WO2016108628A1

WO2016108628A1 - Biometric sensor module comprising film cover and method for packaging biometric sensor module

Info

Publication number: WO2016108628A1
Application number: PCT/KR2015/014496
Authority: WO
Inventors: 박철; 김재준
Original assignee: 주식회사 바이오메트릭스
Priority date: 2015-01-02
Filing date: 2015-12-30
Publication date: 2016-07-07
Also published as: KR20160084302A; KR101675465B1

Abstract

A biometric sensor module basically comprises a substrate, a biometric sensor, which is mounted on the substrate, and a signal connection unit, which is formed on the substrate so as to connect the biometric sensor and an external circuit, and is characterized by comprising an adhesive layer, which is formed on the biometric sensor, and a hard film layer, which is attached to the upper portion of the biometric sensor by the adhesive layer.

Description

Packaging method of biometric sensor module and biometric sensor module including film cover

The present invention relates to a biometric sensor module and packaging, and more particularly, to a method of simply packaging a biometric sensor module, such as fingerprint recognition or vein recognition.

In general, a biometric sensor is applied to a smart phone or a laptop, and biometric sensors include fingerprint recognition, vein distribution, iris recognition, and the like. Among them, contact biometrics such as fingerprint recognition, blood vessel distribution, and blood vessel detection are used in smartphones.

For example, the fingerprint sensor generates radio waves around the sensor, and when the finger touches the cover covering the fingerprint sensor chip, the generated radio wave recognizes the fingerprint pattern by using the difference in the signal received by the sensor. I'm using the method. There are various methods for recognizing fingerprints, such as optical measurement, but electrical measurement methods are widely used due to the advantage of miniaturization.

A typical fingerprint recognition sensor module using an electrical measurement method includes a chip-shaped sensor and a cover, which is a cover for covering the sensor, and as a fingerprint sensor is applied to a smartphone, unlike a conventional structure, it functions as a button or a peripheral device. It is often used by covering the colored cover to create a color-compatible design.

Conventional fingerprint sensor module uses a polymer resin, such as that used for a semiconductor chip as a cover. When the cover is formed of a polymer resin, a protective coating may be formed by coating a separate color paint with a spray or the like for decoration and coating the layer with a spray thereon. However, when forming the protective coating, it is difficult to control the thickness, and because it is spray coating directly on the polymer resin may increase the defective rate and increase the price. In addition, the sapphire substrate or glass substrate may be covered on the fingerprint sensor according to the design.

In general, the fingerprint sensor applied to a smartphone recognizes a fingerprint within about 0.5 millimeters in width and length, so the type and thickness of the cover significantly affect sensitivity and recognition rate. In addition, because the measurement method using electromagnetic waves, characteristics such as dielectric constant, thickness, and hardness of the cover may affect the sensitivity and recognition rate of the fingerprint sensor module.

In other words, in the manufacture of biometric sensor modules such as fingerprint sensors of the electrical measurement method, the type and packaging structure of the cover covering the sensor as important as the sensor is also important.

The present invention provides a biometric sensor module and packaging method that can facilitate the manufacturing and improve the sensitivity by using a sensor cover in the form of a film.

The present invention can decorate the coating on the film and form the electrode, it is possible to simply complete the packaging of the biometric sensor with the film, the biometric sensor module that can easily adjust the sensitivity of the sensor with a minimum thickness And a packaging method.

The present invention provides a biometric sensor module and packaging method capable of completing electrical connection and packaging through the process of attaching or adhering a film.

The present invention provides a biometric sensor module and a packaging method excellent in thickness control, color control, hardness control, and design flexibility.

The present invention provides a simple structure, a simple manufacturing method, a biometric sensor module and packaging method maintaining a low manufacturing cost.

According to an exemplary embodiment of the present invention, the biometric sensor module basically includes a substrate, a biometric sensor mounted on the substrate, and a signal connection portion formed on the substrate to connect the biometric sensor and an external circuit, and biometrics And a hard film layer attached to the upper part of the biometric sensor by the adhesive layer formed on the sensor and the adhesive layer.

Since the conventional biometric sensor module protects the surface of the sensor by molding compounding, defects due to thickness adjustment failure may occur due to thickness tolerances due to PCB thickness and die adhesive of the sensor. In order to solve this problem, a module by a conventional molding compounding is adjusted through thickness through grinding.

In addition, conventional molding compounding modules typically color the molding compound with a spray in the absence of a film or glass cover, in which case the color can be appropriately matched to a variety of colors other than black, white or ceramic. I can't. In particular, in recent years, it is not possible to respond to the demand for metal texture and color, and it is not easy to control the thickness of the module for them by forming various thicknesses for each color.

However, the present invention can solve all the problems caused by molding compounding because the hard film layer is adhered or adhered to the biometric sensor through film bonding, laminating, or transfer rather than molding compounding. That is, it is possible to reduce defects or manufacturing costs for the thickness control, not to go through the adjustment process by grinding, etc., it is possible to enable a variety of colors and metal texture representation.

In addition, it is possible to form a decoration layer of a variety of designs and colors possible on the film, and to form an electrode of various materials and forms can be used as a motion sensing electrode or outgoing electrode.

The hard film layer may be formed on the release film and then attached to the biometric sensor module through a transfer process, and the release film may include a base layer and a release coating layer, and the hard film layer may be formed on the release coating layer, and then be biometric. Can be transferred to the module. At this time, the release film made of a PET or urethane material or the like can be transferred to the hard film layer, and the release film can also be pre-molded, thereby partially packaging using a molding technique.

The decoration layer formed on the hard film layer may be formed on the top or bottom surface of the hard film layer, and may be provided as a general printing layer, an inorganic thin film layer, or a metal thin film layer. Decoration techniques include silkscreen printing, thin film coating with inorganic materials such as SiO ₂ , TiO ₂ , Si3N ₄ , metals such as aluminum, titanium and chromium or precious metals such as gold and silver, and edges It is also possible to decorate a metal thin film by partially etching it. Alternatively, the TiO ₂ white powder may be included in the hard film layer to form a white color or black to form a required color using only the hard film layer even without a separate decoration. In addition, printing and thin film formation can be formed on both upper and lower portions of the hard film layer, and multiple decorations can be formed on the hard film at once.

Since the thickness of the hard film layer through the release transfer is about 5 to 20 μm, the thickness of the entire module may be minimized compared to the conventional molding compound method when the hard film layer is adhered to the biometric sensor. In addition, even when using a general film, its thickness is about 100 μm and can be formed significantly thinner than in the prior art, and the conventional sapphire substrate cover can minimize the thickness of the cover to about 300 μm.

