WO2014115646A1

WO2014115646A1 - Transparent resin film, transfer film, conductive film laminate, capacitive input device, and image display device

Info

Publication number: WO2014115646A1
Application number: PCT/JP2014/050762
Authority: WO
Inventors: 隆志有冨; 伊藤　英明
Original assignee: 富士フイルム株式会社
Priority date: 2013-01-25
Filing date: 2014-01-17
Publication date: 2014-07-31
Also published as: JP2014160460A

Abstract

This transparent resin film contains at least a silicone-based resin as a binder resin, and has a thickness of 5 μm or more. This transparent resin film is characterized by being used for the purpose of filling up the difference in level between a transparent front plate and a decorative layer in a capacitive input device that comprises the transparent front plate, the decorative layer that is arranged on a part of one surface of the front plate, and an electrode pattern that is arranged on the side of the one surface of the front plate.

Description

Transparent resin film, transfer film, conductive film laminate, capacitive input device, and image display device

The present invention relates to a transparent resin film, a transfer film, a conductive film laminate, a capacitive input device, and an image display device. More specifically, a transparent resin film used for filling a step between a decorative layer and a front plate of a capacitive input device capable of detecting a contact position of a finger as a change in capacitance, and including the transparent resin film The present invention relates to a transfer film, a conductive film laminate, a capacitive input device, and an image display device including the capacitive input device as a constituent element.

In recent years, electronic devices such as mobile phones, car navigation systems, personal computers, ticket vending machines, and bank terminals have been equipped with tablet-type input devices on the surface of liquid crystal devices and instructions displayed in the image display area of liquid crystal display devices. There is a type in which information corresponding to an instruction image can be input by touching a part where the instruction image is displayed with a finger or a touch pen while referring to the image.

Such input devices (touch panels) include a resistance film type and a capacitance type. However, the resistance film type input device has a drawback that it has a narrow operating temperature range and is susceptible to changes over time because it has a two-layer structure of film and glass that is shorted by pressing the film.

On the other hand, the capacitance-type input device has an advantage that a light-transmitting conductive film is simply formed on a single substrate. The capacitive touch panel of the cover glass integrated type (OGS: One Glass Solution) touch panel has a front plate integrated with the capacitive input device, and thus can be reduced in thickness and weight. In such a capacitive touch panel, the appearance of the device has been improved by covering the sense circuit with a decorative layer. There is no restriction | limiting in particular as a decoration layer, It is known that the decoration layer of various color tone (Black, white, pastel color, metallic etc.) can be provided.

However, when such a decorative layer is provided, a difference in film thickness between the decorative portion and the non-decorative portion occurs, and problems such as disconnection of the sensor of the obtained touch panel may occur (see Patent Document 1). ). On the other hand, in patent document 1, in order to make the level | step difference resulting from a decoration layer small with respect to an OGS touch panel, the method of producing a dent in the glass base material of the lower part of a decoration layer is described.

On the other hand, Patent Document 2 describes a touch panel member in which a transparent electrode layer is formed directly or indirectly on a transparent substrate, and a photosensitive siloxane resin layer is formed on the transparent electrode layer. A mode in which a conductive siloxane resin layer is used as an interlayer insulating film and / or a surface protective layer having a thickness of about 1.5 μm and a transparent electrode layer is embedded in the interlayer insulating film and / or the surface protective layer and planarized is described. ing. Further, it is described that the photosensitive siloxane resin layer can form an interlayer insulating film and / or a surface protective layer excellent in surface hardness and heat resistance. Patent Document 2 does not describe any use of such a photosensitive siloxane resin layer to fill a step caused by a decorative layer.

On the other hand, in the field of protection panels for flat panel displays, for example, Patent Document 3 describes a display protection plate made of a transparent protection plate and a transparent resin that fills the step between the printing portion and the printing portion as a method of filling the step. . In Patent Document 3, an acrylic resin is used as a transparent resin for filling the steps.

JP 2012-073726 A JP 2011-150550 A JP 2010-176111 A

Smartphones and tablet PCs equipped with a capacitive touch panel on a liquid crystal or organic EL display have been developed and announced using a tempered glass typified by Corning's gorilla glass on the front plate (the surface directly touched by a finger) Has been. The method described in Patent Document 1 for processing a concave mold with respect to a glass substrate under the decorative layer is difficult to use when such a tempered glass substrate is used, and other simpler methods. Was demanded.

As a result of investigations by the present inventors, an acrylic resin or a photosensitive siloxane resin is used for such a tempered glass substrate (hereinafter also referred to as “front plate”), transfer using a transfer film, liquid resist coating, screen printing, etc. It was found that when the decorative layer was formed by the method, a decorative layer having a tapered gentle slope at the end portion could be formed. Moreover, in order to improve the concealing power of the transparent electrode pattern provided on the decorative layer, it was found that it is necessary to provide a thickness of 5 μm or more depending on the color of the decorative layer.
Here, such a decorative layer on a part of the front plate, that is, a step having a gentle slope at the end and having a thickness of 5 μm or more (in other words, a step on one surface of the front plate) Even if it has an unevenness on one side of the front plate due to the decorative layer being arranged in part), the end of the decorative layer is tapered, so that Even if other members are laminated, it is expected that bubbles due to the step do not occur, and even if a transparent electrode pattern such as ITO is provided, the disconnection of the transparent electrode pattern due to the step does not occur. However, when the present inventors examined, contrary to said expectation, it has a decorative layer which has a taper-shaped gentle inclination in an end part, and has a thickness of 5 micrometers or more in part of a front board. Even though the edge of the decorative layer has a gentle slope, bubbles are formed when another member is laminated on the step (the side of the front plate where the decorative layer is formed). It has been found that there is a problem of disconnection of the transparent electrode pattern provided on the step.
Moreover, the method of embedding and transparentizing the transparent electrode layer described in Patent Document 2 in an interlayer insulating film and / or a surface protective layer of about 1.5 μm can be applied to a decorative layer having a thickness exceeding 5 μm. No assumption was made, and no disclosure or suggestion was made about filling a step having a thickness exceeding 5 μm.

Here, using the transparent resin described in Patent Document 3 in the field of flat panel display protection plates, the present inventors studied to fill a step caused by the decorative layer of the OGS touch panel. In the production, the transparent electrode pattern is heated in the process for producing the transparent electrode pattern. However, since the transparent resin using the acrylic binder described in Patent Document 3 is thermally yellowed by the heating in the above process, OGS It was found that it cannot be used to fill the steps of the touch panel. That is, it has been found that there is a problem in that the transparency of the transparent resin film used to fill the step caused by the decorative layer of the OGS touch panel is lowered.

The problem to be solved by the present invention is that a step between the front plate and the decorative layer of the capacitance type input device integrated with the front plate can be filled, and the transparency is high, and other members are provided on the decorative layer. An object of the present invention is to provide a transparent resin film that can suppress bubble entrapment (bubble mixing) when layers are stacked, and can suppress disconnection of an electrode pattern disposed on a decorative layer.

The present inventors reduced the step of the decorative layer without reducing transparency by using a transparent resin film containing a silicone-based resin to fill the step caused by the decorative layer of the OGS touch panel. The present inventors have found that a flat surface can be provided, air bubbles can be prevented from being mixed when an overcoat layer or the like is laminated, and steps can be smoothed to reduce the fear of disconnection of electrode patterns such as ITO.

The present invention, which is a specific means for solving the above problems, is as follows.
[1] A transparent resin film containing at least a silicone resin as a binder resin and having a thickness of 5 μm or more, and the transparent resin film is disposed on a transparent front plate and a part of one surface of the front plate A capacitive input device having a decorated layer and an electrode pattern disposed on one surface side of the front plate is used to fill a step between the front plate and the decorative layer, Transparent resin film.
[2] In the transparent resin film according to [1], the silicone resin is preferably a straight silicone resin.
[3] In the transparent resin film according to [2], the straight silicone resin is preferably a straight silicone resin containing in the molecule at least a siloxane structure represented by the following general formula (1).

In the general formula (1), R ¹ is independently a hydrogen atom, a halogen atom, a linear, branched or cyclic alkoxy group having 1 to 20 carbon atoms, a linear or branched structure having 1 to 20 carbon atoms. Or a cyclic alkyl group, a linear, branched or cyclic substituted alkyl group having 1 to 20 carbon atoms, a linear, branched or cyclic alkenyl group having 2 to 20 carbon atoms, and an aryl having 6 to 20 carbon atoms Represents a group or an aralkyl group having 7 to 20 carbon atoms.
[4] In the transparent resin film according to [2] or [3], the weight average molecular weight of the straight silicone resin is preferably 1,000 to 1,000,000.
[5] The transparent resin film according to any one of [1] to [4] preferably has a thickness of 10 μm or more.
[6] The transparent resin film according to any one of [1] to [5] is preferably manufactured using a transparent resist solution.
[7] A transfer film comprising a temporary support and the transparent resin film according to any one of [1] to [6].
[8] The transfer film according to [7] preferably has a thermoplastic resin layer between the temporary support and the transparent resin film.
[9] a transparent front plate;
A decorative layer disposed on a part of one surface of the front plate;
Having an electrode pattern disposed on one side of the front plate,
A conductive film laminate in which a step between the front plate and the decorative layer is filled with the transparent resin film according to any one of [1] to [6].
[10] a transparent front plate;
A decorative layer disposed on a part of one surface of the front plate;
Having an electrode pattern disposed on one side of the front plate,
A conductive film laminate in which a step between the front plate and the decorative layer is filled with the transparent resin film of the transfer film described in [7] or [8].
[11] In the conductive film laminate according to [9] or [10], the thickness of the decorative layer is preferably 5 μm or more.
[12] In the conductive film laminate according to any one of [9] to [11], the thickness of the transparent resin film is preferably 0.3 to 1.3 times the thickness of the decorative layer. .
[13] The conductive film laminate according to any one of [9] to [12] preferably includes a transparent protective layer on the transparent resin film, the decorative layer, and the electrode pattern.
[14] In the conductive film laminate according to any one of [9] to [13], the transparent resin film is heated to 180 to 300 ° C. in an environment of 0.08 to 1.2 atm. Is preferred.
[15] In the conductive film laminate according to any one of [9] to [14], the electrode pattern preferably includes the following (3) to (5).
(3) A plurality of first transparent electrode patterns formed by extending the plurality of pad portions in the first direction via the connection portions. (4) electrically insulated from the first transparent electrode pattern; A plurality of second electrode patterns comprising a plurality of pad portions extending in a direction intersecting with one direction (5) electrically insulating the first transparent electrode pattern and the second electrode pattern; Insulating layer [16] The conductive film laminate according to [15] is further (6) electrically connected to at least one of the first transparent electrode pattern and the second electrode pattern, and the first transparent electrode pattern It is preferable to have a conductive element different from the second electrode pattern.
[17] In the conductive film laminate according to [15] or [16], the second electrode pattern is preferably a transparent electrode pattern.
[18] In the conductive film laminate according to any one of [9] to [17], it is preferable that the end portion of the decorative layer has a tapered shape.
[19] A capacitance-type input device comprising the conductive film laminate according to any one of [9] to [18].
[20] An image display device comprising the capacitive input device according to [19] as a constituent element.

According to the present invention, it is possible to fill a step between the front plate and the decorative layer of the capacitance type input device integrated with the front plate, the transparency is high, and when another member is laminated on the decorative layer Can be suppressed, and a transparent resin film capable of suppressing disconnection of the electrode pattern disposed on the decorative layer can be provided.

It is sectional drawing which shows the structure of an example of the electrostatic capacitance type input device of this invention. It is explanatory drawing which shows an example of the front plate in this invention. It is explanatory drawing which shows an example of the 1st transparent electrode pattern in this invention, and a 2nd transparent electrode pattern. It is a top view which shows an example of the tempered glass in which the opening part was formed. It is a top view which shows an example of the front board in which the decoration layer was formed. It is a top view which shows an example of the front plate in which the 1st transparent electrode pattern was formed. It is a top view which shows an example of the front plate in which the 1st and 2nd transparent electrode pattern was formed. It is a top view which shows an example of the front plate in which the electroconductive element different from a black decorating layer and the 1st and 2nd transparent electrode pattern was formed. It is explanatory drawing which shows a metal nanowire cross section. It is the schematic which shows the shape after die-cutting of the transfer film used in order to form a decorating layer. It is explanatory drawing which shows the method of die-cutting the transfer film used in order to form a decorating layer. It is explanatory drawing which shows the die-cutting method of the transfer film used in order to form a decorating layer in the X-X 'cross section of a front plate. It is explanatory drawing which shows the die-cutting method of the transfer film used in order to form a decoration layer in the YY 'cross section of a front plate. It is sectional drawing which shows the structure of another example of the electrostatic capacitance type input device of this invention. It is sectional drawing which shows the structure of another example of the electrostatic capacitance type input device of this invention. It is sectional drawing which shows the structure of another example of the electrostatic capacitance type input device of this invention.

Hereinafter, the transparent resin film, transfer film, conductive film laminate, capacitance-type input device and image display device of the present invention will be described.
The description of the constituent elements described below may be made based on typical embodiments of the present invention, but the present invention is not limited to such embodiments. In this specification, “to” is used to mean that the numerical values described before and after it are included as a lower limit value and an upper limit value.

[Transparent resin film]
The transparent resin film of the present invention is a transparent resin film containing at least a silicone resin as a binder resin and having a thickness of 5 μm or more. The transparent resin film comprises a transparent front plate and one of the front plates. A step between the front plate and the decorative layer of a capacitive input device having a decorative layer arranged on a part of the surface and an electrode pattern arranged on one surface side of the front plate It is used for filling in.
With such a configuration, the step between the front plate and the decorative layer of the capacitive input device integrated with the front plate can be filled, and the transparency is high, and when another member is laminated on the decorative layer Air bubble uptake can be suppressed, and disconnection of the electrode pattern disposed on the decorative layer can be suppressed.

The transparent resin film of the present invention may be in a state where the fluidity is maintained, may be in a state where the fluidity is lost, or may be in a cured or fixed state.
The transparent resin film of the present invention comprises a transparent front plate, a decorative layer disposed on a part of one surface of the front plate, and an electrode pattern disposed on one surface side of the front plate. In the case where the capacitive input device is formed from a transparent resist solution for filling a step between the front plate and the decorative layer, the transparent resist solution in a state of maintaining fluidity is used as the transparent resist solution of the present invention. It can be said that it is a resin film, and what made the state which lost the fluidity | liquidity by drying a transparent resist solution can also be called the transparent resin film of this invention.
Moreover, when using the transparent resin film of this invention for the transfer film of this invention mentioned later, the coating liquid for transparent resin film formation of this invention is apply | coated on a temporary support etc. which are mentioned later, it dries, and a dry film and In this case, the transparent resin film in the transfer film of the present invention can also be referred to as the transparent resin film of the present invention.
Moreover, using the transparent resin film of the present invention, a transparent front plate, a decorative layer arranged on a part of one surface of the front plate, and one surface side of the front plate are arranged. In a capacitive input device having an electrode pattern, a transparent resin film cured by irradiation with actinic radiation after filling a step between the front plate and the decorative layer is also referred to as a transparent resin film of the present invention. it can.

(composition)
-Silicone resin-
A well-known thing can be used as said silicone resin used for the transparent resin film of this invention.
Silicone-based resins are partially modified with the following silane compounds, dehydrated and condensed with modified silicone resins with various properties and silane compounds having alkoxy groups or silanol groups, utilizing the inherent properties of silicone. Can be classified as straight silicone resin. In the transparent resin film and transfer film of the present invention, the silicone resin is preferably a modified silicone resin or a straight silicone resin, more preferably a straight silicone resin, and at least the following general formula ( A straight silicone resin containing a siloxane structure represented by 1) is particularly preferred.
Examples of the modified silicone resin include acrylic resin-modified silicone resin (KR-9706 manufactured by Shin-Etsu Chemical Co., Ltd.) obtained by polymerization of a monomer obtained by reacting an acrylic monomer such as acrylic acid with a silane compound or copolymerization with another acrylic monomer, polyester Polyester resin-modified silicone resin in which a silane compound is reacted with a hydroxyl group of the epoxy resin, an epoxy resin-modified silicone resin in which an epoxy-containing silane compound is reacted with an amino group residue of the resin, an alkyd resin in which an alkyd resin is modified with a reactive silane compound A modified silicone resin, a rubber silicone resin that directly forms a covalent bond with a resin using an oxime initiator, and the like can be used.

As the straight silicone resin, one containing at least a siloxane structure represented by the following general formula (1) in the molecule can be used.

In the general formula (1), R ¹ is independently a hydrogen atom, a halogen atom, a linear, branched or cyclic alkoxy group having 1 to 20 carbon atoms, a linear or branched structure having 1 to 20 carbon atoms. Or a cyclic alkyl group, a linear, branched or cyclic substituted alkyl group having 1 to 20 carbon atoms, a linear, branched or cyclic alkenyl group having 2 to 20 carbon atoms, and an aryl having 6 to 20 carbon atoms A group or an aralkyl group having 7 to 20 carbon atoms, and a plurality of R ¹ may be the same or different. That is, the straight silicone resin having a siloxane structure represented by the general formula (1) may be a condensate having the same siloxane structure or a co-condensate having a different combination.

