WO2014191532A1 - Modular data processing centre - Google Patents

Modular data processing centre Download PDF

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Publication number
WO2014191532A1
WO2014191532A1 PCT/EP2014/061201 EP2014061201W WO2014191532A1 WO 2014191532 A1 WO2014191532 A1 WO 2014191532A1 EP 2014061201 W EP2014061201 W EP 2014061201W WO 2014191532 A1 WO2014191532 A1 WO 2014191532A1
Authority
WO
WIPO (PCT)
Prior art keywords
modules
data processing
face
processing centre
data
Prior art date
Application number
PCT/EP2014/061201
Other languages
French (fr)
Inventor
Marc Faig Palomer
Original Assignee
Ast Modular, S.L.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ast Modular, S.L. filed Critical Ast Modular, S.L.
Publication of WO2014191532A1 publication Critical patent/WO2014191532A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1497—Rooms for data centers; Shipping containers therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04H—BUILDINGS OR LIKE STRUCTURES FOR PARTICULAR PURPOSES; SWIMMING OR SPLASH BATHS OR POOLS; MASTS; FENCING; TENTS OR CANOPIES, IN GENERAL
    • E04H1/00—Buildings or groups of buildings for dwelling or office purposes; General layout, e.g. modular co-ordination or staggered storeys
    • E04H1/12—Small buildings or other erections for limited occupation, erected in the open air or arranged in buildings, e.g. kiosks, waiting shelters for bus stops or for filling stations, roofs for railway platforms, watchmen's huts or dressing cubicles
    • E04H2001/1283—Small buildings of the ISO containers type
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04H—BUILDINGS OR LIKE STRUCTURES FOR PARTICULAR PURPOSES; SWIMMING OR SPLASH BATHS OR POOLS; MASTS; FENCING; TENTS OR CANOPIES, IN GENERAL
    • E04H5/00—Buildings or groups of buildings for industrial or agricultural purposes
    • E04H2005/005—Buildings for data processing centers

