WO2018001374A1 - Heater-based method and apparatus for temperature control and optical module - Google Patents

Abstract

A heater-based method and apparatus for temperature control and an optical module. The heater-based temperature control method comprises: detecting the die temperature of a laser in an array waveguide grating (AWG) (S202); calculating the temperature difference between the die temperature and a set temperature (S204); and adjusting the die temperature of the AWG on the basis of the temperature difference (S206). The heater-based method for temperature control solves the problem of a heater being prone to an instantaneous current spike when adjusting the die temperature of the AWG.

Description

Heater-based temperature control method and device, optical module Technical field

The present disclosure relates to the field of optical communication technologies, for example, to a heater-based temperature control method and apparatus, and an optical module.

Background technique

In the related art, the optical module is mainly composed of a light receiving portion and a light transmitting portion, and further includes a Micro Controller Unit (MCU), a Field Programmable Gate Array (FPGA) control unit, and a power supply unit. The light receiving side device is integrated with an Arrayed Waveguide Grating (AWG) to perform splitting processing on the 10×10 Gb/s combined optical signal, so that different wavelengths correspond to a unique channel center. For the AWG, due to the reflection coefficient of the glass material, the wavelengths of the corresponding channel centers of the AWG will vary with the temperature of the AWG. For every 1 degree Celsius change in temperature, the channel center of the AWG will drift by 11 pm. In a standard AWG, this temperature drift is suppressed by an active temperature control system to ensure that the AWG's channel matches the International Telecommunication Union (ITU) standard. In order not to affect the performance of the system, the temperature change of the AWG chip must be kept within ±0.5 °C, and the temperature control of the AWG is usually achieved by a heater control circuit.

The hardware circuit on the receiver side controls the temperature of the receiver through the heater, and the heater can heat the receiver but cannot cool. When the AWG temperature is higher than the set working temperature, the heater control circuit controls the heater to heat the electrode, reducing the heater current and reducing the AWG temperature; when the AWG temperature is lower than the design working temperature, the heater control circuit controls the heater to heat the electrode and increase The amount of heater current, the refrigerator heats the die, and the AWG temperature will rise, which will stabilize the operating temperature of the AWG. The implementation of the heater hardware circuit function is accomplished by forming a negative feedback loop through the AWG component's thermistor (R _th ), the semiconductor cooler, and the hardware control circuitry to stabilize multiple corresponding channel center wavelengths of the AWG.

In the related art, only the analog circuit is included in the design of the heater control circuit on the receiver side, and FIG. 1 is a circuit diagram of the analog heater control loop in the related art according to the present disclosure, as shown in FIG. 1:

Where: V _set is the operating temperature of the AWG, V _REF = 2.5V, R ₁ = 10KΩ, V _EE = 3.3V, R _H = 5Ω, R ₄₃₀ = 10KΩ, C ₃₂₃ = 1μF and R ₄₃₁ = 221KΩ.

In order to test the stability of the control loop, it is necessary to constantly change the operating temperature _{Vset of the} AWG. When _Vset = 0.5V is _set , there is oscillation on the drain voltage V _D to instantaneously generate a large heater current. _Th = 1.25V, the temperature of the AWG will slowly lock to the temperature of the working point; continue to change the operating temperature of the AWG. When V _set = 0.3V is _set , the drain voltage V _D will appear to oscillate again, and the heater current is instantaneous. It becomes larger, but the temperature of the AWG is slowly locked to the temperature of the working point. When the operating temperature of the AWG is changed, the heater current will become instantaneously large.

It can be concluded that the instantaneous generation of a large heater current is caused by a defect in the hardware circuit design. The response of the receiver side heater control circuit changes with the temperature of the receiving side AWG, and can only be adjusted by adjusting the resistance of the heater control circuit. The size of the capacitor is used to change the lock time, resulting in poor portability of the heater control circuit, inaccurate control, and the like.

In view of the above problems in the related art, no effective solution has been found yet.

Summary of the invention

The embodiment provides a heater-based temperature control method and device, and an optical module, to solve the problem that the heater current is instantaneously increased when the temperature of the AWG is adjusted in the related art.

