WO2015041050A1 - Composite module - Google Patents

Composite module Download PDF

Info

Publication number
WO2015041050A1
WO2015041050A1 PCT/JP2014/073144 JP2014073144W WO2015041050A1 WO 2015041050 A1 WO2015041050 A1 WO 2015041050A1 JP 2014073144 W JP2014073144 W JP 2014073144W WO 2015041050 A1 WO2015041050 A1 WO 2015041050A1
Authority
WO
WIPO (PCT)
Prior art keywords
columnar conductor
resin layer
composite module
columnar
exposed
Prior art date
Application number
PCT/JP2014/073144
Other languages
French (fr)
Japanese (ja)
Inventor
野村　忠志
明彦 鎌田
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2015041050A1 publication Critical patent/WO2015041050A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/1026—Compound semiconductors
    • H01L2924/1032—III-V
    • H01L2924/10329—Gallium arsenide [GaAs]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs

Definitions

  • the present invention relates to a composite module in which a columnar conductor for external connection having one end connected to one main surface of a wiring board is sealed with a resin.
  • the electrode of the LSI chip 102 and a predetermined wiring electrode formed on one main surface of the wiring substrate 101 are connected by the Au wire 103, and one end of the columnar conductor 104 is formed on the one main surface of the wiring substrate 101. Connected to a predetermined wiring electrode. The other end of the columnar conductor 104 is exposed from the surface of the resin layer 105 and is used as an external connection electrode on the surface side.
  • a back electrode connected to the wiring electrode via a conductor inside the through hole is formed, and the back electrode is used as an external connection electrode on the back surface side.
  • the wiring in the composite module 100 has a three-dimensional structure, the area of the main surface of the wiring board 101 can be reduced as compared with the conventional composite module in which the wiring is formed in a plane. Therefore, the composite module 100 can be reduced in size.
  • the columnar conductor 104 is disposed inside the resin layer 105 and the entire peripheral side surface thereof is covered with the resin layer 105, the columnar conductor exposed from the resin layer 105 by solder, for example.
  • solder for example.
  • the state of the connecting portion between them for example, the wet state of the solder
  • the connection state of the connection portion is good can be determined only by an electrical inspection, but can also be determined visually.
  • the present invention has been made in view of the above-described problems, and an object of the present invention is to make a connection state with the outside visible in a composite module connected to the outside with a columnar conductor.
  • the composite module of the present invention includes a wiring board on which electronic components are mounted, and a columnar shape for external connection arranged with one end connected to one main surface of the wiring board.
  • the composite module is connected to the external mother substrate by soldering.
  • connection state of both connection portions can be viewed from the side of the composite module mounted on the mother board.
  • the end surface of the other end of the columnar conductor may be exposed from the surface opposite to the surface of the resin layer facing the wiring board.
  • the end face is also exposed from the resin layer in addition to a part of the side face at the other end of the columnar conductor, the end face and side face of the other end exposed from the resin layer of the columnar conductor are used as connection surfaces to the outside. Can function. Therefore, compared with a conventional composite module that is connected to the outside only by the other end face of the columnar conductor, the connection area with the outside is widened, and the connection strength and connection reliability with the outside are improved.
  • the other end of the columnar conductor may have a larger cross-sectional area than the one end. If it does in this way, since the side surface of the other end of the columnar conductor can be brought close to the peripheral side surface of the resin layer, the visibility of the composite module and the external connection portion is improved. In addition, when the end surface of the other end is exposed from the resin layer, the area of the connection surface with the outside becomes large, so even if the connection portion with the wiring board is not covered with the resin layer like the one end side, the external surface Connection strength and connection reliability can be ensured.
  • a protruding portion directed toward the peripheral side surface may be formed at the other end of the columnar conductor so as to be exposed from the peripheral side surface of the resin layer. If it does in this way, since the side surface of the other end of a columnar conductor will approach the peripheral side surface of a resin layer, the visibility of a composite module and an external connection part will improve.
  • a notch portion may be formed on the peripheral side surface of the resin layer so that a part of the side surface of the other end of the columnar conductor is exposed.
  • the connection state of the connecting portions can be visually recognized from the side of the composite module mounted on the mother board.
  • the stress resistance characteristic of the connection portion between the wiring board and the columnar conductor can be maintained.
  • FIG. 10 is a bottom view of the composite module of FIG. 9. It is sectional drawing of the composite module concerning 3rd Embodiment of this invention. It is sectional drawing of the conventional composite module.
  • FIGS. 1 and 2 are cross-sectional views of the composite module 1 according to the first embodiment, and FIG. 2 is a bottom view of the composite module 1.
  • FIG. 2 the cross section of one end of each columnar conductor 4 is indicated by a broken line.
  • the composite module 1 has a wiring board 2 in which wiring electrodes, via conductors, and the like are formed on the surface and inside thereof, and one end of the wiring board 2 on one edge of the main surface.
  • a plurality of columnar conductors 4 for external connection arranged in a connected state, a plurality of electronic components 3a and 3b mounted on both main surfaces of the wiring board 2, and one main surface of the wiring board 2, an electronic component 3a and the first resin layer 5a laminated on the wiring board 2 so as to cover each columnar conductor 4, and the second resin laminated on the wiring board 2 so as to cover the other main surface of the wiring board 2 and each electronic component 3b.
  • the wiring board 2 is, for example, a low-temperature co-fired ceramic (LTCC) multilayer board or a glass epoxy resin multilayer board, and a land for mounting the electronic components 3a and 3b and the columnar conductors 4 on both main surfaces thereof. Electrodes 6a and 6b are formed. Further, as described above, various wiring electrodes, via conductors and the like (not shown) are also formed therein.
  • the wiring board 2 may have a single layer structure.
  • Each electronic component 3a, 3b is, for example, a semiconductor element formed of Si, GaAs, or the like, or a chip component such as a chip capacitor, a chip inductor, or a chip resistor, and an electrode provided on each of the electronic components 3a, 3b It is mounted on both main surfaces of the wiring board 2 by being connected to predetermined land electrodes 6a and 6b of the wiring board 2 by solder or the like.
  • Each columnar conductor 4 is formed of Cu or the like, one end of which is connected to a land electrode 6a provided on the periphery of one main surface of the wiring board 2, and the other end is provided on a predetermined mother board or the like.
  • the mounting electrodes are connected by soldering or the like.
  • each columnar conductor 4 has a substantially circular cross section at both ends, and the other end is formed with a larger cross-sectional area than one end. A flange portion is formed on the side.
  • Each of the columnar conductors 4 can be formed by cutting and processing a wire made of Cu, for example.
  • the shape of the cross section of the both ends of each columnar conductor 4 is not restricted circularly, For example, rectangular shape may be sufficient.
  • positioning of each columnar conductor 4 can be changed suitably.
  • the first and second resin layers 5a and 5b are each formed of an epoxy resin or the like, and the first resin layer 5a covers the one main surface of the wiring board 2, the electronic component 3a, and each columnar conductor 4, and the wiring board.
  • the second resin layer 5b is laminated on the other main surface of the wiring board 2 so as to cover the other main surface of the wiring board 2 and each electronic component 3b.
  • the first resin layer 5a embeds one end of each columnar conductor 4 and covers each columnar conductor 4 with the other end face and a part of the side surface exposed.
  • the first resin layer 5a corresponds to the “resin layer” in the present invention.
  • each columnar conductor 4 has its end surface exposed from the surface opposite to the surface of the first resin layer 5a facing the wiring board 2, and a part of the side surface of the first conductor layer 5a.
  • the formed notch 5a1 exposes the peripheral side surface of the first resin layer 5a.
  • the notch 5a1 is formed on the other side of each columnar conductor 4 from the peripheral side surface of the first resin layer 5a so that the opposite surface of the first resin layer 5a opposite to the wiring substrate 2 is bordered. Cut out toward the side of the end.
  • FIGS. 3 and 4 are diagrams for explaining the method of manufacturing the composite module 1.
  • FIGS. 3A to 3E show the respective steps, and FIGS. 4A to 4D are shown. These show each process following FIG.3 (e).
  • a method for manufacturing the composite module 1 will be described by taking as an example a case in which an assembly formed by a plurality of composite modules 1 is manufactured separately for each unit of the composite modules 1.
  • the composite module 1 can also be manufactured one by one in the same manner as the manufacturing method described below. 3 and 4, only two adjacent composite modules 1 in the aggregate of composite modules 1 are illustrated.
  • an assembly substrate 7 formed of a low-temperature co-fired ceramic or glass epoxy resin is prepared (preparation step).
  • land electrodes 6a and 6b for mounting the respective electronic components 3a and 3b and the respective columnar conductors 4 are formed on both main surfaces of the assembly substrate 7, and various wiring electrodes and vias are formed therein. Conductors are formed.
  • Each columnar conductor 4 is mounted on one main surface of the assembly substrate 7 by connecting the land electrode 6a) and one end of each columnar conductor 4 (columnar conductor mounting step).
  • each columnar conductor 4 and electronic component 3a can be mounted using a known surface mounting technique. Moreover, the mounting order of each columnar conductor 4 and the electronic component 3a may be reversed.
  • an epoxy resin is applied or printed on one main surface of the assembly substrate 7, so that one main surface of each assembly substrate 7, each columnar conductor 4, and the electronic component
  • a first resin layer 5a formed by covering 3a is laminated on one main surface of the aggregate substrate 7 (first resin layer forming step).
  • the first resin layer 5a can be formed using a coating method, a printing method, a compression mold method, a transfer mold method, or the like.
  • the surface of the first resin layer 5a (corresponding to the opposite surface of the first resin layer 5a to the one main surface of the wiring board 2) is polished or ground.
  • the other end face of each columnar conductor 4 is exposed from the first resin layer 5a (polishing / grinding step).
  • the surface of each columnar conductor 4 may be polished / ground.
  • the electronic component 3b is mounted on the other main surface of the assembly board 7 in the same manner as the first component mounting step (second component mounting step).
  • the second resin layer 5b formed by covering the other main surface of the assembly substrate 7 and each electronic component 3b is assembled. It laminates on the other main surface of body substrate 7 (second resin layer forming step).
  • the first resin is introduced along the singulation line L by letting the blade enter from the side of the first resin layer 5 a opposite to the direction in which the blade enters in the first blade process.
  • the layer 5a is shaved to obtain the separated composite module 1 (second blade step).
  • the blade is thicker than the blade used in the first blade step so that the side surface of the other end of each columnar conductor 4 is exposed.
  • a cutout portion 5a1 that exposes a part of the side surface of the other end of each columnar conductor 4 is formed on the peripheral side surface of the first resin layer 5a.
  • the depth at which the first resin layer 5 a is shaved with a blade is limited to the other end portion of each columnar conductor 4 so that the side surface of one end of each columnar conductor 4 is not exposed.
  • the process order of the first and second blade processes may be reversed.
  • a second blade step is provided. Instead, it may be separated into individual composite modules 1 at the stage of the first blade process.
  • the peripheral side surface of the first resin layer 5a in which a part of the side surface of the other end is laminated so as to cover each columnar conductor 4 For example, when the composite module 1 is connected to an external mother board by soldering, the connection state of both connecting portions can be visually recognized from the side surface side of the composite module 1 mounted on the mother board. it can.
  • each columnar conductor 4 is covered with one end embedded in the first resin layer 5a, so that the wiring of the composite module 1 can be ensured when the composite module 1 is connected to the outside. The stress resistance characteristics of the connection portion between the substrate 2 and each columnar conductor 4 can be maintained.
  • each columnar conductor 4 is exposed not only from the end surface at the other end, but also from the first resin layer 5a, a part of the side surface is exposed from the end surface at the other end of the columnar conductor 4 and the first resin layer 5a.
  • a part of the exposed side surface can function as a connection surface with the outside. Therefore, compared with a conventional composite module that is connected to the outside only by the other end face of the columnar conductor, the connection area with the outside is widened, and the connection strength and connection reliability with the outside are improved.
  • each columnar conductor 4 has a cross-sectional area larger than that of one end, and a flange portion is formed at the other end, so that the side surface of the other end of the columnar conductor 4 is a circumferential side surface of the first resin layer 5a. Therefore, the visibility of the composite module 1 and the external connection portion is improved. Further, if the cross-sectional area of the other end is made larger than that of one end, the area of the connection surface with the outside becomes larger. Therefore, the connection portion with the wiring board 2 is covered and reinforced with the first resin layer 5a like the one end side. Even without this, connection strength and connection reliability with the outside can be ensured.
  • the side surface of the other end of each columnar conductor 4 can be easily exposed from the peripheral side surface of the first resin layer 5a.
  • FIGS. 5 to 7 is a diagram for explaining each modification.
  • Each of the modified examples shown in FIGS. 5 to 7 is a method of mounting a plurality of columnar conductors 4 together on one main surface of the wiring board 2.
  • a solder paste is applied or printed on the land electrode 6a for mounting the columnar conductor 4 formed on one main surface of the assembly substrate 7,
  • a flat support 8 is prepared for each composite module 1, and the other end of each columnar conductor 4 is fixed to a predetermined position on one main surface of the support 8.
  • the other main surface of the support 8 to which each columnar conductor 4 is fixed is adsorbed to an adsorbing portion of the mounter, and the support 8 is mounted at a predetermined position on the assembly substrate 7 (wiring substrate 2).
  • the columnar conductors 4 are collectively mounted on one main surface of the assembly board 7 (wiring board 2). Next, as shown in FIG. 5 (b), the support body 8 is peeled off from the other end of each columnar conductor 4, and the assembly substrate 7 on which each columnar conductor 4 is mounted as shown in FIG. 3 (b). obtain. If it does in this way, mounting of each columnar conductor 4 can be performed easily.
  • each columnar conductor 4 is arranged for each composite module 1.
  • a frame-shaped member 9 that constitutes a part of the first resin layer 5a is prepared. At this time, the both end surfaces of each columnar conductor 4 are exposed.
  • the columnar members 4 are assembled together by mounting the frame-shaped member 9 at a predetermined position on one main surface of the assembly substrate 7 (wiring substrate 2). It is mounted on one main surface of the substrate 7 (wiring substrate 2).
  • the frame-like member 9 is made of, for example, glass epoxy resin.
  • each columnar conductor 4 on the frame-shaped member 9 for example, a through-hole adapted to the shape of each columnar conductor 4 is formed at a predetermined position of the frame-shaped member 9 by laser processing or the like.
  • the columnar conductors 4 are fitted into the through holes.
  • the columnar conductors 4 may be formed by filling the through holes with Cu paste or the like, or by plating.
  • the frame-shaped member 9 when preparing the frame-shaped member 9 in which each columnar conductor 4 is arranged, the frame-shaped member 9 may have a configuration in which a cutout corresponding to the cutout portion 5a1 of the first resin layer 5a is formed in advance.
  • the notch is formed by the blade so that the side surface of the other end of each columnar conductor 4 is exposed from the outer peripheral side surface of the frame-shaped member 9. Then, after mounting the frame-shaped member 9 and mounting the electronic component 3a, the first resin layer composed of the frame-shaped member 9 and the epoxy resin in the surrounding region is filled with an epoxy resin in the surrounding region by the frame-shaped member 9. 5a is formed.
  • an assembly substrate 7 with a solder paste is prepared in the same manner as in the first modification, and adjacent columnar conductors 4 between adjacent composite modules 1 are prepared.
  • a rod-shaped member 10 is prepared by integrating and integrating the members. Specifically, in each composite module 1, each columnar conductor 4 arranged on the periphery of the wiring board 2 shown in FIG. 2 is replaced with two long side blocks arranged along the long side of the wiring board 2 and a short side. Dividing into a total of four blocks of two short side blocks arranged along the side, adjacent long side blocks of the adjacent composite module 1 or short side blocks are collectively arranged for each block.
  • the rod-shaped member 10 integrated is prepared.
  • This rod-shaped member 10 is formed of, for example, a glass epoxy resin or the like, like the frame-shaped member 9 of the second modification, and constitutes a part of the first resin layer 5a. Further, the arrangement / formation method of each columnar conductor 4 on the rod-shaped member 10 is the same as that of the second modification.
  • the columnar conductors 4 may be separately arranged or formed on each rod-shaped member 10, or as shown in FIG. 7C. As described above, the other ends of the columnar conductors 4 may be connected or formed between adjacent composite modules 1.
  • the rod-like member 10 is configured as shown in FIG. 7C, full cutting is performed at the stage of the first blade process where the blade thickness is thinner than that of the second blade process, and individual composite modules 1 are separated into individual pieces. Even in this case, the second blade process can be reduced because a part of the side surface of the other end of each columnar conductor 4 can be exposed from the peripheral side surface of the first resin layer 5a.
  • FIG. 8 is a diagram for explaining a method of forming the columnar conductor 4 according to this example, and (a) to (f) show the respective steps.
  • This example is a method of forming each columnar conductor 4 by a plating process. Briefly described, first, as shown in FIG. 8 (a), both main parts are mounted for mounting electronic components 3a and 3b and An assembly substrate 7 on which land electrodes 6a and 6b for forming each columnar conductor 4 are formed is prepared.
  • a first resist 11 is formed on one main surface of the aggregate substrate 7.
  • the opening 11a is formed in the first resist 11 so that the land electrode 6a for forming each columnar conductor 4 is exposed.
  • the thickness is a thickness that forms one end of each columnar conductor 4.
  • each opening 11a is filled with Cu by plating, and one end of each columnar conductor 4 connected to each land electrode 6a for forming the columnar conductor 4 is formed.
  • the second resist 12 is formed on the first resist 11 (the lower side in the drawing) using the same material as the resin that forms the first resist 11.
  • the opening 12a is formed in the second resist 12 so that the end surface of one end of each columnar conductor 4 (the surface opposite to the connection surface with the land electrode 6a) is exposed.
  • the opening 12a is formed so that the opening area is wider than the opening 11a on one end side so that the cross-sectional area of the end face of the other end of the columnar conductor 4 is larger than that of one end.
  • each opening 12a is filled with Cu by a plating process to form the other end of the columnar conductor 4 whose cross-sectional area is larger than that of one end.
  • FIGS. 9 is a cross-sectional view of the composite module 1a
  • FIG. 10 is a bottom view of the composite module 1a.
  • the cross section of the end of each columnar conductor 4a is shown with the broken line.
  • the composite module 1a according to this embodiment differs from the composite module 1 of the first embodiment described with reference to FIGS. 1 and 2 in that the shape of each columnar conductor 4a is as shown in FIGS. Is different. Since other configurations are the same as those of the composite module 1 of the first embodiment, the description thereof is omitted by attaching the same reference numerals.
  • the cutout portion 5a1 is not formed on the peripheral side surface of the first resin layer 5a, and the first resin layer 5a A protrusion 4a1 is formed at the other end of each columnar conductor 4a so as to be exposed from the peripheral side surface.
  • the protrusion 4a1 is formed so that the width W in the direction perpendicular to the direction toward the peripheral side surface is substantially the same as the diameter of the cross section on the one end side, up to the peripheral side surface of the first resin layer 5a. It is formed to extend.
  • the composite module 1 according to this embodiment includes a method for manufacturing the composite module 1 according to the first embodiment described with reference to FIGS. 3 to 8, a modification of the method for mounting the columnar conductor 4, and a method for forming the columnar conductor. It can be manufactured in the same manner as the modified example. However, since the protrusion 4a1 at the other end of each columnar conductor 4a is formed to extend so as to reach the peripheral side surface of the first resin layer 5a, the second provided by the method for manufacturing the composite module 1 of the first embodiment. The blade process becomes unnecessary, and the full cutting is performed at the stage of the first blade process to separate each composite module 1a.
  • the side surface of the other end of each columnar conductor 4a can be exposed from the peripheral side surface of the first resin layer 5a, so that the composite module 1a is mounted on an external mother board using solder.
  • the connection state of both connection parts can be visually recognized from the side surface side of the composite module 1a.
  • not only the end surface of the other end of each columnar conductor 4a but also a part of the side surface exposed from the first resin layer 5a can function as a connection surface with the outside. Therefore, it is possible to improve the connection strength and connection reliability with the outside.
  • each columnar conductor 4a is formed so as to extend to the peripheral side surface of the first resin layer 5a with a width W that is substantially the same as the diameter of the cross section on the one end side. Compared with the composite module 1 of the first embodiment, the pitch of each columnar conductor 4a can be reduced.
  • FIG. 11 is a cross-sectional view of the composite module 1b.
  • the composite module 1b according to this embodiment differs from the composite module 1 of the first embodiment described with reference to FIGS. 1 and 2 in that the shape of each columnar conductor 4b is different as shown in FIG. It is. Since the other configuration is the same as that of the first embodiment, description thereof is omitted by attaching the same reference numerals.
  • each of the columnar conductors 4b is formed in a columnar shape having the same cross-sectional area at both ends, and a part of the side surface at the other end is formed by the notch 5a1 formed on the peripheral side surface of the first resin layer 5a. It is exposed from the peripheral side surface of the resin layer 5a.
  • Each columnar conductor 4b is not limited to the columnar shape described above, and may be formed in a tapered shape that tapers from the other end side toward the one end side, for example. If it does in this way, the area of the end surface of the other end of each columnar conductor 4b used as a connection surface with the exterior can be enlarged compared with one end side.
  • the composite module 1b according to this embodiment can also be manufactured in the same manner as the composite module manufacturing method of the first embodiment, a variation of the mounting method of each columnar conductor 4, and the method of forming each columnar conductor 4.
  • the thickness of the blade used in the second blade step is adjusted so that a part of the side surface at the other end of each columnar conductor 4b is exposed.
  • the side surface of the other end of each columnar conductor 4b is slightly shaved to ensure that a part of the other side surface of each columnar conductor 4b is exposed from the peripheral side surface of the first resin layer 5a. May be. By comprising in this way, the effect similar to the composite module 1 of 1st Embodiment is acquired.
  • the present invention is not limited to the above-described embodiments, and various modifications other than those described above can be made without departing from the spirit thereof.
  • the other end face and part of the side surface of each columnar conductor 4, 4a, 4b are exposed from the first resin layer 5a.
  • part of the side surface of each columnar conductor 4, 4a, 4b It is only necessary to be exposed from the peripheral side surface of the first resin layer 5a, and the end surface at the other end is not necessarily exposed from the first resin layer 5a.
  • it connects with the exterior using a part of side surface of the other end of each columnar conductor 4,4a, 4b exposed from the surrounding side surface of the 1st resin layer 5a. Even in this way, the connection state of the connection portion between the composite module 1, 1a, 1b and the outside can be visually recognized from the side surface side of the composite module 1, 1a, 1b.
  • each columnar conductor 4, 4a, 4b is formed of Cu.
  • each columnar conductor 4, 4A is made of other metal such as Ag, Al, Au. 4a and 4b may be formed.
  • the present invention can be applied to various composite modules that are connected to the outside using columnar conductors.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

