140. Three or more colors may be mixed in the cover 1140.

Although not shown in the present invention, the cover of the tenth embodiment (1040 of FIG. 15) and the cover of the eleventh embodiment (1140 of FIG. 16) may be mixed with each other. That is, the translucent first cover 1041 of FIG. 15 and the non-transparent second cover 1042 of FIG. 15 may each include at least one color of transparent, translucent, and colored.

17 is a diagram illustrating an ultraviolet lamp 2100 according to an embodiment of the present invention. 18 is a side view illustrating the ultraviolet lamp 2100 of FIG. 17.

Referring to FIG. 17, an ultraviolet lamp 2100 may include a lamp tube 2110, a printed circuit board 2120, at least one ultraviolet light emitting device 2130,

bases

2141 and 2142, and at least one power pin. 2151).

The lamp tube 2110 includes an upper cover and a lower cover integrally formed with the upper cover. The lamp tube 2110 extends in the X direction and defines an interior space of the ultraviolet lamp 2100. The lamp tube 2110 has a height in the Z direction. The lamp tube 2110 may have a cylindrical shape as shown in FIG. 17.

Referring to FIG. 18, the upper cover 2111 is formed of a transparent material. According to an embodiment of the present invention, the upper cover 2111 includes polymethyl methacrylate (PMMA) and / or quartz. The lower cover 2112 may be formed of an opaque material to cover the space corresponding to the lower cover 2112 in the inner space of the lamp tube 2110. Lower cover 2112 may comprise polymethylmethacrylate and / or quartz. In an embodiment, the lower cover 2112 may further include at least one of a pigment, a filler, and the like.

Referring back to FIG. 17, the printed circuit board 2120 extends in the X direction and has a width in the Y direction. The printed circuit board 2120 is fixed in the lamp tube 2110. The printed circuit board 2120 drives the at least one ultraviolet light emitting device 2130 based on the power received through the power pin 2215.

At least one ultraviolet light emitting device 2130 is disposed on the printed circuit board 2120. In FIG. 17, ten ultraviolet light emitting devices are illustrated as arranged on the printed circuit board 2120 along the X direction. The ultraviolet light emitting device 2130 faces the upper cover 2111. The ultraviolet light emitting device 2130 is configured to emit ultraviolet light under the control of the printed circuit board. The ultraviolet light emitting device 2130 will be fixed so that its ultraviolet light will emit in the direction of the transparent top cover. According to an embodiment, the ultraviolet light emitting device 2130 may be an ultraviolet light emitting diode.

Bases

2141 and 2142 are fixed to both ends of the lamp tube 2110. The

bases

2141 and 2142 may block the inside of the lamp tube 2110 from the outside. At least one power pin 2215 is fixed to the

bases

2141 and 2142. The power pin 2215 is connected to an external connector (not shown) to receive power for driving the printed circuit board 2120. In an embodiment, when the external connector provides the DC power, the printed circuit board 2120 will receive the DC power through the power pin 2215. In an embodiment, when the external connector provides AC power, the ultraviolet lamp 2100 may further include a power supply configured to convert AC power received through the power pin 2151 to DC power. The power supply will provide the converted direct current power to the printed circuit board 2120.

In an embodiment, the

bases

2141 and 2142 may include polycarbonate (PC).

19 is a cross-sectional view of the ultraviolet lamp 2100 along the line II ′ of FIG. 17.

Referring to FIG. 19, the ultraviolet lamp 2100 further includes a heat sink 2160. The heat sink 2160 is configured to dissipate heat generated when the printed circuit board 2120 is driven. For example, the lower portion of the heat sink 2160 may include a plurality of irregularities as shown in FIG. 19. The plurality of recesses and protrusions causes the lower portion of the heat sink 2160 to have a large surface area, and thus the heat sink 2160 can efficiently dissipate heat.

Heat sink 2160 is secured to lamp tube 2110. For example, the upper cover 2111 and the lower cover 2112 each include a protrusion 2111_1 and a protrusion 2112_1 protruding toward the inner space, and the heat sink 2160 is provided at the protrusions 2111_1 and 2112_1. Can be fixed.

