WO2015034770A1

WO2015034770A1 - Segmented insole for support of embedded systems

Info

Publication number: WO2015034770A1
Application number: PCT/US2014/053389
Authority: WO
Inventors: Hahna Ruth ALEXANDER; Devit Frengul DAVITIAN; Elliot Isaac KAHN; Matthew James STANTON
Original assignee: Solepower Llc
Priority date: 2013-09-04
Filing date: 2014-08-29
Publication date: 2015-03-12
Also published as: US20150059204A1

Abstract

A two part insole having one part for housing smart systems embedded within an insole, and a second part for maintaining comfort of a cut-to-fit insole to increase the functionality of the overall product for the user.

Description

SEGMENTED INSOLE FOR SUPPORT OF EMBEDDED SYSTEMS

Related Applications

[0001] This application claims the benefit of U.S. Provisional Application Serial No.

61/873,421, filed September 4, 2013.

Background of the Invention

[0002] Smart footwear is defined as footwear having embedded mechanical and electrical systems for performing various functions. Embedded systems may be located anywhere on the shoe, but it is desirable, both for function and aesthetic reasons, that the embedded system be hidden in the insole of the shoe. Typical examples of such systems include energy harvesting devices, footwear-embedded GPS devices and step-logging (pressure sensing) devices. Devices hidden in the insole of the shoe require support material for the embedded device to prevent damage from impacts from the user's foot and from moisture that may be present within the shoe.

[0003] Off-the-shelf after-market insoles are frequently made to be cut-to-fit. A range of sizes will be marked on the insole so that the user can cut the toe end of the insole to personalize the size. However, optimal fitting depends on user precision, and the insole can easily be ruined by user error, rendering the entire system unusable. For an insole without an embedded system, two insoles are typically offered for purchase in one package, or the user can buy another insole for a relatively low cost if the insole is ruined by user error. [0004] Insoles for smart footwear, however, have a much higher expected cost and cannot be repurchased as easily. Other problems related to embedded systems within insoles include added wear on those systems from machine washing, replacement of the soft (comfort-related) materials from wear, and the high cost of customization due to aesthetic desires like color. Therefore, it is desirable to provide an insole design that addresses these deficiencies, while supporting a wide variety of embedded systems.

Summary of the Invention

[0005] A novel two part insole is presented for use with any mechanical mechanism or electronic device located in the heel of an insole. The two part insole construction is designed for both stability and support of the embedded system present in smart footwear, as well as for comfort of the user, while still addressing the cut-to-fit and reusability constraints desirable for insoles.

[0006] The insole is provided as a two-part construction having a bottom layer and a top layer. The bottom layer is a more rigid construction and provides stability and encasing for engineered systems. The top comfort layer is detachable from the bottom layer, is customizable by material, color, and size, and consists of a softer, more flexible material for the comfort of the user. The insole layers may be attached to each other using grooves, adhesives, or detachable materials like Velcro. The toe end of the top layer of the insole may be provided with a cut-to-fit pattern for user fitting, or maybe provided pre-sized from the factory. Brief Description of the Drawings

[0007] Figure 1 shows an exploded view of the segmented insole of the present invention. Detailed Description of the Invention

[0008] Smart footwear having engineered devices embedded in the insole are best served by a two part insole where the cheaper, top comfort layer 1 of the insole can be customizable and removable, while the lower, more rigid layer 2 supports the embedded device. The present invention is a two part insole for this purpose. The system includes an upper insole layer 1 for comfort, having cut-to-fit lines on the toe end thereof for customizability, and a lower insole layer 2 for support, having a cavity 5 of variable shape for embedding mechanical and electrical systems. An attachment method between the lower support 2 and upper comfort insole layer 1 is provided. The insole may also feature treads on the base of the insole for inducing friction between the insole and the base of the shoe.

[0009] The smart footwear insole of the present invention is shown in Figure 1. Top,

comfort layer 1 is thin at the heel-end, becomes thicker under the arch at the arch point, and tapers to be thinner by the toe end. A notch 4 at the arch point is shaped to mate with bottom support layer 2. Cut-to-fit lines 3 are marked on comfort layer 1, such that the user can cut comfort layer 1 to their personal foot/shoe size along one of cut-to-fit lines 3.