　A composite module connecting to the exterior with a columnar conductor, wherein the state of connection with the exterior is visible. The composite module (1) is provided with: a wiring substrate (2) on which are mounted electronic components (3a, 3b); a plurality of external connection columnar conductors (4) disposed such that one end thereof is connected to the peripheral edge of one main surface of the wiring substrate (2); and a first resin layer (5a) covering the one main surface of the wiring substrate (2) and the columnar conductors (4), and layered on the wiring substrate (2); a notch section (5a1) being formed on the peripheral side surface of the first resin layer (5a) so that the side surfaces on the other end of the columnar conductors (4) are exposed. In such a configuration, the side surfaces at the other ends of the columnar conductors (4) connected to the exterior are exposed from the peripheral side surface of the first resin layer (5a); therefore, when the composite module (1) is connected to the exterior, the connection state of both connection parts can be seen from the side-surface side of the composite module (1).

Description

複合モジュールCompound module
本発明は、配線基板の一方主面にその一端が接続された外部接続用の柱状導体が樹脂封止されてなる複合モジュールに関する。 The present invention relates to a composite module in which a columnar conductor for external connection having one end connected to one main surface of a wiring board is sealed with a resin.
　電子機器の小型化に伴って、これに搭載される複合モジュールの小型化も要求されており、従来より、小型化を目的とした種々の複合モジュールが提案されている。例えば、特許文献１に記載の複合モジュール１００では、図１２に示すように、表面および内部に配線電極やスルーホールが形成された配線基板１０１の一方主面にＬＳＩチップ１０２および柱状導体１０４が搭載され、樹脂層１０５により、配線基板１０１の一方主面がＬＳＩチップ１０２および柱状導体１０４とともに被覆される。このとき、ＬＳＩチップ１０２の電極と配線基板１０１の一方主面に形成された所定の配線電極とが、Ａｕワイヤ１０３で接続され、柱状導体１０４の一端が配線基板１０１の一方主面に形成された所定の配線電極に接続される。また、柱状導体１０４の他端は、樹脂層１０５の表面から露出しており、表面側の外部接続電極として使用される。 With downsizing of electronic devices, downsizing of composite modules mounted on the electronic equipment is also required, and various composite modules for miniaturization have been proposed. For example, in the composite module 100 described in Patent Document 1, as shown in FIG. 12, an LSI chip 102 and a columnar conductor 104 are mounted on one main surface of a wiring board 101 having wiring electrodes and through holes formed on the surface and inside. Then, one main surface of the wiring substrate 101 is covered with the LSI chip 102 and the columnar conductor 104 by the resin layer 105. At this time, the electrode of the LSI chip 102 and a predetermined wiring electrode formed on one main surface of the wiring substrate 101 are connected by the Au wire 103, and one end of the columnar conductor 104 is formed on the one main surface of the wiring substrate 101. Connected to a predetermined wiring electrode. The other end of the columnar conductor 104 is exposed from the surface of the resin layer 105 and is used as an external connection electrode on the surface side.
　また、配線基板１０１の他方主面には、スルーホール内部の導体を介して配線電極と接続された裏面電極が形成され、該裏面電極が裏面側の外部接続電極として使用される。 Also, on the other main surface of the wiring board 101, a back electrode connected to the wiring electrode via a conductor inside the through hole is formed, and the back electrode is used as an external connection electrode on the back surface side.
　このように、複合モジュール１００内の配線を立体構造とすることで、配線が平面的に形成される従来の複合モジュールと比較して、配線基板１０１の主面の面積を小さくすることができるため、複合モジュール１００の小型化を図ることができる。 As described above, since the wiring in the composite module 100 has a three-dimensional structure, the area of the main surface of the wiring board 101 can be reduced as compared with the conventional composite module in which the wiring is formed in a plane. Therefore, the composite module 100 can be reduced in size.
特開２００８－１６７２９号公報（段落００１１、図１等参照）Japanese Patent Laying-Open No. 2008-16729 (see paragraph 0011, FIG. 1, etc.)
　しかしながら、従来の複合モジュール１００では、柱状導体１０４が樹脂層１０５の内部に配置され、その周側面全体が樹脂層１０５により被覆されているため、例えば、半田により、樹脂層１０５から露出した柱状導体１０４の他端の端面を外部のマザー基板などに接続した場合、両者の接続部の状態（例えば、半田の濡れ状態）を外部から視認することができない。したがって、当該接続部の接続状態の良否は、電気検査のみで判断するしかなく、目視でも判断できるようにしたいという要請があった。 However, in the conventional composite module 100, since the columnar conductor 104 is disposed inside the resin layer 105 and the entire peripheral side surface thereof is covered with the resin layer 105, the columnar conductor exposed from the resin layer 105 by solder, for example. When the end face of the other end of 104 is connected to an external mother board or the like, the state of the connecting portion between them (for example, the wet state of the solder) cannot be visually recognized from the outside. Therefore, there has been a request that whether or not the connection state of the connection portion is good can be determined only by an electrical inspection, but can also be determined visually.
　本発明は、上記した課題に鑑みてなされたものであり、柱状導体により外部と接続する複合モジュールにおいて、外部との接続状態を視認可能にすることを目的とする。 The present invention has been made in view of the above-described problems, and an object of the present invention is to make a connection state with the outside visible in a composite module connected to the outside with a columnar conductor.
　上記した目的を達成するために、本発明の複合モジュールは、電子部品が実装される配線基板と、前記配線基板の一方主面にその一端が接続された状態で配置される外部接続用の柱状導体と、前記配線基板の一方主面および前記柱状導体を被覆して前記配線基板に積層された樹脂層とを備え、前記柱状導体の他端の側面の一部が、前記樹脂層の周側面から露出していることを特徴としている。 In order to achieve the above-described object, the composite module of the present invention includes a wiring board on which electronic components are mounted, and a columnar shape for external connection arranged with one end connected to one main surface of the wiring board. A conductor and a resin layer coated on the wiring board so as to cover the one main surface of the wiring board and the columnar conductor, and a part of the side surface of the other end of the columnar conductor is a peripheral side surface of the resin layer It is characterized by being exposed from.
　この場合、外部と接続される柱状導体の他端の側面が、柱状導体を被覆して積層された樹脂層の周側面から露出しているため、例えば、複合モジュールを半田により外部のマザー基板と接続した場合に、両者の接続部の接続状態を、マザー基板に実装した複合モジュールの側面側から視認することができる。 In this case, since the side surface of the other end of the columnar conductor connected to the outside is exposed from the peripheral side surface of the resin layer that is laminated to cover the columnar conductor, for example, the composite module is connected to the external mother substrate by soldering. In the case of connection, the connection state of both connection portions can be viewed from the side of the composite module mounted on the mother board.
　また、配線基板に接続された柱状導体の一端は、樹脂層により被覆されているため、配線基板と柱状導体との接続部の耐応力特性を維持することができる。 In addition, since one end of the columnar conductor connected to the wiring board is covered with the resin layer, the stress resistance characteristics of the connection portion between the wiring board and the columnar conductor can be maintained.
　また、前記柱状導体の他端の端面が、前記樹脂層の前記配線基板との対向面の反対面から露出していてもよい。この場合、柱状導体の他端の側面の一部に加えて端面も樹脂層から露出することになるため、柱状導体の樹脂層から露出した他端の端面と側面とを外部との接続面として機能させることができる。したがって、柱状導体の他端の端面のみで外部と接続させる従来の複合モジュールと比較して、外部との接続面積が広くなり、外部との接続強度および接続信頼性が向上する。 Further, the end surface of the other end of the columnar conductor may be exposed from the surface opposite to the surface of the resin layer facing the wiring board. In this case, since the end face is also exposed from the resin layer in addition to a part of the side face at the other end of the columnar conductor, the end face and side face of the other end exposed from the resin layer of the columnar conductor are used as connection surfaces to the outside. Can function. Therefore, compared with a conventional composite module that is connected to the outside only by the other end face of the columnar conductor, the connection area with the outside is widened, and the connection strength and connection reliability with the outside are improved.
　また、前記柱状導体の他端は、前記一端よりも横断面積が大きく形成されていてもよい。
このようにすると、柱状導体の他端の側面を、樹脂層の周側面に近づけることができるため、複合モジュールと外部の接続部の視認性が向上する。また、他端の端面を樹脂層から露出させた場合は、外部との接続面の面積が広くなるため、一端側のように配線基板との接続部を樹脂層で被覆しなくても、外部との接続強度および接続信頼性を確保することができる。 Further, the other end of the columnar conductor may have a larger cross-sectional area than the one end.
If it does in this way, since the side surface of the other end of the columnar conductor can be brought close to the peripheral side surface of the resin layer, the visibility of the composite module and the external connection portion is improved. In addition, when the end surface of the other end is exposed from the resin layer, the area of the connection surface with the outside becomes large, so even if the connection portion with the wiring board is not covered with the resin layer like the one end side, the external surface Connection strength and connection reliability can be ensured.
　また、前記柱状導体の他端には、前記樹脂層の周側面から露出するように、当該周側面方向に向かう突出部が形成されていてもよい。このようにすると、柱状導体の他端の側面が樹脂層の周側面に近づくため、複合モジュールと外部の接続部の視認性が向上する。 Further, a protruding portion directed toward the peripheral side surface may be formed at the other end of the columnar conductor so as to be exposed from the peripheral side surface of the resin layer. If it does in this way, since the side surface of the other end of a columnar conductor will approach the peripheral side surface of a resin layer, the visibility of a composite module and an external connection part will improve.
　また、前記柱状導体の前記他端の側面の一部が露出するように、前記樹脂層の周側面に切欠部が形成されていてもよい。このように樹脂層の周側面に切欠部を設けることで、柱状導体の他端の側面を容易に樹脂層から露出させることができる。 Further, a notch portion may be formed on the peripheral side surface of the resin layer so that a part of the side surface of the other end of the columnar conductor is exposed. Thus, by providing a notch in the peripheral side surface of the resin layer, the side surface of the other end of the columnar conductor can be easily exposed from the resin layer.