The embodiment provides a heater-based temperature control method, including:

Detecting a die temperature of a laser in an arrayed waveguide grating AWG;

Calculating a temperature difference between the die temperature and a set temperature;

The die temperature of the AWG is adjusted based on the temperature difference.

Optionally, detecting a die temperature of the laser in the AWG includes: acquiring a voltage value of the thermistor in the AWG; converting the voltage value into a corresponding temperature value according to a preset correspondence between the voltage value and the temperature value Determining that the temperature value obtained by the conversion is the current die temperature.

Optionally, adjusting the die temperature of the AWG according to the temperature difference comprises: generating a first voltage signal for controlling a voltage controlled current source in the AWG according to the temperature difference;

The die temperature is adjusted by heating control the die of the laser in accordance with the first voltage signal.

Optionally, adjusting a die temperature of the AWG according to the temperature difference, including:

Proportional integration of the temperature difference to obtain an integration result;

The die temperature is adjusted based on the integration result.

Optionally, adjusting the die temperature according to the integration result includes: generating a first voltage signal for controlling a voltage controlled current source in the AWG according to the integration result;

The die temperature is adjusted by heating control the die of the laser in accordance with the first voltage signal.

Optionally, the method for heating and controlling the die of the laser according to the first voltage signal comprises: controlling a magnitude of a resistance of the thermistor in the AWG according to the first voltage signal, The die of the laser is heated for control.

The embodiment further provides an optical module, including: a light receiving device and a field programmable gate array FPGA control unit, the light receiving device includes an arrayed waveguide grating AWG, the optical module further includes: a heater control device, configured to The die temperature of the AWG is controlled by the FPGA control unit.

Optionally, the heater control device further includes: a detecting device connected to the thermistor in the AWG, configured to detect a die temperature of the laser in the AWG; and a calculation circuit integrated in the FPGA control unit Connected to the detecting device, configured to calculate a temperature difference between the die temperature and the set temperature; and an adjustment circuit coupled to the calculation circuit, configured to adjust the tube of the AWG according to the temperature difference Core temperature.

Optionally, the detecting device further comprises: a detecting circuit configured to detect an analog voltage signal of the thermistor in the AWG; an analog-to-digital converter ADC configured to convert the analog voltage signal into a digital voltage signal; and a processing unit And being configured to convert the digital voltage signal into a corresponding temperature value according to a correspondence between the voltage value and the temperature value.

Optionally, the calculation circuit further includes: a calculation module configured to calculate a temperature difference between the die temperature and the set temperature; and a proportional integration module configured to perform proportional integration on the temperature difference to obtain an integration result .

Optionally, the adjustment circuit further includes: a digital-to-analog converter connected to the proportional integration module, configured to convert the integration result into a corresponding analog signal; and an adjustment unit configured to be controlled according to the analog signal The magnitude of the resistance of the thermistor in the AWG.

The embodiment further provides a heater-based temperature control device, comprising: a detection module configured to detect a die temperature of a laser in the arrayed waveguide grating AWG; and a calculation module configured to calculate the die temperature and the set temperature a temperature difference between the electrodes; and an adjustment module configured to adjust a die temperature of the AWG based on the temperature difference.

This embodiment also provides a storage medium. The storage medium is arranged to store program code for performing the following steps:

Detecting a die temperature of a laser in an arrayed waveguide grating AWG;

Calculating a temperature difference between the die temperature and a set temperature;

The die temperature of the AWG is adjusted based on the temperature difference.

The embodiment further provides a computer readable storage medium storing computer executable instructions for performing any of the above methods.

The embodiment further provides an optical module device, the optical module device comprising one or more processors, a memory and one or more programs, the one or more programs being stored in the memory when being processed by one or more When the device is executed, perform any of the above methods.

The embodiment further provides a computer program product comprising a computer program stored on a non-transitory computer readable storage medium, the computer program comprising program instructions, when the program instructions are executed by a computer Having the computer perform any of the methods described above.

