WO2016029607A1

WO2016029607A1 - Heat dissipation device of electrical component

Info

Publication number: WO2016029607A1
Application number: PCT/CN2014/095146
Authority: WO
Inventors: 杨成鹏; 郝明亮
Original assignee: 华为技术有限公司
Priority date: 2014-08-27
Filing date: 2014-12-26
Publication date: 2016-03-03
Also published as: CN104363736B; CN104363736A

Abstract

Disclosed is a heat dissipation device of an electrical component, the heat dissipation device comprising a cross-flow fan (120) and a plurality of first fins (110a) provided on the heat dissipation surface of an electrical component; a first heat dissipation channel (110b) is formed between neighboring first fins (110a), and the plurality of first fins (110a) form a plurality of first heat dissipation channels (110b); the cross-flow fan (120) is located at an external side of one end of the plurality of first fins (110a), and enables the plurality of first heat dissipation channels (110b) to communicate; and air blown by the cross-flow fan (120) enters the first heat dissipation channels (110b), thus facilitating the heat dissipation of the plurality of first fins (110a). The heat dissipation device of the electrical component in an embodiment of the present invention increases a heat dissipation efficiency.

Description

Heat sink for electronic components

The present application claims priority to Chinese Patent Application No. 20141042 945, filed on Aug. 27, 2014, the entire disclosure of which is incorporated herein by reference.

Technical field

The present invention relates to the field of electronic devices, and in particular, to a heat sink for an electronic component.

Background technique

As the acquisition of the equipment room becomes more and more difficult, the construction cost of the equipment room is getting higher and higher, and the longer feeder cable increases the loss, which is disadvantageous for system energy saving and lowering the operating electricity cost.

At present, the operator has increased the application ratio of the distributed base station. In the distributed base station, the remote radio unit (RRU) is installed close to the antenna. As the output power of the RRU module increases, the heat consumption of the RRU module increases, and the heat dissipation requirements are higher and higher. It is required to provide a heat dissipation device with higher heat dissipation efficiency to meet the heat dissipation requirements of the current RRU module.

Summary of the invention

Embodiments of the present invention provide a heat dissipation device for an electronic component, which can improve heat dissipation efficiency.

In a first aspect, a heat dissipating device for an electronic component is provided. The heat dissipating device includes: a cross flow fan disposed on a heat dissipating surface of the electronic component and a plurality of first fins, and the first fins are formed between the first fins a heat dissipation channel, the plurality of first fins form a plurality of first heat dissipation channels; the cross flow fan is located at one end of the plurality of first fins, and the cross flow fan penetrates the plurality of first heat dissipation channels; the wind blown by the cross flow fan enters The first heat dissipation channel facilitates heat dissipation of the plurality of first fins.

With reference to the first aspect, in a first possible implementation, the heat dissipating device further includes: a plurality of second fins, a second heat dissipation channel is formed between the adjacent second fins, and the plurality of second fins are formed a plurality of second heat dissipation channels; the cross flow fan is located at one end of the plurality of second fins, and the cross flow fan penetrates the plurality of second heat dissipation channels; the wind flows from the outside into the second heat dissipation channel, and is blown through the second heat dissipation channel Flow fan.

With reference to the first possible implementation manner, in a second possible implementation manner, the axial length of the cross flow fan is greater than or equal to the distance between the outermost two second fins of the plurality of second fins, Take The wind output from each of the plurality of second heat dissipation channels is blown into the cross flow fan.

In combination with the first aspect or the first or second possible implementation manner, in a third possible implementation, the axial length of the cross flow fan is greater than or equal to the outermost two of the plurality of first fins The distance between the fins is such that the wind blown by the cross-flow fan enters each of the plurality of first heat dissipation channels.

With reference to the first aspect or any one of the first to the third possible implementation manners, in a fourth possible implementation, the cross flow fan comprises an axial parallel arrangement along the cross flow fan Multiple sub-flow fans.

In combination with the first aspect or any one of the first to fourth possible implementations, in a fifth possible implementation, the plurality of first fins are disposed on an upper portion of the cross flow fan. The plurality of second fins are disposed at a lower portion of the cross flow fan, and the heat dissipating device further includes: a top cover disposed on the top of the heat dissipating device to cover the plurality of first fins and the plurality of first heat dissipating passages.

