WO2015199128A1 - Electronic device and method for manufacturing same - Google Patents

Electronic device and method for manufacturing same Download PDF

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Publication number
WO2015199128A1
WO2015199128A1 PCT/JP2015/068194 JP2015068194W WO2015199128A1 WO 2015199128 A1 WO2015199128 A1 WO 2015199128A1 JP 2015068194 W JP2015068194 W JP 2015068194W WO 2015199128 A1 WO2015199128 A1 WO 2015199128A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
wiring
electronic device
layer
coating layer
Prior art date
Application number
PCT/JP2015/068194
Other languages
French (fr)
Japanese (ja)
Inventor
健史 伊藤
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP2016529628A priority Critical patent/JP6601396B2/en
Publication of WO2015199128A1 publication Critical patent/WO2015199128A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Definitions

  • the present invention relates to an electronic device whose shape is flexibly adapted to a place where a human body or an object moves or is curved, and a method for manufacturing the same.
  • This application claims priority based on Japanese Patent Application No. 2014-132162 for which it applied on June 27, 2014, and uses the content here.
  • vital information and physical information indicating individual life activity signs may be constantly monitored in the medical field.
  • the electronic device in order to always wear a desired electronic device on an individual's body and detect physical information, the electronic device needs to be flexible so that the subject can follow the movement of the body so that the subject can wear it without feeling uncomfortable. is there.
  • Patent Document 1 discloses a thin and flexible clothing pressure sensor that detects a clothing pressure using a strain gauge.
  • the clothing pressure sensor is used for solid pressure measurement of clothing clothing pressure.
  • the metal sheet is etched and bonded with a strain gauge, and the clothing pressure detection part with external lead wires attached is made of flexible material such as silicon rubber.
  • the housing is formed by integrally molding the material.
  • Patent Document 2 discloses a wearable self-supporting medical device having flexibility and conformality. Specifically, a wearable drug infusion device such as a patch pump replacing a conventional insulin pump is disclosed.
  • the installation place is limited in an apparatus in which a multifunctional device including a sensor, a memory, a microcomputer, an interface, a battery, and the like are integrally formed. Further, even if mounting components are integrated in order to reduce the area occupied by the device, there is a limit to downsizing, and the integration of mounting components may increase the thickness of the device and impair the ease of installation. is there.
  • the housing itself can be made thin by dispersing and mounting the mounting components on the wiring board, but since most of the mounting components are made of a rigid material, bending deformation Can not do it.
  • the wiring board is a flexible board (FPC: Flexible Printed Circuits)
  • FPC Flexible Printed Circuits
  • the tensile stress and compressive stress generated when the wiring board is bent increases in proportion to the distance in the thickness direction from the bending center.
  • the resin and the wiring board are in contact with each other or bonded together, so that the bending center is on the resin side or the wiring board side. Will move. In this case, the optimum bending center is shifted as viewed from the resin side or the wiring board side, and the bending deformation of the wiring board is hindered.
  • the present invention has been made in view of the above circumstances, and an object of the present invention is to provide an electronic device capable of reducing a tensile stress and a compressive stress to bend and deform with a small force and a manufacturing method thereof.
  • a part of a flexible wiring board, a flexible coating layer that covers the wiring board from the outside, and a coating layer and the wiring board are provided between the coating layer and the coating board.
  • the electronic device includes a sliding layer that allows relative displacement between the layer and the wiring board.
  • a wiring board having at least a part of flexibility is prepared, the wiring board is covered with a flexible coating layer from the outside, and a lubricant is provided between the coating layer and the wiring board.
  • a third aspect of the present invention at least a part of a flexible wiring board is prepared, a sliding layer that covers the wiring board from the outside is formed, and the wiring board covered with the sliding layer has flexibility. It is the manufacturing method of the electronic device covered with the coating layer.
  • the present invention is characterized in that a sliding layer that allows relative displacement between the wiring board and the coating layer is provided in the electronic device.
  • a sliding layer that allows relative displacement between the wiring board and the coating layer is provided in the electronic device.
  • FIG. 3 is a longitudinal sectional view taken along line II-II in FIG. 2. It is a side view which shows the state which curved the wiring board of the electronic device which concerns on Example 2.
  • FIG. 4 is a partially enlarged view of the vicinity of an electrode part in FIG. 3.
  • 6 is a longitudinal sectional view of a wiring board applied to an electronic apparatus according to Example 2.
  • FIG. It is a longitudinal cross-sectional view which shows the state which covered the wiring board with the sliding layer. It is a longitudinal cross-sectional view which shows the process of pinching
  • FIG. 9 is a flowchart illustrating a method for manufacturing an electronic apparatus according to a second embodiment. It is sectional drawing which shows the bending center and stress when a coating layer is curved alone. It is sectional drawing which shows the bending center and stress at the time of bending a wiring board independently. It is sectional drawing which shows the bending center and stress at the time of fixing and bending a wiring board and a coating layer. It is sectional drawing which shows the bending center and stress at the time of providing a sliding layer between a wiring board and a coating layer, and making it curve. 10 is a front view of a wiring board applied to an electronic device according to a modification of Example 2. FIG.
  • FIG. 16 is a front view showing a state in which the wiring board of FIG. 15 is curved. It is an enlarged view of the part which connects a board
  • FIG. 10 is an enlarged cross-sectional view of a second end portion of an electronic device according to a first modification of Example 3.
  • FIG. 10 is an enlarged cross-sectional view illustrating a state where an injection needle is inserted into an internal space of an electronic device according to a first modification example of Example 3.
  • 10 is an enlarged cross-sectional view showing a state after an injection needle is pulled out from an electronic apparatus according to a first modification of Example 3.
  • FIG. 12 is an enlarged cross-sectional view illustrating a state where a through hole of a coating layer is closed with a plug at a second end portion of an electronic device according to a second modification of Example 3. Will be described with reference to FIG.
  • FIG. 10 is an enlarged cross-sectional view showing a state in the middle of inserting an injection needle into a coating layer of an electronic device according to a third modification of Example 3.
  • FIG. It is an expanded sectional view showing the state where the injection needle was pulled out from the coating layer after injecting the lubricant into the coating layer of the electronic device according to the third modification of Example 3 to form the sliding layer 4.
  • It is a top view of the wiring board applied to the electronic device which concerns on Example 4 of this invention.
  • 6 is a plan view of a wiring board according to a first modification of Example 4.
  • FIG. 10 is a plan view of a wiring board according to a second modification of Example 4.
  • FIG. 10 is a plan view of a wiring board according to a third modification of Example 4.
  • FIG. 10 is a plan view of a wiring board according to a fourth modification of Example 4.
  • FIG. 10 is a front view of a wiring board according to a fourth modification of Example 4.
  • FIG. 10 is a front view of
  • FIG. 1 is a cross-sectional view of an electronic apparatus 1 according to Embodiment 1 of the present invention.
  • the electronic device 1 includes a wiring board 2, a covering layer 3, and a sliding layer 4. At least a part of the wiring board 2 has flexibility. That is, by applying an external force to the wiring board 2, at least a part thereof can be easily bent.
  • the covering layer 3 is formed of a flexible material such as a silicone resin or a low-hardness thermoplastic elastomer.
  • the covering layer 3 is formed sufficiently more flexibly than the wiring board 2.
  • the covering layer 3 is formed so as to cover the wiring board 2 from the outside.
  • the sliding layer 4 is disposed between the covering layer 3 and the wiring board 2.
  • the sliding layer 4 allows relative displacement between the covering layer 3 and the wiring board 2.
  • the sliding layer 4 reduces friction between the covering layer 3 and the wiring board 2, and enables the covering layer 3 to smoothly move in the direction along the front and back surfaces of the wiring board 2.
  • the sliding layer 4 is formed of an inert liquid or gel-like body mainly containing silicon, or a fluororesin.
  • the sliding layer 4 between the wiring board 2 and the coating layer 3 by providing the sliding layer 4 between the wiring board 2 and the coating layer 3, the inner surface of the coating layer 3 and the outer surface of the wiring board 2 are formed when the electronic device 1 is curved. Relative displacement is possible. Thereby, the tensile stress and compressive stress which act on the wiring board 2 and the coating layer 3 can be reduced, and the electronic device 1 can be curved smoothly. As a result, the flexibility of the electronic device 1 can be improved and curved and deformed with less force.
  • the electronic device 101 includes a wiring board 2, a covering layer 3, and a sliding layer 4.
  • FIG. 2 is a plan view of the electronic device 101.
  • FIG. 3 is a longitudinal sectional view taken along line II-II in FIG.
  • FIG. 4 is a side view showing a state in which the wiring board 2 of the electronic device 101 is bent.
  • the electronic device 101 according to the second embodiment is mounted on, for example, a human body and includes a detection unit (not shown) that detects the state of the human body.
  • the wiring board 2 includes a board part 5 and a wiring part 6.
  • the wiring board 2 includes a plurality of substrate portions 5 (specifically, five substrate portions 5).
  • the substrate part 5 is formed by laminating a metal wiring such as copper and an insulating member made of epoxy resin or the like. Therefore, the substrate part 5 itself does not have flexibility and does not bend easily.
  • Various mounting components 7 (for example, sensors, memories, microcomputers, interfaces, batteries, etc.) are mounted on the substrate unit 5.
  • the mounting component 7 is not flexible like the substrate portion 5. That is, by mounting the mounting component 7 on the board part 5, bending stress acting on the mounting component 7 can be reduced.
  • the electronic device 101 is formed by insert-molding the wiring board 2 with a flexible material, and the wiring board 2 can be bent as a multi-joint body.
  • the mounting component 7 may be coated with a hard resin or covered with a metal frame. In this case, since the mounting component 7 can be protected from external force, the connection reliability between the mounting component 7 and the board part 5 can be improved.
  • the substrate portions 5 are each formed in a rectangular plate shape. Among the five substrate portions 5 arranged on the wiring substrate 2, a battery 8 is mounted as a mounting component 7 on the central substrate portion 5.
  • FIG. 3 shows that the mounting component 7 is mounted on the surface of the board portion 5, the present invention is not limited to this.
  • the mounting component 7 may be mounted only on the back surface of the substrate unit 5 or may be mounted on the front and back surfaces of the substrate unit 5.
  • the wiring part 6 has flexibility and can be easily bent.
  • the wiring part 6 is formed so as to connect the adjacent substrate parts 5.
  • the wiring part 6 is formed by laminating a thin sheet-like insulating member (not shown) such as polyimide formed with a metal wiring (not shown) such as copper.
  • the wiring part 6 has a width dimension H1 smaller than a width dimension H2 of the board part 5.
  • the wiring part 6 is formed so that the width dimension gradually decreases toward the center position C1 (see FIG. 2) between the adjacent substrate parts 5.
  • the wiring portion 6 is formed in an arc shape in which both side portions in the width direction are recessed toward the center portion in the width direction.
  • the substrate portion 5 does not bend, but can be bent by the flexibility of the wiring portion 6.
  • the electrode portion 10 is omitted in FIG.
  • the sliding layer 4 is provided between the covering layer 3 and the wiring board 2. Specifically, the sliding layer 4 is provided between the mounting component 7 and the covering layer 3 at the place where the mounting component 7 of the wiring board 2 is mounted.
  • the sliding layer 4 is formed using an inert liquid or gel-like body mainly composed of silicon, a fluororesin having a low surface friction coefficient, or the like.
  • the sliding layer 4 is disposed so as to be in contact with the entire inner peripheral surface of the covering layer 3.
  • the sliding layer 4 can be formed on the wiring board 2 using a dip coater or a spray.
  • FIG. 5 is a partially enlarged view of FIG. 3 and shows the vicinity of the electrode portion 10 in the electronic apparatus 101 according to the second embodiment.
  • the wiring substrate 2 is provided with an electrode portion 10 for electrical connection with the outside of the covering layer 3.
  • the electrode portion 10 is formed on the substrate portion 10 at the extreme end.
  • the electrode part 10 is fixed to the covering layer 3 by an adhesive or the like.
  • An upper end portion 11 of the electrode portion 10 is exposed to the outside of the coating layer 3.
  • the electrode portion 10 extends in a direction intersecting with the longitudinal direction of the substrate portion 5.
