WO2017047538A1 - Electronic control device - Google Patents

Electronic control device Download PDF

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Publication number
WO2017047538A1
WO2017047538A1 PCT/JP2016/076751 JP2016076751W WO2017047538A1 WO 2017047538 A1 WO2017047538 A1 WO 2017047538A1 JP 2016076751 W JP2016076751 W JP 2016076751W WO 2017047538 A1 WO2017047538 A1 WO 2017047538A1
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WO
WIPO (PCT)
Prior art keywords
relay
control device
heat
electronic control
case
Prior art date
Application number
PCT/JP2016/076751
Other languages
French (fr)
Japanese (ja)
Inventor
紘文 渡部
斎藤 博之
藤田 治彦
Original Assignee
日立オートモティブシステムズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 日立オートモティブシステムズ株式会社 filed Critical 日立オートモティブシステムズ株式会社
Publication of WO2017047538A1 publication Critical patent/WO2017047538A1/en

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    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02GINSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02Details
    • H02G3/08Distribution boxes; Connection or junction boxes
    • H02G3/16Distribution boxes; Connection or junction boxes structurally associated with support for line-connecting terminals within the box
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating

Definitions

  • This invention relates to an electronic control device provided with an electromagnetic relay.
  • Patent Document 1 as a prior art, in a vehicle power supply device equipped with a relay, the top surface of the relay case is disposed through a heat conductive sheet in order to release heat generated inside the relay in an ON state. A configuration in contact with a vehicle chassis is disclosed.
  • the entire top surface of the relay case is subjected to a reaction force due to the elastic force of the heat conductive sheet and is pressed in the thickness direction of the heat conductive sheet. Therefore, when the relay case becomes hot due to heat generated during operation of the relay or ambient heat, stress is generated in the central portion of the top surface due to expansion of the top surface portion of the relay case, reducing the durability of the relay case. There are concerns.
  • An electronic control device includes: A relay in which an electromagnet and a contact portion opened and closed by the electromagnet are housed in a relay case; A heat-generating component that generates heat during operation; A circuit board on which the relay and the heat generating component are mounted; An exterior member that houses the circuit board; A heat conductive member having adhesiveness disposed between one surface of the relay case facing the inner surface of the exterior member and the inner surface of the exterior member; With The heat conducting member is The relay case is joined to the surface in a region excluding the central portion of the surface.
  • the central portion of the surface of the relay case that becomes the heat conducting surface is not constrained by the heat conducting member, so when the heat expands due to heat generated during operation of the relay or heat of surrounding heat generating components, Stress at the center is dispersed, and the occurrence of breakage and cracks is suppressed.
  • the disassembled perspective view which shows the electric brake booster provided with the motor control apparatus which is one Example of this invention.
  • the enlarged view of the principal part of FIG. Sectional drawing along the AA line of FIG. FIG. 6 is a cross-sectional view of the entire motor control device taken along line BB in FIG. 5. Sectional drawing of the whole motor control apparatus along CC line of FIG.
  • FIG. 16 is a cross-sectional view of the entire motor control device taken along line DD in FIG. 15.
  • FIG. 19 is a cross-sectional view of the entire motor control device taken along line EE in FIG. 18.
  • FIG. 22 is a sectional view of the entire motor control device taken along line FF in FIG. 21.
  • FIG. 25 is a sectional view of the entire motor control device taken along line GG in FIG. 24.
  • FIG. 28 is a cross-sectional view of the entire motor control device taken along line HH in FIG. 27.
  • FIG. 31 is a sectional view of the entire motor control device taken along line II in FIG. 30.
  • FIG. 1 is an exploded perspective view showing an electric brake booster 1 provided with a motor control device 3 which is an electronic control device according to the present invention
  • FIG. 2 is an exploded perspective view of the motor control device 3.
  • An electric brake booster 1 shown in FIG. 1 is attached to the engine room side of a dash panel (not shown) that partitions the automobile compartment and the engine compartment, and is illustrated according to the depression of a brake pedal provided on the compartment side.
  • a motor control device 3 that drives and controls the electric motor 2 based on the state.
  • the electric motor 2 has a motor housing 4 made of a metal material such as an aluminum alloy, for example, and a cylindrical outer surface of the motor housing 4 is positioned between the pair of pedestal portions 5 and the pair of pedestal portions 5. And a controller mounting seat portion 6 to be formed.
  • the motor control device 3 is mounted on the controller mounting seat 6 and is mounted and fixed to the motor housing 4 by screwing the device mounting screws 8 arranged at the four corners into the screw holes 7 of the base 5. Yes.
  • the controller mounting seat portion 6 having a substantially rectangular wall shape has an opening 9 inside thereof, and the electric connection between the electric motor 2 side and the motor control device 3 is made through the opening 9. .
  • FIG. 1 generally corresponds to the posture of the electric brake booster 1 disposed in the engine room when mounted on the vehicle, and the motor control device 3 is mounted on the upper surface side of the motor housing 4 when mounted on the vehicle. ing.
  • the motor control device 3 has a housing 11 corresponding to an “exterior member”.
  • the housing 11 includes a case 12 positioned on the lower side when the vehicle is mounted and a cover 15 positioned on the upper side when mounted on the vehicle.
  • the case 12 has a bottom wall 13 and a peripheral wall 14, and has a substantially rectangular shape in plan view with the upper surface opening upward.
  • the cover 15 has a substantially rectangular shape in a plan view that closes the upper surface opening of the case 12.
  • a power module 16 corresponding to a “circuit board” is housed together with a control module 17 made of another circuit board. Specifically, the power module 16 is positioned near the bottom wall 13 of the case 12, and the control module 17 is laminated and disposed above the power module 16 with a predetermined interval.
  • the cover 15 is formed by press-molding a metal plate in a substantially dish shape, and has a flange portion 21 joined to the upper end of the peripheral wall 14 of the case 12 at the periphery, and accommodates the control module 17. Therefore, it has a shape bulging from the flange portion 21 toward the opposite side of the case 12.
  • the cover 15 is fixed to the case 12 by cover mounting screws 22 arranged at four corners.
  • the case 12 is molded by a so-called die casting method using a metal material having relatively good heat conduction, such as an aluminum alloy.
  • the substantially rectangular peripheral wall 14 of the case 12 includes a first wall portion 14a and a third wall portion 14c that face each other, and a second wall portion 14b and a fourth wall portion 14d that face each other in a form orthogonal to them.
  • an opening 25 through which the external connector 24 of the power module 16 is inserted is cut out in a substantially U shape in the first wall portion 14a corresponding to one side thereof.
  • a circular breathing hole 27 to which a breathing filter 26 (see FIG. 1) is attached from the outside is formed at one end of the fourth wall portion 14d.
  • a plurality of cooling fins 28 are formed on the outer surface of the fourth wall portion 14d.
  • the case 12 and the cover 15 are sealed with a sealant applied to the seal groove 29 at the upper end of the peripheral wall 14, and the periphery of the external connector 24 of the power module 16 is similarly applied by applying the sealant. 12 and the cover 15 are sealed.
  • the bottom wall 13 of the case 12 is formed with a plurality of substantially cylindrical power module support portions 31 protruding toward the cover 15 at a plurality of locations, and screw holes for attaching the power module 16 to each top portion. 32 is formed.
  • a block-shaped projecting portion 34 projecting from the bottom wall 13 toward the cover 15 is formed into a substantially rectangular block shape. Is formed.
  • This block-shaped protrusion 34 functions as a heat sink having a large heat capacity.
  • the block-shaped projecting portion 34 is located at a substantially central portion of the case 12 and has a predetermined interval with respect to the first wall portion 14a, the second wall portion 14b, and the third wall portion 14c of the rectangular peripheral wall 14. And are formed integrally and continuously with respect to the fourth wall portion 14d.
  • a plurality of screw holes 32 for attaching the power module 16 are also formed in the vicinity of the four corners of the top surface of the block-shaped protrusion 34.
  • a connector insertion hole 35 is formed in an elongated rectangular shape.
  • a stator terminal insertion hole 36 is formed in the bottom wall 13 between the block-shaped protruding portion 34 and the second wall portion 14b.
  • the stator terminal insertion hole 36 is formed adjacent to the block-shaped projecting portion 34, that is, is formed in an elongated slit shape along the side surface of the block-shaped projecting portion 34 facing the second wall portion 14b. ing.
  • the power module 16 is molded using a synthetic resin material.
  • a metal bus bar (not shown) is formed in a substantially flat plate shape and serves as circuit wiring.
  • a stator connection terminal portion 43 and a sensor connector portion 44 projecting in the orthogonal direction are provided.
  • the external connector 24 is exposed to the outside through the opening 25 of the case 12, and is connected to an electronic device on the vehicle side for transmission and reception of signals and electric power.
  • stator connection terminal portion 43 located substantially at the center of the plate-like base portion 41 passes through the stator terminal insertion hole 36 of the case 12 described above.
  • the sensor connector 44 located on the side of the plate-like base 41 passes through the connector insertion hole 35 of the case 12.
  • the stator connection terminal portion 43 and the sensor connector portion 44 are finally connected to the stator and the sensor on the electric motor 2 side through the opening 9 of the controller mounting seat portion 6 of the electric motor 2, respectively.
  • FIGS. 4 and 5 show the lower surface of the power module 16 on the case 12 side, that is, the component mounting surface, on which a large number of electronic components (mainly power system components) are mounted.
  • the six switching elements (for example, MOSFETs) 46 and the plate-like base 41 constituting a known inverter circuit that converts DC power supplied via the external connector 24 into three-phase AC power.
  • the six switching elements 46 corresponding to “heat generating components” are collectively arranged in the form of “2 ⁇ 3” in a region corresponding to the block-shaped protrusion 34 of the case 12.
  • the pair of relays 51 is disposed at a position opposite to the mounting region of the switching element 46 with the stator connection terminal portion 43 at the substantially central portion interposed therebetween.
  • the power module 16 is combined with the case 12 in such a posture that the component mounting surface is the lower surface, and a plurality of power module mounting screws 53 are respectively screwed into the screw holes 32 on the case 12 side. It is fixed to the case 12.
  • the peripheral portion of the power module 16 is fixed to the screw hole 32 of the substantially cylindrical power module support portion 31, and the central portion is fixed to the screw hole 32 of the block-shaped protruding portion 34.
  • the various electronic components mounted on the power module 16 are accommodated in a space generated between the power module 16 and the case 12.
  • the six switching elements 46 are located close to the top surface of the block-shaped protrusion 34, and each package has a block-shaped protrusion via a single heat conductive sheet as will be described later. 34 is joined to the top surface.
  • the control module 17 overlaid on the power module 16 is made of a printed wiring board using a resin substrate such as glass epoxy resin or a metal substrate, and a large number of control system electronic components (not shown) are mounted on both sides thereof. It is. As shown in FIG. 2, the control module 17 made of this printed wiring board has through holes 56 penetratingly formed at positions corresponding to a large number of connection terminals 55 extending upward from the upper surface of the power module 16. By soldering the connection terminal 55 and the through hole 56, necessary electrical connection is made between the power module 16.
  • the pair of relays 51 mounted on the power module 16 is a normally open type in which the contact is turned on when the electromagnet is energized, and each has a rectangular parallelepiped shape as shown in FIG. .
  • the power module 16 made of synthetic resin is integrally formed with a pair of relay housing chambers 62 formed of relatively thin relay housing chamber walls 61. The relays 51 are fitted in the storage chambers 62, respectively.
  • FIG. 6 and 7 are an enlarged plan view and a cross-sectional view showing a portion of the relay accommodating chamber 62, and the relay accommodating chamber wall 61 is formed of the plate-like base portion 41 of the power module 16 as shown in FIG. It is formed so as to stand vertically from a relay mounting surface 62a at the bottom of a part. And as shown in FIG. 6, the relay accommodating chamber wall 61 is extended so that the circumference
  • the surface facing the relay mounting surface 62a is the bottom surface 51a, and the opposite surface is the top surface 51b.
  • the pair of surfaces along the short side are called side surfaces 51c and the pair of surfaces along the short side are called end surfaces 51d
  • the pair of relays 51 are parallel to each other with a relatively small distance between the side surfaces 51. They are arranged next to each other. Note that a plurality of terminals (a fixed contact terminal 74, a movable contact terminal 75, and a coil terminal 76 shown in FIG.
  • the relay mounting surface 62a is welded or soldered to a bus bar (not shown) passing through the plate-like base 41 of the power module 16 and extending along the upper surface of the plate-like base 41 (the surface opposite to the relay mounting surface 62a).
  • a relay accommodating chamber wall 61 for one relay 51 (indicated by reference numeral 51A in FIG. 6) has a first wall portion 61a along one side surface 51c, and extends perpendicularly from the first wall portion 61a.
  • a second wall 61b along one end face 51d, a third wall 61c extending along the other side 51c of the relay 51, and the other end face of the relay 51, extending orthogonally from the second wall 61b.
  • a fourth wall portion 61d which is located opposite to 51d and has a substantially U shape in plan view. Therefore, the first wall portion 61a and the third wall portion 61c face each other with the relay 51 interposed therebetween, and the second wall portion 61b and the fourth wall portion 61d face each other with the relay 51 interposed therebetween.
  • the relay accommodating chamber wall 61 for the other relay 51 (shown as 51B in FIG. 6) is configured to be substantially symmetrical with the relay accommodating chamber wall 61 for the relay 51A, and similarly, along the one side surface 51c.
  • the first wall portion 61a and the third wall portion 61c face each other with the relay 51 interposed therebetween, and the second wall portion 61b and the fourth wall portion 61d face each other with the relay 51 interposed therebetween.
  • the third wall portion 61c for one relay 51A and the third wall portion 61c for the other relay 51B are connected to each other by a pair of connecting portions 61e.
  • Each of the second wall portions 61b includes a substantially U-shaped portion at the intermediate portion.
  • each of the relay accommodating chambers 62 is configured as a substantially rectangular recessed space surrounding the four surfaces around the relay 51, although the relay accommodating chamber wall 61 is not completely continuous.
  • the relay 51 is inserted from the open surface, and mounted on the relay mounting surface 62a. In this state where the relay 51 is mounted, the top surface 51b of the relay 51 is exposed from the open surface of one end of the relay accommodating chamber 62.