In conjunction with the fifth possible implementation, in a sixth possible implementation, the top cover is provided with a heat dissipation hole, and the heat dissipation device further includes: a guiding structure, wherein the introduction end of the guiding structure is disposed on the top cover Below the venting holes, the leading end of the guiding structure is disposed outside the plurality of first heat dissipating passages, and the liquid or debris entering from the louvers on the top cover plate is led out to the heat dissipating device.

In combination with the fifth or the sixth possible implementation, in a seventh possible implementation, the heat dissipating device further includes: a front cover disposed between the top cover and the cross flow fan, and the plurality of first The fin and the outer side of the plurality of first heat dissipation channels, the plurality of first fins and the plurality of first heat dissipation channels are located between the heat dissipation surface of the electronic component and the front cover, and the labyrinth heat dissipation holes are disposed on the front cover.

With reference to the first aspect, or any one of the first to the seventh possible implementation manners, in the eighth possible implementation, the heat dissipating device further includes: a side baffle disposed on the heat dissipating device On both sides, the heat dissipation holes are provided on the side fences.

In a second aspect, a base station is provided, comprising the heat dissipation device, the radio remote unit RRU and the antenna according to any one of the preceding claims, wherein the heat dissipation device is disposed on a heat dissipation surface of the RRU; and the RRU is configured to convert the baseband optical signal into a radio frequency The signal amplifies the RF signal and transmits the amplified RF signal to the antenna for transmission through the antenna.

According to the above technical solution, by providing a cross-flow fan and a plurality of fins on a heat dissipating surface of the electronic component, the cross-flow fan is disposed at one end of the plurality of fins, and the cross-flow fan penetrates the plurality of first heat dissipating passages. The wind blown by the flow fan directly enters the plurality of heat dissipation channels formed by the plurality of fins, so that the resistance of the wind entering the plurality of heat dissipation channels is small, thereby improving the heat dissipation efficiency.

DRAWINGS

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings to be used in the embodiments of the present invention will be briefly described below. It is obvious that the drawings described below are only some embodiments of the present invention, Those skilled in the art can also obtain other drawings based on these drawings without paying any creative work.

1A is a schematic plan view of a heat sink of an electronic component in accordance with one embodiment of the present invention.

1B and 1C are schematic plan views of a heat sink of an electronic component according to another embodiment of the present invention.

2 is a schematic plan view of a heat sink of an electronic component in accordance with another embodiment of the present invention.

3 is a front elevational view of a heat sink of an electronic component in accordance with another embodiment of the present invention.

4A is a front elevational view of a heat sink of an electronic component in accordance with another embodiment of the present invention.

4B is a front elevational view of a heat sink of an electronic component in accordance with another embodiment of the present invention.

5A is a side view of a heat sink of an electronic component in accordance with another embodiment of the present invention.

5B is a schematic structural view of a front cover of a heat sink of an electronic component according to another embodiment of the present invention.

5C is a schematic side view of a front cover of a heat sink of an electronic component according to another embodiment of the present invention.

5D is another schematic side view of a front cover of a heat sink of an electronic component according to another embodiment of the present invention.

5E is a side view of a heat sink of an electronic component in accordance with another embodiment of the present invention.

6A is a rear elevational view of a heat sink of an electronic component in accordance with still another embodiment of the present invention.

6B is a schematic view showing the assembly of a heat sink of an electronic component according to still another embodiment of the present invention.

detailed description

The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are a part of the embodiments of the present invention, but not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of the present invention.

1 shows a plan view of a heat sink 100 of an electronic component in accordance with an embodiment of the present invention. As shown in FIG. 1, the heat sink 100 includes: a cross current disposed on a heat dissipating surface of an electronic component A fan and a plurality of first fins 110.

A first heat dissipation channel 110b is formed between the adjacent first fins 110a, and the plurality of first fins 110a form a plurality of first heat dissipation channels 110b. The cross flow fan 120 is located at one end of the plurality of first fins 110a, and the cross flow fan 120 penetrates the plurality of first heat dissipation passages 110b. The wind blown by the cross flow fan 120 enters the first heat dissipation passage 110b, thereby facilitating heat dissipation of the first fin 110a.