Definitions

  • the present invention relates to a modular data processing centre, which enables the modular implementation of one of its basic operating infrastructure, specifically the air conditioning system of the inner space of the DPC.
  • This enables a horizontal, vertical or combined arrangement of the portable data modules that define the inner space intended to house one or more electronic information processing systems mounted in racks and/or in special cabinets. This proves particularly useful for application in a wide variety of building solutions.
  • Data processing centres are made up of large rooms or buildings, inside of which a great number of pieces of electronic equipment are concentrated, for the purpose of processing the information of a given company or organisation.
  • Document US2012/0300372A1 shows a modular data processing centre, comprising a plurality of portable data modules that define the inner space thereof. Each one of them is made up of a front face, a back face and two lateral faces, delimited by a bottom module support face and a top face. Said document distinguishes between three types of data module, namely interior, facility-side-end and power-side-end. They are all arranged side-by-side, arranged horizontally by at least one of their lateral faces.
  • the air conditioning system of the inner space of this DPC requires an inner distribution of hot aisles and cold aisles.
  • the former collect the hot air between two rows of racks and/or special cabinets with electronic equipment, such that the heat given off by the latter generates a return airflow that is gathered by a plurality of chilling units arranged on the top face of the data modules. Said units chill the return air and push it towards the cold aisles.
  • the DPC comprises a power module, annexed to one of the data modules, inside of which the electrical supply and distribution systems are concentrated, as well as additional cooling units, and humidifiers.
  • Document WO2012/138362A1 shows a modular data processing centre that attempts to resolve some of the abovementioned problems.
  • said document shows a modular DPC, comprising a plurality of portable functional modules that define the inner space thereof. Each one of them is made up of a front face, a back face and two lateral faces, delimited by a bottom structural module support face and a top face. Said modules are arranged side-by-side and horizontally by at least one of their lateral faces and at the same time, are also stacked one on top of the other by their top faces, in a vertical arrangement forming levels at various heights. Each one of these levels serves a specific function.
  • the modules at the bottom are intended for the electrical supply and distribution systems
  • the modules in the middle comprise the racks and/or special cabinets with the electronic equipment for information processing
  • the modules at the top are intended for the air conditioning system of the inner space of the DPC.
  • the modular data processing centre of the present invention overcomes the problems set forth above, through a structural and functional configuration that enables the modular implementation of the air conditioning system of the inner space of the DPC, along with the data modules themselves. This facilitates the implementation and assembly of the DPC and optimises the available space. Moreover, it enables it to be applied in a wide variety of building solutions, wherein the data modules can be arranged both horizontally and vertically or in a combination thereof, which proves especially useful both in building new DPCs and expanding those already in place. Description of the invention
  • the modular data processing centre of the present invention comprises a plurality of portable data modules that define an inner space, intended to house one or more electronic information processing systems mounted in racks and/or in special cabinets, each one of said data modules being made up of a front face, a back face and two lateral faces, delimited by a bottom data module support face and by a top face, said data modules being configured to enable:
  • Said modular data processing centre is characterised in that it comprises a plurality of cooling modules, each one of which is delimited laterally by at least one lateral joining face, arranged adjacently to one another by their lateral joining faces.
  • Said data modules are configured to enable:
  • This modular integration between prefabricated cooling modules and data modules enables a wide variety of DPC building solutions, wherein the data modules may be arranged horizontally, vertically or both ways at the same time, creating large, unobstructed spaces in which to place racks and/or special cabinets, which is extremely versatile in both building new DPCs and expanding those already in place.
  • each cooling module comprises:
  • a recirculation chamber configured to receive a return airflow coming from the inner space of the data processing centre, through a return opening
  • a chilling unit configured to chill a supply airflow coming from the recirculation chamber
  • one or more supply fans configured to enable the supply airflow to circulate through the chilling unit and push it towards the inner space (I) through a supply opening.
  • the recirculation chamber is configured so as to directly receive an external airflow coming from a space external to the data processing centre, through a duct-free intake opening.
  • the cooling module is compatible with the most common cooling systems, i.e. cooling water (CW) or direct expansion (DX).
  • the chilling units are chosen between water chilling coils and gas chilling coils.
  • the cooling module it is also possible to configure the cooling module to carry out indirect cooling, whilst still directly receiving an external airflow coming from a space external to the data processing centre. This is achieved by separating the recirculation chamber, in order to prevent cross contamination of the air between the return airflow and the external airflow, in turn using a chilling unit that comprises a passive air-air exchanger.
  • the cooling modules are preferably assembled by their longitudinal sides and are arranged at one end of the data module, inside or outside the same, as shall be seen further on.
  • the lateral joining faces of the cooling modules are parallel to the lateral faces of the data processing modules.
  • the front, back, bottom and top faces and one lateral face thereof, constitute enclosures, whereas the remaining lateral face of said data module constitutes a lateral extension opening.
  • the front, back, bottom and top faces thereof constitute enclosures, whereas the lateral faces of said data module constitute lateral extension openings.
  • the back, bottom and top faces thereof constitute enclosures, whereas the lateral faces and the front face of said data module constitute lateral extension openings.
  • the data processing centre preferably comprises insulation panels to cover the inside of the enclosures.
  • the lateral faces may comprise structural reinforcement columns, which are meant to be removed whilst building the DPC.
  • the bottom face preferably comprises a first coupling element positioned on each one of its bottom corners, configured to set one data module on top of another data module or on top of the foundation itself.
  • the top face comprises a second coupling element positioned on each one of its top corners, which may be coupled to the first coupling element.
  • the modular data processing centre comprises a fastening anchor, for fastening to the ground with a third coupling element, which may be coupled to the second coupling element.
  • the modular data processing centre of the present invention is complemented by other components intended to improve its structural stability and ensure that it is airtight.
  • the DPC comprises:
  • connecting bolts configured so as to reinforce the fastening between data modules arranged vertically, for example connecting the top face of one module to the bottom face of the module above it;
  • each data module comprises:
  • the modular data processing centre may comprise a modular slanted roof configured so as to be coupled to the top face of a data module.
  • the modular roof in turn comprises an air chamber configured to receive the extraction airflow, through the outlet passage and to redirect it towards an extraction passage connected to the external space.
  • each data module comprises:
  • the cooling modules are arranged externally, on the top face of a data module, wherein said data module comprises:
  • Figure 1 is a perspective view of a data module of the present invention.