Examples of the halogen atom represented by R ¹ include a fluorine atom and a chlorine atom.
Examples of the linear, branched or cyclic alkoxy group having 1 to 20 carbon atoms represented by R ¹ include, for example, methoxy group, ethoxy group, n-propoxy group, i-propoxy group, n-butoxy group, i-butoxy group. Group, sec-butoxy group, t-butoxy group, n-pentyloxy group, n-hexyloxy group, cyclopentyloxy group, cyclohexyloxy group and the like.
Examples of the linear, branched or cyclic alkyl group having 1 to 20 carbon atoms represented by R ¹ include a methyl group, an ethyl group, an n-propyl group, an i-propyl group, an n-butyl group, and an i-butyl group. Group, sec-butyl group, t-butyl group, n-pentyl group, n-hexyl group, cyclopentyl group, cyclohexyl group and the like. Among the linear, branched or cyclic alkyl groups having 1 to 20 carbon atoms represented by R ¹ , an alkyl group having 1 to 3 carbon atoms is preferable, and a methyl group is more preferable.
Examples of the linear, branched or cyclic substituted alkyl group having 1 to 20 carbon atoms represented by R ¹ include an arylalkyl group, a fluoroalkyl group, a chloroalkyl group, a hydroxyalkyl group, and a (meth) acryloxyalkyl group. Groups and mercaptoalkyl groups. Specific examples thereof include, for example, phenylmethyl (benzyl) group, diphenylmethyl group, 1-phenylethyl group, 2-phenylethyl group, 1-phenyl-n-propyl group, 2-phenyl-2-propyl (cumyl). ) Group, 3-phenyl-n-propyl group, 1-phenylbutyl group, 2-phenylbutyl group, 3-phenylbutyl group, 4-phenylbutyl group, 1-phenylpentyl group, 2-phenylpentyl group, 3- Phenylpentyl group, 4-phenylpentyl group, 5-phenylpentyl group, 1-phenylhexyl group, 2-phenylhexyl group, 3-phenylhexyl group, 4-phenylhexyl group, 5-phenylhexyl group, 6-phenylhexyl Group, 1-phenylcyclohexyl group, 2-phenylcyclohexyl group, 3-phenylcyclohexyl group 1-phenylheptyl group, 2-phenylheptyl group, 3-phenylheptyl group, 4-phenylheptyl group, 5-phenylheptyl group, 6-phenylheptyl group, 1-phenyloctyl group, 2-phenyloctyl group, 3 -Phenyloctyl group, 4-phenyloctyl group, 5-phenyloctyl group, 6-phenyloctyl group, 1-naphthylethyl group, 2-naphthylethyl group, 1-naphthyl-n-propyl group, 2-naphthyl-2- Propyl group, 3-naphthyl-n-propyl group, 1-naphthylbutyl group, 2-naphthylbutyl group, 3-naphthylbutyl group, 4-naphthylbutyl group, 1-naphthylpentyl group, 2-naphthylpentyl group, 3- Naphthylpentyl group, 4-naphthylpentyl group, 5-naphthylpentyl group, 1-naphthylhexyl group, 2-naphthyl Hexyl group, 3-naphthylhexyl group, 4-naphthylhexyl group, 5-naphthylhexyl group, 6-naphthylhexyl group, 1-naphthylcyclohexyl group, 2-naphthylcyclohexyl group, 3-naphthylcyclohexyl group, 1-naphthylheptyl group 2-naphthylheptyl group, 3-naphthylheptyl group, 4-naphthylheptyl group, 5-naphthylheptyl group, 6-naphthylheptyl group, 1-naphthyloctyl group, 2-naphthyloctyl group, 3-naphthyloctyl group, 4 -Arylalkyl groups such as naphthyloctyl group, 5-naphthyloctyl group, 6-naphthyloctyl group, etc .; fluoromethyl group, trifluoromethyl group, 2-fluoroethyl group, (trifluoromethyl) methyl group, pentafluoroethyl group , 3-fluoro-n-propyl group, 2- (Trifluoromethyl) ethyl group, (pentafluoroethyl) methyl group, heptafluoro-n-propyl group, 4-fluoro-n-butyl group, 3- (trifluoromethyl) -n-propyl group, 2- (pentafluoro Ethyl) ethyl group, (heptafluoro-n-propyl) methyl group, nonafluoro-n-butyl group, 5-fluoro-n-pentyl group, 4- (trifluoromethyl) -n-butyl group, 3- (pentafluoro Ethyl) -n-propyl group, 2- (heptafluoro-n-propyl) ethyl group, (nonafluoro-n-butyl) methyl group, perfluoro-n-pentyl group, 6-fluoro-n-hexyl group, 5- (Trifluoromethyl) -n-pentyl group, 4- (pentafluoroethyl) -n-butyl group, 3- (heptafluoro-n-propyl) -n -Propyl group, 2- (nonafluoro-n-butyl) ethyl group, (perfluoro-n-pentyl) methyl group, perfluoro-n-hexyl group, 7- (trifluoromethyl) -n-heptyl group, 6- (Pentafluoroethyl) -n-hexyl group, 5- (heptafluoro-n-propyl) -n-pentyl group, 4- (nonafluoro-n-butyl) -n-butyl group, 3- (perfluoro-n- Pentyl) -n-propyl group, 2- (perfluoro-n-hexyl) ethyl group, (perfluoro-n-heptyl) methyl group, perfluoro-n-octyl group, 9- (trifluoromethyl) -n- Nonyl group, 8- (pentafluoroethyl) -n-octyl group, 7- (heptafluoro-n-propyl) -n-heptyl group, 6- (nonafluoro-n-butyl) -n-he Sil group, 5- (perfluoro-n-pentyl) -n-pentyl group, 4- (perfluoro-n-hexyl) -n-butyl group, 3- (perfluoro-n-heptyl) -n-propyl group Fluoroalkyl groups such as 2- (perfluoro-n-octyl) ethyl group, (perfluoro-n-nonyl) methyl group, perfluoro-n-decyl group, 4-fluorocyclopentyl group, 4-fluorocyclohexyl group; Chloromethyl group, 2-chloroethyl group, 3-chloro-n-propyl group, 4-chloro-n-butyl group, 3-chlorocyclopentyl group, 4-chlorocyclohexyl group, hydroxymethyl group, 2-hydroxyethyl group, 3-hydroxycyclopentyl group, 4-hydroxycyclohexyl group, 3- (meth) acryloxypropyl group, 3-mercap It can be mentioned propyl group.
Examples of the linear, branched or cyclic alkenyl group having 2 to 20 carbon atoms represented by R ¹ include, for example, vinyl group, 1-methylvinyl group, 1-propenyl group, allyl group (2-propenyl group). 2-methyl-2-propenyl group, 1-butenyl group, 2-butenyl group, 3-butenyl group, 3-cyclopentenyl group, 3-cyclohexenyl group and the like. Of the linear, branched or cyclic substituted alkyl groups having 1 to 20 carbon atoms represented by R ¹ , arylalkyl groups are preferred, and cumyl groups are more preferred.
Examples of the aryl group having 6 to 20 carbon atoms represented by R ¹ include a phenyl group, o-tolyl group, m-tolyl group, p-tolyl group, 2,3-xylyl group, and 2,4-xylyl group. 2,5-xylyl group, 2,6-xylyl group, 3,4-xylyl group, 3,5-xylyl group, 1-naphthyl group and the like. Among the aryl groups having 6 to 20 carbon atoms represented by R ¹ , other than unsubstituted phenyl groups, that is, o-tolyl group, m-tolyl group, p-tolyl group, , 3-xylyl, 2,4-xylyl, 2,5-xylyl, 2,6-xylyl, 3,4-xylyl, 3,5-xylyl, 1-naphthyl, A tolyl group, m-tolyl group, and p-tolyl group are more preferred.
Examples of the aralkyl group having 7 to 20 carbon atoms represented by R ¹ include a benzyl group and a phenethyl group.

In the general formula (1), R ¹ is independently a hydrogen atom, a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms, a linear, branched or cyclic group having 1 to 6 carbon atoms. Are preferably substituted alkyl groups or aryl groups having 6 to 9 carbon atoms, and more preferably represent a hydrogen atom, a methyl group, a phenyl group or a tolyl group.
The siloxane structure represented by the general formula (1) preferably contains a methyl group as R ¹ from the viewpoint of particularly enhancing the L value of the decorative layer.

The straight silicone resin has two or more general formulas (1) wherein R ¹ are different from each other.
It is also preferable that it is a copolymer of the siloxane structure represented by these. In this case, the siloxane structure represented by the general formula (1) in which R ¹ is an alkyl group and the siloxane structure represented by the general formula (1) in which R ¹ is a hydrogen atom, a substituted alkyl group, or an aryl group. And a copolymer thereof. The copolymerization ratio is not particularly limited, but the siloxane structure represented by the general formula (1) in which R ¹ is an alkyl group is 50 to 50% of all the siloxane structures represented by the general formula (1). The amount is preferably 100 mol%, more preferably 60 to 100 mol%, and particularly preferably 70 to 100 mol%.

The straight silicone resin used in the present invention has a siloxane structure comprising a co-condensation with a siloxane structure represented by the following general formula (2) in addition to the siloxane structure represented by the general formula (1) in the molecule. The thing containing this can also be used preferably.

In general formula (2), R ² has the same meaning as that used for R ^{1 in} general formula (1), and the preferred range is also the same as R ¹ .

Specific examples of straight silicone resins include alkyl straight silicones prepared from the condensation of silane compounds having an alkyl group having 1 to 20 carbon atoms and an alkoxy group (methyl straight silicones, etc.), alkyl-aryls such as methylphenyl, etc. Straight silicone, aryl straight silicone such as phenyl, and hydrogen straight silicone such as methyl hydrogen can be used.
More preferred are methyl-based straight silicone resins, methyl-tolyl-based straight silicone resins, methyl-phenyl-based straight silicone resins, acrylic resin-modified silicone resins, methyl-hydrogen-based straight silicone resins, and hydrogen-hydrogen-based straight silicone resins. From the viewpoint of preventing the decrease in lightness without generating benzene, methyl straight silicone resin, methyl tolyl straight silicone resin, methyl hydrogen straight silicone resin, and hydrogen tol straight silicone resin are particularly preferable.
These silicone resins may be used alone or in combination of two or more, and the film physical properties can be controlled by mixing them at an arbitrary ratio.

The weight average molecular weight of the straight silicone resin is preferably 1000 to 1000000, more preferably 2000 to 800000, and particularly preferably 2500 to 500000. When the molecular weight is 1000 or more, the film forming property is good.

The weight average molecular weight in this specification can be measured, for example, by gel permeation chromatography (GPC). Specifically, it can be measured under the following conditions.
Column: GPC column TSKgel Super HZM-H (manufactured by Tosoh Corporation)
・ Solvent: Tetrahydrofuran ・ Standard: Monodisperse polystyrene

As a silane compound used to prepare a modified silicone resin and a straight silicone resin,
Tetramethoxysilane, tetraethoxysilane, tetra n-propoxysilane, tetraisopropoxysilane, tetra n-butoxysilane, tetraisobutoxysilane, methyltrimethoxysilane, methyltriethoxysilane, methyltriacetoxysilane, methyltributoxysilane, Ethyltrimethoxysilane, ethyltriethoxysilane, isobutyltrimethoxysilane, propyltrimethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltrimethoxyethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, phenyltriacetoxysilane , Cumyltrimethoxysilane, tolyltrimethoxysilane, 3,3,3-trifluoropropyltrimethoxysilane, γ-methacryloxypropi Trimethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropyltriethoxysilane, N-β (aminoethyl) -γ-aminopropyltrimethoxy Silane, N-β (aminoethyl) -γ-aminopropyltriethoxysilane, β-cyanoethyltriethoxysilane, methyltriphenoxysilane, glycidoxymethyltrimethoxysilane, glycidoxymethyltriethoxysilane, α-glycid Xylethyltrimethoxysilane, α-glycidoxyethyltriethoxysilane, β-glycidoxyethyltrimethoxysilane, β-glycidoxyethyltriethoxysilane, α-glycidoxypropyltrimethoxysilane, α-glycidoxypro Pyrtriethoxysilane, β-glycidoxypropyltrimethoxysilane, β-glycidoxypropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-glycidoxy Propyltripropoxysilane, γ-glycidoxypropyltributoxysilane, γ-glycidoxypropyltrimethoxyethoxysilane, γ-glycidoxypropyltriphenoxysilane, α-glycidoxybutyltrimethoxysilane, α-glycid Xylbutyltriethoxysilane, β-glycidoxybutyltrimethoxysilane, β-glycidoxybutyltriethoxysilane, γ-glycidoxybutyltrimethoxysilane, γ-glycidoxybutyltriethoxysilane, δ-glycid Xibutyltrimethoxy , Δ-glycidoxybutyltriethoxysilane, (3,4-epoxycyclohexyl) methyltrimethoxysilane, (3,4-epoxycyclohexyl) methyltriethoxysilane, β- (3,4-epoxycyclohexyl) ethyltri Methoxysilane, β- (3,4-epoxycyclohexyl) ethyltriethoxysilane, β- (3,4-epoxycyclohexyl) ethyltripropoxysilane, β- (3,4-epoxycyclohexyl) ethyltributoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltriphenoxysilane, γ- (3,4-epoxycyclohexyl) propyltrimethoxysilane, γ- (3,4 Epoxycyclohexyl) propyltri Trialkoxy such as toxisilane, δ- (3,4-epoxycyclohexyl) butyltriethoxysilane, triacyloxy or triphenoxysilane, phenylmethyldimethoxysilane, phenylmethyldiethoxysilane, dimethyldiacetoxysilane, γ-methacryloxypropyl Methyldimethoxysilane, γ-methacryloxypropylmethyldiethoxysilane, γ-mercaptopropylmethyldimethyldimethoxysilane, γ-mercaptopropyldiethoxysilane, γ-aminopropylmethyldimethoxysilane, γ-aminopropylmethyldiethoxysilane, vinylmethyl Dimethoxysilane, vinylmethyldiethoxysilane, glycidoxymethyldimethoxysilane, glycidoxymethyldiethoxysilane, α-glycidoxyethyl ester Rudimethoxysilane, α-glycidoxyethyldiethoxysilane, β-glycidoxyethylmethyldimethoxysilane, β-glycidoxyethylmethyldiethoxysilane, α-glycidoxypropylmethyldimethoxysilane, α-glycidoxy Propylmethyldiethoxysilane, β-glycidoxypropylmethyldimethoxysilane, β-glycidoxypropylmethyldiethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, γ- Glycidoxypropylmethyldipropoxysilane, γ-glycidoxypropylmethyldibutoxysilane, γ-glycidoxypropylmethyldimethoxyethoxysilane, γ-glycidoxypropylmethyldiphenoxysilane, γ-glycidoxypropylethyl Methoxysilane, γ-glycidoxypropylethyldiethoxysilane, γ-glycidoxypropylethyldipropoxysilane, γ-glycidoxypropylvinyldimethoxysilane, γ-glycidoxypropylvinyldiethoxysilane, γ-glycid Alkoxysilanes or diacyloxysilanes such as xylpropylphenyldimethoxysilane, γ-glycidoxypropylphenyldiethoxysilane, dimethoxymethylsilane, trimethoxysilane, dimethylethoxysilane, diacetoxymethylsilane, diethoxymethylsilane, diethylmethyl Silane, triethylsilane, butyldimethylsilane, dimethylphenylsilane, methylphenylvinylsilane, diphenylmethylsilane, tripropylsilane, tripentyloxysilane, Nylsilane, trihexylsilane, diethylsilane, allyldimethylsilane, methylphenylsilane, diphenylsilane, phenylsilane, octylsilane, 1,4-bis (dimethylsilyl) benzene, and 1,1,3,3-tetramethyldisiloxane , Dimethyltolylsilane, methyltolylvinylsilane, ditolylmethylsilane, tolylylsilane, dimethylbenzylsilane, methylbenzylvinylsilane, dibenzylmethylsilane, tribenzylsilane, diphenylsilane, 2-chloroethylsilane, bis [(p-dimethyl Silyl) phenyl] ether, 1,4-dimethyldisilylethane, 1,3,5-tris (dimethylsilyl) benzene, 1,3,5-trimethyl-1,3,5-trisilane, poly (methylsilylene) phenylene ,as well as Poly (methylsilylene) methylene, tetrachlorosilane, trichlorosilane, triethoxysilane, tri-n-propoxysilane, tri-i-propoxysilane, tri-n-butoxysilane, tri-sec-butoxysilane, fluorotrichlorosilane, fluoro Trimethoxysilane, fluorotriethoxysilane, fluorotri-n-propoxysilane, fluorotri-i-propoxysilane, fluorotri-n-butoxysilane, fluorotri-sec-butoxysilane, methyltrichlorosilane, methyltri-n-propoxy Silane, methyltri-i-propoxysilane, methyltri-n-butoxysilane, methyltri-sec-butoxysilane, 2- (trifluoromethyl) ethyltrichlorosilane, 2- (trifluoromethyl) Tiltrimethoxysilane, 2- (trifluoromethyl) ethyltriethoxysilane, 2- (trifluoromethyl) ethyltri-n-propoxysilane, 2- (trifluoromethyl) ethyltri-i-propoxysilane, 2- (trifluoro Methyl) ethyltri-n-butoxysilane, 2- (trifluoromethyl) ethyltri-sec-butoxysilane, 2- (perfluoro-n-hexyl) ethyltrichlorosilane, 2- (perfluoro-n-hexyl) ethyltrimethoxy Silane, 2- (perfluoro-n-hexyl) ethyltriethoxysilane, 2- (perfluoro-n-hexyl) ethyltri-n-propoxysilane, 2- (perfluoro-n-hexyl) ethyltri-i-propoxysilane , 2- (Perfluoro-n-hexyl) Tiltly-n-butoxysilane, 2- (perfluoro-n-hexyl) ethyltri-sec-butoxysilane, 2- (perfluoro-n-octyl) ethyltrichlorosilane, 2- (perfluoro-n-octyl) ethyltri Methoxysilane, 2- (perfluoro-n-octyl) ethyltriethoxysilane, 2- (perfluoro-n-octyl) ethyltri-n-propoxysilane, 2- (perfluoro-n-octyl) ethyltri-i-propoxy Silane, 2- (perfluoro-n-octyl) ethyltri-n-butoxysilane, 2- (perfluoro-n-octyl) ethyltri-sec-butoxysilane, hydroxymethyltrichlorosilane, hydroxymethyltrimethoxysilane, hydroxyethyltri Methoxysilane, hydroxy Methyltri-n-propoxysilane, hydroxymethyltri-i-propoxysilane, hydroxymethyltri-n-butoxysilane, hydroxymethyltri-sec-butoxysilane, 3- (meth) acryloxypropyltrichlorosilane, 3- (meth) Acryloxypropyltrimethoxysilane, 3- (meth) acryloxypropyltriethoxysilane, 3- (meth) acryloxypropyltri-n-propoxysilane, 3- (meth) acryloxypropyltri-i-propoxysilane, 3 -(Meth) acryloxypropyltri-n-butoxysilane, 3- (meth) acryloxypropyltri-sec-butoxysilane, 3-mercaptopropyltrichlorosilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropylto Ethoxysilane, 3-mercaptopropyltri-n-propoxysilane, 3-mercaptopropyltri-i-propoxysilane, 3-mercaptopropyltri-n-butoxysilane, 3-mercaptopropyltri-sec-butoxysilane, vinyltrichlorosilane Vinyltri-n-propoxysilane, vinyltri-i-propoxysilane, vinyltri-n-butoxysilane, vinyltri-sec-butoxysilane, allyltrichlorosilane, allyltrimethoxysilane, allyltriethoxysilane, allyltri-n-propoxysilane, Allyltri-i-propoxysilane, allyltri-n-butoxysilane, allyltri-sec-butoxysilane, phenyltrichlorosilane, phenyltri-n-propoxysilane, phenyltri- -Propoxysilane, phenyltri-n-butoxysilane, phenyltri-sec-butoxysilane, methyldichlorosilane, methyldiethoxysilane, methyldi-n-propoxysilane, methyldi-i-propoxysilane, methyldi-n-butoxysilane, Methyldi-sec-butoxysilane, dimethyldichlorosilane, dimethyldimethoxysilane, dimethyldiethoxysilane, dimethyldi-n-propoxysilane, dimethyldi-i-propoxysilane, dimethyldi-n-butoxysilane, dimethyldi-sec-butoxysilane, (methyl ) [2- (perfluoro-n-octyl) ethyl] dichlorosilane, (methyl) [2- (perfluoro-n-octyl) ethyl] dimethoxysilane, (methyl) [2- (perfluoro-n-octyl) Ethyl] dimethoxysilane, (methyl) [2- (perfluoro-n-octyl) ethyl] di-n-propoxysilane, (methyl) [2- (perfluoro-n-octyl) ethyl] di-i-propoxy Silane, (methyl) [2- (perfluoro-n-octyl) ethyl] di-n-butoxysilane, (methyl) [2- (perfluoro-n-octyl) ethyl] di-sec-butoxysilane, (methyl ) (Γ-glycidoxypropyl) dichlorosilane, (methyl) (γ-glycidoxypropyl) dimethoxysilane, (methyl) (γ-glycidoxypropyl) diethoxysilane, (methyl) (γ-glycidoxy Propyl) di-n-propoxysilane, (methyl) (γ-glycidoxypropyl) di-i-propoxysilane, (methyl) (γ-glycidoxy (Lopyl) di-n-butoxysilane, (methyl) (γ-glycidoxypropyl) di-sec-butoxysilane, (methyl) (3-mercaptopropyl) dichlorosilane, (methyl) (3-mercaptopropyl) dimethoxysilane , (Methyl) (3-mercaptopropyl) diethoxysilane, (methyl) (3-mercaptopropyl) di-n-propoxysilane, (methyl) (3-mercaptopropyl) di-i-propoxysilane, (methyl) ( 3-mercaptopropyl) di-n-butoxysilane, (methyl) (3-mercaptopropyl) di-sec-butoxysilane, (methyl) (vinyl) dichlorosilane, (methyl) (vinyl) dimethoxysilane, (methyl) ( Vinyl) diethoxysilane, (methyl) (vinyl) di-n-propoxysilane, ( Methyl) (vinyl) di-i-propoxysilane, (methyl) (vinyl) di-n-butoxysilane, (methyl) (vinyl) di-sec-butoxysilane, divinyldichlorosilane, divinyldimethoxysilane, divinyldiethoxysilane , Divinyldi-n-propoxysilane, divinyldi-i-propoxysilane, divinyldi-n-butoxysilane, divinyldi-sec-butoxysilane, diphenyldichlorosilane, diphenyldimethoxysilane, diphenyldiethoxysilane, diphenyldi-n-propoxysilane, Diphenyldi-i-propoxysilane, diphenyldi-n-butoxysilane, diphenyldi-sec-butoxysilane, chlorodimethylsilane, methoxydimethylsilane, ethoxydimethylsilane, chlorotrimethylsilane Bromotrimethylsilane, iodotrimethylsilane, methoxytrimethylsilane, ethoxytrimethylsilane, n-propoxytrimethylsilane, i-propoxytrimethylsilane, n-butoxytrimethylsilane, sec-butoxytrimethylsilane, t-butoxytrimethylsilane, (chloro) (Vinyl) dimethylsilane, (methoxy) (vinyl) dimethylsilane, (ethoxy) (vinyl) dimethylsilane, (chloro) (methyl) diphenylsilane, (methoxy) (methyl) diphenylsilane, (ethoxy) (methyl) diphenylsilane Etc., respectively. However, the present invention is not limited to these specific examples.