The electronic component in the embodiment of the present invention may be a remote radio unit (RRU), and may be other electronic components.

The heat dissipating surface of the electronic component may be any one or more surfaces of the electronic component. The embodiment of the present invention is described by taking only the heat dissipating surface of the heat dissipating device 100 shown in FIG. 1 as the front surface.

In the embodiment of the present invention, the plurality of first fins 110a may be disposed on the air outlet side of the cross flow fan 120, and the air outlet direction of the air outlet of the cross flow fan 120 is the same as the air inlet direction of the plurality of first heat dissipation channels 110b. . The wind blown by the cross-flow fan 120 can directly enter the plurality of first heat dissipation channels 110b, and the wind receives less resistance during the flow into the first heat dissipation channel, so that the cross-flow fan 120 has less working resistance during the air supply process. Thereby, the heat dissipation efficiency of the heat sink can be improved.

At the same time, since the cross-flow fan 120 has uniform airflow over the entire length of the impeller, and the wind output from the cross-flow fan 120 can directly flow into the plurality of second heat dissipation channels 120, the wind can be uniformly sent to the plurality of second heat dissipation channels 120. The heat dissipation of the heat sink 100 is made more uniform.

The embodiment of the present invention does not need to provide a special air guiding structure to guide the wind output from the cross flow fan 120 into the heat dissipation channel 120, so that the structure of the heat dissipation device is simpler.

The cross flow fan 120 can be embedded in the first fin 110a without taking up extra space, which can make the structure of the electronic component more compact. Here, a certain gap may be provided between the first fin 110a and the impeller of the cross flow fan 120. For example, a gap of 3 to 5 mm may be provided between the first fin 110a and the impeller of the cross flow fan 120.

The cross flow fan 120 may include an impeller and a first motor, the first motor being disposed at one end of the impeller, and the motor driving the impeller to rotate.

Since the motor of the cross-flow fan is disposed at one end of the impeller, the radius of the cross-section fan 120 perpendicular to the axial direction is small, and the cross-flow fan 120 is embedded in the first fin 110a, so that the height of the first fin 110a can be lowered. Therefore, the size of the heat sink is smaller. Since the impeller and the motor of the axial flow fan have overlapping regions, the height of the axial flow fan is the superimposed height of the impeller and the motor, so that the cross-flow fan can reach a smaller size that cannot be achieved by the axial flow fan, so that the heat dissipation of the embodiment of the present invention The device 100 can reach a smaller scale that cannot be achieved by the heat sink of the axial fan in the prior art. Inch. Therefore, embodiments of the present invention are advantageous for miniaturization of electronic products.

The cross flow fan 120 may also be disposed at the top end or the bottom end of the heat dissipating surface, as shown in FIG. 1B and FIG. 1C. At this time, only the plurality of first fins 110a are disposed on the air outlet side of the cross flow fan 130.

When the cross-flow fan 120 is disposed in the middle of the heat dissipation surface, the heat dissipation device may further include: a plurality of second fins 130a, and a second heat dissipation channel 130b is formed between the adjacent second fins 130a, and the plurality of second fins 130a forms a plurality of second heat dissipation channels 130b. The cross flow fan 120 is located at one end of the plurality of second fins 130a, and the cross flow fan 120 penetrates the plurality of second heat dissipation passages 130b. The wind flows from the outside into the second heat dissipation passage 130b, and passes through the cross flow fan 120 blown by the second heat dissipation passage 130b. A certain gap may be provided between the second fin 130a and the impeller of the cross flow fan 120, for example, a gap of 3 to 5 mm is provided between the second fin 130a and the impeller of the cross flow fan 120.

It should be understood that, in the embodiment of the present invention, only the first heat dissipating fins 110a shown in FIG. 1A are disposed on the upper portion of the cross flow fan 120, and the second heat dissipating fins 130a are disposed on the lower portion of the cross flow fan 120 as an example for description. At this time, the flow direction of the airflow is from the bottom to the top, and the heat dissipation efficiency of the heat sink 100 is high. It should be understood that the first heat dissipating fins 110a may also be disposed at a lower portion of the cross flow fan 120, and the second heat dissipating fins 130a are disposed at an upper portion of the cross flow fan 120, as shown in FIG. 1C.

