WO2016101594A1

WO2016101594A1 - Frame structure for touch screen and manufacturing method therefor, touch screen and display device

Info

Publication number: WO2016101594A1
Application number: PCT/CN2015/083778
Authority: WO
Inventors: 吴玲艳; 张雷; 谢涛峰; 刘洋
Original assignee: 京东方科技集团股份有限公司; 合肥鑫晟光电科技有限公司
Priority date: 2014-12-26
Filing date: 2015-07-10
Publication date: 2016-06-30
Also published as: US10007367B2; CN104503617A; CN104503617B; US20170177105A1

Abstract

A frame structure for a touch screen, a touch screen provided with same, a display device provided with the touch screen and a manufacturing method for said touch screen frame structure. The frame structure comprises: a BM portion (2), a bonding area, a first insulating photoresist layer (5) and a plurality of transparent conductive edge wires (3); the BM portion (2) is arranged at one end of a substrate (1) on the back of the substrate (1); the bonding area is arranged on the BM portion (2) and is provided with a plurality of metal leads (7) and a plurality of transparent conductive solder pads (31), and each of the plurality of transparent conductive pads (31) is electrically connected with the corresponding metal lead (7); the first insulating photoresist layer (5) is arranged between the transparent conductive pads (31) and the metal leads (7) in the thickness direction of the substrate, and the transparent conductive pads (31) are electrically connected with the corresponding metal leads (7) by use of jump holes (51) arranged in the first insulating photoresist layer (5); the plurality of transparent conductive edge wires (3) are arranged at either side of the substrate (1) on the back thereof (1), and each transparent conductive edge wire (3) extends to the bonding area to form the corresponding transparent conductive pad (31). Frameless technologies can be realized by utilizing a transparent conductive material as edge wires, bringing better user experience to users.

Description

Frame structure of touch screen, manufacturing method thereof, touch screen and display device

Technical field

Embodiments of the present invention relate to the field of display technologies, and in particular, to a bezel structure of a touch screen, a touch screen having the bezel structure, a display device having the touch screen, and a method of manufacturing a bezel structure of the touch screen.

Background technique

With the development of the touch screen industry, based on market demand, the border portion of the touch screen has also become more and more narrow.

At present, the metal frame is basically used as the edge line for the surrounding frame. The metal trace has the characteristics of good conductivity, narrow line width and low resistance, which can meet the requirements of narrow frames. However, due to the opacity of the metal material and the appearance requirements, it is impossible to realize the borderless touch screen by using the metal line as the edge trace. At present, the narrow frame that can be made by using metal lines mainly includes a 2-3 mm mobile phone touch screen, a TPC/NB touch screen of about 5 mm, and an MNT touch screen of about 10 mm.

At present, OGS (One Glass Solution) products on the market use metal traces as edge lines. However, the product still can not achieve no border, and in the small size product part, the narrowest frame can only be about 2mm.

There is a need in the prior art for a frameless touch screen.

Summary of the invention

The present invention has been proposed in order to realize a borderless touch screen.

According to an aspect of an embodiment of the present invention, a bezel structure of a touch screen is provided, the touch screen having a substrate, and the bezel structure includes:

a BM portion provided at one end of the substrate on the back surface of the substrate;

a bonding region disposed on the BM portion, the bonding region is provided with a plurality of metal leads and a plurality of transparent conductive pads, each of the plurality of transparent conductive pads being electrically connected to a corresponding metal lead;

a first insulating photoresist layer disposed between the transparent conductive pad and the metal lead in a thickness direction of the substrate, the transparent conductive pad and the corresponding metal lead being disposed at the first insulating photoresist Electrical connection of jump holes in the layer;

A plurality of transparent conductive edge traces are disposed on the back sides of the substrate on both sides of the substrate, and each of the transparent conductive edge traces extends to the bonding region to form a corresponding transparent conductive pad.

Optionally, the BM portion, the transparent conductive pad, the first insulating photoresist layer, and the metal lead are sequentially disposed from the substrate in a thickness direction of the substrate.

Further optionally, the frame structure further includes a second insulating photoresist layer disposed on a side of the metal lead away from the first insulating photoresist layer.