As the silicone resin such as a modified silicone resin and a straight silicone resin, commercially available products can be used. In the product name, for example,
KC-89, KC-89S, X-21-3153, X-21-5841, X-21-5842, X-21-5842, X-21-5844, X-21-5845, X-21-5845, X-21-5847, X-21-5848, X-22-160AS, X-22-170B, X-22-170BX, X-22-170D, X-22-170DX, X-22-176B, X- 22-176D, X-22-176DX, X-22-176F, X-40-2308, X-40-2651, X-40-2655A, X-40-2671, X-40-2672, X-40- 9220, X-40-9225, X-40-9226, X-40-9227, X-40-9246, X-40-9247, X-40-9250, X-40-9323, X-40- 460M, X-41-1053, X-41-1056, X-41-1805, X-41-1810, KF6001, KF6002, KF6003, KR-212, KR-213, KR-217, KR-220, KR- 240, KR-242A, KR-271, KR-282, KR-300, KR-311, KR-400, KR-251, KR-253, KR-255, KR-401N, KR-500, KR-510, KR-5206, KR-5230, KR-5235, KR-9218, KR-9706, KR-165 (above, Shin-Etsu Chemical Co., Ltd.);
SH804, SH805, SH806A, SH840, SR2400, SR2402, SR2405, SR2406, SR2410, SR2411, SR2416, SR2420 (above, Toray Dow Corning);
YR3187, YR3370, TSR127B (Momentive Performance Materials Japan GK)
FZ3711, FZ3722 (Nippon Unicar Company);
DMS-S12, DMS-S15, DMS-S21, DMS-S27, DMS-S31, DMS-S32, DMS-S33, DMS-S35, DMS-S38, DMS-S42, DMS-S45, DMS-S51, DMS- 227, PSD-0332, PDS-1615, PDS-9931, XMS-5025 (above, Chisso);
Methyl silicate MS51, Methyl silicate MS56 (Mitsubishi Chemical Corporation);
Ethyl silicate 28, ethyl silicate 40, ethyl silicate 48 (above, Colcoat);
Examples include partial condensates such as glass resin GR100, GR650, GR908, GR950 (above, Showa Denko). However, the present invention is not limited to these specific examples.

Here, the transparent resin film of the present invention may not be formed by photocuring a resin composition containing a photocurable resin and a photopolymerization initiator, and the resin composition used for forming the transparent resin film is , It may or may not contain a photocurable resin or photopolymerization initiator. Among these, when the transparent resin film contains an antioxidant described later, the function of the antioxidant is not hindered by the radicals generated when exposed to the photopolymerization initiator, not containing the photopolymerization initiator. From the viewpoint of sufficiently increasing the whiteness after baking. Therefore, the silicone resin is preferably thermosetting.

-Antioxidant-
In the present invention, the transparent resin film preferably contains an antioxidant from the viewpoint of increasing the transparency of the transparent resin film after baking. Here, when forming a transparent electrode pattern such as ITO on the capacitive input device, it is necessary to bake at a high temperature. By adding an antioxidant, the transparency of the transparent resin film after baking is increased. Can be increased.
A known antioxidant can be used as the antioxidant. For example, hindered phenol antioxidants, semi-hindered phenol antioxidants, phosphoric acid antioxidants, and hybrid antioxidants having phosphoric acid and hindered phenol in the molecule can be used.
Preferably a phosphoric acid antioxidant; a combination of a phosphoric acid antioxidant and a hindered phenol antioxidant or a semi-hindered phenol antioxidant; or a hybrid antioxidant having phosphoric acid and hindered phenol in the molecule is there.
A commercially available antioxidant can also be used as the antioxidant. For example, examples of the phosphoric acid antioxidant include IRGAFOS168 and IRGAFOS38 (both manufactured by BASF Japan). IRGAMOD295 (manufactured by BASF Japan) can be mentioned as a phosphoric acid / hindered phenol-based antioxidant, and Sumilizer GP (Sumitomo Chemical Co., Ltd.) as a hybrid type antioxidant having phosphoric acid and hindered phenol in the molecule. Manufactured).
The antioxidant is more preferably a phosphoric acid antioxidant from the viewpoint of improving transparency after baking of the transparent resin film, and IRGAFOS 168 is particularly preferable.
The amount of the antioxidant added to the total solid content of the transparent resin film is not particularly limited, but is preferably 0.001 to 10% by mass, more preferably 0.01 to 1% by mass. Preferably, it is 0.05 to 1% by mass.

-catalyst-
The transparent resin film preferably contains a catalyst from the viewpoint of improving brittleness by curing the transparent resin film containing the silicone resin. In particular, when two or more kinds of silicone resins are used, they are preferably used for promoting crosslinking by dehydration and dealcohol condensation reaction.
A known catalyst can be used as the catalyst.
As a preferable catalyst, tin (Sn), zinc (Zn), iron (Fe), titanium (Ti), zirconium (Zr), bismuth (Bi), hafnium (Hf), yttrium (Y), aluminum (as a metal component) Examples thereof include organic metal compound catalysts such as organic complexes or organic acid salts of at least one metal selected from the group consisting of Al), boron (B), and gallium (Ga).
Among these, Sn, Ti, Zn, Zr, Hf, and Ga are preferable from the viewpoint of high reaction activity, Zn or Ti is more preferable from the viewpoint of preventing cracking during baking, and Zn is particularly preferable from the viewpoint of improving pot life.
Examples of the organometallic compound catalyst containing zinc (Zn) include zinc triacetylacetonate, zinc stearate, bis (acetylacetonato) zinc (II) (monohydrate) and the like.
Examples of organometallic compound catalysts containing tin (Sn), titanium (Ti), zirconium (Zr), hafnium (Hf), and gallium (Ga) include, for example, the catalysts described in JP2012-238636A. It can be preferably used.
A commercially available catalyst can also be used as the catalyst. Examples thereof include zinc-based condensation catalyst D-15 (manufactured by Shin-Etsu Chemical Co., Ltd.).
The said catalyst may be used individually by 1 type, and may use 2 or more types by arbitrary combinations and a ratio. Moreover, you may use together with a reaction accelerator and reaction inhibitor.
The content of the catalyst is preferably 0.01 to 10% by mass with respect to the silicone resin from the viewpoint of preventing cracking during baking and improving pot life, and more preferably 0.03 to 5.0. % By mass.

-Additive-
Furthermore, you may use another additive for the said transparent resin film. Examples of the additive include surfactants described in paragraph 0017 of Japanese Patent No. 4502784, paragraphs 0060-0071 of JP-A-2009-237362, and prevention of thermal polymerization described in paragraph 0018 of Japanese Patent No. 4502784. And other additives described in paragraphs 0058 to 0071 of JP-A No. 2000-310706. The concentration of the surfactant contained in the transparent resin film is preferably 0.01% by mass to 10% by mass.

(Thickness)
The transparent resin film of the present invention has a thickness of 5 μm or more, preferably 10 μm or more. Particularly, when the decorative layer is a white decorative layer, it is preferable to increase the thickness of the white decorative layer. More preferably, it is 20 μm or more.

(Transparent resin film production method)
The method for producing the transparent resin film is not particularly limited, but can be formed by applying a preparation liquid containing the silicone resin or other additives, and the preparation liquid used for the application is a solvent. Can be used.
As the solvent for producing the transparent resin film by coating, the solvents described in paragraphs 0043 to 0044 of JP2011-95716A can be used.

[Transfer film]
The transfer film of the present invention includes a temporary support and the transparent resin film of the present invention.
Moreover, you may have a thermoplastic resin layer between the said temporary support body and the said transparent resin film.

<Temporary support>
As the temporary support, a material that is flexible and does not cause significant deformation, shrinkage, or elongation under pressure or under pressure and heating can be used. Examples of such a temporary support include a polyethylene terephthalate film, a cellulose triacetate film, a polystyrene film, and a polycarbonate film, and among them, a biaxially stretched polyethylene terephthalate film is particularly preferable.

The thickness of the temporary support is not particularly limited and is generally in the range of 5 to 200 μm, and in the range of easy handling and versatility, the range of 10 to 150 μm is particularly preferable.
Further, the temporary support may be transparent or may contain dyed silicon, alumina sol, chromium salt, zirconium salt or the like.
Further, the temporary support can be imparted with conductivity by the method described in JP-A-2005-221726.

<Transparent resin film>
The transfer film of the present invention includes the transparent resin film of the present invention. The transparent resin film used for the transfer film of the present invention may have a desired size in order to fill a step between the front plate and the decorative layer in the conductive laminate and the capacitive input device of the present invention described later. preferable. However, as described in the description of the conductive laminate and the capacitive input device of the present invention described later, the transfer film of the present invention is used to fill a step between the front plate and the decorative layer by a precut process or the like. Can be size. Therefore, the transparent resin film used for the transfer film of the present invention does not necessarily have the size necessary to fill the step between the front plate and the decorative layer in the conductive laminate and the capacitive input device of the present invention described later. There is no need to match.
On the other hand, in order to fill the step between the front plate and the decorative layer in the conductive laminate and the capacitive input device of the present invention described later, the transparent resin film of the present invention is used as a decorative layer at the stage of use for the transfer film. It is preferable that the thickness is adjusted to the same level as the height.

(Viscosity of transparent resin film)
The viscosity of the transparent resin film measured at 100 ° C. is preferably in the range of 1 to 50000 Pa · sec.

Here, the viscosity of each layer can be measured as follows. The solvent is removed from the coating solution for the thermoplastic resin layer or transparent resin film by drying at atmospheric pressure and under reduced pressure to obtain a measurement sample. For example, Vibron (DD-III type: manufactured by Toyo Baldwin Co., Ltd.) is used as a measuring instrument. Then, measurement is performed under the conditions of a measurement start temperature of 50 ° C., a measurement end temperature of 150 ° C., a temperature increase rate of 5 ° C./min, and a frequency of 1 Hz / deg, and a measurement value of 100 ° C. can be used.

<Thermoplastic resin layer>
In the transfer film of the present invention, it is preferable that a thermoplastic resin layer is provided between the temporary support and the transparent resin film. The thermoplastic resin layer is preferably alkali-soluble. The thermoplastic resin layer plays a role as a cushioning material so as to be able to absorb unevenness of the base surface (including unevenness due to already formed images, etc.), and according to the unevenness of the target surface. It is preferable to have a property that can be deformed.

The thermoplastic resin layer preferably includes an organic polymer substance described in JP-A-5-72724 as a component. The Vicat method [specifically, a polymer obtained by American Material Testing Method ASTM D1235] An embodiment containing at least one selected from organic polymer substances having a softening point of about 80 ° C. or less according to the softening point measurement method] is particularly preferable.

Specifically, polyolefins such as polyethylene and polypropylene, ethylene copolymers with ethylene and vinyl acetate or saponified products thereof, copolymers of ethylene and acrylic acid esters or saponified products thereof, polyvinyl chloride and vinyl chloride, Vinyl chloride copolymer with vinyl acetate or saponified product thereof, polyvinylidene chloride, vinylidene chloride copolymer, polystyrene, styrene copolymer with styrene and (meth) acrylic acid ester or saponified product thereof, polyvinyl toluene, Vinyl toluene copolymer of vinyl toluene and (meth) acrylic acid ester or saponified product thereof, poly (meth) acrylic acid ester, (meth) acrylic acid ester copolymer weight of butyl (meth) acrylate and vinyl acetate, etc. Copolymer, vinyl acetate copolymer nylon, copolymer nylon N- alkoxymethyl nylon, N- dimethylamino nylon or the like of the polyamide resin, polyester, and organic polymers such as.

Further, it is preferable to add a foaming agent or the like for controlling peelability to the thermoplastic resin layer, and those described in paragraphs 0020 to 0028 of JP-A-2007-225939 can be used as appropriate.

It is also preferable to add a surfactant to the thermoplastic resin layer. For example, those described in Paragraph 0017 of Japanese Patent No. 4502784 and Paragraphs 0060 to 0071 of JP-A-2009-237362 can be used as appropriate.

The layer thickness of the thermoplastic resin layer is preferably 3 to 30 μm. When the thickness of the thermoplastic resin layer is 3 μm or more, the followability at the time of lamination is sufficient, and the unevenness of the base surface is easily absorbed. In addition, when the layer thickness is 30 μm or less, it is difficult to apply a load to drying (solvent removal) when forming the thermoplastic resin layer on the temporary support, and development of the thermoplastic resin layer does not take too much time. , Process aptitude is good. The thickness of the thermoplastic resin layer is more preferably 4 to 25 μm, and particularly preferably 5 to 20 μm.

The thermoplastic resin layer can be formed by applying a preparation liquid containing a thermoplastic organic polymer, and the preparation liquid used for the application can be prepared using a solvent. The solvent is not particularly limited as long as it can dissolve the polymer component constituting the thermoplastic resin layer, and examples thereof include methyl ethyl ketone, cyclohexanone, propylene glycol monomethyl ether acetate, n-propanol, and 2-propanol.

The viscosity of the thermoplastic resin layer measured at 100 ° C. is preferably in the region of 1000 to 50000 Pa · sec.

<Other layers>
The transfer film of the present invention can be suitably configured by providing an intermediate layer between the transparent resin film and the thermoplastic resin layer, or further providing a protective film or the like on the surface of the transparent resin film.

In the transfer film of the present invention, it is preferable to provide an intermediate layer for the purpose of preventing mixing of components when applying a plurality of layers and during storage after application. As the intermediate layer, an oxygen-blocking film having an oxygen-blocking function, which is described as “separation layer” in JP-A-5-72724, is preferable, which increases sensitivity during exposure and reduces the time load of the exposure machine. And productivity is improved.

As the intermediate layer and the protective film, those described in paragraphs 0083 to 0087 and 0093 of JP-A-2006-259138 can be appropriately used.

<Method for producing transfer film>
The transfer film of the present invention can be produced according to the method for producing a photosensitive transfer material described in paragraphs 0094 to 0098 of JP-A-2006-259138.
Specifically, when forming the transfer film of the present invention having an intermediate layer, a solution (the coating solution for the thermoplastic resin layer) in which the additive is dissolved together with the thermoplastic organic polymer is applied onto the temporary support. After drying and providing a thermoplastic resin layer, a preparation liquid (intermediate layer coating liquid) prepared by adding a resin or an additive to a solvent that does not dissolve the thermoplastic resin layer is applied onto the thermoplastic resin layer. By drying and laminating an intermediate layer, and further applying a transparent resin film coating solution prepared using a solvent that does not dissolve the intermediate layer on the intermediate layer, and drying and laminating a decorative layer , Can be suitably produced.

[Conductive film laminate, capacitance type input device]
The conductive film laminate of the present invention was disposed on a transparent front plate, (1) a decorative layer disposed on a part of one surface of the front plate, and one surface side of the front plate. And a step between the front plate and the decorative layer is filled with the transparent resin film of the present invention or the transparent resin film of the transfer film of the present invention. .
The capacitive input device of the present invention includes the conductive film laminate of the present invention.