　本発明によれば、外部と接続される柱状導体の他端の側面が、柱状導体を被覆して積層された樹脂層の周側面から露出しているため、例えば、複合モジュールを半田により外部のマザー基板と接続した場合に、両者の接続部の接続状態を、マザー基板に実装した複合モジュールの側面側から視認することができる。また、配線基板に接続された柱状導体の一端は、樹脂層により被覆されているため、配線基板と柱状導体との接続部の耐応力特性を維持することができる。 According to the present invention, since the side surface of the other end of the columnar conductor connected to the outside is exposed from the peripheral side surface of the resin layer that is laminated so as to cover the columnar conductor, for example, the composite module is When connected to the mother board, the connection state of the connecting portions can be visually recognized from the side of the composite module mounted on the mother board. In addition, since one end of the columnar conductor connected to the wiring board is covered with the resin layer, the stress resistance characteristic of the connection portion between the wiring board and the columnar conductor can be maintained.
本発明の第１実施形態にかかる複合モジュールの断面図である。It is sectional drawing of the composite module concerning 1st Embodiment of this invention. 図１の複合モジュールの底面図である。It is a bottom view of the composite module of FIG. 図１の複合モジュールの製造方法を説明するための図である。It is a figure for demonstrating the manufacturing method of the composite module of FIG. 図１の複合モジュールの製造方法を説明するための図である。It is a figure for demonstrating the manufacturing method of the composite module of FIG. 柱状導体の実装方法の第１変形例を示す図である。It is a figure which shows the 1st modification of the mounting method of a columnar conductor. 柱状導体の実装方法の第２変形例を示す図である。It is a figure which shows the 2nd modification of the mounting method of a columnar conductor. 柱状導体の実装方法の第３変形例を示す図である。It is a figure which shows the 3rd modification of the mounting method of a columnar conductor. 柱状導体の形成方法の変形例を示す図である。It is a figure which shows the modification of the formation method of a columnar conductor. 本発明の第２実施形態にかかる複合モジュールの断面図である。It is sectional drawing of the composite module concerning 2nd Embodiment of this invention. 図９の複合モジュールの底面図である。FIG. 10 is a bottom view of the composite module of FIG. 9. 本発明の第３実施形態にかかる複合モジュールの断面図である。It is sectional drawing of the composite module concerning 3rd Embodiment of this invention. 従来の複合モジュールの断面図である。It is sectional drawing of the conventional composite module.
　＜第１実施形態＞
　本発明の第１実施形態にかかる複合モジュール１について、図１および図２を参照して説明する。なお、図１は第１実施形態にかかる複合モジュール１の断面図、図２は複合モジュール１の底面図である。なお、図２では、各柱状導体４の一端の横断面を破線で示している。 <First Embodiment>
The composite module 1 according to the first embodiment of the present invention will be described with reference to FIGS. 1 and 2. 1 is a cross-sectional view of the composite module 1 according to the first embodiment, and FIG. 2 is a bottom view of the composite module 1. In FIG. 2, the cross section of one end of each columnar conductor 4 is indicated by a broken line.
　この実施形態にかかる複合モジュール１は、図１に示すように、その表面や内部に配線電極やビア導体などが形成された配線基板２と、配線基板２の一方主面の周縁にその一端が接続された状態で配置された複数の外部接続用の柱状導体４と、配線基板２の両主面それぞれに実装された複数の電子部品３ａ，３ｂと、配線基板２の一方主面、電子部品３ａおよび各柱状導体４を被覆して配線基板２に積層された第１樹脂層５ａと、配線基板２の他方主面および各電子部品３ｂを被覆して配線基板２に積層された第２樹脂層５ｂとを備え、種々の電子機器に搭載される。 As shown in FIG. 1, the composite module 1 according to this embodiment has a wiring board 2 in which wiring electrodes, via conductors, and the like are formed on the surface and inside thereof, and one end of the wiring board 2 on one edge of the main surface. A plurality of columnar conductors 4 for external connection arranged in a connected state, a plurality of electronic components 3a and 3b mounted on both main surfaces of the wiring board 2, and one main surface of the wiring board 2, an electronic component 3a and the first resin layer 5a laminated on the wiring board 2 so as to cover each columnar conductor 4, and the second resin laminated on the wiring board 2 so as to cover the other main surface of the wiring board 2 and each electronic component 3b. Layer 5b and mounted on various electronic devices.
　配線基板２は、例えば、低温同時焼成セラミック（ＬＴＣＣ）多層基板やガラスエポキシ樹脂多層基板であり、その両主面それぞれには、各電子部品３ａ，３ｂおよび各柱状導体４を実装するためのランド電極６ａ，６ｂが形成される。また、上記したように、その内部には、図示しない各種配線電極やビア導体なども形成されている。なお、配線基板２は、単層構造であってもかまわない。 The wiring board 2 is, for example, a low-temperature co-fired ceramic (LTCC) multilayer board or a glass epoxy resin multilayer board, and a land for mounting the electronic components 3a and 3b and the columnar conductors 4 on both main surfaces thereof. Electrodes 6a and 6b are formed. Further, as described above, various wiring electrodes, via conductors and the like (not shown) are also formed therein. The wiring board 2 may have a single layer structure.
　各電子部品３ａ，３ｂは、例えば、ＳｉやＧａＡｓなどで形成された半導体素子や、チップキャパシタ、チップインダクタ、チップ抵抗などのチップ部品であり、各電子部品３ａ，３ｂそれぞれに設けられた電極が半田などにより配線基板２の所定のランド電極６ａ，６ｂに接続されることで、配線基板２の両主面に実装される。 Each electronic component 3a, 3b is, for example, a semiconductor element formed of Si, GaAs, or the like, or a chip component such as a chip capacitor, a chip inductor, or a chip resistor, and an electrode provided on each of the electronic components 3a, 3b It is mounted on both main surfaces of the wiring board 2 by being connected to predetermined land electrodes 6a and 6b of the wiring board 2 by solder or the like.
　各柱状導体４は、それぞれ、Ｃｕなどで形成され、その一端が配線基板２の一方主面の周縁に設けられたランド電極６ａに接続され、他端が外部のマザー基板などに設けられた所定の実装電極に半田などにより接続される。このとき、各柱状導体４それぞれは、図１および図２に示すように、両端それぞれの横断面が略円形であって、他端が一端よりも横断面積が大きく形成されることで、他端側にフランジ部が形成される。これらの各柱状導体４は、例えば、Ｃｕからなる線材を切断・加工して形成することができる。なお、各柱状導体４の両端の横断面の形状は、円状に限らず、例えば、矩形状であってもかまわない。また、各柱状導体４の配置数は、適宜、変更可能である。 Each columnar conductor 4 is formed of Cu or the like, one end of which is connected to a land electrode 6a provided on the periphery of one main surface of the wiring board 2, and the other end is provided on a predetermined mother board or the like. The mounting electrodes are connected by soldering or the like. At this time, as shown in FIGS. 1 and 2, each columnar conductor 4 has a substantially circular cross section at both ends, and the other end is formed with a larger cross-sectional area than one end. A flange portion is formed on the side. Each of the columnar conductors 4 can be formed by cutting and processing a wire made of Cu, for example. In addition, the shape of the cross section of the both ends of each columnar conductor 4 is not restricted circularly, For example, rectangular shape may be sufficient. Moreover, the number of arrangement | positioning of each columnar conductor 4 can be changed suitably.
　第１および第２樹脂層５ａ，５ｂは、それぞれ、エポキシ樹脂などで形成され、第１樹脂層５ａは、配線基板２の一方主面、電子部品３ａおよび各柱状導体４を被覆して配線基板２の一方主面に積層され、第２樹脂層５ｂは、配線基板２の他方主面および各電子部品３ｂを被覆して配線基板２の他方主面に積層される。このとき、第１樹脂層５ａは、各柱状導体４の一端を埋設するとともに、他端の端面および側面の一部が露出した状態で、各柱状導体４を被覆している。なお、第１樹脂層５ａが、本発明における「樹脂層」に相当する。 The first and second resin layers 5a and 5b are each formed of an epoxy resin or the like, and the first resin layer 5a covers the one main surface of the wiring board 2, the electronic component 3a, and each columnar conductor 4, and the wiring board. The second resin layer 5b is laminated on the other main surface of the wiring board 2 so as to cover the other main surface of the wiring board 2 and each electronic component 3b. At this time, the first resin layer 5a embeds one end of each columnar conductor 4 and covers each columnar conductor 4 with the other end face and a part of the side surface exposed. The first resin layer 5a corresponds to the “resin layer” in the present invention.
　具体的には、各柱状導体４の他端は、その端面が、第１樹脂層５ａの配線基板２との対向面の反対面から露出し、その側面の一部が、第１樹脂層５ａ形成された切欠部５ａ１により、第１樹脂層５ａの周側面から露出している。この切欠部５ａ１は、図２に示すように、第１樹脂層５ａの配線基板２との対向面の反対面を縁取るように、第１樹脂層５ａの周側面から各柱状導体４の他端の側面に向けて切欠いて形成される。なお、各柱状導体４の他端の側面が第１樹脂層５ａの周側面に到達するように、その横断面積（柱状導体４の他端）が大きく形成されている場合は、必ずしも、第１樹脂層５ａに切欠部５ａ１を設けなくてもよい。 Specifically, the other end of each columnar conductor 4 has its end surface exposed from the surface opposite to the surface of the first resin layer 5a facing the wiring board 2, and a part of the side surface of the first conductor layer 5a. The formed notch 5a1 exposes the peripheral side surface of the first resin layer 5a. As shown in FIG. 2, the notch 5a1 is formed on the other side of each columnar conductor 4 from the peripheral side surface of the first resin layer 5a so that the opposite surface of the first resin layer 5a opposite to the wiring substrate 2 is bordered. Cut out toward the side of the end. In addition, when the cross-sectional area (the other end of the columnar conductor 4) is formed large so that the side surface of the other end of each columnar conductor 4 reaches the peripheral side surface of the first resin layer 5a, it is not always necessary to It is not necessary to provide the notch 5a1 in the resin layer 5a.
　（複合モジュール１の製造方法）
　次に、複合モジュール１の製造方法について、図３および図４を参照して説明する。なお、図３および図４それぞれは、複合モジュール１の製造方法を説明するための図であり、図３（ａ）～（ｅ）はその各工程を示し、図４（ａ）～（ｄ）は、図３（ｅ）に続く各工程を示す。 (Method for manufacturing composite module 1)
Next, a method for manufacturing the composite module 1 will be described with reference to FIGS. 3 and 4 are diagrams for explaining the method of manufacturing the composite module 1. FIGS. 3A to 3E show the respective steps, and FIGS. 4A to 4D are shown. These show each process following FIG.3 (e).
　この実施形態では複合モジュール１の製造方法に関し、複数個の複合モジュール１が集合してなる集合体を、各複合モジュール１の単位ごとに個片化して製造する場合を例として説明する。なお、以下に説明する製造方法と同じ要領で複合モジュール１を１つずつ製造することもできる。また、図３および図４では、複合モジュール１の集合体のうち、隣り合う２つの複合モジュール１のみを図示している。 In this embodiment, a method for manufacturing the composite module 1 will be described by taking as an example a case in which an assembly formed by a plurality of composite modules 1 is manufactured separately for each unit of the composite modules 1. In addition, the composite module 1 can also be manufactured one by one in the same manner as the manufacturing method described below. 3 and 4, only two adjacent composite modules 1 in the aggregate of composite modules 1 are illustrated.