  • the electrode unit 10 may be provided as necessary and may be omitted.
  • FIG. 6 is a longitudinal sectional view of the wiring board 2 applied to the electronic apparatus 101 according to the second embodiment.
  • FIG. 7 is a longitudinal sectional view showing a state in which the wiring board 2 is covered with the sliding layer 4.
  • FIG. 8 is a longitudinal sectional view showing a process of sandwiching the wiring board 2 between the upper coating layer 3a and the lower coating layer 3b.
  • FIG. 9 is a longitudinal sectional view showing a state in which the wiring board 2 is sealed with the coating layer 3.
  • FIG. 10 is a flowchart illustrating a method for manufacturing the electronic apparatus 101 according to the second embodiment.
  • the wiring board 2 shown in FIG. 6 is assembled (step S01). Further, the upper coating layer 3a and the lower coating layer 3b shown in FIG. 8 constituting the coating layer 3 are formed (step S02). Note that the order of assembly of the wiring board 2 and formation of the coating layer 3 is not limited to the order of steps S01 and S02.
  • the upper coating layer 3 a and the lower coating layer 3 b correspond to an upper part and a lower part obtained by dividing the coating layer 3 by a plane passing through the center in the thickness direction of the wiring board 2.
  • the upper coating layer 3 a includes a plurality of first recesses 13 for housing the mounting components 7.
  • the first recess 13 is formed following the shape of the mounted component 7 to be accommodated, and is formed in a space slightly larger than the mounted component 7. That is, the sliding layer 4 can be disposed in the gap between the inner surface of the first recess 13 and the mounting component 7.
  • a second concave portion 14 for accommodating the wiring portion 6 is formed between the adjacent first concave portions 13, a second concave portion 14 for accommodating the wiring portion 6 is formed.
  • the depth of the second recess 14 is sufficiently smaller than the depth of the first recess 13.
  • the second recess 14 is formed following the wiring portion 6 and is formed in a space slightly larger than the wiring portion 6.
  • the sliding layer 4 can be disposed in the gap between the inner surface of the second recess 14 and the wiring portion 6.
  • the lower coating layer 3 b includes a third recess 15.
  • the depth of the third recess 15 is approximately the same as that of the second recess 14. Thereby, a gap in which the sliding layer 4 can be disposed is formed also in the third recess 15.
  • the sliding layer 4 is formed so as to cover the outer surface of the wiring board 2 (step S03).
  • the wiring substrate 2 covered with the sliding layer 4 is sandwiched between the upper coating layer 3a and the lower coating layer 3b, and the outer edge portion 16a of the upper coating layer 3a and the outer edge portion 16b of the lower coating layer 3b.
  • the electrode part 10 is formed on the substrate part 5 on the extreme end side, the electrode part 10 and the coating layer 3 are bonded.
  • the wiring substrate 2 is sealed with the covering layer 3.
  • the size of the hatched portion indicates a change in stress.
  • the center of the coating layer 3 or the wiring board 2 in the thickness direction is bent. It becomes the center W. That is, the stress gradually increases in the symmetric direction from the bending center W of the coating layer 3 and the wiring substrate 2 toward both side portions in the thickness direction.
  • the wiring board 2 and the covering layer 3 are fixed as shown in FIG. 13, the bending center W is common to both, and when viewed from the wiring board 2, the bending center moves to the covering layer 3 side.
  • the bending center moves to the wiring board 2 side.
  • the bending center W is arranged at the boundary portion between the wiring board 2 and the covering layer 3. For this reason, the lower surface 18 of the wiring board 2 and the upper surface 17 of the covering layer 3 are separated from the bending center W, and the stress acting on the wiring board 2 and the covering layer 3 is increased.
  • the electronic device 101 according to the second embodiment includes the sliding layer 4 between the wiring board 2 and the coating layer 3.
  • the inner surface of the layer 3 and the outer surface of the wiring board 2 can be relatively displaced. Therefore, the electronic device 101 can be smoothly curved by reducing the tensile stress and the compressive stress acting on the wiring board 2 and the coating layer 3. As a result, the flexibility of the electronic device 101 can be improved and curved and deformed with a small force.
  • the wiring part 6 in which the mounting component 7 is not mounted among the wiring boards 2 is flexible, the wiring board 2 is curved as a whole even if the board part 5 on which the mounting component 7 is mounted is not curved. Can be made.
  • the wiring board 2 since the wiring board 2 is fixed to the coating layer 3 via the electrode portion 10, the wiring board 2 can be positioned with respect to the coating layer 3. As a result, the electronic device 101 can be bent stably. Further, since the electrode portion 10 extends in a direction intersecting with the longitudinal direction of the substrate portion 5, when the electronic device 101 is bent, a shearing force acts on the boundary portion between the electrode portion 10 and the coating layer 3. Can be prevented. As a result, the wiring board 2 and the coating layer 3 can be stably fixed.
  • the wiring substrate 2 covered with the sliding layer 4 is sandwiched between the upper coating layer 3a and the lower coating layer 3b, and the upper coating layer 3a and the lower coating layer 3b may be fixed to each other. Can be manufactured. As a result, the burden on the operator who manufactures the electronic device 101 can be reduced.
  • FIG. 15 is a front view of the wiring board 102 applied to the electronic device 101 according to the modification of the second embodiment.
  • FIG. 16 is a front view showing a state in which the wiring board 102 is bent.
  • FIG. 17 is an enlarged view of a portion where the substrate portion 5 and the wiring portion 6 are connected in the wiring substrate 102 of FIG.
  • FIG. 18 is an enlarged view of a portion where the substrate unit 5 and the wiring unit 6 are connected when the wiring substrate 102 is bent.
  • the wiring board 102 includes a board part 5 and a wiring part 6.
  • the wiring part 6 is formed continuously.
  • a mounting component 7 is mounted on the front surface 5 a of the substrate portion 5, and a part of the back surface 5 b opposite to the front surface 5 a is connected to the wiring portion 6.
  • the substrate unit 5 and the wiring unit 6 may be connected in part, and may be connected to the wiring unit 6 except for the central portion of the back surface 5b of the substrate unit 5.
  • the substrate unit 5 since the back surface 5b of the substrate unit 5 and the wiring unit 6 are partially connected in the wiring substrate 102, the substrate unit 5 does not prevent the entire wiring substrate 102 from being bent. Therefore, as shown in FIGS. 16 and 18, the entire wiring board 102 can be smoothly curved. As a result, the electronic device 101 can be bent and deformed with a small force.
  • the third embodiment is different from the above-described embodiment in that the sliding layer 4 is formed after the wiring substrate 2 is sealed with the covering layer 3 (that is, the step of covering the wiring substrate 2 with the covering layer 3). Therefore, in Example 3, the same part as the above-mentioned Example is attached
  • FIG. 19 is an enlarged cross-sectional view of the first end portion 25 of the electronic apparatus 201 according to the third embodiment.
  • FIG. 20 is an enlarged cross-sectional view of the second end portion 27 of the electronic apparatus 201 according to the third embodiment, and shows a state in which a lubricant that forms the sliding layer 4 is injected.
  • FIG. 21 is an enlarged cross-sectional view of the first end portion 25 of the electronic apparatus 201 according to the third embodiment, and shows a state where the injection needle 30 is inserted into the internal space.
  • FIG. 22 is an enlarged cross-sectional view of the first end portion 25 of the electronic apparatus 201 according to the third embodiment, and shows a state where the through hole 26 is filled with the filler 31 after the injection needle 30 is pulled out.
  • the electronic apparatus 201 communicates the internal space between the coating layer 3 and the wiring board 2 and the external space of the coating layer 3 at the first end 25 of the coating layer 3.
  • a through hole 26 is formed.
  • the through hole 26 is formed in the direction from the first end 25 of the coating layer 3 to the opposite side (that is, the second end 27).
  • a through hole 26 is also formed in the second end portion 27 of the coating layer 3.
  • a check valve 28 is provided on the inner peripheral surface of the covering layer 3 so that the liquid or the gel-like lubricant forming the sliding layer 4 does not leak to the outside from the through hole 26.
  • the check valve 28 is formed so that its end 29 can be elastically deformed from a closed position (see FIG. 19) where the through hole 26 is closed to an open position (see FIG. 21) where the through hole 26 is opened.
  • the check valve 28 is pressed by the injection needle 30 inserted into the through hole 26, the check valve 28 is displaced from the closed position to the open position.
  • the liquid or gel-like lubricant that forms the sliding layer 4 can be injected into the internal space between the wiring board 2 and the coating layer 3 via the injection needle 30.
  • the check valve 28 is displaced from the open position to the closed position by its elasticity.
  • the through hole 26 is closed by the end portion 29 of the check valve 28, and the lubricant can be prevented from temporarily leaking outside through the through hole 26.
  • the through-hole 26 after the injection needle 30 has been pulled out is filled with a filler 31 such as a modified silicon adhesive or silicon resin.
  • the sliding layer 4 is formed of a resin material having an extremely low hardness, the resin material can be prevented from leaking to the outside of the coating layer 3 by performing a curing process on the resin material.
  • the first modification of the third embodiment is different from the third embodiment in the structure related to prevention of leakage of the filler to the outside when the sliding layer 4 is formed. Therefore, in the 1st modification of Example 3, the same code
  • FIG. 23 is an enlarged cross-sectional view of the second end portion 27 of the electronic apparatus 201 according to the first modification of the third embodiment.
  • FIG. 24 is an enlarged cross-sectional view showing a state where the injection needle 30 is inserted into the internal space of the electronic apparatus 201.
  • FIG. 25 is an enlarged cross-sectional view showing a state after the injection needle 30 is pulled out from the electronic device 201.
  • a valve body 32 is integrally formed inside the through hole 26 in the coating layer 3 of the electronic device 201 according to the first modification of the third embodiment.
  • the valve body 32 is supported so that the upper part and the lower part of the through hole 26 can swing. Before the injection needle 30 is inserted, the valve body 32 closes the upper end portion and the lower end portion and closes the through hole 26.
  • the valve body 32 When the injection needle 30 is inserted into the through hole 26 of the coating layer 30, the valve body 32 is pressed by the injection needle 30 and swings toward the inside of the coating layer 3. Accordingly, the valve body 32 is in an open state in which the through hole 26 is opened, and the lubricant can be injected by the injection needle 30. Thereafter, as shown in FIG. 25, when the injection needle 30 is pulled out from the through hole 26, a lubricant such as a liquid forming the sliding layer 4 presses the valve body 32, and the valve body 32 closes the through hole 26. Return to the closed position. Accordingly, it is possible to prevent the lubricant such as the liquid forming the sliding layer 4 from leaking outside through the through hole 26.
  • Example 3 Compared with Example 3 and the first modified example, the second modified example is different in the structure for preventing leakage of the filler to the outside when the sliding layer 4 is formed. Therefore, the same parts as those in the third embodiment are denoted by the same reference numerals and the description thereof is omitted. 26 and 27, the wiring board 2 is not shown.
  • FIG. 26 is an enlarged cross-sectional view of the second end portion 27 of the coating layer 3 according to the second modification of the third embodiment, and shows a state after the operation of injecting the lubricant with the injection needle 30.
  • FIG. 27 is an enlarged cross-sectional view showing a state where the through hole 26 of the coating layer 3 is closed with the plug 33.
  • the second modification includes a plug 33 that closes the through hole 26 of the coating layer 3.
  • the plug 33 includes a main body portion 34 and a return portion 35.
  • the main body 34 has a diameter slightly larger than the diameter of the through hole 26.
  • the return portion 35 of the plug 33 has a surface extending radially outward from the main body portion 34, and the return portion 35 has a diameter sufficiently larger than that of the through hole 26. Therefore, when the plug 33 is inserted into the through hole 26 and the return portion 35 reaches the internal space of the coating layer 3, the return portion 35 is caught on the inner surface of the coating layer 3 around the through hole 26, and thus the plug 33. Is prevented from falling out of the through hole 26. As described above, it is possible to prevent the lubricant such as the liquid forming the sliding layer 4 from leaking outside through the through hole 26.