When the cross-flow fan is maintained, it can be disassembled and maintained from the side of the heat sink 100 or other directions. When a plurality of electronic components are assembled, the cross-flow fan can be detached from the side of the heat sink 100, which makes maintenance more convenient.

Therefore, in the heat dissipating device for an electronic component according to the embodiment of the present invention, a cross-flow fan and a plurality of fins are disposed on a heat dissipating surface of the electronic component, and a cross-flow fan is disposed at one end of the plurality of fins, and the wind blown by the cross-flow fan directly enters The plurality of fins form a plurality of heat dissipating passages, so that the working resistance of the fan is small, thereby improving the heat dissipation efficiency.

In the embodiment of the present invention, as shown in FIG. 1, the first fins 110a and the second fins 120a may be disposed in a vertical direction, and may also be disposed to have a certain curvature as shown in FIG. 2. In addition, the cross-flow fan 120 may be horizontally disposed or non-horizontal, such that the airflow direction of the cross-flow fan is the same as the air-inflow direction of the second heat dissipation channel, and the airflow direction of the cross-flow fan and the first heat dissipation. The air outlet direction of the channel is the same. At this time, the cross-flow fan 120 is subjected to the minimum resistance of the heat dissipation channel during operation, so that the heat dissipation device 100 can achieve high heat dissipation efficiency.

In the embodiment of the present invention, the angles of the inlet and outlet of the cross-flow fan 120 may be set to 135°, and the angles of the inlet and outlet of the cross-flow fan 120 are close to the horizontal, and the air inlet and outlet are The effect is equivalent to an axial fan. It should be understood that in the embodiment of the present invention, the air inlet and outlet of the cross flow fan 120 The angle is not limited to 135°, and the angles of the inlet and outlet of the cross-flow fan 120 may be other angles. It should be noted that when the angle of the inlet and outlet of the cross-flow fan 120 is 90°, if the air outlet of the cross-flow fan is facing the extending direction of the first heat dissipation channel formed by the first fin 110a, the cross-flow fan at this time The air inlet is almost perpendicular to the direction of the second heat dissipation channel. At this time, it is disadvantageous to assemble a plurality of electronic components together, because the electronic components assembled in the front block the air inlets of the subsequent electronic components, thereby affecting the heat dissipation of the subsequent electronic components.

In the embodiment of the present invention, the cross flow fan 120 may employ a magnetic suspension bearing. It should be understood that the cross flow fan 120 can also employ mechanical bearings. The use of magnetic suspension bearings can reduce bearing wear and improve the reliability of the heat sink.

In the embodiment of the present invention, the cross flow fan 120 may further include a second motor disposed at the second end of the impeller. At this time, the first motor can be the main motor, and the second motor can be the standby motor. This forms a redundant configuration of the motor, which can improve the reliability of the cross-flow fan 120, thereby improving the overall reliability of the heat sink 100 of the electronic component.

Preferably, in the embodiment of the present invention, the axial length of the cross flow fan may also be greater than or equal to the distance between the outermost two first fins 110a of the plurality of first fins 110a, so that the cross flow fan The blown air of 120 flows to each of the plurality of first heat dissipation passages 110b.

At this time, the wind blown by the cross-flow fan can cover all the heat dissipation channels on the heat dissipation surface of the electronic component, thereby improving the heat dissipation efficiency of the heat dissipation device and uniform heat dissipation.

Alternatively, when the plurality of second fins 130b are disposed on the other side of the cross flow fan, the axial length of the cross flow fan 120 may also be greater than or equal to the outermost two of the plurality of second fins 130a. The distance between the fins 130a is such that the wind output from each of the plurality of second heat dissipation passages 130b is blown into the cross flow fan 120.

