WO2017024789A1

WO2017024789A1 - Communications device

Info

Publication number: WO2017024789A1
Application number: PCT/CN2016/074692
Authority: WO
Inventors: 刘剑
Original assignee: 中兴通讯股份有限公司
Priority date: 2015-08-12
Filing date: 2016-02-26
Publication date: 2017-02-16
Also published as: CN204994190U

Abstract

Disclosed is a communications device, comprising a housing and at least two boards. A main heat dissipation air duct is disposed on the front surface of the board. The main heat dissipation air duct is defined by two adjacent boards or a board and the housing. Each board comprises a circuit board and a support board, the support board being disposed at the back of the circuit board. A ventilation gap is formed between the circuit board and support board of at least one board, and an air shield structure is formed in the ventilation gap. At least one vent is provided on at least one of the support board and the circuit board. Air is blown into the ventilation gap, forming backflow via the air shield structure, and then is blown to a preset air-needed area via the vent, a path through which the air is blown being an auxiliary heat dissipation air duct. On the premise of keeping the structure space size of an existing communications device unchanged, the ventilation structure of a board is more flexibly set, the air volume of a specified area is balanced, and the heat dissipation air volume can be distributed according to needs.

Description

Communication device

Technical field

The present application relates to the field of communication devices, for example to a communication device.

Background technique

As the capacity of each board in a communication device increases, the integration of components on the board becomes higher and higher, and the area where the board needs to dissipate heat becomes more unpredictable. In the case where the internal structure of the communication device is limited, most of the existing boards are in the form of a front main air duct to solve the heat dissipation problem. As shown in Figure 1, because of the air duct form of the wind exiting the connector at the front panel, the board is prone to some problems. For example, some areas of the front air duct of the board are easy to form a low wind speed area. The device is too hot but does not have enough airflow to meet its cooling requirements. That is to say, the ventilation setting of the board is not flexible enough, so that the heat dissipation and ventilation of the board is limited, and the amount of heat dissipation cannot be properly allocated according to the required wind area.

Summary of the invention

The technical problem to be solved by the embodiments of the present invention is to provide a communication device to solve the problem that the heat dissipation air volume and the effective heat dissipation area of the single board in the communication device are relatively solidified in the related art, and cannot be flexibly set and cannot be allocated as needed.

To solve the above technical problem, an embodiment of the present invention provides a communication device, including: a casing and at least two boards, and a main heat dissipation air channel is disposed on a front surface of the single board, and the main heat dissipation air channel is composed of two An adjacent single board, or a single board is formed by enclosing the outer casing; the single board includes a circuit board and a pallet, the pallet is disposed at the back of the circuit board; at least one of the circuit board and the pallet of the single board Forming a ventilation gap, and forming a wind shield structure in the ventilation gap; at least one vent is disposed on at least one of the tray and the circuit board; wind is blown into the ventilation gap and via the The windshield structure forms a recirculation, and then is blown through the vent to a predetermined wind demand area, and the wind blown path is an auxiliary heat dissipation air passage.

In an embodiment of the invention, the wind-required area is an upper area of a designated component or a low wind speed area of the main cooling air duct.

In an embodiment of the invention, the distance between the windshield structure and the vent is greater than 0 cm and less than 10 cm.

In an embodiment of the present invention, the vent is obliquely penetrating through the circuit board or the pallet, and a distance from the air inlet of the vent to the air inlet surface is smaller than an air outlet of the vent to the The distance into the wind surface.

In an embodiment of the present invention, an opening of the air inlet of the vent in a direction parallel to the air inlet surface is an effective air inlet width, and a length of the wind shield structure in the direction is an effective wind shield. Width, the effective windshield width being greater than the effective air inlet width.

In an embodiment of the invention, the windshield structure is any one of the following structures:

An angled structure formed by contacting the circuit board and the pallet;

a wind deflector disposed in the ventilation gap;

At least a portion of the pallet that extends toward the circuit board and forms a slit or is coupled to the circuit board.