　まず、図３（ａ）に示すように、低温同時焼成セラミックやガラスエポキシ樹脂などで形成された集合体基板７を用意する（準備工程）。このとき、集合体基板７の両主面には、各電子部品３ａ，３ｂおよび各柱状導体４を実装するためのランド電極６ａ，６ｂが形成されるとともに、その内部には各種配線電極やビア導体などが形成されている。 First, as shown in FIG. 3A, an assembly substrate 7 formed of a low-temperature co-fired ceramic or glass epoxy resin is prepared (preparation step). At this time, land electrodes 6a and 6b for mounting the respective electronic components 3a and 3b and the respective columnar conductors 4 are formed on both main surfaces of the assembly substrate 7, and various wiring electrodes and vias are formed therein. Conductors are formed.
　次に、図３（ｂ）に示すように、半田を用いて、集合体基板７の一方主面に設けられた所定のランド電極６ａ（各配線基板２の一方主面の周縁に設けられたランド電極６ａ）と各柱状導体４の一端とを接続することにより、各柱状導体４を集合体基板７の一方主面に実装する（柱状導体実装工程）。 Next, as shown in FIG. 3B, using solder, a predetermined land electrode 6a provided on one main surface of the assembly substrate 7 (provided on the periphery of one main surface of each wiring substrate 2). Each columnar conductor 4 is mounted on one main surface of the assembly substrate 7 by connecting the land electrode 6a) and one end of each columnar conductor 4 (columnar conductor mounting step).
　次に、図３（ｃ）に示すように、集合体基板７の一方主面に電子部品３ａを実装する（第１部品実装工程）。なお、各柱状導体４および電子部品３ａは、周知の表面実装技術を用いて実装することができる。また、各柱状導体４と電子部品３ａとの実装順は逆であってもかまわない。 Next, as shown in FIG. 3C, the electronic component 3a is mounted on one main surface of the assembly substrate 7 (first component mounting step). Each columnar conductor 4 and electronic component 3a can be mounted using a known surface mounting technique. Moreover, the mounting order of each columnar conductor 4 and the electronic component 3a may be reversed.
　次に、図３（ｄ）に示すように、集合体基板７の一方主面にエポキシ樹脂を、塗布または印刷するなどして、集合体基板７の一方主面、各柱状導体４および電子部品３ａを被覆してなる第１樹脂層５ａを集合体基板７の一方主面に積層する（第１樹脂層形成工程）。なお、第１樹脂層５ａは、塗布方式、印刷方式、コンプレッションモールド方式、トランスファモールド方式などを用いて形成することができる。 Next, as shown in FIG. 3 (d), an epoxy resin is applied or printed on one main surface of the assembly substrate 7, so that one main surface of each assembly substrate 7, each columnar conductor 4, and the electronic component A first resin layer 5a formed by covering 3a is laminated on one main surface of the aggregate substrate 7 (first resin layer forming step). The first resin layer 5a can be formed using a coating method, a printing method, a compression mold method, a transfer mold method, or the like.
　次に、図３（ｅ）に示すように、第１樹脂層５ａの表面（第１樹脂層５ａの配線基板２の一方主面との対向面の反対面に相当）を研磨または研削して、各柱状導体４それぞれの他端の端面を、第１樹脂層５ａから露出させる（研磨・研削工程）。なお、この研磨・研削工程において、各柱状導体４の表面を研磨・研削してもかまわない。 Next, as shown in FIG. 3E, the surface of the first resin layer 5a (corresponding to the opposite surface of the first resin layer 5a to the one main surface of the wiring board 2) is polished or ground. The other end face of each columnar conductor 4 is exposed from the first resin layer 5a (polishing / grinding step). In this polishing / grinding step, the surface of each columnar conductor 4 may be polished / ground.
　次に、図４（ａ）に示すように、第１部品実装工程と同じ要領で、集合体基板７の他方主面に電子部品３ｂを実装する（第２部品実装工程）。 Next, as shown in FIG. 4A, the electronic component 3b is mounted on the other main surface of the assembly board 7 in the same manner as the first component mounting step (second component mounting step).
　次に、図４（ｂ）に示すように、第１樹脂層形成工程と同じ要領で、集合体基板７の他方主面および各電子部品３ｂを被覆してなる第２樹脂層５ｂを、集合体基板７の他方主面に積層する（第２樹脂層形成工程）。 Next, as shown in FIG. 4B, in the same manner as the first resin layer forming step, the second resin layer 5b formed by covering the other main surface of the assembly substrate 7 and each electronic component 3b is assembled. It laminates on the other main surface of body substrate 7 (second resin layer forming step).
　次に、図４（ｃ）に示すように、各複合モジュール１の個片化ラインＬに沿って、ハーフカットを行う（第１ブレード工程）。このとき、ブレードを用いて、第２樹脂層５ｂ、集合体基板７、第１樹脂層５ａの順に削り、第１樹脂層５ａについては、各柱状導体４の一端部分の位置まで削る。 Next, as shown in FIG. 4C, half-cutting is performed along the singulation lines L of each composite module 1 (first blade process). At this time, using a blade, the second resin layer 5b, the aggregate substrate 7, and the first resin layer 5a are cut in this order, and the first resin layer 5a is cut to the position of one end portion of each columnar conductor 4.
　次に、図４（ｄ）に示すように、第１ブレード工程のブレードの侵入方向とは逆の第１樹脂層５ａ側からブレードを侵入させて、個片化ラインＬに沿って第１樹脂層５ａを削って、個片化された複合モジュール１を得る（第２ブレード工程）。このとき、ブレードは、各柱状導体４の他端の側面が露出するように、第１ブレード工程で用いたブレードよりも厚みが厚いものを使用する。この結果、第１樹脂層５ａの周側面には、各柱状導体４の他端の側面の一部を露出させる切欠部５ａ１が形成される。なお、各柱状導体４の一端の側面が露出しないように、ブレードで第１樹脂層５ａを削る深さは、各柱状導体４の他端部分までにとどめるのが好ましい。また、第１、第２ブレード工程の工程順序は逆であってもかまわない。 Next, as shown in FIG. 4 (d), the first resin is introduced along the singulation line L by letting the blade enter from the side of the first resin layer 5 a opposite to the direction in which the blade enters in the first blade process. The layer 5a is shaved to obtain the separated composite module 1 (second blade step). At this time, the blade is thicker than the blade used in the first blade step so that the side surface of the other end of each columnar conductor 4 is exposed. As a result, a cutout portion 5a1 that exposes a part of the side surface of the other end of each columnar conductor 4 is formed on the peripheral side surface of the first resin layer 5a. In addition, it is preferable that the depth at which the first resin layer 5 a is shaved with a blade is limited to the other end portion of each columnar conductor 4 so that the side surface of one end of each columnar conductor 4 is not exposed. The process order of the first and second blade processes may be reversed.
　また、各柱状導体４の他端の側面が第１樹脂層５ａの周側面に到達するように、当該他端のフランジ部分の横断面が大きく形成されている場合は、第２ブレード工程を設けずに、第１ブレード工程の段階で各複合モジュール１毎に個片化してもかまわない。 Further, when the transverse section of the flange portion at the other end is formed large so that the side surface at the other end of each columnar conductor 4 reaches the peripheral side surface of the first resin layer 5a, a second blade step is provided. Instead, it may be separated into individual composite modules 1 at the stage of the first blade process.
　したがって、上記した実施形態によれば、外部と接続される各柱状導体４それぞれにおいて、その他端の側面の一部が、各柱状導体４を被覆して積層された第１樹脂層５ａの周側面から露出しているため、例えば、複合モジュール１を半田により外部のマザー基板と接続した場合に、両者の接続部の接続状態を、マザー基板に実装した複合モジュール１の側面側から視認することができる。 Therefore, according to the above-described embodiment, in each columnar conductor 4 connected to the outside, the peripheral side surface of the first resin layer 5a in which a part of the side surface of the other end is laminated so as to cover each columnar conductor 4 For example, when the composite module 1 is connected to an external mother board by soldering, the connection state of both connecting portions can be visually recognized from the side surface side of the composite module 1 mounted on the mother board. it can.
　また、各柱状導体４それぞれは、その一端が第１樹脂層５ａに埋設された状態で被覆されているため、複合モジュール１を外部と接続したときの接続部の視認性を確保しつつ、配線基板２と各柱状導体４との接続部の耐応力特性を維持することができる。 In addition, each columnar conductor 4 is covered with one end embedded in the first resin layer 5a, so that the wiring of the composite module 1 can be ensured when the composite module 1 is connected to the outside. The stress resistance characteristics of the connection portion between the substrate 2 and each columnar conductor 4 can be maintained.
　また、各柱状導体４それぞれは、その他端の端面のみならず、側面の一部も第１樹脂層５ａから露出しているため、柱状導体４の他端の端面と、第１樹脂層５ａから露出した側面の一部とを外部との接続面として機能させることができる。したがって、柱状導体の他端の端面のみで外部と接続させる従来の複合モジュールと比較して、外部との接続面積が広くなり、外部との接続強度および接続信頼性が向上する。 In addition, since each columnar conductor 4 is exposed not only from the end surface at the other end, but also from the first resin layer 5a, a part of the side surface is exposed from the end surface at the other end of the columnar conductor 4 and the first resin layer 5a. A part of the exposed side surface can function as a connection surface with the outside. Therefore, compared with a conventional composite module that is connected to the outside only by the other end face of the columnar conductor, the connection area with the outside is widened, and the connection strength and connection reliability with the outside are improved.
　また、各柱状導体４それぞれを、他端が一端よりも横断面積を大きくし、他端にフランジ部を形成することで、柱状導体４の他端の側面を、第１樹脂層５ａの周側面に近づけることができるため、複合モジュール１と外部の接続部の視認性が向上する。また、他端の横断面積を一端よりも大きくすると、外部との接続面の面積が広くなるため、一端側のように配線基板２との接続部を第１樹脂層５ａで被覆して補強しなくても、外部との接続強度および接続信頼性を確保することができる。 Further, each columnar conductor 4 has a cross-sectional area larger than that of one end, and a flange portion is formed at the other end, so that the side surface of the other end of the columnar conductor 4 is a circumferential side surface of the first resin layer 5a. Therefore, the visibility of the composite module 1 and the external connection portion is improved. Further, if the cross-sectional area of the other end is made larger than that of one end, the area of the connection surface with the outside becomes larger. Therefore, the connection portion with the wiring board 2 is covered and reinforced with the first resin layer 5a like the one end side. Even without this, connection strength and connection reliability with the outside can be ensured.
　また、第１樹脂層５ａの周側面に切欠部５ａ１を形成することで、各柱状導体４の他端の側面を容易に第１樹脂層５ａの周側面から露出させることができる。 Further, by forming the notch 5a1 on the peripheral side surface of the first resin layer 5a, the side surface of the other end of each columnar conductor 4 can be easily exposed from the peripheral side surface of the first resin layer 5a.
　（柱状導体４の実装方法の変形例）
　次に、各柱状導体４の実装方法の変形例について、図５～図７を参照して説明する。なお、図５～図７それぞれは、各変形例を説明するための図である。 (Modification of mounting method of columnar conductor 4)
Next, a modified example of the mounting method of each columnar conductor 4 will be described with reference to FIGS. Each of FIGS. 5 to 7 is a diagram for explaining each modification.