  • FIG. 28 is an enlarged cross-sectional view of the second end portion 27 of the electronic apparatus 201 according to the third modification of the third embodiment, and shows a state before the injection needle 30 is inserted into the coating layer 3.
  • FIG. 29 is an enlarged cross-sectional view showing a state in the middle of inserting the injection needle 30 into the coating layer 3 of the electronic device 201.
  • FIG. 30 is an enlarged cross-sectional view showing a state where the injection needle 30 is pulled out from the coating layer 3 after the lubricant is injected into the coating layer 3 of the electronic device 201 to form the sliding layer 4.
  • a cut 36 is formed instead of the through hole 26 in the second end portion 27 of the coating layer 3 of the electronic device 201.
  • the cut 36 is sealed by the tackiness of the flexible material forming the coating layer 3.
  • the injection needle 30 can be caused to enter the inner space of the coating layer 3 by spreading the cut 36 with the injection needle 30.
  • the cut 36 returns to the close contact state again. Therefore, it is possible to prevent a lubricant such as a liquid that forms the sliding layer 4 from leaking to the outside.
  • FIG. 31 is a plan view of the wiring board 2 according to the fourth embodiment of the present invention.
  • FIG. 32 is a plan view of the wiring board 2 according to a first modification of the fourth embodiment.
  • FIG. 33 is a plan view of the wiring board 2 according to a second modification of the fourth embodiment.
  • FIG. 34 is a plan view of the wiring board 2 according to a third modification of the fourth embodiment.
  • FIG. 35 is a plan view of the wiring board 2 according to a fourth modification of the fourth embodiment.
  • FIG. 36 is a front view of the wiring board 2 according to a fourth modification of the fourth embodiment.
  • the wiring board 2 includes a plurality of substrate parts 5 and a plurality of wiring parts 106.
  • the wiring part 106 has a surplus length. In other words, the entire length of the wiring portion 106 is longer than the gap between the adjacent substrate portions 5.
  • the wiring portion 106 shown in FIG. 31 has a surplus length that meanders in the width direction with respect to the longitudinal direction of the wiring substrate 2. Thereby, the wiring part 106 is easily deformed in the twisting direction.
  • the direction in which the wiring portion 106 meanders is not limited to the width direction of the wiring board 2.
  • the wiring part 106 may meander in the longitudinal direction of the wiring board 2.
  • the surplus length is formed by meandering the wiring portion 106, but the present invention is not limited to this.
  • the wiring part 106 may be formed obliquely with respect to the arrangement direction of the substrate parts 5. Further, as shown in FIG. 34, the wiring portions 106 may be alternately formed in an oblique direction. That is, the extending direction and angle of the wiring part 106 are not limited to a specific direction and angle.
  • the wiring portion 106 may meander in the thickness direction of the substrate portion 5.
  • the wiring board according to the above-described embodiments and modifications is provided with a substrate part having no flexibility and a wiring part having flexibility, the invention is not limited to this. If an electronic circuit can be mounted on the flexible portion of the wiring board, there is no need to provide a non-flexible substrate portion.
  • the wiring board may be configured by a flexible board (FPC). Even in this case, since the mounted component cannot be bent, it is only necessary to arrange the mounted component so as to be appropriately concentrated or dispersed on the wiring board.
  • the wiring board is composed of a board portion on which electronic components are mounted and a wiring portion having flexibility
  • the electronic device can be attached by adapting the shape to various objects. It can be applied to a wide range of applications.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)

Abstract

　An electronic device (101) having a shape that flexibly adapts to curved locations or places where people or objects move is formed by insert-molding a wiring substrate (2) in a flexible material. Specifically, the electronic device (101) is provided with the wiring substrate (2), at least a portion of which is flexible; a flexible covering layer (3) for covering the wiring substrate (2) from the outside; and a sliding layer (4) provided between the covering layer (3) and the wiring substrate (2), the sliding layer (4) allowing relative displacement between the covering layer (3) and the wiring substrate (2). The wiring substrate (2) is composed of a plurality of substrate parts (5) on which mounting components (7) are mounted, and a flexible wiring part (6) for linking the substrate parts (5) together. It is thereby possible for the electronic device (101) to be bent into a curve for use as a multi-jointed unit. Forming the sliding layer (4) reduces the tensile stress and the compressive stress, so that the electronic device (101) can be bent into a curve with minimal force.

Description

電子機器およびその製造方法Electronic device and manufacturing method thereof
　本発明は、人体や物体における動きのある場所や湾曲した箇所に対して形状が柔軟に適応する電子機器およびその製造方法に関する。
　本願は、２０１４年６月２７日に出願された日本国の特願２０１４－１３２１６２号に基づき優先権を主張し、その内容をここに援用する。 The present invention relates to an electronic device whose shape is flexibly adapted to a place where a human body or an object moves or is curved, and a method for manufacturing the same.
This application claims priority based on Japanese Patent Application No. 2014-132162 for which it applied on June 27, 2014, and uses the content here.
　社会の様々な課題を解決するためにビッグデータを活用する方法が知られており、電子機器を用いてインフラストラクチャ、構造物、地球環境、自動車、人間などの種々の対象物から情報やデータを収集している。電子機器は種々の対象物に対して容易かつ確実に取り付けられることが望ましい。 There is a known method of using big data to solve various social issues, and information and data can be obtained from various objects such as infrastructure, structures, global environment, automobiles, and humans using electronic devices. Collecting. It is desirable that the electronic device is easily and reliably attached to various objects.
　例えば、ヘルスケア分野では医療現場において個人の生命活動徴候を示すバイタル情報や身体情報を常時監視することがある。この場合、所望の電子機器を個人の身体に常時装着して身体情報を検出するために、電子機器は被験者が違和感なく装着できるように身体の動きに追従可能な柔軟性を有することが必要である。 For example, in the healthcare field, vital information and physical information indicating individual life activity signs may be constantly monitored in the medical field. In this case, in order to always wear a desired electronic device on an individual's body and detect physical information, the electronic device needs to be flexible so that the subject can follow the movement of the body so that the subject can wear it without feeling uncomfortable. is there.
　特許文献１はひずみゲージを利用して衣服の着衣圧を検出する薄型で柔軟な着衣圧センサを開示している。当該着衣圧センサは衣服の着衣圧の固体圧力測定に供されるものであり、金属シートをエッチング加工してひずみゲージを接着し、外部リード線を取り付けた着衣圧検出部をシリコンゴムなどの柔軟材料で一体成形して筐体を構成している。特許文献２は可撓性および共形性を有する着用可能な自立型の医療デバイスを開示している。具体的には、従来のインスリンポンプに代わるパッチポンプなどの着用可能な薬剤注入デバイスを開示している。 Patent Document 1 discloses a thin and flexible clothing pressure sensor that detects a clothing pressure using a strain gauge. The clothing pressure sensor is used for solid pressure measurement of clothing clothing pressure. The metal sheet is etched and bonded with a strain gauge, and the clothing pressure detection part with external lead wires attached is made of flexible material such as silicon rubber. The housing is formed by integrally molding the material. Patent Document 2 discloses a wearable self-supporting medical device having flexibility and conformality. Specifically, a wearable drug infusion device such as a patch pump replacing a conventional insulin pump is disclosed.
特開２０１１－２０９２５５号公報JP 2011-209255 A 特表２０１３－５０３６９２号公報Special Table 2013-201392
　特許文献１に記載の着衣圧センサのようにセンサ単独での占有領域が小さく肉薄であるデバイスであれば設置場所の制限は少ない。しかし、センサ、メモリ、マイクロコンピュータ、インタフェース、および電池などを備えた多機能なデバイスを一体成形した装置では設置場所が制限される。また、当該装置の占有領域を小さくするために実装部品を集積しても小型化には限界があり、実装部品を集積することにより装置の厚さが増して設置容易性が損なわれる可能性がある。 If the device occupies a small area and is thin like the clothing pressure sensor described in Patent Document 1, there are few restrictions on the installation location. However, the installation place is limited in an apparatus in which a multifunctional device including a sensor, a memory, a microcomputer, an interface, a battery, and the like are integrally formed. Further, even if mounting components are integrated in order to reduce the area occupied by the device, there is a limit to downsizing, and the integration of mounting components may increase the thickness of the device and impair the ease of installation. is there.
　一方、占有領域は大きくなるが実装部品を配線基板上に分散して実装することで筐体自身の薄型化を図ることができるが、実装部品の殆どは剛性材料で生成されているため湾曲変形することができない。しかし、配線基板をフレキシブル基板（ＦＰＣ：Ｆｌｅｘｉｂｌｅ　Ｐｒｉｎｔｅｄ　Ｃｉｒｃｕｉｔｓ）にすることで実装部品のない部分では若干湾曲変形することができる。これにより、人体の動きのある場所や湾曲した箇所に対する適合性を向上することができる。 On the other hand, although the occupied area becomes large, the housing itself can be made thin by dispersing and mounting the mounting components on the wiring board, but since most of the mounting components are made of a rigid material, bending deformation Can not do it. However, when the wiring board is a flexible board (FPC: Flexible Printed Circuits), it can be slightly bent and deformed in a portion where there is no mounted component. Thereby, the adaptability with respect to the place with a motion of a human body or the curved part can be improved.
　しかし、配線基板を柔軟材料で一体成形すると、配線基板を湾曲させた場合に発生する引張応力や圧縮応力は曲げ中心からの厚さ方向の距離に比例して大きくなる。十分な柔軟性を備えた樹脂と湾曲変形し易く形成された薄型の配線基板について考察すると、当該樹脂と配線基板とが互いに接触または張り合わされることで、樹脂側または配線基板側に曲げ中心が移動することとなる。この場合、樹脂側または配線基板側からみて最適な曲げ中心がずれることとなり、当該配線基板の湾曲変形が阻害されてしまう。 However, when the wiring board is integrally formed of a flexible material, the tensile stress and compressive stress generated when the wiring board is bent increases in proportion to the distance in the thickness direction from the bending center. Considering a resin with sufficient flexibility and a thin wiring board that is easily bent and deformed, the resin and the wiring board are in contact with each other or bonded together, so that the bending center is on the resin side or the wiring board side. Will move. In this case, the optimum bending center is shifted as viewed from the resin side or the wiring board side, and the bending deformation of the wiring board is hindered.
　本発明は上記事情に鑑みてなされたものであり、引張応力および圧縮応力を低減して少ない力で湾曲変形させることが可能な電子機器およびその製造方法を提供することを目的とする。 The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an electronic device capable of reducing a tensile stress and a compressive stress to bend and deform with a small force and a manufacturing method thereof.
　本発明の第一の態様は、少なくとも一部が可撓性を有する配線基板と、配線基板を外側から覆う可撓性を有する被覆層と、被覆層と配線基板との間に設けられ、被覆層と配線基板との相対変位を許容する滑り層とを具備する電子機器である。 According to a first aspect of the present invention, at least a part of a flexible wiring board, a flexible coating layer that covers the wiring board from the outside, and a coating layer and the wiring board are provided between the coating layer and the coating board. The electronic device includes a sliding layer that allows relative displacement between the layer and the wiring board.
　本発明の第二の態様は、少なくとも一部が可撓性を有する配線基板を用意し、配線基板を外側から可撓性を有する被覆層で覆い、被覆層と配線基板との間に潤滑剤を注入して滑り層を形成するようにした電子機器の製造方法である。 According to a second aspect of the present invention, a wiring board having at least a part of flexibility is prepared, the wiring board is covered with a flexible coating layer from the outside, and a lubricant is provided between the coating layer and the wiring board. This is a method for manufacturing an electronic device in which a slip layer is formed by injecting.
　本発明の第三の態様は、少なくとも一部が可撓性を有する配線基板を用意し、配線基板を外側から覆う滑り層を形成し、滑り層で覆われた配線基板を可撓性を有する被覆層で覆うようにした電子機器の製造方法である。 According to a third aspect of the present invention, at least a part of a flexible wiring board is prepared, a sliding layer that covers the wiring board from the outside is formed, and the wiring board covered with the sliding layer has flexibility. It is the manufacturing method of the electronic device covered with the coating layer.