Optionally, the BM portion, the metal lead, the first insulating photoresist layer, and the transparent conductive pad are sequentially disposed from the substrate in a thickness direction of the substrate.

Further optionally, the frame structure further includes a second insulating photoresist layer disposed on a side of the transparent conductive pad away from the first insulating photoresist layer.

Optionally, the frame structure further includes an X-direction transparent conductive strip disposed at an intermediate portion of the back surface of the substrate and a Y-direction transparent conductive strip substantially parallel to the transparent conductive edge trace, wherein the X-direction transparent conductive strip and the Y The transparent conductive strips are electrically isolated from each other.

Optionally, the X-direction transparent conductive strip is electrically connected through a corresponding transparent conductive bridge formed on the substrate, the transparent conductive bridge is provided with an auxiliary insulating photoresist layer, and the Y-transparent conductive strip is disposed at Above the auxiliary insulating photoresist layer.

Optionally, the first insulating photoresist layer and the auxiliary insulating photoresist layer are disposed in the same layer and are made of the same material.

Optionally, the frame structure is an OGS frame structure.

According to another aspect of an embodiment of the present invention, a touch screen is provided, including the above-described bezel structure.

According to still another aspect of an embodiment of the present invention, a display device having the touch panel described above is proposed.

According to still another aspect of the embodiments of the present invention, a method for forming a bezel structure of a touch screen is provided, the touch screen having a substrate, and the method includes the following steps:

S100, forming a BM portion on one end of the substrate on the back surface of the substrate, and the BM portion is adapted to form a bonding region;

S200, forming a plurality of transparent conductive edge traces on both sides of the substrate on the back side of the substrate, each transparent conductive edge trace extending to the bonding region to form a transparent conductive pad;

S300, forming a first insulating photoresist layer on the back surface of the substrate, the first insulating photoresist layer in each a region of a transparent conductive pad forming a jump hole;

S400, providing a plurality of metal leads on the bonding area;

Wherein, each of the transparent conductive pads is electrically connected to the corresponding metal lead through the jump hole.

Optionally, in the above method, steps S100 to S400 are sequentially performed.

Further, the step S200 further includes forming a plurality of transparent conductive bridges by using a material forming a transparent conductive edge trace in a middle portion of the back surface of the substrate; and the step S300 further includes utilizing a material forming the first insulating photoresist layer An auxiliary insulating photoresist layer partially covering each of the plurality of transparent conductive bridges is formed.

Further optionally, the method further includes the following steps between step S300 and step S400: forming an X-direction transparent conductive strip and a Y-direction transparent conductive strip in a middle portion of the back surface of the substrate, wherein the X-direction transparent conductive strip passes through the corresponding The transparent conductive bridge is electrically connected, and the Y-transparent conductive strip is disposed above the corresponding auxiliary insulating photoresist layer, and the X-direction transparent conductive strip and the Y-direction transparent conductive strip are electrically isolated from each other by the auxiliary insulating photoresist layer.

Optionally, the method further includes the step of forming a second insulating photoresist layer covering the back surface of the substrate after the step S400.

Alternatively, in the above method, the step S100, the step S400, the step S300, and the step S200 are sequentially performed.

Further, the step S400 further includes forming a plurality of conductive bridges by using a material forming the metal leads in a middle portion of the back surface of the substrate; and the step S300 further includes forming a partial covering portion by using a material forming the first insulating photoresist layer An auxiliary insulating photoresist layer of each of the plurality of conductive bridges. Further optionally, the step S200 further includes forming an X-direction transparent conductive strip and a Y-direction transparent conductive strip in a middle portion of the back surface of the substrate, wherein the X-direction transparent conductive strip is electrically connected through the corresponding transparent conductive bridge, and the Y-direction transparent conductive The strip is disposed above the corresponding auxiliary insulating photoresist layer, and the X-direction transparent conductive strip and the Y-direction transparent conductive strip are electrically isolated from each other by the auxiliary insulating photoresist layer. Optionally, the method further includes forming a second insulating photoresist layer covering the back surface of the substrate after step S200.