Optionally, in the embodiment of the present invention, the cross flow fan 120 may include a plurality of sub-flow fans arranged in parallel along the axial direction of the cross flow fan 120. The embodiment of the present invention is described by taking only two sub-flow fans as an example. It should be understood that the cross-flow fan 120 may further include two or more sub-flow fans in the embodiment of the present invention. The two sub-flow fans may be two independently operating portions of the cross-flow fan 120, the overall configuration of which is still embodied as a complete fan assembly. Alternatively, the two sub-flow fans may be two independent cross-flow fans. The motor of the sub-flow fan on the left side is disposed on the left side, and the motor of the sub-flow fan on the right side is disposed on the right side, which can realize the coordinated operation or independent operation of the sub-flow fans on the left and right sides. This can reduce the synchronization requirements of the motors on both sides, the excessive long axis ratio of the impeller, and the torsional deformation of the impeller. During maintenance, the two sub-flow fans can be plugged and unplugged from both sides, so that the present invention The heat sink of the electronic component of the embodiment is easier to maintain.

Optionally, as another embodiment, as shown in FIG. 3, the heat dissipation device 100 may further include a top cover 140 disposed at the top of the heat dissipation device 100 to cover the first heat dissipation channel 110b and the first fin 110a. The top cover 140 of the embodiment of the present invention can prevent rainwater or debris from falling directly from the top of the heat sink 100 into the impeller and the motor of the fan, causing damage to the cross flow fan. At this time, the first fin 110a (the second fin 130a when the air inlet portion is disposed at the upper portion of the cross flow fan) may be disposed to maintain a certain distance from the top cover 140, or may be first as shown in FIG. An air guiding structure is disposed on the heat dissipating surface between the uppermost end of the fin 110 and the top cover 140, and the air guiding structure can guide the wind flowing out of the first heat dissipating passage 110b to the left and right sides of the heat dissipating device. The wind guiding structure may be composed of a pin fin or a sheet fin. When the wind output from the cross-flow fan 120 flows out from above the first heat dissipation passage 110b, it is guided by the air guiding structure, the wind direction changes, flows to the left and right sides, and is discharged through the left and right sides.

Optionally, as another embodiment, as shown in FIG. 4A, a heat dissipation hole may be disposed on the top cover 140. At this time, the heat dissipation device 100 may further include: a guiding structure 150. The introduction end of the guiding structure 150 is disposed under the heat dissipation hole on the top cover 140, and the leading end of the guiding structure 150 is disposed in the plurality of first heat dissipation channels. The outside of the 110b, the liquid or foreign matter entering from the heat dissipation holes in the top cover 140 is led out to the heat sink 100. For example, the guiding structure 150 can guide rainwater or debris to the left and right sides of the heat sink. The embodiment of the invention can simultaneously improve the heat dissipation amount while having the protection function. The embodiment of the present invention is described by taking the louver structure as shown in FIG. 4A as an example. The guiding structure 150 may also be in other forms, which is not limited by the embodiment of the present invention. For example, rainwater falling from the top cover 140 falls onto the louver structure shown in FIG. 4A, and falls along the louver structure onto the louver at the bottom of the louver structure, and the louver is provided with a rain guide to guide the rainwater. Discharge to the left and right sides of the heat sink.

As shown in FIG. 4B, the heat sink 100 may further include a front cover 160 disposed between the top cover 140 and the cross flow fan 120, and a plurality of first fins 110a and a plurality of first heat dissipation channels 110b. The plurality of first fins 110a and the plurality of first heat dissipation channels 110b are located between the heat dissipation surface of the electronic component and the front cover 160. The front cover 160 can form a duct with the plurality of first heat dissipation passages 110b formed by the plurality of first fins 110a, preventing the wind from flowing out from the outside of the first heat dissipation passage 110b, so that the wind output from the cross flow fan 120 flows through the plurality of A fin 110a and the entire surface of the plurality of first heat dissipation channels 110b further improve heat dissipation efficiency. Meanwhile, the embodiment of the present invention can further prevent rainwater or debris from falling between the top cover 140 and the cross flow fan 120 into the impeller of the cross flow fan 120 and Motor. At this time, the leading end of the guiding structure 150 in the embodiment shown in FIG. 4A may be disposed to extend to the front cover 160, and at the same time, a heat dissipation hole is disposed on the front cover 160 at a position corresponding to the leading end of the guiding structure, so that the falling The rainwater derived from the outlet end can be directly discharged through the heat dissipation holes on the front cover 160.