A groove 2161 may be formed on the heat sink 2160. As the printed circuit board 2120 is located in the groove 2161, the heat sink 2160 will support the printed circuit board 2120. The heat sink 2160 may include at least one protrusion 2162 protruding from the top of the groove 2161 in the Y direction or the direction opposite to the Y direction. By the protrusions 2162, the printed circuit board 2120 may be effectively fixed to the heat sink 2160.

20A is a graph showing a change in transmittance of the upper cover 2111 including polymethylmethacrylate according to the change of the wavelength of light. In FIG. 20A, the horizontal axis represents wavelength in nanometers (nm) and the vertical axis represents transmittance.

Referring to FIG. 20A, the top cover 2111 including polymethyl methacrylate at 200 nm has a transmittance of 0%. Near about 300 nm, the transmittance of the top cover 2111 increases rapidly. At about 340 nm, the transmittance of the upper cover 2111 is higher than 90%, and at a wavelength of 360 nm or more, the transmittance of the upper cover 2111 is stably maintained at a value higher than 90%. For example, the transmittance of the top cover 2111 at 400 nm, 500 nm, 600 nm, 700 nm, 800 nm, 900 nm, 1000 nm, and 1100 nm has a value higher than 90%. It can be understood that polymethylmethacrylate has a critical significance at about 360 nm.

According to the exemplary embodiment of the present invention, the ultraviolet light emitting device 2130 emits ultraviolet rays having a wavelength of 360 nm or more toward the upper cover 2111, and the upper cover 2111 includes polymethyl methacrylate. The upper cover 2111 may transmit the ultraviolet ray with high transmittance.

Ultraviolet rays can generally have a wavelength region of about 100-400 nm. The ultraviolet light emitting device 2130 may emit ultraviolet light having a wavelength selected from a wavelength range of 360 nm to 400 nm.

Meanwhile, polymethyl methacrylate may have a material property that is strained at a relatively low temperature. The possibility of deformation of the top cover 2111 due to heat is problematic when ultraviolet rays having a wavelength of 360 nm or more are transmitted to the top cover 2111 including polymethyl methacrylate.

FIG. 20B is a graph showing a change in transmittance of the upper cover 2111 with time when the upper cover 2111 including polymethyl methacrylate transmits ultraviolet rays having a wavelength of 360 nm. FIG. 21 is a graph showing a change in transmittance of the upper cover 2111 having a diffusing agent according to a change in wavelength of light. 20B and 21, the horizontal axis represents time and the vertical axis represents transmittance.

Referring to FIG. 20B, even if the time for which the top cover 2111 is exposed to ultraviolet rays having a wavelength of 360 nm is increased, the transmittance of the top cover 2111 is maintained at about 90%. For example, when the time when the upper cover 2111 is exposed to the corresponding ultraviolet rays is 0 hours, 250 hours, 500 hours, 750 hours, 1000 hours, 2000 hours, and 3000 hours, the transmittance of the upper cover 2111 is about. 90%. Depending on the experimental error, it will be appreciated that the transmittance of the top cover 2111 may vary from about 5% to 10%.

Even if the upper cover 2111 is continuously exposed to ultraviolet rays having a wavelength of 360 nm, the transmittance is maintained high, which may mean that the upper cover 2111 is not deformed even if the upper cover 2111 is continuously exposed to the ultraviolet rays. For example, even if the upper cover 2111 is continuously exposed to the corresponding ultraviolet rays, the color of the upper cover 2111 will not change or cracks will occur in the upper cover 2111. This may mean that heat is not easily generated in the upper cover 2111 when the ultraviolet rays are used. It can be understood that this is due to the efficient transmission of the upper cover 2111 without absorbing the corresponding ultraviolet rays. Therefore, although the polymethyl methacrylate has physical properties that are deformed at a relatively low temperature, the upper cover 2111 containing polymethyl methacrylate is provided when an ultraviolet light emitting device that emits ultraviolet rays having a wavelength of 360 nm or more is provided. May not be modified.

As a result, the upper cover 2111 transmits ultraviolet rays having a wavelength of 360 nm or more with high transmittance, but will not be deformed even if exposed to the ultraviolet rays for a long time.