  • the substantially U-shaped recesses in the fourth wall portion 61d and the second wall portion 61b are filled with an adhesive having a relatively high viscosity after the relay 51 is mounted.
  • the relay accommodating chamber wall 61 is located slightly away from the side surface 51c and the end surface 51d of the relay 51, and a gap serving as an air layer 63 is provided between them. Further, as shown in FIG. 7, the height from the relay mounting surface 62 a to the tip of the relay accommodating chamber wall 61 is slightly lower than the height to the top surface 51 b of the relay 51. The top portion slightly protrudes from the tip of the relay accommodating chamber wall 61. Thus, since the height of the relay accommodating chamber wall 61 is slightly low, the chuck of the automatic assembly machine for assembling the relay 51 is inserted into the relay accommodating chamber 62 while holding the top of the relay 51. It becomes possible to do. The difference in height between the two is desirably set to a minimum dimension capable of gripping the relay 51 by the chuck. Note that the leading edge of the relay accommodating chamber wall 61 has the same height in each part.
  • the pair of relays 51 arranged in the relay accommodating chamber 62 as described above are assembled with the case 12 or the like as the motor control device 3, and the top surface 51 b faces downward as shown in FIGS. 8 and 9.
  • Each top surface 51b faces the bottom wall 13 of the case 12, more specifically, the bottom wall 13 in the region between the stator terminal insertion hole 36 and the second wall portion 14b.
  • a heat conduction block 65 having a rectangular flat block shape is disposed as a “heat conduction member”.
  • the heat conduction block 65 is made of a rubber-like material or a silicon-based material excellent in heat conduction, and has flexibility and surface adhesiveness.
  • the heat conduction block 65 has an inner surface between the top surface 51b and the bottom wall 13 of the relay 51. It arrange
  • FIG. 10 shows the power module 16 having the heat conduction block 65 with the case 12 removed
  • FIG. 11 shows an enlarged view of the main part of FIG.
  • FIG. 12 is a perspective view showing one relay 51 and a heat conduction block 65.
  • the heat conduction block 65 of the first embodiment has a rectangular outer shape corresponding to the outer dimension of the top surface 51b forming the rectangle of the relay 51, and has a rectangular central opening in the central portion. 66. Accordingly, the heat conduction block 65 has a rectangular frame shape or a rectangular cylindrical shape.
  • the heat conduction block 65 substantially has a central portion 51 ba (central opening portion 66) of the top surface 51 b of the relay 51.
  • the heat conduction block 65 is configured to be sufficiently thick (for example, having a thickness of 5 mm or more), and high followability can be obtained with respect to minute irregularities on the joint surface.
  • the space between the six switching elements 46, which are heat generating components, and the top surface of the block-like protrusion 34 of the case 12 is thinner than the heat conduction block 65.
  • a sheet-like heat conductive sheet 67 is interposed.
  • This heat conductive sheet 67 is made of a rubber-like material or a silicon-based material excellent in heat conduction similar to the heat conductive block 65, has flexibility and surface adhesiveness, and protrudes from the package surface of the switching element 46 in a block shape. It is in close contact with the top surface of the portion 34. As a result, the heat of the switching element 46 in operation is dissipated to the block-shaped protrusion 34 serving as a heat sink.
  • the relay 51 used in the present invention is not necessarily limited to a specific configuration, but an example thereof is shown in FIG.
  • the relay 51 has a synthetic resin-made relay case 70 composed of a plate-shaped base member 71 and a box-shaped cap 72 having an open end, and the base member 71 has a plurality of terminals (fixed contacts).
  • a terminal 74, a movable contact terminal 75, and a pair of coil terminals 76) are attached by insert molding.
  • the lower surface of the base member 71 is the bottom surface 51 a of the relay 51 described above, and the base member 71 is positioned on the relay mounting surface 62 a side of the power module 16.
  • the terminals 74 to 76 are disposed through the relay mounting surface 62a, and are welded or soldered to a bus bar (not shown) included in the power module 16.
  • a bus bar (not shown) included in the power module 16.
  • Each of the outer surfaces of the cap 72 is the top surface 51b, the side surface 51c (not shown in FIG. 13) and the end surface 51d of the relay 51 described above.
  • a cylindrical coil 81, an iron core 82, and a substantially L-shaped yoke 83 are located on the upper side (ceiling wall 72 a (top surface 51 b)) of the internal space of the relay case 70 including the base member 71 and the cap 72.
  • An electromagnet 80 is accommodated, and a contact portion 85 composed of a fixed contact 86 and a movable contact 87 is accommodated near the lower side of the internal space of the relay case 70 (base member 71 (bottom surface 51a)). That is, in the relay case 70, the contact portion 85 is located at a position relatively closer to the base member 71 than the coil 81, and the ceiling wall 72 a (in other words, the top surface 51 b) of the cap 72 is reversed to the contact portion. Located at a distance from 85. Therefore, the distance from the contact portion 85 to the ceiling wall 72a (top surface 51b) is larger than the distance from the contact portion 85 to the base member 71 (bottom surface 51a).
  • the fixed contact 86 is attached to the end portion of the fixed contact terminal 74 bent in an L shape so as to follow the inner surface of the base member 71, and the movable contact 87 positioned opposite thereto is a leaf spring 88. And is connected to the movable contact terminal 75 via the leaf spring 88.
  • An L-shaped magnetic plate 89 is supported so as to swing around a fulcrum portion 89 a as a swing center, one end 89 a of which opposes the end of the iron core 82, and the other end 89 b to the leaf spring 88. It is linked.
  • the magnetic plate 89 swings and presses the leaf spring 88 downward in the drawing, and the movable contact 87 contacts the fixed contact 86.
  • the movable contact 87 is separated from the fixed contact 86 by the leaf spring 88.
  • Such a relay 51 itself is publicly known, and is described in, for example, Japanese Unexamined Patent Application Publication Nos. 2009-283255 and 2004-172036. In the present invention, various known types of relays can be applied.
  • the relay case 70 has a sealed structure, surrounding moisture penetrates into the relay case 70 due to moisture permeability of the synthetic resin material constituting the relay case 70.
  • the inside of the housing 11 of the motor control device 3 is about 0 ° C. to 5 ° C. during the operation of the vehicle (that is, during the operation of the motor control device 3).
  • the water in the relay case 70 is in a vaporized state, but thereafter, when the operation of the vehicle is finished and the power source of the motor control device 3 is shut off, the metal members such as the bus bars of the power module 16 and the terminals of the connector
  • the temperature of the contact portion 85 (fixed contact 86, movable contact 87) that is thermally connected to the outside air via the temperature decreases to below freezing point, and the vaporized moisture in the relay case 70 becomes the contact 86. , 87 may cause condensation on the surface. Since the contacts 86 and 87 have a small heat capacity, condensation is likely to occur. If condensation occurs in the contact portion 85 while the vehicle is stopped in this manner, contact failure at the contact portion 85 may occur when the power is turned on to start operation of the vehicle.
  • the relay is connected to the metal case 12 exposed to the outside air via the heat conduction block 65 after the power source of the motor control device 3 is shut off in the extremely cold region. Since the top surface 51b of 51 is thermally connected, the temperature of the ceiling wall 72a of the relay case 70 quickly decreases, and the water vaporized in the relay case 70 is condensed on the inner surface of the ceiling wall 72a. .
  • the heat transfer path to the contacts 86 and 87 via the bus bars and the like described above is thin and long, whereas the heat transfer path to the ceiling wall 72a via the heat conduction block 65 is wide and short. Even if it is made of synthetic resin, the temperature rapidly decreases. Therefore, dew condensation at the contacts 86 and 87 located away from the ceiling wall 72a and close to the base member 71 is suppressed.
  • the top surface 51b of the relay case 70 that is, the ceiling wall 72a is in contact with the bottom wall 13 of the case 12 via the heat conduction block 65, and the ceiling wall 72a is locally cooled by heat conduction.
  • the portion other than the ceiling wall 72a is surrounded by the relay accommodating chamber wall 61 via the air layer 63 and is kept warm by the air layer 63, the temperature drop is relatively slow. Therefore, the temperature of the inner surface of the ceiling wall 72a is lowered earlier than the temperature of the contacts 86 and 87, and moisture in the relay case 70 is collected on the ceiling wall 72a as condensation.
  • the contacts 86 and 87 in the relay case 70 are located above the ceiling wall 72a and the ceiling wall 72a is at the bottom, so that the temperature distribution due to air convection in the relay case 70 However, the upper contacts 86 and 87 are more likely to maintain a higher temperature than the lower ceiling wall 72a. If dew condensation occurs in a portion other than the ceiling wall 72a in the relay case 70, the water drops grow and try to collect on the lower ceiling wall 72a by its own weight. The condensation of 87 is more reliably suppressed.
  • the frame-like heat conduction block 65 contacts the outer edge portion of the ceiling wall 72a (that is, the outer edge portion 51bb of the top surface 51b), and the center portion (that is, the top surface 51b) of the ceiling wall 72a that most easily expands due to thermal expansion. Since the central portion 51ba) is opened by the central opening 66, the stress at the central portion of the ceiling wall 72a is relieved, and the occurrence of breakage and cracks is suppressed.
  • the heat conduction block 65 is thick in the height direction of the relay 51, the expansion / contraction of the ceiling wall 72a can be easily absorbed. Therefore, the durability of the relay case is improved.
  • the heat conduction block 65 is also disposed on the outer edge 51bb on the outer peripheral side of the central portion of the ceiling wall 72a corresponding to the central opening 66 (that is, the central portion 51ba of the top surface 51b). Since it is surrounded by the heat conduction block 65, the temperature decrease is also promoted by heat conduction through the heat conduction block 65, and as described above, condensation can be generated on the inner surface thereof.
  • the “center portion” of the rectangular top surface 51b means a portion including the intersection of two diagonal lines of the top surface 51b. Therefore, by forming the central opening 66, at least the intersection is located inside the central opening 66 without being covered by the heat conduction block 65.
  • the heat conduction block 65 of the second embodiment has the rectangular shape of the first embodiment described above so as to cover the top surfaces 51 b of the two relays 51 with one heat conduction block 65.
  • a frame-shaped heat conduction block 65 is connected by two connecting portions 67.
  • rectangular cutouts 68 corresponding to the distance between the pair of relays 51 are provided on the outside of the connecting portion 67. That is, as a whole, the figure has an 8-shape having a pair of central openings 66.
  • the central portion of the ceiling wall 72a of each relay 51 (the central portion 51ba of the top surface 51b) is also opened by the central opening 66, so that stress during thermal expansion can be relieved. it can. Further, compared to the first embodiment described above, the area of the heat transfer surface in contact with the bottom wall 13 of the case 12 is increased, and the number of assembling steps of the heat conduction block 65 is reduced.
  • the heat conduction block 65 is disposed at the outer edge 51bb on the outer peripheral side of the central portion 51ba of the top surface 51b corresponding to the central opening 66, so that the heat conduction block
  • the heat conduction through 65 also promotes a decrease in temperature and can cause condensation on the inner surface.
  • the notch portion 68 is positioned between the third wall portions 61 c of the pair of relay accommodating chamber walls 61, so that the heat conduction block 65 with respect to the relay 51 is arranged. Positioning is easy. Further, by inserting a flat jig between the pair of relay accommodating chamber walls 61 and placing the heat conduction block 65 while applying the jig to the notch 68, the above positioning operation is facilitated. Improves attachment and reduces assembly man-hours.
  • the heat conduction block 65 that is compressed and deformed by the top surface 51b of the relay 51 and the inner surface of the case 12 is notched. It becomes easy to escape to the space produced by the part 68, and as a result, the adhesiveness of each surface improves.
  • the heat conduction block 65 when the pressing force of the heat conduction block 65 increases due to the thermal expansion of the cover 15, the heat conduction block 65 easily escapes into the space formed by the notch 68. Since the heat conduction block 65 swelled in the space is restored, adhesion to heat shrinkage is improved.
  • the heat conduction block 65 can be formed in a shape that does not include the notch 68.
  • a heat conduction block 65 having a rectangular block shape is disposed across the top surfaces 51 b of the pair of relays 51.
  • the heat conduction block 65 has a rectangular outer shape smaller than one top surface 51 b so as not to overlap the central portion 51 ba of the top surface 51 b of each relay 51, and covers the portions inside the pair of relays 51. ing.
  • the temperature decrease is also promoted by heat conduction through the heat conduction block 65, and condensation can be generated on the inner surface thereof.
  • the central portion 51ba of the top surface 51b does not overlap the heat conduction block 65 between the pair of end surfaces 51d of each relay 51. It is more preferable in terms of relaxation.
  • each heat conduction block 65 has a length equal to the width of the end surface 51 d of the relay 51 (that is, the short side of the relay 51) and the width of the side surface 51 c of the relay 51 (that is, the relay 51.
  • the two heat conductive blocks 65 are each arrange
  • each relay 51 the two heat conducting blocks 65 are joined to the region excluding the central portion 51ba of the top surface 51b, and the central portion 51ba of the top surface 51b is open. Thereby, the stress at the time of thermal expansion can be relieved.
  • the small heat conduction block 65 of the fourth embodiment is provided on the top surface 51b of each relay 51 only on one side. In this case, in consideration of the internal configuration of the relay 51 illustrated in FIG. 13, it is preferable to dispose the heat conduction block 65 on the side far from the contact portion 85.
  • the main body portion 65A has a rectangular outer shape corresponding to the outer dimension of the top surface 51b of the relay 51, similarly to the heat conduction block 65 of the first embodiment.
  • a rectangular central opening 66 is provided in the central portion, and a thin-walled portion 65B is provided in the central opening 66 of the main body 65A as a second heat conducting member that can be relatively easily deformed.
  • the thin-walled portion 65B can be integrally formed using, for example, a heat conductive material that is the same as that of the main body portion 65A, or a separately formed member is press-fitted into the central opening 66. It may be integrated.
  • the thin portion 65B may be made of a material different from that of the main body portion 65A.
  • the thin portion 65B is formed so as to constitute a part of one heat transfer surface that is in close contact with the bottom wall 13 of the case 12, and between the central portion 51ba of the top surface 51b of the relay 51. A space is formed.
  • the stress at the central portion 51ba of the top surface 51b during thermal expansion is relieved.
