WO2014189775A1 - Methods for processing a thin flexible glass substrate with a glass carrier - Google Patents
Methods for processing a thin flexible glass substrate with a glass carrier Download PDFInfo
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- WO2014189775A1 WO2014189775A1 PCT/US2014/038312 US2014038312W WO2014189775A1 WO 2014189775 A1 WO2014189775 A1 WO 2014189775A1 US 2014038312 W US2014038312 W US 2014038312W WO 2014189775 A1 WO2014189775 A1 WO 2014189775A1
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- WIPO (PCT)
- Prior art keywords
- glass
- thin flexible
- glass carrier
- ammonium fluoride
- carrier
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
Definitions
- the following description relates to methods for processing a thin flexible glass substrate with a glass carrier and, more particularly, to methods for processing a thin flexible glass substrate with a glass carrier having a textured surface.
- the means for forming the release area of the glass carrier may be to increase a surface roughness of the release area.
- glass carriers are subjected to wet chemical etching processes using an ammonium fluoride mixture as an etchant and are subsequently provided for the processing of thin flexible glass substrates.
- the process is suited to texture release areas of glass carriers used as rigid substrates to support thin flexible glass substrates during liquid crystal display (LCD) and organic light-emitting diode processing (OLED) for display devices including, but not limited to, cell phones, tablet computers, and televisions.
- a concentration of the ammonium fluoride mixture and a time of exposure to the ammonium fluoride mixture can be varied to produce glass carriers with release areas having varying degrees of texture.
- the ammonium fluoride mixture may be soluble, thereby enabling a hermetic sealing of a mount area of the glass carrier to a mount area of the thin flexible glass substrate.
- the ammonium fluoride mixture is generally safer and easier to use as an etchant than the commonly used hydrofluoric acid.
- a method for processing a thin flexible glass substrate with a glass carrier includes the steps of: (I) providing the glass carrier including a release area and a mount area; then (II) providing the release area of the glass carrier with a textured surface by contacting an etchant including an ammonium fluoride mixture to the release area for a period; then (III) removing the etchant from the glass carrier; and then (IV) bonding a mount area of the thin flexible glass substrate to the mount area of the glass carrier.
- the textured surface prevents a target area of the thin flexible glass substrate from bonding to the release area of the glass carrier.
- the period of step (II) is in a range of from about 1 minute to about 10 minutes.
- step (II) provides the textured surface with a root-mean-squared surface roughness in a range from about 3 nm to about 232 nm.
- step (II) provides the textured surface with a root-mean-squared surface roughness that is greater than about 2 nm and equal to or less than about 6 nm.
- the etchant of step (II) consists of the ammonium fluoride mixture, and the ammonium fluoride mixture consists of an ammonium fluoride solution in glacial acetic acid.
- a concentration of the ammonium fluoride solution is in a range from about 4 % to about 20 %.
- the ammonium fluoride solution of step (II) is about 40 % ammonium fluoride in water.
- the method further includes the step of applying a mask to the mount area of the glass carrier.
- the mask prevents the etchant from contacting the mount area of the glass carrier.
- the mask includes an adhesive film.
- step (II) includes printing the etchant on the release area of the glass carrier.
- step (II) includes screen-printing or stencil-printing the etchant on the release area of the glass carrier.
- step (II) applies the etchant as a gel etchant.
- the gel etchant consists of the ammonium fluoride mixture and a thickener, and the ammonium fluoride mixture consists of an ammonium fluoride solution in glacial acetic acid.
- a concentration of the ammonium fluoride solution is in a range from about 13 % to about 20 %.
- the ammonium fluoride solution is 40 % ammonium fluoride in water.
- step (III) includes rinsing the etchant from the glass carrier and then drying the glass carrier.
- the etchant consists of soluble chemicals.
- the method further includes the step (V) of removing the mount area of the thin flexible glass substrate from the target area of the thin flexible glass substrate to release the target area of the thin flexible glass substrate from the glass carrier.
- the method further includes the steps of: (V) providing the target area of the thin flexible glass substrate with functional features; and then (VI) removing the mount area of the thin flexible glass substrate from the target area of the thin flexible glass substrate to release the target area of the thin flexible glass substrate from the glass carrier.