In an embodiment of the invention, when the windshield structure is a windshield, the veneer includes at least two of the windshields, and one of the farthest distances from the air inlet surface is removed. The projected area of the wind plate and the other wind deflectors in the air inlet direction is smaller than the area of the air inlet surface.

In an embodiment of the present invention, when the windshield structure is a windshield, the windshield and the circuit board or the pallet provided with the vent are in a direction close to the air inlet surface. The angle is greater than 0° and less than 90°.

The beneficial effects of the embodiment of the present invention are: on the premise that the structure space of the communication device is constant, on the basis of the main heat dissipation air channel, an auxiliary heat dissipation air channel is added, so that the wind is blown to the windproof structure through the ventilation gap, so that The wind forms a recirculation, and enters a specified component area or a low wind speed area through the vent, thereby increasing the amount of heat dissipation of the main heat dissipation air duct; in the embodiment of the invention, the ventilation structure of the single board is more flexible, and the air volume of the designated area is balanced, and The amount of heat dissipation is allocated as needed.

BRIEF abstract

1 is a schematic structural view of a heat dissipation air passage of a conventional single board;

2 is a schematic diagram of a heat dissipation air passage of a plurality of single boards according to an embodiment of the present invention;

3 is a front view of a single board provided with a wind deflector according to an embodiment of the present invention;

4 is a schematic rear view of a single board with a wind deflector according to an embodiment of the present invention;

FIG. 5 is a schematic structural diagram of a single board without a windshield according to an embodiment of the present invention; FIG.

6 is a schematic structural view of a single plate of an extension portion of a pallet according to an embodiment of the present invention;

FIG. 7 is a schematic structural diagram of a single board with multiple windshields according to an embodiment of the present invention; FIG.

Among them: 1, circuit board; 2, pallet; 3, windshield; 4, the main cooling air duct; 5, auxiliary cooling air duct; 6, low wind speed area; 7, designated component area; 8, vent; 9, into the wind.

Embodiments of the invention

The invention will now be described in detail by way of embodiments with reference to the accompanying drawings.

Embodiment 1:

The embodiment of the present invention provides a communication device. Referring to FIG. 2, the communication device includes three boards, each of which includes a circuit board 1 and a tray 2, and the tray 2 is disposed on the back of the circuit board 1. These boards are generally arranged in an overlapping manner. For example, multiple boards are inserted into different slots of the same backplane. The three boards form a total of three main cooling ducts and three auxiliary cooling ducts. The vents 8 of the upper two boards are disposed on the pallet, and the vents 8' of the lowermost board are disposed on the circuit board. . Different from the related art, the pallet 2 in the embodiment of the present invention not only functions to support the circuit board 1, but also needs to form a ventilation gap between the two, and the ventilation gap is the auxiliary heat dissipation wind in the embodiment of the present invention. A part of the road 5. In the ventilating gap, a wind deflector 3 is also provided, and the wind deflector 3 is arranged to cooperate with the

vent

8 or 8 ′ so that the wind passing through the venting gap forms a recirculation through the

vent

8 or 8 ′ as the wind demand area Service, so the windshield 3 can be located behind the vent 8 or 8'. The windshield 3 may be provided on the circuit board 1, or on the pallet 2, or at the same time connected to the circuit board 1 and the pallet 2, the position of which may be determined according to the position of the vent 8 or 8'.

For example, the venting port 8' and the windshield 3 cooperate with each other, and the auxiliary cooling air channel serves to serve the single board; for example, the venting port 8 and the wind deflecting plate 3 cooperate with each other, and the auxiliary cooling air channel functions as Adjacent next board service. The position of the vents can be determined according to the position of the wind-receiving area. Please refer to FIG. 3. The wind-receiving area refers to the upper area of the designated component area 7 or the low-wind speed area 6 of the main cooling air duct of the single board, and the vents. You can also set up any other places where you need to increase the amount of air or dissipate heat.