　図５～図７に示す各変形例は、複数の柱状導体４をまとめて配線基板２の一方主面に実装する方法である。例えば、第１変形例では、図５（ａ）に示すように、集合体基板７の一方主面に形成された柱状導体４実装用のランド電極６ａ上に半田ペーストを塗布または印刷するとともに、各複合モジュール１毎に平板状の支持体８を用意し、該支持体８の一方主面の所定位置に各柱状導体４の他端を固定する。そして、各柱状導体４が固定された支持体８の他方主面をマウンターの吸着部などに吸着させ、この支持体８を集合体基板７（配線基板２）の所定位置に搭載することにより、各柱状導体４をまとめて集合体基板７（配線基板２）の一方主面に実装する。次に、図５（ｂ）に示すように、支持体８を各柱状導体４の他端から剥離して、図３（ｂ）に示す、各柱状導体４が実装された集合体基板７を得る。このようにすると、各柱状導体４の実装を容易に行うことができる。 Each of the modified examples shown in FIGS. 5 to 7 is a method of mounting a plurality of columnar conductors 4 together on one main surface of the wiring board 2. For example, in the first modification, as shown in FIG. 5A, a solder paste is applied or printed on the land electrode 6a for mounting the columnar conductor 4 formed on one main surface of the assembly substrate 7, A flat support 8 is prepared for each composite module 1, and the other end of each columnar conductor 4 is fixed to a predetermined position on one main surface of the support 8. Then, the other main surface of the support 8 to which each columnar conductor 4 is fixed is adsorbed to an adsorbing portion of the mounter, and the support 8 is mounted at a predetermined position on the assembly substrate 7 (wiring substrate 2). The columnar conductors 4 are collectively mounted on one main surface of the assembly board 7 (wiring board 2). Next, as shown in FIG. 5 (b), the support body 8 is peeled off from the other end of each columnar conductor 4, and the assembly substrate 7 on which each columnar conductor 4 is mounted as shown in FIG. 3 (b). obtain. If it does in this way, mounting of each columnar conductor 4 can be performed easily.
　第２変形例では、図６（ａ）に示すように、第１変形例と同じ要領で半田ペースト付きの集合体基板７を準備するとともに、各複合モジュール１毎に、各柱状導体４が配置された第１樹脂層５ａの一部を構成する枠状部材９を用意する。このとき、各柱状導体４の両端面が露出した状態にする。次に、図６（ｂ）に示すように、当該枠状部材９を集合体基板７（配線基板２）の一方主面の所定位置に搭載することで、各柱状導体４をまとめて集合体基板７（配線基板２）の一方主面に実装する。この枠状部材９は、例えば、ガラスエポキシ樹脂などで形成されている。また、枠状部材９への各柱状導体４の配置または形成については、例えば、枠状部材９の所定位置に、レーザー加工などで各柱状導体４の形状に合わせた貫通孔を形成し、当該貫通孔に各柱状導体４を嵌めこんで配置する。その他の例としては、前記貫通孔にＣｕペーストなどを充填したり、めっき処理により各柱状導体４を形成してもよい。 In the second modification, as shown in FIG. 6A, an assembly substrate 7 with solder paste is prepared in the same manner as in the first modification, and each columnar conductor 4 is arranged for each composite module 1. A frame-shaped member 9 that constitutes a part of the first resin layer 5a is prepared. At this time, the both end surfaces of each columnar conductor 4 are exposed. Next, as shown in FIG. 6B, the columnar members 4 are assembled together by mounting the frame-shaped member 9 at a predetermined position on one main surface of the assembly substrate 7 (wiring substrate 2). It is mounted on one main surface of the substrate 7 (wiring substrate 2). The frame-like member 9 is made of, for example, glass epoxy resin. As for the arrangement or formation of each columnar conductor 4 on the frame-shaped member 9, for example, a through-hole adapted to the shape of each columnar conductor 4 is formed at a predetermined position of the frame-shaped member 9 by laser processing or the like. The columnar conductors 4 are fitted into the through holes. As other examples, the columnar conductors 4 may be formed by filling the through holes with Cu paste or the like, or by plating.
　なお、各柱状導体４が配置された枠状部材９を用意する際、第１樹脂層５ａの切欠部５ａ１に相当する切欠を、枠状部材９に予め形成する構成であってもかまわない。この場合、例えば、各柱状導体４の他端の側面が枠状部材９の外側の周側面から露出するように、ブレードにより切欠を形成する。そして、枠状部材９の搭載、電子部品３ａの実装後、枠状部材９による囲繞領域にエポキシ樹脂を充填して、枠状部材９と当該囲繞領域内のエポキシ樹脂とからなる第１樹脂層５ａを形成する。なお、この場合、エポキシ樹脂が枠状部材９と集合体基板７との隙間から漏れ出さないように、当該隙間に、各柱状導体４の一端と集合体基板７との接続部を補強する補強樹脂を設けるのが好ましい。このようにすると、各柱状導体４の他端の端面を露出させる研磨・研削工程を削減することができる。 In addition, when preparing the frame-shaped member 9 in which each columnar conductor 4 is arranged, the frame-shaped member 9 may have a configuration in which a cutout corresponding to the cutout portion 5a1 of the first resin layer 5a is formed in advance. In this case, for example, the notch is formed by the blade so that the side surface of the other end of each columnar conductor 4 is exposed from the outer peripheral side surface of the frame-shaped member 9. Then, after mounting the frame-shaped member 9 and mounting the electronic component 3a, the first resin layer composed of the frame-shaped member 9 and the epoxy resin in the surrounding region is filled with an epoxy resin in the surrounding region by the frame-shaped member 9. 5a is formed. In this case, in order to prevent the epoxy resin from leaking out from the gap between the frame-shaped member 9 and the aggregate substrate 7, reinforcement that reinforces the connection portion between one end of each columnar conductor 4 and the aggregate substrate 7 in the gap. It is preferable to provide a resin. If it does in this way, the grinding | polishing and grinding process which exposes the end surface of the other end of each columnar conductor 4 can be reduced.
　第３変形例では、図７（ａ）に示すように、第１変形例と同じ要領で半田ペースト付きの集合体基板７を用意するとともに、隣り合う複合モジュール１間で、隣接する柱状導体４を集合配置して一体化した棒状部材１０を用意する。具体的には、各複合モジュール１それぞれにおいて、図２に示す配線基板２の周縁に配置された各柱状導体４を、配線基板２の長辺に沿って配置される２つの長辺ブロックと短辺に沿って配置される２つの短辺ブロックの、合計４つのブロックに分割し、各ブロック毎に、隣接する複合モジュール１の隣り合う長辺ブロック同士、または、短辺ブロック同士を集合配置して一体化した棒状部材１０を用意する。この棒状部材１０は、第２変形例の枠状部材９と同様に、例えば、ガラスエポキシ樹脂などで形成され、第１樹脂層５ａの一部を構成する。また、棒状部材１０への各柱状導体４の配置・形成方法は、第２変形例と同じである。 In the third modification, as shown in FIG. 7A, an assembly substrate 7 with a solder paste is prepared in the same manner as in the first modification, and adjacent columnar conductors 4 between adjacent composite modules 1 are prepared. A rod-shaped member 10 is prepared by integrating and integrating the members. Specifically, in each composite module 1, each columnar conductor 4 arranged on the periphery of the wiring board 2 shown in FIG. 2 is replaced with two long side blocks arranged along the long side of the wiring board 2 and a short side. Dividing into a total of four blocks of two short side blocks arranged along the side, adjacent long side blocks of the adjacent composite module 1 or short side blocks are collectively arranged for each block. The rod-shaped member 10 integrated is prepared. This rod-shaped member 10 is formed of, for example, a glass epoxy resin or the like, like the frame-shaped member 9 of the second modification, and constitutes a part of the first resin layer 5a. Further, the arrangement / formation method of each columnar conductor 4 on the rod-shaped member 10 is the same as that of the second modification.
　なお、この場合、各棒状部材１０には、図７（ａ）および（ｂ）に示すように、各柱状導体４を分離して配置または形成してもよいし、図７（ｃ）に示すように、隣接する複合モジュール１の間で柱状導体４の他端どうしを繋げて配置または形成してもかまわない。棒状部材１０を図７（ｃ）に示す構成にすると、ブレードの厚みが第２ブレード工程よりも薄いものが用いられる第１ブレード工程の段階でフルカットし、各複合モジュール１毎に個片化した場合であっても、各柱状導体４の他端の側面の一部を第１樹脂層５ａの周側面から露出させることができるため、第２ブレード工程を削減することができる。 In this case, as shown in FIGS. 7A and 7B, the columnar conductors 4 may be separately arranged or formed on each rod-shaped member 10, or as shown in FIG. 7C. As described above, the other ends of the columnar conductors 4 may be connected or formed between adjacent composite modules 1. When the rod-like member 10 is configured as shown in FIG. 7C, full cutting is performed at the stage of the first blade process where the blade thickness is thinner than that of the second blade process, and individual composite modules 1 are separated into individual pieces. Even in this case, the second blade process can be reduced because a part of the side surface of the other end of each columnar conductor 4 can be exposed from the peripheral side surface of the first resin layer 5a.
　（柱状導体４の形成方法の変形例）
　次に、各柱状導体４の形成方法の変形例について、図８を参照して説明する。なお、図８は、本例にかかる柱状導体４の形成方法を説明するための図であり、（ａ）～（ｆ）はその各工程を示す。 (Modification of the method of forming the columnar conductor 4)
Next, a modification of the method of forming each columnar conductor 4 will be described with reference to FIG. FIG. 8 is a diagram for explaining a method of forming the columnar conductor 4 according to this example, and (a) to (f) show the respective steps.
　本例は、各柱状導体４をめっき処理により形成する方法であり、簡単に説明すると、まず、図８（ａ）に示すように、その両主面に各電子部品３ａ，３ｂの実装用および各柱状導体４の形成用のランド電極６ａ，６ｂが形成された集合体基板７を用意する。 This example is a method of forming each columnar conductor 4 by a plating process. Briefly described, first, as shown in FIG. 8 (a), both main parts are mounted for mounting electronic components 3a and 3b and An assembly substrate 7 on which land electrodes 6a and 6b for forming each columnar conductor 4 are formed is prepared.
　次に、図８（ｂ）に示すように、集合体基板７の一方主面に第１レジスト１１を形成する。このとき、第１レジスト１１には、各柱状導体４形成用のランド電極６ａが露出するように開口部１１ａを形成する。また、その厚みは、各柱状導体４の一端部を形成する厚みとする。 Next, as shown in FIG. 8B, a first resist 11 is formed on one main surface of the aggregate substrate 7. At this time, the opening 11a is formed in the first resist 11 so that the land electrode 6a for forming each columnar conductor 4 is exposed. The thickness is a thickness that forms one end of each columnar conductor 4.
　次に、図８（ｃ）に示すように、めっき処理により各開口部１１ａにＣｕを充填して、それぞれ柱状導体４の形成用のランド電極６ａに接続された各柱状導体４の一端部を形成する。 Next, as shown in FIG. 8 (c), each opening 11a is filled with Cu by plating, and one end of each columnar conductor 4 connected to each land electrode 6a for forming the columnar conductor 4 is formed. Form.
　次に、図８（ｄ）に示すように、第１レジスト１１を形成する樹脂と同じ材料を使用して、第１レジスト１１上（紙面下側）に第２レジスト１２を形成する。このとき、第２レジスト１２に、各柱状導体４の一端部の端面（ランド電極６ａとの接続面の反対面）が露出するように開口部１２ａを形成する。この開口部１２ａは、柱状導体４の他端の端面の横断面積が一端よりも大きくなるように、その開口面積を一端側の開口部１１ａよりも広く形成する。 Next, as shown in FIG. 8D, the second resist 12 is formed on the first resist 11 (the lower side in the drawing) using the same material as the resin that forms the first resist 11. At this time, the opening 12a is formed in the second resist 12 so that the end surface of one end of each columnar conductor 4 (the surface opposite to the connection surface with the land electrode 6a) is exposed. The opening 12a is formed so that the opening area is wider than the opening 11a on one end side so that the cross-sectional area of the end face of the other end of the columnar conductor 4 is larger than that of one end.
　次に、図８（ｅ）に示すように、めっき処理により各開口部１２ａにＣｕを充填して、その横断面積が一端部よりも大きい柱状導体４の他端部を形成する。 Next, as shown in FIG. 8E, each opening 12a is filled with Cu by a plating process to form the other end of the columnar conductor 4 whose cross-sectional area is larger than that of one end.