- the first aspect may be provided alone or in combination with any one or more of the examples of the first aspect discussed above.
- FIG. 1 is a schematic top view illustrating an example of an article having a thin flexible glass substrate bonded to a glass carrier;
- FIG. 2 is a schematic end view illustrating an example of the article in FIG. 1;
- FIG. 3 is a flow diagram illustrating a first example of a first aspect of a method for processing a thin flexible glass substrate with a glass carrier;
- FIGS. 4-5 represents graphical diagrams illustrating examples of a surface texture profile of glass etched at two extremes of an etchant concentration and an exposure to the etchant using the first example of the first aspect of the method for processing a thin flexible glass substrate with a glass carrier;
- FIG. 6 is a flow diagram illustrating a second example of the first aspect of the method for processing a thin flexible glass substrate with a glass carrier
- FIG. 7 is a graphical diagram illustrating a surface texture resulting from the etching of a glass carrier in accordance with the second example of the first aspect of the method for processing a thin flexible glass substrate with a glass carrier;
- FIG. 8 is a flow diagram illustrating an example of a second aspect of the method for processing a thin flexible glass substrate with a glass carrier.
- FIG. 1 is a schematic top view illustrating an example of an article having a thin flexible glass substrate 20 bonded to a glass carrier 10.
- FIG. 2 is a schematic end view illustrating an example of the article in FIG. 1.
- the glass carrier 10 having a thickness 12 is bonded to the thin flexible glass substrate 20 so that the thin flexible glass substrate 20 can be utilized in existing device processing infrastructure.
- their combined thickness 24 is the same as a thicker sheet for which the device processing equipment was designed. For example, if the processing equipment was designed for a 700-micron sheet, and the thin flexible glass substrate 20 had a thickness 22 of 300 microns, then the thickness 12 would be selected as 400 microns.
- the glass carrier 10 and the thin flexible glass substrate 20 may be of any suitable composition including alumino-silicate, boro-silicate, alumino-boro-silicate, and soda-lime-silicate, and either alkali-containing or alkali-free, depending upon their ultimate application. Additionally, the glass carrier 10 may be made of one layer, as shown, or multiple layers (including multiple thin sheets) that are bonded together.
- the thin flexible glass substrate 20 is bonded to the glass carrier 10 by a mount area 40.
- the mount area 40 there is direct contact between the surface of the thin flexible glass substrate 20 and the surface of the glass carrier 10, wherein these surfaces have an average surface roughness Ra sufficiently low enough to allow glass to glass bonding, for example, Ra of ⁇ 2 nm.
- the release area 50 of the glass carrier 10 has a perimeter 52, outside of which the mount area 40 is disposed.
- the thin flexible glass substrate 20 may be bonded to the glass carrier 10 initially by van der Waals forces. Then, the bond strength may be increased in certain regions while retaining the ability to remove the thin flexible glass substrate 20 after processing the thin sheet/carrier article to form devices thereon. At least a portion of the thin flexible glass substrate 20 may be bonded to the glass carrier 10 such that device process fluids are prevented from entering between the thin flexible glass substrate 20 and the glass carrier 10, thereby reducing the chance that contamination may occur in downstream processes. In other words, the mount area 40 between the thin flexible glass substrate 20 and the glass carrier 10 may be hermetic. The glass carrier 10 and the thin flexible glass substrate 20 may be cleaned and have surfaces thereof prepared to facilitate bonding.
- the initial bond between the thin flexible glass substrate 20 and the glass carrier 10 may be strengthened at the mount area 40.
- Releasability of the thin flexible glass substrate 20 from the glass carrier 10 may be provided by the release area 50 of the glass carrier, thereby allowing desired parts 56, having perimeter 58, of the thin flexible glass substrate 20 to be extracted.
- FIG. 3 is a flow diagram illustrating a first example of a first aspect of a method (300) for processing a thin flexible glass substrate 20 with a glass carrier 10.
- a glass carrier 10 including the release area 50 and the mount area 40 may be provided (301).