  • Figure 2A is a plan view in section along line B-B of figure 2B, which corresponds to a DPC with two data modules arranged horizontally and four inner cooling modules without external air intake.
  • Figure 2B is an elevation view in section along line A-A of figure 2A.
  • Figure 3A is a plan view in section along line D-D of figure 3B, which corresponds to a DPC with two data modules arranged vertically and four inner cooling modules without external air intake.
  • Figure 3B is an elevation view in section along line C-C of figure 3 A.
  • Figure 4A is a plan view in section along line F-F of figure 4B, which corresponds to a DPC with two data modules arranged horizontally and four external cooling modules with external air intake.
  • Figure 4B is an elevation view in section along line E-E of figure 4A.
  • Figure 5 is an elevation view in section along a line equivalent to line E-E of figure 4A, which corresponds to a DPC such as the one in figures 4A and 4B, equipped with a modular roof.
  • Figure 6A is a plan view in section along line H-H of figure 6B, which corresponds to a DPC with two data modules arranged horizontally and four external cooling modules with external air intake.
  • Figure 6B is an elevation view in section along line G-G of figure 6A.
  • Figure 7A is a plan view in section along line I-I of figure 7B, which corresponds to a DPC with two data modules arranged horizontally and four external cooling modules with external air intake, arranged upon the top face of the data modules.
  • Figure 7B is an elevation view in section along line J-J of figure 7A.
  • Figure 8 is a cross-section of two data modules that are side-by-side.
  • Figure 9 is a detailed view of point "X" of figure 8.
  • Figure 10 is a detailed view of point "Y" of figure 8.
  • Figure 11 is a schematic elevation view of two stacked data modules.
  • Figure 12 is a detailed view of point "Z" of figure 10.
  • FIG. 1 is a perspective view of a portable data module (10) of the present invention.
  • each data module (10) defines an inner space (I) that is intended to house one or more electronic information processing systems mounted in racks and/or in special cabinets (100), each one of said data modules (10) being made up of a front face (11), a back face (12) and two lateral faces (13), delimited by a bottom data module (10) support face (14) and by a top face (15), said data modules (10) being configured to enable:
  • the present example shows a data module (10) in a lateral boundary position, wherein the front (11), back (12), bottom (14) and top (15) faces and one lateral face (13) thereof constitute enclosures (10A), whereas the remaining lateral face (13) of said data module (10B) constitutes a lateral extension opening (10B).
  • FIGs 2 A and 2B show a first example of how to build the modular data processing centre (1) of the present invention, with two data modules (10) arranged horizontally (H) and four inner cooling modules (20) without external air intake, operating in recirculation mode.
  • each cooling module (20) is delimited laterally by at least one lateral joining face (21), all arranged adjacently to one another by their lateral joining faces (21).
  • each cooling module (20) comprises:
  • a recirculation chamber (22) configured to receive a return airflow (2) coming from the inner space (I) of the data processing centre (1), through a return opening (23);
  • a chilling unit (24) configured to chill a supply airflow (3) coming from the recirculation chamber (22);
  • one or more supply fans (25) configured to enable the supply airflow (3) to circulate through the chilling unit (24) and push it towards the inner space (I) through a supply opening (26).
  • the recirculation chamber is configured so as to directly receive an external airflow (4) coming from a space external to the data processing centre (1), through a duct-free intake opening (27), figure 4B.
  • the cooling modules (20) are assembled by their longitudinal sides and are arranged at one end of the data module (10). To this end, the lateral joining faces (21) of the cooling modules (20) are parallel to the lateral faces (13) of the data processing modules (10).
  • Figures 3A and 3B show a second example of how to build the modular data processing centre (1) of the present invention, with two data modules (10) arranged vertically (V) and four internal cooling modules (20) without external air intake, operating in recirculation mode. As may be seen, the data modules (10) are arranged stacked one on top of the other by one of their top faces (15).
  • FIGS 4A and 4B show a third example of how to build the modular data processing centre (1) of the present invention, with two data modules (10) arranged horizontally (H) and four external cooling modules (20) with external air intake.
  • the cooling modules (20) are arranged internally, side-by-side with the back faces (12) of the data modules (10), wherein each data module (10) comprises:
  • one or more inlet passages (36) arranged on its back face (12), configured so as to enable the external airflow (4) to pass through to the cooling modules (20);
  • FIG. 5 shows a fourth example of how to build the modular data processing centre (1) of the present invention, which corresponds to a DPC such as the one in figures 4A and 4B, equipped with a modular roof (40).
  • the modular data processing centre (1) comprises a modular double sloping gable roof (40), configured so as to be coupled to the top face (15) of a data module (10).
  • the modular roof (40) in turn comprises an air chamber (41), configured to receive the extraction airflow (5) through the outlet passage (37) and redirect it towards an extraction passage (42) connected to the external space. Air is supplied beneath a raised floor.
  • FIGS 6A and 6B show a fifth example of how to build the modular data processing centre (1) of the present invention, with two data modules (10) arranged horizontally (H) and four external cooling modules (20) with external air intake.
  • the cooling modules (20) are arranged externally, side-by-side with the back faces (12) of the data modules (10), where each data module (10) comprises:
  • FIGS 7A and 7B show a sixth example of how to build the modular data processing centre (1) of the present invention, with two data modules (10) arranged horizontally (H) and four external cooling modules (20) with external air intake, arranged on the top face (15) of the data modules (10), illustrated with a dashed line.
  • the cooling modules (20) are arranged externally on the top face (15) of a data module (10), where said data module (10) comprises:
  • top return passages (43) arranged on its top face (15), configured so as to enable the return airflow (2) to return to the cooling modules (20);
  • the cooling module (20) is configured in order to carry out indirect cooling, whilst still directly receiving an external airflow (4) coming from the space external to the data processing centre (1). This is achieved by separating the recirculation chamber (22), in order to prevent cross contamination of the air between the return airflow (2) and the external airflow (4), in turn using a chilling unit (24) that comprises a passive air-air exchanger.
  • Figure 8 is a cross-section of two data modules (10) that are side-by-side.
  • the modular data processing centre (1) comprises insulation panels (31) to cover the inside of the enclosures (10A).
  • the bottom face (14) in turn comprises a first coupling element (16), positioned on each one of its bottom corners (17), configured so as to set one data module (10) on top of another data module (10) or on the foundation itself.
  • the top face (15) comprises a second coupling element (18) positioned on each one of its top corners (19), which may be coupled to the first coupling element (16).
  • the modular data processing centre (1) comprises a fastening anchor (32) for fastening to the ground, only one of which has been represented for illustrative purposes, with a third coupling element (33), which may be coupled to the second coupling element (18).
  • Figures 9 and 10 show the coupling and fastening elements of the modular data processing centre (1) in greater detail.
  • FIGS 11 and 12 show other components intended to improve the structural stability and ensure the air-tightness of the modular data processing centre (1).
  • the DPC comprises:
  • connecting bolts (34) configured so as to reinforce the fastening between data modules (10) arranged vertically (V), for example connecting the top face (15) of one module with the bottom face (14) of the module (10) above it; and connecting coverings (35), figure 8, configured so as to ensure air-tightness between data modules (10) arranged horizontally (H).