　最後に、図８（ｆ）に示すように、第１、第２レジスト１１，１２を除去して、本実施形態の各柱状導体４を得る。 Finally, as shown in FIG. 8F, the first and second resists 11 and 12 are removed to obtain the respective columnar conductors 4 of the present embodiment.
　＜第２実施形態＞
　本発明の第２実施形態にかかる複合モジュール１ａについて、図９および図１０を参照して説明する。なお、図９は複合モジュール１ａの断面図、図１０は複合モジュール１ａの底面図である。また、図１０では、各柱状導体４ａの一端の横断面を破線で示している。 Second Embodiment
A composite module 1a according to a second embodiment of the present invention will be described with reference to FIGS. 9 is a cross-sectional view of the composite module 1a, and FIG. 10 is a bottom view of the composite module 1a. Moreover, in FIG. 10, the cross section of the end of each columnar conductor 4a is shown with the broken line.
　この実施形態にかかる複合モジュール１ａが図１および図２を参照して説明した第１実施形態の複合モジュール１と異なるところは、図９および図１０に示すように、各柱状導体４ａの形状が異なることである。その他の構成は、第１実施形態の複合モジュール１と同じであるため、同一符号を付すことにより説明を省略する。 The composite module 1a according to this embodiment differs from the composite module 1 of the first embodiment described with reference to FIGS. 1 and 2 in that the shape of each columnar conductor 4a is as shown in FIGS. Is different. Since other configurations are the same as those of the composite module 1 of the first embodiment, the description thereof is omitted by attaching the same reference numerals.
　この場合、図９および図１０に示すように、第１実施形態の複合モジュール１と異なり、第１樹脂層５ａの周側面には切欠部５ａ１が形成されておらず、第１樹脂層５ａの周側面から露出するように、各柱状導体４ａの他端に当該周側面方向に向かう突出部４ａ１が形成される。具体的には、この突出部４ａ１は、周側面に向かう方向と垂直な方向の幅Ｗが、一端側の横断面の直径とほぼ同じ大きさで形成され、第１樹脂層５ａの周側面まで延出して形成される。 In this case, as shown in FIGS. 9 and 10, unlike the composite module 1 of the first embodiment, the cutout portion 5a1 is not formed on the peripheral side surface of the first resin layer 5a, and the first resin layer 5a A protrusion 4a1 is formed at the other end of each columnar conductor 4a so as to be exposed from the peripheral side surface. Specifically, the protrusion 4a1 is formed so that the width W in the direction perpendicular to the direction toward the peripheral side surface is substantially the same as the diameter of the cross section on the one end side, up to the peripheral side surface of the first resin layer 5a. It is formed to extend.
　なお、この実施形態にかかる複合モジュール１は、図３から図８を参照して説明した第１実施形態の複合モジュール１の製造方法、柱状導体４の実装方法の変形例、柱状導体の形成方法の変形例と同じ要領で製造することができる。ただし、各柱状導体４ａの他端の突出部４ａ１を第１樹脂層５ａの周側面に到達するように延出して形成するため、第１実施形態の複合モジュール１の製造方法で設けた第２ブレード工程が不要となり、第１ブレード工程の段階でフルカットして各複合モジュール１ａに個片化する。 The composite module 1 according to this embodiment includes a method for manufacturing the composite module 1 according to the first embodiment described with reference to FIGS. 3 to 8, a modification of the method for mounting the columnar conductor 4, and a method for forming the columnar conductor. It can be manufactured in the same manner as the modified example. However, since the protrusion 4a1 at the other end of each columnar conductor 4a is formed to extend so as to reach the peripheral side surface of the first resin layer 5a, the second provided by the method for manufacturing the composite module 1 of the first embodiment. The blade process becomes unnecessary, and the full cutting is performed at the stage of the first blade process to separate each composite module 1a.
　このように構成することでも、各柱状導体４ａの他端の側面を、第１樹脂層５ａの周側面から露出させることができるため、複合モジュール１ａを外部のマザー基板などに半田を用いて実装した際、両者の接続部の接続状態を複合モジュール１ａの側面側から視認することができる。また、第１実施形態の複合モジュール１と同様、各柱状導体４ａの他端の端面のみならず、第１樹脂層５ａから露出した側面の一部も外部との接続面として機能させることができるため、外部との接続強度および接続信頼性の向上を図ることができる。 Even with this configuration, the side surface of the other end of each columnar conductor 4a can be exposed from the peripheral side surface of the first resin layer 5a, so that the composite module 1a is mounted on an external mother board using solder. When it does, the connection state of both connection parts can be visually recognized from the side surface side of the composite module 1a. Further, similarly to the composite module 1 of the first embodiment, not only the end surface of the other end of each columnar conductor 4a but also a part of the side surface exposed from the first resin layer 5a can function as a connection surface with the outside. Therefore, it is possible to improve the connection strength and connection reliability with the outside.
　また、各柱状導体４ａの他端の突出部４ａ１は、その幅Ｗが、一端側の横断面の直径とほぼ同じ大きさで第１樹脂層５ａの周側面まで延出して形成されるため、第１実施形態の複合モジュール１と比較して、各柱状導体４ａの狭ピッチ化を図ることができる。 Further, the protrusion 4a1 at the other end of each columnar conductor 4a is formed so as to extend to the peripheral side surface of the first resin layer 5a with a width W that is substantially the same as the diameter of the cross section on the one end side. Compared with the composite module 1 of the first embodiment, the pitch of each columnar conductor 4a can be reduced.
　＜第３実施形態＞
　本発明の第３実施形態にかかる複合モジュール１ｂについて、図１１を参照して説明する。なお、図１１は複合モジュール１ｂの断面図である。 <Third Embodiment>
A composite module 1b according to a third embodiment of the present invention will be described with reference to FIG. FIG. 11 is a cross-sectional view of the composite module 1b.
　この実施形態にかかる複合モジュール１ｂが、図１および図２を参照して説明した第１実施形態の複合モジュール１と異なるところは、図１１に示すように、各柱状導体４ｂの形状が異なることである。その他の構成は第１実施形態と同じであるため、同一符号を付すことにより説明を省略する。 The composite module 1b according to this embodiment differs from the composite module 1 of the first embodiment described with reference to FIGS. 1 and 2 in that the shape of each columnar conductor 4b is different as shown in FIG. It is. Since the other configuration is the same as that of the first embodiment, description thereof is omitted by attaching the same reference numerals.
　この場合、各柱状導体４ｂそれぞれが、両端の横断面積が等しい円柱状に形成され、第１樹脂層５ａの周側面に形成された切欠部５ａ１により、他端の側面の一部が、第１樹脂層５ａの周側面から露出している。なお、各柱状導体４ｂは、上記した円柱状に限らず、例えば、他端側から一端側に向けて先細りしたテーパ状に形成されていてもよい。このようにすると、外部との接続面となる各柱状導体４ｂの他端の端面の面積を一端側と比較して広くすることができる。 In this case, each of the columnar conductors 4b is formed in a columnar shape having the same cross-sectional area at both ends, and a part of the side surface at the other end is formed by the notch 5a1 formed on the peripheral side surface of the first resin layer 5a. It is exposed from the peripheral side surface of the resin layer 5a. Each columnar conductor 4b is not limited to the columnar shape described above, and may be formed in a tapered shape that tapers from the other end side toward the one end side, for example. If it does in this way, the area of the end surface of the other end of each columnar conductor 4b used as a connection surface with the exterior can be enlarged compared with one end side.
　この実施形態にかかる複合モジュール１ｂも、第１実施形態の複合モジュールの製造方法、各柱状導体４の実装方法の変形例、各柱状導体４の形成方法と同じ要領で製造することができる。この場合、第２ブレード工程で用いるブレードの厚みを各柱状導体４ｂの他端の側面の一部が露出するように調整する。また、第２ブレード工程で、各柱状導体４ｂの他端の側面を若干削って、各柱状導体４ｂの他端の側面の一部を確実に第１樹脂層５ａの周側面から露出させるようにしてもよい。このように構成することで、第１実施形態の複合モジュール１と同様の効果が得られる。 The composite module 1b according to this embodiment can also be manufactured in the same manner as the composite module manufacturing method of the first embodiment, a variation of the mounting method of each columnar conductor 4, and the method of forming each columnar conductor 4. In this case, the thickness of the blade used in the second blade step is adjusted so that a part of the side surface at the other end of each columnar conductor 4b is exposed. Also, in the second blade step, the side surface of the other end of each columnar conductor 4b is slightly shaved to ensure that a part of the other side surface of each columnar conductor 4b is exposed from the peripheral side surface of the first resin layer 5a. May be. By comprising in this way, the effect similar to the composite module 1 of 1st Embodiment is acquired.
　なお、本発明は上記した各実施形態に限定されるものではなく、その趣旨を逸脱しない限りにおいて、上記したもの以外に種々の変更を行なうことが可能であり、例えば、上記した各実施形態では、各柱状導体４，４ａ，４ｂの他端の端面および側面の一部が第１樹脂層５ａから露出している場合について説明したが、各柱状導体４，４ａ，４ｂの側面の一部が第１樹脂層５ａの周側面から露出していればよく、必ずしも他端の端面を第１樹脂層５ａから露出させなくてもよい。この場合、第１樹脂層５ａの周側面から露出した各柱状導体４，４ａ，４ｂの他端の側面の一部を利用して外部と接続する。このようにしても、複合モジュール１，１ａ，１ｂと外部との接続部の接続状態を、複合モジュール１，１ａ，１ｂの側面側から視認することができる。 The present invention is not limited to the above-described embodiments, and various modifications other than those described above can be made without departing from the spirit thereof. For example, in the above-described embodiments, In the above description, the other end face and part of the side surface of each columnar conductor 4, 4a, 4b are exposed from the first resin layer 5a. However, part of the side surface of each columnar conductor 4, 4a, 4b It is only necessary to be exposed from the peripheral side surface of the first resin layer 5a, and the end surface at the other end is not necessarily exposed from the first resin layer 5a. In this case, it connects with the exterior using a part of side surface of the other end of each columnar conductor 4,4a, 4b exposed from the surrounding side surface of the 1st resin layer 5a. Even in this way, the connection state of the connection portion between the composite module 1, 1a, 1b and the outside can be visually recognized from the side surface side of the composite module 1, 1a, 1b.
　また、上記した各実施形態では、各柱状導体４，４ａ，４ｂをＣｕで形成した場合について説明したが、Ｃｕの代わりにＡｇ、Ａｌ、Ａｕなどの他の金属を用いて各柱状導体４，４ａ，４ｂを形成してもよい。 In each of the above-described embodiments, the case where each columnar conductor 4, 4a, 4b is formed of Cu has been described. However, instead of Cu, each columnar conductor 4, 4A is made of other metal such as Ag, Al, Au. 4a and 4b may be formed.
　また、本発明は、柱状導体を用いて外部と接続させる種々の複合モジュールに適用することができる。 Also, the present invention can be applied to various composite modules that are connected to the outside using columnar conductors.
　１，１ａ，１ｂ　　複合モジュール
　２　　　　　　　　配線基板
　３ａ，３ｂ　　　　電子部品
　４，４ａ，４ｂ　　柱状導体
　４ａ１　　　　　　突出部
　５ａ　　　　　　　第１樹脂層（樹脂層）
　５ａ１　　　　　　切欠部
  1, 1a, 1b Composite module 2 Wiring board 3a, 3b Electronic component 4, 4a, 4b Columnar conductor 4a1 Projection 5a First resin layer (resin layer)
5a1 Notch