- the release area 50 of the glass carrier 10 may be provided (302) with a textured surface by contacting an etchant including an ammonium fluoride mixture to the release area 50 for a period.
- the period during which the release area 50 is contacted by the etchant including the ammonium fluoride mixture may be in a range from about 1 minute to about 10 minutes.
- the textured surface may be provided with a root-mean-squared surface roughness (hereinafter referred to as "Rq”) in a range from about 4 nm to about 232 nm.
- Rq root-mean-squared surface roughness
- the etchant may consist of soluble chemicals.
- the etchant may consist of the ammonium fluoride mixture.
- the ammonium fluoride mixture may consist of an ammonium fluoride solution in glacial acetic acid.
- a concentration of the ammonium fluoride solution may be in a range from about 4 % to about 20 %.
- the ammonium fluoride solution may be about 40 % ammonium fluoride in water.
- a mask may be applied (305) to the mount area 40 of the glass carrier 10.
- the mask may prevent the etchant from contacting the mount area 40 of the glass carrier 10.
- the mask may include an adhesive film.
- the etchant may be removed (303) from the glass carrier 10.
- the removing (303) of the etchant may include a rinsing (306) of the etchant and then a subsequent drying (307) of the glass carrier 10.
- a mount area of the thin flexible glass substrate 20 may be bonded (304) to the mount area 40 of the glass carrier 10.
- the textured surface provided (302) to the release area 50 of the glass carrier 10 may prevent a target area of the thin flexible glass substrate 20 from bonding to the release area 50 of the glass carrier 10.
- the mount area of the thin flexible glass substrate 20 may be separated (308) from the target area 56 of the thin flexible glass substrate 20 to release the target area of the thin flexible glass substrate 20 from the glass carrier 10.
- the target area 56 of the thin flexible glass substrate 20 may be provided (309) with functional features.
- the removing (308) of the mount area of the thin flexible glass substrate 20 from the target area of the thin flexible glass substrate 20 may be performed to release the target area 56, having perimeter 58, of the thin flexible glass substrate 20 from the glass carrier 10.
- the method (300) of FIG. 3 may represent a wet chemical etching process for texturing glass that will enable a surface of a release area 50 of a glass carrier 10 to be textured.
- the texturing of the surface of the release area 50 may be performed to enable the glass carrier 10 to be used as a rigid substrate to support thin flexible glass substrates 20 during liquid crystal display (LCD) or organic light-emitting diode (OLED) processing for display devices including, but not limited to, cell phones, tablet computers, and televisions.
- LCD liquid crystal display
- OLED organic light-emitting diode
- the chemical etch of the wet chemical etching process of the method (300) of FIG. 3 may include exposing the glass carrier 10 to an etchant composed of a mixture of glacial acetic acid and a 40 % aqueous mixture of ammonium fluoride.
- the chemical etch may be applied selectively to the glass carrier 10 to generate one or more release areas 50 on one surface of the glass carrier 10, the release areas 50 being textured by the chemical etch.
- the texture of the release areas 50 is determined through the control of the composition, concentration, and temperature of the etchant and the duration of an exposure of the glass carrier 10 to the etchant.
- the exposure of the glass carrier 10 to the etchant may be via vertically dipping the glass carrier 10 into the etchant.
- a cleaned glass carrier 10 may be laminated on one side with an adhesive film.
- the adhesive film may have an opening on the glass carrier 10 that is equivalent to a desired size of a release area 50 to be patterned by the etchant.
- the glass carrier 10 may then dipped into a bath of the etchant for a period ranging from 1 to 10 minutes. After the glass carrier 10 is dipped into the etchant bath, the glass carrier 10 may be rinsed, for example, rinsed three times in three separate rinse tanks, and dried.
- the laminated adhesive film may then be removed, after which the glass carrier 10 may be washed with isopropyl alcohol and dried with an air knife.
- the glass carrier 10 may be various types of glass, including, but not limited to, Gorilla ® glass, Eagle XG ® glass, LotusTM glass, all of the foregoing glass codes available from Corning Incorporated, having headquarters in Corning NY, and soda-lime glass.