Optionally, as another embodiment, as shown in FIG. 5A, a labyrinth heat dissipation hole 161 may be disposed on the front cover 160. The wind can be discharged through the labyrinth vent 161 to dissipate the heat sink 100, which can further improve the heat dissipation efficiency of the heat sink. At the same time, the labyrinth vents 161 also prevent rainwater from entering the heat sink 100. As shown in FIG. 5A, the top cover 140 and the front cover 160 may be provided as a single unit. It should be understood that the top cover 140 and the front cover 160 may also be provided as two separate cover plates as shown in FIG. 4B.

In the embodiment of the present invention, FIG. 5B is a schematic structural view of a labyrinth heat dissipation hole on the front cover 160. The labyrinth vent 161 may be composed of a front cover 160, a baffle 162a, and a baffle 162b. The baffle 162a is disposed at a position facing the labyrinth louver 161, and the baffle 162b connects the baffle 162a and the lower edge of the labyrinth louver 161. The baffle 162b may be disposed to have a certain inclination so that rainwater falling on the baffle 162b flows out of the front cover 160 by gravity. FIG. 5C is a side view of the front cover 160 of an embodiment, and the baffle 162b may be directly connected to the lower edge of the labyrinth vent 161 as a whole. 5D is a side elevational view of the front cover 160 of another embodiment, the baffle 162b being coupled to the baffle 162c, and the baffle 162c being securable to the front cover 160 by a standard mounting member. FIG. 5E is a front elevational view of the labyrinth vent 161 of the embodiment shown in FIG. 5D. The heat dissipating device 100 of the electronic component according to the embodiment of the present invention can further increase the air volume, improve the heat dissipation efficiency, and ensure the heat dissipation device of the electronic component while preventing external rain or debris from entering the cross-flow fan from the top and the front. reliability.

Optionally, as shown in FIG. 3, FIG. 4A, FIG. 4B, FIG. 5A and FIG. 5E, in the embodiment of the present invention, the heat dissipating device 100 further includes a side baffle 170 disposed on both sides of the heat dissipating device 100. A heat dissipation hole 171 is disposed on the baffle 170. For example, only the heat dissipation holes disposed at the corresponding air outlets are taken as an example, and it should be understood that the heat dissipation holes may be disposed at other positions on the shutter 170. Embodiments of the present invention can enhance the protection capability of the heat sink, thereby enhancing the reliability of the heat sink 100 of the electronic component.

As shown in FIG. 6A, it is also possible to provide a duct on the back surface of the corresponding heat dissipating surface of the electronic component. For example, the duct may be composed of a sheet fin or a pin fin. The back side of the electronic component may or may not be a heat dissipating surface. In the embodiment of the present invention, only the air passage formed by the pin fins shown in FIG. 6A is disposed on the upper portion of the back surface as an example. It should be understood that the air passage may be disposed at the middle or the lower portion of the back surface. As shown in FIG. 6A, it is also possible to set the position of the air passage corresponding to the back surface on the side fence 170. The heat dissipation hole 172 is disposed. When a plurality of electronic components according to an embodiment of the present invention are assembled, as shown in FIG. 6B, the hot airflow discharged from the electronic component on the right side through the front cover 160 can pass through the air passage formed by the pin fins on the back side of the left electronic component. And the heat dissipation holes 172 on the side baffles are discharged. The embodiment of the invention can reduce the working resistance of the cross-flow fan and improve the overall heat dissipation capability of the multi-electronic component assembly.

In addition, the top cover 140, the front cover 160, and the side dam 170 may each be made of a heat conductive material, which can contribute to heat dissipation.

Those of ordinary skill in the art will appreciate that the elements and algorithm steps of the various examples described in connection with the embodiments disclosed herein can be implemented in electronic hardware or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the solution. A person skilled in the art can use different methods for implementing the described functions for each particular application, but such implementation should not be considered to be beyond the scope of the present invention.

A person skilled in the art can clearly understand that for the convenience and brevity of the description, the specific working process of the system, the device and the unit described above can refer to the corresponding process in the foregoing method embodiment, and details are not described herein again.

