WO2017111259A1

WO2017111259A1 - Display apparatus and manufacturing method therefor

Info

Publication number: WO2017111259A1
Application number: PCT/KR2016/010443
Authority: WO
Inventors: 이동진; 주재현
Original assignee: 주식회사 나노브릭
Priority date: 2015-12-22
Filing date: 2016-09-20
Publication date: 2017-06-29

Abstract

Disclosed is a method for manufacturing a display apparatus including a display layer and a substrate having a common electrode. The method comprises: a step of forming a plurality of individual electrodes and a connecting electrode on a substrate; a step of removing at least a part of any one of the substrate or the display layer to form a connecting area; a step of bonding the substrate and the display layer; a step of removing at least a part of any one of the substrate or the display layer to expose the connecting electrode and the common electrode to the outside; and a step of charging a conductive material into the connecting area to electrically connect the connecting electrode and the common electrode.

Description

Display device and manufacturing method thereof

The present invention relates to a display device and a method for manufacturing the same, and more particularly, to a reflective display device and a method for manufacturing the same through which the screen can be viewed through illumination provided from an external environment.

When the common electrode of the display layer is adhered to the connecting electrode of the (lower) substrate with a conductive material to form a display device, conventionally, after the display layer is physically removed, a liquid conductive material having a high viscosity is applied to the removed region. Or by applying a conductive adhesive. However, in the conventional method using a liquid conductive material, it is difficult to accurately control the amount of the liquid conductive material, which causes the patterned individual electrode adjacent to the connection electrode of the adjacent display layer or the (lower) substrate. (E.g. pixel electrodes). This caused a problem that the display layer of the region was damaged or the individual electrode (s) and the connection electrode of the (lower) substrate were shorted. In the case of performing the adhesion using the conductive adhesive, such a risk is small, but a relatively wide contact area is required and the cost of the material is high, and thus, there is a problem in that the manufacturing cost is increased and the display panel is relatively limited in design.

SUMMARY OF THE INVENTION An object of the present invention is to provide a manufacturing method for precisely and stably connecting a common electrode to a separately patterned independent connecting electrode of a (lower) substrate, and a display device manufactured by the manufacturing method. In other words, the present invention provides a display apparatus and a method of manufacturing the same, which can prevent the aforementioned problems (propagation of the conductive material to the display layer and adjacent pixel electrodes) while using a liquid conductive material.

One object of the present invention is to provide a method of manufacturing an electrophoretic display device including a method of forming an opening for exposing a common electrode at a low cost without contamination on the upper substrate.

According to an exemplary embodiment of the inventive concept, a method of manufacturing a display device including a display layer and a substrate having a common electrode may include forming a plurality of individual electrodes and a connection electrode on the substrate; Removing at least a portion of either the substrate or the display layer to form a connection region; Bonding the substrate and the display layer; Removing at least a portion of either the substrate or the display layer to expose the connection electrode and the common electrode corresponding to the connection area to the outside; And charging the conductive material into the connection region to electrically connect the connection electrode and the common electrode.

In one example, the conductive material may be a liquid conductive material.

In some embodiments, the connection region is formed in the substrate, and exposing the connection electrode and the common electrode to the outside may include removing a portion of the display layer.

In alternative embodiments, the display layer further includes an adhesive layer and a display portion between the adhesive layer and the common electrode, wherein the common electrode may be exposed by partially removing the adhesive layer and the display portion through the connection region. . In other embodiments, removal of the display layer may be performed through suction of the adhesive layer and the display unit.

In alternative embodiments, the method may further comprise forming a protective layer on the substrate, at least encapsulating the conductive material.

In alternative embodiments, the connection electrode may be formed by embedding into the substrate. In other embodiments, the substrate may include a first surface on which the individual electrodes are formed and a second surface opposite to the first surface, and the connection electrode may be formed on the second surface of the substrate. In this case, the display device may further include a conductive layer formed on the connection electrode.

In some embodiments, the connection region is formed in the display layer, and exposing the connection electrode and the common electrode to the outside may further include removing a portion of the display layer.

In alternative embodiments, the display layer further includes an adhesive layer and a display portion between the adhesive layer and the common electrode, and the connection region may be formed by partially removing the adhesive layer and the display portion.

In alternative embodiments, removal of the portion of the display layer may be performed by forming through holes in the common electrode of the display layer, wherein the width of the connection region may be greater than the width of the through holes.

In alternative embodiments, the method may further include forming a protective layer at least encapsulating the conductive material on the display layer.

In alternative embodiments, the connection electrode may be formed embedded into the substrate, and the liquid conductive material may contact the substrate and the connection electrode. In other embodiments, the connection electrode may include a plurality of partial electrodes, and a plurality of steps may be formed between the plurality of partial electrodes and the substrate.

In some embodiments, the connection region is formed in the display layer, and exposing the connection electrode and the common electrode to the outside may include removing a portion of the substrate.

According to another aspect of the inventive concept, a display apparatus may include: a substrate including a connection electrode and a plurality of individual electrodes; An adhesive layer on the substrate; A display unit on the adhesive layer, the display unit including a micro container having at least one pigment particle and a dielectric fluid; A common electrode on the display unit; And a conductor connecting the connection electrode and the common electrode, wherein the conductor may pass through at least one of the connection electrode and the common electrode.