- the glass carrier 10 can be used to support various types of thin flexible glass substrates 20, including, but not limited to, glass having a thickness ⁇ 300 microns, for example, 300, 290, 280, 270, 260, 250, 240, 230, 220, 210, 200, 190, 180, 170, 160, 150, 140, 130, 120, 1 10, 100, 90, 80, 70, 60, 50, 40, 30, 20, 10 microns, for example, WillowTM glass, a glass code available from Corning Incorporated, with headquarters in Corning NY.
- FIGS. 4-5 includes graphical diagrams illustrating examples of a surface texture profile of Gorilla ® glass etched at two extremes of an etchant concentration and an exposure to the etchant using the first example of the method of processing the thin flexible glass substrate with the glass carrier.
- the graphical diagrams illustrate that 15 minutes of etch time for Gorilla ® glass in a 20 % NH 4 F concentration etch bath produce deeper, coarser features in the surface texture profile, whereas 30 seconds of etch time for Gorilla ® glass in a 4 % NH 4 F concentration etch bath produce shallower, finer features in the surface texture profile.
- the surface texture of a glass carrier 10 can be tuned by varying the etch bath concentration and varying the duration in which the glass carrier 10 is exposed to the etch bath concentration.
- Table 1 provided herebelow, summarizes the surface texture attributes of Gorilla ® glass generated by this process. Measurements were carried out using a Zygo NewViewTM 7300 optical profilometer. The microscope settings were a 20X lens with a 2X zoom. The low and high filter wavelengths were 0.5 ⁇ and 50 ⁇ , respectively. Roughness average Ra, root-mean-squared (RMS) roughness Rq, along with skewness (R sk) and kurtosis (R ku), constitute the fingerprint of a surface.
- Roughness average Ra, root-mean-squared (RMS) roughness Rq, along with skewness (R sk) and kurtosis (R ku) constitute the fingerprint of a surface.
- Ra is a mean height of the surface profile.
- Rq is more sensitive to peaks and valleys than Ra, because the amplitudes of Rq are squared.
- Rsk is the skewness of the height distribution of the surface features. If Rsk ⁇ 0, the surface can includes valleys. If Rsk > 0, the surface can be flat and have peaks. Values numerically greater or less than 1 may indicate extreme valleys or peaks on the surface.
- Rku is the kurtosis of the height distribution. Kurtosis is a measure of the randomness of heights, and of the sharpness of a surface. Surfaces with a kurtosis of 3 have a perfectly random surface. Surfaces having a kurtosis of less than or greater than 3 are less random and more repetitive as the kurtosis value becomes further removed from 3. Surfaces with spikes generally have higher kurtosis values, while bumpy surfaces generally have lower kurtosis values.
- a first etching of one of the above- referenced samples for 10 minutes using an NH 4 F mixture having 20 % NH 4 F solution in GAA produces a sample surface having a Rq of 232 nm, skewness of -0.5, and a kurtosis of 3. This indicates that, after the etching, the sample surface that is subject to the first etching is made of randomly spaced valleys.
- a second etching of one of the above-referenced samples for 10 minutes using an NH 4 F mixture having 4 % NH 4 F in GAA produces a sample surface having a Rq of 4 nm, a skewness of -0.3, and a kurtosis of 4. This indicates that, after the etching, while the sample surface subject to the second etching is still made of randomly spaced valleys, the second etching produces the randomly spaced valleys with lower amplitudes than produced by the first etching.
- FIG. 6 is a flow diagram illustrating a second example of the first aspect of the method (500) for processing the thin flexible glass substrate 20 with the glass carrier 10.
- a glass carrier 10 including the release area 50 and the mount area 40 may be provided (501).
- the release area 50 of the glass carrier 10 may be provided (502) with a textured surface by contacting an etchant including an ammonium fluoride mixture to the release area 50 for a period.
- the period during which the release area 50 is contacted by the etchant including the ammonium fluoride mixture may be in a range from about 1 minute to about 10 minutes.