Claims (5)

  1. 　電子部品が実装される配線基板と、
    　前記配線基板の一方主面にその一端が接続された状態で配置される外部接続用の柱状導体と、
    　前記配線基板の一方主面および前記柱状導体を被覆して前記配線基板に積層された樹脂層とを備え、
    　前記柱状導体の他端の側面の一部が、前記樹脂層の周側面から露出している
    　ことを特徴とする複合モジュール。     A wiring board on which electronic components are mounted;
    A columnar conductor for external connection arranged in a state where one end thereof is connected to one main surface of the wiring board;
    A resin layer that covers the one main surface of the wiring board and the columnar conductor and is laminated on the wiring board;
    Part of the side surface of the other end of the columnar conductor is exposed from the peripheral side surface of the resin layer.
  2. 　前記柱状導体の他端の端面が、前記樹脂層の前記配線基板との対向面の反対面から露出していることを特徴とする請求項１に記載の複合モジュール。 2. The composite module according to claim 1, wherein an end surface of the other end of the columnar conductor is exposed from a surface opposite to a surface of the resin layer facing the wiring board.
  3. 　前記柱状導体の他端は、前記一端よりも横断面積が大きく形成されていることを特徴とする請求項１または２に記載の複合モジュール。 3. The composite module according to claim 1, wherein the other end of the columnar conductor has a larger cross-sectional area than the one end.
  4. 　前記柱状導体の他端には、前記樹脂層の周側面から露出するように、当該周側面方向に向かう突出部が形成されていることを特徴とする請求項１または２に記載の複合モジュール。 3. The composite module according to claim 1, wherein a projecting portion directed toward the peripheral side surface is formed at the other end of the columnar conductor so as to be exposed from the peripheral side surface of the resin layer.
  5. 　前記柱状導体の前記他端の側面の一部が露出するように、前記樹脂層の周側面に切欠部が形成されていることを特徴とする請求項１ないし４のいずれかに記載の複合モジュール。 5. The composite module according to claim 1, wherein a notch portion is formed on a peripheral side surface of the resin layer so that a part of the side surface of the other end of the columnar conductor is exposed. .
PCT/JP2014/073144 2013-09-17 2014-09-03 Composite module WO2015041050A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-191573 2013-09-17
JP2013191573 2013-09-17