The release film may be formed in a predetermined shape before bonding the hard film layer to be released to be used as a cover of the sensor. In order to mold, the jig is first manufactured, and the jig may be formed by applying pressure while the film is mounted on the jig so that the release film has a certain shape. In some cases, the temperature is also increased to increase the stretching force of the film when pressure is applied. When raising the temperature, the jig is heated to raise the temperature, and the temperature may be generally 80 degrees or more, or a vacuum may be formed on one side of the jig to maintain the molded shape.

In this way, the fingerprint sensor attached to the electronic circuit board (PCB, FPCB) can be attached to the molded film. As a method of adhesion, a liquid adhesive such as epoxy is applied to the biometric sensor attached to the molded film or the electronic circuit board by dispensing a certain amount by dispensing. You can.

The curing method of the liquid adhesive may be heat curing, ultraviolet curing, natural curing using an epoxy adhesive, and the like. After attaching, the base layer of the release film and the release coating layer may be left only the hard film layer.

The biometric sensor module according to the present invention may further include a peripheral electrode provided around the biometric sensor. The peripheral electrode may be formed directly on the substrate, or may be formed together with the hard film layer and later attached to the biometric sensor module. Peripheral electrodes may also be provided in one or two or more, and may be functionally used for various purposes such as motion detection or signal transmission. Each of these peripheral electrodes may be provided in one or two or more for one purpose, or may be provided to implement two or more purposes with one peripheral electrode.

According to an exemplary embodiment of the present invention, a method of packaging a biometric sensor module includes a substrate, a biometric sensor mounted on the substrate, and a biosignal including a signal connection portion formed on the substrate to connect the biometric sensor and an external circuit. A method for packaging a recognition sensor module, the method comprising: providing an original substrate prior to cutting a substrate, and providing a plurality of biometric sensors and signal connections formed on the substrate; Providing a hard film on top of the plurality of biometric sensors; Attaching the hard film on the biometric sensor through an adhesive layer interposed between the biometric sensor and the hard film; And cutting the substrate on which the hard film is attached to produce the biometric sensor module including the substrate and the hard film layer.

According to the biometric sensor module and packaging method of the present invention, it is possible to facilitate the manufacturing using the sensor cover in the form of a film, not only can significantly reduce the thickness of the entire module, but also easy to adjust the thickness to improve the sensitivity Can be. That is, when attaching the hard film layer by a release transfer according to an embodiment, it is possible to form a thickness of the sensor cover of about 5-20 ㎛, it is possible to minimize the distance between the pixel of the fingerprint sensor and the finger fingerprint. Therefore, the recognition accuracy of the fingerprint sensor can be maximized.

According to the biometric sensor module and packaging method of the present invention, the decoration coating and the electrode can be formed on the film, it is possible to simply complete the packaging of the biometric sensor with the film, the sensor can be various colors, textures and designs It can be implemented in modules, and it is also possible to simply implement various functions that require electrodes.

According to the biometric sensor module and packaging method of the present invention, since the electrical connection and packaging can be completed through the process of attaching or adhering the film, it is possible to maintain a simple structure, a simple manufacturing method, a low manufacturing cost.

According to the biometric sensor module and packaging method of the present invention, in addition to the excellent effect in the thickness control (Thickness control), color control (Hardness control) and design flexibility (Design Flexibility) possible in the film Can be.

1 is a view for explaining a biometric sensor module according to an embodiment of the present invention.

2 to 5 are views for explaining the manufacturing process of the biometric sensor module according to an embodiment of the present invention.

6 is a view for explaining a biometric sensor module according to an embodiment of the present invention.

7 to 9 are views for explaining a packaging method of a biometric sensor module according to an embodiment of the present invention.

10 is a view for explaining a packaging method of a biometric sensor module according to an embodiment of the present invention.

11 is a view for explaining a biometric sensor module according to an embodiment of the present invention.

12 is a view for explaining a packaging method of a biometric sensor module according to an embodiment of the present invention.

13 is a view for explaining a biometric sensor module according to an embodiment of the present invention.

14 is a view for explaining a biometric sensor module according to an embodiment of the present invention.

15 to 18 are views for explaining a packaging method of a biometric sensor according to an embodiment of the present invention.

19 and 20 are views for explaining a biometric sensor module according to an embodiment of the present invention.

21 and 22 are views for explaining a biometric sensor module according to an embodiment of the present invention.

23 is a view for explaining a biometric sensor module according to an embodiment of the present invention.

24 and 25 are views for explaining a biometric sensor module according to an embodiment of the present invention.

26 to 28 are views for explaining a biometric sensor module according to an embodiment of the present invention.

29 to 31 are views for explaining a biometric sensor module according to an embodiment of the present invention.

32 is a view for explaining a packaging method of a biometric sensor module according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited or limited by the embodiments. For reference, in the present description, the same numbers refer to substantially the same elements, and may be described by referring to the contents described in the other drawings under these rules, and the contents determined to be obvious to those skilled in the art or repeated may be omitted.

For reference, hereinafter, the biometric sensor will be described based on a fingerprint sensor, but other recognition sensors using an electric touch sensor, for example, a vein distribution sensor, may be easily understood by those skilled in the art with reference to the embodiment of the present invention. It can be carried out.

1 is a view for explaining a biometric sensor module according to an embodiment of the present invention, Figures 2 to 5 are views for explaining a manufacturing process of a biometric sensor module according to an embodiment of the present invention.

Referring to FIG. 1, the illustrated biometric sensor module 100 is for fingerprint recognition and connects a substrate 110, a sensor 130 mounted on the substrate 110, and a sensor 130 to an external circuit. In order to include a signal connection portion 120 formed on the substrate 110, the hard film layer 200 is attached to the upper portion of the sensor by the adhesive layer 140 and the adhesive layer 140 formed on the sensor 130 It features.

In the present specification, the substrate 110 may be a printed circuit board or a flexible circuit board, and the sensor 130 may be mounted on the substrate 110 by a wiring or SMT method or other connection method, and may be an external circuit, for example. The signal connection unit 120 may be used to be electrically connected to the central processing unit or AP of the smartphone. Of course, the substrate 110 may be equipped with a microchip for the basic operation and signal processing of the sensor. In addition, in the present specification, the 'signal connecting portion is formed on the substrate' will include a case in which the signal connecting portion is formed on the surface of the substrate as well as formed inside the substrate or between layers in a multilayer structure.