In the embodiment of the present invention, by using a transparent conductive material as an edge trace, a borderless technology can be realized to provide a better user experience for the user.

DRAWINGS

1-6 are structural diagrams illustrating a method of fabricating a bezel structure for a touch screen in accordance with an exemplary embodiment of the present invention, in each of which the left side is a schematic top view and the right side is a schematic end view Or a sectional view, where:

Figure 1 is a schematic view showing the formation of a BM portion on a substrate, wherein the left side is a plan view and the right side is a side view;

2 is a schematic view showing the formation of a first transparent conductive layer, wherein the left side is a schematic plan view, and the right side is a side view;

3 is a schematic view showing the formation of a first insulating photoresist layer, wherein the left side is a schematic plan view, and the right side is a side view;

4 is a schematic view showing the formation of a second transparent conductive layer, wherein the left side is a schematic plan view, and the right side is a side view;

Figure 5 is a schematic view showing the formation of a metal layer or a metal wiring layer, wherein the left side is a plan view and the right side is a side view;

Fig. 6 shows a schematic view of forming a second insulating photoresist layer, wherein the left side is a plan view and the right side is a side view.

detailed description

The frame structure of the touch screen provided by the embodiment of the present invention, the touch screen having the frame structure, the display device having the touch screen, and the method for manufacturing the frame structure of the touch screen are described in detail below with reference to the accompanying drawings.

The size and shape of the components in the drawings do not reflect the true proportion of the touch screen or the frame structure, and even the end view or the cross-sectional view on the right side does not correspond to the top view on the left side. The purpose of the drawings is only to schematically illustrate the present invention. Content.

Embodiments of the present invention relate to a method of fabricating a bezel structure of a touch screen having a substrate, the method comprising the steps of:

S300, forming a first insulating photoresist layer on a back surface of the substrate, the first insulating photoresist layer forming a jump hole in a region where each transparent conductive pad is located;

S400, providing a plurality of metal leads on the bonding area;

Based on the above method, using a transparent conductive material as the edge trace, a borderless technology can be realized to provide a better user experience for the user.

In an embodiment of the invention, the frame structure described above may be an OGS frame structure to reduce the thickness of the touch screen.

In an embodiment of the invention, the material forming the transparent conductive edge trace, the transparent conductive pad, and the subsequent transparent conductive bridge may be a suitable transparent conductive material such as ITO, FTO, AZO or the like.

In an exemplary embodiment, steps S100 to S400 are performed in sequence. The above steps will be specifically described below with reference to Figs.

As shown in FIG. 1, in step S100, a BM (black matrix) portion 2 is formed on one end of the substrate (the upper end of the schematic plan view shown in FIG. 1) on the back surface of the substrate 1, and the BM portion 2 is adapted to form a bonding region. In the embodiment of the invention, the back side of the substrate 1 represents the side opposite to the user-facing side. The BM is only disposed in the area where the bonding area is formed, and the other three sides are not provided with the BM. For example, the BM portion can be formed by a first mask process.

As shown in FIG. 2, in step S200, a plurality of transparent conductive edge traces 3 are formed on both sides of the substrate on the back surface of the substrate 1, and each transparent conductive edge trace 3 extends to the bonding region to form a transparent conductive pad 31. . As shown in FIG. 2, the step S200 further includes forming a plurality of transparent conductive bridges 4 by using a material forming the transparent conductive edge traces 3 in the intermediate portion of the back surface of the substrate 1. Thus, the transparent conductive edge traces 3, the transparent conductive pads 31, and the transparent conductive bridge 4 can be formed by a second mask process, which simplifies the fabrication process and reduces the manufacturing cost.

As shown in FIG. 3, in step S300, a first insulating photoresist layer 5 is formed on the back surface of the substrate 1, and the first insulating photoresist layer 5 forms a jump hole 51 in a region where each of the transparent conductive pads 31 is located. In an embodiment of the invention, the insulating photoresist layer acts to insulate and protect. As shown in FIG. 3, the step S300 further includes forming an auxiliary insulating photoresist layer 52 partially covering each of the plurality of transparent conductive bridges 4 by using a material forming the first insulating photoresist layer 5. Thus, the first insulating photoresist layer 5 and the auxiliary insulating photoresist layer 52 can be formed by using a third mask process, which simplifies the fabrication process and reduces the manufacturing cost.