In some embodiments, the conductor may include a first portion penetrating at least one of the connection electrode and the common electrode; And a second portion penetrating the display unit, wherein the first portion and the second portion may have different sidewall profiles.

In other embodiments, a portion of the adhesive layer adjacent to the substrate may protrude toward the central axis of the conductor.

According to another exemplary embodiment of the inventive concept, a method of manufacturing a display device including a display layer and a substrate having a common electrode may include forming a plurality of individual electrodes and a connection electrode on the substrate; Removing at least a portion of the substrate to form a connection region; Bonding the substrate and the display layer; Removing at least a portion of the display layer to expose the connection electrode and the common electrode to the outside; And charging the conductive material into the connection region to electrically connect the connection electrode and the common electrode.

In some embodiments, the conductive material includes a first portion that fills the connection region of the substrate and a second portion that fills the removed region of the display layer, wherein the first portion and the second portion each other. It can have a different sidewall profile.

According to still another exemplary embodiment of the inventive concept, a method of manufacturing a display apparatus including a display layer and a substrate having a common electrode may include forming a plurality of individual electrodes and a connection electrode on the substrate; Removing at least a portion of the display layer to form a connection area; Bonding the substrate and the display layer; Further removing at least a portion of the display layer to expose the connection electrode and the common electrode to the outside; And charging the conductive material into the connection region to electrically connect the connection electrode and the common electrode.

In some embodiments, the display layer further includes an adhesive layer and a display portion between the adhesive layer and the common electrode, and by bonding the substrate and the display layer, a portion of the adhesive layer facing the substrate is connected to the display layer. It may protrude toward the central axis of the region.

An electrophoretic display device according to an aspect of the present invention includes a first base substrate, a connection electrode arranged on the first base substrate, a plurality of pixel electrodes, a second base substrate, a common electrode on the base substrate, and the pixel electrode. And a display layer between the common electrode and the common electrode, a contact plug disposed between the connection electrode and the common electrode through the display layer, and a peeling pattern between the contact plug and the common electrode.

The adhesion between the display layer and the peeling pattern may be weaker than the adhesion between the display layer and the common electrode.

The release pattern may be conductive to electrically connect the contact plug to the common electrode.

The electrophoretic display device includes a plurality of connection pads disposed on the first base substrate, and wirings disposed on the first base substrate and connecting the plurality of connection pads to the connection electrode and the pixel electrodes, respectively. It may further include them.

Reference voltages may be applied to the connection electrodes through the connection pads, and voltages independent of each other may be applied to the pixel electrodes.

The electrophoretic display device may further include an adhesive layer disposed between the display layer and the pixel electrodes to bond the display layer on the pixel electrodes.

The display layer may include a dispersion solvent and first particles charged with a first polarity to move in a direction of an electric field dispersed and applied in the dispersion solvent.

The display layer may include microcapsules each including the dispersion solvent and the first particles in the form of a capsule and displaying different colors according to at least one of the direction and the intensity of the applied electric field.

According to the method of manufacturing an electrophoretic display device according to an aspect of the present invention, a connection electrode and a plurality of pixel electrodes are formed on a first base substrate. The common electrode is formed on the second base substrate. A peeling pattern is formed at a position corresponding to the connection electrode on the common electrode. A display layer and an adhesive layer are formed on a portion of the common electrode not covered by the peeling pattern. A contact plug is formed on the release pattern. The pixel electrodes are bonded to the adhesive layer so that the connection electrode and the contact plug are electrically connected to each other.

In the forming of the display layer and the adhesive layer, the display layer may be formed only on a portion of the common electrode not covered by the peeling pattern due to the surface repulsive force between the peeling pattern and the display layer. . The adhesive layer may be formed on the display layer to expose the peeling pattern.

In the step of forming the adhesive layer, a release film having the adhesive layer attached on one surface may be attached on the display layer so that the display layer and the adhesive layer contact. The release film may be peeled off. A portion of the adhesive layer that is not in contact with the display layer due to the empty space on the peeling pattern may be removed together with the release film when the release film is peeled off.

The peeling pattern may be conductive to electrically connect the contact plug and the common electrode to each other.

1 to 4 are cross-sectional views schematically illustrating a method of manufacturing a display device according to embodiments of the inventive concept.

5 is a cross-sectional view schematically illustrating a display device according to example embodiments of the inventive concept.

6 and 7 are cross-sectional views schematically illustrating a method of manufacturing a display device according to embodiments of the inventive concept.

8 and 9 are cross-sectional views schematically illustrating display apparatuses according to exemplary embodiments of the inventive concept.

10 to 14 are cross-sectional views schematically illustrating a method of manufacturing a display device according to embodiments of the inventive concept.

15 is a cross-sectional view schematically illustrating a display device according to example embodiments of the inventive concept.

16 to 18 are cross-sectional views schematically illustrating a method of manufacturing a display device according to embodiments of the inventive concept.

19 and 20 are cross-sectional views showing in more detail the deformation that occurs in the adhesive layer when the display layer and the substrate in contact with the connection region is formed.

21 and 22 are cross-sectional views schematically illustrating a display device according to example embodiments of the inventive concept.

23 shows structures of the connecting electrode for improving the adhesion.

24 to 28 are cross-sectional views schematically illustrating a method of manufacturing a display device according to embodiments of the inventive concept.