In the present specification, the hard film layer may use PET, PC, PMMA, a film including silica, and the like, and the hard film layer maintains a surface that is not deformed or damaged even when it comes into contact with a body. This may be understood as a relatively hard material or film that maintains a hard coating surface.

In the conventional module assembly method by molding compounding, the cover is formed directly on the sensor, whereas the hard film layer 200 of the present embodiment is not directly formed on the substrate 110 and the sensor 130, There is a difference in that it is attached to the substrate 110 and the sensor 130 after being manufactured separately. Since the hard film layer 200 may be formed to have a thickness of about 5 to 20 μm, the thickness of the sensor module 100 may be kept significantly thin even when the thickness of the adhesive layer 140 is considered.

In addition, if the hard film layer 200 includes a TiO ₂ white powder to give a white color or mix black pigments to form a black color, the hard film layer 200 may form a required color even without a separate decoration.

Referring to FIG. 2, when the sensor cover is formed of a film, a plurality of sensor modules may be packaged on a single substrate 1101, and the sensor module of the same quality may be produced even after the film is attached and cut. There is an advantage.

As shown, the substrate 1101 may also be a printed circuit board or a flexible circuit board, the wire for the circuit configuration. A plurality of sensors 130 are mounted on the base substrate 1101, and an electrode line may be formed as a signal connection unit 120 on the top, bottom, or inside of the base substrate 1101 for connection with an external circuit.

Referring to FIG. 3, after the adhesive 1401 is coated on the substrate 1101 and the sensor 130, a release film may be attached thereto. The release film includes a base layer 210, a release coating layer 212 formed on the base layer 210, and a hard film 2001 formed on the release coating layer 212. In recent years, it is possible to form a film having a thickness of 20 μm or less, but when the hard film 2001 is formed on a relatively thick PET or urethane base film or base layer 210, various film processing methods can be used on the upper surface thereof. It is advantageous in that the thin hard film 2001 can be easily handled.

Referring to FIG. 4, an adhesive layer 1401 may be formed through a curing process after attaching a release film. The hard film 2001 may be adhered onto the base substrate 1101 by the adhesive layer 1401. In this embodiment, the adhesive layer 1401 is cured together with the hard film 2001 on the base substrate 1101, but in some cases, the adhesive layer 1401 is first flattened to form a resin protective layer, and then the hard film ( 1401 may be attached.

The method of forming the adhesive layer or the curable protective layer may be a two-component or one-component type, and may be made into a solid form by applying an epoxy or the like to the upper portion of the substrate and the sensor in a liquid state and then curing.

Referring to FIG. 5, it is possible to separate the base layer 210 and the release coating layer 212 from the hard film 2001. As a result, the hard film 2001 having a thickness of 20 μm or less remains on the base substrate 1101, and the sensor module 100 may be cut to a designed size.

In this embodiment, the sensor module 100 is cut after separating the release film, but in another embodiment, after cutting together without separating the release film, it is also possible to separate the release film after completing the post-processing later. .

6 is a view for explaining a biometric sensor module according to an embodiment of the present invention, Figures 7 to 9 are views for explaining a packaging method of a biometric sensor module according to an embodiment of the present invention.

Referring to FIG. 6, the biometric sensor module 300 is for fingerprint recognition and includes a substrate 310, a sensor 330 mounted on the substrate 310, and a substrate for connecting an external circuit with the sensor 330. A signal connection part 320 formed on the 310 is included, and the adhesive layer 340 formed on the sensor 330 and the hard film layer 200 attached to the upper part of the sensor by the adhesive layer 340 are provided, and the hard film A decoration layer 220 is formed on the bottom of the layer 200.

The substrate 310 is a printed circuit board on which a sensor 330 is mounted, and the sensor 330 is electrically connected to the signal connection part 320 of the substrate 310 by a gold wire. In detail, the sensor 330 may be connected to an external circuit through a via hole of the signal connection part 320 that vertically penetrates the bonding electrode of the signal connection part 320 and the substrate 310 through wire bonding.

The hard film layer 200 and the decoration layer 220 are integrally formed and attached to the sensor module 300 through the adhesive layer 340. The color of the sensor module 300 may be determined by the decoration layer 220, and since the decoration layer 220 may be formed by a conventional film processing method, the color and design may be formed in a desired color and design. .

For example, the decoration layer 220 may be provided as a printing layer, an inorganic thin film layer or a metal thin film layer. Decoration techniques include silkscreen printing, thin film coating or multi-coating with inorganic materials such as SiO ₂ , TiO ₂ , and Si ₃ N ₄ , or coating metals such as aluminum, titanium, chromium or precious metals such as gold and silver. It is also possible to decorate the metal thin film by partially etching the edges, leaving only the edges.

In addition, the decoration layer 220 is formed on the bottom surface of the hard film layer 200, but in some cases may be formed on the upper surface. Printing and thin film formation may be formed on both the top and bottom of the hard film layer 200, and a plurality of decorations may be simultaneously formed on one hard film layer.

Referring to FIG. 7, the substrate 3101 is a printed circuit board or a flexible circuit board. A plurality of sensors 330 are mounted on the substrate 3101, and the substrate 3101 is connected to an external circuit. Signal connections 320 for the sensor 330 are formed on the top, bottom or inside of each.

Referring to FIG. 8, after the adhesive 3401 is coated on the substrate 3101 and the sensor 330, a release film may be attached thereto. The release film includes a base layer 210, a release coating layer 212 formed on the base layer 210, and a hard film 2001 before cutting formed on the release coating layer 212. When using a relatively thick PET or urethane base film or base layer 210, various film processing methods can be used while forming the hard film 2001, and the thin hard film 2001 can be easily handled. have.

The base layer 210 may be provided using a PET film or a urethane film, and may use a film having a thickness of about 25 μm to 200 μm. In addition, the release coating layer 212 may be provided using a silicone-based resin, may be formed to a thickness of about 5 ~ 10㎛, and may be separated from the hard film 2001 later.

The hard film 2001 may be formed using an ultraviolet curable acrylic resin, or the like, and may be formed to a thickness of 5 to 20 μm. The hard film 2001 may be formed of a transparent material because the decoration layer 2201 is used. However, in some cases, the hard film 2001 itself may be mixed with dyes or pigments to produce colors such as black, white, and color. You can also pay.