In the conductive film laminate of the present invention, the electrode pattern preferably includes the following (3) to (5) from the viewpoint of using the conductive film laminate of the present invention as a capacitive input device.
(3) A plurality of first transparent electrode patterns formed by extending a plurality of pad portions in a first direction via connection portions (4) electrically insulated from the first transparent electrode pattern, A plurality of second electrode patterns comprising a plurality of pad portions formed extending in a direction intersecting the first direction (5) electrically connecting the first transparent electrode pattern and the second electrode pattern However, “the electrode pattern is disposed on the decorative layer” means that part of (3) or (4) among the above (3) to (5) is the decorative layer All of (3) to (5) need not be arranged on the decorative layer. Moreover, the electrode pattern may be arrange | positioned adjacent to the said decoration layer, and may be arrange | positioned through another layer.
Furthermore, in the capacitance-type input device of the present invention, the electrode pattern may further include the following (6).
(6) A conductive element that is electrically connected to at least one of the first transparent electrode pattern and the second electrode pattern, and is different from the first transparent electrode pattern and the second electrode pattern; In the conductive film laminate and the capacitive input device of the present invention, the second electrode pattern may be a transparent electrode pattern. In this specification, the second transparent electrode pattern may be described instead of the second electrode pattern, but the preferred embodiment of the second electrode pattern is the same as the preferred embodiment of the second transparent electrode pattern. is there.
Furthermore, the conductive film laminate and the capacitance-type input device of the present invention are the (1) decorative layer formed on the one surface side of the front plate on the side opposite to the surface facing the front plate. Further, (2) a mask layer may be provided on the surface.
Hereinafter, the preferable aspect of the electrically conductive film laminated body and electrostatic capacitance type input device of this invention is demonstrated.

<Structure of conductive film laminate and capacitive input device>
The structures of the conductive film laminate and the capacitance type input device of the present invention will be described. FIG. 14 is a cross-sectional view showing a preferred configuration among the capacitance-type input device of the present invention. In FIG. 14, the capacitive input device is disposed on the transparent front plate 1, the decorative layer 2 disposed on a part of one surface of the front plate, and one surface of the front plate. A step between the front plate 1 and the decorative layer 2 is filled with the transparent resin film 9 of the present invention. Further, the capacitive input device shown in FIG. 14 includes a first transparent electrode pattern 3, an insulating layer 5, and a transparent protective layer 7.
As in the capacitive input device shown in FIG. 14, the front plate 1, the decorative layer 2, the first transparent electrode pattern 3, the second transparent electrode pattern 4, the insulating layer 5, and the conductivity An element 6, a transparent protective layer 7 ′, and the transparent resin film 9 of the present invention are formed, and an electrode pattern (second transparent electrode pattern 4 and conductive element 6) is adjacent to the decorative layer 2. Are preferably arranged. That is, a transparent protective layer is included on the transparent resin film, the decorative layer, and the electrode pattern (an overcoat layer is present above the electrode pattern such as ITO). In the case of using a transparent protective layer that is not present, it is preferable from the viewpoint that the transparent protective layer does not undergo thermal discoloration during ITO sputtering.
On the other hand, in FIG. 1, the electrode pattern (second transparent electrode pattern 4 and conductive element 6) is disposed on the decorative layer 2 via the transparent protective layer 7. As shown in FIG. 1, the conductive film laminate and the capacitance-type input device of the present invention are further provided between the decorative layer 2 and the electrode pattern, and between the transparent resin film 9 and the electrode pattern. The aspect containing the transparent protective layer 7 may be sufficient. However, in the conductive film laminate of the present invention, the stacking order shown in FIG. 14 is preferable to the stacking order shown in FIG.
The edge part of the decoration layer 2 may be a taper shape, a reverse taper shape, or may not form the taper shape. In FIG. 1, the decoration layer 2 has a tapered end. On the other hand, as shown in FIG. 14, the decoration layer 2 does not need to form a taper shape. As for the electrically conductive film laminated body of this invention, it is preferable that the edge part of the said decoration layer is a taper shape.
14 and 1, the inner diameter (one side) L of the decorative layer 2 is equal to the width of the transparent resin film 9 of the present invention. On the other hand, when the step between the front plate 1 and the decorative layer 2 is filled with the transparent resin film 9 of the present invention, the inner diameter (one side) L of the decorative layer 2 is as long as it does not contradict the spirit of the present invention. As shown in FIG. 15, it may be wider than the width of the transparent resin film 9 of the present invention, and conversely, as shown in FIG. 16, it may be narrower than the width of the transparent resin film 9 of the present invention. The transparent resin film 9 existing on the decorative layer 2 is thinner than the transparent resin film 9 in direct contact with the front plate 1 due to the pressure applied during transfer due to the thickness of the decorative layer 2. Tend to be. The width of the transparent resin film 9 of the present invention is preferably equal to or greater than the inner diameter (one side) L of the decorative layer 2 and preferably equal to or greater than 20 mm, more preferably equal to or greater than 10 mm, and equal to or greater than 5 mm. It is particularly preferable from the viewpoint of suppressing the introduction of new bubbles near the edge of the transparent resin film present on the decorative layer 2.

The front plate 1 is composed of a light-transmitting substrate such as a glass substrate, and tempered glass represented by Corning's gorilla glass can be used. In this specification, of the surfaces of the front plate 1 constituting the capacitive input device of the present invention, the surface on which input is performed by bringing a finger or the like into contact is referred to as a contact surface, and the contact surface of the front plate 1 Is called the non-contact surface 1a. Hereinafter, the front plate may be referred to as a “base material”.

In addition, a mask layer may be provided on one surface of the front plate 1 with a decorative layer 2 interposed therebetween. The mask layer is a frame-like pattern around the display area formed on one surface side of the front panel of the touch panel, and is formed so as not to show the lead wiring or the like.
The decoration layer 2 may be formed for the purpose of decoration between one surface of the touch panel front plate and the mask layer.
In the capacitive input device of the present invention, as shown in FIG. 2, a decorative layer 2 and a mask layer (a mask layer (covering a region other than the input surface in FIG. 2) of the front plate 1 are covered. (Not shown) is preferably provided. Further, the front plate 1 can be provided with an opening 8 in a part of the front plate as shown in FIG. A pressing mechanical switch can be installed in the opening 8. Since the tempered glass used as a base material has high strength and is difficult to process, it is general to form the opening 8 by forming the opening 8 before the tempering treatment and then performing the tempering treatment. . However, when trying to form the decorative layer 2 using the liquid resist for decorating layer formation or the screen printing ink on the substrate after the strengthening treatment having the opening 8, the resist component mole from the opening, There is a problem that the resist component protrudes from the glass edge in the decorative layer provided between the mask layer and the front plate, which needs to form a light-shielding pattern until the boundary of the front plate, and the back side of the substrate is contaminated. However, when the decorative layer 2 is formed on the base material having the opening 8 by using a transfer film, such a problem can be solved.

On one surface of the front plate 1, a plurality of first transparent electrode patterns 3 in which a plurality of pad portions are formed extending in the first direction via connection portions, and a first transparent electrode pattern 3. And a plurality of second transparent electrode patterns 4 comprising a plurality of pad portions formed extending in a direction crossing the first direction, the first transparent electrode pattern 3 and the second An insulating layer 5 for electrically insulating the transparent electrode pattern 4 is formed. The first transparent electrode pattern 3, the second transparent electrode pattern 4, and another conductive element 6, which will be described later, are translucent, such as ITO (Indium Tin Oxide) and IZO (Indium Zinc Oxide). The conductive metal oxide film can be used. Examples of such metal films include ITO films; metal films such as Al, Zn, Cu, Fe, Ni, Cr, and Mo; metal oxide films such as SiO ₂ . At this time, the film thickness of each element can be set to 10 to 200 nm. Further, since the amorphous ITO film is made into a polycrystalline ITO film by firing, the electrical resistance can be reduced. The first transparent electrode pattern 3, the second transparent electrode pattern 4, and the conductive element 6 described later use a transfer film having a conductive curable resin layer using conductive fibers described later. Can also be manufactured. In addition, when the first transparent electrode pattern or the like is formed of ITO or the like, paragraphs 0014 to 0016 of Japanese Patent No. 4506785 can be referred to.

Further, at least one of the first transparent electrode pattern 3 and the second transparent electrode pattern 4 is the transparent resin film 9 of the present invention disposed on one surface of the front plate 1 and the front plate 1 of the decorative layer 2. It can be installed across both areas of the opposite surface and the opposite surface. In FIG. 14, the second transparent electrode pattern 4 is opposite to the transparent resin film 9 of the present invention disposed on one surface of the front plate 1 and the surface facing the front plate 1 of the decorative layer 2. The figure in which the second transparent electrode pattern 4 is installed across both regions of the side surface is shown. Thus, when laminating an electrode pattern (for example, laminating the below-mentioned transfer film) over the decoration layer 2 which needs fixed thickness, and the transparent resin film 9 of this invention arrange | positioned on the front plate back surface However, by using the transparent resin film 9 of the present invention, it is possible to laminate without the generation of bubbles at the boundary of the decorative layer and the disconnection of the electrode pattern without using expensive equipment such as a vacuum laminator. become.

The first transparent electrode pattern 3 and the second transparent electrode pattern 4 will be described with reference to FIG. FIG. 3 is an explanatory diagram showing an example of the first transparent electrode pattern and the second transparent electrode pattern in the present invention. As shown in FIG. 3, the first transparent electrode pattern 3 is formed such that the pad portion 3a extends in the first direction via the connection portion 3b. The second transparent electrode pattern 4 is electrically insulated by the first transparent electrode pattern 3 and the insulating layer 5 and extends in a direction intersecting the first direction (second direction in FIG. 3). It is constituted by a plurality of pad portions that are formed. Here, when the first transparent electrode pattern 3 is formed, the pad portion 3a and the connection portion 3b may be manufactured as one body, or only the connection portion 3b is manufactured and the pad portion 3a and the second portion 3b are formed. The transparent electrode pattern 4 may be integrally formed (patterned). When the pad portion 3a and the second transparent electrode pattern 4 are produced (patterned) as a single body (patterning), as shown in FIG. 3, a part of the connection portion 3b and a part of the pad portion 3a are coupled, and an insulating layer Each layer is formed so that the first transparent electrode pattern 3 and the second transparent electrode pattern 4 are electrically insulated by 5.

In FIG. 14, the conductive element 6 is installed on the surface of the decorative layer 2 opposite to the surface facing the front plate 1. The conductive element 6 is electrically connected to at least one of the first transparent electrode pattern 3 and the second transparent electrode pattern 4, and is different from the first transparent electrode pattern 3 and the second transparent electrode pattern 4. Another conductive element. FIG. 14 shows a diagram in which another conductive element 6 is connected to the second transparent electrode pattern 4.

Moreover, in FIG. 1, the transparent protective layer 7 is further installed between the said decoration layer 2 and the said electrode pattern, and between the said transparent resin film 9 and the said electrode pattern. Thus, the transparent protective layer 7 may be configured to cover only a part of each component. A transparent protective layer 7 is formed across both the regions of the transparent resin film 9 of the present invention disposed on one surface of the front plate 1 and the surface of the decorative layer 2 opposite to the surface facing the front plate 1. Even in the case of installation, by using the transparent resin film 9 of the present invention, it is possible to perform lamination without generating bubbles at the boundary of the decorative layer with a simple process without using expensive equipment such as a vacuum laminator.
On the other hand, as shown in FIG. 14, it is more preferable that a transparent protective layer 7 ′ is provided so as to cover all the components. In FIG. 1, a transparent protective layer 7 ′ may be provided as shown in FIG. 14 so as to cover all the components. The transparent

protective layer

7 or 7 ′ is sometimes called an overcoat layer.
The insulating layer 5 and the transparent protective layer 7 may be made of the same material or different materials. As a material constituting the insulating layer 5 and the transparent protective layers 7 and 7 ', those having high surface hardness and high heat resistance are preferable, and known photosensitive siloxane resin materials, acrylic resin materials, and the like are used.

Examples of the embodiment formed in the manufacturing process of the capacitive input device of the present invention include the embodiments shown in FIGS. FIG. 4 is a top view illustrating an example of the tempered glass 11 in which the opening 8 is formed. FIG. 5 is a top view showing an example of the front plate on which the decorative layer 2 is formed. FIG. 6 is a top view showing an example of the front plate on which the first transparent electrode pattern 3 is formed. FIG. 7 is a top view showing an example of a front plate on which the first transparent electrode pattern 3 and the second transparent electrode pattern 4 are formed. FIG. 8 is a top view showing an example of a front plate on which conductive elements 6 different from the first and second transparent electrode patterns are formed. These show examples embodying the above description, and the scope of the present invention is not limitedly interpreted by these drawings.

Hereinafter, with respect to the conductive film laminate and the capacitance-type input device of the present invention, details of each layer and preferred modes of the manufacturing method of each layer will be described.

<Decoration layer>
The electrically conductive film laminated body and electrostatic capacitance type input device of this invention have (1) decoration layers arrange | positioned at the one surface side of the said front board.

In the conductive film laminate and the capacitive input device body of the present invention, the thickness of the decorative layer is preferably 5 μm or more, more preferably 10 μm or more, and in particular, the decorative layer is a white decorative layer. When it is, since it is preferable to make the thickness of a white decoration layer thick, it is more preferable that it is 30 micrometers or more.
In the conductive film laminate of the present invention, the thickness of the transparent resin film is preferably 0.2 to 2.0 times, and preferably 0.3 to 1.5 times the thickness of the decorative layer. The ratio is more preferably 0.99 to 1.01 times.

(material)
The decorative layer includes a colorant.

Examples of the black colorant include carbon black, titanium carbon, iron oxide, titanium oxide, and graphite. Among these, carbon black is preferable. In addition to the black colorant, a mixture of pigments such as red, blue, and green can be used.

As the white colorant, the white pigment described in paragraph 0019 of JP2009-191118A or paragraph 0109 of JP2000-175718A can be used. Also, white pigments described in paragraphs 0015 and 0114 of JP-A-2005-7765 can be used.
Specifically, in the present invention, white inorganic pigments such as titanium oxide (rutile type), titanium oxide (anatase type), zinc oxide, lithopone, light calcium carbonate, white carbon, aluminum oxide, aluminum hydroxide, barium sulfate, etc. Titanium oxide (rutile type), titanium oxide (anatase type) and zinc oxide are more preferable, titanium oxide (rutile type) and titanium oxide (anatase type) are more preferable, and rutile type titanium oxide is particularly preferable.

Specific examples of titanium dioxide include JR, JRNC, JR-301, 403, 405, 600A, 605, 600E, 603, 701, 800, 805, 806, JA-1, C, 3, 4, 5, MT- 01, 02, 03, 04, 05, 100AQ, 100SA, 100SAK, 100SAS, 100TV, 100Z, 100ZR, 150W, 500B, 500H, 500SA, 500SAK, 500SAS, 500T, SMT-100SAM, 100SAS, 500SAM, 500SAS Manufactured), CR-50, 50-2, 57, 58, 58-2, 60, 60-2, 63, 67, 80, 85, 90, 90-2, 93, 95, 97, 953, Super70, PC -3, PF-690, 691, 711, 736, 737, 739, 740, 42, R-550, 580, 630, 670, 680, 780, 780-2, 820, 830, 850, 855, 930, 980, S-305, UT771, TTO-51 (A), 51 (C), 55 (A), 55 (B), 55 (C), 55 (D), S-1, S-2, S-3, S-4, V-3, V-4, MPT-136, FTL- 100, 110, 200, 300 (Ishihara Sangyo Co., Ltd.), KA-10, 15, 20, 30, KR-310, 380, KV-200, STT-30EHJ, 65C-S, 455, 485SA15, 495M, 495MC ( Titanium Industry Co., Ltd.), TA-100, 200, 300, 400, 500, TR-600, 700, 750, 840, 900 (Fuji Titanium Industry Co., Ltd.) and the like. It may be.

In the present invention, the surface of the white inorganic pigment (particularly titanium oxide) can be used in combination with silica treatment, alumina treatment, titania treatment, zirconia treatment, organic matter treatment and the like.
Thereby, the catalytic activity of the white inorganic pigment (especially titanium oxide) can be suppressed, and heat resistance, fluorescence, etc. can be improved.
From the viewpoint of the whiteness of the decorative layer after heating, in the present invention, the white pigment is preferably a rutile type titanium oxide surface-treated with an inorganic substance, and at least one of alumina treatment and zirconia treatment was surface-treated. A rutile type titanium oxide is more preferable, and a rutile type titanium oxide surface-treated by an alumina / zirconia combined treatment is particularly preferable.

In order to use as a decorative layer of the other colors, pigments or dyes described in paragraphs 0183 to 0185 of Japanese Patent No. 4546276 may be mixed and used. Specifically, pigments and dyes described in paragraphs 0038 to 0054 of JP-A-2005-17716, pigments described in paragraphs 0068 to 0072 of JP-A-2004-361447, paragraphs of JP-A-2005-17521 The colorants described in 0080 to 0088 can be preferably used.

The content of the inorganic pigment with respect to the total solid content of the decorative layer is 20 to 75% by mass to form a decorative layer having good brightness and whiteness and simultaneously satisfying other required characteristics. It is preferable from the viewpoint. Moreover, when using the transfer film of this invention for the manufacturing method of the electrostatic capacitance type input device of this invention mentioned later, also from a viewpoint of shortening development time fully, the said inorganic pigment with respect to the total solid of the said decoration layer is sufficient. The content is preferably 20 to 75% by mass.
The content of the inorganic pigment with respect to the total solid content of the decorative layer is more preferably 25 to 60% by mass, and further preferably 30 to 50% by mass.
The total solid content as used in this specification means the total mass of the non-volatile component except the solvent etc. from the said decoration layer.

The inorganic pigment (which is the same for other colorants) is preferably used as a dispersion. This dispersion can be prepared by adding and dispersing a composition obtained by previously mixing the inorganic pigment and the pigment dispersant in an organic solvent (or vehicle) described later. The vehicle is a portion of a medium in which a pigment is dispersed when the paint is in a liquid state, and is a liquid component that binds to the pigment to form a coating film (binder) and dissolves and dilutes it. Component (organic solvent).

The dispersing machine used for dispersing the inorganic pigment is not particularly limited. For example, a kneader described in Kazuzo Asakura, “Encyclopedia of Pigments”, First Edition, Asakura Shoten, 2000, page 438. , Known dispersing machines such as a roll mill, atrider, super mill, dissolver, homomixer, and sand mill. Further, fine grinding may be performed using frictional force by mechanical grinding described on page 310 of the document.

The colorant that can be used in the present invention is preferably a colorant having an average primary particle size of 0.16 μm to 0.3 μm, more preferably 0.18 μm to 0.27 μm, from the viewpoint of dispersion stability and hiding power. The colorant is preferred. Further, a colorant of 0.19 μm to 0.25 μm is particularly preferable. When the average particle size of the primary particles is smaller than 0.16 μm, the hiding power is suddenly lowered, and the base of the decorative layer may be easily seen or the viscosity may be increased. On the other hand, when it exceeds 0.3 μm, the whiteness is lowered particularly when a white inorganic pigment is used, and at the same time, the hiding power is suddenly lowered, and the surface condition when applied may be deteriorated.
The “average particle size of primary particles” as used herein refers to the diameter when the electron micrograph image of the particles is a circle of the same area, and the “number average particle size” refers to the above-mentioned particle size for many particles. The diameter is determined, and among these, an average value of 100 arbitrarily selected particle diameters is referred to.
On the other hand, when measuring by the average particle diameter in a dispersion liquid and a coating liquid, laser scattering HORIBA H (made by Horiba Advanced Techno Co., Ltd.) can be used.