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

A modular data processing centre comprising a plurality of portable data modules (10) that define an inner space (I), intended to house one or more electronic information processing systems mounted in racks or in special cabinets (100), each one being made up of a front face (11), a back face (12) and two lateral faces (13), delimited by a bottom support face (14) and by a top face (15). Said data modules (10) are configured to enable a horizontal arrangement (H), wherein said centre (1) comprises a plurality of cooling modules (20), each one of which is delimited laterally by at least one lateral joining face (21), arranged adjacently to one another by their lateral joining faces (21) and being configured to enable a vertical arrangement (V) wherein said data modules (10) are arranged stacked one on top of the other by one of their top faces (15).

Description

MODULAR DATA PROCESSING CENTRE
DESCRIPTION
Field of the invention
The present invention relates to a modular data processing centre, which enables the modular implementation of one of its basic operating infrastructure, specifically the air conditioning system of the inner space of the DPC. This enables a horizontal, vertical or combined arrangement of the portable data modules that define the inner space intended to house one or more electronic information processing systems mounted in racks and/or in special cabinets. This proves particularly useful for application in a wide variety of building solutions.
Background of the invention
Data processing centres (DPCs) are made up of large rooms or buildings, inside of which a great number of pieces of electronic equipment are concentrated, for the purpose of processing the information of a given company or organisation.
The rising demand for new DPCs or increasingly more often, for expanding those already in place, has led to the creation of so-called modular data processing centres. They aim to make the same easier to build, speeding up their implementation and optimising the available space as much as possible. At present, there are several known modularly built DPCs.
Document US2012/0300372A1 shows a modular data processing centre, comprising a plurality of portable data modules that define the inner space thereof. Each one of them is made up of a front face, a back face and two lateral faces, delimited by a bottom module support face and a top face. Said document distinguishes between three types of data module, namely interior, facility-side-end and power-side-end. They are all arranged side-by-side, arranged horizontally by at least one of their lateral faces. In turn, the air conditioning system of the inner space of this DPC requires an inner distribution of hot aisles and cold aisles. The former collect the hot air between two rows of racks and/or special cabinets with electronic equipment, such that the heat given off by the latter generates a return airflow that is gathered by a plurality of chilling units arranged on the top face of the data modules. Said units chill the return air and push it towards the cold aisles. In addition, the DPC comprises a power module, annexed to one of the data modules, inside of which the electrical supply and distribution systems are concentrated, as well as additional cooling units, and humidifiers.
This type of modular data processing centre presents certain drawbacks. To begin with, the implementation of the data modules is restricted to a horizontal arrangement, given the presence of chilling units arranged on the ceiling or top face of said modules. It is therefore not possible to arrange the data modules vertically such that they are stacked on top of each other, thus limiting the possibilities of building upwards or expanding DPCs already in place, in turn making them more difficult to assemble. Furthermore, full modularity cannot be observed in the air conditioning system in the inner space of the DPC, since said system has an additional infrastructure to contain a portion thereof.
Document WO2012/138362A1 shows a modular data processing centre that attempts to resolve some of the abovementioned problems. Specifically, just as in the preceding case, said document shows a modular DPC, comprising a plurality of portable functional modules that define the inner space thereof. Each one of them is made up of a front face, a back face and two lateral faces, delimited by a bottom structural module support face and a top face. Said modules are arranged side-by-side and horizontally by at least one of their lateral faces and at the same time, are also stacked one on top of the other by their top faces, in a vertical arrangement forming levels at various heights. Each one of these levels serves a specific function. Thus, the modules at the bottom are intended for the electrical supply and distribution systems, the modules in the middle comprise the racks and/or special cabinets with the electronic equipment for information processing, and the modules at the top are intended for the air conditioning system of the inner space of the DPC.
Despite enabling the functional modules to be arranged horizontally and vertically, this type of modular data processing centre still presents significant drawbacks. Thus, vertical arrangement is still restricted as far as the data modules are concerned. As in the preceding case, the main cause of this restriction is the very air conditioning system of the inner space of the DPC, since in both cases, its implementation requires there to be free space on the ceiling or upper face of said data modules. Moreover, an upwards module distribution based on functional aspects not only makes assembly tasks more difficult but also links these modules to one another, such that it conditions and limits future expansions and remodelling.
The modular data processing centre of the present invention overcomes the problems set forth above, through a structural and functional configuration that enables the modular implementation of the air conditioning system of the inner space of the DPC, along with the data modules themselves. This facilitates the implementation and assembly of the DPC and optimises the available space. Moreover, it enables it to be applied in a wide variety of building solutions, wherein the data modules can be arranged both horizontally and vertically or in a combination thereof, which proves especially useful both in building new DPCs and expanding those already in place. Description of the invention
The modular data processing centre of the present invention comprises a plurality of portable data modules that define an inner space, intended to house one or more electronic information processing systems mounted in racks and/or in special cabinets, each one of said data modules being made up of a front face, a back face and two lateral faces, delimited by a bottom data module support face and by a top face, said data modules being configured to enable:
• a horizontal arrangement, wherein said data modules are arranged side-by-side, by one of their lateral faces.
Said modular data processing centre is characterised in that it comprises a plurality of cooling modules, each one of which is delimited laterally by at least one lateral joining face, arranged adjacently to one another by their lateral joining faces. Said data modules are configured to enable:
• a vertical arrangement, wherein said data modules are arranged one on top of the other by one of their top faces.
This modular integration between prefabricated cooling modules and data modules enables a wide variety of DPC building solutions, wherein the data modules may be arranged horizontally, vertically or both ways at the same time, creating large, unobstructed spaces in which to place racks and/or special cabinets, which is extremely versatile in both building new DPCs and expanding those already in place.
Likewise, each cooling module comprises:
· a recirculation chamber configured to receive a return airflow coming from the inner space of the data processing centre, through a return opening;