  • the area of the heat transfer surface with respect to the bottom wall 13 of the case 12 can be increased compared to the first embodiment. That is, since the heat conduction block 65 is in contact with the case 12 even in the thin portion 65B, the heat transfer area can be increased and the temperature drop of the top surface 51b of the relay 51 can be promoted.
  • the thin portion 65B can be provided to be shifted to the relay 51 side. Even if the configuration is in contact with the top surface 51b of the relay 51, the thin-walled portion 65B can be easily deformed as compared with the main body portion 65A, so that excessive stress during thermal expansion is suppressed.
  • the main body portion 65A has a rectangular outer shape corresponding to the outer dimension of the top surface 51b of the relay 51, similarly to the heat conduction block 65 of the first embodiment.
  • a second heat conductive member having a rectangular central opening 66 in the central portion and relatively easily deformed in the central opening 66 of the main body 65A, heat conduction different from that of the main body 65A.
  • a low reaction force portion 65C made of a conductive material is provided.
  • the low reaction force portion 65C is made of a material having a smaller elastic force, that is, a reaction force than the main body portion 65A, has the same thickness as the main body portion 65A, and has a top surface 51b of the relay 51 and a bottom surface of the case 12. It is in contact with both the wall 13.
  • the low reaction force portion 65C may be formed integrally with the main body portion 65A using different materials, or may be formed separately and press-fitted into the central opening 66.
  • the seventh embodiment since the reaction force against the displacement of the central portion 51ba of the top surface 51b is small, the stress at the central portion 51ba of the top surface 51b during thermal expansion is relieved as in each of the embodiments. Further, according to the seventh embodiment, there is an advantage that a large area of the heat transfer surface with respect to the top surface 51b of the relay 51 and the bottom wall 13 of the case 12 can be obtained.
  • each relay 51 has a posture in which the terminals 74, 75, 76 of the relay 51 protrude toward the plane of the plate-like base 41 of the power module 16, that is, the relay mounting surface 62 a of the relay accommodating chamber 62.
  • the present invention is not limited to this, and the present invention can be similarly applied to a configuration in which the relay 51 is mounted in a posture in which these terminals 74, 75, and 76 protrude to the side. is there.
  • the present invention can be applied not only to the motor control device 3 for the electric brake booster of the above embodiment but also to various electronic control devices.
  • the electronic control device of the present invention includes an electromagnet and a relay in which a contact portion opened and closed by the electromagnet is housed in a relay case, a heat generating component that generates heat in an operating state, the relay, and the heat generating component.
  • a circuit board on which the circuit board is mounted ; an exterior member that accommodates the circuit board; and an adhesive disposed between one surface of the relay case facing the inner surface of the exterior member and the inner surface of the exterior member.
  • the heat conductive member is joined to the surface in a region excluding the central portion of the surface of the relay case.
  • the temperature of a part of the relay case can be quickly lowered by heat conduction after the operation stops in a very cold region, etc., and condensation due to moisture in the relay case is generated on the inner wall of the relay case away from the contact point. Collecting and dew condensation at the contact portion can be suppressed. And when the relay case is thermally expanded due to the heat generated by the relay itself or the heat-generating parts during operation, the reaction force acting on the center of the surface of the relay case is small. It is suppressed that it leads to a crack.
  • the heat conducting member is configured in a rectangular frame shape having a central opening corresponding to the central portion of the surface. Thereby, a space is formed toward the central portion of the above surface, and stress during thermal expansion is suppressed.
  • a second heat conducting member that is relatively easily deformed is provided in the central opening.
  • the area of a heat-transfer surface expands, suppressing the stress of a center part.
  • a heat conducting member smaller than the above surface is joined to a portion of the above surface that is offset from one side except for the central portion. Even in such an embodiment, the stress in the central portion can be suppressed.
  • two relays are arranged adjacent to each other, and one heat conducting member is arranged across both of the two relays so as to cover the adjacent areas. Even in such an embodiment, the stress in the central portion can be suppressed. In addition, the number of assembling steps for the heat conducting member is reduced.
  • the heat conducting member is made of a rubber-like material or a silicon-based material and has flexibility.
  • the heat conducting member has a block shape with a thickness of 5 mm or more.
  • the above-mentioned heat conduction member is arranged in the state where it was compressed between the above-mentioned surface of the above-mentioned relay, and the inner surface of the above-mentioned exterior member which this surface opposes.
  • the relay includes a plurality of terminals on the bottom surface opposite to the surface.
  • the electronic control device of the present invention is, for example, a motor control device for an electric brake booster mounted on a vehicle.
  • the surface of the relay is rectangular, and the intersection of two diagonal lines of the rectangle is not covered by the heat conducting member.

Abstract

In this motor control device (3) of an electric brake booster, a power module (16) is housed inside a housing (11) together with a control module (17). A relay (51) is mounted in the power module (16). Between the top surface (51b) of the relay (51) and the bottom surface of a case (12) in the housing (11), a heat conduction block (65) is arranged and is thermally connected. In extremely cold locales, after power source shut-off, the top surface of the relay (51) is cooled by heat conduction, so condensation is suppressed in the contact part. The heat conduction block (65) comprises a center opening (66), and the top surface center (51ba) of the relay case (70) is opened, so stress during thermal expansion is suppressed.

Description

電子制御装置Electronic control unit
 この発明は、電磁式のリレーを備えた電子制御装置に関する。 This invention relates to an electronic control device provided with an electromagnetic relay.
 特許文献1には、その従来技術として、リレーを具備した車両用電源装置において、ON状態でリレー内部で発生する熱を外部に放出させるために、リレーケースの頂面を熱伝導シートを介して車両のシャーシに接触させた構成が開示されている。 In Patent Document 1, as a prior art, in a vehicle power supply device equipped with a relay, the top surface of the relay case is disposed through a heat conductive sheet in order to release heat generated inside the relay in an ON state. A configuration in contact with a vehicle chassis is disclosed.
 上記従来の構成では、リレーケースの頂面の全面が熱伝導シートの弾性力による反力を受け、熱伝導シートの厚み方向に押圧された状態となる。そのため、リレーの作動中の発熱や周囲の熱によりリレーケースが高温となったときに、リレーケースの頂面部分の膨張によって頂面中央部に応力が発生し、リレーケースの耐久性が低下する懸念がある。 In the above conventional configuration, the entire top surface of the relay case is subjected to a reaction force due to the elastic force of the heat conductive sheet and is pressed in the thickness direction of the heat conductive sheet. Therefore, when the relay case becomes hot due to heat generated during operation of the relay or ambient heat, stress is generated in the central portion of the top surface due to expansion of the top surface portion of the relay case, reducing the durability of the relay case. There are concerns.
特開2014-79093号公報JP 2014-79093 A
 この発明に係る電子制御装置は、
 電磁石および該電磁石によって開閉される接点部がリレーケース内に収容されてなるリレーと、
 作動状態で発熱する発熱部品と、
 上記リレーおよび上記発熱部品が実装される回路基板と、
 この回路基板を収容する外装部材と、
 上記外装部材の内側面に対向するリレーケースの一つの面と上記外装部材の内側面との間に配置された粘着性を有する熱伝導部材と、
 を備え、
 上記熱伝導部材は、
 上記リレーケースの上記の面の中央部を除いた領域で該面に接合されている。
An electronic control device according to the present invention includes:
A relay in which an electromagnet and a contact portion opened and closed by the electromagnet are housed in a relay case;
A heat-generating component that generates heat during operation;
A circuit board on which the relay and the heat generating component are mounted;
An exterior member that houses the circuit board;
A heat conductive member having adhesiveness disposed between one surface of the relay case facing the inner surface of the exterior member and the inner surface of the exterior member;
With
The heat conducting member is
The relay case is joined to the surface in a region excluding the central portion of the surface.
 本発明によれば、熱伝導面となるリレーケースの面の中央部は熱伝導部材によって拘束されていないため、リレーの作動中の発熱や周囲の発熱部品の熱などにより熱膨張したときに、中央部での応力が分散し、破損やひび割れの発生が抑制される。 According to the present invention, the central portion of the surface of the relay case that becomes the heat conducting surface is not constrained by the heat conducting member, so when the heat expands due to heat generated during operation of the relay or heat of surrounding heat generating components, Stress at the center is dispersed, and the occurrence of breakage and cracks is suppressed.
本発明の一実施例であるモータ制御装置を備えた電動ブレーキブースタを示す分解斜視図。The disassembled perspective view which shows the electric brake booster provided with the motor control apparatus which is one Example of this invention. この実施例のモータ制御装置の分解斜視図。The exploded perspective view of the motor control device of this embodiment. ケース単体の斜視図。The perspective view of a case single-piece | unit. パワーモジュール単体の斜視図であって、パワーモジュールを部品実装面側から見た斜視図。It is the perspective view of a power module single-piece | unit, Comprising: The perspective view which looked at the power module from the component mounting surface side. 同じくパワーモジュール単体を部品実装面側から見た平面図。Similarly, the top view which looked at the power module simple substance from the component mounting surface side. 図5の要部の拡大図。The enlarged view of the principal part of FIG. 図6のA-A線に沿った断面図。Sectional drawing along the AA line of FIG. 図5のB-B線に沿ったモータ制御装置全体の断面図。FIG. 6 is a cross-sectional view of the entire motor control device taken along line BB in FIG. 5. 図5のC-C線に沿ったモータ制御装置全体の断面図。Sectional drawing of the whole motor control apparatus along CC line of FIG. ケースを取り除いた状態でパワーモジュールとカバーとを示す平面図。The top view which shows a power module and a cover in the state which removed the case. 図8の要部の拡大図。The enlarged view of the principal part of FIG. 第1実施例の熱伝導ブロックをリレーとともに示す斜視図。The perspective view which shows the heat conductive block of 1st Example with a relay. リレーの一構成例を示す断面図。Sectional drawing which shows one structural example of a relay. 第2実施例の熱伝導ブロックをリレーとともに示す斜視図。The perspective view which shows the heat conductive block of 2nd Example with a relay. 第2実施例の熱伝導ブロックを備えた図10と同様の平面図。The top view similar to FIG. 10 provided with the heat conductive block of 2nd Example. 図15のD-D線に沿ったモータ制御装置全体の断面図。FIG. 16 is a cross-sectional view of the entire motor control device taken along line DD in FIG. 15. 第3実施例の熱伝導ブロックをリレーとともに示す斜視図。The perspective view which shows the heat conductive block of 3rd Example with a relay. 第3実施例の熱伝導ブロックを備えた図10と同様の平面図。The top view similar to FIG. 10 provided with the heat conductive block of 3rd Example. 図18のE-E線に沿ったモータ制御装置全体の断面図。FIG. 19 is a cross-sectional view of the entire motor control device taken along line EE in FIG. 18. 第4実施例の熱伝導ブロックをリレーとともに示す斜視図。The perspective view which shows the heat conductive block of 4th Example with a relay. 第4実施例の熱伝導ブロックを備えた図10と同様の平面図。The top view similar to FIG. 10 provided with the heat conductive block of 4th Example. 図21のF-F線に沿ったモータ制御装置全体の断面図。FIG. 22 is a sectional view of the entire motor control device taken along line FF in FIG. 21. 第5実施例の熱伝導ブロックをリレーとともに示す斜視図。The perspective view which shows the heat conductive block of 5th Example with a relay. 第5実施例の熱伝導ブロックを備えた図10と同様の平面図。The top view similar to FIG. 10 provided with the heat conductive block of 5th Example. 図24のG-G線に沿ったモータ制御装置全体の断面図。FIG. 25 is a sectional view of the entire motor control device taken along line GG in FIG. 24. 第6実施例の熱伝導ブロックをリレーとともに示す斜視図。The perspective view which shows the heat conductive block of 6th Example with a relay. 第6実施例の熱伝導ブロックを備えた図10と同様の平面図。The top view similar to FIG. 10 provided with the heat conductive block of 6th Example. 図27のH-H線に沿ったモータ制御装置全体の断面図。FIG. 28 is a cross-sectional view of the entire motor control device taken along line HH in FIG. 27. 第7実施例の熱伝導ブロックをリレーとともに示す斜視図。The perspective view which shows the heat conductive block of 7th Example with a relay. 第7実施例の熱伝導ブロックを備えた図10と同様の平面図。The top view similar to FIG. 10 provided with the heat conductive block of 7th Example. 図30のI-I線に沿ったモータ制御装置全体の断面図。FIG. 31 is a sectional view of the entire motor control device taken along line II in FIG. 30.
 以下、本発明を電動ブレーキブースタの電子制御装置に適用した一実施例を図面に基づいて詳細に説明する。 Hereinafter, an embodiment in which the present invention is applied to an electronic control device for an electric brake booster will be described in detail with reference to the drawings.
 図1は、本発明に係る電子制御装置であるモータ制御装置3を備えた電動ブレーキブースタ1を示す分解斜視図であり、図2は、モータ制御装置3の分解斜視図である。 FIG. 1 is an exploded perspective view showing an electric brake booster 1 provided with a motor control device 3 which is an electronic control device according to the present invention, and FIG. 2 is an exploded perspective view of the motor control device 3.
 図1に示す電動ブレーキブースタ1は、自動車の車室とエンジンルームとを仕切るダッシュパネル(図示せず)のエンジンルーム側に取り付けられ、車室側に設けられるブレーキペダルの踏込に応じて図示せぬマスタシリンダを駆動する倍力機構を構成するものであって、ボールねじ機構を介して図示せぬマスタシリンダのピストンを軸方向に駆動する電動モータ2と、運転者によるブレーキ操作や自動車の運転状態に基づいて電動モータ2を駆動制御するモータ制御装置3と、を備えている。 An electric brake booster 1 shown in FIG. 1 is attached to the engine room side of a dash panel (not shown) that partitions the automobile compartment and the engine compartment, and is illustrated according to the depression of a brake pedal provided on the compartment side. A booster mechanism for driving the master cylinder, and an electric motor 2 for driving the piston of the master cylinder (not shown) in the axial direction via a ball screw mechanism; And a motor control device 3 that drives and controls the electric motor 2 based on the state.