As shown in FIG. 4, after step S300, further comprising forming an X-direction (lateral direction) transparent conductive strip 6X and a Y-direction (longitudinal direction) transparent conductive strip 6Y in the intermediate portion of the back surface of the substrate 1 (in The schematic diagram on the right side of FIG. 4 is collectively indicated by reference numeral 6), wherein the X-direction transparent conductive strips 6X are electrically connected through the corresponding transparent conductive bridges 4, and the Y-direction transparent conductive strips 6Y are disposed on the corresponding auxiliary insulating photoresist layers. Above the 52, the X-directed transparent conductive strips 6X and the Y-directed transparent conductive strips 6Y are electrically isolated from each other by the auxiliary insulating photoresist layer 52. Thus, the X-direction transparent conductive strips 6X and the Y-direction transparent conductive strips 6Y can be formed by a fourth mask process, which simplifies the manufacturing process and reduces the manufacturing cost.

The above "partial coverage of the first insulating photoresist layer 5" means that in the case of electrically insulating the conductive bridge 4 through the auxiliary insulating photoresist layer 52 and the Y-transparent conductive strip 6Y, a portion of the conductive bridge 4 is also exposed, so as to facilitate The conductive bridge 4 is electrically connected to the X-transparent conductive strip. That is, in the same row, the X-direction transparent conductive strip 6X includes a plurality of sub-transparent conductive strips, and these sub-transparent conductive strips are electrically connected through the conductive bridge 4.

As shown in FIG. 5, in step S400, a plurality of metal leads 7 are disposed on the bonding region, and each of the transparent conductive pads 31 is electrically connected to the corresponding metal wiring 7 through the jump holes 51. Also, the pattern of the metal leads 7 can be formed using a fifth mask process.

As shown in FIG. 6, after step S400, a second insulating photoresist layer 8 covering the back surface of the substrate 1 may be formed to improve the light blocking property of the back surface of the substrate 1. The second insulating photoresist layer 8 can be formed using a sixth mask process.

Obviously, the second insulating photoresist layer 8 needs to vacate the corresponding portion of the bonding region. As shown in FIG. 6, the second insulating photoresist layer 8 has an opening portion 81 for exposing the metal lead 7 of the bonding region, so as to facilitate the FPC (Flexible Printed Circuit) to pass through the ACF (Anisotropic Conductive Film) and the metal lead of the bonding region. 7 electrical connection.

Figures 1-6 illustrate a method of fabricating a bezel structure of a touch screen by six mask processes.

Alternatively, in order to save manufacturing costs, the mask structure of the touch screen can also be fabricated using 4 mask processes. Specifically, the BM portion is first formed by a first mask process; then, a conductive bridge is formed in a central region of the back surface of the substrate by a second mask process, and a metal lead is formed at a bonding region of the substrate; and then a third mask is passed through Forming a first insulating photoresist layer and an auxiliary insulating photoresist layer, wherein the first insulating photoresist layer is provided with a jump hole; after the first insulating photoresist layer is formed, the fourth mask process may be performed on the back surface of the substrate Forming a plurality of transparent conductive edge traces on both sides of the substrate, each transparent conductive edge trace extending to the bonding region to form a transparent conductive pad, The transparent conductive pad is electrically connected to the corresponding metal lead through the jump hole, and the X-direction transparent conductive strip and the Y-direction transparent conductive strip are formed in the middle area of the back surface of the substrate, wherein the X-direction transparent conductive strip is electrically connected through the corresponding transparent conductive bridge. The Y-transparent conductive strip is disposed above the corresponding auxiliary insulating photoresist layer, and the X-direction transparent conductive strip and the Y-direction transparent conductive strip are electrically isolated from each other by the auxiliary insulating photoresist layer 52.