29 to 35 are cross-sectional views illustrating a method of manufacturing a display device (for example, an electrophoretic display device) according to the inventive concept.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art, and the following embodiments may be modified in many different forms, the scope of the present invention It is not limited to the following embodiments. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an" and "the" may include the plural forms as well, unless the context clearly indicates otherwise. Also, as used herein, "comprise" and / or "comprising" specifies the presence of the mentioned shapes, numbers, steps, actions, members, elements and / or groups of these. It is not intended to exclude the presence or the addition of one or more other shapes, numbers, acts, members, elements and / or groups. As used herein, the term "and / or" includes any and all combinations of one or more of the listed items.

Although the terms first, second, etc. are used herein to describe various members, regions, and / or portions, it is obvious that these members, components, regions, layers, and / or portions should not be limited by these terms. Do. These terms are not meant to be in any particular order, up, down, or right, and are only used to distinguish one member, region, or region from another member, region, or region. Accordingly, the first member, region, or region described below may refer to the second member, region, or region without departing from the teachings of the present invention.

Embodiments of the present invention will now be described with reference to the drawings, which schematically illustrate ideal embodiments of the present invention. In the drawings, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, embodiments of the present invention should not be construed as limited to the specific shapes of the regions shown herein, but should include, for example, changes in shape resulting from manufacturing.

First, referring to FIG. 1, a display layer 100 and a substrate 200 are provided. The display layer 100 may include an adhesive layer 110, a display unit 120, a common electrode 130, and a transparent plate 140. At least one individual electrode 210 and a connection electrode 220 may be formed on the substrate 200. The individual electrode 210 may be formed on the substrate 200, and the connection electrode 220 may be formed by being embedded into the substrate 200. In an alternative embodiment, the connection electrode 220 may be formed adjacent to the individual electrode 210 on the substrate 200.

Referring to FIG. 2, the forming of the connection region C may be performed by removing at least some regions of the substrate 200. As shown in FIG. 2, the connection region C may be formed in the form of a through hole penetrating the substrate 200 or may be formed in the form of a groove that does not penetrate the entire substrate 200. As the connection region C is formed, the connection electrode 220 inserted into the substrate 200 by the through hole or the groove may be exposed.

Referring to FIG. 3, bonding the substrate 200 and the display layer to each other is performed, and then removing at least a portion of the display layer 100 to expose the common electrode 130 to the outside. More specifically, the common electrode 130 may be exposed by partially removing the adhesive layer 110 and the display unit 120.

Removing a portion of the display layer 100 may be performed using the connection area C. For example, a portion of the display layer 100 may be removed using laser cutting, and the connection area C may provide alignment during the laser cutting.

In another embodiment, removal of a portion of the display layer 100 may be performed using suction. For example, by adhering the suction device to the connection area C, a portion of the adhesive layer 110 and the display unit 120 having fluidity may be sucked into the suction device. As a result, the common electrode 130 may be exposed by removing the adhesive layer 110 and the display unit 120.

Referring to FIG. 4, the forming of the structure V for electrically connecting the connection electrode 220 and the common electrode 130 by filling a conductive material into the connection region C is performed. The conductive material may be a liquid conductive material. For example, the liquid conductive material may include at least one of silver paste, carbon paste, and liquid OCA (including conductive balls).

Optionally, the liquid conductive material may be cured in a later process, in which case the structure V will be a solid conductor. In other words, the liquid conductive material refers to a liquid material applied during the display device manufacturing process, and the conductor may be a liquid conductive material that is not cured, or a structure in which the conductive material in a liquid state is cured.

As such, a space (that is, the connection region C) for connecting the connection electrode 220 and the common electrode 130 is formed on the substrate 200, and then the substrate 200 is bonded to the display layer 100. Since the display layer 100 is removed using the region C, the alignment process can be simplified. In addition, since the display layer 100 is removed and the liquid conductive material is filled after the substrate 200 and the display layer 100 are adhered to each other, the liquid conductive material spreads to adjacent electrodes, causing a short circuit between the electrodes. Can be prevented.

In an alternative embodiment, when the substrate 200 is formed of a plastic or film type substrate 200, the display layer 100 and the substrate 200 may be adhered to each other without forming the connection region C. Thereafter, a hole is formed in a region where the buried connection electrode 220 is formed to expose the common electrode 130, and a liquid conductive material electrically connecting the connection electrode 220 and the common electrode 130 through the hole is formed. It may be filled.

5 is a cross-sectional view schematically illustrating a display device according to example embodiments of the inventive concept. The display device according to these embodiments may be a modification of the display device according to the above-described embodiments. Duplicate descriptions between the embodiments will be omitted.

Referring to FIG. 5, the liquid conductive material may be filled to partially fill the connection region C, and a protective layer P encapsulating the liquid conductive material may be formed in the remaining region of the connection region C. Can be formed. The protective layer P serves to prevent the conductive material from being separated and to block the inflow of the pollutant. Although FIG. 5 illustrates that the protective layer P is formed only in the connection region C, the present invention is not limited thereto, and the protective layer P may be formed to cover the entire surface of the substrate 200. Since the protective layer P is formed to cover the entire surface of the substrate 200, moisture permeation may be prevented and durability may be improved as a whole of the substrate 200.