In an embodiment, the top cover 2111 may include no diffusion agent or a small amount of diffusion agent for diffusing light. A diffusing agent may be included in the tube of the lamp that emits visible light. By the diffusing agent, the visible light transmitted through the tube is diffused and the uniformity of the visible light is increased. Assume that the top cover 2111 includes a diffusing agent. Ultraviolet rays having a wavelength of 360 nm or more may be absorbed and scattered by the diffusing agent such that transmittance of the upper cover 2111 may be reduced. Referring to FIG. 21, the transmittance of the upper cover 2111 is less than 10% at 360 nm and has a transmittance of 90% at 400 nm or more. This means that the upper cover 2111 has a high transmittance with respect to visible light when it includes a diffusing agent, but has a low transmittance with ultraviolet rays having a wavelength of 360 nm to 400 nm. According to the present embodiment, the upper cover 2111 may not include a diffusion agent or may include a small amount of the diffusion agent. Accordingly, the transmittance for ultraviolet light having a wavelength of 360 nm or more of the upper cover 2111 will be kept high as described with reference to FIG. 20B. Furthermore, since absorption and refraction of ultraviolet rays by the diffusing agent do not occur, the possibility of deformation of the upper cover 2111 due to heat can be reduced.

In an embodiment, the top cover 2111 may include no impact modifier, for example an acrylic rubber, or a small amount of impact modifier. Without absorption of ultraviolet light by the impact modifier, the transmittance for ultraviolet light with a wavelength greater than or equal to 360 nm of the top cover 2111 will remain high as described with reference to FIG. 20B.

For example, top cover 2111 includes pure polymethylmethacrylate (clear PMMA).

22 is a cross-sectional view of an ultraviolet lamp 2100 according to another embodiment of the present invention.

Referring to FIG. 22, a printed circuit board 2220, an ultraviolet light emitting device 2230, a heat sink 2260, and a power supply 2270 are provided inside the upper cover 2211 and the lower cover 2212. Is provided.

As described with reference to FIGS. 20A and 20B, the top cover 2211 has a high transmittance without deformation for ultraviolet light having a wavelength of 360 nm. Accordingly, the internal structure of the lamp tube may be changed such that the heat sink 2260 is located at a high height H1 such that the distance between the ultraviolet light emitting device 2230 and the upper cover 2211 is shorter than in the embodiment of FIG. 19. Can be.

The heat sink 2260 may be located at a position higher than or equal to the height H1. The height H1 may be higher than the height H2 corresponding to the radius of the lamp tube (see 2110 of FIG. 17). Accordingly, an area in which the power supply device 2270 is disposed between the heat sink 2260 and the lower cover 2212 may be secured. In this case, the upper cover 2211 may include polymethyl methacrylate and / or quartz, but may be formed to be transparent, and the lower cover 2212 may include polymethyl methacrylate and / or quartz, but may be formed to be opaque. have.

Heat sink 2260 may be secured to the lamp tube in a variety of ways. For example, as shown in FIG. 22, the lower cover 2212 includes first and second protrusions 2212_1 and 2212_2 protruding into the inner region of the lamp tube, and the heat sink 2260 is the first. And the second protrusions 2212_1 and 2212_2.

The power supply device 2270 is configured to convert AC power from the outside into DC power and provide the converted DC power to the printed circuit board 2220. In an embodiment, the power supply 2270 may be a switched mode power supply (SMPS).

23 is a cross-sectional view of an ultraviolet lamp 2100 according to another embodiment of the present invention. 24 is an exploded perspective view illustrating a printed circuit board 2320, ultraviolet light emitting devices 2330, a heat sink 2360, and a flame retardant layer 2380.

Referring to FIG. 23, a printed circuit board 2320, an ultraviolet light emitting device 2330, a heat sink 2360, and a flame resisting layer 2380 are disposed inside the upper cover 2311 and the lower cover 2312. Is provided.

The polymethylmethacrylate included in the top cover 2311 may have physical properties that are modified at a relatively low temperature. Meanwhile, the printed circuit board 2320 may generate a spark, a flame, or the like during driving.

According to an embodiment of the present invention, a flame resistant layer 2380 is provided between the printed circuit board 2320 and the top cover 2311. The flame retardant layer 2380 may be disposed on the printed circuit board 2320. The flame retardant layer 2380 includes a material that is difficult to burn. The flame retardant layer 2380 may protect the upper cover 2311 from sparks and flames generated from the printed circuit board 2320.