-Binder resin-
It is preferable that a decoration layer contains binder resin. The binder resin is preferably a silicone resin similar to the transparent resin film.
Moreover, it is preferable that a catalyst is included from a viewpoint of hardening the said decoration layer containing the said silicone type resin and improving a brittleness. The catalyst is preferably the same as the transparent resin film.

(Method for forming the decoration layer)
Although there is no restriction | limiting in particular in the formation method of the said decoration layer, It is preferable to form using the transfer film which has a temporary support body and a resin layer in this order, and this temporary support body and a photocurable resin layer are made into this. It is more preferable to form using a photosensitive transfer film having in order, and it is particularly preferable to use a photosensitive transfer film having a temporary support, a thermoplastic resin layer, and a photocurable resin layer in this order. . For example, when the white decorative layer 2 is formed, the white light curing is performed on the surface of the front plate 1 using a photosensitive transfer film described later having a white light curing resin layer as the photocurable resin layer. It is preferable to form by transferring the conductive resin layer.
When forming a decorating layer using the said transfer film, a coloring agent can be used for a resin layer. As the colorant, the aforementioned colorants (organic pigments, inorganic pigments, dyes, etc.) can be suitably used.

In the capacitance-type input device having the opening 8 configured as shown in FIG. 2, when the decorative layer 2 and the mask layer (not shown) shown in FIG. 1 are formed using the transfer film of the present invention, the opening is formed. Even the front plate (substrate) having a portion has no resist component leakage from the opening. In particular, when using the transfer film of the present invention, in the decorative layer that needs to form a light-shielding pattern just above the boundary line of the front plate, there is no protrusion of the resist component from the glass edge, so the back side of the front plate is A touch panel having advantages of thinning and light weight can be manufactured through a simple process without contamination.

A method for forming the decorative layer using a transfer film will be described. In general, when a transfer film is used, it can be formed by an ordinary photolithography method if the decorative layer contains a photocurable resin. Here, the transfer film may or may not contain the photocurable resin in the decorative layer, and in any case, the transfer film is used depending on the transfer method by the following half cut or the transfer method by die cut. And a decorative layer can be formed.
In the transfer method by the half cut, first, after pre-cutting with a razor or the like at the boundary between the image portion and the non-image portion of the decorative layer, the protective film, the decorative layer and the intermediate layer of the non-image portion are removed with a tape, and further the image portion The protective film is similarly removed, and the decorative layer pattern is transferred to the substrate.
On the other hand, in the transfer method by die-cutting, first, as shown in FIGS. After removing the decorative layer (non-image portion 31) in the region of (2), the protective film of the image portion 32 remaining after the removal is removed with a tape, and the decorative layer pattern is transferred to the substrate.
Subsequently, the decorative layer pattern can be formed by removing the thermoplastic resin layer and the intermediate layer by development.
You may combine well-known image development facilities, such as a brush and a high pressure jet, as needed. After the development, post-exposure and post-bake may be performed as necessary, and post-bake is preferably performed.

Also, in order to enhance the adhesion of the decorative layer by lamination in the subsequent transfer process, one surface of the base material (front plate) can be subjected to surface treatment in advance. As the surface treatment, it is preferable to carry out a surface treatment (silane coupling treatment) using a silane compound (silane coupling agent). As the silane coupling agent, those having a functional group that interacts with the photosensitive resin are preferable. For example, a silane coupling solution (N-β (aminoethyl) γ-aminopropyltrimethoxysilane 0.3% by mass aqueous solution, trade name: KBM603, manufactured by Shin-Etsu Chemical Co., Ltd.) is sprayed for 20 seconds by a shower, and pure water shower washing is performed. To do. Thereafter, the reaction is carried out by heating. A heating tank may be used, and the reaction can be promoted by preheating the substrate of the laminator.

In the case where a permanent material such as a decorative layer is formed using a transfer film, a patterning method using the transfer film will be described using a method of forming the decorative layer as an example.

The method of forming the decorative layer is a half-cut step, that is, a step of making a cut in a depth that penetrates the decorative layer and does not penetrate the temporary support in a part of the transfer film, and the cut (1) decoration using the transfer film after removing the decoration layer in at least a part of the region surrounded by the step and removing the decoration layer in the part of the region Forming a layer.
In addition, the method for forming the decorative layer includes a die cutting step, that is, a step of making a cut through the temporary support from the decorative layer into a part of the transfer film, and the decoration of the partial region. And (1) forming a decorative layer using the transfer film after removing the layer.

A step of making a cut in a depth that does not penetrate the temporary support and through the decorative layer in a part of the transfer film, or a step of making a cut through the temporary support from the decorative layer It is also called a step of pre-cutting an image portion to be transferred in the decorative layer.

The step of removing the decorative layer in at least a part of the region surrounded by the cuts is also referred to as the step of removing the decorative layer of the non-image portion that is not transferred.
Furthermore, when the transfer film includes a protective film, an intermediate layer, or a thermoplastic resin layer, the step of removing the decorative layer in at least a part of the region surrounded by the cuts is a protective film for a non-image part. And a step of removing the decorative layer and the protective film of the image portion.

(1) The process of forming the decoration layer using the transfer film after removing the decoration layer of the partial area, the transfer process of transferring the decoration layer of the image part onto the substrate Also say.
Furthermore, when a transfer film contains a protective film, an intermediate | middle layer, and a thermoplastic resin layer, the said (1) decoration layer is formed using the said transfer film after removing the said decoration layer of the said one part area | region. The step is preferably a transfer step in which the decorative layer of the image portion of the transfer film from which the protective film has been removed is transferred onto a substrate.
In this case, the step of forming the decorative layer (1) using the transfer film after removing the decorative layer in the partial area further peels off the temporary support transferred onto the substrate. It is preferable that the process to include is included.
In this case, the step (1) of forming the decorative layer using the transfer film after removing the decorative layer in the partial region further includes the step of removing the thermoplastic resin layer and the intermediate layer. It is preferable to include.

The method for forming the decorative layer includes a step of pre-cutting the image portion to be transferred among the decorative layer of the transfer film, a step of removing the protective film and the decorative layer of the non-image portion, and the protective film of the image portion, A transfer step of transferring the decorative layer of the image portion of the transfer film from which the protective film has been removed onto the substrate, a step of peeling the temporary support transferred onto the substrate, a thermoplastic resin layer, A method having a step of removing the intermediate layer is more preferable.

On the other hand, when the decorative layer has a photocurable resin layer, the method of forming the decorative layer includes a protective film removing step of removing the protective film from the transfer film, and the protective film is removed. And a transfer step of transferring the photocurable resin layer of the photosensitive transfer material onto a substrate. In this case, it is preferable to further include a step of post-exposing the transferred photocurable resin layer after the transfer step.

(A) Photolithography A patterning method will be described for the case where the decorative layer is formed using a photolithography method.
After the transfer film is laminated on the front plate (base material), it is exposed to the required pattern, and in the case of negative type material, the unexposed part and in the case of positive type material, the exposed part is developed and removed. A pattern can be obtained. At this time, the development may be carried out by removing the thermoplastic resin layer and the photocurable resin layer with separate liquids, or with the same liquid. You may combine well-known image development facilities, such as a brush and a high pressure jet, as needed. After the development, post-exposure and post-bake may be performed as necessary.

The method of forming the transparent curable resin layer pattern when having the photocurable resin layer includes a protective film removing step of removing the protective film from the transfer film, and the light of the transfer film from which the protective film has been removed. A transfer step of transferring a transparent curable resin layer containing a curable resin onto a substrate, an exposure step of exposing the photocurable resin layer transferred onto the substrate, and an exposed photocurable resin layer And a development step of obtaining a pattern image by development. In this case, it is preferable to further include a step of post-exposing the transferred photocurable resin layer after the transfer step.

-Transfer process-
The transfer step is a step of transferring the photocurable resin layer of the transfer film from which the protective film has been removed onto a substrate.
At this time, a method of removing the temporary support after laminating the photocurable resin layer of the transfer film on the substrate is preferable.
Transfer (bonding) of the photocurable resin layer to the surface of the substrate is performed by stacking the photocurable resin layer on the surface of the substrate, pressurizing and heating. For laminating, known laminators such as a laminator, a vacuum laminator, and an auto-cut laminator that can further increase productivity can be used.

-Exposure process, development process, and other processes-
As examples of the exposure step, the development step, and other steps, the methods described in paragraphs 0035 to 0051 of JP-A-2006-23696 can be preferably used in the present invention.

The exposure step is a step of exposing the photocurable resin layer transferred onto the substrate.
Specifically, there is a method in which a predetermined mask is disposed above the photocurable resin layer formed on the substrate, and then exposed from above the mask through the mask, the thermoplastic resin layer, and the intermediate layer. Can be mentioned.
Here, the light source for the exposure can be appropriately selected and used as long as it can irradiate light in a wavelength region capable of curing the photocurable resin layer (for example, 365 nm, 405 nm, etc.). Specifically, an ultrahigh pressure mercury lamp, a high pressure mercury lamp, a metal halide lamp, etc. are mentioned. The exposure dose is usually about 5 to 200 mJ / cm ² , preferably about 10 to 100 mJ / cm ² .

The developing step is a step of developing the exposed photocurable resin layer.
The development can be performed using a developer. The developer is not particularly limited, and a known developer such as a developer described in JP-A-5-72724 can be used. The developer is preferably a developer in which the photocurable resin layer has a dissolution type development behavior. For example, a developer containing a compound having pKa = 7 to 13 at a concentration of 0.05 to 5 mol / L is preferable. A small amount of an organic solvent miscible with water may be added. Examples of organic solvents miscible with water include methanol, ethanol, 2-propanol, 1-propanol, butanol, diacetone alcohol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol mono-n-butyl ether, benzyl alcohol And acetone, methyl ethyl ketone, cyclohexanone, ε-caprolactone, γ-butyrolactone, dimethylformamide, dimethylacetamide, hexamethylphosphoramide, ethyl lactate, methyl lactate, ε-caprolactam, N-methylpyrrolidone and the like. The concentration of the organic solvent is preferably 0.1% by mass to 30% by mass. Further, a known surfactant can be added to the developer. The concentration of the surfactant is preferably 0.01% by mass to 10% by mass.

The development method may be any of paddle development, shower development, shower & spin development, dip development, and the like. Here, the shower development will be described. The uncured portion can be removed by spraying a developer onto the photocurable resin layer after exposure. In the case where a thermoplastic resin layer or an intermediate layer is provided, an alkaline liquid having a low solubility of the transparent curable resin layer containing a photocurable resin is sprayed by a shower or the like before development, and the thermoplastic resin layer, It is preferable to remove the intermediate layer and the like. Further, after the development, it is preferable to remove the development residue while spraying a cleaning agent or the like with a shower and rubbing with a brush or the like. The liquid temperature of the developer is preferably 20 ° C. to 40 ° C., and the pH of the developer is preferably 8 to 13.

(B) Pre-cut process The image forming method of a decoration layer needs to form an image part in a decoration layer before transfer, when not image-forming by a normal photolitho system.
As a kind of pre-cut, a step (half-cut step) of cutting through the decorative layer into a part of the transfer film and not penetrating the temporary support (half-cut step) and the temporary support from the decorative layer There is a process (die cutting process) for making a cut through the body.

(I) Half-cut process First, a half-cut process in the method of forming the decorative layer, that is, a cut with a depth that penetrates the decorative layer and does not penetrate the temporary support in a part of the transfer film. The process of putting in will be described below.
There is no restriction | limiting in particular as the method of making the said incision, Incision can be made by arbitrary methods, such as a blade and a laser, and it is preferable to make an incision with a blade. Further, the structure of the blade is not particularly limited.
When the transfer film is composed of, for example, a temporary support, a thermoplastic resin layer, an intermediate layer, a decorative layer, and a protective film in that order, for example, using a blade or a laser, from above the protective film, By cutting through the protective film, the decorative layer, and the intermediate layer and reaching part of the thermoplastic resin layer, it is possible to separate the image portion to be transferred and the non-image portion not to be transferred.

-The process of removing the decorative layer in the non-image area-
In order to selectively transfer the image portion of the decorative layer precut by the half cut to the substrate, it is necessary to devise a method for not transferring the non-image portion. One method is a method of removing the decorative layer in the non-image area before transfer, and after removing the protective film, the decorative layer and the intermediate layer in the non-image area are simultaneously peeled off. The other is a method of peeling off the protective film on the non-image area, subsequently peeling off the decorative layer and the intermediate layer at the same time, and further peeling off the protective film on the image area. From the viewpoint of protecting the image portion of the decorative layer until just before transfer, the latter is preferable.

(Ii) Die-cutting step Next, the die-cutting step in the method of forming the decorative layer, that is, the step of making a cut through the temporary support from the decorative layer into a part of the transfer film will be described below. .
There is no restriction | limiting in particular as the method of making the said cut like a half cut, It can cut with arbitrary methods, such as a blade and a laser, It is preferable to make a cut with a blade. Further, the structure of the blade is not particularly limited.
When the transfer film is composed of, for example, a temporary support, a thermoplastic resin layer, an intermediate layer, a decorative layer, and a protective film in that order, for example, using a blade or a laser, from above the protective film, By providing a cut through the protective film, the decorative layer, the intermediate layer, the thermoplastic resin layer, and the temporary support, it is possible to separate between the image portion to be transferred and the non-image portion not to be transferred.

The transfer step is a step of transferring the decorative layer of the transfer film from which the protective film has been removed onto a substrate.
At this time, a method is preferred in which the decorative layer of the transfer film is laminated on a substrate and then the temporary support is removed.
Transfer (bonding) of the decorative layer to the substrate surface is performed by stacking the decorative layer on the substrate surface, pressurizing and heating. For laminating, known laminators such as a laminator, a vacuum laminator, and an auto-cut laminator that can further increase productivity can be used.

The step of removing the thermoplastic resin layer and the intermediate layer can be performed using an alkaline developer generally used in a photolithography method, and the development used in the step of developing the exposed photocurable resin layer. The liquid can be used as well.

The method of removing the thermoplastic resin layer and the intermediate layer may be any of paddle, shower, shower & spin, dip, etc. used for developing the exposed photocurable resin layer.

It is preferable to include a post-baking step after the transfer step, and it is more preferable to include a step of performing post-baking after the step of removing the thermoplastic resin layer and the intermediate layer.
The decorative layer can be formed by heating the decorative layer after the transfer step in an environment of 0.08 to 1.2 atm at 180 to 300 ° C. to achieve both whiteness and productivity. It is preferable from the viewpoint.
The post-baking is more preferably performed in an environment of 0.5 atm or more. On the other hand, it is more preferable to carry out in an environment of 1.1 atm or less, and it is particularly preferred to carry out in an environment of 1.0 atm or less. Furthermore, it is more preferable to carry out in an environment of about 1 atm (atmospheric pressure) from the viewpoint of reducing the manufacturing cost without using a special decompression device. Here, conventionally, when the decorative layer (1) is formed by curing by heating, it is performed under a reduced pressure environment of a very low pressure, and the whiteness after baking is maintained by lowering the oxygen concentration. However, by using a transfer film formed using a coating liquid for a decorative layer containing the silicone resin, the whiteness of the decorative layer can be increased even after baking in the above pressure range.
The post-baking temperature is more preferably 200 to 280 ° C., and particularly preferably 220 to 260 ° C.
The post-baking time is more preferably 20 to 150 minutes, and particularly preferably 30 to 100 minutes.
The post-baking may be performed in an air environment or a nitrogen substitution environment, but it is particularly preferable to perform the post-bake from the viewpoint of reducing the manufacturing cost without using a special decompression device.

The formation method of a decoration layer may have other processes, such as a post-exposure process.
When the said decoration layer has a photocurable resin layer and forming the said decoration layer, it is preferable that a post-exposure process is included. The post-exposure step may be performed only from the surface direction of the decorative layer on the side in contact with the base material, or from only the surface direction of the side not in contact with the transparent base material, or from both sides. Also good.

As examples of the step of removing the thermoplastic resin layer and the intermediate layer and other steps, the method described in paragraphs 0035 to 0051 of JP-A-2006-23696 can be preferably used in the present invention. it can.

The transfer film having the photocurable resin layer may include a protective film and an intermediate layer in addition to the photocurable resin layer, the temporary support, and the thermoplastic resin layer.
The preferred configuration and order of lamination of each layer is the same except that a resin layer containing a colorant (preferably a photocurable resin layer containing a colorant) is used instead of the transparent resin film of the invention in the transfer film of the invention. .
The photocurable resin layer of the transfer film having the photocurable resin layer preferably has the following configuration.

There is no restriction | limiting in particular as long as it is not contrary to the meaning of this invention as said monomer used for the said photocurable resin layer, A well-known polymeric compound can be used.
As the polymerizable compound, the polymerizable compounds described in paragraphs 0023 to 0024 of Japanese Patent No. 4098550 can be used.

The binder used in the photocurable resin layer is not particularly limited as long as it is not contrary to the gist of the present invention, and a known polymerizable compound can be used.
When the transfer film having the photocurable resin layer is a negative material, the photocurable resin composition preferably contains an alkali-soluble resin, a polymerizable compound, and a polymerization initiator. Furthermore, although a coloring agent, an additive, etc. are used, it is not restricted to this.
As the alkali-soluble resin, polymers described in paragraph 0025 of JP2011-95716A and paragraphs 0033 to 0052 of JP2010-237589A can be used. On the other hand, when the decorative layer is formed by precutting, it is also preferable to use a silicone resin as the binder resin in the resin layer having the colorant as described above.
When the transfer film having the photocurable resin layer is a positive type material, for example, a material described in JP-A-2005-221726 is used for the photocurable resin layer, but is not limited thereto.

As the photopolymerization initiator used in the photocurable resin layer, the polymerizable compounds described in paragraphs 0031 to 0042 described in JP 2011-95716 A can be used.

-Additive-
Furthermore, an additive may be used for the photocurable resin layer. Examples of the additive include surfactants described in paragraph 0017 of Japanese Patent No. 4502784, paragraphs 0060-0071 of JP-A-2009-237362, and prevention of thermal polymerization described in paragraph 0018 of Japanese Patent No. 4502784. And other additives described in paragraphs 0058 to 0071 of JP-A No. 2000-310706.

-solvent-
In addition, as a solvent for producing a transfer film having a photocurable resin layer by coating, the solvents described in paragraphs 0043 to 0044 of JP-A-2011-95716 can be used.

Although the above description has focused on the case where the transfer film having the photocurable resin layer is a negative type material, the transfer film may be a positive type material.

(Viscosity of photocurable resin layer)
The viscosity of the photocurable resin layer measured at 100 ° C. is in the range of 2000 to 50000 Pa · sec, and preferably satisfies the following formula.
Viscosity of thermoplastic resin layer <viscosity of photocurable resin layer

<Transparent resin film>
In the conductive film laminate and the capacitive input device of the present invention, the step between the front plate and the decorative layer is filled with the transparent resin film of the present invention.