- the textured surface may be provided with a Rq that is greater than about 2 nm and equal to or less than about 6 nm.
- the etchant may consist of soluble chemicals.
- the etchant may be printed on the release area 50 of the glass carrier 10.
- the printing of the etchant may include, but is not limited to, screen-printing or stencil printing the etchant on the release area 50 of the glass carrier 10.
- the etchant may be applied as a gel etchant.
- the gel etchant may consist of the ammonium fluoride mixture and a thickener.
- the ammonium fluoride mixture may consist of an ammonium fluoride solution in glacial acetic acid. A concentration of the ammonium fluoride solution may be in a range from about 13 % to about 20 %.
- the ammonium fluoride solution may be 40 % ammonium fluoride in water.
- the etchant may be removed (503) from the glass carrier 10.
- the removing (503) of the etchant may include a rinsing (505) of the etchant and then a subsequent drying (506) of the glass carrier 10.
- a mount area of the thin flexible glass substrate 20 may be bonded (504) to the mount area 40 of the glass carrier 10.
- the textured surface provided at (502) to the release area 50 of the glass carrier 10 may prevent a target area of the thin flexible glass substrate 20 from bonding to the release area 50 of the glass carrier 10.
- the mount area of the thin flexible glass substrate 20 may be removed (507) from the target area of the thin flexible glass substrate 20 to release the target area of the thin flexible glass substrate 20 from the glass carrier 10.
- the target area of the thin flexible glass substrate 20 may be provided (508) with functional features.
- the removing (507) of the mount area of the thin flexible glass substrate 20 from the target area of the thin flexible glass substrate 20 may be performed to release the target area of the thin flexible glass substrate 20 from the glass carrier 10.
- the method (500) of FIG. 6 may represent a wet chemical etching process for texturing glass that will enable a surface of a release area 50 of a glass carrier 10 to be textured.
- the texturing of the surface of the release area 50 may be performed to enable the glass carrier 10 to be used as a rigid substrate to support thin flexible glass substrates 20 during liquid crystal display (LCD) or organic light- emitting diode (OLED) processing for display devices including, but not limited to, cell phones, tablet computers, and televisions.
- LCD liquid crystal display
- OLED organic light- emitting diode
- the chemical etch of the wet chemical etching process of the method (500) of FIG. 6 may include exposing the glass carrier 10 to an etchant composed of a mixture of glacial acetic acid and a 40 % aqueous mixture of ammonium fluoride.
- the chemical etch may be applied selectively to the glass carrier 10 to generate one or more release areas 50 on one surface of the glass carrier 10, the release areas 50 being textured by the chemical etch.
- the texture of the release areas 50 is determined through the control of the composition, concentration, and temperature of the etchant and the duration of an exposure of the glass carrier 10 to the etchant.
- the exposure of the glass carrier 10 to the etchant may be via screen-printing or stencil-printing the etchant onto the glass carrier 10.
- the etchant may be selectively screen- printed or stencil-printed on the glass carrier 10 according to a desired size of a release area 50 to be patterned by the application of the etchant.
- Screen-printing or stencil-printing the etchant onto the glass carrier 10 may require the addition of a thickener resulting in a thixotropic gel that is compatible with the screen-printing or stencil-printing process.
- a thickener resulting in a thixotropic gel that is compatible with the screen-printing or stencil-printing process.
- water-soluble polymers may be added from the polyethylene oxide family available from Dow Wolff CellulosicsTM under the trade name PolyoxTM.
- the resultant gel etchant may remain on the glass carrier 10 for a period ranging from 1 to 10 minutes, after which the glass carrier 10 may be rinsed three times and dried.
- the glass carrier 10 may be various types of glass, including, but not limited to, Gorilla ® glass, Eagle XG ® glass, LotusTM glass, and soda-lime glass.
- the glass carrier 10 can be used to support various types of thin flexible glass substrates 20, including, but not limited to, WillowTM glass.
- PV stands for "peak-to-valley" and represents the distance between the highest peak and the lowest valley.
- FIG. 7 represents the texture parameters of the carrier surface resulting from the etching conditions described above.