　本発明は、電子機器において配線基板と被覆層との間に両者の相対変位を許容する滑り層を設けたことを特徴としている。滑り層を形成することにより、配線基板や被覆層に作用する引張応力や圧縮応力を低減して小さい力で電子機器を湾曲変形することができる。 The present invention is characterized in that a sliding layer that allows relative displacement between the wiring board and the coating layer is provided in the electronic device. By forming the sliding layer, it is possible to reduce the tensile stress and the compressive stress acting on the wiring board and the coating layer and to bend and deform the electronic device with a small force.
本発明の実施例１に係る電子機器の断面図である。It is sectional drawing of the electronic device which concerns on Example 1 of this invention. 本発明の実施例２に係る電子機器の平面図である。It is a top view of the electronic device which concerns on Example 2 of this invention. 図２のＩＩ－ＩＩ線に沿う縦断面図である。FIG. 3 is a longitudinal sectional view taken along line II-II in FIG. 2. 実施例２に係る電子機器の配線基板を湾曲させた状態を示す側面図である。It is a side view which shows the state which curved the wiring board of the electronic device which concerns on Example 2. FIG. 図３の電極部近傍の一部拡大図である。FIG. 4 is a partially enlarged view of the vicinity of an electrode part in FIG. 3. 実施例２に係る電子機器に適用される配線基板の縦断面図である。6 is a longitudinal sectional view of a wiring board applied to an electronic apparatus according to Example 2. FIG. 配線基板を滑り層で覆った状態を示す縦断面図である。It is a longitudinal cross-sectional view which shows the state which covered the wiring board with the sliding layer. 配線基板を上部被覆層と下部被覆層とによって挟み込む工程を示す縦断面図である。It is a longitudinal cross-sectional view which shows the process of pinching | interposing a wiring board by an upper coating layer and a lower coating layer. 配線基板を被覆層によって封止した状態を示す縦断面図である。It is a longitudinal cross-sectional view which shows the state which sealed the wiring board with the coating layer. 実施例２に係る電子機器の製造方法を示すフローチャートである。9 is a flowchart illustrating a method for manufacturing an electronic apparatus according to a second embodiment. 被覆層を単体で湾曲させた場合の曲げ中心および応力を示す断面図である。It is sectional drawing which shows the bending center and stress when a coating layer is curved alone. 配線基板を単体で湾曲させた場合の曲げ中心および応力を示す断面図である。It is sectional drawing which shows the bending center and stress at the time of bending a wiring board independently. 配線基板と被覆層とを固定して湾曲させた場合の曲げ中心および応力を示す断面図である。It is sectional drawing which shows the bending center and stress at the time of fixing and bending a wiring board and a coating layer. 配線基板と被覆層との間に滑り層を設けて湾曲させた場合の曲げ中心および応力を示す断面図である。It is sectional drawing which shows the bending center and stress at the time of providing a sliding layer between a wiring board and a coating layer, and making it curve. 実施例２の変形例に係る電子機器に適用される配線基板の正面図である。10 is a front view of a wiring board applied to an electronic device according to a modification of Example 2. FIG. 図１５の配線基板を湾曲させた状態を示す正面図である。FIG. 16 is a front view showing a state in which the wiring board of FIG. 15 is curved. 図１５の配線基板において基板部と配線部とを接続する部分の拡大図である。It is an enlarged view of the part which connects a board | substrate part and a wiring part in the wiring board of FIG. 図１５の配線基板を湾曲させた場合の基板部と配線部とを接続する部分の拡大図である。It is an enlarged view of the part which connects a board | substrate part and wiring part at the time of curving the wiring board of FIG. 本発明の実施例３に係る電子機器の第一端部の拡大断面図である。It is an expanded sectional view of the 1st end part of the electronic device which concerns on Example 3 of this invention. 実施例３に係る電子機器の第二端部の拡大断面図であり、滑り層を形成する潤滑剤を注入している状態を示している。It is an expanded sectional view of the 2nd edge part of the electronic device which concerns on Example 3, and has shown the state which has inject | poured the lubricant which forms a sliding layer. 実施例３に係る電子機器の第一端部の拡大断面図であり、注入針を内部空間に挿入した状態を示している。It is an expanded sectional view of the 1st end part of the electronic device which concerns on Example 3, and has shown the state which inserted the injection needle into internal space. 実施例３に係る電子機器の第一端部の拡大断面図であり、注入針を引き抜いた後に貫通孔に充填材を充填した状態を示している。It is an expanded sectional view of the 1st end part of the electronic device which concerns on Example 3, and has shown the state which filled the through-hole with the filler after extracting the injection needle. 実施例３の第一変形例に係る電子機器の第二端部の拡大断面図である。FIG. 10 is an enlarged cross-sectional view of a second end portion of an electronic device according to a first modification of Example 3. 実施例３の第一変形例に係る電子機器の内部空間に注入針を挿入した状態を示す拡大断面図である。FIG. 10 is an enlarged cross-sectional view illustrating a state where an injection needle is inserted into an internal space of an electronic device according to a first modification example of Example 3. 実施例３の第一変形例に係る電子機器から注入針を引き抜いた後の状態を示す拡大断面図である。10 is an enlarged cross-sectional view showing a state after an injection needle is pulled out from an electronic apparatus according to a first modification of Example 3. FIG. 実施例３の第二変形例に係る電子機器の第二端部の拡大断面図であり、注入針による潤滑剤の注入作業後の状態を示している。It is an expanded sectional view of the 2nd edge part of the electronic device which concerns on the 2nd modification of Example 3, and has shown the state after the injection | pouring operation | work of the lubricant by an injection needle. 実施例３の第二変形例に係る電子機器の第二端部において、被覆層の貫通孔をプラグで閉塞した状態を示す拡大断面図である。を参照して説明する。FIG. 12 is an enlarged cross-sectional view illustrating a state where a through hole of a coating layer is closed with a plug at a second end portion of an electronic device according to a second modification of Example 3. Will be described with reference to FIG. 実施例３の第三変形例に係る電子機器の第二端部の拡大断面図であり、注入針を被覆層内に挿入する前の状態を示す。It is an expanded sectional view of the 2nd edge part of the electronic device which concerns on the 3rd modification of Example 3, and shows the state before inserting an injection needle in a coating layer. 実施例３の第三変形例に係る電子機器の被覆層内に注入針を挿入している途中の状態を示す拡大断面図である。10 is an enlarged cross-sectional view showing a state in the middle of inserting an injection needle into a coating layer of an electronic device according to a third modification of Example 3. FIG. 実施例３の第三変形例に係る電子機器の被覆層内に潤滑剤を注入して滑り層４を形成した後に注入針を被覆層から引き抜いた状態を示す拡大断面図である。It is an expanded sectional view showing the state where the injection needle was pulled out from the coating layer after injecting the lubricant into the coating layer of the electronic device according to the third modification of Example 3 to form the sliding layer 4. 本発明の実施例４に係る電子機器に適用される配線基板の平面図である。It is a top view of the wiring board applied to the electronic device which concerns on Example 4 of this invention. 実施例４の第一変形例に係る配線基板の平面図である。6 is a plan view of a wiring board according to a first modification of Example 4. FIG. 実施例４の第二変形例に係る配線基板の平面図である。10 is a plan view of a wiring board according to a second modification of Example 4. FIG. 実施例４の第三変形例に係る配線基板の平面図である。10 is a plan view of a wiring board according to a third modification of Example 4. FIG. 実施例４の第四変形例に係る配線基板の平面図である。10 is a plan view of a wiring board according to a fourth modification of Example 4. FIG. 実施例４の第四変形例に係る配線基板の正面図である。10 is a front view of a wiring board according to a fourth modification of Example 4. FIG.
　本発明に係る電子機器およびその製造方法について実施例とともに添付図面を参照して詳細に説明する。 The electronic device and the manufacturing method thereof according to the present invention will be described in detail with reference to the accompanying drawings together with examples.
　図１は、本発明の実施例１に係る電子機器１の断面図である。電子機器１は、配線基板２、被覆層３、および滑り層４から構成される。配線基板２は少なくともその一部が可撓性を有している。即ち、配線基板２に外力を加えることにより少なくともその一部を容易に湾曲させることができる。 FIG. 1 is a cross-sectional view of an electronic apparatus 1 according to Embodiment 1 of the present invention. The electronic device 1 includes a wiring board 2, a covering layer 3, and a sliding layer 4. At least a part of the wiring board 2 has flexibility. That is, by applying an external force to the wiring board 2, at least a part thereof can be easily bent.
　被覆層３は、シリコン樹脂や低硬度の熱可塑性エラストマなどの可撓性を有する柔軟材料により形成される。被覆層３は、配線基板２よりも十分に柔軟に形成される。被覆層３は、配線基板２を外部から覆うように形成されている。 The covering layer 3 is formed of a flexible material such as a silicone resin or a low-hardness thermoplastic elastomer. The covering layer 3 is formed sufficiently more flexibly than the wiring board 2. The covering layer 3 is formed so as to cover the wiring board 2 from the outside.
　滑り層４は、被覆層３と配線基板２との間に配置されている。滑り層４は、被覆層３と配線基板２との相対変位を許容する。言い換えれば、滑り層４は被覆層３と配線基板２との間の摩擦を低減するものであり、配線基板２の表裏面に沿う方向へ被覆層３が円滑に相対移動することを可能としている。例えば、滑り層４はシリコンを主とした不活性な液体やゲル状体、又はフッ素樹脂で形成される。 The sliding layer 4 is disposed between the covering layer 3 and the wiring board 2. The sliding layer 4 allows relative displacement between the covering layer 3 and the wiring board 2. In other words, the sliding layer 4 reduces friction between the covering layer 3 and the wiring board 2, and enables the covering layer 3 to smoothly move in the direction along the front and back surfaces of the wiring board 2. . For example, the sliding layer 4 is formed of an inert liquid or gel-like body mainly containing silicon, or a fluororesin.
　本発明の実施例１によれば、配線基板２と被覆層３との間に滑り層４を設けることで、電子機器１を湾曲する場合に被覆層３の内面と配線基板２の外面とが相対変位可能となる。これにより、配線基板２や被覆層３に作用する引張応力および圧縮応力を低減して電子機器１を円滑に湾曲させることができる。その結果、電子機器１の柔軟性を向上してより少ない力で湾曲変形させることができる。 According to the first embodiment of the present invention, by providing the sliding layer 4 between the wiring board 2 and the coating layer 3, the inner surface of the coating layer 3 and the outer surface of the wiring board 2 are formed when the electronic device 1 is curved. Relative displacement is possible. Thereby, the tensile stress and compressive stress which act on the wiring board 2 and the coating layer 3 can be reduced, and the electronic device 1 can be curved smoothly. As a result, the flexibility of the electronic device 1 can be improved and curved and deformed with less force.
　次に、本発明の実施例２に係る電子機器１０１について添付図面を参照して詳細に説明する。電子機器１０１は配線基板２、被覆層３、および滑り層４を具備している。図２は、電子機器１０１の平面図である。図３は、図２のＩＩ－ＩＩ線に沿う縦断面図である。図４は、電子機器１０１の配線基板２を湾曲させた状態を示す側面図である。実施例２に係る電子機器１０１は、例えば、人体等に装着されるものであり、人体等の状態を検出する検出部（不図示）を具備している。 Next, the electronic apparatus 101 according to the second embodiment of the present invention will be described in detail with reference to the accompanying drawings. The electronic device 101 includes a wiring board 2, a covering layer 3, and a sliding layer 4. FIG. 2 is a plan view of the electronic device 101. FIG. 3 is a longitudinal sectional view taken along line II-II in FIG. FIG. 4 is a side view showing a state in which the wiring board 2 of the electronic device 101 is bent. The electronic device 101 according to the second embodiment is mounted on, for example, a human body and includes a detection unit (not shown) that detects the state of the human body.