In addition, a decoration layer 2201 is formed on the bottom of the hard film 2001 before being cut. The decoration layer 2201 may be formed on the whole or part of the top surface of the hard film 2001, and may be provided as a printing layer, an inorganic thin film layer, or a metal thin film layer. The decoration layer 2201 may be formed under the hard film 2001, may be printed by silkscreen, or may be formed using an inorganic thin film coating such as SiO ₂ , TiO ₂ , Si ₃ N ₄ , aluminum, Metal thin film decoration of a desired shape may be formed by coating a thin film of a metal such as titanium or chromium or a precious metal such as gold or silver, and partially patterning only the edge portion. When coating a metal thin film or inorganic thin film of about 0.01 ~ 0.2㎛ thickness, such as aluminum or chromium, it may be coated alone, but after the metal thin film or inorganic thin film coating may be printed by silk screen decoration.

Referring to FIG. 9, after the release film is attached using an adhesive 3401 such as epoxy, the hard film 2001 may be completely adhered onto the substrate 3101 through a curing process. In addition, the base layer 210 and the release coating layer 212 may be separated from the hard film 2001. In addition, after separating the release film, by cutting the sensor module, it is possible to manufacture the sensor module 300 shown in FIG.

As such, the adhesion and separation method using the base layer, the release coating layer, the hard film, and the decoration layer using the release film may be similarly applied to other structures afterwards.

10 is a view for explaining a packaging method of a biometric sensor module according to an embodiment of the present invention, Figure 11 is a view for explaining a biometric sensor module according to an embodiment of the present invention.

Referring to FIG. 10, a release film including a base layer 2102, a release coating layer 2122, a hard film 2011, and a decoration layer 2211 may be preformed. In the present embodiment, in order to reduce the distance between the upper surface of the hard film layer and the pixel of the sensor, it can be formed concave at the touched portion.

To this end, the release film may form curved regions through some molding. As shown in FIG. 11, the gap between the sensor 330 and the upper surface of the module can be narrowed by this structure, and problems such as alignment can be solved when mounting.

Jig may be used to mold the release film. For example, by applying pressure while the release film is mounted on the jig, the release film may be formed to have a certain shape. In some cases, the temperature may be raised to about 80 degrees or more in order to increase the stretching force of the film when pressure is applied, and a vacuum may be formed on one side of the jig to maintain the molded shape.

After attaching the molded release film using an adhesive 3411 such as epoxy, the hard film 2011 may be completely adhered onto the base substrate 3101 through a curing process. In addition, the base layer 2102 and the release coating layer 2122 may be separated from the hard film 2011. In addition, after separating the release film, by cutting the sensor module, it is possible to manufacture the sensor module shown in FIG.

Referring to FIG. 11, a portion of the sensor module where the finger touches is concave to minimize the distance from the sensor 330. In addition, since molding is performed to avoid the structure of the surrounding wire bonding, it is possible to further reduce the thickness of about 30 to 50 µm corresponding to the thickness of the wire bonding.

In addition, after cutting, the substrate 310 may be mounted on the flexible circuit board 312, and may be connected to an external circuit through the signal line 322 of the flexible circuit board.

12 is a view for explaining a packaging method of a biometric sensor module according to an embodiment of the present invention, Figure 13 is a view for explaining a biometric sensor module according to an embodiment of the present invention.

Referring to FIG. 12, a release film including a base layer 2103, a release coating layer 2123, a hard film 2021, and a decoration layer 2221 may be preformed. In this embodiment, the side of the hard film layer may be molded to bend to partially receive the side of the sensor.

To this end, the release film may form curved regions through some molding. This structure makes it possible to determine the general shape of the sensor module in the film processing step. In addition, it is possible to implement a variety of shapes that were difficult in the conventional sensor module manufacturing method. For example, when the sensor module has an irregular shape such as an L-shaped, in the conventional manufacturing method, only the sensor module or the module and the substrate should be cut in an L-shaped shape, but according to the present embodiment, the release film covering the sensor module There is an advantage in that it is possible to simply form the desired shape simply by molding the shape of the L-shaped.

Jig can also be used to mold the release film. For example, by forming a pressure, temperature, or vacuum in a state in which the release film is mounted on the jig, the release film may be formed to have a certain shape.

After attaching a molded release film using an adhesive 341 such as epoxy, the hard film 2021 may be completely adhered onto the base substrate 3101 through a curing process. The base layer 2103 and the release coating layer 2123 may be separated from the hard film 2021 and the decoration layer 2221. In addition, after separating the release film, by cutting the sensor module, it is possible to manufacture the sensor module shown in FIG.

Referring to FIG. 13, the side surface of the sensor module may be defined by a release film, and the side shaping and finishing may be completed together because the side surface of the sensor module is protected by the hard film layer 342 at the same time as the adhesion. In addition, according to the design of the smart phone can be ordered in a variety of shapes and orders of the sensor module, the shape of the release film or the general film can be defined in this way can be supplied to the sensor module of various designs.

14 is a view for explaining a biometric sensor module according to an embodiment of the present invention, Figures 15 to 18 are views for explaining a packaging method of a biometric sensor according to an embodiment of the present invention.

Referring to FIG. 14, the illustrated biometric sensor module 500 is for fingerprint recognition, and connects an external circuit with a substrate 510, a sensor 530 mounted on the substrate 510, and a sensor 530. In order to include a signal connecting portion 520 formed on the substrate 510, the adhesive layer 540 formed on the sensor 530 and the hard film layer 400 is attached to the upper portion of the sensor by the adhesive layer 540. On the bottom of the hard film layer 400, the outgoing electrode 430 is formed as a surrounding electrode, and the outgoing electrode connection part 440 is formed on one side of the outgoing electrode 430, thereby forming a signal formed on the substrate 510. It is connected to the connection terminal 522.

Referring to FIG. 15, the substrate 510, the signal connection unit 520, and the sensor 530 before coupling with the hard film layer 400 are shown, and the signal connection terminal 522 is also a member of the signal connection unit. It may be directly connected to the sensor 530 or the chip of the substrate, or may be connected to an external circuit through the signal connection unit 520.

The sensor 530 includes a plurality of tens of micrometer-sized fingerprint recognition pixel electrodes, each pixel electrode may image the curvature of the fingerprint to recognize the shape of the fingerprint and convert it into fingerprint recognition data.

In the case of forming the sensor cover in a film in this embodiment, as shown, a film may be provided for an individual sensor, but as described in FIGS. 2 and 7, packaging a plurality of sensor modules on a single substrate In addition, the method of producing a sensor module by cutting the film after attaching the same can also be applied.