6 and 7 are cross-sectional views schematically illustrating a method of manufacturing a display device according to embodiments of the inventive concept. The display apparatus according to these embodiments may be a modification of the manufacturing method of the display apparatus according to the above-described embodiments. Duplicate descriptions between the embodiments will be omitted.

During the preparing of the substrate 200, individual electrodes 210 may be formed on a first surface of the substrate 200, while a connection electrode 220 may be formed on a second surface opposite to the first surface. have. After that, a connection region is formed on the substrate 200, and the substrate 200 is bonded to the display layer 100, and then a portion of the adhesive layer 110 and the display unit 120 are removed through the connection region to remove the common electrode 130. This exposed appearance is shown in FIG. 6.

Referring to FIG. 7, the liquid conductive material is filled through the connection region, such that the common electrode 130 and the connection electrode 220 may be electrically connected to each other. In this case, the conductive layer R may be formed on the top surface of the connection electrode 220. In this case, the conductive layer R may contact the large area of the connection electrode 220 over the top surface of the connection electrode 220, thereby reducing the sheet resistance between the structure V and the connection electrode 220.

8 and 9 are cross-sectional views schematically illustrating display apparatuses according to exemplary embodiments of the inventive concept. The display device according to these embodiments may be a modification of the display device according to the above-described embodiments. Duplicate descriptions between the embodiments will be omitted.

8 and 9, the display apparatus includes a substrate 200 including a connection electrode 220 and a plurality of individual electrodes 210, an adhesive layer 110 on the substrate 200, and a display unit on the adhesive layer 110. 120, a common electrode 130 on the display unit 120, a transparent plate 140 on the common electrode 130, and a conductor V connecting the connection electrode 220 and the common electrode 130. It may include.

The display unit 120 may include a microcapsule M having at least one pigment particle B and W and a dielectric fluid. The pigment particles may be charged with (+) polarity or (-) polarity and may have various colors. The dielectric fluid may include suitable dielectric solvents such as hydrocarbons, fatty oils, paraffin oil, silicone fluids, aromatic hydrocarbons, halogenated solvents, and perfluorinated solvents, and may optionally be formed from air. Although the form of the microcapsules M is shown in FIGS. 8 and 9, it may be implemented as a microcup, microchannels, or a microcontainer having any shape.

The conductor V may be formed to penetrate the connection electrode 220. Alternatively, the conductor may be formed to penetrate the common electrode 130 (see FIG. 15). Also, optionally, the conductor V may be formed to penetrate the connection electrode 220 and the common electrode 130. That is, the conductor V may be formed to penetrate at least one of the connection electrode 220 and the common electrode 130.

As described in the above embodiments, the connection region C of the substrate 200 is formed by a first process such as laser cutting, and the common electrode 130 is bonded to the substrate 200 after the display is bonded. Exposed by a second process such as separate laser cutting or suction. Since the first process and the second process are performed at different times, the cross section of the connection region C and the cross section of the region where the display layer 100 is removed may be different. As a result, the conductive material filling the region from which the connection region C and the display layer 100 are removed may have partially different sidewall profiles.

More specifically, the first portion of the conductive material filling the connection region C of the substrate 200 and the second portion filling the removed region of the display layer 100 may have different sidewall profiles. .

In one embodiment, for example, as shown in FIG. 8, when the connection region C of the substrate 200 is formed by a laser cutting process, and the display layer 100 is removed by a suction process, the structure ( The first portion R1 of V) may have a straight sidewall by the connection region C formed by the laser cutting process, and the second portion R2 of the structure V may be the second laser cutting process. It can have a curved sidewall by.

In another embodiment, as shown, for example, in FIG. 9, the connection region C of the substrate 200 is formed by the first laser cutting process and the display layer 100 is removed by the second laser cutting process. In this case, the first portion R1 of the structure V may have sidewalls of the first slope by the first laser cutting process, and the second portion R2 of the structure V may be the second laser. It may have a sidewall of the second slope by the cutting process.

Although the first portion R1 is formed to penetrate the connection electrode 220 in FIGS. 8 and 9, and the second portion R2 is formed to penetrate the display portion 120 of the display layer, the present invention is limited thereto. It doesn't work. For example, as illustrated in FIG. 15, the first portion R1 of the structure V may pass through the common electrode 130, and the second portion R2 may pass through the display portion 120.

10 to 14 are cross-sectional views schematically illustrating a method of manufacturing a display device according to embodiments of the inventive concept. The display device according to this embodiment may be a modification of the manufacturing method of the display device according to the above embodiments. Duplicate descriptions between the embodiments will be omitted.

First, referring to FIG. 10, a display layer 100 and a substrate (not shown) are provided. The connection electrode formed on the substrate may be formed on the same surface on which the individual electrodes are formed. Thereafter, as shown in FIG. 11, before the display layer 100 and the substrate are in contact with each other, a connection area C is formed in the display layer 100. In the above-described embodiments, the connection region C may be formed in the substrate 200, whereas the connection region C may be formed in the display layer 100, as in the embodiment shown in FIGS. 10 to 14. The connection area C may be formed by partially removing the adhesive layer 110 and the display unit 120 of the display layer 100. In an alternative embodiment, the connection region C may be formed by partially removing the adhesive layer 110, the display unit 120, and the common electrode 130.