　電子機器１０１において、配線基板２は基板部５と配線部６とを具備している。配線基板２は複数の基板部５（具体的には、５つの基板部５）を具備している。基板部５は、銅などの金属配線とエポキシ樹脂等からなる絶縁部材とを積層して形成されている。そのため、基板部５自体は可撓性を有しておらず容易に撓まない。基板部５には各種の実装部品７（例えば、センサ、メモリ、マイクロコンピュータ、インタフェース、電池、等）が実装されている。実装部品７も基板部５と同様に可撓性を有していない。つまり、実装部品７を基板部５に実装することで、実装部品７に作用する曲げ応力を低減することができる。電子機器１０１は配線基板２を柔軟材料でインサート成型して形成されており、配線基板２は多関節体として湾曲させることができる。 In the electronic device 101, the wiring board 2 includes a board part 5 and a wiring part 6. The wiring board 2 includes a plurality of substrate portions 5 (specifically, five substrate portions 5). The substrate part 5 is formed by laminating a metal wiring such as copper and an insulating member made of epoxy resin or the like. Therefore, the substrate part 5 itself does not have flexibility and does not bend easily. Various mounting components 7 (for example, sensors, memories, microcomputers, interfaces, batteries, etc.) are mounted on the substrate unit 5. The mounting component 7 is not flexible like the substrate portion 5. That is, by mounting the mounting component 7 on the board part 5, bending stress acting on the mounting component 7 can be reduced. The electronic device 101 is formed by insert-molding the wiring board 2 with a flexible material, and the wiring board 2 can be bent as a multi-joint body.
　例えば、実装部品７には硬質樹脂を塗布したり金属等のフレームを被せたりしてもよい。この場合、実装部品７を外力から保護することができるので、実装部品７と基板部５との間の接続信頼性を向上することができる。電子機器１０１の配線基板２において、基板部５はそれぞれ矩形板状に形成されている。配線基板２に配列された５つの基板部５のうち、中央の基板部５には実装部品７として電池８が実装されている。尚、図３では実装部品７が基板部５の表面に実装されていることを示しているが、これに限定されるものではない。例えば、実装部品７を基板部５の裏面のみに実装してもよく、或いは、基板部５の表裏面に実装してもよい。 For example, the mounting component 7 may be coated with a hard resin or covered with a metal frame. In this case, since the mounting component 7 can be protected from external force, the connection reliability between the mounting component 7 and the board part 5 can be improved. In the wiring substrate 2 of the electronic device 101, the substrate portions 5 are each formed in a rectangular plate shape. Among the five substrate portions 5 arranged on the wiring substrate 2, a battery 8 is mounted as a mounting component 7 on the central substrate portion 5. Although FIG. 3 shows that the mounting component 7 is mounted on the surface of the board portion 5, the present invention is not limited to this. For example, the mounting component 7 may be mounted only on the back surface of the substrate unit 5 or may be mounted on the front and back surfaces of the substrate unit 5.
　配線部６は、可撓性を有し容易に湾曲させることができる。配線部６は、隣接する基板部５の間を接続するように形成されている。例えば、配線部６はポリイミドなどの薄いシート状の絶縁部材（不図示）に銅などの金属配線（不図示）を形成したものを積層してなる。実施例２に係る電子機器１０１の配線基板２において、配線部６はその幅寸法Ｈ１が基板部５の幅寸法Ｈ２よりも小さくされている。また、配線部６は隣接する基板部５間の中央位置Ｃ１（図２参照）に向かってその幅寸法が漸次減少するように形成されている。具体的には、配線部６はその幅方向の両側部分が幅方向の中央部に向かって凹んだ円弧状に形成されている。 The wiring part 6 has flexibility and can be easily bent. The wiring part 6 is formed so as to connect the adjacent substrate parts 5. For example, the wiring part 6 is formed by laminating a thin sheet-like insulating member (not shown) such as polyimide formed with a metal wiring (not shown) such as copper. In the wiring board 2 of the electronic device 101 according to the second embodiment, the wiring part 6 has a width dimension H1 smaller than a width dimension H2 of the board part 5. Moreover, the wiring part 6 is formed so that the width dimension gradually decreases toward the center position C1 (see FIG. 2) between the adjacent substrate parts 5. Specifically, the wiring portion 6 is formed in an arc shape in which both side portions in the width direction are recessed toward the center portion in the width direction.
　つまり、図４に示すように、配線基板２では基板部５が湾曲しないものの、配線部６の可撓性によって湾曲させることができる。図示都合上、図４では電極部１０を省略している。 That is, as shown in FIG. 4, in the wiring substrate 2, the substrate portion 5 does not bend, but can be bent by the flexibility of the wiring portion 6. For convenience of illustration, the electrode portion 10 is omitted in FIG.
　図３に示すように、滑り層４は被覆層３と配線基板２との間に設けられている。具体的には、配線基板２の実装部品７が実装されている箇所において滑り層４は実装部品７と被覆層３との間に設けられている。滑り層４はシリコンを主とした不活性な液体やゲル状体、および、表面の摩擦係数が低いフッ素樹脂などを用いて形成される。実施例２に係る電子機器１０１において、滑り層４は被覆層３の内周面の全域に接するよう配置されている。滑り層４は、配線基板２に対してディップコータやスプレーを用いて形成することができる。 As shown in FIG. 3, the sliding layer 4 is provided between the covering layer 3 and the wiring board 2. Specifically, the sliding layer 4 is provided between the mounting component 7 and the covering layer 3 at the place where the mounting component 7 of the wiring board 2 is mounted. The sliding layer 4 is formed using an inert liquid or gel-like body mainly composed of silicon, a fluororesin having a low surface friction coefficient, or the like. In the electronic device 101 according to the second embodiment, the sliding layer 4 is disposed so as to be in contact with the entire inner peripheral surface of the covering layer 3. The sliding layer 4 can be formed on the wiring board 2 using a dip coater or a spray.
　図５は図３の一部拡大図であり、実施例２に係る電子機器１０１における電極部１０の近傍部分を示している。図３及び図５に示すように、配線基板２には被覆層３の外部との電気接続を行うための電極部１０が設けられている。具体的には、実施例２に係る電子機器１０１の配線基板２には５つの基板部５が設けられているが、最端部分の基板部１０上に電極部１０が形成されている。電極部１０は、被覆層３に対して接着材などにより密着固定されている。電極部１０の上端部分１１は被覆層３の外部に露出している。電極部１０は基板部５の長手方向と交差する方向に延伸している。尚、電極部１０は必要に応じて設ければよく、省略してもよい。 FIG. 5 is a partially enlarged view of FIG. 3 and shows the vicinity of the electrode portion 10 in the electronic apparatus 101 according to the second embodiment. As shown in FIGS. 3 and 5, the wiring substrate 2 is provided with an electrode portion 10 for electrical connection with the outside of the covering layer 3. Specifically, five substrate portions 5 are provided on the wiring substrate 2 of the electronic apparatus 101 according to the second embodiment, but the electrode portion 10 is formed on the substrate portion 10 at the extreme end. The electrode part 10 is fixed to the covering layer 3 by an adhesive or the like. An upper end portion 11 of the electrode portion 10 is exposed to the outside of the coating layer 3. The electrode portion 10 extends in a direction intersecting with the longitudinal direction of the substrate portion 5. The electrode unit 10 may be provided as necessary and may be omitted.
　次に、実施例２に係る電子機器１０１の製造方法について添付図面を参照して詳細に説明する。
　図６は、実施例２に係る電子機器１０１に適用される配線基板２の縦断面図である。図７は、配線基板２を滑り層４で覆った状態を示す縦断面図である。図８は、配線基板２を上部被覆層３ａと下部被覆層３ｂとによって挟み込む工程を示す縦断面図である。図９は、配線基板２を被覆層３によって封止した状態を示す縦断面図である。図１０は、実施例２に係る電子機器１０１の製造方法を示すフローチャートである。 Next, a method for manufacturing the electronic apparatus 101 according to the second embodiment will be described in detail with reference to the accompanying drawings.
FIG. 6 is a longitudinal sectional view of the wiring board 2 applied to the electronic apparatus 101 according to the second embodiment. FIG. 7 is a longitudinal sectional view showing a state in which the wiring board 2 is covered with the sliding layer 4. FIG. 8 is a longitudinal sectional view showing a process of sandwiching the wiring board 2 between the upper coating layer 3a and the lower coating layer 3b. FIG. 9 is a longitudinal sectional view showing a state in which the wiring board 2 is sealed with the coating layer 3. FIG. 10 is a flowchart illustrating a method for manufacturing the electronic apparatus 101 according to the second embodiment.
　先ず、図６に示す配線基板２を組み立てる（ステップＳ０１）。また、被覆層３を構成する図８に示す上部被覆層３ａおよび下部被覆層３ｂを形成する（ステップＳ０２）。尚、配線基板２の組立てと被覆層３の形成との順序はステップＳ０１、Ｓ０２の順序に限定されるものではない。ここで、上部被覆層３ａと下部被覆層３ｂとは被覆層３を配線基板２の厚さ方向の中央を通る面で分割した上側部分と下側部分とに相当する。 First, the wiring board 2 shown in FIG. 6 is assembled (step S01). Further, the upper coating layer 3a and the lower coating layer 3b shown in FIG. 8 constituting the coating layer 3 are formed (step S02). Note that the order of assembly of the wiring board 2 and formation of the coating layer 3 is not limited to the order of steps S01 and S02. Here, the upper coating layer 3 a and the lower coating layer 3 b correspond to an upper part and a lower part obtained by dividing the coating layer 3 by a plane passing through the center in the thickness direction of the wiring board 2.
　上部被覆層３ａは、実装部品７を収納する複数の第一凹部１３を備えている。第一凹部１３は収納する実装部品７の形状に倣って形成されるとともに、当該実装部品７よりも僅かに大きな空間で形成されている。即ち、第一凹部１３の内面と実装部品７との間隙には滑り層４を配置することができる。隣接する第一凹部１３の間には配線部６を収納する第二凹部１４が形成されている。第二凹部１４の深さは第一凹部１３の深さよりも十分に小さくされている。第一凹部１３と同様に、第二凹部１４は配線部６に倣って形成されるとともに、当該配線部６よりも僅かに大きな空間で形成されている。即ち、第二凹部１４の内面と配線部６との間隙には滑り層４を配置することができる。一方、下部被覆層３ｂは第三凹部１５を備えている。第三凹部１５の深さは第二凹部１４と同程度とされている。これにより、第三凹部１５内にも滑り層４を配置可能な間隙が形成される。 The upper coating layer 3 a includes a plurality of first recesses 13 for housing the mounting components 7. The first recess 13 is formed following the shape of the mounted component 7 to be accommodated, and is formed in a space slightly larger than the mounted component 7. That is, the sliding layer 4 can be disposed in the gap between the inner surface of the first recess 13 and the mounting component 7. Between the adjacent first concave portions 13, a second concave portion 14 for accommodating the wiring portion 6 is formed. The depth of the second recess 14 is sufficiently smaller than the depth of the first recess 13. Similar to the first recess 13, the second recess 14 is formed following the wiring portion 6 and is formed in a space slightly larger than the wiring portion 6. That is, the sliding layer 4 can be disposed in the gap between the inner surface of the second recess 14 and the wiring portion 6. On the other hand, the lower coating layer 3 b includes a third recess 15. The depth of the third recess 15 is approximately the same as that of the second recess 14. Thereby, a gap in which the sliding layer 4 can be disposed is formed also in the third recess 15.
　次に、図７に示すように、配線基板２の外面を覆うようにして滑り層４を形成する（ステップＳ０３）。その後、図８に示すように、滑り層４で覆われた配線基板２を上部被覆層３ａと下部被覆層３ｂとによって挟み込み、上部被覆層３ａの外縁部１６ａと下部被覆層３ｂの外縁部１６ｂとを接着材等により固定する（ステップＳ０４）。図８において図示を省略しているが、最端部側の基板部５に電極部１０を形成している場合には、当該電極部１０と被覆層３とを接着する。これにより、図９に示すように、配線基板２が被覆層３によって封止された状態となる。 Next, as shown in FIG. 7, the sliding layer 4 is formed so as to cover the outer surface of the wiring board 2 (step S03). Thereafter, as shown in FIG. 8, the wiring substrate 2 covered with the sliding layer 4 is sandwiched between the upper coating layer 3a and the lower coating layer 3b, and the outer edge portion 16a of the upper coating layer 3a and the outer edge portion 16b of the lower coating layer 3b. Are fixed with an adhesive or the like (step S04). Although not shown in FIG. 8, when the electrode part 10 is formed on the substrate part 5 on the extreme end side, the electrode part 10 and the coating layer 3 are bonded. As a result, as shown in FIG. 9, the wiring substrate 2 is sealed with the covering layer 3.