- the patterned carriers were pre-bonded to 360 mm x 460 mm x 0.13 mm WillowTM glass and thermally bonded at 400 °C for 10 minutes.
- the bonded assembly of patterned Eagle XG ® glass carriers and WillowTM glass was then scored and broken.
- the area in which the mount area of the glass carriers and the WillowTM glass were bonded broke monolithically.
- the release area of the glass carriers and the corresponding areas of the WillowTM glass broke with clear separation of the glass carriers and the WillowTM glass.
- the method (500) provides a method of varying a Rq of a release area 50 of a glass carrier 10 over a wide range for bonding WillowTM glass to the glass carrier and subsequently enabling release of a portion of the WillowTM glass from the glass carrier, an example of a desired Rq is about 2 nm. While it is possible to produce a desired Rq through various combination of etching times and etchant concentrations, an example of a desired ammonium fluoride solution concentration is about 13 % and a desired etching time is about 3 minutes.
- FIG. 8 is a flow diagram illustrating an example of a second aspect of the method (700) for processing a thin flexible glass substrate 20 with a glass carrier 10.
- This method (700) is directed to roughening a glass surface using an etching cream, which contains a mixture of fluorine salts, insoluble salts, soluble salts, and mineral acid, and may be particularly useful when the glass to be roughened (either the flexible glass substrate 20 or the glass carrier 10) is a low ion soda lime glass, although it may be used on Eagle XG ® type glass as well.
- an etching cream which contains a mixture of fluorine salts, insoluble salts, soluble salts, and mineral acid, and may be particularly useful when the glass to be roughened (either the flexible glass substrate 20 or the glass carrier 10) is a low ion soda lime glass, although it may be used on Eagle XG ® type glass as well.
- the glass carrier 10 may be cleaned (701) to remove contaminations. Then, the glass carrier 10 may be placed (702) into an ultrasonic bath with deionized water for further cleaning. After drying (703), the glass carrier 10 may be laminated (704) with an anti-acid polyethylene to protect a mount area 40 of the glass carrier 10. Then, the glass carrier 10 may be immersed (705) in a diluted hydrofluoric acid and hydrochloric acid solution for a short period to remove a very thin surface layer of the glass carrier 10 and to clean and activate the surface. This period may be within a range of 5 seconds to 10 seconds.
- the glass carrier 10 is exposed (707) to etching cream between 30 and 120 seconds while being moved slightly up and down.
- the etching powder used for the etching cream may be composed of 10-40 wt% of KF as a fluorine source, 10-40 wt% of KCL or KNO 3 as an additional salt, 5-20 wt% of BaS0 4 as filler, 1-10 wt% of starch, and 1-10 wt% of polyacrylamide. This powder may be dissolved in 20-50 wt% of concentrated HCl acid or a mixture of HCl acid and acetic acid to form the etching cream.
- etching cream can be kept at ambient conditions for 12 hours prior to use with manual agitation every 2-4 hours to reach chemical equilibrium.
- the glass carrier 10 may be quickly rinsed (708), for example, in deionized water for 10 seconds. Afterwards, the lamination may be removed (709) and the glass carrier 10 may be thoroughly rinsed (710) to remove the remaining acid and etching cream on the surface.
- the Ra of the resulting release area 50 of the glass carrier 10 may be about 25 nm.
- the uniformity of the release area 50 may be controlled by the physical properties of the etching cream, which include, but are not limited to, viscosity, sedimentation, and insoluble particle size distribution. A certain range of viscosity and sedimentation time may be required to reach the desired texture uniformity of the release area 50. These parameters can be adjusted by adjusting the content of the salts of the etching powder, the mineral acid, and the water. Insoluble large particles may be preferably removed to reach the desired slurry viscosity and sedimentation time.
- the roughness of the release area 50 can be controlled by the concentration of the etching cream and the time for which the glass carrier 10 is exposed to the etching cream. Higher etching cream concentrations and longer etching cream processing times may lead to greater surface roughness. An increase in acid concentration or processing time also may lead to a rougher surface texture.
- etching chemistry described above in connection with this second aspect of the method (700) may also be used in connection with roughening low ion soda lime glass for silicon tandem photovoltaic cell applications.