In this embodiment, by detecting the die temperature of the laser in the arrayed waveguide grating AWG, the temperature difference between the die temperature and the set temperature is calculated, and the die temperature of the AWG is adjusted according to the temperature difference, and the die temperature is The working temperature of the AWG can be used to change the temperature of the die by using digital calculation and feedback. It can change the locking time with more flexibility. It can solve the problem that the heater current is easily increased when the temperature of the AWG is adjusted in the related art. The problem is flexible and convenient.

DRAWINGS

1 is a circuit diagram of an analog heater control loop in accordance with the related art of the present disclosure;

2 is a flowchart of a heater-based temperature control method according to the present embodiment 1;

Figure 3 is a block diagram showing the structure of a heater-based temperature control device according to the second embodiment;

4 is a block diagram showing the structure of an optical module according to the second embodiment;

Figure 5 is a block diagram of a heater modulus combining control loop according to the third embodiment;

Figure 6 is a graph showing the relationship between voltage and temperature of the thermistor according to the third embodiment;

Figure 7 is a graph showing the relationship between power and temperature according to the present embodiment 3;

Figure 8 is a block diagram of a heater digital control according to the present embodiment 3;

Figure 9 is a block diagram of a heater simulation control according to the present embodiment 3;

Figure 10 is a block diagram showing the control of the AWG heater in the 100G module according to the third embodiment;

FIG. 11 is a schematic diagram showing the hardware structure of an optical module device according to Embodiment 3.

detailed description

The terms "first", "second" and the like in the specification and claims of the present disclosure and the above-mentioned figures are used to distinguish similar objects, and are not necessarily used to describe a particular order or order.

Example 1

In the present embodiment, a heater-based temperature control method is provided, and FIG. 2 is a flowchart of a heater-based temperature control method according to the present embodiment. As shown in FIG. 2, the flow may include S202-S206. .

In S202, the die temperature of the laser in the arrayed waveguide grating AWG is detected.

In S204, a temperature difference between the die temperature and the set temperature is calculated.

In S206, the die temperature of the AWG is adjusted according to the temperature difference.

Through the above steps, detecting the die temperature of the laser in the arrayed waveguide grating AWG, calculating the temperature difference between the die temperature and the set temperature, and adjusting the die temperature of the AWG according to the temperature difference, the die temperature is the operating temperature of the AWG, By using the digital calculation and feedback to adjust the temperature of the die, the locking time can be changed flexibly, and the problem that the heater current is instantaneously increased when adjusting the die temperature of the AWG in the related art is solved, and the utility model has the advantages of flexible and convenient use. effect.

Alternatively, the execution body of the above steps may be a temperature control device of a heater, such as a heater control device of an AWG, etc., but is not limited thereto.

Optionally, the die temperature of the AWG is adjusted according to the temperature difference, including S12-S14.

In S12, generating a first voltage signal for controlling a voltage controlled current source in the AWG according to the temperature difference;

In S14, the die temperature is adjusted by heating the die of the laser according to the first voltage signal.

Optionally, detecting the die temperature of the laser in the AWG includes S22-S26.

In S22, the voltage value of the thermistor in the AWG is obtained.

In S24, the voltage value is converted into a corresponding temperature value according to a preset correspondence between the voltage value and the temperature value.

In S26, it is determined that the temperature value obtained by the conversion is the current die temperature.

Optionally, adjusting the die temperature of the AWG based on the temperature difference includes S32-S34.

In S32, the temperature difference is proportionally integrated to obtain an integration result.

In S34, the die temperature is adjusted in accordance with the integration result.

The integration result can be given to a digital to analog converter (DAC) or the integration result can be given to the open module before being given to the DAC.

Optionally, adjusting the die temperature based on the integration result includes S42-S44.

In S42, a first voltage signal for controlling the voltage controlled current source in the AWG is generated based on the integration result.

The integration result is converted by the DAC into the above first voltage signal.

In S44, the die temperature is adjusted by heating the die of the laser according to the first voltage signal.

Optionally, the method of heating and controlling the die of the laser according to the first voltage signal comprises: controlling the magnitude of the resistance of the thermistor in the AWG according to the first voltage signal to perform heating control on the die of the laser.

Optionally, the manner of heating control of the dies of the laser according to the first voltage signal comprises: The magnitude of the resistance of the thermistor in the AWG is controlled according to the first voltage signal to heat the die of the laser.