• a chilling unit configured to chill a supply airflow coming from the recirculation chamber; and
• one or more supply fans configured to enable the supply airflow to circulate through the chilling unit and push it towards the inner space (I) through a supply opening.
In order to enable direct free cooling (DFC) of the data processing centre, the recirculation chamber is configured so as to directly receive an external airflow coming from a space external to the data processing centre, through a duct-free intake opening.
The cooling module is compatible with the most common cooling systems, i.e. cooling water (CW) or direct expansion (DX). The chilling units are chosen between water chilling coils and gas chilling coils.
In accordance with a particular embodiment of the present invention, it is also possible to configure the cooling module to carry out indirect cooling, whilst still directly receiving an external airflow coming from a space external to the data processing centre. This is achieved by separating the recirculation chamber, in order to prevent cross contamination of the air between the return airflow and the external airflow, in turn using a chilling unit that comprises a passive air-air exchanger.
To optimise the inner space and in particular, the space intended for the racks and/or special cabinets with electrical equipment, the cooling modules are preferably assembled by their longitudinal sides and are arranged at one end of the data module, inside or outside the same, as shall be seen further on. To this end, the lateral joining faces of the cooling modules are parallel to the lateral faces of the data processing modules.
In accordance with a data module in a lateral boundary position, the front, back, bottom and top faces and one lateral face thereof, constitute enclosures, whereas the remaining lateral face of said data module constitutes a lateral extension opening.
In accordance with a data module in an intermediate position, the front, back, bottom and top faces thereof constitute enclosures, whereas the lateral faces of said data module constitute lateral extension openings.
In particular, in accordance with a data module in an end position, the back, bottom and top faces thereof constitute enclosures, whereas the lateral faces and the front face of said data module constitute lateral extension openings.
In order to provide sufficient thermal insulation, the data processing centre preferably comprises insulation panels to cover the inside of the enclosures. At the same time, in order to reinforce the rigidity of the data modules during the transportation thereof, the lateral faces may comprise structural reinforcement columns, which are meant to be removed whilst building the DPC.
In order to guarantee the correct positioning of the data modules, the bottom face preferably comprises a first coupling element positioned on each one of its bottom corners, configured to set one data module on top of another data module or on top of the foundation itself. Meanwhile, the top face comprises a second coupling element positioned on each one of its top corners, which may be coupled to the first coupling element. Likewise, the modular data processing centre comprises a fastening anchor, for fastening to the ground with a third coupling element, which may be coupled to the second coupling element. This provides structural stability, precision when placing the modules and suitable weight distribution, in terms of both the vertical distribution of modules and the way they are fastened to the ground.
The modular data processing centre of the present invention is complemented by other components intended to improve its structural stability and ensure that it is airtight. To this end, the DPC comprises:
• connecting bolts configured so as to reinforce the fastening between data modules arranged vertically, for example connecting the top face of one module to the bottom face of the module above it; and
· connecting coverings configured so as to ensure air-tightness between data modules arranged horizontally.
In accordance with internal building solutions, the cooling modules are arranged internally, side-by-side with the back faces of the data modules, wherein each data module comprises:
· one or more inlet passages arranged on its back face, configured so as to enable the external airflow to pass through to the cooling modules; and
• one or more outlet passages arranged on its top face, configured so as to enable the extraction airflow coming from the inner space to pass outward.
In addition, the modular data processing centre may comprise a modular slanted roof configured so as to be coupled to the top face of a data module. The modular roof in turn comprises an air chamber configured to receive the extraction airflow, through the outlet passage and to redirect it towards an extraction passage connected to the external space.
In accordance with external building solutions on the foundation, the cooling modules are arranged externally, side-by-side with the back faces of the data modules, wherein each data module comprises:
• one or more back return passages arranged on its back face, configured so as to enable the return airflow to return to the cooling modules; and
• one or more back supply passages arranged on its back face, configured so as to enable the supply airflow to be supplied to the inner space.
In accordance with external building solutions on the data modules, the cooling modules are arranged externally, on the top face of a data module, wherein said data module comprises:
• one or more top return passages arranged on its top face, configured so as to enable the return airflow to return to the cooling modules; and • one or more top supply passages arranged on its top face, configured so as to enable the supply airflow to be supplied to the inner space.
Brief description of the drawings
What follows is a very brief description of a series of drawings that aid in better understanding the invention, which are expressly related to various embodiments of said invention that, presented by way of non-limiting examples of the same.
Figure 1 is a perspective view of a data module of the present invention.
Figure 2A is a plan view in section along line B-B of figure 2B, which corresponds to a DPC with two data modules arranged horizontally and four inner cooling modules without external air intake.
Figure 2B is an elevation view in section along line A-A of figure 2A.
Figure 3A is a plan view in section along line D-D of figure 3B, which corresponds to a DPC with two data modules arranged vertically and four inner cooling modules without external air intake.
Figure 3B is an elevation view in section along line C-C of figure 3 A.
Figure 4A is a plan view in section along line F-F of figure 4B, which corresponds to a DPC with two data modules arranged horizontally and four external cooling modules with external air intake.
Figure 4B is an elevation view in section along line E-E of figure 4A.
Figure 5 is an elevation view in section along a line equivalent to line E-E of figure 4A, which corresponds to a DPC such as the one in figures 4A and 4B, equipped with a modular roof.
Figure 6A is a plan view in section along line H-H of figure 6B, which corresponds to a DPC with two data modules arranged horizontally and four external cooling modules with external air intake.
Figure 6B is an elevation view in section along line G-G of figure 6A.
Figure 7A is a plan view in section along line I-I of figure 7B, which corresponds to a DPC with two data modules arranged horizontally and four external cooling modules with external air intake, arranged upon the top face of the data modules.
Figure 7B is an elevation view in section along line J-J of figure 7A.
Figure 8 is a cross-section of two data modules that are side-by-side.
Figure 9 is a detailed view of point "X" of figure 8.
Figure 10 is a detailed view of point "Y" of figure 8.
Figure 11 is a schematic elevation view of two stacked data modules. Figure 12 is a detailed view of point "Z" of figure 10.