Referring to FIG. 16, the hard film layer 400 attached to the substrate 510 may be formed of an insulating material, and may be formed of a transparent material or supplied as a material having color alone. The outgoing electrode 430 may be formed on the hard film layer 400.

The outgoing electrode 430 may be formed of a metal or other conductive material, and may serve to transmit an electrical signal for fingerprint recognition. The outgoing electrode 430 may be formed on the top surface of the hard film layer 400 to be exposed to the outside. However, the outgoing electrode 430 is formed on the bottom surface of the hard film layer 400 as in this embodiment. This wear can also be prevented.

The outgoing electrode 430 may be provided in a closed curve shape so as to be formed around the sensor 530 in the sensor module. The outgoing electrode 430 may be provided in various shapes such as a circle, a polygon, and an irregular shape in addition to the rectangle. Of course, the outgoing electrode may be provided in an open figure shape, it is also possible to provide two or more.

The transmitting electrode 430 may serve to transmit a radio signal for fingerprint recognition, but may also serve as a decoration of the metal texture. To this end, various metal thin films such as aluminum, titanium and chromium or precious metals such as gold and silver may be coated on the film as a metal, and the hard film layer 400 is a structure that protects the metal thin film. Various metal decoration effects can be provided.

One side of the outgoing electrode 430 is connected to the outgoing electrode connector 440, and the outgoing electrode connector 440 is connected to the signal connection terminal 522 of the substrate during packaging, and receives an electrical signal from the substrate 510. To transmit to the outgoing electrode 430. In this embodiment, the outgoing electrode connector 440 may be formed in the same process as the outgoing electrode 430.

The hard film layer 400 and the outgoing electrode 430 may be adhered to the substrate 510 by themselves, but as shown in FIG. 17, the hard film layer 400 and the outgoing electrode 430 may be formed on the release film, that is, the base layer 410 and the release coating layer 412. There is a number. Although the hard film layer 400 may be laminated to a substrate by directly producing a film having a thickness of 20 μm or less, the hard film layer 400 is formed on a relatively thick PET or urethane base film or base layer 410. If the lower surface, a variety of film processing methods can be used on the upper surface, there is an advantage that the handling of the thin hard film layer 400 is easy.

Referring to FIG. 18, an adhesive layer 540 may be formed through a curing process after attaching a release film. The hard film layer 400 may be adhered to the substrate 510 by the adhesive layer 540. In addition, the outgoing electrode connecting portion 440 and the signal connecting terminal 522 are located at a corresponding position up and down, and may be electrically connected to each other by a conductive adhesive layer 542 using a conductive adhesive.

The base layer 410 and the release coating layer 412 can be separated from the hard film layer 400, and on the substrate 510, the hard film layer 400 and the outgoing electrode 430 of about 20 μm or less are used as a protective cover. The process of electrically connecting the outgoing electrode 430 through the conductive adhesive layer 542 may be completed at the same time.

That is, in this embodiment, since the outgoing electrode 430 is directly formed on the hard film layer 400, it is not necessary to use a separate metal ring as in the prior art, thereby reducing the manufacturing cost of the sensor module and protecting the sensor module. When forming the cover to form and connect to the outgoing electrode 430, the conventional process of assembling the metal ring after forming the cover can be omitted, and the overall manufacturing process can be simplified.

In the manufacture of the sensor module in the manufacturing of the cover according to the present invention directly using the film on which the outgoing electrode is formed, and the production of the release film in which the outgoing electrode is formed, but the base layer is removed and the hard film layer and the outgoing electrode substrate The difference between the methods of adhering to is the difference in the thickness of the cover.

In general, the film of PET material as a film used for the cover film is produced about 25㎛ considering the handleability, etc., and considering the additional coating to prevent scratch, the coating should be coated in the range of about 10㎛ For this reason, it is difficult to produce the total thickness of about 25 μm or less. However, when the release film is used, since the thickness of the hard film layer 400 can be made thinner than about 10 to 20 μm, the thickness of the cover can be reduced by about 10 μm or more than when using a general film. . Therefore, the method using the release film can more easily adjust the thickness of the cover to have the optimum sensitivity characteristics in the fingerprint sensor module.

19 and 20, the outgoing electrode 630 is formed on the hard film layer 600, and the hard film layer 600 and the outgoing electrode 630 have a convex shape corresponding to the shape of the sensor module. It is molded.

In addition, the hard film layer 600 is not formed separately from the outgoing electrode connecting portion to be electrically connected to the signal connection terminal 722 of the substrate 710, the outgoing electrode 630 by making the outgoing electrode 630 wide May be electrically connected to the signal connection terminal 722. The outgoing electrode 630 and the signal connection terminal 722 may be electrically connected to each other by the conductive adhesive layer 742 separately from the adhesive layer 740.

Compared to the previous embodiment, the widely extended outgoing electrode 630 may play a role of decorating a metal texture in addition to transmitting a radio signal for fingerprint recognition. For this purpose, a metal can be manufactured by coating various metal thin films such as aluminum, chrome, gold, or silver on the film, and the hard film layer 600 can protect various metal thin films, thereby providing various metal decoration effects. have.

21 and 22, the sensor module includes a substrate 710, a sensor 730, a signal connector, a signal connector 722, an adhesive layer, a conductive adhesive layer 742, a hard film layer 600, and an outgoing electrode ( 630, the description of which may refer to the description of the previous embodiment.

However, in the sensor module of the present embodiment, the micro electrode pattern 650 is formed on the same surface as the outgoing electrode 630 in the hard film layer 600, and the micro electrode pattern 650 improves the sensitivity of the sensor 730. For the purpose of being separated from one another. The microelectrode pattern 650 is preferably formed at a smaller size and narrower distance than the pixel electrode 732 of the sensor 730.

In the present embodiment, the microelectrode pattern 650 is formed in a quadrangular shape, but is not limited thereto. The microelectrode pattern 650 may be formed in various shapes such as a circle, an ellipse, a polygon, or an irregular shape, and the size thereof does not prevent the normal detection of the sensor 730. It can be formed in a size of about 0.1 ~ 100 ㎛ in the line. For reference, if the pattern is too small, the yield and manufacturing cost increases, and if the pattern is too large, it may cause a decrease in the sensitivity of the sensor.

In the present embodiment, the microelectrode pattern 650 is provided with the same metal material as that of the outgoing electrode 630. However, in some cases, the microelectrode pattern 650 may be formed of an electrical material such as an oxide electrically conductive material such as ITO, ZTO, PRDOT, or an organic material. All conductive materials may be used, and a separate decoration layer may be interposed between the transmitting electrode 630 and the hard film layer 600 for this case.