The method of the foregoing embodiment may be implemented by means of software and a general hardware platform, or may be implemented by hardware. The method provided in this embodiment may be embodied in the form of a computer software product, which may be stored in a storage medium (such as a ROM/RAM, a magnetic disk, an optical disk), and includes a plurality of instructions for causing a terminal device ( Any method of this embodiment can be performed by a mobile phone, a computer, a server, or a network device.

Example 2

In this embodiment, a heater-based temperature control device and a physical device optical module are provided, and the method provided by the above implementation may be performed, and the description has been omitted.

3 is a block diagram showing the structure of a heater-based temperature control device according to the present embodiment. As shown in FIG. 3, the device may include:

The detection module 30 is configured to detect the die temperature of the laser in the arrayed waveguide grating AWG.

A calculation module 32 is provided to calculate a temperature difference between the die temperature and the set temperature.

The adjustment module 34 is configured to adjust the die temperature of the AWG based on the temperature difference.

4 is a structural block diagram of an optical module according to the embodiment. The optical module is a physical device provided by the embodiment, and the heater control device can be applied to the optical module, and the heater control device can be applied to other devices. The optical module is taken as an example here, and other devices are also applicable. As shown in FIG. 4, the optical module may include: a light receiving device 40 and a field programmable gate array FPGA control unit 42. The light receiving device 40 may include an arrayed waveguide grating AWG 402, and the optical module may further include: a heater control device 44. Set to control the die temperature of the AWG through the FPGA control unit.

Optionally, the heater control device 44 further includes: a detecting device connected to the thermistor in the AWG Connected, set to detect the die temperature of the laser in the AWG; the calculation circuit is integrated in the FPGA control unit, connected to the detecting device, set to calculate the temperature difference between the die temperature and the set temperature; the adjustment circuit, and the calculation circuit Connect, set to adjust the die temperature of the AWG based on the temperature difference.

Optionally, the detecting device further includes: a detecting circuit configured to detect an analog voltage signal of the thermistor in the AWG; and an analog to digital converter (ADC) configured to convert the analog voltage signal into a digital voltage signal; The processing unit is configured to convert the digital voltage signal into a corresponding temperature value according to a preset correspondence between the voltage value and the temperature value, and determine the temperature value as the die temperature.

Optionally, the calculation circuit further includes: a calculation module configured to calculate a temperature difference between the die temperature and the set temperature; and a proportional integration module configured to perform proportional integration on the temperature difference to obtain an integration result.

Optionally, the adjusting circuit further comprises: a digital-to-analog converter connected to the proportional-integral module, configured to convert the integrated result into a corresponding analog signal; and an adjusting unit configured to control the resistance of the thermistor in the AWG according to the analog signal. size.

Each of the above modules may be implemented by software or hardware. For example, the above modules may be disposed in the same processor, or may be respectively disposed in different processors in any combination.

Example 3

The embodiment provides a dynamic adjustable heater current control device, which can change the lock time by modifying the parameter setting, and solve the problem that the instantaneous heater current becomes large, so as to meet the working temperature requirement of the AWG in different receiver devices. Compared with the related art, the digital feedback can eliminate the instantaneous heater current and can flexibly change the locking time. The system has the characteristics of flexibility, convenience and practicality.

FIG. 5 is a block diagram of a heater modulus combined control loop according to the present embodiment, as shown in FIG. 5:

The workflow of the heater current control algorithm is as follows:

The voltage value V _{th of the} thermistor is collected by the ADC, and the voltage value of the thermistor is converted into a corresponding temperature value T _H according to the following formula (1):

Where: T ₀ = 25 ° C, representing the reference temperature;

R ₀ =10KΩ, which represents the resistance of the thermistor at 25°C, β=3475K, which represents the temperature coefficient of the thermistor; the conversion formula of Celsius and absolute temperature is: T(K)=T[°C]+273.15 , VREF is the reference voltage.