 電動モータ2は、例えばアルミニウム合金等の金属材料からなるモータハウジング4を有し、このモータハウジング4の円筒形の外面には、一対の台座部5と、この一対の台座部5の間に位置するコントローラ取付座部6と、が形成されている。モータ制御装置3は、コントローラ取付座部6の上に載置され、四隅に配した装置取付ねじ8が台座部5のねじ孔7に螺合することによって、モータハウジング4に取付・固定されている。略矩形の壁状をなすコントローラ取付座部6は、その内側に開口部9を有し、この開口部9を通して、電動モータ2側とモータ制御装置3との間の電気的接続がなされている。 The electric motor 2 has a motor housing 4 made of a metal material such as an aluminum alloy, for example, and a cylindrical outer surface of the motor housing 4 is positioned between the pair of pedestal portions 5 and the pair of pedestal portions 5. And a controller mounting seat portion 6 to be formed. The motor control device 3 is mounted on the controller mounting seat 6 and is mounted and fixed to the motor housing 4 by screwing the device mounting screws 8 arranged at the four corners into the screw holes 7 of the base 5. Yes. The controller mounting seat portion 6 having a substantially rectangular wall shape has an opening 9 inside thereof, and the electric connection between the electric motor 2 side and the motor control device 3 is made through the opening 9. .
 なお、図1は、エンジンルーム内に配置される電動ブレーキブースタ1の車両搭載状態の姿勢に概ね対応しており、車両搭載状態でモータハウジング4の上面となる側にモータ制御装置3が搭載されている。 FIG. 1 generally corresponds to the posture of the electric brake booster 1 disposed in the engine room when mounted on the vehicle, and the motor control device 3 is mounted on the upper surface side of the motor housing 4 when mounted on the vehicle. ing.
 図2に示すように、モータ制御装置3は、「外装部材」に相当する筐体11を有する。この筐体11は、車両搭載状態で下側に位置するケース12と、車両搭載状態で上側に位置するカバー15と、からなる。ケース12は、底壁13と周壁14とを有し、上面が上方に向けて開口する平面視で略矩形状をなす。カバー15は、ケース12の上面開口を閉蓋する平面視で略矩形状をなす。筐体11の内部には、「回路基板」に相当するパワーモジュール16が、別の回路基板からなる制御モジュール17とともに収容されている。詳しくは、ケース12の底壁13寄りにパワーモジュール16が位置し、その上方に、所定の間隔を隔てて制御モジュール17が積層配置されている。 As shown in FIG. 2, the motor control device 3 has a housing 11 corresponding to an “exterior member”. The housing 11 includes a case 12 positioned on the lower side when the vehicle is mounted and a cover 15 positioned on the upper side when mounted on the vehicle. The case 12 has a bottom wall 13 and a peripheral wall 14, and has a substantially rectangular shape in plan view with the upper surface opening upward. The cover 15 has a substantially rectangular shape in a plan view that closes the upper surface opening of the case 12. Inside the housing 11, a power module 16 corresponding to a “circuit board” is housed together with a control module 17 made of another circuit board. Specifically, the power module 16 is positioned near the bottom wall 13 of the case 12, and the control module 17 is laminated and disposed above the power module 16 with a predetermined interval.
 カバー15は、金属板を略皿状にプレス成形することで形成されているものであって、ケース12の周壁14上端に接合されるフランジ部21を周縁に有し、制御モジュール17を収容すべくフランジ部21からケース12とは反対側に向けて膨出した形状をなしている。このカバー15は、四隅に配したカバー取付ねじ22によってケース12に固定されている。 The cover 15 is formed by press-molding a metal plate in a substantially dish shape, and has a flange portion 21 joined to the upper end of the peripheral wall 14 of the case 12 at the periphery, and accommodates the control module 17. Therefore, it has a shape bulging from the flange portion 21 toward the opposite side of the case 12. The cover 15 is fixed to the case 12 by cover mounting screws 22 arranged at four corners.
 図3にも示すように、ケース12は、熱伝導が比較的良好な金属材料例えばアルミニウム合金を用いていわゆるダイカスト法によって金型成形されたものである。このケース12の略矩形の周壁14は、互いに対向する第1壁部14aならびに第3壁部14c、および、これらと直交する形で互いに対向する第2壁部14bならびに第4壁部14d、から構成されているが、その一辺に相当する第1壁部14aには、パワーモジュール16の外部接続コネクタ24が挿通する開口部25が略U字形に切り欠き形成されている。また第4壁部14dの一端部には、外側から呼吸フィルタ26(図1参照)が取り付けられる円形の呼吸孔27が開口形成されている。第4壁部14dの外面には、複数の冷却用フィン28が形成されている。なお、ケース12とカバー15との間は、周壁14上端のシール溝29に塗布されたシール剤によってシールされており、パワーモジュール16の外部接続コネクタ24の周囲も同様にシール剤の塗布によってケース12およびカバー15に対しシールされている。 As shown in FIG. 3, the case 12 is molded by a so-called die casting method using a metal material having relatively good heat conduction, such as an aluminum alloy. The substantially rectangular peripheral wall 14 of the case 12 includes a first wall portion 14a and a third wall portion 14c that face each other, and a second wall portion 14b and a fourth wall portion 14d that face each other in a form orthogonal to them. Although it is configured, an opening 25 through which the external connector 24 of the power module 16 is inserted is cut out in a substantially U shape in the first wall portion 14a corresponding to one side thereof. In addition, a circular breathing hole 27 to which a breathing filter 26 (see FIG. 1) is attached from the outside is formed at one end of the fourth wall portion 14d. A plurality of cooling fins 28 are formed on the outer surface of the fourth wall portion 14d. The case 12 and the cover 15 are sealed with a sealant applied to the seal groove 29 at the upper end of the peripheral wall 14, and the periphery of the external connector 24 of the power module 16 is similarly applied by applying the sealant. 12 and the cover 15 are sealed.
 ケース12の底壁13には、カバー15側に向けてそれぞれ突出する略円柱状のパワーモジュール支持部31が複数箇所に形成されており、各々の頂部に、パワーモジュール16を取り付けるためのねじ孔32が形成されている。 The bottom wall 13 of the case 12 is formed with a plurality of substantially cylindrical power module support portions 31 protruding toward the cover 15 at a plurality of locations, and screw holes for attaching the power module 16 to each top portion. 32 is formed.
 また、底壁13の中でパワーモジュール16側の後述するスイッチング素子実装領域に対応する位置において、該底壁13からカバー15側に向けて略矩形のブロック状に突出したブロック状突出部34が形成されている。このブロック状突出部34は、熱容量の大きなヒートシンクとして機能する。ブロック状突出部34は、ケース12の略中央部に位置し、矩形の周壁14のうち第1壁部14a、第2壁部14bおよび第3壁部14cに対しては、それぞれ所定の間隔を介して離れており、第4壁部14dに対しては、一体に連続して形成されている。このブロック状突出部34の頂面の四隅近傍には、やはりパワーモジュール16を取り付けるための複数のネジ孔32が形成されている。 Further, at a position corresponding to a switching element mounting region, which will be described later, on the power module 16 side in the bottom wall 13, a block-shaped projecting portion 34 projecting from the bottom wall 13 toward the cover 15 is formed into a substantially rectangular block shape. Is formed. This block-shaped protrusion 34 functions as a heat sink having a large heat capacity. The block-shaped projecting portion 34 is located at a substantially central portion of the case 12 and has a predetermined interval with respect to the first wall portion 14a, the second wall portion 14b, and the third wall portion 14c of the rectangular peripheral wall 14. And are formed integrally and continuously with respect to the fourth wall portion 14d. A plurality of screw holes 32 for attaching the power module 16 are also formed in the vicinity of the four corners of the top surface of the block-shaped protrusion 34.
 ブロック状突出部34の第4壁部14d側の端部には、細長い矩形状にコネクタ挿通孔35が開口形成されている。さらに、ブロック状突出部34と第2壁部14bとの間において、底壁13に、ステータ用端子挿通孔36が開口形成されている。このステータ用端子挿通孔36は、ブロック状突出部34に隣接して形成されており、つまり第2壁部14bに対向するブロック状突出部34の側面に沿って、細長いスリット状に開口形成されている。 At the end of the block-shaped protrusion 34 on the fourth wall 14d side, a connector insertion hole 35 is formed in an elongated rectangular shape. Further, a stator terminal insertion hole 36 is formed in the bottom wall 13 between the block-shaped protruding portion 34 and the second wall portion 14b. The stator terminal insertion hole 36 is formed adjacent to the block-shaped projecting portion 34, that is, is formed in an elongated slit shape along the side surface of the block-shaped projecting portion 34 facing the second wall portion 14b. ing.
 パワーモジュール16は、合成樹脂材料を用いて型成形したものであって、図4および図5に示すように、略平板状に形成されるとともに回路配線となる金属製のバスバー(図示せず)が表面ないし内部に多数インサートされた板状基部41と、この板状基部41の一端縁に一体に形成された前述した外部接続コネクタ24と、板状基部41から該板状基部41の平面と直交する方向に突出したステータ接続端子部43およびセンサコネクタ部44と、を備えている。外部接続コネクタ24は、前述したようにケース12の開口部25を通して外部へ露出しており、信号および電力の授受のために車両側の電子機器と接続される。また板状基部41の略中央に位置するステータ接続端子部43は、前述したケース12のステータ用端子挿通孔36を貫通する。板状基部41の側部に位置するセンサコネクタ部44は、ケース12のコネクタ挿通孔35を貫通する。これらのステータ接続端子部43およびセンサコネクタ部44は、最終的には、電動モータ2のコントローラ取付座部6の開口部9を通して電動モータ2側のステータおよびセンサとそれぞれ接続される。 The power module 16 is molded using a synthetic resin material. As shown in FIGS. 4 and 5, a metal bus bar (not shown) is formed in a substantially flat plate shape and serves as circuit wiring. A plate-like base portion 41 having a large number inserted on the surface or inside thereof, the external connection connector 24 formed integrally with one end edge of the plate-like base portion 41, and a plane of the plate-like base portion 41 from the plate-like base portion 41. A stator connection terminal portion 43 and a sensor connector portion 44 projecting in the orthogonal direction are provided. As described above, the external connector 24 is exposed to the outside through the opening 25 of the case 12, and is connected to an electronic device on the vehicle side for transmission and reception of signals and electric power. Further, the stator connection terminal portion 43 located substantially at the center of the plate-like base portion 41 passes through the stator terminal insertion hole 36 of the case 12 described above. The sensor connector 44 located on the side of the plate-like base 41 passes through the connector insertion hole 35 of the case 12. The stator connection terminal portion 43 and the sensor connector portion 44 are finally connected to the stator and the sensor on the electric motor 2 side through the opening 9 of the controller mounting seat portion 6 of the electric motor 2, respectively.
 図4および図5は、ケース12側となるパワーモジュール16の下面つまり部品実装面を示しており、ここに多数の電子部品(主にパワー系部品)が実装されている。具体的には、外部接続コネクタ24を介して供給される直流電力を三相交流電力に変換する周知のインバータ回路を構成する6個のスイッチング素子(例えばMOSFET)46、板状基部41の平面から直立した略円柱状をなす一対の第1電解コンデンサ47、同じく板状基部41の平面から直立した略円柱状をなし第1電解コンデンサ47よりは軸方向の長さが短い一対の第2電解コンデンサ48、複数のセラミックコンデンサ49、電流を検出するための複数のシャント抵抗50、回路保護のために電力遮断を行う一対のリレー51、ノイズフィルタとなるノーマルモードコイル52、などが実装されている。「発熱部品」に相当する6個のスイッチング素子46は、ケース12のブロック状突出部34に対応する領域に「2×3」の形でまとめて配置されている。一対のリレー51は、略中央部のステータ接続端子部43を挟んでスイッチング素子46の実装領域と反対側となる位置に配置されている。 4 and 5 show the lower surface of the power module 16 on the case 12 side, that is, the component mounting surface, on which a large number of electronic components (mainly power system components) are mounted. Specifically, from the plane of the six switching elements (for example, MOSFETs) 46 and the plate-like base 41 constituting a known inverter circuit that converts DC power supplied via the external connector 24 into three-phase AC power. A pair of first electrolytic capacitors 47 having an upright substantially cylindrical shape, and a pair of second electrolytic capacitors having a substantially cylindrical shape which is also upright from the plane of the plate-like base 41 and having a shorter axial length than the first electrolytic capacitor 47. 48, a plurality of ceramic capacitors 49, a plurality of shunt resistors 50 for detecting current, a pair of relays 51 for cutting off power for circuit protection, a normal mode coil 52 serving as a noise filter, and the like are mounted. The six switching elements 46 corresponding to “heat generating components” are collectively arranged in the form of “2 × 3” in a region corresponding to the block-shaped protrusion 34 of the case 12. The pair of relays 51 is disposed at a position opposite to the mounting region of the switching element 46 with the stator connection terminal portion 43 at the substantially central portion interposed therebetween.
 パワーモジュール16は、図2に示したように、上記の部品実装面が下面となる姿勢でケース12と組み合わされ、ケース12側のねじ孔32にそれぞれ螺合する複数のパワーモジュール取付ねじ53によってケース12に固定されている。なお、パワーモジュール16の周縁部は、略円柱状のパワーモジュール支持部31のねじ孔32に、中央部分は、ブロック状突出部34のねじ孔32に、それぞれ固定される。そして、パワーモジュール16に実装された上記の種々の電子部品は、パワーモジュール16とケース12の間に生じる空間内に収容される。このとき、6個のスイッチング素子46は、ブロック状突出部34の頂面に近接して位置しており、各々のパッケージが、後述するように1枚の熱伝導シートを介してブロック状突出部34の頂面に接合されている。 As shown in FIG. 2, the power module 16 is combined with the case 12 in such a posture that the component mounting surface is the lower surface, and a plurality of power module mounting screws 53 are respectively screwed into the screw holes 32 on the case 12 side. It is fixed to the case 12. The peripheral portion of the power module 16 is fixed to the screw hole 32 of the substantially cylindrical power module support portion 31, and the central portion is fixed to the screw hole 32 of the block-shaped protruding portion 34. The various electronic components mounted on the power module 16 are accommodated in a space generated between the power module 16 and the case 12. At this time, the six switching elements 46 are located close to the top surface of the block-shaped protrusion 34, and each package has a block-shaped protrusion via a single heat conductive sheet as will be described later. 34 is joined to the top surface.