A groove 2361 may be formed in the heat sink 2360. The heat sink 2360 may include at least one protrusion 2362 protruding from the top of the groove 2361 in a Y direction or a direction opposite to the Y direction. Printed circuit board 2320 and flame retardant layer 2380 may be received in groove 2361 and secured by protrusion 2362.

Referring to FIG. 24, the flame retardant layer 2380 includes at least one hole 381. Each hole 381 may correspond to each ultraviolet light emitting device 2330 on the printed circuit board 2320. When the flame retardant layer 2380 is attached to the printed circuit board 2320, the ultraviolet light emitting device 2330 passes through the hole 381. After attachment, the ultraviolet light emitting device 2330 will penetrate through the flame retardant layer 2380 toward the top cover 2311. Printed circuit board 2320 and flame retardant layer 2380 are secured in groove 2361.

25 is a cross-sectional view of an ultraviolet lamp 2100 according to another embodiment of the present invention.

Referring to FIG. 25, a printed circuit board 2420, an ultraviolet light emitting device 2430, a heat sink 2460, and a flame retardant layer 2480 are provided inside the upper cover 2411 and the lower cover 2412.

Printed circuit board 2420 is located in groove 2241 formed in heat sink 2460. The flame retardant layer 2480 may be provided to cover the top of the heat sink 2460 and the printed circuit board 2420. For example, an adhesive may be used to fix the flame retardant layer 2480 on top of the heat sink 2460 and on the printed circuit board 2420.

FIG. 26 is a cross-sectional view of the ultraviolet lamp 2100 along the line II-II ′ of FIG. 17.

Referring to FIG. 26, a printed circuit board 2120, an ultraviolet light emitting device 2130, and a heat sink 2160 are provided inside the upper cover 2111 and the lower cover 2112. The base 2141 is fixed to one end of the lamp tube 2110 (see FIG. 17). The base 2141 may include grooves for receiving the upper cover 2111 and the lower cover 2112 as shown in FIG. 26. The base 2141 may include a support portion 2141_1 protruding in the X direction to support the heat sink 2160.

The ultraviolet light emitting device 2130 may have a predetermined directivity range RG. For example, the ultraviolet light emitting device 2130 may emit ultraviolet light within a directivity angle of 120 degrees. According to an embodiment of the present disclosure, the ultraviolet light emitting device 2130 may be positioned such that the base 2141 is positioned outside the directivity range RG. The ultraviolet light emitting device 2130 may be spaced apart from the base 2141 by a specific distance such that the base 2141 is positioned outside the directivity range RG.

In an embodiment, the base 2141 may include an ultraviolet stabilizer. Depending on the UV stabilizer, even if ultraviolet rays are irradiated onto the base 2141, physical properties of the base 2141 may be stably maintained. For example, the UV stabilizer can include at least one of an absorbent, a quencher, a Hindered Amine Light Stabilizer (HALS), and the like.

FIG. 27 is a diagram illustrating a modified embodiment 2500 of the ultraviolet lamp 2100 of FIG. 17. 28 is a cross-sectional view of the ultraviolet lamp 2500 of FIG. 27. For convenience of description, a portion of the ultraviolet lamp 2500 is shown in FIGS. 27 and 28.

Referring to FIGS. 27 and 28, the lamp tube 2510 includes an upper cover 2511 and a lower cover 2512. The upper cover 2511 and the lower cover 2512 are configured similarly to the upper cover 2111 and the lower cover 2112 described with reference to FIGS. 17 and 18. Duplicate explanations will be omitted below.

The base 2551 is fixed to the end of the lamp tube 2510. The base 2541 may include a support 2551_1 configured to support the heat sink 2560.

The ultraviolet light emitting device 2530 is disposed on the printed circuit board 2520. The printed circuit board 2520 may be disposed on the heat sink 2560 and may include a protrusion 2521 extending from the inner space of the lamp tube 2510 and penetrating the base 2551. The shape of the protrusion 2521 will be formed to accommodate an external connector for providing power. The ultraviolet lamp 2500 will receive power through the protrusion 2521.