Referring to FIG. 12, the display layer 100 and the substrate 200 are adhered to each other, and as shown in FIG. 13, the connection electrode 220 and the common electrode 130 are further removed by further removing a portion of the display layer 100. This is exposed to the outside. More specifically, the through hole T penetrating the transparent plate 140 and the common electrode 130 of the display layer 100 may be formed. The width of the through hole T may be smaller than the width of the connection area C, so that alignment between the through hole T and the connection area C may be more easily performed during the through hole T forming process. Can be.

Referring to FIG. 14, a step of forming a structure V for electrically connecting the connection electrode 220 and the common electrode 130 by filling a conductive material into the through hole T and the connection region C is performed. . As described above, the conductive material may be a liquid conductive material, and may include, for example, at least one of a silver paste, a carbon paste, and a liquid OCA (including conductive balls).

As such, after forming a space (that is, a connection region C) for connecting the connection electrode 220 and the common electrode 130 to the display layer 100 and adhering the substrate 200 and the display layer 100 to each other, Since the display layer 100 is removed (that is, the through hole T is formed) using the connection area C, the alignment process may be simplified. In addition, since the display layer 100 is removed and the liquid conductive material is filled after the substrate 200 and the display layer 100 are adhered to each other, the liquid conductive material spreads to adjacent electrodes, causing a short circuit between the electrodes. Can be prevented.

In an alternative embodiment, the display layer 100 and the substrate 200 may be adhered to each other without forming the connection area C in the display layer 100. Thereafter, a hole may be formed in the display layer 100 to expose the common electrode 130, and a liquid conductive material may be filled to electrically connect the connection electrode 220 and the common electrode 130 through the hole.

15 is a cross-sectional view schematically illustrating a display device according to example embodiments of the inventive concept. The display device according to these embodiments may be a modification of the display device according to the above-described embodiments. Duplicate descriptions between the embodiments will be omitted.

Referring to FIG. 15, the protective layer P may be formed to cover the top surface of the transparent plate 140 of the display layer 100. Since the protective layer P is formed to cover the entire surface of the transparent plate 140, separation of the conductive material may be prevented, moisture permeation may be prevented in the transparent plate 140, and durability may be improved. Although the protective layer P is formed on the entire transparent plate 140 in FIG. 15, the protective layer P may be formed only in the connection region.

16 to 18 are cross-sectional views schematically illustrating a method of manufacturing a display device according to embodiments of the inventive concept. The display device according to this embodiment may be a modification of the manufacturing method of the display device according to the above embodiments. Duplicate descriptions between the embodiments will be omitted.

First, referring to FIG. 16, before the display layer 100 and the substrate 200 contact each other, a connection area C is formed in the display layer 100. Thereafter, the display layer 100 and the substrate 200 contact each other, and as shown in FIG. 17, a portion of the substrate 200 is removed to expose the connection electrode 220 and the common electrode 130 to the outside. More specifically, a through hole T penetrating the substrate 200 and the connection electrode 220 formed on the substrate 200 (the connection electrode 220 may be embedded in the substrate 200) may be formed. . The width of the through hole T may be smaller than the width of the connection area C, and alignment of the through hole T and the connection area C may be performed more easily.

Referring to FIG. 18, the forming of the structure V for electrically connecting the connection electrode 220 and the common electrode 130 is performed by filling a conductive material into the through hole T and the connection region C. . As described above, the conductive material may be a liquid conductive material, and may include, for example, at least one of a silver paste, a carbon paste, and a liquid OCA (including conductive balls).

19 and 20 illustrate a bonding layer formed in a case where a connection region is formed in the display layer 100 and then the display layer 100 and the substrate 200 contact each other (see FIGS. 12 and 16). It is a cross section which shows the deformation | transformation which arises in 110 more specifically.

Referring to FIG. 19, the protrusion E may be formed by bonding the substrate 200 and the display layer 100 to each other. The protrusion E may be formed by applying pressure to the adhesive layer 110 when the substrate 200 and the display layer 100 are bonded after the connection area C is formed in the display layer 100. . Due to the pressure, the protrusion E faces the substrate 200 in the adhesive layer 110 and the portion adjacent to the substrate 200 (for example, the portion in contact with the connection electrode 220) is connected to the connection region C. It may be formed to protrude toward the central axis of the. Therefore, when the conductor fills the connection region C in a later process, the conductor will be formed to have a shape corresponding to the protrusion E (ie, the portion of the adhesive layer 110 adjacent to the substrate 200 is Will protrude toward the central axis of the conductor).

Referring to FIG. 20, in other embodiments, the connection region C formed in the display layer 100 may expose not only the connection electrode 220 but also the top surface of the substrate 200 adjacent to the connection electrode 220. Can be formed. In this case, a protrusion may not be formed at a portion of the adhesive layer 110 that contacts the substrate 200, whereas a protrusion E may be formed at a portion of the adhesive layer 110 that contacts the connection electrode 220. Therefore, when the conductor fills the connection region C in a later process, the conductor will be formed to have a shape corresponding to the protrusion E. FIG.

21 and 22 are cross-sectional views schematically illustrating a display device according to example embodiments of the inventive concept. The display device according to these embodiments may be a modification of the display device according to the above-described embodiments. Duplicate descriptions between the embodiments will be omitted.

Referring to FIG. 21, the substrate 200 of the display device may include a connection electrode 220, and the connection electrode 220 may be inserted into the substrate 200. A portion of the substrate 200 may be recessed to expose the top surface of the connection electrode 220. Optionally, the connection electrode 220 may be formed to extend to overlap the individual electrodes 210.