 パワーモジュール16の上方に重ねられる制御モジュール17は、ガラスエポキシ樹脂などの樹脂基板もしくは金属基板を用いた印刷配線基板からなり、その両面に多数の制御系電子部品(図示せず)を実装したものである。図2に示すように、この印刷配線基板からなる制御モジュール17は、パワーモジュール16の上面から上方へ延びる多数の接続端子55に対応した位置に、それぞれスルーホール56が貫通形成されており、これら接続端子55とスルーホール56とをハンダ付けすることによって、パワーモジュール16との間での必要な電気的接続がなされている。そして、パワーモジュール16の上面に一体に成形された複数のスナップフィット部57が制御モジュール17周縁の切欠部58に係合し、これによって、制御モジュール17がパワーモジュール16の板状基部41から所定の間隔を保った状態で固定保持されている。 The control module 17 overlaid on the power module 16 is made of a printed wiring board using a resin substrate such as glass epoxy resin or a metal substrate, and a large number of control system electronic components (not shown) are mounted on both sides thereof. It is. As shown in FIG. 2, the control module 17 made of this printed wiring board has through holes 56 penetratingly formed at positions corresponding to a large number of connection terminals 55 extending upward from the upper surface of the power module 16. By soldering the connection terminal 55 and the through hole 56, necessary electrical connection is made between the power module 16. Then, a plurality of snap fit portions 57 integrally formed on the upper surface of the power module 16 engage with the notches 58 on the periphery of the control module 17, whereby the control module 17 is predetermined from the plate-like base portion 41 of the power module 16. It is fixedly held in a state where the interval is maintained.
 次に、本発明の要部であるリレー51周辺の構成についてさらに説明する。 Next, the configuration around the relay 51, which is a main part of the present invention, will be further described.
 パワーモジュール16に実装される一対のリレー51は、本実施例では、電磁石に通電したときに接点がONとなる常開型のものであり、それぞれ図4に示すように直方体形状をなしている。この直方体形状をなすリレー51に対し、合成樹脂製のパワーモジュール16には、比較的薄肉のリレー収容室壁61から構成される一対のリレー収容室62が一体に成形されており、各々のリレー収容室62内にリレー51がそれぞれ嵌合している。 In this embodiment, the pair of relays 51 mounted on the power module 16 is a normally open type in which the contact is turned on when the electromagnet is energized, and each has a rectangular parallelepiped shape as shown in FIG. . In contrast to the relay 51 having a rectangular parallelepiped shape, the power module 16 made of synthetic resin is integrally formed with a pair of relay housing chambers 62 formed of relatively thin relay housing chamber walls 61. The relays 51 are fitted in the storage chambers 62, respectively.
 図6および図7は、リレー収容室62の部分を拡大して示す平面図および断面図であって、リレー収容室壁61は、図7に示すように、パワーモジュール16の板状基部41の一部をなす底部のリレー実装面62aから垂直に起立して形成されている。そして、図6に示すように、リレー収容室壁61は、リレー51の周囲を矩形に囲むように延びている。 6 and 7 are an enlarged plan view and a cross-sectional view showing a portion of the relay accommodating chamber 62, and the relay accommodating chamber wall 61 is formed of the plate-like base portion 41 of the power module 16 as shown in FIG. It is formed so as to stand vertically from a relay mounting surface 62a at the bottom of a part. And as shown in FIG. 6, the relay accommodating chamber wall 61 is extended so that the circumference | surroundings of the relay 51 may be enclosed in a rectangle.
 ここで、説明の便宜のために、直方体つまり6面体をなすリレー51の各面について、リレー実装面62aに向かう面を底面51a、これと反対側の面を頂面51b、平面視で長辺に沿った一対の面をそれぞれ側面51c、短辺に沿った一対の面をそれぞれ端面51d、と呼ぶこととすると、一対のリレー51は、各々の側面51が比較的小さな間隔を介して平行に隣り合うように配置されている。なお、リレー51の後述する複数の端子(図12に示す固定接点端子74、可動接点端子75、コイル端子76)は、底面51aから該底面51aに対し垂直に突出しており、これらの端子は、リレー実装面62aにおいてパワーモジュール16の板状基部41を貫通し、該板状基部41の上面(リレー実装面62aと反対側の面)に沿った図示せぬバスバーに溶接もしくはハンダ付けされている。 Here, for convenience of explanation, for each surface of the relay 51 that forms a rectangular parallelepiped, that is, a hexahedron, the surface facing the relay mounting surface 62a is the bottom surface 51a, and the opposite surface is the top surface 51b. If the pair of surfaces along the short side are called side surfaces 51c and the pair of surfaces along the short side are called end surfaces 51d, the pair of relays 51 are parallel to each other with a relatively small distance between the side surfaces 51. They are arranged next to each other. Note that a plurality of terminals (a fixed contact terminal 74, a movable contact terminal 75, and a coil terminal 76 shown in FIG. 12), which will be described later, of the relay 51 protrude perpendicularly from the bottom surface 51a to the bottom surface 51a. The relay mounting surface 62a is welded or soldered to a bus bar (not shown) passing through the plate-like base 41 of the power module 16 and extending along the upper surface of the plate-like base 41 (the surface opposite to the relay mounting surface 62a). .
 一方のリレー51(図6に符号51Aとして示す)に対するリレー収容室壁61は、一方の側面51cに沿った第1壁部61aと、該第1壁部61aから直交して延び、リレー51の一方の端面51dに沿った第2壁部61bと、該第2壁部61bからさらに直交して延び、リレー51の他方の側面51cに沿った第3壁部61cと、リレー51の他方の端面51dに対向して位置し、平面視で略U字形をなす第4壁部61dと、を備えている。従って、第1壁部61aと第3壁部61cとは、リレー51を挟んで互いに対向し、第2壁部61bと第4壁部61dとは、リレー51を挟んで互いに対向する。 A relay accommodating chamber wall 61 for one relay 51 (indicated by reference numeral 51A in FIG. 6) has a first wall portion 61a along one side surface 51c, and extends perpendicularly from the first wall portion 61a. A second wall 61b along one end face 51d, a third wall 61c extending along the other side 51c of the relay 51, and the other end face of the relay 51, extending orthogonally from the second wall 61b. And a fourth wall portion 61d which is located opposite to 51d and has a substantially U shape in plan view. Therefore, the first wall portion 61a and the third wall portion 61c face each other with the relay 51 interposed therebetween, and the second wall portion 61b and the fourth wall portion 61d face each other with the relay 51 interposed therebetween.
 他方のリレー51(図6に符号51Bとして示す)に対するリレー収容室壁61は、リレー51Aに対するリレー収容室壁61とほぼ対称をなすように構成されており、同様に、一方の側面51cに沿った第1壁部61aと、該第1壁部61aから直交して延び、リレー51の一方の端面51dに沿った第2壁部61bと、該第2壁部61bからさらに直交して延び、リレー51の他方の側面51cに沿った第3壁部61cと、リレー51の他方の端面51dに対向して位置し、平面視で略U字形をなす第4壁部61dと、を備えている。第1壁部61aと第3壁部61cとは、リレー51を挟んで互いに対向し、第2壁部61bと第4壁部61dとは、リレー51を挟んで互いに対向する。 The relay accommodating chamber wall 61 for the other relay 51 (shown as 51B in FIG. 6) is configured to be substantially symmetrical with the relay accommodating chamber wall 61 for the relay 51A, and similarly, along the one side surface 51c. The first wall 61a, the first wall 61a extending orthogonally from the first wall 61a, the second wall 61b along one end surface 51d of the relay 51, and the second wall 61b extending further orthogonally, A third wall portion 61c along the other side surface 51c of the relay 51, and a fourth wall portion 61d that is positioned opposite to the other end surface 51d of the relay 51 and has a substantially U shape in plan view. . The first wall portion 61a and the third wall portion 61c face each other with the relay 51 interposed therebetween, and the second wall portion 61b and the fourth wall portion 61d face each other with the relay 51 interposed therebetween.
 そして、一方のリレー51Aに対する第3壁部61cと他方のリレー51Bに対する第3壁部61cとが、一対の連結部61eでもって互いに連結されている。また、各々の第2壁部61bは、中間部に略U字形の部分を備えている。 The third wall portion 61c for one relay 51A and the third wall portion 61c for the other relay 51B are connected to each other by a pair of connecting portions 61e. Each of the second wall portions 61b includes a substantially U-shaped portion at the intermediate portion.
 従って、各々のリレー収容室62は、リレー収容室壁61が完全には連続していないものの、リレー51の周囲の四面を囲む実質的に矩形の凹部状の空間として構成されており、その一端の開放面からリレー51が挿入されて、リレー実装面62a上に実装されることとなる。このようにリレー51が実装された状態でおいては、リレー収容室62の一端の開放面からリレー51の頂面51bが露出した状態となる。なお、第4壁部61dおよび第2壁部61bにおける略U字形の凹部には、リレー51の実装後に比較的粘度の高い接着剤が充填される。 Accordingly, each of the relay accommodating chambers 62 is configured as a substantially rectangular recessed space surrounding the four surfaces around the relay 51, although the relay accommodating chamber wall 61 is not completely continuous. The relay 51 is inserted from the open surface, and mounted on the relay mounting surface 62a. In this state where the relay 51 is mounted, the top surface 51b of the relay 51 is exposed from the open surface of one end of the relay accommodating chamber 62. The substantially U-shaped recesses in the fourth wall portion 61d and the second wall portion 61b are filled with an adhesive having a relatively high viscosity after the relay 51 is mounted.
 ここで、リレー収容室壁61は、リレー51の側面51cや端面51dからは僅かに離れて位置しており、両者間に空気層63となる間隙が設けられている。また、図7に示すように、リレー実装面62aからのリレー収容室壁61先端までの高さは、リレー51の頂面51bまでの高さよりも僅かに低くなっており、従って、リレー51の頂部がリレー収容室壁61の先端から僅かに突出するようになっている。このようにリレー収容室壁61の高さが僅かに低いことで、リレー51の組付を行う自動組立機のチャックがリレー51の頂部を把持したまま該リレー51をリレー収容室62内に挿入することが可能となる。この両者の高さの差は、チャックによるリレー51の把持が可能な最小限の寸法に設定することが望ましい。なお、リレー収容室壁61の先端縁は、各部で同一の高さとなっている。 Here, the relay accommodating chamber wall 61 is located slightly away from the side surface 51c and the end surface 51d of the relay 51, and a gap serving as an air layer 63 is provided between them. Further, as shown in FIG. 7, the height from the relay mounting surface 62 a to the tip of the relay accommodating chamber wall 61 is slightly lower than the height to the top surface 51 b of the relay 51. The top portion slightly protrudes from the tip of the relay accommodating chamber wall 61. Thus, since the height of the relay accommodating chamber wall 61 is slightly low, the chuck of the automatic assembly machine for assembling the relay 51 is inserted into the relay accommodating chamber 62 while holding the top of the relay 51. It becomes possible to do. The difference in height between the two is desirably set to a minimum dimension capable of gripping the relay 51 by the chuck. Note that the leading edge of the relay accommodating chamber wall 61 has the same height in each part.
 上記のようにリレー収容室62内に配置された一対のリレー51は、モータ制御装置3としてケース12等と組み立てた状態では、図8および図9に示すように、頂面51bが下向きとなるように倒立した姿勢となり、各々の頂面51bがケース12の底壁13詳しくはステータ用端子挿通孔36と第2壁部14bとの間の領域における底壁13に対向している。そして、両者間に、「熱伝導部材」として矩形の偏平なブロック状をなす熱伝導ブロック65が配置されている。この熱伝導ブロック65は、熱伝導に優れたゴム状材料もしくはシリコン系材料からなり、柔軟性ならびに表面の粘着性を備えているものであって、リレー51の頂面51bと底壁13の内側面との間で僅かに圧縮された状態に配設されており、これにより、それぞれの面に密着している。従って、リレー51の頂面51bがケース12の底壁13に熱的に接続されている。 As shown in FIGS. 8 and 9, the pair of relays 51 arranged in the relay accommodating chamber 62 as described above are assembled with the case 12 or the like as the motor control device 3, and the top surface 51 b faces downward as shown in FIGS. 8 and 9. Each top surface 51b faces the bottom wall 13 of the case 12, more specifically, the bottom wall 13 in the region between the stator terminal insertion hole 36 and the second wall portion 14b. Between them, a heat conduction block 65 having a rectangular flat block shape is disposed as a “heat conduction member”. The heat conduction block 65 is made of a rubber-like material or a silicon-based material excellent in heat conduction, and has flexibility and surface adhesiveness. The heat conduction block 65 has an inner surface between the top surface 51b and the bottom wall 13 of the relay 51. It arrange | positions in the state compressed slightly between the side surfaces, and is closely_contact | adhered to each surface by this. Therefore, the top surface 51 b of the relay 51 is thermally connected to the bottom wall 13 of the case 12.
 図10は、熱伝導ブロック65を備えたパワーモジュール16をケース12を取り除いた状態で示しており、また図11は図8の要部を拡大して示している。また図12は、一つのリレー51と熱伝導ブロック65とを示す斜視図である。これらの図に示すように、第1実施例の熱伝導ブロック65は、リレー51の矩形をなす頂面51bの外形寸法に対応した矩形の外形状を有するとともに、中央部分に矩形の中央開口部66を有している。従って、熱伝導ブロック65は、矩形のフレーム状ないし矩形の筒状をなしている。これにより、熱伝導ブロック65がリレー51とケース12の底壁13との間に介在した状態では、熱伝導ブロック65は、実質的にリレー51の頂面51bの中央部51ba(中央開口部66に対応する領域)よりも外周側の外縁部51bbに接しており、頂面51bの中央部51baに対しては、中央開口部66により空間が確保されている。なお、熱伝導ブロック65はその肉厚が十分に厚く(例えば5mm以上の肉厚を有する)構成されており、接合面の微細な凹凸に対し高い追従性が得られる。 FIG. 10 shows the power module 16 having the heat conduction block 65 with the case 12 removed, and FIG. 11 shows an enlarged view of the main part of FIG. FIG. 12 is a perspective view showing one relay 51 and a heat conduction block 65. As shown in these drawings, the heat conduction block 65 of the first embodiment has a rectangular outer shape corresponding to the outer dimension of the top surface 51b forming the rectangle of the relay 51, and has a rectangular central opening in the central portion. 66. Accordingly, the heat conduction block 65 has a rectangular frame shape or a rectangular cylindrical shape. Thereby, in a state where the heat conduction block 65 is interposed between the relay 51 and the bottom wall 13 of the case 12, the heat conduction block 65 substantially has a central portion 51 ba (central opening portion 66) of the top surface 51 b of the relay 51. The region corresponding to the outer peripheral portion 51bb on the outer peripheral side than the region 51), and a space is secured by the central opening 66 for the central portion 51ba of the top surface 51b. The heat conduction block 65 is configured to be sufficiently thick (for example, having a thickness of 5 mm or more), and high followability can be obtained with respect to minute irregularities on the joint surface.