　次に、図１１乃至図１４を参照して曲げ中心Ｗと応力との関係について説明する。ここで、ハッチング部の大きさが応力の変化を示している。図１１に示すように被覆層３を単体で湾曲させた場合や、図１２に示すように配線基板２を単体で湾曲させた場合、被覆層３や配線基板２の厚さ方向の中心が曲げ中心Ｗとなる。即ち、被覆層３や配線基板２の曲げ中心Ｗから厚さ方向の両側部分に向かって応力が対称方向に徐々に大きくなる。一方、図１３に示すように配線基板２と被覆層３とを固定した場合には曲げ中心Ｗは両者で共通となり、配線基板２から見ると曲げ中心は被覆層３側に移動し、被覆層３から見ると曲げ中心は配線基板２側に移動することとなる。図１３では、曲げ中心Ｗが配線基板２と被覆層３との境界部分に配置されている。そのため、配線基板２の下面１８と被覆層３の上面１７とが曲げ中心Ｗから離間することとなり、配線基板２および被覆層３に作用する応力が両方とも増加することとなる。 Next, the relationship between the bending center W and the stress will be described with reference to FIGS. Here, the size of the hatched portion indicates a change in stress. When the coating layer 3 is curved as shown in FIG. 11 or when the wiring board 2 is curved as shown in FIG. 12, the center of the coating layer 3 or the wiring board 2 in the thickness direction is bent. It becomes the center W. That is, the stress gradually increases in the symmetric direction from the bending center W of the coating layer 3 and the wiring substrate 2 toward both side portions in the thickness direction. On the other hand, when the wiring board 2 and the covering layer 3 are fixed as shown in FIG. 13, the bending center W is common to both, and when viewed from the wiring board 2, the bending center moves to the covering layer 3 side. When viewed from 3, the bending center moves to the wiring board 2 side. In FIG. 13, the bending center W is arranged at the boundary portion between the wiring board 2 and the covering layer 3. For this reason, the lower surface 18 of the wiring board 2 and the upper surface 17 of the covering layer 3 are separated from the bending center W, and the stress acting on the wiring board 2 and the covering layer 3 is increased.
　これに対して、図１４に示すように、配線基板２と被覆層３との間に滑り層４を設けると、配線基板２と被覆層３とに対して個別の曲げ中心Ｗが存在し、単体の曲げ中心と略同じ位置に維持することができる。そのため、配線基板２と被覆層３とに作用する応力を小さくすることができる。ここで、曲げ中心Ｗよりも内側方向には圧縮応力が作用し、曲げ中心Ｗよりも外側方向には引張応力が作用する。 On the other hand, as shown in FIG. 14, when the sliding layer 4 is provided between the wiring board 2 and the covering layer 3, individual bending centers W exist for the wiring board 2 and the covering layer 3, It can be maintained at substantially the same position as the single bending center. Therefore, the stress acting on the wiring board 2 and the coating layer 3 can be reduced. Here, a compressive stress acts on the inner side of the bending center W, and a tensile stress acts on the outer side of the bending center W.
　実施例１に係る電子機器１と同様に、実施例２に係る電子機器１０１では配線基板２と被覆層３との間に滑り層４を設けているので、電子機器１０１を湾曲させる場合に被覆層３の内面と配線基板２の外面とが相対変位可能となる。そのため、配線基板２や被覆層３に作用する引張応力および圧縮応力を低減して電子機器１０１を円滑に湾曲させることができる。その結果、電子機器１０１の柔軟性を向上して少ない力で湾曲変形させることができる。 Similar to the electronic device 1 according to the first embodiment, the electronic device 101 according to the second embodiment includes the sliding layer 4 between the wiring board 2 and the coating layer 3. The inner surface of the layer 3 and the outer surface of the wiring board 2 can be relatively displaced. Therefore, the electronic device 101 can be smoothly curved by reducing the tensile stress and the compressive stress acting on the wiring board 2 and the coating layer 3. As a result, the flexibility of the electronic device 101 can be improved and curved and deformed with a small force.
　また、配線基板２のうち実装部品７が実装されていない配線部６が可撓性を有するので、実装部品７が実装される基板部５自身が湾曲しなくとも配線基板２を全体的に湾曲させることができる。 Moreover, since the wiring part 6 in which the mounting component 7 is not mounted among the wiring boards 2 is flexible, the wiring board 2 is curved as a whole even if the board part 5 on which the mounting component 7 is mounted is not curved. Can be made.
　また、配線基板２が電極部１０を介して被覆層３と固定されているため、被覆層３に対して配線基板２を位置決めすることができる。その結果、電子機器１０１を安定して湾曲させることができる。また、電極部１０が基板部５の長手方向と交差する方向に延伸しているので、電子機器１０１を湾曲させたときに、電極部１０と被覆層３との境界部分にせん断力が作用することを防止できる。その結果、配線基板２と被覆層３とを安定して固定することができる。 In addition, since the wiring board 2 is fixed to the coating layer 3 via the electrode portion 10, the wiring board 2 can be positioned with respect to the coating layer 3. As a result, the electronic device 101 can be bent stably. Further, since the electrode portion 10 extends in a direction intersecting with the longitudinal direction of the substrate portion 5, when the electronic device 101 is bent, a shearing force acts on the boundary portion between the electrode portion 10 and the coating layer 3. Can be prevented. As a result, the wiring board 2 and the coating layer 3 can be stably fixed.
　更に、上部被覆層３ａと下部被覆層３ｂとによって滑り層４で覆われた配線基板２を挟み込み、上部被覆層３ａと下部被覆層３ｂとを互いに固定すればよいため、容易に電子機器１０１を製造することができる。その結果、電子機器１０１を製造する作業者の負担を軽減することができる。 Further, the wiring substrate 2 covered with the sliding layer 4 is sandwiched between the upper coating layer 3a and the lower coating layer 3b, and the upper coating layer 3a and the lower coating layer 3b may be fixed to each other. Can be manufactured. As a result, the burden on the operator who manufactures the electronic device 101 can be reduced.
　次に、本発明の実施例２の変形例に係る電子機器１０１について添付図面を参照して説明する。実施例２と実施例２の変形例とは基板部５と配線部６との接続態様が異なる。そのため、実施例２の変形例では実施例２と同一部分に同一の符号を付してその説明を割愛する。 Next, an electronic device 101 according to a modification of the second embodiment of the present invention will be described with reference to the accompanying drawings. The connection form of the board | substrate part 5 and the wiring part 6 differs between Example 2 and the modification of Example 2. FIG. Therefore, in the modified example of the second embodiment, the same parts as those in the second embodiment are denoted by the same reference numerals, and the description thereof is omitted.
　図１５は、実施例２の変形例に係る電子機器１０１に適用される配線基板１０２の正面図である。図１６は、配線基板１０２を湾曲させた状態を示す正面図である。図１７は、図１５の配線基板１０２において基板部５と配線部６とを接続する部分の拡大図である。図１８は、配線基板１０２を湾曲させた場合の基板部５と配線部６とを接続する部分の拡大図である。 FIG. 15 is a front view of the wiring board 102 applied to the electronic device 101 according to the modification of the second embodiment. FIG. 16 is a front view showing a state in which the wiring board 102 is bent. FIG. 17 is an enlarged view of a portion where the substrate portion 5 and the wiring portion 6 are connected in the wiring substrate 102 of FIG. FIG. 18 is an enlarged view of a portion where the substrate unit 5 and the wiring unit 6 are connected when the wiring substrate 102 is bent.
　図１５及び図１７に示すように、実施例２の変形例に係る配線基板１０２は基板部５および配線部６を備えている。配線部６は連続して形成されている。基板部５の表面５ａには実装部品７が実装され、当該表面５ａと反対側の裏面５ｂの一部が配線部６と接続されている。具体的には、基板部５の裏面５ｂの中央部のみが接続部２０を介して配線部６に接続されている。実施例２の変形例では基板部５と配線部６とは一部で接続されていればよく、基板部５の裏面５ｂの中央部以外で配線部６と接続されていればよい。 As shown in FIGS. 15 and 17, the wiring board 102 according to the modification of the second embodiment includes a board part 5 and a wiring part 6. The wiring part 6 is formed continuously. A mounting component 7 is mounted on the front surface 5 a of the substrate portion 5, and a part of the back surface 5 b opposite to the front surface 5 a is connected to the wiring portion 6. Specifically, only the central part of the back surface 5 b of the substrate part 5 is connected to the wiring part 6 via the connection part 20. In the modified example of the second embodiment, the substrate unit 5 and the wiring unit 6 may be connected in part, and may be connected to the wiring unit 6 except for the central portion of the back surface 5b of the substrate unit 5.
　実施例２の変形例によれば、配線基板１０２において基板部５の裏面５ｂと配線部６とが一部で接続されているため、基板部５によって配線基板１０２全体の湾曲が妨げられない。そのため、図１６及び図１８に示すように、配線基板１０２全体を円滑に湾曲させることができる。その結果、電子機器１０１を少ない力で湾曲変形させることができる。 According to the modification of the second embodiment, since the back surface 5b of the substrate unit 5 and the wiring unit 6 are partially connected in the wiring substrate 102, the substrate unit 5 does not prevent the entire wiring substrate 102 from being bent. Therefore, as shown in FIGS. 16 and 18, the entire wiring board 102 can be smoothly curved. As a result, the electronic device 101 can be bent and deformed with a small force.
　次に、本発明の実施例３に係る電子機器２０１について添付図面を参照して詳細に説明する。実施例３は上述の実施例と比べて配線基板２を被覆層３によって封止した（即ち、配線基板２を被覆層３で覆う工程）後に滑り層４を形成する点で異なる。そのため、実施例３において上述の実施例と同一部分には同一の符号を付してその説明を割愛する。 Next, the electronic apparatus 201 according to the third embodiment of the present invention will be described in detail with reference to the accompanying drawings. The third embodiment is different from the above-described embodiment in that the sliding layer 4 is formed after the wiring substrate 2 is sealed with the covering layer 3 (that is, the step of covering the wiring substrate 2 with the covering layer 3). Therefore, in Example 3, the same part as the above-mentioned Example is attached | subjected with the same code | symbol, and the description is omitted.
　図１９は、実施例３に係る電子機器２０１の第一端部２５の拡大断面図である。図２０は、実施例３に係る電子機器２０１の第二端部２７の拡大断面図であり、滑り層４を形成する潤滑剤を注入している状態を示している。図２１は、実施例３に係る電子機器２０１の第一端部２５の拡大断面図であり、注入針３０を内部空間に挿入した状態を示している。図２２は、実施例３に係る電子機器２０１の第一端部２５の拡大断面図であり、注入針３０を引き抜いた後に貫通孔２６に充填材３１を充填した状態を示している。 FIG. 19 is an enlarged cross-sectional view of the first end portion 25 of the electronic apparatus 201 according to the third embodiment. FIG. 20 is an enlarged cross-sectional view of the second end portion 27 of the electronic apparatus 201 according to the third embodiment, and shows a state in which a lubricant that forms the sliding layer 4 is injected. FIG. 21 is an enlarged cross-sectional view of the first end portion 25 of the electronic apparatus 201 according to the third embodiment, and shows a state where the injection needle 30 is inserted into the internal space. FIG. 22 is an enlarged cross-sectional view of the first end portion 25 of the electronic apparatus 201 according to the third embodiment, and shows a state where the through hole 26 is filled with the filler 31 after the injection needle 30 is pulled out.
　図１９に示すように、実施例３に係る電子機器２０１は被覆層３の第一端部２５において、被覆層３と配線基板２との間の内部空間と被覆層３の外部空間とを連通する貫通孔２６が形成されている。貫通孔２６は、被覆層３の第一端部２５からその反対側（即ち、第二端部２７）への方向に形成される。図２０に示すように、被覆層３の第二端部２７にも貫通孔２６が形成されている。 As shown in FIG. 19, the electronic apparatus 201 according to the third embodiment communicates the internal space between the coating layer 3 and the wiring board 2 and the external space of the coating layer 3 at the first end 25 of the coating layer 3. A through hole 26 is formed. The through hole 26 is formed in the direction from the first end 25 of the coating layer 3 to the opposite side (that is, the second end 27). As shown in FIG. 20, a through hole 26 is also formed in the second end portion 27 of the coating layer 3.