When the external connector provides the DC power, the printed circuit board 2520 may receive the DC power through the protrusion 2521. When the external connector provides AC power, the ultraviolet lamp 2500 may further include a power supply (see 2270 in FIG. 22) configured to convert AC power received through the protrusion 2521 into DC power. . The power supply will provide the converted direct current power to the printed circuit board 2520.

29 is a cross-sectional view of an ultraviolet lamp 2100 according to another embodiment of the present invention.

Referring to FIG. 29, the ultraviolet lamp 2100 further includes a flame retardant layer 2180. The flame retardant layer 2180 is disposed on the inner surface of the lamp tube 2110.

The printed circuit board 2120, the ultraviolet light emitting device 2130, and / or the heat sink 2160 may generate and / or transfer heat, and the heat may be transferred to the lamp tube 2110. According to an embodiment of the present disclosure, a flame retardant layer 2180 may be further provided on at least a portion of an inner surface of the lamp tube 2110. Accordingly, deformation or burning of the lamp tube 2110 and / or the ultraviolet lamp 2100 can be prevented.

In an embodiment, the flame retardant layer 2180 may be disposed on the entire inner surface of the lamp tube 2110. In another embodiment, the flame retardant layer 2180 may be disposed on a portion of the inner surface of the lamp tube 2110.

In an embodiment, the flame retardant layer 2180 may include fluorine.

30 is a cross-sectional view of an ultraviolet lamp 2100 according to another embodiment of the present invention.

Referring to FIG. 30, the flame retardant layer 2190 may surround at least a portion of an outer surface of the lamp tube 2110. In an embodiment, the flame retardant layer 2190 may be disposed on the entire outer surface of the lamp tube 2110. In another embodiment, the flame retardant layer 2190 may be disposed on a portion of the outer surface of the lamp tube 2110. Accordingly, deformation or burning of the lamp tube 2110 and / or the ultraviolet lamp 2100 can be prevented. In addition, the flame retardant layer 2190 may surround the lamp tube 2110 and support the lamp tube 2110 to prevent the lamp tube 2110 from being scattered by an external impact. For example, this advantage is more pronounced when the lamp tube 2110 has good cracking properties, including, for example, quartz.

FIG. 31 is a flowchart for explaining a method of manufacturing the lamp tube 2110 of FIG. 17.

Referring to FIG. 31, in step S110, a first raw material corresponding to the upper cover 2111 (see FIG. 18) and a second raw material corresponding to the lower cover 2112 (see FIG. 18) are prepared. For example, the first raw material and the second raw material may be provided to different hoppers, respectively.

The first raw material includes polymethyl methacrylate and / or quartz. In an embodiment, the first raw material may include no diffusion agent or may include a small amount of diffusion agent. In an embodiment, the first raw material may include no impact modifier or a small amount of impact modifier.

The second raw material may comprise polymethylmethacrylate and / or quartz and materials for the lower cover 2112 to be colored, for example pigments, fillers, and the like. .

In step S120, the first raw material is melted to produce a first melt, and the second raw material is melted to produce a second melt.

For example, the first melt and the second melt will each be produced in different cylinders. From each hopper, the corresponding raw material will be supplied to the cylinder. In the cylinder, the feedstock supplied will be transported, melted, and compressed at an appropriate pressure to produce a melt.

In step S130, the first melt and the second melt is passed through one mold. For example, the first melt and the second melt transported through different cylinders will pass through one mold. For example, the top cover and the bottom cover may be molded according to a profile extrusion process.

It will be appreciated that the mold can have any of a variety of shapes. For example, the mold may have shapes corresponding to the upper cover 2111 and the lower cover 2112 shown in FIG. 19. As another example, the upper cover 211 and the lower cover 212 shown in FIG. It may have a shape corresponding to the.

According to an exemplary embodiment of the present invention, the transparent upper cover 2111 and the opaque lower cover 2112 may be integrally formed by passing the first melt and the second melt through one mold.

In step S140, the upper cover 2111 and the lower cover 2112 are cooled to provide a lamp tube 2110. For example, the upper cover 2111 and the lower cover 2112 may be cooled by the coolant to maintain the molded shape according to the mold. For example, lamp tube 2110 may be cut to have an appropriate length.