Figure 3-6 shows three typical boards with auxiliary air ducts for heat dissipation. Referring to Figures 3 and 4, respectively, a front and back schematic view of a single veneer, in each of which the windshield 3 is disposed on the pallet 2. Due to In this embodiment, only one windshield 3 is provided as the windshield structure. Therefore, in order to improve the wind shielding effect of the windshield 3, the projected area of the windshield 3 in the air inlet direction may be equal to the area of the air inlet surface 9. Although this type of setting requires separate components, the versatility is better.

FIG. 5 shows a single veneer structure directly formed by the contact between the circuit board 1 and the pallet 2 as a windshield structure, and the wind enters the main heat dissipation air duct 4 and the auxiliary heat dissipation air duct 5 from the air inlet surface 9 respectively. The wind of the auxiliary heat dissipating duct 5 passes through the ventilating gap until reaching the angled structure, and forms a reflow after encountering the obstruction, and then blows out from the vent 8 disposed before the angled structure to enter the main cooling duct of the adjacent single board. Therefore, the component area is cooled for the adjacent single board or the air volume is increased for the low wind speed area of the main heat dissipation duct. The arrangement of the vents 8 is as described in FIG. 2 and will not be described again here. This type of setup is low cost and does not require additional components.

FIG. 6 is a schematic diagram of a single board extending from a portion of the pallet 2 to the circuit board 1 to form a windshield structure. The arrangement of the vents 8 is as described in FIG. 2 and will not be described herein. This method also has the characteristics of low cost, and it is obvious that the process of the present mode is simpler than the above two methods.

In this embodiment, the distance between the wind deflector 3 and the vent 8 may be greater than 0 cm and less than 10 cm. This arrangement enables the wind to form a recirculation through the wind deflector 3 at a suitable distance.

The angle between the windshield 3 and the circuit board 1 or the tray 2 on which the vents are disposed is closer to 0° than 90° on the side close to the air inlet surface 9. This limitation can make the wind deflector 3 have a more recirculating effect. Ok, it is not a necessary condition for the wind to form a reflow.

In this embodiment, the vent 8 or 8' can be inclined through the circuit board 1 or the pallet 2, and the air inlet of the vent 8 or 8' is as far as possible away from the windshield 3, which is also to make the vent 8 or 8' The drainage of the wind is stronger.

Similarly, the opening length of the air inlet of the vent 8 or 8' in the direction parallel to the air inlet surface 9 is the effective air inlet width, and the length of the wind shield 3 in the direction is the effective wind width, when the effective speed is When the wind width is greater than the effective inlet width, more wind can be returned to the vent through the wind deflector 3.

Embodiment 2:

This embodiment introduces a case where a plurality of wind shield structures are disposed in one single board based on the first embodiment. In this embodiment, the main heat dissipation air channel, the auxiliary heat dissipation air channel, the venting position of the single-board, the installation position of the wind-proof structure, and the cooperation manner of the wind-proof structure and the venting port can all adopt the manner in the first embodiment. , no longer repeat them here. Because with the increase in the integration of components on the board, the circuit board layout is more The more precise it is, the windshield and the vent on the circuit board are not realistic on the one hand, and the wind is not returned well on the other hand, so the windshield and the vent of the embodiment are provided on the pallet. .

As shown in FIG. 7 , a schematic diagram of a single single-board structure in which all wind-shielding structures are windshields is provided. The vents 8 and the windshield 3 are respectively disposed on the pallet 2, and each vent 8 corresponds to one windshield 3 . Except for one windshield 3 farthest from the air inlet surface 9, the projected area of the other wind deflectors 3 in the air inlet direction is smaller than the area of the air inlet surface 9, and the height and width of the wind deflector 3 follow The distance between the air inlet surface 9 increases and increases. The reason for this setting is as follows: If the ventilation gap is completely blocked by the other windshield 3 except the last windshield 3, then, from the direction of the intake air, the rear of the windshield 3 which completely blocks the ventilation gap first is All the windshields 3 can not play the role of recirculating the wind, and correspondingly, it is impossible to realize the reasonable guidance of the heat dissipation air volume and the flexible distribution effect.