　図１９乃至図２１に示すように、被覆層３の内周面には、滑り層４を形成する液体やゲル状体の潤滑剤が貫通孔２６から外部に漏れないように逆止弁２８が設けられている。逆止弁２８は、その端部２９が貫通孔２６を閉塞する閉塞位置（図１９参照）から貫通孔２６を開放する開放位置（図２１参照）まで弾性変形可能に形成されている。逆止弁２８は、貫通孔２６に挿入された注入針３０によって押圧されると、閉塞位置から開放位置まで変位する。これにより、注入針３０を介して配線基板２と被覆層３との間の内部空間に滑り層４を形成する液体やゲル状体の潤滑剤を注入することができる。 As shown in FIGS. 19 to 21, a check valve 28 is provided on the inner peripheral surface of the covering layer 3 so that the liquid or the gel-like lubricant forming the sliding layer 4 does not leak to the outside from the through hole 26. Is provided. The check valve 28 is formed so that its end 29 can be elastically deformed from a closed position (see FIG. 19) where the through hole 26 is closed to an open position (see FIG. 21) where the through hole 26 is opened. When the check valve 28 is pressed by the injection needle 30 inserted into the through hole 26, the check valve 28 is displaced from the closed position to the open position. Thereby, the liquid or gel-like lubricant that forms the sliding layer 4 can be injected into the internal space between the wiring board 2 and the coating layer 3 via the injection needle 30.
　また、逆止弁２８は注入針３０が貫通孔２６から引き抜かれると、その弾性によって開放位置から閉塞位置まで変位する。逆止弁２８の端部２９により貫通孔２６が閉塞されて、潤滑剤が貫通孔２６を介して一時的に外部に漏れることを防止することができる。図２２に示すように、注入針３０が引き抜かれた後の貫通孔２６には、変性シリコン系接着材やシリコン系樹脂などの充填材３１が充填される。ここで、滑り層４が超低硬度の樹脂材料で形成される場合、当該樹脂材料に対して硬化処理を行なうことにより、被覆層３の外部への樹脂材料の漏れを防止することができる。 Further, when the injection needle 30 is pulled out from the through hole 26, the check valve 28 is displaced from the open position to the closed position by its elasticity. The through hole 26 is closed by the end portion 29 of the check valve 28, and the lubricant can be prevented from temporarily leaking outside through the through hole 26. As shown in FIG. 22, the through-hole 26 after the injection needle 30 has been pulled out is filled with a filler 31 such as a modified silicon adhesive or silicon resin. Here, when the sliding layer 4 is formed of a resin material having an extremely low hardness, the resin material can be prevented from leaking to the outside of the coating layer 3 by performing a curing process on the resin material.
　次に、実施例３の第一変形例について図２３乃至図２５を参照して説明する。実施例３の第一変形例は実施例３と滑り層４を形成する際の充填物の外部への漏れ防止に係る構造が異なる。従って、実施例３の第一変形例では実施例３と同一部分には同一符号を付してその説明を割愛する。また、配線基板２の図示を省略する。 Next, a first modification of the third embodiment will be described with reference to FIGS. The first modification of the third embodiment is different from the third embodiment in the structure related to prevention of leakage of the filler to the outside when the sliding layer 4 is formed. Therefore, in the 1st modification of Example 3, the same code | symbol is attached | subjected to the same part as Example 3, and the description is omitted. Further, illustration of the wiring board 2 is omitted.
　図２３は、実施例３の第一変形例に係る電子機器２０１の第二端部２７の拡大断面図である。図２４は、電子機器２０１の内部空間に注入針３０を挿入した状態を示す拡大断面図である。図２５は、電子機器２０１から注入針３０を引き抜いた後の状態を示す拡大断面図である。 FIG. 23 is an enlarged cross-sectional view of the second end portion 27 of the electronic apparatus 201 according to the first modification of the third embodiment. FIG. 24 is an enlarged cross-sectional view showing a state where the injection needle 30 is inserted into the internal space of the electronic apparatus 201. FIG. 25 is an enlarged cross-sectional view showing a state after the injection needle 30 is pulled out from the electronic device 201.
　図２３に示すように、実施例３の第一変形例に係る電子機器２０１の被覆層３には貫通孔２６の内側に弁体３２が一体に形成されている。弁体３２は、貫通孔２６の上部と下部との揺動可能に支持されている。弁体３２は、注入針３０の挿入前にはその上端部及び下端部同士が密着して貫通孔２６を閉塞している。 23, a valve body 32 is integrally formed inside the through hole 26 in the coating layer 3 of the electronic device 201 according to the first modification of the third embodiment. The valve body 32 is supported so that the upper part and the lower part of the through hole 26 can swing. Before the injection needle 30 is inserted, the valve body 32 closes the upper end portion and the lower end portion and closes the through hole 26.
　被覆層３０の貫通孔２６に注入針３０が挿入されると、弁体３２は注入針３０に押圧されて被覆層３の内側に向かって揺動する。これにより、弁体３２は貫通孔２６を開放した開放状態となり、注入針３０による潤滑剤の注入が可能となる。その後、図２５に示すように、注入針３０を貫通孔２６から引き抜くと、滑り層４を形成する液体等の潤滑剤が弁体３２を押圧することとなり、弁体３２が貫通孔２６を閉塞する閉塞位置に戻る。従って、滑り層４を形成する液体等の潤滑剤が貫通孔２６を介して外部に漏れることを防止できる。 When the injection needle 30 is inserted into the through hole 26 of the coating layer 30, the valve body 32 is pressed by the injection needle 30 and swings toward the inside of the coating layer 3. Accordingly, the valve body 32 is in an open state in which the through hole 26 is opened, and the lubricant can be injected by the injection needle 30. Thereafter, as shown in FIG. 25, when the injection needle 30 is pulled out from the through hole 26, a lubricant such as a liquid forming the sliding layer 4 presses the valve body 32, and the valve body 32 closes the through hole 26. Return to the closed position. Accordingly, it is possible to prevent the lubricant such as the liquid forming the sliding layer 4 from leaking outside through the through hole 26.
　次に、実施例３の第二変形例に係る電子機器２０１について図２６及び図２７を参照して説明する。実施例３及び第一変形例に比べて第二変形例では滑り層４を形成する際の充填物の外部への漏れ防止構造が異なっている。従って、実施例３と同一部分には同一符号を付してその説明を割愛する。また、図２６及び図２７において配線基板２の図示を省略する。 Next, an electronic apparatus 201 according to a second modification of the third embodiment will be described with reference to FIGS. Compared with Example 3 and the first modified example, the second modified example is different in the structure for preventing leakage of the filler to the outside when the sliding layer 4 is formed. Therefore, the same parts as those in the third embodiment are denoted by the same reference numerals and the description thereof is omitted. 26 and 27, the wiring board 2 is not shown.
　図２６は、実施例３の第二変形例に係る被覆層３の第二端部２７の拡大断面図であり、注入針３０による潤滑剤の注入作業後の状態を示している。図２７は、被覆層３の貫通孔２６をプラグ３３で閉塞した状態を示す拡大断面図である。図２６に示すように、第二変形例は被覆層３の貫通孔２６を閉塞するプラグ３３を備えている。プラグ３３は、本体部３４と返し部３５とを備えている。本体部３４は貫通孔２６の口径よりも僅かに大きな直径を有する。 FIG. 26 is an enlarged cross-sectional view of the second end portion 27 of the coating layer 3 according to the second modification of the third embodiment, and shows a state after the operation of injecting the lubricant with the injection needle 30. FIG. 27 is an enlarged cross-sectional view showing a state where the through hole 26 of the coating layer 3 is closed with the plug 33. As shown in FIG. 26, the second modification includes a plug 33 that closes the through hole 26 of the coating layer 3. The plug 33 includes a main body portion 34 and a return portion 35. The main body 34 has a diameter slightly larger than the diameter of the through hole 26.
　プラグ３３の返し部３５は本体部３４から半径方向の外側に広がる面を備えているおり、当該返し部３５は貫通孔２６よりも十分大きな直径を有する。そのため、プラグ３３が貫通孔２６に挿通されて返し部３５が被覆層３の内部空間に到達すると、返し部３５が貫通孔２６の周囲の被覆層３の内面に引っ掛かり、以って、プラグ３３が貫通孔２６から抜け落ちることを防止する。このように、滑り層４を形成する液体等の潤滑剤が貫通孔２６を介して外部に漏れることを防止することができる。 The return portion 35 of the plug 33 has a surface extending radially outward from the main body portion 34, and the return portion 35 has a diameter sufficiently larger than that of the through hole 26. Therefore, when the plug 33 is inserted into the through hole 26 and the return portion 35 reaches the internal space of the coating layer 3, the return portion 35 is caught on the inner surface of the coating layer 3 around the through hole 26, and thus the plug 33. Is prevented from falling out of the through hole 26. As described above, it is possible to prevent the lubricant such as the liquid forming the sliding layer 4 from leaking outside through the through hole 26.
　次に、実施例３の第三変形例に係る電子機器２０１について図２８乃至図３０を参照して説明する。図２８は、実施例３の第三変形例に係る電子機器２０１の第二端部２７の拡大断面図であり、注入針３０を被覆層３内に挿入する前の状態を示す。図２９は、電子機器２０１の被覆層３内に注入針３０を挿入している途中の状態を示す拡大断面図である。図３０は、電子機器２０１の被覆層３内に潤滑剤を注入して滑り層４を形成した後に注入針３０を被覆層３から引き抜いた状態を示す拡大断面図である。 Next, an electronic apparatus 201 according to a third modification of the third embodiment will be described with reference to FIGS. FIG. 28 is an enlarged cross-sectional view of the second end portion 27 of the electronic apparatus 201 according to the third modification of the third embodiment, and shows a state before the injection needle 30 is inserted into the coating layer 3. FIG. 29 is an enlarged cross-sectional view showing a state in the middle of inserting the injection needle 30 into the coating layer 3 of the electronic device 201. FIG. 30 is an enlarged cross-sectional view showing a state where the injection needle 30 is pulled out from the coating layer 3 after the lubricant is injected into the coating layer 3 of the electronic device 201 to form the sliding layer 4.
　図２８に示すように、実施例３の第三変形例では電子機器２０１の被覆層３の第二端部２７において貫通孔２６に代えて切れ目３６が形成されている。切れ目３６は、被覆層３を形成する柔軟材料のタック性によって密閉されている。図２９に示すように、注入針３０によって切れ目３６を押し広げることで注入針３０を被覆層３の内部空間に進入させることができる。図３０に示すように、注入針３０による潤滑剤の注入作業が終了して注入針３０を被覆層３から引き抜くと切れ目３６は再び密着状態に戻る。そのため、滑り層４を形成する液体等の潤滑剤が外部に漏れることを防止できる。 As shown in FIG. 28, in the third modification of the third embodiment, a cut 36 is formed instead of the through hole 26 in the second end portion 27 of the coating layer 3 of the electronic device 201. The cut 36 is sealed by the tackiness of the flexible material forming the coating layer 3. As shown in FIG. 29, the injection needle 30 can be caused to enter the inner space of the coating layer 3 by spreading the cut 36 with the injection needle 30. As shown in FIG. 30, when the injection operation of the lubricant by the injection needle 30 is completed and the injection needle 30 is pulled out from the coating layer 3, the cut 36 returns to the close contact state again. Therefore, it is possible to prevent a lubricant such as a liquid that forms the sliding layer 4 from leaking to the outside.