 また、図10および図9に示すように、発熱部品である6個のスイッチング素子46とケース12のブロック状突出部34の頂面との間には、熱伝導ブロック65に比して薄肉なシート状をなす熱伝導シート67が介装されている。この熱伝導シート67は、熱伝導ブロック65と同様の熱伝導に優れたゴム状材料もしくはシリコン系材料からなり、柔軟性ならびに表面の粘着性を有し、スイッチング素子46のパッケージ面とブロック状突出部34の頂面とに密着している。これによって、作動中のスイッチング素子46の熱がヒートシンクとなるブロック状突出部34に放熱される。 Further, as shown in FIGS. 10 and 9, the space between the six switching elements 46, which are heat generating components, and the top surface of the block-like protrusion 34 of the case 12 is thinner than the heat conduction block 65. A sheet-like heat conductive sheet 67 is interposed. This heat conductive sheet 67 is made of a rubber-like material or a silicon-based material excellent in heat conduction similar to the heat conductive block 65, has flexibility and surface adhesiveness, and protrudes from the package surface of the switching element 46 in a block shape. It is in close contact with the top surface of the portion 34. As a result, the heat of the switching element 46 in operation is dissipated to the block-shaped protrusion 34 serving as a heat sink.
 本発明に用いられるリレー51は、必ずしも特定の構成のものに限定されるものではないが、その一例を図13に示す。図示するように、リレー51は、板状のベース部材71と一端が開口した箱状のキャップ72とからなる合成樹脂製のリレーケース70を有し、ベース部材71に、複数の端子(固定接点端子74、可動接点端子75、一対のコイル端子76)がインサート成形により取り付けられている。図示例では、ベース部材71の図下側の面が上述したリレー51の底面51aとなり、パワーモジュール16のリレー実装面62a側にベース部材71が位置した姿勢となる。上記の端子74~76は、前述したように、リレー実装面62aを貫通して配置され、パワーモジュール16が具備する図示せぬバスバーに溶接もしくはハンダ付けされる。またキャップ72の外側面の各々が前述したリレー51の頂面51b、側面51c(図13では符号は付していない)および端面51dとなる。 The relay 51 used in the present invention is not necessarily limited to a specific configuration, but an example thereof is shown in FIG. As shown in the figure, the relay 51 has a synthetic resin-made relay case 70 composed of a plate-shaped base member 71 and a box-shaped cap 72 having an open end, and the base member 71 has a plurality of terminals (fixed contacts). A terminal 74, a movable contact terminal 75, and a pair of coil terminals 76) are attached by insert molding. In the illustrated example, the lower surface of the base member 71 is the bottom surface 51 a of the relay 51 described above, and the base member 71 is positioned on the relay mounting surface 62 a side of the power module 16. As described above, the terminals 74 to 76 are disposed through the relay mounting surface 62a, and are welded or soldered to a bus bar (not shown) included in the power module 16. Each of the outer surfaces of the cap 72 is the top surface 51b, the side surface 51c (not shown in FIG. 13) and the end surface 51d of the relay 51 described above.
 ベース部材71とキャップ72とで構成されるリレーケース70の内部空間の図上方(天井壁72a(頂面51b))寄りには、円筒状のコイル81、鉄心82および略L字形のヨーク83からなる電磁石80が収容されており、リレーケース70の内部空間の図下方(ベース部材71(底面51a))寄りには、固定接点86と可動接点87とからなる接点部85が収容されている。つまり、リレーケース70の中で、接点部85は、コイル81よりも相対的にベース部材71に近い位置にあり、キャップ72の天井壁72a(換言すれば頂面51b)は、逆に接点部85から離れた位置にある。従って、接点部85から天井壁72a(頂面51b)までの距離は、接点部85からベース部材71(底面51a)までの距離よりも大きなものとなっている。 A cylindrical coil 81, an iron core 82, and a substantially L-shaped yoke 83 are located on the upper side (ceiling wall 72 a (top surface 51 b)) of the internal space of the relay case 70 including the base member 71 and the cap 72. An electromagnet 80 is accommodated, and a contact portion 85 composed of a fixed contact 86 and a movable contact 87 is accommodated near the lower side of the internal space of the relay case 70 (base member 71 (bottom surface 51a)). That is, in the relay case 70, the contact portion 85 is located at a position relatively closer to the base member 71 than the coil 81, and the ceiling wall 72 a (in other words, the top surface 51 b) of the cap 72 is reversed to the contact portion. Located at a distance from 85. Therefore, the distance from the contact portion 85 to the ceiling wall 72a (top surface 51b) is larger than the distance from the contact portion 85 to the base member 71 (bottom surface 51a).
 固定接点86は、ベース部材71の内側面に沿うようにL字形に折曲された固定接点端子74の端部に取り付けられており、これに対向して位置する可動接点87は、板バネ88の先端部に支持されるとともに、該板バネ88を介して可動接点端子75に接続されている。L字形に構成された磁性板89が支点部89aを揺動中心として揺動するように支持されており、その一端89aが鉄心82の端部に対向し、かつ他端89bが板バネ88に連係されている。従って、コイル端子76からコイル81に通電されると、磁性板89が揺動して板バネ88を図の下方へ押圧し、可動接点87が固定接点86に当接する。コイル81が非通電となると、可動接点87は板バネ88によって固定接点86から離間する。 The fixed contact 86 is attached to the end portion of the fixed contact terminal 74 bent in an L shape so as to follow the inner surface of the base member 71, and the movable contact 87 positioned opposite thereto is a leaf spring 88. And is connected to the movable contact terminal 75 via the leaf spring 88. An L-shaped magnetic plate 89 is supported so as to swing around a fulcrum portion 89 a as a swing center, one end 89 a of which opposes the end of the iron core 82, and the other end 89 b to the leaf spring 88. It is linked. Accordingly, when the coil 81 is energized from the coil terminal 76, the magnetic plate 89 swings and presses the leaf spring 88 downward in the drawing, and the movable contact 87 contacts the fixed contact 86. When the coil 81 is de-energized, the movable contact 87 is separated from the fixed contact 86 by the leaf spring 88.
 このようなリレー51そのものは公知であり、例えば、特開2009-283255号公報や特開2004-172036号公報等に記載されている。本発明では、公知の種々の形式のリレーを適用することが可能である。 Such a relay 51 itself is publicly known, and is described in, for example, Japanese Unexamined Patent Application Publication Nos. 2009-283255 and 2004-172036. In the present invention, various known types of relays can be applied.
 以上説明した実施例の構成においては、極寒冷地におけるリレー51の接点部85の結露の発生を抑制できる。 In the configuration of the embodiment described above, it is possible to suppress the occurrence of condensation on the contact portion 85 of the relay 51 in an extremely cold region.
 すなわち、リレーケース70は密閉構造であるものの、該リレーケース70を構成する合成樹脂材料が有する透湿性によって周囲の水分がリレーケース70内に浸透する。例えば氷点下20°にも達するような極寒冷地を想定すると、車両の運転中(つまりモータ制御装置3の作動中)は、モータ制御装置3の筐体11内は0℃~5℃程度であり、リレーケース70内の水分は気化した状態にあるが、その後、車両の運転が終了し、モータ制御装置3の電源が遮断されると、パワーモジュール16のバスバーやコネクタの端子類などの金属部材を介して外気に熱的に接続された形となっている接点部85(固定接点86、可動接点87)の温度が氷点下へと低下し、リレーケース70内の気化していた水分が接点86,87の表面で結露するおそれがある。接点86,87は、熱容量も小さいことから、結露が生じやすい。このようにして停車中に接点部85の結露が生じると、車両の運転を開始すべく電源が投入されたときに、接点部85での接触不良が生じることがあり、好ましくない。 That is, although the relay case 70 has a sealed structure, surrounding moisture penetrates into the relay case 70 due to moisture permeability of the synthetic resin material constituting the relay case 70. For example, assuming a very cold region that reaches 20 ° below freezing point, the inside of the housing 11 of the motor control device 3 is about 0 ° C. to 5 ° C. during the operation of the vehicle (that is, during the operation of the motor control device 3). The water in the relay case 70 is in a vaporized state, but thereafter, when the operation of the vehicle is finished and the power source of the motor control device 3 is shut off, the metal members such as the bus bars of the power module 16 and the terminals of the connector The temperature of the contact portion 85 (fixed contact 86, movable contact 87) that is thermally connected to the outside air via the temperature decreases to below freezing point, and the vaporized moisture in the relay case 70 becomes the contact 86. , 87 may cause condensation on the surface. Since the contacts 86 and 87 have a small heat capacity, condensation is likely to occur. If condensation occurs in the contact portion 85 while the vehicle is stopped in this manner, contact failure at the contact portion 85 may occur when the power is turned on to start operation of the vehicle.
 このような問題に対し、上記実施例の構成では、極寒冷地においてモータ制御装置3の電源が遮断された後に、外気に晒されている金属製のケース12に熱伝導ブロック65を介してリレー51の頂面51bが熱的に接続されていることから、リレーケース70の天井壁72aが速やかに温度低下し、リレーケース70内の気化していた水分が天井壁72aの内表面で結露する。上述したバスバー等を介した接点86,87への熱伝達経路は、細くかつ長いのに対し、熱伝導ブロック65を介した天井壁72aへの熱伝達経路は、広くかつ短いので、天井壁72aが合成樹脂製であっても速やかに温度低下する。従って、天井壁72aから離れてベース部材71寄りに位置する接点86,87での結露が抑制される。 With respect to such a problem, in the configuration of the above-described embodiment, the relay is connected to the metal case 12 exposed to the outside air via the heat conduction block 65 after the power source of the motor control device 3 is shut off in the extremely cold region. Since the top surface 51b of 51 is thermally connected, the temperature of the ceiling wall 72a of the relay case 70 quickly decreases, and the water vaporized in the relay case 70 is condensed on the inner surface of the ceiling wall 72a. . The heat transfer path to the contacts 86 and 87 via the bus bars and the like described above is thin and long, whereas the heat transfer path to the ceiling wall 72a via the heat conduction block 65 is wide and short. Even if it is made of synthetic resin, the temperature rapidly decreases. Therefore, dew condensation at the contacts 86 and 87 located away from the ceiling wall 72a and close to the base member 71 is suppressed.
 特に、リレー51は、リレーケース70の頂面51bつまり天井壁72aが熱伝導ブロック65を介してケース12の底壁13に接しており、この天井壁72aが熱伝導により局部的に冷却される一方で、この天井壁72a以外の部分は、リレー収容室壁61によって空気層63を介して囲まれており、この空気層63によって保温されるため、その温度低下が相対的に緩慢となる。そのため、接点86,87の温度よりも天井壁72aの内表面の温度の方が先に低下し、リレーケース70内の水分が天井壁72aに結露として集められる。 Particularly, in the relay 51, the top surface 51b of the relay case 70, that is, the ceiling wall 72a is in contact with the bottom wall 13 of the case 12 via the heat conduction block 65, and the ceiling wall 72a is locally cooled by heat conduction. On the other hand, since the portion other than the ceiling wall 72a is surrounded by the relay accommodating chamber wall 61 via the air layer 63 and is kept warm by the air layer 63, the temperature drop is relatively slow. Therefore, the temperature of the inner surface of the ceiling wall 72a is lowered earlier than the temperature of the contacts 86 and 87, and moisture in the relay case 70 is collected on the ceiling wall 72a as condensation.
 また、車両搭載状態では、リレーケース70内の接点86,87は天井壁72aよりも上方に位置し、かつ天井壁72aが最下部となるため、リレーケース70内での空気の対流による温度分布としても、下方の天井壁72aよりも上方の接点86,87の方が高い温度を保ち易い。そして、仮にリレーケース70内の天井壁72a以外の部位で結露が生じた場合には、水滴の成長に伴って自重により下方の天井壁72aに集まろうとするため、上方に位置する接点86,87の結露がより確実に抑制される。 Further, in the vehicle-mounted state, the contacts 86 and 87 in the relay case 70 are located above the ceiling wall 72a and the ceiling wall 72a is at the bottom, so that the temperature distribution due to air convection in the relay case 70 However, the upper contacts 86 and 87 are more likely to maintain a higher temperature than the lower ceiling wall 72a. If dew condensation occurs in a portion other than the ceiling wall 72a in the relay case 70, the water drops grow and try to collect on the lower ceiling wall 72a by its own weight. The condensation of 87 is more reliably suppressed.