The relationship between the voltage value of the thermistor and the temperature is as shown in FIG. 6. FIG. 6 is a graph showing the relationship between the voltage and the temperature of the thermistor according to the present embodiment, which is based on data obtained by a plurality of tests, as can be seen from FIG. When the voltage of the thermistor becomes small, the converted temperature value becomes larger; when the voltage of the thermistor becomes larger, the converted temperature value becomes smaller; since the formula for converting the voltage into temperature is complicated, a lookup table can be used. To determine the temperature value obtained by voltage conversion.

The converted temperature value T _H is subtracted from the _set operating temperature T _set to obtain a temperature difference T _err , and the result T _err is proportionally integrated to obtain an integration result X, which is combined with FIG. 6 , the heater power P _H The calculation formula is as shown in formula (2):

Wherein, I _H is the current of the heater, R _H is the resistance of the heater, and R ₂ is the second resistance.

According to formula (2), it can be seen that the power P _{H of the} heater is linear with the integral result X of the output. The larger the value of X, the larger the power value of the heater; Fig. 7 is a graph showing the relationship between power and temperature according to the present embodiment. As shown in Fig. 7, the power of the heater is proportional to the temperature of the heater.

Therefore, it can be concluded that when the data output from the DAC becomes larger, the power of the heater becomes larger, and the temperature of the heater rises. The temperature of the thermistor senses the heater, and the resistance of the thermistor becomes smaller. The voltage of the thermistor also becomes smaller; when the data output from the DAC becomes smaller, the power of the heater becomes smaller, then the temperature of the heater decreases, the temperature of the thermistor senses the temperature of the heater, and the resistance of the thermistor changes. Large, the voltage of the thermistor also becomes larger.

In this embodiment, the digital portion includes the following process:

Figure 8 is a block diagram of the heater digital control according to the present embodiment, the functional block diagram of the digital portion of the heater control loop is as shown in Figure 8:

In Fig. 8, 101 is an ADC chip, performs data acquisition, and converts the analog voltage signal into a digital signal as input data of the heater control loop, and 102 is an implementation module of the lookup table, which converts the input voltage _Vth into temperature T. _TH; temperature 103 converts the temperature value T _th AWG set operating point T _set values taking the difference T _err; 104 results difference T _err performs a proportional integral; 105 sum the integration result to the external DAC chip.

The working steps of the digital control loop of the heater current of this embodiment are as follows:

Step 1: Set the working temperature value T _{set of the} AWG and the proportional coefficient ki, kp of the proportional integral;

Since the coefficients of ki and kp are configurable, the step size of the proportional integral is variable.

Step two: through the ADC acquisition chip, the input analog voltage is converted into a digital voltage Vth;

Step 3: According to the ROM lookup table, find the corresponding temperature value by inputting the voltage value.

The use of FPGA resources needs to be considered when making the voltage conversion temperature into a ROM lookup table according to formula (1). Since the ADC is a 16-bit precision chip, the ADC range is 0 to 65535, and the operating temperature of the AWG is mostly around 75 °C, which can reduce the addressing range of the lookup table, such as between 65 ° C and 85 ° C. For detailed investigation, when it is higher than 85 ° C and lower than 65 ° C, a fixed temperature value can be output.

Step 4: Take the difference between the result of the lookup table and the set temperature value T _set . When the difference is positive, it means that it is higher than the set temperature T _set and needs to be cooled. When the difference is negative, it means that it is lower than the set temperature T _set and needs to be warmed up.

The result _Terr is integrated into the proportional integration module, and the result of the integration is output to the DAC for subsequent processing.

In this embodiment, the implementation of the analog portion includes the following:

9 is a block diagram of a heater analog control according to the present embodiment, which converts an input voltage value into a current. When the current I _d becomes large, the heater power becomes large, and the heater temperature increases, and the thermistor senses. The temperature of the heater, the resistance of the thermistor is reduced, and the voltage of the thermistor is also reduced; when the current I _d becomes smaller, the power of the heater becomes smaller, and the temperature of the heater decreases, and the temperature of the thermistor senses the heater. The resistance of the thermistor increases, and the voltage of the thermistor also increases. The voltage of the thermistor is obtained according to the following formula (3):

Where R _th is the resistance of the thermistor.

The device parameters selected for the analog circuit are as follows: first resistor R ₁ =10KΩ, R ₂ =10kΩ, V _CC =2.5V, R _H =5Ω, V _REF =2.5V.