Detailed description of the invention
Figure 1 is a perspective view of a portable data module (10) of the present invention. As may be observed, each data module (10) defines an inner space (I) that is intended to house one or more electronic information processing systems mounted in racks and/or in special cabinets (100), each one of said data modules (10) being made up of a front face (11), a back face (12) and two lateral faces (13), delimited by a bottom data module (10) support face (14) and by a top face (15), said data modules (10) being configured to enable:
· a horizontal arrangement (H), figure 2 A, wherein said data modules (10) are arranged side-by-side, by one of their lateral faces (13).
The present example shows a data module (10) in a lateral boundary position, wherein the front (11), back (12), bottom (14) and top (15) faces and one lateral face (13) thereof constitute enclosures (10A), whereas the remaining lateral face (13) of said data module (10B) constitutes a lateral extension opening (10B).
Figures 2 A and 2B show a first example of how to build the modular data processing centre (1) of the present invention, with two data modules (10) arranged horizontally (H) and four inner cooling modules (20) without external air intake, operating in recirculation mode. As may be seen, each cooling module (20) is delimited laterally by at least one lateral joining face (21), all arranged adjacently to one another by their lateral joining faces (21).
Likewise, each cooling module (20) comprises:
• a recirculation chamber (22) configured to receive a return airflow (2) coming from the inner space (I) of the data processing centre (1), through a return opening (23);
• a chilling unit (24) configured to chill a supply airflow (3) coming from the recirculation chamber (22); and
• one or more supply fans (25) configured to enable the supply airflow (3) to circulate through the chilling unit (24) and push it towards the inner space (I) through a supply opening (26).
In order to enable direct free cooling (DFC) of the data processing centre, the recirculation chamber is configured so as to directly receive an external airflow (4) coming from a space external to the data processing centre (1), through a duct-free intake opening (27), figure 4B.
In order to optimise the inner space and in particular, the space intended for the racks and/or special cabinets (100) with electrical equipment, the cooling modules (20) are assembled by their longitudinal sides and are arranged at one end of the data module (10). To this end, the lateral joining faces (21) of the cooling modules (20) are parallel to the lateral faces (13) of the data processing modules (10).
Figures 3A and 3B show a second example of how to build the modular data processing centre (1) of the present invention, with two data modules (10) arranged vertically (V) and four internal cooling modules (20) without external air intake, operating in recirculation mode. As may be seen, the data modules (10) are arranged stacked one on top of the other by one of their top faces (15).
Figures 4A and 4B show a third example of how to build the modular data processing centre (1) of the present invention, with two data modules (10) arranged horizontally (H) and four external cooling modules (20) with external air intake. As may be seen, the cooling modules (20) are arranged internally, side-by-side with the back faces (12) of the data modules (10), wherein each data module (10) comprises:
· one or more inlet passages (36) arranged on its back face (12), configured so as to enable the external airflow (4) to pass through to the cooling modules (20); and
• one or more outlet passages (37) arranged on its top face (15), configured so as to enable the extraction airflow (5) coming from the inner space (I) to pass outward.
Figure 5 shows a fourth example of how to build the modular data processing centre (1) of the present invention, which corresponds to a DPC such as the one in figures 4A and 4B, equipped with a modular roof (40). As may be seen, the modular data processing centre (1) comprises a modular double sloping gable roof (40), configured so as to be coupled to the top face (15) of a data module (10). The modular roof (40) in turn comprises an air chamber (41), configured to receive the extraction airflow (5) through the outlet passage (37) and redirect it towards an extraction passage (42) connected to the external space. Air is supplied beneath a raised floor.
Figures 6A and 6B show a fifth example of how to build the modular data processing centre (1) of the present invention, with two data modules (10) arranged horizontally (H) and four external cooling modules (20) with external air intake. As may be seen, the cooling modules (20) are arranged externally, side-by-side with the back faces (12) of the data modules (10), where each data module (10) comprises:
• one or more back return passages (38) arranged on its back face (12), configured so as to enable the return airflow (2) to return to the cooling modules (20); and
• one or more back supply passages (39) arranged on its back face (12), configured so as to enable the supply airflow (3) to be pushed towards the inner space (I).
Figures 7A and 7B show a sixth example of how to build the modular data processing centre (1) of the present invention, with two data modules (10) arranged horizontally (H) and four external cooling modules (20) with external air intake, arranged on the top face (15) of the data modules (10), illustrated with a dashed line. As may be seen, the cooling modules (20) are arranged externally on the top face (15) of a data module (10), where said data module (10) comprises:
• one or more top return passages (43) arranged on its top face (15), configured so as to enable the return airflow (2) to return to the cooling modules (20); and
• one or more top supply passages (44) arranged on its top face (15), configured so as to enable the supply airflow (3) to be pushed toward the inner space (I). In this building example, the cooling module (20) is configured in order to carry out indirect cooling, whilst still directly receiving an external airflow (4) coming from the space external to the data processing centre (1). This is achieved by separating the recirculation chamber (22), in order to prevent cross contamination of the air between the return airflow (2) and the external airflow (4), in turn using a chilling unit (24) that comprises a passive air-air exchanger.
Figure 8 is a cross-section of two data modules (10) that are side-by-side. As may be seen, the modular data processing centre (1) comprises insulation panels (31) to cover the inside of the enclosures (10A). The bottom face (14) in turn comprises a first coupling element (16), positioned on each one of its bottom corners (17), configured so as to set one data module (10) on top of another data module (10) or on the foundation itself. Meanwhile, the top face (15) comprises a second coupling element (18) positioned on each one of its top corners (19), which may be coupled to the first coupling element (16). Likewise, the modular data processing centre (1) comprises a fastening anchor (32) for fastening to the ground, only one of which has been represented for illustrative purposes, with a third coupling element (33), which may be coupled to the second coupling element (18).
Figures 9 and 10 show the coupling and fastening elements of the modular data processing centre (1) in greater detail.
Figures 11 and 12 show other components intended to improve the structural stability and ensure the air-tightness of the modular data processing centre (1). To this the DPC comprises:
connecting bolts (34) configured so as to reinforce the fastening between data modules (10) arranged vertically (V), for example connecting the top face (15) of one module with the bottom face (14) of the module (10) above it; and connecting coverings (35), figure 8, configured so as to ensure air-tightness between data modules (10) arranged horizontally (H).