Alternatively, in order to save manufacturing costs, the mask structure of the touch screen can also be fabricated using 5 mask processes. Specifically, the BM portion is first formed by a first mask process; then, a conductive bridge is formed in a central region of the back surface of the substrate by a second mask process, and a metal lead is formed at a bonding region of the substrate; and then a third mask is passed through Forming a first insulating photoresist layer and an auxiliary insulating photoresist layer, wherein the first insulating photoresist layer is provided with a jump hole; after the first insulating photoresist layer is formed, the fourth mask process may be performed on the back surface of the substrate Forming a plurality of transparent conductive edge traces on both sides of the substrate, each transparent conductive edge trace extending to the bonding region to form a transparent conductive pad, and the transparent conductive pad is electrically connected to the corresponding metal lead through the jump hole, and The back intermediate portion of the substrate forms an X-direction transparent conductive strip and a Y-direction transparent conductive strip, wherein the X-direction transparent conductive strip is electrically connected through a corresponding transparent conductive bridge, and the Y-direction transparent conductive strip is disposed above the corresponding auxiliary insulating photoresist layer. And the X-direction transparent conductive strip and the Y-direction transparent conductive strip are electrically isolated from each other by the auxiliary insulating photoresist layer 52; thereafter, the cover substrate back is formed by a fifth mask process a second insulating photoresist layer.

In the 4 mask process and the 5 mask process, when a transparent conductive layer (including a transparent conductive edge trace, a transparent conductive pad, a transparent conductive bridge, an X-direction transparent conductive strip, and a Y-transparent conductive strip) is formed, etching is required. The etchant is generally acidic and adversely affects the metal leads. However, since the transparent conductive layer is covered by the first insulating photoresist layer and the auxiliary insulating photoresist layer after the transparent conductive layer is formed, the developer is generally alkaline when etching the first insulating photoresist layer, and does not It has an adverse effect on metal leads and metal bridge points.

In the above embodiment, steps S100 to S400 are described as being sequentially performed. In an alternative embodiment, step S100, step S400, step S300, and step S200 are performed in sequence. That is, the step S200 of forming the transparent conductive pad and the step S400 of forming the metal lead are interchangeable, but the step S300 for forming the first insulating photoresist layer is performed between step S200 and step S400, Electrical isolation of the transparent conductive pads and formation of the metal leads is achieved.

It should be noted that the above embodiments are merely illustrative. For example, in the manufacture of a touch screen In the method of the frame structure, when the transparent conductive edge trace is formed, the transparent conductive bridge, the X-direction transparent conductive strip and the Y-direction transparent conductive strip may be formed at different times; when the metal lead layer is formed, the metal bridge point may not be formed at the same time. .

Based on the above embodiment, as shown in FIG. 5-6, an embodiment of the further aspect of the present invention further provides a frame structure of the touch screen. The touch screen has a substrate 1. The frame structure includes:

a BM portion 2 provided at one end of the substrate on the back surface of the substrate 1;

a bonding region disposed on the BM portion, the bonding region is provided with a plurality of metal leads 7 and a plurality of transparent conductive pads 31, each of the plurality of transparent conductive pads 31 being electrically connected to the corresponding metal leads 7;

A first insulating photoresist layer 5 is disposed between the transparent conductive pad 31 and the metal lead 7 in the thickness direction of the substrate 1, and the transparent conductive pad 31 and the corresponding metal lead 7 are disposed on the first insulating photoresist layer 5 The jump hole 51 in the electrical connection;

A plurality of transparent conductive edge traces 3 are disposed on the back side of the substrate 1 on both sides of the substrate, and each of the transparent conductive edge traces 3 extends to the bonding region to form a corresponding transparent conductive pad 31.

In the above frame structure, by using a transparent conductive material as an edge trace, a borderless technology can be realized, and a better user experience is provided for the user.

Alternatively, in the thickness direction of the substrate 1, in the bonding region, the BM portion 2, the transparent conductive pad 31, the first insulating photoresist layer 5, and the metal wiring 7 are sequentially disposed on the back surface of the substrate 1.

Further, the frame structure further includes a second insulating photoresist layer 8 in which: in the thickness direction of the substrate 1, in the bonding region, the BM portion 2, the transparent conductive pad 31, and the first layer are sequentially disposed on the back surface of the substrate 1. The insulating photoresist layer 5, the metal lead 5, and the second insulating photoresist layer 8. Thus, the second insulating photoresist layer is disposed on a side of the metal lead remote from the first insulating photoresist layer.