In the several embodiments provided by the present application, it should be understood that the disclosed systems, devices, and methods may be implemented in other manners. For example, the device embodiments described above are merely illustrative. For example, the division of the unit is only a logical function division. In actual implementation, there may be another division manner, for example, multiple units or components may be combined or Can be integrated into another system, or some features can be ignored or not executed. In addition, the mutual coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interface, device or unit, and may be in an electrical, mechanical or other form.

The units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of the embodiment.

In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated in one unit. In the unit.

The functions may be stored in a computer readable storage medium if implemented in the form of a software functional unit and sold or used as a standalone product. Based on such understanding, the technical solution of the present invention, which is essential or contributes to the prior art, or a part of the technical solution, may be embodied in the form of a software product, which is stored in a storage medium, including The instructions are used to cause a computer device (which may be a personal computer, server, or network device, etc.) to perform all or part of the steps of the methods described in various embodiments of the present invention. The foregoing storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, and the like, which can store program codes. .

The above is only a specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of changes or substitutions within the technical scope of the present invention. It should be covered by the scope of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

A heat dissipating device for an electronic component, characterized in that: the heat dissipating device comprises: a cross flow fan and a plurality of first fins disposed on a heat dissipating surface of the electronic component,

Forming a first heat dissipation channel between the adjacent first fins, the plurality of first fins forming a plurality of the first heat dissipation channels;

The cross flow fan is located at one end of the plurality of first fins, and the cross flow fan passes through the plurality of first heat dissipation channels;

The wind blown by the cross-flow fan enters the first heat dissipation passage, thereby facilitating heat dissipation of the plurality of first fins.
The heat dissipation device according to claim 1, further comprising:

a plurality of second fins, a second heat dissipation channel is formed between the adjacent second fins, and the plurality of second fins form a plurality of the second heat dissipation channels;

The cross flow fan is located at one end of the plurality of second fins, and the cross flow fan passes through the plurality of second heat dissipation channels;

The wind enters the second heat dissipation passage from the outside, and is blown into the cross flow fan through the second heat dissipation passage.
The heat dissipation device according to claim 2, wherein an axial length of the cross flow fan is greater than or equal to a distance between two outermost fins of the plurality of second fins, Wind output from each of the plurality of second heat dissipation channels is blown into the cross flow fan.
The heat dissipating device according to any one of claims 1 to 3, wherein an axial length of the cross flow fan is greater than or equal to two outermost two first fins of the plurality of first fins a distance between the wind blown by the cross flow fan into each of the plurality of first heat dissipation channels.
The heat sink according to any one of claims 1 to 4, wherein the cross flow fan comprises a plurality of sub-flow fans arranged in parallel along an axial direction of the cross flow fan.
The heat sink according to any one of claims 1 to 5, wherein the plurality of first fins are disposed at an upper portion of the cross flow fan, and the plurality of second fins are disposed at the The heat dissipating device further includes a top cover disposed on the top of the heat dissipating device to cover the plurality of first fins and the plurality of first heat dissipating passages.
The heat dissipating device according to claim 6, wherein the top cover is provided With vents,

The heat dissipation device further includes: a guiding structure, the introduction end of the guiding structure is disposed under the heat dissipation hole on the top cover, and the leading end of the guiding structure is disposed on the plurality of first heat dissipation Outside the passage, the liquid or debris entering from the louvers on the top cover is led out of the heat sink.
The heat dissipation device according to claim 6 or 7, further comprising:

a front cover plate disposed between the top cover plate and the cross flow fan, and outside of the plurality of first fins and the plurality of first heat dissipation channels, the plurality of first fins and The plurality of first heat dissipation channels are located between the heat dissipation surface of the electronic component and the front cover, and the front cover is provided with a labyrinth heat dissipation hole.
The heat dissipating device according to any one of claims 1 to 8, further comprising: a side baffle disposed on two sides of the heat dissipating device, wherein the side baffle is provided with a heat dissipation hole.
A base station comprising the heat sink, the radio remote unit RRU and the antenna according to any one of claims 1 to 9, wherein the heat sink is disposed on a heat dissipation surface of the RRU;

The RRU is configured to convert a baseband optical signal into a radio frequency signal, perform amplification processing on the radio frequency signal, and transmit the amplified radio frequency signal to the antenna for transmission through the antenna.