The substrate 200 in which the connection electrode 220 is embedded in the substrate 200 and the top surface of the connection electrode 220 is exposed may be applied to the embodiments of FIGS. 10 to 14. In this case, a display device having a structure as shown in FIG. 22 may be formed. In the case of the display device, since the liquid conductive material contacts the stepped substrate 200 and the connection electrode 220, adhesion between the liquid conductive material and the substrate 200 and the connection electrode 220 may be improved. Can be.

23 illustrates structures of the connection electrode 220 according to other embodiments for improving such adhesion. In the above structures, the connection electrode 220 may include a plurality of partial electrodes. The plurality of partial electrodes may be formed on the substrate 200 or buried in the substrate 200. A plurality of steps may be formed between the plurality of partial electrodes and the substrate 200. The adhesion between the conductive material, the substrate 200 and the connection electrode 220 may be improved by the plurality of steps. In alternative embodiments, the plurality of partial electrodes may be arranged in a pattern that prevents the liquid conductive material from propagating to adjacent individual electrodes 210.

24 to 28 are cross-sectional views schematically illustrating a method of manufacturing a display device according to embodiments of the inventive concept. The display device according to this embodiment may be a modification of the manufacturing method of the display device according to the above embodiments. Duplicate descriptions between the embodiments will be omitted.

Referring to FIG. 24, a display layer 100 is provided, and as shown in FIG. 25, a connection area C is formed in the display layer 100. Thereafter, as shown in FIG. 26, the conductive material is filled into the connection region C. The display layer 100 filled with the conductive material may be in contact with the substrate 200 as shown in FIG. 27.

The substrate 200 used herein may be the substrate shown in FIG. 21, that is, a substrate in which a connection electrode 220 is inserted into the substrate and a hole in which the connection electrode 220 is exposed is in contact with the display layer 100. Can be. Although not shown in the drawings, the substrate 200 may be a substrate shown in FIG. 23.

29 to 35 are cross-sectional views illustrating a method of manufacturing an electrophoretic display device according to the spirit of the present invention.

Referring to FIG. 29, an electrode layer N120 including a connection electrode N122 and a plurality of pixel electrodes N124 is formed on the first base substrate N110.

The connection electrode N122 and the plurality of pixel electrodes N124 may be formed on a first base substrate N110 by manufacturing a printed circuit board, for example, a printing method, and the connection electrode N122 and the plurality of pixel electrodes N124. The first base substrate N110 on which the pixel electrodes N124 are formed may be referred to as a printed circuit board. The connection electrode N122 and the pixel electrodes N124 are spaced apart from each other on the first base substrate N110. As illustrated in FIG. 1, the connection electrode N122 may be located outside the display area DR, and the pixel electrodes N124 may be spaced apart from each other in the display area DR.

The pad part N101 including the connection pads 102 of FIG. 1 may be further formed on the first base substrate N110, and the connection pads N102 may include the connection electrode N122 and the pixel electrodes N124. ) May be connected via wires 103 (see FIG. 1). The wirings N103 may be positioned on a different layer from the connection electrode N122 and the pixel electrodes N124. For example, the connection electrode N122 and the pixel electrodes N124 are disposed on the first surface of the first base substrate N110, and the wirings N103 are opposite to the first surface of the first base substrate N110. The surface may be disposed on a second surface that is a surface, or may be disposed inside the first base substrate N110. The connection pads N102 may be disposed on the first surface of the first base substrate N110 or may be disposed on the second surface.

After the through via is formed in the first base substrate N110, the conductive material such as metal is plated, and then a portion of the plating layer is removed to connect the connection electrode N122 and the pixel to the first base substrate N110. Electrodes N124, connection pads N102, and wires N103 may be formed. The first base substrate N110 may be a flexible or rigid substrate made of various materials such as plastic and metal. The first base substrate N110 may be a flexible synthetic resin substrate.

Referring to FIG. 30, a common electrode N140 and a peeling pattern N170 may be formed on the second base substrate N110. The peeling pattern N170 may be disposed on the common electrode N140 at a position corresponding to the connection electrode N122.

The second base substrate N130 is a light transparent material having high transmittance and may be a film formed of a material having a high transmittance of 80% or more.

The common electrode N140 may be formed of a transparent conductive material on the second base substrate N130. The common electrode N140 may be formed on the second base substrate N130 by sputtering. According to another example, the common electrode N140 may be formed on the second base substrate N130 by coating or plating.

The peeling pattern N170 may be formed at a position corresponding to the connection electrode N122 on the common electrode N140. The peeling pattern N170 may be formed at a position corresponding to the connection electrode N122 on the common electrode N140. The material of the release pattern N170 may have a surface repulsion force with the material of the display layer N150. That is, the adhesion between the peeling pattern N170 and the display layer N150 may be weaker than the adhesion between the common electrode N140 and the display layer N150. Accordingly, the display layer N150 may be formed only on the common electrode N140 not covered with the peeling pattern N170, and may not be formed on the peeling pattern N170. In addition, the adhesion layer N160 may also be formed only on the display layer N150, and the display layer N150 and the adhesion layer N160 may not exist on the peeling pattern N170. Therefore, it is not necessary to remove portions of the display layer N150 and the adhesive layer at positions corresponding to the connection electrode N122. The contact plug N180 may be directly formed on the exposed peeling pattern N170.