Thereafter, the printed circuit board 2120 (see FIG. 19), the ultraviolet light emitting device 2130 (see FIG. 19), and the heat sink 2160 (see FIG. 19) will be disposed in the lamp tube 2110.

According to an embodiment of the present invention, the ultraviolet lamp includes an ultraviolet light emitting device that emits ultraviolet rays having a wavelength of 360 nm or more toward the upper cover, and a top cover having polymethyl methacrylate. The upper cover will not deform even if exposed to the ultraviolet rays for a long time while transmitting the ultraviolet rays with high transmittance. Thus, an ultraviolet lamp with improved performance and reliability can be provided.

In the present invention as described above has been described by the specific embodiments, such as specific components and limited embodiments and drawings, but this is provided to help a more general understanding of the present invention, the present invention is not limited to the above embodiments. For those skilled in the art, various modifications and variations are possible from these descriptions.

Therefore, the spirit of the present invention should not be limited to the described embodiments, and all the things that are equivalent to or equivalent to the claims as well as the following claims will belong to the scope of the present invention. .

As such, the tubular LED lighting apparatus according to the embodiment of the present invention has a shorter separation distance between the heat sink and the cover, thereby improving heat dissipation. In addition, the tubular LED lighting apparatus according to an embodiment of the present invention is formed so that one end of the substrate on which the electrode is formed is located inside the base, it can be electrically connected to the external power supply without wire bonding. Therefore, the tubular LED lighting device can simplify the process by eliminating wire bonding, and can prevent defects due to opening and short circuit due to wire bonding.

Claims

Board;

A light emitting device mounted on the substrate;

A heat sink in which the substrate is seated on one surface, and recesses inwardly formed on both sides thereof;

A cover including the heat sink, the substrate, and the light emitting device, the cover including a protrusion protruding from an inner wall and inserted into the groove; And

A base coupled to both ends of the cover;

Including;

The shape of both sides of the heat sink corresponding to the shape of the inner wall of the cover tubular LED lighting device.
The method according to claim 1,

The heat sink further comprises a tubular LED lighting device surrounding both sides of the substrate.
The method according to claim 2,

One surface of the substrate fixing portion is a tubular LED lighting device that increases in height from the inner side to the outer side on which the substrate is seated.
The method according to claim 1,

The heat sink further comprises a heat dissipation fin on the other surface facing the one surface.
The method according to claim 1,

One end of the substrate penetrates the base is located inside the base of the tubular LED lighting device.
The method according to claim 5,

A tubular LED lighting device is formed with a power pad on one end of the substrate.
The method according to claim 6,

The power pad is a tubular LED lighting device formed on one surface of one end of the substrate.
The method according to claim 6,

The power pad is a tubular LED lighting device each formed on one side and the other side of the substrate.
The method according to claim 6,

The power pad is a tubular LED lighting device formed on each side of one end of the substrate.
The method according to claim 6,

One end protrudes out of the base, the other end of the tubular LED lighting device further comprises a connector in contact with the power pad formed on one end of the substrate.
The method according to claim 1,

The inner wall of the cover is a tubular LED lighting device having a shape including a curved surface.
The method according to claim 11,

Both sides of the heat sink is a tubular LED lighting device having a shape including a curved surface.
The method according to claim 1,

The cover is a tubular LED lighting device formed of a light-transmissive material.
The method according to claim 1,

A portion of the cover is formed of a light-transmissive material, the other portion is a tubular LED lighting device formed of a non-translucent material.
The method according to claim 1,

The cover is a tubular LED lighting device formed of a color comprising at least one of transparent, translucent and colored.
The method according to claim 1,

At least a portion of the cover is a tubular LED lighting device formed of a pure polymethylmethacrylate (PMMA) material.
The method according to claim 16,

And a region in which the light of the light emitting element is transmitted from the cover is formed of the pure PMMA.
Board;

A light emitting device mounted on the substrate;

A heat sink in which the substrate is seated on one surface, and recesses inwardly formed on both sides thereof;

A cover including the heat sink, the substrate, and the light emitting device, the cover including a protrusion protruding from an inner wall and inserted into the groove; And

A base coupled to both ends of the cover;

Including;