- rough glass substrates can increase the light trapping and thus increase the conversion efficiency.
- an etching cream containing NH4HF2, NH4F, KC1, BaS0 4 , and HCl can be used.
- This etching cream may be particularly useful when Gorilla® Glass is used as either one of the substrate 20 or the glass carrier 10, and includes the surface to be roughened to provide the release area.
- the method (700) may include a second acid exposure (711) for 2 minutes containing 15 wt% of H2SO4 and 5 wt% HCl after the exposure (707) to the etching cream for the required amount of time.
- a third acid exposure (713) containing 24 wt% HF and 45.5 wt% HCl may be conducted for 90 seconds.
- an etching cream composed of 10-20 wt% of NH 4 F, 10-20 wt% of NH 4 HF 2 , 0-10 wt% of KNO 3 as additional salt, 5-20 wt% of BaS0 4 as filler. 1-10 wt% of soluble starch, and 0-5 wt% of polyacrylamide can be used.
- the solids mentioned above can be combined with 36-38 % concentrated HCl acid and prepared as stated above with respect to the etching cream being used for texturing the carrier glass 10.
- a method of applying the etching cream may include performing steps (701) - (710) as referenced above with respect to the etching cream being used for texturing the carrier glass 10.
- the Gorilla ® glass can be further polished by the second acid exposure (711) for a certain period, followed by the quick rinse (708).
- Texture uniformity may be normally satisfied for square shaped samples of the Gorilla ® glass after exposure to the above-referenced etching cream as a dip to achieve antiglare properties.
- a spray of etching cream instead of a dip may show better texture uniformity.
- the etching cream can be allowed to spray onto the Gorilla ® glass surface either manually or using a pump.
- the Gorilla ® glass may be put in a rack with 30 degree of tilt from a horizontal plane. The Gorilla ® glass can be sprayed homogeneously with the same flow rate.
- An anti-acid pump with a flow rate ranging from 20 L/min to 50 L/min may be used for spraying the etching cream onto the Gorilla ® glass surface having a size of 120 mm x 60 mm. Larger glass surfaces may require a spray having a higher flow rate. Any size or shape of the glass may be applicable either using the spray method or dipping method.
- the etching chemistry and processes described above in connection with this third aspect of the method (700) may also be used in connection with providing a roughened surface to a cover glass, for example Gorilla ® Glass, to provide an anti-glare surface or to achieve anti-glare properties. More particularly, reduction of the specular reflection is often a desired property for the cover glass of touch sensitive electronic devices, electronic ink readers, interactive whiteboards, and other portable LCD panels, especially when used in certain light conditions.
- a cover glass having such properties can be realized by creating textures on the surface. The surface texture reduces the reflection light through the random scattering of the reflected light and leads to a blurred reflective image, which is also referred to as anti-glare surface.
- These surface textures may be provided by the etching chemistry of this third aspect of the method (700).
- the etching cream formulation and process of this aspect can roughen the Gorilla® glass surface to achieve anti-glare properties.
- the textured surface properties like haze, gloss, distinctiveness of image (DOI), and roughness, can be regulated in a broad range by controlling the etching cream formulation and the process parameters, thereby providing a low cost, scratch resistant, and flexible method for obtaining anti-glare Gorilla® glass surface. This technique is particularly useful on Corning code 2317 and 2318 type glasses before ion exchanging into Gorilla ® Glass.
- the methods (300) and (500) may use soluble ingredients and the method (700) may use insoluble ingredients.
- the use of soluble ingredients in the methods (300) and (500) may avoid deposition of particulates that may be left by the use of insoluble ingredients in the method (700). These particulates, if not adequately rinsed off in steps (708), (710), and (712), may serve to interfere with bond formation between the thin flexible glass substrate 20 and the glass carrier 10 at the respective mount areas.