According to an example, the peeling pattern N170 may have conductivity. The peeling pattern N170 may include a transparent metal filler to have conductivity. Transparent metal fillers include inorganic salts such as lithium chloride and magnesium chloride, silicon compounds which are hydrolysis products of chlorosilane, silicon tetrachloride, metal oxide powder, indium oxide (tin), glass beads surface-treated with tin oxide (antimony), and the like. It may include. The content of the transparent metal filler in the peeling pattern N170 may be 5 [wt%] to 50 [wt%] (weight percent). According to another example, the peeling pattern N170 may have a very thin thickness so as not to have an insulating property.

According to another example, the peeling pattern N170 may have a soft property to change shape when pressure is applied. According to another example, the peeling pattern N170 may have a very thin thickness so as not to have an insulating property.

Referring to FIG. 31, the display layer N150 may be formed on the common electrode N140 on the second base substrate N110. Since the material of the peeling pattern N170 has a surface repulsion force with the material of the display layer N150, the display layer N170 is not formed on the peeling pattern N170. To this end, the adhesion between the peeling pattern N170 and the display layer N150 may be weaker than the adhesion between the common electrode N140 and the display layer N150.

The display layer N150 mixes the microcapsules including the dispersion solvent and the first particles in a binder, applies a paste in which the binder and the microcapsules are mixed on the common electrode N140, and applies the common capsule N140. The paste may be cured by applying heat to the paste or UV irradiation, and may be locally coated on the common electrode N140. The paste may not be applied on the peeling pattern N170 due to the surface repulsive force. Even if the paste is partially applied onto the peeling pattern N170, after curing, the display layer N150 existing on the peeling pattern N170 may not be adhered to the peeling pattern N170, and the peeling pattern may be removed by suction or mechanical vibration. N170) can be removed and removed.

Coating can be performed by patch die coating, slot or extrusion coating, slide or cascade coating, curtain coating, roll coating, gravure coating, dip coating, spray coating, meniscus coating, spin coating, brush coating, air knife coating, etc. have. Printing can be performed by silk screen printing, electrostatic printing, thermal printing, ink jet printing, or the like.

Referring to FIG. 32, a release film N162 having an adhesive layer N160a attached to the second base substrate N130 on which the common electrode N140 and the display layer N150 are formed. The adhesive layer N160a may be attached onto the display layer N150 by using the adhesive force of the adhesive layer N160a. The adhesion between the release film N162 and the adhesive layer N160a may be lower than the adhesion between the adhesive layer N160a and the display layer N150. To this end, the release film N162 may be subjected to a surface treatment for lowering the adhesive strength with the adhesive layer N160a.

Referring to FIG. 33, the release film N162 is peeled from the adhesive layer N160a so that only a portion of the adhesive layer N160b remains on the display layer N150. Due to the adhesive force between the release film N162 and the adhesive layer N160a, some of the adhesive layers N160c positioned on the empty space on the release pattern N170 are torn together when the release film N162 is peeled off. As shown, a portion of the adhesive layer N160c is attached to the release film N162 and removed together with the release film N162 when the release film N162 is peeled off.

The adhesive layer N160 has adhesiveness and may be cured by heat or UV. According to another example, the adhesive layer N160 may not have adhesiveness at room temperature and may have adhesiveness after heat is applied.

As a result, the opening which exposes the peeling pattern N170 is formed. The position of the opening may correspond to the position of the connection electrode N122.

Referring to FIG. 34, a contact plug N180 may be formed to contact the peel pattern N170 in an opening exposing the peel pattern N170. The contact plug N180 may be formed of a liquid conductive material having a high viscosity and may be embedded in the opening by using a syringe. The contact plug N180 may be formed of a conductive adhesive film, and the conductive adhesive film may be cut into a smaller size than the opening, and then inserted into the opening. The contact plug N180 may be a spherical or cylindrical conductor such as a solder ball, and may be pressed to be in contact with the connection electrode N122 after being inserted into the opening. The contact plug N180 may include conductive particles distributed in the synthetic resin, and may provide an electrical path due to the conductive particles in physical contact with each other.

Referring to FIG. 35, the first base substrate N110 is disposed on the second base substrate N130 such that the contact plug N180 and the connection electrode N122 contact each other. The first base substrate N110 is pressed toward the second base substrate N130 so that the connection electrode N122 is electrically connected to the contact plug N180. In this case, the pixel electrodes N124 are bonded to the adhesive layer N160. Depending on the material of the adhesive layer N160, heat may be applied to the adhesive layer N160 or UV may be irradiated. The adhesive layer N160 may also adhere to the first base substrate N110 not covered by the pixel electrodes N124.

The electrophoretic display device N100 thus formed includes a first base substrate N110, a connection electrode N122 arranged on the first base substrate N110, a plurality of pixel electrodes N124, and a second base substrate N130. ), The common electrode N140 on the base substrate N130, the display layer N150 between the pixel electrodes N124 and the common electrode N140, and the connection electrode N122 and the common electrode through the display layer N150. The contact plug N180 disposed between the N140 and the peeling pattern N170 between the contact plug N180 and the common electrode N140 is included. The connection electrode N122 and the common electrode N140 are electrically connected to each other through the contact plug N180. The electrophoretic display device N100 may further include an adhesive layer N160 for bonding the pixel electrodes N124 and the display layer N150 to each other.