Although there is no restriction | limiting in particular as a method of filling the level | step difference of the said front board and the said decoration layer with the transparent resin film of this invention, The transfer by the half cut described in the formation method of the above-mentioned decoration layer is used for the transfer film of this invention. It is preferable that the transparent resin film of the present invention is prepared to have a size equivalent to the inner diameter of the decorative layer by using a method or a transfer method by die cutting, and the transparent resin film of the present invention is transferred to the front plate.
A preferred embodiment of the method for transferring the transparent resin film of the present invention to the front plate is the same as the preferred embodiment of the method for forming the decorative layer using the transfer film.
Meanwhile, the front plate and the decorative layer are prepared by applying or printing the liquid resist solution for the transparent resin film of the present invention on a step portion between the front plate and the decorative layer and curing by a known method. May be filled with the transparent resin film of the present invention.

In the conductive film laminate and the capacitive input device according to the present invention, the transparent resin film is heated to 180 to 300 ° C. in an environment of 0.08 to 1.2 atm. It is preferable from the viewpoint of compatibility. The preferable aspect of a heating is the same as the preferable aspect of the post-baking in the formation method of the said decoration layer.

<(3) A plurality of first transparent electrode patterns formed by extending a plurality of pad portions in the first direction via connection portions>
In the method of manufacturing the capacitance-type input device, at least one of the first transparent electrode pattern, the second transparent electrode pattern, and the conductive element, the temporary support and the photocurable resin layer are arranged in this order. It is preferable that the transparent conductive material is formed by etching using the etching pattern formed by the transfer film having, and the transfer film having a temporary support, a thermoplastic resin layer, and a curable resin layer in this order. More preferably, the transparent conductive material is etched by using the formed etching pattern.
Furthermore, at least one of the first transparent electrode pattern, the second transparent electrode pattern, and the conductive element includes a temporary support and a photocurable resin layer, and a transfer film having a photocurable resin layer It is more preferable to use an etching pattern formed by a transfer film having a photocurable resin layer having a temporary support, a thermoplastic resin layer, and a photocurable resin layer in this order. It is particularly preferable to use it.
On the other hand, the manufacturing method of the capacitance-type input device includes at least one of the first transparent electrode pattern, the second transparent electrode pattern, and the conductive element, a temporary support, a conductive curable resin layer, Are preferably formed using a transfer film having a temporary support, a thermoplastic resin layer, and a conductive curable resin layer in this order.
Forming at least one of the first transparent electrode pattern, the second transparent electrode pattern and the conductive element using a transfer film having a temporary support and a conductive curable resin layer in this order. Specifically, a transfer film having at least one of the first transparent electrode pattern, the second transparent electrode pattern, and the conductive element, a temporary support, and a conductive curable resin layer in this order. The conductive curable resin layer is transferred and formed.
That is, the first transparent electrode pattern 3 is preferably formed using a transfer film having an etching treatment or a conductive curable resin layer.

(Etching process)
When the first transparent electrode pattern 3 is formed by etching, first, a transparent electrode layer such as ITO is sputtered on one surface of the front plate 1 on which the decorative layer 2 or the transparent protective layer 7 is formed. Form. Next, etching is performed by exposure / development using a transfer film similar to the transfer film used for forming the decorative layer 2 except that the photocurable resin layer for etching is provided as the photocurable resin layer on the transparent electrode layer. Form a pattern. Thereafter, the transparent electrode layer is etched to pattern the transparent electrode, and the etching pattern is removed, whereby the first transparent electrode pattern 3 and the like can be formed.
Also when the transfer film having the photocurable resin layer is used as an etching resist (etching pattern), a resist pattern can be obtained in the same manner as in the above method. For the etching, etching or resist stripping can be applied by a known method described in paragraphs 0048 to 0054 of JP2010-152155A.

For example, as an etching method, there is a commonly performed wet etching method of dipping in an etching solution. As an etchant used for wet etching, an acid type or alkaline type etchant may be appropriately selected in accordance with an object to be etched. Examples of acidic etching solutions include aqueous solutions of acidic components such as hydrochloric acid, sulfuric acid, hydrofluoric acid, and phosphoric acid, and mixed aqueous solutions of acidic components and salts of ferric chloride, ammonium fluoride, potassium permanganate, and the like. Is done. As the acidic component, a combination of a plurality of acidic components may be used. In addition, alkaline type etching solutions include sodium hydroxide, potassium hydroxide, ammonia, organic amines, aqueous solutions of alkali components such as organic amine salts such as tetramethylammonium hydroxide, alkaline components and potassium permanganate. A mixed aqueous solution of a salt such as A combination of a plurality of alkali components may be used as the alkali component.

The temperature of the etching solution is not particularly limited, but is preferably 45 ° C. or lower. The resin pattern used as an etching mask (etching pattern) in the present invention is particularly excellent for acidic and alkaline etching solutions in such a temperature range by being formed using the decorative layer described above. Demonstrate resistance. Therefore, the resin pattern is prevented from peeling off during the etching process, and the portion where the resin pattern does not exist is selectively etched.
After the etching, a cleaning process and a drying process may be performed as necessary to prevent line contamination. The cleaning process is performed by cleaning the substrate with pure water for 10 to 300 seconds at room temperature, for example, and the air blowing pressure (about 0.1 to 5 kg / cm ² ) is appropriately adjusted using an air blow for the drying process. Just do it.

Next, the method of peeling the resin pattern is not particularly limited, and examples thereof include a method of immersing the substrate in a peeling solution being stirred at 30 to 80 ° C., preferably 50 to 80 ° C. for 5 to 30 minutes. The resin pattern used as an etching mask in the present invention exhibits excellent chemical resistance at 45 ° C. or lower as described above, but exhibits a property of swelling by an alkaline stripping solution when the chemical temperature is 50 ° C. or higher. . Due to such properties, when the peeling process is performed using a peeling solution of 50 to 80 ° C., there are advantages that the process time is shortened and the resin pattern peeling residue is reduced. That is, by providing a difference in chemical temperature between the etching process and the peeling process, the resin pattern used as an etching mask in the present invention exhibits good chemical resistance in the etching process, while in the peeling process. Good peelability will be exhibited, and both conflicting properties of chemical resistance and peelability can be satisfied.

Examples of the stripping solution include inorganic alkali components such as sodium hydroxide and potassium hydroxide, organic alkali components such as tertiary amine and quaternary ammonium salt, water, dimethyl sulfoxide, N-methylpyrrolidone, or these. A stripping solution dissolved in a mixed solution of You may peel by the spray method, the shower method, the paddle method etc. using the said peeling liquid.

(Method using transfer film having conductive curable resin layer)
The transfer film having a temporary support and a curable resin layer can be used as a lift-off material to form the first transparent electrode pattern, the second transparent electrode pattern, and other conductive members. The transfer film As an example, a transfer film having the photo-curable resin layer can be used. Also in this case, the transfer film having the temporary support and the curable resin layer preferably has the thermoplastic resin layer between the temporary support and the curable resin layer. In this case, after patterning using a transfer film having a photocurable resin layer, after forming a transparent conductive layer on the entire surface of the substrate, the transfer film having a decorative layer or a photocurable resin layer together with the deposited transparent conductive layer A desired transparent conductive layer pattern can be obtained by dissolving and removing the photocurable resin layer in (lift-off method).

When the first transparent electrode pattern 3 is formed using a transfer film having a conductive curable resin layer, the first transparent electrode pattern 3 may be formed by transferring the conductive curable resin layer to the surface of the front plate 1. it can.

When the first transparent electrode pattern 3 is formed using a transfer film having the conductive curable resin layer, the front plate (substrate) having an opening has no resist component leakage from the opening, and the back side of the front plate. In a simple process, the touch panel can be manufactured with a merit of thinning and weight reduction.
Furthermore, in forming the first transparent electrode pattern 3, a transfer film having a specific layer structure having a thermoplastic resin layer between the conductive curable resin layer and the temporary support is used to laminate the transfer film. Bubble generation is prevented, and the first transparent electrode pattern 3 having excellent conductivity and low resistance can be formed.

Further, when the transfer film has a conductive curable resin layer, the conductive curable resin layer contains conductive fibers and the like.

-Conductive curable resin layer (conductive fiber)-
When the transfer film on which the conductive curable resin layer is laminated is used for forming a transparent electrode pattern or another conductive element, the following conductive fibers can be used for the conductive curable resin layer.

There is no restriction | limiting in particular as a structure of an electroconductive fiber, Although it can select suitably according to the objective, A solid structure or a hollow structure is preferable.
Here, the fiber having a solid structure may be referred to as “wire”, and the fiber having a hollow structure may be referred to as “tube”. A conductive fiber having an average minor axis length of 1 nm to 1,000 nm and an average major axis length of 1 μm to 100 μm may be referred to as “nanowire”.
In addition, a conductive fiber having an average minor axis length of 1 nm to 1,000 nm, an average major axis length of 0.1 μm to 1,000 μm, and having a hollow structure may be referred to as “nanotube”.
The material of the conductive fiber is not particularly limited as long as it has conductivity, and can be appropriately selected according to the purpose. However, at least one of metal and carbon is preferable, and among these, The conductive fiber is particularly preferably at least one of metal nanowires, metal nanotubes, and carbon nanotubes.

-Metal nanowires-
--metal--
The material of the metal nanowire is not particularly limited. For example, at least one metal selected from the group consisting of the fourth period, the fifth period, and the sixth period of the long periodic table (IUPAC 1991) is preferable. More preferably, at least one metal selected from Group 2 to Group 14 is selected from Group 2, Group 8, Group 9, Group 10, Group 11, Group 12, Group 13, and Group 14. At least one metal selected from the group is more preferable, and it is particularly preferable to include it as a main component.

Examples of the metal include copper, silver, gold, platinum, palladium, nickel, tin, cobalt, rhodium, iridium, iron, ruthenium, osmium, manganese, molybdenum, tungsten, niobium, tantel, titanium, bismuth, antimony, and lead. And alloys thereof. Among these, in view of excellent conductivity, those mainly containing silver or those containing an alloy of silver and a metal other than silver are preferable.
Containing mainly silver means that the metal nanowire contains 50% by mass or more, preferably 90% by mass or more.
Examples of the metal used in the alloy with silver include platinum, osmium, palladium and iridium. These may be used alone or in combination of two or more.

--shape--
There is no restriction | limiting in particular as a shape of the said metal nanowire, According to the objective, it can select suitably, For example, it can take arbitrary shapes, such as a column shape, a rectangular parallelepiped shape, and the column shape from which a cross section becomes a polygon. In applications where high transparency is required, a cylindrical shape and a cross-sectional shape with rounded polygonal corners are preferred.
The cross-sectional shape of the metal nanowire can be examined by applying a metal nanowire aqueous dispersion on a substrate and observing the cross-section with a transmission electron microscope (TEM).
The corner of the cross section of the metal nanowire means a peripheral portion of a point that extends each side of the cross section and intersects with a perpendicular drawn from an adjacent side. Further, “each side of the cross section” is a straight line connecting these adjacent corners. In this case, the ratio of the “outer peripheral length of the cross section” to the total length of the “each side of the cross section” was defined as the sharpness. For example, in the metal nanowire cross section as shown in FIG. 9, the sharpness can be represented by the ratio of the outer peripheral length of the cross section indicated by the solid line and the outer peripheral length of the pentagon indicated by the dotted line. A cross-sectional shape having a sharpness of 75% or less is defined as a cross-sectional shape having rounded corners. The sharpness is preferably 60% or less, and more preferably 50% or less. If the sharpness exceeds 75%, the electrons may be localized at the corners, and plasmon absorption may increase, or the transparency may deteriorate due to yellowing or the like. Moreover, the linearity of the edge part of a pattern may fall and a shakiness may arise. The lower limit of the sharpness is preferably 30%, more preferably 40%.

--- Average minor axis length and average major axis length--
The average minor axis length of the metal nanowire (sometimes referred to as “average minor axis diameter” or “average diameter”) is preferably 150 nm or less, more preferably 1 nm to 40 nm, still more preferably 10 nm to 40 nm, 15 nm to 35 nm is particularly preferable.
When the average minor axis length is less than 1 nm, the oxidation resistance may be deteriorated and the durability may be deteriorated. When the average minor axis length is more than 150 nm, scattering due to metal nanowires occurs and sufficient transparency is obtained. There are times when you can't.
The average minor axis length of the metal nanowires was determined by observing 300 metal nanowires using a transmission electron microscope (TEM; manufactured by JEOL Ltd., JEM-2000FX). The average minor axis length of was determined. In addition, the shortest axis length when the short axis of the metal nanowire is not circular is the shortest axis.

The average major axis length (sometimes referred to as “average length”) of the metal nanowire is preferably 1 μm to 40 μm, more preferably 3 μm to 35 μm, and even more preferably 5 μm to 30 μm.
If the average major axis length is less than 1 μm, it may be difficult to form a dense network and sufficient conductivity may not be obtained. If it exceeds 40 μm, the metal nanowires are too long and manufactured. Sometimes entangled and agglomerates may occur during the manufacturing process.
The average major axis length of the metal nanowires was measured using, for example, a transmission electron microscope (TEM; manufactured by JEOL Ltd., JEM-2000FX), and 300 metal nanowires were observed. The average major axis length of the wire was determined. In addition, when the said metal nanowire was bent, the circle | round | yen which makes it an arc was considered and the value calculated from the radius and curvature was made into the major axis length.

The thickness of the conductive curable resin layer is preferably from 0.1 to 20 μm, more preferably from 0.5 to 18 μm, from the viewpoint of process stability such as the stability of the coating solution and the drying time during coating and the development time during patterning. 1 to 15 μm is preferable. The content of the conductive fiber with respect to the total solid content of the conductive curable resin layer is preferably 0.01 to 50% by mass, and 0.05 to 30% by mass from the viewpoint of conductivity and stability of the coating solution. Is more preferable, and 0.1 to 20% by mass is particularly preferable.

<(4) A plurality of second electrode patterns composed of a plurality of pad portions that are electrically insulated from the first transparent electrode pattern and extend in a direction crossing the first direction>

The second electrode pattern is preferably a transparent electrode pattern. The second transparent electrode pattern 4 can be formed by using the etching process or a transfer film having the conductive curable resin layer. A preferred embodiment at that time is the same as the method for forming the first transparent electrode pattern 3.

<(5) Insulating layer that electrically insulates the first transparent electrode pattern and the second transparent electrode pattern>
When the insulating layer 5 is formed, a first transparent electrode pattern is formed using a transfer film having the photocurable resin layer having an insulating photocurable resin layer as the photocurable resin layer. Further, it can be formed by transferring an insulating photocurable resin layer to the surface of the front plate 1.
When forming an insulating layer using a transfer film, the thickness of the insulating layer is preferably 0.1 to 5 μm, more preferably 0.3 to 3 μm, more preferably 0.5 to 3 μm from the viewpoint of maintaining insulation. 2 μm is particularly preferable.

<(6) Conductivity that is electrically connected to at least one of the first transparent electrode pattern and the second transparent electrode pattern and is different from the first transparent electrode pattern and the second transparent electrode pattern Element>
The another conductive element 6 can be formed using the etching process or a transfer film having the conductive curable resin layer.

<(7) Transparent protective layer>
When forming the transparent protective layer 7, the front plate on which each element is formed using a transfer film having the photocurable resin layer having a transparent photocurable resin layer as the photocurable resin layer It can be formed by transferring a transparent photocurable resin layer to the surface of 1.
In the case of forming a transparent protective layer using a transfer film, the thickness of the transparent protective layer is preferably 0.5 to 10 μm, more preferably 0.8 to 5 μm, from the viewpoint of exhibiting sufficient surface protection ability. Particularly preferred is ˜3 μm.

<Image display device>
An image display device including the capacitive input device of the present invention as a constituent element is “latest touch panel technology” (published July 6, 2009, Techno Times), supervised by Yuji Mitani, “Touch Panel Technology and Development. The configurations disclosed in CM Publishing (2004, 12), FPD International 2009 Forum T-11 Lecture Textbook, Cypress Semiconductor Corporation Application Note AN2292, etc. can be applied.

Hereinafter, the present invention will be described more specifically with reference to examples.
The materials, amounts used, ratios, processing details, processing procedures, and the like shown in the following examples can be changed as appropriate without departing from the spirit of the present invention. Therefore, the scope of the present invention should not be construed as being limited by the specific examples shown below. Unless otherwise specified, “%” and “parts” are based on mass.

[Example 1]
-Production of transfer film for embedding steps-
On a polyethylene terephthalate film (temporary support) having a thickness of 75 μm, a thermoplastic resin layer coating solution: Formulation H1 was applied using a slit nozzle and dried to form a thermoplastic resin layer. Next, the intermediate layer coating solution: Formulation P1 was applied on the thermoplastic resin layer and dried to form an intermediate layer. Furthermore, the transparent resin film coating liquid: Formulation C1 was applied on the intermediate layer and dried to form the transparent resin film of Example 1. Thus, the thermoplastic resin layer having a dry film thickness of 15.1 μm, the intermediate layer having a dry film thickness of 1.6 μm, and the transparent resin film of Example 1 having a dry film thickness of 35 μm on the temporary support. Provided. The transparent resin film has a size equivalent to the inner diameter of the frame of the white decorative layer. Finally, a protective film (12 μm thick polypropylene film) was pressure-bonded on the transparent resin film of Example 1. In this way, the transfer film of Example 1 for step embedding was produced in which the temporary support, the thermoplastic resin layer, the intermediate layer (oxygen barrier film), the transparent resin film of Example 1 and the protective film were integrated.

(Coating solution for thermoplastic resin layer: Formulation H1)
Methanol: 11.1 parts by mass Propylene glycol monomethyl ether acetate: 6.36 parts by mass Methyl ethyl ketone: 52.4 parts by mass Methyl methacrylate / 2-ethylhexyl acrylate / benzyl methacrylate / methacrylic acid copolymer (copolymerization composition ratio) (Molar ratio)
= 55 / 11.7 / 4.5 / 28.8,
Weight average molecular weight = 100,000, Tg (glass transition temperature) ≒ 70 ° C)
: 5.83 parts by mass-Styrene / acrylic acid copolymer (copolymerization composition ratio (molar ratio) = 63/37,
Weight average molecular weight = 10,000, Tg≈100 ° C.): 13.6 parts by mass / monomer 1 (trade name: BPE-500, manufactured by Shin-Nakamura Chemical Co., Ltd.)
: 9.1 parts by mass / surfactant (fluorine polymer, trade name: Megafak F780F,
Manufactured by Dainippon Ink and Chemicals Incorporated): 0.54 parts by mass The above fluorine-containing _{_{_{polymer, C 6 F 13 CH 2 CH}}} 2 OCOCH = CH 2 40 parts of _{H (OCH (CH 3) CH} 2) 7 OCOCH = a copolymer of CH ₂ 55 parts of _{_{H (OCHCH 2) 7 OCOCH =}} CH 2 5 parts, weight average molecular weight 30,000, methyl ethyl ketone 30 wt% solution.
The viscosity at 120 ° C. after removing the solvent from the coating solution for thermoplastic resin layer: Formulation H1 was 1500 Pa · sec.