In an alternative embodiment, a BM portion, a metal lead, a first insulating photoresist layer, and a transparent conductive pad are sequentially disposed on the back side of the substrate in the thickness direction of the substrate. Further, the frame structure further includes a second insulating photoresist layer, wherein: in the thickness direction of the substrate, in the bonding region, the BM portion, the metal wire, the first insulating photoresist layer, and the transparent conductive pad are sequentially disposed on the back surface of the substrate. And a second insulating photoresist layer, such that the second insulating photoresist layer is disposed on a side of the transparent conductive pad away from the first insulating photoresist layer. That is, in embodiments of the invention, the locations of the metal leads and the transparent conductive pads are interchangeable, but with a first insulating photoresist layer therebetween.

The bezel structure according to an embodiment of the present invention further includes an X-direction transparent conductive strip 6X extending in the lateral direction disposed substantially in the intermediate portion of the back surface of the substrate 1 (the region outside the bonding region) and substantially parallel to the transparent conductive edge trace 3 The Y-direction transparent conductive strip 6Y extending in the longitudinal direction, wherein the X-direction transparent conductive strip 6X and the Y-transparent conductive strip 6Y are electrically isolated from each other. The X-direction transparent conductive strips 6X and the Y-transparent conductive strips 6Y are electrically connected to the corresponding transparent conductive edge traces 3 to control the X-direction transparent conductive strips 6X and the Y-direction transparent conductive strips 6Y by the control circuit through the flexible circuit board, thereby realizing Display function.

In one embodiment, the X-direction transparent conductive strips 6X are electrically connected through corresponding transparent conductive bridges 4 formed on the substrate 1. The transparent conductive bridge 4 is provided with an auxiliary insulating photoresist layer 52, and the Y-direction transparent conductive strips 6Y are disposed. Above the auxiliary insulating photoresist layer 52, the X-direction transparent conductive strips 6X and the Y-transparent conductive strips 6Y are electrically isolated from each other. Further, the first insulating photoresist layer 5 and the auxiliary insulating photoresist layer 52 are disposed in the same layer and are made of the same material, which can be formed by a single mask process, which simplifies the manufacturing process and reduces the manufacturing cost.

Accordingly, the present invention provides a touch screen including the above-described bezel structure.

Accordingly, the present invention provides a display device having the above touch screen. The display device may be any product or component having a display function, such as a liquid crystal panel, an electronic paper, an OLED panel, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like. Based on the erasing process, the technical solution of the present invention is particularly suitable for a small-sized touch screen, such as a touch screen of 10 inches or less.

It is apparent that those skilled in the art can make various modifications and variations to the invention without departing from the spirit and scope of the invention. Thus, it is intended that the present invention cover the modifications and modifications of the invention

Claims

A frame structure of a touch screen, the touch screen having a substrate, the frame structure comprising:

a BM portion provided at one end of the substrate on the back surface of the substrate;

a bonding region disposed on the BM portion, the bonding region is provided with a plurality of metal leads and a plurality of transparent conductive pads, each of the plurality of transparent conductive pads being electrically connected to a corresponding metal lead;

a first insulating photoresist layer disposed between the transparent conductive pad and the metal lead in a thickness direction of the substrate, wherein the transparent conductive pad and the corresponding metal lead utilize a jump hole provided in the first insulating photoresist layer Connection;

A plurality of transparent conductive edge traces are disposed on the back sides of the substrate on both sides of the substrate, and each of the transparent conductive edge traces extends to the bonding region to form a corresponding transparent conductive pad.
The bezel structure of claim 1 wherein:

The BM portion, the transparent conductive pad, the first insulating photoresist layer, and the metal lead are sequentially disposed from the substrate in the thickness direction of the substrate.
The bezel structure of claim 2, further comprising a second insulating photoresist layer disposed on a side of the metal lead remote from the first insulating photoresist layer.
The bezel structure of claim 1 wherein:

The BM portion, the metal lead, the first insulating photoresist layer, and the transparent conductive pad are sequentially disposed from the substrate in the thickness direction of the substrate.
The bezel structure of claim 4, further comprising a second insulating photoresist layer disposed on a side of the transparent conductive pad remote from the first insulating photoresist layer.
The bezel structure according to any one of claims 1 to 5, further comprising an X-direction transparent conductive strip disposed at a rear intermediate portion of the substrate and substantially parallel to the transparent conductive edge trace Y-transparent conductive strips, wherein the X-direction transparent conductive strips and the Y-direction transparent conductive strips are electrically isolated from each other.
The bezel structure according to claim 6, wherein the X-ray transparent conductive strip is electrically connected through a corresponding transparent conductive bridge formed on the substrate, and the transparent conductive bridge is provided with an auxiliary insulating photoresist layer. The Y-transparent conductive strip is disposed above the auxiliary insulating photoresist layer.
The bezel structure according to claim 7, wherein the first insulating photoresist layer and the auxiliary insulating photoresist layer are disposed in the same layer and are made of the same material.
A bezel structure according to any one of claims 1-8, wherein:

The frame structure is an OGS frame structure.
A touch screen comprising the bezel structure according to any one of claims 1-9.
A display device having the touch screen of claim 10.
A method of manufacturing a bezel structure of a touch screen, the touch screen having a substrate, the method comprising the steps of:

S100, forming a BM portion on one end of the substrate on the back surface of the substrate, and the BM portion is adapted to form a bonding region;

S200, forming a plurality of transparent conductive edge traces on both sides of the substrate on the back side of the substrate, each transparent conductive edge trace extending to the bonding region to form a transparent conductive pad;

S300, forming a first insulating photoresist layer on a back surface of the substrate, the first insulating photoresist layer forming a jump hole in a region where each transparent conductive pad is located;

S400, providing a plurality of metal leads on the bonding area;

Wherein, each of the transparent conductive pads is electrically connected to the corresponding metal lead through the jump hole.
The method of claim 12 wherein:

The steps S100 to S400 are sequentially performed.
The method of claim 13 wherein:

The step S200 further includes forming a plurality of transparent conductive bridges by using a material forming a transparent conductive edge trace in a middle portion of the back surface of the substrate;

The step S300 further includes forming an auxiliary insulating photoresist layer partially covering each of the plurality of transparent conductive bridges by using a material forming the first insulating photoresist layer.
The method of claim 14 further comprising the step of between step S300 and step S400:

Forming an X-direction transparent conductive strip and a Y-direction transparent conductive strip in a middle portion of the back surface of the substrate, wherein the X-direction transparent conductive strip is electrically connected through a corresponding transparent conductive bridge, and the Y-direction transparent conductive strip is disposed above the corresponding auxiliary insulating photoresist layer And the X-direction transparent conductive strip and the Y-direction transparent conductive strip are electrically isolated from each other by the auxiliary insulating photoresist layer.
A method according to any one of claims 12-15, further comprising the steps of:

A second insulating photoresist layer covering the back surface of the substrate is formed after the step S400.
The method of claim 9 wherein:

The step S100, the step S400, the step S300, and the step S200 are sequentially performed.
The method of claim 17 wherein:

The step S400 further includes forming a plurality of conductive bridges by using a material forming the metal leads in a middle portion of the back surface of the substrate;

The step S300 further includes forming an auxiliary insulating photoresist layer partially covering each of the plurality of conductive bridges with a material forming the first insulating photoresist layer.
The method of claim 18 wherein:

The step S200 further includes forming an X-direction transparent conductive strip and a Y-direction transparent conductive strip in a middle portion of the back surface of the substrate, wherein the X-direction transparent conductive strip is electrically connected through the corresponding transparent conductive bridge, and the Y-direction transparent conductive strip is disposed in the corresponding Above the auxiliary insulating photoresist layer, the X-direction transparent conductive strip and the Y-direction transparent conductive strip are electrically isolated from each other by the auxiliary insulating photoresist layer.
A method according to any one of claims 12 to 19, further comprising:

A second insulating photoresist layer covering the back surface of the substrate is formed after the step S200.