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SG11201509626YA SG11201509626YA (en) | 2013-05-22 | 2014-05-16 | Methods for processing a thin flexible glass substrate with a glass carrier |
KR1020157036110A KR20160012186A (en) | 2013-05-22 | 2014-05-16 | Methods for processing a thin flexible glass substrate with a glass carrier |
CN201480041042.8A CN105392747A (en) | 2013-05-22 | 2014-05-16 | Methods for processing a thin flexible glass substrate with a glass carrier |
JP2016514976A JP2016523796A (en) | 2013-05-22 | 2014-05-16 | Method for processing thin flexible glass substrate with glass carrier |
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JP (1) | JP2016523796A (en) |
KR (1) | KR20160012186A (en) |
CN (1) | CN105392747A (en) |
SG (1) | SG11201509626YA (en) |
TW (1) | TW201500306A (en) |
WO (1) | WO2014189775A1 (en) |
Cited By (6)
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WO2018144577A1 (en) * | 2017-01-31 | 2018-08-09 | Corning Incorporated | Methods for reducing glass sheet edge particles |
US10364180B2 (en) | 2015-01-06 | 2019-07-30 | Corning Incorporated | Apparatus and method for producing anti-glare surfaces |
WO2019173374A1 (en) * | 2018-03-07 | 2019-09-12 | Corning Incorporated | Textured glass surfaces for reduced electrostatic charging |
US10690818B2 (en) | 2014-10-31 | 2020-06-23 | Corning Incorporated | Anti-glare substrates with a uniform textured surface and low sparkle and methods of making the same |
EP3798694A4 (en) * | 2018-05-21 | 2022-03-23 | Agc Inc. | Antiglare transparent substrate and display device provided with same |
US11691909B2 (en) | 2016-11-30 | 2023-07-04 | Corning Incorporated | Textured glass for light extraction enhancement of OLED lighting |
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JP2015202997A (en) * | 2014-04-16 | 2015-11-16 | 旭硝子株式会社 | Substrate, substrate production system, peeling device, substrate production method and peeling method |
JP7024373B2 (en) * | 2017-12-18 | 2022-02-24 | Agc株式会社 | Glass substrate for display |
CN111499213B (en) * | 2019-01-31 | 2021-09-21 | 比亚迪股份有限公司 | Gradient glass and preparation method and application thereof |
CN115246711A (en) * | 2021-04-28 | 2022-10-28 | Oppo广东移动通信有限公司 | Glass shell for electronic equipment, preparation method of glass shell and electronic equipment |
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- 2014-05-16 SG SG11201509626YA patent/SG11201509626YA/en unknown
- 2014-05-16 KR KR1020157036110A patent/KR20160012186A/en not_active Application Discontinuation
- 2014-05-16 WO PCT/US2014/038312 patent/WO2014189775A1/en active Application Filing
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Publication number | Priority date | Publication date | Assignee | Title |
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US10690818B2 (en) | 2014-10-31 | 2020-06-23 | Corning Incorporated | Anti-glare substrates with a uniform textured surface and low sparkle and methods of making the same |
US10364180B2 (en) | 2015-01-06 | 2019-07-30 | Corning Incorporated | Apparatus and method for producing anti-glare surfaces |
US11691909B2 (en) | 2016-11-30 | 2023-07-04 | Corning Incorporated | Textured glass for light extraction enhancement of OLED lighting |
WO2018144577A1 (en) * | 2017-01-31 | 2018-08-09 | Corning Incorporated | Methods for reducing glass sheet edge particles |
WO2019173374A1 (en) * | 2018-03-07 | 2019-09-12 | Corning Incorporated | Textured glass surfaces for reduced electrostatic charging |
EP3798694A4 (en) * | 2018-05-21 | 2022-03-23 | Agc Inc. | Antiglare transparent substrate and display device provided with same |
US11940685B2 (en) | 2018-05-21 | 2024-03-26 | AGC Inc. | Antiglare transparent substrate and display device provided with same |
Also Published As
Publication number | Publication date |
---|---|
JP2016523796A (en) | 2016-08-12 |
KR20160012186A (en) | 2016-02-02 |
TW201500306A (en) | 2015-01-01 |
SG11201509626YA (en) | 2015-12-30 |
CN105392747A (en) | 2016-03-09 |
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