Claims

1. - A modular data processing centre, comprising a plurality of portable data modules (10) that define an inner space (I) intended to house one or more electronic information processing systems mounted in racks or in special cabinets (100), each one of said data modules (10) being made up of a front face (11), a back face (12) and two lateral faces (13), delimited by a bottom data module (10) support face (14) and by a top face (15), said data modules (10) being configured to enable:
• a horizontal arrangement (H), wherein said data modules (10) are arranged side- by-side, by at least one of their lateral faces (13);
said modular data processing centre (1) being characterised in that it comprises:
• a plurality of cooling modules (20) configured so as to cool the inner space (I), each one of which is delimited laterally by at least one lateral joining face (21), arranged adjacently to one another by their lateral joining faces (21);
and in that each data module (10) comprises:
• a first coupling element (16) positioned on its bottom face (14), configured so as to set one data module (10) on top of another data module (10) or on the foundation itself; and
• a second coupling element (18) positioned on its top face (15), which may be coupled to the first coupling element (16);
said data modules (10) thus being configured so as to enable:
• a vertical arrangement (V), wherein said data modules (10) are arranged one stacked on top of the other by one of their top faces (15).
2. - The modular data processing centre according to claim 1, characterised in that each cooling module (20) comprises:
• a recirculation chamber (22) configured to receive a return airflow (2) coming from the inner space (I) of the data processing centre (1), through a return opening (23);
• a chilling unit (24) configured to chill a supply airflow (3) coming from the recirculation chamber (22); and
• one or more supply fans (25) configured to enable the supply airflow (3) to circulate through the chilling unit (24) and push it towards the inner space (I) through a supply opening (26).
3. - The modular data processing centre according to claim 2, characterised in that the recirculation chamber is configured so as to directly receive an external airflow (4) coming from a space external to the data processing centre (1), through a duct-free intake opening (27).
4. - The modular data processing centre according to any of the claims 1 to 3, characterised in that the lateral joining faces (21) of the cooling modules (20) are parallel to the lateral faces (13) of the data processing modules (10).
5.- The modular data processing centre according to any of the claims 1 to 4, characterised in that the front (11), back (12), bottom (14) and top (15) faces and one lateral face (13) of a data module (10) constitute enclosures (10A), whereas the remaining lateral face (13) of said data module (10B) constitutes a lateral extension opening (10B).
6. - The modular data processing centre according to claim 5, characterised in that it comprises insulation panels (31) to cover the inside of the enclosures (10A).
7. - The modular data processing centre according to any of the claims 1 to 6, characterised in that the first coupling element (16) is positioned on each one of the bottom corners (17) of the bottom face (14) and in that the second coupling element (18) is positioned on each one of the top corners (19) of the top face (15).
8. - The modular data processing centre according to any of the claims 1 to 7, characterised in that it comprises a fastening anchor (32), for fastening to the ground with a third coupling element (33), which may be coupled to the second coupling element (18).
9. - The modular data processing centre according to any of the claims 1 to 8, characterised in that it comprises connecting bolts (34), configured so as to reinforce the fastening between data modules (10) arranged vertically (V).
10. - The modular data processing centre according to any of the claims 1 to 9, characterised in that it comprises connecting coverings (35), configured so as to ensure air-tightness between data modules (10) arranged horizontally (H).
11.- The modular data processing centre according to any of the claims 1 to 10, characterised in that it comprises a slanted modular roof (40) configured so as to be coupled to the top face (15) of a data module (10).
12.- The modular data processing centre according to any of the claims 3 to 1 1 , characterised in that the cooling modules (20) are arranged internally, side-by-side with the back faces (12) of the data modules (10) and in that each data module (10) comprises:
• one or more inlet passages (36) arranged on its back face (12), configured so as to enable the external airflow (4) to pass through to the cooling modules (20); and
• one or more outlet passages (37) arranged on its top face (15), configured so as to enable the extraction airflow (5) coming from the inner space (I) to pass outward.
13. - The modular data processing centre according to the claims 11 and 12, characterised in that the modular roof (40) comprises an air chamber (41) configured to receive the extraction airflow (5), through the outlet passage (37) and redirect it towards an extraction passage (42) connected to the external space.
14. - The modular data processing centre according to any of the claims 3 to 1 1 , characterised in that the cooling modules (20) are arranged externally, side-by-side with the back faces (12) of the data modules (10) and in that each data module (10) comprises:
· one or more back return passages (38) arranged on its back face (12), configured so as to enable the return airflow (2) to return to the cooling modules (20); and
• one or more back supply passages (39) arranged on its back face (12), configured so as to enable the supply airflow (3) to be pushed toward the inner space (I).
15. - The modular data processing centre according to any of the claims 3 to 10, characterised in that the cooling modules (20) are arranged externally, on the top face (15) of a data module (10) and in that said data module (10) comprises:
• one or more top return passages (43) arranged on its top face (15), configured so as to enable the return airflow (2) to return to the cooling modules (20); and • one or more top supply passages (44) arranged on its top face (15), configured so as to enable the supply airflow (3) to be pushed toward the inner space (I).
PCT/EP2014/061201 2013-05-31 2014-05-29 Modular data processing centre WO2014191532A1 (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106877192A (en) * 2017-04-21 2017-06-20 温州电力设计有限公司 A kind of integrated secondary device cabin
WO2017215905A3 (en) * 2016-06-14 2018-01-25 Ovh Transportable and stackable server racks
EP3500076A1 (en) * 2017-12-13 2019-06-19 Ovh Method for positioning a rack onto a base structure
WO2022263804A1 (en) * 2021-06-14 2022-12-22 Dataqube Global Ltd Modular data centre