One end of the substrate penetrates the base is located inside the base of the tubular LED lighting device.
The method according to claim 18,

The heat sink further comprises a tubular LED lighting device surrounding both sides of the substrate.
The method according to claim 19,

One surface of the substrate fixing portion is a tubular LED lighting device that increases in height from the inner side to the outer side on which the substrate is seated.
The method according to claim 18,

The heat sink further comprises a heat dissipation fin on the other surface facing the one surface.
The method according to claim 18,

A tubular LED lighting device is formed with a power pad on one end of the substrate.
The method according to claim 22,

The power pad is a tubular LED lighting device formed on one surface of one end of the substrate.
The method according to claim 22,

The power pad is a tubular LED lighting device each formed on one side and the other side of the substrate.
The method according to claim 22,

The power pad is a tubular LED lighting device formed on each side of one end of the substrate.
The method according to claim 22,

One end protrudes out of the base, the other end of the tubular LED lighting device further comprises a connector in contact with the power pad formed on one end of the substrate.
The method according to claim 18,

The shape of both sides of the heat sink corresponding to the shape of the inner wall of the cover tubular LED lighting device.
The method of claim 27,

The inner wall of the cover is a tubular LED lighting device having a shape including a curved surface.
The method according to claim 28,

Both sides of the heat sink is a tubular LED lighting device having a shape including a curved surface.
The method according to claim 18,

The cover is a tubular LED lighting device formed of a light-transmissive material.
The method according to claim 18,

A portion of the cover is formed of a light-transmissive material, the other portion is a tubular LED lighting device formed of a non-translucent material.
The method according to claim 18,

And the cover comprises at least one of transparent, translucent and colored.
The method according to claim 18,

At least a portion of the cover is a tubular LED lighting device formed of a pure polymethylmethacrylate (PMMA) material.
The method according to claim 13,

And a region in which the light of the light emitting element is transmitted from the cover is formed of the pure PMMA.
A lamp tube including an upper cover and a lower cover integrally formed with the upper cover;

A printed circuit board fixed in the lamp tube;

At least one ultraviolet light emitting device disposed on the printed circuit board and facing the upper cover, the ultraviolet light emitting device emitting light toward the upper cover in accordance with control of the printed circuit board; And

And a flame retardant layer disposed between the printed circuit board and the top cover or surrounding at least a portion of an outer surface of the lamp tube.
The method of claim 35, wherein

The top cover is an ultraviolet lamp comprising polymethyl methacrylate or quartz.
The method of claim 35, wherein

The at least one ultraviolet light emitting device is an ultraviolet lamp for emitting ultraviolet light having a wavelength of 360nm (nanometer) or more.
The method of claim 35, wherein

The lower cover is UV lamp including the polymethyl methacrylate or quartz is formed to be opaque.
The method of claim 35, wherein

A heat sink fixed in the lamp tube and configured to dissipate heat generated by the printed circuit board,

Grooves are formed on the heat sink,

The printed circuit board and the flame retardant layer are located within the groove,

And the flame retardant layer covers the printed circuit board.
The method of claim 35, wherein

A heat sink fixed in the lamp tube and configured to dissipate heat generated by the printed circuit board,

Grooves are formed on the heat sink,

The printed circuit board is located within the groove,

The flame retardant layer covers the top of the heat sink and the printed circuit board.
The method of claim 35, wherein

And the flame retardant layer is attached to at least a portion of an inner surface of the lamp tube.
The method of claim 35, wherein

A heat sink supporting the printed circuit board and configured to dissipate heat generated by the printed circuit board; And

A power supply disposed between the heat sink and the lower cover and configured to convert AC power from the outside into DC power and to provide the converted DC power to the printed circuit board,

The lower cover is UV lamp including the polymethyl methacrylate or quartz is formed to be opaque.
The method of claim 35, wherein

Further comprising a base fixed to the end of the lamp tube,

The at least one ultraviolet light emitting device,

And an ultraviolet lamp positioned on the printed circuit board to emit the ultraviolet light within a predetermined directivity range, wherein the base is located outside the predetermined directivity range.
The method of claim 35, wherein

Further comprising a base fixed to the end of the lamp tube,

And the base comprises an ultraviolet stabilizer.