Publications (1)

Publication Number Publication Date
WO2015041050A1 true WO2015041050A1 (en) 2015-03-26

Family

ID=52688704

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2014/073144 WO2015041050A1 (en) 2013-09-17 2014-09-03 Composite module

Country Status (1)

Country Link
WO (1) WO2015041050A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111788674A (en) * 2018-03-20 2020-10-16 株式会社村田制作所 High frequency module

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11150090A (en) * 1991-08-23 1999-06-02 Sony Corp Manufacture of semiconductor device
WO2013035715A1 (en) * 2011-09-07 2013-03-14 株式会社村田製作所 Module manufacturing method and module

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11150090A (en) * 1991-08-23 1999-06-02 Sony Corp Manufacture of semiconductor device
WO2013035715A1 (en) * 2011-09-07 2013-03-14 株式会社村田製作所 Module manufacturing method and module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111788674A (en) * 2018-03-20 2020-10-16 株式会社村田制作所 High frequency module
CN111788674B (en) * 2018-03-20 2024-03-15 株式会社村田制作所 High frequency module

Similar Documents

Publication Publication Date Title
JP5790682B2 (en) Module and manufacturing method thereof
US10535581B2 (en) Module for heat generating electronic component
KR101288284B1 (en) Semiconductor package manufacturing method
JP4367414B2 (en) Component built-in module and manufacturing method thereof
WO2012023332A1 (en) Electronic part and method of manufacturing same
KR101665992B1 (en) Module and method of manufacturing the same
US20130271928A1 (en) Circuit module and method of manufacturing the same
US9832871B2 (en) Module
JP5861260B2 (en) Semiconductor device manufacturing method and semiconductor device
JP2018046297A (en) Circuit board
KR20150032493A (en) Semiconductor device and method of manufacturing the same
JP5831057B2 (en) Module manufacturing method
KR100611291B1 (en) Circuit device, circuit module, and manufacturing method of the circuit device
EP3030060B1 (en) Wiring base plate and electronic device
JPWO2018168709A1 (en) Circuit module and manufacturing method thereof
WO2015041050A1 (en) Composite module
JP2019021863A (en) Multilayer substrate
JP2006339277A (en) Substrate for connection and manufacturing method thereof
WO2017077837A1 (en) Component-mounted substrate
CN210129511U (en) High frequency module
JP2012209590A (en) Electronic component mounting multilayer wiring board and manufacturing method of the same
KR20170124769A (en) Electric component module and manufacturing method threrof
JP5257518B2 (en) Substrate manufacturing method and resin substrate
JP4353131B2 (en) Electronic equipment
WO2017141597A1 (en) Wireless communications device, production method therefor, and resin molded body

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14846479

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 14846479

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP