WO2014199886A1 - Communication apparatus and electronic device - Google Patents

Communication apparatus and electronic device Download PDF

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Publication number
WO2014199886A1
WO2014199886A1 PCT/JP2014/064909 JP2014064909W WO2014199886A1 WO 2014199886 A1 WO2014199886 A1 WO 2014199886A1 JP 2014064909 W JP2014064909 W JP 2014064909W WO 2014199886 A1 WO2014199886 A1 WO 2014199886A1
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WO
WIPO (PCT)
Prior art keywords
communication device
antenna
conductor pattern
insulating layers
laminate
Prior art date
Application number
PCT/JP2014/064909
Other languages
French (fr)
Japanese (ja)
Inventor
用水邦明
Original Assignee
株式会社村田製作所
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Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2014199886A1 publication Critical patent/WO2014199886A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H01Q7/06—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07792—Antenna details the antenna adapted for extending in three dimensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
    • H04B5/20—Near-field transmission systems, e.g. inductive or capacitive transmission systems characterised by the transmission technique; characterised by the transmission medium
    • H04B5/24—Inductive coupling
    • H04B5/26—Inductive coupling using coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
    • H04B5/70—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes
    • H04B5/72—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes for local intradevice communication
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/097—Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards

Definitions

  • the present invention relates to a communication apparatus and an electronic device used in, for example, an RFID (Radio Frequency Identification) system and a near field communication (NFC) system.
  • RFID Radio Frequency Identification
  • NFC near field communication
  • Patent Document 1 discloses a communication terminal device in which a communication function is modularized.
  • the communication terminal device of Patent Document 1 is such that an antenna element and a chip component are mounted on a flexible substrate, and the flexible substrate is housed in a casing.
  • the communication terminal device of Patent Document 1 has a structure in which an antenna element is mounted on a flexible substrate together with a chip component, there are many mounting processes, and the thickness is increased by the thickness of a bonding agent such as solder. Further, if there is solder or a conductor pattern on the mounting surface, the magnetic field is hindered by the solder or conductor pattern, so that the antenna characteristics deteriorate. For this reason, the antenna element mounting area of the flexible substrate cannot be effectively used and cannot be downsized.
  • An object of the present invention is to provide a communication device and an electronic apparatus that are provided with an antenna and a chip component on a substrate and can be further miniaturized.
  • a communication apparatus includes a substrate, an antenna and an IC provided on the substrate, and the substrate is a stacked body in which a plurality of insulating layers are stacked, and the antenna includes a plurality of layers inside the stacked body.
  • the coiled conductor pattern is formed over the upper layer side and the lower layer side than the height of the mounting surface of the IC in the multilayer body. .
  • the above configuration solves the problem of mounting the antenna element on the substrate. That is, the thickness and size can be reduced without degrading the antenna characteristics.
  • the IC is disposed within a formation range in the stacking direction of the coiled conductor pattern. This effectively reduces the thickness.
  • the coiled conductor pattern is composed of a planar conductor provided on the main surface of the insulating layer and an interlayer connection conductor penetrating the insulating layer.
  • the IC is mounted on the surface of the laminate or incorporated in the laminate. With this structure, the thickness of the IC can be reduced.
  • a magnetic core is built in the laminated body inside the formation area of the coiled conductor pattern.
  • a predetermined inductance can be set without increasing the size of the antenna portion.
  • the convergence of the magnetic flux is increased, and the degree of coupling with the communication partner antenna in short-range communication is increased.
  • the insulating layer is preferably made of LCP (liquid crystal polymer). As a result, the dielectric loss can be kept low.
  • an external connection terminal is formed on the laminate, and a cover that covers the laminate is provided.
  • a single laminate covered with a cover can be handled as, for example, a card-type communication device.
  • An electronic apparatus includes any one of the communication devices described above, and the communication device is housed in a housing.
  • an electronic device having a communication function can be configured by inserting or mounting a card-type communication device in a housing.
  • the problem in mounting the antenna element on the substrate is solved. That is, the thickness and size can be reduced without degrading the antenna characteristics.
  • FIG. 1 is a perspective view of a communication apparatus 101 according to the first embodiment.
  • 2A is a plan view of the communication apparatus 101
  • FIG. 2B is a cross-sectional view of the main part of the communication apparatus 101.
  • FIG. 3 is a circuit diagram of the main part of the communication apparatus 101.
  • FIG. 4 is an exploded perspective view of the communication apparatus 101.
  • FIG. 5 is an exploded cross-sectional view of the communication apparatus 101.
  • FIG. 6 is an exploded perspective view of the communication apparatus 102 according to the second embodiment.
  • FIG. 7 is an exploded cross-sectional view of the communication device 102.
  • FIG. 8 is an exploded perspective view of the communication device 103 according to the third embodiment.
  • FIG. 9 is an exploded cross-sectional view of the communication device 103.
  • FIG. 10 is an exploded perspective view of the communication device 104 according to the fourth embodiment.
  • FIG. 11 is an exploded cross-sectional view of the communication device 104.
  • FIG. 12 is an exploded perspective view of a communication apparatus 101A according to the fifth embodiment.
  • FIG. 13 is a perspective view of the electronic apparatus 201.
  • FIG. 1 is a perspective view of a communication apparatus 101 according to the first embodiment.
  • 2A is a plan view of the communication apparatus 101
  • FIG. 2B is a cross-sectional view of the main part of the communication apparatus 101.
  • the communication device 101 includes a resin multilayer substrate (hereinafter simply referred to as “substrate”) 10, an antenna 20, ICs 31 and 32, and other chip components 41 and 42 provided on the substrate 10.
  • substrate 10 is a laminate in which a plurality of insulating layers made of a thermoplastic resin such as LCP (liquid crystal polymer) are laminated and thermocompression bonded.
  • LCP liquid crystal polymer
  • the antenna 20 is a coiled conductor pattern formed over a plurality of layers inside the laminate.
  • the coiled conductor pattern is composed of planar conductors 21 and 22 provided on the main surface of the insulating layer, and interlayer connection conductors 23 and 24 penetrating the insulating layer. That is, a rectangular helical coil-shaped conductor pattern whose axis is in the in-plane direction of the insulating layer is configured. This coiled conductor pattern is formed over the upper layer side and the lower layer side than the height of the mounting surface of the ICs 31 and 32 in the multilayer body.
  • the antenna 20 is coupled to the communication partner antenna in such a manner that the magnetic flux passes in the in-plane direction of the insulating layer, and therefore, for example, some electrode is formed in the formation region of the antenna 20 of the insulating layer 11. Even so, there is little coupling with the magnetic flux passing through the coil opening. Therefore, if necessary, the formation area of the laminated antenna 20 can be used as a conductor pattern formation area other than the antenna.
  • FIG. 3 is a circuit diagram of the main part of the communication apparatus 101.
  • the IC 31 is an RFIC, and the IC 32 is a memory.
  • the antenna 20 is connected to an RF port of the IC 31 (RFIC) through a matching circuit including a chip component 41 and the like.
  • FIG. 4 is an exploded perspective view of the communication apparatus 101
  • FIG. 5 is an exploded sectional view of the communication apparatus 101.
  • each element is enlarged and particularly exaggerated in the thickness direction. The same applies to the second and subsequent embodiments.
  • the substrate is a laminate of insulating layers 11-16.
  • chip parts such as ICs 31 and 32 are mounted on the surface of the laminated body of the insulating layers 11, 12, and 13.
  • An antenna 20 is formed on the insulating layers 12 to 16 among the plurality of insulating layers.
  • An external connection terminal 51 is formed on the lower surface of the insulating layer 11.
  • the manufacturing method of the communication device 101 is as follows.
  • a hole for via formation is formed by laser processing from the surface opposite to the land formation surface, and a conductive paste such as Cu paste is applied to the hole with a squeegee and dried.
  • the antennas on the resin multilayer substrate together with the ICs 31 and 32 and arranging the ICs 31 and 32 within the formation range in the lamination direction of the coiled conductor pattern for example, compared to a structure in which the antenna element is mounted on the flexible substrate.
  • the coil opening of the coiled conductor pattern can be enlarged while being thin, high antenna radiation efficiency can be ensured.
  • the loss can be reduced by configuring the insulating layer with a low dielectric loss resin such as LCP (liquid crystal polymer).
  • a small communication device that does not have a housing, does not have a connector, and is not soldered can be configured with a simple process.
  • the handling becomes good.
  • FIG. 6 is an exploded perspective view of the communication apparatus 102 according to the second embodiment
  • FIG. 7 is an exploded cross-sectional view of the communication apparatus 102.
  • the substrate is a laminated body of insulating layers 11-15.
  • chip parts such as ICs 31 and 32 are mounted on the surface of the laminated body of the insulating layers 11 and 12.
  • An antenna 20 is formed on the insulating layers 12-15.
  • Insulating layers 13 and 14 are formed with openings for incorporating chip components such as ICs 31 and 32 into the laminate.
  • chip components such as ICs 31 and 32 are mounted on a laminate of insulating layers 11 and 12. At that time, chip components such as ICs 31 and 32 are not connected to the regular conductors by heating and pressing the interlayer connection conductors as shown by circles A in FIG. ).
  • cavities are formed by the openings of the insulating layers 13, 14.
  • a laminated body made of the insulating layers 11, 12 is laminated on the laminated body made of the insulating layers 13, 14, 15, and is heated and pressed to form a cavity in the laminated body. Built in.
  • a part of the antenna 20 is constituted by the laminated body composed of the insulating layers 13, 14 and 15, and the remaining part of the antenna 20 is constituted by the laminated body constituted by the insulating layers 11 and 12.
  • the antenna 20 is configured by laminating them.
  • FIG. 8 is an exploded perspective view of the communication device 103 according to the third embodiment
  • FIG. 9 is an exploded cross-sectional view of the communication device 103.
  • the substrate is a laminated body of insulating layers 11-15.
  • chip parts such as ICs 31 and 32 are mounted on the surface of the laminated body of the insulating layers 11 and 12.
  • An antenna 20 is formed on the insulating layers 12-15.
  • Insulating layers 13 and 14 are formed with openings for incorporating chip components such as ICs 31 and 32 into the laminate.
  • the communication device 103 has a magnetic core 61 built in the laminate inside the coiled conductor pattern formation region of the antenna 20.
  • the magnetic core 61 is mounted on the laminated body of the insulating layers 11 and 12 together with the chip components such as the ICs 31 and 32.
  • the laminated body of the insulating layers 13, 14, 15 cavities are formed by the openings of the insulating layers 13, 14.
  • chip components such as ICs 31, 32 and the magnetic core 61 are formed in the cavity. Is built-in.
  • a part of the antenna 20 is constituted by the laminated body composed of the insulating layers 13, 14 and 15, and the remaining part of the antenna 20 is constituted by the laminated body constituted by the insulating layers 11 and 12.
  • the antenna 20 is configured by laminating them.
  • the antenna portion can be set to a predetermined inductance without increasing the size.
  • the convergence of the magnetic flux is increased, and the degree of coupling with the communication partner antenna in short-range communication is increased.
  • FIG. 10 is an exploded perspective view of the communication device 104 according to the fourth embodiment
  • FIG. 11 is an exploded cross-sectional view of the communication device 104.
  • the substrate is a laminated body of insulating layers 11-15.
  • chip parts such as ICs 31 and 32 are mounted on the surface of the laminated body of the insulating layers 11 and 12.
  • An antenna 20 is formed on the insulating layers 12-15.
  • Insulating layers 13 and 14 are formed with openings for incorporating chip components such as ICs 31 and 32 into the laminate.
  • the antenna 20 of the communication device 104 includes a rectangular helical coil-shaped conductor pattern in which the coil winding axis is oriented in the stacking direction of the multilayer body by the planar conductors 25a to 25d and the interlayer connection conductor 26. Has been.
  • the antenna 20 can be coupled to the communication partner antenna by a usage method in which magnetic flux passes in the stacking direction of the stacked body.
  • a non-magnetic insulating layer is laminated.
  • a resin sheet in which ferrite powder is dispersed in LCP or other resin may be laminated.
  • the antenna can be set to a predetermined inductance without increasing the size of the antenna portion.
  • only the insulating layer above the insulating layer on which the IC or other chip component is mounted may be formed of the magnetic resin sheet. As a result, the cost can be reduced.
  • FIG. 12 is an exploded perspective view of the communication apparatus 101A according to the fifth embodiment
  • FIG. 13 is a perspective view of the electronic apparatus 201.
  • the communication device 101A of the present embodiment is formed by stacking and integrating the communication device 101 shown in the first embodiment so that the upper and lower sides of the communication device 101 are sandwiched between covers 71 and 72. .
  • a recess for forming a space for mounting the ICs 31, 32, etc. is formed on the lower surface of the cover 71.
  • a plurality of external connection terminals are formed on the lower surface of the laminated body of the communication device 101, and an opening AP that exposes the external connection terminals is formed in the cover 72 at a position facing the external connection terminals.
  • a card-type communication device such as an SD card or a SIM card, which is provided with a cover, is configured.
  • covers 71 and 72 may be provided by applying and forming a resin sealing layer on the laminated body and then heat-curing it.
  • the communication device 101A is housed, for example, in a casing 81 of a mobile terminal, and the external connection terminal electrode is connected to a circuit in the electronic device.
  • the electronic device 201 can also be thinned. Since the communication device 101A is thin, the electronic device 201 can also be thinned. Since the communication apparatus 101A includes a coil antenna instead of a dielectric antenna, there are few restrictions on the arrangement of the metal plate in the housing 81, and the degree of freedom in design is high, and accordingly, a thinner and smaller electronic device is more suitable. Can be configured.
  • Opening 10 Resin multilayer substrate (laminate) DESCRIPTION OF SYMBOLS 11-16 ... Insulating layer 20 ... Antenna 21, 22 ... Planar conductor 23, 24, 26 ... Interlayer connection conductor 25a-25d ... Planar conductor 31, 32 ... IC 41, 42 ... chip component 51 ... external connection terminal 61 ... magnetic core 71, 72 ... cover 81 ... housing 101 to 104 ... communication device 101A ... communication device 201 ... electronic device

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Abstract

A communication apparatus (101) comprises: a board (10); an antenna (20) provided to the board (10); and ICs (31, 32) also provided thereto. The board (10) is a laminated product in which a plurality of insulating layers are laminated, while the antenna (20) is a coil-shaped conductor pattern formed such that the coil-shaped conductor pattern extends through a plurality of layers within the laminated product. This coil-shaped conductor pattern is formed such that the coil-shaped conductor pattern extends through layers upper and lower than the height of the mounting plane of the ICs (31, 32) in the laminated product. In this way, further downsized communication apparatuses and electronic devices having antennas and chip components provided to the boards thereof are configured.

Description

通信装置および電子機器Communication device and electronic device
　本発明は、例えばＲＦＩＤ（Radio Frequency Identification）システムや近距離無線通信（NFC：Near Field Communication）システムに用いられる通信装置および電子機器に関するものである。 The present invention relates to a communication apparatus and an electronic device used in, for example, an RFID (Radio Frequency Identification) system and a near field communication (NFC) system.
　ＲＦＩＤシステムやＮＦＣシステムに適用される携帯電話端末などの電子機器の小型化が進められている。例えば、通信機能をモジュール化した通信端末装置が特許文献１に示されている。 Electronic devices such as mobile phone terminals that are applied to RFID systems and NFC systems are being reduced in size. For example, Patent Document 1 discloses a communication terminal device in which a communication function is modularized.
　特許文献１の通信端末装置は、フレキシブル基板上にチップ部品とともにアンテナ素子を実装し、このフレキシブル基板を筐体内に収めたものである。 The communication terminal device of Patent Document 1 is such that an antenna element and a chip component are mounted on a flexible substrate, and the flexible substrate is housed in a casing.
特開２００１－１４３０３２号公報JP 2001-143032 A
　特許文献１の通信端末装置は、アンテナ素子をフレキシブル基板上にチップ部品とともに実装する構造であるので、実装工程が多く、はんだなどの接合剤の厚さ分厚くなる。また、実装面にはんだや導体パターンがあると、そのはんだや導体パターンにより磁界が妨げられるので、アンテナ特性が劣化する。そのため、フレキシブル基板のアンテナ素子実装領域が有効利用できず、小型化できない。 Since the communication terminal device of Patent Document 1 has a structure in which an antenna element is mounted on a flexible substrate together with a chip component, there are many mounting processes, and the thickness is increased by the thickness of a bonding agent such as solder. Further, if there is solder or a conductor pattern on the mounting surface, the magnetic field is hindered by the solder or conductor pattern, so that the antenna characteristics deteriorate. For this reason, the antenna element mounting area of the flexible substrate cannot be effectively used and cannot be downsized.
　本発明の目的は、アンテナおよびチップ部品を基板に備え、より小型化できるようにした通信装置および電子機器を提供することにある。 An object of the present invention is to provide a communication device and an electronic apparatus that are provided with an antenna and a chip component on a substrate and can be further miniaturized.
　本発明の通信装置は、基板と、この基板に設けられたアンテナおよびＩＣを備え、前記基板は、複数の絶縁層が積層された積層体であり、前記アンテナは前記積層体の内部の複数層に亘って形成されたコイル状導体パターンであり、前記コイル状導体パターンは、前記積層体における前記ＩＣの実装面の高さよりも上層側および下層側に亘って形成されていることを特徴とする。 A communication apparatus according to the present invention includes a substrate, an antenna and an IC provided on the substrate, and the substrate is a stacked body in which a plurality of insulating layers are stacked, and the antenna includes a plurality of layers inside the stacked body. The coiled conductor pattern is formed over the upper layer side and the lower layer side than the height of the mounting surface of the IC in the multilayer body. .
　上記構成により、アンテナ素子を基板上に実装する場合の問題が解消される。すなわち、アンテナ特性を劣化させることなく薄型化・小型化が図れる。 The above configuration solves the problem of mounting the antenna element on the substrate. That is, the thickness and size can be reduced without degrading the antenna characteristics.
　前記ＩＣは前記コイル状導体パターンの積層方向における形成範囲内に配置されていることが好ましい。このことにより、効果的に薄型化される。 It is preferable that the IC is disposed within a formation range in the stacking direction of the coiled conductor pattern. This effectively reduces the thickness.
　前記コイル状導体パターンは、前記絶縁層の主面に設けられた平面導体と、前記絶縁層を貫通する層間接続導体とで構成されていることが好ましい。この構造により、通常の多層基板の製造工程で、基板内にアンテナを構成できる。 It is preferable that the coiled conductor pattern is composed of a planar conductor provided on the main surface of the insulating layer and an interlayer connection conductor penetrating the insulating layer. With this structure, an antenna can be formed in the substrate in a normal multilayer substrate manufacturing process.
　前記ＩＣは前記積層体の表面に実装されているか、または積層体に内蔵されていることが好ましい。この構造により、ＩＣの素子厚分の薄型化も図れる。 It is preferable that the IC is mounted on the surface of the laminate or incorporated in the laminate. With this structure, the thickness of the IC can be reduced.
　前記コイル状導体パターンの形成領域の内側で、前記積層体内に磁性体コアが内蔵されていることが好ましい。この構造により、アンテナ部分を大型化することなく所定のインダクタンスに定めることができる。また、磁束の収束性が高まり、近距離通信での通信相手側アンテナとの結合度が高まる。 It is preferable that a magnetic core is built in the laminated body inside the formation area of the coiled conductor pattern. With this structure, a predetermined inductance can be set without increasing the size of the antenna portion. In addition, the convergence of the magnetic flux is increased, and the degree of coupling with the communication partner antenna in short-range communication is increased.
　前記絶縁層はＬＣＰ（液晶ポリマー）で構成されていることが好ましい。このことで、誘電体損失を低く抑えることができる。 The insulating layer is preferably made of LCP (liquid crystal polymer). As a result, the dielectric loss can be kept low.
　前記積層体に外部接続端子が形成されていて、前記積層体を覆うカバーを備えていることが好ましい。この構造により、カバーで被覆された積層体単体で例えばカード型の通信装置として扱える。 It is preferable that an external connection terminal is formed on the laminate, and a cover that covers the laminate is provided. With this structure, a single laminate covered with a cover can be handled as, for example, a card-type communication device.
　本発明の電子機器は、上記いずれかに記載の通信装置を備え、この通信装置を筐体内に収めたものである。例えばカード型の通信装置を筐体内に挿入または装着することで通信機能を有する電子機器を構成できる。 An electronic apparatus according to the present invention includes any one of the communication devices described above, and the communication device is housed in a housing. For example, an electronic device having a communication function can be configured by inserting or mounting a card-type communication device in a housing.
　本発明によれば、アンテナ素子を基板上に実装する場合の問題が解消される。すなわち、アンテナ特性を劣化させることなく薄型化・小型化が図れる。 According to the present invention, the problem in mounting the antenna element on the substrate is solved. That is, the thickness and size can be reduced without degrading the antenna characteristics.
図１は第１の実施形態に係る通信装置１０１の斜視図である。FIG. 1 is a perspective view of a communication apparatus 101 according to the first embodiment. 図２（Ａ）は通信装置１０１の平面図、図２（Ｂ）は通信装置１０１の主要部の断面図である。2A is a plan view of the communication apparatus 101, and FIG. 2B is a cross-sectional view of the main part of the communication apparatus 101. 図３は通信装置１０１の主要部の回路図である。FIG. 3 is a circuit diagram of the main part of the communication apparatus 101. 図４は通信装置１０１の分解斜視図である。FIG. 4 is an exploded perspective view of the communication apparatus 101. 図５は通信装置１０１の分解断面図である。FIG. 5 is an exploded cross-sectional view of the communication apparatus 101. 図６は、第２の実施形態に係る通信装置１０２の分解斜視図である。FIG. 6 is an exploded perspective view of the communication apparatus 102 according to the second embodiment. 図７は通信装置１０２の分解断面図である。FIG. 7 is an exploded cross-sectional view of the communication device 102. 図８は、第３の実施形態に係る通信装置１０３の分解斜視図である。FIG. 8 is an exploded perspective view of the communication device 103 according to the third embodiment. 図９は通信装置１０３の分解断面図である。FIG. 9 is an exploded cross-sectional view of the communication device 103. 図１０は、第４の実施形態に係る通信装置１０４の分解斜視図である。FIG. 10 is an exploded perspective view of the communication device 104 according to the fourth embodiment. 図１１は通信装置１０４の分解断面図である。FIG. 11 is an exploded cross-sectional view of the communication device 104. 図１２は、第５の実施形態に係る通信装置１０１Ａの分解斜視図である。FIG. 12 is an exploded perspective view of a communication apparatus 101A according to the fifth embodiment. 図１３は電子機器２０１の斜視図である。FIG. 13 is a perspective view of the electronic apparatus 201.
　以降、図を参照して幾つかの具体的な例を挙げて、本発明を実施するための複数の形態を示す。各図中には同一箇所に同一符号を付している。各実施形態は例示であり、異なる実施形態で示した構成の部分的な置換または組み合わせが可能であることは言うまでもない。 Hereinafter, several specific examples will be given with reference to the drawings to show a plurality of modes for carrying out the present invention. In each figure, the same reference numerals are assigned to the same portions. Each embodiment is an exemplification, and needless to say, partial replacement or combination of configurations shown in different embodiments is possible.
《第１の実施形態》
　図１は第１の実施形態に係る通信装置１０１の斜視図である。図２（Ａ）は通信装置１０１の平面図、図２（Ｂ）は通信装置１０１の主要部の断面図である。 << First Embodiment >>
FIG. 1 is a perspective view of a communication apparatus 101 according to the first embodiment. 2A is a plan view of the communication apparatus 101, and FIG. 2B is a cross-sectional view of the main part of the communication apparatus 101.
　この通信装置１０１は、樹脂多層基板（以下、単に「基板」）１０と、この基板１０に設けられたアンテナ２０、ＩＣ３１，３２およびその他のチップ部品４１，４２等を備えている。基板１０は、ＬＣＰ（液晶ポリマー）等の熱可塑性樹脂による複数の絶縁層が積層され、加熱圧着された積層体である。アンテナ２０は積層体の内部の複数層に亘って形成されたコイル状導体パターンである。 The communication device 101 includes a resin multilayer substrate (hereinafter simply referred to as “substrate”) 10, an antenna 20, ICs 31 and 32, and other chip components 41 and 42 provided on the substrate 10. The substrate 10 is a laminate in which a plurality of insulating layers made of a thermoplastic resin such as LCP (liquid crystal polymer) are laminated and thermocompression bonded. The antenna 20 is a coiled conductor pattern formed over a plurality of layers inside the laminate.
　上記コイル状導体パターンは、絶縁層の主面に設けられた平面導体２１，２２と、絶縁層を貫通する層間接続導体２３，２４とで構成されている。すなわち、絶縁層の面内方向に軸が向く矩形ヘリカル状のコイル状導体パターンが構成されている。このコイル状導体パターンは、積層体におけるＩＣ３１，３２の実装面の高さよりも上層側および下層側に亘って形成されている。 The coiled conductor pattern is composed of planar conductors 21 and 22 provided on the main surface of the insulating layer, and interlayer connection conductors 23 and 24 penetrating the insulating layer. That is, a rectangular helical coil-shaped conductor pattern whose axis is in the in-plane direction of the insulating layer is configured. This coiled conductor pattern is formed over the upper layer side and the lower layer side than the height of the mounting surface of the ICs 31 and 32 in the multilayer body.
　本実施形態の通信装置１０１は、アンテナ２０が絶縁層の面内方向に磁束が通る使用方法で通信相手側アンテナと結合するので、例えば絶縁層１１のアンテナ２０の形成領域に何らかの電極が形成されていても、コイル開口を抜ける磁束との結合は少ない。そのため、必要に応じて、積層体のアンテナ２０の形成領域をアンテナ以外の導体パターン形成領域として使用することもできる。 In the communication apparatus 101 of the present embodiment, the antenna 20 is coupled to the communication partner antenna in such a manner that the magnetic flux passes in the in-plane direction of the insulating layer, and therefore, for example, some electrode is formed in the formation region of the antenna 20 of the insulating layer 11. Even so, there is little coupling with the magnetic flux passing through the coil opening. Therefore, if necessary, the formation area of the laminated antenna 20 can be used as a conductor pattern formation area other than the antenna.
　図３は通信装置１０１の主要部の回路図である。上記ＩＣ３１はＲＦＩＣであり、ＩＣ３２はメモリである。ＩＣ３１（ＲＦＩＣ）のＲＦポートにはチップ部品４１等による整合回路を介してアンテナ２０が接続されている。 FIG. 3 is a circuit diagram of the main part of the communication apparatus 101. The IC 31 is an RFIC, and the IC 32 is a memory. The antenna 20 is connected to an RF port of the IC 31 (RFIC) through a matching circuit including a chip component 41 and the like.
　図４は通信装置１０１の分解斜視図であり、図５は通信装置１０１の分解断面図である。分解断面図は各要素を拡大し、特に厚み方向に誇張して描いている。これは第２の実施形態以降についても同様である。 4 is an exploded perspective view of the communication apparatus 101, and FIG. 5 is an exploded sectional view of the communication apparatus 101. In the exploded sectional view, each element is enlarged and particularly exaggerated in the thickness direction. The same applies to the second and subsequent embodiments.
　図５に表れているように、基板は絶縁層１１～１６の積層体である。これらの絶縁層のうち、絶縁層１１，１２，１３の積層体の表面にＩＣ３１，３２等のチップ部品が実装されている。複数の絶縁層のうち絶縁層１２～１６にアンテナ２０が構成されている。また、絶縁層１１の下面に外部接続端子５１が構成されている。 As shown in FIG. 5, the substrate is a laminate of insulating layers 11-16. Among these insulating layers, chip parts such as ICs 31 and 32 are mounted on the surface of the laminated body of the insulating layers 11, 12, and 13. An antenna 20 is formed on the insulating layers 12 to 16 among the plurality of insulating layers. An external connection terminal 51 is formed on the lower surface of the insulating layer 11.
　通信装置１０１の製造方法は次のとおりである。 The manufacturing method of the communication device 101 is as follows.
（１）導体パターン形成
　片面銅張の樹脂シートにエッチングレジストを塗布し、ビア導体形成位置のランドを形成するためにエッチングレジスト膜をパターン化し、エッチングし、エッチングレジスト膜を除去する。 (1) Conductor pattern formation An etching resist is applied to a single-sided copper-clad resin sheet, the etching resist film is patterned and etched to form lands at via conductor formation positions, and the etching resist film is removed.
（２）層間接続導体形成
　ランド形成面とは反対側の面からレーザー加工によりビア形成用の穴をあけ、その穴にＣｕペースト等の導電性ペーストをスキージで塗布し、乾燥する。 (2) Interlayer connection conductor formation A hole for via formation is formed by laser processing from the surface opposite to the land formation surface, and a conductive paste such as Cu paste is applied to the hole with a squeegee and dried.
（３）熱圧着
　樹脂シートをこれらの順に積み上げることで、絶縁層の仮積層体を構成し、その後、一括加熱プレスにより熱圧着する。または１層ずつ熱圧着しながら積層してもよい。さらには、接着シートを介在させて貼り付けてもよい。 (3) Thermocompression bonding Resin sheets are stacked in this order to form a temporary laminate of insulating layers, and then thermocompression bonded by a batch heating press. Or you may laminate | stack, laminating | stacking one layer at a time. Furthermore, you may affix by interposing an adhesive sheet.
　このように、ＩＣ３１，３２とともにアンテナを樹脂多層基板に設け、コイル状導体パターンの積層方向における形成範囲内にＩＣ３１，３２を配置することにより、例えばフレキシブル基板にアンテナ素子を実装する構造に比べて薄くできる。また、薄型でありながら、コイル状導体パターンのコイル開口を大きくできるので、高いアンテナ放射効率を確保できる。特に、絶縁層をＬＣＰ（液晶ポリマー）等の低誘電体損失の樹脂で構成することにより、低損失化が図れる。 Thus, by providing the antennas on the resin multilayer substrate together with the ICs 31 and 32 and arranging the ICs 31 and 32 within the formation range in the lamination direction of the coiled conductor pattern, for example, compared to a structure in which the antenna element is mounted on the flexible substrate. Can be thin. Further, since the coil opening of the coiled conductor pattern can be enlarged while being thin, high antenna radiation efficiency can be ensured. In particular, the loss can be reduced by configuring the insulating layer with a low dielectric loss resin such as LCP (liquid crystal polymer).
　また、誘電体アンテナとは異なり、コイルアンテナであるので、金属体が近づいてもアンテナの特性が変化しにくい。さらに、一体形成されるため、簡易なプロセスで、筺体が無く、コネクタが無く、はんだ付けされない、小型の通信装置が構成できる。 Also, unlike a dielectric antenna, since it is a coil antenna, the characteristics of the antenna are unlikely to change even when a metal body approaches. Furthermore, since it is integrally formed, a small communication device that does not have a housing, does not have a connector, and is not soldered can be configured with a simple process.
　さらに、積層体の厚みは全体に比較的平坦になるので、ハンドリングが良好となる。 Furthermore, since the thickness of the laminated body becomes relatively flat as a whole, the handling becomes good.
《第２の実施形態》
　図６は、第２の実施形態に係る通信装置１０２の分解斜視図であり、図７は通信装置１０２の分解断面図である。 << Second Embodiment >>
FIG. 6 is an exploded perspective view of the communication apparatus 102 according to the second embodiment, and FIG. 7 is an exploded cross-sectional view of the communication apparatus 102.
　図７に表れているように、基板は絶縁層１１～１５の積層体である。これらの絶縁層のうち、絶縁層１１，１２の積層体の表面にＩＣ３１，３２等のチップ部品が実装されている。また、絶縁層１２～１５にアンテナ２０が構成されている。絶縁層１３，１４には、ＩＣ３１，３２等のチップ部品を積層体に内蔵するための開口が形成されている。 As shown in FIG. 7, the substrate is a laminated body of insulating layers 11-15. Among these insulating layers, chip parts such as ICs 31 and 32 are mounted on the surface of the laminated body of the insulating layers 11 and 12. An antenna 20 is formed on the insulating layers 12-15. Insulating layers 13 and 14 are formed with openings for incorporating chip components such as ICs 31 and 32 into the laminate.
　図６に表れているように、ＩＣ３１，３２等のチップ部品は絶縁層１１，１２の積層体に実装される。その際、通常のはんだ付けではなく、層間接続導体の加熱プレス時に、ＩＣ３１，３２等のチップ部品は、図７中に丸印Ａで示すように、層間接続導体を介して平面導体（配線パターン）に接続される。 As shown in FIG. 6, chip components such as ICs 31 and 32 are mounted on a laminate of insulating layers 11 and 12. At that time, chip components such as ICs 31 and 32 are not connected to the regular conductors by heating and pressing the interlayer connection conductors as shown by circles A in FIG. ).
　絶縁層１３，１４，１５の積層体には上記絶縁層１３，１４の開口によるキャビティが形成されている。絶縁層１１，１２による積層体に絶縁層１３，１４，１５による積層体が積層され、加熱プレスされることにより、積層体内にキャビティが構成され、このキャビティ内にＩＣ３１，３２等のチップ部品が内蔵される。 In the laminated body of the insulating layers 13, 14, 15, cavities are formed by the openings of the insulating layers 13, 14. A laminated body made of the insulating layers 11, 12 is laminated on the laminated body made of the insulating layers 13, 14, 15, and is heated and pressed to form a cavity in the laminated body. Built in.
　絶縁層１３，１４，１５による積層体にはアンテナ２０の一部が構成され、絶縁層１１，１２による積層体にはアンテナ２０の残りの部分が構成される。これらが積層されることにより、アンテナ２０が構成される。 A part of the antenna 20 is constituted by the laminated body composed of the insulating layers 13, 14 and 15, and the remaining part of the antenna 20 is constituted by the laminated body constituted by the insulating layers 11 and 12. The antenna 20 is configured by laminating them.
　本実施形態によれば、ＩＣや受動部品をはんだ実装する必要がない。また、アンテナ２０とともにＩＣ３１，３２やチップ部品が絶縁層で覆われるので、機械的衝撃に対する耐性が高い。 According to this embodiment, there is no need to solder and mount an IC or passive component. Further, since the ICs 31 and 32 and the chip parts are covered with the insulating layer together with the antenna 20, the resistance to mechanical shock is high.
《第３の実施形態》
　図８は、第３の実施形態に係る通信装置１０３の分解斜視図であり、図９は通信装置１０３の分解断面図である。 << Third Embodiment >>
FIG. 8 is an exploded perspective view of the communication device 103 according to the third embodiment, and FIG. 9 is an exploded cross-sectional view of the communication device 103.
　図９に表れているように、基板は絶縁層１１～１５の積層体である。これらの絶縁層のうち、絶縁層１１，１２の積層体の表面にＩＣ３１，３２等のチップ部品が実装されている。また、絶縁層１２～１５にアンテナ２０が構成されている。絶縁層１３，１４には、ＩＣ３１，３２等のチップ部品を積層体に内蔵するための開口が形成されている。 As shown in FIG. 9, the substrate is a laminated body of insulating layers 11-15. Among these insulating layers, chip parts such as ICs 31 and 32 are mounted on the surface of the laminated body of the insulating layers 11 and 12. An antenna 20 is formed on the insulating layers 12-15. Insulating layers 13 and 14 are formed with openings for incorporating chip components such as ICs 31 and 32 into the laminate.
　第２の実施形態と異なり、通信装置１０３には、アンテナ２０のコイル状導体パターンの形成領域の内側で、積層体内に磁性体コア６１が内蔵されている。 Unlike the second embodiment, the communication device 103 has a magnetic core 61 built in the laminate inside the coiled conductor pattern formation region of the antenna 20.
　図８に表れているように、ＩＣ３１，３２等のチップ部品とともに磁性体コア６１が絶縁層１１，１２の積層体に実装される。絶縁層１３，１４，１５の積層体には上記絶縁層１３，１４の開口によるキャビティが形成されている。絶縁層１１，１２による積層体に絶縁層１３，１４，１５による積層体が積層されることにより、積層体内にキャビティが構成され、このキャビティ内にＩＣ３１，３２等のチップ部品および磁性体コア６１が内蔵される。 As shown in FIG. 8, the magnetic core 61 is mounted on the laminated body of the insulating layers 11 and 12 together with the chip components such as the ICs 31 and 32. In the laminated body of the insulating layers 13, 14, 15, cavities are formed by the openings of the insulating layers 13, 14. By laminating the laminated body of the insulating layers 13, 14, 15 on the laminated body of the insulating layers 11, 12, a cavity is formed in the laminated body, and chip components such as ICs 31, 32 and the magnetic core 61 are formed in the cavity. Is built-in.
　絶縁層１３，１４，１５による積層体にはアンテナ２０の一部が構成され、絶縁層１１，１２による積層体にはアンテナ２０の残りの部分が構成される。これらが積層されることにより、アンテナ２０が構成される。 A part of the antenna 20 is constituted by the laminated body composed of the insulating layers 13, 14 and 15, and the remaining part of the antenna 20 is constituted by the laminated body constituted by the insulating layers 11 and 12. The antenna 20 is configured by laminating them.
　このように、アンテナ２０のコイル状導体パターンの形成領域の内側で、積層体内に磁性体コア６１が内蔵されていることにより、アンテナ部分を大型化することなく所定のインダクタンスに定めることができる。また、磁束の収束性が高まり、近距離通信での通信相手側アンテナとの結合度が高まる。 As described above, since the magnetic core 61 is built in the laminated body inside the coil-shaped conductor pattern forming region of the antenna 20, the antenna portion can be set to a predetermined inductance without increasing the size. In addition, the convergence of the magnetic flux is increased, and the degree of coupling with the communication partner antenna in short-range communication is increased.
《第４の実施形態》
　図１０は、第４の実施形態に係る通信装置１０４の分解斜視図であり、図１１は通信装置１０４の分解断面図である。 << Fourth Embodiment >>
FIG. 10 is an exploded perspective view of the communication device 104 according to the fourth embodiment, and FIG. 11 is an exploded cross-sectional view of the communication device 104.
　図１１に表れているように、基板は絶縁層１１～１５の積層体である。これらの絶縁層のうち、絶縁層１１，１２の積層体の表面にＩＣ３１，３２等のチップ部品が実装されている。また、絶縁層１２～１５にアンテナ２０が構成されている。絶縁層１３，１４には、ＩＣ３１，３２等のチップ部品を積層体に内蔵するための開口が形成されている。 As shown in FIG. 11, the substrate is a laminated body of insulating layers 11-15. Among these insulating layers, chip parts such as ICs 31 and 32 are mounted on the surface of the laminated body of the insulating layers 11 and 12. An antenna 20 is formed on the insulating layers 12-15. Insulating layers 13 and 14 are formed with openings for incorporating chip components such as ICs 31 and 32 into the laminate.
　第３の実施形態と異なり、通信装置１０４のアンテナ２０は、平面導体２５ａ～２５ｄと層間接続導体２６によって、積層体の積層方向にコイル巻回軸が向く矩形ヘリカル状のコイル状導体パターンが構成されている。 Unlike the third embodiment, the antenna 20 of the communication device 104 includes a rectangular helical coil-shaped conductor pattern in which the coil winding axis is oriented in the stacking direction of the multilayer body by the planar conductors 25a to 25d and the interlayer connection conductor 26. Has been.
　本実施形態によれば、アンテナ２０を、積層体の積層方向に磁束が通る使用方法で通信相手側アンテナと結合させることができる。 According to the present embodiment, the antenna 20 can be coupled to the communication partner antenna by a usage method in which magnetic flux passes in the stacking direction of the stacked body.
　なお、以上に示した各実施形態では、非磁性体の絶縁層を積層する例を示したが、ＬＣＰやその他の樹脂にフェライト粉を分散させた樹脂シートを積層してもよい。そのことで、アンテナ部分を大型化することなく、アンテナを所定のインダクタンスに定めることができる。また、ＩＣやその他のチップ部品を実装する絶縁層より上部の絶縁層のみを、上記磁性を有する樹脂シートで構成してもよい。そのことで、低コスト化が図れる。 In each of the embodiments described above, an example in which a non-magnetic insulating layer is laminated is shown. However, a resin sheet in which ferrite powder is dispersed in LCP or other resin may be laminated. As a result, the antenna can be set to a predetermined inductance without increasing the size of the antenna portion. In addition, only the insulating layer above the insulating layer on which the IC or other chip component is mounted may be formed of the magnetic resin sheet. As a result, the cost can be reduced.
《第５の実施形態》
　図１２は、第５の実施形態に係る通信装置１０１Ａの分解斜視図であり、図１３は電子機器２０１の斜視図である。 << Fifth Embodiment >>
FIG. 12 is an exploded perspective view of the communication apparatus 101A according to the fifth embodiment, and FIG. 13 is a perspective view of the electronic apparatus 201.
　本実施形態の通信装置１０１Ａは、図１２に表れているように、第１の実施形態で示した通信装置１０１の上下をカバー７１，７２で挟み込むように、これらを積層一体化したものである。カバー７１の下面には、ＩＣ３１，３２等の実装位置の空間を形成する凹部が形成されている。通信装置１０１の積層体の下面には複数の外部接続端子が形成されていて、カバー７２には、外部接続端子に対向する位置に、外部接続端子を露出させる開口ＡＰが形成されている。 As shown in FIG. 12, the communication device 101A of the present embodiment is formed by stacking and integrating the communication device 101 shown in the first embodiment so that the upper and lower sides of the communication device 101 are sandwiched between covers 71 and 72. . On the lower surface of the cover 71, a recess for forming a space for mounting the ICs 31, 32, etc. is formed. A plurality of external connection terminals are formed on the lower surface of the laminated body of the communication device 101, and an opening AP that exposes the external connection terminals is formed in the cover 72 at a position facing the external connection terminals.
　このようにしてカバーを備えた、例えばＳＤカードやＳＩＭカードのようなカード型の通信装置が構成される。 Thus, a card-type communication device such as an SD card or a SIM card, which is provided with a cover, is configured.
　なお、カバー７１，７２は、積層体に対して樹脂封止層を塗布形成し、それを加熱硬化させることで設けてもよい。 Note that the covers 71 and 72 may be provided by applying and forming a resin sealing layer on the laminated body and then heat-curing it.
　上記通信装置１０１Ａは、図１３に表れているように、例えば携帯端末の筐体８１内に収められ、上記外部接続用端子電極が電子機器内の回路に接続される。 As shown in FIG. 13, the communication device 101A is housed, for example, in a casing 81 of a mobile terminal, and the external connection terminal electrode is connected to a circuit in the electronic device.
　通信装置１０１Ａは薄型であるので、電子機器２０１も薄型化できる。通信装置１０１Ａは、誘電体アンテナではなくコイルアンテナを備えるものであるので、筐体８１内の金属板の配置に制約が少なく、設計の自由度が高く、その分さらに薄型・小型の電子機器が構成できる。 Since the communication device 101A is thin, the electronic device 201 can also be thinned. Since the communication apparatus 101A includes a coil antenna instead of a dielectric antenna, there are few restrictions on the arrangement of the metal plate in the housing 81, and the degree of freedom in design is high, and accordingly, a thinner and smaller electronic device is more suitable. Can be configured.
ＡＰ…開口
１０…樹脂多層基板（積層体）
１１～１６…絶縁層
２０…アンテナ
２１，２２…平面導体
２３，２４，２６…層間接続導体
２５ａ～２５ｄ…平面導体
３１，３２…ＩＣ
４１，４２…チップ部品
５１…外部接続端子
６１…磁性体コア
７１，７２…カバー
８１…筐体
１０１～１０４…通信装置
１０１Ａ…通信装置
２０１…電子機器 AP: Opening 10: Resin multilayer substrate (laminate)
DESCRIPTION OF SYMBOLS 11-16 ... Insulating layer 20 ... Antenna 21, 22 ... Planar conductor 23, 24, 26 ... Interlayer connection conductor 25a-25d ... Planar conductor 31, 32 ... IC
41, 42 ... chip component 51 ... external connection terminal 61 ... magnetic core 71, 72 ... cover 81 ... housing 101 to 104 ... communication device 101A ... communication device 201 ... electronic device

Claims (8)

  1. 　基板と、この基板に設けられたアンテナおよびＩＣを備えた通信装置において、
    　前記基板は、複数の絶縁層が積層された積層体であり、
    　前記アンテナは前記積層体の内部の複数層に亘って形成されたコイル状導体パターンであり、
    　前記コイル状導体パターンは、前記積層体における前記ＩＣの実装面の高さよりも上層側および下層側に亘って形成されていることを特徴とする、通信装置。     In a communication device including a substrate and an antenna and an IC provided on the substrate,
    The substrate is a laminate in which a plurality of insulating layers are laminated,
    The antenna is a coiled conductor pattern formed over a plurality of layers inside the laminate,
    The communication device, wherein the coiled conductor pattern is formed on an upper layer side and a lower layer side than a height of a mounting surface of the IC in the multilayer body.
  2. 　前記ＩＣは前記コイル状導体パターンの積層方向における形成範囲内に配置されている、請求項１に記載の通信装置。 The communication device according to claim 1, wherein the IC is disposed within a formation range of the coiled conductor pattern in a stacking direction.
  3. 　前記コイル状導体パターンは、前記絶縁層の主面に設けられた平面導体と、前記絶縁層を貫通する層間接続導体とで構成されている、請求項１または２に記載の通信装置。 The communication device according to claim 1 or 2, wherein the coiled conductor pattern includes a planar conductor provided on a main surface of the insulating layer and an interlayer connection conductor penetrating the insulating layer.
  4. 　前記ＩＣは前記積層体の表面に実装されている、または積層体に内蔵されている、請求項１～３のいずれかに記載の通信装置。 The communication device according to any one of claims 1 to 3, wherein the IC is mounted on a surface of the laminated body or built in the laminated body.
  5. 　前記コイル状導体パターンの形成領域の内側で、前記積層体内に磁性体コアが内蔵されている、請求項１～４のいずれかに記載の通信装置。 The communication device according to any one of claims 1 to 4, wherein a magnetic core is built in the laminated body inside a formation area of the coiled conductor pattern.
  6. 　前記絶縁層は液晶ポリマーで構成されている、請求項１～５のいずれか記載の通信装置。 The communication device according to any one of claims 1 to 5, wherein the insulating layer is made of a liquid crystal polymer.
  7. 　前記積層体に外部接続端子が形成されていて、前記積層体を覆うカバーを備えた、請求項１～６のいずれかに記載の通信装置。 The communication device according to any one of claims 1 to 6, wherein an external connection terminal is formed on the laminate, and a cover that covers the laminate is provided.
  8. 　請求項１～７のいずれかに記載の通信装置を備え、この通信装置を筐体内に収めた、電子機器。 An electronic device comprising the communication device according to any one of claims 1 to 7 and housing the communication device in a housing.
PCT/JP2014/064909 2013-06-12 2014-06-05 Communication apparatus and electronic device WO2014199886A1 (en)

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