　次に、本発明の実施例４に係る電子機器１０１について図３１乃至図３６を参照して詳細に説明する。実施例２に比べて実施例４の電子機器１０１は配線基板２の配線部１０６の形状が異なる。そのため、実施例２と同一部分には同一の符号を付してその説明を割愛する。図３１は、本発明の実施例４に係る配線基板２の平面図である。図３２は、実施例４の第一変形例に係る配線基板２の平面図である。図３３は、実施例４の第二変形例に係る配線基板２の平面図である。図３４は、実施例４の第三変形例に係る配線基板２の平面図である。図３５は、実施例４の第四変形例に係る配線基板２の平面図である。図３６は、実施例４の第四変形例に係る配線基板２の正面図である。 Next, the electronic apparatus 101 according to the fourth embodiment of the present invention will be described in detail with reference to FIGS. Compared to the second embodiment, the electronic device 101 according to the fourth embodiment is different in the shape of the wiring portion 106 of the wiring board 2. Therefore, the same parts as those in the second embodiment are denoted by the same reference numerals and the description thereof is omitted. FIG. 31 is a plan view of the wiring board 2 according to the fourth embodiment of the present invention. FIG. 32 is a plan view of the wiring board 2 according to a first modification of the fourth embodiment. FIG. 33 is a plan view of the wiring board 2 according to a second modification of the fourth embodiment. FIG. 34 is a plan view of the wiring board 2 according to a third modification of the fourth embodiment. FIG. 35 is a plan view of the wiring board 2 according to a fourth modification of the fourth embodiment. FIG. 36 is a front view of the wiring board 2 according to a fourth modification of the fourth embodiment.
　図３１に示すように、本発明の実施例４に係る配線基板２は複数の基板部５と複数の配線部１０６とを具備する。配線部１０６は余長を有している。言い換えれば、隣接する基板部５の間隙よりも配線部１０６の全長が長い。具体的には、図３１に示す配線部１０６は配線基板２の長手方向に対して幅方向に蛇行する余長が形成されている。これにより、配線部１０６が捩れ方向にも変形し易くなる。ここで、配線部１０６が蛇行する方向は配線基板２の幅方向に限られない。例えば、図３２に示すように、配線部１０６を配線基板２の長手方向に蛇行させてもよい。 As shown in FIG. 31, the wiring board 2 according to the fourth embodiment of the present invention includes a plurality of substrate parts 5 and a plurality of wiring parts 106. The wiring part 106 has a surplus length. In other words, the entire length of the wiring portion 106 is longer than the gap between the adjacent substrate portions 5. Specifically, the wiring portion 106 shown in FIG. 31 has a surplus length that meanders in the width direction with respect to the longitudinal direction of the wiring substrate 2. Thereby, the wiring part 106 is easily deformed in the twisting direction. Here, the direction in which the wiring portion 106 meanders is not limited to the width direction of the wiring board 2. For example, as shown in FIG. 32, the wiring part 106 may meander in the longitudinal direction of the wiring board 2.
　図３１及び図３２では、配線部１０６を蛇行させることにより余長を形成するようにしたが、これに限定されるものではない。図３３に示すように、配線部１０６を基板部５の配列方向に対して斜め方向に形成してもよい。また、図３４に示すように、配線部１０６を互い違いに斜め方向に形成してもよい。即ち、配線部１０６の延伸方向や角度は特定の方向や角度に限定されるものではない。 In FIG. 31 and FIG. 32, the surplus length is formed by meandering the wiring portion 106, but the present invention is not limited to this. As shown in FIG. 33, the wiring part 106 may be formed obliquely with respect to the arrangement direction of the substrate parts 5. Further, as shown in FIG. 34, the wiring portions 106 may be alternately formed in an oblique direction. That is, the extending direction and angle of the wiring part 106 are not limited to a specific direction and angle.
　更に、図３５及び図３６に示すように、配線部１０６を基板部５の厚さ方向に蛇行させてもよい。 Furthermore, as shown in FIGS. 35 and 36, the wiring portion 106 may meander in the thickness direction of the substrate portion 5.
　本発明は、上述した実施例及び変形例に限定されるものではなく、電子機器の構成要素の具体的な形状は例示であり適宜変更が可能である。即ち、本発明は添付した特許請求の範囲に定義される発明の範囲内における種々の設計変更や改変をも包含するものである。 The present invention is not limited to the above-described embodiments and modifications, and the specific shapes of the components of the electronic device are examples and can be appropriately changed. That is, the present invention includes various design changes and modifications within the scope of the invention as defined in the appended claims.
　例えば、上述の実施例及び変形例に係る配線基板では可撓性を有しない基板部と可撓性を有する配線部を具備するものとしたが、これに限定されるものではない。配線基板の可撓性を有する部分に電子回路を搭載することができるのであれば、可撓性を有しない基板部を設ける必要はない。例えば、配線基板をフレキシブル基板（ＦＰＣ）で構成してもよい。この場合であっても、実装部品は湾曲させることができないので、実装部品を配線基板上に適宜集中又は分散させて配置すればよい。 For example, although the wiring board according to the above-described embodiments and modifications is provided with a substrate part having no flexibility and a wiring part having flexibility, the invention is not limited to this. If an electronic circuit can be mounted on the flexible portion of the wiring board, there is no need to provide a non-flexible substrate portion. For example, the wiring board may be configured by a flexible board (FPC). Even in this case, since the mounted component cannot be bent, it is only necessary to arrange the mounted component so as to be appropriately concentrated or dispersed on the wiring board.
　本発明は配線基板を電子部品を実装する基板部と可撓性を有する配線部とで構成したので、各種の対象物に形状を適応させて電子機器を取り付けることができるので、データ収集や医療用途などの幅広い分野に適用することができる。 In the present invention, since the wiring board is composed of a board portion on which electronic components are mounted and a wiring portion having flexibility, the electronic device can be attached by adapting the shape to various objects. It can be applied to a wide range of applications.
　１、１０１、１０２　　電子機器
　２　　配線基板
　３　　被覆層
　３ａ　上部被覆層
　３ｂ　下部被覆層
　４　　滑り層
　５　　基板部
　６、１０６　　配線部（非実装領域）
　７　　実装部品
　８　　電池
　１０　　電極部（外部端子）
　１３　　第一凹部
　１４　　第二凹部
　１５　　第三凹部
　２０　　接続部
　２５　　第一端部
　２６　　貫通孔（連通路、注入口）
　２７　　第二端部
　２８　　逆止弁（逆流防止部）
　３０　　注入針
　３１　　充填材
　３２　　弁体（逆流防止部）
　３３　　プラグ（逆流防止部）
　３６　　切れ目（注入口） DESCRIPTION OF SYMBOLS 1, 101, 102 Electronic device 2 Wiring board 3 Covering layer 3a Upper coating layer 3b Lower coating layer 4 Sliding layer 5 Substrate part 6, 106 Wiring part (non-mounting area)
7 Mounting parts 8 Battery 10 Electrode part (external terminal)
13 1st recessed part 14 2nd recessed part 15 3rd recessed part 20 Connection part 25 1st end part 26 Through-hole (communication path, injection port)
27 Second end 28 Check valve (backflow prevention part)
30 Injection needle 31 Filler 32 Valve body (backflow prevention part)
33 Plug (Backflow prevention part)
36 Cut (inlet)

Claims (14)

  1. 　少なくとも一部が可撓性を有する配線基板と、
    　前記配線基板を外側から覆う可撓性を有する被覆層と、
    　前記被覆層と前記配線基板との間に設けられ、前記被覆層と前記配線基板との相対変位を許容する滑り層とを具備する電子機器。     A wiring board at least partially flexible;
    A flexible coating layer covering the wiring substrate from the outside;
    An electronic apparatus comprising a sliding layer provided between the covering layer and the wiring board and allowing relative displacement between the covering layer and the wiring board.
  2. 　前記被覆層の所定位置において前記滑り層に連通する連通路を形成するようにした請求項１に記載の電子機器。 The electronic device according to claim 1, wherein a communication path communicating with the sliding layer is formed at a predetermined position of the covering layer.
  3. 　前記配線基板は実装部品を実装するための実装領域と前記実装部品が実装されない可撓性を有する非実装領域とを具備するようにした請求項１に記載の電子機器。 2. The electronic device according to claim 1, wherein the wiring board includes a mounting area for mounting a mounting component and a flexible non-mounting area where the mounting component is not mounted.
  4. 　前記配線基板は、実装部品が実装される基板部と可撓性を有する非実装領域としての配線部とを連結して構成するようにした請求項１に記載の電子機器。 2. The electronic device according to claim 1, wherein the wiring board is configured by connecting a board part on which a mounting component is mounted and a wiring part as a flexible non-mounting area.
  5. 　前記配線基板は、実装部品が実装される基板部と可撓性を有する非実装領域としての配線部とを具備し、前記基板部の裏面の一部と前記配線部とを接続するようにした請求項１に記載の電子機器。 The wiring board includes a board part on which mounting components are mounted and a wiring part as a flexible non-mounting region, and connects a part of the back surface of the board part to the wiring part. The electronic device according to claim 1.
  6. 　前記配線部は幅方向又は長手方向に蛇行する余長を有するようにした請求項４に記載の電子機器。 5. The electronic apparatus according to claim 4, wherein the wiring portion has a surplus length that meanders in the width direction or the longitudinal direction.
  7. 　前記配線基板と前記被覆層とは一部で固定されるようにした請求項１に記載の電子機器。 The electronic device according to claim 1, wherein the wiring board and the covering layer are fixed in part.
  8. 　前記配線基板の所定位置と連結されて前記被覆層の外部に露出する外部端子を更に具備し、前記外部端子により前記配線基板と前記被覆層とが固定されるようにした請求項７に記載の電子機器。 The external terminal connected to a predetermined position of the wiring board and exposed to the outside of the covering layer is further provided, and the wiring board and the covering layer are fixed by the external terminal. Electronics.
  9. 　前記外部端子は前記被覆層の長手方向と交差する方向に延伸するように形成した請求項８に記載の電子機器。 The electronic device according to claim 8, wherein the external terminal is formed to extend in a direction intersecting with a longitudinal direction of the coating layer.
  10. 　前記被覆層の所定位置に前記配線基板と前記被覆層との間に前記滑り層を形成するための潤滑剤を注入する注入口を形成するようにした請求項１に記載の電子機器。 The electronic apparatus according to claim 1, wherein an injection port for injecting a lubricant for forming the sliding layer is formed between the wiring board and the coating layer at a predetermined position of the coating layer.
  11. 　前記注入口は前記潤滑剤の逆流を防止する逆流防止部を備えるようにした請求項１０に記載の電子機器。 11. The electronic apparatus according to claim 10, wherein the injection port includes a backflow prevention unit that prevents backflow of the lubricant.
  12. 　少なくとも一部が可撓性を有する配線基板と、
    　前記配線基板を外側から覆う可撓性を有した被覆層からなり、
    　前記配線基板は、部品が実装され可撓性を有さない基板部と、前記部品が実装されない可撓性を有する配線部とを備え、
    　前記配線部は、前記基板部の前記部品が実装される実装面とは反対側の裏面の一部に接続されている電子機器。     A wiring board at least partially flexible;
    It consists of a flexible coating layer that covers the wiring board from the outside,
    The wiring board includes a board portion on which components are mounted and has no flexibility, and a flexible wiring portion on which the components are not mounted,
    The wiring unit is an electronic device that is connected to a part of the back surface of the board unit opposite to the mounting surface on which the component is mounted.
  13. 　少なくとも一部が可撓性を有する配線基板を用意し、
    　前記配線基板を外側から可撓性を有する被覆層で覆い、
    　前記被覆層と前記配線基板との間に潤滑剤を注入して滑り層を形成するようにした電子機器の製造方法。     Prepare a wiring board at least partially flexible,
    Covering the wiring board with a flexible coating layer from the outside,
    A method of manufacturing an electronic device, wherein a sliding layer is formed by injecting a lubricant between the coating layer and the wiring board.
  14. 　少なくとも一部が可撓性を有する配線基板を用意し、
    　前記配線基板を外側から覆う滑り層を形成し、
    　前記滑り層で覆われた前記配線基板を可撓性を有する被覆層で覆うようにした電子機器の製造方法。     Prepare a wiring board at least partially flexible,
    Forming a sliding layer covering the wiring board from the outside;
    A method for manufacturing an electronic device, wherein the wiring board covered with the sliding layer is covered with a flexible covering layer.
PCT/JP2015/068194 2014-06-27 2015-06-24 Electronic device and method for manufacturing same WO2015199128A1 (en)

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