In addition, the following process may be performed to manufacture the electrophoretic display device N100.

A first step of forming a plurality of pixel electrodes N124 and a connection electrode N122 on the substrate N110 (see FIG. 29).

A second step of forming a connection region by removing at least a portion of the display layer having the substrate N130, the common electrode N140, and the display layer N150 (see FIG. 31).

A third step of exposing the connection electrode N122 or the peeling pattern N170 corresponding to the connection area to the outside by removing the release film N162 and the adhesive layer N162a formed on the display layer (see FIG. 33). )

A fourth step of filling the conductive material into the connection region (see FIG. 34)

A fifth step of adhering the substrate N110 and the display layer (see FIG. 35);

The peeling pattern N170 may be exposed during the third step, and the common electrode N140 under the peeling pattern N170 may be exposed. Also, although not shown in the drawing, the pixel electrodes N124 on the substrate N110 may also be exposed to the outside for bonding with the display layer.

In a fifth step, a contact plug N180 may be formed to electrically connect the connection electrode N122 and the common electrode N140.

Embodiments described herein may be cross-referenced, and some process (es) described in one embodiment may be substituted for or interposed between process (s) of another embodiment. In addition, the order of the processes shown in the embodiment may be changed.

For example, forming the connection region by removing at least a portion of either the substrate or the display layer may include forming an opening exposing the common electrode using the peeling pattern described in the embodiments of FIGS. 29 to 35. It may include a step. More specifically, during the second step of forming a connection region by removing at least a portion of the display layer including the substrate N130, the common electrode N140, and the display layer N150, the peeling pattern N170 is used. As a result, a portion of the display layer N150 may be removed to form a connection region.

In order to clearly understand the present invention, the shape of each part of the accompanying drawings should be understood as illustrative. It should be noted that the present invention may be modified in various shapes other than the illustrated shape.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and changes are possible within the scope not departing from the technical spirit of the present invention. It will be evident to those who have knowledge of.

Claims

In the manufacturing method of a display device comprising a display layer having a common electrode and a substrate,

Forming a plurality of individual electrodes and a connecting electrode on the substrate;

Removing at least a portion of either the substrate or the display layer to form a connection region;

Bonding the substrate and the display layer;

Removing at least a portion of either the substrate or the display layer to expose the connection electrode and the common electrode corresponding to the connection area to the outside; And

Filling a conductive material into the connection region to electrically connect the connection electrode and the common electrode.
The method according to claim 1,

Wherein the conductive material is a liquid conductive material.
The method according to claim 1,

The connection region is formed on the substrate

Exposing the connection electrode and the common electrode to the outside, removing a portion of the display layer.
The method according to claim 3,

The display layer further includes an adhesive layer and a display unit between the adhesive layer and the common electrode.

And the common electrode is exposed by partially removing the adhesive layer and the display portion through the connection region.
The method according to claim 3,

The removal of the display layer is performed through suction of the adhesive layer and the display portion.
The method according to claim 3,

Forming a protective layer on the substrate, the protective layer at least encapsulating the conductive material.
The method according to claim 3,

And the connecting electrode is formed embedded into the substrate.
The method according to claim 3,

The substrate includes a first surface on which the individual electrodes are formed and a second surface opposite to the first surface,

The connecting electrode is formed on the second side of the substrate.
The method according to claim 8,

The display device further comprises a conductive layer formed on the connection electrode.
The method according to claim 1,

The connection region is formed in the display layer,

Exposing the connection electrode and the common electrode to the outside, further comprising removing a portion of the display layer.
The method according to claim 10,

The display layer further includes an adhesive layer and a display unit between the adhesive layer and the common electrode.

And the connecting region is formed by partially removing the adhesive layer and the display portion.
The method according to claim 11,

Removal of a portion of the display layer is performed by forming a through hole in the common electrode of the display layer,

And the width of the connecting area is greater than the width of the through hole.
The method according to claim 10,

Forming a protective layer on the display layer, the protective layer at least encapsulating the conductive material.
The method according to claim 10,

The connection electrode is formed embedded in the substrate,

And the conductive material is in contact with the substrate and the connecting electrode.
The method according to claim 10,

The connection electrode includes a plurality of partial electrodes,

And a plurality of steps are formed between the plurality of partial electrodes and the substrate.
The method according to claim 1,

The connection region is formed in the display layer,

Exposing the connection electrode and the common electrode to the outside comprises removing a portion of the substrate.
The method according to claim 4,

Wherein the indicator comprises a micro container having at least one pigment particle and a dielectric fluid.
A substrate comprising a connection electrode and a plurality of individual electrodes;

An adhesive layer on the substrate;

A display unit on the adhesive layer, the display unit including a micro container having at least one pigment particle and a dielectric fluid;

A common electrode on the display unit; And

A conductor connecting the connection electrode and the common electrode;

And the conductor passes through at least one of the connection electrode and the common electrode.
The method according to claim 18,

The conductor,

A first portion penetrating at least one of the connection electrode and the common electrode; And

A second portion penetrating the display unit;

And the first portion and the second portion have different sidewall profiles.
The method according to claim 18,

And a portion of the adhesive layer adjacent to the substrate protrudes toward the central axis of the conductor.