In addition, in the embodiment, the plurality of wind shield structures in one single board may be the same or different, and FIG. 7 adopts the form of a plurality of wind deflectors. In addition, the windshield structure may also be in the form of a plurality of portions extending from the pallet to the circuit board, or may be a combination of the windshield 3 and the angled structure and/or the extension of the pallet 2 to the circuit board 1. form.

The above is a detailed description of the present invention in connection with the embodiments, and it is not considered that the implementation of the invention is limited to the description. It will be apparent to those skilled in the art that a number of simple derivations or substitutions may be made without departing from the scope of the embodiments of the invention.

Industrial applicability

The communication device disclosed in the present application includes a casing and at least two veneers, and a main heat dissipating air passage is disposed on a front surface of the veneer, and the main heat dissipating air passage is surrounded by two adjacent veneers, or a single plate and an outer casing. The board includes a circuit board and a pallet, the pallet is disposed at a back of the circuit board; a ventilation gap is formed between the circuit board and the pallet of at least one of the boards, and the ventilation gap is Forming a windshield structure; providing at least one vent on at least one of the pallet and the circuit board; wind blowing into the venting gap and forming a recirculation via the windshield structure, and then passing through the venting The mouth blows to the preset wind demand area, and the path that the wind blows is the auxiliary heat dissipation air passage. Under the premise that the structure space of the existing communication device is constant, the ventilation structure of the single board is more flexible, and the air volume of the designated area is balanced, so that the heat dissipation air volume is allocated as needed.

Claims

A communication device includes: a casing and at least two veneers, wherein a main heat dissipating air passage is disposed on a front surface of the veneer, and the main heat dissipating air passage is surrounded by two adjacent veneers, or a single plate and an outer casing The board includes a circuit board and a pallet, the pallet is disposed at a back of the circuit board; a ventilation gap is formed between the circuit board of the at least one of the boards and the pallet, and the ventilation gap is Forming a windshield structure; providing at least one vent on at least one of the pallet and the circuit board, blowing wind into the venting gap and forming a recirculation via the windshield structure, and then passing through the The vent is blown to the preset wind demand area, and the path blown by the wind is the auxiliary heat dissipation duct.
The communication device according to claim 1, wherein said wind-required area is an upper area of a designated component or a low wind speed area of said main heat-dissipating duct.
The communication device according to claim 1, wherein a distance between said windshield structure and said vent is greater than 0 cm and less than 10 cm.
The communication device according to claim 1, wherein the vent is inclined through the circuit board or the pallet, and a distance from an air inlet of the vent to an air inlet surface is smaller than an air outlet of the vent The distance into the wind surface.
The communication device according to claim 1, wherein an opening of the air inlet of the vent in a direction parallel to the air inlet surface is an effective air inlet width, and a length of the wind shield structure in the direction is effective. a windshield width, the effective windshield width being greater than the effective airflow width.
A communication device according to any one of claims 1 to 5, wherein the windshield structure is any one of the following structures:

An angled structure formed by contacting the circuit board and the pallet;

a wind deflector disposed in the ventilation gap;

At least a portion of the pallet extending toward the circuit board and forming a slit or The board connection.
The communication device according to claim 6, wherein when said windshield structure is a windshield, said veneer includes at least two of said windshields, and a portion farthest from said windward surface is removed The windshield is described, and the projected area of the other wind deflectors in the air inlet direction is smaller than the area of the air inlet surface.
The communication device according to claim 6, wherein when said windshield structure is a windshield, said wind deflector and said circuit board or said pallet on which said vent is provided is adjacent to an air inlet surface The angle of the direction is greater than 0° and less than 90°.