 一方、前述した特許文献1のようにリレーケースの頂面全面に熱伝導シートを配設すると、リレーが高温となったときにリレーケースの膨張に伴う応力によってひび割れ等が生じる懸念があるが、上記実施例では、フレーム状の熱伝導ブロック65が天井壁72aの外縁部(つまり頂面51bの外縁部51bb)に接触し、熱膨張によって最も膨らみやすい天井壁72aの中央部(つまり頂面51bの中央部51ba)が中央開口部66によって開放されているので、この天井壁72a中央部での応力が緩和され、破損やひび割れの発生が抑制される。しかも、熱伝導ブロック65は、リレー51の高さ方向における肉厚が厚いので、天井壁72aの膨張・収縮を容易に吸収することができる。従って、リレーケースの耐久性が向上する。なお、中央開口部66に対応する天井壁72aの中央部(つまり頂面51bの中央部51ba)の中央部においても、その外周側である外縁部51bbに熱伝導ブロック65が配置されていて該熱伝導ブロック65に囲まれているため、熱伝導ブロック65を介した熱伝導によって、やはり温度低下が促進され、上述したように、その内表面に結露を生じさせることができる。 On the other hand, when the heat conductive sheet is disposed on the entire top surface of the relay case as in Patent Document 1 described above, there is a concern that cracks and the like may occur due to stress associated with expansion of the relay case when the relay becomes hot, In the above embodiment, the frame-like heat conduction block 65 contacts the outer edge portion of the ceiling wall 72a (that is, the outer edge portion 51bb of the top surface 51b), and the center portion (that is, the top surface 51b) of the ceiling wall 72a that most easily expands due to thermal expansion. Since the central portion 51ba) is opened by the central opening 66, the stress at the central portion of the ceiling wall 72a is relieved, and the occurrence of breakage and cracks is suppressed. Moreover, since the heat conduction block 65 is thick in the height direction of the relay 51, the expansion / contraction of the ceiling wall 72a can be easily absorbed. Therefore, the durability of the relay case is improved. Note that the heat conduction block 65 is also disposed on the outer edge 51bb on the outer peripheral side of the central portion of the ceiling wall 72a corresponding to the central opening 66 (that is, the central portion 51ba of the top surface 51b). Since it is surrounded by the heat conduction block 65, the temperature decrease is also promoted by heat conduction through the heat conduction block 65, and as described above, condensation can be generated on the inner surface thereof.
 なお、矩形をなす頂面51bの「中央部」とは、頂面51bの2つの対角線の交点を含む部位を意味する。従って、中央開口部66の形成により、少なくとも上記交点は熱伝導ブロック65に覆われることなく中央開口部66の内側に位置している。 It should be noted that the “center portion” of the rectangular top surface 51b means a portion including the intersection of two diagonal lines of the top surface 51b. Therefore, by forming the central opening 66, at least the intersection is located inside the central opening 66 without being covered by the heat conduction block 65.
 次に、図14~図16に基づいて、熱伝導ブロック65の第2実施例を説明する。この第2実施例の熱伝導ブロック65は、図14に示すように、2個のリレー51の頂面51bを一つの熱伝導ブロック65でもって覆うように、前述した第1実施例の矩形のフレーム状をなす熱伝導ブロック65が連結部67を介して2個連結された形状をなしている。そして、連結部67の外側には、一対のリレー51の間隔に対応した矩形の切欠部68がそれぞれ設けられている。つまり、全体として、一対の中央開口部66を備えた8の字形をなしている。 Next, a second embodiment of the heat conduction block 65 will be described with reference to FIGS. As shown in FIG. 14, the heat conduction block 65 of the second embodiment has the rectangular shape of the first embodiment described above so as to cover the top surfaces 51 b of the two relays 51 with one heat conduction block 65. A frame-shaped heat conduction block 65 is connected by two connecting portions 67. In addition, rectangular cutouts 68 corresponding to the distance between the pair of relays 51 are provided on the outside of the connecting portion 67. That is, as a whole, the figure has an 8-shape having a pair of central openings 66.
 このような構成によれば、各リレー51の天井壁72a中央部(頂面51bの中央部51ba)は、やはり中央開口部66によって開放されているので、熱膨張時の応力を緩和することができる。また、前述した第1実施例に比較して、ケース12の底壁13と接する伝熱面の面積が大きくなり、かつ熱伝導ブロック65の組付工数が低減する。 According to such a configuration, the central portion of the ceiling wall 72a of each relay 51 (the central portion 51ba of the top surface 51b) is also opened by the central opening 66, so that stress during thermal expansion can be relieved. it can. Further, compared to the first embodiment described above, the area of the heat transfer surface in contact with the bottom wall 13 of the case 12 is increased, and the number of assembling steps of the heat conduction block 65 is reduced.
 なお、前述した第1実施例と同じく、中央開口部66に対応する頂面51bの中央部51baにおいても、その外周側である外縁部51bbに熱伝導ブロック65が配置されるため、熱伝導ブロック65を介した熱伝導によって、やはり温度低下が促進され、その内表面に結露を生じさせることができる。 As in the first embodiment described above, the heat conduction block 65 is disposed at the outer edge 51bb on the outer peripheral side of the central portion 51ba of the top surface 51b corresponding to the central opening 66, so that the heat conduction block The heat conduction through 65 also promotes a decrease in temperature and can cause condensation on the inner surface.
 ここで、上記のように切欠部68を備えた構成では、一対のリレー収容室壁61の第3壁部61cの間に切欠部68を位置合わせすることで、リレー51に対する熱伝導ブロック65の位置決めが容易となる。また、一対のリレー収容室壁61の間に平板状の治具を挿入し、切欠部68にこの治具を当てつつ熱伝導ブロック65を配置することで、上記の位置決め作業が容易となり、組付性の向上ならびに組付工数の低減が図れる。 Here, in the configuration provided with the notch portion 68 as described above, the notch portion 68 is positioned between the third wall portions 61 c of the pair of relay accommodating chamber walls 61, so that the heat conduction block 65 with respect to the relay 51 is arranged. Positioning is easy. Further, by inserting a flat jig between the pair of relay accommodating chamber walls 61 and placing the heat conduction block 65 while applying the jig to the notch 68, the above positioning operation is facilitated. Improves attachment and reduces assembly man-hours.
 さらに、パワーモジュール16および制御モジュール17をケース12内に収容してカバー15を組み付けたときに、リレー51の頂面51bとケース12の内面とにより圧縮されて変形する熱伝導ブロック65が、切欠部68により生じる空間に逃げやすくなり、その結果、それぞれの面の密着性が向上する。 Further, when the power module 16 and the control module 17 are accommodated in the case 12 and the cover 15 is assembled, the heat conduction block 65 that is compressed and deformed by the top surface 51b of the relay 51 and the inner surface of the case 12 is notched. It becomes easy to escape to the space produced by the part 68, and as a result, the adhesiveness of each surface improves.
 また、カバー15の熱膨張により熱伝導ブロック65の押し付け力が大きくなったときにも、同様に熱伝導ブロック65が切欠部68による空間に逃げやすくなり、逆に熱収縮時には、切欠部68の空間に膨らんだ熱伝導ブロック65が復元するため、熱収縮に対する密着性が向上する。 Similarly, when the pressing force of the heat conduction block 65 increases due to the thermal expansion of the cover 15, the heat conduction block 65 easily escapes into the space formed by the notch 68. Since the heat conduction block 65 swelled in the space is restored, adhesion to heat shrinkage is improved.
 なお、第2実施例として、切欠部68を具備しない形状に熱伝導ブロック65を形成すること可能である。 In the second embodiment, the heat conduction block 65 can be formed in a shape that does not include the notch 68.
 次に、図17~図19に基づいて、熱伝導ブロック65の第3実施例を説明する。この第3実施例は、図17に示すように、一対のリレー51の頂面51bに跨って一つの矩形ブロック状をなす熱伝導ブロック65を配置したものである。熱伝導ブロック65は、各リレー51の頂面51bの中央部51baに重ならないように、一つの頂面51bよりも小さな矩形の外形を有し、一対のリレー51の互いに内側となる部分を覆っている。 Next, a third embodiment of the heat conduction block 65 will be described with reference to FIGS. In the third embodiment, as shown in FIG. 17, a heat conduction block 65 having a rectangular block shape is disposed across the top surfaces 51 b of the pair of relays 51. The heat conduction block 65 has a rectangular outer shape smaller than one top surface 51 b so as not to overlap the central portion 51 ba of the top surface 51 b of each relay 51, and covers the portions inside the pair of relays 51. ing.
 この実施例によれば、やはりリレー51の頂面51bの中央部51baが開放された状態となるので、熱膨張時の応力を緩和することができる。 According to this embodiment, since the central portion 51ba of the top surface 51b of the relay 51 is still open, the stress during thermal expansion can be relieved.
 なお、頂面51bの中央部51baにおいても、熱伝導ブロック65を介した熱伝導によって、やはり温度低下が促進され、その内表面に結露を生じさせることができる。 It should be noted that also in the central portion 51ba of the top surface 51b, the temperature decrease is also promoted by heat conduction through the heat conduction block 65, and condensation can be generated on the inner surface thereof.
 また、上記第3実施例では、頂面51bの中央部51baが、各リレー51の一対の端面51dの間に亘って熱伝導ブロック65と重ならない構成となっているため、熱膨張時の応力緩和の上でより好適である。 In the third embodiment, the central portion 51ba of the top surface 51b does not overlap the heat conduction block 65 between the pair of end surfaces 51d of each relay 51. It is more preferable in terms of relaxation.
 次に、図20~図22に基づいて、熱伝導ブロック65の第4実施例を説明する。この第4実施例は、一対のリレー51の各々に、比較的小さな2個の熱伝導ブロック65を互いに離して配置したものである。個々の熱伝導ブロック65は、図20に示すように、リレー51の端面51dの幅(つまりリレー51の短辺)と等しい長さを有するとともに、リレー51の側面51cの幅(つまりリレー51の長辺)の半分よりも小さい厚さを有する、矩形ブロック状をなす。そして、2個の熱伝導ブロック65が、頂面51b上でかつ端面51dに近い位置にそれぞれ配置されている。換言すれば、2個の起立壁状の熱伝導ブロック65が、間隔を置いて互いに平行に配置されている。 Next, a fourth embodiment of the heat conduction block 65 will be described with reference to FIGS. In the fourth embodiment, two relatively small heat conduction blocks 65 are arranged apart from each other in each of the pair of relays 51. As shown in FIG. 20, each heat conduction block 65 has a length equal to the width of the end surface 51 d of the relay 51 (that is, the short side of the relay 51) and the width of the side surface 51 c of the relay 51 (that is, the relay 51. A rectangular block shape having a thickness smaller than half of the long side). And the two heat conductive blocks 65 are each arrange | positioned in the position close | similar to the end surface 51d on the top surface 51b. In other words, the two standing wall-like heat conduction blocks 65 are arranged in parallel to each other with a gap therebetween.
 従って、各リレー51の頂面51bにおいて、2個の熱伝導ブロック65は頂面51bの中央部51baを除いた領域に接合されており、頂面51bの中央部51baが開放されている。これにより、熱膨張時の応力を緩和することができる。 Therefore, on the top surface 51b of each relay 51, the two heat conducting blocks 65 are joined to the region excluding the central portion 51ba of the top surface 51b, and the central portion 51ba of the top surface 51b is open. Thereby, the stress at the time of thermal expansion can be relieved.
 図23~図25に示す第5実施例は、第4実施例の小型の熱伝導ブロック65を各リレー51の頂面51bに片側だけ設けるようにしたものである。なお、この場合、図13に例示したようなリレー51の内部構成を考慮して、接点部85から遠い側に熱伝導ブロック65を配置することが好ましい。 In the fifth embodiment shown in FIGS. 23 to 25, the small heat conduction block 65 of the fourth embodiment is provided on the top surface 51b of each relay 51 only on one side. In this case, in consideration of the internal configuration of the relay 51 illustrated in FIG. 13, it is preferable to dispose the heat conduction block 65 on the side far from the contact portion 85.
 次に、図26~図28に基づいて、熱伝導ブロック65の第6実施例を説明する。この第6実施例の熱伝導ブロック65は、本体部65Aが、第1実施例の熱伝導ブロック65と同様に、リレー51の頂面51bの外形寸法に対応した矩形の外形状を有するとともに、中央部分に矩形の中央開口部66を有しており、かつこの本体部65Aの中央開口部66に、相対的に変形が容易な第2の熱伝導部材として、薄肉部65Bが設けられている。薄肉部65Bは、例えば、本体部65Aと同じ材質の熱伝導性材料を用いて一体に成形することも可能であり、あるいは別体に形成したものを中央開口部66内に圧入するなどして一体化してもよい。本体部65Aと異なる材料から薄肉部65Bを構成してもよい。薄肉部65Bは、図示例では、ケース12の底壁13と密接する一方の伝熱面の一部を構成するように形成されており、リレー51の頂面51b中央部51baとの間には、空間が形成されている。 Next, a sixth embodiment of the heat conduction block 65 will be described with reference to FIGS. In the heat conduction block 65 of the sixth embodiment, the main body portion 65A has a rectangular outer shape corresponding to the outer dimension of the top surface 51b of the relay 51, similarly to the heat conduction block 65 of the first embodiment. A rectangular central opening 66 is provided in the central portion, and a thin-walled portion 65B is provided in the central opening 66 of the main body 65A as a second heat conducting member that can be relatively easily deformed. . The thin-walled portion 65B can be integrally formed using, for example, a heat conductive material that is the same as that of the main body portion 65A, or a separately formed member is press-fitted into the central opening 66. It may be integrated. The thin portion 65B may be made of a material different from that of the main body portion 65A. In the illustrated example, the thin portion 65B is formed so as to constitute a part of one heat transfer surface that is in close contact with the bottom wall 13 of the case 12, and between the central portion 51ba of the top surface 51b of the relay 51. A space is formed.
 従って、上述した各実施例と同様に、熱膨張時における頂面51b中央部51baでの応力が緩和される。この第6実施例によれば、第1実施例に比較して、ケース12の底壁13に対する伝熱面の面積が大きく得られる。つまり、熱伝導ブロック65は、薄肉部65Bにおいてもケース12と接触するので、熱伝達面積を拡大でき、リレー51の頂面51bの温度低下を促進することができる。 Therefore, as in the above-described embodiments, the stress at the central portion 51ba of the top surface 51b during thermal expansion is relieved. According to the sixth embodiment, the area of the heat transfer surface with respect to the bottom wall 13 of the case 12 can be increased compared to the first embodiment. That is, since the heat conduction block 65 is in contact with the case 12 even in the thin portion 65B, the heat transfer area can be increased and the temperature drop of the top surface 51b of the relay 51 can be promoted.
 なお、薄肉部65Bをリレー51側に片寄って設けることもできる。リレー51の頂面51bに接している構成であっても、薄肉部65Bは本体部65Aに比べて容易に変形し得ることから、熱膨張時の過大な応力が抑制される。 It should be noted that the thin portion 65B can be provided to be shifted to the relay 51 side. Even if the configuration is in contact with the top surface 51b of the relay 51, the thin-walled portion 65B can be easily deformed as compared with the main body portion 65A, so that excessive stress during thermal expansion is suppressed.