The following is a general description of the analog part and the digital part. FIG. 10 is a block diagram of the AWG heater control in the 100G module according to the embodiment, including: an analog control circuit and a digital feedback part, which together constitute a control circuit of the AWG heater current, as shown in FIG. Shown. In the receiving side of the optical module, each optical receiver component (Receiver Optical Subassembly, ROSA) integrates an AWG inside, and only the AWG corresponding to each ROSA device works at a suitable temperature to allow each optical signal to pass. The own grid, the 100Gb / s optical signal sent from the receiving end, is divided into 10 parallel 10Gb / s optical signals by the AWG. The thermistor is used to detect the change of the die temperature of the AWG laser. When the temperature rises, the resistance of the thermistor becomes smaller, and the voltage of the thermistor becomes smaller. The change of the voltage is collected by the ADC. After converting the voltage into temperature, the corresponding difference is obtained by comparing with the set temperature value, and the difference of the output is integrated to generate a voltage signal for controlling the voltage control current source of the heater. The heater heats the die of the laser according to the magnitude of the current flowing in, thereby controlling the temperature of the receiver, so that the heater control circuit is a negative feedback temperature control loop, which can achieve temperature stability of the receiver.

In the above scenario where the operating temperature of the receiver heater is controlled, a combination of digital and analog control can be implemented to stabilize the operating temperature of the AWG.

Example 4

This embodiment provides a storage medium. Optionally, in the embodiment, the foregoing storage medium may be configured to store program code for performing the following steps:

In S1, detecting a die temperature of a laser in the arrayed waveguide grating AWG;

In S2, calculating a temperature difference between the die temperature and the set temperature;

In S3, the die temperature of the AWG is adjusted according to the temperature difference.

Optionally, in this embodiment, the foregoing storage medium may include, but not limited to, a USB flash drive, a Read-Only Memory (ROM), a Random Access Memory (RAM), a mobile hard disk, and a magnetic memory. A variety of media that can store program code, such as a disc or a disc.

Optionally, in this embodiment, the processor performs, according to the stored program code in the storage medium, detecting a die temperature of the laser in the arrayed waveguide grating AWG;

Optionally, in this embodiment, the processor performs a calculation of a temperature difference between the die temperature and the set temperature according to the stored program code in the storage medium;

Optionally, in the embodiment, the processor performs to adjust the die temperature of the AWG according to the temperature difference according to the stored program code in the storage medium.

FIG. 11 is a schematic diagram of a hardware structure of an optical module device according to the embodiment. The optical module device may include one or more processes in addition to the components of the optical module provided in the foregoing embodiment. The processor 510, the memory 520, the input device 530, and the output device 540 are exemplified by a processor 510 in FIG.

The processor 510, the memory 520, the input device 530, and the output device 540 in the optical module device may be connected by a bus or other manner, and the connection through the bus is taken as an example in FIG.

The input device 530 can receive input numeric or character information, and the output device 540 can include a display device such as a display screen.

The memory 520 is a computer readable storage medium that can be used to store software programs, computer executable programs, and modules. The processor 510 executes various functional applications and data processing by executing software programs, instructions, and modules stored in the memory 520 to implement any of the above embodiments.

The memory 520 may include a storage program area and an storage data area, wherein the storage program area may store an operating system, an application required for at least one function; the storage data area may store data created according to usage of the optical module device, and the like. In addition, the memory may include volatile memory such as random access memory (RAM), and may also include non-volatile memory such as at least one magnetic disk storage device, flash memory device, or other non-transitory solid state storage device.

Memory 520 can be a non-transitory computer storage medium or a transitory computer storage medium. The non-transitory computer storage medium, such as at least one magnetic disk storage device, flash memory device, or other non-volatile solid state storage device. In some embodiments, memory 520 can optionally include memory remotely located relative to processor 510, which can be connected to the optical module device over a network. Examples of the above networks may include the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

Input device 530 can be configured to receive input digital or character information and to generate key signal inputs related to user settings and function control of the optical module device. The output device 540 can include a display device such as a display screen.