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108391390A (en) * 2018-04-25 2018-08-10 广东闻扬环境科技有限公司 Mating control electric cabinet applied to MVR vapo(u)rization systems

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007139560A1 (en) * 2006-06-01 2007-12-06 Google, Inc. Modular computing environments
WO2009137215A2 (en) * 2008-05-05 2009-11-12 Carrier Corporation Integrated computer equipment container and cooling unit
US20100290197A1 (en) * 2009-05-15 2010-11-18 NxGen Modular, LLC Modular Data Center and Associated Methods
GB2474944A (en) * 2009-10-29 2011-05-04 Colt Technology Services Group Ltd A data centre comprising a hall of connected sections that house racks with common power and environmental control
US20110239679A1 (en) * 2010-04-06 2011-10-06 American Power Conversion Corporation Container based data center solutions
GB2480383A (en) * 2010-05-14 2011-11-16 Gen Electric Filter container
WO2012138362A1 (en) 2011-04-06 2012-10-11 Fmr Llc Modular data center

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090229194A1 (en) * 2008-03-11 2009-09-17 Advanced Shielding Technologies Europe S.I. Portable modular data center
EP2354378A1 (en) * 2010-02-01 2011-08-10 Dataxenter IP B.V. Modular datacenter element and modular datacenter cooling element
TW201224372A (en) * 2010-12-15 2012-06-16 Hon Hai Prec Ind Co Ltd Container data center cooling system

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007139560A1 (en) * 2006-06-01 2007-12-06 Google, Inc. Modular computing environments
WO2009137215A2 (en) * 2008-05-05 2009-11-12 Carrier Corporation Integrated computer equipment container and cooling unit
US20100290197A1 (en) * 2009-05-15 2010-11-18 NxGen Modular, LLC Modular Data Center and Associated Methods
US20120300372A1 (en) 2009-05-15 2012-11-29 NxGen Modular, LLC Modular Data Center and Associated Methods
GB2474944A (en) * 2009-10-29 2011-05-04 Colt Technology Services Group Ltd A data centre comprising a hall of connected sections that house racks with common power and environmental control
US20110239679A1 (en) * 2010-04-06 2011-10-06 American Power Conversion Corporation Container based data center solutions
GB2480383A (en) * 2010-05-14 2011-11-16 Gen Electric Filter container
WO2012138362A1 (en) 2011-04-06 2012-10-11 Fmr Llc Modular data center

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017215905A3 (en) * 2016-06-14 2018-01-25 Ovh Transportable and stackable server racks
CN109315076A (en) * 2016-06-14 2019-02-05 Ovh公司 It can transport and stackable server rack
US10219400B2 (en) 2016-06-14 2019-02-26 Ovh Transportable and stackable server racks
CN109315076B (en) * 2016-06-14 2020-11-24 Ovh公司 Transportable and stackable server rack
CN106877192A (en) * 2017-04-21 2017-06-20 温州电力设计有限公司 A kind of integrated secondary device cabin
EP3500076A1 (en) * 2017-12-13 2019-06-19 Ovh Method for positioning a rack onto a base structure
CN109907552A (en) * 2017-12-13 2019-06-21 Ovh公司 For shelf to be navigated to the method in base structure
US10765029B2 (en) 2017-12-13 2020-09-01 Ovh Method for positioning a rack onto a base structure
CN109907552B (en) * 2017-12-13 2021-12-03 Ovh公司 Method for positioning a shelf onto a base structure
WO2022263804A1 (en) * 2021-06-14 2022-12-22 Dataqube Global Ltd Modular data centre

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