 次に、図29~図31に基づいて、熱伝導ブロック65の第7実施例を説明する。この第7実施例の熱伝導ブロック65は、本体部65Aが、第1実施例の熱伝導ブロック65と同様に、リレー51の頂面51bの外形寸法に対応した矩形の外形状を有するとともに、中央部分に矩形の中央開口部66を有しており、かつこの本体部65Aの中央開口部66に、相対的に変形が容易な第2の熱伝導部材として、本体部65Aとは異なる熱伝導性材料からなる低反力部65Cが設けられている。低反力部65Cは、本体部65Aに比較して弾性力つまり反力が小さな材料から構成されており、本体部65Aと同じ肉厚を有し、リレー51の頂面51bとケース12の底壁13との双方に接している。この低反力部65Cは、それぞれ異なる材料を用いて本体部65Aと一体に成形してもよく、あるいは別体に形成したものを中央開口部66内に圧入するなどしてもよい。 Next, a seventh embodiment of the heat conduction block 65 will be described with reference to FIGS. In the heat conduction block 65 of the seventh embodiment, the main body portion 65A has a rectangular outer shape corresponding to the outer dimension of the top surface 51b of the relay 51, similarly to the heat conduction block 65 of the first embodiment. As a second heat conductive member having a rectangular central opening 66 in the central portion and relatively easily deformed in the central opening 66 of the main body 65A, heat conduction different from that of the main body 65A. A low reaction force portion 65C made of a conductive material is provided. The low reaction force portion 65C is made of a material having a smaller elastic force, that is, a reaction force than the main body portion 65A, has the same thickness as the main body portion 65A, and has a top surface 51b of the relay 51 and a bottom surface of the case 12. It is in contact with both the wall 13. The low reaction force portion 65C may be formed integrally with the main body portion 65A using different materials, or may be formed separately and press-fitted into the central opening 66.
 この第7実施例によれば、頂面51b中央部51baの変位に対する反力は小さいので、やはり各実施例と同様に、熱膨張時における頂面51b中央部51baでの応力が緩和される。また、この第7実施例によれば、リレー51の頂面51bとケース12の底壁13とに対する伝熱面の面積が大きく得られる利点がある。 According to the seventh embodiment, since the reaction force against the displacement of the central portion 51ba of the top surface 51b is small, the stress at the central portion 51ba of the top surface 51b during thermal expansion is relieved as in each of the embodiments. Further, according to the seventh embodiment, there is an advantage that a large area of the heat transfer surface with respect to the top surface 51b of the relay 51 and the bottom wall 13 of the case 12 can be obtained.
 なお、上記の各実施例では、リレー51の端子74,75,76がパワーモジュール16の板状基部41の平面つまりリレー収容室62のリレー実装面62aへ向かって突出した姿勢でもって各リレー51が実装されているが、本発明はこれに限定されるものではなく、これら端子74,75,76が側方へ突出した姿勢でリレー51を取り付けた構成においても同様に適用することが可能である。 In each of the above embodiments, each relay 51 has a posture in which the terminals 74, 75, 76 of the relay 51 protrude toward the plane of the plate-like base 41 of the power module 16, that is, the relay mounting surface 62 a of the relay accommodating chamber 62. However, the present invention is not limited to this, and the present invention can be similarly applied to a configuration in which the relay 51 is mounted in a posture in which these terminals 74, 75, and 76 protrude to the side. is there.
 また本発明は、上記実施例の電動ブレーキブースタ用のモータ制御装置3に限らず、種々の電子制御装置に適用することができる。 The present invention can be applied not only to the motor control device 3 for the electric brake booster of the above embodiment but also to various electronic control devices.
 以上のように、本発明の電子制御装置は、電磁石および該電磁石によって開閉される接点部がリレーケース内に収容されてなるリレーと、作動状態で発熱する発熱部品と、上記リレーおよび上記発熱部品が実装される回路基板と、この回路基板を収容する外装部材と、上記外装部材の内側面に対向するリレーケースの一つの面と上記外装部材の内側面との間に配置された粘着性を有する熱伝導部材と、を備え、上記熱伝導部材は、上記リレーケースの上記の面の中央部を除いた領域で該面に接合されている。 As described above, the electronic control device of the present invention includes an electromagnet and a relay in which a contact portion opened and closed by the electromagnet is housed in a relay case, a heat generating component that generates heat in an operating state, the relay, and the heat generating component. A circuit board on which the circuit board is mounted; an exterior member that accommodates the circuit board; and an adhesive disposed between one surface of the relay case facing the inner surface of the exterior member and the inner surface of the exterior member. And the heat conductive member is joined to the surface in a region excluding the central portion of the surface of the relay case.
 これにより、極寒冷地などで作動が停止した後に、リレーケースの一部を熱伝導により速やかに温度低下させることができ、リレーケース内の水分による結露を接点部から離れたリレーケース内壁面に集めて、接点部での結露を抑制することができる。そして、作動時のリレー自体の発熱や発熱部品の熱などによってリレーケースが熱膨張したときに、リレーケースの面の中央部に作用する反力が小さいことから、その応力が小さくなり、破損やひび割れに至ることが抑制される。 As a result, the temperature of a part of the relay case can be quickly lowered by heat conduction after the operation stops in a very cold region, etc., and condensation due to moisture in the relay case is generated on the inner wall of the relay case away from the contact point. Collecting and dew condensation at the contact portion can be suppressed. And when the relay case is thermally expanded due to the heat generated by the relay itself or the heat-generating parts during operation, the reaction force acting on the center of the surface of the relay case is small. It is suppressed that it leads to a crack.
 好ましい一つの態様では、上記熱伝導部材は、上記の面の上記中央部に対応した中央開口部を有する矩形のフレーム状に構成されている。これにより、上記の面の中央部に向かって空間が形成され、熱膨張時の応力が抑制される。 In a preferred embodiment, the heat conducting member is configured in a rectangular frame shape having a central opening corresponding to the central portion of the surface. Thereby, a space is formed toward the central portion of the above surface, and stress during thermal expansion is suppressed.
 さらに、一つの態様では、上記中央開口部に、相対的に変形が容易な第2の熱伝導部材が設けられている。これにより、中央部の応力を抑制しつつ伝熱面の面積が拡大する。 Furthermore, in one aspect, a second heat conducting member that is relatively easily deformed is provided in the central opening. Thereby, the area of a heat-transfer surface expands, suppressing the stress of a center part.
 また好ましい一つの態様では、上記の面よりも小さな熱伝導部材が、上記の面の上記中央部を除いた一方に片寄った部位に接合されている。このような態様でも、中央部の応力の抑制が図れる。 In a preferred embodiment, a heat conducting member smaller than the above surface is joined to a portion of the above surface that is offset from one side except for the central portion. Even in such an embodiment, the stress in the central portion can be suppressed.
 また好ましい一つの態様では、2個のリレーが隣接して配置されており、これら2個のリレーの互いに近接した領域を覆うように、両者に跨って一つの熱伝導部材が配置されている。このような態様でも、中央部の応力の抑制が図れる。また、熱伝導部材の組付工数が削減する。 Also, in one preferred embodiment, two relays are arranged adjacent to each other, and one heat conducting member is arranged across both of the two relays so as to cover the adjacent areas. Even in such an embodiment, the stress in the central portion can be suppressed. In addition, the number of assembling steps for the heat conducting member is reduced.
 好ましい一つの態様では、上記熱伝導部材は、ゴム状材料もしくはシリコン系材料から形成されており、柔軟性を有している。 In a preferred embodiment, the heat conducting member is made of a rubber-like material or a silicon-based material and has flexibility.
 また好ましい一つの態様では、上記熱伝導部材は、5mm以上の肉厚を有するブロック状をなしている。 In a preferred embodiment, the heat conducting member has a block shape with a thickness of 5 mm or more.
 そして、好ましい一つの態様では、上記リレーの上記の面と、該面が対向する上記外装部材の内側面と、の間に、上記熱伝導部材が圧縮された状態に配設されている。 And in one desirable mode, the above-mentioned heat conduction member is arranged in the state where it was compressed between the above-mentioned surface of the above-mentioned relay, and the inner surface of the above-mentioned exterior member which this surface opposes.
 また好ましい一つの態様では、上記リレーは、上記の面とは反対側となる底面に、複数の端子を備えている。 In a preferred embodiment, the relay includes a plurality of terminals on the bottom surface opposite to the surface.
 本発明の電子制御装置は、例えば、車両に搭載される電動ブレーキブースタのモータ制御装置である。 The electronic control device of the present invention is, for example, a motor control device for an electric brake booster mounted on a vehicle.
 好ましい一つの態様では、上記リレーの上記の面は矩形をなし、この矩形の2つの対角線の交点は上記熱伝導部材に覆われていない。 In a preferred embodiment, the surface of the relay is rectangular, and the intersection of two diagonal lines of the rectangle is not covered by the heat conducting member.

Claims (11)

  1.  電磁石および該電磁石によって開閉される接点部がリレーケース内に収容されてなるリレーと、
     作動状態で発熱する発熱部品と、
     上記リレーおよび上記発熱部品が実装される回路基板と、
     この回路基板を収容する外装部材と、
     上記外装部材の内側面に対向するリレーケースの一つの面と上記外装部材の内側面との間に配置された粘着性を有する熱伝導部材と、
     を備え、
     上記熱伝導部材は、
     上記リレーケースの上記の面の中央部を除いた領域で該面に接合されている、電子制御装置。
    A relay in which an electromagnet and a contact portion opened and closed by the electromagnet are housed in a relay case;
    A heat-generating component that generates heat during operation;
    A circuit board on which the relay and the heat generating component are mounted;
    An exterior member that houses the circuit board;
    A heat conductive member having adhesiveness disposed between one surface of the relay case facing the inner surface of the exterior member and the inner surface of the exterior member;
    With
    The heat conducting member is
    An electronic control device joined to the relay case in a region excluding the central portion of the surface of the relay case.
  2.  上記熱伝導部材は、上記の面の上記中央部に対応した中央開口部を有する矩形のフレーム状に構成されている、請求項1に記載の電子制御装置。 The electronic control device according to claim 1, wherein the heat conducting member is configured in a rectangular frame shape having a central opening corresponding to the central portion of the surface.
  3.  上記中央開口部に、相対的に変形が容易な第2の熱伝導部材が設けられている、請求項2に記載の電子制御装置。 The electronic control device according to claim 2, wherein a second heat conducting member that is relatively easily deformed is provided in the central opening.
  4.  上記の面よりも小さな熱伝導部材が、上記の面の上記中央部を除いた一方に片寄った部位に接合されている、請求項1に記載の電子制御装置。 The electronic control device according to claim 1, wherein a heat conductive member smaller than the surface is joined to a portion of the surface that is offset from one side except the central portion.
  5.  2個のリレーが隣接して配置されており、これら2個のリレーの互いに近接した領域を覆うように、両者に跨って一つの熱伝導部材が配置されている、請求項1に記載の電子制御装置。 2. The electron according to claim 1, wherein two relays are arranged adjacent to each other, and one heat conducting member is arranged across both of the two relays so as to cover a region adjacent to each other. Control device.
  6.  上記熱伝導部材は、ゴム状材料もしくはシリコン系材料から形成されており、柔軟性を有する、請求項1~5のいずれかに記載の電子制御装置。 6. The electronic control device according to claim 1, wherein the heat conducting member is made of a rubber-like material or a silicon-based material and has flexibility.
  7.  上記熱伝導部材は、5mm以上の肉厚を有するブロック状をなしている、請求項1~6のいずれかに記載の電子制御装置。 The electronic control device according to any one of claims 1 to 6, wherein the heat conducting member has a block shape having a thickness of 5 mm or more.
  8.  上記リレーの上記の面と、該面が対向する上記外装部材の内側面と、の間に、上記熱伝導部材が圧縮された状態に配設されている、請求項1~7のいずれかに記載の電子制御装置。 The heat conduction member is disposed in a compressed state between the surface of the relay and the inner surface of the exterior member facing the surface. The electronic control device described.
  9.  上記リレーは、上記の面とは反対側となる底面に、複数の端子を備えている、請求項1~8のいずれかに記載の電子制御装置。 The electronic control device according to any one of claims 1 to 8, wherein the relay includes a plurality of terminals on a bottom surface opposite to the surface.
  10.  電子制御装置は、車両に搭載される電動ブレーキブースタのモータ制御装置である、請求項1~9のいずれかに記載の電子制御装置。 The electronic control device according to any one of claims 1 to 9, wherein the electronic control device is a motor control device of an electric brake booster mounted on a vehicle.
  11.  上記リレーの上記の面は矩形をなし、この矩形の2つの対角線の交点は上記熱伝導部材に覆われていない、請求項1~10のいずれかに記載の電子制御装置。 The electronic control device according to any one of claims 1 to 10, wherein the surface of the relay is rectangular, and an intersection of two diagonal lines of the rectangle is not covered by the heat conducting member.
PCT/JP2016/076751 2015-09-17 2016-09-12 Electronic control device WO2017047538A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1041678A (en) * 1996-07-25 1998-02-13 Hitachi Ltd Optical receiver
JP2009283255A (en) * 2008-05-21 2009-12-03 Panasonic Electric Works Co Ltd Relay
WO2011148665A1 (en) * 2010-05-24 2011-12-01 シャープ株式会社 Heat dissipation structure for electronic equipment
JP2014064419A (en) * 2012-09-21 2014-04-10 Hitachi Automotive Systems Ltd Electronic control device
JP2014079093A (en) * 2012-10-10 2014-05-01 Sanyo Electric Co Ltd Electric power supply unit, vehicle having the same, and power storage device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1041678A (en) * 1996-07-25 1998-02-13 Hitachi Ltd Optical receiver
JP2009283255A (en) * 2008-05-21 2009-12-03 Panasonic Electric Works Co Ltd Relay
WO2011148665A1 (en) * 2010-05-24 2011-12-01 シャープ株式会社 Heat dissipation structure for electronic equipment
JP2014064419A (en) * 2012-09-21 2014-04-10 Hitachi Automotive Systems Ltd Electronic control device
JP2014079093A (en) * 2012-10-10 2014-05-01 Sanyo Electric Co Ltd Electric power supply unit, vehicle having the same, and power storage device

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