(Coating liquid for intermediate layer: prescription P1)
Polyvinyl alcohol: 32.2 parts by mass (trade name: PVA205, manufactured by Kuraray Co., Ltd., saponification degree = 88%, polymerization degree 550)
・ Polyvinylpyrrolidone: 14.9 parts by mass (trade name: K-30, manufactured by IS Japan Co., Ltd.)
-Distilled water: 524 parts by mass-Methanol: 429 parts by mass

(Coating liquid for transparent resin film: prescription C1)
・ Methyl ethyl ketone (manufactured by Tonen Chemical Co., Ltd.): 20 parts by mass ・ Silicone resin KR-300 (manufactured by Shin-Etsu Chemical Co., Ltd .; xylene solution of straight silicone (solid content: 50% by mass)): 268 parts by mass (Irgafos 168, manufactured by BASF Corp.): 0.25 parts by mass. Surfactant (trade name: Megafac F-780F, manufactured by DIC Corp.): 1 part by mass

-Production of transfer film L1 for forming white decorative layer (frame shape) for touch panel-
On a polyethylene terephthalate film (temporary support) having a thickness of 75 μm, a thermoplastic resin layer coating solution: Formulation H1 was applied using a slit nozzle and dried to form a thermoplastic resin layer. Next, the intermediate layer coating solution: Formulation P1 was applied and dried to form an intermediate layer. Further, a decorative layer coating solution: Formula L1 was applied and dried to form a decorative layer. In this way, a thermoplastic resin layer having a dry film thickness of 15.1 μm, an intermediate layer having a dry film thickness of 1.6 μm, and a white decorative layer having a dry film thickness of 35 μm were provided on the temporary support. . Finally, a protective film (thickness 12 μm polypropylene film) on the decorative layer was pressure-bonded. In this way, a transfer film for forming a white decorative layer was produced in which the temporary support, the thermoplastic resin layer, the intermediate layer (oxygen barrier film), the decorative layer, and the protective film were integrated.

(Coating liquid for decorative layer: Formula L1)
・ Methyl ethyl ketone (manufactured by Tonen Chemical Co., Ltd.): 56 parts by mass ・ Silicone resin KR-300 (manufactured by Shin-Etsu Chemical Co., Ltd.);
Straight silicone xylene solution (solid content 50% by mass): 584 parts by mass. Silicone resin catalyst D-15 (manufactured by Shin-Etsu Chemical Co., Ltd.);
Xylene solution (solid content: 25% by mass): 12 parts by mass, white pigment dispersion 1 (the following composition): 346 parts by mass, antioxidant (Irgafos168, manufactured by BASF Corp.): 0.6 parts by mass, interface Activator (Brand name: MegaFuck F-780F, manufactured by DIC Corporation)
: 2.2 parts by mass

-Composition of white pigment dispersion 1-
・ Titanium oxide (CR97 manufactured by Ishihara Sangyo; alumina / zirconia-treated rutile type,
Primary particle diameter 0.25 μm): 70.0 mass%
-Random copolymer of benzyl methacrylate / methacrylic acid = 72/28 molar ratio (weight average molecular weight 37,000): 3.5% by mass
・ Methyl ethyl ketone (manufactured by Tonen Chemical Co., Ltd.): 26.5% by mass

Using a CO ₂ laser cutter (L-CPNC550, manufactured by Climb Products Co., Ltd.), transfer the white decorative layer-forming transfer film (protective film, A decorative layer, an intermediate layer, a thermoplastic resin layer, and a temporary support were penetrated from the protective film side and punched out. As shown in FIG. 3, the white decorative layer-forming transfer film after punching is formed with an outer peripheral portion 42, a frame interior 41 having a straight portion, and a wiring extraction portion 43 having a straight portion.
By this punching, a white decorative layer forming transfer film after punching having the shape of FIG. 10 was formed.

-Preparation of front plate with decorative layer (frame shape)-
Using glass (300 mm × 400 mm × 0.7 mm) tempered glass with an opening (15 mmΦ) as a transparent front plate (glass substrate) and spraying a glass detergent solution adjusted to 25 ° C. for 20 seconds with a shower Washed with a rotating brush with nylon bristles, washed with pure water shower, then silane coupling liquid (N-β (aminoethyl) γ-aminopropyltrimethoxysilane 0.3% by weight aqueous solution, trade name: KBM603, Shin-Etsu Chemical Co., Ltd.) (Made by Co., Ltd.) was sprayed for 20 seconds with a shower and washed with pure water. This glass substrate was preheated at 90 ° C. for 2 minutes with a substrate preheating apparatus.

As shown in FIGS. 11 and 12, the white decorative layer forming transfer film punched with the blade 33 (the white decorative layer forming transfer film after punching) is protected with a tape. Only 25 was peeled off, and similarly, the two layers of the decorative layer 24 and the intermediate layer 23 of the non-image part 31 were peeled off simultaneously using a tape. Further, only the protective film 25 in the region corresponding to the image portion 32 was peeled off.
The surface of the decorative layer 24 of the image portion 32 exposed after peeling off the protective film 25 and the surface of the tempered glass that has been preheated at 90 ° C. and that has been subjected to the silane coupling treatment are overlapped to form a laminator (Co., Ltd.). ) Using Hitachi Industries (Lamic II type)), lamination was performed at a rubber roller temperature of 120 ° C., a linear pressure of 100 N / cm, and a conveying speed of 2.5 m / min. Subsequently, the polyethylene terephthalate temporary support 21 was peeled off at the interface with the thermoplastic resin layer 22 to remove the temporary support 21.
As a result, the decorative layer 24, the intermediate layer 23, and the thermoplastic resin layer 22 are transferred from the white decorative layer forming transfer film to the image portion 32 of the glass substrate, and are transferred to the non-image portion 31 of the glass substrate. Only the thermoplastic resin layer 22 was transferred from the white decorative layer forming transfer film.

Next, using a triethanolamine developer (containing 30% by mass of triethanolamine, trade name: T-PD2 (manufactured by Fuji Film Co., Ltd.) diluted 10 times with pure water) at 30 ° C. For 60 seconds, shower development was performed at a flat nozzle pressure of 0.1 MPa to remove the thermoplastic resin layer 22 and the intermediate layer 23 of the image portion 32 and the thermoplastic resin layer 22 of the non-image portion 31 of the glass substrate. Subsequently, air was blown onto the upper surface of the glass base material to drain the liquid, and then pure water was sprayed for 10 seconds by a shower, pure water shower washing was performed, and air was blown to reduce a liquid pool on the glass base material.
Thereafter, post-baking treatment was performed at 240 ° C. for 60 minutes in air under atmospheric pressure (1 atm) to form a decorative layer 24, and a decorative layer having a thickness of 35 μm was formed on the upper surface of the glass substrate. A front plate was obtained.

-Inserting transparent resin film-
Using the CO ₂ laser cutter (L-CPNC550, manufactured by Crime Products Co., Ltd.), the transfer film for embedding the steps (protective film, transparent) A resin film, an intermediate layer, a thermoplastic resin layer, and a temporary support were penetrated from the protective film side and punched out. The transfer film for embedding the step after punching is punched so as to fit inside the white decorative layer (frame shape) (region where the white decorative layer is not formed).

The front plate on which the decorative layer was formed was preheated at 90 ° C. for 2 minutes with a base material preheating device.
For the transfer film of Example 1 for embedding a step after punching, only the protective film of the non-image part is peeled off using a tape, and the transparent resin film and the intermediate layer 2 of the non-image part are similarly peeled off using the tape. The layers were peeled simultaneously. Further, only the protective film in the region corresponding to the image area was peeled off.
Example 1 for embedding a step so that the surface of the transparent resin film in the image area exposed after peeling off the protective film is in contact with the surface of the tempered glass pretreated at 90 ° C. and subjected to the silane coupling treatment. Laminator (Hitachi Co., Ltd.) was designed so that the transfer film of the white decorative layer was fitted so that there was no gap in the frame of the white decorative layer and did not rise above the white decorative layer (equivalent to the inner diameter of the white decorative layer). Lamination was performed at a rubber roller temperature of 120 ° C., a linear pressure of 100 N / cm, and a conveyance speed of 2.5 m / min. Subsequently, the polyethylene terephthalate temporary support was peeled off at the interface with the thermoplastic resin layer to remove the temporary support.

Next, using a triethanolamine developer (containing 30% by mass of triethanolamine, trade name: T-PD2 (manufactured by Fuji Film Co., Ltd.) diluted 10 times with pure water) at 30 ° C. For 60 seconds, shower development was performed at a flat nozzle pressure of 0.1 MPa to remove the thermoplastic resin layer 22 and the intermediate layer 23 of the image portion 32 and the thermoplastic resin layer 22 of the non-image portion 31 of the glass substrate. Subsequently, air was blown onto the upper surface of the glass base material to drain the liquid, and then pure water was sprayed for 10 seconds by a shower, pure water shower washing was performed, and air was blown to reduce a liquid pool on the glass base material.
Thereafter, post-baking treatment is performed at 240 ° C. for 60 minutes in the air under atmospheric pressure (1 atm), and the transparent resin film of Example 1 has no gap in the frame of the white decorative layer. The front plate was obtained so that it would not rise up.

(Evaluation of transparency)
The front plate with the transparent resin film fitted in the frame of the white decorative layer produced as described above was observed by 60 people, and the transparency of the transparent resin film was evaluated according to the following evaluation criteria. The practical level is C or higher.
<Evaluation criteria>
A: Number of people recognized as yellowish 0 to 1 B: Number of people recognized as yellowish 2 to 3 people C: Number of people recognized as yellowish 4 to 5 people D: Number of people recognized as yellowish 6-10 people E: Number of people recognized as yellowish 11 or more Evaluation results are shown in Table 1 below.

-Manufacture of capacitive input devices-
<Formation of first transparent electrode pattern>
<Formation of transparent electrode layer>
A front plate on which a decorative layer and a transparent resin film in which a step of the decorative layer is embedded is formed is introduced into a vacuum chamber, and an ITO target having a SnO ₂ content of 10 mass% (indium: tin = 95: 5). (Molar ratio)) is used to form an ITO thin film having a thickness of 40 nm by DC magnetron sputtering (conditions: substrate temperature 250 ° C., argon pressure 0.13 Pa, oxygen pressure 0.01 Pa), and a transparent electrode layer is formed. A formed front plate was obtained. The surface resistance of the ITO thin film was 80Ω / □.

<Preparation of transfer film E1 for etching>
In the production of the white decorative layer forming transfer film L1, the white decorative layer was used except that the decorative layer coating solution: prescription L1 was used instead of the etching photocurable resin layer coating solution: prescription E1. The transfer film for etching in which the temporary support, the thermoplastic resin layer, the intermediate layer (oxygen barrier film), the photocurable resin layer for etching, and the protective film are integrated as in the production of the transfer film for formation L1. E1 was obtained (the film thickness of the photocurable resin layer for etching was 2.0 μm).

(Coating liquid for photocurable resin layer for etching: prescription E1)
Methyl methacrylate / styrene / methacrylic acid copolymer (copolymer composition (mass%): 31/40/29, mass average molecular weight 60000,
Acid value 163 mg KOH / g): 16 parts by mass Monomer 1 (Brand name: BPE-500, manufactured by Shin-Nakamura Chemical Co., Ltd.): 5.6 parts by mass Tetraethylene oxide monomethacrylate 0.5 mol addition of hexamethylene diisocyanate Product: 7 parts by mass-cyclohexane dimethanol monoacrylate as a compound having one polymerizable group in the molecule: 2.8 parts by mass-2-chloro-N-butylacridone: 0.42 parts by mass-2,2 -Bis (o-chlorophenyl) -4,4 ', 5,5'-tetraphenylbiimidazole: 2.17 parts by mass, leuco crystal violet: 0.26 parts by mass, phenothiazine: 0.013 parts by mass, surfactant (Product name: Megafuck F-780F, Dainippon Inn (Ki Co., Ltd.)
: 0.03 parts by mass · Methyl ethyl ketone: 40 parts by mass · 1-methoxy-2-propanol: 20 parts by mass

<Formation of first transparent electrode pattern>
In the same manner as the cleaning of the tempered glass in the formation of the decorative layer, the decorative layer, the transparent resin film in which the step of the decorative layer is embedded, and the front plate on which the transparent electrode layer is formed are cleaned, and then the protective film is applied. The removed transfer film E1 for etching was laminated (base material temperature: 130 ° C., rubber roller temperature 120 ° C., linear pressure 100 N / cm, conveyance speed 2.2 m / min). After peeling off the temporary support, the distance between the exposure mask (quartz exposure mask having a transparent electrode pattern) surface and the photocurable resin layer for etching is set to 200 μm, and the exposure amount is 50 mJ / cm ² (i-line). ) For pattern exposure.
Next, using a triethanolamine developer (containing 30% by mass of triethanolamine, trade name: T-PD2 (manufactured by FUJIFILM Corporation) diluted 10 times with pure water) at 25 ° C. Developed for 100 seconds, washed with surfactant-containing cleaning solution (trade name: T-SD3 (manufactured by FUJIFILM Corporation) 10 times with pure water) at 33 ° C. for 20 seconds, The front plate was rubbed with a rotating brush, and the residue was removed by spraying pure water from an ultra-high pressure cleaning nozzle. Further, a post-baking treatment at 130 ° C. for 30 minutes is performed to form a decorative layer, a transparent resin film in which a step of the decorative layer is embedded, a transparent electrode layer, and a photocurable resin layer pattern for etching. Obtained.

An ITO etchant (hydrochloric acid, potassium chloride aqueous solution, liquid temperature 30 ° C.) is used as a decorative layer, a transparent resin film in which a step of the decorative layer is embedded, a transparent electrode layer, and a photocurable resin layer pattern for etching. ), And 100 seconds of treatment (etching treatment) to dissolve and remove the exposed transparent electrode layer that is not covered with the photo-curable resin layer for etching. A front plate with a transparent electrode layer pattern with a transparent resin film in which the step of the layer was embedded and a photocurable resin layer pattern for etching was obtained.

Next, a front plate with a transparent electrode layer pattern with a photocurable resin layer pattern for etching is applied to a resist stripping solution (N-methyl-2-pyrrolidone, monoethanolamine, a surfactant (trade name: Surfynol 465). , Manufactured by Air Products Co., Ltd., liquid temperature 45 ° C), immersed in a resist stripping tank, treated for 200 seconds (peeling treatment), removed the photocurable resin layer for etching, decorated layer, The transparent resin film in which the step is embedded, the first surface of the front plate, and the surface of the decorative layer that is disposed on both sides of the surface opposite to the surface facing the front plate are installed as shown in FIG. A front plate having one transparent electrode pattern was obtained.

<Formation of insulating layer>
<Preparation of transfer film W1 for forming an insulating layer>
In the production of the decorative layer-forming transfer film L1, the decorative layer-forming transfer film L1 was prepared in place of the decorative layer-forming coating solution: Formula W1, instead of the insulating layer-forming coating solution: Formula W1. Similarly, a transfer film W1 for forming an insulating layer was obtained in which a temporary support, a thermoplastic resin layer, an intermediate layer (oxygen barrier film), a photocurable resin layer for an insulating layer, and a protective film were integrated ( The film thickness of the photocurable resin layer for the insulating layer is 1.4 μm).

(Insulating layer forming coating solution: Formula W1)
Binder 3 (cyclohexyl methacrylate (a) / methyl methacrylate (b) / methacrylic acid copolymer (c) glycidyl methacrylate adduct (d) (composition (mass%): a / b / c / d = 46/1 / 10/43, mass average molecular weight: 36000, acid value 66 mgKOH / g) 1-methoxy-2-propanol, methyl ethyl ketone solution (solid content: 45%)): 12.5 parts by mass DPHA (dipentaerythritol hexaacrylate) Manufactured by Nippon Kayaku Co., Ltd.)
Propylene glycol monomethyl ether acetate solution (76% by mass)
: 1.4 parts by mass, urethane monomer (trade name: NK Oligo UA-32P, manufactured by Shin-Nakamura Chemical Co., Ltd .: non-volatile content 75%, propylene glycol monomethyl ether acetate:
25%): 0.68 parts by mass. Tripentaerythritol octaacrylate (trade name: V # 802,
Osaka Organic Chemical Industry Co., Ltd.): 1.8 parts by mass. Diethylthioxanthone: 0.17 parts by mass. 2- (dimethylamino) -2-[(4-methylphenyl) methyl] -1-
[4- (4-morpholinyl) phenyl] -1-butanone (trade name: Irgacure 379, manufactured by BASF): 0.17 parts by mass Dispersant (trade name: Solsperse 20000, manufactured by Avicia): 0.19 parts by mass, interface Activator (Brand name: Megafuck F-780F, manufactured by Dainippon Ink)
: 0.05 parts by mass-Methyl ethyl ketone: 23.3 parts by mass-MMPGAc (manufactured by Daicel Chemical Co., Ltd.): 59.8 parts by mass The viscosity at 100 ° C. after removing the solvent of the coating liquid W1 for forming the insulating layer is 4000 Pa.・ It was sec.

In the same manner as the cleaning of the tempered glass substrate in the formation of the decorative layer, after washing the decorative layer, the transparent resin film in which the step of the decorative layer is embedded, the front plate with the first transparent electrode pattern, A transfer film W1 for forming an insulating layer, which was subjected to silane coupling treatment and from which the protective film was removed, was laminated (base material temperature: 100 ° C., rubber roller temperature 120 ° C., linear pressure 100 N / cm, conveyance speed 2.3 m / min). After peeling off the temporary support, the distance between the exposure mask (quartz exposure mask having the insulating layer pattern) surface and the insulating layer was set to 100 μm, and pattern exposure was performed at an exposure amount of 30 mJ / cm ² (i-line). .

Next, using a triethanolamine developer (containing 30% by mass of triethanolamine, trade name: T-PD2 (manufactured by FUJIFILM Corporation) diluted 10 times with pure water) at 33 ° C. Using a sodium carbonate / sodium hydrogen carbonate developer (trade name: T-CD1 (manufactured by Fuji Film Co., Ltd.) diluted 5 times with pure water) at 25 ° C. for 60 seconds. Developed for 50 seconds. Next, using a surfactant-containing cleaning solution (trade name: T-SD3 (manufactured by FUJIFILM Corporation) diluted 10-fold with pure water), cleaning was performed at 33 ° C. for 20 seconds, and the surface was cleaned with a rotating brush. The residue was removed by rubbing the face plate and spraying pure water from an ultra-high pressure cleaning nozzle. Further, a post-baking treatment at 230 ° C. for 60 minutes was performed to obtain a front plate on which a decorative layer, a transparent resin film in which a step of the decorative layer was embedded, a first transparent electrode pattern, and an insulating layer pattern were formed.