[00010] Comfort layer 1 is preferably made of a soft, shock-absorbing material, such as gels, fabrics, foams, recycled material, or plastic materials common to comfort-based, standard orthotics. Support layer 2 provides stability for the user's foot, as well as support for the embedded device. It is preferably constructed of a structural material, such as hard plastics, composites, metals, foams, recycled material or any other structural material suitable for the base of an insole, and provides a step-down surface to protect any mechanical or electrical systems embedded within embedded systems cavity 5. Embedded systems cavity 5 may be of any shape depending on the design of the particular embedded system, and may include channels for antenna, wires or other parts which are required to be positioned external to the insole (not shown). In a second embodiment of the invention, support layer 2 may comprise a two-part construction defining a cavity on the interior thereof such that the embedded system is completely encased by the rigid material of support layer 2. In such cases, the two parts of support layer 2 may be attached to each other using methods similar to those used to attach the whole support layer 2 to comfort layer 1. In other embodiments, the embedded systems may be manufactured already permanently or non-permanently encased in support layer 2, ready to be joined with comfort layer 1.

The length of support layer 2 will preferably not exceed the length from the heel to arch point 4. Comfort layer 1 may be attached to the top side of support layer 2 using grooves, pegs, friction-inducing fixtures, adhesives or other fixtures in the materials. In the embodiment shown, two pads 6 are shown to represent a hook and loop attachment method, such as Velcro^®. The strips are orthogonal to the user's foot, but other embodiments could be in any arrangement on the outward faces of support layer 2 and comfort layer 1. In another embodiment, comfort layer 1 would be thicker at the heel end with a separate pocket for support layer 2. Support layer 2 would then fit into a fabric pocket to be fastened to comfort layer 1 (not shown). In this embodiment, the fabric pocket would replace the strips of attachment material 6 seen in the embodiment of Figure 1. In yet another embodiment, comfort layer 1 may define a cavity in the heal portion thereof into which support layer 2 may be inserted (not shown).

Claims

We claim:

1. A segmented insole comprising:

a bottom, support layer; and

a top, comfort layer, said top layer defining one or more surfaces designed to mate with said bottom layer;

wherein said bottom layer is composed of a semi-rigid structural material and defines a cavity therein for holding an embedded device; and further

wherein said top layer covers said bottom layer.

2. The segmented insole of claim 1 further comprising one or more attachment points wherein said bottom layer and said top layer are attached to each other.

3. The segmented insole of claim 1 further comprising an attachment method for attaching said bottom layer to said top layer at said one or more attachment points.

4. The segmented insole claim 3 wherein said attachment method comprises an attachable and detachable material.

5. The segmented insole of claim 3 wherein said attachment method comprises an adhesive.

6. The segmented insole of claim 3 wherein said attachment method comprises friction-inducing fixtures, grooves, or pegs.

7. The segmented insole of claim 1 wherein said top layer has cut-to-fit sizing lines.

8. The segmented insole of claim 1 wherein said bottom layer and the portion of said top layer not covering said bottom layer each define a bottom surface, said bottom surface defining treads for engaging the base of a shoe into which said insole is disposed.

9. The segmented insole of claim 1 wherein said top layer is composed of a shock-absorbing material.

10. The segmented insole of claim 9 wherein said top layer is composed of a material which is softer than said bottom layer.

11. The segmented insole of claim 9 wherein said shock-absorbing material is selected from a group consisting of gels, fabrics, foams, recycled materials and soft plastic materials.

12. The segmented insole of claim 1 wherein semi-rigid structural material is selected from a group consisting of hard plastics, composites, metals, foams and recycled materials.

13. The segmented insole of claim 3 wherein said attachment method consists of a cavity defined in said top layer for accepting insertion of said bottom layer therein.

14. The segmented in sole of claim 13 wherein said cavity is composed of the same material as said top layer.

15. The segmented insole of claim 13 wherein said cavity is composed of a fabric attached to said top layer.

16. The segmented insole of claim 1 wherein said bottom layer defines one or more grooves or channels therein to allow for exposure of portions of said embedded device external to said insole.

17. The segmented insole of claim 16 wherein said bottom layer comprises two parts which, when joined, encase said embedded system inside of said bottom layer.

18. The segmented insole of claim 17 wherein said bottom layer permanently encases said embedded system.