Referring back to the drawing, the sensor 730 is composed of a pixel electrode 732 of several tens of micrometers in size. In the hard film layer 600, a fine electrode pattern 650 is formed in the outgoing electrode 630 corresponding to the pixel electrode 732. For reference, although the microelectrode pattern is formed on the bottom surface of the hard film layer in the present embodiment, both the top surface and the bottom surface may be formed, and may be formed on one surface or both surfaces.

The microelectrode pattern 650 is separated from each other and electrically insulated from each other, and the microelectrode pattern 650 delivers an image of a fingerprint at a smaller and denser resolution than the pixel electrode 732, thereby providing an electrical connection between the fingerprint and the sensor 730. It can increase the adhesion and improve the accuracy of fingerprint recognition.

In order to prevent the interference between the pixel electrodes 732 of the sensor, the microelectrode pattern 650 is preferably formed smaller than the distance between the pixel electrodes 732, and randomly selects the microelectrode pattern 650. Even if the pixel electrode 732 is not connected by the fine electrode pattern 650 is preferable. For example, if the distance between the pixel electrodes is about 0.05mm, the width of the microelectrode pattern should be designed within 0.05mm, and preferably made up to 0.001 mm width so that multiple microelectrode patterns can correspond to one pixel electrode. It may be desirable to. Of course, it is also possible to arrange one microelectrode pattern corresponding to one pixel electrode to correspond, but in this case, it may be difficult to manufacture because the arrangement of the microelectrode pattern and the arrangement of the pixel electrodes must be completely matched.

For reference, not all microelectrode patterns 650 need to be the same in size or shape, and the metal types for the microelectrode patterns 650 are chromium, aluminum, nickel, titanium, gold, platinum, ruthenium, palladium, silver, and the like. Most metals can be used, and in some cases alloys can be used. The thickness of the metal thin film for the microelectrode pattern 650 is usually about 0.01 ~ 0.5 ㎛ or various other thicknesses are possible.

The microelectrode pattern 650 may be variously applied according to the type of the sensor 730. For example, in the case of a surface contact method, an area corresponding thereto may be provided. In the case of a swipe method, the fine electrode patterns 650 may be formed in a single line.

Referring to FIG. 23, the sensor module includes a substrate 710, a sensor 730, a signal connector, a signal connector 722, an adhesive layer, a conductive adhesive layer 742, a hard film layer 600, an outgoing electrode 630, and the like. The microelectrode pattern 650 may be included, and a description thereof may be referred to the description of the previous embodiment.

However, in the sensor module of the present embodiment, the microelectrode pattern 650 is formed different from the outgoing electrode 630 in the hard film layer 600. The microelectrode pattern 650 is to improve the sensitivity of the sensor 730 and is separated from each other, and the microelectrode pattern 650 is smaller than the pixel electrode 732 of the sensor 730.

In the present exemplary embodiment, since the microelectrode pattern 650 is formed on a different surface from the outgoing electrode 630, the microelectrode pattern 650 may be formed of another material and may have a physical structure required for fingerprint recognition. In addition, when the microelectrode pattern 650 is exposed to the outer surface, a separate protective layer may be required.

24 and 25, the illustrated biometric sensor module 900 is for fingerprint recognition, and includes a substrate 910, a sensor 930 mounted on the substrate 910, a sensor 930, and an external circuit. It includes a signal connection unit 920 formed on the substrate 910 and the peripheral sensor 930 formed around the sensor 930 to connect the. Four peripheral electrodes 941 to 944 are formed around the sensor 930.

The adhesive layer interposed between the hard film layer 800 and the substrate 910 may be fixed to each other. The hard film layer 800 is bonded onto the substrate 910 in the form of a release film, and the release film is in the order of the base layer 810, the release coating layer 812, the hard film layer 800, and the decoration layer 820. Are stacked.

The substrate 910 may transmit and receive necessary data with an external circuit through the signal connection unit 920, and an auxiliary substrate or a pedestal 912 may be provided as a bottom surface of the substrate 910, and when a button function is used, a dome switch Can interact with the back.

The peripheral electrodes 941 to 944 may be electrically connected to an external circuit through the signal connector 920, and may have various functions according to the design of the software.

As a first example, the peripheral electrodes 941 to 944 may be used as motion sensing electrodes. When the peripheral electrodes 941 to 944 are used for the purpose of motion detection, the functions of the biometric sensor may be assisted or used independently. For example, a sleeping user's fingerprint can be used to unlock a smartphone or a specific lock regardless of the user's intention, but if the user inputs an additional pattern that only the user knows, the security function can be further improved. Therefore, it is possible to use the peripheral electrodes 941 to 944 as a motion sensing electrode, and for this purpose, a plurality of peripheral electrodes 941 to 944 may be used around the sensor 930.

As a second example, the peripheral electrodes 941 to 944 may be used as outgoing electrodes. A plurality of peripheral electrodes (941 ~ 944) that can operate independently of each other can send a signal in sequence, the sensor 930 is synchronized with the peripheral electrodes (941 ~ 944) acting as the outgoing electrode is the outgoing electrode When the signals are sequentially transmitted, the signals may be sequentially received according to the signals.

Since the sensor 930 includes a plurality of pixel electrodes, even if signals from the same source electrode are generated, signals having different sensitivity are received according to the position of the pixel electrode, which is represented by nonuniformity of signal strength. In order to solve this problem, two or more outgoing electrodes send signals while maintaining a constant interval, and each pixel electrode of the sensor 930 receives them, thereby measuring and correcting a signal according to a distance between the outgoing electrode and the pixel electrode.

Examples of the use of a plurality of peripheral electrodes are examples of the motion sensing electrode and the outgoing electrode, but various other applications are possible, and the signals from the peripheral electrodes may be used as one electrode or may be used as different electrodes. . In addition, the use of the motion detection and the outgoing electrode may be implemented in the same peripheral electrode, it may be divided into four peripheral electrodes to be used for different purposes. Those skilled in the art will be able to utilize a variety of peripheral electrodes.

26 to 28, the illustrated biometric sensor module is for fingerprint recognition and includes a substrate 910, a sensor 930, a signal connection unit 920, and a hard film layer 800. However, two

peripheral electrodes

831 and 832 and peripheral

electrode connecting portions

841 and 842 are formed on the hard film layer 800 instead of the substrate 930, and the peripheral electrode connecting portion ( In response to 841 and 842, two

signal connection terminals

921 and 922 are formed to face each other. The

peripheral electrode connectors

841 and 842 and the

signal connector

921 and 922 are connected to each other through a conductive adhesive layer.

The adhesive layer interposed between the hard film layer 800 and the substrate 910 may be fixed to each other. As in the previous embodiment, the hard film layer 800 may be adhered to the substrate 910 in the form of a release film, the release film is laminated in the order of the base layer, the release coating layer and the hard film layer 800.

As described above, the

peripheral electrodes

831 and 832 may be electrically connected to an external circuit through the signal connection unit 920, and may have various functions according to the design of the software.

As a first example, the

peripheral electrodes

831 and 832 may be used as motion sensing electrodes. When the

peripheral electrodes

831 and 832 are used for the purpose of motion detection, the functions of the biometric sensor may be assisted or used independently. As shown in the figure, when used in two, it is possible to detect the left and right motion, in the case of three or more it may be possible to detect the plane movement.

As a second example, the

peripheral electrodes

831 and 832 may be used as outgoing electrodes. The two

peripheral electrodes

831 and 832 that can operate independently of each other may sequentially transmit signals, and the sensor 930 may synchronize with the

peripheral electrodes

831 and 832 that operate as the transmitting electrodes. When the signals are sequentially transmitted, the signals may be sequentially received according to the signals.

In addition, examples of the use of the plurality of peripheral electrodes are not limited to the motion sensing electrode and the outgoing electrode, and may be changed, replaced, switched, or simultaneously implemented through various combinations.

29 to 31, the biometric sensor module includes a signal formed on the substrate 1110, a sensor 1130 mounted on the substrate 1110, and a sensor 1130 to connect an external circuit with the sensor 1130. Hard film layer 1200 adhered to the sensor 1130 through the connection portion 1120, the adhesive layer 1140, the decoration layer 1220 formed on the bottom of the hard film layer 1200 and the transmission layer formed on the bottom of the decoration layer 1220 Electrode 1230.

The outgoing electrode 1230 is formed on the bottom surface of the hard film layer 1200 to be positioned around the sensor 1130 as a surrounding electrode. The outgoing electrode connector 1240 is formed at one side of the outgoing electrode 1230, and is connected to the signal connection terminal 1122 formed on the substrate 1110.

Referring to FIG. 30, a process of bonding the hard film layer 1200 and the substrate 1110 is illustrated. The signal connection terminal 1122 is a member of the signal connection unit and may also be directly connected to the sensor 1130 or the chip of the substrate or to an external circuit through the signal connection unit 1120.

The sensor 1130 may include a plurality of tens of micrometer-sized fingerprint recognition pixel electrodes, and may be provided in a state covered by the protective resin layer 1134, that is, in a state where packaging is primarily completed. The protective resin layer 1134 may be manufactured through a molding compound, and may be mounted on the substrate 1110 by an SMT method.

Even if the sensor 1130 is packaged to some extent in this embodiment, since the packaging method of the present invention has many advantages in forming a cover, this may be applied. As such, when forming the sensor cover into a film, as shown, a film may be provided for an individual sensor, but as described with reference to FIGS. 2 and 7, a plurality of sensor modules are packaged in one substrate and In addition, the method of producing the sensor module by cutting the film after attaching the same can also be applied.

The hard film layer 1200 attached to the substrate 1110 may be formed of an insulating material, and may be formed of a transparent material or supplied as a material having a color by itself. The decoration layer 1220 and the outgoing electrode 1230 may be formed on the hard film layer 1200.

The transmitting electrode 1230 may be formed of a metal or other conductive material, and may also function to transmit an electrical signal for fingerprint recognition. Although the outgoing electrode 1230 may be formed on the top surface of the hard film layer 1200 and exposed to the outside, the outgoing electrode 1230 is formed on the bottom surface of the hard film layer 1200 as in the present embodiment and is frequently used. This wear can also be prevented.

The outgoing electrode 1230 may function to transmit a radio signal for fingerprint recognition, but at the same time, various colors may be expressed when the decoration layer 1220 is colored. To this end, as a metal, a film can be produced by coating various metal thin films such as aluminum, chromium, gold or silver.

One side of the outgoing electrode 1230 is connected to the outgoing electrode connector 1240, the outgoing electrode connector 1240 is connected to the signal connection terminal 1122 of the substrate in the packaging process, and receives an electrical signal from the substrate 1110. To transmit to the outgoing electrode 1230. In this embodiment, the outgoing electrode connector 1240 may be formed in the same process as the outgoing electrode 1230.

The hard film layer 1200 and the outgoing electrode 1230 may be adhered onto the substrate 1110 by themselves, but as shown in FIG. 30, the hard film layer 1200 and the outgoing electrode 1230 may be formed on the release film, that is, the base layer 1210 and the release coating layer 1212. There is a number. Although it is possible to produce the hard film layer 1200 with a film having a thickness of 20 to 30 μm or less and directly laminate it on the substrate, the hard film layer 1200 may be formed on a relatively thick PET or urethane base film or base layer 1210. Forming the present invention may use various film processing methods on the upper surface thereof, and the thin hard film layer 1200 may be easily handled.

After attaching the release film, an adhesive layer 1140 may be formed through a curing process. The hard film layer 1200 may be attached to the sensor 1130 and the substrate 1110 that are the primary packaging by the adhesive layer 1140. In addition, the outgoing electrode connector 1240 and the signal connection terminal 1122 may be positioned at a corresponding position up and down, and may be electrically connected to each other by a conductive adhesive layer 1142 using a conductive adhesive.

The base layer 1210 and the release coating layer 1212 may be separated from the hard film layer 1200, and the hard film layer 1200 and the outgoing electrode 1230 of about 20 to 30 μm or less are protected on the substrate 1110. The cover is fixed as a cover, and the process of electrically connecting the outgoing electrode 1230 through the conductive adhesive layer 1142 may be completed at the same time.

Referring to FIG. 32, as shown in FIG. 12, a release film including a base layer 2103, a release coating layer 2123, a hard film 2021, and a decoration layer 2221 is preformed, and a side surface of the hard film layer. It can be shaped to bend to partially receive the side of the sensor.

However, in the molded release film, the accommodating part 260 accommodating the sensor is disposed to face upward, and the adhesive 3342, such as epoxy, may be sprayed on the accommodating part 260 in a quantitative manner. The mold release film may be attached while the adhesive 3241 is cured, and adhesives having desired characteristics may be used regardless of the viscosity of the adhesive, and desired module thickness may be adjusted by using a fixed amount of adhesive. After separating the release film, by cutting the sensor module, it is possible to manufacture the sensor module shown in FIG.

As described above, although described with reference to the preferred embodiment of the present invention, those skilled in the art various modifications and variations of the present invention without departing from the spirit and scope of the invention described in the claims below I can understand that you can.

Claims

In the biometric sensor module comprising a substrate, a biometric sensor mounted on the substrate and a signal connection portion formed on the substrate for connecting the biometric sensor and an external circuit,

An adhesive layer formed on the biometric sensor; And

And a hard film layer attached to an upper portion of the biometric sensor by the adhesive layer.
The method of claim 1,

The biometric sensor module further comprises a decoration layer interposed between the hard film layer and the adhesive layer.
The method of claim 1,

And at least one surrounding electrode formed on the substrate, wherein the outgoing electrode is connected to the external circuit through the signal connection unit.
The method of claim 1,

At least one peripheral electrode (surrounding electrode) formed on the upper or lower portion of the hard film layer, wherein the peripheral electrode is attached to the biometric sensor module by the adhesive layer with the hard film layer, the peripheral electrode Biometric sensor module, characterized in that connected to the external circuit through the signal connection.
The method of claim 4, wherein

The peripheral electrode is formed using a metal thin film or a biometric sensor module, characterized in that formed using a conductive ink.
The method of claim 4, wherein

The peripheral electrode is a biometric sensor module, characterized in that used as a motion detection electrode for detecting the movement of the living body on the biometric sensor.
The method of claim 4, wherein

The peripheral electrode is a biometric sensor module, characterized in that used as an outgoing electrode for transmitting an electrical signal to the living body located on the biometric sensor.
The method of claim 7, wherein

When two or more of the peripheral electrodes are provided, each of the peripheral electrodes sequentially transmits an electrical signal, and the biometric sensor combines the signals received by each of the peripheral electrodes. module.
The method of claim 4, wherein

The microelectrode pattern includes a plurality of microelectrode patterns formed on the hard film layer corresponding to the biometric sensor together with the peripheral electrode, wherein the microelectrode patterns are insulated from each other to improve the sensitivity of the biometric sensor. Recognition sensor module.
The method of claim 9,

The microelectrode pattern is a biometric sensor module, characterized in that formed in a circular, oval, polygonal or atypical form.
The method of claim 9,

The microelectrode pattern is a biometric sensor module, characterized in that formed in 0.1 ~ 100 ㎛ size.
The method of claim 1,

The hard film layer is formed on a release film and then attached to the biometric sensor module through a transfer process, the release film comprises a base layer and a release coating layer, the hard film layer is formed on the release coating layer Biometric sensor module, characterized in that transferred to the biometric module.
The method of claim 1,

The hard film layer is provided in a molded state corresponding to the shape of the biometric sensor module, wherein the molded hard film layer is attached to define at least a portion of the appearance of the biometric sensor module biometrics Sensor module.
The method of claim 1,

And a protective resin layer covering the biometric sensor, wherein the protective resin layer is provided together with the biometric sensor before attaching the hard film layer.
The method of claim 1,

The substrate is a biometric sensor module, characterized in that the printed circuit board or flexible circuit board.
A method of packaging a biometric sensor module comprising a substrate, a biometric sensor mounted on the substrate, and a signal connection portion formed on the substrate to connect the biometric sensor and an external circuit,

Providing an original substrate prior to cutting the substrate, wherein the plurality of biometric sensors and the signal connection part are formed on the substrate;

Providing a hard film positioned on the plurality of biometric sensors;

Attaching the hard film on the biometric sensor through an adhesive layer interposed between the biometric sensor and the hard film; And

And cutting the original substrate to which the hard film is attached to produce a biometric sensor module including the substrate and the hard film layer.
The method of claim 16,

And forming a decoration layer on the hard film, and then attaching the hard film on the biometric sensor together with the decoration layer.
The method of claim 17,

The decoration layer is a packaging method of a biometric sensor module, characterized in that provided as a printing layer, an inorganic thin film layer or a metal thin film layer.
The method of claim 16,

Forming at least one surrounding electrode on or below the hard film corresponding to each biometric sensor,

The peripheral electrode is a packaging method of a biometric sensor module, characterized in that located in the vicinity of the biometric sensor module with the hard film.
The method of claim 19,

Forming a peripheral electrode connection part electrically connected to the peripheral electrode on the hard film corresponding to each of the biometric sensors,

And attaching the hard film on the biometric sensor, electrically connecting the peripheral electrode connector and the signal connector using an electrically conductive adhesive.
The method of claim 19,

In the attaching the hard film, the peripheral electrode of the hard film and the signal connecting portion of the substrate, so that the peripheral electrode is wide, so as to form a packaging method of a biometric sensor module.
The method of claim 16,

Forming a plurality of microelectrode patterns on the hard film corresponding to each of the biometric sensors;

The microelectrode pattern is a packaging method of a biometric sensor module, characterized in that insulated from each other to improve the sensitivity of the biometric sensor.
The method of claim 16,

In the step of providing the hard film, providing a release film comprising a base layer and the release coating layer, to form the hard film on the release coating layer,

In the step of attaching the hard film on the biometric sensor via the adhesive layer, the adhesive layer is provided between the hard film and the biometric sensor, the release film on which the hard film is formed via the adhesive layer The method of packaging a biometric sensor module, characterized in that attached to the substrate, the base layer of the release film is separated from the substrate.
The method of claim 16,

Packaging method of the biometric sensor module, characterized in that further comprising the step of molding the hard film corresponding to the shape of the biometric sensor module.
The method of claim 24,

In order to maintain the upper surface of the biometric sensor and the hard film layer close, the packaging method of the biometric sensor module, characterized in that for forming the recessed part of the biofilm for biometric recognition.
The method of claim 24,

Corresponding to the top and side shape of each biometric sensor module, the packaging method of the biometric sensor module, characterized in that for molding the hard film.
The method of claim 26,

The molded hard film includes a receiving portion for receiving the biometric sensor,

In the attaching the hard film on the biometric sensor, the accommodating part is disposed upward, an adhesive for the adhesive layer is applied to the accommodating part, and the biometric sensor is applied to the accommodating part. Packaging method of a biometric sensor module, characterized in that attached from above.
The method of claim 16,

The biometric sensor is provided on the base plate in a state covered by a protective resin layer, the hard film is a packaging method of a biometric sensor module, characterized in that attached to the biometric sensor covered with the protective resin layer.