A person skilled in the art can understand that all or part of the process of implementing the above embodiment method can be completed by executing related hardware by a computer program, and the program can be stored in a non-transitory computer readable storage medium. The program, when executed, may include the flow of an embodiment of the method as described above, wherein the non-transitory computer readable storage medium may be a magnetic disk, an optical disk, a read only memory (ROM), or a random access memory (RAM). Wait.

Industrial applicability

A heater-based temperature control method and device, and an optical module, can change the locking time more flexibly, and solve the problem that the heater current is instantaneously enlarged when adjusting the die temperature of the AWG in the related art, and is flexible and convenient. The effect of using.

Claims (13)

1. A heater based temperature control method comprising:

   Detecting a die temperature of a laser in an arrayed waveguide grating AWG;

   Calculating a temperature difference between the die temperature and a set temperature;

   The die temperature of the AWG is adjusted based on the temperature difference.
2. The method of claim 1 wherein detecting the die temperature of the laser in the AWG comprises:

   Obtaining a voltage value of the thermistor in the AWG;

   Converting the voltage value to a corresponding temperature value according to a correspondence between a voltage value and a temperature value;

   It is determined that the temperature value obtained by the conversion is the current die temperature.
3. The method of claim 1 wherein adjusting the die temperature of the AWG based on the temperature difference comprises:

   Generating a first voltage signal for controlling a voltage controlled current source in the AWG based on the temperature difference;

   The die temperature is adjusted by heating control the die of the laser in accordance with the first voltage signal.
4. The method of claim 1 or 3, wherein adjusting the die temperature of the AWG based on the temperature difference comprises:

   Proportional integration of the temperature difference to obtain an integration result;

   The die temperature is adjusted based on the integration result.
5. The method of claim 4 wherein adjusting the die temperature based on the integration result comprises:

   Generating a first voltage signal for controlling a voltage controlled current source in the AWG according to the integration result Number; and

   The die temperature is adjusted by heating control the die of the laser in accordance with the first voltage signal.
6. The method of claim 4, wherein the controlling the heating of the die of the laser according to the first voltage signal comprises: controlling the resistance of the thermistor in the AWG according to the first voltage signal The magnitude of the value is used to heat control the die of the laser.
7. An optical module comprising: a light receiving device and a field programmable gate array FPGA control unit, wherein the light receiving device comprises an arrayed waveguide grating AWG, wherein

   The light module further includes a heater control device configured to control a die temperature of the AWG by the FPGA control unit.
8. The optical module according to claim 7, wherein the heater control device further comprises:

   Detecting a device coupled to the thermistor in the AWG, configured to detect a die temperature of a laser in the AWG;

   a calculation circuit integrated in the FPGA control unit, coupled to the detection device, configured to calculate a temperature difference between the die temperature and a set temperature;

   An adjustment circuit coupled to the calculation circuit is configured to adjust a die temperature of the AWG based on the temperature difference.
9. The optical module of claim 8, wherein the detecting device further comprises:

   a detection circuit configured to detect an analog voltage signal of the thermistor in the AWG;

   An analog to digital converter ADC configured to convert the analog voltage signal to a digital voltage signal;

   The processing unit is configured to convert the digital voltage signal into a corresponding temperature value according to a correspondence between the voltage value and the temperature value.
10. The optical module of claim 8, wherein the calculation circuit further comprises:

    a calculation module configured to calculate a temperature difference between the die temperature and the set temperature;

    The proportional integration module is configured to perform proportional integration on the temperature difference to obtain an integration result.
11. The optical module of claim 10, wherein the adjustment circuit further comprises:

    a digital to analog converter coupled to the proportional integral module, configured to convert the integrated result to a corresponding analog signal;

    And an adjusting unit configured to control a magnitude of a resistance of the thermistor in the AWG according to the analog signal.
12. A heater based temperature control device comprising:

    a detection module configured to detect a die temperature of a laser in the arrayed waveguide grating AWG;

    a calculation module configured to calculate a temperature difference between the die temperature and the set temperature;

    The adjustment module is configured to adjust a die temperature of the AWG according to the temperature difference.
13. A computer readable storage medium storing computer executable instructions for performing the method of any of claims 1-6.

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