<< Formation of second transparent electrode pattern >>
<Formation of transparent electrode layer>
In the same manner as the formation of the first transparent electrode pattern, a front plate on which a decorative layer, a transparent resin film in which a step of the decorative layer is embedded, a first transparent electrode pattern, and an insulating layer pattern is formed is formed using a DC magnetron. Sputtering treatment (conditions: substrate temperature 50 ° C., argon pressure 0.13 Pa, oxygen pressure 0.01 Pa), forming an ITO thin film with a thickness of 80 nm, and transparent in which a decorative layer and a step of the decorative layer are embedded A front plate on which a resin film, a first transparent electrode pattern, an insulating layer pattern, and a transparent electrode layer were formed was obtained. The surface resistance of the ITO thin film was 110Ω / □.

Similarly to the formation of the first transparent electrode pattern, using the etching transfer film E1, the decorative layer, the transparent resin film in which the step of the decorative layer is embedded, the first transparent electrode pattern, the insulating layer pattern, A front plate on which a transparent electrode layer and a photocurable resin layer pattern for etching were formed was obtained (post-bake treatment; 130 ° C., 30 minutes).
Further, in the same manner as the formation of the first transparent electrode pattern, an etching process (30 ° C., 50 seconds) is performed, and then the photocurable resin layer for etching is removed (peeling process: 45 ° C., 200 seconds). The decorative layer, the transparent resin film in which the step of the decorative layer is embedded, the first transparent electrode pattern, the insulating layer pattern, one surface of the front plate and the surface of the decorative layer facing the front plate A front plate having a second transparent electrode pattern formed as shown in FIG. 1 across both regions on the opposite surface was obtained.

<< Formation of Conductive Element Separate from First and Second Transparent Electrode Pattern >>
Similarly to the formation of the first and second transparent electrode patterns, a decorative layer, a transparent resin film in which a step of the decorative layer is embedded, a first transparent electrode pattern, an insulating layer pattern, a second transparent The front plate on which the electrode pattern was formed was subjected to DC magnetron sputtering treatment to obtain a front plate on which a 200 nm thick aluminum (Al) thin film was formed.

Similarly to the formation of the first and second transparent electrode patterns, using the etching transfer film E1, a decorative layer, a transparent resin film in which the step of the decorative layer is embedded, and the first transparent electrode pattern A front plate on which an insulating layer pattern, a second transparent electrode pattern, an aluminum thin film, and a photocurable resin layer pattern for etching were formed was obtained (post-bake treatment; 130 ° C., 30 minutes).
Further, in the same manner as the formation of the first transparent electrode pattern, by etching (30 ° C., 50 seconds), and then removing the photocurable resin layer for etching (peeling treatment: 45 ° C., 200 seconds), The decorative layer, the transparent resin film in which the step of the decorative layer is embedded, the first transparent electrode pattern, the insulating layer pattern, the second transparent electrode pattern, and the conductivity different from the first and second transparent electrode patterns A front plate on which the elements were formed was obtained.

<Preparation of transparent protective layer>
(Method for forming transparent protective layer-A)
Using the coating solution formulation 1 for photosensitive resin layer described in Example 1 of JP2012-78528A, according to the method described in paragraphs 0103 to 0113 of the same publication, a temporary support (PET) and a thermoplastic resin A photosensitive transfer film in which a layer, an intermediate layer, and a photosensitive resin layer were integrated was produced.
Front plate having a white decorative layer (frame shape) embedded with the transparent resin film of Example 1 (decorative layer, transparent resin film embedded with a step of the decorative layer, first transparent electrode pattern, insulating layer pattern) , A second transparent electrode pattern, a front plate on which a conductive element different from the first and second transparent electrode patterns is formed) on the photosensitive resin layer of the produced photosensitive transfer film, a temporary support ( After peeling at the interface with PET), it was transferred together with the thermoplastic resin layer and the intermediate layer (layer forming step).
Next, using a proximity type exposure machine (manufactured by Hitachi High-Tech Electronics Engineering Co., Ltd.) having an ultrahigh pressure mercury lamp, the entire surface was exposed from the thermoplastic resin layer side at i line and 40 mJ / cm ² . Next, triethanolamine developer (containing 30% triethanolamine, trade name: T-PD2 (manufactured by FUJIFILM Corporation) 10 times with pure water (1 part of T-PD2 and 9 parts of pure water). The mixture was diluted to 30) at 30 C for 60 seconds at a flat nozzle pressure of 0.04 MPa to remove the thermoplastic resin and the intermediate layer. Subsequently, air was blown onto the upper surface (photosensitive resin layer side) of the glass substrate to drain the liquid, and then pure water was sprayed for 10 seconds by a shower, washed, and air was blown to remove a liquid pool on the glass substrate. Reduced. Next, the substrate is heat-treated at 230 ° C. for 60 minutes (post-bake), the decorative layer, the transparent resin film in which the step of the decorative layer is embedded, the first transparent electrode pattern, the insulating layer pattern, the second A transparent electrode pattern, a conductive plate different from the first and second transparent electrode patterns, and a front plate on which a transparent protective layer-A was laminated were obtained, and the capacitive input device of Example 1 was obtained.

(Evaluation of air bubble entrapment in the vicinity of the white decorative layer (frame shape) after transfer of the transparent protective layer)
The front plate having the white decorative layer (frame shape) embedded with the transparent resin film of Example 1, the surface on which the decorative layer of the front plate is formed, and the surface opposite to the surface on which the decorative layer is formed Was observed with a microscope using reflected light and transmitted light, and the state of air bubble in the vicinity of the white decorative layer was evaluated according to the following criteria. B and above are practical levels.

<Evaluation criteria>
A: No entrapment of bubbles is observed in the vicinity of the white decorative layer (frame shape), which is very good.
B: Although several bubbles were found in the vicinity of the white decorative layer (frame shape), it was not recognized from the surface opposite to the surface on which the decorative layer was formed, which is good.
C: A considerable number of bubbles were found in the vicinity of the white decorative layer (frame shape), and bubbles were observed from the surface opposite to the surface on which the decorative layer was formed.
The evaluation results are shown in Table 1 below.

(Evaluation of disconnection of electrode pattern)
The presence or absence of disconnection of the electrode pattern was examined using the surface resistance value and evaluated according to the following criteria. B and above are practical levels.

<Evaluation criteria>
A: Less than 10 ² Ω / □ B: 10 ² Ω / □ or more and less than 10 ³ Ω / □ C: 10 ³ Ω / □ or more Evaluation results are shown in Table 1 below.

[Examples 2 to 12]
Coating liquid for transparent resin film of Example 1: Silicone resin KR-311 (Example 2), silicone resin KR-282 (Example 3), silicone resin instead of silicone resin KR-300 in the preparation of formulation C1 KR-300 and silicone resin KR-311 solid content mixture (Example 4), Silicone resin KR-300 and silicone resin KR-311 solid content mass ratio 3: 7 mixture (Example 5), Silicone resin KR-271 (Example 6), silicone resin KR-255 (Example 7), silicone resin KR-242A (Example 8), silicone resin KR-251 (Example 9), silicone resin KR-251 and X- 40-9246 A mixture with a solid content mass ratio of 9: 1 (Example 10) Acrylic-modified silicone resin KR-970 (Example 11), except that the polyester-modified silicone resin KR-5230 (Example 12) was used. ) That is, a transparent resin film coating solution containing the binder shown in Table 1 below: A transfer film for embedding steps of Examples 2 to 12 was prepared in the same manner as in Example 1 except that the formulations C2 to C12 were used. did.
In place of the step-embedding transfer film of Examples 2 to 12 that were used in place of the step-embedding transfer film used in Example 1, in the same manner as the embedding of the transparent resin film of Example 1, A transparent resin film is fitted into the frame of the white decorative layer, the decorative layer, the transparent resin film in which the step of the decorative layer is embedded, the first transparent electrode pattern, the insulating layer pattern, the second transparent electrode pattern, the first A front plate on which a conductive element different from the first and second transparent electrode patterns and the transparent protective layer-A were formed was produced, and the capacitive input devices of Examples 2 to 12 were obtained.
The results of evaluating the capacitive input devices of Examples 2 to 12 in the same manner as in Example 1 are shown in Table 1 below.

[Comparative Example 1]
In Example 1, the step of embedding the step-embedded transfer film, that is, in the same manner as in Example 1 except that the transparent resin is not present inside the frame of the white decorative layer, the white decorative layer, A front plate on which a transparent element pattern, an insulating layer pattern, a second transparent electrode pattern, a conductive element different from the first and second transparent electrode patterns and a transparent protective layer-A are formed is prepared. 1 capacitance type input device.
The results of evaluating the capacitive input device of Comparative Example 1 in the same manner as in Example 1 are shown in Table 1 below.

[Comparative Examples 2 and 3]
Example 1 Transparent resin film coating solution: In the preparation of formulation C1, instead of silicone resin KR-300, an acrylic resin, methyl methacrylate / 2-ethylhexyl acrylate / benzyl methacrylate / methacrylic acid copolymer (copolymerization composition) Ratio (molar ratio) = 55 / 11.7 / 4.5 / 28.8, weight average molecular weight = 100,000, Tg (glass transition temperature) ≈70 ° C.) (Comparative Example 2), or acrylic resin benzyl methacrylate / Methacrylic acid = 68/32 molar ratio random copolymer, weight average molecular weight 50,000) (Comparative Example 3), except that (Comparative Example 3) was used (solid content was the same), That is, the transparent resin film was embedded in the frame of the white decorative layer in the same manner as in Example 1 except that the binder shown in Table 1 below was used, and the steps of the decorative layer and the decorative layer were changed. An embedded transparent resin film, a first transparent electrode pattern, an insulating layer pattern, a second transparent electrode pattern, a conductive element different from the first and second transparent electrode patterns, and a transparent protective layer-A were formed. A front plate was produced and used as the capacitance type input devices of Comparative Examples 2 and 3, respectively.
The results of evaluating the capacitive input devices of Comparative Examples 2 and 3 in the same manner as in Example 1 are shown in Table 1 below.

[Examples 13 to 16]
In Example 4, instead of setting the film thickness of the transparent resin film to 35 μm, the thickness was set to 5 μm (Example 13), 10 μm (Example 14), 20 μm (Example 15), and 45 μm (Example 16), respectively. Except for the above, transfer films for embedding steps of Examples 13 to 16 were produced in the same manner as Example 4.
Instead of using the transfer film for embedding steps in Examples 13 to 16 instead of the transfer film for embedding steps used in Example 4, the same procedure as in the embedding of the transparent resin film in Example 4 was used except that each of the transfer films for embedding steps was used. A transparent resin film is fitted into the frame of the white decorative layer, the decorative layer, the transparent resin film in which the step of the decorative layer is embedded, the first transparent electrode pattern, the insulating layer pattern, the second transparent electrode pattern, the first A front plate on which a conductive element different from the first and second transparent electrode patterns and the transparent protective layer-A were formed was produced, and the capacitive input devices of Examples 13 to 16 were obtained.
The results of evaluating the capacitive input devices of Examples 13 to 16 in the same manner as in Example 1 are shown in Table 2 below.

[Examples 17 and 18]
In Example 4, the size of the transparent resin film was made equal to the inner diameter (L in FIGS. 1 and 14 to 16) of the frame of the white decorative layer in the capacitive input device of Example 4. Instead, the transparent resins of Examples 17 and 18 were the same as Example 4 except that each side was 5 mm (Example 17) or 10 mm (Example 18) larger than the inner diameter of the frame of the white decorative layer. A transfer film for embedding steps of Examples 17 and 18 having a film was prepared.
Using the transfer film for embedding steps of Examples 17 and 18, the transparent resin film of Examples 17 and 18 was inserted into the frame of the white decorative layer (partly across the frame of the white decorative layer), A decorative element, a transparent resin film in which a step of the decorative layer is embedded, a first transparent electrode pattern, an insulating layer pattern, a second transparent electrode pattern, and a conductive element different from the first and second transparent electrode patterns Then, a front plate on which the transparent protective layer-A was formed was produced, and the capacitive input devices of Examples 17 and 18 were obtained.
The capacitance type input devices of Examples 17 and 18 were evaluated in the same manner as in Example 1, and the results are shown in Table 2 below.
However, when the edge part of a decoration layer has a taper shape, let the part which becomes equal to the maximum height of a decoration layer be a reference | standard which measures the internal diameter of a frame shape (L shown in FIG. 15). The white decorative layer produced by die-cutting from the transfer film used in common in Examples 1 to 18 had a tapered end.

[Examples 19 and 20]
Instead of fitting a transparent resin film into the frame of the white decorative layer using a transfer film, a transparent resin film was prepared by application using a liquid resist.
As the transparent resist for preparing the transparent resin film of Example 19, the coating liquid for transparent resin film of Example 2 was used. A transparent resist for forming a transparent resin film of Example 19 on a glass substrate coater (manufactured by F.S. Japan, trade name: MH-1600) having a slit-like nozzle on the glass substrate. Was applied. Subsequently, after part of the solvent was dried by VCD (vacuum dryer, manufactured by Tokyo Ohka Kogyo Co., Ltd.) for 30 seconds to eliminate the fluidity of the coating layer, the periphery of the substrate was measured by EBR (edge bead remover). The unnecessary coating solution was removed and prebaked at 120 ° C. for 3 minutes to obtain a transparent resin film of Example 19 having a thickness of 5.0 μm on the tempered glass (liquid resist method).
In Example 19 above, the application of the coating solution for preparing the transparent resin film was repeated 7 times, and seven layers having a film thickness of 5.0 μm were formed on the glass substrate, and the film thickness of 35.0 μm in Example 20 was formed. A transparent resin film was obtained.
The capacitance type input devices of Examples 19 and 20 were evaluated in the same manner as in Example 1, and the results are shown in Table 2 below.

From Table 1 and Table 2, the transparency of the transferred transparent resin film after post-baking can be increased by fitting the transparent resin film of the present invention inside the frame of the white decorative layer. It has been found that the problem of air bubbles being taken in after the transparent protective layer is transferred thereon can be suppressed. Furthermore, it has been found that the problem of disconnection when the electrode pattern is formed can also be suppressed.

DESCRIPTION OF SYMBOLS 1 Front plate 2 Decoration layer 3 1st transparent electrode pattern 3a Pad part 3b Connection part 4 Second transparent electrode pattern 5 Insulating layer 6 Conductive element 7, 7 'Transparent protective layer 8 Opening part 9 Transparent resin of this invention Film (for step filling)
L Inner diameter of decorative layer (one side)
11 Tempered glass C First direction D Second direction 21 Temporary support 22 Thermoplastic resin layer 23 Intermediate layer 24 Decorating layer 25 Cover film (protective film)
31 Non-image part 32 Image part 33 Blade 40 Transfer material 41 Inside the frame 42 Outside the frame 43 Wiring extraction part 44 Decoration layer (area not removed)
45 Area from which the decoration layer has been removed

Claims

A transparent resin film containing at least a silicone resin as a binder resin and having a thickness of 5 μm or more,
The transparent resin film has a transparent front plate, a decorative layer disposed on a part of one surface of the front plate, and an electrode pattern disposed on one surface side of the front plate. A transparent resin film used for filling a step between the front plate and the decorative layer of a capacitive input device.
2. The transparent resin film according to claim 1, wherein the silicone resin is a straight silicone resin.
3. The transparent resin film according to claim 2, wherein the straight silicone resin is a straight silicone resin containing at least a siloxane structure represented by the following general formula (1) in the molecule.

In the general formula (1), R 1 is independently a hydrogen atom, a halogen atom, a linear, branched or cyclic alkoxy group having 1 to 20 carbon atoms, a linear or branched structure having 1 to 20 carbon atoms. Or a cyclic alkyl group, a linear, branched or cyclic substituted alkyl group having 1 to 20 carbon atoms, a linear, branched or cyclic alkenyl group having 2 to 20 carbon atoms, and an aryl having 6 to 20 carbon atoms Represents a group or an aralkyl group having 7 to 20 carbon atoms.
4. The transparent resin film according to claim 2, wherein the weight average molecular weight of the straight silicone resin is 1,000 to 1,000,000.
The transparent resin film according to any one of claims 1 to 4, wherein the transparent resin film has a thickness of 10 袖 m or more.
The transparent resin film according to any one of claims 1 to 5, wherein the transparent resin film is produced using a transparent resist solution.
A temporary support;
A transfer film comprising the transparent resin film according to any one of claims 1 to 6.
The transfer film according to claim 7, further comprising a thermoplastic resin layer between the temporary support and the transparent resin film.
A transparent front plate,
A decorative layer disposed on a part of one surface of the front plate;
An electrode pattern disposed on one surface side of the front plate,
A conductive film laminate in which a step between the front plate and the decorative layer is filled with the transparent resin film according to any one of claims 1 to 6.
A transparent front plate,
A decorative layer disposed on a part of one surface of the front plate;
An electrode pattern disposed on one surface side of the front plate,
A conductive film laminate in which a step between the front plate and the decorative layer is filled with the transparent resin film of the transfer film according to claim 7 or 8.
The conductive film laminate according to claim 9 or 10, wherein the decorative layer has a thickness of 5 µm or more.
12. The conductive film laminate according to claim 9, wherein the thickness of the transparent resin film is 0.3 to 1.3 times the thickness of the decorative layer.
The conductive film laminate according to any one of Claims 9 to 12, further comprising a transparent protective layer on the transparent resin film, the decorative layer, and the electrode pattern.
The conductive film laminate according to any one of claims 9 to 13, wherein the transparent resin film is heated to 180 to 300 ° C in an environment of 0.08 to 1.2 atm.
The conductive film laminate according to any one of claims 9 to 14, wherein the electrode pattern includes the following (3) to (5).
(3) A plurality of first transparent electrode patterns formed by extending a plurality of pad portions in a first direction via connection portions (4) electrically insulated from the first transparent electrode pattern, A plurality of second electrode patterns comprising a plurality of pad portions formed extending in a direction intersecting the first direction (5) electrically connecting the first transparent electrode pattern and the second electrode pattern Insulating layer
And (6) a conductive element that is electrically connected to at least one of the first transparent electrode pattern and the second electrode pattern and is different from the first transparent electrode pattern and the second electrode pattern. The conductive film laminate according to claim 15, comprising:
The conductive film laminate according to claim 15 or 16, wherein the (4) second electrode pattern is a transparent electrode pattern.
The conductive film laminate according to any one of claims 9 to 17, wherein an end portion of the decorative layer has a tapered shape.
A capacitance-type input device comprising the conductive film laminate according to any one of claims 9 to 18.
An image display device comprising the capacitive input device according to claim 19 as a constituent element.